User guide
Current Transducer HMSR-SMS series

Ref: HMSR 6-SMS, HMSR 8-SMS, HMSR 10-SMS, HMSR 15-SMS,
HMSR 20-SMS, HMSR 30-SMS

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This document is a user guide for using HMSR series.
This document consists of following.

Table of Contents

1. General features ............................................................................3
2. Electrical characteristics ..............................................................5
2.1.

Temperature Drift ....................................................................................... 5

2.2.

di/dt ............................................................................................................ 6

2.3.

dv/dt ........................................................................................................... 6

2.4.

Electrical and thermal resistance ............................................................... 73. Guidelines of Board Design..........................................................83.1.

Analog output ............................................................................................. 8

3.1.1.

Measurement without using reference voltage Uref. ..................................... 83.1.2.

Measurement using reference voltage Uref .................................................... 93.2.

Over Current Detection, OCD .................................................................... 93.2.1.

The internal Over Current Detection, OCD_INT ............................................ 93.2.2.

The external Over Current Detection, OCD_EXT ........................................ 103.3.

Primary current path on PCB ................................................................... 113.3.1.

Footprint ..................................................................................................... 123.3.2.

Pin configuration ......................................................................................... 133.3.3.

Primary current path ................................................................................... 143.4.

Insulation design ...................................................................................... 153.5.

Thermal design and overcurrent capability............................................... 153.6.

External magnetic field guideline .............................................................. 164. Others...........................................................................................164.1.

Supply Voltage ......................................................................................... 164.2.

Soldering .................................................................................................. 174.3.

PCB design guidelines ............................................................................. 184.4.

Space saving ............................................................................................ 18

4.5.

Handling procedures ................................................................................ 18

4.6.

Standards ................................................................................................. 19200701/02 / 19

1. General features
HMSR is an open loop hall effect transducer having a miniature ferrite and a proprietary ASIC
(Figure 1) to allow direct current measurement and consistent insulation performance.
The ferrite used in the product is also a key factor in achieving a high-frequency bandwidth of
300 kHz (-3 dB) and makes it possible to achieve good rejection against external fields.
The product provides an accuracy across a range of temperatures, from -40 °C to +125 °C with atypical value of 1 % of IP N (the HMSR 20-SMS model).
Power conversion applications such as solar inverter or drives demand high efficiency levels andthese can be reached only if the control loop is accurate.
General features are given as follows:•

IP N = 6, 8, 10, 15, 20 or 30 A RMS as primary nominal current•

The measurement range (full scale) is given as IP N x 2.5 A pk•

The operating temperature range is given by -40 °C to +125 °C•

8 mm creepage and clearance distances with CTI 600•

The reinforced insulation by IEC 60950-1 (4.95 kV RMS as Insulation test voltage)•It withstands overload current bursts up to 20 kA (8-20 µs) when installed on a properly
designed Printed Circuit Board (PCB)•2 µs delay time•

SOIC16-like packaging footprint having 6 mm height for Surface Mounted Devices (SMD)
assembly

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3 / 19Figure 1 ASIC block diagram
Table 1 shows the product line up.
ProductUc (V)Range (A)Error (mV/A)

Uout typePackage

HMSR 6-SMS

5±15133.33

Fixed Uref

HMSR

HMSR 8-SMS

5±20100

Fixed Uref

HMSR

HMSR 10-SMS

5±2580

Fixed Uref

HMSR

HMSR 15-SMS

5±37.553.33

Fixed Uref

HMSR

HMSR 20-SMS

5±5040

Fixed Uref

HMSR

HMSR 30-SMS

5±7526.67

Fixed Uref

HMSR

Table 1 HMSR xx-SMS series

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2. Electrical characteristics
2.1. Temperature Drift

Within an overall temperature range from -40 °C to +125 °C, the typical measured current
accuracy of an HMSR 20-SMS is shown in Figure 2 (a).
The graph in Figure 2 (b) shows the linearity on the same temperature range.

(a)

(b)

Figure 2 Temperature drift of Total error and Linearity

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2.2. di/dt

The delay time to 10 % and the delay time to 90 % are respectively below 1.5 µs and2 µs. The typical measurement waveform is shown by Figure 3.

－: Primary Current－: Uout – Uref－: Uref

Figure 3 Step delay waveform

2.3. dv/dt

The following graphs (Figure 4) show the disturbance created by applying a ±1 kV
at 20 kV/µs dv/dt step between primary and secondary side of the sensor.
The error generated is 3 % of full scale with a recovery time of 3.8 µs.
dv/dt input
Uref

Uout - Uref

Figure 4 dv/dt waveform

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6 / 192.4. Electrical and thermal resistance

The electrical resistance of the primary conductor is 0.75 mΩ typical at 25 °C.
It has the same temperature coefficient as copper, α = 0.393 %/K.
The thermal resistance, junction to case is 18 K/W typical 1).
Figure 5 (a) show the position of the temperature sensor used for junction casemeasurement.

Figure 5 Temperature measurement positions (a)Note: 1) Done with LEM evaluation board PCB2325.

