SPECIFICATION AND PERFORMANCE
Series123A SeriesFile

123A-XXX00_SPEC_1.1

Date

2019/12/06

Scope:

This specification covers the requirements for product performance, test methods andquality assurance provisions of below
P/N

123A-21A00
123A-21B00
123A-21E00
123A-21M00
123A-30A00
123A-30B00
123A-30E00
123A-30M00
123A-40A00
123A-40B00
123A-40E00
123A-40M00

Descriptions

M.2 Socket, H2.1 A Key 0.5 Pitch G/F, Black, Reel
M.2 Socket, H2.1 B Key 0.5 Pitch G/F, Black, Reel
M.2 Socket, H2.1 E Key 0.5 Pitch G/F, Black, Reel
M.2 Socket, H2.1 M Key 0.5 Pitch G/F, Black, Reel
M.2 Socket, H3.0 A Key 0.5 Pitch G/F, Black, Reel
M.2 Socket, H3.0 B Key 0.5 Pitch G/F, Black, Reel
M.2 Socket, H3.0 E Key 0.5 Pitch G/F, Black, Reel
M.2 Socket, H3.0 M Key 0.5 Pitch G/F, Black, Reel
M.2 Socket, H4.0 A Key 0.5 Pitch G/F, Black, Reel
M.2 Socket, H4.0 B Key 0.5 Pitch G/F, Black, Reel
M.2 Socket, H4.0 E Key 0.5 Pitch G/F, Black, Reel
M.2 Socket, H4.0 M Key 0.5 Pitch G/F, Black, Reel

Performance and Descriptions:

The product is designed to meet the electrical, mechanical and environmental performancerequirements specification. Unless otherwise specified, all tests are performed at ambientenvironmental conditions.

RoHS:

All material in according with the RoHS environment related substances list controlled.

MATERIALSNO.

PART NAME

1

Insulator

2

Upper contact

3Lower contact

4

Hold down

DESCRIPTIONLCP, UL94V-0, Black
Phosphor Bronze C5210, contact area gold flash, solder area gold flash, allunder plating 50u” nickel.
Phosphor Bronze C5210, contact area gold flash, solder area gold flash, allunder plating 50u” nickel.
Brass C2680, 100u” matte tin over 50u” nickel platingRATING
Rated Voltage
Rated Current
Operating Temperature
Storage Temperature
Durability50VAC
0.5A-40°C~+85°C-40°C~+85°C
60 mating cycles

The information contained herein is exclusive property of ATTEND. Do not copy and print except that Attend
accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-1 -Item
Low Level ContactResistance

ELECTRICAL

Requirement

Test Condition
Solder connectors on PCB and mate themtogether, measure by applying closed circuitcurrent of 100mA maximum at open circuit
voltage of 20mV (max).
(JIS C5402 5.4)
Mate connectors; apply 300V AC at
60 Hz(rms.) between two adjacent for 1 minute.
(Trip current:0.5mA)(MIL-STD-202 METHOD 301)
Apply 500V DC between adjacent contacts, orcontact and ground.
(MIL-STD-202 METHOD 302)
Mate connector: measure the temperature rise at
rated current after 0.5A/Power contact.
.(EIA-364-70 Method 2.)

Initial: 55mΩ max.
After: Δ20mΩ max.

Dielectric withstanding
VoltageNo breakdown

Insulation Resistance

500 MΩ Min.

Temperature Rating

30°C Max.

Item
Mating/ Unmating Force

Requirement
Mating: 20N Max.
Unmating: 25N Max.

