World’s Leading Trade Fair forElectronics Development and Production
November 18–21, 2025
Trade Fair Center Messe München
productronica.com

Product Index

management@productronica.com, Tel. +49 89 949-20330
Messe München GmbH, Am Messesee 2, 81829 München, Germany

A Cluster Semiconductor
1

Semiconductor production

1.1
1.2
1.3
1.4
1.5
1.6
1.7

Wafer front-end processing
Wafer back-end processing/Advanced Packaging
Production of power electronics (IGBT, Power MOSFET, Thyristors, etc.)
Measurement, detection and control systems for semiconductor
production
Packaging and assembly materials
Electronic components
Electronic applications

2

Production of displays, LEDs
and discretes

2.1
2.2
2.3

Display manufacturing
Manufacturing of Light Emitting Diodes (LED)
Manufacturing of discrete components(resistors, capacitors, transistors, diodes)

3

Photovoltaics production

3.1
3.2
3.3

Materials for Photovoltaics
Photovoltaic production technology
Factory planning and -equipment for photovoltaics

4

micronano-production/MEMS

4.1
4.2
4.3
4.4
4.5
4.6

Materials/substances
Production equipment
Test, measurement and adaptation equipment for microtechnology
Assembly and packaging technology for microintegration
Microtechnology applications
Nanotechnology

5

Clean room technology

5.1
5.2
5.3
5.4

Clean rooms
Clean-room maintenance and control
Clean-room equipment
Clean-room equipment for personnel

6

Materials processing

6.1
6.2
6.3
6.4
6.5
6.6
6.7

Mechanical processing other than PCB
Thermal treatment
Welding
Chemical and electroplate processing
Fastening, connecting
Laser material-processing systems
System periphery for laser-based manufacturing

B Cluster PCB & EMS
7

PCB and circuit-carrier manufacturing

7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
7.12

Base materials
Circuit-printing tools and photomasters
Tools, machines and accessories for PCB processing
Generating circuit structure
Chemical processing of PCBs
Heat treatment, drying
Solder-resist technology
Legend printing
Molded Interconnect Device (MID) production
Printed Circuit Board (PCB) handlingSpecial machines for power electronics
Special machines for the production of high frequency devices

8

Electronic Manufacturing Services (EMS)

8.1
8.2

EMS for component/chip carrier manufacturing
EMS for component assembly and device manufacturing
and Advanced Packaging
Development-related services

8.3

1World’s Leading Trade Fair forElectronics Development and Production
November 18–21, 2025
Trade Fair Center Messe München
productronica.com

Product Index

management@productronica.com, Tel. +49 89 949-20330
Messe München GmbH, Am Messesee 2, 81829 München, Germany

C Cluster SMT
9Component mount technology, pick & place

9.1
9.2
9.3
9.4

Component preparation
Component mount techniques, component mounting
Production
Handling technology

10 Soldering and joining technology for PCBs

10.1
10.2
10.3
10.4
10.5
10.6

Solders and soldering aids
Paste application systems and stencils
Soldering units
Soldering equipment
Soldering accessories
Gluing, dispensing, varnishing, coating

11 Test and measurement, quality assurance

11.1
11.2
11.3
11.4
11.5
11.6
11.7

Visual inspection, image processing
Materials testing
Measurement technology for non-electrical parameters
Measurement technology for electrical parameters
Test and measurement systems
Conveyors, handling systems, test adapters
Laboratory/test station equipment

12 Product finishing

12.1
12.2
12.3
12.4
12.5
12.6

Repair and rework
Programming equipment, memory components
Protective coating and potting
Hybrids
Housings
Electronic protective devices (EMC/ESD)

13 Production subsystems

13.1 Assembly and handling technology, Advanced Packaging
13.2 Drive technology
13.3 Systems for production data acquisition (PDA)

14 Production logistics andmaterial-flow technology

14.1
14.2
14.3
14.4
14.5
14.6
14.7
14.8
14.9

Information acquisition
Purchasing, Supply Chain Management
Merchandise management systems
Logistics management
Material-flow control
Transportation and conveyor technology
Storage technology and commissioning systems
Packaging technology
Complete solutions and turnkey systems for logistics

15 Production technologies for cables
and connectors

15.1
15.2
15.3
15.4
15.5
15.6
15.7

Cable and wire processing
Tools for wiring
Cable-processing equipment
OthersCable-protection devices
Processing equipment for cable-protection devices
Technology for detachable connections, connectors

16 Coilware production

16.1 Materials for coilware
16.2 Production equipment for coilware
16.3 Applications for coilware

D Cluster Cables, Coils & Hybrids2

World’s Leading Trade Fair forElectronics Development and Production
November 18–21, 2025
Trade Fair Center Messe München
productronica.com

Product Index

17 Hybrid-component manufacturing

management@productronica.com, Tel. +49 89 949-20330
Messe München GmbH, Am Messesee 2, 81829 München, Germany

17.1
17.2
17.3
17.4
17.5
17.6
17.7
17.8
17.9

Tooling and mouldmaking
Tools, tool equipment
Assembly and handling technology, periphery
Stamping
Shaping
Surface-finishing equipment, refinement
Injection molding for plastics
Metal/plastic composite technologies
Process and quality control/Automation

E Cluster Future Production—Smart Factory
18 Industry 4.0

18.1 Autonomous inter-connected micro systems, sensor and actuator
networks, cyber physical systems
18.2 Software: basic systems and development tools
18.3 Machine software
18.4 Manufacturing software
18.5 Business software
18.6 Software services
18.7 Application specific software

19 Production technologies for batteries
and electrical energy storage

19.1
19.2
19.3
19.4

Materials and components for batteries and electrical energy storage
Equipment for batteries and electrical energy storage
Inspection and test systems for batteries and electrical energy storage
Accumulators

20 Organic and printed electronics

20.1
20.2
20.3
20.4

Materials and components
Manufacturing equipment
Inspection and test systems
Applications and devices

21 3D Printing, Additive Manufacturing

21.1 Production equipment and process technology
21.2 Sub systems and machine components
21.3 Materials

F Overall Production Support
22 Production materials/equipment
and environmental technology

22.1
22.2
22.3
22.4
22.5
22.6

Preliminary products and semi-finished goods, metallic
Preliminary products and semi-finished goods, non-metallic
Process materials
Plant equipment
Decontamination, cleaning, disposal (environmental management)
Recirculation systems, supply, recycling

23 Services

23.1
23.2
23.3
23.4
23.5

Information provision
Production services except EMS
Used machines, systems, plants
Brainware and Sales
Other services

3World’s Leading Trade Fair forElectronics Development and Production
November 18–21, 2025
Trade Fair Center Messe München
productronica.com

Product Index
A

Cluster Semiconductor

1

Semiconductor production

1.1

1.1.1
1.1.1.1
1.1.1.1.1
1.1.1.1.2
1.1.1.1.3
1.1.1.1.4
1.1.1.1.5
1.1.1.1.6
1.1.1.1.7
1.1.1.2
1.1.1.2.1
1.1.1.2.1.1
1.1.1.2.1.2
1.1.1.2.1.3
1.1.1.2.2
1.1.1.2.3
1.1.2
1.1.2.1
1.1.2.2
1.1.2.3
1.1.2.3.1
1.1.2.3.2
1.1.3
1.1.3.1
1.1.3.1.1
1.1.3.1.2
1.1.3.1.3
1.1.3.1.4
1.1.3.2
1.1.3.2.1
1.1.3.2.2
1.1.3.2.3
1.1.4
1.1.4.1
1.1.4.1.1
1.1.4.1.2
1.1.4.1.3
1.1.4.1.4
1.1.4.1.5
1.1.4.1.6
1.1.4.1.7
1.1.4.1.8
1.1.4.2
1.1.4.2.1
1.1.4.2.2
1.1.4.2.3
1.1.4.2.4
1.1.4.2.5
1.1.4.2.6
1.1.4.2.7
1.1.4.2.8
1.1.4.2.9
1.1.4.2.10
1.1.4.2.11
1.1.4.2.12
1.1.4.2.13

Wafer front-end processing

Wafers and substrates
Materials
Wafers made of semiconductor material
Ceramic substrates
Thin-film substrates (glass/ceramic)
Glass wafers
Semiconductor semi-finished parts, miscellaneous
Ceramic foils
Process gases
Production equipment
Crystal growing systems and substrate treatment
Melt growthGas-phase growth
Tempering ovens
Polishing tools
Other tools for wafer processing
Mask and artwork generation
Mask production equipment
Resist-coating systems
Beam sources for exposure equipment
Lasers for exposure equipment
UV exposure light sources
Lithography
Lithography equipment
Microlithography equipment
Contact exposure equipment
Optical steppers
Laser writing equipment
Lithography materials
Resists, Developers & Ancillaries(incl. Adhesion promoter HMDS); Primer
AR coatings
Developers
Thin-film generation
Materials
Epitaxial materials
Process materials, thin-film technology, miscellaneous
Quartzware (silicon carbide, fused quartz glass, sapphire),
ceramics
Vapor deposition materials
Strippers
Sputter targets
Lapping, polishing and grinding agents
Process chemicals, Cleaning Chemicals, Solvents, miscellaneous
Production equipment
Diffusion ovens
Dosing devices
Heat treatment equipment for microstructuring,
miscellaneous
Cathode sputter equipment, PVD
CVD equipment, MOCVD; PECVD; LPCVD; ALD; REALD; MVD
Electron-beam deposition equipment
High-vacuum evaporation equipment
Ion-beam coating equipment
Oxidation equipment
Plasma coating systems
Plasma polymerization units
Vacuum coating equipment
Vacuum components

management@productronica.com, Tel. +49 89 949-20330
Messe München GmbH, Am Messesee 2, 81829 München, Germany

1.1.4.2.14
1.1.4.2.15
1.1.5
1.1.5.1
1.1.5.2
1.1.5.3
1.1.5.4
1.1.5.5
1.1.6
1.1.6.1
1.1.6.2
1.1.6.3
1.1.6.4
1.1.7
1.1.7.1
1.1.7.2
1.1.7.3
1.1.7.4
1.1.7.5
1.1.7.6
1.1.7.7
1.1.8
1.1.8.1
1.1.8.2
1.1.8.3
1.1.8.4
1.1.8.5
1.1.8.6
1.1.8.6.1
1.1.8.6.2
1.1.8.6.3
1.1.9
1.1.9.1
1.1.9.2
1.1.9.3
1.1.9.4
1.1.9.5
1.1.9.6
1.1.9.7
1.1.9.8
1.1.9.9

1.2

1.2.1
1.2.1.1
1.2.1.2
1.2.1.3
1.2.1.4
1.2.1.5
1.2.1.6
1.2.1.7
1.2.1.8
1.2.1.9
1.2.1.10
1.2.1.11
1.2.1.12
1.2.1.13
1.2.2
1.2.2.1
1.2.2.2

Evaporator inserts
Reactors for epitaxy
Etching equipment
Ion-etching equipment
Wet-etching equipment
Etching plasma generators
Spray etchers
Plasma-, sputter-etching equipment
Drying equipment
Continuous dryers
UV dryers
IR dryers
Vacuum dryers
Equipment for mechanical machining
Polishing devices/machines for semiconductor technology
Scribers and automatic scribers
Lapping equipment
Separating/trimming/scribing lasers
Wafer-cleaning systems
Wafer saws
Wafer dicing equipment
Manufacturing and machining equipment, miscellaneous
Plasma equipment, miscellaneous
Spray process machines, miscellaneous
Photoresist stripping systems
Substrate-cleaning systems
Wafer washers
Semiconductor technology process equipment, miscellaneous
Gas; liquid delivery panels as subsystems
Handling; transfer; loading systems; lifting devices
Temperature sensing; control; recirculators; chillers;
heat exchangers
Wafer/substrate handling
CTC wafer-handling equipment
Wafer-cassetting equipment
Wafer storage/shipping containers
Wafer mounters
Wafer/tape laminators/de-laminators
Wafer transfer systems
Wafer/chip manipulators
Marking equipment
Wafer/substrate handling systems, miscellaneous

Wafer back-end processing/Advanced Packaging

Chip handling
Component handlers
Component-handling machines, specialized
Die sorters
Sorting equipment for components
Lifter modules
Coordinate tables
Piezo actuators
Process carriers
Transport carriers
Micromanipulators
Micropositioning
Positioning systems, miscellaneous
Chip-handling equipment, miscellaneous
BondingPre-contacting processes
Plasma cleaning and activation equipment

