MultiConnect® xDotTM
MTXDOT Developer GuideMULTICONNECT XDOT DEVELOPER GUIDE

MultiConnect xDot Developer Guide
Models: MTXDOT-NA1-xxx, MTXDOT-EU1-xxx
Part Number: S000645, Version 1.1

Copyright
This publication may not be reproduced, in whole or in part, without the specific and express prior written permission signed by an executive officer ofMulti-Tech Systems, Inc. All rights reserved. Copyright © 2017 by Multi-Tech Systems, Inc.
Multi-Tech Systems, Inc. makes no representations or warranties, whether express, implied or by estoppels, with respect to the content, information,material and recommendations herein and specifically disclaims any implied warranties of merchantability, fitness for any particular purpose and noninfringement.
Multi-Tech Systems, Inc. reserves the right to revise this publication and to make changes from time to time in the content hereof without obligation ofMulti-Tech Systems, Inc. to notify any person or organization of such revisions or changes.

Trademarks and Registered Trademarks
MultiTech, and the MultiTech logo, and MultiConnect are registered trademarks and xDot and Conduit are trademarks of Multi-Tech Systems, Inc. All otherproducts and technologies are the trademarks or registered trademarks of their respective holders.

Legal Notices
The MultiTech products are not designed, manufactured or intended for use, and should not be used, or sold or re-sold for use, in connection withapplications requiring fail-safe performance or in applications where the failure of the products would reasonably be expected to result in personal injury or
death, significant property damage, or serious physical or environmental damage. Examples of such use include life support machines or other life
preserving medical devices or systems, air traffic control or aircraft navigation or communications systems, control equipment for nuclear facilities, or
missile, nuclear, biological or chemical weapons or other military applications (“Restricted Applications”). Use of the products in such Restricted
Applications is at the user’s sole risk and liability.
MULTITECH DOES NOT WARRANT THAT THE TRANSMISSION OF DATA BY A PRODUCT OVER A CELLULAR COMMUNICATIONS NETWORK WILL BE
UNINTERRUPTED, TIMELY, SECURE OR ERROR FREE, NOR DOES MULTITECH WARRANT ANY CONNECTION OR ACCESSIBILITY TO ANY CELLULAR
COMMUNICATIONS NETWORK. MULTITECH WILL HAVE NO LIABILITY FOR ANY LOSSES, DAMAGES, OBLIGATIONS, PENALTIES, DEFICIENCIES, LIABILITIES,COSTS OR EXPENSES (INCLUDING WITHOUT LIMITATION REASONABLE ATTORNEYS FEES) RELATED TO TEMPORARY INABILITY TO ACCESS A CELLULAR
COMMUNICATIONS NETWORK USING THE PRODUCTS.
The MultiTech products and the final application of the MultiTech products should be thoroughly tested to ensure the functionality of the MultiTech
products as used in the final application. The designer, manufacturer and reseller has the sole responsibility of ensuring that any end user product into
which the MultiTech product is integrated operates as intended and meets its requirements or the requirements of its direct or indirect customers.
MultiTech has no responsibility whatsoever for the integration, configuration, testing, validation, verification, installation, upgrade, support or maintenanceof such end user product, or for any liabilities, damages, costs or expenses associated therewith, except to the extent agreed upon in a signed written
document. To the extent MultiTech provides any comments or suggested changes related to the application of its products, such comments or suggestedchanges is performed only as a courtesy and without any representation or warranty whatsoever.

Contacting MultiTech
Knowledge Base
The Knowledge Base provides immediate access to support information and resolutions for all MultiTech products. Visit http://www.multitech.com/kb.go.

Support Portal
To create an account and submit a support case directly to our technical support team, visit: https://support.multitech.com.

SupportBusiness Hours: M-F, 8am to 5pm CT
Country

By Email

By Phone

Europe, Middle East, Africa:

support@multitech.co.uk+(44) 118 959 7774

U.S., Canada, all others:

support@multitech.com(800) 972-2439 or (763) 717-5863

Warranty
To read the warranty statement for your product, visit www.multitech.com/warranty.go. For other warranty options, visit www.multitech.com/es.go.

World Headquarters
Multi-Tech Systems, Inc.
2205 Woodale Drive, Mounds View, MN 55112
Phone: (800) 328-9717 or (763) 785-3500
Fax (763) 785-9874

2

MultiConnect® xDotTM MTXDOT Developer Guide

CONTENTS

Contents
Chapter 1 Product Overview .................................................................................................................................... 6
Overview ....................................................................................................................................................................... 6
Documentation Overview ............................................................................................................................................. 6
Related Documentation .............................................................................................................................................. 6
mbed Documentation ................................................................................................................................................... 6
Programming the xDot Microcontroller ..................................................................................................................... 7
General mBed Links .................................................................................................................................................... 7
xDot Platform ............................................................................................................................................................. 7
EUI and Networking ...................................................................................................................................................... 7
Product Build Options ................................................................................................................................................... 8
Chapter 2 Getting Started ........................................................................................................................................ 9
Getting Started with the xDot Developer Kit................................................................................................................ 9
COM Port Enumeration by Operating System .............................................................................................................. 9Linux ............................................................................................................................................................................ 9
Windows ..................................................................................................................................................................... 9
Mac ........................................................................................................................................................................... 10
Chapter 3 Mechanical Drawings with Pinouts ........................................................................................................ 11
xDot ............................................................................................................................................................................. 11
Chapter 4 Specifications and Pin Information ........................................................................................................ 12
MTXDOT Specifications ............................................................................................................................................... 12
Mapping Data Rate to Spreading Factor/Bandwidth................................................................................................ 14
Battery Draw Down..................................................................................................................................................... 15
Electrical Characteristics ........................................................................................................................................... 15
Measuring the Power Draw ...................................................................................................................................... 16
xDot and Processor Pin Information .......................................................................................................................... 17
Pin Information ......................................................................................................................................................... 17
Pull-Up/Down............................................................................................................................................................ 20
xDot Pinout Design Notes ........................................................................................................................................... 21
Serial Pinout Notes.................................................................................................................................................... 21
Serial Settings.............................................................................................................................................................. 21
LoRa ............................................................................................................................................................................ 21
Throughput Rates...................................................................................................................................................... 21
Range ........................................................................................................................................................................ 21
Chapter 5 Antennas ............................................................................................................................................... 23
Antenna System ......................................................................................................................................................... 23
U.FL and Trace Antenna Options ............................................................................................................................... 23
Pulse Electronics Antenna........................................................................................................................................... 24

MultiConnect® xDotTM MTXDOT Developer Guide

3

CONTENTS

Antenna Specifications ............................................................................................................................................. 24
RSMA-to-U.FL Coaxial Cables ..................................................................................................................................... 25
Coaxial Cable Specifications ..................................................................................................................................... 25
Ethertronics Chip Antenna.......................................................................................................................................... 26
Antenna Specifications ............................................................................................................................................. 26
Stackup Information.................................................................................................................................................... 26
Developer Board Layer Stackup................................................................................................................................ 26
Stackup Table ............................................................................................................................................................ 27
Impedance ................................................................................................................................................................ 27
Chip Antenna Design Guidelines................................................................................................................................. 29
Antenna Pad Layout.................................................................................................................................................. 30
PCB Layout ................................................................................................................................................................ 30
Antenna Matching Network........................................................................................................................................ 31
915 ............................................................................................................................................................................ 31
868 ............................................................................................................................................................................ 32
OEM Integration ......................................................................................................................................................... 32
FCC & IC Information to Consumers ......................................................................................................................... 32
FCC Grant Notes........................................................................................................................................................ 32
Host Labeling............................................................................................................................................................... 33
Chapter 6 Safety Information................................................................................................................................. 34
Handling Precautions .................................................................................................................................................. 34
Radio Frequency (RF) Safety ....................................................................................................................................... 34
Sécurité relative aux appareils à radiofréquence (RF).............................................................................................. 34
Interference with Pacemakers and Other Medical Devices ...................................................................................... 35
Potential interference ............................................................................................................................................... 35
Precautions for pacemaker wearers ........................................................................................................................ 35
Device Maintenance ................................................................................................................................................... 35
User Responsibility...................................................................................................................................................... 35
Chapter 7 Regulatory Information ......................................................................................................................... 36
EMC, Safety, and R&TTE Directive Compliance ......................................................................................................... 37
47 CFR Part 15 Regulation Class B Devices ................................................................................................................. 37
FCC Interference Notice ............................................................................................................................................. 37
FCC Notice ................................................................................................................................................................... 37
Industry Canada Class B Notice................................................................................................................................... 38
Chapter 8 Environmental Notices........................................................................................................................... 39
Waste Electrical and Electronic Equipment Statement .............................................................................................. 39
WEEE Directive.......................................................................................................................................................... 39
Instructions for Disposal of WEEE by Users in the European Union ........................................................................ 39
REACH Statement ....................................................................................................................................................... 39
Registration of Substances........................................................................................................................................ 39
Substances of Very High Concern (SVHC) ................................................................................................................ 39

