MMC Activities..............1
MEMS-ONE Pj...............5
Column.......................6
Overseas Trends............7
Member’s Profiles .........8

MMC Activities

Activities of the Micromachine Center in Fiscal 2004
OVERVIEW
The Micromachine Center undertook the following activities
regarding research and study about micromachines (MEMS andother minute machines and systems), the collection andprovision of micromachine information, and exchange andcooperation with domestic and worldwide organizations. The
aim was to establish basic micromachine technologies andpromote their industrialization, thus contributing to the further
development of Japan's industrial economy and to internationalsociety.

1. Research and Investigation of Micromachines
Research activities were aimed at gaining a clear
understanding of the trends in micromachine technologies andindustries and conducting investigations of and research on
new technological issues regarding the fusion of micro- andnanotechnologies, as well as making adjustments appropriate
for the multidirectional expansion of micromachine technology.
(1) Microanalysis/Production System Project(recommissioned NEDO project and contract)
The MMC participated in the national government/NEDOsponsored Microanalysis/Production System Project and is
working on the construction of a document database system.
Specifically, the MMC attended µTAS2004 and MEMS2005 andexamined a total of 480 microchemistry-related documents,
classifying the content of each and compiling a databaseaccordingly.
(2) Studies on the future prospects of micromachine/
MEMS technology
The MMC not only held six next-generation project meetings
attended by key figures in industry, academia, and government,
but also undertook joint research commissioned by the
Mechanical Social Systems Foundation, proposing a nextgeneration MEMS project to begin in fiscal 2006 aimed atmeeting the requirements and expectations of industry
regarding MEMS and trends in MEMS technology.
(3) Studies on R & D trends for micromachinetechnology in Japan and abroad
The Subcommittee on Trends in R&D for MicromachineTechnology in Japan and Abroad (Chairman: Prof. Shuichi Shoji,
Waseda University)met three times, conducting exploratory
analysis of the latest situation regarding the rapid expansion,both domestically and internationally, of micromachinetechnology and research trends and of basic technological datathat contributes to the advancement of micromachinetechnology; and compiled the results of investigations ontechnological trends into the 2004 report on the investigation
into trends by category.
(4) Studies on MEMS reliability assessment
technology(project commissioned by the Japan
Machinery Federation)
The Subcommittee on Trends in Reliability Assessment
Technology was established and met five times. The
subcommittee investigated the current situation of and issues
for MEMS reliability assessment technology using relatedInternet Home Page : http://www.mmc.or.jp/

academic literature, and compiled the recommendations
regarding policies for strengthening approaches in this field into
the 2004 report on the investigation into MEMS reliability
assessment.
(5) Studies on micro/nanosystem-related processing andassembly/measurement and assessment/handlingtechnology(project commissioned by the MechanicalSocial Systems Foundation)
A report was compiled of the results of investigations aimed
at exploiting MEMS characteristics and enhancing theirpotential as an integrated technology through the integration of
third-generation microprocessing technology and nano-and
other disparate cutting-edge materials. In cooperation with the“Studies on the future prospects of micromachine/MEMS
technology” described above in (2), the MMC made proposals
for a next-generation MEMS project.
(6) Joint survey research activities concerning theindustrialization of MEMS
As measures to promote the expansion and strengthening of
MEMS foundry operations, the a subcommittee comprising
three foundry manufacturers considered two issuestandardization of specialized MEMS terminology, and methodsof response to MEMS foundry users-and maderecommendations to the Foundry Service Industry Committee.
These recommendations are to be implemented in fiscal 2005.
(7) MEMS-ONE: MEMS Open Network Engineering
System of Design Tools Project(NEDO-commissioned project)
The MMC has organized an industry/academia cooperative
research consortium (comprising nine businesses, ten
universities, one research institute, and one organization). In
June 2004, the center was commissioned to act as
representative for MEMS-ONE (MEMS Open Network
Engineering System of Design Tools Project), a national
government/NEDO project, to oversee development for a threeyear period until March 2006.
Specifically, the MMC oversees a total of six committees,
including the Project Promotion Committee, and ensured thatthe project overall proceeded according to plan in the firststage.
The MMC also took part in the construction of the MEMSONE knowledge database and materials/process database,collecting and compiling information from academic literatureand data provided by universities.
(8) Studies on the ripple effect and diffusion of MEMSONE(NEDO-commissioned project)
The MMC and Mizuho Information & Research Institute,
Inc. jointly conducted a NEDO-commission project with the aimof promoting the diffusion of MEMS-ONE. Specifically, a written
and, in some cases, aural survey of potential MEMS-ONE users(domestic organizations) was conducted, as was amarket/needs survey aimed towards diffusion.