4World’s Leading Trade Fair forElectronics Development and Production
November 18–21, 2025
Trade Fair Center Messe München
productronica.com

Product Index
1.2.2.3
1.2.2.3.1
1.2.2.3.2
1.2.2.3.3
1.2.2.4
1.2.2.4.1
1.2.2.4.2
1.2.2.4.3
1.2.2.4.4
1.2.2.4.5
1.2.2.4.6
1.2.2.5
1.2.2.5.1
1.2.2.5.2
1.2.2.5.3
1.2.2.5.4
1.2.2.5.5
1.2.2.5.6
1.2.2.5.7
1.2.2.5.8
1.2.3
1.2.3.1
1.2.3.2
1.2.3.2.1
1.2.3.2.2
1.2.3.2.3
1.2.3.2.4
1.2.3.2.5
1.2.3.2.6
1.2.3.2.7
1.2.3.2.8
1.2.3.2.9
1.2.3.2.10
1.2.3.3
1.2.3.3.1
1.2.3.3.1.1
1.2.3.3.1.2
1.2.3.3.1.3
1.2.3.3.1.4
1.2.3.4
1.2.3.4.1
1.2.3.4.2
1.2.3.4.3
1.2.3.4.4
1.2.3.4.5
1.2.3.4.6
1.2.3.4.7
1.2.3.5

Chip carriers
Semi-finished CC goods (metal/plastic)
Plastic-chip carriers (PCC)
Ceramic-chip carriers (including LTCC configurations)Internal connections
Bonding wires/tapes
Die bonders
Flip-chip bonders
Bonders, miscellaneous
Bumping systems
Dispensing systems
Tools
Ultrasonic bonders
Ultrasonic generators
Ultrasonic transducers
Ultrasound metrology
Contacting equipment, miscellaneous
Welding equipment for microconnections
Resistance soldering/welding equipment
Bonding tools, miscellaneous
Chip packaging
Housings
Caps and encapsulations, encapsulation equipment
Protective component caps
Glass, passivation/encapsulation
Ball-grid array packages
Potting compounds, encapsulations
Encapsulation materials, miscellaneous
Encapsulations and encapsulation equipment, miscellaneous
Epoxy-processing equipment
Sealants
Molding presses
Molding tools
Protective coatings for devices
Impregnating equipment for devices
Impregnating machines for metal
Vacuum pressure impregnating machines
Atmospheric pressure impregnating machines
Impregnating machines for laboratory and special applications
Potting equipment
Potting mixing/dosing equipment
Vacuum potting systems
Athmospheric potting systems
R&D and specialized potting systems
Automatic pressure gelation (APG)
Bearings and conveyor equipment for cast resins
Additional potting equipment, miscellaneous
Drying and hardening systems

1.3

Production of power electronics(IGBT, Power MOSFET, Thyristors, etc.)

1.3.1
1.3.2
1.3.3

Materials
Machines and production equipment
Housing and components

1.4

Measurement, detection and control systems
for semiconductor production

1.4.1
1.4.2
1.4.3
1.4.4
1.4.5

Monitoring and control units for clean-room technology
Monitoring systems, process-specificPositioning controllers
Control equipment, miscellaneous, application-specific
Computer; control; communication; data acquisition systems

1.5
1.6

Packaging and assembly materials
Electronic components

management@productronica.com, Tel. +49 89 949-20330
Messe München GmbH, Am Messesee 2, 81829 München, Germany

1.7

Electronic applications

2

Production of displays,
LEDs and discretes

2.1

2.1.1
2.1.1.1
2.1.1.2
2.1.1.3
2.1.1.4
2.1.2
2.1.2.1
2.1.2.2
2.1.2.3
2.1.2.4
2.1.2.5
2.1.2.6
2.1.2.7
2.1.3
2.1.3.1
2.1.3.1.1
2.1.3.1.2
2.1.3.1.3
2.1.3.1.4

2.2

2.2.1
2.2.1.1
2.2.1.2
2.2.1.3
2.2.1.4
2.2.1.5
2.2.1.6
2.2.1.7
2.2.2
2.2.2.1
2.2.2.2
2.2.2.3
2.2.2.4
2.2.2.5
2.2.2.6
2.2.2.7
2.2.2.8
2.2.2.9
2.2.2.10
2.2.2.11
2.2.2.12
2.2.2.13
2.2.2.13.1
2.2.3
2.2.3.1
2.2.3.2
2.2.3.3

2.3
2.3.1
2.3.2
2.3.2.1
2.3.2.2
2.3.2.3

Display manufacturing

Substrate processing for displays
Aligners, exposer systems for displays
CVD equipment for displays
Laser-annealing systems
Substrate processing for displays, miscellaneousMaterials, parts
Substrate materials
Spacers for displays
Functional organic materials (OLED)
Photomasks
Functional films, laminates for displays
Resins, adhesives for displays
Materials, parts, miscellaneous
Panel processing
Printers
Screen printers
Inkjet printers
Flexo printers
Display separation equipment

Manufacturing of Light Emitting Diodes (LED)Materials, components
Substrates (Sapphire, SiC, bulk Si, bulk GaN, composites,
InP; SiGe, etc.)
Material for buffer layers
Material for emitter layers, compound semiconductors
Optical components
Reflectors
Components for LED Package
Resins, material for sealing
Manufacturing equipment
Sapphire wafer equipment (crystal growth, sawing, grinding)
Silicon carbide wafer equipment (crystal growth, sawing, grinding)Wafer equipment for other LED-related semiconductors
Lithography
Etching
Metallization
DicingPick-and-place
Die attach
Bonding
Phosphor coating
Packaging, sealing, housing
Equipment for epitaxy
Organic/Organo-metallic vapour phase deposition(OMVPE, MOCVD)
Test systems
Life time test systems
Photometric test systems
LED test systems, miscellaneous

Manufacturing of discrete components(resistors, capacitors, transistors, diodes)

Materials for discrete components
Equipment for manufacturing of discrete components
Small parts precision manufacturing equipment
Vacuum technology equipment
Laser-processing equipment
for discrete components
5World’s Leading Trade Fair forElectronics Development and Production
November 18–21, 2025
Trade Fair Center Messe München
productronica.com

Product Index

management@productronica.com, Tel. +49 89 949-20330
Messe München GmbH, Am Messesee 2, 81829 München, Germany

2.3.2.4
2.3.2.5
2.3.2.6
2.3.2.7
2.3.2.8
2.3.2.9
2.3.2.10
2.3.2.11
2.3.2.12

Surface-finishing equipment
Continuous furnaces
Drying/curing equipment, miscellaneous
Finishing equipment for discrete components
Manufacturing equipment for capacitors
Manufacturing equipment for resistors
Manufacturing equipment for transistors/diodes
Film casting equipment
Processing equipment for discrete component manufacture,
miscellaneous

3.2.2.11
3.2.3
3.2.3.1
3.2.3.2

Equipment for thin-film production, miscellaneousEquipment for new generation solar cells
Equipment for concentrator photovoltaics (CPV)
Equipment for other novel solar concepts

3.3

Factory planning and -equipment
for photovoltaics

3

Photovoltaics production

3.1

Materials for Photovoltaics

3.1.1
3.1.2
3.1.3
3.1.4
3.1.5
3.1.6
3.1.7
3.1.8
3.1.9
3.1.103.2

3.2.1
3.2.1.1
3.2.1.1.1
3.2.1.1.2
3.2.1.2
3.2.1.2.1
3.2.1.2.2
3.2.1.2.3
3.2.1.2.4
3.2.1.2.5
3.2.1.2.6
3.2.1.2.7
3.2.1.2.8
3.2.1.3
3.2.1.3.1
3.2.1.3.2
3.2.1.3.3
3.2.1.3.4
3.2.1.3.5
3.2.1.4
3.2.1.4.1
3.2.1.4.2
3.2.1.4.3
3.2.1.4.4
3.2.1.4.5
3.2.1.4.6
3.2.2
3.2.2.1
3.2.2.2
3.2.2.3
3.2.2.4
3.2.2.5
3.2.2.6
3.2.2.7
3.2.2.8
3.2.2.9
3.2.2.10

Polysilicon, wafers (silicon, III-V semiconductors, aso.)
Materials for organic photovoltaics and novel solar cells
Glass substrates for thin-film photovoltaics
Process chemicals
Sputter targets
Materials for evaporation and CVD
Solder pastes
Ribbons
Adhesives
Foils, laminates for encapsulation/modular technology

Photovoltaic production technology

Equipment for wafer-based photovoltaics
Ingot and wafer production
Crystal growing equipment
Wafer inspection
Cell production
Wafer texturing
Diffusion furnaces
Etching equipment (wet etch, laser)
Deposition equipment (PECVD, Sputtering)
Printers for front and backside contacts
Print screens for metallisation
Drying furnaces/Fast-firing furnaces
Equipment for cell production, miscellaneous
Module production
Tabbers/Stringers/Soldering ovens/Bonder
Laminators
Framing units
Module test/Quality inspection
Equipment for module production, miscellaneousEquipment for cristalline photovoltaics, miscellaneous
Loaders/Unloaders
Automation, assembly and handling equipment
Laser processing equipment(sawing, drilling, edge isolation, marking)Resistance-/laser-welding equipment
Vacuum technology
Measurement tools/process control/environmental monitoring
Equipment for thin-film module production
Cleaning equipment
Deposition equipment (CVD, PVD)
Surface processing equipment/Priming/Conditioning/Resin coating
Laser processing equipment(sawing, drilling, edge isolation, marking)Encapsulation systems/Laminators
Soldering equipment
Module test/Quality inspection
Automation and handling equipment
Vacuum technology
Measurement tools/process control/environmental monitoring

3.3.1
3.3.2

Waste-gas abatement/Waste-water treatment
Turnkey solutions

4

micronano-production/MEMS

4.1

Materials/substances

4.1.1
4.1.2
4.1.3

4.2

4.2.1
4.2.1.1
4.2.1.2
4.2.1.3
4.2.1.3.1
4.2.1.3.2
4.2.1.3.3
4.2.1.4
4.2.2
4.2.2.1
4.2.2.2
4.2.2.3
4.2.2.4
4.2.3
4.2.3.1
4.2.3.2
4.2.3.3
4.2.3.4
4.2.3.5
4.2.3.6
4.2.3.7
4.2.3.8
4.2.4
4.2.4.1
4.2.4.2
4.2.4.3
4.2.4.4
4.2.5
4.2.5.1
4.2.5.2
4.2.5.3
4.2.5.4
4.2.5.5
4.2.5.6
4.2.5.7
4.2.5.8
4.2.5.9
4.2.5.10
4.2.5.11
4.2.5.12
4.2.5.13
4.2.5.14
4.2.6
4.2.6.1
4.2.6.2
4.2.6.3
4.2.6.4
4.2.6.5

Substrate materials for microtechnology
Nanomaterials
Materials for micro/nano technology, miscellaneous

Production equipment

Mask and artwork generation
CA mask generation
Resist-coating systems
Exposure tools
Pattern generators
Laser writing equipment
Exposure equipment, miscellaneous
Mask handling systems
Lithography, substrate processing
Microlithography equipment
Contact-printing equipment
Laser writing equipment
E-beam writers
Production technology for microsystems
Photo lithography
Double-sided lithography
UV depth lithography systems
Thin-film technology
Etching techniques
RIE (reactive ion etching)Laser ablation systems
Doping techniques
Tool and mould making
Micro tools
Prototype/sample manufacturing
Rapid prototyping
Rapid tooling
Micromachining and ultra-precision manufacturing
Micro tools
Micro milling machines
Drills for micromechanics
Grinders, micromechanical
Welding equipment for microconnections
Saw blades for microtechnology
Lasers for microtechnology materials
Ultrasonic machines
Micro-optic production machines
Production machines for micro hot stamping
Production machines for micro system technology, miscellaneous
Micro reaction systems
Microdosing systems
Production tools for microsystem technology, miscellaneous
Bonding for microtechnology
Substrate bonding
Anodic bonding
Fusion bonding
Glass reflow bonding
Adhesive bonding
6

World’s Leading Trade Fair forElectronics Development and Production
November 18–21, 2025
Trade Fair Center Messe München
productronica.com

Product Index
4.2.6.6
4.2.7
4.2.7.1
4.2.7.2
4.2.7.3
4.2.7.4
4.2.7.5
4.2.7.6
4.2.7.7
4.2.8
4.2.8.1
4.2.8.2
4.2.8.3
4.2.8.4

