Application Note

RA Family
Using QE and FSP to Develop Capacitive Touch Applications
Introduction
This document demonstrates the necessary steps for creating an application example that integrates
capacitive touch sensing using Renesas RA Microcontrollers.

Target Device
RA family with Capacitive Touch Sensing Unit (CTSU, CTSU2)

Contents
1.

Application Example Overview ................................................................................................ 2

2.

Related Documents .................................................................................................................2

3.

High Level Integration Steps .................................................................................................... 2

4.

Required Development Tools and Software Components ........................................................ 2

5.

Application Example Overview ................................................................................................ 3

6.

Capacitance Touch Application Development Procedure......................................................... 3

6.1

Project Creation ....................................................................................................................................... 3

6.2

Using RA Configurator to Add Modules .................................................................................................. 6

6.3

Creating the Capacitive Touch Interface ............................................................................................... 18

6.4

Modifying Debug Session for Capacitive Touch Tuning ....................................................................... 22

6.5

Tuning the Capacitive Touch Interface Using QE for Capacitive Touch Plug-in .................................. 23

6.6

Adding rm_touch middleware API Calls to Application Example .......................................................... 26

6.7

Monitoring Touch Performance Using e2studio Expressions Window and QE for Capacitive Touch... 30

6.8

Monitoring Touch Performance with QE for Capacitive Touch Using Serial Communication .............. 36

7.

qe_touch_sample.c Listing After Modifications ...................................................................... 38

7.1

When Using a Software Trigger to Start the CTSU Measurement Process ......................................... 38

7.2

When Using an External Trigger to Start the CTSU Measurement Process ........................................ 40

Website and Support .................................................................................................................... 42
Revision History ............................................................................................................................ 43

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1. Application Example Overview
This document demonstrates how to implement capacitive touch sensing functions using Renesas RA MCUs
using the following procedures:••

Create a project using the RA Smart Configurator with the RA6M2 MCU board or RA2L1 MCU board
Create a capacitive touch interface with QE for Capacitive Touch for tuning and monitoring.

2. Related Documents
This application example is intended to give the user a short introduction to creating a working RA capacitive
touch sensing project. A thorough review of all the applicable documentation for the e2 studio/RA Smart
Configurator, Flexible Software Package (FSP) drivers/middleware, and QE for Capacitive Touch plug-in
help (contained within the e2 studio IDE help index) is strongly suggested to answer any questions or for
more details on usage of any of the tools utilized in this application example.

3. High Level Integration Steps
The following high-level steps give the reader an overview of how to integrate touch detection into thisproject. These same steps should apply to any typical user development application.
1. Create a new project with the e2 studio project creation wizard.
2. Use the RA Smart Configurator to add the required modules to the created e2 studio project.
3. Use the QE for Capacitive Touch e2 studio plug-in to create the capacitive touch interface.
4. Use the QE for Capacitive Touch e2 studio plug-in to tune the application project.
5. Add the needed FSP module API calls to the user project to enable capacitive touch sensing operationsin the application.
6. Monitor the application project using QE for Capacitive Touch e2 studio plug-in to demonstrate capacitive
touch sensing detection.

4. Required Development Tools and Software Components
This project utilizes the following development environment:
Table 1.

Development Environment

Development Tool
Software Components
Board kit

Renesas e2 studio Integrated
Development Environment (IDE)
GCC ARM Embedded Compiler
Renesas QE for Capacitive
Touch
Flexible Software Package (FSP)

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RA6M2 (CTSU)

RA2L1 (CTSU2)

RA6M2 MCU Group Evaluation
Kit (EK-RA6M2)

RA2L1-embedded CapTouch
CPU Board(RTK0EG0022S01001BJ)

2023-07 or later
12.2.1.20230214 or later
3.3.0 or later
4.6.0 or later

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5. Application Example Overview
In the main loop of the application example, the following processing is performed as shown in Figure 1.
A code listing of the completed application example after modifications is provided in section 7,
qe_touch_sample.c Listing After Modifications for review.
A call to the RM_TOUCH_ScanStart()API starts the measurement (scanprocess).
The RM_TOUCH_ScanStart()API return value is checked to determine if the
rm_touch middleware is ready for processing.

If the middleware is ready, a call to the RM_TOUCH_DataGet()API
determines if there is a touch on the target sensor board.
Figure 1.

Application Example Overview

6. Capacitance Touch Application Development Procedure
6.1

Project Creation

1. On your PC, start the e2 studio IDE using the Windows > Start menu or the icon on your desktop. Whenthe dialog appears, create the Workspace wherever you like.
2. Start a new project by clicking File > New > Renesas C/C++ Project > Renesas RA from the e2 studiomenu.
3. When the New C/C++ Project dialog box opens, select “Renesas RA CC++ Project”, then click Next.
4. In the Renesas RA C/C++ Project wizard, go to the Project Name and Location page and enter a
Project Name (any name can be used).
The example here uses Capacitive_Touch_Project_Example. When you have entered your project
name, click Next.
5. Next, in the Device and Tools Selection dialog box, select the following:
Table 2.

