Belle II Experiment
Yutaka USHIRODA (IPNS, KEK)KEKB Review Meeting
Feb. 7, 2011

Outline• Introduction• Detector Design• Machine‐Detector issues• Construction Cost and Schedule• Summary2Primary Target of KEKB/Belle… was to conﬁrm Kobayashi‐Maskawa mechanism.

… and was so successful.
3Hot news from Belle in the past
Data size （)‐1）

333 physics publications

b→dγ transition
Z(4430)＋CP violation in B→Kπ
decay

Anomalous CP
violation in B→Kπ
decay

X（3872）CP violation in neutral
B system

B→τν
decay
CP violation in
penguin decays

1. Precise determination of SM (CKM)
2. Some unexpected observations such as new hadronic resonances(possible, but omitted in SM)
3. (Yet unclear) hints of new physics (impossible in SM, possible in NP)

4

Goal of Super B‐factory… is to search for NP,
discover it,
and determine model and parameters.
Or, to search for NP,
and constrain model and parameters.
Minimal Flavor
Violation

Enhanced Flavor
Violating Couplings5SuperKEKB and Belle II

Belle IIe+ 4GeV 3.6 A!
New IRe- 7GeV 2.6 A!
New beam pipe
& bellows

Colliding bunches

New superconducting /permanent ﬁnal
focusing quads near the
IP

SuperKEKB

Replace short dipoles
with longer ones (LER)

Add / modify RF systems
for higher beam current
Low emittancepositrons to inject
Redesign the lattices of HER& LER to squeeze theemittance
TiN‐coated beam pipewith antechambers

Damping ring

Positron source

New positron target /capture section
Low emittance gun

Low emittanceelectrons to inject

Target: L = 8x1035/cm2/s

6

Peak Luminosity(cm-2s-1)

Integrated Luminosity(ab-1)

Luminosity prospect
Milestone of SuperKEKB
9 month/year
20 days/month

We will reach 50 ab-1
in 2020~2021.

Commissioning starts
in 2nd half of FY2014

Shutdown
for upgrade

7

M. Yamauchi

KEK-DGKEKB ARC

BPAC

and many other B
ﬁeld‐level
Factorybarrier‐free
Board interactionsExp. groupAcc. group between machineand detector groups:(Bファクトリー推進委員会）‐ SuperKEKB kentoukai,‐ Belle II Executive Board meeting,‐ Belle II General Meeting
KEK’s executive‐ board
Computing research center
SuperKEKB Optics meeting,
KEK’s board of directors
Executive
Cryogenics centerIR technical meeting,
Administration ‐departmentcommittee
Mechanical engineering center
Facility department(Bファクトリー推‐ IR assembly meeting,
Radiation safety office進室）
Public relations‐ office
Belle II SVD mechanical meeting…
(addition by YU)

Belle II Collaboration

13 countries/regions, 57 institutes, 384 collaborators (Jan. 2011)9

Belle II Organization
IB mtg.
~3/year

EB mtg.
~1/month

Collaboration mtg.
3/yearWorkshops,
meetings+Task forces

10

Tsukuba‐hall webcam

Beam Pipe and Vertex Detector extraction: on Nov. 10, 2010
Belle Detector Roll‐out: Dec. 9, 2010
End‐caps, CDC, B‐ACC, TOF extraction: in Jan. 201111

Belle II Detector (in comparison with Belle)

SVD: 4 DSSD lyrs  2 DEPFET lyrs + 4 DSSD lyrs
CDC: small cell, long lever arm
ACC+TOF  TOP+A‐RICH
ECL: waveform sampling (+pure CsI for end‐caps)
KLM: RPC  Scintillator +MPPC(end‐caps)

12Technical Design Report• arXiv:1011.0352: http://arxiv.org/abs/1011.0352• KEK Report 2010‐1:
http://www‐lib.kek.jp/cgi‐bin/kiss_prepri.v8?
KN=201024001&OF=8.
• Belle II web page:
http://b2comp.kek.jp/~twiki/pub/Organization/B2TDR/B2TDR.pdf
Reviewed by BPAC members + external experts in May and in Nov.
Printed in Nov.

