ICP-20100
High Accuracy, Low Power, Barometric Pressure
and Temperature Sensor IC
GENERAL INFORMATIONFEATURES

The ICP-20100 pressure sensor provides a high-accuracy, lowpower, barometric pressure and temperature sensor solution,that integrates a capacitive pressure sensor for monitoringpressure changes in the range of 30 to 110 kPa.
The ICP-20100 integrates a DSP module for on-chip
calibration with an Analog-to-Digital converter (ADC), digital
filtering, a FIFO and has I²C, I3CSM, and SPI interfaces
available. The solution can be configured to achieve ultra-low
noise or ultra-low power performance and is flexible toperform anywhere in-between. Additionally, the filters can be
enabled to allow even lower noise performance or activatefeatures such as filtering of pressure glitches (e.g.
opening/closing a window).
The ICP-20100 is available in a closed package with a venthole.

DEVICE INFORMATIONPARTNUMBER

PACKAGE

LID
OPENING

MSL**

ICP-20100*

2x2x0.8mm
LGA-10L

1-Hole1* Denotes RoHS and Green-Compliant Package** Moisture Sensitivity Level of the package

BLOCK DIAGRAM•

Digital-output pressure and temperature sensors,with programmable output: all-pressure, alltemperature or pressure & temperature
Programmable noise performance down to
0.5 Parms through programmable Oversampling
Ratio (OSR)
Digital filtering for pressure signals
o Finite Impulse Response (FIR) filter for
improved noise performanceo Infinite Impulse Response (IIR) filter for e.g.
filtering of pressure glitches
Package dimensions 2x2x0.8 mm (10-pin LGA)
96-byte FIFO buffer enables the application
processor to read up to 16 pressure-temperaturepairs in a burst
User-programmable Interrupt
Host interface: 12 MHz SPI/1 MHz I2C/12.5 MHz
I3CSM
Temperature operating range: -40°C to 85°C
Main Supply voltage: 1.8V ±10% or 3.3V ±10%
I/O supply voltage externally applied (1.2V ±10%,1.8V ±10% or 3.3V* ±10%) *available only when main
supply voltage equals 3.3V ±10%
RoHS and Green compliant

•

•

•
•

•
•
•
•
•

•

TYPICAL OPERATING CIRCUIT

GND

GND
VDDIO

APPLICATIONS••••

C2, 100nF

Smartphones and Tablets
Wearable Sensors
Home and Building Automation
Weather Stations

GND
INT

VDDIO

AD0

SCL

(VDDIO / GND)

VDD
C1, 100nF

SDA

GND

GND

InvenSense, Inc. reserves the right to change
specifications and information herein without notice
unless the product is in mass production and thedatasheet has been designated by InvenSense in writing
as subject to a specified Product / Process Change
Notification Method regulation.

InvenSense, a TDK Group Company
1745 Technology Drive, San Jose, CA 95110 U.S.A+1(408) 988–7339
invensense.tdk.com

Document Number: DS-000416
Revision: 1.4
Release Date: 08/12/2022

ICP-20100
TABLE OF CONTENTS
General Information ..................................................................................................................................................1
Device Information ....................................................................................................................................................1
Block Diagram ............................................................................................................................................................1
Applications ...............................................................................................................................................................1
Features .....................................................................................................................................................................1
Typical Operating Circuit ...........................................................................................................................................1
1

2

3

4

Introduction ...........................................................................................................................................................7
1.1

Purpose and Scope ........................................................................................................................................7

1.2

Product Overview ..........................................................................................................................................7

Pressure And Temperature Sensor Specifications .................................................................................................8
2.1

Operation Ranges ..........................................................................................................................................8

2.2

Operation Modes ...........................................................................................................................................8

2.3

Pressure Sensor Specifications ......................................................................................................................8

2.4

Temperature Sensor Specifications ...............................................................................................................9

Electrical Specifications .......................................................................................................................................10
3.1

Electrical Characteristics ..............................................................................................................................10

3.2

Absolute Maximum Ratings .........................................................................................................................12

3.3

Sensor System Timing ..................................................................................................................................12

3.4

I2C Timing Characterization .........................................................................................................................13

3.5

I3CSM Timing Characterization .....................................................................................................................14

3.6

SPI 4-Wire Mode Timing Characterization ...................................................................................................15

3.7

SPI 3-Wire Mode Timing Characterization ...................................................................................................16

Interface Specifications .......................................................................................................................................17
4.1

I3CSM / I2C Interface .....................................................................................................................................17

4.1.1

I2C Interface .........................................................................................................................................17

4.1.2

I3CSM Interface .....................................................................................................................................17

4.1.3

I2C Data Protocol ..................................................................................................................................18

4.1.4

I3CSM Data Protocol ..............................................................................................................................18

4.1.5

Supported I3CSM Common Command Codes (CCC) ..............................................................................19

4.1.6

I3CSM Provisional Identifier ...................................................................................................................19

4.1.7

I3CSM Bus Characteristics Register .......................................................................................................20

4.1.8

I3CSM Device Characteristics Register ...................................................................................................20

4.1.9

Fixed I2C slave address and address increment....................................................................................20

4.1.10I3CSM Slave Address ..............................................................................................................................20

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ICP-20100
4.2

4.2.1

SPI Protocol ..........................................................................................................................................21

4.2.2

SPI Modes ............................................................................................................................................22

4.2.3

SPI Frame Abort ...................................................................................................................................22

4.2.4

Supported Commands..........................................................................................................................22

4.3
5

6

7

SPI Interface .................................................................................................................................................20

Drive Strength Configuration .......................................................................................................................23

Applications Information .....................................................................................................................................24
5.1

ICP-20100 Pin Out Diagram And Signal Description ....................................................................................24

5.2

Typical Operating CircuitS ............................................................................................................................25

5.3

Bill of Materials for External Components ...................................................................................................26

5.4

ASIC identification........................................................................................................................................27

Pressure and Temperature Measurement ..........................................................................................................28
6.1

Pressure and Temperature Measurement Accuracy ...................................................................................28

6.2

Pressure and Temperature Measurement Sequencing ...............................................................................28

6.2.1

Duty Cycled Operation .........................................................................................................................28

6.2.2

Triggered operation .............................................................................................................................29

6.3

FIR Filter .......................................................................................................................................................30

6.4

IIR Filter ........................................................................................................................................................31

6.5

Boot Sequence .............................................................................................................................................31

6.6

Mode switching/selection ...........................................................................................................................34

6.7

Pressure/Temperature read-out .................................................................................................................34

6.7.1

Pressure conversion formula ................................................................................................................34

6.7.2

Temperature conversion formula ........................................................................................................35

FIFO ......................................................................................................................................................................36
7.1

FIFO Accessibility .........................................................................................................................................36

7.2

FIFO Full/Empty ...........................................................................................................................................37

7.3

FIFO Overflow/Underflow ...........................................................................................................................37

7.4

FIFO Watermark Low/High ..........................................................................................................................37

7.5

FIFO Flush ....................................................................................................................................................37

7.6

Absolute Pressure VaLue Overrun/Underrun ..............................................................................................37

7.7

Delta Pressure VaLue Overrun .....................................................................................................................378

Interrupts .............................................................................................................................................................38

9

Assembly ..............................................................................................................................................................39
9.1

Implementation and Usage Recommendations ..........................................................................................39

9.1.1

Soldering ..............................................................................................................................................39

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Revision: 1.4

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ICP-20100
9.1.2

Chemical Exposure and Sensor Protection ...........................................................................................39

10

Package Dimensions ........................................................................................................................................40

11

Part Number Part Markings .............................................................................................................................42

12

Register Map ....................................................................................................................................................43

13

Register Map Description ................................................................................................................................44

13.1

TRIM1_MSB .................................................................................................................................................44

13.2

TRIM2_LSB ...................................................................................................................................................44

13.3

TRIM2_MSB .................................................................................................................................................44

13.4

DEVICE_ID ....................................................................................................................................................44

13.5

IO_DRIVE_STRENGTH ..................................................................................................................................45

13.6

OTP_CONFIG1 ..............................................................................................................................................45

13.7

OTP_MR_LSB ...............................................................................................................................................45

13.8

OTP_MR_MSB ..............................................................................................................................................45

13.9

OTP_MRA_LSB .............................................................................................................................................46

13.10

OTP_MRA_MSB .......................................................................................................................................46

13.11

OTP_MRB_LSB .........................................................................................................................................46

13.12

OTP_MRB_MSB .......................................................................................................................................46

13.13

OTP_ADDRESS..........................................................................................................................................46

13.14

OTP_COMMAND ......................................................................................................................................47

13.15

OTP_RDATA .............................................................................................................................................47

13.16

OTP_STATUS ............................................................................................................................................47

13.17

OTP_DBG2 ...............................................................................................................................................47

13.18

OTP_STATUS2 ..........................................................................................................................................47

13.19

MASTER_LOCK .........................................................................................................................................48

13.20

MODE_SELECT .........................................................................................................................................48

13.21

INTERRUPT_STATUS ................................................................................................................................49

13.22

INTERRUPT_MASK ...................................................................................................................................50

13.23

FIFO_CONFIG ...........................................................................................................................................50

13.24

FIFO_FILL ..................................................................................................................................................51

13.25

SPI_MODE ................................................................................................................................................51

13.26

PRESS_ABS_LSB .......................................................................................................................................52

13.27

PRESS_ABS_MSB ......................................................................................................................................52

13.28

PRESS_DELTA_LSB ...................................................................................................................................52

13.29

PRESS_DELTA_MSB ..................................................................................................................................53

13.30

DEVICE_STATUS .......................................................................................................................................53

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ICP-20100
13.31

I3C_INFO ..................................................................................................................................................53

13.32

VERSION ...................................................................................................................................................53

13.33

PRESS_DATA_0 ........................................................................................................................................54

13.34

PRESS_DATA_1 ........................................................................................................................................54

13.35

PRESS_DATA_2 ........................................................................................................................................54

13.36

TEMP_DATA_0 .........................................................................................................................................54

13.37

TEMP_DATA_1 .........................................................................................................................................54

13.38

TEMP_DATA_2 .........................................................................................................................................55

14

Tape & Reel Specification ................................................................................................................................56

15

Ordering Guide ................................................................................................................................................57

16

References .......................................................................................................................................................58

17

Revision History ...............................................................................................................................................59

