Comparing Advanced Materials
Properties for High Frequency
Telecommunications Hardware
Applications
Presented by 3M Product Developer, Steve Amos

23 September© 3M 2021.
2021. AllAll RightsRights Reserved.
Reserved.

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Agenda• Introduction to 3M Company & Advanced Material Division• Material Challenges for 5G and Millimeter Wave Signal Transmission• 3M Material Solutions and Applications
3M™ Glass Bubbles

3M™ Nextel™ Ceramic Fibers• Summary• Questions during or after the presentation can be asked at 3M.com/5G AST

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Who we are – 3M Consists of Four Business Groups
Working together to leverage the breadth of solutions & support
Safety & Industrial

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Transportation &Electronics•

Display materials•

Automotive and aerospace•

Electronics materials•

Commercial solutions•

Advanced materials•

Transportation safety

Health CareConsumer3

At 3M we can help solve your design challenges byleveraging the breadth of 3M Technology

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3M Technologies for the Electronics/5G Market

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55G Customer Challenge: Increased Signal Transmission
Why this is a design challenge in 5G
Technology:Benefit:
Applications:
Timing:23 September© 3M 2021. All Rights Reserved.

AR/VR

Smart Cities, Wearables

Industrial ControlSystems, Med Devices

2020-2022

2020-2024

2022-2026
Graphic Source: Lux Report: Aug 2019 Materials for 5G

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5G Customer Challenge: Increased Signal Transmission
Why this is a design challenge in 5G
Data Requirements Growing

Driving antenna frequencies up
4G
0.7 to2.6 GHz5G

Sub-6
3.5 to
6 GHz

5GmmWave
28 to39 GHz

WiGig6G60 GHz

100 GHz to
3 THzNew materials needed to offset loss

NEEDS: Faster Data Speeds, More connectedDevices, Decreased Latency
ENABLING: More Streaming/Gaming, Internetof Things, Autonomous Driving

Signal Loss α (F * Df * √Dk)
• Higher frequency increases loss
• Materials needed with better dielectric
properties to help reduce loss

Dk = dielectric constant
Df = dissipation factor

Table Source: Cisco Visual Networking Index (VNI) Compete Forecast Update Dec 2018
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3M™ Glass Bubbles

Reduces Dk and Df in composite materialsWhy is it important to 5G?

Technology3M™ Glass Bubbles

Impact Dk & Df

Small hollow, thin walled, unicellular spheres primarily composed ofsoda-lime borosilicate glassProperty

Value

ShapeHollow, thin walled, unicellular spheres

ColorWhite

True Density†

0.32 - 0.60 g/cc

Crush Strength*6000 – 28,000 psi

Softening Temp

>600 C

Average Dia

15 - 25 microns

Moisture<0.5%

Dielectric Constant (Dk) @10GHz

1.2-1.5

Dissipation Factor (Df) @10GHz

0.003-0.005

Note: The data presented is not for specification purposes
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3M™ Glass Bubbles for Light-weighting and 5G
RF Transparency, Density Modification, Low Dielectric Constant and Loss

Low Dielectric PCBs

Antenna Transmission Window

Radome Enclosure

5G Benefit for Internet of Things (IoT)

AR/VR & Video Streaming
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Smart City

Telemedicine

Autonomous Driving
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Copper Clad Laminate for Printed Circuit Boards
Application Specific Design Challenges:
Problem to Solve:• Signal / Frequency loss between layers• Delamination between layers• Adhesion Performance• Material Expansion (CTE)• Improve overall cost attractiveness• Thermal management• Reduction of overall weight of CCL

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3M™ Nextel™ Ceramic Fibers
RF Transparent and High Modulus
Why is it important to 5G?

