Datasheet

Synchronous Buck-Boost DC/DC Converterwith 2 A Switches (VIN = 2.0 V to 5.5 V, 1ch)
BD83070GWLKey Specifications

General Description

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The BD83070GWL is a synchronous buck-boost DC/DC
convertor providing 3.3 V or 2.5 V output from single-cell
Li-ion battery or other input between 2.0 V and 5.5 V. It
has the capability to support up to 1 A output over input
voltage range of 2.7 V to 5.5 V. It seamlessly changes
between buck and boost operations depending on the
input voltage.
It is based on pulse width modulation (PWM) andprovides high efficiency for heavy load. While in PWM
operation, internal FETs switch at fixed frequency 1.5
MHz typical. It automatically changes over control
system to hysteresis pulse frequency modulation (PFM)
to suppress switching loss and current consumption
during light load. Battery drain fall down to only 2.8 μA
typical at no load current. It is possible to disable
auto-PFM/PWM mode by the MODE pin for suppressing
output ripple and fixed frequency switching.
The device is packaged in a 1.2 mm x 1.6 mm WLCSP
package.

Package
UCSP50L1C (12Pin)

2.0 V to 5.5 V
2.5 V or 3.3 V
1 A(Max)
1.5 MHz(Typ)2.8 μA(Typ)-40 °C to +85 °C

W(Typ) x D(Typ) x H(Max)1.20 mm × 1.60 mm × 0.57 mm

Applications
 Single Cell Li-ion or 3 Cell NiMH Battery-Powered
Portable Products Tablet Terminal Device
 Smartphone

Features
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Input Voltage Range:
Output Voltage:
Output Current:
Switching Frequency:
Quiescent VIN Current:
Operating Temperature Range:

Synchronous Buck-Boost DC/DC Converter
Automatic PFM/PWM Transition
Output Current: Up To 1 A (VIN > 2.7 V, VOUT = 3.3 V)
Selectable Output Voltage: 2.5 V or 3.3 V
Efficiency: Up To 95 %UVLO Detection: 1.61 V(Max)
Built-in Thermal, Over Voltage, And Over Current
Protection

Typical Application Circuit
L1: 1.5 μH

VIN
2.0 V to 5.5 V

LX1

LX2

PVIN

VOUT

C1: 10 μF

FB

VOUT
3.3 V (up to 1 A)
C2: 22 μF

VIN
ON

EN

OFF

VSEL

Forced-PWM
Auto-PFM/PWM

MODE
GND

REF
PGND

C3: 0.47 μF

Figure 1. Typical Application Circuit〇Product structure : Silicon integrated circuit.www.rohm.com© 2018 ROHM Co., Ltd. All rights reserved.
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BD83070GWL

Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Key Specifications .......................................................................................................................................................................... 1
Package .......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Typical Application Circuit ............................................................................................................................................................... 1
Contents ......................................................................................................................................................................................... 2
Pin Configuration ............................................................................................................................................................................ 3
Pin Descriptions .............................................................................................................................................................................. 3
Block Diagram ................................................................................................................................................................................ 4
Absolute Maximum Ratings ............................................................................................................................................................ 4
Thermal Resistance ........................................................................................................................................................................ 5
Recommended Operating Conditions ............................................................................................................................................. 5
Electrical Characteristics................................................................................................................................................................. 5
Detailed Descriptions ...................................................................................................................................................................... 7
Typical Performance Curves ........................................................................................................................................................... 8
Application Examples ................................................................................................................................................................... 15
I/O Equivalence Circuits................................................................................................................................................................ 16
Operational Notes ......................................................................................................................................................................... 17
Ordering Information ..................................................................................................................................................................... 19
Marking Diagram .......................................................................................................................................................................... 19
Physical Dimension and Packing Information ............................................................................................................................... 20
Revision History ............................................................................................................................................................................ 21

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Pin Configuration

1

2

3

EN

GND

REF

FB

MODE

VIN

C

VOUT

VSEL

PVIN

D

LX2

PGND

LX1

Top View
Figure 2. Pin Configuration

Pin Descriptions
Pin No.

