FT6336U
Self-Capacitive Touch
Panel Controller

INTRODUCTION
The FT6336U are single-chip capacitive touch panel controller IC with a built-in 16 bit enhanced Micro-controller unit (MCU).They
adopt the self-capacitance technology, which supports single point and gesture touch or two points. In conjunction with aself-capacitive touch panel, The FT6336U implement the user-friendly input function and are widely used in various portable devices,such as smart phones, MIDs ad GPS.

FEATURES Self-Capacitive Sensing Techniques support single point
touch and gesture or two point touch
 Absolute X and Y coordinates or gesture 1 point and gestures / 2 points supported
 High immunity to RF and power Interferences Auto-calibration: Insensitive to Capacitance and Environmental Variations
 Built-in Enhanced MCU
 FT6336U supports up to 39 channels of sensors /drivers
 Report Rate: Up to 100Hz Support Interfaces :I2C
 Support single film material TP and triangle pattern without
additional shield

FocalTech Systems Co., Ltd· Internal accuracy ADC and smooth filters
 Support 2.8V to 3.6V Operating Voltage
 Support independent IOVCC
 Built-in LDO for Digital Circuits
 High efficient power management with 3 Operating Modes


Active ModeMonitor Mode
Hibernation Mode Operating Temperature Range: -40°C to +85°C
 ESD:HBM≥7500V, MM≥500V

www.focaltech-systems.com·support@focaltech-systems.com

FT6336UDATASHEET Preliminary

TABLE OF CONTENTS\\INTRODUCTION .......................................................................................................................................................... IFEATURES..................................................................................................................................................................... I
1

OVERVIEW .......................................................................................................................................................... 1
1.1

2

TYPICAL APPLICATIONS ................................................................................................................................... 1

FUNCTIONAL DESCRIPTION.......................................................................................................................... 12.1
ARCHITECTURAL OVERVIEW............................................................................................................................ 12.2
MCU ................................................................................................................................................................ 22.3
OPERATION MODES .......................................................................................................................................... 22.4SERIAL INTERFACE ........................................................................................................................................... 32.4.1
I2C ........................................................................................................................................................... 33

ELECTRICAL SPECIFICATIONS .................................................................................................................... 43.1
3.2
3.3
3.4
3.5

ABSOLUTE MAXIMUM RATINGS ....................................................................................................................... 4
DC CHARACTERISTICS ..................................................................................................................................... 4
AC CHARACTERISTICS ..................................................................................................................................... 5
I/O PORTS CIRCUITS ......................................................................................................................................... 6
POWER ON/RESET/WAKE SEQUENCE ............................................................................................................ 64

PIN CONFIGURATIONS .................................................................................................................................... 85

PACKAGE INFORMATION ............................................................................................................................ 105.1

PACKAGE INFORMATION OF QFN-5X5-48L PACKAGE ................................................................................... 10

FocalTech Systems Co., Ltd·www.focaltech-systems.com·support@focaltech-systems.com

1

OVERVIEW

1.1

Typical ApplicationsFT6336U accommodate a wide range of applications with a set of buttons up to a 2D touch sensing device, their typical applications
are listed below.
 Mobile phones, smart phones
 GPS Game consoles
 POS (Point of Sales) devices Portable MP3 and MP4 media players
 Digital cameras
 MIDs
FT6336U series ICs support up to 5 inch Touch Panel; users may find out their target IC from the specs listed in the following table,

22.1

Model Name

Panel
Channel

TypePackagePinFT6336U39QFN5*548

Size
0.6-P0.35

Touch Panel Size≤5.0 inch

FUNCTIONAL DESCRIPTION
Architectural Overview

Figure2-1 shows the overall architecture for the FT6336U.

