ManualProtoMat S62
English, version 4.0

LPKF Laser & Electronics AG
Osteriede 7
D-30827 Garbsen
Telephone : ++ 49 - 51 31 - 70 95 - 0
Telefax: ++ 49 - 51 31 - 70 95 - 90
eMail
: lpkf@lpkf.de
Homepage : http: //www.lpkf.deCopyright (C) 2005 LPKF AG
No part of this document may be reproduced or transmitted or used forany purpose without the express written permission of LPKF. The
information contained in this document is subject to change without priornotification. LPKF assumes no liability for the use of this document. In
particular for damage resulting from information, which is present, notpresent or erroneous.
Trademarks: HP-GL is a trademark of the Hewlett-Packard Corp.
All other trademarks are the property of the specific proprietor.
Item number: 115808

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Notes on this Manual
The information contained in this document is subject to change without
previous notice. No part of this document may be reproduced ortransmitted for any purposes in any form without express written
permission of LPKF AG. All efforts were made to ensure that thisdocument is as accurate as possible and that the information contained
therein is complete. Nevertheless, LPKF AG cannot assume any liability
for its use or for any violations of patent or other rights held by third
parties resulting there from.
The operator of the machine is responsible for ensuring that thefollowing points are observed. Ensure that• the machine is used only for its intended purpose.
• the machine is operated only in a perfect functional condition andparticularly that the safety equipment is checked regularly forproper function.
• required personal protective equipment for the operating,
maintenance and repair personnel is available and used.
• the operating instructions are always kept at the location where
the machine is operated and are in a legible and complete
condition.
• only sufficiently qualified and authorized personnel operate,service and repair the machine.
• this personnel is trained regularly on all questions regarding labor
safety and environmental protection as well as is familiar with theoperating instructions and particularly the safety precautions
contained therein.
• all safety and warning information attached to the machine is notremoved and remains legible.

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I. Outline
This Manual is subdivided into the following chapters:
1. Introduction
2. Intended use
3. Safety notes
4. Scope of delivery
5. Layout of machine
6. Bringing into service
7. BoardMaster User Surface
8. Introduction to the Basic Functions of the ProtoMat S62
9. BoardMaster Functions
10.Menu Bar
11.Operating procedures
12.Practical tips
13.Other BoardMaster Functions
14.Special Applications
15.Appendix
16.Options
17.Technical Data
18.Declaration of conformity
19.Index

II. Conventions used in this manual
Bold text is used to emphasize important information.
Illustrations are numbered. Example: Fig. 5› Prompts for actions are identified with an arrow.
Italic sections are used to indicate the reactions consequent on anaction.
Word printed in italics mark proper names.
Key inscriptions and menu terms are printed in BOLD CAPITALS.

III. Notes on the symbols used
Danger! This symbol is used to highlight danger to life or health.

Caution! This symbol is used to identify hazards which may cause
damage.

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Note! This symbol is used for notes intended to help you avoid faults inoperation or to help you improve your procedures.

Machine greenhorn:
This symbol indicates important tips and information for those notalready familiar with LPKF milling technology.

IV. Terminology
Copper laminate: Special extremely thin base material used forpressing multilayers.

Base material: Circuit board material coated with copper foil

Solder resist foil

: Special foil with cutouts for solder connections
on a circuit board.

BoardMaster: Machine control software.

CircuitCAM: Software for data processing

V. Target Group
This manual is intended for personnel who already possess basic
knowledge of production of circuit boards for the electronic sector.

VI. Intended Use
The machine described in this manual is intended exclusively for
milling and drilling standard commercial circuit board materials in
the electronic industry. Any other type of use of the machine isexpressly prohibited.

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Contents

1.0 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . 11
2.0 Intended Use . . . . . . . . . . . . . . . . . . . . . . . . 13
3.0 Safety Notes . . . . . . . . . . . . . . . . . . . . . . . . 14
4.0 Scope of Delivery . . . . . . . . . . . . . . . . . . . . 16
4.1 Accessories (available as option). . . . . . . . . . . . . .16

5.0 Layout of Machine . . . . . . . . . . . . . . . . . . . 17
5.1 Initial Setup. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
5.2 Orientation Axis / Positions . . . . . . . . . . . . . . . . . .20
5.3 Machine Components and Connections . . . . . . . .21
5.4 Serial Interface(s) / USB Connection . . . . . . . . . . .22
5.5 Functional Units . . . . . . . . . . . . . . . . . . . . . . . . . . .24
5.5.1 The Machining Head . . . . . . . . . . . . . . . . . . . . . . 24
5.5.1.1 Machining Spindle with Collet . . . . . . . . . . . . . . . . . 25

5.5.2 Working Depth Limiter . . . . . . . . . . . . . . . . . . . . . 25

6.0 Bringing into Service . . . . . . . . . . . . . . . . . 26
6.1 Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
6.1.1 System Prerequisites . . . . . . . . . . . . . . . . . . . . . . 26
6.1.2 Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
6.1.3 Directories Generated During Installation . . . . . . 28

6.2 Installation of the USB driver . . . . . . . . . . . . . . . . .28
6.3 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

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6.3.1 HOME Position and Reference Hole System . . . 29

6.4 Switching On the Circuit Board Plotter . . . . . . . . . .30
6.4.1 Starting BoardMaster. . . . . . . . . . . . . . . . . . . . . . 30
6.4.2 Plotter Ready . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.4.3 Wait Message . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

6.5 Switching Off the Circuit Board Plotter . . . . . . . . . .33

7.0 BoardMaster User Surface . . . . . . . . . . . . 34
7.1 Function Bar . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
7.2 Brief Summary of Function Bar . . . . . . . . . . . . . . .35
7.2.1 Status information . . . . . . . . . . . . . . . . . . . . . . . . 36

8.0 Introduction to the Basic Functions of theProtoMat S62 . . . . . . . . . . . . . . . . . . . . . . . . 38
8.1 Creating a New Reference Hole System . . . . . . . .39
8.2 Preparing and putting on base material . . . . . . . . .40
8.3 Working with Production Data and Phases . . . . . .42

9.0 BoardMaster Functions. . . . . . . . . . . . . . . 50
9.1 Changeable Settings . . . . . . . . . . . . . . . . . . . . . . .50
9.2 Positioning Functions . . . . . . . . . . . . . . . . . . . . . . .50
9.3 Control Functions for Manual Control. . . . . . . . . . .51
9.4 Selection functions . . . . . . . . . . . . . . . . . . . . . . . . .52
9.5 Control Functions for Production Phase. . . . . . . . .53
9.6 Camera Functions (only for S62 with camera option)
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9.7 Tool Holder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54

10.0 Menu Bar . . . . . . . . . . . . . . . . . . . . . . . . . . 56
10.1 Go To Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56
10.2 CONFIGURATION Menu . . . . . . . . . . . . . . . . . . .57
10.2.1 Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . 57
10.2.2 Machine Settings . . . . . . . . . . . . . . . . . . . . . . . . 59
10.2.3 Tool Parameter. . . . . . . . . . . . . . . . . . . . . . . . . . 61
10.2.4 Heads Dialog Box. . . . . . . . . . . . . . . . . . . . . . . . 63
10.2.5 Adjust Camera Offset . . . . . . . . . . . . . . . . . . . . . 64
10.2.6 Phase... - Production Phases. . . . . . . . . . . . . . . 65
10.2.7 Defining the Base Material Size . . . . . . . . . . . . . 67

10.3 File Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69
10.4 Edit Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70
10.4.1 Assigning Tools . . . . . . . . . . . . . . . . . . . . . . . . . 70
10.4.2 Placing Projects . . . . . . . . . . . . . . . . . . . . . . . . . 73
10.4.3 Select Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75

10.5 Reload Dialog Box . . . . . . . . . . . . . . . . . . . . . . . .75
10.6 View Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
10.7 Selecting Production Phase . . . . . . . . . . . . . . . . .78
10.8 Automatic Tool Change . . . . . . . . . . . . . . . . . . . .79

11.0 Operating Procedures . . . . . . . . . . . . . . . 81
11.1 Fastening the Base Material . . . . . . . . . . . . . . . . .81
11.2 The tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .82
11.3 Drilling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .83
11.4 Insulation Milling . . . . . . . . . . . . . . . . . . . . . . . . . .83
11.5 Contour Milling in Circuit Board Material . . . . . . .84
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11.6 Milling Wide Insulation Channels . . . . . . . . . . . . .85
11.7 Cleaning Circuit Boards . . . . . . . . . . . . . . . . . . . .86

12.0 Practical Tips . . . . . . . . . . . . . . . . . . . . . . 87
13.0 Other BoardMaster Functions . . . . . . . . 89
13.1 Learning Fiducial (Option) . . . . . . . . . . . . . . . . . .89
13.1.1 Adjusting Milling Depth . . . . . . . . . . . . . . . . . . . 92
13.1.2 Drilling Reference Holes in Base Material . . . . . 93
13.1.3 Special Features . . . . . . . . . . . . . . . . . . . . . . . . 95
13.1.3.1 Tool box dialog box. . . . . . . . . . . . . . . . . . . . . . . . . 95
13.1.3.2 Service password dialog box . . . . . . . . . . . . . . . . . 96

14.0 Special Applications . . . . . . . . . . . . . . . . 98
14.1 Front Panel Engraving . . . . . . . . . . . . . . . . . . . . .98
14.2 Milling Solder Resist Foils . . . . . . . . . . . . . . . . . .98

15.0 Appendix . . . . . . . . . . . . . . . . . . . . . . . . 100
15.1 Switching over the device voltage . . . . . . . . . . .100
15.2 Maintenance. . . . . . . . . . . . . . . . . . . . . . . . . . . .103
15.2.1 X Axis, Y-Axis and Z Axis . . . . . . . . . . . . . . . . 103
15.2.2 Maintenance on Working Depth Limiter . . . . . 104
15.2.3 Maintenance instruction for Machining Head . 106

15.3 Checking and adjusting the tool positions by meansof the camera . . . . . . . . . . . . . . . . . . . . . . . . . . . .107
15.4 Checking and adjusting tool positions without camera
108
15.5 The Teach-In Dialog Box . . . . . . . . . . . . . . . . . .109

16.0 Options . . . . . . . . . . . . . . . . . . . . . . . . . . 112

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16.1 Installing the camera . . . . . . . . . . . . . . . . . . . . . 112
16.2 Mounting the Vacuum Table . . . . . . . . . . . . . . . . 114
16.3 Spring setting at the machining head . . . . . . . . . 116

17.0 Technical Data . . . . . . . . . . . . . . . . . . . . 118
18.0 Declaration of Conformity . . . . . . . . . . . 119
19.0 Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

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Introduction

1.0 Introduction
The machine described in this manual is a circuit board plotter suitablefor producing circuit board prototypes and engraved films. It consists
basically of a base plate, an X/Y motion system and a machining head.
This machining head can be moved along both axes with the aid of the
X/Y motion system. The machining head can also be lowered. This
results in two basic processing possibilities. First, a channel can bemilled with a milling cutter in a piece of base material fastened to thebase plate by moving the lower machining head.
Second, a hole can be drilled in the base material by lowering themachining head when it is standing still and a drill installed.
This circuit board plotter offers very high precision in machining and highmachining speed. Almost completely automatic processing is possible
due to other special functions like fully automatic tool change and theadjustable depth with which the tool penetrates the base material during
drilling, which can be set via the software. All this helps to minimize theeffort required for operation in small series production. Another special
feature is the integrated vacuum table which enables the processing ofsoft and flexible substrates (special PCB materials).
The machine is controlled and operated almost completely by the
BoardMaster software. Always read this manual carefully before
starting work with the machine. After unpacking, set up your circuitboard plotter on a suitable table (see chapter „Initial Setup“ onpage 17 for a description) and inspect all of the components
described in the following chapters precisely, i.e. familiarize
yourself with the mechanical control possibilities. This will make iteasier when you then start up the machine in combination with thesoftware with the aid of the quick start instructions or the
BoardMaster chapters.
LPKF BoardMaster 5.0 for WindowsTM is a program for automatic controlof HP-GL-compatible LPKF circuit board plotters.
LPKF BoardMaster is capable of reading in, displaying and processing
production data in LMD format (generated in LPKF CircuitCAM) as wellas production data generated in HP-GL format
BoardMaster takes over complete control of the circuit board plotter. The
WYSIWYG (What You See Is What You Get) display for the data to beprocessed, manual control of the circuit board plotter on the Windows
surface as well as the present tool library with all required information
ensures virtually complete automation of circuit board prototype
production.
This Manual shows you the path from LMD/HP-GL circuit board data
generated by CircuitCAM or other programs, over job preparation rightup to completion of the circuit board prototypes with the circuit board
plotter.
The Manual introduces the basic control possibilities of BoardMasterstep by step, allowing you to quickly complete your first circuit board in a
simple manner.
Basic use of the Windows surface is not covered in this manual. If you
are not familiar with the use of the various Windows objects, please firstrefer to your Windows documentation.

