TSL2591
Datasheet - Apr. 2013 - ams163.5

General Description

The TSL2591 is a very-high sensitivity light-to-digital converter
that transforms light intensity into a digital signal output
capable of direct I 2C interface. The device combines one
broadband photodiode (visible plus infrared) and one
infrared-responding photodiode on a single CMOS integrated
circuit. Two integrating ADCs convert the photodiode currents
into a digital output that represents the irradiance measured oneach channel. This digital output can be input to a
microprocessor where illuminance (ambient light level) in lux isderived using an empirical formula to approximate the human
eye response. The TSL2591 supports a traditional level styleinterrupt that remains asserted until the firmware clears it.

Figure TSL2591 – 1:
Key Benefits and Features

Benefits

FeaturesApproximates Human Eye Response

Dual Diode

Flexible Operation

Programmable Analog Gain and Integration Time

Suited for Operation Behind Dark Glass

600M:1 Dynamic Range

Low Operating Overhead
Low Power 3.0 μA Sleep StateI2C Fast Mode Compatible Interface

Datasheet - Apr. 2013 - ams163.5• Two Internal Interrupt Sources• Programmable Upper and Lower Thresholds• One Interrupt Includes Programmable Persistence Filter
User Selectable Sleep Mode
• Data Rates up to 400 kbit/s• Input Voltage Levels Compatible with 3.0V Bus

TSL2591 – 1

Figure TSL2591 – 2:
Block Diagram

Detailed Description

The TSL2591 contains two integrating analog-to-digitalconverters (ADC) that integrate currents from two photodiodes.
Integration of both channels occurs simultaneously. Uponcompletion of the conversion cycle, the conversion result istransferred to the Channel 0 and Channel 1 data registers,
respectively. The transfers are double-buffered to ensure thatthe integrity of the data is maintained. After the transfer, thedevice automatically begins the next integration cycle.
Communication with the device is accomplished through astandard, two-wire I 2C serial bus. Consequently, the TSL2591
can be easily connected to a microcontroller or embedded
controller. No external circuitry is required for signal
conditioning. Because the output of the device is digital, theoutput is effectively immune to noise when compared to ananalog signal.
The TSL2591 also supports an interrupt feature that simplifies
and improves system efficiency by eliminating the need to polla sensor for a light intensity value. The primary purpose of theinterrupt function is to detect a meaningful change in lightintensity. The concept of a meaningful change can be definedby the user both in terms of light intensity and time, or
persistence, of that change in intensity. The device has theability to define two sets of thresholds, both above and below
the current light level. An interrupt is generated when the valueof a conversion exceeds either of these limits. One set ofthresholds can be configured to trigger an interrupt only when
the ambient light exceeds them for a configurable amount oftime (persistence) while the other set can be configured totrigger an immediate interrupt.

TSL2591 – 2

Datasheet - Apr. 2013 - ams163.5

The TSL2591 pin assignments are described below.

Pin Assignment

Figure TSL2591 – 3:
Pin Diagram
Package FN Dual Flat No-Lead (TopView): Package drawing is not to scale.

SCL

1

6

SDA

INT

2

5

VDD

GND 3

4

NC

Figure TSL2591 – 4:
Pin Description

Pin Number

Pin Name

1SCL

I2C serial clock input terminal

2

INT

Interrupt — open drain output (active low).

3

GND

Power supply ground. All voltages are referenced to GND.

4NC

No connect — do not connect.

5

VDD

Supply voltage

6

SDA

I2C serial data I/O terminal

Datasheet - Apr. 2013 - ams163.5

Description

TSL2591 – 3

Ordering Information
Figure TSL2591 – 5:
Ordering Information

Ordering Code

Address

Interface

Delivery form

TSL25911FN

0x29

I2C Vbus = VDD Interface

ODFN-6

TSL25913FN*

0x29

I2C Vbus = 1.8V

ODFN-6*Contact factory for availability.
Notes:
1. All products are RoHS compliant and ams green.
2. Buy our products or get free samples online at www.ams.com/ICdirect
3. Technical Support is available at www.ams.com/Technical-Support
4. For further information and requests, email us at sales@ams.com
5. (or) find your local distributor at www.ams.com/distributor
6. Please contact ams for alternate address device availability.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. These arestress ratings only. Functional operation of the device at theseor any other conditions beyond those indicated under“Operating Conditions” is not implied. Exposure to absolute
maximum rating conditions for extended periods may affectdevice reliability.