Device and Toolchain Selection

Item
FSP Version
Board
DeviceToolchains
Debugger

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RA6M2 (CTSU)
4.6.0
EK-RA6M2
R7FA6M2AF3CFB
GNU ARM Embedded
12.2.1.20230214
J-Link ARM

Rev.3.00

RA2L1 (CTSU2)
RSSK-RA2L1
R7FA2L1AB2DFP

J-Link ARM, E2 (ARM)OR

E2 Lite (ARM)

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Figure 2.

Device and Toolchain (RA6M2)

Figure 3. Device and Toolchain (RA2L1)
6. Once complete, click Next.
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7. In the Build Artifact and RTOS Selection dialog box, select the following:
Table 3.

Build and RTOS Selection

Item
Build Artifact Selection
RTOS Selection

RA6M2 (CTSU)
Executable
No RTOS

Figure 4.

RA2L1 (CTSU2)

Build and RTOS Selection

8. Once complete, click Next.
In the next dialog box, Project Template Selection, select “Bare Metal – Minimal”, then click Finish.

Figure 5.

Project Template Selection

Once complete, the RA Smart Configurator perspective appears in the e2 studio default window, ready for
project configuration. This completes the new project creation process.
Using RA Configurator to Add Modules
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Using QE and FSP to Develop Capacitive Touch Applications

Using RA Configurator to Add Modules

1. Using the tabs in the lower-middle pane of the e2 studio, select the BSP tab to display the Board Support
Package (BSP) configuration.

Figure 6.

BSP Tab

2. To set the power supply, select the following from the lower-left of the e2 studio screen: Properties >Settings > RA Common > MCU Vcc (mV). For this example, the MCU Vcc (mV) is set to 3300 mV.

Figure 7.

Power Supply Voltage Setting

3. Select the Clocks tab to configure the clocks.

Figure 8.
4.

Clocks Tab

For this example, the following settings are used.

Table 4.

Clocks ConfigurationClock
PLL Src
Clock Src
PCLKB

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RA6M2 (CTSU)XTALPLLPCLKB Div /4

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RA2L1 (CTSU2)- (no setting)HOCO
PCLKB Div /2

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Figure 9.

Clocks Configuration (RA6M2)

Figure 10.

Clocks Configuration (RA2L1)

5. Next, select the Pins tab. Assign the pins in order to connect the sensor port of the MCU to the
Capacitive Touch Application Board.
Note:

Depending on the selections made in Device Selection > Board when creating the project, thesensor port may be assigned to the TS pin by default.

Figure 11.
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Pins Tab
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6. Under Pin Selection, expand Peripherals. Open Input:CTSU and select CTSU0.

Figure 12

Select Peripherals (CTSU0)

7. In Pin Configuration, change the Operation Mode from “Disabled” to “Enabled”.

Figure 13.

Operation Mode (CTSU0)

8. Enable the TS pins that you will be using. Since RA2L1 (CTSU2) can control the output of nonmeasurement pins at once, all TS pins should be enabled. In this application example, the following TS
pins are assigned for use in capacitive touch interface, and so forth.
Table 5.

TS Pins Used in Application Example

Item
TS pins used in the application
exampleRA6M2 (CTSU) TSCAP pin


Figure 14.

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TS2 pinRA2L1 (CTSU2)
 TSCAP pin
TS0 pin

TS11-CFC pin

TS Pin Configurations (RA6M2)

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Figure 15.

TS Pin Configurations (RA2L1)

9. For RA6M2 (CTSU), we recommend that the touch sensor pins that are NOT being used by theapplication be setup so that they are driven to ‘low-level output’ at startup.
To do so, expand the Ports tree node in Pin Selection. Expand the P2 sub-node and select “P206”.
Change the Mode setting of the pin configuration from “Disable” to “Output” mode (Initial Low)”.
Note: Only one port is setup here as a usage example. Set all unused sensor ports in the samemanner.

Figure 16.

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Low Output Drive Setting

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10. Select Pin Selection > Peripherals, then open the Connectivity:SCI tree and select “SCI9.”
Note:

Steps 10 and 11 should only be set when using serial communication for monitoring. Otherwise,skip to Step 12.

Figure 17.

Select Peripherals (SCI9)

11. Select Pin Configuration > Operation Mode, then change “Disabled” to “Asynchronous UART”. Also
make sure TXD is set to “P203” and RXD is set to “P202”.

Figure 18.

Operation Mode (SCI9)

12. Next, select the Stacks tab.

Figure 19.

Stacks Tab

13. Select New Stack > CapTouch > Touch (rm_touch) to add the CTSU driver and middleware.

Figure 20.
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Add CTSU Driver and Middleware
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14. HAL/Common Stacks appear as shown in the following figure.