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Introduction

In order to ensure that any possible guarantee claims are honored,
always follow the instructions in this manual before starting up themachine. Machines exported to other EU countries are subject to theguarantee terms in that country.
Now we hope you enjoy familiarizing yourself with your circuit board
plotter.

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Intended Use

2.0 Intended Use
The machine described in this manual is exclusively designed andconstructed for the machining of commercially approved materials forthe production of printed circuit boards or front plates. This comprises
especially the following working steps:
Machining of all one-sided and double-sided board types in the usual
packing density (FR3, FR4, FR5, G10), flexible substrates, RF substrates, drilling test adapters, structuring film patterns, producing solder frames for PCB assembly, SMD fine line technology, contour-milling,engraving of front panels or labels, depth milling of rigid or flexible
boards, depaneling and reworking of populated and unpopulatedboards, machining of housings and multilayers up to 8 layers in combination with MiniContac III and MultiPress-II.
Any other use is explicitely forbidden! Danger of damage tomaterial or personal injury, and any guarantee claims are excluded!

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Safety Notes

3.0 Safety Notes
Danger: To ensure safe work with the circuit board plotter, the user
should read this Manual as well as the enclosed documentationand particularly the safety precautions in bold face print!
• Keep your workplace orderly. Disorder at the workplaceincreases the danger of an accident!
• Take surrounding influences into consideration: Do not
subject the electric machine to water or water spray. Do not
use the circuit board plotter in moist or wet surroundings.
Provide for good illumination. Never use the machine inareas endangered by fire or explosion.
• Keep children away from the working area! Ensure thatchildren cannot touch the machine or connection line!
• Wear suitable work clothing! Do not wear wide clothing or
jewelry. This can be caught by moving parts!
• Wear a hair net if you have long hair! Otherwise, your haircan get caught in a rotating tool!
• Care for your machine and the accessories properly andobserve the maintenance instructions! Check the plug andcable regularly and if damaged have replaced by anauthorized electrician!
• Before any type of maintenance or cleaning work on themachine, disconnect the power plug!
• Always be attentive! Observe your work and proceed
rationally. Do not use the machine if you areunconcentrated!
• Always work with the vacuum on! Dusts resulting during
operation of the machine may pose a health hazard andmust therefore be evacuated!
• Check the machine regularly for damage! Ensure that allparts are installed correctly and that all conditions are
fulfilled for proper operation as intended.
• Use only accessories and add-on equipment specified in theoperating instructions or recommended or prescribed by the
manufacturer! Use of other tools or accessories can cause
damage to the machine or pose an injury hazard for theuser!
• Have the machine repaired by authorized personnel! The
circuit board plotter fulfills all applicable safety regulations.
Repair should be performed only by qualified personnel
using genuine parts, because improper repairs can pose an
injury hazard for the user
• Caution when closing the machine hood! Danger of injury tohands!
• Never reach into the machine while it is running!
• Caution! Machine changes motion speed automaticallyduring operation!

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Safety Notes• iChange tools only with the machining head spindle
stopped! Injury hazard!
• When changing tools manually, always insert tool into chuckagainst stop!
• iWhen performing manipulations on the machine, neveroperate the controlling PC simultaneously.
• Never reach into the traversing range of the runningmachine! The XY positioning systeem may move very fast.
Fot this reason the handling also of auxiliary tools in thearea of the base plate is strictly prohibited. Shear force may
e.g. cut of fingers• The safety of the machine can no longer be guaranteed if
modifications are made to the machine by the user and theguarantee is invalidated!
• Observe that some materials can produce carcinogenic dust
or dangerous gases during processing. Obtain informationfrom material suppliers.
• Eating, drinking or smoking while working with the circuitboard plotter is prohibited! The danger exists of ingesting
toxic substances through the mouth! Never leave food orbeverages open in the workroom (dust deposit!).
• When using chemicals, please observe the instructions on
the containers or any separate safety data sheets!
• Wear suitable protection gloves during the exchange ofmaterial of the machine base plate. Danger of cutting due tosharp edges of the metall supports!
• When the cover is opened the present command is executet
and then the machine will stop and no more commands canbe given!

• Ensure that your computer is properly connected to the line
power and to the circuit board plotter!
• Ensure that no one is present in the hazard area of the circuitboard plotter during data transfer between BoardMaster andthe circuit board plotter!
• Ensure that no one can enter the hazard area of the circuitboard plotter and come into contact with the tools during
operating phases controlled by BoardMaster!
• Ensure that it is not possible for unauthorized persons tooperate BoardMaster when working with the circuit board
plotter, for example during manual tool change or alignment of
the base material!
• In the event of an emergency, shut off the circuit board plotter
and PC connected to the circuit board plotter immediately!
• Also observe other safety precautions in this manual!

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Scope of Delivery

4.0 Scope of Delivery• 1 Machine unit LPKF ProtoMat S62 with integrated electronic
circuitry• 1 Connection cable machine - PC (USB or serial)• 1 Set accessories (foot of the working depth limiter, adhesivetape, various Torx tools, 5 reference hole pins, tweezers, brush, 2
red reference hole strips, 2 reference hole drills 2.95 mm, set offuses)• 1 Power cable• 1 Piece base material (fixed on machine base plate)• 1 Manual ProtoMat S62 machine and software BoardMaster• 1 CD ROM with software program BoardMaster• 1 Manual software CircuitCAM• 1 Pre-assembled hood
• 1 UUSB cable (from mid of July 2005 on)• 1 USB repeater (from mid of July 2005 on)

4.1 Accessories (available as option)• 1 Vacuum system with fine mesh filter and integratetd automatic
switch, adjustable exhaust power and automatic filter control. The
vacuum system is switeched on and off via the machining
spindle.
• Danger: The fine filter is required particularly for processing
materials containing fiber glass such as FR4 base material!
Otherwise, the hazard exists of carcinogenic dust particles
escaping!!

• Vision System
Camera-based positioning system for fiducial recognition• LPKF ProConduct
System for through-plating with paste• Vacuum table
System for fixing rigid or flexible materials free from distortion or
warp

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Layout of Machine

5.0 Layout of Machine
5.1 Initial Setup› Lift the cover of the cardboard box (1 in figure below) and remove
the cardboard below› Remove the software package and the manuals.
› Pull the styrofoam parts (3) at the side upward out of the box and lift
the cardboard sidewalls (2) .
› Remove the protective foil.
› Put the circuit board plotter on a horizontal support capable ofbearing the load.
Figure 1: Cardboard packing of theProtoMat S62

1

2

3

4

3

1- Top cover of cardboard machine packing
2- Cardboard sidewalls (or frame)
3-Styrofoam protection at the sides
4- Place for manuals

Note: The machine should be positioned on a level and solid
surface to prevent malfunctions and erroneous operation!
› Remove securing devices (see 1, 2 and 3 in following figure) before
switching on the plotter !!! Also remove any residual glue remaining
on the board.
Caution! Shoud you switch on the plotter without having removed
the transport securing devices first, we will not accept any guarantee claims for resulting damage!!!

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Layout of Machine

Figure 2:Transport sealings

1
2

4

3

› After the removal of all the transport sealings, the foot of the working
depth limiter (4 in figure above, contained in the accessories set
supplied with the delivery) has to be inserted in the working depth
limiter underneath the mill/drill head! To do this, hold the machining
head tight with your other hand!
Note:If the software BoardMaster should already have been started
when the foot is being inserted and should the machining head not
be held firmly, then an error message appears as the machining
head is moving outside of the movement border.
!

Figure 3: ProtoMat S62 with cover

3

1

2

3
4

1- Vacuum hose
2- Machining head3- Tool magazine
4- Movable table to fix base material

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Layout of Machine› Then connect the LPKF ProtoMat machine to the computer (COM 1,
COM 2, or USB) with the Connection cable (Sub-D to RJ45 Connector). Remove the protection covers from the connectors and connect
the RJ45 Connector with socket named“RS232/CAN“ and the SubD Connector to COM1 or COM2 on the PC or the USB cable to the
USB sokket.
› Connect the power cable on the LPKFProtoMat machine to the line
power. To do this, pull the power cable from the backside of themachine to the front until it reaches the main switch.
Figure 4: Mains connection, main
switch, voltage switchover

1

1- Mains connection, main switch and switching the voltage› Screw the vacuum hose in the connecting piece (counter-clockwise)
and attach this to the adapter, see figure below.
Figure 5: Connection vacuum
system1
2
3
1 Exhaust adapter
2 Connecting piecet

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Layout of Machine› Attach the loose vacuum hose over the circuit board plotter to theappropriate connection on the machining head (position 5 in figure 1
on page 17).
› Connect the control cable for the exhaust system on the rear of themachine (see figure 5.3 on page 21)
Note: Please save all transport retainers as well as the packaging
for re-use if the machine is transported again.

5.2 Orientation Axis / Positions
The machining head can move along 3 axes. These axes are called theX, Y and Z axes. Definition of the axes is important for you during
operation so that you always know where the table is moving. In the
BoardMaster software, the motion paths are described exclusively
according to these axis designations.
Figure 6: Orientation axis

X-AxisZ-Axis2
3
1

Y-AxisZ-Axis: Lifting/lowering the machining head
1- Pause position:
The machine is moved to this point to install or turn the material to be processed2- HOME position
3- Zero position:
The macine is moved to this point after switching on (machining head on the left, table to thefront).

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Layout of Machine

5.3 Machine Components and Connections
Description of the front view:
Figure 7: Front view
LPKF ProtoMatS62

1
2
3
4
5

1- Hood
2- Vacuum hose
3-Machining head

4- Tool magazine
5- Displaceable machine table

Description of rear view:
Figure 8: Rear view, connections

13

1

3 4

2

1- Mains cable
2- Connecting cable camera - PC (option)
3-Status display „Ready for operation“
4- USB cable

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6

7

8

5- Serial connection (RS232/CAN connection socket
6-Connection hood
7-Control cable for vacuum system
8- Ports 1 to 421

Layout of Machine

In the following figure you see how tools are placed in the tool magazine.
For the order and the exact position of the tools please refer to thecorresponding recommendation in the BoardMaster chapter:
Figure 9: Tools in tool magazine

5.4 Serial Interface(s) / USB Connection
The SERIAL1 is connected to a serial interface of the computer bymeans of the supplied null modem cable.
Wiring of the connecting cable is as follows:

The cable screening protection is connected only on the side of the PC(socket).
The following parameters must be observed:
Baud rate:

57600

Parity:None

Data bit:

8

Stop bit:1

Flow control (Windows XP):

Hardware

FIFO-buffer:on (max. speed)Note: the serial interface at the PC is configured under Windows in
the system control.

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Alternatively the connection can be done using the USB connection.
Connect the USB cable with the USB sockets of the circuit board plotter
and the PC. The optional camera can only be connected to a USB 2.0
port.
Note: USB can only be used via the LPKF USB repeater! For the
installation of the USB driver see „Installation of the USB driver“ onpage 28
Figure 10:Block diagram USB
connection

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5.5 Functional Units
5.5.1 The Machining Head
The machining head has several tasks. It provides the guidance andmounting for• the spindle• the stepping motor for the automatic milling depth adjustment• the camera for fiducial recognition (option)
Moreover, the working depth limiter is located at the bottom of themachining head. It limits to which depth the drilling or milling tool
penetrates the base material.
Figure 11: Machining head front
view

1

8

2
3
4
5

6

9

7

10
1- Vacuum hose
2- Mounting plate for exhaust hose andcable hose
3- Camera option: holding block forcamera4- Camera option: aperture and focus
setting of the camera
5- Camera option: mounting plate forexhaust hose and cable hose

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6- Camera option: camera illumination
7- Milling depth limiter (foot)8- Spring adjusmtent pressure force
9- Connection head illumination
10- Knurled screw for adjusting the milling depth

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5.5.1.1 Machining Spindle with Collet
The machining spindle drives the machining tools, while the collet is
responsible for their firm and precise location. The collet is firmly
mounted on the machining spindle and from the outside only the tool
opening can be seen (1 in following figure).

