100 V, 10 A, 50 mΩ
Power MOSFET Module

SHD4115

Data Sheet

DescriptionPackage

The SHD4115 includes four N-channel power
MOSFETs in its small HSON package. The internalpower MOSFETs have Zener diodes between gates andsources, thus requiring no externally clamped circuit for
an injection coil drive circuit. Supplied in a low thermal
resistance package, the product achieves highperformance in heat dissipation. In addition, its HSON
package employs a wettable flank structure, with the pintips plated and the case resin around the pins grooved.
This achieves higher reliability in mounting.

● HSON-20Features

Not to scale● High Reliability Achieved● Automotive Requirements Satisfied● AEC-Q101 Qualified● Bare Lead Frame: Pb-free (RoHS Compliant)● Wettable Flank HSON Package● Case Resin around the Pins Grooved● Built-in Zener Diodes between Gates and Sources● Specifications (Q1 to Q4)
V(BR)DSS ------------------------------- 100 V (ID = 100 μA)
ID ------------------------------------------------------- 10 A
RDS(ON) --------------- 50 mΩ max. (ID = 5 A, VGS = 10 V)

Internal Schematic Diagram
D D14 13

D D12 11

G 15

10 G

D 16

Q4

S 17

9 DQ38 S

S 18

Typical Application

D 19● Solenoid Injection System

7 S

Q1

Q2

6 D

G 20

5 G

1 2
D D

SHD41113 4
D D

D: Drain
S: Source
G: GateApplication

DC/DCControl● Injection Coil Driver Circuits
SHD4115

SHD4115-DSE Rev.1.0
SANKEN ELCTRIC CO., LTD.
Sep. 01, 2020
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 2020

1SHD4115
Absolute Maximum Ratings
Unless otherwise specified, TA = 25 °C.
Parameter
SymbolConditions

Rating

Unit

Drain-to-Source Voltage

VDS100V

Gate-to-Source Voltage

VGS±20V

Continuous Drain Current

ID

TC = 25 °C

10A

Pulsed Drain Current

IDMt ≤ 30 µs, duty cycle ≤ 1 %30

A

1.7

W

80

W

62.5mJ

10A

Power Dissipation

PD

TC = 25 °C, all power MSOFETs
operating; mounted on an FR4 board(26 mm × 36 mm × 1.66 mm)
TC = 25 °C, all power MSOFETs;
with an infinite heatsink
Single pulse, VDD = 14 V,
L = 1.0 mH, ID = 10 A,unclamped, RG = 50 Ω;
see Figure 16

Avalanche Energy

EAS

Avalanche Current

IAS

Maximum Drain-to-Source dv/dt

dv/dt1

VDD = 14 V, L = 1.08 mH,
ID = 10 A, unclamped, RG = 50 Ω;
see Figure 16

0.6

V/ns

Maximum Diode Recovery dv/dt

dv/dt2

See Figure 17

5V/ns

Maximum Diode Recovery di/dtdi/dt

See Figure 17

100A/µs

Junction Temperature

TJ150°C

Storage Temperature

TSTG− 55 to 150°C

Thermal Resistance Characteristics
Parameter
Junction-to-Case ThermalResistance

SymbolConditions

Min.

Typ.

Max.

Unit

RθJC

TC = 25 °C; with an infinite
heatsink——

6.25°C/W

SHD4115-DSE Rev.1.0
SANKEN ELCTRIC CO., LTD.
Sep. 01, 2020
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 20202

SHD4115
Electrical Characteristics
Unless otherwise specified, TA = 25 °C.
Parameter
SymbolDrain-to-Source Breakdown
V(BR)DSS
Voltage
Drain-to-Source Leakage Current
IDSS

Conditions

Min.

Typ.

Max.