4

MultiConnect® xDotTM MTXDOT Developer Guide

CONTENTS

Restriction of the Use of Hazardous Substances (RoHS) ............................................................................................ 41
Information on HS/TS Substances According to Chinese Standards ......................................................................... 42
Information on HS/TS Substances According to Chinese Standards (in Chinese) ...................................................... 43
Chapter 9 Labels .................................................................................................................................................... 44
Label Examples............................................................................................................................................................ 44
Chapter 10 Developer Kit Overview ....................................................................................................................... 45
xDot Developer Kit ..................................................................................................................................................... 45
Developer Kit Package Contents............................................................................................................................... 45
Firmware Updates..................................................................................................................................................... 45
Programming Devices in Production ........................................................................................................................ 45
xDot Developer Kit Mechanical Drawings................................................................................................................... 46
Micro Developer Board LEDs ...................................................................................................................................... 47
Chapter 11 Developer Board Schematics................................................................................................................ 48
Assembly Diagrams and Schematics ........................................................................................................................... 48
Assembly Diagrams ................................................................................................................................................... 48
Schematics ................................................................................................................................................................ 50
Chapter 12 Design Considerations.......................................................................................................................... 54
Noise Suppression Design ........................................................................................................................................... 54
PC Board Layout Guideline ......................................................................................................................................... 54
Electromagnetic Interference .................................................................................................................................... 54
Electrostatic Discharge Control................................................................................................................................... 55
Chapter 13 Mounting xDots and Programming External Targets ............................................................................ 56
Mounting the Device on Your Board .......................................................................................................................... 56
Solder Profile............................................................................................................................................................... 56
Setpoints (Celsius)..................................................................................................................................................... 57
xDot Packing ............................................................................................................................................................... 57
Programming External Targets ................................................................................................................................... 57
JTAG/SWD Connector .............................................................................................................................................. 58
Index...................................................................................................................................................................... 59

MultiConnect® xDotTM MTXDOT Developer Guide

5

CHAPTER 1 PRODUCT OVERVIEW

Chapter 1 Product Overview
Overview
The MultiConnect xDot (MTXDOT) is a LoRaWANTM, low-power RF device, capable of two way communication overlong distances, deep into buildings, or within noisy environments* using the unlicensed ISM bands in North
America, Europe and worldwide. The xDot is a compact surface-mount device with an mbed enabled processor andenhanced security. The xDot features an integrated ARM® Cortex®-M3 processor and mbedTM compatible software
library for developers to control, monitor and bring edge intelligence to their Internet of Things (IoT) applications.
*

Actual distance depends on conditions, configuration, antennas, desired throughput, and usage frequency. In
dense urban environments, a typical range is 1-2 miles.

Documentation Overview
This manual is one part of xDot documentation. Refer to the Related Documentation and mbed sections for
additional information needed to program your xDot and integrate your application with the MultiConnect Conduit
gateway.
This document includes:■ xDot device information: including mechanical drawings, specifications, safety and regulatory information,and other device specific content.
■ Developer Kit information: including design considerations, schematics, and installation and operation
information.
This current version of this manual is available at www.multitech.com/support.

Related Documentation■ DOT Series AT Command Reference: Includes details on the AT commands available for xDots.
■ MultiTech Developer Site: Application notes, LoRa information, and documentation for related products
such as the MultiConnect Conduit (MTCDT) gateway and the LoRa accessory card (MTAC-LORA) are available
on the MultiTech developer site. This site includes information on using the Conduit with xDots. Go to:www.multitech.net■ Processor Datasheet: ST ARM® Cortex®-M3 processor (STM32L151CCU6) datasheet is available on the ST
website: http://www.st.com/resource/en/datasheet/stm32l151cc.pdf

mbed Documentation
ARM mbed is a free, open-source platform and operating system for embedded devices using the ARM Cortex-M
microcontrollers. The mbed website provides free software libraries, hardware designs, and online tools for rapid
prototyping of products. The platform includes a standards-based C/C++ SDK, a microcontroller HDK, andsupported development boards, an online compiler and online developer collaboration tools.
Note: To send and receive data, you need a LoRaWAN 1.0 gateway, such as MultiTech's MultiConnect Conduit(MTCDT) with an MTAC-LORA accessory card installed.

6

MultiConnect® xDotTM MTXDOT Developer Guide

CHAPTER 1 PRODUCT OVERVIEW

Programming the xDot Microcontroller
Note: To program an xDot application, you need the xDot Developer kit, which includes an xDot mounted on adeveloper board.
Use the ARM mbed ecosystem to program the microcontroller. Compile in the cloud or locally, copy the resulting
binary file to the mbed USB drive, and reset the xDot.
On the xDot mbed page, MultiTech supplies source code for non-RF portions of the xDot. To comply with FCC andETSI certification, some portions of the software is available only as binary libraries.
MultiTech offers both development and stable release versions of the library.
■ Development version: libmxDot-dev-mbed5■ Stable release version: libmxDot-mbed5
You can use either the mbed online compiler or offline tools.
■ Online: Use the mbed-os library in your mbed application■ Offline: Use mbed-cli tools to create, manage, and build your mbed 5.1 application.

General mBed Links■ Explore mbed: http://developer.mbed.org/explore■ Getting Started with mbed: http://developer.mbed.org/getting-started■ mbed Handbook: http://developer.mbed.org/handbook/Homepage■ mbed online compiler documentation: https://developer.mbed.org/handbook/mbed-Compiler■ mbed cli documentation: https://github.com/ARMmbed/mbed-cli/blob/master/README.md■ mbed workspace tools documentation: https://github.com/ARMmbed/mbedos/blob/master/docs/BUILDING.md#workspace-tools

xDot Platform
The xDot mbed page includes the xDot library, firmware, and test cases
https://developer.mbed.org/platforms/MTS-xDot-L151CC/

EUI and Networking
xDots have an Extended Unique Identifier (EUI). To query the device for the EUI, AT+DI:
AT+DI=<8-BYTE-HEX-MSB>
AT+DI=001122AABBCCDDEE
For information on setting up xDots as part of a LoRa network, go to www.multitech.net.

MultiConnect® xDotTM MTXDOT Developer Guide

7

CHAPTER 1 PRODUCT OVERVIEW

Product Build Options
Product

Description

Package Quantity

MTXDOT-NA1-A00

915 MHz LoRa Module UFL/TRC (NAM)

1 or 100

MTXDOT-NA1-A01

915 MHz LoRa Module TRC (NAM)

100

MTXDOT-EU1-A00

868 MHz LoRa Module UFL/TRC (EU)

1 or 100

MTXDOT-EU1-A01

868 MHz LoRa Module TRC (EU)100

North America

EMEA

Developer Kits
MTMDK-XDOT-NA1-A00

MultiConnect xDot Micro Developer Kit - Includes a 915 MHz xDot

MTMDK-XDOT-EU1-A00

MultiConnect xDot Micro Developer Kit - Includes a 868 MHz xDot

Note:
■ The complete product code may end in .Rx. For example, MTXDOT-NA1-A00.Rx, where R is revisionand x is the revision number.

8

MultiConnect® xDotTM MTXDOT Developer Guide

CHAPTER 2 GETTING STARTED

Chapter 2 Getting Started
Getting Started with the xDot Developer Kit
Getting started depends on what you want to do. By default, xDot ships with firmware that supports AT
Commands that use the serial I/O. For AT Commands, refer to the separate MultiConnect Dots AT Command
Reference Guide.
Two serial interfaces are available through the USB interface, one is used to send AT commands to the xDot andthe other is for debug messages. Refer to Chapter 4, Specifications and Pin Information for information on which
pins are available out of the box.
Before starting your project development, make sure you have the latest firmware for the Developer Kit and xDot.
Go to the xDot mbed page for firmware. https://developer.mbed.org/platforms/MTS-xDot-L151CC/
To send commands to the xDot:
1.
2.
3.

Plug the developer board into a USB port.
Open communications software, such as TeraTerm, Putty, or Minicom.
Set the following:■ Baud rate = 115,200■ Data bits = 8■ Parity = N■ Stop bits = 1■ Flow control = Off

To develop using mbed, the xDot mbed page includes libraries and test cases. Refer to mbed Documentation for
details and links.
For help setting up a MultiConnect® Conduit™ to send data to and from an xDot, refer to Related Documentation .