1

With this circuit board plotter the collet of the machining spindle is actuated automatically.

5.5.2 Working Depth Limiter
Danger! During work, keep your fingers away from the travel area ofthe machine!

During the milling of isolation channels in the often slightly bent PCB
materials it is of special importance that the milling depth is kept
constant. The LPKF ProtoMat S62 achieves this by means of themechanical or manual scanning using the working depth limiter.
Moreover, the working depth limiter enables the improved removal of themilling dust.
Figure 12: Working depth limiter

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6.0 Bringing into Service
This chapter describes the switching-on procedure of your circuit board
plotter. Some operating steps are explained with the help of theBoardMaster software. Therefore it is necessary that you install thissoftware first on the PC with which the circuit board plotter is to becontrolled. Connect the circuit board plotter to the corresponding
PC (see „Initial Setup“ on page 17) and install the BoardMaster
software on the corresponding PC (see following chapter)!
Observe the specified temperature range for operation of 15-25°C(59-77°F)!

6.1 Installation
6.1.1 System Prerequisites
The minimum system prerequisites for installation of BoardMaster are:• Pentium Processor 1500 MHz or faster• 256 MB main memory (512 MBytes recommended)• XGA graphic card (recommended display resolution 1024 x 768
pixels)• Microsoft Windows 2000/XP• 16 x CD ROM drive, DVD-drive is recommended for optional DVD
for training• RS 232 interface and USB 2.0 for camera option
BoardMaster requires approx. 40 MB of free hard disk capacity for
installation.

6.1.2 Installation
As soon as you have inserted the CD in the PC drive and if the autostart
function of this drive is activated, the CD browser will start automatically.
Its menu guidance will lead you through the installation of the LPKF programs.
If autostart is not activated on your PC, start the CD browser by doubleclicking on the file SETUP.EXE.

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Figure 13: Component selection

During installation, the appropriate initialization files are assigned to
BoardMaster by selection of the circuit board plotter. The setup
initialization files (*.MCH) contain information on the circuit board plotter
used (resolution, max. speed, motion range, etc.), the tool libraries to be
used and production phases. These points are treated in detail in thefollowing chapters.
Note for update customers: The initialization file (*.INI) for yourexisting BoardMaster version is copied during installation of the
update so that your user-specific settings are not lost.

New and update installation:
During installation of BoardMaster, the following window appears:
Figure 14: Component Selection

Select NEW, FIRST INSTALLATION if you are installing BoardMasterand your circuit board plotter for the first time. The setup program will
request you to place the configuration CD supplied with the circuit board
plotter and containing the specific INI file in the CD-ROM drive.

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If you do not want to use this initialization file (*.INI), e.g. test installation
without plotter connected, press <ESC> when Setup requests you to
insert the configuration diskette. The Setup program then installs
BoardMaster with standard settings.
Select UPDATE INSTALLATION if the Setup program is to add yourpresent initialization file (*.INI) to your update installation. You will thenbe requested to select the directory containing the INI file. Here, you canpress <ESC> to install BoardMaster with standard settings.

6.1.3 Directories Generated During Installation
During installation, the installation program generates a directory“C\Program files\LPKF50", for storing the programs and other required
files as a standard feature.
The following subdirectories are created in the directory “LPKF50" forBoardMaster:• BMaster contains the program files for BoardMaster as well as all
required configuration files.
• Data contains the data files for BoardMaster. This is the standard
directory where all data generated by CircuitCAM is stored.
• cfg_* Subdirectories for configuration scripts
After installation of BoardMaster, the Start menu contains a new program
group “LPKF Laser & Electronics“, as well as a new linkage on your
Windows desktop.

6.2 Installation of the USB driver
The USB drivers for the SMCU II of the ProtoMat S62 will be copied to
the PC after BoardMaster has been installed.
› First install BoardMaster and then connect the ProtoMat S62 to thecomputer via USB.
After the ProtoMat S62 is switched on WINDOWS asks for the driversfor „SMCU II“.
› Use the WINDOWS USB setup to have the drivers copied from thedirectory C:\programs\LPKF50\BMasterusb_drv.

6.3 Introduction
This and the following chapters provide basic information on the operating principles and a first impression of BoardMaster to familiarize youwith the user surface
Note: As a beginner, always read the following chapter and Chapter
4 carefully before starting to work with BoardMaster in combination
with your circuit board plotter. Chapter 5 then presents a practical
introduction into the basic methods of operation.
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6.3.1 HOME Position and Reference Hole System
The HOME position is a reference point programmed in the software.
This point serves BoardMaster as a reference position for orientation on
the machine base plate. The circuit board plotter can be controlled correctly by BoardMaster only when this point is adjusted correctly. The
Home position must be located on the reflection axis (reference holesystem) of the machine for production of circuit boards coated on bothsides. The base material is turned around this reflection axis. Inaccuracies in the HOME position lead to an offset in processing the base material after turning.
By means of the reference hole system the circuit board plotter is able toproduce double-sided boards. The reference pins are positioned exactly
on the HOME line, thus ensuring the congruency of the top side and thebottom side of the board. Any faults that may occur when the board isbeing turned are often due to the fact that the reference pins are no longer exactly positioned on the Y-coordinate of the HOME position. The
HOME position or HOME point is rhe reference point for the milling anddrilling data that are to be approached. All coordinates are calculated asabsolute values with respect to it. Machines with camera-based positioning systems (Vision System) may work without a reference holesystem for most of the time.
Note: The parallelism of the reference hole system is ensured only
for the current position of the reference hole strips. If you use basematerial of different sizes later, it will be necessary to drill an
additional reference hole in the !rear! reference hole strip for eachformat (see Chapter„Creating a New Reference Hole System“ onpage 39). The position of the pusher for the various holes should
be noted or marked on the circuit board plotter. This ensuresparallelism for the various formats and eliminates the possibility of
mix-ups.
It is only necessary to reprogram the HOME position in exceptional
cases (offset on double-sided circuit boards) or possibly after transportof the machine or loss of the individual .INI file.
Note: In this manual, we assume that the recommended standard
settings are made during installation. This applies for the name ofthe program group as well as the directories created.
Before starting to work with the ProtoMat S62, reference holes have tobe drilled in the reference hole strips, see chapter "Creating a New Reference Hole System" on page 39.

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Figure 15: Reference pin system
S62

1

2

3

1- HOME Position
2- Reference pin groove
3- additional reference hole, rear position

6.4 Switching On the Circuit Board Plotter
Before switching-on, remove all objects from the machine and its travelarea. Reference pins must not protrude from the base material.
Reference pins serve for fixation and as reference point of the axis ofreflection when base material is turned.
Danger! Never reach into the machine during switching-on!
For error-free operation with your circuit board plotter, it is absolutely
necessary to observe the switch-on sequence specified below:• First switch on the computer• Then switch on the circuit board plotter LPKF ProtoMat at
the main switch.
• Then start BoardMaster. The green operating indicator on
the circuit board plotter illuminates and indicates that themachine is ready for operation.
Otherwise, the communication that takes place when BoardMaster isbeing started cannot be performed.

6.4.1 Starting BoardMaster
After installation of BoardMaster, the Start menu contains a new program
group “LPKF Laser & Electronics“, as well as a new linkage on your
Windows desktop.
Start BoardMaster as follows:

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Bringing into Service› Click once on the entry BOARDMASTER 5.0 in the program group
LPKF LASER & ELECTRONICS in the START menu or double click
the BOARDMASTER 5.0 icon on your desktop.
Note: During start-up the following image appears before the main
menu or the wizard (input assistance) is displayed:
Figure 16:

This image may be visible for up to 8 seconds, which is related tothe communication between the PC and the machine, it does not
represent an error. After that, the program start is automaticallycontinued.

6.4.2 Plotter Ready
After starting LPKF BoardMaster, the following prompt appears if theplotter was not switched on previously:
Figure 17: Machine Switching On› Switch on the circuit board plotter (machine).
› As soon as the green operating indicator on the circuit board plotter
illuminates, click OK!
Caution! Clicking CANCEL starts BoardMaster without contact tothe machine, i.e. the port is set to zero. This mode is suitable only
for test operation or for editing data. To set the port please refer to
Chapter „Serial Interface“ on page 57.
If this prompt remains visible, check whether the machine is connected
correctly.

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Note: If you previously used a version BoardMaster 4.0 or older, thecommunication to the machine cannot be established immediately due
to the changed interface programming. In this case click on CANCEL if
the prompt SWITCH ON MACHINE appears and proceed according to
the description in chapter „Serial Interface“ on page 57
After starting BoardMaster for the circuit board plotter S62, the TOOLSTATUS dialog box appears:
Figure 18: Tool Status

CAUTION:It is absolutely necessary to establish where a tool islocated at switch on. Then, the free tool position can be entered in
the tool box. Note: position 1 = tool 1 all the way to the left,
position 10 is all the way to the right in the tool box
After starting BoardMaster for the first time, the TOOL STATUS dialog
box appears as illustrated above. The actual status, meaning where atool is located and which position is free in the plotter tool box for thistool, must be defined by the user. Each time the program is restarted,
the tool status present the last time the program was closed is displayed.
This can then be confirmed simply by pressing OK.
If the status displayed does not coincide with the actual status, it isnecessary for the user to correct the status.
Then, the program asks whether the tool is to be put back in the tool box
upon exiting BoardMaster.

6.4.3 Wait Message
As long as BoardMaster is waiting for a reply from the circuit board
plotter (i.e. circuit board plotter is in motion), a box with a corresponding
message is displayed:
Figure 19: Board Master

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The box disappears as soon as the head has arrived at the tool change
position!
Always wait this long and do not click the Stop button!!
This message is also output when the machine is still busy editing thelast command from the command buffer. This is not an error message! It
is possible to change to other applications while the box is displayed. As
soon as the plotter sends the requested reply to the PC, the box
disappears and the program is continued normally.
After clicking the Stop button, an (additional) error message appears:
Message: “Do you really want to cancel the current process?”
Yes
No
Note: If you really want to cancel the current process, it is
discontinued only after clicking the YES button a number of times.
The communication between computer and circuit board plotter isthen interrupted.
This message also appears when the circuit board plotter is switched off
before BoardMaster is switched off, see following chapter.

6.5 Switching Off the Circuit Board Plotter.
When switching off the circuit board plotter, first quit BoardMaster before
switching off the machine. In the opposite sequence, recurring error
messages are possible, which can be cancelled only by repeatedly
actuating the YES button.
(Error message: Do you really want to cancel the current process...)
Before BoardMaster is actually switched off, a menu is displayed asking
where the machining head is to be displaced to:
Figure 20: „Go to“ Menu

› Click on Ja to make the machine head go to the reference point ( i.e.
zero position).
› Click on YES, if possible, as after clicking on NO the machine must
be initialized again at a restart which requires some amount of time.

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7.0 BoardMaster User SurfaceT
he following illustration shows the BoardMaster user surface:
Figure 21: User surface

1
2
3
7

4

8
5
6

1-Title bar

5- Working area (only ProtoMat S62 with camera option)

2-Menu bar

6- Blue cross hairs represent the current positionof the mill/drill head7- Imaging window from head camera (only forcamera system)
8- Reference picture „Fiducial“ (only for camera
system

3-Function bar
4-Tool change position

A job is a completely edited production file containing information on thesize of the base material, HP-GL or LMD data used, its positioning aswell as all production phases and tool assignments.
The format of such a file is described in greater detail in the following
chapters.
You can import the file “tutor.lmd“ or any other desired file after starting
BoardMaster for test and practice purposes by selecting the entry
IMPORT - LMD OR LPR in the FILE menu.
The user surface for BoardMaster is subdivided into a number of areas:• The Title bar shows the name of the program indicating the type ofcircuit board plotter used as well as the name of any job loaded or
created.

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BoardMaster User Surface• The Menu bar lists the menus available.
• The Function bar contains various buttons, displays and functions
for control of the circuit board plotter and for modification of a job.
• The Working area graphically displays the current top view of thecircuit board plotter.
• This area is itself divided up into the actual motion rangeof the circuit board plotter (displayed in dark gray) and thearea of the base material used (displayed in light gray)with the circuit board data to be processed. Only in thisarea you can lower the head, therefore all data must beplaced in this area.
You can adapt the graphic display of the working area toyour specific requirements with the functions in the VIEW
menu.
• The Display scroll bars are located on the right of and below the
working area and serve for moving the visible section into theworking area.
• The Current mouse cursor position is indicated at the left next tothe horizontal scroll bar.
• The Status bar below the horizontal scroll bar provides information
on buttons, displays or areas where the mouse cursor is presently
located.
• The tool changing position represents the stations 1-10 of the tool
magazine.

