MultiConnect® mDotTM
MTDOT Developer GuideMULTICONNECT MDOT DEVELOPER GUIDE

MultiConnect mDot Developer Guide
Models: MTDOT-915-xxx, MTDOT-868-xxx includes also the MTUDK2-ST-MDOT Developer Kit
Part Number: S000612, Version 3.0

Copyright
This publication may not be reproduced, in whole or in part, without the specific and express prior written permission signed by an executive officer ofMulti-Tech Systems, Inc. All rights reserved. Copyright © 2016 by Multi-Tech Systems, Inc.
Multi-Tech Systems, Inc. makes no representations or warranties, whether express, implied or by estoppels, with respect to the content, information,material and recommendations herein and specifically disclaims any implied warranties of merchantability, fitness for any particular purpose and noninfringement.
Multi-Tech Systems, Inc. reserves the right to revise this publication and to make changes from time to time in the content hereof without obligation ofMulti-Tech Systems, Inc. to notify any person or organization of such revisions or changes.

Trademarks and Registered Trademarks
MultiTech, and the MultiTech logo, and MultiConnect are registered trademarks and mDot and Conduit are trademarks of Multi-Tech Systems, Inc. All otherproducts and technologies are the trademarks or registered trademarks of their respective holders.

Legal Notices
The MultiTech products are not designed, manufactured or intended for use, and should not be used, or sold or re-sold for use, in connection withapplications requiring fail-safe performance or in applications where the failure of the products would reasonably be expected to result in personal injury or
death, significant property damage, or serious physical or environmental damage. Examples of such use include life support machines or other life
preserving medical devices or systems, air traffic control or aircraft navigation or communications systems, control equipment for nuclear facilities, or
missile, nuclear, biological or chemical weapons or other military applications (“Restricted Applications”). Use of the products in such Restricted
Applications is at the user’s sole risk and liability.
MULTITECH DOES NOT WARRANT THAT THE TRANSMISSION OF DATA BY A PRODUCT OVER A CELLULAR COMMUNICATIONS NETWORK WILL BE
UNINTERRUPTED, TIMELY, SECURE OR ERROR FREE, NOR DOES MULTITECH WARRANT ANY CONNECTION OR ACCESSIBILITY TO ANY CELLULAR
COMMUNICATIONS NETWORK. MULTITECH WILL HAVE NO LIABILITY FOR ANY LOSSES, DAMAGES, OBLIGATIONS, PENALTIES, DEFICIENCIES, LIABILITIES,COSTS OR EXPENSES (INCLUDING WITHOUT LIMITATION REASONABLE ATTORNEYS FEES) RELATED TO TEMPORARY INABILITY TO ACCESS A CELLULAR
COMMUNICATIONS NETWORK USING THE PRODUCTS.
The MultiTech products and the final application of the MultiTech products should be thoroughly tested to ensure the functionality of the MultiTech
products as used in the final application. The designer, manufacturer and reseller has the sole responsibility of ensuring that any end user product into
which the MultiTech product is integrated operates as intended and meets its requirements or the requirements of its direct or indirect customers.
MultiTech has no responsibility whatsoever for the integration, configuration, testing, validation, verification, installation, upgrade, support or maintenanceof such end user product, or for any liabilities, damages, costs or expenses associated therewith, except to the extent agreed upon in a signed written
document. To the extent MultiTech provides any comments or suggested changes related to the application of its products, such comments or suggestedchanges is performed only as a courtesy and without any representation or warranty whatsoever.

Contacting MultiTech
Knowledge Base
The Knowledge Base provides immediate access to support information and resolutions for all MultiTech products. Visit http://www.multitech.com/kb.go.

Support Portal
To create an account and submit a support case directly to our technical support team, visit: https://support.multitech.com.

SupportBusiness Hours: M-F, 8am to 5pm CT
Country

By Email

By Phone

Europe, Middle East, Africa:

support@multitech.co.uk+(44) 118 959 7774

U.S., Canada, all others:

support@multitech.com(800) 972-2439 or (763) 717-5863

Warranty
To read the warranty statement for your product, visit www.multitech.com/warranty.go. For other warranty options, visit www.multitech.com/es.go.

World Headquarters
Multi-Tech Systems, Inc.
2205 Woodale Drive, Mounds View, MN 55112
Phone: (800) 328-9717 or (763) 785-3500
Fax (763) 785-9874

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CONTENTS

Contents
Chapter 1 Product Overview .................................................................................................................................... 7
Overview ....................................................................................................................................................................... 7
What's New in Firmware Version 2.0 ........................................................................................................................... 7
LoRaWan 1.0.1 Enhancement..................................................................................................................................... 7
AU915 Support............................................................................................................................................................ 7
Class C ......................................................................................................................................................................... 7
AT Commands Added or Changed in Version 2.0....................................................................................................... 8
Maintenance Release 1.0.8-1........................................................................................................................................ 8
What's New in Firmware Version 1.0 ........................................................................................................................... 8
About Adaptive Data Rate .......................................................................................................................................... 8Peer to Peer Communication...................................................................................................................................... 9
EU 868 Test Mode....................................................................................................................................................... 9
Sleep Mode Enhancements ...................................................................................................................................... 10
Preserve Session ....................................................................................................................................................... 10
AT Commands Added or Changed in Version 1.0..................................................................................................... 10
Getting Started............................................................................................................................................................ 11
Documentation Overview ........................................................................................................................................... 12
Related Documentation ............................................................................................................................................ 12
mbed Documentation ................................................................................................................................................. 12
Programming the mDot Microcontroller .................................................................................................................. 12
General mBed Links .................................................................................................................................................. 13
mDot Platform ......................................................................................................................................................... 13
xDot Platform ........................................................................................................................................................... 13
EUI and Networking ................................................................................................................................................... 14
Product Build Options ................................................................................................................................................. 14
Chapter 2 Mechanical Drawings with Pinouts ........................................................................................................ 15
MTDOT-xxx-X1P-SMA.................................................................................................................................................. 15
MTDOT-xxx-X1P-U.FL .................................................................................................................................................. 16
MTDOT-xxx-X1-SMA.................................................................................................................................................... 17
MTDOT-xxx-X1-UFL ..................................................................................................................................................... 18
MTDOT-xxx-M1-UFL.................................................................................................................................................... 19
MTDOT-xxx-M1-TRC.................................................................................................................................................... 20
Chapter 3 Specifications and Pin Information ........................................................................................................ 21
MTDOT Specifications ................................................................................................................................................. 21
Power Draw................................................................................................................................................................. 24
Electrical Characteristics ............................................................................................................................................. 25
Pin Information .......................................................................................................................................................... 25

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SPI Flash .................................................................................................................................................................... 26
LoRa........................................................................................................................................................................... 26
mDot Pinout Design Notes.......................................................................................................................................... 28
Serial Pinout Notes.................................................................................................................................................... 28
Serial Settings.............................................................................................................................................................. 28
LoRa ............................................................................................................................................................................ 28
Throughput Rates...................................................................................................................................................... 28
Range ........................................................................................................................................................................ 29
Chapter 4 Antennas ............................................................................................................................................... 30
Antenna System ......................................................................................................................................................... 30
U.FL and Trace Antenna Options ............................................................................................................................... 30
Pulse Electronics Antenna........................................................................................................................................... 30
Antenna Specifications ............................................................................................................................................. 30
OEM Integration ......................................................................................................................................................... 31
FCC & IC Information to Consumers ......................................................................................................................... 31
FCC Grant Notes........................................................................................................................................................ 31
Host Labeling............................................................................................................................................................. 31
Chapter 5 Safety Information................................................................................................................................. 32
Handling Precautions .................................................................................................................................................. 32
Radio Frequency (RF) Safety ....................................................................................................................................... 32
Sécurité relative aux appareils à radiofréquence (RF).............................................................................................. 32
Interference with Pacemakers and Other Medical Devices ...................................................................................... 33
Potential interference ............................................................................................................................................... 33
Precautions for pacemaker wearers ........................................................................................................................ 33
Device Maintenance ................................................................................................................................................... 33
User Responsibility...................................................................................................................................................... 33
Chapter 6 Regulatory Information ......................................................................................................................... 34
EMC, Safety, and R&TTE Directive Compliance ......................................................................................................... 34
47 CFR Part 15 Regulation Class B Devices ................................................................................................................. 34
FCC Interference Notice ............................................................................................................................................. 34
FCC Grant .................................................................................................................................................................... 35
FCC Part 15................................................................................................................................................................ 35
FCC Notice ................................................................................................................................................................... 35
Industry Canada Class B Notice................................................................................................................................... 35
Industry Canada ......................................................................................................................................................... 36
Chapter 7 Environmental Notices........................................................................................................................... 37
Waste Electrical and Electronic Equipment Statement .............................................................................................. 37
WEEE Directive.......................................................................................................................................................... 37
Instructions for Disposal of WEEE by Users in the European Union ........................................................................ 37
REACH Statement ....................................................................................................................................................... 38
Registration of Substances........................................................................................................................................ 38
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Substances of Very High Concern (SVHC) ................................................................................................................ 38
Restriction of the Use of Hazardous Substances (RoHS) ............................................................................................ 39
Information on HS/TS Substances According to Chinese Standards ......................................................................... 40
Information on HS/TS Substances According to Chinese Standards (in Chinese) ...................................................... 41
Chapter 8 Labels .................................................................................................................................................... 42
Approvals and Certification......................................................................................................................................... 42
Example Labels............................................................................................................................................................ 42
Chapter 9 Developer Kit Overview ......................................................................................................................... 43
Developer Board Overview ......................................................................................................................................... 43
Developer Board Features ........................................................................................................................................ 43
MTUDK2-ST-MDOT Developer Kit Contents .............................................................................................................. 43
MTUDK2-ST-CELL Developer Kit Contents ................................................................................................................. 43
Chapter 10 Board Components .............................................................................................................................. 45
Developer Board ........................................................................................................................................................ 45
Developer Board Connectors ...................................................................................................................................... 47
Board Components ..................................................................................................................................................... 47
LED Indicators ............................................................................................................................................................. 48
Chapter 11 Developer Board Installation ............................................................................................................... 49
Installing an mDot on the Developer Board ............................................................................................................... 49
Arduino Shield............................................................................................................................................................. 50
mDot Arduino Pins.................................................................................................................................................... 50
Installing an Arduino Shield with an mDot ............................................................................................................... 50
RSMA to U.FL Cables................................................................................................................................................... 51
Connecting an Antenna through the Developer Board Connectors........................................................................... 51
Chapter 12 Developer Board Schematics................................................................................................................ 52
Block Diagram ............................................................................................................................................................. 52
Schematics .................................................................................................................................................................. 53
Chapter 13 Micro Developer Kit ............................................................................................................................. 58
Micro Developer Kit ................................................................................................................................................... 58
Developer Kit Package Contents............................................................................................................................... 58
Firmware Updates..................................................................................................................................................... 58
Micro DK Mechanical Drawings .................................................................................................................................. 59
Micro Developer Board Components ......................................................................................................................... 60
Installing an mDot on a Micro Developer Board ........................................................................................................ 60
Assembly Diagrams and Schematics ........................................................................................................................... 61
Assembly Diagrams ................................................................................................................................................... 61
Schematics ................................................................................................................................................................ 62
Chapter 14 Design Considerations.......................................................................................................................... 67
Noise Suppression Design ........................................................................................................................................... 67
PC Board Layout Guideline ......................................................................................................................................... 67

