EV GROUP® | Products//

Metrology

Solutions for Metrology

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EV GROUP® | Products//Metrology//

Solutions for Metrology

EVG Metrology Benefits
Adaptiveness

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Multi-sensor measurement mount for highest metrology flexibility
Sensor set available for multiple measurement ranges and materials
Self-calibration of measurement units for minimal service and maintenanceStand-alone tool or integrated in production systems

Handling■■■

Handling and metrology of various substrate materials, shapes, stress, bow or warp
Bridge capability for different substrate sizes and carrier-mounted wafers
Available with multiple load port options and combinations

Control■■■

Feedback loop for correction of process parameters
Customized pass/fail criteria for automated processing decisions
Fully integrated SECS/GEM interface

EVG Metrology Capabilities
EVG®20

AVM

Front-to-back alignment(BSA)

EVG®40NT

EVG®40NT2x

Top side alignment (TSA)
Overlay or box-in-boxxx

Critical dimension (CD)xx

Alignment to bond interface(via IR inspection)xxx

Bond alignment withvisible lightxxx

Bond alignment withtransmitted IRxxx

Bond alignment withreflected IRxxx

Thickness and TTVof IR transparent layerxx

Thickness and TTVof stacks
Thickness of air gaps
(e.g., void detection)xx

Topographyxxxx

Bow and warp
Bond strength measurement
Die-to-wafer and die-to-diealignment verificationxx
xx

Edge bead removal andedge trim measurement
Stacked Die alignment
verification

EVG®50xx

EVG®20 IR Inspection System (stand-alone tool)
Infrared Inspection Station (integrated module)

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Full wafer IR inspection module combining yield, bond wave dynamics andbond strength measurement
One-shot inspection of the entire wafer
Fully automated bond strength measurement (Maszara test)
Optional bond pin for live visualization of bond wave propagation
Void size detection down to 500 µm radius

EVG®40 NT Automated Measurement System Series(fully automated stand-alone tool)
Alignment Verification Module (AVM) (HVM-integrated module)■■■

Metrology tools with high measurement accuracy in lateral and verticalresolution
Versatile measurement options for lithography and bonding metrology- Alignment verification for bonding and lithography applications- Critical dimension (CD) measurement- Die-to-Wafer and Die-to-Die alignment verification- Multi-layer thickness measurement
High throughput

AVM: Integrated Alignment Verification for quick process parameter optimization
feedback for fusion and hybrid bonding.
EVG®40 NT: Alignment and CD measurements for Lithography and Bonding wherealignment down to 100 nm can verified.
An optimized version for wafer-level-optics manufacturing is available.
EVG®40 NT2: Alignment measurement especially for die to die; die to wafer andwafer to wafer bonding all with enhanced throughput. Metrology and integrated
feedback capability for die-to-wafer placement accuracy for collective die-to-wafer
as well as direct placement die-to-wafer bonding. Industry leading IR metrology for
wafer-to-wafer bonding down to 20 nm alignment.

EVG®50 Automated Metrology System(fully automated stand-alone tool)
Inline Metrology Module (IMM) (HVM-integrated module)■■■

Highly accurate measurements at high speed■

Low-contact edge handling- Particle free- Full-area accessible front and back side■■■■

Utilizing different measurement methods for a large number of applications
Industry-leading throughput and resolution multi-layer metrology- Multi-layer thickness mapping- Bond interface inspection

Self-calibrating for better system reproducibility and more productive time
Various output formats
100% production inspection for film thickness and thickness variation
Meets the most demanding requirements of the yield-driven semiconductor
industryEVG Metrology Solutions
EVG’s metrology solutions can be integrated in two ways
in order to improve production yield:■■

Stand-alone metrology
systems with automatedpass/fail criteria based on
customer specifications andhost-controlled feedback
loop to all relevant upstream
process steps

EVG®20

EVG®40 NT

EVG®50

Void Detection &Bond Strength

Overlay, Thickness,
Critical Dimension &Die-to-Die

Thickness, TTV,
Topography &Void Detection

IRInspection
StationAlignment
Verification
Module(AVM)

InlineMetrology
Module(IMM)Stand-Alone

Integrated metrology infully automated production
systems for direct feedback
and immediate correction ofprocess parameters

Integrated

Process Control
Direct feedback loop forbond parameter correction - AVM

Feedback loop for temporary bonding
before non-reworkable thinning – IMM

Wafer to Wafer
Alignment
TemporaryBonding

AlignedWafer Bonding

PASS

Thinning

FAIL

ReworkMetrology(Interlayer TTV)

Overlay Alignment
Verification
Calculation of Alignment
Correction Factors

Automated Processwith Customized Criteria

Software and Support
The Windows-based, graphical user interface is designed with a strong focus on userfriendliness, and easily navigates the operator through each process step. Multi-language
support, individual user account settings and integrated error logging / reporting andrecovery can simplify the user’s daily operation. All EVG systems can also communicate
remotely. Thus, our service includes field-proven, real-time remote diagnostics andtroubleshooting via secured connection, phone or email. EVG’s experienced processengineers are readyEVG
to support Process
you anytime thanks toour de-centralized worldwide support
Expertisestructure, including cleanroom space on three different continents:
Europe (HQ), Asia (Japan) andNorth America (USA).
...etc.
CVD,
LPCVD,
PVD,...

