BAS21QA-Q

High-voltage switching diode22 April 2024

Product data sheet

1. General description
High-voltage switching diode, encapsulated in a leadless ultra small DFN1010D-3 (SOT1215)
Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.

2. Features and benefits
•
•
•
•
•
•
•
•

High switching speed: trr ≤ 50 ns
Low leakage current: IR ≤ 100 nA
High reverse voltage: VR ≤ 200 V
Low capacitance: Cd ≤ 2 pF
Ultra small and leadless SMD plastic package
Low package height of 0.37 mm
Suitable for Automatic Optical Inspection (AOI) of solder joint
Qualified according to AEC-Q101 and recommended for use in automotive applications

3. Applications••••

High-speed switching
General-purpose switching
Voltage clamping
Reverse polarity protection

4. Quick reference data
Table 1. Quick reference data
SymbolParameter

Conditions

IF

forward current

Tj = 25 °C

VRMin

TypMaxUnit--330mA

reverse voltage

--200

V

VRRM

repetitive peak reversevoltage--250VVF

forward voltage

IF = 200 mA; tp ≤ 300 µs; δ ≤ 0.02;
Tj = 25 °C--1.25VIR

reverse current

VR = 200 V; pulsed; Tj = 25 °C--100nAtrr

reverse recovery timeIF = 30 mA; IR = 30 mA; RL = 100 Ω;
IR(meas) = 3 mA; Tj = 25 °C

--50

ns

[1]

[1]

Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.

BAS21QA-Q

Nexperia

High-voltage switching diode5. Pinning information
Table 2. Pinning information
PinSymbol
Description
1A

anode

2n.c.

not connected

3K

cathode4Kcathode

Simplified outline

Graphic symbol

3A41K
2n.c.

Transparent top view

aaa-021941

DFN1010D-3 (SOT1215)

6. Ordering information
Table 3. Ordering information
Type numberPackage
BAS21QA-Q

Name

Description

Version

DFN1010D-3

plastic, leadless thermal enhanced ultra thin small outline SOT1215
package with side-wettable flanks (SWF); 3 terminals; 0.75mm pitch; 1.1 mm x 1 mm x 0.37 mm body

7. Marking
Table 4. Marking codes
Type number

Marking code

BAS21QA-Q

X001

MARKING CODE(EXAMPLE)READINGDIRECTION

YEAR DATE
CODE

PIN 1
INDICATION MARKVENDOR CODEREADING EXAMPLE:

MARK-FREE AREA

A 110
aaa-020723

Fig. 1.

DFN1010D-3 (SOT1215) binary marking code description

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High-voltage switching diode8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating Sytem (IEC 60134)
SymbolParameter

Conditions

MinMaxUnit

VRRM

repetitive peak reversevoltage

Tj = 25 °C-250VVR

reverse voltage-200VIFforward current-330mA

IFSM

non-repetitive peak
forward current

tp = 1 µs; square wave; Tj(init) = 25 °C-9A

tp = 100 µs; square wave; Tj(init) = 25 °C-3A

tp = 10 ms; square wave; Tj(init) = 25 °C

-1.7

A-

900mA

[1]-

350mW

[2]-

610mW

[1]IFRM

repetitive peak forwardcurrent

tp ≤ 1 ms; δ ≤ 0.25

Ptot

total power dissipation

Tamb ≤ 25 °C

Tj

junction temperature-150°C

Tambambient temperature

-55

150°C

Tstg

storage temperature-65150°C

[1]
[2]

Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
2
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated mounting pad for cathode 1cm .

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High-voltage switching diode9. Thermal characteristics
Table 6. Thermal characteristics
SymbolParameterRth(j-a)
Rth(j-sp)
[1]
[2]
[3]

Conditions

MinTypMax

Unit

thermal resistance from In free air
junction to ambient[1]--355

K/W

[2]

--

205

K/W

thermal resistance fromjunction to solder point

[3]

--45

K/W

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
2
Device mounted on an FR4 PCB, single-sided copper, tin-plated mounting pad for cathode 1cm .
Soldering point of cathode tab.
aaa-027994

103
duty cycle = 1Zth(j-a)
(K/W)

0.50
102

0.25

0.75
0.33
0.20

0.100.05
100.02

0.01

0
1

10-5

10-4

10-3

10-2

10-1

110102tp (s)

103

FR4 PCB, standard footprint
Fig. 2.

Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
aaa-027995

103
Zth(j-a)(K/W)

duty cycle = 1

102

0.50
0.25

0.75
0.33
0.20

0.10
0.05

10
0.02

0.01

0
1

10-5

10-4

10-3

10-2

FR4 PCB, mounting pad for cathode 1 cm
Fig. 3.

10-1110102tp (s)

103

2

Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

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High-voltage switching diode10. Characteristics
Table 7. Characteristics
SymbolParameterVFforward voltageIRreverse currentConditions

MinTypMax

Unit

IF = 100 mA; tp ≤ 300 µs; δ ≤ 0.02;
Tj = 25 °C--1V

IF = 200 mA; tp ≤ 300 µs; δ ≤ 0.02;
Tj = 25 °C--1.25V

VR = 200 V; pulsed; Tj = 25 °C--100nA

VR = 200 V; pulsed; Tj = 150 °C--100µACd

diode capacitance

VR = 0 V; f = 1 MHz; Tj = 25 °C

--2pF

trr

reverse recovery timeIF = 30 mA; IR = 30 mA; RL = 100 Ω;
IR(meas) = 3 mA; Tj = 25 °C--50

ns006aab212

600

aaa-028237

1IF(A)

IF(mA)

10-1

400
10-2
(2)

200(1)

(3)

00

0.4

0.8

1.2

VF (V)

10-4

1.6(1) Tamb = 150° C(2) Tamb = 85° C(3) Tamb = 25° C(4) Tamb = -40° CFig. 4.

Product data sheet

00.25

0.50

0.75

1.00

1.25

1.50 1.75
VF (V)(1) Tj = 150° C(2) Tj = 85° C(3) Tj = 25° C(4) Tj = -40° C

Forward current as a function of forward
voltage; typical values

BAS21QA-Q(1) (2) (3) (4)

10-3

(4)

Fig. 5.

Forward current as a function of forward
voltage; typical values; (logarithmic scale)All information provided in this document is subject to legal disclaimers.

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BAS21QA-QNexperia

High-voltage switching diode006aab213

102
IR(µA)
10mbg447

1.0(1)

Cd(pF)1(2)

0.8(3)

0.6

10-1
10-2
10-3

0.4

10-4
10-5(4)050

100

150200VR (V)(1) Tamb = 150° C(2) Tamb = 85° C(3) Tamb = 25° C(4) Tamb = -40° C
Fig. 6.

0.2

25002

46VR (V)8f = 1 MHz
Tj = 25 °C
Fig. 7.

Reverse current as a function of reverse
voltage; typical values

Diode capacitance as a function of reverse
voltage; typical values

mbg703102IFSM(A)10110- 1

110102103

tp (µs)104

Based on square wave currents.
Tj(init) = 25 °CFig. 8.

Non-repetitive peak forward current as a function of pulse duration; maximum values

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High-voltage switching diode11. Test informationtr
D.U.T.
RS = 50 ΩIFtpt

10 %+ IFSAMPLING
OSCILLOSCOPEtrrt

Ri = 50 ΩV = VR + IF × RS

mga881

(1)

90 %

VR

input signal

output signal(1) IR = 3 mA
Fig. 9.

Reverse recovery time test circuit and waveforms

Quality information
This product has been qualified in accordance with the Automotive Electronics Council (AEC)
standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use inautomotive applications.

