Recent Changes in the Physical Layer (Chapter 8) for
DeviceNet and EtherNet/IP
Brad Woodman
Engineering Supervisor
Molex
Presented at the ODVA2014 Industry Conference & 16th Annual Meeting
March 11-13, 2014
Phoenix, Arizona, USA

Abstract:
Significant changes are being made to the physical layer (Chapter 8) in both DeviceNet™ and EtherNet/IP™
volumes. For DeviceNet, the changes are more clarification and design factors for both cable drop lengths. For
EtherNet/IP, the changes are more technology changes for higher data rate of 1G in an industrial environment andharmonizing with IEC standards. Creating a technical guideline document for earthing (grounding) and bonding for
all ODVA physical layers to use.
Keywords:
M12-8 X-Coding, IEC 61076-2-109, Earthing (grounding) and bonding, ISO/IEC 24702, IEC 61918, ANSI/TIA1005-A, ISO/IEC 11801
Definition of terms (optional):
Bonding: Act of connecting together exposed conductive parts and extraneous conductive parts of apparatus,
systems, or installations that are at essentially the same potential. {IEC61918}
Earthing: (verb) often referred to as, “Grounding” in the US influenced markets means to make an electricalconnection between a given point in a system or in an installation or in equipment and the local earth. {IEC 61918}
Parallel Earthing Conductor or Potential Equalization cable: a conductor connected in parallel with thescreens/shields of signal and/or data cables in order to limit the current flowing through the screens {IEC 61000-5-2,IEC60364-4-44}.

2014 ODVA Industry Conference

1©2014 ODVA, Inc.

DeviceNet Chapter 8 Changes
Updating Cable profiles with additional information on Drop length
The current DeviceNet cable profiles do not provide any guidance on the maximum drop line current per drop
length. The proposed changes will be providing both the table and graph showing the maximum drop line current
per drop length. Calculations and values used to create both the table and graph will be provided in thespecification. The maximum drop current for any cable profile is 3 Amps due to DeviceNet system design
requirements.
Thick Cable profile updates are shown below:

Maximum Drop Current (Amps)

Drop current per cable length
4.0
3.0
2.0
1.0
0.00
(0)

0.3
(1)

0.9(3)

1.5(5)

2.3(7.5)3(10)4.6(15)6.1(20)4.6(15)3.0

6.1(20)3.0

Drop length in meters (feet)

Figure 1: Drop current per cable length for thick cable

Drop Length in meters (feet)

00.3 0.9 1.5 2.3
3.0(1) (3) (5) (7.5) (10)Maximum Current in amps
3.0 3.0 3.0 3.0 3.0
3.0
Table 1: Thick Cable Maximum Allowable Drop Line Current

The table above was computed by using the formula, with a maximum rating of 3 Amps:
I=0.35V/[(Cable DCR * Length of Drop) + (Contact DCR * Number of contacts)]
Where Cable DCR = 0.00445 ohms/ft at 80C. The equation for DCR at elevated temperature is;
R = R0*[1 + a(T – T0)]
R is the new DCR for copper at the new temperature (80C)
R0 = 3.6 ohms/1000ft , DCR of copper at 20 degrees C
a = 0.00393/degrees C (coefficient for copper)
T = 80 (new temperature)
T0 = 20
Contact DCR = 0.001 ohms
Number of contacts = 8 (4 connections with 2 contacts for each connection)2014 ODVA Industry Conference2©2014 ODVA, Inc.

Thin Cable profile updates are shown below:Maximum Drop Current (Amps)

Drop current per cable length
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.00(0)0.3(1)

0.9(3)

1.5(5)

2.3(7.5)3(10)4.6(15)6.1(20)Drop length in meters (feet)

Figure 2: Drop current per cable length for thin cable

Drop Length in meters (feet)0

Maximum Current in amps

3.0

0.3(1)
3.0

0.9(3)
3.0

1.5(5)
3.0

2.3(7.5)
2.1

3.0(10)
1.6

4.6(15)1.1

6.1(20)0.8

Table 2: Thin Cable Maximum Allowable Drop Line Current
The table above was computed by using the formula, with a maximum rating of 3 Amps:
I=0.35V/[(Cable DCR * Length of Drop) + (Contact DCR * Number of contacts)]
Where Cable DCR = 0.0216 ohms/ft at 80C. The equation for DCR at elevated temperature is;
R = R0*[1 + a(T – T0)]
R is the new DCR for copper at the new temperature (80C)
R0 = 17.5 ohms/1000ft , DCR of copper at 20 degrees C
a = 0.00393/degrees C (coefficient for copper)
T = 80 (new temperature)
T0 = 20
Contact DCR = 0.001 ohms
Number of contacts = 8 (4 connections with 2 contacts for each connection)

