MF3D(H)x3

MIFARE DESFire EV3 contactless multi-application IC
Rev. 3.1 — 11 January 2024

Product short data sheet

1 General description
1.1 Introduction
MF3D(H)x3 is the latest addition to the MIFARE DESFire product family introducing new feature alongwith enhanced performance for best user experience. The MF3D(H)x3 is Common Criteria EAL5+ security
certified which is the same security certification level as demanded for smart card IC products used e.g. forbanking cards or electronic passports. It fully complies with the requirements for fast and highly secure datatransmission and flexible application management. This makes it the ideal product for service providers andservice operators who want to offer an easy, convenient and secure access to a wide variety of different
services.
MF3D(H)x3 offers best flexibility when creating multi-application schemes and feature such as MIsmartApp
is supporting new business models. Using MF3D(H)x3 with NXP's AppXpplorer cloud service, Smart Cities
services for example could be utilized with only one card by combining services such as public transport, caror bike sharing, access to city attractions with citizen services, closed-loop e-payment applications and local
loyalty programs.
MF3D(H)x3 is based on global open standards for both air interface and cryptographic methods. It is compliant
to all levels of ISO/IEC 14443A and supports optional ISO/IEC 7816-4 commands (APDU and file structure
supported) and is fully interoperable with existing NFC reader for MIFARE infrastructure.
Featuring an on-chip backup management system and the mutual three-pass authentication, a MF3D(H)x3
card can hold as many applications as the memory can accommodate. Each application can hold up to 32
files with various data configurations. The size of each file is defined at the moment of its creation, making
MF3D(H)x3 a truly flexible and convenient product. An automatic anti-tear mechanism is available for all filetypes, guaranteeing transaction-oriented data integrity.
The main characteristics of this device are denoted by its name "DESFire": DES indicates the high level of
security using a 3DES or AES hardware cryptographic engine for confidentiality and integrity protection of thetransmission data. Fire indicates its outstanding position as a Fast, Innovative, Reliable and sEcure IC in thecontactless proximity transaction market.
MF3D(H)x3 delivers the perfect balance of speed, performance and cost efficiency. Its open concept allows
seamless future integration of other ticketing media such as smart paper tickets, banking convergence card,and MIFARE 2GO mobile ticketing service based on Near Field Communication (NFC) technology. MF3D(H)x3
is your ticket to secure contactless systems worldwide.

1.2 Evolution of MIFARE DESFire products family
MIFARE DESFire has evolved over time, enhancing its security properties to protect against current and future
security threats, and adding new features to better suit into new user requirements.

MF3D(H)x3

NXP Semiconductors

MIFARE DESFire EV3 contactless multi-application IC
MIFARE DESFire EV3 is the fourth generation of the MIFARE DESFire products family succeeding MIFAREDESFire EV2. It is functionally backward compatible with all previous MIFARE DESFire generations, namely
MIFARE DESFire EV2, MIFARE DESFire EV1 and MIFARE DESFire D40 (MF3ICD40).
Figure 1 shows the relationship between the latest three generations of MIFARE DESFire products. The latest
generation encompasses the features from the older generation(s). Therefore, allowing existing users of theolder products to adopt the latest product with minimum or no changes to their infrastructures.
MIFARE DESFire EV3 can be used as a MIFARE DESFire EV2 or a MIFARE DESFire EV1 in its default
delivery configuration. Every new feature would require an activation and/or the use of new commands which is
described in their respective sections in this document.
EV3
CC EAL5+ on HW and SW
2 KB, 4 KB or 8 KB NV memory
No limit on no. of Applications, 32 files
6 file types - new Transaction MAC file
17 pF or 70 pF

EV2
CC EAL5+ on HW and SW
2 KB, 4 KB, 8 KB, 16 KB or 32 KB NV memory
No limit on no. of Applications, 32 files
6 file types - new Transaction MAC file
17 pF or 70 pF

EV1
CC EAL4+ on HW and SW
256 B, 2 KB, 4 KB or 8 KB NV memory
28 Applications, 32 files
5 file types
17 pF or 70 pF

Secure messaging (EV1):
2KTDEA and 3KTDEA and AES128
Random ID
ISO7816-4 APDU and CMDs (8)ISO7816-4 file structure support
Configurable ATS

Secure messaging (EV2):
AES128
Random ID
Improved ISO7816-4 support
Configurable ATS:up to 128 bytes buffer
MlsmartApp
Transaction MAC
Multiple Key Sets
Multiple keys per access rights
Shared application management
UpdateRecord command
Virtual Card Architecture
Proximity Check
Originality Check

Secure messaging (EV2):
AES128
Random ID
Improved ISO7816-4 support
Configurable ATS:up to 256 bytes buffer
MlsmartApp
Transaction MAC
Multiple Key Sets
Multiple keys per access rights
Shared application management
UpdateRecord command
Virtual Card Architecture
Proximity Check
Originality Check
Tranaction Timer
Secure Dynamic Messaging
NXP AppXplorer support

aaa-037714

Figure 1. Evolution of MIFARE DESFire

MF3D_H_X3_SDS

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2 Features and benefits
2.1 Feature overview
2.1.1 RF interface: ISO/IEC 14443 Type A• Contactless interface compliant with ISO/IEC 14443-2/3 A• Low Hmin enabling operating distance up to 100 mm (depending on power provided by the PCD and antenna
geometry)• Fast data transfer: 106 kbit/s, 212 kbit/s, 424 kbit/s, 848 kbit/s• 7 bytes unique identifier (option for Random ID)• Uses ISO/IEC 14443-4 transmission protocol• Configurable FSCI to support up to 256 bytes frame size