COM Port Enumeration by Operating System
xDots create an AT Commands port and a debug port.

Linux
The following COM ports are created on Linux systems:■ /dev/ttyACMx■ /dev/ttyACMy
Where x and y may be 0 and 1, 3 and 4, etc.
The COM port with lower number is the AT command port and COM port with the higher number is the debug
port.

Windows
On Windows systems, COM ports appear in the Device Manager:■ Debug Port: mbed Serial Port
MultiConnect® xDotTM MTXDOT Developer Guide

9CHAPTER 2 GETTING STARTED■ AT Command Port: XR21V1410 USB UART
You may need to install a driver for the debug port to function properly. Go to:https://developer.mbed.org/handbook/Windows-serial-configurationMac
On Mac systems, COM ports appear in the Device Manager as:■ /dev/cu.usbmodemx
Where x is a string of numbers and possibly letters, ending in a number.
The COM port with lower number is the AT command port and COM port with the higher number is the debug
port.

10

MultiConnect® xDotTM MTXDOT Developer Guide

CHAPTER 3 MECHANICAL DRAWINGS WITH PINOUTS

Chapter 3 Mechanical Drawings with Pinouts
xDot

MultiConnect® xDotTM MTXDOT Developer Guide

11

CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

Chapter 4 Specifications and Pin Information
MTXDOT Specifications
Category

Description

GeneralCompatibility

LoRaWAN 1.0 specifications

Interfaces

Note that pin functions are multiplexed.
Up to 19 digital I/O
Up to 10 analog inputs
2 DAC outputs
I2C
SPI
Wake pin
Reset pin
Full UART
mbed/simple UART (RX & TX only)
mbed programming interface

CPU PerformanceCPU

32 MHzMax Clock

32 MHzFlash Memory

256 KB, with xDot library 136 KB available; with AT firmware, 56 KB available

EEPROM

8 KB, available 6 KB

SRAM

32 KB

Backup Register

128 byte, available 88

Radio Frequency
ISM Bands

863 MHz - 868 MHz, 902 MHz - 928 MHz, 915 MHz - 935 MHz

Physical Description
Weight0.0001 oz. (0.003g)

Dimensions

Refer to Mechanical Drawings for Dimensions.

RF Connectors

12-UFL Models

U.FL-Trace Models

Trace Connection

MultiConnect® xDotTM MTXDOT Developer Guide

CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

Category

Description

Environment
OperatingTemperature-40° C to +85° C

Storage
Temperature-40° C to +85° C

Humidity

20%-90% RH, non-condensing

Power Requirements
Operating Voltage

2.4 to 3.57 V

Certifications and Compliance
EMC and Radio
Compliance

Safety Compliance

EN 300 220-2 V2.4.1:2012

EN 300 220-2 V2.4.1:2012

EN 301 489-03 V1.6.1:2013

ICES-003:2012

FCC 15.247:2015

CISPR 22:2008

FCC 15.109:2015

AS/NZS CISPR 22

FCC 15.107:2015

AS/NZS 4268:2012 + a1:2013

RSS 247:2015

Standard 2014 MPE

UL 60950-1 2nd ED
cUL 60950-1 2nd ED
IEC 60950-1 2nd ED AM1 + AM2
AS/NZS 60950.1:2015

Category

Description

Transmission
North America

EMEA

Max Transmitter
Power Output (TPO)

19 dBm

14 dBmMaximum Receive
Sensitivity-137 dBm-137 dBm

Link Budget1

147 dB Point-to-Point

147 dB Point-to-Point

Max Effective
Isotropic RadiatedPower (EiRP)

22 dBm

10 dBmMultiConnect® xDotTM MTXDOT Developer Guide

13

CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

Category

Description

Receive Sensitivity
Spreading Factor

North America Typical Sensitivity2

EMEA Typical Sensitivity3

6-111 dBm-121 dBm

7-116 dBm-124 dBm

8-119 dBm-127 dBm

9-122 dBm-130 dBm

10-125 dBm-133 dBm

11-127 dBm-135 dBm

12-129 dBm-137 dBm

1

Greater link budget is possible with higher gain antenna.

2

RFS_L500: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 500 kHz bandwidth using split Rx/Tx
path.
3

RFS_L125: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 125 kHz bandwidth using split Rx/Tx
path.

Mapping Data Rate to Spreading Factor/Bandwidth
US/AU

UplinkDownlink

DR0: SF10BW125

DR8: SF12BW500

DR1: SF9BW125

DR9: SF11BW500

DR2: SF8BW125...

DR3: SF7BW125

DR13: SF7BW500

DR4: SF8BW500
DR5-DR7: RFU
EU

DR0: SF12BW125...
DR5: SF7BW15
DR6: SF7BW250
DR7: FSK

14

MultiConnect® xDotTM MTXDOT Developer Guide

CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

Battery Draw Down
xDot battery life depends on many variables, including transmit power, data rate, sleep usage, and duty cycle. The
following figure represents the current consumption in one possible application.

Use the current consumption values from the Electrical Characteristics table (below) when calculating average
power consumption.

Electrical Characteristics
Note:■ All measurements taken at VDD = 3.3 V and 25 degrees Celsius ambient temperature unlessotherwise specified.
■ Refer to the ST Micro STM32L151CC datasheet for more detailed processor IO characteristics.
SignalDescription

VCC

Conditions

Min

Typical

Max

Units

Operating Voltage

2.4

3.3

3.6

V

Vin Low

IO input low level----

0.3V * VDDVVin High

IO input high level

0.45 * VDD + 0.6

Vout Low

IO output low level

Vout HighIO output high level 2.7V < VDD < 3.6V

VDD - 0.4

Vout Low

IO output low level--

Vout HighIO output high level 2.7V < VDD < 3.6V

Pin current = 8mA
Pin current = 20mA

MultiConnect® xDotTM MTXDOT Developer Guide-

VDD - 1.3

V
0.4

V
V

1.3

V
V

15

CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

SignalDescription

ICC

Conditions

Min

Typical

Max

Units

Idle mode (no TX, no -RX), processor active

11.1

mA

TX, TXP=2

--

128

mA

TX, TXP=11

--

184

mA

TX, TXP=20

--

188

mA

Maximum supply-current. Transmitting
at TXP=20, allperipherals active, noload on IO pins. VDD= 3.3V. 25 degC
ambient
temperature.

--

250

mA

Sleep mode

--

2.1

--

uA

Deep sleep mode

--

1.8

--

uA

RX

22

mA

Measuring the Power Draw
To measure the power draw on an xDot developer board:
1.
2.
3.
4.
5.
6.
7.

Flash the latest AT command firmware on the xDot.
Unplug the xDot from the computer and then reconnect it.
Connect current meter across JP30 on the developer board.
Set wake pin to wake, AT+WP=6.
Set wake mode to interrupt, AT+WM=1.
Put the xDot to sleep, AT+SLEEP=0|1.
Put jumper across JP5.
Note: After this step, AT command and debug ports no longer work.

8.
9.

16

Measure current draw.
Press the S2 button on the developer board to wake the xDot

MultiConnect® xDotTM MTXDOT Developer Guide

CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

xDot and Processor Pin Information

Pin Information
Note:■ Using the mbed platform expands your pin functionality options.
■ Pins are on a 0.07 inch grid, and are 0.028 inches square (except for upper left)■ The xDot is 0.045 x 0.045, board is 0.93 x 0.93
48QFN xDot Pin

