First Announcement

ICRP-9/GEC-68/SPP-33
9th International Conference
on Reactive Plasmas /rd68th
Gaseous Electronics Conference /33 Symposium on Plasma Processing

October 12-16, 2015
Hawaii Convention Center
Honolulu, U. S. A.

*image courtesy of Hawaii Tourist Authority / Dana Edmunds

Sponsored by
The Japan Society of Applied Physics
American Physical Society
ICRP-9 Supported by:

Plasma Electronics Division,
The Japan Society of Applied Physics
Center of Plasma Nano-Interface Engineering,
Kyushu University, Japan
Plasma Nanotechnology Research Center,
Nagoya University, Japan
Plasma Medical Science Global Innovation Center,
Nagoya University, Japan
Grant-in-Aid for Scientific Research on
Innovative Areas Plasma Medical Innovation

http://www.plasma.engg.nagoya-u.ac.jp/icrp-9/General Information

Conference Topics

The International Conference on Reactive Plasmas(ICRP) has taken place by the initiative of the Division ofPlasma Electronics, the Japan Society of Applied Physics
since 1991. The 1st ICRP was held in Nagoya, the 2ndin Yokohama (1994), the 3rd in Nara (1997), and themost recent conference (8th ICRP) in Fukuoka (2014).
Some former ICRPs were held as international joint
conferences: the 5th ICRP was with ESCAMPIG atGrenoble (2002) and the 7th was with the GaseousElectronics Conference (GEC) at Paris in 2010.
The Symposium on Plasma Processing (SPP) is adomestic annual Japanese meeting that has been held by
the Division of Plasma Electronics since 1984. Thejoint ICRP and SPP conference aims to gather
researchers and engineers, involved in various aspects ofreactive plasmas and their applications. The joint
conference also aims to facilitate the exchange ofinformation and ideas among them within an internationalframework.
The subjects covered in this conference are the entire
field of reactive plasmas and their applications to various
materials processing such as surface modification, etchingand deposition with emphasis on basic phenomena,technologies, and the underlying basic physics andchemistry.
Furthermore, the subjects have been
extended to bio- and/or medical application of plasmas.
This conference particularly encourages papers dealing
with basic properties of the plasma itself, its generationand control, fundamental processes in the plasma, andplasma-solid/liquid interactions. Papers dealing withspecific results of processing should place emphasis on
the related plasma characteristics in obtaining the results.
The 9th ICRP will take place in October 12-16, 2015,
in Hawaii, U.S.A., as a co-located conference with the68th GEC. This conference will also be held as a joint
conference with the 33rd Symposium on Plasma
Processing, since the 4th ICRP in 1998. The conferencesite will be at Hawaii Convention Center at Honolulu.

1 Atomic and Molecular Processes
1.1 Electron and photon collisions with atoms andmolecules: excitation
1.2 Electron and photon collisions with atoms andmolecules: ionization
1.3 Heavy particle collisions
1.4 Dissociation, recombination and attachment
1.5 Distribution functions and transport coefficients forelectrons and ions
1.6 Other atomic and molecular collision phenomena

TopicsThe ICRP-9/GEC-68/SPP-33 will consist of a series oforal sessions (composed of both invited and contributedpapers), poster sessions, and several arranged sessions on
selected topics. Sessions will be organized aroundcoherent subjects in order to facilitate useful discussions
and focus on appropriate solutions to problems.

2 Plasma Science
2.1 Nonequilibrium kinetics of low-temperatureplasmas2.2 Basic plasma physics phenomena in lowtemperature plasmas
2.3 Plasma boundaries: sheaths, boundary layers,others,
2.4 Gas phase plasma chemistry
2.5 Plasma-surface interactions
2.6 Plasma diagnostic techniques
2.7 Modeling and simulation
2.8 Glows: dc, pulsed, microwave, others
2.9 Capacitively coupled plasmas
2.10 Inductively coupled plasmas
2.11 Magnetically-enhanced plasmas: ECR, helicon,
magnetron, others
2.12 High pressure discharges: dielectric barrier,discharges, coronas, breakdown, sparks
2.13 Microdischarges: dc, rf, microwave
2.14 Thermal plasmas: arcs, jets, switches, others
2.15 Plasmas in liquids
2.16 Negative ion and dust particle containing plasmas
2.17 Other plasma science topics
3 Plasma Applications
3.1 Plasmas for light production: laser media, glows,arcs, flat panels and novel sources
3.2 Plasma etching
3.3 Plasma deposition
3.4 Plasma ion implantation
3.5 Green plasma technologies: environmental andenergy applications
3.6 Plasma processing for photovoltaic applications
3.7 Biological applications of plasmas
3.8 Plasma applications in medicine
3.9 Plasma propulsion and aerodynamics
3.10 Plasmas for nanotechnologies, flexible electronics
and other emerging applicationsContributed Papers

