WirelessCommunication
Module
AMP520Hardware User Guide
Rev. 1.2◈ Product Name: LTE & WCDMA / HSPA+ Wireless Module◈ Model Name: AMP520◈ Document No: NO.2015-0206◈ Approval No:

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Limitations of Liability
This user guide is provided “as is” and the recipient of the user guide shall endorse all risks arisingfrom its use.
In no event shall AM Telecom has any responsibility for any damages if the product(s) has been
improperly stored, installed, used or maintained, or if it has been made under any unauthorized
modifications, adjustments and/or repairs to such product(s).
In no event will am telecom or its affiliates be liable for any lost profits, lost savings or incidental,
indirect, special or consequential damages, arising out of use or inability to use the product, even if
advised of the possibility of such damages. some states do not allow the limitation or exclusion of
liability for incidental or consequential damages so the above limitation or exclusion may not apply.

Copyright ⓒ AM Telecom co.,Ltd, 2014
Transmittal, reproduction, dissemination and(or) editing of this document as well as utilization of
its contents and communication thereof to others without express authorization are prohibited.
Offenders will be held liable for payment of damages. All rights are reserved.

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■

Revision History

VersionDate

Description

Author

1.0

2014.07.25

Initial release

S.W HAN

1.1

2014.10.30

Hardware User Guide_Rev.1.1 release

S.W HAN

1.2

2015.02.06

Update 3. Modem interface description

S.W HAN

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[ Contents ]Introduction............................................................................................................................ 6
1. System Layout & Specification ................................................................................... 7
1.1.

Physical feature ............................................................................................................................................ 7

1.2.

Interface parts specification.................................................................................................................... 8

1.3.

Modem specification ................................................................................................................................. 9

1.4.

RF specifications........................................................................................................................................ 11

1.5.

System block............................................................................................................................................... 17

2. Interface Connector ..................................................................................................... 18
2.1.

Pin assignment .......................................................................................................................................... 18

2.2.

Pin description ........................................................................................................................................... 20

3. Modem Interface Description ................................................................................... 23
3.1.

Power supply .............................................................................................................................................. 23

3.2.

USB.................................................................................................................................................................. 23

3.3.

Power_key .................................................................................................................................................... 23

3.4.

RESET_N ........................................................................................................................................................ 24

3.5.

USIM ............................................................................................................................................................... 25

3.6.

UART ............................................................................................................................................................... 26

3.7.

GPIO ............................................................................................................................................................... 26

3.8.

WAKE_ON_WWAN_N .............................................................................................................................. 26

3.9.

Reserved ....................................................................................................................................................... 27

4. Current Consumption .................................................................................................. 28
4.1.

Standby current ......................................................................................................................................... 28

4.2.

Operating current ..................................................................................................................................... 28

4.3.

In-rush current ........................................................................................................................................... 29

4.4.

Leakage current ......................................................................................................................................... 29

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5. Signal Timing ................................................................................................................ 30
5.1.

Power on sequence ................................................................................................................................. 30

5.2.

Reset sequence .......................................................................................................................................... 30

6. Mechanical Design Guide ........................................................................................... 31
6.1.

PCB layout guide ...................................................................................................................................... 31

6.2.

Insert nut & screw guide ...................................................................................................................... 31

7. Module Assembly ........................................................................................................ 33
8. Packaging....................................................................................................................... 34
8.1.

Product label dimension ....................................................................................................................... 34

8.2.

Packaging method ................................................................................................................................... 34

9. Cautions ......................................................................................................................... 35
9.1.

Safety precautions .................................................................................................................................... 35

9.2.

Product handling precautions ............................................................................................................ 35

10. Acronyms ....................................................................................................................... 37
11. Contact Information .................................................................................................... 39

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Introduction
This module (LTE & WCDMA/HSPA) is designed with a Qualcomm MDM9215 chipset
solution.

It supports LTE_FDD with small size and thin 2mm thickness.

