44N
MULTIFUNCTIONAL MICRODISPERSED CERAMICFILLED EPOXY-FIBERGLASS PREPREG
Arlon 44N is a high resin content multifunctional (175°C)
epoxy prepreg system with a proprietary micordisperse
ceramic filler system. 44N is engineered for the filling ofclearance holes in thin Metal cores such as 0.006” Copperinvar-Copper or via holes in sequentially laminated MLB
designs.
Based on Arlon’s 45N, the 44N system iscompatible with conventional epoxy lamination andfabrication.
Features:• Microdisperse ceramic filled to minimize resin shrinkage andcracking in filled clearance holes• Prepreg format eliminates the need for messy paste fillmaterial in high volume applications• High Tg compatible with conventional multifunctional epoxyprocessing• Filled system has reduced Z-direction expansion andimproved thermal conductivity for improved plated throughhole reliability• Suitable for most Lead-Free applications• RoHS/WEEE compliant
Typical Applications:• UL-94 VO• Automotive Under-hood applications• Backplanes and Mother Boards• Ball Grid Array Packaging• High layer count MLB’s

Typical Properties:
Property

44NUnits

Value

Test Method-4.2 to 4.6

IPC TM-650 2.5.5.3
IPC TM-650 2.5.5.9-0.025

IPC TM-650 2.5.5.3
IPC TM-650 2.5.5.9

MΩ-cm
MΩ-cm

2.6 x 107
3.3 x 107

IPC TM-650 2.5.17.1
IPC TM-650 2.5.17.1

MΩ
MΩ
Volts/mil (kV/mm)
kV
sec

4.0 x 104
2.9 x 107
1500
65

IPC TM-650 2.5.17.1
IPC TM-650 2.5.17.1
IPC TM-650 2.5.6.2
IPC TM-650 2.5.6
IPC TM-650 2.5.1

175

IPC TM-650 2.4.24
IPC TM-650 2.4.25

1. Electrical Properties
Dielectric Constant (may vary with Resin %)@ 1 MHz@ 1 GHz
Dissipation Factor@ 1 MHz@ 1 GHz
Volume Resistivity
C96/35/90
E24/125
Surface Resistivity
C96/35/90
E24/125
Electrical Strength (typical)
Dielectric Breakdown
Arc Resistance2. Thermal Properties
Glass Transition Temperature (Tg)
TMA
DSC

°C°C

Decomposition Temperature (Td)
Initial
5%
T260
T288
T300
CTE (x,y)CTE (z)< Tg°C
°C
min
min
min
ppm/°C

14 - 16

IPC TM-650 2.3.41
IPC TM-650 2.3.41
IPC TM-650 2.4.24.1
IPC TM-650 2.4.24.1
IPC TM-650 2.4.24.1
IPC TM-650 2.4.41

ppm/°C55

IPC TM-650 2.4.24> Tg
z-axis Expansion (50-260ºC)

ppm/°C%

2002.4

IPC TM-650 2.4.24
IPC TM-650 2.4.24

lb/in (N/mm)
lb/in (N/mm)

88

IPC TM-650 2.4.8
IPC TM-650 2.4.8.2

lb/in (N/mm)

8

IPC TM-650 2.4.8

Young’s Modulus
Flexural Strength
Tensile Strength

Mpsi (GPa)kpsi (MPa)kpsi (MPa)2.8

IPC TM-650 2.4.18.3
IPC TM-650 2.4.4
IPC TM-650 2.4.18.3

Compressive Modulus
Poisson’s Ratio (x, y)

kpsi (MPa)-0.15

ASTM D-695
ASTM D-3039%g/cm3W/mKClass0.1
1.85
0.3
V0

IPC TM-650 2.6.2.1
ASTM D792 Method A
ASTM E1461
UL-94

3. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)
After Thermal Stress
At Elevated Temperatures
After Process Solutions

4. Physical Properties
Water Absorption
Specific Gravity
Thermal Conductivity
Flammability

Results listed above are typical properties, provided without warranty, expressed or implied, and without liability. Properties may vary, depending on design and application. Arlon reserves
the right to change or update these values.

Availability:Arlon PartNumberResin Content

Resin Flow

Ceramic Load

Yield per Ply

44N068080%50 ± 5%14 ± 20.0015”

44N is supplied in a high resin content prepreg on 106 glass fabric reinforcement

Recommended Process Conditions:
We suggest the use of vacuum or vacuum assist lamination . Utilize a low pressure “kiss” cycle up tothe melt point of the resin (around 170°CF/76°C to 190°F.88°C [depending upon heat up rate])followed by full pressure (200 psi minimum,) through the remainder of the cycle.
Pressure, temperature and time may vary depending on the available equipment, panel size andcomplexity and other factors. Controlling the heat-up rate, of the multilayer package, to 8-12°F/4-7°C
per minute between 150°F and 250°F/65-120°C is recommended. See start point
recommendations in table below:
Panel Size

Pressureincm

psi

kg/sq cm

12 x 1840 x 46275

1916 x 18

30 x 46350

2518 x 24

46 x 61

400

28

A 90 minute cure at a temperature of 360°F/182°C should achieve a Tg of 175°C. When thelamination package contains layers of metal core the cure time may need to be extended to offset theheat lagging effects of the metal.
NOTE: for sequential lamination use 60 minutes for the first lamination and 90 minutes for the final.
Cool down under pressure at ≤ 12°F/min (6°C/min)Drill at 350 SFM. Undercut bits are recommended for vias 0.018” (0.45cm) and smaller De-smear
using alkaline permanganate or plasma with settings appropriate for FR-4. slightly longer dwell times
may be needed for multifunctional compared with difunctional FR-4.
Bake for 1 – 2 hours at 250°F (121°C) prior to solder reflow or HASL.

44NOptimal processing requirements may vary depending on specific equipment and operating conditions. These recommendations are offered only as a starting point.

North America:9433 Hyssop Drive, Rancho Cucamonga, California 91730
Tel: (909) 987-9533 • Fax: (909) 987-8541
1100 Governor Lea Road, Bear, Delaware, 19701
Tel: (302) 834-2100, (800) 635-9333
Fax: (302) 834-2574
Northern Europe:
44 Wilby Avenue, Little Lever, Bolton, Lancaster, BL31QE, UK
Tel/Fax: (44) 120-457-6068
Southern Europe:
1 Bis Rue de la Remarde, 91530 Saint Cheron, FranceTel: (33) 871-096-082 • Fax: (33) 164-566-489
Arlon Material Technologies
No. 20 Datong Road, Export Processing Zone, Suzhou New & High District, Jiangsu, China
Tel (86) 512-6269-6966
Fax: (86) 512-6269-6038
Arlon Electronic Materials (Suzhou) Co., Ltd.
Building 7, Da Xing Industrial Park of Suzhou New & High District
Jinangsu, China 21500
Tel: (86) 512-6672-1698
Fax: (86) 512-6672-1697
Eastern China:
Room 11/401, No. 8, Hong Gu Road, Shanghai, China, 200336
Tel/Fax: (86) 21-6209-0202
Southern China:
Room 601, Unit 1, Building 6, Liyuanxincun, Road Holiday,
Hua qiaocheng, Nanshan District, Shenzhen City, China
Tel: (86) 755-26906612 • Fax: (86) 755-26921357

Rev 1.0

www.arlon-med.com© 2008, 2009 Arlon LLC