report

Report Title:

ADLK 0.6um 6inch to 8inch transfer

Report Number: 6396
Date:

29 June 2008

Analog Devices Reliability . Gateway Business Park, Special Economic Park,
Javelera, Gen. Trias . Cavite, Philippines
Tel: 632.867.7030
Fax: 632.867.7200
www.analog.com

Reliability Report: 6396

SummaryThis report documents the successful completion of the engineering evaluation on the YG06
AD5398 product in a 8-LFCSP package, the YH14 which is sold as bare die, the X402 , theADP1653 in a 16l LFCSP, the ADP3207 in a 40L LFCSP, the ADP1823 in a 32L LFCSP, theADD8754 in a 24L LFCSP, ADP3207A in a 40L LFCSP, the ADP3208 product in a 48-LFCSP,
the ADP3209 product in a 32-LFCSP and the AD5821 which is also sold in bare die.
Other generics to be covered by this qualification report are the: ADE7754, AD7843, AD7477,
AD7476, AD7418, AD7417, AD7416, AD5300, ADG758, AD5206, AD7303, ADW50009,
AD11/2045, AD7730L, AD9832, AD9835, AD5306, AD5316, AD5326, AD5307, AD5317,
AD5327, AD8509, AD8511, AD5241-10, AD5241-100, AD5241-1, AD5242-10, AD5242-100,
AD5242-1, AD7302, AD7801, AD73360, AD7730, AD7731, AD5302, AD7418 CHIPS,
AD5312, AD5322, AD5313, AD5323, AD5308, AD5328, AD5318, AD7904, AD7914,
AD7923, AD7918, AD7924, AD7928, AD7927, AD8607, AD8603, MCPCHIPS, AD7908,
ADG714, ADG725, ADG731, ADG732, ADG726, AD7478, AD5160, AD5161, AD5245,
ADP3041, AD9851, AD7911/12/21/22, AD8604, AD5162-2.5, AD5162-100, AD5162-10,
AD5172/AD5243-10, AD5162-50, AD5172/AD5243-100, AD5172/AD5243-50,
AD5172/AD5243-2.5, AD5248-10, AD5170-10, AD5248-2.5, AD5248-100, AD7873, AD7656,
AD5170-2.5, AD7922, AD5173-2.5, AD5173-50, AD5173-10, AD5173-100, AD5248-50,
AD7829, AD5170-50, AD7822, AD7825, AD7829-1, AD5170-100, AD5301, AD5311,
AD5321, ADM1175/6/7/8/91/92 AD7873, AD7545A MIL, AD7545ACHIPS, AD7545A,
AD7545, PM7545, AD5333, AD5332, AD5331, AD5330, AD5343, AD5341, AD5335,
AD5344, AD5342, AD5336, AD5334, AD5340, ADG787, DAC8412, AD8602, AD8511,
AD8509, AD7303, AD5626, ADG706, AD7740, DAC8413, AD5227-10, AD5227-100,
ADG819, AD5725, AD5228-10, AD5228-100, AD5228-50, AD5725-1, AD7490, AD7888,
AD7888CHIPS, AD5227-50, AD5373, DAC8412, AD5725-1, AD5725, AD5371, AD5370,
AD5372, AD5361, AD5362, AD5363, ADP1864, AD5360, ADG707, AD7657, AD7476A,
ADG728, ADG739, AD5320, AD7814, ADG801, ADG802, AD7814CHIPS, DAC8420,
AD5726, AD7888MCPCHIPS, DAC8043A, DAC8043, AD5441, ADG3300, ADG3308,
ADG3304, AD7414-0/-1/AD7415, AD7414-2/-3, AD8668, ADG715, ADG884, ADM1170-1,
ADM1170-2, ADM1171-1, ADM1171-2, ADM1172-1, ADM1172-2, ADM4210-1, ADM42102, ADM6819, ADM6820, ADP1821, ADP1822, AD5405, ADG3304 WLCSP, AD5415,
AD7992/3/4/7/8, ADM1170-1/-2, ADM1171-1/-2, ADM1172-1/-2, ADM4210-1/-2, ADM6819,
ADM6820, ADG1434, ADG1408, ADG1409, ADG1433, ADG1434, ADM4073F, ADM4073T,
ADM4073H, AD8619, ADG888 BUMPED, AD8231, ADG794, ADG888, AD5443, AD5424,
AD5425, AD5426, AD5432, AD5433, AD5445, ADR5040/1/3/4/5, AD7817, AD5628,
AD5648, AD5666, AD5668, AD5678, and the ADG1208. These are listed in the additionaltransferred parts section.
The AD5398 is a single 10-bit DAC with 120mA output current sink capability.
The AD5821 is a single 10-bit digital-to-analog converter with 120mA output current sinkcapability. It features and internal reference and operates from a single 2.7V to 5.5V supply. The
DAC is controlled via a 2-wire (I2C-compatible) serial interface that operates at clock rates up to
400kHz.

Page 2 of 29

Reliability Report: 6396
The X402 is a thin film test chip. The X402 test vehicle was used to qualify the seven ‘blackbox’ circuit options. These circuit options ranged from single latch to 16k memory arrays. All
qualification material was assembled in a 44 ld PLCC package.
The ADP1653 is an ultra compact flash LED driver.
The ADP3207 is a multi-phase synchronous buck switching controller optimized forconverting the notebook battery voltage into the core supply voltage required by Intelprocessor.
The ADP3207A is a further revision on the ADP3207.

The ADD8754 offers display designers the flexibility of a high frequency step-up dc-dc
switching regulator, LDO voltage regulator, dedicated VCOM operational amplifier, and agate pulse modulator circuit integrated on a single chip.
The ADD8754D is a follow on part from the ADD8754 with improved ESD protection.
The ADP1823 is a versatile dual, interleaved synchronous PWM buck controller.
The ADP3208 is a two phase integrated controller and driver chip. The controller portion isderived from the ADP3207, a three phase controller. The driver portion is a scaled up version of
the drivers on the ADP3280, which is also an integrated driver and controller.
The ADP3209 is a single-phase controller with drivers for mobile chip-sets.
All parts already have been fully qualified to ADI0012 on 6” in the Limerick Fab. This reportcovers the qualification of the same die on Limericks 8” 0.6um DPTM CMOS fab process.