This module is designed on Linux OS that software design is simple. It will be given a best
choice to all customers who want 4G & 3G wireless data communication. Any portabledevices such as Laptop, Tablet PC and PDA, and various M2M devices can be designed withminimum efforts.
TELEC certification number is 003-140259
JATE certification number is D140192003

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1. System Layout & Specification
1.1. Physical feature
ITEM

Specification

Dimension

30.0 x 42.0 x 2.2 mm

WeightTyp. 6.0 gram

Mounting hole

1 holeB

A(Fig. 1) Physical dimension
Note A: Main antenna for LTE, WCDMA and HSPA+ modes
Note B: Aux antenna for LTE_RX, and GPS modes

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1.2. Interface parts specification
1.2.1. Coaxial RF connector
a. Manufacturer : Murata
b. Part number : MM4829-2702RB0
c. Dimension(Fig.2) Coaxial RF connector dimension

1.2.2. Interface connector① Host parta. Manufacture: Kyocera.
b. Parts number: 24-6411-067-101-894B
c. Dimension: 21.9mm x 8.7mm x 2.0mm

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1.3. Modem specification
1.3.1 Module frequency specification
Technology

RF BandFrequency Range(MHz)Diversity

Band 1

1920 ~ 1980 (UL) , 2110 ~ 2170 (DL)O

Band 19830 ~ 845 (UL), 875 ~ 890 (DL)O

Band 211447.9 ~ 1462.9 (UL) ,1495.9 ~ 1510.9(DL)

O

WCDMA

Band 1

1920 ~ 1980 (UL), 2110 ~ 2170 (DL)O

(HSPA)

Band 19830 ~ 845 (UL), 875 ~ 890 (DL)O

GPS

Tracking sensitivity: -157dBm<, Fc=1575.42Mhz

LTE

1.3.2

Comment

Module frequency specification (Qualcomm MDM9215)

Standard

FeatureDownlink 64 QAM; up to 21 Mbps
Uplink 16 QAM; up to 5.76 Mbps

R7 HSPADTX and DRX
Enhanced F-DPCH
Layer 2 optimizations
Enhanced cell forward access channel (FACH)

R99,R5,R6

Downlink : up to 14.4Mbps
Uplink ; up to 5.76 Mbps

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1.3.3

LTE network feature summary (Qualcomm MDM9215)

Standard

Feature
FDD: up to 100 Mbps downlink, 50 Mbps uplink
1.4 to 20 MHz RF bandwidth

R8 Cat3

2 × 2 downlink SU-MIMO;

FDD

IPv6, QoS
Inter-RAT capabilities with WCDMA, HSPA and applicablebackward-compatible modes

1.3.4

Electrical specification

Parameter

Description

Min. Typ. Max. Units

Absolute maximum voltage

-

-

5

V

Supply Voltage

3.0

3.3

3.6

V

VIH

High-level Input Voltage, CMOS

1.2

1.8

2.1

V

VIL

Low-level Input Voltage, CMOS

0

0

0.6

V

VOH

High-level Output Voltage, CMOS

1.2

1.8

2.1

V

VOL

Low-level Output Voltage, CMOS

0

0

0.45

V

+VPWR

Note : Refer to 4. Current consumption

1.3.5

Environment specification

ITEM

Spec.

Storage Temperature-40℃ to + 90℃

Operating Temperature-40℃ to + 85℃

Humidity (Operational)

85%(50℃) relative humidity

Vibration (Operational)

5Hz to 500Hz sinusoidal, 1.0G

Drop

No damages after 75cm drop over concrete floor

ESD [Electrostatic discharge]+/- 1 kV Human Body Model (JESD22-A114-B)

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1.4. RF specifications
1.4.1. RX/TX Frequency specification -WCDMA mode
Item

Specification

Maximum Output Power+23 dBm / 3.84 MHz, +1 / -3 dB

Frequency Error

within ±0.1 PPM

Open Loop Power Control

Normal conditions : within ±9 dB,
Extreme conditions : within ±12 dB

Minimum Transmit Power

< -50 dBm /3.84 MHz

Occupied Bandwidth< 5 MHz at 3.84 Mcps (99% of power)

Adjacent Channel Leakage> 33 dB @ ±5 MHz,Power Ratio> 43 dB @ ±10 MHz< -36 dBm / 1 kHz RW @ 9 kHz ≤ f < 150 kHz< -36 dBm / 10 kHz RW @ 150 KHz ≤ f < 30 MHz< -36 dBm / 100 kHz RW@ 30 MHz ≤ f < 1 GHz

Spurious Emissions< -30 dBm / 1 MHz RW @ 1 GHz ≤ f < 12.75 GHz|f-fc| > 12.5 MHz< -41 dBm / 300 kHz RW @ 1893.5 MHz < f < 1919.6 MHz< -67 dBm / 100 kHz RW @ 925 MHz ≤ f ≤ 935 MHz

