H263-S67-AAW1
High Density Server - 2U 4-Node DP 8-Bay NVMe/SATAKey Features• 2U 4-node rear access server system• Dual 5th/4th Gen Intel ® Xeon ® Scalable Processors per node
• 8-Channel DDR5 RDIMM, 64 x DIMMs• Dual ROM Architecture• 1 x CMC port
• 8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swappable bays
• 4 x M.2 slots with PCIe Gen4 x4 interface (optional)• 4 x LP PCIe Gen5 x16 slots• 4 x OCP 3.0 Gen5 x16 slots• Dual 3000W 80 PLUS Titanium redundant power supply

Application
High-Performance Computing, High Converged Server

Specification
Dimensions

2U 4-Node - Rear access (W438 x H87.5 x D840 mm)

Internal I/O

Motherboard

MS63-HD1

Backplane Board Speed & bandwidth: PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s

CPU

5th/4th Gen Intel® Xeon® Scalable Processors\
Dual processors per node, TDP up to 270W

Security
Modules

1 x TPM header with SPI interface per node- Optional TPM2.0 kit: CTM010

Power Supply

Dual 3000W 80 PLUS Titanium redundant power supply
AC Input: 100-240V
Available for 2+1 redundant PSU configuration (optional)*The system power supply requires C19 power cord.

SystemManagementASPEED® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X)

System Fans

4 x 80x80x80mm (16,500rpm)

OperatingProperties

Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

PackagingContent

1 x H263-S67-AAW1, 8 x CPU heatsinks,
24 x Carriers, 1 x 3-Section Rail kit

Part Numbers

Barebone package: 6NH263S67DR000ABW1*- 3-Section Rail kit: 25HB2-A66125-K0R- CPU heatsink: 25ST1-453207-C1R/25ST1-453208-C1R- Power supply: 25EP0-230009-L0S- C19 power cord 125V/15A (US): 25CP1-018000-Q0R (optional)- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R (optional)- M.2 riser card - CMTP061: 9CMTP061NR-00 (optional)- Riser card - CRSH310: 9CRSH310NR-00 (optional)- Ring topology kit: 6NH263S62S1000AAN11 (optional)- RMA packaging: 6NH263S67SR-RMA-A100 (optional)Supports TDP up to 350W with no support on OCP slot at ambient 35°C.
Supports TDP up to 350W at ambient 30°C.

Sock

2 x LGA 4677 per node (Socket E)

ChipsetIntel® C741 Chipset

MemoryTotal 64 x DIMM slots (16 x DIMM slots per node)
8-Channel DDR5 memory architecture
RDIMM up to 96GB supported; 3DS RDIMM up to 256GB supported
5th Gen Intel® Xeon®: Up to 5600 MT/s
4th Gen Intel® Xeon®: Up to 4800 MT/s

LAN

4 x 10/100/1000 Mbps Management LAN
1 x CMC port (Please refer to optional parts for ring topology support)

Video

ASPEED® AST2600 Integrated 2D Graphic Adapter
Management chip on CMC board: ASPEED® AST2520A2-GP

Storage

Total 8 x 2.5" Gen5 NVMe/SATA/SAS-4* hot-swappable bays
*SAS card is required for SAS devices supportRAIDIntel® SATA RAID 0/1/10/5

Expansion
Slots

4 x LP PCIe Gen5 x16 slots
4 x OCP 3.0 Gen5 x16 slots (supports NCSI function)
Optional 4 x LP PCIe Gen5 x16 slots (CRSH310)
Optional 4 x M.2 slots (CMTP060): M-key, PCIe Gen4 x4, 2280/22110

Rear I/O

Total: 8 x USB 3.2 Gen1, 4 x VGA, 4 x MLAN, 1 x CMC

Per node: 1 x TPM header, 1 x VROC connector

Learn more about GIGABYTE server at https://www.gigabyte.com/Enterprise

Designed by* All specifications are subject to change without notice. Please visit our website for the latest information.
* Intel, the Intel logo, Xeon, and other Intel marks are trademarks of Intel Corporation or its subsidiaries.
* All other brands, logos and names are property of their respective owners.
© 2024 Giga Computing Technology Co., Ltd. All rights reserved.

Giga Computing

GigaComputing

GIGABYTEServer

GIGABYTEChannel