TND6260/D
Rev. 3, August − 2021

Physically Based, Scalable SPICE
Modeling Methodologies forModern Power Electronic Devices© Semiconductor Components Industries, LLC, 2013

August, 2021 − Rev. 3

1

Publication Order Number:
TND6260/D

Physically Based, Scalable SPICE Modeling
Methodologies for Modern Power Electronic Devices
Abstract
Efficient power electronic design hinges on the availability of accurate and predictive SPICE
models. This paper proposes novel physical and scalable SPICE models for power electronic
semiconductors including wide−bandgap devices. The models are based on process and layout
parameters, enabling design optimization through a direct link between SPICE, physical design,and process technology. The models are used as key design components during technology
development and for the proliferation of new products.

Introduction
Modern day power electronics encompass a wide spectrum of semiconductor device types,
all of which present unique benefits and trade−offs in the design space. Such devices include
trench IGBTs, Super−Junction MOSFETs, Trench MOSFETs, GaN HEMTs, SiC MOSFETs and
SiC diodes. In order to realize all the various device benefits, efficient power module design
hinges on the availability of accurate and predictive SPICE models. In a conventional industry
reactionary modeling approach, devices are first designed and fabricated througha combination of time consuming TCAD and fabrication cycles. Once the device design isfinalized and qualified, a SPICE model is extracted to the measured characteristics andsubsequently made available for application simulation. A physical SPICE model that issensitive to process parameter and layout perturbations breaks the reactionary cycle, enabling
simulation as a key link in the device design process [1−3]. Such physical models stimulate cycle
time reduction by bridging the gaps between TCAD, circuit design, and fabrication. Circuitdesigners can evaluate technologies early in the process development stages in simulation
rather than through fabrication iterations.
Historically, power semiconductor models at the SPICE level have been based on simple
subcircuit or behavioral models. Simple subcircuit models are often too rudimentary toadequately capture all the device performances such as current−voltage, capacitance−voltage,transient, and thermal behavior. More advanced behavioral models often do not contain direct
links to the device layout and process parameters. For example, in recent models for SiC
MOSFETs reported in [4−7], simple SPICE level 1 based MOSFET models are used for thechannel and fixed linear resistors are used for the clearly nonlinear JFET like drift region. In
addition, the all important CGD capacitance is described through unphysical diode networks,
empirical fitting functions, or table models as described in [8]. The models are not process andwww.onsemi.com
2layout based nor is the scalability apparent. More physical models were reported in [9, 10].
However these models also treat the nonlinear drift region with a linear resistor and the depletion
pinching effects in the CGD are not captured. Furthermore, the model in [9] is implemented ina specific simulator language, raising questions about the portability across multiple SPICE
simulator platforms. The previous references are just for SiC MOSFET models. A similar
situation exists on all power semiconductor device types. This paper advances thestate−of−the−art through first time physical, scalable, and robust SPICE agnostic model for
multiple power semiconductor devices. SiC MOSFET and Trench IGBT models will be covered
in detail though the methods have been applied to a wide range of devices includingSuper−Junction [1], Trench MOSFET [2], and most recently GaN HEMT devices. Details
regarding robust SPICE agnostic model generation is covered in section VI.

SiC MOSFET MODEL DESCRIPTION
Figure 1 illustrates a SiC MOSFET cross section and Figure 2 displays the corresponding
SPICE sub−circuit rendition.

Figure 1. SiC MOSFET Subcircuit Model

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3Channel
The channel is described by the physically based bsim3v3 model capturing all relevant
channel physics [11]. In particular, the transitions through subthreshold, weak inversion andstrong inversion regions are captured accurately. The extracted mobility parameter U0 takes
on low ranges 10−50 cm2/(V−s) typical of SiC channels, demonstrating the applicability of themodel to SiC MOSFETs. Flexible temperature modeling is included which can be tuned to
specific SiC MOSFET behavior. Furthermore, the widely available bsim3v3 model has excellent
speed and convergence properties as compared to behavioral models.

