PLDBEITO SpecPLDBEITO Specification

VersionV1.0
V2.0
V2.2
V2.3
V2.4

Note
CreateModify Pin Define
Add 4.3
Add Section5,Section6

Date
2019/05/29
2019/10/29
2020/02/25
2020/08/14
2020/12/28

This document contains information that is proprietary to Pairlink . This document is commerciallyconfidential and must NOT be disclosed to third parties without prior consent. The information
provided herein is believed to be reliable. But production testing may not include testing of allparameters. Pairlink reserves the right to change information at any time without notification.
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PLDBEITO Spec

Contents
1.Functional Characteristics.........................................................................................................- 3 1.1.Product Feature............................................................................................................. - 4 1.2. Main Application Domain............................................................................................. - 4 2.Electrical Specifications.............................................................................................................- 5 2.1.Absolute Ratings............................................................................................................ - 5 2.2.Recommended Operating Conditions........................................................................... - 5 2.3.Power Consumption...................................................................................................... - 6 2.4.RF Specifications............................................................................................................ - 7 3.Physical Parameters.................................................................................................................. - 8 3.1.Peripheral Interface....................................................................................................... - 8 4.Hardware design and PCB layout..............................................................................................- 9 4.1.Pin assignment and Pin descriptionab............................................................................- 9 4.2.Reference Design......................................................................................................... - 10 4.3.Interface Signal Function Selection............................................................................. - 12 4.4.Appearance and Dimensions.......................................................................................- 13 4.5.Module Layout Guideline............................................................................................ - 14 5.Packing Information................................................................................................................ - 15 5.1.Rolling Information...................................................................................................... - 15 5.2.Master Carton Information..........................................................................................- 16 5.3.Label Information.........................................................................................................- 16 6. Welding Declare..................................................................................................................... - 18 -All rights reserved-2-Suzhou Pairlink Network Technology Ltd.

PLDBEITO Spec

1.Functional Characteristics

PLDBEITO is SOC module developed based on the Bluetooth 5 standards. the internal
integration architecture ARM® Cortex®-M3 processor.It has the advantage of small
volume, low power consumption, long distance transmission, strong anti-jamming
capability, low cost.Specifically applied to Bluetooth low power control area,andsuitable for various occasions short distance wireless communication.
The PLDBEITO is the optimal solution for voice, data, home automation, accessories andother applications that require a Bluetooth SIG standards-compliant interface. The
PLDBEITO supports a host command interface (HCI) through USB or UART and also
supports PCM audio. The PLDBEITO transceiver’s enhanced radio performance meetsthe most stringent industrial temperature application requirements for compact
integration into mobile handset and portable devices.
The module includes 20Mhz Crystal and 8Mb SPI flash.
Circuit block diagram of the module is shown in Figure 1.

Figure 1: PLDBEITO Circuit Block Diagram

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PLDBEITO Spec

1.1.Product Feature
1. PLDBEITO under Bluetooth 5 specification. including BR/EDR/BLE.
2. Supports A2DP, AVRCP, HSP, HFP, GATT, SPP, HIDD, HIDH, ANCS, AMS,IAP2, PBAP, OBEX, WeChat, HomeKit, Wide band speech (WBS)
3. Support Beacon function.
4. Support OTA Upgrade, UART Upgrade.
5. I2S/PCM for BT audio

1.2. Main Application Domain
1: Bluetooth Printer/Scanning device
2: Home automation / Intelligent access control system.
3: Industrial telemetry / Industrial data collection.
4: Bluetooth and RS232 (RS485) serial data transfer.

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PLDBEITO Spec

2.Electrical Specifications
Integration architecture ARM® Cortex®-M3 processor
352KB RAM,848KB ROM,8Mbit Flash
Include 8Mbit SPI FLASH, Memory size is optional
Supports Cypress proprietary data rate up to 2 Mbps

2.1.Absolute Ratings

Power Supply

Min.
-0.3

Specification
Typical
3.3

Max.
+3.8

Current Consumption--100mA

Storage temperature-40-+150℃

Working temperature-30-+105℃

ESD HBM-2K-+2KV

ESD CDM-500-+500V

Latch-up

TBD

TBD

TBD

mAParameterUnitV

2.2.Recommended Operating Conditions
Parameter

Specification
Typical
3.3

Min.
3.0

Power Supply

Digital I/O Characteristic(VDDIO=3.3V)

