RoHSSpecification规 格 书
Customer Name：
客户名称：

Customer P/N：客户品号：

Factory P/N： HL-A-5730D1W-S1-08-HR3
公司品号：

Sending Date：
送样日期：

Client approval

Hongli approval

客户审核鸿利光电审核Approval

Audit

Confirmation

Approval

Audit

Confirmation

核准确认

制作

核准确认

制作

林德顺

□ Qualified
接受

黄雪梅

DATE:
日期：

□ Disqualified
不接受

Adr：Airport High-tech Industry Base Jingu South Road(XianKe 1st Road Intersection),
Huadu District,Guangzhou,China
地址：中国广州市花都区机场高新科技产业基地金谷南路与先科一路交汇

Tel/电话：020-86733333

Fax/传真：020-86733883 8673393886733265

Web/网址：www.honglitronic.com
注:1.此规格书以中英文方式书写,若有冲突以中文版本为准文本.
2.此规格书的最终解释权归广州鸿利光电股份有限公司
3.此规格书的有效期限为两年,自盖章或签字之日起计算,期满时双方可以续签协议,但应采用书面形式

SPEC NO：B-15-A-0284

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DATE: MAY/23/2015

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HL-A-5730D1W-S1-08-HR3Features( 特征）PLCC-2 Package.(PLCC-2 封装）
Extremely wide viewing angle.（宽的发光角度）
Suitable for all SMT assembly and solder process.（适用于所有的SMT组装和焊接工艺）
Available on tape and reel.（适用于载带及卷轴）
Moisture sensitivity level: Level 4.（防潮等级 Level 4）
Package:2500pcs/reel..(包装每卷2500PCS）
RoHS compliant. (RoHS 认证）
ATTENTION

Description（描述）

OBSERVE PRECAUTIONSFOR HANDLINGELECTROSTATICDISCHARGESENSITIVE
DEVICES

The White LED which was fabricated using a blue chip and the phosphor
白光LED由蓝光芯片与荧光粉激发而成

注意：操作时应注意静电敏感释放设备装置

Applications（应用）■ Optical indicator（光学指示）

Package Dimensions（封装尺寸）■ Indoor display（室内显示）■ Automotive lighting（汽车照明）■ Backlight for LCD, switch and Symbol, display（LCD背光、转换器，开关和标志，显示器等）■ Tubular light application（用于日光灯管）■ General use（一般应用）

Recommended Soldering Pattern（建议焊盘尺寸图）

Notes:（备注）1. All dimension units are millimeters.（所有标注尺寸单位为毫米）2.All dimension tolerance is ±0.15mm unless otherwise noted.（除特别标注外，所有尺寸允许公差±0.15mm ）SPEC NO：B-15-A-0284

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HL-A-5730D1W-S1-08-HR3
Selection Guide（选择指南）Part No. 型号

Chip Materials 芯片材料

Lens Type 胶体类型

HL-A-5730D1W-S1-08-HR3

InGaN

Yellow Diffused

Mass Production list（批量生产目录）Part No. 型号

CCT（K）Min

CCT（K）Typ

CCT（K）
Max

Φ（lm）
Min

Φ（lm）
Typ

Test Conditions
测试条件

5700

6000

6500

5560

IF=150mA

4750

5000

5300

5560

IF=150mA

3800

4000

4250

5560

IF=150mA2800

3000

3100

5358

IF=150mA

HL-A-5730D1W-S108-HR3

Electrical / Optical Characteristics at Ta=25°C

电性与光学特性

Parameter（参数）

Symbol
（符号）

Min.
（最小）

Typ.
（平均）

Max.
（最大）

Units
（单位）

Test Conditions
测试条件

Forward Voltage
正向电压

VF

2.8

--

3.6

V

IF=150mA

Viewing Angle
角度2θ1/2--

120--

Deg

IF=150mA

Color Rendering Index
显色性指数

Ra80----

Reverse Current
反向电流IR----10

IF=150mA

μA

VR = 5V

Note:(备注）21/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
21/2 是半值角,指光强是光学中心线光强的1/2处到光学中心线的角度
2. The above luminous flux measurement allowance tolerance is ±10%.
上述发光通量的测试允许公差为±10%
3. The above Color Rendering Index measurement allowance tolerance is ±2以上显色性指数的测试允许公差为±2
4. The above forward voltage measurement allowance tolerance is ±0.1V.
以上所示电压测量误差±0.1V
5. The above color coordinates measurement allowance tolerance is ±0.003.
以上所示坐标测量误差±0.003