Figure 2-1 FT6336U System Architecture Diagram
The FT6336U is comprised of five main functional parts listed below,
 Touch Panel Interface Circuits
The main function for the AFE and AFE controller is to interface with the touch panel. It scans the panel by sending AC signals to thepanel and processes the received signals from the panel. So it supports both driver and Sensor functions. Key parameters to configure
this circuit can be sent via serial interfaces.
 Enhanced MCU
For the Enhanced MCU, larger program and data memories are supported. Furthermore, A Flash ROM is implemented to store
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programs and some key parameters.
Complex signal processing algorithms are implemented by MCU to detect the touches reliably and efficiently.
Communication protocol software is also implemented on this MCU to exchange data and control information with the host processor.
 External Interface
 I2C: an interface for data exchange with host INT: an interrupt signal to inform the host processor that touch data is ready for read
 RSTN: an external low signal reset the chip.
 A watch dog timer is implemented to ensure the robustness of the chip.
 A voltage regulator to generate 1.5V for digital circuits from the input VDDA supply.

2.2MCUThis section describes some critical features and operations supported by the Enhanced MCU.
Figure 2-2 shows the overall structure of the MCU block. In addition to the Enhanced MCU core, we have added the followingcircuits, Memory: 48KB Flash Data Memory: 5KB SRAM
 Timer: A number of timers are available to generate different clocks
 Master Clock:18MHz from a 36MHz RC Oscillator
 Clock Manager: To control various clocks under different operation conditions of the system

Figure 2-2 MCU Block Diagram

2.3

Operation Modes

FT6336U operates in the following three modes:
 Active ModeIn this mode, FT6336U actively scans the panel. The default scan rate is 60 frames per second. The host processor can configure
FT6336U to speed up or to slow down.
 Monitor ModeIn this mode, FT6336U scans the panel at a reduced speed. The default scan rate is 25 frames per second and the host processor canincrease or decrease this rate. When in this mode, most algorithms are stopped. A simpler algorithm is being executed to determine if
there is a touch or not. When a touch is detected, FT6336U shall enter the Active mode immediately to acquire the touch information
quickly. During this mode, the serial port is closed and no data shall be transferred with the host processor
 Hibernation ModeIn this mode, the chip is set in a power down mode. It shall respond to the “RESET” or “Wakeup” signal from the host processor. Thechip therefore consumes very little current, which help prolong the standby time for the portable devices.

Host Interface Figure 2-3 shows the interface between a host processor and FT6336U. This interface consists of the following
three sets of signals:
 Serial InterfaceTHIS DOCUMENT CONTAINS INFORMATION PROPRIETARY TO FOCALTECH SYSTEMS CO.,LTD., AND MAY NOT BEREPRODUCED, DISCLOSED OR USED IN WHOLE OR PART WITHOUT THE EXPRESS WRITTEN PERMISSION OF
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Version 1.0 ︱Page 2 of 10 Interrupt from FT6336U to the Host Reset Signal from the Host to FT6336U

Figure 2-3 Host Interface Diagram
The serial interface of FT6336U is I2C. The details of this interface are described in detail in Section 2.4. The interrupt signal (/INT)
is used for FT6336U to inform the host that data are ready for the host to receive. The RSTN signal is used for the host to reset
FT6336U. After resetting, FT6336U shall enter the Active mode.

2.4

Serial Interface

FT6336U supports the I2C interfaces, which can be used by a host processor or other devices.
2.4.1

I2C

The I2C is always configured in the Slave mode. The data transfer format is shown in Figure 2-4.

Figure 2-4 I2C Serial Data Transfer Format

Figure 2-5 I2C master write, slave read

Figure 2-6 I2C master read, slave write
Table 2-1 lists the meanings of the mnemonics used in the above figures.
Table 2-1 Mnemonics Description
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Mnemonics
SDescription
I2C Start or I2C RestartA[6:0]

Slave address

R/W

READ/WRITE bit, ‘1’ for read, ‘0’for write

A(N)

ACK(NACK)
STOP: the indication of the end of a packet (if this bit is missing, S will indicate the end of the current
packet and the beginning of the next packet)

P

I2C Interface Timing Characteristics is shown in Table 2-2.
Table 2-2 I2C Timing Characteristics
Parameter

MinMaxUnit

SCL frequency

10400

KHz

Bus free time between a STOP and START condition

4.7

\us

Hold time (repeated) START condition

4.0\usData setup time250\nsSetup time for a repeated START condition

4.7\usSetup Time for STOP condition

4.0\us3

ELECTRICAL SPECIFICATIONS

3.1Absolute Maximum Ratings
Table 3-1 Absolute Maximum Ratings
ItemSymbolValueUnitNotePower Supply Voltage