Unit

ID = 100 μA, VGS = 0 V

100——VVDS = 100 V, VGS = 0 V——100µA

VGS = ±15 V——± 10µA

Gate-to-Source Leakage Current

IGSSGate Threshold Voltage

VGS(TH)VDS = 10 V, ID = 1 mA

1.5

2.0

2.5

V

Forward Transconductance
Static Drain-to-Source Onresistance
Input CapacitancegFS

VDS = 10 V, ID = 5 A

9——SRDS(ON)ID = 5 A, VGS = 10 V—

3850mΩ

—2200—

Output Capacitance

Coss—

210

—

Reverse Transfer Capacitance

Crss—

110

—

Total Gate Charge

QG—

45

—

Gate-to-Source Charge

QGS—

6—

Gate-to-Drain Charge

QGD—

10—

Turn-on Delay Timetd(ON)—30—Turn-on Rise Time

tr—

40—

Turn-off Delay Timetd(OFF)

—160—

—80

—

Turn-off Fall Time
Source-to-Drain Diode Forward
Voltage Drop
Source-to-Drain Diode Reverse
Recovery TimeCisstf

VDS = 10 V,
VGS = 0 V,
f = 1 MHzVDD = 50 V,
ID = 5 A,
VGS = 10 V,
RL = 10 Ω
VDD = 50 V,
ID = 5 A,
VGS = 10 V, RG = 20 Ω,
RL = 10 Ω;
see Figure 18pF

nC

ns

VSD

IS = 10 A, VGS = 0 V——1.2Vtrr

IS = 10 A,
di/dt = 100 A/µs;
see Figure 17—50—

ns

SHD4115-DSE Rev.1.0
SANKEN ELCTRIC CO., LTD.
Sep. 01, 2020
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 2020

3SHD4115
Derating Curves1001210Drain Current, ID (A)Power Dissipation, PD (W)With infinite heatsink

8060

40864202FR4 (26mm×36mm×1.66mm)

00255075

10012515000

Case Temperature, TC (°C)

255075100125150

Case Temperature, TC (°C)

Figure 1. PD vs. TC(All Power MOSFETs Operating)Figure 2. ID vs. TC

70

Avalanche Energy, EAS (mJ)

6050
403020100255075100125150

Junction Temperature, TJ (°C)
Figure 3. EAS vs. TJ (Single Pulse)

SHD4115-DSE Rev.1.0
SANKEN ELCTRIC CO., LTD.
Sep. 01, 2020
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 2020

4

SHD4115
Characteristic Curves
100

20100 µs

1 ms

10Drain Current, ID (A)Drain Current, ID (A)VGS = 10 V

1

VGS = 4.5 V

15

VGS = 3.5 V

10

VGS = 3.0 V

50.101

10100

1000

00.5

Drain–Source Voltage, VDS (V)

1.5

Drain–Source Voltage, VDS (V)Figure 4. Typical Characteristics: Safe Operating Area
(Single Pulse, TJ = 25 °C)

Figure 5. Typical Characteristics:
ID vs. VDS (TJ = 25 °C)

2.5Gate Threshold Voltage,VGS(TH) (V)

20Drain Current, ID (A)11510
TJ = 150 °C
TJ = 25 °C

5
TJ = −55 °C

2.0

1.5

1.0

0.5

00

12345-100-50

050

100

150

Gate–Source Voltage, VGS (V)Junction Temperature, TJ (°C)

Figure 6. Typical Characteristics:
ID vs. VGS (VDS = 10 V)

Figure 7. Typical Characteristic:
VGS(TH) vs. TJ (VDS = 10 V, ID = 1 mA)

SHD4115-DSE Rev.1.0
SANKEN ELCTRIC CO., LTD.
Sep. 01, 2020
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 20202005SHD4115

100

Drain–Source On-resistance, RDS (ON) (mΩ)

Drain–Source On-resistance, RDS (ON) (mΩ)

60504030201000510158060

40200-100

20050

100150200

Junction Temperature, TJ (°C)

Drain Current, ID (A)Figure 8. Typical Characteristic:RDS(ON) vs. ID (VGS = 10 V, TJ = 25 °C)

