Single-chip Type with Built-in FET Switching Regulator Series

Boost and Inverted Output
Power Supply for TFT-LCD Displays
BD83850GWL
General Description

Key Specifications

BD83850GWL is a boost switching regulator and charge
pump inverter for small TFT-LCD Displays. It has a wide
input voltage range of 2.5V to 4.5V that is suitable forportable applications. In addition, its small package
design is ideal for miniaturizing the power supply.

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■
■
■
■
■
■
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FeaturesWide input voltage range of 2.5V to 4.5V
High frequency operation
Output Discharge Independent ON/OFF
signal(STBYP, STBYN)
Circuit protection

Input Voltage Range
Output Boost Voltage
Output Inverted Voltage
Maximum Current
Operating Frequency
Efficiency
Output Voltage AccuracyStandby Current

Package

2.5V to 4.5V
5.0V(typ)-5.0V(typ)50mA(max)
1.0MHz(typ)>85 %(typ)±2 %(typ)1µA(max)

W(Typ) x D(Typ) x H(Max)Over Current Protection (OCP)
Short Current Protection (SCP)
Under Voltage Lock Out (UVLO)
Thermal Shutdown (TSD)

Applications

TFT LCD Smart phones
TFT LCD Tablets

UCSP50L1C
1.80mm x 1.50mm x 0.57mm

Typical Application Circuit
LLX
4.7µH

LX
VIN
2.5V to 4.5V

C1
4.7µF

VIN

VREG
CVREG
4.7µF

PGND1
PGND2
AGND

V+
5.0V/max50mA

VOUTP

CP1

STBYP
STBYN

CP2

CVOP
4.7µF
CCP
2.2µF

VOUTN
CVON
4.7µF

V-5.0V/max50mA

Figure 1. Application Circuit〇Product structure : Silicon monolithic integrated circuit.www.rohm.com© 2014 ROHM Co., Ltd. All rights reserved.
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BD83850GWL

Contents
General Description ....................................................................................................................................................1
Features .......................................................................................................................................................................1
Applications ................................................................................................................................................................1
Key Specifications ......................................................................................................................................................1
PackageW(Typ) x D(Typ) x H(Max) .......................................................................................................................1

Typical Application Circuit .........................................................................................................................................1
Pin Configuration ........................................................................................................................................................3
Pin Description............................................................................................................................................................3
Block Diagram .............................................................................................................................................................4
Absolute Maximum Ratings (Ta = 25°C) ...................................................................................................................4
Recommended Operating Conditions ......................................................................................................................4
Electrical Characteristics (Unless otherwise specified VIN=3.7V Ta=25°C) ..........................................................5
Typical Performance Curves .....................................................................................................................................6
Application Information ........................................................................................................................................... 11
Description of Protection Circuits ....................................................................................................................... 11
Application Example .............................................................................................................................................13
Selection of External Components ......................................................................................................................13
Power Dissipation .....................................................................................................................................................14
I/O Equivalent Circuit ...............................................................................................................................................15
Operational Notes .....................................................................................................................................................16
Ordering Information ................................................................................................................................................18
Physical Dimension, Tape and Reel Information ...................................................................................................18
Revision History .......................................................................................................................................................19

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BD83850GWL
Pin Configuration

C

B

A

1

2

3

4

Figure 2. Pin assignment(Bottom view)

Pin Description
Pin No.

Pin Name

Function

B-1

CP2

A-3

PGND1

Boost Power ground

B-2

PGND2

Charge pump Power ground

C-1

CP1

Negative charge pump flying capacitor

B-4

VREG

Boost converter output

C-4

VOUTP

LDO output (V+)

A-1

VOUTN

Charge pump inverter (V-) output

C-2

AGND

Analog ground

B-3

STBYN

Charge pump inverter (V-) enable

C-3

STBYP

LDO enable (V+)

A-2

VIN

Input voltage supply

A-4

LX

Boost converter switch

Negative charge pump flying capacitor

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BD83850GWL
Block Diagram
VIN(Battery Voltage)

CVIN
4.7µF

CVREG
4.7µF

LLX 4.7µH
VIN

PGND1

LX

VREG

Backgate
Control

OCP

VREF

TSD

VOUTP

BOOST
CONVERTER

VREF

STBYP

SCP
VREG
UVLO

OSC1M

OSC500k

LOGIC

CP1

CHARGE
PUMP

PGND2

SOFT
START
SEQ.

