October 7, 2020
Nisshinbo Mechatronics Inc.
Elephantech Inc.

Nisshinbo Mechatronics and Elephantech Agree to Develop
Molded Parts for ADAS Vehicles Using IMPC™ Technology
Nisshinbo Mechatronics Inc. (based in Chuo-ku, Tokyo and headed by CEO Toshihiro Masuda,
hereinafter referred to as “Nisshinbo Mechatronics”) and Elephantech Inc. (based in Chuo-ku, Tokyoand headed by CEO Shinya Shimizu, hereinafter “Elephantech”) have concluded a basic agreement todevelop wiring-integrated molded parts for ADAS vehicles by combining Nisshinbo Mechatronics
Group's injection molding technology and Elephantech's IMPC™ three-dimensional wiringtechnology*.
The Nisshinbo Mechatronics Group will, based on its injection molding technology, electronics
technology and automotive parts manufacturing know-how, incorporate Elephantech’s IMPC™
technology to accelerate the development of various in-vehicle molded parts in which resin, wiringand functions are integrated with each other. Prototypes of molded parts with integrated wiring for
ADAS vehicles have already been made and we are moving onto developing for mass production
aiming for a 2023 start.
To realize a safe and reliable future for mobility in society, the importance of in-vehicle sensing is on
the rise. Furthermore, for increasingly sophisticated automated driving in the future, a large numberof parts and manufacturing processes will be required. Moving forward, finding a way to integrate awide variety of sensors and other components into vehicles while decreasing the number of parts andshortening manufacturing processes will be a challenge.
Elephantech’s IMPC™ technology is seen as a potential solution for this problem and its unique wiring
printing technology that combines inkjet printing and electroless copper plating presents acompetitive advantage. Furthermore, IMPC™, a technology for manufacturing 3D wiring, will be
developed by combining the differentiated wiring printing technology and the film insert molding
technology owned by Nisshinbo Mechatronics group companies. By combining the core technologies
of both companies, the integration of resin molded parts and wiring will make it possible to incorporatea large number of functions while reducing the number of parts. The two companies will continue toplan and develop new products by applying and collaborating with each other's technologies.
*IMPC™ (In-Mold Printed Circuit) TechnologyAs opposed to conventional partial optimization
structures where resin and electronic circuits
were designed and manufactured separately
beforebeingcombined,

ourdesignandmanufacturing solution involves integrating andoptimizing parts as a whole. By integrating theresin and the circuitry, a wider range of optimized
designs can be achieved, resulting in various advantages such as reduced weight, thickness and cost.

■Company Overview
Company Name

Nisshinbo Mechatronics Inc.

Headquarters

2-31-11, Ningyo-cho, Nihonbashi, Chuo-ku, Tokyo

Capital4 billion JPY (as of December 31, 2019)

Main Business

Development, manufacture, and sale of Molding products
Development, manufacture, and sale of customized machines
Manufacture, and sale of Precision Parts for Automobiles

URL

https://www.nisshinbo-mechatronics.co.jp/english/<Press Contact>
Nisshinbo Holdings Inc. IR & Public Relations Group TEL +81-3-5695-8854< For inquiries about our business and products>
Nisshinbo Mechatronics Inc. Business Administration Department
TEL +81-564-55-1111

Company Name

Elephantech Inc.

Headquarters

4-3-8, Hatchobori, Chuo-ku, Tokyo

Capital

310 million JPY

Main Business

Development and servicing of production technologies for printed
electronics
Development of manufacturing technologies using additive manufacturing

URL

https://www.elephantech.co.jp/en/<For inquiries about IMPC™ technology>
Elephantech Inc. Public Relations Officer pr@elephantech.co.jp