THC63LVD104C_Rev.2.21_E

THC63LVD104C
112MHz 30Bits COLOR LVDS Receiver
General DescriptionFeatures

The THC63LVD104C receiver is designed to support
pixel data transmission between Host and Flat Panel
Display from NTSC up to SXGA resolutions. The
THC63LVD104C converts the LVDS data streams
back into 35bits of CMOS/TTL data with the choiceof the rising edge or falling edge clock for theconvenience with a variety of LCD panel controllers.
At a transmit clock frequency of 112MHz, 30bits ofRGB data and 5bits of timing and control data
(HSYNC, VSYNC,DE,CNTL1,CNTL2) aretransmitted at an effective rate of 784Mbps per
LVDS channel. Using a 112MHz clock, the data
throughput is 490Mbytes per second

 Wide dot clock range: 8-112MHz suited for NTSC,VGA, SVGA, XGA, and SXGA PLL requires no external components





50% output clock duty cycle
TTL clock edge programmable
Power down modeLow power single 3.3V CMOS design
64pin TQFP
Backward compatible with THC63LVDF64x(18bits) / F84x(24bits)

 Pin compatible with THC63LVD104A Fail-safe for Open LVDS Input

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Pin Diagram

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Pin Name

Pin #Type

Description

RA+, RARB+, RB-50, 49
52, 51

LVDS INLVDS IN

RC+, RC-55, 54

LVDS IN

RD+, RD-60, 59

LVDS IN

RE+,RE-62, 61

LVDS IN

RCLK+, RCLK-57, 56

LVDS IN

RA6 ~ RA040,41,42,43,45,46,47

OUT

RB6 ~ RB0

32,33,34,35,36,38,39

OUT

RC6 ~ RC0

22,24,25,26,27,28,29

OUTRD6 ~ RD0

14,15,17,18,19,20,21

OUT

RE6 ~ RE0

6,7,8,10,11,12,13

OUT

TEST

2IN

PD

3IN

OE

4IN

H: Output enable (Normal operation). L:Output disable(all outputs are Hi-Z)

R/F

5IN

Output Clock Triggering Edge Select.
H: Rising edge, L: Falling edge

VCC

9,23,37,48

Power

Power Supply Pins for TTL outputs and digital circuitry.

CLKOUT

31

OUT

Clock out.

GND

1,16,30,44

GroundGround Pins for TTL outputs and digital circuitry.

LVCC

53

Power

Power Supply Pin for LVDS inputs.

LGND

58

GroundGround Pin for LVDS inputs.

PVCC64

PowerPower Supply Pin for PLL circuitry.

PGND

63GroundGround Pin for PLL circuitry.

LVDS Data In.

LVDS Clock In.

CMOS/TTL Data Outputs.

Test pin, must be “L” for normal operation.
H: Normal operation,
L: Power down (all outputs are “L”)

PD

R/F

OE

Data Outputs(Rxn)

CLKOUT

00

0001

Hi-Z
All 0Hi-Z
Fixed Low

010

Hi-Z

Hi-Z

01

1

All 0

Fixed Low

100

Hi-Z

Hi-Z

101

Data OutThe falling edge closer to the center of the data eye.

110Hi-Z

Hi-Z111Data Out

The rising edge closer to the center of the data eye.

** Rxnx = A,B,C,D,E
n = 0,1,2,3,4,5,6

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Absolute Maximum Ratings *1
Supply Voltage (VCC=VCC=LVCC=PVCC)-0.3V ~ +4.0V

CMOS/TTL Input Voltage-0.3V ~ (VCC + 0.3V)

CMOS/TTL Output Voltage-0.3V ~ (VCC + 0.3V)

LVDS Receiver Input Voltage-0.3V ~ (VCC + 0.3V)

Output Current-30mA ~ 30mA

Junction Temperature+125 C

Storage Temperature Range-55  C ~ +150 C

Reflow Peak Temperature / Time+260  C / 10sec.

