Technical Review Board Update

Technical Trackwww.odva.org

Objective of This Session
Provide an overview of the recent andplanned technical activities of theorganization.
• TRB introduction and update• Special Interest Group (SIG) updates• EtherNet/IP Workshop update

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 2www.odva.org

Technical Review Board
Roster

Chair, Rich Harwell (Eaton)• Dave VanGompel (Rockwell Automation)• Ludwig Leurs (Bosch Rexroth)• Rudy Belliardi (Schneider)• Paul Didier (Cisco)• Jeff Jurs (Omron)• To Be Appointed (Endress + Hauser)• Damien Leterrier (Molex) (Member elected)• Joakim Wiberg (HMS) (Member elected)• Alain Grenier (ODVA)Click to insert presentation title
TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 3www.odva.org

TRB Organization and Work Flow
SpecialSpecialSpecialInterest
SpecialInterest
Interest
Group
Interest
Group
Group
Group
EIP
WorkshopUpdateSpecificationsSet

TRB Update© 2012 ODVA, Inc.

Set SIGWork Plans
Submit SE
Or TDEODVA
Staff(Conformance
Authority)

Technical
ReviewBoard
Approved
SE or TDE
Update (TRB review)

UpdateConformance
Tests
2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

Policies
and Procedures

page 4www.odva.org

SIG Reports
•
•
•
•
•
•
•
•
•
•
•
•
•

EtherNet/IP Physical Layer- Bob Lounsbury
DeviceNet Physical Layer – Brad Woodman
EtherNet/IP Infrastructure – Mark Rossi
EtherNet/IP System – Brian Batke
Distributed Motion SIG – Steve Zuponcic
CompoNet – Tianbing Li
Conformance – Alain Grenier
Modbus Integration – Todd Snide
Energy Initiative – Rick Blair and Rich Morgan
CIP Safety – Paul Kucharski
Semiconductor – Rolf Enderes
CIP System – Dave VanGompel
EtherNet/IP workshop – Kevin Knake (NA), Viktor Schiffer(Europe)
TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 5www.odva.org

EtherNet/IP Physical Layer
Roster

Chair: Bob Lounsbury (Rockwell Automation)
V-Chair: Brian Shuman (Belden)• 25 Member Companies• Companies with Voting Rights 4• 48 Members

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 6www.odva.org

EtherNet/IP Physical Layer
MemberName

Company
Name

MemberName

Company
Name

MemberName

CompanyName

Harmon, John
Ramler, Jim
Shuman, Brian
Koditek, Frank
Schmidt, David
Migliorati, Juri

Balluff
Balluff
BeldenBeldenCamozzi SpA
Camozzi SpA

Klecka, Rudy
McGaughey, Reid
Fernald, Darrell
Bertelsen, Torben
Latino, Frank
Mulligan, Paul

Cisco Systems, Inc.
Cisco Systems, Inc.
Cooper Interconnect
Dan Foss
Festo Corporation
FiberFin, Inc.

Tom Williams
Mike Balekdjian
Offner, Arnold
Horrmeyer, Bernd
Yi, Kristy
Cicerchi, Timothy

Garstkiewicz, Edmund

Harting, Inc. NA

Steidl, Steve

Innovasic Semiconductor

Johnston, ScottShea, Jill

Harting, Inc. NA

Wehrenberg, Michael

Kendall Electric Inc.

Tanvi Desi

Metz Connect (BTR)
Metz Connect (BTR)
Phoenix Contact
Phoenix Contact
Phoenix Contact
Pepperl + Fuchs
RockwellAutomation/AllenBradley
RockwellAutomation/AllenBradley

Craig Zagorski

Harting, Inc. NA

Mitukiewicz, Rick

Metz Connect (BTR)

Ayanle, Abdi

Harwell, Richard

Eaton

Roland Dold

Metz Connect (BTR)

McGonigle, Kevin

Woodman, Brad

Molex Incorporated

Crane, David

ODVA

Wess, Thomas

Mallozzi, Meghan

3M

Grenier, Alain

ODVA

Lounsbury, Robert E.

