RCX200N20
DatasheetNch 200V 20A Power MOSFET
Outline

VDSS

200V

RDS(on) (Max.)

130m

ID20A

PD48W

Features

TO-220FM(1) (2)(3)

Inner circuit

1) Low on-resistance.
2) Fast switching speed.

(1) Gate(2) Drain(3) Source∗13) Drive circuits can be simple.
4) Parallel use is easy.
(1)

(2)

1 BODY DIODE(3)5) Pb-free lead plating ; RoHS compliant6) 100% Avalanche tested

Packaging specifications
Packaging

BulkReel size (mm)-Tape width (mm)-Automotive Motor Drive

Quantity (pcs)

500Automotive Solenoid Drive

Taping code-Application
Switching Power Supply

TypeMarking

RCX200N20

Absolute maximum ratings(Ta = 25°C)
Parameter

SymbolValue

Unit

VDSS

200V

Tc = 25°C

ID *1

20

A

Tc = 100°C

ID *1

10.8

A

80

A

Drain - Source voltage
Continuous drain current*2

Pulsed drain current

ID,pulse

Gate - Source voltage

VGSS

30

V

Avalanche energy, single pulse

EAS *3

32.3

mJ

Avalanche current

IAR *3

10A

Tc = 25°C

PD48

W

Ta = 25°C

PD

2.23

W

Junction temperature

Tj

150°C

Range of storage temperatureTstg

55 to 150°C

Power dissipationwww.rohm.com© 2015 ROHM Co., Ltd. All rights reserved.

1/12

2019.05 - Rev.C

Data Sheet

RCX200N20
Thermal resistance
ValuesParameter

Unit

Symbol
Min.

Typ.

Max.

Thermal resistance, junction - case

RthJC

--

2.57°C/W

Thermal resistance, junction - ambient

RthJA--56°C/W

Soldering temperature, wavesoldering for 10s

Tsold--265°C

Electrical characteristics(Ta = 25°C)
ValuesParameter
Drain - Source breakdown voltage

SymbolV(BR)DSS

UnitConditions
VGS = 0V, ID = 1mA

Min.

Typ.

Max.

200----25V

VDS = 200V, VGS = 0V
Zero gate voltage drain current

IDSSTj = 25°C

A

VDS = 200V, VGS = 0V--100

Tj = 125°C
Gate - Source leakage current

IGSS

VGS = 30V, VDS = 0V--

100nA

Gate threshold voltage

VGS (th)VDS = 10V, ID = 1mA

3.0-

5.0V

VGS = 10V, ID = 10A-

100

130-

220

310

4.99.8-

Static drain - sourceon - state resistanceRDS(on) *4 VGS = 10V, ID = 10AmTj = 125°C
Forward transfer admittancewww.rohm.com© 2015 ROHM Co., Ltd. All rights reserved.

gfs

VDS = 10V, ID = 10A

2/12S

2019.05 - Rev.C

Data Sheet

RCX200N20
Electrical characteristics(Ta = 25°C)
ValuesParameter

SymbolConditions

Unit
Min.

Typ.

Max.

Input capacitanceCiss

VGS = 0V

-

1900

-

Output capacitanceCoss

VDS = 25V-

120-

Reverse transfer capacitanceCrssf = 1MHz-70-

Turn - on delay timetd(on)VDD ⋍ 100V, VGS = 10V-35-

Rise timetr *4

ID = 10A-100-

Turn - off delay timetd(off)

RL = 10-60-Fall timetf

RG = 10-45-*4*4*4pF

nsGate Charge characteristics(Ta = 25°C)
ValuesParameter

Symbol*4Total gate charge

Qg

Gate - Source charge

Qgs *4Gate - Drain charge

Qgd

Gate plateau voltage

V(plateau)*4Conditions

Unit
Min.

Typ.

Max.

VDD ⋍ 100V-40-

ID = 10A-

15-

VGS = 10V-

15-

VDD ⋍ 100V, ID = 10A-

8.0-

nCV

Body diode electrical characteristics (Source-Drain)(Ta = 25°C)
ValuesParameter

SymbolIS*1Pulsed source current

ISM

*2

Forward voltageVSD*4Reverse recovery timetrr

Reverse recovery charge

Qrr

Continuous source current*4*4Conditions

UnitMin.

