131th International Workshop on
Vertex Detectors (VERTEX2022)

Vertex2022 organized
Kazuhiko Hara

粒子生成や多くの崩壊は衝突点（原子核内）
Bハドロンなどは数mm飛んでから崩壊
粒子軌跡を精密に測定する⇒どんな反応が起きたかを知る重要情報
VERTEX Detector （or Tracker）
Mainly, silicon semiconductor trackers

Past Vertex workshops•2021 virtual, Oxford/UK•2020 virtual, Tsukuba/Japan•2019 Lopud Island, Croatia•2018 Chennai, India•2017 Asturias, Spain•2016 Isola d'Elba, Italy•2015 Santa Fe, New Mexico, USA•2014 Mácha Lake, Doksy, Czech Republic•2013 Lake Starnberg, Germany•2012 Jeju, Korea•2011 Rust, Austria•2010 Loch Lomond, Scotland, UK•2009 Mooi Veluwe, Putten, The Netherlands•2008 Uto Island, Sweden•2007 Lake Placid, New York, USA2

•2006 Perugia, Italy•2005 Chuzenji Lake, Nikko, Japan•2004 Menaggio Como, Italy•2003 Low Wood, Lake Windermere, Cumbria, UK•2002 Kailua-Kona Hawaii, USA•2001 Brunnen, Switzland•2000 Sleeping Bear Dunes, Lake Michigan, USA•1999 Texel, The Netherlands•1998 Santorini, Greece•1997 Mangaratiba, Rio de Janeiro, Brazil•1996 Chia, Sardignia, Italy•1995 Ein Gedi, Dead Sea, Israel•1994 Lake Monroe, Indiana, USA•1993 Lake Bohinj, Slovenia•1992 Basto Island, Finland

KH: International Advisory Committee member since 2010
LEP experiments 1989
Style keywords: Water, Isolated
RD19 1992 (pixel sensors)full board
invited talks
VERTEX2022: 36 invited (30’) talks + 17 short (15’) talks

3

VERTEX2020 & VERTEX2022

Start organizing in Feb.
w/o any idea of the venue

Decide to be virtual
April 1, 2020 as for Tokyo
Olympics is postponed

Decided to be on-site July 1
Visa requirement set void
since 11 October ….

Running detectors
Giulia (CMS Inner Tracker)
Kerstin (ATLAS pixel)
Ivan Ravasenga (Alice ITS3)
Arthur (Belle II PXD)
Kookhyun (Belle II SVD)
Valeriia (LHCb VELO)
Dimitra (LHCb UT)
Suvankar (CMS silicon tracker)
Hanna (ATLAS SCT)
Benedikt (FASER)
Shinji (J-PARC g-2/EDM)

4

Giulia
Negro

Highlights of CMS Inner Tracker• Detector refurbishment during Long Shutdown 2• new Layer 1 modules• new readout chip (PROC600v4) to fix dynamic

300um?

inefficiency issue and reduce crosstalk noise• new Token-Bit-Manager (TBM10d) with delay
and power reset option• new HDI design to eliminate HV issues• new DCDC converters to fix failure mechanism indisabled state•…

• Smooth installation and commissioning in 2021
• First Run 3 performance are good!
• bias scans to monitor evolution of radiation damage• large charge efficiency loss in Layer 1 within first
10 fb-1• recovered by raising bias voltage and withpositive annealing in period without beam
• timing scans to find optimal delay settings• now also for Layer 1 w.r.t. Layer 2 thanks to newTBM feature• excellent position resolution in full detector• comparable to Run 2

50.28

Commissioning and performance in Run 3 of ALICE ITS2→ Highlights

Ivan Ravasenga (CERN) – ALICE Collaboration

ITS2: upgraded ALICE Inner tracking system based on
MAPS → 10m2 active area, low material budget(~0.36% X0 in IB)⚫ Installation in ALICE cavern: May 2021
⚫ Commissioning in the cavern: June 2022
⚫ Taking data in Run 3: pp collisions √s = 13.6 TeV,
nominal 500 kHz interaction rate, nominal 202 kHz
framing rate

6⚫

Calibration is challenging for 24120 chips: 1% of pixels pulsed –40 processing nodes + parallel processing⚫
Masking 0.15‰ of total pixels and tuning the discrimination
Threshold tuned to 100e- in the full ITS2 (24120 chips)
thresholds to 100 e⚫
Benchmarking the pre-alignment with K0S: ~80um pointingAfter
reso Tuningwith pre-alignment⚫

7 layers (3 IB+4 OB)
Target threshold: 100e-

Average #clusters / chip / ReadOutFrame in the full detector
K0S invariant mass: ITS stand-alone tracking (δmean=a few/mile)

