MODEL: R3-ND3Remote I/O R3 Series

SPECIFICATIONS OF OPTION: Q (multiple selections)
COATING (For the detail, refer to our web site.)/C01: Silicone coating/C02: Polyurethane coating/C03: Rubber coating
EX-FACTORY SETTING/SET: Preset according to the Ordering Information Sheet(No. ESU-8353)

DeviceNet INTERFACE MODULE(for 64-point analog signals)
27.5 [1.08]

130[5.12]RELATED PRODUCTS• EDS file(downloadable at our web site.)109[4.29]
mm [inch]

GENERAL SPECIFICATIONSMODEL: R3-ND3-[1][2]ORDERING INFORMATION• Code number: R3-ND3-[1][2]Specify a code from below for each of [1] and [2].
(e.g. R3-ND3-R/CE/Q)• Specify the specification for option code /Q(e.g. /C01/SET)[1] POWER INPUT
N: No power supply
AC Power
K3: 100 – 120 V AC
(Operational voltage range 85 - 132 V, 47 - 66 Hz) *(CE not available)
L3: 200 – 240 V AC
(Operational voltage range 170 - 264 V, 47 - 66 Hz) *(CE not available)
DC Power
R: 24 V DC
(Operational voltage range 24 V ±10 %, ripple 10 %p-p max.) ** Not selectable for use with independent power modules or
network modules with the internal power input options.

[2] OPTIONS (multiple selections)

Connection
DeviceNet: Euro type connector terminal(applicable wire size: 0.2 to 2.5 mm2, stripped length 7 mm)
Internal bus: Via the Installation Base(model: R3-BSx)
Internal power: Via the Installation Base (model: R3-BSx)
Power input, RUN contact output: M3 separable screw
terminal (torque 0.5 N·m)
Screw terminal: Nickel-plated steel
Isolation: DeviceNet to internal bus or internal power topower input to RUN contact output to FG
Input error data setting: Input value setting at input module
error with side DIP SW
Dual communication setting: Set with the side DIP switch
Data allocation setting: Set with the side DIP switch■ RUN CONTACT OUTPUT
RUN contact: Turns ON when both MS and NS LEDs aregreen (DeviceNet in normal communication).
Rated load: 250 V AC @ 0.5 A (cos ø = 1)
30 V DC @ 0.5 A (resistive load)(Less than 50 V AC to conform with EU Directive)
Maximum switching voltage: 250 V AC or 30 V DC
Maximum switching power: 250 VA or 150 W
Minimum load: 1 V DC @ 1 mA
Mechanical life: 2 × 107 cycles (300 cycles/min.)
When driving an inductive load, external contact protection
and noise quenching recommended.

Standards & Approvals
blank: Without CE/CE: CE marking
Other Options
blank: none
/Q: Option other than the above (specify the specification)

R3-ND3 SPECIFICATIONS

MG CO., LTD.
www.mgco.jp

ES-8382 Rev.18 Page 1/7

MODEL: R3-ND3
DeviceNet COMMUNICATION
Transmission cable: Approved for DeviceNet
Node address setting: DIP switch; 00 – 63
Baud rate: 125 kbps, 250 kbps, 500 kbps DIP switch
NS (Network Status) indicator: Bi-color (green/red) LED
indicates status of the communication link.
MS (Module Status) indicator: Bi-color (green/red) LED
indicates device status.
Data allocation: 64 words for input data 67 words for output
dataINSTALLATIONPower consumption•AC: Approx. 20 VA•DC: Approx. 12 W
Current consumption (no power supply): 80 mA
Output current (power supply): 270 mA continuous at 20 V
DC; 420 mA for 10 minutes
Supply voltage to network: 11 – 25 V DC supplied throughthe network terminal block
Supply current to network: 50 mA max.
Operating temperature: -10 to +55°C (14 to 131°F)
Operating humidity: 30 to 90 %RH (non-condensing)
Atmosphere: No corrosive gas or heavy dust
Mounting: Installation Base (model: R3-BSx)
Weight: 200 g (0.44 lb)

PERFORMANCE
Insulation resistance: ≥ 100 MΩ with 500 V DC
Dielectric strength: 1500 V AC @ 1 minute(DeviceNet to internal bus or internal power to power input
to RUN contact output to FG)

STANDARDS & APPROVALS
EU conformity:
EMC Directive
EMI EN 61000-6-4
EMS EN 61000-6-2
RoHS Directive

R3-ND3 SPECIFICATIONS

MG CO., LTD.
www.mgco.jpES-8382 Rev.18 Page 2/7

MODEL: R3-ND3EXTERNAL VIEW
■ FRONT VIEW

■ SIDE VIEW
Node Address & Baud Rate

MS Indicator LED

DR1DR0NA5NA4NA3NA2NA1NA087654321Baud Rate
Setting
NodeAddressSetting

NS Indicator LED

Configuration JackDIP SW
SW34321ONEuro TypeConnector Terminal

ON1452

SW287654321ON

3SW187654321ON6R3-ND3 SPECIFICATIONS

MG CO., LTD.
www.mgco.jpES-8382 Rev.18 Page 3/7MODEL: R3-ND3TRANSMISSION DATA DESCRIPTIONSThe DIP SW located at the side of the module specifies each I/O module's data allocation (occupied data area).
For example, when the data areas are assigned as shown below:
Module 14Module 2
4Module 34Module 41Module 51Module 61Module 7
1Then the I/O data are assigned as in the figures below:■ OUTPUT DATA
The figure below shows the allocation of the data sent fromthe network module to the master.
Begin
Address +0150

Begin
Address +0

Module 1+2

15Module 2+6

Module 1+2

Module 2+6+8+8Module 3+10Module 4

Module 3+10+12

Module 6

Module 4
Module 5

Module 5+140+4+4+12■ INPUT DATAThe figure below shows the allocation of the data sent fromthe master to the network module.