Typ.

Max.

--20A--80

A

VGS = 0V, IS = 20A

--

1.5V

IS = 10A
di/dt = 100A/s-100

-

ns-

350-

nC

Tc = 25°C*1 Limited only by maximum temperature allowed.
*2 Pw  10s, Duty cycle  1%
*3 L ⋍ 500H, VDD = 50V, Rg = 25, starting Tj = 25°C
*4 Pulsed

www.rohm.com© 2015 ROHM Co., Ltd. All rights reserved.

3/12

2019.05 - Rev.C

Data Sheet

RCX200N20
Electrical characteristic curves

Fig.2 Maximum Safe Operating Area

Fig.1 Power Dissipation Derating Curve

1000
Ta=25ºCSingle Pulse

100100PW = 100s

Drain Current : ID [A]Power Dissipation : PD/PD max. [%]

12080
60
40
20010
PW = 1ms

Operation in thisarea is limitedby RDS(on)10.1

PW = 10ms

0.010255075100

125

1500.1

175

1101001000

Drain - Source Voltage : VDS [V]Junction Temperature : Tj [°C]

Normalized Transient Thermal Resistance : r(t)Fig.3 Normalized Transient ThermalResistance vs. Pulse Width
10Ta=25ºC
Single Pulse
Rth(j-c)(t) = r(t)×Rth(ch-c)Rth(j-c) = 56ºC/W
10.1

0.01
0.0001

top D = 1
D = 0.5
D = 0.1
D = 0.05
D = 0.01
D = Single

0.01

1100

Pulse Width : PW [s]www.rohm.com© 2015 ROHM Co., Ltd. All rights reserved.

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2019.05 - Rev.C

Data Sheet

RCX200N20

Fig.4 Avalanche Current vs Inductive Load

Fig.5 Avalanche Energy Derating Curvevs Junction Temperature

100120VDD=50V,RG=25
VGF=10V,VGR=0VStarting Tch=25ºCAvalanche Energy : EAS / EAS max. [%]Avalanche Current : IAS [A]Electrical characteristic curves

1010.10.010.1

1101008060402000100

Coil Inductance : L [mH]

5075100125150175

Junction Temperature : Tj [°C]

Fig.7 Typical Output Characteristics(II)Fig.6 Typical Output Characteristics(I)205
Ta=25ºC
Pulsed4.5

VGS=10.0V

Drain Current : ID [A]3.5
3
VGS=6.5V2
1.5
VGS=6.0V

1

VGS=5.5V

0.5

VGS=8.0V

Ta=25ºC
Pulsed16

VGS=7.0V

2.5

VGS=10.0V18

VGS=8.0V

4

Drain Current : ID [A]2514

VGS=7.0V

12108

VGS=6.5V

6

VGS=6.0V

4

VGS=5.5V

20000.2

0.4

0.6

0.80146810

Drain - Source Voltage : VDS [V]Drain - Source Voltage : VDS [V]www.rohm.com© 2015 ROHM Co., Ltd. All rights reserved.

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2019.05 - Rev.C

Data Sheet

RCX200N20

Fig.8 Breakdown Voltage
vs. Junction Temperature

Fig.9 Typical Transfer Characteristics

280

100
VGS = 0V
ID = 1mA

270

VDS= 10V
10260
250

Drain Current : ID [A]Normarize Drain - Source Breakdown Voltage: V(BR)DSS [V]Electrical characteristic curves

2402302202102001
Ta= 125ºC
Ta= 75ºC
Ta= 25ºC
Ta= 25ºC

0.10.01

1900.001

180-500501000150

1345678910Gate - Source Voltage : VGS [V]Fig.10 Gate Threshold Voltage
vs. Junction Temperature

Fig.11 Transconductance vs. Drain Current

5.0100VDS= 10VVDS = 10V
ID = 1mA
4.5Transconductance : gfs [S]Gate Threshold Voltage : VGS(th) [V]

Junction Temperature : Tj [°C]24.03.5

3.02.5-50 -25025507510.1

0.010.01

100 125 150Junction Temperature : Tj [°C]www.rohm.com© 2015 ROHM Co., Ltd. All rights reserved.

