MMC Activities..............1
TOPICS.......................5
Members’ Profiles .........6
Worldwide R&D ............8

MMC Activities

The 8th International Micromachine / Nanotech Symposium
The 8 th International Micromachine/Nanotech
Symposium will be held on November 14 (Thursday), 2002,
at the Science Museum in Kitanomaru Park, Tokyo, and isbeing organized by the Micromachine Center.
This is the 8th symposium since the 1st International
Micromachine Symposium was held in 1995 supported by
METI and NEDO, the symposium aims at establishment anddissemination of micromachine technology, as well as
enlightment of micromachine technology. Last year, in the
7th International Micromachine symposium, we presented
summary of the fruits of "Micromachine technology
development PJT" which took the global initiative in the 10
year PJT of "Industrial Science and Technology Frontier
Program" so called (ISTF). From this 8th symposium, we
expand the scope from Micromachine technology to nanotechnology and applied the sub-theme as "Micro systems
implicated nano technology make the Foundation of Industrial
Technology in the 21st Century". Therefore we named this
symposium The 8th International Micromachine/Nanotech Symposium.
Recently the fruits of research in nanotechnology havebeen remarkable, however to utilize the nano-scaletechnology for human size, it is required to develop the newtech which seamlessly links nano-scale and human-size toimplicate such as optics and biotechnology into the microsystems. The 8th International Micromachine/Nanotech
Symposium focuses on R & D in the new domain of"micro/nano fusion that will enable the realization of novel
functions and capacity.
This symposium has been planned by the organizing
committee (chairman: Professor Naomasa Nakajima, The
University of the Air), and by the program committee(chairman: Professor Hiroyuki Fujita, The University ofTokyo). Through these committees, the frame of program
were made and the guest speakers were nominated.
Furthermore, to fill up the content of the symposium andinternational points of view, an advisory board has beenorganized by nine European and American chief delegates of
the 8th world Micromachine summit and we invited fiveforeign speakers.
The program consists of five sessions, and fourteen
speakers including nine Japanese and five foreigners givelectures. In Session 1, "Opening," a guest speech will begiven by the Director-General of the Manufacturing

Internet Home Page : http://www.mmc.or.jp/

Industries Bureau of METI, then Professor Isao Shimoyama,
The University of Tokyo presents special lecture entitled"Strategy towards Fusion of Nano and Micro Systems. This
lecture will provide participants valuable information about
technological strategies and future directions on "micro/nanofusion domain."In Session 2, "The Path to New Industries in the 21stCentury," will feature the following five lectures.
1. International Standardization of MEMS
2. Standardization of Tensile Testing Methods for Thin
Film Materials - Round Robin Testing of Thin Film
Specimen 3. MEMS in China, Especially in Shanghai Area
4. MMC's Initiatives towards Foundry Service Network
5. The Sensibility of Scaling Recognition
In the third lecture, Prof. Yilong Hao of Peking University
talks the MEMS industry in China, which has been making
significant progress in the Shanghai area.
The fifth lecture, "The Sensibility of Scaling Recognition"in Micro/Nano machine design" will be presented by Prof.
Kazuo Kawasaki of Nagoya City University Medical School,
who has been honored with several good design awards inthe field of industrial design, both in Japan, and foreigncountries such as U.S.A., France and Germany.
For Session 3, "Innovative R & D," we prepares four
lectures to introduce the latest innovative R & D, from whichsignificant future evolutions are anticipated.
1. Creation of Biochips Aiming at Highly Medical
Treatment
2. Micro-fluidics for Pre-process of Dioxin Measurement
3. Advanced MEMS Research in US
4. Nanoscale Light Manipulation
The fourth lecture, "Nanoscale Light Manipulation," will
be presented by Prof. Laurens Kuipers of the University ofTwente MESA + Research Institute, the Netherlands, who
researches on advanced photonics structures. Based on his
research on how to make the low dimensional photonic
crystal and optical phenomena of the crystal, Prof. Kuipers
aims at developing new devices for optical communications
and high-speed computers.
In Session 4, "National Strategy for Micro/nano Fusion

will look at French approaches and strategies in the fusion of
micromachine technology and nanotechnology.