Page 3 of 29

Reliability Report: 6396

Table 1: AD5398 Product Characteristics
DeviceMaximum Power Dissipation (W)0.184
Device / Die ID
F23A
Die Size (mm)1.40 x 1.69
Wafer Fabrication Site
ADI-Limerick 8”
Wafer Fabrication Process
0.6um DPTM CMOS
Transistor Count
7 thousand
Passivation Layer
undoped-oxide/SiN
Bond Pad Metal Composition
AlCu
Maximum Current Density (mA/µm)
1.18
Package/Assembly
Available Package(s)Body Size (mm)Assembly Location
Die Attach
Lead Frame Material
Bond Wire Type
Bond Wire Dia. (mils)
Mold Compound
Lead Finish
Moisture Sensitivity Level
Maximum Peak Reflow (°C)

8-LFCSP
3.00 x 3.00 x .00
Amkor-K
Ablestik 8290
Copper Olin 194
Gold
1.00
Sumitomo G700
Tin Plate
1260

Table 2: AD5821 Product Characteristics
DeviceMaximum Power Dissipation (W)0.184
Device / Die ID
F24A
Die Size (mm)1.52 x 1.69
Wafer Fabrication Site
ADI-Limerick 8”
Wafer Fabrication Process
C6DPTMRA
Transistor Count
5 thousand
Passivation Layer
undoped-oxide/SiN
Bond Pad Metal Composition
AlCu
Maximum Current Density (mA/μm)
1.18

Page 4 of 29

Reliability Report: 6396

Table 3: ADP3207 Product Characteristics
DeviceMaximum Power Dissipation (W)0.100
Device / Die ID
6510Z
Die Size (mm)2.02 x 2.00
Wafer Fabrication Site
ADI-Limerick 8”
Wafer Fabrication Process
H6DPDMPNLR
Transistor Count
7300
Passivation Layer
undoped-oxide/SiN
Bond Pad Metal Composition
AlCu
Maximum Current Density (mA/µm)
1.18
Package/Assembly
Available Package(s)Body Size (mm)Assembly Location
Die Attach
Lead Frame Material
Bond Wire Type
Bond Wire Dia. (mils)
Mold Compound
Lead Finish
Moisture Sensitivity Level
Maximum Peak Reflow (°C)

40-LFCSP
6.00 x 6.00 x .9
Amkor-K
Ablestik 8290
CopperGold
1.00
Sumitomo G700
Tin Plate
3260

Page 5 of 29

Reliability Report: 6396

Table 4: ADD8754 Product Characteristics
DeviceMaximum Power Dissipation (W)Device / Die ID
Die Size (mm)Wafer Fabrication Site
Wafer Fabrication Process
Transistor Count
Passivation Layer
Bond Pad Metal Composition
Package/Assembly
Available Package(s)Body Size (mm)Assembly Location
Die Attach
Lead Frame Material
Bond Wire Type
Bond Wire Dia. (mils)
Mold Compound
Lead Finish
Moisture Sensitivity Level
Maximum Peak Reflow (°C)

2.08
ADD8754 - 8524Z
2.24 x 2.24
ADI-Limerick 8”
0.6um DPTM CMOS
1240
undoped-oxide/OxyNitride
AlCu
4x4 24-LFCSP
4.00 x 4.00 x .85
Amkor-K
Ablestik 8900NC
Copper Olin 194
Gold
1.20
Sumitomo G700
Tin Plate
3260

Page 6 of 29

Reliability Report: 6396

Table 5: ADD8754D Product Characteristics
DeviceMaximum Power Dissipation (W)Device / Die ID
Die Size (mm)Wafer Fabrication Site
Wafer Fabrication Process
Transistor Count
Passivation Layer
Bond Pad Metal Composition
Package/Assembly
Available Package(s)Body Size (mm)Assembly Location
Die Attach
Lead Frame Material
Bond Wire Type
Bond Wire Dia. (mils)
Mold Compound
Lead Finish
Moisture Sensitivity Level
Maximum Peak Reflow (°C)

2.08
YJ22B011.72 x 1.8
ADI-Limerick 8”
0.6um DPTM CMOS
1240
undoped-oxide/OxyNitride
AlCu
4x4 24-LFCSP
4.00 x 4.00 x .85
Amkor-K
Ablestik 8900NC
Copper Olin 194
Gold
1.20
Sumitomo G700
Tin Plate
3260

Page 7 of 29

Reliability Report: 6396

Table 6: ADP3207A Product Characteristics
DeviceMaximum Power Dissipation (W)0.100
Device / Die ID
6572ZBDie Size (mm)2.23 x 2.20
Wafer Fabrication Site
ADI-Limerick 8”
Wafer Fabrication Process
H6DPDMPNLR
Transistor Count
7300
Passivation Layer
undoped-oxide/SiN
Bond Pad Metal Composition
AlCu
Maximum Current Density (mA/µm)
1.18
Package/Assembly
Available Package(s)Body Size (mm)Assembly Location
Die Attach
Lead Frame Material
Bond Wire Type
Bond Wire Dia. (mils)
Mold Compound
Lead Finish
Moisture Sensitivity Level
Maximum Peak Reflow (°C)

40-LFCSP
6.00 x 6.00 x .9
Amkor-K
Ablestik 8290
CopperGold
1.00
Sumitomo G700
Tin Plate
3260

Page 8 of 29

Reliability Report: 6396

Table 7: X402 Product Characteristics
DeviceMaximum Power Dissipation (W)Device / Die ID
Die Size (mm)Wafer Fabrication Site
Wafer Fabrication Process
Passivation Layer
Bond Pad Metal Composition
Package/Assembly
Available Package(s)Body Size (mm)Assembly Location
Die Attach
Lead Frame Material
Bond Wire Type
Bond Wire Dia. (mils)
Mold Compound
Lead Finish
Moisture Sensitivity Level
Maximum Peak Reflow (°C)

X402
0.050
A
2.61 x 2.61
ADI-Limerick
C6 DPTMR
undoped-oxide/SiN
AlCu
44-PLCC.00 x .00 x .00
Amkor-P
Ablestik 84-1LMIS R4
Copper Olin 151
Gold
1.30
Sumitomo 6300H
Tin / Lead Solder Plate
3
230

Page 9 of 29

Reliability Report: 6396

Table 8: ADP1653 Product Characteristics
DeviceMaximum Power Dissipation (W)Device / Die ID
Die Size (mm)Wafer Fabrication Site
Wafer Fabrication Process
Transistor Count
Passivation Layer
Bond Pad Metal Composition

0.5
6568Z
1.45 x 1.45
ADI-Limerick 8”
0.6um DPTM CMOS
9 thousand
undoped-oxide/OxyNitride
AlCu

Maximum Power Dissipation (W)Device / Die ID
Die Size (mm)Wafer Fabrication Site
Wafer Fabrication Process
Transistor Count
Passivation Layer
Bond Pad Metal Composition

0.5
6568ZD
1.45 x 1.45
ADI-Limerick 8”
0.6um DPTM CMOS
9 thousand
undoped-oxide/OxyNitride
AlSiCuPackage/Assembly
Available Package(s)Body Size (mm)Assembly Location
Die Attach
Lead Frame Material
Bond Wire Type
Bond Wire Dia. (mils)
Mold Compound
Lead Finish
Moisture Sensitivity Level
Maximum Peak Reflow (°C)

