インテル HPCプラットフォームの最新動向
インテル株式会社
事業開発本部 HPC事業開発担当
石川達郎
February 19, 2010
Copyright © Intel Corporation, 2010. All right reserved

Intel in High Performance Computing

A commitment to High Performance Computing
2Where Data Becomes Knowledge: HPC from Intel
Copyright © Intel Corporation, 2010. All right reserved

Balanced Solution To Deliver Real Results
The Intel® Xeon® Processor 5500 Series Based Platform• Intelligent PerformanceIntel® QPI up to 25.6 GB/sec
bandwidth per linkIntel® Xeon®
Processor
5500 SeriesIntel® Xeon®
Processor55
00 Series

QPI

DDR3 Memory
Up to 18 slots– Intel® Turbo Boost Technology– Intel® Hyper-Threading Technology– Intel® QuickPath Interconnect (Intel® QPI)– Large Memory Capacity• Automated Energy Efficiency
More Performance, Less Energy, MoreDensity– Dynamic Scalability– Intel® Intelligent Power Technology

PCI Express*
2.0 10GB/Sec
bandwidth

Unlocking Application Performance
Real Performance Is Almost Always Bandwidth Limited

3

Where Data Becomes Knowledge: HPC from Intel
Copyright © Intel Corporation, 2010. All right reserved

Coming: Intel® Server Processor (Westmere-EP)
Building on Intel® Xeon® 5500 Processor Series Performance• Socket CompatibleNEW!

• 32 nm process technology
with 50% more threads
and cache• Improved Energy
Efficiency with support for
1.35V low power memory

Intel® 5520
ChipsetPCI Express* 2.0Intel® X25-ESSDs4

ICH 9/10• Available 2010

Intel® 82599 10GbEController

Where Data Becomes Knowledge: HPC from Intel
Copyright © Intel Corporation, 2010. All right reserved

Coming: Nehalem-EX Platform
More Powerful, More Balanced Computing• Monolithic single die processor• Up to 8 Intel® microarchitecture (Nehalem)cores, 16 threads• Supports 2, 4 and 8 socket in glueless configs
and larger systems using Node Controller(NC)NehalemNehalem• 24MB shared L3 cache
I/O HUB• 2 integrated memory controllers• Intel® Scalable Memory Interconnect (Intel®
SMI) with support for up to 8 DDR channels

PCIExpress*

I/O HUB

NehalemNehalem

PCIExpress*• 4 Intel® QuickPath Interconnect (Intel® QPI)
links with up to 6.4GT/s“Super Node”
Increasing Available Resources
Larger More Complex problems Scalable Performance

5Where Data Becomes Knowledge: HPC from Intel

Nehalem-EX = Intelligent and Expandable High-End Intel® Server Platform, Codenamed Nehalem-EX Copyright © Intel Corporation, 2010. All right reservedGenerationsofPerformance
GainsIntel Xeon Processor 5500 Series Platforms®

®

Relative Performance
Higher is better

14X

Relative Performance

12X
10X

Intel® Xeon®
5500

Performance gains represent a blend(GEO mean) of five common 2-socket
workload types across a range of typicalusages

8X

Intel® Xeon®
5400
Intel® Xeon®
5300

6X

Intel® Xeon®
5100

4X
2X

12.05

6.12

4.57

2X

3.00
11.20

Single Core 2004

Single Core 2005

0X

Intel Single-Core

Dual-Core - 2006

Quad-Core 2007

Quad-Core 2008

Quad-Core 2009

Intel Multi-Core

4X
Source: Published/submitted/measured results March 30, 2009. Each bar represents the geo mean of best published results on five industry standard
benchmarks – SPECint*_rate_base2006, SPECfp*_rate_base2006, SPECjbb*2005, TPC*-C and SAP-SD*.
See backup slides for further information.

