SMD291SNL50T3
Datasheet revision 1.3

www.chipquik.com

Solder Paste No-Clean SAC305 in Jar 50g T3 Mesh
Product Highlights
Printing speeds up to 100mm/sec
Long stencil life
Wide process window
Clear residue
Low voiding
Specifications
Alloy:
Mesh Size:
Micron (µm) Range:
Flux Type:
Flux Classification:
Metal Load:
Melting Point:
Packaging:
Shelf Life:

Excellent wetting compatibility on most board finishes
Print grade
Compatible with enclosed print heads
Passes BONO test @1.56%
RoHS 3 and REACH compliant

Sn96.5/Ag3.0/Cu0.5
T325-45
Synthetic No-CleanREL0
88.5% Metal by Weight217-220°C (423-428°F)
Jar 50g
Refrigerated >6 months, Unrefrigerated >2 months*See notes below:*Shelf Life Notes: Chip Quik® solder paste is good past its quoted shelf life, regardless of refrigeration. Before use, visuallyinspect the solder paste to ensure it is not dried out or clumpy, or check stencil release. If stored in a jar, stir the productthoroughly for 2-3 minutes before inspection and use.
Chip Quik® solder paste is manufactured using high quality synthetic flux and precision atomized metal powder. Chip Quik®
solder paste is guaranteed for 12 months from date of manufacture, regardless of refrigeration. If you have any issues withour solder paste, please contact Chip Quik® directly for no charge warranty replacement. Please retain original bill of sale,and solder paste in original container as we may request its return for internal R&D testing purposes.
Printer Operation
Print Speed: 25-100mm/sec
Squeegee Pressure: 70-250g/cm of blade
Under Stencil Wipe: Once every 10-25 prints, or as necessary
Stencil Life>8 hours @ 20-50% RH 22-28°C (72-82°F)>4 hours @ 50-70% RH 22-28°C (72-82°F)
Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Refrigerate at 3-8°C (37-46°F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25°C(68-77°F) before use.
Transportation
This product has no shipping restrictions. Shipping below 0°C (32°F) or above 25°C (77°F) for normal transit times by groundor air will not impact this product’s stated shelf life.

1© 1994-2022 Chip Quik® Inc.

Recommended Profile
Reflow profile for Sn96.5/Ag3.0/Cu0.5 solder assembly, designed as a starting point for process optimization.

249°C (480°F)

217°C (423°F)
175°C (347°F)
Temperature
150°C (302°F)

25°C (77°F)
0sec

90sec

180sec210sec240sec270secTime

Test Results
Test J-STD-004 or otherrequirements as stated
Copper Mirror
Corrosion
Quantitative Halides
Electrochemical Migration
Surface Insulation Resistance 85°C,
85% RH @ 168 Hours
Tack Value
Viscosity – Malcom @ 10 RPM/25°C(x103mPa/s)
VisualConflict Minerals Compliance
REACH Compliance

Test Requirement

Result

IPC-TM-650: 2.3.32
IPC-TM-650: 2.6.15
IPC-TM-650: 2.3.28.1
IPC-TM-650: 2.6.14.1
IPC-TM-650: 2.6.3.7

L: No breakthrough
L: No corrosion
L: <0.05%
L: <1 decade drop (No-clean)
L: ≥100MΩ (No-clean)

IPC-TM-650: 2.4.44
IPC-TM-650: 2.4.34.4

64g
Print: 155-215, Dispense: 125-170

IPC-TM-650: 3.4.2.5
Electronic Industry Citizenship
Coalition (EICC)
Articles 33 and 67 of Regulation (EC)No 1907/2006

Clear and free from precipitation
CompliantConforms to the following Industry Standards:
J-STD-004B, Amendment 1 (Solder Fluxes):
J-STD-005A (Solder Pastes):
J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders):
RoHS 3 Directive (EU) 2015/863:

2© 1994-2022 Chip Quik® Inc.

Contains no substance >0.1% w/w thatis listed as a SVHC or restricted foruse in solder materials

Yes
Yes
Yes
Yes