Elliot, Bob

PanduitDan McGrath

Panduit

Zomcheck Kevin

Turk Inc
Tyco Electronics
Corporation
Tyco Electronics
Corporation
RockwellAutomation/AllenBradley
RockwellAutomation/AllenBradley

Reid, RobertPanduit

Rossi, Mark

Schneider Electric

Adragna Jean-Jacques

Schneider Electric

Harper Gary

Schneider Electric
Weidmueller Interface
GmbH & Co. KG

Unni MohananSchneider Electric

Short, Ken

Schneider Electric

Nicholson, Richard

SMC

Seereiner, Simon
TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 7www.odva.org

EtherNet/IP Physical Layer
Accomplishments since 14th Annual
MeetingProgress on Grounding and Bonding covering all
ODVA Physical Layers
Progress on re-order of Chapter 8• Definition of 1Gig Cabling• Coordination with TIA and ISO/IEC• End2End Link




1 ESE to release new 1G connector
Release of Planning and Install IEC 61784-5-2
ControlNet
EtherNet/IP

TRB Update© 2012 ODVA, Inc.

DeviceNet2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 8www.odva.org

EtherNet/IP Physical Layer
Proposed plans: Next 12-18 months









Complete Grounding and Bonding
Complete and release 1 Gig Cabling
Complete and release new Chapter 8Update EtherNet/IP Planning and Install Manual
Add End to End Link definition to Chapter 8
Track and Coordinate activities in TIA
Track and Coordinate activities in ISO/IEC
Track and Coordinate activities in IEC
SC65C/JWG10TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 9www.odva.org

DeviceNet Physical Layer
Roster

Chair: Brad Woodman (Molex)• 14 Participants representing 11 companies– 8 Active participants representing 7 companies

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 10www.odva.org

DeviceNet Physical Layer
Accomplishments since 14th Annual
MeetingProvided comments on IEC 61784-5-2 Annex C to
US TAG
Updated Planning and Install Guide for DeviceNet

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 11www.odva.org

DeviceNet Physical Layer
Proposed plans: Next 12-18 monthsHarmonize the current Planning and Install Guide
to the IEC Planning and Install Guide
Update all cable profiles with the maximum drop
current
Clarifying transceiver timing issues

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 12www.odva.org

EtherNet/IP Infrastructure SIG
Roster

Chair: Mark Rossi (Schneider Electric)• Active Participants– Belden Hirschmann – O. Kleineberg, M. Höglinger, J. Mower– Cisco Systems – P. Didier, Y. Nguyen– General Motors – G. Workman– Innovasic Semiconductor – J. Woods– Moxa – E. Lee, N. Sandoval, J. Toepper– N-Tron – T. Oberkirch– ODVA – D. Crane, A. Grenier– Rockwell Automation – B. Batke, M. Hantel, A. Moldovansky, S.
Piyevsky– Schneider Electric – G. Ditzel, B. LeRette, J. Li, M. Rossi T. Snide– Tyco Electronics – K. McGonigle• Other Member Companies– Anixter, Bernecker + Rainer, Danfoss, Delta Computer Systems,
Eaton, Festo, Murrelektronik, Omron, Panduit, Phoenix Contact,
Shanghai Electrical, SMC,, Wago, Weidmueller

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 13www.odva.org

EtherNet/IP Infrastructure SIG
Accomplishments since 14th Annual
Meeting

The following topics have been developed andhave since been published as part of the current
Volume 2 specification• Managed Ethernet Switch Device Profile• Base Switch Object• RSTP Bridge Object• RSTP Port Object



PRP Object• Submitted for consideration by TRB

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 14www.odva.org

EtherNet/IP Infrastructure SIG
Focus for the next 12-18 months









Appendix A (WIP) for improving PUB35
DLR Whitepaper (WIP)
Define the Interoperability Test requirements andrecommendations for Infrastructure devices according toAppendix A (WIP)
Create the Interoperability Test Plan for Infrastructure
Devices based on the Test Requirements andRecommendations
Support the development of the Conformance Test Plan for
Infrastructure Devices according to Managed Switch Profile
Address infrastructure support requests from TRB and
Conformance Lab as requested

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 15www.odva.org

EtherNet/IP System Architecture
Roster

82 members; 32 different companies
Chair: Brian Batke (Rockwell Automation)
Active Participants:

Ludwig Leurs, Bosch-Rexroth
Joakim Wiberg, HMS
Jamin Wendorf, Real-Time
Automation
Ovidiu Adam, Phoenix Contact
Mike Mann, Pyramid Solutions
Todd Snide, Schneider Electric
Dennis Dube, Schneider ElectricGeorge Ditzel, Schneider Electric

TRB Update© 2012 ODVA, Inc.