16-LFCSP
3.00 x 3.00 x .95
Amkor-K
Ablestik 8290
CopperGold
1.20
Sumitomo G700
Tin Plate
3260

Page 10 of 29

Reliability Report: 6396

Table 9: ADP1823 Product Characteristics
DeviceMaximum Power Dissipation (W)Die Size (mm)Wafer Fabrication Site
Wafer Fabrication Process
Transistor Count
Passivation Layer
Bond Pad Metal Composition
Package/Assembly
Available Package(s)Assembly Location
Die Attach
Lead Frame Material
Bond Wire Type
Bond Wire Dia. (mils)
Mold Compound
Lead Finish
Moisture Sensitivity Level
Maximum Peak Reflow (°C)

11.83 x 2.05
ADI-Limerick 8”
0.6um DPDM CMOS
2097
undoped-oxide/OxyNitride
AlCu

32-LFCSP
Amkor-K
Ablestik 8290
Copper Olin 194
Gold
1.00
Sumitomo G700
Tin Plate
3260

Page 11 of 29

Reliability Report: 6396

Table 10: ADP3208 Product Characteristics
DeviceMaximum Power Dissipation (W)Die Size (mm)Wafer Fabrication Site
Wafer Fabrication Process
Transistor Count
Passivation Layer
Bond Pad Metal Composition

0.11
1.96 x 2.66
ADI-Limerick 8”
H6DPDMNLRI
3000
undoped-oxide/SiN
AlCu

Package/Assembly
Available Package(s)Body Size (mm)Assembly Location
Die Attach
Lead Frame Material
Bond Wire Type
Bond Wire Dia. (mils)
Mold Compound
Lead Finish
Moisture Sensitivity Level
Maximum Peak Reflow (°C)

48-LFCSP
7.00 x 7.00 x .85
Amkor-K
Ablestik 8290
CopperGold
1.00
Sumitomo G700
Tin Plate
3260

Page 12 of 29

Reliability Report: 6396

Table 11: ADP3209 Product Characteristics
DeviceMaximum Power Dissipation (W)Die Size (mm)Wafer Fabrication Site
Wafer Fabrication Process
Transistor Count
Passivation Layer
Bond Pad Metal Composition
Package/Assembly
Available Package(s)Body Size (mm)Assembly Location
Die Attach
Lead Frame Material
Bond Wire Type
Bond Wire Dia. (mils)
Mold Compound
Lead Finish
Moisture Sensitivity Level
Maximum Peak Reflow (°C)

0.11
1.96 x 2.66
ADI-Limerick 8”
0.6μm 2P2M HV CMOS
3000
undoped-oxide/SiN
AlCu

32-LFCSP
5.0 x 5.0 x 1.0
Amkor-K
Ablestik 8290
Copper Olin 194
Gold
1.00
Sumitomo G700
Tin Plate
3260

Page 13 of 29

Reliability Report: 6396

Description/Results of Tests Performed
Tables 12-13 provides a description of the qualification tests conducted and the associatedtest results on the AD5398 YG06, AD5398 YH14, ADP1653, ADP1823, ADD8754,
ADD8754D, ADP3207, ADP3207A, ADP3208, ADP3209 and the X402. Two lots werequalified in Qual Plan #6396 and one lot was qualified in Qual Plan #6500 for the AD5398.

Table 12: Package Qualification Test Results from QP6396
Test Name

Conditions

Specification

DevicePackage

Autoclave 1

121C 100%RH
2atm 168hrs

JEDEC-STD22, Method
A102

AD5398

8-LFCSP

AD5398

8-LFCSP

X402

44-PLCCHTS

150C 1000hrs

SHR 1

Temp Cycle 1

See Below-65C/+150C
500cycles

JEDEC-STD22, Method
A103

ADI-0049

JEDEC-STD22, Method
A104

AD5398

8-LFCSP

AD5398

8-LFCSP

X402

44-PLCC

AA40489.1

SampleSize
77

AA50891.1

77

0AA40343.1

77

0AA50893.1

770

Lot Num

Qty. Rejects
0f159859.3

760f159972.2

450f159973.4

45

0AA40339.1

25

0AA52997.1

100AA40344.1

77

0AA50895.1

770f159970.2

480f159972.4

450f159978.4

45

0

SHR

2

See Below

ADI-0049

ADP1653 rev-b 16-LFCSP AA71942.1

15

0

SHR

2

See Below

ADI-0049

ADP1653 rev-c 16-LFCSP AA55280.1

15

0

SHR

2

See Below

ADI-0049

ADP3207A

40-LFCSP AB82992.1

20

0

SHR

2

See Below

ADI-0049

ADP3207

40-LFCSP AA42967.1

20

0

SHR

2

See Below

ADI-0049

ADD8754

24-LFCSP AA50896.1

20

0

SHR

2

See Below

ADI-0049

ADD8754D

24-LFCSP AD23125.1

20

0

SHR

2

See Below

ADI-0049

ADP1823

32-LFCSP AB86438.1

15

0

SHR

2

See Below

ADI-0049

ADP3208

48-LFCSP AA80830.1

20

0

SHR 2

See Below

ADI-0049

ADP3209

32-LFCSP S156503.6

150Page 14 of 29

Reliability Report: 6396

Table 13: Package Qualification Test Results from QP6500
Test Name

Conditions

Autoclave 1

121C 100%RH
2atm 168hrs

HTS

150C 1000hrs

SHR 1

See Below

Temp Cycle 1-65C/+150C
500cycles

1

2

Specification
JEDEC-STD22, Method
A102
JEDEC-STD22, Method
A103
ADI-0049
JEDEC-STD22, Method
A104

SampleSize

Qty. Rejects

8-LFCSP AA42946.1

770AD5398

8-LFCSP AA42958.1

770AD5398

8-LFCSP AA42959.1

100AD5398

8-LFCSP AA34423.1

770DevicePackage

AD5398Lot Num

These Samples were subjected to preconditioning (per J-STD-020 Level 1) prior to the start of the stress test.
Level 1 preconditioning consists of the following:• Bake: 24 hrs @ 125°C• Unbiased Soak: 168 hrs @ 85°C, 85%RH• Reflow: 3 passes through an oven with a peak temperature of 260+0/-5°C
These Samples were subjected to preconditioning (per J-STD-020 Level 3) prior to the start of the stress test.
Level 1 preconditioning consists of the following:• Bake: 24 hrs @ 125°C• Unbiased Soak: 192 hrs @ 30°C, 60%RH• Reflow: 3 passes through an oven with a peak temperature of 260+0/-5°C

Samples of the many devices manufactured with this packaging technology are continuously
undergoing reliability evaluation as part of the ADI Reliability Monitor Program. Additional
qualificationdata
isavailableon
AnalogDevices'
web
site
at:
http://www.analog.com/world/quality/read/1stpage.html.

