TOKYO ELECTRON ANNUAL REPORT 2013

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CONTENTSCONTENTS

Financial Highlights

Business Overview

Top Message

Special Feature

Review of Operations
and Business Outlook

Corporate GovernanceFeatures — Technological Innovation in Pursuit of Growth
Feature 3: Technology Acquisitions

Corporate CitizenshipIntellectual Property

Financial Section

Corporate Data

Feature 1: Product Development / Feature 2: Research and Development

Feature 4: Manufacturing

Features: Technological Innovation in Pursuit of Growth
Feature 3: Technology Acquisitions

Timely Acquisitions to Seize Opportunities for GrowthTokyo Electron conducted four acquisi-products, helping us provide a wideit into a core business over the medium

global network and sales support capa-

entiated technologies. Going forward,

tions in 2012, each with distinct growth

range of solutions to meet the increas-

and long term.

bilities. Technological innovation moves

we will flexibly consider a wide range ofobjectives.

ingly complex needs of our customers.

As planned, Tokyo Electron is

at a rapid pace in the markets thatcollaboration, extending to M&A, with

Tokyo Electron secured next-genera-

We acquired U.S.-based FSI

advancing the integration of new

Tokyo Electron operates in, and it isother companies in order to achieve a

International to strengthen existing busi-

tion core technologies through theresources acquired via M&A with Tokyo

imperative to be the leader in develop-

profitable growth.

nesses. This addition will quickly

acquisition of Irish venture company

Electron’s own proprietary technology,

ing and commercializing superior, differ-improve the competitiveness of Tokyo

Magnetic Solutions, obtaining magnetic

Electron’s cleaning systems, one of the

field annealing technologies necessary

most important areas of our core semi-

for the production of a promising new

conductor production equipment busi-memory.

Kenji Washinoness, which we are targeting for

Corporate Director,
Executive V.P.,
Corporate Development Division,
ATS/FPD/PVE

expansion. The synergy of this acquisi-Oerlikon Solar to expand our field oftion has already begun to show.

operations. With this acquisition, Tokyo

We acquired the Swiss company

The acquisition of U.S.-based NEXX

Acquisition of FSI International

Acquisition of NEXX Systems

Expanding Tokyo Electron’s cleaning system business withStrengthening the lineup of advanced packaging products,

new complementary single wafer cleaning technology

a future growth driver

Existing TEL SystemsElectron made a full-fledged entry into

Systems expands Tokyo Electron’s

the photovoltaic panel production

lineup of wafer level packaging

equipment business, with plans to growBatch cleaning

EXPEDIUS™

FY2013: Corporate acquisitions for further growth

Objectives

Technologies acquired

Completion ofacquisition

Cleaning technology• Single wafer cleaning systems

FSI International, Inc.
(now TEL FSI, Inc.)

October 2012

Advanced packaging technology• Electrochemical deposition systems• Sputtering systems

NEXX Systems Inc.
(now TEL NEXX, Inc.)

May 2012

Obtaining next-generationcore technology inSPE business

MRAM manufacturing technology• Magnetic annealing systems

Magnetic Solutions Ltd.
(now TEL MagneticSolutions Ltd.)Entering newbusiness areas

Photovoltaic panel manufacturing
technology• Thin-film silicon photovoltaic panel
production equipment

Strengthening
SPE business

Single water cleaning
Stratus, Electrochemical Deposition System
CELLESTA™
Critical cleaning
Film stripping

ORION™
High-dosed resiststripping

Dry cleaning
Cu pillar

TSV Cu filling

By acquiring NEXX Systems, Tokyo Electron expanded its line-Certas™

up of TSV 3DI packaging technology with NEXX’s electro-December 2012

chemical deposition and sputtering systems for advanced

Physical cleaning

packaging.
TSV: through-silicon via

Oerlikon Solar AG(now TEL Solar AG)

Micro bump

NS300+
Scrubbersystem

November 2012ANTARES™
AerosolTokyo Electron will increase its competitiveness in single wafer
cleaning systems through the acquisition of FSI International.
FSI International boasts high-dosed resist stripping technology
with high temperature SPM process, an increasingly importanttechnology.