13

Vertex Detector
Beam Pipe
DEPFET
Layer 1
Layer 2DSSD
Layer 3Layer 4Layer 5Layer 6

Belle IIr = 10mm

Belle
15mm

r = 14mm
r = 22mm
r = 38mm
r = 80mm
r = 115mm
r = 140mm

20mm
43.5mm
70mm
88mm

14

PXD (DEPFET)
Each pixel is a p-channel FET on a completely depleted bulk
A deep n-implant creates a potential minimum for electrons
under the gate (“internal gate”)
Signal electrons accumulate in the internal gate andmodulate the transistor current (gq ~ 400 pA/e-)
Accumulated charge can be removed by a clear contact(“reset”)
Fully depleted: => large signal, fast signal collection
Low capacitance, internal amplification: => low noise

gate

High S/N even for thin sensors (50µm)
Rolling shutter mode (column parallel) for matrix operation=> 20 µs frame readout time=> Low power (only few lines powered)

DEPFET- matrix
off

off

on

reset

off

off

nxm
pixel
off

off

VGATE, ON
VGATE, OFF

DEPFET:
http://aldebaran.hll.mpg.de/twiki/bin/view/DEPFET/WebHome

reset

IDRAINdrain
0 suppression

15

output

VCLEAR, ON
VCLEAR, OFF
VCLEAR-Control

DEPFET for Belle II
radiuspixel
Layer 1 r = 14mm
50x50µm2
Layer 2 r = 22mm50x75µm2
75µm

thickness
75µm(0.18%X0)
total of 8 Mpx

Mechanical mockup

16Power consumption in sensitive area: 0.1W/cm² => air-cooling sufficientTest System
DCDB readout chip,
Bump bonded on interface board

PXD5 DEPFET matrix

Switcher control chip

New switcher and DCD is tested with a DEPFET PXD5 matrix
So far the system reaches 120ns sampling time with 40nA (~ 100 electrons) noise
Some fine tuning needed to reach full speed (<100ns) (tests started 2 weeks ago)
Side remark: flipping and bump bonding of DCDB in adapter board worked without problems
17

SVD (DSSD)HPK resumed DSSD production with 6’’ wafers
Two types of rectangular sensors andTrapezoidal sensors for slanted part (still under discussion)

20[c m ]
10la y e r s
4
6
6
5

4
6

4
6

3
0
-3 0

-2 0
z APVsrp h i A P V sz APVsrp h i A P V sz APVsrp h i A P V s

4
6

4
6

4

-1 0

4
6

4
6

4
6

6
6

4
6
4

4
6

4

6

6
6
6

0

10

20

30

40
[c m ]

R e c t ( 1 2 2 . 8 x 3 8 . 4 m m 2 , 1 6 0 / 5 0 u m p it c h )2
R e c t ( 1 2 2 . 8 x 5 7 . 6 m m , 2 4 0 / 7 5 u m p it c h )182Wedge (122.8 x 57.6-38.4 mm , 240 / 75..50 um pitch)Flex PCBs and APV25
Origami PCB•

Origami PCB– 3‐layer design– 237µm thick (nominal)•

PA0, PA1 and PA2– 2‐layer design– 145µm thick (nominal)

PA1

PA0
glued onto
hybridPA2

Thinned APV25(300µm~100µm)~0.55%X0/layer

19First prototype ladder

A prototype ladder using the ﬁrst 6 inch DSSD from HPK has
been assembled and tested.
20

Expected performance
σ[µm]

σ[µm]

Less Coulomb
scatterings

σ =a+

Belle

b
pβ sinν θ

Pixel detector close
to the beam pipe

Belle II’

Belle II
20µm
10µm
0

1.0

2.0

pβsin(θ) [GeV/
c]

0

1.0

3/2

Ks trackγ

2.0

pβsin(θ)5/2 [GeV/c]

π+ π-

γ

B vertex
IP profileγ

B decay point reconstruction
with KS trajectory

Larger radial
coverage of SVD
21

Central Drift Chamber

longer lever arm
improve resolution of momentum and dE/dx

Belle

Belle

Belle II

inner most sense wire

r=88mmr=168mmouter most sense wire

r=863mm

r=1111.4mm

Number of layers

50

56

Total sense wires

8400

14336

Gas

He:C2H6

He:C2H6

sense wireW(Φ30μm)