Maximum Power Dissipation @+25 C

2.1W

Electrical Characteristics
CMOS/TTL DC Specifications
VCC =LVCC=PVCC= 3.0V ~ 3.6V, Ta = -20 C~ +85CSymbol

Parameter

VIH
VIL

High Level Input Voltage
Low Level Input Voltage

VOH

High Level Output Voltage

VOL

Low Level Output Voltage

IINC

Input Current

Conditions

IOH= -4mA (data)
IOH= -8mA (clock)
IOL= 4mA (data)
IOL= 8mA (clock)0V  VIN  VCCMin.

Typ.

Max.

Units

2.0
GND-

VCC
0.8

VV

2.4--V--0.4

V10

A

-LVDS Receiver DC Specifications
VCC =LVCC=PVCC= 3.0V ~ 3.6V, Ta = -20 C~ +85C
SymbolParameter

Conditions

VTH
VTL

Differential Input High Threshold
Differential Input Low Threshold

VIC= 1.2V
VIC= 1.2V-Input Current

VIN= 2.4V / 0V-IINL

VCC= 3.6V

Min. Typ.

Max.

Units-100 -100-mVmV30

A

1. “Absolute Maximum Ratings” are those values beyond which the safety of the device can not be guaranteed. They are
not meant to imply that the device should be operated at these limits. The tables of “Electrical Characteristics” specify
conditions for device operation.

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Supply Current
VCC =LVCC=PVCC= 3.0V ~ 3.6V, Ta = -20 C~ +85CSymbol

Parameter
Receiver Supply

IRCCW

fCLKOUT = 75MHz
fCLKOUT = 90MHz

CL=8pF,Vcc=3.6V,
Ta= -20  C ~ 85 C

fCLKOUT = 112MHz

CL=8pF,Vcc=3.6V,
Ta= -20  C ~70 C *Current(LVDS Full Toggle)

IRCCS

Conditions

Receiver Power Down
PD = L
Supply Current

Typ.

Max.

Units-

205236mAmA

280mA

25

A

-

*The trade-off between the output load and the ambient temperature exists so that the junction temperature does notexceed 125C.

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Output load limitation
The output load is limited so that the junction temperature does not exceed 125ºC.

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Switching Characteristics
VCC =LVCC=PVCC= 3.0V ~ 3.6V, Ta = -20 C ~+85C
SymbolParametertRCP

CLKOUT PeriodtRCH

CLKOUT High TimetRCL

CLKOUT Low TimetRS

TTL Data Setup to CLKOUTtRH

TTL Data Hold from CLKOUT

tTLH

TTL Low to High Transition TimetTHL

TTL High to Low Transition Time
Receiver

tSK

Min.
8.92

Typ.
T-T/2-

T/2

Max.
125.0-

Units
nsns-

ns-----

1.0

3.0

ns

1.0

3.0ns

CLKOUT=50MHz-100001000ps

Skew CLKOUT=75MHz-5500550psCLKOUT=90MHz-4000400ps

CLKOUT=112MHz-250

0250psMarginns4/7tRCP-1

ns

3/7tRCP-1

tRIP1

Input Data Position0-tSK

0+tSK

nstRIP0

Input Data Position1

T/7-tSK

T/7

T/7+tSK

nstRIP6

Input Data Position2

2T/7-tSK

2T/7

2T/7+tSK

nstRIP5

Input Data Position3

3T/7-tSK

3T/7

3T/7+tSK

nstRIP4

Input Data Position4

4T/7-tSK

4T/7

4T/7+tSK

nstRIP3

Input Data Position5

5T/7-tSK

5T/7

5T/7+tSK

nstRIP2

Input Data Position66T/7-tSK

6T/7

6T/7+tSKnstRPLL

Phase Lock Loop Set-10.0

mstRCDRCLK +/- to
CLKOUT Delay CLKOUT=75MHz

46.5

-52.5

nstRCIP

CLKIN Period

8.92-125.0ns

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Switching Characteristics

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AC Timing Diagram

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AC Timing Diagram

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Note1)Power On Sequence
Power on LVDS-Tx after THC63LVD104C.

2)Cable Connection and Disconnection
Don't connect and disconnect the LVDS cable, when the power is supplied to the system.

