Intel® RealSenseTM
Product Family D400 Series
DatasheetIntel® RealSense™ Vision Processor D4, Intel® RealSense™ Vision
Processor D4 Board, Intel® RealSense™ Vision Processor D4 Board V3,Intel® RealSense™ Depth Module D410, Intel® RealSense™ Depth Module
D415, Intel® RealSense™ Depth Camera D415, Intel® RealSense™ Depth
Module D430, Intel® RealSense™ Depth Module D450, Intel® RealSense™
Depth Module D401, Intel® RealSense™ Depth Camera D435, Intel®
RealSense™ Depth Camera D435i, Intel® RealSense™ Depth Camera D455,
Intel® RealSense™ Depth Camera D405, Intel® RealSense™ Depth Camera
D435f

Revision 013
April 2022

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Document Number: 337029-013

Contents
1

Description and Features .................................................................................. 13

2

Introduction .................................................................................................... 15
2.1
2.2
2.3
2.4
2.5
2.6

3

Component Specification .................................................................................. 21
3.1
3.2
3.3

3.4
3.5
3.6

3.7

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Purpose and Scope of this Document ....................................................... 15
Terminology ......................................................................................... 15
Stereo Vision Depth Technology Overview ................................................ 16
Camera System Block Diagram ............................................................... 18
Intel® RealSense™ Depth Module D400 series Product SKUs ..................... 19Intel® RealSense™ Depth Camera D400 series Product SKUs .................... 20
Vision Processor D4 Camera System Components ..................................... 21
Host Processor ..................................................................................... 21
Intel® RealSense™ Vision Processor D4 .................................................. 21
3.3.1
Vision Processor D4 Features .................................................... 22
3.3.2
Vision Processor D4 Signal Description ....................................... 22
3.3.3
Vision Processor D4 Package Mechanical Attributes ...................... 28
3.3.4
Vision Processor D4 Power Requirements.................................... 33
3.3.5
Vision Processor D4 Power Sequencing ....................................... 33
3.3.6
Vision Processor D4 Spec Code .................................................. 34
3.3.7
Vision Processor D4 Storage and Operating Conditions ................. 34
3.3.8
Vision Processor D4 Thermals ................................................... 35
Clock ................................................................................................... 35
Serial (SPI) Flash Memory ...................................................................... 35
Stereo Depth Module ............................................................................. 35
3.6.1
Left and Right Imagers ............................................................. 38
3.6.2
Infrared Projector .................................................................... 40
3.6.3
Color Sensor ........................................................................... 41
3.6.4
Depth Module Connector .......................................................... 43
3.6.5
Stereo Depth Module Label ....................................................... 43
3.6.6
Stiffener ................................................................................. 44
3.6.7
Temperature Sensor ................................................................ 44
3.6.8
Other Stereo Depth Module Components .................................... 44
Mechanical Dimensions............................................................. 45
3.6.9
45
3.6.10 Stereo Depth Module Power Sequence........................................ 46
3.6.11 Stereo Depth Module Storage and Powered Conditions ................. 46
Intel® RealSense™ Vision Processor D4 Board ......................................... 47
3.7.1
Mechanical Dimensions............................................................. 48
3.7.2
Depth Module Receptacle .......................................................... 49
3.7.3
Flex and Rigid Interposer Interconnect ....................................... 49
3.7.4
External Sensor Sync Connector ................................................ 58
3.7.5
USB Peripheral Connector – Type-C – D415, D435, D435i, D435f,
D455 ..................................................................................... 58
3.7.6
USB Peripheral Connector – Micro-B (D405) ................................ 60
3.7.7
Color Image Signal Processor (ISP) ............................................ 61
3.7.8
Vision Processor D4 Board Power Requirements .......................... 61
3.7.9
Vision Processor D4 Board Thermals .......................................... 61
3.7.10 Vision Processor D4 Board Storage and Powered Conditions .......... 622

3.7.11

3.8

4

Functional Specification .................................................................................... 70
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
4.10
4.11

5

5.2

Intel® RealSense™ Software Development Kit 2.0 .................................... 93

System Integration .......................................................................................... 94
7.1
7.2

7.3
7.4
7.5
7.6

7.7
7.8
7.9
7.10

7.11
7.12
7.13

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Update ................................................................................................ 92
5.1.1
Update Limits .......................................................................... 92
Recovery ............................................................................................. 92

Software......................................................................................................... 93
6.1

7

Vendor Identification (VID) and Device Identification (DID) ........................ 70
Vision Processor D4 Data Streams .......................................................... 70
Depth Field of View (FOV) ...................................................................... 77
Depth Field of View at Distance (Z) ......................................................... 78
Invalid Depth Band ............................................................................... 79
Minimum-Z Depth ................................................................................. 80
Depth Quality Specification .................................................................... 80
Depth Start Point (Ground Zero Reference) .............................................. 82
4.8.1
Depth Origin X-Y Coordinates .................................................... 85
Depth Camera Functions ........................................................................ 88
Color Camera Functions ......................................................................... 89
IMU Specifications................................................................................. 90
90

Firmware ........................................................................................................ 92
5.1

6Intel® RealSense™ Vision Processor D4 Board Product Identifier andMaterial Code .......................................................................... 62
Intel® RealSense™ Depth Camera D400 Series ........................................ 63
3.8.1
Depth Camera D400 Series Mechanical Dimensions ..................... 66
3.8.2
Depth Camera D400 Series Thermals ......................................... 67
3.8.3
Depth Camera D400 Series Product Identifier and Material Code ... 68
3.8.4
Camera Lens Cleaning Procedure ............................................... 69

System Level Block Diagram .................................................................. 94
System Level Block Diagram .................................................................. 95
7.2.1
Vision Processor D4 Board ........................................................ 95
7.2.2
Vision Processor D4 on Motherboard .......................................... 96
D4 Camera System Power Delivery ......................................................... 97
Thermals ............................................................................................. 98
Stereo Depth Module Flex ..................................................................... 102
Stereo Depth Module Mounting Guidance ................................................ 103
7.6.1
Screw Mounting/End Mounting ................................................. 103
7.6.2
Bracket Mounting/Mid-Module Mounting .................................... 104
7.6.3
Stereo Depth Module Air gap.................................................... 106
Thermal Interface Material .................................................................... 107
Heat Sink ............................................................................................ 107
Cover Design and Material Guidance ...................................................... 107
Gaskets .............................................................................................. 108
7.10.1 Optical Isolation ..................................................................... 110
7.10.2 Dust Protection ...................................................................... 110
Firmware Recovery .............................................................................. 110
Calibration Support .............................................................................. 111
Multi-Camera Hardware Sync ................................................................ 111

3

7.14
8

Platform Design Guidelines .............................................................................. 113
8.1
8.2

8.3

9

Handling Conditions ............................................................................. 112
Vision Processor D4 on Motherboard ...................................................... 113
Kaby Lake U and Kaby Lake Y platforms ................................................. 114
8.2.1
Kaby Lake Platform Introduction ............................................... 114
8.2.2
Supported PCB Stack-Up and Routing Geometries ...................... 114
8.2.3
Vision Processor D4 on Motherboard with USB Host Interface ....... 115
8.2.4
Vision Processor D4 on Motherboard with MIPI Host Interface ...... 116
8.2.5
Vision Processor D4 Board for Integrated Peripheral (USB 3.1 Gen 1
Host to Vision Processor D4 Routing) ........................................ 118
8.2.6
USB2.0 Design Guidelines (USB2 Host to Vision Processor D4
Routing) ................................................................................ 119
Cherry Trail T4 Platform........................................................................ 120
8.3.1
Cherry Trail T4 Platform Introduction ........................................ 120
8.3.2
Vision Processor D4 Platform Design Guidelines .......................... 120

Regulatory Compliance .................................................................................... 122
9.1

9.2

9.3

System Laser Compliance ..................................................................... 122
9.1.1
Certification Statement............................................................ 122
9.1.2
Explanatory Label ................................................................... 122
9.1.3
Cautionary Statements ............................................................ 122
9.1.4
US FDA Accession Number ....................................................... 123
Regulatory Compliance ......................................................................... 123
9.2.1
Manufacturer’s Information ...................................................... 123
9.2.2
EU Single Place of Contact ....................................................... 123
9.2.3
UK Single Place of Contact ....................................................... 124
9.2.4
NRTL Statement ..................................................................... 124
9.2.5
FCC Part 15 Declaration of Conformity ...................................... 124
9.2.6
Canada ................................................................................. 125
9.2.7
European Directives ................................................................ 125
9.2.8
UK ........................................................................................ 126
9.2.9
Australia ................................................................................ 126
9.2.10 Japan .................................................................................... 126
9.2.11 South Korea........................................................................... 126
9.2.12 Customs Union ....................................................................... 127
Ecology Compliance ............................................................................. 127
9.3.1
China RoHS Declaration ........................................................... 127
9.3.2
Waste Electrical and Electronic Equipment (WEEE) ...................... 128
9.3.3
Turkey .................................................................................. 128

10

Mechanical Drawings ....................................................................................... 129

11

Connector Drawings ........................................................................................ 141

12

Appendix A – Vision Processor D4 on Motherboard Schematic Checklist ................. 143
12.1

13

Power Delivery .................................................................................... 150

Appendix B – Cover Material ............................................................................ 153

FiguresFigure 2-1. Active Infrared (IR) Stereo Vision Technology ......................................................... 17337029-013

4

Figure 2-2. Depth Measurement (Z) versus Range (R).............................................................. 17
Figure 2-3. Vision Processor D4 Camera System Block Diagram ................................................ 18
Figure 3-1. Vision Processor D4 Package Drawing .................................................................... 29
Figure 3-2. Vision Processor D4 Ball-out ................................................................................. 30
Figure 3-3. Vision Processor D4 Power Sequencing .................................................................. 34
Figure 3-4. Stereo Depth Module (Intel® RealSense™ Depth Module D410)................................. 36
Figure 3-5. Stereo Depth Module (Intel® RealSense™ Depth Module D430)................................. 36
Figure 3-6. Stereo Depth Module (Intel® RealSense™ Depth Module D450)................................. 36
Figure 3-7. Stereo Depth Module (Intel® RealSense™ Depth Module D401) ................................ 37
Figure 3-8. Stereo Depth Module Power Sequence ................................................................... 46
Figure 3-9. Vision Processor D4 Board (V1 and V3) (USB Peripheral Type-C)............................... 48
Figure 3-10. Vision Processor D4 Board (V4) (USB3 Peripheral Micro-B) ..................................... 48
Figure 3-11. Flex Interposer – D415, D435, D435i, D435f, D455 (Illustration) ............................ 50
Figure 3-12. Rigid Interposer – D415, D435, D435i, D435f, D455 (Illustration) ........................... 50
Figure 3-13. Depth Module Receptacle and Plug Connector Pin Position – D415, D435, D435i, D435f,
D455.............................................................................................................. 51
Figure 3-14. Depth Module Connector Orientation and Pin Position – D415, D435, D435i, D435f,
D455.............................................................................................................. 53
Figure 3-15. Flex Interposer – D401 (Illustration) .................................................................... 54
Figure 3-16. Depth Module Receptacle and Plug Connector Pin Position – D401 ........................... 54
Figure 3-17. Depth Module Connector Orientation and Pin Position – D401 ................................. 57
Figure 3-18. USB Type-C Receptacle Pin Map .......................................................................... 59
Figure 3-19. USB3 Micro-B Receptacle Pin Map ........................................................................ 60
Figure 3-20. Intel® RealSenseTM Depth Camera D415 ............................................................... 63
Figure 3-21. Intel® RealSense™ Depth Camera D435/D435i ..................................................... 63
Figure 3-22. Intel® RealSense™ Depth Camera D455 ............................................................... 63
Figure 3-23. Intel® RealSense™ Depth Camera D405 ............................................................... 63
Figure 4-1. Depth Field of View to Depth Map illustration .......................................................... 78
Figure 4-2. Left Invalid Depth Band ....................................................................................... 79
Figure 4-3. Depth Module Depth Start Point Reference ............................................................. 82
Figure 4-4. Depth Camera Depth Start Point Reference ............................................................ 84
Figure 4-5. Depth Module X-Y Depth Origin Reference – D410, D415, D430, D450 ...................... 85
Figure 4-6. Depth Module X-Y Depth Origin Reference – D401 ................................................... 86
Figure 4-7. Depth Camera X-Y Depth Origin Reference – D415, D435/D435i/D435f, D455 ............ 87
Figure 4-8. Depth Camera X-Y Depth Origin Reference – D405 .................................................. 88
Figure 7-1. System Block Diagram – D415, D435, D435i, D455 ................................................. 94
Figure 7-2. System Block Diagram – D405 .............................................................................. 95
Figure 7-3. Intel® RealSense™ Vision Processor D4 Board – V1, V3 ........................................... 96
Figure 7-4. Intel® RealSense™ Vision Processor D4 Board – V4 ................................................. 96
Figure 7-5. Vision Processor D4 on Motherboard (Illustration) ................................................... 97
Figure 7-6. D4 Camera System Power Scheme ........................................................................ 98
Figure 7-7. Bottom Stiffener Depth Module D410/D415 ........................................................... 102
Figure 7-8. Bottom Stiffener Depth Module D430 .................................................................... 102
Figure 7-9. Bottom Stiffener Depth Module D450 .................................................................... 102
Figure 7-10. Bottom Stiffener Depth Module D401 .................................................................. 102
Figure 7-11. Stereo Depth Module Screw Mounting/End Mounting – D410.................................. 103
Figure 7-12. Stereo Depth Module Screw Mounting/End Mounting – D430.................................. 104
Figure 7-13. Stereo Depth Module Bracket example for D415 ................................................... 105
Figure 7-14. Stereo Depth Module Bracket Mount – D415 ........................................................ 105
Figure 7-15. Stereo Depth Module Mid-Mounting – D401 ......................................................... 106
Figure 7-16. Stereo Depth Module Air Gap ............................................................................. 107
Figure 7-17. Illustration of Gasket Placement and Cover Material .............................................. 109
Figure 7-18. Example of Light Leakage Effects........................................................................ 110
Figure 7-19. Firmware Recovery Sequence ............................................................................ 111
Figure 7-20. External Sensor Sync Connector Location on D4 Vision Processor V1 and V3 Board... 111

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Figure 7-21. External Sensor Sync Connector Location on Depth Camera D435/D435i/D455 ........ 112
Figure 8-1. Vision Processor D4 with USB Host Interface ......................................................... 113
Figure 8-2. Vision Processor D4 with MIPI Host Interface ......................................................... 113
Figure 8-3. Vision Processor D4 on Board for USB Integrated Peripheral .................................... 114
Figure 8-4. Host Processor - Vision Processor D4 .................................................................... 115
Figure 8-5. Vision Processor D4 Transmit - Host Receive ......................................................... 116
Figure 8-6. Stereo Depth Transmit - Vision Processor D4 Receive ............................................. 117
Figure 8-7. Flex Interposer PCB Stack-Up .............................................................................. 118
Figure 8-8. USB 3.1 Gen 1 Host to Vision Processor D4 Topology .............................................. 118
Figure 8-9. USB2.0 Host to Vision Processor D4...................................................................... 119
Figure 9-1. NRTL Certifications ............................................................................................. 124
Figure 10-1. Intel® RealSense™ Depth Module D410 .............................................................. 129
Figure 10-2. Intel® RealSense™ Depth Module D415 ............................................................... 130
Figure 10-3. Intel® RealSense™ Depth Module D430 ............................................................... 131
Figure 10-4. Intel® RealSense™ Depth Module D450 ............................................................... 132
Figure 10-5. Intel® RealSense™ Depth Module D401 ............................................................... 133
Figure 10-6. Vision Processor D4 Board USB Type-C (Intel® RealSense™ Vision Processor D4 Board –V1 and V3) .................................................................................................... 134
Figure 10-7. Vision Processor D4 Board USB Micro-B (Intel® RealSense™ Vision Processor D4 Board– V4) ............................................................................................................ 135
Figure 10-8. Intel® RealSense™ Depth Camera D415 .............................................................. 136
Figure 10-9. Intel® RealSense™ Depth Camera D435/D435i .................................................... 137
Figure 10-10. Intel® RealSense™ Depth Camera D455 ............................................................ 139
Figure 10-11. Intel® RealSense™ Depth Camera D405 ............................................................ 140
Figure 11-1. Receptacle Mechanical Drawing (50-Pin Depth Module Receptacle) ......................... 141
Figure 11-2. Plug Mechanical Drawing (50-Pin Depth Module Plug) ........................................... 142
Figure 12-1. Vision Processor D4 Laser PWM Reference Platform Schematic ............................... 150
Figure 12-2. Vision Processor D4 24 MHz Crystal Clock Reference Platform Schematic ................. 150
Figure 12-3. DC-DC Reference Platform Schematic (3.3 V, 1.8 V, 0.9 V) .................................... 151
Figure 12-4. Vision Processor D4 VDD_PG and AVDD Reference Platform Schematic ................... 152

TablesTable 2-1. Depth Module Product SKU Descriptions .................................................................. 19
Table 2-2. Depth Camera Product SKU Descriptions ................................................................. 20
Table 3-1. Component Descriptions........................................................................................ 21
Table 3-2. Vision Processor D4 Signal Descriptions .................................................................. 22
Table 3-3. Hardware Straps .................................................................................................. 27
Table 3-4. Vision Processor D4 Package Mechanical Attributes ................................................... 28
Table 3-5. Vision Processor D4 Ball-out by Signal Name ........................................................... 30
Table 3-6. Vision Processor D4 Power Requirements ................................................................ 33
Table 3-7. Vision Processor D4 Power Sequencing Timing Parameters ........................................ 33
Table 3-8. Vision Processor D4 SPEC Code .............................................................................. 34
Table 3-9. Vision Processor D4 Storage and Operating Conditions .............................................. 34
Table 3-10. Stereo Depth Module........................................................................................... 35
Table 3-11. Stereo Depth Module SKU Properties ..................................................................... 37
Table 3-12. Standard Left and Right Imager Properties – D410/D415......................................... 38
Table 3-13. Wide Left and Right Imager Properties – D430 ....................................................... 38
Table 3-14. Wide Left and Right Imager Properties – D450 ....................................................... 39
Table 3-15. Wide Left and Right Imager Properties – D401 ....................................................... 39
Table 3-16. Standard (D41x) Infrared Projector Parameters ...................................................... 40
Table 3-17. Wide (D43x, D45x) Infrared Projector Parameters .................................................. 40
Table 3-18. Color Sensor Properties – D415 ............................................................................ 41

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Table 3-19. Color Sensor Properties – D450 ............................................................................ 42
Table 3-20. Color Sensor Properties – D401* .......................................................................... 42
Table 3-21. Depth Module 50-pin Connector Plug Details .......................................................... 43
Table 3-22. Stereo Depth Module Product Labeling .................................................................. 43
Table 3-23. Stereo Depth Module Label Fields ......................................................................... 43
Table 3-24. Intel® RealSense™ Depth Module D400 Series Product Identifier Code and ProductMaterial Code .................................................................................................. 44
Table 3-25. Other Stereo Depth Module Components ............................................................... 44
Table 3-26. Intel® RealSense™ Depth Module D410 Mechanical Dimensions ............................... 45
Table 3-27. Intel® RealSense™ Depth Module D415 Mechanical Dimensions ............................... 45
Table 3-28. Intel® RealSense™ Depth Module D430 Mechanical Dimensions ............................... 45
Table 3-29. Intel® RealSense™ Depth Module D450 Mechanical Dimensions ............................... 46
Table 3-30. Intel® RealSense™ Depth Module D401 Mechanical Dimensions ............................... 46
Table 3-31. Stereo Depth Module Storage and Powered Conditions ............................................ 46
Table 3-32. Vision Processor D4 Board ................................................................................... 47
Table 3-33. Vision Processor D4 Board Components ................................................................. 47
Table 3-34. Vision Processor D4 USB Type-C V1/V3 Board Mechanical Dimensions....................... 48
Table 3-35. Vision Processor D4 USB3 Micro-B V4 Board Mechanical Dimensions ......................... 49
Table 3-36. Depth Module Receptacle Details .......................................................................... 49
Table 3-37. Interposer Interconnect Signal Description – D415, D435, D435i, D435f, D455 .......... 51
Table 3-38. Interposer Interconnect Signal Description - D401 .................................................. 55
Table 3-39. Custom Flex Interposer Ordering Logistics ............................................................. 57
Table 3-40. External Sensor Connector Details ........................................................................ 58
Table 3-41. External Sensor Sync Connector Pin List ................................................................ 58
Table 3-42. USB Peripheral Connector Pin List ......................................................................... 59
Table 3-43. USB Peripheral Connector Pin List – D405 .............................................................. 60
Table 3-44. ISP Properties .................................................................................................... 61
Table 3-45. Vision Processor D4 Board Power Requirements ..................................................... 61
Table 3-46. Vision Processor D4 Board Storage and Powered Conditions ..................................... 62
Table 3-47. Vision Processor D4 Board Product Identifier and Material Code ................................ 62
Table 3-48. Depth Camera SKU Properties .............................................................................. 64
Table 3-49. D435 and D435f Comparison ............................................................................... 65
Table 3-50. Intel® RealSense™ Depth Camera D415 Mechanical Dimensions ............................... 66
Table 3-51. Intel® RealSense™ Depth Camera D435, D435i, D435f Mechanical Dimensions .......... 66
Table 3-52. Intel® RealSense™ Depth Camera D455 Mechanical Dimensions ............................... 66
Table 3-53. Intel® RealSense™ Depth Camera D405 Mechanical Dimensions ............................... 66
Table 3-54. Depth Camera D400 Series Storage and Powered Conditions ................................... 67
Table 3-55. Depth Camera D400 Series Product Identifier and Material Code .............................. 68
Table 4-1. Vendor ID and Device ID Table .............................................................................. 70
Table 4-2. Image Formats (USB 3.1 Gen 1) – D410/D415/D430/D435/D435i/D435f .................... 70
Table 4-3. Image Formats (USB 3.1 Gen 1) – D450/D455 ........................................................ 72
Table 4-4. Image Formats (USB 3.1 Gen1) – D401/D405 ......................................................... 73
Table 4-5. Simultaneous Image Streams (USB 3.1 Gen 1) –D410/D415/D430/D435/D435i/D435f/D450/D455 ............................................... 74
Table 4-6. Simultaneous Image Streams (USB 3.1 Gen 1) – D401/D405 .................................... 74
Table 4-7. Image Formats (USB 2.0) – D410/D415/D430/D435/D435i/D435f ............................. 75
Table 4-8. Image Formats (USB 2.0) – D450/D455 .................................................................. 75
Table 4-9. Image Formats (USB 2.0) – D405 .......................................................................... 76
Table 4-10. Simultaneous Image Streams (USB 2.0) ................................................................ 77
Table 4-11. Minimum-Z Depth ............................................................................................... 80
Table 4-12. Depth Quality Metric ........................................................................................... 80
Table 4-13. Depth Quality Metric Illustration ........................................................................... 81
Table 4-14. Depth Quality Specification .................................................................................. 81
Table 4-15. Depth Module Depth Start Point ........................................................................... 83
Table 4-16. Depth Cameras Depth Start Point ......................................................................... 85

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Table 4-17. Depth Module X-Y Depth Origin Coordinates .......................................................... 85
Table 4-18. Depth Module X-Y Depth Origin Coordinates – D401 ............................................... 86
Table 4-19. Depth Camera X-Y Depth Origin Coordinates .......................................................... 87
Table 4-20. Depth Camera X-Y Depth Origin Coordinates – D405 .............................................. 88
Table 4-21. Depth Camera Controls ....................................................................................... 88
Table 4-22. RGB Exposed Controls ......................................................................................... 89
Table 4-23. IMU Specifications – BMI055 ................................................................................ 90
Table 4-24. IMU Specifications – BMI085 ................................................................................ 90
Table 7-1. Vision Processor D4 Board V1/V2/V3 – Component Power and TDP at Max Operating
Mode(1) ........................................................................................................... 98
Table 7-2. Vision Processor D4 Board V4 – Component Power and TDP at Max Operating Mode(1) .. 99
Table 7-3. Stereo Depth Module (D410/D415) – Component Power and TDP at Max Operating
Mode(1) ........................................................................................................... 99
Table 7-4. Stereo Depth Module (D430) – Component Power and TDP at Max Operating Mode(1) ... 99
Table 7-5. Stereo Depth Module (D450) – Component Power and TDP at Max Operating Mode(1) ... 99
Table 7-6. Stereo Depth Module (D401) – Component Power and TDP at Max Operating Mode(1) .. 100
Table 7-7. Stereo Depth Camera (D415) – Component Power and TDP at Max Operating Mode(1) . 100
Table 7-8. Stereo Depth Camera (D435) – Component Power and TDP at Max Operating Mode(1) . 100
Table 7-9. Stereo Depth Camera (D455) – Component Power and TDP at Max Operating Mode(1) . 101
Table 7-10. Stereo Depth Camera (D405) – Component Power and TDP at Max Operating Mode(1) 101
Table 7-11. Vision Processor D4 Board Components – Case Temperature Limits (Still Air) ........... 101
Table 7-12. Component Transmission .................................................................................... 108
Table 7-13. Electrostatic Discharge Caution ........................................................................... 112
Table 8-1. Host Transmit – Vision Processor D4 Receive Routing Guidelines ............................... 115
Table 8-2. Vision Processor D4 Transmit - Host Receive Routing Guidelines ............................... 115
Table 8-3. Vision Processor D4 Transmit – Host Receive Routing Guidelines ............................... 116
Table 8-4. Stereo Depth Module Transmit - Vision Processor D4 Receive Routing Guidelines ........ 117
Table 8-5. USB 3.1 Gen 1 Host to Vision Processor D4 Routing Guidelines ................................. 119
Table 9-1. U.S. FDA Accession Number.................................................................................. 123
Table 12-1. Vision Processor D4 on Motherboard Schematic Checklist ....................................... 143
Table 12-2. Vision Processor D4 Decoupling and Filter Requirements ........................................ 152
Table 13-1. Example: Cover Material Parameters .................................................................... 153