Pin Name

SW NameFunction
Description

Processor Pin
Alt1

Processor Pin Alt2

25

9

PB12

SPI2_NSSGPIO / SPI

TIM10_CH1/
I2C2_SMBA/
SPI2_NSS/
I2S2_WS/
USART3_CK/
LCD_SEG12

ADC_IN18/
COMP1_INP/VLCDRAIL2

26

10

PB13

SPI2_SCKGPIO / SPI

TIM9_CH1/
SPI2_SCK/
I2S2_CK/USART3_CTS/LCD_SEG13

ADC_IN19/
COMP1_INPMultiConnect® xDotTM MTXDOT Developer Guide

17

CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

18

48QFN xDot Pin

Pin Name

SW NameFunction
Description

Processor Pin
Alt1

Processor Pin Alt2

28

11

PB15

SPI2_MOSIGPIO / SPI

TIM11_CH1/
SPI2_MOSI/I2S2_SD/
LCD_SEG15

ADC_IN21/
COMP1_INP/
RTC_REFIN

27

12

PB14

SPI2_MISOGPIO / SPI

TIM9_CH2/
SPI2_MISO/USART3_RTS/
LCD_SEG14

ADC_IN20/COMP1_INP

30

13

PA9

UART1_TXGPIO / UARTUSART1_TX/
LCD_COM1

-

31

14

PA10

UART1_RX

GPIO / UARTUSART1_RX/
LCD_COM2

-

12

15

PA2

UART2_TX

Debug UART

13

16

PA3

UART2_RX

Debug UART

20

23

PB2

GPIO3

GPIO

BOOT1

VLCDRAIL1/ ADCIN0b

18

24

PB0

GPIO2

GPIO

TIM3_CH3/
LCD_SEG5

ADC_IN8/COMP1_INP/OPAMP2_VOUT/VLCDRAIL3/
VREF_OUT

15

25

PA5

GPIO1

GPIO

TIM2_CH1_ETR/
SPI1_SCKADC_IN5/
DAC_OUT2/
COMP1_INP

14

26

PA4

GPIO0

GPIO

SPI1_NSS/SPI3_NSS/
I2S3_WS/
USART2_CK

ADC_IN4/
DAC_OUT1/
COMP1_INP

45

27

PB8

I2C1_SCLGPIO / I2C

TIM4_CH3/
TIM10_CH1/
I2C1_SCL/LCD_SEG16

-

46

28

PB9

I2C1_SDAGPIO / I2C

TIM4_CH4/
TIM11_CH1/
I2C1_SDA/LCD_COM3

-

37

29

PA14

MBED SWCLK

JTCK-SWCLK

-

34

30

PA13

MBED SWDIO

JTMS-SWDIO

-

33

31

PA12

GPIO / UARTUSART1_RTS/
SPI1_MOSIUSB_DPUART1_RTS

MultiConnect® xDotTM MTXDOT Developer Guide

CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

48QFN xDot Pin

Pin Name

SW NameFunction
Description

Processor Pin
Alt1

Processor Pin Alt2

32

32

PA11

UART1_CTSGPIO / UARTUSART1_CTS/
SPI1_MISO

USB_DM

7

33

NRST

NRESET

-

-

10

34

PA0-WKUP1

GPIO / WAKE

TIM2_CH1_ETR/
TIM5_CH1/
USART2_CTS

WKUP1/
RTC_TAMP2/
ADC_IN0/
COMP1_INP

WAKE

37

ANT1

47

RFU (ANT2)

8,23,35 1, 5, 17, VSS,47,49 20,35, 36,
38, 39,40, 41,42, 43,44, 45,46, 48,49, 50,51, 52,53, 54,55, 56,57, 58GND

2, 6, 7, 8,
18, 19,21, 22

Reserved

16

PA6

LORA_DIO0

LORA Radio

17

PA7

LORA_DIO1

LORA Radio

29

PA8

LORA_DIO2LORA Radio

42

PB6

LORA_DIO3

LORA Radio

43

PB7

LORA_DIO4LORA Radio

40

PB4

LORA_MISOLORA Radio

41

PB5

LORA_MOSILORA Radio

38

PA15

LORA_NSSLORA Radio

11

PA1

LORA_RESETLORA Radio

39

PB3

LORA_SCKLORA Radio

22

PB11

SE_CLK

Secure Element

19

PB1

SE_CTRL

Secure Element

21

PB10

SE_IO

Secure Element2

PC13-WKUP2 SE_RESET

MultiConnect® xDotTM MTXDOT Developer Guide

Secure Element

19

CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

48QFN xDot Pin

Pin Name

44

SW NameFunction
Description

Processor Pin
Alt1

Processor Pin Alt2

BOOT0

Boot0

-

-

3

PC14OSC32_IN(4)

RTC_CLK-

OSC32_IN

4

PC15OSC32_OUT

RTC_CLK-

OSC32_OUT

5

PH0OSC_IN(5)Main 24M-

OSC_IN

6

PH1OSC_OUT(5)Main 24M-

OSC_OUT

Pull-Up/Down

20

48QFN

xDot Pin

Pin Name

7

33

NRST

SW NamePU/PD
10k PU38

PA15

LORA_NSS

100k PU19

PB1

SE_CTRL

10k PU

44

BOOT0

10k PD

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CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

xDot Pinout Design Notes
Refer to the mechanical drawing for your model for pin locations.
■ All pins that go to connectors are directly connected to the processor.
■ Refer to Pin Information table for pull up and pull down information.
xDots allow you to program pins depending on your application:■ Serial: Available out of the box. See Serial Pinout Notes for details.
■ mbed: Designed with the STM32L151CCU6 48-pin processor, this option provides the most flexibility. For
more information about processor capabilities, see the processor datasheet.

Serial Pinout Notes
Out of the box, these pins are available for serial applications. Refer to the mechanical drawing for your model forpin locations.
■ 18 PTA1 UART1_CTS■ 19 PTA2 UART1_RTS■ 36 PTC3 UART1_RX■ 37 PTC4 UART1_TX

Serial Settings
When creating a serial connection with the device on the developer board, open communications software (suchas TeraTerm, Putty, or Minicom ), and use the following settings:■ Baud rate = 115,200■ Data bits = 8■ Parity = N■ Stop bits = 1■ Flow control = Off

LoRa
Throughput Rates
Theoretical maximum speeds for LoRa mode with ACKs off are:
■ Using spreading factor 7 at 125kHz, the throughput rate is 5470 bps (5.47 kbps).
■ Using spreading factor 7 at 500kHz the receiving throughput rate is 21900 bps (21.9 kbps).
Note: Data rates in the LoRaWAN specification vary by geographic region.

Range
Variables effecting the range include TX power, antenna gain, RX sensitivity, fade margin, earth's curvature. Use
the following formula to calculate the maximum range:

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CHAPTER 4 SPECIFICATIONS AND PIN INFORMATION

The following table provides example settings and the theoretical maximum range based on these settings.
Example18dB Transmit Power for
915 MHz Models

Units

Example 14dB Transmit Power for
868MHz Models

Frequency

915

MHz

868

TX Power

19

dBm

14

3

dB

3

RX Sensitivity

-120

dBm

-120

RX Antenna Gain

3

dB

3

Fade Margin2

30

dB

30

Distance

8.14

Miles

5.41

Distance

13.08

Km

8.70

TX Antenna Gain
1

1

RX Sensitivity is set to a conservative -120dBm, but can vary from -117 to -137dBm.

2

Fade Margin is set at the worst case of 30dB. Fade margin is an allowance a system designer includes to accountfor unknown variables. The higher the fade margin, the better the overall link quality will be. With a fade margin
set to zero, the link budget is still valid, but only in LOS conditions, which is not practical for most designs. The
amount of fade margin to include in a calculation depends on the environment in which you will deploy thesystem. A fade margin of 12 dBm is good, but a better number would be 20 to 30 dBm.

22

MultiConnect® xDotTM MTXDOT Developer Guide

CHAPTER 5 ANTENNAS

Chapter 5 Antennas
Antenna System
The LoRa antenna performance depends on the implementation and antenna design. The integration of theantenna system into the product is a critical part of the design process; therefore, it is essential to consider it earlyso the performance is not compromised. If changes are made to the device's certified antenna system, thenrecertification will be required.
This radio transmitter has been tested with both the Pulse and Ethertronics antennas listed below. If you follow
our design guidelines, you do not need to re-certify your design. The antenna you use must maintain the same
specifications. It must be of the same type, with similar in-band and out-of-band radiation patterns. Antennas
having a greater gain than the maximum gain indicated for the listed type, are strictly prohibited for use with thisdevice.

U.FL and Trace Antenna Options
If using U.FL or trace antennas, note the following:■ For a simple trace to RF antennas: Routing must follow standard RF design rules and practices forstripline/miscrostrip for a 50 ohm impedance line. Use the developer board schematics for a reference
circuit for the a trace antenna.
■ For U.FL antennas: The antenna and cable combination in your design cannot exceed the performance of
the SMA antenna as listed in the next topic.
■ The xDot Developer Board includes an Ethertronics M620720 chip antenna, which by default connects thexDot to the chip antenna. Only one antenna, either U.FL or chip, may be used at a time. To use the xDot’s
U.FL connector, remove resistor C23 and L1, marked on the following image, to disconnect the chipantenna.