2. Collection and Provision of Micromachine Information
Information and documents on micromachines inuniversities, industries, and public organizations both in Japan

Industrial Science and Technology (AIST) joined the network
this year as an associate member. The Foundry Service Industry
Committee met five times; strategies for expanding the network
were considered; the MMC Internet homepage - a channel for
providing information - was upgraded; and two MEMS lectures
were held.

and overseas have been collected and, along with MCCproduced survey results and documents, maintained and not
only made freely available in the MMC library, but also
disseminated widely, both domestically and internationally.
(1) Improved dissemination and exchange of information
through the MCC website
The MMC Internet homepage was revised and thoroughly
overhauled.

(5) Establishing a forum for the exchange of cuttingedge micro/nano technology
A forum for the exchange of cutting-edge micro-nanotechnology was held two times for supporting members withthe aim of strengthening cooperation between industry andacademia in the micromachine/MEMS field.

(2) Publication of a micromachine periodical(“Micromachine Index”)
A micromachine periodical entitled Micromachine Index
gathering together abstracts of important documents was
published and distributed to interested parties (fiscal 2004:
Nos. 92-99 issued [8 volumes]).

4. Promotion of Standardization of Micromachines
In cutting-edge technological fields such as
micromachine/MEMS, standardization is being promoted asinternational initiatives are taken.

(3) Publication of a newsletter
Information concerning research and governmental trends
related to micromachines was distributed monthly tosupporting members.

(1)Standardization of fatigue testing methods for micronano materials (application for sponsorship submitted to
the Ministry of Economy, Trade and Industry)
Continuing on from last year, the MMC is conducting
research on standard fatigue testing methods that enableevaluation of the mechanical properties of various thin film
materials measuring less than 10µm wide and 100µm long, withthe aim of international standardization.

(4) Maintaining and upgrading the MMC library
Documents on micromachines in universities, industries,
and public organizations both in Japan and overseas have beencollected and combined with survey results compiled anddocuments produced by MMC and made available in the MMC
library (48 books collected in fiscal 2004, making a total of
1,100 books as of March 31).

(2) Standardization of tensile testing methods for thin film materials
With the support of the Japanese Standards Association,
the MMC has prepared proposals for the international
standardization of tensile testing methods for thin film materials
and standard test pieces. The CD (Committee Draft) submitted
to the International Electric Congress (IEC) was referred toeach of the member countries and approved at the IEC meeting
held in Seoul in October 2004. It was then decided to submit a
CDV (Committee Draft for Vote), one more step closer tointernational standardization.

3. Exchange and Cooperation with Micromachinerelated Organizations Worldwide
To promote affiliation, exchange and cooperation withrelated organizations in and outside Japan, the MMC involved
itself in such activities as participating in the Micromachine
Summit, holding the International Micromachine/Nanotech
Symposium, and inviting to Japan and sending overseas
researchers and experts in the field.
(1) Participation in the 10th Micromachine Summit
The 10th Micromachine Summit was held over three days,
from May 3 to 5, 2004, in Grenoble, France. The event was
attended by 108 participants representing 23 countries andregions. A delegation of four and three observers attended fromJapan, and presentations were made by Isao Shimoyama(professor, the University of Tokyo), Toshiro Shimoyama(Honorary Chairman of MMC), Takayuki Hirano (MMC
Technology Adviser), and Kunihiko Hara (Executive Director,
Nippon Soken Inc.)(3) Support for standardization of IEC terminology
At the IEC meeting held in Seoul in October 2004, the CDV
proposed by Japan was approved. It was then decided to submit
a FDIS (Final Draft International Standard). International
standardization will thus be achieved in 2005.
(4) Research and investigation of micromachine standardization
Following the IEC international standardization of
specialized terminology, it was decided to next proceed withJapan Industrial Standard (JIS). Now that the international
standardization of specialized terminology, tensile testing andfatigue testing has been completed, an investigation isunderway about what other areas require standardization.