VDDA - VSSA

-0.3 ~ +3.6

V

1, 2

Power Supply Voltage2

VDD3 - VSS-0.3 ~ +3.6

V

1, 3I/O Digital Voltage

IOVCC

1.8~3.6

V

1

Operating TemperatureTopr-40 ~ +85℃

1Storage Temperature

Tstg-55 ~ +150℃

1Notes

1. If used beyond the absolute maximum ratings, FT6336U may be permanently damaged. It is strongly recommended that the device
be used within the electrical characteristics in normal operations. If exposed to the condition not within the electrical characteristics,
it may affect the reliability of the device.
2. Make sure VDDA (high) ≥VSSA (low).
3. Make sure VDD3(high) ≥VSS(low).

3.2

DC Characteristics
Table 3-2 DC Characteristics (VDDA=2.8~3.6V, Ta=-40~85℃)
Item

SymbolTest Condition

Min.

Typ.

Max.

Unit

Input high-level voltage

VIH

0.7 x IOVCC-IOVCCV

Input low -level voltage

VIL-0.3-0.3 x IOVCC

V

Output high -level voltage

VOHIOH=-0.1mA

0.7 x IOVCC--V

Output low -level voltage

VOLIOH=0.1mA--0.3 x IOVCCVI/O leakage current

ILI

Vin=0~VDDA-1-1μA

Note

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VDDA =VDD3= 2.8V
Ta=25℃
MCLK=18MHzVDDA =VDD3= 2.8V
Ta=25℃
MCLK=18MHz

Current consumption（Normal operation mode）

Iopr

Current consumption（Monitor mode）

Imon

Current consumption（Sleep mode）

Islp

Step-up output voltage

VDD5Power Supply voltage

VDDA
VDD3-

4.32*1--

220*2-uA

VDDA =VDD3= 2.8V
Ta=25℃-55-

uA

VDDA = VDD3=2.8V-

5-

V

2.8-

3.3

VmA

*1: Report Rate: 75Hz @ 4”TP
*2: Report Rate: 25Hz @ 4”TP

3.3

AC Characteristics
Table 3-3 AC Characteristics of Oscillators

Item
OSC clock 1Symbol

Test Condition

MinTyp.

Max

Unit

fosc1

VDDA= 2.8V；Ta=25℃

34.64

3636.36

MHz

Note

Table 3-4 AC Characteristics of sensor
Item

SymbolTest Condition

MinTyp.

Max

Unit

Sensor acceptable clock

ftx

VDDA= 2.8V；Ta=25℃

0100300

KHz

Sensor output rise time

Ttxr

VDDA= 2.8V；Ta=25℃-100-nS

Sensor output fall time

Ttxf

VDDA= 2.8V；Ta=25℃-80-nS

Sensor input voltage

Trxi

VDDA= 2.8V；Ta=25℃-5-V

Note

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3.4

I/O Ports Circuits

Figure 3-1 Digital In/Out Port Circuit

Figure 3-2 Reset Input Port Circuits

3.5

POWER ON/Reset/Wake Sequence

The GPIO such as INT and I2C are advised to be low before powering on. Reset should be pulled down to be low before powering on.
INT signal will be sent to the host after initializing all parameters and then start to report points to the host. If Power is down, thevoltage of supply must be below 0.3V and Trst is more than 5ms.

TrisPower

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Figure 3-7 Power on timeTrstPower0.3V

Figure 3-8 Power Cycle requirement

Tpon
Tprt
Power
Reset
INTI2C
Figure 3-9 Power on Sequence
Reset time must be enough to guarantee reliable reset, the time of starting to report point after resetting approach to the time ofstarting to report point after powering on.

