IAM-20685
Automotive 6-axis MotionTracking® MEMS Device for ADAS andAutonomous Driving Applications
By leveraging its patented and volume-proven CMOSMEMS fabrication platform, which integrates Micro
Electro-Mechanical Systems (MEMS) wafers withcompanion CMOS electronics through wafer-levelbonding, TDK InvenSense has driven the package size
down to a footprint and thickness of 4.5x4.5x1.1 mm3 (24pin DQFN), to offer fully integrated, high performancecomponent in a very small form factor.

GENERAL DESCRIPTION
The IAM-20685 is a 6-axis MotionTracking® device thatcombines a 3-axis gyroscope and a 3-axis accelerometer ina small plastic package with wettable flanks option.
The IAM-20685 features:••
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ORDERING INFORMATION

IAM-20685 includes on-chip 16-bit ADCs, programmabledigital filters, and embedded seft-test. The device features
a VDD operating range of 3.0V to 5.5V, a separate digital
IO supply, VDDIO, from 3.0V to 5.5V, and a current
consumption below 10 mA in all the operating conditions.
The IAM-20685 has been developed according to ISO26262 with an automotive safety integrity level ASIL-B.
Fault detection over lifetime is achieved by a set ofembedded safety mechanisms (SMs) executed either atstartup, upon command, or run-time.

Navigation
Telematics and V2X
Autonomous driving
Automated parking
ADAS
Dead reckoning
High precise positioning
Vision systems image stabilization

PART NUMBERTEMPERATURE

PACKAGEMSL*

IAM-20685†−40°C to +105°C

24-Pin DQFN

3

†Denotes RoHS and Green-compliant package* Moisture sensitivity level of the package

BLOCK DIAGRAMMEMS & ANALOGDIGITAL
VDDIO

Safety Mechanisms and Safety Controller

VDD
GND

ALARMBODR

LV
HVCharge ChargePumpPump

TYPICAL OPERATING CIRCUITPLLSDZ Gyro
MEMS

SPI

MOSI
SCLK
MISO
NCS

IO
MUX

MOSI
SCLK
MISO
NCS

PLL

SD

Y Gyro
MEMS

PLL

BIAS

SD

X GyroMEMS

USR

AHB BUS•IAM-20685 address a wide range of automotive
applications, including but not limited to:Data Regsters•APPLICATIONS

Signal Conditioning•Six independent axes
Gyroscope with programmable full scale range from±41 dps to ±1966 dps
Accelerometer with programmable full-scale range
from ±2 g, to ±65 g
Minimal cross-axis sensitivity between theaccelerometer and gyroscope axes
MEMS structure hermetically sealed and bonded atwafer level10,000 g shock tolerant structure
Two temperature sensors
10 MHz, 32-bits Serial Peripheral Interface (SPI) with
CRC-based error-detecting code algorithmISO-26262 ASIL B
Automotive-qualified
Reliability testing performed according toAEC – Q100 grade 2 (-40°C to 105°C) qualification
Final test at three temperatures: -40°C, 25°C, 105°C

CFGSR
RESETNOTPCLKPLL (X)POR

REGOUT

MasterBias

Accel
BiasAccel
ChargePump

AnalogRegulator

PLL clock (X-Gyro)

X-AccelMEMSSD

Y-AccelMEMS

SDClocking••

Redundant DMA
DMA

Z-AccelMEMS

DMA coreSD

Timing GenTSD

Temp Sensors

TDK Corporation
1745 Technology Drive, San Jose, CA 95110 U.S.A+1(408) 988–7339
www.invensense.com

DMA TOP

POR DMA
Sequencer

DigitalRegulator

This document contains information on a preproduction product, and should not be considered
for production until qualification is complete.
InvenSense Inc. reserves the right to change
specifications and information herein without notice

OTP CTRL

Document Number: PB-000075
Revision: 1.1
Release Date: 11/03/2022

Control (PWR SEQ)

VPP

IAM-20685
REVISION HISTORYREVISION DATEREVISIONDESCRIPTION

12/23/2019

1.0

Initial Release

11/03/2022

1.1

Block diagram review

This information furnished by InvenSense, Inc. (“InvenSense”) is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense
for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice.
InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance, without
prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document.
InvenSense assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products andservices detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or otherintellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise
under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registeredtrademarks are the property of their respective companies. InvenSense sensors should not be used or sold in the development, storage, production orutilization of any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life criticalapplications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disasterprevention and crime prevention equipment.
©2017—2022 InvenSense. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, AAR,
and the InvenSense logo are trademarks of InvenSense, Inc. The TDK logo is a trademark of TDK Corporation. Other company and product names may be
trademarks of the respective companies with which they are associated.

©2017—2022 InvenSense. All rights reserved.

Document Number: PB-000075
Revision: 1.1

InvenSense Confidential & Proprietary

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