Technical Bulletin No. A05-135-2007
New Japan Chemical Co., Ltd.

Resin curing agent
capable of thin film curing

RIKACIDTM TBN-100


SummaryFeature






Powder acid anhydride with reduced volatilization during heat curing.
Epoxy curing coating is provided by combining TBN-100 and epoxy resinwith accelerator, and applying it to substrate, and vaporization drying
solvent, and heat curing.

The curing coating is superior inthermal resistance and initial transparency and heat yellowing resistance.
The curing coating is superior in water vapor barrier property.
The curing coating is superior in adhesion to various substrate.
The curing coating is superior in flexibility.
The curing coating is superior in solvent resistance and alkali resistance.
Curing coating having high surface hardness is provided.
Solvent solubility is relatively good.

Typical properties
Table 1. Typical properties of TBN-100
RIKACIDTM TBN-100

Remarks

Appearance

White powder－

Equivalent of acid anhydride

450～550－

Softening point[℃]90～95

Melting point measuring instrument

Registration situation of law

Not registered－※These values are not guaranteed.

１/５Technical Bulletin No. A05-135-2007
New Japan Chemical Co., Ltd.

Solvent solubility of TBN-100

The solubility in various solvents is shown in Table 2 and Table 3, and the viscosity of each 50wt% productat room temperature (25℃) is shown in Table 4.
Table 2. Solubility at 25℃. (○: dissolved, ×: insoluble)
TBN-100 concentration
Solvent

MEK※140wt%
Dissolution
Solubilitytime(h)
○
0.5

50wt%
Dissolution
Solubilitytime(h)○1.060wt%
Dissolution
Solubilitytime(h)○1.570wt%
Dissolution
Solubilitytime(h)○6.0

Ethyl acetate

○0.5

○

1.0○1.5○

6.0

Butyl acetate

○

1.0○

3.0×6.0×

6.0

○

3.0

○

3.0×

6.0×

6.0

○

6.0×

6.0×

6.0×

6.0

PGMEABCA※2※3

Table 3. Solubility at 50℃. (○: dissolved, ×: insoluble)
TBN-100 concentration
Solvent

MEK※140wt%
Dissolution
Solubilitytime(h)
○
0.5

50wt%
Dissolution
Solubilitytime(h)
○
1.0

60wt%
Dissolution
Solubilitytime(h)
○
1.5

70wt%
Dissolution
Solubilitytime(h)○6.0

Ethyl acetate

○0.5

○

1.0

○

1.5

○

6.0

Butyl acetate

○

1.0○

3.0×6.0×

6.0○

3.0○

3.0○

4.0○

4.0○

6.0○

6.0×

6.0×

6.0

PGMEA
BCA※2※3＜Evaluation method＞
TBN-100 and each solvent were added to the sample bottle so as to have a predetermined concentration,and the mixture was stirred at each temperature (25℃, 50℃), and whether or not the solution was soluble
was visually confirmed.
Table 4. Solution viscosity (E type viscometer, 25℃, TBN-100 concentration：50wt%)
Solvent

MEK※1

Viscosity[mPa・s]
30

Ethyl acetate

59

Butyl acetate

102

PGMEABCA※2※32631300※1 MEK：Ethyl methyl ketone (Nacalai Tesque, Inc.)※2 PGMEA：Propyleneglycol monomethyl ether acetate (Nacalai Tesque, Inc.)※3 BCA： 2-(2-Butoxyethoxy)ethyl acetate (Butyl carbitol acetate)(Nacalai Tesque, Inc.)

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Technical Bulletin No. A05-135-2007
New Japan Chemical Co., Ltd.

Curing condition of RIKACIDTM TBN-100

We show a curing condition of TBN-100 (in Figure 1). It can be cured at 140℃ or more / 30 to 60 minutes.

Fig 1. The relationship of Tg and curing time
＜Formulation＞ [p.b.w, Equivalent ratio = 1.0]
Epoxy Resin jER TM 828： Bisphenol A epoxy resin (Mitsubishi Chemical Corporation.)
100
Curing agent RIKACIDTM TBN-100
255
Solvent
Ethyl methyl ketone (MEK, Nacalai tesque Co., Ltd.)
255
Accelerator HISHICOLIN TM PX-4ET： Quaternary phosphonium salt (NIPPON CHEMICAL INDUSTRIAL CO., LTD.) 1＜Curing condition＞
100℃/10min(Dry) ＋ 100～180℃/15～180min(Curing)＜Test condition＞
DSC, Heating rate： 20℃/min Sample：100μ m(Film thickness)

Depend on equivalent ratio

We show a equivalent ratio of TBN-100 (in Figure 2). The most suitable equivalent ratio of TBN-100 is 1.0.

＜Foemulation＞
The formulation is the same as figure 1.
＜Curing condition＞
100℃/10min(Dry) ＋ 150℃/3h(Curing)＜Test condition＞
DSC, Heating rate： 20℃/min
Sample： 100μ m(Film thickness)

Fig 2. The relationship of Tg and equivalent ratio

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Technical Bulletin No. A05-135-2007
New Japan Chemical Co., Ltd.



