Looking Ahead to the 19th Term
The Future of Industrial Automation

Leadership - Technical Review Board
1. Daniel Amirsadeghi, Molex
2. Rudy Belliardi, Schneider Electric
3. Paul Didier, Cisco Systems
4. Dr. Jörg Hähniche, Endress+Hauser
5. Dr. Ludwig Leurs, Bosch Rexroth
6. Shinji Murayama, Omron
7. Dave VanGompel, Rockwell Automation
8. Joakim Wiberg, HMS Industrial Networks (*)* chairperson
General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
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2

Leadership - Officers•

President and Executive Director – Katherine Voss•

Chief Technology Officer – Joakim Wiberg•

Secretary – Christopher Lynch•

Treasurer – Jürgen Weinhofer

General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
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33

Leadership - Board of Directors

Michael Höing
Weidmüller Interface

Masaru Takeuchi
Omron
General Session© 2017 ODVA, Inc.

Fabrice Jadot
Schneider Electric

Dr. Thomas Bürger
Bosch Rexroth2017 Industry Conference & 18th Annual Meeting
All rights reserved.

Dr. Jürgen Weinhofer
Rockwell Automation

Dr. Rolf Birkhofer
Endress+Hauser
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Dave Lagerstrom
Turck4Strategic Technologies
Cloud/FogComputing
Resources

ICS Integration
Tools

Industrial Control
Systems (ICS)

1:1andmore*

IIOT
FootprintGeneral Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
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5Strategic Technologies
Building on EtherNet/IP’s leading position requires that ODVA stakeholders
monitor, and work together, to adapt to opportunities and threats.
Device data is increasing in value. CIP provides a rich, context-based repository for device dataand thus provides the opportunity to increase the value proposition of EtherNet/IP based on its
device data. In order to capture this value, ODVA specifications must be enhanced to include amodern, robust electronic data technology to support data-driven workflows for device integration
and a standard reference model for the production and consumption of digitized device data.
The result will benefit vendors and users of EtherNet/IP through value-added services madepossible by context-rich device data aligned with workflow needs.

Introducing “Project xDS”
General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
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6Strategic Technologies
What is Project xDS?
Project xDS is the name of ODVA’s collective activities to define, create and proliferate the successor to ODVA’s current electronic
artifacts for device integration and conformance testing of ODVA CONFORMANT™ devices, the Electronic Data Sheet (EDS) andStatement of Conformance (STC) files.
Project xDS was approved by ODVA’s Board of Directors at its Regular Meeting on October 12 and 13, 2016.

The first phase of Project xDS proceeds with two parallel activities:
1.
An Ad Hoc Committee for Project xDS shall be constituted to define and prepare the detailed work plan for Project xDS forreview by, and feedback from, ODVA leadership and then for approval by ODVA’s Board of Directors.
2.
ODVA’s future vision of digitized artifacts for EtherNet/IP device data, as defined by this presentation, shall be distributed forreview and comments from key stakeholders in the Project including, but not limited to, ODVA’s Technical Review Board, Ad
Hoc Committee for Project xDS (Ad Hoc Committee), principal members and technical staff. The Ad Hoc Committee shallreview and integrate the stakeholder comments into its detailed work plan.
The business case for Project xDS, and its definition, has been developed and vetted through various means including ODVA
workshops to define use cases and requirements for ODVA’s electronic artifacts for device integration and conformance testing,joint meetings with other organizations pertaining to technology and standards for ICS Integration Tools, experience of the ODVA
staff with EDS and STC files, and meetings of ODVA’s Board of Directors.
General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
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7Guiding Principles for Project xDS1)
2)

EtherNet/IP shall be the ODVA network technology of primary focus.
The Vendor Value Proposition shall:
Make integration of EtherNet/IP devices in vendor ICS Integration Tools as simple and re-usable as possible;
Eliminate the need for different artifacts for device integration and another for ODVA conformance testing;Support an approach to technical implementation by developers that is scalable from simple to complex devices and from device tosystem suppliers; and•
Provide methods to simplify adoption by device vendors.
•••3)

