RS8561,RS8562,RS8564

Zero-Drift, Rail-to-Rail I/O CMOS Operational Amplifiers
1 FEATURES
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Low Offset Voltage: ±20uV (MAX)
Input Offset Drift: ±0.1uV/°C (TYP)High Gain Bandwidth Product: 11MHz
Rail-to-Rail Input and Output
High Gain, CMRR, PSRR:120dB(TYP)High Slew Rate: 8.5V/us
Low Noise: 0.48uVp-p (0.01Hz~10Hz)
Low Power Consumption: 1.3mA /op amp
Overload Recovery Time:0.4us
Low Supply Voltage: +2.9 V to +5.5 V
No External Capacitors Required
Extended Temperature: -40°C to +125°C

2 APPLICATIONS
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Temperature Sensors
Medical/Industrial Instrumentation
Pressure Sensors
Battery-Powered Instrumentation
Active Filtering
Weight Scale Sensor
Strain Gage Amplifiers
Power Converter/Inverter

3 DESCRIPTIONSThe RS8561, RS8562, RS8564 series of CMOS
operational amplifiers use auto-zero techniques tosimultaneously provide very low offset voltage (20uVmax) and near-zero drift over time and temperature.
This family of amplifiers has ultralow noise, offset andpower.
This miniature, high-precision operational amplifiers
offset high input impedance and rail-to-rail input andrail-to-rail output swing. With high gain-bandwidth
product of 11MHz and slew rate of 8.5V/us.
Single or dual supplies as low as +2.9V (±1.45V) andup to +5.5V (±2.75V) may be used.
The RS8561/RS8562/RS8564 are specified for theextended industrial and automotive temperature
range (-40°C to 125°C). The RS8561 single amplifier
is available in 5-lead SOT23, 8-lead MSOP8 and 8lead SOP packages, The RS8562 dual amplifier isavailable in 8-lead SOP and 8-lead MSOP narrowsurface mount packages. The RS8564 quad isavailable in 14-lead SOP and 14-lead narrow TSSOP
packages.

Device Information (1)PART
NUMBER
RS8561

RS8562RS8564

PACKAGEBODY
SIZE(NOM)

SOT23-52.90mm×1.60mm

SOP8

4.90mm×3.90mm

MSOP8

3.00mm×3.00mm

SOP8

4.90mm×3.90mm

MSOP8

3.00mm×3.00mm

SOP14

8.65mm×3.90mm

TSSOP145.00mm×4.40mm(1) For all available packages, see the orderable addendum at theend of the data sheet.

REV C.2.1

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RS8561,RS8562,RS8564
Table of Contents
1 FEATURES ............................................................................................................................................................................... 1
2 APPLICATIONS ...................................................................................................................................................................... 1
3 DESCRIPTIONS ...................................................................................................................................................................... 1
4 Revision History ..................................................................................................................................................................... 3
5 PACKAGE/ORDERING INFORMATION (1) ..................................................................................................................... 4
6 Pin Configuration and Functions (Top View) .................................................................................................................. 5
7 SPECIFICATIONS ................................................................................................................................................................... 7
7.1 Absolute Maximum Ratings .......................................................................................................................................... 7
7.2 ESD Ratings ...................................................................................................................................................................... 7
7.3 Recommended Operating Conditions ......................................................................................................................... 7
7.4 ELECTRICAL CHARACTERISTICS ............................................................................................................................... 8
7.5 TYPICAL CHARACTERISTICS ....................................................................................................................................10
8 Detailed Description ...........................................................................................................................................................13
8.1 Overview .........................................................................................................................................................................13
8.2 OPERATING VOLTAGE ...............................................................................................................................................13
9 Application and Implementation ......................................................................................................................................14
9.1 APPLICATION NOTE ...................................................................................................................................................14
9.2 Bidirectional Current-Sensing .....................................................................................................................................14
9.3 Design Requirements ...................................................................................................................................................14
9.4 Detailed Design Procedure .........................................................................................................................................14
9.5 APPLICATION NOTE ...................................................................................................................................................15
9.6 Application Curve ..........................................................................................................................................................15
10 Layout ...................................................................................................................................................................................16
10.1 Layout Guidelines .......................................................................................................................................................16
10.2 Layout Example ...........................................................................................................................................................16
11 PACKAGE OUTLINE DIMENSIONS .............................................................................................................................17
12 TAPE AND REEL INFORMATION .................................................................................................................................22