Max.
3.6

Specification
Typical-Unit
VCharacteristics

SymbolInput Low Voltage

VIL

Min.
-

Input High Voltage

VIH

2.0--V

Output Low Voltage

VOL--0.4

V

Output High Voltage

VOH

VBAT-0.4V--

V

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Max.
0.8

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Unit
VPLDBEITO Spec

2.3.Power Consumption

Current consumption measured in BLE mode with 3.30V power on in VBAT.
Operational Mode
ReceivingTransmitting
Flash Operation

Conditions

Receive (1 Mbps) current level
when receiving a basic rate packet
Transmit (1 Mbps) current level
when transmitting a basic rate packet.
Erase and write flash

HIDOFF(Deep Sleep)

Current consumption measured in Pairlink connected mesh mode.
Work Mode
StatusTypicalUnit

12.5

mA

26.5

mA

60

mA

1.8

uA

Average

Unit

Mesh disable

Power on

12.18

mA

Discoverable

Broadcast

18.84

mA

Single modeHome id configurated

13.03

mA

Connected

IN MESHnet

14.62

mA

Note: These data are based on the development board with Demo_SW, only for customer reference.
The actual power consumption according to the customer's application

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PLDBEITO Spec

2.4.RF Specifications
ParameterConditions

Min.

TypicalA

Max.

Unit

Receiver RF Specifications
Frequency range

-2402

-

2480

MHz

GFSK,0.1％BER,1Mbps--93.5-dBm

Π/4-DQPSK,0.01％BER,2Mbps
8-DPSK,0.01％BER,3Mbps--95.5-dBm--89.5-dBm

GFSK,1 Mbps

---20

dBm

2402

-2480

MHz

Class 1: GFSK TX power-12-dBm

Class 1: EDR TX power-9-dBmClass 2: GFSK TX power-2-dBm

248dB

RX sensitivityB

Maximum input

Transmitter RF Specifications(TBD)
Frequency range

Power control step--A.Typical operating conditions are 3.3V operating voltage and 25°C ambient
temperature.
B.The receiver sensitivity is measured at BER of 0.1% on the device interface.

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PLDBEITO Spec

3.Physical Parameters
Parameter

Performance

Note

Crystal20MHz

Data Transfer (BLE)
Environment: Sunny and open
Airspeed: 1Mbps
AUDIO(BR/EDR)
Environment: Sunny and open
Industry Standard

ProtocolBluetooth 5Including BR/EDR/BLE

Package

Patch

Refer to section 4.4

IC

CYW20706

49-ball FcBGA

RAM352KB

Patch RAM(64KB)\Data RAM(288KB)

ROM

848KB

I-ROM(800KB)\D-ROM(48KB)

FLASH

8Mbit

Core

ARM Cortex-M3

Dimensions

16.8mm*11mm*2.6mm

Distance

50M
10M

L*W*H

3.1.Peripheral Interface







1 x I2S/PCM interface
1 x PUART interface with CTS/RTS
1 x HCI UART interface with CTS/RTS
1 x SPI interface with master/slave configurable
1 x I2C interface with master/slave configurable
12 x GPIO
11 x ADC input
4 x PWM interface

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Dragon Spec

4.Hardware design and PCB layout
4.1.Pin assignment and Pin descriptionab
PLDBEITO Pin definition can refer to Figure 2.
Table 1:Module Pin Description
Pin

Pin Name

Number

POR

I/O

State

Alternate Function Description

10

VBAT

ADI

/

Power Supply

1,2,3,9,17,18,26

GND

GND

/

Connect to Ground

11RESETDI

INPUT. Reset signal (active Low). Floating if not
used

7RECOVERYI

SPI2 Master In Slave Out. For Test.

3

UART_RTS

I,PU

RTS for HCI UART interface. NC if unused.

4

UART_CTS

I,PU

CTS for HCI UART interface: NC if unused.

5

UART_RXD

I

Serial data input for the HCI UART interface.

6

UART_TXD

O,PU

Serial data input for the HCI UART interface.

