THAN0201_Rev.2.00_E

Application Note

THAN0201_Rev.2.00_E

THC63LVDM83D/THC63LVDF(R)84C
Application Note
System Diagram and PCB Design Guideline

Date2015/08/04
2015/10/21
2015/11/04

Copyright© 2015, THine Electronics, Inc.

Revision
Rev.1.00_E
Rev.1.10_E
Rev.2.00_E

1/10

THine Electronics, Inc.
Security E

THAN0201_Rev.2.00_E

Contents
Contents ..................................................................................................................................................................... 2
1. TTL Data Timing Diagram ................................................................................................................................ 3
2. LVDS Data Timing Diagram ............................................................................................................................. 4
3. Examples of System Diagrams .......................................................................................................................... 5
4. Note ................................................................................................................................................................... 8
5. PCB Design Guideline....................................................................................................................................... 9
Notices and Requests ............................................................................................................................................... 10

Copyright© 2015, THine Electronics, Inc.

2/10THine Electronics, Inc.
Security E

THAN0201_Rev.2.00_E

1. TTL Data Timing Diagram
Figure 1 and Table 1 shows the THC63LVDM83D TTL data input example for XGA(1024x768).

Figure 1. THC63LVDM83D TTL data timing diagram example (XGA, 1024x768)

Table 1. RGB ordering

MSB

6bit LSB
8bit LSB

Copyright© 2015, THine Electronics, Inc.

Red
R7R6R5R4R3R2R1R0GreenG7
G6G5G4G3G2G1
G03/10Blue
B7B6B5B4B3B2B1B0THine Electronics, Inc.
Security E

THAN0201_Rev.2.00_E

2. LVDS Data Timing Diagram

Figure 2. THC63LVDF(R)84C LVDS data input timing diagram

Table 2. THC63LVDM83D/THC63LVDF(R)84C Pixel Data Assignment (6bit, 8bit Application)
TA0
TA1TA2TA3
TA4
TA5
TA6TB0
TB1
TB2
TB3
TB4
TB5
TB6
TC0
TC1
TC2TC3TC4TC5
TC6
TD0
TD1
TD2
TD3TD4
TD5
TD66bit
R2
R3
R4
R5
R6
R7
G2
G3G4G5G6G7
B2B3B4B5B6B7Hsync
Vsync
DE-8bit
R2
R3
R4
R5R6
R7G2G3G4G5G6G7B2B3B4B5B6B7Hsync
Vsync
DER0
R1
G0
G1
B0
B1
N/A

Note: For 6bit application, use TA-TC channel and open TD+/- pin.

Copyright© 2015, THine Electronics, Inc.

4/10

THine Electronics, Inc.
Security E

THAN0201_Rev.2.00_E

3. Examples of System Diagrams
1) 8bit TTL/CMOS Input(8 to 112MHz)
Example:
THC63LVDM83D: Falling edge/Normal Swing
THC63LVDF84C: Falling edge

THC63LVDM83D

THC63LVDF84C*1: If RS pin is tied to VCC, LVDS swing is 350mV.
If RS pin is tied to GND, LVDS swing is 200mV.
*2: Connect each PCB GNDFigure 3. System Diagram Example (8bit TTL/CMOS Input)

Copyright© 2015, THine Electronics, Inc.

5/10

THine Electronics, Inc.
Security E

THAN0201_Rev.2.00_E2) 8bit Small Swing Input(8 to 112MHz)
Example:
THC63LVDM83D: Small Swing input/Falling edge
THC63LVDF84C: Falling edge

THC63LVDM83D

THC63LVDF84C*1: RS pin acts as VREF input pin when input voltage is set to half of high level signal input.

*2: Connect each PCB GND
Figure 4. System Diagram Example (8bit Small Swing Input)

Copyright© 2015, THine Electronics, Inc.

6/10

THine Electronics, Inc.
Security E

THAN0201_Rev.2.00_E

3) 6bit TTL/CMOS Input(8 to 112MHz)
Example:
THC63LVDM83D: Falling edge/Normal Swing
THC63LVDF84C: Falling edge

THC63LVDM83D

THC63LVDF84C*1: If RS pin is tied to VCC, LVDS swing is 350mV.
If RS pin is tied to GND, LVDS swing is 200mV.
*2: Connect each PCB GND
Figure 5. System Diagram Example (6bit TTL/CMOS Input)

Copyright© 2015, THine Electronics, Inc.

7/10

THine Electronics, Inc.
Security E

THAN0201_Rev.2.00_E

4. Note1) Power On Sequence
Power on THC63LVDM83D after THC63LVDF(R)84C is powered on.
2) Cable Connection and Disconnection
Don’t connect and disconnect the LVDS cable, when the power is supplied to the system.
3) GND Connection
Connect the each GND of the PCB which THC63LVDM83D and THC63LVDF(R)84C on it. It isbetter for EMI reduction to place GND cable as close to LVDS cable as possible.
4) Multi Drop Connection
Multi drop connection is not recommended.