EtherNet/IP Chapter 8 Changes
New sealed small form factor connector – M12-8 X-Coding
The M12-8 X-Coding is based on the current M12-4 D-Coding connector design. The features of the M12-8 XCoding are the following:• 4-pair shielded or unshielded cables• Update to 10 Gigabit-Ethernet (10GBASE-T) transmission rates• Complaint to IEC 61076-2-109• Connector performance to ISO/IEC 11801 Category 6A and IEC 60512-29-100• Sealed to both IP65 and IP67 ingress ratings
2014 ODVA Industry Conference

3©2014 ODVA, Inc.

••

Accepted by both EtherNet/IP and PROFINET specifications
Standardized in IEC 61918 and IEC 61784-5-x series

The pictures below shows both the plug and jack views for the M12 X-Coding:

The figure below shows the plug and jack views with corresponding pin assignment:

Figure 3: Plug connector with male pin contacts

PIN

Pin Assignment
T568B

123
45678

White Orange
OrangeWhite GreenGreenWhite Brown
Brown
White BlueBlue

Jack connector with female socket contacts

Pair Assignment

2341Pin Assignment
T568A

Pair Assignment

White GreenGreenWhite OrangeOrangeWhite BrownBrown
White BlueBlue324
1

Table 3: Sealed M12-8 X-Coding pin/pair designation and color coding for balanced cabling2014 ODVA Industry Conference4©2014 ODVA, Inc.

1G Industrial cabling
The addition of 1G (1000BASE-T) for both commercial and industrial cabling to Chapter 8 is currently being
finalized by the EtherNet/IP physical layer JSIG. The commercial (E1) cabling performance requirements are fromone of the following standards:• ISO/IEC 11801 – Information technology – Generic cabling for customer premises• ISO/IEC 24702 - Information technology – Generic cabling for Industrial premises• ANSI/TIA-1005-A – Telecommunications Infrastructure Standard for Industrial Premises
For 1G industrial cabling, which covers both E2 and E3 environments, the JSIG is working on defining theadditional performance requirements that might be required for those environments beyond the current requirementsin the standards stated above. The figure below shows the various MICE environments for an industrial area:

Figure 4: MICE environments for an industrial area
The major area of concern is the coupling of noise from adjacent conductors or devices causing the loss datapackets. For motion control systems, the loss of three consecutive data packets will require the system to shut down
for safety issues. Testing for both conducted radio-frequency (RF) fields per IEC 61000-4-6 and electrical fasttransient burst immunity (EFT/B) per IEC 61000-4-4 on various industrial cabling are currently being conducted bymembers of the JSIG. After the completion of testing, the JSIG will determine if additional requirements for thecabling are needed for impedance, return loss, coupling attenuation for shielded cables, transverse conversion loss(TCL) for unshielded cables, and equal level transverse conversion transfer loss (ELTCTL) for unshielded cables.
For 1G copper industrial cabling, the JSIG is specifying to use either the sealed RJ-45 variant 1 of IEC 61076-3-106
or the M12-8 X-coding of IEC 61076-2-109. For the cable, the JSIG will determine the category level and if bothshielded and unshielded cable will be used from the E3 testing.

Harmonize with International standards
Members of the JSIG are actively working with various ISO/IEC and IEC standard bodies to harmonize EtherNet/IPspecifications to the various standards. The following list of ISO/IEC, IEC, and ANSI standard groups that themembers are involved with:• ISO/IEC JTC1/SC25/WG3 – Customer premises cabling• IEC SC65C JWG10 – Industrial cabling• IEC 48B WG3 – Electrical Connectors• ANSI/TIA TR42.9 – Industrial Telecommunications Infrastructure2014 ODVA Industry Conference

5©2014 ODVA, Inc.

The various standard groups above work on defining the connector component, cable component, cabling
performance, fieldbus cabling. With the involvement of the members from the JSIG in the various international
standards, common components and performance requirements are standardized and are not fragment between thevarious standards. This enables companies to have a standard physical layer cabling for the various industrial
fieldbuses.