Eutectic bonding
Micro-assembly
Component mount techniques
Component mounting in microsystems
Micro technology mounting & assembly systems
Joining and interconnection techniques
Micro filters
Microrobotics
Nanorobotics
Microdrive technology
Piezo-electric actuators
Micro motors
Micro gears
Micro positionings

4.3

Test, measurement and adaptation equipment
for microtechnology
Assembly and packaging technology
for microintegration

4.4
4.4.1
4.4.2
4.4.3
4.4.4

4.5

On-Chip Integration, System-on-chip (SoC), Wafer-level packaging
On-Board Integration, Chip-on-Board (CoB)
Flip-chip assembly
System-in-Package (SiP), Multi-chip modules, 3D integration

Microtechnology applications

4.5.1
4.5.2

Micro manufacturing, precision technology
Lab-on-Chip, micro-process technology

4.6

Nanotechnology

5

Clean room technology

4.6.1
4.6.2
4.6.3
4.6.4

5.1

5.1.1
5.1.2
5.1.3
5.1.4
5.1.5
5.1.6

5.2

Nanochemistry, -materials, -substances
Nano tools, Nano analysis
Nanomanufacturing
Nanoelements/Nanosystems

Clean rooms

Clean rooms, built-in
Clean-room boxes, incl. walk-in
Clean hoods
Flow boxes
Laminar flow equipment
Dust-free workstations

Clean-room maintenance and control

5.2.1
5.2.2
5.2.3
5.2.4

Clean-room filter elements
Particle-monitoring equipment
Ionization systems
Flow visualization (clean rooms)

5.3

Clean-room equipment

5.3.1
5.3.2
5.3.3
5.3.4
5.3.5
5.3.6
5.3.7
5.3.8
5.3.9
5.3.105.3.11
5.3.125.3.13

5.4

5.4.1
5.4.2

Wet-process workbenches
Clean-room mats
Clean-room ovens
Clean-room dryers
Clean-room vacuum cleaners
Clean-room shelving/transport aids
Clean-room cabinets, nitrogen-rinsed
Clean-room tunnels
Clean-room consumables
Clean-room packaging
Electrostatic control equipment
Clean-room accessories, miscellaneous
Clean-room fittings, miscellaneous

Clean-room equipment for personnel

Air shower cabins, personnel
Clean-room clothing

management@productronica.com, Tel. +49 89 949-20330
Messe München GmbH, Am Messesee 2, 81829 München, Germany

5.4.3
5.4.4

Clean-room air locks
Clean-room equipment, miscellaneous

6

Materials processing

6.1.1
6.1.1.1
6.1.1.2
6.1.1.3
6.1.1.4
6.1.1.5
6.1.1.6
6.1.1.7
6.1.1.8
6.1.2
6.1.2.1
6.1.2.2
6.1.2.3
6.1.2.4
6.1.2.5
6.1.3
6.1.3.1
6.1.3.2
6.1.3.3
6.1.3.4
6.1.4
6.1.4.1
6.1.4.2
6.1.4.3
6.1.4.4
6.1.4.5
6.1.5
6.1.5.1
6.1.5.2
6.1.5.3
6.1.5.4
6.1.5.5
6.1.5.6

Drilling and milling
Fit-hole drilling equipment
Single-spindle drilling machines
Special drilling machines
Milling machines
3D milling machines
CNC processing equipment
XY tables
Drilling machines, miscellaneous
Cutting, separating
ShearsCircular saws
Saws, miscellaneous
Laser cutting machines
Scoring machines
Border machining
Deburring equipment, mechanical
Chamfering machines
Edge-finishing equipment
Edge-finishing machines, miscellaneous
Surface treatment
Brushing machines
Grinders
Wet-grinding equipment
Polishing equipment and materials
Equipment for surface treatment, miscellaneous
Tools and accessories
DrillsMilling cutters
Drilling aids
Brushes for surface treatment
Grinding discs
Surface treatment materials, miscellaneous

6.1

6.2

Mechanical processing other than PCB

Thermal treatment

6.2.1
6.2.2
6.2.3
6.2.4
6.2.5

DryingCuringAnnealing
Microwave heating
Medium- and high-frequency heating

6.3

Welding

6.3.1
6.3.2
6.3.3
6.3.4
6.3.5
6.3.6
6.3.7
6.3.8
6.3.9

6.4

6.4.1
6.4.1.1
6.4.1.1.1
6.4.1.1.2
6.4.1.2
6.4.1.2.1
6.4.1.2.2
6.4.1.2.3

Spot-welding units
Inert-gas welders
Ultrasonic welders for metal
Ultrasonic welders for plastics
Resistance welding equipment
HF welding
Thermocompression welding
Welding systems, miscellaneous
Shielding gases for welding

Chemical and electroplate processing

Chemical processing
Chemicals for etching and pickling
Etching resists
Chemical processing materials (non-chipping), miscellaneous
Machines for etching, pickling and other chemical processing
Etching equipment/machines
Continuous etching lines
Degreasing, chemical/thermal
7World’s Leading Trade Fair forElectronics Development and Production
November 18–21, 2025
Trade Fair Center Messe München
productronica.com

Product Index
6.4.1.2.4
6.4.1.2.5
6.4.1.2.6
6.4.1.3
6.4.2
6.4.2.1
6.4.2.1.1
6.4.2.1.2
6.4.2.1.3
6.4.2.2
6.4.2.2.1
6.4.2.2.2
6.4.2.3
6.4.2.3.1
6.4.2.3.2
6.4.2.3.3
6.4.2.3.4
6.4.2.4
6.4.2.4.1
6.4.2.4.2
6.4.2.4.3
6.4.2.4.4
6.4.2.4.5
6.4.2.4.6
6.4.2.4.7
6.4.2.4.8
6.4.2.4.9

Ultrasonic degreasing
Photochemical processing of thin precision parts
Machines for etching, pickling and other chemical processing,miscellaneous
Peripheral equipment, Dosage/metering equipment
Galvanic processing
Plate material
Tin anodes
Tin-lead anodes
Anodes, miscellaneousMaterials, miscellaneous
Electroplating aids
Anode hangers, anode baskets
Electrolytes
Gilding baths
Nickel baths
Process chemicals, electroplating
Electroplating chemicals, miscellaneous
Electroplating machines
Electroplating facilities, vertical
Electroplating facilities, horizontal
Precious-metal electroplating
Vibro-plating systems
Plating racks/frames
Heat exchangers, electroplating
Subsystems for electroplating
Small electroplating units
Electroplating equipment, miscellaneous

6.5

Fastening, connecting

B

Cluster PCB & EMS

7

PCB and circuit-carrier
manufacturing

7.1

7.1.1
7.1.1.1
7.1.1.2
7.1.2
7.1.2.1
7.1.2.2
7.1.2.3
7.1.3
7.1.3.1
7.1.3.2
7.1.3.3
7.1.3.4
7.1.3.5
7.1.3.6
7.1.3.7
7.1.3.8
7.1.3.9
7.1.3.10
7.1.3.11
7.1.3.12
7.1.4
7.1.4.1
7.1.4.2
7.1.5
7.1.5.1
7.1.5.2
7.1.5.3

Base materials

StripsCu and Cu alloy strips
Conducting strips
Foils
Cu/Al/Cu sandwich foil sets
Cu foils for base materials
Separating foils
Laminates
Paper laminates, copper-coatedComposite laminates/prepregs, copper-coated
Epoxy-glass laminates/prepregs, copper-coated
Cyanide ester laminates/prepregs
Polyamide/glass laminates/prepregs
PTFE/glass laminates
Metal-core composite laminates
Uncoated laminates
Flexible base materials
Photo-laminated base materials
Base materials, special-purpose
Laminates, miscellaneous
Substrates
Ceramic substrates
Metal substrates (including enameled)
Equipment and tools for base material manufacturing
Laminators for ML materials, automatic
Lamination presses
Vacuum-lamination presses

management@productronica.com, Tel. +49 89 949-20330
Messe München GmbH, Am Messesee 2, 81829 München, Germany

6.5.1
6.5.2
6.5.3
6.5.4
6.5.5

6.6

6.6.1
6.6.2
6.6.3
6.6.4
6.6.5
6.6.6
6.6.7
6.6.8
6.6.9

6.7

Connectors, mechanical
Screwdrivers and screw-driving machines
Automatic riveters/screw equipment
Press-fit insertion equipment
Fasteners, miscellaneous

Laser material-processing systems

Laser welding systems
Laser soldering installations
Laser cutting systems
Laser drilling systems
Laser marking and lettering systems
Laser trimming systems
Laser surface processing systems
Laser micro processing systems
Laser material processing systems, miscellaneous

System periphery for laser-based manufacturing

6.7.1
6.7.2
6.7.3
6.7.4
6.7.5
6.7.6
6.7.7
6.7.8
6.7.9
6.7.106.7.11
6.7.12

Drive and control engineering
Handling equipment
Laser robots
Monitoring and recognition systems
Control systems
Articulated arms
Laser working heads and adapters
Beam guidance telescopes
Cutting laser optics
Welding optics
Laser vapor extraction systems
Laser gases

7.1.5.4
7.1.5.5
7.1.5.6
7.1.5.7
7.1.5.8
7.1.5.9

Coating presses
Lamination registration equipment, ML
Multilayer production equipment, miscellaneous
Lamination aids
LTCC equipment (ML/SL)
Film casting equipment

7.2

7.2.1
7.2.1.1
7.2.1.1.1
7.2.1.1.2
7.2.1.1.3
7.2.1.1.4
7.2.1.2
7.2.1.2.1
7.2.1.2.2
7.2.1.2.3
7.2.1.2.4
7.2.1.2.5
7.2.1.2.6
7.2.1.2.7
7.2.2
7.2.2.1
7.2.2.1.1
7.2.2.1.2
7.2.2.1.3
7.2.2.1.4
7.2.2.1.5
7.2.2.2
7.2.2.2.1
7.2.2.2.2

Circuit-printing tools and photomasters

Foto circuit print
Materials
Photochemicals
Films/photo papers
Film storage
Photographic materials, miscellaneous
Exposure equipment
Photographic tools
Spotlight equipment
UV exposure equipment
UV cold-light exposure systems
UV post-polymerization equipment
Laser direct imaging (LDI) systems
Exposure equipment, miscellaneous
Stencil fabrication
Hard-copy equipment
Photo-plotters
Stencil printers
Registration machines for film originals
PCB scanners
Fine-line imaging equipment
Stencil production
Screen stencils
Screen-print masks8World’s Leading Trade Fair forElectronics Development and Production
November 18–21, 2025
Trade Fair Center Messe München
productronica.com

Product Index
7.2.2.2.3
7.2.2.2.4
7.2.2.2.5
7.2.2.2.6
7.2.2.2.7
7.2.2.2.8

Screen-printing inspection units
Stencil production lasers
Stencil production tools, miscellaneous
Metal stencils
Stencil production, miscellaneous
Stencil production storage

7.3

Tools, machines and accessories
for PCB processing

7.3.1
7.3.2
7.3.3
7.3.4
7.3.5
7.3.6
7.3.7
7.3.8
7.3.9
7.3.107.3.11
7.3.12
7.3.12.1
7.3.12.2
7.3.12.3

7.4

7.4.1
7.4.1.1
7.4.1.1.1
7.4.1.1.2
7.4.1.1.3
7.4.1.1.4
7.4.1.1.5
7.4.1.2
7.4.1.2.1
7.4.1.2.2
7.4.1.2.3
7.4.1.2.4
7.4.1.3
7.4.1.3.1
7.4.1.3.2
7.4.1.3.3
7.4.1.3.4
7.4.1.3.5
7.4.1.4
7.4.2
7.4.2.1
7.4.2.1.1
7.4.2.1.2
7.4.2.1.2.1
7.4.2.1.2.2
7.4.2.1.2.3
7.4.2.1.2.4
7.4.2.1.2.5
7.4.2.1.3
7.4.2.2
7.4.2.2.1
7.4.2.2.2
7.4.2.2.3
7.4.2.2.4
7.4.2.2.5
7.4.2.3
7.4.2.3.1
7.4.2.3.2
7.4.2.3.3

Drilling machines for PCBs
Drills for PCBs
Laser drills for microvias
Milling machines for PCBs
Milling cutters for PCBs
Drilling/milling spindles for PCB processing
Welding machines for PCBs
Drilling aids for PCBs
Press tools
Cutting tools
Special tools for PCB processing
Panel separation machines
Mechanical PCB separators
Laser PCB separators
Tools, machines and accessories, miscellaneous

