ST890
1.2 A current limited high-side power switch with thermal
shutdown
Datasheet - production data

Applications
PCMCIA slots
Access bus slots
Portable equipment

Description
The ST890 device is a low voltage, P-channel
MOSFET power switch intended for high-side
load switching applications.
The switch operates with inputs from 2.7 V to
5.5 V, making it ideal for both 3 V and 5 V
systems.

Features
2.7 to 5.5 V input range
Programmable current limit up to 1.2 A
Low quiescent current
Thermal shutdown
Active-low FAULT indicator output
90 mΩ (typ.) ON resistanceSO8 and DFN8L 3x3 packages

December 2016

The internal current limiting circuitry protects theinput supply against overload. The thermal
overload protection limits power dissipation andjunction temperatures.
The maximum current limit is 1.2 A. The current
limit through the switch is programmed with aresistor from SET to ground. The devices areavailable in SO8 and DFN8L 3x3 packages.

DocID8649 Rev 10

This is information on a product in full production.

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www.st.com

ContentsST890

Contents1Device summary .............................................................................. 32

Pinout information........................................................................... 434Absolute maximum ratings and operating conditions ................. 5
Electrical information ...................................................................... 64.1

Characteristics and timings ............................................................... 64.2

Application circuit .............................................................................. 74.3

Functional description ....................................................................... 74.4

5672/194.3.1

Output current limit ............................................................................. 74.3.2Output short-circuit protection ............................................................ 74.3.3

Programming ILIM ................................................................................ 84.3.4

𝐅𝐀𝐔𝐋𝐓 pin........................................................................................... 84.3.5

Thermal protection.............................................................................. 8

Typical performance characteristics .................................................. 9Package information ..................................................................... 105.1

SO8 package information ................................................................ 115.2

SO8 tape and reel information ........................................................ 125.3DFN8L 3x3 package information ..................................................... 13

5.4

DFN8L 3x3 tape and reel information ............................................. 15

Ordering information..................................................................... 17
Revision history ............................................................................ 18

DocID8649 Rev 10ST890

1

Device summary

Device summary
Figure 1: Schematic diagram

Table 1: Truth table for ON /OFF switch
ON /OFFOUT

LON

H

OFF

Table 2: Truth table for FAULT
FAULT

FLAGH

Normal operation

L

Fault condition

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Pinout information

2

ST890

Pinout information
Figure 2: SO8 and DFN8L 3x3 pin connections (top view)

1.

IN 1

8 FAULTIN 27 OUT

ON 3

6 OUT

GND 45 SET

The exposed pad of the DFN8L 3x3 is not internally connected. It can be connected to the PCB
groundplane for best thermal performance.

Table 3: SO8 and DFN8L 3x3 pin description

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Pin no.

SymbolName and function

1, 2IN

Input P-channel MOSFET source. Bypass IN with a 1 μF capacitor to ground.

3ON

Active-low switch ON input. A logic low turns the switch ON.

4GNDGround

5SET

Set current limit input. A resistor from SET to GND sets the current limit forthe switch.

6, 7OUT

Switch output. P-channel MOSFET drain. Bypass OUT with a 0.1 μFcapacitor to ground.

8FAULT

Fault indicator output. This open drain output goes low when in current limit orwhen the die temperature exceeds 135 °C.

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ST8903

Absolute maximum ratings and operating
conditions

Absolute maximum ratings and operating conditions
Stressing the device above the ratings listed inTable 4: "Absolute maximum ratings" maycause permanent damage to the device. These are stress ratings only and operation of thedevice at these or any other conditions above those indicated in of this specification is not
implied. Exposure to absolute maximum rating conditions for extended periods may affectdevice reliability.
Table 4: Absolute maximum ratings
SymbolParameter

Value

VI

Voltage at IN pin-0.5 to 6

VON

Input voltage at ON pin-0.5 to 6

Input voltage at FAULT_N pin-0.5 to 6

VFAULT_N
VSET

Voltage at SET pin

IDS

Maximum continuous switching current

Tstg

Storage temperature

UnitV-0.5 to (VIN + 0.5)
1.5A-65 to 150°C

Table 5: Thermal data
SymbolRthj-amb

Parameter
Thermal resistance junction-ambient

SO8DFN8L

Unit

160 (1)37.6 (2)°C/W

Notes:(1)

This value depends on the thermal design of the PCB on which the device is mounted.

(2)This value depends on the four-layer PCB, JEDEC standard test board. For best thermal performance, theexposed pad PCB area should be connected by a via to the PCB groundplane.

Table 6: Operating conditions
SymbolParameter

VIVoltage at IN pinToper

Operating free-air temperature range

ST890CDR

ST890BDR

ST890DTR

2.7 to 5.5

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UnitV°C

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Electrical information

ST890

4

Electrical information

4.1

Characteristics and timings
Table 7: Electrical characteristics

SymbolTA = 25 °C

Test condition (1)Parameter

Unit
Min.

