SFine MEMS Project Interim Achievements Seminar
Sponsor: Fine MEMS Project Committee/ Micromachine Center(1) Purpose
This seminar will cover the interim achievements of the Highly Integrated / Complex MEMS Manufacturing Technology Development
Project (Fine MEMS), a three-year NEDO-sponsored project initiated in fiscal 2006 to develop the key technologies that will support thegrowth of the MEMS industry.
The purpose of the Fine MEMS Project is to develop key manufacturing technologies that will make it possible to create moreadvanced methods for three-dimensional microstructure processing and develop more complex and integrated functions through the useof nanomaterials and heterogenous materials.
(2) Program

Highly Integrated / Complex MEMS Manufacturing Technology Development Project (commissioned and subsidized by NEDO) (FY 2006 - 2008)

Fine MEMS Project Interim Achievements Seminar
Date & time: Friday, July 27, 2007 1:00 p.m. - 4:30 p.m.
Venue: Tokyo Big Sight (special venue set up within West No. 3 Hall)
Sponsor: Fine MEMS Project Committee/ Micromachine Center
Admission fee: Free
MC: Tomoyuki Koike, Micromachine Center

Session 1Opening

13 : 00 --- 13 : 05

Greeting from invited guest

13 : 05 --- 13 : 10

Greeting from invited guest

Masami Takayasu, Director, New Energy andIndustrial Technology Development Organization (NEDO)
Hiroaki Okahashi, Deputy Director, Ministry of Economy,
Trade and Industry (METI)

Isao Shimoyama, Chair, Fine MEMS Project Committee

13 : 10 --- 13 : 25

Overview of Fine MEMS Project

Session 2

Achievements of Commissioned Fine MEMS Projects (1)13 : 25 --- 13 : 45

Nano-mechanical structure fabrication technology

13 : 45 --- 14 : 05

Selective Modification Technologies
for Biomaterials (e.g. Proteins)

Sachio Suzuki, Research Scientist, Research Center of Advanced Bionics,

14 : 05 --- 14 : 25

Technology to selectively structure nano-materials
such as single-wall carbon nanotubes (CNT)

Kenji Hata, Team Leader, Research Center for Advanced Carbon Materials

14 : 25 --- 14 : 30

Break(Professor and Dean, Graduate School of Information Scienceand Technology, The University of Tokyo)

Isao Shimoyama, Professor and Dean, Graduate Schoolof Information Science and Technology, The University of Tokyo
National Institute of Advanced Industrial Science and Technology (AIST)

National Institute of Advanced Industrial Science and Technology (AIST)

Session 3

Achievements of Commissioned Fine MEMS Projects (2)14 : 30 --- 14 : 50

Exploration of novel sensing principle for piezoresistanceof nano scale Si and its application to high-functional
sensing devices

14 : 50 --- 15 : 10

Integrate Lateral connection MEMS and IC(Low Temperature Integration Technology)

Jun Akedo, Project Leader, Advanced Manufacturing Research Institute,

15 : 10 --- 15 : 30

MEMS-LSI Chip Lateral Interconnection Technology(High density packaging technology using
low temperature chip stacking)Mitsumasa Koyanagi, Professor,
Department of Bioengineering and Robotics, Tohoku University

15 : 30 --- 15 : 50

Low-Stress Dicing for Multi-layered MEMS Wafer

Session 4Closing

15 : 50 --- 16 : 00

Regarding the Fine MEMS Knowledge Database

16 : 00 --- 16 : 30

Technical Consultation Corner

7

Hisayuki Toriyama, Professor,
Faculty of Science & Technology, Ritsumeikan University
National Institute of Advanced Industrial Science and Technology (AIST)

Masayuki Fujita, Chief Researcher,
Institute for Laser Technology

Keiichi Aoyagi, Executive Director Micromachine Center

Exhibition Area Booth C-032