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Revision: 1.4

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ICP-20100
LIST OF FIGURES
Figure 1. I2C Bus Timing Diagram .................................................................................................................................13
Figure 2. I3CSM Bus Timing Diagrams ...........................................................................................................................14
Figure 3. SPI 4-Wire Mode Bus Timing Diagram ..........................................................................................................15
Figure 4. SPI 3-Wire Mode Bus Timing Diagram ..........................................................................................................16
Figure 5. I2C Data Protocol ...........................................................................................................................................18
Figure 6. I3CSM Data Protocol.......................................................................................................................................19
Figure 7. 4-Wire SPI Transaction Overview .................................................................................................................21
Figure 8. 3-Wire SPI Transaction Overview .................................................................................................................21
Figure 9. Pin Out Diagram for ICP-20100, 2mm x 2mm x 0.8mm LGA ........................................................................24
Figure 10. ICP-20100 Application Schematic (I3CSM / I2C Interface to Host) ...............................................................25
Figure 11. ICP-20100 Application Schematic (SPI Interface to Host) ...........................................................................26
Figure 12. Duty Cycled Measurement .........................................................................................................................28
Figure 13. Duty Cycled Measurement Without Wait ..................................................................................................29
Figure 14. Pressure-Only Mode ...................................................................................................................................29
Figure 15. FIR Filter ......................................................................................................................................................30
Figure 16. Pressure Output Code.................................................................................................................................34
Figure 17. Temperature Output Code .........................................................................................................................35
Figure 18. FIFO Read Out Modes .................................................................................................................................36
Figure 19. ICP-20100 Package Diagrams......................................................................................................................40
Figure 20. Part Number Part Markings for ICP-20100 .................................................................................................42
Figure 21. ICP-20100 Tape Dimensions....................................................................................................56
Figure 22. ICP-20100 Tape and Reel Drawing ..............................................................................................................56

LIST OF TABLES
Table 1. Operation Ranges.............................................................................................................................................8
Table 2. Operation Modes .............................................................................................................................................8
Table 3. Pressure Sensor Specifications.........................................................................................................................8
Table 4. Temperature Sensor Specifications .................................................................................................................9
Table 5. Electrical Supplies ..........................................................................................................................................10
Table 6. Electrical Specifications ..................................................................................................................................11
Table 7. Absolute Maximum Ratings ...........................................................................................................................12
Table 8. System Timing Specifications .........................................................................................................................12
Table 9. I2C Parameters Specification ..........................................................................................................................13
Table 10. I3CSM Parameters Specification ....................................................................................................................14
Table 11. SPI 4-Wire Mode Parameters Specification .................................................................................................15
Table 12. SPI 3-Wire Mode Parameters Specification .................................................................................................16
Table 13. Supported I3CSM CCCs ..................................................................................................................................19
Table 14. I3CSM Provisional Identifier ..........................................................................................................................19
Table 15. I3CSM Bus Characteristics Register................................................................................................................20
Table 16. SPI Data Rate Specifications .........................................................................................................................21
Table 17. SPI Supported Commands............................................................................................................................22
Table 18. ICP-20100 Signal Descriptions......................................................................................................................24
Table 19. ICP-20100 Package Dimensions ...................................................................................................................41
Table 20. Part Number Part Markings .........................................................................................................................42
Table 21. Register Map ................................................................................................................................................43

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Revision: 1.4

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ICP-20100
1

INTRODUCTION

1.1

PURPOSE AND SCOPE

This document is a preliminary product specification, providing a description, specifications, and design related
information for the ICP-20100 Pressure Sensor.

1.2

PRODUCT OVERVIEWThe ICP-20100 is a high accuracy, low power, barometric pressure and temperature sensor solution that integrates
a capacitive pressure sensor for monitoring pressure changes in the range of 30 to 110kPa.
The ICP-20100 pressure and temperature sensor device combines TDK InvenSense 2nd generation (20k-series)
capacitive pressure sensors.
Other industry-leading features include up to 20-bits output data, programmable digital filters, an embedded
temperature sensor, calibration, FIFO, and programmable interrupts. The device features I2C, I3CSM, and SPI serialinterfaces, a VDD operating range of 1.8V ±10% or 3.3V ±10%, and an externally applied VDDIO operating range of
1.2V ±10%, 1.8V ±10% or 3.3V* ±10% (*available only when VDD voltage equals 3.3V ±10%).
The host interface can be configured to support SPI slave or I 2C/ I3CSM slave modes. The SPI interface supports
speeds up to 12 MHz, the I2C interface supports speeds up to 1 MHz, and the I3CSM interface supports speeds up to
12.5 MHz.
The MEMS sensor consists of a capacitive pressure sensor whose capacitance changes according to the pressure
applied. An integrated temperature sensor on the same MEMS sensor allows for accurate temperature
measurements.

Document Number: DS-000416
Revision: 1.4

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ICP-20100
2

PRESSURE AND TEMPERATURE SENSOR SPECIFICATIONS

2.1

OPERATION RANGESPARAMETER
Functional Pressure Range
Operating Temperature Range

VALUE
30 to 110
-40 to 85

UNITS
kPa
°C

Table 1. Operation Ranges

2.2

OPERATION MODES

The sensor can be operated in the following measurement modes to satisfy different requirements for power
consumption vs. noise, accuracy, and measurement frequency.
Operation mode can be selected using register field MEAS_CONFIG in register MODE_SELECT. Modes 0 to 3 are
pre-defined while Mode 4 is user configurable. Please refer to “AN-000238: ICP-20100 User Configurable
Operation Mode and IIR Filter” for details on how to configure MODE4.

PARAMETER

BW
(HZ)

ODR
(HZ)

MODE0
MODE1
MODE2
MODE3
MODE4*

6.25
30
10
0.5
12.5

25
120
40
2
25

PRESSURE
NOISE (PARMS)
TYP
0.5
1
2.5
0.5
0.3

CURRENTCONSUMPTION
(µA)
TYP
211
222
49
23
250

IIR FILTERENABLEDFIR FILTERENABLED

No
No
No
No
No

Yes
Yes
Yes
Yes
No

Table 2. Operation Modes
Note: MODE4 is user configurable as explained in the application note “AN-000238: ICP-20100 User Configurable Operation Mode and IIR
Filter”. MODE4 functionality shown is default device calibration, user can modify MODE4 configuration as explained in AN-000238.

2.3

PRESSURE SENSOR SPECIFICATIONS

Pressure sensor specifications are given in Table 3. Default conditions of 25 °C, VDD = 1.8V and VDDIO = 1.8V
apply, unless otherwise stated.
PARAMETER
Functional pressure range
Absolute Accuracy
Relative Accuracy
Temperature Coefficient of Offset(TCO)
Long-Term Drift (during 1 year)
Solder Drift
Resolution

CONDITIONSValid from -20°C to 65°C
Any step ≤ 1 kPa at 25°C
P = 100 kPa
25°C … 45°C
Board-level specification

MIN

TYP

MAX

UNITS

NOTES

30

70
±20
±1

110

kPa
Pa
Pa

1
1

±0.4

Pa/°C

1

±10
±0.4
20

Pa
hPa
bits

2
3, 4

Table 3. Pressure Sensor Specifications
Notes:
1.
2.
3.
4.

Parameter specifications shown are component-level. They may be different at the board-level and may depend on PCB characteristics including but
not limited to PCB material, number of layers, PCB thickness. They may also depend on usage conditions.
Determined based on HTOL data.
Derived from validation or characterization of parts, not tested in production.
Board-level spec values depend on specific board design. For design information of boards used for device characterization, that forms the basis of the
spec values reported here, please contact your local TDK InvenSense FAE.

Document Number: DS-000416
Revision: 1.4

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ICP-20100
2.4

TEMPERATURE SENSOR SPECIFICATIONSSpecifications of the temperature sensor are shown in Table 4.
PARAMETER
Temperature accuracy
Output Data rate

CONDITIONS

MIN

TYP
±0.5
ODR

Table 4. Temperature Sensor Specifications
Notes:
1.

Temperature ODR = Pressure ODR for selected mode

Document Number: DS-000416
Revision: 1.4

Page 9 of 60

MAX

UNITS
°C
Hz

NOTES
1

ICP-20100
3

ELECTRICAL SPECIFICATIONS

3.1

ELECTRICAL CHARACTERISTICS

Default conditions of 25 °C, VDD = 1.8V and VDDIO = 1.8V apply to values in Table 5 and Table 6, unless otherwise
stated.
PARAMETER
Main Supply Voltage

I/O Supply Voltage

Supply current

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

1.62

1.8

1.98

V

2.97

3.3

3.63

V

1.08

1.2

1.32

V

1.62

1.8

1.98

V

2.97

3.3

3.63

V

-

2.65

-

µA

VDD

VDDI0

IDD

standby

Table 5. Electrical Supplies

Document Number: DS-000416
Revision: 1.4

COMMENTS

Page 10 of 60

Externally suppliedICP-20100
PARAMETERCONDITIONS

MIN

TYP

MAX

UNITS

NOTES

SUPPLIES
Supply Ramp Time

Monotonic ramp. Ramp rate is 10% to 90% of
the final value

0.01

Power Supply Noise

10

ms

50

mV
peak-peak

2
2

TEMPERATURE SENSOR
Operating Range
ADC Resolution
ODR

-20

Ambient

65

°C

800

bits
Hz

15

2
1
1

I2C ADDRESS
AD0 = 0AD0 = 1I2C ADDRESS

0x63
0x64

DIGITAL INPUTS
VIH, High Level Input Voltage
VIL, Low Level Input Voltage

0.7*VDDIOV
0.3*VDDIOV

2

DIGITAL OUTPUTS
VOH, High Level Output
Voltage
VOL, Low-Level Output Voltage

0.75*VDDIO

V
2
0.25*VDDIO

V

Drive strength for VDDIO =
1.2V

0.5
2
3
4

2
4
6
8

4
6
9
12

mA

Drive strength for VDDIO =1.8V/3.3V

1
2
4
8

2
4
8
12

4
8
12
16

mA

-2

+2

%

2

-3.125+3.125%2

INTERNAL CLOCK SOURCE
Clock Frequency Initial
Tolerance

Low clock frequency 8kHz
Main clock frequency 1.9MHz

Table 6. Electrical Specifications
Notes:
1.
2.

Guaranteed by design.
Derived from validation or characterization of parts, not guaranteed in production

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ICP-20100
3.2

ABSOLUTE MAXIMUM RATINGS

Stress levels beyond those listed in Table 7 may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these conditions cannot be guaranteed. Exposure to the absolute
maximum rating conditions for extended periods may affect the reliability of the device.
PARAMETERRATING

Supply voltage, VDD-0.3V to +4.0V

Supply Voltage, SCL & SDA-0.3V to VDDIO+0.3V

Operating temperature range-40°C to +85°C

Storage temperature range-40°C to +125°C

ESD HBM

1.5 kVESD CDM

500V

Radiated EMI immunity

4kV/m

Conducted EMI immunity

2Vrms

Overpressure>600kPa
Table 7. Absolute Maximum Ratings

3.3

SENSOR SYSTEM TIMING

Default conditions of 25 °C, VDD = 1.8V and VDDIO = 1.8V apply to TYP values listed in Table 8, unless otherwise
stated. MAX values apply over the specified operating range of VDD and over the operating temperature range.
PARAMETERSYMBOLPower-up time

tPU

CONDITIONS

MIN

-

TYP

2

MAX

-

Table 8. System Timing Specifications

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Revision: 1.4

Page 12 of 60

UNITS

COMMENTS

ms

Time between VDD reaching VPU and sensor
entering idle state; VPU is the power-up
voltage, the minimum VDD at which start-up
time is guaranteed, it has a value of 1.56V.