(2) Holding the 10th International Micromachine/Nanotech
Symposium (partially subsidized by activities promoting
the machine industry)
The 10th International Micromachine/Nanotech Symposium
was held on November 11 at the Science Museum in
Kitanomaru Park, Tokyo, with the aim of promoting
micromachine technology and educating a wider publicaudience. The event was well attended, with a total of 359
participants including speakers, invited persons and media
representatives.

5. Dissemination of information and education
about micromachines
The MMC undertook a variety of activities aimed atdisseminating information and providing education about
micromachines, including in particular the issue and distributionof quarterly magazines and sponsorship of exhibitions.
(1) Publication of public relations quarterly magazine“Micromachine ”
Volumes 47 to 50 were published in Japanese only. English
versions are available on the MMC website.

(3) International exchange and dispatch of researchers
A fact-finding mission visited Taiwan and Singapore over six
days, from September 6 to 11, 2004. In Taiwan, the group visitedthe Industrial Technology Research Institute (ITRI) and threecompanies, and in Singapore visited the Institute ofMicroelectronics (IME) and two companies; approaches to
MEMS and nanotechnology were discussed. To summarize,
Taiwan is planning the foundry industrialization of MEMS andpromoting the use of large diameter wafers on the same level assemiconductors; Singapore is focusing on nanotechnology
research.

(2) The 15th Micromachine Exhibition
The 15th Micromachine Exhibition was held from November 10
to 12 at the Science Museum in Kitanomaru Park, Tokyo.
Altogether 247 companies, organizations, and other exhibitors the largest number of exhibitors at any micromachine exhibition
to date - participated (the total number of booths was 352), andthe total number of visitors was 8,213.

(4) Building a MEMS foundry network system
To further the industrialization of MEMS, the MMC hasestablished and operates a foundry network comprisingbusinesses that provide foundry services. In addition to the 10
foundry business members, the National Institute of Advanced(3) Administration of the Federation of MicromachineTechnology
As secretariat for the Federation of Micromachine Technology,
the MMC endeavored to enhance cooperation between andstrengthen micromachine-related organizations.

2

Next-Generation Projectss
Isao Shimoyama, Professor
Graduate School of Information Science and Technology
The University of Tokyo
The Micromachine Center created the NextGeneration Project Investigative Commission to study
the future shape of MEMS. The following is a
description of the findings of this study.
Characterized by miniaturization, MEMS has beendeveloped as a major industry centered on
monofunctional devices. MEMS products that havebeen marketed to date include pressure sensors,
accelerometers, gyroscopes, inkjet print heads, DLP
products, and microphones. According to a study
conducted by the Micromachine Center, the market
size for MEMS in Japan is expected to reach 1.36
trillion yen by 2010. Therefore, future high-density,
complex MEMS, which will be smaller, more reliable,
and more sophisticated, have become a major issue.
The Investigative Commission discussed the MEMS
industry based on our recognition of this situation. In
the future, there will be a strong demand for smaller,
cheaper, more sophisticated, and more versatileelectronic parts serving as key components in thetelecommunication field, for which a surge in demand
is anticipated, and the automotive field, which iscompetitive internationally. It will also be necessary tocontribute to safety and security, sustainable energy,
medical welfare, and other social needs. MEMS
technology is the leading candidate among
manufacturing technologies for meeting these needs.
Future MEMS business may develop in many
shapes, including in-house-manufacturing businesses,
businesses for supplying MEMS parts, foundry
services, startup companies produced by spinouts, aswell as design, simulation, and consulting businesses.
However, MEMS R&D to date has required capital for
relatively long periods, such as ten to twenty years or
more. If this also proves to be a impediment in nextgeneration highly integrated, complex MEMS, thepotential for the MEMS industry and its users will be
low. Therefore, we must establish policies for the

