SGM6906VU

X-band 50W GaN-HEMT 2-stage Module◼ Features•••••High Output Power: Psat=47.5dBm (Typ.)High Gain: Gp=22.5dB (Typ.)Frequency Band: 9.2 to 9.5GHz
Impedance Matched Zin/Zout = 50ohm
Hermetically Sealed SMT Package◼ Description
The SGM6906VU is a 50ohm matched X-band 50W GaN-HEMT
2-stage module in a small hermetically sealed ceramic SMT package.
The SGM6906VU provides optimum power and high gain for X-bandapplications.
ABSOLUTE MAXIMUM RATING (Case Temperature Tc=25 deg.C)
ItemDrain-Source Voltage
Gate-Source Voltage
Storage Temperature
Channel Temperature

SymbolVDSVGSTstg
TchRating
55-15-55 to +125+250

Unit
VV
deg.Cdeg.C

RECOMMENDED OPERATING CONDITION
Item
Drain-Source Voltage

SymbolVDS

Forward Gate Current

IGF

Reverse Gate Current

IGR

Channel Temperature
Pulse Width

Tch
PW

Condition
1st stage Rg=360ohm

Limit<=50<=9.8

2nd stage Rg=75ohm
1st stage Rg=360ohm<=45.0>=-0.6

2nd stage Rg=75ohm>=-2.6<+200<=100

Duty=10%

Unit
VmAmA
deg.C
µsec

ELECTRICAL CHARACTERISTICS (Case Temperature Tc=25 deg.C)
Item

SymbolCondition

Pinch-off Voltage

VP (1st stage)
VP (2nd stage)

Frequency Range

Freq

Output PowerPsat

Power Gain

Gp

Drain Current

IDSR

Power Added Efficiency

PAE

VDS=50V, IDS=0.8mA
VDS=50V, IDS=3mA
VDS=50V
IDS(DC)1=40mA
IDS(DC)2=160mA
Pulse Width=50µsec
Duty=5%
Pin=25dBm

CASE STYLE
RoHS Compliance
ESD

VU
YES
Class 1B

Min.
-LimitTyp. Max.
-4.5-4.5-Unit
VV

9.2-

9.5

GHz

46.4

47.5-dBm

21.4

22.5-dB-3.04.1A-37-%

500V to <1000V

Note: Based on ANSI/ESDA/JEDEC JS-001-2012(C=100pF, R=1.5kohm)

ORDERING INFORMATIONPart Number
Order Unit
SGM6906VU
No limitation
SGM6906VUT
500pcs.

Edition 3.0
Jul. 2023

Packing48 pcs./Tray x 4 Tray = 192 pcs. / Packing
500 pcs./Reel x 1 Reel = 500 pcs. / Packing-1-

SGM6906VU

X-band 50W GaN-HEMT 2-stage Module⚫ RF Characteristics
Output Power, PAE vs. Input Power

VDS=50V, VGS=-2.75/-5.0V, IDS(DC)1+IDS(DC)2 =200mA, PW=50µsec., Duty=5%⚫ Transient Thermal Resistanc
Rth vs. Pulse Width

Edition 3.0
Jul. 2023-2-

SGM6906VU

X-band 50W GaN-HEMT 2-stage Module⚫ Block Diagram

Edition 3.0
Jul. 2023-3-

SGM6906VU

X-band 50W GaN-HEMT 2-stage Module⚫ Package Outline
Case Style: VU

Edition 3.0
Jul. 2023-4-

SGM6906VU

X-band 50W GaN-HEMT 2-stage Module⚫ 4-inch Tray Packing (Part No.: SGM6906VU)

Edition 3.0
Jul. 2023-5-

SGM6906VU

X-band 50W GaN-HEMT 2-stage Module⚫ Tape and Reel Packing(Part No.: SGM6906VUT)

Edition 3.0Jul. 2023-6-SGM6906VU

X-band 50W GaN-HEMT 2-stage Module⚫ Mounting Method of SMD(Surface Mount Devices) for Lead-free solder
Mounting Condition(1) For soldering, Lead-free solder (Sn-3.0Ag-0.5Cu)*1 or equivalent shall be used.
(*1: The figure displays with weight %. A predominantly tin-rich alloy with 3.0% silver and 0.5%copper.)(2) A rosin type flux with a chlorine content of 0.2% or less shall be used. The rosin flux with low
halogen content is recommended.
(3) When soldering, use one of the following time / temperature methods for acceptable solder joints.
Make sure the devices have been properly prepared with flux prior soldering.
* Reflow soldering method (Infrared reflow / Heat circulation reflow / Hot plate reflow):
Limit solder to 3 reflow cycles because resin is used in the modules manufacturing process.
Excessive reflow cycles will effect the resin resulting in a potential failure or latent defect. The
recommended reflow temperature profile is shown below. The temperature of the reflow profile
must be measured at the device body surface.

Temperature (deg.C)

Reflow temperature profile and condition:

260
255
217

(4)
(2) (6)

200
(5)
150
(1)
RT

(3)

(7)
Time

(1) Preheating:(2) Ramp-up Rate:(3) Liquidus temperature and time:(4) Peak Temperature:(5) Time Peak Temperature:(6) Ramp-down Rate:(7) Time RT to peak temperature:

150 to 200 deg.C, 60 to 120 seconds
3 deg.C /seconds max
217 deg.C, 60 to 150 seconds
260 deg.C
255deg.C, 30seconds max
6 deg.C /seconds max
8 minutes max* Measurement point: Center of the package body surface(4) The above-recommended conditions were confirmed using the manufacture’s equipment andmaterials. However, when soldering these products, the soldering condition should be verified bycustomer using their equipment and materials.

Edition 3.0
Jul. 2023-7-

SGM6906VU

X-band 50W GaN-HEMT 2-stage Module

For Safety, Observe the Following Procedures Environmental Management⚫ Do not put this product into the mouth.
⚫ Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, orchemical processing as these by-products are dangerous to the human body if inhaled, ingested, orswallowed.
⚫ Respect all applicable laws of the country when discarding this product.
This product must be disposed in accordance with methods specified by applicable hazardous waste
procedures.
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the device(s) with respect to its use based on such information. When the user develops equipment
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The products described in this document are designed, developed and manufactured as contemplated forgeneral use, including, without limitation, ordinary industrial use, general office use, personal use, andhousehold use, but are not designed, developed and manufactured as contemplated (1) for use
accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious
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Information in this document is subject to change without notice.

Edition 3.0Jul. 2023-8-