84N
Polyimide Prepreg
84N is a high performance ceramic-filled polyimide
prepreg based on Arlon’s 85N pure polyimide
system, designed for use in filling etched areas
in polyimide multilayers that contain thick copper
layers and for filling clearance holes in metal cores.
The ceramic filler in the resin serves to reduceshrinkage and inhibit crack formulation during
through-hole drilling in filled clearance areas.

Features:• High Tg polyimide (>250°C) with Thermal Decomposition
temperature (Td) >400°C and T300>60 minutes• Low Z-axis expansion of 1% between 50-250°C offers superior
PTH reliability through manufacture, assembly and in-service• Decomposition temperature of 407°C, compared with 300-360°C
for typical high-performance epoxies, offering outstanding
long- term high-temperature performance• Electrical and mechanical properties meeting the requirementsof IPC-4101/40 and /41• Toughened, ceramic filled chemistry resists resin fracturing• Halogen-free chemistry• Ideal for lead-free processing• RoHS/WEEE compliant

Typical Applications:• MLB’s that are designed with clearance holes in metal cores orfor thick metal power and ground planes that require the thermal
stability of polyimide• Applications requiring significant lifetimes at elevatedtemperatures, such as aircraft engine instrumentation, downhole drilling, under-hood automotive applications industrial
sensor systems and burn-in testing of IC’s.

84N
Typical Properties:Property

1. Electrical Properties
Dielectric Constant@ 1 MHz@ 1 GHz
Dissipation Factor@ 1 MHz@ 1 GHz
Volume Resistivity
C96/35/90
E24/125
Surface Resistivity
C96/35/90
E24/125
Electrical Strength
Dielectric Breakdown
Arc Resistance2. Thermal Properties
Glass Transition Temperature (Tg)
TMA
DSC
Decomposition Temperature (Td)
Initial
5%T260
T288
T300
CTE (X,Y)CTE (Z)< Tg> Tgz-axis Expansion (50-260ºC)
3. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)
After Thermal Stress
At Elevated Temperatures
After Process Solutions
Young’s Modulus
Flexural Strength
Tensile Strength
Poisson’s Ratio
4. Physical Properties
Water Absorption (0.062”)
Specific Gravity
Thermal Conductivity
Flammability

Units

Value

Test MethodPrepreg @ 67% RC-4.03.8

IPC TM-650 2.5.5.3
IPC TM-650 2.5.5.9

-0.01
N/A

IPC TM-650 2.5.5.3
IPC TM-650 2.5.5.9

MΩ-cm
MΩ-cm

1.5 x 108
3.0 x 108

IPC TM-650 2.5.17.1
IPC TM-650 2.5.17.1

MΩ
MΩ
Volts/mil (kV/mm)
kV
sec

1.6 x 109
1.6 x 108
1200 (39.3)

IPC TM-650 2.5.17.1
IPC TM-650 2.5.17.1
IPC TM-650 2.5.6.2
IPC TM-650 2.5.6
IPC TM-650 2.5.1

°C
°C

250

IPC TM-650 2.4.24
IPC TM-650 2.4.25

°C°C
min
min
min
ppm/°C

387
407>60>60>60
14-16

IPC TM-650 2.3.41
IPC TM-650 2.3.41IPC TM-650 2.4.24.1
IPC TM-650 2.4.24.1
IPC TM-650 2.4.24.1
IPC TM-650 2.4.41

ppm/°Cppm/°C%

48150
1.0

IPC TM-650 2.4.24
IPC TM-650 2.4.24
IPC TM-650 2.4.24

lb/in (N/mm)
lb/in (N/mm)
lb/in (N/mm)
Mpsi (GPa)Kpsi (MPa)
Kpsi (MPa)-7.1 (1.2)
7.1 (1.2)
7.1 (1.2)
3.0

IPC TM-650 2.4.8
IPC TM-650 2.4.8.2
IPC TM-650 2.4.8
IPC TM-650 2.4.18.3

0.15

ASTM D-3039%g/cm3
W/mK
class

0.3
1.65
0.25
HB

IPC TM-650 2.6.2.1
ASTM D792 Method A
ASTM E1461
UL-94

140Results listed above are typical properties, provided without warranty, expressed or implied, and without liability. Properties may vary, depending on design and application. Arlon reserves theright to change or update these values.

