THCV2712_Rev.1.01_E

THCV2712
V-by-One® HS Distributor

General Description

FeaturesThe THCV2712 is a high performance 1:2 signal
distributor for V-by-One® HS with data rates up to
4Gbps and integrated 2:1 and 1:2 signal switcher
support bi-directional communication.
The THCV2712 features the distribution function
which duplicates a V-by-One® HS signal and theswitch function which changes the path of signals.
All configurations are supported by external pins.



Unidirectional Distribution
Bi-directional Switch (1:2 and 2:1)
Transmit VOD Control : 600 to 1300 mVp-p
Available in single supply voltage 3.3V withintegrated LDO
ESD: HBM ±4kV
QFN40 (5.0mm x 5.0mm)

Applications

All driver outputs and receiver inputs are internallyterminated which no require external components.

All V-by-One® HS applications such as Digital Signage
 Digital Blackboard
 Multi-Function Printer Production Printer Medical Imaging
 Machine Vision
 Image Sensor
 Camera

Block Diagram

AINP
AINN

Distribution / Switch

THCV2712
AOUTP0AOUTN0AOUTN1AOUTP1

BINP1

BOUTN

Switch

BINN1
BOUTP

BINN0
BINP0

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NC

MODE

NC

GND

NC

NC

NC

VCC33

VCC33

PD

Pin Configuration

30

29

28

27

26

25

24

23

22

21

VCC33

31

20

AOUTP0

AINP

32

19

AOUTN0

AINN

33

18

AOUTN1

VREG2534

17

AOUTP1

GND

35

16

VREG25

BOUTP

36

15

BINP1

BOUTN

37

14

BINN1

NC

38

13

BINN0

DRV

39

12

BINP0

GND

40

11

GND

1

2

3

4

5

6

7

8

9

10

GND

VCC33

VCC33

VREG15PATHSEL[1]PATHSEL[0]VREG25

VCC33

EQ

NC

(TOP View)
41 Exposed GND

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Pin Description
Pin Name
AINP
AINN
BOUTP
BOUTN
AOUTP1AOUTN1AOUTP0AOUTN0
BINP1
BINN1
BINP0
BINN0

Pin No
32
33
36
37
17
18
20
19
15
14
12
13

Type
CI
CI
CO
CO
CO
CO
CO
CO
CI
CI
CI
CI

PD

21

I

MODE

29

I

PATHSEL[1:0]
EQ
DRV
VREG15
VREG255,6
9
39
4
7,16,34
2,3,8,22,
23,31

I
3LI
3LI
PWR
PWR

VCC33
GND

1,11,27,
35,40,41

PWR
GND

Description
High-Speed CML Channel A (CHA) Signal Input
High-Speed CML Channel A (CHA) Signal Input
High-Speed CML Channel B (CHB) Signal Output
High-Speed CML Channel B (CHB) Signal Output
High-Speed CML Port 1 of CHA Signal Output
High-Speed CML Port 1 of CHA Signal Output
High-Speed CML Port 0 of CHA Signal Output
High-Speed CML Port 0 of CHA Signal Output
High-Speed CML Port 1 of CHB Signal Input
High-Speed CML Port 1 of CHB Signal Input
High-Speed CML Port 0 of CHB Signal Input
High-Speed CML Port 0 of CHB Signal Input
Power Down
0: Operation
1: Chip Power Down
Mode select0 : Distribution
1 : Switch
Select Switch Input / Output
Rx equalizer setting.
Tx output swing control
Decoupling Capacitor Pin for On-chip Regulator.
Decoupling Capacitor Pin, 2.5V output.
Power supply pin for on-chip regulator.
Ground. Must be tied to the PCB ground plane throughan array of vias.
Pin#41 is exposed pad ground.
Non-connection pin. Must be open.

