EV GROUP® | Products

Solutions for R&D

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EV GROUP® | Products //Solutions for R&DIntroduction
As a technology and market leader in wafer processing solutions for semiconductor, MEMS
and nanotechnology applications, EVG supports partners and customers to make theirideas a reality.
EVG’s track record of innovations in the field of micro- and nano-fabrication technologies
is unique. We realize our vision of being the first in exploring new techniques and serving
next-generation applications of micro- and nano-fabrication technologies through intensive
R&D collaborations. On average, EVG participates in more than 10 European cooperative
R&D projects and cooperates on several joint development programs with R&D institutes
worldwide every year.
EV Group has been working with research facilities for more than 40 years, giving us insight
into their unique requirements. Our dedicated R&D tools provide superior technology
combined with maximum flexibility, enabling universities, research institutions andtechnology development partners to scale processes across multiple research projects andapplications.
What’s more, the R&D equipment integrates seamlessly with EVG’s core technology
platforms, which span the entire manufacturing chain from R&D all the way to small-scaleand high-volume production. Full software and recipe compatibility between R&D andfull-scale production systems enables researchers to migrate their processes to volumeproduction environments.

Multiple Use Systems for R&D or Pilot Line

Wafer Bonding
AnodicAdhesive
Metal
Thermo-compression

Hot Embossing (HE)Spin-on layers
Polymer substrates
Optical aligned HE
Mechanical aligned HE

Resist Processing
Spin coating
Spray coating
Aqueous or solvent-baseddeveloping

EVG®520

EVG®101

UV Nanoimprint
SmartNIL®
µ-contact printing
Hard UV-NILSoft UV-NIL

Mask Alignment
Optical lithography
First print
Top and bottom side alignment
SU8 mastering

EVG®620x

Bond Alignment
Top and bottom sidealignment

Resist Processing
EVG®101■■■■

Automated spin or spray coating or developing with manual wafer load/unload
Easy process transfer from research to production utilizing modular design
Syringe dispense system for utilization of small resist volumes, including highviscosity resists

Patternd, spray coated resist layer
in anisotropically etched cavity
Courtesy of TU-Delft DIMES

Small footprint while maintaining a high level of personal and process safety

Lithography
EVG®620 NT / EVG®6200 NT■■■■■■Top side alignment accuracy up to ± 0.5 µm / 3σ (± 0.1 µm in R&D)
Bottom side alignment accuracy up to ± 1.0 µm / 3σ
Substrate size from pieces to 150 mm (100 mm to 200 mm in EVG®6200 NT)
80 µm SU-8 resist features withsidewall angles approaching 90°
Courtesy of DALSA Corporation

Optional bond alignment
Thin or warped wafer handling
Manual R&D systems and volume production types and are available

Nanoimprint Lithography (NIL) & Hot Embossing (HE)
EVG®620 NT / EVG®720 / EVG®500 Bonder series with hot embossing and de-embossing tooling■■■■

Nanoimprint lithography enables simple replication of various kindof structures, shapes and sizes - nanoscale structures can be achieved
without sophisticated and expensive optics
EVG®620 NT covers all common imprinting techniques, including proprietary
SmartNIL® technology

L/S grating with optimized residual
layer with approximately 10 nm
thickness
Source: EVG

EVG®720 is the dedicated SmartNIL® system for advanced processdevelopment and pre-commercial upscaling
EVG®500 can provide for simultaneous replication of micro- and nanostructures,
imprinting into bulk polymer materials or glass andsuitable for spin-on thermoplastics

Bonding
EVG®501 / EVG®510 / EVG®520 IS Bonders for R&D
Wafer Bonding

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■
■

AnodicAdhesive
Eutectic
Transient liquid phase
Thermo-compression

Features

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Substrates up to 200 mm
Forces up to 100 kN
Temperatures up to 550°C
Vacuum down to 1·10 mbar
-6

Other options: anodic, UV curing, 650°C heaters

Hybrid Bonding of a daisy
chain with 4,4 µm pads*©STMicroelectronics
Used with permission.

* S. Lhostis et al., “Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors”, 2016 IEEE 66th Electronic Components and Technology Conference

Process Services
Wafer processing services on any EVG equipment, including special processes such as■
■
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■
■
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Plasma activated direct bonding
ComBond® - conductive bonding of Si and compound semiconductors
High-vacuum aligned bonding
Temporary bonding and thermal, mechanical or laser debonding
Hybrid bonding
Adhesive bonding
Collective D2W bonding

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Permanent wafer bonding■

Resist Processing

Lithography
UV-NIL on large substratesLens molding
Master stamp and working stamp fabrication forSmartNIL®

Benefits
Multiple Equipment Functionalities / Multi-Purpose Equipment
EVG®610, EVG®620 NT,EVG®6200 NT■ Lithography■ Nanoimprinting■ Bond alignment

EVG®510, EVG®520
Bonding
Hot embossing

EVG®101■ Spin coating■ Spray coating■■Multiple Process Capabilities
Nanoimprint Lithography(NIL)■ SmartNIL®
■ Hard UV-NIL■ Soft UV-NIL■ Micro contact printing■ Lens molding

Bonding
Metal (transient liquidphase, eutectic,
thermo-compression)■ Glass frit
■ Anodic■ Adhesive■ Temporary adhesive■Coating■ Spin coating■ OmniSpray®
■ Conformal coatings oftopography■ Uniform thick resist
coatings forhigh topography■ Adhesive coating forbonding

Process Services

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■

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Access to industrial equipment andprocesses
Customer tailored evaluation programs ■Very small batches possible