W(Φ30μm)

field wireAl(Φ120μm)

Al(Φ120μm)

Belle II

small cell
10 mm
6~8 mmnormal cell
18 mm
22

10~20 mm

Test chamber fabrication for 3D TRG study
Number of wires

making cable
HV testsignal check

Cosmic ray

wire stringing

July 9July 291205 field wires
384 sense wires

Aug. 12

Analog signal of β-ray
with current Belle AMP

Full‐length (540x570x2200) test
chamber has also been made

Status of new 48ch board for CDC
48ch board

16ch board

AMP shaper ASIC chip
4ch/chip
FADC

AMP shaper discriminator chip
8ch/chip

Deliv
e

red o

n Oc

t. 26

discriminator
FADC

Rocket I/Ofor data transfer

ethernet port
for data transfer
NIM input for TRG

NIM input for TRG

200mm x 175mm

230mm x 150mm
TDC~200nswaveform sampling with
32MHz FADC

Energy loss

Particle Identiﬁcation Devices

Endcap PID: Aerogel RICH (ARICH)
200mm

oton
ov ph

enk
Cher

Barrel PID: Time of Propagation Counter (TOP)

Quartz radiator

Focusing mirror

Small expansion block
Hamamatsu MCP-PMT (measure t, x and y)

Aerogel radiatorn~1.05

Hamamatsu HAPD
+ new ASIC

Aerogel radiator

Hamamatsu HAPD + readout

200

25

Time of Propagation Counter (TOP)Barrel PID: Time of Propagation Counter (TOP)

Quartz radiator

Focusing mirror

Small expansion block
Hamamatsu MCP-PMT (measure t, x and y)• Quartz radiator– 2.6mL x 45cmW x 2cmT
– Excellent surface accuracy• MCP‐PMT– Hamamatsu 16ch MCP‐PMT• Good TTS (<35ps) & enoughlifetime• Multialkali photo‐cathode  SBA

TOP

〜1.2m
TOF

MCP‐PMT

26

quartz

TOP (Barrel PID)

Beam
spot

• Beam test done in 2009

915mm

– # of photons consistent– Time resolution OK

2nd

3rd

875mm

1st

Quartz Radiator
Hamamatsu MCP‐PMT

Time resolution

beam data
1st
2nd# of photons

3rd[1count/25ps]

Simulations

1st

3rd
2nd

27

[1count/25ps]

Test beam result
Test Beam setup
AerogelClear Cherenkov image observed
Cherenkov angle distribution
Hamamatsu HAPD
Q.E. ~33% (recent good ones)

Single photon angle resolution σ0 = 13.5mrad# of photoelectrons Npe = 15.3

6.6 σ π/K at 4GeV/c !

28

Expected Performance (Luminosity gain)
No upgrade
BAD

B0ρ0γNo upgrade
BAD

FWD
BRL

ACC
only

TOF, dE/dx
NA

–74%

TOF NA

UpgradeGOOD

As good as
Belle
TOP opt.0
TOP opt.2

Upgrade
GOOD

dE/dx
only
–69%

As good as Belle

A‐RICH

–68%

–62%

–41%

–35%

–32%

–22%

–10%

–4%

0% (deﬁnition)

+12%

+27%

+33%

+40%

+59%

+45%

+51%

+60%

+83%

Completely diﬀerent
world with excellent PID
detectors!

29

Upgrade of ECL

For
Day 1

1. Upgrade electronics to do waveform sampling & ﬁtting
2. Upgrade crystals for end caps (pure CsI + photomultiplier as
the baseline)

30

New shaper/readout boards

Basically ready for mass production(minor revisions because we still have time.)
One of older versions has been installed in Belle toreadout part of the end cap in 2008. Tested OK.

31

KLM: KL&Muon detector
RPC  Scintillator (End cap)
also inner 1,2, or 3 layers of Barrel(?)