CountsITS2 in the ALICE coreMay 2021

7Hadronic
eventsdesigntracks
surveyFASER Tracker Highlight VERTEX 2022FASER tracker made of 12 layerswith silicon strip modules(ATLAS SCT modules)

Installation in 2021

Efficient andsuccessful beamcommissioning

Hit efficiency>99.6%>99.5% working
channels>20fb-1 collected
in 2022

Upgrade
Giacomo (CMS pixel HL-LHC)
Fabio (CMS Outer Tracker)
Mei (CMS L1 tracker finder)
Mauro (CMS 3D)
Toru (Belle II upgrade)
Zihan (Belle II thin-fine pitch SVD)
Helen (ATLAS Itk pixel)
Benedikt (ATLAS Itk strip)
Stefania (ATLAS pixel Loaded Local Support Demonstrstor)
Christoph (ATLAS strip QC)
Shigeki (ATLAS strip QA)
Francesca (ALICE ITS for Run4)
Lukas (ALICE ITS beam test)
Ryu (LHCb Mighty Tracker w/ HV-CMOS)

9The CMS Outer Tracker for the High Luminosity LHC
10• The new Outer Tracker will be equipped withthe pT-modules• Will allow running the particle flow at 40 MHz• Two types of pT-modules: 2S and PS• Module production centers are getting ready• Assembly and QA procedures are being finalized• Several prototypes successfully
assembled and qualified• Improvement in detector geometry,
better materials and cooling,
more clever power distribution• Low material budget
Fabio Ravera

Pixel + Strip (PS)

Strip + Strip (2S)

Belle-2 Upgrade scheduled 2027-2028
Toru Tsuboyama

DMAPS OBELIX: Optimized BELle II pIXel sensor• Monopix2: 33 μm pitch, 25 ns integration• Tower Jazz 180nm• Cover entire volume

SOI DuTip: Dual Timer Pixel• ALPIDE type frontend (modified for faster response)• Lapis 200nm• Seemless readout• Innermost layer
7-bit timer-0
7-bit timer 1

ALPIDE sequencer

45x45 μm pixel

Si TFP: Thin fine-pitch DSSD to cover outer volume• 150 um thick DSSD (prototype@Micron)• Binary readout SNAP128A (pipeline~8us)

11

ATLAS Itk Strip

13

ATLAS Itk strip sensor QC
Order typePre-production
ProductionSensor typeall 8 types
all 8 types

Contractor
HPKHPK

14

christoph

No. sensors
1,041
9.2 m2 completed
20,800 190.3 m2 ongoing

VFD
Sensor bow

Strip test

Breakdown V

Strip test: each by HPK and samplings by Institutes

 Fully established QC site testing procedures withfinalised setups and hardware use of ITk Production Databaserecords of all tests by HPK + ATLAS sites
shipmentsShigeki Hirose

ATLAS ITk Strip sensor pre-pro.
QA• ITk strip sensor pre-production was carried out in 2020
• With >100 QA pieces, very good performance was confirmed• Various good lessons to improve our QA procedure for mainproduction!

• Based on the outcomes from pre-production, ATLAS18 sensor
main production was started in July 2021

15

Upgrade of the ALICE Inner Tracking System 16
Francesca Carnesecchi
for LHC Run 4
From 432 sensors to 6 truly cylindrical wafer-scale MAPS sensors
Ultimate vertex detector
Silicon flexibility and bending proved
Full mock-up of the final ITS3 done,
uniform performances among different radii

efficiency
Fake rate

Next step: stitchingFirst prototype to be received in 2023:
fundamental for understanding therules of stitching, yield and uniformity

Sensor design validated
Improved charge collection efficiency
with new design, 100% detection
efficiency reached and radiation
hardness higher than one needed fromALICE (1013 neq/cm2)

ASIC
AlessandroCaratelli (CMS track finder)
John (RD53 – ATLAS/CMS pixel)

17

RD53 Pixel chips for ATLAS and CMS Phase II upgrades
Designing blocks and test chips, testing radiation hardness,
designing RD53A, verification

2013

2014

2015

2016

2017

Protecting against single event
effects, adding features, verification

2018

2019

2020

Adding features,fixing bugs,verification

2021

Fixing bugs,verification

2022

Fixing bugs,verification

2023

RD53C-ATLAS:

Q4 2022400 x 192 pixels
size: 20mm x 11.5 mm

400 x 384 pixels
size: 20 mm x 21 mm

432 x 336 pixels
size: 21.6 mm x 18.6 mm

Differential Front End

Linear Front End

ATLAS production(ITkPix-V2)
RD53C-CMS:

Q1 2023
CMS production

RD53A• Half-size demonstrator for:• evaluating alternatives:
RD53B-ATLAS (ITkPix-V1)• 3 analogue front ends
• ATLAS pre-production• 2 readout architectures• Submitted in March 2020
• prototyping Pixel modules • In October 2020, a mask respin• submitted in August 2017
was submitted to patch a serious
bug in the pixels’ Time overThreshold latches(CROC-v2)

RD53B-CMS (CROC-v1)• CMS pre-production• Submitted in June 2021

RD53:
Pixel chip collaborationof 24 ATLAS and CMS
institutes for 9 years
and counting

19Monolithic
Luigi (MuPix for Mu3e)
Ivan Dario (DMAPS)
Jory (TPA)
Lingxin(HVCMOS test beam)
Pascal (digital MAPS)
Akimasa (SOI)
Didier (FASER preshower)
Heinz (small pixel: MALTA)
n+P-P-well

Silicon-0n insulator
Pixel/n-welln+Small electrodes
MALTA

large electrodes
DMAPS/HVCMOSPSOIJory Sonneveld

TPA (two photon absorption) laser to image * TPA occurs at focal point20

21

SOI

Akimasa ishikawa

Since 2005, Japanese group is developing the SOI pixel detector with Lapis
semiconductor (200nm FD-SOI)
Tested with 90Sr and 50MHz CLK• DuTiP concept for Belle II and ILC(20ns) - good enough for 63ns bucket•First prototype DuTiP1 was tested•DuTip2 (full functionality) was delivered

ALPIDE analog circuit
Modified for faster response

7bitx 2
15.9MHz(62.9ns) CLK(SuperKEKB509MHz/32(1.97ns*32) )Trigger
latency of at most 8us (4.4us requirement)

R&D New Detector/Material

Christopher (RD50 activity)
Giulio (SiC)
Harris (Diamond)22giulio

SiC

23High quality, low defect density SiC is available up to 200 mm wafers••••

Wide bandgap• reduces the leakage current, maintaining low noise levels at high temperatures.
• Insensitive to visible light.
High atomic displacement threshold (~20 eV for C, and ~40 eV for Si), which shouldmake the material more radiation resistant;
Fast saturated electron drift velocity (2x107 cm/s at RT), twice faster than silicon;
High thermal conductivity (490 Wm-1K-1), which is three times higher than that of Si

IMB-CNM SiC epi 50umt

channel

0204060

80

100

220

220210210200200190

190

244Cm emisión ~ 5,8 MeV α

180180Range ~ 19 mm

170

170
0204060

Reverse bias (V)

80

100

Rise time on the orderof few hundreds of ps
３D in prep.

LGAD idea(57eh/um, 50umt)
Gain layer by epi

TimingMengqing (ATLAS HGTD)
Valentina (HGTD rad-hardness)
Vagelis (LHCb Velo2 – 4D)
Kevin (TimePix monolithic 440ps)
Wilhelm (HADES beam monitor-LGAD)
Francesco (Resistive RO – LGAD, 20ps/15um)

Alessandro Tricoli (AC-LGAD 28ps/6um)
Sayuka (AC-LGAD)
Francesco (TCAD simulation)
Adriano (TimeSPOT: 10ps⇒50ps w/ ASIC)
Giuseppe (picoAD: monolithic 17.3ps)

24

Rise of 4D Detector≲ 6 μm with 100 μm pitch(limited by tracker resolution)

25
Alessandro Tricoli

Time Resolution ~28 ps:

26

AC-LGAD for hadron collider
Sayuka Kita

finer pitch AC-LGAD sensors (strip&pixel) are prototyped
with HPK – process parameters are optimized
Strip (80um pitch)

Y [mm]

Signal size [V]Pixel (100um pitch)large signal&goodperformancee.g. efficiency

large signalbutsignal reduction
by Cint
X [mm]

Strip length [mm]

27
The

ERC Project

G. Iacobucci

Introduces the PicoAD© —Picosecond Avalanche Detector— a multi-PN junction sensor.
A monolithic proof-of-concept prototype was produced in SiGe BiCMOS 130nm IHP process. Continuous gain layer
10µm deep in sensor. Testbeam provided:•Efficiency = 99.9 % including inter-pixel regions•Time resolution σt = (17.3 ± 0.4) ps 13 ps at center and 25 ps at pixel edge
(although sensor not yet optimized for timing)

Second monolithic prototype WITHOUT GAIN provides 21ps time resolution.

Non HEP & Future experiments

Giuseppe (100μPET)
Xuan (EIC)
Nazar (muon collider)
Haken (ILC)

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VERTEX2022✓ HEPNews 12月号に会議報告記事⇒VERTEX2023
IAC: 原から中村浩二（KEK）に交代

Vertex2023 will be hosted by Genova Group (Claudia Gemme)