Pin Name

A1

EN

A2

GND

A3

REF

B1

FB

B2

MODE

B3

VIN

C1

VOUT

C2

VSEL

C3

PVIN

D1
D2
D3

LX2
PGND
LX1

Function
Enable pin of the DC/DC converter. Inputting high (≥ 1.2 V) the EN pin turns on the regulator.
Inputting low (≤ 0.4 V) or open the EN pin turns off the regulator.
Ground for sensing
Linear regulator output for power supply of internal circuits. Connect ceramic capacitor (0.47μF) between this pin and the GND pin for output stability. Do not connect the other devices.
Voltage feedback pin. Connect this pin to the VOUT pin.
Mode selection pin. Low (≤ 0.4 V): Auto-PFM/PWM mode. High (≥ 1.2 V): Forced-PWM mode.
Do not leave this pin floating.
Power supply input of controller. Connect this pin to the PVIN pin.
Output pin of the DC/DC converter. Connect ceramic capacitor (22 μF recommended) between
this pin and the PGND pin for output stability.
Output voltage selection pin. High (VIN): 3.3 V. Low (GND): 2.5 V. Connect this pin to either the
VIN pin or the GND pin.
Power supply input of the DC/DC converter and LX1 side gate drivers. Connect ceramic
capacitor (≥ 10 μF) between this pin and the PGND pin for power supply noise reduction.
Inductor connection pin. Connect inductor (1.5 μH) between this pin and the LX1 pin.
Ground of power FET, discharge, and gate drivers.
Inductor connection pin. Connect inductor (1.5 μH) between this pin and the LX2 pin.

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Block Diagram
LX1

LX2

D3

D1

PVIN C3C1 VOUT

Current
Sense Amp.

Gate
DriverGate
Driver
PGND

Zero Cross
Comparator

PGND

PGND

Control
Logic

OVP

DCDC_EN+
VIN B3

H: VREF + 1.5 %L: VREF + 0.5 %

+

B1 FB

+
+

-

VREF
UVLO

VREF

C2 VSEL-UVLO+Current Limit

Ramp
Generator

GND

IMIN Clamper
DCDC_EN

EN A1
ThermalShutdown

LDO

TSD

A3 REFREFOKMODE B2
GND

PGND

A2

D2

GND

PGND

Figure 3. Block Diagram

Absolute Maximum Ratings (Ta=25 °C)
Parameter

SymbolRatings

Unit

VMAXVIN, VMAXPVIN, VMAXVOUT,
VMAXFB, VMAXEN, VMAXMODE-0.3 to +6.0

V

VMAXLX1, VMAXLX2-1.0 to +7.0

V

Voltage Range in Pin: REF

VMAXREF-0.3 to +2.1

V

Voltage Range in Pin: PGND

VMAXPGND-0.3 to +0.3

V

Maximum Junction Temperature

Tjmax

150

°C

Storage Temperature Range

Tstg-55 to +125

°C

Voltage Range in Pins:
VIN, PVIN, VOUT, FB, EN, MODE
Voltage Range in Pins: LX1, LX2(Note 1)

(Note 1) Voltage transients on the LX1 or the LX2 pins beyond the DC limits specified in the absolute maximum ratings are non-disruptive to normal operation
when using good layout practices as described elsewhere in the data sheet and application notes and as seen on the product demo board.
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of theproperties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasingboard size and copper area so as not to exceed the maximum junction temperature rating.

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BD83070GWL(Note 2)

Thermal ResistanceParameter

Thermal Resistance (Typ)Symbol1s(Note 3)(Note 3)

2s2p

Unit

UCSP50L1C
θJA

Junction to Ambient

-

186.6

°C/W

(Note 2) Based on JESD51-2A(Still-Air).
(Note 3) Using a PCB board based on JESD51-9.

