35N
Polyimide Laminate and Prepreg
35N is a pure polyimide laminate and prepreg
system for applications requiring high temperature
performance. High Tg (250°C) results in lowZ-direction expansion for resistance to PTH failure
during PWB processing, and minimizes risk of latent
PTH defects in-service. Reduced temperature andtime to cure offers improved throughput compared
to traditional polyimide cycles.

Features:• Tg greater than 250°C• UL recognized as UL-94 V-1• Low Z-axis of 1.1% between 50-260°C (vs. 2.5-4.0%
for typical high-performance epoxies).
• Low Z-axis expansion minimizes the risk of latent PTH defects
caused during solder reflow and device attachment• Decomposition temperature of 407°C (vs. 300-360°C fortypical high-performance epoxies) offer outstanding long-termhigh-temperature performance• Electrical and mechanical properties meeting the requirements ofIPC-4101/40 and /41• Toughened, chemistry resists resin fracturing• Ideal for lead-free processing• RoHS/WEEE compliant

Typical Applications:• PCBs that are subjected to high temperatures during processing,such as lead-free soldering, HASL, IR Reflow• Applications with significant lifetimes at high temperatures, suchas aircraft engine instrumentation, down hole drilling, under-hood
automotive controls, burn-in boards, or industrial sensors

35N
Typical Properties:
Property

1. Electrical Properties
Dielectric Constant@ 1 MHz@ 1 GHz
Dissipation Factor@ 1 MHz@ 1 GHz
Volume Resistivity
C96/35/90
E24/125
Surface Resistivity
C96/35/90
E24/125
Electrical Strength
Dielectric Breakdown
Arc Resistance2. Thermal Properties
Glass Transition Temperature (Tg)
TMADSC
Decomposition Temperature (Td)
Initial5%T260
T288
T300
CTE (X,Y)CTE (Z)< Tg> Tgz-axis Expansion (50-260ºC)
3. Mechanical Properties
Peel Strength to Copper (1 oz/35 micron)
After Thermal Stress
At Elevated Temperatures
After Process Solutions
Young’s Modulus
Flexural Strength
Tensile Strength
Poisson’s Ratio
4. Physical Properties
Water Absorption (0.062”)
Specific Gravity
Thermal Conductivity
Flammability

Units

Value

Test Method

Multilayer ~ 50% RC
Multilayer ~ 50% RC

4.2
4.0

IPC TM-650 2.5.5.3
IPC TM-650 2.5.5.9

-0.01
N/A

IPC TM-650 2.5.5.3
IPC TM-650 2.5.5.9

MΩ-cm
MΩ-cm

1.5 x 108
1.2 x 108

IPC TM-650 2.5.17.1
IPC TM-650 2.5.17.1

MΩ
MΩ
Volts/mil (kV/mm)
kV
sec

5.0 x 108
3.7 x 108
1400 (55.9)

IPC TM-650 2.5.17.1
IPC TM-650 2.5.17.1
IPC TM-650 2.5.6.2
IPC TM-650 2.5.6
IPC TM-650 2.5.1

°C
°C

>250

IPC TM-650 2.4.24
IPC TM-650 2.4.25

°C°C
min
min
min
ppm/°C

363
407>60>601116

IPC TM-650 2.3.41
IPC TM-650 2.3.41
IPC TM-650 2.4.24.1
IPC TM-650 2.4.24.1IPC TM-650 2.4.24.1
IPC TM-650 2.4.41

ppm/°Cppm/°C%

5115.8
1.2

IPC TM-650 2.4.24
IPC TM-650 2.4.24
IPC TM-650 2.4.24

lb/in (N/mm)
lb/in (N/mm)
lb/in (N/mm)
Mpsi (GPa)kpsi (MPa)kpsi (MPa)-6.3 (1.1)
6.3 (1.1)
6.0 (1.1)
4.3 (29.6) / 3.8 (26.2)
69 (476 / 36.3 (250)0.15 / 0.15

IPC TM-650 2.4.8
IPC TM-650 2.4.8.2
IPC TM-650 2.4.8
IPC TM-650 2.4.18.3
IPC TM-650 2.4.4
IPC TM-650 2.4.18.3
ASTM D-3039%g/cm3
W/mk
class

0.26
1.60.2
V-0

IPC TM-650 2.6.2.1
ASTM D792 Method A
ASTM E1461
UL-94

165

Results listed above are typical properties, provided without warranty, expressed or implied, and without liability. Properties may vary, depending on design and application. Arlon reserves theright to change or update these values.

Availability:Arlon
Part Number

Glass Style

Resin %

Scaled Flow
Hf (mils)

Scaled Flow
∆H (mils)

35N0672
35N8063
35N2355
35N2650
35N2840
Arlon

106
1080
2313
2116
7628

72
63555040

1.7 ± 0.3
2.4 ± 0.3
3.4 ± 0.3
4.1 ± 0.3
6.6 ± 0.3
ScaledFlow0.55 ± 0.20
0.55 ± 0.20
0.55 ± 0.20
0.55 ± 0.20
0.55 ± 0.20
ScaledFlowPart Number

Glass Style

Resin %

Hf (mils)∆H (mils)

35N067210672
1.7 ± 0.3
0.55 ± 0.20
35N80631080
632.4±0.3
0.55 ± 0.20
Recommended Process Conditions:
35N23552313
55
3.4 ± 0.3
0.55 ± 0.20
Process inner-layers through develop, etch, and strip using standard industry practices. Use brown oxide on
35N26502116
504.1 ± 0.30.55 ± 0.20
inner layers. Adjust dwell time in the oxide bath to ensure uniform coating. Bake inner layers in a rack for 60
35N28407628
40
6.6 ± 0.30.55 ± 0.20

minutes at 107°C - 121°C (225°F - 250°F) immediately prior to lay-up. Store prepreg at 16˚C - 21˚C (60-70°F)
at or below 30% RH. Vacuum desiccate the prepreg for 8 - 12 hours prior to lamination.
Lamination Cycle:
Panel Size1) Pre-vacuum for 30 - 45 minutesPressurePressure/29˝ Vacuumincm
psikg/cm2psikg/cm22) Control the heat12rise
to 4°C 40- 6°C
and 121°C 14.0
(150°F and 250°F).
x 18x 46(8°F - 12°F)
275per minute19between 65°C200
Vacuum lamination
Start point 350
vacuum laminationpressuresare shown17.5
in the table below:
16 x is18preferred.
30 x 4625250
18 x 2446 x 61
400
28300
21.0
Panel Sizein
12 x 18
16 x 18
18 x 24cm
40 x 46
30 x 4646 x 61

Pressure

psi
275
350
400

Pressure/29˝ Vacuum

kg/cm2
192528psi
200
250
300kg/cm2
14.017.521.03) Set cure temperature at 213˚C (415˚F). Start cure timer when product temperature reaches 210˚C (410˚F)4) Cure time at temperature = 90 minutes
NOTE: For sequential lamination use 60 minutes for the first lamination and 90 minutes for the final.
5) Drill at 350 SFM. Undercut bits are recommended for vias 0.018” (0.045cm) and smaller
De-smear using alkaline permanganate or plasma with settings appropriate for polyimide;
plasma is preferred for positive etchback
Conventional plating processes are compatible with 35NStandard profiling parameters may be used; chip breaker style router bits are not recommended
Bake for 1 - 2 hours at 121°C (250°F) prior to solder reflow or HASL

35N

Arlon Electronic Substrates… Challenge Us
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