Figure 9. Typical Characteristic:RDS(ON) vs. TJ (VGS = 10 V, ID = 5 A)

2010000

Ciss15Capacitance (pF)

Source–Drain Diode Forward Current, IS (A)-50

10TJ = 150 °C
TJ = 25 °C

1000

Coss100

5TJ = −55 °C

Crss

10000.5

11.50

Source–Drain Diode Forward Voltage, VSD (V)Figure 10. Typical Characteristics:
IS vs. VSD (VGS = 0 V)

1020304050

Drain–Source Voltage, VDS (V)Figure 11. Typical Characteristics:
Capacitance vs. VDS (f = 1 MHz, VGS = 0 V)

SHD4115-DSE Rev.1.0
SANKEN ELCTRIC CO., LTD.
Sep. 01, 2020
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 2020

6SHD4115

10Gate–Source Voltage, VGS (V)Drain–Source Breakdown Voltage, V(BR)DSS (V)14013012011010090-10086420-50050100150200010203040Junction Temperature, TJ (°C)

Total Gate Charge, QG (nC)

Figure 12. Typical Characteristic:
V(BR)DSS vs. TJ (ID = 10 mA, VGS = 0 V)

Figure 13. Typical Characteristic:
VGS vs. QG (ID = 5 A, VDD ≈ 50 V)

501.0Drain–Source Voltage, VDS (V)

0.80.6
ID = 10 A0.4
ID = 5 A

0.20.005101520Gate–Source Voltage, VGS (V)Figure 14. Typical Characteristics:
VDS vs. VGS (VDS = 10 V)

SHD4115-DSE Rev.1.0
SANKEN ELCTRIC CO., LTD.
Sep. 01, 2020
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 2020

7

SHD4115

Junction–Case Thermal Resistance(°C/W)

1010.10.01

100 μ1m10 m

100 m

110Time (s)Figure 15.

Transient Thermal Resistance Characteristic (Single Pulse, TC = 25 °C, VDS < 10 V)

SHD4115-DSE Rev.1.0
SANKEN ELCTRIC CO., LTD.
Sep. 01, 2020
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 2020

8SHD4115

EAS =VDS

V(BR)DSS
1× L × IAS 2 ×2V(BR)DSS − VDD

V(BR)DSS
dv/dt 1L

VDD

IDtVDS

ID

RG

IAS

VDD

VGS
0Vt

(a) Test Circuit(b) Waveforms
Figure 16. Avalanche Energy and dv/dt1 Test

IS
trr

D.U.T.
LIS0

IRM × 90 %
di/dt

VDD
IRM
VDD

RG
VDS

dv/dt2

VGS0V
0(a) Test Circuit(b) Waveforms

Figure 17. Diode Reverse Recovery Time Test

RL

VGS

VDD

VGS0V10%0VDS

RG

90%VDS90%

10%0Pulse width = 10 μs
Duty cycle 1 %td(on) trtd(off) tf

tontoff(a) Test Circuit
Figure 18.

(b) Waveforms
Resistive Load Switching Time Test

SHD4115-DSE Rev.1.0
SANKEN ELCTRIC CO., LTD.
Sep. 01, 2020
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 2020

9

SHD4115Internal Schematic Diagram
D D
14 13

D D
12 11

G 15

10 G

D 16

Q4

Q3

Q1

Q2

S 17

9 D
8 S

S 18

7 S

D 19

6 D

G 20

5 G

1 2
D D

3 4
D D

Pin Configuration Definitions
141312 11151617181920
1 2Pin Number

11 1210101599168817771866195520

3 4Description

13 14

4 3Pin Number

Description

1Q1 drain

11Q3 drain

2Q1 drain

12

Q3 drain

3Q2 drain

13

Q4 drain

4Q2 drain

14

Q4 drain

5Q2 gate

15

Q4 gate6Q2 drain

16

Q4 drain

7

Q2 source

17

Q4 source

8

Q3 source

18

Q1 source

9Q3 drain

19

Q1 drain

10

Q3 gate20

Q1 gateSHD4115-DSE Rev.1.0
SANKEN ELCTRIC CO., LTD.
Sep. 01, 2020
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 2020