MEMS industry aimed at revitalizing the strength ofJapan's manufacturing industry.
The Commission established the following four
categories for technologies required for meeting our
future needs through the development of high-density,
complex MEMS that are smaller, more reliable, andmore sophisticated.
(1) Technologies integrating MEMS and high-density
semiconductors (MEMS + CMOS)(2) Technologies for combining and increasing thedensity of multiple MEMS (MEMS + MEMS)(3) Technologies for combining the functions of
MEMS and nanotechnology (MEMS + NANO)(4) Common base technologies

Of these categories, (1) involves the monolithic
integration of MEMS and CMOS aimed at rapidly
improving the functional capacity for knowledge
accumulation; (2) involves the research anddevelopment of technologies for bonding and layering
dissimilar materials and functions at the wafer level inorder to combine functions, express new functions,and improve reliability; (3) involves the research anddevelopment of technologies for locally and selectively
forming and expressing the functions of nanomaterials
on MEMS with the aim of improving the performanceof MEMS using functional expressions on thenanoscale; and (4) is aimed at constructing a common
knowledge database primarily concerned with highdensity, complex MEMS.
MEMS technology is our trump card for the futureof the manufacturing industry. It has high added value
and is supported by a strong technological strength
difficult to replicate. It is our wish that the results of
the Next-Generation Project Investigative Commission
will be incorporated in future R&D for strengthening
the competitiveness of our industry.

Possible strategies for the MEMS Industry
Advances in MEMS will meet diverse needs
and resolve many problems in our society
Advances in MEMS

2nd Stage:

1.36 trillion yen by 2010
Other (domestic market)
Environment
Healthcare
Lifestyles
Automobiles
Telecommunications

High-density, complex
plex
ex MEMS
M
MEM
EMSS(Smaller, moreore reliable,
reliablemoreree sophisticated)sophisticated)

430 billion yen in 2002

The

Devel
Developing
Develoevelopingeveloveloping conventional
MEMS through 3D
integration and nanofunctions

Today 1st Stage:

birt

ho

fM

EM

S

Conventional MEMS devices
Pressure sensors, accelerometers,
scanners, inkjet print heads

The emergence of numerous MEMS
devices based on micromachining andsemiconductor fabrication technologies

Possible strategies for the MEMS Industry

3

Fujikura's MEMS Foundry Service
Nobuyuki Sadakata, General Manager
Electron Device Laboratory, Silicon Technology Department
Fujikura Ltd.

1. Overview

3. MEMS Packaging

Fujikura's MEMS technology is based on
experiences in the downsizing and integration of
sensors. The technology is backed by years ofexpertise on silicon micromachining, wafer bonding
and packaging during our mass-production ofsemiconductor pressure sensors. By combining siliconplaner processes, microcircuits formation on flexible
printed circuit boards, and chip-on-film assembling
technology, we have developed our wafer-levelpackage (WLP) technology and launched a foundry
service. Fujikura is actively pursuing research anddevelopment targeting a future MEMS packaging
applying silicon through-hole interconnection
technology.