7.1 Function Bar
The function bar in BoardMaster includes functions for positioning andcopying projects on the base material as well as for control of theconnected circuit board plotter. Moreover, the function bar provides
important status information on the machining process.

7.2 Brief Summary of Function BarT
his short summary contains a list of all features in the function bar. The
individual features and meanings are explained briefly. Each function
includes a reference to the corresponding page in the manual containing
a detailed explanation when present. The hot keys for the function are
also listed following the page number.

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Figure 22: Overview function bar

11

7

3

16 18

6

13

8

2 4 5

10

25

15

9
1

22

12 17

21

14 32 20 19

1- New file (page 69)
2- Display/select active phase (page 50)
3- Import LMD-file (page 69)
4- No function
5- Display/select active tool (page 50)
6- Open job file (page 69); (Strg+O)
7- Save file as job (page 69)
8- Zoom window (page 77)
9- Zoom in x 1,5 (page 77), (Page up key)
10- Tool penetration depth
11- Zoom out x1,5 (page 77), (Page down key)
12- Number of drills or length of milling lines mm
13- Total view of operating area (page 77, („Pos1“)14- Speed of milling/drilling spindle
15- Previous (page 77)
16- Reload LMD data (also screen refresh)
17- Display: Drilling time in sec. or feed in mm/sec.

27

24

23

29

28

26

30

31

18- Phase configuration (page 65
19- Tool position - dialogbox
20- Vacuum On/Off (not for all machines)
21- Configuration „active Tool library“ (page 57)
22- Controlling functions for Milling/Drilling head (page page 51)
23- Display interface (page 57)
24- Moving Milling/Drilling head in X-/Y-direction
25- Moving Z-Axis -Z / +Z (page 50)
26- Special camera functions (only for camera option, page 54)
27- Display: X-,Y-,and Z-position in mm
28- Vector index display
29- Copy, Shift, Select, Mark (page 50/page 52
30- „Start“ / „Stop“ (page 53))
31- Estimated processing time (hr:mm:ss)
32- Open connection to the LPKF internet shop

7.2.1 Status information

Figure 23: Status-Information-I

1

2

3

4

1. Interface
This display provides information on the interface set for transferring
the control data. Here NULL means that the data is not sent to aninterface. When the mouse is moved over this display field,
the values set for the interface are indicated in the status bar.

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2. Actual position of milling drilling headThis display shows the actual position in all 3 axis.
3. Number of vectors
The number of vectors which have already been processedis displayed (here vector means section of line, "Selection
functions" on page 52, causing movement in X, Y, or Z direction).
.
4. Estimated Processing TimeFor current production phase. This display indicates the estimatedtime in hours:minutes required for processing the enabled production
phases. Individual selections are not taken into consideration here.

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8.0 Introduction to the Basic Functions of the ProtoMat S62
With this chapter we want to show step by step the principal procedure
for the prototype production of a double-sided unplated PCB by meansof BoardMaster specially when using the ProtoMat S62. Just follow
the instructions and within a short time you will be familiar with the basic
work procedure with BoardMaster and your circuit board plotter:› If this is not already done, switch on the machine at the main switch
first!
› Click once on the entry BOARDMASTER 5.0 in the program group
LPKF LASER & ELECTRONICS in the START menu or double click
the BOARDMASTER 5.0 icon on your Desktop in order to start
BoardMaster.
The following message appears:
Figure 24: Tool Status

Click on the correct position. If there is not yet any tool within themachine or if the tool magazine is occupied, only click on OK.
When the machine is first put into operation there will not be a tool
present. Programming and preparation of the tool magazine will be
dealt with later in this introduction. In this case, too, just click on
OK.
Configuring BoardMaster:
BoardMaster can only communicate correctly with the circuit board plotter when BoardMaster addresses the correct interface of the PC andwhen this interface is correctly adjusted.
› If this is not already done, define the serial interface by selecting
menu CONFIGURATION and there the entry INTERFACE..., checkand if necessary adapt the values correspondingly (see chapter„Serial Interface(s) / USB Connection“ on page 22).
› If necessary, check the settings of the serial interface in the WINDOWS- SYSTEM CONTROL under System Devices Manager
Connections. Necessary setting parameters are shown in figure 39
on page 58, they depend on the type of circuit board plotter that isconnected.

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Note: Close the BoardMaster program after control and any
configuration of the interface adjustment before continuing withthis introduction!
› Click once on the entry BOARDMASTER 5.0 in the program group
LPKF LASER & ELECTRONICS in the START menu or double click
the BOARDMASTER 5.0 icon on your Desktop in order to start
BoardMaster.
› Click on the MOVE TO ... - PAUSE in the menu bar to move the circuit board plotter to the pause position.

8.1 Creating a New Reference Hole System
The machine is delivered with red reference hole strips inserted in thereference hole groove, however, these strips do not yet containreference holes. Before producing the first printed circuit board,reference holes have to be drilled into the reference hole strips. Drilling
new reference holes also becomes necessary when the reference holes
in the red reference hole strips become larger after a time from use andare therefore not as precise as at the beginning. Replace the strip when
too many holes are present.
Danger! Remember that the tools are very sharp and may also be
hot. Work only with vacuum switched on to prevent injuries fromchips!
A new reference hole system can be created as follows:› When creating a reference hole system for the first time, remove thebase material and drilling panel. If you have already worked with themachine, remove them as well as the reference hole pins.
› If sufficient space is still present on the old reference hole strip, it canbe reused (reference hole strip may be turned around). Otherwise,
insert two new reference hole strips into the machine groove,
whereby the front reference hole strip should be pressed against thefront reference pin in the groove. The distance between the two
reference hole strips should correspond approximately to the size ofthe base material along the X axis. (move the machining head to thepause position to change the reference hole strips; use command
Go to...-Pause position on the menu bar).
› Move the machine head to the ZERO position and remove the foot of
the working depth limiter.
› Select Spiral Drill Ref. 2.95 in the Tool list field (machine changes
tool automatically).
› Move the machine head to the HOME position (GO TO Menu,
HOME position).
› and from there in the X direction (not Y direction under any
circumstances) to a free location on the front reference hole strip
with the arrow keys.
› Switch on the vacuum system!
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Introduction to the Basic Functions of the ProtoMat S62› Switch on motor by clicking
lowerand drill a hole by pressing the raise/button.

Two enquiries follow, asking whether a reference hole is to be drilled
and whether the working depth limiter has been removed. Both haveto be confirmed with YES.

› Switch off motor by clicking.

› Move along the X axis by 295 mm (for basis material 9“x12“ or 229 x
305 mm) to the second, rear reference hole strip (on the right-handside) and drill a hole there as well. (Confirm the enquiries). Do not
move in the Y direction under any circumstances.
› Move machining head to the PAUSE position.
› Insert thte reference pin into the fitting tool, such that the chamferedside is protruding. At delivery of the machine, the reference pins aresupplied in the accessory bag.
› Press the pin into the hole now present in the reference hole strip
using the fitting tool as an aid. Repeat the process with the second
reference pin. Ensure that the pins are tightly seated, because any
play in the fitting accuracy has a negative effect on the offset
accuracy of the board.
› Mark old holes with felt-tip pen so that they cannot be mixed up with
the new holes.
› Position pre-drilled base material and drilling panel above referencehole strips. Select the format for the base material so that thereference hole strips do not have to be moved by more than 10 mm,
because otherwise the reference hole system loses accuracy.
› Fasten the base material now positioned with adhesive tape in
addition (we recommend Tesakrepp 5250) on all four sides.

8.2 Preparing and putting on base material
Preparing the base material:› Now use, for example, an upright drilling machine to drill a 3 mm holeon the middle axis of both short sides at 5 mm distance away fromthe edge (see following figure):

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Figure 25: Drill holes in the basematerial

Base material

Drill holes› First put on the drill underlay material.
› Then place the base material on the machining table.
Note: the tools must be assigned to the tool magazine before
milling. The tools must, of course, also be inserted in the tool
magazine. This work step is postponed on purpose as BoardMastercan later display which tools are really needed for thecorresponding job after the data are read in and prepared. Details
on the tools and the tool holder can be found in chapters "Thetools" on page 82 and "Tool Holder" on page 54
In order to be able to process data that are prepared using CircuitCAM
or a similar software, they must first be imported into BoardMaster.
For those who are so far unfamiliar with the LPKF milling
technology it is helpful to have the base material that is actuallyprocessed visibly displayed on the screen.
To do this, you can determine this area.
The determination has no influence on the course of the
production, it is merely an assistance for the view.
In case of need, proceed as follows:
Determining the view of the material size:
Determine the size of the base material that is used by reading chapter"Defining the Base Material Size" on page 67 and using the method
Determining the size by moving the machining head described
there. Then continue work from here.

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8.3 Working with Production Data and Phases
Importing production data:
The „work instruction“ for BoardMaster which determines the way inwhich the base material is processed is contained in the production data.
The data is prepared by CircuitCAM, for example. It must be imported
first:
You can import LMD production data prepared by software CircuitCAM(e.g. TUTOR Fiducial.LMD). In the following we will import a file in LMD
format (TutorFiducial.lmd).
› Import the file TutorFiducial.LMD by clicking in menu FILE to thesub-menu IMPORT and there on entry LMD or LPR... . There you
can select a file (e.g. „TutorFiducial.LMD“). This file is located in the
directory LPKF50\Data\.
Assigning tools:
In order for BoardMaster „to know“ which tool is to be used for each individual production phase (milling, drilling of different sizes, engraving,and so on), a tool must be assigned to each production phase. This is
usually done by BoardMaster, this is also the case with the import ofTutor.lmd.
› If you work with a HP-GL file. Asign the corresponding tools/phasesto the imported production data or projects, respectively (PROCESSING-MATERIAL ALLOCATION). If not, continue with the next working step.
Placing production data:
The data are automatically placed in the middle of the machining surface
after import of the data. With this function It is possible to place theimported production data anywhere on the base material where they are
to be milled later.
› Place the imported production data or projects by going to menu
PROCESSING and selecting entry PLACING... or click on the buttonin the function bar. Then you can move the mouse to theimage of the production data and move these by keeping the mouse
key pressed.
Saving a job:
› Having placed all projects, store the job by selecting menu FILE andentry SAVE to store the job under any name of your choice.
Note: Before starting the machining process, the milling depth has
to be manually adjusted. The milling depth can be adjusted by turning the knurled nut on the working depth limiter. When the wheel isturned clockwise, the milling depth is increased, turning counterclockwise reduces the milling depth.
• Turning the knurled nut by one increment changes the milling
depth by approx. 4 µm.
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Introduction to the Basic Functions of the ProtoMat S62• Turning the knurled nut one complete rotation changes the milling
depth by approx. 0.5 mm.

Note: Altogether the following production work steps must beprocessed in order to produce a double-sided PCB:
• Marking Drills• Drilling Plated• Milling Bottom• Read Top (only with camera option)• Milling Top• Cutting Outside
Note for the Read phase (only for option camera or vision system):
A Read-Phase must be performed each time when it was necessary
to remove the PCB from the machine base plate (e.g. duringmultilayer production), e.g. „Read-Bottom“ after the PCB was
through-plated.

Selecting first production phase:
Each production phase, like „milling the solder side“ (Milling Bottom)
must be selected indiviudally and prepared for processing (inserting thecorrect tool and so on). Now start with the first production phase:› First check whether in the function bar in the list field PRODUCTIONSTEP (see figure below) the production phase Marking Drills is
selected. If this is not the case, select it.
Figure 26: List field „Production
Phase“Configuring tools for automatic tool change:› Configure the tool positions by clicking with the right mouse key on
the list field TOOL in the function bar (or button).

A message is displayed asking if the machining head is to be moved tothe pause position.

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Introduction to the Basic Functions of the ProtoMat S62› Confirm with Yes/Ja
In the current window on the right you see the tools required for this job.
These must be inserted in the tool magazine as follows:› Now you manually set the „UniversalCutter 0.2 mm (marking)“ on
position1 (see ffigure on following page):
Figure 27: Tool positions› Now click on the button at the side to open the „Pos.tool“- window ofposition 1, and select the tool „UniversalCutter 0.2 mm“.
› Proceed in the same way for all other tools. At the end the window
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Figure 28: Listed tools

A mark in front of the tools listed on the left side of the screen indicatesthat those tools are required for the phases listed on the right side.
Now the tool magazine is equipped and programmed for the job.
› Click on OK.
› Save the data as job by clicking on SAVE FILE.

