Product/Process Change Notice - PCN 23_0268 Rev. Analog Devices, Inc. One Analog Way, Wilmington, MA 01887, USA

This notice is to inform you of a change that will be made to certain ADI products (see Appendix A) that you may have purchased in thelast 2 years. Any inquiries or requests with this PCN (additional data or samples) must be sent to ADI within 30 days ofpublication date. ADI contact information is listed below.

PCN Title:

Bond Wire Conversion and Mold Compound Change for ADSP-BF70x/BF70xW
Processors in 184-Ball BGA Package
23-Jan-2024

Publication Date:
Effectivity Date:
Revision Description:

26-Apr-2024 (the earliest date that a customer could expect to receive changed material)

Initial Release.

Description Of Change:
Change of bond wire material from Gold (Au) to Copper (Cu) and change of molding compound from Sumitomo G770LC to Kyocera
KE G1280TS.

Reason For Change:
Ensure continuity of supply in order to meet customer demand.

Impact of the change (positive or negative) on fit, form, function & reliability:
There is no change to form, fit, functionality or reliability.

Product Identification (this section will describe how to identify the changed material)
Change will be differentiated by date code.

Summary of Supporting Information:
Qualification has been performed per AEC-Q100, Stress Test Qualification for Integrated Circuits. See attached Qualification Results
Summary.

Supporting Documents
Attachment 1: Type: Qualification Results Summary
ADI_PCN_23_0268_Rev_-_Qualification Report.pdf...
Attachment 2: Type: Delta Qualification Matrix
ADI_PCN_23_0268_Rev_-_Delta-Qualification-Matrix-ZVEI-5_0_16.xlsm...
Attachment 3: Type: Detailed Change Description
ADI_PCN_23_0268_Rev_-_184-ball BGA Material Changes.pdf...
Note: If applicable, the device material declaration will be updated due to material change.

ADI Contact Information:
For questions on this PCN, please send an email to the regional contacts below or contact your local ADI sales representatives.

Americas:

Europe:Japan:

Analog Devices, Inc. PCN 23_0268_Rev_- Page 1 of 4

Rest of Asia:PCN_Americas@analog.com

PCN_Europe@analog.com

PCN_Japan@analog.com

Analog Devices, Inc. PCN 23_0268_Rev_- Page 2 of 4

PCN_ROA@analog.com

Appendix A - Affected ADI Models:Added Parts On This Revision - Product Family / Model Number (26)
ADSP-BF701 / ADSP-BF701BBCZ-2ADSP-BF701 / ADSP-BF701KBCZ-1ADSP-BF701 / ADSP-BF701KBCZ-2ADSP-BF703 / ADSP-BF703BBCZ-4ADSP-BF703 / ADSP-BF703KBCZ-3ADSP-BF703 / ADSP-BF703KBCZ-4ADSP-BF701W-11 /ADBF701WCBCZ211
ADSP-BF703W-11 /ADBF703WCBCZ311

ADSP-BF705 / ADSP-BF705BBCZ-3ADSP-BF705 / ADSP-BF705BBCZ-4ADSP-BF705 / ADSP-BF705KBCZ-3ADSP-BF705 / ADSP-BF705KBCZ-4ADSP-BF703W-11 /ADBF703WCBCZ411ADSP-BF705W-11 /ADBF705WCBCZ311

ADSP-BF705W-11 /ADBF705WCBCZ411

ADSP-BF707 / ADSP-BF707BBCZ-3ADSP-BF707 / ADSP-BF707BBCZ-4ADSP-BF707 / ADSP-BF707BBCZ-4RL

ADSP-BF707 / ADSP-BF707KBCZ-3ADSP-BF707 / ADSP-BF707KBCZ-4ADSP-BF707 / ADSPBF707BBCZ4EGE

ADSP-BF707W-11 /ADBF707WCBCZ311

ADSP-BF707W-11 /ADBF707WCBCZ411

ADSW4000 / ADSW4000-P

ADSW4000 / ADSW4000-Y

Analog Devices, Inc. PCN 23_0268_Rev_- Page 3 of 4

ADSP-BF703 / ADSP-BF703BBCZ-3

Appendix B - Revision History:
RevRev. -Publish Date Effectivity Date
23-Jan-2024 26-Apr-2024 Initial Release.

Rev Description

Analog Devices, Inc. PCN 23_0268_Rev_- Page 4 of 4