VRM = 200 V, IF(AV) = 10 A, trr = 30 ns
Fast Recovery DiodeSPXS-2102S

Data Sheet

DescriptionPackage

The SPXS-2102S is a fast recovery diode of 200 V /10 A. The maximum trr of 30 ns is realized by optimizing
a life-time control. The low thermal resistance packageachieves high performance in terms of heat dissipation.

TO252-2L(4)

Features● VRM---------------------------------------------------- 200 V● IF(AV)-----------------------------------------------------10 A● VF ---------------------------------------------------- 1.25 V● trr1 ------------------------------------------------------- 30 ns● Bare Leads: Pb-free (RoHS Compliant)● Flammability: Equivalent to UL94V-0(1) (2) (3)(1)

Applications● Secondary-side Rectifier Diode(Flyback Converter, LLC Converter, etc.)● Freewheel Diode(Offline Buck Converter, Offline Buck-boostConverter, etc.)

SPXS-2102S-DSE Rev.1.0
SANKEN ELECTRIC CO., LTD.
Jan. 06, 2021
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 2019(3)
(2)(4)(1) Anode(2) Cathode(3) Anode(4) CathodeNot to scale

1

SPXS-2102S
Absolute Maximum Ratings
Unless otherwise specified, TA = 25 °C.
ParameterSymbol(1)
Nonrepetitive Peak Reverse Voltage
VRSM(1)
Repetitive Peak Reverse Voltage
VRM
Average Forward Current
IF(AV)
Surge Forward Current(1)IFSM

I2t Limiting Value(1)Junction Temperature
Storage TemperatureI2t
TJ
TSTG

Conditions

See Figure 3 and Figure 4
Half cycle sine wave,
positive side, 10 ms, 1 shot
1 ms ≤ t ≤ 10 ms

Rating20020010UnitVVA65

A

21− 40 to 150− 40 to 150

A2s°C°C

Electrical Characteristics
Unless otherwise specified, TA = 25 °C.
Parameter
SymbolForward Voltage Drop(1)VF

Reverse Leakage Current(1)Reverse Leakage Current
under High Temperature(1)IRConditions
TJ = 25 °C, IF = 5.0 A
TJ = 100 °C, IF = 5.0 A
VR = VRM

H∙IR

VR = VRM, TJ = 150 °C——10mAIF = IRP = 100 mA,90% recovery point, TJ = 25 °C
IF = 100 mA, IRP = 200 mA,75% recovery point, TJ = 25 °C——30ns

—

—

25ns

—

—

5.0°C/W

Typ.
0.32

Max.
—

Unitg

trr1
Reverse Recovery Time(1)trr2Thermal Resistance (2)Rth(J-C)

(3)

Min.
—
—
—

Typ.
—
0.82
—

Max.
1.25
—
50UnitVVµA

Mechanical Characteristics
Parameter
Package Weight

Conditions

Min.
—

Copper area

5.0 mm

TCBoard

5.8 mm
20 mm

2.2 mm
4.0 mm
1.6 mm
3.0 mm
30 mm

Figure 1.

Case Temperature Measurement Point

Figure 2.

Glass-epoxy Board(1)

Specifies a value per chip; the SPXS-2102S consists of two chips.
Refers to thermal resistance between junction and the case.
(3)
The device is mounted on the glass-epoxy board (PCB: 42 mm × 32 mm in size, 1 mm in thickness, copper area: see
Figure 2).
(2)

SPXS-2102S-DSE Rev.1.0
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Jan. 06, 2021
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Derating Curves
10108

Average Forward Current, IF(AV) (A)Average Forward Current, IF(AV) (A)Sine wave
DCt/T = 1/2t/T = 1/3, sine wave

6t/T = 1/642tt/T = 1/28DC

6t/T = 1/34t/T = 1/62t

TT0507090110

13001505070

Figure 3.

90110130150Case Temperature, TC (°C)

Case Temperature, TC (°C)
IF(AV) vs. TC (TJ = 150 °C, VR = 0 V)

Figure 4.

