Processing electronics
with laser precision

In the microelectronics industry,
multiple devices are typically fabricatedat once on a single substrate
The substrate is then cut to separate

the individual components or circuits.
Substrates are typically ceramic or

FR4 composite, both of which can belaser cut. The non-contact nature of
the laser process minimises the riskof damaging the small components,
reducing waste and increasing
throughput.

Other applications for our CO2 lasers

include laser marking electronic

components, drilling holes in mobile

phone cases, cutting plastic films for

touch screens, and patterning plastic
screens for backlit displays.

Case study:
cutting FR4

Circuit boards can be cut mechanically,
but this produces a lot of dust anddebris, and risks delamination of theFR4 composite substrates. This in turn
may cause premature failure of thedevices on the board. Laser cutting istherefore an attractive alternative.

Although most FR4 composites havea tendency to char with CO2 laser

processing, degating of circuit boards
can be successful with some care. If
appropriate cutting parameters arechosen, the results may compare

favourably with those produced bymechanical cutting – charring can be

minimised, and the individual circuits
are separated without mechanicalcontact or stress.

Laser cutting FR4 composites on circuit boards

Case study:

ceramic cutting and drillingTechnical ceramics are widely used

the pulse width from 2µs to 1ms. The

are traditionally difficult to machine.

pulses and slow process speeds usuallyin the microelectronics industry, andThese materials are hard and brittle,

and components are generally small.
CO2 laser processing allows lines,

slots, holes and complex profiles tobe machined with no tool contact andreduced mechanical stress.

pulse regime of the laser is critical; longproduce superior results.

Alumina (Al2O3) is the most common

material, but we can also process otherceramics, including zirconia, aluminium
nitride and boron nitride.

CO2 laser processing

The laser process requires very careful

reduces mechanical

SR 15i is designed with ceramic

ceramics

control of the parameters; the Luxinar

processing in mind, allowing control ofstress on technicalCase study:

alumina scribing
Ceramic components can be separated by drilling a series of closely spaced blindholes along the required cutting line. The ceramic is then broken cleanly along thisline. In many cases this “scribe and break” technique is faster and more reliable thanfull cutting. The hole depth and separation must be precisely controlled in order toensure a clean break. The Luxinar SR 15i is particularly well suited to this application,offering pulse widths up to 1 millisecond for complete control of the scribing depth.

Laser scribing of alumina electronic
components is fast and reliableCase study:

marking electronic components
Lasers can be used to mark essential

Our lasers are able to mark on a variety

components, including diodes,and composites. Marks are indelible

information on all kinds of electronic
capacitors, transistors and IC chips.

Our CO2 laser markers can apply bothalphanumeric text and Data Matrix
codes to label components withvalues, specifications and certification
information.

of materials including ceramics, plastics
and robust, and will not be erased

during soldering or handling of thecomponents. Components can bemarked during production, with bothspeed and precision.

A variety of electronic components can bemarked by CO2 lasers

Case study:thin polarization film cutting

Growth in the display industry has driven
demand for higher power, more precise

processing quality and minimal heat effecton thin films during the cutting process.

Luxinar’s SR AOM, a range of CO2 lasers

The AOM-integrated

with an integrated AOM, has an optical rise/

30% less HAZ (courtesy of MDI)

unwanted heat accumulation when cutting

CO2 laser creates approximately

fall time of less than 1μs and minimisespolarization film (3-layer, 0.23mm thick)compared with traditional CO2 laser sources,
which typically produce longer pulse rise/falltimes of approximately 60μs.

Case study:thin projected capacitive
film cuttingThis film has a five-layer structure (upper

melts the silicone layers and causes them– touch film 65μm – adhesive silicone

outer layers that are difficult to peel off.

protection film 50μm – upper silicone 8μm
20μm – lower protection film 50μm) and isused to protect display screens. The upperand lower protection film layers have tobe easily peeled off after cutting. Usinga standard CO2 laser to cut these films

produces excess heat accumulation, whichto stick to the adjacent layers, resulting inUsing a Luxinar SR AOM, the cut quality of
the upper and lower protection film layers

is dramatically improved with a significant
reduction in the melted area. More

importantly, the adhesive silicone layer nolonger sticks to the neighbouring layers,thus creating an easy-peel protection film
layer as shown on the bottom left photo.
This CO2 laser with integrated AOM canachieve similar results to a picosecond
UV laser but with significantly lower
investment and maintenance costs.

