33N
Polyimide Laminate and Prepreg
33N is a flame retardant (UL94 V-O) polyimide
laminate and prepreg system where the excellent
highperformance

properties

ofpolyimide

need to be combined with flame retardance.

HighTg (250°C) results in low overall z-axis expansion,and minimizes risk of latent PTH defects in-service.

Features:• Tg greater than 250°C• UL recognized as UL94 V-0• Low Z-axis expansion of 1.2% between 50-260°C (vs. 2.5-4.0%
for typical high-performance epoxies)• Low Z-axis expansion minimizes the risk of PTH latent defects
caused during solder reflow and device attachment• Decomposition temperature of 390°C (vs. 300-360°Cfor typical high-performance epoxies) offering outstanding longterm high-temperature performance• Electrical and mechanical properties meeting the requirementsof IPC-4101/40 and /41• Toughened chemistry resists resin fracturing• Ideal for lead-free processing• RoHS/WEEE compliant

Typical Applications:• PCBs that are subjected to high temperatures during processing,such as lead-free soldering, HASL, IR Reflow• Applications with significant lifetimes at high temperatures, suchas aircraft engine instrumentation, down hole drilling, under-hood
automotive controls, burn-in boards,or industrial sensors.

33N
Typical Properties:
Property

1. Electrical Properties
Dielectric Constant@ 1 MHz@ 1 GHz
Dissipation Factor@ 1 MHz@ 1 GHz
Volume Resistivity
C96/35/90
E24/125
Surface Resistivity
C96/35/90
E24/125
Electrical Strength
Dielectric Breakdown
Arc Resistance2. Thermal Properties
Glass Transition Temperature (Tg)
TMADSC
Decomposition Temperature (Td)
Initial
5%T260
T288
T300
CTE (X,Y)CTE (Z)< Tg> Tgz-axis Expansion (50-260ºC)
3. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)
After Thermal Stress
At Elevated Temperatures
After Process Solutions
Young’s Modulus
Flexural Strength
Tensile Strength
Poisson’s Ratio
4. Physical Properties
Water Absorption (0.062”)
Specific Gravity
Thermal Conductivity
Flammability

Units

Value

Test Method

Multilayer ~ 50% RC
Multilayer ~ 50% RC

4.25
4.1

IPC TM-650 2.5.5.3
IPC TM-650 2.5.5.9

-0.01
N/A

IPC TM-650 2.5.5.3
IPC TM-650 2.5.5.9

MΩ-cm
MΩ-cm

7.2 x 107
4.5 x 108

IPC TM-650 2.5.17.1
IPC TM-650 2.5.17.1

MΩ
MΩ
Volts/mil (kV/mm)
kV
sec

4.1 x 108
1.6 x 109
1290 (50.8)>40170

IPC TM-650 2.5.17.1
IPC TM-650 2.5.17.1
IPC TM-650 2.5.6.2
IPC TM-650 2.5.6
IPC TM-650 2.5.1

°C°C

>250
N/A

IPC TM-650 2.4.24
IPC TM-650 2.4.25

°C°C
min
min
min
ppm/°C

353
389
>60
238
16ppm/°Cppm/°C
%

53164
1.2

IPC TM-650 2.4.24.6
IPC TM-650 2.4.24.6
IPC TM-650 2.4.24.1
IPC TM-650 2.4.24.1
IPC TM-650 2.4.24.1
IPC TM-650 2.4.41
IPC TM-650 2.4.24
IPC TM-650 2.4.24
IPC TM-650 2.4.24
IPC TM-650 2.4.24

lb/in (N/mm)
lb/in (N/mm)
lb/in (N/mm)
Mpsi (GPa)kpsi (MPa)kpsi (MPa)-7.2 (1.2)
7.2 (1.2)
7.5 (1.3)
3.2

0.15

IPC TM-650 2.4.8
IPC TM-650 2.4.8.2
IPC TM-650 2.4.8
IPC TM-650 2.4.18.3
IPC TM-650 2.4.4
IPC TM-650 2.4.18.3
ASTM D-3039%g/cm3
W/mk
class

0.21
1.6
0.2V-0

IPC TM-650 2.6.2.1
ASTM D792 Method A
ASTM E1461
UL-94

Results listed above are typical properties, provided without warranty, expressed or implied, and without liability. Properties may vary, depending on design and application. Arlon reserves theright to change or update these values.

Availability:Arlon
Part Number

33N0672
33N8063
33N2355
33N2650
33N2840

Resin %

Scaled Flow
Hf (mils)

72
6355
Glass 50
Style40106

1.9 ± 0.3
2.6 ± 0.3
3.6 ± 0.3
Resin%
4.3 ± 0.3
6.872
± 0.3

Glass Style10610802313
Arlon2116
Part Number7628
33N0672

Scaled Flow
∆H (mils)

0.55 ± 0.20
0.55 ± 0.20
0.55 ± 0.20
Scaled Flow
± 0.20Hf 0.55(mils)
0.55± 0.201.9 ± 0.3

Scaled Flow
∆H (mils)

0.55 ± 0.20
33N80631080
632.6 ± 0.3
0.55 ± 0.20
Recommended Process 33N2355
Conditions: 2313
55
3.6 ± 0.3
0.55 ± 0.20
33N26502116
504.3 ± 0.3
0.55 ± 0.20
Process inner-layers through develop, etch, and strip using standard industry practices. Use brown oxide
33N28407628
406.8±0.3± 0.20
on inner layers. Adjust dwell time in the oxide bath to ensure uniform coating. Bake inner layers in0.55
a rackfor 60 minutes at 107°C - 121°C (225°F - 250°F) immediately prior to lay-up. Vacuum desiccate the prepreg
for 8 - 12 hours prior to lamination.
Lamination Cycle:
Size1) Pre-vacuum for 30 Panel- 45 minutes

Pressurein to 4°C - cm
psiper minutekg/cm2) Control the heat rise
6°C (8°F - 12°F)
between 65°C and 121°C (150°F and 250°F).
212 x 18
16 x 1818 x 24

40 x 46275
30 x 4635046 x 61Panel Size
400in
12 x 18
16 x 1818 x 24

192428cm40 x 46
30 x 4646 x 61Pressurepsi275
350
400kg/cm21924283) Set cure temperature at 213˚C (415˚F). Start cycle timer when product temperature reaches 210˚C (410˚F)4) Cure time at temperature = 90 minutes
NOTE: For sequential lamination use 60 minutes for the first lamination and 90 minutes for the final
Cool down under pressure at ≤ 6°C/min (12°F/min)Drill at 350 SFM. Undercut bits are recommended for vias 0.018” and smaller
De-smear using alkaline permanganate or plasma with settings appropriate for polyimide;
plasma is preferred for positive etchback
Conventional plating processes are compatible with 33NStandard profiling parameters may be used; chip breaker style router bits are not recommended
Bake for 1 - 2 hours at 121°C (250°F) prior to solder to reflow of HASL

33N

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