This document was developed by the SFF Committee prior to it
becoming the SFF TA (Technology Affiliate) TWG (Technical
Working Group) of the SNIA (Storage Networking Industry
Association) in 2016.

The information below should be used instead of the equivalent herein.

POINTS OF CONTACT: SFF TA TWG Chair Email: sff-chair@snia.org.
LOCATION OF SFF DOCUMENTS: http://www.snia.org/sff/specifications.
Suggestions for improvement of this specification are welcome and should besubmitted to http://www.snia.org/feedback.
If you are interested in participating in the activities of the SFF TA TWG, additional
information and the membership application can be found at:
http://www.snia.org/sff.

SFF-8436 Rev 4.9

PUBLISHEDSFF Committee documentation may be purchased in electronic form.
SFF specifications are available at ftp://ftp.seagate.com/sff

SFF Committee
SFF-8436
Specification for
QSFP+ 4X 10 Gb/s Pluggable Transceiver
Rev 4.9

August 31, 2018

Secretariat: SFF Committee
Abstract: This specification defines the electrical (copper), the optical and themechanical characteristics of the pluggable Quad SFP+ Module/direct attach cable plug andconnector.
This document provides a common specification for systems manufacturers, system
integrators, and suppliers of drives. This is an internal working document of the SFF
Committee, an industry ad hoc group. This specification is intended to supersede INF-8438
by adding support for 10 Gb/s data rates and updates to the mechanical specification
This specification is made available for public review, and written comments are
solicited from readers. Comments received by the members will be considered for inclusion
in future revisions of this specification.
Support: This specification is supported by the identified member companies of the SFF
Committee.
POINTS OF CONTACT:Tom Palkert
Technical Editor
Luxtera2320 Camino Vida Roble
Carlsbad CA 92011
Ph: 952-200-8542
tpalkert at luxtera dot com

QSFP+ 4X 10 GB/S Pluggable Transceiver

I. Dal Allan
Chairman
SFF Committee
14426 Black Walnut Court
Saratoga, CA 95070
Ph: 408-867-6630
endlcom at acm dot org

Page 1

SFF-8436 Rev 4.9

PUBLISHED
EXPRESSION OF SUPPORT BY MANUFACTURERS

The following member companies of the SFF Committee voted in favor of this industry
specification.
Amphenol
Cinch
EMC
Emulex
ENDL
ETRI
FCI
Finisar
Hewlett Packard
HGST
JDS Uniphase
Lotes Tech
LuxteraMellanox
Molex
NetApp
NetLogic uSyst
OclaroPanduit
Sumitomo
Sun Microsystems
TE Connectivity
Volex
The following member companies of the SFF Committee voted against this industry
specification.
Avago
QLogicThe following member companies of the SFF Committee voted to abstain on this industry
specification.
Dell Computer
FoxconnIntel
LSI
Luxshare-ICT
Sandisk
SeagateToshibaXyratex
The user's attention is called to the possibility that implementation to thisSpecification may require use of an invention covered by patent rights. By distributionof this specification, no position is taken with respect to the validity of a claim or
claims or of any patent rights in connection therewith. Members of the SFF Committee
which advise that a patent exists are required to provide a statement of willingness togrant a license under these rights on reasonable and non-discriminatory terms andconditions to applicants desiring to obtain such a license.

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SFF-8436 Rev 4.9

Change History:
Changes from Revision 3.5 to 3.6:
Section 1.1: Added descriptions for clauses 4 thru 7
Section 3:
Table 1 and 2: Added X to 10GFC column to match the 10GBE column.
Changed 'The overall package dimension shall conform to the indicated dimensions andtolerances and the mounting features.' to: The overall package dimension shall conform to
the indicated dimensions and tolerances indicated in clause 5. The mounting features...
Changed from 'The electrical and optical specifications shall be compatible with….'
to 'The electrical and optical specifications may be compatible with …..'
Section 3 page 10 line 19: Add: ‘"For speeds above 6Gb/s the compliance board methodologyof IEEE802.3ba, FC-PI4 and SFF8431 should be used.
Measurements taken with QSFP+
compliance boards should be corrected for any difference between the loss of thesecompliance boards and the loss of the compliance boards specified in the standard.’
Section 4:
4.1.1.2: changed 'post' to 'asserting "low"’
4.1.1.5: Added the following text: 'The INTL pin is de-asserted “High” when byte 2 bit 0(Data Not Ready)is read unless a flag is set (see 7.6.1.2).'
4.1.3.1: Changed 'Clause 6.6.5.2' to 'Clause 7.6.5.2'
4.1.3.2: Changed " For operation above 6 Gb/s see the appropriate specification forrequired voltage swings. Note: for 10G Ethernet reference SFF-8431. For 40G Ethernet
operation reference 802.3ba." to "For operation above 6 GBd see the appropriate
specification, e.g. 802.3ba, FC-PI-4, FC-PI-5 or the InfiniBand specification. For 10G
Ethernet, see SFF-8431."
Deleted ‘(absolute value)’ after ‘1600mv’.
4.2.1: Change "… filtering shown in Figure 4", to "… filtering equivalent to that shownin Figure 4".
4.2.1: In Table 6, added a reference to Figure 5 in the Condition column for Sustained
peak current at hot plug ... & Module Maximum Current Inrush....
4.2.1: At line 9, add a sentence "It is recommended that the 22 uF capacitors each havean equivalent series resistance of 0.22 ohm."
Section 5:
5.1: Updated the two bottom images to show the same keying structure as the two top
images (modules).
5.3: Enlarged the scale of Fig. 8 to make it easier to read the dimensions and notes.
Figure 8: Added missing dimensions at the bottom of figure.
5.3.1: Figure 10: Change pad width from ‘0.60 +/-0.03’ to ‘0.55 -0, +0.08’
Figure 10 detail 2: Change the tolerances from ‘0.08 +/- 0.015’ to ‘0.10 +/-0.05’.
Figure 14: Deleted the MX1 product code
Figure 17A and 17B: Changed the dimension in section Y-Y from ‘.2mm’ to ‘2.0 mm’.
5.10: Updated IEC-xxx reference to IEC 61754-20. Updated TIA reference for dual LC to
TIA/EIA-604-10A.
Section 7:
7.1:Added the following text: 'This QSFP+ specification is based on the INF8438
specification however it is not backward compatible.
Address 128 Page00 is used toindicate the use of the QSFP+ memory map rather than the QSFP memory map.'
7.2.1: Changed reference from ‘clause 3.1.2’ to ‘clause 4.1.2’.
7.4: Changed reference from ‘clause 6.6’ to ‘clause 7.6’ ; changed reference from ‘clause
3.1.1.1’ to ‘clause 4.1.1.1’ ; changed reference from ‘clause 3.1.2’ to ‘clause 4.1.2’.
7.6: Changed the last byte designation in page 00 from ‘126’ to ‘128’
7.6: Changed ‘Page 03 is required if byte 2, bit 2 in the lower page is set high’ to‘Page 03 is required if byte 2, bit 2 in the lower page is low.’
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SFF-8436 Rev 4.9

7.6.1: Consolidated 3 columns in tables 17-47: single column now reads: Passive copper,
active copper and active optical.
7.6.1.2: Added: 'These flags may be masked. (See 7.6.1.6) '7.6.1.4: Changed reference from ‘clause 6.6.1.3’ to ‘clause 7.6.1.3’
Table 24: Address 88: changed ‘RX’ to ‘TX’
7.6.2 Table 29: Added to byte 146 "Link length supported for 50/125 um fiber (OM4), unitsof 2 m) when Byte 147 declares 850 nm VCSEL as defined in Table 37."
Table 38: Changed reserved bytes from ‘7-4 to ‘7-5’. Added 'Reserved for' in front of FDR
for bit 3 and in front of EDR for bit 4
Table 41: Address 220 changed from ‘FEC BER’ to ‘reserved’
Table 43: Added references to table 44.
Table 45: For Address 226 - 239, in the Description column, changed the entry (2 Bytes)
to (14 Bytes).
Table 46: address 208-223: Changed byte column from ‘8’ to ‘16’.
7.6.5.2: changed ‘clause 3.1.3’ to ‘clause 4.1.3’
Changes from revision 3.6 to 3.7:
Changed the title from ‘Qsfp+ Copper And Optical Modules’ to ‘QSFP+ 4X 10 Gbs
Transceiver’

Pluggable

Section 2:
2.1 and 2.2: Added references.
Section 4:
4.1.1.5: The host needs to read both byte 2 and the flag field after completion of reset.
Defined bit 0 of Byte 6 in Table 20 to be Initialization complete Flag. Designated Byte
103 bit 0 as the mask bit for Initialization complete flag.
4.3: Added ‘Where ESD performance is not otherwise specified, e.g. in the InfiniBand
specification,’
Section 5:
5.3: Figure 9: Added ‘component free area’ to drawing
5.3.1: Figure 10: The accepted Rev 3.6 comment to change pad width from „0.60 +/-0.03‟ to„0.55 -0, +0.08‟" was not implemented in Fig 10.
Added LPMode Deassert time to Table 15
Parameter Symbol Max Unit
LPMode Deassert Time toff_LPMode
300 msConditions
Time for deassertion of LPMode (Vin:
LPMode=Vil) until module until themodule is fully functional3

Changes from revision 3.7 to 3.8:
- Editorial review of formatting and font consistency throughout.
- Bitmapped figures 24-29 were reconstructed as tables.
- Identified figures that have been patched by Text Boxes need to be re-drawn.
Changes from revision 3.8 to 3.9:
- Replaced Figure 30- Corrected sub-levels in Section 7.5- Deleted bitmapped figures 24-29 which had been left for comparison in 3.8
Changes from revision 3.9 to 4.0:
- Changed 'Module Maximum Current with LPMode Pin asserted' and 'Module Maximum Current
with LPMode Pin deasserted' to 'Maximum instantaneous current with LPMode asserted' and
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SFF-8436 Rev 4.9'Maximum instantaneous current with LPMode deasserted'- Changed "The QSFP+ module and host contacts with exception of the module and host highspeed signal contacts shall withstand 1000 V electrostatic discharge ..." to "The QSFP+
module and host high speed signal contacts shall withstand 1000 V electrostatic discharge..."- In Table 8 change the definition for datum B from, "Centerline of bezel" to "Insidesurface of bezel".
- In Figure 10 (top-left corner) changed from "0.55 -0 + 0.08", back to, "0.60 +/- 0.13
x 45° 2 PLACES"- In Table 15, for LPMode Deassert Time, add a reference in the conditions column to a
new note, Note 5, and add to the table "Note 5. Does not apply to Power Level 1 devices."- In Table 25, for byte 103, change bit column entry from '3 - 0' to '3 - 1'.
Changes from revision 4.0 to 4.1:
- Global change to improve legibility: subscripts replaced with regular fonts- Renumbered 7.5.3.4 to 7.5.3.3- Added SFF-8472 to 2.1 References and deleted 7.6 "APPLICABLE DOCUMENTS" paragraph- Reorganized 2.1 References into a list
- Reserved Table 33 Byte 133 bits 3-0 and Byte 134 bits 7-4
Changes from revision 4.1 to 4.2:
- Figures 7, 8, 9, 10, 11, 12, 13A, 13B, 17A & 17B redrawn- Pad width on Figure 10 changed back to 0.60±0.03 from 0.55±0.08
Changes from revision 4.2 to 4.3:
- Figure 8 redrawn
Note 4 was clarified
Note 9 re higher wattage models added
length of transceiver outside of cage restored to the 20 Max of the MSA- Figure 9 redrawn
Corrected Section B-B drafting error on dimensioning of Component Free Area
Added R 0.3 Max, 2 Plc to two radii (needed for hard stop to function properly)
Reversed crosshatching of Section J-J to clarify latch point and surface areas- Figure 17A redrawn
Note 9 re higher wattage models added- Figure 19 redrawn
Re-dimensioned thermal contact area to coincide with opening in top of cage
August 20- Figure 10 redrawn
Note re solder mask was incomplete
To be verified- Figure 17A
As redrawn includes three sets of dimensions which include that of 17B.
Figure 17B deleted and Figure 17A renumbered as Figure 17.
Change from Revision 4.3 to 4.4:
- Table 30 Identifier Values and Table 34 Encoding Values modified to point to SFF-8024
as the reference for later values and codes.
Change from Revision 4.4 to 4.5- ACK and NACK modified per user request (Figures 27, 28, 29)- Verified that Figure 17A was comprehensive, deleted 17B, and renamed 17A as 17.
Change from Revision 4.5 to 4.6- Removed Ref from upper left of Figure 17 (valid for only one of the configurations)- Moved notes from body to below figure.
Change from Revision 4.6 to 4.7- Corrected editorial error on Figure 28 and Figure 29 (Host NACK to Device ACK)
Change from Revision 4.7 to 4.8- Replaced Figure 8, Figure 9, Figure 13A, Figure 17, and Figure 19 with improved
drawings- Updated Table 9 Latch Retention spec from 180N to 125N
Rev 4.9 (August 31, 2018)- Document to be withdrawn from EIA; other than the changes to the header and cover page,
no content or formatting changes have been made since Rev 4.8 of this document.

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SFF-8436 Rev 4.9

Foreword
The development work on this specification was done by the SFF Committee, an industry
group. The membership of the committee since its formation in August 1990 has included a
mix of companies which are leaders across the industry.
When 2 1/2" diameter disk drives were introduced, there was no commonality on external
dimensions e.g. physical size, mounting locations, connector type, and connector
location, between vendors.
The first use of these disk drives was in specific applications such as laptop portablecomputers and system integrators worked individually with vendors to develop the
packaging. The result was wide diversity, and incompatibility.
The problems faced by integrators, device suppliers, and component suppliers led to theformation of the SFF Committee as an industry ad hoc group to address the marketing andengineering considerations of the emerging new technology.
During the development of the form factor definitions, other activities were suggested
because participants in the SFF Committee faced more problems than the physical form
factors of disk drives. In November 1992, the charter was expanded to address any issuesof general interest and concern to the storage industry. The SFF Committee became a forum
for resolving industry issues that are either not addressed by the standards process orneed an immediate solution.
Those companies which have agreed to support a specification are identified in the firstpages of each SFF Specification. Industry consensus is not an essential requirement topublish an SFF Specification because it is recognized that in an emerging product area,
there is room for more than one approach. By making the documentation on competing
proposals available, an integrator can examine the alternatives available and select the
product that is felt to be most suitable.
SFF Committee meetings are held during T10 weeks (see www.t10.org), and Specific Subject
Working Groups are held at the convenience of the participants. Material presented at SFF
Committee meetings becomes public domain, and there are no restrictions on the open
mailing of material presented at committee meetings.
Most of the specifications developed by the SFF Committee have either been incorporated
into standards or adopted as standards by EIA (Electronic Industries Association), ANSI(American National Standards Institute) and IEC (International ElectrotechnicalCommission).
If you are interested in participating or wish to follow the activities of the SFF
Committee, the signup for membership and/or documentation can be found at:www.sffcommittee.com/ie/join.html
The complete list of SFF Specifications which have been completed or are currently being
worked on by the SFF Committee can be found at:
ftp://ftp.seagate.com/sff/SFF-8000.TXT
If you wish to know more about the SFF Committee, the principles which guide theactivities can be found at:
ftp://ftp.seagate.com/sff/SFF-8032.TXT
Suggestions for improvement of this specification will be welcome. They should be sent to
the SFF Committee, 14426 Black Walnut Ct, Saratoga, CA 95070.

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SFF-8436 Rev 4.9

PUBLISHEDTABLE OF CONTENTS
1.

