Version: D
Issued Date: 2023/03/15

Approval Sheet(產品承認書)產品名稱(Product)Bluetooth Low Energy Module

解決方案(Solution)

Nordic nRF5340 WLCSP Package產品型號(Model No.)MDBT53 – 1M (Chip Antenna)
MDBT53 – P1M (PCB Antenna)產品料號(Part No.)see 4.3 Order CodeWorking distance (in Meters)
Model

125 Kbps

1 Mbps

2 MbpsOperatingTemperature

MDBT53-1M

over 240

over 200

over 160-40 ~ 105℃

MDBT53-P1M

over 210

up to 180

up to 140

-40 ~ 105℃

Working range is tested in open spaceIndex1.

Overall Introduction ...................................................................................................... 4
1.1. Application ............................................................................................................ 4
1.2. Features ............................................................................................................... 5

2.

Product Dimension ....................................................................................................... 7
2.1. PCB Dimensions & Pin Indication ......................................................................... 7
2.2. Recommended Layout of Solder Pad ................................................................... 92.3. RF Layout Suggestion (aka Keep-Out Area) ...................................................... 13
2.4. Footprint & Design Guide ................................................................................... 16
2.5. Pin Assignment ................................................................................................... 17

3.

Main Chip Solution ...................................................................................................... 21

4.

Shipment Packaging Information .............................................................................. 224.1. Marking on Metal Shield ..................................................................................... 23
4.2. Packaging Info .................................................................................................... 24
4.3. Order Code ......................................................................................................... 26

5.

Specification ................................................................................................................ 27
5.1. Absolute Maximum Ratings ................................................................................ 27
5.2. Operating Conditions .......................................................................................... 28
5.3. Electrical Specifications ...................................................................................... 28
5.4. Application CPU Performance ............................................................................ 31
5.5. Network CPU Performance ................................................................................ 32
5.6. Power Management............................................................................................ 32

6.

Block Diagram ............................................................................................................. 41

7.

Antenna ........................................................................................................................ 42
7.1. MDBT53 ............................................................................................................. 42
7.2. MDBT53-P .......................................................................................................... 43

8.

Reference Circuit......................................................................................................... 44
8.1. Normal Voltage LDO and DC/DC Mode.............................................................. 45
8.2. High Voltage LDO and DC/DC Mode .................................................................. 47
8.3. USB Power LDO and DC/DC Mode ................................................................... 49
8.4. USB Disabled ..................................................................................................... 51

9.

Certification ................................................................................................................. 52
9.1. Declaration ID ..................................................................................................... 52
9.2. FCC Certificate (USA) ........................................................................................ 53

2

9.3.
9.4.
9.5.
9.6.
9.7.
9.8.
9.9.
9.10.

TELEC Certificate (Japan) .................................................................................. 54
NCC Certificate (Taiwan) .................................................................................... 55
CE (EU) & RCM (Australia & New Zealand) Test Report .................................... 57
IC Certificate (Canada) ....................................................................................... 60
SRRC Certificate (China).................................................................................... 61
KC Certificate (South Korea) .............................................................................. 62
RoHS & REACH Report ..................................................................................... 63
End-Product Label .............................................................................................. 63

10. Notes and Cautions ..................................................................................................... 65
11. Useful Links ................................................................................................................. 66
Full List of Raytac’s BLE Modules .................................................................................... 67
Release Note ....................................................................................................................... 71

3

1. Overall Introduction
Raytac’s MDBT53 & MDBT53-P is a BT 5.2 stack (Bluetooth low energy or BLE) module
designed based on Nordic nRF5340 SoC solution, which incorporates: GPIO, SPI, UART,
TWI, I2S, PDM, PWM, ADC, NFC and USB interfaces for connecting peripherals andsensors.
Features:1.

Embedded 2.4GHz transceiver supports Bluetooth 5.2 ((), IEEE 802.15.4& Zigbee) & 2.4Ghz RF & ANT+ upon customer’s preference.

2.

