PRODUCT BRIEF

TwinPro®

BigTwin®

FatTwin®

GrandTwin™

Executive Summary
TABLE OF CONTENTS
Executive Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Supermicro Twin Family . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Supermicro TwinPro . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Supermicro BigTwin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Supermicro FatTwin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Supermicro GrandTwin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Example Use Cases . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Summary & Additional Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

SUPERMICROAs a global leader in high performance, high efficiency server technology
and innovation, we develop and provide end-to-end green computing
solutions to the data center, cloud computing,IT, big data,.................. 7
Summary and Additional Information . . . . . .enterprise
HPC, and embedded markets. Our Building Block Solutions® approachallows us to provide a broad range of SKUs, and enables us to build anddeliver application-optimized solutions based upon your requirements.

© 2022 Copyright Super Micro Computer, Inc. All rights reserved

The Supermicro Twin family of products has been designed forthe most demanding applications while also reducing OPEX
through innovative design that reduces electricity usage and Ewaste. The Twin family consists of three product families that all
offer the benefits of shared power and cooling systems andutilize the 3rd Gen Intel® Xeon® Scalable processors.

Supermicro Twin Family
Multi-node systems are designed so that all servers (nodes) arelocated within a single chassis with shared power supplies andfans. Supermicro has developed a product family that takes
advantage of the latest available computing, storage, andnetworking technologies in the Twin product family. Thesesystems are available in the TwinPro®, BigTwin®, FatTwin®, andGrandTwin™ product lines. These product lines offer the latest
CPU technology in various form factors and offer a significantly
increased computing power and memory capacity density
compared to traditional rackmount servers while reducing

June 20221

power consumption. For example, a Supermicro BigTwin with four nodes and dual processors in each node results in 8 CPUs injust 2U. This increased density compares to a typical 1U rackmount server with 2 CPUs in 1U, a 100% increase in computingdensity. In addition, a single chassis containing multiple compute nodes reduces the amount of sheet metal used and allows
for upgrading the nodes as needed. This also lowers possible E-waste as only one node needs to be updated or upgraded at atime.
The airflow over a hot surface (CPU) needs to be removed so that the CPU does not overheat. Since shared fans can be larger insize (diameter), they can run at lower speeds to produce the same airflow CFM (cubic feet per minute) needed to cool theprocessors. Larger fans running at lower speeds use less electricity than smaller fans do. The CFM required can be calculated
and fan speed adjusted accordingly.
Building blocks enable IT administrators to create environments from multiple components that match their specificworkloads. The Twin product lines with flexible computing, storage, and networking capabilities allow an entire IT environment
to be constructed and deployed to match specific workloads and the physical design of a data center.
The Twin family consists of three product lines, the TwinPro®, BigTwin®, and FatTwin®. All are configured with the 3rd Gen Intel
Xeon Scalable processors, with a maximum thermal design profile (TDP) of 270 Watts supported in specific configurations. The
nodes in the BigTwin series can also be liquid-cooled for environments where maximum cooling is needed and data centercooling systems cannot maintain proper operating temperatures.

© 2022 Copyright Super Micro Computer, Inc. All rights reserved

June 20222Supermicro TwinPro
The Supermicro TwinPro is the entry point into the Twin family. Four nodes, each containing two CPUs, can be configured in theTwinPro. Each node has 16 DIMMs, which give each node up to 4TB of high speed memory. On the motherboard are dual 10GbE
network interfaces, ideal for OS access and cluster management. TwinPro systems can also be configured with two redundant
2200W Titanium Level (96%) power supplies. Up to 6 hot-swappable SAS or SATA drives and two internal M.2 NVMe SSDs per
node can be used for direct attached storage. Expansion slots for each node include two low-profile PCI-E 4.0 slots x16, ideal forhand-bandwidth network adapters or FPGAs. Both a 1U 2-Node and 2U 4-Node (pictured here) are available.

