2nd International Eco-electronics ConferenceSponsored by
Ministry of Information Industry of China
Co-sponsor by
Tsinghua University

December 7-9th, 2006
Beijing International Convention Center

http://www.eco-e.org/

Conference Background
Recently, as an important trend in the field of electronic manufacturing, EcoDesign
has been considered much more than an environmental concept, it has been developed
quickly toward an big market and business chance, especially after the enactment ofRoHS/WEEE law system in EU and Other countries. At the same time, so many related
standards, product categories, technical level, testing methods arising from this field havenot been uniformed globally. To provide a chance as for the discussion on how to constructa stable development future of eco-electronics, some EcoDesigners from different countries
proposed this conference.
Ministry of Information Industry of China, as a sponsor, will publish the new progressof Chinese RoHS/WEEE system during the conference. We sincerely invite you to join andshare new information with us. Some friendly open discussion related to technology, market,
management and policy of eco-electronics were expected in the conference.

Language
English / Chinese (English was highly recommended)

Topics!

Global strategy & policy on Eco-electronics Industry.
Recent progress on the RoHS/WEEE system in different countries, including
standards, product category, RoHS certification will be discussed. The strategy on
the development of Eco-electronics business will be shared.

!

Design & technology on lead-free & halogen-free system.
Design, material, process, reliability & simulation on the lead-free & halogen-freesystem will be discussed.

!

Standard, testing & equipment on green electronics for RoHS system
Standards on material composition of electronic product, RoHS testing technique,
RoHS certificate procedure, RoHS solution, and RoHS related equipment system
will be discussed.

!

Construction and management of the system of Eco-electronics supply chain
It will be discussed about how to construct an effective new green supply chain,
how to mark the product, how to manage the storage of product, component,process….

!

Recycle, technology & management on E-waste
Recycle system construction, 3R, global collaboration, and product disassemble
technique will be discussed.

!

Collaboration of industry, education and research on Eco-electronics
To ensure sustainable development of eco-electronic activity, it was necessary todevelop active collaboration of industry, education and research.

Sponsored byMinistry of Information Industry of China
Co-sponsor byTsinghua University

In cooperation withIEEE-CPMT Beijing Chapter
Chinese Electronic Packaging Society
School of Material Science, Tsinghua University
Component Sub-society, Chinese Electronic Society
The University of Tokyo Wuxi Representative Office
China-Japan Science & Technology Exchange Society
Japan EcoDesign Promotion Network

Organized by
Division of Electronic Material & Packaging Technology, Tsinghua University
Wuxi International EcoDesign and Microelectronic Packaging Research InstitutePaper Submission
We sincerely invite you to attend the conference, paper submission was greatly encouraged. Theabstract of 200 words should include title, author, contact information, brief content of paper,etc. Anyone who plan to submit paper, please send abstract by email or fax to the following
address:

E-mailxuzhonghua@tsinghua.org.cn
xu.zhong@su.t.u-tokyo.ac.jp
temptm@mail.tsinghua.edu.cn

Fax

0510-85225248
010-62772724

Important date
Deadline for abstract
Paper acceptance notification
Deadline for paper
In site regiatration
Conference date
Industry tour

October 30th
November 5th
November 20thDecember 6-8th
December 7-8th
December 9thRegistration fee (Including lunch, dinner & proceedings)
Student
In-site registration, Dec.6-875US$
Student
Advanced registration by Nov.25
60US$
Speaker (Non-student)
In-site registration, Dec.6-8150US$
Speaker (Non-student)
Advanced registration by Nov.25
135US$
Non-speaker (Non-student)
In-site registration, Dec.6-8200US$
Non-speaker (Non-student)
Advanced registration by Nov.25
185US$
1. Registration fee of in-site registration will be paid at conference site on Dec.6-8 by cash.
2. Registration fee of advanced registration must be paid by Nov.25 by the way ofremittance to the following bank account:
Beneficiary’s name: International Ecodesign and Microelectronic Packaging Research Institute
LimitedPostal code: 214028
Unit address: Room 301-304, Building A, No.21, Changjiang RoadNew District, Wuxi, Jiangsu Province P.R.China
Bank name: Wuxi New District, Jiangsu Province, Agriculture Bank of China
Bank address: No.58 Wang Zhuang Road, WND, Jiangsu, China
SWIFT: ABOCCNBJ100
Account number: 1408010500141

Notice: Registration form was encouraged to be sent to the Organizer Secretariat byNovember 25th by Fax or e-mail.