Layer Number ofMeasurement Board
SingleMaterial

Board Size

FR-4

114.5 mm x 101.5 mm x 1.6 mmt

TopCopper Pattern

Thickness

Footprints and Traces

70 μm

Layer Number ofMeasurement Board

Material

Board Size

4 Layers

FR-4

114.5 mm x 101.5 mm x 1.6 mmt

Top

2 Internal Layers

BottomCopper Pattern

Thickness

Copper Pattern

Thickness

Copper Pattern

Thickness

Footprints and Traces

70 μm

99.5 mm x 99.5 mm

35 μm

99.5 mm x 99.5 mm

70 μm

Symbol

Min

Typ

Max

Unit

VIN

2.0

3.6

5.5

V

Recommended Operating Conditions
Parameter
Power Supply Voltage
Operating Temperature
REF Connection Capacitor(Note 1)

Topr

-40

+25

+85

°C

CREF

0.22

0.47

1.00

μF

(Note 1) The minimum value capacitance must be met this specification over full operating condition. Ceramic capacitors are recommended for input/output
capacitors.

Electrical Characteristics (Unless otherwise specified VIN=PVIN=EN=VSEL=3.6 V, CREF=0.47 μF, Ta=25 °C)
Parameter

Limit

Symbol

Unit

Min

Typ

Max

Conditions

DC/DC Converter
Switching Frequency
during PWM

fSW

1.35

1.50

1.65

MHz

MODE=VIN

Maximum Duty

DMAX

80

87

95

%

MODE=VIN

RON1H

-

50

-

mΩ

RON1L

-

60

-

mΩ

RON2H

-

55

-

mΩ

VOUT=3.3 V

RON2L

-

65

-

mΩ

VOUT=3.3 V

Over Current Protection

IOCP

2.0

-

-

A

PVIN=3.6 V

Output Voltage 1

VOUT1

3.267

3.300

3.333

V

Output Voltage 2

VOUT2

2.468

2.500

2.532

V

Load Regulation

VLR

-

0.5

-

mV

LX1 High Side FETON Resistance
LX1 Low Side FETON Resistance
LX2 High Side FETON Resistance
LX2 Low Side FETON Resistancewww.rohm.com© 2018 ROHM Co., Ltd. All rights reserved.
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MODE=VIN, VSEL=VIN,
No Load
MODE=VIN, VSEL=0 V,
No Load
MODE=VIN, VSEL=VIN
IOUT=0 mA to 1000 mA

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BD83070GWL
Electrical Characteristics - continued (Unless otherwise specified VIN=PVIN=EN=VSEL=3.6 V, CREF=0.47 μF,
Ta=25 °C)
Parameter

Limit

Symbol

Unit

Min

Typ

Max

Conditions

DC/DC Converter - continued
DetectVOVPDET

5.3

5.5

5.7

V

VOUT voltage increasing

ReleaseVOVPRST

5.2

5.4

5.6

V

VOUT voltage decreasing

Startup Delay Time

tST

-

4.9

-

ms

From EN=High to VOUT=100 mV

Startup Slew Rate

SRST

2.5

5.0

10.0

mV/μs

Discharge Resistance

RDCG

40

85

200

Ω

EN=0 V

Detect

VSCPDET

1.3

1.4

1.5

V

FB voltage decreasing

ReleaseVSCPRST

1.51

1.61

1.71

V

FB voltage increasingUp

VUVLOUP

-

1.740

1.990

V

VIN voltage increasing

Down

VUVLODN

1.51

1.56

1.61

V

VIN voltage decreasing

ON

VENH

1.2

-

5.5

V

OFF

VENL

-0.3

-

+0.4

V

IEN

-

200

500

nA

High

VMODEH

1.2

-

5.5

V

Low

VMODEL

-0.3

-

+0.4

V

High

VVSELH

VIN-0.3-

VIN+0.3

V

Low

VVSELL

-0.3

-

+0.3

V

VREF

1.45

1.50

1.55

V

IREF=-100 μA

Quiescent VIN Current

IVIN

-

2.8

5.6

μA

MODE=0 V, FB=3.5 V

Quiescent FB Current

IFB

-

0.2

0.4

μA

MODE=0 V, FB=3.5 V

Shutdown VIN Current

ISHD

-

0.1

1.0

μA

EN=0 VOver Voltage
Threshold

Short Circuit
Threshold
Main Controller
Under Voltage
Lockout Threshold
EN Pin Control
Voltage
EN Pin Input Current
MODE Pin Control
Voltage
VSEL Pin Control
Voltage
REF Output Voltage
Whole Device