Figure 2. SiC MOSFET Cross Section
Epi−JFETThe epi region between the pwells is captured by the standard SPICE JFET model. Previously
derived analytical models of JFET parameters [1] are modified for application to the SiC
MOSFET JFET region. Similar to the bsim3v3 model, the spice JFET model is universallyavailable, very fast and has excellent convergence properties. The JFET spice model
parameters that capture the linear and nonlinear behavior of the drift region are the current gain
factor beta and the threshold or pinch−off voltage vto. These parameters are used in the wellknown JFET current equations such as equation (1) of the triode region.
I D + b @ [2 @ (V GS * nto) * V DS] @ V DS @ (1 ) l @ V DS)(eq. 1)Analytical models of the JFET gain (beta) and pinch−off (vto) parameters for the SiC MOSFET
have been derived as functions of the physical process and layout parameters using thestandard equations for JFET depletion width. Finding the point where the depletion width equals
the half width between the pwells, the vto parameter is as follows

ǒ Ǔ

d pw
nto + f *2@a2(eq. 2)where dpw is the distance between the pwells, otherwise know as the JFET region. The built−in
potential f between the pwell and JFET with associated dopings Ppw and Njfet is given byȡNjfet @ Ppwȣf + f t @ logȧȢ n2i ȧ
Ȥwww.onsemi.com
4(eq. 3)

where ni is the intrinsic carrier concentration and ft is the thermal voltage. The depletion factor
a is given bya+Ǹ2 @ eSiC @ Ppw(eq. 4)q @ N jfet @ (N jfet ) P pw)

where q is the Coulomb charge and eSiC is the SiC permittivity.
Further derivation of the beta parameter is given byb+

2 @ H bayeff
X jpw @ ò @ (* nto)

@

ǒ

d pw
* a @ Ǹf2

Ǔ(eq. 5)where Xjpw is the junction depth of the pwell. The resistivity ρ as a function of mobility m is givenbyò+1
q @ N jfet @ m(eq. 6)Hbayeff is the effective distance between gate runners which will be derived in the scaling sectionthat follows.
The extended drift region beyond the JFET is modeled with Rdrift which is parameterizedaccording to the epi and N+ doping and cross sectional area dependent on cell pitch CP.
Body DiodeSiC MOSFETs, like other power MOSFETs, conveniently contain a built in junction diodebetween the Ppw and Nepi layers for reverse conduction. It is well known that the simple SPICE
diode model does not capture reverse recovery effects. A physical diode model with reverse
recovery was proposed in [13]. In this work, this model has been extended to include specificlayout scaling for the SiC MOSFET. This diode model presented in [14] is the basis for all
onsemi fast recovery diode models.

Figure 3. SiC MOSFET Typical Layouts

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5Capacitances
The CGD capacitance in SiC MOSFET devices is captured by a behavioral MOS−capacitor
which depends on process and layout parameters such as gate oxide thickness tox, dpw andNjfet. As the doping in the JFET region is often engineered to balance capacitance and current
nonlinear effects, the measured capacitance exhibits multiple transition regions which are
doping and geometry dependent. A base equation for the CGD MOS capacitor is given by
C GD +C ox @ C dep(eq. 7)

C ox ) C dep

where Cox is the oxide capacitance directly determined by the oxide thickness tox. Further, Cdep
is given bye(eq. 8)
C dep + SiC
W dep
where the depletion width Wdep becomes a function of doping and JFET pinch−off conditions.
The depletion region is obtained through the summation of multiple components. The first twocomponents occur pre−JFET pinch−off and vary due to the changing doping profile from thesurface into the JFET region. The first portion is given byǒ

2 @ e SiC
@ min((V DG * V FB), V surf)
W dep1 +q @ N surf

Ǔmjsurf(eq. 9)where VFB is the flatband voltage, Nsurf is the doping just below the oxide, mjsurf and mj in (10)are grading parameters close to 0.5, and Vsurf is the effective voltage when the transition occurs
in the doping profile to Njfet. The second component is given byǒ

2 @ e SiC
@ min((V DG * V FB * V surf), * nto)
W dep2 +q @ N surfǓmj(eq. 10)All min and max functions are implemented through square root limiting equations that provide
smooth transitions, necessary for data fitting and good convergence. The 3rd depletion
represents the drop of the bottom plate of the depletion region once the JFET region pinches
off. A smooth step function is implemented that introduces Wdep3 which is directly related to Xjpw
at VDS = vto. The additional Wdep post pinch−off is then controlled by the Nepi and limited by the
thickness of the epi region.
The CGS is mostly determined from the bsim3v3 channel model. In addition, a fixed capacitor
for the gate poly overlap of N+ and source metal overlap of gate poly is included in the model.
The CDS capacitance comes through the body diode junction capacitance as previously
described.