10,24,25,
26,28,30,
NC
38
CI: CML Input buffer, CO: CML Output buffer
I: LVCMOS Input buffer, 3LI: 3-Level LVCMOS Input buffer,
PWR: Power supply, GND: Ground, NC: Non-connection pin
NC

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Operation Mode Settings
Table1 shows the operation mode setting.
Table 1. Operation Mode SettingPD
0
1

Pin Settings
MODE
PATHSEL[1:0]
0
11
01
1
10
IgnoreIgnoreOperation Mode
Distribution Mode
Switch Mode Port 0 Enable
Switch Mode Port 1 Enable
Chip Power Down.

Distribution Mode
MODE=0, PATHSEL[1:0]=11
AOUTP/N0
AINP/NAOUTP/N1

BINP/N1
BOUTP/N
BINP/N0

Switch Mode 0

Switch Mode 1

MODE=1, PATHSEL[1:0]=01

MODE=1, PATHSEL[1:0]=10
AOUTP/N0

AINP/NAOUTP/N0
AINP/NAOUTP/N1

AOUTP/N1

BINP/N1
BOUTP/N

BINP/N1
BOUTP/N

BINP/N0BINP/N0LOCKN/HTPDN signals are not be distributed and switched. The signals should be bypassed THCV2712.

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V-by-One
Rx1

HS

AOUTP0V-by-One
Tx1

HS
AINP

THCV2712

AINN

Distribution
Mode

LOCKN

LOCKN

AOUTN0AOUTN1
V-by-OneAOUTP1

HS

Rx2

LOCKN

Figure 1. LOCKN circuits in Distribution Mode

V-by-One
Rx1

HS

V-by-One
Tx1

BINP0

AOUTP0V-by-One
Tx1

V-by-One
Rx1

HS
AINP

THCV2712

AINN

SwitchMode

AOUTN0HS

LOCKN

AOUTN1LOCKNAOUTP1HS

V-by-One

HS

BOUTP

THCV2712

BOUT
N

Switch
Mode

BINN1

LOCKN

Rx2

LOCKN

BINN0

V-by-One
Tx2

BINP1

LOCKN

LOCKN

0

0

1

1

PATHSEL[1]PATHSEL[1](a) 1:2 Switch Function(b) 2:1 Switch Function

Figure 2. LOCKN circuits in Switch Mode

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HS

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Absolute Maximum Ratings
Table 2. Absolute Maximum Ratings
Parameter
Supply Voltage(VCC33)
LVCMOS Input Voltage
Level Control LVCMOS Input Voltage
3-Level LVCMOS Input Voltage
CML Receiver Input Voltage
CML Transmitter Output Voltage
HBM
ESD Rating
CDM
Storage Temperature
Junction Temperature
Reflow Peak Temperature/Time

Min
-0.3
-0.3
-0.3
-0.3
-0.3
-0.3
-55
-

Typ
-

Max
4.0
VCC33+0.3
VCC33+2.5
VCC33+0.3
3.0
3.0
±4
±500
125
125
260/10

Unit
V
V
V
V
V
V
kV
V
°C
°C
°C/sec

Max
3.6
50
85

Unit
V
ms
°C

Recommended Operating Conditions
Table 3. Recommended Operating Condition
Parameter
Supply Voltage(VCC33)
Supply Ramp Requirement
Operating Temperature

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Min
3.0
0.1
-40

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Typ
3.3
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THCV2712_Rev.1.01_E

Electrical Specification
LVCMOS DC Specification
Table 4. LVCMOS DC Specification
Over recommended operating supply and temperature range unless otherwise specified
Symbol
VIH
VIL
VOH
VOL

Parameter
High Level Input Voltage
Low Level Input Voltage
High Level Output Voltage
Low Level Output Voltage
Output Leak Current High in Hi-Z
State
Output Leak Current Low in
Hi-Z State

IOZH
IOZL

Condition
Ioh=-2mA
Iol=8mA

Min
2.0
0
2.4
0

Typ
-

Max
VCC33
0.7
VCC33
0.4

Unit
V
V
V
V

-

-15

-

15

uA

-

-15

-

15

uA

3-Level LVCMOS DC Specification
Table 5. 3-Level LVCMOS DC Specification
Over recommended operating supply and temperature range unless otherwise specified
SymbolVTHL
VTHH
IIH_3LIIL_3L

