SPECIFICATION AND PERFORMANCE
Series124A-3 SeriesFile

124A-3_SEPC

Date

2019/6/12

Scope:

This specification covers the requirements for product performance, test methods andquality assurance provisions of below table
P/N
124A-40A03
124A-40A13
124A-52A03
124A-52A13
124A-80A03
124A-80A13
124A-92A03
124A-92A13

DESCRIPTION
DDR4 SODIMM Socket, Horizontal 4.0H, STD, G/F, Black, Reel, Solder PEG
DDR4 SODIMM Socket, Horizontal 4.0H, RVS, G/F, Black, Reel, Solder PEG
DDR4 SODIMM Socket, Horizontal 5.2H, STD, G/F, Black, Reel, Solder PEG
DDR4 SODIMM Socket, Horizontal 5.2H, RVS, G/F, Black, Reel, Solder PEG
DDR4 SODIMM Socket, Horizontal 8.0H, STD, G/F, Black, Reel, Solder PEG
DDR4 SODIMM Socket, Horizontal 8.0H, RVS, G/F, Black, Reel, Solder PEG
DDR4 SODIMM Socket, Horizontal 9.2H, STD, G/F, Black, Reel, Solder PEG
DDR4 SODIMM Socket, Horizontal 9.2H, RVS, G/F, Black, Reel, Solder PEG

Performance and Descriptions:

The product is designed to meet the electrical, mechanical and environmental performancerequirements specification. Unless otherwise specified, all tests are performed at ambientenvironmental conditions.

RoHS:

All material in according with the RoHS environment related substances list controlled.

MATERIALSNO.

PART NAME

1HOUSING

2CONTACT

3LATCH4PEG

DESCRIPTIONLCP E6808, UL94V-0, Black
Phosphor Bronze C5210 0.15t, gold flash on contact area, gold flash on
solder area, 50u” min. nickel under plated over all
Stainless Steel SUS301 0.3t
Stainless Steel SUS301 0.3t, 50u” min. matte-tin plating over all, 50u” min.
nickel under plating

RATING
Rated Voltage
Rated Current
Operating Temperature
Storage Temperature
Durability

25 VAC
0.6A/ Pin
-40°C to 85°C
-40°C to 85°C
50 Cycles

The information contained herein is exclusive property of Attend. Do not copy and print except that Attend
accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-1 -ELECTRICAL
Item

Low level
Contact ResistanceDielectric Withstanding
VoltageInsulation Resistance

Requirement
Initial: 50mΩ max.
Final: 60mΩ max

No evidence of flash overor insulation shall takeplace. Current leakage:
1mA Max.
Initial :250MΩ Min.
Final :100MΩ Min.

Test Condition
Solder connectors on PCB and mate them
together, measure by applying closed circuitcurrent of 100mA maximum at open circuit
voltage of 20mV maximum.
EIA-364-23
500VAC for 1 minute.
Test between adjacent circuits of unmatedconnector.
EIA-364-20
Impressed voltage 500VDC. Test between
adjacent circuits of unmated connector.
EIA-364-21

MECHANICAL
Item
Mating Force/ Unmating Force

Requirement
Mating Force: 59.8N Max.
Un-mating Force: 44.6N
Max.

Durability

50 cycles No evidence ofphysical damage.

Durability(Preconditioning)

3 cycles No evidence ofphysical damage.

Vibration

No electrical discontinuity
greater than 1μ sec shalloccur. No evidence ofphysical damage.

Mechanical ShockNo electrical discontinuity
greater than 1μ sec shalloccur. No evidence ofphysical damage.

