Innovative
silicondetectorsfor
HL-LHC
Daniela Bortoletto
9/14/21

D. Bortoletto, TGSW 2021

1

Large Hadron Collider (LHC)CMSCMS

LHCb

ALICE
ALICE

ATLAS

ATLAS

LHCb

A 27km discovery machine colliding pp at 13 TeV

The Large Hadron Collider (LHC) is 27km
9/14/21

D. Bortoletto, TGSW 20212

Unprecedented discoveries: Higgs
2012
2013

2013

To François Englert and Peter W. Higgs "for the theoretical discovery of a mechanism that contributes to our understanding of the origin ofmass of subatomic particles, and which recently was confirmed through the discovery of the predicted fundamental particle, by the ATLAS and3
CMS experimentsD.atBortoletto,
CERN'sLarge
9/14/21TGSW
2021Hadron Collider "Unprecedented discoveries: Higgs
Probing the predictions of SM

Yukawa coupling modifier |κc|<8.5 at 95% CL

LHCP2021

2013

9/14/21

D. Bortoletto, TGSW 2021

4

But also others LHCb: RLHCb:PENTAQUARKS
2015

K

ALICE: QGP

Perhaps showing somecracks in the SM

Spherical: five tightly boundquarks contained in symmetricvolume?

Molecular: a meson weakly boundto a proton?
9/14/21Elliptical flow
D. Bortoletto, TGSW 2021

5

High-Luminosity LHC
Nominal Luminosity 1 x 1034 cm-2 s-1

We arehereUpgrades• 190 fb-1 only about 5% of the entire programme• LHC + HL-LHC is the largest pp dataset for the next few decades
9/14/21

D. Bortoletto, TGSW 2021

6

The incredible challenge of HL-LHC
Run 2 LHC pileup < μ > = 37

HL-LHC pileup < μ > = 200• Radiation levels in the inner most layersof the detectors up to:− fluence of 2x1016 1 MeV neq/cm2− Total Ionizing Dose (TID) ~ 1 Grad
9/14/21

D. Bortoletto, TGSW 2021

7

TimingExploit the time spread of collisions to reduce pileup contamination
9/14/21

D. Bortoletto, TGSW 2021

8

ATLAS High Granularity Timing Detector• Low Gain Avalanche
Detectors (LGADs) pixel
size: 1.3x1.3 mm2• Excellent time resolution(30-50 ps/track)• Radiation-hard (up to2.5x1015 neq/cm2 and 1.5MGy)• Occupancy< 10%•••••

2 double planar layers per endcap providing an average number of hits per track of 2-3
Pseudorapidity coverage: 2.4<|η|<4.0
Radial extension: 12 cm < R < 64 cmz position: 3.5 m; Thickness in z: 7.5 cm
Operated at -30 0C

Timing detectors will also
be implemented in CMS

9/14/21

D. Bortoletto, TGSW 2021

9Low Gain Avalanche Diodes• The Junction Terminating Extension (JTE) allows
high depletion but limits position resulution• Timing resolution: 35 - 70 ps/hit• Gain> 20 decreases to > 8 at the end oflifetime (Vbias<800 V)• Collected charge >4 fC /MIP/hit after 2.5x1015
neq/ cm2• Prototypes from CNM (Spain), HPK (Japan),BNL (USA), FBK (Italy), IME & NDL (China),
T-e2v & Micron (UK)
9/14/21

D. Bortoletto, TGSW 2021

10

Sensor performance in l

Ultra Fast Silicon Detectors

3530

HPK-3.2, -30C
5E14 pCy
1.5e15 n
3e15 npre-rad (20C)
8e14 n1.5e15 pCy

4E14 n1e15 pCy
2.5e15 n

Increasing fluence

25Charge [fC]

Charge [fC]

Sensor performance in lab: charge
987

In the Lab

70 ps

415

3102

500100
HGTD

In the Lab

6520

FBK-UFSD3-C, 2.5e15 n
HPK-3.2, 2.5e15 n
HPK-3.2 #2, 2.5e15 n
CNM-AIDA, 2.5e15 n

Vendors atmaximum fluence

35 ps1200300

400500600700800

Bias Voltage [V]

00100
HGTD

200300400500600700800

Bias Voltage [V]• Collected charge as a function of bias voltage from various vendors.
• Sensors from a variety of vendors satisfy collected charge requirement
HPK 3.2 : Collected Charge > 4 fC after irradiation to 3x1015 neq/cm2 with neutrons.
Superior
performancefor FBKsensors• • Inner(12-23cm) every
1000
fb-1with C enriched gain layer. Same charge for lower
bias voltage. Testing continues.
-1• Middle(23-47cm)
every2000
fb
10I. Nikolic, TIPP-2021, May 26 2021

• Outer (47-64 cm) never replaced

9/14/21 – TIPP 2021
Irena Nikoloc

Ø Sensors from different vendors have different ope
Ø SimilarALTIROC
σt can bechipachieved with sensors while biase
Ø Time resolution improves with increasing gain.
9I. Nikolic, TIPP-202