Page 15 of 29

Reliability Report: 6396

Table 14: Process Qualification Test Results for QP6396
Test
Name

Conditions

Specification

ELF

125C 48hrs

MIL-STD-883,
Method 1015

1

130C 85%RH
2atm, Biased
96hrs

HTOL

125C<Tj<135C,
Biased 1000hrs

HAST

ELF

HAST
1

125C 48hrs

130C 85%RH
2atm, Biased
96hrs

AA40487.1

Sample
Size
38

Qty.
Rejects
0

AA51034.1

330

0.6um DPTM
CMOS

AA40342.1

77

0AA50892.1

77

0

0.6um DPTM
CMOS

AA40514.1

500AA48457.1

450f159858.2

520f159954.2

2090f159971.1

200

0f159978.2

191

0f159859.4

77

0f159972.3

770f159978.3

770f159858.1

770f159955.2

800f159973.2

770Part Number Fab Process

Lot Number

AD5398

0.6um DPTMCMOSJEDEC-STD-22,
Method A110

AD5398JESD22-A108

AD5398MIL-STD-883,
Method 1015

JEDEC-STD-22,
Method A110

X402

X402

NA

NA

150C<Tj<175C,
HTOL
Biased 500hrs

JESD22-A108

ELF

125C 48hrs

MIL-STD-883,
Method 1015

ADP3207

H6DPDMPNLR

AA42968

100

0

HTOL

125C<Tj<135C,
Biased 1000hrs

JESD22-A108

ADP3207

H6DPDMPNLR

AA42968.2

77

0

ELF

125C 48hrs

MIL-STD-883,
Method 1015

ADD8754

AA50897.1

100

0

HTOL

125C<Tj<135C,
Biased 1000hrs

JESD22-A108

ADD8754

AA50897.1

77

0

ELF

125C 48hrs

MIL-STD-883,
Method 1015

ADP3208

H6DPDMPNLR

S148060

100

0

HTOL

125C<Tj<135C,
Biased 1000hrs

JESD22-A108

ADP3208

H6DPDMPNLR

AA80830.3

77

0

X402

NA

0.6um DPTM
CMOS
0.6um DPTM
CMOS

Page 16 of 29

Reliability Report: 6396

Table 15: Process Qualification Test Results for QP6500
Test
Name

Conditions

ELF

125C 48hrs

Specification Part Number

Fab Process

Lot Number

SampleSize

Qty.
Rejects

MIL-STD-883,
Method 1015
JEDEC-STD22, Method
A110

0.6um DPTM
CMOS

AA32245.1

1000AD5398130C 85%RH
0.6um DPTM
AD5398AA34421.1
77
2atm, Biased
CMOS
96hrs
125C<Tj<135C,
0.6um DPTMHTOLJESD22-A108
AD539895
AA32246.1
Biased 1000hrs
CMOS
1
These Samples were subjected to preconditioning (per J-STD-020 Level 1) prior to the start of the stress test.
Level 1 preconditioning consists of the following:• Bake: 24 hrs @ 125°C• Unbiased Soak: 168 hrs @ 85°C, 85%RH• Reflow: 3 passes through an oven with a peak temperature of 260+0/-5°C

HAST 1

Samples of the many devices manufactured with these process technologies are continuously
undergoing reliability evaluation as part of the ADI Reliability Monitor Program. Additional
qualificationdata
isavailableon
AnalogDevices'
web
site
at:
http://www.analog.com/world/quality/read/1stpage.html.

Page 17 of 2900Reliability Report: 6396

ESD Testing
The results of Human Body Model (HBM) and Field Induced Charge Device Model(FICDM) ESD testing are summarized in table 16 to 33.
ADI measures ESD results using stringent test procedures based on the specifications listed
in the above table. Any comparison with another supplier's results should ensure that thesame ESD test procedures have been used. For further details, please see the EOS/ESD
chapter of the ADI Reliability Handbook at http://www.analog.com/world/quality/manuals/.

