Datasheet
Nano EnergyTM

Ultra Low Iq Buck Converter
For Low Power Applications
BD70522GUL
General Description

Key Specifications







The BD70522GUL is a Buck Converter featuring 180nA
quiescent current and supports output current up to
500mA. The Constant ON-Time (COT) control with ULP(Ultra Low Power) mode provides superior transient
response and extends battery life by providing excellent
light load efficiency below 10µA load range. The output
voltage can be selected from 9 pre-set voltages by VSEL
pins. When the input voltage gets close to the output
voltage, the IC enters 100%ON mode where theswitching operation stops.

Input Voltage Range:
Output Voltage Range:
Maximum Output Current:
Operating Quiescent Current:Standby Current:
Operating Temperature Range:

Package
VCSP50L1C

2.5V to 5.5V
1.2V to 3.3V
500mA
180nA (Typ)50nA (Typ)-40°C to +85°C

W(Typ) x D(Typ) x H(Max)1.76mm x 1.56mm x 0.57mm

Features









Nano EnergyTM
180nA (Typ) Quiescent Current
Up to 90% Efficiency at 10µA Output Current
Up to 500mA Output Current
9 Selectable Output Voltages(1.2V, 1.5V, 1.8V, 2.0V, 2.5V, 2.8V, 3.0V, 3.2V, 3.3V)
Power Good Output
100%ON Mode for Low Input Voltage
Discharge Function on VOUT

Applications







Smoke Detector
Thermostat
Portable Devices
Wearable Devices
Low-Iq Applications without Standby Switcher
Energy Harvesting

Typical Application Circuit

L1
2.2μH

CIN
10μF

VEN
VSEL1
VSEL2

VIN

LX

EN

VOUT
PG

VSEL1

AGND

VSEL2

VOUT
1.2V-3.3V
COUT
22μF

RPULLUP

VIN
2.5V-5.5V

VPG

PGND
Figure 1. Typical Application Circuit「Nano EnergyTM」is a trademark of Rohm Co., Ltd.
〇Product structure : Silicon monolithic integrated circuit.www.rohm.com© 2017 ROHM Co., Ltd. All rights reserved.
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Contents
General Description ........................................................................................................................................................................ 1
Features.......................................................................................................................................................................................... 1
Applications .................................................................................................................................................................................... 1
Key Specifications .......................................................................................................................................................................... 1
Package .......................................................................................................................................................................................... 1
Typical Application Circuit ............................................................................................................................................................... 1
Contents ......................................................................................................................................................................................... 2
Pin Configuration ............................................................................................................................................................................ 3
Pin Descriptions .............................................................................................................................................................................. 3
Block Diagram ................................................................................................................................................................................ 3
Absolute Maximum Ratings ............................................................................................................................................................ 4
Thermal Resistance ........................................................................................................................................................................ 4
Recommended Operating Conditions ............................................................................................................................................. 4
Electrical Characteristics................................................................................................................................................................. 4
Electrical Characteristics - continued .............................................................................................................................................. 5
Detailed Descriptions ...................................................................................................................................................................... 6
Typical Performance Curves........................................................................................................................................................... 8
Figure 7-10. Efficiency vs Output Current ................................................................................................................................... 8
Figure 11-14. Output Voltage vs Output Current ......................................................................................................................... 9
Figure 15-18. Switching Frequency vs Output Current ............................................................................................................. 10
Figure 19-22. Output Ripple Voltage vs Output Current ............................................................................................................ 11
Figure 23-26. Load Transient Response ................................................................................................................................... 12
Figure 27-30. Line Transient Response .................................................................................................................................... 13
Figure 31-34. Line Transient Response .................................................................................................................................... 14
Figure 35-36. Startup................................................................................................................................................................. 15
Figure 37-38. Shutdown ............................................................................................................................................................ 15
Figure 39-42. Input Voltage Ramp Up/Down ............................................................................................................................. 16
Timing Chart ................................................................................................................................................................................. 17
Application Examples ................................................................................................................................................................... 18
I/O Equivalence Circuits................................................................................................................................................................ 19
Operational Notes ......................................................................................................................................................................... 20
Ordering Information ..................................................................................................................................................................... 22
Marking Diagram .......................................................................................................................................................................... 22
Physical Dimension and Packing Information ............................................................................................................................... 23
Revision History ............................................................................................................................................................................ 24

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Pin Configuration

1

2

3

A

PGND

LX

VIN

B

VOUT

AGND

EN

C

PG

VSEL2

VSEL1

Top View
Figure 2. Pin Configuration

Pin Descriptions
Pin No.