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Revision History
Revision Number

Description

Revision Date

001

Initial release

January 2018002

Tracking Module 1 removal, NRTL certification, 7.2.2.1
Firmware Update

March 2018003

• Added USB2.0 support

July 2018• Removed VBUS0 from Table 3 6. Vision Processor D4 Power
Requirements• Table 3 12. Standard Left and Right Imager Properties• Table 3 13. Wide Left and Right Imager Properties• Table 3 9. Vision Processor D4 Storage and Operating
Conditions• Table 3 27 Stereo Depth Module Storage and Operating
Conditions• Table 3 38. Vision Processor D4 Board Storage and Operating
Conditions• Table 3 44. Depth Camera D400 Series Storage and Operating
Conditions• Table 4 3. Image Formats (USB 2.0)
• Table 4 5. Simultaneous Image Streams (USB3.1 Gen1, USB
2.0)• 4.7 Depth Origin Point (Ground Truth Zero)• 7.14 Multi-camera hardware sync for multi-camera
configuration
004• Description and Features

November 2018

• Terminology• Table 2-2. Depth Camera Product SKU Descriptions• Table 3-11. Stereo Depth Module SKU Properties• Table 3-33. Custom Flex Interposer Ordering Logistics• Table 3-35. External Sensor Sync Connector Pin List
• Table 3-42. Depth Camera SKU properties• Table 3-47. Depth Camera D400 Series Product Identifier andMaterial Code• Table 4-1. Vendor ID and Device ID Table• Table 4-2. Image Formats (USB 3.1 Gen1)• Table 4-3. Image Formats (USB 2.0)
• Table 4-9. Depth Quality Specification• Section 4-12 IMU Specification
005• Table 3-11. Stereo Depth Module SKU Properties

January 2019

• Table 3-42. Depth Camera SKU Properties• Table 4-4. Simultaneous Image Streams (USB 3.1 Gen 1 &USB 2.0)• Table 4-18. IMU Specifications

337029-013

9Revision Number
006

Description• Table 3-28. Vision Processor D4 Board

Revision Date
June 2019• Table 4-2. Image Formats (USB 3.1 Gen1)• Table 4-4. Simultaneous Image Streams (USB 3.1 Gen1 & USB
2.0)• Table 4-17. RGB Exposed Controls• Figure 10-7. Intel® RealSense™ Depth Camera D415
• Figure 10-8. Intel® RealSense™ Depth Camera D435/D435i• Figure 4-1. Depth Field of View to Depth Map illustration
007• Table 3-19. Stereo Depth Module Label Fields

October 2019

• Table 3 43. Intel® RealSense™ Depth Camera D415 Mechanical
Dimensions• Table 3 44. Intel® RealSense™ Depth Camera D435, D435i
Mechanical Dimensions• Table 4-9. Depth Quality Specification• Section 7.6. Stereo Depth Module Flex
• Remove Table 7-11. Bracket Ordering Logistics
008• Support for Intel® RealSense™ Vision Processor D4 Board V2(IMU version for MM#954010)

April 2020

• Table 2-1. Depth Module Product SKU Descriptions• Table 3-9. Vision Processor D4 Storage and Operating
Conditions• Table 3-15. Wide Infrared Projector Parameters• Table 3-27. Stereo Depth Module Storage and Powered
Conditions• Table 3-37. Recommended USB Type C cable Assemblies
Ordering Logistics• Table 3-40. Vision Processor D4 Board Storage and Powered
Conditions• Table 3-41. Vision Processor D4 Board Product Identifier andMaterial Code• Table 3-45. Depth Camera D400 Series Storage and Powered
Conditions• Table 4-2. Image Formats (USB 3.1 Gen 1)• Table 4-15. RGB Exposed Controls• Table 4-16. IMU Specifications• Table 7-10. Vision Processor D4 Board Components – Case
Temperature Limits (Still Air)• Table 13-1. Example: Cover Material Parameters• Section 1. Description and Features• Section 3.6.7. Temperature Sensor• Section 3.7.5. USB Peripheral Connector – Type-C• Section 3.8.2.2. Depth Camera D400 Series Thermal Solution
Guidance• Remove Table 4-3. Image Formats (USB 2.0)
• Remove Section 4.8. Measured Power337029-013

10

Revision Number
009

Description• Section 1. Description and Features

Revision Date
June 2020• Section 3.8.4. Camera Lens Cleaning Procedure• Section 9. Regulatory Compliance• Table 2-2. Depth Camera Product SKU Descriptions• Table 3-42. Depth Camera SKU properties• Table 3-45. Intel® RealSense™ Depth Camera D455 Mechanical
Dimensions• Table 3-47. Depth Camera D400 Series Product Identifier andMaterial Code• Table 4-3. Image Formats (USB 3.1 Gen1) – D455
• Table 4-1. Vendor ID and Device ID Table• Table 4-4. Simultaneous Image Streams (USB 3.1 Gen1 &USB2.0)• Table 4-5. Depth Field of View
• Table 4-6. Minimum-Z Depth• Table 4-9. Depth Quality Specification• Table 4-13. Depth Camera X-Y Depth Origin Coordinates• Table 4-11. Depth Cameras Depth Start Point• Table 4-16. IMU Specifications• Figure 3-15. Intel® RealSense™ Depth Camera D455
• Figure 10-9. Intel® RealSense™ Depth Camera D455
010

• Figure 3-6. Stereo Depth Module (Intel® RealSense™ Depth
Module D450)

February 2021

• Table 3-11. Stereo Depth Module SKU Properties• Table 3-14. Wide Left and Right Imager Properties – D450
• Table 3-22. Intel® RealSense™ Depth Module D400 Series
Product Identifier Code and Product Material Code• Table 3-29. Intel® RealSense™ Depth Module D450 Mechanical
Dimensions• Table 3 43. Vision Processor D4 Board Product Identifier andMaterial Code• Table 3-48. Depth Camera D400 Series Storage and Powered
Conditions – Notes• Table 3-49. Depth Camera D400 Series Product Identifier andMaterial Code• Table 4-1. Vendor ID and Device ID Table• Table 4-5. Depth Field of View
• Table 4-9. Depth Quality Specification• Table 4-10. Depth Module Depth Start Point• Table 4-12. Depth Module X-Y Depth Origin Coordinates• Table 4-16. IMU Specifications• Table 7-10. Stereo Depth Module (D450) – Component Powerand TDP at Max Operating Mode(1)• Figure 7-9. Bottom Stiffener Depth Module D450
• Figure 10-6. Intel® RealSense™ Depth Module D450

337029-013

11

Revision Number
011

Description• General: typos, rephrasing, removing D420

Revision Date
August 2021

• Table 2-2. Depth Camera Product SKU Descriptions• Table 3-10. Stereo Depth Module• Table 3-11. Stereo Depth Module SKU Properties• Table 3-15. Standard Infrared Projector Parameters• Table 3-16. Wide Infrared Projector Parameters• Table 3-18. Color Sensor Properties• Tables 3-24 to 3-29 3-45 to 3-47 flatness• Table 3-43. Depth Camera SKU properties• Table 3-48. Case temperature• 4.11 IMU Specifications - removing Vision Processor D4 Board
V2 (PCN #1180–5 - 00)• Table 4-2. Image Formats (USB 3.1 Gen1)• Table 4-3. Image Formats (USB 3.1 Gen1) – D450/D455• Table 4-4. Simultaneous Image Streams (USB 3.1 Gen1 &USB2.0)• Table 4-8. Adding lifetime• Table 4-9. Depth Quality Specification• Table 7-4. Stereo depth module D450 component power• 4.3 Depth Field of View (FOV)• 7.4. Update thermal data and add cameras• 7.6 Stereo Depth Module Mounting Guidance• 9.1 Regulatory laser compliance• 9.2 Regulatory compliance• Figure 10-6. Intel® RealSense™ Depth Module D450
012

• General: Add D401/D405

March 2022

013

• General: Add D435f

April 2022

337029-013

12

Description and Features

1

Description and Features
The Intel® RealSenseTM Product Family D400 Series is a stereo vision depth camera
system. The subsystem assembly contains a stereo depth module and vision processor
with USB 2.0/USB 3.1 Gen 1 or MIPI1 connection to host processor.
The small size and ease of integration of the camera subsystem provides system
integrators flexibility to design into a wide range of products.
The Intel® RealSenseTM D400 series also offers complete depth cameras integrating
the vision processor, stereo depth module, RGB sensor with color image signal
processing, and an Inertial Measurement Unit2 (IMU). The depth cameras are designed
for easy setup and portability making them ideal for makers, educators, hardware
prototypes and software development.
The Intel® RealSenseTM D400 series is supported with the cross-platform and open
source Intel® RealSense™ SDK 2.0.

Usages/Markets

Minimum System Requirements
General Features•

Autonomous Mobile Robots (AMR)•

Automated Guided Vehicles (AGV)•

Drones•Collision avoidance•Home surveillance•

3D scanning•

Digital signage•

Volumetric measurement•

USB 2.0/USB 3.1 Gen 1•

Ubuntu*16.xx/Windows*10•

2nd Generation Stereo Depth Camera System•

2nd Generation dedicated Intel® RealSense™ Vision
Processor D4 with advanced algorithms•

Infrared (IR) Laser Projector System•

Full HD resolution Image sensors•

Active power management•

Selection of Stereo Depth Module options to meetyour usage requirements
1.
2.

Intel® RealSense™ Depth Camera
D415 Features

337029-012

MIPI is not currently supported. Please contact
your Intel representative on MIPI enablement
timelines.
Module and Camera SKU dependent•Intel® RealSense™ Vision Processor D4•

Up to 1280 x 720 stereo depth resolution•

Up to 1920 x 1080 RGB resolution•

Depth diagonal field of view over 70°•

Dual rolling shutter sensors for up to 90 FPS depth
streaming

13

Intel® RealSense™ Depth Camera
D435/D435i Features••

337029-013

Intel® RealSense™ Depth
Camera D455 Features

Intel® RealSense™ Depth
Camera D405 Features•

Range 0.3 m to over 4 m (varies with lighting
conditions)•Intel® RealSense™ Vision Processor D4•

Up to 1280 x 720 stereo depth resolution•

Up to 1920 x 1080 RGB resolution•

Depth diagonal field of view over 90°•

Dual global shutter sensors for up to 90 FPS depth
streaming•

Range 0.2 m to over 3 m (varies with lighting
conditions)•Intel® RealSense™ Depth Camera D435i includes
Inertial Measurement Unit (IMU) for 6 Degrees ofFreedom (6DoF) data•

Intel® RealSense™ Vision Processor D4•

Up to 1280 x 720 stereo depth resolution•

Up to 1280 x 800 RGB resolution•

Diagonal field of view over 90°•

Dual global shutter sensors for up to 90 FPS depth
streaming•

RGB global shutter sensor for up to 90 FPS•

Range 0.4 m to over 6 m (varies with lighting
conditions)•Intel® RealSense™ Depth Camera D455 includes
Inertial Measurement Unit (IMU) for 6 Degrees ofFreedom (6DoF) data•

Intel® RealSense™ Vision Processor D4•

Up to 1280 x 720 stereo depth resolution•

Up to 1280 x 720 RGB resolution•

Diagonal field of view over 90°•

Dual global shutter sensors for up to 90 FPS depth
streaming•

RGB global shutter sensor for up to 90 FPS•

Range 7 cm to 1 m (varies with lighting conditions)

14

2
2.1

Introduction
Purpose and Scope of this Document
This document captures the specifications and the design–in details for the Intel®
RealSense™ D400 series family of products. This document provides informationnecessary to understand and implement an Intel® RealSense™ D400 series-based
camera system.
Note: Intel® RealSense™ D400 series is alternately referred to as “D4 Camera
System” in this document. Intel® RealSense™ Vision Processor D4 is alternately
referred to as “D4” in this document.

2.2

Terminology
Term

Description

6DOF

Six Degrees of Freedom (6DoF) refers to the freedom of movement of arigid body in three-dimensional space. Forward/back, up/down, left/right,
pitch, yaw, roll

Stereo Depth
Baseline

The distance between the center of the left and right imagers in a stereo
cameraMIPI CSI-2

The Camera Serial Interface (CSI) is a specification of the Mobile Industry
Processor Interface (MIPI) Alliance and CSI-2 is the 2nd generation
specification defining the interface between a camera and a hostprocessor

Depth

Depth video streams are similar to color video streams except that eachpixel has a value representing the distance away from the camera insteadof color information

D4

If the term D4 is used alone, it refers to the entire D4 camera system
consisting of various modules and components.
If the term D4 is used with an appropriate qualifier (i.e., D4 Vision
Processor, D4 Vision Processor Board), it refers to the specific module orcomponent within the D4 camera system.

337029-013

FOV

Field Of View (FOV) describes the angular extent of a given scene that isimaged by a camera. A camera's FOV can be measured horizontally,
vertically, or diagonally.

Host System

Computer or SOC connected to D4 camera

I2C

I²C (Inter-Integrated Circuit), pronounced I-squared-C, is a multimaster, multi-slave, single-ended, serial computer bus invented byPhilips Semiconductor (now NXP Semiconductors). It is typically used toallow easy control and data communication between components.

15

Term

2.3

Description

IR Projector

This refers to the source of infrared (IR) light used for illuminating ascene, object, or person to collect depth data.

Imagers

Depth camera system uses a pair of cameras referred as imagers to
calculate depth. They are identical cameras configured with identicalsettings.

Image Signal
Processor(ISP)

Image processing functions to enhance color image quality

Left imager

From the perspective of the stereo camera looking out at the world, theleft imager is on the left side of the camera module. Thus, when the user
is facing the front of the camera, the left imager is on the right side of
the camera module.

Lens

This refers to the optical component of an imager in the D4 camera. Its
purpose is to focus the incoming light rays onto the CMOS chip in theimager.

MIPI

MIPI (Mobile Industry Processor Interface) is a global, open membershiporganization that develops interface specifications for the mobile
ecosystem

Platform
cameraThis refers to the two-dimensional (2D) color camera on a platform

System on
Chip (SoC)

Integrated circuit (IC) that integrates all components of a computer

Stereo Depth
ModuleThis refers to a stiffened module containing at least two imagers. The
distance between the imagers, which is referred to as the baseline or
intraocular spacing, is typically in the range of 18 mm to 95 mm.

Stereo camera

This refers to a pair of imagers looking at the same subject from slightly
different perspectives. The difference in the perspectives is used togenerate a depth map by calculating a numeric value for the distancefrom the imagers to every point in the scene.

SKU

Stock Keeping Unit (SKU) is a unique identifier for distinct products. It is
often used in the scope of naming different versions of a device.

TBD

To Be Determined. In the context of this document, information will beavailable in a later revision.

Stereo Vision Depth Technology Overview
The Intel® RealSense™ D400 series depth camera uses stereo vision to calculate
depth. The stereo vision implementation consists of a left imager, right imager,
and an optional infrared projector. The infrared projector projects a non-visible
static IR pattern to improve depth accuracy in scenes with low texture. The left
and right imagers capture the scene and send imager data to the depth imaging(vision) processor, which calculates depth values for each pixel in the image by

337029-013

16correlating points on the left image to the right image and via the shift between apoint on the Left image and the Right image. The depth pixel values are processedto generate a depth frame. Subsequent depth frames create a depth video
stream.
Figure 2-1. Active Infrared (IR) Stereo Vision Technology

2) Search

1) Capture3) Depth
Image
Sensors

IR Projector

The depth pixel value is a measurement from the parallel plane of the imagers andnot the absolute range as illustrated.
Figure 2-2. Depth Measurement (Z) versus Range (R)337029-013

17

2.4

Camera System Block Diagram
The camera system has two main components, Vision Processor D4 and Depth
module. The Vision Processor D4 is either on the host processor motherboard oron a discrete board with either a USB2.0/USB 3.1 Gen 1 or a MIPI connection to
the host processor. The Depth module incorporates left and right imagers forstereo vision with the optional IR projector and RGB color sensor. The RGB color
sensor data is sent to Vision Processor D4 via the color Image Signal Processor(ISP) on the Host Processor motherboard or D4 Board.

Figure 2-3. Vision Processor D4 Camera System Block Diagram

337029-013

18

2.5

Intel® RealSense™ Depth Module D400 series
Product SKUs
The Table below describes the main components that make up the different depth
module SKUs.

Table 2-1. Depth Module Product SKU Descriptions
Component

Subcomponent

D410

D415

D430

D450

D401

Intel® RealSense™
Vision Processor D4

-

√

√

√

√

√

Intel® RealSense™
Vision Processor D4
Board

-

V1(1)

V1(1)

V1(1)/V3(2)

V3(2)

V4(3)

Standard Stereo Imagers

√

√

X

X

X

Wide Stereo Imagers

X

X

√

√

√

Standard Infrared
Projector

√

√

X

X

X

Wide Infrared Projector

X

X

√

√

X

RGB Color Sensor

X

√

X

√

√(4)

Intel® RealSense™
Depth Module

Definitions:
D410 = Intel® RealSenseTM Depth Module D410
D415 = Intel® RealSenseTM Depth Module D415
D430 = Intel® RealSenseTM Depth Module D430
D450 = Intel® RealSenseTM Depth Module D450
D401 = Intel® RealSenseTM Depth Module D401
Notes:(1) Intel® RealSense™ Vision Processor D4 Board V1(2) Intel® RealSense™ Vision Processor D4 Board V3 (IMU Version of V1)(3) Intel® RealSense™ Vision Processor D4 Board V4(4) Left depth sensor provides RGB data to color ISP

337029-013

19

2.6

Intel® RealSense™ Depth Camera D400 series
Product SKUs
The Table below describes the main components that make up the different
camera SKUs.

Table 2-2. Depth Camera Product SKU Descriptions

ComponentSubcomponentIntel®
RealSense
TM
Depth
Camera
D415Intel®
RealSense
TM
Depth
Camera
D435/Intel®
RealSense
TM
Depth
Camera
D435i

Intel®
RealSense
TM
Depth
Camera
D455Intel®
RealSense
TM
Depth
Camera
D405

D435f
Intel®
RealSense™
VisionProcessor D4

Intel
RealSense™
Depth
Module

-

√

√

√

√

√

Standard
StereoImagers

√

X

X

X

X

Wide Stereo
Imagers

X

√

√

√

√

Standard
Infrared
Projector

√

X

X

X

X

Wide Infrared
Projector

X

√

√

√

X

RGB colorsensor

√

√

√

√

√

X

X

√

√

X

®

Inertial
Measurement
Unit (IMU)
Notes:

337029-013

1.

For information regarding USB interoperability, refer to whitepaper “USB Interoperability
Testing for Intel® RealSense™ Cameras” - https://www.intelrealsense.com/usbinteroperability-testing-for-intel-realsense-cameras

2.

D435f = D435 with 750nm near-infrared filter (CLAREX® NIR-75N) applied to coverglass, with holes over projector and RGB sensor openings. Filter transmits near-infrared
light and absorbs visible light. Filter’s thickness = 0.5 mm.

20

3
3.1

Component Specification
Vision Processor D4 Camera System
Components

Table 3-1. Component Descriptions
Component

Description

Host Processor

Host Processor that receives Depth and other data streams from Vision
Processor D4

VisionProcessor D4

Depth Imaging Processor with USB 2.0/USB 3.1 Gen 1 or MIPI interface
connection to Host Processor

Clock

24 MHz clock source for Vision Processor D4

Serial Flash
MemorySPI 16 Mb Serial Flash memory for firmware storage

Stereo Depth
ModuleCamera module with left and right imager, color sensor†, IR projector†
enclosed in a stiffenerPower Delivery

Circuitry on motherboard/Vision Processor D4 Board to deliver and manage
power to Vision Processor D4 and Stereo Depth Module.

Stereo Depth
Connector andInterposer

50-pin connector on motherboard/Vision Processor D4 Board and Stereo
Depth module with interposer for connection

Note:(†) SKU dependent

3.2

Host Processor
The host processor interface to Vision Processor D4 is either USB 2.0/USB 3.1 Gen
1 or MIPI. To ensure the best of quality of service, the Vision Processor D4 must
be connected to a dedicated USB 3.1 Gen 1 root port within the host processor
system.

3.3

Intel® RealSense™ Vision Processor D4
The primary function of Vision Processor D4 is to perform depth stereo vision
processing. The Vision Processor D4 on the Host Processor motherboard or on the
Vision Processor D4 Board communicates to the host processor throughUSB2.0/USB 3.1 Gen 1 or MIPI and receives sensor data from the stereo depth
module. The Vision Processor D4 supports MIPI CSI-2 channels for the connection
to the image sensors.

337029-013

21

3.3.1

Vision Processor D4 Features
•
•
•
•
•
•
•
•
•

3.3.2

28 nm CMOS process technology
5 MIPI camera ports with each MIPI lane capable of handling data transfers of
up to 750 Mbps
USB 2.0/USB 3.1 Gen 1 or MIPI interface to host system
Image rectification for camera optics and alignment compensation
IR Projector (laser) controls
Serial Peripheral Interface for fast data transfer with external SPI flash
Integrated I2C ports
General purpose Input/Output pins
Active power gating

Vision Processor D4 Signal Description

Table 3-2. Vision Processor D4 Signal Descriptions
RESERVED – Signal reserved for future usage
IO Type- Input/Output Buffer type
A – Analog
I – Input
O - Output
Signal Name

IO
Type

After
RESET

Host MIPI Data Lane 0 Differential Pair

A

I

Host MIPI Data Lane 1 Differential Pair

A

I

Host MIPI Data Lane 2 Differential Pair

A

I

Host MIPI Data Lane 3 Differential Pair

A

I

Host MIPI Clock Differential Transmit Pair

A

I

Host I2C Bus Data and Clock

I/O

IO

Host MIPI External Reference 6.04K 1% resistor pull down
to ground)

A

I

A

I

Description
Host MIPI

H_DATAP0
H_DATAN0
H_DATAP1
H_DATAN1
H_DATAP2
H_DATAN2
H_DATAP3
H_DATAN3
H_CLKP
H_CLKN
H_SDA
H_SCL
H_REXT

Imager A MIPI
A_DATAP0337029-013

Imager A MIPI Data Lane 0 Differential Receive Pair

22

IO
Type

After
RESET

Imager A MIPI Data Lane 1 Differential Receive PairA

I

Imager A MIPI Clock Differential Receive PairA

I

Imager A I2C Bus Data and Clock

I/O

IO

A_RCLK

Imager A Reference Clock

I/O

O

A_PDOWN(RESERVED) Imager A Power Down Signal

I/O

O

A_VSYNC

Imager A Vertical/Frame Sync

I/O

I

A_RESETN

Imager A Reset

I/OO

A_REXT

Imager A MIPI External Reference (6.04K 1% resistor pull
down to ground)

A

I

A

I

(RESERVED) Imager B MIPI Data Lane 1 Differential
Receive PairA

I

(RESERVED) Imager B MIPI Clock Differential Receive PairA

I

(RESERVED) Imager B I2C Bus Data and Clock

I/O

IO

B_RCLK(RESERVED) Imager B Reference Clock

I/O

O

B_PDOWN(RESERVED) Imager B Power Down

I/O

O

B_VSYNC(RESERVED) Imager B Vertical/Frame Sync

I/O

I

B_RESETN(RESERVED) Imager B Reset

I/OO

B_REXT

Imager B MIPI External Reference (6.04K 1% resistor pull
down to ground)A

I

Imager M MIPI Data Lane 0 Differential Receive PairA

I

Imager M MIPI Data Lane 1 Differential Receive PairA

I

Imager M MIPI Clock Differential Receive PairA

I

Imager M I2C Bus Data and Clock

I/O

IO

Signal Name

Description

A_DATAN0
A_DATAP1
A_DATAN1
A_CLKP
A_CKLN
A_SDA
A_SCL

Imager B MIPI
B_DATAP0
B_DATAN0
B_DATAP1
B_DATAN1
B_CLKP
B_CKLN
B_SDA
B_SCL(RESERVED) Imager B MIPI Data Lane 0 Differential
Receive Pair