Figure 6. Multi Drop Connection Example (not recommended)

5) Asynchronous Use
Asynchronous use such as following systems is not recommended.
CLKOUT

TCLK+

THC63LVDM83D

DATA

TCLK-

CLKOUTTCLK+

CLKOUT
LVDS-Rx

DATA
IC

IC

DATA

TCLK-

THC63LVDM83D

CLKOUT

RCLK+
LVDS-TxDATA

LVDS-RxDATA

CLKOUT

THC63LVDF84CDATA

RCLK-ICICRCLK+CLKOUT
LVDS-TxDATA

CLKOUT

RCLK-

DATA

THC63LVDF84C

TCLK+

THC63LVDM83D

DATA

TCLK-

CLKOUT

TCLK+

IC

IC

DATA

TCLK-

THC63LVDM83D

RCLK+

THC63LVDF84C

CLKOUT
DATA

RCLK-

IC

IC
RCLK+
RCLK-

THC63LVDF84C

DATA

Figure 7. Asynchronous Use Examples (not recommended)

Copyright© 2015, THine Electronics, Inc.

8/10

THine Electronics, Inc.
Security E

THAN0201_Rev.2.00_E

5. PCB Design Guideline
General Guideline• Use 4 layer PCB (minimum).
• Locate by-pass capacitors adjacent to the device pins as close as possible.
• Make the loop minimum which is consist of Power line and Gnd line.

LVDS Traces• Interconnecting media between Transmitter and Receiver (i.e. PCB trace, connector, and cable) should be wellbalanced.(Keep all these differential impedance and the length of media as same as possible.).

• Minimize the distance between traces of a pair (S1) to maximize common mode rejection. See following figure.
• Place adjacent LVDS trace pair at least twice (>2 x S1) as far away as much as possible.
• Avoid 90 degree bends.
• Minimize the number of VIA on LVDS traces.
• Match impedance of PCB trace, connector, media (cable) and termination to minimize reflections (emissions) forcabled applications (typically 100ohm differential mode characteristic impedance).

• Place Terminal Resister adjacent to the Receiver.

Figure 8. PCB Design Guideline

Copyright© 2015, THine Electronics, Inc.

9/10THine Electronics, Inc.
Security E

THAN0201_Rev.2.00_E

Notices and Requests
1. The product specifications described in this material are subject to change without prior notice.
2. The circuit diagrams described in this material are examples of the application which may not always apply tothe customer's design. We are not responsible for possible errors and omissions in this material. Please note iferrors or omissions should be found in this material, we may not be able to correct them immediately.
3. This material contains our copyright, know-how or other proprietary. Copying or disclosing to third parties thecontents of this material without our prior permission is prohibited.
4. Note that if infringement of any third party's industrial ownership should occur by using this product, we will
be exempted from the responsibility unless it directly relates to the production process or functions of theproduct.
5. Product Application 5.1 Application of this product is intended for and limited to the following applications:audio-video device, office automation device, communication device, consumer electronics, smartphone,feature phone, and amusement machine device. This product must not be used for applications that require
extremely high-reliability/safety such as aerospace device, traffic device, transportation device, nuclear power
control device, combustion chamber device, medical device related to critical care, or any kind of safety device.
5.2 This product is not intended to be used as an automotive part, unless the product is specified as a productconforming to the demands and specifications of ISO/TS16949 ("the Specified Product") in this data sheet.
THine Electronics, Inc. (“THine”) accepts no liability whatsoever for any product other than the SpecifiedProduct for it not conforming to the aforementioned demands and specifications. 5.3 THine accepts liability fordemands and specifications of the Specified Product only to the extent that the user and THine have beenpreviously and explicitly agreed to each other.
6. Despite our utmost efforts to improve the quality and reliability of the product, faults will occur with a certain
small probability, which is inevitable to a semi-conductor product. Therefore, you are encouraged to havesufficiently redundant or error preventive design applied to the use of the product so as not to have our productcause any social or public damage.
7. Please note that this product is not designed to be radiation-proof.
8. Testing and other quality control techniques are used to this product to the extent THine deems necessary tosupport warranty for performance of this product. Except where mandated by applicable law or deemednecessary by THine based on the user’s request, testing of all functions and performance of the product is notnecessarily performed.
9. Customers are asked, if required, to judge by themselves if this product falls under the category of strategic
goods under the Foreign Exchange and Foreign Trade Control Law.
10. The product or peripheral parts may be damaged by a surge in voltage over the absolute maximum ratings ormalfunction, if pins of the product are shorted by such as foreign substance. The damageｓ may cause asmoking and ignition. Therefore, you are encouraged to implement safety measures by adding protection
devices, such as fuses.

THine Electronics, Inc.
sales@thine.co.jp

Copyright© 2015, THine Electronics, Inc.

10/10

THine Electronics, Inc.
Security E