55NTEPOXY NONWOVEN ARAMID LAMINATEAND PREPREG
55NT is an epoxy laminate and prepreg system, reinforced witha non-woven aramid substrate. This system combinescompatibility with lead-free processing,using a hightemperature epoxy resin, with the low in-plane (x,y) expansion
and outstanding dimensional stability of non-woven aramid
reinforcement.

Features:• Low in-plane (x,y) expansion of 6-9 ppm/°C allows attachment ofSMT devices with minimal risk of solder joint failure due toCTE mismatch• Nonwoven aramid organic reinforcement provides outstandingdimensional stability and enhanced registration for improved
multilayer yields• Tg of 170°C, decomposition temperature of 368°C, andz-expansion of 3.5% between 50-260°C ensures compatibility withmost lead-free processes• Polymeric reinforcement results in PCBs typically 25% lighterin weight than conventional glass-reinforced laminates• Laser and plasma ablatable for high speed formation of
microvias and other features as small as 25µm
• Electrical and mechanical properties meeting the requirements ofIPC-4101/55• Compatible with lead-free processing

Typical Applications:• RoHS/WEEE compliant• Military and commercial avionics, missiles and missile defense,
satellites, and other high-reliability SMT applications requiring
low in-plane (x,y) CTE values• Other applications requiring low in-plane (x,y) CTE values,
including chip carriers and multichip modules, where thechip carrier serves as an interposer for attachment to theunderlying PCB• PCBs that are subjected to elevated temperatures during processing,such as lead-free solderingTypical Properties:
Property

55NT
Units

Value

Test Method-3.8

IPC TM-650 2.5.5.3
IPC TM-650 2.5.5.9-0.015

IPC TM-650 2.5.5.3

1. Electrical Properties
Dielectric Constant (may vary with Resin %)@ 1 MHz@ 1 GHz
Dissipation Factor@ 1 MHz@ 1 GHz
Volume Resistivity
C96/35/90
E24/125
Surface Resistivity
C96/35/90
E24/125
Electrical Strength
Dielectric Breakdown
Arc Resistance-

IPC TM-650 2.5.5.9

MΩ-cm
MΩ-cm

2.3 x 107
6.6 x 107

IPC TM-650 2.5.17.1
IPC TM-650 2.5.17.1

MΩ
MΩ
Volts/mil (kV/mm)
kV
sec

1.8 x 108
1.6 x 1081240 (48.8)
165

IPC TM-650 2.5.17.1
IPC TM-650 2.5.17.1IPC TM-650 2.5.6.2
IPC TM-650 2.5.6
IPC TM-650 2.5.1

°C°C

170

IPC TM-650 2.4.24
IPC TM-650 2.4.25

Initial
5%
T260
T288
T300
CTE (x,y)CTE (z)°C°C
minminminppm/°C

351
368>60>60286-9

IPC TM-650 2.3.41
IPC TM-650 2.3.41
IPC TM-650 2.4.24.1
IPC TM-650 2.4.24.1
IPC TM-650 2.4.24.1
IPC TM-650 2.4.41< Tg

ppm/°C99

IPC TM-650 2.4.24

ppm/°C%

259
3.5

IPC TM-650 2.4.24
IPC TM-650 2.4.24

lb/in (N/mm)
lb/in (N/mm)
lb/in (N/mm)

3.6 (0.6)
3.6 (0.6)
3.6 (0.6)

IPC TM-650 2.4.8
IPC TM-650 2.4.8.2
IPC TM-650 2.4.8

Young’s Modulus
Flexural Strength
Tensile Strength

Mpsi (GPa)kpsi (MPa)kpsi (MPa)

2.0 (13.8)
38 (262)36 (248)

IPC TM-650 2.4.18.3
IPC TM-650 2.4.4
IPC TM-650 2.4.18.3

Compressive Modulus
Poisson’s Ratio (x, y)

kpsi (MPa)-2. Thermal Properties
Glass Transition Temperature (Tg)
TMADSC
Decomposition Temperature (Td)> Tgz-axis Expansion (50-260ºC)

3. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)
After Thermal Stress
At Elevated Temperatures
After Process Solutions

ASTM D-695
ASTM D-3039

4. Physical Properties
Water Absorption (0.062”)
Specific Gravity
Thermal Conductivity
Flammability%g/cm3
W/mK
class

0.3
1.38
0.2
V-0

IPC TM-650 2.6.2.1
ASTM D792 Method A
ASTM E1461
UL-94

Results listed above are typical properties, provided without warranty, expressed or implied, and without liability. Properties may vary, depending on design and application. Arlon reserves
the right to change or update these values.

Availability:
Arlon PartNumberGlass Style

Resin %Mil/Ply

Flow %

55NT147E210

491.91255NT247

E220

49

31255NT347

E230491.91255NT153

E210

53

2.32555NT253

E220

53

3.6

2555NT353

E230

53

52555NT165

E210

6555NT265

E220

6355NT365

E230

63

Recommended Process Conditions:
Process inner-layers through develop, etch, and strip using standard industry practices. Usebrown oxide on inner layers. Adjust dwell time in the oxide bath to ensure uniform coating.
Bake inner layers in a rack for 60 minutes at 107°C - 121°C (225°F - 250°F) immediately
prior to lay-up. Vacuum desiccate the prepreg for 8 - 12 hours prior to lamination.
Lamination Cycle:1)

Pre-vacuum for 30 - 45 minutes2)

Control the heat rise to 4.5°C – 6.5°C (8°F – 12°F) per minute between 82°C and 138°C (180°F and280°F)
Panel Size

Pressureincm

psikg/sq cm

12 x 1240 x 40

2501712 x 18

40 x 46275

1916 x 18

30 x 46350

2518 x 24

46 x 61

400273)

Product temperature at start of cure = 182°F (360°C).

4)

Cure time at temperature = 90 minutes5)

Cool down under pressure at ≤ 6°C/min (10°F/min)Drill at 350-400 SFM. Undercut bits are recommended for vias 0.023” (0.9cm) and smaller
De-smear using alkaline permanganate or plasma with settings appropriate for epoxy;plasma is preferred for positive etchback
Conventional plating processes are compatible with 55NT
Standard profiling parameters may be used; chip breaker style router bits are not recommended
Bake for 1 - 2 hours at 121°C (250°F) prior to solder reflow or HASL55NT

Optimal processing requirements may vary depending on specific equipment and operating conditions. These recommendations are offered only as a starting point.

North America:
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Arlon Material Technologies
No. 20 Datong Road, Export Processing Zone, Suzhou New & High District, Jiangsu, China
Tel (86) 512-6269-6966
Fax: (86) 512-6269-6038
Arlon Electronic Materials (Suzhou) Co., Ltd.
Building 7, Da Xing Industrial Park of Suzhou New & High District
Jinangsu, China 21500
Tel: (86) 512-6672-1698
Fax: (86) 512-6672-1697
Eastern China:
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Tel/Fax: (86) 21-6209-0202
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Rev 1.0

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