EPO-TEK® EK2000
Technical Data Sheet
For Reference OnlyHigh Conductivity Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:

Recommended Cure: 150°C/1 Hour + 200°C/1 Hour (post-cure)
November 2019
VIII
TwoMinimum Alternative Cure(s):May not achieve performance properties listed below
1:1
Part A: 3.82
Part B: 3.88
200°C / 30 Minutes
2 Weeks
Dry Time: < 1 Day
One year refrigerated upon arrival

NOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.
● Thermal post-cure beneficial – contact techserv@epotek.com for recommendations.

Product Description: EPO-TEK® EK2000 is a two component, silver-filled adhesive that exhibits exceptional thermal and electricalconductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach
applications. Other benefits include low viscosity and high thixotropy making it suitable for a wide range of application techniques. It isa two component version of EPO-TEK® EK1000.
Typical Properties: Cure condition: Varies as required
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 100 rpm:
Thixotropic Index:* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
Below Tg:
Above Tg:
Shore D Hardness:
Lap Shear @ 23°C:
Die Shear @ 23°C:
Degradation Temp:
Weight Loss:@ 200°C:@ 250°C:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:
Ion Content:* Particle Size:

Part A: SilverPart B: Silver
Smooth thixotropic paste
1,800 - 3,600 cPs
3.6≥ 80 °C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)
38
94
66
1,010
≥ 10357

Cl-:
NH4+:

0.19
0.94
1.70
< 300
273,528< 10 ppm
6 ppm
≤ 45

x 10-6 in/in°C
x 10-6 in/in°C
psi
Kg
°C

3,556 psi%%%
°C (Intermittent)
psi
Na+:
2 ppm
K+:
0 ppm
microns

ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity (150°C / 1 Hour):Thermal Conductivity (150°C / 1 Hour + 200°C / 1 Hour):Thermal Conductivity (125°C / 2 Hours + 150°C / 36 Minutes + 200°C / 15 Minutes):* Volume Resistivity @ 23°C:

12.6
26.3
35.5
≤ 0.00009

W/mK
W/mK
W/mK
Ohm-cmEpoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® EK2000
Technical Data Sheet
For Reference OnlyHigh Conductivity Epoxy

EPO-TEK® EK2000 Advantages & Suggested Application Notes:● Low viscosity and high thixotropy make it ideal for dispensing● Two components for convenient shipping but also available as a single component version(EPO-TEK® EK1000) and Mil-STD 883 Test Method 5011 version (EPO-TEK® EK1000MP)● Extreme thermal management in high brightness LEDs and high power communication die
attach such as MMICS and GaN● Concentrated photo voltaic solar cells (CPV)○ Die attach in triple junction III-V semiconductor chips, offering extremely low thermal
resistance○ Favorable performance when compared to solder○ Replacing vacuum preform solder manufacturing with lower temp/low stress high volume
dispensing process● Alternative step cures can result in improved thermal management

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com