Transmit Intermodulation< -79 dBm / 100 kHz RW@ 935 MHz < f ≤ 960 GHz< -71 dBm / 100 kHz RW@ 1805 MHz ≤ f ≤ 1880 MHz< -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz
when Interference CW Signal Level = -40 dBc

Error Vector Magnitude< 17.5 %, when Pout ≥ -20 dBm

Peak Code Domain Error< -15 dB at Pout  -20 dBm

Reference Sens. Level

BER < 0.001 when

Maximum Input Level

BER < 0.001 when Îor = -25 dBm / 3.84 MHz

Adjacent Channel Selectivity (ACS)Blocking Characteristic

Îor = -106.7 dBm / 3.84 MHz

ACS > 33 dB where BER < 0.001 whenÎor = -92.7 dBm / 3.84

MHz & Ioac = –52 dBm / 3.84 MHz @ ±5 MHz
BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = ±10 MHz

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or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = ±15 MHz
Spurious Response

BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz & Iblocking = 44 dBm
BER < 0.001 when Îor= -103.7 dBm / 3.84 MHz

Intermodulation& Iouw1 = -46 dBm @ Fuw1(offset) = ±10 MHz& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = ±20 MHz

Spurious Emission< -57 dBm / 100 kHz BW @ 9 kHz ≤ f < 1 GHz< -47 dBm / 1 MHz BW @ 1 GHz ≤ f ≤ 12.75 GHz

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1.4.2. RX/TX frequency specification -HSPA mode
Item
Maximum

Specification
OutputPower

Sub-Test
1=1/15,2=12/15

21~25dBm / 3.84 MHz

3=13/15

4=15/820~25dBm / 3.84 MHz

5=15/7

6=15/019~25dBm / 3.84 MHz

Sub-test
in table
C.10.1.4
HS-DPCCH

5

Power

Power

step

boundary

Adjacent

ChannelP [dB][dB]

2

Start of CQI

1+/- 0.6

3

Middle of CQI0+/- 0.6

4

End of CQI

5+/- 2.3

2=12/15, 3=13/15, 4=15/8, 5=15/7,
Minimum requirement

6=15/0Measurement
Bandwidth

2.5 ~ 3.5 MHz-35-15×(△f-2.5)dBc

30 kHz

3.5 ~ 7.5 MHz-35-1×(△f-3.5)dBc

1 MHz

7.5 ~ 8.5 MHz-35-10×(△f-7.5)dBc

1 MHz

8.5 ~ 12.5 MHz-49dBc

1 MHz

Sub-Test : 1=1/15,

2=12/15, 3=13/15, 4=15/8, 5=15/7,> 33 dB @ ±5 MHz

Power Ratio (ACLR)> 43 dB @ ±10 MHz

Maximum

Sub-Test : 1=1/15,

2=12/15, 3=13/15, 4=15/8, 5=15/7,

BLER < 10%

R >= 700kbps

Leveltolerance+/- 2.3

Leakage

Input

power step

6

carrier △f

Mask

step size,

Start of Ack/Nack

Frequency offset fromEmissionslot

Transmitter

1

Sub-Test : 1=1/15,

Spectrum

step

Power

or

6=15/06=15/0(BLER or R), 16QAM
Only

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1.4.3. RX/TX frequency specification -LTE mode
Specification
Item
BW

Maximum
OutputPower(Class III)

Minimum
OutputPwr

Frequency
Error

EVM

UL confDL
conf

requirement
Mod

RB

OffsetUnits

5/10/20M

N.A

QPSK

1

0/0/0

5/10/20M

N.A

QPSK

1

24/49/99

20M

N.A

QPSK

18

0

20M

N.A

QPSK

18

82

23dBm

10M

N.A

QPSK

12

0

+/- 2.7dBm

10M

N.A

QPSK

12

38

5M

N.A

QPSK

8

0

5M

N.A

QPSK

8

17

20M

N.A

QPSK

100

0

10M

N.A

QPSK

50

0

5M

N.A

QPSK

25

0

20M

N.A

QPSK

50

50

10M

N.A

QPSK

50

0

5M

N.A

QPSK

25

0

20M

N.A

QPSK/16QAM

18

0

20M

N.A

QPSK/16QAM

18

82

20M

N.A

QPSK/16QAM100

0(QPSK)10M

N.A

QPSK/16QAM

120<12.5%10M

N.A

QPSK/16QAM

12

38

10M

N.A

QPSK/16QAM

50

0<- 39 dBm

within ±0.1 ppm+ 15Hz< 17.5%(16QAM)