3)GND Connection
Connect the each GND of the PCB which LVDS-Tx and THC63LVD104C on it. It is better for EMI reduction toplace GND cable as close to LVDS cable as possible.

4)Multi Drop Connection
Multi drop connection is not recommended.

5)Asynchronous use
Asynchronous use such as following systems are not recommended.

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Package

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Notices and Requests
1.

The product specifications described in this material are subject to change without prior notice.

2.

The circuit diagrams described in this material are examples of the application which may not always apply to the customer’s
design. THine Electronics, Inc. (“THine”) is not responsible for possible errors and omissions in this material. Please noteeven if errors or omissions should be found in this material, THine may not be able to correct them immediately.

3.

This material contains THine’s copyright, know-how or other intellectual property rights. Copying, reverse-engineer ordisclosing to third parties the contents of this material without THine’s prior written permission is prohibited.

4.

THINE ACCEPTS NO LIABILITY FOR ANY DAMAGE OR LOSS IN CONNECTION WITH ANY DISPUTE
RELATING TO INTELLECTUAL PROPERTY RIGHTS BETWEEN THE USER AND ANY THIRD PARTY, ARISINGOUT OF THIS PRODUCT, EXCEPT FOR SUCH DAMAGE OR LOSS IN CONNECTION WITH DISPUTESSUCCESSFULLY PROVED BY THE USER THAT SUCH DISPUTES ARE DUE SOLELY TO THINE. NOTE,HOWEVER, EVEN IN THE AFOREMENTIONED CASE, THINE ACCEPTS NO LIABILITY FOR SUCH DAMAGE ORLOSS IF THE DISPUTE IS CAUSED BY THE USER’S INSTRUCTION.

5.

This product is not designed for applications that require extremely high-reliability/safety such as aerospace device, nuclearpower control device, or medical device related to critical care, excluding when this product is specified for automotive use byTHine and used it for that purpose. THine accepts no liability whatsoever for any damages, claims or losses arising out of theuses set forth above.

6.

Despite our utmost efforts to improve the quality and reliability of the product, faults will occur with a certain small
probability, which is inevitable to a semi-conductor product. Therefore, you are encouraged to have sufficiently fail-safe
design principles such as redundant or error preventive design applied to the use of the product so as not to have our productcause any social or public damage.

7.

This product may be permanently damaged and suffer from performance degradation or loss of mechanical functionality if
subjected to electrostatic charge exceeding capacity of the ESD (Electrostatic Discharge) protection circuitry. Safety earth
ground must be provided to anything in contact with the product, including any operator, floor, tester and soldering iron.

8.

Please note that this product is not designed to be radiation-proof.

9.

Testing and other quality control techniques are used to this product to the extent THine deems necessary to support warranty
for performance of this product. Except where mandated by applicable law or deemed necessary by THine based on the user’s
request, testing of all functions and performance of the product is not necessarily performed.

10. This product must be stored according to storage method which is specified in this specifications. THine accepts no liability
whatsoever for any damage or loss caused to the user due to any storage not according to above-mentioned method.
11. Customers are asked, if required, to judge by themselves if this product falls under the category of strategic goods under theForeign Exchange and Foreign Trade Act in Japan and the Export Administration Regulations in the United States of America
on export or transit of this product. This product is prohibited for the purpose of developing military modernization, including
the development of weapons of mass destruction (WMD), and the purpose of violating human rights.
12. The product or peripheral parts may be damaged by a surge in voltage over the absolute maximum ratings or malfunction, if
pins of the product are shorted by such as foreign substance. The damages may cause a smoking and ignition. Therefore, youare encouraged to implement safety measures by adding protection devices, such as fuses. THine accepts no liability
whatsoever for any damage or loss caused to the user due to use under a condition exceeding the limiting values.
13. All patents or pending patent applications, trademarks, copyrights, layout-design exploitation rights or other intellectual
property rights concerned with this product belong to THine or licensor(s) of THine. No license or right is granted to the user
for any intellectual property right or other proprietary right now or in the future owned by THine or THine’s licensor. The user
must enter into a license agreement with THine or THine’s licensor to be granted of such license or right.

THine Electronics, Inc.
https://www.thine.co.jp

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