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Scaling
As the model uses lumped components, one needs to derive the effective width andmultiplicity factors from the layout parameters for the device components such as the bsim3v3,
JFET, diode, and capacitances. First the active area is calculated based on the input layout
parameters as follows
AA + (W chip * 2 @ X edge) @ (H chip * 2 @ Y edge) * GP loss * GR loss * CNR loss

(eq. 11)

where Wchip is the chip width, Hchip is the chip height, Xedge and Yedge are the dimensions fromthe chip edges to the active area. Equations for GPloss (gate pad area), GRloss (gate runnerarea), and CNRloss (corner area) are not listed here but are obvious to derive. As not all gate
fingers have the same height due to the gate pad, an effective height is derived as
H bayeff +AA[(W chip * 2 @ X edge) @ 2 @ (1 ) N grunner)](eq. 12)

where Ngrunner is the number of internal gate runners, not counting the side runners. The
multiplicity factor is given bymult +

2 @ (W chip * 2 @ X edge) @ 2 @ (1 ) N grunner)CP
where the first 2 factor accounts for the cell symmetry.

(eq. 13)

Figure 3 displays a typical layout where the non−active regions in the die edges, runners, andgate pad contain distinct parasitic capacitances and resistances. Varying degrees of the
proportionality of parasitics to the active device are clear. The model includes physical, scalable
components for every parasitic element.
Miscellaneous
The gate poly and metal runner resistances are scalable with device process and layout
parameters. The gate poly resistance is given by
H bayeff(eq. 14)
L poly @ mult @ rdist
2
where ρshpoly is the gate poly sheet resistance and rdist is a distributed fitting parameter typicallyin the range of 3. Simple SPICE tc1 and tc2 temperature parameters are supported for the gate
resistance.
R poly + ò shpoly @The model is fully electro−thermal, including ambient and self−heating for the channel and
JFET regions following [1, 12]. In addition, the diode model has been extended to include
self−heating. The device power drives into a thermal impedance network to solve for the junction
temperature Tj implicitly in SPICE. Cauer networks are implemented in order to provide physicalcascading of the system ZTH networks.
Parasitic inductances are included in the model for discrete packaged components.
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SIC MOSFET MODEL VERIFICATION
Benchmark results are presented for onsemi’s 1200 V SiC MOSFET Technology.
Current−Voltage (IV)
Multiple facets of the current−voltage relationship are investigated. All IV tests are performed
under pulsed conditions with a pulse width of 250 ms. Pulsed transient simulations are run tomimic the test conditions. The currents are sampled at the end of the pulses analogous to themeasurements. This ensures consistency between simulated and measured Tj, critical for
power semiconductor model extraction. Figure 4 shows the T = 25°C output characteristics.
Very accurate modeling of the output conductance is achievable. One can clearly see the effectsof the JFET region at high gate and drain biases where the current begins to compress. Figure 5
shows the T = 25°C transfer characteristics at VDS = 0.1 V. A very good match to the current andtransconductance through the entire VGS range is realized, including accurate modeling of thesubthreshold region previously unreported.
As the robust temperature behavior of SiC MOSFET devices is a key feature to technology
adopters, accurate modeling of the device performance over temperature is critical for circuitdesign. Figure 6 displays the output characteristics for VGS = 20 V over varying temperature.
Figure 7 displays the transfer characteristics at VDS = 0.1 V over varying temperature. The
threshold voltage at ID = 10 mA is plotted in Figure 8 over temperature. The RDSon overtemperature is plotted in Fig. 9. The temperature parameters associated with the bsim3v3 andJFET models such as KT1, UTE, UA1, AT, BTEE, and VTTC are deployed. Lastly, the body
diode current−voltage characteristics over temperature are plotted in Figures 10, 11. The overalltemperature results are a clear indication of the model’s ability to accurately capture the SiC
MOSFET temperature behavior.