Marking data:
It is possible to process only parts of this production phase by marking
them correspondingly. Therefore the required areas which are to be processed must be selected first. As here the whole production phase is tobe processed, all data of this phase are marked.

› Selectfor marking all data.

Danger! Activating the following button in the function bar causes
the circuit board plotter to move, danger of crushing! Make sure no
persons come within the travel area of the circuit board plotter orcome in contact with the tools.
Starting the milling process of the selected production phase:› Click on the
button in the function bar to send the marked
data of the current production phase via the serial interface to the circuit board plotter.
Production phase „Marking drills“ is being processed.
The following message appears:

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Figure 29:› Click on OK.

Select a second production phase:› In the function bar in the list field PRODUCTION PHASE select the
production phase DrillingPlated (see figure below).
Figure 30: List field „Production
phase“Mark data:› Selectfor marking all data.

› Click onin the function bar.

The production phase is processed.
Now continue to follow the drill request by inserting the tool (drill) uponrequest and subsequent clicking on OK until the production phase iscompletely processed.

Select third production phase:› In the function bar and in the list field PRODUCTION PHASE selectthe phase MillingBottom.

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Figure 31: List field „Production
phase“Mark data:› Selectfor marking all data.

Starting the milling process of the selected production phase:› In the function bar click on.

Data of the current production phase is sent to the circuit board plotter
via the serial interface. When processing is finished, the following
window appears:
Figure 32:

Only for camera option: select next production phase:› When the production phase is processed, move the head to MOVE
TO ..../PAUSE.
› First turn the base material. To do this, lift it and turn it around its longitudinal axis so that the former bottom side is now on top. Make
sure the base material is well positioned on the reference pins.
› In the function bar and in the list field PRODUCTION PHASE selectthe phase ReadTop .

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Figure 33: List field „Production
phase“› Selectto mark all data.

› Click onin the function bar.

The machine automatically traverses to all three fiducials.
After the successful fiducial recognition the main screen is again displayed. You can now see three little crosses on the fiducials.
Select fourth (for camera option fifth) production phase:› First turn the base material. To do this, lift it and turn it around its longitudinal axis so that the former bottom side is now on top. Make
sure the base material is well positioned on the reference pins.
› Now select production phase MillingTop.
› Click on ALL+.
› Click on START.
› When the production phase is processed, move the head to MOVE
TO ..../PAUSE.
When you have performed the previous work steps, you must now process the production phase Cutting Outside.

Select fifth (for camera option sixth) production phase:
During this production phase the board is milled out of the basematerial.
› In the function bar and in the list field PRODUCTION PHASE selectthe phase CuttingOutside.
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Start the milling process of the selected production phase:› Click onin the function bar.

The selected data of the current production phase are sent to thecircuit board plotter via the serial interface.
› When the production phase CUTTING OUTSIDE is completely processed, move the circuit board plotter to the PAUSE position.

Danger! The milled edges of the produced board may be sharp.
Danger of cutting! If necessary, wear protective gloves.
The double-sided board is now finished. It may be broken out of thebase material with due care. If you want to process the data of other production phases (milling of inner layers of a multilayer and so on) then follow the description above in the same way for these phases. Read thecorresponding chapters in the manual.

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9.0 BoardMaster Functions
9.1 Changeable Settings
The display fields indicated here can be edited and thereby adapted toyour requirements.
Figure 34: Status-Information-II

1

2

4

3

1. ToolThis list field shows the tool used for the current production
phase.
2. Current Production Phase
The current production phase is indicated in this list field.
3. Step Width for Manual Control
This text field allows definition of the step width by which the millingdrilling head is moved each time one of the six Arrow buttons(outlined with dotted line in figure above) is clicked.
You can mark the text field and increase or decrease the value
in defined steps with the + or - button.
4. Vector Index
This text field allows you to define the vector index. An index iscounted with each line segment or arc segment. Here, it is possible
to define the vector index at which processing is to be started, forexample.

9.2 Positioning Functions
Move Project
You can activate this button to move a project in the operating area.
Position the cursor on the project to be moved, press the left mouse key
and drag the project to the desired position with the mouse key
depressed.
The project appears as a dark area while it is being moved.
Duplicate Project
You can activate this button to duplicate a project and position the copyin the operating area. Position the cursor on the project to be duplicated,press the left mouse key and drag the copy of the project to the desired
position with the mouse key depressed.
The copy of the project is represented as a dark area during duplication.
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Note: Each time a project is moved or duplicated it is necessary toreactivate the corresponding button.
Click a project with the right mouse key to open the PLACEMENT
dialog box and display the settings for this project.
In this dialog box you can correct the reference point values for
positioning projects on the same X and Y coordinates (align). If thecontrol key is pressed and held down, while clicking and holding
down the left mouse key on the project, the project is moved only in
the X or in the Y direction.
You can also use the PLACEMENT dialog box for rotating a project(after positioning with the mouse) by changing the setting
ROTATION.

9.3 Control Functions for Manual Control
Danger! After activating one of the following buttons on thefunction bar, the connected circuit board plotter is put into motion!
Ensure that no one can move into the hazard area of the plotter
during the operating phases controlled by BoardMaster!
Manual Control
The head can be moved in the directions +X, +Y, -X and -Y with the aidof the arrow keys. Pressing one of the arrow keys once, moves the headby the value entered on the function bar in the entry field STEP FOR
MANUAL CONTROL in the selected direction. (See "Changeable
Settings" on page 50). Motion in the X and Y direction can also be
accomplished by holding down the Ctrl key on your keyboard andpressing the arrow keys on the keyboard. The Z-axis can be moved withthe keyboard by pressing the Ctrl key and actuating the Page or Page
key.
Moving by Mouse
After activating this button, the head can be moved to the position in theoperating area which you click with the left mouse key. If you continue tohold down the left mouse key, you can move the mouse and the headfollows the motion of the mouse after it has reached the mouse starting
position. This function allows the head to be moved to any desired
location very quickly for defining the material size. To control the XY
table with the mouse motion again it is first necessary to activate thebutton again.

Moving to the Home Position
When this button is clicked, the machining head moves to the Home
Position. This position is principally moved to in order to check the existing reference hole system or to produce a new one.
Zero point
When this button is clicked, the machining head moves to the zero pointof the X-Y coordinate system. This position is generally moved to before
switching the circuit board plotter off.

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VacuumBy clicking on this button you can switch the vacuum system on or off.
Please note that the vacuum system cannot be switched off when themachining spindle is running.
Machining spindle on / off
By clicking on this button you can switch the machining spindle on or off.
Pause Position
When this button is clicked, the machining head moves to the Pause
Position. This position is used when material is to be exchanged or whenmaterial is to be turned round.

9.4 Selection functions
Before selecting, you must have activated all phases to be assigned
data and which you want to process. Detailed information on activation is
given in the chapter “Phases”. Data must be selected before it can besent to the plotter for processing. Only data in the activated phases canbe selected.
The following buttons are available on the function bar for selecting thedata:Mark All
Activate this button to mark all data for the enabled production phases.
The data marked are displayed in a lighter color on the monitor.
Cancel All Marking
Activate this button to cancel all marking of the data.
Select Area
Activate this button to select a data area. For this purpose, press the left
mouse key and hold it down while dragging the mouse over the desired
area.
This function also selects lines crossing the area. The selected data aredisplayed in white on the monitor.
Select Area (only inside)
Activate this button to mark a data area. For this purpose, press the left
mouse key and hold it down while dragging the mouse over the desired
area.
This function marks lines crossing the marked area only up to their first
support coordinate outside of this area. The marked data is indicated inwhite on the monitor.
Note: It is necessary to reactivate the corresponding button eachtime an area is selected.

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Add Selected Data to Marking
Activate this button to add selected data to the marking.
Delete Selected Data from Marking
Activate this button to delete selected data from the current marking.
Selected Lines
You can increase or decrease the number in the window with the small
arrow buttons to the right. Each number stands for a certain vector(section of line). The entire job is processed vector for vector in thesequence of this numbering. It is possible to select a certain vector or anumber of vectors for subsequent marking. For this purpose, it isnecessary to select the number of the corresponding line with the aid of
the right arrow button. Then, it is necessary to activate the function“Selected lines” by clicking. You can then increase or decrease thenumber with the arrow buttons to select each selected vector anddisplay it in white on the monitor. These selected lines can be marked byor added to a marking. If vectors already marked areclicking
selected in this manner, they can be unmarked by clicking.
This function can be deactivated by clicking.
Furthermore this function allows to select a project to start with a determined vector index value. Enter the vector value from which the projectis to be processed. Confirm the function withand then the vector
value is increased using the keyboard entry (for example by adding a
number, e.g. 564 becomes 5640). The subsequent routes are then represented in white and can be added to the selection by pushing the
button.

9.5 Control Functions for Production Phase
Danger! After activating one of the following buttons on thefunction bar, the connected circuit board plotter is put into motion!
Ensure that no one can move into the hazard area of plotter andcome into contact with the tools during the operating phases
controlled by BoardMaster!
Start
Activate this button to transfer the marked data for the enabled
production phase to the plotter over the serial interface.
Stop
Activate this button to discontinue data transfer to the plotter after
starting.
Caution: After activating the Stop button, the plotter does NOT
STOP IMMEDIATELY; first, it continues to process the data in thebuffer!
Activation of the Stop button only interrupts transmission of data
to the plotter!

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9.6 Camera Functions (only for S62 with camera
option)Set Focus
Use the arrow keys to move the machining head with camera until theimage is focussed on the base material. Then press this key to have thecurrent Z value stored in the INI file as vocus position.
In order to facilitate the adjustment of the focus, it is recommended touse a piece of paper with text on it. Put this on the working area and thenapproach the writing. By means of the keys for moving the Z-axis(recommended stepwidth 0.5 mm) the focus can then be adjusted manually.
The following enquiry for setting the position of the camera is to be
anwered with YES.
Focus
Press this button to have the camera moved back to the focus position
when it is currently in a different position.
Stop
Pressing this button stops ongoing reading processes of the camera,e.g. when fiducials are being read in.

9.7 Tool Holder
Tool holders that are mounted at the S62 machine are represented on
the screen in the following way:
Figure 35:

The dots below the menu and function bars (see rectangle) represent
the tool holders of the machine: The color represents the kind of tool in
the holder.
Green dot:
Orange dot:
Blue dot:

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Violet dot:
Yellow dot:Light green dot:end mills
contour cutter
Endmill longDot displayed with a red ring around it:
Tool position reserved - tool is presently in the collet
Dot displayed in white by the software:
Tool holder is free.
A detailed desciption of the tools can be found in the chapter „The tools“
on page 82.

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10.0 Menu Bar
This chapter introduces the menu functions in BoardMaster in their
typical sequence of use.

10.1 Go To Menu
This menu contains functions for moving the machining head to thecorresponding positions:Figure 36: Go To Menu

Danger: When an entry in the menu GO TO is selected, theconnected circuit board plotter starts moving! The hazard ofpinching and crushing exists!
For this reason, ensure that no one can enter the motion range ofthe circuit board plotter during the operating phases!
HOME

Select this entry to move the machining head to the
HOME position (data origin).

PAUSE

Select this entry to move the machining head to the
PAUSE position (standard Xmax/Ymax) .

Zero Position

Select this entry to move the machining head to thetool changing position (standard Xmin/Ymin).

Camera >> Head
Select this entry to move the camera (if option ispresent) to the current machining head position.
Head >> Camera
Select this entry to move the machining head backto its original position.