Pin Name

A1

PGND

Description
Power Ground Pin

A2

LX

Switching Pin. Connect an inductor to this pin.

A3

VIN

B1

VOUT

B2

AGND

B3

EN

C1

PG

C2

VSEL2

C3

VSEL1

Power Supply Input Pin. Connect an input capacitor close to this pin.
Feedback Pin for internal feedback divider network and regulation loop.
This pin is also used for VOUT discharge while EN pin is set to low.
Analog Ground Pin
Enable Pin. This pin must be terminated.
High : Enable
Low : Shutdown
Do not pull up EN terminal higher than VIN voltage.
Power Good Open Drain Output Pin. PG remains low while the VOUT pin voltage
is lower than the threshold voltage. If not used, this pin can be left open.
Do not pull up PG terminal to a voltage which is higher than VIN voltage.
Output Voltage Selection Pins.
These pins have three states :High = VIN (Connect these pins to VIN directly without pull up resistors)
Low = GND (Connect these pins to GND directly without pull down resistors)
OPEN = No Connection (PCB:C<50pF, R>1Mohm)
The setting of these pins cannot be changed while the IC is operating.

Block Diagram
EN

Ultra Low Power
Reference

VSEL1
VFB

AGND
Main
Ref
PG
Comp

ULP
Ref

VOUT
Discharge

Soft
Start

Internal
Feedback
Network

VSEL2

PG

VOUT
UVLO
EN

100% ON Mode
Comp

UVLO
Comp

VIN

VIN

VIN

VTH_UVLO

V100TH_REF

Main
Comp

UVLO
Current
Limit Comp

ULP
Comp

Control
Logic

LX

Zero CrossComp

VTH_PGEN

LimitHigh Side

Current
Limit Comp

Limit
Low Side

PGND

Figure 3. Block Diagram

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Absolute Maximum Ratings (Ta=25°C)
Parameter

SymbolRatingUnit

VIN-0.3 to +6V

LX Voltage

VLX-0.3 to VIN+0.3V

V

EN Voltage

VEN-0.3 to VIN+0.3V

V

PG Voltage

VPG-0.3 to VIN+0.3V

V

VSEL1, 2 Voltage

VSEL-0.3 to VIN+0.3V

V

PG Sink Current

IPG

10

mA

Power Dissipation

Pd

0.592 (Note 1)

Maximum Junction Temperature

Tjmax

150

W
°C

Storage Temperature Range

Tstg- 55 to + 150°C

Supply Voltage

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of theproperties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with power dissipation taken into consideration byincreasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) The derating is 4.74 mW/°C while the device is operating above Ta≧25°C (Mounted on 4-layer 50.0mm x 58.0mm x 1.6mm FR-4 board)

Thermal ResistanceParameter

SymbolThermal Resistance (Typ)

Unit

θJA

168.8

°C/W

VCSP50L1C
Junction to Ambient
Layer Number ofMeasurement Board
4 Layers

Material

Board Size

FR-4

50.0mm x 58.0mm x 1.6mmt

Recommended Operating Conditions
Parameter

Symbol

Min

Typ

Max

Unit

Supply Voltage(Note 2)

VIN

2.5

3.6

5.5

V

Output Current

IOUT

-

-

500

mA

Inductance(Note 3)

L

-

2.2

-

µH

Output Capacitance(Note 4)

COUT

10

22

100

µF

Operating Temperature

Topr

-40

+25

+85

°C

(Note 2) Initial startup voltage is over 2.6V (Max)(Note 3) The effective inductance should be kept in the specified range from 1.5µH to 3.5µH, including the variety of tolerance, temperature, current derating.
(Note 4) The effective capacitance should be kept this specified range including variety of tolerance, temperature, bias voltage derating.