10Ta= 25ºC
Ta=25ºC
Ta=75ºC
Ta=125ºC

0.1110100Drain Current : ID [A]

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2019.05 - Rev.C

Data Sheet

RCX200N20
Electrical characteristic curves

Fig.12 Static Drain - Source On - StateResistance vs. Gate Source Voltage

1000
Ta=25ºC

250
ID = 10A

200

ID = 20A
15010050005101520

Static Drain - Source On-State Resistance: RDS(on) [m]300

Static Drain - Source On-State Resistance: RDS(on) [m]Fig.13 Static Drain - Source On - StateResistance vs. Drain Current(I)Gate - Source Voltage : VGS [V]Ta=25ºC
VGS= 10V

100

100.010.1

110100Drain Current : ID [A]Fig.14 Static Drain - Source On - StateResistance vs. Junction Temperature
Static Drain - Source On-State Resistance: RDS(on) [m]300
VGS = 10V
ID = 10A

250200150
100500-50050100150

Junction Temperature : Tj [ºC]www.rohm.com© 2015 ROHM Co., Ltd. All rights reserved.

7/12

2019.05 - Rev.C

Data SheetRCX200N20
Electrical characteristic curves

Fig.15 Static Drain - Source On - StateResistance vs. Drain Current(II)Fig.16 Drain Current Derating Curve
120

VGS= 10V
100

Drain Current Dissipation: ID/ID max. (%)

Static Drain - Source On-State Resistance: RDS(on) [m]

10000

Ta=125ºC
Ta=75ºC
Ta=25ºC
Ta= 25ºC

1000

100

80
60
40
200100.010.1

1100100

Drain Current : ID [A]www.rohm.com© 2015 ROHM Co., Ltd. All rights reserved.

255075100

125150175

Junction Temperature : Tj [°C]8/122019.05 - Rev.C

Data SheetRCX200N20Electrical characteristic curves

Fig.17 Typical Capacitancevs. Drain - Source Voltage

Fig.18 Switching Characteristics
1000010000
Cisstf1000

Switching Time : t [ns]1000

Capacitance : C [pF]

Ta=25ºC
VDD= 100V
VGS= 10V
RG=10

Coss

100
Crss
10
Ta = 25ºC
f = 1MHz
VGS = 0V

td(off)100

td(on)

10tr

1

10.01

0.1

1

10100

0.01

1000

Drain - Source Voltage : VDS [V]

0.1

1

10100

Drain Current : ID [A]Fig.19 Dynamic Input Characteristics

Gate - Source Voltage : VGS [V]20
Ta=25ºC
VDD= 100VID= 10A
RG=1015105001020304050607080Total Gate Charge : Qg [nC]www.rohm.com© 2015 ROHM Co., Ltd. All rights reserved.

9/12

2019.05 - Rev.C

Data Sheet

RCX200N20
Electrical characteristic curves

Fig.20 Source Current
vs. Source - Drain Voltage

Fig21 Reverse Recovery Time
vs.Source Current

100

1000

Source Current : IS [A]10Reverse Recovery Time : trr [ns]VGS=0V

Ta=125ºC
Ta=75ºC
Ta=25ºC
Ta= 25ºC

10.1

Ta=25ºC
di / dt = 100A / s
VGS = 0V100

100.01
0.00.51.00.1

1.5

Source-Drain Voltage : VSD [V]www.rohm.com© 2015 ROHM Co., Ltd. All rights reserved.

110100Source Current : IS [A]

10/12

2019.05 - Rev.C

Data Sheet

RCX200N20
Measurement circuits
Fig.1-1 Switching Time Measurement Circuit
VGS

Fig.1-2 Switching Waveforms
Pulse width

ID

VDS
RL

D.U.T.