CP2

OSC1M
REF

V+
CVOP
4.7µF

UVLO
VREF

STBYN

LDO

CCP
2.2µF

VREF

OSC500k
OSC1M

VOUTN

VREF

VCVON
4.7µF

AGND

Figure 3. Block diagram

Absolute Maximum Ratings (Ta = 25°C)
Parameter

SymbolRatingUnit

VIN-0.3 to 7.0

V

STBYP,STBYN-0.3 to 7.0

V

LX-0.3 to 7.0

V

VOUTP

-0.3 to 7.0

V

Pd

0.69

W

Storage temperature range

Tstg-55 to +150

°C

Junction temperature

Tjmax

+150

°C

Maximum power supply voltage
Voltage range(note1)

Power dissipation(Note 1) Derate by 5.5mW/°C when operating above Ta=25°C (when mounted in ROHM’s standard board).
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.

Recommended Operating Conditions

Parameter

SymbolPower supply voltage
Operating temperature range

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Standard value

Units

MIN

TYP

MAX

VDD

2.5

-

4.5

V

Topr

-40

25

85

°C

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BD83850GWLElectrical Characteristics (Unless otherwise specified VIN=3.7V Ta=25°C)

Parameter

SymbolStandard value
MIN

TYP

MAX

Unit

Conditions【Power Supply】
Input Voltage Range

VIN

2.5

-

4.5

V

UVLO Detect Voltage

VUVLO1

2.20

2.26

-

V

UVLO UnDetect Voltage

VUVLO2

-

2.39

2.50

V

UVLO Hysteresis Voltage

VHYS

-

0.13

-

V

VOUTP Soft Start Time

tSSVP

0.4

0.5

1.0

ms

CVOP=4.7µF+4.7µF

VOUTN Soft Start Time

tSSVN

3.7

4.1

4.6

ms

CVON=4.7µF+6.8µF

fSWLX

0.90

1.00

1.10

MHz

【Soft Start Sequence】【Boost Converter】
LX Switching Frequency
LX OCP Current

OCPLXL

0.6

-

-

A

VREG Output Voltage

VVREG

5.10

5.25

5.40

V

VREGUVLO Voltage 1

VRUVLO1

1.9

2.1

2.3

V

VREGUVLO Voltage 2

VRUVLO2

4.35

4.55

4.75

V

Output Voltage

VOUTP

4.900

5.000

5.100

V

Output Voltage Accuracy

VOUTPAQ

-2

-

2

%

Maximum Output Current

IOUTP

-

-

50

mA

Line Regulation

VOPLINE

-

0.1

-

%/V

Iout=10mA

Load Regulation

VOPLOAD

-

10

-

mV

Iout=50mA

Discharge Resistor

ROPDIS

20

40

80

Ω

VREG=5.25V

CP Switching Frequency

fSWCP

450

500

550

kHz

Output Voltage

VOUTN-5.100-5.000-4.900V

Output Voltage Accuracy

VOUTNAQ

-2

-

2

%

Maximum Output Current

IOUTN

-

-

50

mA

Line Regulation

VONLINE

-

0.1

-

%/V

Iout=10mA

Load Regulation

VONLOAD

-

10

-

mV

Iout=50mA

Discharge Resistor

RONDIS

10

20

40

Ω

VREG=5.25V

Active

VSTBH

1.5

-

VIN

V

Non-active

VSTBL

-0.3

-

0.3

V

STBY pin pull down resistance

RSTB1

500

800

1100

kΩ

Standby current

ISTB

-

0

1

µA

STBYP=STBYN=L

Circuit current of operation VIN

IDD

1.3

2.5

5.0

mA

STBYP=STBYN=H
VOUTP IL=0,VOUTN IL=0

Among Soft Start Operation【Output VOUTP】【Output VOUTN】【STBYP,STBYN】
STBY pin
Control voltage【Circuit current】

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BD83850GWL
Typical Performance Curves

Reference Data of BD83854GWL
Reference Data of BD83854GWLVUVLO2VUVLO185°C-40, 25°C

Figure 4. Standby Current vs VIN Voltage(Ta –40, 25, 85°C)