Parameter
Low-Level Threshold Voltage
High-Level Threshold Voltage
High Level Input Leak Current
Low Level Input Leak Current

Condition**
VIN=VCC33
VIN=GND

Min
0.42
1.25
-100
-100

Typ
0.83
1.67
-

Max
1.25
2.08
100
100

Unit
V
V
uA
uA

*Must be tied for setting each level
Low: Tie 1kΩ ±5% to GND
Float: Leave pin open
High: Tie 1kΩ ±5% to VCC33

Supply Current
Table 6. Supply Current
Over recommended operating supply and temperature range unless otherwise specified
SymbolICCW

ICCS

Parameter

Active Mode Supply Current

Power Down Supply Current

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Condition
PD=0,MODE=1
EQ=High
DRV=High
PD=0,MODE=1
EQ=Low
DRV=Low
PD=0,MODE=0
PD=1

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Min

Typ

Max

Unit

-

-

170

mA

-

90

-

mA

-

1.0

250
2.0

mA
mA

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THCV2712_Rev.1.01_E

Receiver DC/AC Specification
Table 7. Receiver DC/AC Specification
Over recommended operating supply and temperature range unless otherwise specified
Symbol
VRX-TH
VRX-TL
VRX-RIN
VRX-EQ-LOW
VRX-EQ-FLOAT
VRX-EQ-HIGH

Parameter
CML Differential Input High
Threshold
CML Differential Input Low
Threshold
CML Differential Input Resistance
Input Equalization@2GHz
Input Equalization@2GHz
Input Equalization@2GHz

Condition

EQ=Low
EQ=Float
EQ=High

Min

Typ

Max

Unit

-

-

50

mV

-50

-

-

mV

80
-

100
3.2
4.6
7.6

120
-

Ω
dB
dB
dB

Transmitter DC / AC specifications
Table 8. Transmitter DC / AC specification
Over recommended operating supply and temperature range unless otherwise specified
SymbolVTX-DIFF-PP-LOW
VTX-DIFF-PP-FLOQTVTX-DIFF-PP-HIGH
RTX-DIFF-DC
VTX-DC-CM
ITX-SHORTTACTIVETPOWERDOWN
TSKEW
TPROPAGATIONΔTPROPAGATIONTSWITCH

Parameter
Differential p-p Tx Voltage
Swing
Differential p-p Tx Voltage
Swing
Differential p-p Tx Voltage
Swing
DC Differential ImpedanceTransmitter DC Common-mode
VoltageTransmitter Short-circuit
Current Limit
PD Low to CML Output Delay
PD High to CML Output HighFix Delay
CML Output Inter-pair skew
Differential Propagation Delay
Delta Propagation Delay
Switching Time

Condition

Min

Typ

Max

DRV=Low

0.4

0.6

0.8

DRV=Float

0.8

1.0

1.2

DRV=High

1.0

1.3

1.6

-

80

100

120

Ω

-

-

1.9

-

V

-

-

20

60

mA

200

ns

10

ns

25
90
10

ps
ps
ps
ns

-

-

-

150
-

Unit

V

PD

AINP/NTACTIVE

AOUTP/N0

TPOWERDOWN
Fix to GND

Fix to GND
TPROPAGATIONAOUTP/N1

Fix to GND

Fix to GND
TSKEW

Figure 3 Power on Sequence (Distribution Mode)

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PD

PATHSEL[0]PATHSEL[1]AINP/NTACTIVETPOWERDOWN
Fix to REG25

AOUTP/N0

Fix to GND

Fix to GND
Invaild

TPROPAGATIONAOUTP/N1

Fix to REG25
Fix to GND

Fix to GND
Invaild

BINP/N0BINP/N1

BOUTP/NFix to GND

Fix to GND
Invaild

TSWITCH

Figure 4. Power on Sequence (Switch Mode)RX1

THCV2712
RX1

TX1

TX1

V-By-One HS
Transmitter

TPROPAGATION1

THCV2712
RX2

TX2

RX2

TX2

TPROPAGATION2
TPROPAGATION = | TPROPAGATION1 – TPROPAGATION2 |Figure 5. CML Propagation Delay Timing

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Package

Unit : mm
Figure 6. 40-pin QFN package physical dimension

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Notices and Requests
1.

