Report Title:

ADSP-2156x in BGA Automotive
Grade 2 Cu Wire Qualification

Report Number: 17053
Revision:

B

Date:

9 February 2023

Reliability Report: 17053

SummaryThis report documents the successful completion of the reliability qualification requirements
for the release of the ADSP-21566/21566W, ADSP-21567/21567W, ADSP-21569/21569W
Rev 0.2 product in a 400-CSP_BGA package with Cu wire at SK3. The ADSP-2156x are thenext generation SHARC DSP processor family.
This same ADSP-2156x Rev 0.2 family of products was previously released in a 400CSP_BGA package with Au wire per qual 16972.

Table 1: ADSP-2156x Product Characteristics
Die/FabDie Id

TMKK81 A

Die Size (mm)4.44 x 4.4

Wafer Fabrication Site
Wafer Fabrication Process
Approximate Transistor Count
Passivation Layer
Bond Pad Metal Composition

E_TSMC1512
CMOS
20.0 million
undoped-oxide/SiN
AlCu(0.5%)

Package/Assembly
Package

400-CSP_BGA

Body Size (mm)17.00 x 17.00 x 1.28

Assembly Location

STATS (SK3)

Solder Ball Diameter (mm)0.45

Solder Ball Pitch (mm)0.80

Molding Compound

Kyocera KE G2250HT-TU

Wire Type

PdCuAu 2N

Wire Diameter (mils)

0.8

Substrate Material

BT Resin / DS-7409HGB(G)

Solder Ball Composition

96.5Sn3Ag0.5Cu

Moisture Sensitivity Level

3Maximum Peak Reflow Temperature (°C)

260

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Reliability Report: 17053

Description / Results of Tests Performed
Tables 2 through 4 provide a description of the qualification tests conducted and the associatedtest results for products manufactured on the same technologies as described in Table 1. All
devices were electrically tested before and after each stress. Any device that did not meet allelectrical data sheet limits following stressing would be considered a valid (stress-attributable)
failure unless there was conclusive evidence to indicate otherwise.

Table 2: CSP_BGA at STATS (SK3) with Cu Wire Package
Qualification Test Results
SampleQty.
SizeFailures
Q17053.1.3
450High Temperature Storage Life
150°C, 1,000
ADSPJESD22-A103
Q17053.2.3
450(HTSL)2Hours
21569
Q17053.3.3
450
Q17053.1.2
770
Solder Heat ResistanceADSPJ-STD-020
MSL-3
Q17053.2.2
770(SHR) 1,221569
Q17053.3.2770
Q17053.1.2770
Temperature Cycling-55°C/+125°C, ADSPJESD22-A104
Q17053.2.2
770(TC) 1,22,000 Cycles
21569
Q17053.3.2
770Q17053.1.1
77085°C, 85%RH,Temperature Humidity BiasADSPJESD22-A101
Biased, 2,000
Q17053.2.1
770(THB) 1,221569
Hours
Q17053.3.1
7701 These samples were subjected to preconditioning (per J-STD-020 Level 3) prior to the start of the stress test. Level 3
preconditioning consists of the following: Bake: 24 hrs @ 125°C, Unbiased Soak: 192 hrs @ 30°C, 60%RH, Reflow:
3 passes through an oven with a peak temperature of 260°C.
Test Name

Specification

Conditions

DeviceLot #2 Units were tested pre and post stress and ambient and hot temperature

Table 3: ADSP-2156x CSP_BGA at STATS (SK3) with Au Wire Package
Qualification Test Results
SampleQty.
Size
Failures
Q13499.12
770130C 85%RH
Unbiased HASTJESD22-A118
33.3 psia,
ADSP-21569
Q13499.13
7701,2(UHST)
96 Hours
Q13499.32
7701 These samples were subjected to preconditioning (per J-STD-020 Level 3) prior to the start of the stress test. Level 3
preconditioning consists of the following: Bake: 24 hrs @ 125°C, Unbiased Soak: 192 hrs @ 30°C, 60%RH, Reflow:
3 passes through an oven with a peak temperature of 260°C.
Test Name

Specification

Conditions

DeviceLot #2 Pre- and post-stress electrical test was performed at room temperature.

