HVQF
N48

SOT619-11

plastic thermal enhanced very thin quad flat package; noleads; 48 terminals
8 February 2016

Package information

1. Package summary
Terminal position code

Q (quad)Package type descriptive code

HVQFN48

Package type industry code

HVQFN48

Package style descriptive code

HVQFN (thermal enhanced very thin quadflatpack; no leads)

Package style suffix code

NA (not applicable)

Package body material typeP (plastic)

IEC package outline code---

JEDEC package outline codeMO-220JEITA package outline code---

Mounting method typeS (surface mount)

Issue date

11-12-2009

Table 1. Package summary
SymbolParameter

MinTypNomMax

UnitDpackage length

6.9-

77.1mmEpackage width

6.9-

77.1mmA

seated height

0.8-

0.851mmenominal pitch-

-

0.5-

mm

n2

actual quantity of termination--48-

SOT619-11

NXP Semiconductors

plastic thermal enhanced very thin quad flat
package; no leads; 48 terminals

2. Package outline
HVQFN48: plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 7 x 7 x 0.85 mm

DB

SOT619-11

A

terminal1
index area

EA
A1c

detail Xe1eL

1/2 evw

b1324

12CC A B
Cy1 Cy25eEhe2
1/2 e1
terminal1
index area

36
48

X

37
Dh0

2.5

Dimensions
Unit
mm

5 mm

scale
A(1)

A1bc

DDhE

Ehee1

e2Lv

w

ymax 1.00 0.05 0.30
nom 0.85 0.02 0.21
min 0.80 0.00 0.18

0.2

7.1
7.0
6.9

5.45
5.30
5.15

7.1
7.0
6.9

5.45
5.30
5.15

0.5

5.5

5.5

0.5
0.4
0.30.10.05 0.05

y10.1

Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
References

Outlineversion

IECJEDECJEITASOT619-11---MO-220---

sot619-11_po

Europeanprojection

Issue date
09-12-11
12-06-25

Fig. 1. Package outline HVQFN48 (SOT619-11)

SOT619-11

Package information

All information provided in this document is subject to legal disclaimers.

8 February 2016

© NXP Semiconductors N.V. 2016. All rights reserved

2/4

SOT619-11

NXP Semiconductors

plastic thermal enhanced very thin quad flatpackage; no leads; 48 terminals

3. Legal information
Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for theconsequences of use of such information. NXP Semiconductors takes noresponsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removalor replacement of any products or rework charges) whether or not suchdamages are based on tort (including negligence), warranty, breach ofcontract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordancewith the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right tomake changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.

SOT619-11

Package information

All information provided in this document is subject to legal disclaimers.

8 February 2016

© NXP Semiconductors N.V. 2016. All rights reserved

3/4

SOT619-11

NXP Semiconductorsplastic thermal enhanced very thin quad flatpackage; no leads; 48 terminals

4. Contents
1. Package summary........................................................ 1
2. Package outline............................................................ 2
3. Legal information......................................................... 3© NXP Semiconductors N.V. 2016. All rights reserved

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 8 February 2016

SOT619-11

Package information

All information provided in this document is subject to legal disclaimers.

8 February 2016

© NXP Semiconductors N.V. 2016. All rights reserved

4/4