2.1.2 Non-volatile memory• 2 kB, 4 kB, 8 kB, or 16 kB• Data retention of 25 years• Write endurance typical 1 000 000 cycles• Fast programming cycles

2.1.3 NV-memory organization and multi-application support• Flexible file system: user can freely define application structures on PICC
• As many applications as the memory size supports per PICC
• Up to 32 files in each application (6 file types available: Standard Data file, Back-up Data file, Value file, Linear
Record file, Cyclic Record file and Transaction MAC file)• File size is determined during creation (not for Transaction MAC file)• MIsmartApp (Delegated Application Management)• Memory reuse in DAM applications (Format Application)• Factory loaded NXP's DAM keys for AppXplorer service support• Accessing files from any two applications during a single transaction

2.1.4 Security and Privacy• Common Criteria certification: EAL5+ (Hardware and Software)• Unique 7 bytes serial number for each device• Optional “RANDOM” ID for enhanced security and privacy• Mutual three-pass authentication• Mutual authentication according to ISO/IEC 7816-4• Flexible key management: 1 card master key and up to 14 keys per application• Multiple key assignment for each file access rights (up to 8)• Multiple Key Sets per application with fast key rolling mechanism (up to 16 sets)• Hardware DES using 56/112/168 bit keys featuring key version• Hardware AES using 128-bit keys featuring key version• Data authenticity by 8 byte CMAC
• MF3ICD40 compatible mode: 4 byte MAC, CRC 16• Data encryption on RF-channel• Authentication on application level
MF3D_H_X3_SDS

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MIFARE DESFire EV3 contactless multi-application IC• Hardware exception sensors• Self-securing file system• Transaction MAC signed with secret key per application• Virtual Card Architecture for enhanced card/application selection on multi-VC devices with privacy protection• Proximity Check for protection against Relay Attacks• Originality Check for proof of genuine NXP’s product2.1.5 ISO/IEC 7816 compatibility• Supports ISO/IEC 7816-4 file structure (selection by File ID or DF name)• Supports ISO/IEC 7816-4 APDU message structure• Supports ISO/IEC 7816-4 APDU wrapper for MIFARE DESFire native commands• Supports ISO/IEC 7816-4 INS code ‘A4’ for SELECT FILE
• Supports ISO/IEC 7816-4 INS code ‘B0’ for READ BINARY• Supports ISO/IEC 7816-4 INS code ‘D6’ for UPDATE BINARY• Supports ISO/IEC 7816-4 INS code ‘B2’ for READ RECORDS• Supports ISO/IEC 7816-4 INS code ‘E2’ for APPEND RECORD• Supports ISO/IEC 7816-4 INS code ‘84’ for GET CHALLENGE• Supports ISO/IEC 7816-4 INS code ‘88’ for INTERNAL AUTHENTICATE• Supports ISO/IEC 7816-4 INS code ‘82’ for EXTERNAL AUTHENTICATE

2.1.6 Special features• Transaction-oriented automatic anti-tear mechanism with new transaction timer support• Configurable ATS information for card personalization• Backward compatibility mode to MIFARE DESFire EV2, EV1 and D40 (MF3ICD40)• Secure Unique NFC (SUN) enabled by Secure Dynamic Messaging (SDM) which is mirrored as text into the
NDEF message (compatible with NTAG DNA)
• NFC Forum Type 4 Tag certified (Certificate ID. 58652)• Optional high input capacitance (70 pF) for small form factor designs (MF3DHx3)

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MIFARE DESFire EV3 contactless multi-application IC

2.2 Summary of key differences between MIFARE DESFire generations
Table 1 shows the key differences between the latest three product generations of the MIFARE DESFire family.
For more detail on the new features, please refer to their respective sections in this document.
Table 1. Key differences between MIFARE DESFire generations
Features

MIFARE DESFire EV1

MIFARE DESFire EV2

MIFARE DESFire EV3

Cryptography scheme(s)Single DES, 2KTDEA,
3KTDEA, AES128

Single DES, 2KTDEA,
3KTDEA, AES128

Single DES, 2KTDEA,
3KTDEA, AES128

Secure messaging(s)D40 Native, EV1

D40 Native, EV1, EV2 (seeproduct data sheet )D40 Native, EV1, EV2 (seeproduct data sheet

No. of applications

28

No limit

No limit

No. of files per application

32

32

32

Max. no. of files with backup

32

32

32

ISO/IEC7816-4 commands

8

8 (refined)

8 (refined)

Random ID

Yes

Yes

Yes

Configurable ATS

Yes, Historical bytes only

Yes, all parameters

Yes, all parameters

Max. communication buffer

64 bytes

up to 128 bytes

Up to 256 bytes

Chaining during data transfer

Native (AFh)Native (AFh) or ISO/
IEC14443-4

Native (AFh) or ISO/
IEC14443-4

Multiple Key Sets with rolling

No

Yes

Yes

MIsmartApp (DelegatedApplication Management)

