SPECIFICATION AND PERFORMANCE
Series

119A-XXA00-R02

File

119A-XXA00-R02_spec_4

Date2020/04/16

Scope:

This specification covers the requirements for product performance, test methods andquality assurance provisions of below table
P/N
119A-40A00-R02
119A-56A00-R02
119A-80A00-R02
119A-92A00-R02

Description
Mini PCI Express Socket, GF, Reel, H=4.0mm, (w/Logo)
Mini PCI Express Socket, GF, Reel, H=5.6mm, (w/Logo)
Mini PCI Express Socket, GF, Reel, H=8.0mm, (w/Logo)
Mini PCI Express Socket, GF, Reel, H=9.2mm, (w/Logo)

Performance and Descriptions:

The product is designed to meet the electrical, mechanical and environmental performancerequirements specification. Unless otherwise specified, all tests are performed at ambientenvironmental conditions.

RoHS:All material in according with the RoHS environment related substances list controlled.

MATERIALSNO.

PART NAME

1HOUSING

2CONTACT

3

HOLD DOWNDESCRIPTIONLCP MG350, UL94V-0, Black
Phosphor Bronze, C5191
Contact Area: Gold Flash, solder area: 100u” matte Tin, all under plated
50u” Nickel
Brass, C2680,
Solder area: 100u” matte Tin plated, under plated 50u” NickelRATING
Rated Voltage
Rated Current
Operating Temperature
Storage Temperature
Durability

Item

Contact Resistance

50V AC
0.5A-40°C to +85°C-40°C to +85°C
50 cycles

ELECTRICAL

Requirement

Initial: 30mΩ Max.
After test 20mΩ change max.

Test Condition

Solder connectors on PCB and matethem together, measure by applying
closed circuit current of 100mA

The information contained herein is exclusive property of ATTEND. Do not copy and print except that Attend
accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-1 -Insulation Resistance

Initial: 500Ω Min.
After: 100MΩ Min.

Dielectric Withstanding
Voltage

No breakdown

maximum at open circuit voltage of20mV (max).
(JIS C5402 5.4)
Apply 500V DC between adjacentcontacts, or contact and ground.
(MIL-STD-202 METHOD 302)
Mate connectors; apply 250V AC at
60Hz (rms.) between two adjacent for 1minute. (Trip current:0.5mA)(MIL-STD-202 METHOD 301)

Item

MECHANICAL

Requirement

Test Condition

Contact Normal Force

50gf per pin Min.

The normal force of the individual
contact shall be 50 gf minimum

Contact Retention Force

180gf per pin Min.

Place a connector on the push-pullmachine, then apply a force on acontact head and push the contact tothe opposite direction of the contact
insertion at the speed of 25±3mm/min.

Durability(EIA364-29)
FinishAfter 50 mating and un-mating cycles

1.Contact Resistance:with 1.0mm thick board at the rate of50mΩ Max.
2.No Damage

25±3mm/min.
The connector shall be of no damage tothe housing or contacts. The connector
shall also meet the requirements ofcontact resistance in the paragraph 5.1

Shock(EIA364-09)
FinishSolder connectors on PCB and mate1. No electrical discontinuity

them together, subject to following

more than 0.1μs.

shock conditions, 3 shocks shall be2 .No Damage

period along 3 mutually perpendicular

3. Contact Resistance: 50mΩaxis, passing DC 1mA current duringMax.

the test.
50G,11ms Half-sine

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.
本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-2 -(MIL-STD-202 METHOD 213)

ENVIRONMENTAL

ItemRequirement

Humidity Test

Test Condition

FinishHumidity storage at 40±3°C with

1. Contact Resistance:

90±5% RH for 96 hours.

50mΩ Max.

Salt Mist Test

2. Insulation Resistance:
100MΩ Min.

(EIA364-31)

Finish

5±1% salt solutions, at 35±2°C

1. Contact Resistance:

duration 24 hours.

50mΩ Max.

Connectors detached

2 .No Damage
Thermal ShockStage

1. Contact Resistance:t3
t2(MIL-STD-1344)

Finish50mΩ Max.

t4

2. Insulation Resistance:
100MΩ Min.

t1

Temp

Time

t1

-55±5°C

30 mint2-55±5°C~+85±5°C

5 min

t3

+85±5°C

30 mint4+85±5°C~-55°C±5°C5 min

Test time: 5 cycles(MIL-STD-202 METHOD 107)

Heat ResistanceFinishSolder connectors on PCB and mate

1. Contact Resistance:them together, expose to 85±2°C for50mΩ Max.

48hrs. Upon completion of the exposure

2. Insulation Resistance:

period, the test specimens shall be

100MΩ Min.

conditioned at ambient room conditionsfor 1 of 2hrs, after which the specified
measurements shall be performed.
(MIL-STD-202 METHOD 108)

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.
本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-3 -Solderability

SOLDER ABILITY

95% of immersed area mustshow no voids , pin holes

Dip solder tails into the moltensolder(held at 230±5 °C) up to0.5mm from the tip of tails for 3±0.5
seconds.
(MIL-STD-202 METHOD 208)

Resistance to soldering heat

No melting, cracks or functional
damage allowed

All connectors designed for PCB
soldering within this specification must
be able to withstand the heat fromsolder oven according to the graphbelow. The cycle should be repeatedtwice.
(MIL-STD-202 METHOD 210)Preheating temperature: 150 ~ 200°C, 60~120 seconds
Liquidus temperature (TL): 217°C, 60~150 seconds
Peak temperature: 260°C
Time within 5 °C of peak temperature (Tc): 255°C, 30seconds

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.
本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-4 -TEST SEQUENCE
No.

Test Item

1

Contact Resistance2

Insulation Resistance3

Dielectric Withstanding Voltage

4

Contact Normal Force5

Contact Retention Force

6Durability Life7Shock8Temperature Shock

9Heat Resistance

10Humidity

11Salt Spray

12Solder ability

13

Resistance to Soldering HeatSample Quantity

ABCDEFGH

1,3

1,3

1,3

1,3

1,4

1,3IJ

2,5
11222232
114444444444

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.
本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-5 -