Introduction to DXM-OXY-01 Tools

Talents come from diligence,and knowledge is gained byaccumulation.

WELCOME
Thank you for your trust in our productsThis file is only used for the discussion of the customer's intentional design scheme, not the actual molding
product modeling

01

02

03

Company Profile Product introduction Process introduction

04

05

Prototype data

Comparison

01
Company
ProfileDandong Xindongfang Crystal
Dandong New Oriental Crystal Instrument Co., Ltd. was established in 2007. It is a private high-tech enterprise
specializing in the research and development of X-RAY crystal orientation and testing equipment.
In February 2017, the international semiconductor standard SEMI HB8-0217 Test Method for Determining
Orientation of a SapphireSingle Crystal/Single Crystal Orientation Test Method, which was compiled by Dandong
New Oriental Crystal Instrument Co., Ltd., was officially released. This is the first breakthrough for Chinese LED
companies to promote international LED industry standards. This is the first approved standard of SEMI China
HB-LED Standards Committee since its establishment three years ago, which is of great significance.

Dandong New Oriental Crystal started in 2007. It
is a high-tech enterprise specializing in the
research and development of X-Ray crystal
orientation and testing equipment. For more thanten years, the company has passed ISO09001
quality management system certification, many
products have passed CE certification and otherspecial qualifications or certifications, etc., and has
successively obtained 1 invention patent and 45
utility model patents; in 2013, it was awarded thetitle of national high-tech enterprise.
At present, X-Ray crystal orientation and testing
equipment and other products have been
exported to more than ten countries and regions,and are widely used by well-known semiconductormaterials, LED, solar photovoltaic industry
manufacturing enterprises, universities andresearch institutes conducting research anddevelopment at home and abroad. The domestic
market share has reached more than 45%

After 15 years of development, New Oriental Crystal has developed intoa leader in my country's crystal orientation instrument industry, with adomestic market share of 45%.
Due to the continuous efforts of national industries including New
Oriental, China's crystal orientation instrument products have completely
gotten rid of the situation of relying on imports, making China the only
country in the world that can produce the same type of orientation
instruments besides Germany, Japan and France.

806040200200 7201 0销售额

201 5201 8202 1

Dandong Xindongfang
Crystal Instrument Co., Ltd.
X-ray directional
instrument sells well allover the country, andexported to the UnitedStates, Russia, Canada,Japan, South Korea, Taiwan
and other countries andregions.

02ProductIntroduction

DXM-EXY Series
High-precision orientation, bonding, and reinspection integrated operation
This instrument is a comprehensive automatic equipment integrating
X-ray orientation, one-time bonding of polycrystalline rods, and reinspection after bonding.

Ø Full automation
Ø High measurement and positioning accuracy
Ø Easy to Use
Ø Humanized design
Ø Labor cost reduction

1.

Full automation. The adjustment, lifting and loading of the tools
are all automatically controlled by motors, and high-precision
sensors are used at the same time, so the measurement andbonding process does not require manual operation by personnel

2.

The integrated design of functions simplifies the production
structure, realizes measurement, alignment, positioning, bondingand other functions in one, which greatly improves the production
efficiency.

3.

The labor cost is low, and a single tools can be completed by ageneral worker, which reduces the requirements for the skill andquantity of workers, and reduces the training period.

4.

High accuracy and stability. Adopt X-ray automatic peak-finding
technology, X, Y dual-axis automatic detection, no need forpersonnel to participate, reduce human error, improve theaccuracy and stability of the equipment.

5.

The production cycle is short and the production efficiency is improved.
It integrates multi-functions and reduces the connection between
workbenches.

6.

Reduce the industrial chain of production lines, have low requirements
for the processing quality of upstream products, reduce upstream
processing steps, and reduce the requirements for upstream crystal
processing accuracy.

7.

Re-inspection function, it can realize the biaxial re-inspection
after the ingot is bonded.

8.

It has a real-time monitoring function during the bonding process of
the ingot to improve the fault tolerance rate.

9.

During the bonding process, the bonding pressure can be adjusted.

10.

