RS845X

36V, 8MHz Rail-to-Rail Output
CMOS Operational Amplifier
1 FEATURES

3 DESCRIPTIONSHIGH GAIN BANDWIDTH: 8MHzThe RS845X families of products offer high voltage

INPUT OFFSET VOLTAGE: ±0.5mV (Typical)(36V) operation and rail-to-rail output, as well as

QUIESCENT CURRENT: 3mA/Amp

excellent speed/power consumption ratio, providing anRail to Rail Output

excellent bandwidth (8MHz) and slew rate of 5V/us. The

Supply Range: +5V to +36V

op-amps are unity gain stable and feature an ultra-lowSPECIFIED UP TO +125°C

input bias current.

Micro SIZE PACKAGES: SOP8, MSOP8,SOP14, TSSOP14

The input can operate normally within the negativepower rail to 2V below of the positive power rail. TheRS845X families of operational amplifiers are specified

2 APPLICATIONSSENSORSPHOTODIODE AMPLIFICATIONACTIVE FILTERSTEST EQUIPMENTDRIVING A/D CONVERTERS

at the full temperature range of −40°C to +125°C undersingle power supplies of 5V to 36V or dual power
supplies of ±2.5V to ±18V.

Device Information (1)PART NUMBER
RS8452RS8454

PACKAGEBODY SIZE(NOM)

SOP84.90mm x 3.90mm

MSOP83.00mm x 3.00mm

SOP148.65mm x 3.90mm

TSSOP145.00mm x 4.40mm(1) For all available packages, see the orderable addendum at the endof the data sheet.

REV A.4.1

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RS845X
Table of Contents
1 FEATURES ............................................................................................................................................................................... 1
2 APPLICATIONS ...................................................................................................................................................................... 1
3 DESCRIPTIONS ...................................................................................................................................................................... 1
4 Revision History ..................................................................................................................................................................... 3
5 PACKAGE/ORDERING INFORMATION (1) ..................................................................................................................... 46 Pin Configuration and Functions (Top View) .................................................................................................................. 5
7 SPECIFICATIONS ................................................................................................................................................................... 7
7.1 Absolute Maximum Ratings .......................................................................................................................................... 7
7.2 ESD Ratings ...................................................................................................................................................................... 7
7.3 Recommended Operating Conditions ......................................................................................................................... 7
7.4 ELECTRICAL CHARACTERISTICS ............................................................................................................................... 8
7.5 TYPICAL CHARACTERISTICS ....................................................................................................................................108 PACKAGE OUTLINE DIMENSIONS ................................................................................................................................129 TAPE AND REEL INFORMATION ...................................................................................................................................16

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4 Revision History
Note: Page numbers for previous revisions may different from page numbers in the current version.
VERSION

Change Date

Change Item

A.1

2020/12/2

A.2

2021/6/21

A.3

2022/03/16

A.4

2024/01/24

A.4.1

2024/03/01

Initial version completed
1. Fix TSSOP-14 Package mistake in Page 12@A.1 Version
2. Added the value of Input Voltage Noise Density
3. Added the information of package size
Increase the minimum junction temperature
1. Added MSL on Page 7@RevA.3
2. Update ELECTRICAL CHARACTERISTICS
3. Delete SOT23-5 Package
Modify packaging naming

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RS845X
5 PACKAGE/ORDERING INFORMATION (1)Orderable
Device
RS8452XKPackage Type

PinChannel

Op Temp(°C)

SOP882-40°C ~125°C

DeviceMarking (2)RS8452

MSL (3)

Package Qty

MSL3

Tape and Reel,4000

RS8452XM

MSOP882-40°C ~125°C

RS8452MSL3

Tape and Reel,4000

RS8454XP

SOP14

144-40°C ~125°C

RS8454

MSL3

Tape and Reel,4000

RS8454XQTSSOP14144-40°C ~125°C

RS8454

MSL3

Tape and Reel,4000

NOTE:(1) This information is the most current data available for the designated devices. This data is subject to change without notice and revisionof this document. For browser-based versions of this data sheet, refer to the right-hand navigation.
(2) There may be additional marking, which relates to the lot trace code information (data code and vendor code), the logo or theenvironmental category on the device.
(3) MSL, The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications.