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10.2 CONFIGURATION Menu
This menu contains all functions required for configuration ofBoardMaster as well as the connected circuit board plotter:
Figure 37: Configuration menu

10.2.1 Serial Interface
An interface is preset by the manufacturer in the INI-file. If the machine isto be connected to a different interface at your computer (COM2 insteadof COM1) or if you used version BoardMaster 4.0 or an older version,
than BoardMaster will first start without communication build-up. The interface and its configuration can then be selected later in BoardMaster
under „configuration -> interface“. It is important that the correct configuration is selected which corresponds to the connected ProtoMat machine.
Otherwise the communication will not be built up correctly.
Note: When the communication has been successfully established,
it is absolutely necessary to terminate BoardMaster for a shortmoment and then restart it so that the modified settings are written
in the INI file.
Figure 38: Machine communication

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MachineAdjustable machine configurations.
H100 - 2003-:
ProtoMat H100 built in 2003
H100 -2004-:
ProtoMat H100 built in 2004
H60:
ProtoMat H60
S62 (Firmware 2.4.1):
ProtoMat S62, with USB connection
S62 (Firmware 2.3.3)
ProtoMat S62 (previous firmware version)
SMCU_2AX:
ProtoMat 91s, 91s/VS, 92s, C20, C30, C30s, C40, C60, C100/HF,
M30/s, M60, M100, L60, X60
SMCU_2AX Toolchange:
ProtoMt 95s, 95s/II
SMCU3AX:
ProtoMat D100, M60/3D
Virtual Machine:
Demo-Modus for offline operation
X60:
ProtoMat X60/II
X60 III:
ProtoMat X60 / IIInterface
Usable communication ports of the control computer. Selectable are „RS
232“ or „USB“ (USB only for ProtoMat machines with LPKF motion.net™
controllers. A firmware update may be required)Port
Here the PC connection is selected which is connected to the machine.
Baud rate
57600
Language
If an error occurs during operation, then BoardMaster gives necessary
hints to the problem in a dialog. The language of the dialog may be set
here.
Write to Comtrace.txt
The dialog between the PC and the machine via the serial interface canbe written in a separate file to help error detection. The file produced iscalled „Comtrace.txt“ and is located in the main directory of BoardMaster, C:\Program Files\LPKF50\Bmaster.
The following table lists all parameters of the serial interface which canbe set:Figure 39: Interface parameters

Circuit board plotter
ProtoMat S62

Baudrate

Data bits

Stop bits

ParityProtocol

Fifo

57600

8

1

none

Hardware

Yes

Note: the FIFO buffer must be switched on (see table above)!
The adjustment of these parameters is done in the Windows system
control.

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Windows 2000/XP: System - Hardware - Device Manager(Login as „Admin“!!!)If the circuit board plotter is not correctly triggered after the start of thedata transfer, check the connection between PC and plotter.
Also make sure that the parameters of the serial interface in the Windows system control match the parameters listed in the table.
Note: The cause of incorrect communication often is an incorrectly
adjusted protocol of the serial interface. Make sure that the
protocol set is Hardware-Handshake and not XON/XOFF.

10.2.2 Machine Settings
Select the entry SETTINGS... in the menu CONFIGURATION to open
the following dialog box:
Figure 40: Machine parameter

To prevent a change by mistake of the parameters listed in the dialog field MACHINE PARAMETERS if you want to make a deliberate
modification you have to click on the button UNLOCK to enable theediting of a parameter. The button then changes to LOCK, whichmust be pressed if modifications are to be stored.
UNIT
Click on one of the two options to have the length, diameter coordinatesand so on displayed either in inch or metrically.
NAME
This text field displays the type of circuit board plotter as it appears in the
BoardMaster title bar. This serves only for information purposes and has
no effect on the operation.

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Menu BarNUMBER OF TOOL POSITIONSThe number in this text field indicates the number of tool change positions. For the circuit board plotter ProtoMat S62 this is always 10.
SEND
Click on this button to send the command in the entry field to the left ofthe button to the circuit board plotter.
For this function it is not necessary to click first on the button UNLOCK .
ROTATION
The number in this text field indicates the maximum speed of rotation of
the spindle of the circuit board plotter.
SPEED OF MOVINGThe number in this text field indicates the maximum speed of movementof the circuit board plotter when the machining head is lifted.
RESOLUTION
The numbers in these two fields define the distance which the circuitboard plotter moves in X or Y direction at one step of the stepping motor.
Do not change these values under any circumstances as otherwise thecorrect scaling of the output cannot be guaranteed.
Automotor
If there is a check mark the machining motor is switched before start of a
production phase and it is switched off when the phase is finished.
All parameters specific to a plotter are defined in this dialog field. They
are stored in an initialisation file (*.INI).
SMCU II-control
Control type SMCU II for ProtoMat S62
BoardMaster is capable to operate two types of control. Selection of thecontrol type is preset for the circuit board plotter selected in the setup.
Note: The type of control should not be changed as otherwise thecorrect data transfer with the corresponding syntax is no longer
possible.
Vacuum table
There must be a check mark in this field if a vacuum table is mounted sothat the correct working height is taken into account during milling or
drilling. Otherwise there is the danger that e.g. during drilling ofreference holes the vacuum table is damaged.
Vacuum table heightThe default value of 15 mm is set at the factory. This value should not bechanged. The value is activated if the checkmark is set in the field
vacuum table.
CameraIf a camera is installed, there must be a check mark in this field.
During installation, the machine parameters of your plotter are read fromthe initialisation disk that is supplied together with the plotter. Thus allimportant values like machine size and the position of the HOME position (data origin on the axis of reflection) are already programmed at thefactory. The circuit board plotter is immediately ready for operation.

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All important information like HOME-position and area of travel must be
sent from BoardMaster to the control of the circuit board plotter.
A chain of commands in plotter syntax can be entered in the text field
START LINE. The commands are stored in the initialisation file when
BoardMaster is closed and are sent to the circuit board plotter when
BoardMaster is started.
All entries in the dialog field MACHINE PARAMETER are transferred tothe plotter when OK is clicked to leave the program and they are stored
in the initialisation file when BoardMaster is closed. Thus they are available at each new start of the program.

10.2.3 Tool Parameter
The BoardMaster program provides tool libraries containing tools
available from LPKF with all specific tool settings. The tool library files
are available in three versions: *.TOL for drilling and milling tools, *.DIS
for dispensing needles and *.VAC for evacuation needles (only withLPKF AutoContac). All lists can be changed and stored for later use.
The submenu TOOL LIBRARY in the menu CONFIGURATION
provides access to the various tool libraries:
Figure 41:

Libraries:
Example:FR4-60.tol FR3-60.tol Alu-60.tol Film-60.tol Kapt-60.tol Plastics.tol -Processing of FR4 base material
Processing of FR3 base material
Processing of aluminum base material
Processing of film foils
Processing of solder resist or stencil foils
Processing of plastic materials

FR4-60.tol is loaded as default. Please select before starting dependingon material.
› Select the entry MILL/DRILL HEAD in the menu CONFIGURATION
in the submenu TOOL LIBRARY to open the following dialog box:›

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Figure 42: Mill/Drill Tool Edit

All tools required for operation of the circuit board plotter are defined in
the tool library with their characteristic properties. The individual settings
are described here to allow you to change or add additional tools.
NAME
This list field contains the name of the tool. The selection of the nameshould provide information on the type of tool to facilitate later selection
in other program sections. After selecting a tool in the list field, you candisplay its settings and change them if required. The names selected
here must coincide with those in CircuitCAM. This name allows
automatic tool assignment when importing LMD files.
DIAMETER
The number in this text field indicates the diameter of the tool. This value
allows automatic tool assignment when importing LMD files and thedisplay of the actual diameter in the graphic working area.
HEAD DOWNTIME
The number in this text field indicates the time interval in seconds
between the command “Lower head” and the command “Raise head” forthe drilling tool.
MILL/DRILL
The tool can be defined as a milling or drilling tool by clicking one ofthese two options.
DESCRIPTION
An additional description of the tool can be entered in this text field.
However, this specification has no significance for the production
sequence.
LIFE CYCLE
The number in the text field MAXIMUM specifies the maximum cutting
path or maximum number of holes for the tool. In the text field
PRESENT; the cutting path already cut or the current number of holes
for the tool is indicated.

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The tool change procedure can be started by clicking REPLACE andafter replacing the old tool, the specification in the text field PRESENT is
reset to 0.
OPTIMAL SPEED
The speed in the text field ROTATION defines the optimum rpm for themachining spindle. The number in the text field MILLING defines the
optimum feed rate for milling tools.
Milling infeed [mm]Value in millimeters for milling depth (engraving tools L=36mm) andinfeed (cutting mills L=38mm). All milling tools that only machine the surface of the material or engrave it penetrate into the material with thisvalue, after the zero position was detected by the depth sensor prior tothat. Cutting mills are not detected by the depth sensor. Then the value
only indicates the further infeed.
Working mode...
Here parameter sets or profiles can be assigned to each tool. There are
the profiles THROUGHPUT, BALANCED, QUALITY. Parameters
speed, acceleration and dwell times can be stored for each of the threeaxes, they apply to „lower head“ (drilling) and „head down“(milling).
These profiles are stored in an MCH-file and are preset for the various
working mode profiles.
Note: The speed is used automatically only for circuit board
plotters with variable spindle speed. For all other circuit board
plotters with variable motor speed, the optimal speed must be set
by hand on the control. The optimal speed to be set is, however,indicated by BoardMaster upon tool change.
All changes in the tool library can be stored in a tool file (*.TOL) andloaded again later. The file to be loaded when BoardMaster isstarted can be defined in the machine file “*.MCH” with thecommand “#INCLUDE”.This also applies for production phases,
the dispenser and vacuum tools.
All changes are stored in a tool file (*.TOL) when the SAVE... button ispressed and can be loaded again later by pressing the LOAD... button.

10.2.4 Heads Dialog Box
The HEADS dialog box can be reached by clicking HEADS in the menu
CONFIGURATION.
Figure 43: Heads -Mill Drill

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Menu BarThe various tool heads are listed in the left half and the offset associatedwith the specific heads are listed in the right half:
Mill/Drill head: The milling/drilling head serves as a reference for allother options mounted on the head. Its offset should therefore always be
set to X = 0 and Y = 0.
Camera: The distance between a camera option mounted on themachining head and the machining head is defined here. This can beused for precise positioning for reloading circuit boards alreadycompleted.
A detailed description of how this offset is calculated is given in thefollowing chapter.
Auto
When a metal sheet is put on the table, this function is used to calibrate
the camera offset automatically. This is no function in the software version for the ProtoMat S62.

10.2.5 Adjust Camera Offset
Adjust camera offset (factory setting existent)› Select a 0.8 mm drill and drill a hole on a free area of the base material.
Caution: Do not move the machining head anymore!
› In menu CONFIGURATION open the dialog HEADS.
› Click on entry CAMERA.
Figure 44: Heads› Press button ORIGIN.
The button then turns to gray.
› Quit this dialog by clicking on OK.
› In the menu GO TO click on CAMERA>>HEAD

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› Now move the head as long as the cross wires of the camera image
are exactly in the center of the hole. For better positioning decrease
the step width to 0.005 mm.

Figure 45: Camera› Open the HEAD dialog box again.
› Press the button HEAD to accept this new position.
Then the coordinates in the field OFFSET should change.
› Quit this dialog with OK.

10.2.6 Phase... - Production Phases
All data to be transferred to the circuit board plotter by BoardMastermust be assigned to a certain production phase. These production
phases define a work sequence which does not require any
manipulations by the user. An example of such a manipulation would bethrough contacting the circuit board or turning the base material. The
only exception here is manual tool change. This assignment is preparedin CircuitCAM and is accomplished automatically in BoardMaster.
Some production phases are already defined in the initialization file.
However, you can adapt these production phases to your specificrequirements at any time. The names of the production phases mustcoincide in CircuitCAM and BoardMaster.
› Select the entry PHASES... in the menu CONFIGURATION to open
the following dialog box:

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Figure 46: Phases

All standard defined production phases are listed in the list field. After
selecting a production phase, you can view its settings and change them
if required.
Two settings are required for each production phase:• The color with which the data assigned to this production phase is tobe displayed. This setting serves for differentiation of the various
production phases on the working area.
• Definition of the circuit board side (visible = component side orreversed = soldering side) for the production phase. Mark theindicator box REVERSE SIDE for all production phases forprocessing the bottom of the circuit board. All other production
phases for which the indicator box REVERSE SIDE is not marked,
are defined for processing the top.
To create a new production phase:› Mark the production phase in the list field in front of or in back of the
new production phase you want to add.
› Enter the name of the production phase in the text field.
› Click INS ABOVE or INS BELOW to insert the production phase at
the corresponding point in the list field.
Press the SAVE button to store all changes in the PHASES... dialog box
in a phase definition file (*.PHS) so that it can be loaded again later bypressing the LOAD button.
Note: On one-sided material, the option “REVERSE SIDE” shouldbe activated for the phase “CUTTING OUTSIDE“! This eliminates
the necessity of turning the base material.