No

Yes

Yes

NXP AppXplorer supports

No

Yes, self configuration

Yes, preloaded DAM keys

Shared Application
Management

No

Yes

Yes

Multiple keys per access right

No

Yes

Yes

UpdateRecord command

No

Yes

Yes

Transaction MAC

No

Yes

Yes

Transaction Timer

No

No

Yes

Secure Dynamic Messaging

No

No

Yes

Virtual Card Architecture

No

Yes

Yes

Proximity Check

No

Yes

Yes

Originality Check

No

Yes

Yes

MF3D_H_X3_SDS

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MIFARE DESFire EV3 contactless multi-application IC

3 Applications• Secure public transport ticketing• Multi-application smart city and mobility card
• Secure access management• Micro-payment and Loyalty• Student ID• Road tolling and parking• Hospitality• Event ticketing

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MIFARE DESFire EV3 contactless multi-application IC

4 Quick reference data
Table 2. Quick reference data
SymbolParameterfi

input frequency

Ci

input capacitance[1][2]

Conditions

Min

Typ

Max

Unit

-

13.56

-

MHz

MF3Dx3[3][4]

-

17.0

-

pF

MF3DHx3[3][4]

-

66.5

-

pF

NV memory characteristics
tret

retention time

Tamb = 25 °C

25

-

-

year

Nendu(W)write endurance

Tamb = 25 °C

200 000

1 000 000

-

cycle

[1]
[2]
[3]
[4]

Stresses above one or more of the values may cause permanent damage to the device.
Exposure to limiting values for extended periods may affect device reliability.
Measured with LCR meter.
Tamb = 25 °C; fi = 13.56 MHz; 2.1 V RMS

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MIFARE DESFire EV3 contactless multi-application IC

5 Ordering information
Table 3. Ordering information
Type number

Package

Description

Version[1][2]-[1][2]-[1][2]-[1][2]-[1][2]-[1][2]-[1][2]-[1][2]-[3]

SOT500-2[3]

SOT500-2[3]

SOT500-2[3]

SOT500-2[3]

SOT500-2[3]

SOT500-2[3]

SOT500-2[3]

SOT500-2[4]

SOT500-4[4]

SOT500-4[4]

SOT500-4[4]

SOT500-4[4]

SOT500-4

MF3D2301DUD/00

FFC

12-inch wafer (sawn; 120 μm thickness)
capacitanceMF3D4301DUD/00

FFC

12-inch wafer (sawn; 120 μm thickness)
capacitanceMF3D8301DUD/00

FFC

12-inch wafer (sawn; 120 μm thickness)
capacitanceMF3D9301DUD/01

FFC

12-inch wafer (sawn; 120 μm thickness)
capacitance

MF3DH2301DUD/00

FFC

12-inch wafer (sawn; 120 μm thickness)
capacitance

MF3DH4301DUD/00

FFC

12-inch wafer (sawn; 120 μm thickness)
capacitance

MF3DH8301DUD/00

FFC

12-inch wafer (sawn; 120 μm thickness)
capacitance

MF3DH9301DUD/01

FFC

12-inch wafer (sawn; 120 μm thickness)
capacitanceMF3D2300DA4/00

MOA4

plastic leadless module carrier package ; 2 kB, 17 pF input
capacitanceMF3D4300DA4/00

MOA4

plastic leadless module carrier package ; 4 kB, 17 pF input
capacitanceMF3D8300DA4/00

MOA4

plastic leadless module carrier package ; 8 kB, 17 pF input
capacitanceMF3D9300DA4/01

MOA4

plastic leadless module carrier package ; 16 kB, 17 pF input
capacitance

MF3DH2300DA4/00

MOA4

plastic leadless module carrier package ; 2 kB, 70 pF input
capacitance

MF3DH4300DA4/00

MOA4

plastic leadless module carrier package ; 4 kB, 70 pF input
capacitance

MF3DH8300DA4/00

MOA4

plastic leadless module carrier package ; 8 kB, 70 pF input
capacitance

MF3DH9300DA4/01

MOA4

plastic leadless module carrier package ; 16 kB, 70 pF input
capacitanceMF3D2300DA8/00

MOA8

plastic leadless module carrier package ; 2 kB, 17 pF input
capacitanceMF3D4300DA8/00

MOA8

plastic leadless module carrier package ; 4 kB, 17 pF input
capacitanceMF3D8300DA8/00

MOA8

plastic leadless module carrier package ; 8 kB, 17 pF input
capacitanceMF3D9300DA8/01

MOA8

plastic leadless module carrier package ; 16 kB, 17 pF input
capacitance

MF3DH2300DA8/00

MOA8

plastic leadless module carrier package ; 2 kB, 70 pF input
capacitanceMF3D_H_X3_SDS

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; 2 kB, 17 pF input; 4 kB, 17 pF input; 8 kB, 17 pF input; 16 kB, 17 pF input; 2 kB, 70 pF input; 4 kB, 70 pF input; 8 kB, 70 pF input; 16 kB, 70 pF input© 2024 NXP B.V. All rights reserved.