Table 16: AD5398 ESD Test Results
ESD Model

Package

FICDM

8-LFCSP

HBM

8-LFCSPESD Test Spec
ESD Assoc.
STM5.3.1-1999
ESD Assoc.
STM5.1-2001

RC Network

Acc/rej limitClass

1Ω, Cpkg

pass +/- .25kV

C3

1.5kΩ, 100pF

pass +/-1.5kV

1C

Table 17: AD5821 ESD Test Results
ESD Model

Package

FICDM

8-LFCSP

HBM

8-LFCSPESD Test Spec
ESD Assoc.
STM5.3.1-1999
ESD Assoc.
STM5.1-2001

RC Network

Acc/rej limitClass

1Ω, Cpkg.25Kv/0.5kV

C3

1.5kΩ, 100pF

1.6kV/1.7kV

1C

Table 18: ADP3207A ESD Test Results
ESD Model

Package

FICDM

40-LFCSP

HBM

40-LFCSPESD Test Spec
ESD Assoc.
STM5.3.1-1999
ESD Assoc.
STM5.1-2001

RC Network

Acc/rej limitClass

1Ω, Cpkg+/-1kVC5

1.5kΩ, 100pF+/-3.5kV

2

Table 19: ADD8754 ESD Test Results
ESD Model

Package

FICDM

16-LFCSP

MM

16-LFCSP

HBM

16-LFCSPESD Test Spec
ESD Assoc.
STM5.3.1-1999

RC Network

Acc/rej limitClass

1Ω, Cpkg+/-1.5kVC6ESD Assoc.
STM5.2-1999

0kΩ, 200pF+/-0.2kV

M3

ESD Assoc.
STM5.1-2001

1.5kΩ, 100pF+/-2.5kV

2Page 18 of 29

Reliability Report: 6396

Table 20: ADD8754D ESD Test Results
ESD Model

Package

FICDM

16-LFCSP

MM

16-LFCSP

HBM

16-LFCSPESD Test Spec
ESD Assoc.
STM5.3.1-1999

RC Network

Acc/rej limitClass

1Ω, Cpkg+/-1.5kVC6ESD Assoc.
STM5.2-1999

0kΩ, 200pF+/-0.2kV

M3

ESD Assoc.
STM5.1-2001

1.5kΩ, 100pF+/-4.0kV

3A

Table 21: ADP3207 ESD Test Results
ESD Model

Package

FICDM

24-LFCSP

HBM

24-LFCSPESD Test Spec
ESD Assoc.
STM5.3.1-1999
ESD Assoc.
STM5.1-2001

RC Network

Acc/rej limitClass

1Ω, Cpkg+/-0.5kV

C4

1.5kΩ, 100pF+/-2.5kV

2

Table 22: ADP1653 ESD Test Results
ESD Model

Package

FICDM

40-LFCSP

HBM

40-LFCSPESD Test Spec
ESD Assoc.
STM5.3.1-1999
ESD Assoc.
STM5.1-2001

RC Network

Acc/rej limitClass

1Ω, Cpkg+/-1.0kV

C5

1.5kΩ, 100pF+/-2.0kV

2

Table 23: ADP1823 ESD Test Results
ESD Model

Package

FICDM

32-LFCSP

HBM

32-LFCSPESD Test Spec
ESD Assoc.
STM5.3.1-1999
ESD Assoc.
STM5.1-2001

RC Network

Acc/rej limitClass

1Ω, Cpkg+/-0.5kV

C4

1.5kΩ, 100pF+/-2.0kV

2

Table 24: ADP3208 ESD Test Results
ESD Model

Package

FICDM

48-LFCSP

HBM

48-LFCSPESD Test Spec
ESD Assoc.
STM5.3.1-1999
ESD Assoc.
STM5.1-2001

RC Network

Acc/rej limitClass

1Ω, Cpkg+/-0.25kV

C1

1.5kΩ, 100pF+/-1.0kV

1C

Table 25: ADP3209 ESD Test Results
ESD Model

Package

FICDM

32-LFCSP

HBM

32-LFCSP

MM

32-LFCSPESD Test Spec
ESD Assoc.
STM5.3.1-1999

RC Network

Acc/rej limitClass

1Ω, Cpkg+/-0.5kV

C4

ESD Assoc.
STM5.1-2001

1.5kΩ, 100pF+/-2.0kV2

ESD Assoc.
STM5.2-1999

0kΩ, 200pF+/-0.2kVM3Page 19 of 29

Reliability Report: 6396

Table 26: ADE7754 ESD Test Results
ESD Model

Package

FICDM

48-LFCSP

HBM

48-LFCSPESD Test Spec
ESD Assoc.
STM5.3.1-1999
ESD Assoc.
STM5.1-2001

RC Network

Acc/rej limitClass

1Ω, Cpkg+/-0.25kV

C1

1.5kΩ, 100pF+/-1.5kV

1C

RC Network

Acc/rej limitClass

1Ω, Cpkg+/-1.0kV

C5

1.5kΩ, 100pF+/-1.5kV

1C

RC Network

Acc/rej limitClass

1Ω, Cpkg+/-1.0kV

C5

1.5kΩ, 100pF+/-4.0kV

3A

RC Network

Acc/rej limitClass

1Ω, Cpkg+/-1.0kV

C5

1.5kΩ, 100pF+/-4.0kV

3A

RC Network

Acc/rej limitClass

1Ω, Cpkg+/-1.0kV

C5

1.5kΩ, 100pF+/-4.0kV

3A

RC Network

Acc/rej limitClass

1Ω, Cpkg+/-1.5kV

C51.5kΩ, 100pF+/-4.0kV

2

Table 27: AD7843 ESD Test Results
ESD Model

Package

FICDM

48-LFCSP

HBM

48-LFCSPESD Test Spec
ESD Assoc.
STM5.3.1-1999
ESD Assoc.
STM5.1-2001

Table 28: AD7476 ESD Test Results
ESD Model

Package

FICDM

48-LFCSP

HBM

48-LFCSPESD Test Spec
ESD Assoc.
STM5.3.1-1999
ESD Assoc.
STM5.1-2001

Table 29: AD7418 ESD Test Results
ESD Model

Package

FICDM

48-LFCSP

HBM

48-LFCSPESD Test Spec
ESD Assoc.
STM5.3.1-1999
ESD Assoc.
STM5.1-2001

Table 30: AD7417 ESD Test Results
ESD Model

Package

FICDM

48-LFCSP

HBM

48-LFCSPESD Test Spec
ESD Assoc.
STM5.3.1-1999
ESD Assoc.
STM5.1-2001

Table 31: ADG758 ESD Test Results
ESD Model

Package

FICDM

48-LFCSP

HBM

48-LFCSPESD Test Spec
ESD Assoc.
STM5.3.1-1999
ESD Assoc.
STM5.1-2001

Page 20 of 29

Reliability Report: 6396

Table 32: AD73360 ESD Test Results
ESD Model

Package

ESD Test SpecRC Network

Acc/rej limit

Class

HBM

48-LFCSP

ESD Assoc.
STM5.1-2001

1.5kΩ, 100pF+/-2.5kV2

RC Network

Acc/rej limitClass

1Ω, Cpkg+/-0.5kV

C2

1.5kΩ, 100pF+/-3.0kV

2

Table 33: AD8509 ESD Test Results
ESD Model

Package

FICDM

48-LFCSP

HBM

48-LFCSPESD Test Spec
ESD Assoc.
STM5.3.1-1999
ESD Assoc.
STM5.1-2001

Page 21 of 29

Reliability Report: 6396

Latch-up Testing
Six samples of the AD5398 passed Latch-up testing at Ta=25°C per JEDEC Standard
JESD78, Class I, Level A.
Twelve samples of the AD5821 passed Latch-up testing at Ta=25°C per JEDEC Standard
JESD78, Class I, Level A.
Twelve samples of the ADP3207A passed Latch-up testing at Ta=25°C per JEDEC Standard
JESD78, Class I, Level A.
Twelve samples of the ADP3207 passed Latch-up testing at Ta=25°C per JEDEC Standard
JESD78, Class I, Level A.
Twelve samples of the ADP1653 passed Latch-up testing at Ta=25°C per JEDEC Standard
JESD78, Class I, Level A.
Twelve samples of the ADP1823 passed Latch-up testing at Ta=25°C per JEDEC Standard
JESD78, Class I, Level A.
Twelve samples of the ADP3208 passed Latch-up testing at Ta=25°C per JEDEC Standard
JESD78, Class I, Level A.
Twelve samples of the ADP3209 passed Latch-up testing at Ta=25°C per JEDEC Standard
JESD78, Class I, Level A.
Twelve samples of the ADD8754D passed Latch-up testing at Ta=25°C per JEDEC Standard
JESD78, Class I, Level A.
Latch-up was not completed on the ADD8754 as this part was not going to be released on 8”
and was only being used as the qualification vehicle.

Approvals
Reliability Engineer: Fergus Downey
This report has been approved by electronic means (3.5).