ICP-20100
I2C TIMING CHARACTERIZATION

3.4

Default conditions of 25 °C, VDD = 1.8V and VDDIO = 1.8V apply to values in Table 9, unless otherwise stated.
PARAMETERS
2

CONDITIONS

MIN

TYP

MAX

UNITS

NOTES

1

2

I C TIMINGI C FAST-MODE PLUS

fSCL, SCL Clock Frequency

MHz

1

tHD.STA, (Repeated) START Condition Hold Time

260

ns

1

tLOW, SCL Low Period

500

ns

1

tHIGH, SCL High Period

260

ns

1

tSU.STA, Repeated START Condition Setup Time

260

ns

1

tHD.DAT, SDA Data Hold Time

5

ns

1

tSU.DAT, SDA Data Setup Time

55

ns

1

tr, SDA and SCL Rise Time 2

Cb bus cap. From 10 to 400 pF

20*(VDD/5.5V)

120

ns

1

tf, SDA and SCL Fall Time 2

Cb bus cap. From 10 to 400 pF

20*(VDD/5.5V)

120

ns

1

tSU.STO, STOP Condition Setup Time

260

ns

1

tBUF, Bus Free Time Between STOP and START
Condition

500

ns

1

Cb, Capacitive Load for each Bus Line

550
450

pF

1

tVD.DAT, Data Valid Timens

1

tVD.ACK, Data Valid Acknowledge Time

450

ns

1

Table 9. I2C Parameters Specification
Notes:
1.

Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets.

Figure 1. I2C Bus Timing Diagram

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ICP-20100
3.5

I3CSM TIMING CHARACTERIZATION

Default conditions of 25 °C, VDD = 1.8V and VDDIO = 1.8V apply to values in Table 10, unless otherwise stated.
PARAMETERS
I3CSM TIMING

CONDITIONS

MIN

TYP

MAX

UNITS

12.5

12.9

MHz

I3CSM SDR modefSCL, SCL Clock FrequencytLOW, SCL Low Period

From 30% to 30%

24nstDIG_L, SCL Low Period (to high transition)

From 30% to 70%

32

ns

tHIGH_MIXED, SCL High Period for Mixed Bus

From 70% to 70%

24tDIG_H_MIXED, SCL High Period for Mixed Bus

From 70% to 30%

32

tHIGH, SCL High Period

From 70% to 70%

24tDIG_H, SCL High Period

From 70% to 30%

32

tSCO, Clock in to Data Out for Slave

ns
45

ns
ns
ns

12

ns

tCR, SCL Rise Time

Capped at 60

12ns

tCF, SCL Fall Time

Capped at 60

12ns

tHD_PP, SDA Signal Data Hold in Push-Pull mode

Slave

0

tSU_PP, SDA Signal Data Setup in Push-Pull mode
Cb, Capavitive Load per Bus Line

3
SDA/SCL

Table 10. I3CSM Parameters Specification

Figure 2. I3CSM Bus Timing Diagrams

Document Number: DS-000416
Revision: 1.4

nsPage 14 of 60

ns
50

pF

NOTES

ICP-20100
3.6

SPI 4-WIRE MODE TIMING CHARACTERIZATION

Default conditions of 25°C and 1.8V supply voltage apply to values in Table 11, unless otherwise stated.
PARAMETERS

CONDITIONS

MIN

TYP

MAX

UNITS

NOTES

12

MHz

1

SPI TIMING
fSPC, SCL Clock FrequencytLOW, SCL Low Period

40

ns

1

tHIGH, SCL High Period

40

ns

1

tSU.CS, CS Setup Time

20

ns

1

tHD.CS, CS Hold Time

20

ns

1

tSU.SDI, SDI Setup Time

5

ns

1

tHD.SDI, SDI Hold Time

20

ns

1

ns

1

tVD.SDO, SDO Valid Time

Cload = 50 pF

tHD.SDO, SDO Hold Time

Cload = 50 pF

32

ns

1

tDIS.SDO, SDO Output Disable Time

5
25

ns

1

tFall, SCLK Fall Time

5

ns

2

tRise, SCLK Rise Time

5

ns

2

Table 11. SPI 4-Wire Mode Parameters Specification
Notes:
1.
2.

Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets
Based on other parameter values

Figure 3. SPI 4-Wire Mode Bus Timing Diagram

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ICP-20100
3.7

SPI 3-WIRE MODE TIMING CHARACTERIZATION

Default conditions of 25°C and 1.8V supply voltage apply to values in Table 12, unless otherwise stated.
PARAMETERS

CONDITIONS

MIN

TYP

MAX

UNITS

NOTES

12

MHz

1

SPI TIMING
fSPC, SCL Clock FrequencytLOW, SCL Low Period

40

ns

1

tHIGH, SCL High Period

40

ns

1

tSU.CS, CS Setup Time

20

ns

1

tHD.CS, CS Hold Time

20

ns

1

tSU.SDI, SDI Setup Time

5

ns

1, 3

tHD.SDI, SDI Hold Time

20

ns

1, 3

ns

1, 3

tVD.SDO, SDO Valid Time

Cload = 50 pF

tHD.SDO, SDO Hold Time

Cload = 50 pF

32

ns

1, 3

tDIS.SDO, SDO Output Disable Time

5
25

ns

1, 3

tFall, SCLK Fall Time

5

ns

2

tRise, SCLK Rise Time

5

ns

2

Table 12. SPI 3-Wire Mode Parameters Specification
Notes:
1.
2.
3.

Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets
Based on other parameter values
Separate SDI and SDO times are provided to account for input and output transactions on the SDIO interface for 3-wire SPI mode

Figure 4. SPI 3-Wire Mode Bus Timing Diagram

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ICP-20100
4

INTERFACE SPECIFICATIONSThe ICP-20100 supports I3CSM, I2C, SPI host-interface options. The ICP-20100 always operates as a slave whenconnected to the host. Selection between SPI and I3CSM/I2C is done with the CSB pin. If the pin is pulled low, the
SPI interface is active and I3CSM/I2C are disabled. If CSB is high, I3CSM/I2C is selected.

I3CSM / I2C INTERFACE

4.1

The I3CSM/I2C interface can operate in I2C legacy mode or I3CSM SDR mode (SCL clock frequency up to 12.5 MHz).
After reset, the device requires a minimum of 10 clock cycles to initialize the I3CSM/I2C interface. Before doing this,no communication is possible through I3CSM/I2C. This initialization can be done through a dummy write transaction
to address 0xEE.

4.1.1 I2C Interface
The ICP-20100 I2C slave interface can operate in following modes:•

Standard mode (SCL clock frequency up to 100 kHz)•Fast mode (SCL clock frequency up to 400 kHz)•Fast mode plus (SCL clock frequency up to 1 MHz)

4.1.2 I3CSM Interface
I3CSM is a new 2-wire digital interface comprised of the signals serial data (SDA) and serial clock (SCLK). I3C SM isintended to improve upon the I2C interface, while preserving backward compatibility.
I3CSM carries the advantages of I²C in simplicity, low pin count, easy board design, and multi-drop (vs. point topoint), but provides the higher data rates, simpler pads, and lower power of SPI. I3C SM adds higher throughput fora given frequency, dynamic addressing.
The I3CSM interface complies with “MIPI I3C Specification -- public edition”, version 1.0, 23 December 2016.
By default, the I2C protocol is used. Only when the device detects that it is connected to an I3CSM bus, will it
permanently switch to the I3CSM protocol and the glitch filter will be disabled.
The I3CSM interface supports:•

SDR data rate up to 12.5 MHz•

Dynamic Addressing•

Error detection (Parity)•

Common Command Codes described in Table 13.

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ICP-20100
4.1.3 I2C Data Protocol
A transfer is always started by addressing the device with an I2C write header followed by the targeted 8-bit
register address.
For write accesses, the master continues sending the 8-bit data word.
For read accesses, the master must change the transfer direction from write to read by sending an I 2C read header
with the correct address. The device then transmits the data word (if available). An address increment featureenables reading multiple data bytes in a row.
All commands and memory locations are mapped to an 8-bit register space which can be accessed via the I2C
interface. Data is always transferred as 8-bit words. Figure 5 illustrates the different transfer types.

Figure 5. I2C Data Protocol

The I2C interface has access to all registers needed for functional operation.
Every byte transmitted from the I2C master to the slave device must be acknowledged.
In read direction, the master indicates with the acknowledge if an address increment read needs to be initiated.
An ACK from the master indicates a request for an address increment read. A NACK from the master indicates theend of the read transfer and needs to be followed by a STOP condition.
Every last I2C bus transaction to ICP-20100 should end with read to address 0x00. At least once in every 255 I2C
read or burst read transactions (Burst read accesses treated as one read transaction independent of burst size) on
the bus to other I2C devices, the host should perform a read to ICP-20100 address 0x00.
One possible implementation of the requirement above would be to add a dummy read from ICP-20100 address
0x00 after any I2C transactions.
Another possible implementation is to perform a dummy read from ICP-20100 address 0x00 after each last I2C bus
transaction to ICP-20100 and add a dummy read from ICP-20100 address 0x00 at a constant rate of 110Hz.

4.1.4 I3CSM Data Protocol
The device is switched to I3CSM mode by sending the reserved byte 7’h7E.
While in I3CSM mode, the device is addressed with an I3CSM write header containing the dynamic device address,
followed by the targeted 8-bit register address.
For write accesses, the master continues sending the 8-bit data word.
For read accesses, the master must change the transfer direction from write to read by sending an I3CSM readheader containing the dynamic device address. The device then transmits the data word. An address increment
feature allows to read out multiple data bytes in a row.
All commands and memory locations are mapped to an 8-bit register space which can be accessed via the I3CSM
interface. Data is always transferred as 8-bit words. Figure 6 illustrates the different transfer types.

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ICP-20100

Figure 6. I3CSM Data Protocol

The I3CSM interface has access to all registers needed for functional operation.
Every last I3C bus transaction to ICP-20100 should end with read to address 0x00. At least once in every 255 I3Cread or burst read transactions (Burst read accesses treated as one read transaction independent of burst size) on
the bus to other I3C devices, the host should perform a read to ICP-20100 address 0x00.
One possible implementation of the requirement above would be to add a dummy read from ICP-20100 address
0x00 after any I3C transactions.
Another possible implementation is to perform a dummy read from ICP-20100 address 0x00 after each last I3C bus
transaction to ICP-20100 and add a dummy read from ICP-20100 address 0x00 at a constant rate of 110Hz.

