SOT758-1

plastic thermal enhanced very thin quad flat package; no leads; 16 terminals;
body 3 x 3 x 0.85 mm

Package information

HVQF
N1
618 June 2024

1 Package summary
Terminal position code

Q (quad)Package type descriptive code

HVQFN16

Package type industry code

HVQFN16

Package style descriptive code

HVQFN (thermal enhanced very thin quad flatpack; noleads)

Package body material typeP (plastic)

JEDEC package outline codeMO-220

Mounting method typeS (surface mount)

Issue date21-10-2002

Manufacturer package code

SOT758Table 1. Package summary
Parameter

MinNomMax

Unit

package length

2.933.1mm

package width

2.933.1mm

seated height

-

0.851

mm

package height

-

0.85-

mm

nominal pitch-

0.5-mmactual quantity of termination-

16-

SOT758-1

NXP Semiconductors

plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm

2 Package outline
HVQFN16: plastic thermal enhanced very thin quad flat package; no leads;
16 terminals; body 3 x 3 x 0.85 mm

BDSOT758-1Aterminal 1
index area
AEA1cdetail X

e1C
1/2 ee58yy1 Cv M C A B
w M CbL
49ee2

Eh
1/2 e

12

116

terminal 1
index area

13DhX

0

2.55 mmscale
DIMENSIONS (mm are the original dimensions)
UNITA (1)
max.

A1bc

D (1)

Dh

E (1)

Ehee1e2

Lv

w

yy1

mm1

0.05
0.00

0.30
0.18

0.2

3.1
2.9

1.75
1.45

3.1
2.9

1.75
1.45

0.5

1.5

1.5

0.5
0.3

0.1

0.05

0.05

0.1

Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
2. Terminal 1 feature shape, size and location may vary.
REFERENCESOUTLINE
VERSION

IEC

JEDEC

JEITA

SOT758-1---MO-220---EUROPEAN
PROJECTION

ISSUE DATE
02-10-21
24-05-24

Figure 1. Package outline HVQFN16 (SOT758-1)
SOT758-1

Package information

All information provided in this document is subject to legal disclaimers.

18 June 2024

© 2024 NXP B.V. All rights reserved.

2/5

SOT758-1

NXP Semiconductors

plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm

3 Soldering
Footprint information for reflow soldering of HVQFN16 package

SOT758-1

Hx
Gx
DP

0.025
0.025

C(0.105)
SPx

Hy

SPy totnSPx

Gy

SPynSPy

SLy

By

Ay

SPx tot

SLx
Bx
Ax
solder landsolder paste deposit
solder land plus solder paste
occupied area

nSPx

nSPy

22Dimensions in mmPAx

Ay

Bx

ByCDSLx

SLy

SPx tot SPy totSPx

SPyGx

GyHx

Hy

0.50

4.00

4.00

2.20

2.20

0.90

0.24

1.50

1.50

0.900.30

0.30

3.30

3.30

4.25

4.25

Issue date

0.90

12-03-07
12-03-08

sot758-1_fr

Figure 2. Reflow soldering footprint for HVQFN16 (SOT758-1)

SOT758-1

Package information

All information provided in this document is subject to legal disclaimers.

18 June 2024

© 2024 NXP B.V. All rights reserved.

3/5

SOT758-1

NXP Semiconductors

plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm

4 Legal information
Disclaimers
Limited warranty and liability — Information in this document isbelieved to be accurate and reliable. However, NXP Semiconductors
does not give any representations or warranties, expressed orimplied, as to the accuracy or completeness of such informationand shall have no liability for the consequences of use of suchinformation. NXP Semiconductors takes no responsibility for thecontent in this document if provided by an information source
outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect,
incidental, punitive, special or consequential damages (including without limitation - lost profits, lost savings, business interruption,
costs related to the removal or replacement of any products orrework charges) whether or not such damages are based on tort(including negligence), warranty, breach of contract or any otherlegal theory.
Notwithstanding any damages that customer might incur for
any reason whatsoever, NXP Semiconductors’ aggregate andcumulative liability towards customer for the products describedherein shall be limited in accordance with the Terms and conditionsof commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves theright to make changes to information published in this document,
including without limitation specifications and product descriptions,at any time and without notice. This document supersedes andreplaces all information supplied prior to the publication hereof.

SOT758-1

Package information

All information provided in this document is subject to legal disclaimers.

18 June 2024

© 2024 NXP B.V. All rights reserved.

4/5

SOT758-1

NXP Semiconductors

plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm

Contents12
34Package summary ........................................... 1
Package outline ............................................... 2
Soldering .......................................................... 3
Legal information .............................................4© 2024 NXP B.V.

All rights reserved.

For more information, please visit: https://www.nxp.com
Date of release: 18 June 2024
Document identifier: SOT758-1