THE 30th INTERNATIONAL SYMPOSIUM
ON SEMICONDUCTOR MANUFACTURING
December 9-10, 2024 (in conjunction with SEMICON Japan 2024)
KFC Hall, Ryogoku, Tokyo, Japan

CALL FOR PAPERS《EXTENDED》ABSTRACT DEADLINE: Friday, September 13, 2024 <PDT 8:00 AM>
ISSM has been contributing progress of semiconductor manufacturing technologies from a scientific perspective and has been
conducting activities to share medium- and long-term improvement measures for common manufacturing issues and shortterm and practicable solutions. ISSM2024 marks the 30-year anniversary. Recently, with the participation of material andequipment manufacturers, which are Japan's strength, in addition to device manufacturers, ISSM has expanded its presence as
the only conference to discuss production and manufacturing technologies from process and equipment control to materials
and devices, as well as plant operations, based on highly dimensional science driven by big data. ISSM aims to "design thefuture semiconductor manufacturing," and will boldly embrace the movement of new changes in semiconductor manufacturing
and lead the innovative technologies in semiconductor production more than ever before.
Currently, there are dramatical changes in terms of economic security internationally, such as the restructure of the supply
chain of cutting-edge logic semiconductor chips and the emergence of a foundry by a foundry. Under international cooperation,
new factories are being actively constructed in Japan and other countries around the world. In order to realize theminiaturization of transistors with a secure operating margin, research and development are progressing on new device physics
and the introduction of new materials are advancing. With the time-to-market supply of AI chips as a competitive advantage inthe market, a new challenge to ultra-short TAT production is garnering attention. The transition from conventional
semiconductor manufacturing mixed batch and wafer processes to full single-wafer manufacturing has become a hot topic, andthe adoption of latest trends and innovative technologies, such as 3D package, chiplet integration and their manufacturing
technologies, is also urgently needed.
Furthermore, in the green transformation of semiconductor factories to realize a decarbonized society, it is necessary to evolve
into a line reconstruction and operation mode for manufacturing new structure devices by introducing energy-saving processequipment and new materials. In addition to the new directions mentioned above, common discussions and interactions among
companies, academic societies, and research institutes included in the semiconductor value chain are becoming moresignificant for the utilization of generative AI beyond the conventional approach and semiconductor chip manufacturing insmart factories.
ISSM2024 will provide a forum for researchers and engineers to develop and discuss the direction, activities, and operations ofproduction technologies ahead of the future by combining a bird's-eye view of broad industrial and technological trends witha management perspective. We strongly expect the active participation of the next generation of young semiconductor
engineers and the next generation of students.

Areas of Interest

Highlighted Themes

Abstract will be accepted for each of following areas of interest.

Fab Management* Factory Design (FD)* Manufacturing Strategy (MS)* Manufacturing Control and Execution (MC)* Environment, Safety and Health, Carbon Neutral (ES)* Intelligent Data Management (ID)

Papers on the topics of special interests may be programmed as aspecial session for highlight themes. Papers on the following topics
are especially welcome. See more information on the reverse side.

IoT and AI Solution-Big Data Science in Fab-IoT and Sensing Technology-AI Application

Next Generation FabProcess Integration* Process/Material Optimization (PO)* Yield Enhancement and Methodology (YE)* Ultraclean Technology and Contamination Control (UC)* Process Monitoring and Control Method (PC)
* Process/Metrology Equipment (PE)* Design for Manufacturing (DM)* Manufacturing Technology for Variety Devices (VD)

3D, Chiplets & Advanced Packaging*3D, Chiplet, and Advanced Packaging Technology (TP)- Smart Factory and GX- Sophisticated Transportation including PKG- Physical Analysis Automation and Short Development Period

Sustainable Manufacturing and Promotion of Global
Environmental Conservation- High Energy Efficiency and Emission Reduction- Return of Investment in Legacy Fab.

3D Packaging and Chiplet Integration:
New Horizon from Integration to Testing-Chiplet, Substrate, Interposer, 3D Interconnection, Insulator
between Layers, Plating Process<<EXTENDED SCHEDULE>>

Abstract Submission Due:
Notification of Paper Acceptance:

Fri., Sep. 13, 2024
Fri., Oct. 4, 2024

http://issm.semiconportal.net/
Contact issm_2024@semiconportal.com

ISSM Sponsors:

ISSM Awards
The ISSM Awards to be presented to the excellent papers

ISSM Best Papers for IEEE/TSM
Best papers for ISSM will have the chance to submit full papers forIEEE/TSM (Transactions on Semiconductor Manufacturing) which is
published quarterly for worldwide distribution. About ten papers
are annually selected and reported in ISSM/TSM special session.