High success rate for sample
processing
Access to EVG’s service providers

R&D Cooperation

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■

Application and market expertise
Industrial partner network
Consulting and proof of concepts
Upscaling processes■■

Implementation of engineering
concepts and solutions in equipment
and toolingIndustrial qualification of processes
and equipment

Software and Support
The Windows-based, graphical user interface is designed with a strong focus on userfriendliness, and easily navigates the operator through each process step. Multi-language
support, individual user account settings and integrated error logging / reporting andrecovery can simplify the user’s daily operation. All EVG systems can also communicateremotely. Thus, our service includes field-proven, real-time remote diagnostics andtroubleshooting via secured connection, phone or email. EVG’s experienced processengineers are readyEVG
to support Process
you anytime thanks toour de-centralized worldwide support
Expertisestructure, including cleanroom space on three different continents:
Europe (HQ), Asia (Japan) andNorth America (USA).
...etc.
CVD,
LPCVD,
PVD,...

ResistCoating
Spin/Spray

Wafer &Template
Fabrication
Substrate
Cleaning
Substrate
Bondingfor SOI

Maskless
Exposure

RIE,
DRIE
Nanoimprint
Lithography

ResistDeveloping

Metallization

Wafer
DicingThinning,
CMP

Wafer
Bonding
Metrology

ResistLift-Off

PlasmaActivation

EVG Processes

Electroplating
Wet
Etching

Proximity
Lithography
Alignment
Verification

Bond
Alignment

Temporary
Bonding/Debonding

StressReliefEtching

Chip-toWafer
BondingOxidation
Wafer
Bumping &Redistribution

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EV GROUP® | Products //Solutions for R&D

Emerging Technologies - Shaping the Future
Being the first in exploring new techniques and serving next-generation applications of micro- and nano-fabrication technologies
enables our customers to successfully commercialize their new product ideas.
Nanotechnology for Various Applications
EVG process technologies like nanoimprinting, hot embossing, micro-contact printing as well as adhesive bonding enable theproduction of device structures with feature sizes from 100 µm to 10 nm. Application areas are bio- and medical devices, sensors,
MEMS and photonic structures.

20 µm

Honeycomb texturing of Multicrystalline Silicon (mc-Si)
Courtesy of Fraunhofer ISE

5 µm

Photonic crystals for light extraction of LEDs

12.5 nm dots

Bonding «Anything on Anything» EVG® ComBond®
The EVG ComBond platform combines several technology breakthroughs to enable the formation of bond interfaces between
heterogeneous materials at room temperature while achieving excellent bonding strength and electrical conductivity. The novel
oxide-free bonding technique is particularly beneficial for silicon photonics, high-vacuum MEMS packaging, and compound
semiconductor and other advanced engineered substrates for “beyond CMOS” applications such as high-mobility transistors, highperformance/low-power logic and radio frequency (RF) devices. The ComBond masters the crucial surface preparation steps thatare needed to ensure contamination- and oxide-free bonds at room temperature.
SiC

5 nm

Wafer-bonded III-V / Si multi-junction solar cell with 33.3
percent record efficiency
Courtesy of Fraunhofer ISE/A. Wekkeli

SiC

SiC - SiC Bond Interface

Ge5 nmSi

Ge - Si Bond Interface

Topography CoatingEVG has developed spray-coating technologies and equipment for topography coating, which is an essential process in 3D
integration and wafer-level packaging applications. Examples are conformal coating of high aspect ratio structures like TSVs,
conformal via lining for dicing streets and MEMS-cavity coatings.

100 nmHigh depth of focus exposure on EVG®620 NTof KOH etched cavities with a depth of 150 µm
Source: EVG

20 µm

20 µm

Coating of 100 µm deep cavities with 350 x 350 µm opening

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Headquarters
EV Group Europe & Asia/Pacific GmbHDI Erich Thallner Strasse 14782 St. Florian am Inn
Austria+43 7712 5311 0
Sales@EVGroup.com
TechSupportEurope@EVGroup.com

EVG Subsidiaries
North America
EV Group Inc.
+1 480 305 2400
SalesNorthAmerica@EVGroup.com
TechSupportNorthAmerica@EVGroup.com

China
EV Group China Ltd.
+86 21 3899 4888
Sales@EVGroup.cn
TechSupportChina@EVGroup.com

Japan
EV Group Japan KK+81 45 348 0665
Sales@EVGroup.jp
TechSupportJapan@EVGroup.com

TaiwanEVG-JOINTECH CORP.
+886 3 516 3389
Sales@EVG-Jointech.com.tw
TechSupportTaiwan@EVGroup.com

Korea
EV Group Korea Ltd.
+82 2 3218 4400
Sales@EVGroup.co.krTechSupportKorea@EVGroup.com

Get in touch:Contact@EVGroup.com

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The information contained in this document is provided “as is” and without warranty of any kind, express or implied. Any express or implied warranties including, but not limited to, any implied warranty ofmerchantability, fitness for a particular purpose, and patent infringement or other violation of any intellectual property rights are hereby expressly disclaimed.
EVG makes no representation that the use or implementation of the information contained in this document will not infringe or violate any copyright, patent, trademark, trade secret or other right.
In no event shall EVG be liable for any claim, damages or other liability, including any general, special, indirect, incidental, or consequential damages, whether in an action of contract, tort infringement,
misappropriation or otherwise, arising from, out of or relating to the use or inability to use the information.
Acceptance and/or any use of the information contained in this document shall be deemed consent to, and acceptance of, this disclaimer.
Data, design and specifications may not simultaneously apply; or may depend on individual equipment configuration, process conditions and materials and vary accordingly. EVG reserves the right to change data,
design and specifications without prior notice.
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