Figure 21.

HAL/Common Stacks (after CTSU is added)

15. Next, click the CTSU Driver on r_ctsu module to display Properties.
Note:

Steps 15 to 18 should only be set when using the Data Transfer Controller (DTC). Use the DTC
to transfer data between memory and registers without going through the CPU. When not using
the DTC, skip to Step 19.

Figure 22.

CTSU Driver on r_ctsu Module

16. Set the DTC from Properties at the bottom-left of the screen. Select Settings > Common > Support
for using DTC and change the setting from “Disabled” to “Enabled”.

Figure 23.

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Support for Using DTC

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17. Click the Add DTC Driver for Transmission module and select the New > Transfer (r_dtc) to add the
DTC driver for transmission.

Figure 24.

Add DTC Driver for Transmission

18. In the same manner, click the Add DTC Driver for Reception module and select the New > Transfer(r_dtc) to add the DTC driver for reception.

Figure 25.

Add DTC Driver for Reception

19. Click the TOUCH (rm_touch) module to display Properties.
Note: Steps 19 to 26 should only be set when using serial communication for monitoring. Otherwise, skip
to Step 27.

Figure 26.

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TOUCH Driver on rm_touch Module

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20. At the bottom left of the screen, select Properties > Settings > Common > Support for QE monitoring
using UART and change “Disabled” to “Enabled”.

Figure 27.

Support for QE Monitoring using UART

21. Click the Add SCI UART Driver module and select New > UART (r_sci_uart) to add the UART driver.

Figure 28.

Add UART Driver

22. Click the g_uart_qe UART Driver on r_sci_uart module to display Properties.

Figure 29.

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g_uart_qe UART Driver on r_sci_uart Module

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23. Set the SCI channel. At the bottom-left of the screen, select Properties > Settings > Module g_uart_qe
UART Driver on r_sci_uart] > General > Channel and change the channel setting from “0” to “9”.

Figure 30.

Channel

24. From Properties set the DTC as well. Select Common > DTC Support and change “Disable” to“Enable”.
Note: Steps 24 to 26 should only be set when using the Data Transfer Controller (DTC). Use the DTC totransfer data between memory and registers without going through the CPU. When not using theDTC, skip to Step 27.

Figure 31.

DTC Support

25. Click the Add DTC Driver for Transmission module and select New > Transfer (r_dtc) to add the DTC
driver for transmission.

Figure 32.
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Add DTC Driver for Transmission (SC19)
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26. In the same manner, click the Add DTC Driver for Reception module and select New > Transfer(r_dtc) to add the DTC driver for reception.

Figure 33.

Add DTC Driver for Reception (SC19)

27. Select New Stack >Timers > Timer, Low-Power (r_agt) to add the AGT driver.
Note: Steps 27 to 33 should only be set when using an external trigger as the CTSU measurement start
trigger. Otherwise (for example, when using a software trigger), skip to Step 34.

Figure 34.

Add AGT Driver

28. Click the g_timer0 Timer,Low-Power (r_agt) module to display Properties.

Figure 35.
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g_timer0 Timer Driver on r_agt Module
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29. Set the AGT. At the bottom left of the screen, select Properties > Settings > Module g_timer0 Timer
Driver on r_agt > General > Period. Enter “100” as the Period setting and select milliseconds as theunit.

Figure 36.

Period / Period Unit

30. Now set the AGT interrupts by selecting Module g_timer0 Timer Driver on r_agt > Interrupts >Underflow Interrupt Priority and setting the priority to anything other than “Disabled”. In the example,
Priority 2 is selected, which generates an AGT0 interrupt every100 ms.

Figure 37.

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Underflow Interrupt Priority

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31. Select New Stack > System > Event Link Controller (r_elc) to add the ELC Driver.

Figure 38.

Add ELC Driver

32. Click the CTSU Driver on r_ctsu module to display Properties.

Figure 39.

CTSU Driver on r_ctsu Module

33. Set the CTSU measurement start trigger. At the bottom-left of the screen, select Properties > Settings > Module CTSU Driver on r_ctsu > Scan Start Trigger and change the trigger from “Software” to“AGT0 INT (AGT interrupt)”. This setting makes the CTSU start the measurement with an AGT0
interrupt.

Figure 40.

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Scan Start Trigger

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34. At this point, all application modules necessary for capacitive touch operations have been added. The
final step is to generate the application code modules necessary for the project by clicking Generate
Project Content icon at the upper-right of the screen.

Figure 41.

6.3

Generate Project Content

Creating the Capacitive Touch Interface

1. From the e2 studio IDE, use Renesas Views > Renesas QE > CapTouch Workflow (QE) to open themain perspective for configuring capacitive touch to the project.

Figure 42.