Conference draft agenda (To be updated)
December 6-8thth

December 7th

December 8

Registration-whole day
Morning

Keynote speech

Afternoon

Group discussion

NightWelcome banquet

Morning
Afternoon
NightGroup discussion
Group discussion
DinnerDecember 9th

Industry tour

Conference site
Beijing International Convention Center
Beijing International Convention Center, connected with Beijing Continental Grand Hotel, covers aconstructional area of 60, 000 m2. It is a venue for international and domestic meetings, exhibition,and large-scale activities. It also serves as an office building. It is equipped with intelligent building
control system, Wide Band, simultaneous interpretation facilities, and digital control system foraudio, video, and lighting. All services for leisure and business are available here.

http://www.bicc.com.cn/guanyu/dili.htm
Beijing International Convention Center

Beijing Capital Airport
National Olympic Center“Secretariat of 2nd Eco-Electronics Conference”
Tel: +86-510-8522-5248; +86-10-6277-2724; +81-3-5841-6494
Fax: +86-510-8522-5248; +86-10-6277-2724; +81-3-5841-6495;
E-mail: xu.zhong@su.t.u-tokyo.ac.jp
temptm@mail.tsinghua.edu.cn
xuzhonghua@tsinghua.org.cn

http://www.eco-e.org/

Registration
Unit name
Unit address
Name

PaymentP.C.
Title

Telephone/Fax

E-mailPayment method (Please select the payment method by “!”)
1. Advanced registration, payment by postal remittance
2. Advanced registration, payment by bank transferring
3. In site registration, payment by cash

1. Registration fee of in-site registration will be paid at conference site on Dec.6-8 by cash.
2. Registration fee of advanced registration must be paid by Nov.25 by the way ofremittance to the following bank account:
Beneficiary’s name: International Ecodesign and Microelectronic Packaging ResearchInstitute Limited
Postal code: 214028
Unit address: Room 301-304, Building A, No.21, Changjiang RoadNew District, Wuxi, Jiangsu Province P.R.China
Bank name: Wuxi New District, Jiangsu Province, Agriculture Bank of China
Bank address: No.58 Wang Zhuang Road, WND, Jiangsu, China
SWIFT: ABOCCNBJ100
Account number: 1408010500141

Notice: Registration form was encouraged to be sent to the Organizer Secretariat byNovember 25th by Fax or e-mail.
****************************************************************“Secretariat of 2nd Eco-Electronics Conference”
Tel: +86-510-8522-5248，+86-10-6277-2724； +81-3-5841-6494
Fax: +86-510-8522-5248，+86-10-6277-2724； +81-3-5841-6495
Email: xuzhonghua@tsinghua.org.cn
temptm@mail.tsinghua.edu.cn
xu.zhong@su.t.u-tokyo.ac.jp
Http://www.eco-e.org/****************************************************************

2nd International Eco-Electronic Conference-Agenda
Thursday, Dec.7, 2006-!""# $ %! & ' ()Chairman--- Jianzhong Huang, Ministry of Information Industry*+,-./012345
8:30-9:00

Opening speech!"#$Chairman, Jusheng ma, Tsinghua University*+,67809:;<9:00-9:45

Introduction of Legislation of Chinese RoHS
Jianzhong Huang, Ministry of Information Industry of China=>123?@ABCDEFGHGIJKL-./012345

9:45-10:30

Introduction of Legislation of Chinese WEEE
Liang Feng, State Development and Reforming Commission of China
MN WEEE OPQRS
TU0MNNVWXYZ[\] ^_`a10:30-10:4510:45-11:15

11:15-11:45

11:45-12:15

Coffee break--%&Tin Whisker Bridging Across Electrical Conductors
Sony Mathew, Michael Osterman and Michael Pecht
Center for Advanced Life Cycle Engineering (CALCE)
University of Maryland
For a better global environment and trade – Harmonization
aspects of requirements for electronics industry
Hansjoerg Griese, Jutta Mueller, Lutz Stobbe
Fraunhofer Institute for Reliability and Microintegration IZMIntroduction of Standardization of Chinese RoHS
Weibing Xing, Electronic Standardization Research Institute of MII=>123?@ABCbcdefIJKL
ghi012345=>j4bcdklm

