Product/Process Change Notice - PCN 16_0234 Rev. B
Analog Devices, Inc. Three Technology Way Norwood, Massachusetts 02062-9106

This notice is to inform you of a change that will be made to certain ADI products (see Appendix A) that you may have purchased in thelast 2 years. Any inquiries or requests with this PCN (additional data or samples) must be sent to ADI within 30 days ofpublication date. ADI contact information is listed below.
Note: Revised fields are indicated by a red field name. See Appendix B for revision history.

PCN Title:
Publication Date:

Assembly Transfer to ASE Korea and Test Transfer to STATS ChipPAC Singapore ofSelect LFCSP Parts.
06-Feb-2017

Effectivity Date:

06-Feb-2017 (the earliest date that a customer could expect to receive changed material)

Revision Description:
Added CP-24-15 to POD attachment.

Description Of Change
ADI is transferring to subcontractor ASE Korea for assembly manufacturing and STATS ChipPAC Singapore for test manufacturing of select
LFCSP products.
ADI has qualified ASE Korea's BOM(Bill of Materials). The mold compound is changing from Sumitomo G770 to Sumitomo G700. Die attachepoxy is changing from Able8290 and Able3230 to EN4900GC for 5x5 LFCSP devices. See BOM attachment for details.
The package outline exposed pad dimensions are changing for 3x3mm 8LD/16LD, 4x4mm 16LD/20LD/24LD, 5x5mm 28LD/32LD. See POD
attachment for details.
Reason For Change
ADI's current Assembly and Test supplier STATS ChipPAC China is relocating their factory by end of September 2017.
In this regard, the affected products currently assembled and tested in that facility will be transferred to new Assembly and Test site toensure continuous supply of products.
ADI's assembly subcontractors manufacture products using Analog Devices specified manufacturing flows, materials, process controls andmonitors, ensuring the same level of quality and reliability on products they receive from the new site.
Impact of the change (positive or negative) on fit, form, function & reliability
There will be no impact on the form, fit, function and reliability of the devices.

Product Identification (this section will describe how to identify the changed material)
The parts that will be assembled and tested from the new site will be identified by assembly lot and the country of origin.

Summary of Supporting Information
Qualification has been performed per ADI0012, Procedure for Qualification of New or Revised Processes. See attached Qualification Results
Summary. Test correlation and validation has been performed per ADI's standard product site to site change correlation procedure. See
attached Test Correlation Report.
Comments
During transition to new assembly and/or Test Site, products will be Assembled/or Tested from either current or new Assembly and/or Test
Site. The customers may receive products that are assembled at AEK & tested at SCC and/or assembled at SCC & tested at STA.
Applies for all packing/reel options.

Analog Devices, Inc. PCN 16_0234_Rev_B Page 1 of 4

Supporting Documents
Attachment 1: Type: Qualification Results Summary
ADI_PCN_16_0234_Rev_B_Qual Results Summary for LFCSP.pdf
Attachment 2: Type: Detailed Change Description
ADI_PCN_16_0234_Rev_B_BOM Change Description.pptx
Attachment 3: Type: Detailed Change Description
ADI_PCN_16_0234_Rev_B_POD Change Description.pptx
Attachment 4: Type: Test Correlation Report
ADI_PCN_16_0234_Rev_B_TEST CORRELATION RESULT.xlsx
For questions on this PCN, please send an email to the regional contacts below or contact your local ADI sales representatives.
Americas:

PCN_Americas@analog.com

Europe:PCN_Europe@analog.com

Japan:
Rest of Asia:

Analog Devices, Inc. PCN 16_0234_Rev_B Page 2 of 4

PCN_Japan@analog.com
PCN_ROA@analog.com

Appendix A - Affected ADI Models
Existing Parts - Product Family / Model Number (78)AD7172-4 / AD7172-4BCPZ

