EPO-TEK® EK1000
Technical Data Sheet
For Reference OnlyHigh Conductivity Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:
Shelf Life- Syringe:

July 2019
IXSingle
N/A
3.34
2 Weeks
Dry Time: ≤ 1 Day
One year at -40°C
Six months at -40°C

Recommended Cure:
150°C / 1 Hour plus 200°C / 1 Hour (post cure)
Minimum Alternative Cure(s):May not achieve performance properties listed below
200°C / 30 Minutes

NOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.

Product Description: EPO-TEK® EK1000 is a silver-filled adhesive that exhibits exceptional thermal and electrical conductivity alongwith a shiny silver appearance designed for the demanding requirements of high power LED die attach applications. It is the single
component version of EPO-TEK® EK2000.
Typical Properties: Cure condition: Varies as required
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):
Silver* Consistency:
Smooth thixotropic paste* Viscosity (23°C) @ 100 rpm:
1,800 - 3,600 cPs
Thixotropic Index:
3.6* Glass Transition Temp:≥ 80 °C (Dynamic Cure: 20-300°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)
Coefficient of Thermal Expansion (CTE):
Below Tg:
38 x 10-6 in/in°C
Above Tg:
94 x 10-6 in/in°C
Shore D Hardness:
66
Lap Shear @ 23°C:
1,010 psi
Die Shear @ 23°C (Initial):≥ 10 Kg
3,556 psi
Die Shear @ 23°C (after 1000 hrs 85°C/85% RH):
≥ 5 Kg
1,778 psi
Degradation Temp:
357 °C
Weight Loss:@ 200°C:
0.19 %@ 250°C:
0.94 %@ 300°C:
1.70 %
Suggested Operating Temperature:< 300 °C (Intermittent)
Storage Modulus:
273,528 psi
Ion Content:Cl-:≤ 10 ppm Na+:
2 ppm
NH4+:
6 ppm K+:
0 ppm
* Particle Size:≤ 45 microns
ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity (150°C/1 Hour):Thermal Conductivity (150°C/1 Hour + 200°C/1 Hour):Thermal Conductivity (125°C/2.5 Hours+150°C/36 Min+ 200°C/15 Min):* Volume Resistivity @ 23°C:
Dielectric Constant (1KHz):
Dissipation Factor (1KHz):

12.626.335.5≤ 0.00009
N/A
N/A

W/mK
W/mK
W/mKOhm-cmEpoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® EK1000
Technical Data Sheet
For Reference OnlyHigh Conductivity Epoxy

EPO-TEK® EK1000 Advantages & Suggested Application Notes:● Low viscosity and high thixotropy make it ideal for a wide range of application techniques
including syringe dispensing● Extreme thermal management in high power and high brightness LED die attach.
● Resistant to thermal cycling and impact resistance in high power microwave
communications die attach.
● Available in a Mil-STD-883 Test Method 5011 version: EPO-TEK® EK1000-MP.
● Concentrated PV solar cells (CPV):o Die attach of triple junction, III-V semiconductor chips, offering the lowest thermalresistance.
o Favorable performance with respect to solder devices.
o Replacing vacuum preform solder manufacturing with low temperature/low stresswith a proven low temperature/low stress, high volume dispensing process.
● Alternative step cures can result in improved thermal management. Contact
techserv@epotek.com for selecting the best multi-step curing process.

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com