•
•
•
•

GENERAL LAYOUT
One layer: 75 strips (4 cm
width)/sector
5 segments
1 segment = 15strips
Two orthogonal layer =superlayer
F&B endcap KLM:
– Total area ~1400 m2– 16800 strips– the longest strip 2.8 m;
the shortest 0.6 m••

WLS fiber in each strip
Hamamatsu MPPC at one
fiber end
• mirrored far fiber end

32

One strip

ﬁber: Kuraray Y11 MC

ScinVllator bar: Vladimir (Russia)(used in T2K ND)

MPPC: Hamamatsu
1.3×1.3 mm 667 pixels(used in T2K ND)

part II

part I33

Test modules adjacent to Belle KLM (2008)

Muon tag

34

EKLM Module-0 assembled in
ITEP into the frame mock-up

Close view of frame support structureand strips with SiPM connectors

Strip SiPM connector

Close view of strips.
Segment’s plastic plates are easily seen

Y‐strip

X‐strip
Plastic plates

Machine‐Detector issues
 IR design  Tuesday morning Beam Background  Tuesday morning Machine commissioning strategy
 Injection veto and PXD
 Beam energy asymmetry (settled) Detector rotation

38

Machine commissioning strategy
1. Our BG estimation (MC/extrapolation) has large uncertainty.
2. We don’t like to burn our precious detectors before taking data.
3. We won’t roll‐in Belle II until we are conﬁdent about the BG level.
We will prepare dedicated detector (BEAST II) for machine commissioning
to monitor the BG level and compare with our estimation.

BG levelMC

Machine parameters for BEAST II must be
close enough to the design values so thatnatural extrapolation would work.
Unpredictable jump should be avoided.
(somewhat small beam size, some beam
current and some luminosity needed)

No discrimination
power if MC is correct.

BEAST II with Solenoid magnet (?)
Machine parameter(I,L,σ, …)Design value

Discussion started

39

Injection veto
~1ms

~3ms

Level 1 trigger is blocked after injection
because BG is too high.
 dead‐time
Suppose n = 100, W1=1µs and m=300,
6.5% dead‐time @ 50Hz injection.

DEPFET pixel detector integrates data for 20µs.
= 2 revolutions of noisy bunches.
Pixels are all exposed till the end of 2nd phase (4ms)
20% dead‐time @ 50Hz injection.
Trying to increase the frame rate (20µs  5µs), but
still 10% dead‐time @ 50Hz injection.
Any ideas
to reduce injection repetition rate (by reinforcing injectors?)
to achieve quiet injection, fast background dumping
are welcome.

40

LER Beam Energy (settled)
3.5GeV  4GeV to mitigate Touschek lifetime.
We are not so happy (25‐30% loss in TCPV, 6% gain in full‐recon.).
Larger boost,
better Δt
resolution

Smaller boost,
Larger acceptanceworse

better- J/ψK0 tCPV
- φK0 tCPV
- Bτν BR

41

Detector Rotation
Two beams have ﬁnite crossing angle (83mrad).
Belle solenoid axis must be bisector of the angle, but now it is not.
Either Belle or two rings must be rotated.
Parameters are OLD

Rotation is technically possible.
Additional cost (very preliminary estimate: 3 oku yen)
Possible damage in detectors (?)
Concern from bad experience of buckled CsI container when constructing Belle.
We will rotate Belle IF two rings cannot be rotated after all.
Cost to be covered by machine group.

42

Belle II Construction Schedule43Construction Cost
Cost proﬁle in FY2011‐2014~40 Oku yen in three‐four years(w/o comp. )½ covered by KEK, ½ by collaborating institutes
44Summary• SuperKEKB/Belle II with L=8×1035 cm-2s-1is can
explore many fruitful ﬂavor physics in coming 10‐15
years.
• Belle detector disassembly by end of Jan. asscheduled.
• Detector R&D, part of construction going on. On
schedule so far.
• Several machine‐detector issues to be cleared. Close
cooperation of two groups is necessary.