The tools has lower requirements on the working environment, anddigital control is realized in each working link.

Sn.

Traditional solution

This equipment planAdvantage

1

The crystal measurement and bonding are separated,
and the crystal needs to be moved for multi-station
operation.

Measurement and bonding functions are integrated
in oneIncreased accuracy and stability of bonded
crystals

2

2-4 workers required, high technical requirements,
subject to technical and human judgment

One regular worker required

Reduce labor costs

3

Measurement and bonding positioning are all manuallyoperated by human judgment

Both measurement and movement are controlled
automatically, with foolproof function

Reduce the influence of human factors
and improve stability

4

The Y axis is adjusted to change the different shims toadjust the pitch angle

Manipulator clamping, motor direct drive to control
angle deviation

The accuracy and operability are greatly
improved, and the labor intensity ofworkers is reduced

5

Use the cylindrical physical plane of the crystal rod as thebenchmark to position and bond the crystal rod

The standard atomic plane required for direct
measurement of crystals is the reference planeHigh precision, low requirements for
upstream physical processing

6

The recheck is the method of dotting the cylinder

Direct measurement of crystal end face, real-timemonitoring of crystal rod during bonding process

Improve fault tolerance and reduce
production costs

7

The measurement data is divided into parts anduploaded manually

Data docking by means of communication

Avoid human error, or tampering. Improvedata accuracy and labor costs.

8

Manually confirm the bonding angle

The recipe function is filled in one time andautomatically called

Avoid manual errors, improve processcontrol, and enhance the consistency ofbonding parameters.

03
Process
IntroductionCompletion

Recheck

3min
X min

Frist Curing

Ingot clamping

1min

Parameter
setting

1min

automatic
measurement

3min

Glue
deployment

Angular motion
compensation

1min

Beam Gluing

automaticbonding

3min•Ingot clamping: place the ingot to be bonded on the material plate table, control the tools, andthe manipulator automatically clamps the ingot.

•Parameter setting: Enter the data of the ingot that has been clamped into the tools, including thenumber, size, length and bonding angle parameters, etc.

•

Automatic measurement: The device automatically measures the crystal X, Y biaxial lattice angle.

•Angular motion compensation: automatically run according to the input parameters andmeasured values to compensate for the angle difference.

•Glue preparation: mix AB glue in proportion.

•Beam gluing: Apply the prepared glue on both sides of the beam.

•

Automatic gluing: place the beam above the material board, and the tools will automatically glue it.

•Frist curing : The adhesive layer is left to be initially cured.

•Re-check: re-inspect the X and Y biaxial angles of the ingot after bonding.

•Completion: The overall sheet is removed.

The bonding scheme for long ingot such as sapphire gallium arsenide:
1. Three-point clamping and fixing ingot;
2. The inverted cone structure prevents accidental falling off;
3. The PPS pad contacts the crystal without scratches;
4. For different cutting processes, the reference edge is down, and thereference edge is oblique to 45° bonding (the picture shows thereference edge down bonding process);
5. 4-6, 6-8 inch crystal rods are bonded, the backing plate is replaced,
and the program is automatically switched;
6. The clamping pressure is continuously adjustable from 10-200N; theclamping position is self-checked to prevent errors;
7. Applicable crystals: size 4-6, 6-8 inches, length 50-300mm, diffraction
angle: 12-38° (adjustable), crystal rod cylindricity less than 0.02mm.

Bonding scheme for short ingot such as SIC:
1. Vacuum adsorption type fixed crystal ingot;
2. Polyurethane wheel locates the cylindrical surface of the crystal ingot;
3. The rubber backing plate contacts the crystal without scratches;
4. For different cutting processes, the reference edge is down, thereference edge is up, and the notch groove is up (the picture shows thereference edge down bonding process);
5. There is no need to replace the fixture for bonding of 4-6 inch crystal
ingot, and it can be automatically switched;
6. Adsorption technical parameters: large suction holes. Air source ratedpressure: 0.5MPa; vacuum pressure: less than -87kPa;
7. Applicable crystals: size 4-6 inches, length 5-50mm, diffraction angle:
12-48° (adjustable), the weight of a single crystal is less than 2.5KG,
and the flatness of the end face is less than 0.02mm.