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HL-A-5730D1W-S1-08-HR3
Absolute Maximum Ratings at Ta=25°C

绝对最大额定值Parameter（参数）

Symbol（符号）Rating（值）Units（单位）Power Dissipation（功耗）

Pd

500mW

Forward Current（正向电流）

IF150mA

Peak Forward Current [1]（峰值正向电流）

IFP

180mA

Reverse Voltage（反向电压）

VR5VElectrostatic Discharge (HBM)（静电）

ESD

1000V

Operating Temperature（操作温度）

Topr-40 ~ +85℃

Storage Temperature（保存温度）

Tstg-40 ~ +100℃

Rthj-s

22℃/W

Tj

115℃

Thermal Resistance （Junction / Solderingpoint）
热阻Junction Temperature结温Note:（备注）1. 1/10 Duty cycle, 0.1ms pulse width.（脉宽0.1ms,周期1/10）

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HL-A-5730D1W-S1-08-HR3
Typical optical characteristics curves 典型光学特性曲线

Soldering Temperature vs. Forward Current

Forward Current VS. Relative Intensity

焊盘温度与正向电流特性曲线

正向电流与相对光强特性曲线

1.4
Relative Luminous Intensity

Forward Current(mA)

200150

10050

1.2
1.0
0.8
0.6
0.4
0.2
0.0

0020406080
Soldering Temperature

0100Ts(℃)

50100150200

Forward Current(mA)

Forward Voltage VS. Forward Current

Ambient Temperature VS. Relative Intensity

正向电压与正向电流特性曲线

环境温度与相对光强特性曲线

3.0160Relative Luminous Intensity

140
Forward Current(mA)

120
10080604020

2.52.01.5

1.00.500 0.5 1 1.5 2 2.5 3 3.5
Forward Voltage (V)SPEC NO：B-15-A-0284

REV NO: A/10.0-40-20020

Ambient Temperature

DATE: MAY/23/2015

40

6080Ta(℃)

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HL-A-5730D1W-S1-08-HR3
Typical optical characteristics curves 典型光学特性曲线
Relative spectral emission

