PRODUCTS GUIDEWe make the world measurably better.
For over 100 years, CoorsTek has been perfecting the process ofengineering advanced ceramics.
We are prepared to apply expertise to the toughest engineering
challenges around the world.
Much like the materials we work with, CoorsTek is versatile andendlessly extendible. we work with our customers to develop
tomorrow’s technology for just about
every industry in the global economy.
We don’t simply deliver high-quality products.
We partner to deliver solutions that make the world
measurably better.

ContentsSemiconductor Related Products• Carbon Susceptors• SiC Wafer Boats• Photomask Substrates• Alumina Plasma Etcher Parts• Yttria Plasma Etcher Parts• Silicon Focus Rings• Silicon Susceptors• SiC Polishing Plates3• In-line Gas Filters “CEPURE”• Vacuum-Break Filters

FPD Related Products6• Large Scale Photomask Substrates

General Industrial Products• Fused Silica Refractories• SiC Heat-resistant Structural Parts• SiC Setters & Saggers

7• Quartz Carbon Heaters “QCH-HEATER”• Foundry Filters “FLOW-RITE”

Automotive, Electric & Mechanical Products

9• Carbon Brushes• Ceramic Balls “CERBEC”

Bio and Medical Related Products

10• Ceramic Bone Substitutes

Main Material Line-up

11Semiconductor
Related Products
CoorsTek GK develops and manufactures a variety of products
made of inorganic materials such as quartz glass, graphite, siliconcarbide, single crystal silicon and fine ceramics, all of which areindispensable to the production of semiconductor devices.
CoorsTek GK maintains a large market share for many products
related to semiconductor manufacturing, a position we achievedby providing high-quality products that contribute to the higher
integration and improved productivity of semiconductor devices
and by utilizing our unique high-purity material andhigh-precision machining technologies.

Carbon Susceptors
SEMICONDUCTOR MANUFACTURING PROCESS

Silicon ingot
pulling

Slicing/
Polishing

Epitaxial
growthOxidation/
Deposition

Lithography

EtchingIon
implantaton/
Sputtering

Wafer
testing

DicingAssemblyFinaltesting

Wafer
testing

DicingAssemblyFinaltesting

Wafer
testing

DicingAssemblyFinaltesting

APPLICATION : Wafer carriers for epitaxial growth processing
M A T E R I A L : High-purity SiC coated graphite “CLEAR CARBON”
FUNCTIONS / FEATURES

High purity
Controllability of temperature distribution on wafer■ Excellent high temperature durability■■SiC Wafer BoatsSEMICONDUCTOR MANUFACTURING PROCESS

Silicon ingot
pulling

Slicing/
Polishing

Epitaxial
growthOxidation/
Deposition

Lithography

EtchingIon
implantaton/
Sputtering

APPLICATION : Wafer carriers for diﬀusion and LP-CVD processing
M A T E R I A L : High-purity silicon impregnated silicon carbide “TPSS”
FUNCTIONS / FEATURES

High purity
High temperature stability (up to 1350℃)■ Less particle generation■ Certified by major furnace manufacturers■■Photomask Substrates
SEMICONDUCTOR MANUFACTURING PROCESS

Silicon ingot
pulling

Slicing/Polishing

Epitaxial
growthOxidation/
Deposition

Lithography

EtchingIon
implantaton/
Sputtering

APPLICATION : Photomasks for lithography processing
M A T E R I A L : High-purity synthetic silica glass
FUNCTIONS / FEATURESWorld's most popular substrates for lithography processing, including ArF
Superior UV transmittance■ Superior ArF laser durability■ Low birefringence■■3 PRODUCTS GUIDEAlumina Plasma Etcher Parts
SEMICONDUCTOR MANUFACTURING PROCESS

Silicon ingot
pulling

Slicing/
Polishing

Epitaxial
growthOxidation/
Deposition

Lithography

EtchingIon
implantaton/
Sputtering

Wafer
testing

DicingAssemblyFinaltestingIon
implantaton/
Sputtering

Wafer
testing

DicingAssemblyFinaltestingIon
implantaton/
Sputtering

Wafer
testing

DicingAssemblyFinaltestingIon
implantaton/
Sputtering

Wafer
testing

DicingAssemblyFinaltesting

APPLICATION : Elements for plasma etching processing
M A T E R I A L : High-purity translucent alumina “SAPPHAL”
FUNCTIONS / FEATURESExtremely high purity (≧99.9%)
Larger grain size and translucency■ Excellent electrical properties (LLT)■■Yttria Plasma Etcher Parts
SEMICONDUCTOR MANUFACTURING PROCESS