8

P15/ADC_IN

DIO

Floating

GPIO:P15/ADC_IN

13

P30

DIO

Floating

GPIO:P30

14P25

DIO

Floating

GPIO:P25/P32

15

P4/PUART_RX

DIO

Floating

GPIO:P4/P24
PUART_TX

16P36

DIO

Floating

GPIO:P36/P38

19

P31/PUART_TX

DIO

Floating

20

P34/I2S_WS

DIO

Floating

21

P12DIO

Floating

22

P29/I2S_DATA

DIO

Floating

23

P28/I2S_SCLKDIO

Floating

24

P26

DIO

Floating

All rights reserved-9-GPIO:P31
PUART_RX
GPIO:P34
I2S_WS /PCM_SYNC
GPIO:P12
I2S_DI/PCM_IN/I2C_SDA
GPIO:P29
I2S_DO/PCM_OUT/I2C_SCL/PWM3
GPIO:P28
I2S_SCLK/PCM_CLK/PWM2
GPIO:P26/P11

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Dragon Spec
PWM0
GPIO:P27/P33
I2S_MCLK/PWM1a. For more GPIO function configuration questions, contact to Pairlink.
b. During power-on reset, all inputs are disabled.
25

P27/I2S_MCLKDIO

Floating

4.2.Reference Design
The latest schematic and design examples, bill of material, and layout file are available fromoriginal developer . Contact us for details.

Figure 2: Module Reference Design

Circuit Description
1:VBAT supply voltage value is 3.0V-3.60V.
2:PIN12(Recovery) reserved for testing.
3:PIN11(RST_L) is Module Reset_Control (active Low) ,Keep floating if the user not use.
4:Reserve JP1 burning interface if the PCB board has enough space.

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Dragon Spec
5:The application block diagram of SECTION A is shown below:

6:The application block diagram of SECTION B is shown below:

7:PLDBEITO not support GPIOs supermux,for more GPIO function configuration questions,contact the Pairlink.

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Dragon Spec

4.3.Interface Signal Function Selection
PLDBEITO not support GPIOs Supermux. IIC\IIS\PWM\SPI\ADC can't be configured at the same time.
If the customer wants to use all functions, it can be assigned by Pairlink.

Peripheral_UARTP_UART_TX
PIN Name
P31

PIN Number
19

P_UART_RX
PIN Name
P4

PIN Number
15IIC

IIC_SDAPIN Number
21

IIC_SCLPIN Name
P12

PIN Number
22

PIN Name
P29

SPI_MOSI(Mater and Salve )PIN
PIN
NumberName
25
P27

SPI_MISO(Mater and Salve )PIN
PIN
NumberName
14P25

I2S_SCLK

I2S_MCLKSPISPI_CS(SLAVE)PIN
PIN
NumberName
24
P26

SPI_CLK(Mater and Salve )PIN
PIN
NumberName
16P36
IIS

I2S_WS
PIN
Number
20

PIN
Name
P34

I2S_DATA
PIN
Number22

PIN
Name
P29

PIN
Number
23

PIN
Name
P28

PIN
Number
25

PIN
Name
P27

PWM
PWM0PIN
Number24

PIN
Name
P26

All rights reserved

PWM1PIN
Number25

PIN
Name
P27PWM2
PIN
Number23- 12 -PIN
Name
P28

PWM3
PIN
Number22PIN
NameP29

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Dragon Spec

4.4.Appearance and Dimensions
Figure 3 shows the size of the module.The components and prominent structure are not allowed
put in this size range(16.8mm*11.0mm*2.60mm).
The following land pattern size is recommended for user board design. However, user can modify
it according PCB soldering conditions. Sufficient examination is necessary if use the modified
land pattern.
Figure 3: Mechanical Information

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Dragon Spec

4.5.Module Layout Guideline
The layout on user PCB should be designed according to the following guideline.
Figure 4: Module Placement

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Dragon Spec

5.Packing Information
5.1.Rolling Information

Product name

MOQ

Packing method

Single package quantity

PLDBEITO

1100PCS

Tape and Reel

1100PCS

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Dragon Spec

5.2.Master Carton Information

5.3.Label InformationA) Label on module
PLDBEITO has passed BQB\FCC\CE\IC\MIC\RoHS\SRRC certificationB) Label on vacuum bag and pizza box
Product name

PLDBEITO

Model name

Customer Corresponding Item Number

Customer PN

Customer Part Number

Quantity(PCS)

1100 pcs

Product date

YY.MM.DD

Product Version

SW Version

Product Type

Bluetooth Module

MFG PN

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Dragon SpecC) Label on carton
Product Name

Customer Corresponding Item Number

Customer PN

Customer Part Number

Quantity(PCS)

5500pcs

Produced date

YY.MM.DD

C/N

Cartoon Number

ROHS

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Dragon Spec

6. Welding Declare
The PLDBEITO module only supports one reflow soldering , and the module failure caused bymultiple reflow soldering is not responsible.

Figure 5: Standard Operation Procedure (SOP)

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