Introduction of PARTICLE GETTER

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Introduction of PARTICLE GETTERIndex
Company Proﬁle ................................................................................................................1

Using the PG: How to choose the optimal PG? ............................................ 16

Company Information....................................................................................................2

Major industries using PG, and examples of target materials.............. 17

What is Particle Getter? ..................................................................................................3

Customer feedback....................................................................................................... 18

Eﬀects of PG.........................................................................................................................4

PG process steps............................................................................................................. 19

Characteristics of PG: Anchoring eﬀects .............................................................5

Particle Getter process steps and logistics ﬂow............................................. 20

Characteristics of PG: Mitigation of the adsorbed ﬁlm stress（1） .....6

Eﬀects of PG on the ITO ﬁlm formation.............................................................. 21

Characteristics of PG: Mitigation of the adsorbed ﬁlm stress (2)...........7

Part after installing PG ................................................................................................ 22

Comparison of PG and AL spray (1) .......................................................................8

Part after ﬁlm formation (ITO, MO)........................................................................ 23

Comparison of PG and AL spray (2) .......................................................................9
Example of the usage of PG: Bending ............................................................... 10
Example of the usage of PG: Wire clamping.................................................. 11
Example of the usage of PG: Screw clamping .............................................. 12
Example of the usage of PG: PG die cutting .................................................. 13
Example of the usage of PG: .................................................................................. 14

PARTICLE GETTER
Introduction of PARTICLE GETTER

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Company Information
Introduction of PARTICLE GETTER

Company nameSunric Co,.Ltd.

Representative

Takashi Yoshioka (President)

Capital20 million yen

Established on

November 18, 1968

Founded inMay 1942

Location

Head Oﬃce/Plant

2-13-45 Fukuura, Kanazawa-ku, Yokohama, Kanagawa 236-0004
Tel : 045-522-8988 ｜ Fax : 045-522-8992

Certiﬁed No. JQA-QM4321

Certiﬁed No. JQA-EM5723

Obtained February 2000

Obtained March 2007
Introduction of PARTICLE GETTER｜1

Line of business
Introduction of PARTICLE GETTER

Vacuum evaporation parts for equipment■Laser disk manufacturing equipment■ Reﬂector manufacturing equipment■TIN(thin ﬁlm) carbide tool manufacturing equipment■Lens manufacturing equipment■Other equipments■Crystal oscillator manufacturing equipment■MOCVD equipment (including LED)

■Cluster ion beam equipment

Semiconductor equipment parts for equipment■Ion implanation equipment■Sputtering equipment■MBE equipment■Other equipments

Vacuum high-temperature heat-treated parts for equipment■HIP furnace■Other furnaces■Vacuum brazing furnace■Vacuum ceramic baking furnace ■Tantalium capacitor baking furnace■Sapphire growth furnace■Vacuum brazing furnace■Other furnaces

Special machined parts for equipment■Ion implantation equipment■HIP furnace■Vacuum ceramic baking furnace※Sunric manufactures precision parts for various types of equipment and facillities using hard metals diﬃcult to proces that have been drawn or otherwise processed.

Sputtering targets / shields■LCD display manufacturing equipment■Semiconductor manufacturing equipment■Compact disk manufacturing equipment■Solar panel manufacturing equipment■Magneto-optical disk manufacturing equipment

Sale of materials [bas, plates, blocks and wires]Tungsten

Molybdenum

Tntalum

Titanium

NickelStainless steel

ChromiumInconel

High purity aluminum

Copper

Niobium

Introduction of PARTICLE GETTER｜2What is Particle Getter?
Introduction of PARTICLE GETTER

Schematic Diagram of the Equipment

Particle Getter (PG) is a copper ﬁlm, whose surface is specially processed, to be used as an alternative to AL spray inconventional spraying process.

ShieldMask

Target

The following eﬀects have been demonstrated by putting the PG on the surfaceof the parts inside the equipment used for ﬁlm formation.
Particle

1.

Particle control (Adsorption of the particles by special surface processing)2.

Controlling of the detachment of the ﬁlms from the surface of the parts inside
the equipment (reducing the residual stress of the attached ﬁlms by embossment)

Material:

Substrate

Copper ﬁlm (99.9% or more)Na ≦ 0.1ppm, K ≦ 0.1ppm, U ≦ 0.001ppm, Th ≦ 0.001ppm

Surface processing:

ﬂat, embossment

Thickness:

210μm、140μm、70μm

AIR

PG

Particle

VacuumTargetPlasma heat source

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Eﬀects of PG
Introduction of PARTICLE GETTER

Target life
Without PG

Parts replacement

PG installed

Downtime

Number ofparticles

Target exchange

Reducing the detachment ofthe adsorbed ﬁlm from the part surface

Reducing the frequency of replacement ofthe parts because of reduced particles

Reducing the wear of the parts, because ﬁlm
removal with chemicals is not performed

Present condition of the particle during spattering

Improving the yields

Longer life of the parts

Reducing the downtime of the equipment

Increasing the rate of precious metal recovery

Reducing the costs

Stabilizing the production schedule, etc.