Bill Lerette, Schneider Electric
Gary Baczkowski, Rockwell
Automation
Darren Klug, Rockwell Automation
Plus: Occasional participants as
subject matter warrants.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 16www.odva.org

EtherNet/IP System Architecture
Accomplishments since 14th Annual
Meeting
Approved ESEs:
243-010: SNMP Support (new capability)
001-046: DLR Gateway (new capability)
590-001: QoS Clarification
170-003: Encapsulation Options Clarification
090-004: EDS Clarification
001-044: Admin State Clarification
590-002: ACD Clarifications
090-007: ACD Clarifications



TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 17www.odva.org

EtherNet/IP System Architecture
Proposed plans: Next 12-18 monthsAddress urgent issues as they arise, in particular
relating to conformance
Review Single Wire Coexistence Application Guide
when available (not started)
Complete specification work on EtherNet/IP
support of IPv6 (in progress)
Begin work on EtherNet/IP security, based on
input from Task Force and TRB (not started)

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 18
www.odva.org

Distributed Motion SIG
Roster Chair:

Steve Zuponcic (Rockwell Automation)• Participants
Chaffee, Mark
Cooper, Mark
Demassieux, Valerie
Grenier, Alain
Harris, Ken
Hirschinger, Bob
Knudsen, Chris
Lee, Darek
Li, Hongbin
Nachtwey, Peter
Orehawa, Luke
Ratliff, Cortland
Rossi, MarkSaravanan, Pradeep
Tormanen, Quinton
Wehrenberg, Michael
Wiese, Todd
Zuponcic, Steve
Harwell, Richard*

Rockwell Automation
Rockwell Automation
Rockwell Automation
ODVA
Rockwell Automation
Rockwell Automation
Yaskawa Electric
Yaskawa ElectricApplied Materials, Inc
Delta Computer Systems Inc.
Control Techniques PLC
SMC Corporation
Schneider ElectricPower Electronics S.L.
Delta Computer Systems, Inc.
Kendall Electric Inc.
Rockwell Automation
Rockwell Automation
Eaton Electrical
Distributed Motion jSIG Activities Update

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 19
www.odva.org

Distributed Motion SIG
Accomplishments since 14th Annual MeetingUpdated CIP Sync Time Sync Object• Clarified attributes that should be designated as non-volatile

Improved CIP Motion Device Axis Object based oncontinued development and product implementation.
• Included Additions, Changes, Clarifications and Corrections

Improved CIP Motion Device Profile based on continued
development and product implementation.
• Included Additions, Changes, Clarifications and Corrections

Started the CIP Motion Controller Axis Object Definition
Started Peer to Peer Connection definition for sharing realtime motion control information among peer devices.
• Inter-vendor and Intra-vendor coordination for real-time electronic
line-shafting and camming applications

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 20www.odva.org

Distributed Motion SIG
Proposed plans: Next 12-18 months
Peer to Peer Connection Object Definition• Definition and Specification• Plan for a Multi-Vendor “Plug-Fest” for Testing and
Debugging

Motion Controller Axis Object Definition (MCAO)• Continue Definition and Specification• Corollary to Motion Device Axis Object (MDAO) alreadypublished and standardized.

Continued Enhancements to existing MDAO and
CIP Motion Device Profile

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 21www.odva.org

CompoNet SIG
Roster

Chair: Tianbing Li (OMRON)• Participants: 12
Brad Woodman,
Yasuhito Inamori,Takeshi Sugimoto
Hideki Harada, Tianbing Li
Bill Henry, Alain Grenier
Bernd Horrmeyer
Bob Lounsbury
Peifeng Xi
Yoshihiro Tanabe,
Qiang Peng

TRB Update© 2012 ODVA, Inc.

