NXP ELECTRIFICATIONSOLUTIONSSEMICONDUCTOR SYSTEM SOLUTIONS FOR THE NEXT
GENERATION OF ELECTRIFIED ECOSYSTEMSTable of Content
Introduction ................................................................ 3
EV Automotive System Solutions ....................................... 4
Propulsion Domain Control ............................................ 5
High Voltage Battery Management System (HVBMS)
Reference Design.......................................................... 6
HEV/EV Power Inverter System Reference Platform ................. 7
Digital Twin ................................................................ 8
Development Platforms .................................................. 9Real-time Processor Hybrid Control Unit ............................. 10
Microcontroller Hybrid Control Unit ................................... 11
Traction Inverter Control ................................................ 12
Electrified General-Purpose Nodes .................................... 13
The Scalable S32K3 Family: Supporting ASIL D Level Safety,
Simplifying Software Development .................................... 14Power Management: Functionally Safe System Basis Chips ....... 15
Battery Management Systems .......................................... 17
Battery Pressure Monitoring Sensors .................................. 18
Motor Control: High-Voltage Inverters ................................ 20
Features and Benefits ................................................... 20
Vehicle Network Protocols .............................................. 22
EV Charging System Solutions ........................................ 24
Key Building Blocks .................................................... 25
DC EVSE Solution .................................................... 27
NXP Product Summary ................................................ 28
SafeAssure® Functional Safety Program ............................... 29
Security Program ......................................................... 30
Available Resources ...................................................... 30

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INTRODUCTION

CHARGING INFRASTRUCTUREOUR STORY
The network of electrified endpoints — from EVs, tocharging stations, to smarter city grids — is constantly
expanding. For the network to work reliably, millions ofelectrified endpoints must stay in constant balance —providing the right information to the right place at theright time.
NXP Electrification solutions’ robust, open architecture
enables safer, more secure two-way communication fromelectrified endpoints to the cloud. Our integrated andembedded technologies give product designers andservice providers confidence to build systems with thehighest security and safety standards; with insights toimprove the performance for the whole product lifecycle.
NXP Electrification solutions offer control throughout thewhole ecosystem, not just one part—handling battery
management, fast charging, and load balancing acrossentire grids.
NXP powers electrified ecosystems with smart insightsthat securely drive safe, optimized performance.
WHICH ENERGY TO USE?
A frequent detracting argument for electric vehicles isover the increased use of electricity for slow charging. The
counter point to this argument is the reduction in gasoline
and diesel displacement and the resulting decrease inCO2 emissions.

The scale of the electric charging infrastructure is asensitive area that hasn’t been favorable for EV adoption.
Desperately inadequate for mass adoption, the majorityof the 7.3 million chargers1 worldwide are privately
owned. While the necessity of home-based charging isclear, the convenience and reassurance of widespreadcharge points are undeniable. However, Level 2 chargers,which could fully charge the EV overnight, are gaining in
popularity in large part due to incentives from states andutility companies, as well as EV manufacturers who arealso helping with its acceptance. As a result, the global
EV charger market is expected to grow at a 28.5% CAGR
between 2021 and 2028.3
BATTERY PACK EVOLUTION
Through all this, the challenge for the automotive
industry is to find the path to make electric vehicles more
profitable than ICE models. The sticking point here is thebalance between the size and cost of the battery packand the consumer acceptance for the vehicle range ona single charge. The unit cost of the battery pack andmanufacturing capacities are key to the expansion of theelectric vehicle market.
https://www.nxp.com/company/blog/back-to-thecharge:BL-BACK-TO-THE-CHARGE

With more than 3 million in sales, EVs made up 4.6%of the global car sales in 2021—another big step from theprevious year.1 In addition, Europe overtook the People’s
Republic of China (“China”) as the world’s largest EV
market for the first time.2

Powering Electrified Ecosystems

ENERGY MANAGEMENT& SECURITY

EV CHARGING

Begins with accurate and secure measurement
NXP Kinetis MCUs & Azure.

NXP supports EV charging systems
by providing high accuracy energy

Provides crypto protocols for securecommunication with the EV compliant with
ISO15118 and secure storage for credentials
and service provider specific data.

Accurate power
delivery measurement
Increased security andand machine learning (ML)Availability and reliability

safety at the edge

Efficient energy management

Standardized device APIs

Secure data storage and transfer
Secure access to charging andpayment

for billing and control
Mass deployment readiness

Enables secure communication between
EVs and the cloud for data transfer

EV charging station management
Allows key and credential rotation to onboard

Charging
Card

Banking
Card

Smart City
Card

Phone
From empty+100 miIn ~35min
Li-Ion battery pack prices are decreasing

GOAL

~40%
Home
For the Year
PublicElectrification infographic 2022
Iea. “Global EV Outlook 2021 – Analysis.” Accessed April 18, 2022. https://www.iea.org/reports/global-ev-outlook-2021?mode=overview“At 28.5% CAGR, EV Charger Market to hit USD 31158.2 Million by 2028 Globally, Says Brandessence Market Research.” Accessed April 18, 2022. https://www.prnewswire.com/
news-releases/at-28-5-cagr-ev-charger-market-to-hit-usd-31158-2-million-by-2028-globally-says-brandessence-market-research-301455432.html

1, 2
3

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EV AUTOMOTIVE SYSTEM SOLUTIONS
Accelerate to zero emissions with NXP’s electrification solutions. From battery management
to propulsion domain control, our aim is to simplify the electrification transition. NXP delivers
an electrified system solution, incorporating optimal performance, robust functional safety,
and power management features that automakers and developers require for their next
generation of vehicles.
Our automotive electrification portfolio features:• High-performance real-time processors• Micrcontrollers (MCUs) with associated power management ICs (PMICs) and system
basis chips (SBCs)• Battery cell controller and battery management solutions• Electric motor driver solutions, based on advanced functional safety IGBT gate drivers• In-vehicle networking components for CAN, LIN, FlexRay™ and Ethernet• Scalable functional safety• Automotive robustness with electrification mission profiles (EMP)• Enablement platforms, reference designs and evaluation boards• Worldwide presence and support

AC-DC
Charger

Major Components
Battery Management
SystemAC

Motor Control(HV inverters)

DC

Propulsion Domain Control

BMS(Torque/energy management & optimization)

48 V eMachine(BSG, ISG, HVAC)
DC/DC Voltage
Domain Converter
Onboard Charger
AC/DC converter

HV
Li-ionBattery~Motor Control

Motor(s)

=

M
MM

=

~
Propulsion Domain
Control (PDC)

48 V or> 60 V (e.g., 400 V)

48 V and HVModules=
BMS
LV
lead-acidor Li-ion
Battery=

12 V
12 V-Bus
Modules

Electric Vehicles: Base Architecture Components

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PROPULSION DOMAIN CONTROLThe propulsion domain control (PDC) is the brain of the powertrain control for hybrid or electric vehicles.
It controls the power distribution, energy storage, engine and motor. As such, it is key for enhancing the efficiencyof the xEV powertrain.
BENEFITSSUPPORTED DEVICES• NXP S32Z/E: market leader for propulsion domain
controllers and zonal architectures with automotive
ASIL D real-time compute performance• FS66: functionally safe multi-output power supply
integrated circuit• Virtual automotive ECU development platform available
FEATURES• Executes multiple applications, including hybrid electric
control with advanced algorithms, all under hypervisor• Energy and thermal management• S32Z2: Based on the Arm Cortex-R52 core, the S32ZS24
and S32E2 real-time processors are designed forautomotive vehicle dynamics, domain control and safety
coprocessor applications. They offer support for thehigh levels of automotive safety and the performanceheadroom to manage the transition to advanced
electrification and autonomous vehicle applications.

