Call for Papers

ADMETAPlus 2019
Advanced Metallization Conference 2019: 29th Asian Session
October 9 - 11, 2019
The University of Tokyo, Sanjo Conference Hall (Hongo Campus), Tokyo
Sponsorship by ADMETA Committee
Co-sponsorship by the Japan Society of Applied Physics
The ADMETAPlus is heading for its 29th historical meeting and has a long record of important
contributions to practical progress for advanced MPU and various memory devices. In recent years, theimportance of interconnect technology for realizing low resistance, large integration, rich functionality,
low cost, and high reliability has increased in various device application fields beyond silicon electronics.
This conference will focus on interconnects technology and science related to materials, processes, device
design, assembly, equipment, cost performance, and characterization. We will host comprehensive
discussions on a wide range of topics, establish basics to applications, with researchers and engineersfrom industry, government, and academia. We are looking forward to new developments in interconnect
technology fields and contributing to the growth of semiconductor industry in the Asian area.
ADMETAPlus 2019 General Chair, Shinji Yokogawa (The University of Electro-Communications)＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊★Conference Topics of Interest
Integration: Interconnection Structure and Performance, Parasitic Capacitance, Reliability Technology, Testing andAnalysis
Reliability Science and Failure Analysis: EM, SIV, TDDB, Defect Detection and Analysis, Failure Mechanism andModeling
Metallization: PVD, CVD, ALD, Plating, Barrier Metal, New Material, Alloy, Supercritical Fluid, Reflow
Low-k Dielectric: CVD, ALD, SOD, Film Properties, New Materials, Dielectric Structures (Air Gap), Metrology, etc.
CMP: Planarization Technology, Slurry, Pad, Dress, End Point Detection, Cleaning, Anti-corrosive Technology, etc.
Contact: Silicide, Interface, Solid Phase Reaction, Shallow Junction, Crystal Properties, Electron Properties, CarrierTransport, etc.
MEMS/RF: Interconnection Structure and Materials, Packaging, Fabrication Process Technology, Device Design, etc.
Emerging Technology: Active Wiring, Power Electronics, Silicon Photonics, Flexible Electronics, Energy Harvesting,etc.
Backend Device Technology: Tech. for Embedding Devices (MRAM, PCRAM, ReRAM, DRAM etc.), Materials andProcessing of Magnetics, Phase-Change and Resistive-Change Devices, Electrode, Metallization, etc.
Nano Carbon: Graphene, CNT, Deposition, Integration, Electrical Characteristics, Reliability, Evaluation, Analysis, etc.
3D and Packaging: TSV, TMV, Stacking Method (CoW, WoW), Thinning, Planarization, Bonding, Bump, Stress andThermal Analysis, Sealing, Cooling, Reliability.

*************************************************★ To Apply:
Prepare an abstract per the directions below and submit it to the ADMETAPlus 2019 Secretariat;
A4 format, up to 2 pages, figures and tables are recommended but not required,Oral [15 min. talk & 5 min. QA] or Poster [90 min.],
Abstracts are due June 28, 2019.
QRcordtoURL

http://www.admeta.org/

Prospective authors must submit a PDF file up to 2 pages with necessary figures and tables. Send the PDF file of themanuscript, the subject of your paper (please choose from the Conference Topics of Interest), and desired presentationstyle (Oral or Poster) to the secretariat office via e-mail. On the abstract, please indicate the author to whom
correspondence should be addressed, and include mailing and e-mail addresses. A template of abstract can be
downloaded from the ADMETAPlus 2019 website. Notification of acceptance will be made to the authors by August 23,
2019. Upon notification, authors will be requested to confirm their participation in the conference．
The accepted abstracts will be included in the conference proceedings (paper and/or CD-ROM), which the participants
will receive on site at the registration desk of ADMETAPlus 2019. Pre-registered participants will also be able todownload the accepted abstracts from the ADMETAPlus 2019 webpage after Oct. 2, 2019.
[ Continued on the following page ]★ Special Issue of JJAPAuthors with papers presented at ADMETAPlus 2019 are encouraged to submit their original manuscripts to a Special
Issue of the Japanese Journal of Applied Physics (JJAP) dedicated to the ADMETAPlus 2019. The deadline for submitting
the Special Issue is scheduled around November 2019. The manuscript will be reviewed based on the JJAP standard foran original paper. JJAP Special Issues are accepting regular papers (RP), brief notes (BN), and reviews (RV), and will be
published in July, 2020.

★ Reminder
As the papers of the Special Issue will be the original papers, please be careful not to post the same contents toany other journals.

*************************************************
Conference Information: Oct.10-11, 2019 (in English)★ Preliminary list of Planary Speakers include:1) Atsuyoshi Koike (Western Digital Japan)
2) Ruth Brain (Intel)★ Preliminary list of Invited Speakers include:
1) Thin films and Dielectrics
Koichi Motoyama (IBM Research)
2) CMP
Haedo Jeong (Pusan National University)
3) Advanced Integration and Process Griselda Bonilla (IBM Research)4) Emerging Technologies
Kaidong Xu (Leuven Instruments)★ Organized Sessions1) Emerging Technologies (STT-MRAM, ReRAM)
2) Advanced Metallization
3) Advanced Integration and Process★ General Sessions
1) Thin films and Dielectrics
2) CMP and Cleaning
3) Next Generation Interconnect (Carbon, Optical Interconnects etc.)
4) 3D Device, TSV and Packaging*************************************************
Tutorial Information: Oct.9, 2019 (in Japanese)★ Preliminary list of Tutorial Lecturers include:
1) Metallization
Koichi Motoyama (IBM Research)
2) 3D Flash Memory
Masayoshi Tagami (Toshiba Memory)3) ALD
Fumiaki Hayase (Tokyo Electron Technology Solutions)4) Semiconductor Market Trend
Hiroshi Kuwatsuka (Deloitte Tohmatsu Financial Advisory)5) Interconnect Conference Trend Kazuyoshi Ueno (Shibaura Institute of Technology)6) Lithography
Satoshi Tanaka (Toshiba Memory）
7) CMP
Kazumi Sugai (Fujimi Incorporated)
8) 3D CMOS image sensor
Hayato Iwamoto (Sony Semiconductor Solutions)*Full list of the invited speakers and tutorial lecturers will be announced later.
**Official language of the Tutorial Lecturers is Japanese.

*************************************************★ Contact: ADMETAPlus 2019 Secretariat
QRcordtoURL#502 Omiyadaini Bldg., 4-1-7 Hongo, Bunkyo-ku, Tokyo 113-0033, Japan.
TEL: +81-3-6801-5685, FAX: +81-3-6801-5686
E-mail: jimukyoku@admeta.org*************************************************[事務局からのお知らせ] ADMETAPlus2019 は最先端の配線技術全般を扱う会議で 29 回目を迎えることになりました。昨年は本会議が北京で開催されましたが、今年は東京での開催になります。投稿に関しては、今回から 1 ページでの Abstract 投稿も可能となりました。また、最先端技術に関http://www.admeta.org/ する日本語による Tutorial も毎年大変好評となっております。皆様のご投稿およびご参加を心からお待ちしております。