Scope
9
Description of Clauses ........................................................ 92.
References9
2.1
Industry Documents ............................................................ 9
2.2
SFF Specifications ............................................................ 9
2.3
Sources ....................................................................... 9
2.4
Conventions ................................................................... 10
3 Introduction
11
4 Electrical Specification
13
4.1 Electrical Connector............................................................. 13
4.1.1 Low Speed Electrical Hardware Pins........................................... 17
4.1.1.1 ModSelL................................................................... 18
4.1.1.2 ResetL.................................................................... 18
4.1.1.3 LPMode.................................................................... 18
4.1.2 Low Speed Electrical Specification........................................... 19
4.1.3 High Speed Electrical Specification.......................................... 20
4.1.3.1 Rx(n)(p/n)................................................................ 20
4.1.3.2 Tx(n)(p/n)................................................................ 20
4.2 Power Requirements............................................................... 21
4.2.1 Host Board Power Supply Filtering............................................ 21
4.3 ESD.............................................................................. 23
5 Mechanical and Board Definition24
5.1 Introduction..................................................................... 24
5.2 QSFP+ Datums and Component Alignment............................................. 24
5.3 QSFP+ Module Mechanical Package Dimensions....................................... 26
5.3.1
Mating of QSFP+ Module PCB to QSFP+ Electrical Connector ................. 29
5.4 Host PCB Layout.................................................................. 30
5.4.1 Insertion, Extraction and Retention Forces for QSFP+ Modules................. 31
5.5 Color Coding and Labeling of QSFP+ Modules....................................... 32
5.6 Bezel for Systems Using QSFP+ Modules............................................ 32
5.6.1 Bezel for the Thru Bezel Cage Assembly Version............................... 33
5.6.2 Bezel for the Behind the Bezel Cage Assembly Version......................... 34
5.7 QSFP+ Electrical Connector Mechanical............................................ 35
5.8 Individual QSFP+ Cage Assembly Versions.......................................... 36
5.8.1 QSFP+ Heat Sink Clip Dimensions.............................................. 39
5.8.2 QSFP+ Heat Sink Dimensions................................................... 39
5.8.3 Light Pipes.................................................................. 40
5.9 Dust / EMI Cover................................................................. 41
5.10 Optical Interface............................................................... 41
6 Environmental and Thermal
44
6.1 Thermal Requirements............................................................. 44
7 Management Interface
44
7.1 Introduction..................................................................... 44
7.2 Timing Specification............................................................. 44
7.2.1 Introduction................................................................. 44
7.2.2 Management Interface Timing Specification.................................... 44
7.2.3 Serial Interface Protocol.................................................... 45
7.2.3.1 Management Timing Parameters.............................................. 46
7.3 Memory Interaction Specifications................................................ 46
7.3.1 Timing for Soft Control and Status Functions................................. 47
7.4 Device Addressing and Operation.................................................. 49
7.5 Read/Write Functionality......................................................... 51
7.5.1 QSFP+ Memory Address Counter (Read AND Write Operations)..................... 51
7.5.2 Read Operations.............................................................. 51
7.5.2.1 Current Address Read..................................................... 51
1.1

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SFF-8436 Rev 4.9

7.5.2.2 Random Read.............................................................. 52
7.5.2.3 Sequential Read.......................................................... 53
7.5.2.4 Sequential Read from Random Start Address................................. 54
7.5.3 Write Operations............................................................ 55
7.5.3.1 BYTE Write................................................................ 55
7.5.3.2 Sequential Write......................................................... 56
7.5.3.3 Acknowledge Polling...................................................... 57
7.6 QSFP+ Memory Map................................................................. 57
7.6.1 Lower Memory Map............................................................. 59
7.6.1.1 Status Indicator Bits..................................................... 59
7.6.1.2 Interrupt Flags........................................................... 60
7.6.1.3 Module Monitors........................................................... 64
7.6.1.4 Channel Monitoring........................................................ 65
7.6.1.5 Control Bytes............................................................. 67
7.6.1.6 Module and Channel Masks.................................................. 68
7.6.1.7 Rate Select (Byte 87-88).................................................. 69
7.6.1.8 Password Entry and change................................................. 71
7.6.2 Upper Memory Map Page 00h.................................................... 71
7.6.2.1 Identifier (Address 128).................................................. 73
7.6.2.2 Extended Identifier (Address 129)......................................... 73
7.6.2.3 Connector (Address 130)................................................... 74
7.6.2.4 Specification compliance (Address 131-138)................................ 74
7.6.2.5 Encoding (Address 139).................................................... 76
7.6.2.6 BR, nominal (Address 140)................................................. 76
7.6.2.7 Extended RateSelect Compliance (Address 141).............................. 76
7.6.2.8 Length (Standard SM Fiber)-km (Address 142)............................... 77
7.6.2.9 Length (OM3) (Address 143)................................................ 77
7.6.2.10 Length (OM2) (Address 144)............................................... 77
7.6.2.11 Length (OM1) (Address 145)............................................... 77
7.6.2.12 Cable Assembly Length (Copper or active cable) (Address 146)............. 77
7.6.2.13 Device Tech (Address 147)................................................ 77
7.6.2.14 Vendor Name (Address 148-163)............................................ 78
7.6.2.15 Extended Module Codes (Address 164)...................................... 78
7.6.2.16 Vendor OUI (Address 165-167)............................................. 79
7.6.2.17 Vendor PN (Address 168-183).............................................. 79
7.6.2.18 Vendor Rev (Address 184-185)............................................. 79
7.6.2.19 Wavelength (Address 186-187)............................................. 79
7.6.2.20 Wavelength Tolerance (Address 188-189)................................... 79
7.6.2.21 Max Case Temp (Address 190).............................................. 80
7.6.2.22 CC_BASE (Address 191).................................................... 80
7.6.2.23 Options (Address 192-195)................................................ 80
7.6.2.24 Vendor SN (Address 196-211).............................................. 81
7.6.2.25 Date Code (Address 212-219).............................................. 81
7.6.2.26 Diagnostic Monitoring Type (Address 220)................................. 82
7.6.2.27 Enhanced Options (Address 221)........................................... 82
7.6.2.28 CC_EXT (Address 223)..................................................... 83
7.6.2.29 Vendor Specific (Address 224-255)........................................ 83
7.6.3 Upper Memory Map Page 01h.................................................... 84
7.6.4 User Writable and Vendor Specific Memory..................................... 84
7.6.5 Upper Memory Page 03h........................................................ 84
7.6.5.1 Module and Channel Thresholds............................................. 84
7.6.5.2 Optional Channel Controls................................................. 86
7.6.5.3 Channel Monitor Masks..................................................... 87

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SFF-8436 Rev 4.9

SFF Committee -QSFP+ 4X 10 Gb/s Pluggable Transceiver1.
Scope
In an effort to broaden the applications for storage devices, an ad hoc industry group ofcompanies representing system integrators, peripheral suppliers, and component suppliers
decided to address the issues involved.
The SFF Committee was formed in August, 1990 and the first working document was
introduced in January, 1991.
1.1
Description of Clauses
Clause 1 contains the Scope and Purpose
Clause 2 contains Referenced and Related Standards and SFF Specifications
Clause 3 begins the specification
Clause 4 contains electrical specifications
Clause 5 contains mechanical specifications and printed circuit board recommendations
Clause 6 contains environmental and thermal considerations
Clause 7 is a description of the management interface and management register contents.
2.
References
The SFF Committee activities support the requirements of the storage industry, and it isinvolved with several standards.
2.1
Industry Documents- GR-253-CORE- IEEE Std 802.3-2012- InfiniBand Architecture Specifications- FC-PI-2- FC-PI-3- FC-PI-4- SAS 2.0/2.1- INF-8438 QSFP (Quad SFP) 4 Gbs 4X Transceiver- SFF-8636 Shielded Cables Common Management Interface- SFF-8431 SFP+ (Chapter 3 high speed serial interface)- SFF-8472 Diagnostic Monitoring Interface for Optical Transceivers
2.2

SFF Specifications

There are several projects active within the SFF Committee. The complete list of
specifications which have been completed or are still being worked on are listed in thespecification at ftp://ftp.seagate.com/sff/SFF-8000.TXT
2.3
SourcesThose who join the SFF Committee as an Observer or Member receive electronic copies ofthe minutes and SFF specifications (http://www.sffcommittee.com/ie/join.html).
Copies of ANSI standards may be purchased from the InterNational Committee forInformation Technology Standards (http://tinyurl.com/c4psg).

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Copies of SFF, ASC T10 (SCSI), T11 (Fibre Channel) and T13 (ATA/SATA) standards andstandards still in development are available on the HPE version of CD_Access(http://tinyurl.com/85fts).
2.4
Conventions
The ISO convention of numbering is used i.e., the thousands and higher multiples are
separated by a space and a period is used as the decimal point. This is equivalent to theEnglish/American convention of a comma and a period.
AMERICAN
0.6
1,000
1,323,462.9

FRENCH0,6
1 000
1 323 462,9

QSFP+ 4X 10 GB/S Pluggable Transceiver

ISO
0.6
1 000
1 323 462.9

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SFF-8436 Rev 4.9

3 Introduction
This Specification covers the following items:a) electrical interfaces (including pinouts for data control, status, configuration andtest signals) and the electrical connector and recommended host PCB layout requirements.
b) management interfaces encompassing features from the current SFP MSA and includes
specific multi-data rate and multi-protocol implementations.
c) optical interfaces (including the optical connector receptacle and mating fiber optic
connector plug and recommended breakout cable assembly.) The optical specifications areleft to the applicable standards for each protocol.
d) mechanical including package outline with latching detail and optical connector
receptacle detail, electrical connector mechanical details for both the module and host
PCB halves, front panel cut-out recommended dimensions and a blocking key solution toprevent damage from XFP modules.
e) thermal requirements (case temperatures)f) electromagnetic interference (EMI) recommendations(including necessary shielding
features to seal the OEM chassis front panel output with and without the QSFP+ module
installed in the cage.)g) electrostatic discharge (ESD) requirements solely to the extent disclosed in theSpecification where the sole purpose of such disclosure is to enable products to operate,connect or communicate as defined within the Specifications.
The overall package dimension shall conform to the indicated dimensions and tolerancesindicated in clause 5.The mounting features shall be located such that the products aremechanically interchangeable with the cage and connector system. In addition, the overall
dimensions and mounting requirements for the cage and connector system on a circuit board
shall be configured such that the products are mechanically and electricallyinterchangeable and the overall dimensions and insertion requirements for the opticalconnector and corresponding fiber optic cable plug shall be such that the products aremechanically and optically interchangeable.
The electrical and optical specifications may be compatible with those enumerated in the
ITU-T Recommendation G.957 (STM-1, STM-4 and STM-16), Telcordia Technologies GR-253-CORE(OC-3, OC-12, OC-48 and OC-192), Ethernet IEEE 802.3 (Gigabit, 10Gigabit and 40Gigabit
Ethernet), InfiniBand Architecture Specifications (SDR, DDR and QDR), SFF-8431, or Fibre
Channel-PI-3/4 (2GFC, 4GFC, 8GFC) and 10GFC. Electrical and optical specifications may becompatible with standards under development.
The Specifications will provide a common solution for combined four-channel ports that
support SONET/SDH and/or Ethernet and/or InfiniBand and/or Fibre Channel specifications.
This specification encompasses design(s) capable of supporting multimode, single mode
Modules, passive copper, active copper and active optical cables.

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Distance
275m
220m
26m
33m
150m
75m
70m
50m
21m
550m
500m
66m
82m
300m
300m
150m
125m
75m
50m
200m
380m
150m
100m
150m

Distance
1.4km
2km
4km
10km
30km
40km

Table 1 - Multimode Fiber Applications
Fiber
IEE 802.3
Fibre Channel- FC-PIType
2/3/4
Core
1G
10 40
2
4
8
10
Diameter
E
GE GE
GFC
GFC
GFC
GFC
MHZ*km
62.5/200X
62.5/160
X
62.5/160
X
X
62.5/200X
X
62.5/200X
62.5/20062.5/200X
62.5/20062.5/200
X
50/500X
50/400X
50/400X
X
50/500X
X
50/2000
X
X
50/500X
50/500X
50/50050/50050/500X
50/2000
X
50/2000
X
50/2000
X
50/2000
X
50/4700
X

Fiber
type
SM
SM
SM
SM
SM

InfiniBand
SDR

DDR

X
X

X
X
X
X
X

Table 2 – Single mode Fiber Applications
IEEE 802.3
Fibre Channel FC-PIInfiniBand
2/3/4
1
10
40
2
4
8
10
SDR
DDR
GE
GE
GE
GFC
GFC
GFC
GFC
X

X

X
X
X

X

X

X
X

X

X
X
X

QDR

X

X

QDR

X

An application reference Model, See Figure 1, shows the high-speed data interface between
an ASIC (SerDes) and the QSFP+ module. Only one data channel of the interface is shownfor simplicity. Either parallel MPO or duplex LC fiber connectors can be used for the
optical interface.

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Figure 1 – Application Reference ModelQSFP+ reference points for 6Gb/s and lower speeds are as follows:
A: Host ASIC transmitter output at ASIC package pin on a DUT board
B: Host ASIC transmitter output across the Host Board and Host Edge Card connector at theModule Card Edge interface
B’: Host ASIC transmitter output across the Host Board at Host Edge Card Connector
C: QSFP+ receiver output at the Module Card Edge interface
C’: QSFP+ receiver output at Host Edge Card Connector
D: QSFP+ receiver output at Host ASIC package receiver input pin on a DUT board
Note: For speeds above 6Gb/s the compliance board methodology of IEEE802.3ba, FC-PI4 andSFF8431 should be used.
Measurements taken with QSFP+ compliance boards should becorrected for any difference between the loss of these compliance boards and the loss ofthe compliance boards specified in the standard.

4 Electrical Specification
This clause contains pin definition data for the QSFP+ Module. The pin definition data is
generic for gigabit -per-second datacom applications such as Fibre Channel and Gigabit
Ethernet and SONET/ATM applications. Compliance Points for high-speed signal electricalmeasurements are defined in Figure 1. Compliance Points for all other electrical signals
are at comparable points at the host edge card connector.
4.1 Electrical Connector
Figure 2 shows the signal symbols and contact numbering for the QSFP+ Module edge
connector. The diagram shows the module PCB edge as a top and bottom view. There are 38
contacts intended for high speed, low speed signals, power and ground connections. Table
3 provides more information about each of the 38 contacts.
For EMI protection the signals to the connector should be shut off when the QSFP+ Module
is removed. Standard board layout practices such as connections to Vcc and GND with Vias,use of short and equal-length differential signal lines, use of microstrip-lines and 50
Ohm terminations are recommended. The chassis ground (case common) of the QSFP+ module
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should be isolated from the module’s circuit ground, GND, to provide the equipment
designer flexibility regarding connections between external electromagnetic interference
shields and circuit ground, GND, of the module.

Figure 2 QSFP+ Module Pad Layout

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Pin
1
2
3
4
5
6
7
8
9
10
11
12

Table 3: Pin Function Definition
Logic
SymbolDescription

CML-I
CML-I
CML-I
CML-I
LVTTL-ILVTTL-I
LVCMOSI/O
LVCMOSI/O

GND
Tx2n
Tx2p
GND
Tx4n
Tx4p
GND
ModSelL
ResetLVcc RxSCL(See Figure 10 for pad dimensions)
Plug
Sequence
Ground1
Transmitter Inverted Data Input
3
Transmitter Non-Inverted Data Input
3
Ground1
Transmitter Inverted Data Input
3
Transmitter Non-Inverted Data Input
3
Ground1Module Select3
Module Reset
3+3.3V Power Supply Receiver2
2-wire serial interface clock
3

SDA

2-wire serial interface data

Notes
1

1

1

2

3

13
GND
Ground
1
1
14
CML-O
Rx3p
Receiver Non-Inverted Data Output
3
15
CML-O
Rx3n
Receiver Inverted Data Output
3
16
GND
Ground
1
1
17
CML-O
Rx1p
Receiver Non-Inverted Data Output
3
18
CML-O
Rx1n
Receiver Inverted Data Output
3
19
GND
Ground1
1
20
GND
Ground
1
1
21
CML-O
Rx2n
Receiver Inverted Data Output
3
22
CML-O
Rx2p
Receiver Non-Inverted Data Output
3
23
GND
Ground
1
1
24
CML-O
Rx4n
Receiver Inverted Data Output
3
25
CML-O
Rx4p
Receiver Non-Inverted Data Output
3
26
GND
Ground1
1
27
LVTTL-O ModPrsL Module Present
328
LVTTL-O IntL
Interrupt
329
Vcc Tx+3.3V Power supply transmitter
2
2
30
Vcc1
+3.3V Power supply
2
2
31
LVTTL-I LPMode
Low Power Mode
332
GND
Ground
1
1
33
CML-I
Tx3p
Transmitter Non-Inverted Data Input
3
34
CML-I
Tx3n
Transmitter Inverted Data Input
335
GND
Ground
1
1
36
CML-I
Tx1p
Transmitter Non-Inverted Data Input
3
37
CML-I
Tx1n
Transmitter Inverted Data Input
338
GND
Ground11Note 1: GND is the symbol for signal and supply (power) common for the QSFP+
module. All are common within the QSFP+ module and all module voltages arereferenced to this potential unless otherwise noted. Connect these directly to thehost board signal-common ground plane.
Note 2: Vcc Rx, Vcc1 and Vcc Tx are the receiver and transmitter power supplies andshall be applied concurrently. Requirements defined for the host side of the Host
Edge Card Connector are listed in Table 6. Recommended host board power supply
filtering is shown in Figures 3 and 4. Vcc Rx Vcc1 and Vcc Tx may be internallyconnected within the QSFP+ Module in any combination. The connector pins are each
rated for a maximum current of 500 mA.
Figure 3 shows an example of a complete QSFP+ host PCB schematic with connections to
SerDes and control ICs.

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Figure 3a: Example QSFP+ Host Board Schematic For Optical Modules

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Figure 3b Example QSFP+ Host Board Schematic for passive copper cables
4.1.1 Low Speed Electrical Hardware Pins
In addition to the 2-wire serial interface the module has the following low speed pinsfor control and status:
ModSelL
ResetL
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ModPrsL
IntL
4.1.1.1 ModSelL
The ModSelL is an input pin. When held low by the host, the module responds to 2-wireserial communication commands. The ModSelL allows the use of multiple QSFP+ modules on asingle 2-wire interface bus. When the ModSelL is “High”, the module shall not respond toor acknowledge any 2-wire interface communication from the host. ModSelL signal input
node must be biased to the “High” state in the module.
In order to avoid conflicts, the host system shall not attempt 2-wire interface
communications within the ModSelL de-assert time after any QSFP+ modules are deselected.
Similarly, the host must wait at least for the period of the ModSelL assert time before
communicating with the newly selected module. The assertion and de-asserting periods ofdifferent modules may overlap as long as the above timing requirements are met.
4.1.1.2 ResetL
The ResetL pin must be pulled to Vcc in the QSFP+ module. A low level on the ResetL pin
for longer than the minimum pulse length (t_Reset_init) initiates a complete module
reset, returning all user module settings to their default state. Module Reset Assert
Time (t_init) starts on the rising edge after the low level on the ResetL pin isreleased. During the execution of a reset (t_init) the host shall disregard all status
bits until the module indicates a completion of the reset interrupt. The module indicatesthis by asserting “low” an IntL signal with the Data_Not_Ready bit negated. Note that on
power up (including hot insertion) the module should post this completion of reset
interrupt without requiring a reset.
4.1.1.3 LPModeThe LPMode pin shall be pulled up to Vcc in the QSFP+ module. This function is affectedby the LPMode pin and the combination of the Power_over-ride and Power_set software
control bits (Address A0h, byte 93 bits 0,1).
The module has two modes a low power mode and a high power mode. The high power mode
operates in one of the four power classes.
When the module is in a low power mode it has a maximum power consumption of 1.5W.
This
protects hosts that are not capable of cooling higher power modules, should such modules
be accidentally inserted.
The modules 2-wire serial interface and all laser safety functions must be fully
operational in this low power mode.
The module shall still support the completion ofreset interrupt in this low power mode.
If the Extended Identifier bits (Page 00h, byte 129 bits 6-7) indicate a power
consumption greater than 1.5W and the module is in low power mode it must reduce its
power consumption to less than 1.5W while still maintaining the functionality above. The
exact method of accomplishing low power is not specified, however it is likely thateither the Tx or Rx or both will not be operational in this state.
If the Extended Identifier bits (Page 00h, byte 129 bits 6-7) indicate that its power
consumption is less than 1.5W then the module shall be fully functional independent of
whether it is in low power or high power mode.
The Module should be in low power mode if the LPMode pin is in the high state, or if thePower_ override bit is in the high state and the Power_set bit is also high.
The
module should be in high power mode if the LPMode pin is in the low state, or thePower_override bit is high and the Power_set bit is low.
Note that the default state
for the Power_override bit is low.