Imager M MIPI
M_DATAP0
M_DATAN0
M_DATAP1
M_DATAN1
M_CLKP
M_CKLN
M_SDA
M_SCL

337029-013

23

Signal Name

Description

IO
Type

After
RESET

M_RCLK

Imager M Reference Clock

I/OO

M_PDOWN(RESERVED) Imager M Power Down

I/O

O

M_VSYNC

Imager M Vertical/Frame Sync

I/O

I

M_RESETN

Imager M Reset

I/OO

M_REXT

Imager M MIPI External Reference (6.04K 1% resistor pull
down to ground)A

I

Imager Y MIPI Data Lane 0 Differential Receive PairA

I

Imager Y MIPI Data Lane 1 Differential Receive PairA

I

Imager Y MIPI Clock Differential Receive PairA

I

Imager Y I2C Bus Data and Clock

I/O

IO

Y_RCLK

Imager Y Reference ClockI/OO

Y_PDOWN(RESERVED) Imager Y Power Down

I/OO

Y_VSYNC

Imager Y Vertical/Frame Sync

I/O

I

Y_RESETN

Imager Y Reset

I/OO

Y_REXT

Imager Y MIPI External Reference (6.04K 1% resistor pull
down to ground)A

I(RESERVED) Imager Z MIPI Data Lane 0 Differential
Receive PairA

I

(RESERVED) Imager Z MIPI Data Lane 1 Differential
Receive PairA

I

(RESERVED) Imager Z MIPI Clock differential Receive PairA

I

(RESERVED) Imager Z I2C Bus Data and Clock

I/O

IO

Z_RCLK(RESERVED) Imager Z Reference ClockI/O

O

Z_PDOWN(RESERVED) Imager Z Power Down

I/O

O

Z_VSYNC

Depth Vertical/Frame Sync

I/OO

Z_RESETN(RESERVED) Imager Z Reset

I/O

O

Z_REXT

Imager Z MIPI External Reference (6.04K 1% resistor pull
down to ground)A

I

Imager Y MIPIY_DATAP0
Y_DATAN0
Y_DATAP1
Y_DATAN1
Y_CLKPY_CKLN
Y_SDA
Y_SCL

Imager Z MIPIZ_DATAP0Z_DATAN0
Z_DATAP1
Z_DATAN1
Z_CLKPZ_CKLN
Z_SDA
Z_SCL

Serial Peripheral Interconnect (SPI)

337029-013

24

Signal Name

Description

IO
Type

After
RESET

SPI_DISPI Data Input

I/O

I

SPI_DOSPI Data Output

I/O

O

SPI_CLKSPI ClockO

O

SPI_CSSPI Chip SelectO

O

SPI_WP

Flash Write Protect

O

O

General Purpose Input Output (GPIO)
GPIO[0](RESERVED) Not Defined

I/O

I

GPIO[1](RESERVED) Not Defined

I/O

I

GPIO[2]

Laser PWM – Controls Laser Power for IR projector on
Stereo Module

I/OO

GPIO[3](RESERVED) Not Defined

I/O

I

GPIO[4](RESERVED) Not Defined

I/O

I

GPIO[5](RESERVED) Not Defined

I/O

I

GPIO[6](RESERVED) Not Defined

I/O

I

GPIO[7](RESERVED) Not Defined

I/O

I/O

EGPIO[0](RESERVED) Not Defined

I/O

I/O

EGPIO[1](RESERVED) Not Defined

I/O

I/O

EGPIO[2](RESERVED) Not Defined

I/O

I/O

EGPIO[3]Laser_PWRDN - IR projector Power Down Signal

I/OO

EGPIO[4](RESERVED) Not Defined

I/O

I/O

EGPIO[5]FLAGB – IR Projector Fault Detect

I/O

I

EGPIO[6](RESERVED) Not Defined

I/O

I/O

EGPIO[7](RESERVED) Not Defined

I/O

I/O

EGPIO[8]ISP_FCS (Color ISP)I/OOEGPIO[9](RESERVED) Not Defined

I/O

I/O

EGPIO[10](RESERVED) Not Defined

I/O

I/O

EGPIO[11](RESERVED) Not Defined

I/O

I/O

EGPIO[12](RESERVED) Not Defined

I/O

I/O

EGPIO[13](RESERVED) - For Intel test purpose only

I/O

I/O

Miscellaneous

337029-013

LD_ON_OUT_XX(RESERVED) Laser Enable

O

O

MODSTROB(RESERVED) Modulation current strobeO

O

MODSIGN(RESERVED) Modulation current signO

O

LD_ERR

Laser Error (Active High)

I

I

CLKXI

24 MHz XTAL

I

I

25

Signal Name

Description

IO
Type

After
RESET

CLKXO

24MHz XTAL

I

I

PRSTN

D4 Reset

I

I

CW_CSR_PRSTn

Hardware reset without debug port reset

I/O

I

PMU_PWR_EN

Switchable domain (VDD_PG) power control signal

I/O

O

DFU

Dynamic FW update, used for FW recovery

I/OI

I2C Bus Data and Clock

I/O

IO

VQPSQ

(RESERVED) – For Intel test purpose only

O

O

VQPSM

(RESERVED) – For Intel test purpose onlyO

O

REFPADCLKP(RESERVED) – For Intel test purpose only

I

I

REFPADCLKM(RESERVED) – For Intel test purpose onlyI

I

ISP_SCL
ISP_SDAJTAGTDITest Data Input

I/O

I

TDO

Test Data Output

I/O

O

TCLK

Test Clock Input

I/O

I

TMS

Test Mode Select

I/O

I

TRSTN

Test Reset

I/O

I

USB
USB_RXPUSB 3.1 Gen 1 receive, positive sideA

I

USB_RXN

USB 3.1 Gen 1 receive, negative sideA

I

USB_TXPUSB 3.1 Gen 1 Transmit, positive sideAO

USB_TXN

USB 3.1 Gen 1 Transmit, negative sideAO

USB_DPUSB 2.0 D+ lineA

IO

USB_DNUSB 2.0 D- lineA

IO

USB_ID

Mini-receptacle identifier and test point

USB_RESREF

Reference Resistor input. 200 Ohm 1%

A

I

Power and Ground337029-013

VDD

0.9 V (Core Voltage)Power

VDD_PG

0.9 V (Switched Core Voltage)Power

USB_DVDD

0.9 V (USB Core Voltage)

Power

VPTX0

0.9 V (USB Core Voltage)

Power

VP

0.9 V (USB Core Voltage)

Power*_AVDD

1.8 V (MIPI Core and IO Voltage)Power

VDDPLL

0.9 V (PLL Voltage)

Power

26

Description

IO
Type

VDDTS

1.8 V (Temperature Sensor Voltage)Power

VDDPST18

1.8 V (IO Voltage)

Power

USB_VDD330

3.3 V (USB Core Voltage)

Power

VBUS0

3.3 V (VBUS power monitor)

Power

VSS

GroundGND*_AGND

GroundGND

Signal Name

After
RESET

Table 3-3. Hardware Straps
Boot
Load

Pin
EPGPIO0

No

HW/FW
FW

Description
USB connection type:
0: Peripheral (default)
1: Integrated

EGPIO4Yes

HW

SPI Interface:
0: SPI on “Z”
1: SPI connected (default)

EPGPIO7

Yes

FW

Flash
00: 64 Mb
01: 8 Mb
10: 16 Mb (default)

EPGPIO8

11: 32 Mb
EPGPIO9No

FW

Host interface:
0: USB (default)
1: MIPIEPGPIO10No

FW

Board version [0] (default: 0)

EPGPIO11

No

FW

Board version [1] (default: 0)

EPGPIO12No

FW

Board version [2] (default: 0)

DFU

Yes

HW

Go to DFU
0: Disabled (default)
1: Go to DFU mode (Recovery)

Notes:

337029-013

1.

Boot Load – Read during Boot

2.

Hardware (HW) Strap – External hardware pin state directly configures D4
functionality

3.

Firmware (FW) Strap – External hardware pin state is read by firmware andfirmware configures D4 functionality27

3.3.3

Vision Processor D4 Package Mechanical Attributes
The Table below provides an overview of the mechanical attributes of the package.

Table 3-4. Vision Processor D4 Package Mechanical Attributes
Parameter

Description

Value

Package Technology

Package Type

Flip Chip CSP (Chip Scale Package)Interconnect

Ball Grid Array (BGA) Ball

Lead Free

Yes

Halogenated Flame Retardant Free

Yes

Solder Ball Composition

SAC125Ni

Ball/Pin Count

225 solder balls

Grid Array Pattern

15 x 15

Nominal Package Size (mm)6.40 x 6.40

Min Ball/Pin pitch (mm)0.42

Package Configuration

Package Dimensions

Weight337029-013

~1 g

28

Figure 3-1. Vision Processor D4 Package Drawing

337029-013

29

Figure 3-2. Vision Processor D4 Ball-out

A

B

C

D

E

F

G

H

J

K

L

15

VSS

Y_DATAN0

Y_REXT

Y_SCL

GPIO_0

GPIO_1

GPIO_5

GPIO_6

MODSTROB

TMS

TRSTN

SPI_WPN SPI_MISO CW_CSR_RSTN

14

Y_CLKNY_CLKPY_DATAP0

Y_RCLK

Y_SDA

Y_RESETN GPIO_2

GPIO_3 MODSIGN

TCLK

TDO

SPI_CLK SPI_MOSI Z_RESETN Z_VSYNC

1413

Y_DATAN1 Y_DATAP1

VSS

VSS

12

B_DATAN0

B_SCL

B_SDA

Y_AVDDVSS

11

B_CLKN B_DATAP0 B_REXT

VSS

VSS

10

B_DATAN1

N

P

R

9

H_DATAN3 B_DATAP1 B_PDOWNVSS8H_DATAN2 H_DATAP3 B_VSYNC

VSS

VSS

7

H_CLKN H_DATAP2 B_RCLK

H_AVDDVSS6

H_DATAN1

5

H_DATAN0 H_DATAP1

15

VSS

GPIO_4

GPIO_7

LD_ERR

LD_ON_OUT_XX

TDISPI_CS

Z_SDA

Z_DATAP0

Z_RCLK

13

VSS

VDDPST18_LEFT

VSS

VSS

VDDPST18_LEFT

VSS

VSS

Z_SCL

Z_CLKP Z_DATAN0

12

VSS

VDD

VDD

VDD

VSS

VSS

Z_AVDD Z_PDOWN Z_DATAP1 Z_CLKN

11

VDD

VDD

VDD_PG VDD_PG ISP_SCL

Z_REXT M_DATAP1 Z_DATAN1

10

VSS

VSS

VDD_PG VDD_PG

ISP_SDA M_CLKP M_DATAN1

9

VSS

VSS

Y_PDOWN Y_VSYNC

B_CLKP B_RESETN B_AVDD VDD_PG VDD_PG VDD_PG

H_CLKPM

VDD_PG VDD_PG VDD_PG

VDD_PG VDD_PG

VSS

VSS

VSS

VSS

VSS

M_DATAP0 M_CLKN

8

VSS

VSS

VSS

VSS

VDD_PG VDD_PG M_AVDD M_RESETN M_PDOWN M_DATAN07

H_AVDD REFPADCLKP REFPADCLKM

VSS

VDD

VDD

VSS

VDD_PG VDD_PG M_REXT M_VSYNC M_SDA

M_RCLK

6

H_REXT

VP

VDD

VDD

VDD

VSS

VSS

VSS

M_SCL

5

USB_IDVSSVSSA_DATAP14

H_SCL

H_DATAP0

USB_VDD330

VPTX0

VSS

VSS

VDDPST18_RIGHT

VSS

VSS

A_AVDD A_REXT

A_CLKP A_DATAN1

4

3

USB_RXN

H_SDA

PRSTN

USB_DP EGPIO_1 EGPIO_11 VDDTS

VSSTS

VDDPST18_RIGHTPMU_PWR_EN

VQPSQ

VQPSM A_PDOWN A_DATAP0 A_CLKN

32

USB_TXN USB_RXP

DFU

USB_DN EGPIO_9 EGPIO_13 VDDPLLVSSPLLEGPIO_5 EGPIO_12 EGPIO_3 EGPIO_4

EGPIO_6 EGPIO_7 EGPIO_8 CLK_XIN CLK_XOUT EGPIO_10 EGPIO_2 EGPIO_0 A_VSYNC A_SDA A_RESETN

1VSS

USB_TXP

VBUS0

A

B

C

D

USB_RESREF USB_DVDD

E

F

G

H

J

K

L

M

A_SCL

N

A_RCLK A_DATAN0

P

1

VSS

R

Table 3-5. Vision Processor D4 Ball-out by Signal Name

337029-013

Ball

Name

Ball

Name

Ball

Name

A01

H_AGND

B01

USB_TXP

C01

VBUS0

A02

USB_TXN

B02

USB_RXP

C02

DFU

A03

USB_RXN

B03

H_SDA

C03

PRSTN

A04

H_SCL

B04

H_DATAP0

C04

USB_VDD330

A05

H_DATAN0

B05

H_DATAP1

C05

H_REXT

A06

H_DATAN1

B06

H_CLKP

C06

H_AVDDA07

H_CLKN

B07

H_DATAP2C07

B_RCLK230

337029-013

Ball

Name

Ball

Name

Ball

Name

A08

H_DATAN2

B08

H_DATAP3C08

B_VSYNC

A09

H_DATAN3

B09

B_DATAP1C09

B_PDOWN

A10

B_DATAN1

B10

B_CLKPC10

B_RESETN

A11

B_CLKN

B11

B_DATAP0

C11

B_REXTA12

B_DATAN0

B12

B_SCL

C12

B_SDA

A13

Y_DATAN1

B13

Y_DATAP1C13

Y_AGNDA14

Y_CLKNB14

Y_CLKPC14

Y_DATAP0A15

Y_AGNDB15

Y_DATAN0C15

Y_REXT

D01

EGPIO_6

E01

EGPIO_7

F01

EGPIO_8

D02

USB_DN

E02

EGPIO_9

F02

EGPIO_13

D03

USB_DP

E03

EGPIO_1

F03

EGPIO_11

D04

VPTX0

E04

USB_RESREF

F04

USB_DVDD

D05

VP

E05

USB_ID

F05

VDD

D06

REFPADCLKP

E06

REFPADCLKM

F06

VSS

D07

H_AVDDE07

H_AGND

F07

VSS

D08

B_AGND

E08

VSS

F08

VDD_PGD09

B_AGNDE09

VDD_PGF09

VDD_PG

D10

B_AVDDE10

VDD_PGF10

VDD_PG

D11

VSS

E11

VSS

F11

VSS

D12

Y_AVDD

E12

VSS

F12

VSS

D13

VSS

E13

Y_PDOWN

F13

Y_VSYNC

D14

Y_RCLK

E14

Y_SDA

F14

Y_RESETN

D15

Y_SCL

E15

GPIO_0F15

GPIO_1G01

CLK_XIN

H01

CLK_XOUT

J01

EGPIO_10

G02

VDDPLLH02

VSSPLLJ02

EGPIO_5

G03

VDDTS

H03

VSSTS

J03

VDDPST18_RIGHT

G04

VSS

H04

VSS

J04

VDDPST18_RIGHT

G05

VDD

H05

VDD

J05

VSS

G06

VDD

H06

VDD

J06

VSS

G07

VSS

H07

VSS

J07

VSS

G08

VDD_PG

H08

VSS

J08

VSS

G09

VDD_PG

H09

VSS

J09

VSS

G10

VDD_PG

H10

VDD

J10

VDD

G11

VDD

H11

VDD

J11

VDD

G12

VDDPST18_LEFT

H12

VSS

J12

VSS

31

337029-013

Ball

Name

Ball

Name

Ball

Name

G13

GPIO_4

H13

GPIO_7

J13

LD_ERR

G14

GPIO_2

H14

GPIO_3

J14

MODSIGN

G15

GPIO_5

H15

GPIO_6

J15

MODSTROB

K01

EGPIO_2

L01

EGPIO_0

M01

A_VSYNC

K02

EGPIO_12

L02

EGPIO_3

M02

EGPIO_4

K03

PMU_PWR_EN

L03

VQPSQ

M03

VQPSM

K04

VSS

L04

VSS

M04

A_AVDD

K05

VSS

L05

VSS

M05

VSS

K06

VDD_PG

L06

VDD_PG

M06

M_REXTK07

VDD_PGL07

VDD_PG

M07

M_AVDD

K08

VSS

L08

VSS

M08

M_AGNDK09

VDD_PGL09

VDD_PG

M09

M_AGNDK10

VDD_PGL10

VDD_PG

M10

ISP_SCL

K11

VSS

L11

VSS

M11

Z_AVDDK12

VDDPST18_LEFT

L12

VSS

M12

VSS

K13

LD_ON_OUT_XX

L13

TDI

M13

SPI_CS

K14

TCLK

L14

TDO

M14

SPI_CLK

K15

TMS

L15

TRSTN

M15

SPI_WPN

N01

A_SDA

P01

A_RESETN

R01

A_AGND

N02

A_SCL

P02

A_RCLKR02

A_DATAN0

N03

A_PDOWN

P03

A_DATAP0R03

A_CLKN

N04

A_REXT

P04

A_CLKP

R04

A_DATAN1

N05

A_AGNDP05

A_DATAP1

R05

M_SCL

N06

M_VSYNC

P06

M_SDA

R06

M_RCLK

N07

M_RESETN

P07

M_PDOWN

R07

M_DATAN0

N08

VSS

P08

M_DATAP0R08

M_CLKNN09

ISP_SDAP09

M_CLKP

R09

M_DATAN1

N10

Z_REXTP10

M_DATAP1

R10

Z_DATAN1

N11

Z_PDOWN

P11

Z_DATAP1

R11

Z_CLKN

N12

Z_SCL

P12

Z_CLKPR12

Z_DATAN0

N13

Z_SDA

P13

Z_DATAP0R13

Z_RCLK

N14

SPI_MOSIP14

Z_RESETN

R14

Z_VSYNC

N15

SPI_MISOP15

CW_CSR_RSTN

R15

Z_AGND

32

3.3.4

Vision Processor D4 Power Requirements
The Vision Processor D4 requires the following power supplies for operation.

Table 3-6. Vision Processor D4 Power Requirements

3.3.5

Voltage Ball Name

Min.
(V)

Nominal
(V)

Max.
(V)

Peak Current
(Icc)

VDD

0.85

0.9

0.95

0.4 A

VDD_PG

0.85

0.9

0.95

1.6 A

USB_DVDD

0.81

0.9

0.99

0.2 A

VPTX0

0.81

0.9

0.99

0.2 A

VP

0.81

0.9

0.99

0.2 A

*AVDD

1.71

1.8

1.89

0.2 A

VDDPLL

0.85

0.9

0.95

0.2 A

VDDTS

1.71

1.8

1.89

0.2 A

VDDPST18 (Left andRight)

1.71

1.8

1.89

0.2 A

USB_VDD330

3.13

3.3

3.46

0.2 A

Vision Processor D4 Power Sequencing
The timing requirement for power sequencing is listed below and shown in thefollowing figure.
1. Hold Vision Processor D4 in reset
2. Ramp up power in the 3.3 V rail
3. Ramp up power in the 0.9 V rail
4. Ramp up power in the 1.8 V rail
5. Release Vision Processor D4 Reset

Table 3-7. Vision Processor D4 Power Sequencing Timing Parameters
Parameter

Value

Units

Label

0.9 V stable to 3.3 V stable

>= 50

us

T1

PMU_PWR_EN to 0.9 V Stable

>= 50

us

T2

1.8 V stable to 0.9 V Stable

>= 50

us

T3

15

us

T4

PRSTN (D4 RESET) assertion to 1.8 V stable

337029-013

33

Figure 3-3. Vision Processor D4 Power Sequencing

Note: Vision Processor D4 has no specific power down sequence requirement.

3.3.6

Vision Processor D4 Spec CodeThe spec code is an identification mark printed on Vision Processor D4.

Table 3-8. Vision Processor D4 SPEC Code

3.3.7

Vision Processor D4SPEC CODE

Production (Shipped in Tape and Reel)

SLLY5

Production (Shipped in Tray)

SLM6B

Vision Processor D4 Storage and Operating Conditions

Table 3-9. Vision Processor D4 Storage and Operating Conditions

337029-013

Condition

Description

Min

Max

Unit

Storage (Still Air), Not
OperatingTemperature (Sustained,
Controlled)(1)

0

85

oC

34

Operating, Component
Case Temperature(3)Temperature (Short
Exposure)(2)-40

Humidity

Temperature/ RH: 40oC / 90%

Temperature

0

85

85

oC

oC

Notes:

3.3.8

1.

Controlled conditions should be used for long-term storage of product2.

Short exposure represents temporary max limits acceptable for transportation
conditions

3.

Component case temperature limits must be met during operation

Vision Processor D4 Thermals
The thermal design should be such that Vision Processor D4 does not exceed
component case temperature limit. Care must also be taken to make sure that the
Vision Processor D4 heat is not transferred to other components of the imaging
system or stereo depth module. It is best to thermally isolate Vision Processor D4
from the stereo depth module.

3.4

Clock
Vision Processor D4 requires a single 24 MHz clock oscillator. All clocks required bystereo depth module are generated by Vision Processor D4.

3.5

Serial (SPI) Flash Memory
Vision Processor D4 requires 16 Mb Serial Flash Memory for its firmware storage.
The recommended part number is IS25WP016 (www.issi.com) or equivalent.

3.6

Stereo Depth Module
The stereo depth module components are described in Table 3-10. The stereo
depth printed circuit board and components are encapsulated in a common metal
stiffener.

Table 3-10. Stereo Depth Module
Component

337029-013

Description

Left and Right Imagers

2 image sensors

Infrared (IR) Projector

Class 1 laser compliant (optional)(1)

Color Sensor

RGB image sensor (optional)

Depth Module Connector

50-pin connector plug

35

Stiffener

Reinforcement housing to keep imagers aligned

Label

Manufacture and product identifier information

Other Components

Laser driver, EEPROM, voltage regulators, etc.

Note:(1) IR projector is considered Class 1 when integrated into Intel® RealSense™ Depth
Cameras. Also considered Class 1 when depth module is paired with Intel®
RealSense™ Vision Processor D4 Board and integration guidelines in thisdatasheet are used.

Figure 3-4. Stereo Depth Module (Intel® RealSense™ Depth Module D410)

Right
ImagerModuleLabel

IR
Projector

CameraConnector

Left
ImagerFigure 3-5. Stereo Depth Module (Intel® RealSense™ Depth Module D430)
Module Label

Right Imager

IR Projector

CameraConnector

Left Imager

Figure 3-6. Stereo Depth Module (Intel® RealSense™ Depth Module D450)

337029-013

36

Figure 3-7. Stereo Depth Module (Intel® RealSense™ Depth Module D401)

Table 3-11. Stereo Depth Module SKU Properties
Intel®
Intel®
Intel®
Intel®
Intel®
RealSense™ RealSense™ RealSense™ RealSense™ RealSense™
Depth
Depth
Depth
Depth
Depth
ModuleModuleModuleModuleModule
D410
D415
D430
D450
D401

StereoModuleBaseline

55 mm

55 mm

50 mm

95 mm

18 mm

Left/Right
Imagers TypeStandard

Standard

Wide

Wide

Wide

Depth FOVHD (16:9)(degrees)

H:65 / V:40 / H:65 / V:40 / H:87 / V:58 / H:87 / V:58 / H:84 / V:58 /
D:72
D:72
D:95
D:95
D:92

Depth FOVVGA (4:3)(degrees)

H:50 / V:40 / H:50 / V:40 / H:75 / V:62 / H:75 / V:62 /
D:61
D:61
D:89
D:89

IR Projector

Standard

IR Projector
FOVStandard

Wide

Wide

H:67 / V:41 / H:67 / V:41 / H:90 / V:63 / H:90 / V:63 /
D:75
D:75
D:99
D:99

Color Sensor-

OV2740-Color Camera
FOV-

H:69/ V:42 /D:77-

ModuleDimensions(mm)

X=74.7 mm
Y=10 mm
Z=4.7 mm

X=83.7 mm
Y=10 mm
Z=4.7 mm

OV9782

OV9782

H:90 / V:65 / H:84 / V:58 /
D:98
D:92

X=70.7 mm X=119.5 mm
Y=14 mm
Y=17.4 mm
Z=10.53 mm Z=10.53 mm

X=36.5 mm
Y=19.4 mm
Z=10.5 mm

Notes:

337029-013

1.

H = Horizonal FOV, V = Vertical FOV, D = Diagonal FOV, X = Length, Y = Breadth, Z= Thickness

2.

Depth FOV specified at 0.2 m for D401 and at 2 m for other modules37Due to mechanical tolerances of ± 5%, Max and Min FOV values can vary from lens
to lens and module to module by ~ ± 3 degrees

3.

3.6.1

Left and Right Imagers
The stereo depth module has two camera sensors referred to here as imagers;
they are identical parts and are configured with identical settings. The imagers arelabeled “left” and “right” from the perspective of the camera module looking
outward. The stereo imager pairs are referred as Standard or Wide based onimager field of view.

Table 3-12. Standard Left and Right Imager Properties – D410/D415
Parameter

Camera Sensor Properties

Image Sensor

OmniVision Technologies OV2740

Active Pixels

1920 × 1080

Sensor Aspect Ratio

16:9

Format10-bit RAW

F Number

f/2.0

Focal Length

1.88 mm

Filter Type

None

Focus

Fixed

Shutter Type

Rolling Shutter

Signal Interface

MIPI CSI-2, 2X Lanes

Horizontal Field of View

69.4o

Vertical Field of View

42.5o

Diagonal Field of View

77o

Distortion<= 1.5%

Table 3-13. Wide Left and Right Imager Properties – D430
Parameter

337029-013

Camera Sensor Properties

Image Sensor

OmniVision Technologies OV9282

Active Pixels

1280 x 800

Sensor Aspect Ratio

8:5

Format10-bit RAW

F Number

f/2.0

Focal Length

1.93 mm

Filter Type

None

Focus

Fixed

Shutter Type

Global Shutter

38

Parameter

Camera Sensor Properties

Signal Interface

MIPI CSI-2, 2X Lanes

Horizontal Field of View

91.2o

Vertical Field of View

65.5o

Diagonal Field of View

100.6oDistortion<= 1.5%

Table 3-14. Wide Left and Right Imager Properties – D450
Parameter

Camera Sensor Properties

Image Sensor

OmniVision Technologies OV9782

Active Pixels

1280 x 800

Sensor Aspect Ratio

8:5

Format10-bit RAW

F Number

f/2.0

Focal Length

1.93 mm

Filter Type

None

Focus

Fixed

Shutter Type

Global Shutter

Signal Interface

MIPI CSI-2, 2X Lanes

Horizontal Field of View

90 ± 1oVertical Field of View

65 ± 1oDiagonal Field of View

95 ± 1oDistortion<= 1.5%

Table 3-15. Wide Left and Right Imager Properties – D401
Parameter

337029-013

Camera Sensor Properties

Image Sensor

OmniVision Technologies OV9782

Active Pixels

1280 x 800

Sensor Aspect Ratio

8:5

Format10-bit RAW

F Number

f/2.0

Focal Length

1.93 mm

Filter TypeIR Cut Filter

Focus

Fixed

Shutter Type

Global Shutter

Signal Interface

MIPI CSI-2, 2X Lanes

39

Horizontal Field of View

84 ± 1oVertical Field of View

58 ± 1oDiagonal Field of View

92 ± 1oDistortion<= 1.5%

Note:
1.