Durability

Finish
1.Contact Resistance:
20mΩ Max. change
2.No Damage

Vibration

Finish
1. No electrical
discontinuity more than
0.1μs.
2 .No Damage
3 .Contact Resistance:
20mΩ Max. change

Shock

Finish
1. No electrical
discontinuity more than
0.1μs.
2 .No Damage
3 .Contact Resistance:

MECHANICAL

Test Condition
Card mating/unmating sequence:a) Insert the card at the angle specified by themanufacturerb) Rotate the card into positionc) Reverse the installation sequence to unmatedOperation Speed:25mm/min.
Measure the force required to mating/unmatingconnector. ( EIA-364-13, Method A.)
After 60 mating and unmating cycles with 1.0mm
thick board at the rate of 25±3mm/min. The
connector shall be of no damage to the housing
or contacts. The connector shall also meet therequirements of contact resistance in theparagraph 5.1. (EIA364-09)
Mate dummy card and subject to the following
vibration conditions, for a period of 30 minutes ineach of 3 mutually perpendicular axis, passing DC
1 mA during the test.
Amplitude: 1.52 mm P-P or 19.6 m/s²
Frequency: 10-55-10Hz
Shall be traversed in 1minute.
(MIL-STD-202 METHOD 201)
Solder connectors on PCB and mate them
together, subject to he following shock conditions,
3 shocks shall be period along 3 mutuallyperpendicular axis, passing DC 1mA current
during the test. A (50G,11ms Half-sine)(MIL-STD-202 METHOD 213)20mΩ Max. change

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.
本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-2 -Item
Thermal Shock

ENVIRONMENTAL

Requirement

Test Condition
StageTemp. ±5°(°C)
Time (Minute)t1-55°C
30
t2-55°C~+85°C
5t3
+85°C
30
t4
+85°C~-55°C
5Test time: 5 cycles(MIL-STD-202 METHOD 107)
Mated Connector 105°C, 120 hours,(EIA-364-17, Method A.)

Finish
1. Contact Resistance:
20mΩ Max change
2. No abnormality

Temperature Life

Contact Resistance:
20mΩ Max. change

Cold ResistanceContact Resistance:
20mΩ Max. change

Humidity

Contact Resistance:
20mΩ Max change
Insulation Resistance:
100MΩ (Min)

Salt SprayContact Resistance:
20mΩ Max change
No Damage

Solder connectors on PCB and mate them
together, expose to -55 for 96hrs. Uponcompletion of the exposure period, the test
specimens shall be conditioned at ambient room
conditions for 1 of 2hrs, after which the specified
measurements shall be performed.(EIA364-59)
Humidity storage at +40±3°C with
90±5% RH for 96 hours.
(EIA364-31)
5 ± 1% salt solutions, at 35 ± 2°C duration 24hours. Connectors detached (MIL-STD-1344)

SOLDER ABILITY
ItemSolder abilityRequirement
95% of immersed area
must show no voids , pinholes.

Resistance to soldering
heatNo melting, cracks orfunctional damage
allowed

Test Condition
Dip solder tails into the molten solder(held at 245±5°C) up to0.5mm from the tip of tails for 3±0.5 seconds.
(MIL-STD-202 METHOD 208)
All connectors designed for PCB soldering within
this specification must be able to withstand theheat from solder oven according to the graphbelow. The cycle should be repeated twice.
(MIL-STD-202 METHOD 210)

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.
本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-3 -Preheating temperature: 150 ~ 200°C, 60~120 seconds
Liquidus temperature (TL): 217°C, 60~150 seconds
Peak temperature: 260°C 5 seconds
Time within 5 °C of peak temperature (Tc): 255°C, 30seconds

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.
本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-4 -Table: Products Qualification Test Sequence
No.

Test item

ABC

Test Group and Sequence
DEFGHI

1,6

1,3

1,31,31,31Contact Resistance

2Insulation Resistance3

Dielectric Withstanding Voltage

4Temperature Rise

5Mating/ Unmating Force

3,5

6Durability

47

Vibration

8Shock9

Thermal Shock10Temperature Life

11

Cold Resistance

12Humidity

13

Salt Spray

14

Solder Ability

15

Resistance to Soldering HeatSample Quantity

1,3

1,3

1,3

1,4JK

2,52222222321144444444444

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.
本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-5 -