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PUBLISHEDA truth table for the relevant configurations of the LPMode and the Power_over-ride andPower_set are shown in Table 4.
LPMode1
0
X
X

Table 4 - Power Mode Truth Table
Power_overidePower_set Bit
Bit
0
X
0
X
1
1
1
0

Module Power
Allowed
Low Power
High Power
Low Power
High PowerAt Power up, the Power_override and Power_set bits shall be set to 0.
4.1.1.4 ModPrsL
ModPrsL is pulled up to Vcc_Host on the host board and grounded in the module. The
ModPrsL is asserted “Low” when inserted and deasserted “High” when the module isphysically absent from the host connector.
4.1.1.5 IntL
IntL is an output pin. When “Low”, it indicates a possible module operational fault or a
status critical to the host system. The host identifies the source of the interrupt using
the 2-wire serial interface. The IntL pin is an open collector output and must be pulled
to host supply voltage on the host board. The INTL pin is deasserted “High” after
completion of reset, when byte 2 bit 0 (Data Not Ready)is read with a value of ‘0’ andthe flag field is read (see 7.6.1.2).
4.1.2 Low Speed Electrical Specification
Low speed signaling other than SCL and SDA is based on Low Voltage TTL (LVTTL) operating
at Vcc. Vcc refers to the generic supply voltages of VccTx, VccRx, Vcc_host or Vcc1.
Hosts shall use a pull-up resistor connected to Vcc_host on each of the 2-wire interface
SCL (clock), SDA (data), and all low speed status outputs. The SCL and SDA is a hot pluginterface that may support a bus topology. During module insertion or removal, the module
may implement a pre-charge circuit which prevents corrupting data transfers from othermodules that are already using the bus.
Note 1-Timing diagrams for SCL and SDA are included in Subclause 6.2.2.
The QSFP+ low speed electrical specifications are given in Table 5. This specification
ensures compatibility between host bus masters and the 2-wire interface.

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Table 5 - Low Speed Control and Sense Signals
SymbolMin
Max
Unit Condition
VOL
0
0.4
V
IOL(max)=3.0mA
VOH
Vcc-0.5 Vcc+0.3
V
SCL and SDA
VIL-0.3
Vcc*0.3
V
VIH
VCC*0.7 Vcc + 0.5
VCapacitance for SCL
Ci
14
pF
and SDA I/O pin
Total bus
Cb
100
pF
3.0 k Ohms Pullup
capacitive load forresistor, max
SCL and SDA
200pF
1.6 k Ohms pullup
resistor max
LPMode, Reset and
VIL
-0.3
0.8
V
|Iin|<=125 uA for
ModSelL
0V<Vin,Vcc
VIH
2
VCC+0.3
V
ModPrsL and IntL
VOL
0
0.4
V
IOL=2.0mA
VOH
VCC-0.5 VCC+0.3
V
Parameter
SCL and SDA

4.1.3 High Speed Electrical Specification
4.1.3.1 Rx(n)(p/n)Rx(n)(p/n) are QSFP+ module receiver data outputs. Rx(n)(p/n) are AC-coupled 100 Ohm
differential lines that should be terminated with 100 Ohm differentially at the Host
ASIC(SerDes). The AC coupling is inside the QSFP+ module and not required on the Hostboard. When properly terminated, the differential voltage swing shall be less than orequal to 1600 mVpp or the relevant standard, whichever is less.
Note: Due to the possibility of insertion of QSFP modules into a host designed for QSFP+,
it is recommended that the damage threshold of the host input be at least 1600 mV peak topeak differential.
Output squelch for loss of optical input signal, hereafter Rx Squelch, is required andshall function as follows. In the event of the optical signal on any channel becoming
equal to or less than the level required to assert LOS, then the receiver data output forthat channel shall be squelched or disabled. In the squelched or disabled state output
impedance levels are maintained while the differential voltage swing shall be less than
50 mVpp.
In normal operation the default case has Rx Squelch active. Rx Squelch can bedeactivated using Rx Squelch Disable through the 2-wire serial interface. Rx Squelch
Disable is an optional function. For specific details refer to Subclause 7.6.5.2.
4.1.3.2 Tx(n)(p/n)Tx(n)(p/n) are QSFP+ module transmitter data inputs. They are AC-coupled 100 Ohm
differential lines with 100 Ohm differential terminations inside the QSFP+ module. The
AC coupling is inside the QSFP+ module and not required on the Host board. For operation
at 6 Gb/s and below the inputs will accept single-ended voltage swings between 250 mV to
800 mV and differential voltage swings between 500 mVpp to 1600 mVpp. For best EMI
results, single-ended swings between 250 mV and 600 mV and differential voltage swings
between 500 mVpp to 1200 mVpp are recommended. For operation above 6 Gb/s see theappropriate specification, e.g. 802.3ba Annex 86A, FC-PI-4, FC-PI-5 or the InfiniBand
specification. For 10G Ethernet reference SFF-8431.
Due to the possibility of insertion of QSFP+ modules into a host designed for QSFP
interface per INF-8438i the damage threshold of the module input shall be at least 1600
mV peak to peak differential.

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Output squelch, hereafter Tx Squelch, for loss of input signal, hereafter Tx LOS, is an
optional function. Where implemented it shall function as follows. In the event of thedifferential, peak-to-peak electrical signal on any channel becomes less than 50 mVpp,then the transmitter optical output for that channel shall be squelched or disabled andthe associated TxLOS flag set.
Where squelched, the transmitter OMA shall be less than or equal to -26 dBm and whendisabled the transmitter power shall be less than or equal to -30 dBm. For applications,e.g. Ethernet, where the transmitter off condition is defined in terms of average power,
disabling the transmitter is recommended and for applications, e.g. InfiniBand, where thetransmitter off condition is defined in terms of OMA, squelching the transmitter isrecommended.
In module operation, where Tx Squelch is implemented, the default case has Tx Squelch
active. Tx Squelch can be deactivated using Tx Squelch Disable through the 2-wire serialinterface. Tx Squelch Disable is an optional function. For specific details refer toClause 7.6.5.2.
4.2 Power Requirements
The power supply has three designated pins, Vcc Tx, Vcc1, and Vcc Rx, in the connector.
Vcc1 is used to supplement Vcc Tx or Vcc Rx at the discretion of the module vendor. Power
is applied concurrently to these pins.
Since different classes of modules exist with pre-defined maximum power consumption
limits, it is necessary to avoid exceeding the system power supply limits and cooling
capacity when a module is inserted into a system designed to only accommodate lower power
modules. It is recommended that the host, through the management interface, identify thepower consumption class of the module before allowing the module to go into high powermode.
A host board together with the QSFP+ module(s) forms an integrated power system. The host
supplies stable power to the module. The module limits electrical noise coupled back into
the host system and limits inrush charge/current during hot plug insertion.
All specifications shall be met at the maximum power supply current. No power sequencingof the power supply is required of the host system since the module sequences thecontacts in the order of ground, supply and signals during insertion.
4.2.1 Host Board Power Supply Filtering
The host board should use the power supply filtering equivalent to that shown in Figure
4.

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Figure 4 Recommended Host Board Power Supply Filtering
Any voltage drop across a filter network on the host is counted against the host DC set
point accuracy specification. Inductors with DC Resistance of less than 0.1 Ohm should be
used in order to maintain the required voltage at the Host Edge Card Connector. It is
recommended that the 22 uF capacitors each have an equivalent series resistance of 0.22
ohm.
The specification for the power supply is shown in Table 6.

Parameter
Vcc
Vcc set point accuracy
Power Supply Noise
including ripple
Sustained peak current
at hot plug with LPModePin asserted
Maximum instantaneous
current with LPModeasserted
Module sustained peakcurrent with LPMode Pindeasserted
Maximum instantaneous
current with LPModedeasserted

Table 6 - Power Supply Specification
MIN Nominal Max
Unit
Condition
3.3
V
Measured at Vcc Tx, Vcc Rx and
Vcc1.
-5
5
%
Measured at Vcc Tx, Vcc Rx and
Vcc1.
50
mV
1kHz to frequency of operation
measured at Vcc host.
495
mA
See Figure 5
600

mA

750

mA

900

mA

See Figure 5

These limits separately apply to the current that flows through each inductor in the
power supply filter.

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Figure 5 —Instantaneous and sustained peak currents for Vcc1, Vcc Tx or Vcc Rx
Power levels associated with classifications of modules are shown in Table 7.
Table 7 - Power Budget Classification
Power Level
Max Power (W)
1
1.5
2
2
3
2.5
4
3.5
In general, the higher power classification level is associated with higher data rates
and longer reach. The system designer is responsible for ensuring that the maximum
temperature does not exceed the case temperature requirements.

4.3 ESD
Where ESD performance is not otherwise specified, e.g. in the InfiniBand specification,
the QSFP+ module shall meet ESD requirements given in EN61000-4-2, criterion B test
specification when installed in a properly grounded cage and chassis. The units are
subjected to 15kV air discharges during operation and 8kV direct contact discharges tothe case. The QSFP+ module and host high speed signal contacts shall withstand 1000 V
electrostatic discharge based on Human Body Model per JEDEC JESD22-A114-B.
The QSFP+ module and all host contacts with exception of the module and host high speed
signal contacts shall withstand 2 kV electrostatic discharge based on Human Body Model
per JEDEC JESD22-A114-B.

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5 Mechanical and Board Definition

5.1 Introduction
The overall module defined in this clause is illustrated in Figure 6. All Pluggable
modules and direct attach cable plugs must mate to the connector and cage design definedin this specification. The QSFP+ optical interface shall meet the dimensional
specifications of IEC 61754-7 interface 7-3, the MPO adapter interface, and shall
optically mate with the plug on the optical fiber cabling. Several cage to bezel options
are defined. Both metal spring finger and elastomeric EMI solutions are permitted but
must pass customer defined requirements. Heat sink/clip thermal designs are application
specific and not specifically defined by this specification, however a general design isgiven as an example.

Figure 6 — QSFP+ pluggable and direct attach module rendering
5.2 QSFP+ Datums and Component Alignment
A listing of the datums for the various components is contained in Table 8. The
alignments of some of the datums are noted. The relationship of the Module, Cage, andConnector relative to the Host Board and Bezel is illustrated in Figure 7 by the locationof the key datums of each of the components. In order to reduce the complexity of thedrawings, all dimensions are considered centered unless otherwise specified.

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Table 8 — Definition of Datums
Description
Host Board Top Surface
Inside surface of bezel**Distance between Connector terminal thru holes on hostboard
D*Hard stop on Module
E**Width of Module
F
Height of Module housing
G**Width of Module pc board
H
Leading edge of signal contact pads on Module pc boardJ
Top surface of Module pc board
K*Host board thru hole #1 to accept connector guide post
L
*Host board thru hole #2 to accept connector guide post
M**Width of bezel cut out
N*Connector alignment pin
P**Width of inside of cage at EMI gasket (when fullycompressed)
R
Height of inside of cage at EMI gasket (when fullycompressed)
S
Seating plane of cage on host board
T*Hard stop on cage
V
Length of heat sink clip
W
Seating surface of the heat sink on the cage
X & Y
Host board horizontal and depth datums
Z**Width of heat sink surface that fits into clip
AA**Connector slot widthBB
Seating plane of cage on host board
CC
Length of boss on heat sink that fits inside of the cageDD
Top surface of connector backshell*Datums D, K, L, N and T are aligned when assembled (see figure 7)**Centerlines of datums AA, C, E, G, M, P and Z are aligned on the samevertical axis
Datum
A
B
C

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Figure 7 — QSFP+ Datum Alignment, Depth
5.3 QSFP+ Module Mechanical Package Dimensions
A common mechanical outline is used for all QSFP+ Modules and direct attach cables. The
preferred method of removing the module from the cage assembly is by a bail type
actuation method. The module shall provide a means to self-lock with the cage uponinsertion. The package dimensions for the QSFP+ Module are defined in Figure 8 and Figure
9. The dimensions that control the size of the module that extends outside of the cageare listed as maximum dimensions per Note 1 and Note 6 in Figure 8. Note: All dimensions
are in mm.

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Figure 8 — Drawing of QSFP+ Module

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Figure 9 — QSFP+ Module Tab drawings

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5.3.1
Mating of QSFP+ Module PCB to QSFP+ Electrical Connector
The QSFP+ Module contains a printed circuit board that mates with the QSFP+ electricalconnector. The pads are designed for a sequenced mating:First mate – ground contacts
Second mate – power contacts
Third mate – signal contacts
The pattern layout for the QSFP+ Printed Circuit Board is shown in Figure 10.

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5.4 Host PCB Layout
A typical host board mechanical layout for attaching the QSFP+ Connector and Cage System
is shown in Figure 11 and Figure 12. Location of the pattern on the host board isapplication specific. See Sub-clause 5.6 for details on the location of the patternrelative to the bezel.
To achieve 10 Gb/s performance pad dimensions and associated tolerances must be adhered
to and attention paid to the host board layout.

Figure 11 — QSFP+ Host PCB Mechanical Layout

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Figure 12 — QSFP+ Host PCB Mechanical Layout, Detail Z
5.4.1 Insertion, Extraction and Retention Forces for QSFP+ Modules
The requirements for insertion forces, extraction forces and retention forces are
specified in Table 9. The QSFP+ cage and module design combinations must ensure excessive
force applied to a cable does not damage the QSFP+ cage or host connector. If any part isdamaged by excessive force, it should be the cable or media module and not the cage orhost connector which is part of the host system.

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Table 9 — Insertion, Extraction and Retention Forces
Measurement
Min
Max
Units
Comments
QSFP+ Module
040N
insertion
QSFP+ Module
030
N
extraction
QSFP+ Module
90
N/A
N
No damage to module below
retention
90N
Cage retention (Latch 125
N/AN
No damage to latch below
strength)
125N
Cage retention in
114
N/A
N
Force to be applied in a
Host Board
vertical direction, no
damage to cage
Insertion / removal
100
N/A
Cycles Number of cycles for thecycles, connector /connector and cage withcage
multiple modules.
Insertion / removal
50
N/A
Cycles Number of cycles for an
cycles, QSFP+ Module
individual module.

5.5 Color Coding and Labeling of QSFP+ Modules
An exposed feature of the QSFP+ Module (a feature or surface extending outside of thebezel) shall be color coded as follows:
Beige for 850nm
Blue for 1310nm
White for 1550nm
Each QSFP+ Module shall be clearly labeled. The complete labeling need not be visible
when the QSFP+ Module is installed and the bottom of the device is the recommended
location for the label. Labeling shall include:
Appropriate manufacturing and part number identification
Appropriate regulatory compliance labeling
A manufacturing traceability code
The label should also include clear specification of the external port characteristics
such as:Optical wavelength
Required fiber characteristics
Operating data rate
Interface standards supported
Link length supported
The labeling shall not interfere with the mechanical, thermal or EMI features.

5.6 Bezel for Systems Using QSFP+ Modules
Host enclosures that use QSFP+ devices should provide appropriate clearances between the
QSFP+ Modules to allow insertion and extraction without the use of special tools and abezel enclosure with sufficient mechanical strength. The QSFP+ Module insertion slot
should be clear of nearby moldings and covers that might block convenient access to thelatching mechanisms, the QSFP+ Module, or the cables that plug directly into the cage.
There are two cage designs defined for use with QSFP+ modules as described in sub-clauses
5.6.1 and 5.6.2. The difference between them is that the front of one cage extends into
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or through the opening in the bezel and the other extends up against the back surface ofthe bezel. While the cage footprint is the same for both designs, its distance from theinside surface of the host bezel may differ depending on gasket selection. The
recommended basic dimension from the inside surface of the bezel to Datum K and Datum L
on the Host board may be different between designs and is addressed in Figures 13a and
13b.
These designs align with the two versions for cage assemblies as defined in Section 5.8.
The minimum recommended host board thickness for belly-to-belly mounting of theassemblies is different for each bezel version as noted in 5.6.1 and 5.6.2.
The bezel thickness range shall be 0.8 mm to 2.6 mm.

5.6.1 Bezel for the Thru Bezel Cage Assembly Version
The front surface of the cage assembly passes through the bezel.
Two EMI solutions may be implemented for this option. If EMI spring fingers are used,
they make contact to the inside of the bezel cutouts. If an EMI gasket is used, it makes
contact to the inside surface of the bezel. To accept all cage designs, both bezel
surfaces must be conductive and connected to chassis ground.
The minimum recommended host board thickness for belly to belly mounting of the connector
and cage assemblies is 2.2mm minimum.

