Leveraging 5G Networks & EtherNet/IP: Unleashing the Power of TSN, Clustered
Networks, and Deterministic Connectivity for Sensor-to-Cloud Architecture
Jegajith P.T
Technical Director - Industrial Technologies
Utthunga

Outline• Smart Manufacturing & OT-IT Convergence• 5G in Smart Manufacturing• 5G & Relevance of ISA-95 Purdue Model• Typical Network Architecture for EtherNet/IP + Private 5G• Integrating EtherNet/IP with 5G• OSI Layer Breakdown• Blended Architecture• MVP for 5G Testing• Reference Design• Hardware Architecture• Functional Architecture• EtherNet/IP with Private 5G – Use Cases & Applications• Conclusion

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Level 3

Plant Operation &ManagementMES

Level 2SCADASupervisory
Control

Level 1

Process
Control

PLC

I/O

Level 0Field Devices
Field Devices

Sensors

Field Devices

Sensors

ANSI / ISA-95 (ISO 62264) MODEL

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VM

Analytics
Digital Twins

Reporting
Virtual WAN

IIoT Field
Devices

OT + IT

ERP

Digital Transformation (Profitability, Flexibility..)
Data view at enterprise level
High upgrade cost
Cyber not designed, No common platform forcyber monitoring

Convergence to heterogeneous Network

Level 4Enterprise & BusinessIntelligence••••

Microservices/TCP/IP Ethernet/Wi-Fi/5G/OPC/MQTT/Ddta
Diode…….

Smart Manufacturing & OT-IT Convergence

IIOT / CLOUD / SERVICES INTEGRATION

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5G in Smart Manufacturing

The 5G specifications defined by 3GPP include the following elements that make it thenext big thing for intelligent factories:

1. QoS (Quality of Service): 3GPP has defined four parameters for 5G based on the types of traffic,••

Periodic Deterministic Traffic: Stringent requirements are defined.
Aperiodic Deterministic Traffic: No pre-set sending time, but stringent requirements interms of timeliness and availability are defined.

••

Non-Deterministic Traffic: Specifying lesser stringent requirements.

Mixed Traffic: Minimum stringent requirements.

2. End-to-End Latency: As less as 0.5 milli second that goes up to 500 milli seconds
3. Data Rate: Up to Gbits/second

High-band or millimeter wave (mmWave) 5G
High speed but short range. High band 5G frequencies range from 24 GHz to 100 GHz,

4. Communication Service Availability: 99.9% to 99.999999%

making it incredibly fast - enabling multi-gigabit per second speeds. But these high

5. Seamless integration with wired technologies on the same machines

short distances.

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frequencies cause trouble going through buildings and walls, making it useful only for

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5G & Relevance of Purdue Model
VLANs per Layer

EnterpriseAppsInternetIT Firewall

Inter Cell SwitchCell Firewall

Cell Firewall

Layer 1

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Cell Switch

CellSwitch

Layer 0Controller

Connected
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RTU
PLC

Sensor

RTU
PLC

Controller

Connected
Machinewww.odva.org

SensorLayer 2 VLAN

HMI
Systems

Cell Layer 1 VLAN00

NTP
WLAN

PLC VLANMES

Layer 3 VLANOT Firewall

Layer 3.5 VLANIT Firewall
RemoteAccessCell 1RTU
PLC

Enterprise
VLAN

Layer 4/5
HMI

Layer 25G NRCore Cluster

Automation
Devices

Layer 3DMZ

Alert
Devices

IT Core Switch

Layer 3.5Enterprise
AppsConnected
Machine5

Typical Network Architecture for EtherNet/IP + Private 5G

Private 5G Network

5G Cellular Network

MCU Hardware• A typical Ethernet-IP device has an EtherNet/IP Slave Device; for example, Motion Control Driver,the EtherNet/IP Object will be Motor Object.
• The same EtherNet/IP setup is referred to for bringing in 5G Integration.