Figure 1 - TwinPro Servers

Supermicro BigTwin
The Supermicro BigTwin continues to lead the industry with systems designed for low OPEX and high performance. The BigTwin
is available in a 2U form factor, with either two or four nodes available. Each node can accommodate up to two 3rd Gen IntelXeon Scalable processors. The 2-Node system includes custom heat pipes to optimize airflow to support dual-processors up to270W TDP, the maximum available in the Intel product lineup. The 4-Node system has a vapor chamber heatsink with an airchannel to accommodate dual processors, up to 205W TDP, a significant thermal design feature optimized for hyper-converged
and high-performance storage solutions. Various storage options are available for the nodes, including up to twelve 2.5" hotswap NVMe/SAS/SATA or six 3.5" drives, including Helium HDDs to maximize storage capacities for scale-out storage solutions.
Additionally, two M.2 SATA or NVMe drives are supported with optional NVMe HW RAID 1 for boot redundancy, based on Marvell®
88NR2241 intelligent NVMe switch. Each compute-optimized node contains two PCI-E 4.0 slots and SAS support with Broadcom
SAS3808/SAS3908 controllers. Each storage-optimized node has three PCI-E 4.0 slots and SAS support with Broadcom© 2022 Copyright Super Micro Computer, Inc. All rights reservedJune 2022

3

SAS3808/SAS3816 and an optional SAS3916, supporting up to 12 SAS/SATA drives. In addition, the BigTwin family includes up
to 16 DIMM slots per server, accommodating up to 6TB per node when using Intel® Optane™ Persistent Memory 200 series.
Onboard networking options for BigTwin nodes are highly flexible with AIOM PCI-E 4.0 add-on cards, compliant with OCP (OpenCompute Project) 3.0 SFF standards.

Figure 2 - BigTwin Servers

Figure 3 - BigTwin Server with Liquid CoolingSupermicro FatTwin
Supermicro's FatTwin product family is a 4U multi-node system containing eight or four nodes. A true workhorse, the FatTwin
is a battle tested platform deployed in some of the largest cloud datacenters. In addition, its flexibility allows customers tostandardize on one platform for both their storage and compute needs in today's infrastructure environments.
Each node can contain up to two 3rd Gen Intel Xeon Scalable processors, and each node is designed to run with only a single CPU
installed on the dual-CPU motherboard. These systems are designed with front facing nodes for easy serviceability. In a hotaisle, cold-aisle data center, the ability to service these systems from the front (cold aisle) makes servicing more accessible and© 2022 Copyright Super Micro Computer, Inc. All rights reservedJune 20224

faster than working in a hot-aisle containment setup. The hot-swappable drive bays can accommodate NVMe, SAS, or SATA
storage devices. A single GPU can also be installed for HPC and AI/ML applications. Additionally, 16 DIMM slots are available oneach node, accommodating up to 4TB of DRAM or 6TB when using Intel Optane™ Persistent Memory. Network connectivity isthrough AIOM support.

Figure 4 – FatTwin Servers

Supermicro GrandTwin
The new Supermicro GrandTwin family of multi-node rackmount building block systems has been designed to maximize front
I/O and serviceability and features the latest 3rd Gen Intel® Xeon® Scalable processors. Designed explicitly for spaceconstrained installations with limited or no hot-aisle access, GrandTwin provides front access to all networking ports andnode trays.
Many telcos and public/private cloud providers have limited access to the hot aisle due to space or OPEX constraints,
complicating the serviceability of networking and storage systems. While most servers today require installation and service
from the back of the system, the Supermicro GrandTwin gives IT administrators the option to access all I/O from the system's© 2022 Copyright Super Micro Computer, Inc. All rights reserved

June 2022

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front. This feature reduces the difficulty of implementing and maintaining systems in space-constrained environments ormore environmentally friendly data center designs where cold air aisles are separated from hot air aisles.

Figure 5 – GrandTwin Server© 2022 Copyright Super Micro Computer, Inc. All rights reserved

June 2022

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X12 TwinProHeight

X12 BigTwin

X12 FatTwin

X12 GrandTwin

2U4U

2U

1U2U

24244842222221Max TDP Watts
Per Node185185270205

Max
DIMMS/Socket(IncludingPMem)

16162020

Number ofNodes
Max CPUs Per
NodeUPDPUPDPUP

250205250185270161616

NVMe Support

NoYes

Yes

Yes (Modular Kit)