HPK 15x 15D. Bortoletto, Lecture 2

11

Sensor performance in lUltra Fast Silicon Detectors
Time resolution measured in te3530

HPK-3.2, -30C
5E14 pCy
1.5e15 n
3e15 npre-rad (20C)
8e14 n1.5e15 pCy

4E14 n1e15 pCy
2.5e15 n

Increasing fluence

25Charge [fC]

Charge [fC]

Sensor performance in lab: charge
9876520In the Lab

Boron doped HPK 3.2 sensors,irradiated with neutrons
70 ps

415

3
10

2

500100HGTD

FBK-UFSD3-C, 2.5e15 n
HPK-3.2, 2.5e15 n
HPK-3.2 #2, 2.5e15 n
CNM-AIDA, 2.5e15 n

Vendors atmaximum fluence

300

400

500

600

700

800

Bias Voltage [V]00100HGTD

200300400

4 sensors/SIPM
500600700

800

9/14/21 – TIPP 2021
Irena Nikoloc

Ø Time resolution improves with increasing gain.

30 ps-1Middle(23-47cm)
every2000
fb
10I. Nikolic, TIPP-2021, May 26 2021

• Outer (47-64 cm) never replaced• HPK n-irradiatedσ=3
Ø Sensors from different vendors have different ope
600 Vwhileandbiasefo
Ø SimilarALTIROC
σt can bechipachieved with atsensors

In test beams withALTIROC

Bias Voltage [V]• Collected charge as a function of bias voltage from various vendors.
• Sensors from a variety of vendors satisfy collected charge requirement
HPK 3.2 : Collected Charge > 4 fC after irradiation to 3x1015 neq/cm2 with neutrons.
Superiorperformancefor FBKsensors• • Inner(12-23cm) every
1000
fb-1with C enriched gain layer. Same charge for lowerbias voltage. Testing continues.

•difference betwetime (or with anps
σ² (ti-tj) =35 σ²

1200

In •theTimeLab resolution

930 ps
HPK 15x 15D. Bortoletto, Lecture 2• Tested sensors tI. Nikolic,TIPP-202
greaterthan
4 fC
better than 40 p

12

Timing with 3D sensors• Parker et al. IEEE TNS 58(2) (2011) 404• Hexagonal geometry L=50 μm, 20 V bias
• Tested under 90Sr β source at RT• σt = 31- 177 ps (according to signalamplitude)• Limited by RO electronics noise• G. Kramberger et al., NIMA 934 (2019) 26-32• Squared geometry L=50 μm. Depth = 300 μm. 50V bias
• Tested under 90Sr β source. Room temperature.
• σt = 75 ps

9/14/21

D. Bortoletto, TGSW 2021

13

Timing with 3D sensors

Trench geometry (TIMESPOT)

Column geometry (e.g. ATLAS IBL)

Compatible with existing Timepix chip
9/14/21

D. Bortoletto, TGSW 2021

14TimeSpot• Beam test results (270 MeV/c π+ at PSI)
• Fast Front End Electronics (SiGe BJT)LHCb Upgrade needs

In the lab with infrared laser
20 ps
Vbias = 50V~10 MIPdeposit

9/14/21

D. Bortoletto, TGSW 2021

𝜎t= 907 𝑓𝑠

15

Imaging 5-D Calorimetry• Standard calorimetry• Particle Flow calorimetry• High Granularity Calorimeter
Replacing existing CMS
endcap pre-shower,
electromagnetic and hadronic
calorimeter at HL-LHC• Extremely challenging:• Fluence up to 1016 n/cm2
Dose up to 200 Mrad
• -30oC
9/14/21

D. Bortoletto, TGSW 2021

16

CMS High Granularity CALorimeter
CE-E: Si, Cu & CuW & Pbabsorbers
CE-H: Si & Scintillator,
Steel absorbers

Scintillator

Silicon
Kapton

Silicon

R&D
ILC

CE-E

• HGCROC electronics both
Silicon sampling calorimeter
for SiPM and silicon(OMEGA)－ Measures charge andand time (TOA)
PCB with HGCROC• Trigger data from ASICs fed
through concentrators to theback-end system

CE-H

Baseplate

Silicon: 620 m2, 30K modules, 6Mchannels, 0.5/1 cm2 cell size
• Scintillator: 400 m2 , 4K boards,
240k channels, 4-30 cm2 size

ILC
CLIC, CepC
FCC•

9/14/21

D. Bortoletto, TGSW 2021

Scintillator tiles withon-tile SiPM readout

17

CMS HGCAL• 8’’ prototype sensor (HPK) p-type silicon

320 𝜇m200 𝜇m120 𝜇m9/14/21

D. Bortoletto, TGSW 2021

HGCAL FE electronics
requirements:• Low noise (<2500e)• high dynamic range(0.2fC -10pC)• Timing to tens ofpicoseconds.
• Radiation tolerant• <20mW per channel