Electrical Characteristics(Unless otherwise specified VIN=3.6V Ta=25°C)
Parameter

Symbol

Min

Typ

Max

Unit

Conditions

Shutdown Current

IST

-

50

1000

nA

Operating Quiescent Current

IQ

-

180

1000

nA

No switching, VEN= VIN
VSEL=VIN
Include VSEL, EN pin current

UVLO Detection Threshold

VUVLO

2.30

2.40

2.50

V

VIN falling

UVLO Release Threshold

VUVLORLS

2.40

2.50

2.60

V

VIN rising

Circuit Current

Under Voltage Lockout

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Electrical Characteristics - continued(Unless otherwise specified VIN=3.6V Ta=25°C)
Parameter

Symbol

Min

Typ

Max

Unit

EN High Level

VENH

1.1

EN Low Level

VENL

-

EN Input Current

IEN

VSEL High LevelVSEL Low LevelVSEL Input Current

Conditions

-

-

V

-

0.3

V

-

0

1

µA

VSELH

VIN-0.3-

VIN+0.3

V

VSELL

-0.3

-

+0.3

V

IVSEL

-

0

1

µA

RONH

-

0.30

0.45

Ω

ILX =50mA

ControlPower Switch
High-side FET On-ResistanceLow-side FET On-Resistance

RONL

-

0.15

0.23

Ω

ILX=-50mA

High-side FET Switch Current Limit 1

ILIMITH1

1225

1750

2275

mA

Peak current of inductor

Low-side FET Switch Current Limit

ILIMITL

680

970

1260

mA

Bottom current of inductor

High-side FET Switch Current Limit 2

ILIMITH2

680

970

1260

mA

100%ON Mode

VOUT Discharge FET On-Resistance

RDISCH

50

100

200

Ω

IOUT=-10mA

Power Good Detection Threshold

VPGTH

-

95

-

%

VOUT risingPower Good Hysteresis

VPGHYS

-

-5

-

%

PG Low Level Output Voltage

VOLPG

-0.3

-

0.3

V

PG Output Off Leak Current

IOFFPG

-

0

1

µA

100% ON Mode Detection Threshold

V100THM

100

200

300

mV

VIN falling, VIN = VOUT + V100THM

100% ON Mode Release Threshold

V100THP

150

250

350

mV

VIN rising, VIN = VOUT + V100THP

Output Voltage Range

VOUTRG

1.2

-

3.3

V

Refer to Table 1

Output Voltage Accuracy 1

VOACC1

-2.0

0.0

2.0

%

IOUT=10mA

Output Voltage Accuracy 2

VOACC2

-2.5

0.0

2.5

%

IOUT=100mA

Startup Delay TimetSDELAY

2.5

5.0

10.0

ms

tSS

1.5

3.0

6.0

ms

Power Good Output

IPG=-1mA

100% ON Mode Transition

OutputSoft-Start TimeVSET

Table 1. Output Voltage Settings (Note 5)
VSEL1
VSEL2

1.2V

GND

OPEN

1.5V

OPEN

GND

1.8V

GND

GND

2.0V

VIN

GND

2.5V

OPEN

VIN

2.8V

VIN

OPEN

3.0V

OPEN

OPEN

3.2V

GND

VIN

3.3V

VIN

VIN

(Note 5) The output voltage is only determined by the states of VSEL1 and VSEL2 during the startup delay.
In order to reduce the current consumption, the output voltage cannot be changed by changing thestates of VSEL1 and VSEL2 after the startup delay.

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Detailed Descriptions
1.

Constant ON-Time (COT) Control
The COT control topology supports CCM (Continuous Current Mode) for medium and high load conditions andDCM (Discontinuous Current Mode) for light load conditions.
The ON-Time is set in proportion to the output voltage (VOUT), and in inverse proportion to power supply voltage(VIN). Therefore, when in CCM, even if VIN or VOUT settings changes, the IC always operates in a constant frequency
1MHz (Typ) approximately.
If the load current decreases, the IC enters DCM seamlessly to maintain high efficiency down to very light loads,
and the switching frequency varies approximately linearly with the load current.

2.

100%ON Mode
When VIN gets close to VOUT, the IC stops switching and starts 100% duty cycle operation. It connects the output tothe input via the inductor and the internal high side MOSFET switch, when VIN falls below the 100%ON Mode Enter
Threshold (V100THM). And when VIN increases and exceeds the 100%ON Mode Release Threshold (V100THP), the IC
starts to switch again.
VIN
VOUT

Soft 100%
Start MODE

100%
MODE

250mV(Typ)

V100THP
V100THM

200mV(Typ)

VPGTH
95%(Typ)

VPGHYS
5%(Typ)VUVLORLS
2.5V(Typ)

VUVLO
2.4V(Typ)PG①①①① : Soft Start End① : VIN①V100THP①① ’① VIN①V100THM

t

①①①’

High

Low

Low
t

Figure 4. 100% ON Mode Transition
3.