Domain," prepares following four lectures.
1. Strategy to Enhance the Application of Micro@nanoTechnology in France
2. Practice Collaboration between Industry andAcademia in Micro/nano System Technology
3. Bio Nano Technology in the 21st Century: CELLOMIX
4. National Strategy on NEMS/MEMS in France

The 13th Micromachine Exhibition will be held on the
ground floor of the Science Museum from November 13(Wednesday) to November 15 (Friday), 2002 and willfeature a diversity of products by micromachine-relatedindustries, universities and institutions. We believe that thismicromachine exhibition and the symposium will provide agood opportunity for participants to obtain a clear andcomprehensive image on what are cutting-edge
micromachine technologies, and we recommend allparticipants to visit the events to enable you to see actual
micromachines in action. Symposium participants can bepermitted free admission to the micromachine exhibition bysimply showing their participation cards.

In the first lecture, "Strategy to Enhance the Applicationof Micro@nano-Technology in France," Dr. Dirk Beernaert of
EURIMUS (Eureka Industrial Initiative for Microsystem's
Users), will talk the aspects of Integrated Project for the EU
6th Framework Programme such as the project's objectives
and policies, and its development of MEMS products.
The fourth lecture, "National Strategy on NEMS/MEMS in
France," will be presented by Dr. Constant Axelrad, a Scientific
Advisor at CEA-LETI in Grenoble, France, and actively
involved with France's Micro/nanotechnology Innovation
Center and NEXUS. As the title suggests, Dr. Axelrad's lecture

The deadline for applications to attend the symposium is
October 31, 2002. but if seats are available, applications will
be accepted on the day of the symposium.

❉❉❉❉❉❉❉❉❉❉❉❉❉❉❉❉❉❉ PROGRAM (Tentative) ❉❉❉❉❉❉❉❉❉❉❉❉❉❉❉❉❉❉
As of October 11, 2002
9:00 --

Registration

Session 1 : Opening

Chairman : Mr. T. HIRANO

9:30 -- 9:35

Opening Remarks

9:35 -- 9:40

Guest Speech

Mr. Toshiro SHIMOYAMA, Chairman, Micromachine Center

9:40 -- 10:20

Special Guest Speech: Strategy towards Fusion of Nano and Micro Systems

Director-General,Manufacturing Industries Bureau, METI
Prof. Isao SHIMOYAMA, The University of Tokyo

Session 2 : The Path to New Industries in the 21st Century

Chairman : Prof. H..FUJITA

10:20 -- 10:45

International Standardization of MEMS

10:45 -- 11:10

Standardization of Tensile Testing Method for Thin Film Material - Round Robin Test of Thin Film Specimen -Dr. Kuniki OHWADA, International Standardization Engineering Laboratory

11:10 -- 11:35

MEMS in China, Especially in Shanghai Area

11:35 -- 12:00

MMC’s Initiative towards Foundry Service Network

12:00 -- 13:00❋❋❋❋❋❋❋❋ Lunch ❋❋❋❋❋❋❋❋

13:00 -- 13:30

The Sensibility of Scaling Recognition

Toshiyuki TSUCHIYA, Toyota Central R&D LABS INC
Prof. Yilong HAO, Peking University
Mr. Takashi MIHARA, Foundry Service Industry Committee
Prof. Kazuo KAWASAKI, Nagoya City University Medical School