Test Condition
Card mating/un-mating sequence:a) Insert the card at the angle specified by themanufacture.
b) Rotate the card into position.
c) Reverse the installation sequence to unmating.
Operation Speed: 25.4mm per minute.
Measure the force required to mate/Un-mateconnector.
EIA-364-13 Method A
The sample should be mounted in the testerand fully mate and un-mated the rate of
25.4mm per minute.
EIA-364-09
The sample should be mounted in the testerand fully mate and un-mated the rate of
25.4mm per minute.
EIA-364-09.
15 minutes in each of 3 mutually perpendicular
directions. Both mating halves should be rigidly
fixed so as not to contribute to the relative
motion of one contact against another.
EIA-364-28, Test condition VII, Test condition
latter D
50G, 11ms
Half sine, No. of Drops: 3 drops each to normal
and reversed directions of X, Y, and Z axes,
totally 18 drops. EIA-364-27B

The information contained herein is exclusive property of Attend. Do not copy and print except that Attendaccepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-2 -ENVIRONMENTAL
Item

Requirement
Contact Resistance 60mΩmax.

Thermal ShockContact Resistance 60mΩmax.

Temperature Life

Contact Resistance 60mΩmax.
Contact Resistance 60mΩmax.

Humidity
Temperature Cycle

Temperature Cycling

Mixed Flowing Gas
Thermal Disturbance

Salt SprayContact Resistance 60mΩmax
Contact Resistance 60mΩ
maxContact Resistance 60mΩmax

Test Condition
Mated Connector.
Initial measurement, cold shock and vibration.
Cycle the connector between 25±3°C at
85±3%RH and 65±3°C at 50±3%RH.
Ramp times should be 0.5 hour and dwell
times should be 1.0 hour.
Dwell times start when the temperature andhumidity have stabilized within the specified
levels. Perform 24 such cycles.
EIA-364-31, method III
Mated Connector.
Units are non-operating
Temperature -55°C to +85°C
30 minute dwell at each high and low temp.
extreme, 10 cycles
EIA-364-32,test condition I
Mated Connector,105°C, 96 hours
EIA-364-17,method A
Mated connector
Cycle the connector or socket between
15°C±3°C and 85°C±3°C, as measure on thepart. Ramps should be a min. of 2°C per
minute, and dwell times, should insure that thecontacts reach the temperature extremes ( amin. of 5 minutes) Humidity is not controlled.
Perform 500 such cycles.
Mated connector, duration 120hours
EIA-364-65, class IIA
Cycle the connector or socket between 15°C±3°C and 85°C±3°C, as measured on the part.
Ramps should be a min. of 2°C per minute,and dwell times should insure that the contacts
reach the temperature extremes (a min. of 5minutes) Humidity is not controlled. Perform
10 such cycles
Salt concentration: 5±1%Temperature 35±2°C
Test time: 48 hours, ager salt is removed byrunning water and a drop is removed, it ismeasured
EIA-364-26

The information contained herein is exclusive property of Attend. Do not copy and print except that Attendaccepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-3 -SOLDER ABILITY
Item
Solder AbilityRequirement
Solder coverage 95% MIN.

Reflow Soldering Heat
ResistanceNo evidence of physicaldamage

Test Condition
Solder 5±0.5 seconds.
Solder temperature:245±5°C
EIA-364-52
Pre-heat: 150~215°C, 30~120 sec.
Reflow: 230°C Min, 40 sec Min.
Peak temp: 260°C Max, 10 sec Max.

Reflow Profile

Preheating temperature: 150 ~ 215°C, 30~120 seconds
Liquidus temperature (TL): 217°C, 60~150 seconds
Peak temperature: 260°C
Time within 5 °C of peak temperature (Tc): 255°C, 10seconds

The information contained herein is exclusive property of Attend. Do not copy and print except that Attendaccepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-4 -Test sequence:
Test item

Test groupABCDEFG

H
1,41

Examination of product

1,91,81,101,101,101,121,52

Low level contact resistance

2,62,72,5,7,
92,5,7,
92,5,7,
92,5,7,9,112,4

3

Insulation resistance

3,74

Dielectric withstanding voltage

4,85Mating/ un-mating force

6Durability

433337Durability (Preconditioning)

5888Vibration89Mechanical shock

610Solderability

11

Thermal shock

12

Temperature life

413

Thermal cycling

614

Humidity temperature cycling

15

Thermal disturbance616

Mixed flowing gas

817Salt spray

18

Reflow soldering heat
resistance
Quantities of samples

3,65

103
444

63
255

5

55

555The information contained herein is exclusive property of Attend. Do not copy and print except that Attend
accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-5 -