37NPOLYIMIDE LOW-FLOW PREPREG
37N is a polyimide low-flow prepreg suitable for bonding
multilayer polyimide rigid-flex, attaching heat sinks topolyimide MLBs, or other applications where minimal anduniform resin flow is required.

Features:• Tg >200°C and expansion characteristics typical of polyimide
greatly improves PTH reliability• Good bond strength to Kapton® polyimide, copper and other metals• Curable at temperatures as low as 350°F (177°C)• Excellent thermal stability• Available in different flow ranges and fiberglass styles for optimalprocess flexibility• Electrical and mechanical properties meeting the requirementsof IPC 4101/42• Compatible with lead-free processing• RoHS/WEEE compliant

Typical Applications:• Bonding multilayer polyimide rigid-flex• Attaching heat sinks to polyimide MLBs
• Other applications where minimal and uniform resin flow is required

Typical Properties:
Property

37N
Units

Value

Test Method-4.25

IPC TM-650 2.5.5.3
IPC TM-650 2.5.5.9-0.018IPC TM-650 2.5.5.3
IPC TM-650 2.5.5.9

MΩ-cm
MΩ-cm

8.2 x 109
4.7 x 109

IPC TM-650 2.5.17.1
IPC TM-650 2.5.17.1

MΩ
MΩ
Volts/mil (kV/mm)
kV

4.4 x 106
1.2 x 109
1330 (52.4)

IPC TM-650 2.5.17.1
IPC TM-650 2.5.17.1
IPC TM-650 2.5.6.2
IPC TM-650 2.5.6

sec

124

IPC TM-650 2.5.1

°C°C

210

IPC TM-650 2.4.24
IPC TM-650 2.4.25

°C°C
min
min
min
ppm/°C

322
340
>60
52

IPC TM-650 2.3.41
IPC TM-650 2.3.41
IPC TM-650 2.4.24.1
IPC TM-650 2.4.24.1
IPC TM-650 2.4.24.1
IPC TM-650 2.4.41

ppm/°C76

IPC TM-650 2.4.24ppm/°C%2522.3

IPC TM-650 2.4.24
IPC TM-650 2.4.24

lb/in (N/mm)
lb/in (N/mm)
lb/in (N/mm)

6.8 (1.2)
5.5 (0.9)
9.2 (1.6)

IPC TM-650 2.4.8
IPC TM-650 2.4.8.2
IPC TM-650 2.4.8

lb/in (N/mm)
lb/in (N/mm)
Mpsi (GPa)kpsi (MPa)kpsi (MPa)kpsi (MPa)

4.2

1. Electrical Properties
Dielectric Constant (may vary with Resin %)@ 1 MHz@ 1 GHz
Dissipation Factor@ 1 MHz@ 1 GHz
Volume Resistivity
C96/35/90
E24/125
Surface Resistivity
C96/35/90
E24/125
Electrical Strength
Dielectric Breakdown
Arc Resistance2. Thermal Properties
Glass Transition Temperature (Tg)
TMADSC
Decomposition Temperature (Td)
Initial
5%
T260
T288
T300
CTE (x,y)CTE (z)< Tg> Tgz-axis Expansion (50-260ºC)

3. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)
After Thermal Stress
At Elevated Temperatures
After Process Solutions
Peel Strength to Kapton
As Received
After Solder
Young’s Modulus
Flexural Strength
Tensile Strength
Compressive Modulus
Poisson’s Ratio (x, y)

60 (414)32 (221)

IPC TM-650 2.4.18.3
IPC TM-650 2.4.4IPC TM-650 2.4.18.3
ASTM D-695-0.17

ASTM D-3039%g/cm3
W/mKclass<1.0

IPC TM-650 2.6.2.1
ASTM D792 Method A
ASTM E1461
UL-94

4. Physical Properties
Water Absorption
Specific Gravity
Thermal Conductivity
Flammability

0.3
V-0

Results listed above are typical properties, provided without warranty, expressed or implied, and without liability. Properties may vary, depending on design and application. Arlon reserves
the right to change or update these values.

Availability:Arlon PartNumber

Glass Style

Resin %

Flow Range

PressedThickness

37N0666

10666%

70 – 100 mils

1.8 mils

37N066601

10666%

100 – 130 mils

1.8 mils

37N066606

10666%

4 – 8% (mil flow)

1.8 mils

37N80601080

60%

70 – 100 mils

3.0 mils

37N806001

1080

60%

100 – 130 mils

3.0 mils

37N806006

1080

60%

4 – 8% (mil flow)

3.0 mils

Recommended Process Conditions:Because of varying storage conditions, it is recommended that 37N prepreg be dried at 29”(736mm) Hg for 12 to 24 hours.
37N Low-Flow prepreg is very process tolerant. It laminates well with either a cold platenpress start or with a hot start. Vacuum or vacuum assist lamination is recommended for theremoval of moisture and air. Low-Flow products do not displace air voids as well as standard
prepregs, and vacuum will help assure a void-free final product.
Lamination Cycle:
1)

Vacuum draw down the package for 30 minutes at <29” (736mm) Hg prior to applying pressurein the press. Maintain the vacuum beyond the set point of the resin, i.e., above 320°F (160°C)

2)

Use a platen temperature in the range of 370°F - 380°F (188°C - 193°C).

3)Control the heat rise to about 8°F - 12°F per minute (4°C - 6°C) between 200°F and 300°F(93°C and 149°C)

4)

Use a pressure of 180 to 350 psi (12.6 to 24 kg/sq.cm), depending on panel size andcomplexity. Following are recommended pressures relative to panel size to use as starting
points:Panel Size
Pressureincm

psikg/sq cm

9 x 1222 x 30

1801312 x 1230 x 30

2001412 x 1830 x 46250

1816 x 1840 x 46

290

2018 x 2446 x 61

3302324 x 2461 x 61350

24

Cure time is 90 minutes at temperature.
The subsequent processing should be the same as those normally used for rigid-flex PCBs.

37N
Optimal processing requirements may vary depending on specific equipment and operating conditions. These recommendations are offered only as a starting point.

North America:
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Tel: (33) 871-096-082 • Fax: (33) 164-566-489
Arlon Material Technologies
No. 20 Datong Road, Export Processing Zone, Suzhou New & HighDistrict, Jiangsu, China
Tel (86) 512-6269-6966
Fax: (86) 512-6269-6038
Arlon Electronic Materials (Suzhou) Co., Ltd.
Building 7, Da Xing Industrial Park of Suzhou New & High District
Jinangsu, China 21500
Tel: (86) 512-6672-1698
Fax: (86) 512-6672-1697
Eastern China:
Room 11/401, No. 8, Hong Gu Road, Shanghai, China, 200336
Tel/Fax: (86) 21-6209-0202
Southern China:
Room 601, Unit 1, Building 6, Liyuanxincun, Road Holiday,
Hua qiaocheng, Nanshan District, Shenzhen City, China
Tel: (86) 755-26906612 • Fax: (86) 755-26921357

Rev 1.3

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