PlasmaPro ® 80 Range
Next Generation Plasma Systems
Compact open-loading tool for plasma etch and deposition

PlasmaPro 80 range
Multiple process technologies

PlasmaPro 80 offers versatile plasma etch anddeposition solutions on one platform withconvenient open loading. This compact, smallfootprint system is easy to site and easy to use,with no compromise on process quality.

RIE of InP waveguide

The PlasmaPro 80 is ideally suited to R&D or small-scale production, and canprocess from the smallest wafer pieces to 200mm wafers. The open load design
allows fast wafer loading and unloading, ideal for research, prototyping and lowvolume production.
7 µm polyimide feature RIE

Wide range of applications• III-V etch processes• Silicon Bosch and cryo-etch processes• Diamond Like Carbon (DLC) deposition• SiO and quartz etch
• Failure analysis dry etch de-processing using the specially-configured
2

PlasmaPro FA tools, with RIE, dual-mode RIE/PE and ICP processes
ranging from packaged chip and die etch through to full 200mm waferetch• High quality PECVD of silicon nitride and silicon dioxide forphotonics, dielectric layers, passivation and many other uses

• Hard mask deposition and etch for high brightness LED production

Deep Si feature etch by ICP-RIE
cryo process

PlasmaPro NGP80

Failure analysis - fast metal layer
exposure in the PlasmaPro FA
ICP

Sub µm Si mesa etch

PlasmaPro 80
Process technology configuration options

PlasmaPro 80 RIE

PlasmaPro 80 PECVD

Proven dry etch technology used

Designed to produce high quality

successfully throughout the industry

uniform dielectric films. Stress control is

on a wide range of applications.

provided by selectable or mixed high/PlasmaPro 80 ICPHigh density plasma for high rateetching. Independent control of ion

low frequency plasma power, enabling
deposited films to be tuned for tensile,compressive or low stress.

energy allows low damage, highly

PlasmaPro 80 RIE/PE

selective processing to be achieved.

Combines anisotropy of RIE withselectivity of PE mode etching

The 240mm electrodeaccommodates wafers up to200mm in size for all system
configurations

in a single system.

The electrostatic shield design in the PlasmaPro 80 ICP configuration avoids
energetic ion bombardment and capacitive coupling, providing low
substrate damage, with long life for the ICP tube and reduced maintenance.
Optimised showerhead design delivers high performance PECVD
processes with excellent deposition uniformity.

PlasmaPro 80

Benefits of PlasmaPro 80 range

The PlasmaPro 80 is the tool of choice for open load, plasmaetch and deposition, with high performance processes using optimisedelectrode cooling, excellent substrate temperature control, andadvanced Auto Matching Unit (AMU) allowing easy set up.

High performance processes
PlasmaPro 80 optimised electrode cooling results in excellent process control, wafer
temperature uniformity and great flexibility, covering a wide range of processes.

• Enhanced process uniformity and rates are guaranteed by using ahigh-conductance radial (axially symmetric) pumping configuration• The addition of 50ms datalogging of the capacitor values offers traceability andhistory of chamber and process conditions• A close-coupled turbo pump provides high pumping speed and excellent base pressure
Easy open access
The pneumatic hoist mechanism is designed to allow clear access to the lower electrodeand smooth chamber opening with minimal particle generation.

PlasmaPro 80Highperformance
process control
with etch end
pointing
Substrate temperature control
Substrate temperature control is provided by a range of fluid-cooled and/or
electrically-heated electrodes, 240mm in diameter, with a temperature range up to400°C. This results in excellent electrode temperature control and stability.
Options are available for helium-assisted substrate backside cooling, for optimum
wafer temperature control during processes. Cooling can be further extended down
to -150°C with the cryogenic electrode option, enabling Si cryo-etch processes.

Advanced Auto Matching Unit
The PlasmaPro 80 advanced AMU allows easy set up, fast matching over a widerange, and excellent RF transfer. This results in effective process repeatability & fast
response time. AMU control is managed through the front end software.

Plasma Accelerator for
Advanced Die Processing
Innovative processes developed for fastde-processing of packaged devices using
focussed plasma.