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In-bandemissionsfor nonallocated
RB

Spectrum
Flatness

5M

N.A

QPSK/16QAM

8

0

5M

N.A

QPSK/16QAM

8

17

5M

N.A

QPSK/16QAM

25

0

20M

N.A

QPSK

18

0

20M

N.A

QPSK

18

82

10M

N.A

QPSK

12

0

10M

N.A

QPSK

12

38

5M

N.A

QPSK

8

0

5M

N.A

QPSK

8

17

20M

N.A

QPSK

100

0

10M

N.A

QPSK

50

0

<- 24.2 dB

Range1:F UL_Meas - F UL_Low≥3 MHz and F
UL_High - F UL_Meas≥3 MHz,Max Ripple : 4 p-p dB
Range2:

5M

N.A

QPSK

25

0

F UL_Meas - F UL_Low< 3 MHz andF UL_High - F UL_Meas< 3 MHz,Max Ripple : 8 p-p dB

Occupiedbandwidth

ACLR
Adjacent
ChannelLeakage
Power
Ratio)

20M

N.A

QPSK

100

0

10M

N.A

QPSK

50

0

5M

N.A

QPSK

25

0

20M

N.A

QPSK/16QAM

18

0

20M

N.A

QPSK/16QAM

18

82

20M

N.A

QPSK/16QAM

100

0

10M

N.A

QPSK/16QAM

12

0

10M

N.A

QPSK/16QAM

12

38

10M

N.A

QPSK/16QAM

50

0

5M

N.A

QPSK/16QAM

8

0

20MHz
10MHz
5MHz

UTRAACLR1 :<-32.2dB
UTRAACLR2 :<-35.2dB
E-TRAACLR1 :<-29.2dB

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Transmitter
Spurious
emissions

5M

N.A

QPSK/16QAM

8

17

5M

N.A

QPSK/16QAM

25

0

20M

N.A

QPSK/16QAM

18

0

20M

N.A

QPSK/16QAM

18

82

20M

N.A

QPSK/16QAM

100

0

BW 5Mhz :10 ΔFOOB(Mhz) ,BW10Mhz :15 ΔFOOB(Mhz) ,BW20Mhz :25 ΔFOOB(Mhz)*ΔF OOB ( Δ Frequency of Out Of Bandemission)

10M

N.A

QPSK/16QAM

12

0

9 kHz≤f<150kHz; Limit -36 dBm,

10M

N.A

QPSK/16QAM

1238

measurement BW 1khz

10M

N.A

QPSK/16QAM

50

0

5M

N.A

QPSK/16QAM

8

0

30 MHz≤f<1000MHz; Limit -36 dBm,

5M

N.A

QPSK/16QAM

8

17

1 GHz≤f<12.75GHz; Limit -30 dBm,

5M

N.A

QPSK/16QAM

25

0measurement BW 1Mhz

Minimum

20M

QPSK

Sensitivity

SIMO

100RB

QPSK

100

0

<-93.3 dBm/20MHz

20M

QPSK

SISO

100RB

QPSK

100

0

<-90.3 dBm/20MHz

10M

QPSK

SIMO

50RB

QPSK

50

0

<-96.3 dBm/10MHz

10M

QPSK

SISO

50RB

QPSK

50

0

<-93.3 dBm/10MHz

5M

QPSK

QPSK

25

0

<-99.3 dBm/5MHz

SIMO

25RB

5M

QPSK

SISO

25RB

QPSK

25

0

<- 96.3 dBm/5MHz

20M

64QAM

SIMO

MCS26

QPSK

18

0

10M

64QAM

SIMO

MCS26

QPSK

12

0

5M

64QAM

SIMO

MCS26

QPSK

8

8

Level

Maximum
input Level

150 kHz≤f<30MHz; Limit -36 dBm,
measurement BW 10khz
measurement BW 100khz

dBm/20MHz>- 25.7

dBm/10MHz

dBm/5MHz

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1.5. System block
This module is composed of MDM9215, Memory, RF frontend, WTR1605L, PM8018 andinterface connector. MDM9215 chipset supports high performance data applications over awide range air interface standards including HSPA, WCDMA, and Category 3 LTE.
And the supported RF operating bands are defined by the chipset’s WTR1605L.
The built-in memory capacity is NAND 2Gbit and SDRAM 1Gbit. The PM8018 device
integrates all wireless data card power-management, general-housekeeping, and userinterface support functions into a single IC. The interface connector

supports functions of

UART, USIM, GPIO’S and USB.