Figure TSL2591 – 6:
Absolute Maximum Ratings

Parameter

Min

Supply voltage, VDD

Max

Units

Comments

3.8

V

All voltages are with respect to GND

Input terminal voltage

-0.5

3.8

V

Output terminal voltage

-0.5

3.8

V

Output terminal current

-1

20

mA

Storage temperature range, Tstg

-40

85

ºC

2000

V

ESD tolerance, human body model

TSL2591 – 4

Datasheet - Apr. 2013 - ams163.5

All limits are guaranteed. The parameters with min and max
values are guaranteed with production tests or SQC (Statistical
Quality Control) methods.

Electrical Characteristics

Figure TSL2591 – 7:
Recommended Operating Conditions

SymbolParameter

Min

Typ

Max

Units

3

3.6

V

70

ºC

VDD

Supply voltage

2.7

TA

Operating free-air temperature-30

Figure TSL2591 – 8:
Operating Characteristics, VDD=3V, TA =25ºC (unless otherwise noted)

SymbolParameter

Conditions

Min

Typ

Max

Units

275
2.3

325
4

μA

0
0

0.4
0.6

V

5

μA

IDD

Supply Current

ActiveSleep state - no I 2C activity

VOL

INT, SDA output low
voltage

3mA sink current
6mA sink current

ILEAK

Leakage current, SDA,
SCL, INT pins

-5

VIH

SCL, SDA input highvoltage

0.7 VDD

VIL

SCL, SDA input low
voltage

Datasheet - Apr. 2013 - ams163.5

V
0.3 VDDV

TSL2591 – 5

Figure TSL2591 – 9:
ALS Characteristics, VDD=3V, TA=25ºC, AGAIN = Max, AEN=1, (unless otherwise noted) (Notes 1, 2, 3),

Parameter

Conditions

Dark ADC countvalue

Ee = 0,ATIME=000b (100ms)

ADC integration
time step size

ATIME = 000b (100ms)

Channel

Min

CH0
CH1

0
0

Max

Units

25
25

counts

108

ms

1

6

steps

95

ADC number ofintegration steps(Note 4)

Typ101

ADC counts per
step

ATIME = 000b (100ms)

0

37888

counts

ADC count value

ATIME = 101b (600ms)

0

65535

countsWhite light (Note 2)
Ee = 4.98 μW/cm2
ATIME = 000b (100 ms)

CH0
CH1

25500

30000
4996

34500

CH0
CH1

25500

30000
19522

34500

White light (Note 2)

0.116

0.166

0.216

λp = 850 nm (Note 3)

0.456

0.652

0.848

counts

ADC count value
λp = 850 nm (Note 3)
Ee = 5.62 μW/cm2,
ATIME = 000b (100 ms)
ADC count value
ratio: CH1/CH0

White light (Note 2)
ATIME = 000b (100 ms)

CH0
CH1

6024
1003

λp = 850 nm (Note 3)
ATIME = 000b (100 ms)

CH0
CH1

5338
3474

Noise
(Note 4)White light (Note 2)
Ee = 4.98 μW/cm2
ATIME = 000b (100 ms)

CH01

Gain scaling,
relative to 1× gain
setting

AGAIN = Low
AGAIN = MedAGAIN = HighAGAIN = Max

Re
Irradianceresponsivity

countscounts/(μW/cm2)

2

1 standard
deviation

1
25
428
9876

×

Notes:
1. Optical measurements are made using small-angle incident radiation from light-emitting diode optical sources. Visible whiteLEDs and infrared 850 nm LEDs are used for final product testing for compatibility with high-volume production
2. The white LED irradiance is supplied by a white light-emitting diode with a nominal color temperature of 4000 K.
3. The 850 nm irradiance is supplied by a GaAs light-emitting diode with the following typical characteristics: peak wavelength
λ p = 850 nm and spectral halfwidth Δλ½ = 42 nm.
4. Parameter ensured by design and is not 100% tested.

