MMC Activities..............1
MEMS Pj .....................4
Column.......................6
Overseas Trends............7
Member’s Profiles .........8

MMC Activities

New Operation System of MMC
Keiichi Aoyagi, Executive Director of Micromachine Center
The Micromachine Center (MMC) is actively promoting technical development projects, sponsored primarily by
the Japanese government and the New Energy and Industrial Technology Development Organization (NEDO), in aneffort to establish a technical infrastructure in the micronano field that includes micromachines and MEMS. At thesame time, the MMC is also actively involved in activities to improve the environment for the industrialization of
micronano fields, such as policy proposal activities, industrial networking and incubating activities, research projects,
standardization projects, dissemination and publicity activities and so on, in order to promote the dissemination andindustrialization of these basic technologies. Through these activities, the MMC is working to assist in thedevelopment of Japanese industry and to contribute to the international community.
This basic approach will be continued in the new fiscal year as well, and the Micromachine Center will be involvedin a variety of projects.
In terms of national and NEDO projects, the MMC has submitted a proposal for the Bio ElectromechanicalAutonomous Nano Systems (BEANS) Manufacturing Technology Development Project (FY 2008 - 2012). In the eventthat the proposal is accepted, a concentrated research and development organization with several development
centers will be established for industry-academic collaboration, and the focus will be on establishing the technicalinfrastructure for the achievement of the third generation of MEMS (BEANS). In addition, this is the final year for theHighly Integrated / Complex MEMS (Fine MEMS) Manufacturing Technology Development Project (FY 2006 - 2008),
so the Micromachine Center will work to ensure maximum achievements for the project. Moreover, the Micromachine
Center is also concentrating on distribution and dissemination activities for the MEMS Open Network Engineering
System Design Tools (MemsONE) achieved in the MEMS Open Network Engineering System Design Tools Project(nicknamed the MemsONE Project), which concluded development in FY 2007.
In terms of activities to improve the environment for industrialization in the micronano field, the MEMS Industry
Forum established to conduct various activities to support industrial development has begun its third year. The
number of participating members continues to grow steadily, and the content of its activities continues to be more
fully developed. Exhibition Micromachine/MEMS is attracting more and more attendees each year. The Exhibition will
be held again this year at the end of July at Tokyo Big Sight, as part of MicroNano 2008 which also includes various
conferences. In addition, the Micromachine Center will promote many other activities this year, including theMicromachine Summit, various international interchanges, research activities that include MEMS market researchand technical trend surveys both at home and abroad, international standardization activities for the MEMS materials
and devices that are playing a leading role in various countries, and industrialization promotion activities that include
operation of the MEMS Foundry Network and opening of the MEMS Mall.
We are grateful for your continued understanding and support.

Internet Home Page : http://www.mmc.or.jp/

MMC Activities

Overview of FY 2008 Project Planning
I. Basic policy for project planning

2. MEMS Industry Forum Projects (policy proposal,
industry interchange and stimulation projects)

FY 2008 is the final year of the Highly Integrated / Complex
MEMS (Fine MEMS) Manufacturing Technology Development
Project, a three-year project that began in FY 2006. The goal forthis year will be to complete the project and ensure that its
goals have been achieved. As last year, efforts with regard to
the MEMS Open Network Engineering System Design Tools
Project (nicknamed the MemsONE Project), for whichdevelopment was concluded in March 2007, will focus on thecreation of a support organization and dissemination of the
project's achievements. Furthermore, a concentrated researchand development approach is > planned for the Bio-electro
mechanical Autonomous Nano Systems (BEANS) >development project, and a proposal has been submitted in the
open > competition for this project. With regard to activities toimprove the environment for industrialization, the focus will beon policy proposal activities for the MEMS Industry Forum andindustry interchange and stimulation projects. Moreover, as lastyear, an active effort will be made to promote research projects,
standardization promotion projects, dissemination and publicity
projects and so on.