Session 3 : Innovative R & D

Chairman : Prof. K. .IKUTA

13:30 -- 14:00

Creation of Biochips Aiming at Highly Medical Treatment

14:00 -- 14:30

Micro-fluidics for pre-process of Dioxin Measurement

14:30 -- 15:00

Top Down and Bottom Up Approaches to Bio Nano Technology

15:00 -- 15:30

Nanoscale Light Manipulation

15:30 -- 16:00❋❋❋❋❋❋❋❋ Break ❋❋❋❋❋❋❋❋

Prof. Yasuhiro HORIIKE, The University of Tokyo
Dr. Ryo MIYAKE, Hitachi Ltd.
Dr. Jennifer Gaudioso, Sandia National Laboratory
Prof. Laurens KUIPERS, University of Twente

Session 4 : National Strategy for Micro/Nano Fusion domain

Chairman : Prof. I. SHIIMOYAMA

16:00 -- 16:30

Strategy to enhance the application of micro @ nano-technology in France

16:30 -- 17:00

Practice Collaboration between Industry and Academia in Micro-Nano System Technology

Dr. Dirk BEERNAERT, European Commission

17:00 -- 17:30

Bio Nano Technology in 21st Century, CELLOMIX

17:30 -- 18:00

National Strategy on NEMS/MEMS in France

Prof. Susumu SUGIYAMA, Ritsumeikan University
Prof. Teruo OKANO, Tokyo Women’s Medical University
Dr. Constant AXELRAD, CEA-LETI

Session 5 : Closing
18:00 -- 18:10

Closing speech

Mr. Takayuki HIRANO, Executive Director, Micromachine Center

2

The 2nd Workshop on Standardization forMicromachines / MST / MEMS in Tokyo
During the morning session, the workshop reviewed
activities following the 1 st Workshop, including
standardization activities in the U.S., Germany, and Japan,
and discussed future activities leading up to the 3rdWorkshop. Dr. Kuniki Owada, joined as a special
participant in this workshop, reported that a technicalreport issued by the Micromachine Center in 1998 called"Technical Terms in Micromachine Technology" (220words) had been proposed to the IEC/TC47. Serving as amember of the IEC/TC47/WG4, Dr. Owada had worked on
this proposal under commission by the Japanese Industrial
Standards Committee. Takashima, Associate professor ofTokyo Institute of Technology, presented the developmentof a fatigue testing machine and results of fatigue tests
conducted on cantilever type specimens. The
Micromachine Center has proposed this machine to the
METI as an item for standardization to follow the thin film
tensile tests.
In the afternoon session they had presentations anddiscussions on RRT performed under the NEDO projectcalled "standardization of evaluation method of properties
for micromachine materials" which developed original
testing machines for thin film materials and standard
specimen of these materials ended in March last year.
A total of twenty-four people participated, including
above workshop members and representatives from three
universities, three makers, and the National Institute of
AIST (Advanced Industrial Science and Technology) who
involved in RRT, as well as the Japanese Standards
Association, which is preparing international
standardization of RRT. The participants agreed tosupport activities related to IEC terminology and tosupport such projects as world RRT proposed by U.S.
delegate on thin film residual stress tests. They concluded
to hold the 3rd Workshop on Standardization at NIST in
Washington, U.S.A. in March 2003.

In addition to performing advanced research,
Micromachine Center is working to achieve international
standardization. So far the Micromachine Center has beenstudied in two areas: One is to establish unified technicalterminology able to commonly use among various fields,
because the micromachine is multidisciplinary system.
And the other is "Standardization of measurement andevaluation methods of Micromachine" to compare thefunctions of newly developed micro-devices.
Micromachine Center summarized these studies intechnical reports. And the Center aims to propose thesereports as international standard to internationalorganization as contributions from Japan to the world. For
achieving these and the international harmonization,
Micromachine Center established on-line International
Standardization Forum that exchanges opinions over theinter-net and is operating since 1998. The Forumoccasionally hold face-to-face meeting such as the 2nd
Workshop on Standardization held recently in Tokyo.
The 2nd Workshop on Standardization for Micromachine /MST / MEMS was held at Tokyo Metropolitan Small Business
Promotion Agency on July 23, 2002, with Hisayoshi Sato,
Professor of Chuo University, serving as chairperson.
The 2 nd Workshop was scheduled to be held in
Washington D.C. in October 2001, according to theagreement at the 1st Workshop on Standardization held in
London in March 2001. However, this Workshop was
postponed due to the terrorist attacks that occurred in
New York and Washington D.C. on September 11, justprior to this date. It was decided that the 2nd Workshop
on Standardization would be held in Tokyo in conjunction
with presentations regarding RRT (Round Robin Test) on
thin film specimens, which is planning to propose tointernational organization as world standards byMicromachine Center. Thirteen people, including four
from overseas, joined in this workshop.