The User Value Proposition shall:
Mandate, as of a date to be determined, that the xDS artifact shall be provided for all ODVA CONFORMANT™ EtherNet/IP devices;
Mandate use of all data provided in the xDS artifact by scanners and by Device Integration Tools used in ICS systems with CIP subnets;•Minimize the amount of optional device data in the xDS artifact;•Mandate that a vendor shall obtain and maintain Declarations of Conformity for its xDS artifacts (in addition to the EtherNet/IP device
whose data the xDS artifact defines); and•Allow one xDS artifact for a product family.
••

General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
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8

Strategic Technologies
Organizing Framework for Project xDSGeneral Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

9Strategic Technologies
Organizing Framework for Project xDSGeneral Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

10Strategic Technologies
Organizing Framework for Project xDS

General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
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11Strategic Technologies
Organizing Framework for Project xDS

General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

www.odva.org

12Strategic Technologies
Organizing Framework for Project xDSGeneral Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
All rights reserved.

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13

Strategic Technologies
Ad Hoc Committee is Next Step for Project xDS1) Develop an initial set of target Use Cases and minimum requirements to refine and achieve the benefits for theVendor and User Value Propositions.

2) Map what EDS and STC does today to the xDS concept and identify gaps in device data and workflow
coverage (Recommendation from Workshop 2016Q3: As a starting point, review The CIP Annex from The
FDT2 Specification and align the xDS concept).
3) Select the Data Syntax Format based on best fit for the minimum xDS Workflows and the xDS productionconsumption model.
4) Develop the Reference Architecture, including separation of the data contents from the encoding method; theReference Architecture shall be submitted for review and approval by ODVA’s Technical Review Board andBoard of Directors.
5) Develop key Milestones for the Scope of Work including resource requirements and a projected timeline forcompletion; the Milestones shall be submitted for review and approval by ODVA Technical Review Board,
officers and Board of Directors.

General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
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14

Looking to our Future Generation of Developers

Steep Learning
Curve

Finding Help

Specification

General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
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Reference
Implementations
DesignDecisions

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15

Looking to our Future Generation of Developers

General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
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16

Looking to our Future Generation of Developers
Need For an Integrated Learning Environment

Online Community

Development Workflow
17

Looking to our Future Generation of Developers
Introducing ILE for
EtherNet/IP Newbies!
•A self-guided course in
EtherNet/IP•
Connects mainconcepts directly to theapplicable content in theSpecification•Provides real-life
examplesGeneral Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
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1818

Looking to our Future Generation of Developers
What’s in the Box?
• EtherNet/IP Short Course (integrated withThe EtherNet/IP Specification)• Basic stack example• Virtual devices• Virtual Lab• …and Online Community Access in the
Know-How HubGeneral Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
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19

Looking to our Future Generation of Developers
ToolBox Launch with New Digital Subscription Management System••

Improving the user experience for vendors and ODVA Members
Streamline fulfillment and update process

Order ODVA Product

DeliveryLoginProduct
Activation CodeRole / Permission
General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
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Deeper Know-How:in the Online
Community
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Looking to our Future Generation of Developers
The beginning of an ODVA on-line community for developers

Know-How
Blog

Product Tool Tips &Instructions

Conformance
Q&A

My ODVA
Subscriptions• Emerging trends• Implementation
approaches• Roundtable report• Enabling tech.
provider point ofview . . . .

• Dedicated selfserve content foreach product• Searchable libraryof tips, FAQs

• Commonquestions and tips
from CA• Searchable library• Integrated contactform• Licenses for yourcurrent products• Activations tolicenses• Integrated contact
form

General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
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21

Looking Ahead to the 19th Term
The Future of Industrial Automation

Leadership - YOU

IIOT
Footprint

Board ofDirectors

Working
GroupsTechnicalReview
Board

ODVA must continue
to drive conversationand collaboration
inside ODVA at thehighest levelpossible.

Staff, TSPs
and other ODVA
Valueproposition
ServiceProviders

Officers

IIOT
Footprint

Working together to make the 19th Term Great!
General Session© 2017 ODVA, Inc.

2017 Industry Conference & 18th Annual Meeting
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23

See YOU in October 2018 at theODVA 2018 Industry Conference & 19th Annual Meeting of Members!
Dates TBD.