VI

Operating voltage

ID = 1 mA

ICC

ON quiescent supply current

VI = 5 V, ON = GND, IO = 0ICCOFF

OFF quiescent supply current

VULO

Undervoltage lockout

VHYST

Undervoltage lockout
hysteresis

RON

ON resistance

VSET

Reference voltage to turn theswitch OFFIMAXMaximum programmable
output over current limit

Typ.

2.7

5.5131

ON = IN, VI = 5.5 V, VO = 05Rising edge

22.475120

VI = 3 V90

130

1.24

1.302

1.178

µAVmV

VI = 4.5 VmΩ
V

1.2

ISC

Short-circuit current limit

ILIM/ISETILIM to ISET current ratio

IO = 500 mA, VO > 1.6 V

VIL

ON input low level voltage

VI = 2.7 to 5.5 V

VIH

ON input high level voltage

IION input leakage current

VI = 5.5 V

ISETbias

ISET bias current

VSET = 1.24 V, IO = 0, VI = VO

0.5

VOL

FAULT output low voltage

ISINK = 1 mA, VSET = 1.4 V

0.15

FAULT output leakage

2.6100

IO = 100 mA,
VSET rise until VI - VO > 0.8 VV

25

ON = IN, VI = VOUT = 5.5 V

VI = 5 V, OUT connected to GND,
device enabled into short-circuit

IOH

Max.

970

1.2
ILIM

1.5
ILIM1110

1300

A

0.8

VI = 2.7 to 3.6 V

2

VI = 2.7 to 5.5 V

2.4V

1

VFAULT = 5.5 V, VSET = 1 V

3µA

V
1µAcurrent
TPROT

Thermal protection

130

THYSTThermal hysteresis

15Notes:(1)V = 3 V, T = TIN
AMIN to TMAX, unless otherwise specified. Typical values are at T A = 25 °C

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ST890Electrical information
Table 8: Timing characteristics
TA = 25 °C

Parameter

Test condition (1)Slow current loop response time

20 % current overdrive,
VCC = 5 V

Symbol

tRESP

Min.

Max.

Unit

5

Fast current loop response timetONTyp.

2
VI = 5 V, IO = 500 mA

25VI = 3 V, IO = 500 mA

50µs

50

Turn ON time

tOFF

Turn OFF timeVI = 5 V

1210Notes:(1)V = 3 V, T = TIN
AMIN to TMAX, unless otherwise specified. Typical values are at TA = 25 °C

4.2

Application circuit
Figure 3: Typical application circuit

INPUT

INO UTIN

O UT

FAULT

ONG NDSETO UT PUT

0.1 μF

100 kΩ
ON / OFF

1 μF

RSET

4.3

Functional description

4.3.1

Output current limit
ILIM is the output current that the ST890 device limits under the condition VO (outputvoltage) > 1.6 V.
When ILIM is reached, the FAULT pin is asserted.

4.3.2

Output short-circuit protection
The ST890 device provides short-circuit protection by limiting the output current during ashort circuit event.
Isc is the output short-circuit current limit level (typ. 1.2 x ILIM). When a short circuit event
occurs on the output, such as VO < 1.6 V, the ST890 device limits the output current to no
more than the Isc level.
When a short circuit event occurs on the output, the FAULT pin is asserted.
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Electrical information

4.3.3

ST890

Programming ILIM
The ST890's ILIM can be programmed through the external resistor, RSET, connected at theSET pin (pin 5).
ILIM is determined by the equations below.
Equation 1
I SET =VSETRSET

Equation 2
I LIM= 1110I SET

Therefore:
Equation 3
RSET = 1.24 ×

4.3.4

1110
I LIM

𝐅𝐀𝐔𝐋𝐓 pin
The FAULT pin (pin 8) is an open drain active-low output. This pin should be connected toan external pull-up resistor.
The FAULT pin is asserted low when:
IOUT reaches the programmed ILIM value
A short-circuit event occurs
The device goes into thermal protection

4.3.5Thermal protection
The thermal protection of the ST890 is triggered to turn off the switch when the junction
temperature exceeds 130 °C (typ.).

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ST890

4.4

Electrical information

Typical performance characteristics
Unless otherwise specified Tj = 25 °C.
Figure 4: ON resistance vs. supply voltage (A)Figure 5: ON resistance vs. supply voltage (B)Figure 6: ON resistance vs. temperature (A)Figure 7: ON resistance vs. temperature (B)Figure 8: Switching waveforms (A)Figure 9: Switching waveforms (B)DocID8649 Rev 10

9/19Package information

5ST890

Package information
In order to meet environmental requirements, ST offers these devices in different grades ofECOPACK® packages, depending on their level of environmental compliance. ECOPACK ®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.

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ST890

5.1

Package information

SO8 package information
Figure 10: SO8 package outline

Table 9: SO8 mechanical data
Dimensions
Ref.

Millimeters
Min.

