Product/Process Change Notice - PCN 10_0241 Rev. B
Analog Devices, Inc.

Three Technology Way Norwood, Massachusetts 02062-9106

This notice is to inform you of a change that will be made to certain ADI products (see Material Report). Any issues with this PCN orrequirements to qualify the change (additional data or samples) must be sent to ADI within 30 days of publication date. ADI contact information
is listed below.
Note: Revised fields are indicated by a red field name. See Appendix B for revision history.

PCN Title:
Publication Date:

Conversion of LFCSP package outline from Punch to Sawn of package sizes 4x4, 5x5,6x6 and 7x7mm and a transfer of assembly site.
07-Mar-2012

Effectivity Date:

05-Jun-2012 (the earliest date that a customer could expect to receive changed material)

Revision Description:
Add ADUC7020

Description Of Change
ADI has qualified and will be utilizing Assembly subcontractor STATS ChipPAC in Malaysia (SCM) for ADP5588, SSM2603, ADF4193, ADF7020 andADUC7020 LFSCP products. ADI has qualified SCM's standard bill of materials in a SAWN singulated leadframe. See attached for BOM changesand package outline differences.
Rev. B
Note: The parts from Rev- will maintain original effectivity date of 21-Apr-2011. Added parts will have the standard 90 day effectivity.
Reason For Change
Sawn LFCSP is ADI's technology direction for LFCSP. The use of ADI qualified SCM as an assembly site will ensure continued source of productsupply. ADI's assembly subcontractors manufacture our products using Analog Devices specified manufacturing flows, process controls andmonitors. This assures that our customers receive the same level of quality and reliability on products they receive from qualified ADI manufacturinglocations.
Impact of the change (positive or negative) on fit, form, function & reliability
The devices function and reliability as specified by the product datasheet will be unaffected by these changes. The Foot Print Dimension will remain
the same for both punch and sawn LFCSP package

Product Identification (this section will describe how to identify the changed material)
Malaysia will be the country of origin (laser marked on the package) for parts assembled at STATS ChipPAC.

Summary of Supporting Information
Qualification has been performed per ADI0012, Procedure for Qualification of New or Revised Processes. See attached Reliability Report.

Supporting Documents
Attachment 1: Type: Package Outline Drawing
ADI_PCN_10_0241_Rev_B_Punch to Sawn rev.pdf
Attachment 2: Type: Qualification Report Summary
ADI_PCN_10_0241_Rev_B_Qualification Results.pdf
Attachment 3: Type: Detailed Change Description

Analog Devices, Inc. PCN 10_0241_Rev_B Page 1 of 2

ADI_PCN_10_0241_Rev_B_LFCSP BOM.pdf
For questions on this PCN, send email to the regional contacts below or contact your local ADI sales representative
Americas:PCN_Americas@analog.com

Europe:PCN_Europe@analog.com

Japan:
Rest of Asia:

PCN_Japan@analog.com
PCN_ROA@analog.com

Appendix A - Affected ADI Models
Existing Parts - Product Family / Model Number (22)
ADF4193 / ADF4193BCPZ

ADF4193 / ADF4193BCPZ-RL

ADF4193 / ADF4193BCPZ-RL7

ADF4193 / ADF4193SP1BCPZ

ADF4193 / ADF4193SP1BCPZ-RL

ADF4193 / ADF4193SP1BCPZ-RL7

ADF4193 / ADF4193SP2BCPZ-RL7

ADF4193 / ADF4193SP3BCPZ-RL7

ADF4193 / ADF4193WCCPZ-U1ADF7020 / AD45203Z-RL

ADF7020 / AD57/002Z-0RL

ADF7020 / ADF7020BCPZ

ADF7020 / ADF7020BCPZ-RL

ADF7020 / ADF7020BCPZ-RL7

ADF7020-1 / ADF7020-1BCPZ

ADF7020-1 / ADF7020-1BCPZ-RL

ADF7020-1 / ADF7020-1BCPZ-RL7

ADP5588 / ADP5588ACPZ-R7

ADSP-BF537SSTD / ADSST-IP4010

SSM2603 / SSM2603CPZ-R2

SSM2603 / SSM2603CPZ-REEL

SSM2603 / SSM2603CPZ-REEL7

ADUC7020 / ADUC7020BCPZ62

ADUC7020 / ADUC7020BCPZ62-RL7

Added Parts On This Revision - Product Family / Model Number (6)ADUC7020 / ADUC7020BCPZ62I

ADUC7020 / ADUC7020BCPZ62I-RL

ADUC7020 / ADUC7020BCPZ62IRL7

ADUC7020 / ADUC7020SRTZRevPublish Date

Rev. Rev. A
Rev. B

21-Jan-2011
19-Sep-2011
07-Mar-2012

Appendix B - Revision History
Rev Description
Initial Release
Removal of ADUC7020 not changing.
Add ADUC7020
Analog Devices, Inc.

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