4.1.5 Supported I3CSM Common Command Codes (CCC)
I3CSM features CCCs that allow the master to manage the bus and its connected slaves, either directly or through abroadcast.
The I3CSM master should not use any unsupported CCCs.
CODE

CCC TYPEMNEMONICDESCRIPTION

0x06
0x07
0x86
0x87
0x88
0x8D
0x8E
0x8F
0x90

broadcastbroadcastdirectdirectdirectdirectdirectdirectdirectRSTDAAENTDAARSTDAASETDASASETNEWDAGETPIDGETBCRGETDCRGETSTATUS

Reset Dynamic Address Assignment
Enter Dynamic Address Assignment
Reset Dynamic Address Assignment (p2p)
Set Dynamic Address from Static Address
Set New Dynamic Address
Get Provisional ID
Get Bus Characteristics Register
Get Device Characteristics Register
Get Device Status

Table 13. Supported I3CSM CCCs

4.1.6 I3CSM Provisional Identifier
The Provision Identifier (PID) is hardwired as:
FIXED

BIT

NAME

47:33
32
31:16
15:12
11:0

MIPI Manufacturer ID
PID Type Selector
Part ID
Instance ID
Vendor defined

VALUE
15’h02350000Table 14. I3CSM Provisional Identifier

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NOTE
TDK Manufacturer ID
0 = PID fixed value

ICP-20100
4.1.7 I3CSM Bus Characteristics Register
The Bus Characteristics Register (BCR) is hardwired as:
FIXED

BIT

NAME

7
6
5
4
3
2
1
0

Device Role [1]Device Role [0]Data Rate support
Bridge Identifier
Offline Capable
IBI Payload
IBI Request Capable
Max Data Speed Limit

NOTE

VALUE
0
0
0
0
0
0
0
0

fixed (slave role)
fixed (slave role)
fixed (SDR only)
fixed (no bridge)
fixed (not offline capable)
fixed (IBI not supported)
fixed (IBI not supported)
fixed (no speed limit, GETMXDS not supported)

Table 15. I3CSM Bus Characteristics Register

4.1.8 I3CSM Device Characteristics Register
The Device Characteristics Register (DCR) byte [7:0] is hardwired to the fixed value 0x62, which corresponds to the“Environment Pressure Sensor” as defined by MIPI. (seehttps://www.mipi.org/MIPI_I3C_device_characteristics_register)

4.1.9 Fixed I2C slave address and address increment
The value assigned on AD0 allows to adapt the I2C address as follows:••

AD0 = 0 : I2C address = 0x63
AD0 = 1 : I2C address = 0x64

4.1.10 I3CSM Slave Address
I3CSM supports dynamic addressing feature which allows master and slaves to do dynamic address arbitration on
the I3CSM bus.
The concatenation of {PID[15:0],BCR[7:0],DCR[7:0]} is used to determine the priority for dynamic addressing by the
Master.
Since there is already a static address present for I2C, this can be used via the SETDASA command if known by the
Master up front. When applicable, the address increment is applied as well.

4.2

SPI INTERFACEThe ICP-20100 SPI slave interface can operate in the following modes:•

3-wire mode using pins CSB, SDIO and SCL•

4-wire mode using pins CSB, SDI, SDO and SCL

The SPI interface has access to all registers needed for functional operation.

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ICP-20100
4.2.1 SPI Protocol
The SPI frame format is as follows:
1.
2.
3.
4.
5.
6.

SPI master pulls CSB low
SPI master sends 1 command byte
SPI master sends 1 address byte
For write frames, SPI master sends a master data byte
For read frames, IFPS replies with a number of slave data bytes
SPI master releases CSB

This is pictured in the Figure 7 and Figure 8 respectively for 4-wire SPI and 3-wire SPI.

Figure 7. 4-Wire SPI Transaction Overview

Figure 8. 3-Wire SPI Transaction Overview

A transmitter conceptually produces data bits at the falling edge of the SPI clock SCL, and a receiver samples thedata bits at the rising edge of the SPI clock.
Bytes are transmitted in the order MSB to LSB.
The slave keeps SDO in high-Z unless a reply is expected from the command (read request).
PARAMETERDESCRIPTION

MIN

spi_speed

Data rate of the SPI protocol

DC

TYP

MAX

UNIT

12

Mbps

Table 16. SPI Data Rate Specifications

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COMMENTSICP-20100
4.2.2 SPI Modes
The ICP-20100 supports SPI MODE0 and MODE3.
When the SPI interface is idle, SCL is low. Data is propagated on the clock's falling edge and captured on the clock's
rising edge.

4.2.3 SPI Frame Abort
The SPI master can abort an SPI frame by de-asserting CSB.

4.2.4 Supported Commands
Table 17 shows the supported commands via the SPI interface.
COMMAND CODE
0x3C
0x33

COMMANDDESCRIPTIONCMD_READ_REG
CMD_WRITE_REG

Read from register
Write to register

Table 17. SPI Supported Commands

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ICP-20100
4.3

DRIVE STRENGTH CONFIGURATION

The device starts up with drive strength 2 mA in 1.8V IO supply mode. If the application requires high speed
communication (>1 MHz) or uses VDDIO=1.2V, the drive strength settings need to be adapted. This is done byreconfiguring register IO_DRIVE_STRENGTH (section 13.5 in this datasheet).
This section provides MATLAB sample code on how to do this. The following terminology is used in this code forregister map references:
regMap.Register_Name.Register_Field_Name.Write(Value)
where-“Register_Name” is the register name;-“Register_Field_Name” is the name of the register field in the register;-“Write” is a write operation for the specified register field;-“Value” is the value being written to the specified register field

Please refer to sections 12 and 13 for information about the registers/register fields shown in the sample code.
function PowerMode(self)%% PowerMode: function to move into power mode
global regMap%% Move to power mode if not already inside
if (regMap.MODE_SELECT.POWER_MODE.read==0)
fprintf('Moving into power mode...\n')regMap.MODE_SELECT.POWER_MODE.write(1);pause(0.001);
end
end
function Configure_drive_strength(self)%% Configure_drive_strength: sample code on how to configure the drive strength% after a reset of the device
global regMap
self.PowerMode;%% Configure the drive strength mirror registers% This example configures a drive strength of 12mA for 1.8V IO supply
regMap.IO_DRIVE_STRENGTH.IO_DS.write('0x3');
end

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ICP-20100
5

APPLICATIONS INFORMATION

5.1

ICP-20100 PIN OUT DIAGRAM AND SIGNAL DESCRIPTIONPIN NUMBER
1
2
3

PIN NAME
CSB
SCL
VSS

4

SDA / SDIO / SDI

5

VDD

6

SDO / AD0

7
8
9
10

INT
RESV
RESV
VDDIO

DESCRIPTIONSPI Chip SelectI3CSM / I2C / SPI Serial Clock
Power Supply Ground
SDA: I3CSM / I2C serial data; SDIO: SPI serial data I/O (3-wire mode);
SDI: SPI serial data input (4-wire mode)
Power Supply Voltage
SDO: SPI serial data output (4-wire mode);
AD0: I3CSM / I2C slave address LSB
Interrupt Output
Connect to Ground
Connect to Ground
IO Power Supply

Table 18. ICP-20100 Signal Descriptions

8

9

10

RESV

RESV

VDDIO

7

1

INT

CSB

BOTTOM VIEW

62

SDO / AD0

SCL

5
VDD

4
SDA / SDIO
/ SDI

3
VSS

Figure 9. Pin Out Diagram for ICP-20100, 2mm x 2mm x 0.8mm LGA

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ICP-20100
5.2

TYPICAL OPERATING CIRCUITS

GND

GND
VDDIO
C2, 100nF

GND
INT

VDDIO

AD0

SCL

(VDDIO / GND)

VDD
C1, 100nF

SDA

GND

GND

Figure 10. ICP-20100 Application Schematic (I3CSM / I2C Interface to Host)
Note: I2C lines are open drain and pull-up resistors (e.g. 5kΩ) are required.

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ICP-20100
GND

GND
VDDIO
C2, 100nF

GND
INT

CSB

SDO

SCL

VDD
C1, 100nF

SDIO
/ SDI

GND

GND

Figure 11. ICP-20100 Application Schematic (SPI Interface to Host)

5.3

BILL OF MATERIALS FOR EXTERNAL COMPONENTSCOMPONENTLABELSPECIFICATIONQUANTITYVDD Bypass Capacitor

C1

X7R, 100nF ±10%

1

VDDIO Bypass Capacitor

C2

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ICP-20100
5.4

ASIC IDENTIFICATION

For identifying this device, please use following procedure:
1) Power-on the ASIC
2) Initialize the I2C interface by toggling the clock line a few times. The easiest way to do that is byinserting a dummy I2C write transaction. You can, for example, execute the first transaction (write tolock register) twice.
3) Check that the value from register regMap.device_id equals 0x63
4) Check the value from register regMap.version:•

0x00 indicates a device version A•

0xB2 indicates a device version B

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ICP-20100
6

PRESSURE AND TEMPERATURE MEASUREMENTThe ICP-20100 uses a 2nd order  ADC with time-multiplexed pressure and temperature measurements.
Integration time for measurement, or over-sampling ratio (OSR) can be configured independently for pressure andtemperature.

6.1

PRESSURE AND TEMPERATURE MEASUREMENT ACCURACY

Increasing the pressure OSR improves the noise on the pressure measurement but also results in more current
consumption due to a delayed return to STANDBY mode.
Increasing the temperature OSR improves the noise on the temperature measurement and on the pressure
measurement due to the non-linear pressure compensation as a function of the temperature but also results inmore current consumption due to a delayed return to STANDBY.
The pressure and temperature OSR values are limited by the Output Data Rate (ODR) selection. For details of therelationship between these parameters, refer to section 6.2.
For given OSR and ODR settings, the noise can further be optimized by using an IIR filter. Refer to section 0 for
details of the IIR filter.

6.2

PRESSURE AND TEMPERATURE MEASUREMENT SEQUENCING

Pressure and temperature measurements are time-multiplexed, with pressure measurement performed first andfollowed by temperature measurement.
A measurement can be started either automatically (duty cycled operation) or manually (triggered operation).

6.2.1 Duty Cycled Operation
In duty cycled operation Pressure/Temperature measurements are automatically started.
The time between 2 measurements is defined by the ODR (Output Data Rate) setting and is timed based on the
low power clock.
In Figure 12 and Figure 13, TOSR_P is the pressure sensor OSR and TOSR_T is the temperature sensor OSR.

Figure 12. Duty Cycled Measurement

If the configured ODR period is smaller than the conversion time for pressure and temperature, the actual ODR isadapted to match the conversion time.

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ICP-20100

Figure 13. Duty Cycled Measurement Without Wait

By disabling the pressure or temperature measurement through setting its respective OSR configuration register(refer to the application note “AN-000238: ICP-20100 User Configurable Operation Mode and IIR Filter”) to value 0,
a temperature-only or pressure-only measurement can be configured.
If a pressure-only setting is combined with an ODR period setting that is smaller than the conversion time, amaximal conversion rate can be established in which no settling is needed for each individual sample and a higher
ODR can be reached. The same principle applies for temperature-only setting.

