Final Call for Papers

MOC2023
28th MICROOPTICS CONFERENCE
https://moc2023.com/Sponsored by

The Japan Society of Applied Physics (JSAP)

Organized byMicrooptics Group, JSAP

Technically co-sponsored by

M C

IEEE Photonics Society

In cooperation withOptica (formerly OSA) | The Optical Society of Japan | IEICE Electronics SocietyIEEE Photonics Society Tokyo Section Chapter | IEEE Photonics Society Kansai Chapter
IEEE Photonics Society Fukuoka Chapter | The Chemical Society of JapanThe Society of Polymer Science, Japan | The Laser Society of Japan
Optoelectronics Industry and Technology Development Association
Japan Optomechatronics Association | Japan Photonics Council (Some organizations are under negotiation.)

Sep. 24 (Sun.) - Sep. 27 (Wed.), 2023
Seagaia Convention Center in “Phoenix Seagaia Resort”,Miyazaki, Japan

Paper Deadline: April 28 (Fri.), 2023
PLENARY TALKS
Akihiko Kasukawa, Furukawa Electric Co., Ltd.
"Review of Semiconductor Lasers in Long Haul OpticalFiber Communications”
Marko Loncar, Harvard University"Integrated Lithium Niobate Photonics and Applications"
Martin Wegener, Karlsruhe Institute of Technology"3D Laser Micro- and Nanoprinting: Status andPerspectives”
INVITED TALKS
Yi-jen Chiu, National Sun Yat-sen University"High-speed Optical Modulation through the Quantum
Well Intermixing (QWI) Semiconductor Optical
Amplifier (SOA)-Integration Electroabsorption
Modulator (EAM)"
Yen-Hung Chen, National Central University"Integrated Photonic Quantum Sources and Circuits inLithium Niobate Platform"
Philippe Lalanne, CNRS, Inst. d'Optique"New Appearances with Random Metasurfaces"
Arka Majumdar, University of Washington"Non-volatile Programmable Photonics"
Vinod Menon,
The City College of New York
"Strong Exciton-Photon Coupling in 2D Materials "Aydogan Ozcan, University of California, Los Angeles"Diffractive Optical Networks & Computational
Imaging Without a Computer"
Jae-Hyeung Park, Inha University"Near Eye Displays for AR with Focus Cue andOcclusion Support"
Paolo Pintus, Karlsruhe Institute of Technology(Tentative) "An Integrated Magneto-Optic Modulator
for Cryogenic Applications"
William Shieh, University of Melbourne"Polarization-Multiplexing Short-Reach Optical
Interconnects"
Yikai Su, Shanghai Jiao Tong University"Scalability of Heterogeneous Photonic IntegratedCircuits"
SUNDAY SPECIAL SESSION "Social Optics"
On Sunday afternoon of September 24th, a special
session entitled “Social Optics” is scheduled.
Following distinguished speakers will deliver theirtalks focused on the mission of optics and relatedscience and technology in our present society.
Shinji Matsuo, NTT Device Technology Laboratory
Koji Mori, University of Miyazaki
Satoshi Wada, RIKENOBJECTIVE
The 28th MICROOPTICS CONFERENCE (MOC2023) will beheld at Seagaia Convention Center in Miyazaki Prefecture,
Japan in a hybrid format from September 24 to 27, 2023. Thisconference is sponsored by the Japan Society of Applied
Physics (JSAP) and organized by Microoptics Group and incooperation with several academic societies and associations.
The MOC2023 is intended to provide a central forum for an
update and review of scientific and technical information
covering a wide range of microoptics field from fundamental
researches to systems and applications.

