Raise3D Hyper Speed ABS V2_TDS

Sep. 2023 Version 1.0

Raise3D Hyper Speed ABS V2 Technical Data Sheet
Hyper Speed ABS V2 filament is specifically designed to be used with the Hyper FFF™ solution fromthe Hyper Speed filament line. When printing at high speeds, the regular ABS filament is rapidly
fed into the heat block, and the polymer has very little time to go from a solid to a molten state,
which can cause nozzle clogging and poor bonding quality between layers. Additionally, the regular
ABS filament can be subject to warpage and delamination of the printed part during high-speed
printing without a heated chamber.
With optimized molecular weight and stiffness, Hyper Speed ABS V2 filament is capable of printing
at the speed of up to 300 mm/s thanks to its faster melting and homogenous cooling, which results
in a lower temperature gradient and lower inner stress of printed part. Hyper Speed ABS V2
filament exhibits superior heat resistance compared to Hyper Speed ABS filament. With almost nowarpage and improved interlayer bonding, Hyper Speed ABS V2 filament is also perfectly suitablefor many functional prototyping parts, tools and fittings with many different possibilities for postprocessing and finishing methods (e.g., polishing and acetone vapor smoothing).

General Properties

Property

Testing Method

Typical Value

Density (g/cm³)

ASTM D792

1.04

Water absorption (%)

ISO 62: Method 1

0.27

Diameter (mm)/1.75

Net weight (kg)/1.0Color/

Black, Grey

Odor

/

Almost odorless

Solubility/

Insoluble in water

Mechanical Properties

Typical Value

Typical Value

ISO 527, GB/T 1040

2040 ± 58

2051 ± 82

Tensile strength (MPa)ISO 527, GB/T 1040

26 ± 223 ± 3Elongation at break (%)

ISO 527, GB/T 1040

7.63 ± 3.3

1.38 ± 0.03

Bending modulus (MPa)ISO 178, GB/T 9341

2072 ± 35/

Bending strength (MPa)ISO 178, GB/T 9341

44 ± 2/

Property

Testing Method

Young’s modulus (MPa)(XY, Flat)

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(ZX, Upright)

Raise3D Hyper Speed ABS V2_TDS
Izod impact strength (kJ/m²)

Sep. 2023 Version 1.0

ISO 180, GB/T 1843

16.1 ± 0.9/Note:
All testing specimens were printed under the following conditions:Nozzle diameter = 0.4 mm, nozzle temperature = 250°C, printing speed = 300 mm/s, build plate temperature = 90°C,
infill = 100%
All specimens were conditioned at room temperature for 24 h prior to testing.

Thermal Properties

Property

Testing Method

Typical Value

Melt flow index (g/10 min)

220°C, 5 kg

21Heat distortion temperature (°C)

ISO 75@0.45 MPa

77

ISO 75@1.8 MPa

72

Other Information

ColorColor CodeBlackRAL 7021

GreyRAL 7045

Testing Geometries

Fig 1. Tensile testing specimen

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Raise3D Hyper Speed ABS V2_TDS

Sep. 2023 Version 1.0

Fig 2. Flexural testing specimen

Fig 3. Impact testing specimen

ZX

YXY, Flat

ZX, UprightFig 4. Print Orientation

Fused filament fabrication (FFF)/fused deposition modeling is a layer-by-layer process allows thermoplastic
to be printed in various orientations relative to the print direction. Due to anisotropy, the performance hasa gap between the different orientation.
Note: All samples are printed with 100% infill; the lines in the Fig 4. indicate typical directionality of infill andwalls in a printed part.

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Raise3D Hyper Speed ABS V2_TDS

Sep. 2023 Version 1.0

Disclaimer

The typical values presented in this data sheet are intended for reference and comparison
purposes only. They should not be used for design specifications or quality control purposes. Actualvalues may vary significantly with printing conditions. Enduse performance of printed parts
depends not only on materials, but also on part design, environmental conditions, printingconditions, etc. Product specifications are subject to change without notice.
Each user is responsible for determining the safety, lawfulness, technical suitability, and disposal/recycling practices of Raise3D materials for the intended application. Raise3D makes no warrantyof any kind, unless announced separately, to the fitness for any particular use or application.
Raise3D shall not be made liable for any damage, injury or loss induced from the use of Raise3D
materials in any particular application.

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