THTVS321_Rev.1.00_E

THTVS321
Transient Voltage Suppressor for I/O protection

General Description

Features

THine THTVS Transient Voltage Suppressor family
is designed to protect sensitive interconnect I/O fromovervoltage caused by ESD (Electrostatic discharge),
CDE (Cable Discharge Events) and EFT (Electricalfast transients).

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The THTVS321 single-channel TVS is low
capacitance ESD protection device which designed
to protect sensitive CML, PECL LVDS physicallayer for ASIC, FPGA, SOC, ASSP and Display
port ,HDMI , PCIe and USB3.0 standard I/O.

ESD protection IEC 61000-4-2(ESD)±8kV(contact), ±15kV(Air)Ultra-small package
Protect one line
Low capacitance: 0.17pF Typ
Low dynamic resistance: 0.18 Ohm typ
Operating voltage: Vrwm 3.6V
Two pin package (0.6 x 0.3 x 0.25mm)
Packaging: Tape and ReelApplications

The THTVS321 have extra small capacitance of
0.17pF (Typ) and working voltage of 3.6V Vrwm.
This allows to be used on circuits operating around
up to 10GHz with signal integrity. They may be used
to meet the ESD immunity requirements of IEC
61000- 4-2 Leve4.
The dynamic resistance is extremely low 0.18 Ohms(Typ) providing optimum protection of sensitive
circuits.
The THTVS321 is designed to protect a single-endlines. For differential lines, two THTVS321s will beemployed.
The THTVS321 is in a small 2-pin 0.6 x 0.3 x
0.25mm package. Low capacitance, small package,and high level of ESD protection will makes aflexible solution for high speed applications.

Applications for sensitive and high speed I/Oprotection as followed.
•••••••••

FPGA/SoC high Seed I/O.
CML/PECL/LVDS physical layer
HDMI/DVI/DisplayPortTM
PCI Express /eSATA
Thunderbolt3
USB3.0/3.1
V-by-One® HS
Sensitive Sensor I/OConnector and cable I/F

Schematic and package Diagram

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Pin Configuration

Package pin configuration (Top view)

Pin Description
Pin No12TypeII

Description
Input or Ground*1
Input or Ground*1*1: Ground must be tied to the PCB ground plane. Low impedance connection required.

Absolute Maximum Rating
Parameter

SymbolValueUnit

Peak Pulse Power (tp = 1.2/50µs)

PPk45W

Peak Pulse Current (tp = 1.2/50µs)

Ipp7A

ESD per IEC 61000-4-2 (Air)*1ESD per IEC 61000-4-2 (Contact)Notw

VESD+/- 15+/- 8kV

Operating Junction Temperature

TJ-40 to +85°C

Storage Temperature

TSTG-55 to +150°CNotes.
*1: Measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected
to ESD ground plane.

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Electrical Characteristics (Tj=25°C unless otherwise specified)Parameter

SymbolCondition

MinTypMax

Unit

Reverse Stand-Off Voltage

VRWM---

3.6

V

It = 1mA

5.5810V

Reverse Breakdown Voltage

VBR-40 to 85°C

Reverse Leakage Current

IR

VRWM = 3.6V

-

550nA

Holding Current

IH-50120-mA

tp=1.2/50μs(Voltage),8/20µs(Current)
Combination Waveform,
RS = 2Ω I pp = 7A

-

56.5

V-

3.3-

Clamping Voltage*2

VC

I=4A,

ESD Clamping Voltage*3
VC

tp=0.2/100ns(TLP)
I=16A,V-5.5-

tp=0.2/100ns(TLP)
Trigger Voltage*3

VTRIG

Tp=0.2/100ns(TLP)

-

9.4

-

V

Dynamic Resistance *4

RDYN

tp=0.2/100ns(TLP)

-0.18

-

ΩJunction CapacitanceCj

VR = 0V, f = 1MHz,

-

0.17

0.2

pF

Notes
*2 Measured using a 1.2/50us voltage, 8/20us current combination waveform, RS = 8 Ohms. Clamping is defined as the peakvoltage across the device after the device snaps back to a conducting state.
*3 Transmission Line Pulse Test (TLP) Settings tp = 100ns, tr = 0.2ns, TLP I and V averaging window: t1 = 70ns to t2 = 90ns.
*4 Dynamic resistance calculated from I TLP = 4A to I TLP = 16A

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Typical Characteristics
ESD Clamping (8kV Contact per IEC 61000-4-2)

ESD Clamping (-8kV Contact per IEC 61000-4-2)

TLP Characteristic (Positive Pulse)