• Regenerative braking• Battery states (charge, health, function) management– Advanced algorithms (torque vectoring, A-ECMS, etc.)

IVN– Inter-domain communication, acts on ADAS domain
messages

Inverter
Isolated
High-Voltage
Gate Driver

High-Voltage
IGBT/
MOSFETNXP Technology

EV Powertrain Control Block Diagram

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HIGH VOLTAGE BATTERY MANAGEMENTSYSTEM (HVBMS) REFERENCE DESIGN
NXP’s HVBMS reference design (HVBMS RD) has ascalable ASIL D architecture for high-voltage applications
it is composed of three modules: the BMU, the CMU
and the BJB. At NXP we offer solutions for each module.
The BMU board features an ASIL D microcontroller - theS32K3. The CMU includes ASIL D compliant battery cell
controllers and the BJB two of our recently launchedMC33772C ICs

KEY GENERAL FEATURES• Scalability: HVBMS chipset solutions for a wide range
of applications to reduce development cost and enable
faster time to market.
• Safety: High system-level safety level ensures proper
operation of the battery at all times, protecting thepassengers.
• Precision: Precise and synchronized measurement
increases battery potential and maximizes range.

CMU A
HVSense_CH+

Battery

Car system

Internal & external chargers, converters, inverters & HV loads

HVSense_HV+

CMU B

BJB
HVCtrlx

IsoSense

HVBMS Block Diagram

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HEV/EV POWER INVERTER SYSTEMREFERENCE PLATFORM
This power inverter system reference platform includes:

BENEFITS• MPC5775E: secure multi-core 32-bit lockstep MCU with
software resolver• ASIL C/D compliancy with small, compact 9 IC
system footprint• FS65: Grade1/Grade0 Safety SBC, fit for ASIL D,
with two fail-safe outputs for motor control safety
management• Robust fail-silent SBC with operation from 36 V
down to 2.7 V• GD3160: advanced single-channel high-voltage isolated
gate driver• GD3162: advanced galvanically-isolated, single-channel
gate driver• TJA1051: redundant CAN bus interface with low-power
standby• Enablement software with API and functional safety case

• Secure multicore 32-bit lockstep MCU with eTPU
and SW RDC• Functional safety case and enablement softwarewith API• < 2 µs iSense-compatible 2-level IGBT OC protection
with soft shutdown
FEATURES• Efficiently drives 100 kW 3-phase motor from
400 V supply• Integrated galvanic signal isolation in IGBT/SiC
gate drivers• Redundant CAN bus interface with low-power standby• Primary and backup battery inputs with no negativegate driver supply• Supported by S32DS SDK with MCAL drivers

DC/DC

HVBAT

LV HV

Link
Capacitor

To HVDisconnect

VBAT

VVCC

IGN

VMCU

SPI
Motor

SBC

Fault
SPI
PWM
Fault

Fail-Safe
Circuitry

Gate Driver
w/ HV

x6

x6

RST

MCU
Voltage/Temp
Sense
CAN

CAN
Transceiver

CAN

SoftwareResolver toDigital Converter

NXP Technology

Non NXP Technology

Optional Technology

Hybrid and EV Powertrain Block Diagram

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DIGITAL TWIN
Digital twins are virtual representations of real-world
situations. With AI, machine learning, processors andsensors, it gets easier to create those digital models
that show what is happening in manufacturing sites, electriccars and hospitals - and will help to improve simulations,
testing, monitoring and maintenance processes.
Digital twin cloud services have a high potential to
improve estimations of the battery’s state of health (SoH)and state of charge (SoC to improve efficiency, lifetimeand cost. Battery digital twins adapt to ongoing changes
in battery health due to operating conditions and provide
updated figures back to the BMS for continuously
improving control decisions.
SUPPORTED DEVICES• MC33775A: 14 cell lithium-ion battery cell controller IC• MC33665A: General-purpose battery management
communication gateway and TPL transceiver• FS26: Safety SBC with low power fit for ASIL D• TJA1145: High-speed CAN transceiver for partial
networking• TJA1443: High-speed CAN transceiver with standby,
sleep and listen only mode
• TJA1057: High-speed CAN transceiver• MC40XS6500: External automotive lighting multi-channel
eXtreme switch• HB2000: H-Bridge motor driver family is SPI
programmable with multi-packages, ASIL B/D with 120
mohm typical RDS(ON) fit for high safety applications• PCA2131: Nano-power highly accurate real-time clock(RTC) with integrated quartz crystal for automotive
applications• NBP8: Fully integrated battery monitor sensor• EVE-Ai 360 Adaptive Controls: Artificial intelligence& machine learning from Electra Vehicles• S32K3: microcontrollers fit for ASIL D ASIL D
functional safety• S32G: Safe and secure multi-core Arm® Cortex®-A53
application processors with optional cluster lockstep
support and dual-core lockstep Cortex-M7 real-time
microcontrollers fit for ASIL D safety

Battery
Analytics
Digital Twin
Battery

VehicleNetworking
GoldBoxCloud

BJB
Digital Twin Block Diagram

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DEVELOPMENT PLATFORMS
In addition to our development platforms, evaluation boards and tools are available to help accelerate yourelectrification designs.
EVB NAME

DESCRIPTIONMTRCKTDPS5643L
MOTOR CONTROLDEVKIT-MPC5744P
MPC5775BE-416DS Adapter

BMS

RD33771CNTREVM

Reference design for mixed centralized-distributed architecture BMS for electric vehicle applications

RD33771CDSTEVB

14-channel Li-Ion BCC with isolated daisy chain interface with MC33771C BCC

FRDM33771CSPEVB

14-channel high performance Li-Ion BMS with SPI interface using MC33771C BCC

FRDMDUAL33664EVB

Dual TPL interface between MCU and isolated network with loopback using MC33664 device

FRDM33771BTPLEVB

14-channel Li-ion battery cell controller with isolated daisy chain interface using MC33771B BCC

FRDM33664BEVB

TPL interface between MCU and isolated network using MC33664 device

FRDM33772BTPLEVB

6-channel Li-Ion BCC with isolated daisy chain interface using MC33772B BCC

FRDM33664BEVB

Transceiver physical layer (TPL) interface between MCU and isolated network using MC33664 device

RD33771-48VEVM

48 V mild hybrid auxiliary battery management system reference design

FRDM33771CSPEVB

14-channel high performance Li-Ion BMS with SPI interface using MC33771C BCC

FRDM33771BSPIEVB

14-channel Li-ion battery cell controller with SPI interface using MC33771B BCC

FRDM33771BTPLEVB

14-channel Li-ion battery cell controller with isolated daisy chain interface using MC33771B BCC

FRDM33664BEVB

Transceiver physical layer (TPL) interface between MCU and isolated network using MC33664 device

NEWTEC-NTBMS

12 V battery management system for Li-Ion batteries supporting ASIL C safety levels

RD9Z1-638-4LI

4-Cell Li-Ion BMS with high EMC performance and CAN interface using MM9Z1_638 sensor

RD9Z1-638-12V-C

12 V lead-acid BMS with high EMC performance with CAN interface using MM9Z1_638 sensor

RD9Z1-638-12V

12 V lead-acid BMS with high EMC performance with LIN interface using MM9Z1_638 sensor

FRDM33772BSPIEVB

RD33772BJBEVM

6-channel BCC for Li-Ion battery applications with SPI interface using MC33772B BCC
For automotive engine control applications that require advanced performance, timing systems andfunctional safety capabilities
GreenBox, advanced performance, peripherals and multicore Arm® environment for HEV and EV
development with peripheral board for HEV and ICE applications
High Voltage Battery Junction Box (BJB) RD with functional safety, voltage, current, temperature andinsulation measurement function