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Electromagnetic Interference .................................................................................................................................... 67
Electrostatic Discharge Control................................................................................................................................... 68
USB Design ................................................................................................................................................................. 68
Index...................................................................................................................................................................... 69

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Chapter 1 Product Overview
Overview
The MultiConnect mDot is a programmable, long-range RF module that provides encrypted data connectivity tosensors, industrial equipment, and remote appliances. By using LoRa™ Long Range Spread Spectrum technology, bidirectional data communication can be maintained for distances up to 5 miles/8 km line of sight, deep into
buildings, or within noisy environments* using the unlicensed ISM bands in North America, Europe and worldwide.
mDot simplifies local connectivity for Internet of Things (IoT) applications.
The mDot features an integrated ARM® Cortex®-M4 processor and mbedTM compatible software library fordevelopers to control, monitor and bring edge intelligence to their Internet of Things (IoT) applications.
*

Actual distance depends on conditions, configuration, antennas, desired throughput, and usage frequency. In
dense urban environments, a typical range is 1-2 miles.

What's New in Firmware Version 2.0
The new release includes the following changes:■ LoRaWAN 1.01 Enhancements■ AU915 Support■ Class C■ US915 Test Mode

LoRaWan 1.0.1 Enhancement
Join Backoff updated to use the RTC clock to track time since the last join failure.

AU915 Support
AU915 support in this release as defined in LoRaWAN 1.01.

Class C
Allows the device to receive downlink packets from the network server without issuing an uplink first. Before thedevice can receive packets, it must first join the network via OTA or ABP. The device then listens for packets whenidle, which leads to higher current consumption.

Configuration
Join via OTA or ABP as normal.
AT+DC=C
AT&W
AT+SD
Soon after being schedule to the network server, the device receives packets. If the network server requests an
ACK, the device automatically sends an empty packet, only when the device is in serial data mode.

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Network Server Configuration
After a device has joined via OTA or ABP, you can change from the default Class A setting. In the case of ABP join,
the class can be set when you add the device.
lora-query -u <NODE-ADDR> class C

AT Commands Added or Changed in Version 2.0
The following AT Commands were added or modified in this release. Refer to the Dot Series AT Command
Reference for details
CommandFunction

AT+TXCH

Change, datarate range and current channel mask enabled settings are now
shown in channel output.

AT+DC

Change. Class C allowed.

AT+SD

Change, if RX packet requires ACK or data pending bit is set, an empty
packet is sent automatically.

AT+CHM

New, enables channel mask.

AT+MAC

New, injects MAC command.

Maintenance Release 1.0.8-1
Firmware release 1.0.8-1 addresses power consumption in sleep mode. For power draw changes, refer to notes
and measurements in Power Measurements.

What's New in Firmware Version 1.0
The release includes the following changes:■ Separate AT Command Reference Guide document, with expanded details.
■ Enhanced support of LoRaWAN 1.0 and 1.0.1 specification.
■ Adaptive Data Rate
■ Peer to Peer
■ EU868 Test Mode
■ Enhanced sleep mode
■ Preserve session

About Adaptive Data Rate
LoRaWAN provides MAC Commands, LinkADRReq and LinkADRAns to support Adaptive Data Rate (ADR).
ADR allows the network server to change a device’s data rate, Tx power, and repetition settings. If ADR is enabled,
the network server samples the SNR from each packet and computes a possible data rate based on that sample.
The possible data rate for a number of packets is held until the packet threshold is met. Once the threshold is met,a LinkADRAns MAC command is sent to request that the device change data rate.

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For the ADR to judge the SNR correctly, set Tx power to maximum. Greater power savings are achieved throughHighest Power/Highest Data Rate than with Lowest Power/Lowest Data Rate. Each step in spreading
factor/bandwidth (SD/BW) gives about 3 dB increase in link budget.
Once the highest data rate is assigned, the network server looks at adjusting Tx power. If the SNR ratio for the last
several packets is 3 dB above the highest data rate threshold, power is lowered.
Related commands
AT+ADR – Enables adaptive data rate
AT+SDR - Shows the current data rate

Peer to Peer Communication
Peer to Peer mode allows mDots to communicate without a network server. Two mDots can be configured withidentical network addresses and session keys and default to receive mode. In peer to peer mode, both mDots arein listen mode when not transmitting and, if acknowledgments are enabled, every data packet is acknowledged
immediately.
Note: In peer to peer mode, mDots only communicate with each other; mDots cannot make both peer to peer
and network connections in the same session.
To use this feature, the following settings must match on each mDot.
Item

Command

Configuration

Network Address

AT+NA<NET-ADDR>

Network Join Mode

AT+NJM

3

Network Session Key

AT+NSK<NWK-SK>

Data Session Key

AT+DSK<DATA-SK>Transmit Frequency

AT+TXF

US 915MHz: Any; 915.5-919.7 isrecommended
EU 868MHz: FIXED at 869.85

Transmit Data Rate

AT+TXDR

US 915MHz: DR8-DR13
EU 868MHz: DR0-DR6

TX/RX Inverted

AT+TXI, AT+RXI

0, 1 Use the AT+TXI setting for both

Require Acknowledgment

AT+ACK

0-8

Save Configuration

AT&W

Serial Data Mode

AT+SD

EU 868 Test Mode
This feature allows test mode for EU 868MHz devices as defined by the LoRa Alliance. Test mode is administered at
the application level so the mDot must be joined to the network via ABPA or OTAA prior to testing.
Test mode allows you to test the mDot without special commands from the UI. Instead the network server initiates
test mode with a special packet (0x01010101) on port 224. Once initiated, the server changes settings on the mDot

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through MAC commands and records the packets received from a number of attempts. Duty cycle limits are
disabled during test mode.
The libmDot library now includes the test mode implementation, so an application built with libmDot will also haveit. The libmDot library generates uplink packets and responds to commands from the network server test
application.

Sleep Mode Enhancements
Changes to sleep mode include:■ Sleep mode now allows both Sleep Mode (stop) and Deep sleep (standby). Earlier firmware allowed only
Deep sleep.
■ Deep sleep has been changed to allow devices to wake on interval, interrupt, or both.
■ Allow user to set a wake up pin for sleep mode.
Related Commands■ Sleep Mode (+SLEEP)■ Wake Mode (+WM)■ Wake Interval (+WI)■ Wake Pin (+WP)

Preserve Session
This feature allows you to preserve an AUTO_OTA LoRa Network session across power cycle or reset. The preservesession feature is applicable only when AT+NJM=2 (AUTO_OTA). However, AT+RS and AT+SS commands can beused with AT+NJM=1 or 0 (OTA or MANUAL) modes as well.
Related Commands■ Preserve Session (+PS)■ Restore Saved Session (+RS)■ Send using restored session (+SEND)■ Save Session (+SS)

AT Commands Added or Changed in Version 1.0
The following AT Commands were added or modified in this release.Refer to the MultiConnect Dot AT Command
Reference for details

10

CommandFunction

AT+TXCH

Change allows users to now add channels for EU 868MHz models.

AT+ULC

New, uplink counter

AT+DLC

New, downlink counter

AT+ANT

New, antenna gain

AT+JD

New, join delay

AT+RXD

New, receive delay

AT+TXDR

Change to data rate format

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CommandFunction

AT+SDR

New, displays the current data rate

AT+SDCE

New, serial data clear on error

AT&K0/3

New, hardware flow control

AT+DC

New, device class

AT+AP

New, application port

AT+SS

New, save network session

AT+RS

New, restore network session

AT+PS

New, preserve session

Getting Started
Getting started depends on what you want to do. By default, mDot ships with firmware that supports AT
Commands that use the serial I/O. For AT Commands, refer to the separate MultiConnect Dots AT Command
Reference Guide.
To send commands to the mDot:
1.
2.

Mount the mDot on the developer board. For details, refer to Chapter 11, Developer Board Installation.
Connect a serial cable into the DB-9 connector.

3.
4.

Open communications software, such as HyperTerminal or TeraTerm.
Set the following:■ Baud rate = 115,200■ Data bits = 8■ Parity = N■ Stop bits = 1■ Flow control = Off

Two serial interfaces are available through the USB interface, one is used to program the mDot and the other is fordebug messages. Refer to “mDot Pinout Design Notes” in Chapter 3, Specifications and Pin Information for
information on which pins are available out of the box.
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To develop using mbed, the mDot mbed page includes libraries and test cases. Refer to “mBed Documentation” fordetails and links.
For help setting up a MultiConnect® Conduit™ to send data to and from an mDot, refer to “Related
Documentation.”

