Reacting to changing machine visionneeds by USB3.0 and Sony’s next
generation CMOS sensor

November 5, 2014
Shunsuke Oka
Copyright © 2014 TOSHIBA TELI CORPORATION, All rights reserved.

Introduction

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What is USB3.0 / USB3 Vision

 Machine Vision standard : High bandwidth in excess of 440 MByte/s : Easy-to-use plug and play interface : Power and data over the same passive cable to 8m(more with active cables) : Uses GenICamTM generic programming interface : Improved Robustness than USB2.0 :Copyright © 2014 TOSHIBA TELI CORPORATION, All rights reserved.

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Compare with CameraLink System

CameraLink
Medium Configuration(4Gbps)USB3.0(4Gbps)Copyright © 2014 TOSHIBA TELI CORPORATION, All rights reserved.

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Summary of USB3.0 / USB3 VisionHigh
Bandwidth

=

×

High
Reliability

×

Low
Cost

Next Standard Interface
for Machine vision
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Applications of our USB3 Vision Camera

Factory Automation• Pick & place Machine (Chip Mounter)• Wire Bonding Machine• Die Bonding Machine• Stepper• Others (Bin Picking, etc.)

Inspection & Testing• Appearance Optical Inspection (AOI)• Industrial Endoscope / Pipe Inspection• Industrial Microscope
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Our advanced features

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Toshiba Teli BU series : USB3 Vision Camera Compact Body
CCD model : □29mm×13mm
CMOS model : □29mm×16mm

 Light Weight
CCD model : 27g
CMOS model : 32g

 GPIO 2 Output 1 Input
 LED Status Indicator USB3.0 Micro B

3

WARRANTYYEARS Applying CCD and
CMOS Sensor

 Screw lock

 eCON Connector
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e-CON Connector
What is e-CON connector?
e-CON specifications are currently being promoted forstandardization by manufactures of FA components
and connectors such as Omron, SMC, 3M and so on.

 Use industry-proven spring clamps for assembling.
 No Special tools required for assembling.
 Rewiring (Repairing) is possible.
 Reasonable price comparing to Hirose pin connector.

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Compact Body & Light Weight

Original development
IP core

27g

29mm

32g

29mm

29mm

13mm

CCD model

29mm

16mm

CMOS model

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Our Unique USB IP
FPGA+ All - In – One USB Chip

Software Processing
Hardware Processing

Register Setting
Mode Setting

Data
Bus

DrivingCPU
USB Communication

Data
Bus

FPGA

LINK
IP

TG

Data
Bus

PHY

Toshiba Teli’s USB IP Core

RegisterAll-in-one
SettingUSB
USB
Communication
Communication

ALU/
MUX
etc.

Down Sizing

Image
Sensor

Data
Bus

TG

Generic USB IP
USB
Communication

Register Setting

CPU

Data
Bus

Data
Bus
ALU/MUX
etc.

TG
Driving

Driving

LINK
IP

Data
Bus

LINK
IP

PHY

FPGA

PHY

FPGA
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High Speed Response
CPU Processing
Hostrequest sequence

Data_nHardware Processing

Cameracommand control

commandProcessing

Ack_n

Our Unique
USB IP

Host
request sequence

Cameracommand control

Data_nAll in one
Ack_n
USB
chip

Generic
USB IP

Data_n+1

Data_n+1
Data_n+2
10
times faster

Ack_n+2

Data_n+2

Read register
Ack_n+2

Data_n+4

Finish100 times faster
Ack_n+1

Ack_n+1

Data_n+3

Processing

2.2 - 5us

Data_n+3

40.8 - 44.6us

223 - 546us
Ack_n+3

Data_n+4

SoftwareAck_n+3
2.2 - 5.4us
trigger(write register)
Ack_n+4

46.9- 71.0us
Finish

Ack_n+4

314 - 324us
Command Analysis：
・Event notification
・Register R/W・Image adjustment
・Software trigger
・etc.

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No Delay Event Notification
 BU series equipped with our high-speed hardware IP has achieved‘No-Delay Event Notification’ for effective machine control.
(1) Frame Trigger: Reception of Frame Start Trigger(2) Frame Trigger Error : Rejection of Frame Start Trigger(3) Frame Trigger Wait : Start of waiting for Frame Start Trigger(4) Frame Transfer Start: Start of transferring Streaming data
(5) Frame Transfer End : End of Transferring Streaming data
(6) Exposure Start: Start of Exposure(7) Exposure End: End of Exposure

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Bulk Trigger
 Camera exposes and transfers multiple frames by a single trigger.

Trigger
Int.Trigger
Exposure
USB bus

Image Data 1

Image Data 2

Image Data 3

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14Sequential Shutter
 BU Series can capture images sequentially while applying registered settings.
(Gain, Exposure, ROI position, etc.) (CMOS model only).
Case study : Capture ROI with proper brightness to the subject.
Memory Bank1
Memory Bank2
Memory Bank3
Memory Bank4
Memory Bank5

Frame 1

Frame 4

Memory Bank6
Memory Bank7

Memory Bank8
Memory Bank9
Memory Bank10
Memory Bank11
Memory Bank12

SEQ : Frame 1・ Gain : 0dB
・ Exposure : 2ms
・ ROI Position :.
.
.