Silicon ingotpulling

Slicing/
Polishing

Epitaxial
growthOxidation/
Deposition

Lithography

Etching

APPLICATION : Elements for plasma etching processing
M A T E R I A L : High-purity yttria “EXYRIA”
FUNCTIONS / FEATURES

Excellent plasma durability
High purity■ Large size production (up to Φ550mm)■■

Silicon Focus Rings
SEMICONDUCTOR MANUFACTURING PROCESS

Silicon ingot
pulling

Slicing/
Polishing

Epitaxial
growthOxidation/
Deposition

Lithography

Etching

APPLICATION : Focus rings for plasma etching processing
M A T E R I A L : High-purity single crystal silicon
FUNCTIONS / FEATURES

High purity
Surface damage removed by acid etching■ Very low risk of particle generation in use■ Large size production (up to Φ510mm)■■Silicon Susceptors
SEMICONDUCTOR MANUFACTURING PROCESS

Silicon ingot
pulling

Slicing/
Polishing

Epitaxial
growthOxidation/
Deposition

Lithography

Etching

APPLICATION : Wafer carriers/adjusters for various processing
M A T E R I A L : High-purity single crystal silicon
FUNCTIONS / FEATURES

High purity
Surface damage removed by acid etching■ Very low risk of particle generation in use■ Large size production (up to Φ510mm)■■

PRODUCTS GUIDE 4

SiC Polishing Plates
SEMICONDUCTOR MANUFACTURING PROCESS

Silicon ingot
pulling

Slicing/
Polishing

Epitaxial
growthOxidation/
Deposition

Lithography

EtchingIon
implantaton/
Sputtering

Wafer
testing

DicingAssemblyFinaltesting

Wafer
testing

DicingAssemblyFinaltesting

Wafer
testingDicing

AssemblyFinaltesting

APPLICATION : Surface plates for wafer polishing
M A T E R I A L : Sintered silicon carbide “CERASIC”
FUNCTIONS / FEATURES

Exclusive bonding technology
Large size production■ Precise green body machining■■

In-line Gas Filters “CEPURE”
SEMICONDUCTOR MANUFACTURING PROCESS

Silicon ingot
pulling

Slicing/
Polishing

Epitaxial
growthOxidation/
Deposition

Lithography

EtchingIon
implantaton/
Sputtering

APPLICATION : In-line gas filters for various processing
M A T E R I A L : Porous alumina (filter element), stainless steel, nickel & PTFEFUNCTIONS / FEATURES■■

Superior gas displacement characteristics
High corrosion resistance

Vacuum-Break Filters
SEMICONDUCTOR MANUFACTURING PROCESS

Silicon ingot
pulling

Slicing/
Polishing

Epitaxial
growthOxidation/
Deposition

Lithography

EtchingIon
implantaton/
Sputtering

APPLICATION : Diffusers for vacuum chamber (loadlock, process, etc.)
M A T E R I A L : Porous alumina / Porous silica
FUNCTIONS / FEATURES

Prevention of dust dispersion
Reduction of venting time
■ High corrosion resistance■■5 PRODUCTS GUIDEFPD Related ProductsDue to the enlargement of flat panel displays (FPD) and theglass substrates that are one of their main components,
technologies required for FPD production have beenadvancing. As higher technical levels have become necessary
for manufacturing FPD glass substrates, CoorsTek GK’s
products for FPD glass substrate manufacturing are able tomeet these requirements with our unique high-purity material
and high-precision machining technologies for large scaleproducts.

Large Scale Photomask Substrates
APPLICATION : Photomasks for LCD manufacturing
M A T E R I A L : High-purity synthetic silica glass
FUNCTIONS / FEATURES

Low thermal expansion
Superior transmittance in broad wavelength spectrum■ High purity and high homogeneous■ Large size production (up to 1220x1400mm)■■PRODUCTS GUIDE 6

General Industrial Products
CoorsTek GK develops and manufactures a wide range ofproducts made of inorganic materials for use in manyindustries with extreme environments that require high heat
resistance, corrosion resistance, abrasion resistance and/orcleanliness by using in-depth knowledge and an abundance ofknow-how with materials such as silicon carbide and quartz
glass.