Documentation Overview
This manual is one part of mDot documentation. Refer to the Related Documentation and mbed sections for
additional information needed to program your mDot and integrate your application with the MultiConnect
Conduit gateway.
This document includes the following sections:■ mDot device information: Mechanical drawings, specifications, safety and regulatory information, and otherdevice specific content. Chapters 1-8■ Universal Developer Kit information: Using the MTUDK-ST-MDOT Developer Kit, including design
considerations, schematics, and installation and operation information. Chapters 9-13
This manual is available at www.multitech.com/support.

Related Documentation■ DOT Series AT Command Reference: Includes details on the AT commands available for mDots. This manualis available at www.multitech.com/support■ MultiTech Developer Site: Application notes, LoRa information, and documentation for related products
such as the MultiConnect Conduit (MTCDT) gateway and the LoRa accessory card (MTAC-LORA) are available
on the MultiTech developer site. This site includes information on using the Conduit with mDots. Go to:www.multitech.net■ Processor Datasheet: STmicro ARM® Cortex®-M4 processor datasheet is available on the STMicro website:
http://www.st.com/web/en/catalog/mmc/FM141/SC1169/SS1577/LN1877/PF260049

mbed Documentation
ARM mbed is a free, open-source platform and operating system for embedded devices using the ARM Cortex-M
microcontrollers. The mbed website provides free software libraries, hardware designs, and online tools for rapid
prototyping of products. The platform includes a standards-based C/C++ SDK, a microcontroller HDK, andsupported development boards, an online compiler and online developer collaboration tools.
Note: To send and receive data, you need a LoRaWAN 1.0 gateway, such as MultiTech's MultiConnect Conduit(MTCDT) with an MTAC-LORA accessory card installed.

Programming the mDot Microcontroller
With the mDot and the MTUDK2-ST-xx developer board, use the ARM mbed ecosystem to program themicrocontroller. Compile in the cloud or locally, copy the resulting binary file to the mbed USB drive, and reset themDot.
Note: To program the mDot, you need an mDot model with programming header, model MTDOT-xx-X1P-SMA.
On the mDot mbed page, MultiTech supplies source code for non-RF portions of the mDot and MTAC-LORA cards.
To comply with FCC and ETSI certification, some portions of the software is available only as binary libraries.

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CHAPTER 1 PRODUCT OVERVIEWMultiTech offers both development and stable release versions of the library.
■ Development version: libmDot-dev-mbed5■ Stable release version: libmDot-mbed5
You can use either the mbed online compiler or offline tools.
■ Online: Use the mbed-os library in your mbed application■ Offline: Use mbed-cli tools to create, manage, and build your mbed 5.1 application.

General mBed Links■ Explore mbed: http://developer.mbed.org/explore■ Getting Started with mbed: http://developer.mbed.org/getting-started■ mbed Handbook: http://developer.mbed.org/handbook/Homepage■ mbed online compiler documentation: https://developer.mbed.org/handbook/mbed-Compiler■ mbed cli documentation: https://github.com/ARMmbed/mbed-cli/blob/master/README.md■ mbed workspace tools documentation: https://github.com/ARMmbed/mbedos/blob/master/docs/BUILDING.md#workspace-tools

mDot Platform
The mDot mbed page includes the mDot library, firmware, and test cases
https://developer.mbed.org/platforms/MTS-mDot-F411

xDot Platform
The xDot mbed page includes the xDot library, firmware, and test cases
https://developer.mbed.org/platforms/MTS-xDot-L151CC/

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EUI and Networking
All mDots have a factory-programmed Extended Unique Identifier (EUI). This is marked as Node on the mDot label.
To connect an mDot to a network, you will need to program it with the network ID for the network you areconnecting to as well as the network key and application key. For information on setting up mDots as part of a
LoRa network, go to: www.multitech.net

Product Build Options
Product

Description

Quanity to Order

MTDOT-915-X1-SMA

915 MHz LoRa SMA

1 or 50

MTDOT-915-X1P-SMA

915 MHz LoRa SMA with Programming Header

1

MTDOT-915-X1-UFL

915 MHz LoRa U.FL

1 or 50

MTDOT-915-M1-UFL

915 MHz SMT LoRa U.FL

1 or 100

MTDOT-915-M1-TRC

915 MHz SMT LoRa RF Pad

1 or 100

MTDOT-868-X1-SMA

868 MHz LoRa SMA

1 or 50

MTDOT-868-X1P-SMA

868 MHz LoRa SMA with Programming Header

1

MTDOT-868-X1-UFL

868 MHz LoRa U.FL

1 or 50

MTDOT-868-M1-UFL

868 MHz SMT LoRa U.FL

1 or 100

MTDOT-868-M1-TRC

868 MHz SMT LoRa RF Pad

1 or 100mDot Developer Kit

1

North America

EMEA

Developer Kits
MTUDK2-ST-MDOT
Note:■ The complete product code may end in .Rx. For example, MTDOT-915-M1-X1.Rx, where R is revisionand x is the revision number.

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CHAPTER 2 MECHANICAL DRAWINGS WITH PINOUTS

Chapter 2 Mechanical Drawings with Pinouts
MTDOT-xxx-X1P-SMA

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CHAPTER 2 MECHANICAL DRAWINGS WITH PINOUTSMTDOT-xxx-X1P-U.FL

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CHAPTER 2 MECHANICAL DRAWINGS WITH PINOUTSMTDOT-xxx-X1-SMA

MultiConnect® mDotTM MTDOT Developer Guide

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CHAPTER 2 MECHANICAL DRAWINGS WITH PINOUTSMTDOT-xxx-X1-UFL

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CHAPTER 2 MECHANICAL DRAWINGS WITH PINOUTSMTDOT-xxx-M1-UFL

MultiConnect® mDotTM MTDOT Developer Guide

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CHAPTER 2 MECHANICAL DRAWINGS WITH PINOUTSMTDOT-xxx-M1-TRC

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CHAPTER 3 SPECIFICATIONS AND PIN INFORMATION

Chapter 3 Specifications and Pin Information
MTDOT Specifications
Category

Description

GeneralCompatibility

LoRaWAN 1.0 specifications

Interfaces

Note that pin functions are multiplexed.
Up to 16 digital I/O
Up to 11 analog inputs
SPI
I2C
UART (RX, TX, RTS, CTS)
USB (OTG full speed)

CPU Performance
CPU

STM32

Max Clock

100 MHz

Flash Memory

512 KB (400 KB available)

RAM

128 KB

Radio Frequency
ISM Bands

863 MHz - 868 MHz, 902 MHz - 928 MHz

Physical Description
Weight1

0.2 oz. (5g)

Dimensions

Refer to Mechanical Drawings for Dimensions.

RF Connectors-SMA Models

SMA-UFL Models

U.FL-Trace Models

Trace Connection

Environment
Operating Temperature -40° C to +85° C
Storage Temperature-40° C to +85° C

Humidity

20%-90% RH, non-condensing

Power Requirements
Operating Voltage

3.3 V to 5 V (See Important note regarding voltage)

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CHAPTER 3 SPECIFICATIONS AND PIN INFORMATION

Category

Description

Certifications and Compliance
EMC Compliance

EN 300 220-2 V2.4.1:2012
EN 301 489-03 V1.6.1:2013

Radio Compliance

FCC 15.247:2015
FCC 15.109:2015
FCC 15.107:2015
RSS 247:2015
ICES-003:2012
CISPR 22:2008
EN 300 220-2 V2.4.1:2012

Safety Compliance

UL 60950-1 2nd ED
cUL 60950-1 2nd ED
IEC 60950-1 2nd ED AM1 + AM2

1

Weight is for the MTDOT-xxx-X1P-SMA, which is the heaviest model.
Important:
The MTDOT requires 3.3 V minimum power to maintain certification and to help protect the SPI Flash filesystem. The onboard LDO regulator output is 3 V derived from the 3.3 V to 5 V (+-5%) input voltage.
Starting with firmware version 2.0.16, SPI flash access is prevented if the onboard LDO regulator output
drops below 3 V. This code change protects the SPI file system from corruption that could occur frompower drop or loss.

Category

Description

Transmission2
North America

EMEA

Max Transmitter
Power Output (TPO)

19 dBm

14 dBmMaximum Receive
Sensitivity-137 dBm-137 dBm

Link Budget3

147 dB Point-to-Point

147 dB Point-to-Point

Max Effective
Isotropic RadiatedPower (EiRP)

22 dBm

10 dBmSpreading Factor

North America Typical Sensitivity4

EMEA Typical Sensitivity5

6-111 dBm-121 dBm

7-116 dBm-124 dBm

Receive Sensitivity

22

MultiConnect® mDotTM MTDOT Developer Guide

CHAPTER 3 SPECIFICATIONS AND PIN INFORMATION

Category

Description

8-119 dBm-127 dBm

9-122 dBm-130 dBm

10-125 dBm-133 dBm

11

Not Applicable-135 dBm

12

Not Applicable-137 dBm

2

Using the Pulse Electronics W1063 antenna, described in the Chapter 4, Antennas.

3

Greater link budget is possible with higher gain antenna.

4

RFS_L500: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 500 kHz bandwidth using split Rx/Tx
path.
5

RFS_L125: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 125 kHz bandwidth using split Rx/Tx
path.