MPC5775B-EVB

Low-cost development boards engineered for battery applications

RDVCU5775EVM

RD772BJBTPLEVB

Reference design for high-voltage BMS and vehicle control unit integration for ASIL D applications
Reference design for rapid prototyping of a high-voltage battery management system (HVBMS) hardware
and software
Centralized cell monitoring unit (CMU) reference design with transformer physical layer (TPL) communicationthat is ideal for rapid prototyping of a high-voltage battery management system (HVBMS) hardware andsoftware
A battery junction box (BJB) reference design that is ideal for rapid prototyping of a high-voltage battery
management system (HVBMS) hardware and software

BATT-6EMULATOR

6-cell battery pack to supply MC33772 EVBs—emulates a multi-cell battery pack

BATT-14CEMULATOR

14-cell battery pack to supply MC33771C EVBs—emulates a multi-cell battery pack

BATT-14EMULATOR

14-cell battery pack emulator made to supply MC33771B BCC EVBs

BATT-14EXTENDER NE

Allows for the connection up to four evaluation boards using only one single battery emulator

BATT-14AAAPACK

A configurable battery pack that can be used to supply the MC33771 or MC33772 evaluation boards

KIT9Z1J638EVM

Battery sensor for current, voltage and temperature with CAN/LIN interface using MM9Z1_638 sensor

MPC5775BE-516DS Adapter
S32EDEVPL

HVBMS

RD-K344BMU
RD33775ACNTEVBBATTERY PACKBATTERY SENSOR
GATE DRIVER
TRACTION INVERTER

Dual 3-phase PMSM development kit with MPC5643L microcontroller; suitable for applications requiring 2
PMSM motors, such as active suspension or electric powertrain
Offers dual e200z4 lockstep cores, motor control, safety and communication interfaces to facilitate acomplete safety/ chassis solution for motor control applications
MPC5775B MCU targets industrial and automotive battery management systems (BMS); the MPC5775E
targets HEV/ EV inverter control systems that require advanced performance; eTPU-based timer system andISO 26262/IEC 61508 functional safety support up to ASIL D

FRDMGD3160DSBHBFRDMGD3160XM3EVM
ICP2.0EV-INVERTERHDBT

Half-bridge evaluation kit populated with two GD3160 single channel IGBT/SiC MOSFET gate drive devices.
Second gen automotive grade IGBT- EV power inverter control platform (ICP2.0) system solution based on
GD3160 gate driver IC offers both hardware and software enablement for electric vehicle traction inverters
application targeting ISO 26262 ASIL C/D using IGBT power modules

Battery
Management
SystemTraction
Motor

Hybrid Vehicle
Control Unit
TractionMotor

NXP GreenBox
Development Platform
Target Applications

Traction
Motor
Internal
Converter

EngineTraction
Motor

GreenBox Platform

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REAL-TIME PROCESSOR HYBRID CONTROL UNIT

Power
Conn:
PJ-202OH

Safety SBC
FS26

10BASET1S PHY

JTAG Conn.

MAC

JTAG

SPI

S32K148

CAN0-2CAN FDXCVR:
TJA1448

I2C0
Safety SBC
FS86

CAN0-3

Safety SBC
FS5030RCON Switch

RCON0-31

CANXL0CANXL1

EEPROM:
AT24C01

RCON7-8

LIN5-6
LIN3,12uSDHC

SD Ctrl:
NVT4857UK

QSPI1_A
FRA0
FRA1

CAN
COMMS

CAN FDXCVR:
TJA1448

CAN XLXCVR:
TJA1448LIN
XCVR:
TJA1124
COMMS1

FlexRay
XCVR:
TJA1081
I2C1,12C2, DSPI7,

eMMC:
MTFC32GAZAQHDSENT1, PSI50
GTM, eMIOS, ADC0Quad Flash:
MT25QL256A
BA8E12QSPI1_B

HyperFlash:
S26HS512TG
ARHV000QSPI0

LPDDR4:
MT53E1G16D

DDR0

PBW/PBY/PBZ SAR,PBU GPIO
DSPI5, LIN1, GPIO, GTM, EIRQ

BMS
Conn.

BMS XCVR:
MC33664A
TL1EG

DSPI1-2

S32E
Up to 8x Arm® Cortex®-R52@ 800 MHzPBV/PBW/PBX SARPBD/PBE/PBU GPIODSPI9, LIN12, GPIO, GTM, EIRQPBU/PBV/PBW/PBX SARPBD/PBE/PBU GPIODSPI7, LIN5, GPIO, GTM
ADC0, EIRQPBZ ZAR

CLKOUT1

Motor Ctrl
Conn 1:
PCIE
Motor Ctrl
Conn 2:PCIE
GTM
Conn 2:PCIE

SGMII x4

ETH
COMMS

Ethernet
Switch:SJA1110100BASE-T1 x6

MATENET:
2339800-1

GMII PHY
x2

GMII x2

CLKOUT4

JTAG
Conn.

AE DieGTM
Conn 2:PCIEeMIOS0, eMIOS1

SMA: 142

SMA: 142

COMMS2

PBC/PBD/PBU GPIOJTAG
GMAC0-1
DSPI4

AuroraConn.

Micro-B
USB Conn.

USB
UART:
FT232RQ

LIN9Micro-AB
USB Conn.

OpenSDA:
MK26FN2
M0VMI18LIN12ZIPWIRE0ZIPWIRE1

GMII RJ-45

ZIPWIREx2

RESET0Reset Bttn.

JTAG
Conn.

JTAG

NXP Products

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MICROCONTROLLER HYBRID CONTROL UNIT
The hybrid control unit (HCU) is a core control component for hybrid and electric vehicles. It uses input signals to
calculate and manage output parameters such as engine power or motor torque.
S32Z2 AND S32E2 SAFE REAL-TIME PROCESSORSThe S32Z and S32E are Arm Cortex-R52-based microcontroller for automotive vehicle dynamics, domain control andsafety coprocessor applications. They support for the highest levels of automotive safety and provide the performanceheadroom to manage the transition to advanced electrification and autonomous vehicle applications.
FEATURES AND BENEFITS• 8x Arm Cortex-R52 plus Lockstep Arm Cortex-M33• Advanced safety functionality and fault recovery tosupport ASIL D applications• Combine real-time and DSP/ML processing withhardware virtualization, scalable non-volatile memory,
flexible expansion memory support and network
acceleration• Hardware security engine supporting public and private
key encryption• AEC-Q100 Grade 1 device with support from -40 °C
to 150 °C (junction)• On-the-fly, over-the-air update capability with zeroprocessor downtime

Real-Time Unit 0 (4 x Cortex-R52)

Real-Time Unit 1 (4 x Cortex-R52)

DSP/ML
Processor

System Manager(Cortex-M33)
Arm® Cortex®-R52

Cortex-R52

Cortex-R52

Cortex-R52

32 KB L1I 16 KB L1

32 KB L1I 16 KB L1D

32 KB L1I 16 KB L1D
Neon
FPU
SIMD

32 KB L1I 16 KB L1D

Neon™
SIMD

Neon
SIMD

FPU

3x TCM 64/16/16 KB

FPU

3x TCM 64/16/16 KB

FP Vector DSP
Neon
SIMD

3x TCM 64/16/16 KB

Cortex-M33
32 KB I Cache

FPU

8 KB L1 I and D
TCM 256 KB

3x TCM 64/16/16 KB

MemoryEthernet Acceleration
FlexLLCE

19 MB Total SRAM with ECC
Ethernet Subsystem (NETC3)ENET Switch

0 MB/16 MB/32 MB/64 MB NVM
512 KB Data Flash Memory with ECC
LPDDR4 (Flash or DRAM) with ECC + IEE

Cortex-M33

768 KB SRAM

Cortex-M33
24x FlexCAN FD

QuadSPI NOR Flash I/F + OTFAD
10 Mb/100 Mb/1 Gb
MAC

10 Mb/100 Mb/1 Gb
MAC

eMMC/SDHC NAND Flash I/FHyperRAMTM I/F with inline ECC

System Control Unit and Safety
Power Control, Clocks, Reset
BootROMs
PMIC interface (SPI/I3C)