TSL2591 – 6

Datasheet - Apr. 2013 - ams163.5

The timing characteristics of TSL2591 are given below.

Timing Characteristics

Figure TSL2591 – 10:
AC Electrical Characteristics, VDD = 3 V, TA = 25ºC (unless otherwise noted)

Parameter†

Description

Min

Typ

Max

Units

f(SCL)

Clock frequency (I2C only)

0

400

kHz

t(BUF)Bus free time between start and stop
condition

1.3

μst(HDSTA)

Hold time after (repeated) start
condition. After this period, the firstclock is generated.

0.6

μs

t(SUSTA)

Repeated start condition setup time

0.6

μs

t(SUSTO)

Stop condition setup time

0.6

μs

t(HDDAT)

Data hold time0μst(SUDAT)

Data setup time

100

ns

t(LOW)SCL clock low period

1.3

μs

t(HIGH)SCL clock high period

0.6

μs

tF

Clock/data fall time

300

ns

tR

Clock/data rise time

300

ns

Ci

Input pin capacitance10

pF† Specified by design and characterization; not production tested.

Timing Diagrams
Figure TSL2591 – 11:
Parameter Measurement Information

Datasheet - Apr. 2013 - ams163.5

TSL2591 – 7

Typical Operating Characteristics
Figure TSL2591 – 12:Spectral Responsivity
Spectral Responsivity: Two channel
response allows for tunable illuminance(lux) calculation regardless oftransmissivity of glass.

1
0.9

Normalized Responsivity

0.8

CH0

0.7
0.6
0.5
0.4
CH1

0.3
0.2
0.1
0
300

400

500

600

700

800

900 1000 1100

λ - Wavelength - nm

Figure TSL2591 – 13:
White Normalized Responsivity vs. Angular Displacement
White LED Angular Response: Nearcosine angular response for broadband
white light sources.

100%
Response - Normalized to 0º

90%

CH0

80%
70%
60%
50%
40%
30%
20%

CH1

10%
0%
-90 -75 -60 -45 -30 -15 0 15 30 45 60 75 90
Incedent Angle - º

TSL2591 – 8

Datasheet - Apr. 2013 - ams163.5

IDD vs. VDD vs. Temp: Effect of supply
voltage and temperature on active
current.

IDD - Active Current Normalized @ 3V, 25ºC

Figure TSL2591 – 14:
Normalized IDD vs. VDD and Temperature

1.2
1.15

75°C

1.1
50°C
25°C

1.05

5°C

1
0.95
0.9
2.7

2.8

2.9

3

3.1

3.2

3.3

3.4

3.5

3.6

60

70

VDD - Source Voltage - V

Figure TSL2591 – 15:
Response to White LED vs. Temperature
White LED Response v Temp: Effect oftemperature on the device response fora broadband white light source.

Response - Normalized to 25ºC

110%

105%
Ch 0
100%
Ch 1
95%

90%
0

10

20

30

40

50

Temperature - ºC

Datasheet - Apr. 2013 - ams163.5

TSL2591 – 9

The device is controlled and monitored by registers accessed

Register Description

through the I 2C serial interface. These registers provide for avariety of control functions and can be read to determine resultsof the ADC conversions. The register set is summarized in Figure
TSL2591 - 16.
Figure TSL2591 – 16:Register Description

Register Function

Reset
Value

Address

Register Name

R/W

--

COMMAND

W

Specifies Register Address

0x00

0x00

ENABLE

R/W

Enables states and interrupts

0x00

0x01

CONFIGR/W

ALS gain and integration time configuration

0x00

0x04

AILTL

R/W

ALS interrupt low threshold low byte

0x00

0x05

AILTH

R/W

ALS interrupt low threshold high byte

0x00

0x06

AIHTL

R/W

ALS interrupt high threshold low byte

0x00

0x07

AIHTH

R/W

ALS interrupt high threshold high byte

0x00

0x08

NPAILTL

R/W

No Persist ALS interrupt low threshold low byte

0x00

0x09

NPAILTHR/W

No Persist ALS interrupt low threshold high byte

0x00

0x0A

NPAIHTL

R/W

No Persist ALS interrupt high threshold low byte

0x00

0x0B

NPAIHTHR/W

No Persist ALS interrupt high threshold high
byte

0x00

0x0C

PERSIST

R/W

Interrupt persistence filter

0x00

0x11

PID

R

Package ID

--

0x12

ID

R

Device ID

ID

0x13

STATUSR

Device status

0x00

0x14

C0DATALR

CH0 ADC low data byte

0x00

0x15

C0DATAHR

CH0 ADC high data byte

0x00

0x16

C1DATALR

CH1 ADC low data byte

0x00

0x17

C1DATAHR

CH1 ADC high data byte

0x00

Note: JGS-Stopped here.