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Reliability Report: 17053

Table 3: 28nm CMOS at TSMC Fab-15 Fab Qualification Test Results
Table 4: ADSP2156x CMOS at TSMC Fab-15
Qualification Test Results
Test NameHigh Temperature Operating Life(HTOL) 1,3
High Temperature Storage Life(HTSL) 1,2
Power and Temp Cycling(PTC)1,2

ADSP-21565
ADSP-21569

Q13499.1
Q13499.2
Q13499.3
Q16972.1.1
Q13566.14
Q13499.8

SampleSize
77777777
4545

Qty.
Failures000000ADSP-21565

Q16792.1.11

450

Specification

Conditions

Device

JESD22-A108

125°C<Tj<135°C,Biased,
1,000 Hours

ADSP-21569

JESD22-A103

150°C, 1,000 Hours

JESD22-A105-40°C/+105°C,
P1000

Lot #Q16972.1.14
115
Q16972.2.3
92
Q16972.3.3
164
Q16972.1.15
102
Q16972.1.19
39
Q16972.4.1
165
Q16972.5.2
148
Q16972.5.3
148
Q16972.5.1
114
Q16972.5.4
45
Early Life Failure Rate
AEC
Tj=125C, Biased,
ADSP-21569(ELFR) 2
Q100-008
48 Hours
Q16972.5.5
160
Q16972.5.6
160
Q16972.5.8
160
Q16972.5.7
160
Q16972.4.2
149
Q16972.3.4
104
Q16972.5.9
26
Q16972.3.5
93
Q16972.4.3
119
Q16972.4.4
154
1 These samples were subjected to preconditioning (per J-STD-020 Level 3) prior to the start of the stress test. Level 3
preconditioning consists of the following: Bake: 24 hrs @ 125°C, Unbiased Soak: 192 hrs @ 30°C, 60%RH, Reflow: 3passes through an oven with a peak temperature of 260°C.
2 Pre- and post-stress electrical test was performed at room and hot temperatures.
3 Pre- and post-stress electrical test was performed at room, hot, and cold temperatures.

Samples of the many devices manufactured with these package and process technologies arecontinuously undergoing reliability evaluation as part of the ADI Reliability Monitor Program.
Additional qualification data is available on Analog Devices' web site.

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ESD Test Results
The results of Human Body Model (HBM) and Field-Induced Charged Device Model(FICDM) ESD testing are summarized in Table 5. ADI measures ESD results using stringent
test procedures based on the specifications listed. Any comparison with another supplier's
results should ensure that the same ESD test procedures have been used. For further details,
please see the EOS/ESD chapter of the ADI Reliability Handbook (available via the 'Quality
and Reliability' link on Analog Devices' web site).

Table 5: ADSP-21569 ESD Test Results
ESD ModelPackage

ESD Test Spec

FICDM

400-CSP_BGAC Q100-011

HBM

400-CSP_BGA

ESDA/JEDEC JS-001-2011

RC Network

HighestPass Level

First FailLevel

Class1Ω, Cpkg

±750V

±1000VC2b±3000V±3500V

21.5kΩ,
100pF

Latch-Up Test Results
Three samples of the ADSP-21565, ADSP-21569 were latch-up tested at TA=105°C per
JEDEC Standard JESD78, Class II. All pins passed.
Passing Positive Current

Passing Negative Current

Passing Over-Voltage+200mA-200mA

2.842/5.205/2.37/1.185/1.582V

Approvals
Reliability Engineer: Carolyn Pipitone

Additional InformationData sheets and other additional information are available on Analog Devices' web site

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