Cool White

相对光谱分布特性曲线

Warm White

Neural White

Relative luminous intensity

1.00.80.6

0.4

0.20.0380460

540620
Wavelength(nm)Radiation diagram

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辐射图特性曲线

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HL-A-5730D1W-S1-08-HR3

Y0.44

3000K

0.42

W42
W430.44000K

W44

W52 W62

W53 W63

W54

W64

N52
N420.38

N535000K
N43

N120.36

C62
N136000K
C420.34

C63

C32
C43
C33

0.32

0.3
0.3

0.32

0.34

0.36

0.38

0.4

0.42

0.44

0.46

X

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HL-A-5730D1W-S1-08-HR3

Bin Range of Chromaticity Coordinate
CCT 色温Bin Code Bin代码

Bin区分类及色坐标范围

CIE_x

CIE_y0.3205

0.34810.31170.3393

C32 6000-6500K

Bin Code Bin代码

CIE_x

CIE_y

0.32110.34680.32940.3542

C42 5700-6000K
0.3131

0.329

0.3296

0.34290.32130.33710.32190.33600.32130.33710.32190.33600.3131

0.329

0.3296

0.34296000K

C33 6000-6500K

C43 5700-6000K
0.31500.31900.32980.33150.3226

0.32620.32270.32510.3376

0.3616

0.34610.36850.34610.36850.35450.3754

C62 5000-5300K

N12 4750-5000K
0.34510.35610.35300.36250.33720.34970.34510.35610.33720.34970.34510.35610.34510.35610.35300.3625

5000K

C63 5000-5300K

N13 4750-5000K
0.34410.34370.35140.3496

0.33680.33780.34410.34370.37310.38530.38390.39200.38390.39200.39470.3987

N42 4000-4250K

N52 3800-4000K
0.38030.37770.39030.38390.37030.37160.38030.37770.37030.37160.38030.37770.38030.37770.39030.38394000K

N43 4000-4250K

SPEC NO：B-15-A-0284

N53 3800-4000K
0.37670.36340.38580.36900.36750.35780.37670.3634REV NO: A/1

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HL-A-5730D1W-S1-08-HR3

Bin Range of Chromaticity Coordinate
CCT 色温Bin Code Bin代码

Bin区分类及色坐标范围

CIE_x

CIE_y

0.43540.41420.44300.4165

W42 3000-3100K

CIE_x

CIE_y

0.4316

0.40590.43900.4082

W43 3000-3100K
0.43900.40820.43500.39980.4316

0.40590.42790.39750.42790.39750.44300.41650.43500.39980.45050.4189W44 3000-3100K

3000K

Bin Code Bin代码

W52 2900-3000K
0.43100.39150.44630.41060.42410.38920.43900.40820.43900.40820.43500.39980.44630.41060.44200.4022

W53 2900-3000K

W54 2900-3000K
0.44200.40220.43780.39390.43500.39980.43100.39150.45050.41890.44630.41060.45810.42120.4536

0.4129W62 2800-2900K

W63 2800-2900K
0.4536

0.41290.44920.40450.44630.41060.44200.40220.44200.40220.44920.40450.4447

0.39620.43780.3939W64 2800-2900K

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HL-A-5730D1W-S1-08-HR3
Reliability Test Items And Conditions 信赖性测试项目及条件
Test Items
项目Ref. Standard
参考标准

Test Condition
测试条件Time时间

Quantity
数量

Ac/Re
接收/拒收

Reflow
回流焊

JESD22-B106

Temp:260℃max
T=10 sec

3 times.

22Pcs.

0/1

Temperature Cycle
温度循环

JESD22-A104

100℃±5℃ 30 min.
↑↓5 min-40℃±5℃ 30 min.

100 Cycles

22Pcs.

0/1

High Temperature Storage
高温保存

JESD22-A103Temp:100℃±5℃

1000Hrs.

22Pcs.

0/1

Low Temperature Storage
低温保存

JESD22-A119

Temp:-40℃±5℃

1000Hrs.

22Pcs.

0/1

Life Test
常温通电

JESD22-A108

Ta=25℃±5℃
IF=150mA

1000Hrs.

22Pcs.

0/1

High Temperature
High Humidity Life Test
高温高湿通电

JESD22-A101

85℃±5℃/ 85%RH
IF=100mA

1000Hrs.

22Pcs.

0/1

Failure Criteria 失效判定标准
Test Items
项目Symbol
符号

Failure Criteria
判定标准

Test Condition
测试条件

Min. 最小Max. 最大

Forward Voltage
正向电压VF

IF=150mA--U.S.L*)x1.1

Reverse Current
反向电流IR

VR = 5V--10uALuminous Flux
光通量Lm

IF=150mAL.S.L*)x0.7--U.S.L: Upper Specification Limit 规格上限

L.S.L: Lower Specification Limit 规格下限*The technical information shown in the data sheets are limited to the typical characteristics andcircuit examples of the referenced products. It does not constitute the warranting of industrial
property nor the granting of any license.
数据工作表中所示的技术信息仅限于典型特征和电路实例引用的产品.它既不构成工业特性的保证,也不构成任何许
可的授权SPEC NO：B-15-A-0284

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HL-A-5730D1W-S1-08-HR3
SMT Reflow Soldering Instructions SMT回流焊说明

1.Reflow soldering should not be done more than two times. 回流焊不可以做两次以上
2.When soldering , do not put stress on the LEDs during heating
当焊接时，不要在材料受热时用力压胶体表面

Soldering iron 烙铁焊接1.When hand soldering, keep the temperature of iron below less 300℃ less than 3 seconds
当手工焊接时，烙铁的温度必须小于300℃，时间不可超过3秒

2.The hand solder should be done only one times
手工焊接只可焊接一次

Repairing 修补Repair should not be done after the LEDs have been soldered. When repairing is unavoidable,
a double-head soldering iron should be used (as below figure). It should be confirmed in advancewhether the characteristics of LEDs will or will not be damaged by repairing.
LED回流焊后不应该修复，当修复是不可避免时，必须使用双头烙铁（如下图），但必须事先确认此种方式会或不会
损坏LED本身的特性。