Figure 14. Pressure-Only Mode

The maximum ODR can be calculated based on the pressure and temperature OSR by the following formula:
ODRMAX(Hz)= 106/(168+2.1*1.5*(OSRPRESS+OSRTEMP))
with OSRPRESS, OSRTEMP the pressure and temperature Over Sampling Ratio.
where 𝑂𝑆𝑅𝑃𝑅𝐸𝑆𝑆 = (𝑂𝑆𝑅_𝑃𝑅𝐸𝑆𝑆𝑟𝑒𝑔𝑖𝑠𝑡𝑒𝑟 + 1) ∗ 25 and 𝑂𝑆𝑅𝑇𝐸𝑀𝑃 = (𝑂𝑆𝑅_𝑇𝐸𝑀𝑃𝑟𝑒𝑔𝑖𝑠𝑡𝑒𝑟 + 1) ∗ 25

6.2.2 Triggered operation
Triggered operation (also called forced measurement mode) performs a single Pressure, Temperature, or
Pressure/Temperature pair measurement. After the measurement, the device returns to standby mode.
Triggered operation is only supported for MODE4.

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ICP-20100
6.3

FIR FILTERThe ICP-20100 includes a FIR filter in the signal path.
The FIR filter is a low pass filter, filtering off the remaining noise above ODR/4.

Figure 15. FIR Filter

In case the FIR filter is enabled first 14 samples should be ignored after mode change. This can be done byconfiguring ICP-20100 in required mode and poll for FIFO count to be 14 and flushing FIFO or by using FIFO
watermark interrupt. The following sequence will explain ignoring first 14 samples using FIFO watermark interrupt:1) Power-on the ASIC
2) Only for I2C: initialize the I2C interface by toggling the clock line a few times. The easiest way to do thatis by inserting a dummy I2C write transaction.
3) Configure the FIFO watermark high to 14 samples•

regMap.FIFO_CONFIG = 0xE04) Unmask the watermark high interrupt•

regMap.INTERRUPT_MASK = 0xFB

5) Start a measurement•

regMap.MODE_SELECT.MEAS_CONFIG = M (M is the selected mode)•

regMap.MODE_SELECT.MEAS_MODE = 1•

regMap.MODE_SELECT.POWER_MODE = 0

6) Wait for the interrupt
7) Stop the measurement•

regMap.MODE_SELECT = 0x00•

wait 10us;8) Flush the FIFO•

regMap.FIFO_FILL = 0x80;

9) Reconfigure the interrupt settings if required for the application and detection of measurement data
10) Start a measurement•

regMap.MODE_SELECT.MEAS_CONFIG = M (M is the selected mode)•

regMap.MODE_SELECT.MEAS_MODE = 1•

regMap.MODE_SELECT.POWER_MODE = 0

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ICP-20100
11) Wait for the interrupt or use another mechanism (polling, fixed wait) to detect if measurement data isavailable
12) Read the data from FIFO registers•

Press[7:0] = regMap.PRESS_DATA_0•

Press[15:8] = regMap.PRESS_DATA_1•

Press[19:16] = regMap.PRESS_DATA_2•

Temp[7:0] = regMap.TEMP_DATA_0•

Temp[15:8] = regMap.TEMP_DATA_1•

Temp[19:16] = regMap.TEMP_DATA_2

13) Repeat step 12 until the FIFO is empty
In case FIR filter is disabled (for operation mode 4) the first sample after mode change need to be ignored.

6.4

IIR FILTERThe ICP-20100 includes an IIR filter in the signal path, to filter out pressure glitches due to sudden pressurechanges caused by events such as slamming door, or wind blowing on the sensor. The IIR filter is a 1st order filter
with programmable cut-off frequency.
For details on how to program and use the IIR filter, refer to the application note “AN-000238: ICP-20100 and ICP20132 User Configurable Operation Mode and IIR Filter.”

6.5

BOOT SEQUENCE

Before starting any measurement, the device needs to be configured. This section lists the different steps to betaken before being able to conduct a measurement.
The following terminology is used in this code for register map references:
regMap.Register_Name.Register_Field_Name = Value
where-“Register_Name” is the register name-“Register_Field_Name” is the name of the register field in the register-“Value” is the value being written to the specified register field
1) Power-on the ASIC
2) Initialize the I2C interface by toggling the clock line a few times. The easiest way to do that is byinserting a dummy I2C write transaction. You can for example execute the first transaction (write tolock register) twice.
3) Check the value from register regMap.version:•

If 0x00 (version A), continue to step 4.

•

If 0xB2 (version B), no further initialization is required.

4) Check the value from register regMap. OTP_STATUS2. BOOT_UP_STATUS

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ICP-20100•

If 1, ICP-20100 didn’t go through power cycle after previous boot up sequence. No further
initialization is required.

•If 0, boot up config is not done after ICP-20100 power on. Continue to step 55) Bring the ASIC in power mode to activate the OTP power domain and get access to the main registers•

regMap.MODE_SELECT.POWER_MODE = 1•

Wait 4ms;

6) Unlock the main registers•

regMap.MASTER_LOCK.LOCK = 0x1f

7) Enable the OTP and the write switch•

regMap.OTP_CONFIG1.OTP_ENABLE = 1;•

regMap.OTP_CONFIG1.OTP_WRITE_SWITCH = 1;•

wait 10μs;8) Toggle the OTP reset pin•

regMap.OTP_DBG2.RESET = 1•

wait 10us•

regMap.OTP_DBG2.RESET = 0•

wait 10us

9) Program redundant read•

regMap.OTP_MRA_LSB = 0x04•

regMap.OTP_MRA_MSB = 0x04•

regMap.OTP_MRB_LSB = 0x21•

regMap.OTP_MRB_MSB = 0x20•

regMap.OTP_MR_LSB = 0x10•

regMap.OTP_MR_MSB = 0x80

10) Write the address content and read command•

regMap.OTP_ADDRESS.ADDRESS = 8’hF8•regMap.OTP_COMMAND.ADDRESS = 4’h0•

regMap.OTP_COMMAND.COMMAND = 1// for offset// read action11) Wait for the OTP read to finish•

Monitor regMap.OTP_STATUS.BUSY to be 012) Read the data from register•

Offset = regMap.OTP_RDATA.VALUE

13) Write the next address content and read command•

regMap.OTP_ADDRESS.ADDRESS = 8’hF9•regMap.OTP_COMMAND.ADDRESS = 4’h0Document Number: DS-000416
Revision: 1.4

Page 32 of 60// for gainICP-20100•

regMap.OTP_COMMAND.COMMAND = 1// read action

14) Wait for the OTP read to finish•

Monitor regMap.OTP_STATUS.BUSY to be 015) Read the data from register•

Gain = regMap.OTP_RDATA.VALUE

16) Write the next address content and read command•

regMap.OTP_ADDRESS.ADDRESS = 8’hFA•

regMap.OTP_COMMAND.ADDRESS = 4’h0•

regMap.OTP_COMMAND.COMMAND = 1// for HFosc// read action17) Wait for the OTP read to finish•

Monitor regMap.OTP_STATUS.BUSY to be 018) Read the data from register•

HFosc = regMap.OTP_RDATA.VALUE

19) Disable OTP and write switch•

regMap.OTP_CONFIG1.OTP_ENABLE = 0;•

regMap.OTP_CONFIG1.OTP_WRITE_SWITCH = 0;•

wait 10μs;20) Write the Offset to the main registers•

regMap.TRIM1_MSB.PEFE_OFFSET_TRIM = Offset[5:0]21) Write the Gain to the main registers without touching the parameter BG_PTAT_TRIM•

Rdata = regMap.TRIM2_MSB•

Rdata[6:4] = Gain[2:0]•

regMap.TRIM2_MSB = Rdata

22) Write the HFosc trim value to the main registers•

regMap.TRIM2_LSB = HFosc

23) Lock the main registers•

regMap.MASTER_LOCK.LOCK = 0x00

24) Move to standby•

regMap.MODE_SELECT.POWER_MODE = 0

25) Write bootup config status to 1 to avoid re initialization with out power cycle.
regMap. OTP_STATUS2. BOOT_UP_STATUS = 1

Note: The bootup sequence should be run only once for every powerup. Running the boot sequence multiple times
could create issues.

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ICP-20100
6.6

MODE SWITCHING/SELECTION

Mode switching/selection is done by•

Making sure the previous mode is selected by reading the register field MODE_SYNC_STATUS of register
DEVICE_STATUS until it is set to ‘1’.

•

Starting the new mode by selecting it in the register field MEAS_CONFIG of register MODE_SELECT.

6.7

PRESSURE/TEMPERATURE READ-OUT

Pressure and temperature are read out by•

Waiting until the FIFO contains data (either by polling the FIFO_LEVEL register field in register FIFO_FILL or
though configuration of the FIFO watermark high interrupt).

•

Read out registers PRESS_DATA_0, PRESS_DATA_1, PRESS_DATA_2, TEMP_DATA_0 , TEMP_DATA_1, andTEMP_DATA_2 using the address increment burst feature of the SPI, I 2C or I3CSM interface. The FIFO readpointer will automatically increment on reading the last register TEMP_DATA_2. The read address willautomatically wrap to address PRESS_DATA_0 (in case of Pressure first mode refer to section 7). Thismeans that multiple FIFO locations can be read out by continuously using the interface address increment
function until the FIFO is empty.

6.7.1 Pressure conversion formula
The 20-bit output pressure value represents a two’s complement integer from -219 till 219-1
To convert this value into pressure, use the formulaP = (POUT/217)*40kPa + 70kPa- P: pressure in kPa- POUT: two’s complement representation of the pressure output code

Figure 16. Pressure Output CodeDocument Number: DS-000416
Revision: 1.4

Page 34 of 60

ICP-20100
6.7.2 Temperature conversion formula
The 20-bit output temperature value represents a two’s complement integer from -219 till 219-1
To convert this value into temperature, use the formulaT = (TOUT/218)*65C + 25C- T: temperature in degrees Celsius- TOUT: two’s complement representation of the temperature output code

Figure 17. Temperature Output CodeDocument Number: DS-000416
Revision: 1.4

Page 35 of 60

ICP-20100
7

FIFO

A 96-bytes FIFO allows to buffer up to 16 pressure and temperature measurement pairs before reading them out
through I2C, I3CSM or SPI.
Four modes are supported when reading out the FIFO with address increment:•

Pressure first: The address wraps to the start address of the Pressure value•

Temperature only: The address wraps to the start address of the Temperature value•

Temperature first: Temperature and pressure locations are switched, the address wraps to the start
address of the Temperature value•

Pressure only: Temperature and pressure locations are switched, the address wraps to the start addressof the Pressure value

Figure 18. FIFO Read Out Modes

7.1

FIFO ACCESSIBILITY

The Measurement FIFO registers are accessible from the I2C/I3CSM/SPI interface in all operating modes, includingStandby mode.
The Measurement FIFO registers need to be read out in burst mode for I2C/I3CSM. The data that is read out is notguaranteed to be consistent if every byte is addressed separately.