MultiConnect® xDotTM MTXDOT Developer Guide

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CHAPTER 5 ANTENNAS

Pulse Electronics Antenna
Manufacturer:

Pulse Electronics

Description:

868-915 MHz RP-SMA Antenna, 8"

Model Number:

W1063

MultiTech Part Number:

45009830L

MultiTech ordering information:
Ordering Part Number

Quantity

AN868-915A-1HRA

1

AN868-915A-10HRA

10AN868-915A-50HRA

50

Antenna Specifications

24

Category

Description

Frequency Range

868-928 MHz

Impedance

50 Ohms

VSWR

< 2.0

Gain

3.0 dBi

Radiation

Omni
MultiConnect® xDotTM MTXDOT Developer Guide

CHAPTER 5 ANTENNAS

Category

Description

Polarization

Vertical

RSMA-to-U.FL Coaxial Cables
Coaxial Cable Specifications
Optional antenna cables can be ordered from MultiTech
Cable Type

Coaxial Cable

Attenuation<1.0dbConnector Impedance

50 ohmMaximum Cable Length16" (40 cm)

Ordering Information
Part Number

Description

CARSMA-UFL-1

RSMA-to-UFL Coax Cable (Single Pack)

CARSMA-UFL-10

RSMA-to-UFL Coax Cable (Ten Pack)

CARSMA-UFL-100

RSMA-to-UFL Coax Cable (One Hundred Pack)

MultiConnect® xDotTM MTXDOT Developer Guide

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CHAPTER 5 ANTENNAS

Ethertronics Chip AntennaThis is the developer board's default antenna.
Manufacturer:

Ethertronics

Description:

915MHz Chip RF Antenna 902MHz ~ 928MHz 2.56dB Solder Surface Mount

Model Number:

M620720

Datasheet:https://www.ethertronics.com/wp-content/uploads/2016/11/M620720-ISM-868915MHz-Ethertronics-Savvi-Ceramic-antenna-datasheet-20161020.pdf

Antenna Specifications
Category

Description

Electrical Specifications
Frequency Range

868-870 MHz, 902-928 MHz

Peak Gain

2.56 dBi

VSWR

2:6:1 max

Impedance

50 ohms unbalanced

Average Efficiency

58%

Power Handling

0.5 Watt CW

Polarization

LinearMechanical Specifications
Mounting

Surface MountSize

6.00 x 2.00 x 1.1mm

Stackup Information
Developer Board Layer Stackup

26

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CHAPTER 5 ANTENNAS

Stackup Table

Impedance
Polar trial balance (L1 refer to L2) impedance 50.87 ohms, using 11 mil tracs, 22mil space.

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CHAPTER 5 ANTENNAS

Polar trial balance (L1 refer to L2/L4 refer to L3) impedance 93.54 ohms, using 8 mil tracs, 7mil space.

28

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CHAPTER 5 ANTENNAS

Chip Antenna Design Guidelines
When designing antenna placement for the chip antenna, note the following:■ The antenna's long side must be along the edge of the ground plane.
■ Remove the ground plane from all layers below the antenna.
■ The distance from the antenna to the enclosure or plastic cover should be greater than 1.5 mm.
The distance from the antenna to relatively large perturbations, such as a shield or large components, depends on
the height of surrounding components. It should not be less than 1.5mm.
We recommend a distance equal to or greater than 10mm from the end of the antenna to either end of the PCB
distance. Performance is better from larger distances.
Use the recommended land pattern shown in the figures below. Land patterns are composed of a 50 ohm line
connected to each antenna feed point. Ground clearance around and under the antenna as shown in the PCB
layout is recommended to maximize antenna performance.

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CHAPTER 5 ANTENNAS

Antenna Pad Layout

PCB Layout

30

MultiConnect® xDotTM MTXDOT Developer Guide

CHAPTER 5 ANTENNAS

Antenna Matching Network
The following images come from the xDot Developer Board schematics and show component populations for theantenna tuning circuit. The values you use depend on which frequency band you are using, 898 MHz or 915 MHz

915

MultiConnect® xDotTM MTXDOT Developer Guide

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CHAPTER 5 ANTENNAS

868

OEM Integration
FCC & IC Information to Consumers
The user manual for the consumer must contain the statements required by the following FCC and IC regulations:47 C.F.R. 15.19(a)(3), 15.21, 15.105 and RSS-Gen Issue 4 Sections 8.3 and 8.4.

FCC Grant Notes
The OEM should follow all the grant notes listed below. Otherwise, further testing and device approvals may benecessary.
FCC Definitions
Portable: (§2.1093) — A portable device is defined as a transmitting device designed to be used so that theradiating structure(s) of the device is/are within 20 centimeters of the body of the user.
Mobile: (§2.1091) — A mobile device is defined as a transmitting device designed to be used in other than fixedlocations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally
maintained between the transmitter’s radiating structure(s) and the body of the user or nearby persons.
Actual content pending Grant: This device is a mobile device with respect to RF exposure compliance. The
antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all
persons, and must not be collocated or operate in conjunction with any other antenna or transmitter except inaccordance with FCC multi-transmitter product guidelines. Installers and end-users must be provided with specificinformation required to satisfy RF exposure compliance for installations and final host devices. (See note underGrant Limitations.) Compliance of this device in all final host configurations is the responsibility of the Grantee.
32

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CHAPTER 5 ANTENNAS

Note: Host design configurations constituting a device for portable use (<20 cm from human body) require
separate FCC/IC approval.

Host Labeling
The following statements are required to be on the host label:■ This device contains FCC ID: AU792U13A16858■ This device contains equipment certified under IC: 125A-0055
For labeling examples, see Cellular Approvals and Labeling Requirements.

MultiConnect® xDotTM MTXDOT Developer Guide

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CHAPTER 6 SAFETY INFORMATION

Chapter 6 Safety Information
Handling Precautions
To avoid damage due to the accumulation of static charge, use proper precautions when handling any cellulardevice. Although input protection circuitry has been incorporated into the devices to minimize the effect of staticbuild-up, use proper precautions to avoid exposure to electronic discharge during handling and mounting thedevice.

Radio Frequency (RF) Safety
Due to the possibility of radio frequency (RF) interference, it is important that you follow any special regulations
regarding the use of radio equipment. Follow the safety advice given below.
■ Operating your device close to other electronic equipment may cause interference if the equipment isinadequately protected. Observe any warning signs and manufacturers’ recommendations.
■ Different industries and businesses restrict the use of cellular devices. Respect restrictions on the use ofradio equipment in fuel depots, chemical plants, or where blasting operations are in process. Follow
restrictions for any environment where you operate the device.
■ Do not place the antenna outdoors.
■ Switch OFF your wireless device when in an aircraft. Using portable electronic devices in an aircraft may
endanger aircraft operation, disrupt the cellular network, and is illegal. Failing to observe this restriction
may lead to suspension or denial of cellular services to the offender, legal action, or both.
■ Switch OFF your wireless device when around gasoline or diesel-fuel pumps and before filling your vehicle
with fuel.
■ Switch OFF your wireless device in hospitals and any other place where medical equipment may be in use.

Sécurité relative aux appareils à radiofréquence (RF)À cause du risque d'interférences de radiofréquence (RF), il est important de respecter toutes les réglementations
spéciales relatives aux équipements radio. Suivez les conseils de sécurité ci-dessous.
■ Utiliser l'appareil à proximité d'autres équipements électroniques peut causer des interférences si leséquipements ne sont pas bien protégés. Respectez tous les panneaux d'avertissement et les
recommandations du fabricant.
■ Certains secteurs industriels et certaines entreprises limitent l'utilisation des appareils cellulaires. Respectez
ces restrictions relatives aux équipements radio dans les dépôts de carburant, dans les usines de produits
chimiques, ou dans les zones où des dynamitages sont en cours. Suivez les restrictions relatives à chaquetype d'environnement où vous utiliserez l'appareil.
■ Ne placez pas l'antenne en extérieur.
■ Éteignez votre appareil sans fil dans les avions. L'utilisation d'appareils électroniques portables en avion est
illégale: elle peut fortement perturber le fonctionnement de l'appareil et désactiver le réseau cellulaire. S'ilne respecte pas cette consigne, le responsable peut voir son accès aux services cellulaires suspendu ou
interdit, peut être poursuivi en justice, ou les deux.
■ Éteignez votre appareil sans fil à proximité des pompes à essence ou de diesel avant de remplir le réservoir
de votre véhicule de carburant.

34

MultiConnect® xDotTM MTXDOT Developer Guide

CHAPTER 6 SAFETY INFORMATION■ Éteignez votre appareil sans fil dans les hôpitaux ou dans toutes les zones où des appareils médicaux sontsusceptibles d'être utilisés.