Compact size with (L) 14.3 x (W) 9.3 x (H) 1.85 or 1.6 mm.

3.

Low power requirements, ultra-low peak, average and idle mode power consumption.

4.

Be compatible with a large installed base of mobile phones, tablets and computers.

5.

Fully coverage of BLE software stack.

6.

BLE & RF transmission switching helps products fit all operation system and mosthardware.

1.1.

Application‧Advanced computer peripherals and I/o devices‧Multi-touch trackpad‧Advanced wearables‧Health / fitness sensor and monitor devices‧Wireless payment enabled devices.
‧Wireless audio devices‧Bluetooth Low Energy Audio‧True wireless earbuds‧Headphones, microphones and speakers‧Internet of Things (IoT)‧Smart home sensors and controllers‧Industrial IoT sensors and controllers‧Interactive entertainment devices‧Remote controls‧Gaming controllers‧Professional Lighting‧Wireless connected luminaire

4

1.2.

Features‧Supply voltage range 1.7V to 5.5V
‧1.8 V to 3.3 V regulated supply for external components‧Single 32 MHz crystal operation‧48 general purpose I/O pins
‧Operating temperature from -40 to +105°C
Network Core
‧ARM® Cortex®-M33 with TrustZone® technology‧64 MHz operation‧256 kB flash‧64 kB low leakage RAM‧Bluetooth® 5.2, IEEE 802.15.4-2006, 2.4 GHz transceiver‧-98 dBm sensitivity in 1 Mbps Bluetooth Low Energy mode‧-104 dBm sensitivity in 125 kbps Bluetooth Low Energy mode (long range)‧-101 dBm sensitivity in IEEE 802.15.4‧-20 to +3 dBm configurable TX power‧On-air compatible with nRF52, nRF51, nRF24L, and nRF24AP Series‧Supported data rates:‧Bluetooth 5.2 - 2 Mbps, 1 Mbps, 500 kbps, and 125 kbps
‧IEEE 802.15.4-2006 - 250 kbps
‧Proprietary 2.4 GHz - 2 Mbps, 1 Mbps
‧Angle of Arrival (AoA) and Angle of Departure (AoD) direction finding‧128-bit AES/ECB/CCM/AAR co-processor (on-the-fly packet encryption)‧SPI master/slave with EasyDMA‧I2C compatible two-wire master/slave with EasyDMA‧UART (CTS/RTS) with EasyDMA‧Up to 3x 32-bit timer with counter mode
‧Up to 2x real-time counter (RTC)
Application Core
‧ARM® Cortex®-M33 with TrustZone® technology‧128 MHz or 64 MHz operation‧Single-precision floating-point unit (FPU)‧Digital signal processing (DSP) instructions‧1 MB flash and 512 kB low leakage RAM

5‧ARM TrustZone CryptoCell™-312 security subsystem‧USB 2.0 full speed (12Mbps) controller‧QSPI peripheral for communicating with an external flash memory device‧Near field communication (NFC-A) tag with wake-on field‧Up to 5x SPI master/slave with EasyDMA‧Up to 4x I2C compatible two-wire master/slave with EasyDMA‧Up to 4x UART (CTS/RTS) with EasyDMA‧Audio peripherals: I2S, digital microphone interface (PDM)‧Up to 4x pulse width modulator (PWM) units with EasyDMA‧12-bit, 200 ksps ADC with EasyDMA - eight configurable channels with programmablegain‧Up to 3x 32-bit timer with counter mode
‧Up to 2x 24-bit real-time counter (RTC)‧Up to 2x Quadrature decoder (QDEC)

62. Product Dimension
2.1.

PCB Dimensions & Pin Indication‧MDBT53
PCB Size (in mm)
Min.
L
W
H

Norm

MAX.

14.3
- 0.15

9.3

+ 0.2

1.85

7

‧MDBT53-P
PCB Size (in mm)
Min.
L
W
H

Norm

MAX.

14.3
- 0.15

9.3

+ 0.2

1.6

8

2.2.

