Development of silicon semiconductor
tracking devices for theHigh-Luminosity LHC experiment
Koji Nakamura (KEK)

21st Sep, 2018

TGSW 2018

1

Contents• Introduction– Motivation of High Luminosity LHC and Future collider– Schedule and design• Challenge of detector design– Requirement to the HL-LHC detector– Introduction of semiconductor tracking detector• Japan group development– Planar type fine pixel pitch detector– Future technology for the timing sensitive detector.

• Conclusion
21st Sep, 2018

TGSW 20182

Contents• Introduction– Motivation of High Luminosity LHC and Future collider– Schedule and design• Challenge of detector design– Requirement to the HL-LHC detector– Introduction of semiconductor tracking detector• Japan group development– Planar type fine pixel pitch detector– Future technology for the timing sensitive detector.

• Conclusion
21st Sep, 2018

TGSW 20183

Large Hadron Collider (LHC)
here
Jula mountains

CERN

LHC magnet
Geneva air port

27km proton-proton collider
Placed 100m under ground.
2010-2012 : 8TeV max.
2015: 13TeV

Down town Geneva
21st Sep, 2018

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4

LHC and ATLAS/CMS experiment
ATLAS

Lac Leman

Geneva Air port
CMS

Thanks to the operationof LHC, ATLAS & CMS recorded :5fb-1 7TeV data
20fb-1 8TeV data
145fb-1 13TeV data
27km

21st Sep, 2018

TGSW 2018

5LHC and ATLAS/CMS experiment
Great achievement :Higgs observation
Lac Leman

Geneva Air port

Thanks to the operationof LHC, ATLAS & CMS recorded :5fb-1 7TeV data
20fb-1 8TeV data
145fb-1 13TeV data
27km

21st Sep, 2018

Englert and Higgs

TGSW 2018

6Observation of Higgs couplings
τHWWb

Z

New result in 2018

Hb

21st Sep, 2018

HHτNew result in 2018

ZW

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H

7

Coupling

What we are now?
Coupling proportional
to the particle massThis is the evidence of“Higgs give the mass ofparticles”

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What we want to know next?
• “Vacuum”– “Vacuum” is nothing? Filled by Higgs boson?
– How Higgs boson/field condensed to the “Vacuum”?
– Need to determine/observe the shape of Higgs Potential.
Observe/measure “Higgs self coupling”.
HHH
H

interferencet

H
H• “Dark Matter/Energy”– We only know 4%. What’s the others?
– Beyond the Standard Model?
• Super Symmetry?
21st Sep, 2018

TGSW 20189Future Hadron Collider• Need “Higher Luminosity” and/or “Higher Energy”– High Luminosity LHC (HL-LHC)• 20 times more data than currently taken (~3000-4000fb-1)
RUNat1 2026RUN 2
RUN 3
RUN 4 RUN 5 RUN 6• Start25fb-1150fb-1
300fb-1

HL-LHC
Final Focusing Magnet (β*)
replaced (radiation damage) Replace all tracking det.
Energy 14TeV
Luminosity x2.5 (5x1034)

Energy 8->13TeV
Luminosity x2-2.5

Energy 13->14TeV?
Luminosity x1.2

4000fb-1

Now!
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Future Hadron Collider• Need “Higher Luminosity” and/or “Higher Energy”– High Luminosity LHC (HL-LHC)• 20 times more data than currently taken(~3000-4000fb-1)• Plan : Start at 2026

– High Energy LHC (HE-LHC)• Use Super Conducting Magnet with Higher
Magnetic field(16T)• 28TeV collider in the same tunnel as LHC.

– Future Circular Collider (FCC)• Use Super Conducting Magnet with Higher
Magnetic field(16T)• 100TeV collider with 100km tunnel at CERN.
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Contents• Introduction– Motivation of High Luminosity LHC and Future collider– Schedule and design• Challenge of detector design– Requirement to the HL-LHC detector– Introduction of semiconductor tracking detector• Japan group development– Planar type fine pixel pitch detector– Future technology for the timing sensitive detector.