Interference with Pacemakers and Other Medical Devices
Potential interference
Radio frequency energy (RF) from cellular devices can interact with some electronic devices. This iselectromagnetic interference (EMI). The FDA helped develop a detailed test method to measure EMI of implanted
cardiac pacemakers and defibrillators from cellular devices. This test method is part of the Association for the
Advancement of Medical Instrumentation (AAMI) standard. This standard allows manufacturers to ensure thatcardiac pacemakers and defibrillators are safe from cellular device EMI.
The FDA continues to monitor cellular devices for interactions with other medical devices. If harmful interference
occurs, the FDA will assess the interference and work to resolve the problem.

Precautions for pacemaker wearers
If EMI occurs, it could affect a pacemaker in one of three ways:■ Stop the pacemaker from delivering the stimulating pulses that regulate the heart's rhythm.
■ Cause the pacemaker to deliver the pulses irregularly.
■ Cause the pacemaker to ignore the heart's own rhythm and deliver pulses at a fixed rate.
Based on current research, cellular devices do not pose a significant health problem for most pacemaker wearers.
However, people with pacemakers may want to take simple precautions to be sure that their device doesn't cause
a problem.
■ Keep the device on the opposite side of the body from the pacemaker to add extra distance between
the pacemaker and the device.
■ Avoid placing a turned-on device next to the pacemaker (for example, don’t carry the device in a shirt
or jacket pocket directly over the pacemaker).

Device Maintenance
When maintaining your device:■ Do not attempt to disassemble the device. There are no user serviceable parts inside.
■ Do not expose your device to any extreme environment where the temperature or humidity is high.
■ Do not expose the device to water, rain, or spilled beverages. It is not waterproof.
■ Do not place the device alongside computer discs, credit or travel cards, or other magnetic media. The
information contained on discs or cards may be affected by the device.
■ Using accessories, such as antennas, that MultiTech has not authorized or that are not compliant with
MultiTech's accessory specifications may invalidate the warranty.
If the device is not working properly, contact MultiTech Technical Support.

User Responsibility
Respect all local regulations for operating your wireless device. Use the security features to block unauthorized use
and theft.

MultiConnect® xDotTM MTXDOT Developer Guide

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CHAPTER 7 REGULATORY INFORMATION

Chapter 7 Regulatory Information

36

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CHAPTER 7 REGULATORY INFORMATION

EMC, Safety, and R&TTE Directive Compliance
The CE mark is affixed to this product to confirm compliance with the following European Community Directives:
Council Directive 2014/30/EU on the approximation of the laws of Member States relating toelectromagnetic compatibility;andCouncil Directive 2014/35/EU on the harmonization of the laws of Member States relating to electricalequipment designed for use within certain voltage limits;
andCouncil Directive 2011/65/EU on the restriction of the use of certain hazardous substances in electricaland electronic equipment;
andCouncil Directive 1999/5/EC on radio equipment and telecommunications terminal equipment and themutual recognition of their conformity.

47 CFR Part 15 Regulation Class B Devices
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio communications. However,there is no guarantee that interference will not occur in a particular installation. If this equipment does cause
harmful interference to radio or television reception, which can be determined by turning the equipment off andon, the user is encouraged to try to correct the interference by one or more of the following measures:■ Reorient or relocate the receiving antenna.
■ Increase the separation between the equipment and receiver.
■ Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
■ Consult the dealer or an experienced radio/TV technician for help.
Warning: Changes or modifications to this unit not expressly approved by the party responsible for compliancecould void the user’s authority to operate the equipment.

FCC Interference Notice
Per FCC 15.19(a)(3) and (a)(4) This device complies with part 15 of the FCC Rules. Operation is subject to thefollowing two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.

FCC Notice
xDot products are open development based products that contain a sub ghz radio technology. MultiTech has
certified for compliance with US and Foreign compliance bodies including FCC, R&TTE and others. (e.g. FCC
15.247:2015 & IC RSS 247:2015)
MultiTech provides software code meant to operate the radio to a level that maintains compliance with theoperating modes under which these radio devices were certified. To ensure this level of compliance, the software
code is provided in binary form only. Users are prohibited from making any changes that affect the operation ofMultiConnect® xDotTM MTXDOT Developer Guide

37

CHAPTER 7 REGULATORY INFORMATION

the radio performance. Accessing or controlling the radio through any means other than the provided binary
software will require the user to obtain their own intentional radiator license from the certification body governing
their locality, as all pre-certification provided with xDot will have been made invalid.

Industry Canada Class B NoticeThis Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations.
Cet appareil numérique de la classe B respecte toutes les exigences du Reglement Canadien sur le matériel
brouilleur.
This device complies with Industry Canada license-exempt RSS standard(s). The operation is permitted for thefollowing two conditions:1.
2.

the device may not cause harmful interference, andthe user of the device must accept any interference suffered, even if the interference is likely tojeopardize the operation.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes:
1.
2.

38

l'appareil ne doit pas produire de brouillage, etl'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement.

MultiConnect® xDotTM MTXDOT Developer Guide

CHAPTER 8 ENVIRONMENTAL NOTICES

Chapter 8 Environmental Notices
Waste Electrical and Electronic Equipment Statement
Note: This statement may be used in documentation for your final product applications.

WEEE Directive
The WEEE Directive places an obligation on EU-based manufacturers, distributors, retailers, and importers to takeback electronics products at the end of their useful life. A sister directive, ROHS (Restriction of Hazardous
Substances) complements the WEEE Directive by banning the presence of specific hazardous substances in the
products at the design phase. The WEEE Directive covers all MultiTech products imported into the EU as of August
13, 2005. EU-based manufacturers, distributors, retailers and importers are obliged to finance the costs of recovery
from municipal collection points, reuse, and recycling of specified percentages per the WEEE requirements.

Instructions for Disposal of WEEE by Users in the European Union
The symbol shown below is on the product or on its packaging, which indicates that this product must not be
disposed of with other waste. Instead, it is the user's responsibility to dispose of their waste equipment by handing
it over to a designated collection point for the recycling of waste electrical and electronic equipment. The separate
collection and recycling of your waste equipment at the time of disposal will help to conserve natural resourcesand ensure that it is recycled in a manner that protects human health and the environment. For more information
about where you can drop off your waste equipment for recycling, please contact your local city office, yourhousehold waste disposal service or where you purchased the product.
July, 2005

REACH Statement
Registration of Substances
After careful review of the legislation and specifically the definition of an “article” as defined in EC Regulation
1907/2006, Title II, Chapter 1, Article 7.1(a)(b), it is our current view that Multi-Tech Systems, Inc. products would
be considered as “articles.” In light of the definition in § 7.1(b) which requires registration of an article only if it
contains a regulated substance that “is intended to be released under normal or reasonably foreseeable conditionsof use,” our analysis is that Multi-Tech Systems, Inc. products constitute nonregisterable articles for their intended
and anticipated use.

Substances of Very High Concern (SVHC)Per the candidate list of Substances of Very High Concern (SVHC) published October 28, 2008 we have reviewed
these substances and certify the Multi-Tech Systems, Inc. products are compliant per the EU “REACH”
requirements of less than 0.1% (w/w) for each substance. If new SVHC candidates are published by the European
Chemicals Agency, and relevant substances have been confirmed, that exceeds greater than 0.1% (w/w), MultiTech Systems, Inc. will provide updated compliance status.

MultiConnect® xDotTM MTXDOT Developer Guide

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CHAPTER 8 ENVIRONMENTAL NOTICES

Multi-Tech Systems, Inc. also declares it has been duly diligent in ensuring that the products supplied are compliant
through a formalized process which includes collection and validation of materials declarations and selective
materials analysis where appropriate. This data is controlled as part of a formal quality system and will be madeavailable upon request.

40

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CHAPTER 8 ENVIRONMENTAL NOTICES

Restriction of the Use of Hazardous Substances (RoHS)

Multi-Tech Systems, Inc.
Certificate of Compliance2011/65/EU
Multi-Tech Systems, Inc. confirms that its embedded products comply with the chemical concentration limitations
set forth in the directive 2011/65/EU of the European Parliament (Restriction of the use of certain Hazardous
Substances in electrical and electronic equipment - RoHS).
These MultiTech products do not contain the following banned chemicals1:■ Lead, [Pb] < 1000 PPM■ Mercury, [Hg] < 1000 PPM■ Hexavalent Chromium, [Cr+6] < 1000 PPM■ Cadmium, [Cd] < 100 PPM■ Polybrominated Biphenyl, [PBB] < 1000 PPM■ Polybrominated Diphenyl Ether, [PBDE] < 1000 PPM
Environmental considerations:■ Moisture Sensitivity Level (MSL) =1■ Maximum Soldering temperature = 260C (in SMT reflow oven)1

Lead usage in some components is exempted by the following RoHS annex, therefore higher lead concentration
would be found in some modules (>1000 PPM);- Resistors containing lead in a glass or ceramic matrix compound.

