June 16, 2023
80, Oshimada-machi, Nagano-shi, 381-2287 JapanSHINKO ELECTRIC INDUSTRIES CO., LTD.
Stock exchange code: 6967, TSE Prime

SHINKO ELECTRIC INDUSTRIES CO., LTD. Acquires Certification for
Supply Security Plan at Chikuma Plant
NAGANO, Japan, June 16, 2023 – SHINKO ELECTRIC INDUSTRIES CO., LTD. (SHINKO)
announced that its capital investment plan for the manufacturing of next-generation flipchip type packages (FC-BGA substrates) for cutting-edge semiconductors at its Chikuma
Plant, located in Chikuma City, Nagano Prefecture, has been certified as a “Supply SecurityPlan” by Japan’s Minister of Economy, Trade and Industry, based on the Act on thePromotion of Ensuring National Security through Integrated Implementation of EconomicMeasures. As a result of this certification, subsidies will be granted for the capital
investment plan at the Chikuma Plant.
With the spread of 5G, the increasing use of AI and IoT, and the progression of Digital
Transformation (DX), etc., society and the economy are becoming digitized. Consequently, theapplications for semiconductors are expected to keep growing, further increasing the demand
over the medium-to long-term. The market for cutting-edge semiconductors, particularly used
for servers and other applications, is projected to expand significantly, driving increasing
demand for semiconductors with higher functionality and speed as well as power saving.
Demand for more advanced FC-BGA substrates that meet these needs by achieving larger size,
higher multi-layering, and ultra-high density fine wiring is expected to increase dramatically.
SHINKO is actively engaging in the development of next-generation FC-BGA substrates,
including i-THOP®, to capture these needs. By establishing a mass-production system at ourChikuma Plant, we will contribute to the creation of a more affluent society through theadvancement of the semiconductor-related industries, realization of Green Transformation (GX)
and other factors.
Our President, Susumu Kurashima, made the following statement regarding the certification:“We are grateful for the support from the Japanese government. FC-BGA substrates arebecoming more and more important in high-performance semiconductors, which are driving thedigitalization of society and the economy, and are playing a pivotal role in semiconductor
evolution. In the cutting-edge semiconductor market, there is a demand for FC-BGA substrates
that greatly surpass conventional performance through larger size, higher multi-layering, andultra-high density fine wiring technology. By stably producing in Japan and launching nextgeneration FC-BGA substrates, including i-THOP® developed by SHINKO, we will contribute to
the development of semiconductor-related industries and Japan’s economic security.”

i-THOP®

Outline of supply security plan, as planned
1) Name of the operator
Shinko Electric Industries Co., Ltd.
2) Investment amount53.3 billion yen
3) Maximum subsidy
17.8 billion yen4) Facility
Chikuma Plant5) Main products manufactured
Next-generation FC-BGA substrates［About i-THOP®］“integrated Thin film High density Organic Package (i-THOP®)” developed by SHINKO isan FC-BGA substrate that assembles an ultra-fine wiring layer formed through high density
wiring technology and thin-film technology with a build-up substrate. The ultra-fine wiring
layer of i-THOP® enables the assembly of multiple logic chips and heterogeneous
integrations, such as logic chips and high bandwidth memory (HBM). SHINKO will beintroducing i-THOP® to the market as a next-generation FC-BGA substrate that meets theneeds of the high-performance computing (HPC) market, which is expected to experiencesignificant growth in the medium-to long-term.
i-THOP is a registered trademark of SHINKO ELECTRIC INDUSTRIES CO., LTD.
Notice: This document is a translation of the original Japanese document and is only for reference
purposes. In the event of any discrepancy between this translated document and the originalJapanese document, the latter shall prevail.
CONTACT: Public & Investor Relations Dept.,Corporate Planning Div.

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