CATEGORY
The category of the conference covers the following subjectsof microoptics;
1. Theory, Modeling, and Design
Aberrations, Dispersion, Beam optics, Guided-wave optics,
Gradient-index optics, Diffractive optics, Photonic band, Slowlight, Near-field optics, Nonlinear optics, Thermooptics,
Plasmonics, Metal optics, Quantum optics/photonics,
Biomimetic optics, Metaoptics, Simulation and system design,etc.
2. Materials and Fabrication
Semiconductors, Crystals, Dielectric materials, Polymers,
Liquid crystals, Nonlinear materials, Composite materials,
Nano-materials, Transparent conductors, Magneto-opticmaterials, Spin-materials, Metamaterials, Nanocarbons, etc.
Micro- and nano-fabrication, Nano-imprint, Laser processing,
Heterogeneous bonding, 3D printing, Optical manipulation, etc.
3. Measurement and Sensing
Spectroscopy,
Interferometry,
Reflectometry,
Ultrafastmeasurement, 3D measurement, Quantum measurement,
LiDAR, etc.
4. EO/OE and Active Devices
Lasers, LEDs, VCSELs, Array lasers, Amplifiers, Photodetectors, Terahertz devices, Optical imaging sensors, Solarcells, Energy harvesting devices, etc.
5. Passive Devices
Fibers,Waveguides,
Multi/demultiplexers,
Add-dropmultiplexers, Branching and mixing components, Photonic

SUBMISSION OF PAPERS
Original papers that have not been previously presented
and that describe new technical contributions to the areas
covered by the technical descriptions in theaforementioned category will be accepted for presentation
by peer review by program committee members. A
detailed instruction will be available from the following
Web site.
https://moc2023.com/
Papers should be submitted electronically no later thanApril 28 (Fri.), 2023. Authors will be requested to submit
a 2-page paper written in English, including text, figures,tables, and references within a frame of 17 cm x 24 cm.
The paper template will be available through the Web site.
ORAL SESSION
Oral session will be conducted in a hybrid format withboth on-site and virtual versions. The detailed
information will be announced on the web site.
POSTER SESSION
In addition to regular oral presentation sessions, aposter presentation session will be planned to stimulate
detailed explanation and discussion. The author(s) ofpapers will be informed of the size of bulletin board for
displaying summary, figures, tables, etc., when selected
as poster papers. Online poster session is underconsideration.

crystals, Filters, Microlenses, Diffractive optical elements,
Isolators, Polarizers, etc.
6. Dynamic and Functional Devices
MEMS, Switches, Modulators, Tunable devices, Wavelength
converters, Nonlinear optical devices, Deflectors, Opticalbuffers, etc.
7. Integration, Packaging, and Si photonics
Monolithic and hybrid integration, Mounting and packaging,Micro-assembly, Wafer-level assembly, 3D integration, etc.
8. System and Design Conception

APPLICATION FIELD
The 28th MICROOPTICS CONFERENCE covers microoptics
technologies in the following major topical fields;
A. Optical Communications
Photonic networks, Optical routing, Advanced multiplexing,
LAN, FTTH, Wireless optical communication, etc.
B. Optical Interconnects
Chip/board/system interconnects, Active optical cable, etc.
C. Optoelectronic Equipment
Optical storages, Laser and LED printers, Smart sensors,
Advanced cameras, Advanced microscopes, etc.
D. Optical Sensing and Processing
Optics for image recognition, Physical measurements, 3Dmeasurements, Sensors and sensing systems, Securitysystems, Optical computing, Bio- and medical sensing,
Tomography, etc.
E. Displays and Lighting
LCD, Laser/LED/EL displays, MEMS displays, 3D displays,
Projection displays, μ-LED displays, Wearable displays,
AR/VR-glass，head mounted displays, Flexible displays, Solidstate lighting, Illuminations, Appearance design and control, etc.
F. New Applications and Emerging Technologies
Green photonics, Environmental and energy optics, Bio- andmedical optics, Nano-photonics, Quantum systems, Next
generation and intelligent microoptics, Car optics, Agriculturaland fishery optics, Optical wireless power transmission, AI andIoT, etc.

POST-DEADLINE PAPER
A limited number of post-deadline papers will be
accepted for presentation at post-deadline sessions. The
latest significant results obtained after the regulardeadline are most welcome.
PAPER PUBLICATION
Accepted papers will be published in IEEE Xplore inaddition to the conference technical digest. The authors
would also have a chance to publish an extended, fulllength version of the paper presented at MOC2023 in a
special issue of the JJAP, which is an international
journal published by the Japan Society of Applied
Physics and IOP publishing. The special issue of theJJAP is planned to be published in 2024.
PAPER AWARDSThe MOC Paper Award will be given to several
excellent contributed papers. Moreover, the MOC
Student Award will be given to several students who
presented excellent papers.
FINANCIAL SUPPORT FOR OVERSEAS STUDENTS
Limited financial support is considered for thepresentations by students from overseas. Details will beannounced on the website: https://moc2023.comOFFICIAL LANGUAGE
The official language of MOC2023 is English.
CONFERENCE VENUEThe MOC2023 will take place at Seagaia Convention
Center, Miyazaki, Japan.
Seagaia Convention Center, Phoenix Seagaia Resort
Hamayama Yamasaki-cho, Miyazaki City, Miyazaki
Prefecture, Japan
Tel +81 985 21 1111
https://seagaia.co.jp/english/access/
ACCESS
Miyazaki is approximately 90 minutes by air from Tokyo.
The Seagaia Convention Center is a 25-minute taxi or bus
ride from Miyazaki Airport.