MultiConnect® xDotTM MTXDOT Developer Guide

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CHAPTER 8 ENVIRONMENTAL NOTICES

Information on HS/TS Substances According to Chinese Standards
In accordance with China's Administrative Measures on the Control of Pollution Caused by Electronic Information
Products (EIP) # 39, also known as China RoHS, the following information is provided regarding the names andconcentration levels of Toxic Substances (TS) or Hazardous Substances (HS) which may be contained in Multi-Tech
Systems Inc. products relative to the EIP standards set by China's Ministry of Information Industry (MII).
Hazardous/Toxic Substance/Elements
Name of the Component

Lead
(PB)

Mercury(Hg)

Cadmium Hexavalent(CD)
Chromium(CR6+)

Polybromi Polybrominat
nated
ed Diphenyl
Biphenyl
Ether (PBDE)(PBB)Printed Circuit Boards

O

O

O

O

O

O

Resistors

X

O

O

O

O

O

Capacitors

X

O

O

O

O

O

Ferrite Beads

O

O

O

O

O

O

Relays/Opticals

O

O

O

O

O

O

ICs

O

O

O

O

O

O

Diodes/ Transistors

O

O

O

O

O

O

Oscillators and Crystals

X

O

O

O

O

O

Regulator

O

O

O

O

O

O

Voltage Sensor

O

O

O

O

O

O

Transformer

O

O

O

O

O

O

Speaker

O

O

O

O

O

O

Connectors

O

O

O

O

O

O

LEDs

O

O

O

O

O

O

Screws, Nuts, and other
Hardware

X

O

O

O

O

O

AC-DC Power Supplies

O

O

O

O

O

O

Software /Documentation CDs

O

O

O

O

O

O

Booklets and Paperwork

O

O

O

O

O

O

Chassis

O

O

O

O

O

O

X Represents that the concentration of such hazardous/toxic substance in all the units of homogeneousmaterial of such component is higher than the SJ/Txxx-2006 Requirements for Concentration Limits.
O Represents that no such substances are used or that the concentration is within the aforementioned limits.

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CHAPTER 8 ENVIRONMENTAL NOTICES

Information on HS/TS Substances According to Chinese Standards (inChinese)依照中国标准的有毒有害物质信息
根据中华人民共和国信息产业部 (MII) 制定的电子信息产品 (EIP) 标准－中华人民共和国《电子信息产品污染
控制管理办法》（第 39 号），也称作中国 RoHS, 下表列出了 Multi-Tech Systems, Inc. 产品中可能含有的有毒物质 (TS) 或有害物质 (HS) 的名称及含量水平方面的信息。
有害/有毒物质/元素
成分名称

铅 (PB)

印刷电路板

O

电阻器

汞 (Hg)

镉 (CD)六价铬 (CR6+) 多溴联苯
(PBB)

多溴二苯醚
(PBDE)

O

O

O

O

O

X

O

O

O

O

O

电容器

X

O

O

O

O

O

铁氧体磁环

O

O

O

O

O

O

继电器/光学部件

O

O

O

O

O

O

ICs

O

O

O

O

O

O

二极管/晶体管

O

O

O

O

O

O

振荡器和晶振

X

O

O

O

O

O

调节器

O

O

O

O

O

O

电压传感器

O

O

O

O

O

O

变压器

O

O

O

O

O

O

扬声器

O

O

O

O

O

O

连接器

O

O

O

O

O

O

LEDs

O

O

O

O

O

O

螺丝、螺母以及其它五金件

X

O

O

O

O

O

交流-直流电源

O

O

O

O

O

O

软件/文档 CD

O

O

O

O

O

O

手册和纸页

O

O

O

O

O

O

底盘

O

O

O

O

O

O

X 表示所有使用类似材料的设备中有害/有毒物质的含量水平高于 SJ/Txxx-2006 限量要求。
O 表示不含该物质或者该物质的含量水平在上述限量要求之内。

MultiConnect® xDotTM MTXDOT Developer Guide

43

CHAPTER 9 LABELS

Chapter 9 Labels
Label Examples
Note: Actual labels vary depending on the regulatory approval markings and content.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This
device may not cause harmful interference, and (2) this device must accept any interference received, includinginterference that may cause undesired operation.
The label shown is not the actual size.
1 - MultiTech Model Identification.
2 - MultiTech Ordering Part Number.
3 - Device Node Number.
Example xDot Device Label

44

Example Developer Board Device LabelMultiConnect® xDotTM MTXDOT Developer Guide

CHAPTER 10 DEVELOPER KIT OVERVIEW

Chapter 10 Developer Kit Overview
xDot Developer Kit
The xDot developer kit comes with an xDot already mounted on the developer board. Simply plug the developer kit
into a USB port on your computer to test, program, and evaluate your application.

Developer Kit Package Contents
Your Developer Kit (MTMDK-NX-XDOT-xx) includes the following:
Developer Board

1 - xDot Developer Board with xDot

Customer Notices

Quick Start

Firmware Updates
Before starting your project development, make sure you have the latest firmware for the Developer Kit and xDot.
Go to the xDot mbed page for firmware. https://developer.mbed.org/platforms/MTS-xDot-L151CC/

Programming Devices in Production
Consult developer kit schematics for programming options.

MultiConnect® xDotTM MTXDOT Developer Guide

45

CHAPTER 10 DEVELOPER KIT OVERVIEW

xDot Developer Kit Mechanical Drawings

Note: The Reset and Wake buttons reset and wake the xDot processor.

46

MultiConnect® xDotTM MTXDOT Developer Guide

CHAPTER 10 DEVELOPER KIT OVERVIEW

Micro Developer Board LEDs
LED

Description

LED1

User-definable LED.

LED3/SDA

Programming Status.

LED2/PWR

Power, blue light when the board has power.

LED4/PROXY

LED for the proximity sensor, which is next to it (labeled U14 on the top assembly
diagram).

MultiConnect® xDotTM MTXDOT Developer Guide

47

CHAPTER 11 DEVELOPER BOARD SCHEMATICS

Chapter 11 Developer Board Schematics
Assembly Diagrams and Schematics
Assembly Diagrams
Top

48

MultiConnect® xDotTM MTXDOT Developer Guide

CHAPTER 11 DEVELOPER BOARD SCHEMATICS

BottomMultiConnect® xDotTM MTXDOT Developer Guide

49

CHAPTER 11 DEVELOPER BOARD SCHEMATICS

Schematics

50

MultiConnect® xDotTM MTXDOT Developer Guide

CHAPTER 11 DEVELOPER BOARD SCHEMATICS

MultiConnect® xDotTM MTXDOT Developer Guide

51

CHAPTER 11 DEVELOPER BOARD SCHEMATICS

52

MultiConnect® xDotTM MTXDOT Developer Guide

CHAPTER 11 DEVELOPER BOARD SCHEMATICS

MultiConnect® xDotTM MTXDOT Developer Guide

53

CHAPTER 12 DESIGN CONSIDERATIONS

Chapter 12 Design Considerations
Noise Suppression Design
Adhere to engineering noise-suppression practices when designing a printed circuit board (PCB). Noise suppression
is essential to the proper operation and performance of the modem and surrounding equipment.
Any OEM board design must consider both on-board and off-board generated noise that can affect digital signal
processing. Both on-board and off-board generated noise that is coupled on-board can affect interface signal levels
and quality. Noise in frequency ranges that affect modem performance is of particular concern.
On-board generated electromagnetic interference (EMI) noise that can be radiated or conducted off-board isequally important. This type of noise can affect the operation of surrounding equipment. Most local government
agencies have certification requirements that must be met for use in specific environments.
Proper PC board layout (component placement, signal routing, trace thickness and geometry, and so on)component selection (composition, value, and tolerance), interface connections, and shielding are required for theboard design to achieve desired modem performance and to attain EMI certification.
Other aspects of proper noise-suppression engineering practices are beyond the scope of this guide. Consult noise
suppression techniques described in technical publications and journals, electronics and electrical engineering text
books, and component supplier application notes.

PC Board Layout Guideline
In a 4-layer design, provide adequate ground plane covering the entire board. In 4-layer designs, power and groundare typically on the inner layers. Ensure that all power and ground traces are 0.05 inches wide.
The recommended hole size for the device pins is 0.036 in. +/-0.003 in. in diameter. Use spacers to hold the device
vertically in place during the wave solder process.

