Bonetown Activation Serial Keygen [REPACK] 150
IMDb2. Quickly learn how to use the IMDb by getting access to these helpful tools.7 days ago.[English] ‎(Booklet, 208 pages). Home · Upload · FAQ · Download · Register · Invite · Account Guide · Vote · Surveys · Site Map · Points · Sign up.The invention relates to a process for the production of a silicon wafer having a low edge scar. Silicon wafers are produced by slicing a single crystal ingot
obtained by the Czochralski process, passivating the surface of the silicon wafer by a chemical etching process, and grinding and polishing the wafer. Now, the grinding and polishing of the silicon wafer is carried out by using a large size grinding wheel. During this operation, the silicon wafer is rotated at a high speed of 100 to 150 rpm. As a result, small grains of silicon are dug out from the siliconwafer, to form small valleys in the boundary region between the silicon wafer and the grinding wheel. Then the silicon wafer is polished using a rotary polishing pad. However, such a silicon wafer produced by the grinding and polishing process has a lot of valley scars in the vicinity of the boundary of the silicon wafer. Then the silicon wafer is subjected to a back grinder process for back grinding thesilicon wafer. In the back grinder process, water or etching liquid is sprayed on the silicon wafer, and the silicon wafer is grinded by the back grinder. As a result, the silicon wafer is ground and polished all over its surface. However, the silicon wafer is sometimes not ground and polished to the edge of the silicon wafer, and therefore a so-called edge scar is formed in the boundary between the siliconwafer and the edge. In order to prevent this edge scar from being formed in the silicon wafer, it is known to spray the water or etching liquid directly on the edge portion of the silicon wafer before the silicon wafer is subjected to the back grinder process. However, as the spraying is repeated, the water or etching liquid often collects in the valley scar in the vicinity of the boundary between the siliconwafer and the edge. This collection of water or etching liquid prevents the edge from being satisfactorily polished. If the edge of the silicon wafer is not satisfactorily polished, the machined state of the silicon wafer is detected byDownload
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Bonetown Activation Serial Keygen REPACK 150