The MEMS Industry Forum was established as a special
project committee whose goal is to support the further
development of MEMS industries and contribute to theinternational competitiveness of Japanese industry. Its
membership is made up primarily of companies in MEMSrelated industries. The Forum maintains ties with affiliatedacademies, regional centers and overseas institutions, and it
promotes the following activities:(1) Policy proposal activities(2) Industry-academia liaison activities(3) Establishment of infrastructure for MEMS development(4) Interchange activities for businesses in MEMS andother industries
Participation in the 14th World Micromachine Summit (to be held
April 30 - May 3 in Taejon, Korea), 14th International Micromachine/ Nanotech Symposium (to be held July 29 at the Tokyo Bay Ariake
Washingon Hotel, exhibition at the Hannover Messe etc.

3. Research Projects
Research will be conducted for the micromachine andMEMS technologies that are rapidly becoming key technologies
in manufacturing industries. Efforts will focus on accurately
determining technical and manufacturing trends and exploring
new technical issues in the domains in which these technologies
are fused with nanotechnology.
(1) Research aimed at strengthening manufacturing
centers for highly integrated MEMS
Even after the conclusion of the three-year Highly
Integrated / Complex MEMS Manufacturing Technology
Development Project that has been underway since 2006,
research that is based on policy proposals for FY 2009 will be
conducted so the achievements of the project can be quickly
and accurately applied to the manufacturing industry in Japan.
(2) Survey of technical trends both at home and abroad(3) Survey of industrial trends(4) Enhancement of micronano database

II. Major projects
1. National / NEDO projects
In order to establish a technical infrastructure formicromachines and MEMS, the Micromachine Center is actively
working to promote research and development projects
sponsored by the national government and the New Energy andIndustrial Technology Development Organization (NEDO),
harnessing the combined capabilities of industry, academia andgovernment. In FY 2008, the Center will promote the following
projects.
(1) Highly Integrated / Complex MEMS (Fine MEMS)
Manufacturing Technology Development Project(NEDO project)
The project was initiated in FY 2006 as a national
government / NEDO project. In this, the final year of the
project, the Center will continue working on and will strive tocomplete a database of highly integrated / complex MEMS
knowledge that collects, organizes and compiles knowledge
information relating to the three development categories of the
project: (1) complex technologies to implement MEMS /nanofunctions (2) integrated construction with semiconductor
chips (3) methods to connect MEMS components in a highly
integrated manner.

4. Activities to promote standardization
Standardization projects in micromachine and MEMS
technology fields will be promoted concurrently withinternational initiatives.
(1) Research and development in the area of standards
certification for the purpose of proposinginternational standards(2) Follow-up regarding proposed standards for thin film
material fatigue test methods(3) Study of overseas standards(4) Adoption of thin film material tensile test method
standard as a JIS standard(2) Promotion and dissemination of MemsONEIn FY 2008, the Micromachine Center will operate theMemsONE Support Center established in cooperation with
software vendors based on the dissemination infrastructure
created during the previous fiscal year. The Center will also
promote MemsONE dissemination activities. Specifically, theacademic version of MemsONE will be distributed touniversities and research institutions, and energetic efforts will
be made to promote dissemination through user groups,
seminars for showing examples of use, training sessions andother user support activities and promotional activities.

5. Dissemination and publicity projects
Efforts will be made to promote wide-ranging disseminationand educate the general public regarding micromachines andMEMS by publishing and distributing a journal, holding
exhibitions and so on.
(1) Use of website to disseminate information andstrengthen ties
(2) Publication of MicroNano Journal(3) Publication of monthly news bulletins(4) Provision of information, etc. through the“MicroNano Express” newsletter(5) Upgrading of reference room including database ofreference abstracts(6) Holding of Exhibition Micromachine/MEMS &Nanotechnologies
The 19th Exhibition Micromachine/MEMS & Nanotechnologies
will be held at Tokyo Big Sight as part of MicroNano 2008. Plans
called for the trade show to be held July 30 - August 1.