MultiConnect® mDotTM MTDOT Developer Guide

23

CHAPTER 3 SPECIFICATIONS AND PIN INFORMATIONPower Draw
Note:
■ For AT command firmware version 1.0.8-1 and newer, both AT+SLEEP=0 and AT+SLEEP=1 put thedevice into sleep mode.
■ When your application uses the mDot library code to call sleep, specify either standby or stop. Notethe following:■ With standby, all I/O pins are configured as analog inputs with no pull resistors for minimum
power draw. At the processor level, stop mode is invoked not standby mode. All pin
configurations are saved before sleep and restored after.
■ With stop, only internal I/O pins are configured as analog inputs for minimum power draw. At theprocessor level, stop mode is invoked. It is left to the application to handle external pin
configurations. For minimum power draw during sleep, configure external pins as analog inputs
with no pull resistors.
■ Transmit power measured with MTDOT-915-xx transmitting to a MultiConnect Conduit with an
MTAC-LORA-915 accessory card installed.
■ The mDot used for measurements was revision B PCB with firmware version 1.0.8-1■ Idle current measured with the mDot joined with Conduit, but idle without data transferring.
■ Transmit power measured while transferring data packets using spread factor 9. Packet size limited
to 53 bytes. The Conduit was set to receive packets from and send back to the mDot. A script was
run to send the packet 100 times with either 10 or 53 bytes of data, with an average measurement
taken during that time.
■ Inrush charge is the highest observed value from took five separate measurements.
■ Power measurements are similar for EU1 models. Some 868 MHz sub-band frequencies do notsupport maximum TXP power of 20.
■ Multi-Tech Systems, Inc. recommends that you incorporate a 10% buffer into the power source
when determining product load.

24

Voltage

Sleep
Mode
Range,
Sleep = 0
or 1
Typical(µA)

Idle
Packetcurrent Size
Average (Bytes)(Amps)

Average
Current(Amps) at
Low
Transmit
Power
Setting(TXP 2)Average
Current(Amps) at
Default
Transmit
Power
Setting(TXP 11)

Average
Total Inrush
Current
Charge(Amps) at
Measured in
Maximum Millicoulombs
Transmit(mC)
Power
Setting (TXP
20)

Total Inrush
ChargeDuration
duringPowerup(InRushDuration)

3.3

40, Range
35-45

0.032

10

0.026

0.028

0.031

1.14

661uS

5.0

40, Range
35-45

0.032

10

0.026

0.028

0.032

1.79

1.24mS

MultiConnect® mDotTM MTDOT Developer Guide

CHAPTER 3 SPECIFICATIONS AND PIN INFORMATIONElectrical Characteristics
SignalDescription

Min

Max

Vin Low

Input low level

--

.99

Vin High

Input high level

2.31

--

Vout Low

Output low level--.4

Vout High

Output high level

2.9

--

VCC

Standard operating voltage 3.3

5

ICC

Operating current (mA)
@5V

--

135

Operating current (mA)
@3.3V

--

200

Pin Information
Using the mbed platform with the Cortex-M4 processor expands your pin functionality options.
MT Pin

STM32411 (Where
applicable)

AT mbed Default Other Functions
Function

1

VDD input

Description
3.3 V to 5 V input

2

PA2

USART2_TX

GPIO/Defaulted to USART_Tx - RS232
on UDK2

3

PA3

USART2_RX

GPIO/Defaulted to USART_Rx - RS232
on UDK2

4

PA6

SPI1_MISO

SPI1_MISO

5

Reset

Reset

nReset input - 10K PU

6PA8

I2C_SCLI2C clock7

PC9

I2C_SDAI2C Serial data

8

PA12

USART6_RX

USB_FS_DP

GPIO

9

PA11

USART6_TX

USB_FS_DM

GPIO

10

VSSA/VSS_3/VSS_4

GND

Ground for VCC

11

PA7

SPI1_MOSI

PA_7/AD4/DIO4/SPI1_MOSI

12

PA0-WKUP

WAKE

Wake up from Standby on rising edge

13

PC13

ON_Sleep

Sleep On

14

No Connect

Not routed on board

15

PC1

GPIO

16

PA1

GPIO

17

PA4

SPI1_CS

MultiConnect® mDotTM MTDOT Developer Guide

PA_4/AD3/DIO3/SPI1_CS

25

CHAPTER 3 SPECIFICATIONS AND PIN INFORMATIONMT Pin

STM32411 (Where
applicable)

AT mbed Default Other Functions
Function

Description

18

PA5

SPI1_SCK

PA_5/AD2/DIO2/SPI1_SCK

19

PB0

PB_0/AD1/DIO1

20

PB1

PB_1/AD0/DIO0

21

Not a pin22

Not a pin23

Not a pin

GND

RF Ground for antenna - UFL or SMA

24

VDDA

Vout/Vref

3V @25ma reference voltage

25

VSSA/VSS_3/VSS_4

GND

Ground for VCC

26

PA14

JTMS-SWCLK

STMicro - JTAG Clock /Serial Wire
Debug Clock

27

PA13

JTMS-SWIO

STMicro - JTAG Data I/O /Serial Wire
Debug Data

28

PB4

JTMS-nRst

STMicro -JTAG reset

29

PB3

JTDO-SO

STMicro - SWO - Trace View

30

PA10

Debug RX

Debug RX/ routes to USB on UDK2

31

PA9

Debug TX

Debug TX/ routes to USB on UDK2GND

RF Ground for antenna - UFL or SMA
RF Antenna In/Out - UFL or SMA

SPI Flash
Note: Using the SPI Flash, Micron M25P16 Family.
Pin

Function

Description

PC_12

SPI3_MOSISPI serial data IN

PC_11

SPI3_MISO

SPI serial data OUT

PC_10

SPI3_SCKSPI clock

PC_6

SPI3_CSSPI chipset

PC_7

FLASH_HOLD#HOLD, the HOLD# signal isused to pause any serial
communications with thedevice without deselecting thedevice

PC_8

FLASH_WP

Flash write protect

LoRa

26

Pin

Function

PC_0

LORA_RESET

PC_2

LORA_RXCTL

MultiConnect® mDotTM MTDOT Developer Guide

CHAPTER 3 SPECIFICATIONS AND PIN INFORMATION

Pin

Function

PC_3

LORA_TXCTL

PB_5

LORA_DIO0

PB_6

LORA_DIO1

PB_7

LORA_DIO2

PB_8

LORA_DIO3

PB_9

LORA_DIO4

PB_10

LORA_DIO5

LoRa/SPI2
PB_12

LORA_NSS

PB_13

LORA_RXCTL

PB_14

LORA_MISO

PB_15

LORA_MOSI

MultiConnect® mDotTM MTDOT Developer Guide

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CHAPTER 3 SPECIFICATIONS AND PIN INFORMATION

mDot Pinout Design Notes
Refer to the mechanical drawing for your model for pin locations.
■ All pins that go to connectors are directly connected to the processor.
■ Reset is the only pin with pull up.
■ I/O is 5V tolerant.
mDots allow you to program pins depending on your application:■ Serial: Available out of the box. See Serial Pinout Notes for details.
■ mbed: Designed with the mbed STM32F411 RET 64-pin processor, this option provides the most flexibility.
For more information about processor capabilities, see the STM32F411 RET datasheet.
Note: To program the mDot, you need an mDot model with programming header., model MTDOT-xx-X1P-SMA

Serial Pinout Notes
Out of the box, these pins are available for serial applications. Refer to the mechanical drawing for your model forpin locations.
■ 2 Dout/TX■ 3 Din/RX■ 9 DTR■ 12 CTS■ 13 On/Sleep■ 16 RTS

Serial Settings
When creating a serial connection with the device on the developer board, connect a serial cable to the DB-9
connector, open communications software (such as TeraTerm, Putty, or Minicom ), and use the following settings:■ Baud rate = 115,200■ Data bits = 8■ Parity = N■ Stop bits = 1■ Flow control = Off

LoRa
Throughput Rates
Theoretical maximum speeds for LoRa mode with ACKs off are:
■ Using spreading factor 7 at 125kHz, the throughput rate is 5470 bps (5.47 kbps).
■ Using spreading factor 7 at 500kHz the receiving throughput rate is 21900 bps (21.9 kbps).
Note: Data rates in the LoRaWAN specification vary by geographic region.

28

MultiConnect® mDotTM MTDOT Developer Guide

CHAPTER 3 SPECIFICATIONS AND PIN INFORMATION

Range
Variables effecting the range include TX power, antenna gain, RX sensitivity, fade margin, earth's curvature. Use
the following formula to calculate the maximum range:

The following table provides example settings and the theoretical maximum range based on these settings.
Example18dB Transmit Power for
915 MHz Models

Units

Example 14dB Transmit Power for
868MHz Models

Frequency

915

MHz

868

TX Power

19

dBm

14

TX Antenna Gain

3

dB

3

RX Sensitivity1

-120

dBm

-120

RX Antenna Gain

3

dB

3

Fade Margin

30

dB

30

Distance

8.14

Miles

5.41

Distance

13.08

Km

8.70

2

1

RX Sensitivity is set to a conservative -120dBm, but can vary from -117 to -137dBm.

2

Fade Margin is set at the worst case of 30dB. Fade margin is an allowance a system designer includes to accountfor unknown variables. The higher the fade margin, the better the overall link quality will be. With a fade margin
set to zero, the link budget is still valid, but only in LOS conditions, which is not practical for most designs. The
amount of fade margin to include in a calculation depends on the environment in which you will deploy thesystem. A fade margin of 12 dBm is good, but a better number would be 20 to 30 dBm.

MultiConnect® mDotTM MTDOT Developer Guide

29

CHAPTER 4 ANTENNAS

Chapter 4 Antennas
Antenna System
The LoRa antenna performance depends on the implementation and antenna design. The integration of theantenna system into the product is a critical part of the design process; therefore, it is essential to consider it earlyso the performance is not compromised. If changes are made to the device's certified antenna system, thenrecertification will be required.
This radio transmitter has been approved with the antenna types listed below. The antenna used must maintainthe same specifications. The antenna must be of the same type, with similar in-band and out-of-band radiation
patterns. Antenna types not included on this list, or having a greater gain than the maximum gain indicated for thelisted type, are strictly prohibited for use with this device.

U.FL and Trace Antenna Options
Currently, FCC approval includes Pulse Electronics SMA antenna only. If using U.FL or trace antennas, note thefollowing:■ For a simple trace to RF antennas: Routing must follow standard RF design rules and practices forstripline/miscrostrip for a 50 ohm impedance line. Use the developer board schematics for a reference
circuit for the a trace antenna. This option may require additional certification testing.
■ For U.FL antennas: The antenna and cable combination in your design cannot exceed the performance of
the SMA antenna as listed in the next topic.

