QFN32
HVSOT617-3

plastic, thermal enhanced very thin quad flat package; 32
terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.85 mm body
13 September 2021

1

Package information

Package summary
Terminal position code

Q (quad)Package type descriptive code

HVQFN32

Package type industry code

HVQFN32

Package style descriptive code

HVQFN (thermal enhanced very thin quad
flatpack; no leads)

Package body material typeP (plastic)

JEDEC package outline codeMO-220

Mounting method typeS (surface mount)

Issue date

22-10-2002

Manufacturer package code

98ASA01350D

Table 1. Package summary
Parameter

MinNomMax

Unitpackage length

4.955.1mm

package width

4.955.1mm

seated height

0.80.851mm

nominal pitch-0.5-mmactual quantity of termination-32-

SOT617-3

NXP Semiconductors

plastic, thermal enhanced very thin quad flat package; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.85mm body2Package outline

HVQFN32: plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 x 5 x 0.85 mmDBSOT617-3

Aterminal 1
index area

AA1

Edetail X

Ce1ev
w

1/2 e b

916

L

y1 C

C A B
Cy178ee2Eh
1/2 e24

1
terminal 1
index area

3225
X

Dh0

2.5

Dimensions
Unit(1)mm5 mmscale
A(1)A1bmax0.05 0.30
nom 0.85
min
0.00 0.18

c0.2

D(1)

DhE(1)

Eh

5.1

3.75

5.1

3.75

4.9

3.45

4.9

3.45

ee1

e2

0.5

3.5

3.5

L
0.5
0.3v

w

y0.1

0.05 0.05

y10.1

Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
Outlineversion
SOT617-3

References
IECJEDEC

JEITA

sot617-3_po

Europeanprojection

Issue date
11-06-14
11-06-21

MO-220Figure 1. Package outline HVQFN32 (SOT617-3)

SOT617-3

Package information

All information provided in this document is subject to legal disclaimers.

13 September 2021

© NXP B.V. 2021. All rights reserved.

2/5

SOT617-3

NXP Semiconductors

plastic, thermal enhanced very thin quad flat package; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.85mm body3SolderingFootprint information for reflow soldering of HVQFN32 package

SOT617-3

Hx
Gx
see detail X

PnSPx

By

Hy Gy SLyAynSPy

CDSLx
Bx
Ax

0.60

solder land

0.30

solder paste

detail X

occupied area
Dimensions in mm
PAx

Ay

Bx

By

CD

Gx

Gy

Hx

HySLx

SLynSPx

nSPy

0.5

5.95

5.95

4.25

4.25

0.85

0.27

5.25

5.25

6.2

6.2

3.75

3.75

33Issue date

11-11-15
11-11-20

sot617-3_fr

Figure 2. Reflow soldering footprint for HVQFN32 (SOT617-3)

SOT617-3Package information

All information provided in this document is subject to legal disclaimers.

13 September 2021

© NXP B.V. 2021. All rights reserved.

3/5

SOT617-3

NXP Semiconductors

plastic, thermal enhanced very thin quad flat package; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.85
mm body4

Legal information

Disclaimers
Limited warranty and liability — Information in this document isbelieved to be accurate and reliable. However, NXP Semiconductors
does not give any representations or warranties, expressed or
implied, as to the accuracy or completeness of such informationand shall have no liability for the consequences of use of suchinformation. NXP Semiconductors takes no responsibility for thecontent in this document if provided by an information source
outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect,
incidental, punitive, special or consequential damages (including without limitation - lost profits, lost savings, business interruption,
costs related to the removal or replacement of any products orrework charges) whether or not such damages are based on tort(including negligence), warranty, breach of contract or any otherlegal theory.
Notwithstanding any damages that customer might incur for
any reason whatsoever, NXP Semiconductors’ aggregate andcumulative liability towards customer for the products describedherein shall be limited in accordance with the Terms and conditionsof commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves theright to make changes to information published in this document,
including without limitation specifications and product descriptions,at any time and without notice. This document supersedes andreplaces all information supplied prior to the publication hereof.

SOT617-3

Package information

All information provided in this document is subject to legal disclaimers.

13 September 2021

© NXP B.V. 2021. All rights reserved.

4/5

SOT617-3

NXP Semiconductors

plastic, thermal enhanced very thin quad flat package; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.85
mm bodyContents
123
4

Package summary ...............................................1
Package outline ...................................................2
Soldering ..............................................................3
Legal information ................................................ 4© NXP B.V. 2021.

All rights reserved.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 13 September 2021