Figure 4. SiC MOSFET Output
Current at T = 255C

Figure 5. SiC MOSFET Transfer
Current at VDS = 0.1 V, T = 255C

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8Figure 6. SiC MOSFET Output Current
over Temperature

Figure 7. SiC MOSFET Transfer
Current over Temperature

Figure 8. SiC MOSFET Threshold
Voltage over Temperature

Figure 9. SiC MOSFET RDSon
over Temperature

Figure 10. SiC MOSFET Body Diode
Current−voltage on Linear Scale

Figure 11. SiC MOSFET Body Diode
Current−voltage on Log Scalewww.onsemi.com
9Capacitance−Voltage (CV) and Gate Charge
Figure 12 demonstrates the model accuracy for conventional capacitances CISS, CRSS, andCOSS. The accurate match of the multiple transitioning regions in the CRSS validates the
proposed CGD model. The characteristics are shown on log−log scales in order to highlight thehighly nonlinear behaviors over multiple orders of magnitude. As a direct consequence of theaccurate capacitance simulation, reasonable gate charge results are expected as shown in
Figure 13.

Figure 12. SiC MOSFET Standard
Capacitances

Figure 13. SiC MOSFET Gate
Charge, Note the Presence of aParasitic CGS = 1 nF in Test Setup

Figure 14. Double Pulse Switching Circuit

Figure 15. SiC MOSFET Double
Pulse Switching OFF at ID = 15 A

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10Figure 16. SiC MOSFET Double Pulse
switching ON at ID = 15 A

Figure 17. SiC MOSFET Double
Pulse switching OFF at ID = 24 A

Figure 18. SiC MOSFET Double Pulse
switching ON at ID = 24 A
Double Pulse Switching and Reverse Recovery
The double pulse circuit is widely used to evaluate switching characteristics for power
semiconductors. The basic switching circuit is shown in Figure 14 where many of the parasitic
elements associated with the passives and the boards are left out for simplicity. The previously
characterized SiC MOSFET is incorporated for the high side and low side devices. Figures
15−18 demonstrate the model’s ability to accurately capture turn−on and turn−off transient
waveforms at two different current levels. The near precise prediction of the highly nonlinear
capacitances and miller effects in QG leads to reasonable prediction of the switching results withno further tuning required. SiC MOSFETs have fast switching characteristics and low switchinglosses. Mismatching in oscillations is due to inaccuracies in modeling the test circuitcomponents and their parasitics such as the load inductor, electrolytic capacitors and circuitboard routing.

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Scaling
A second device is characterized with the same chip dimensions, but with a 42% increase in
cellpitch and 12% increase in Lpoly. The base model is directly simulated with the new layout
parameters with no further tuning. Figure 19 shows the capacitance which is a key indicator ofcorrect scaling. Highly accurate results are obtained validating the scalability of the model.

Figure 19. Standard Capacitances for Device with a 42%
Increase in CP and 12% Increase in Lpoly

TRENCH IGBT MODEL DESCRIPTION
Figure 20 illustrates a trench IGBT cross section and Figure 21 displays the corresponding
SPICE subcircuit rendition. The starting point for the physical model was the work by Lauritzen
in [15] for planar IGBTs. The model contains a solid foundation for the IGBT carrier transportphysics. However, it does not contain physical equations for the trench device behavior withvarying layout and process parameters. This model was extended in this work with the following
attributes:• Development of physical/scaling equations for trench IGBT process• Replaced empirical intrinsic MOSFET model with bsim3v3 model similar to SiC MOSFET
model• Added physical/nonlinear dynamic capacitor models for trench technology including
pinching effects between the trenches• Added emitter cell and source blocking modeling for short circuit robust technologies• Added full electro−thermal effects• Implementation in SPICE through arbitrary sources• Numerically robust, good convergence/speed performancewww.onsemi.com
12Figure 20. Trench IGBT Cross Section

Figure 21. Trench IGBT Subcircuit Model
Details of the subcircuit Cgb capacitor associated with the conventional CRES are covered
here. The model uses a MOS depletion formulation similar to the SiC MOSFET, however thepinch−off voltage between the trenches follows different physics. The pinch−off voltage
equation is given by
Vp +

ǒ

Ǔ

q @ N jfet @ W mesaW@ 1 ) mesa ) V j
2
C ox 4 @ e Si

(eq. 15)

where Njfet is the doping between the trenches underneath the Pwell and Vj is the junction
potential of the anode to buffer layer determined by the layer doping concentrations.
The trench IGBT follows similar layout and gate resistance scaling as previously described
for the SiC MOSFET.