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MIFARE DESFire EV3 contactless multi-application IC
Table 3. Ordering information...continued
Type number

Package

Description

Version[4]

SOT500-4[4]

SOT500-4[4]

SOT500-4

MF3DH4300DA8/00

MOA8

plastic leadless module carrier package ; 4 kB, 70 pF input
capacitance

MF3DH8300DA8/00

MOA8

plastic leadless module carrier package ; 8 kB, 70 pF input
capacitance

MF3DH9300DA8/01

MOA8

plastic leadless module carrier package ; 16 kB, 70 pF input
capacitance

[1]
[2]
[3]
[4]

Delivered on film frame carrier with electronic fail die marking according to SECSII format.
See [2]
See Figure 4
See Figure 5

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MIFARE DESFire EV3 contactless multi-application IC

6 Block diagram
ANALOGPOR

OSCILLATOR

CLOCK
GENERATIONRECTIFIER,
MODULATORDEMODULATOR

CLOCK
FILTERVOLTAGESENSORSSUSPENSION
TIME, TEMPSENSORVOLTAGEREGULATORACTIVESHIELDING, RAILSENSORS

LIGHT
GLITCHSENSOR

ROM

LA

LB

Data
bus
CPU

MMU

RAM

NVM

MF3D(H)x3

ISO14443
CIU

CRC
16/32

TRNG

3-Key
DES

AES
128
aaa-037517

Figure 2. MIFARE DESFire EV3 IC block diagram

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MIFARE DESFire EV3 contactless multi-application IC

7 Functional description
7.1 Introduction
MIFARE DESFire EV3 is a contactless multi-application smart card IC compliant with ISOIEC 14443A (part1-4). The MIFARE DESFire EV3 operating system provides an off-the-shelf development platform for smart card
application providers.
The memory organization of MIFARE DESFire EV3 is flexible and can be dynamically structured to fit into any
application requirements. The application and file structure is shown in Figure 3. Each application folder is acontainer of data files usable within a certain real world application (e.g. Transport ticketing). There are 5 filetypes available for data storage and 1 file type for storing Transaction MAC as detailed in Section 7.6.
Within the application folder, there is a set of keys and configuration settings dedicated for the application. The
application owner can freely organize the file structure and security setting within his application. An adjacentapplication will not have access to its files as long as they do not possess the correct security rights. MIFAREDESFire EV3 also supports the ISO/IEC 7816-4 file structure and APDU.
At the PICC level, there is another set of keys and security settings for the PICC owner. The PICC owner will
have the right to create or delete any application, but he will not have access to the application's files, unless heknows the application keys too.

Application x

Application z

App. Setting
configuration

Application
Keys

PICC Setting andconfiguration
Std. Data
File

BackUp Data
File

Cyclic Record
FileLinear Record
File

Value
File

Up to 14 keys, free and never access options per application.
Applications are independent of PICC keys and crypto
Applications are independent of each other5 types of data file + 1 Transaction MAC file (optional)
Maximum 32 files per application
PICC Keys

Independent file access and communication settings

Application Y

Transaction
MAC
File

aaa-022073

Figure 3. MIFARE DESFire EV3 product-based application and file structure

MIFARE DESFire EV3 supports confidential and integrity protected communication (see Section 7.7). Each
MIFARE DESFire EV3 application can have its own cryptographic settings (i.e. 2TDEA, 3TDEA or AES)
and secure messaging for communication. The D40 and EV1 secure messaging are included in the productfor backward compatible support of existing installations. For new projects, the EV3 secure messaging is
recommended.

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MF3D(H)x3

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MIFARE DESFire EV3 contactless multi-application IC
MIFARE DESFire EV3 offers a transaction-oriented backup mechanism to prevent inconsistent updating of data
storage across multiple files during a tearing situation. When transaction tearing occurs, either all data fields are
updated or none is altered. MIFARE DESFire EV3 offers a new Transaction Timer feature which will prevent a
Man-in-the-Middle (MitM) attack where the attacker delays the conclusion of a transaction by keeping the card
powered after it left the legitimate reader device.
Besides the application file structure support, MIFARE DESFire EV3 offers many optional features such as
following:• Delegated Application Management (MIsmartApp) for giving rights to third-party application creation andmanagement.
• Multiple key set within an application with key rolling mechanism and key migration supported.
• Shared files between two applications, supporting a single transaction over two applications at the same time.
• Multiple keys for each access right of files.
• Transaction MAC on application level, MACing the transacted data with a secret key on the card and served
as a proof of transaction to the backend system.
• Secure Dynamic Messaging (SDM) which is mirror as text into the NDEF message• Virtual Card Architecture providing a privacy protecting mechanism during card selection.
• Proximity Check to prevent against relay attacks.
• Originality Check for verification of genuine MIFARE DESFire EV3 product from NXP or its licensees.
The following chapters provide basic description of some functionality on MIFARE DESFire EV3. For a moredetailed description of each functionality on MIFARE DESFire EV3, see [1].

7.2 Contactless energy and data transfer
In the MIFARE product-based system, the MIFARE DESFire EV3 is connected to a coil consisting of a few
turns embedded in a standard ISO/IEC smart card. A battery is not needed. When the card is positioned in theproximity of the PCD antenna, the high-speed RF communication interface allows data to be transmitted up to
848 kbit/s.

7.3 Anti-collision
An intelligent anti-collision mechanism allows more than one MIFARE DESFire EV3 in the field to be handledsimultaneously. The anti-collision algorithm selects each MIFARE DESFire EV3 individually and ensuresthat the execution of a transaction with a selected MIFARE DESFire EV3 is performed correctly without data
corruption resulting from other MIFARE DESFire EV3s in the field.