50%

10%

VDD

RG

90%

50%10%

VGS
VDS

10%

90%
td(on)
ton

Fig.2-1 Gate Charge Measurement Circuit
VGStf
toff

Fig.2-2 Gate Charge Waveform
VGID

VDSQg

RL

VGS

D.U.T.

IG(Const.)

90%
td(off)

trQgs

VDD

Qgd

ChargeFig.3-1 Avalanche Measurement Circuit
VGSIAS

D.U.T.
RG

Fig.3-2 Avalanche Waveform

VDS
L

V(BR)DSS
IAS

VDD
VDD
EAS =www.rohm.com© 2015 ROHM Co., Ltd. All rights reserved.

11/12

122

L IAS

V(BR)DSS
V(BR)DSS - VDD

2019.05 - Rev.C

Data Sheet

RCX200N20
Dimensions (Unit : mm)
D

TO-220FM

E

A

E1

A1

A

A2

A4F

φpb1

L

Q

ceb

DIM
A
A1A2
A4bb1cDEeE1FLp
Q
xx

A

MILIMETERS
MIN
MAX
16.60
17.60
1.80
2.20
14.80
15.40
6.80
7.20
0.70
0.85
1.10
1.50
0.70
0.85
9.90
10.30
4.40
4.80
2.54
2.70
3.00
2.80
3.20
11.50
12.50
3.00
3.40
2.10
3.10
0.381

INCHES
MIN
0.654
0.071
0.583
0.268
0.028
0.043
0.028
0.39
0.173

MAX
0.693
0.087
0.606
0.283
0.033
0.059
0.033
0.406
0.189
0.10

0.106
0.11
0.453
0.118
0.083
-0.118
0.126
0.492
0.134
0.122
0.015

Dimension in mm/incheswww.rohm.com© 2015 ROHM Co., Ltd. All rights reserved.

12/12

2019.05 - Rev.CNoticePrecaution on using ROHM Products
1.

Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transportequipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury orserious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for anydamages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for SpecificApplications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPANUSAEU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ

2.

ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, whicha failure or malfunction of our Products may cause. The following are examples of safety measures:[a] Installation of protection circuits or other protective devices to improve system safety[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure3.

Our Products are designed and manufactured for use under standard conditions and not under any special orextraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
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product performance, reliability, etc, prior to use, must be necessary:[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,H2S, NH3, SO2, and NO2[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items[f] Sealing or coating our Products with resin or other coating materials[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering[h] Use of the Products in places subject to dew condensation

4.

The Products are not subject to radiation-proof design.

5.

Please verify and confirm characteristics of the final or mounted products in using the Products.

6.

In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affectproduct performance and reliability.

7.

De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.

8.

Confirm that operation temperature is within the specified range described in the product specification.

9.

ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined inthis document.

Precaution for Mounting / Circuit board design
1.

When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect productperformance and reliability.

2.

In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E© 2015 ROHM Co., Ltd. All rights reserved.

Rev.004

Precautions Regarding Application Examples and External Circuits
1.

If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of thecharacteristics of the Products and external components, including transient characteristics, as well as static
characteristics.

2.

You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not beapplied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation
1.

Product performance and soldered connections may deteriorate if the Products are stored in the places where:[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation[d] the Products are exposed to high Electrostatic

2.

Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time isexceeding the recommended storage time period.

3.

Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.

4.

Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products ofwhich storage time is exceeding the recommended storage time period.

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A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

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When disposing Products please dispose them properly using an authorized industry waste company.

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Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
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No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
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1.

This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2.

The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior writtenconsent of ROHM.

3.

In no event shall you use in any way whatsoever the Products and the related technical information contained in theProducts or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.

4.

The proper names of companies or products described in this document are trademarks or registered trademarks ofROHM, its affiliated companies or third parties.

Notice-PGA-E© 2015 ROHM Co., Ltd. All rights reserved.

Rev.004

Datasheet
General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a nyROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any priornotice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.

3.

The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible orliable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of orconcerning such information.

Notice – WE

© 2015 ROHM Co., Ltd. All rights reserved.

Rev.001