Cautions 注意事项The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on
the top of package. The pressure to the top surface will be influence to the reliability of the LEDs.
Precautions should be taken to avoid the strong pressure on the encapsulated part. So when use
the picking up nozzle, the pressure on the silicone resin should be proper.
LED封装为硅胶，故LED胶体表面较软，用力按压胶体表面会影响LED可靠性，因此应有预防措施避免在封装的零件上的强大压力，当使用吸嘴时，胶体表面的压力应是恰当的。

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HL-A-5730D1W-S1-08-HR3Handling Precautions 处理防备措施Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its
characteristic significantly reduces thermal stress, it is more prone to damage by external mechanical force . As a result, Special handling precautions must be observed during assembling using silicone encapsulated LED products, Failure to comply might leads to damage and premature failure ofthe LED.
相对环氧树脂较脆较硬而言，硅胶封装较柔软且有弹性，虽然它的特性大大减少了热应力，但易受机械外力损坏，因此在手工处理方面须要对硅胶封装材料做预防措施，若未按要求操作，可能会导致LED损坏和光衰

1.Handle the component along the side surface by using forceps or appropriate tools; do not directly
touch or Handle the silicone lens surface, it may damage the internal circuitry.
通过使用适当的工具从材料侧面夹取，不可直接用手或尖锐金属压胶体表面，它可能会损坏内部电路

2.The outer diameter of the SMD pickup nozzle should not exceed the sizeof the LED to prevent air leaks. The inner diameter of the nozzle should beas large as possible. A pliable material is suggested for the nozzle tip to avoid
scratching or damaging the LED surface during pickup. The dimensions of thecomponent must be accurately programmed in the pick-and-place machine toinsure precise pickup and avoid damage during production.
为防止气压泄漏，SMD吸咀外径不可以超过LED尺寸，吸咀内径尺寸应尽可能大，吸咀顶端材
质建议采用柔软材料以防在吸取期间刮伤或损坏LED胶体表面，元件的尺寸必须在取放机里准确的编程好，以确保精确的吸取和避免生产过程中的损害

3.Do not stack together assembled PCBs containing
LEDs. Impact may scratch the silicone lens or damage
the internal circuitry

4.Not suitable to operate in acidic environment, PH<7
不可用在PH<7的酸性场所

不可将模组材料堆积在一起，它可能会损坏内部电路<PH7
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5.LED operating environment and sulfur element composition cannot be over 100PPM in the LEDmating usage material.
LED工作环境及与LED适配的材料中硫元素及化合物成份不可超过100PPM

6.When we need to use external glue for LED application products, please make sure that the external glue matches the LED packaging glue. Additionally ,as most of LED packaging glue is silica gel,and it has strong Oxygen permeability as well as strong moisture permeability; in order to prevent external material from getting into the inside of LED, which may cause the malfunction of LED, the single
content of Bromine element is required to be less than 900PPM,the single content of Chlorine element
is required to be less than 900PPM,the total content of Bromine element and Chlorine element in theexternal glue of the application products is required to be less than 1500PPM
当我们需要使用外封胶涂抹LED产品时，应确保外封胶与LED封装胶水相匹配，因为大多数LED的封装胶水为硅胶，它有较强的氧化性和较强的吸湿性，必须防止外封材质进入LED内部以造成LED的损伤，单一的溴元素含量要求小于900PPM，单
一氯元素含量要求小于900PPM，在涂抹LED产品时要求外封胶溴元素与氯元素总含量必须小于1500PPM

7.Other points for attention, please refer to our LED user manual.
其它注意事项请参照我们的LED使用手册SPEC NO：B-15-A-0284

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HL-A-5730D1W-S1-08-HR3
Label 标签IV: Luminous intensity rank 亮度等级电压等级
VF: Forward voltage rank
色坐标X/Y: Coordinate rank
色温
TC: Color temperature

Tape Specifications (Units : mm)

载带规格（单位：mm)

Reel Dimensions
卷轴尺寸

Moisture Resistant Packaging

防潮带包装

Note: The tolerances unless mentioned is ±0.1mm , Unit: mm

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注：标注公差为±0.1mm ，单位：mm

DATE: MAY/23/2015

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