IT´S ULTRA-THIN

NXP® ultra-thincontactless chipmodule MOB10Ultra-thin module transforms
ePassport and eID card production
Measuring just 200 µm - roughly four times the thickness of an average human hair
- the MOB10 is an impressive 20% thinner than its predecessor, and is ideally suited
for use in ultra-thin inlays for passport datapages and identity cards. It is the first ultrathin
contactless module available in high volume, and supports polycarbonate technology
and new security features, yet is compatible with the existing production infrastructure.

KEY BENEFITSKEY FEATURES

Allows for additional security layers and featuresand is optimized for polycarbonate technology

Protects the chip against mechanicaland environmental stress and reverse engineeringUltra-thin and flexible inlays for passport data
page and eID cards

Improved product quality and increased
document durability

APPLICATIONSHigher production efficiency

 National eID cards

 ePassports eHealth cards

Builds on proven MOB industry technology
and ensures production handshake Citizen cards
 Resident permits
 eDriver‘s licenses
 High-security physical / logical accessMINIATURIZATION AND PRODUCT QUALITYPRODUCT COMPATIBILITY

Extensive testing has proven the robustness of the MOB10.
The very high degree of resilience leads to higher endproduct quality, by making the document less vulnerable
to damage. For example, the MOB10 withstands the damage
caused by-- Mechanical stress in the field and during production-- Micro-cracks that can be initiated in the naked flip chip-- Environmental stress like humidity, chemicals,solvents etc.
-- Thermal stress-- Light and laser-- Attacks and reverse engineering

The MOB10 is designed to be compatible with existingproduction lines and can be integrated into current
manufacturing processes without modifying or replacing
the in-place setup. This helps manufacturers to keep
the costs low, and makes it easier to transition to moreadvanced government documents.

Furthermore, to support the evolution of biometricpassports, which will move the contactless module fromthe cover to the data page, the demand for miniaturization
increases. The MOB10 meets this demand by being
the leading ultra-thin contactless module.
MOB MODULE EVOLUTION

MOB2MOB4

MOB6

MOB10400 μm

320 μm

250 μm200 μmThe MOB10 is the latest in NXP’s groundbreaking MOB
series which has set the industry standard for contactless
IC packages. As a pioneer in the area of miniaturization,
we have introduced several generations of contactless chipmodules, each thinner than the one before it.

Standard Footprint

Small Footprint(MOB)(MOA8)The MOB10 is compatible with standard production
steps, including punching from frame, pick and place,interconnecting to modules with thermocompression
welding, conductive gluing or soldering, and laminating.
And, because the MOB10 module can accommodate
a number of different secure ICs, multiple designs can besupported without increasing production costs or slowing
down the production line.
SOLUTION PRODUCTIVITY
With the MOB10, NXP enables ultra-thin inlays, eCovers,and eDatapages, and supports fast production ramp-up.
The NXP offer includes the chip, an operating system,
an applet suite, and middleware - all of which are Common
Criteria certified and ICAO compliant. We also offer prepersonalization and initialization support, for maximum
flexibility in every implementation.
NXP LEADERSHIP
NXP is the world leader in secure microcontrollers
for contact and contactless applications. We inventedMIFARE contactless ICs and have made leading
contributions to many innovations, including Near Field
Communiation (NFC). Our proven end-to-end solutions
include reader ICs, security ICs, and enabling technologies
for mobile transactions, infrastructure, and end-user
applications. We are also the number-one provider of secure
identity products for eGov applications. We were first withtiny MOB contactless modules and continue to set
the industry standard by focusing on production,productivity, quality, and security.

The ultra-thin profile of the MOB10 makes it possible
to accommodate new security features and still include
the secure microcontroller and its antenna, without addingbulk. As an option, the MOB10 will be available in the MOA8
footprint, for an even smaller design.

© 2017 NXP Semiconductors N.V.
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The information presented in this document does not form part of any quotation or contract, is believed to be accurate
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Date of Release: October 2017

With DPA Countermeasures functionality
NXP ICs containing functionality implementing
countermeasures to Differential Power Analysis
and Simple Power Analysis are produced
and sold under applicable license from
Cryptography Research, Inc.