(Fig. 3) System block diagram

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Rev.1.22. Interface Connector
2.1. Pin assignment
1

Config_3

2

+VPWR

3

GND

4

+VPWR

5

GND

6

Power_Key

7

USB_D+

8

Reserved(*1)

9USB_D-

10 Reserved(*1)

11 GND

12 Module key(*3)

13 Module key(*3)

14 Module key(*3)

15 Module key(*3)

16 Module key(*3)

17 Module key(*3)

18 Module key(*3)

19 Module key(*3)

20 RTS

21 Config_0

22 TXD

23 WAKE ON WWAN_N

24 RXD

25 Reserved(*1)

26 Reserved(*1)

27 GND

28 NC(*2)

29 NC(*2)

30 UIM_RESET

31 NC(*2)

32 UIM_CLK

33 GND

34 UIM_DATA

35 NC(*2)

36 UIM_PWR

37 NC(*2)

38 NC(*2)

39 GND40 Reserved(*1)

41 Reserved(*1)

42 GPIO_1

43 Reserved(*1)

44 GPIO_2

45 GND

46 GPIO_3

47 Reserved(*1)

48 CTS

49 Reserved(*1)

50 NC(*2)

51 GND52 Reserved(*1)

53 Reserved(*1)

54 Reserved(*1)

55 Reserved(*1)

56 Reserved(*1)

57 GND58 Reserved(*1)

59 Reserved(*1)

60 NC(*2)

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61 Reserved(*1)

62 NC(*2)

63 Reserved(*1)

64 NC(*2)

65 Reserved(*1)

66 Reserved(*1)

67 RESET_N

68 NC(*2)

69 Config_1

70 +VPWR

71 GND

72 +VPWR

73 GND

74 +VPWR

75 Config_2
NOTE(*1) :Reserved pins are connected with signals in the module.
Purpose of the pin refer to 3.9 Reserved
NOTE(*2) :NC Pins are opened in the module.
NOTE(*3) :Module Keying (U-shaped indentation) is required by PCIe M.2 specifications
to provide configurability as well as preventing incompatible module insertion.

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2.2. Pin description
Pin

Signal name

Pad

Pad

Type

Voltage

Functional Description

1

CONFIG_3--

Ground

2

+VPWR

PI

3.3V

3

GND

-

-

4

+VPWR

PI

3.3V

5

GND

-

-

6

POWER_KEY

AI

1.8V

7

USB_D+

B

8

Reserved-

9

USB_D-

B

10

Reserved

-

-

11

GND

-

-

12

Module key

-

-

-

13

Module key

-

-

-

14

Module key

-

-

-

15

Module key

-

-

-

16

Module key

-

-

-

17

Module key

-

-

-

18

Module key

-

-

-

19

Module key

-

-

-

20

RTS

IO

1.8V

21

CONFIG_0

-

-

22

TXD

DI

1.8V

UART transmit data output

23

WAKE_ON_WWAN_N

IO

1.8V

This pin is used to wake host, Active low

24

RXD

DO

1.8V

UART receive data input

25

Reserved

-

-

-

26

Reserved

-

-

-

27

GND

-

-

Ground

28

N/C

-

-

Not Connected

29

N/C

-

-

Not Connected

30

UIM_RESETDO

Main power supply input
GroundMain power supply input
GroundSystem Power On/Off, Active highUSB data (+)-

USB data (-)
GroundUART ready for receive signal
Not Connected

2.85V/1.8V UIM Reset

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31

N/C

Not Connected

32

UIM_CLK

DO

33

GND

-

34

UIM_DATA

B

35

N/C

-

36

UIM_PWR

DO

37

N/C

-

-

Not Connected

38

N/C

-

-

Not Connected

39

GND

-

-

Ground40

Reserved

-

-

-

41

Reserved

-

-

-

42

GPIO_1

IO

1.8V

43

Reserved--

44

GPIO_2

IO

1.8V

45

GND

-

-

46

GPIO_3

IO

1.8V

47

Reserved

-

-

48

CTS

DO

1.8V

49

Reserved

-

-

50

N/C

-

-

Not Connected

51

GND

-

-

Ground52

Reserved

-

-

-

53

Reserved

-

-

-

54

Reserved

-

-

-

55

Reserved

-

-

-

56

Reserved

-

-

-

57

GND

58

Reserved

-

-

-

59

Reserved

-

-

-

60

N/C

-

-

61

Reserved

-

-

62

N/C

-

-

63

Reserved

-

-

64

N/C

-

-

2.85V/1.8V UIM Clock-

Ground

2.85V/1.8V UIM Data-

Not Connected

2.85V/1.8V UIM Power

General Purpose Input Output Port
General Purpose Input Output Port
GroundGeneral Purpose Input Output Port
UART clear to send signal-