Technology

What are Nextel ™ Ceramic Fibers? Low Df Properties,High Modulus
Continuous Aluminum Oxide fibersthat structurally reinforce to help
improve modulus of the composites withsimultaneous electrical insulation

▪
▪
▪
▪
▪
▪

▪
▪
▪
▪
▪

3M™ Nextel™ Fibers has the highest known
modulus of all continuous, RF transparent fibersLow Df, RF transparent
Excellent chemical resistance
Thermal conductivity >1.7X vs. chopped glass
fiber PMC
Efficient mfg vs. CNC metal or monolithic
ceramic

Metal-likemechanicalproperties
RF transparent
2X stiffness of GF atsame vol.%Ability to thin-wall adesign
Match CTE ofmetal/aluminum
Easily processed via
injection orcompressionmolding© 3M 2021. All Rights Reserved. The data presented is not for specification purposes

Resin

Properties

Units

Tensile Modulus @ Break

15V%
30V%
30V% e- 53V%
316
Ceramic Fiber Ceramic Fiber Glass Fiber Ceramic Stainless
ChoppedChopped Chopped Fiber Steel**

Polyamide
Dielectric Constant (Dk)
(PA)

GPa

183415

9.5 GHz

3.73

4.4

3.89

9.5 GHz

0.008

0.007

0.01

Tensile Modulus @ BreakDielectric Loss (Df)

Polycarbonate
Dielectric Constant (Dk)
(PC)

GPa

1635

14

9.5 GHz

3.51

4.34

3.65

9.5 GHz

0.004

0.004

0.007

Tensile Modulus @ Break

GPa

3117

Dielectric Constant (Dk)

9.5 GHz

4.43

3.74

Dielectric Loss (Df)

9.5 GHz

0.003

0.007

Dielectric Loss (Df)

PBT

Epoxy

Tensile Modulus @ Break

GPa

181*

160-200Dielectric Constant (Dk)

9.5 GHz

6.4

N/A

Dielectric Loss (Df)
9.5 GHz
0.01
N/A*Chopped fiber = 3mm, *53V% Data on 0 laminate , **316 SS properties depend on composition and processing*Chopped fiber = 3mm, *53V% Data on 0° laminate, **316 SS properties depend on composition and processing*Data is for reference only and not for specification purposes. Data shows typical properties
NOTE: All the data in this table is not for specification purposes. This data is for reference only to show typical property
values.
The data presented is not for specification purposes

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3M™ Nextel™ Fiber Applications in Electronic Devices
Application Areas:• Replace metal or carbon fiber
composite parts/frames/antenna splits
for RF transparency, while providing
stiffness and protection• Parts requiring thin, stiff characteristics
where other materials may fail23 September© 3M 2021. All Rights Reserved.

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Transmission Loss Test Set-up for 28 – 78GHz
S21(transmission) measurement using VNA (Vector network analyzer)

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Transmission Loss Compared to Air and SteelTransmission Loss Between 26.5 and 39GHz• Continuous ceramic fiber compared to GF at 54vol% in an epoxy PMC• Depending on thickness and frequency, there are ranges where CeF is better than GF
Note: The data presented is not for specification purposes
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Transmission Loss Compared to Air and SteelTransmission Loss Between 71 and 86GHz• Continuous ceramic fiber compared to GF at 54vol% in an epoxy PMC• Depending on thickness and frequency, there are ranges where CeF is better than GF
Note: The data presented is not for specification purposes
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Summary• 3M has material solutions for next generation devices - 5G and mmWave• 3M™ Glass Bubbles can be used as a low dielectric additive in polymer
composites used in antenna grade PCB CCL, electrical connectors, radomeenclosures−

Reduce signal loss/issues−

Lower CTE to prevent solder breakage and delamination• 3M™ Nextel™ Ceramic Fibers can be extruded or prepregged with plastic
matrices and efficiently molded into parts benefiting antenna applications−

RF transparency−Low loss (Df) at 5G wavelengths−Structural mechanical properties−

Design freedom; thin walling, ease of processing (e.g. injection moldable) and color matching

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Questions?
3M.com/5G AST

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