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RS8561,RS8562,RS8564
4 Revision History
Note: Page numbers for previous revisions may different from page numbers in the current version.
VersionChange Date

Change Item

C.1

2022/05/17

C.2

2023/09/18

1. Update Package Qty on Page 3@RevB.6
2. Added TAPE AND REEL INFORMATION
3. Added APPLICATION NOTE
Delete RS8563 related content

C.2.1

2024/03/04

Modify packaging naming

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RS8561,RS8562,RS8564
5 PACKAGE/ORDERING INFORMATION (1)Orderable
Device
RS8561XF

Package Type

Pin

ChannelOp Temp(°C)

Device Marking(2)Package Qty

SOT23-551-40°C ~125°C

8561

Tape and Reel,3000

RS8561XK

SOP8

8

1

-40°C ~125°C

RS8561

Tape and Reel,4000

RS8561XM

MSOP8

8

1

-40°C ~125°C

RS8561

Tape and Reel,4000

RS8562XK

SOP8

8

2

-40°C ~125°C

RS8562

Tape and Reel,4000

RS8562XM

MSOP8

8

2

-40°C ~125°C

RS8562

Tape and Reel,4000

RS8564XP

SOP14

14

4

-40°C ~125°C

RS8564

Tape and Reel,4000

RS8564XQTSSOP14144-40°C ~125°C

RS8564

Tape and Reel,4000

NOTE:(1) This information is the most current data available for the designated devices. This data is subject to change without notice and revisionof this document. For browser-based versions of this data sheet, refer to the right-hand navigation.
(2) There may be additional marking, which relates to the lot trace code information (data code and vendor code), the logo or theenvironmental category on the device.

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RS8561,RS8562,RS8564
6 Pin Configuration and Functions (Top View)

1

V-

2

+IN

3

5

+

-

V+

4

-IN

NC

1

-IN

2

+IN

3

V-

4

SOT23-5

8

NC

-

OUT

7

V+

+

RS8561

RS8561

6 OUT
5

NC

SOP8,MSOP8

Pin Description
PIN
NAME

I/O (1)

RS8561

RS8561

SOT23-5

SOP8/MSOP8

-IN

4

2

DESCRIPTIONI

Negative (inverting) input

+IN

3

3

I

Positive (noninverting) input

NC (2)

-

1,5,8

-

No internal connection (can be left floating)

OUT

1

6

O

Output

V-

2

4

-

Negative (lowest) power supply

V+

5

7

-

Positive (highest) power supply

(1)
(2)

I = Input, O = Output.
There is no internal connection. Typically, GND is the recommended connection to a heat spreading plane.

RS8562
OUT A

1

-IN A

2

+IN A

3

V-

+

A
B

4

+

8

V+

7

OUTB

6

-IN B

5

+IN B

SOP8,MSOP8

Pin Description
NAME

PIN
SOP8/MSOP8

I/O (1)DESCRIPTION

-INA

2

I

Inverting input, channel A

+INA

3

I

Noninverting input, channel A

-INB

6

I

Inverting input, channel B

+INB

5

I

Noninverting input, channel B

OUTA

1

O

Output, channel A

OUTB

7

O

Output, channel B

V-

4

-

Negative (lowest) power supply

V+

8

-

Positive (highest) power supply(1)

I = Input, O = Output.