The 2nd Workshop on Standardization forMicromachine/MST/MEMS

3Submitting MMC Technical Reports
on Terminology to the IEC
October 4 on whether or not to adopt this proposal. If
the proposal is adopted at this time, then the issue will
be offered up for a discussion on international
standards. However, the proposal has many hurdles toovercome before it can finally be standardized.

While the Micromachine Center was carrying out
R&D on Micromachine Technology under METI's
Industrial Science and Technology Frontier Program
over a ten-year period, it also stressed thestandardization of terminology and measurement
evaluation, even at the research stage. Accordingly,
the Center organized working groups for measurement
evaluation and terminology under the Committee on
Micromachine Standardization (chairman: Hisayoshi
Sato, Professor of Chuo University) and conductedstudies on these topics. The results were compiled intechnical reports that have been published. For
terminology, definitions were confirmed in English andJapanese for 220 terms. The Micromachine Center led
discussions on this glossary at an online International
Standardization Forum, while publishing the glossary
on its home page and collecting comments regarding
its contents.

Through these achievements, however, thestandardization activities of the Center have enteredan international phase, thereby achieving one
milestone. In keeping with this, tensile testing
methods for thin films conducted under commission of
NEDO have entered a stage this fiscal year in which astandardization proposal will be created with thesupport of the Japanese Standards Association.
The following is the list of the committee members(at the time of the committee activities) who
contributed to developing the terminology.

After it was determined that nearly all opinions had
been collected, the Center received approval from the
WG for terminology to submit the glossary formally to
the IEC. The Center also formally submitted theglossary to the IEC/TC47/WG4 after receiving approval
from a domestic committee (JEITA) on TC47
(semiconductor devices).

ChairmanNobuyuki Moronuki (Tokyo Metropolitan
University Graduate School)

Members

Nobuyuki Kabei (Saitama Cardiovascular
and Respiratory Center)
Masaaki Ikeda (OMRON CORP.)
Koichi Suzumori (TOSHIBA CORP.)
Hiromu Narumiya (MITSUBISHIELECRIC CORP.)
Takefumi Kabashima (YASKAWA
ELECTRIC CORPORATION)

The copy below shows a letter from the IEC
notifying all countries on July 5 of Japan's proposal
regarding terminology and definitions. As shown by
the notifications, P- members are urged to vote by

47/1644/N P
NEW WORK ITEM PROPOSALClassification according to IEC Directives Supplement,
Table 1

A3

Proposer

Date of proposalJapan

2002-07

TC/SC

Secretariat

47

Korea

Date of circulation

Closing date for voting

2002-07-05

2002-10-04

A proposal for a new work item within the scope of an existing technical committee or subcommittee shall be submitted to theCentral Office. The proposal will be distributed to the P-members of the technical committee or subcommittee for voting, and to theO-members for information. The proposer may be a National Committee of the IEC, the secretariat itself, another technicalcommittee or subcommittee, an organization in liaison, the Standardization Management Board or one of the advisor ycommittees, or the General Secretary. Guidelines for proposing and justifying a new work item are given in ISO/IEC Directives,
Part 1, Annex C (see extract overleaf). This form is not to be used for amendments or revisions to existing publications.
The proposal (to be completed by the proposer)
Title of proposal

IEC 60747 : Semiconductor devices ---- Par t XX-1 : Micro electromechanical devices ---Terms and definitions
Standard

Technical Specification

Scope (as defined in ISO/IEC Directives, Part2, 6.2.1)

To provide

terms and definitions of microelectronic mechanical devices.