REGISTRATION
Registration Fees
Before/On Aug. 23 After Aug. 24General¥47,000¥52,000
Student, Retiree¥17,000¥20,000*The conference fee includes admission to MOC2023
and a Technical Digest.
*Additional fee is needed for the conference party.
Those who wish to attend MOC2023 should register
online at https://moc2023.com/All payment should be made in Japanese yen by one of
the following methods:

1. Credit card
Master Card, VISA, American Express, Diners Club and
JCB are available. Personal checks are NOT accepted.
Pre-registration, by August 23, 2023, is encouraged andwill be entitled to reduced fees. Upon receipt of registration
information and payment, MOC2023 Registration Deskwill send an e-mail of confirmation.

2. Bank transfer(For domestic attendees only)
三井住友銀行 本店営業部
口座番号：（普通）200-4180310
口 座 名：公益社団法人応用物理学会 （コウエキシャダンホウジンオウヨウブツリガッカイ）

About Miyazaki
Miyazaki City is a resort spot on the southeast side of
Kyushu Island. A beautiful coastline stretches out here.
The mild climate makes it easy to spend time here all
year round. Fans from all over the world visit the leading
golf courses and surf spots of Japan. Legends of ancientJapan remain and the shrines are also a highlight. Youwill find plenty of tasty foods here. These include
Miyazaki beef - the best beef in Japan - as well as
charcoal grilled chicken and ripe mangos. For detail onsightseeing, visit the following website.
https://visitmiyazaki.com

REGISTRATION CANCELLATION POLICYNo refunds of the registration fee will be made for any
reasons whatever. In case of registrant unable to attend
the conference, Technical Digest (PDF format) will be sent
after the conference.
CONTACT
MOC2023 Registration Desk
Secretariat of Microoptics Group2325-26 Shimokawai-cho, Asahi-ku, Yokohama 241-0806,
Japan
Phone: +81- 80-5412-0844, Fax: +81- 45-954-2777
E-mail: ogura@comemoc.com
FURTHER INFORMATION
The latest information will be also presented on theweb site:
https://moc2023.com/ (QR code)MOC2023 COMMITTEE MEMBERS
ORGANIZING COMMITTEE
Conference Co-chairs
T. Sato (NTT Corp.)
T. Watanabe (Kagoshima Univ.)

PROGRAM COMMITTEE
Co-chairs
S. Kimura (Toshiba Corp.)
K. Ogawa (Japan Women's Univ.)

Members
T. Aoki (Waseda Univ.)
M. Bunsen (Fukuoka Univ.)
T. Endo (Mitsubishi Electric Corp.)
K. Hotate (Toyota Tech. Institute)
Y. Katano (Japan Broadcasting Corp.)
K. Kato (Kyushu Univ.)
K. Kishino (Sophia Univ.)
Y. Koike (Keio Univ.)
T. Kojima (Fuji Xerox Co., Ltd.)K. Kuroda (Utsunomiya Univ.)
Y. Lee (Hitachi, Ltd.)T. Maeda (Waseda Univ.)
K. Maru (Kagawa Univ.)
M. Mori (AIST)
S. Saito (Toshiba Corp.)
H. Shoji (Sumitomo Electric Ind., Ltd.)Y. Takada (Nikon Corp.)
H. Takahashi (Pioneer Corp.)
H. Takahashi (Oki Electric Industry Co., Ltd.)Y. Takiguchi (Hamamatsu Photonics K. K.)
K. Tsunetomo (Nippon Sheet Glass Co., Ltd.)K. Ueyanagi (TSS Co., Ltd.)Y. Uozu (Mitsubishi Chemical Corp.)
S. Ura (Kyoto Inst. Tech.)
Y. Yamagata (Fujikura Ltd.)I. Yamaguchi (Toyo Seiki Seisaku-sho Ltd.)T. Yatagai (Utsunomiya Univ.)