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RS8561,RS8562,RS8564
Pin Configuration and Functions (Top View)
RS8564
14

OUT D

13

-IN D

OUT A

1

-IN A

2

+IN A

3

12 +IN D

V+

4

11

V-

+IN B

5

10

+IN C

-IN B

6

9

-IN C

OUT B

7

8

OUT C

A
- +

-

B

+

D
+ -

+ C

SOP14, TSSOP14

Pin Description
NAME

PIN
SOP14/TSSOP14

I/O (1)DESCRIPTION

-INA

2

I

Inverting input, channel A

+INA

3

I

Noninverting input, channel A

-INB

6

I

Inverting input, channel B

+INB

5

I

Noninverting input, channel B

-INC

9

I

Inverting input, channel C

+INC

10

I

Noninverting input, channel C

-IND

13

I

Inverting input, channel D

+IND

12

I

Noninverting input, channel D

OUTA

1

O

Output, channel A

OUTB

7

O

Output, channel B

OUTC

8

O

Output, channel C

OUTD

14

O

Output, channel D

V-

11

-

Negative (lowest) power supply

V+

4

-

Positive (highest) power supply(1)

I = Input, O = Output.

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RS8561,RS8562,RS8564
7 SPECIFICATIONS
7.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted) (1)
MIN

MAX

Supply, VS=(V+) - (V-)
Voltage

Current

7Signal input pin (2)(V-)-0.5(V+) +0.5

Signal output pin (3)(V-)-0.5(V+) +0.5

Signal input pin (2)

-10

10

mA

Signal output pin (3)

-55

55

mA

Output short-circuit (4)Package thermal impedance (5)θJAVContinuous
SOT23-5

230

SOP8

110

MSOP8

170

SOP14

105

TSSOP14
Temperature

UNIT

°C/W

90

Operating range, TA

-40

125

Junction, TJ (6)

-40

150

Storage, Tstg

-65

150

°C

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond thosespecified is not implied.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should
be current-limited to 10mA or less.
(3) Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.5V beyond the supply rails
should be current-limited to ±55mA or less.
(4) Short-circuit to ground, one amplifier per package.
(5) The package thermal impedance is calculated in accordance with JESD-51.
(6) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (T J(MAX) - TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.

7.2 ESD Ratings
The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.
VALUE
V(ESD)

Electrostatic discharge

Human-body model (HBM)±5000

Machine Model (MM)

±400

UNIT
V

ESD SENSITIVITY CAUTION
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its publishedspecifications.

7.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
MIN
Supply voltage, VS= (V+) - (V-)

NOM

MAX

Single-supply

2.9

5.5

Dual-supply

±1.45

±2.75

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UNIT
V

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RS8561,RS8562,RS8564
7.4 ELECTRICAL CHARACTERISTICS
Boldface limits apply over the specified temperature range, TA (9) = -40°C to +125°C.
(At TA = +25°C, VS=5V, RL = 10kΩ connected to VS/2, and VOUT = VS/2, VCM = VS/2, unless otherwise noted.) (1)
PARAMETERSYMBOL

CONDITION

VOS

VCM= VS/2

RS8561, RS8562, RS8564
MIN(2)

TYP(3)

MAX(2)

UNIT

-20

±3

20

uV

±0.1

±0.4

uV/°C

OFFSET VOLTAGE
Input Offset Voltage
Input Offset Voltage Average
DriftPower-Supply Rejection Ratio

VOS TC
PSRR

VS= +2.9V to +5.5V, VCM= 0100

Channel Separation, dc

120

dB

0.1

uV/V

±100

pA

±10

pA

INPUT BIAS CURRENT
Input Bias Current (4) (5)IB

Input Offset Current (4)IOS

VCM = VS/2

NOISE PERFORMANCE
Input Voltage Noiseenp-pf= 0.01Hz to 10Hz

0.48

uVpp

Input Voltage Noiseenp-pf= 0.01Hz to 1Hz

0.15

uVpp

Input Voltage Noise Densityenf= 1KHz32

nV/√HzInput Current Noise Densityinf= 10Hz

1.5

fA/√HzINPUT VOLTAGE RANGE
Common-Mode Voltage Range

VCM

Common-Mode Rejection Ratio

CMRR

(V+)
+0.1

(V-) -0.1(V-) -0.1V < VCM < (V+)+ 0.1V

100

V

120

dB

Differential

5

pF

Common-Mode

5

pF

120

dB

8.5

V/us

INPUT CAPACITANCE

Open-Loop Gain
AOL

RL= 10KΩ, VO= 0.3V to 4.7V,
TA= -40°C to 125°C

Slew Rate (8)