12:15-13:30

Lunch-'(Chairman--- Tadatomo Suga, University of Tokyo*+nopqr0st;<
13:30-14:00

Development of New Lead Free System and Its Reliability
Jusheng Ma, Tsinghua University
uvwxyzkC{|}~•)
67809:;<14:00-14:30

A New Class of Thermal Interface Material based on Nano-Technology for
Heat Removal in Electronics Packaging
Johan Liu1,2, Michael Olugbenga Olorunyomi1 , Xiuzhen Lu2, Wen Xuan
Wang2, Tomas Aronsson1, Si Chen2 and Dongkai Shangguan2
1
SMIT Center & Dept of Microtechnology and Nanoscience,University of14:30-15:00

15:00-15:30

15:30-16:00

Technology, Sweden
2
Key State Laboratory for New Displays and System Applicatons and SMIT
Center, Shanghai University
Packaging and Green Technology on Led
Sheng Liu, Huazhong University of Science and Technology!"#$%&'()*+,./0-123)45
Challenge of RoHS on Chinese Electronic Industry
By Chinese Industry people
Coffee Break-!"Panel discussion---Chinese RoHS and Its Global Impact
Chair—Wayne Koh, USA
4678+,9992: ;<=> (?@ABCDEFGHIJKL-M<N0O:

16:00-17:30

18:00-20:00

Jianzhong Huang, Ministry of Information Industry of China
Weibing Xing, Electronic Standardization Research Institute of MII
Dipl.-Ing. Hansjoerg Griese, IZM, Germany
Other 2-3 members from Japan, USA
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Dipl.-Ing. Hansjoerg Griese, IZM, Germany
defO:gh 2-3 iBanquet

Friday, Dec.8, 2006-#$$% & '# ( ) *Session A Design & technology on lead-free & halogen-free system
j6-k-lmflnop%qrs)*8:10-8:30
8:30-8:50

8:50-9:10

9:10-9:30
9:30-9:50

The Mutual Impact of Lead-Free Soldering and Fluxing Technology
Ning-Cheng Lee, Indium Corporation of American
Environmentally Friendly Electronics Packaging Materials
Itsuo Watanabe, Hitachi Chemical Co., Ltd.
Implementing RoHS and Green Policy in an International Power Management!
Manufacturing Service Provider Operating in China
Teng Hui, Yang Hongbo, Zhou Ming, Anthony C. Tsui
Advanced Engineering Department, GEM Electronics (Shanghai) Co., Ltd
Green Sensor application of thin film Hall sensors
Dr. Ichiro Shibasaki , Dr. Shuichiro Ogawa
New Business Development, Asahi Kasei Corporation
IC Green Packaging—Fundation of Green Electronics
Hongjun Yan, Nantong Fujitsu Microelectronics Co., Ltd.

!!""#$#!%&"'!!()$%&,'()*(+",
9:50-10:10
10:10-10:30

10:30-10:50

10:50-11:10

11:10-11:30

11:30-11:50

12:00-13:00

Coffee break-!"
Research Report on Lead Free Solder of SnCuNiCeMingbin Su, Kunshan Chengli Soldering Co. Ltd.
-./012 SnCuNiCe 34567
89:;<=>?1@AB-CDE
Halogen Free Cables and Wires for Our Green Life
Eddie Li, Jay Luo and Hugo Leung, LTK Wiring Company
Fine Lead-free solder paste for high density Packaging and its key-preparation
Hu-qiang, Xu-jun, Zhang fu-wen
General Research Institute for Non-ferrous Metals
FGHIJKLM/01NO.P2QR.SATUVWXYZ[\Z])^W_`-abc45defgP2hi;_`jk@l12-CDE
Critical Parameters in Voiding Control at Reflow Soldering
Ning-Cheng LeeIndium Corporation of American
Novel SACX solders with superior drop test performance
Weiping Liu and Ning-Cheng Lee
Indium Corporation of American
Lunch-#$Session B—Eco-Design, management, supply chain and global collaboration
mnWop!aqr;st;uvwxyzg{W