Purpose and justification, including the market relevance and relationship to Safety(Guide 104), EMC(Guide 107),
Environmental aspects(Guide 109) and Quality assurance(Guide 102).(attach a separate page as annex, if necessary)In the field of micro electro-mechanical devices, many technology areas are included such as,
electronics, mechanical engineering, chemistry and biology. it is desirable to construct glossary for
micro electromechanical devices for convenience of end-users of the devices.

4

TOPICS

IWMF 2002 Held in the U.S.A.
the ISTF Program. The mini-factory is configured ofhandling modules arranged around a conveying plate. For
conveying, a two-dimensional planar motor with a wire isused for power supply. However, the positioning precision
is ± 20 µm, which is equivalent to that in the micro-factoryof the ISTF Program using a stopper, and a precision of
200 nm is achieved when using a magnetic sensor. Each
module is provided with a controller using distributed
JAVA, which is advantageous for its suitability in an
Internet environment through the use of Ethernet.
Designing tools have been developed for designing thesystem. Research is currently being conducted on asystem using a micro fluidic injection module. There is aplan to develop a system for assembling laser diodes ofdifferent specifications by 2004.
As a new venture, France's Laboratoire d'Automatiquede Besançon is researching a proposed concept on plugand-play devices called microrobots on chip. While theresearch is aimed at developing an inexpensive highresolution device that is compact and can be used
immediately, research to date has focused on mounting a
two degrees-of-freedom gripper on a SmartCard Reader
and verifying its functions. The laboratory is also studying
a linking construction for accurately positioning an end
effector. Manipulation by sensors is apparently not
performed in order to protect the object being
manipulated.
At this workshop, there were a lot of presentations on
measurement and evaluation technology in particular,such as a study on capturing the shape of objects based on
CAD data and methods for taking wide images using
multiple cameras.
The 4 th IWMF has been scheduled for Shanghai in
September 2004.

The 3 rd International Workshop on Microfactories(IWMF) was held at the University of Minnesota,
Minneapolis, through the joint sponsorship of Carnegie
Mellon University and the University of Minnesota, forthree days, September 16 through 18, 2002,.
The former Mechanical Engineering Laboratory of the
Agency of Industrial Science and Technology took the
initiative to hold the 1st IWMF in December 1998. In
October 2000, the 2nd IWMF was held in Switzerland.
The program at this year's workshop included thefollowing sessions: (1) System Architectures for
Microfactories, (2) Micro Assembly Systems, (3) Micro
Assembly Techniques, (4) Micro Fabrication, (5) Micro
Fluidic Systems, (6) Micro Actuation and Sensing, and (7)Toward Nanofactories.
The breakdown in number of presentations given perregion had America with 8, Europe 9, Japan 5, and otherregions 2. Fifteen presentations were given in the poster
session.
The Japan side featured a presentation by Takayuki
Hirano, Executive Director of the Micromachine Center,entitled "Micromachine Technology Trends in
Microfactories," which covered the results of METI's
Industrial Science and Technology Frontier (ISTF)
Program, the fusing of micromachines withnanotechnology, and the like. In addition, the National
Institute of Advanced Industrial Science and Technology
presented several research findings.
Here, we will summarize some of the more memorable
parts of the presentations.
The Fraunhofer-Institute for Manufacturing
Engineering and Automation, (IPA Department for New
Applications) announced research findings on a "minifactory," similar to the micro-factory concept developed in5Members' Profiles