SR

G= +1

Gain-Bandwidth Product

GBW

11

MHz

Overload Recovery Time

tOR

0.4

us

Open-Loop Voltage Gain

100

DYNAMIC PERFORMANCEOUTPUT CHARACTERISTICS
Output Voltage HighVOH

Output Voltage Low

VOL

Short-Circuit Current (6) (7)ISC

RL=100 KΩ to GND

4.99

4.998

RL=10 KΩ to GND

4.95

4.98

V

RL=100 KΩ to V+

110

RL=10 KΩ to V+

10

30

65

mV
mA

POWER SUPPLY
Operating Voltage Range

VS

Quiescent Current Per Amplifier

IQ

2.9
1.3

8 / 23

5.5

V

1.55

mA

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RS8561,RS8562,RS8564
NOTE:(1) Electrical table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using statisticalquality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may varyover time and will also depend on the application and configuration.
(4) This parameter is ensured by design and/or characterization and is not tested in production.
(5) Positive current corresponds to current flowing into the device.
(6) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (T J(MAX) - TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.
(7) Short circuit test is a momentary test.
(8) Number specified is the slower of positive and negative slew rates.
(9) Specified by characterization only.

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RS8561,RS8562,RS8564
7.5 TYPICAL CHARACTERISTICS
NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
At TA = +25°C, VS=5V, RL = 10kΩ connected to VS/2, VOUT = VS/2, unless otherwise noted.

Population

Number Of Amplifiers

6
5
4
3
2
1
0

-20

-15

-10

-5

0

5

10

-0.3

15

-0.2

Figure 1. Offset Voltage Production Distribution

Phase

110

80

90

60

70

40

50

20

30

0

10

-20

-10
100M

1M

0.2

0.3

1K

100

10
-40 -20

0

20

40

60

80 100 120 140

Temperature (℃)

Frequency (Hz)Figure 4. Input Bias Current vs Temperature

Figure 3. Open-Loop Gain and Phase vsFrequency

140

120

120

100

100

CMRR (dB)140

PSRR (dB)

0.1

10K

Input Bias Current (pA)

Open-Loop Gain (dB)

100

10K

0

Figure 2. Offset Voltage Drift Production
Distribution

130

Gain

Phase Margin (°)

120

100

-0.1

Input Offset Drift (uV/℃)

Offset Voltage (uV)

80

60

80
60

40

40

20

20
0

0
100

1K

10K

100K

1M

100

10M

Frequency (Hz)

1K

10K

100K

1M

10M

Frequency (Hz)Figure 5. Power-Supply Rejection Ratio vsFrequency

Figure 6. Common-Mode Rejection Ratio vsFrequency

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RS8561,RS8562,RS8564
TYPICAL CHARACTERISTICS
NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
At TA = +25°C, VS=5V, RL = 10kΩ connected to VS/2, VOUT = VS/2, unless otherwise noted.
1.32
VS= 5V

1.31

Quiescent Current (mA)

Quiescent Current (mA)

1.32

1.3

1.29
1.28
1.27

VS= 2.9V

1.31
1.3
1.29
1.28
1.27
1.26

1.26
-40 -20

0

20

40

60

-40 -2080 100 120 140

0Temperature (℃)

8585

Sink Current (mA)

90

75
70
65
60

60

80 100 120 140

Figure 8. Quiescent Current vs Temperature

90

80

40

Temperature (℃)

55

80
75
70
65
60
55

50

50

-40 -20

0

20

40

60

80 100 120 140-40 -200Temperature (℃)

20

40

60

80 100 120 140

Temperature (℃)

Figure 9. Source Current vs Temperature

Figure 10. Sink Current vs Temperature

CL=100pF

CL=100pF

1V/ div

50mV/ div

Source Current (mA)

Figure 7. Quiescent Current vs Temperature

20

200ns/div

500ns/div

Figure 11. Small-Signal Step Response

Figure 12. Large-Signal Step Response

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RS8561,RS8562,RS8564
TYPICAL CHARACTERISTICS
NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
At TA = +25°C, VS=5V, RL = 10kΩ connected to VS/2, VOUT = VS/2, unless otherwise noted.