Figure 5 (b) show the nominal (thermal) current versus ambient temperature.

Figure 5 Nominal range versus Ambient Temperature (b)200701/0

7 / 193. Guidelines of Board Design
3.1. Analog output

Two examples of external circuit with or without using reference voltage are presentedhereunder.
Whenever possible LEM recommends using Uref in combination with Uout (3.1.2).

3.1.1. Measurement without using reference voltage Uref.

Recommended circuit without using reference voltage Uref is given inFigure 6.
Bypass capacitor should be placed close to Uc, Uout and Uref pins. Uref is set tobe “OPEN”.
Other non-connected pins are set to be either “OPEN” or “GND connection”
depending on the application.
For more specific recommendations, please call your LEM sales contact.
The traces from Uc and Uout pins are recommended to be wide, short andsurrounded by the ground plane to reduce the influence of switching noises
from the power lines.

Figure 6 Circuit recommendation (a)200701/0

8 / 193.1.2. Measurement using reference voltage Uref

Recommended circuit using reference voltage Uref is given in Figure 7.
Bypass capacitor should be placed close to Uc, Uout and Uref pins.
The traces from Uc and Uout pins are recommended to be wide, short andsurrounded by the ground plane to reduce the influence of switching noises
from the power lines.

Figure 7 Circuit recommendation (b)3.2. Over Current Detection, OCD

This function provides an over-current event signal by OCD_INT and OCD_EXT pins.

3.2.1. The internal Over Current Detection, OCD_INT

The internal threshold level of OCD_INT is set to 2.75 x IP N with +/-10 %accuracy of the HMSR. Although, the threshold level of OCD_INT, 2.75 x IP N,is above the measuring range of HMSR, the over current can be stilldetected.
The OCD_INT signal is separated from the main current measurement signalof Uout.
The OCD_INT signal provides the same behavior as OCD_EXT withovercurrent duration time of 1.7 µs instead of 10 µs.

200701/0

9 / 193.2.2. The external Over Current Detection, OCD_EXT

An external overcurrent detection, OCD_EXT, can be set with resistors
divider on UE OCD pin (16). Refer to following formulas (2) and (3) andFigure 8 (a) for external OCD threshold at Uref = 2.5V, setting with
0.3 ≤ UE OCD ≤ Uref.

𝐼𝐼E OCD =1000×(𝑈𝑈𝑟𝑟𝑟𝑟𝑟𝑟 −𝑈𝑈E OCD )𝑅𝑅𝑈𝑈E OCD = 𝑅𝑅 +𝑅𝑅𝐸𝐸
𝐸𝐸

𝐺𝐺𝑡𝑡ℎ𝑟𝑟𝑟𝑟𝑟𝑟(2)

× 𝑈𝑈𝑟𝑟𝑟𝑟𝑟𝑟 (3)When the duration of the overcurrent is detected for more than 10 µs, theOCD_EXT signal turns on, switching from a high (Uc) to a low level (0 V).
The signal holds while primary current is higher than the threshold level asshown in Figure 8 (b).
If the overcurrent duration is less than 20 µs, a 10 µs overcurrent signal holdtime is maintained as shown in Figure 8 (c).
If the duration of the overcurrent is below 10 µs, the OCD_EXT does not turnon Figure 8 (d).
The detection accuracy is +/-6 %.

Figure 8 OCD_EXT threshold (a)200701/0

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Figure 8 Typical waveform of overcurrent detection OCD_EXT (b-c-d)3.3. Primary current path on PCB

The primary conductor paths should be at the same time wide to conduct maximum
current and as short as possible between source and load in order to minimize theresistance of primary conductor.
Higher conductor resistance will cause Joule heating of the overall primary circuit of thecurrent transducer.

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3.3.1. Footprint

Recommended soldering pad layout is given in Figure 9.

Figure 9 Recommended soldering pad layout
Dual landing PCB layout is possible with satisfactory solderability for both HMSR and SOIC
16 lead equivalent.
LEM testing of HMSR and SOIC 16 on a LEM designed PCB passed all IPC-7351
Density Level B requirements for PCB’s with clearance distance of 8 mm.
For more information, PCB drawings, and a detailed report, please contact your LEM sales
person.

HMSRSO16

Alternative dual landing soldering pad layout is given in Figure 9a.

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3.3.2. Pin configuration
Pin configuration is given in Figure 10 and Table 2.

Figure 10 Pin configuration

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Table 2 Pin connection of HMSR xx-SMS

Note: when the OCD function is not used, the OCD_INT (pin 9), UE OCD (pin 16), andOCD_EXT (pin 14) pins are either "OPEN" or "GND connection" is OK.

3.3.3. Primary current path

Recommended primary current paths are presented below.
The straight current carrying path from right to left is shown in the Figure 11(a). If this current path cannot be realized due to board layout constraints, thepath having an opposite direction of the secondary pins, as shown inFigure 11 (b) is recommended.
The layout shown in Figure 12 in not recommended as this may degrade thesystem isolation characteristics.
Likewise, it is not recommended to have the current-carrying paths
underneath the current transducer.
Besides potential isolation issues, the output could be influenced magneticfields generated by primary current.