Recommended Layout of Solder Pad
Graphs are all in Top View, Unit in mm.

9

10

11

12

2.3.

RF Layout Suggestion (aka Keep-Out Area)

Make sure to keep the “No Ground Pad” as wider as you can regardless of the size of yourPCB.
No Ground Pad should be included in the corresponding position of the antenna in EACH
LAYER.
Place the module towards the edge of PCB to have better performance than placing it on thecenter.
Welcome to send us your layout in PDF for review at service@raytac.com or your contact at
Raytac with title “Layout reviewing – Raytac Model No. – YOUR company’s name”.

13

14

Examples of “NOT RECOMMENDED” layout15

If there is limited space for layout, the module can be put on the upper right corner tominimize the layout space.

2.4.

Footprint & Design Guide

Please visit “Support” page of our website to download. The package includes footprint,
2D/3D drawing, reflow graph/solder profile and recommended spec for external 32.768khz.

16

2.5.

Pin Assignment

Pin No. Name

Pin Function

Description

(1)

GND

Power

Ground

(2)

SWCLK

Debug

Serial wire debug I/O for debug and programming

(3)

P1.08

Digital I/O

General-purpose I/O

(4)

SWDIO

Debug

Serial wire debug I/O for debug and programming

P0.27

Digital I/O

General-purpose I/O

AIN6

Analog input

Analog input

nRESET

Reset

Pin RESET with internal pull-up resistor

P0.26

Digital I/O

General-purpose I/O

AIN5

Analog input

Analog input

P0.24

Digital I/O

General-purpose I/O

P0.25

Digital I/O

General-purpose I/O

AIN4

Analog input

Analog input

(10)

P1.06

Digital I/O

General-purpose I/O

(11)

P1.04

Digital I/O

General-purpose I/O

(12)

P0.21

Digital I/O

General-purpose I/O

(13)

P0.20

Digital I/O

General-purpose I/O

(14)

P0.19

Digital I/O

General-purpose I/O

P0.12

Digital I/O

General-purpose I/O

DCX

DCX for SPIM4

Dedicated pin for high-speed SPI

P0.18

Digital I/O

General-purpose I/O

CSN

CSN for QSPI

Dedicated pin for Quad SPI

P0.11

Digital I/O

General-purpose I/O

CSN

CSN for SPIM4

Dedicated pin for high-speed SPI

P0.10

Digital I/O

General-purpose I/O

MISO

MISO for SPIM4

Dedicated pin for high-speed SPI

P0.09

Digital I/O

General-purpose I/O

MOSI

MOSI for SPIM4

Dedicated pin for high-speed SPI

P0.07

Digital I/O

General-purpose I/O

AIN3

Analog input

Analog input

(5)
(6)
(7)
(8)
(9)

(15)

(16)

(17)

(18)

(19)

(20)

17

Pin No.

Name

Pin Function

Description

P0.13

Digital I/O

General-purpose I/O

IO0

IO0 for QSPI

Dedicated pin for Quad SPI

P1.05

Digital I/O

General-purpose I/O

P0.15

Digital I/O

General-purpose I/O

IO2

IO2 for QSPI

Dedicated pin for Quad SPI

(24)

GND

Power

Ground

(25)

P0.22

Digital I/O

General-purpose I/O

P0.17

Digital I/O

General-purpose I/O

SCKSCK for QSPI

Dedicated pin for Quad SPI

P0.14

Digital I/O

General-purpose I/O

IO1

IO1 for QSPI

Dedicated pin for Quad SPI

P0.16

Digital I/O

General-purpose I/O

IO3

IO3 for QSPI

Dedicated pin for Quad SPI

P0.08

Digital I/O

General-purpose I/O

SCKSCK for SPIM4

Dedicated pin for high-speed SPI

P0.03

Digital I/O

General-purpose I/O

NFC2

NFC input

NFC antenna connection

P1.03

Digital I/O

General-purpose I/O

TWI

TWI 1 Mbps

High-speed pin for 1 Mbps TWI

P0.02

Digital I/O

General-purpose I/O

NFC1

NFC input

NFC antenna connection

P1.02

Digital I/O

General-purpose I/O

TWI

TWI 1 Mbps

High-speed pin for 1 Mbps TWI

P0.00

Digital I/O

General-purpose I/O

XL1

Analog input

Connection for 32.768 kHz crystal

P0.06

Digital I/O

General-purpose I/O

AIN2

Analog input

Analog input

P0.01

Digital I/O

General-purpose I/O

XL2

Analog input

Connection for 32.768 kHz crystal

(21)
(22)
(23)