(3) Proposal for “Bio & Electro-mechanical Autonomous
Nano Systems (BEANS) Manufacturing Technology
Development Project” (METI Project)
A proposal will be submitted in the open competition for the
research and development project entitled “Bio & Electromechanical Autonomous Nano Systems (BEANS)
Manufacturing Technology Development Project” to be initiatedin FY 2008 by the Ministry of Economy, Trade and Industry. If
the proposal is accepted, the project will be implemented using
a concentrated research and development approach.

2

MemsONE Ver. 1.0 Release
MEMS System Development Center
The MEMS-ONE Project was completed in FY 2006,
and in FY 2007 the “MEMS-ONE Project Achievement
Dissemination Project (hereafter “Project”)” wascommissioned by the New Energy and Industrial
Technology Development Organization (NEDO) . In
this Project, a beta version of MemsOne (achieved in
the MEMS-ONE project) was distributed, and activities
that included user support, function improvement /upgrading and study regarding dissemination wereconducted. The Project issued more than 450
distribution licenses for the beta version and morethan 200 persons attended user support seminars.
This made a major contribution to the establishment ofa functional infrastructure for MemsONE as well as tothe achievement of dissemination and publicity
objectives.
Development of a commercial version was pursued
concurrently with the Project, and MemsONE Ver. 1.0
was released in mid-February 2008. MemsONE Ver.
1.0 represents an advanced function version of the
program and reflects approximately 90% of thefunctional improvements and upgrades to the beta
version that were achieved by the Project.
Two versions of MemsONE have been prepared: anenterprise version for general company use and an
academic version for universities and research
institutions. The enterprise version will be marketedby software vendors and the academic version will be
distributed by the Micromachine Center. The detailed
product configuration is shown below.

@ Academic version
The academic version is designed for universities
and research institutions. There are two editions: a
research edition and a classroom edition. (Both werereleased starting in mid-March.)– Research edition (for researchers)

This edition contains the full set of professionaluse functions, subject to the following restrictions.
– Licensed period of use: 1 year (upgraded annually)– Conditions for use: comes with an obligation to provide
knowledge data, teach seminars, etc.
– Classroom edition (for teaching use)

This edition contains the full set of entry-level
functions, subject to the following restrictions.
– Licensed period of use: 4 years or 1 year
(two types: 30 licenses per classroom and 50 licenses /classroom)

As the organization for future support, a MemsONE
Support Center will be established within theMicromachine Center, and the Micromachine Center
will work with three software vendors to pursue
dissemination activities. Major releases will be issued
annually. Version 1.1 (representing the achievements ofthis Project) is scheduled for release in May, andVersion 2.0 is scheduled for release in January of nextyear.

MemsONE Operation (Support Organization)(1) Mechanical simulator(2) Process simulator<Software upgrades>

Software vendors(3) Wet etching simulator(4) Inverse process analysis(marketingof enterprise version)<System operation and support><Updating of knowledge / materials
and process database><Provision of knowledge /materials and process data>

Support Center

Universities, AIST etc.

(within Micromachine Center)(distributionof academic version)

Foundry companies
Device development companies

Users(5) Nano imprint simulator
Outside analysis
software(plugins)(6) MEMS circuit simulator

Framework
Advanced functional
analysis software, etc.

Enterprise version

Knowledge /materials
database

Foundry companies / users
Design houses
Engineers from many fields etc.

MEMS design / analysis support system
MemsONE@ Enterprise version

Academic version

The enterprise version is designed for generalcompany use. There are two editions: a professional
edition and an entry-level edition. (Both were released
starting in mid-February.)(development / provision
Third parties of outside software)
University researchers, software vendors, companies,
government and NEDO professionals etc.