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Detailed Descriptions
1. Startup and Shutdown Control
When the EN pin goes from low (input under 0.4 V or open) to high (input over 1.2 V), the BD83070GWL turns on
internal LDO, REF, and the DC/DC converter. There is typically 4.9 ms delay from the EN high edge to startup of DC/DC
converter (tST). It has a soft-start structure and ramps up the output voltage in 5 mV/μs typically (SRST). On the other
hand, when the EN pin goes from high to low, it disables the internal LDO and DC/DC immediately. While in shutdown, it
turns discharge switch on to pull VOUT to ground through 85 Ω typically. If the EN pin goes again from low to high during
discharge sequence, the output voltage is ramped up from remaining voltage to target voltage in 5 mV/μs(Typ).
EN
tST
tST
VOUT

SRST

Figure 4. Startup Sequence
2. MODE Pin
In the case of the MODE pin is pulled high (over 1.2 V), the BD83070GWL operates in forced PWM mode and uses fixed
frequency 1.5 MHz regardless its loads. If the MODE pin is pulled low (under 0.4 V), it operates in automatic PFM-PWM
mode and automatically changes over form PWM to hysteresis PFM operation depending on its loads. Do not leave thispin floating because it is neither pulled down nor up, internally.
3. Output Voltage Setting
The BD83070GWL has internal feedback resistors. It is possible to select target output voltage from either 2.5 V or 3.3 V
by the VSEL pin. If the VSEL pin is connected to ground, the nominal output voltage is 2.5 V. On the other hand when
the VSEL is connected to VIN, the nominal output voltage is 3.3 V. It is not recommended to change while in EN is logic
high.
4. Maximum Load Current
The maximum load current varies depending on PVIN voltage and output voltage setting. When using therecommended application, the maximum load current becomes as follows.
VOUT = 2.5 V Setting
Maximum Load Current [mA]

Maximum Load Current [mA]

VOUT = 3.3 V Setting
1000 mA

600 mA

300 mA

1.8 V

2.3 V

2.7 V
PVIN voltage [V]

5.5 V

1000 mA
800 mA

400 mA

1.8 V

2.3 V

2.7 V
PVIN voltage [V]5.5 V

Figure 5. Maximum Load Current
5. Current Limit Protection
The BD83070GWL has a current limit protection circuit to prevent excessive electric stress on itself and external
inductor at overload condition.
6. Short Circuit Protection
If FB voltage drops less than 1.4 V(Typ), the current limit value is reduced to about half of the normal that. The current
limit value returns to the normal that when the FB voltage exceeds 1.61 V(Typ).
7. Over Voltage Protection
The BD83070GWL has an over voltage comparator. When the FB pin becomes open, the output voltage rises beyond
target voltage. If the VOUT pin reaches 5.5 V(Typ), it stops switching to prevent over voltage stress on its power FETs. If
the VOUT pin voltage falls lower than 5.4 V(Typ), it restarts switching.
8. Under Voltage Lockout (UVLO)
The BD83070GWL has a UVLO comparator to turn the device off and prevent malfunction when the input voltage is toolow. As same as UVLO, it has a REFOK comparator to monitor REF voltage, internal LDO output, and turns the device
off when the REF voltage is too low.
9. Thermal Shutdown
The BD83070GWL has a Thermal Shutdown Circuit (TSD Circuit). When the temperature of its chip is higher than
175 °C typical, the TSD circuit turns off the DC/DC converter. There is the hysteresis width of 20 °C between thedetection point and release point to prevent malfunctions from temperature fluctuations. Because TSD Circuit is only
designed for protecting the device from thermal over load, it is not recommended to design the application as TSD
working in normal condition.
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100