Molex Incorporated
Nichigoh CommunicationElectric Wire Co. Ltd
OMRON
ODVA
Phoenix Contact
Rockwell Automation
SEARI
SMC Corporation
Tokyo Keiso Co. Ltd

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 22www.odva.org

CompoNet SIG
Accomplishments since 14th Annual
MeetingNo official activities in the SIG
Part of participants collaborated on moving
CompoNet to national standards(JIS/GB)• Waiting for final approval from authorities respectively

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 23www.odva.org

CompoNet SIG
Proposed plans: Next 12-18 months


Editorial Corrections• To correct editorial errors found in IEC/JIS/GB standard
development

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 24www.odva.org

Conformance SIG
Roster

Chair: Alain Grenier (ODVA)• 42 SIG members registered• Average attendance is about 5 plus 2 ODVA staff
members• Meetings frequency is once a month – the first
Wednesday of every month at 10:00 AM ESTMission:• Support and work cooperatively with the ODVA
Conformance Authority to enhance and improve theoverall quality and effectiveness of the conformance
testing practice for the complete family of CIP Networks

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 25www.odva.org

Conformance SIG
Accomplishments since 14th Annual
MeetingConformance Test Suites Released• EtherNet/IP CT9 & CT9 Update (Nov 2011 & Aug 2012)• EtherNet/IP CT10 (Oct 2012)• DeviceNet CT24 (July 2012)



Test Plans Approved• Time Sync Test Plan
• DLR Test Plan
• QoS Test Plan
• ACD Test PlanTRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 26
www.odva.org

Conformance SIG
Proposed plans: Next 12-18 months
Working with ODVA CA on the planning for the
new content to incorporate into conformance test
suites• EtherNet/IP CT11 and Generation 2• DeviceNet CT25



Finalize and Approve test plans for:• Position Sensor Object• Connection Configuration Object• Originator/Scanner functionality• TCP/IP and Ethernet Link object manual testing

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 27www.odva.org

Conformance SIG
Proposed plans: Next 12-18 months
Working with ODVA CA on the planning for the
new content to incorporate into conformance test
suites related to Specification Enhancements
approved by the ODVA TRB

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 28
www.odva.org

Modbus Integration SIG
Roster

Chair: Todd A. Snide (Schneider Electric)• Participants
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–

Belliardi, Rudy - Schneider Electric
Bertelsen, Torben - Danfoss
Blair, Rick - Schneider Electric
Crane, David - ODVADube, Dennis - Schneider Electric
Goehrig, Alexander - SEW Eurodrive GmbH
Grenier, Alain – ODVAHeijma, René - Omron Corporation
Kulkarni, Aditi - ProSoft Technology, Inc.
Leterrier, Damien - Molex Incorporated
Li, James - Schneider ElectricMann, Michael - Pyramid Solutions, Inc.
Pålsson, Joel - HMS Industrial Networks AB
Ratliff, Cortland - SMC Corporation
Schiffer, Viktor - Rockwell Automation
Scott, Eric - Molex Incorporated
Semrow, Greg - ABB Inc.
Telljohann, Pat - Rockwell Automation
VanGompel, Dave - Rockwell Automation
Vasko, David - Rockwell Automation
Wester, Ken - Schneider Electric
Xue, Ji - SEARI Group Co. Ltd.
Zeng, Qi – ODVA

• Bold indicates active participants

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 29
www.odva.org

Modbus Integration SIG
Accomplishments since 14th Annual Meeting

Held 50 Modbus Integration SIG meetings• Meetings are held every 2nd and 4th Tuesday of the month

Published TDE-243-002 Modbus Integration EDS White
Paper
Submitted multiple specification enhancements• CIPSE-170-005 Modbus Object• MISE-170-005 EDS Chapter Cleanup• MISE-243-004 Error Handling for non-settable Modbus
registers• MISE-170-004 Network LED behavior• MISE-243-005 Object Model of the Translator• MISE-243-006 Object Model of the Translator, Part 2• CIPSE-170-004 Modbus Translation Device TypeTRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 30
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Modbus Integration SIG
Proposed plans: Next 12-18 monthsComplete pending specification enhancements• MISE-170-005 ModbusParamN EDS Keyword• MISE-001-005 Modbus Integration Chapter 1 & 7 Cleanup

Develop the functionality to allow CIP Object mapping
within the Modbus translation function to better utilize thecapabilities of a Modbus device inside the CIP environment• Object mapping focusing first on the Energy Object(s)• Followed by more general object mapping methodologies



Investigate automated methods to insert Modbus device
specific information into the Modbus translation function.
• XML, DTM, etc.