◆Details for the Areas of Interest◆◆Details for the Highlight Themes◆

Fab Management

IoT and AI Solution

FD: Factory Design
This area focuses on fab design and its key enablers to meet theflexibility, extendibility, and scalability needs of a cost-effective
leading-edge fab.
MS: Manufacturing Strategy
This area focuses on strategy and concepts for more functional fab,and its operation management to meet rapidly changing complex
business requirements.
MC: Manufacturing Control and Execution
This area focuses on manufacturing execution and decision support
systems, factory scheduling, control of equipment/materials
handling systems and queue time management.
ES: Environment, Safety and Health, Carbon Neutral
This area focuses on zero greenhouse gas emissions, suppression ofenergy and materials consumption, recycling and reuse of materials
from the standpoint of the environmental management in asemiconductor factory in order to achieve a decarbonized society.
ID: Intelligent Data Management
This area focuses on analysis methods and systems for big datacollected in the fab.

Process Integration
PO: Process Optimization
This area focuses on process and material optimization from thestandpoint of high reliability, cost reduction and environment. The
breakthrough technology to improve the productivity of legacy
process is contained.
YE: Yield Enhancement and Methodology
This area focuses on probe yield enhancement and its stabilization
technology including inspection, analysis and reduction of defects
and particles. Reports for the Zero ‐ Defect process would be
especially attractive.
UC: Contamination Control and Ultraclean Technology
This area focuses on new technology for damage-less particle
removal, contamination control of wafer backside and bevel,surface cleaning for new materials and fine structure. Energy saving
cleaning and molecular level contamination control in advanced
wafer fab will be included.
PC: Process Control and Monitoring
This area focuses on tighter process control for advanced
production as well as mature fab, to achieve higher productivity,
higher uptime, quality enhancement by advanced equipment
control/advanced process control (AEC/APC), FDC, e-diagnostics
and new sensors. This area also covers accuracy enhancement andsmart process control using virtual metrology for advanced
nanoscale device manufacturing, 3D profile/high aspect ratio
structure control and excursion control for stable equipment.
PE: New Process/Metrology Equipment
This area focuses on finer pattern delineation/control. The
application of metrology equipment control and engineeringsystem will be highlighted.
DM: Design for Manufacturing
This area focuses on the collaboration between manufacturing anddesign including RET, OPC, systematic defects, and other approachto improve productivity from design.
VD: Manufacturing Technology for Variety Devices
This area focuses on manufacturing technologies specialized for
emerging variety devices in MEMS, power devices, and CMOS
sensors areas which can be realized by technologies not limited tominiaturization or large-diameter wafers.

3D, Chiplets & Advanced Packaging
TP:3D, Chiplet, and Advanced Packaging Technology
This area focuses on innovative approaches to advanced packaging
manufacturing processes, materials, equipment, automateddelivery systems, interposers, substates, interconnection
approaches, and testing methods.

ISSM Sponsors:

In recent years, data utilization has become common knowledge inmany manufacturing industries, and the evolution of IoT for datacollection and AI applications using collected data has attracted
much attention. In semiconductor manufacturing, research anddevelopment of various manufacturing technologies utilizing data
have been carried out for over 30 years. Furthermore, in order torapidly expand production due to increased demand forsemiconductor chips, it is expected to utilize new tools such as
generative AI during the start-up phase of production lines. Papers
on the application of IoT and AI to create breakthroughmanufacturing technologies are welcomed. We also hope toprovide opportunities for people in other industries to learn about
the current state of IoT and AI use in semiconductor manufacturing,and to discuss smart manufacturing using AI.
Topics may include (but not limited to): Big Data Science in Fab, IoTand Sensing Technology, AI Application, Bayesian Design, Machine
Learning, Deep Learning, Material Informatics, AI Tool, Verbalizationof Know-How.

Next Generation FabUnder international cooperation, many semiconductor fabs, notonly in Japan, have become a construction rush. Next generation
fabs require new concepts, and device manufacturing requires
thorough energy conservation from development of devices tomanufacturing, consistent cycle time reduction from device design
to wafer manufacturing to 3D assembly, and AI implementation.
The development and deployment of a wide range of technologies
required to solve these challenges will be discussed.
Topics may include (but not limited to): Smart factory, advanceddelivery including PKG, automation of physical analysis andreduction of development time, GX.

Sustainable Manufacturing and Promotion of Global
Environmental Conservation

Demand for semiconductor chips is increasing, and the use ofenergy, water, and materials (chemicals, gases, etc.) insemiconductor manufacturing continues to increase. For
sustainable semiconductor manufacturing, it is essential to design
factories, processes, and recycling that are more environmentallyfriendly, such as DX and GX. Reducing the use ofchlorofluorocarbons, organic solvents, and ultrapure water is also amajor challenge for promoting global environmental conservation.
Design policies and issues to realize economic efficiency andproductivity toward the realization of high efficiency fabs will bediscussed.
Topics may include (but not limited to): Energy efficiency,
emissions reduction and recycling, return of investment issues inlegacy fabs.

3D Packaging and Chiplet Integration:
New Horizon from Integration to Testing

3D packaging and chiplet integration technologies are taking theperformance and efficiency of electronic devices to the next level.
Innovative approaches to advanced packaging manufacturingprocesses, materials, equipment, automated delivery systems,interposers, substates, interconnection approaches, and testing
methods will be discussed.
Topics may include (but not limited to): Chiplet integration
technology, substrate, interposer, 3D connection technology,interlayer insulation film, plating process.