Generating circuit structure

PCB production by screen printing
Thick film
Thick-film pastes
Dielectric pastes
Circuit path pastes
No-clean pastes
Resistance pastes
Screen-printing materials
Screen frames
Screen meshScreen-printing aids
Squeegees
Screen-printing equipment
Thick-film printers
Manual screen-printing units
Screen printers
Hybrid printers
Screen-printing aids, miscellaneous
Etch resist
Photoprinting
Lacquer-coating systems
Liquid photo resists
Coating equipment
Roller coaters
Curtain-coating systems
Spray-coating systems
InkJet direct imaging
Coating systems, miscellaneous
Circuit-printing registration systems
Dry resists
Dry-film resists
Roller-coating systems
Vacuum-coating systems
Coating equipment, miscellaneous
Dry-resist laminators
Exposure systems
UV-exposure systems
UV-exposure systems, automatic
Circuit-printing registration systems

management@productronica.com, Tel. +49 89 949-20330
Messe München GmbH, Am Messesee 2, 81829 München, Germany

7.4.2.3.4
7.4.2.3.5
7.4.2.3.6
7.4.2.3.7
7.4.2.4
7.4.2.4.1
7.4.2.4.2
7.4.3
7.4.3.1
7.4.3.2
7.4.4
7.4.4.1
7.4.4.2

7.5

7.5.1
7.5.1.1
7.5.1.2
7.5.1.3
7.5.2
7.5.2.1
7.5.2.2
7.5.2.3
7.5.2.4
7.5.3
7.5.4
7.5.4.1
7.5.4.2
7.5.5
7.5.5.1
7.5.5.2
7.5.5.3
7.5.5.4
7.5.5.5
7.5.5.6
7.5.5.7
7.5.6
7.5.6.1
7.5.6.2
7.5.6.3
7.5.6.4
7.5.6.5
7.5.7
7.5.7.1
7.5.7.2
7.5.7.3
7.5.7.4
7.5.7.5
7.5.7.6

7.6

Direct imaging systems
Laser imaging systems
Auxiliary equipment for exposure systems
Exposure systems, miscellaneous
Developing equipment
Developing machines
Foil-peeling equipment
PCB production by mechanical processing
Circuit diagram creation with milling cutter plotters
Microstructuring with diamond tools
PCB production by other direct processing
Direct circuit diagram creation with laser plotters
Direct circuit diagram creation

Chemical processing of PCBs

Chemicals for etching
Etching materials
Etching resists
Chemical processing materials (non-chipping), miscellaneous
Machines for etching
Small-scale etching units for PCBs
Etching equipment/machines
Continuous etching lines
Machines for etching, pickling and other chemical processing,miscellaneous
Through-plating
Via-hole plugging
Via-hole plugging machines
Via-hole plugging inks
Final surfaces for PCBs
Hot air solder leveling equipment
Chemical tin deposition
Chemical gold/silver deposition
Chemical palladium
Cu antioxidation coatings
Copper passivation
Passivation, miscellaneous
De-coating equipment
Dry-film removers
Photo-laminate stripping equipment
Solder mask stripping equipment
Tin stripping equipment
Film-stripping equipment, miscellaneous
PCB cleaning
ML inner-layer cleaning
PCB hole cleaning (de-smearing)
Rinse-processing equipment
Post-cleaning systems for PCBs
Plasma cleaning
Dust cleaning for PCB’s, films and other surfaces

Heat treatment, drying

7.6.1
7.6.1.1
7.6.1.2
7.6.1.3
7.6.1.4
7.6.1.5
7.6.1.6
7.6.1.7
7.6.1.8
7.6.1.9
7.6.1.10

Heat treatment
Conveyor belt ovens
Burn-in ovens
Heating equipment, miscellaneous
High-temperature ovens
IR treatment equipment
Microwave ovens
Radiation sources for heat treatment
Solar simulators for process work
Heat cabinets
Heat treatment, miscellaneous

7.6.2
7.6.2.1

DryingThick-film dryers
9World’s Leading Trade Fair forElectronics Development and Production
November 18–21, 2025
Trade Fair Center Messe München
productronica.com

Product Index
7.6.2.2
7.6.2.3
7.6.2.4
7.6.2.5
7.6.2.6
7.6.2.7
7.6.2.8

7.7

Hot-air drying/curing units
Air dryers
Screen-drying cabinets
Bench-top dryers
Drying chambers
Dryers, solder-resist masks
Dryers, miscellaneous

Solder-resist technology

7.7.1
7.7.2
7.7.3

Solder-resist masks
Solder-resist lacquers
InkJet solder mask application

7.8.1
7.8.2

InkJet legend printing
Screen-printing

7.8
7.9

7.9.1
7.9.2
7.9.2.1
7.9.2.2
7.9.2.3
7.9.3
7.9.3.1
7.9.3.2
7.9.4
7.9.4.1
7.9.4.2
7.9.4.3
7.9.5
7.9.5.1
7.9.5.2
7.9.6
7.9.6.1
7.9.6.1.1
7.9.6.1.2
7.9.6.1.3
7.9.6.1.4
7.9.6.1.5

7.10

Legend printing

Molded Interconnect Device (MID) production

Plastic granulates for MID production
Injection molding
Single-component injection molding
Two-component injection molding
Injection molds
Metallization
Chemical and galvanic metallisation
Physical vapor deposition (PVD)
MID Structuring
MID photostructuring
MID laser ablation
MID laser activation LDS
MID Assembly
3D mounting
MID connection technology
Forming of artificial material
Tools and machines
Injection-molding metering equipment
Injection-molding machines
Plastic-welding equipment
Molded interconnect devices
Structuring design equipment, 3D

Printed Circuit Board (PCB) handling7.10.1
7.10.27.10.37.10.4

Automatic loaders/unloaders for PCBs
Stacking devices for PCBs
PCB-separating equipment
PCB-handling aids, miscellaneous

7.11

Special machines for the production of
power electronics

C

Cluster SMT

9Component mount technology,
pick & place

9.1

Component preparation

9.1.1
9.1.2
9.1.3
9.1.4
9.1.5
9.1.6

Tin-plating equipment for component connections
Bending equipment for component connections
Trimmers for component preparation
DIL component aligners
Component separation equipment
Component preparation aids, miscellaneous

9.2

Component mount techniques, component mounting

9.2.1
9.2.1.1

Manual component insertion
Equipment for manual component insertion

management@productronica.com, Tel. +49 89 949-20330
Messe München GmbH, Am Messesee 2, 81829 München, Germany

7.12

Special machines for the production ofhigh frequency devices

8

Electronic Manufacturing Services (EMS)

8.1

EMS for component/chip carrier manufacturing

8.1.1
8.1.2
8.1.3
8.1.4
8.1.5
8.1.6
8.1.7
8.1.8
8.1.9
8.1.108.1.118.1.12

Layout services
Artwork production services
ML lamination/drilling services
Coating services
Laser engraving
Wire erosion
Laser welding
Laser cutting and singulation of IC carriers
Plating services
Reflow services
Surface treatment
Production services for component/chip carrier manufacturing,
miscellaneous

8.2

EMS for component assembly and device
manufacturing and Advanced Packaging

8.2.1
8.2.2
8.2.3
8.2.4
8.2.5
8.2.6
8.2.7
8.2.8
8.2.9
8.2.108.2.118.2.128.2.138.2.148.2.158.2.168.2.178.2.188.2.198.3

Layout services
Artwork production services
Solder mask services
Hybrid implementation
Component assembly
Bonding bare dies on PCBs
Flip chip assembly
Component assembly under cleanroom conditions
Metal machining
Manufacturing precision drilling and milling parts
Housings
Assembly and device manufacturing
EMD shielding
Coating services
CablingLabeling
Laser marking
Production services for component construction and equipment
manufacturing, miscellaneous
Lacquering subcontractors

Development-related services

8.3.1
8.3.2
8.3.3
8.3.4

Prototype manufacturing PCBs
Prototype manufacturing housings
Prototype manufacturing equipment
Prototype manufacturing, miscellaneous

9.2.1.2
9.2.2
9.2.2.1
9.2.2.2
9.2.2.3
9.2.2.4
9.2.2.5
9.2.2.6
9.2.2.7
9.2.2.8
9.2.3
9.2.3.1
9.2.3.2

Clinching tools for insertions
Automatic component mounting
Surface mount equipment
Mounting systems, through hole components
Semi-automatic mounting equipment
Pick-and-place machines for special components
Automatic mounting equipment for spatial chip carriers
Pin insertion machines
Accessories for mounting equipment
Mounting machines, miscellaneous
Component mounting systems, specialized
BGA mounting equipment
Flip-chip assembly systems

10World’s Leading Trade Fair forElectronics Development and Production
November 18–21, 2025
Trade Fair Center Messe München
productronica.com

Product Index
9.2.3.3
9.2.3.4

Waffle pack dispensers
Component mounting systems, specialized, miscellaneous

9.3

Production

9.3.1
9.3.2
9.3.3
9.3.4

Mounting lines
Mounting cells
Production lines for assembly, component placement,
connections, etc.
Robot cells for linking

9.4

Handling technology

9.4.1
9.4.1.1
9.4.1.2
9.4.1.3
9.4.1.4
9.4.1.5
9.4.1.6
9.4.1.7
9.4.2
9.4.2.1
9.4.2.2
9.4.2.3
9.4.2.4
9.4.3
9.4.3.1
9.4.3.1.1
9.4.3.1.2
9.4.3.1.3
9.4.3.1.4
9.4.3.1.5
9.4.3.1.6
9.4.3.2
9.4.3.2.1
9.4.3.2.2
9.4.3.2.3
9.4.3.2.4
9.4.3.2.5
9.4.4
9.4.4.1
9.4.4.2
9.4.4.3
9.4.4.4
9.4.4.5
9.4.4.6

10
10.1

10.1.110.1.210.1.310.1.410.1.510.1.610.1.710.1.810.2

10.2.110.2.210.2.310.2.410.2.5Material supply systems
Vibration conveyors
Clamping/fixing systems
Loading/unloading equipment for machines/workstations
Parts transfer systems
Bulk material feeder modules (component)
Storage systems (handling)
Linking/transfer equipment, miscellaneous
Automation
Assembly-handling equipment
Automatic loaders/unloaders for assemblies
Automation bus systems
Process automation equipment, miscellaneous
Robots and handling systems for material supply,
storage and logistics
Robots
Articulated robots
Industrial robots, miscellaneous
Frog-leg robots
Coordinate-type robots
Gantry-type robots
Swiveling-arm robots
Handling systems for material supply, storage and logistics
Assembly-handling equipment
Automatic loaders/unloaders for assemblies
Guidance parts/systems
Handling equipment, miscellaneous
Inert-gas storage
Control technology
Measurement, detection and control systems
Monitoring systems, process-specificMeasurement, detection and control systems, miscellaneous
Positioning controllers
Guidance technology equipment, miscellaneous
Control equipment, miscellaneous, application-specific

Soldering and joining technology
for PCBs
Solders and soldering aids

Solders, leaded
Solders, unleaded
Soldering pastes, leaded
Soldering pastes, unleaded
Flux for soldering
Soldered connection parts
Inert gas, cleaning gases
Soldering aids, miscellaneous

Paste application systems and stencils

Dispensers for soldering pastes
Screen-printing systems
Applicators, miscellaneous
Solder-paste printing stencils
Solder-paste application stencils

management@productronica.com, Tel. +49 89 949-20330
Messe München GmbH, Am Messesee 2, 81829 München, Germany

10.2.610.3

10.3.1
10.3.210.3.310.3.410.3.510.4

10.4.1
10.4.210.4.310.4.410.4.510.4.610.4.710.4.810.4.910.4.1010.4.1110.4.1210.4.1310.4.1410.5

10.5.1
10.5.210.5.310.5.410.5.510.5.610.5.7
10.5.810.5.9

10.6

Nano-coated SMD stencils

Soldering units

Soldering irons and workstations
Hot-air soldering units
Impulse soldering units
Inert-gas manual-soldering workstations
Soldering units, miscellaneous

Soldering equipment

Reflow soldering machines
Vapor-phase soldering machines
Laser soldering systems
Light soldering systems
Wave soldering machines
Flux-free soldering equipment
Selective soldering equipment
Robotic soldering equipment
Vacuum soldering ovens
Induction soldering equipment
Resistance soldering equipment
Dip soldering equipment
Heat-staking equipment
Soldering equipment, miscellaneous

Soldering accessories

Soldering frames, masks
Soldering-frame cleaning systems
Inert-gas technology
Preheating modules for soldering lines
Soldering-tip cleaning units
Reflow equipment
Soldering-vapor extractors
Soldering tips
Soldering accessories, miscellaneous