University researchers and students
Researchers at research institutions
together with
Individual user
database creation

MemsONE Support Organization– Professional edition (for actual use)

This edition is designed for real-world use andhas no functional limitations. It comprises the basic
product set ((1) - (3)) as well as the separate
products ((1) - (6)).

For details regarding MemsONE Ver. 1.0, see thefollowing website:
http://mmc.la.coocan.jp/memsone/hiroba/ver1_info/– Entry-level edition (for functional evaluation)

This is a low-cost edition provided for functional
evaluation purposes, with some limitations on thenumber of nodes and so on. It comprises only theseparate products ((1) - (6)).

For inquiries regarding MemsONE, please contact
the MemsONE Support Center:
TEL(+81) 3-5835-1870
Email mems1-user@mmc.or.jp

3

Fine MEMS Project

Compiling of a Knowledge Databaseand Development of an Integrated Design Platform
Final Project Year
FY 2008 will be the final year of the Fine MEMS Project that began in FY 2006. Steady achievements are being
realized in each research and development topic. The Micromachine Center will place particular emphasis on thefollowing three topics in order to establish various types of manufacturing technology infrastructure to achieve thesecond generation of what are referred to as highly integrated and complex MEMS.
The first task is the creation of a fine MEMS knowledge database (Fig. 1). A server has been set up within theMicromachine Center, and a database system in MediaWiki format has been completed on the Internet. This database
will ultimately contain more than 1,000 case studies of knowledge data; as a result of steady progress in registering
data, the database already contains many items. In order to both increase data quantity and improve the quality of thedata, new functions have been provided, such as the ability to vote for registered case studies, rankings for individual
keywords, identification of case studies recommended by committee chairman Shimoyama and so on. Moreover, toimprove usability, a search function and improved patent information have been provided. Currently users of thisdatabase system are limited to researchers that have registered with the Project. During this fiscal year, however, ageneral user interface will be provided and integration with the MemsONE knowledge database will be conducted in
anticipation of the opening of the database to the general public following the end of the project.

Project achievements

Latest informationfrom academic societies, etc.

Following conclusion of project :To fine MEMS
knowledge database

Research & development
members- Opened to the general public
on the Internet- Integrated with MemsONE
MemsONEknowledge database

Research & development
members

Liaision

People can freely post and view comments on the Wiki using their web browsers.
Collaboration tools allow visitors to freely add to articles.

Processes
DevicesMaterials
AnalysisFig. 1

Secondly, with regard to the “Research & Development of Integrated Design Platform for Fine MEMS” that began
in the previous fiscal year, an equivalent circuit model – an integrated platform for MEMS and electronic circuits –was developed and then used to model various devices. In addition, a web library that allows people to view thesemodels over the Internet was developed and the device models, etc. were placed in this library. Based on theseachievements, development during this fiscal year will focus on providing greater versatility and making it easy for
MEMS and electronic circuit engineers to conduct design. Efforts will focus on the following three points:4

1)

Enhance device models through the use of MEMS equivalent circuit model, which is usefulwhen integrating MEMS with one another, in order to construct a fine MEMS equivalentcircuit model that can connect MEMS devices to one another and support high integration.

2)

Build a collaborative environment between the circuit simulator and the web library system(created to develop functions to extract electrical properties and mechanical properties) inorder to develop a function for extracting the electrical properties of MEMS devices and themechanical properties of the moving parts of MEMS devices.

3)

Develop mutual transformation of equivalent circuit models and three-dimensional CAD
models to enable mutual transformation of the shape data and material property values of
equivalent circuit models and three-dimensional CAD models.