ResistCoating
Spin/Spray

Wafer &Template
Fabrication
Substrate
Cleaning
Substrate
Bondingfor SOI

Maskless
Exposure

RIE,
DRIE
Nanoimprint
Lithography

ResistDeveloping

Metallization

Wafer
DicingThinning,
CMP

Wafer
Bonding
Metrology

ResistLift-Off

PlasmaActivation

EVG Processes

Electroplating
Wet
Etching

Proximity
LithographyAlignment
Verification

BondAlignment

Temporary
Bonding/Debonding

StressReliefEtching

Chip-toWafer
Bonding

Oxidation
Wafer
Bumping &Redistribution

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EV GROUP® | Products//Metrology//Solutions for Metrology

EVG®20 - Key Features
Bonded Wafers w/ IR transparent interlayer■

Transparent layer measurements:- Voids and dimples in bond interface

Fusion Bonded Wafers■■■

Voids and dimples in bond interface
Bond strength measurement
Live bond wave inspection

EVG®40 NT Series / AVM - Key Features
Bonded Wafers w/ IR transparent interlayer■■

Bond alignment verificationIntermediate layer measurements:- Thickness and TTV- Voids and dimples in bond interface

Top Side Patterned Wafer

Fusion Bonded Wafers

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Bond alignment verification
Thickness
TTV
Voids and dimples in bond interface

Top and Bottom Side Patterned Wafer■■

CD measurement■■

Thickness measurement

Top side alignment verification:- Overlay / Box in box■■■

Top-to-bottom alignment verification
Critical dimension (CD) measurement
Die-to-die alignment verification

Die-to-die alignment verification

Wafer with dies / stacked dies■■■

Die to die alignment
Die to wafer alignment
Die mapping / Die shift mapping

EVG®50 / IMM - Key Features
Bonded Wafers w/ IR transparent interlayer■■

Total stack measurements:- Thickness / TTV / Bow and warp
- Voids and dimples in bond interface
Bond adhesive measurements:- Thickness / TTVCoated Wafer■■■

Fusion Bonded Wafers■■

Total stack measurements:- Thickness- TTV- Bow and warp
Voids and dimples in bond interface

Single wafer

Coating thickness measurement
TTV measurement of coated layer
Edge bead removal and edge trim measurement(Coating: lithography resist, temporary bonding adhesive, etc.)■■

Thickness measurement■

Bow and warp measurement

Total thickness variation (TTV)
measurement

Application Examples

Void detection – EVG®20

Overlay measurement – EVG®40 NT

Post Bond adhesive interlayer
TTV measurement – EVG®50

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EVG Subsidiaries
North America
EV Group Inc.
+1 480 305 2400
SalesNorthAmerica@EVGroup.com
TechSupportNorthAmerica@EVGroup.com

China
EV Group China Ltd.
+86 21 3899 4888
Sales@EVGroup.cn
TechSupportChina@EVGroup.com

Japan
EV Group Japan KK+81 45 348 0665
Sales@EVGroup.jp
TechSupportJapan@EVGroup.com

TaiwanEVG-JOINTECH CORP.
+886 3 516 3389
Sales@EVG-Jointech.com.tw
TechSupportTaiwan@EVGroup.com

Korea
EV Group Korea Ltd.
+82 2 3218 4400
Sales@EVGroup.co.kr
TechSupportKorea@EVGroup.com

Get in touch:Contact@EVGroup.com

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EVG makes no representation that the use or implementation of the information contained in this document will not infringe or violate any copyright, patent, trademark, trade secret or other right.
In no event shall EVG be liable for any claim, damages or other liability, including any general, special, indirect, incidental, or consequential damages, whether in an action of contract, tort infringement,
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Acceptance and/or any use of the information contained in this document shall be deemed consent to, and acceptance of, this disclaimer.
Data, design and specifications may not simultaneously apply; or may depend on individual equipment configuration, process conditions and materials and vary accordingly. EVG reserves the right to change data,
design and specifications without prior notice.
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