• Conclusion
21st Sep, 2018

TGSW 201812

Technical Design Report for HL-LHC• Detector design forHigh Luminosity LHC
is almost final.
• Released 6
Technical DesignReports• Production for thesilicon detectors
start very soon.
• Getting ready formass production
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Challenge for Detector building• Design Luminosity of HL-LHC– Current LHC: L=2x1034cm-2s-1– HL-LHC : L=7x1034cm-2s-1

3-4 times higher

Number of Interaction per Crossing

10-60 interaction

21st Sep, 2018

TGSW 201814

Challenge for Detector building• Design Luminosity of HL-LHC– Current LHC: L=2x1034cm-2s-1– HL-LHC : L=7x1034cm-2s-1
Number of Interaction per Crossing

3-4 times higher

HL-LHC : 140 interaction per bunch crossing

10-60 interaction

Need to identify the primary vertices to reduce
Pileup oriented background21st Sep, 2018

TGSW 201815

Specification for Upgrade detector• Pixel size for charged particle detection– 5 times finer pixel size
– 50um x 50um or 25um x 100um

Current detector• Sensor thickness– Thinner sensor could reduce occupancy.
– 1st and 2nd layer 100um, the others 150um– Need 100um thickness to have enoughcharge (~7000 e-/h pair)

250um
50um

NewφZ
Pixel size
thicknessb-tagthickness

Pixel sizethickness
thickness

21st Sep, 2018TGSW 201816

Radiation environment• Expected radiation level for 4000fb-1– Non Ionizing Energy Loss (NIEL):• 3rd layer: 2.8x1015 neq /cm2 1st layer : 2.6x1016neq/cm2– Total Ionizing Dose (TID) :• 3rd layer : 1.6MGy 1st layer : 19.8MGy

21st Sep, 2018

TGSW 2018

Could replace detector
at the middle of runs.

17

Semiconductor tracking detector• Basic principle :– Backside is negative bias and n+ isground.
– Detect electron-hole pairs created byionizing energy loss from MIP particle.

• Strip detector– n+ can easily ground at the end ofstrip.
– Readout usually via “wire bonding”
strips to the readout ASIC.

AlSiO2e- hee- hhn+P-stop

p Bulk-V• Pixel detector (new technology)– Electrode placed two dimensionally.
– To ground all pixels, high resistivity
biasing grid is necessary.
– Readout ASIC is connected by “bumpbonding”.
21st Sep, 2018

TGSW 201818

Semiconductor tracking detector• Basic principle :– Backside is negative bias and n+ isground.
– Detect electron-hole pairs created byionizing energy loss from MIP particle.

• Strip detector– n+ can easily ground at the end ofstrip.
– Readout usually via “wire bonding”
strips to the readout ASIC.

AlSiO2e- hee- hh• Pixel detector (new technology)n+P-stop

p Bulk-V
4 chip module– Electrode placed two dimensionally.
– To ground all pixels, high resistivity
biasing grid is necessary.
– Readout ASIC is connected by “bumpbonding”.
Our development is together with Hamamatsu Photonics K.K (HPK)
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Contents• Introduction– Motivation of High Luminosity LHC and Future collider– Schedule and design• Challenge of detector design– Requirement to the HL-LHC detector– Introduction of semiconductor tracking detector• Japan group development– Planar type fine pixel pitch detector– Future technology for the timing sensitive detector.

• Conclusion
21st Sep, 2018

TGSW 201820

ATLAS Pixel Detector Upgrade• Japan group : Pixel Detector development
Target : 3rd – 5th layers– High Efficiency Sensor design– Readout ASIC and DAQ development– Sensor – ASIC attachment– Flex PCB design and assembly– Module loading to the support

StripPixel

Contributing to all steps
Build detector in Japan
Layer 2 + Layer 3 Demonstrator

1.6m
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ATLAS Pixel Detector Upgrade• Japan group : Pixel Detector development
Target : 3rd – 5th layers– High Efficiency Sensor design– Readout ASIC and DAQ development– Sensor – ASIC attachment– Flex PCB design and assembly– Module loading to the support

HPK: n+ in p type
Pixel Size : 50umx50um
Requirement :97% after irradiation(3x1015neq/cm2)

Planar type Pixel moduleReadout ASIC
Efficiency measurement at testbeam
Bump
Irradiation test by proton beam
Poly-Si
Bias-railAln+After irradiation >99% efficiency
n+SiO2eBee-hhh

P-stopP-bulk-V

21st Sep, 2018

TGSW 201822

ATLAS Pixel Detector Upgrade• Japan group : Pixel Detector development
Target : 3rd – 5th layers– High Efficiency Sensor design– Readout ASIC and DAQ development– Sensor – ASIC attachment– Flex PCB design and assembly– Module loading to the support
RD53 Collabration(ATLAS+CMS)
65nm CMOS process
20mm