Figure 13A — Recommended Bezel Design for cages that extend into or thru Bezel

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5.6.2 Bezel for the Behind the Bezel Cage Assembly Version
There are many options for a bezel EMI gasket that functions as a seal between the bezel
and the front of the cage. The design of the bezel EMI gasket and the materials used forthe gasket are application specific. The preferred method is to fasten the gasket to theback of the bezel with a pressure sensitive adhesive.
Assembly of the host board to the bezel will compress the gasket to the recommended range
specified by the bezel EMI gasket manufacturer. The surface in the back of the bezel thatis in contact with the bezel EMI gasket must be low resistance and connected to chassis
ground. The minimum recommended host board thickness for belly to belly mounting of theconnector and cage assemblies are 2.7mm minimum.
The gasket thickness after compression can be calculated as follows:
GT = BKL – 42.80 +/- 0.25mm.
Where:• GT is gasket thickness in the compressed state.
• BKL is the distance from the back of the bezel to the centerline of Datums K & L. See
Figure 11 and Figure 12 (Note: dimension from front of bezel to centerline of Datums K &L must not exceed 48.25mm).
• The 42.80 +/- 0.25mm dimension is the distance from the front of the cage to the hardstop, Datum T. See Figure 17.

Figure 13B — Recommended Bezel Design for cages that
extend up against the inside surface of the Bezel

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5.7 QSFP+ Electrical Connector Mechanical
The QSFP+ Connector is a 38-contact, right angle surface mount connector and is shown in
Figure 14. The mechanical specifications for the connector are listed in Table 9 andshown in Figure 15.

Figure 14 — QSFP+ Module Electrical Connector Illustration

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Figure 15 — QSFP+ Electrical Connector Specification
5.8 Individual QSFP+ Cage Assembly Versions
There are two versions for cage assemblies: a Thru Bezel version that passes through thebezel, and a Behind the Bezel version that does not pass through the bezel. An exploded
view of both Thru Bezel (left side) and behind the Bezel (right side) cage assemblies isshown schematically in Figure 16.

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Figure 16 — Thru Bezel (left side) and behind the bezel (right side) Cage and Optional
Heat Sink Designs (exploded view)

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Notes:

1. Inside surfaces of gaskets when fully compressed.
2. Break edge of inside tip of latch.
3. The maximum force to deflect the latch to the release position = 6N.
4. Latch deflection.
5. Cavity for heat sink is optional.
6. Optional pins.
7. Press fit pin solutions require a 1.44 min host board thickness.
8. Datum defined by seating plane of cage on host board.
9. Higher wattage models may require larger opening for cooling
Figure 17 — 1-by-1 Thru Bezel Cage Design

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5.8.1 QSFP+ Heat Sink Clip Dimensions
The heat sink clip defined in Figure 18 is for reference only. The design of the heatsink clip, heat sink and their attachment features on the cage assembly are vendor
specific and not defined in this document. When fastened to the cage, the clip will
provide a minimum force of 5 Newtons at the interface of the heat sink and QSFP+ Module.
The clip is designed to permit a heat sink to be fastened into the clip then assembled tothe cage and to expand slightly during module insertion in order to maintain a contact
force between the module and heat sink.

Figure 18 — QSFP+ Heat Sink Clip
5.8.2 QSFP+ Heat Sink Dimensions
The heat sink illustrated in Figure 19 is for reference only. Critical dimensions toensure that the heat sink will be compatible with the Heat Sink Clip are defined. The
configuration of the fins or posts is application specific along with the outsideenvelope. The heat sink includes a beveled edge which “rides up” the leading edge of themodule as the module is inserted into the cage assembly. The recommended material for theheat sink is aluminum and the surface treatment for the module contacting surface can be
anodizing or nickel plating.

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Figure 19 — QSFP+ Heat Sink
5.8.3 Light Pipes
The use of light pipes to indicate status of the module is application specific.

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5.9 Dust / EMI CoverIn order to prevent contamination of the internal components and to optimize EMI
performance, it is recommended that a Dust/EMI Cover be inserted into the cage assembly
when no module is present. See Figure 19 for the recommended design. During installation,
the front flange on the cover shall be seated against the front surface of the bezel toprevent dust from entering the equipment. The conductivity of the materials should bechosen for the Dust/EMI Cover to block EMI emissions.

Figure 20 — Dust / EMI Cover
5.10 Optical Interface
The QSFP+ optical interface port shall be either a male MPO connector as specified in IEC
61754-7 (see Figure 21a) or a dual LC as specified in IEC 61754-20 (see Figure 21b).
The four fiber positions on the left as shown in Fig. 20a, with the key up, are used forthe optical transmit signals (Channel 1 through 4). The fiber positions on the right areused for the optical receive signals (Channel 4 through 1).

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Two alignment pins are present.

Figure 21a — QSFP+ Optical Receptacle and Channel Orientation for MPO connector

Figure 21b — QSFP+ Optical Receptacle and Channel Orientation for dual LC connector

MPO Optical Cable connection
Aligned key (Type B) MPO patchcords should be used to ensure alignment of the signals
between the modules. The aligned key patchcord is defined in TIA-568 and shown in Figure
21c. The optical connector is orientated such that the keying feature of the MPO
receptacle is on the top.

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Figure 21c — QSFP+ MPO Optical patchcord

Dual LC Optical Cable connection
The Dual LC optical cable patchcord is defined in TIA/EIA-604-10A and shown in Figure
21d.

Figure 21d — QSFP+ dual LC Optical patchcord

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6 Environmental and Thermal

6.1 Thermal Requirements
The QSFP+ module shall operate within one or more of the case temperatures ranges definedin Table 10. The temperature ranges are applicable between 60m below sea level and 1800m
above sea level, (Ref. NEBS GR-63) utilizing the host systems designed airflow.
Class
Standard
ExtendedIndustrial

Table 10 Temperature Range Class of operation
Case Temperature Range
0 through 70C-5 through 85C-40 through 85C

QSFP+ is designed to allow for up to 16 adjacent modules, ganged and/or belly-to-belly,with the appropriate thermal design for cooling / airflow. (Ref. NEBS GR-63)

7 Management Interface
7.1 Introduction
A management interface, as already commonly used in other form factors like GBIC, SFP,
and XFP, is specified in order to enable flexible use of the module by the user. The
specification has been changed in order to adopt the use of a multi-channel module. Sometiming requirements are critical especially for a multi-channel device, so the interface
speed has been increased. This QSFP+ specification is based on the INF8438 specification
however it is not backward compatible.
Address 128 Page00 is used to indicate the useof the QSFP+ memory map rather than the QSFP memory map.
7.2 Timing Specification
7.2.1 Introduction
Low speed signaling is based on Low Voltage CMOS (LVCMOS) operating at Vcc. Hosts shalluse a pull-up resistor connected to a Vcc_host on the 2-wire interface SCL (clock) andSDA (Data) signals. Detailed electrical specification is given in Sub-clause 4.1.2.
Nomenclature for all registers more than 1 bit long is MSB-LSB.
7.2.2 Management Interface Timing Specification
In order to support a multi-channel device a higher clock rate for the serial interface
is considered. The timing requirements are shown in Figure 22 and specified in Table 11.
QSFP+ is positioned to leverage 2-wire timing (Fast Mode devices) to align the use of
related cores on host ASICs. This subclause closely follows the XFP MSA specification.

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Figure 22 — QSFP+ Timing Diagram
Before initiating a 2-wire serial bus communication, the host shall provide setup time
(Host_select_setup -Table 11) on the ModSelL line of all modules on the 2-wire bus. The
host shall not change the ModSelL line of any module until the 2-wire serial bus
communication is complete and the hold time requirement (Host_select_hold - Table 11) issatisfied. The 2-wire serial interface address of the QSFP+ module is 1010000X (A0h). In
order to allow access to multiple QSFP+ modules on the same 2-wire serial bus, the QSFP+
pinout includes a ModSelL or module select pin. This pin (which is pulled high ordeselected in the module) must be held low by the host to select the module of interest
and allow communication over the 2-wire serial interface. The module must not respond toor accept 2-wire serial bus instructions unless it is selected.
7.2.3 Serial Interface Protocol
The module asserts LOW for clock stretch on SCL.

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7.2.3.1 Management Timing Parameters
The timing parameters for the 2-Wire interface to the QSFP+ module are shown in Table 11.
Parameter

Table 11- Management Interface timing parameters
SymbolMin
Max Unit Conditions

Clock Frequency
Clock Pulse Width Low
Clock Pulse Width HighTime bus free before newtransmission can start
START Hold Time
START Set-up Time
Data In Hold Time
Data in Set-up Time
Input Rise Time (400kHz)

fSCL
tLOW
tHIGH
tBUF

0
1.3
0.6
20

400

kHz
us
us
us

tHD.STAtSU.STA
tHD.DATtSU.DATtR.400

0.6
0.6
0
0.1

Input Fall Time (400kHz)

tF.400STOP Set-up Time
ModSelL Setup Time

tSU.STO
Host_select_setup

0.6
2

us
ms

ModSelL Hold Time

Host_select_hold10usAborted sequence – bus
releaseDeselect _Abort

2

ms

300

us
us
us
us
ns

300

ns

Between STOP and START and
between ACK and ReStart

From (VIL,MAX-0.15) to(VIH, MIN +0.15)
From (VIH,MIN + 0.15) to(VIL,MAX – 0.15)
Setup time on the selectlines before start of ahost initiated serial bus
sequence
Delay from completion of aserial bus sequence tochanges of Module selectstatusDelay from a host deasserting ModSelL (at any
point in a bus sequence)
to the QSFP+ Module
releasing SCL and SDA

7.3 Memory Interaction Specifications
QSFP+ memory transaction timings are given in Table 12. Single byte writable memory
blocks are given in Table 13. Multiple byte writable memory blocks are defined in Table
14.

Parameter
Serial Interface
Clock Holdoff“Clock Stretching”
Complete Single
or Sequential
Write
Endurance (Write
Cycles)Table 12- QSFP+ Memory Specification
SymbolMin Max Unit
Conditions
T_clock_hold
500 usMaximum time the QSFP+Module may hold the SCL
line low before continuingwith a read or write
operation
tWR
40
ms
Complete (up to) 4 Byte
Write

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Page
A0h
A0h
A0h
A0h

Address
89-92
100-106
119-122123-126128-255
225-241242-253

Table 13- Single Byte Writable Memory Block
Address Volatile or
Description
Nonvolatile
86
Volatile
Control register
87
VolatileRx Rate selectregister
88
Volatile
Tx Rate selectregister
127
Volatile
Page Select Byte

Table 14- Multiple Byte Writable Memory Block#Volatile/NonVolatile Description
Bytes
4
Volatile
Application select per channel
7
Volatile
Module Mask
4
Volatile
Password Change Entry Area
(Optional)
4
Volatile
Password Entry Area (Optional)
128
Non-Volatile
User Writable memory – Page 02h
16Volatile
Vendor Specific Channel Controls–
Page 03h
12
Volatile
Channel Monitor Masks – Page 03h

7.3.1 Timing for Soft Control and Status Functions
Timing for QSFP+ soft control and status functions are described in Table 15.

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Table 15- Timing for QSFP+ soft control and status functions
SymbolMax
Unit Conditions
t_init2000 ms
Time from power on2 , hot plug or rising edge
Initializationof reset until the module is fullytimefunctional3 This time does not apply to nonPower level 0 modules in Low Power State
Reset Init
t_reset_init 2
us
A Reset is generated by a low level longer
Assert Timethan the minimum reset pulse time present on
the ResetL pin
Serial Bus
t_serial
2000 ms
Time from power on2 until module responds to
Hardware Readydata transmission over the 2-wire serial bus
Time
Monitor Datat_data2000 ms
Time from power on2 to data not ready, bit 0
Ready Timeof Byte 2, deasserted and IntL asserted
Reset Assert
t_reset2000 ms
Time from rising edge on the ResetL pin untilTime
the module is fully functional3
LPMode Assert
ton_LPMode
100
usTime for assertion of LPMode (Vin:Time
LPMode=Vih)until module power consumption
reaches Power Level 1.
LPMode Deassert Toff_LPMode300
ms
Time for deassertion of LPMode (Vin:Time
LPMode=Vil) until module is fully
functional3,5IntL Assert
ton_IntL
200
ms
Time from occurrence of condition triggeringTime
IntL until Vout:IntL=Vol
IntL Deassert
toff_IntL
500
usTime from clear on read4 operation ofTime
associated flag until Vout:IntL=Voh. This
includes deassert times for Rx LOS, Tx Fault
and other flag bits.
Rx LOS Assert
ton_los
100
ms
Time from Rx LOS state to Rx LOS bit set
Time(value = 1b) and IntL asserted.
Tx Fault Assert ton_Txfault
200
ms
Time from Tx Fault state to Tx Fault bit set
Time(value=1b) and IntL asserted.
Flag Assert
ton_flag200
msTime from occurrence of condition triggeringTimeflag to associated flag bit set (value=1b)
and IntL asserted.
Mask Assert
ton_mask
100
ms
Time from mask bit set (value=1b)1 until
Time
associated IntL assertion is inhibited
Mask Deassert
toff_mask
100
msTime from mask bit cleared (value=0b)1 until
Time
associated IntL operation resumes
Application ort_ratesel
100msTime from change of state of Application orRate SelectRate Select bit1 until transmitter or
Change Time
receiver bandwidth is in conformance withappropriate specification
Power_override
ton_Pdown
100
ms
Time from P_Down bit set (value = 1b)1 untilor Power_set
module power consumption reaches Power Level
Assert Time1Power_override
toff_Pdown
300
ms
Time from P_Down bit cleared (value = 0b)1
or Power_set
until the module is fully functional3
Deassert Time
Note 1. Measured from falling clock edge after stop bit of write transaction
Note 2. Power on is defined as the instant when supply voltages reach and remain at or
above the minimum level specified in Table 6
Note 3. Fully functional is defined as IntL asserted due to data not ready bit, bit 0byte 2, deasserted. The module should also meet optical and electrical specifications.
Parameter

Note 4. Measured from falling clock edge after stop bit of read transaction
Note 5. Does not apply to power level 1 modules

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Squelch and disable timings are defined in Table 16.
Table 16 - I/O Timing for Squelch & Disable
SymbolMax
Unit Conditions
ton_Rxsq
80
usTime from loss of Rx input signal until
the squelched output condition isreached. See Subclause 4.1.3.1.
Rx Squelch
toff_Rxsq
80
us
Time from resumption of Rx input signals
Deassert Timeuntil normal Rx output condition isreached. See subclause 4.1.3.1.
Tx Squelch
ton_Txsq
400
msTime from loss of Tx input signal until
Assert Timethe squelched output condition isreached. See subclause 4.1.3.2.
Tx Squelch
toff_Txsq
400ms
Time from resumption of Tx input signals
Deassert Timeuntil normal Tx output condition isreached. See subclause 4.1.3.2.
Tx Disable
ton_txdis
100
ms
Time from Tx Disable bit set (value =Assert Time1b)1 until optical output falls below
10% of nominal
Tx Disable
toff_txdis 400
msTime from Tx Disable bit cleared (value
Deassert Time= 0b)1 until optical output rises above
90% of nominal
Rx Output
ton_rxdis
100
ms
Time from Rx Output Disable bit set
Disable Assert(value = 1b)1 until Rx output fallsTime
below 10% of nominal
Rx Output
toff_rxdis 100
msTime from Rx Output Disable bit cleared
Disable Deassert(value = 0b)1 until Rx output rises
Timeabove 90% of nominal
Squelch Disable
ton_sqdis
100msThis applies to Rx and Tx Squelch and isAssert Timethe time from bit set (value = 0b)1
until squelch functionality is disabled.
Squelch Disable
toff_sqdis 100
msThis applies to Rx and Tx Squelch and is
Deassert Timethe time from bit cleared (value = 0b)1
until squelch functionality is enabled
Note 1: Measured from falling clock edge after stop bit of write transaction
Parameter
Rx Squelch
Assert Time

7.4 Device Addressing and Operation
Serial Clock (SCL): The host supplied SCL input to QSFP+ Modules is used to positive-edge
clock data into each QSFP+ device and negative-edge clock data out of each device. The
SCL line may be pulled low by a QSFP+ module during clock stretching.
Serial Data (SDA): The SDA pin is bi-directional for serial data transfer. This pin is
open-drain or open-collector driven and may be wire-ORed with any number of open-drain oropen collector devices. Master/Slave: QSFP+ Modules operate only as slave devices. The
host must provide a bus master for SCL and initiate all read/write communication.
Device Address: Each QSFP+ is hard wired at the device address A0h. See Subclause 7.6 formemory structure within each Module.
Multiple Devices per SCL/SDA: While QSFP+ Modules are compatible with point-to-point
SCL/SDA, they can share a single SCL/SDA bus by using the QSFP+ ModSelL line. See
Subclause 4.1.1.1,Subclause 4.1.2 and Table 3 for more information.
Clock and Data Transitions: The SDA pin is normally pulled high with an external device.
Data on the SDA pin may change only during SCL low time periods. Data changes during SCL
high periods indicate a START or STOP condition. All addresses and data words areserially transmitted to and from the QSFP+ in 8-bit words.
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Every byte on the SDA line must be 8-bits long. Data is transferred with the mostsignificant bit (MSB) first. START Condition: A high-to-low transition of SDA with SCL
high is a START condition, which must precede any other command.
STOP Condition: A low-to-high transition of SDA with SCL high is a STOP condition.
Acknowledge: After sending each 8-bit word, the transmitter releases the SDA line for one
bit time, during which the receiver is allowed to pull SDA low (zero) to acknowledge(ACK) that it has received each word.
Device address bytes and write data bytes initiated by the host shall be acknowledged by
QSFP+ Modules. Read data bytes transmitted by QSFP+ Modules shall be acknowledged by thehost for all but the final byte read, for which the host shall respond with a STOP
instead of an ACK.
Memory (Management Interface) Reset: After an interruption in protocol, power loss or
system reset the QSFP+ management interface can be reset. Memory reset is intended only
to reset the QSFP+ Module management interface (to correct a hung bus). No other module
functionality is implied.
1) Clock up to 9 cycles.
2) Look for SDA high in each cycle while SCL is high.
3) Create a START condition as SDA is highDevice Addressing: QSFP+ devices require an 8-bit device address word following a start
condition to enable a read or write operation. The device address word consists of amandatory sequence for the first seven most significant bits in Figure 23. This is common
to all QSFP+ devices.
1
MSB

0

1

0

0

0

0

R/W
LSB

Figure 23 – QSFP+ Device Address
The eighth bit of the device address is the read/write operating select bit. A read
operation is initiated if this bit is set high and a write operation is initiated if this
bit is set low. Upon compare of the device address (with ModSelL in the low state) the
QSFP+ Module shall output a zero (ACK) on the SDA line to acknowledge the address.