(26)

(27)

(28)

(29)

(30)

(31)

(32)

(33)

(34)

(35)

(36)

18

Pin No.

Name

Pin Function

Description

P0.04

Digital I/O

General-purpose I/O

AIN0

Analog input

Analog input

VDD

Power

Power supply

P0.05

Digital I/O

General-purpose I/O

AIN1

Analog input

Analog input

(40)

DCCH

Power

DC/DC converter output

(41)

VDDH

Power

High voltage power supply

(42)

GND

Power

Ground

(43)

P1.01

Digital I/O

General-purpose I/O

(44)

VBUS

Power

5V input for USB 3.3V regulator

(45)

P1.00

Digital I/O

General-purpose I/O

(46)

D+

Digital I/O

USB D+

(47)

P1.15

Digital I/O

General-purpose I/O

(48)

D˗̶̶̶

Digital I/O

USB D-

(49)

P1.14

Digital I/O

General-purpose I/O

(50)

DCCD

Power

DC/DC converter output

(51)

P1.13

Digital I/O

General-purpose I/O

(52)

DECD

Power

Digital regulator supply decoupling

(53)

P1.12

Digital I/O

General-purpose I/O

(54)

DCC

Power

DC/DC converter output

(55)

P1.11

Digital I/O

General-purpose I/O

(56)

P0.31

Digital I/O

General-purpose I/O

(57)

P0.30

Digital I/O

General-purpose I/O

(58)

DECR

Power

Regulator supply decoupling

(59)

P1.10

Digital I/O

General-purpose I/O

P0.28

Digital I/O

General-purpose I/O

AIN7

Analog input

Analog input

GND

Power

Ground

(37)
(38)
(39)

(60)
(61)

19

Pin No.

Name

Pin Function

Description

(62)

P0.23

Digital I/O

General-purpose I/O

(63)

P1.07

Digital I/O

General-purpose I/O

(64)

P1.09

Digital I/O

General-purpose I/O

(65)

P0.29

Digital I/O

General-purpose I/O20

3. Main Chip Solution
RF IC

Crystal Frequency

Nordic NRF5340 / WLCSP32MHZ / CL = 8pF / 20ppm

32MHz crystal is already inside the module. The module does NOT include external
capacitor for 32MHZ crystal.
Default on-chip capacitor is enabled = 12.5pF
CAPVALUE: AAAAA = 01100 / on-chip capacitor enable: B = 1

How to calculate CAPVALUE:CAPVALUE = (((1+56) x (12.5x2-14)) + ((16-8) left shift 4 digits)+32) right shift 6 digits= ((57 x 11) +128+32) right shift 6 digits= 787(DEC)right shift 6 digits= 0011 0001 0011(BIN) right shift 6 digits= 0000 1100(BIN)
Where FICR ->xosc32MTRIM.SLOPE = 1 (fixed for NRF5340)
Desired CAPACITANCE = 12.5PF
FICR->xosc32MTRIM.OFFSET = 16 (fixed for NRF5340)
8(DEC) left shift 4 digits = 1000(BIN) left shift 4 digits = 1000 0000(BIN) = 128(DEC)21

4. Shipment Packaging Information
Model

Antenna

MDBT53-1M

Chip/Ceramic

MDBT53-P1M

PCB/Printed

Photo- Unit Weight of Module:
MDBT53-1M: 0.41 g (±0.02 g) ; MDBT53-P1M: 0.38 g (±0.02 g)- Packaging Type: Tray or Tape & Reel.