Intel® Optane™
PMem Support

NoYes

Yes

Yes

Max PCI-E
Cards perNodeMax. Numberof Drives/NodeOnboard
Networking

22321111 LP
GPU

1 LP GPU

1 DW
GPU

2 LPGPU

1 LP GPU

1 LP GPU

1 LPGPU46126684

Dual-10GbE

AIOM*

AIOM*

I/O Module***AIOM: The Supermicro® Advanced I/O Module (AIOM) is the latest form factor designed to provide a wide range of networking options and other I/Otechnologies for server, storage, and IoT systems. The Supermicro AIOM card contains many options for networking. See more at:https://www.supermicro.com/en/support/resources/aoc/aiom** I/O Module: Proprietary I/O Module designed for GrandTwin to support Front I/O with BMC, dual 10GbE or dual 25GbE, USB, and VGA ports

Table 1 - High-Level Comparison of TwinPro, BigTwin, FatTwin, GrandTwin© 2022 Copyright Super Micro Computer, Inc. All rights reservedJune 20227

Example Use Cases
TwinPro:•Data Center Cloud Computing: The Supermicro TwinPro is an economical choice when a lower cost multi-node
solution is required. With lower cost CPUs than other systems, the Supermicro TwinPro can be used for various data
center and cloud computing workloads, where high-density servers are required. The TwinPro reduces E-waste withup to four nodes in a compact 2U chassis, as each node can be replaced or upgraded without replacing an entire
chassis. Raw materials are also reduced compared to standard 1U rackmount servers.

•Virtualization: For workloads that require advanced virtualization implementation for standard workloads, theSupermicro TwinPro is an ideal solution. With up to 4 nodes in a 2U chassis, these systems can easily satisfy the SLAsof many organizations that require fast responses with economic CPU choices.

BigTwin:•Hyperconverged Infrastructure: The Supermicro BigTwin is an excellent server for Hyperconverged Infrastructure(HCI) deployments. Many workloads in various industries benefit from the BigTwin, including Big Data Analytics,DevOps & IT Operations, Cloud-Native Applications, High-Performance Databases, and Mission-Critical Applications.
With a range of configurations of CPUs and very flexible I/O options, the Supermicro BigTwin allows mission criticalapplications to be run with the highest performance available. Many Nutanix customers have chosen to use theSupermicroBigTwinfor
their
most
demandingenterpriseapplications.
Seemoreat:(https://www.supermicro.com/en/pressreleases/supermicro-expands-total-solution-portfolio-offering-nutanix-nxplatforms-hybrid ) . These environments require flexible storage options addressed with NVMe/SAS/SATA support andmultiple network connectivity options that are easily satisfied using AIOM options and high-bandwidth low-profile
cards.

•Distributed Storage & Database Solutions: With various configurations supporting the latest, highest performing
CPUs and NVMe technologies, the BigTwin is an ideal building block for organizations creating and building their own
scale-out storage and distributed databases, whether on-prem or a publicly available service. With the compute &storage density available in a 2U 4-Node and 2-Node setup with dual sockets per node, the BigTwin can provide
industry-leading storage performance for modern AI workloads and support Big Data Analytics with popular softwaredefined solutions, such as MongoDB, Cassandra, and Ceph.

•HPC: The Supermicro BigTwin, with its ability to house the most powerful CPUs, high-speed memory modules, andcache coherent host channel adapters available, is an ideal choice for energy-efficient, scale-out High-Performance
Computing environments. With a high number of CPUs available in a dense package, support for up to 3kW of Titaniumlevel power supplies, and a range of I/O performance options, the BigTwin accelerates time to solution. So whetherrunning more parallel workloads or enlarging datasets, or supporting more physics engines for data modeling &simulations, organizations can bring products to market faster and reduce costs in various industries.

•Other Applications: Other applications that the Supermicro BigTwin is ideal for include: Back-up & Recovery, AllFlash Object Storage (https://www.supermicro.com/white_paper/white_paper_Ceph_Cluster_BigTwin.pdf ), HighDensity RAID storage, and Big Data Analytics.

© 2022 Copyright Super Micro Computer, Inc. All rights reservedJune 20228FatTwin:•Cloud and Web Applications: For organizations that need to provide services to millions to billions of users, theSupermicro FatTwin is an ideal solution, built with the highest density available. The front-facing (cold aisle)
serviceability and ease of maintenance reduce OPEX and allow faster replacement than a server with rear-facing (hotaisle) access. With the design capability of running the nodes with only a single CPU, infrastructure executives canoptimize exactly the best amount of computing cores for extremely dense data center environments•EDA and Semiconductor Simulation: With the increasing demand for accurate simulations of multi-billion transistor
CPUs and other microprocessors, a system with high speed CPUs and large memory access is required. TheSupermicro FatTwin, optimized for high density computing, is an ideal server for simulations that require access tosignificant amounts of memory. In addition, the Supermicro FatTwin includes Titanium level redundant power
supplies, ensuring that simulations do not abort when there is a slight power loss to the critical computing
components.