SEQ : Frame 3・ Gain : 0dB
・ Exposure : 1ms
・ ROI Position :.
.
.

SEQ : Frame 2・ Gain : +6dB
・ Exposure : 2ms
・ ROI Position :.
.
.

Memory Bank13
Memory Bank14
Memory Bank15

Frame 2

Frame 3

SEQ : Frame 4・ Gain : +3dB
・ Exposure : 2ms
・ ROI Position :.
.
.

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Bulk Trigger + Sequential Shutter Sequential Shutter mode can combine Bulk trigger (CMOS model only).
Case study : multiple different programed exposures by one trigger input.
Trigger
Int.Trigger
Exposure
USB bus

Image Data 1

Image Data 2Long exposure
image

Short exposure
image

External
Processing
Wide dynamic range
image

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Bus Synchronization
 BU series have a function of synchronized exposure mode without
trigger input.
Bus Synchronization Mode

Exposure

Camera 1
Camera 2
Camera 3
Camera 4
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BERT(Bit Error Rate Test) Function
 Camera generates Test Pattern and compares them with Received Loop
Back Data. (CMOS model only)

You can evaluate cable quality by our Camera
before you install the cable into your system.

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CMOS model Features
 Image buffer
Image data can be stored temporarily to internal buffer memory, andread them out in arbitrary timing. The image buffer size is 64MByte.

 Defective Pixel Correction (On Board Correction)
The camera can correct defective pixels.
Corrected

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TeliCamSDKEasy to program development

Application

Add the Software function
Reduce the development cost

performance and reliability
CPU load is reduced -> stable operating

C/C++ I/F

Integration of interface

TeliCamSDKFunction setting

Image capture

GenAPI,XML

Image convet

Register R/WImage storage

GigE SDK and USB3.0 SDK is integrated

Industrial protocol supported
BG series
GigEVision
GenICam
BU series
USB3Vision
IIDC2
GenICam

System, Camera Enumeration

TeliGev
Driver

BG
Seriesver1.2ver2.3
ver1.0
ver1.0.0
ver2.3ManualTeliU3v
DriverPlease refer StartUpGuide for the manualof the install and sample code.
Please refer LibraryManual for theprocedure of the function.

BU
SeriesFAQ
FAQ is available on the Web site

Toshiba
Teli FAQ

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The Solutions of Peripheral equipment

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Our reliability

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Assured Signal Quality
 Signal Quality was verified by USB Compliance Test.

Test Name
PassSpec Range
 800.0 mV <= VALUE <= 1.2000 V
LFPS Peak-Peak Differential Output Voltage
 20.0000 ns <= VALUE <= 100.0000 ns
LFPS Period (tPeriod)
 600.0 ns <= VALUE <= 1.4000 µs
LFPS Burst Width (tBurst)
 6.0000 µs <= VALUE <= 14.0000 µs
LFPS Repeat Time Interval (tRepeat)
 VALUE <= 4.0000 ns
LFPS Rise Time VALUE <= 4.0000 ns
LFPS Fall Time
 40.0000 % <= VALUE <= 60.0000 %LFPS Duty cycle
 VALUE <= 100.0 mV
LFPS AC Common Mode Voltage
 TSSCMin ppm <= VALUE <= TSSCMax ppm
TSSC-Freq-Dev-Min
 -300.000 ppm <= VALUE <= 300.000 ppm
TSSC-Freq-Dev-Max
 30.000000 kHz <= VALUE <= 33.000000 kHz
SSC Modulation Rate VALUE <= 10.000 ms
SSC Slew Rate VALUE <= 230 mUIFar End Random Jitter (CTLE ON)
 VALUE <= 430 mUIFar End Maximum Deterministic Jitter (CTLE ON)
 VALUE <= 660 mUIFar End Total Jitter at BER-12 (CTLE ON)
 VALUE = 0.000
Far End Template Test (CTLE ON)
 100.0 mV <= VALUE <= 1.2000 V
Far End Differential Output Voltage (CTLE ON)

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Cable Quality
 Cable selection is the most important matter for USB3.0 application.
 We can conduct the cable quality test in our lab.

Margin80.00%Far End Total Jitter at BER-12

70.00%

Company B #1

60.00%

Company B #2

50.00%

Company C #1

40.00%

Company C #2
Company C #3

30.00%

Company D

20.00%

Company E #1

10.00%

Company E #2

0.00%

1.00E+04

A

Far End Template Test
3.00%

5.00E+03-5.00E+03-1.00E+04-1.50E+04-2.00E+04-2.50E+04-3.00E+04

MarginMargin0.00E+00

Company A

B

C

D

E

Far End Differential Output Voltage

Company A

2.00%

Company B #1

1.00%

Company B #2

0.00%

Company C #1

-1.00%

Company C #2

-2.00%-3.00%-4.00%-5.00%

Company C #3
Company D

Company E #1
Company E #2

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Our Efforts for Robustness
Image Buffering
BU series offers two ways of achieving stable image transfer.
• On Board Frame Buffer: CMOS Model• Unique Buffer Flow Control: All Model

When CPU Usage is highpacketOur Unique Buffer Flow Control compensates forthe volatility of the USB Bus
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Our Efforts for Robustness
Error Handling
NOT ONLY USB3.0 standard retry,
BUT BU series also employs our Unique Error Handling.