GroundNot Connected
Not Connected
Not Connected

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65

Reserved

-

-

-

66

Reserved

-

-

-

67

RESET_N

AI

1.8V

68

N/C

-

-

Not Connected

69

CONFIG_1--

Not Connected

70

+VPWR

PI

3.3V

71

GND

-

-

72

+VPWR

PI

3.3V

73

GND

-

-

74

+VPWR

PI

3.3V

75

CONFIG_2--

Hardware reset, Active low
Open drain design is recommended.

Main power supply input
GroundMain power supply input
GroundMain power supply input
Not Connected[Remark]
B : Bi-directional
AI : Analog Input into Module
AO : Analog Output from Module
DI : Digital Input into Module
DO : Digital Output from Module
PI : Power input into Module
PO: Power output from Module
IO: General Purpose Input Output Port

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3. Modem Interface Description
3.1. Power supply
Requirement of Input voltage is refer to the below table
SignalPin No.

Name

2, 4, 70, 72, 74

+VPWR

Typ

Max

Units

3.0

3.3

3.6

V

Ripple voltage

-

-

100

mVpp

-

-

0

-

V

Specification

Min

Voltage range

3, 5, 11, 27, 33,
39, 45, 51, 57, 71,

GND

73

3.2. USB
This module supports the USB 2.0 Specification.
It is used for diagnostic monitoring and data transfer.
Entering into suspend mode is available from the host or module
Pin No.

Signal Name

Signal Description

Direction

9

USB_D-USB differential data (-)

Bidirectional

7

USB_D+USB differential data (+)

Bidirectional

NOTE : Differential line(D+,D-) impendence should be designed closely to 90-ohm..

3.3. Power_key
To turn on, Power_Key pin must be held high at least for one second, and then amodule will start booting. In same procedure, to turn off, Power_Key pin must be heldhigh for at least 1 second, and then the power will switch off automatically.
Pin No.

Signal Name

Signal Description

Direction

6

POWER_KEY

Power On/Off , Active high

Input

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(Fig. 4) POWER_KEY circuit

3.4. RESET_N
This pin is for hardware reset of this module, which pin is recommended open-drain
design in host. RESET_N signal must be held low for at least 1s, and then released.
Pin No.

Signal Name

Signal Description

Direction

67

RESET_N

Reset input , Active low

Input(Fig. 5) RESET_N operation
Note 1 : This hardware reset must be designed to be controlled by the host.
In case of any communication problems, it is recommended that the hostshould perform reset in hardware and software manner.
Note 2 : Only in case software reset(AT command) can not solve the problem,
executes a hardware reset.
Note 3 : During hardware reset, I/O signals connected to module including UART signals
should be asserted to Low level or open state.
Otherwise, power leakage can cause an malfunction and the module can not be worked.

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(Fig.6) RESET_N circuit

3.5. USIMThis module supports USIM interface as the below table.
Pin No.

Signal Name

Signal Description

Direction

36

UIM_PWR

Power supply for SIM

Output32

UIM_CLK

Serial clock for SIM data

Output30

UIM_RESET

Active low SIM reset

Output34

UIM_DATA

Bi-directional SIM data line

Output/Input

TVS Diodes in host design are recommended as below diagram for ESD protection.

(Fig.7) USIM interface design for ESD protection
Note : ESD protection must be selected in consideration of the timing.

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3.6. UART
UART pins may support the AT command, may be used for data communication with the
host.
Pin No.

Signal Name

Signal Description

Direction

20

RTS

Request to send

HOST → AMP520

22

TXD

Transmit Data

HOST → AMP520

24

RXD

Receive Data

HOST ← AMP520

48

CTS

Clear to send

HOST ← AMP520

Note: If the module is off, a leakage is generated when voltage is supplied at pin. It should be carefulwhen you design.

