HVSO
N20

SOT1360-1

plastic thermal enhanced extremely thin quad flat package;no leads; 20 terminals; body 3.5 x 5.5 x 0.85 mm
9 June 2016

Package information

1. Package summary
Terminal position code

B (bottom)

Package type descriptive code

HVSON

Package type industry code

HVSON20

Package style descriptive code

HVSON (thermal enhanced very thin smalloutline; no leads)

Package body material typeP (plastic)

Mounting method typeS (surface mount)

Issue date

6-7-2015

Table 1. Package summary
SymbolParameterMinTypNomMaxUnit

D

package length

5.4-

5.55.6mm

Epackage width

3.4-

3.53.6mmA

seated height

0.8-

0.851mmenominal pitch--

0.5-mmn2

actual quantity of termination

--

20-

SOT1360-1

NXP Semiconductors

plastic thermal enhanced extremely thin quad flat package; no leads; 20 terminals; body 3.5 x 5.5 x 0.85mm

2. Package outline
HVSON20: plastic thermal enhanced extremely thin quad flat package; no leads;
20 terminals; body 3.5 x 5.5 x 0.85 mm

SOT1360-1

XDBAAE

A1

C

detail X
terminal 1
index area
terminal 1
index area

e1

Cev
w

b1

10C A BCy1 CyLK

Eh20

11Dh03

Dimensions
bC

D(1)

DhE(1)

Ehee1

KLv

w

max 1.00 0.05 0.30
nom 0.85 0.03 0.25
min 0.80 0.00 0.20

0.2

5.6
5.5
5.4

4.85
4.80
4.75

3.6
3.5
3.4

1.85
1.80
1.75

0.5

4.5

0.40 0.55
0.35 0.50
0.30 0.45

0.1

0.05 0.05

Unitmm

6 mm

scale
A(1)

A1yy1
0.1

Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
Outlineversion
SOT1360-1

References
IECJEDEC

JEITA

sot1360-1_po

Europeanprojection

Issue date
15-05-13
15-07-06

MO-240Fig. 1. Package outline HVSON20 (SOT1360-1)

SOT1360-1

Package information

All information provided in this document is subject to legal disclaimers.

9 June 2016

© NXP Semiconductors N.V. 2016. All rights reserved

2/4

SOT1360-1

NXP Semiconductors

plastic thermal enhanced extremely thin quad flat package; no leads; 20 terminals; body 3.5 x 5.5 x 0.85mm

3. Legal information
Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for theconsequences of use of such information. NXP Semiconductors takes noresponsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removalor replacement of any products or rework charges) whether or not suchdamages are based on tort (including negligence), warranty, breach ofcontract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordancewith the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right tomake changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.

SOT1360-1

Package information

All information provided in this document is subject to legal disclaimers.

9 June 2016

© NXP Semiconductors N.V. 2016. All rights reserved

3/4

SOT1360-1

NXP Semiconductors

plastic thermal enhanced extremely thin quad flat package; no leads; 20 terminals; body 3.5 x 5.5 x 0.85mm

4. Contents
1. Package summary........................................................ 1
2. Package outline............................................................ 2
3. Legal information......................................................... 3© NXP Semiconductors N.V. 2016. All rights reserved

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 9 June 2016

SOT1360-1

Package information

All information provided in this document is subject to legal disclaimers.

9 June 2016

© NXP Semiconductors N.V. 2016. All rights reserved

4/4