2 110SHD4115
Physical Dimensions● HSON-20 Package
12.6 ±0.2

9.1 ±0.2

8.5 ±0.2

11.3 ±0.2

0.5 min

1.5
1.6

3.3

A

(a)

R0.175(b)

0.5min* 0.8

8-0.4 ±0.05

0.7

* 0.4

3.3

3.6

* 0.8

1.6

0.7

3.3

* 0.4

8-R0.175

(1.1)

* 0.4

0.8

2.14

* 0.8

* 0.4
0.5 min

* 0.8

* 0.4

* 0.8

4.68

0.25

* 0.4

±0.05

8-0.653.3(0.75)(c)
Enlarged view of A (S = 10/1)

NOTES:- Dimensions in millimeters- Bare lead frame: Pb-free (RoHS compliant)- Dimensions without tolerances have a tolerance of ±0.1.
- Dimensions with the asterisks do not include any mold flash.
- (a)depicts the area where one or more mold flashes similar in thickness to that of the frame may exist.
- (b)depicts the area where a groove is formed with a target depth of 0.05.
- (c)depicts the area where a frame is crushed with a target width of 0.05.
- Moisture Sensitivity Level 3 (MSL 3)- When soldering the products, it is required to minimize the working time within the following limits:
ReflowPreheat: 150 °C to 200 °C / 60 s to 120 s
Solder heating: 255 °C / 30s, 3 times (260 °C peak)
Soldering iron: 350 °C / 3.5 s, 1 time
- The following pins are not guaranteed to be connected by soldering: 6, 9, 16, and 19.
SHD4115-DSE Rev.1.0
SANKEN ELCTRIC CO., LTD.
Sep. 01, 2020
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 202011SHD4115

6.75

4.97

3.75

2.24
2.84

00.35
0.971.57

1.57
0.97
0.35

2.84
2.24

3.75

4.97

6.75

● HSON-20 Land Pattern Example

4.90
3.75
3.83
2.57
1.43
0.35
0.1700.17
0.35
1.43

2.57
3.83
3.75
4.90

Unit：mm

Marking Diagram

SHD41 15
Y MD DX

Pin 1 indicatorPart Number
Lot Number:
Y is the last digit of the year of manufacture (0 to 9)
M is the month of the year (1 to 9, O, N, or D)
DD is the day of the month (01 to 31)
X is the control number

SHD4115-DSE Rev.1.0
SANKEN ELCTRIC CO., LTD.
Sep. 01, 2020
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 2020