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7.5 Read/Write Functionality

7.5.1 QSFP+ Memory Address Counter (Read AND Write Operations)QSFP+ devices maintain an internal data word address counter containing the last address
accessed during the latest read or write operation, incremented by one. The address
counter is incremented whenever a data word is received or sent by the module. Thisaddress stays valid between operations as long as QSFP+ power is maintained. The address“roll over” during read and writes operations is from the last byte of the 128-bytememory page to the first byte of the same page.
7.5.2 Read Operations
7.5.2.1 Current Address Read
A current address read operation requires only the device address read word (10100001) besent, see Figure 24.
<-- QSFP+ ADDRESS --->
H
O
S
T

S
T
A
R
T

M
S
B
1

L
S
B
0

1

0

0

0

Q
S
F
P
+

0

R
E
A
D
1

0

x

A
C
K

M
S
B

x

x

x

x

x

x

x

N
A
C
K
1

S
T
O
P

L
S
B

<---- DATA WORD ----->
Figure 24 - QSFP+ Current Address Read Operation
Once acknowledged by the QSFP+, the current address data word is serially clocked out.
The host does not respond with an acknowledge, but does generate a STOP condition oncethe data word is read.

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7.5.2.2 Random Read
A random read operation requires a “dummy” write operation to load in the target byte
address as shown in Figure 25. This is accomplished by the following sequence.
<- QSFP+ ADDRESS ->
H
O
S
T

S
T
A
R
T

M
S
B
1

L
S
B
0

1

Q
S
F
P
+

0

0

0

0

<W
R
I
T
E
0

MEMORY ADDRESS

->

M
S
B
0

L
S
B

x

x

x

x

x

x

x

x

0

A
C
K

A
C
K

Begin Figure 25<- QSFP+ ADDRESS ->
S
T
A
R
T

M
S
B
1

L
S
B
0

1

0

0

0

0

R
E
A
D
1

x

x

x

x

x

x

S
T
O
P

0

x

A
C
K

M
L
S
S
B
B
<---- DATA WORD n---->
Figure 25 End

Figure 25 — QSFP+ Random Read

x

N
A
C
K
1

The target 8-bit data word address is sent following the device address write word
(10100000) and acknowledged by the QSFP+. The host then generates another START condition(aborting the dummy write without incrementing the counter) and a current address read bysending a device read address (10100001). The QSFP+ acknowledges the device address andserially clocks out the requested data word. The host does not respond with an
acknowledge, but does generate a STOP condition once the data word is read.

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7.5.2.3 Sequential Read
Sequential reads are initiated by either a current address read Figure 26 or a random
address read Figure 27. To specify a sequential read, the host responds with an
acknowledge (instead of a STOP) after each data word. As long as the QSFP+ receives an
acknowledge, it shall serially clock out sequential data words. The sequence isterminated when the host responds with a NACK and a STOP instead of an acknowledge.
<- QSFP+ ADDRESS ->
H
O
S
T

S
T
A
R
T

M
S
B
1

L
S
B
0

1

Q
S
F
P
+

0

0

0

0

R
E
A
D
1

A
C
K
0

x

A
C
K

M
S
B

x

x

x

x

x

x

x

0

L
S
B

<---- DATA WORD n---->
Begin Figure 26

A
C
K
x

x

M
S
B

x

x

x

x

x

x
L
S
B

0

x
M
S
B

x

x

x

x

x

x

x

N
A
C
K
1

S
T
O
P

L
S
B

<-- DATA WORD n+1 ---><-- DATA WORD n+x --->
Figure 26 End
Figure 26 — Sequential Address Read Starting at QSFP+ Current Address

QSFP+ 4X 10 GB/S Pluggable TransceiverPage 53

SFF-8436 Rev 4.9

PUBLISHED
7.5.2.4 Sequential Read from Random Start Address<- QSFP+ ADDRESS ->
H
O
S
T

S
T
A
R
T

M
S
B
1

L
S
B
0

1

0

0

0

0

<W
R
I
T
E
0

Q
S
F
P
+

MEMORY ADDRESS

->

M
S
B
0

L
S
B

x

x

x

x

x

x

x

x

0

A
C
K

A
C
K

Begin Figure 27<- QSFP+ ADDRESS ->
S
T
A
R
T

M
S
B
1

L
S
B
0

1

0

0

0

0

R
E
A
D
1

A
C
K
0

x

A
C
K

M
S
B

x

x

x

x

x

x

x

0

L
S
B

<---- DATA WORD n---->
Figure 27 Middle

A
C
K
x

x

M
S
B

x

x

x

x

x

x
L
S
B

0

x
M
S
B

x

x

x

x

x

x

x

N
A
C
K
1

S
T
O
P

L
S
B

<-- DATA WORD n+1 ---><-- DATA WORD n+x --->
Figure 27 End
Figure 27 — Sequential Address Read Starting with Random QSFP+ ReadQSFP+ 4X 10 GB/S Pluggable TransceiverPage 54

SFF-8436 Rev 4.9

PUBLISHED
7.5.3

Write Operations

7.5.3.1 BYTE Write
A write operation requires an 8-bit data word address following the device address write
word (10100000) and acknowledgement, see Figure 28.
<- QSFP+ ADDRESS ->
H
O
S
T

S
T
A
R
T

M
S
B
1

Q
S
F
P
+

L
S
B
0

1

0

0

0

0

<W
R
I
T
E
0

MEMORY ADDRESS

->

M
S
B
0

x

L
S
B
x

A
C
K

x

x

x

x

x

x

S
T
O
P
0

x

A
C
K

M
S
B

<Figure 28 - QSFP+ Write Byte Operation

x

x

x

x

x

DATA WORD

x

x

0

L
S
B

A
C
K

->

Upon receipt of this address, the QSFP+ shall again respond with a zero (ACK) toacknowledge and then clock in the first 8-bit data word. Following the receipt of the 8bit data word, the QSFP+ shall output a zero (ACK) and the host master must terminate thewrite sequence with a STOP condition for the write cycle to begin. If a START conditionis sent in place of a STOP condition (i.e. a repeated START per the 2-wire interface
specification) the write is aborted and the data received during that operation is
discarded. Upon receipt of the proper STOP condition, the QSFP+ enters an internally
timed write cycle, tWR, to internal memory. The QSFP+ disables its management interface
input during this write cycle and shall not respond or acknowledge subsequent commands
until the write is complete. Note that 2-wire interface “Combined Format” using repeated
START conditions is not supported on QSFP+ write commands.

QSFP+ 4X 10 GB/S Pluggable TransceiverPage 55

SFF-8436 Rev 4.9

PUBLISHED

7.5.3.2 Sequential Write
QSFP+’s shall support up to a 4 sequential byte write without repeatedly sending QSFP+
address and memory address information as shown in Figure 29.
<- QSFP+ ADDRESS ->
H
O
S
T

S
T
A
R
T

M
S
B
1

L
S
B
0

1

0

0

0

0

<W
R
I
T
E
0

Q
S
F
P
+

MEMORY ADDRESS

->

M
S
B
0

L
S
B

x

x

x

x

x

x

x

x

0

A
C
K

A
C
K

Begin Figure 29

A
C
K
x

x

x

x

x

x

x

M
S
B

x

0

L
S
B

A
C
K
x

x

x

x

x

x

x

M
S
B

x

0

L
S
B

<--- DATA WORD 1 ---><--- DATA WORD 2 ---->
Figure 29 Middle

A
C
K
x

x

M
S
B

x

x

x

x

x

x
L
S
B

0

S
T
O
P
x
M
S
B

x

x

x

x

x

x

x

0

L
S
B

A
C
K

<--- DATA WORD 3 ---><--- DATA WORD 4 ---->
Figure 29 End
Figure 29 - QSFP+ Sequential Write Operation
A “sequential” write is initiated the same way as a single byte write, but the hostmaster does not send a stop condition after the first word is clocked in. Instead, after
the QSFP+ acknowledges receipt of the first data word, the host can transmit up to three
more data words. The QSFP+ shall send an acknowledge after each data word received. The
host must terminate the sequential write sequence with a STOP condition or the write
operation shall be aborted and data discarded. Note that 2-wire interface “combinedformat” using repeated START conditions is not supported on QSFP+ write commands.
QSFP+ 4X 10 GB/S Pluggable TransceiverPage 56

PUBLISHED

SFF-8436 Rev 4.9

7.5.3.3 Acknowledge Polling
Once the QSFP+ internally timed write cycle has begun (and inputs are being ignored on
the bus) acknowledge polling can be used to determine when the write operation iscomplete. This involves sending a START condition followed by the device address word.
Only if the internal write cycle is complete shall the QSFP+ respond with an acknowledge
to subsequent commands, indicating read or write operations can continue.

7.6 QSFP+ Memory Map
This subclause defines the Memory Map for QSFP+ Module used for serial ID, digitalmonitoring and certain control functions. The interface is mandatory for all QSFP+
devices. The interface has been designed largely after the XFP MSA as defined in INF8077i Rev.4.0. The memory map has been changed in order to accommodate 4 optical channels
and limit the required memory space. The single address approach is used as found in XFP.
Paging is used in order to enable time critical interactions between host and Module.
The structure of the memory is shown in Figure 30. The memory space is arranged into alower, single page, address space of 128 bytes and multiple upper address space pages.
This structure permits timely access to addresses in the lower page, e.g. Interrupt Flags
and Monitors. Less time critical entries, e.g. serial ID information and thresholdsettings, are available with the Page Select function. The structure also provides
address expansion by adding additional upper pages as needed. For example, in Figure 30
upper pages 01 and 02 are optional. Upper page 01 allows implementation of Application
Select Table, and upper page 02 provides user read/write space. The lower page and upper
page 00 are always implemented. Page 03 is required if byte 2, bit 2 in the lower pageis low. See Table 39 for details regarding declaration of optional upper pages 01 and
02.
The interface address used is A0xh and is mainly used for time critical data likeinterrupt handling in order to enable a “one-time-read” for all data related to aninterrupt situation. After an Interrupt, IntL, has been asserted, the host can read out
the flag field to determine the effected channel and type of flag.

QSFP+ 4X 10 GB/S Pluggable TransceiverPage 57

SFF-8436 Rev 4.9

PUBLISHED

2-Wire Serial Address: 1010000x
0
ID and status(3 Bytes)

Interrupt Flags(19 Bytes)

Module Monitors(12 Bytes)

Channel Monitors(48 Bytes)

Reserved(4 Bytes)

Control(12 Bytes)

Reserved(2 Bytes)

Free Side Device andChannel Mask

(7 Bytes)

Reserved(1 Bytes)

Free Side Device
Properties(4 Bytes)

Reserved(7 Bytes)

Password Change
Entry Area (Optional)(4 Bytes)

Password Entry Area
(Optional)(4 Bytes)

Page Select Byte

(1 Bytes)

2

21

33

81

85

97

99

106

107

111

118

122

126

127

Page 00

Page 01 (Optional)

128
Base ID Fields

128
CC_APPS(64 Bytes)

191(1 Byte)255

128
Extended ID(32 Bytes)

223

255

Page 02 (Optional)

128

129
Vender SpecificID(32 Bytes)
131

133

AST Table
Length (TL)

(1 Byte)Application Code
Entry 0(2 Bytes)

Application Code
Entry 1

(2 Bytes)

User EEPROM
Data

Page 03 (Optional for Cable Assemblies)
128(128 Bytes)
175

223

Free Side Device
Threshold(48 Bytes)

ChannelThreshold(48 Bytes)

Reserved(2 Bytes)

Vender Specific(12 Bytes)

Channel Controls(4 Bytes)

Channel Monitor
Masks(12 Bytes)

Reserved(2 Bytes)

225

237

other entries
241

255

Application Code
Entry TL

(2 Bytes)Figure 30 — QSFP+ Memory Map

253

255

In order to allow access to multiple QSFP+ Modules on the same 2-wire serial interface,
the QSFP+ pinout includes a ModSelL pin which allows the host to select the respective
Module for interaction. See Subclause 4.1.1.1 for details on ModSelL and Subclause 4.1.2
for details of the 2-Wire serial interface.

QSFP+ 4X 10 GB/S Pluggable TransceiverPage 58

SFF-8436 Rev 4.9

PUBLISHED

Note: Reserved memory locations are to be filled with logic zeros in all bit locations
for reserved bytes, and in reserved bit locations for partially specified byte locations
as described in this clause. Optional bits (O) that are not being used are to be filledwith logic zeros. Not Applicable bits (NA) shall be filled with logic zeros. The
indications of Optional (O), Required (R) and Not Applicable (NA) registers are shown ineach table for the appropriate cable types.
7.6.1 Lower Memory Map
The lower 128 bytes of the 2-wire serial bus address space, see Table 17, is used toaccess a variety of measurements and diagnostic functions, a set of control functions,and a means to select which of the various upper memory map pages are accessed on
subsequent reads. This portion of the address space is always directly addressable andthus is chosen for monitoring and control functions that may need to be repeatedlyaccessed. The definition of Identifier field is the same as page 00h Address Byte 128.
Address
0
1-2
3-21
22-33
34-81
82-85
86-97
98-99
100-106
107-118
119-122123-126
127

Table 17 — Lower Memory Map (A0h)
Description
Type
Passive Copper,
Active Copper,
Active Optical
Identifier (1Read-OnlyR
Byte)
Status (2 Bytes)
Interrupt Flags(19 Bytes)
Module Monitors(12 Bytes)
Channel Monitors(48 Bytes)
Reserved (4 Bytes)
Control (12 Bytes)
Reserved (2 Bytes)
Module and Channel
Masks (7 Bytes)
Reserved (12Bytes)
Password Change
Entry Area
(optional) (4Bytes)
Password Entry
Area (optional) 4
Bytes
Page Select Byte

OpticalModuleR

Read-Only
Read-Only

See Table 18
See Tables 19-21

Read-Only

See Table 22

Read-Only

See Table 23

Read-Only
Read/Write
Read/Write
Read/Write

Reserved
See Table 24
Reserved
See Table 25

Read/Write

Reserved

Read/WriteO

O

Read/WriteO

O

Read/Write

R

R

7.6.1.1 Status Indicator Bits
The Status Indicators are defined in Table 18.

QSFP+ 4X 10 GB/S Pluggable TransceiverPage 59

SFF-8436 Rev 4.9

PUBLISHED
Address

1
2

Table 18 — Status Indicators (Page A0)
Name
Description
Passivecopper,ActiveCopper,ActiveOpticalAll
Reserved
7
Reserved
6
Reserved
5
Reserved
4
Reserved
3
Reserved2
Flat_mem
Upper memory flatRor paged. Flatmemory: 0=
paging, 1= page 0
only
1
IntL
Digital state ofO
the IntL
Interrupt output
pin0
Data_Not_Re Indicates ModuleR
ady
has not yetachieved power up
and memory data
is not ready. Bit
remains highuntil data isready to be readat which time thedevice sets the
bit low.
Bit

OpticalModuleR

R

R

The Data_Not_Ready bit is high during module power up and prior to a valid suite ofmonitor readings. Once all monitor readings are valid, the bit is set low until thedevice is powered down. If the memory contents are static this bit can be always low.