HPK: n+ in p type
Pixel Size : 50umx50um
Requirement :97% after irradiation(3x1015neq/cm2)½ size prototype available
DAQ development with US-- 5.12Gbps / ASIC readout-- 400x384 pixel matrix-- Low noise (<100 e)

Planar type Pixel module
Readout ASIC
Poly-Sin+Bias-rail

Bump
Al

20mmn+

SiO2eBee-hhhP-stopP-bulk-V

21st Sep, 2018

TGSW 201823

ATLAS Pixel Detector Upgrade• Japan group : Pixel Detector development
Target : 3rd – 5th layers– High Efficiency Sensor design– Readout ASIC and DAQ development– Sensor – ASIC attachment– Flex PCB design and assembly– Module loading to the support
HPK Sensor

Readout ASIC(TSMC)

90Sr Source test (beginning)

Quad sensor
90Sr Source test (improved)
Bump bonding @ HPKSnAg solder bumpno flux / no support wafer
Thickness sensor/ASIC
150um/150um

Established in 2016
High production Yield
ready for mass production
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TGSW 201824

ATLAS Pixel Detector Upgrade• Japan group : Pixel Detector development
Target : 3rd – 5th layers– High Efficiency Sensor design– Readout ASIC and DAQ development– Sensor – ASIC attachment– Flex PCB design and assembly– Module loading to the support
HPK Sensor

Quad sensor

Development of Assembly jig
Radiation Tolerance test for Glue
Wire bonding

Module Flex
Japan

Readout ASIC
(TSMC)

Assembly jig

Japan
21st Sep, 2018

TGSW 201825

ATLAS Pixel Detector Upgrade• Japan group : Pixel Detector development
Target : 3rd – 5th layers– High Efficiency Sensor design– Readout ASIC and DAQ development– Sensor – ASIC attachment
Short Demonstrator– Flex PCB design and assembly– Module loading to the supportHPK Sensor

Quad sensor

Installation

Module Flex
Japanbending

Readout ASIC(TSMC)

Assembly jig

Japan
21st Sep, 2018

TGSW 201826

Signal readout and timing resolution• Current Pixel detector

signal– Amplifire and shaper are in ASIC
– Time over Threshold (ToT) based ADC• Considering readout speed(5Gbps/ASIC), one of
the best approach.
• Time walk require less than 25ns (1 clock) toidentify bunch of collision.

thresholdToT
40MHz

Hit information

w/ timing info.

– Once hit positions are obtained, reconstruct
track as the best chi-square combination ofhits.
• Timing information helps. 30ps ~ 1mm• Low Gain Avalanche Detector (LGAD)– Create High Electric Field to have hugemobility of e/h pairs.
– HPK device : ~30ps time resolution achieved!
21st Sep, 2018

TGSW 201827

Future application of LGAD detector• HL-LHC upgrade– Pad detector will be installed

21st Sep, 2018

TGSW 201828

Future application of LGAD detector• HL-LHC upgrade– Pad detector will be installed• Future improvement:①Better granularity :• The position detection.

Strip pitch : 80um

Developed strip detector②

Higher radiation tolerance• Inner tracking detector.

Positron Emission Tomography (PET)
Fludeoxyglucose(near cancer)①
Medical Usage(PET)

e+511keV γe-511keV γ

Hit information①+②• HEP Detector• Monitor of
Nuclear Reactor

21st Sep, 2018

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w/ timing info.

29

Conclusion

21st Sep, 2018

TGSW 201830

Conclusion
LHC

21st Sep, 2018

TGSW 201831

Conclusion
HL-LHC

LHC

Upgrading accelerator and detectors to see more physics

21st Sep, 2018

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Conclusion
HL-LHC

LHC

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ConclusionHL-LHC

LHC

21st Sep, 2018

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backup

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Challenge for Detector building• Design Luminosity of HL-LHC– Current LHC: L=2x1034cm-2s-1– HL-LHC : L=7x1034cm-2s-1
Number of Interaction per Crossing

3-4 times higher

HL-LHC : 140 interaction per bunch crossing
HL-LHC μ=140 @ 5e34

1. 210-60 interaction

1. 00. 8

HL-LHC++ μ=140 @ 5e34

0. 60. 4

ＬＨＣ μ=40 @ 0.7e34

0. 2z [m]0. 2

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0. 10.1

0. 236