Ultra Low Power (ULP) Mode
2 comparators are used in this IC for monitoring VOUT.
One is main comparator (Main Comp) and the other is ULP comparator (ULP Comp).
The transition from normal mode to ULP mode is judged pulse by pulse. While the Main Comp or the ULP Compdetects the decrease in VOUT, the LX node switches for one pulse, then becomes high impedance.
If the high impedance state lasts over 8μs, the IC transits from normal mode to ULP mode.
In ULP mode, the Main Comp and the Power Good comparator (PG Comp) are disabled to reduce the current
consumption. And when the ULP Comp detects the decrease in VOUT, the Main Comp and the PG Comp areenabled, and the IC transits from ULP mode to normal mode.

8us

8us

8us

normal mode

ULP mode

normal mode

ULP mode

normal mode

Main Comp: ON
PG Comp: ON

Main Comp: OFF
PG Comp: OFF

Main Comp: ON
PG Comp: ON

Main Comp: OFF
PG Comp: OFF

Main Comp: ON
PG Comp: ON

Figure 5. Transition between Normal Mode and ULP Modewww.rohm.com© 2017 ROHM Co., Ltd. All rights reserved.
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4.

On-Time Extension
The On-Time is extended automatically to get the best transient response in the case of high duty cycle operation.
If the Main Comp Output does not return to high level within Constant On-Time, the On-Time is extended until theMain Comp Output returns to high, and the maximum On-Time is limited to 16μs.
FB
+
Ramp
Compensator
VREF

Main Comp
Output

LX
Constant
On-TimeOn-Time Extension
with delay

shot

IL

Figure 6. On-Time Extension
5.

Discharge for VOUT
VOUT pin has a MOSFET for discharge which connects VOUT pin to GND when the IC is in standby state.
(EN=Low or UVLO state or TSD state)

6.

Power Good (PG) Output
PG pin is an open-drain output.
The PG Comp is active when EN pin is set to high and VIN is above the threshold VUVLORLS.
PG pin remains low when the VOUT is lower than the PG detection threshold (VPGTH) or during the soft-start time.
PG pin goes to high impedance when VOUT exceeds VPGTH.
And it is pulled to low level once VOUT falls below the PG release threshold (VPGTH-VPGHYS).

7.

Under Voltage Lock Out (UVLO)
UVLO function prevents the malfunction of the internal circuit when VIN is too low.
If VIN falls lower than 2.4V (Typ), the IC turns off.
In order to prevent from the misdetection of UVLO, it is necessary to set VIN higher than 2.5V (Typ).

8.

Over Current Limit (OCL)
BD70522GUL employs a bottom inductor current limit function which is achieved by using the low side MOSFET.
Turning on the high side MOSFET is prohibited while the inductor current is higher than the low side OCL (ILIMITL).
This function keeps the inductor peak current lower than the sum of ILIMITL and the inductor ripple current.
However, the low side OCL function does not work if the VOUT pin is directly shorted to GND. Thus, a high side
OCL is implemented for such case. The high side MOSFET turns off when the inductor current exceeds the highside OCL (ILIMITH1). Furthermore, the peak current is limited to ILIMITH1×0.67 under the On-Time extension state.
The inductor current is also limited to ILIMITH2 under 100%ON mode, and the high side MOSFET is used to sense thecurrent in this case.

9.

Thermal Shutdown (TSD)
BD70522GUL stops the switching operation when the device temperature exceeds the TSD detection threshold
130°C (Typ) for protecting the IC from overheat. After the device temperature falls below the TSD release threshold
115°C (Typ), the IC starts the soft-start operation and recovers to the normal operation.