Investigate the impact IPv6 on Volume 7

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 31www.odva.org

Energy Applications SIG
Roster

Co-Chairs:

Rick Blair (Schneider Electric)
Rich Morgan (Rockwell Automation)
Active members• Schneider Electric: Rudy Belliardi, Marc Geneau, Ulrich
Kaemmerer, Mark Rossi, Todd Snide• Rockwell Automation: Dave Brandt, John Caspers, Cliff
Whitehead• Cisco Systems: John Parello• Molex: Eric Scott

Other participants• Omron, Panduit, Eaton, Weidmueller, SMC

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 32
www.odva.org

Energy Applications SIG
Accomplishments since 14th Annual
MeetingEnergy Initiatives SIG established
Energy Awareness (phase 1) published Nov. 2011
• Base, Electrical, Non-electrical Energy Objects• At-a-glance published

Power Management (phase 2a) published May,2012
• Power Management Object – power reduction during idle
states• Wake-on-LAN specification for EtherNet/IP• At-a-glance published• Working on a clean-up CIPSETRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 33
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Energy Applications SIG
Marketing activity supportAt-a-glance documents published• Energy Awareness: Dec 2011
• Management of Energy Usage: April, 2012Webinars and workshop sessions• Energy Awareness Webinars– Ann Arbor, Jan 2012
– Germany, Mar 2012

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 34
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Energy Applications SIG
Proposed plans: Next 12-18 monthsEnergy Management (phase 2b) CIPSE – power
reduction during operational states
Conformance development for PowerManagement Object
Energy application profile proposal• Unified presentation of energy, power and energy
management• Higher level than device profile

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 35
www.odva.org

Semiconductor SIG
Roster

Chair: Rolf Enderes (INFICON AG)
Participants

TRB Update© 2012 ODVA, Inc.

FirstName
Patrick
Jochen
Dave
Gary
Chris
Rolf
Yukimasa
Jamie
Larry
Oscar
Alain
Bill
HiroshiToshihiro
Hongbin
Frank
Bala
John
Arun
MakatoCortland
Mark
Bill
Ariel
WarnerYi-Li
Masatoshi
Mike

LastName
Albright
Boettcher
Chamberlain
ConnerEllec
Enderes
Furukawa
Gallant
Glentz
Gomez
GrenierHenry
Ito
KashimaLi
LatinoMohammed
Morin
Nagarajan
Ogawa
Ratliff
Rossi
Rothrock
Tabangcura
ThelenTsai
Tsuruoka
WestraEmailpatrick.albright@hitmet.com
jochen.boettcher@pfeiffer-vacuum.de
dave_chamberlain@mksinst.com
gary.conner@brooksinstrument.com
chris.ellec@brooksinstrument.com
rolf.enderes@inficon.com
yukimasa.furukawa@horiba.com
jamie.gallant@molex.com
lglentz@watlow.com
oscar_gomez@amat.com
agrenier@odva.org
whenry@odva.org
hiroshi.ito@omron.com
toshihiro.kashima@horiba.com
hongbin.li87@gmail.com
frank_latino@festo.com
bala_mohammed@amat.com
john_morin@comdel.com
arun.nagarajan@hitmet.com
makoto_ogawa@omron.co.jp
cratliff@smcusa.com
mark.rossi@schneider-electric.com
bill.rothrock@pivotalsys.com
ariel.tabangcura@horiba.com
wthelen@parker.com
yili.tsai@horiba.com
masatoshi_tsuruoka@omron.co.jp
mike.westra@aei.com

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

Company
Advanced Energy Industries, Inc.
Pfeiffer Vacuum GmbHMKS Instruments, Inc.
Brooks Instrument
Brooks Instrument
INFICON AG
Horiba-STEC Inc.
Molex Incorporated
Watlow
Applied Materials
ODVA
ODVA
Omron Corporation
Horiba-STEC Inc.
Applied Materials
Festo
Applied Materials
Comdel Inc.
Hitachi Metals Ltd
Omron Corporation
SMC Corporation
Schneider Electric
Pivotal Systems
Horiba-STEC Inc.
Parker Hannifin Corp.
Horiba-STEC Inc.
Omron Corporation
Advanced Energy Industries, Inc.