Fujikura was among the first to focus on promisingthrough-hole interconnects in silicon substrates. A
photo-assisted electro-chemical etching (PAECE)
process for forming through-holes and a molten metalsuctioned method (MMSM) for conductor formation
have been developed at early stage. Now by dry
etching and by low-cost conductor filling processes,
for instance, electroplating, we are pursuing R&D on
various techniques for forming through-holeinterconnects and wafer bonding that are appropriate
for MEMS device packaging and system-in-package
technologies.
The image-sensor package is one of the typical
product applying these technologies. By embedding
conductors in a chip using a through-holeinterconnect, solder bumps can be formed on the
opposite side of image-sensing area of the device on
the optical lens side, achieving a small camera module
for a high-density assembly. Combining this WLP
technology with our expertise in packaging of pressure
sensors with cavities, we are endeavoring to realize
practical products by introducing our through-holeinterconnects for the coming generation of interposers
and wafer-level MEMS packages (WLMP).

2. Wafer-Level Packages
For portable electronic equipments, WLP, whichenables real-chip-size IC package, is now becoming
widespread. Fujikura has developed technologies forforming thick resin film, fine rule circuits, lead-freesolder bumping on the whole wafer and reducing thechip-height by wafer-thinning. Also, building-up multilayer circuits has been developed. Fujikura started its
WLP foundry service in 2002, and now new massproduction line for 8-inch and 6-inch wafers at the
Sakura Plant has brought into operation. Further,integrated passive devices for RF-MEMS of highperformance antennas and inductors on WLPs havebeen successfully developed. Fujikura will continue tocontribute improving device performance with novel
technology.

4. Conclusion
Fujikura has assembled its wafer-level package
foundry service and MEMS R&D at its Sakura Plant,
intending to establish a MEMS production service aswell as WLPs to meet our customer demands.
Contact
E-mail: device@rd.fujikura.co.jp
CavityResin

Al I/O pad

Si

Cu re-routeFig. 1 Wafer-level package

Through-holeinterconnect
Encapsulant

Lead-free solder bump

Fig. 2 Cross-sectional view of an image sensor

4MEMS-ONE Project Data:Development of the Framework Software
Yukihisa Maeda, MEMS Project Manager, Research and Development Department
Nihon Unisys Excelutions, Ltd.

format so that the user's software can be incorporated
into the present system. The database interface has afunction for facilitating interface with the knowledge
database and the material and process database.
Development of the MEMS-ONE project was begun
last year with a target release date set for the end of
2006. We have begun development work on the
program this year based on the studies implemented
last year on specifications for the framework functions.
Below we present a draft of screen images for the
MEMS-ONE framework functions (not the final
version).

1. Development Objectives
Nihon Unisys Excelutions is researching anddeveloping framework software designed to implement
integrated management of the MEMS Open Network
Engineering System of Design Tools (MEMS-ONE).
This framework software will have sophisticatedfunctional integration with diverse analytical software
and will establish an organic link with the knowledge
database and material and process database.
2. State of Development
The framework, detailed in the following diagram,
primarily functions to form device structures, create
masks, set analytical conditions, display analyticalresults, set process recipes, automatically create
lattices, convert data using external software,
implement plug-ins, and interface with databases.

Framework Software
Device structure
creation

Analyticalresults display

Automatic
lattice creation

Analyticalcondition setting

External software
conversion

Plug-in function

Mask creation
Database
Process recipe

Diverse analytical programs

interface

MEMS-ONE start-up screen

Knowledge andmaterial databases

Plug-in program

Functions in the framework for MEMS-ONE

The function for device structure formation
includes a 3D modeling function. The function formask creation includes a CAD function for creatingmask layout data. The function for setting analyticalconditions can set conditions for many diverse
analytical programs. The function for displaying
analytical results includes a function for visualizing
analytical data. The process recipes include a function
for combining processes in multiprocessing and afunction for setting and modifying process conditions.
The function for automatic lattice creation has afunction for creating mesh data required for analyticalprograms employing the finite element method. The
external software converter has a function forconverting commercial CAD data and analytical data.
The plug-in function has an open parts and data

Selection window for the mechanical analysis program

Since the framework functions are responsible forthe main interface with the user, we strove to create auser-friendly GUI simple enough for novices to use.
Our goal is to complete the development early enoughthat the developmental results can be actively
promoted at the Micromachine Exhibition and the like.

