85N
Polyimide Laminate and Prepreg
85N is the ultimate polyimide and laminate andprepreg system for PWB’s requiring resistanceto high temperature, both in process and inend-use application. Bromine-free chemistry provides
Best-in-Class thermal
withsustainedstability for

highapplicationsin-use temperatures aswell as for use in lead-free soldering applications.

Features:• Polyimide with the best thermal performance, including Tg greaterthan 250°C, decomposition temperature >400°C, and T300>60 min.
• Low Z-axis expansion of 1.2% between 50-260°C (vs. 2.5-4.0% fortypical high-performance epoxies) offering superior PTH reliability
through process and in-service• Low Z-axis expansion minimizes the risk of latent PTH defects
caused during solder reflow and device attachment.
• Decomposition temperature of 407°C, compared with 300-360°C
for typical high-performance epoxies, offering outstanding longterm high-temperature performance• Electrical and mechanical properties meeting the requirements ofIPC-4101/40 and /41• Toughened chemistry resists resin fracturing• Halogen-free chemistry• Compatible with lead-free processing• RoHS/WEEE compliant

Typical Applications:• PCBs that are subjected to high temperatures during processing,such as lead-free soldering, HASL, IR Reflow• Applications with significant lifetimes at high temperatures, suchas aircraft engine instrumentation, down hole drilling, under-hood
automotive controls, burn-in boards,or industrial sensors

85N
Typical Properties:
Property

1. Electrical Properties
Dielectric Constant @ 1 MHz@ 16 GHz
Dissipation Factor @ 1 MHz@ 16 GHz
Volume Resistivity
C96/35/90
E24/125
Surface Resistivity
C96/35/90
E24/125
Electrical Strength
Dielectric BreakdownArc Resistance2. Thermal Properties
Glass Transition Temperature (Tg)
TMADSC
Decomposition Temperature (Td)
Initial
5%
T260
T288
T300
CTE (X,Y)CTE (Z)< Tg> Tgz-axis Expansion (50-260ºC)
3. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)
After Thermal Stress
At Elevated Temperatures
After Process Solutions
Young’s Modulus
Flexural Strength
Tensile Strength
Poisson’s Ratio
4. Physical Properties
Water Absorption (0.062”)
Specific Gravity
Thermal Conductivity
Flammability

Units

Value

Test Method——

4.2
4.4
0.01
N/A

IPC TM-650 2.5.5.3

MΩ-cm
MΩ-cm

1.5 x 10830 x 109

IPC TM-650 2.5.17.1
IPC TM-650 2.5.17.1

MΩ
MΩ
Volts/mil (kV/mm)
kV
sec

1.6 x 109
1.6 x 109
1450 (57.1)>40
143

IPC TM-650 2.5.17.1
IPC TM-650 2.5.17.1
IPC TM-650 2.5.6.2
IPC TM-650 2.5.6
IPC TM-650 2.5.1

˚C
˚C

250

IPC TM-650 2.4.24
IPC TM-650 2.4.25

˚C
˚Cmin
min
min
ppm/˚C

387
407>60>60>60
16

IPC TM-650 2.3.41
IPC TM-650 2.3.41
IPC TM-650 2.4.24.1
IPC TM-650 2.4.24.1
IPC TM-650 2.4.24.1
IPC TM-650 2.4.41

ppm/˚Cppm/˚C%

55149
1.2

IPC TM-650 2.4.24
IPC TM-650 2.4.24
IPC TM-650 2.4.24

lb/in (N/mm)
lb/in (N/mm)
lb/in (N/mm)
Mpsi (GPa)kpsi (MPa)kpsi (MPa)

7.1 (1.2)
7.1 (1.2)
7.1 (1.2)
3.2

0.15

IPC TM-650 2.4.8
IPC TM-650 2.4.8.2
IPC TM-650 2.4.8
IPC TM-650 2.4.18.3
IPC TM-650 2.4.4
IPC TM-650 2.4.18.3
ASTM D-3039

0.27
1.60.2HB

IPC TM-650 2.6.2.1ASTM D792 Method A
ASTM E1461
UL-94%
g/cm3
W/mKclass

IPC TM-650 2.5.5.9

Results listed above are typical properties, provided without warranty, expressed or implied, and without liability. Properties may vary, depending on design and application. Arlon reserves the right tochange or update these values.

Availability:Arlon
Part Number

Glass Style

Resin %

Scaled Flow
Hf (mils)

Scaled Flow
∆H (mils)

85N0672
85N8063
85N2355
85N2650
Arlon
85N2840PartNumber106
1080
2313
2116
GlassStyle7628

72635550
Resin40 %1.7 ± 0.3
2.4 ± 0.3
3.4 ± 0.3
4.1 ± 0.3
Scaled Flow
6.6(mils)± 0.3
Hf0.75 ± 0.20
0.75 ± 0.20
0.75 ± 0.20
0.75 ± 0.20
Scaled Flow
0.70(mils)± 0.20∆H

85N067210672
1.7 ± 0.3
0.75 ± 0.20
85N80631080
632.4 ± 0.3
0.75 ± 0.20
Recommended
Process Conditions:
85N23552313
55
3.4 ± 0.3
0.75 ± 0.20
Process inner-layers through develop, etch, and strip using standard industry practices. Use brown oxide
85N26502116
504.1 ± 0.30.75 ± 0.20on inner layers. Adjust dwell time in the oxide bath to ensure uniform coating. Bake inner layers in a rack for
85N28407628
406.6 ± 0.3
0.70 ± 0.2060 minutes at 107°C - 121°C (225°F - 250°F) immediately prior to lay-up. Store prepreg at 60-70°F at orbelow 30% RH. Vacuum desiccate the prepreg for 8 - 12 hours prior to lamination.
Lamination Cycle:Size1) Pre-vacuum for 30 Panel- 45 minutes

Pressure

Pressure/29˝ Vacuumin to 4°C - 6°C
cm (8°F - 12°F)
psiper minutekg/cm2) Control the heat rise
between 65°C psi
and121°Ckg/cm(150°F and 250°F).
12x18
40x46275
19200
14.0
Vacuum lamination is preferred. Start point vacuum lamination pressures are shownin the table below:
216 x 18
18 x 2430 x 4646 x 61

350
400

25
28in
12 x 18
16 x 18
18 x 24cm
40 x 46
30 x 4646 x 61

psi
275
350
400kg/cm2
1925
28

Panel Size

Pressure2

250300

17.5
21.0

psi
200
250
300

kg/cm2
14.0
17.5
21.0

Pressure/29˝ Vacuum3) Set cure temperature at 218˚C (425˚F). Start cure time when product temperature = 213˚ (415˚F)4) Cure time at temperature = 120 minutes5) Cool down under pressure at ≤ 5°C/min (10°F/min)Drill at 350 SFM. Undercut bits are recommended for vias 0.018” (0.045cm) and smaller
De-smear using alkaline permanganate or plasma with settings appropriate for polyimide;
plasma is preferred for positive etchback
Conventional plating processes are compatible with 85N
Standard profiling parameters may be used; chip breaker style router bits are not recommended
Bake for 1 - 2 hours at 250°F (121°C) prior to solder to reflow of HASL85N

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