3.6.2

D401 Depth FOV specified at 200 mm

Infrared Projector
The infrared projector improves the ability of the stereo camera system todetermine depth by projecting a static infrared pattern on the scene to increase
texture on low texture scenes. The infrared projector meets the Class 1 laser
safety standard under normal operation. The power delivery and laser safety
circuits are on the stereo depth module. The infrared projector is referred asStandard or Wide based on field of projection.

Table 3-16. Standard (D41x) Infrared Projector Parameters
Parameter

Properties

Projector

InfraredPattern Type

StaticIlluminating Component

Vertical-cavity surface-emitting laser (VCSEL) + Optics

Laser Controller

PWM

Optical Power

360 mW average

Laser Wavelength

850 nm ± 10 nm nominal @ 20°C

Laser ComplianceClass 1, IEC 60825-1:2007 Edition 2, IEC 60825-1:2014
Edition 3(*)

Horizontal Field of Projection

64°±3°

Vertical Field of Projection

41°±3°

Diagonal Field of Projection

72°±3°

Note:(*) IR projector is considered Class 1 when integrated into Intel® RealSense™ Depth
Cameras. Also considered Class 1 when depth module is paired with Intel® RealSense™
Vision Processor D4 Board and integration guidelines are used.

Table 3-17. Wide (D43x, D45x) Infrared Projector Parameters
Parameter

337029-013

Properties

Projector

InfraredPattern Type

StaticIlluminating Component

Vertical-cavity surface-emitting laser (VCSEL) + optics

Laser Controller

PWM

40

Parameter

Properties

Optical Power

360mW average

Laser Wavelength

850nm ± 10 nm nominal @ 20°C

Laser Compliance(*)

Class 1, IEC 60825-1:2007 Edition 2, IEC 60825-1:2014
Edition 3

Horizontal Field of Projection

90°±3°

Vertical Field of Projection

63°±3°

Diagonal Field of Projection

99°±3°

Note:(*) IR projector is considered Class 1 when integrated into Intel® RealSense™ Depth
Cameras. Also considered Class 1 when depth module is paired with Intel® RealSense™
Vision Processor D4 Board and integration guidelines are used.

3.6.3

Color Sensor
The color sensor on the stereo depth module, in addition to generating a color
image, provides texture information. Usages for the texture information include
overlay on a depth image to create a colorized point cloud and overlay on a 3Dmodel for reconstruction.

Table 3-18. Color Sensor Properties – D415
Parameter

337029-013

Camera Sensor Properties

Image Sensor

OmniVision Technologies OV2740

Color Image Signal Processor

Discrete

Active Pixels

1920 x 1080

Sensor Aspect Ratio

16:9

Format10-bit RAW RGB

F Number

f/2.0

Focal Length

1.88 mm

Filter TypeIR Cut Filter

Focus

Fixed

Shutter Type

Rolling Shutter

Signal Interface

MIPI CSI-2, 1 Lane

Horizontal Field of View

69.4o

Vertical Field of View

42.5o

Diagonal Field of View

77o

Distortion<= 1.5%41

Table 3-19. Color Sensor Properties – D450
Parameter

Camera Sensor Properties

Image Sensor

OmniVision Technologies OV9782

Color Image Signal Processor

Discrete

Active Pixels

1280 x 800

Sensor Aspect Ratio

16:10

Format10-bit RAW RGB

F Number

f/2.0

Focal Length

1.93 mm

Filter TypeIR Cut Filter

Focus

Fixed

Shutter Type

Global Shutter

Signal Interface

MIPI CSI-2, 1 Lane

Horizontal Field of View

90o

Vertical Field of View

65o

Diagonal Field of View

98oDistortion<= 1.5%

Table 3-20. Color Sensor Properties – D401*
Parameter

Camera Sensor Properties

Image Sensor

OmniVision Technologies OV9782

Color Image Signal Processor

Discrete

Active Pixels

1280 x 800

Sensor Aspect Ratio

8:5

Format10-bit RAW

F Number

f/2.0

Focal Length

1.93 mm

Filter TypeIR Cut Filter

Focus

Fixed

Shutter Type

Global Shutter

Signal Interface

MIPI CSI-2, 2X lanes

Horizontal Field of View

84 ± 1oVertical Field of View

58 ± 1oDiagonal Field of View

92 ± 1oDistortion<= 1.5%

Note:337029-013

42

(*) D401 does not contain a dedicated RGB sensor. D401’s left depth sensor provides RGB
data to the color ISP.

3.6.4

Depth Module Connector
The depth module connector provides the signal and power interface to the stereo
depth module. The connector on the stereo depth module is a 50-pin connector
plug.

Table 3-21. Depth Module 50-pin Connector Plug Details

3.6.5

Parameter

Description

Number of Contacts

50

Product NameNOVASTACK 35-P
Plug AssemblyPart Number

20708-050E

Manufacturer Website

www.i-pex.com

DiagramStereo Depth Module Label

Table 3-22. Stereo Depth Module Product Labeling

Dimension

For illustration purpose only, subject tochange

Value

Unit

A

Label Width

17

mm

B

Label Height

6.9

mm

C

Scan Code Width

5

mm

D

Scan CodeHeight5mm

Scan Code Format
XXXXXXXXXXXXOOOOOOXXXXXX-XXX
Table 3-23. Stereo Depth Module Label Fields
Group

Field

CompanyIntel

Model Number

RealSense
4XX
XXXXXX

337029-013

Description
Manufacturer

TM

CameraCamera Model Number
Product Identifier CodeType
StaticStaticStatic43

Product Assembly
NumberSerial Number-XXX

Manufacture Configuration
Code

Dynamic

OOOOOO

Product Material CodeStaticXXXXXXXXXXXXManufacture Unit CodeDynamic

Note:
1. Product Material Code (MM code) within the QR code on the label of the device will read
“000000”. The QR code MM code will be zero.

Table 3-24. Intel® RealSense™ Depth Module D400 Series Product Identifier Codeand Product Material Code

3.6.6

Production

Product Identifier CodeManufacture Configuration Code

Product Material Code

Depth Module D410

J32106-100

951913Depth Module D415

J32114-100

952000Depth Module D420

J51355-100956826

Depth Module D450

K83121-100

999WCM

Depth Module D401

M31768-100

99ACXA

Stiffener
The stiffener maintains the precise alignment of the camera sensors and assists in
subassembly rigidity. The stiffener consists of a bottom and a top plate. The
stiffener is of stainless steel grade AISI 304.

3.6.7

Temperature Sensor
The stereo depth module is equipped with a thermal sensor that is used for laser
safety control (IR Projector). The Intel® RealSense™ SDK 2.0 library provides
access to the thermal sensor readouts. Temperature information does not reflect
the ambient temperature of the module.

3.6.8

Other Stereo Depth Module Components

Table 3-25. Other Stereo Depth Module Components
Component
Laser (IRProjector) Driver

337029-013

Description
The depth module implements a laser driver which controls the infraredlaser within the infrared projector system.

44

3.6.9Laser (IRprojector)
Thermal Control

The depth module implements a laser safety control circuit that adjusts
laser drive output. When laser power and depth streaming is enabled and if
stereo depth module temperature is >60°C, laser power is halved. If
temperature is not lowered below temperature limit within a certain
interval, the laser is shut off.

EEPROM

The depth module implements flash memory for storing the calibration data

Fork/Screw Mount

Secure placement and mounting to system/chassis/heat sink

Voltage
Regulators

The stereo depth module implements DC to DC voltage converters

Mechanical Dimensions

Table 3-26. Intel® RealSense™ Depth Module D410 Mechanical Dimensions
Dimension

Min

Nominal

Max

Unit

Width

74.5

74.7

74.9

mm

Height

9.8

10

10.2

mm

Depth

4.5

4.7

4.9

mm

Flatness Tolerance

0

-

0.2

mm

Weight

7.3

8.1

8.9

g

Table 3-27. Intel® RealSense™ Depth Module D415 Mechanical Dimensions
Dimension

Min

Nominal

Max

Unit

Width

89.5

89.7

89.9

mm

Height

9.8

10

10.2

mm

Depth

4.5

4.7

4.9

mm

Flatness Tolerance

0

-

0.2

mm

Weight11g

Table 3-28. Intel® RealSense™ Depth Module D430 Mechanical Dimensions

337029-013

Dimension

Min

Nominal

Max

Unit

Width

70.5

70.7

70.9

mm

Height

13.8

14

14.2

mm

Depth

10.33

10.53

10.73

mm

Flatness Tolerance

0

-

0.2

mm

Weight

13

14.5

16

g

45

Table 3-29. Intel® RealSense™ Depth Module D450 Mechanical Dimensions
Dimension

Min

Nominal

Max

Unit

Width

119.3

119.5

119.7

mm

Height

17.2

17.4

17.6

mm

Depth

10.33

10.53

10.73

mm

Flatness Tolerance

0

-

0.25

mm

Weight29.5

gTable 3-30. Intel® RealSense™ Depth Module D401 Mechanical Dimensions

3.6.10Dimension

Min

Nominal

Max

Unit

Width

36.3

36.5

36.7

mm

Height

19.2

19.4

19.6

mm

Depth

10.3

10.5

10.7

mm

Flatness Tolerance

-

0.15

-

mm

Weight

9.9

10.9

11

g

Stereo Depth Module Power Sequence

Figure 3-8. Stereo Depth Module Power Sequence

3.3V

1.8V

3.6.11

Stereo Depth Module Storage and Powered Conditions

Table 3-31. Stereo Depth Module Storage and Powered Conditions
Condition
Storage (Ambient), Not
Powered (6)337029-013

Description

Min

Max

Unit

Temperature (Sustained,
Controlled)(1)

0

50

oC

46

Case Temperature,
Powered (3)(4)(5)(6)Temperature (Short
Exposure)(2)-40

Humidity

Temperature / RH: 40oC / 90%

Temperature

0

70

50

oC

oC

Notes:(1) Controlled conditions should be used for long term storage of product(2) Short exposure represents temporary max limits acceptable for transportation
conditions(3) Case temperature limits must be met for all temperatures when powered(4) Case temperature is specified for the overall depth module(5) Case temperature 0° minimum and lower temperatures is non-condensing(6) Although all Key Performance Indicators (KPIs) are verified before leaving Intel’sfactory, KPIs may be negatively impacted by extended exposure to excessive
temperatures and humidity

3.7Intel® RealSense™ Vision Processor D4 Board
The Vision Processor D4 Board enables an easy and quick option for system
integrators to integrate Vision Processor D4 into a system.

Table 3-32. Vision Processor D4 BoardType

Description

USB Peripheral
Type-C

Connects to Host USB 3.1 Gen 1 port through USB Type-C connector andcable
Note: When connecting to host system, connect Type-C cable to camera
prior to connecting device to host system port.

Table 3-33. Vision Processor D4 Board Components
Components

337029-013

Description

Vision Processor D4

Stereo Depth Processing ASIC

16 Mb Serial Flash

Vision Processor D4 firmware storage

24 MHz Crystal

Clock source for Vision Processor D4

Realtek* ISP with external serial flash

Color image signal processor

Depth Module Receptacle

50-pin receptacle for connection to Stereo Depth
ModuleUSB Type-C

USB peripheral connector for connection to Host
USB 2.0/USB 3.1 Gen 1 port

External Sensor Sync Connector

Interface to external sensor interrupts/sync signals

47

Components

Description

Voltage Regulators

DC to DC converters powering Vision Processor D4
Board and stereo depth module.

Mounting holes

Vision Processor D4 Board secure mounting

Figure 3-9. Vision Processor D4 Board (V1 and V3) (USB Peripheral Type-C)
Depth Module
Receptacle

Vision Processor D4

USB Type-C
Connector

External Sensor
Sync Connector

Figure 3-10. Vision Processor D4 Board (V4) (USB3 Peripheral Micro-B)

3.7.1

Mechanical Dimensions

Table 3-34. Vision Processor D4 USB Type-C V1/V3 Board Mechanical Dimensions

337029-013

Dimension

Min

Nominal

Max

Unit

Width

72.2

72.4

72.6

mm

Height

15.8

16

16.2

mm

48

Depth

3.74

3.94

4.14

mm

Weight

3.56

3.96

4.36

g

Table 3-35. Vision Processor D4 USB3 Micro-B V4 Board Mechanical Dimensions

3.7.2

Dimension

Min

Nominal

Max

Unit

Width

35.9

36

36.1

mm

Height

22.9

23

23.1

mm

Depth

2.48

2.63

2.78

mm

Weight

1.1

2.7

3.2

g

Depth Module Receptacle
The Vision Processor D4 Board interface to stereo depth module is through 50-pin
receptacle on the board.

Table 3-36. Depth Module Receptacle Details

3.7.3

Parameter

Description

Number of Contacts

50

Product NameNOVASTACK* 35-P
Receptacle AssemblyPart Number

20709-050E

Manufacturer Website

www.i-pex.com

DiagramFlex and Rigid Interposer Interconnect
The high-speed interposer at one end has the 50-pin depth module receptacle toconnect into 50-pin depth module plug on stereo depth module, and at the otherend has the 50-pin depth module plug to connect into 50-pin depth module
receptacle on Vision Processor D4 Board. The high-speed flex interposer is custom
developed and procured by system integrator.

337029-013

49

Figure 3-11. Flex Interposer – D415, D435, D435i, D435f, D455 (Illustration)

Figure 3-12. Rigid Interposer – D415, D435, D435i, D435f, D455 (Illustration)

337029-013

50

Figure 3-13. Depth Module Receptacle and Plug Connector Pin Position – D415,
D435, D435i, D435f, D455

Table 3-37. Interposer Interconnect Signal Description – D415, D435, D435i, D435f,
D455
Position

ASIC Board/
Motherboard

Depth Module

1

RGB_RSTN_N

RGB_RSTN_N

2

GND

GND

3

RGB_XCL

RGB_XCLRGB Sensor Clock

4

RGB_MDP0

RGB_MDP0RGB Sensor MIPI Data Lane 0 differential pair positive

5

GND

GND

337029-013

Interconnect Description
RGB Sensor Reset
GroundGround51

ASIC Board/
Motherboard

Depth Module

RGB_MDN0

RGB_MDN0

RGB Sensor MIPI Data Lane 0 differential pairnegative

7

RGB_FSYNC

RGB_FSYNC

RGB Sensor Sync

8

GND

GND

9

RGB_STROBERGB_STROBE

10

RGB_MCPRGB_MCPRGB Sensor MIPI Clock differential pair positive

11

RGB_SDARGB_SDARGB Sensor I2C Bus Data

12

RGB_MCN

RGB_MCNRGB Sensor MIPI Clock differential pair negative

13

RGB_SCL

RGB_SCLRGB Sensor I2C Bus Clock

14

GND

GND

Ground

15

GND

GND

Ground16

MDP0_L

MDP0_L

Left Imager MIPI Data Lane 0 differential pair positive

17

VDD18V

VDD18V

1.8 V Power

MDN0_L

MDN0_L

Left Imager MIPI Data Lane 0 differential pairnegative

19

VDD18V

VDD18V

1.8 V Power

20

GND

GND

21

LED_PSY

LED_PSY

Privacy LED control signal

22

MCP_L

MCP_L

Left Imager MIPI Clock differential pair positive

23

DVSYNCDVSYNC

VSYNC

24

MCN_L

MCN_L

Left Imager MIPI Clock differential pair negative

25

NC

NC

No Connect

26

GND

GND

Ground27

XVCLK_LXVCLK_L

Clock to Left Imager

28

MDP1_L

MDP1_L

Left Imager MIPI Data Lane 1 differential pair positive

29

GND

GND

MDN1_L

MDN1_L

Left Imager MIPI Data Lane 1 differential pairnegative

31

ST_RST_N

ST_RST_N

Reset signal to Left and Right Imager

32

GND

GND

33

FF_RSTn

FF_RSTn

Laser Error

34

MDP0_R

MDP0_R

Right Imager MIPI Data Lane 0 differential pair
positive

35

GND

GND

36

MDN0_R

MDN0_R

Position
6

1830

337029-013

Interconnect Description

GroundRGB Sensor Strobe

GroundGroundGroundGroundRight Imager MIPI Data Lane 0 differential pairnegative52

Position

ASIC Board/
Motherboard

Depth Module

37

XVCLK_RXVCLK_R

38

GND

GND

39

I2C_SCL

I2C_SCLI2C Bus Clock

40

MCP_R

MCP_R

Right Imager MIPI Clock differential pair positive

41

I2C_SDAI2C_SDAI2C Bus Data

42

MCN_R

MCN_R

Right Imager MIPI Clock differential pair negative

43

LASER_PWM

LASER_PWM

44

GND

GND

45

LASER_PWRDN46

MDP1_R

MDP1_R

47

LASER_PWM1

LASER_PWM1

48

MDN1_R

MDN1_R

Right Imager MIPI Data Lane 1 differential pairnegative

49

FLAGB

FLAGB

IR Projector Fault Detect

50

GND

GND

Ground

51

GND

GND

Ground52

VDD33V

VDD33VInterconnect Description
Clock to Right Imager
GroundIR Projector Control Signal
GroundLASER_PWRDN IR Projector Power Down
Right Imager MIPI Data Lane 1 differential pair
positive
IR Projector Control Signal

3.3 V power

Figure 3-14. Depth Module Connector Orientation and Pin Position – D415, D435,
D435i, D435f, D455

Pin Position 1

Stereo Depth Module

Vision Processor D4 Card

Pin Position 50

P/N 20708-050E

Pin Position 50

P/N 20709-050E

Pin Position 1-

337029-013

53

Figure 3-15. Flex Interposer – D401 (Illustration)

Figure 3-16. Depth Module Receptacle and Plug Connector Pin Position – D401

51, 52 (VDD 3.3V)
GND

2

1

4

3

6

5

8

7

10

9

12

11

GND

14

13

MDP0_L

16

15

GND

MDN0_L18

17

VDD18V

GND

20

19

VDD18V

MCP_L

22

21

MCN_L

24

23

FSYNC

GND

26

25

FSTROBE

MDP1_L

28

27

XVCLK_L

MDN1_L

30

29

GND

GND

32

31

RST_N

MDP0_R

34

33

MDN0_R

36

35

GND

GND

38

37

XVCLK_R

MCP_R

40

39

I2C_SCL

MCN_R

42

41

I2C_SDA

GND

337029-013

GND

54

GND
MDP1_R
MDN1_R

44
46
48

43
45
47

GND

50

49

53, 54 (GND)
Table 3-38. Interposer Interconnect Signal Description - D401
Position

ASIC Board/
Motherboard

Depth Module

1
2

GND

GND

2
3

4

4
GND

GND

5

6

6

7

7

8

Interconnect Description

1

3

5

GND

GND

8

9

9

10

10

11

11

12

12

13

13

GroundGroundGround

14

GND

GND

14

Ground

15

GND

GND

15

GroundMDP0_L

MDP0_L

16

Left Imager MIPI Data Lane 0 differential
pair positive

17

VDD18V

VDD18V17

1.8 V Power18

MDN0_L

MDN0_L

18

Left Imager MIPI Data Lane 0 differential
pair negative19

VDD18V

VDD18V19

1.8 V Power

20

GND

GND

20

Ground

16

21
22
23
24
25

337029-013

Position

21
MCP_L

MCP_L

DVSYNCDVSYNC

MCN_L

MCN_L

FSTROBEFSTROBE

22

Left Imager MIPI Clock differential pair
positive

23

VSYNC

24

Left Imager MIPI Clock differential pairnegative

25

Depth Strobe signal

55

Position

ASIC Board/
Motherboard

Depth Module

Position

26

GND

GND

26

Ground27

XVCLK_LXVCLK_L

27

Clock to Left Imager

MDP1_L

MDP1_L

28

Left Imager MIPI Data Lane 1 differential
pair positive

GND

GND

29

GroundMDN1_L

MDN1_L

30

Left Imager MIPI Data Lane 1 differential
pair negative

31

ST_RST_N

ST_RST_N

31

Reset signal to Left and Right Imager

32

GND

GND

32

Ground

28
29
30

33

33

34

MDP0_R

MDP0_R

34

Right Imager MIPI Data Lane 0 differential
pair positive

35

GND

GND

35

Ground36

MDN0_R

MDN0_R36

Right Imager MIPI Data Lane 0 differential
pair negative37

XVCLK_RXVCLK_R

37

Clock to Right Imager

38

GND

GND

38

Ground39

I2C_SCL

I2C_SCL39

I2C Bus Clock

40

MCP_R

MCP_R

40

Right Imager MIPI Clock differential pair
positive

41

I2C_SDAI2C_SDA41

I2C Bus Data

42

MCN_R

MCN_R

42

Right Imager MIPI Clock differential pairnegative

43
44

43
GND

GND

45
46

48

44

Ground45
MDP1_R

MDP1_R

47

46

Right Imager MIPI Data Lane 1 differential
pair positive

47
MDN1_R

MDN1_R

49

337029-013

Interconnect Description

48

Right Imager MIPI Data Lane 1 differential
pair negative

49

50

GND

51

VDD33V52

VDD33V

53

GND

GND

50

GroundVDD33V52

3.3 V power

GND

51

Ground56

Figure 3-17. Depth Module Connector Orientation and Pin Position – D401

Table 3-39. Custom Flex Interposer Ordering Logistics
Vendor

COCOM CONSUMERELECTRONICS LTD.

337029-013

Sales Contact

Name: Janine Langdale
Email: Janine.Langdale@cc-e.co.uk
Office phone: +44 (0) 1444 461620
Mobile phone: +44 (0) 7905 692131

57

3.7.4External Sensor Sync Connector
The external sensor connector provides the interface for external sensors tosynchronize to depth output.
For D415 and D455, both the depth and RGB sensors can be synced by an
external trigger.
For D435, D435i, and D435f, only the depth sensor can be synced by an external
trigger.
For D401, the external sync mechanism is not exposed.

Table 3-40. External Sensor Connector Details
Parameter

Description

Number of Contacts

9

Product Name

9 Positions Header,
Shrouded Connector

Part Number

SM09B-SRSSTB(LF)(SN)

Manufacturer Website

www.jst-mfg.com

Diagram

Table 3-41. External Sensor Sync Connector Pin List
Pin

Function

Description

1

GPIO3

GVSYNC0

Not Defined

2

GPIO4

GVSYNC1

IR Projector Power Down signal

GVSYNC2

External IR Projector Fault Detect

GVSYNC3

External IR Projector

3

4

3.7.5

Signal

GPIO5

GPIO6

5

Z_VSYNC

VSYNC

Depth VSYNC

6LASER_PWM0

LASER PWM0

Laser control signal

7

LASER_PWM1

LASER PWM1

Laser control signal

8

VDD33V

Power

3.3 V

9

GND

GroundGroundUSB Peripheral Connector – Type-C – D415, D435,
D435i, D435f, D455
USB Type-C connector consists of 24 signal pins designed in a symmetrical way.
The connector z-height is as low as 3 mm and enables enhanced user experience

337029-013

58

by allowing the USB Type-C plug to be plugged into a receptacle either right side
up or upside down. Interoperability between USB Type-C and legacy USB ispossible through standard legacy cable assemblies defined in USB Type-C Cable
and Connector specification.
Recommend using a certified USB Type-C cable with locking connector for use
with Intel® RealSense™ Camera D400 Series products.
Figure 3-18. USB Type-C Receptacle Pin Map

Table 3-42. USB Peripheral Connector Pin List
Pin

337029-013

SignalFunction

Description

A1

GND

Power Delivery

GroundA2

TX1+

USB 3.1 Gen 1 DataFirst SuperSpeed TX Differential Pair Positive

A3

TX1-

USB 3.1 Gen 1 DataFirst SuperSpeed TX Differential Pair Negative

A4

VBUS

Power Delivery

5V

A5

CC1

Control

Configuration Channel 1

A6

D+USB2.0 Datake
USB 2.0 differential pair positive

A7

D-

USB2.0 Data

A8

SBU1

SidebandUSB 2.0 differential pair negativeorientation detection
Sideband Use Signal 1

A9

VBUS

Power Delivery

5V

A10

RX2-

USB 3.1 Gen 1 Data

Second SuperSpeed RX Differential Pair Negative

A11

RX2+

USB 3.1 Gen 1 Data

Second SuperSpeed RX Differential Pair Positive

A12

GND

Power Delivery

GroundB1

GND

Power Delivery

GroundB2

TX2+

USB 3.1 Gen 1 Data

Second SuperSpeed TX Differential Pair Positive

B3

TX2-

USB 3.1 Gen 1 Data

Second SuperSpeed TX Differential Pair Negative

B4

VBUS

Power Delivery

5V

B5

CC2

Control

Configuration Channel 2

B6

D+USB 2.0 Data

USB 2.0 differential pair positive

B7

D-

USB 2.0 Data

USB 2.0 differential pair negative

B8

SBU2

SidebandSideband Use Signal 2

B9

VBUS

Power Delivery

5V

B10

RX1-

USB 3.1 Gen 1.0 DataFirst SuperSpeed RX Differential Pair Negative

59

Pin

SignalFunction

Description

B11

RX1+

USB 3.1 Gen 1.0 DataFirst SuperSpeed RX Differential Pair Positive

B12

GND

Power Delivery

Ground

3.7.6

USB Peripheral Connector – Micro-B (D405)
USB Micro-B connector consists of 10 signal pins with a connector Z-height of
1.8mm.
Intel recommends using a certified USB Micro-B cable and connector for use with
the Intel® RealSense™ Camera D401/405 Series products.