100

95

90

90

80

85

70
Efficiency [%]Efficiency [%]Typical Performance Curves

8075
VIN=4.2 V

70
65
60
55

50
0.01

VIN=3.8 V

60
50

VIN=3.6 V

VIN=3.6 V

VIN=3.0 V

20

VIN=3.0 V

VIN=2.4 V

10

VIN=2.4 V

0.1
1
10
100
Output Current:IOUT [mA]

0
0.01

1000

VIN=1.8 V
0.1
1
10
100
Output Current:IOUT [mA]

1000

Figure 7. Efficiency vs Output Current(VSEL=High, MODE=High: Forced-PWM)

100

100

95

90

90

80

85

70
Efficiency [%]Efficiency [%]Figure 6. Efficiency vs Output Current(VSEL=High, MODE=Low: Auto-PFM/PWM)

80
75

65

VIN=3.8 V

30

VIN=1.8 V

VIN=4.2 V

70

VIN=4.2 V

40

VIN=3.8 V

60
50
VIN=4.2 V

40

VIN=3.8 V

VIN=3.6 V

30

VIN=3.6 V

60

VIN=3.0 V

20

VIN=3.0 V

55

VIN=2.4 V

10

VIN=2.4 V

50
0.01

VIN=1.8 V
0.1
1
10
100
Output Current:IOUT [mA]

0
0.01

1000

Figure 8. Efficiency vs Output Current(VSEL=Low, MODE=Low: Auto-PFM/PWM)

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VIN=1.8 V
0.1
1
10
100
Output Current:IOUT [mA]

1000

Figure 9. Efficiency vs Output Current(VSEL=Low, MODE=High: Forced-PWM)

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2.60

3.40

2.55

3.35

2.50

3.30

Output Voltage 1:VOUT1 [V]Output Voltage 2:VOUT2 [V]Typical Performance Curves - continued

2.45
2.40
2.35
2.30
2.25

VIN=4.2 V

2.20

VIN=3.6 V

VIN=2.4 V

2.15

3.10

3.05

VIN=4.2 V

3.00

VIN=3.6 V

0

2000

2.55

3.35

2.50

3.30

Output Voltage 1:VOUT1 [V]

3.40

2.45
2.40
2.35
2.30
VIN=4.2 V

2.20

VIN=3.6 V
VIN=2.4 V

2.15

500
1000
1500
Output Current:IOUT [mA]

2000

Figure 11. Output Voltage 1 vs Output Current(“Load Regulation”, VSEL=High, MODE=High: Forced-PWM)

2.60

2.25

VIN=2.4 V

2.90

Figure 10. Output Voltage 2 vs Output Current(“Load Regulation”, VSEL=Low, MODE=High: Forced-PWM)

Output Voltage 2:VOUT2 [V]3.15

VIN=1.8 V

VIN=1.8 V
500
1000
1500
Output Current:IOUT [mA]

3.20

2.95

2.10
0

3.25

3.25
3.20
3.15
3.10

3.05

VIN=4.2 V

3.00

VIN=3.6 V
VIN=2.4 V

2.95

VIN=1.8 V

VIN=1.8 V

2.10

2.90
0

500
1000
1500
Output Current:IOUT [mA]

2000

0

Figure 12. Output Voltage 2 vs Output Current(“Load Regulation”, VSEL=Low, MODE=Low:
Auto-PFM/PWM)

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500
1000
1500
Output Current:IOUT [mA]

2000

Figure 13. Output Voltage 1 vs Output Current(“Load Regulation”, VSEL=High, MODE=Low:
Auto-PFM/PWM)

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Typical Performance Curves - continued

2000
Maximum Output Current:IMAX [mA]4.0

Output Voltage 1:VOUT1 [V]