Introduction of PARTICLE GETTER｜4Characteristics of PG: Anchoring Eﬀects
Introduction of PARTICLE GETTER

Schematic diagram ofthe eﬀects of anchoring

Adsorbed ﬁlm
PG

ITO ﬁlm

PG

Strong adhesion onthe PG/adsorbed ﬁlm interface

Unique surface condition
after PG/adsorption (SEM)

Cross-section view of PG/adsorbed ﬁlm
Introduction of PARTICLE GETTER｜5Characteristics of PG:
Mitigation of the adsorbed ﬁlm stress (1)Introduction of PARTICLE GETTER

When the adsorbed ﬁlm becomes thicker, the PG gets deformed between
welding points, and thus, the stress in the adsorbed ﬁlm is mitigated.
Adsorbed ﬁlm
PG sheet
AL、SUS baseWelding point

The PG and the part are joined only at the welding points.
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6

Characteristics of PG:
Mitigation of the adsorbed ﬁlm stress (2)Introduction of PARTICLE GETTER

PG installed:
before forming the ﬁlm

PG installed:
after forming the ﬁlm

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7

Comparison of PG and AL spray (1)Introduction of PARTICLE GETTER

Accumulated energy (kWh)Target life (kWh)Particles（0.3μm>d）100500350

AL Spray

AL spray

PG

350300500

7009001100

Particle Getter

Data from MRC Eclipse, Ti/TiN process（ ＞ 0.3μ）

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Comparison of PG and AL spray (2)Introduction of PARTICLE GETTER

SEM

adsorbed ﬁlm: W-Ti

W-Ti ﬁlm
W-Ti ﬁlm
AI spray
PG

SUS

AL SprayParticle Getter

Surface of the sprayed aluminum part

Surface of the aluminum part after PG processing

Introduction of PARTICLE GETTER｜9Example of the usage of PG: Bending
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Example of the usage of PG: Wire clamping
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Example of the usage of PG: Screw clamping
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Example of the usage of PG: PG die cutting
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13

Example of the usage of PG
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Example of the usage of PG
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Using the PG: How to choose the optimal PG?
Introduction of PARTICLE GETTER

Points to be taken into consideration
while choosing PG
Material to adsorb

With or without clearance

Thickness of the adsorbed ﬁlm

It is necessary to choose the optimal type after actually installing。
it.

70 μ embossed PG
0.22 mm

140 μ softening, embossed PG
0.57 mm

210 μ ﬂat PG
0.22 mm

210 μ embossed PG
0.85 mm

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Major industries using PG, and examples of target materials
Introduction of PARTICLE GETTER

Precious metal

Semiconductor

Liquid crystal

HDD

Oxide

Target material

Crystal resonator

Ag

SiO2

Ru

SiO

Au

ITOCoCrPtTaBr

Tio

Pt

TiO2

Cr

Tantalum
pentoxide

DLC

MgF2

W-Ti
TiMoMoSi

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Customer feedback
Introduction of PARTICLE GETTER

Merit of PG(examples)"Yield rate of semiconductor products improved.""PG reforms better than previous situation that much dusts in bias sputtering prevents process.""Parts life extends because blast processing to shield decreases.""Retrieval rate of rare metal was improved as new merit."

Examples of PG
installed equipment

Maker / Model name

Model number

UNVAC / Ceraus

4500

4800

9000

Anelva / ILC

10511060ーVarian31803290

ーApplied Materials / ENDUR

5500
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PG process steps
Introduction of PARTICLE GETTER

1. PG detachment
2. Blast treatment
3. Cleaning (purewater cleaning)
4. Drying
5. PG installation
6. Vacuum packing
7. Shipping
8. Delivery
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Particle Getter process steps and logistics ﬂow
Introduction of PARTICLE GETTER

When the PG is installed at Sunric
Detachment

BlastPurewater
Celaning

Vacuumpacking

Installation

DryingSunricParts
Customer

When the PG installed by customer
PartsCustomer

DryingPG
adsorption
Cleaning

Using of parts
SunricPG
detachment

PG cutting

Vacuumpacking

Introduction of PARTICLE GETTER｜20

Eﬀects of the PG on the ITO ﬁlm formation
Introduction of PARTICLE GETTER

Surface after sputtering is competed

Erosion surface

Without PG

PG installed

Signiﬁcant reduction of nodule identiﬁed by the use of PG

Target : ITO UHD-X gradePower density : 1.0W / cm2

Reduced particles in the ﬁlm formation due to PG

Total Power Supply : 40whr / cm2
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Part after installing the PG
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Part after ﬁlm formation (ITO, MO)
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ITO

MO

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