CapTouch Workflow (QE) Menu

2. In the CapTouch Workflow (QE) pane, select the project you want to configure for touch interface byusing the pull-down tab and selecting “Capacitive_Touch_Project_Example” as shown below.

Figure 43.

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Select a Project

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3. Next, select Prepare a Configuration in the menu on the left-hand side of "CapTouch Workflow (QE)" todisplay the items for setting. Select Create a new configuration from the pull-down menu to generate a
new configuration for a touch interface.

Figure 44.

Select a Configuration

4. The Create Configuration of Touch Interfaces dialog box opens, showing the area for positioning thetouch interface (default blank canvas).

Figure 45.

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Create Configuration of Touch Interfaces Dialog Box

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5. Add a button to the touch interface area by selecting Button on the right side of the Create
Configuration of Touch Interfaces dialog box, and then clicking on the blank canvas. Press the ESC
key on your keyboard or select Button again to complete the step. The added button remains red, as
shown in the figure below, indicating that it has not been assigned a touch sensor yet.

Figure 46.

Add a Button

6. Double click Button00 in the touch interface canvas to display the Setup Touch Interface dialog box.
From the pull-down menu, select the MCU sensor port you want to assign to this button. When a sensor
port that has been enabled by the RA Smart Configurator is correctly assign to the button, the setting
error disappears and the button turns green, indicating that it has been set.
Item
Touch sensor to be selected

TS02

Figure 47.
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RA6M2 (CTSU)

TS11

RA2L1 (CTSU2)

Setup Touch Interface (set button)
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7. Next, on the right side of the Create Configuration of Touch Interfaces dialog box, select Shield Pin
and then click on the canvas to add a shield pin. Press the ESC key on your keyboard or select Shield
Pin again to complete the step. The added shield pin remains red, as shown in the figure below,
indicating it has not been assigned a touch sensor yet.
Note: When creating a project, if “EK-RA6M2” (RA6M2 MC Group Evaluation Kit) is selected in Device
Selection > Board, the Shield Pin is disabled and cannot be selected.

Figure 48.

Add Shield Pin

8. Double click “Shield00” in the touch interface canvas to open the Setup Touch Interface dialog box. Fromthe pull-down menu, select the MCU sensor port to assign to this shield pin. When a sensor port that has
been enabled by the RA Smart Configurator is correctly assign to the pin, the setting error disappears
and the button turns green, indicating that it has been set.
Item
Touch sensor to be selected

RA6M2 (CTSU)- (Cannot be set for EKRA6M2)

Figure 49.
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RA2L1 (CTSU2)
TS00

Setup Touch Sensor (Shield Pin)
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9. Click Create in the Create Configuration of Touch Interfaces dialog box to complete the touch
interface settings.

Figure 49.

Create Button

10. Select Renesas Views >Renesas QE >CapTouch Tuning Result (QE) from the menu of the e2 studioand open the CapTouch Tuning Result (QE) view to display the configuration of the touch interface in
the Tuning panel.

Figure 50.

Tuning Pane

11. Build the project using the hammer icon in the upper left-hand side of the e2 studio screen. The project
should build without any errors or warnings.

Figure 51.

6.4
1.

Modifying Debug Session for Capacitive Touch Tuning
The debug configuration needs to be modified slightly so that a special tuning kernel can be downloaded
into the MCU RAM after the debug session starts. Enter the Debug Configuration by clicking the dropdown list button of the bug icon from the e² Studio Tools button.

Figure 52.
2.

Build Button

Debug Configuration Editing Button

Select the Startup tab.

Figure 53

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Using QE and FSP to Develop Capacitive Touch Applications

Ensure the two check boxes Set breakpoint at: and Resume are checked and appear as follows in the
Runtime Options. You may need to scroll down in the dialog box to see these check boxes.

Figure 54.
4.

6.5

Runtime Option

Click Apply to use these modified settings. This completes the project configuration and debug setup fortuning.

Tuning the Capacitive Touch Interface Using QE for Capacitive Touch Plug-in

1. Make sure that the emulator is connected correctly to the board and PC.
2. Select Start Tuning (Emulator) in the menu on the left-hand side of "CapTouch Workflow (QE)" to open
the settings of "Tuning Touch Sensors". Click on Start Tuning to start automatic tuning.

Figure 55.
3.

Start Tuning

At the start of the first debug session, e2 studio may display a message regarding a switch to the Debug

perspective. Click the Remember my decision check box and YES to continue the Debug session and
the QE for Capacitive Touch automatic tuning.

Figure 56.
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4. QE for Capacitive Touch automatic tuning now begins. Please carefully read the Automatic Tuning
Processing dialog windows as they guide you through the tuning process. An example screen is shown
below. Typically, no interaction is required during the initial tuning process steps.

Figure 57.