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TRENCH IGBT MODEL VERIFICATION
Benchmark results are presented for multiple generations of onsemi’s 650 V Field Stop
Trench IGBT Technology.
Current−Voltage (IV)
Multiple facets of the current−voltage relationship are investigated under pulsed transientconditions as previously described. Figure 22 displays typical output characteristics up to highpower levels to show the effects of self−heating at T = 25°C. Figure 23 shows the output current
zoomed into the VCEsat region at T = 25°C and T = 175°C. Figure 24 shows the transfer
characteristics at T = 25°C and T = 175°C. Both temperature dependent plots show the model’s
accurate prediction of thermal behavior.
Capacitance−Voltage (CV) and Gate Charge
Figure 25 demonstrates the model accuracy for conventional capacitances CIES, CRES, andCOES. The accurate match of the CRES drop voltage validates the physical model for the pinch
off voltage. Accurate gate charge simulation is expected as shown in Figure 26.
Double Pulse Switching
The same switching circuit as shown in Figure 14 is used with the MOSFETs exchanged forco−packed Trench IGBTs. Figures 27 and 28 demonstrate the model’s ability to accurately
capture turn−on and turn−off transient waveforms. The accurate simulation of the gradual rise
in VCE during the off transition is attributed to the dynamic capacitance Cgb. The accurate
modeling of the collector current IC throughout the on transition validate the accurate modelingof the reverse recovery of the co−packed diode.
Layout Scaling
In onsemi’s most recent Trench IGBT Technology FS4, a 75 A device is used to characterize
the base scalable model. The base model is directly simulated with the new layout parameters
for a 50 A device with no further tuning. Figures 29 and 30 show the current−voltage and CRES
respectively. Highly accurate results are obtained validating the scalability of the model.
Process Scaling
Due to the inherent model physics and process parameterization, key device trade−offs canbe evaluated such as the well known trade−off curve in IGBTs (EOFF vs. VCEsat). Typically power
semiconductor manufacturers provide products from multiple derivatives of one technology
generation. Often, the only difference between an IGBT derivative is the anode doping to control
the trade−off curve. The model presented here is able to accurately predict trade−off curve
performance through direct adjustment of the anode doping as shown in Figure 31. The scalable
process parameters are presented to the designer at the symbol level as shown in Figure 32
where ncolln stands for the normalized collector (or anode) doping.
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In this mode, designers can run parametric sweeps of the anode doping to understand thedesign and application sensitivities to key process parameters.

Figure 22. Trench IGBT IC vs. VC
at T = 255C

Figure 23. Trench IGBT IC vs. VC at
T= 255C and 1755C

Figure 24. Trench IGBT IC vs. VG
at T=255C and 1755C

Figure 25. Trench IGBT Standard
Capacitances

Figure 26. Trench IGBT Gate Charge

Figure 27. Trench IGBT Double
Pulse Switching OFF at IC = 20 A

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Figure 28. Trench IGBT Double Pulse
Switching ON at IC = 20 A

Figure 29. Trench IGBT IC vs. VC
Scaling

Figure 30. Trench IGBT CRES Scaling

Figure 31. EOFF vs. VCE Tradewww.onsemi.com
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ROBUST SPICE AGNOSTIC MODELING
onsemi’s models are built as physically based subcircuits. SPICE primitives are usedwhenever possible for best speed and convergence. However due to the complex physics
associated with modern power semiconductor devices, accurate and physical SPICE primitives
are largely unavailable. Once the device physics for a particular device is derived, one can use
controlled sources (typically G and E) to implement physical temperature dependent equations
for currents, charges, and capacitances.
The power semiconductor design community uses a wide range of SPICE like simulators.
Thus to minimize multiple simulator specific model support and provide consistent results
across simulators, a SPICE agnostic approach is taken. A key component is to use least
common denominator SPICE elements and syntax which is generally found in PSPICE.
Behavioral languages like Verilog−A and MAST, though very attractive for model
implementations, are avoided as they are not supported by all the common simulators.