The product specifications described in this material are subject to change without prior notice.

2.

The circuit diagrams described in this material are examples of the application which may not always apply to the customer’s
design. THine Electronics, Inc. (“THine”) is not responsible for possible errors and omissions in this material. Please noteeven if errors or omissions should be found in this material, THine may not be able to correct them immediately.

3.

This material contains THine’s copyright, know-how or other intellectual property rights. Copying, reverse-engineer ordisclosing to third parties the contents of this material without THine’s prior written permission is prohibited.

4.

THINE ACCEPTS NO LIABILITY FOR ANY DAMAGE OR LOSS IN CONNECTION WITH ANY DISPUTE
RELATING TO INTELLECTUAL PROPERTY RIGHTS BETWEEN THE USER AND ANY THIRD PARTY, ARISINGOUT OF THIS PRODUCT, EXCEPT FOR SUCH DAMAGE OR LOSS IN CONNECTION WITH DISPUTESSUCCESSFULLY PROVED BY THE USER THAT SUCH DISPUTES ARE DUE SOLELY TO THINE. NOTE,HOWEVER, EVEN IN THE AFOREMENTIONED CASE, THINE ACCEPTS NO LIABILITY FOR SUCH DAMAGE OR
LOSS IF THE DISPUTE IS CAUSED BY THE USER’S INSTRUCTION.

5.

This product is not designed for applications that require extremely high-reliability/safety such as aerospace device, nuclear
power control device, or medical device related to critical care, excluding when this product is specified for automotive use by
THine and used it for that purpose. THine accepts no liability whatsoever for any damages, claims or losses arising out of theuses set forth above.

6.

Despite our utmost efforts to improve the quality and reliability of the product, faults will occur with a certain small
probability, which is inevitable to a semi-conductor product. Therefore, you are encouraged to have sufficiently fail-safe
design principles such as redundant or error preventive design applied to the use of the product so as not to have our productcause any social or public damage.

7.

This product may be permanently damaged and suffer from performance degradation or loss of mechanical functionality if
subjected to electrostatic charge exceeding capacity of the ESD (Electrostatic Discharge) protection circuitry. Safety earth
ground must be provided to anything in contact with the product, including any operator, floor, tester and soldering iron.

8.

Please note that this product is not designed to be radiation-proof.

9.

Testing and other quality control techniques are used to this product to the extent THine deems necessary to support warranty
for performance of this product. Except where mandated by applicable law or deemed necessary by THine based on the user’s
request, testing of all functions and performance of the product is not necessarily performed.

10. This product must be stored according to storage method which is specified in this specifications. THine accepts no liability
whatsoever for any damage or loss caused to the user due to any storage not according to above-mentioned method.
11. Customers are asked, if required, to judge by themselves if this product falls under the category of strategic goods under theForeign Exchange and Foreign Trade Act in Japan and the Export Administration Regulations in the United States of America
on export or transit of this product. This product is prohibited for the purpose of developing military modernization, including
the development of weapons of mass destruction (WMD), and the purpose of violating human rights.
12. The product or peripheral parts may be damaged by a surge in voltage over the absolute maximum ratings or malfunction, if
pins of the product are shorted by such as foreign substance. The damages may cause a smoking and ignition. Therefore, youare encouraged to implement safety measures by adding protection devices, such as fuses. THine accepts no liability
whatsoever for any damage or loss caused to the user due to use under a condition exceeding the limiting values.
13. All patents or pending patent applications, trademarks, copyrights, layout-design exploitation rights or other intellectual
property rights concerned with this product belong to THine or licensor(s) of THine. No license or right is granted to the user
for any intellectual property right or other proprietary right now or in the future owned by THine or THine’s licensor. The user
must enter into a license agreement with THine or THine’s licensor to be granted of such license or right.

THine Electronics, Inc.
https://www.thine.co.jp

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