5Column

Transitions in Bonding Technologies : from a Golden Mask to MEMS
Osamu Ohashi, Professor, Graduate School of Science and Technology
Niigata University
photolithography. The method of bonding is anodic bonding,which employs electrostatic attraction in the glass interface
that accompanies the migration of sodium ions. This method
can be used at the relatively low temperature of about 300;.
In addition to microreactors, devices having
micromechanical structures (MEMS) include various
accelerometers and optical switches. Assembled of
micromechanical parts formed in silicon using
photolithography, these devices have practical applications in
combination with processing technologies from multiple fields.
I believe that complex micromechanical process andassembly technologies represented in devices having
micromechanical structures should be one of Japan's focuses in
the future.

Throughout the history of humankind, technology has
progressed slowly and, at times, rapidly. One technology thathas advanced with the others is welding/bonding technology.
The history of bonding began with a golden mask that was
discovered in the tomb of the Egyptian king Tutankhamen. The
goldwork of the mask had been assembled around 1300 BCE
using thermocompression. Bonding in Japan began with therepair of a bronze bell. Then in 747, the Daibutsu, or Great
Buddha, of Nara was cast in block units and subsequently
assembled using a brazing-like technique. Around 900, atechnique for manufacturing Japanese swords was established.
When guns arrived in Tanegashima in 1543, material processing
techniques advanced so rapidly that guns could bemanufactured domestically soon thereafter. These bonding andprocessing techniques were performed by combusting charcoal
as a heat source, heating the materials in a reducing gas toprevent oxidation, and joining gold and iron alloys throughforge welding and brazing with no melting.
When iron came to be produced in blast furnaces after the
Industrial Revolution, iron and steel materials were bonded
mechanically by forming holes in two iron plates and inserting
rivets to join them together. This riveted construction can beseen in the Eiffel Tower, constructed in 1889, and the
Komagata Bridge in Asakusa, Japan, shown in Photo 1. The heatsource evolved from charcoal to electricity, then arcs, electron
beams, and laser beams, as new heat sources were developed.
These heat sources have been applied to welding/bonding
techniques to develop a new fusion welding for melting theprocess points.
Recently, materials are gaining higher functionality; parts
are being made smaller; and there is increasing demand for
precision bonding and methods for joining dissimilar materials.
There are numerous cases in which assembly is not possible
with the conventional melt welding due to metallurgicalproblems. Thus, technologies have been sought and developedfor joining materials in their solid phase without including amolten phase in order to decrease these metallurgical problems.
Fig. 2 shows a sample wound coil for use in a cell phone.
The entire coil is smaller than a grain of rice. The coil is
produced from a urethane-coated copper wire having a
diameter of 30 µm, and this insulated copper wire is bonded tothe silver electrode of a terminal by thermal compression.
Fig. 3 shows a sample microreactor having heat exchange
circuits above and below the reactor circuit. A stainless steel
leaf having a path no greater than 0.5 mm, is bonded using
thermocompression (diffusion bonding) under a high vacuum
so that the material does not deform.
The thermocompression in these bonding techniques was
the same used to assemble Tutankhamen's golden mask, but
remarkable advancements have been made in techniques forcontrolling the bonding process.
Various accelerometers have been manufactured in recent
years. Many of these have been incorporated in automobiles
and have helped improve riding comfort and safety.
Accelerometers are parts formed by joining and assemblingsilicon and glass that have been micromachined according to

Fig. 1 Rivet structure for the Komagata Bridge in Asakusa

Fig. 2 Wound coil for a cell phone (manufactured by Taiyo Yuden)Fig. 3 Layered heat exchanger cut to show the internal
structure (manufactured by Yachida)6Overseas Trends