•Data Warehousing: With up to eight high-capacity HDDs and single-socket support per node in multi-node chassis, theFatTwin is one of the industry's most power-efficient, distributed storage solutions. This system is a purpose-built
platform for Big Data Analytics and is still used today for data warehousing to deliver business intelligence at scale.

•

Other Applications: Other applications that the Supermicro FatTwin excels at include: Cloud Optimized Servers,
Data Center Enterprise Applications, and Virtualization Servers.

Read more about how a public company uses the Supermicro FatTwin to handle trillions of messages daily.
https://www.supermicro.com/CaseStudies/CaseStudy_Fortune100FatTwin.pdfGrandTwin•Multi-Purpose Content Delivery Network: The GrandTwin's compact enclosure and front I/O options allowoperators to easily onboard new infrastructure or deploy into brownfield environments from a global logistics andintegration standpoint.

•

Distributed Caching Services: Reliable cache clusters are required to reduce the round trip time by bringing thecontent closer to consumers. With each node supporting one 3rd Gen Intel Xeon Scalable Processor, 16 DIMM slots,and Intel PMem 200 Series, GrandTwin allows customers to cost-effectively deploy clusters with large memory pools
without dealing with the complexity of NUMA-awareness and managing process affinities.

•Streaming Data Services: To optimize performance without increasing the costs of streaming data infrastructure,large broadcasting and telecommunications companies have adopted a hybrid cloud approach. There may be severaltranscoding steps to manage multiplexing, packaging, and encryption from content ingestion to distribution at
strategic CDN PoPs (Points of Presence), which requires a tremendous amount of aggregated computing power andnetwork bandwidth. With support for GPU acceleration, GrandTwin can provide optimal bitrate and low-latency
streaming solutions with flexible I/O options.

•Telco Edge Cloud: In the 5G era, CSPs need a simple and easy way to operate hybrid cloud building blocks that can
automatically scale and optimize latency-sensitive back-end applications while managing & monitoring other
IoT/embedded systems at the edge. The GrandTwin is optimized to meet these requirements by complying with© 2022 Copyright Super Micro Computer, Inc. All rights reservedJune 20229CNCF (Cloud-Native Computing Foundation) and ODIM (Open Distributed Infrastructure Management) standards,
plus supporting FPGA acceleration devices, certified to support open RAN (Radio Access Networks) standards.

Summary of Supermicro Twin Product Families
The Supermicro Twin Product Family consists of three product lines designed to use the 3rd Gen Intel Scalable processors. The
Twin family starts with the TwinPro systems. This flexible 1U and 2U systems offer a range of I/O expansion options and aredesigned to reduce CAPEX and OPEX costs. Next up is the 2U 2-Node and 2U 4-Node BigTwin®, a breakthrough multi-nodeserver system with many innovations and industry firsts, designed to support the highest performance CPUs, maximum
memory capacity, flexible networking, all-flash NVMe support, and supports hardware acceleration for content delivery. Thesesystems are optimized for answering challenging business, finance, or scientific research requirements. Finally, the 4U
FatTwin series is configurable for up to 8 nodes and is built for advanced deployment scenarios with single-socket support,
flexible storage options, and industry-leading PUE, which is ideal for scale-out deployments. With a new edition to the Twinfamily, Supermicro is first to market with a modular Twin design with Front I/O, single-socket support, 16 DIMMs, and optional
hardware acceleration to deliver cost-optimized caching and streaming platforms to bridge the gap between far edge
computing and cloud resources.

Additional Information
https://www.supermicro.com/en/products/twin
https://www.supermicro.com/en/products/twinpro
https://www.supermicro.com/en/products/bigtwin
https://www.supermicro.com/en/products/fattwin
https://www.supermicro.com/en/products/grandtwin© 2022 Copyright Super Micro Computer, Inc. All rights reserved

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