193μm thickness film cut by a Luxinar
SCX 35 9μm

193μm thickness film cut by a Luxinar
SR 25 AOM 9μm

Case study:
PDLCD film
cutting

In polymer-dispersed liquid crystal

sector, where display technology isliquid crystals are mixed in a specific ratio

based devices. The ITO layers indisplay (PDLCD) films, polymers andbetween polyethylene terephthalate (PET)
and indium tin oxide (ITO) layers. Wheninactive, the liquid crystal droplets scatterand as they permeate the screen thisoften combined with microprocessorPDLCD film are very sensitive to heat,and discoloration of the material is aproblem when cutting with traditional
CO2 laser technology. Employing an

results in a turbid (opaque) state. WhenSR AOM 9μm laser can reduce thisdroplets align, allowing light to passrise and fall times minimise the residual

a voltage is applied, the liquid crystal

through. This turns the screen from a nontransparent to a transparent state and isfrequently used in the electronics

discoloration problem since the fastheat accumulation in the material. This

Edge of the PDLCD film: all layers haveextremely high quality cut edge.

no discoloration with the SR 25 AOM

reduction in the HAZ also results in an

been cut without damage and with almostBenefits of

CO2 lasers vs conventional
mechanical processing:• Non-contact process increases productivity• No tool wear or breakage means downtime is reduced• Lower tool cost (digital process)• High level of accuracy• Fast and consistent process reduces time to market• Flexible method that is easily automated• No/less maintenance• Mark a variety of materials (ceramics, plastics, composites)• Indelible, robust marking that won’t be erased during soldering or handling• No dust and debris or delamination of FR4 composite substrates(cutting circuit boards)• Reduced risk of premature failure of the devices on the board(cutting circuit boards)• No/reduced mechanical stress(degating circuit boards, ceramic cutting & drilling)• No tool contact (ceramic cutting & drilling)• Fast, precise scribing of ceramics/alumina• Less HAZ/reduced heat accumulation in film cutting• Higher quality machined finish of film cuttingSR AOM series – 150W and 75W
sealed CO2 laser sources

High-precision processing• Optical pulse rise/fall time < 1μs for high-precision processing, energy control and		 reduced heat affected zone

• Integrated, detachable and field replaceable RF power supply for ease of installation		 and servicing

Due to its precise pulse control, the SR AOM series is ideal for a variety of high-precision
processes such as microfilm cutting in the flat panel display market and scribing,engraving, marking and surface patterning applications that need less HAZ. Other thinfilm applications, including those in the automotive, electronics, lighting and flexible

packaging industries, can benefit from the higher quality cutting edge which the SR AOM
offers when compared to standard pulsed CO2 lasers.

A watertight laser technology
Our SR series CO2 laser sources, SR 08s, SR 10i, SR 15i, SR15s and SR 25i, are all IP66

rated to ensure a high level of protection against water and dust ingress. This, together
with the reliability that our customers have come to expect from Luxinar, guarantees awatertight laser technology.
• IP66 rating• Wavelengths 10.6µm, 10.25µm, 9.3µm• Integrated and field replaceable RF power supplies• Compact, lightweight laser sources• Simple diagnostics• Minimum shipment power 20% higher than rated power
The simple control interface and compact mechanical design of the units allow easy

integration into laser-based processing machines used for cutting, marking, perforatingand drilling, among others. Throughput, economy, flexibility and reliability are the mainfeatures associated with the SR series of CO2 laser sources.

SR series – 80-250W
sealed CO2 laser sourcesPower range of 20-350W• IP56 rating• Wavelength 10.6µm• Separate RF power supplies for flexible integration• Minimum shipment power 20% higher than rated power
The SCX 35 laser source, with an output power of up to 350W, is designed for integration
into industrial processing systems and is often used for cutting applications. It includes

a separate RF power supply which enables the laser to produce short optical pulses withhigh peak power or quasi-CW output. It is of a lightweight and robust design, and canbe integrated exceptionally well into systems with scanners or other beam guidancecomponents.

SCX 35 – 350W

sealed CO2 laser sources

OEM series – 450-1000W
sealed CO2 laser sources
Power outputs up to 1000W• Most lasers are available in wavelengths 10.6µm, 10.25µm, 9.3µm• A high quality, round, symmetrical beam for high-speed processing applications• Short optical pulse for improved edge quality and minimal HAZ• Minimum shipment power 20% higher than rated power

The OEM series of CO2 lasers represents a compact solution that can be easily integrated

into industrial processing production lines. The RF power supply enables the laser toproduce short optical pulses with high peak power or quasi-CW output. There is also theoption for an absorbing thin film reflector (ATFR) to prevent back reflection issues.
The OEM series lasers use a single resonator design, producing laser light with alinear polarisation. With a beam quality of K > 0.8, power and precision are defining

characteristics of these lasers. Since many equipment manufacturers purchase thisrange to integrate into their equipment, these OEM laser sources are available without
the laser housing, if desired.

Applications laboratories
Could a CO2 laser be used to enhance your electronics production process? We can help

you to find out by testing samples of your product.

Our applications lab facilities are open to both new and existing customers and OEMs.

Our laboratories are well equipped to carry out a range of processes, including marking
and cutting.

We offer rapid sample turnaround times, detailed application reports, and complimentary
advice from our experienced applications engineers.

We carry out application tests using your actual product samples. Guided by yourobjectives, we will try to replicate the conditions of your application as closely as possible
in the lab.

Upon completion, you will receive a detailed report outlining our findings, along withsome laser-processed samples for your evaluation. Most application tests can becompleted within 10 working days.

Whatever your process, we can help you to find the best laser for your application.

Contact us on https://www.luxinar.com/contact/ or info@luxinar.comFollow us on social media:© 2021 Luxinar Ltd 903-0272-00 Rev 1