Timestamping

Connectivity/Interfaces

Security
Hardware Security Engine (HSE)
Cortex-M7

Secure Memory

Symmetric/Asymmetric Cryptos

Domain Resource Partitioning (XRDC)

RNG

VFCCU

Physical Protection

MBIST, LBIST
Debug

Security Offload

Lifecycle

2x Zipwire
2x FlexRay ®
10x SPI, 1x MSC
2x CAN XL
16-ch SENT

12x LIN
3x I3C®
2x PSI5, 2x PSI5_S

2x eFlexPWM, 4x eTimer
3x CTU, 2x eMIOS
4 clusters x GTM 4.1 (optional)
2x 1.8 V 12-bit SAR ADC (8-ch total), SINC Filter
5x (68-ch total) 3.3/5V 12-bit SAR ADC

E-Fuses

S32E2 Processor Block Diagram

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TRACTION INVERTER CONTROLThe S32K39 is a purpose-built device addressing new EV traction inverter control needs with a compelling
combination of performance, integration, networking, security and functional safety capabilities.
It has enough compute power to support six-phase or two three-phase motors controlled by over 200 kHz control
loops, while hosting AI/ML algorithms or other monitoring applications. It supports remote smart actuation applications
using Time-Sensitive Networking (TSN) Ethernet for new zonal vehicle architectures. And it reduces system cost with
ASIL D software resolver and analog integration.
COMPUTEANALOG-TO-DIGITAL• Three Arm Cortex-M7 cores running at 320 MHz• Seven SAR-ADC (69 ch)• One lockstep core pair

• Four Sigma-Delta ADC• Two split-lock configurable cores• Two sine wave generator (SWG)• Two motor control coprocessors running at 320 MHz(S32K39 only)• Two analog comparators
FUNCTIONAL SAFETY AND SECURITY• Programmable CoolFlux™ DSP running at 160 MHz• ISO 26262 up to ASIL D
SMART TIMERS• Designed to support ISO/SAE 21434• Two eFlexPWM (12 ch) with NanoEdge (8 ch)• NXP hardware security engine (HSE_B) accelerates
symmetric and asymmetric cryptos• One eMIOS (24 ch)• Two logic control units (LCU)

CPU Platform

Lockstep

Split-Lock Capable

Arm Cortex-M7

Arm® Cortex®-M7
16 KB I-cache

16 KB I-cache

16 KB D-cache

16 KB I-cache

4 MB or 6 MB Embedded NVM

16 KB D-cache

TCM: 32 KB-I, 64 KB-D

TCM: 32 KB-I, 64 KB-D

TCM: 32 KB-I, 64 KB-D

SPFPU, DSP

SPFPU, DSP

SPFPU, DSP

AnalogSine Wave Generator (SWG) x2

512 KB of SRAM with ECC
Including 64 KB Standby

DSP16L4 Threads

Arm Cortex-M7

Arm Cortex-M7

16 KB D-cache

MemoryCoolFlux DSP

32 KB-I

24 KB-D
128 KB D-Flash with ECC

Smart Motor Control, Timers and I/O
Motor Control Coprocessors x2
Logic Control Unit (LCU) x2

SD-ADC x4
SAR-ADC x7 (69 ch)
eFlexPWM (12 ch) x2 with NanoEdge (8 ch) x2
Analog Comparator x2

Motor Control
Core A

32 KB-I

Motor Contro
Core B

Timer
Channels x32

8 KB-D

Timer
Channels x32

System and Safety
eDMA (64 ch) with 32-ch lockstep
Power Control, Clocks, Reset
BootROMs

Security

Fault Collection and Control Unit (FCCU)PIT x 3, RTC x1, STM (4 ch) x3, SWT x3

Connectivity / Interfaces

Hardware Security Engine (HSE_B)
Arm Cortex-M0+

Secure Memory

Symmetric / Asymmetric Cryptos

PMIC Interface (SPI / I2C)
Domain Resource Partitioning (XRDC)eMIOS (24 ch) x1
Body Cross-Triggering Unit (BCTU) x2

Zipwire x1
CAN FD x6

LIN / UARTSPI x6DSPI / MSC

QSPI x 1 (8-bit)

I2C x2

Random Number Generators (RNGs)
Ethernet 100 Mbit/s x1(AVB/TSN)
Physical Protection

Self-Test (MBIST, LBIST)
Debug, Temp Sensing and Calibration

Lifecycle (Upgrade Management)

FlexIO (8 ch) x 1(Camera, I2C, I2S, PWM, SENT, SPI, UART)

E-Fuses

Features added from the S32K37x

S32E2 Processor Block Diagram

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ELECTRIFIED GENERAL-PURPOSE NODESTHE SCALABLE S32K1 FAMILY: ACCELERATED DESIGN
TIME, LOW-POWER PERFORMANCE• Performance and integration with future-proof designs• Automotive-grade software with minimized complexity• Broad portfolio allows maximized reuse

RUNTIME SOFTWARE• Automotive-grade NXP software development kit (SDK)• NXP middleware e.g., core self test, LIN stack• AUTOSAR 4.0 and 4.2 MCAL
• FreeRTOS

S32K FUNCTIONAL SAFETY SOFTWARE• Bootloader• Cortex-M Core Self-Test Library: Structural Core
Self-Test Library (SCST) is a safety measure against
permanent faults in the cores

SOFTWARE DEVELOPMENT TOOLS• IAR, GHS and GNU toolchains• Developed for detecting hardware permanent faults
in a core by means of executing machine op-codeswith fixed set of operands and comparing their
execution results• Full-featured, no-cost development platform (S32 DS)• This library is considered as Safety Element out ofContext and was developed according to ASIL B• Motor control• SCST library provides tests to achieve the claimed
diagnostic coverage (analytically estimated)• Secure communication

HARDWARE PLATFORM• Near-field communication• FreeMASTERAPPLICATION SPECIFIC• Touch sensing• Wireless charging• Low-cost development board compatible toArduino® shields• Onboard debugger and system basis chip

S32K116

S32K118

Arm® Cortex®-M0+ @ 48 MHz

Common Features

S32K146

S32K148

Arm Cortex-M4F @ up to 112 MHz

256 KB FlashCSEc Security Module

17 KB SRAM

24 KB SRAM

Low Power Operating Modes
and Peripherals

up to 42 I/Os

up to 58 I/Os

ASIL-B Capable:(ECC, MPU, CRC, W’DOGs)

4 channel eDMA

LPUART, LPSPI,LPIIC, FlexIO

1x FlexCAN with 1x FD

FlexTimers, LP Timers, Prog.
Delay Block

1x 16-ch.,12-bit ADC

S32K144

S32K142W

S32K144W

Arm Cortex-M4F @ up to 80 MHz

AEC-Q100, 5 V

128 KB Flash1x 13-ch.,12-bit ADC

S32K142

8-40 MHz Ext. Osc,
8/48 MHz Osc., 128 KHz LPO

256 KB Flash512 KB Flash

1 MB Flash2 MB Flash256 KB Flash512 KB Flash

32 KB SRAM

64 KB SRAM

128 KB SRAM

256 KB SRAM

32 KB SRAM

64 KB SRAM

up to 128 I/Os

up to 156 I/Os

up to 89 I/Os

up to 58 I/Os

16 channel eDMA
2x FlexCAN
with 1x FD

3x FlexCAN
with 1x FD

2x 16-ch., 12-bit ADC

3x FlexCAN
with 2x FD

3x FlexCAN
with 3x FD

2x FlexCAN with 2x FD

2x 24-ch.,12-bit ADC

2x 32-ch.,12-bit ADC

2x 16-ch., 12-bit ADC*JTAGIEEE® 158
ENET

S32DS IDE, SDK

Quad SPIReal Time Drivers (RTD)

