EPO-TEK® H20E-PFC
Technical Data Sheet
For Reference Only
Electrically Conductive, Silver Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:

November 2019
XITwo
1:1
Part A: 2.88
Part B: 3.31
3 Days
One year at room temperature

Recommended Cure: 150°C / 1 Hour
Minimum Alternative Cure(s):May not achieve performance properties listed below
175°C / 45 Seconds
150°C / 5 Minutes
120°C / 15 Minutes
80°C / 3 HoursNOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.

Product Description: EPO-TEK® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects
using a solder-free joining method.
Typical Properties: Cure condition: 150°C / 1 Hour
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 100 rpm:
Thixotropic Index:* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
Below Tg:Above Tg:
Shore D Hardness:
Lap Shear @ 23°C:
Die Shear @ 23°C:
Degradation Temp:
Weight Loss:@ 200°C:@ 250°C:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:
Ion Content:

Part A: Silver
Part B: Silver
Smooth thixotropic paste
3,000 - 4,000 cPs
6.7≥ 80 °C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)
48
10650
850
≥5407

x 10-6 in/in°C
x 10-6 in/in°Cpsi
Kg°C

1,778 psi

* Particle Size:

0.46
1.02
1.78
< 325921,254
199 ppm
349 ppm≤ 20%%%°C (Intermittent)
psiNa+:
12 ppmK+:
12 ppmmicrons

ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:* Volume Resistivity @ 23°C:

3.2≤ 0.0004

W/mKOhm-cm

Cl-:
NH4+:

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782www.epotek.com

EPO-TEK® H20E-PFC
Technical Data Sheet
For Reference Only
Electrically Conductive, Silver Epoxy

EPO-TEK® H20E-PFC Advantages & Suggested Application Notes:● Stencil printing of small dots or “bumps” the size of 4 mil diameter with 8 mil pitch can beachieved.
● Product may be applied at the wafer level or single-chip bumping of prototypes.
● Final system packaging can be hermetic micro-electronic cases or open-faced circuits
using potting resin or housing.
● Low temperature cure capable between 70°C – 100°C allows for lower cost plastic
substrates / housings to be used.
● Suggested for flip chip packaging applications found in memory devices (SRAM, DRAM),
watch modules, RFID tags, smart-cards, military, and medical devices.
● Passes NASA low outgassing standard ASTM E595 with proper cure http://outgassing.nasa.gov/● Compatible with Au, Cu, Ag, Ag-Pd component or substrate metallization.
● Recommended to be used with chips or wafers which have UBM layer already deposited.
● Compatible with automated dispensing equipment.

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com