Typ.

AInches
Max.

Min.

Typ.

1.75

0.069

A10.10

A21.25b0.28

0.480.011

0.019

c

0.17

0.23

0.007

0.010

D

4.80

4.90

5.00

0.189

0.193

0.197

E

5.80

6.00

6.20

0.228

0.236

0.244

E1

3.80

3.90

4.00

0.150

0.154

0.157

e

0.25

Max

0.004

0.010

0.049

1.27

0.050

h0.25

0.50

0.010

0.020

L

0.40

1.27

0.016

0.050

L1kccc

1.04
0°

0.040
8°
0.10

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0°

8°
0.004

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Package information

5.2

ST890

SO8 tape and reel information
Figure 11: SO8 tape and reel outline

1.

Drawing not to scale

Table 10: SO8 tape and reel mechanical data
Dimensions
Symbol

mm
Min.

Typ.

A

Max.

Min.

Typ.

330
12.8

D

20.2

0.795

N60

2.362

Ao

8.1

Bo

13.2

—

Max.
12.992CT

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Inches

0.504

22.4

0.519

—

0.882

8.5

0.319

5.5

5.9

0.216

0.232

Ko

2.1

2.3

0.082

0.090

Po

3.9

4.1

0.153

0.161

P

7.9

8.1

0.311

0.319

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0.335

ST890

5.3

Package information

DFN8L 3x3 package information
Figure 12: DFN8L 3x3 package outline

1.
2.

Drawing is not to scale
Dimensions in millimeters

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Package information

ST890
Table 11: DFN8L 3x3 mechanical data
Dimensions

Ref.

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

MaxA

0.80

0.85

0.90

0.031

0.033

0.035

A1

0

0.02

0.05

00.001

0.002

b

0.25

0.030

0.35

0.010

0.001

0.014

D

2.95

3

3.05

0.116

0.118

0.120

D2

2.30

2.40

2.50

0.091

0.094

0.098

E

2.95

3

3.05

0.116

0.118

0.120

E2

1.70

1.80

1.90

0.067

0.071

0.075

eL

0.65
0.25

0.30

0.026
0.35

0.010

Figure 13: DFN8L 3x3 recommended footprint

1.
2.

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Drawing not to scale
Dimensions in millimeters

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0.014

ST890

5.4

Package information

DFN8L 3x3 tape and reel information
Figure 14: DFN8L 3x3 tape and reel outline

1.

10 sprocket hole pitch cumulative tolerance ±0.20

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Package information

ST890
Figure 15: DFN8L 3x3 reel ouline

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ST8906

Ordering information

Ordering information
Table 12: Order codes
Order code

Temperature range

ST890CDR

0 to 70 °C

ST890BDR
ST890DTR-40 to 85 °C

PackageSO8DFN8L 3x3

DocID8649 Rev 10Packaging

MarkingST890C

Tape and reel

ST890B
UD91

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Revision history

7ST890

Revision history
Table 13: Document revision history
Date

Revision

Changes

22-Jul-2005

4

Added 3 rows on Table 2 on page 3

10-Aug-2007

5

Removed ST890CD and ST890BD from Table 1 on page 1
Updated short circuit current limit value in Table 8 on page 7

1-Dec-2007

6

Added Section : Contents.
Added ST890D and related DFN8L package information.
Added Figure 2: DFN8L (3 x 3 mm) pin connection (top view) on page 4.
Figure 3: Schematic diagram on page 5: redrawn, no content change.
Modified title in Table 5: Truth table for FAULT on page 5.
Updated Table 8: Electrical characteristics on page 7.
Figure 4: Typical application circuit on page 8: redrawn, no contentchange.

13-Oct-2008

7

Updated: Table 2 on page 3, Table 3 on page 4.
Added: Section 2.1: Functional description on page 9 and Figure 12 onpage 18.

04-Mar-20098

Replaced ST890B, ST890C and ST890D with ST890.
Modified: Table 6: Absolute maximum ratings
Updated Figure 1, Figure 3, Table 5, Section 2.1 (overlined “ FAULT ”
and “ ON ” pin, minor corrections).

25-Jan-2013

9

Updated Table 3 (added “Exposed pad”).
Added cross-references to Section 2.
Updated note 2. below Table 7.
Updated Table 8 (parameter of IOH symbol corrected to “ FAULT
output leakage current”).
Updated ECOPACK in Section 3.
Minor corrections throughout document.

12-Dec-2016

18/19

10

Updated datasheet layout
Table 4: "Absolute maximum ratings": removed reference to the "SURE"
program, updated name of parameter VI, and removed parameter Top.
Added Table 6: "Operating conditions"
Updated SO8 package information
Table 11: "DFN8L 3x3 mechanical data": added inches dimensions
Added Table 12: "Order codes"

DocID8649 Rev 10

ST890IMPORTANT NOTICE – PLEASE READ CAREFULLYSTMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, andimprovements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST
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