Clamping Characteristic

Insertion Loss - S21

Capacitance vs. Reverse Voltage

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PackageDE

TOP VIEW

ASEATING
PLANE

aaa CCSIDE VIEW

A1e/2

R0.025TYPbLe
BOTTOM VIEW

Symbol
A
A1b
DEeL
aaa

Items
Mounting HeightStandoffTerminal Width
Body Length
Body Width
Pitch
Terminal Length
Coplanarity

Min.
0.235
0.000
0.200
0.580
0.280
0.140

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Nom.
Max.
0.250
0.265
0.010
0.050
0.220
0.240
0.600
0.620
0.300
0.320
0.355 BSC
0.160
0.180
0.08

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0.675
0.270

0.175(0.425)

Land Pattern

0.250
TOPTOP
VIEW
VIEW

Unit : mm(Note)
Please carefully consider your SMT conditions (Material of substrate, Solder Composition, Reflow Condition and so on), and adjusts
the Land Pattern at your own risk.

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Notices and Requests
1.

The product specifications described in this material are subject to change without prior notice.

2.

The circuit diagrams described in this material are examples of the application which may not always apply tothe customer’s design. THine Electronics, Inc. (“THine”) is not responsible for possible errors and omissions inthis material. Please note even if errors or omissions should be found in this material, THine may not be able tocorrect them immediately.

3.

This material contains THine’s copyright, know-how or other intellectual property rights. Copying, reverseengineer or disclosing to third parties the contents of this material without THine’s prior written permission isprohibited.

4.

THINE ACCEPTS NO LIABILITY FOR ANY DAMAGE OR LOSS IN CONNECTION WITH ANYDISPUTE RELATING TO INTELLECTUAL PROPERTY RIGHTS BETWEEN THE USER AND ANY
THIRD PARTY, ARISING OUT OF THIS PRODUCT, EXCEPT FOR SUCH DAMAGE OR LOSS INCONNECTION WITH DISPUTES SUCCESSFULLY PROVED BY THE USER THAT SUCH DISPUTESARE DUE SOLELY TO THINE. NOTE, HOWEVER, EVEN IN THE AFOREMENTIONED CASE, THINEACCEPTS NO LIABILITY FOR SUCH DAMAGE OR LOSS IF THE DISPUTE IS CAUSED BY THE
USER’S INSTRUCTION.

5.

This product is not designed for applications that require extremely high-reliability/safety such as aerospacedevice, nuclear power control device, or medical device related to critical care, excluding when this product is
specified for automotive use by THine and used it for that purpose. THine accepts no liability whatsoever for
any damages, claims or losses arising out of the uses set forth above.

6.

Despite our utmost efforts to improve the quality and reliability of the product, faults will occur with a certain
small probability, which is inevitable to a semi-conductor product. Therefore, you are encouraged to havesufficiently fail-safe design principles such as redundant or error preventive design applied to the use of theproduct so as not to have our product cause any social or public damage.

7.

This product may be permanently damaged and suffer from performance degradation or loss of mechanicalfunctionality if subjected to electrostatic charge exceeding capacity of the ESD (Electrostatic Discharge)
protection circuitry. Safety earth ground must be provided to anything in contact with the product, including any
operator, floor, tester and soldering iron.

8.

Please note that this product is not designed to be radiation-proof.

9.

Testing and other quality control techniques are used to this product to the extent THine deems necessary tosupport warranty for performance of this product. Except where mandated by applicable law or deemednecessary by THine based on the user’s request, testing of all functions and performance of the product is notnecessarily performed.

10. This product must be stored according to storage method which is specified in this specifications. THine accepts
no liability whatsoever for any damage or loss caused to the user due to any storage not according to abovementioned method.
11. Customers are asked, if required, to judge by themselves if this product falls under the category of strategic
goods under the Foreign Exchange and Foreign Trade Act in Japan and the Export Administration Regulationsin the United States of America on export or transit of this product. This product is prohibited for the purpose

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of developing military modernization, including the development of weapons of mass destruction (WMD), andthe purpose of violating human rights.
12. The product or peripheral parts may be damaged by a surge in voltage over the absolute maximum ratings ormalfunction, if pins of the product are shorted by such as foreign substance. The damages may cause a smoking
and ignition. Therefore, you are encouraged to implement safety measures by adding protection devices, suchas fuses. THine accepts no liability whatsoever for any damage or loss caused to the user due to use under acondition exceeding the limiting values.
13. All patents or pending patent applications, trademarks, copyrights, layout-design exploitation rights or otherintellectual property rights concerned with this product belong to THine or licensor(s) of THine. No license orright is granted to the user for any intellectual property right or other proprietary right now or in the future owned
by THine or THine’s licensor. The user must enter into a license agreement with THine or THine’s licensor tobe granted of such license or right.

THine Electronics, Inc.
https://www.thine.co.jp

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