EPO-TEK® H37-MP
Technical Data Sheet
For Reference Only
Electrically Conductive, Silver Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:

Recommended Cure: 150°C / 1 Hour

September 2017
VIIISingle
N/A
3.07
28 Days
One year at -40°C

NOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.
● Complies with the requirements of MIL-STD 883/Method 5011.

Product Description: EPO-TEK® H37-MP is a single component, electrically conductive, thixotropic silver-filled adhesive for die-attachand SMD attach inside hybrid microelectronic packages. Also available in a frozen syringe.
Typical Properties: Cure condition: 150°C / 1 Hour
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 10 rpm:
Thixotropic Index:* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
Below Tg:
Above Tg:
Shore D Hardness:
Lap Shear @ 23°C:* Die Shear @ 23°C:
Degradation Temp:
Weight Loss:* @ 200°C:@ 250°C:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:* Ion Content:

Silver
Smooth flowing paste
22,000-26,000 cPs
3.6≥ 90 °C (Dynamic Cure: 20-300°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)
52
14880
1,880
≥ 10358

Cl-:
NH4+:

* Particle Size:
ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:* Volume Resistivity @ 23°C:
Dielectric Constant (1KHz):
Dissipation Factor (1KHz):

0.13
0.41
0.80
< 300727,680< 200 ppm
65 ppm≤ 201.6≤ 0.0005
N/A
N/A

x 10-6 in/in°C
x 10-6 in/in°C
psiKg°C

3,556 psi%%%°C (Intermittent)psiNa+:< 50 ppm
K+:< 50 ppm
microns
W/mK
Ohm-cmEpoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® H37-MP
Technical Data Sheet
For Reference Only
Electrically Conductive, Silver Epoxy

EPO-TEK® H37-MP Advantages & Suggested Application Notes:● Complies with MIL-STD 883/Test Method 5011.
● Can be considered a lower stress, and lower cure temperature alternative to EPO-TEK®
H35-175MP.
● Compliant material; eliminates cracking when bonding large components or substrates.
● Excellent adhesion to ceramic, Si, Au, kovar, Au/kovar and AgPd.
● May also be used on lead-frames and die-paddles compatible with JEDEC plastic ICpackaging.
● Adaptable to conventional processing methods such as automatic dispensing or screen
printing.
● Passes NASA low outgassing standard ASTM E595 with proper cure http://outgassing.nasa.gov/.

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com