Meaning of the phase files
1-2layer.phs
Production of single and double-sided boards
4layer.phs
Production of 4 layer multilayer boards (sequential build-up method)
6layerpin.phs
Prodution of 6 layer multilayer boards (registration pin method)soldermask.phs
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Cutting of solder foil „system EasySolder“

10.2.7 Defining the Base Material Size
When preparing a new job, it is first necessary to define the size of thebase material used. This is necessary to display the actual processing
surface available in the working area and therefore allow optimum
positioning of the circuit board data.
The material size can be defined in the menu CONFIGURATION in thesubmenu MATERIAL:
Figure 47: Material Size

This submenu offers two possibilities for defining the material size:• Determination of size by moving circuit board plotter and reading incoordinates.
• Manual entry in the SIZE dialog box.
Determining the size by moving the machining head:
Precise determination of the base material size can be accomplishedwith the circuit board plotter connected with the functions SET X,Y-MIN
and SET X,Y-MAX in the submenu MATERIAL in the menu
CONFIGURATION.
When defining the material size, observe attachment strips and the sizeof the working depth limitation as well as the position of the referencehole pins.
When a new job is defined; the already defined material size is deleted.
Danger! The following instructions should be read before startingthe circuit board plotter as it sets the plotter in motion!
Ensure that no one can enter the motion range of the circuit board
plotter. Danger of pinching and crushing!
Also observe the safety precautions for the circuit board plotter!

› Move the machining head of the circuit board plotter with the arrow
to the “front right corner” (X/Y-Min) on thekeys
circuit board material.
› Select the entry SET X, Y-MIN in the submenu MATERIAL in themenu CONFIGURATION.

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› Move the machining head of the circuit board plotter with the arrow
keys
circuit board material.

to the “rear left corner” (X/Y-Max) on the› Select the entry SET X,Y-MAX in the submenu MATERIAL in themenu CONFIGURATION.
After the base material size has been defined, it is displayed in dark grayin the BoardMaster working area.
Always observe the specified sequence for setting the coordinates (first
front right corner, then rear left corner)!
Manual entry in SIZE dialog box:
Note: This possibility for defining the size should only be used for
preparing a job when the circuit board is not connected, because
precise entry in consideration of the positioning on the circuitboard plotter and the position of the reference holes in the basematerial is not possible.
Select the entry SIZE... in the submenu MATERIAL in the menu
CONFIGURATION to open the following dialog box:
Figure 48: Material size and position

The size of the base material can be defined by manually entering thecorresponding values in the text fields. The size calculated from thevalues in the upper text fields is displayed in the text field SIZE.
FREE DRIVE LEVEL indicates by how many mm the tool is moved
upward after a machining process.
MATERIAL THICKNESS indicates the thickness of the material to beprocessed.
UNDERLAY indicates the thickness of the drill underlay. This fieldcannot be selected if a vacuum table is installed.
After exiting this dialog box by clicking OK, the base material area isdisplayed in dark gray in the working area
Always observe that the minimum values (possibly negative sign) areentered under X-MIN / Y-MIN and the maximum values under X-MAX /Y-MAX.
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10.3 File Menu
The functions in this menu serve for handling jobs and projects inBoardMaster:Figure 49: File Menu

NEW
OPEN

SAVE

Select this entry to create a new job in BoardMaster.
Select this entry to open a job already present inBoardMaster. Version 3.x job files can also be loaded.
However, it is necessary to reassign the tools, because thetool names are not identical and BoardMaster cannot findthe old names.
(See "Introduction to the Basic Functions of the ProtoMat
S62" on page 38)
Select this entry to store the job opened in BoardMaster
under the file name indicated on the BoardMaster
title bar.

SAVE AS...
Select this entry to store the job opened in BoardMaster
under a new file name.
IMPORT
This submenu contains functions for importing production
data or projects into BoardMaster:LMD OR LPR...
Select this entry to import LMD files (CircuitCAM
production data) or LPR files (BoardMaster HP-GL projects)
into BoardMaster. Version 3.x LMD files can also be
imported. However, it is necessary to reassign the tools(„Assigning Tools“ on page 70 and the production phases,
because these names are not identical and BoardMastercannot find the old names.
NC-Convert
Without function
HP-GL INTO
In this submenu, select the entry
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NEW LPR...,

to import the HP-GL files into
BoardMaster and assign them
to a new project.

<STANDARD>, To import the HP-GL files into
BoardMaster and assign themto the Standard project.
After importing LMD files, data is positioned immediately in the middle of
the working area for the circuit board plotter. Moreover, the production
data and the required tools are automatically assigned to the data: If it is
not possible for BoardMaster to assign one or more tools, the following
message appears:
Figure 50: Import

In this case, it is necessary to assign the tools manually in the tool
assignment dialog box or to complete the tool library before importing
the data again.
After exporting the files, all tools required are listed in the CircuitCAM
report window.

10.4 Edit Menu
Figure 51: Edit Menu

10.4.1 Assigning Tools
Each job in BoardMaster consists of one or more projects. Here, aproject is designated to be a circuit board imported as LMD file or HP-GL
project.
Select the entry TOOL ASSIGNMENT in the EDIT menu to open thefollowing dialog box:

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Figure 52: Edit tool assignment

Generally, the production data is read in by importing it in the file menu.
These projects can, however, also be inserted at this point (LMD filefrom CircuitCAM) or generated (HP-GL files).
The LMD files generated during export in CircuitCAM contain the
production data for the entire circuit board. The LMD files imported into
BoardMaster are listed in the project list. The CircuitCAM layers with
their production phases (phase) are listed in the field Phase file/Layer.
Each of these entries contains one or more pieces of tool information(pins) with the assigned tools from the BoardMaster tool library (tool).
If automatic tool assignment was not possible (see above), it isnecessary to perform it here:› Select the Layer from the list, for which this assignment is missing.
› Open the Pen list field and check whether a tool is assigned to each“pin”.
› If not, select the tool to be used here from the Tool list field.
Repeat this until all tools have been assigned correctly.

To create a new project:
Such a project (LPR) consists of one or more HPGL files.
› Click CREATE PROJECT... to create a new project.
› Assign a name for the project in the dialog field ENTER NEW LPR
NAME:

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Figure 53: Enter new LPR name› Click OK to close the dialog box.
› Enter the resolution for the HP-GL files associated with the project inthe text field UNIT.
The HP-GL files have a standard resolution of 0.025 mm. If you want touse data with a different resolution, please change the setting for the
HP-GL unit:› Click ADD to add the desired HP-GL files to the project.
Note: All HP-GL files for a project must be located in the same
directory.
You can remove HP-GL files from a project by marking thecorresponding entry in the list field PHASE FILE/LAYER and clicking
REMOVE.
It is necessary to assign the following information to each HPGL file withproduction data in FILE/LAYER:PHASEIn this list field, select the phase to be assigned tothe production data.

PIN/TOOL Select the pin for the HP-GL file in the LIST field pin
to which the tool selected in the list field TOOL
is to be assigned.
Y=>-Y

Activate this control box to allow simultaneous,coincidental display of both sides of the circuitboard for production data generated as a mirror
image (generally, the bottom for all production data).

› Click SAVE AS to store the project as an LPR file.
In order to reopen a project stored as LPR file, after restarting theBoardMaster program, select the entry LMD OR LPR... in the submenu
IMPORT in the FILE menu.
or:
Click ADD PROJECT to add a project. This can be an LMD file
generated with CircuitCAM or an LMD file (HP-GL project file) generated
with BoardMaster.

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10.4.2 Placing Projects
After you have imported or generated the required projects, you canplace them in the BoardMaster working area. Imported projects areautomatically positioned in the center of the working area or thepredefined base material.
Select the entry PLACEMENT... in the EDIT menu to open the following
dialog box:
Figure 54: Placement

To place a project:› Click Add... and select a project from the list. Or:
Select the project whose positioning you want to change on the left
side in the list field.
› Enter the desired scale for the project in the text field SCALE.
The default value for the scale is 1, indicating scale 1:1.
However, you can also define another scale here, for application such as
front plate and plate engraving.
› Enter the desired position for the project in the working area in the
text field X and Y under ORIGIN. These values refer to the HOME
position for the circuit board plotter and the data origin.
If you do not know the exact position of the data in the coordinate
system, you can enter the value 0 and 0 here and position the project inthe working area with the aid of the function bar/mouse.
› Select the appropriate offset for the project in the working area under
ROTATION.
› If you want to complete more than one prototype for a project, define
the number of multiple boards under COUNT. Enter the number ofboards in the X direction in the first text field and the number ofboards in the Y direction in the second text field.
› Enter the interval of the boards under DISPLACEMENT. Enter the
displacement of the boards in the X direction in the first text field andthe displacement of the boards in the Y direction in the second text
field.

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The displacement of the boards in relation to one another mustcorrespond to at least the length and width of the circuit boards, because
otherwise, the boards would overlap.
Multiple boards can also be created with the function bar.
Centering a project on the base material:› Select the corresponding project in the list field.
› Click CENTER to position the selected project in the center of thebase material.
To add other projects for placement:› Click ADD.
› Select the project to also be positioned on the base material in thelist field:
Figure 55: Select Project› Click OK to close the dialog box.
To remove a project already positioned:› Select the corresponding project in the list field.
› Click Delete to remove the positioned project from the base material.

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10.4.3 Select Tools
The SELECT dialog window can be used to disable individual tools forprocessing in the current production phase.
The dialog window shows all of the tools used in the current production
phase. Normally all tools in the list are marked (dark background), i.e.
enabled for use.
Clicking one of the tools allows it to be disabled (light background) or
enabled (dark background). Disabled tools are not used for processing
during the production phase, even though they are included in the
project.

Figure 56: Select Tools

Example:A dull drill is detected while drilling. By selecting only this tool, pressing
ALL+ and START, only the holes with this tool are repeated, all others
are ignored.
Moreover it is possible to define in this list field, whether the smallest
tool is to be used first (recommended for milling insulation), followedby the next thicker tool, or if the current tool is to be used first (fordrilling, to avoid unnecessary tool changes).
A detailed description of the tools can be found in the chapter „The tools“
on page 82.

10.5 Reload Dialog Box
The function RELOAD serves for reloading a circuit board which has
already been completed and cut, in order to drill additional holes,
engrave text or separate the conductors for coding.
The prerequisites for using the reload function include a circuit board
requiring reprocessing and the circuit board data as LMD file with atleast two identifiable points (holes, reference marks, vectors), which canbe assigned to the corresponding points on the circuit board.
The main purpose of the reload feature is to position the data so that it
coincides with the circuit board to be processed. For this purpose, two
identifiable points in the data (reference points) are assigned to thecorresponding points on the circuit board to be processed.

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When RELOAD is selected, the floating dialog box RELOAD
MATERIAL is opened.
Figure 57: Reload Material

To reload, the following steps are required:

Danger: Activating one of the following buttons on the function bar,sets the connected circuit board plotter in motion! The danger ofpinching and crushing exists!
Ensure that no one can enter the hazard area of the circuit board
plotter during the operating phases controlled by BoardMaster orcome into contact with the tools!
Work sequence:› Fasten the circuit board to be reloaded on the plotter.
› Import the LMD file with the corresponding data for the circuit board.
› If not already accomplished, open the RELOAD MATERIAL dialog
box. Switch on the switch for Point 1 and select the first reference
point on the data (center point of solder eye or hole, corner point).
› Move the mark to the desired position by clicking the keys
CENTER or CORNER.
- Hole selection only
- Pad selection only
› Move the machining head with tool installed or the cross hairs on thecamera (LPKF CircuitView Option) as exactly as possible to theappropriate point on the circuit board. For this purpose, use themotion keys on the function strip:› Then click the Read button to store this point.

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2nd reference point.
› Mark the check box Enable.
› Exit the dialog box by clicking OK to activate “Reload“.
› Select the data to be sent to the plotter. The data is converted tocorrespond to the position of the circuit board after clicking Start.
Then cancel the mark in the ENABLE check box to prevent the datafrom being aligned for later jobs. Exit with OK and close the floating
dialog box.

10.6 View Menu

You can adapt the graphic display of the BoardMaster working area toyour specific requirements with the functions in the View menu:
Figure 58: View menu

ZOOM AREA

Select this function to display a freely selectablecutout of the working area to fill the screen.
For this purpose, press the left-mouse key andhold down while moving the mouse to define
the desired area. You can also select thisfunction by clicking

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on the function bar.

ZOOMING 1.5x

Select this function to increase the graphic
display by a factor of 1.5.

ZOOM OUT 1.5x

Select this function to decrease the graphic
display by a factor of 1.5.