Figure 5. VIN UVLO Voltage vs Temperture

Reference Data of BD83854GWL
85°C

25°C

STBYN

-40°C

STBYP

VSTBH /VSTBL

VSTBH /VSTBL

Reference Data of BD83854GWL

Figure 6. Circuit Current of Operation VIN vs VIN Voltage(Ta –40, 25, 85°C)

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Figure 7. STBY Control Voltage vs Temperture(VIN =3.7V)

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Typical Performance Curves – continued

Reference Data of BD83854GWL

Reference Data of BD83854GWL

Iout=10mA

25°C

Iout=1mA

-40°C

85°C
Iout=50mA

Figure 8. VOUTP Output Voltage vs Temperture

Figure 9. VOUTP Load Regulation(Ta(VIN =3.7V, Iout=1m, 10m, 50mA)

Reference Data of BD83854GWL

Reference Data of BD83854GWL

Iout=1mA

Iout=10mA

85°C

25°C

-40°C

Iout=50mA

Figure 10. VOUTN Output Voltage vs Temperture(VIN =3.7V, Iout=1m, 10m, 50mA)

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Figure 11. VOUTN Load Regulation(Ta –40, 25, 85°C)

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Typical Performance Curves – continued

Reference Data of BD83854GWL

Reference Data of BD83854GWL

85°C

25°C

-40°C

Figure 13. VREG Output Voltage vs Temperture

Figure 12. LX Frequecney vs VIN Voltage(Ta–40, 25, 85°C)(VIN =3.7V, Iout=0)

Reference Data of BD83854GWL
1269AS-H-4R7N

25°C
MLP2520V-4R7M

85°C
-40°C

Reference Data of BD83854GWL

Figure 14. Efficiency vs Iout

Figure 15. VOUTP vs IVOUTP(Ta(VIN =3.7V, Ta 25°C)–40, 25, 85°C)

Efficiency= (VOUTP x Iout - VOUTN x Iout) / (VIN x Idd)

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BD83850GWLTiming Chart
Recommended Power ON Sequence (STBYP has same timing as STBYN)STBYP & STBYN are recommended simultaneously to be in H when after VIN becomes more than 2.5V (working
range voltage). The through rate should be less than 100µs when STBYP and STBYN are set H simultaneously. It is
not relating to soft start but to prevent chattering. STBYN must be high within 5ms from STBYP=H.

Table 1. Function of STBYP and STBYN
STBYP
L
L
L->H
H->L

STBYN
L
L->H
L
L

VOUTP
+0V
+0V
+5.0V
+0V

VOUTN
-0V
-0V
-0V
-0V

Function Description

L->H

L->H

+5.0V

-5.0V

STBYP and STBYN should be controlled almost at the same timing
Gap of STBYP/N should less than 5ms

H

L->H

+0V

-0V

VOUTP will be drived to "L" when setting STBYN to "H" later more than 5ms
Otherwise the internal sequence will be disrupted

The output of VOUTP/N stay "L" before STBYP become "H"
VOUTP can be controlled independently when STBYN is "L"

2.5V <

VIN

30µs
1.5V <

STBYP
STBYN

VOUTP + 0.25V

VREG 0V

2048 µs(typ)512 µs(typ)VOUTP
VOUTN 0VSTBYN Disable Time
4096 µs(typ)VOUTP = 5.0V

VOUTN = -5.0V
4096 µs(typ)Soft Start Operation
8192 µs (typ)Figure 16. Power ON Sequence Timing (STBYP=STBYN)
2.5V <

VIN

30µs
1.5V <STBYN delay capable 5ms(max)

STBYP
STBYN

VOUTP + 0.25V

VREG 0V

2048 µs(typ)512 µs(typ)VOUTP = 5.0V

VOUTP
VOUTN 0V

VOUTN = -5.0V

STBYN Disable Time
4096 µs(typ)4096 µs(typ)Soft Start Operation
8192 µs (typ)Figure 17. Power ON Sequence Timing (STBYP≠STBYN)

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BD83850GWL

Recommended OFF Sequence (STBYP has same timing as STBYN)

30µs

STBYP
STBYN
VREG
90% down 4.0ms(typ)

VOUTP

+5.0V

90% down 356µs(typ)0V

VOUTN -5.0V
90% down 216µs
Shutdown Time
4.0ms (typ)Figure 18. OFF Sequence Timing (STBYP=STBYN)

Recommended OFF Sequence
30 µs

STBYP
No Limitation

STBYN
VREG

90% down 4.0ms(typ)

VOUTP

+5.0V

90% down 356µs(typ)
0V

VOUTN

-5.0V

90% down 216µs
Shutdown Time
4.0ms + tSTBYP (typ)Figure 19. OFF Sequence Timing

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BD83850GWL
Application Information
Description of Protection Circuits(1) UVLO
Circuit for preventing malfunction at low voltage input.
This circuit prevents malfunction at the start of DC/DC converter operation when there is low input voltage bymonitoring the voltage at VIN pin. If VIN voltage is lower than 2.2V, all DC/DC converter outputs are turned OFF,and the timer latch for soft-start circuit is reset.