Accommodation

Contributed papers will be presented as 15-minute oral
talks or in poster sessions. Authors are requested tosubmit a GEC-style abstract to the AIP website by June 19,
2015. A preference for oral/poster may be indicated.
The final decision will be communicated to thecorresponding author. In addition to GEC abstract
submission, authors are required to submit a two-pagemanuscript for ICRP proceedings volume (in atwo-column, camera-ready form) no later than June 19th,
2015. Further details will be given in the secondannouncement.

A room block has been reserved at the Ala Moana Hotel,
at $155 (Kona Tower) and $175 (Waikiki Tower) pernight + tax. The cut-off date for the special rate is
September 11, 2015 or when the block is filled,whichever comes first. Early reservations are strongly
recommended.

Abstracts and Proceedings
Regular participants will be given both the GEC abstracts
and the ICRP conference proceedings, which containinvited and contributed papers.
The abstracts andproceedings will be handed out upon the registration at theconference.

JJAP Special Issue
Papers published in the ICRP conference proceedings mayalso be submitted to a special issue “Plasma Processing”
of the Japanese Journal of Applied Physics (JJAP).

Language
The official language of the conference is English. Allpresentations and printed materials should be prepared in
the official language.

Registration Fee
The early registration fee for regular participants will be
550 USD per person. The reduced early fee for full-timestudents will be 275 USD per person.

Conference Site
The conference will be held at the Hawaii Convention
Center in Honolulu, U.S.A. Other site information, suchas accommodations around the conference site, will beprovided at the GEC web site:
http://gec2015.wordpress.drake.edu/

Second Announcement
The second announcement will contain more details,
such as the scientific program, registration procedure,accommodation, transportation, visa information, andguidelines for preparing abstracts. It will be issued in
April/May 2015.

K. Terashima, The University of Tokyo
F. Tochikubo, Tokyo Metropolitan University
T. Watanabe, Kyushu University
K. Nakamura (Secretary), Chubu University

ICRP-9 Office
ICRP-9 secretariat c/o Inter Group Corp.
Telephone: +81-52-581-3241
Facsimile: +81-52-581-5585
E-mail: icrp9@intergroup.co.jp

Calendar of EventsFirst announcement
Feb 2015
Second announcement
April/May 2015
GEC abstract deadline
June 19 2015
Two-page papers deadline for a ICRP proceedings(a two-column, camera-ready form) June 19 2015
Deadline for student travel support
June 21 2015
Registration starts
July 1 2015
Notification of acceptanceAugust 2015
Final announcement/program
September 2015
ICRP-9/GEC-68/SPP-33
October 12-16 2015
Papers deadline for JJAP special issue November 2015

*image courtesy of Hawaii Tourist Authority / Kirk Lee Aeder

Organizing Committee
H. Toyoda (Chair), Nagoya University
M. Vukovic (Vice-Chair), Tokyo Electron America
U. Czarnetzki (Vice-Chair), Ruhr University Bochum
S. J, Yoo (Vice-Chair), NFRI
P. Chabert, Ecole PolytechniqueJ.-G. Duh, National Tsing Hua University
P. Favia, Bari University
T. Kaneko, Tohoku University
S. Miyazaki, Nagoya University
T. Murphy, CSIRO, Australia
D. O'Connell, University of YorkY.-K. Pu, Tsinghua University
O. Sakai, The University of Shiga Prefecture
K. Sasaki, Hokkaido University
Y. Setsuhara, Osaka University
E. Stamate, Technical University of Denmark*image courtesy of Hawaii Tourist Authority / Daeja Faris