Tray

Tape & Reel

MPQ
(Min. Package Q’ty)

88 pcs per tray

1,500 pcs per reel

Carton Contents(per carton)

1,760 pcs

1,500 pcs

Carton Dimension(L) x (W) x (H) cm

37 x 21 x 13

37 x 36 x 6

Gross Weightabout 2.4 kgs

about 1.9 kgs

22

4.1.

Marking on Metal ShieldLabel contexts for date code 221 and after,

For date code 209 to 221,

There is no marking on metal shield for module(s) with date code before 209.

23

4.2.

Packaging Info

4.2.1. Tray Packaging
Anti-static tray is specifically designed for mass production. It can be used directly on SMT
automatic machine.

Before July 1st, 2022

After July 1st, 2022

24

4.2.2. Reel Packaging

W
P1
E1
F
D0
P0
P2
A0
B0
K0
T

24.00 ± 0.30
16.00 ± 0.10
1.75 ± 0.10
11.50 ± 0.10
1.50 +0.1/-0
4.00 ± 0.10
2.00 ± 0.10
9.60 ± 0.10
14.60 ± 0.10
2.20 ± 0.10
0.30 ± 0.05

25

4.3.

Order CodeEach model has two options of packaging. Please use following part no. when placing order
to us.

Model

Tray

Tape & Reel

MDBT53-1M

MD-240A6-007

MD-240A6-007R

MDBT53-P1M

MD-240A6-008

MD-240A6-008R

MPQ of Reel packaging is 1,500 pcs and Tray packaging is 88 pcs.

26

5. Specification
Any technical spec shall refer to Nordic’s official documents as final reference. Contents
below are from “nRF5340 Objective Production Specification v1.3”, please click to download
full spec.

5.1.

Absolute Maximum Ratings

27

5.2.

Operating Conditions

5.3.

Electrical Specifications

5.3.1. General Radio Characteristics

28

5.3.2. Radio Current Consumption (Transmitter)

5.3.3. Radio Current Consumption (Receiver)29

5.3.4. Transmitter Specification

5.3.5. RSSI Specifications30

5.3.6. Receiver Operation

5.4.

Application CPU Performance

31

5.5.

Network CPU Performance

5.6.

Power Management

5.6.1. Sleep

32

5.6.2. Application CPU Running33

5.6.3. Network CPU Running

5.6.4. I2S Active34

5.6.5. NFCT Active

5.6.6. PDM Active35

5.6.7. PWM Active

5.6.8. QDEC Active

5.6.9. QSPI Active36

5.6.10. SAADC Active

5.6.11. Timer Running37

5.6.12. SPIM Active

5.6.13. SPIS Active

5.6.14. TWIM Active38

5.6.15. TWIS Active

5.6.16. UARTE Active39

5.6.17. USBD Active40

6. Block Diagram41

7. Antenna
7.1.

MDBT5342

7.2.

MDBT53-P

43

8. Reference Circuit
This chapter shows a different combination of reference circuits. Before getting started,
please read below notes carefully because it is applied to all the reference circuits.
⚫

32MHz crystal is already inside the module.

⚫

Module is pre-programmed with Raytac testing code. Default uses LDO mode andneeds to add external 32.768khz (X2) with internal capacitor to work.
Below is the FW setting of using external 32.768khz (X2).

SDK default setting: A = 1, 6pF internal load capacitors
You can use DC-DC mode without adding external 32.768khz, they are NOT
related events.
⚫

When using internal 32.768khz RC oscillator, please remove X2.

⚫

When NOT using NFC, please remove NFC1 / C19 / C21.

44

8.1.

Normal Voltage LDO and DC/DC Mode

Recommend using when the highest input voltage is less than 3.6V. Supply power from VDD
and connect VDD and VDDH together

8.1.1. LDO Mode45

8.1.2. DC/DC Mode

46

8.2.