When Error Rate is high(Bad Signal Quality)

Good

Retry
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USB3 Test Environments
 USB3 compliance test USB3 Bus Analyzer

Keysight Technologies
DSO91304A Infiniium High Performance Oscilloscope

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Our assessment systems

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Toshiba Teli " Reliability assessment center "Radio darkroom and Shield room

EMC measurement system

Inside the Radio darkroom
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Toshiba Teli " Reliability assessment center "Chill

Hot air

Steep low/high temperature testing instrument

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Toshiba Teli " Special testing laboratory "Vibration chip test equipment

Home thermal humid equipment
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Our lineup

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USB3 Vision Camera Lineup
BU130

BU205M

BU238M

BU406M

DU657M

BU030CBU130CBU205MCBU238MC

BU406MCDU657MC

BU030CFBU130CFBU205MCF

BU238MCF

BU406MCF

BU030

Model

BU031

BU080

BU1203MCF

Imager

CCD

CCD

CCD

CCD

GS-CMOSGS-CMOSGS-CMOSGS-CMOSRS-CMOS

Imager type

ICX424

ICX414

ICX204

ICX445

CMV2000

IMX174

CMV4000

Original

IMX226

Pixel

0.3M

0.3M

0.8M

1.3M

2M

2.3M

4M

6.5M

12M

640×480

640×480

1024×768

1280×960

2048×1088

1920×1200

2048×2048

2560×2560

4000×3000

Optical format

1/3 type

1/2 type

1/3 type

1/3 type

2/3 type

1/1.2 type1 type1.1 type

1/1.7 type

Pixel size

7.4um

9.9um

4.65um

3.75um

5.5um

5.86um

5.5um

5.0um

1.85umAspect ratio

4:3

4:3

4:3

4:3

2:1

16 : 10

1:1

1:1

4:3

Frame rate

125fps125fps

40fps

30fps

170fps165fps

90fps

55fps

T.B.D.

Original IP core

X

X

X

X

X

X

X

X

X

Event notifications

X

X

X

X

X

X

X

X

X

Bulk trigger

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

Sequential shutter
Bus synchronization

X

X

X

X

Image buffer
External dimension□29×13mm□29×13mm□29×13mm□29×13mm□29×16mm□29×16mm□29×16mm□40×35mm□29×16mm

Mass

27g

27g

27g

27g

32g

32g

32g

T.B.D.

32g

Production

Available

Available

Available

Available

Available

Available

Available

CY2015 1Q

CY2015 2Q

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Our future

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Relationship with Sensor Manufacturers

Sony

Panasonic

TELEDYNE DALSA

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Sony’s Next Generation GS-CMOS Sensor
Industrial features
High frame rate

The Pregius is global shutter pixel technology for active pixel-type CMOS image
sensors that use Sony’s low-noise CCD structure, and realizes high picture
quality.

Pixel Size
□3.45um

High sensitivity
Low noiseHigh dynamic range※“Pregius” is a trademark of Sony Corporation.
Copyright © 2014 TOSHIBA TELI CORPORATION, All rights reserved.

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Camera Lineup Using Sony’s GS-CMOS
Model

BU238M

DU302M

DU505M

DU806M

DU1207M

BU238MCDU302MCDU505MCDU806MCDU1207MC

ImagerImager typeSony’s global shutter CMOS image sensor
IMX174

IMX252

IMX250

IMX255

IMX253

2.3M

3.1M

5.0M

8.8M

12.0M

1920×1200

2048×1536

2456×2048

4096×2160

4000×3000

Optical format

1/1.2 type

1/1.8 type

2/3 type

1 type1.1 type

Pixel size

□5.86um

Aspect ratio

16 : 10

4:3

6:5

17 : 9

4:3

Frame rate

165fps120fps

75fps

40fps

30fps

Pixel

□3.45umInterfaceUSB3.0 / USB3 Vision

Lens mountC-mount

External
dimensions□29mm×16mm□29mm×T.B.D.

T.B.D

Mass

32g

T.B.D

T.B.D

Status

MP : Available

ES : CY2015 3Q ES : CY2015 2Q ES : CY2015 4Q ES : CY2015 3Q※“This plan is subject to change without notice.
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Copyright © 2014 TOSHIBA TELI CORPORATION, All rights reserved.

38

Trademarks
 USB3 Vision™, GigE Vision™ and Camera Link™ are trademarks owned by AIA.
 GenICam™ is a trademark owned by EMVA.
 IIDC2 is a machine vision industry standards hosted by JIIA.
 USB is an industry standard hosted by USB-IF.
 All other trademarks are the marks of their respective owners.

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