Pulse Electronics Antenna
Manufacturer:

Pulse Electronics

Description:

868-915 MHz RP-SMA Antenna, 8"

Model Number:

W1063

MultiTech Part Number:

45009830L

MultiTech ordering information:
Ordering Part Number

Quantity

AN868-915A-1HRA

1

AN868-915A-10HRA

10AN868-915A-50HRA

50

Antenna Specifications

30

Category

Description

Frequency Range

868-928 MHz

Impedance

50 Ohms

VSWR

< 2.0

MultiConnect® mDotTM MTDOT Developer Guide

CHAPTER 4 ANTENNAS

Category

Description

Gain

3.0 dBi

Radiation

Omni

Polarization

VerticalOEM Integration
FCC & IC Information to Consumers
The user manual for the consumer must contain the statements required by the following FCC and IC regulations:47 C.F.R. 15.19(a)(3), 15.21, 15.105 and RSS-Gen Issue 3, Dec 2010; 7.1.2 and 7.1.3

FCC Grant Notes
The OEM should follow all the grant notes listed below. Otherwise, further testing and device approvals may benecessary.
FCC Definitions
Portable: (§2.1093) — A portable device is defined as a transmitting device designed to be used so that theradiating structure(s) of the device is/are within 20 centimeters of the body of the user.
Mobile: (§2.1091) — A mobile device is defined as a transmitting device designed to be used in other than fixedlocations and to generally be used in such a way that a separation distance of at least 20 centimeters is normally
maintained between the transmitter’s radiating structure(s) and the body of the user or nearby persons.
Actual content pending Grant: This device is a mobile device with respect to RF exposure compliance. The
antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all
persons, and must not be collocated or operate in conjunction with any other antenna or transmitter except inaccordance with FCC multi-transmitter product guidelines. Installers and end-users must be provided with specificinformation required to satisfy RF exposure compliance for installations and final host devices. (See note underGrant Limitations.) Compliance of this device in all final host configurations is the responsibility of the Grantee.
Note: Host design configurations constituting a device for portable use (<20 cm from human body) require
separate FCC/IC approval.

Host Labeling
The following statements are required to be on the host label:This device contains FCC ID: {Add the FCC ID of the specific device}
This device contains equipment certified under IC ID: {Add the IC ID of the specific device}
For additional labeling requirements, see the product's Labeling Requirements. For the FCC and IC IDs, see specificcertificate information in the Regulatory Statement chapter.

MultiConnect® mDotTM MTDOT Developer Guide

31

CHAPTER 5 SAFETY INFORMATION

Chapter 5 Safety Information
Handling Precautions
To avoid damage due to the accumulation of static charge, use proper precautions when handling any cellulardevice. Although input protection circuitry has been incorporated into the devices to minimize the effect of staticbuild-up, use proper precautions to avoid exposure to electronic discharge during handling and mounting thedevice.

Radio Frequency (RF) Safety
Due to the possibility of radio frequency (RF) interference, it is important that you follow any special regulations
regarding the use of radio equipment. Follow the safety advice given below.
■ Operating your device close to other electronic equipment may cause interference if the equipment isinadequately protected. Observe any warning signs and manufacturers’ recommendations.
■ Different industries and businesses restrict the use of cellular devices. Respect restrictions on the use ofradio equipment in fuel depots, chemical plants, or where blasting operations are in process. Follow
restrictions for any environment where you operate the device.
■ Do not place the antenna outdoors.
■ Switch OFF your wireless device when in an aircraft. Using portable electronic devices in an aircraft may
endanger aircraft operation, disrupt the cellular network, and is illegal. Failing to observe this restriction
may lead to suspension or denial of cellular services to the offender, legal action, or both.
■ Switch OFF your wireless device when around gasoline or diesel-fuel pumps and before filling your vehicle
with fuel.
■ Switch OFF your wireless device in hospitals and any other place where medical equipment may be in use.

Sécurité relative aux appareils à radiofréquence (RF)À cause du risque d'interférences de radiofréquence (RF), il est important de respecter toutes les réglementations
spéciales relatives aux équipements radio. Suivez les conseils de sécurité ci-dessous.
■ Utiliser l'appareil à proximité d'autres équipements électroniques peut causer des interférences si leséquipements ne sont pas bien protégés. Respectez tous les panneaux d'avertissement et les
recommandations du fabricant.
■ Certains secteurs industriels et certaines entreprises limitent l'utilisation des appareils cellulaires. Respectez
ces restrictions relatives aux équipements radio dans les dépôts de carburant, dans les usines de produits
chimiques, ou dans les zones où des dynamitages sont en cours. Suivez les restrictions relatives à chaquetype d'environnement où vous utiliserez l'appareil.
■ Ne placez pas l'antenne en extérieur.
■ Éteignez votre appareil sans fil dans les avions. L'utilisation d'appareils électroniques portables en avion est
illégale: elle peut fortement perturber le fonctionnement de l'appareil et désactiver le réseau cellulaire. S'ilne respecte pas cette consigne, le responsable peut voir son accès aux services cellulaires suspendu ou
interdit, peut être poursuivi en justice, ou les deux.
■ Éteignez votre appareil sans fil à proximité des pompes à essence ou de diesel avant de remplir le réservoir
de votre véhicule de carburant.

32

MultiConnect® mDotTM MTDOT Developer Guide

CHAPTER 5 SAFETY INFORMATION■ Éteignez votre appareil sans fil dans les hôpitaux ou dans toutes les zones où des appareils médicaux sontsusceptibles d'être utilisés.

Interference with Pacemakers and Other Medical Devices
Potential interference
Radio frequency energy (RF) from cellular devices can interact with some electronic devices. This iselectromagnetic interference (EMI). The FDA helped develop a detailed test method to measure EMI of implanted
cardiac pacemakers and defibrillators from cellular devices. This test method is part of the Association for the
Advancement of Medical Instrumentation (AAMI) standard. This standard allows manufacturers to ensure thatcardiac pacemakers and defibrillators are safe from cellular device EMI.
The FDA continues to monitor cellular devices for interactions with other medical devices. If harmful interference
occurs, the FDA will assess the interference and work to resolve the problem.

Precautions for pacemaker wearers
If EMI occurs, it could affect a pacemaker in one of three ways:■ Stop the pacemaker from delivering the stimulating pulses that regulate the heart's rhythm.
■ Cause the pacemaker to deliver the pulses irregularly.
■ Cause the pacemaker to ignore the heart's own rhythm and deliver pulses at a fixed rate.
Based on current research, cellular devices do not pose a significant health problem for most pacemaker wearers.
However, people with pacemakers may want to take simple precautions to be sure that their device doesn't cause
a problem.
■ Keep the device on the opposite side of the body from the pacemaker to add extra distance between
the pacemaker and the device.
■ Avoid placing a turned-on device next to the pacemaker (for example, don’t carry the device in a shirt
or jacket pocket directly over the pacemaker).

Device Maintenance
When maintaining your device:■ Do not attempt to disassemble the device. There are no user serviceable parts inside.
■ Do not expose your device to any extreme environment where the temperature or humidity is high.
■ Do not expose the device to water, rain, or spilled beverages. It is not waterproof.
■ Do not place the device alongside computer discs, credit or travel cards, or other magnetic media. The
information contained on discs or cards may be affected by the device.
■ Using accessories, such as antennas, that MultiTech has not authorized or that are not compliant with
MultiTech's accessory specifications may invalidate the warranty.
If the device is not working properly, contact MultiTech Technical Support.

User Responsibility
Respect all local regulations for operating your wireless device. Use the security features to block unauthorized use
and theft.

MultiConnect® mDotTM MTDOT Developer Guide

33

CHAPTER 6 REGULATORY INFORMATION

Chapter 6 Regulatory Information
EMC, Safety, and R&TTE Directive Compliance
The CE mark is affixed to this product to confirm compliance with the following European Community Directives:
Council Directive 2014/30/EU on the approximation of the laws of Member States relating toelectromagnetic compatibility;andCouncil Directive 2014/35/EU on the harmonization of the laws of Member States relating to electricalequipment designed for use within certain voltage limits;
andCouncil Directive 2011/65/EU on the restriction of the use of certain hazardous substances in electricaland electronic equipment;
andCouncil Directive 1999/5/EC on radio equipment and telecommunications terminal equipment and themutual recognition of their conformity.

47 CFR Part 15 Regulation Class B Devices
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio communications. However,there is no guarantee that interference will not occur in a particular installation. If this equipment does cause
harmful interference to radio or television reception, which can be determined by turning the equipment off andon, the user is encouraged to try to correct the interference by one or more of the following measures:■ Reorient or relocate the receiving antenna.
■ Increase the separation between the equipment and receiver.
■ Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
■ Consult the dealer or an experienced radio/TV technician for help.
Warning: Changes or modifications to this unit not expressly approved by the party responsible for compliancecould void the user’s authority to operate the equipment.

FCC Interference Notice
Per FCC 15.19(a)(3) and (a)(4) This device complies with part 15 of the FCC Rules. Operation is subject to thefollowing two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause undesired operation.

34

MultiConnect® mDotTM MTDOT Developer Guide

CHAPTER 6 REGULATORY INFORMATIONFCC Grant
FCC Part 15
FCC Identifier:AU792U13A16857

Equipment Class:

Digital Transmission System

Notes:MTDOT-915

FCC Rule Parts:

15C

Approval:

Single Modular

Frequency Range:

902.3-914.9

Output Watts:

0.0772

Output power is conducted. This transmitter is a hybrid per FCC 15.247(f) and FCC KDB 453039. The antenna(s)used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons andmust not be collocated or operating in conjunction with any other antenna or transmitter within a host device,
except in accordance with FCC multi-transmitter product procedures. End-users and installers must be provided
with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance.