Chapter 8 new formatting allows expanding to future higher data transmission speedsWith the addition of 1G (1000BASE-T) to the specification, the JSIG decided to re-format the tables and chapter
layout to allow for future expansion of higher data transmission speeds. An example of this would be the section onIEEE 802.3 PMD/MDI interfaces
ServiceData Rate
10BASE-T100BASE-X

PMD
Clause924

100BASE-TX

25

1000BASE-X

1000BASE-T

PMA

PMD/MDI
Other relevant Clauses

14ANSI X3.263-1995
ISO/IEC 9314,
ANSI X3T12 (FDDI)ANSI X3.263-1995

3636

PMD ANSI X3.2301994 Clauses 6 and 7 ,Clause 66

4040

AutoNegotiation

37

28

Table 4: IEEE 802.3 relevant clauses for PMD/MDI interfaces
Another example is the creation of a new table for industrial copper connectors with a listing of electrical andmechanical specifications.
Industrial EtherNet/IP Connector Specifications and Requirements
Specification

TypeElectrical

RJ-45-Shielded

RJ-45

M12-4 D-Coding

M12-8 X-Coding

Conductors

8 + 1 Shield848

Insertion LossANSI/TIA-568-C.2
Category 5E

ANSI/TIA-568-C.2
Category 5E

IEC 61076-2-101

IEC 61076-2-109

RL

ANSI/TIA-568-C.2
Category 5E

ANSI/TIA-568-C.2
Category 5E

IEC 61076-2-101

IEC 61076-2-109

NEXT LossANSI/TIA-568-C.2
Category 5E

ANSI/TIA-568-C.2
Category 5E

IEC 61076-2-101

IEC 61076-2-109

Shielding Effectiveness

ANSI/TIA-568-C.2
Category 5E

N/A

IEC 61076-2-101

IEC 61076-2-109

Coupling Attenuation 1

ANSI/TIA-568-C.2

NAIEC 61076-2-109

TCL

ANSI/TIA-568-C.2

ANSI/TIA-568-C.2

IEC 61076-2-109

TCTL

ANSI/TIA-568-C.2

ANSI/TIA-568-C.2

IEC 61076-2-109

1 This specification is marked FFS in the referencing standard.
Mechanical

RJ-45-Shielded

RJ-45

GenderPlug and Socket

Plug and Socket

Mating Specification

IEC 60603-7-3 orIEC 60603-7-5

IEC 60603-7-2 or IEC60603-7-4

2014 ODVA Industry Conference6

M12-4 D-Coding

M12-8 X-Coding
IEC 61076-2-101 IEC 61076-2-109
IEC 61076-2-101 IEC 61076-2-109©2014 ODVA, Inc.

Contact plating 50u inches min. gold over
100u inches min. nickel orequivalent plating system

50u inches min. gold over
100u inches min. nickel orequivalent plating system

IEC 61076-2-101 IEC 61076-2-109

Contact LLCR over life

< 20 mΩ< 20 mΩIEC 61076-2-101 IEC 61076-2-109

Initial Contact Low Level
Contact Resistance<=2.5 mΩ<=2.5 mΩIEC 61076-2-101 IEC 61076-2-109

Minimum contact force

100 grams

100 grams

133 N

133 NIEC 61076-2-101 IEC 61076-2-109
IEC 61076-2-101 IEC 61076-2-109

750 insertions andextractions min.

750 insertions andextractions min.

Minimum plug retention force
2Contact Life
1IEC 61076-2-101 IEC 61076-2-109

Required when the connector is used as a standalone connector (not in a protectiveshell)

Table 5: Industrial EtherNet/IP copper connector specifications and requirements
Both of these new table formats allows for additional connectors for future data transmission speeds simply byadding additional row to the bottom of the PMD/MDI table and a column to the right for the connector table.