Report on the 11th Micromachine Summit
The 11th Micromachine Summit was held in Dallas, Texas,
May 1-4, 2005. The Micromachine Center held the first
Micromachine Summit in Kyoto, Japan in March 1995, inviting
representatives from nine other countries active in the field of
micromachines, including the United States, Australia, Canada,
France, Germany, Italy, the Netherlands, Switzerland, and theUnited Kingdom. Now, ten years later, sixty-three
representatives and thirty-three observers-for a total of ninetysix participants-attended the 11th Micromachine Summit in 2005.
Including the countries mentioned above, the participants camefrom a total of twenty-four countries including Mexico,
Argentina, China, South Korea, Taiwan, Singapore, India, Israel,
Belgium, Greece, Denmark, Norway, Sweden, and Finland.
Representatives from universities and research institutes andorganizations accounted for three-fourths of the participants,
while the remainder was made up of business reapresentatives.
A total of nine people from Japan attended, including Chief
Delegate Dr. Isao Shimoyama (professor, the University ofTokyo), Delegate Toshiro Shimoyama (chairman, theMicromachine Center and supreme advisor, Olympus
Corporation), Delegate Hitoshi Ogata (director, theMicromachine Center and senior executive officer, Mitsubishi
Electric Corporation), Delegate Keiichi Aoyagi (executive
director, the Micromachine Center), Delegate Takayuki Hirano(executive advisor, the Micromachine Center), and four
observers.
The conference proceeded in a roundtable format, with thedelegates seated around the table and the observers encircling
them. The first day of lectures consisted of country reviews, inwhich a representative from each participating country spoke
about their country's micromachine- and nanotechnologyrelated endeavors. No other event provides the opportunity tohear about the micromachines activities of twenty-four countries
under one roof. For Japan's review, Chief Delegate Shimoyama
spoke on “MEMS Market Trends in Japan.” In this report, hepredicted rapid growth in Japan's MEMS market and stressed
the importance of producing fine MEMS through thedevelopment of (1) MEMS+CMOS, (2) MEMS+MEMS, and (3)MEMS+Nanotech in order to attain and expand this rapid
growth.

On the second day of the Summit, twenty-three lectures
were given during four sessions entitled (1) Techno-Historical,(2) Institutes and Companies, (3) Strategy, and (4) Industry
Groups. Of particular interest were the success stories relatedby the host country's Texas Instruments on Digital Mirror
Devices and Analog Device Inc. on the development ofaccelerometers. Delegate Aoyagi of Japan reported on theMicromachine Center's endeavors to date and future
developments in a lecture entitled “Toward Industrialization of
MEMS/Micromachine Technologies.” Delegate Shimoyama gave
a visual presentation entitled “Technological Challenges toward
Capsule Endoscopes,” in which he introduced through video
Olympus' activities in Capsule Endoscopes. This year, Delegate
Shimoyama was recognized by the Secretariat for the enormous
contribution he has given to the Summit over the years. Also, in
his lecture entitled “Micro and Nano Technologies at Mitsubishi
Electric Corporation,” Delegate Ogata presented Mitsubishi
Electric's work in nanotechnology centered on MEMS
technology.
On the final day, participants were taken on a tour of Texas
Instruments, Zyvex, and the University of Texas at Dallas, alllocated near the conference hall. Perhaps due to its location in thisbuoyant town of Texas, this year's Micromachine Summit had alight-hearted mood throughout. It was apparent during thisSummit that the connection of micromachines and MEMS
technology to nanotechnology is essential and that many countries
are working to use this to create and develop new industries. The
fruits of these activities are greatly anticipated. Finally, it was
decided to append the subtitle “Micro/Nano Technology andApplications” to the original title “Micromachine Summit.”
The 12th Micromachine Summit: Micro/Nano Technology andApplications has been scheduled to be held in Beijing, China forthree days on April 27-29, 2006. Hence, as new industries for
micromachines and MEMS emerge and the number of Asianparticipants in the Summit increases, the Micromachine Summit
will be departing from its salon-type roundtable meeting ofseveral tens of people and is about to be reborn as a newconference that maximizes features different from other typicalacademic meetings on technology. The Micromachine Center
will continue to lend its support to the Micromachine Summit.