High Voltage LDO and DC/DC Mode

Recommend using when the highest input voltage is equal or greater than 3.6V. Supply
power from VDDH.

8.2.1. LDO Mode47

8.2.2. DC/DC Mode

48

8.3.

USB Power LDO and DC/DC Mode

Recommend using when the device is powered by USB.

8.3.1. LDO Mode49

8.3.2. DC/DC Mode

50

8.4.

USB DisabledThis circuit only focuses on USB disabled. You can use it to go with other 6 reference
circuits. Please leave D+ & D- as NC when USB is disabled.

51

9. Certification
9.1.

Declaration ID

Profile Description

Service Description

Alert Notification Profile

Alert Notification Service
Blood Pressure Service

Blood Pressure Profile
Device Information Service
Cycling Speed & Cadence Service
Cycling Speed & Cadence Profile
Device Information Service
Glucose Service
Glucose Profile
Device Information Service
Health Thermometer Service
Health Thermometer Profile
Device Information Service
Heart Rate Service
Heart Rate Profile
Device Information Service
HID Service
HID over GATT Profile
Battery Service
Link Loss Service
Proximity Profile

Immediate Alert Service
TX Power Service
Running Speed & Cadence Service

Running Speed & Cadence Profile
Device Information Service
Time Profile

Time Profile Service

Glucose Profile (Central)
Mesh Provisioning Service
Mesh Profile
Mesh Proxy Service

52

9.2.

FCC Certificate (USA)BLE

1 Mbps & 2 Mbps

53

9.3.

TELEC Certificate (Japan)
BLE

1 Mbps & 2 Mbps

54

9.4.

NCC Certificate (Taiwan)
BLE

1 Mbps & 2 Mbps
MDBT5355

BLE

1 Mbps & 2 Mbps
MDBT53-P

56

9.5.

CE (EU) & RCM (Australia & New Zealand) Test Report
BLE

1 Mbps & 2 Mbps

57

58

59

9.6.

IC Certificate (Canada)
BLE

1 Mbps & 2 Mbps

60

9.7.

SRRC Certificate (China)
BLE

1 Mbps & 2 Mbps

61

9.8.

KC Certificate (South Korea)
BLE

1 Mbps & 2 Mbps

62

9.9.

RoHS & REACH Report

Please visit “Support” page of our website to download.

9.10. End-Product Label
It is suggested using following content adding to package or user manual or label to obey theregulation. Any rules of end-product label shall refer to each regulation for final reference.

9.10.1. FCC (USA)The FCC statement should be included in the user manual when there is no enough spaceon label. Otherwise, it should be included on the label.
“This device complies with part 15 of the FCC rules. Operation is subject to the following two
conditions. (1) This device may not cause harmful interference. (2) This device must accept
any interference received, including interference that may cause undesired operation.”
The final end product must be labeled in a visible area with the following: “Contain FCC ID:
SH6MDBT53”.

9.10.2. TELEC (Japan)
When manufacturer is placing the product on the Japanese market, the product must be
affixed with the following Specified Radio Equipment marking:63

9.10.3. NCC (Taiwan)
請依下列標籤式樣自製標籤，標貼或印鑄於器材本體明顯處，始得販賣或公開陳列。

Series標籤樣式

MDBT53 Series

MDBT53-P Series

以 MDBT53 為例，平台廠商必須於平台上標示字樣「本產品內含射頻模組：ID 編號
CCAM21Y10110T8」。
「平台」定義如下：若器材組裝本案模組，消費者仍能正常使用該器材主要功能，該器材得視為平台。若器材不組裝本案模組，消費者不能正常使用該器材主要功能，該器材不能視為平台。
該類不同廠牌型號器材組裝本案審驗模組後，須分別申請型式認證。

9.10.4. IC (Canada)
The IC statement should be included in the user manual when there is no enough space onlabel. Otherwise, it should be included on the label.
“This device complies with Industry Canada license-exempt RSS Standard(s). Operation is
subject to the following two conditions. (1) This device may not cause harmful interference.
(2) This device must accept any interference received, including interference that may cause
undesired operation.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils
radio exempts de licence.L'exploitation est autorisée aux deux conditions suivantes: (1)l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre lefonctionnement.”
The final end product must be labeled in a visible area with the following: “Contain IC ID:
8017A-MDBT53”.