Earthing (Grounding) and Bonding Technical Guideline
Technical guideline document is currently under development by the members EtherNet/IP physical layer JSIG.
Once approved by the JSIG, the document will be reviewed by the other ODVA physical layer SIGs. The scope ofthe document is the following:
Scope:The intended audience of this document is Vendors, designers, installers, integrators and end-users. This
document is intended for the planning, installation, and maintenance phases of CIP networks. This
document describes two earthing systems commonly implemented. The two systems are called
equipotential/mesh earthing systems and star earthing systems. Bonding methods are also described.
These methods are intended to provide a low noise earthing system for the CIP communications system andnot meant to replace the building electrical earthing and bonding system.
The document terminology is standardized using international terms of earthing, instead of North America
terminology of grounding as defined below.
Key definitions:
Bonding: Act of connecting together exposed conductive parts and extraneous conductive parts of apparatus,
systems, or installations that are at essentially the same potential. {IEC61918}
Earthing: (verb) often referred to as, “Grounding” in the US influenced markets means to make an electricalconnection between a given point in a system or in an installation or in equipment and the local earth. {IEC 61918}
Parallel Earthing Conductor or Potential Equalization cable: a conductor connected in parallel with thescreens/shields of signal and/or data cables in order to limit the current flowing through the screens {IEC 61000-5-2,IEC60364-4-44}.
Ground currents on sensitive equipment such as communications cabling can be minimized by controlling theground offset currents in ether the building wire or auxiliary earthing wiring. The two earthing methods are shown
below in figures 5 & 6.

2014 ODVA Industry Conference

7©2014 ODVA, Inc.

Figure 5: Equipotential/mesh bonding network at building level2014 ODVA Industry Conference

8©2014 ODVA, Inc.

Figure 6: Star grounding schematic

Harmonize with International standards
The guideline document uses the following International standards as reference:• IEC 61918 – Industrial communication networks – Installation of communication networks in industrialpremises• IEC 61000-5-2 – Electromagnetic compatibility (EMC) – Part 5: Installation and mitigation guidelines –Section 2: Earthing and cabling• IEC 60364-4-44 – Low-voltage electrical installations – Part 4-44: Protection for safety – Protection
against voltage disturbances and electromagnetic disturbances
Members of the JSIG are actively working with various ISO/IEC and IEC standard bodies to harmonize EtherNet/IP
specifications to the various standards. The following list of ISO/IEC, IEC, and ANSI standard groups that themembers are involved with:• ISO/IEC JTC1/SC25/WG3 – Customer premises cabling• IEC SC65C JWG10 – Industrial cabling• ANSI/TIA TR42.16 – Premises Telecommunications Bonding & Grounding
The various standard groups above work on defining the connector component, cable component, cablingperformance, fieldbus cabling. With the various members involvement, common components and performancerequirements are standardized and are not fragment between the various standards. This enables companies to havea standard physical layer cabling for the various industrial fieldbuses.

2014 ODVA Industry Conference

9©2014 ODVA, Inc.

References (optional):•••••••IEC 61076-2-109 – Connectors for electronic equipment – Product requirements – Part 2-109:
Circular connectors – Detail specification for connectors M12 x 1 with screw-locking, for datatransmissions with frequency up to 500 MHz
ISO/IEC 11801 – Information technology – Generic cabling for customer premises
ISO/IEC 24702 - Information technology – Generic cabling for Industrial premises
ANSI/TIA-1005-A – Telecommunications Infrastructure Standard for Industrial Premises
IEC 61918 – Industrial communication networks – Installation of communication networks inindustrial premises
IEC 61000-5-2 – Electromagnetic compatibility (EMC) – Part 5: Installation and mitigation
guidelines – Section 2: Earthing and cablingIEC 60364-4-44 – Low-voltage electrical installations – Part 4-44: Protection for safety –Protection against voltage disturbances and electromagnetic disturbances**************************************************************************************The ideas, opinions, and recommendations expressed herein are intended to describe concepts of the author(s) for the possible use of CIP
Networks and do not reflect the ideas, opinions, and recommendation of ODVA per se. Because CIP Networks may be applied in many diverse
situations and in conjunction with products and systems from multiple vendors, the reader and those responsible for specifying CIP
Networks must determine for themselves the suitability and the suitability of ideas, opinions, and recommendations expressed herein for intended
use. Copyright ©2014 ODVA, Inc. All rights reserved. For permission to reproduce excerpts of this material, with appropriate attribution to theauthor(s), please contact ODVA on: TEL +1 734-975-8840 FAX +1 734-922-0027 EMAIL odva@odva.org WEB www.odva.org.
CIP, Common Industrial Protocol, CIP Energy, CIP Motion, CIP Safety, CIP Sync, CompoNet, ControlNet, DeviceNet, and EtherNet/IP aretrademarks of ODVA, Inc. All other trademarks are property of their respective owners.

2014 ODVA Industry Conference10©2014 ODVA, Inc.