TSL2591 – 10

Datasheet - Apr. 2013 - ams163.5

The COMMAND register specifies the address of the target
register for future read and write operations, as well as issues
special function commands.

Command Register

7
CMD

6

5

4

3

TRANSACTION

Fields

Bits

CMD

7

2

1

0

ADDR/SF

Description
Select Command Register. Must write as 1 when addressing
COMMAND register.
Select type of transaction to follow in subsequent data transfers
FIELD VALUE

TRANSACTIONDESCRIPTION

00

Reserved - Do not use

01

Normal Operation

10

Reserved – Do not use

11

Special Function – See description below

6:5

Address field/special function field. Depending on the transaction
type, see above, this field either specifies a special functioncommand or selects the specific control-status-data register for
subsequent read and write transactions. The field values listed
below apply only to special function commands.
FIELD VALUE

ADDR/SF

4:0

DESCRIPTION

00100

Interrupt set – forces an interrupt

00110

Clears ALS interrupt

00111

Clears ALS and no persist ALS interrupt

01010

Clears no persist ALS interrupt

otherReserved – Do not write

The interrupt set special function command sets the interrupt bitsin the status register (0x13). For the interrupt to be visible on the
INT pin, one of the interrupt enable bits in the enable register(0x00) must be asserted.
The interrupt set special function must be cleared with an interrupt
clear special function. The ALS interrupt clear special functions
clear any pending interrupt(s) and are self-clearing.

Datasheet - Apr. 2013 - ams163.5

TSL2591 – 11

The ENABLE register is used to power the device on/off, enable
functions and interrupts.

Enable Register (0x00)

7

6

5

4

NPIEN

SAI

Reserved

AIEN

3

2
Reserved

1

0

AEN

PON

Fields

Bits

Description

NPIEN

7

No Persist Interrupt Enable. When asserted NP Thresholdconditions will generate an interrupt, bypassing the persist filter.

SAI

6

Sleep after interrupt. When asserted, the device will power down at
the end of an ALS cycle if an interrupt has been generated.

Reserved

5

Reserved. Write as 0.

AIEN

4

ALS Interrupt Enable. When asserted permits ALS interrupts to begenerated, subject to the persist filter.

Reserved

3:2

Reserved. Write as 0.

AEN

1

ALS Enable. This field activates ALS function. Writing a one
activates the ALS. Writing a zero disables the ALS.

PON

0Power ON. This field activates the internal oscillator to permit the
timers and ADC channels to operate. Writing a one activates theoscillator. Writing a zero disables the oscillator.

TSL2591 – 12

Datasheet - Apr. 2013 - ams163.5

The CONTROL register is used to configure the ALS gain andintegration time. In addition, a system reset is provided. Upon
power up, the CONTROL register resets to 0x00.

Control Register (0x01)

76

SRESET

Reserved

5

4

3

AGAIN

2

1

Reserved

0

ATIME

Fields

Bits

Description

SRESET

7

System reset. When asserted, the device will reset equivalent to a
power-on reset. SRESET is self-clearing.

Reserved

6

Reserved. Write as 0.
ALS gain sets the gain of the internal integration amplifiers for bothphotodiode channels.
FIELD VALUE

AGAINReserved

5:4

3

DESCRIPTION

00

Low gain mode01

Medium gain mode

10

High gain mode

11

Maximum gain mode

Reserved. Write as 0.
ALS time sets the internal ADC integration time for bothphotodiode channels.