1. Development of a systematized design platform using equivalent circuit models as an integrated
design method that can accommodate the increase in complexity and integration of MEMS
structures and different materials
2. Dramatic reduction of the time required for the practical application of fine MEMS, further
stimulating and ensuring the international competitiveness of the Japanese MEMS market

Study of individual
element models and MEMS
structural element models

Gathering andregistration of MEMS
equivalent circuits

Creation of fine MEMS
circuit models

Web library of MEMS equivalent circuits

Equivalent circuit data
(device structure, equivalent circuit diagram, Net List Data)

Viewable by users

Study of collaboration between
CAD and circuits

Net List Data
///
GHDE

Accommodation offine MEMS

Explanation and instructions for individual element
models and MEMS structural element models(model expression, element diagrams)

Fig. 2 Development of fine MEMS systemized design platform

Lastly, the Micromachine Center has been contracted to assist in the overall operation and management of the fine
MEMS project. The Center holds meetings of the Project Promotion Liaison Committee (four times a year),
Knowledge Database Committee (six times a year) and Platform Study Committee (four times a year). These
committees contribute to the smooth promotion of the project and dissemination of project achievements. In FY
2007, exhibits were displayed at the International Exhibition Micromachine / MEMS and Nanotech 2008. Moreover, aproject interim achievements briefing was held in July to present the latest achievements to the many attendees.
Exhibiting at International Exhibition Micromachine / MEMS and the holding of an interim achievements briefing areplanned for this fiscal year as well.
The final year of the project promises to be filled with activity and we look forward to the results.

5Column

Expectations for the New BEANS Project
Hiroyuki Fujita, Professor, Institute of Industrial Science, the University of Tokyo
With microsensors now being widely used in gamemachine controllers and image stabilizers for cameras,
among other applications, consumers are beginning toappreciate the true value of sensors as they are able toplay TV games using gestures and body movements
and can produce sharp photographs even when thecamera moves slightly. While the same consumers
might not fully understand that advances in MEMS
technology are responsible for these sensors, we
MEMS engineers are inwardly proud. Such advances in
MEMS products directly help secure and expand our
future areas of activity, making it particularly
satisfying to see our efforts in development finallybegin to bear fruit.
Already 20 years have elapsed since surface
micromachining was developed in the late 1980s andsince we were first amazed to see micro-gears andmicro-turbines rotating on silicon chips. Through thedevelopment of many advanced process technologies
during that time, including wafer bonding and deep
reactive-ion etching (DRIE), microstructures can now
be freely created and moved with precision. By
devising various micromachining techniques adapted
to CMOS circuitry and by incorporating electronic
circuits on chips, we have added such advanced
functions as temperature and sensitivity correction,
self-diagnoses, and various data processing functions.
We have accumulated much data on reliability andbettered our knowledge in packaging and other areasof industrial science through earlier achievements
made in automotive pressure sensors andaccelerometers and in projectors employing movablemicro-mirror arrays.
Since the Micromachine Technology Project
conducted from 1990 to 2000, Japan has supported
technological development primarily at the corporate
level through the MEMS Foundry Project, and the
MEMS Open Network Engineering System of Design
Tools (MemsONE) Project. Currently underway is thefineMEMS Project targeting highly integrated, complex
MEMS. This foundation of progress has allowed us tomake rapid advances in commercialization.
From another perspective, MEMS technology on
the micro-scale has reached a high level of maturity,
entering the domain of competitive development due
to its direct link to commercialization. While it will benecessary to further enhance existing technologies
and expand the product lineup in commercially viable
fields, such as sensors, information andtelecommunications, and optics, new fabrication
techniques must also be created to prepare for future
growth outside of these fields. By merging
micromachining based on a typical top-down approachwith nanotechnology or biotechnology based on abottom-up approach, manufacturing processes for
MEMS can be developed under unprecedented
concepts. We anticipate that these process
technologies could be used to produce products
having such functions as biosensors for biologicalmeasurements, treatment, and diagnoses, efficientenergy conversion based on nanostructures, andnetwork-based measurements of extensive
environmental data, which projects are anticipated tohelp resolve national and social issues faced in the 21st