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95.0

95.0

90.0

90.0

85.0

85.0

80.0

80.0

75.0

75.0

E fficiency: η[% ]E fficiency: η[% ]Typical Performance Curves(Unless otherwise specified Ta=25°C)

70.0
65.0
60.0

65.0
60.0

VIN=2.6V
VIN=3.6V

55.0

70.0

VIN=2.6V
VIN=3.6V

55.0

VIN=4.2V

50.0

VIN=4.2V

50.0

VIN=5.0V

VIN=5.0V

VIN=5.5V

45.0
0.001

0.01

0.1

1

10

100

VIN=5.5V

45.0
0.001

1000

0.01

Output Current: I OUT[mA]

100.0

95.0

95.0

90.0

90.0

85.0

85.0

80.0

80.0

E fficiency: η[% ]E fficiency: η[% ]

10

100

1000

Figure 8. Efficiency vs Output Current(VOUT=1.8V)

100.0

75.0
70.0

75.0
70.0
65.0

VIN=2.8V

VIN=3.6V

VIN=3.6V

60.0

1

Output Current: I OUT[mA]

Figure 7. Efficiency vs Output Current(VOUT=1.2V)

65.0

0.1

60.0

VIN=4.2V

55.0

VIN=5.0V

VIN=4.2V

55.0

VIN=5.0V

VIN=5.5V

VIN=5.5V

50.0
0.001

0.01

0.1

1

10

100

50.0
0.001

1000

Output Current: I OUT[mA]

0.1

1

10

100

1000

Output Current: I OUT[mA]

Figure 9. Efficiency vs Output Current(VOUT=2.5V)

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0.01

Figure 10. Efficiency vs Output Current(VOUT=3.3V)

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1.236

1.854

1.224

1.836

1.212

1.818
Output Voltag e: V OUT[V]Output Voltage: V OUT[V]

Typical Performance Curves - continued(Unless otherwise specified Ta=25°C)

1.200

1.188
VIN=2.6V

1.800

1.782
VIN=2.6V

VIN=3.6V

1.176

VIN=3.6V

1.764

VIN=4.2V

VIN=4.2V

VIN=5.0V

VIN=5.0V

VIN=5.5V

1.164
0.001

0.01

0.1

1

10

100

VIN=5.5V

1.746
0.001

1000

0.01

Output Current: I OUT[mA]

Figure 11. Output Voltage vs Output Current(Load Regulation, VOUT=1.2V)

1

10

2.575

3.399

2.550

3.366

2.525

3.333

2.500

2.475
VIN=2.8V

3.267
VIN=3.6V
VIN=4.2V

3.234

VIN=4.2V

VIN=5.0V

VIN=5.0V

VIN=5.5V

VIN=5.5V

2.425
0.001

0.01

0.1

1

10

100

3.201
0.001

1000

Output Current: I OUT[mA]

0.01

0.1

1

10

100

1000

Output Current: I OUT[mA]

Figure 13. Output Voltage vs Output Current(Load Regulation, VOUT=2.5V)

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1000

3.300

VIN=3.6V

2.450

100

Figure 12. Output Voltage vs Output Current(Load Regulation, VOUT=1.8V)

Output Voltage: V OUT[V]Output Voltage: V OUT[V]0.1

Output Current: I OUT[mA]

Figure 14. Output Voltage vs Output Current(Load Regulation, VOUT=3.3V)

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1200

1200

1100

1100

1000

1000

900

900

800

800

Switching Frequency: F SW [kHz]Switching Frequency: F SW [kHz]

Typical Performance Curves - continued(Unless otherwise specified Ta=25°C)

700
600
500
400

300
200

VIN=3.6V

0

100

200

300

400

500
400

300
VIN=2.6V
VIN=3.6V

100

VIN=5.5V

0

600

200

VIN=2.6V

100

700

VIN=5.5V

0
500

0

100

200

300

400

500

Output Current: I OUT[mA]

Figure 15. Switching Frequency vs Output Current(VOUT=1.2V)

Figure 16. Switching Frequency vs Output Current(VOUT=1.8V)

1200

1200

1100

1100

1000

1000

900

900

800

800

Switching Frequency: F SW [kHz]Switching Frequency: F OSW [kHz]Output Current: I OUT[mA]

700
600
500
400

300
200

100

200

300

400

300

VIN=5.5V05000Output Current: I OUT[mA]

100

200

300

400

500

Output Current: I OUT[mA]

Figure 17. Switching Frequency vs Output Current(VOUT=2.5V)