Additional Information
Data sheets and other additional information are available on Analog Devices’ web site at theaddresses shown below.
Home Page:
Sales Info:
Reliability Data:
Reliability Handbook:

http://www.analog.com
http://www.analog.com/world/corp_fin/sales_directory/distrib.html
http://www.analog.com/world/quality/read/1stpage.html
http://www.analog.com/corporate/quality/manuals/

Page 22 of 29

Reliability Report: 6396

Appendix
A. Additional Transferred parts

Page 23 of 29

Reliability Report: 6396
A: Additional Transferred parts.
Part name
ADE7754
AD7843
AD7477
AD7476
AD7418AD7417
AD7416

die #
7754
F734A
N521A
N52A
D102A
D101A

Wafer Fabrication
Process
C6DPTM

4.68x3.58

2733371.82x2.085067

0.01575

0.78x2.282624

0.01575

0.78x2.282624

0.0275

1.52x2.125799

0.0275

1.52x2.125799

0.0275

1.52x2.125799

0.00450.75x1.35

2812

0.00631.30x2.00

0.003

2.34x2.896

5925

0.02

1.33x1.81

3904

0.02

1.33x1.81

3904

0.02

1.33x1.81

3904

0.02

2.73x4.68

41000

0.132

2.60x2.60

31435

0.132

2.60x2.60

31435

0.005452.07x2.8513673

0.005452.07x2.8513673

0.005452.07x2.8513673

0.005452.07x2.8513673

0.005452.07x2.8513673

0.005452.07x2.85

13673

0.042

1.77x2.42

1627

0.042

1.77x2.421627

0.00033

1.75x1.98386

0.00033

1.75x1.98386

0.00033

1.75x1.98386

0.00033

1.75x1.98386

0.00033

1.75x1.98386

0.00033

1.75x1.98

386

0.02

1.66x1.92

4813

0.02

1.66x1.92

4813

0.2

4.27x6.10

57380

0.06752.73x4.68

41000

0.06752.73x4.68

41000

0.004

1.14x2.21

7325

8C6DPDM

0.0275

1.52x2.12

5799

8C6DPDML
8C6DPDML
8C6DPDM
8C6DPDM
8C6DPDM

ADG758A78A

8C6MDPTM

AD52066427Z

C6DPDM

AD7303

J06C

8C6DPDMS

ADW50009

J06C

8C6DPDMS

AD11/2045

J06C

8C6DPDMS

AD7730L

S402B

8C6DPDM

AD9832F05A

8C6DPDMS

AD9835F05A

8C6DPDMS

AD5306

F47A

8C6DPDM

AD5316

F47A

8C6DPDM

AD5326F471A

8C6DPDM

AD5307F472A

8C6DPDM

AD5317F472A

8C6DPDM

AD5327F473A

8C6DPDM

AD85096411Z

8C6DPDM

AD85116411Z

8C6DPDM

AD5241-10

6432Z

8C6MDPDMR

AD5241-100

6432Z

8C6MDPDMR

AD5241-1

6432Z

8C6MDPDMR

AD5242-10

6432Z

8C6MDPDMR

AD5242-100

6432Z

8C6MDPDMR

AD5242-1

6432Z

8C6MDPDMR

AD7302J07A

8C6DPDMS

AD7801J07A

8C6DPDMS

AD73360

U60A

8C6DPDM

AD7730S40B

8C6DPDM

AD7731S401B

8C6DPDM

AD7418 CHIPS

Transistor
Count

0.88

D10A
D122A

F44A
8YB07J02

Die Size (mm)0.005675

8C6DPDM

AD5300AD5302

Maximum Power
Dissipation (W)