century, including issues in health care and welfare,the environment and energy, and safety and security.
From this point of view, the BEANS (BioElectromechanical Autonomous Nano Systems)
Project proposed by METI is aimed at researching
manufacturing technologies required to create
innovative devices through the integration of microand nanofunctions. The basic plan calls for developing
processes enabling the fusion of biomaterials andorganic matter, the formation of 3D nanostructures,and the continuous large-area manufacturing of micronano structures, and for constructing related
knowledge databases. Research on processes for
merging biomaterials and organic matter will involve
harnessing the unique capabilities of biomaterials andorganic matter, such as molecular recognition and selfassembly, and selectively adding these capabilities tosilicon structures. These processes are expected to
produce devices that can be adapted to organisms andoperate stably therein for a long period of time, andstructures employing nanopores or nanopillars toachieve cell culture and high-sensitivity sensing.
Processes for forming 3D nanostructures include a
process for creating smooth nanostructures with nointernal flaws at the atomic level, and a process foruniformly coating the surfaces of or gaps innanostructures with a functional film. Sincenanostructures and nanoparticles exhibit properties
unique to the quantum effect, such as good
photoelectric energy conversion not found in bulk
materials, they are thought to be useful in ultra-small
devices capable of generating power efficiently, among
other applications. Finally, research on processes forthe continuous large-area manufacturing of micro- andnanostructures is aimed at finding a process to create
devices inexpensively on large substrates using
printing or embossing techniques rather than asemiconductor process, which, although capable ofunrestricted 3D micromachining, is expensive and can
only be performed on substrates of a limited size. This
process should allow us to manufacture devices
continuously over thin, soft substrates, much like aprinting press can print newspapers quickly and inhigh volume.
Just as R&D on MEMS manufacturing techniques
began some 20 years ago, the BEANS Project is being
initiated with the goal of developing new processing
techniques that will prove useful 20 or 30 years fromnow. Already we are anticipating with pleasure how
consumers will come to appreciate the true value of
devices developed from the fruits of this project.
Rapid expansionof applications

Rapid product expansion
CMOS

Large-area
DRIE
Wafer bonding

BiotechNanotech

Semiconductor
processes
Mechanicalprocesses

Micromachining
MEMS

1990

6

Highlyintegrated
MEMS

2000

BEANS
2010

Overseas Trends

Hannover Messe 2008 (April 21 – 25)
A MEMS Industry Forum exhibit will be included in the Hannover Messe Microtechnology Fair to be held April 21 –
25 (Monday – Friday), 2008 in Hannover, Germany. The exhibit will be presented through the cooperation of Omron
Corporation, Olympus Corporation, Matsushita Electric Works, Ltd. and the University of Tokyo Shimoyama Lab.
The Hannover Messe is said to be the world's largest industrial sample fair. Each year the event attracts around
5,000 exhibiting companies from more than 65 countries, as well as 200,000 visitors and 3,000 media representatives.
This year, Japan is the official Partner Country for the Messe, and more than 100 Japanese firms (double the usual
number) will participate as exhibitors. Many visitors from political and economic circles in Japan will also attend theevent.
The Microtechnology Fair is a trade show for applications of micro/nano technology and is sponsored by iVAM, theoverseas affiliate of the MEMS Industry Council. The Council participates in this trade show as part of its overseas
business liaison activities. This year marks the third time that the Council will provide an exhibit, and through thecooperation of these companies “The Activities of the MEMS Industry Forum” will be presented in terms of thepromotion of Japanese industry, support for industrialization, market development and so on. The Council will also
promote the MicroNano 2008 exhibition to be held in July.
Moreover, a Japan Day is scheduled for the forums to be held during the Messe in conjunction with the fair.
Director Aoyanagi, executive director of the Micromachine Center, will give the opening address. Eight presentations
will be held by Olympus Corporation, Mr. Matsumoto, Matsushita Electric Works, Ltd., Mr. Okamoto, Mitsubishi
Electric Corporation, Mr. Yoshida, Professor Suga of Tokyo University, the National Institute of Advanced Industrial
Science and Technology (AIST), Mr. Maeda, Mr. Takahashi, the New Energy and Industrial Technology Development
Organization (NEDO), Mr. Watanabe and the Micromachine Center MEMS Industry Forum.
In addition, the following events will be held jointly with the Partner Country, Japan:• Japan – Germany Business Summit (April 21)• Japan – Day MicroTechnology (April 22)• Mobile Robots & Autonomous Systems / German – Japanese Robotics Forum (April 22)• German – Japanese Photovoltaic Forum (April 24)• German – Japanese Roadmap Symposium (April 22)• Business establishment and personnel recruitment in Japan (April 24)• Premium Market Japan (April 22)