0V

1V/ div

VOUT

0V
VS=±2.5V
G=-100VOUT

200mV/ div0V

VS=±2.5V
G=-100

1V/ div

VIN

200mV/ div

0V
VIN

100ns/div

100ns/div

Figure 13. Positive Overvoltage Recovery

Figure 14. Negative Overvoltage Recovery
VS=2.9V

200nV/ div

400nV/ div

VS=5V

10s/div

10s/div

Figure 15. 0.01Hz to 10Hz Noise

Figure 16. 0.01Hz to 10Hz Noise
Vs=2.9V

200nV/ div

100nV/ div

VS=5V

10s/div

10s/div

Figure 17. 0.01Hz to 1Hz Noise

Figure 18. 0.01Hz to 1Hz Noise

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RS8561,RS8562,RS8564
8 Detailed Description
8.1 Overview
The RS8561, RS8562, RS8564 series op amps are unity-gain stable and free from unexpected output phasereversal. They use auto-zeroing techniques to provide low offset voltage and very low drift over time andtemperature.
Good layout practice mandates use of a 0.1µ F capacitor placed closely across the supply pins.
For lowest offset voltage and precision performance, circuit layout and mechanical conditions should be
optimized. Avoid temperature gradients that create thermoelectric (Seebeck) effects in thermocouple junctions
formed from connecting dissimilar conductors. These thermally-generated potentials can be made to cancel by
assuring that they are equal on both input terminals.
• Use low thermoelectric-coefficient connections (avoid dissimilar metals).
• Thermally isolate components from power supplies or other heat-sources.
• Shield op amp and input circuitry from air currents, such as cooling fans.
Following these guidelines will reduce the likelihood of junctions being at different temperatures, which cancause thermoelectric voltages of 0.1µ V/°C or higher, depending on materials used.

8.2 OPERATING VOLTAGE
The RS8561, RS8562, RS8564 series op amps operate over a power-supply range of +2.9V to +5.5V (±1.45V to±2.75V). Supply voltages higher than 7V (absolute maximum) can permanently damage the amplifier. Parametersthat vary over supply voltage or temperature are shown in the typical characteristics section of this data sheet.

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RS8561,RS8562,RS8564
9 Application and Implementation
Information in the following applications sections is not part of the RUNIC component specification, and RUNIC
does not warrant its accuracy or completeness. RUNIC’s customers are responsible for determining suitability ofcomponents for their purposes. Customers should validate and test their design implementation to confirm
system functionality.

9.1 APPLICATION NOTEThe RS856X is a unity-gain stable, precision operational amplifier with very low offset voltage drift; these devices
are also free from output phase reversal. Applications with noisy or high-impedance power supplies requiredecoupling capacitors close to the device power-supply pins. In most cases, 0.1-uF capacitors are adequate.

Typical Applications
9.2 Bidirectional Current-Sensing
This single-supply, low-side, bidirectional current-sensing solution detects load currents from -1 A to 1 A. The
single-ended output spans from 110 mV to 3.19 V. This design uses the RS856X because of its low offset voltage
and rail-to-rail input and output. One of the amplifiers is configured as a difference amplifier and the otherprovides the reference voltage.
VCC
VCC

VREF

R5

+

U1B

R6
ILOAD

VBUS

+

R2
R1

+
VSHUNTR SHUNT

+

VOUT
U1A

R3

VCC

RL

R4

Figure 19. Bidirectional Current-Sensing Schematic

9.3 Design Requirements
This solution has the following requirements:• Supply voltage: 3.3 V• Input: -1 A to 1 A• Output: 1.65 V ±1.54 V (110 mV to 3.19 V)