04
PrototypeDataSapphire test data 267 groups
Less than 0.02° Quantity: 190; Proportion: 71.16%;
Less than 0.025° Quantity: 229; Proportion: 85.77%;
Less than 0.034 °Data: 264; Proportion: 98.88%;
Note: The blue polyline is the X-axis deviation value, and the orange polyline is the Y-axis deviation value.

0.04
0.03
0.02
0.01
0-0.01
-0.02
-0.03
-0.04

05
Comparison

Applicable crystals

DXM-EXY-01-JC(4.6)-300-01

DXM-EXY-01-JC(6.8)-300-01

DXM-EXY-01-XF(4.6)-60-01

Material

Single crystal (sapphire) Single crystal (sapphire) Single crystal (SIC)

Shape

Cylindrical

Cylindrical

Cylindrical

Diameter

4/6 inch（±0.5mm）
101.6±0.5mm
152.4±0.5mm

6/8 inch（±0.5mm）
152.4±0.5mm
203.2±0.5mm

4/6 inch（±0.5mm）
101.6±0.5mm
152.4±0.5mm

Length50～300mm

50～300mm

10～60mm

Measuring position

Ingot end face

Ingot end face

Ingot end face

Ingot weight (MAX)

<20KG

<30KG

<2.5KG

Maximum deviation in <5°
the vertical direction of
the crystal end face<5°<3°

Ingot cylindrical taper
extremely poor

<0.02mm<0.02mm<0.2mmExtremely poor end
surface flatness<0.1mm<0.1mm<0.015mm

Applicable tomaterial plates andstrips

DXM-EXY-01-JC(4.6)-300-01

DXM-EXY-01-JC(6.8)-300-01

DXM-EXY-01-XF(4.6)-60-01

Length range

300-600mm

300-600mm

300-600mm

Width range

60-120mm

60-120mm

50-120mm

Height range

30-130mm

30-65mm30-120mm

Type of Material seat

Single customization

Single customization

Single customization

Gasket thickness

10-15mm10-15mm10-15mm

Gasket width

50-75mm50-75mm50-75mm

Process limitations

DXM-EXY-01-JC(4.6)-300-01

DXM-EXY-01-JC(6.8)-300-01

DXM-EXY-01-XF(4.6)-60-01

Number of crystals
bonded to a single
material plate

1-6 ingot

1-6 ingot

Customize

Communication
methodTCP/IP

TCP/IP

TCP/IP

Input power

single phase AC 220V
，50Hz

single phase AC 220V
，50Hz

single phase AC 220V
，50Hz

Crystal orientationangle

θ Angle：+12～+48°
2θ Angle：+24～+96

θ Angle：+12～+48°
2θ Angle：+24～+96

θ Angle：+12～+48°
2θ Angle：+24～+96

Bonding ingot gap>=5 mm>=5 mm>=5 mm

Bonding accuracy>=±0.05°>=±0.05°>=±0.05°

Bonding direction

OFF Flat, up or down whenbonding
OFF Flat, up or down whenbonding
NOTCH, up when bonding

OFF Flat, up or down whenbonding
OFF Flat, up or down whenbonding
NOTCH, up when bonding

4 inch OFF flat, up or downwhen bonding
6 inches is the OFF flat, upor down when bonding
6 inches is NOTCH,
upwards when bonding

Talents come from diligence,and knowledge is gained byaccumulation.

OS TECH Co., Ltd.
Ȏµ¹°­°°²³ ‫۾‬᩸ࣈ‫ګࢍګ‬Ԗԧ˧ّɻ˲႔²­²­·´
TEL : 072-221-2778 FAX : 072-221-2779
, Minami-mikunigaoka, Sakai-ku, Sakai, Osaka, JAPAN 590-0023
TEL : +81-72-221-2778 FAX : +81-72-221-2779

PDWHULDOBLQIR#RVWHFKFRMS

http://www.ostech.co.jp