SPECIFICATION AND PERFORMANCE
Series123A-58X01

File

123A-58X01_SPEC_1

Date

2021/06/08

Scope:

This specification covers the requirements for product performance, test methods andquality assurance provisions of below
P/N
123A-58B01
123A-58E01
123A-58M01

Description
M.2 Socket, H5.8 B Key 0.5 Pitch G/F, Black, Reel
M.2 Socket, H5.8 E Key 0.5 Pitch G/F, Black, Reel
M.2 Socket, H5.8 M Key 0.5 Pitch G/F, Black, Reel

Performance and Descriptions:

The product is designed to meet the electrical, mechanical and environmental performancerequirements specification. Unless otherwise specified, all tests are performed at ambientenvironmental conditions.

RoHS:

All material in according with the RoHS environment related substances list controlled.

MATERIALSNO.

PART NAME

1Housing

2Contact3

Hold down

DESCRIPTIONLCP E6808, UL94V-0, Black
Phosphor Bronze C5210, gold flash plating on contact & solder area, 50u”
min. nickel under-plating over all
Brass C2680, 50u”min. matte tin plating under 50u” min. nickel plating

RATING
Rated Voltage
Rated Current
Operating Temperature
Storage Temperature
Durability50VAC
0.5A-40°C TO +85°C-40°C TO +85°C
60 CYCLES

ELECTRICAL
ItemContact Resistance

Insulation Resistance

Requirement
55mΩ max.(initial), Δ20mΩ
(finish)500MΩ min.

Test Condition
Subject mated contacts assembled inhousing to closed circuit current of 100mA(max) at open circuit voltage of 20mV
voltage (max.)
EIA 364-23
Measure by applying 500VDC for 2
minutes between adjacent contacts ofThe information contained herein is exclusive property of ATTEND. Do not copy and print except that Attend
accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-1 -Withstanding Voltage

unmated connector.
EIA-364-21
Apply 300VAC for 1 minute between
adjacent contacts of unmated connector.
EIA-364-20

No Breakdown

MECHANICAL

Item
Mating Force/ Unmating
Force

Requirement
2.04Kgf(20N) Max.

Durability

No evidence of physical damage
Contact resistance Δ20mΩ max.

Vibration

Appearance: no damage
Discontinuity: 1µsec Max.

Physical ShockAppearance: no damage
Discontinuity: 1µsec Max.

Test Condition
Measure the force required tomate/unmate connector, operation Speed:
25.4mm/min.
EIA-364-13
Connector shall be subjected to 60 cyclesof insertion and withdrawal.
Manual insertion/ withdrawal speed rate:
250cycles/hours
EIA-364-09
15 Minutes in each of 3 mutuallyperpendicular Direction both mating
halves， should be rigidly fixed so as not
to contribute to the relative motion of
one contact against another.
EIA-364-28 Test condition VII test
condition letter D
Acceleration: 285G
Time: 2ms (half sine wave)
Cycles: 3 drops each to normal andreversed directions of X,Y,Z axes, total 18
drops.
(EIA-364-27)

ENVIRONMENTAL

Item
Solder ability

Requirement
95% min. of solder area 10x themagnifying glass of view

Thermal ShockContact resistance Δ20mΩ max.

Temperature Life

Contact resistance Δ20mΩ max.

Humidity

Contact resistance Δ20mΩ max.

Salt SprayNo detrimental corrosion allowedin contact area and base metal

Test Condition
Soldering time : 4~5 second
Solder Temperature: 245±5˚C(EIA-364-52)
Mated Connectors-55+/-3℃ (30 min.), +85+/-2℃ (30 min.)
Perform this cycle, repeat 10 cycles(EIA-364-32 condition I)

Mated Connector 105℃, 96 hours,(EIA-364-17 test condition IV.)
Subject mated Connectors to 96 hours at40℃ with 90~95% RH.
(EIA-364-31 Method II Test Condition A.)
Subject mated connectors to 35+/-2℃ and

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.
本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-2 -exposed

Mixed flowing gas

Contact Resistance△R=20 mΩMax.(Final)

Resistance to Reflow
Soldering Heat

No physical damage shall occur.
Test Initial and final, coplanarityof product shall meetrequirements of applicableproduct drawing andspecification.

5+/-1% salt condition for 48hours. After
test, rinse the sample with water andrecondition the room temperature for 1hour. (EIA-364-26)
Mated connectors,Duration: 120 hours(EIA-364-65, class IIA)
Test connector on PCB Preheat:150~180˚C, 90±30sec.
Solder heat: 230˚C Min, 30±10sec.
Peak temp: 260˚C Max. 3~5sec.

Preheating temperature: 150 ~ 180°C, 90±30 seconds
Liquidus temperature (TL): 230°C, 30±10 seconds
Peak temperature: 260°C
Time within 5 °C of peak temperature (Tc): 255°C, 30seconds

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.
本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-3 -