12SHD4115
Important Notes● All data, illustrations, graphs, tables and any other information included in this document (the “Information”) as to Sanken’s products
listed herein (the “Sanken Products”) are current as of the date this document is issued. The Information is subject to any change
without notice due to improvement of the Sanken Products, etc. Please make sure to confirm with a Sanken sales representative thatthe contents set forth in this document reflect the latest revisions before use.
● The Sanken Products are intended for use as components of electronic equipment or apparatus (transportation equipment and its
control systems, home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Prior to use of theSanken Products, please put your signature, or affix your name and seal, on the specification documents of the Sanken Products andreturn them to Sanken. If considering use of the Sanken Products for any applications that require higher reliability (traffic signal
control systems or equipment, disaster/crime alarm systems, etc.), you must contact a Sanken sales representative to discuss thesuitability of such use and put your signature, or affix your name and seal, on the specification documents of the Sanken Productsand return them to Sanken, prior to the use of the Sanken Products. The Sanken Products are not intended for use in any applications
that require extremely high reliability such as: aerospace equipment; nuclear power control systems; and medical equipment orsystems, whose failure or malfunction may result in death or serious injury to people, i.e., medical devices in Class III or a higherclass as defined by relevant laws of Japan (collectively, the “Specific Applications”). Sanken assumes no liability or responsibility
whatsoever for any and all damages and losses that may be suffered by you, users or any third party, resulting from the use of theSanken Products in the Specific Applications or in manner not in compliance with the instructions set forth herein.
● In the event of using the Sanken Products by either (i) combining other products or materials or both therewith or (ii) physically,
chemically or otherwise processing or treating or both the same, you must duly consider all possible risks that may result from all
such uses in advance and proceed therewith at your own responsibility.
● Although Sanken is making efforts to enhance the quality and reliability of its products, it is impossible to completely avoid theoccurrence of any failure or defect or both in semiconductor products at a certain rate. You must take, at your own responsibility,
preventative measures including using a sufficient safety design and confirming safety of any equipment or systems in/for which theSanken Products are used, upon due consideration of a failure occurrence rate and derating, etc., in order not to cause any humaninjury or death, fire accident or social harm which may result from any failure or malfunction of the Sanken Products. Please referto the relevant specification documents and Sanken’s official website in relation to derating.
● No anti-radioactive ray design has been adopted for the Sanken Products.
● The circuit constant, operation examples, circuit examples, pattern layout examples, design examples, recommended examples, allinformation and evaluation results based thereon, etc., described in this document are presented for the sole purpose of reference ofuse of the Sanken Products.
● Sanken assumes no responsibility whatsoever for any and all damages and losses that may be suffered by you, users or any thirdparty, or any possible infringement of any and all property rights including intellectual property rights and any other rights of you,users or any third party, resulting from the Information.
● No information in this document can be transcribed or copied or both without Sanken’s prior written consent.
● Regarding the Information, no license, express, implied or otherwise, is granted hereby under any intellectual property rights andany other rights of Sanken.
● Unless otherwise agreed in writing between Sanken and you, Sanken makes no warranty of any kind, whether express or implied,including, without limitation, any warranty (i) as to the quality or performance of the Sanken Products (such as implied warranty ofmerchantability, and implied warranty of fitness for a particular purpose or special environment), (ii) that any Sanken Product isdelivered free of claims of third parties by way of infringement or the like, (iii) that may arise from course of performance, courseof dealing or usage of trade, and (iv) as to the Information (including its accuracy, usefulness, and reliability).
● In the event of using the Sanken Products, you must use the same after carefully examining all applicable environmental laws andregulations that regulate the inclusion or use or both of any particular controlled substances, including, but not limited to, the EU
RoHS Directive, so as to be in strict compliance with such applicable laws and regulations.
● You must not use the Sanken Products or the Information for the purpose of any military applications or use, including but notlimited to the development of weapons of mass destruction. In the event of exporting the Sanken Products or the Information, orproviding them for non-residents, you must comply with all applicable export control laws and regulations in each country including
the U.S. Export Administration Regulations (EAR) and the Foreign Exchange and Foreign Trade Act of Japan, and follow theprocedures required by such applicable laws and regulations.
● Sanken assumes no responsibility for any troubles, which may occur during the transportation of the Sanken Products including thefalling thereof, out of Sanken’s distribution network.
● Although Sanken has prepared this document with its due care to pursue the accuracy thereof, Sanken does not warrant that it iserror free and Sanken assumes no liability whatsoever for any and all damages and losses which may be suffered by you resulting
from any possible errors or omissions in connection with the Information.
● Please refer to our official website in relation to general instructions and directions for using the Sanken Products, and refer to therelevant specification documents in relation to particular precautions when using the Sanken Products.
● All rights and title in and to any specific trademark or tradename belong to Sanken and such original right holder(s).

DSGN-AEZ-16003

SHD4115-DSE Rev.1.0
SANKEN ELCTRIC CO., LTD.
Sep. 01, 2020
https://www.sanken-ele.co.jp/en© SANKEN ELECTRIC CO., LTD. 202013