Left: Hannover Messe venue

Right: Explanations and business consultations at booths

7Members’ Profiles

Mesago Messe Frankfurt
1. Overview
Mesago Messe Frankfurt Corporation is theJapanese affiliate of Messe Frankfurt, a company thatorganizes international trade fairs. Germany is thecountry in which the most trade fairs (messe) are held,
and Messe Frankfurt was the first trade fair organizer inGermany to expand operations globally to othercountries. Messe Frankfurt is currently the second
largest organizer of trade fairs, and together with its
affiliates holds more than 100 trade fairs each year invarious locations around the world including Europe,Asia, North America, South and Central America, theMiddle East and Russia.
Since its establishment in 1987, the Japaneseaffiliate has conducted promotional activities for the
trade fairs held in various parts of the world. Mesago
Messe Frankfurt has also sponsored and operated international specialized trade fairs in Japan as well,
utilizing the international network of the group that covers more than 100 countries throughout the world.
All of these industrial trade fairs have been key events for the industry, exhibiting both state-of-the-art
technologies and up-to-date information and providing a business platform for many industry participants.
2. International Exhibition Micromachine/MEMS: Growing along with the Rapid Advances in the
MEMS Industry
Exhibition Micromachine/MEMS sponsored by the Micromachine Center is held annually. Its purpose isto present practical applications for the micromachines and MEMS technologies that are fast becoming key
technologies for industry, as well as to distribute products, strengthen ties among industry, academia andgovernment, and promote technology exchanges at home and abroad. The Exhibition has a long history; it
was first held in 1990, making this its 19th year. Mesago Messe Frankfurt has contributed to the growth of the
Exhibition since the very beginning. At the outset, the Exhibition served as the venue for presentations on
research and development topics by some 40 universities, research organizations and companies. In the past
few years, the event has continued to increase in scale each year, propelled by the growth of the MEMS
industry. The previous Exhibition was held in July 2007 and attracted 362 companies and organizations and12,424 visitors. It is now widely recognized as one of the world's largest MEMS related international
exhibitions.
The growth of Exhibition Micromachine/MEMS has resulted both in progress in MEMS technologies andexpanded needs. There is a clear sense that the MEMS
market is one that will attract more and more attention
from the general public from now on.
Exhibition Micromachine/MEMS is the only
exhibition in Japan devoted solely to MEMS. The
Exhibition will continue to provide companies involved
with MEMS with the ideal business platform forcommunicating and acquiring up-to-date information.
Through its sponsorship and operation of the
Exhibition, Mesago Messe Frankfurt will continue
working to achieve its goal of connecting industry
participants with business opportunities and helping tocontribute to the growth of the MEMS industry.
MICRONANO No. 63
MICRONANO is published quarterly by Micromachine Center (MMC) to promote the international exchange of
information related to micromachines, R&D and other technical topics, and is circulated free of change. Please send
your comments about MICRONANO to the publisher :Keiichi Aoyagi, Executive Director, Micromachine Center (MMC)
MBR99 Bldg., 6F., 67 Kanda Sakumagashi, Chiyoda-ku, Tokyo 101-0026, Japan
Tel : +81-3-5835-1870, Fax : +81-3-5835-1873
Internet Home Page h t t p : / / w w w . m m c . o r . j p /Date of Issue : May 16, 2008

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