18

HGCAL 5D Power
Vector Boson Fusion (H→γγ) event with one photon
and one VBF jet in the same quadrant
No Timing cutCut Δt < 90ps (3σ at 30ps)• Cells with Q > 12 fC projected to the front face of the endcap calorimeter.
• Identify high-energy clusters, then make timing cut to retain hits of interest
9/14/21

D. Bortoletto, TGSW 2021

19

ALICE ITS• Based on the Alpide chip in TJ 180 nm
8 µm

2x11 µm

6.82x229.2

4 µm• Tremendous progress in CMOS pixel
designs−Pixel pitch: 29 𝜇m x 27 𝜇m

25 µ m−Power < 40 mW/cm2

14 µm−Integration time <10 𝜇s

All monolithic silicon pixel
tracking becoming possible
9/14/21

ALPIDE (ALICE)

D. Bortoletto, TGSW 2021

20

Material reduction
Outer layers• ALICE MAPS-CMOS Tracker−7-layers, 12.5 Giga pixels,
10m2

Middle layers−R coverage:
23 – 400 mm• Material/layer:−0.3% X0 (IB)−1.0% X0 (OB)9/14/21

D. Bortoletto, TGSW 2021

Slide 21

CMOS Pixel Chips & Material
62x22x29.24µm~0,6 gram

25 µm

Cooling Plate~1,3 g ~1,0 g

m.88 µ11 µm

Pixel Sensors

Carbon fiber weaves

Flex Printed Circuit

14 µm

Space Frame

ALPIDE (ALICE)
9/14/21

D. Bortoletto, TGSW 2021

Slide 22

Depleted CMOS Sensors
Minimize the material budget

Overall Material Budget

Luciano Musa, Bergen, August 2019: https://indico.cern.ch/event/836343/

9/14/21

D. Bortoletto, TGSW 2021

Slide 23

Depleted CMOS Sensors
Minimize the material budget

9/14/21

Reduce Power (< 20 mW/cm2 ) andRemove Cooling

D. Bortoletto, TGSW 2021

Slide 24

Depleted CMOS Sensors
Minimize the material budget

9/14/21

Remove PCB and integrate components
on chip

D. Bortoletto, TGSW 2021

Slide 25

Depleted CMOS Sensors
Minimize the material budget

Remove mechanical support and use
stiffness provided by rolling Si wafers

Factor 7 Reduction in Mass !

9/14/21

D. Bortoletto, TGSW 2021

Slide 26

IT3 Concept

Technology advances:• 300 mm wafer-scale chips fabricated with stitching• thinned down to 20-40 μm bent to the target radii• held in place by carbon foam ribs
Key benefits:• extremely low material budget: 0.02-0.04% X0(beampipe: 500 μm Be: 0.14% X0)• homogeneous material distribution leading tosmaller systematic error

9/14/21

D. Bortoletto, TGSW 2021

27

Test beams
June 2020 test beam data shows that bent MAPS work perfectly

Collaboration investigating TowerJazz 65 nm
Magnus Mager (CERN) | ALICE ITS3
| TIPP 2021 | 26.05.2021 |9/14/21

D. Bortoletto, TGSW 2021

28

Test beams
June 2020 test beam data shows that bent MAPS work perfectly

Development extremely important for futuree+e- colliders and experiments requiring
very low material
Collaboration investigating TowerJazz 65 nm
Magnus Mager (CERN) | ALICE ITS3
| TIPP 2021 | 26.05.2021 |9/14/21

D. Bortoletto, TGSW 2021

29

Perspective+ ASICs

9/14/21

D. Bortoletto, TGSW 2021

Slide 30

Conclusions
Imagination is more important
than knowledge.
For knowledge is limited,
whereas imaginationembraces the entire world,
stimulating progress, giving
birth to evolution.

Albert Einstein, What Life
Means to Einstein (1924)
9/14/21

D. Bortoletto, TGSW 2021

Slide 31

4 D tracking
TrenchMultiplication region

Pixel 1

Multiplication region

no-gain region Pixel 2p++ substrate

LGADS•••
9/14/21

AC LGADS

Trench Isolated• n++-implant more resistive• p-stop & JTE replaced by a trench• Add dielectric layer forisolation and AC-coupling
into readout pads

These are just examples
Many other ideas under development• no p-stop, JTE, inter-pad gap
Timinginfo essential for future colliders
D. Bortoletto, TGSW 2021

32

HGCAL as an Imaging calorimeter𝜇 (200 GeV)

CE-H(Si)

π (250 GeV)

CE-H(Si)

CE-E
CE-Ee (150 GeV)

CE-H(Si)

π (250 GeV)
CE-E

CE-E9/14/21

CE-H(Si)

D. Bortoletto, TGSW 2021

33