Gluing, dispensing, varnishing, coating

10.6.1
10.6.1.1
10.6.1.2
10.6.1.3
10.6.1.4
10.6.1.5
10.6.1.6
10.6.1.7
10.6.1.8
10.6.1.9
10.6.1.10
10.6.210.6.2.1
10.6.2.2
10.6.2.3
10.6.2.4
10.6.2.5
10.6.2.6
10.6.2.7
10.6.2.8
10.6.2.9
10.6.2.10
10.6.310.6.3.1
10.6.3.2
10.6.3.3

Adhesives and auxiliary materials
SMD adhesives
Acrylic/epoxy adhesives
Hot-melt adhesives
Adhesives, anisotropic
Adhesives, electrically conductive
Adhesives, heat-conducting
Heat-conducting pastes
Adhesive tapes
Insulated adhesive tapes
Adhesives, miscellaneousEquipment for processing and applying adhesives
Adhesive dispensers
Automatic dispensers
Ultra-small quantity dispensers
Multi-component dosage equipment
Adhesive tape dispensers
Adhesive curing lines
Hot-sealing presses, adhesives
Stencils for applying SMD adhesives
Heat-seal bonders
Adhesive-processing equipment, miscellaneous
Coating equipment
Flux application equipment
Varnishing equipment
Coating equipment, miscellaneous

11

Test and measurement, quality assurance

11.1

Visual inspection, image processing
11World’s Leading Trade Fair forElectronics Development and Production
November 18–21, 2025
Trade Fair Center Messe München
productronica.com

Product Index
11.1.111.1.1.1
11.1.1.2
11.1.1.3
11.1.1.4
11.1.1.5
11.1.1.6
11.1.1.7
11.1.1.8
11.1.1.9
11.1.1.10
11.1.1.11
11.1.1.12
11.1.1.13
11.1.1.14
11.1.1.15
11.1.1.16
11.1.2
11.1.2.1
11.1.2.2
11.1.2.3
11.1.2.4
11.1.2.5
11.1.2.6
11.1.2.7
11.1.2.8
11.1.2.9
11.1.311.1.3.1
11.1.3.2
11.1.3.3
11.1.411.1.4.1
11.1.4.2
11.1.4.3
11.1.4.4
11.1.4.5
11.1.4.6
11.1.4.7
11.1.4.8
11.1.4.9
11.1.4.10
11.1.511.1.5.1
11.1.5.2
11.1.5.3
11.1.5.4
11.1.5.5
11.1.5.6
11.1.5.7
11.1.5.8
11.1.5.9
11.1.5.10
11.1.5.11
11.1.5.12
11.1.5.13
11.1.5.14
11.1.5.15
11.1.611.1.6.1
11.1.6.2
11.1.6.3
11.1.6.4

Inspection systems
Solder paste inspection systems
Flux inspection systems
Bump inspection systems
Assembly inspection equipment
Optical inspection systems
Visual surface inspection systems
2D/3D inspection systems, miscellaneous
X-ray inspection systems
Robot visual systems
IC lead geometry testers
Wafer bond inspection systems
Optical inspection systems, miscellaneous
ML inner-layer inspection systems
Photomask inspection systems
Finish inspection systems for bare boards
Conformal Coating inspection systems
Image processing
Image-processing camera systems
Semiconductor cameras (CCD)
Cameras for observation purposes, miscellaneous
IR image systems
X-ray image systems
Image-processing accessories
Image-analysis systems, miscellaneous
Image-processing systems, miscellaneous
Print image control systems
Recognition systems
Pattern recognition systems
Position recognition systems
Color recognition systems
Microscopy
Stereo microscopes
Control/measurement microscopes
Confocal microscope systems
Video microscopes
Projection microscopes
Scanning probe microscopes
Electron microscopes
Ultrasonic microscopes
White-light interferometers
Microscopes, miscellaneous
Optical equipment and systems
Magnifying lenses
Scanner equipment
Projectors
Enlargers
Fiber optics
Automated optical-inspection systems (AOI)
Automated X-ray inspection (AXI)
3D laser measurement systems
Technical endoscopes
Cross-sectioning systems
Cross-section inspection systems
X-ray fluorescence analyzers
Optical-inspection equipment, miscellaneous
Optical-measurement equipment, miscellaneous
Visual-inspection aids, miscellaneous
Lighting
Microscope lighting
Lighting systems for image/pattern recognition
Stroboscopes
Equipment for image/pattern recognition and processing,miscellaneous

management@productronica.com, Tel. +49 89 949-20330
Messe München GmbH, Am Messesee 2, 81829 München, Germany

11.2

Materials testing

11.2.111.2.1.1
11.2.1.2
11.2.1.3
11.2.1.4
11.2.1.5
11.2.1.6
11.2.1.7
11.2.1.8
11.2.211.2.2.1
11.2.2.2
11.2.2.3
11.2.2.4
11.2.2.5
11.2.2.6
11.2.311.2.3.1
11.2.3.2

Material analysis
Pressure/tension testers
Hardness testers
Thermal analysis units
Electrical properties, miscellaneous test equipment for
Gas analyzers
Contamination-monitoring equipment
Wafer characterization equipment
Analyzers, miscellaneous
Surface analysis
Surface cleanliness testers
Flatness testers
Optical profilometers
Peak-to-valley measuring devices
Surface topography measurement systems
Surface test units, miscellaneous
Shape analysis
Accuracy-of-fit testers
Shape inspection equipment

11.3

Measurement technology for non-electricalparameters11.3.1
11.3.1.1
11.3.1.2
11.3.1.3
11.3.211.3.2.1
11.3.2.2
11.3.2.3
11.3.2.4
11.3.2.5
11.3.311.3.3.1
11.3.3.2
11.3.3.3
11.3.411.3.4.1
11.3.4.2
11.3.4.3
11.3.511.3.5.1
11.3.5.2
11.3.5.3
11.3.5.4
11.3.611.3.6.1
11.3.6.2
11.3.6.3
11.3.6.4
11.3.711.3.7.1
11.3.7.2
11.3.7.3
11.3.7.4
11.3.7.5
11.3.7.6
11.3.7.7

11.4

11.4.1
11.4.1.1
11.4.1.2
11.4.1.3
11.4.1.4

Measurement/testing of geometric parameters
Distance measurement devices
Film thickness meters
Drill-hole test units
Mechanical units
Force meters
Pressure measurement equipment
Vacuum measurement units
Bond-strength testers (CAW/COB/COF)
Shear-strength testers
Time and time-dependent parameters
Work measurement
Flow meters
Acceleration meters
Thermal units
Temperature meters
Temperature profile measurement
Microthermographs, non-contact
Environmental parameters
Climate control meters
Climate control sensors
Acoustic-noise meters
Shock vibration meters
Chemical and biological parameters
Strip analyzers for electroplating
pH/redox determination
O2-monitoring systems
Gas concentration meters
Optical parameters
Optical spectrum analyzers
Optical multimeters
Fiber-optic measuring equipment, miscellaneousSpectroscopy equipment
Probe preparation for spectroscopy
Calibration systems for non-electric systems
Accessories for non-electric measuring systems

Measurement technology for electrical parameters

General-purpose measurement equipment
Voltmeters
Current meters
Power meters
Multimeters, voltmeters

12World’s Leading Trade Fair forElectronics Development and Production
November 18–21, 2025
Trade Fair Center Messe München
productronica.com

Product Index
11.4.1.5
Resistance meters11.4.1.6
Capacitance meters11.4.1.7
Inductivity meters11.4.1.8
Impedance meters11.4.1.9
Function generators
11.4.1.10 Signal generators
11.4.1.11 Pulse generators
11.4.1.12 Oscilloscopes, analog
11.4.1.13 Oscilloscopes, digital
11.4.1.14 Timer/counter equipment
11.4.1.15 Electronic ballasts for measurement purposes
11.4.1.16 Powerline measurement equipment IEC 1000-3-3
11.4.1.17 Switching systems
11.4.1.17.1 Relay switching systems
11.4.1.17.2 PCI switching systems
11.4.1.17.3 PXI switching systems
11.4.1.17.4 LXI switching systems
11.4.1.17.5 VXI switching systems
11.4.1.17.6 GPIB/IEC-625 switching systems
11.4.1.17.7 Relay multiplexers
11.4.1.17.8 Measurement equipment, miscellaneous
11.4.1.17.9 Calibration equipment
11.4.2
Accessories for general-purpose measurement equipment
11.4.2.1
Test cables
11.4.2.2
Probes
11.4.2.3
Accessories, miscellaneous
11.4.3
Audio measurement equipment
11.4.4
RF measurement equipment
11.4.4.1
Signal generators
11.4.4.2
Sweep generators
11.4.4.3
Power meters11.4.4.4
Spectrum analyzers
11.4.4.5
Measuring receivers
11.4.4.6
Network analyzers, scalar/vector
11.4.4.7
Noise figure meters11.4.4.8
RF test equipment, miscellaneous
11.4.5Microwave measurement equipment
11.4.6
Accessories for RF and µW measurement equipment
11.4.6.1
RF measurement cables
11.4.6.2
Measurement bridges
11.4.6.3
Reflection bridges
11.4.6.4
Calibration kits
11.4.6.5
High-frequency test tips
11.4.6.6
Accessories for RF and µW measurement equipment,
miscellaneous
11.4.7
EMC measuring equipment
11.4.7.1
Power amplifiers
11.4.7.2
Antennas
11.4.7.3
Measuring receivers
11.4.7.4
Field-strength measurement devices
11.4.7.5
EMC test stand equipment
11.4.7.6
ESD testers
11.4.7.7
Testing electrical/magnetic properties, other devices for11.4.8
Mobile radio measurement equipment
11.4.8.1
Test systems for analog mobile radios
11.4.8.2
Test systems for digital mobile radios
11.4.8.3
Signal generators for digital mobile radio transmission
11.4.8.4
Analyzers for digital mobile radio transmission
11.4.8.5
Geographical radio-coverage analysis systems
11.4.8.6
Type-approval test systems
11.4.9
Digital-measurement equipment, miscellaneous
11.4.10
Communication test equipment
11.4.10.1 Sonet/SDH test equipment
11.4.10.2 LAN analyzers

management@productronica.com, Tel. +49 89 949-20330
Messe München GmbH, Am Messesee 2, 81829 München, Germany

11.4.10.3
11.4.10.4
11.4.1111.4.11.1
11.4.11.2
11.4.11.3
11.4.11.4
11.4.1211.4.12.1
11.4.12.2
11.4.12.3
11.4.12.4
11.4.12.5
11.4.12.6
11.4.12.7
11.4.13
11.4.13.1
11.4.13.2
11.4.13.3
11.4.13.4
11.4.13.5

11.5

11.5.1
11.5.1.1
11.5.1.2
11.5.1.3
11.5.1.4
11.5.1.5
11.5.1.6
11.5.1.7
11.5.1.8
11.5.1.9
11.5.1.10
11.5.2
11.5.2.1
11.5.2.2
11.5.2.3
11.5.2.4
11.5.2.5
11.5.2.6
11.5.2.7
11.5.2.8
11.5.2.9
11.5.2.10
11.5.2.11
11.5.2.12
11.5.2.13
11.5.2.14
11.5.311.5.3.1
11.5.3.2
11.5.3.3
11.5.3.4
11.5.411.5.4.1
11.5.4.1.1
11.5.4.1.2
11.5.4.1.3
11.5.4.1.4
11.5.4.1.5
11.5.4.1.6

PCM/PDH test equipment
TV and radio measurement equipment
Bus test systems
CAN-bus test systems
USB-bus test systems
PCI-bus test systems
Field-bus test systems
Peripheral equipment
Laboratory mains equipment
Multiplexers for measurement purposes
Measurement data transmission equipment
Data loggers
Laboratory instrumentation accessories
Standards for measurement/testing
Measurement data acquisition systems
Protective-measure test devices
Ground test equipment
Insulation testers
Short-circuit localization devices
Safety standards test systems (VDE, UL, TÜV, etc.)
Induction high-voltage testers