TOYOTA CENTRAL R&D
LABS., INC.
Toyota Central R&D Labs., Inc., in cooperation
with the Toyota Group and research organizations
throughout the world, carries out extensive researchon automobile-related technologies, electronics,
information and communications, functional materials,
biotechnology, and environmental technology.
Since its founding in 1960, Toyota Central R&D
Labs., Inc. has made many contributions to themicromachine field, developing the world's first strain
gauge that incorporates the piezoresistive effect ofsilicon and conducting research on such silicon
micromachining processes as silicon anistropic etching
and anodic bonding technologies to aid in the practicalutilization of pressure sensors and accelerometersdeveloped by Toyota Group companies. In recent
years, we have conducted research on a wide range of
device, circuit, design, process, and evaluation
technologies focusing on surface micromachining andsilicon integrated sensors.
In process technologies, research on surface
micromachining for the fabrication of microstructuresusing polysilicon, SiO2 thin films and SOI wafers havebeen conducted, which includes vapor etching ofsacrificial layers, surface coating and machining for
sticking prevention, fabrication formation of thin film
multilayer structures, and thin film vacuum
encapsulation . Fig. 1 is a vibrating gyroscope(angular rate sensor) formed of three layers ofpolysilicon thin films produced using the above
technologies. This 2-µm thick thin film structure is
supported on four beams over a vertical gap of 2µm, as
if floating in space. By inserting this type of sensor

Norikatsu Ishikawa
Director

structure in a micro-chamber having the same thinfilm structure, we produced a on-chip vacuum-sealed
angular rate sensor. This is the world's first sensor
that allows us to verify operations for detecting
angular rate .
In evaluation techniques, we have focused on
evaluating the mechanical properties of thin film
materials. We are developing such equipment as adevice for measuring the Young's modulus and internal
stress of a thin film membrane based on its pressuredeflection curve and a thin film tensile tester (Fig. 2)
with an electrostatic chucking system for evaluating
micro-sized specimens. We are also studying property
evaluations necessary for designing and evaluating thereliability of micromachine devices. Using thesetechnologies, we participated in a NEDO project called"the standardization of evaluation method of material
properties for micromachines" implemented by theMicromachine Center through the last fiscal year.
In the future, we would like to expand ourapplications based on surface micromachining
technologies to encompass micromachine devices
incorporating not only sensors, but also actuators andthe like.

Angular rate Oscillation

Chuck
Specimen

200µm

Upper electrode

Muss
Support beam
Drive electrode

10µm

Fig. 1 Polysilicon vibrating gyroscope

Fig. 2 Thin film tensile tester with electrostatic chucking system

6

NAGANO KEIKI CO., LTD.
1. The Challenge of Micromachine Technology
Pressure measurements designed to meet theneeds of various industries are important basic
technologies in any age. Nagano Keiki became involvedin this technology as a general manufacturer ofpressure measurement and control equipment by
developing pressure sensors using micromachinetechnology.
Shigeru Miyashita

2. Development of Micromachine Technology

President

To date, Nagano Keiki has developed hightemperature semiconductor pressure sensors using
epitaxial aluminum deposition through a commission
by the Japan Science and Technology Corporation,
integrated capacitance type pressure sensors throughjoint research with Tohoku University, and a highprecision wet etching technology.

an SOI strain gauge are superior in heat resistance andwith stand voltage and demonstrate high reliability insevere environments.

There are currently two types of pressure sensors
manufactured with our micromachining technology: acapacitive type and a SOI (silicon on insulator) strain
gauge type.

We have recently begun developing sensors for
microspaces designed to measure the physicalproperties (pressure, temperature, etc.) of microchemical plants formed on a glass substrate andanalyzing devices that fit in the palm of one's handcalled µ-TAS (micro-Total Analysis System).

3. Future Challenges

Nagano Keiki mass-produces a series of highly
sensitive, highly durable pressure capacitive sensors
ranging from the micro-pressure of 25 Pa. In addition
to satisfying customer demands for sensors, we
produce other products that make use of highsensitivity and high-durability features, such as
differential pressure detecting leakage testers andmedical equipment that detects the behavior of infants
and issues an alert for abnormal breathing and thelike.