7.6.1.2 Interrupt Flags
A portion of the memory map (Bytes 3 through 21), form a flag field. Within this field,
the status of LOS and Tx Fault as well as alarms and warnings for the various monitored
items is reported. For normal operation and default state, the bits in this field havethe value of 0b. For the defined conditions of LOS, Tx Fault, module and channel alarms
and warnings, the appropriate bit or bits are set, value = 1b. Once asserted, the bits
remained set (latched) until cleared by a read operation that includes the affected bit
or reset by the ResetL pin.
Fault bits that are cleared while the underlying fault persists MAY be immediately set
again by the module. This may or may not cause the IntL to de-assert and then re-assert
quickly. Hosts should be tolerant of both behaviors. The Channel Status Interrupt Flags
are defined in Table 19. These flags may be masked. (See 7.6.1.6)

QSFP+ 4X 10 GB/S Pluggable TransceiverPage 60

SFF-8436 Rev 4.9

PUBLISHED

Address

Bit

3

7

4

5

Table 19 — Channel Status Interrupt Flags (Page A0)
Name
Description
Passivecopper,ActiveCopper,ActiveOpticalL-Tx4 LOS
Latched TX LOSO
indicator, channel 4

6

L-Tx3 LOS

5

L-Tx2 LOS

4

L-Tx1 LOS

3

L-Rx4 LOS

2

L-Rx3 LOS

1

L-Rx2 LOS0

L-Rx1 LOS

7-4
3

Reserved
L-Tx4 Fault

2

L-Tx3 Fault

1

L-Tx2 Fault

0

L-Tx1 Fault

All

Reserved

QSFP+ 4X 10 GB/S Pluggable Transceiver

OpticalModuleO

Latched TX LOS
indicator, channel 3
Latched TX LOS
indicator, channel 2
Latched TX LOS
indicator, channel 1
Latched RX LOS
indicator, channel 4
Latched RX LOS
indicator, channel 3
Latched RX LOS
indicator, channel 2
Latched RX LOS
indicator, channel 1

O

O

O

O

O

O

O

O

O

O

O

O

O

O

Latched TX fault
indicator, channel 4
Latched TX fault
indicator, channel 3
Latched TX fault
indicator, channel 2
Latched TX fault
indicator, channel 1

O

R

O

R

O

R

O

R

Page 61

SFF-8436 Rev 4.9

PUBLISHEDThe Module Monitor Interrupt Flags are defined in Table 20.
Table 20 — Module Monitor Interrupt Flags (Page A0)
Name
Description
Passivecopper,ActiveCopper,ActiveOptical7
L-Temp High Alarm
Latched highO
temperature alarm
6
L-Temp Low Alarm
Latched low
Otemperature alarm
5
L-Temp HighLatched highO
Warning
temperature warning
4
L-Temp Low
Latched low
OWarning
temperature warning
3-1
Reserved
0
Initialization
Asserted (one) after0
complete flag
initialization and/or
reset has completed.
Returns to Zero whenread.
7
L-Vcc High Alarm
Latched high supplyO
voltage alarm
6
L-Vcc Low Alarm
Latched low supplyO
voltage alarm
5
L-Vcc HighLatched high supplyO
Warning
voltage warning
4
L-Vcc Low Warning
Latched low supplyO
voltage warning
3-0
Reserved
All
Vendor Specific

Address

Bit

6

7

8

OpticalModule

R
O
O
O

0

O
O
O
O

The Channel Monitor Interrupt Flags are defined in Table 21.
Address

Bit

9

7
6
5
4
3
2
1
0

Table 21 — Channel Monitor Interrupt Flags (Page A0)
Name
Description
Passivecopper,ActiveCopper,ActiveOptical
L-Rx1 Power HighLatched high RX powerO
Alarm
alarm, channel 1
L-Rx1 Power Low
Latched low RX powerO
Alarm
alarm, channel 1
L-Rx1 Power HighLatched high RX powerO
Warning
warning, channel 1
L-Rx1 Power Low
Latched low RX powerO
Warning
warning, channel 1
L-Rx2 Power HighLatched high RX powerO
Alarm
alarm, channel 2
L-Rx2 Power Low
Latched low RX powerO
Alarm
alarm, channel 2
L-Rx2 Power HighLatched high RX powerO
Warning
warning, channel 2
L-Rx2 Power Low
Latched low RX powerO

QSFP+ 4X 10 GB/S Pluggable Transceiver

OpticalModule

O
O
O
O
O
O
O
O
Page 62

SFF-8436 Rev 4.9

PUBLISHED

13-14

All

Warning
L-Rx3 Power HighAlarm
L-Rx3 Power Low
Alarm
L-Rx3 Power HighWarning
L-Rx3 Power Low
Warning
L-Rx4 Power HighAlarm
L-Rx4 Power low
Alarm
L-Rx4 Power highWarning
L-Rx4 Power low
warning
L-Tx1 Bias HighAlarm
L-Tx1 Bias Low
Alarm
L-Tx1 Bias highWarning
L-Tx1 Bias Low
Warning
L-Tx2 Bias HighAlarm
L-Tx2 Bias Low
Alarm
L-Tx2 Bias HighWarning
L-Tx2 Bias Low
Warning
L-Tx3 Bias HighAlarm
L-Tx3 Bias Low
Alarm
L-Tx3 Bias HighWarning
L-Tx3 Bias Low
Warning
L-Tx4 Bias HighAlarm
L-Tx4 Bias Low
Alarm
L-Tx4 Bias HighWarning
L-Tx4 Bias Low
Warning
Reserved

15-16

All

Reserved

17-18

All

Reserved

19-21

All

Vendor Specific

10

7
6
5
4
3
2
1
0

11

7
6
5
4
3
2
1
0

12

7
6
5
4
3
2
1
0

QSFP+ 4X 10 GB/S Pluggable Transceiverwarning, channel 2
Latched high RX power
alarm, channel 3
Latched low RX power
alarm, channel 3
Latched high RX power
warning, channel 3
Latched low RX power
warning, channel 3
Latched high RX power
alarm, channel 4
Latched low RX power
alarm, channel 4
Latched high RX power
warning, channel 4
Latched low RX power
warning, channel 4
Latched high TX bias
alarm, channel 1
Latched low TX bias alarm,channel 1
Latched high TX bias
warning, channel 1
Latched low TX bias
warning, channel 1
Latched high TX bias
alarm, channel 2
Latched low TX bias alarm,channel 2
Latched High TX bias
warning, channel 2
Latched low TX bias
warning, channel 2
Latched high TX bias
alarm, channel 3
Latched low TX bias alarm,channel 3
Latched high TX bias
warning, channel 3
Latched low TX bias
warning, channel 3
Latched high TX bias
alarm, channel 4
Latched low TX bias alarm,
Channel 4
Latched high TX bias
warning, channel 4
Latched low TX bias
warning, channel 4
Reserved channel monitor
flags, set 3
Reserved channel monitor
flags, set 4
Reserved channel monitor
flags, set 5

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

Page 63

PUBLISHED

SFF-8436 Rev 4.9

7.6.1.3 Module Monitors
Real time monitoring for the QSFP+ module include Module temperature, Module supply
voltage, and monitoring for each transmit and receive channel. Channel monitoring
functions are described in Subclause 7.6.1.4.
Measured parameters are reported in 16-bit data fields, i.e., two concatenated bytes.
These are shown in Table 22. The 16 bit-data fields allow for wide dynamic range. This
is not intended to imply that a 16-bit A/D system is recommended or required in order toachieve the accuracy goals stated below. The width of the data field should not be taken
to imply a given level of precision. It is conceivable that the accuracy goals hereincan be achieved by a system having less than 16 bits of resolution. It is recommended
that any low-order data bits beyond the system’s specified accuracy be fixed at zero.
Overall system accuracy and precision will be vendor dependent.
To guarantee coherency of the diagnostic monitoring data, the host is required toretrieve any multi-byte fields from the diagnostic monitoring data structure by the useof a single two-byte read sequence across the 2-wire serial interface. The Module isrequired to insure that any multi-byte fields that are updated with diagnostic monitoringdata must have this update done in a fashion that guarantees coherency and consistency ofthe data.
In other words, the update of a multi-byte field by the Module must not occur such that a
partially updated multi-byte field can be transferred to the host. Also, the Module
shall not update a multi-byte field within the structure during the transfer of thatmulti-byte field to the host, such that partially updated data would be transferred tothe host.
Accuracy requirements specified below shall apply to the operating signal range specified
in the relevant standard. The manufacturer’s specification should be consulted for moredetail on the conditions under which the accuracy requirements are met.
Measurements are calibrated over vendor specified operating temperature and voltage andshould be interpreted as defined below. Alarm and warning threshold values should beinterpreted in the same manner as real time 16-bit data.
Internally measured Module temperature are represented as a 16-bit signed twos complement
value in increments of 1/256 degrees Celsius, yielding a total range of –128C to +128C
that is considered valid between –40 and +125C. Temperature accuracy is vendor specific
but must be better than ±3 degrees Celsius over specified operating temperature andvoltage. Please see vendor specification for details on location of temperature sensor.
Internally measured Module supply voltage are represented as a 16-bit unsigned integer
with the voltage defined as the full 16 bit value (0 – 65535) with LSB equal to 100
uVolt, yielding a total measurement range of 0 to +6.55 Volts. Practical considerations
to be defined by Module manufacturer will tend to limit the actual bounds of the supply
voltage measurement. Accuracy is vendor specific but must be better than ±3% of the
manufacturer’s nominal value over specified operating temperature and voltage.

QSFP+ 4X 10 GB/S Pluggable TransceiverPage 64

SFF-8436 Rev 4.9

PUBLISHED
Table 22 — Module Monitoring Values (Page A0)
Name
Description
Passivecopper,ActiveCopper,ActiveOpticalAddress

Bit

22

All

Temperature MSB

23

All

Temperature LSB

24-25
26

All
All

Reserved
Supply Voltage MSB

27

All

Supply Voltage LSB

28-29
30-33

All
All

Reserved
Vendor SpecificInternallymeasured moduletemperature

Internallymeasured modulesupply voltage

OpticalModule

O

R

O

R

O

O

O

O

7.6.1.4 Channel Monitoring
Real time channel monitoring is for each transmit and receive channel and includes
optical input power and Tx bias current. Module monitoring functions are described in
Subclause 7.6.1.3.
Measurements are calibrated over vendor specified operating temperature and voltage andshould be interpreted as defined below. Alarm and warning threshold values should beinterpreted in the same manner as real time 16-bit data. Table 23 defines the Channel
Monitoring.
Measured TX bias current is in mA and are represented as a 16-bit unsigned integer withthe current defined as the full 16 bit value (0 – 65535) with LSB equal to 2 uA, yielding
a total measurement range of 0 to 131 mA. Accuracy is vendor specific but must be better
than ±10% of the manufacturer’s nominal value over specified operating temperature andvoltage.
Measured RX received optical power is in mW and can represent either average received
power or OMA depending upon how bit 3 of byte 220 (upper memory page 00h) is set.
Represented as a 16 bit unsigned integer with the power defined as the full 16 bit value(0 – 65535) with LSB equal to 0.1 uW, yielding a total measurement range of 0 to 6.5535
mW (~-40 to +8.2 dBm). Absolute accuracy is dependent upon the exact optical wavelength.
For the vendor specified wavelength, accuracy shall be better than ±3 dB over specified
temperature and voltage. This accuracy shall be maintained for input power levels up to
the lesser of maximum transmitted or maximum received optical power per the appropriate
standard. It shall be maintained down to the minimum transmitted power minus cable plantloss (insertion loss or passive loss) per the appropriate standard. Absolute accuracy
beyond this minimum required received input optical power range is vendor specific.

QSFP+ 4X 10 GB/S Pluggable TransceiverPage 65

SFF-8436 Rev 4.9

PUBLISHED

Addres
s

Bit

34

All

35

All

36

All

37

All

38

All

39

All

40

All

41

All

42

All

43

All

44

All

45

All

46

All

47

All

48

All

49

All

50-57
58-65
66-81

Table 23 — Channel Monitoring Values (Page A0)
Name
Description
Passivecopper,ActiveCopper,ActiveOpticalRx1 Power
Internally measured RX input
O
MSB
power, channel 1
Rx1 Power
O
LSB
Rx2 Power
Internally measured RX input
O
MSB
power, channel 2
Rx2 Power
O
LSB
Rx3 Power
Internally measured RX input
O
MSB
power, channel 3
Rx3 Power
O
LSB
Rx4 Power
Internally measured RX input
O
MSB
power, channel 4
Rx4 Power
O
LSB
Tx1 Bias
Internally measured TX bias,
O
MSB
channel 1
Tx1 BiasO
LSB
Tx2 Bias
Internally measured TX bias,
O
MSB
channel 2Tx2 BiasO
LSB
Tx3 Bias
Internally measured TX bias,
O
MSB
channel 3Tx3 BiasO
LSB
Tx4 Bias
Internally measured TX bias,
O
MSB
channel 4Tx4 BiasO
LSB
Reserved channel monitor set 3
Reserved channel monitor set 4
Vendor Specific

QSFP+ 4X 10 GB/S Pluggable Transceiver

OpticalModule

O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O

Page 66

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7.6.1.5 Control Bytes
Control Bytes are defined in Table 24. These bytes are intended to be written by thehost.
Table 24 — Control Bytes (Page A0)
Address Bit Name
Description
Passive Optical
Copper, Module
ActiveCopper,ActiveOptical86
7-4 Reserved
3
Tx4 Disable
Read/Write bit that allows
OR
software disable of transmitters1
2
Tx3 Disable
Read/Write bit that allows
OR
software disable of transmitters11
Tx2 Disable
Read/Write bit that allows
OR
software disable of transmitters10
Tx1 Disable
Read/Write bit that allows
OR
software disable of transmitters1
87
7/6 Rx4_Rate_selectSoftware rate select. Rx Channel
O
O
4 MSB/LSB
5/4 Rx3_Rate_selectSoftware rate select. Rx Channel
O
O
3 MSB/LSB
3/2 Rx2_Rate_selectSoftware rate select. Rx Channel
OO
2 MSB/LSB
1/0 Rx1_Rate_selectSoftware rate select. Rx Channel
OO
1 MSB/LSB88
7/6 Tx4_Rate_selectSoftware rate select. Tx Channel
O
O
4 MSB/LSB
5/4 Tx3_Rate_selectSoftware rate select. Tx Channel
O
O
3 MSB/LSB
3/2 Tx2_Rate_selectSoftware rate select. Tx Channel
OO
2 MSB/LSB
1/0 Tx1_Rate_selectSoftware rate select. Tx Channel
OO
1 MSB/LSB
89
All Rx4_Application_Select Software Application Select perOO
SFF-8078, Rx Channel 4
90
All Rx3_Application_Select Software Application Select perOO
SFF-8078, Rx Channel 3
91
All Rx2_Application_Select Software Application Select perOO
SFF-8078, Rx Channel 2
92
All Rx1_Application_Select Software Application Select perOO
SFF-8078, Rx Channel 193
2-7 Reserved
931Power set
Power set to Low Power ModeR
R
Default 0930Power override
Override LP mode signal; powerRR
mode set via software; Default 0

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94

All

Tx4_Application_Select

95

All

Tx3_Application_Select

96

All

Tx2_Application_Select

97

All

Tx1_Application_SelectSoftware application per SFF8079, Tx Channel 4
Software application per SFF8079, Tx Channel 3
Software application per SFF8079, Tx Channel 2
Software application per SFF8079, Tx Channel 1

O

O

O

O

O

O

O

O

98-99
All Reserved
1. Writing ‘1’ disables the laser of the channel
If software Rate Select is not implemented, the Module ignores the value of Rate Selectbits. The registers read all “0”s upon power-up.
7.6.1.6 Module and Channel Masks
The host system may control which flags result in an interrupt (IntL) by setting highindividual bits from a set of masking bits in bytes 100-104 for module flags, and bytes
242-253 of page 03h for channel flags. These are described in Table 25 and Table 48. A
1 value in a masking bit prevents the assertion of the hardware IntL pin by thecorresponding latched flag bit. Masking bits are volatile and startup with all unmasked(masking bits 0).
The mask bits may be used to prevent continued interruption from on-going conditions,which would otherwise continually reassert the hardware IntL pin. A mask bit is required(indicated by C for Conditional) whenever the associated flag bit is implemented.
Table 25 — IntL Masking Bits for Module and Channel Status Interrupts (Page A0)
Address Bit Name
Description
Linear/Passive
OpticalActive Copper,
ModuleActive Optical1007
M-Tx4 LOS Masking bit for TX LOSCC
indicator, channel 4
6
M-Tx3 LOS Masking bit for TX LOSCC
indicator, channel 3
5
M-Tx2 LOS Masking bit for TX LOSCC
indicator, channel 2
4
M-Tx1 LOS Masking bit for TX LOSCC
indicator, channel 1
3
M-Rx4 LOS Masking bit for RX LOSCC
indicator, channel 42
M-Rx3 LOS Masking bit for RX LOSCC
indicator, channel 31
M-Rx2 LOS Masking bit for RX LOSCC
indicator, channel 20
M-Rx1 LOS Masking bit for RX LOSCC
indicator, channel 1
101
7-4 Reserved
3
M-Tx4
Masking bit for TX fault CR
Fault
indicator, channel 4
2
1
0

M-Tx3
Fault
M-Tx2
Fault
M-Tx1
Fault

Masking bit for TX fault
indicator, channel 3
Masking bit for TX fault
indicator, channel 2
Masking bit for TX fault
indicator, channel 1

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R

C

R

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102
103

All
7
6
5
4
3-1
0

104

7
6
5
4

105-106

3-0
All

Reserved
M-TempMasking bit for highHigh
Temperature alarm
Alarm
M-TempMasking bit for low
Low Alarm Temperature alarm
M- Temp
Masking bit for highHigh
Temperature warning
Warning
M-TempMasking bit for low
Low
Temperature warning
Warning
Reserved
MMasking bit for
Initializ initialization complete
ation
flag.
completeflag
M-Vcc
Masking bit for high Vcc
High
alarm
alarm
M-Vcc Low Masking bit for low Vcc
alarm
alarm
M-Vcc
Masking bit for high Vcc
Highwarning
Warning
M-Vcc Low Masking bit for low Vcc
Warning
warning
Reserved
Vendor Specific

C

C

C

C

C

C

C

C

C

C

C

C

C

C

C

C

C

C

7.6.1.7 Rate Select (Byte 87-88)
Rate Select is an optional control used to limit the receiver bandwidth for compatibility
with multiple data rates (most likely Fibre Channel). In addition, rate selection allows
the transmitter to be fine-tuned for specific data rate transmissions.
The Module may:
a)
b)
c)

Provide no support for rate selection
Rate selection using extended rate selectRate selection with application select tables

7.6.1.7.1 No Rate Selection Support
When no rate selection is supported, (page 00h, byte 221, bits 2 and 3) have a value of 0
and Options (page 00h, byte 195, bit 5) have a value of 0. Lack of implementation does
not indicate lack of simultaneous compliance with multiple standard rates. Compliancewith particular standards should be determined from Module Values (See Table 33).
7.6.1.7.2 Extended Rate Selection
When (page 00h, byte 221, bits 2 and 3) have the values of 0 and 1 respectively and at
least one of the bits in the Extended Rate Compliance byte (page 00h, byte 141) have avalue of one, the module supports extended rate select. Extended rate selection has
reserved two bits per channel in the Rxn_Rate_Select (byte 87) and two bits per channel
in the Txn_Rate_Select (byte 88) to denote up to four rates. Table 26 defines the

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functionality when bit 0 of byte 141 is 1. All other values of Extended Rate Compliancebyte are reserved.
Table 26 — Functionality of byte 87 and 88: xN_Rate_Selectwith Extended Rate selection Page (A0)xN_Rate_SelectxNDescription
Linear/Passive
Opticalmsb Value
Rate_SelectActive Copper,
ModuleIsb Value
Active Optical
00Optimized for data O
Orates less than
2.2Gb/s
01
Optimized for data O
Orates from 2.2 up
to 6.6 Gb/s
10
Optimized for 6.6
OO
Gb/s data rates
and above1
1
Reserved