3.5
3.0
2.5
2.0

1.5
1.0
0.5

1800
1600
1400
1200
1000
800
600
400

0.0

0
0

1
2
3
4
5
Power Supply Voltage:VIN [V]6

Figure 14. Output Voltage 1 vs Power Supply Voltage(“Line Regulation”, EN=VSEL=High, MODE=Low:
Auto-PFM/PWM, 3.3 kΩ resistive load)

1.5

2.0
2.5
3.0
Power Supply Voltage:VIN [V]3.5

Figure 15. Maximum Output Current vs Power Supply Voltage

2.0

7
Ta=-50 ˚C
Ta=+25 ˚C
Ta=+125 ˚C

Quiescent VIN Current:IVIN [μA]

Shutdown VIN Current:ISHD [μA]

VSEL=Low
VSEL=High

200

1.5

1.0

0.5

0.0

6

VSEL=Low
VSEL=High

5
4
3
2
1
0

1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Power Supply Voltage:V IN [V]

1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Power Supply Voltage:V IN [V]Figure 16. Shutdown VIN Current vs Power Supply Voltage(EN=MODE=Low, No load)www.rohm.com© 2018 ROHM Co., Ltd. All rights reserved.
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Figure 17. Quiescent VIN Current vs Power Supply Voltage(MODE=Low: Auto-PFM/PWM, FB=3.5 V, No load)

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2.0

200

1.9

180

1.8

160

Ripple Voltage [mV]

Switching Frequency:fSW [MHz]Typical Performance Curves - continued

1.7
1.6
1.5
1.4

1.3
1.2

MODE=Low: Auto-PFM/PWM
MODE=High: Forced-PWM

140
120
100
80
60

40
VSEL=Low

1.1

20

VSEL=High
1.0

0
0.01

1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Power Supply Voltage:VIN [V]Figure 18. Switching Frequency vs Power Supply Voltage(MODE=High: Forced-PWM, No load)

0.1
1
10
100
Output Current:IOUT [mA]

1000

Figure 19. Ripple Voltage vs Output Current(VIN=3.6 V, VSEL=High)

ch1:MODE [2 V/div]

ch1:VSEL [2 V/div]

ch2:VOUT [100 mV/div, offset=3.3 V]
ch2:VOUT [500 mV/div, offset=2.9 V]
ch3:Icoil [200 mA/div]

ch3:Icoil [200 mA/div]

Time[500 μs/div]

Time[500 μs/div]

Figure 20. Transient Response(“Mode Change”, VIN=3.6 V, VSEL=High,
MODE=Low<->High, Output current 50 mA)

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Figure 21. Transient Response(“Output Voltage Change”, VIN=2.9 V, VSEL=Low<->High,
MODE=Low: Auto-PFM/PWM, Output current 50 mA)

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Typical Performance Curves - continued

ch4:IOUT [200 mA/div]
ch4:IOUT [200 mA/div]

ch1:VOUT [200 mV/div, offset=3.31 V]

ch1:VOUT [200 mV/div, offset=3.31 V]

ch3:PVIN [1 V/div, offset=2.3 V]

ch3:PVIN [1 V/div, offset=2.3 V]

Time[50 μs/div]

Time[50 μs/div]

Figure 22. Transient Response(VIN=2.3 V, VSEL=High, MODE=Low: Auto-PFM/PWM,
Output current 20 mA->600 mA)

Figure 23. Transient Response(VIN=2.3 V, VSEL=High, MODE=Low: Auto-PFM/PWM,
Output current 600 mA->20 mA)

ch4:IOUT [300 mA/div]

ch4:IOUT [300 mA/div]

ch1:VOUT [300 mV/div, offset=3.31 V]
ch1:VOUT [300 mV/div, offset=3.31 V]
ch3:PVIN [1 V/div, offset=3.6 V]

ch3:PVIN [1 V/div, offset=3.6 V]

Time[50 μs/div]

Time[50 μs/div]

Figure 24. Transient Response(VIN=3.6 V, VSEL=High, MODE=Low: Auto-PFM/PWM,
Output current 50 mA->1000 mA)