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6 Pin Configuration and Functions (Top View)
RS8452OUT A

1-IN A

2+IN A

3V-

4+

A
B+

8V+

7OUTB

6-IN B

5+IN B

SOP8/MSOP8
Pin Description
NAME

PIN
SOP8/MSOP8

I/O (1)DESCRIPTION

-INA

2I

Inverting input, channel A+INA

3I

Noninverting input, channel A

-INB

6I

Inverting input, channel B+INB

5I

Noninverting input, channel B

OUTA

1OOutput, channel A

OUTB

7O

V-

4-V+

8-Output, channel B
Negative (lowest) power supply or ground (for single supplyoperation)
Positive (highest) power supply(1) I = Input, O = Output.

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Pin Configuration and Functions (Top View)
RS8454
14OUT D

13-IN D

312+IN D

V+

411V-+IN B

510+IN C-IN B

69-IN COUT B

78OUT COUT A

1-IN A

2+IN A

A- +D+ -- +B+ C

SOP14/TSSOP14

Pin Description
NAME

PIN
SOP14/TSSOP14I/O (1)DESCRIPTION

-INA

2I

Inverting input, channel A

+INA

3I

Noninverting input, channel A

-INB

6I

Inverting input, channel B

+INB

5I

Noninverting input, channel B

-INC

9I

Inverting input, channel C

+INC

10I

Noninverting input, channel C

-IND

13I

Inverting input, channel D

+IND

12I

Noninverting input, channel D

OUTA

1O

Output, channel A

OUTB

7OOutput, channel B

OUTC

8O

Output, channel COUTD

14O

V-

11-

V+4-

Output, channel D
Negative (lowest) power supply or ground (for singlesupply operation)
Positive (highest) power supply(1) I = Input, O = Output.

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RS845X
7 SPECIFICATIONS
7.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted) (1)MIN
Supply, VS=(V+) - (V-)
Voltage

Current-0.7

36

Signal input pin (2)(V-)-0.2(V+) +0.2

Signal output pin (3)(V-)-0.2(V+) +0.2

V-1010mASignal output pin (3)

-100

100mA

Package thermal impedance (5)Temperature

UNIT

Signal input pin (2)Output short-circuits (4)θJAMAX

Continuous
SOP8110

MSOP8170

SOP14105TSSOP1490

Operating range, TA

-40

125

Junction, TJ (6)-40150Storage, Tstg

-55

150°C/W°C(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond thosespecified is not implied.
(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.2V beyond the supply rails should
be current-limited to 10mA or less.
(3) Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.2V beyond the supply rails
should be current-limited to ±100mA or less.
(4) Short-circuit to ground, one amplifier per package.
(5) The package thermal impedance is calculated in accordance with JESD-51.
(6) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (T J(MAX) - TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.

7.2 ESD Ratings
The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.
VALUE
V(ESD)

Electrostatic discharge

Human-body model (HBM)±5000

Machine Model (MM)±200

UNITV(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

ESD SENSITIVITY CAUTION
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its publishedspecifications.

7.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
MIN
Supply voltage，VS= (V+) - (V-)

NOM

MAX

Single-supply

536

Dual-supply

±2.5

±18

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7.4 ELECTRICAL CHARACTERISTICS(At TA = +25C, VS=5V to 36V, RL = 10kΩ connected to VS/2, and VOUT = VS/2, VCM = VS/2, Full (9) = -40C to 125C, unlessotherwise noted.) (1)
PARAMETERCONDITIONS

TJ

RS845XMIN(2)

TYP(3)

MAX(2)UNITS

POWER SUPPLYVSOperating Voltage Range

25C

IQ

Quiescent Current Per
Amplifier

PSRR

Power-Supply Rejection
Ratio

VS=5V to 36V

Vos

Input Offset Voltage

VCM= VS/2

Vos TcInput Offset Voltage
Average Drift

IB

Input Bias Current (4) (5)VCM=0V

IOS

Input Offset Current (5)VCM=0V

VCM

Common-Mode Voltage
Range

VS= ±18V

CMRR

Common-Mode Rejection
Ratio

VS= ±2.5V,
VCM=(V-) to (V+)-2V
VS= ±18V,
VCM=(V-) to (V+)-2V

Open-Loop Voltage Gain
Output Swing

VS=±2.5V, Io=0mA
VS=±18V, Io=0mA

525C

36
3.0

4.75

3.8

5.75

25C

93

110

25C-3±0.5VmAdB

INPUT
Full

±1.3

Full

±525C

10

Full

600

25C

10Full600

25C(V-)