45

Backup46

Super B Factories• Although there exist interesting possible hints for the NP at the present B factories, all
the results are consistent with the SM.
• NP should exist at the higher energy scale, possibly in TeV region considering thehierarchy problem → LHC will discover it.
• Super B factories can help the identiﬁcation of the NP,
i.e. whether it is SUSY or others, or how SUSY breaking occurs.
SUSY scenario

Observables@ Super B
factories or otherexperiments[based on
T.Goto et.al.
PRD77,
095010(2008)]

Physics with 50(75) ab−1
Two recent publications:• Physics at Super B Factory (Belle II) arXiv:1002.5012• SuperB Progress Reports: Physics (SuperB) arXiv:1008.1541

In addition to the topics in this talk,Upper limits• Photon polarization of B→K*γ.
• B→K(*)νν.
• CPV in D.
• LFV in τ decay.
•…

τ decay

Integ. Lum.（ ab-1 ）Reach ofB
factories

Super B factories

B- → τ-ν – charged higgs limits
b
u

W/H±

τ

​𝐫↓𝐇 =​𝐵𝑟(𝐁→𝛕𝛎)/𝐵𝑟​(𝐁→𝛕𝛎)↓𝑆𝑀 =​𝟏−​
𝐦↓𝐁↑𝟐 /​𝐦↓𝐇↑𝟐 ​𝐭𝐚𝐧↑𝟐 𝛃ντ→ limit on charged Higgs mass vs. tanβ5 ab-150 ab-1

B → K*γ t-dependent CPV
𝑃(​𝐵↑0 →𝑓;Δ𝑡)=​𝑒↑−∣Δ𝑡∣ /τ/4τ [1+​𝑆↓𝐶𝑃↑𝑓 sin(Δ𝑚Δ𝑡)+​𝐴↓𝐶𝑃↑𝑓cos(Δ𝑚Δ𝑡)]SM:∣​𝑆↓𝐶𝑃↑​𝐾↓𝑆 ​π↑0 γ ∣≈(​2m↓𝑠 /​𝑚↓𝑏 )sin2​Φ↓1 ≈0.04

Left-Right Symmetric Models:∣​𝑆↓𝐶𝑃↑​𝐾↓𝑆 ​π↑0 γ ∣≈0.67cos2​Φ↓1 ≈0.5

D. Atwood et al., PRL79, 185 (1997)​𝑆↓𝐶𝑃↑​𝐾↓𝑆 ​π↑0 γ =−0.15±0.20​𝐴↓𝐶𝑃↑​𝐾↓𝑆 ​π↑0 γ =−0.07±0.12
HFAG, Winter’09

σ(​𝑆↓𝐶𝑃↑​𝐾↓𝑆 ​π↑0 γ )=0.09@​
5ab↑−10.03@​50ab↑−1(~SM prediction)

LFV and New Physics

τ3ℓ,ℓη

γ

τℓγ

µ

µ ( s)

χ%0

τ

(e )
τ% µ%%

イメージ
を表示で
きませ

µ (e)

Neutral Higgs mediated decay.
● Important when MSUSY >> EW scale●(ml%2 )23(13)SUSY + Seasaw● Large LFV

●

●

●

τ

bkg. free (U.L. ∝ 1/L)
Upper limits

bkg. from ee→ ττγ (U.L. ∝ 1/√L)
model

Br(τ→ℓℓℓ )mSUGRA+seesaw
SUSY+SO(10)SM+seesaw
Non-Universal Z’
SUSY+Higgs

Br(τ→µγ)
10-7
10-8
10-9
10-9
10-10

10-9
10-10
10-10
10-8
10-7

Integ. Lum.（ ab-1 ）Reach of B factories
Super B factories

Comparison with LHCb
Belle

Belle II

Belle II

LHCb

~ 0.5 ab−1

5 ab−150 ab−1

10 {−1 [5yrs]

ΔS(φKS)

0.22

0.073

0.029

0.14

ΔS(η’KS)

0.11

0.038

0.020

‐‐‐

φs from S(J/ψφ)

‐‐‐

‐‐‐

‐‐‐

0.01

S(K*γ)

0.36

0.12

0.03

‐‐‐

S(ργ)

0.68

0.22

0.08

‐‐‐

ΔB/B(B → τν)

3.5σ

10%

3%

‐‐‐

Bs → µµ∙∙∙

5σ @ 6 {−1τ → µγ [×10−9]

<45

<30

<8

‐‐‐

τ → µµµ [×10−9]

<209

<10

<1

‐‐‐

φ2

11⁰

2⁰

1⁰

4.5⁰

φ3

16⁰

6⁰

2⁰

2.4⁰

Advantage:
LHCb• Modes where the ﬁnal
states are charged only.
• Bs• B c , Λb
• …..