6

Where Data Becomes Knowledge: HPC from Intel
Copyright © Intel Corporation, 2010. All right reserved

Intel® Xeon® Processor - EXpandable(EX) Segment Roadmap
2007

2008

2009

FutureTODAY

Expandability and Scalability
Reliability, Availability, and Serviceability (RAS)
Designed for Demanding Apps and Large-Scale Consolidation
Westmere = Intel® microarchitecture, codenamed Westmere

7Nehalem-EX (NHM-EX)= High-End Intel® Server Platform, Codenamed Nehalem-EXCopyright © Intel Corporation, 2010. All right reserved

Scalable Processor Cores
COR
E1CO
R
E
2COR
E3COR
E
4CO
R
E
5CO
R
E6CO
R
E
7COR
E
8

Dynamically Scalable
Micro-architecture

SYSInterface• Up to 8 cores per socket• Intel® Hyper-Threading
Technology (2 threads/core)• 24MB shared last level cache• Intel® Turbo Boost Technology
for performance boost• CPU TDP: 130W; 105W; 95W

Core/Cache Interconnect

SYS
Interface
RouterIntegratedMemory
Controller02 SerialChannels

8QPI Link controller

4 Full-widthIntel®
QuickPathInterconnects(Intel® QPI)

IntegratedMemoryController12 Serial
Channels

Copyright © Intel Corporation, 2010. All right reserved

Scalable Sockets 2, 4, and up to 8+
Sample Platform Configurations
CPU 1

CPU22 Processors

IO HUBIO HUB

8 Processors
IO HUBIO HUB

CPU 2

CPU 4

CPU 2

CPU 4

CPU 6

CPU 8

CPU 1

CPU 3

CPU 1

CPU 3

CPU 5

CPU 7

IO HUB

9CPU2

IO HUB

4 Processors
IO HUBCPU 1

IO HUB

Glueless

3 peers at 1 hop
4 peers at 2 hops

IO HUB

Copyright © Intel Corporation, 2010. All right reserved

Scalable Memory Subsystem
Integrated Memory Controller(IMC):DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM

2 IMCs per socket
High capacity / bandwidth per controller:• Up to 8 DIMMs per memory controller• 4 DDR Channels for two SMI interface

REG
REG

S
M
B
SMI

DDR3DRAM
DDR3DRAMDRAM
DDR3DRAM
DDR3DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM

DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM

DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM

REG

REG

REG

REG

Integrated
MemoryController

DDR3DRAMDRAM
DDR3DRAM
DDR3DRAM
DDR3DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM

SMI

S
M
B

DDR3DRAM
DDR3DRAMDRAM
DDR3DRAM
DDR3DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM

DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM
REG
REG
DDR3DRAM
DDR3DRAMDRAM
DDR3DRAM
DDR3DDR3DRAM
DDR3DRAM
DDR3DRAM
DDR3DRAM

Scalable Memory Interface(SMI): High speed serial links for maximum
bandwidth Run in lockstep mode to minimize latencies& enable RAS

Scalable Memory Buffer(SMB):

 Memory buffer is on board or memory riser
 2 DDR channels & up to 4 DIMMs per buffer

Memory Capacity: Max population with 16GB DIMMS = 256 GB / Socket
Theoretical Peak Bandwidth: 50 GB/s/Socket
10Copyright © Intel Corporation, 2010. All right reserved

Scalable I/O PCIe Interconnect
PCI Express* (PCIe) Technology Configurationsx8 x8 x8 x8 x4

PCIe 2.0

I/O Hub

ICH
10x8 x8 x8 x8 x42x42x42x42x4

PCIe 2.0

ORI/O HubICH
10ESI Port or PCIe 1.0

ESI Port or PCIe 1.0

ICH10

OR

ESI Port or PCIe 1.0

I/O HubScalability:x8 x8 x8 x8 x4x162x2
PCIe 2.0

2 Sockets – up to 2 I/O Hubs = (72+10) Lanes
4 Sockets – 2 or 3 I/O Hubs = (72+10) or (108+14)Lanes
8 Sockets – 4 I/O Hubs = (144 + 18) Lanes
11Copyright © Intel Corporation, 2010. All right reserved

x16

Platform Capability Enhancement
Up to 8 cores
DDR3

Up to 6 cores

FSB

2007/8Platform

Intel® QPI

2009/10
Platform

FB-DIMMPCI Express* 1.0 Technology

PCI Express* 2.0 Technology
Peak CPU-CPU BW: 25.6 GB/s

Peak CPU-CPU BW: 8 GB/s
Peak CPU-Chipset: 34 GB/s
Peak Memory BW: 32 (FBD-667)

Peak I/O BW: 2.5GT/s , PCIe 1.0

Architectural Innovations:• Front Side Bus (FSB) to Intel®
QuickPath Interconnect withintegrated memory controller• FB-DIMM to DDR3
• PCI Express* Technology (PCIe)
1.0 to 2.0…

Peak CPU-Chipset: 102.4 GB/s
Peak Memory BW: 200 (DDR3-1067)
Peak I/O BW: 5GT/s, PCIe 2.0

