EPO-TEK® H44
Technical Data Sheet
For Reference Only
Gold-Filled, Electrically Conductive Epoxy

Date:
Rev:
No. of Components:
Mix Ratio by Weight:
Specific Gravity:
Pot Life:
Shelf Life- Bulk:

Recommended Cure: 150°C / 1 Hour

June 2019
VIIISingle
N/A
Available for a fee
N/A
Six months at room temperature

NOTES:● Container(s) should be kept closed when not in use.
● Filled systems should be stirred thoroughly before mixing and prior to use.
● Performance properties (rheology, conductivity, others) of the product may vary from those stated on the data sheet when bi-pak/syringe packaging or
post-processing of any kind is performed. Epoxy’s warranties shall not apply to any products that have been reprocessed or repackaged from Epoxy’s
delivered status/container into any other containers of any kind, including but not limited to syringes, bi-paks, cartridges, pouches, tubes, capsules, films
or other packages.

Product Description: EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid
microelectronic packaging.
Typical Properties: Cure condition: 150°C / 1 HourDifferent batches, conditions & applications yield differing results.
Data below is not guaranteed. To be used as a guide only, not as a specification. * denotes test on lot acceptance basis
PHYSICAL PROPERTIES:* Color (before cure):* Consistency:* Viscosity (23°C) @ 0.5 rpm:
Thixotropic Index:* Glass Transition Temp:
Coefficient of Thermal Expansion (CTE):
Below Tg:
Above Tg:
Shore D Hardness:
Lap Shear @ 23°C:
Die Shear @ 23°C:
Degradation Temp:
Weight Loss:@ 300°C:
Suggested Operating Temperature:
Storage Modulus:
Ion Content:* Particle Size:

Brown
Smooth thick paste> 819,200 cPs
N/A≥ 100 °C (Dynamic Cure: 20-200°C/ISO 25 Min; Ramp -10-200°C @20°C/Min)
Available for a fee
Available for a fee
Available for a fee
Available for a fee≥ 10 Kg
388 °C

3,556 psi

0.06 %< 300 °C (Intermittent)
Available for a fee
Available for a fee≤ 50 microns

ELECTRICAL AND THERMAL PROPERTIES:
Thermal Conductivity:
Available for a fee* Volume Resistivity @ 23°C:≤ 0.0005
Dielectric Constant (1KHz):
N/A
Dissipation Factor (1KHz):
N/A

Ohm-cmEpoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com

EPO-TEK® H44
Technical Data Sheet
For Reference Only
Gold-Filled, Electrically Conductive Epoxy

EPO-TEK® H44 Advantages & Suggested Application Notes:● High viscosity paste. Users should not expect the same creamy viscosity as silver-filledepoxies.
● Design engineers need to be aware of longer lead times and shorter shelf-life than
traditional silver-filled epoxies.
● Suggested applications for hybrid/hermetic packaging: Die-attach and SMD attach
instead of silver epoxy; avoiding silver migration inside sealed packages; medical andaerospace electronics and circuits.
● Passes NASA low outgassing standard ASTM E595 with proper cure http://outgassing.nasa.gov/.

Epoxies and Adhesives for Demanding Applications™
This information is based on data and tests believed to be accurate. Epoxy Technology, Inc. makes no warranties (expressed or implied) as toits accuracy and assumes no liability in connection with any use of this product.
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
www.epotek.com