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400

100

VIN=5.5V

0500

VIN=3.6V

VIN=3.6V

0

600

200

VIN=2.8V

100

700

Figure 18. Switching Frequency vs Output Current(VOUT=3.3V)

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Typical Performance Curves - continued(Unless otherwise specified Ta=25°C)

50.0

50.0

VIN=2.6V
VIN=3.6V

45.0

VIN=2.6V
VIN=3.6V

45.0

VIN=5.5V

VIN=5.5V

40.0

Output Ripple Voltage: VRIP[m Vpp]

Output R ipple Voltage: V R IP [mVpp]

40.0
35.0
30.0
25.0
20.0

15.0

35.0
30.0
25.0
20.0

15.0

10.0

10.0

5.0

5.0

0.0

0.0
0

100

200

300

400

500

0

100

Output Current: I OUT[mA]

200

300

500

Output Current: I OUT[mA]

Figure 19. Output Ripple Voltage vs Output Current(Peak to Peak Output Ripple Voltage, VOUT=1.2V)

Figure 20. Output Ripple Voltage vs Output Current(Peak to Peak Output Ripple Voltage, VOUT=1.8V)

50.0

50
VIN=2.8V

VIN=3.6V

VIN=3.6V

45.0

45
VIN=5.5V

VIN=5.5V

40
Output Ripple Voltage: VRIP[m Vpp]

40.0
Output Ripple Voltage: VRIP[m Vpp]

400

35.0
30.0
25.0
20.0
15.0

35
30
25
20
15

10.0

10

5.0

5

0.0

0
0

100

200

300

400

500

0

Output Current: I OUT[mA]

200

300

400

500

Output Current: I OUT[mA]

Figure 21. Output Ripple Voltage vs Output Current(Peak to Peak Output Ripple Voltage, VOUT=2.5V)

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100

Figure 22. Output Ripple Voltage vs Output Current(Peak to Peak Output Ripple Voltage, VOUT=3.3V)

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Typical Performance Curves - continued(Unless otherwise specified Ta=25°C)

Droop=113.9mV
Overshoot=65.1mV

Droop=137.5mV
Overshoot=66.9mV

VOUT

VOUT

IOUT

IOUT

Figure 23. Load Transient Response(VIN=3.6V, VOUT=1.2V, IOUT=1uA⇔500mA, tr=tf=1μs)

Figure 24. Load Transient Response(VIN=3.6V, VOUT=1.8V, IOUT=1uA⇔500mA, tr=tf=1μs)

Droop=174.9mV
Overshoot=85.6mV

Droop=260.2mV
Overshoot=88.1mV

VOUT

VOUT

IOUT

IOUT

Figure 25. Load Transient Response(VIN=3.6V, VOUT=2.5V, IOUT=1uA⇔500mA, tr=tf=1μs)

Figure 26. Load Transient Response(VIN=3.6V, VOUT=3.3V, IOUT=1uA⇔500mA, tr=tf=1μs)

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Typical Performance Curves - continued(Unless otherwise specified Ta=25°C)

VIN

VIN
Droop=22.0mV
Overshoot=22.8mV

Droop=30.4mV
Overshoot=29.6mV

VOUT

VOUT

Figure 27. Line Transient Response(VIN=2.6V⇔5.5V, tr=tf=48μs, VOUT=1.2V, IOUT=1mA)

Figure 28. Line Transient Response(VIN=2.6V⇔5.5V, tr=tf=48μs, VOUT=1.2V, IOUT=500mA)

VIN

VIN
Droop=18.8mV
Overshoot=20.0mV

Droop=32.8mV
Overshoot=30.4mV

VOUT

VOUT

Figure 29. Line Transient Response(VIN=2.6V⇔5.5V, tr=tf=48μs, VOUT=1.8V, IOUT=1mA)

Figure 30. Line Transient Response(VIN=2.6V⇔5.5V, tr=tf=48μs, VOUT=1.8V, IOUT=500mA)

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Typical Performance Curves - continued(Unless otherwise specified Ta=25°C)

VIN

VIN

Droop=20.0mV
Overshoot=28.0mV

Droop=54.0mV
Overshoot=48.4mV

VOUT

VOUT

Figure 31. Line Transient Response(VIN=2.8V⇔5.5V, tr=tf=45μs, VOUT=2.5V, IOUT=1mA)