9.4 Detailed Design Procedure
The load current, ILOAD, flows through the shunt resistor (RSHUNT) to develop the shunt voltage, VSHUNT. The shunt
voltage is then amplified by the difference amplifier, which consists of U1A and R 1 through R4. The gain of thedifference amplifier is set by the ratio of R 4 to R3. To minimize errors, set R2 = R4 and R1 = R3. The reference
voltage, VREF, is supplied by buffering a resistor divider using U1B. The transfer function is given by Equation 1.
VOUT= VSHUNT×Gain Diff_Amp +VREF
Where
VSHUNT=ILOAD×RSHUNTR
Gain Diff_Am p = 4
R3(1)
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RS8561,RS8562,RS8564
There are two types of errors in this design: offset and gain. Gain errors are introduced by the tolerance of theshunt resistor and the ratios of R4 to R3 and, similarly, R2 to R1. Offset errors are introduced by the voltage divider(R5 and R6) and how closely the ratio of R4/R3 matches R2/R1. The latter value impacts the CMRR of the difference
amplifier, which ultimately translates to an offset error. Because this is a low-side measurement, the value of
VSHUNT is the ground potential for the system load. Therefore, it is important to place a maximum value on VSHUNT.
In this design, the maximum value for V SHUNT is set to 100 mV. Equation 2 calculates the maximum value of theshunt resistor given a maximum shunt voltage of 100 mV and maximum load current of 1 A.

RSHUNT(Max) =VSHUNT(Max) 100 mV= 100 m=ILOAD(Max)1A(2)

9.5 APPLICATION NOTE
The tolerance of RSHUNT is directly proportional to cost. For this design, a shunt resistor with a tolerance of 0.5%
was selected. If greater accuracy is required, select a 0.1% resistor or better.
The load current is bidirectional; therefore, the shunt voltage range is -100 mV to 100 mV. This voltage is divided
down by R1 and R2 before reaching the operational amplifier, U1A. Take care to ensure that the voltage present
at the noninverting node of U1A is within the common-mode range of the device. Therefore, it is important touse an operational amplifier, such as the RS856X, that has a common-mode range that extends below thenegative supply voltage. Finally, to minimize offset error, note that the RS856X has a typical offset voltage of±3µ V (±20µ V maximum). Given a symmetric load current of -1 A to 1 A, the voltage divider resistors (R5 and R6)
must be equal. To be consistent with the shunt resistor, a tolerance of 0.5% was selected. To minimize power
consumption, 10kΩ resistors were used. To set the gain of the difference amplifier, the common-mode range
and output swing of the RS856X must be considered. Equation 3 and Equation 4 depict the typical commonmode range and maximum output swing, respectively, of the RS856X given a 3.3V supply.
-100mV<VCM<3.4V(3)100mV<VOUT<3.2V(4)
The gain of the difference amplifier can now be calculated as shown in Equation 5.
GainDiff_Am p =VOUT_Max VOUT_Min
3.2 V 100 mVV= 15.5=V
100 m[1 A ( 1A)]
RSHU NT (I MAX IMIN)(5)
The resistor value selected for R1 and R3 was 1kΩ. 15.4kΩ was selected for R2 and R4 because it is the nearest
standard value. Therefore, the ideal gain of the difference amplifier is 15.4 V/V.
The gain error of the circuit primarily depends on R1 through R4. As a result of this dependence, 0.1% resistors
were selected. This configuration reduces the likelihood that the design requires a two-point calibration. A simple
one-point calibration, if desired, removes the offset errors introduced by the 0.5% resistors.

9.6 Application Curve
3.30

1.65

0

1.0

0.5

0
Input Current (A)

0.5

1.0

Figure 20. Bidirectional Current-Sensing Circuit Performance: Output Voltage vs Input Current

15 / 23www.run-ic.com

RS8561,RS8562,RS8564
10 Layout10.1 Layout Guidelines
Attention to good layout practices is always recommended. Keep traces short. When possible, use a PCB groundplane with surface-mount components placed as close to the device pins as possible. Place a 0.1uF capacitor
closely across the supply pins.
These guidelines should be applied throughout the analog circuit to improve performance and provide benefits
such as reducing the EMI susceptibility.

