EPO-TEK® E2101
Technical Data Sheet
For Reference Only
Electrically Conductive, Silver Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:

September 2017
VIIITwo
3:1
Part A: 2.35
Part B: 4.58
5 Days
One year at room temperature

Recommended Cure: 150°C / 1 Hour
Minimum Alternative Cure(s):May not achieve performance properties listed below
175°C / 15 Minutes

NOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.

Product Description: EPO-TEK® E2101 is a two component, thixotropic, electrically conductive adhesive. It may be used for circuitassembly and semiconductor applications.
Typical Properties: Cure condition: 150°C / 1 Hour
Different batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 20 rpm:
Thixotropic Index:* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
Below Tg:
Above Tg:
Shore D Hardness:
Lap Shear @ 23°C:
Die Shear @ 23°C:Degradation Temp:
Weight Loss:@ 200°C:@ 250°C:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:
Ion Content:

Part A: Silver
Part B: Silver
Smooth thixotropic paste
15,000-18,000 cPs
3.9≥ 90 °C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)
48
192
68952
≥5401

x 10-6 in/in°C
x 10-6 in/in°C
psi
Kg°C

1,778 psi

* Particle Size:

0.37
0.61
0.90
< 300
1,052,430
27 ppm80 ppm
≤ 20%%%°C (Intermittent)psiNa+:
10 ppmK+:
1 ppm
microns

ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:* Volume Resistivity @ 23°C:

2.5≤ 0.0005

W/mKOhm-cm

Cl-:
NH4+:

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® E2101
Technical Data Sheet
For Reference OnlyElectrically Conductive, Silver Epoxy

EPO-TEK® E2101 Advantages & Suggested Application Notes:● Thixotropic paste allows for application by stencil or screen printing. SMD caps andresistors as small as the 0402 format have been mounted to PCB without silver bridging
between the 2 electrodes.
● Capable of adhering to PCB metals like Au, Cu, OSP / Cu, Ag, Ag-Pd.
● Used for making electrical connections to PZT electrodes in ink-jetting or medical /ultrasound applications.
● Suitable for low temperature flip chip packaging. “Bumps” of E2101 may be used insteadof Sn/Pb solder balls.
● Suited for high speed automated syringe dispensing techniques.
● Low flow, low resin bleedout on gold surfaces.
● Passes NASA low outgassing standard ASTM E595 with proper cure http://outgassing.nasa.gov/● JEDEC Level III and II semiconductor packaging material

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com