ETM Trace

AUTOSAR MCAL/OS

2x SAI

Application SW
S32K14x only

S32K General-Purpose Microcontoller Common Features

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13

SCALABLE S32K3 FAMILY: SUPPORTING ASIL D LEVELSAFETY, SIMPLIFYING SOFTWARE DEVELOPMENT• Safety
documentation
and®
SafeAssure community support• Lockstep Arm Cortex-M7 cores, 120-240 MHz + FPU• 512 KB, 8 MB Flash with ECC• HSE security engine: AES-128/192/256, RSA and ECC
encryption; secure boot and key storage; side channel
protection; ISO 21434 intended• FOTA, A/B firmware swap with zero downtime androll-back support. Automatic address translation• Ethernet TSN and AVB (100 Mbps/1 Gbps), I3C,CAN FD, FlexIO (SPI/IIC/IIS/SENT protocol), serial audio
interface, QSPI

• 12-bit 1 Msps ADCs, 16-bit eMIOS timers with logic
control unit for motor control• Low power Run and Standby modes, fast wake-up,
clock and power gating

MAXQFP PACKAGE TECHNOLOGY• MaxQFP and BGA packages• QFP ‘gull-wing’ + PLCC ‘J-lead’ in single package

S32K3 – SAFETY, SECURITY AND CONNECTIVITY• 172-pin (16 x 16 mm), 100-pin (10 x 10 mm), and0.65 mm pin pitch• ISO 26262 up to ASIL D• AEC-Q100 qualified: Grade 1 (-40° C to +125° C)
and Grade 2 (-40° C to +105° C)• Fault collection and control unit (FCCU)• Hardware and software watchdogs,
clock/power/temperature monitors

K311
Common Features

K312

K314

1 x Arm® Cortex ®-M7

AEC-Q100, 125 °C, 3.3/5 V

1x Cortex-M7@160 MHz@120 MHz

HSE-B
Crypto Security Engine

1 MB Flash2 MB Flash

4 MB Flash

FOTA(Firmware Over-the-Air)

128 K SRAM

192 K SRAM

512 K SRAM

up to 143 I/Os

up to 218 I/Os

Low-Power Operating Modes and Peripherals(LP UART, FlexIO)
ASIL B/D Safety:(ECC Memories, MPU, CRC, Watchdogs)

eMIOS Timers, Analogue Comparator, Logic Control
Unit, Body Cross Triggering Unit, Trigger Mux

up to 84 I/Os
16-ch. eDMA

32-ch. eDMA

3 x CAN(3 x FD)

6 x CAN (6 x FD)
100 Mbit/s
Ethernet (TSN)

1 x I3C and 2 x I2CJTAG
S32 Design Studio IDE

1 x I3C and 2 x I2C

2 x I2C

4 x SPI*

6 x SPI*2 x 24-ch.
12-bit ADC

3 x 24-ch.
12-bit ADC

Real-Time Drivers(AUTOSAR® and Non-AUTOSAR)
Security F/W Safety
Software Framework
Application Software

2 x SAI (I2S)
Quad SPIMaxQFP-172

LQFP-48
MaxQFP-100

MAPBGA-257

S32K31x Family Features Part 1 Block Diagram

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14

SCALABLE S32K3 FAMILY: SUPPORTING ASIL D LEVEL

Common Features

AEC-Q100, 125 °C, 3.3/5 V
HSE-B
Crypto Security Engine
FOTA(Firmware Over-the-Air)

K322

K324

2 x Cortex-M7 @160 MHz

eMIOS Timers, Analogue
Comparator, Logic Control Unit, Body
Cross Triggering Unit, Trigger Mux

K344

1 Lockstep Cortex-M7 @ 160 MHz

2 MB Flash

4 MB Flash

1 MB Flash2 MB Flash

4 MB Flash512 k SRAM

256 k SRAM

256 k SRAM

512 k SRAM

up to 143 I/Os

up to 218 I/Os

up to 143 I/Os

up to 143 I/Os

up to 218 I/Os

4 x CAN(4 x FD)

6 x CAN(6 x FD)

32-ch. eDMA
4 x CAN(4 x FD)

6 x CAN(6 x FD)

1 x I3C and 2 x I2C

2 x I 2C

4 x CAN(4 x FD)

1 x I3C and 2 x I2C

1 x I3C and 2 x I2C

2 x I 2C

4 x SPI*

6 x SPI*

4 x SPI*

4 x SPI*

6 x SPI*2 x 24-ch.
12-bit ADC

3 x 24-ch.
12-bit ADC

2 x 24-ch.
12-bit ADC

2 x 24-ch.
12-bit ADC

3 x 24-ch.
12-bit ADC

100 Mbit/s Ethernet (TSN)JTAG

2 x SAI (I2S)

S32 Design Studio IDE

Quad SPI

Real-Time Drivers(AUTOSAR® and Non-AUTOSAR)

MaxQFP-172

Security F/W Safety
Software Framework
Application Software

K342

256 k SRAM

Low-Power Operating Modes
and Peripherals(LP UART, FlexIO)
ASIL B/D Safety:(ECC Memories, MPU, CRC,
Watchdogs)

K341

MaxQFP-100

MaxQFP-100

MaxQFP-100

MAPBGA-257

MAPBGA-257

S32K31x Family Features Part 2 Block Diagram

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15

POWER MANAGEMENT: FUNCTIONALLY SAFE SYSTEM BASIS CHIPS
FS45 AND FS65 GRADE 1 AND GRADE 0 SAFETY POWER SYSTEM BASIS CHIPS
The family of FS45 and FS65 safety SBC chips provides power management to MCUs by the optimization of energy
consumption through DC-DC switching regulators, linear regulators and ultra-low-power saving modes.
FEATURES AND BENEFITS• Physical and electrical independence to target
ASIL B or D applications• Configurable RSTb activation provides more
system availability• Power management monitoring unit (UV/OV/OC)• Redundant system fail-safe enabler• Analog and digital built-in self-test to minimize
latent faults• Second fail-safe pin to assert safety path withconfigurable delay after failure• Redundant reference and supply to reduce common
cause failure• Long-duration timer (from seconds to months)
to simplify RTC function and reduce costs• VCORE external monitoring• FCCU: fault collection control unit

• Tracker rail, short circuit to battery proof,
to supply external ECU loads (sensors, etc.)• Monitor lock-step MCUs

• FCRBM: Feedback Core Resistor Bridge Monitoring

MCU

VDD_HV ADR

FS65 Functionally Safe System Basis Chip Block Diagram

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16

POWER MANAGEMENT: FUNCTIONALLY SAFE SYSTEM BASIS CHIPS (cont.)
The FS66 is an automotive, functionally safe multi-output power supply integrated circuit. It’s focused on powertrain,safety and chassis applications and is the primary companion chip of the S32Z and S32E Real-Time processors.
FEATURES• 60 V DC maximum input voltage fits for 12 V and
24 V systems• Multiple SMPS and LDO to supply S32Z and S32E
Real-Time processorsand more

• Standby OFF mode with very low sleep current (<10 µA)• 32-bit SPI interface with CRC• Fit for ASIL D with independent safety monitoring unit