Typical properties of cured epoxy resin

Table 5 shows the epoxy cured film properties and Table 6 shows the water vapor permeability of the film.
Table 5. Typical properties of cured epoxy resin
Formulation No.
jERTM 828※4
Formulation[p.b.w]
Equivalentratio = 1.0

RIKACIDTM

RIKACIDTMMEKTBN-100
MH-700※5※6

HISHICOLINTM PX-4ET※7①②Remarks

100100Epoxy equivalent = 185

255-

Equivalent of acid anhydride = 472-

89

Equivalent of acid anhydride = 164

255-

Solvent

11Accelerator

Curing condition

Typicalproperties ofcured epoxy
resin

100℃/10min(Dry) ＋ 150℃/1h(Curing)Gel time (140℃)[sec]

220

280

Tg [℃]

121

30

YI１ (After curing)

0.02

3.2

YI２ (After 150℃/5days aging)

0.61

8.4

Resistance for Thermal Yellowing ΔYI

0.59

5.2

Pencil hardness

H

5B

90°Bending resistance (PET※8)○×Alkali resistance （5%NaOH）○×

Solvent resistance （NMP）○×

Based on JIS C2161 B
DSC

ΔYI = YI2-YI1

Thickness：
100μm

Based on JIS K5600-5-4○：There is no change
×：There is change

Thickness：
30μm

TM

※4 jER 828： Bisphenol A epoxy resin (Mitsubishi Chemical Corporation)※5 RIKACIDTM MH-700： 4-methyl cyclohexane-dicarboxylic anhydryde/cyclohexane-dicarboxylic anhydryde= 70/30(wt%) (New Japan Chemical Co., Ltd.)※6 MEK： Ethyl methyl ketone (Nacalai tesque Co., Ltd.)※7 HISHICOLIN TM PX-4ET： Quaternary phosphonium salt (NIPPON CHEMICAL INDUSTRIAL CO., LTD.)TM※8 PET： Polyethylene terephthalate, 「COSUMOSHINE A4300」 (TOYOBO CO., LTD.)
Preparation of curing agent：TBN-100 was dissolved in MEK at room temperature(25℃) to give a 50wt% solution.

Table 6. Water vapor permeability of the film
Resin typejERTM 828/TBN-100※9Polyurethane※10PC※10Water vapor permeability(g/m2・24h・atm)

4.085024※9 Preparation of curing agent： TBN-100 was dissolved in MEK at room temperature(25℃) to give a 50wt% solution.
Curing condition： 100℃/10min(Dry) ＋ 150℃/1h(Curing)→ Sepalation of the film from glass substrate → 60℃/8h(Dry)Measure condition： 40℃, 90%RH
Film thickness： 25μ ｍ※10 Referance： 「Testing method and evaluation result of each dynamic characteristic of the plastic material」
Plastics, 51(6), 119 (2000)
Measure condition： 40℃, 90%RH
Film thickness： Polyurethane(25μ ｍ), PC(50μ ｍ)

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Technical Bulletin No. A05-135-2007
New Japan Chemical Co., Ltd.

Table 7 shows the adhesion to various substrates.
Table 7. Adhesive property (Cross-cut peeling test)
Formulation No.

Formulation[p.b.w]
Equivalent ratio = 1.0①②Remarks

jERTM 828※11100100

Epoxy equivalent = 185

RIKACIDTM TBN-100

255-

Equivalent of acid anhydride = 472

RIKACIDTM MH-700※12-89

Equivalent of acid anhydride = 164

MEK※13255-Solvent

HISHICOLINTM PX-4ET※141

1

Accelerator

Curing condition
Thickness[μm]Initial adhesion

Boiling adhesion(100℃/1h)-

100℃/10min(Dry) ＋ 150℃/1h(Curing)
30-Steel plate※15○×PC※16○×PET※17○×PI※18○×

Copper plate※19○×PC※16○×PET※17○×

Based on JIS K5600-5-6○：There is no detachment
×：There is detachment※11 jER TM 828： Bisphenol A epoxy resin (Mitsubishi Chemical Corporation)
TM※12 RIKACID MH-700： 4-methyl cyclohexane-dicarboxylic anhydryde/cyclohexane-dicarboxylic anhydryde= 70/30(wt%) (New Japan Chemical Co., Ltd.)※13 MEK： Ethyl methyl ketone (Nacalai tesque Co., Ltd.)※14 HISHICOLIN TM PX-4ET： Quaternary phosphonium salt (NIPPON CHEMICAL INDUSTRIAL CO., LTD.)※15 Substrate： Extension steel plate (Nippon Testpanel Co., Ltd.)※16 PC： Polycarbonate (Commercial product)※17 PET： Polyethylene terephthalate, 「COSUMOSHINE TM A4300」 (TOYOBO CO., LTD.)※18 PI： Polyimide, 「KaptonTM 100EN」 (DU PONT-TORAY CO., LTD.)※19 HULL CELL CATHODE PLATE (YAMAMOTO-MS Co., Ltd.)Inquiry
Please contact us at the following address, if you want to ask about these Technical Bulletin.
New Japan Chemical Co., Ltd. （http://www.nj-chem.co.jp/en/)

Osaka head office Polymer Materials Marketing ＆ Sales Dept. Marketing ＆ Sales Division
Bingomachi Nomura BLDG., 2-1-8, Bingomachi, Chuo-ku, Osaka 541-0051
Tel. ＋81-(0)6-6203-3962 FAX. ＋81-(0)6-6202-7784
Tokyo office Polymer Materials Marketing ＆ Sales Dept. Marketing ＆ Sales Division
GREEN OAK KAYABACHO., 1-3-3, Sinkawa, Chuo-ku, Tokyo 104-0033
Tel. ＋81-(0)3-5540-8106 FAX. ＋81-(0)-3-3297-1251

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