Figure 3-19. USB3 Micro-B Receptacle Pin Map

Table 3-43. USB Peripheral Connector Pin List – D405

337029-013

Pin
NumberSignalName

Description

MatingSequence

1

VBUS

Power

Second2

D-

USB 2.0 differential pair

Last

60

3.7.7

3

D+

4

ID

OTG Identification

5

GND

Ground for power return

6
7

MicB_SSTX- SuperSpeed transmitter differential
pair
MicB_SSTX+8

GND_DRAIN Ground for SuperSpeed signal return Second9MicB_SSRX- SuperSpeed receiver differential pair Last

10

MicB_SSRX+

Shell

ShieldSecondLast

Connector metal shell

First

Color Image Signal Processor (ISP)
The color sensor data is sent to discrete Image Signal Processor (ISP) on the
Vision processor D4 Board for image adjustments, image scaling and processing
functions to help compensate for inherent inaccuracy in lens and sensor, toprovide optimal image quality. The processed color image is sent to the Vision
Processor D4.

Table 3-44. ISP Properties
Parameter

3.7.8

ISP Properties

ISP Part Number on Vision Processor D4 Board

RTS5845

1Mb Serial Flash for ISP

Winbond* W25X10CL or equivalentInterface To Vision Processor D4

MIPI CSI-2, 2X Lanes

Interface To RGB Sensor

MIPI CSI-2, 1X Lane

Vision Processor D4 Board Power Requirements
The Vision Processor D4 Board is powered through VBUS power of the USB
connector. The Vision Processor D4 Board in turn power sources the stereo depth
module.

Table 3-45. Vision Processor D4 Board Power Requirements
Parameter
VCC

Supply Voltage

ICC

Supply Current
Supply Voltage Ramp Rate

3.7.9

Min

Nom

Max

Unit

4.75

5.00

5.25

V

700

mA

5

ms

0.5

Vision Processor D4 Board Thermals
The Vision Processor D4 Board should be screw mounted onto a heat sink or aheat dissipating structure element using screw forks on Board. Thermal conductive

337029-013

61

tape (electrically non-conductive) should cover the entire back side area (noncomponent side) of the ASIC Board for thermal transfer onto heat sink or heatdissipating structure element.

3.7.10Vision Processor D4 Board Storage and Powered
Conditions

Table 3-46. Vision Processor D4 Board Storage and Powered Conditions
Condition

Description

Min

Max

Unit

Storage (Ambient), Not Powered

Temperature(Sustained,
Controlled)(1)

0

50

oC

Temperature(ShortExposure)(2)

-40

70

oC

Humidity

Temperature/ RH: 40oC / 90%

Temperature0

Case Temperature, Powered(3)(4)(5)oC

50

Notes:(1) Controlled conditions should be used for long term storage of product(2) Short exposure represents temporary max limits acceptable for transportation
conditions(3) Case temperature limits must be met for all temperatures when powered(4) Case temperature is specified for the overall Vision Processor D4 Board(5) Case temperature 0° minimum and lower temperatures is non-condensing

3.7.11Intel® RealSense™ Vision Processor D4 Board Product
Identifier and Material Code

Table 3-47. Vision Processor D4 Board Product Identifier and Material Code
Production

Product Identifier
Code-Manufacture
Configuration Code

Product
Material Code

IMU
Component

Vision Processor D4 Board(1)J32139-120

952019N/A

Vision Processor D4 Board V3(2)K94249-110

99A2NX

BMI085

Vision Processor D4 Board V4

M31706-100

99AGAR

N/A(3)

Notes:(1) The V1 ASIC (without IMU) is validated and supports all D400 depth modules

337029-013

62

(2) The V3 ASIC is designed for use with the D430 and D450 Modules. Full validation
has been done on this combination.
(3) The V4 ASIC is designed for use with the D401 Module. Full validation has been
done on this combination.

3.8

Intel® RealSense™ Depth Camera D400 Series

Figure 3-20. Intel® RealSenseTM Depth Camera D415

Figure 3-21. Intel® RealSense™ Depth Camera D435/D435i

Figure 3-22. Intel® RealSense™ Depth Camera D455

Figure 3-23. Intel® RealSense™ Depth Camera D405

337029-013

63

Table 3-48. Depth Camera SKU Properties
D400 series Depth
CamerasIntel®
RealSense™
Depth Camera
D415Intel® RealSense™
Depth Camera
D435/D435i/D435f

Intel® RealSense™
Depth Camera
D455

Intel® RealSense™
Depth Camera
D405

Depth moduleIntel® RealSense™
Depth module D415

Intel® RealSense™
Depth module D430

Intel® RealSense™
Depth module D450Intel® RealSense™
Depth module D401

Baseline

55mm

50mm

95mm

18mm

Left/Right Imagers TypeStandard

Wide

Wide

Wide

Depth FOV HD (16:9)(degrees)

H:65 / V:40 / D:72

H:87 / V:58 / D:95

H:87 / V:58 / D:95

H:84 / V:58 / D:92

Depth FOV VGA (4:3)(degrees)

H:50/ V:40 / D:61

H:75 / V:62 / D:89

H:75 / V:62 / D:89

N/A

IR Projector

Standard

Wide

Wide

N/A

IR Projector FOV

H:67 / V:41 / D:75

H:90 / V:63 / D:99

H:90 / V:63 / D:99

N/A

Color Sensor

OV2740

OV2740

OV9782

OV9782

Color Camera FOV

H:69 /V:42 /D:77

H:69 /V:42 /D:77

H:90 /V:65 /D:98

H:84 / V:58 / D:92

IMU

None

None/6DoF/None

6DoF

None

Notes:

337029-013

1.

H = Horizontal FOV, V = Vertical FOV, D = Diagonal FOV, X = Length, Y = Breadth, Z =Thickness2.

Depth FOV specified at 20 cm for D401 and at 2 m for other modules3.

Due to mechanical tolerances of +/- 5%, Max and Min FOV values can vary from lens tolens and module to module by ~ +/- 3 degrees

4.

D435f = D435 with 750nm near-infrared filter (CLAREX® NIR-75N) applied to coverglass, with holes over projector and RGB sensor openings. Filter transmits near-infrared
light and absorbs visible light. Filter’s thickness = 0.5 mm.

64Figure 3-24. Intel® RealSense™ Depth Camera D435f NIR Filter Optical Properties

Table 3-49. D435 and D435f Comparison
Items

D435

D435f

Ambient light
spectrum

Both visible and IR light

IR light only

Repetitive pattern

May cause false depth

False depth mitigated

Specular reflections

May cause image saturation

Saturation mitigated

Indoor operating
range

Long (unlimited)

L/R images

Available in all lighting
conditions

Availability limited by ambient
IR strength

Works in typical ambient
lighting conditions

May need additional IR light

Calibration(OEM, Dynamic, Self)

337029-013

Limited by IR projector power65

3.8.1

Depth Camera D400 Series Mechanical Dimensions

Table 3-50. Intel® RealSense™ Depth Camera D415 Mechanical Dimensions
Dimension

Min

Nominal

Max

Unit

Width

98.85

99

99.15

mm

Height

22.85

23

23.15

mm

Depth

19.85

20

20.15

mm

Weight

68.4

62

75.6

g

Flatness Tolerance

0

-

0.2

mm

Table 3-51. Intel® RealSense™ Depth Camera D435, D435i, D435f Mechanical
Dimensions
Dimension

Min

Nominal

Max

Unit

Width

89.85

90

90.15

mm

Height

24.85

25

25.15

mm

Depth

24.85

25

25.15

mm

Weight

68.4

75

75.6

g

Flatness Tolerance

0

-

0.15

mm

(1)

Note:
(1) D435f depth can be up to 25.8mm

Table 3-52. Intel® RealSense™ Depth Camera D455 Mechanical Dimensions
Dimension

Min

Nominal

Max

Unit

Width

123.5

124

124.5

mm

Height

28.5

29

29.5

mm

Depth

25.5

26

26.5

mm

Weight

114

116

118

g

Flatness Tolerance

0

-

0.2

mm

Table 3-53. Intel® RealSense™ Depth Camera D405 Mechanical Dimensions

337029-013

Dimension

Min

Nominal

Max

Unit

Width

41.85

42

42.15

mm

Height

41.85

42

42.15

mm

Depth

22.85

23

23.15

mm

Weight

58

60

62

g

66

Flatness Tolerance

-

0.15

-

mm

3.8.2

Depth Camera D400 Series Thermals

3.8.2.1

Depth Camera D400 Series Storage and Powered Conditions

Table 3-54. Depth Camera D400 Series Storage and Powered Conditions
Condition

Description

Min

Max

Unit

Storage (Ambient), Not
Powered(5)Temperature (Sustained,
Controlled)(1)

0

50

oC

Temperature (Short
Exposure)(2)

-40

70

oC

Humidity

Temperature/ RH: 40oC / 90%

Ambient, Powered(3)(4)(5)Temperature, Performance

0

35

oC

Backside Case
Temperature, Powered

Temperature, Performance

0

50

oC

Notes:(1) Controlled conditions should be used for long term storage of product(2) Short exposure represents temporary max limits acceptable for transportation
conditions(3) The camera ambient temperature when powered, 0 oC to 35 oC is the validated
range in which Intel® qualified the camera. This is a standard range in which
Intel® qualifies consumer products. The camera’s internal thermal solution was
designed to keep the internal components at or below their max powered
temperatures. As stated in Table 3-25, the projector temperature and the
projector’s operation below 60 oC is critical to the use of the projector for camera
operations (use of projector can be determined by application developer based onnecessity in usage model).
(4) Ambient means environment while the camera is attached to a tripod using thecamera’s tripod screw attachment and is not connected to any mechanical orthermal material(5) Although all Key Performance Indicators (KPIs) are verified before leaving Intel’sfactory, KPIs may be negatively impacted by extended exposure to excessive
temperatures and humidity

3.8.2.2

Depth Camera D400 Series Thermal Solution Guidance
The Intel® RealSense™ Depth Camera D400 Series camera thermal solution was
designed taking into account the necessary thermal and mechanical aspects that
go into producing a standalone peripheral camera. Those aspects include thetemperatures for all of the components associated with the module (projector,
vision processor, IMU and camera sensors) when powered.
The Intel® RealSense™ SDK 2.0 (https://github.com/IntelRealSense/librealsense)
provides temperature sensor readout based on Intel® RealSense™ camera

337029-013

67

capabilities. The readout should be used as a reference/guide, but is not to be
used as a replacement for thermal solutions that comply with the temperatures of
the camera. If monitoring the temperature of the camera is necessary due tothermal concern, it is recommended to monitor librealsense temperature readoutfrom the application level and act upon the data if within < 5 oC of the component
max temperatures.
To aid in development of thermal solution and heat dissipation, therecommendations below provide some guidance to system integrators.
Passive Cooling Recommendations:•

Mounting Bracket Material – Utilize mounting screws (2X M3 screws) andmaterial that is the same or similar in nature (equal or lower thermal
resistance or high conductivity) as the peripheral housing that the D400
Series depth cameras are made from. Material – Aluminum 6000 series.

•

Increased Mating Surface – Mounting bracket mating surface with D400
series depth camera can be increased by a factor of 2X. The larger themounting bracket mating surface area to the depth camera the better.
o•Reduction of mating surface imperfections, defects, roughness andgaps is recommended. Any increase in defects in the material canincrease the thermal contact resistance, reducing effectiveness ofheat dissipation of the thermal solution. Attachment options
should be comprised of epoxy compounds or thermal tape/paste.

Heat Sink – The addition of a heat sink can also improve heat dissipationfrom the D400 series depth camera. Use of a material such as Aluminum
6000 series or similar with equal or lower thermal resistance to the mating
surface is recommended.

Active Cooling Recommendations:
•

3.8.3

While heat pipes and liquid cooling solutions offer advantages, they also
increase the complexity of system integration substantially. The use of a
fan with direct air flow to the depth camera (back mounting surface 2X M3screws) is preferable.

Depth Camera D400 Series Product Identifier andMaterial Code

Table 3-55. Depth Camera D400 Series Product Identifier and Material Code337029-013

Production

Product Identifier
Code-Manufacture
Configuration Code

Product
Material Code

IMU
Component

Depth Camera D415

J72476-100

961443

N/A

Depth Camera D415 (Multi
Pack)

J72476-100

962304

N/A

Depth Camera D435

J72479-100

961448N/A

68

3.8.4

Depth Camera D435 (Multi
Pack)

J72479-100

962305

N/A

Depth Camera D435i

K38179-100

999AFR

BMI055Depth Camera D435i

K38179-110

999AFR

BMI085Depth Camera D435i (Multi
Pack)

K38179-100

999AXG

BMI055Depth Camera D435i (Multi
Pack)

K38179-110

999AXG

BMI085Depth Camera D435f

M31895-100

99ANHK

N/A

Depth Camera D435f (Multi
Pack)

M31895-100

99ANHL

N/A

Depth Camera D455

K83122-100

999WCT

BMI055Depth Camera D455

K83122-110

999WCT

BMI085Depth Camera D455 (Multi
Pack)

K83122-100

999WCR

BMI055Depth Camera D455 (Multi
Pack)

K83122-110

999WCR

BMI085Depth Camera D405

M31895-100

99ACXC

N/A

Camera Lens Cleaning Procedure
1. Do not use any chemicals or water on the camera lens
2. Remove dust and dirt as much as possible from the lens with a lens blower
brush
3. Wipe with a dry, clean micro-fiber cloth

337029-013

694Functional Specification

4.1

Vendor Identification (VID) and Device
Identification (DID)

Table 4-1. Vendor ID and Device ID Table
Depth Module/Depth Camera

4.2

Vendor ID

Device ID

Intel® RealSense™ Depth Module D410

8086

0x0AD2

Intel® RealSense™ Depth Module D415

8086

0x0AD3

Intel® RealSense™ Depth Camera D415

8086

0x0AD3

Intel® RealSense™ Depth Module D430

8086

0x0AD4

Intel® RealSense™ Depth Camera D435

8086

0x0B07

Intel® RealSense™ Depth Camera D435i

8086

0x0B3AIntel® RealSense™ Depth Module D450

8086

0x0B5CIntel® RealSense™ Depth Camera D455

8086

0x0B5CIntel® RealSense™ Depth Module D401

8086

0x0B5BIntel® RealSense™ Depth Camera D405

8086

0x0B5BIntel® RealSense™ Depth Camera D435f

8086

0x0B07

Vision Processor D4 Data Streams
The Intel® RealSense™ Vision Processor D4 depth imaging system provides highquality depth data to a host system. The depth data is generated via stereo vision
technology, which is optionally assisted by an infrared projector. The imaging
system has the ability to syncronize its depth data stream with its color data
stream.

Table 4-2. Image Formats (USB 3.1 Gen 1) – D410/D415/D430/D435/D435i/D435f
FormatZ [16 bits]

337029-013

Resolution

Frame Rate
(FPS)

1280 x 720

6, 15, 30

848 x 480

6, 15, 30, 60, 90

640 x 480

6, 15, 30, 60, 90

640 x 3606, 15, 30, 60, 90

Comment

Depth70FormatY8 [8 bits]

UYVY [16 bits]

YUY2 [16 bits]

Calibration [24 bits]

Intel® RealSense™
Self-Calibration

Resolution

Frame Rate
(FPS)

480 x 270

6, 15, 30, 60, 90

424 x 240

6, 15, 30, 60, 90

1280 x 720

6, 15, 30

848 x 480

6, 15, 30, 60, 90

640 x 480

6, 15, 30, 60, 90

Luminance

640 x 3606, 15, 30, 60, 90

Left and Right Imager

480 x 270

6, 15, 30, 60, 90

424 x 240

6, 15, 30, 60, 90

1280 x 720

6, 15, 30

848 x 480

6, 15, 30, 60, 90

640 x 480

6, 15, 30, 60, 90

640 x 3606, 15, 30, 60, 90

480 x 270

6, 15, 30, 60, 90

424 x 240

6, 15, 30, 60, 90

1920 x 1080

6, 15, 30

1280 x 720

6, 15, 30

960 x 540

6, 15, 30, 60

848 x 480

6, 15, 30, 60

640 x 480

6, 15, 30, 60

640 x 3606, 15, 30, 60

424 x 240

6, 15, 30, 60

320 x 240

6, 30, 60

320 x 180

6, 30, 60

1920x1080

15, 25

D410/D415

1280 x 800

15, 25

D430/D435/D435i/D435f

256 x 144

90

Intel® RealSense™ SelfCalibration and Tare format

Comment

Color Stream from Left Imager(D410 & D415 )Color Stream from RGB camera(Camera D415 &D435/D435i/D435f)(D400 Series)

Notes:

337029-013

1.

Depth and Color are mapped as separated interfaces. Each one of the interfaces
operates independently of the other interface (Virtual channel in MIPI and End Point in
USB).

2.

To ensure proper USB 3.1 device enumeration, connect the cable to the D400 camera
first, then insert it into the host system port

3.

For information regarding USB interoperability, refer to whitepaper “USB Interoperability
Testing for Intel® RealSense™ Cameras” - https://www.intelrealsense.com/usbinteroperability-testing-for-intel-realsense-cameras

71

Table 4-3. Image Formats (USB 3.1 Gen 1) – D450/D455
FormatResolution

Frame Rate (FPS)

1280 x 720

5, 15, 30

848 x 480

5, 15, 30, 60, 90

640 x 480

5, 15, 30, 60, 90

640 x 3605, 15, 30, 60, 90

480 x 270

5, 15, 30, 60, 90

424 x 240

5, 15, 30, 60, 90

1280 x 720

5, 15, 30

848 x 480

5, 15, 30, 60, 90

640 x 480

5, 15, 30, 60, 90

Luminance

640 x 3605, 15, 30, 60, 90

Left and Right Imager

480 x 270

5, 15, 30, 60, 90

424 x 240

5, 15, 30, 60, 90

1280 x 720

5, 15, 30

848 x 480

5, 15, 30, 60, 90

640 x 480

5, 15, 30, 60, 90

640 x 3605, 15, 30, 60, 90

480 x 270

5, 15, 30, 60, 90

424 x 240

5, 15, 30, 60, 90

1280 x 800

5, 15, 30

848 x 480

5, 15, 30, 60

640 x 480

5, 15, 30, 60

640 x 3605, 15, 30, 60, 90

480 x 270

5, 15, 30, 60, 90

424 x 240

5, 15, 30, 60, 90

Calibration IR
Imager Y12I
[24 bits]

1280 x 800

15, 25

Intel®
RealSense™
SelfCalibration

256 x 144

90

Z [16 bits]

Y8 [8 bits]

UYVY [16 bits]

YUY2 [16 bits]

Comment

Depth

Color Stream from Left
ImagerColor Stream from RGB
cameraCalibration uses 1280 x
720 at 15 or 30 FPSIntel® RealSense™ SelfCalibration and Tare
formatNotes:

337029-013

1.

Depth and Color are mapped as separated interfaces. Each one of the interfaces
operates independently of the other interface (Virtual channel in MIPI and End Point in
USB).

2.

To ensure proper USB 3.1 device enumeration, connect cable to D400 camera first, theninsert into host system port

72

3.

For information regarding USB interoperability, refer to whitepaper “USB Interoperability
Testing for Intel® RealSense™ Cameras” - https://www.intelrealsense.com/usb-

interoperability-testing-for-intel-realsense-cameras
Table 4-4. Image Formats (USB 3.1 Gen1) – D401/D405
Resolution

Frame Rate
(FPS)

1280 x 720

5, 15, 30

848 x 480

5, 15, 30, 60, 90

640 x 3605, 15, 30, 60, 90

480 x 270

5, 15, 30, 60, 90

424 x 240

5, 15, 30, 60, 90

1280 x 720

5, 15, 30

848 x 480

5, 15, 30, 60, 90

640 x 3605, 15, 30, 60, 90

480 x 270

5, 15, 30, 60, 90

424 x 240

5, 15, 30, 60, 90

1280 x 720

5, 15, 30

848 x 480

5, 15, 30, 60, 90

640 x 3605, 15, 30, 60, 90

480 x 270

5, 15, 30, 60, 90

424 x 240

5, 15, 30, 60, 90

1280 x 720

5, 15, 30

848 x 480

5, 15, 30, 60, 90

640 x 3605, 15, 30, 60, 90

480 x 270

5, 15, 30, 60, 90

424 x 240

5, 15, 30, 60, 90

1280 x 720

5, 15, 30

848 x 480

5, 15, 30, 60, 90

640 x 3605, 15, 30, 60, 90

480 x 270

5, 15, 30, 60, 90

424 x 240

5, 15, 30, 60, 90

Calibration L+R
imager Y12I [24 bits]

1288 x 808

15, 25

D401, D405

OC Calibration

256 x 144

90

On Chip and Tare calibration
format, all cameras/modules

FormatZ [16 bits]

Y8 [8 bits]

L8R8 [16 bits]

UYVY [16 bits]

YUY2 [16 bits]

Comment

Depth

Luminance Left or Right Imager

Luminance Left and Right
ImagerColor Stream from Left Imager

Color Stream from Left RGB via
ISP

Notes:

1. Depth and Color are mapped to the same UVC interface

337029-013

73

2.

To ensure proper USB 3.1 device enumeration, connect cable to D400 camera first, theninsert into host system port

3.

For information regarding USB interoperability, refer to whitepaper “USB Interoperability
Testing for Intel® RealSense™ Cameras” - https://www.intelrealsense.com/usbinteroperability-testing-for-intel-realsense-cameras

Table 4-5. Simultaneous Image Streams (USB 3.1 Gen 1) –D410/D415/D430/D435/D435i/D435f/D450/D455
Color
Depth

Imager(Left Imager)
D410

Z16

IMU
D435i/D455

D415/D435/D435i/

Comment

D435f/D450/D455
Gyro &
Accelerometer

Y8

Z16
Z16

Color
(RGB Camera)

Gyro &
Accelerometer

UYVY
Y8

Z16

YUY2

Gyro &
Accelerometer

YUY2

Gyro &
Accelerometer

Notes:
1.

RGB to depth hardware sync is only supported with the same frame rate for all streams

2.

For simultaneous Depth and RGB streaming, it is recommended to set color resolution
to same value (or higher) as depth resolution3.

USB 3.1 Gen 1 supports all resolution/frame rate combinations in a typical dedicatedUSB port configuration. When sharing a USB hub with other devices (e.g., additional
RealSense cameras), considerations regarding bandwidth requirements have to betaken into account.

4.

To ensure proper USB 3.1 device enumeration, connect the cable to the D400 camera
first, then insert it into the host system port

5.

Streaming of Depth, IR left and IR right concurrently is only supported for calibration ina dedicated format with rectified IR (24-bit), as seen in the section 4.2

6.

For information regarding USB interoperability, refer to whitepaper “USBInteroperability Testing for Intel® RealSense™ Cameras” https://www.intelrealsense.com/usb-interoperability-testing-for-intel-realsensecameras

Table 4-6. Simultaneous Image Streams (USB 3.1 Gen 1) – D401/D405
Color
Depth

Imager(Left
Imager)Comment

D401/D405
Z16

Y8

Z16

Y8

YUY2

Notes:

337029-013

74

1.

USB 3.1 Gen 1 supports all resolution/frame rate combinations in a typical dedicatedUSB port configuration. When sharing a USB hub with other devices (e.g., additional
RealSense cameras), considerations regarding bandwidth requirements must be taken
into account.

2.

To ensure proper USB 3.1 device enumeration, connect cable to D400 camera first, theninsert into host system port

3.

For information regarding USB interoperability, refer to whitepaper “USB Interoperability
Testing for Intel® RealSense™ Cameras” - https://www.intelrealsense.com/usbinteroperability-testing-for-intel-realsense-cameras

Table 4-7. Image Formats (USB 2.0) – D410/D415/D430/D435/D435i/D435f
FormatZ [16 bits]

Y8 [8 bits]

UYVY [16 bits]

YUY2 [16 bits]

Intel®
RealSense™ SelfCalibration

Resolution

Frame Rate

Comment

1280 x 720

6848 x 4806, 10

640 x 480

6, 15, 30

640 x 36030

480 x 270

6, 15, 30, 60

1280 x 720

6848 x 480

6, 10

Luminance Stream from

640 x 480

6, 15, 30

Left Imager

480 x 270

6, 15, 30, 60

1280 x 720

6640 x 480

6, 15, 30

480 x 270

6, 15, 30, 60

1280 x 720

6, 15

640 x 480

6, 15, 30424 x 240

6, 15, 30, 60

256 x 144

90

Depth

Color Stream from Left Imager(D410 & D415)
Color Stream from RGB camera(Camera D415 &D435/D435i/D435f)

Intel® RealSense™ SelfCalibration and Tare format

Note:
1.

