85NTPOLYIMIDE NONWOVEN ARAMID LAMINATEAND PREPREG
85NT is a pure polyimide laminate and prepreg system (Tg =250°C), reinforced with a non-woven aramid substrate. Thissystem combines the high-reliability features of polyimide(improved PTH reliability and temperature stability) with the low
in-plane (x,y) expansion and outstanding dimensional stability of anon-woven aramid reinforcement.

Features:• Low in-plane (x,y) expansion of 6-9 ppm/°C allows attachment of
SMT devices with minimal risk of solder failure joint failure due toCTE mismatch• Nonwoven aramid reinforcement provides outstanding
dimensional stability and enhanced registration for improved
multilayer yields.
• Decomposition temperature of 426°C, compared with 300-360°C
for typical high-performance epoxies, offering outstanding
high-temperature lifetime performance• Polymeric reinforcement results in PCBs typically 25% lighterin weight than conventional glass-reinforced laminates• Laser and plasma ablatable for high speed formation of
microvias and other features as small as 25µm
• Electrical and mechanical properties meeting the requirements ofIPC-4101/53• Compatible with lead-free processing• RoHS/WEEE compliant

Typical Applications:•Military and commercial avionics, missiles and missile defense,
satellites, and other high-reliability SMT applications requiring
low in-plane (x,y) CTE values•

PCBs that are subjected to high temperatures during processing,such as lead-free soldering•

Applications with significant lifetimes at elevated temperatures, such as
aircraft engine instrumentation, on-engine applications, orindustrial sensors

Typical Properties:
Property

85NT
Units

Value

Test Method-3.6

IPC TM-650 2.5.5.3
IPC TM-650 2.5.5.9-0.014

IPC TM-650 2.5.5.3

1. Electrical Properties
Dielectric Constant (may vary with Resin %)@ 1 MHz@ 1 GHz
Dissipation Factor@ 1 MHz@ 1 GHz
Volume Resistivity
C96/35/90
E24/125
Surface Resistivity
C96/35/90-IPC TM-650 2.5.5.9

MΩ-cm
MΩ-cm

2.0 x 108
1.4 x 108

IPC TM-650 2.5.17.1
IPC TM-650 2.5.17.1

MΩ

6.0 x 108

IPC TM-650 2.5.17.1

MΩ

9.0 x 107

IPC TM-650 2.5.17.1

Volts/mil (kV/mm)kVsec

1000 (39.4)

IPC TM-650 2.5.6.2
IPC TM-650 2.5.6
IPC TM-650 2.5.1°C°C

250

IPC TM-650 2.4.24
IPC TM-650 2.4.25

Initial
5%
T260
T288
T300
CTE (x,y)CTE (z)< Tg°C°C
minminminppm/°C

393
426>60>60>606-9

IPC TM-650 2.3.41
IPC TM-650 2.3.41
IPC TM-650 2.4.24.1
IPC TM-650 2.4.24.1
IPC TM-650 2.4.24.1
IPC TM-650 2.4.41

ppm/°C93

IPC TM-650 2.4.24> Tg
z-axis Expansion (50-260ºC)

ppm/°C%

279
2.3

IPC TM-650 2.4.24
IPC TM-650 2.4.24

Peel Strength to Copper (1 oz/35 micron)
After Thermal Stress
At Elevated Temperatures
After Process Solutions
Young’s Modulus
Flexural Strength
Tensile Strength

lb/in (N/mm)
lb/in (N/mm)
lb/in (N/mm)
Mpsi (GPa)kpsi (MPa)kpsi (MPa)

4.3 (0.8)
4.3 (0.8)
3.9 (0.7)
2.3 (16)34 (234)
6.5 (114)

IPC TM-650 2.4.8
IPC TM-650 2.4.8.2
IPC TM-650 2.4.8
IPC TM-650 2.4.18.3
IPC TM-650 2.4.4
IPC TM-650 2.4.18.3

Compressive Modulus
Poisson’s Ratio (x, y)

kpsi (MPa)-E24/125
Electrical Strength
Dielectric Breakdown
Arc Resistance1602. Thermal Properties
Glass Transition Temperature (Tg)
TMADSC
Decomposition Temperature (Td)

3. Mechanical Properties

ASTM D-695
ASTM D-3039

4. Physical Properties
Water Absorption (0.062”)
Specific Gravity
Thermal Conductivity
Flammability

%
g/cm3
W/mK
class

0.6
1.37
0.2
n/a

IPC TM-650 2.6.2.1
ASTM D792 Method A
ASTM E1461
UL-94

Results listed above are typical properties, provided without warranty, expressed or implied, and without liability. Properties may vary, depending on design and application. Arlon reserves
the right to change or update these values.

Availability:
Arlon PartNumber

Glass Style

Resin %

Mil/Ply

Flow %

85NT147

E210491.7885NT247

E220493885NT347

E230

49

3.88

Recommended Process Conditions:
Process inner-layers through develop, etch, and strip using standard industry practices. Usebrown oxide on inner layers. Adjust dwell time in the oxide bath to ensure uniform coating.
Bake inner layers in a rack for 60 minutes at 225°F - 250°F (107°C - 121°C) immediately
prior to lay-up. Vacuum desiccate the prepreg for 8 - 12 hours prior to lamination.
Lamination Cycle:1)

Pre-vacuum for 30 - 45 minutes

2)

Control the heat rise to 8°F - 12°F (4°C - 6°C) per minute between 150°F and 250°F (65°C and121°C)
Panel Size

Pressureincm

psikg/sq cm

12 x 1240 x 40

2501712 x 1840 x 46

300

2116 x 18

30 x 46350

2518 x 24

46 x 61

400273)

Product temperature at start of cure = 425°F (218°C).

4)Cure time at temperature = 3.0 hours

5)

Cool down under pressure at ≤ 10°F/min (6°C/min)Drill at 350-400 SFM. Undercut bits are recommended for vias 0.023” (0.9cm) and smaller
De-smear using alkaline permanganate or plasma with settings appropriate for polyimide;
plasma is preferred for positive etchback
Conventional plating processes are compatible with 85NT
Standard profiling parameters may be used; chip breaker style router bits are not recommended
Bake for 1 - 2 hours at 250°F (121°C) prior to solder reflow or HASL

85NT
Optimal processing requirements may vary depending on specific equipment and operating conditions. These recommendations are offered only as a starting point.

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Rev 1.0

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