8C6DPDM

8C6DPDM

AD5312

8YB42E01

8C6DPDM

0.004

1.14x2.21

7325

AD5322

8YB42E02

8C6DPDM

0.004

1.14x2.21

7325

Page 24 of 29

Reliability Report: 6396
AD5313

8YB42E04

8C6DPDM

0.004

1.14x2.22

7325

AD5323

8YB42E05

8C6DPDM

0.004

1.14x2.23

7325

AD5308

8YE02A

8C6DPDM

0.00212.70x2.61

20169

AD5328

8YE02A

8C6DPDM

0.00212.70x2.61

20169

AD5318

8YE02A

8C6DPDM

0.00212.70x2.61

20169

AD7904

8YE22C

8C6DPDM

0.01

2.30x2.62

7600

AD7914

8YE22C

8C6DPDM

0.01

2.30x2.62

7600

AD7923

8YE22C

8C6DPDM

0.01

2.30x2.62

7600

AD7918

8YE22C

8C6DPDM

0.01

2.30x2.62

7600

AD7924

8YE22C

8C6DPDM

0.01

2.30x2.62

7600

AD7928

8YE22C

8C6DPDM

0.01

2.30x2.62

7600

AD7927

8YE22C

8C6DPDM

0.01

2.30x2.627600

AD8607

8YE92B01

8C6DPDMLX

0.001

1.42x1.91

3332

AD8603

8YE79C02

8C6DPDML

0.00030.94x1.422322

MCPCHIPS

8YE22C

8C6DPDM

0.01

2.30x2.627600

AD7908

8YE22C

8C6DPDM

0.01

2.30x2.62

7600

ADG714

8YC46C06

8C6DPDM

0.072

1.30x2.01

1100

ADG725

8YD59E03/8YD59F03

8C6MDPTM

0.025

3.31x3.26

2500

ADG731

8YD59E02/8YD59F02

8C6MDPTM

0.025

3.31x3.26

2500

ADG732

8YD59F/8YD59E

8C6MDPTM

0.025

3.31x3.26

2500

ADG726

8YD59E01/8YD59F01

8C6MDPTM

0.025

3.31x3.26

2500

AD7478

8YC26D02

8C6DPDMLR

0.01575

0.78x2.28

2624

AD5160/AD5161/AD5245

8YE48B

8C6MDPDMR

0.00020.78x1.95

2532

AD5160/AD5161/AD5245

8YE48B01

8C6MDPDMR

0.00020.78x1.95

2532

AD5160/AD5161/AD5245

8YE48B02

8C6MDPDMR

0.00020.78x1.95

2532

AD5160/AD5161/AD5245

8YE48B03

8C6MDPDMR

0.00020.78x1.95

2532

ADP3041

8YD85D

8S6DPDMNT

0.2

1.44x1.82

232

AD9851

8YC13B

8C6DPDM

0.555

2.29x4.34

AD7911/12/21/22

8YF06B

8C6DPTMLA

0.02

0.78x2.29

3820

AD8604

8YC69C

8C6DPDM

0.024

1.32x1.73

3229

AD5162-2.5

8YE98B07

8C6MDPDMR

0.006

1.47x1.71

6115

AD5162-100

8YE98B06

8C6MDPDMR

0.006

1.47x1.71

6115

AD5162-10

8YE98B04

8C6MDPDMR

0.006

1.47x1.71

6115

AD5172/AD5243-10

8YE98B

8C6MDPDMR

0.006

1.47x1.71

6115

AD5162-50

8YE98B05

8C6MDPDMR

0.006

1.47x1.71

6115

AD5172/AD5243-100

8YE98B02

8C6MDPDMR

0.006

1.47x1.71

6115

AD5172/AD5243-50

8YE98B01

8C6MDPDMR

0.006

1.47x1.71

6115

AD5172/AD5243-2.5

8YE98B03

8C6MDPDMR

0.006

1.47x1.71

6115

AD5173/AD5248-10

8YE98B08

8C6MDPDMR

0.006

1.47x1.71

6196

AD5170-10

8YE98B12

8C6MDPDMR

0.006

1.47x1.71

6196

AD5173/AD5248-2.5

8YE98B11

8C6MDPDMR

0.006

1.47x1.71

6196

AD5173/AD5248-100

8YE98B10

8C6MDPDMR

0.006

1.47x1.71

6196

AD7873

8YC72F02

8C6DPDM

0.006

2.00x1.79

5097

Page 25 of 29

Reliability Report: 6396
AD7656

8YG50E/8YG50F

8H6DPTMIL

0.15

4.60x5.49

55061

AD5170-2.5

8YE98B15

8C6MDPDMR

0.006

1.47x1.71

6196

AD7922

8YF06B

8C6DPTMLA

0.02

0.78x2.29

3820

AD5173/AD5248-50

8YE98B09

8C6MDPDMR

0.006

1.47x1.71

6196

AD7829

8YA73C

8C6DPDM

0.065

2.29x2.72

4549

AD5170-50

8YE98B13

8C6MDPDMR

0.006

1.47x1.71

6196

AD7822

8YA73C02

8C6DPDM

0.065

2.29x2.72

4549

AD7825

8YA73C01

8C6DPDM

0.065

2.29x2.72

4549

AD7829-1

8YA73C03

8C6DPDM

0.065

2.29x2.72

4549

AD5170-100

8YE98B14

8C6MDPDMR

0.006

1.47x1.71

6196

AD5301

8YH03B01

8C6DPDM

0.001375

0.79x2.17

2094

AD5301

8YH03B

8C6DPDM

0.001375

0.79x2.17

2094

AD5311

8YH03B02

8C6DPDM

0.001375

0.79x2.17

2094

AD5321

8YH03B04

8C6DPDM

0.001375

0.79x2.17

2094

AD5321

8YH03B05

8C6DPDM

0.001375

0.79x2.17

2094

AD5311

8YH03B03

8C6DPDM

0.001375

0.79x2.17

2094

ADM1175/6/7/8/91/92

YG56E

8H6DPTMPNLR

0.04

1.41x2.1513500

AD7873

8YC72F02

8C6DPDM

0.006

2.00x1.79

5097

AD7545A MIL

8YE82I

8H6DPDMRB

0.013

1.80x1.83

154

AD7545ACHIPS

8YE82I

8H6DPDMRB

0.013

1.80x1.83

154

AD7545A

8YE82I

8H6DPDMRB

0.013

1.80x1.83

154

AD7545

8YE82I

8H6DPDMRB

0.013

1.80x1.83

154

PM7545

8YE82I

8H6DPDMRB

0.013

1.80x1.83

154

AD5333

8YC38D05

8C6DPDM

0.00361.90x2.76

13365

AD5332

8YC38D06

8C6DPDM

0.00361.90x2.76

13365

AD5331

8YC38D07

8C6DPDM

0.00361.90x2.76

13365

AD5330

8YC38D08

8C6DPDM

0.00361.90x2.76

13365

AD5343

8YC38D10

8C6DPDM

0.00361.90x2.76

13365

AD5341

8YC38D09

8C6DPDM

0.00361.90x2.76

13365

AD5335

8YC38D11

8C6DPDM

0.00361.90x2.76

13365

AD5344

8YC38D

8C6DPDM

0.00361.90x2.76

13365

AD5342

8YC38D01

8C6DPDM

0.00361.90x2.76

13365

AD5336

8YC38D02

8C6DPDM

0.00361.90x2.76

13365

AD5334

8YC38D03

8C6DPDM

0.00361.90x2.76

13365

AD5340

8YC38D04

8C6DPDM

0.00361.90x2.76

13365

ADG787

8YF71D02

8C6MDPTM

0.04

1.50x2.01

202

DAC8412

8YH39E

8H6DPDMPNRBX

0.51

5.80x4.55

3229

AD86026426y

8C6DPDM

0.012

1.40x0.95

2000

AD85116411ZA

8C6DPDM

0.042

1.77x2.42

1627

AD85096411ZA

8C6DPDM

0.042

1.77x2.42

1627

AD7303

J06C

8C6DPDMS

0.02

1.33x1.81

3904

AD5626

8YJ01C

H6DPDMPNR

0.15

3.06x2.93

3000

ADG706

8YC68C

8C6MDPDM

0.18

1.73x2.74

487

Page 26 of 29

Reliability Report: 6396
AD7740

8YC39E

8C6DPDM

0.00550.79x2.08

1900

DAC8413

8YH39E01/8YH39F01

8H6DPDMPNRBX

0.51

3.06x2.93

3229

AD5227-10

8YF37D

8C6MDPDMR

0.000015

0.52x1.40

1326

AD5227-100

8YF37E02

8C6MDPDMR

0.000015

0.52x1.40

1326

ADG819