Depth and Color are mapped as separated interfaces. Each one of the interfaces is
working independently of the other interface (Virtual channel in MIPI and End Point inUSB). Right infrared imager stream is supported for calibration purposes only.

Table 4-8. Image Formats (USB 2.0) – D450/D455
FormatZ [16 bits]

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Resolution

Frame Rate

1280 x 720

5848 x 4805, 10

640 x 480

5, 15, 30

640 x 360

30

Comment

Depth75

FormatY8 [8 bits]

UYVY [16 bits]

YUY2 [16 bits]

Intel®
RealSense™ SelfCalibration

Resolution

Frame Rate

Comment

480 x 270

5, 15, 30, 60

1280 x 720

5848 x 4805, 10

640 x 480

5, 15, 30

640 x 36030

480 x 270

5, 15, 30, 60

1280 x 720

5848 x 4805, 10

640 x 480

5, 15, 30

640 x 36030

480 x 270

5, 15, 30, 60

1280 x 800

151280 x 720

5, 10, 15

640 x 480

5, 15, 30424 x 240

5, 15, 30, 60

256 x 144

90

Intel® RealSense™ SelfCalibration and Tare format

Resolution

Frame Rate

Comment

1280 x 720

5848 x 4805, 10

640 x 480

5, 15, 30

640 x 36030

480 x 270

5, 15, 30, 60

1280 x 720

5848 x 4805, 10

640 x 480

5, 15, 30

640 x 36030

480 x 270

5, 15, 30, 60

1280 x 720

5848 x 4805, 10

640 x 480

5, 15, 30

640 x 36030

480 x 270

5, 15, 30, 60

Luminance Stream from
Left Imager

Color Stream from Left Imager

Color Stream from RGB camera

Table 4-9. Image Formats (USB 2.0) – D405
FormatZ [16 bits]

Y8 [8 bits]

UYVY [16 bits]

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Depth

Luminance Stream from
Left Imager

Color Stream from Left Imager

76Format

YUY2 [16 bits]

Intel®
RealSense™ SelfCalibration

Resolution

Frame Rate

1280 x 720

5, 10, 15

848 x 4805, 10

640 x 480

5, 15, 30

480 x 270

5, 15, 30424 x 240

5, 15, 30, 60

256 x 144

90

Comment

Color Stream from RGB + ISPIntel® RealSense™ SelfCalibration and Tare format

Table 4-10. Simultaneous Image Streams (USB 2.0)
Color
Depth

Imager(Left Imager)
D410

Z16

IMU
D435i/D455

Camera)Comment

D415/D435/D435i/D450/D455
Gyro &
Accelerometer

Y8

Z16
Z16

Color
(RGB

Gyro &
Accelerometer

UYVY
Y8

YUY2
YUY2

Z16

Gyro &
Accelerometer
Gyro &
Accelerometer

Notes:

1. RGB to depth hardware sync is only supported with the same frame rate for all streams

4.3

2.

For simultaneous Depth and RGB streaming, it is recommended to set the color
resolution to the same value (or higher) as the depth resolution

3.

USB 2.0 supports a subset of the possible resolution/frame rate combinations due to the
bandwidth requirements. Maximum simultaneous stream configurations are:a.

Depth: 640 x 480 @ 15FPS; Imager: 640 x 480 @ 15FPS; RGB Camera: 640 x
480 @ 30FPSb.

Depth: 480 x 270 @ 60FPS; Imager: 480 x 270 @ 60FPS; RGB Camera: 424 x
240 @ 30FPSc.

Depth: 848 x 480; Imager: 848x480; RGB Camera: 1280 x 720 @ 10FPS

Depth Field of View (FOV)The depth field of view is the shared overlap of the individual left and right imagers’
fields of view for which Vision Processor D4 provides depth data.
The FOV changes based on the resolution and aspect ratio. HD resolution’s aspectratio is 16:9, while VGA resolution’s aspect ratio is 4:3. Review “Table 3-11. Stereo
Depth Module SKU Properties” and “Table 3-48. Depth SKU Properties” to obtain the
FOV values associated with each camera SKU.

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77

4.4

Depth Field of View at Distance (Z)Depth Field of View (Depth FOV) at any distance (Z) can be calculated using thefollowing equation:

Depth FOV =

HFOV
HFOV
+ tan−1 {tan () − B/Z}
2
2

Definitions:
1.

Depth FOV = Depth Field of View

2.

HFOV = Horizontal Field of View of left imager on depth module3.

B = Baseline

4.

Z = Distance of scene from depth module

Figure 4-1. Depth Field of View to Depth Map illustration

Note:
1.

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As the scene’s distance from the depth module increases, the invalid depth banddecreases in the overall depth image. Overall depth image is invalid depth band plus
valid depth map.

78

4.5

Invalid Depth BandThe depth data generated by the D4 Vision Processor utilizes the left imager as thereference for the stereo matching algorithm, resulting in a non-overlapped region in
the camera’s field of view. This non-overlapped region (at the left edge of the frame)
contains no depth data. The invalid depth data band decreases as the distance fromthe camera/module to the scene increases.

Figure 4-2. Left Invalid Depth BandThe width of the invalid depth band can be calculated using the following equations:
In terms of horizontal FOV:DBR (Ratio of Invalid Depth Band to Total Horizontal Image)
HFOV= B/(2 ∗ Z ∗ tan())
2
Invalid Depth Band (in Pixels) = HRES ∗ DBR
In terms of focal length:

DBR (Ratio of Invalid Depth Band to Total Horizontal Image)= B ∗ F/(Z ∗ HRES)
Invalid Depth Band (in Pixels) = B ∗ F/Z
Definitions:337029-013

1.

B = Baseline2.

Z = Distance of scene from depth module3.

F = Focal length79

4.

HFOV = Horizontal Field of View of left imager on depth module

5.

HRES = Horizontal Resolution

Note that the equations above are valid for a base configuration of camera settings.
The default camera configuration in firmware may have settings optimized for depth
performance that impact the actual width of the invalid depth band, as compared tothe calculated width of the invalid depth band from the equations.

4.6

Minimum-Z Depth
The Minimum-Z Depth is the minimum distance from the depth camera/module to thescene for which the Vision Processor D4 provides depth data.

Table 4-11. Minimum-Z Depth
D410/

D430/D435/

D450/D455

D401/D405

D415

D435i/D435f

Min-Z (mm)Min-Z (mm)Min-Z (mm)Min-Z (mm)1280x720

450

280

520

100

848X480

310

195

350

70

640x480

310

175

320

-

640x360

240

150

260

55

480x270

180

120

200

45

424x240

160

105

180

40

Resolution

4.7

Depth Quality Specification
A set of standard metrics based on accuracy, data validity, and temporal stability areused to quantify the depth quality.
Although the modules are designed for a specific depth FOV, the measurements aretaken within 80% of this FOV, defined as the Region Of Interest (ROI). This ROI aligns
with the practical usage area and the module’s qualified optical parameters.

Table 4-12. Depth Quality Metric
MetricDefinition(1)Depth Accuracy

Measures the difference for valid pixels relative to a ground truth surface

Fill Rate

Percentage of pixels that have valid depth values

Depth Standard Deviation

Measures total spatial noise for each valid pixel relative to a best fit plane

Pixel Temporal Noise

Measures total temporal noise for each valid pixel relative to a best fit plane

Note:(1) Each measurement is taken from a predefined region of interest (ROI) which is within 80% of the depth
field of view (FOV)337029-013

80

Table 4-13. Depth Quality Metric Illustration
Depth Accuracy and Depth RMS Error

Fill Rate

Table 4-14. Depth Quality Specification
D410/D415
MetricD430/D435/

D450/D455(<= 2 Meters andD435i/D435f(<= 4 Meters and
80% ROI, HD
80% ROI, HD(<=
2
MetersandResolution)
Resolution)
80% ROI, HD
Resolution)

D401/D405(<= 0.5 Metersand 80% ROI,
HD Resolution)Z-accuracy (orAbsolute Error)

± 2%

± 2%

± 2%

± 2%

Fill rate

≥ 99%

≥ 99%

≥ 99%

≥ 99.5%RMS Error (orSpatial Noise)

≤ 2%

≤ 2%

≤ 2%

≤ 1%

Temporal Noise

≤ 1%

≤ 1%

≤ 1%

≤ 0.5%

Lifetime

4 years

5 years

5 years

5 years

Notes:

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1.

Key Performance Indicators (KPIs) are validated at the factory and reflect typicalconditions

2.

KPIs could be impacted by environmental factors over the camera/module’s lifetime

3.

Please follow best-known methods to obtain optimal camera/module performance over
its lifetime. Refer to white paper “Intel® RealSense™ Stereo Camera Best Known
Methods to Get Optimal Camera Performance over Lifetime” -81https://www.intelrealsense.com/best-known-methods-for-optimal-camera-performanceover-lifetime
4.

For Depth Quality metric definitions and test methodology, refer to white paper “Intel ®
RealSense™ Camera Depth Testing Methodology”

5.

Laser Power:

6.

4.8

a.

D410/D415/D430/D435/D435i/D435f – 150 mW, Exposure: Auto Exposureb.

D450/D455 – 360 mW, Exposure: Auto Exposure

Lifetime: operating in default settings within the supported temperature for up to 16
hours a day [66%]Depth Start Point (Ground Zero Reference)
The depth start point or the ground zero reference can be described as the starting
point or plane where depth = 0. For depth modules (D410 & D415), this point isreferenced from front of lens or from backside of module. For depth cameras (D415,
D435/D435i/D435f, D455), this point is referenced from front of the camera coverglass.

Figure 4-3. Depth Module Depth Start Point Reference

Depth Start
Depth (Z)
Point
Z’

Scene

Z”

Back of
ModuleFront of Lens

D410 (Depth Module Side View)

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82

D401 (Depth Module Side View)

Table 4-15. Depth Module Depth Start Point
Depth Module

Front of Lens (Z’)

Back of Module (Z”)

D410/D415-0.1 mm

4.3 mm

D430/D450-3.2 mm

7.5 mmD401-2.7 mm

7.8 mmNote:
1.

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If depth measurement reference is front of lens, then |Z’| should be added to measured
value to determine Ground Truth. If depth measurement reference is back of module,
then |Z”| should be subtracted to determine Ground Truth.

83

Figure 4-4. Depth Camera Depth Start Point Reference

Depth Start
Point

Depth (Z)

Scene

Z’

Front Cover
Glass

D435 (Depth Camera Side View)

D405 (Depth Camera Side View)

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84

Table 4-16. Depth Cameras Depth Start Point
Depth Camera

Camera Front Glass (Z’)

D415

-1.1 mm

D435/D435i-4.2 mm

D435f-4.7 mm

D455-4.55 mmD405

-3.7 mm

Note:
1.

4.8.1

If depth measurement reference is front cover glass, then |Z’| should be added tomeasured value to determine Ground Truth

Depth Origin X-Y Coordinates

The depth origin X-Y coordinates are the X-Y center of the left imager.
Figure 4-5. Depth Module X-Y Depth Origin Reference – D410, D415, D430, D450

Table 4-17. Depth Module X-Y Depth Origin Coordinates

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Depth Module

Left Alignment Hole1 to Left Imager Center

D410

8 mm

D415

8 mm

D430

8 mm

D450

12.2 mm85

Notes:1.

Left alignment hole on bottom stiffener of depth module

2.

Left alignment hole and left imager center is on depth module centerline

Figure 4-6. Depth Module X-Y Depth Origin Reference – D401

Table 4-18. Depth Module X-Y Depth Origin Coordinates – D401
Depth Module

Left Alignment Hole(1,2) to Left Imager Center(2)D401

X - 4.3 mm, Y - 8.5 mm

Notes:(1) Left alignment hole on bottom stiffener of depth module(2) Left alignment hole and left imager center is on depth module centerline

337029-013

86Figure 4-7. Depth Camera X-Y Depth Origin Reference – D415, D435/D435i/D435f,
D455

Table 4-19. Depth Camera X-Y Depth Origin Coordinates
Depth Camera

From Centerline of ¼-20(1) To Left Imager

D415

20 mm

D435/D435i/D435f

17.5 mm

D455

47.5 mmNote:(1) Center of tripod mounting hole (1/4-20)

337029-013

87Figure 4-8. Depth Camera X-Y Depth Origin Reference – D405

Table 4-20. Depth Camera X-Y Depth Origin Coordinates – D405
Depth Camera

From Centerline of ¼-20(1) To Left Imager

D405

9 mm

Note:
(1) Center of tripod mounting hole (1/4-20)

4.9

Depth Camera Functions
D4 exposes the following Depth image settings.

Table 4-21. Depth Camera Controls
Control

Description

Min

Max

Manual Exposure(1) (ms)Control sensor exposure period(400/410)

1

166

Manual Exposure(1) (ms)Control sensor exposure period (430)1

166

Manual Gain(1)Control sensor digital gain

16

248

Power to IR Projector

0

1

0

360

(Gain 1.0 = 16)
Laser Power (On/Off)(On = 1)
Manual Laser Power (mW) Laser Power setting (30 mW steps)

337029-013

88

ControlAuto Exposure Mode
(Enable = 1)

Auto Exposure ROI

Description

Min

Max

Auto Exposure Mode. When Auto
Exposure is enabled, Exposure andGain are set based on the environment
condition.

0

1

Perform Auto Exposure on a selected
ROI

T-0

T-719

L-0

L-1279PresetSet Controls parameters based on
Camera Usage

Meta Data Control

Enable/Disable Metadata

B-1

B-720

R-1

R-1280

0

1

Min

Max

Note:
(1) Not supported in Auto Exposure Mode
Definitions:•

4.10

T = Top, L = Left, B = Bottom, R = Right

Color Camera Functions

Table 4-22. RGB Exposed Controls
Control

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Description

Auto-Exposure Mode

Automatically sets the exposure
time and gain for the frame

0x1

0x8

Auto Exposure ROI

Perform Auto Exposure on aselected ROI

T-0

T-1079L-0

L-1919B-1

B-1080

R-1

R-1920Manual Exposure Time

Sets the absolute exposure time
when auto-exposure is disabled

1

10000

Brightness

Sets the amount of brightness
applied when auto-exposure isenabled-64

64

Contrast

Sets the amount of contrast basedon the brightness of the scene

0

100

Gain

Sets the amount of gain applied to
the frame if auto-exposure isdisabled

0

128

Hue

Sets the amount of hue adjustment
applied to the frame

-180

180

Saturation

Sets the amount of saturation
adjustment applied to the frame

0

100

89

ControlDescription

Min

Max

Sharpness

Sets the amount of sharpening
adjustment applied to the frame

0

100

Gamma

Sets amount of gamma correction
applied to the frame

100

500

White Balance
Temperature Control

Sets the white balance when AWB is
disabled

2800

6500

White Balance
Temperature Auto
(AWB)

Enables or disables the AWB
algorithm

01Power Line Frequency

Specified based on the local powerline frequency for flicker avoidance03Backlight
Compensation

Sets a weighting amount based onbrightness to the frame

0

1

Low Light CompLow Light Compensation

0

1

Definitions:

•

4.11

T = Top, L = Left, B = Bottom, R = RightIMU Specifications

Table 4-23. IMU Specifications – BMI055
CameraParameter

Properties

Intel® RealSense™ Depth Camera
D435i, Intel® RealSense™ Depth
Camera D455

Degrees of Freedom

6

Acceleration Range±4gIntel® RealSense™ Depth ModuleD430+Intel® RealSense™ Vision
Processor D4 Board V2(3)Accelerometer Sample Rate(1)62.5, 250 (Hz)Gyroscope Range± 1000 deg/sIntel® RealSense™ Depth Module
D450+Intel® RealSense™ Vision
Processor D4 Board V3

Gyroscope Sample Rate

(2)

Sample Timestamp Accuracy

200, 400 (Hz)50 µsec

Notes:(1) The sample rate may differ from the absolute specified sample rate by ± 5%. It isadvisable to rely on the sample timestamp.
(2) The sample rate may differ from the absolute specified sample rate by ± 0.3%
(3) Intel® RealSense™ Depth Module D430 + Intel® RealSense™ Vision Processor D4
Board V2 and V3 with the BMI055 IMU are no longer available. The BMI085 IMU
replaced the BMI055. See PCN #118035 – 00 and Table 4-24 below.

Table 4-24. IMU Specifications – BMI085
CameraParameter
Degrees of Freedom

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Properties
6

90

CameraParameter

Properties

Intel® RealSense™ Depth Camera
D435i, Intel® RealSense™ Depth
Camera D455

Acceleration Range

Intel® RealSense™ Depth Module
D450+Intel® RealSense™ Vision
Processor D4 Board V3

Gyroscope Range±1000 deg/s

Gyroscope Sample Rate(2)200, 400 (Hz)

Accelerometer Sample Rate

±4 g
(1)

Sample Timestamp Accuracy

100, 200 (Hz)50 µsec

Notes:(1) The sample rate may differ from the absolute specified sample rate by ± 5%. It isadvisable to rely on the sample timestamp.
(2) The sample rate may differ from the absolute specified sample rate by ± 0.3%

337029-013

915

Firmware
The firmware contains the Vision Processor D4’s operating instructions. Upon bootup,
Vision Processor D4 loads the firmware and programs the components’ registers. If
the Vision Processor D4 is configured for update or recovery, the unlocked R/W regionof the firmware can be changed.

5.1

UpdateDuring a firmware update, the firmware utility will issue a device firmware update
command to the Vision Processor D4. The Vision Processor D4 will then reset into
firmware update mode. The firmware utility uses a single binary file to maintain thefirmware image. The firmware utility compares the firmware version installed on thecamera to the firmware version file to be updated. Based on the comparison, thefirmware utility will downgrade, upgrade, or skip if the versions match.

5.1.1

Update Limits
The firmware update engine does not allow infinite update cycles between older andcurrent versions of firmware. The engine will establish a baseline version of firmware
based on the latest firmware version installed. The engine will allow a return to aprevious version or baseline version of firmware up to 20 times. After the 20th
update, the engine will only allow an update to a firmware revision higher than thebaseline version.

5.2

RecoveryA read-only boot sector is built into firmware which enables basic operation regardlessof the integrity of the operating instructions region. This ensures that the imaging
system can still function if the update fails or is corrupted. When firmware recovery is
required, the firmware utility will communicate with the recovery driver to set the DFU
pin low and reset the imaging system to recovery mode.
Firmware Recovery can also be externally triggered via a controllable interrupt
connected to the Vision Processor D4 DFU (Device Firmware Update) pin.
The firmware recovery sequence will be triggered by the firmware client utility. Thisclient utility will communicate through ACPI _DSM to trigger the controllable interrupt(GPIO) at the appropriate times. The firmware recovery requires an ACPI _DSM
interface to control the interrupt GPIO in configuring to firmware recovery state. The
ACPI_DSM methods and BIOS use the Write to GPIO functions to set the controllable
interrupt.

337029-013

92

6
6.1

SoftwareIntel® RealSense™ Software Development Kit 2.0
Intel® RealSense™ SDK 2.0 is a cross-platform library for working with Intel®
RealSense™ D400 Series cameras. It is open source and available on
https://github.com/IntelRealSense/librealsense
The SDK includes:

337029-013•

Intel® RealSense™ Viewer - This application can be used view, record, andplay back depth streams, set camera configurations, and adjust other controls.

•

Depth Quality Tool - This application can be used to test depth quality,
including: distance to plane accuracy, Z accuracy, standard deviation of the Z
accuracy and fill rate.

•

Debug Tools - These command line tools gather data and generate logs toassist in debug of the camera.

•

Code Examples - Examples to demonstrate the use of SDK and to enable
inclusion of D400 Series camera code snippets into applications.

•

Wrappers -Software wrappers supporting common programming languages
and environments such as ROS, Python, MATLAB, node.js, LabVIEW, OpenCV,
PCL, .NET and more.

93

7

System Integration
The small size of the stereo depth module and the independent placement of Vision
Processor D4 provides system integrators flexibility to design into a wide range of
products. Because the camera uses stereo vision technology, it is crucial that thestereo depth module does not flex throughout its service life. This creates uniquemechanical and thermal implementation guidance. This section explains how tocorrectly integrate D4 depth camera into a system.

7.1

System Level Block Diagram

Figure 7-1. System Block Diagram – D415, D435, D435i, D455

337029-013

94Figure 7-2. System Block Diagram – D405

Stereo Depth Module

EEPROM

Left Imager

MIPI

Right Imager

MIPI

EEPROM

ISP
Vision processor
D4
D4 (ASIC) Board
USB 2.0/USB 3.1

7.2

System Level Block Diagram
There are two options to integrate Vision Processor D4 into a system: integration of
the Vision Processor D4 Board or by placing the Vision Processor D4 and support
components directly on the host processor motherboard. The Vision Processor D4
Board simplifies system design and integration of the D4 depth camera system,
whereas integrating the Vision Processor D4 onto the motherboard allows for a space
optimized implementation.

7.2.1

Vision Processor D4 Board
The Vision Processor D4 Board has a standard USB Type-C connector and requires anappropriate USB Type-C cable to connect to a standard USB 2.0/USB 3.1 Gen 1
external port.

337029-013

95

Figure 7-3. Intel® RealSense™ Vision Processor D4 Board – V1, V3

USB3 Type-C
Connector
Figure 7-4. Intel® RealSense™ Vision Processor D4 Board – V4

7.2.2

Vision Processor D4 on Motherboard
In the Vision Processor D4 on Motherboard option, Vision Processor D4 and support
components are directly placed on the host processor motherboard. The depth module
receptacle is on the host processor motherboard for connection to the stereo depth
module.

337029-013

96Figure 7-5. Vision Processor D4 on Motherboard (Illustration)

Stereo Depth Module

Flex Interposer
Host Processor SOC
Motherboard

D4

7.2.2.1

Firmware Update
The SPI flash chip assembled onto the motherboard requires a bootable firmware
image for Vision Processor D4 to boot or to run the firmware update utility provided byIntel.
There are two implementation options:
1. Pre-program SPI flash chip with firmware before assembly on to motherboard
or replace corrupt image with a good image SPI flash chip. The blank SPI flash
chip can pre-programmed using a compatible adapter (i.e., PA8QFN8D) andsupporting flash programmer.
2. A header or test points is connected in parallel to the SPI flash chip, thenprogrammed directly with an SPI flash programmer. Vision Processor D4 SPI
interface is put in high Z state by strapping EPGPIO4 pin to Ground when
programmed directly with an SPI flash programmer.

7.3

D4 Camera System Power Delivery
D4 camera system MUST keep stereo depth module and the Vision Processor D4 on
the same power rails. The stereo depth module holds a safety region in EEPROM thatis configured by the firmware’s protected region code. Keeping all components on thesame rail prevents malicious software reset of the stereo depth module withoutcausing a reset to the ASIC. Through this protection we ensure that all the safety logic
is kept locked as long as the device is active. Ensure that power delivery
implementation recommendations in Chapter 12 are followed in the design of D4
camera system.