Automatic Tuning Processing Dialog (now preparing)

5. After several automated steps, a dialog box with information similar to what is shown below appears.
This is the touch sensitivity measurement step of the tuning process. As the first interactive step of thetuning process, press “Button00” (sensor) using normal touch pressure as indicated in the dialog box(RA6M2: TS02, RA2L1: TS11-CFC). When pressing the sensor, the bar graph increases to the right andthe touch counts increase numerically. While continuing to apply pressure to the sensor, press any key
on the PC keyboard to accept the measurement.

Figure 58.

Automatic Tuning Processing Dialog (now measuring)

6. Once sensitivity measurement for the button is complete, a dialog like the following appears allowing
threshold confirmation. This is the detection threshold that is used by the middleware to determine if atouch event has occurred.

Figure 59

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Automatic Tuning Processing (tuning complete)

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7. Click the Continue the Tuning Process button in the dialog box shown. This exits the tuning process
and disconnects from the Debug session on the target board. This should return you to the default Cap
Touch Workflow (QE) screen in the e2 studio IDE.

Figure 60.

Continue the Tuning Process Button

8. The only remaining step is the output of the tuned parameter files. Select Output Parameter Files fromthe menu on the left-hand side of "CapTouch Workflow (QE)", and click on Output Parameter Files.
Note:

Carry out this step if you are NOT using an external trigger (that is, when you are using asoftware trigger) to start the CTSU measurement.

Figure 61.

Output Parameter Files

9. When using an external trigger to start the CTSU measurement, Check the Use an external trigger box
and click on Output Parameter Files.
Note:

Carry out this step if you are using an external trigger to start the CTSU measurement process.

Figure 62.

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Parameter File Output Settings

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10. In the Project Explorer window, confirm that qe_touch_config.c, qe_touch_config.h and
qe_touch_define.h files have been added. These contain the tuning information necessary for enabling
touch detection with drivers.

Figure 63.

Parameter Files

11. Build the project using the hammer icon in the upper left-hand side of the e2 studio IDE. Confirm that thebuild results shown in the Console window do not show any errors.
Note: A build error is generated if monitoring via serial communication is enabled in Flexible Software
Package (FSP) V3.0.0. See https://github.com/renesas/fsp/issues/78 for more details.

6.6
1.

Adding rm_touch middleware API Calls to Application Example
To implement a program (code) to scan the states of the touch sensors, select Implement Program in
the menu on the left-hand side of "CapTouch Workflow (QE)", and then click on Show Sample.

Figure 64.

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Show Sample Code

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Using QE and FSP to Develop Capacitive Touch Applications

The Show Sample Code window opens and shows the sample code in text. Click the Output to a Filebutton to output the sample code. Finally, click OK to close the window.

Figure 65.
3.

Show Sample Code Window

You can confirm that the new qe_touch_sample.c file has been created in Project Explorer.

Figure 66.

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qe_touch_sample.c

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Using QE and FSP to Develop Capacitive Touch Applications

In Project Explorer, select ra_gen and double click on main.c to open the file. Make sure hal_entry is
selected in the main() function and right-click on Open Declaration. This opens the hal_entry() function
declaration.

Figure 67.
5.

Open Declaration (hal_entry function)

In the hal_entry() function, add the code to call the qe_touch_main() function and the prototype
declaration as shown in the image below.

Figure 68.

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Function Call (qe_touch_main function)

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Using QE and FSP to Develop Capacitive Touch Applications

In the hal_entry() function, select the qe_touch_main() function, then click on Open Declaration to
open the qe_touch_main () declaration.
Note: Carry out Steps 6 and 7 only if you are using an external trigger to start the CTSU measurement
process. If you are NOT using an external trigger (that is, when you are using a software trigger),skip to Step 8.

Figure 69.
7.

Open Declaration (qe_touch_main function)

When using an external trigger to start the CTSU measurement process, enable the code after
commenting out the API that controls the AGT driver of the qe_touch_main().

Figure 70.
8.

Code Modifications

This completes all the necessary code modifications required for this application example. Build the code
to confirm that there are no errors or warnings.

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6.7

Using QE and FSP to Develop Capacitive Touch Applications

Monitoring Touch Performance Using e2studio Expressions Window and QE for
Capacitive Touch

1.

Start a Debug session by clicking the Bug icon in the upper left-hand corner of e2 studio.

2.

The debugger stops at the hal_entry () function call. This is the first code point in the main() function.

3.

Open the declaration of hal_entry () function.

Figure 71.
4.

Open the declaration of the qe_touch_main() function.

Figure 72.
5.

Open Declaration (hal_entry function)

Open Declaration (qe_touch_main function)

Scroll down in the qe_touch_main.c file to the RM_TOUCH_DataGet () function in the while (true) loop.
With the argument “button_status” selected, right click and select Add Watch Expression... This
opens the Add Watch Expression dialog box, where you can add the variable “button_status” to theexpressions window.

Figure 73.

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6.