Electromagnetic Interference
The following guidelines are offered specifically to help minimize EMI generation. Some of these guidelines are thesame as, or similar to, the general guidelines. To minimize the contribution of device-based design to EMI, youmust understand the major sources of EMI and how to reduce them to acceptable levels.
■ Keep traces carrying high frequency signals as short as possible.
■ Provide a good ground plane or grid. In some cases, a multilayer board may be required with full layers forground and power distribution.
■ Decouple power from ground with decoupling capacitors as close to the device's power pins as possible.
■ Eliminate ground loops, which are unexpected current return paths to the power source and ground.
■ Decouple the telephone line cables at the telephone line jacks. Typically, use a combination of series
inductors, common mode chokes, and shunt capacitors. Methods to decouple telephone lines are similar todecoupling power lines; however, telephone line decoupling may be more difficult and deserves additional
attention. A commonly used design aid is to place footprints for these components and populate asnecessary during performance/EMI testing and certification.
■ Decouple the power cord at the power cord interface with decoupling capacitors. Methods to decouple
power lines are similar to decoupling telephone lines.

54

MultiConnect® xDotTM MTXDOT Developer Guide

CHAPTER 12 DESIGN CONSIDERATIONS■ Locate high frequency circuits in a separate area to minimize capacitive coupling to other circuits.
■ Locate cables and connectors to avoid coupling from high frequency circuits.
■ Lay out the highest frequency signal traces next to the ground grid.
■ If using a multilayer board design, make no cuts in the ground or power planes and be sure the groundplane covers all traces.
■ Minimize the number of through-hole connections on traces carrying high frequency signals.
■ Avoid right angle turns on high frequency traces. Forty-five degree corners are good; however, radius turns
are better.
■ On 2-layer boards with no ground grid, provide a shadow ground trace on the opposite side of the board to
traces carrying high frequency signals. This will be effective as a high frequency ground return if it is threetimes the width of the signal traces.
■ Distribute high frequency signals continuously on a single trace rather than several traces radiating fromone point.

Electrostatic Discharge Control
Handle all electronic devices with precautions to avoid damage due to the static charge accumulation.
See the ANSI/ESD Association Standard (ANSI/ESD S20.20-1999) – a document “for the Development of an
Electrostatic Discharge Control for Protection of Electrical and Electronic Parts, Assemblies and Equipment.” This
document covers ESD Control Program Administrative Requirements, ESD Training, ESD Control Program Plan
Technical Requirements (grounding/bonding systems, personnel grooming, protected areas, packaging, marking,equipment, and handling), and Sensitivity Testing.
MultiTech strives to follow these recommendations. Input protection circuitry is incorporated in MultiTech devices
to minimize the effect of static buildup. Take precautions to avoid exposure to electrostatic discharge during
handling.
MultiTech uses and recommends that others use anti-static boxes that create a faraday cage (packaging designed
to exclude electromagnetic fields). MultiTech recommends that you use our packaging when returning a productand when you ship your products to your customers.

MultiConnect® xDotTM MTXDOT Developer Guide

55

CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS

Chapter 13 Mounting xDots and Programming External Targets
Mounting the Device on Your Board
A footprint diagram is included on the xDot Mechanical Diagram.

Solder Profile
Solder Paste: SAC NC 254
Note: Calculate slope over 120 seconds

56

Name

Low Limit

High Limit

Units

Max Rising Slope (Target=1.0)02

Degrees/Second

Max Falling Slope

-2

-0.1

Degrees/Second

Soak Time 150-170C

15

45

Seconds

Peak Temperature

235

250

Degrees Celsius

Total Time Above 218C

30

90

Seconds

MultiConnect® xDotTM MTXDOT Developer Guide

CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS

Setpoints (Celsius)
Zone

1

2

3

4

5

6

7

Top

130

160

170

190

230

245

255

Bottom

130

160

170

190

230

245

255

Conveyer Speed

32.0 inch/minute
Max Rising Slope Max Falling Slope Soak Time 150170C

Peak Temp

Total Time /218C

TC

Position Slope

PWI

Slope

PWI

Time

PWI

Temp

PWI

Time

PWI

1

<TC2>

1.38

38%

-0.63

45%

28.82

-8%

240.22

-30%

43.61

-55%

2

<TC3>

1.38

38%

-0.75

32%

26.75

-22%

241.21

-17%

43.66

-54%

3

<TC4>

1.38

38%

-0.70

36%

29.47

-4%

239.56

-39%

43.29

-56%

Delta

0.00

0.12

2.72

1.65

0.37

xDot Packing
xDots ship on 20 piece trays, which you can use for pick and place handling.
Warning: Maximum temperature for these trays is 65° C.

Programming External Targets
You can use the xDot developer board to program external targets. To do this:1.
2.

Connect header JP1 to your target board with a 9-position ribbon cable.1
Apply power to your target board.

MultiConnect® xDotTM MTXDOT Developer Guide

57

CHAPTER 13 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS

3.

1

When the xDot developer board detects a target voltage on Pin 1 of header JP1, it redirects the mbed
programming interface to the external target. You can use the mbed programming environment asnormal to program and debug the external target.

MultiTech recommends the Samtec FFSD-05-D-06.00-01-N ribbon cable.

JTAG/SWD Connector
The developer board uses an unshrouded 10-pin header.
Suitable connector headers include:■ Harwin: M50-3500542■ Mouser: 855-M50-3500542■ Samtec shrouded header: FTSH-105-01-F-D-K
The Samtec FTSH-105 header dimensions are 0.25"x 0.188" (6.35mm x 4.78mm).
Ensure that you connect your cable correctly, typically by matching the "1" marked on the board to the cable's red
stripe.

58

MultiConnect® xDotTM MTXDOT Developer GuideINDEX

Index
schematics
Developer Board ...................................................48
A
antenna ....................................................................23 24
developer board ......................................................26
antenna design guidelines ............................................29
assembly diagrams
Developer Board ......................................................48
AT command
port ............................................................................9Bbattery draw down .......................................................15
baud rate.......................................................................21
board components
Micro Developer Board............................................47
build options ...................................................................8C
cable
coaxial ......................................................................25
certifications .................................................................12
Chinese hazardous substances
Chinese version........................................................43
English version .........................................................42
Class B ..........................................................................37
Industry Canada .......................................................38
COM ports .......................................................................9
Conduit............................................................................6

Eelectrical characteristics................................................15
electromagnetic interference .......................................54
electrostatic discharge ..................................................55
EMI ................................................................................54
ESD ................................................................................55
EUI ...................................................................................7
external targets.............................................................57
F
FCC
grant notes...............................................................32
FCC NoticeClass B .....................................................................37
flow control...................................................................21
G
ground plane.................................................................54H
handling precautions due to ESD..................................55
hazardous substances ...................................................41
host labeling..................................................................32
I
Industry Canada
Class B .....................................................................38
interférence des radiofréquences.................................34

DJdata bits ........................................................................21
debug port ......................................................................9
design guidelines
antenna....................................................................29
devicemaintenance ............................................................35
dimensions ....................................................................11
documentation................................................................6

JTAG connector .............................................................58
K
KDB 447498 Section 8 ..................................................32
Llabeling
host ..........................................................................32

MultiConnect® xDotTM MTXDOT Developer Guide

59

INDEXlabels .............................................................................44
Linux ................................................................................9LoRarange ........................................................................21receive sensitivity..........................................................12
related products..............................................................6
ribbon cable ..................................................................57
RoHS..............................................................................41
RSMA-to-UFL cable .......................................................25

M
Mac .................................................................................9
maintenance .................................................................35
mbed ..............................................................................6
mechanical drawings.....................................................11
Micro Developer Board............................................46
MTAC-LORA.....................................................................6
MTCDT.............................................................................6
MultiConnect ..................................................................6
N
network, connecting .......................................................7
noise suppression..........................................................54
P
packing list ....................................................................45
parity .............................................................................21
PC board layout.............................................................54
pin information .............................................................17
pinout notes..................................................................21
ports ................................................................................9
power ............................................................................15
power draw
measuring ................................................................16
processor.........................................................................6
programming external targets ......................................57
R

S
safetyRF interference ........................................................34
safety standards............................................................54
serial settings ................................................................21
solder profile .................................................................56
specifications.................................................................12
static..............................................................................34
stop bits.........................................................................21
sécuritéinterférences RF.......................................................34
T
trace antenna................................................................23transmission ..................................................................12
U
U.FL antenna .................................................................23
user responsibility.........................................................35
W
Windows .........................................................................9X
xDot packing..................................................................57

radio frequency interference........................................34
range .............................................................................21

60

MultiConnect® xDotTM MTXDOT Developer Guide