Test and measurement systems

Measurement systems for component testing
Test systems for passive components
Test systems for coilware/wound components
Relay testers
Semiconductor test systems
IC testers, digital
IC testers, analog
Mixed-signal test systems
CPU testers
Memory IC testers
Semiconductor burn-in test systems
Test systems for assemblies and hybrids
Bare-board testers
Substrate testers
Wiring test units
Wiring harness test units
Signature testers
In-circuit testers
Functional testers
Combination testers (in-circuit & function)
Test systems without adapters
Power supply testers
Keyboard testers
Boundary scan testers
Burn-in board testers
Wafer test systems
Test systems for photovoltaics
Solar simulators, Flasher
PV module simulators, I-V curve adjustment for inverters
Test systems for inverters
Test systems for photovoltaics, miscellaneous
Automated test systems for special purposes
Optical test
Optical circuit-board test systems
X-ray test systems
Automatic solder-paste print inspection equipment
Automatic solder-site inspection equipment
Optical display test
Optical test equipment, miscellaneous13

World’s Leading Trade Fair forElectronics Development and Production
November 18–21, 2025
Trade Fair Center Messe München
productronica.com

Product Index
11.5.4.2
11.5.4.2.1
11.5.4.2.2
11.5.4.2.3
11.5.4.2.4
11.5.4.2.5
11.5.4.2.6
11.5.4.3
11.5.4.3.1
11.5.4.3.2
11.5.4.3.3

11.6

Electrical test
High-ohm testers for R and I
Automatic high-voltage test equipment
Automatic power-semiconductor test equipment
Electro-optical function testers
In-line test stations
Electrical test systems, miscellaneous
Process control
Solderability testers
Reflow profilers
Process control, miscellaneous

Conveyors, handling systems, test adapters

11.6.1
11.6.1.1
11.6.1.2
11.6.1.3
11.6.1.4
11.6.1.5
11.6.1.6
11.6.2
11.6.2.1
11.6.2.2
11.6.2.3
11.6.2.4
11.6.2.5
11.6.311.6.3.1
11.6.3.2
11.6.3.3
11.6.3.4
11.6.3.5
11.6.3.6

Handling
SMD handlers for test purposes
In-line handling equipment
Wafer probers
Stamp equipment
Board handling systems
Handling systems, miscellaneous
Test aids
Test pins
Test sockets for components
Probe cards
Test probe head positioner
Test sockets; contactors and contact accessories
Adapters
Hydraulic adapters for unpopulated circuit carriers
Vacuum needle adapters
Pressure foot adapters
Pneumatic adapters
Moving-probe test adapters
Needle cards

11.7

Laboratory/test station equipment

11.7.1
11.7.1.1
11.7.1.2
11.7.1.3
11.7.1.4
11.7.2
11.7.2.1
11.7.2.2
11.7.2.3
11.7.2.4
11.7.311.7.3.1
11.7.3.2
11.7.3.3

Environmental and other simulation
Mains interference simulators
Solar-simulation equipment for testing
Vibration test equipment
Test area equipment, specialized, miscellaneous
Environmental simulation
Temperature and climatic testing cabinets
Stress-screening and Shock-test chambers
Test bays and walk-in, open-plan facilities
Environmental simulation aids, miscellaneous
Bench-top test and measurement equipment
Laboratory measurement aids, electrical
Laboratory measurement aids, non-electrical
Laboratory measurement accessories, miscellaneous

12

Product finishing

12.1

12.1.112.1.1.1
12.1.1.2
12.1.1.3
12.1.1.4
12.1.1.5
12.1.1.6
12.1.212.1.2.1
12.1.2.2
12.1.2.3
12.1.2.4
12.1.2.5

Repair and rework

Consumables
Sprays for electronics
Zipper closure encapsulation
Shrink-wrap productsProtective tubes/sleeves
Insulating sleeving
Rework aids
Repair systems
Solder removal/resoldering equipment
Solder paste systems
SMT repair workstations
Semi-automated repair workstations
Laser repair workstations

management@productronica.com, Tel. +49 89 949-20330
Messe München GmbH, Am Messesee 2, 81829 München, Germany

12.1.2.6
12.1.2.7
12.1.2.8
12.1.312.1.3.1
12.1.3.2
12.1.3.3
12.1.3.4
12.1.3.5
12.1.412.1.4.1
12.1.4.2

PCB-repair welding units
Hot-air fans
Repair workstations, miscellaneous
Hand tools
Insertion hand tools
Compressed-air hand tools
Electric hand tools
Hand tools
Special electronics hand tools
Tools, miscellaneous
Pneumatic cutters
Special machines

12.2
12.3

Programming equipment, memory components
Protective coating and potting

12.3.112.3.212.3.312.3.3.1
12.3.3.2
12.3.3.3
12.3.3.4
12.3.3.5
12.3.3.6
12.3.3.7
12.3.3.8
12.3.412.3.512.3.5.1
12.3.5.2
12.3.5.3

Protective coating systems
Impregnating machines
Potting equipment
Continuous automatic extruders
Potting mixing/dosing equipment
Vacuum potting systems
Athmospheric potting systems
R&D and specialized potting systems
Automatic pressure gelation (APG)
Bearings and conveyor equipment for cast resins
Additional potting equipment, miscellaneous
Dryers and curing systems
Protective coating agentsProtective lacquers
Encapsulating materials
Protective coatings, miscellaneous

12.4

Hybrids

12.5

Housings

12.4.112.4.212.5.1
12.5.1.1
12.5.1.2
12.5.1.3
12.5.212.5.312.5.3.1
12.5.3.2
12.5.3.3
12.5.412.5.512.5.5.1
12.5.5.2
12.5.5.3
12.5.5.4
12.5.5.5
12.5.5.6
12.5.5.7
12.5.5.8
12.5.5.9
12.5.5.10
12.5.5.11
12.5.5.12
12.5.5.13

12.6

12.6.1
12.6.2

Burn-in ovens
Laser trimmers
System racks
19'' racks and cabinets
Control cabinets
System racks for telecommunications
Small-scale housings,
miscellaneousSpecial housingsSpecialized component enclosures
Unit housings, miscellaneousSpecial housings, miscellaneousFeed-throughs, glas- and others
Accessories for housings
Card slots
Front panels for assemblies/devices
Front panels, customized
Housing seals
Knobs
Rubber and plastic parts for housings
Distance assembly fittings
Housing cover accessories
Conduits
Accessories for housings, miscellaneous
Slide bearings
Handles, housing
Heat shields

Electronic protective devices (EMC/ESD)

EMC-conducted
EMC-radiated14World’s Leading Trade Fair forElectronics Development and Production
November 18–21, 2025
Trade Fair Center Messe München
productronica.com

Product Index
12.6.2.1
12.6.2.2
12.6.2.3
12.6.2.4
12.6.312.6.412.6.4.1
12.6.4.2
12.6.4.3
12.6.5

Shielding (EMC)
Housings with EMC protection
HF seals
Polymer seals for housings
EMP protection devices
ESD protection devices
ESD mats
ESD floors
ESD protection devices, miscellaneousProtection components, miscellaneous

13

Production subsystems

13.1

Assembly and handling technology,
Advanced Packaging

13.1.113.1.213.1.313.1.413.1.513.1.613.1.713.1.813.1.913.1.1013.1.1113.1.12Assembly systems, assembly centers
Assembly components and supplies
Assembly equipment
Linking and transport equipment
Positioning systems
Automatic assemblers
Industrial robots
Service robots
Components for robot systems
Robotic assembly lines
Assembly and handling technology, miscellaneousHybrid Bonding Systems

13.2.113.2.1.1
13.2.1.2
13.2.1.3
13.2.1.4
13.2.1.5
13.2.1.6
13.2.1.7
13.2.1.8
13.2.1.9
13.2.213.2.313.2.3.1
13.2.3.2
13.2.3.3
13.2.413.2.4.1
13.2.4.2
13.2.4.3
13.2.4.4
13.2.4.5
13.2.4.6
13.2.4.7
13.2.4.8

MotorsAC motors
Brushless motors
DC motors
Torque motors
Micromotors
Stepper motors
Linear drives
Magnetic actuators
Actuators, miscellaneousGears, Geared motors
Actuators, miscellaneousTranslational direct drives
Pneumatic actuators
Positioning drives, miscellaneous
Accessories for actuators
Driver PCBs
Electromotor controllers/regulators
Roller bearings
Rail guides
Ball-bushing guides
Linear guides
Linear systems
Threaded spindle drives

13.2

13.3

Drive technology

Systems for production data acquisition (PDA)

13.3.113.3.213.3.313.3.413.3.5

Production
Assemblies for control applications
MPC assemblies
Controllers, programmable
Controllers, static signal

14

Production logistics andmaterial-flow technology

14.1

14.1.114.1.2

Information acquisition

Demand forecast tools
Real-time communication platforms

management@productronica.com, Tel. +49 89 949-20330
Messe München GmbH, Am Messesee 2, 81829 München, Germany

14.2
14.3
14.4

Purchasing, Supply Chain Management
Merchandise management systems
Logistics management

14.4.114.4.1.1
14.4.1.2
14.4.214.4.2.1
14.4.2.2
14.4.2.3
14.4.2.4

Consulting and planning for logistics management
Professional and trade associations
Logistics consulting
Engineering, development and planning for logistics
Planning of material flow
Production planning and control (PPC)
Process optimization
Quality analysis

14.5.1
14.5.1.1
14.5.1.2
14.5.1.3
14.5.1.4
14.5.1.5
14.5.214.5.2.1
14.5.2.1.1
14.5.2.1.2
14.5.2.1.3
14.5.2.1.4
14.5.2.1.5
14.5.2.2
14.5.2.2.1
14.5.2.2.2
14.5.2.2.3
14.5.2.2.4
14.5.2.3
14.5.2.3.1
14.5.2.3.2
14.5.2.3.3
14.5.2.3.4
14.5.2.3.5
14.5.2.4
14.5.2.4.1
14.5.2.4.2
14.5.2.4.3
14.5.2.4.4
14.5.2.4.5
14.5.2.4.6
14.5.314.5.3.1
14.5.3.2
14.5.3.3
14.5.3.4
14.5.3.5

Production planning and control
MRP/Material Required Planning
ERP/Enterprise Resource Planning
CIM/Compunter integrated Manufacturing
APS/Advanced Production Scheduling
MES/Manufacturing Execution System
Marking and identification
Printing
Printing/marking equipment, miscellaneous
Bar-code printer systems
Inkjet marking equipment
Engraving equipment
Laser marking systems for components
Badges, labels
Roll labels
Self-adhesive labels/signs
Bar-code labels
Metal signs
RFID Systems
Transponders, active
Transponders, passive
Smart label systems
Readers, reader stations
System integration
Other marking systems
Contactless marking systems
Coding systems
Laser markers
Printer systems for PCBs
Labeling equipment and tools, miscellaneous
Marking equipment and tools, miscellaneous
Identification
Laser scanners
Contactless identification parts
Marking/identification software
Bar-code readers
Identification systems, miscellaneous

14.6.1
14.6.214.6.314.6.4

Vertical conveyors and lifting equipment
Continuous conveyors
Transport equipment, miscellaneous
Loading and conveyor aids, miscellaneous

14.7.1
14.7.1.1
14.7.1.2
14.7.1.3
14.7.1.4
14.7.1.5
14.7.1.6
14.7.1.7

Pallets, bins and containers
Cassettes and cassetting equipment
Pallets and palletizing systems
SMD coil-stacking systems
Component feed equipment
Commissioning equipment
Warehouse equipment/units, miscellaneousTransport containers

14.5

14.6

14.7

Material-flow control

Transportation and conveyor technology

Storage technology and commissioning systems

15

World’s Leading Trade Fair forElectronics Development and Production
November 18–21, 2025
Trade Fair Center Messe München
productronica.com

Product Index
14.7.214.7.2.1
14.7.2.2
14.7.2.3
14.7.2.4
14.7.2.5
14.7.2.6
14.7.314.7.3.1
14.7.3.2
14.7.3.3
14.7.3.4
14.7.3.5
14.7.3.6
14.7.414.7.4.1
14.7.4.2
14.7.4.3

14.8

Containers and storage for PCBs
PCB containers
PCB cases
PCB cassettes
Stencil storage equipment
Film storage equipment
Containers, miscellaneous
Shelving and storage systems
Fixed-rack shelving
Flow shelves
Pallet and high-bay racking systems
Carrousel storage
Paternoster storage systems
Small-parts storage
Order-picking, sorting and distribution technology
Order-picking shelves
Order-picking carts and equipment
Automatic order-picking systems

Packaging technology

14.8.1

Materials

D

Cluster Cables, Coils & Hybrids

15

Production technologies for cables
and connectors

15.1

15.1.115.1.215.1.315.1.415.1.515.1.615.1.715.1.815.1.915.1.1015.1.1115.1.1215.1.12.1
15.1.12.2