Fused Silica Refractories
APPLICATION : Elements of glass melting furnace
M A T E R I A L : Fused silica refractory “GLASSUN”
FUNCTIONS / FEATURES

Extremely low thermal expansion
Low thermal conductivity■ Complicated and very large size production(up to 2000x3000x200mm)■■

SiC Heat-resistant Structural Parts
APPLICATION : Radiant tubes, heat exchange tubes, etc.
M A T E R I A L : Sintered silicon carbide “CERASIC”
FUNCTIONS / FEATURESLong size production (up to 2350mm)
High heat resistance and thermal conductivity■ Excellent chemical and corrosion resistance■ Long life■■

SiC Setters & Saggers
APPLICATION : Kiln furniture for electric parts
M A T E R I A L : Recrystallized silicon carbide
FUNCTIONS / FEATURES

Excellent creep resistance and thermal shock resistanceEexcllent temperature followability caused by low heat capacity andhigh thermal conductivity■ Also available with prasma spray coating■■

7 PRODUCTS GUIDEQuartz Carbon Heaters “QCH-HEATER”
APPLICATION : Various rapid, clean and partial heating
M A T E R I A L : Quartz glass & carbon wire
FUNCTIONS / FEATURES

High-speed heating (reduction of heating time)Long-life (reduction of running costs)■ Clean and non-contact source of energy■■Foundry Filters “FLOW-RITE”
APPLICATION : Foundry filters for iron, aluminum and steel
M A T E R I A L : A kind of mullite
FUNCTIONS / FEATURES

Excellent hot strength
Stable filtration performance■ Applicable to various sizes of casting, from small to large■■< Manufactured by CoorsTek, Inc. (USA) >PRODUCTS GUIDE 8

Automotive, Electric &Mechanical Products
CoorsTek GK develops and manufactures automotive, electricand mechanical products whose users require materials withspecial functions not realized by metal or resin parts.

Carbon Brushes
APPLICATION : Brushes for DC electric motors
M A T E R I A L : Carbon & copper
FUNCTIONS / FEATURES■■

Lead-free and silica-freeStable quality by high productivity manufacturing process

Ceramic Balls “CERBEC”
APPLICATION : High-temperature and high-speed bearings
M A T E R I A L : Silicon nitride
FUNCTIONS / FEATURES

Harder and stiffer
High corrosion and electrical resistance■ Light weight and low thermal expansion■ Smooth surface and accurate geometry■■< Manufactured by CoorsTek, Inc. (USA) >9 PRODUCTS GUIDEBio and Medical Related
Products
As bio and medical needs increase with a rapidly aging
society, CoorsTek GK has been developing and manufacturing
bio and medical related products with our advanced materialand porous medium forming technology.

Ceramic Bone Substitutes
APPLICATION : Artifical bones for orthopedic surgery
M A T E R I A L : 3D-interconnected porous structure hydroxyapatite
FUNCTIONS / FEATURESNew natural bone growing inside
High biocompatibility■ Good machinability■■

PRODUCTS GUIDE 10

Main Material Line-up

Quartz Glass/Silica

High-purity
quartz glass

Quartz glass

High-purity
synthetic
silica glass

Alumina
GLASSUN
Fused silica
refractory

SAPPHAL
High-purity
translucent
alumina

YttriaADS
High-purity
alumina

EXYRIA
High-purity
yttriaAlumina plasma
etcher parts

Lapping plates

Yttria plasma
etcher parts

Photomask
substrates

Fused silica
refractories

2.2

2.2

1.95

3.99

3.9

4.9

105

105

13.1300

350

110----

Typical Products

Bulk Density
Room Temp.

MPaHigh Temp.

MPa3149149

900℃

900℃

Young's Modulus

GPa7272-395

360

170

Poisson's Ratio

-

0.17

0.17-

0.23

0.23

0.30

Vickers HardnessGPa
2(kgf/mm )9.7GPa

9.7GPa

（950）

（950）

Fracture Toughness(KⅠc)(MPa・m )--Coefficient of Thermal
Expansion

x10 /K

ThermalConductivity

Electrical Properties

Thermal Properties

Mechanical Properties

Bending
Strength

g/cm

1/2--

17.7GPa

16GPa

6.1GPa（1770）（1600）

（600）

4.0

4.5

1.2

0.5

0.65

0.4

8.0

7.8

8.2

RT～1000℃

RT～1000℃

RT～1000℃RT～900℃

RT～900℃

RT～900℃

Room Temp. W/(m・K)

1.5

1.4-

3530

14

High Temp. W/(m・K)-

1.02（1000℃）

9（1000℃）

8（1000℃）--6

Thermal ShockResistance Tc

3（900℃）（t2.0mm）

＞1000

＞1000

-

200

220

130

1000

1000

1800

1500

2000

-

10

Max. Use Temperature℃

1100

Electrical Volume
Resistivity℃

10

Dielectric Constant

Ω・cm

3.58

3.58

1MHz

1MHz

Dielectric Loss
(Tan Delta)

18

1.5x10

10-4

1MHz

18

1.5x10--41MHz-

171016161010.1

9.9

12.010GHz

10GHz

13.56MHz-4

1.0x10

10GHz

10GHz1.0x10-3-4

6x10

13.56MHz

These values are typical and should not be considered as specifications. The characteristic values may vary depending on product shape and conditions of use.