Availability:
Arlon
Part Number

Glass Style

Resin %

NominalFlow (%)

PressedThickness

84N0675-HF
84N0680-HF

106
106

75
80

45
450.0014”
0.0015”

Recommended Process Conditions:
84N is recommended for etched areas in copper layers and clearance holes, and the high resin flow on the 84N
is designed to flow Arlon
readily into the holes. The nominal pressed thicknessof the glassplus resin that will be left
NominalPressedGlass Style
Resin %Part
Flow to(%)
after flow-out into
theNumberholes may vary depending on the density of holes
be filled.Thickness
It is recommended that
84N0675-HF
75 at least two
45plies of 84N 0.0014”
to ensure maximum
effectiveness of the106
hole-filling process,be used on each side of
the material to be84N0680-HF
filled (more may be neededfor thicker80systems), backed
ply of standard 85N
106
45 up by a single0.0015”
1080 or 106 to serve as a hydraulic medium to drive the filled resin into clearance and via holes.
NOTE: the 84N0675HF grade has reduced resin content to provide a lower pressed thickness. Customer
should use the 84N0680HF grade for most applications as the lower resin grade may be marginal in hole fillfor many applications.
Lamination Cycle:

Panel Size

Pressure

Pressure/29˝ Vacuum

incm
psi
kg/cm2psi
kg/cm212 x 1840 x 46275
1920014.01) Pre-vacuum for 30 - 45 minutes
16 x 1830 x 46
350
25250
17.5x 24x 61(8°F - 12°F)
400per minute282) Control the heat18
riseto 4°C 46- 6°C
between 65°C300
and 121°C 21.0
(150°F and 250°F).

Vacuum lamination is preferred. Start point vacuum lamination pressures are shown in the table below:
Panel Sizein
12 x 18
16 x 18
18 x 24cm
40 x 46
30 x 4646 x 61

Pressure

psi
275
350
400

Pressure/29˝ Vacuum

kg/cm2
192528psi
200
250
300kg/cm2
14.0
17.521.03) Set cure temperature at 218˚C (425˚F). Start cure time when product temperature = 213˚C (415˚F)4) Cure time at temperature = 120 minutes5) Cool down under pressure at ≤ 5°C/min (10°F/min)Drill at 350 SFM. Undercut bits are recommended for vias 0.018” (0.045 cm) and smaller.
De-smear using alkaline permanganate or plasma with settings appropriate for polyimide;
plasma is preferred for positive etchback
Conventional plating processes are compatible with 84NStandard profiling parameters may be used; chip breaker style router bits are not recommended
Bake for 1 - 2 hours at 121°C (250°F) prior to solder to reflow of HASL

84NArlon Electronic Substrates… Challenge Us
For samples, technical assistance, customer service or for more
information, please contact Arlon Materials for Electronics Divisionat the following locations:

NORTH AMERICA:

SOUTHERN CHINA:

Arlon LLC
Electronic Substrates
9433 Hyssop Drive
Rancho Cucamonga, CA 91730
Tel: (909) 987-9533
Fax: (909) 987-8541

Arlon LLC
Room 601, Unit 1, Bldg 6
Liyuan, Xincun Shahe
Shenzhen, China 518053
Tel: (86) 755-269-066-12
Fax: (86) 755-26910475

Arlon LLC
Microwave Materials
1100 Governor Lea Road
Bear, DE 19701
Tel: (800) 635-9333
Outside U.S. & Canada: (302) 834-2100
Fax: (302) 834-2574

NORTHERN CHINA:NORTHERN EUROPE:
Arlon LLC
44 Wilby Avenue
Little Lever
Bolton, Lancashire BL31QE
United Kingdom
Tel: (44) 120-457-6068
Fax: (44) 120-479-6463

Arlon LLC
Room 11/401, No. 8
Hong Gu Road
Shanghai, China 200336
Tel/Fax: (86) 21-6209-0202
SOUTHERN EUROPE:
Arlon LLC
6 cours des Juilliottes
94700 Maisons-Alfort France
Phone : (33) 1 84 23 41 51
Fax: (33) 9 55 62 43 26

www.arlon-med.com
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