ATIME

2:0

Datasheet - Apr. 2013 - ams163.5

FIELD VALUEINTEGRATION TIME

MAX COUNT000

100 ms37888

001

200 ms

65535

010

300 ms65535

011

400 ms65535

100

500 ms65535

101

600 ms65535

TSL2591 – 13

ALS Interrupt Threshold Register(0x04 − 0x0B)

The ALS interrupt threshold registers provide the values to be
used as the high and low trigger points for the comparison
function for interrupt generation. If C0DATA crosses below the
low threshold specified, or above the higher threshold, aninterrupt is asserted on the interrupt pin.
If the C0DATA exceeds the persist thresholds (registers: 0x04 –0x07) for the number of persist cycles configured in the PERSIST
register an interrupt will be triggered. If the C0DATA exceeds
the no-persist thresholds (registers: 0x08 – 0x0B) an interrupt
will be triggered immediately following the end of the current
integration.
Note that while the interrupt is observable in the STATUS
register (0x13), it is visible only on the INT pin when AIEN or
NPIEN are enabled in the ENABLE register (0x00).
Upon power up, the interrupt threshold registers default to
0x00.

Register

Address

Bits

Description

AILTL

0x04

7:0

ALS low threshold lower byte

AILTH

0x05

7:0

ALS low threshold upper byte

AIHTL

0x06

7:0

ALS high threshold lower byte

AIHTH

0x07

7:0

ALS high threshold upper byte

NPAILTL

0x08

7:0

No Persist ALS low threshold lower byte

NPAILTH0x09

7:0

No Persist ALS low threshold upper byte

NPAIHTL

0x0A

7:0

No Persist ALS high threshold lower byte

NPAIHTH

0x0B

7:0

No Persist ALS high threshold upper byte

TSL2591 – 14

Datasheet - Apr. 2013 - ams163.5

The Interrupt persistence filter sets the number of consecutive
out-of-range ALS cycles necessary to generate an interrupt.
Out-of-range is determined by comparing C0DATA (0x14 and0x15) to the interrupt threshold registers (0x04 - 0x07). Notethat the no-persist ALS interrupt is not affected by the interrupt
persistence filter. Upon power up, the interrupt persistence
filter register resets to 0x00.

PERSIST Register (0x0C)

7

6

5

4

3

2

Reserved

Field

Bits

Reserved

7:4

1

0

APERS

Description
Reserved. Write as 0.
ALS interrupt persistence filter
FIELD VALUEAPERSPERSISTENCE

0000

Every ALS cycle generates an interrupt

0001

Any value outside of threshold range0010

2 consecutive values out of range0011

3 consecutive values out of range

0100

5 consecutive values out of range

0101

10 consecutive values out of range

0110

15 consecutive values out of range

0111

20 consecutive values out of range

1000

25 consecutive values out of range

1001

30 consecutive values out of range

1010

35 consecutive values out of range

1011

40 consecutive values out of range

1100

45 consecutive values out of range

1101

50 consecutive values out of range

1110

55 consecutive values out of range

1111

60 consecutive values out of range

3:0

Datasheet - Apr. 2013 - ams163.5

TSL2591 – 15

The PID register provides an identification of the devices
package. This register is a read-only register whose value neverchanges.

PID Register (0x11)

7

6

5

Reserved

4

3

2

PACKAGEID

0

Reserved

Field

Bits

Reserved

7:6

Reserved.

PID

5:4

Package Identification = 00

Reserved

3:0

Reserved.

Description

The ID register provides the device identification. This register
is a read-only register whose value never changes.

ID Register (I0x12)

7

1

6

5

4

3

2

1

0

ID

Field

Bits

ID

7:0

Device Identification = 0x50

The Status Register provides the internal status of the device.
This register is read only.

Status Register (0x13)

7

6
Reserved

Description

5

4

NPINTR

AINT

3

2

1

Reserved

0
AVALID

Field

Bits

Reserved

7:6

Reserved. Write at zero.

NPINTR

5

No-persist Interrupt. Indicates that the device has encountered ano-persist interrupt condition.

AINT

4

ALS Interrupt. Indicates that the device is asserting an ALS
interrupt.

Reserved

3:1

Reserved.

AVALID0

ALS Valid. Indicates that the ADC channels have completed an
integration cycle since the AEN bit was asserted.