7.6.1.7.3 Rate Selection Using Application Select Tables
Application Select(byte 89) maximizes compatibility with SFF-8079 Part 2 for Modules thatare SFF-8472 compliant.
When the Rate Select declaration bits (page 00h, byte 221, bits 2 and 3) have the valuesof 1 and 0 respectively, the Application Select method defined in Page 01h is used (seeSubclause 7.6.3).
The host reads the entire application select table on page 01h to determine thecapabilities of the Module. The host controls each channel separately by writing aControl Mode and Table Select (TS) byte to bytes 89-92 and bytes 94-97. The bits of the
Rx_Application Select and the Tx_Application Select registers are defined in Table 27.
Table 27--Definition of Application Select(Bytes 89 to 92 and Bytes 94 to 97) (Page A0)
7
6
5
4
3
2
1
0
Control Mode
Table Select TS
Control Mode defines the application control mode. Table Select selects module behavior
from the AST among 63 possibilities (000000 to 111110). Note that (111111) is invalid.
Table 28 — Detailed Description of Control Mode (Page A0)
Bit 6
Function
Address 87, 88
Table SelectControl
Control00Extended rate
LSB and MSB are used
Ignoredselectionaccording to
declaration bits.
1
Don’t
Application
Ignoredfield points
careselecttoapplication
Note: Default values for control mode is 0,0 and is volatile memory.
Bit 7

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7.6.1.8 Password Entry and change
Bytes 119-126 are reserved for an optional password entry function. The Password entry
bytes are write only and will be retained until power down, reset, or rewritten by host.
This function may be used to control read/write access to vendor specific page 02h.
Additionally, module vendors may use this function to implement write protection ofSerial ID and other QSFP+ read only information. Passwords may be supplied to and used by
Host manufacturers to limit write access in the User EEPROM Page 02h.
Password access shall not be required to access QSFP+ defined data in the lower memory
page 00h or in upper pages 00h, 02h and 03h. Note that multiple module manufacturer
passwords may be defined to allow selective access to read or write to various sectionsof memory as allowed above.
Host manufacturer and module manufacturer passwords shall be distinguished by the highorder bit (bit 7, byte 123). All host manufacturer passwords shall fall in the range of00000000h to 7FFFFFFFh, and all module manufacturer passwords in the range of 80000000h
to FFFFFFFFh. Host manufacturer passwords shall be initially set to 00001011h in new
modules.
Host manufacturer passwords may be changed by writing a new password in bytes 119-122
when the correct current Host manufacture password has been entered in 123-126, with thehigh order bit being ignored and forced to a value of 0 in the new password.
The password entry field shall be set to 00000000h on power up and reset.
7.6.2 Upper Memory Map Page 00h
Page 00h consists of the Serial ID and is used for read only identification information.
The Serial ID is divided into the Base_ID Fields, Extended ID Fields and Vendor Specific
ID Fields. The format of the Serial ID Memory Map is shown in Table 29.
Address

Size
(Byt
es)

Table 29 — Serial ID: Data Fields (Page 00)
Name
Description of Base ID
Passive
Field
Copper,ActiveCopper,ActiveOpticalBase ID
fields128

1

Identifier

129

1

130

1

Ext.
Identifier
Connector

131-138

8

Specification
compliance

139

1

Encoding

140

1

BR, nominal

141

1

142

1

ExtendedrateselectCompliance
Length(SMF)

OpticalModuleIdentifier Type of serial
ModuleExtended Identifier ofSerial Module
Code for connector type

R

R

R

R

R

R

Code for electronic
compatibility or opticalcompatibility
Code for serial encoding
algorithm
Nominal bit rate, unitsof 100 MBits/s
Tags for extended rate
select compliance

R

R

R

R

R

R

R

R

Link length supported for
SMF fiber in km (note 1)

R

R

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143

1

Length(OM3 50
um)

144

1

Length(OM2 50
um)

145

1

Length(OM162.5 um)

146

1

Length(Copper)

147
148-163
164

1
16
1

165-167

3

Device tech
Vendor name
Extended
ModuleVendor OUI

168-183

16

Vendor PN

184-1852

Vendor rev

186-187

2

Wave lengthor Copper
cable
Attenuation

188-1892

Wavelength
tolerance

190

1

191

1

Max case
temp.
CC_BASE

Link length supported for
EBW 50/125 um fiber (OM3),
units of 2m (note 1)
Link length supported for
50/125 um fiber (OM2),
units of 1m (note 1)
Link length supported for
62.5/125 um fiber (OM1),
units of 1m (note 1)
Link length of copper or
active cable, units of 1 m(note 1)Link length
supported for 50/125 um
fiber (OM4), units of 2 m)
when Byte 147 declares 850
nm VCSEL as defined inTable 37
Device technology
QSFP+ vendor name(ASCII)
Extended Module codes forInfiniBand
QSFP+ vendor IEEE company
ID
Part number provided by
QSFP+ vendor(ASCII)
Revision level for partnumber provided by
vendor(ASCII)
Nominal laser wavelength(wavelength=value/20 innm) or copper cableattenuation in dB at
2.5GHz (Adrs 186) and5.0GHz (Adrs 187)
Guaranteed range of laser
wavelength(+/- value) fromnominalwavelength.(wavelength
Tol.=value/200 in nm)
Maximum case temperature
in degrees C
Check code for base ID
fields (addresses 128-190)

R

R

R

R

R

R

R

R

R
R
R

R
R
R

R

R

R

R

R

R

R

R

R

R

R

R

R

R

Rate Select, TX Disable,
TX Fault, LOS, Warning
indicators for:
Temperature, VCC, RX
power, TX Bias
Serial number provided by
vendor (ASCII)

R

R

R

R

Vendor’s manufacturing
date code
Indicates which types ofdiagnostic monitoring are
implemented (if any) in
the Module. Bit 1,0

R

R

R

R

Extended ID fields
192-195

4

Options

196-211

16

Vendor SN

212-219

8

Date Code220

1

Diagnostic
MonitoringType

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221

1

Enhanced
Options

222
223

1
1

Reserved
CC_EXT

Reserved
Indicates which optional
enhanced features are
implemented in the Module.
Check code for the
Extended ID Fields(addresses 192-222)

R

R

R

R

Vendor Specific ID Fields
224-255

32

Vendor Specific EEPROM

Note 1: A value of zero means that the Module does not support the specified technology
or that the length information must be determined from the Module technology.
7.6.2.1 Identifier (Address 128)
The identifier value specifies the physical device described by the serial information.
This value shall be included in the serial data. The defined identifier values are shownin Table 30. The QSFP+ Module shall use the identifier 0Dh.
Table 30 — Identifier Values (Address 128) (Page 00)
Value
Description of Physical device
00h
Unknown or unspecified
01h
GBIC
02h
Module/connector soldered to motherboard
03h
SFP
04h
300 pin XBI
05h
XENPAK
06h
XFP
07h
XFF
08h
XFP-E
09h
XPAK
0Ah
X2
0Bh
DWDM-SFP
0Ch
QSFP
0Dh
QSFP+
0Eh-7Fh
Reserved
80-FFhVendor Specific
These values were valid at the time of technical balloting.
The reference specification for values subsequent to that date is
SFF-8024 Cross Reference to Industry Product Names

7.6.2.2 Extended Identifier (Address 129)
The extended identifier provides additional information about the basic Module types suchas whether the Module contains a CDR function and identifies the power consumption classit belongs to.

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Table 31 — Extended Identifier Values (Address 129) (Page 00)
Bit Description of Device Type
7-6 00: Power Class 1 Module (1.5W max. Power consumption)
01: Power Class 2 Module (2.0W max. Power consumption)
10: Power Class 3 Module (2.5W max. Power consumption)
11: Power Class 4 Module (3.5W max. Power consumption)
5
Reserved
40: No CLEI code present in Page 02h
1: CLEI code present in Page 02h
30: No CDR in TX , 1: CDR present in TX
2
0: No CDR in RX , 1: CDR present in RX
1-0 Reserved

7.6.2.3 Connector (Address 130)
The Connector value indicates the external connector provided on the interface. Thisvalue shall be included in the serial data. The defined connector values are shown in
Table 32. Note that 01h – 0Bh are not QSFP+ compatible, and are included forcompatibility with other standards.
Table 32 — Connector Values (Address 130) (Page 00)
Value
Description of Connector
00h
Unknown or unspecified
01h
SC
02h
FC Style 1 copper connector
03h
FC Style 2 copper connector
04h
BNC/TNC05h
FC coax headers
06h
Fiberjack
07h
LC
08h
MT-RJ
09h
MU
0Ah
SG
0Bh
Optical Pigtail
0Ch
MPO
0D-1FhReserved
20h
HSSDC II
21h
Copper pigtail
22h
RJ45
23h
No separable connector
24h-7Fh Reserved
80-FFhVendor specific7.6.2.4 Specification compliance (Address 131-138)
The following bit significant indicators define the electronic or optical interfaces thatare supported by the QSFP+ Module. For Fibre Channel QSFP+s, the Fibre Channel speed,transmission media, transmitter technology, and distance capability shall all be
indicated.

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Table 33 — Specification compliance (Address 131-138) (Page 00)
Address
Bit Description of Module data
10/40G Ethernet Compliance Code
131
7
Reserved
131
6
10GBASE-LRM
131
5
10GBASE-LR
131
4
10GBASE-SR
131
3
40GBASE-CR4
131
2
40GBASE-SR4
131
1
40GBASE-LR4131
040G Active Cable (XLPPI)SONET Compliance codes
132
7-4 Reserved132
3
40G OTN (OTU3B/OTU3C)
132
2
OC 48, long reach132
1
OC 48, intermediate reach132
0
OC 48 short reach
SAS/SATA compliance codes
133
7,6 Reserved SAS
133
5
SAS 6.0G
133
4
SAS 3.0G
133
3-0 Reserved
Gigabit Ethernet Compliant codes
134
7-4 Reserved
134
3
1000BASE-T
134
2
1000BASE-CX
134
1
1000BASE-LX
134
01000BASE-SX
Fibre Channel link length/Transmitter Technology
135
7Very long distance (V)135
6Short distance (S)1355Intermediate distance (I)135
4Long distance (L)135
3Medium (M)135
2Reserved
135
1
Longwave laser (LC)135
0Electrical inter-enclosure (EL)136
7Electrical intra-enclosure
136
6
Shortwave laser w/o OFC (SN)136
5Shortwave laser w OFC (SL)136
4Longwave Laser (LL)136
0-3 Reserved
Fibre Channel transmission media
137
7
Twin Axial Pair (TW)137
6Shielded Twisted Pair (TP)137
5
Miniature Coax (MI)137
4Video Coax (TV)137
3Multi-mode 62.5m (M6)137
2Multi-mode 50m (M5)137
1Multi-mode 50um (OM3)137
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Fibre Channel Speed
138
138
138
138
138
138
138

7
6
5
4
3,1
2
0

1200 Mbytes/Sec
800 Mbytes/Sec
1600 Mbytes/Sec
400 Mbytes/Sec
Reserved
200 Mbytes/Sec
100 Mbytes/Sec

7.6.2.5 Encoding (Address 139)
The encoding value indicates the serial encoding mechanism that is the nominal design
target of the particular QSFP+ Module. The value shall be contained in the serial data.
The defined encoding values are shown in Table 34.
Table 34 — Encoding Values (Address 139) (Page 00)
Code
Description of encoding mechanism
00h
Unspecified
01h
8B10B
02h
4B5B
03h
NRZ
04h
SONET Scrambled
05h
64B66B
06h
Manchester
07h-FFh
Reserved
These values were valid at the time of technical balloting.
The reference specification for values subsequent to that date is
SFF-8024 Cross Reference to Industry Product Names

7.6.2.6 BR, nominal (Address 140)
The nominal bit rate (BR, nominal) is specified in units of 100 Megabits per second,rounded off to the nearest 100 Megabits per second. The bit rate includes those bits
necessary to encode and delimit the signal as well as those bits carrying data
information. A value of 0 indicates that the bit rate is not specified and must be
determined from the Module technology. The actual information transfer rate will dependon the encoding of the data, as defined by the encoding value.
7.6.2.7 Extended RateSelect Compliance (Address 141)
The Extended RateSelect Compliance field is used to allow a single QSFP+ Module theflexibility to comply with single or multiple Extended RateSelect definitions. A
definition is indicated by presence of a “1” in the specified bit tag position. If
exclusive, non-overlapping bit tag definitions are used, Page 00h, byte 141 will allow
compliance to 8 (1-8) distinct multi-rate definitions.
Table 35 — Extended RateSelect Compliance Tag Assignment (Address 141) (Page 00)
Address Bits Description
141
7-1
Reserved
141
0
QSFP+ Rate Select Version 1. This functionality
is different from SFF-8472 and SFF-8431.
Note: Further details of the use of this field can be found in Subclause 7.6.1.7.

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7.6.2.8 Length (Standard SM Fiber)-km (Address 142)
Addition to EEPROM data from original GBIC definition. This value specifies the link
length that is supported by the QSFP+ Module while operating in compliance with theapplicable standards using single mode fiber. Supported link length is as specified in
the SFF 8074i standard. The value is in units of kilometers. A value of zero means that
the Module does not support single mode fiber or that the length information must be
determined from the Module technology. For all direct attach cable assemblies, including
active optical cables the value shall be zero.
7.6.2.9 Length (OM3) (Address 143)
This value specifies the link length that is supported by the QSFP+ Module while
operating in compliance with the applicable standards using 2000 MHZ*km (850 nm) extended
bandwidth 50 micron core multimode fiber. The value is in units of 2 meters. A value ofzero means that the Module does not support OM3 fiber or that the length information must
be determined from the Module technology. For all direct attach cable assemblies,
including active optical cables the value shall be zero.

7.6.2.10 Length (OM2) (Address 144)
This value specifies the link length that is supported by the QSFP+ Module while
operating in compliance with the applicable standards using 500 MHz*Km (850 nm and 1310nm) 50 micron multi-mode fiber. The value is in units of 1 meter. A value of zero meansthat the Module does not support OM2 fiber or that the length information must be
determined from the Module technology. For all direct attach cable assemblies, including
active optical cables the value shall be zero.

7.6.2.11 Length (OM1) (Address 145)
This value specifies the link length that is supported by the QSFP+ Module while
operating in compliance with the applicable standards using 200 MHz*Km (850 nm) and 500
MHz*Km (1310 nm) 62.5 micron multi-mode fiber. The value is in units of 1 meter. A valueof zero means that the Module does not support OM1 fiber or that the length informationmust be determined from the Module technology. For all direct attach cable assemblies,
including active optical cables the value shall be zero.

7.6.2.12 Cable Assembly Length (Copper or active cable) (Address 146)
This value specifies the link length of the Cable assembly passive The value is inunits of 1 meter. Link length is as specified in the INF 8074. Link lengths less than 1
meter shall indicate 1 meter. A value of zero means that the Module is not a cable
assembly or that the length information must be determined from the Module technology. A
value of 255 means that the Module supports a link length greater than 254 m.

7.6.2.13 Device Tech (Address 147)
The technology used in the device is described in Table 36 and Table 37. The top 4 bitsof the Device Tech byte describe the device technology used. The lower four bits (bits 74) of the Device Tech byte are used to describe the transmitter technology.

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Table 36 — Description of Device Technology (Address 147) (Page 00)
Bits Description of Physical device
7-4
Transmitter technology
30: No wavelength control
1: Active wavelength control
2
0: Uncooled transmitter device
1: Cooled transmitter
1
0: Pin detector
1: APD detector00: Transmitter not tunable
1: Transmitter tunable
Table 37 — Transmitter Technology (Address 147 bits 7-4) (Page 00)
Value Description of physical device0000b 850 nm VCSEL
0001b 1310 nm VCSEL
0010b 1550 nm VCSEL
0011b 1310 nm FP
0100b 1310 nm DFB
0101b 1550 nm DFB
0110b 1310 nm EML
0111b 1550 nm EML
1000b
Others1001b 1490 nm DFB
1010b Copper cable unequalized
1011b Copper cable passive equalized
1100b Copper cable, near and far end limiting active equalizers
1101b Copper cable, far end limiting active equalizers
1110b Copper cable, near end limiting active equalizers
1111b Copper cable, linear active equalizers

7.6.2.14 Vendor Name (Address 148-163)
The vendor name is a 16 character field that contains ASCII characters, left-aligned andpadded on the right with ASCII spaces (20h). The vendor name shall be the full name of
the corporation, a commonly accepted abbreviation of the name of the corporation, the
SCSI company code for the corporation, or the stock exchange code for the corporation. At
least one of the vendor name or the vendor OUI fields shall contain valid serial data.
7.6.2.15 Extended Module Codes (Address 164)
The Extended Module Codes define the electronic or optical interfaces for InfiniBand thatare supported by the QSFP+ Module as shown in Table 38.
Table 38 — Extended Module Code Values (Address 164) (Page 00)
Address
Bit Description of Module Data
InfiniBand Compliance codes
164
7-5 Reserved
164
4
Reserved for EDR
164
3
Reserved for FDR
164
2
QDR
164
1
DDR
164
0
SDR

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7.6.2.16 Vendor OUI (Address 165-167)
The vendor organizationally unique identifier field (vendor OUI) is a 3-byte field that
contains the IEEE Company Identifier for the vendor. A value of all zero in the 3-byte
field indicates that the Vendor OUI is unspecified.

7.6.2.17 Vendor PN (Address 168-183)
The vendor part number (vendor PN) is a 16-byte field that contains ASCII characters,
left aligned and padded on the right with ASCII spaces (20h), defining the vendor partnumber or product name. A value of all zero in the 16-byte field indicates that thevendor PN is unspecified.

