TECHNICAL DOCUMENTATIONMX X2G2 and MC Dismantling GuideXIMEA s.r.o.
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900 33 Marianka
SlovakiaTel.
+421 2 20510366
Email: ondrej.pindroch@ximea.com
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Document information
Document title:

MX X2G2 and MC Dismantling Guide

Author:Ondrej Pindroch

Date:

24.10.2017

Department:

R&D

Version:

REV1

File name:

TD-MX-xx-MX-X2G2-and-MC-Dismantling-Guide.docx (-REV1.pdf)

Document number

TD-MX-xx

Status:REV 1

Scope:

Procedure how to dismantle MX X2G2 and MC camera models and extract filter glass

Released by:Approved by:

Confidential:
The information contained in this document is the proprietary and exclusive property of XIMEA except as otherwise indicated.
No part of this document, in whole or in part, may be reproduced, stored, transmitted, or used for design purposes without
the prior permission of XIMEA.

TR-Test-Report-Template.doc (TR-0001)

Revision History

Revision History
REVISIONWHODESCRIPTION

DATE

REV1

OP

First draft

24.10.2017

Table of Contents
Revision History .............................................................................................................................................. 2
Table of Contents ............................................................................................................................................ 2
Glossary of Terms, Acronyms and Abbreviations ....................................................................................... 3
Introduction ...................................................................................................................................................... 3
Handling precautions ...................................................................................................................................... 3
Static Electricity .............................................................................................................................................. 3
Shear forces ................................................................................................................................................... 3
Removing back of the camera ........................................................................................................................ 4
MX X2G2 and MC -FL -FV ............................................................................................................................. 4
MC -TC -UB.................................................................................................................................................... 6
Extracting Sensor PCA ................................................................................................................................... 7
Removing filter glass ...................................................................................................................................... 8
Removing front parts of mechanics ............................................................................................................... 8
Removing filter ............................................................................................................................................... 9

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Glossary of Terms, Acronyms and Abbreviations

Glossary of Terms, Acronyms and Abbreviations
Term /Abbreviation

Definition

PCA

printed circuit board assembly

CSP

Chip scale package

Introduction
This document describes procedure how to dismantle several camera models with minimal risk ofdamaging components. Please keep in mind that following this steps still voids warranty.

Handling precautions
Static Electricity
Because semiconductor components are particularly susceptible to damage by static electricity, youmust take the following precautions:
1. Maintain relative humidity in the working environment between 40% and 70%. Use of an apparatus
for ion generation may be needed to remove electricity.
2. Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment.
3. Use rings or bracelets connected to ground through high resistance (on the level of 1 MΩ). Wearingof ESD clothing and shoes, the use of conductive floor mats and other measures to minimize shockloads is recommended.
4. Avoid the use of styrofoam or other highly static-prone materials for storage of completed board
assemblies.

Shear forces
Camera contains CSP packages. Avoid shear forces above 40 g.

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3Removing back of the camera

Removing back of the camera
MX X2G2 and MC -FL -FV
For this part of procedure you need type PH0 screw driver, small flat screwdriver and tweezer. Procedureneeds to be done in dust free, clean and ESD safe environment.
1. Place camera on the desk facing down. Unscrew and remove 4 screws.

2. To lift the rear part, insert the previously unscrewed screws into the mounting holes as depicted
below. Lift the side of the rear part slow. It should not pop out too quickly, as it can damage the PCBor the connector.

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4Removing back of the camera

3. To detach the main PCA from sensor PCA insert small flat screwdriver in to the marked opening andgently tilt the screwdriver to loosen the board to board connector. Repeat on the other side of camera
until the boards are detached.

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5Removing back of the camera

MC -TC -UB
For this part of procedure you need a type PH0 screw driver, small flat screwdriver and tweezer.
Procedure needs to be done in dust free, clean and ESD safe environment. This procedure is illustrated
in –TC variant of camera.
1. Place camera on the desk facing down. Unscrew and remove 4 screws.

2. The camera rear mechanic contains IO circuitry and connector. When removing the rear housing it
is possible that the main PCA detaches from the sensor PCA with the rear housing. Be careful notto damage the USB connector. You can gently wobble the rear housing in direction of arrows whilepulling it away from the rest of the camera.

3. To detach the main PCA from sensor PCA insert small flat screwdriver in to the marked opening andgently tilt the screwdriver to loosen the board to board connector. Repeat on the other side of camera
until the boards are detached.

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Extracting Sensor PCA
1. Unscrew the screws holding the sensor PCA.

2. Take out the screws and the PCA. Sensor glass is not protected.

3. Cover the sensor glass with protective tape.

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7Removing filter glass

Removing filter glass
Removing front parts of mechanics
As the filter glass is not glued to the mechanics it might be possible to remove it from camera by
dismantling the front part of the camera only and extract the filter glass by vacuum tweezer.
1. Place the camera or the front mechanics on the table with C-mount thread facing up. Unscrew andremove the marked screws.

2. Remove the two front parts. It might be possible to lift he filter glass by using a vacuum tweezer.

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8Removing filter glass

Removing filter
Insert toothpick or something similar with soft surface (to prevent scratches on filter glass) through thesensor window and press against the edge of the filter glass as close as possible to the filter edge.

--end of document--

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