TSL2591 – 16

Description

Datasheet - Apr. 2013 - ams163.5

ALS Data Register (0x14 - 0x17)

ALS data is stored as two 16-bit values; one for each channel.
When the lower byte of either channel is read, the upper byteof the same channel is latched into a shadow register. The
shadow register ensures that both bytes are the result of thesame ALS integration cycle, even if additional integration cycles
occur between the lower byte and upper byte register readings.
Each channel independently operates the upper byte shadow
register. So to minimize the potential for skew between CH0
and CH1 data, it is recommended to read all four ADC bytes insequence. The simplest way to accomplish this is to perform afour-byte I2C read operation using the auto-increment
protocol, which is set in the Command register TRANSACTION
field.

Register

Address

Bits

C0DATAL

0x14

7:0

ALS CH0 data low byte

C0DATAH

0x15

7:0

ALS CH0 data high byte

C1DATAL

0x16

7:0

ALS CH1 data low byte

C1DATAH

0x17

7:0

ALS CH1 data high byte

Datasheet - Apr. 2013 - ams163.5

Description

TSL2591 – 17

Application Information

Figure TSL2591 - 17 shows a typical hardware application
circuit. A 1-μF low-ESR decoupling capacitor should be placed
as close as possible to the VDD pin. V BUS in this figure refers to
the I2C bus voltage, which is equal to V DD.

Figure TSL2591 – 17:
Typical Application Hardware Circuit

TSL2591

The I 2C signals and the Interrupt are open-drain outputs andrequire pull-up resistors. The pull-up resistor (RP) value is afunction of the I2 C bus speed, the I 2C bus voltage, and thecapacitive load. The ams EVM running at 400 kbps, uses 1.5-kΩ
resistors. A 10-kΩ pull-up resistor (RPI) can be used for theinterrupt line.

TSL2591 – 18

Datasheet - Apr. 2013 - ams163.5

PCB Pad Layout

Suggested land pattern based on the IPC−7351B GenericRequirements for Surface Mount Design and Land PatternStandard (2010) for the small outline no-lead (SON) package isshown in Figure TSL2591 - 18.

Figure TSL2591 – 18:
Suggested FN Package PCB Layout (Top View)

Notes:
1. All linear dimensions are in millimeters.
2. This drawing is subject to change without notice.

Datasheet - Apr. 2013 - ams163.5

TSL2591 – 19

Package Drawings and Markings
Figure TSL2591 – 19:
FN Package – Dual Flat No-Lead Packaging Configuration

Notes:
1. All linear dimensions are in micrometers.
2. The die is centered within the package within a tolerence of ±75 μm.
3. Package top surface is molded with an electrically non-conductive clear plastic compound having an index of refraction of 1.55.
4. Contact finish is copper alloy A194 with pre-plated NIPdAu lead finish.
5. This package contains no lead (Pb).
6. This drawing is subject to change without notice.

TSL2591 – 20

Datasheet - Apr. 2013 - ams163.5

Mechanical Data
Figure TSL2591 – 20:
FN Package Carrier Tape and Reel Information

Notes:
1. All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted.
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing AO , B O and K O are defined in ANSI EIA Standard 481-B 2001.
4. Each reel is 178 millimeters in diameter and contains 3500 parts.
5. ams packaging tape and reel conform to the requirements of EIA Standard 481 - B.
6. In accordance with EIA Standard, device pin 1 is located next to the sprocket holes in the tape.
7. This drawing is subject to change without notice.

Datasheet - Apr. 2013 - ams163.5

TSL2591 – 21

Soldering Information

The package has been tested and has demonstrated an ability
to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top ofcomponent. The components should be limited to a maximumof three passes through this solder reflow profile.

Figure TSL2591 – 21:
Solder Reflow Profile

Parameter

Reference

Average temperature gradient in preheating

Device2.5 ºC/sec

Soak timetsoak

2 to 3 minutes

Time above 217 ºC (T1)t1

Max 60 sec

Time above 230 ºC (T2)t2

Max 50 sec

Time above Tpeak - 10 ºC (T3)t3

Max 10 sec

Peak temperature in reflow

Tpeak

260 ºC

Temperature gradient in cooling

Max -5 ºC/sec

Figure TSL2591 – 22:
Solder Reflow Profile Graph

Note: Not to scale – for reference only.