11 PRODUCTS GUIDESilicon
High-purity
single crystal
siliconSilicon focus
rings
Siliconsusceptors

Silicon Carbide
TPSS
High-purity silicon
impregnatedsilicon carbide

SiC wafer boats
SiC process
tubes

Boron Carbide

CERASIC
Sinteredsilicon carbide

HE766
Recrystallized
silicon carbide

SiC heat-resistant
structural parts

SiC setters &saggers

Sinteredboron carbide

Blasting nozzlesSiC polishingplatesCarbonHigh-purity
graphite

Carboncrucibles

CLEAR CARBON
High-purity SiC
coated graphite

Carbonsusceptors

Hydroxyapatite
CERAPHITE
Robustand sturdy
carbonCarbon airsliders

3D-interconnected porous
structurehydroxyapatite

Ceramic bone
substitutes

Carbonheaters

2.33

3.0

3.15

2.4

2.52

1.88

-

1.40

0.79

～300

260

450

42

400

40

40

90

4.95

-

----

280

450

40

1200℃

1450℃

1300℃

190

360

420

160

420～460

10-

17-

0.27

0.16

0.18-

0.21

0.12-

0.18-

60Hs

-

100Hs

------

10.6GPa20.4GPa

23.5GPa（1040）（2000）（2300）

-

4.0

3.5-

-

28.6～34.7GPa（2800～3400）
3～5

3.9

4.2

4.5

4.3

4.5

4.8

4.8

3.2

RT～1000℃

RT～1000℃

RT～1000℃

RT～1000℃

RT～1000℃

RT～450℃

RT～450℃

RT～450℃

157

220

170

105

20～40

107

-

-

0.4-

55
（1000℃）

55（1000℃）

---

-

350

450-

-

-

1300

1370

1500

1500

4+1

4

652
（1000℃）

-

-

-1

1-

3000

1500

2000

（inert atmos.）（inert atmos.）（inert atmos.）-3

5.0x10-3--

10 ～1010 ～10-

10 ～10-----------------

2.4x10－1

1.1x10-PRODUCTS GUIDE 12

COOSTEK IN JAPANThe CoorsTek group in Japan is headquartered in Shinagawa-ku, Tokyo, and has five manufacturing
facilities and three sales offices, and is the core business of global CoorsTek group.

CoorsTek GK Oguni Facility(Manufacture of products for semiconductorand general industry)

CoorsTek Machinery Corporation(Planning of machinery and electric equipment)

CoorsTek Tokuyama
Corporation

CoorsTek
GK Tohoku
Branch(Selling CoorsTekGroup products
domesticallywithin Japan)(Manufacture and processing ofquartz glass products)

CoorsTek GK Nagasaki
Facility(Manufacture of productsfor semiconductor, LCDand refractories)

CoorsTek GK Head Office

CoorsTek GK Hatano Facility(R&D, Manufacture of products forsemiconductor and bio & medical)

CoorsTek GK Kariya Facility(Manufacture of products forsemiconductor and environment)

CoorsTek GK Chubu Branch(Selling CoorsTek Group products
domestically within Japan)

CoorsTek GK
Head Oﬃce
Osaki Wiz Tower, 11-1, Ohsaki 2-chome, Shinagawa-ku,
Tokyo 141-0032, Japan
TEL +81-3-5437-8411
FAX +81-3-5437-7395
Chubu Branch1, Minami-Fuji, Ogakie-cho, Kariya City,
Aichi Prefecture 448-8665, Japan
TEL +81-566-21-3507
FAX +81-566-21-3152
Tohoku Branch
5-15, Kamisugi 1-chome, Aoba-ku, Sendai City,
Miyagi Prefecture 980-0011, Japan
TEL +81-22-264-2241
FAX +81-22-264-2242

13 PRODUCTS GUIDEGLOBAL LOCATION
Global Reach, Local Expertise
CoorsTek connects with customers around the globe by leveraging knowledge and resources across
manufacturing facilities and research and development hubs in North America, Europe, and Asia.
With over 6,000 team members worldwide, we collaborate our customers to deliver technicalceramic components across multiple industries. Our legacy of innovation and engineering expertisethe reason we are the world’s leading manufacturer of technical ceramic components and thepartner of choice for our customers.

Corporate Headquarters
Manufacturing Facility
R&D Hub and Manufacturing Facility
Sales OfficeAmericas

EuropeJapan+1 303 271 7100
info@coorstek.com+49 89 5514190
infoeurope@coorstek.com+81 3 5437 8411
japaninfo@coorstek.com

China

Korea

Thailand+86 21 6232 1125
info_shanghai@coorstek.com+82 031 212 9348
koreainfo@coorstek.com+66 33 010886

PRODUCTS GUIDE 14

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