10.2 Layout Example
+

VIN A

+

VIN B
VOUT ARG

VOUT B

RG

RF

RF

Figure 21. Schematic Representation
Place comp onen ts
close to device and toeach other to reduceparasitic errors.

OU T AVS+OU T AV+-IN A

OU T B

+IN A

-IN B

Use low-ES R,
ceramic bypass
capacitor. Place as
close to the device
as possible.

GND

RF

OU T B

GND
RG
VIN A

+IN B

Ground (GND) plane on another layer
GND

GND
RG

V-

Use low-ES R,
ceramic bypass
capacitor. Place as
close to the device
as possible.

RF

VS-

VIN B

Keep input traces shortand run the input traces
as far away fromthe supply line s
as possible.

Figure 22. Layout Example

16 / 23www.run-ic.com

RS8561,RS8562,RS8564
11 PACKAGE OUTLINE DIMENSIONSSOT23-5 (3)
D

1.90
b

2.59

E1

E

0.99
0.95

0.69

e
e1

RECOMMENDED LAND PATTERN (Unit: mm)

0.2
A A2

c

θ
L

A1

Dimensions In Millimeters

Dimensions In Inches

Min

Max

Min

Max

A (1)

1.050

1.250

0.041

0.049

A1

0.000

0.100

0.000

0.004

A2

1.050

1.150

0.041

0.045

b

0.300

0.500

0.012

0.020

c

0.100

0.200

0.004

0.008

D (1)

2.820

3.020

0.111

0.119

E (1)

1.500

1.700

0.059

0.067

E1

2.650

2.950

0.104

0.116

Symbol0.950(BSC) (2)e0.037(BSC) (2)

e1

1.800

2.000

0.071

0.079

L

0.300

0.600

0.012

0.024

θ

0°

8°

0°

8°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

17 / 23www.run-ic.com

RS8561,RS8562,RS8564
MSOP8 (3)
b

e

E

E1

4.8

1.02
D

0.65

0.41

RECOMMENDED LAND PATTERN (Unit: mm)

A2
c
A
A1

L

Symbolθ

Dimensions In Millimeters

Dimensions In Inches

Min

Max

Min

Max

A (1)

0.820

1.100

0.032

0.043

A1

0.020

0.150

0.001

0.006

A2

0.750

0.950

0.030

0.037

b

0.250

0.380

0.010

0.015

c

0.090

0.230

0.004

0.009

D (1)

2.900

3.100

0.114

0.122

0.650(BSC) (2)e0.026(BSC) (2)

E (1)

2.900

3.100

0.114

0.122

E1

4.750

5.050

0.187

0.199

L

0.400

0.800

0.016

0.031

θ

0°

6°

0°

6°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

18 / 23www.run-ic.com

RS8561,RS8562,RS8564
TSSOP14 (3)
e

E1

b

5.6

E

1.78
D

0.65

0.42

RECOMMENDED LAND PATTERN (Unit: mm)

A2

H

C

A
A1

θ

L

SymbolDimensions In Millimeters

Dimensions In Inches

Min

Min

Max

A (1)

Max

1.200

0.047

A1

0.050

0.150

0.002

0.006

A2

0.800

1.050

0.031

0.041

b

0.190

0.300

0.007

0.012

c

0.090

0.200

0.004

0.008

D (1)

4.860

5.100

0.191

0.201

E (1)

4.300

4.500

0.169

0.177

E1

6.250

6.550

0.246

0.650(BSC) (2)

e
L

0.500

H
θ

0.700

0.020

0.25(TYP)
1°

0.258
0.026(BSC) (2)0.028
0.01(TYP)

7°

1°

7°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

19 / 23www.run-ic.com

RS8561,RS8562,RS8564
SOP8 (3)
b

e

5.2

E

E1

2.2

D

1.27

0.6

RECOMMENDED LAND PATTERN (Unit: mm)