7.6.2.18 Vendor Rev (Address 184-185)
The vendor revision number (vendor rev) is a 2-byte field that contains ASCII characters,
left aligned and padded on the right with ASCII spaces (20h), defining the vendor’s
product revision number. A value of all zero in the field indicates that the vendor Rev
is unspecified.

7.6.2.19 Wavelength (Address 186-187)
Nominal transmitter output wavelength at room temperature. 16 bit hex value with byte 186
as high order byte and byte 187 as low order byte. The laser wavelength is equal to the
16 bit integer value divided by 20 in nm (units of 0.05nm). This resolution should be
adequate to cover all relevant wavelengths yet provide enough resolution for all expected
DWDM applications. For accurate representation of controlled wavelength applications,this value should represent the center of the guaranteed wavelength range.
If the cable is identified as copper these registers will be used to define the cableattenuation. An indication of 0 dB attenuation refers to the case where theattenuation is not known or is unavailable.
Address 186 (00-FFh) is an 8 bit hex value indicating the copper cable attenuation at
2.5GHz in units of 1 dB
Address 187 (00-FFh) is an 8 bit hex value indicating the copper cable attenuation at
5.0GHz in units of 1 db.

7.6.2.20 Wavelength Tolerance (Address 188-189)
The guaranteed +/- range of transmitter output wavelength under all normal operating
conditions. For direct attach cable assemblies the value is zero. 16 bit value with byte
188 as high order byte and byte 189 as low order byte. The laser wavelength is equal to
the 16 bit integer value divided by 200 in nm (units of 0.005nm). Thus, the following two
examples:Example 1:
10GBASE-LR Wavelength Range = 1260 to 1355 nm
Nominal Wavelength in bytes 186 - 187 = 1307.5 nm.
Represented as INT(1307.5 nm * 20) = 26150 = 6626h
Wavelength Tolerance in bytes 188 - 189 = 47.5nm.
Represented as INT(47.5 nm * 200) = 9500 = 251Ch
Example 2:
ITU-T Grid Wavelength = 1534.25 nm (195.4 THz) with 0.236 nm ( 30 GHz) Tolerance
Nominal Wavelength in bytes 186 - 187 = 1534.25 nm.
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Represented as INT(1534.25nm * 20) = 30685 = 77DDh
Wavelength Tolerance in bytes 188 - 189 = 0.236 nm.
Represented as INT(0.236 nm * 200) = 47 = 002Fh

7.6.2.21 Max Case Temp (Address 190)
Allows specification of a maximum case temperature other than the standard 70C. Maximum
case temperature is an 8-bit value in Degrees C. A value of 00h implies the standard 70C
rating.
7.6.2.22 CC_BASE (Address 191)
The check code is a one byte code that can be used to verify that the first 63 bytes ofserial information in the QSFP+ Module is valid. The check code shall be the low order 8bits of the sum of the contents of all the bytes from byte 128 to byte 190, inclusive.
7.6.2.23 Options (Address 192-195)
The bits in the option field shall specify the options implemented in the QSFP+ Module as
described in Table 39.
Address
192
193
193
194
194
194
194
194
195
195

Table 39 — Option Values (Address 192-195) (Page 00)
Bit Description of option
Linear/Passive
Active Copper
Active Optical
7-0 Reserved
7-1 Reserved0
RX output amplitudeR
programming, coded 1 if
implemented, else 0.
7-4 Reserved
3
Rx Squelch Disable
R
implemented, coded 1 if
implemented, else 0.
2
Rx Output Disable capable:R
coded 1 if implemented, else0.
1
Tx Squelch Disable
R
implemented: coded 1 if
implemented, else 0.
0
Tx Squelch implemented:
R
coded 1 if implemented, else
0.
7
Memory page 02 provided:R
coded 1 if implemented, else
0.
6Memory page 01 provided:R
coded 1 if implemented, else
0.

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R
R
R
R
R
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195

5

195

4

195

3

195

2

195

1

195

0

RATE_SELECT is implemented.
If the bit is set to 1 thenactive control of the selectbits in the upper memorytable is required to change
rates. If the bit is set to0, no control of the rate
select bits in the upper
memory table is required. In
all cases, compliance withmultiple rate standards
should be determined byModule Codes in Bytes 132,
133, 134 and 135 of Page
00h.
Tx_DISABLE is implemented
and disables the serial
output.
Tx_FAULT signal implemented,
coded 1 if implemented, else0
Tx Squelch implemented toreduce OMA coded 0,
implemented to reduce Pave
coded 1.
Tx Loss of Signal
implemented, coded 1 if
implemented, else 0
Reserved

R

R

R

R

R

R

R

R

R

R

7.6.2.24 Vendor SN (Address 196-211)
The vendor serial number (vendor SN) is a 16-character field that contains ASCII
characters, left aligned and padded on the right with ASCII spaces (20h), defining thevendor’s serial number for the QSFP+ Module. A value of all zero in the 16-byte fieldindicates that the vendor SN is unspecified.
7.6.2.25 Date Code (Address 212-219)
The date code is an 8-byte field that contains the vendor’s date code in ASCII
characters. The date code is mandatory. The date code shall be in the format specified by
Table 40.
Address
212-213214-215
216-217
218-219

Table 40 — Date Codes (Address 212-219) (Page 00)
Description of field
Linear/Passive
OpticalActive Copper,
ModuleActive Optical
ASCII code, two low orderRR
digits of year. (00=2000)
ASCII code digits ofmonth(01=Jan through
12=DecASCII code day of month(01-31)

R

R

R

R

ASCII code, vendor specific lot code, may be blank

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7.6.2.26 Diagnostic Monitoring Type (Address 220)
“Diagnostic Monitoring Type” is a 1-byte field with 8 single bit indicators describing
how diagnostic monitoring is implemented in the particular QSFP+ Module. Bit indicators
are shown in Table 41.
Digital Diagnostic Monitors monitor received power, bias current, supply voltage andtemperature. Additionally, alarm and warning thresholds must be written as specified inthis document. Auxiliary monitoring fields are optional extensions to Digital
Diagnostics.
All digital monitoring values must be internally calibrated and reported in the units
defined in this document.
Bit 3 indicates whether the received power measurement represents average input opticalpower or OMA. If the bit is set, average power is monitored. If not, OMA is monitored.
Table 41 — Diagnostic Monitoring Type (Address 220) (Page 00)
Address
220
.
220

Bits
7-4
.
3

220
220

2
1-0

Description
Reserved.
Received power measurements type.
0=OMA 1=Average Power
Reserved
Reserved

7.6.2.27 Enhanced Options (Address 221)
The format of the Enhanced Options byte are shown in Table 42. The use of the Enhanced
Options field is defined in Subclause 7.6.1.7. The state where the Rate Selectdeclaration bits both have a value of 1 is reserved and should not be used.

Table 42 — Enhanced Options (byte 221)) (Page 00)
Address

Bit

Description

221
221

7-4
3

221

2

221

1-0

Reserved
Rate Selection Declaration: When thisDeclaration bit is 0 the module does notsupport rate selection. When thisDeclaration bit is 1, rate selection is
implemented using extended rate
selection. See 7.6.1.7.2
Application select table declaration.
When this declaration bit is 1, themodule supports rate selection using
application select table mechanism. When
this declaration bit is 0, the module
does not support application select andpage 01 does not exist
Reserved

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ActiveCopperActiveOptical

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7.6.2.28 CC_EXT (Address 223)
The check code is a one-byte code that can be used to verify that the first 31 bytes ofextended serial information in the QSFP+ Module is valid. The check code shall be the loworder 8 bits of the sum of the contents of all the bytes from byte 192 to byte 222,
inclusive.

7.6.2.29 Vendor Specific (Address 224-255)
This area may contain vendor specific information, which can be read from the QSFP+Module. The data is read only. Bytes 224-255 of Page 00h may be used for Vendor Specific
ID functions.

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7.6.3 Upper Memory Map Page 01h
The format of Page 01h is defined in Table 43.
Address
128

Bit
Range
7-0

129
129

7-6
5-0

130,13170,7-0…
130+2*TL
131+2*TL

7
6
Reserved

Table 43 — Application Select Table (Page 01)
Name of
Description
Field
CC_APPS
Check code for the AST: the check code shall be thelow order bits of the sum of the contents of all thebytes from byte 129 to byte 255, inclusive.
Reserved
AST Table
A 6 bit binary number. TL, specifies how many
Length, TL
application table entries are defined in bytes 130255 addresses. TL is valid between 0 (1 entry) and 62(for a total of 63 entries)
Application
Definition of first application supported (See Table
Code 044)
Other Table
Entries
Application
Definition of last application supported (See Table
code TL
44)

7-0,
7-0

5

4

Table 44 — Application Code Structure
Low Order Byte
3
2
1
0
7
6
5
4
Category

3

High order Byte210
Variant

7.6.4 User Writable and Vendor Specific Memory
Page 02 is optionally provided as user writable EEPROM. The host system may read or write
this memory for any purpose. If bit 4 of Page 00 byte 129 is set, however, the first 10
bytes of Table 02h, bytes128-137 will be used to store the CLEI code for the module.
7.6.5 Upper Memory Page 03h
The upper memory map page 03h contains module thresholds, channel thresholds and masks,
and optional channel controls. These are shown in Table 45 and described in detail in
Subclause 7.6.1, Subclause 7.6.1.6 and Subclause 7.6.1.4.
Address
128-175
176-223224-225
226-239240-241242-253
254-255

Table 45 — Upper Memory Map Page 03h
Description
Type
Module Thresholds (48 Bytes)
Read-Only
Channel Thresholds (48 Bytes)
Read-Only
Reserved (2 Bytes)
Read-Only
Vendor Specific Channel Controls
Read/Write(14 Bytes)
Optional Channel Controls (2Read/Write
bytes)
Channel Monitor Masks (12 Bytes)
Read/Write
Reserved (2 bytes)
Read/Write

7.6.5.1 Module and Channel Thresholds
These values are stored in read-only memory in bytes 128-223 of the upper memory page 03h
as shown in Table 46. Each monitor value has a corresponding high alarm, low alarm, highwarning and low warning threshold. For each monitor that is implemented, High and Low
Alarms Thresholds are required and are indicated by a C (Conditional) where the monitor
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is optional or indicated by an R where the monitor is required. Warning thresholds, Highand Low are optional. These factory-preset values allow the user to determine when aparticular value is outside of “normal” limits as determined by the Module manufacturer.
It is assumed that these values will vary with different technologies and different
implementations.
The values reported in the Alarm and Warning Thresholds area may be typical values atsome chosen nominal operating conditions and may be temperature compensated or otherwise
adjusted when setting warning and/or alarm flags. Any threshold compensation or
adjustment is vendor specific and optional. Refer to the vendor’s data sheet for use ofalarm and warning thresholds.
Address# Bytes128-129130-131132-133
134-135
136-143
144-145
146-147
148-149
150-151
152-159
160-175
176-177
178-179180-181182-183
184-185
186-187
188-189
190-191
192-199200-207
208-223

2
2
2
2
8
2
2
2
2
8
16
2
2
2
2
2
2
2
2
8
8
16

Table 46 — Module and Channel Thresholds (Page 03)
Name
Description
Passive
Copper,ActiveCopper,ActiveOpticalTemp High Alarm
MSB at low address
C
Temp Low Alarm
MSB at low address
C
Temp High Warning
MSB at low address
O
Temp Low Warning
MSB at low addressO
Reserved
Vcc High Alarm
MSB at low addressC
Vcc Low Alarm
MSB at low addressC
Vcc High Warning
MSB at low addressO
Vcc Low Warning
MSB at low addressO
Reserved
Vendor Specific
RX Power High Alarm
MSB at low addressC
RX Power Low Alarm
MSB at low addressC
RX Power High Warning
MSB at low addressO
RX Power Low Warning
MSB at low address
O
Tx Bias High Alarm
MSB at low addressC
Tx Bias Low Alarm
MSB at low addressC
Tx Bias High Warning
MSB at low address
O
Tx Bias Low Warning
MSB at low addressO
Reserved thresholds for channel parameter set 3
Reserved thresholds for channel parameter set 4
Vendor Specific

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O
O
C
C
O
O

C
C
O
O
C
C
O
O

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7.6.5.2 Optional Channel Controls
Upper Memory Page Control Bits are defined in Table 47. (see Table 48 for output
amplitude levels)
Address

226-237
238

239

240

241

Table 47 — Vendor Specific and Optional Channel Controls (Page 03)
Bit Name
Description
Passive
Copper,ActiveCopper,ActiveOpticalVendor Specific
7-4 RX1 output amplitude Output amplitude levels withO
no equalization enabled(seeTable 48)
3-0 RX2 output amplitude Output amplitude levels withO
no equalization enabled(seeTable 48)
7-4 RX3 output amplitude Output amplitude levels withO
no equalization enabled(seeTable 48)
3-0 RX4 output amplitude Output amplitude levels withO
no equalization enabled(seeTable 48)
7
Rx4 SQ Disable
Rx Squelch Disable Channel 4O6
Rx3 SQ Disable
Rx Squelch Disable Channel 3O5
Rx2 SQ Disable
Rx Squelch Disable Channel 2O4
Rx1 SQ Disable
Rx Squelch Disable Channel 1
O
3
Tx4 SQ Disable
Tx Squelch Disable Channel 4O2
Tx3 SQ Disable
Tx Squelch Disable Channel 3O1
Tx2 SQ Disable
Tx Squelch Disable Channel 2O0
Tx1 SQ Disable
Tx Squelch Disable Channel 1
O
7
Rx4 Output Disable
Rx Output Disable channel 4O6
Rx3 Output Disable
Rx Output Disable channel 3O5
Rx2 Output Disable
Rx Output Disable channel 2O
4
Rx1 Output Disable
Rx Output Disable channel 1
O
3
Reserved
2
Reserved
1
Reserved
0
Reserved
Table 48 --- Output amplitude control (address 238-239)
CodeReceiver Output Amplitude
No Output Equalization
NominalUnits
1xxx
Reserved
0111
Reserved
0110
Reserved
0101
Reserved
0100
Reserved
0011
600-1200mV(pk-pk)
0010
400-800
mV(pk-pk)
0001
300-600
mV(pk-pk)
0000
200-400
mV(pk-pk)

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O
O
O
O
O
O
O
O
O
O
O
O
O
O
O

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Squelch disable and output control functionality are optional; if implemented, squelch
disable and output disable are controlled for each channel using bytes 240 and 241 ofpage 03h. Squelch is normally operational as described in Subclause 4.1.3, High Speed
Electrical Specification. Writing a “1” in the Squelch Disable register (byte 240, page03h) disables the squelch for the associated channel. Writing a “1” in the Output
Disable register (byte 241, page 03h) squelches the output of the associated channel.
When a “1” is written in both registers for a channel, the associated output is disabled.
The registers read all “0”s upon power-up.
7.6.5.3 Channel Monitor Masks
The Masking Bits for the Channel Monitor Functions are defined in Table 49.
is required whenever a monitor and associated flag is implemented.
Address
242

243

244

245

246-247248-249
250-253

Bit
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
All
All
All

A mask bit

Table 49 — Channel Monitor Masks (Page 03)
Name
Description
M-Rx1 Power High Alarm
Masking Bit for high RX Power alarm channel 1
M-Rx1 Power Low Alarm
Masking Bit for low RX Power alarm channel 1
M-Rx1 Power High Warning Masking Bit for high RX Power warning channel 1
M-Rx1 Power Low Warning
Masking Bit for low RX Power warning channel 1
M-Rx2 Power High Alarm
Masking Bit for high RX Power alarm channel 2
M-Rx2 Power Low Alarm
Masking Bit for low RX Power alarm channel 2
M-Rx2 Power High Warning Masking Bit for high RX Power warning channel 2
M-Rx2 Power Low Warning
Masking Bit for low RX Power warning channel 2
M-Rx3 Power High Alarm
Masking Bit for high RX Power alarm channel 3
M-Rx3 Power Low Alarm
Masking Bit for low RX Power alarm channel 3
M-Rx3 Power High Warning Masking Bit for high RX Power warning channel 3
M-Rx3 Power Low Warning
Masking Bit for low RX Power warning channel 3
M-Rx4 Power High Alarm
Masking Bit for high RX Power alarm channel 4
M-Rx4 Power Low Alarm
Masking Bit for low RX Power alarm channel 4
M-Rx4 Power High Warning Masking Bit for high RX Power warning channel 4
M-Rx4 Power Low Warning
Masking Bit for low RX Power warning channel 4
M-Tx1 Bias High Alarm
Masking Bit for high TX Bias alarm channel 1
M-Tx1 Bias Low Alarm
Masking Bit for low TX Bias alarm channel 1
M-Tx1 Bias High Warning
Masking Bit for high TX Bias warning channel 1
M-Tx1 Bias Low Warning
Masking Bit for low TX Bias warning channel 1
M-Tx2 Bias High Alarm
Masking Bit for high TX Bias alarm channel 2
M-Tx2 Bias Low Alarm
Masking Bit for low TX Bias alarm channel 2
M-Tx2 Bias High Warning
Masking Bit for high TX Bias warning channel 2
M-Tx2 Bias Low Warning
Masking Bit for low TX Bias warning channel 2
M-Tx3 Bias High Alarm
Masking Bit for high TX Bias alarm channel 3
M-Tx3 Bias Low Alarm
Masking Bit for low TX Bias alarm channel 3
M-Tx3 Bias High Warning
Masking Bit for high TX Bias warning channel 3
M-Tx3 Bias Low Warning
Masking Bit for low TX Bias warning channel 3
M-Tx4 Bias High Alarm
Masking Bit for high TX Bias alarm channel 4
M-Tx4 Bias Low Alarm
Masking Bit for low TX Bias alarm channel 4
M-Tx4 Bias High Warning
Masking Bit for high TX Bias warning channel 4
M-Tx4 Bias Low Warning
Masking Bit for low TX Bias warning channel 4

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