+14Module 6
Module 7

Module 7+16+16+63+64

Module Status
Error Status+66

Data Error Status

Module Status, Error Status and Data Error Status are assigned to +64, +65 and +66 respectively.
Each module can handle either input or output data. Input and output cannot be mixed in one module.
Input data from the master device is transferred to the module's output data area. The master device can read from the output
data area the data it has set.
• Module Status indicates whether individual I/O modules are mounted or not. The bit corresponding to the mounted slot
turns to “1,” and the unmounted slot to “0.”• Error Status indicates error status for each module as described below. The bit corresponding to such module turns to “1.”R3-TSx, R3-RSx, R3-US4: Input burnout
R3-DA16A:
Power input in error or disconnected
R3-YSx:
Output current error (e.g. load unconnected)
R3-PC16A:
External power supply in error or disconnected• Data Error Status indicates overrange (R3-US4: out of -10% to +110%; the other types: out of -15% to +115%) status for eachmodule. The bit corresponding to such module turns to “1.”R3-ND3 SPECIFICATIONS

MG CO., LTD.
www.mgco.jp

ES-8382 Rev.18 Page 4/7

MODEL: R3-ND3MODULE STATUS, ERROR STATUS, DATA ERROR STATUS
Shows each module's availability and error status.
150Module 1
Module 2
Module 3:
Module 16

I/O DATA DESCRIPTIONS
The data allocations for typical I/O modules are shown below.
Refer to the manual for each module for detailed data allocations.
■ ANALOG DATA (16-bit data, models: R3-SV4, YV4, DS4, YS4, US4, etc.)
16-bit binary data.
Basically, 0 to 100% of the selected I/O range is converted into 0 to 10000 (binary).
-15 to 0 % is a negative range represented in 2’s complement.
In case of R3-US4, -10 to 0% is a negative range represented in 2's complement.
150■ TEMPERATURE DATA (16-bit data, models: R3-RS4, TS4, US4, etc.)
16-bit binary data.
With °C temperature unit, raw data is multiplied by 10. For example, 25.5°C is converted into 255.
With °F temperature unit, the integer section of raw data is directly converted into the data.
For example, 135.4°F is converted into 135.
Minus temperature is converted into negative values, represented in 2’s complements.
150■ ANALOG DATA (16-bit data, models: R3-CT4A, CT4B, etc.)
16-bit binary data.
Integer obtained by multiplying unit value (A) by 100.
In case of CLSE-R5, integer obtained by multiplying unit value (A) by 1000.
150■ ACCUMULATED COUNT DATA (32-bit data, models: R3-PA2, PA4A, WT1, WT4, etc.)
32-bit binary data is used for accumulated counts and encoder positions.
Lower 16 bits are allocated from the lowest address to higher ones, higher 16 bits in turn.
150+0

Lower 16 bits
15+10
Higher 16 bits

R3-ND3 SPECIFICATIONS

MG CO., LTD.
www.mgco.jpES-8382 Rev.18 Page 5/7

MODEL: R3-ND3■ BCD DATA (32-bit data, models: R3-BA32A, BC32A, etc.)
32-bit binary data is used for BCD.
Lower 16 bits are allocated from the lowest address to higher ones, higher 16 bits in turn.
150+0Lower 16 bits
150+1Higher 16 bits

■ 16-POINT DISCRETE DATA (models: R3-DA16, DC16, etc.)
150

Input 1 (Output 1)
Input 2 (Output 2)
Input 3 (Output 3)::
Input 16 (Output 16)
0 : OFF
1 : ONEXTERNAL DIMENSIONS & TERMINAL ASSIGNMENTS unit: mm [inch]

130 [5.12]

27.5 [1.08]

109 [4.29]

1562

6.2
[.24]

6–M3SCREW

43TERMINAL
COVER

R3-ND3 SPECIFICATIONSMG CO., LTD.
www.mgco.jp

POSITIONINGGUIDEES-8382 Rev.18 Page 6/7

MODEL: R3-ND3SCHEMATIC CIRCUITRY & CONNECTION DIAGRAM
Note: In order to improve EMC performance, bond the FG terminal to ground.
Caution: FG terminal is NOT a protective conductor terminal.
LED

DIP SW

Isolation
Control
CircuitCommunication
CircuitDIP SW

RUN + 1RUN CONTACT OUTPUT
RUN – 4
*U (+) 2*

POWER INPUTBUS CONNECTORV+CAN_H
To OtherDeviceNet Drain
DevicesCAN_L
V–INTERNAL BUS

INTERNAL POWER

5V (–) 3* FG 6
CONFIGURATION JACKJACK*Not provided with ‘No Power Supply’ type module.

Specifications are subject to change without notice.

R3-ND3 SPECIFICATIONS

MG CO., LTD.
www.mgco.jp

ES-8382 Rev.18 Page 7/7