7.4 UID/serial number
The unique 7 byte (UID) is programmed into a locked part of the NV memory which is reserved for the
manufacturer. Due to security and system requirements these bytes are write-protected after being programmedby the IC manufacturer at production time. According to ISO/IEC 14443-3 during the first anti-collision loop thecascade tag returns a value of 88h and also the first 3 bytes of the UID, UID0 to UID2 and BCC. The second
anti-collision loop returns bytes UID3 to UID6 and BCC.
UID0 holds the manufacturer ID for NXP (04h) according to ISO/IEC 14443-3 and ISO/IEC 7816-6 AMD 1.
MIFARE DESFire EV3 also allows Random ID to be used. In this case, MIFARE DESFire EV3 only uses asingle anti-collision loop. The 3 byte random number is generated after RF reset of the MIFARE DESFire EV3.

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7.5 Memory organization
The NV memory is organized using a flexible file system. This file system allows multiple numbers of different
applications on one MIFARE DESFire EV3. Each application can have multiple files. Every application isrepresented by its 3 bytes Application IDentifier (AID) and an optional ISO DF Name.
5 different data file types and 1 Transaction MAC file type are supported; see Section 8.6.
A guideline to assign DESFire AIDs can be found in the application note MIFARE Application Directory (MAD);see [3].
Each file can be created either at MIFARE DESFire EV3 initialization (card production/card printing), at MIFAREDESFire EV3 personalization (vending machine) or in the field.
If a file or application becomes obsolete in operation, it can be permanently invalidated.
Commands which have impact on the file structure itself (e.g. creation or deletion of applications, change ofkeys) activate an automatic rollback mechanism, which protects the file structure from being corrupted.
If this rollback is necessary, it is done without user interaction before carrying out further commands. To ensure
data integrity on application level, a transaction-oriented backup is implemented for all file types with backup. It
is possible to mix file types with and without backup within one application.

7.6 Available file types
The files within an application can be any of the following types:• Standard data files• Backup data files• Value files with backup• Linear record files with backup• Cyclic record files with backup• Transaction MAC file

7.7 Security
The 7 byte UID is fixed, programmed into each device during production. It cannot be altered and ensures theuniqueness of each device.
The UID may be used to derive diversified keys for each ticket. Diversified MIFARE DESFire EV3 keys
contribute to gain an effective anti-cloning mechanism and increase the security of the original key.
Prior to data transmission a mutual three-pass authentication can be done between MIFARE DESFire EV3 and
PCD depending on the configuration employing either 56-bit DES (single DES, DES), 112-bit DES (triple DES,
3DES), 168-bit DES (3 key triple DES, 3K3DES) or AES. During the authentication, the level of security of all
further commands during the session is set. In addition, the communication settings of the file/application resultin the following options of secure communication between MIFARE DESFire EV3 and PCD:
• Plain data transfer (only possible within the backwards-compatible mode to MF3ICD40 and EV2 secure
messaging)• Plain data transfer with cryptographic checksum (MAC): Authentication with backwards-compatible mode to
MF3ICD40: 4 byte MAC; All other authentications based on DES/3DES/AES: 8 byte CMAC
• Encrypted data transfer (secured by CRC before encryption): Authentication with backwards-compatible modeto MF3ICD40: A 16-bit CRC is calculated over the stream and attached. The resulting stream is encryptedusing the chosen cryptographic method. All other authentications-based DES/3DES/AES: A 32-bit CRC iscalculated over the stream and attached. The resulting stream is encrypted using the chosen cryptographic
method. A cryptographic checksum (CMAC) will also be attached when using EV2 secure messaging.
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MIFARE DESFire EV3 contactless multi-application IC
Find more information on the security concept of the product in [1]. Be aware not all levels of security arerecommended. For new design, the EV2 secure messaging is recommended.

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8 DESFire command set
This section contains an overview of MF3D(H)x3 command code. A detailed description of all commands isprovided in [1].

8.1 Secure Messaging Commands
Table 4. Secure messaging commands overview
Command

Description

Authenticate

Authentication as it was already supported by D40. Only for KeyType.2TDEA keys.
Note that the PICC only performs encryption operations. After this authentication, theD40 backwards compatible secure messaging is used.

AuthenticateISO

Authentication as already supported by DESFire EV1. Only for KeyType.2TDEA or
KeyType.3TDEA keys. After this authentication, EV1 backwards compatible secure
messaging is used.

AuthenticateAES

Authentication as already supported by DESFire EV1. Only for KeyType.AES keys.
After this authentication, EV1 backwards compatible secure messaging is used.

AuthenticateEV2First

Authentication for KeyType.AES keys. After this authentication, EV2 secure
messaging is used. This authentication is intended to be the first in a transaction.

AuthenticateEV2NonFirst

Authentication for KeyType.AES keys. After this authentication, EV2 secure
messaging is used. This authentication is intended for any subsequent authentication
after Cmd.AuthenticateEV2First in a transaction.

8.2 Memory and Configuration Management Commands
Table 5. Memory and configuration management commands overview
Command

Description

FreeMem

Returns the free memory available on the card

FormatAt PICC level, all applications and files are deleted. At application level (only fordelegated applications), all files are deleted. The deleted memory is released and canbe reused.

SetConfiguration

Configures the card and pre personalizes the card with a key, defines if the UID or the
random ID is sent back during communication setup and configures the ATS string.

GetVersion

Returns manufacturing related data of the PICC.

GetCardUID

Returns the UID.

8.3 Key Management Commands
Table 6. Key management commands overview
Command

Description

ChangeKey

Changes any key stored on the PICC.

ChangeKeyEV2

Depending on the currently selected AID, this command updates a key of the PICC orof one specified application keyset.

InitializeKeySet

Depending on the currently selected application, initialize the key set with specificindex.