(a) Straight path(b) Away from secondary side

Figure 11 Example of recommended primary current path designs

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Figure 12 Example of a not recommended primary current path design

3.4. Insulation design

The internal distance between primary and secondary sides of the transducer helps toinsulate the primary bar from the rest of the IC.
The insulation level is 100 % test to 4.95 kV RMS, in accordance with IEC 60950-1: 2005.
The footprint of the HMSR design allows 8 mm of creepage and clearance distances
between the opposed primary and secondary landing pads.

3.5. Thermal design and overcurrent capability

The HMSR is designed to can carry 30 A RMS continuous current.
The transducer can also withstand surge currents up to 20 kA, while maintaining both
functionality and insulation.
This surge current capability simulates the equivalent of a lightning strike and the HMSR
mounted on a LEM designed test PCB has been tested to this level in accordance with theIEC 600060-1 standard 8/20 µs surge test profile, Figure 13.

Figure 13 Typical overcurrent surge profile in solar applications

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3.6. External magnetic field guideline

The measurement values of HMSR output characteristics under a uniform external
magnetic field are given in Figure 14.
The output perturbation on the XYZ axes given in Figure 14 is measured data.

XYZ

Figure 14 Perturbation of the output by external magnetic field

4. Others
4.1. Supply Voltage

HMSR uses the FIX gain mode. For power supply voltage Uc = 5 V, HMSR has been
designed to resist external perturbation of the output signal, see Figure 15.
vrefvout(vout-vref)/vref
12%

5,0010%4,008%

3,006%

2,004%

1,002%-Time [arb unit]

Ratio (vout-vref)/vref [%]Voltage [V]vcc
6,000%

Figure 15 Uc and output voltages on fixed-sensitivity output transducer

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4.2. Soldering

HMSR is compliant with Pb free soldering profile of JEDEC J-STD-020 standard.
In considering the HMSR package (thickness > 2.5 mm and 350 < volume < 2000 mm3),
the peak profile temperature TP shall be 245 °C.
The profile is given in Figure 16.

Figure 16 Reflow soldering profile
Having a ferrite in the product, it is not recommended to solder using an IR (infrared)
reflow system.
The HMSR is best soldered either in a multizone reflow system (7 zones minimum) or avapor phase process where the ramp temperatures can be very accurately controlled.
When soldering the HMSR it is best to apply a slow ramp up and down especially throughthe 150 to 200 °C window while respecting the overall JEDEC process time.
Time at maximum reflow temperature TP should be minimized to what assures asatisfactory solder joint and in no case should exceed the maximum JEDEC
recommendation of 30 s.
LEM does not recommend reworking HMSR solder rejects.

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4.3. PCB design guidelines

In order to take advantage of the HMSR surge current capabilities, care should be taken
to design to also handle the surge current.
LEM recommends a 6-layer 105 µm thick copper PCB.
The board must include multiple vias especially around the primary pins in order totransfer the current and thermal energy into the lower layers of the PCB.
Care must also be given to avoid any solder voids during the mounting process as they
can create weakness that will fail during a surge current occurrence.
For more specific information, please call your LEM sales contact to obtain a Gerber filewith typical PCB design recommendations.

4.4. Space saving

In many applications, HMSR can be mounted directly onto a PCB like other SMD,
reducing manufacturing costs and providing much needed space-saving for challenging
product packaging environments.
For example, at 6 mm high, the HMSR offers space-saving in drive applications, making itideal for placing under a heatsink placed over an Intelligent Power Modules (IPMs), shownin Figure 17.

Figure 17 HMSR mounted with IPM

4.5. Handling procedures
Due to the insulative nature of the HMSR, care should be given during all operations anduse of the transducer to avoid contaminating the surfaces with foreign materials that could
be conductive.
Skin oil, pencil, or other conductive and or partially conductive materials can create anelectrical path over the outside of the package that can lead to a short circuit andpremature failure of the transducer.
Use of finger cots are recommended whenever handling the HMSR in a non-automatedmode.

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4.6. Standards

Following standard is certified to HMSR xx-SMS series.
•IEC 61800-5-1: 2007
Adjustable speed electrical power drive systems – Part 5-1: Safety requirements –Electrical, thermal and energy•

IEC 62109-1: 2010
Safety of power converters for use in photovoltaic power systems - Part 1: General
requirements•IEC 60950-1: 2005
Information technology equipment - Safety - Part 1: General requirements•UL1577
Standard for Optical Isolators

Disclaimer
All information included in this document are provided only to illustrate operation andapplication examples of the HMSR.
How this information is used in a specific design and/or application is the customer’sresponsibility.
LEM hereby disclaims any and all warranties and liabilities of any kind, including without
limitation, warranties of non-infringement of intellectual property rights of any third party.
Refer to HMSR-SMS dedicated webpage for more information.

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