EPO-TEK® H67MP
Technical Data Sheet
For Reference Only
Thermally Conductive Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:
Shelf Life- Syringe:

Recommended Cure: 150°C / 1 Hour

July 2019
IXSingle
N/A
2.00
28 Days
One year at -40°C
Six months at -40°C

NOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.
● Complies with the requirements of MIL-STD 883/Method 5011.

Product Description: EPO-TEK® H67-MP is a single component, thermally conductive epoxy for hybrid die and component attach. It
can also be used for semiconductor and high temperature ceramic and vacuum packaging.
Typical Properties: Cure condition: 150°C / 1 Hour
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 1 rpm:
Thixotropic Index:* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
Below Tg:
Above Tg:
Shore D Hardness:
Lap Shear @ 23°C:* Die Shear @ 23°C:
Degradation Temp:
Weight Loss:* @ 200°C:@ 250°C:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:* Ion Content:

White
Highly viscous paste
300,000-400,000
N/A≥ 90166884
1,522≥ 20350

cPs°C (Dynamic Cure: 20-300°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)
x 10-6 in/in°C
x 10-6 in/in°C
psi
Kg
°C

7,112 psi

* Particle Size:

0.48
0.71
1.22
< 300641,860< 200 ppm
87 ppm
≤ 20%%%°C (Intermittent)psiNa+:< 50 ppm
K+:< 50 ppmmicrons

ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:
Volume Resistivity @ 23°C:
Dielectric Constant (1KHz):
Dissipation Factor (1KHz):

0.5≥ 6 x 1013
4.92
0.004

W/mKOhm-cm

Cl-:
NH4+:

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® H67MP
Technical Data Sheet
For Reference Only
Thermally Conductive Epoxy

EPO-TEK® H67-MP Advantages & Suggested Application Notes:● A very high viscosity and thixotropic paste suitable for screen printing or manual handoperations.
● Performs exceptionally well as a die-attach for small chips such as GaAs, LEDs anddiodes, as well as SMDs.
● Capable of resisting 260°C green reflow process, low outgassing in hermetic lid-sealprocesses near 300°C, and organic burn-in up to 150°C/1000 hours storage.
● Complies with the requirements of MIL-STD 883/Method 5011. Yields low levels of water
extractable ions such as chlorides.
● Capable of JEDEC Level II die-attach packaging on die-paddles and lead-frames.
● Widely used epoxy; popular choice for non-silver-filled die-attach epoxies; optopackaging, hybrids, and many types of substrates including kovar, ceramic and BT.
● Available in different viscosity ranges – contact Technical Services attechserv@epotek.com for best recommendation.
● Can be used as nonconductive staking epoxy, in conjunction with EPO-TEK® H37-MP
for attaching SMDs to hybrid circuits.
● A lower temp cure alternative to EPO-TEK® H65-175MP.

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com