Power Management
and System

FS66
1 x Low-Voltage BOOSTOTP
SPI interface
Sequence Control
Analog MUX

1 x High-Voltage
BUCK Controller

3 x Low-Voltage BUCK

2 x Low-Voltage LDO

Independent Safety
Monitoring Unit

Physical and Electrical IsolationOTP
SPI Interface
CRC, ECC

6 x Voltage Monitoring
Watchdog Monitoring
MCU HW Error Monitoring
Ext. IC Error Monitoring

3 x Safety Outputs

Latent Fault Coverage (LBIST, ABIST)

FS66 Block Diagram

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17

BATTERY MANAGEMENT SYSTEMS
MC33771 AND MC33772 REV C BATTERY CELL CONTROLLER SOLUTION
Battery topology flexibility• Scalable software- and hardware-compatible BMS
solution supporting 3 to >800 cells per daisy chain

Diagnosis and functional safety supporting ISO 26262
with single chip
• Designed to support ISO 26262 up to ASIL D safetysystem• MC33771 (7 to 14 cells) and MC33772 REV C(3 to 6 cells) fully compatible• Sleep mode OV/UV and temperature monitor• Supporting centralized, distributed daisy chain,
distributed CAN• Detection of internal and external faults, i.e., open lines,
shorts, and leakages

High integration level• Integrated balancing diagnostics• Synchronized on-chip current sensor

Automotive robustness• Synchronized on-chip coulomb counter• ESD, EMC; Hot Plug, AEC-Q 100• Integrated passive balancing up to 300 mA per channel• Temp range: -40 °C to 105 °C• 4.0 Mbit/s SPI or isolated 2.0 Mbit/s differential
communication with transformer• Operational low-power mode

• Averaging of cell voltage measurement
Lifetime guaranteed high accuracy• ± 0.8 mV cell voltage measurement error• ± 0.5% total stack voltage measurement• ± 0.5% integrated current sensor gain error

MC33771/2
7 Temperature
3~ 14 Cell VSense
3~ 14 Cell Balancing

Daisy Chain
Communication
up to 63 nodes

MC33771/2
7 Temperature
3~ 14 Cell VSense
3~ 14 Cell Balancing
Current Sense

MC33664
SPI1

SPI2

MCU

MC33771 Battery Cell Controller Solution Block Diagram

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18

BATTERY PRESSURE MONITORING SENSORSFXPS7250D4: Absolute Pressure Sensor• Absolute pressure range: 20 to 250 kPa• Capacitance to voltage converter with anti-aliasing filter• Automotive robustness• Sigma delta ADC plus sinc filter– Redundant pressure transducers enable embedded
self test• 800 Hz or 1000 Hz low-pass filter for absolute pressure• Small package suitable for PCB integration– Common-mode and digital self test for transducer
and signal chain verification– Lead-free, 16-pin QFN 4 x 4 x 1.98 mm
with wettable flank– Digital self test

– Pressure sensor protected by chemical-resistant gel– Operating temperature range: –40 °C to 130 °C– AEC-Q100 Grade 1 compliant• Analog version output available
Current solution FXPS7250x or FXPS165D• I2C compatible serial interface• Absolute pressure range:– Slave mode operation– 20 kPa to 250 kPa or 60 kPa to 165 kPa– Standard mode, fast mode, and fast-mode
plus support– Calibrated Pressure and Temperature measurements• 32-bit SPI compatible serial interface• I2C, SPI or Analog output interface• Secure and fast data communication• Automotive robustness– Redundant pressure transducers enableembedded self test

– 12-bit data for absolute pressure– 8-bit data for temperature– 2-bit basic status and 2-bit detailed status fields– 3, 4, or 8-bit configurable CRC– Common-mode and digital self test for transducer andsignal chain verification– Qualified to AEC-Q100 Grade 1– Operating temperature range: –40 °C to 130 °C– QFN 4 x 4 x 1.98 mm, 16 pins, 0.8 mm pitch

VCC

VSS

Oscillator
SS_B

MODESELECT_0

SCLK/SCL

MODESELECT_1

MOSI
MISO/SDA

VREF

INT

Gain

AAF

FXPS7250D4 Block Diagram

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19

BATTERY PRESSURE MONITORING SENSORS —FEATURES
NBP8/9FDxT1• Auto detects pressure change and sends alarm to host
MCU by any of the following events:• Absolute pressure range:– 40 kPa to 250 kPa operating range– Fixed pressure threshold breach– Calibrated pressure and temperature
measurements capability– Relative pressure threshold breach– Pressure rate-of-change breach (ΔP/Δt)• Internal sleep mode between measurements• Diagnostics• Host can enter sleep mode until needed– Last 12 pressure measurements saved in FIFO memory– Pressure transducer (sense and reference cell),internal connections• SPI interface, ready/interrupt, power supply enable• Automotive robustness– Qualified to AEC-Q100 Grade 1– Operating temperature range: –40 °C to 130 °C– QFN 4 x 4 x 1.98 mm, 24 pins, 0.5 mm pitch

BDM
CONTROLLER

S08
8b CPUINTERRUPTCONTROLLER
PADMUX

SPI

GPIO
IRQ
BKGD
SPI
TPM
ADC
ETC.

PTA0 - 4
PTB0 - 1

M0

BUS
ARB.
MUX

S0

NV RAM
64 x 8S1

SYS RAM512 x 8S2

FLASH
CONTROLLER

FLASH NVM
16 k x 8

M1
S3
PWR. MODE
CONTROLLER
RESET
CNTL. MOD.

KEYBD
INTERRUPTSYSTEM
INT. MOD.
INT. CLKS
SYS

2-ch. TPM

COP
TIMER

FREE

PWU/RTI
TIMER
SAR
ADC

Peripheral Bus
SMI

P-CELLSENSE
P-CELLREF.

GAIN, OFFSETAND COEFF.
C
TO V
MUX

Offset DAC
C TO VCONVERTER

GAIN, OFFSET
AMPS

BUFFERLPF

A TO D
MUX

Bandgap
Temp Sensor

Battery Pressure Monitoring Sensor Block Diagram

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20

MOTOR CONTROL: HIGH-VOLTAGE INVERTERS
GD3160 AND GD3162 GATE DRIVER IC WITH HV ISOLATIONThe GD3160 and GD3160 are programmable high-voltage gate drivers with advanced functional safety, control andprotection features developed for automotive and EV powertrain applications. The GD3160 gate driver offers wider
parametric range tailored to SiC MOSFETs as well as IGBTs and is footprint compatible with the GD3100 gate driver.
The GD3162 offers an adjustable dynamic gate strength drive via a programmable interface over SPI. In addition,
advanced programmable protection features are autonomously managed as faults and the status of the power device
and gate driver are reported via the interrupt pins.
FEATURES AND BENEFITS
GD3160

GD3162OPERATIONOPERATION• ±15 A split output gate current drive• Integrated boost capability for increased drive strength:• Programmable HV V CCregulator output:
14 V to 21 V, 1 V step
• Max VCC output voltage: 23 V
PROTECTION• Integrated HV temperature sensing (TSENSE) for
NTC thermistor or diode sensors with programmableoffset and gain

Up to 10 / 20 / 30 A source/sink current• Max VCC output voltage: 25 V
• Programmable ADC delay – Up to 8 μs sampling delay
from rising or falling edge of PWM
PROTECTION• Integrated HV temperature sensing (TSENSE) for NTC
thermistor or diode sensors with programmable offset
and gain• Faster VCE DeSat detection and reaction time:< 1.2 µs (SiC)• Fast VCE DeSat detection and reaction time: < 1 µs (SiC)• Improved PWM deadtime range for reduced switchinglosses (SiC)• Improved PWM deadtime range for reduced switchinglosses (SiC)• Programmable two-level turn off (2LTO) and softshutdown (SSD)• Programmable two-level turn off (2LTO) and softshutdown