Domestic Members*
T. Arakawa (Yokohama National Univ.)
H. Fuji (Osaka Univ.)
K. Hamamoto (Kyusyu Univ.)
G. Hatakoshi (Toshiba Corp., retired)T. Hamaguchi (Sony Semiconductor Solutions Corp.)
K. Iga (Tokyo Inst. Tech.)
D. Inoue (Sumitomo Electric Ind., Ltd)
H. Ishii (Furukawa Electric Co., Ltd.)S. Iwamoto (Univ. Tokyo)
R. Katayama (Fukuoka Inst. Tech.)
T. Kita (Waseda Univ.)
S. Kogo (Konica Minolta, Inc.)
Y. Kokubun (Inst. Tech.)
R. Kou (AIST)
M. Kuwata (Mitsubishi Electric Corp.)
T. Miyamoto (Tokyo Inst. Tech.)
T. Mizumoto (JSPS)
N. Mori (Yamashita Denso Corp.)
R. Morohashi (Fujikura Ltd.)
H. Nakajima (Waseda Univ.)
S. Saito (Hitachi, Ltd.)
A. Sakai (Ricoh Co., Ltd.)O. Sugihara (Utsunomiya Univ.)
H. Takahashi (Sophia Univ.)
Y. Tsuchiya (Nagoya Inst. Tech.)
T. Yamaguchi (Kogakuin Univ.)
K. Yamamoto (Osaka Univ.)
S. Yamashita (Univ. Tokyo)
K. Yokomori (Hirosaki Univ.)*All domestic members are also organizing committee
members.

LOCAL STEERING COMMITTEE
ChairM. Arai (Univ. Miyazaki)
Members
A. Fukuyama (Univ. Miyazaki)
A. Kameyama (Univ. Miyazaki)
K. Maeda (Univ. Miyazaki)
Y. Naka (Univ. Miyazaki)
A. Yokotani (Univ. Miyazaki)
INTERNATIONAL ADVISORY COMMITTEE
R. Baets (Univ. Gent)
A. Brӓuer (Fraunhofer IOF)
C. J. Chang-Hasnain (UC Berkeley)
K. J. Ebeling (Ulm Univ.)
S. Fleming (Univ. Sydney, retired)
M. T. Flores-Arias (Univ. Santiago de Compostela)
B. Y. Kim (KAIST)K. Kodate (Univ. Electro-Communications)Y. -H. Lee (KAIST)K. Nishizawa (Mirai IPTRC)
Y. Okino (Kansai Univ.)
Y.-P. Park (Yonsei Univ.)
G. C. Righini (Nello Carrara Inst. Appl. Phys., CNR)
P. Russell (Max Planck Institute)
H. K. Shin (Opticis Co., LTD)
Y. Suematsu (Tokyo Inst. Tech.)
C. S. Tsai (UC Irvine)
D. P. Tsai (City Univ. Hong Kong)
M. C. Wu (UC Berkeley)Overseas Members
E. Acosta (Univ. Santiago de Compostela)
K.-S. Chiang (City Univ. Hong Kong)
Y.-J. Kim (Yonsei Univ.)
S.-L. Lee (Taiwan Tech.)
T.-C. Lu (National Yang Ming Chiao Tung Univ.)
Y. Luo (Tsinghua Univ.)
H. Ottevaere (Vrije Univ. Brussel)
N.-C. Park (Yonsei Univ.)
S. Park (Samsung Electronics Corp.)
H. Tan (Australian National Univ.)
Z. J. Wong (Texas A&M Univ.)
K. -T. Yong (Nanyang Technological Univ.)
K. Yu (KAIST)
U. D. Zeitner (Fraunhofer IOF)TECHNICAL ADVISOR
H. Nakajima (Waseda Univ.)
LIAISON ADVISOR
K. Yokomori (Hirosaki Univ.)
SECRETARIAT
Y. Ogura (Microoptics Group)
Some members are under negotiation.

Financially Supported by
National Institute of Information and Communications Technology (NICT)