AD7172-4 / AD7172-4BCPZ-RL

AD7172-4 / AD7172-4BCPZ-RL7

AD7195 / AD42/334Z-0RL

AD7195 / AD7195BCPZ

AD7195 / AD7195BCPZ-RL

AD7195 / AD7195BCPZ-RL7AD8659 / AD8659ACPZ-R7AD8659 / AD8659ACPZ-RL

ADA4084-2 / ADA4084-2ACPZ-R7ADA4084-2 / ADA4084-2ACPZ-RL

ADA4084-4 / ADA4084-4ACPZ-R7ADA4084-4 / ADA4084-4ACPZ-RL

ADA4528-1 / ADA4528-1ACPZ-R7ADA4528-1 / ADA4528-1ACPZ-RL

ADA4960-1 / ADA4960-1ACPZ-R7ADA4960-1 / ADA4960-1ACPZ-RL

ADD5211 / ADD5211ACPZ-R7ADD5211 / ADD5211ACPZ-RL

ADE7953 / ADE7953ACPZ

ADE7953 / ADE7953ACPZ-RL

ADE7978 / AD71162ACPZ-RL

ADE7978 / ADE7978ACPZ

ADE7978 / ADE7978ACPZ-RL

ADP1052 / ADP1052ACPZ-R7ADP1052 / ADP1052ACPZ-RL

ADP1828 / ADP1828ACPZ-R7ADP1851 / ADP1851ACPZ-R7ADP1853 / ADP1853ACPZ-R7ADP1876 / ADP1876ACPZ-R7ADP2164 / ADP2164ACPZ-1.0-R7ADP2164 / ADP2164ACPZ-1.2-R7ADP2164 / ADP2164ACPZ-1.5-R7ADP2164 / ADP2164ACPZ-1.8-R7ADP2164 / ADP2164ACPZ-2.5-R7ADP2164 / ADP2164ACPZ-3.3-R7ADP2164 / ADP2164ACPZ-R7ADP2165 / ADP2165ACPZ-1.0-R7ADP2165 / ADP2165ACPZ-1.2-R7ADP2165 / ADP2165ACPZ-1.5-R7ADP2165 / ADP2165ACPZ-1.8-R7ADP2165 / ADP2165ACPZ-2.5-R7ADP2165 / ADP2165ACPZ-3.3-R7ADP2165 / ADP2165ACPZ-R7ADP2166 / ADP2166ACPZ-1.0-R7ADP2166 / ADP2166ACPZ-1.2-R7ADP2166 / ADP2166ACPZ-1.5-R7ADP2166 / ADP2166ACPZ-1.8-R7ADP2166 / ADP2166ACPZ-2.5-R7ADP2166 / ADP2166ACPZ-3.3-R7ADP2166 / ADP2166ACPZ-R7ADP2311 / ADP2311ACPZ-1-R7ADP2311 / ADP2311ACPZ-2-R7ADP2311 / ADP2311ACPZ-3-R7ADP2311 / ADP2311ACPZ-4-R7ADP320 / ADP320ACPZ-110-R7ADP320 / ADP320ACPZ331815R7ADP322 / ADP322ACPZ-115-R7ADP322 / ADP322ACPZ-135-R7ADP322 / ADP322ACPZ-145-R7ADP322 / ADP322ACPZ-155-R7ADP322 / ADP322ACPZ-165-R7ADP322 / ADP322ACPZ-175-R7ADP322 / ADP322ACPZ-189-R7ADP5040 / ADP5040ACPZ-1-R7ADP5041 / ADP5041ACPZ-1-R7ADP5042 / ADP50420001CPZR

ADP5042 / ADP50420002CPZRADP5042 / ADP50420003CPZR

ADP5042 / ADP5042ACPZ-1-R7

ADP5042 / ADP5042ACPZ-2-R7

ADP5043 / ADP5043ACPZ-1-R7

ADP8866 / ADP8866ACPZ-R7

ADP8870 / ADP8870ACPZ-R7

SSM2602 / SSM2602CPZ-REEL

SSM2602 / SSM2602CPZ-REEL7

SSM2603 / SSM2603CPZ-REEL

SSM2603 / SSM2603CPZ-REEL7

Analog Devices, Inc. PCN 16_0234_Rev_B Page 3 of 4

Appendix B - Revision History
Rev

Publish Date

Effectivity Date

Rev Description

Rev. -

31-Oct-2016

31-Oct-2016

Initial Release

Rev. A

09-Dec-2016

09-Dec-2016

Updated with Test Correlation Results.

Rev. B

06-Feb-2017

06-Feb-2017

Added CP-24-15 to POD attachment.
Analog Devices, Inc.

DocId:3984 Parent DocId:None Layout Rev:7

Analog Devices, Inc. PCN 16_0234_Rev_B Page 4 of 4