Document Number: DS-000416
Revision: 1.4

Page 36 of 60

ICP-20100
7.2

FIFO FULL/EMPTY

A FIFO full flag is raised when the FIFO level reaches the FIFO size.
Data is not written to the FIFO if it is full. The FIFO full flag is reset when the FIFO level drops below the FIFO size by
fetching a FIFO word through from the I2C/I3CSM/SPI interface.
A FIFO empty flag is raised when the FIFO level reaches 0.
A read transaction from the FIFO returns 0x00 values if it is empty. The FIFO empty flag is reset when the FIFO level
increases above 0.

7.3

FIFO OVERFLOW/UNDERFLOW

A FIFO overflow flag is raised when a new pressure/temperature pair is written to the FIFO while it is full. The
written pressure/temperature pair is ignored. The FIFO overflow flag is latched and can be reset by setting it
through the I2C/I3CSM/SPI interface.
A FIFO underflow flag is raised when a pressure/temperature pair is fetched from the FIFO while it is empty. The
data read from the FIFO contains 0x00 values. The FIFO underflow flag is latched and can be reset by setting it
through the I2C/I3CSM/SPI interface.

7.4

FIFO WATERMARK LOW/HIGH

Two FIFO watermark register fields, FIFO_WMK_LOW and FIFO_WMK_HIGH, can be used to manage the data flowfrom the sensor to the host.
The watermark high flag is set when the FIFO level reaches the high value watermark specified by
FIFO_WMK_HIGH.
The watermark low flag is set when the FIFO level reaches the low value watermark specified by FIFO_WMK_LOW.
The FIFO watermark flags are latched and can be reset by setting them through the I2C/I3CSM/SPI interface.

7.5

FIFO FLUSH

A FIFO flush command allows the user to flush the FIFO. The register field FLUSH should be set to 1 to flush the
FIFO.

7.6

ABSOLUTE PRESSURE VALUE OVERRUN/UNDERRUNAn absolute pressure value overrun flag is raised when the pressure value crosses a configurable 16-bit pressure
overrun/underrun value. This value is configurable in the user register map using registers PRESS_ABS_LSB and
PRESS_ABS_MSB.

7.7

DELTA PRESSURE VALUE OVERRUN

A delta pressure value overrun flag is raised when the absolute difference between 2 consecutive pressure values
exceeds a configurable 16-bit delta pressure overrun value. This value is configurable in the user register map,using registers PRESS_DELTA_LSB and PRESS_DELTA_MSB.

Document Number: DS-000416
Revision: 1.4

Page 37 of 60

ICP-20100
8

INTERRUPTS

The interrupt pin is open-drain. It is pulled high by default by an internal pull-up resistor. On an interrupt event, it
is driven low until the interrupt source has been cleared through the I 2C/I3CSM/SPI interface.
The interrupt can be configured to be connected to any of the following interrupt sources:•

FIFO overflow•

FIFO underflow•

FIFO watermark low•

FIFO watermark high•Absolute pressure threshold overrun•

Absolute pressure threshold underrun•

Delta pressure threshold overrun

Each interrupt source can be individually masked.

Document Number: DS-000416
Revision: 1.4

Page 38 of 60

ICP-20100
9

ASSEMBLY

This section provides general guidelines for assembling TDK Micro Electro-Mechanical Systems (MEMS) pressure
sensors.

9.1

IMPLEMENTATION AND USAGE RECOMMENDATIONS

9.1.1 Soldering
When soldering, use the standard soldering profile IPC/JEDEC J-STD-020 with peak temperatures of 260°C.
ICP-20100 may exhibit a pressure offset after soldering, some settling time may be required depending on
soldering properties, PCB properties, and ambient conditions.
ICP-20100 devices have MSL rating 1, appropriate JEDEC J-STD-020 guidelines should be followed to avoid
damaging the part.

9.1.2 Chemical Exposure and Sensor Protection
The ICP-20100 is an open cavity package and should not be exposed to particulates or liquids. If any type ofprotective coating must be applied to the circuit board, the sensor must be protected during the coating process.

Document Number: DS-000416
Revision: 1.4

Page 39 of 60

ICP-20100
10

PACKAGE DIMENSIONS

Package dimensions for the ICP-20100:

Top View: ICP-20100

Bottom View: ICP-20100

Figure 19. ICP-20100 Package Diagrams

Document Number: DS-000416
Revision: 1.4

Page 40 of 60

ICP-20100
SYMBOLS
A
A3
b
c
D
D1
E
E1
e
L
L1
L3

MIN.
0.750
0.655
0.200
0.100
1.950
1.820
1.950
1.820
0.450
0.275
0.025
0.250

DIMENSIONS IN MILLIMETERS
NOM.
0.800
0.675
0.250
0.125
2.000
1.850
2.000
1.850
0.500
0.375
0.075
0.300

Table 19. ICP-20100 Package Dimensions

Document Number: DS-000416
Revision: 1.4

Page 41 of 60

MAX.
0.850
0.695
0.300
0.150
2.050
1.880
2.050
1.880
0.550
0.425
0.100
0.325

ICP-20100
11

PART NUMBER PART MARKINGS

The part number part markings for ICP-20100 devices are summarized below:

PART NUMBER
ICP-20100

PART MARKING
S1
Table 20. Part Number Part Markings
TOP VIEWS1

Lot Traceability Code
Date Code: (Y)Year(W)WorkWeek

XXXX
YW

Part Number
1-Hole (ICP-20100)

Figure 20. Part Number Part Markings for ICP-20100

Document Number: DS-000416
Revision: 1.4

Page 42 of 60

ICP-20100
12

REGISTER MAP

This section lists the register map for ICP-20100.
Addr
(Hex)

Addr
(Dec.)

Register Name

SerialI/F

55

TRIM1_MSB

R/W

6

6

TRIM2_LSB

R/W

7

7

TRIM2_MSB

R/W

C

12

DEVICE_ID

RO

Bit7

Bit6

Bit5

Bit4

Bit3

-

-

PEFE_GAIN_TRIM

BG_PTAT_TRIM
VALUE

13

IO_DRIVE_STRENGTH

R/W

172

OTP_CONFIG1

R/W

AD

173

OTP_MR_LSB

R/W

VALUE_LSB

AE

174

OTP_MR_MSB

R/W

VALUE_MSB

AF

175

OTP_MRA_LSB

R/W

VALUE_LSB

B0

176

OTP_MRA_MSB

R/W

VALUE_MSB

B1

177

OTP_MRB_LSB

R/W

VALUE_LSB

B2

178

OTP_MRB_MSB

R/W

VALUE_MSB

B5

181

OTP_ADDRESS_REG

R/W

B6

182

OTP_COMMAND_REG

R/W

B8

184

OTP_RDATA

R

-

IO_DS
-

OTP_ENCOMMAND

OTP_ADDRESS_MSB
VALUE

B9

185

OTP_STATUS

R

188

OTP_DBG2

R/W

BE

190

MASTER_LOCK

W

BF

191

OTP_STATUS2

R/W

C0

192

MODE_SELECT

R/W

C1

193

INTERRUPT_STATUS

R/W-

PRESS_D
ELTA_INT

C2194

INTERRUPT_MASK

R/W-

PRESS_D
ELTA_MA
SK

C3

195

FIFO_CONFIG

R/W

C4

196

FIFO_FILL

R/W

FIFO_FLUSH

FIFO_EMP
TY

C5

197

SPI_MODE

R/W

C7

199

PRESS_ABS_LSB

R/W

PRESS_ABS_LSB

C8

200

PRESS_ABS_MSB

R/W

PRESS_ABS_MSB

-

BUSY

RESET

LOCK
BOOT_UP_STATUSFORCED_
MEAS_TRI
GGER

MEAS_MODE

POWER_M
ODE

FIFO_READOUT_MODE

PRESS_A
BS_INT-

FIFO_WM
K_LOW_IN
T

FIFO_WM
K_HIGH_I
NT

FIFO_UND
ERFLOW_I
NT

FIFO_OVERFLOW_INT

PRESS_A
BS_MASK-

FIFO_WM
K_LOW_M
ASK

FIFO_WM
K_HIGH_M
ASK

FIFO_UND
ERFLOW_
MASKFIFO_OVERFLOW_MASK

MEAS_CONFIG

FIFO_WM_HIGH

FIFO_WM_LOW

FIFO_FULL

FIFO_LEVELSPI_MOD
E

-

C9

201

PRESS_DELTA_LSB

R/W

PRESS_DELTA_LSB

CA

202

PRESS_DELTA_MSB

R/W

PRESS_DELTA_MSB

CD

205

DEVICE_STATUS

R

CE

206

I3C_INFO

R

D3

211

VERSION

R

FA

250

PRESS_DATA_0

R

PRESS_DATA_1

R

252

PRESS_DATA_2

R

FD

253

TEMP_DATA_0

R

FE

254

TEMP_DATA_1

R

FF

255

TEMP_DATA_2

R

MODE_SYNC_ST
ATUS

I3C_INFO
MAJOR

MINOR
PRESS_DATA_0
PRESS_DATA_1-

PRESS_DATA_2
TEMP_DATA_0
TEMP_DATA_1-

Table 21. Register Map

Document Number: DS-000416
Revision: 1.4

OTP_WROTP_ADDRESS_LSB
-

BC

251

Bit0

PEFE_OFFSET_TRIM

D

FB

Bit1

HF_OSC_TRIM

AC

FC

Bit2

Page 43 of 60

TEMP_DATA_2

ICP-20100
13

REGISTER MAP DESCRIPTIONThis section describes the function and contents of each register.

