砥粒加工学会誌 62 巻 8 号 ／ 目次
Journal of the Japan Society for Abrasive Technology (JSAT) Vol.62 No.8 Contents

半導体製造工程におけるダイシングテープの機能
山口征太郎，佐伯尚哉 ······················································································································ 400
色々なサイズのワークを自在に固定できるどこでも吸着盤

特集髙田 篤，大橋恭介 ···························································································································· 404
静電吸着キャリアプレートを用いた薄型基板の固定

薄板基板の低ストレスチャック

花田郁子 ··············································································································································· 409
溶剤を使わない冷凍固定装置
西 進 ····················································································································································· 413
ベルヌーイ式ノンコンタクトチャッキング
松井 淳 ················································································································································· 417
超音波振動によるラッピングテープの研磨特性の再生
第 1 報：目づまりしたテープの再生方法の検証論文

磯部浩已，石松 純，原 圭祐，田辺郁男 ····················································································· 421
サファイアウエハの振動援用インフィード平面研削に関する研究
由井明紀，籔野真大，楠山純平，北嶋孝之，伊東利洋 ····························································· 427

専門委員会／分科会報告 ····················································································································· 433
会告会告・その他

2018 年度砥粒加工学会学術講演会(ABTEC2018)················································· 436
砥粒加工学会 学会活性化フォーラム in ABTEC2018 ·········································· 446
次世代ものづくり技術研究会
若手エンジニアのための施設見学会付勉強会 ··················································· 447

平成 30 年度(公社)砥粒加工学会賛助会員会 第 1 回技術交流会 ·················· 448
カレンダー ·················································································································································· 449
賛助会員名簿 ··········································································································································· 450
編集後記 ···················································································································································· 451

Journal of the Japan Society for Abrasive Technology (JSAT)Vol.62 No. 8 Contents

Function of dicing tape for manufacuturing semiconductor
Seitaro YAMAGUCHI and Naoya SAIKI ························································································· 400
Porous ceramics vacuum chuck fixing regardless of workpiece size

Special �ssue

Atsushi TAKATA and Kyosuke OHASHI ························································································· 404
Carrier-type electrostatic chuck for substrate

�ow stress chuckof thin plates

Ikuko HANADA···································································································································· 409
Without solvent
Susumu NISHI ······································································································································· 413
Bernoulli type non-contact chucking
Jun MATSUI ·········································································································································· 417
Regeneration of polishing performance of used lapping tape by ultrasonic vibration
1st Report : Verification of technique for reuse of loaded tapePapers

Hiromi ISOBE, Jun ISHIMATSU, Keisuke HARA and Ikuo TANABE ····································· 421
Study on vibration-assisted infeed surface grinding for sapphire wafers
Akinori YUI, Masahiro YABUNO, Jumpei KUSUYAMA,Takayuki KITAJIMA and Toshihiro ITO ··························································································· 427

�nformation··························································································································································· 433～451

砥粒加工学会誌【特399集】

薄板基板の低ストレスチャック使用される用途は違っても，コストダウン，軽量化，高性能化，高付加価値などの目的から，板状材料の多くは板厚が薄くなる傾向である．板厚が薄くなることによって，前述のとおりユーザーの得られるものは大きい．しかし加工屋にとっては，基板が薄くなると簡単に破損しやすくなるため，加工の難易度は板厚の減少に対し，比例的ではなく指数関数的に増加するといえる．
今回は，薄板加工のなかでも基板を固定する技術に注目した．加工というと，被加工物と工具の接触部分にばかり注視してしまいがちだが，とくに薄板基板では基板をいかに固定するかによって加工結果が違ってくる．しかし業界ごとに決まった固定方法を用いるのが常であり，別の分野の固定方法を知る機会は多くはない．本特集では，さまざまな分野で用いられる薄板の固定方法について原理をご解説いただいたうえで，新しい固定技術についてもご紹介いただく．

〔特集１〕 半 導体製造工程におけるダイシングテープの機能〔特集３〕 静 電吸着キャリアプレートを用いた薄型基板の固定【山口 征太郎】（やまぐち・せいたろう）【花田 郁子】（はなだ・いくこ）

現職：リンテック株式会社 研究所 製品研究部 電子材料研究室
専門／業務：粘着製品の設計開発
連絡先：〒335-0005 埼玉県蕨市錦町5-4-42
TEL 048-430-1703 FAX 048-430-1726
e-mail：s-yamaguchi@post.lintec.co.jp

現職：筑波精工株式会社
専門／業務：営業技術部
連絡先：〒329-0617 栃木県河内郡上三川町
大字上蒲生字願成寺2168-10
TEL 0285-55-0081 FAX 0285-55-0768
e-mail：i-hanada@tsukubaseiko.co.jp【佐伯 尚哉】（さいき・なおや）

現職：リンテック株式会社 研究所 製品研究部 電子材料研究室
専門／業務：粘着製品の設計開発
連絡先：〒335-0005 埼玉県蕨市錦町5-4-42
TEL 048-430-1703 FAX 048-430-1726
e-mail：n-saiki@post.lintec.co.jp〔特集４〕 溶
 剤を使わない冷凍固定装置【西 進】（にし・すすむ）

現職：株式会社西研デバイズ 代表取締役
専門／業務：熱関連機器に関する研究開発
連絡先：〒532-0028 大 阪 府 大 阪 市 淀 川 区
十三元今里1-10-6
TEL 06-6885-8241 FAX 06-6885-8247
e-mail：nishikende@yahoo.co.jp〔特集２〕 色 々なサイズのワークを自在に固定できるどこでも吸着盤【髙田 篤】（たかた・あつし）

現職：株式会社ナノテム
専門／業務：材料工学 / 研究開発
連絡先：〒940-0021 新潟県長岡市城岡3丁目
2-10
TEL 0258-22-6725 FAX 0258-22-6726
e-mail：a-takata@nano-tem.com〔特集５〕 ベルヌーイ式ノンコンタクトチャッキング

【大橋 恭介】（おおはし・きょうすけ）【松井 淳】（まつい・じゅん）

現職：株式会社 MTK 代表取締役
専門／業務：微細加工技術，洗浄技術
連絡先：〒236-0002 神奈川県横浜市金沢区
鳥浜町12-64
TEL 045-442-4404 FAX045-442-4408
e-mail：matsui@mtk-2.com

現職：株式会社ナノテム
専門／業務：材料工学 / 研究開発
連絡先：〒940-0021 新潟県長岡市城岡3丁目
2-10
TEL 0258-22-6725 FAX 0258-22-6726
e-mail：k-ohashi@nano-tem.com

Journal of the Japan Society for Abrasive Technology Vol.62 No.8 2018 AUG.

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