TECHNICAL DATA SHEET

Model 4801
Quartz eXpress Module (QuartzXM) Carrier Design Package

Supports customers
interested in building
a custom carrier▪ Build a custom carrier for Mercury's
Model 6001 or 6003 QuartzXM▪ The QuartzXM modules feature Xilinx
Zynq UltraScale+ RFSoC FPGAs▪ The QuartzXM's RFSoC FPGA integrates
eight RF-class A/D and D/A converters
into the Zynq’s multiprocessor
architecture

In situations where only a custom form factor will satisfy theapplication requirements, Mercury supports QuartzXM Models 6001
and 6003 with this Model 4801 carrier design kit that helps users
engineer and build a custom carrier. As complete and tested modules,
Model 6001 and 6003 encapsulate best-in-class electrical and mechanicaldesign, eliminating some of the most challenging aspects of embedded
circuit design and allowing users to focus on an application-specificcarrier design.
The carrier design kit uses Mercury’s Quartz® 5950 or 5953 3U OpenVPX carrier as areference design. Mercury’s Models 6001 and 6003 are high-performance Quartz eXpress
Modules (QuartzXM) based on the Xilinx Zynq UltraScale+ RFSoC FPGA.
Model 6001 is based on the Gen 1 Xilinx Zynq UltraScale+ RFSoC FPGA and Model 6003 isbased on the Gen 3 Xilinx Zynq UltraScale+ RFSoC FPGA. The RFSoC FPGA integrates
eight RF-class A/D and D/A converters into the Zynq’s multiprocessor architecture,creating a multichannel data conversion and processing solution on a single chip.
The 6001 and 6003 have been designed to bring RFSoC performance to a wide range ofdifferent applications by offering the FPGA in a small system-on-module solution
measuring only 2.5 by 4 inches. In addition to the RFSoC FPGA, the 6001 and 6003 include
all of the support circuitry needed to maximize the performance of the RFSoC. The 6001
and 6003 also are available on standard form factor carriers (see "Quartz Products" on thenext page).

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TECHNICAL DATA SHEET
Quartz 4801

CARRIER DESIGN PACKAGE INCLUDES:

QUARTZ PRODUCTS▪ Pin definitions and electrical specifications of all signals onthe module

The 6001 and 6003 are also available on these carriers:▪ 3D models of the module

ModelDescription▪ Thermal profiles of the module and components

5550

8-Channel A/D & D/A Zynq UltraScale+ RFSoC (Gen 1)
SOSA aligned 3U VPX board

5553

8-Channel A/D & D/A Zynq UltraScale+ RFSoC (Gen 3)
SOSA aligned 3U VPX board

5950

8-Channel A/D & D/A Zynq UltraScale+ RFSoC (Gen 1)
3U VPX board▪ Additional electrical and mechanical engineering guidance

5953

8-Channel A/D & D/A Zynq UltraScale+ RFSoC (Gen 3)
3U VPX board

ORDERING INFORMATION

6350

8-Channel A/D & D/A Zynq UltraScale+ RFSoC (Gen 1)
small form factor enclosure

Model

Description

63534801*

QuartzXM Carrier Design Package - DVD

8-Channel A/D & D/A Zynq UltraScale+ RFSoC (Gen 3)
small form factor enclosure

6350S

8-Channel A/D & D/A Zynq UltraScale+ RFSoC (Gen 1)
small form factor subsystem

6353S

8-Channel A/D & D/A Zynq UltraScale+ RFSoC (Gen 3)
small form factor subsystem

7050

8-Channel A/D & D/A Zynq UltraScale+ RFSoC (Gen 1) PCIeboard

7053

8-Channel A/D & D/A Zynq UltraScale+ RFSoC (Gen 3)
PCIe board▪ Carrier reference design schematics▪ PCB stack-up recommendations▪ PCB design guidelines and routing rules▪ Operating systems and bootstrap guidelines*Requires a Non-Disclosure Agreement (NDA).
Contact techsales@mrcy.com for details.

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For technical details, contact:mrcy.com/go/CF4801

Visit: mrcy.com/go/MP4801+41 22 884 5100 tel

The Mercury Systems logo is a registered trademark of Mercury Systems, Inc. Other marks used herein may be trademarks or registered trademarksof their respective holders. Mercury products identified in this document conform with the specifications and standards described herein.
Conformance to any such standards is based solely on Mercury’s internal processes and methods. The information contained in this document issubject to change at any time without notice.
© 2023 Mercury Systems, Inc. 1-0-060623-DS-Q4801

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