Accelerate Everything

Supermicro NVIDIA MGX™ Systems
1U NVIDIA GH200 Grace Hopper™ Superchip Systems

Maximum AI Performance Per-Rack-Unit
Supermicro NVIDIA MGX™ Systems are purpose-built for modern Al and accelerated computing. This modular platform enables new
possibilities in system design and bleeding-edge technologies, including support for NVIDIA GH200 Grace Hopper™ Superchip which
combines the power of an NVIDIA H100 GPU and NVIDIA Grace CPU on a single chip. In a mere 1- rack unit form factor, Supermicro
NVIDIA MGX™ Systems can be equipped with up to 2 Grace Hopper Superchips and deliver the highest accelerated computing
density in this compact form factor. 1U Grace Hopper Superchip Systems are ready to run any application in the NVIDIA Al software
stack.

Grace Hopper Superchip
H100 GPU+ Grace CPU on one Superchip
The Grace Hopper Superchip addresses a key bottleneck in training
and inference of Al models: access to plenty of high-bandwidth
memory. NVLink® Chip-2-Chip(NVLink-C2C) provides a coherent
CPU-GPU link that is 7x faster than PCle 5.0.
Utilize a coherent pool of the 96GB of HBM3 for GPU and 480GBof LPDDR5X for CPU totaling 576GB of memory to accelerate AIand HPC applications. CPU and GPU threads can now concurrently
and transparently access both CPU and GPU resident memory,allowing developers focus on algorithms instead of explicit memory
management.

MGX: A Modern System Architecture

Cooling + Efficiency + Power Delivery

Optimized for thermals, compatibility, and flexibility.

Increased Operations-Per-Second. Decreased OPEX.

MGX is a modular and flexible platform with support for the leading Due to its mechanical design and component selection,
GPUs, CPUs, and DPUs of today and the future. The Supermicro MGX Supermicro MGX™ Systems optimize cooling, efficiency, andsystems also support both air-cooling and liquid-cooling in the same power delivery without sacrifice.
compact chassis to enable highly dense compute featuring GPUs
Supermicro’s proven Direct-to-Chip liquid cooling solutions
with 400W+ TDP while providing high energy efficiency. The modular
can reduce OPEX by more than 40%. Up to 2x 2700W
bays on both sides facilitate constructing finely-tuned systems, such
redundant Titanium Level power supplies deliver ample
as providing flexible PCIe 5.0 slots supporting NVIDIA BlueField®-3power to handle up to the 2000W power requirements of dual
or NVIDIA ConnectX®-7 networking for the next generation of HPC
Grace Hopper Superchips, with headroom to spare.
supercomputing clusters and AI factories.
© 2023 Copyright Super Micro Computer, Inc. All rights reserved

October 2023

Accelerate Everything

Accelerate NVIDIA MGX Systems

1U NVIDIA GH200 Grace Hopper™ Superchip Systems
Construct new solutions for accelerated infrastructures enabling scientists and engineers to focus on solving the world’s mostimportant problems with larger datasets, more complex models, and new generative AI workloads. Within the same 1U chassis,
Supermicro’s dual NVIDIA GH200 Grace Hopper Superchip systems deliver the highest level of performance for any application on theCUDA platform with substantial speedups for Al workloads with high memory requirements. In addition to hosting up to 2 onboard
H100 GPUs in 1U form factor, its modular bays enable full-size PCIe expansions for present and future of accelerated computing
components, high-speed scale-out and clustering.

1 Node with Liquid Cooling

2 Nodes with Liquid Cooling

ARS-111GL-NHR

ARS-111GL-NHR-LCC

ARS-111GL-DNHR-LCC

Form Factor

1U system with single NVIDIA GH200 Grace
Hopper Superchip

1U system with single NVIDIA GH200 Grace
Hopper Superchip

Dual node 1U system with single NVIDIA
GH200 Grace Hopper Superchip per nodeCPU

72-core Grace Arm Neoverse V2 CPU +H100 Tensor Core GPU in a single chip

72-core Grace Arm Neoverse V2 CPU +H100 Tensor Core GPU in a single chip

72-core Grace Arm Neoverse V2 CPU +H100 Tensor Core GPU in a single chip pernodeGPU

NVIDIA H100 Tensor Core GPUwith 96GB of HBM3
or 144GB of HBM3e (coming soon)

NVIDIA H100 Tensor Core GPUwith 96GB of HBM3
or 144GB of HBM3e (coming soon)

NVIDIA H100 Tensor Core GPUwith 96GB of HBM3or 144GB of HBM3e (coming soon) per node

MemoryOnboard memory:
CPU: 480GB integrated LPDDR5X with ECC

Onboard memory:
CPU: 480GB integrated LPDDR5X with ECC

Onboard memory:
CPU: 480GB integrated LPDDR5X with ECC
per node

Drive

8x hot-swap E1.S drives and2x M.2 NVMe drives

8x hot-swap E1.S drives and2x M.2 NVMe drives

4x hot-swap E1.S drives and2x M.2 NVMe drives per node

Networking

3x PCle 5.0 x16 slots supporting NVIDIA
BlueField-3 or ConnectX-7

3x PCle 5.0 x16 slots supporting NVIDIA
BlueField-3 or ConnectX-7

2x PCle 5.0 x16 slots supporting NVIDIA
BlueField-3 or ConnectX-7

Interconnect

NVLink-C2C with 900GB/s for CPU-GPU
interconnect

NVLink-C2C with 900GB/s for CPU-GPU
interconnect

NVLink-C2C with 900GB/s for CPU-GPU
interconnect

Cooling

Air-cooling

Liquid-cooling

Liquid-coolingPower2x 2000W Redundant Titanium Level power 2x 2000W Redundant Titanium Level power 2x 2700W Redundant Titanium Level power
supplies
supplies
supplies

Go to www.supermicro.com/mgx or scan the QR code tolearn more.

© 2023 Copyright Super Micro Computer, Inc. Specifications subject to change without notice. All other brands and names are the property of
their respective owners. All logos, brand names, campaign statements and product images contained herein are copyrighted and may not be
reprinted and/or reproduced, in whole or in part, without express written permission by Supermicro Corporate Marketing.