3.7. GPIO
GPIO supports two modes and can be input, output
Pin No.

Signal Name

Signal Description

Pad Type

42

GPIO_1

General Purpose Input Output PortPD

44

GPIO_2

General Purpose Input Output PortPD

46

GPIO_3General Purpose Input Output PortPD

Note 1: Do not support default
Note 2: If the module is off, a leakage is generated when voltage is supplied at pin. It should be
careful when you design.

3.8. WAKE_ON_WWAN_N
This pin must be used to wake host by module
Pin No.

Signal Name

Signal Description (Host Side)

Direction

This pin is used to wake HOST, It
23

WAKE_ON_WWAN_N

will output a 1sec low pulse

output.Active low
Note: If the module is off, a leakage is generated when voltage is supplied at pin. It should be carefulwhen you design.

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3.9. Reserved
To use Reserved Pins, Customer must inform to AMTEL co.Ltd
Current purpose of Reserved pins is as the below table.
Pin No.

Signal Name

Signal Description

8

Reserved

WWAN disable function-

10

Reserved

LED status indicator-

25

Reserved

26

Reserved

GPS disable function-

40

Reserved

General Purpose Input Output Port-

41

Reserved

Power supply hold control for JTAG

Debug

43

Reserved

JTAG reset

Debug

47

Reserved

JTAG mode select input

Debug

49

Reserved

JTAG data input

Debug

52

Reserved

JTAG return clock

Debug

53

Reserved

JTAG clock input

Debug

54

Reserved

JTAG data output

Debug

55

Reserved

JTAG reset for debug

Debug

56

Reserved

Digital I/O supply voltage (1.8V)

58

Reserved

Watchdog timer disable input

59

Reserved

61

Reserved

63

Reserved

65

Reserved

66

Reserved

This signal is an input directly to the
AMP520 from a suitable SAR sensor.

Direction--

These signals are used for Antenna
Control
These signals are used for Antenna
Control
These signals are used for Antenna
Control
These signals are used for Antenna
Control
SIM card detect

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4. Current Consumption
The current consumption of the module is listed as below table.
The listed current consumption is tested at 3.3V power supply.

4.1. Standby current
Mode

RF modeCurrent

Typical

Unit

LTE

13.0

mA

WCDMA

11.5

mA

LTE

11.4

mA

WCDMA

10.9

mA

StandbyCondition
DRX=1.28s, GPS off(UART is not operation, USB is Suspend mode)
DRX=1.28s, GPS off(UART is not operation, USB is Suspend mode)
DRX=2.56s, GPS off(UART is not operation, USB is Suspend mode)
DRX=2.56s, GPS off(UART is not operation, USB is Suspend mode)

4.2. Operating current
Mode

Call
connected

RF modeCurrent
Typ.

Unit

LTE

670

mA

LTE

330

mA

WCDMA

580

mA

WCDMA

250

mA

Condition
BW:10MHz,D/L:50RB,U/L:12RB@23dBm

3.3V , 25℃ LTE B1
BW:10MHz,D/L:50RB,U/L:12RB@0dBm

3.3V, 25℃ LTE B1
12.2K RMC
@ 23dBm, 3.3V, 25℃, WCDMA B1
12.2K RMC
@ 0dBm, 3.3V, 25℃, WCDMA B1

Note : The maximum current is 810mA, but customer should check whether the voltage drop of+VPWR because the maximum current can be varied depending on the network environment andtemperature.

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4.3. In-rush current
Signal+VPWR

Current

State

Peak current

Max.

Unit

1.6

A

Condition

Power on state

Note : 10 times measured results after full discharging.

4.4. Leakage current
Signal

State

+VPWR

Leakage current

Current
Typical

Max

Unit

-

100

uA

Condition
Power off state

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5. Signal Timing
5.1. Power on sequence

SystemStabilization(Fig. 8) Module power on sequence
Parameter

Description

Min

Typ

Max

T_power_on

POWER_KEY signal tied high

1s

-

-

T_module_on

After reset, the boot timing

5s

-

8s

T_power_off

POWER_KEY signal tied high

1s

-

-

T_module_off

After Power-off sequence start, power-off time

-

0.5s

-

5.2. Reset sequence(Fig. 9) Module reset sequence
Parameter

Descriptiont_resetReset duration

t_module_on

After reset, the booting time

Min

Typ

Max

100ms

400ms

-

5s

-

8s

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6. Mechanical Design Guide
6.1. PCB layout guide(Fig. 10) Modem layout guide6.2. Insert nut & screw guide(Fig. 11) Insert nut guide

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(Fig. 12) screw guide

Note : This guide is based on PCIe M.2 connector(Kyocera part no. 24 6411 067 101 894B).
In case of using different kind of connector, customer should consider if the insert nut and screw
need to be changed.