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OSI Layer Breakdown – Integrating EtherNet/IP with 5G
Drive object

USER LAYER

CIP Application

Application/ServiceAPPLICATION LAYEROpen Transfer Protocol

Implement IO

UDP Packets

TRANSPORT & DATA LINK LAYER

Physical Layer

PHYSICAL LAYERAPPLICATION LAYERPRESENTATION LAYERSESSION LAYER
TRANSPORT LAYER

Network Layer

NETWORK LAYEROpen Wireless Architecture

DATA LINK LAYERPHYSICAL LAYER

STANDARD ETHERNET PHY

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Blended Architecture – Integrating EtherNet/IP with 5G

APPLICATIONSESSIONS CONTROL
TRANSPORTNETWORKPHYSICAL

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▪ Motion Control Ethernet / IP Objects

1/3

STM 32▪ Implicit I/O Message▪ Common Connection Object CIP Application

SPI▪ UDP Protocol▪ Addressing

5G Modem▪ Signaling & Low-Level Comms

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Blended Architecture – Integrating EtherNet/IP with 5G

2/3▪ Device Profile▪ Explicit/Implicit Communication

CIP Layer

SOC-1▪ Connection Management▪ UDP / TCP

UDP▪ (IP)

5G Modem
MTP▪ Ethernet MAC

Wireless
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9Blended Architecture – Integrating EtherNet/IP with 5G

STM32
Ethernet / IP Stack

5G Modem

3/3

P5G
BASE STATIONIO Device
5G MODEM

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PC Based Host OR HMI
WITH ETHERNET/IP MASTER

10MVP for 5G Testing
Private 5G Network
Micro PCI
5G Modem

5G Modem

MCU•••

Modem Driver
Ethernet IP Slave Device
I/O Controller Python Application

PC Application
EtherNet-IP MasterNODE-1
NODE-2•Motor Control Application

I/O Interface

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NODE-N

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Reference Design – Hardware Architecture

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Reference Design – Functional Architecture
USB-CDC
Application

The above architecture describes the high-levelsoftware/firmware
architecture
ofa5G-based
Ethernet/IP Device, which can control a DC motor's speed
and handle some of the I/O functions.
••••

Encapsulation for EtherNet/IP to work with 5G.
This architecture describes the message handlingbetween the two SoCs.
The two SoC hardware are interconnected over an SPI
bus to have a maximum 10mbps connection.
Inter-chip connection over serial (UART) interface with a
USB-CDC connection device class was used toconfigure the SoCs.

HW-1

CIP▪
▪
▪
▪
▪

▪ Motor Controller▪ I/O Module

Device Profile

User Application
Motor On/OffPWM Controller
I/O On-Off
I/O Control

Implicit Communication

UART Config App
SPI UART Data Packets

GSM Message Handler SOC 1

UDP Framework

GSM Message Handler SOC 2

Network HandlerHW-2Config Manager

UART

Physical Layer Handler▪

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Drive Power▪

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Network▪

RF Profile

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EtherNet/IP with Private 5G – Use Cases & Applications
Cloud

EtherNet/IP
Controller

TSN Grand
Master Clock

5G

Motion Control& Robotics

Motor Controller
Private 5G Network

EtherNet/IP
Controller

5G

Automated
Guided Vehicles

I/O Module
EtherNet/IP
MasterTechnical Track© 2023 ODVA, Inc.

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14Conclusion•The amalgamation of 5G networks with EtherNet/IP represents a pivotal advancement in industrial automation, furtherbolstered by the potential of Time-Sensitive Networking (TSN).

•This synergy promises ultra-responsive, deterministic, and broad bandwidth communication platforms uniquely suited to themultifaceted requirements of modern industrial ecosystems.

•Drawing upon collaborative insights from leaders like Rockwell Automation, Ericsson, Qualcomm, and Verizon, this integration
crafts a foundational pathway for organizations aiming to exploit the full spectrum of real-time data communication.

•The outlined hardware and software architectures not only facilitate streamlined MVP developments but also
position industries at the vanguard of a burgeoning digital evolution.

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