FUNCTIONAL SAFETY• Provides either MCU controlled or safety logic controlled
gate drive to actively discharge the DC link capacitor• Additional programmable fault pin (INTA)• Integrated HV fault management (FSISO)

FUNCTIONAL SAFETY• Programmable VCE output monitoring• Additional programmable fault pin (INTA)

INSULATION/ISOLATION• Minimum common mode transient immunity(CMTI) > 100 V/ns
• 5,000 Vrms galvanic isolation per UL1577• Integrated HV fault management (FSISO)• Programmable VCE output monitoring
INSULATION/ISOLATION• Minimum common mode transient immunity (CMTI)> 100 V/ns
• 5,000 Vrms galvanic isolation per UL1577 (planned)

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21

VEHICLE NETWORK PROTOCOLSAs vehicles become more connected, the need for reliable and secure communication within the car is clear. New
isolated CAN for electric vehicles, hybrids and 48 V networks use unique wake-up functions to maximize efficiency andbridge voltage domains. In a distributed car network, central ECUs need to exchange data or configuration with eachother within a critical time frame. Automotive Ethernet can be used to build a time-sensitive network (TSN) that connects
microcontrollers directly in an Ethernet backbone.

FRDMGD3162HBIEVM
Power Gate Drive Board

Backup DC/DC

IGBT
Phase U

VBAT

To HV
Disconnect
FSSTATE

IGN

CAN

SystemBasis
Chip
FS6500PWM_ALT

Link
Capacitor

Gate
Driver
GD3162FSSTATEPWM_ALT

Fail Safe
Circuitry

FCCU1

Gate
Driver
GD3162MCU
MPC5777CCAN

CANInterface

IGBT
Phase V

Gate
Driver
GD3162IGBT
Phase W
150mA

SoftwareResolver toDigital Converter

Gate
Driver
GD3162

GD3162 Advanced High Voltage Isolated Gate Driver Block Diagram

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22

VEHICLE NETWORK PROTOCOLSAs vehicles become more connected, the need for reliable and secure communication within the car is clear. New
isolated CAN for electric vehicles, hybrids and 48 V networks use unique wake-up functions to maximize efficiency andbridge voltage domains. In a distributed car network, central ECUs need to exchange data or configuration with eachother within a critical time frame. Automotive Ethernet can be used to build a time-sensitive network (TSN) that connects
microcontrollers directly in an Ethernet backbone.

VBAT

Safety SBC

CAN
Networks

CAN Interface/
CAN FDCAN
Networks

Secured CAN/
IDPS/
Update Manager

FlexRay
Network

Flex
Interface

MCU

Ethernet
PHY

Ethernet
Network(s)Ethernet
SwitchWatchdog
MCU

NXP Technology

In-Vehicle Networking for HEV and EV Architectures

For further information on the complete in-vehicle networking portfolio, please
visit www.nxp.com/ivn.

nxp.com/electrification

23

VEHICLE NETWORK PROTOCOLS (cont.)
At NXP, we’re leveraging our commitment to quality and security, our broad product portfolio and our application
leadership in automotive power control to provide system solutions that deliver the optimal performance, functional safety
and power management required for the next generation of electric and hybrid vehicles. When you explore NXP, you’ll
find that we’re more than the products we create—we’re a dedicated partner committed to automakers and developers intheir quest to accelerate EV system development and meet the ever-growing demand for vehicle electrification.

In-Vehicle Networking for HEV and EV Architectures

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EV CHARGING SYSTEM SOLUTIONSElectric vehicle sourcing equipment (EVSE), also called the charging system, supplies power for recharging electricvehicles of many types.
EV chargers are made up of at least one smart controller function and a power socket function — either combinedor as standalone boards.
Isolation
Power
SocketBoard

Smart
Controller
Board

Electric Vehicle Supply Equipment (EVSE) Power Socket and Smart Controller Overview

In order to support the developing world of EV types, we need a flexible and scalable approach not only in the choiceof AC or DC, but also in the following key areas:

Accurate power delivery
measurement• Legislation mandating higher
accuracy levels for fair payment• Government fuel tax recovery• Power grid load balancing andmains quality analysis

Mass deployment readiness• Integrated and cost optimized
Artificial intelligence (AI) andmachine learning (ML)
• Consumption profiling• Product longevity greater than
10 or 15 years• Operating life ranging 10 to 20
years• Ruggedized for harsh environments• Anomaly detection

Increasing security and safety
at the edge
• Supporting main EV security
standards, e.g., OCPP2.x, ISO
15118 and PKI• GDPR, Calibration Law “Eichrecht”
and confidentiality• Safety standards, e.g., IEC60730
Class B, IEC61508 SIL2
Cloud onboarding• Simplify the provisioning andownership process, while
maintaining high security andconfidence about connection to anauthentic device using zero-touch
onboarding

nxp.com/electrification

Availability and reliability

24

KEY BUILDING BLOCKS

Security

Metrology• Accurately measure energy flow between charger
and vehicle• Authenticate and protect energy usage and billing data
end to end with cryptographic keys
• Securely and seamlessly onboard EV chargers to backend servers and cloud services for remote management• Calculate energy billing consumption• Manage the safety switching and low-levelcommunications to EV• Configure, update and attest the software and firmware• External Communication• Monitor temperature– Highly accurate temperature sensor enables safety
and anomaly detection• NFC bridge– Acts as an AC-isolated communication channel
to metrology MCU• Support a flexible mix of communication capability
depending on location, region EVSE type
• Support region-specific communications solutions,
including Wi-Fi®, PLC, NBIoT Sigfox and many more

– Also used during manufacture, commissioning
and updates
Controller Board• Manage the main functions and services of the EVSE
including any high-level communications and protocol
stacks, e.g., ISO 15118, OCPP and connection tobackend• Options include bare metal and RTOS; for solutions
running Linux® OS, may add greater value to on-screen
advertising

N In

L In

Temperature
Current andEnergy Measurement
NFC Reader/SignalController
SAE J1772
Connector

AC Residential Charging Station (Level 1,2 or 3) Block Diagram

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25

SOLUTIONS

N In

15 W PSUTEA1723

L In

Re ay

Dual TAP
Transformer

DC/DC

NXP KM34
Relay
Voltage
Divider

Metrology + RCD(Type A/B)

Tamper
PGA + SD0

3.3 V Metrology
3.3 V Digital Processing±12 V Pilot Signal

RTC

V SenseCM0+128 KB

SR

I SenseI 2C

PCT2075DP

I 2C±1 ºC from -25 ºC to +100 ºC

PGA + SD1

NTAG I2C

Pilot
SignalIF

NFC Bridge

Service Processing
Opto

DLMS/COSEM, OCPP,
ISO15118, Payment, V2X

MachineLearning

SAE J1772
Type 2Connector

Host
MIMXRT1064DVJ6

Security
SE051C2(1280 x 800)

QSPI
Flash

Certified IEC60730
Class B libraries

MIFARE®
DESFire®

Single Phase ≤ 7 kW

DC/DC

TEA1723NXP KM34
REF(Type A/B)