Delivers up to 20 times
faster etching rates
Four metal layers of a packaged device canbe exposed in less than five minutes using
both ICP and RIE processes. The standard
process would take more than 60 minutes

The plasma is concentrated above thepackaged device to be etched

PlasmaPro 80

System control and diagnostics

Process Control – Etch
end point detection

Reliability and diagnostics

Excellent etch control and rate determinationachieved through the front end software.

can be provided by optional end-point detection,

The system provides information about the

integrated with PC4000TM process tool software.

status of key components, leading to rapid• Laser end-point detection using

and detailed fault identification.

interferometry to measure etch depth inFault and tool status diagnostics is• Easy access to the main components

transparent materials on reflective surfaces

for maintenance through quickly(for example, oxides on Si), or reflectometry

removable panels

for non-transparent materials (such asmetals) to determine layer boundaries• Optical emission spectrometry (OES) forlarge sample or batch process end-pointing
by detecting changes in etch by-products
or depletion of reactive gas species, and forchamber clean end-pointing

Gas Control System
A modular upgrade path for gas lines enables users tomaximise the flexibility of the PlasmaPro 80 system. The
remote gas line by-pass facility allows broad functionality &ease of use.

• The gas pod offers maximum process flexibility. The design
enables the easy addition of further gas lines, up to 12• The gas pod may be sited remotely in a service area, and isvented and ready for ducting into an extraction system forfull safety compliance• Optional purge facility
PlasmaPro 80• Extended ‘uptime’ via rapid component
change and ease of chamber cleaning

Software control and system support

Process tool software

Cost of ownership and customer support

PlasmaPro 80 includes a new and improved user interface

We work with our customers to create the right system,

based on tried and tested software. Oxford Instruments

process, and support package to meet your specificsoftware is renowned for its clarity and ease of use, making it

requirements, so our range of Service Level Agreements (SLA)

quick to train process operators while retaining full

will be tailored to your needs. This can include:

functionality for fab managers and service staff.

• Guaranteed response times for support engineer visits and• The front end visual interface, which controls and monitors theprocess tool, is configured exactly for the customer’s system• Process recipes are written, stored and recalled through thesame software, building a library• Password controlled user login allows different levels of user
access and tasks, from ‘one-button’ run operation to fullsystem functions• Continuous system data logging (50ms) ensures effective
traceability of each wafer and process run• Fully GEM/SECS compatible

technical hotline calls• Choice of support coverage up to 24/7
• Scheduled preventative maintenance calls• Managed spares inventory options, including customer
dedicated stock, via our parts locations worldwide• Preferential spare part pricing• Process training• Certified maintenance training courses for customer’s
own engineers in preventative maintenanceand first level troubleshooting

Superior
environmental
efficiency
PlasmaPro 80 has
a low heat load and highenergy efficiency. The tool’s
efficient ergonomics andcompliance to Semi S2 makethis a tool of choice for bothresearch and small-scale
production users.

PlasmaPro 80

Technical specifications
Overall dimensions of the PlasmaPro 80

Oxford Instruments
Plasma Technology
For more information please email:plasma@oxinst.com
UKYattonTel: +44 (0) 1934 837000
Germany
Wiesbaden
Tel: +49 (0) 6122 937 161
JapanWheels are removable and for transportation purposes only.

Dimensions in mm.

Worldwide Service and Support

Tokyo
Tel: +81 3 5245 3261
PR China
Beijing

Oxford Instruments is committed to supporting our customers’ success. We recognise that

Tel: +86 10 6518 8160/1/2

this requires world class products complemented by world class support. Our global service

Shanghaiforce is backed by regional offices, offering rapid support wherever you are in the world.

Tel: +86 21 6132 9688We can provide:Singapore•• Comprehensive range of structured training courses• Immediate access to genuine spare parts and accessories• System upgrades and refurbishments
Tailored service agreements to meet your needs

visit www.oxford-instruments.com for more information
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relating to the products or services concerned. Oxford Instruments’ policy is one of continued improvement. The company reserves theright to alter, without notice the specification, design or conditions of supply of any product or service. Oxford Instruments
acknowledges all trademarks and registrations. © Oxford Instruments plc, 2015. All rights reserved. Ref:OIPT/NGP80/2010/01

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