AN12296

i.MX 8M Mini Migration Guide
Migrating from i.MX 8M to i.MX 8M Mini
Rev. 0 — 4 April 2019

1 Introduction
1.1 Purpose
This application note introduces the i.MX 8M Mini architecture by highlighting
the differences from the i.MX 8M series processor upon which it is based. This
document is a migration guide for developers that migrate from the i.MX 8M tothe i.MX 8M Mini processor.

Application NoteContents
1 Introduction.......................................... 1
1.1 Purpose................................... 1
1.2 Scope...................................... 1
1.3 Audience..................................22 Feature Change Summary.................. 2
2.1 BSP support............................2
2.2 Module change list.................. 2
2.3 Power...................................... 43 Revision history...................................5

1.2 Scope
The i.MX 8M Mini architecture introduces new features which are different from the i.MX 8M. The i.MX 8M Mini also removes
some features from i.MX 8M. The key differences include:• Reduced the package size from 17×17 mm, 0.65 mm pitch to 14×14 mm, 0.5 mm pitch.
• Optimized power consumption.
• Increased Arm® Cortex®-A53 core platform frequency.
• Increased Arm® Cortex®-M4 target frequency.
• Removed display controller subsystem (DCSS), so HDR and Dolby vision is not supported.
• GPU 3D changed from GC7000 lite to GCNanoUltra, Single Shader support, OpenCL/Open Vision/Vulkan is not natively
supported.
• Added 2D engine GC320, can use 2D for Color Space Conversion (CSC) and buffer transfers.
• Added one video encoder, the decoder performance is 1080p60.
• Added PDM audio input support.
• Supported 192 kHz audio on SPDIF interface.
• Increased lanes on SAI-2/3 from 1TX+1RX to 2TX+2RX lanes, with support for 768 kHz audio.
• Changed 2×USB3.0 to 2 ×USB2.0.
• Removed second PCIE and second MIPI CSI, do not affect the software.
• Removed HDMI interface.
• Added third SD/eMMC interface.
• Added third SDMA for audio interface.
Due to a close alignment to the i.MX 8M design, this document is structured as a summary of changes to the i.MX 8M Mini
features. It provides references to modules that are reused or modified on the i.MX 8M Mini.

NXP Semiconductors
Feature Change Summary

1.3 Audience
This document is intended for system integrators and software developers migrating from the platforms based on the i.MX 8M.

2 Feature Change Summary
2.1 BSP support
The i.MX 8M Mini is supported by Linux BSP starting from Linux_4.9.123-2.3.0_GA release.

2.2 Module change list
This section summarizes the architectural changes of the i.MX 8M with respect to the i.MX 8M Mini. Table 1 compares the featuresof i.MX 8M Mini and i.MX 8M.
Table 1. Architectural changes
Category

FeatureChange fromi.MX 8M

Assembly

Package sizeand pins

UpdatedBoard impact

Software impact• Optimized for size and system Nonecost— 14 × 14 mm package— 0.5 mm BGA pin pitch— 485 pins
— Package design to use
low cost drilled vias
— 3.2 mil trace and spaceescape— Optimized powerplacements• Accommodated decouple
caps under the BGA— Optimized for LPDDR4routing— 6 to 8 layers fanout
depending on signals
and power usages

PowerPowerconsumption

Optimized

Reduced the board level power
further.

None

Table continues on the next page...

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NXP Semiconductors
Feature Change SummaryTable 1. Architectural changes (continued)
ARM®
Cortex®-A53
core platform

Cortex-A53 core

UpdatedRefer to Hardware Developer’s
Guide (HDG) to size Arm power
supply appropriately.

Increased ARM® Cortex®-A53 coreplatform frequency from 1.4 GHz to
1.8 GHz. Modified the L2 cache from
1 MB to 512 KB.

Arm®
Cortex®-M4
core platform

Cortex-M4 core

UpdatedNone

Increased the Arm® Cortex®-M4
target frequency from 266 MHz to400 MHz.

GPUGPU 3D

UpdatedChanged GPU 3D from
GC7000Lite to GCNanoUltra.

Reduced Open GL ES from 3.1 to
2.0. Added Open VG 1.1 support.
Single Shader support, OpenCL/Open Vision/ Vulkan not nativelysupported.

GPU 2DNew

Added GPU 2D engine GC320.

The GC320 support code is added.

DCSSRemoved

None

The DCSS support code isremoved.

HDR10,Removed

None

None

Video Decoder

Updated

Reduced decoder performancefrom 4Kp60 to 1080p60.

None

Video Encoder

New

Added 1080p60 H.264 1080p60
VP8 video encoder.

The video encoder support code isadded.

PDM input

New

Added PDM audio input.

The PDMsupport code is added.

SAIUpdated

Increased number of lanes on
SAI-2/3 from 1TX+1RX to 2TX+2RX lanes, with support for 768
kHz audio.

None

S/PDIF

UpdatedRemoved the second S/PDIFinterface.

None

Displaycontroller

Dolby Vision
VideoAudio

Support 192 kHz audio on S/PDIF
interface.
DMA

SDMA

Updated

Added third SDMA for audio
interface.

The 3rdSDMAconfig code is added.

Connectivity

HDMI 2.0a

Removed

None

None

MIPI-CSI

RemovedRemoved the second MIDI-CSI
interface.

None

PCIe

RemovedRemoved the second PCIeinterface.

NoneUSB

UpdatedChanged 2 × USB3.0 to 2 ×USB2.0.

None

SD/eMMC

Updated

Added third SD/eMMC interface.

The 3rdSD/eMMCconfig code isadded.

Externalmemory

Table continues on the next page...

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NXP Semiconductors
Feature Change Summary

Table 1. Architectural changes (continued)
On-chip
memoryBoot ROM

UpdatedIncreased ROM size from 128 KB
to 256 KB.

None

OCRAM

UpdatedIncreased OCRAM size from 128
KB to 256 KB.

None

SecurityHigh Assurance
Boot (HAB)

UpdatedNone

HAB version is updated to 4.3.9.

SystemIntegration

Memory Map

UpdatedMemory map was updated toreflect IP changes.

Refer to Memory map chapter in the
Reference Manual for full details.

IRQ Map

Updated

IRQ map was updated to reflect IP Refer to IRQ map chapter in thechanges.
Reference Manual for full details.

DMA Map

UpdatedDMA map was updated to reflect
IP changes.

Refer to DMA map chapter in the
Reference Manual for full details.

Fuse Map

UpdatedFuse map was updated to reflect
IP changes.

Refer to Fuse map chapter in the
Reference Manual for full details.

2.3 Power
Figure 1. on page 5 shows the power trees of both i.MX 8M M ini and i.MX 8M. For i.MX 8M Mini, VDD_GPU supply is combinedwith VDD_VPU, VDD_DRAM and VDD_DRAM_PLL_0P8 on the EVK board, and VDD_SOC is combined with
VDD_ARM_PLL_0P8, VDD_ANA_0P8, VDD_USB_0P8 and VDD_PCI_0P8 on the EVK board.

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NXP Semiconductors
Revision history

Figure 1. Power supply of i.MX 8M Mini vs i.MX8M

3 Revision history
Table 2. Revision history
Revision number

Date

Substantive changes

004/2019

Initial releasei.MX 8M Mini Migration Guide, Rev. 0, 4 April 2019
Application Note5/6

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Date of release: 4 April 2019
Document identifier: AN12296