1.2 V VREF

V1 Sense
IN Sense

PGA+SD

Phase Shifter& Decimator
Phase Shifter& DecimatorSD

Phase Shifter& DecimatorSD

Phase Shifter& Decimator

PGA+SDNTAG I2C

SignalService Processing

SAE J1772

Host
MIMXRT1064DVJ6Connector

Certified IEC60730

Three Phase ≤ 22 kW

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26

DC EVSE SOLUTION

PFC
L1

DC
Primary Side

Sync Rec
High-Voltage
Secondary
400 V to 800 V DC

L2
Gate DriverNISO21561

L3

Gate DriverNISO21561
Gate DriverNISO21561

Metrology
KM34x

DC
Low-Voltage
Primary SideMCU
MC56F83x
CEVT

MCU
MC56F83x

Sync Rec
Low-Voltage
Secondary
12 V DC
Gate DriverNISO21561
MCU
MC56F83x

Gate DriverNISO21561

CCS
Plug

NFC
PN5180N FC

Host Controller i.MX 8M Nano

Trust Anchor

Communications
PLC

NBIoT

WAN
OL2385

Wi-Fi®

HAN
JN5160SE051C2ML
A53 Linux®

M7 RTOSMIFARE®
DESFire®

Fast Charge

PFC
L1

Sync Rec
High-Voltage
SecondaryDC
Primary Side

L2

400 V to 800 V DC
Gate DriverNISO21561

Gate DriverNISO21561

L3

Metrology
KM34x

MCU
MC56F83x

MCU
MC56F83x
CEVT

Gate DriverNISO21561

DC
Low-Voltage
Primary Side

Sync Rec
Low-Voltage
Secondary
12 V DC
Gate DriverNISO21561
MCU
MC56F83x

Gate DriverNISO21561

Storage BMS
BMU
Safety MCU: S32K
Safety PMIC: MC33FS45x
Contactor: MC22XS4200CEKLine Driver: MC3366
CSC
AFE: MC33771
Sensor: FXPS7250x

Communications
PLC
NFC
PN5180N FC

Trust Anchor

NBIoT

WAN
OL2385

Wi-Fi®

HAN
JN5160SE051C2

Gate DriverNISO21561
CCS
Plug
Battery

Host Controller i.MX 8M NanoML
A53 Linux®

M7 RTOSMIFARE®
DESFire®

Ultra Fa t Charge
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27

NXP PRODUCT SUMMARY
DEVICEDESCRIPTIONS32Z & S32E

The S32Z and S32E real-time processors feature Arm® Cortex®-R52 split-lock processors for multi-tenant software integration
plus lockstep Arm Cortex-M33 processors for system management. The S32E processors are ideal for electric vehicle (xEV) control
and smart actuation.

MPC5744P
MPC5777C
MPC5775B/E

These microcontrollers target automotive and industrial battery management and inverter applications that require advanced
performance, security and ASIL D support.

S32K1

S32K is a scalable family of AEC-Q100 qualified 32-bit Arm Cortex®-M4F and Cortex-M0+ based MCUs targeted for general-purpose
automotive and high-reliability industrial applications.

S32K3

S32K3 is a scalable family of AEC-Q100 qualified 32-bit Arm Cortex®-M7F based MCUs targeted for ASIL D functional safetyautomotive and industrial applications.

FS45/FS65

The FS45 and FS65 are system basis chips (SBCs) that provide power to MCUs and optimize energy consumption through DC-DC
switching regulators, linear regulators and ultra-low-power saving modes.

FS66

The FS66 is an automotive, functionally safe multi-output power supply integrated circuit. It includes a multiple switch mode, linear
voltage regulators and enhanced safety features with fail-safe outputs.

MC33771/2

The MC33771/2 are battery cell controllers designed to address safety risks related to Li-ion batteries by accurately controlling critical
Li-ion cell characteristics (voltages, temperatures, current) and by providing embedded balancing functions along with extensive
system diagnostics.

FXPS7250D4

The FXPS7250D4 is high-performance, high-precision absolute pressure sensor for Battery Pressure Monitoring.

GD3100

The GD3100 is an advanced single-channel gate driver for IGBTs. Integrated Galvanic isolation and low on-resistance drive transistors
provide high charging and discharging current, low dynamic saturation voltage and rail-to-rail gate voltage control.

GD3160

The GD3160 is an advanced single-channel high-voltage isolated gate driver with enhanced features for driving and protecting siliconcarbide (SiC) MOSFETs or IGBTs and functional safety.

GD3162The GD3162 is an advanced, galvanically-isolated, single-channel gate driver designed to drive the latest SiC and IGBT modules
for xEV traction inverters.

IVN

IVN is a broad NXP portfolio of in-vehicle networking solutions for LIN, CAN, FlexRay™ and Ethernet.

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SAFEASSURE® FUNCTIONAL SAFETY PROGRAM
NXP’s SafeAssure program does more than align our development process to
ISO 26262 across our business lines. It affirms our corporate commitment tosupporting functional safety through safety-conscious culture, discipline andcollaboration.
THE SAFEASSURE PROGRAM:• Simplifies the process of system compliance, with solutions designed toaddress the requirements of automotive and industrial functional safety
standards• Reduces the time and complexity required to develop safety systems thatcomply with ISO 26262 and IEC 61508 standards• Supports the most stringent safety integrity levels (SILs), enabling designers
to build with confidence• Adheres to a zero-defect methodology from design to manufacturingand helps ensure that our products meet the stringent demands of safety
applications

PRODUCTSTARGET APPLICATION

ASIL

MC337711/2

HEV, EV, ESS, UPS systems

D

FS45

Automotive: vision systems, electrical power steering, engine and battery management; Industrial: drone and robot
automation, building control, transportation, mobile computing, power and energy; healthcare

D

FS65

Automotive: active suspension, gearbox, transmission, EV, HEV, inverter, ADAS, EPS, engine and battery management; mobile
computing; building control; drones and robots; automation; medical

D

FS66

BMS, electrical traction, high-voltage DC-DC converter, HEV, internal combustion engine

D

MPC5744P

Safety Domain Control

D

MPC577C
MPC5775E/

BMS, Traction Motor Control, Direct Injection Engines, Common Rail Diesel Injection Systems, Electronically Controlled
Transmissions, Diesel Engine Management, Gasoline Engine Management

D

S32K3

Body Control, Zone Control, BMS, Infotainment IO controller, E-shifter, Motor Control

D

GD3100

BMS, HEV, EV Power Inverter, Motor Drives

D

GD3160

BMS, HEV, EV Power Inverter, Motor Drives

D

GD3162

EV Power Inverter, HEV, Motor Drives

D

Safety of the Intended Function

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SECURITY PROGRAM
A holistic approach to cyber security – aligned with industry standards and best practices

Secure product engineering process (SMP)
Internal/External security evaluation (VA)

Broad portfolio ofsecurity solutions

3rd part certifications(CC, EMVCo, PSA, SESIP)

Security-awareorgantization

Product Security Incident
Response (PSIRT)
Security School

20+ years inthe security
industry

SOLUTIONS AND TECHNOLOGY

Differentiating Security
Innovations

PROCESSES AND POLICIESInformation security policies
Site security (ISO 27001)

Best-in-class Security
IP and Subsystems

PEOPLE

Working with researchers,
industry partners, Auto-ISAC,
Charter of Trust, CERTS

Security Operations Center (SOC)
Computer Security incident Response (CSIRT)

With the complexity of vehicles on the roads today – it is essential that drivers and passengers are able to trust their cars.
NXP leads the industry with the most complete portfolio of automotive semiconductor security solutions, complemented
by a comprehensive, holistic, automotive cybersecurity program.
Cybersecurity needs a holistic approach: not only with solutions, but also with processes, policies and the appropriate
security-oriented organization.
NXP’s security program has matured over time and contains a broad portfolio of automotive security solutions that are
par to market requirements.
www.nxp.com/automotivesecurity

AVAILABLE RESOURCES
For more information, please visit
nxp.com/electrificationwww.nxp.com
NXP, the NXP logo and SafeAssure are trademarks of NXP B.V. All other product or service names are the property of their respective owners.
Arm, Cortex and Neon are trademarks or registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere. The related
technology may be protected by any or all patents, copyrights, designs and trade secrets. All rights reserved. © 2023 NXP B.V.

Document number: VEHELECTSOLBRA4 REV 7