Figure 32. Line Transient Response(VIN=2.8V⇔5.5V, tr=tf=45μs, VOUT=2.5V, IOUT=500mA)

VIN

VIN

Droop=24.4mV
Overshoot=30.4mV

Droop=50.8mV
Overshoot=48.4mV

VOUT

VOUT

Figure 33. Line Transient Response(VIN=3.7V⇔5.5V, tr=tf=30μs, VOUT=3.3V, IOUT=1mA)

Figure 34. Line Transient Response(VIN=3.7V⇔5.5V, tr=tf=30μs, VOUT=3.3V, IOUT=500mA)

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BD70522GUL
Typical Performance Curves - continued(Unless otherwise specified Ta=25°C)

VEN

VEN

VLX

VLX

VPG

tSDELAY=4.50ms
tSS=2.54ms

VOUT

VPG

VOUT

Figure 35. Startup(VIN=3.6V, VOUT=2.5V, IOUT=0mA, EN=0→VIN)

Figure 36. Startup(VIN=3.6V, VOUT=2.5V, IOUT=500mA, EN=0→VIN)

VEN

VEN

VOUT

VOUT

tSD=2.45ms(50%EN→20%VOUT)

Figure 37. Shutdown(VIN=3.6V, VOUT=2.5V, IOUT=0mA, EN=VIN→0)

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tSDELAY=4.51ms
tSS=2.57ms

tSD=134.2us(50%EN→20%VOUT)

Figure 38. Shutdown(VIN=3.6V, VOUT=2.5V, IOUT=500mA, EN=VIN→0)

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Typical Performance Curves - continued(Unless otherwise specified Ta=25°C)

VPG

VPG

VIN

VIN

VOUT

VOUT

VLX

VLX

Figure 39. Input Voltage Ramp Up/Down(VIN=0V⇔5.0 V, VOUT=1.2V, IOUT=500mA, PG=VOUT)

Figure 40. Input Voltage Ramp Up/Down(VIN=0V⇔5.0V, VOUT=1.8V, IOUT=500mA, PG=VOUT)

VPG

VPG

VIN

VIN
100%ON Mode
Operation

100%ON Mode
Operation

VOUT

VOUT

VLX

VLX

Figure 41. Input Voltage Ramp Up/Down(VIN=0V⇔5.0V, VOUT=2.5V, IOUT=500mA, PG=VOUT)

Figure 42. Input Voltage Ramp Up/Down(VIN=0V⇔5.0V, VOUT=3.3V, IOUT=500mA, PG=VOUT)

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BD70522GUL
Timing Chart
After BD70522GUL is enabled, the internal reference voltage is booted up.
When the startup delay time tSDELAY has expired, the switching is started by the soft-start operation, and the output
voltage is ramped up to the set voltage (VOUTSET) which is determined by the states of VSEL1 and VSEL2 during thestartup delay in normal operation.

VEN

VLX

VOUTSETVOUTtSDELAYtSS

Figure 43. Timing Chart

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BD70522GUL
Application Examples
L1
VIN

LX

EN

VOUT

VEN
VSEL1

PG

VSEL2

AGND

VOUT

COUT
22μF

1.2MΩ

CIN
10μF

2.2μH

RPULLUP

VIN

VPG

PGND

Figure 44. Application Example (VOUT=1.2V)

L1

VIN

LX

EN

VOUT

COUT
22μF

VEN
VSEL1

PG

VSEL2

AGND

VOUT

1.8MΩ

CIN
10μF

2.2μH

RPULLUP

VIN

VPG

PGND

Figure 45. Application Example (VOUT=1.8V)

L1

VIN

LX

EN

VOUT

COUT
22μF

VEN
VSEL1

PG

VSEL2

AGND

VOUT

2.4MΩ

CIN
10μF

2.2μH

RPULLUP

VIN

VPG

PGND

Figure 46. Application Example (VOUT=2.5V)

L1

VEN

VIN

LX

EN

VOUT

VSEL1

PG

VSEL2

AGND

VOUT

COUT
22μF

3.3MΩ

CIN
10μF

2.2μH

RPULLUP

VIN

VPG

PGND

Figure 47. Application Example (VOUT=3.3V)

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BD70522GUL
I/O Equivalence Circuits
A1: PGND, A2: LX, A3: VIN, B2: AGND

B1: VOUT

VIN

VOUT
LX

PGND

AGND

B3: EN

C1: PG
VIN

EN

VIN
PG

C2: VSEL2, C3: VSEL1

VIN

VIN
VSEL2, VSEL1

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BD70522GUL
Operational Notes
1.

Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity whenconnecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.

2.

Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.

3.

Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4.

Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electricalcharacteristics.

6.

Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,and routing of connections.

7.

Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

8.

Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions duringtransport and storage.

9.

Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result indamaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.

10. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance andextremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor andcause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to thepower supply or ground line.

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BD70522GUL
11. Regarding the Input Pin of the ICThis monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep themisolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating aparasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutualinterference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes tooperate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor

Transistor (NPN)

Pin A

Pin B

C

E

Pin A
N

P+

P
N

N

P+

N

Pin B

B

Parasitic
Elements

N

P+

N P

N

P+

B
N

C
E
Parasitic
Elements

P Substrate

P Substrate
GND

GND

Parasitic
Elements

GND

Parasitic
Elements

GND
N Regionclose-byFigure xx. Example of monolithic IC structure
12. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance withtemperature and the decrease in nominal capacitance due to DC bias and others.
13. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are allwithin the Area of Safe Operation (ASO).
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, thejunction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under nocircumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC fromheat damage.
15. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
16. Disturbance Light
In a device where a portion of silicon is exposed to light such as in a WL-CSP and chip products, IC characteristics
may be affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasuresthat will prevent the chip from being exposed to light.

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BD70522GUL
Ordering Information

B

D

7

0

5

Part Number

2

2

G

U

L

-

E 2

Package

Packaging and forming specification

GUL: VCSP50L1C

E2: Embossed tape and reel

Marking Diagram
VCSP50L1C (TOP VIEW)

1PIN MARKPart Number Marking

0522

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LOT Number

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BD70522GUL
Physical Dimension and Packing Information

Package NameVCSP50L1C< Tape and Reel Information >TapeEmbossed carrier tape

Quantity

3,000pcs/Reel

Direction of feed

E2
The direction is the pin 1 of product is at the upper left when you holdreel on the left hand and you pull out the tape on the right hand

1234

1234

Reel

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1234

1234

1pin

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1234

1234

Direction of feed

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BD70522GUL
Revision History
Date

Revision

10.Aug.2017

001

21.Aug.2017002

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Changes
New Release
Corrected the limits of “ILIMITL” and “ILIMITH2” in Electrical Characteristics.
Improved the description of OCL.
Improved Figure 5, Marking Diagram.

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Notice
Precaution on using ROHM Products
1.

Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you(Note 1)intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ

2.

ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, whicha failure or malfunction of our Products may cause. The following are examples of safety measures:[a] Installation of protection circuits or other protective devices to improve system safety[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3.

Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items[f] Sealing or coating our Products with resin or other coating materials[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue offlux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering[h] Use of the Products in places subject to dew condensation

4.

The Products are not subject to radiation-proof design.

5.

Please verify and confirm characteristics of the final or mounted products in using the Products.

6.

In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affectproduct performance and reliability.

7.

De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.

8.

Confirm that operation temperature is within the specified range described in the product specification.

9.

ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined inthis document.

Precaution for Mounting / Circuit board design
1.

When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect productperformance and reliability.

2.

In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E© 2015 ROHM Co., Ltd. All rights reserved.

Rev.003

Precautions Regarding Application Examples and External Circuits
1.

If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of thecharacteristics of the Products and external components, including transient characteristics, as well as static
characteristics.

2.

You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not beapplied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation
1.

Product performance and soldered connections may deteriorate if the Products are stored in the places where:[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation[d] the Products are exposed to high Electrostatic

2.

Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time isexceeding the recommended storage time period.

3.

Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.

4.

Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products ofwhich storage time is exceeding the recommended storage time period.

Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights
1.

All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.

2.

ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).

3.

No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution
1.

This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2.

The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior writtenconsent of ROHM.

3.

In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.

4.

The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.

Notice-PGA-E© 2015 ROHM Co., Ltd. All rights reserved.

Rev.003

Datasheet
General Precaution

1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any priornotice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.

3.

The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of orconcerning such information.

Notice – WE

© 2015 ROHM Co., Ltd. All rights reserved.

Rev.001