FCC Notice
MTDOT-x products are open development based products that contain a sub ghz radio technology. MultiTech has
certified for compliance with US and Foreign compliance bodies including FCC, R&TTE and others. (e.g. FCC
15.247:2015 & IC RSS-210:2010)
MultiTech provides software code meant to operate the radio to a level that maintains compliance with theoperating modes under which these radio devices were certified. To ensure this level of compliance, the software
code is provided in binary form only. Users are prohibited from making any changes that affect the operation of
the radio performance. Accessing or controlling the radio through any means other than the provided binary
software will require the user to obtain their own intentional radiator license from the certification body governing
their locality, as all pre-certification provided with mDot will have been made invalid.

Industry Canada Class B NoticeThis Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations.
Cet appareil numérique de la classe B respecte toutes les exigences du Reglement Canadien sur le matériel
brouilleur.
This device complies with Industry Canada license-exempt RSS standard(s). The operation is permitted for thefollowing two conditions:1.
2.

the device may not cause harmful interference, andthe user of the device must accept any interference suffered, even if the interference is likely tojeopardize the operation.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes:
1.

l'appareil ne doit pas produire de brouillage, etMultiConnect® mDotTM MTDOT Developer Guide

35

CHAPTER 6 REGULATORY INFORMATION

2.

l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement.

Industry Canada
Certification Number/No. de Certification

125A-0054

Type of Radio Equipment/Genre de Matériel

Spread Spectrum/Digital Device (902-928MHz)/
Modular Approval/Approbation modulaire

Model/Modèle

MTDOT-915

Specification/
Cahier desChargesIssue/
ÉditionFrom
Frequency/
De
FréquencesTo
Frequency/ÁFréquences

Emmission
Designation/
Designation
D’émission

Minimum Power

MaximumPower

RSS2471.0

902.3 MHz

914.9 MHz

GXDXX

77.2 mW

77.2 mW

Certification of equipment means only that the equipment has met the requirements of the above noted
specification. License applications, where applicable to use certified equipment, are acted on accordingly by theIndustry Canada issuing office and will depend on the existing radio environment, service and location ofoperation. This certificate is issued on condition that the holder complies and will continue to comply with therequirements and procedures issued by Industry Canada. The equipment for which this certificate is issued shallnot be manufactured, imported distributed, leased, offered for sale or sold unless the equipment complies withthe applicable technical specifications and procedures issued by Industry Canada.
La certification du matériel signifie seulement que le matériel a satisfait aux exigences de la norme indiquée cidessus. Les demandes de licences nécessaires pour l’utilisation du matériel certifié sont traitées en conséquence
par le bureau de délivrance d’Industrie Canada et dépendent des conditions radio ambiantes, du service et del’emplacement d’exploitation. Le présent certificat est délivré à la condition que le titulaire satisfasse et continue
de satisfaire aux exigences et aux procédures d’Industrie Canada. Le matériel à l’égard duquel le présent certificat
est délivré ne doit pas être fabriqué, importé, distribué, loué, mis en vente ou vendu à moins d’être conforme aux
procédures et aux spécifications techniques applicable publiées par Industrie Canada.

36

MultiConnect® mDotTM MTDOT Developer Guide

CHAPTER 7 ENVIRONMENTAL NOTICES

Chapter 7 Environmental Notices
Waste Electrical and Electronic Equipment Statement
Note: This statement may be used in documentation for your final product applications.

WEEE Directive
The WEEE Directive places an obligation on EU-based manufacturers, distributors, retailers, and importers to takeback electronics products at the end of their useful life. A sister directive, ROHS (Restriction of Hazardous
Substances) complements the WEEE Directive by banning the presence of specific hazardous substances in the
products at the design phase. The WEEE Directive covers all MultiTech products imported into the EU as of August
13, 2005. EU-based manufacturers, distributors, retailers and importers are obliged to finance the costs of recovery
from municipal collection points, reuse, and recycling of specified percentages per the WEEE requirements.

Instructions for Disposal of WEEE by Users in the European Union
The symbol shown below is on the product or on its packaging, which indicates that this product must not be
disposed of with other waste. Instead, it is the user's responsibility to dispose of their waste equipment by handing
it over to a designated collection point for the recycling of waste electrical and electronic equipment. The separate
collection and recycling of your waste equipment at the time of disposal will help to conserve natural resourcesand ensure that it is recycled in a manner that protects human health and the environment. For more information
about where you can drop off your waste equipment for recycling, please contact your local city office, yourhousehold waste disposal service or where you purchased the product.
July, 2005

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37

CHAPTER 7 ENVIRONMENTAL NOTICESREACH Statement
Registration of Substances
After careful review of the legislation and specifically the definition of an “article” as defined in EC Regulation
1907/2006, Title II, Chapter 1, Article 7.1(a)(b), it is our current view Multi-Tech Systems, Inc. products would beconsidered as “articles”. In light of the definition in § 7.1(b) which requires registration of an article only if it
contains a regulated substance that “is intended to be released under normal or reasonably foreseeable conditionsof use,” Our analysis is that Multi-Tech Systems, Inc. products constitute nonregisterable articles for their intended
and anticipated use.

Substances of Very High Concern (SVHC)Per the candidate list of Substances of Very High Concern (SVHC) published October 28, 2008 we have reviewed
these substances and certify the Multi-Tech Systems, Inc. products are compliant per the EU “REACH”
requirements of less than 0.1% (w/w) for each substance. If new SVHC candidates are published by the European
Chemicals Agency, and relevant substances have been confirmed, that exceeds greater than 0.1% (w/w), MultiTech Systems, Inc. will provide updated compliance status.
Multi-Tech Systems, Inc. also declares it has been duly diligent in ensuring that the products supplied are compliant
through a formalized process which includes collection and validation of materials declarations and selective
materials analysis where appropriate. This data is controlled as part of a formal quality system and will be madeavailable upon request.

38

MultiConnect® mDotTM MTDOT Developer Guide

CHAPTER 7 ENVIRONMENTAL NOTICES

Restriction of the Use of Hazardous Substances (RoHS)

Multi-Tech Systems, Inc.
Certificate of Compliance2011/65/EU
Multi-Tech Systems, Inc. confirms that its embedded products comply with the chemical concentration limitations
set forth in the directive 2011/65/EU of the European Parliament (Restriction of the use of certain Hazardous
Substances in electrical and electronic equipment - RoHS).
These MultiTech products do not contain the following banned chemicals1:■ Lead, [Pb] < 1000 PPM■ Mercury, [Hg] < 1000 PPM■ Hexavalent Chromium, [Cr+6] < 1000 PPM■ Cadmium, [Cd] < 100 PPM■ Polybrominated Biphenyl, [PBB] < 1000 PPM■ Polybrominated Diphenyl Ether, [PBDE] < 1000 PPM
Environmental considerations:■ Moisture Sensitivity Level (MSL) =1■ Maximum Soldering temperature = 260C (in SMT reflow oven)1

Lead usage in some components is exempted by the following RoHS annex, therefore higher lead concentration
would be found in some modules (>1000 PPM);- Resistors containing lead in a glass or ceramic matrix compound.

MultiConnect® mDotTM MTDOT Developer Guide

39

CHAPTER 7 ENVIRONMENTAL NOTICES

Information on HS/TS Substances According to Chinese Standards
In accordance with China's Administrative Measures on the Control of Pollution Caused by Electronic Information
Products (EIP) # 39, also known as China RoHS, the following information is provided regarding the names andconcentration levels of Toxic Substances (TS) or Hazardous Substances (HS) which may be contained in Multi-Tech
Systems Inc. products relative to the EIP standards set by China's Ministry of Information Industry (MII).
Hazardous/Toxic Substance/Elements
Name of the Component

Lead
(PB)

Mercury(Hg)

Cadmium Hexavalent(CD)
Chromium(CR6+)

Polybromi Polybrominat
nated
ed Diphenyl
Biphenyl
Ether (PBDE)(PBB)Printed Circuit Boards

O

O

O

O

O

O

Resistors

X

O

O

O

O

O

Capacitors

X

O

O

O

O

O

Ferrite Beads

O

O

O

O

O

O

Relays/Opticals

O

O

O

O

O

O

ICs

O

O

O

O

O

O

Diodes/ Transistors

O

O

O

O

O

O

Oscillators and Crystals

X

O

O

O

O

O

Regulator

O

O

O

O

O

O

Voltage Sensor

O

O

O

O

O

O

Transformer

O

O

O

O

O

O

Speaker

O

O

O

O

O

O

Connectors

O

O

O

O

O

O

LEDs

O

O

O

O

O

O

Screws, Nuts, and other
Hardware

X

O

O

O

O

O

AC-DC Power Supplies

O

O

O

O

O

O

Software /Documentation CDs

O

O

O

O

O

O

Booklets and Paperwork

O

O

O

O

O

O

Chassis

O

O

O

O

O

O

X Represents that the concentration of such hazardous/toxic substance in all the units of homogeneousmaterial of such component is higher than the SJ/Txxx-2006 Requirements for Concentration Limits.
O Represents that no such substances are used or that the concentration is within the aforementioned limits.