A2

c

A

A1

L

θ

Dimensions In Millimeters

Dimensions In Inches

Min

Max

Min

Max

A (1)

1.350

1.750

0.053

0.069

A1

0.100

0.250

0.004

0.010

A2

1.350

1.550

0.053

0.061

b

0.330

0.510

0.013

0.020

c

0.170

0.250

0.007

0.010

D (1)

4.800

5.000

0.189

Symbol1.270(BSC) (2)

e

0.197
0.050(BSC) (2)

E

5.800

6.200

0.228

0.244

E1 (1)

3.800

4.000

0.150

0.157

L

0.400

1.270

0.016

0.050

θ

0°

8°

0°

8°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

20 / 23www.run-ic.com

RS8561,RS8562,RS8564
SOP14 (3)
e

E

b

5.2

E1

1.27

0.6

D
1.27

RECOMMENDED LAND PATTERN (Unit: mm)

A2

c

A

θ

A1

L

Dimensions In Millimeters

Dimensions In Inches

Min

Max

Min

Max

A (1)

1.350

1.750

0.053

0.069

A1

0.100

0.250

0.004

0.010

A2

1.350

1.550

0.053

0.061

b

0.310

0.510

0.012

0.020

c

0.100

0.250

0.004

0.010

D (1)

8.450

8.850

0.333

Symbol1.270(BSC) (2)

e

0.348
0.050(BSC) (2)

E

5.800

6.200

0.228

0.244

E1 (1)

3.800

4.000

0.150

0.157

L

0.400

1.270

0.016

0.050

θ

0°

8°

0°

8°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

21 / 23www.run-ic.com

RS8561,RS8562,RS8564
12 TAPE AND REEL INFORMATIONREEL DIMENSIONSTAPE DIMENSION

Reel
DiameterReel Width(W1)

DIRECTION OF FEEDNOTE: The picture is only for reference. Please make the object as the standard.

KEY PARAMETER LIST OF TAPE AND REEL
SOT23-5

Reel
Diameter
7’’

Reel Width
(mm)
9.5

A0
(mm)
3.20

B0
(mm)
3.20

K0
(mm)
1.40

P0
(mm)
4.0

P1
(mm)
4.0

P2
(mm)
2.0

W
(mm)
8.0

Pin1
Quadrant
Q3

Package Type

MSOP8

13’’

12.4

5.20

3.30

1.50

4.0

8.0

2.0

12.0

Q1

TSSOP14

13’’

12.4

6.95

5.60

1.20

4.0

8.0

2.0

12.0

Q1

SOP8

13’’

12.4

6.40

5.40

2.10

4.0

8.0

2.0

12.0

Q1

SOP14

13’’

16.4

6.60

9.30

2.10

4.0

8.0

2.0

16.0

Q1

NOTE:
1. All dimensions are nominal.
2. Plastic or metal protrusions of 0.15mm maximum per side are not included.

22 / 23www.run-ic.com

RS8561,RS8562,RS8564
IMPORTANT NOTICE AND DISCLAIMER
Jiangsu RUNIC Technology Co., Ltd. will accurately and reliably provide technical and reliability data (including
data sheets), design resources (including reference designs), application or other design advice, WEB tools, safety
information and other resources, without warranty of any defect, and will not make any express or implied
warranty, including but not limited to the warranty of merchantability Implied warranty that it is suitable for a
specific purpose or does not infringe the intellectual property rights of any third party.
These resources are intended for skilled developers designing with RUNIC products You will be solely
responsible for: (1) Selecting the appropriate products for your application; (2) Designing, validating and testing
your application; (3) Ensuring your application meets applicable standards and any other safety, security or otherrequirements; (4) RUNIC and the RUNIC logo are registered trademarks of RUNIC INCORPORATED. All
trademarks are the property of their respective owners; (5) For change details, review the revision history
included in any revised document. The resources are subject to change without notice. Our company will not beliable for the use of this product and the infringement of patents or third-party intellectual property rights due
to its use.

23 / 23www.run-ic.com