337029-013

97Figure 7-6. D4 Camera System Power Scheme

3.3V

3.3V

1.8V

1.8V

VBUS0 V 330

StereoDepthConnector*AVDD
VDDTS VDDPST

VisionProcessor
D4

VDDPLL

0.9V

VP

VPTX0 DVDD
VDD
PMU_EN

FET

VDDPG
3.3V

ISP
1.8V

7.4

Thermals
The system thermal design must ensure that the component case temperatures are
not exceeded. Thermal models for Vision Processor D4 Board and Depth Modules areavailable to conduct a thermal evaluation and validate the system thermal design.
A few notes for the power and TDP tables below:
1. Max Operating Mode at max resolution of the Depth and RGB imagers at 30
FPS
2. IR projector TDP is lower than power due to a lower percentage of energy
dissipated as photonic emissions as opposed to heat
3. Voltage Regulator power is included as part of the individual component power

Table 7-1. Vision Processor D4 Board V1/V2/V3 – Component Power and TDP at Max
Operating Mode(1)Component

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Power

TDP

Unit

Vision Processor D4

618

618

mW

Color Camera ISP

196.83196.83mW

Voltage Regulators/Other

491.64491.64mW

All Components

1306.471306.47

mW

98

Table 7-2. Vision Processor D4 Board V4 – Component Power and TDP at Max Operating
Mode(1)
Component

Power

TDP

Unit

Vision Processor D4

878

878

mW

ISP

165

165

mW

Voltage Regulators/Other

187

187

mW

All Components

1230

1230

mW

Table 7-3. Stereo Depth Module (D410/D415) – Component Power and TDP at Max
Operating Mode(1)Component
Left Imager

Power

TDP

Unit

118.5

118.5

mW

Right Imager

118.5

118.5

mW

RGB Imager

(1)

118.5

118.5

mW

(2)

IR Projector

1296

936

mW

EEPROM + Thermal Sensor

4

4

mW

All Components

1655.51295.5mW

Notes:(1) Only applies to D415
(2) Only applies to D410 and D415

Table 7-4. Stereo Depth Module (D430) – Component Power and TDP at Max Operating
Mode(1)
Component

Power

TDP

Unit

Left Imager

177

177

mW

Right Imager

177

177

mW

IR Projector

1620

1260

mW

EEPROM + Thermal Sensor

4

4

mW

All Components

1978

1618

mW

Table 7-5. Stereo Depth Module (D450) – Component Power and TDP at Max Operating
Mode(1)
Component

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Power

TDP

Unit

Left Imager

177

177

mW

Right Imager

177

177

mW

RGB Imager

177

177

mW

99

IR Projector

1620

1260

mW

EEPROM + Thermal Sensor

4

4

mW

All Components

2335

1975

mW

Table 7-6. Stereo Depth Module (D401) – Component Power and TDP at Max Operating
Mode(1)
Component

Power

TDP

Unit

Left Imager(2)

124

124

mW

Right Imager

124

124

mW

EEPROM + Thermal Sensor

4

4

mW

Voltage Regulators

78

78

mW

All Components

330

330

mW

(2)

Note:
(2)

Max. Operating Mode = Depth Resolution 848 x 480 @ 90 FPS, Color Resolution 848 x
480 @ 90 FPS

Table 7-7. Stereo Depth Camera (D415) – Component Power and TDP at Max Operating
Mode(1)
Component

Power

TDP

Unit

Left Imager

118.5

118.5

mW

Right Imager

118.5

118.5

mW

RGB Imager

118.5

118.5

mW

IR Projector

1296

936

mW

EEPROM + Thermal Sensor

4

4

mW

Vision Processor D4 Board

1306.471306.47mW

All Components

2961.972601.97

mW

Table 7-8. Stereo Depth Camera (D435) – Component Power and TDP at Max Operating
Mode(1)
Component

337029-013

Power

TDP

Unit

Left Imager

177

177

mW

Right Imager

177

177

mW

RGB Imager

118.5

118.5

mW

IR Projector

1620

1260

mW

EEPROM + Thermal Sensor

4

4

mW

Vision Processor D4 Board

1306.471306.47mW

All Components

3402.973042.97

mW

100

Table 7-9. Stereo Depth Camera (D455) – Component Power and TDP at Max Operating
Mode(1)
Component

Power

TDP

Unit

Left Imager

177

177

mW

Right Imager

177

177

mW

RGB Imager

177

177

mW

IR Projector

1620

1260

mW

EEPROM + Thermal Sensor

4

4

mW

Vision Processor D4 Board

1306.471306.47mW

All Components

3461.47

3101.47mW

Note:(1) Max. Operating Mode = Depth Resolution 1280 x 720 @ 30 FPS, Color Resolution - 1920
x 1080p @ 30FPS

Table 7-10. Stereo Depth Camera (D405) – Component Power and TDP at Max
Operating Mode(1)Component

Power

TDP

Unit

Left Imager(2)

124

124

mW

Right Imager(2)

124

124

mW

EEPROM + Thermal Sensor

4

4

mW

Vision Processor D4 Board

1230

1230

mW

All Components

1482

1482

mW

Note:
(1) Max. Operating Mode = Depth Resolution 848 x 480 @ 90 FPS, Color Resolution 848 x
480 @ 90 FPS

Table 7-11. Vision Processor D4 Board Components – Case Temperature Limits (Still
Air)
Component

Min

Max(1)

Unit

Vision Processor D4

0

85

◦C

Color Camera ISP

0

70

◦C

For the Depth Modules, case temperature is specified for the overall depth module andthe thermocouple test location is any point on bottom metal stiffener

337029-013

101

Figure 7-7. Bottom Stiffener Depth Module D410/D415

Figure 7-8. Bottom Stiffener Depth Module D430

Figure 7-9. Bottom Stiffener Depth Module D450

Figure 7-10. Bottom Stiffener Depth Module D401

7.5

Stereo Depth Module Flex
It is critical that the stereo depth module does not experience flex during system
integration or during use after integration. Micron level flexing of the module canrender the calibration incorrect and will result in poor performance or nonfunctional
depth data. It is important for system designers to isolate the module from any
chassis flex the system may encounter. While the module has a reinforcement

337029-013

102housing, the housing is not intended to counter loads from chassis flex. The primaryfunction of the housing is to prevent loss of calibration from handling and operating
environments.
It is possible for the module to recover depth performance after experiencing
permanent deformation. However, the module’s ability to recover is dependent on theamount of deformation experienced.
It is required, due to the high probability that some flex will be experienced by themodule during system integration, to perform an OEM calibration procedure after thestereo depth module is fully integrated into its final housing/location.

7.6

Stereo Depth Module Mounting Guidance
There are a few mounting options depending on the SKU. The sections below describe
the various options.

7.6.1

Screw Mounting/End Mounting
This section applies to the following SKUs: D410, D430 and D450.
The stereo depth module incorporates a screw hole and a screw fork for module
mounting. The stereo depth module should be mounted on a large heat sink or a heatdissipating structure element using a M1.6 screw at the screw hole and fork. The
recommended torque for both screws is 1.6Kgf*cm. Thermal interface material should
be used on the backside region of the IR projector and the stereo imagers, between
camera module and heat sink or heat dissipating structure being used for thermaltransfer.
Note: Thermal double-sided adhesive is recommended.

Figure 7-11. Stereo Depth Module Screw Mounting/End Mounting – D410

Screw Fork

337029-013

Screw Hole103

Figure 7-12. Stereo Depth Module Screw Mounting/End Mounting – D430

Note:
1.

7.6.2

For other SKUs, please refer to 10 Mechanical Drawings”.

Bracket Mounting/Mid-Module Mounting
This section applies to all the D400 SKUs, including D415.
The Stereo Depth module should be mounted on large heat sink or a heat dissipating
structure element using the bracket placed at the center of the module. The bracket issecured to the heat sink or structure element using screws. Thermal interface material
should be used on the backside region of the IR projector and the two stereo imagers,
between the camera module and the heat sink or heat dissipating structure being used
for thermal transfer. The camera module should have a minimum of 0.2 mm clearance
from all sides except for the area around the bracket. It is not necessary to insert
screws at the screw hole and screw fork when using a mounting bracket.
Note:
1.

337029-013

For larger modules, such as Intel® RealSense™ Depth Module D450, if amounting bracket is used without the screw hole and fork method, it isrecommended to use a large bracket

104Figure 7-13. Stereo Depth Module Bracket example for D415

Note:
1.

Intel does not sell these brackets; they are only used inside the Intel RealSense
cameras.

The figure below demonstrates how the D415 module is mounted inside the D415
camera using a bracket.
Figure 7-14. Stereo Depth Module Bracket Mount – D415

337029-013

105Figure 7-15. Stereo Depth Module Mid-Mounting – D401

The Stereo Depth module should be mounted on a large heat sink or heat dissipating
structure element using a structurally robust plastic bracket placed at the center ofmodule. The bracket will provide surface pressure on the top face of the module. The
bracket is secured to the heat sink or structure element using four M1.6 screws withrecommended torque of 1.6 Kgf*cm and double-sided tape in the center to preventside displacement and to ensure permanent anchoring to the module before adding
the four M1.6 screws. Thermal interface material should be used on heat sink or heatdissipating structure element, corresponding with the position of the two stereo
imagers. The camera module should have a minimum of 0.2 mm clearance from all
sides except for the area around the bracket. The module is precisely located andplaced onto the heat sink by using 2 locating features: one precision pin and one
locating slot-pin.

7.6.3

Stereo Depth Module Air gap
A minimum air gap of 0.3 mm is recommended between the tallest components on thestereo depth module to the cover window

337029-013

106Figure 7-16. Stereo Depth Module Air Gap

7.7

Thermal Interface Material
Thermal interface material, specifically thermal paste/grease is recommended to beinserted between the stereo depth module and the heat dissipating structure (heatsink) to improve the thermal coupling between these two components. A thermal
paste with thermal conductivity in the 3 - 4 W/mK range is recommended. This paste
must be applied in a thin layer on the back side of the IR projector and also under theleft and right imagers, filling up the air gap under the imagers.

7.8

Heat Sink
The heat sink or heat dissipating structure element used to mount the stereo depth
module and ASIC Board should be a minimum of 2 – 3 mm in thickness. It isadvisable to extend the heat sink by a few mm beyond the edges of the stereo depth
module. It is also recommended to have thermal fins on the back side of the heatdissipating structure. In applications where weight is a concern, high thermal
conductivity graphite tape can be attached to the back side of the heat sink. Thisgraphite tape must be at least as big as the metal heat sink and extended out beyond
the metal as much as possible for optimal cooling. Heat sink metal must be a highconductivity aluminum alloy or copper.
In cases where the module is expected to operate at high ambient temperatures,
additional airflow may be required to ensure temperature limits are not exceeded.
These are guidelines for thermal integration of the D4 camera in the system. However
actual testing or system level thermal modeling is recommended before finalizing thesolution.

7.9

Cover Design and Material Guidance
The stereo depth module components must be covered to minimize dust andhumidity. The transparent cover material stack-up used must provide acceptabletransmission based on the component wavelengths. Anti-reflective coatings can help
increase the transmission of the cover material. Cover material that reduces lighttransmission can result in poor depth performance and will decrease the working
range of the camera. Nominally flat, non-distorting and low scattering cover material
should be used.

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107

Table 7-12. Component Transmission
Component

Wavelength

Unit

®

Left and Right Imager (IntelRealSense™ D410/D430/D450)

400 to 865 (Visible and Infrared) @ 98% transmission
rate or higher at all viewing and transmitting angles

nm

Left and Right Imager (Intel®
RealSense™ D401)

400 to 900 (Visible and Infrared) @ 95% transmission
rate or higher at all viewing and transmitting angles

nm

IR Projector

850nm ± 15 nm @ 98% transmission rate or higher at
all viewing and transmitting angles

nm

Notes:
1.

Higher transmissions @ 98% transmission rate or higher is recommended and not arequirement

2.

Intel RealSense Camera 400 Series provides control over laser power and sensor
exposure. Minor loss of transmission due to cover material transmissivity might becompensated by increasing exposure when less light is able to reach the sensors and byincreasing laser power for IR projector pattern projection loss.

3.

Uncoated clear acrylic (plexiglass) plastic cover is an example for cover material

4.

Anti-reflective coatings can help increase the transmission of cover material

If different cover material is used in front of the cameras and the IR projector to
maximize transmission based on component wavelengths, cover design considerations
should ensure that the FOV of the cameras and FOP of the IR projector are notimpacted.

7.10

Gaskets
Gaskets are recommended for providing optical isolation and dust protection.
However, gaskets can impede FOV and place unwanted stress on the module or theindividual sensor lens holders.
Gasket static force can deform the cosmetic baffle/lens holder resulting in poor image
quality and permanent damage to the camera. Gaskets placed on the module stiffener
can transfer chassis flex into the camera module causing loss of depth data. Gasket
thickness has a large effect on the static force applied to the module surface. The
thinner the seal, the greater the static force applied. Once the gasket is compressed,
the static force will increase exponentially.

337029-013

108Figure 7-17. Illustration of Gasket Placement and Cover Material

337029-013

1097.10.1

Optical Isolation
It is recommended to isolate the left/right imagers and IR projector from each otherto prevent reflections off the cover material. Not properly isolating the cameras canresult in leakage light as shown in Figure 7-18. Example of Light Leakage Effects
To prevent light leakage, it is recommended to use a gasket material in between the
cover holes and the module. The gasket material needs to be compliant so that it does
not transmit chassis flex forces to the module.

Figure 7-18. Example of Light Leakage Effects

7.10.2

Dust Protection
Dust particles can accumulate over the camera lenses which can be visuallyunappealing and degrade image quality.

7.11

Firmware Recovery
To support firmware recovery, a 3.3 V controllable interrupt must be connected to the
Vision Processor D4 DFU (Device Firmware Update) pin .
The ability to recovery the image system if the firmware becomes corrupted requires
the D4 reset and DFU pins driven high for 160 ms. The DFU pin should remain highwhen D4 is out of reset for D4 to boot in DFU mode. The 160 ms ensures that the DFU
pin is held high throughout the reset sequence.

337029-013

110Figure 7-19. Firmware Recovery Sequence
Sequence

Timing Diagram

FirmwareRecoveryReset (PRSTN Pin)DFU Pin

7.12

Calibration Support
It is required to have an accessible USB port to access the host system. The accessible
USB port would allow for reliable streaming of images to an external PC, to determine
the calibration parameters and to write back these parameters via the host system.
The USB port should be able to be configured in a mode where it can access the host.
The access to USB port is required at manufacturing and is not intended to beavailable on the shipped product or accessible by the end user.

7.13

Multi-Camera Hardware Sync
Intel® RealSense™ D400 Series supports a hardware sync signal for multi-camera
configuration. For multiple cameras to be hardware synchronized so as to capture data
at identical times and frame rates, pins 5 (SYNC) and pins 9 (Ground) on the externalsensor sync connector will need to be connected. The external sensor sync connector
is located on the Vision Processor D4 V1 and V3 board and is accessible on the Depth
Cameras.
D405 does not support the hardware sync signal for multi-camera configuration.

Figure 7-20. External Sensor Sync Connector Location on D4 Vision Processor V1 andV3 Board

External Sensor
Sync Connector

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111

Figure 7-21. External Sensor Sync Connector Location on Depth Camera
D435/D435i/D455

External Sensor Sync Connector
For additional details on how to implement the multi-camera hardware sync feature,please refer to multi-camera white paper at https://realsense.intel.com/intelrealsense-downloads/#whitepaper.

7.14

Handling Conditions

Table 7-13. Electrostatic Discharge Caution
To provide a consistent ESD protection level during D4 systemassembly and rework, it is recommended that the JEDECJESD625-A requirements standard be incorporated into the ESD
environment controls.

§§

337029-013

112

8

Platform Design Guidelines
The Platform Design Guidelines have been developed to enable maximum flexibility forboard designers while reducing the risk of board related issues. Design
recommendations are based on Intel's simulations and are strongly recommended.

8.1

Vision Processor D4 on Motherboard
This Design Guidelines provide Vision Processor D4 on motherboard implementation
recommendations for the Kaby Lake U/Y (7th Generation Intel® Core™ Processors)
and Cherry Trail T4 (Intel® Atom™ Z8000 Processor Series) platforms with 8/10 layer
Type 4 PCB.
Supported platform topologies are:
1.Vision Processor D4 with USB Host Interface
2.Vision Processor D4 with MIPI Host Interface
3.Vision Processor D4 on Board for USB Integrated Peripheral

Figure 8-1. Vision Processor D4 with USB Host Interface
MOTHERBOARD

D4 Vision
Processor(2 sets of X2 MIPI)(SL/MS)

Connector

USB 3.1 Gen1

Connector

Host SOC

DEPTH MODULE

Flex PCB(2 sets of X2 MIPI)

Figure 8-2. Vision Processor D4 with MIPI Host Interface
MOTHERBOARD

D4 Vision
Processor(2 sets of X2 MIPI)(SL/MS)

Connector

X4 MIPI(SL/MS)

Connector

Host SOC

DEPTH MODULE

Flex PCB(2 sets of X2 MIPI)

337029-013

113

Figure 8-3. Vision Processor D4 on Board for USB Integrated Peripheral
DEPTH MODULE

D4 Board

MOTHERBOARD

Flex PCB(2 sets of X2 MIPI)

D4 Vision
Processor

HOST SOC
USB 3.1
Gen 1

2 sets of X2 MIPI
(SL/MS)

Connector

IPEX

Connector

IPEX

8.2

Kaby Lake U and Kaby Lake Y platforms

8.2.1

Kaby Lake Platform Introduction
The Kaby Lake U platform consists of a Kaby Lake U processor plus a Kaby Lake
Platform Controller Hub (PCH) in the same Multi Chip Package (MCP). Similarly, theKaby Lake Y platform consists of a Kaby Lake Y processor plus a Kaby Lake PCH in thesame Multi Chip Package (MCP).
Note:
1.

8.2.2

For Kaby Lake U/Y platform design guidelines, refer to Kaby Lake U and Y
Platform Design Guide (Doc# 561280)

Supported PCB Stack-Up and Routing Geometries
Refer to Kaby Lake U/Y Platform Design Guide for type 4 PCB stack up, Breakout/Break-in geometries, Main Route stripline/microstrip geometries and Via
recommendations. It is strongly recommended to follow the impedance criteria in thedesign guide for the given interface.

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114

8.2.3

Vision Processor D4 on Motherboard with USB HostInterface

8.2.3.1

USB 3.1 Gen 1 Motherboard Routing

Figure 8-4. Host Processor - Vision Processor D4

D4

Table 8-1. Host Transmit – Vision Processor D4 Receive Routing Guidelines
Parameter

Maximum
Segment Length(Inches)

Break-out
(BO)

Main
Route
(MR)

Break-in(BI)

Total Allowed Length(L_BO + L_MR + L_BI)

0.25

15-BO-BI

0.25

15

Maximum Allowed
Channel Insertion
loss (dB)<=15 dB @ 2.5 MHz

Table 8-2. Vision Processor D4 Transmit - Host Receive Routing Guidelines
Parameter

Break-out
(BO)

Main
Route
(MR)

Break-in(BI)

Total Allowed Length(L_BO + L_MR + L_BI)

Maximum
Segment Length(Inches)

0.25

15-BO-BI

0.25

15

Maximum Allowed
Channel Insertion
loss (dB)<=15 dB @ 2.5 MHz

Notes:

337029-013

1.

Simulation results shows that an overall 15-inch channel routing length is good for theUSB 3.1 Gen 1 Vision Processor D4 to Host connection motherboard. This connection
does not include any connector or cable.

2.

All routing is recommended to be at an 85 ohm impedance

115

3.

Break-out/break-in should be maximum length of 250 mil for 85 ohm routing. If there is
any impedance variation due to narrow escape BGA break-out, the maximum routing
length should be 150 mil.

4.

Maximum number of via count: 4 (including package microvia)

5.

It is strongly recommended that overall channel loss is within -15 dB for satisfactory
performance

8.2.4

Vision Processor D4 on Motherboard with MIPI HostInterface

8.2.4.1

MIPI Motherboard Routing

Figure 8-5. Vision Processor D4 Transmit - Host Receive

D4

Table 8-3. Vision Processor D4 Transmit – Host Receive Routing Guidelines
Parameter

Maximum
Segment Length(inches)
Maximum Allowed
Channel Insertion
loss (dB)Break-out
(BO)

Main
Route
(MR)

Break-in(BI)

Total Allowed Length(L_BO + L_MR + L_BI)

0.25

15-BO-BI0.25

15<=5.5 dB @ 750MHz

Notes:

337029-013

1.

Maximum via count = 4 vias including the first micro-via from package ball

2.

Minimum stripline break-out pair-to-pair spacing of 2.36 mils is allowed near packageball out region with maximum length of 250 mils

3.

Main route and break-in nominal impedance is required to be consistent. Example: 85
ohm main route and 85 ohm break-in. Mixture of nominal impedance is notrecommended.

4.

Length matching within a differential pair is +/- 5 mils maximum

116

5.

8.2.4.2

The maximum allowed channel insertion loss budget dictates the total allowed length.
The total insertion loss allowed for interconnect from the D4 package die bump to Kaby
Lake SoC package die bump is about 5.5dB at 750 MHz. It should be noted that
although only the insertion loss value at the fundamental frequency (750 MHz) is
specified, the insertion loss curve up to about 1.5 GHz should be well behaved with nostrong resonance or ripple.

MIPI Motherboard Routing (Stereo Depth Module Transmit to
Vision Processor D4 Receive)

Figure 8-6. Stereo Depth Transmit - Vision Processor D4 Receive

Depth
Module

D4

Board Routing

Table 8-4. Stereo Depth Module Transmit - Vision Processor D4 Receive Routing
Guidelines
Parameter

Break-out(BO)

Main Route Break-in
Flex
Interposer
(MR)
(BI)
Length(L_Cable)

Maximum
Segment Length(Inches)
Maximum
Allowed Channel
Insertion loss
(dB)

0.25

15 –
L_Cable L_Camera –BO - BI

0.25

15-L_MBL_camera

CameraTotal Allowed Length
Board(L_MB + L_Cable +Length
L_Camera)(L_Camera)

L_Camera

15(max ~2inches)<=5.5 dB @ 750MHz

Notes:

337029-013

1.

Stereo depth module MIPI routing length are assumed to be 2 inches (max)2.

Maximum via count = 3 vias including the first micro-via from package ball

117

3.

Minimum stripline break-out pair-to-pair spacing of 2.36 mils is allowed near packageball out region with maximum length of 250 mils

4.

Main route and break-in nominal impedance is required to be consistent. Example: 85
ohm main route and 85 ohm break-in. Mixture of nominal impedance is notrecommended.

5.

Length matching within a differential pair is +/- 5 mils maximum6.

No length match requirements for signals routed to different camera modules

7.

The maximum allowed channel insertion loss budget dictates the total allowed length.
The total insertion loss allowed for interconnect from the package die bump to theconnector on the camera module is about 5.5 dB at 750 MHz as shown in the table. This
recommendation allows the use of any cable type as long as the maximum allowed
insertion loss is met. It should be noted that although only the insertion loss value atthe fundamental frequency (750 MHz) is specified, the insertion loss curve up to about
1.5 GHz should be well behaved with no strong resonance or ripple.

8.

Flex Interposer recommendation: 85-100ohm impedance with maximum length of 4 - 6
inches. The recommended interposer should be Flex PCB based design.

Figure 8-7. Flex Interposer PCB Stack-Up

8.2.5

Vision Processor D4 Board for Integrated Peripheral (USB
3.1 Gen 1 Host to Vision Processor D4 Routing)Figure 8-8. USB 3.1 Gen 1 Host to Vision Processor D4 Topology

D4337029-013

118

Table 8-5. USB 3.1 Gen 1 Host to Vision Processor D4 Routing Guidelines
Vision Processor D4 Board

Parameter

Breakout(BO)

Maximum
Segment
Length(Inches)

0.25

Maximum
AllowedChannelInsertion loss(dB)

Main RouteBreak-in

(MR)

(BI)

2

0.25

USB 3.1
Gen 1
Cable
Cable
Length(L_Cable)

15 (max)

Host Motherboard

Break-out

Main RouteBreak-in

(BO)

(MR)

(BI)

0.25

5

0.25

<= 15 dB @ 2.5GHz
Max recommended USB 3.1 Gen 1 cable loss <= 7.5 dB @2.5GHz

Notes:

8.2.6

1.

The maximum allowable motherboard routing of USB 3.1 Gen 1 signals on Host PCB
should be 5 – 6 inches and routing on Vision Processor D4 Board should be 2 – 3 inches.

2.

It is recommended that an 85 ohm common mode choke (CMC) be designed in-line withboth the USB 3.1 Gen 1 signals. The CMC should be placed as close to the connector as
possible.

3.

It is required that a 0.1 μF AC coupling capacitor is designed in series with both the USB
3.1 Gen 1 signals.

4.

The USB 3.1 Gen 1 cable assembly should have a differential impedance of 85 Ohms
with a tolerance of ± 10%.

5.

The max cable length should not exceed 15 inch with target loss of 7.5 dB @ 2.5 GHz

6.

Overall channel loss including cable should not exceed 15 dB @ 2.5 GHz

USB2.0 Design Guidelines (USB2 Host to Vision Processor
D4 Routing)Figure 8-9. USB2.0 Host to Vision Processor D4

D4337029-013

119Parameter

Maximum
Segment Length(inches)

Break-out
(BO)

Main
Route
(MR)

Break-in(BI)

Total Allowed Length(L_BO + L_MR + L_BI)

0.25

15-BO-BI

0.25

15

Maximum Allowed
Channel Insertion
loss (dB)
Notes:
1.

Simulation results shows that an overall 15 inch channel routing is good for USB 2.0 D4
to Host topology on motherboard. This topology does not include any connector orcable.

2.

All routing is recommended to be 85 ohm

3.

Break-out/break-in should be max of 250 mil for 85 ohm routing. If there is any
impedance variation due to narrow escape BGA break-out, the max routing should be
150 mil.

4.

Maximum number of via count: 4 (including package microvia)

5.

It is strongly recommended that overall channel loss to be within -15dB for satisfactory
performance

8.3

Cherry Trail T4 Platform

8.3.1

Cherry Trail T4 Platform Introduction
The Cherry Trail T4 is the Intel Architecture (IA) SoC that integrates an Intel®
processor core, graphics, memory controller, and I/O interfaces into a single systemon-chip solution.
Note: For Cherry Trail T4 platform design guidelines, please refer to Cherry Trail T4
Platform Design Guide. (Doc# 537901)
Note: Cherry Trail platform supports 2 SoC SKUs, T3 and T4. The Vision Processor
D4 platform design guidelines discussed in this chapter are only applicable to the T4based Cherry Trail platform. For information on the Cherry Trail T4 SoC, please refer
to Intel® Atom™ Z8000 Processor Series - External Design Specification (EDS) (Doc#539071)

8.3.2

Vision Processor D4 Platform Design Guidelines
The Vision Processor D4 platform design guidelines on the Cherry Trail T4 platform
follow the same guidelines as specified for the Kaby Lake U and Y platforms.

8.3.2.1

Supported PCB Stack-Up and Routing Geometries
Refer to Cherry Trail T4 Platform Design Guide for Type 4 PCB stack up, Breakout/Break-in routing geometry, Main Route stripline/microstrip geometry and Via

337029-013

120

recommendations. It is strongly recommended to follow the impedance criteria in thedesign guide for the given interface.

337029-013

121

9
9.1

Regulatory Compliance
System Laser Compliance
Certification for the Intel® RealSense™ Depth Cameras and Depth Modules, pairedwith Intel® RealSense™ Vision Processor D4 Board, following integration guidelines, istransferable to the system and no system recertification is required. However, thefollowing statements and labels must be included in the user manual of the end
product.