FinalizeKeySet

Within the currently selected application, finalize the key set with specified number

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Table 6. Key management commands overview...continued
Command

Description

RollKeySet

Within the currently selected application, roll to the key set with specified number

GetKeySettings

Gets information on the PICC and application master key settings.

ChangeKeySettings

Changes the master key settings on PICC and application level.

GetKeyVersion

Reads out the current key version of any key stored on the PICC.

8.4 Application Management Commands
Table 7. Application management commands overview
Command

Description

CreateApplication

Creates new applications on the PICC. The application is initialized according to
the given settings. The application keys of the active key set are initialized with theDefault Application Key.

DeleteApplication

Permanently deactivates applications on the PICC.

CreateDelegatedApplication

Creates delegated applications on the PICC with limited memory consumption.

SelectApplication

Selects one specific application for further access.

GetApplicationIDs

Returns the Application IDentifiers of all applications on a PICC.

GetDFNames

Returns the DF names

GetDelegatedInfo

Returns the DAMSlotVersion and QuotaLimit of a target DAM slot on the card.

8.5 File Management Commands
Table 8. File management commands overview
Command

Description

CreateStdDataFile

Creates files for the storage of plain unformatted user data within an existing
application on the PICC.

CreateBackupDataFile

Creates files for the storage of plain unformatted user data within an existing
application on the PICC, additionally supporting the feature of an integrated backup
mechanism.

CreateValueFile

Creates files for the storage and manipulation of 32bit signed integer values within anexisting application on the PICC.

CreateLinearRecordFile

Creates files for multiple storages of structural similar data, for example for loyalty
programs, within an existing application on the PICC. Once the file is filled completely
with data records, further writing to the file is not possible unless it is cleared.

CreateCyclicRecordFile

Creates files for multiple storages of structural similar data, for example for logging
transactions, within an existing application on the PICC. Once the file is filled
completely with data records, the PICC automatically overwrites the oldest record withthe latest written one. This wrap is fully transparent for the PCD.

CreateTransactionMACFile

Creates a Transaction MAC File and enables the Transaction MAC feature for thetargeted application.

DeleteFile

Permanently deactivates a file within the file directory of the currently selected
application.

GetFileIDs

Returns the File IDentifiers of all active files within the currently selected application.

GetISOFileIDs

Get back the ISO File ID.

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Table 8. File management commands overview...continued
Command

Description

GetFileSettings

Get information on the properties of a specific file.

ChangeFileSettings

Changes the access parameters of an existing file.

8.6 Data Management Commands
Table 9. Data management commands overview
Command

Description

ReadData

Reads data from FileType.StandardData or FileType.BackupData.

WriteData

Writes data to FileType.StandardData or FileType.BackupData

GetValue

Reads the currently stored value from FileType.Value.

CreditIncreases a value stored in a FileType.Value.

Debit

Decreases a value stored in a FileType.Value.

LimitedCredit

Allows a limited increase of a value stored in a FileType.Value without having fullCredit permissions to the file.

ReadRecords

Reads out a set of complete records from a FileType.CyclicRecord or FileType.Linear
Record.

WriteRecord

Writes data to a record in a FileType.CyclicRecord or FileType.LinearRecord.

UpdateRecord

Updates data of an existing record in a FileType.LinearRecord or FileType.Cyclic
Record file.

ClearRecordFile

Resets a FileType.LinearRecord or FileType.CyclicRecord to empty state.

8.7 Transaction Management Commands
Table 10. Transaction management commands overview
Command

Description

CommitTransaction

Validates all previous write access’ on FileType.BackupData, FileType.Value, FileType.
LinearRecord and FileType.CyclicRecord within one application.

AbortTransaction

Invalidates all previous write access’ on FileType.BackupData, FileType.Value, File
Type.LinearRecord and FileType.CyclicRecord within one application.

CommitReaderID

Commits a ReaderID for the ongoing transaction. This will allow a backend to identify
the attacking merchant in case of fraud detected.

8.8 ISO/IEC 7816-4 Standard Commands
Table 11. ISO/IEC 7816-4 support commands overview
Command

Description

ISOSelectFile

Selects either the PICC level, a DESFire application or a DESFire file within an
application.

ISOReadBinary

Read data from FileType.StandardData and FileType.BackupData files.

ISOUpdateBinary

Write data to FileType.StandardData and FileType.BackupData files.

ISOReadRecord

Read data from FileType.LinearRecord and FileType.CyclicRecord files.

ISOAppendRecord

Write a new record to FileType.LinearRecord and FileType.CyclicRecord files.

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Table 11. ISO/IEC 7816-4 support commands overview...continued
Command

Description

ISOGetChallenge

To initiate a ISO/IEC 7816-4 authentication

ISOExternalAutheticate

Authenticate the PCD during a ISO/IEC 7816-4 authentication

ISOInternalAuthenticate

Authenticate the PICC during a ISO/IEC 7816-4 authentication

8.9 Virtual Card Commands
Table 12. Virtual Card commands overview
Command

Description

ISOSelect

Select VC with the given IID.

ISOExternalAuthenticate

Authenticate PCD before accessing the VC.