Using QE and FSP to Develop Capacitive Touch Applications

Right click in the Expressions window to select Enable Real-time Refresh and enable real-time refreshin the added variable.

Figure 74.

Enable Real-time Refresh Menu

7.

Click the Resume (green arrow) button, located near the middle of the e2 studio tool bar, to continue
code execution.

8.

Press the sensor on the board (RA6M2: TS02, RA2L1: TS11-CFC) which was configured as “Button00”
in section 6.3, Creating Capacitive Touch Interface. When pressed, the “button_status” value in the
Expressions window becomes ‘1’, confirming the touch with a binary indication.

Figure 75.

Touch Status Confirmation in Expressions Window

9. Select Start Monitoring (Emulator) in the menu on the left-hand side of “CapTouch Workflow (QE)”. Click on
Show Views to start CapTouch Board Monitor (QE).

Figure 76.
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10. The CapTouch Board Monitor pane should appear as shown in the image below.

Figure 77.

CapTouch Board Monitor Window (RA6M2)

Figure 78.

CapTouch Board Monitor Window (RA2L1)

11. Click the Enable Monitoring button. The dialog text changes from “Monitoring: Disabled” to “Monitoring:
Enabled.”Figure 79.

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12. Touch “Button00” (RA6M2: TS02, RA2L1: TS11-CFC) on the Capacitive Touch Application board. The
CapTouch Board Monitor shows a touch with a finger image on the button like the following image.

Figure 80.

Touch Status Confirmation in CapTouch Board Monitor Window

13. To see a graphical representation of the ‘touch counts’ from the board, use the CapTouch Status Chart.

Figure 81.

CapTouch Status Chart Window

14. Using the Touch I/F pull-down menu, select “Button00 @ config01”.

Figure 82.

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15. The graph begins to display running values. Touch “Button00” (RA6M2: TS02, RA2L1: TS11-CFC) on
the board to view the touch counts shown as a step change on the running graph. The green line is thetouch threshold, which the rm_touch middleware uses to determine whether a button is
actuated/touched. The red blocks at the bottom of the graph are a visual indication to the user that thetouch counts have exceeded the threshold and a touch is detected.

Figure 83.

Confirm Touch Status in CapTouch Status Chart Window

Note: Steps 16 to 19 must be set when displaying and measuring standard deviation.
16. Next, measure the standard deviation. Click on [Start Data Collection] displays the [Data Collection
Settings] dialog box. Select the number of data to be collected from the pull-down menu in this dialog
box. Select [Non Touch + Touch] for [Data collection target] and click on [Start Data Collection].

Figure 84.
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17. When the green bar reaches the right edge, collection of the touch-off data is completed and a dialog
box is displayed. Click on [OK] to close the dialog box.

Figure 85.

Stop Data Collection Button (touch-off state)

18. After that, touch the electrodes to collect touch-on data. Click on [Start Data Collection] while touching
the electrodes. Continue to touch the electrodes until the data collection is complete.

Figure 86.

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19. When the green bar reaches the right edge to indicate the completion of data collection, the [Standard
Deviation Measurement Result] dialog box appears. This dialog box shows the standard deviations ofnoise and the SNRs.

Figure 87.

6.8
1.

Displaying the Measured Results

Monitoring Touch Performance with QE for Capacitive Touch Using Serial
Communication
When monitoring is in operation, click the Enable Monitoring button. The dialog text changes from
“Monitoring: Enabled” to “Monitoring: Disabled”.

Figure 88.

Disable Monitoring Function

2.

To finish the debug session, click the Stop icon at the top-right of the e2 studio window.

3.

Disconnect the emulator from the PC and target board. Confirm that the USB cable is correctly
connected to the target board and PC.
Note: Although operations can be carried out with the emulator connected, the emulator is removed inthis step to confirm successful monitoring without the emulator.

4.

Reset the board by pressing the RESET switch.

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5.

Using QE and FSP to Develop Capacitive Touch Applications

Open the CapTouch Workflow pane and make sure the following folder/file are selected:
To Select a Project: “Capacitive_Touch_Project_Example”
To Prepare a Configuration: “Capacitive_Touch_Project_Example.tifcfg”.

Figure 89.
6.

Select Project / Configuration

Then select [Start Monitoring (Serial)] in the menu on the left-hand side of “CapTouch Workflow (QE)”.
Select [Connect] to enable the serial communication monitoring function.

Figure 90.
7.

Connect Button“Connected to COMn” should appear at the bottom of Console window. Confirm the message to makesure the connection is successful.
Note: The COM port number for connection varies depending on the PC environment.

Figure 91.
8.

Console Window Output

The rest of the process is the same as Step 9 on in Section 6.7 Monitoring Touch Performance Using
e2studio Expressions Window and QE for Capacitive Touch .