TSL2591 – 22

Datasheet - Apr. 2013 - ams163.5

Storage Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affectedduring the soldering process by the release and vaporization ofmoisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount ofabsorbed moisture possible, each device is baked prior to being
dry packed for shipping.
Devices are dry packed in a sealed aluminized envelope calleda moisture-barrier bag with silica gel to protect them fromambient moisture during shipping, handling, and storage
before use.

Shelf LifeThe calculated shelf life of the device in an unopened moisturebarrier bag is 12 months from the date code on the bag whenstored under the following conditions:• Shelf Life: 12 months• Ambient Temperature: < 40°C
• Relative Humidity: < 90%
Rebaking of the devices will be required if the devices exceed
the 12 month shelf life or the Humidity Indicator Card showsthat the devices were exposed to conditions beyond theallowable moisture region.

Floor LifeThe FN package has been assigned a moisture sensitivity levelof MSL 3. As a result, the floor life of devices removed from themoisture barrier bag is 168 hours from the time the bag was
opened, provided that the devices are stored under thefollowing conditions:• Floor Life: 168 hours• Ambient Temperature: < 30°C
• Relative Humidity: < 60%
If the floor life or the temperature/humidity conditions havebeen exceeded, the devices must be rebaked prior to solder
reflow or dry packing.

Rebaking Instructions
When the shelf life or floor life limits have been exceeded,rebake at 50°C for 12 hours.

Datasheet - Apr. 2013 - ams163.5

TSL2591 – 23

RoHS Compliant and ams GreenStatement

The term RoHS complaint means that ams products fully comply
with current RoHS directive. Our semiconductor products do
not contain any chemicals for all 6 substance categories,
including the requirement that lead not exceed 0.1% by weightin homogeneous materials. Where designed to be soldered athigh temperatures, RoHS compliant products are suitable foruse in specified lead-free processes. ams Green means RoHS
compliant and no Sb/Br). ams defines Green that additionallyto RoHS compliance our products are free of Bromine (Br) andAntimony (Sb) based flame retardants (Br or Sb do not exceed
0.1% by weight in homogeneous material).
Important Information and Disclaimer The information
provided in this statement represents ams knowledge andbelief as of the date that it is provided. ams bases its knowledge
and belief on information provided by third parties, and makes
no representation or warranty as to the accuracy of suchinformation. Efforts are underway to better integrate
information from third parties. ams has taken and continues totake reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams
and ams suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.

TSL2591 – 24

Datasheet - Apr. 2013 - ams163.5

Copyrights

Copyright © 1997-2013, ams AG, Tobelbaderstrasse 30, 8141
Unterpremstaetten, Austria-Europe. Trademarks Registered ®.
All rights reserved. The material herein may not be reproduced,
adapted, merged, translated, stored, or used without the priorwritten consent of the copyright owner.

Disclaimer

Devices sold by ams AG are covered by the warranty and patentindemnification provisions appearing in its Term of Sale. ams
AG makes no warranty, express, statutory, implied, or bydescription regarding the information set forth herein or
regarding the freedom of the described devices from patent
infringement. ams AG reserves the right to change
specifications and prices at any time and without notice.
Therefore, prior to designing this product into a system, it isnecessary to check with ams AG for current information. This
product is intended for use in normal commercial applications.
Applications requiring extended temperature range, unusualenvironmental requirements, or high reliability applications,such as military, medical life-support or life-sustaining
equipment are specifically not recommended without
additional processing by ams AG for each application. For
shipments of less than 100 parts the manufacturing flow mightshow deviations from the standard production flow, such as test
flow or test location.
The information furnished here by ams AG is believed to becorrect and accurate. However, ams AG shall not be liable torecipient or any third party for any damages, including but notlimited to personal injury, property damage, loss of profits, lossof use, interruption of business or indirect, special, incidental
or consequential damages, of any kind, in connection with or
arising out of the furnishing, performance or use of thetechnical data herein. No obligation or liability to recipient or
any third party shall arise or flow out of ams AG rendering oftechnical or other services.

Datasheet - Apr. 2013 - ams163.5

TSL2591 – 25