40

MultiConnect® mDotTM MTDOT Developer Guide

CHAPTER 7 ENVIRONMENTAL NOTICES

Information on HS/TS Substances According to Chinese Standards (inChinese)依照中国标准的有毒有害物质信息
根据中华人民共和国信息产业部 (MII) 制定的电子信息产品 (EIP) 标准－中华人民共和国《电子信息产品污染
控制管理办法》（第 39 号），也称作中国 RoHS, 下表列出了 Multi-Tech Systems, Inc. 产品中可能含有的有毒物质 (TS) 或有害物质 (HS) 的名称及含量水平方面的信息。
有害/有毒物质/元素
成分名称

铅 (PB)

印刷电路板

O

电阻器

汞 (Hg)

镉 (CD)六价铬 (CR6+) 多溴联苯
(PBB)

多溴二苯醚
(PBDE)

O

O

O

O

O

X

O

O

O

O

O

电容器

X

O

O

O

O

O

铁氧体磁环

O

O

O

O

O

O

继电器/光学部件

O

O

O

O

O

O

ICs

O

O

O

O

O

O

二极管/晶体管

O

O

O

O

O

O

振荡器和晶振

X

O

O

O

O

O

调节器

O

O

O

O

O

O

电压传感器

O

O

O

O

O

O

变压器

O

O

O

O

O

O

扬声器

O

O

O

O

O

O

连接器

O

O

O

O

O

O

LEDs

O

O

O

O

O

O

螺丝、螺母以及其它五金件

X

O

O

O

O

O

交流-直流电源

O

O

O

O

O

O

软件/文档 CD

O

O

O

O

O

O

手册和纸页

O

O

O

O

O

O

底盘

O

O

O

O

O

O

X 表示所有使用类似材料的设备中有害/有毒物质的含量水平高于 SJ/Txxx-2006 限量要求。
O 表示不含该物质或者该物质的含量水平在上述限量要求之内。

MultiConnect® mDotTM MTDOT Developer Guide

41

CHAPTER 8 LABELS

Chapter 8 Labels
Approvals and Certification
In most cases, when integrated and used with an antenna system that was part of the MultiTech modem
certification, additional approvals or certifications are not required for the device you develop as long as thefollowing are met.
■ PTCRB Requirements: The antenna system cannot be altered.
■ Model Identification: The MultiTech model identification allows the carrier to verify the modem as one of
its approved models. This information is located on the modem's label below the bar code.

Example Labels
Note: Actual labels vary depending on the regulatory approval markings and content.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This
device may not cause harmful interference, and (2) this device must accept any interference received, includinginterference that may cause undesired operation.
The label shown is not the actual size.
1 - MultiTech Model Identification.
2 - MultiTech Ordering Part Number.
3 - Device Node Number.
Example North America Package LabelNorth America Device Label

42

Example EMEA Package LabelEMEA Device LabelMultiConnect® mDotTM MTDOT Developer Guide

CHAPTER 9 DEVELOPER KIT OVERVIEW

Chapter 9 Developer Kit Overview
Developer Board Overview
MultiTech offers three Developer Kits for prototyping and developing with the mDot:■ MTUDK2-ST-CELL is a full developer board and kit compatible with several MultiTech devices.
Warning: Do not use an mDot and a Dragonfly or Socketmodem on this board at the same time. Doing to may
damage both devices.
■ MTUDK2-ST-MDOT is a scaled down version of the developer board and kit for the mDot.
■ MTMDK-ST-MDOT is a mini developer board exclusively for the mDot. If using the Micro DK, go to Chapter
13 Micro Developer Kit for details on this developer board.
Developer kits help streamline your development efforts and evaluate your products and applications. Easily plugin your communications device and use the developer kit for testing, programming and evaluation.
Note: Developer information in this section applies to using either MTUDK2 developer kit with an mDot;
however, the illustrations show the MTUDK2-ST-MDOT model.

Developer Board Features■ USB and serial interfaces■ USB port for mbed development environment■ RS-232 DB-9 connector for serial interface■ Arduino shield socket

MTUDK2-ST-MDOT Developer Kit Contents
The MTUDK2-ST-MDOT Developer Kit includes the following:
Developer Board

1 - MTUDK 2.0 mDot Developer Board

Cables

1 - Micro USB Cable
1 - RSMA-U.FL Antenna Cables (attached to developer board)

Antennas

1 - 868-945 MHz Antenna

Customer Notices

Quick Start

Additional

One promotional screwdriver

MTUDK2-ST-CELL Developer Kit Contents
The MTUDK2-ST-CELL Developer Kit includes the following:
Developer Board

1 - MTUDK 2.0 Cell Developer Board

MultiConnect® mDotTM MTDOT Developer Guide

43

CHAPTER 9 DEVELOPER KIT OVERVIEWPower Supply

1 - 100-240V 9V-1.7A power supply with removable blades
1 - NAM blade/plug,
1 - EURO blade/plug
1 - UK blade/plug
1 - AU/NZ blade/plug

Cables

1 - Micro USB Cable
3 - SMA-U.FL Antenna Cables (attached to developer board)

Antennas

1 - 3.3V magnetic GPS Antenna
2 - 700-2600 MHz Antennas

44

Customer Notices

Quick Start

Additional

One promotional screwdriver

MultiConnect® mDotTM MTDOT Developer Guide

CHAPTER 10 BOARD COMPONENTS

Chapter 10 Board Components
Developer Board

MultiConnect® mDotTM MTDOT Developer Guide

45

CHAPTER 10 BOARD COMPONENTS

46

MultiConnect® mDotTM MTDOT Developer Guide

CHAPTER 10 BOARD COMPONENTS

Developer Board Connectors

Note: mDot connectors are powered through USB. The power jack on this developer board supplies power
to the Arduino Shield Headers.

Board Components
Label

Description

J4

RS232 DB-9 Serial Connector , used to access the mDot AT command interface.

J6

mbed USB Connector, attaches to the ST Micro controller. This provides access to twointerfaces, one used to program the mDot and the other for debug messages.

JP98

Serial Disconnect Header. Pins D0-D8 are connected to the Arduino headers and the DB9 serial
port. Remove these jumpers to disconnect from the RS232 transceiver chip.

JP197

J-Link Header, used for JTAG access to the mDot. This requires installing resistors R94-96 & 98
and removing R88-990 & 92. See Chapter 12 Developer Board Schematics.

MultiConnect® mDotTM MTDOT Developer Guide

47

CHAPTER 10 BOARD COMPONENTS

Label

Description

S1

Reset Button. Use to reset the processor of the device attached to the board.

X6

Arduino Shield Connector.

X7

Arduino Shield Connector.

X8

Arduino Shield Connector.

X9

Arduino Shield Connector.

X10

MTDOT Connector.

X11

MTDOT Connector.

J12

MTDOT Programming Header.

CAUTION: Take care when connecting or disconnecting USB cables to avoid detaching the connector from theboard.

LED Indicators

48

Label

LED

Location

STAT

LED1

Same side as RS-232 DB-9 connector

COM

LED2

Same side as RS-232 DB-9 connector

D7

LED3

Across the mDot connectors.

D6

LED7

Directly across from the mDot connectors.

D3

LED8

Directly across from the mDot connectors.

D0

LED9

Directly across from the mDot connectors.

D1

LED10

Directly across from the mDot connectors.

RST

LED12

Directly across from the mDot connectors.

PWR

LED13

Directly across from the mDot connectors.

D2

LED14

Directly across from the mDot connectors.

MultiConnect® mDotTM MTDOT Developer Guide

CHAPTER 11 DEVELOPER BOARD INSTALLATION

Chapter 11 Developer Board Installation
Installing an mDot on the Developer Board
To install an mDot on the Developer Board:
1.

Align the mDot with the developer board as shown.

2.

Gently press the mDot into the connectors.

MultiConnect® mDotTM MTDOT Developer Guide

49

CHAPTER 11 DEVELOPER BOARD INSTALLATION

Arduino ShieldmDot Arduino Pins

Installing an Arduino Shield with an mDot
Note: When using an Arduino Shield with an mDot, install the mDot on the developer board before installing
the Arduino shield.
To use an Arduino Shield with an mDot:
1.

Disable the developer card’s serial port by removing jumper from JP95.
■ Jumper pins 1-2: Disable U5 on USB VCC high.
■ Jumper pins 2-3: U5 always disabled.
■ Default jumper position is on pins 1-2.

2.

50

Align the Arduino Shield on the developer board as shown.

MultiConnect® mDotTM MTDOT Developer Guide

CHAPTER 11 DEVELOPER BOARD INSTALLATIONRSMA to U.FL Cables
The developer kit includes one 4.5" RSMA to U.FL cables which is preinstalled on the developer board.

Connecting an Antenna through the Developer Board Connectors
Depending on the mDot model, either connect the antenna directly to the mDot or through the RSMA-to-U.FL
antenna cable on the developer board.
To connect an antenna to the device through the developer board :1.
2.

Finger tighten the antenna to the SMA connector.
Attach the U.FL connector from the cable to the connector on the device.

MultiConnect® mDotTM MTDOT Developer Guide

51

CHAPTER 12 DEVELOPER BOARD SCHEMATICS

Chapter 12 Developer Board Schematics
Block Diagram

52

MultiConnect® mDotTM MTDOT Developer Guide

CHAPTER 12 DEVELOPER BOARD SCHEMATICS

Schematics

MultiConnect® mDotTM MTDOT Developer Guide

53

CHAPTER 12 DEVELOPER BOARD SCHEMATICS

54

MultiConnect® mDotTM MTDOT Developer Guide

CHAPTER 12 DEVELOPER BOARD SCHEMATICS

MultiConnect® mDotTM MTDOT Developer Guide

55

CHAPTER 12 DEVELOPER BOARD SCHEMATICS

56

MultiConnect® mDotTM MTDOT Developer Guide

CHAPTER 12 DEVELOPER BOARD SCHEMATICS

MultiConnect® mDotTM MTDOT Developer Guide

57

CHAPTER 13 MICRO DEVELOPER KIT

Chapter 13 Micro Developer Kit
Micro Developer Kit
Designed specifically for mDot development, the Micro DK plugs directly into a USB port on your computer making
it easy to use the developer kit for testing, programming, and evaluating your application.
Note: To work with the developer board, you need an X1P mDot model which includes a programming header.