64

10. Notes and Cautions
Module is not designed to last for a lifetime. Like general products, it is expected to be wornout after continuous usage through the years. To assure that product will perform better andlast longer, please make sure you:⚫

Follow the guidelines of this document while designing circuit/end-product. Any
discrepancy of core Bluetooth technology and technical specification of IC should referto definition of Bluetooth Organization and Nordic Semiconductor as final reference.

⚫

Do not supply voltage that is not within range of specification.

⚫

Eliminate static electricity at any cost when working with the module as it may cause
damage. It is highly recommended adding anti-ESD components to circuit design toprevent damage from real-life ESD events. Anti-ESD methods can be also applied inmechanical design.

⚫

Do not expose modules under direct sunlight for long duration. Modules should be kept
away from humid and salty air conditions, and any corrosive gasses or substances.
Store it within -40℃ to +125℃ before and after installation.

⚫

Avoid any physical shock, intense stress to the module or its surface.

⚫

Do not wash the module. No-Clean Paste is used in production. Washing it will oxidize
the metal shield and have chemistry reaction with No-Clean Paste. Functions of themodule are not guaranteed if it has been washed.

The module is not suitable for life support device or system and not allowed to be used in
destructive device or systems in any direct or indirect ways. The customer agrees toindemnify Raytac for any losses when applying modules in applications such as the ones
described above.

65

11. Useful Links⚫

Nordic Infocenter: https://infocenter.nordicsemi.com/index.jsp
All the necessary technical files and software development kits of Nordic’s chip are on
this website.

⚫

Nordic DevZone: https://devzone.nordicsemi.com/questions/
A highly recommended website for firmware developer. Interact, discuss and consult
with other fellow developers and Nordic’s employees to get answers to your questions.
The site also includes tutorials in detail to help you get started.

⚫

Official Page of nRF5340 : https://www.nordicsemi.com/Products/nRF5340
A brief introduction to nRF5340 and download links for Nordic’s developing software and
SoftDevices.

66

Full List of Raytac’s BLE Modules⚫ MDBT40 Series
SeriesNordicSolution

MDBT40nRF51822

Raytac No.

IC
Ver.

Antenna3

Chip
Antenna

MDBT40-256V3
MDBT40-256RV3

MDBT40-P256V3
MDBT40-P

nRF51822

3
MDBT40-P256RV3

PCB
AntennaRAM

Flash
Memory

16 kb

256 K

32 kb

256 K

16 kb

256 K

32 kb

256 K

RAM

Flash
Memory

64 kb

512 K

24 kb

192 K

64 kb

512 K

24 kb

192 K

64 kb

512 K

⚫ MDBT42Q Series (QFN Package IC)
Series

MDBT42Q

MDBT42Q-P

MDBT42Q-U

NordicSolution

Raytac No.

IC
Ver.

nRF52832

MDBT42Q-512KV2

2

nRF52810

MDBT42Q-192KV2

2

nRF52811

MDBT42Q-192KL

1

nRF52832

MDBT42Q-P512KV2

2

nRF52810

MDBT42Q-P192KV2

2

nRF52811

MDBT42Q-P192KL

1

nRF52832

MDBT42Q-U512KV2

2

Antenna

Chip
Antenna

PCB
Antennau.FL
Connector

67⚫ MDBT42 Series (WLCSP Package IC)
SeriesNordicSolution

MDBT42

Raytac No.

IC
Ver.

AntennaRAM

Flash
Memory2

Chip
Antenna
PCB
Antenna

64 kb

512 K

IC
Ver.