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7. Module Assembly
When assembly or disassembly, please be careful any physical damage of modulea. Do not use sharp tools.
b. Be careful to mate the PCIe M.2 connector, and do not press
very hard the module.

(Fig. 13) Assembly guide

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8. Packaging
8.1. Product label dimension

Note : Label specification can be changed.

8.2. Packaging method

Note : Packaging specification can be changed.

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9. Cautions
9.1. Safety precautions
This module should be used at authorized places or environments due to frequency
jamming possibility while operating. If occur any issues when the module operates at
not authorized places or environments, AM Telecom does not have any responsibility.
① Do not use at life-saving places or areas such as hospitals or medical facilities. Also,
should be ‘power-off’ nearby medical appliances in order to prevent errors causedby radio frequency interference while operating medical appliances or life-support
system.
② Keep ‘Power-off’ at not authorized places in airport and airplane while taking off
and landing in flight. It might be brought a risk of accidence due to radio frequency
jamming.
The limitation is different per each air flight company. So, follow instructionsof each flight company.

③

Do not use at places of combustible storage and handling such as gas stations or
chemical manufacturing plants in order to prevent from explosion or fire.

9.2. Product handling precautions① Be careful not to excessive static applied.
The performance will be able decline if static with over ±2KV is applied.
② Do not give a shock or impact or dropping.
If give strong shock or impact or dropping, those will be reasons about damage or
breakdown or failure. Manufacture does not have responsibility if troubles are madeby users.
③ Do not modify or take apart or fix.

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If do above, risk will be happened such as product damage or breakdown or electric
shock or fire. Manufacture does not have responsibilities on those cases.
④ Do not give damages or removals to product label.
It will be very hard to identify the product, so that AS is not available.
⑤ Be careful to tighten screws not to give excessive forces.
⑥ Always use and store at room temperature.
⑦ Avoid water or humidity directly.
⑧ Use antistatic gloves while handling.
⑨ Try connecting after checking any foreign materials on Connector or Pad.
If any foreign material is on connector, contact failure can be happened. Please clean
the area, and then connect. Be careful not to give any damage.
⑩ Do not touch bottom side by hands while connecting.

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10. Acronyms
Word

Description

AXGP

Advanced extended Global Platform

BER

Bit Error Rate

BLER

Block Error Rate

BW

Band Width

CW

Continuous WaveformdB

DecibeldBm

Decibels above 1 mill wattDL

Down-link

DPCCH

Dedicated Physical Control CHannel

DRX

Discontinuous Reception

DTX

Discontinuous Transmission

EMI

Electromagnetic Interference

ESD

Electrostatic Discharge

F-DPCH

Fractional Dedicated Physical Channel

FDD

Frequency Division Duplex

GPIO

General Purpose Input Output

GPS

Global Positioning System

HSPA

High Speed Packet Access

LTE

Long Term Evolution

MCS

Modulation and Coding Scheme

MISO

Multiple Input Single Output

PPM

Parts Per Million

QAM

Quadrature Amplitude Modulation

QoS

Quality of Service

QPSK

Quadrature Phase Shift Keying

RAT

Radio Access Technology

RFRadio Frequency

Sensitivity

The minimum input signal to be specified value of the output power(or SNR/BER/BLER) in a wireless receiver.

SIMO

Single Input Multiple Output

TDD

Time Division Duplex

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ULUp-link

USB

Universal Serial Bus

USIM

Universal Subscriber Identity Module

VPWR

The source of power to the Modem

WCDMA

Wideband Code Division Multiple Access

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11. Contact Information
-

Korea

E-mailSales@amtel.co.kr

Telephone+82-31-788-9809 (9945)
AM Telecom Co., Ltd

Address.

#608, YatapLeaders bldg., 42, Jangmi-ro, Bundang-gu, Seongnam-si
Gyeonggi-do, 463-828, Korea

-

Japan

E-mailamjapan@amtel.co.jp

Telephone+81-3-6257-3834
AM Telecom Co., Ltd

Address.

18F, Shinkasumigaseki Bldg., 3-3-2, Kasumigaseki, Chiyoda-ku,
Tokyo, 100-0013

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