Figure 25. Transient Response(VIN=3.6 V, VSEL=High, MODE=Low: Auto-PFM/PWM,
Output current 1000 mA->50 mA)

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Typical Performance Curves - continued

ch1:VIN [1 V/div]
ch1:VIN [1 V/div]

ch2:VOUT [100 mV/div, offset=3.3 V]

ch2:VOUT [100 mV/div, offset=3.3 V]

Time[100 μs/div]

Time[100 μs/div]

Figure 26. Transient Response(VIN=2.7 V->5.5 V, VSEL=High, MODE=Low:
Auto-PFM/PWM, Output current 300 mA)

Figure 27. Transient Response(VIN=5.5 V->2.7 V, VSEL=High, MODE=Low:
Auto-PFM/PWM, Output current 300 mA)

ch1:EN [3 V/div]

ch1:EN [3 V/div]

ch2:VOUT [1 V/div]

ch2:VOUT [1 V/div]

ch3:IPVIN+IVIN [500 mA/div]

ch3:IPVIN+IVIN [500 mA/div]

Time[1 ms/div]

Time[2 ms/div]

Figure 28. Startup Waveform(VIN=2.4 V, VSEL=High, MODE=High: Forced-PWM,
5.5 Ω resistive load)www.rohm.com© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001

Figure 29. Startup Waveform(VIN=3.6 V, VSEL=High, MODE=High: Forced-PWM,
3.3 Ω resistive load)

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Typical Performance Curves - continued

ch1:EN [2 V/div]

ch1:EN [2 V/div]

ch2:VOUT [1 V/div]

ch2:VOUT [1 V/div]

Time[2 ms/div]

Time[2 ms/div]

Figure 30. Shutdown Waveform(VIN=3.6 V, VSEL=Low, MODE=Low: Auto-PFM/PWM, No
load)

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Figure 31. Shutdown Waveform(VIN=3.6 V, VSEL=High, MODE=Low: Auto-PFM/PWM, No
load)

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Application Examples
VSEL = VIN (VOUT = 3.3 V setting)

L1

LX1

VIN

LX2

PVIN

VOUT

C1

FB

VOUT
3.3 V
C2

VIN
ON

EN

OFF

VSEL

Forced-PWM

MODE
GND

Auto-PFM/PWM

REF
PGND

C3

Figure 32. 3.3V Output Application Circuit

VSEL = GND (VOUT = 2.5 V setting)

L1

LX1

VIN

LX2

PVIN

VOUT

C1

FB

VOUT
2.5 V
C2

VIN
ON

EN

OFF

VSEL

Forced-PWM
Auto-PFM/PWM

MODE
GND

REF
PGND

C3

Figure 33. 2.5 V Output Application Circuit
Parts Number

Description

Supplier

L1

1239AS-H-1R5M(1.5 μH, 2.5 mm x 2.0 mm x 1.2 mm)

muRataC1

EMK212ABJ106KD (10 μF, 16 V, X5R, 0805)

Taiyo Yuden(Note 1)

JMK107BBJ226MA (22 μF, 6.3 V, X5R, 0603)

Taiyo Yuden

EMK105ABJ474KV-F (0.47 μF, 16 V, X5R, 0402)

Taiyo Yuden

C2

C3(Note 1) The effective load capacitance value considering accuracy, temperature characteristic and DC bias characteristic of output capacitors should not be less than
22 μF. The amount of output capacitance will have a significant effect on the output ripple voltage.

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BD83070GWL
I/O Equivalence Circuits
Pin
Name

Pin
Name

Equivalence circuit

Equivalence circuit
LX2

VIN

EN

VOUT

GND

GND

GND

RDCG

GND

GND

VIN

REF

PVIN
PGND

GND

GND
VOUT

FB

LX2

GND

GND

PGND

PVIN

VOUT

VIN

MODE
VSEL

PGND

GND

GND

GND

GND

PVIN

VIN

LX1
GND

PGND

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BD83070GWL
Operational Notes
1.

Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity whenconnecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.

2.

Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.

3.

Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4.

Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electricalcharacteristics.

6.

Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, androuting of connections.

7.

Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions duringtransport and storage.

8.

Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result indamaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) andunintentional solder bridge deposited in between pins during assembly to name a few.

9.

Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance andextremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor andcause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to thepower supply or ground line.

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BD83070GWL
Operational Notes – continued
10. Regarding the Input Pin of the ICThis monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep themisolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating aparasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutualinterference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes tooperate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor

Transistor (NPN)

Pin A

Pin B

C

E

Pin A
N

P+

P
N

N

P+

N

Pin B

B

Parasitic
Elements

N

P+

N P

N

P+

B
N

C
E
Parasitic
Elements

P Substrate

P Substrate
GND

GND

Parasitic
Elements

GND

Parasitic
Elements

GND
N Regionclose-byFigure 34. Example of Monolithic IC Structure
11.

Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance withtemperature and the decrease in nominal capacitance due to DC bias and others.

12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, thejunction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under nocircumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC fromheat damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
14. Disturbance Light
In a device where a portion of silicon is exposed to light such as in a WL-CSP and chip products, IC characteristics
may be affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasures thatwill prevent the chip from being exposed to light.

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BD83070GWL
Ordering Information

B

D

8

3

0

7

0

G

W

L

Package
GWL: UCSP50L1C

Part Number

E2
Packaging and forming specification
E2: Embossed tape and reel

Marking Diagram
TOP VIEWUCSP50L1C (BD83070GWL)
Pin 1 MarkADQPart Number Marking

LOT Number

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BD83070GWL
Physical Dimension and Packing Information

Package NameUCSP50L1C(BD83070GWL)< Tape and Reel Information >TapeEmbossed carrier tape

Quantity

3,000pcs

Direction of feed

E2
The direction is the pin 1 of product is at the upper left when you holdreel on the left hand and you pull out the tape on the right hand

1234

1234

Reel

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1234

1234

1pin

20/21

1234

1234

Direction of feed

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BD83070GWL
Revision History
Date

Revision

09.Oct.2018

001

Changes
New Releasewww.rohm.com© 2018 ROHM Co., Ltd. All rights reserved.
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Notice
Precaution on using ROHM Products
1.

Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ

2.

ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, whicha failure or malfunction of our Products may cause. The following are examples of safety measures:[a] Installation of protection circuits or other protective devices to improve system safety[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3.

Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items[f] Sealing or coating our Products with resin or other coating materials[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering[h] Use of the Products in places subject to dew condensation

4.

The Products are not subject to radiation-proof design.

5.

Please verify and confirm characteristics of the final or mounted products in using the Products.

6.

In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affectproduct performance and reliability.

7.

De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.

8.

Confirm that operation temperature is within the specified range described in the product specification.

9.

ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined inthis document.

Precaution for Mounting / Circuit board design
1.

When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect productperformance and reliability.

2.

In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E© 2015 ROHM Co., Ltd. All rights reserved.

Rev.004

Precautions Regarding Application Examples and External Circuits
1.

If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of thecharacteristics of the Products and external components, including transient characteristics, as well as static
characteristics.

2.

You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not beapplied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation
1.

Product performance and soldered connections may deteriorate if the Products are stored in the places where:[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation[d] the Products are exposed to high Electrostatic

2.

Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time isexceeding the recommended storage time period.

3.

Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.

4.

Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products ofwhich storage time is exceeding the recommended storage time period.

Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights
1.

All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.

2.

ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).

3.

No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution
1.

This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2.

The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior writtenconsent of ROHM.

3.

In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.

4.

The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.

Notice-PGA-E© 2015 ROHM Co., Ltd. All rights reserved.

Rev.004

Datasheet
General Precaution

1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any priornotice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.

3.

The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of orconcerning such information.

Notice – WE

© 2015 ROHM Co., Ltd. All rights reserved.

Rev.001