7

Members' Profiles

Olympus Corporation

Haruo Ogawa
Division Manager, New Business Planning Division

1. Endeavors in MEMS Technology
Olympus launched its Semiconductor Technology
Center in 1982 to develop special imaging sensors andperipheral ICs. This led to Olympus' involvement in MEMS
in 1989, when Olympus began developing cantilevers foratomic force microscopes (see Fig. 1) using thesemiconductor prototype production line. In themeantime, Olympus has actively engaged in research anddevelopment on charge modulation image sensors and allpurpose Bi-CMOS devices using electronic devices;various cantilevers, optical scanners (see Fig. 2), andother optical MEMS using MEMS; and various opticalsensor modules combining photodiodes and micro-opticaldevices. Olympus also participated in the ten-year
Micromachine Project, which began in 1991 andconcluded in the spring of 2001. This project involved thedevelopment of small-diameter, active-bending
microcatheters tipped with a heavy density of siliconpiezoelectric MEMS pressure sensors, as well as
piezoelectric diagnostic tactile sensors, helping to createbase technologies for a variety of MEMS sensors. In
addition, Olympus has conducted biotechnology-related
R&D since the second half of the 1980s. In the latter halfof the 1990s, Olympus began developing bio-MEMS (ormicrofluidics devices) in the form of preprocessing freeflow modules for separating DNA and proteins and microPCR (polymerase chain reaction) modules for
amplification.

Fig.1 CantileverFig.2 Optical scanner

2. Commercialization of MEMS Technology
After many years of accumulating research anddevelopment on MEMS technology, Olympus introduced
the cofocal scanning laser microscope LEXT OLS3000 in
November 2003 as a product capable of utilizing thefeatures of MEMS devices. This microscope is equippedwith an optical MEMS scanner and boasts the world's
highest resolution among similar microscopes. In August
2004, Olympus introduced the nanosearch microscope
LEXT OLS 3500 (see Fig. 3). This microscope is equippedwith the functions of a scanning probe microscope using
MEMS cantilevers that enable rapid super-wide range

observations, from millimeters to nanometers. In April
2004, Olympus announced that, through collaboration
with Kanazawa University professor Toshio Ando, it had
developed a high-speed atomic force microscope capableof videotaping individual molecules in living proteins byapplying soft cantilevers one-twentieth the size of theirconventional counterparts. This microscope is expected tocontribute widely to fields of basic research innanobiotechnology, for example.
In November 2004, Olympus introduced a passive
capsule observation endoscope (see Fig. 4), which is aculmination of its many years of research anddevelopment on micromachines. Now, MEMS has growninto a core technology at Olympus that differentiates its
products.

Fig.3 Nanosearch microscope Fig.4 Capsule endoscope

3. Creating Core Businesses based on
MEMS Technology
Currently, Olympus is involved in the national MEMS
Project to develop a high-precision fabrication technology
for optical switches. As Olympus continues to acquire
sophisticated optical MEMS technology, its MEMS foundry
service is receiving an increasing number of inquiries.
Although the foundry service has been in operation forjust over three years, numerous prototypes of MEMS
devices have been manufactured, some of which have now
entered the mass-production phase. Quality assurance
becomes of utmost importance in the mass-production
phase, and the laser microscopes OLS3000 and OLS3500
sold by Olympus are ideal for evaluating MEMS devices.
When commercial measuring instruments are notsufficiently inspected or assured, Olympus develops
special evaluation equipment using its own microscope
technologies, making every effort to assure quality.
MEMS is now being said to be vital for industry.
Olympus is striving to build a relationship of trust with its
customers through the MEMS foundry service and tocreate future core businesses according to a new businessmodel.

Contact for the MEMS foundry service
E-mail: MEMS_Lab@ot.olympus.co.jp
MICROMACHINE No. 52

MICROMACHINE is published quarterly by Micromachine Center (MMC) to promote the international exchange of
information related to micromachines, R&D and other technical topics, and is circulated free of change. Please send
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