25C

70

25C70

RL=10KΩ,
VO=(V-)+0.6V to (V+)-0.6V

25C

84

Full

70

VS=±18V, RL=10KΩ25C

3mVμV/C6060(V+)-2pA
pA
V

110dB

OUTPUT
AOL
VOHVOLISC
CLOAD

100dB

17.85

V-17.85

V

Short-circuit current (6) (7)25C±100mA

Capacitive load drive25C70pF

25C

5V/μs

25C

8MHz

25C

1.0μs

25C

1.0μs

25C

10μs

±55

FREQUENCY RESPONSE
SRSlew Rate (8)GBW

Gain-Bandwidth ProducttS

Settling Time,0.01%tOR

Overload Recovery TimetON

Turn On Time

G=+1, CL=70pF
VS=±2.5V, G=+1, CL=70pF,
Step=2V
VIN·Gain≥VS, G=11NOISEEnInput Voltage Noisef = 0.1Hz to 10Hz,
VS=±2.5V

25C7μVppen

Input Voltage NoiseDensity

f = 1KHz25C35nV/√Hz8 / 17

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RS845X
NOTE:(1) Electrical table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using statisticalquality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may varyover time and will also depend on the application and configuration.
(4) Positive current corresponds to current flowing into the device.
(5) This parameter is ensured by design and/or characterization and is not tested in production.
(6) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (T J(MAX) - TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.
(7) Short circuit test is a momentary test.
(8) Number specified is the slower of positive and negative slew rates.
(9) Specified by characterization only.

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RS845X
7.5 TYPICAL CHARACTERISTICS
NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
At TA = +25C, VS=±18V, RL = 10kΩ connected to VS/2, VOUT = VS/2, unless otherwise noted.

Gain
Phase80706050403020100-20100

1K

10K

100K

1M

RS8452790

Phase Margin (°)

Open-Loop Gain(dB)

1008110

Quiescent Current(mA)

1206543210-1010M

048Frequency(Hz)Input

2024283236

VOUT

10V/div

0V

10V/div

VIN

2V/div

VIN

2V/div

0V

Input
OutputVS=±18V
G=11Output

VOUT

1us/div

1us/div

Figure 3. POSITIVE OVERVOLTAGE RECOVERY

Figure 4. NEGATIVE OVERVOLTAGE
RECOVERY

Input
OutputInput
OutputVS=±18V
G=+1
CL=100PF

50mV/div

50mV/div

VS=±18V
G=+1
CL=0PF

16Figure 2. SUPPLY VOLTAGE vs QUIESCENTCURRENT

Figure 1. OPEN-LOOP GAIN AND PHASE vsFREQUENCY
VS=±18V
G=1112

Supply Voltage(V)1us/div

1us/div

Figure 5. SMALL SIGNAL STEP RESPONSE

Figure 6. SMALL SIGNAL STEP RESPONSE
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RS845X
TYPICAL CHARACTERISTICS
NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
At TA = +25C, VS=±18V, RL = 10kΩ connected to VS/2, VOUT = VS/2, unless otherwise noted.

2V/div

2V/div

Input
OutputVS=±18V
G=+1
CL=0PF

Input
OutputVS=±18V
G=+1
CL=100PF

10us/div

10us/div

Figure 8. LARGE SIGNAL STEP RESPONSE

Figure 7. LARGE SIGNAL STEP RESPONSE
201052uV/div

Output Voltage(V)150-5-10-15-20
020406080

100 120 140 160

1s/div

Output Current(mA)

Figure 10. 0.1Hz TO 10Hz NOISE at Vs=5V

Figure 9. Output Voltage Swing vs Output
Current

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RS845X
8 PACKAGE OUTLINE DIMENSIONSMSOP8 (3)be

EE14.81.02
D

0.65

0.41

RECOMMENDED LAND PATTERN (Unit: mm)

A2c
A
A1L

θ

Dimensions In Millimeters

Dimensions In Inches

MinMaxMinMax

A (1)

0.820

1.100

0.032

0.043

A1

0.020

0.150

0.001

0.006

A2

0.750

0.950

0.030

0.037

b0.250

0.380

0.010

0.015

c

0.090

0.230

0.004

0.009

D (1)

2.900

3.100

0.114

Symbol

0.650(BSC) (2)

e

0.122
0.026(BSC) (2)

E (1)

2.900

3.100

0.114

0.122

E1

4.750

5.050

0.187

0.199

L

0.400

0.800

0.016

0.031

θ

0°

6°

0°6°NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

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RS845X
SOP8 (3)
be

5.2
E

E1

2.2
D

1.27

0.6

RECOMMENDED LAND PATTERN (Unit: mm)

A2c

A

A1

L

θ

Dimensions In Millimeters

Dimensions In Inches

MinMaxMinMaxA (1)