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7. qe_touch_sample.c Listing After Modifications
7.1

When Using a Software Trigger to Start the CTSU Measurement Process/************************************************************************* FILE : qe_sample_main.c* DATE : 2020-09-10* DESCRIPTION : Main Program** NOTE:THIS IS A TYPICAL EXAMPLE.
************************************************************************/#include "qe_touch_config.h"#define TOUCH_SCAN_INTERVAL_EXAMPLE (20)/* milliseconds */void qe_touch_main(void);
uint64_t button_status;#if (TOUCH_CFG_NUM_SLIDERS != 0)
uint16_t slider_position[TOUCH_CFG_NUM_SLIDERS];#endif#if (TOUCH_CFG_NUM_WHEELS != 0)
uint16_t wheel_position[TOUCH_CFG_NUM_WHEELS];#endifvoid qe_touch_main(void){
fsp_err_t err;/* Open Touch middleware */err = RM_TOUCH_Open(g_qe_touch_instance_config01.p_ctrl,
g_qe_touch_instance_config01.p_cfg);
if (FSP_SUCCESS != err){
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Using QE and FSP to Develop Capacitive Touch Applications/* Main loop */while (true){/* for [CONFIG01] configuration */err = RM_TOUCH_ScanStart(g_qe_touch_instance_config01.p_ctrl);
if (FSP_SUCCESS != err){
while (true) {}}while (0 == g_qe_touch_flag) {}g_qe_touch_flag = 0;
err = RM_TOUCH_DataGet(g_qe_touch_instance_config01.p_ctrl,&button_status, NULL, NULL);
if (FSP_SUCCESS == err){/* TODO: Add your own code here. */}}/* FIXME: Since this is a temporary process, so re-create a waiting
process yourself. */R_BSP_SoftwareDelay(TOUCH_SCAN_INTERVAL_EXAMPLE,
BSP_DELAY_UNITS_MILLISECONDS);}

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7.2

Using QE and FSP to Develop Capacitive Touch Applications

When Using an External Trigger to Start the CTSU Measurement Process/************************************************************************* FILE : qe_sample_main.c* DATE : 2020-09-10* DESCRIPTION : Main Program** NOTE:THIS IS A TYPICAL EXAMPLE.
************************************************************************/#include "qe_touch_config.h"#define TOUCH_SCAN_INTERVAL_EXAMPLE (20)/* milliseconds */void qe_touch_main(void);
uint64_t button_status;#if (TOUCH_CFG_NUM_SLIDERS != 0)
uint16_t slider_position[TOUCH_CFG_NUM_SLIDERS];#endif#if (TOUCH_CFG_NUM_WHEELS != 0)
uint16_t wheel_position[TOUCH_CFG_NUM_WHEELS];#endifvoid qe_touch_main(void){
fsp_err_t err;/* Initializes the software and sets the links defined in the control
structure. */R_ELC_Open(g_elc.p_ctrl, g_elc.p_cfg);/* Globally enable event linking in the ELC. */R_ELC_Enable(g_elc.p_ctrl);/* Open Touch middleware */err = RM_TOUCH_Open(g_qe_touch_instance_config01.p_ctrl,
g_qe_touch_instance_config01.p_cfg);
if (FSP_SUCCESS != err){
while (true) {}}/* Open AGT driver */R_AGT_Open(g_timer0.p_ctrl, g_timer0.p_cfg);/* Start AGT. */R_AGT_Start(g_timer0.p_ctrl);

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Using QE and FSP to Develop Capacitive Touch Applications/* Main loop */while (true){/* for [CONFIG01] configuration */err = RM_TOUCH_ScanStart(g_qe_touch_instance_config01.p_ctrl);
if (FSP_SUCCESS != err){
while (true) {}}while (0 == g_qe_touch_flag) {}g_qe_touch_flag = 0;
err = RM_TOUCH_DataGet(g_qe_touch_instance_config01.p_ctrl,&button_status, NULL, NULL);
if (FSP_SUCCESS == err){/* TODO: Add your own code here. */}/* FIXME: Since this is a temporary process, so re-create a waiting
process yourself. */R_BSP_SoftwareDelay(TOUCH_SCAN_INTERVAL_EXAMPLE,
BSP_DELAY_UNITS_MILLISECONDS);}}

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Website and Support
RA Product Information
RA Product Support ForumRA Flexible Software Package
Renesas Support
Capacitive Touch Sensing Unit

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renesas.com/rarenesas.com/ra/forum
renesas.com/FSP
renesas.com/support
renesas.com/solutions/touch-key
renesas.com/qe-capacitive-touch

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Revision History
Rev.
1.00
1.10

