AES 300 Adhesive

Product Information
Description

Lamination

AES 300 Adhesive, an offering within our Advanced
Electronic Solutions portfolio, is designed to meet next
generation needs of 5G and 6G platforms, anticipating
requirements for both wireless and digital future designs.
AES 300 Adhesive is an extremely low dielectric
constant and low loss circuit material.

As with any thermoplastic film, AES 300 Adhesive
is suitable for single lamination constructions anddesigns. However, where multiple lamination cycles may
be necessary, review of the design, including copperarea, thickness, and number of sequential lamination
cycles necessary, is recommended, prior to production
commitment.

AES 300 Adhesive offers benefits of superior electricaland thermal performance, typical of fluoropolymers, andovercomes traditional limitations associated with current
PTFE laminates.
Key Features and Benefits• Low loss tangent and dielectric constant.
• Excellent adhesion to plating chemistries.
• Excellent compatibility with standard PCB processing.
• Negligible variance in dielectric constant and thicknessfor excellent reproducibility of results.
Construction Options

A recommended lamination press cycle is shown in Figure
1. Pressure can be varied to balance circuit registration,
layer to layer adhesion, and copper fill requirements.
Suitability for use should be verified for each new design.
AES 300 Adhesive requires no drying or special storage
conditions; room temperature with dust protection isadequate. Care should be taken to ensure that adhesive
surfaces are clean and particle free prior to lamination.
Figure 1. Recommended AES 300 Adhesive
Lamination Press Cycle
60 minTemperatureThis product is a fluoropolymer-based adhesive film thatis thin and flexible.

280 °C
2 °C/min

2 °C/min

5 min
40 °C

• Thickness: 25 μm

40 °C

100–200 psi(6.9–13.8 bar)
5 min
0 psi (0 bar)

0 psi (0 bar)

0 atm(0 kPa)

0 atm
(0 kPa)Vacuum• Sheeted product with 500 mm maximum transverse
dimension

Pressure• Panel Sizes: Rolls up to 500 mm wide

1 atm (101.3 kPa)

TimeAES 300 Adhesive

Table 1. Properties of AES 300 Adhesive1Property

25 µm

Direction

Units

Test Conditions

Test Method

Dielectric Constant

2.120.0005—10 GHz
23 °C/24 hr/50% RHIPC TM-650 2.5.5.15

Dissipation Factor

In-plane(X/Y)

IPC TM-650 2.5.5.15

Dielectric Strength

2.77x10(7055)

Z

V/cm(V/mil)23 °C/24 hr/50% RH

ASTM D149

Electrical Properties

6Thermal Properties
Melting Temperature (Tm)

260

—°C

1 heat method

ASTM D3418

Decomposition Temperature (Td)

471

—°C

5% weight loss

IPC TM-650 2.3.40

Tensile Strength

39.9/22.1

MD/TD

Mpa

23 °C/50% RH

ASTM D882

Tensile Modulus

8.9/4.3

MD/TD

Mpa

23 °C/50% RH

ASTM D882

Tensile Elongation

293/350

MD/TD%23 °C/50% RH

ASTM D882

Thickness

25.0Zµm—

IPC TM-650 2.2.18

Flammability

V-0———UL94

Moisture Absorption

0.02—%E1/105 + D48/50

IPC TM-650 2.6.2.1

Density

2.17

—g/cm

C-24/23/50

IPC TM-650 2.3.5

Mechanical Properties

Physical Properties

3This table gives properties (not specifications) based on production performance. Chemours does not make any express or implied warranty that these products will have thesetypical properties.

1For more information, visit www.teflon.com/electronics© 2024 The Chemours Company FC, LLC. Chemours™ and the Chemours Logo are trademarks of The Chemours Company.

C-11970

NO PART OF THIS MATERIAL MAY BE REPRODUCED, STORED IN A RETRIEVAL SYSTEM OR TRANSMITTED IN ANY FORM OR BY ANY MEANS ELECTRONIC, MECHANICAL, PHOTOCOPYING, RECORDING OR OTHERWISEWITHOUT THE PRIOR WRITTEN PERMISSION OF CHEMOURS.

0424

The information set forth herein is furnished free of charge and based on technical data that Chemours believes to be reliable. It is intended for use by persons having technical skill, at their own
discretion and risk. The handling precaution information contained herein is given with the understanding that those using it will satisfy themselves that their particular conditions of use present
no health or safety hazards. Because conditions of product use are outside our control, Chemours makes no warranties, express or implied, and assumes no liability in connection with any useof this information. As with any material, evaluation of any compound under end-use conditions prior to specification is essential. Nothing herein is to be taken as a license to operate under or arecommendation to infringe any patents.