B factories• Modes with γ, π0 .
• Modes with ν .
• τ decays.
• KS vertex.

ASICs for control and readout
ACTIVE AREA

DCDB

SwitcherControl of gate and clear
32 x 2 channels
Switches up to 30V
AMS 0.35 µm HV technology
Tested up to 36 Mrad

Amplification and digitization of
DEPFET signals
256 input channels
8-bit ADC per channel
92 ns sampling time
UMC 189nm
Rad hard design

DHP
Signal processor
Common mode correction
Pedestal subtraction
0-supression
Timing and trigger control
IBM 90 nm
Rad hard design
53 (32 channel) test chip
½ sizeAll three chips fabricated and successfully tested

Test Beam in 2009 (ILC version)
Array of 6 DEPFET modules
TB 2009

eV
G
0
2
1

π

(Not a typical) event display

54

Radiation Damage
DEPFET based on a MOS structure
problem with ionising radiation:
Creation of fixed (positive) charges in the oxide layer andat the interface
Attracts electrons at the Si/SiO2 interface
Need more negative gate voltages to compensate=> Shift of transistor threshold

Gate oxide

Solution: thin oxides< 2.5V shift at 10Mrad
For standard DEPFETs the theresholdvoltage shifts reach 14 V after 4 Mrad
Too large for safe operation!

55CDC: End‐plate

Design ﬁnalized.
Purchased in this FY.

56

Performance of 1‐bar/2‐bar TOP
1‐bar

2‐bar

Incident angle ﬂuctuation (1mrad)
Timing ﬂuctuation (25ps)
Performance similar (weighted) for physics case studies
57

3% fake~4σConﬁguration choice (May, 2010)• Two conﬁgurations show similar performance• 1‐bar conﬁguration shows stable performance as a functionof increased timing jitter. 2‐bar need precise, continual
timing calibration during experiment operation.
• 1‐bar case has larger forward acceptance and requires
readout only in the backward direction. (forward cablerouting is very crowded)• We chose the 1‐bar conﬁguration as baseline, with 2‐bar as a
backup option, due to these practical considerations.

MCP‐PMT photocathode• Typical QE at max.

– Bialkali (SBA); 28%– Multialkali (MA); 24%• Performance check by simulation– Diﬀerence QE distribution makes
diﬀerent chromaticity eﬀect.

• SBA shows better performance.

 Chose SBA.
– We push HPK to improve QE during
production.

MCP‐PMT: improvement in lifetime
New MA
Protections against‐Ion feedback‐Neutral gas
were eﬀective.
SBA1
SBA2

Old MA

5 yr
01
Belle II year
60

10

End‐cap Particle Identiﬁcation• Ring imaging Cherenkov counter based on silica
aerogel radiator– Space limited ‐> proximity focusing with expansion
distance of 20 cm– Requirements• Transparent silica aerogel• Photo‐detector– Single‐photon sensitivity– Pixel 5x5mm2– Operational in 1.5T
– Compact• Readout electronics– ~70K channels

n=1.05 aerogel|σc(π)‐σc(K)| = 23 mrad at P=4GeV/c

Target: More than 4 σ π/K separation at 4 GeV/c

61

Novel “focusing” radiator

Possible only with aerogel !