1.350

1.750

0.053

0.069

A10.100

0.250

0.004

0.010

A2

1.350

1.550

0.053

0.061

b0.3300.5100.013

0.020

c

0.170

0.250

0.007

0.010

D (1)

4.800

5.000

0.189

Symbol1.270(BSC) (2)

e

0.197
0.050(BSC) (2)

E

5.800

6.200

0.228

0.244

E1 (1)

3.800

4.000

0.150

0.157

L

0.400

1.270

0.016

0.050

θ

0°

8°

0°

8°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

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RS845X
SOP14 (3)eb

5.2

E E11.270.6D
1.27

RECOMMENDED LAND PATTERN (Unit: mm)

A2

Ac

A1θ
L

Dimensions In Millimeters

Dimensions In Inches

MinMaxMinMax

A (1)

1.350

1.750

0.053

0.069

A1

0.100

0.250

0.004

0.010

A2

1.350

1.550

0.053

0.061

b0.310

0.510

0.012

0.020

c

0.100

0.250

0.004

0.010

D (1)

8.450

8.850

0.333

Symbol1.270(BSC) (2)

e

0.348
0.050(BSC) (2)

E

5.800

6.200

0.228

0.244

E1 (1)

3.800

4.000

0.150

0.157

L

0.400

1.270

0.016

0.050

θ0°

8°

0°

8°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

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RS845XTSSOP14 (3)

eb

5.6

E1 E

1.78
D

0.65

0.42

RECOMMENDED LAND PATTERN (Unit: mm)

A2
A

A1SymbolHCθ

L

Dimensions In Millimeters

Dimensions In Inches

MinMinMaxA (1)

Max

1.200

0.047

A10.050

0.150

0.002

0.006

A20.800

1.050

0.031

0.041

b0.1900.300

0.0070.012

c0.090

0.200

0.004

0.008

D (1)

4.860

5.100

0.191

0.201

E (1)

4.300

4.500

0.169

0.177

E1

6.250

6.550

0.246

0.650(BSC) (2)

eL

0.500

Hθ

0.700

0.020

0.25(TYP)
1°

0.258
0.026(BSC) (2)0.028
0.01(TYP)

7°

1°

7°

NOTE:
1. Plastic or metal protrusions of 0.15mm maximum per side are not included.
2. BSC (Basic Spacing between Centers), "Basic" spacing is nominal.
3. This drawing is subject to change without notice.

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RS845X
9 TAPE AND REEL INFORMATIONREEL DIMENSIONSTAPE DIMENSION

Reel
DiameterReel Width(W1)

DIRECTION OF FEEDNOTE: The picture is only for reference. Please make the object as the standard.

KEY PARAMETER LIST OF TAPE AND REEL
SOP8Reel
Diameter
13’’

Reel Width
W1(mm)
12.4

A0(mm)
6.40

B0(mm)
5.40

K0(mm)
2.10

P0(mm)
4.0

P1(mm)
8.0

P2(mm)
2.0

W(mm)
12.0

Pin1
Quadrant
Q1

MSOP813’’

12.4

5.20

3.30

1.50

4.0

8.0

2.0

12.0

Q1

SOP1413’’

16.4

6.60

9.30

2.10

4.0

8.0

2.016.0

Q1

TSSOP14

13’’

12.4

6.95

5.60

1.20

4.0

8.0

2.0

12.0

Q1

Package TypeNOTE:
1. All dimensions are nominal.
2. Plastic or metal protrusions of 0.15mm maximum per side are not included.

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RS845X
IMPORTANT NOTICE AND DISCLAIMER
Jiangsu RUNIC Technology Co., Ltd. will accurately and reliably provide technical and reliability data (including
data sheets), design resources (including reference designs), application or other design advice, WEB tools, safety
information and other resources, without warranty of any defect, and will not make any express or implied
warranty, including but not limited to the warranty of merchantability Implied warranty that it is suitable for aspecific purpose or does not infringe the intellectual property rights of any third party.
These resources are intended for skilled developers designing with RUNIC products You will be solely
responsible for: (1) Selecting the appropriate products for your application; (2) Designing, validating and testing
your application; (3) Ensuring your application meets applicable standards and any other safety, security or otherrequirements; (4) RUNIC and the RUNIC logo are registered trademarks of RUNIC INCORPORATED. All
trademarks are the property of their respective owners; (5) For change details, review the revision history
included in any revised document. The resources are subject to change without notice. Our company will not beliable for the use of this product and the infringement of patents or third-party intellectual property rights dueto its use.

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