VIN

35µs

35µs
2.4V

2.2V
2ms

2ms

VREG
VOUTP

VOUTN
normal operation
mode

UVLO
DetectUVLO
UnDetectnormal operation
mode

Figure 20. UVLO Detect and Release Sequence Timing(2) LX OCP (BOOST CONVERTER)
Circuit for preventing malfunction at over-current.
If input inductor current being supplied by VIN exceeds rated electrical characteristics, LX Lside terminal of
DC/DC converter turns OFF.
(3) SCP
Short-circuit protection(SCP) function based on latch system that monitor VREG voltage among ON state.
The SCP detection level will be change from 2.1V to 4.55V after Soft Start Operation.When VREG pin voltage islower than the SCP detection level, the internal SCP circuit turns OFF all DC/DC converter outputs. To reset thelatch output circuit, turn OFF STBYP and STBYN pins once then turn it ON or power up the supply again.
STBYP
STBYN

SCP functionON

VREG
SCP ON

VREG monitor 2.1Ｖ
(typ)

SCP detect level

VREG monitor 4.55Ｖ (typ)

VOUTP
VOUTN

1.5ms
(typ)

8.2ms(typ)Soft Start Operation

Figure 21. SCP function ON Sequence Timing

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BD83850GWL
Restart

STBYP
STBYN
LX
LX OCP Level

ILX
OCPOver Current Load

IVREG
VREG
VOUTP

SCP Detect Level

0V

VOUTN

SCP
Detectnormal operation mode

normal operation mode

Figure 22. OCP and SCP Detect Sequence Timing(4) TSD
Circuit for preventing malfunction at high Temperature.
When it detects an abnormal temperature exceeding Maximum Junction Temperature (Tj=150°C), all outputs areturned OFF.
10µs

30µs

150 ℃
125 ℃

TEMP
2ms

2ms

VREG
VOUTP

VOUTN
normal operation
mode

TSD
DetectTSD
UnDetectnormal operation
mode

Figure 23. TSD Detect and Release Sequence Timing(5) VOUTP OCP (LDO)
Circuit for preventing malfunction at over-current.
If VOUTP load current exceeds 200mA, over-current protection circuit is activated and output current of LDO isdecreased with respect to VOUTP voltage. If short or overload condition is removed from VOUTP, then the
output returns to normal voltage regulation mode.

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BD83850GWL
Application Example

Figure 24. Suggested Layout
Selection of External Components

Component Code

Inductor [µH]1269AS-H-4R7N
MLP2520V-4R7M

4.7
4.7

Component CodeCapacitor [µF]GRM188R61C225KAAD
GRM188R61C475KAAJ

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2.2
4.7

Table 2. Inductor Selection
VendorEIA Size
Toko
TDK(Thickness max.)

1008(1.0mm)
1008(1.0mm)

0.25
0.24

Table 3. Capacitor Selection
VendorEIA Size (Thickness max.)
MurataMurata13/19

0603 (0.9mm)
0603 (0.9mm)

DCR (Typ.) [Ω]Voltage Rating [V]16
16

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BD83850GWLPower Dissipation

BD83850GWL

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BD83850GWL
I/O Equivalence Circuit

VIN, STBYP, STBYN, AGND

VREG, LX, PGND１, AGND

VIN
VREG

Back
Gate

STBYP
STBYN

LX
Body
Diode

AGND

PGND1

VOUTP, VREG, AGND

AGND

CP1, VREG, PGND2

VREG

VREG
Body
Diode

Body
Diode

CP1

VOUTP
Body
Diode

PGND2

AGND

VIN, AGND, PGND1, PGND2

CP2, VOUTN, PGND2

PGND2

VIN

CP2

PGND1
AGND
PGND2

VOUTN

P Substrate

Figure 25. I/O Equivalent Circuit

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BD83850GWL
Operational Notes
1.

Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity whenconnecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.

2.

Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of thedigital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature andaging on the capacitance value when using electrolytic capacitors.

3.

Ground Voltage
Except for pins the output the input of which were designed to go below ground, ensure that no pins are at a voltage
below that of the ground pin at any time, even during transient condition.

4.

Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5.

Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is whenthe IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.

6.

Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.

7.

Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.

Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9.

Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions duringtransport and storage.

10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result indamaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.

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BD83850GWL
Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance andextremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor andcause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to thepower supply or ground line.
12. Regarding the Input Pin of the ICThis monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep themisolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating aparasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutualinterference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes tooperate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor

Transistor (NPN)

Pin A

Pin B

C

E

Pin A
N

P+

P
N

N

P+

N

Parasitic
Elements

N

P+

N P

N

P+

B
N

C
E
Parasitic
Elements

P Substrate

P Substrate
Parasitic
Elements

Pin B

B

GND

Parasitic
Elements

GND

GND

N Regionclose-by

GND

Figure 26. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance withtemperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under nocircumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC fromheat damage.
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
17. Disturbance light
In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due
to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chipfrom being exposed to light.

www.rohm.com© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001

17/19

TSZ02201-0242AAJ00160-1-2
28.Jan.2015 Rev. 001

BD83850GWL
Ordering Information

B

D

8

Part No.

3

8

5

0

G

Part No.

W

L-

Package
MUV:UCSP50L1C

E2
Packaging and forming specification
E2: Embossed tape and reel

Physical Dimension, Tape and Reel Information

Package NameUCSP50L1C(BD83850GWL)
Lot No.

1.5±0.05

1PIN MARK3850

0.1±0.05
0.57MAX

1.8±0.05

S

12-φ 0.20±0.05
0.05 A B

0.35±0.05

0.06 S

A
C

B

A
1
0.3±0.05

2

3

P=0.4×3

4

P=0.4±2

B

Unit: mm

< Tape and Reel Information >TapeEmbossed carrier tape
Quantity
3,000 pcs
Direction ofE2
feed
The direction is the pin 1 of product is at the upper left when
you hold reel on the left hand and you pull out the tape on theright handwww.rohm.com© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001

18/19

TSZ02201-0242AAJ00160-1-2
28.Jan.2015 Rev. 001

BD83850GWLRevision History
Date

Revision

28.Jan.2015

001

www.rohm.com© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001

Changes
New Release

19/19

TSZ02201-0242AAJ00160-1-2
28.Jan.2015 Rev. 001

Datasheet

NoticePrecaution on using ROHM Products
1.

Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you(Note 1), transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ

2.

ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, whicha failure or malfunction of our Products may cause. The following are examples of safety measures:[a] Installation of protection circuits or other protective devices to improve system safety[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3.

Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items[f] Sealing or coating our Products with resin or other coating materials[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue offlux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering[h] Use of the Products in places subject to dew condensation

4.

The Products are not subject to radiation-proof design.

5.

Please verify and confirm characteristics of the final or mounted products in using the Products.

6.

In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affectproduct performance and reliability.

7.

De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.

8.

Confirm that operation temperature is within the specified range described in the product specification.

9.

ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined inthis document.

Precaution for Mounting / Circuit board design
1.

When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect productperformance and reliability.

2.

In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-GE© 2013 ROHM Co., Ltd. All rights reserved.

Rev.004

Datasheet
Precautions Regarding Application Examples and External Circuits
1.

If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of thecharacteristics of the Products and external components, including transient characteristics, as well as static
characteristics.

2.

You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not beapplied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation
1.

Product performance and soldered connections may deteriorate if the Products are stored in the places where:[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation[d] the Products are exposed to high Electrostatic

2.

Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time isexceeding the recommended storage time period.

3.

Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.

4.

Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products ofwhich storage time is exceeding the recommended storage time period.

Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights
1.

All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:2.

No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.

Other Precaution
1.

This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2.

The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior writtenconsent of ROHM.

3.

In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.

4.

The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.

Notice-GE© 2013 ROHM Co., Ltd. All rights reserved.

Rev.004

Datasheet
General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any priornotice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.

3.

The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of orconcerning such information.

Notice – WE

© 2015 ROHM Co., Ltd. All rights reserved.

Rev.001