Simple accumulation of radiator layer gives more photons, but degrades PID
performance Multiple aerogel layers with diﬀerent indices4cm‐thick single index aerogelσθ(1p.e.) = 22 mrad
Npe ~ 10.6σθ(track) = 6.9 mrad
Focusing by 2cm+2cm aerogel (n1:1.047, n2:1.057)
n1 n2

σθ(1p.e.) = 14.4 mrad
Npe ~ 9.6σθ(track) = 4.8 mrad
NIM A548(2005)383

62

HAPD QE Improvement

HAPD QE has been greatly improved with“super bialkali” technology by Hamamatsu.
40

32%

35

Conventional bialkali

30

QE (%)

Super Bialkali

25

25%

20
15
10
5
0
300

400

500

600

wavelength (nm)Peak QE > 30% has been achieved

Studies to Reduce Neutron Damage
Thinner APD to reduce neutron induced lattice deﬁcits
P+
APD Δ leakage current (1012n/cm2)
5280

0.2

P

5266

0.18

N

5252

0.16

5256

0.14

5278

0.12

5741

ΔIleak[μA/mm^2]：electron：hole

Thick P

5289

0.1

Current,
thick N,thin N

5288

0.08

5258

0.06

5257

0.04
0.02
0
0

20

40

Gain

60

N‐
N+

• Contribution of N‐layer (hole) is about
1/100 of that of P‐layer (e).
thin P Thinner P layer
80• Improvement conﬁrmed with APD
irradiation tests
 presumably this improves HAPD
64
tolerance, too HAPD irradiation test is under way.

Status of Readout Electronics for Aerogel RICH
~74mm(~ﬁnal size)

Trial production of the front end board inprogress (Ljubljana).
Prototype Merger board will be
designed in this ﬁscal year.
The design of the next version of the ASIC
(S03) has just started.
• Shorter shaping time.
• Production schedule depends on
HAPD & front‐end board
development
65

Front‐end electronics of ECL

Back‐end DAQ
66

ECL Collector module
Role of the module:







Conﬁgure Xilinx FPGA on ShaperDSP modules
Synchronize sampling process on all 12 ShaperDSP
modulesCollect data from 12 connected ShaperDSP modules
CalibraVon signal generaVon
Interface with remote PC for stand‐alone operaVon
Provide interface with Belle II TTD and DAQ

Status:Prototype module … produced
Remote ﬁrmware conﬁguraVon on ShaperDSP… establishedInterface with remote PC …establishedCalibraVon signal generaVon … established
Rocket‐I/O … to be tested soon

Shaper DSP module
Key features:
 16 channels per module τ=0.5µs shaper
 FADC Waveform ﬁtting
Output pulse height, timing, and quality of ﬁt Fast shaper + Variable gain amp. for trigger output.
Linearity <0.3%(0.5% for Belle)

Status:Prototype module … produced
New revision … to be submifed in this FY
Belle

Belle II

Linearity

<0.5%

<0.3%

Shaping time

1µs

0.5µs

ENE

~200keV~300keV

ENE (w/ pile‐up 500‐1000keV
noise)

400‐600keV

Most critical path of each subsystem
Simpler Be pipe by
new companies( 4 months)

Most crucial item

Necessary timeBP

Design study, Beryllium pipe production

1‐1.5 years, 1 year

PXD

Sensor production

1.5 years

SVD

Sensor production

2 years

CDC

Drilling small cell end‐plate

9 months after getting skilledTOP

Quartz bar production

2.3 years

A‐RICH

HAPD production

1.3 years

ECL(To exchange pre‐amps If we do so)

KLM

Scintillator bar production

1.5 years,

New companies (in US) 1 yearCommissioning procedure
No earlier
than 2014.10
Roll‐in position
Linac commissioning,
MR commissioning phase 1phase 2Main Ring commissioning with BEAST II, without
Solenoid, probably with Aluminum beam pipe.

Extensive Software‐completion Phase(slow‐control, online, alignment, PXD‐ROI, … )Roll‐out position<1 month
Global Cosmic
Ray w/o B ﬁeld
if required.

Belle II w/o VXD
VXD

VXD installation

Belle II
Global Cosmic Ray
w/ and w/o B‐ﬁeld

Physics Run

VXD = BP+PXD+SVD (scenario 1)

Belle II roll‐in

Belle II constructed

BEAST II

GCR

Main Ring commissioning with
Solenoid. VXD is not installedin Belle II.
Field measurement along
beam line.

Belle IIt