13.1 TRIM1_MSB
Name: TRIM1_MSB
Address: 5 (0x05)
Serial IF: R/W
Reset value: Device dependent
BIT NAME
7:6 5:0 PEFE_OFFSET_TRIM

FUNCTION
Reserved
Trim value for the pressure front-end

13.2 TRIM2_LSB
Name: TRIM2_LSB
Address: 6 (0x06)
Serial IF: R/W
Reset value: Device dependent
BIT NAME
7
6:0 HFOSC_TRIM

FUNCTION
Reserved
Trim value for the high frequency oscillator

13.3 TRIM2_MSB
Name: TRIM1_MSB
Address: 7 (0x07)
Serial IF: R/W
Reset value: Device dependent
BIT NAME
7
6:4 PEFE_GAIN_TRIM
3:0 BG_PTAT_TRIM

FUNCTION
Reserved
Trim value for the pressure front-end
Trim value for PTAT current

13.4 DEVICE_ID
Name: DEVICE_ID
Address: 12 (0x0C)
Serial IF: RO
Reset value: 0x63
BIT NAME
7:0 VALUE

Document Number: DS-000416
Revision: 1.4

FUNCTION
8-bit Device ID

Page 44 of 60

ICP-20100
13.5 IO_DRIVE_STRENGTH
Name: IO_DRIVE_STRENGTH
Address: 13 (0x0D)
Serial IF: R/W
Reset value: 0x03
BIT NAME
7:3 -

2:0

IO_DS

FUNCTION
Reserved
IO drive strength value
000: 2 mA for 1.8V IO supply
001: 4 mA for 1.8V IO supply
010: 8 mA for 1.8V IO supply
011: 12 mA for 1.8V IO supply
100: 2 mA for 1.2V IO supply
101: 4 mA for 1.2V IO supply
110: 6 mA for 1.2V IO supply
111: 8 mA for 1.2V IO supply

13.6 OTP_CONFIG1
Name: OTP_CONFIG1
Address: 172 (0xAC)
Serial IF: R/W
Reset value: 0x00
BIT NAME
7:2 RESERVED
1

OTP_WRITE_SWITCH

0

OTP_ENABLE

FUNCTION
Connect OTP VCC to VCORE. This is needed for OTP write. VCORE should be
3V3 in this case
Enable the OTP

13.7 OTP_MR_LSB
Name: OTP_MR_LSB
Address: 173 (0xAD)
Serial IF: R/W
Reset value: 0x00
BIT NAME
7:0 VALUE_LSB

FUNCTION
OTP MR register bits 7:0

13.8 OTP_MR_MSB
Name: OTP_MR_MSB
Address: 174 (0xAE)
Serial IF: R/W
Reset value: 0x00
BIT NAME
7:0 VALUE_MSB

Document Number: DS-000416
Revision: 1.4

FUNCTION
OTP MR register bits 15:8

Page 45 of 60

ICP-20100
13.9 OTP_MRA_LSB
Name: OTP_MRA_LSB
Address: 175 (0xAF)
Serial IF: R/W
Reset value: 0x00
BIT NAME
7:0 VALUE_LSB

FUNCTION
OTP MRA register bits 7:0

13.10 OTP_MRA_MSB
Name: OTP_MRA_MSB
Address: 176 (0xB0)
Serial IF: R/W
Reset value: 0x00
BIT NAME
7:0 VALUE_MSB

FUNCTION
OTP MRA register bits 15:8

13.11 OTP_MRB_LSB
Name: OTP_MRB_LSB
Address: 177 (0xB1)
Serial IF: R/W
Reset value: 0x00
BIT NAME
7:0 VALUE_LSB

FUNCTION
OTP MRB register bits 7:0

13.12 OTP_MRB_MSB
Name: OTP_MRB_MSB
Address: 178 (0xB2)
Serial IF: R/W
Reset value: 0x00
BIT NAME
7:0 VALUE_MSB

FUNCTION
OTP MRB register bits 15:8

13.13 OTP_ADDRESSName: OTP_ADDRESS
Address: 181 (0xB5)
Serial IF: R/W
Reset value: 0x00
BIT NAME
7:0 ADDRESSDocument Number: DS-000416
Revision: 1.4

FUNCTION
OTP address [7:0] to read from or to write toPage 46 of 60

ICP-20100
13.14 OTP_COMMAND
Name: OTP_COMMAND
Address: 182 (0xB6)
Serial IF: R/W
Reset value: 0x00
BIT NAME
7RESERVED
6:4 COMMAND
3:0 ADDRESSFUNCTION
OTP access command
OTP address [11:8] to read from or to write to

13.15 OTP_RDATA
Name: OTP_RDATA
Address: 184 (0xB8)
Serial IF: R
Reset value: 0x00
BIT NAME
7:0 VALUEFUNCTION
OTP read data word

13.16 OTP_STATUS
Name: OTP_STATUS
Address: 185 (0xB9)
Serial IF: R
Reset value: 0x00
BIT NAME
7:1 RESERVED
0
BUSY

FUNCTIONOTP controller BUSY flag

13.17 OTP_DBG2
Name: OTP_DBG2
Address: 188 (0xBC)
Serial IF: R/W
Reset value: 0x00
BIT NAME
7RESET
6:0 RESERVEDFUNCTION
Value of the OTP port RESET-

13.18 OTP_STATUS2
Name: OTP_STATUS2
Address: 191 (0xBF)
Serial IF: R/W
Reset value: 0xF0
BIT NAME
7:1 RESERVED

Document Number: DS-000416
Revision: 1.4

FUNCTION-

Page 47 of 60

ICP-20100
0

BOOT_UP_STATUS

Boot up config status.
Host can set this bit to 1 when boot up config is done and read later to know
if ICP-20100 is power cycled and needs boot up config.

13.19 MASTER_LOCK
Name: MASTER_LOCK
Address: 190 (0xBE)
Serial IF: W
Reset value: 0x00
BIT NAME
7:0

LOCK

FUNCTION
Write 8'h1F to unlock write access to all main registers
Write any other value to lock write access to all main registers
The OTP mirror registers are not locked by this register13.20 MODE_SELECT
Name: MODE_SELECT
Address: 192 (0xC0)
Serial IF: R/W
Reset value: 0x00
BIT NAME

7:5

MEAS_CONFIG

4

FORCED_MEAS_TRIGGER

3

MEAS_MODE

2

POWER_MODE

1:0

FIFO_READOUT_MODE

Document Number: DS-000416
Revision: 1.4

FUNCTION
Measurement Configuration (the modes listed below are described in
section 2.2)000: Mode0001: Mode1010: Mode2011: Mode3
100: Mode4
101 to 111: Reserved
Initiate Triggered Operation (also called Forced Measurement Mode)
0: Stay in Standby mode
1: Trigger for forced measurement (only supported for Mode4)
Measurement Mode Selection
0: Standby or trigger forced measurement based on the field
FORCED_MEAS_TRIGGER
1: Continuous Measurements (duty cycled): Measurements are started
based on the selected mode ODR_REG
Power Mode Selection
0: Normal Mode: Device is in standby and goes to active mode during theexecution of a measurement
1: Active Mode: Power on DVDD and enable the high frequency clock
FIFO Readout Mode Selection (refer to the FIFO section for further
information)
00: Pressure first.
When you start reading from address 0xFA with address increment, you will
read out press(n), temp(n), press(n+1), temp(n+1), …
01: Temperature only.
When you start reading from address 0xFD with address increment, you will
read out temp(n), temp(n+1), …

Page 48 of 60

ICP-20100
10: Temperature first.
When you start reading from address 0xFA with address increment, you will
read out temp(n), press(n), temp(n+1), press(n+1), …
11: Pressure only.
When you start reading from address 0xFD with address increment, you will
read out press(n), press(n+1), …
Notes:- Make sure DEVICE_STATUS.MODE_SYNC_STATUS bit is set before writing this register.

13.21 INTERRUPT_STATUS
Name: INTERRUPT_STATUS
Address: 193 (0xC1)
Serial IF: R/W
Reset value: 0x00
BIT NAME
7-

6

PRESS_DELTA_INT

5PRESS_ABS_INT

4

-

3

FIFO_WMK_LOW_INT

2

FIFO_WMK_HIGH_INTDocument Number: DS-000416
Revision: 1.4

FUNCTION
Reserved
Delta pressure overrun
Read
0: The difference between 2 consecutive pressure measurements after
filtering didn't exceed the programmed delta pressure overrun value. Theinterrupt has not triggered
1: The difference between 2 consecutive pressure measurements after
filtering exceeded the programmed delta pressure overrun value. Theinterrupt has triggered
Write policy is W1C
0: the press_delta_int interrupt status bit is unchanged
1: the press_delta_int interrupt status bit is cleared
Pressure underrun/overrun
Read
0: The pressure value didn't cross the programmed pressure
underrun/overrun value. The interrupt has not triggered
1: The pressure value crossed the programmed pressure underrun/overrun
value. The interrupt has triggered
Write policy is W1C
0: the press_abs interrupt status bit is unchanged
1: the press_abs interrupt status bit is cleared
Reserved
FIFO watermark low
Read
0: The FIFO fill level didn't reach in downward direction the programmed
watermark low value. The interrupt has not triggered
1: The FIFO fill level reached in downward direction the programmed
watermark low value. The interrupt has triggered
Write policy is W1C
0: the fifo_wmk_low interrupt status bit is unchanged
1: the fifo_wmk_low interrupt status bit is cleared
FIFO watermark highRead
0: The FIFO fill level didn't reach in upward direction the programmed
watermark high value. The interrupt has not triggered
1: The FIFO fill level reached in upward direction the programmed
watermark high value. The interrupt has triggered
Page 49 of 60

ICP-20100

1

FIFO_UNDERFLOW_INT

0

FIFO_OVERFLOW_INT

Write policy is W1C
0: the fifo_wmk_high interrupt status bit is unchanged
1: the fifo_wmk_high interrupt status bit is cleared
FIFO underflow
Read
0: No new pressure/temperature pair was fetched from the FIFO while it was
empty. The interrupt has not triggered
1: A new pressure/temperature pair was fetched from the FIFO while it was
empty. The interrupt has triggered
Write policy is W1C
0: the fifo_underflow interrupt status bit is unchanged
1: the fifo_underflow interrupt status bit is cleared
FIFO overflow
Read
0: No new pressure/temperature pair was written to the FIFO while it was
full. The interrupt has not triggered
1: A new pressure/temperature pair was written to the FIFO while it was full.
The interrupt has triggered
Write policy is W1C
0: the fifo_overflow interrupt status bit is unchanged
1: the fifo_overflow interrupt status bit is cleared

13.22 INTERRUPT_MASK
Name: INTERRUPT_MASK
Address: 194 (0xC2)
Serial IF: R/W
Reset value: 0x00
BIT NAME
7
6

PRESS_DELTA_MASK

5

PRESS_ABS_MASK

4

-

3

FIFO_WMK_LOW_MASK2

FIFO_WMK_HIGH_MASK

1

FIFO_UNDERFLOW_MASK0

FIFO_OVERFLOW_MASKFUNCTION
Reserved (program to 1)
0: PRESS_DELTA interrupt is not masked
1: PRESS_DELTA interrupt is masked
0: PRESS_ABS interrupt is not masked
1: PRESS_ABS interrupt is masked
Reserved
0: FIFO_WMK_LOW interrupt is not masked
1: FIFO_WMK_LOW interrupt is masked
0: FIFO_WMK_HIGH interrupt is not masked
1: FIFO_WMK_HIGH interrupt is masked
0: FIFO_UNDERFLOW interrupt is not masked
1: FIFO_UNDERFLOW interrupt is masked
0: FIFO_OVERFLOW interrupt is not masked
1: FIFO_OVERFLOW interrupt is masked

13.23 FIFO_CONFIG
Name: FIFO_CONFIG
Address: 195 (0xC3)
Serial IF: R/W
Reset value: 0x00

Document Number: DS-000416
Revision: 1.4

Page 50 of 60

ICP-20100
BIT

NAME

7:4

FIFO_WM_HIGH

3:0

FIFO_WM_LOW

FUNCTIONFIFO high watermark value. Interrupt is triggered when the FIFO fill level
reaches this value in the upward direction. A value of 0 disables the highwatermark check.
FIFO low watermark value. Interrupt is triggered when the FIFO fill level
reaches this value in the downward direction.