8.10 Proximity Check Commands
Table 13. Proximity Check commands overview
Command

Description

PreparePC

Prepare for the Proximity Check

ProximityCheck

Perform the precise measurement for the Proximity Check

VerifyPC

Verify the Proximity Check

8.11 Originality Check Commands
Table 14. Originality Check commands overview
Command

Description

Read_Sig

Retrieve the ECC originality check signature

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9 Limiting values[1][2]

Table 15. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
SymbolParameterPd,max

Min

Max

Unit

maximum power dissipation

-

240

mW

ILA-LB,maxmaximum input current at LA/LB

-

86

mA

Tstg

storage temperature

-55

125

°C

Tamb

ambient temperature

-25

85

°C

-

4

kV

VESD
[1]
[2]
[3]

Conditions

electrostatic discharge voltage[3]

Stresses above one or more of the limiting values may cause permanent damage to the device
Exposure to limiting values for extended periods may affect device reliability
ANSI/ESDA/JEDEC JS-001; Human body model: C = 100 pF, R = 1.5 kΩ

CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handlingelectrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent
standards.

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10 Package outline

PLLMC: plastic leadlessmodule carrier package; 35 mm wide tape

SOT500-2

XDA
detail X
0

10
scale

DIMENSIONS (mm are the original dimensions)
UNIT
mm

A(1)
max.

D

0.33

35.05
34.95

20 mm

For unspecified dimensions see PLLMC-drawing given in the subpackage code.

Note
1. Total package thickness, exclusive punching burr.
REFERENCESOUTLINE
VERSION

IEC

JEDEC

JEITA

SOT500-2

---

---

---

EUROPEAN
PROJECTION

ISSUE DATE
03-09-17
06-05-22

Figure 4. Package outline SOT500-2 (MOA4)

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PLLMC: plastic leadless module carrier package; 35 mm wide tape

SOT500-4

X
D

A

0

10

mm

detail X

scale

Dimensions
Unit

20 mm

A(1)

D

max 0.26 35.05
nom
35.00
min
34.95

For unspecified dimensions see PLLMC-drawing given in the subpackage code.

Note
1. Total package thickness, exclusive punching burr.

sot500-4_po

References

Outlineversion

IEC

JEDEC

JEITA

SOT500-4

---

---

---

Europeanprojection

Issue date
11-02-18

Figure 5. Package outline SOT500-4 (MOA8)

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11 Abbreviations
Table 16. Abbreviations
AcronymDescription

AES

Advanced Encryption Standard

AID

Application IDentifier

APDU

Application Protocol Data Unit

ATS

Answer to SelectCC

Common Criteria

CMAC

Cryptic Message Authentication Code

CRC

Cyclic Redundancy Check

DES

Digital Encryption Standard

DF

Dedicated File

EAL

Evaluation Assurance Level

EEPROM

Electrically Erasable Programmable Read-Only Memory

FWT

Frame Waiting TimeID

IDentifierINS

Instructions

LCR

inductance, Capacitance, Resistance

MAC

Message Authentication CodeMAD

MIFARE Application Directory

NV

Non-Volatile Memory

PCD

Proximity Coupling Device

PPS

Protocol Parameter Selection

RATS

Request Answer To Select

REQA

Request Answer

RFRadio Frequency

UID

Unique IDentifier

WTX

Waiting Time eXtension

WUPA

Wake Up Protocol A

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12 References
[1]
[2]
[3]

1

Data sheet MF3D(H)x3 MIFARE DESFire EV3 Product data sheet, document number: 4870** .
Data sheet MF3D(H)x3 Wafer specification, document number: 5808**.
Application note MIFARE Application Directory, document number: 0018**.

1 ** ... BU-ID document version number
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13 Revision history
Table 17. Revision history
Document ID

Release date

Description

MF3D_H_X3_SDS v. 3.1

11 January 2024

• Added additional part types for the 16 kB product variant in Section 5"Ordering information"

MF3D_H_X3_SDS v. 3.0

15 May 2020

• Initial version

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Legal information
Data sheet status
Document status[1][2]

Product status[3]

Definition

Objective [short] data sheet

Development

This document contains data from the objective specification for productdevelopment.

Preliminary [short] data sheet

Qualification

This document contains data from the preliminary specification.

Product [short] data sheet

Production

This document contains the product specification.

[1]
[2]
[3]

Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL https://www.nxp.com.

Definitions
Draft — A draft status on a document indicates that the content is still
under internal review and subject to formal approval, which may resultin modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included in a draft version of a document and shall have noliability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheetwith the same product type number(s) and title. A short data sheet isintended for quick reference only and should not be relied upon to containdetailed and full information. For detailed and full information see therelevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with theshort data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Productdata sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors andcustomer have explicitly agreed otherwise in writing. In no event however,shall an agreement be valid in which the NXP Semiconductors productis deemed to offer functions and qualities beyond those described in the
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Right to make changes — NXP Semiconductors reserves the right tomake changes to information published in this document, including without
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authorized or warranted to be suitable for use in life support, life-critical orsafety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability forinclusion and/or use of NXP Semiconductors products in such equipment orapplications and therefore such inclusion and/or use is at the customer’s own
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Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. NXP Semiconductors makes norepresentation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of theirapplications and products using NXP Semiconductors products, and NXP
Semiconductors accepts no liability for any assistance with applications or
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NXP Semiconductors does not accept any liability related to any default,
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and the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above thosegiven in the Recommended operating conditions section (if present) or theCharacteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
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No offer to sell or license — Nothing in this document may be interpreted
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the grant, conveyance or implication of any license under any copyrights,
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Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of thisdocument, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a priorauthorization from competent authorities.
Suitability for use in non-automotive qualified products — Unless
this document expressly states that this specific NXP Semiconductors
product is automotive qualified, the product is not suitable for automotive
use. It is neither qualified nor tested in accordance with automotive testingor application requirements. NXP Semiconductors accepts no liability forinclusion and/or use of non-automotive qualified products in automotive
equipment or applications.
In the event that customer uses the product for design-in and use inautomotive applications to automotive specifications and standards,
customer (a) shall use the product without NXP Semiconductors’ warrantyof the product for such automotive applications, use and specifications, and(b) whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
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Translations — A non-English (translated) version of a document, including
the legal information in that document, is for reference only. The English
version shall prevail in case of any discrepancy between the translated andEnglish versions.