page 36www.odva.org

Semiconductor SIG
Accomplishments since 14th Annual
MeetingChange on SEMI Interface Guidelines andConformance Test Procedures
voted and in preparation to be sent to TRB• CAN BIT Sampling Point– If possible >83%

• Clarification of Isolation Verification
Discussion about definitions of new profiles for
SEMI Devices• Drawn back from different vendors

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 37
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Semiconductor SIG
Accomplishments since 14th Annual
MeetingDiscussion about Conformance Test Plan for
Turbomolecular Pumps• Drawn back by vendor



Turbo Pump Device Profile• Correction of Device Type Definiton

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 38
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Semiconductor SIG
Accomplishments since 14th Annual
MeetingLong discussion with Applied Materials about• Handling of secure or controlled File Download (password
protected or something like that)• CAN Error Detection during Conformance Test
– Drawn back by Applied

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 39
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Semiconductor SIG
Accomplishments since 14th Annual
Meeting

Dormant CIPSE’s drawn back by Brooks andApplied•••••CIPSE-246-010-03
CIPSE-246-011-03
CIPSE-246-012-03
CIPSE-246-013-02
CIPSE-101-001-02

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 40
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Semiconductor SIG
Accomplishments since 14th Annual
Meeting

Request on Process Control Valve Profile• Change Manufacturer Exception Detail Size to any
length– Drawn back

Discussion about change of the Conformance Test
to check the CAN CONTROLLER ACCEPTANCEFILTER possibility– Drawn back

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 41www.odva.org

Semiconductor SIG
Accomplishments since 14th Annual
Meeting

Request for New I/O Assembly for Mass Flow
Controller• Adding a setpoint ramp is a wish of Applied Materials.
– Drawn back

Discussion with the CTL about a problem in the
S-Device Supervisor definition with Perform Diag
Service while in Abort• CIPSE will be written soon

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 42www.odva.org

Semiconductor SIG
Accomplishments since 14th Annual
MeetingClarification of an attribute definition in the SAnalog Sensor / Subclass Diaphragm Gauge• CIPSE will follow soonDiscussion with the CTL about a new defintion ofa «Generic» Device Type in the S-Device
Hierachy.
• Rejected

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 43
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Semiconductor SIG
Accomplishments since 14th Annual
MeetingCurrently reworking S-Single Stage Controller• Inst. ID 7 – Process Variable is defined as “Notaccessible over the network”– CIPSE will follow

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
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page 44
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Semiconductor SIG
Proposed plans: Next 12-18 months
Proposed plans: Next 12-18 months
In General:









Definition of new object classes and behaviors inside the CIP
specification related to devices used in semiconductor equipment.
Definition of new device profiles inside the CIP specification
related to devices used in semiconductor equipment.
Review and change management of existing object classes anddevice profiles in case of specification errors or enhancements tothe object class like new attributes, new services or
new/additional behavior.
Working directly with the TRB during the TRB review of thecurrently proposed CIPSE’s and new specification documents.
Working directly with the Conformance Authority of ODVA todefine conformance test plans.
Definition of special guidelines for the use of devices used on
semiconductor manufacturing tools
Review SEMI organization standards and align ODVA
semiconductor specification as appropriate

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

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CIP System Architecture SIG- CIP, CNet, DNet Spec Volumes -Roster : 47, Monitoring or Inactive Members : 38

Chair – Dave VanGompel, Rockwell Automation
Active Participants : 8• Rick Blair, Schneider Electric• Perry Green, Pyramid Solutions• Darren Klug, Rockwell Automation• Viktor Schiffer, Rockwell Automation• Eric Scott, Molex• Todd Snide, Schneider Electric• Pat Telljohann, Rockwell Automation• Joakim Wiberg, HMS

Occasional Participants : 1• Quinton Tormamen, Delta Computer Systems



Monitoring or Inactive Members : 38

Held Meeting #543 on October 1, 2012
• 66 SIG meetings since last annual meeting• Standing meeting weekly, Mondays @ 9:30am ET-USTRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

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CIP System Architecture SIG
Accomplishments since 14th Annual
Meeting