13.24 FIFO_FILL
Name: FIFO_FILL
Address: 196 (0xC4)
Serial IF: R/W
Reset value: 0x40
BIT NAME
7

FIFO_FLUSH

6

FIFO_EMPTY

5

FIFO_FULL

4:0

FIFO_LEVELFUNCTIONFIFO flush command. (This field should not be modified while doing ameasurement)
0: No change
1: FIFO is flushed. Flushing the FIFO will empty it.
FIFO empty indication.
0: The FIFO level is above 0
1: The FIFO level is at 0
FIFO full indication.
0: The FIFO level is below the FIFO size
1: The FIFO level has reached the FIFO size
FIFO fill level
00000: Empty
00001: 1/16 full
00010: 2/16 full
00011: 3/16 full
00100: 4/16 full
00101: 5/16 full00110: 6/16 full
00111: 7/16 full
01000: 8/16 full
01001: 9/16 full
01010: 10/16 full
01011: 11/16 full
01100: 12/16 full
01101: 13/16 full
01110: 14/16 full
01111: 15/16 full
10000: Full
10001 to 11111: Reserved

13.25 SPI_MODE
Name: SPI_MODE
Address: 197 (0xC5)
Serial IF: R/W
Reset value: 0x00

Document Number: DS-000416
Revision: 1.4

Page 51 of 60

ICP-20100
BIT
7:1

NAME
-

0

SPI_MODEFUNCTION
Reserved
0: SPI 4-wire mode enabled
1: SPI 3-wire mode enabled

13.26 PRESS_ABS_LSB
Name: PRESS_ABS_LSB
Address: 199 (0xC7)
Serial IF: R/W
Reset value: 0x00
BIT NAME

7:0

PRESS_ABS_LSB

FUNCTION
LSB part of the 16bit pressure overrun/underrun value.
The 16bit value represents pressure values according to the formula
PABS = (P(kPa)-70kPa)/40kPa*213
For example, 80 kPa threshold results in value 0x0800, 50 kPa results invalue 0xF000
This register should not be modified while doing a measurement.

13.27 PRESS_ABS_MSB
Name: PRESS_ABS_MSB
Address: 200 (0xC8)
Serial IF: R/W
Reset value: 0x00
BIT NAME

7:0

PRESS_ABS_MSB

FUNCTION
MSB part of the 16bit pressure overrun/underrun value.
The 16bit value represents pressure values according to the formula
PABS = (P(kPa)-70kPa)/40kPa*213
For example, 80kPa threshold results in value 0x0800, 50 kPa results in value
0xF000This register should not be modified while doing a measurement.

13.28 PRESS_DELTA_LSB
Name: PRESS_DELTA_LSB
Address: 201 (0xC9)
Serial IF: R/W
Reset value: 0x00
BIT NAME

7:0

PRESS_DELTA_LSB

Document Number: DS-000416
Revision: 1.4

FUNCTION
LSB part of the 16bit delta pressure overrun/underrun value.
The 16bit value represents pressure values according to the formula
PDELTA = (P(kPa)/80)* 214
For example, a delta pressure of 0.5 kPa is represented by the value 0x0066
This register should not be modified while doing a measurement.

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ICP-20100
13.29 PRESS_DELTA_MSB
Name: PRESS_DELTA_MSB
Address: 202 (0xCA)
Serial IF: R/W
Reset value: 0x00
BIT NAME

7:0

PRESS_DELTA_MSB

FUNCTION
MSB part of the 16bit delta pressure overrun/underrun value.
The 16bit value represents pressure values according to the formula
PDELTA = (P(kPa)/80)* 214
For example, a delta pressure of 0.5 kPa is represented by the value 0x0066
This register should not be modified while doing a measurement.

13.30 DEVICE_STATUS
Name: DEVICE_STATUS
Address: 205 (0xCD)
Serial IF: R
Reset value: 0x00
BIT NAME
7:6 0

MODE_SYNC_STATUS

FUNCTION
Reserved
0: Synchronization of the selected mode to the internal clock domain is
ongoing. MODE_SELECT register is not accessible by the user.
1: Synchronization of the selected mode to the internal clock domain isfinished. MODE_SELECT register is accessible by the user.

13.31 I3C_INFO
Name: I3C_INFO
Address: 206 (0xCE)
Serial IF: R
Reset value: 0x00
BIT NAME
7:0 I3C_INFO

FUNCTION
This register contains the I3CSM dynamic slave address

13.32 VERSION
Name: VERSION
Address: 211 (0xD3)
Serial IF: R
Reset value: 0x00 (version A); 0xB2 (version B)
BIT
NAME
FUNCTION
7:4
MAJOR
Major version number
3:0
MINOR
Minor version number

Document Number: DS-000416
Revision: 1.4

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ICP-20100
13.33 PRESS_DATA_0
Name: PRESS_DATA_0
Address: 250 (0xFA)
Serial IF: R
Reset value: 0x00
BIT NAME
7:0 PRESS_DATA_0

FUNCTION
Pressure data bits [7:0]

13.34 PRESS_DATA_1
Name: PRESS_DATA_1
Address: 251 (0xFB)
Serial IF: R
Reset value: 0x00
BIT NAME
7:0 PRESS_DATA_1

FUNCTION
Pressure data bits [15:8]

13.35 PRESS_DATA_2
Name: PRESS_DATA_2
Address: 252 (0xFC)
Serial IF: R
Reset value: 0x00
BIT NAME
7:4 3:0 PRESS_DATA_2

FUNCTION
Reserved
Pressure data bits [19:16]

13.36 TEMP_DATA_0
Name: TEMP_DATA_0
Address: 253 (0xFD)
Serial IF: R
Reset value: 0x00
BIT NAME
7:0 TEMP_DATA_0

FUNCTION
Temperature data bits [7:0]

13.37 TEMP_DATA_1
Name: TEMP_DATA_1
Address: 254 (0xFE)
Serial IF: R
Reset value: 0x00
BIT NAME
7:0 TEMP_DATA_1

Document Number: DS-000416
Revision: 1.4

FUNCTION
Temperature data bits [15:8]

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ICP-20100
13.38 TEMP_DATA_2
Name: TEMP_DATA_2
Address: 255 (0xFF)
Serial IF: R
Reset value: 0x00
BIT NAME
7:4 3:0 TEMP_DATA_2

Document Number: DS-000416
Revision: 1.4

FUNCTION
Reserved
Temperature data bits [19:16]

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ICP-20100
14

TAPE & REEL SPECIFICATION

Figure 21. ICP-20100 Tape Dimensions

Figure 22. ICP-20100 Tape and Reel Drawing

Document Number: DS-000416
Revision: 1.4

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ICP-20100
15

ORDERING GUIDEPART

ICP-20100†

TEMP RANGEPACKAGE BODY

PACKAGE LID

QUANTITY

PACKAGING−40°C to +85°C

2x2x0.8mm LGA10L

1-Hole10,00013” Tapeand Reel†Denotes RoHS and Green-Compliant Package

Document Number: DS-000416
Revision: 1.4

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ICP-20100
16

REFERENCES

Please refer to “InvenSense MEMS Handling Application Note (AN-IVS-0002A-00)” and “Pressure Sensor PCB
Design Guidelines (AN-000140)” for the following information:• Manufacturing Recommendationso Assembly Guidelines and Recommendationso PCB Design Guidelines and Recommendationso MEMS Handling Instructionso ESD Considerations
o Reflow Specificationo Storage Specificationso Package Marking Specificationo Reel & Pizza Box Labelo Packaging
o Representative Shipping Carton Label• Complianceo Environmental Complianceo DRC Complianceo Compliance Declaration Disclaimer

Document Number: DS-000416
Revision: 1.4

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ICP-20100
17

REVISION HISTORYREVISION DATEREVISIONDESCRIPTION

10/12/2020

0.1

Initial Release
Updated ASIC Identification Procedure (Section 5.4); Updated Duty Cycled Operation
Description (Section 6.2.1); Updated FIFO FULL/EMPTY Description (Section 7.2);
Moved sections on FIFO OVERFLOW/UNDERFLOW, FIFO WATERMARK LOW/HIGH,
ABSOLUTE PRESSURE VALUE OVERRUN/UNDERRUN, DELTA PRESSURE VALUEOVERRUN from Section 7 to Section 8.
Updated Pressure Sensor Specifications (Table 3); Updated ASIC Identification
Procedure (Section 5.4); Updated Duty Cycled Operation Description (Section 6.2.1);
Updated Interrupts (Section 8).

03/12/2021

0.2

04/01/2021

0.3

05/03/2021

0.4

Added MSL information (Cover Page); Added Tape & Reel Specification (Section 14).

07/09/2021

1.0

Updated Pressure Sensor Specifications (Table 3); Updated References (Section 16)

09/15/2021

1.1

12/08/2021

1.2

12/17/2021

1.3

Updated Boot Sequence (Section 6.5)

08/12/2022

1.4

Updated Section 1.1; Updated AN-000238 title (Sections 2.2, 6.2.1, 6.4); Updated
Storage Temperature Range, added Overpressure spec (Table 7); Updated Part
Number Part Marking (Figure 20)

Document Number: DS-000416
Revision: 1.4

Updated Table 3 Notes and Conditions; Added OSRPRESS and OSRTEMP Calculation(Section 6.2.1); Updated FIFO_FLUSH Register Field Description (Section 13.23)
Updated Drive Strength for VDDIO = 1.2V and for VDDIO = 1.8V/3.3V (Section 3.1);
Updated HBM from 2kV to 1.5kV (Section 3.2); Added new dummy reads for I2C andI3C (Section 4.1.3 and Section 4.1.4); Updated Drive Strength Configuration (Section4.3); Updated FIR Filter section (Section 6.3); Updated drive strength (Section 13.5,3.1); Updated boot section (Section 6.5); Updated ASIC identification section (Section
5.4, 13.31); Added register OTP_STATUS2 (Section 12, 13.18); Updated IO_DS
description (Section 13.5); Added Notes (Section 13.20)

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ICP-20100

This information furnished by InvenSense or its affiliates (“TDK InvenSense”) is believed to be accurate and reliable. However, no responsibility
is assumed by TDK InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use.
Specifications are subject to change without notice. TDK InvenSense reserves the right to make changes to this product, including its circuits
and software, in order to improve its design and/or performance, without prior notice. TDK InvenSense makes no warranties, neither expressed
nor implied, regarding the information and specifications contained in this document. TDK InvenSense assumes no responsibility for any claims
or damages arising from information contained in this document, or from the use of products and services detailed therein. This includes, but is
not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication orotherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied.
Trademarks that are registered trademarks are the property of their respective companies. TDK InvenSense sensors should not be used or soldin the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life
threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear
instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment.
©2022 InvenSense. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP,
AAR, and the InvenSense logo are trademarks of InvenSense, Inc. The TDK logo is a trademark of TDK Corporation. Other company and productnames may be trademarks of the respective companies with which they are associated.

©2022 InvenSense. All rights reserved.

Document Number: DS-000416
Revision: 1.4

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