13:00-13:20

13:20-13:40

13:40-14:00

Europe - China Cooperation in Green Electronics Production Research(EC-GEPRO)
Otto Andersen1, Idun Husabø Anderssen1, Johan Liu2, Teng Wang2, DavidWhalley3, Helge Kristiansen4, Tom Ove Grønlund4, Krystyna Bukat5, XiuzhenLu6, Zhaonian Cheng6
1
Western Norway Research Institute 1 , 2Chalmers Technical University,Sweden, 3Loughborough University, UK, 4Conpart AS, Norway, 5ITR - Teleand Radio Research Institute, Warsaw, Poland, 6Sino Swedish Microsystem
Integration Technology Center, Shanghai University
Importance and necessity on the Ecodesign of Chinese household home
appliance Household
Zhongfan Zhou, Chinese Research Academy of Environmental Scienceh|}K"~•€•‚!aqr3ƒ„…x†‡…
ˆ‰Š;h|‹Œ•Ž45e
Eco-design potentiality of Flexible Printed Circuit (FPC) for electronicequipment
Hidetaka Hayashi, The University of Tokyo14:00-14:20

Green manufacturing-- sustainable development strategy
Weixiang Guo & Jingxing Jiang, China Telecommunication Technology Labs!"#$—%&'()*+,-./, 012, 34567839:;<=>?@AB

14:20-14:40

Extended Producer Responsibility: An examination of its impact oninnovation and greening products
Chris van Rossem, Naoko Tojo, Thomas Lindhqvist

14:40-15:00

Coffee Break-!"

Session C!RoHS Standard, Testing Technology and Equipment
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15:00-15:20

15:20-15:40

15:40-16:00

Study on minimal size of component unnecessary to further disjoint in RoHS
Testing
Luo Daojun and Bian Zhengyun
China Ceprei Lab., Guangzhou, P.R.China
Environmental Regulations and Compliance Standardization of Requirements
Michael Kluwin, Juniper Networks, Inc.
A quick green certified test by X-ray fluorescence spectrometry for RoHS
complianc
L. Hua1, 2, Y. C. Chan1*, Y.P.Wu2, B. An2, A. Sharif 1
1*. Department of Electronic Engineering, City University of Hong Kong
2. Huazhong University of Science " Technology, Wuhan, China

16:00-16:20

Application of X-Ray Spectrometer on RoHS Measurement
Dr. Zhaogui Liu, Skyray Instrument LTD.
T X UVVWXY RoHS ZO<[\]^_`abNcdefXghijklmnop

16:20-16:40

Scheme Consideration of X-Ray Spectrometer for EU RoHS & WEEEBandwise Technology Development Co., Ltd.
qrst ROHS & WEEE uv]whxyzZOQ{#[ X UVC|X}~•€•‚ƒ1„2.6…†‡(hilmSession D—Electronic and electrical sets recycle activity, technology and management.
CDEˆ‰8Š‹Œ56•…†QŽ•E

16:40-17:00

17:00-17:20

A Comparative Study of Recycling Strategies for E-waste in Japan and Korea
Chung Sung Woo, Graduate School of Economics and Business
Administration, Hokkaido University
Prof. Yoshida Fumikazu, Graduate School of Public Policy, Hokkaido
University
Research on Chinese E-Wast recycle System.
Jiping Yang, Dong Xiang, Peng Mou, Guanghong Duan
Tsinghua University<=•‘8Š8g5’‹Œ“•”•–R9:—˜™[1] š›[1] œ•[1] žŸ [1] ¡¢[2][1]£¤¥¦§¨Xg©ª«¦• [2]¬-6®¯°±9:²

17:20-17:40

Research on cycle manufacturing of Chinese electronic and electrical sets inChina
Youliang Zhang, Chinese Household Home Appliance Research Institute!"#$#%&'()*+,*-.
/012!"3#456

17:40-18:00

EEE pollution –Introduction of global environment regulations
Yunfei Xu, Muzhen Ke, SGS!"7, #$%, SGS 899:;<=>?@AB

18:30-20:00

Dinner-!"Saturday, Dec.9, 2006
Industry tour2006 C 12 D 9 EFG