AntennaRAM

Flash
Memory2

Chip
Antenna
PCB
Antenna

64 kb

512 K

MDBT42-512KV2
nRF52832

MDBT42-P

MDBT42-P512KV2⚫ MDBT42V Series (WLCSP Package IC)
SeriesNordicSolution

MDBT42V

Raytac No.
MDBT42V-512KV2

nRF52832
MDBT42V-P

MDBT42V-P512KV2⚫ MDBT42T Series (WLCSP Package IC)
SeriesNordicSolution

MDBT42T

Raytac No.

IC
Ver.

AntennaRAM

Flash
Memory1

Chip
Antenna
PCB
Antenna

24 kb

192 K

IC
Ver.

AntennaRAM

Flash
Memory1

Chip
Antenna
PCB
Antenna

24 kb

192 K

MDBT42T-192K
nRF52805

MDBT42T-P

MDBT42T-P192K⚫ MDBT42TV Series (WLCSP Package IC)
SeriesNordicSolution

MDBT42TV

Raytac No.
MDBT42TV-192K

nRF52805
MDBT42TV-P

MDBT42TV-P192K

68

⚫ MDBT50Q Series (aQFN Package IC)
SeriesNordicSolution

Raytac No.

IC
Ver.

nRF52840

MDBT50Q-1MV2

2

nRF52833

MDBT50Q-512K

1

nRF52840

MDBT50Q-P1MV2

2

nRF52833

MDBT50Q-P512K

1

nRF52840

MDBT50Q-U1MV2

2

nRF52833

MDBT50Q-U512K

1

nRF52840

MDBT50Q-RX

MDBT50Q

MDBT50Q-P

MDBT50Q-U

Dongle

1, 2

RAM

Flash
Memory256 kb

1 MB

128 kb512 kb256 kb

1 MB

128 kb512 kb256 kb

1 MB

128 kb512 kbPCB
Antenna

256 kb

1 MB

AntennaRAM

Flash
Memory32 kb

256 kb128 kb512 kb

32 kb

256 kb128 kb512 kbAntenna
Chip
Antenna

PCB
Antennau.FL
Connector⚫ MDBT50 Series (QFN Package IC)
SeriesNordicSolution

Raytac No.

IC
Ver.

nRF52820

MDBT50-256R

1

nRF52833

MDBT50-512K

1

nRF52820

MDBT50-P256R

1

nRF52833

MDBT50-P512K

1

MDBT50

MDBT50-P

Chip
Antenna

PCB
Antenna69

⚫ MDBT53 Series (WLCSP Package IC)
SeriesNordicSolution

Raytac No.

IC
Ver.

AntennaRAM

Flash
MemoryMDBT53

nRF5340

MDBT53-1M

1Chip
Antenna

512 kb

1 MB

MDBT53-P

nRF5340

MDBT53-P1M

1PCB
Antenna

512 kb

1 MB

MDBT53-U

nRF5340

MDBT53-U1M

1

u.FL
Connector

512 kb

1 MB⚫ MDBT53V Series (WLCSP Package IC)
SeriesNordicSolution

Raytac No.

IC
Ver.

AntennaRAM

Flash
MemoryMDBT53VnRF5340

MDBT53V-1M

1

Chip
Antenna

512 kb

1 MB

MDBT53V-P

nRF5340

MDBT53V-P1M

1PCB
Antenna

512 kb

1 MB

70

Release Note⚫

2021/02/14

Version A: 1st release.

⚫

2021/02/23

Version B:(1) Added SRRC certificate in Chapter 9: Certification.
⚫

2022/07/01

Version C:(1) Updated module photo in Chapter 4: Shipment Packaging Info.
(2) Updated image on metal shield in Chapter 4.1(3) Updated Chapter 4: 4.2.1 Tray Packaging.
(4) Updated List of Raytac’s Model no.
(5) Updated Chapter 5: Specification corresponding to Nordic’s new nRF5340 Objective
Production Specification v1.2.
⚫

2023/03/15

Version D:(1) Added packaging info and order code in Chapter 4.
(2) Updated Chapter 5: Specification corresponding to Nordic’s new nRF5340 Objective
Production Specification v1.3.

71