9.1.1

Certification Statement
This product is classified as a Class 1 Laser Product under the EN/IEC 60825-1, Edition
3 (2014) internationally.
This product complies with FDA performance standards for laser products except for
conformance with IEC 60825-1 Ed. 3 as described in Laser Notice No. 56, dated May
8, 2019.

9.1.2

Explanatory Label

9.1.3

Cautionary Statements
System integrators should refer to their respective regulatory andcompliance owner to finalize regulatory requirements for a specificgeography.

337029-013

122

Caution - Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.

9.1.4

•

Do not power on the product if any external damage wasobserved.

•

Do not attempt to open any portion of this laser product. There are nouser serviceable parts.

•

Invisible laser radiation when opened. Avoid direct exposure to beam.

•

There are no service/maintenance, modification, or disassembly
procedures for the stereo module and infrared projector. The system
integrator must either notify Intel or return modules before any failure
analysis is performed.

•

Modification or service of the stereo module, specifically the infraredprojector, may cause the emissions to exceed Class 1.

•

Do not try to update camera firmware that is not officially released forspecific camera module SKU and revision.

US FDA Accession Number

Table 9-1. U.S. FDA Accession Number
Component

U.S. FDA accession numbersIntel® RealSense™ Depth Module
D410/D415/D430/D450

1420260

Intel® RealSense™ Depth Camera
D415/D435/D435i/D455

1420260

This accession number should be entered into Box B.1 of the Food and Drug
Administration (FDA) 2877 Declaration for Imported Electronic Products Subject toRadiation Control Standards.

9.2

Regulatory Compliance

9.2.1

Manufacturer’s Information
Attn: Corp. Quality
Intel Corporation
2200 Mission College Blvd.
Santa Clara CA 95054-1549
USA

9.2.2

EU Single Place of Contact
Intel Deutschland GmbHz. H. Corp. Quality

337029-013

123

Am Campeon 10-1285579 Neubiberg
GERMANY

9.2.3

UK Single Place of Contact
Intel Corporation (UK) Ltd.
Attn: Corp. Quality
Pipers Way
SwindonWiltshireSN3 1RJUNITED KINGDOM

9.2.4

NRTL Statement
For the US and Canada market, this product has been tested and certified by UL andNemko, and found to be compliant with all applicable requirements of thespecifications below:
UL 60950-1 2nd Edition, CAN/CSA C22.2 No. 60950-1-07, Information Technology
Equipment – Safety – Part 1: General Requirements
Both UL and Nemko are Nationally Recognized Testing Laboratories (NRTLs),
recognized by US Occupational Safety and Health Administration (OSHA) as qualified
to perform safety testing and certifications covered within its scope of recognition.
* Not applicable to D450, D401 modules and D455, D405 cameras.

Figure 9-1. NRTL Certifications

9.2.5

FCC Part 15 Declaration of Conformity
Intel® RealSense™ Depth Camera D415, D435, D435i, D455
This device complies with part 15 of the FCC Rules. Operation is subject to thefollowing two conditions: (1) This device may not cause harmful interference, and (2)337029-013

124this device must accept any interference received, including interference that may
cause undesired operation.
Attn: Corp. Quality, Intel Corporation: 2200Mission College Blvd, Santa Clara, CA
95054-1549, USA
This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to part 15 of the FCC Rules. These limits are designed toprovide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will notoccur in a particular installation. If this equipment does cause harmful interference toradio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or more of thefollowing measures:• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which thereceiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
Changes or modifications not expressly approved by the manufacturer could void theuser’s authority to operate the equipment.
CAUTION: To comply with the limits of the Class B digital device, pursuant to Part 15of the FCC Rules, this device must be installed with computer equipment certified tocomply with Class B limits. All cables used to connect to the computer and peripherals
must be shielded and grounded. Operation with non-certified computers or nonshielded cables may result in interference to radio or television reception.

9.2.6

CanadaCAN ICES-3 (B)/NMB-3(B)This digital apparatus does not exceed the Class B limits for radio noise emissions
from digital apparatus set out in the Interference-Causing Equipment Standard
ICES‑003.
Le présent appareil numerique német pas de bruits radio électriques dépassant leslimites applicables aux appareils numériques de la classe B prescrites dans la présente
norme sur le matériel brouilleur, NMB‑003.

9.2.7

European Directives
This product complies with all applicable European directives.
CAUTION: To keep the product in compliance with the European CE requirement, thedevice must be installed with CE certified computer equipment which meets the Class
B limits. Operation with non-certified computers or incorrect cables may result ininterference to other devices or undesired effect to the product.

337029-013

1259.2.8UK
This product complies with all applicable UK regulations.
Due to the very small size of the product, the marking has been placed in thisdatasheet.

9.2.9

Australia
Due to the very small size of the product, the marking has been placed in thisdatasheet.

9.2.10Japan
この装置は、クラスＢ機器です。この装置は、住宅環境で使用することを目的としていますが、この装置がラジオやテレビジョン受信機に近接して使用されると、受信障害を引き起こすことがあります。 取扱説明書に従って正しい取り扱いをして下さい。
ＶＣＣＩ－Ｂ
This device is a Class B information technology device. This device is intended for use
in a home environment, but if this device is used close to a radio or television receiver
it may cause reception interference. Please handle according to the instruction manual
correctly. VCCI-B

9.2.11

South Korea인증 번호: MSIP-REM-CPU-D415C, MSIP-REM-CPU-D435C, R-R-CPU-D435iC, R-R-CPUD455C, R-R-CPU-D405C
제조자: Intel Corporation
상품명: Intel® RealSense™ Depth Camera
모델: D415, D435, D435i, D455, D405
제조국: 태국, 중국인증 번호: R-REM-CPU-D410, R-REM-CPU-D415, R-REM-CPU-D430, R-R-CPU-D450, RR-CPU-D401
제조자: Intel Corporation
상품명: Intel® RealSense™ Depth Module
모델: D410, D415, D430, D450, D401
제조국: 중국인증 번호: R-REM-CPU-D4BOARD
제조자: Intel Corporation
상품명: Intel® RealSense™ Vision Processor Card
모델: D4BOARD
제조국: 중국

337029-013

1269.2.12

Customs UnionНаименование продукции: Intel® RealSense™ Depth CameraМодель: D415, D435, D435i, D455, D405, D401
Производитель: Intel CorporationСделано в Таиланде, Китае

9.3

Ecology Compliance

9.3.1

China RoHS Declaration

China RoHS
Declaration
产品中有毒有害物质的名称及含量
Hazardous Substances Table
部件名称
Component Name
相机
Camera印刷电路板组件
Printed Board Assemblies
三角架
Tripod
电缆
Cable

铅
Pb

有毒有害物质或元素 Hazardous Substance汞镉六价铬多溴联苯 多溴二苯醚Hg
Cd
Cr (VI) PBB
PBDE

○

○

○

○

○

○

X

○

○

○

○

○

○

○

○

○

○

○

○

○

○

○

○

○

○：表示该有毒有害物质在该部件所有均质材料中的含量均在GB/T 26572标准规定的限量要求以下。
○：Indicates that this hazardous substance contained in all homogeneous materials ofsuch component is within the limits specified in GB/T 26572.

×：表示该有毒有害物质至少在该部件的某一均质材料中的含量超出GB/T 26572标准规定的限量要求。

337029-013

127

×： Indicates that the content of such hazardous substance in at least ahomogeneous material of such component exceeds the limits specified in GB/T 26572.

对销售之日的所售产品,本表显示我公司供应链的电子信息产品可能包含这些物质。注意：
在所售产品中可能会也可能不会含有所有所列的部件。
This table shows where these substances may be found in the supply chain of ourelectronic information products, as of the date of sale of the enclosed product. Notethat some of the component types listed above may or may not be a part of theenclosed product.

除非另外特别的标注,此标志为针对所涉及产品的环保使用期限标志. 某些可更换的零部件可能会有一个不同的环保使用期限(例如,电池单元模块).
此环保使用期限只适用于产品在产品手册中所规定的条件下工作.
The Environment-Friendly Use Period (EFUP) for all enclosed
products and their parts are per the symbol shown here,
unless otherwise marked. Certain field-replaceable parts may
have a different EFUP (for example, battery modules) number.
The Environment-Friendly Use Period is valid only when the
product is operated under the conditions defined in the productmanual.

9.3.2

Waste Electrical and Electronic Equipment (WEEE)“In the EU, this symbol means that this product must not be disposed ofwith household waste. It is your responsibility to bring it to a designatedcollection point for the recycling of waste electrical and electronic equipment.
For more information, contact the local waste collection center or your pointof purchase of this product.”

9.3.3

TurkeyTürkiye Cumhuriyeti: EEE Yönetmeliğine Uygundur§§

337029-013

128

10

Mechanical Drawings

Figure 10-1. Intel® RealSense™ Depth Module D410

337029-013

129

Figure 10-2. Intel® RealSense™ Depth Module D415

337029-013

130Figure 10-3. Intel® RealSense™ Depth Module D430

337029-013

131Figure 10-4. Intel® RealSense™ Depth Module D450

337029-013

132

Figure 10-5. Intel® RealSense™ Depth Module D401

337029-013

133

Figure 10-6. Vision Processor D4 Board USB Type-C (Intel® RealSense™ Vision
Processor D4 Board – V1 and V3)

337029-013

134

Figure 10-7. Vision Processor D4 Board USB Micro-B (Intel® RealSense™ Vision
Processor D4 Board – V4)

337029-013

135Figure 10-8. Intel® RealSense™ Depth Camera D415

Note: Recommended torque for both M3 mounting points is 0.4 Nm

337029-013

136

Figure 10-9. Intel® RealSense™ Depth Camera D435/D435i

Note: Recommended torque for both M3 mounting points is 0.4 Nm

337029-013

137

Figure 10-10. Intel® RealSense™ Depth Camera D435f NIR Filter

337029-013

138

Figure 10-10. Intel® RealSense™ Depth Camera D455

Note: Recommended torque for both M4 mounting points is 0.4 Nm

337029-013

139

Figure 10-11. Intel® RealSense™ Depth Camera D405

337029-013

140

11

Connector Drawings

Figure 11-1. Receptacle Mechanical Drawing (50-Pin Depth Module Receptacle)

337029-013

141Figure 11-2. Plug Mechanical Drawing (50-Pin Depth Module Plug)

337029-013

142

12

Appendix A – Vision Processor
D4 on Motherboard Schematic
Checklist
The following checklist should be compared to the D4 on motherboard design.

Table 12-1. Vision Processor D4 on Motherboard Schematic Checklist
Note:
1. Vision Processor D4 Ball Out and Signal Listing lists additional interfaces andsignal pins that are not supported in current D4 camera system. These pinsare called out as RESERVED.
Definitions:•

Stuff = Component is populated•

No Stuff = Component is not populated

Signal Name

Pad

Connection√

HOST MIPI
H_DATAP0

B04

No Connect

H_DATAN0

A05

No Connect

H_DATAP1

B05

No Connect

H_DATAN1

A06

No Connect

H_DATAP2

B07

No Connect

H_DATAN2

A08

No Connect

H_DATAP3

B08

No Connect

H_DATAN3

A09

No Connect

H_CLKP

B06

No Connect

H_CLKN

A07

No Connect

H_SDA

B03

No Connect

H_SCL

A04

No Connect

H_REXT

C05

6.04K 1% resistor pull down to GND. (This resistor
should be placed as close to ASIC as possible)

IMAGER A MIPI (Stereo Depth Left Imager Interface)
A_DATAP0337029-013

P03

Routed to Stereo Depth Receptacle Pin 16

143Signal Name

Pad

Connection

A_DATAN0

R02

Routed to Stereo Depth Receptacle Pin 18

A_DATAP1

P05

Routed to Stereo Depth Receptacle Pin 28

A_DATAN1

R04

Routed to Stereo Depth Receptacle Pin 30

A_CLKP

P04

Routed to Stereo Depth Receptacle Pin 22

A_CKLN

R03

Routed to Stereo Depth Receptacle Pin 24

A_SDA

N01

Routed to Stereo Depth Receptacle Pin 41 with 2.2K
pull up to 1.8V

A_SCL

N02

Routed to Stereo Depth Receptacle Pin 39 with 2.2K
pull up to 1.8V

A_RCLK

P02

Routed to Stereo Depth Receptacle Pin 27

A_PDOWN

N03

No Connect

A_VSYNC

M01

Routed to Stereo Depth Receptacle Pin 23

A_RESETN

P01

Routed to Stereo Depth Receptacle Pin 31

A_REXT

N04

6.04K 1% resistor pull down to GND. (This resistor
should be placed as close to ASIC as possible)√

IMAGER B MIPI (Reserved)

337029-013

B_DATAP0

B11

No Connect

B_DATAN0

A12

No Connect

B_DATAP1

B09

No Connect

B_DATAN1

A10

No Connect

B_CLKP

B10

No Connect

B_CKLNA11

No Connect

B_SDA

C12

No Connect

B_SCL

B12

No Connect

B_RCLK

C07

No Connect

B_PDOWN

C09

No Connect

B_VSYNC

C08

No Connect

B_RESETNC10No Connect

B_REXT

C11

6.04K 1% resistor pull down to GND. (This resistor
should be placed as close to ASIC as possible)

144

Signal Name

Pad

Connection√

IMAGER M MIPI (Stereo Depth Right Imager)
M_DATAP0

P08

Routed to Stereo Depth Receptacle Pin 34

M_DATAN0

R07

Routed to Stereo Depth Receptacle Pin 36

M_DATAP1

P10

Routed to Stereo Depth Receptacle Pin 46

M_DATAN1

R09

Routed to Stereo Depth Connector Pin 48

M_CLKP

P09

Routed to Stereo Depth Receptacle Pin 40

M_CKLN

R08

Routed to Stereo Depth Receptacle Pin 42

M_SDA

P06

Routed to External Sensor Sync Connector Pin 6
through 2.2K pull up to 1.8V

M_SCL

R05

Routed to External Sensor Sync Connector Pin 7
through 2.2K pull up to 1.8V

M_RCLK

R06

Routed to Stereo Depth Receptacle Pin 37

M_PDOWN

P07

No Connect

M_VSYNC

N06

No Connect

M_RESETN

N07

No Connect

M_REXT

M06

6.04K 1% resistor pull down to GND. (This resistor
should be placed as close to ASIC as possible)
IMAGER Y MIPI (Color ISP)

337029-013

Y_DATAP0

C14

Routed to Color ISP (Intel® Vision Processor D4
Board) or No Connect

Y_DATAN0

B15

Routed to Color ISP (Intel® Vision Processor D4
Board) or No Connect

Y_DATAP1

B13

Routed to Color ISP (Intel® Vision Processor D4
Board) or No Connect

Y_DATAN1

A13

Routed to Color ISP (Intel® Vision Processor D4
Board) or No Connect

Y_CLKP

B14

Routed to Color ISP (Intel® Vision Processor D4
Board) or No Connect

Y_CKLN

A14

Routed to Color ISP (Intel® Vision Processor D4
Board) or No Connect

Y_SDA

E14

Routed to Color ISP (Intel® Vision Processor D4
Board) or No Connect

Y_SCL

D15

Routed to Color ISP (Intel® Vision Processor D4
Board) or No Connect

Y_RCLK

D14

Routed to Color ISP (Intel® Vision Processor D4
Board) or No Connect145Signal Name

Pad

Connection

Y_PDOWN

E13

No Connect

Y_VSYNC

F13

Routed as RGB_FSYNC to Stereo Depth Receptacle
Pin 7 through 0 ohm stuff resistor. Alternately also
as routed as RGB_STROBE to Stereo Depth
Receptacle Pin 9 through 0 ohm no stuff resistor.

Y_RESETN

F14

Routed to Color ISP (Intel® Vision Processor D4
Board) or No Connect

Y_REXT

C15

6.04K 1% resistor pull down to GND. (This resistor
should be placed as close to ASIC as possible)√

IMAGER Z MIPI (Reserved)
Z_DATAP0P13

No Connect

Z_DATAN0

R12

No Connect

Z_DATAP1P11No Connect

Z_DATAN1

R10

No Connect

Z_CLKPP12

No Connect

Z_CKLNR11

No Connect

Z_SDA

N13

No Connect

Z_SCL

N12

No Connect

Z_RCLKR13

No Connect

Z_PDOWN

N11

No Connect

Z_VSYNC

R14

Depth VSYNC - Routed to External Sensor Sync
Connector Pin 5

Z_RESETNP14No Connect

Z_REXT

N10

6.04K 1% resistor pull down to GND. (This resistor
should be placed as close to ASIC as possible)
SPI (SERIAL FLASH MEMORY)

337029-013

SPI_DI

N14

Routed to 16 Mbit SERIAL FLASH MEMORY(IS25WP016 pin 5 or equivalent)

SPI_DO

N15

Routed to 16 Mbit SERIAL FLASH MEMORY(IS25WP016 pin 2 or equivalent)

SPI_CLK

M14

Routed to 16 Mbit SERIAL FLASH MEMORY(IS25WP016 pin 6 or equivalent)

SPI_CS

M13

Routed to 16 Mbit SERIAL FLASH MEMORY(IS25WP016 pin 1 or equivalent)

SPI_WP

M15

Routed to 16 Mbit SERIAL FLASH MEMORY(IS25WP016 pin 3 or equivalent

146

Signal Name

Pad

Connection√

GPIO
GPIO[0]E15

No Connect if not used.

GPIO[1]

F15

No Connect if not used.

G14

LASER_PWM - Routed to Stereo Depth Receptacle
pin 43 with 0 ohm no stuff resistor. Refer to
LASER_PWM platform implementation schematic in
Figure 10-1. Laser PWM0 is routed to Stereo Depth
Receptacle Pin 43 through 0 ohm stuff resistor.
Laser PWM1 is routed to Stereo Depth Receptacle
Pin 47H14GVSYNC0 - Routed to External Sensor Sync
Connector Pin 1

G13

GVSYNC1 - Routed to External Sensor Sync
Connector pin 2 through 0 ohm stuff resistor with
optional LASER_PWRDN through 0 ohm no stuff
resistor or No Connect if not used.

G15

GVSYNC2 - Routed to External Sensor Sync
Connector pin 3 through 0 ohm stuff resistor with
optional FLAGB through 0 ohm no stuff resistor or
No Connect if not used.

H15

GVSYNC3 - Routed to External Sensor Sync
Connector pin 4 through 0 ohm stuff resistor with
optional LASER_PWM through 0 ohm no stuff
resistor or No Connect if not used.

H13

Routed to Stereo Depth Receptacle Pin 21 or No
Connect if not used.

L01

FLAGB - Routed to Stereo Depth Connector
Receptacle Pin 49 with pull up option to 1.8 V with
0 ohm no stuff resistor

EGPIO[1]E03

Pull up option to 1.8 V with 0 ohm no stuff resistor

EGPIO[2]K01

Pull up option to 1.8 V with 0 ohm no stuff resistor

L02

LASER_PWRDN - Routed to Stereo Depth Connector
Receptacle Pin 45 with pull up option to 1.8 V with
0 ohm no stuff resistor

M02

Pull up to 1.8 V with 4.99K resistor

J02

Pull down option to GND with 0 Ohms no stuff
resistor

EGPIO[6]D01

Pull up option to 1.8 V with 0 ohm no stuff resistor

EGPIO[7]E01

Pull down to GND with 4.99K resistor

F01

ISP_FCS – Color ISP EEPROM Chip Select. Also
pulled up to 1.8 V with 4.99K resistor

GPIO[2]

GPIO[3]GPIO[4]GPIO[5]GPIO[6]GPIO[7]EGPIO[0]EGPIO[3]EGPIO[4]EGPIO[5]EGPIO[8]337029-013

147

Signal NamePad

EGPIO[9]E02

EGPIO[10]J01

EGPIO[11]F03

EGPIO[12]K02

EGPIO[13]F02

Connection√

Pull up option to 1.8 V with 0 ohm no stuff resistor
Pull up option to 1.8 V with 4.99K no stuff resistor
Pull up option to 1.8 V with 4.99K no stuff resistor
Pull up option to 1.8 V with 4.99K no stuff resistor
Pull up option to 1.8 V with 0 ohm no stuff resistor
USB

USB_RXP

B02

Intel® Vision Processor D4 Board supports USB

USB_RXN

A03Intel® Vision Processor D4 Board supports USB
Type-C connection to Host USB. Route as
appropriate connection to Host USB.

USB_TXP

B01

Intel® Vision Processor D4 Board supports USB
Type-C connection to Host USB. Route as
appropriate connection to Host USB.

USB_TXN

A02Intel® Vision Processor D4 Board supports USB
Type-C connection to Host USB. Route as
appropriate connection to Host USB.

USB_DP

D03

Intel® Vision Processor D4 Board supports USB
Type-C connection to Host USB. Route as
appropriate connection to Host USB.

USB_DN

D02Intel® Vision Processor D4 Board supports USB
Type-C connection to Host USB. Route as
appropriate connection to Host USB.

USB_ID

E05

Intel® Vision Processor D4 Board supports USB
Type-C connection to Host USB. Route as
appropriate connection to Host USB.

USB_RESREF

E04

200 ohm pull down to GND. (This resistor should beplaced as close to ASIC as possible)

Type-C connection to Host USB. Route as
appropriate connection to Host USB

MISCELLANIOUS
LD_ON_OUT_XX

K13(RESERVED) No Connect

MODSTROB

J15(RESERVED) No Connect

MODSIGN

J14(RESERVED) No Connect

LD_ERR

J13

Connected to FF_RSTn (schematic)

G1

24 MHz XTAL. Refer to platform implementation
schematic in Figure 10-2.

H1

24 MHz XTAL. Refer to platform implementation
schematic in Figure 10-2.

PRSTN

C3

Platform implementation specific

CW_CSR_PRSTN

P15No Connect

CLKXI
CLKXO

337029-013

148

Signal Name

Pad

Connection

PMU_PWR_EN

K3

Enables VDD_PG voltage rail.

DFU

C2

Platform implementation specific

ISP_SCL

M10(RESERVED) No Connect

ISP_SDAN9(RESERVED) No Connect

VQPSQ

L3

(RESERVED) No Connect

VQPSM

M3

(RESERVED) No Connect

REFPADCLKPD6(RESERVED) No Connect

REFPADCLKM

E6(RESERVED) No Connect

√

JTAG
TDI

L13

Routed to Test Point or pulldown resistor of 4.7 10K Ohm if JTAG is not used.

TDO

L14

Routed to Test Point

TCLK

K14

Routed to Test Point or pulldown resistor of 4.7 10K Ohm if JTAG is not used.

TMS

K15

Routed to Test Point or pulldown resistor of 4.7 10K Ohm if JTAG is not used.

TRSTN

L15

Routed to Test Point
POWER AND GROUND

337029-013

VDD

0.9 V

VDD_PG

0.9 V

USB_DVDD

0.9 V

VPTX0

0.9 V

VP

0.9 V

*_AVDD

1.8 V

VDDPLL

0.9 V

VDDTS

1.8 V

VDDPST18

1.8 V

USB_VDD330

3.3 V

VBUS0

VBUS Power Monitor Signal. VBUS0 signal level is at
VBUS*(200k/(200k+30k)) using external voltage
divider

VSS

Ground*_AGND

Ground149

Figure 12-1. Vision Processor D4 Laser PWM Reference Platform Schematic

Figure 12-2. Vision Processor D4 24 MHz Crystal Clock Reference Platform Schematic

12.1

Power Delivery
The DC–DC power circuity discussed in this section must be followed for Vision
Processor D4 on Motherboard designs. TPS62085R DC-DC converter (www.ti.com)
generates 0.9 V and SC21150 (www.semtech.com) generates 1.8 V and 3.3 V voltage
rails from 5 V to power Vision Processor D4, Stereo Depth Module.

337029-013

150

Figure 12-3. DC-DC Reference Platform Schematic (3.3 V, 1.8 V, 0.9 V)

0.9V

1.8V

3.3V

337029-013

151

Figure 12-4. Vision Processor D4 VDD_PG and AVDD Reference Platform Schematic

VDD_PG

Enable
1.8V

Table 12-2. Vision Processor D4 Decoupling and Filter Requirements
Voltage Ball
Name

Decoupling

VDD

4X 100 nF

VDD_PG8X 100 nF

USB_DVDDVPTX0FilterNotes

1X 100 nF
2X 100 nF

VP
*AVDD

1X 100 nF

VDDPLL

1X 100 nF

VDDTS

1X 100 nF

VDDPST18(Left andRight)

1X 100 nF

USB_VDD330

1X 100 nF

1X FERRITE BEAD
120 ohm

1X 100 nF
1X FERRITE BEAD
120 ohm

VBUS0337029-013

152

13

Appendix B – Cover Material
Cover materials placed over the camera sensor must be carefully selected to avoid
impacting software performance. The following parameters are an example of asuitable cover material. Other solutions are also acceptable but careful design andvalidation work should be done to verify a solution will perform adequately.

Table 13-1. Example: Cover Material Parameters
Specification

Notes

Hardness

6H

Prevent Scratches

Flatness

0.05 mm

Minimize Distortion

Less than 8 mm (D410/D415)

Cover Material not toexceed 1 mm thickness

Distance From Lens to Cover

337029-013

Recommendation

Less than 2 mm (D430)

Thickness of Cover

0.55 mm ± 0.03 mm

Cover Material not toexceed 1 mm thickness

Coatings

AR inside and outside

Avoid Reflections

Transmission Wavelength
Range

400 to 865 nm (Visible andInfrared) @ 98% transmission
rate or higher at all viewing andtransmitting angles

Cover Tilt Tolerance± 1.0˚

153