Developer Kit Package Contents
Your Developer Kit (MTMDK-ST-MDOT) includes the following:
Developer Board

1 - MTMDK mDot Developer Board

Antenna

1 - 868-945 MHz LoRa Antenna

Customer Notices

This Quick Start

Update your developer board ST-LINK/V2 firmware through the mDot mbed page athttps://developer.mbed.org/platforms/MTS-mDot-F411/#general-technical-references

Firmware Updates
Before starting your project development, make sure you have the latest firmware for the Micro Developer Kit andmDot. Go to the mDot mbed page for MicroDK firmware. https://developer.mbed.org/platforms/MTS-mDot-F411/

58

MultiConnect® mDotTM MTDOT Developer Guide

CHAPTER 13 MICRO DEVELOPER KITMicro DK Mechanical Drawings

MultiConnect® mDotTM MTDOT Developer Guide

59

CHAPTER 13 MICRO DEVELOPER KITMicro Developer Board Components

Note: The Reset Button resets the mDot processor.
LED

Description

STAT

LED1 Status, red light that blinks when device powers up.

COM

LED2 Communication, green light that shows when device is communicating.

PWR

LED3 Power, blue lights when the board has power.

RSSI

LED4 Received Signal Strength Indicator.

Installing an mDot on a Micro Developer Board

To install an mDot on the Micro Developer Board:
1.
2.

60

Align the mDot on the developer board as shown.
Gently press the mDot into the connectors.

MultiConnect® mDotTM MTDOT Developer Guide

CHAPTER 13 MICRO DEVELOPER KIT

Assembly Diagrams and Schematics
Assembly Diagrams

MultiConnect® mDotTM MTDOT Developer Guide

61

CHAPTER 13 MICRO DEVELOPER KIT

Schematics

62

MultiConnect® mDotTM MTDOT Developer Guide

CHAPTER 13 MICRO DEVELOPER KITMultiConnect® mDotTM MTDOT Developer Guide

63

CHAPTER 13 MICRO DEVELOPER KIT

64MultiConnect® mDotTM MTDOT Developer Guide

CHAPTER 13 MICRO DEVELOPER KITMultiConnect® mDotTM MTDOT Developer Guide

65

CHAPTER 13 MICRO DEVELOPER KIT

66MultiConnect® mDotTM MTDOT Developer Guide

CHAPTER 14 DESIGN CONSIDERATIONS

Chapter 14 Design Considerations
Noise Suppression Design
Adhere to engineering noise-suppression practices when designing a printed circuit board (PCB). Noise suppression
is essential to the proper operation and performance of the modem and surrounding equipment.
Any OEM board design must consider both on-board and off-board generated noise that can affect digital signal
processing. Both on-board and off-board generated noise that is coupled on-board can affect interface signal levels
and quality. Noise in frequency ranges that affect modem performance is of particular concern.
On-board generated electromagnetic interference (EMI) noise that can be radiated or conducted off-board isequally important. This type of noise can affect the operation of surrounding equipment. Most local government
agencies have certification requirements that must be met for use in specific environments.
Proper PC board layout (component placement, signal routing, trace thickness and geometry, and so on)component selection (composition, value, and tolerance), interface connections, and shielding are required for theboard design to achieve desired modem performance and to attain EMI certification.
Other aspects of proper noise-suppression engineering practices are beyond the scope of this guide. Consult noise
suppression techniques described in technical publications and journals, electronics and electrical engineering text
books, and component supplier application notes.

PC Board Layout Guideline
In a 4-layer design, provide adequate ground plane covering the entire board. In 4-layer designs, power and groundare typically on the inner layers. Ensure that all power and ground traces are 0.05 inches wide.
The recommended hole size for the device pins is 0.036 in. +/-0.003 in. in diameter. Use spacers to hold the device
vertically in place during the wave solder process.

Electromagnetic Interference
The following guidelines are offered specifically to help minimize EMI generation. Some of these guidelines are thesame as, or similar to, the general guidelines. To minimize the contribution of device-based design to EMI, youmust understand the major sources of EMI and how to reduce them to acceptable levels.
■ Keep traces carrying high frequency signals as short as possible.
■ Provide a good ground plane or grid. In some cases, a multilayer board may be required with full layers forground and power distribution.
■ Decouple power from ground with decoupling capacitors as close to the device's power pins as possible.
■ Eliminate ground loops, which are unexpected current return paths to the power source and ground.
■ Decouple the telephone line cables at the telephone line jacks. Typically, use a combination of series
inductors, common mode chokes, and shunt capacitors. Methods to decouple telephone lines are similar todecoupling power lines; however, telephone line decoupling may be more difficult and deserves additional
attention. A commonly used design aid is to place footprints for these components and populate asnecessary during performance/EMI testing and certification.
■ Decouple the power cord at the power cord interface with decoupling capacitors. Methods to decouple
power lines are similar to decoupling telephone lines.

MultiConnect® mDotTM MTDOT Developer Guide

67

CHAPTER 14 DESIGN CONSIDERATIONS■ Locate high frequency circuits in a separate area to minimize capacitive coupling to other circuits.
■ Locate cables and connectors to avoid coupling from high frequency circuits.
■ Lay out the highest frequency signal traces next to the ground grid.
■ If using a multilayer board design, make no cuts in the ground or power planes and be sure the groundplane covers all traces.
■ Minimize the number of through-hole connections on traces carrying high frequency signals.
■ Avoid right angle turns on high frequency traces. Forty-five degree corners are good; however, radius turns
are better.
■ On 2-layer boards with no ground grid, provide a shadow ground trace on the opposite side of the board to
traces carrying high frequency signals. This will be effective as a high frequency ground return if it is threetimes the width of the signal traces.
■ Distribute high frequency signals continuously on a single trace rather than several traces radiating fromone point.

Electrostatic Discharge Control
Handle all electronic devices with precautions to avoid damage due to the static charge accumulation.
See the ANSI/ESD Association Standard (ANSI/ESD S20.20-1999) – a document “for the Development of an
Electrostatic Discharge Control for Protection of Electrical and Electronic Parts, Assemblies and Equipment.” This
document covers ESD Control Program Administrative Requirements, ESD Training, ESD Control Program Plan
Technical Requirements (grounding/bonding systems, personnel grooming, protected areas, packaging, marking,equipment, and handling), and Sensitivity Testing.
MultiTech strives to follow these recommendations. Input protection circuitry is incorporated in MultiTech devices
to minimize the effect of static buildup. Take precautions to avoid exposure to electrostatic discharge during
handling.
MultiTech uses and recommends that others use anti-static boxes that create a faraday cage (packaging designed
to exclude electromagnetic fields). MultiTech recommends that you use our packaging when returning a productand when you ship your products to your customers.

USB Design
MultiTech recommends that you review Intel's High Speed USB Platform Design Guidelines for information about
USB signal routing, impedance, and layer stacking. Also:■ Shield USB cables with twisted pairs (especially those containing D+/D-).
■ Use a single 5V power supply for USB devices. See Power Draw for current (ampere) requirements.
■ Route D+/D- together in parallel with the trace spacing needed to achieve 90 ohms differential impedance
for the USB pair and to maintain a 20 mil space from the USB pair and all other signals.
■ If power is provided externally, use a common ground between the carrier board and the device.

68

MultiConnect® mDotTM MTDOT Developer GuideINDEX

Index
schematics
Micro Developer Board .........................................61A
adaptive data rate...........................................................8
antenna .........................................................................30
connecting ...............................................................51
Arduino Shield...............................................................50
assembly diagrams
Micro Developer Board............................................61B
baud rate.......................................................................28
block diagram................................................................52
board components........................................................47
Micro Developer Board............................................60
build options .................................................................14E
electromagnetic interference .......................................67
electrostatic discharge ..................................................68
EMI ................................................................................67
ESD ................................................................................68
EU 868 test mode............................................................9
EUI .................................................................................14F
FCC
grant notes...............................................................31
FCC certification ............................................................35
FCC NoticeClass B .....................................................................34
flow control...................................................................28
G
ground plane.................................................................67

C
cable..............................................................................51
certification
FCC ...........................................................................35
Industry Canada .......................................................36
certifications .................................................................21
Chinese hazardous substances
Chinese version........................................................41
English version .........................................................40
Class B ..........................................................................34
Industry Canada .......................................................35
class C..............................................................................7
Conduit..........................................................................12connectors ....................................................................47

H
handling precautions due to ESD..................................68
hazardous substances ...................................................39
host labeling..................................................................31
I
identifier........................................................................14
IMEI location .................................................................42
Industry Canada ............................................................36
Class B .....................................................................35
install mDot...................................................................49
Micro Developer Board............................................60
interférence des radiofréquences.................................32

Ddata bits ........................................................................28
dc characteristics ..........................................................25
deep sleep mode...........................................................10
devicemaintenance ............................................................33
documentation..............................................................12K
KDB 447498 Section 8 ..................................................31
Llabeling
host ..........................................................................31
labels .............................................................................42

MultiConnect® mDotTM MTDOT Developer Guide

69

INDEX

LED indicators................................................................48
LoRa
range ........................................................................28

RoHS..............................................................................39
RSMA to U.FL cable.......................................................51
S

M

networking ....................................................................14
noise suppression..........................................................67

safetyRF interference ........................................................32
safety standards............................................................67
schematics.....................................................................53
serial settings ................................................................28
sleep mode....................................................................10
SMA to U.FL...................................................................51
specifications.................................................................21
static..............................................................................32
STmicro processor.........................................................12stop bits.........................................................................28
sécuritéinterférences RF.......................................................32

PT

packing list ...............................................................43 58
parity .............................................................................28
PC board layout.............................................................67
peer to peer ....................................................................9
pin information .............................................................25
pinout notes..................................................................28
power draw...................................................................24
preserve session............................................................10

test mode ........................................................................9
trace antenna................................................................30transmission ..................................................................21

maintenance .................................................................33
mbed ............................................................................12
mechanical drawings ...........................15 16 17 18 19 20
Micro Developer Board............................................59
MTAC-LORA...................................................................12
MTCDT...........................................................................12
MultiConnect ................................................................12N

R
radio frequency interference........................................32
range .............................................................................28
receive sensitivity..........................................................21
related products............................................................12

70

U
U.FL ...............................................................................51
U.FL antenna .................................................................30
USB
design consideration................................................68
user responsibility.........................................................33
W
wake..............................................................................10

MultiConnect® mDotTM MTDOT Developer Guide