15.2

15.2.115.2.215.2.315.2.415.2.515.2.615.2.715.2.815.2.915.2.1015.2.11

15.3

Cable and wire processing

Sheath-stripping equipment
Insulation-stripping equipment
Wire-trimming equipment
Wire croppers for low-profile undersides
Wire-bending units
Wire-coding units
Cable-winding equipment
Cable-assembly systems
Cable and wire processing aids, miscellaneous
Cable-assembly equipment
Winding tools (wire strands)
Thermal treatment
Stress relieve annealing
Other

Tools for wiring

Wire-crimping units
Cable-harness production equipment
Ultrasonic welders for cable harnesses
Resistance welders for wire harnesses
Cable strippers
Cable splicing equipment
Wiring machines
Wiring aids
Coax strippers
Cable ties and guides
Wiring tools, miscellaneous

Cable-processing equipment

15.3.1
15.3.215.3.315.3.415.3.515.3.615.3.7

Crimping tools
Bench-top crimping presses
Crimping units/machines, miscellaneous
Post crimp soldering equipment
IDC tools
Coax stripping tools
Optical-fiber stripping tools

15.4

Othersmanagement@productronica.com, Tel. +49 89 949-20330
Messe München GmbH, Am Messesee 2, 81829 München, Germany

14.8.1.1
14.8.1.2
14.8.1.3
14.8.1.4
14.8.1.5
14.8.1.6
14.8.214.8.2.1
14.8.2.1.1
14.8.2.1.2
14.8.2.2
14.8.2.2.1
14.8.2.2.2
14.8.2.2.3

Packaging materials
Blister belting strips
Blister belt cover strips
Belt spools for component belting
Recyclable packaging
Cardboard boxes
Packaging technology
Packaging machines for component packaging
Belting equipment
Packaging machines for component packaging
Machines for compiling load units
Film-sealing systems
Robots for packaging technology
Packaging machines, miscellaneous

14.9

Complete solutions and turnkey systems
for logistics

14.9.1
14.9.214.9.3

Planning services for logistics systems
Consulting for logistics systems
Delivery of turnkey systems

15.4.1
15.4.215.4.3

Cable ring binder equipment
Contacting units, miscellaneous
Control systems for cable-assembly systems

15.5

Cable-protection devices

15.5.1
15.5.215.5.3

Corrugated sheath processing machines
Heat shrinkable sleeves
Protective devices for cable harnesses, miscellaneous

15.6

Processing equipment forcable-protection devices

15.6.1
15.6.2

15.7

Corrugated sheaths
Corrugated sheaths, slottedTechnology for detachable connections, connectors

15.7.1
15.7.215.7.315.7.415.7.515.7.615.7.715.7.815.7.915.7.1015.7.1115.7.1215.7.1315.7.1415.7.15
15.7.16
15.7.17
15.7.18

Connector strips
Single-conductor connectors
Ribbon cable connectors
Cables with connectors
Cable terminals
Wire end ferrules
Crimp connectors and accessories
Terminals
Enameled-wire connectors
Plugs and sockets
Plug sockets, all types
Plug connectors for household appliances
Plug connectors for industrial electronics
Plug connectors for automotive electronics
Plug connectors for laboratory/test equipment
Plug connectors for aerospace
Plug connector parts, miscellaneous
Plug connectors, miscellaneous complete

16

Coilware production

16.1

16.1.116.1.2
16.1.316.1.416.1.516.1.6

Materials for coilware

Coil cores
Cut and toroidal coil cores
Enameled wire, copper-, silverSuperconducting wires
Transformer production aids, miscellaneous
Coil-winding technology materials, miscellaneous16

World’s Leading Trade Fair forElectronics Development and Production
November 18–21, 2025
Trade Fair Center Messe München
productronica.com

Product Index
16.2

Production equipment for coilware

management@productronica.com, Tel. +49 89 949-20330
Messe München GmbH, Am Messesee 2, 81829 München, Germany

16.2.116.2.216.2.316.2.416.2.516.2.616.2.716.2.816.2.916.2.1016.2.1116.2.1216.2.1316.2.1416.2.15

Stator coil winders
Fine-wire coil winders, automatic
Coiled-product assembly lines
Manual coil winders
Layer winders
Linear winders, automatic
Modular winding systems
Toroidal coil winders
Welding/soldering equipment for coiled-product connections
Transfer winding robots
Bench-type coil winders
Bobbin winders
Coil winders, miscellaneous
Coil-manufacturing aids, miscellaneous
Coil-winding technology tools, miscellaneous

17.3.9Cleaning equipment

17.4

Stamping

17.5

Shaping

16.3

Applications for coilware

17.6.1
17.6.217.6.317.6.417.6.517.6.617.6.717.6.817.6.916.3.1
16.3.2
16.3.316.3.416.3.516.3.616.3.7

Electric motor
Generators
Transformers
RelaysElectric magnets
Coilware for actuators, miscellaneous
Coilware for sensors, miscellaneous17

Hybrid-component manufacturing

17.1

17.1.1
17.1.2
17.1.317.2

17.2.117.2.217.2.317.2.417.2.517.2.617.2.717.2.817.2.917.3

Tooling and mouldmaking

Die making, tool making
Rapid prototyping
Tooling and mouldmaking, miscellaneous

Tools, tool equipment

Follow-on assembly tools
Press tools
Cutting tools
Injection moulding tools
Stamping tools
Deep-drawing tools
Separating tools
Bending tools
Tools, miscellaneous

Assembly and handling technology, periphery

17.4.1
17.4.217.4.317.4.417.5.1
17.5.217.5.317.5.417.5.517.5.617.6

17.7

17.7.1
17.7.217.7.317.7.417.7.517.7.617.8

17.8.1
17.8.217.8.317.9

17.9.1
17.9.217.9.317.9.417.9.517.9.617.9.717.9.817.9.917.3.1
17.3.217.3.317.3.417.3.517.3.617.3.717.3.8

Reeling/unreeeling machines
Destacking systems
Feeders, feed technology
Conveyor systems
Reels
Cooling equipment and systems
Assembly equipment and systems
RobotsE

Cluster Future Production—Smart Factory

18

Industry 4.0

18.1

Autonomous inter-connected micro systems,
sensor and actuator networks,
cyber physical systems

18.1.118.1.2
18.1.318.1.4Autonomous inter-connected micro systems,
sensor and actuator networks, wireless sensor networks
5G-Technology
Machine Learing/Big Data Analytics
Cyber Physical Systems (CPS)

18.1.518.1.618.1.718.1.818.1.918.1.1018.1.10.1
18.1.10.2

Presses
Stamping presses
Stamping machines and systems
Service-providers—stamping
Bending machines and systems
LathesRoll bending machines
Special-purpose machines
Service-providers—shaping
Equipment, spare parts and accessories for shaping,miscellaneous

Surface-finishing equipment, refinement

Etching machines and systems
Coating machines and systems
Electroplating machines and systems
Marking systems and equipment
Polishing machines and systems
Cleaning machines and systems
Grinding machines and systems
Service-providers—surface technology
Equipment, spare parts and accessories for surface treatment
and refinement, miscellaneous

Injection molding for plastics

Processing machines and systems
Extruders
Cooling equipment
Injection molding machines and systems
Service-providers—injection molding
Equipment, spare parts and accessories for injection molding
for plastics, miscellaneous

Metal/plastic composite technologies

Assemblies (mounted in plastic)
Inserts (plastic injection around inserted part)
Metal/plastic composite technologies, miscellaneous

Process and quality control/Automation

Production data-acquisition (PDA) systems
Measuring, testing and inspection equipment
Process measuring technology
Process control and automation
Process monitoring
Traceability equipment
Sensors
Regulation and control equipment
Equipment, spare parts and accessories for process and quality
control, miscellaneous

Energy harvesting
Human machine interfaces active/passive (touch panel displays,
barcode reader, RFID systems, augmented reality devices, aso.)
Information security/IP protection (embedded)
Product Security
Digital twin
Equipment with integrated sensor and actuator networks,
CPS
Condition Monitoring
Predictive Maintenance17

World’s Leading Trade Fair forElectronics Development and Production
November 18–21, 2025
Trade Fair Center Messe München
productronica.com

Product Index
18.1.10.3

18.2

Process controlling

Software: basic systems and development tools

18.2.118.2.218.2.318.2.418.2.518.2.6

Embedded systems
Development tools
Simulation systems
Programming systems
Networks and communication
Expert systems (AI-technologies)

18.3

Machine software

18.3.1
18.3.218.3.318.3.418.3.518.4

18.4.1
18.4.218.4.318.4.418.4.518.4.618.4.718.4.818.5

18.5.1
18.5.218.5.318.5.418.5.518.5.618.5.718.5.818.5.918.5.1018.5.1118.5.1218.5.13

18.6

18.6.1
18.6.218.6.318.7

18.7.1
18.7.218.7.318.7.3.1
18.7.3.2
18.7.3.3
18.7.3.4
18.7.3.5
18.7.418.7.4.1
18.7.4.2
18.7.4.3
18.7.518.7.5.1
18.7.5.2
18.7.5.3
18.7.5.4
18.7.6

Machine control software
Measurement technology (embedded into machines)
NC/CNC-path software
Bus systems
Machine vision software

Manufacturing software

Production control center, production data acquisition (PDA),
operating and machine data logging
Manufacturing Execution Systems (MES)
Advanced Planning & Scheduling (APS)
Process optimisation and simulation
Material flow control
Automated Process Control (APC)
Factory automation; cell controller software
Maintenance and service

Business software

Engineering (CAD, CAM, CAE, EDM, PDM, VR, DMU, etc.)
Variant configuration
Supplies/stock/ordering
Supply Chain Management (SCM)
ERP, PPS, order processing
Business process management
Project management
Business Intelligence
Quality management
Technical product documentation
Product Lifecycle Management
E-Business/E-Commerce/E-Market
Service management

Software services

management@productronica.com, Tel. +49 89 949-20330
Messe München GmbH, Am Messesee 2, 81829 München, Germany

18.7.718.7.7.1
18.7.7.2
18.7.7.3
18.7.7.4

Software for Material-flow control
Warehouse management and control systems
Commissioning systems
Production logistics systems
Visualization systems for material flow and warehouse logistics

19

Production technologies for batteries
and electrical energy storage

19.1
19.1.119.1.219.1.319.1.419.1.519.1.6

Cathode material, cathodes
Current Collector
Electrode Foil
Activated Carbon
Materials and components for battery modules
Materials/Components, miscellaneous

19.2

Equipment for batteries and electricalenergy storage

19.2.119.2.1.1
19.2.1.2
19.2.1.3
19.2.1.4
19.2.219.2.2.1
19.2.2.2
19.2.2.3
19.2.2.4
19.2.2.5
19.2.2.6
19.2.319.2.419.2.519.2.5.1
19.2.5.2
19.2.5.3
19.2.5.4
19.2.6

System development/-integration
Order specific software development
Quality and project management

19.2.7

Application specific software

19.3.1
19.3.219.3.319.3.419.3.519.3.6

Process control software for semiconductor and display production
Process control software for photovoltaics production
Process control software for PCB production
Gerber data processing programs
Drill data processing programs
PCB data generation systems
Check data processing programs
Software for printing tools, miscellaneous
Process control software for pick-and-place technology
Automation software
Visualizing software
Process software, miscellaneous
Measurement and test software
Measurement technology software
ATE software/postprocessors
Fault-detection software
Fault-detection software with user prompting
Control software for material processing

Materials and components for batteries
and electrical energy storage

19.3

Electrode and separator manufacturing equipment
Coating equipment
Film casting equipment
Drying equipment
Rolling Press Machine
Cell manufacturing equipment
Cutter
Stamping equipment
Stacking machines
Current collector welding machines
Cell packaging machines
Degassing equipment
Automation equipment
Assembly and handling equipment
Battery module equipment, battery pack assembly
Cell current collector contacting equipment (Soldering, welding,screwing)
Battery Management Systems and sensors mounting equipment
Assembly and handling equipment battery pack
Screwing equipment battery pack
Manufacturing equipment for batteries and energy storage,
miscellaneous
Clean room technology

Inspection and test systems for batteries
and electrical energy storage

19.3.7

Charge/Discharge Test Equipment
Insulation Tester
Life cycle tester, ageing
Impedance measuring equipment
Leak tightness test equipment
Battery simulators for system test (grid buffers for renewableenergy, e-mobility, etc.)
Inspection/Testing/Evaluation equipment, miscellaneous