Note: Peak Memory BW represents theoretical peak; not actual measurement
12Copyright © Intel Corporation, 2010. All right reserved

Intelligent and Expandable HighEnd Intel® Server Platform
BusinessDriverConsolidation

Performance
Memory Bandwidth

Nehalem-EX vs.
Intel Xeon® 7400
Up to 9X

High DataDemands

Database Performance>2.5X

Virtualization

Integer Throughput>1.7X

FP Throughput>2.2X

Scalability

Note: The comparison is based on 6-core Intel Xeon®7400 and 8-core Nehalem-EX
Nehalem-EX (NHM-EX)= High-End Intel® Server Platform, Codenamed Nehalem-EX

13

Copyright © Intel Corporation, 2010. All right reserved

Risk Factors
The above statements and any others in this document that refer to plans and expectations for the third quarter, the year and thefuture are forward-looking statements that involve a number of risks and uncertainties. Many factors could affect Intel’s actualresults, and variances from Intel’s current expectations regarding such factors could cause actual results to differ materially fromthose expressed in these forward-looking statements. Intel presently considers the following to be the important factors that could
cause actual results to differ materially from the corporation’s expectations. Ongoing uncertainty in global economic conditions posea risk to the overall economy as consumers and businesses may defer purchases in response to tighter credit and negative financial
news, which could negatively affect product demand and other related matters. Consequently, demand could be different fromIntel's expectations due to factors including changes in business and economic conditions, including conditions in the credit market
that could affect consumer confidence; customer acceptance of Intel’s and competitors’ products; changes in customer orderpatterns including order cancellations; and changes in the level of inventory at customers. Intel operates in intensely competitive
industries that are characterized by a high percentage of costs that are fixed or difficult to reduce in the short term and productdemand that is highly variable and difficult to forecast. Additionally, Intel is in the process of transitioning to its next generation ofproducts on 32nm process technology, and there could be execution issues associated with these changes, including product defects
and errata along with lower than anticipated manufacturing yields. Revenue and the gross margin percentage are affected by thetiming of new Intel product introductions and the demand for and market acceptance of Intel's products; actions taken by Intel'scompetitors, including product offerings and introductions, marketing programs and pricing pressures and Intel’s response to suchactions; and Intel’s ability to respond quickly to technological developments and to incorporate new features into its products. The
gross margin percentage could vary significantly from expectations based on changes in revenue levels; capacity utilization; start-up
costs, including costs associated with the new 32nm process technology; variations in inventory valuation, including variations
related to the timing of qualifying products for sale; excess or obsolete inventory; product mix and pricing; manufacturing yields;changes in unit costs; impairments of long-lived assets, including manufacturing, assembly/test and intangible assets; and thetiming and execution of the manufacturing ramp and associated costs. Expenses, particularly certain marketing and compensation
expenses, as well as restructuring and asset impairment charges, vary depending on the level of demand for Intel's products andthe level of revenue and profits. The current financial stress affecting the banking system and financial markets and the going
concern threats to investment banks and other financial institutions have resulted in a tightening in the credit markets, a reduced
level of liquidity in many financial markets, and heightened volatility in fixed income, credit and equity markets. There could be anumber of follow-on effects from the credit crisis on Intel’s business, including insolvency of key suppliers resulting in productdelays; inability of customers to obtain credit to finance purchases of our products and/or customer insolvencies; counterparty
failures negatively impacting our treasury operations; increased expense or inability to obtain short-term financing of Intel’soperations from the issuance of commercial paper; and increased impairments from the inability of investee companies to obtainfinancing. The majority of our non-marketable equity investment portfolio balance is concentrated in companies in the flash memory
market segment, and declines in this market segment or changes in management’s plans with respect to our investments in thismarket segment could result in significant impairment charges, impacting restructuring charges as well as gains/losses on equity
investments and interest and other. Intel's results could be impacted by adverse economic, social, political andphysical/infrastructure conditions in countries where Intel, its customers or its suppliers operate, including military conflict and othersecurity risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates. Intel'sresults could be affected by adverse effects associated with product defects and errata (deviations from published specifications),
and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust and other issues, such as thelitigation and regulatory matters described in Intel's SEC reports. A detailed discussion of these and other risk factors that could
affect Intel’s results is included in Intel’s SEC filings, including the report on Form 10-Q for the quarter ended June 27, 2009.
Rev. 7/27/09
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