8YD60E

8C6MDPTM

0.1

1.14x2.18

100

AD5725

8YH39E

8H6DPDMPNRBX

0.51

3.06x2.93

3229

AD5228-10

8YF37D

8C6MDPDMR

0.000015

0.52x1.40

1326

AD5228-100

8YF37E02

8C6MDPDMR

0.000015

0.52x1.40

1326

AD5228-50

8YF37E01

8C6MDPDMR

0.000015

0.52x1.40

1326

AD5725-1

8YH39E01

8H6DPDMPNRBX

0.51

3.06x2.93

3229

AD7490

8YD23E01

8C6DPDM

0.01

2.30x2.59

6862

AD7888

8YC54C

8C6DPDM

0.01651.70x2.05

3009

AD7888CHIPS

8YC54C

8C6DPDM

0.01651.70x2.05

3009

AD5227-50

8YF37E01

8C6MDPDMR

0.000015

0.52x1.40

1326

AD5373

8YJ20C/8YJ20D

8H6DPTMPNR

0.5

6.00x6.00

250000

DAC8412

8YH39F

8H6DPDMPNRBX

0.51

3.06x2.93

3000

AD5725-1

8YH39F01

8H6DPDMPNRBX

0.51

3.06x2.93

3229

AD5725

8YH39F

8H6DPDMPNRBX

0.51

3.06x2.93

3229

AD5371

8YJ20C/8YJ20D

8H6DPTMPNR

0.5

6.00x6.00

250000AD5370

8YJ20C/8YJ20D

8H6DPTMPNR

0.5

6.00x6.00

250000AD5372

8YJ20C/8YJ20D

8H6DPTMPNR

0.5

6.00x6.00

250000AD5361

8YJ20C/8YJ20D

8H6DPTMPNR

0.5

6.00x6.00

250000AD5362

8YJ20C/8YJ20D

8H6DPTMPNR

0.5

6.00x6.00

250000AD5363

8YJ20C/8YJ20D

8H6DPTMPNR

0.5

6.00x6.00

250000

ADP1864

8YG03G

8H6DPDMPNLR

0.005

0.78x1.39

1100

AD5360

8YJ20C/8YJ20D

8H6DPTMPNR

0.5

6.00x6.00

250000ADG707

8YC68C01

8C6MDPDM

0.018

1.73x2.74

487

AD7657

8YG50E

8H6DPTMIL

0.15

4.60X5.49

55061

AD7476A

N52A

8C6DPDM

0.01575

0.78x2.28

2624

ADG728

8YC46A02

8C6SPDM

0.072

1.30x2.01

1100

ADG739

8YC46A05

8C6SPDM

0.072

1.30x2.01

1100

AD5320D123A

8C6DPDM

0.007

0.75x1.35

2812

AD7814

8YB87D05

8C6DPDM

0.006

0.79x2.173739

ADG801

8YD60E04

8C6MDPTM

0.1

1.14x2.18

100

ADG802

8YD60E07

8C6MDPTM

0.1

1.14x2.18

100AD7814CHIPS

8YB87D05

8C6DPDM

0.006

0.79x2.173739

DAC8420

8YH94B

8H6DPDMPNRBX

0.255

2.87x2.85

AD5726

8YH94B

8H6DPDMPNRBX

0.255

2.87x2.85

AD7888MCPCHIPS

8YC54C

8C6DPDM

0.01651.70x2.05

DAC8043A

8YJ19C/8YJ19A

8H6DPDMPNRB

0.05

1.09x0.91

DAC8043

8YJ19C/8YJ19A

8H6DPDMPNRB

0.05

1.09x0.91

AD5441

8YJ19C/8YJ19A

8H6DPDMPNRB

0.05

1.09x0.91

ADG3300

8YF58C01

8C6DPTM

0.001

1.61x2.01

Page 27 of 29

3009

1100

Reliability Report: 6396
ADG3308

8YF58C

8C6DPTM

0.001

1.61x2.01

1100

ADG3304

8YF58D02

8C6DPTM

0.001

1.61x2.01

1100

AD7414-0/-1/AD7415

8YC55D

8C6DPDM

0.006

0.79x0.875084

AD7414-2/-3

8YC55D01

8C6DPDM

0.006

0.79x0.875084

AD8668

8YH08C

8H6DPDMRI

0.096

1.85x2.49

1829

ADG715

8YC46D07

8C6MDPDM

0.072

1.29x2.01

1100

ADG884

8YF71D/8YF71E

8C6MDPTM.256

1.50 x 2.02

202

ADM1170-1

8YG69G01

8H6DPTMPNLR

0.012

0.79x2.29

5000

ADM1170-2

8YG69G01

8H6DPTMPNLR

0.012

0.79x2.29

5000

ADM1171-1

8YG69G01

8H6DPTMPNLR

0.012

0.79x2.29

5000

ADM1171-2

8YG69G01

8H6DPTMPNLR

0.012

0.79x2.29

5000

ADM1172-1

8YG69G01

8H6DPTMPNLR

0.012

0.79x2.29

5000

ADM1172-2

8YG69G01

8H6DPTMPNLR

0.012

0.79x2.29

5000

ADM4210-1

8YG69G01

8H6DPTMPNLR

0.012

0.79x2.29

5000

ADM4210-2

8YG69G01

8H6DPTMPNLR

0.012

0.79x2.29

5000

ADM6819

8YG69G02

8H6DPTMPNLR

0.012

0.79x2.29

5000

ADM6820

8YG69G02

8H6DPTMPNLR

0.012

0.79x2.29

5000

ADP1821

8YF84E

8S6DPDMRN

0.500

1.32x1.58

2657

ADP1822

8YF84E

8S6DPDMRN

0.500

1.32x1.58

2657

AD5405

8YF11D

8C6MDPDMR

0.014

1.99x2.27

3760

ADG3304 WLCSP

8YF58D02

8C6DPTM

0.001

1.61X2.01

1100

AD5415

8YF11D02/D03/D05/D01

8C6MDPDMR

0.014

1.99x2.27

3760

AD7992/3/4/7/8

8YF47C

8C6DPTMA

0.008

1.77x2.28-

ADM1170-1/-2

8YG69H01

8H6DPTMPNLR

0.012

0.79x2.29

5000

ADM1171-1/-2

8YG69H01

8H6DPTMPNLR

0.012

0.79x2.29

5000

ADM1172-1/-2

8YG69H01

8H6DPTMPNLR

0.012

0.79x2.29

5000

ADM4210-1/-2

8YG69H01

8H6DPTMPNLR

0.012

0.79x2.29

5000

ADM6819

8YG69H02

8H6DPTMPNLR

0.012

0.79x2.29

5000

ADM6820

8YG69H02

8H6DPTMPNLR

0.012

0.79x2.29

5000

ADG1434

8YH80B02

8H6DPTMI

0.050

2.445x2.445

200

ADG1408

8YH80B

8H6DPTMI

0.050

2.445x2.445

200

ADG1409

8YH80B01

8H6DPTMI

0.050

2.445x2.445

200

ADG1433

8YH80B03

8H6DPTMI

0.050

2.445x2.445

200

ADG1434

8YH80C04

8H6DPTMI

0.050

2.445x2.445

200

ADM4073F

8YG69H03

8H6DPTMPNLR

0.012

0.79x2.29

5000

ADM4073T

8YG69H05

8H6DPTMPNLR

0.012

0.79x2.29

5000

ADM4073H

8YG69H04

8H6DPTMPNLR

0.012

0.79x2.29

5000

AD8619

8YG70B01

8C6DPDMLX

0.001

1.42x1.67

553

ADG888 BUMPED

8YG37B

8C6MDPTM

0.360

2.00x2.00

329

AD8231

8YH98C

8H6DPDMLR

0.006

2.50x2.50

1700

ADG794

8YG84C

8C6MDPDM

0.001

0.87x1.08

52

ADG888

8YG37B

8C6MDPTM

0.360

2.00x2.00

329

AD5443

8YE84B

8C6MDPDMR

0.014

1.15x1.99

3481

Page 28 of 29

Reliability Report: 6396
AD5424

8YE84B

8C6MDPDMR

0.014

1.15x1.99

3481

AD5425

8YE84B

8C6MDPDMR

0.014

1.15x1.99

3481

AD5426

8YE84B

8C6MDPDMR

0.014

1.15x1.99

3481

AD5432

8YE84B

8C6MDPDMR

0.014

1.15x1.99

3481

AD5433

8YE84B

8C6MDPDMR

0.014

1.15x1.99

3481

AD5445

8YE84B

8C6MDPDMR

0.014

1.15x1.99

3481

ADR5040/1/3/4/5

8YH71C

8C6DPDMRX

0.050

0.76x0.871295

AD7817

8YA32G

8C6DPDM

0.010

1.62x2.05

4297

AD5628/48/66/68/78

8YG87D

8C6DPTMR

0.220

2.75x3.56

66389

ADG1208

8YG63C04

8H6DPTMI

0.200

1.34x1.33

200

Page 29 of 29