Date
Feb.28.20
Apr.06.20

2.00

Jun.07.22

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Description
Page
SummaryFirst edition issued
2
Overview of a simplified example application
3
Change file generation location
3
Change project configuration settings
4
Addition of power supply voltage setting method
5
Change clock frequency setting method
5
Change port number not used for touch sensor
8,9
Added DTC setup instructions
13
Change in debugging method
14
Omission of tuning process
18
Change the method of adding code to the application
example19,20
Changed the way the monitoring view opens.
23
Addition of standard deviation measurement method
25,26
Sample Code Update
EntireAdded RA2L1 (CTSU2) environment and process steps.
document Updated IDE version and name
Added numbers to figures and table.
Changed black arrows in figures to red outlines
3
Chapter 2/4: Removed Renesas Code Generator
Chapter 3: Changed title
4
Chapter 5: Changed implementation description to figure
Chapter 6: Changed title, moved remaining development
steps from chapters to sections
5
Added Fig. 3 Device and Toolchain (RA2L1)
6
Section 6.1: Added Step 7 for building an artifact and
RTOS selection
7
Added Fig. 5 Project Template Selection
10
Added Fig. 10 Clocks Configuration (RA2L1)
12
Added Fig. 15 TS Pin Configurations (RA2L1)
13
Section 6.2: Added Steps 10 and 11 for when using serial
communication for monitoring
Section 6.2: Added Steps 19 to 26 for when using serial
17～21
communication for monitoring
Section 6.2: Added Steps 27 to 33 for when using an
21～24
external trigger to start CTSU measurement
28
Section 6.3: Added Steps 7 and 8 for adding a shield pin.
31
Section 6.4: Added Step 1 for confirming emulator
connection.
35
Section 6.5: Added steps for when using an external
trigger to start CTSU measurement
Section 6.5: Added note regarding build error to Step 1138, 39Section 6.6: Added Steps 6 and 7 for when using asoftware trigger to start the CTSU measurement
41
Added Fig. 75 Enable Real-time Refresh Menu
43
Added Fig. 79 CapTouch Board Monitor RA, RL78,
Synergy (QE) Window (RA2L1)
Added Section 6.8 Monitoring Touch Performance with
49～51
QE for Capacitive Touch [RA, RL78, Synergy] Using
Serial Communication
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52, 5354, 55

3.00

Jan.11.2456
3～725, 26,29, 32,34～36,
42, 5031
45～48
56

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Section 7.1: Updated source Code
Added Section 7.2 When Using an External Trigger toStart the CTSU Measurement Process
Changed URL
Updated the development environment.(Upgrade of
development tools and software components)
Changes due to the upgrade of QE for Capacitive
Touch.(workflow renewal)
Changed toolbar with upgrade of e² studio
Changes due to the upgrade of QE for Capacitive
Touch.(How to measure the standard deviation)
Added URL

Page 44 of 44

General Precautions in the Handling of Microprocessing Unit and Microcontroller Unit
Products
The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the
products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.
1.

Precaution against Electrostatic Discharge (ESD)
A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps
must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must be
adequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity.
Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test andmeasurement tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor2.

devices must not be touched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices.
Processing at power-on
The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states ofregister settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external resetpin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins
in a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches the3.

level at which resetting is specified.
Input of signal during power-off state
Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O
pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal

4.

elements. Follow the guideline for input signal during power-off state as described in your product documentation.
Handling of unused pins
Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins of CMOS products are
generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of
the LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal

5.

become possible.
Clock signals
After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the clock signal during program
execution, wait until the target clock signal is stabilized. When the clock signal is generated with an external resonator or from an external oscillator
during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Additionally, when switching to a clock signal

6.

produced with an external resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable.
Voltage application waveform at input pin
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL(Max.) and VIH (Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the7.

input level is fixed, and also in the transition period when the input level passes through the area between VIL (Max.) and VIH (Min.).
Prohibition of access to reserved addresses
Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access these8.

addresses as the correct operation of the LSI is not guaranteed.
Differences between products
Before changing from one product to another, for example to a product with a different part number, confirm that the change will not lead to problems.
The characteristics of a microprocessing unit or microcontroller unit products in the same group but having a different part number might differ in termsof internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values,
operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a systemevaluation test for the given product.

Notice1.

Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products
and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design ofyour product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from theuse of these circuits, software, or information.
2. Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights,
or other intellectual property rights of third parties, by or arising from the use of Renesas Electronics products or technical information described in thisdocument, including but not limited to, the product data, drawings, charts, programs, algorithms, and application examples.
3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics
or others.
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and all liability for any losses or damages incurred by you or third parties arising from such alteration, modification, copying or reverse engineering.
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Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas
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Handling and Using Semiconductor Devices” in the reliability handbook, etc.), and ensure that usage conditions are within the ranges specified byRenesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characteristics, installation, etc.
Renesas Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products
outside of such specified ranges.
9. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specificcharacteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability
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promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions.
12. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells ortransfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this document.
13. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.
14. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas
Electronics products.
(Note1)(Note2)“Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlledsubsidiaries.
“Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(Rev.5.0-1

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