Figure 3-10 Reset Sequence
Table 3-5 Power on/Reset/Wake Sequence Parameters
Parameter

Description

MinMax

Units

Tris

Rise time from 0.1VDD to 0.9VDD-3ms

Tpon

Time of starting to report point after powering on300-ms

Tprt

Time of being low after powering on1-msTrsi

Time of starting to report point after resetting

300-msTrst

Reset time

5-ms

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4PIN CONFIGURATIONS
Table 4-1 Pin Definition of FT6336UName

Pin No.

Type

Description

VREF

46PWR

S147

I/O

Capacitance sensor /driver channel

S248

I/O

Capacitance sensor /driver channel

S31I/O

Capacitance sensor /driver channel

S42I/O

Capacitance sensor /driver channel

S53I/O

Capacitance sensor /driver channel

S64I/O

Capacitance sensor /driver channel

S75I/O

Capacitance sensor /driver channel

S86I/O

Capacitance sensor /driver channel

S97I/O

Capacitance sensor /driver channel

S10

8I/O

Capacitance sensor /driver channel

S11

9I/O

Capacitance sensor /driver channel

S1210I/O

Capacitance sensor /driver channel

S13

11I/O

Capacitance sensor /driver channel

S14

12I/O

Capacitance sensor /driver channel

S15

13

I/O

Capacitance sensor /driver channel

S16

14I/O

Capacitance sensor /driver channel

S17

15

I/O

Capacitance sensor /driver channel

S18

16

I/O

Capacitance sensor /driver channel

S19

17

I/O

Capacitance sensor /driver channel

S20

18

I/O

Capacitance sensor /driver channel

S21

19

I/O

Capacitance sensor /driver channel

S22

20

I/O

Capacitance sensor /driver channel

S23

21

I/O

Capacitance sensor /driver channel

S24

22

I/O

Capacitance sensor /driver channel

S25

23

I/O

Capacitance sensor /driver channel

S26

24

I/O

Capacitance sensor /driver channel

S27

25

I/O

Capacitance sensor /driver channel

S28

26

I/O

Capacitance sensor /driver channel

S29

27

I/O

Capacitance sensor /driver channel

S30

28

I/O

Capacitance sensor /driver channel

S31

29

I/O

Capacitance sensor /driver channel

S32

30

I/O

Capacitance sensor /driver channel

S33

31

I/O

Capacitance sensor /driver channel

S34

32

I/O

Capacitance sensor /driver channel

S35

33

I/O

Capacitance sensor /driver channel

S36

34

I/O

Capacitance sensor /driver channel

S3735

I/O

Capacitance sensor /driver channel

S38

36

I/O

Capacitance sensor /driver channel

S3937

I/O

VDD538PWR

Capacitance sensor /driver channelHigh voltage power supply from theGenerated internal reference voltage.
A 1μF ceramic capacitor to ground isrequired.

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charge pump LDO generated internally. A 1μF ceramic to ground isrequired.
Analog power supply, A 1μF ceramic

RSTN

41I

IOVCC

42PWR

I/O power supply

SCL

43

I/O

I2C clock input

SDA

44

I/O

I2C data input and output

INT

45

I/O

External interrupt to the hostcapacitor to ground is required.
Digital power supply. A 1μF ceramic
capacitor to ground is required.

25

1112S12S13S14S282610S11S27279S10S29298S9S31307S8S30316S7283254S6S32S343323S4S33S36S3534External Reset, Low is active

S5S38PWR

S374036VDDD

35PWR

139S3VDDAFT6336U Package Diagram

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55.1

PACKAGE INFORMATION
Package Information of QFN-5x5-48L Package

Item

SymbolTotal Thickness
Stand Off
Mold Thickness
L/F Thickness

AA1
A2
A3bb1
DEe
JKL
aaabbbccc
dddeeeLead Width
Body Size
Lead Pitch
EP Size
Lead Length
Package Edge Tolerance
Mold Flatness
Co Planarity
Lead Offset
Exposed Pad Offset

Millimeter
Min
0.50----

Type
0.55
0.035
0.4

Max
0.6
0.05
----

0.152 REF
0.18
0.23
0.12
0.17
5 BSC
5 BSC
0.35 BSC
3.6
3.7
3.8
3.63.73.80.35
0.4
0.45
0.1
0.1
0.08
0.1
0.1

0.130.07

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