Notice: This document is a translation of the original Japanese document and is only forreference purposes.

January 30, 2024
80, Oshimada-machi, Nagano-shi, 381-2287 JapanSHINKO ELECTRIC INDUSTRIES CO., LTD.
Stock exchange code: 6967, TSE Prime

SHINKO ELECTRIC INDUSTRIES CO., LTD. Is Selected for NEDO’s“Research and Development Project of the Enhanced Infrastructures for Post5G Information and Communications Systems/Development of Manufacturing
Technologies for Advanced Semiconductors”
NAGANO, Japan, January 30, 2024 — SHINKO ELECTRIC INDUSTRIES CO., LTD. (SHINKO)
announced that the New Energy and Industrial Technology Development Organization(NEDO) has selected us as a company conducting the “Research and Development Project of
the Enhanced Infrastructures for Post-5G Information and Communications Systems/ Developmentof Manufacturing Technologies for Advanced Semiconductors”.
As traffic increases in accordance with the advancement of information and communication
system infrastructures, there is an increasing need for photonics-electronics convergence, which
unites the functions of data processing by electrons and of optical data transfer within asemiconductor package to dramatically reduce power use, while also achieving super high-speed
data processing. Jointly with Nippon Telegraph and Telephone Corporation, Furukawa ElectricCo., Ltd., NTT Innovative Devices Corporation and NTT DevIces Cross Technologies Corporation,
SHINKO has been selected to conduct the “Research and Development Project of Infrastructures
for Packaging Technology related Photonics-electronics Convergence and Deterministic-Latency
Computing”, within the “Research and Development Project of the Enhanced Infrastructures for
Post-5G Information and Communications Systems/Development of Manufacturing Technologies
for Advanced Semiconductors”. In this project, we will be responsible for the development ofoptical chiplet integration technology and production processes. In addition to the opticalconnection between semiconductor packages, we will collaborate with the other parties andpromote the development of technologies for next-generation optical semiconductor devices thatwill integrate photonics-electronics convergence devices inside a semiconductor package, andmoreover realize the optical connection between chips inside a semiconductor package.
Our businesses include the development and manufacturing of substrates for semiconductor
packages as well as IC assembly, which consists of mounting IC chips on substrates forsemiconductor packages. By advancing and fusing the core technologies nurtured through thesebusinesses, such as plating, surface treatment, and multi-layering as well as advanced packaging
technologies, we will drive research and development of a photonics-electronics convergencedevice in a semiconductor package, contributing to enhancing infrastructures for post-5G
information and communications systems with enhanced functions, such as those for ultra-low
latency and multiple simultaneous connections. This project is scheduled to continue for fiveyears until fiscal year 2028.

［About Optical Chiplets］
Optical chiplets are small photonics-electronics convergence devices (optical transceivers)
with low power consumption. With optical chiplet integration technology, electronic devices
and optical electronics can be connected on a single package substrate, replacing electricalwiring with optical wiring, thereby achieving higher capacity and low-latency networks, thus
significantly reducing power consumption across network systems, including servers anddata centers.
CONTACT: Public & Investor Relations Dept.,
Corporate Planning Div.
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