IF(AV) vs. TC (TJ = 150 °C, VR = 200 V)

Characteristic Curves
3.5

Maximum Reverse Power Dissipation, P R(MAX) (W)

Maximum Forward Power Dissipation, P F(MAX) (W)

1816tt/T = 1/6T

1412t/T = 1/3, sine wave

108t/T = 1/26DC

423.0tT

2.51−t/T = 5/6

2.01−t/T = 2/3

1.51−t/T = 1/2

1.00.5Sine wave

0.0002

468

100

Average Forward Current, IF(AV) (A)Figure 5.

PF(MAX) vs. IF(AV) (TJ = 150 °C)

50

100

150200

Reverse Voltage, VR (V)Figure 6.

SPXS-2102S-DSE Rev.1.0
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Jan. 06, 2021
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PR(MAX) vs. VR (TJ = 150 °C)

3

SPXS-2102S

100
1.E-02
TJ = 150 °C

Reverse Leakage Current, IR (A)Forward Current, IF (A)10
TJ = 150 °C

10.1

TJ = 100 °C

0.01

1.E-03

1.E-04
TJ = 100 °C

1.E-05

1.E-06

TJ = 25 °C

TJ = 25 °C

0.001
0.0

0.5

1.0

1.5

2.0

2.5

1.E-070

Forward Voltage Drop, VF (V)Figure 7.

50100150200

Reverse Voltage, VR (V)Typical Characteristics: IF vs. VF

Figure 8.

Typical Characteristics: IR vs. VR

100Thermal Resistance (°C/W)

Rth(J-A)

10Rth(J-C)
10.1
1m

10m

100m

1101001000

Pulse Width (s)Figure 9.

Typical Transient Thermal Resistance Characteristics

SPXS-2102S-DSE Rev.1.0
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Jan. 06, 2021
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4

SPXS-2102S
Physical Dimensions● TO252-2L PackageSymbolE
L
L1
L2
L3
L4
L5
DHbb2
b3eA
A1cc2
D1
E1
θDimensions
NOM MAX
6.60
6.731
1.52
1.77
2.743 (REF)
0.508 (BSC)
0.89
—
1.27
0.64
—
1.01—
—
—
6.00
6.10
6.223
9.40
10.00 10.40
0.64
0.76
0.88
0.77
0.84
1.14
5.21
5.34
5.46
2.286 (BSC)
2.20
2.30
2.38
0—
0.127
0.46
0.50
0.60
0.46
0.50
0.58
5.21
—
—
4.40
—
—
0°
—
10°

MIN
6.40
1.40

NOTES:- Dimensions in millimeters- All the dimensions exclude mold flashes.
- Bare lead frame: Pb-free (RoHS compliant)- Moisture Sensitivity Level 1 (MSL 1)- When soldering the products, it is required to minimize the working time within the following limits:
Flow: 260 °C / 10 s, 1 time
Reflow:Preheat: 150 °C to 200 °C / 60 s to 120 s
Solder heating: 255 °C / 30s, 2 times (260 °C peak)
Soldering Iron: 350 °C / 3.5 s, 1 time

SPXS-2102S-DSE Rev.1.0
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Jan. 06, 2021
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5SPXS-2102S● TO252-2L Land Pattern Example
6.50

3.00

1.40

4.60

6.00
2.30

Dimensions in millimeters

6.25

Marking Diagram

Specific Device Code (See Table 1)
YWWXXXXX

Lot Number:
Y is the last digit of the year of manufacture (0 to 9)
WW is the week number (01 to 53)
XXXXX is the control number

Table 1. Specific Device CodeSpecific Device CodePart Number

XS2102

SPXS-2102S

SPXS-2102S-DSE Rev.1.0
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Jan. 06, 2021
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6

SPXS-2102S
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DSGN-CEZ-16003

SPXS-2102S-DSE Rev.1.0
SANKEN ELECTRIC CO., LTD.
Jan. 06, 2021
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 20197