25 SEs (23 CIPSEs, 1 DSE, 1 CSE)

CIPSE-001-144 - Target Connection List Object

Online readback of test , default& other Connections supported

CIPSE-001-166 – EDS clarifications V

c/u

CIPSE-001-179 – EDS Parameter Link Scaling

c/u

CIPSE-090-005 – EDS Section Keywords

c/u

CIPSE-527-001 – Turbomolecular Vacuum Pump
Device Profile Device Type Labelc/u

CIPSE-001-174 - Extended Logical Segments for
sub-attribute addressing

Addressing data within simple &complex structures

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
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CIP System Architecture SIG
CIPSE-001-148 – EDS, PortN, Port Type Definition

c/u

CIPSE-001-178 - FwdOpen Extended Status Code
Deprecation Clarification

c/u - beware

CIPSE-170-001 – Client Connection Trigger Type andSequence Count Behavior

c/u – also covers cyclic, change ofstate,sequence counts

CIPSE-001-176 - Bit String Variants

Selectable Assem members basedon bits

CIPSE-001-157 – Correct Open CCO EDS examples

c/u

CIPSE-090-006 – Get & Set All Layout Structure

c/u –TRB request

CIPSE-590-002 - Inactivity/Watchdog Timeout
Clarifications

c/u

CIPSE-590-003 - MaxInst Correction

c/u

CIPSE-001-181 – Vendor specific extended network
segment range

c/u

CIPSE-001-182 - Connection Manager AttributeName Corrections

c/u

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

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CIP System Architecture SIG
CIPSE-001-188 – Service not supported forspecified path

Existing error code too broad (e.g.
Get & Clear service of Enet Link Obj)CIPSE-001-175 – EDS Clarification VI

c/u

CIPSE-243-005 – Modbus Clarifications

c/u

CIPSE-001-193 – Identity Object Clarification

c/u, instance#1 shall exisit

CIPSE-008-010 – Odometer Data Type Definitions

New, Constructed Data Types (0xB0)

CIPSE-001-195 – Network Segment Position inConnection Path

c/u

CIPSE-001-199 – Set_Attribute_Single Service
Correction

c/u

CSE-001-075 – ControlNet EDS Chapter Cleanupc/u

DSE-001-110 – DeviceNet EDS Chapter Cleanupc/u

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
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page 49
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CIP System Architecture SIG
Proposed plans: Next 12-18 months


CIPSEs to support TRB Directive(s)• Fill EDS gaps to support migration from STC  EDS for conformance
testing• Require Device’s EDS be a reasonable match of its capabilities• Add EDS constructs for new Logical Addressing types



CIPSE(s) to support ENet/IP Workshop activities• Improve troubleshooting of communications in ENet/IP
Add constructs for High Option Devices (Obj, EDS)
• Build to order (vs Modular Devices)

Dynamic EDS for highly configurable/programable devices
Several cleanup CIPSEs and DSE in queue
64 Job Jar items, needs culling• 32 prioritized, 32 unprioritized• Define Obsolete vs Deprecated• Fix “conditional” items that have no conditions defined• Common sense Electronic key wildcard restrictions w/VendSpec app
path(s)TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
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2013 Workshop Projects
Project List for 2013:
Finalize low-cost performance test tool, publish on ODVA web
site

1.

•

Change PlugFest procedure to use low cost tool

Create device level EtherNet/IP Diagnostics recommendations

2.

•
•

Multi-vendor demo
Move to SIG for specification enhancement

PlugFest Generation 2 Testing implementation

3.

•
•
•

TRB Update© 2012 ODVA, Inc.

Define Conformance Test levels
Move most of current interoperability testing to conformance test
Add to PF G2–Multiport EtherNet/IP Interoperability–
Expand Originator / Scanner testing–
Expand system test cases

2012 ODVA Industry Conference & 15th Annual Meeting
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2013 Workshop Projects
Project List for 2013:
Interoperability Recommendations

4.
•

Multiport EtherNet/IP Interoperability

5.

IPv6 multi-vendor prototype

6.

Move relevant content from General Recommendations for
EtherNet/IP Developers (Pub 100) into EtherNet/IP Quick Start
for Vendors (Pub 213)

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
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2013 Workshop Schedule
Proposed Workshop Events


WS#37• Date: February 19-20, 2013
• Location: TBD

PlugFest#17• Date: May 7-8, 2013
• Location: ODVA HQ - Ann Arbor, Michigan



WS#38
• Date: August 13-14, 2013
• Location: TBD

TRB Update© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
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