Security — Customer understands that all NXP products may be subject tounidentified vulnerabilities or may support established security standards or
specifications with known limitations. Customer is responsible for the designand operation of its applications and products throughout their lifecycles
to reduce the effect of these vulnerabilities on customer’s applications
and products. Customer’s responsibility also extends to other open and/or
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applications. NXP accepts no liability for any vulnerability. Customer should
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Customer shall select products with security features that best meet rules,
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concerning its products, regardless of any information or support that may beprovided by NXP.
NXP has a Product Security Incident Response Team (PSIRT) (reachable
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release to security vulnerabilities of NXP products.
NXP B.V. — NXP B.V. is not an operating company and it does not distributeor sell products.

Licenses
Purchase of NXP ICs with NFC technology — Purchase of an NXP
Semiconductors IC that complies with one of the Near Field Communication(NFC) standards ISO/IEC 18092 and ISO/IEC 21481 does not convey animplied license under any patent right infringed by implementation of any of
those standards. Purchase of NXP Semiconductors IC does not include alicense to any NXP patent (or other IP right) covering combinations of those
products with other products, whether hardware or software.

Trademarks
Notice: All referenced brands, product names, service names, andtrademarks are the property of their respective owners.
NXP — wordmark and logo are trademarks of NXP B.V.
DESFire — is a trademark of NXP B.V.
MIFARE — is a trademark of NXP B.V.

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TablesTab. 1.
Tab. 2.
Tab. 3.
Tab. 4.
Tab. 5.
Tab. 6.
Tab. 7.
Tab. 8.

Key differences between MIFARE DESFire
generations ........................................................5
Quick reference data .........................................7
Ordering information ..........................................8
Secure messaging commands overview ......... 15
Memory and configuration management
commands overview ........................................15
Key management commands overview ...........15
Application management commands
overview .......................................................... 16
File management commands overview ........... 16

MF3D_H_X3_SDS

Product short data sheet

Tab. 9.
Tab. 10.
Tab. 11.
Tab. 12.
Tab. 13.
Tab. 14.
Tab. 15.
Tab. 16.
Tab. 17.

Data management commands overview ......... 17
Transaction management commands
overview .......................................................... 17
ISO/IEC 7816-4 support commands
overview .......................................................... 17
Virtual Card commands overview ....................18
Proximity Check commands overview .............18
Originality Check commands overview ............18
Limiting values ................................................ 19
Abbreviations ...................................................22
Revision history ...............................................24

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FiguresFig. 1.
Fig. 2.
Fig. 3.

Evolution of MIFARE DESFire .......................... 2
MIFARE DESFire EV3 IC block diagram .........10
MIFARE DESFire EV3 product-based
application and file structure ........................... 11

MF3D_H_X3_SDS

Product short data sheet

Fig. 4.
Fig. 5.

Package outline SOT500-2 (MOA4) ................20
Package outline SOT500-4 (MOA8) ................21

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Contents
1
1.1
1.2
2
2.1
2.1.1
2.1.2
2.1.3
2.1.4
2.1.5
2.1.6
2.2
3
4
5
6
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
8
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
8.11
9
10
11
12
13

General description ......................................... 1
Introduction ........................................................ 1
Evolution of MIFARE DESFire products
family ..................................................................1
Features and benefits ..................................... 3
Feature overview ............................................... 3
RF interface: ISO/IEC 14443 Type A .................3
Non-volatile memory ..........................................3
NV-memory organization and multiapplication support ............................................ 3
Security and Privacy ..........................................3
ISO/IEC 7816 compatibility ................................4
Special features .................................................4
Summary of key differences between
MIFARE DESFire generations ........................... 5
Applications ..................................................... 6
Quick reference data ....................................... 7
Ordering information .......................................8
Block diagram ................................................ 10
Functional description .................................. 11
Introduction ...................................................... 11
Contactless energy and data transfer .............. 12
Anti-collision .....................................................12
UID/serial number ............................................12
Memory organization ....................................... 13
Available file types ...........................................13
Security ............................................................ 13
DESFire command set .................................. 15
Secure Messaging Commands ........................15
Memory and Configuration Management
Commands .......................................................15
Key Management Commands ......................... 15
Application Management Commands .............. 16
File Management Commands ..........................16
Data Management Commands ........................17
Transaction Management Commands ............. 17
ISO/IEC 7816-4 Standard Commands .............17
Virtual Card Commands .................................. 18
Proximity Check Commands ........................... 18
Originality Check Commands .......................... 18
Limiting values ...............................................19
Package outline ............................................. 20
Abbreviations ................................................. 22
References ......................................................23
Revision history .............................................24
Legal information ...........................................25

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Date of release: 11 January 2024
Document identifier: MF3D_H_X3_SDS