In addition to improved sensitivity and precision,
there will be future demand to further reduce the sizeand cost of sensors with increased performance. We
would like to increase the scope of nano andmicromachine technologies and aim toward creating
durable products.

Compared to diffusion type sensors, sensors using

7.4mm

Fig. 1 Applied products

Fig. 2 Pressure sensor device

7Worldwide R&D

Research on Technologies for Utilizing Miniature Device
Tokio Kitahara, Professor, Shonan Institute of Technology, Faculty of Engineering
Shonan Institute of Technology is a university with anengineering faculty (five departments) and a graduate school(three specializations) and approximately 2,500 students. I
am affiliated with the Mechanical Engineering department
and graduate school specialization. My laboratory deals withtechnologies for utilizing miniature mechanisms, which do
not require very large-scale equipment. We conduct researchon the element technologies of microfabrication machines,
high-speed lathing of microparts, micro generators, and thelike. Here, I will describe two of these research projects.

(1) Direct-driven device with built-in actuator
We are studying direct-driven devices driven by friction.
An actuator is integrated in the device for use in
microfabrication equipment. We have verified the usefulnessof these devices in a microlathe, which we developed earlier,and are currently analyzing the device properties in detail.
Fig. 1 shows the basic structure of the device, wherein
two piezoelectric elements intersect a slider. Fig. 2 shows
the results of an experiment for finding the relationshipbetween the surface pressure and velocity of the slider, whilevarying the slider's thrust. From this experiment, we
determined that thrust decreases the slider velocity, but aSlider(2) High-speed lathing of microparts
When microparts are processed on a normal lathe, thecutting speed decreases, increasing the roughness of theprocessing surface dramatically. In a lathe experiment using
a high-speed small-diameter spindle (manufactured by NSKLtd.), we proved the effects of increasing the speed of thespindle on improving the lathed surface.
Fig. 3 shows the condition of the surface of brass after
lathing the piece to a diameter of 100 µm. Deep striation andthe like observed when using a spindle rotational speed of 2 x
104 rpm did not appear when the speed was 16 x 104 rpm.
Fig. 4 shows the relationship between the rotational
speed of the spindle and the arithmetic average roughness(Ra) of the lathed surface. A remarkable improvement insurface roughness occurred at a rotational speed of 4 x 104
rpm (a lathing speed of 13 m/min) or greater, while a Ra
value of approximately 20 nm was obtained at 16 x 104 rpm.
These results indicate that microfabrication devices capableof achieving high spindle speeds are effective in improving
the processing surface.

Sliding guides

2104 rpm

16104 rpm

05[ µm ]

60

Thrust
0N
5N
10N

40

20

0
50

80

110

140

170

200

Slider surface pressure (kPa)

Fig. 2 Properties of the direct-driven device

5

10 [ µm ] 15
[ µm ]

0.00

1.12

1.72

Fig. 3 Topography of the lathed surface

Arithmetic average roughness Ra(nm)Slider velocity V (µm/s)

100010 [ µm ] 15

0.00

Fig. 1 Construction of a direct-driven device

0

0

5

5

[ µm ] 10[ µm ] 10

15

15

Piezoelectric elements

thrust of 10 N or less is possible when the slider surfacepressure is approximately 150 kPa.

120
Workpiece : brass
Lathing diameter : 100µm
80

40

0

0

4

8

12

16

20

Rotational speed n(104 rpm)

Fig. 4 Characteristics of high-speed lathing

MICROMACHINE No. 41
MICROMACHINE is published quarterly by Micromachine Center (MMC) to promote the international exchange of
information related to micromachines, R&D and other technical topics, and is circulated free of change. Please send
your comments about MICROMACHINE to the publisher :Takayuki Hirano, Executive Director, Micromachine Center (MMC)
MBR99 Bldg., 6F., 67 Kanda Sakumagashi, Chiyoda-ku, Tokyo 101-0026, Japan
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Editorial and Production Management : Japan Technical Information Service (JATIS)
Date of Issue : October 21, 2002

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