12. Package outline
0.87
0.95
0.75
10.95
1.05

0.22
0.30
20.16
0.24

0.1
30.04
max

0.34
0.40
Dimensions in mm

0.17
0.25

0.245
0.325

1.05
1.15

0.195
0.27513-03-05

Fig. 10. Package outline DFN1010D-3 (SOT1215)

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High-voltage switching diode13. Soldering
Footprint information for reflow soldering of DFN1010D-3 package

SOT12151.2
0.45 (2x)0.3
1.1

0.35 (2x)0.40.25 (2x)

0.75

0.3

0.5

1.5

1.4

0.4

0.5

0.4

0.3

0.5

1.3

0.4

0.3
0.4
0.5
1.3

solder landsolder land plus solder paste

occupied area

solder resist

Dimensions in mmIssue date

12-11-23
13-03-06

sot1215_fr

Fig. 11. Reflow soldering footprint for DFN1010D-3 (SOT1215)

BAS21QA-Q

Product data sheet

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High-voltage switching diode14. Revision history
Table 8. Revision history
Data sheet ID
Release date

Data sheet status

Change notice

Supersedes

BAS21QA-Q v.1

Product data sheet--BAS21QA-Q

Product data sheet

20240422

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High-voltage switching diodeequipment, nor in applications where failure or malfunction of an Nexperia
product can reasonably be expected to result in personal injury, death orsevere property or environmental damage. Nexperia and its suppliers accept
no liability for inclusion and/or use of Nexperia products in such equipment orapplications and therefore such inclusion and/or use is at the customer's own
risk.

15. Legal information
Data sheet status
Document status[1][2]

Productstatus [3]Definition

Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of thisdocument, and as such is not complete, exhaustive or legally binding.

Objective [short]data sheet

Development

This document contains data fromthe objective specification for
product development.

Preliminary [short]data sheet

Qualification

This document contains data fromthe preliminary specification.

Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. Nexperia makes no representation
or warranty that such applications will be suitable for the specified use
without further testing or modification.

Product [short]data sheet

Production

This document contains the productspecification.

[1]
[2]
[3]

Please consult the most recently issued document before initiating orcompleting a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may havechanged since this document was published and may differ in case ofmultiple devices. The latest product status information is available on
the internet at https://www.nexperia.com.

Definitions
Draft — The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result inmodifications or additions. Nexperia does not give any representations or
warranties as to the accuracy or completeness of information included hereinand shall have no liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheetwith the same product type number(s) and title. A short data sheet isintended for quick reference only and should not be relied upon to containdetailed and full information. For detailed and full information see the relevant
full data sheet, which is available on request via the local Nexperia sales
office. In case of any inconsistency or conflict with the short data sheet, thefull data sheet shall prevail.
Product specification — The information and data provided in a Productdata sheet shall define the specification of the product as agreed between
Nexperia and its customer, unless Nexperia and customer have explicitlyagreed otherwise in writing. In no event however, shall an agreement bevalid in which the Nexperia product is deemed to offer functions and qualities
beyond those described in the Product data sheet.

Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, Nexperia does not give any
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or completeness of such information and shall have no liability for theconsequences of use of such information. Nexperia takes no responsibility
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In no event shall Nexperia be liable for any indirect, incidental, punitive,
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Customers are responsible for the design and operation of their applications
and products using Nexperia products, and Nexperia accepts no liability forany assistance with applications or customer product design. It is customer’ssole responsibility to determine whether the Nexperia product is suitableand fit for the customer’s applications and products planned, as well as
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Customers should provide appropriate design and operating safeguards tominimize the risks associated with their applications and products.
Nexperia does not accept any liability related to any default, damage, costs
or problem which is based on any weakness or default in the customer’sapplications or products, or the application or use by customer’s third party
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liability in this respect.
Limiting values — Stress above one or more limiting values (as defined inthe Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above thosegiven in the Recommended operating conditions section (if present) or theCharacteristics sections of this document is not warranted. Constant orrepeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
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sold subject to the general terms and conditions of commercial sale, as
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High-voltage switching diodeContents
1. General description...................................................... 1
2. Features and benefits.................................................. 13. Applications.................................................................. 14. Quick reference data....................................................15. Pinning information......................................................26. Ordering information....................................................27. Marking.......................................................................... 2
8. Limiting values............................................................. 39. Thermal characteristics............................................... 4
10. Characteristics............................................................ 511. Test information.......................................................... 712. Package outline.......................................................... 713. Soldering..................................................................... 814. Revision history..........................................................915. Legal information......................................................10© Nexperia B.V. 2024. All rights reserved

For more information, please visit: http://www.nexperia.com
For sales office addresses, please send an email to: salesaddresses@nexperia.com
Date of release: 22 April 2024

BAS21QA-Q

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