19.4

Accumulators

20

Organic and printed electronics

20.1.1Substrates

19.4.1
19.4.219.4.319.4.3.1
19.4.3.2
19.4.3.3

20.1

Fuel cells
Supercaps/Ultracaps
Usage
Mobile use, high power (automotive, e-mobility)
Mobile use, low power/consumer (smart phone, laptop, etc.)
Stationary use (photovoltaics, renewable energy, buffer systems)

Materials and components

18World’s Leading Trade Fair forElectronics Development and Production
November 18–21, 2025
Trade Fair Center Messe München
productronica.com

Product Index
20.1.2
20.1.320.1.420.1.520.1.620.1.720.2

20.2.120.2.1.1
20.2.1.2
20.2.220.2.320.2.420.2.520.2.620.2.6.1
20.2.6.2
20.2.6.3
20.2.6.4
20.2.7

20.3

Conductors
Semiconductors
Dielectrics
Encapsulation materials and resins
Components for hybrid systems
Materials and components, miscellaneous

Manufacturing equipment

Print technology
Screen printing equipment
Ink-jet printers
Vacuum processes
Laser deposition equipment
Solution coating (spin coating, dip coating, etc.)
Roll-to-roll process
Assembly and packaging technology, system integration
Electrical contacting (flip chip, bonding, etc.)
Lamination equipment
System integration
Hybrid systems (polytronics)
Manufacturing equipment, miscellaneous

Inspection and test systems

20.3.1
20.3.220.3.320.3.4

Optical characterisation
Chemical characterisation
Quality/Process control
Inspection and test systems, miscellaneousF

Overall Production Support

22

Production materials/equipment andenvironmental technology

22.1

Preliminary products and semi-finished goods,
metallic

22.1.122.1.1.1
22.1.1.2
22.1.222.1.2.1
22.1.2.2
22.1.2.3
22.1.2.4
22.1.2.5
22.1.322.1.422.1.522.1.5.1
22.1.5.2
22.1.5.3
22.1.5.4
22.1.5.5
22.1.5.6
22.1.622.1.6.1
22.1.6.2
22.1.6.3
22.1.6.4
22.1.6.5
22.1.6.6
22.1.6.7
22.1.6.8

Sheet metal, strips
Strips, metal
Laminations and metal foils
Wires
Wires, bare
Wires for component connections
Copper wires, insulated
Silver wires, insulated
Wires, specialized cross-section
Springs
Plastics
CablesRibbon cables
RF cables
Coaxial cables
Round cables
Stranded wires for mains/low frequency
Cables, miscellaneous
Semi-finished goods
Etched parts
Lathed parts
Punch-pressed flexible parts
Drawn parts/semi-finished goods
Contact parts/semi-finished goods
Molded parts, miscellaneous
Mechanical components, miscellaneous
Semi-finished goods in electrical engineering, miscellaneous

22.2

Preliminary products and semi-finished goods,
non-metallic

management@productronica.com, Tel. +49 89 949-20330
Messe München GmbH, Am Messesee 2, 81829 München, Germany

20.4

Applications and devices

20.4.1
20.4.220.4.320.4.420.4.520.4.620.4.720.4.8Integrated Circuits (IC)Passive components
Antennas
RFID labels
Displays and lighting
Speakers
Smart objects/smart textiles
Polymer electronics, other applications

21

3D Printing, Additive Manufacturing

21.1

21.1.121.1.2
21.1.321.1.421.1.5

21.2

Production equipment and process technology

Laser Sintering
Selective Laser Melting
3D Printing/Binder Jetting
Digital Light Processing
other additive manufacturing processes

Sub systems and machine components

21.2.121.2.221.2.321.2.4Tools, nozzles, print heads
Support structures, object platforms, retractable tables
Software, CAD platforms
other sub systems and machine components

21.3

Materials

22.2.122.2.1.1
22.2.1.2
22.2.1.3
22.2.1.4
22.2.1.5
22.2.1.6
22.2.1.7
22.2.1.8
22.2.1.9
22.2.1.10
22.2.1.11
22.2.222.2.2.1
22.2.2.2
22.2.2.3
22.2.2.4

Pre-products
Duroplastic molded parts/semi-finished goods
Resin-bonded molded parts/semi-finished goods
Molded glass parts/semi-finished goods
Resin-bonded fabric
Plastic semi-finished goods
Industrial laminates (sheets, rods, tubes)
Thermoplastic molded parts/semi-finished goods
Silicones and silicone parts
Molded ceramic parts/semi-finished goods, miscellaneous
Plastic parts, miscellaneous
Insulated molded parts/semi-finished goods, miscellaneousMaterials, miscellaneous
Masks (including UV-curable)
Sealants
Seals
Foils, insulating

21.3.1
21.3.222.3

22.3.122.3.1.1
22.3.1.2
22.3.1.3
22.3.1.4
22.3.222.3.2.1
22.3.2.2
22.3.2.3
22.3.322.3.3.1
22.3.3.2
22.3.3.3
22.3.3.4
22.3.422.3.4.1

Plastic filaments
Metal granulates

Process materials

Lacquers
Photographic laminates (resists)
Protective lacquers
Solder mask lacquers
Insulating paints/lacquers
MetalsPrecious metals
Metals/alloys, pure/ultra-pure
Metallic powders
ChemicalsElectronics chemicals
Process chemicals, miscellaneous
Solvents
Chemicals, miscellaneous
Insulating materials
Insulating resins19World’s Leading Trade Fair forElectronics Development and Production
November 18–21, 2025
Trade Fair Center Messe München
productronica.com

Product Index
22.3.4.2
22.3.4.3
22.3.522.3.5.1
22.3.5.2
22.3.5.3
22.3.5.4
22.3.5.5
22.3.5.6
22.3.622.3.6.1
22.3.6.2
22.3.6.3
22.3.722.3.7.1
22.3.7.2

22.4

Impregnation insulating materials
Insulating materials, miscellaneous
Plastics
Elastomers
Polyester materials
Polyamides
Polymer materials, miscellaneous
Antistatic PE foam
Plastics, miscellaneous
Gases
Gases for semiconductor technology
Industrial gases
Gases, miscellaneous
Process materials, miscellaneous
Glass powders
Compound materials

Plant equipment

22.4.122.4.1.1
22.4.1.2
22.4.222.4.2.1
22.4.2.2
22.4.2.3
22.4.2.4
22.4.322.4.3.1
22.4.3.2
22.4.3.3
22.4.3.4
22.4.3.5
22.4.422.4.4.1
22.4.4.2
22.4.4.3
22.4.4.4
22.4.4.5
22.4.4.6
22.4.4.7
22.4.4.8
22.4.522.4.622.4.6.1
22.4.6.2
22.4.6.3

Clothing
Antistatic clothing
Clean-room garments
Furniture
Office/lab furniture
Vibration-proof tables
Lab desks
Stand-up aids
Equipment
Workstations, specialized
Lighting equipment
Floor coverings, specialized
Climate control equipment
Modular workstation systems
ESD protection
ESD working environment
ESD personnel grounding
ESD floor systems
ESD clean-room products
ESD protection
EGB workstation equipment
ESD packaging
Antistatic products, miscellaneousWork safety equipment
Plant fittings, miscellaneous
Power supplies higher than 3 kW
Workshop equipment, miscellaneousProtection materials, miscellaneous

22.5

Decontamination, cleaning, disposal(environmental management)

22.5.122.5.222.5.2.1
22.5.2.2
22.5.2.3
22.5.2.4
22.5.2.5
22.5.322.5.3.1
22.5.3.2
22.5.3.3
22.5.422.5.4.1
22.5.4.2
22.5.4.3
22.5.4.4

Decontamination
Cleaners
Solvents/cleaners
Defluxers
Stencil cleaners
Ultrasonic cleaning equipment
Cleaning agents, miscellaneous
Strippers
Photo-laminate strippers
Tin strippers
Strippers, miscellaneousEquipment and systems
Final-cleaning equipment (before population)
Sterilization equipment, UV
Semi-aqueous cleaning systems
Lead-frame cleaning systems

management@productronica.com, Tel. +49 89 949-20330
Messe München GmbH, Am Messesee 2, 81829 München, Germany

22.5.4.5
22.5.4.6
22.5.4.7
22.5.4.8
22.5.4.9
22.5.4.10
22.5.4.11
22.5.4.12
22.5.4.13
22.5.4.14
22.5.4.15
22.5.4.16
22.5.4.17
22.5.522.5.622.5.6.1
22.5.6.2
22.5.6.3
22.5.722.5.7.1
22.5.7.2

22.6

Film/surface cleaning units
Low-profile component cleaning systems
Plasma-cleaning systems
Screen-washing equipment
Underwipe cleaning
Rinsing equipment, specialized
Substrate-cleaning equipment
Reflow cleaning equipment
In-line washing stations
Ionizers
Cleaning equipment, specialized, miscellaneous
Washing/rinsing equipment, specialized, miscellaneous
Ultrasonic cleaning systems
Peripheral systems
Waste gas abatement
Waste gas abatement/exhaust extraction equipment
Chip/dust extraction equipment
Environmental protection equipment, miscellaneous
Scrapping
Scrap-electronics disassembly equipment
Obsolete electronic parts reprocessing equipment

Recirculation systems, supply, recycling

22.6.122.6.222.6.2.1
22.6.2.2
22.6.2.3
22.6.2.4
22.6.2.5
22.6.2.6
22.6.322.6.3.1
22.6.3.2
22.6.3.3
22.6.3.4
22.6.3.5
22.6.422.6.522.6.5.1
22.6.5.2
22.6.5.3
22.6.5.4
22.6.622.6.6.1
22.6.6.2
22.6.6.3
22.6.6.4
22.6.722.6.7.1
22.6.7.2

Preparation equipment, miscellaneous
Consumables for preparation equipment
Filter materials
Ultra-pure water filtration systems
Filtration equipment, miscellaneous
Resist filter systems in recirculation
Exhaust gas absorbers
Waste-water treatment chemicals
Supply systems
Chemical supply/feed systems
Ultra-pure gas supply systems
Ultra-pure water supply systems
Rinse-water circulation systems
Gas management systems
Exchangers, miscellaneous
Armatures
Valves, connectors
Vacuum valves
Pumps and pumping systems
Vacuum pumps
Cleaning
Process-water purification equipment (recirculation)
Waste-water treatment equipment
Etching-solvent reclamation equipment
Cleaning equipment, miscellaneous
Recycling
Metal recycling
Reclamation equipment, miscellaneous

23

Services

23.1

23.1.123.1.223.1.323.1.423.1.523.1.623.2

23.2.123.2.1.1
23.2.1.2

Information provision

Technical books
Technical journals and periodicals
Publications, miscellaneous
Databases, incl. online accessible
Product-information systems
Information, miscellaneous

Production services except EMS

Production services for semiconductors
Chip bonding
Chip packaging
20

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productronica.com

Product Index
23.2.1.3
23.2.223.2.2.1
23.2.2.2
23.2.2.3
23.2.2.4
23.2.2.5
23.2.323.2.3.1
23.2.3.2
23.2.423.2.4.1
23.2.523.2.5.1
23.2.5.2
23.2.5.3

23.3

23.3.123.3.223.3.323.4

23.4.123.4.1.1
23.4.1.2
23.4.1.3

Contacting services
Services for material machining
Laser welding/cutting
Plating subcontractors
Surface treatment
Metal machining
Manufacturing precision lathed and milled parts
Production services for components
Belting services
Testing/adjusting of component connections
Services for cable processing
Cable assembly
Test and measurement services
Test and test design services
Measurement and calibration services
Acceptance and approval services

Used machines, systems, plants

Plants
Machines
Used machines, systems and plants, miscellaneousBrainware and Sales

Consulting
Research institutes
Professional and trade associations
Information services and training

management@productronica.com, Tel. +49 89 949-20330
Messe München GmbH, Am Messesee 2, 81829 München, Germany

23.4.1.4
23.4.223.4.2.1
23.4.2.2
23.4.323.4.3.1
23.4.3.2
23.4.3.3
23.4.3.4
23.4.423.4.4.1
23.4.4.2
23.4.4.3

23.5

23.5.1
23.5.223.5.323.5.423.5.523.5.623.5.723.5.823.5.9Consultants, miscellaneous
Engineering services
Production line optimization
Setup concepts
Process optimization
Training
Education
Process optimization
Quality analysis
Sales
Equipment sales
Sales of production services
Manufacturers representation; distributors; sales, miscellaneous

Other services

Procurement services
Financial services
Parylene coatings
Maintenance services
Repair services
Disposal services
Packaging of material and liquids
Component database generation
other services, miscellaneous

21