Faster 3D X-ray dataacquisition and superior
imaging quality
for electronics failure analysis
ZEISS DeepRecon ProZEISS DeepRecon Pro is an artificial intelligence (deep learning)-based reconstruction technology for 3D X-ray microscopy (XRM).
Intended to image and analyze electronic products and components, DeepRecon Pro enables faster 3D X-ray scans while preserving
ZEISS’s revolutionary Resolution at a Distance (RaaD) and image quality advantages.
Up to 4X Faster Scans
Rapid structural and failure analysis (FA) aids
fast product introductions and high customer
satisfaction levels. Shrinking package interconnects, higher packing densities, andincreasing package sizes result in smaller,
more difficult-to-find defects and longer
analysis times. DeepRecon Pro enables fasterhigh-resolution, high-quality 3D X-ray image
acquisition for workflows used in processdevelopment and quality control. Up to 4X
faster throughput is possible by leveraging
the ZEISS big-data library and deep learning
training network models.

Faster time to results and the ability toincrease sampling rates provide a newopportunity to scan larger fields of view(FOV) with high resolution for fault isolation
applications.

Standard ReconstructionZEISS DeepRecon Pro

Better Image Quality
High image contrast-to-noise ratio (CNR)
and high resolution are needed to produce
the highest quality images for improved
visualization of defects and for small andlow-contrast features. To achieve a higher
CNR using standard reconstruction techniques,
higher exposure times and/or a higher

Enhanced
CNR
Top-down view
Enhanced
CNR

X-sectional view
300 projections
Scan time: 30 minutes

100 µm300 projections
Scan time: 30 minutes

DeepRecon Pro for electronics failure analysis workflows: Superior image quality for electronics packages

number of projections are generallyrequired, which can significantly impact
throughput. DeepRecon Pro offers astatistically improved CNR, providing superior
image quality. DeepRecon Pro additionallyreduces noise and aliasing imaging artifacts
common in the traditional FeldkampDavis-Kress (FDK) reconstruction method.
Unlimited, User-trained Networks
DeepRecon Pro is an option offered via
the ZEISS Advanced Reconstruction Toolbox
for ZEISS Xradia Versa X-ray microscopes andContext microCT instruments. The one-click
network training solution is seamlessly
integrated in the existing ZEISS reconstructionengine. Deep learning network models can betrained and generated by users, eliminating
the need for a machine-learning expert. Users
can build their own network model library tofit a broad range of repetitive or non-repetitive
applications. Available for new or existing
X-ray systems, DeepRecon Pro opens new 3D
X-ray failure analysis workflow opportunities
by AI-driven speed or image quality.

Standard Reconstruction

Standard ReconstructionZEISS DeepRecon Pro
5 hours(3000 projections / 6 seconds)

ZEISS DeepRecon Pro40 minutes(400 projections / 6 seconds)

ZEISS DeepRecon Pro
7 minutes(400 projections / 1 second)

Smartphone package: DeepRecon Pro enables tremendous improvement on data acquisition speed and image quality for both large and fine features.

ZEISS continuously develops new solutions to solve critical challenges for semiconductor package analysis and FA applications.
ZEISS offers unprecedented system extendibility with field conversion options and various upgrades like DeepRecon Pro to protect
your investment.

ZEISS DeepRecon ProZEISS Xradia Versa XRM
with primary workstation
Standard FDK ReconstructionZEISS Xradia
Context microCTwith primary workstation
Standard FDK Reconstruction

microscopy@zeiss.com
www.zeiss.com/xrm+Software Bundle

High-performance
Offline Workstation• DeepRecon Pro engine• Dual 10-core processor• One-click networkmodel training• 512GB RAM• Manual Reconstruction• Windows 10, 64-bit O/S• XRM DataExplorer• Dual professional-class
3D GPU• XRM 3DViewer• 30” monitor

Not for therapeutic use, treatment or medical diagnostic evidence. Not all products are available in every country. Contact your local ZEISS representative for more information.
EN_44_012_078 US | 07-2021 | Design, scope of delivery and technical progress subject to change without notice. | © Carl Zeiss Microscopy GmbHStandard Reconstruction