CONCLUSION
This paper presents a novel approach to SPICE level modeling of power semiconductor
devices. Highly accurate results are achievable for current nonlinearity and temperature effects
through the subthreshold, linear and saturation regions. In addition, the all critical transfer
capacitances associated with MOSFET CRSS and IGBT CRES are captured accurately acrossthe full bias range, enabling precise simulation of typical application circuits. The introductionof scalable modeling of the device layout and process variation enables designers to unlock
previously recognized but inaccessible device optimization points. The robust models are valid
across multiple SPICE platforms such as PSpice, LTspice, Simetrix, Spectre, ADS, SABER, andSimplorer.

Figure 32. Trench IGBT PSPICE Symbol

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REFERENCES[1] J. Victory, D. Son, T. Neyer, K. Lee, E. Zhou, J. Wang, and M. B. Yazdi, “A Physically
Based Scalable SPICE Model for High−Voltage Super−Junction MOSFETs,”, 2014
PCIM Europe, pp. 956−963, May 2014.
[2] J. Victory, S. Pearson, S. Benczkowski, T. Sarkar, H. Jang, M. Yazdi, and K. Mao,
“A Physically Based Scalable SPICE Model for Shielded−Gate Trench PowerMOSFETs,”, 2016 ISPSD, pp. 219−222, June 2016.
[3] C. He, J. Victory, M. B. Yazdi, K. Lee, M. Domeij, F. Allerstam, and T. Neyer,“A Physically Based Scalable SPICE Model for Silicon Carbide Power MOSFETs,”,2017 APEC, pp. 2678−2684, March 2017.
[4] J. Wang, T. Zhao, J. Li, A. Huang, R. Callana, F. Husna, and A. Argawal,“Characterization, Modeling, and Application of 10−kV SiC MOSFET,” IEEE
Transactions on Electron Devices, vol. 55, no. 8, pp. 1798−1806, August 2009.
[5] A. Arribas, F. Shang, M. Krishnamurthy, and K. Shenai, “Simple and Accurate Circuit
Simulation Model for SiC Power MOSFETs,” IEEE Transactions on Electron Devices,
vol. 62, no. 2, pp. 449−457, Feb. 2015.
[6] A. Lakrim and D. Tahri, “The DC Behavioural Electrothermal Model of Silicon Carbide
Power MOSFETs under SPICE,” in IEEE 2015 International Conference on Industrial
Technology, 2015, pp. 2818−2823, 2015.
[7] K.Sun, H.Wu, J.Lu, Y.Xing and L.Huang, “Improved Modeling of Medium Voltage SiC
MOSFET within Wide Temperature Range,” IEEE Trans. Power Electronics, vol.29,
no.5, pp. 2229−2237, May 2014.
[8] G. Bonanza, D. Cavallaro, R. Greco, A. Raffa, and P. Veneziano, “A New Analog
Behavioral SPICE Macro Model with Thermal and Self−Heating effects for Silicon
Carbide Power MOSFETs,” in 2015 PCIM Europe, 2015, pp. 1023−1030.
[9] T. McNutt, A. Hefner, H. A. Mantooth, D. Berning, and S. Ryu, “Silicon Carbide PowerMOSFET Model and Parameter Extraction Sequence,” IEEE Transactions on PowerElectronics, vol. 22, no. 2, pp. 352−363, March 2007.
[10] M.Mudholkar, S.Ahmed, M.Ericson, S.S.Frank, C.L.Britton, and H.A.Mantooth,“Datasheet Driven Silicon Carbide Power MOSFET Model,” IEEE Trans. PowerElectronics, vol. 29, no.5, pp. 2220−2228, May 2014.
[11] BSIM3v3.2 MOSFET Model User’s Manual, http://bsim.berkeley.edu/models/bsim3[12] M. Maerz and P. Nance, “Thermal Modeling of Power−electronic Systems”, Application
Note, http://www.infineon.com/[13] P. O. Lauritzen and C. L. Ma, “A Simple Diode Model with Reverse Recovery”, IEEE
Transactions on Power Electronics, vol. 6, no. 2, pp. 188−191, April 1991.
[14] M. B. Yazdi and J. Victory, “A Scaled PIN Diode SPICE Model for Power System
Optimization,”, 2017 PCIM Europe, pp. 956−963, 2017.
[15] P. O. Lauritzen, G. K. Andersen, and M. Helsper, “A Basic IGBT Model with Easy
Parameter Extraction”, IEEE Power Electronics Specialists Conference, June 2001.

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