MACHINE

Select this function to display the entire working
surface of the circuit board plotter in theworking area.

MATERIAL

Select this function to display the entire basematerial surface in the working area.

ALL PROJECTS

Select this function to display all positioned
projects as largest possible in the working area.

PREVIOUS

Select this function to return to the previous
screen display.

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BOTH SIDES

Select this function to change back and forth
between simultaneous display of both sides of
the circuit board and display of only one side of
the circuit board.

REAL TOOLS

Select this function switch display of the milledlines in the actual width ON and OFF. The actual
width of the milled lines is defined in the tool
library.

DEFAULT FONT

Select this function to change back and forth
between the Windows system font and the font
set under CHANGE FONT for display of the text.

CHANGE FONT... Select this function to select the font to be
displayed when the DEFAULT FONT isdeactivated.

10.7 Selecting Production Phase
Before sending milling or drilling data to the circuit board plotter, it is firstnecessary to select the production phase to be processed. This can beselected on the function bar in the list field PRODUCTION PHASE:
Figure 59: Production Phase

Select the production phase to be processed next. Ensure that only one
production phase is marked to which an HP-GL file or LMD file has also
been assigned. Erroneous selection leads either to erroneous files being
processed or no data being transmitted at all.
An example for the sequence for the production phases for a doublesided circuit board is given below:
Process

Production phase

Configuring tools for tool change

MarkingDrills

1. Drilling

DrillingPlated

2. Milling bottom

MillingBottom

Turning base material78

3. Milling top

MillingTop

4. Cutting outside

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10.8 Automatic Tool Change
The dialog box shown in figure 60 on page 79 can only be called up
when machines with automatic tool changing unit are used. (example
ProtoMat 95s, H100 and so on). If you now open the TOOL list field on
the function bar, only the thirty or seven tool positions with theircorresponding tool assignment are displayed instead of a list of all tools
as for circuit board plotters with manual tool change.
Figure 60: Automatic tool change

Note: When the program is started for the first time, the tool
<UNKNOWN> is assigned to each tool position, i.e. no tool entered.
This is intended to cause the user to check the tools in the circuitboard plotter magazines and assign the corresponding positions in
the TOOL POSITIONS dialog box. It is absolutely necessary toensure that the tools in the tool box coincide exactly with those
assigned in BoardMaster in order to prevent using the wrong tools
and therefore malfunctions.
Open the TOOL POSITIONS dialog box by clicking the TOOL list fieldwith the right-mouse key:
A tool can be assigned to the tool positions 1 to 10 by selecting the tool
required for the production phase from the appropriate list field.
If a tool position is not assigned to a required tool, this dialog box is
opened automatically when the production phase is started. It is possible
to continue only after all tools have been assigned a position!
The tools required for the selected production phase are listed in the list
field WANTED FOR CURRENT JOB (PHASE).
The option SELECT indicates the tool momentarily located in themachining head.

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The CURRENT life cycle and the MAXIMUM life cycle are indicatedfollowing each tool.
It is necessary for the New check box to be switched on when a used
tool is replaced by a new tool in the tool box. The current life cycle isthen reset to 0.
When exiting BoardMaster, the tool assignment in BoardMaster are
stored under the name extension *.TLS and automatically reloaded eachtime BoardMaster is started.

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11.0 Operating ProceduresThis chapter explains all common operating procedures with the circuitboard plotter as well as the tools and their application possibilities.
Special applications are also explained, which are not necessarily
important immediately for “beginners” and therefore may be
confusing at the beginning. As “beginners”, you should, however,always work your way through the following subchapters:• Fastening the base material• Drilling• Insulation milling• Contour milling in circuit board material• Cleaning the circuit board
The remaining subchapters in this chapter can be read later if required
when you are familiar with the circuit board plotter.

11.1 Fastening the Base Material
When the machine is started up for the first time, you will note that adouble-sided piece of base material is already present on the machinebase plate. Moreover, a reference hole system is preset at the factory. If
you have to process different sizes of base material, it will be necessary
for you to first create a new reference hole system if this is not alreadyexistent. This procedure is described in detail in the BoardMaster
chapter.
The primary preparations are explained in keywords here. If you areworking with a LPKF circuit board plotter for the first time, perform
this work only after you have worked through the BoardMaster
chapter. You will be referred to it at the corresponding point in the
manual!
› Drill coincidental reference holes in the base material and drilling
plate in the X direction (diameter 3 mm). This can also be
accomplished with any desired drill press. Note that the diameter isreduced by galvanic throughplating.
› Move the machining head to the PAUSE position. Insert referencehole pins into the reference hole strips on the left and on the right.
› Position the base material on the reference hole pins.

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Figure 61: Fixing the board

1- Machine bed (aluminum base plate)
2- Reference hole pins, 3 mm diameter3- Base material approx. 1.6 mm thick
4- Drill underlay material

The reference hole pins hold the circuit board in position. This isparticularly necessary during contour milling. On the other hand, they
are also used as a reference when turning double-sided circuit boards.
Danger! Switch on the vacuum before milling/drilling! Remember toreplace the vacuum filter as required! Inhaling the material dust
poses a health hazard!
Note: It is important that no contamination (adhesive tape residues,
drilling or milling chips) is present between the individual layers sothat the base material lays perfectly flat. Small particles below thebase material would have a negative effect on the uniformity of themilling depths.

11.2 The tools
All tools are fitted with spacer rings to ensure the precise pick up and set
down of tools. The different tools are marked by different colours:
In addition the diameter is indicated on the spacer rings, e.g. 1 for 1 mm,
and .1 for 0.1 mm diameter.
Figure 62: Tools with ring and colorcode

1
1- Spacer ring with color code

Tool type
Drills
Universal milling cutter/
Micro--milling cutter
RF-Endmill cutter
End mills
Contour cutter
Endmill long

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Color
green
orangeDiameter (in mm)
0.2-2.4 ; in 0.1 steps
0.1 and 0.25

blue
violetyellowlight green

0.1; 0.15; 0.25; 0.4
0.8; 1.0; 2.0; 3.0
1.0; 2.0; 3.0
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11.3 Drilling
In addition to milling, drilling is one of the primary purposes of the circuitboard plotter. Circuit boards are drilled with special circuit board drills.
It is only possible to drill one circuit board at a time.
Never attempt to drill a number of circuit boards on top of one
another! A drilling cover plate is not required. All drills have a length of
38 mm. Further instructions are contained in the Chapter „Practical
Tips“ on page 87.
Caution! Before drilling, ensure that the base material is seatedtightly! Switch on the vacuum!

11.4 Insulation Milling
Insulation milling is the designation for cutting milled tracks around thelater conductors. This insulates the conductors from the remaining
copper coating. Various types of tools are available for the different
materials and applications (see figure 8 on page 21). Each of these tools
produces different milling tracks (see figure 64 on page 84).
Figure 63: LPKF Unversal cutter,micro cutter and RF
cutter1

2

3

1- Universal milling cutter
2- Micro milling cutter
3- RF milling cutter

Universal milling cutter
Before milling, it is necessary to ensure that only sharp LPKF universal
milling cutters (36 mm long) are used. The milling width can be adjusted
between 0.2 and 0.5 mm according to the thickness of the tool bychanging the milling depth.
Note: It is advisable to degrease the base material with a cleaning
spray before processing (degreaser for electronic components).
This allows the drilling chips to be vacuumed up more easily.
In principle, the milling width should not be smaller than 0.2 mm. If work
is accomplished only with the front-most tip of the milling cutter, the tool
wears more quickly than at greater milling depths.

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Micro milling cutter
Finer insulation channels can be produced with the LPKF micro milling
cutters, however, the service life of these cutters is approx. 10% of thatof the LPKF universal milling cutters mentioned above.
Caution! Do not mix up micro milling cutters and universal milling
cutters! The two can only be differentiated under a microscope.
RF milling cutter
A special cutter which produces a rectangular insulation channel in one
cut has been developed specially for RF technology.
Figure 64: Milling track by LPKF
Universal cutter,
Micro cutter and RF
cutter1

1- Milling track,

universal milling
cutter2

2-Milling track

micro milling
cutter3

3-Milling track

RF milling cutter

Further information is given in the Chapter „Practical Tips“ on page 87.
After processing, it is necessary to clean the circuit boards. This can beaccomplished with a brush machine or manually with board cleaners(LPKF accessory). In all cases, it is necessary to rinse the circuit boards
thoroughly with water to rinse off any copper dust resulting frombrushing.
After rinsing, it is necessary to dry the circuit board well (hot air gun) andthen protect it against oxidation with soldering varnish.
Caution! Before milling, ensure that the base material is seatedtightly! Switch on the vacuum!

11.5 Contour Milling in Circuit Board Material
The contour milling cutters should always be used for cutting out thecircuit board after it is completely machined or for drilling holes with adiameter greater than 2.4 mm when the circuit board is to be cut throughin the entire material thickness.

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Figure 65: Contour cutter (1) end
mill (2)1
2
1- Contour cutter
2-End mill

The motion rate should be reduced for contour milling. The speed varies
from material to material. Use only special contour cutters (38 mm long)with a diameter of 1 or 2 mm if possible.

The 1 mm contour cutter should be used for internal cutouts (small inner
radius). Due to the lower stability, the feed rate should be reduced to aminimum.
The 2 mm milling cutters are considerably more sturdy, however, remove
less material than the 3 mm contour cutters.
So-called “End mill” cutters are used for contour milling on soft RF basematerials instead of contour cutters.
Caution! All speeds and feed rates specified in BoardMaster refer
to FR4 material. Other materials (in the form of libraries) can beselected in the menu CONFIGURATION/TOOL LIBRARY / MILL/DRILL ... /LOAD. Lower feed rates should be used initially for allother materials.
Danger! Remember that carcinogenic dust (from fiber glass) can
occur when machining material such as FR4. Therefore, always
work with vacuum switched on. Always use microfilter.
Danger! Vitally hazard gases can occur when machining somematerials !

11.6 Milling Wide Insulation Channels
Figure 66: End millWide insulation channels can be cut with a 36 mm long two-tip cutter(End mill). Various diameters are available.
The 3 mm two-top cutter is particularly suited for milling very wide
insulation channels (VDE specifications).

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11.7 Cleaning Circuit Boards
Before installing the equipment, it is necessary to carefully clean thecompletely milled circuit boards. This can be accomplished with a circuitboard brushing machine or by hand.
To clean by hand, place the circuit board on a level surface. Brush thecircuit board in the primary direction of the conductors with a wet circuitboard cleaner (e.g. LPKF board cleaner PAD). Brushing is required toremove the oxidation layer and also remove chips in the insulation
channel. After brushing, the circuit board should be metallically bright.
From now on, the circuit board should only be touched at the edges withgloves. Then rinse off the circuit board preferably under hot flowing
water to remove any brushing chips from the insulation channels andthen dry with a hot air gun.
Caution! Never blow off with compressed air, because the oil
particles contained in the compressed air can cause problems
during further processing.
After drying, spray the circuit board with solder varnish on both sides.

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12.0 Practical Tips
This chapter contains tips gained from practical experience on various
aspects of circuit board production with your circuit board plotter. We
recommend reading these tips before operating the circuit board
plotter to familiarize yourself with a few possible sources of error
and exclude them.
Milling depth:

Adjust the milling depth so that engraving is too
deep rather than too shallow. If the engraving is too
shallow, the milling tool wear more quickly.
Evacuation of the milling and drilling chips with thevacuum attachment is also important for precise
milling depth.

Milling depth
irregular:

Is the machine bed really clean?
Adhesive tape residues or similar can have a higheffect on the milling depth.
Milling chips between the machine bed, drilling
plate and base material can also reduce theaccuracy.

Deformed based Bend highly deformed material so that the sagpoints downward; then fasten the edges well withmaterial:
adhesive tape.
Loops between
milling tracks:

Loops between the milling tracks can occur fromincorrect milling sequence, particularly with circles.
When a circle is milled counterclockwise with a tool
which rotates clockwise, overlapping milling tracks
can lead to fine loops between the copper surfaces. The cause is a reduction of the cutting speed
at the outer edges. The solution here is to define
the correct milling sequence in LPKF CircuitCAM.
The LPKF CircuitCAM standard processing alreadycontains the correct milling directions (see LPKF
CircuitCAM Manual).

Milling burr:

A milling burr can be caused by dull tools orincorrect feed rate. If the structure to be milled
allows, this can be corrected by setting deeper.
Otherwise, replace tool.

Burr duringcontour milling:

Burrs during contour milling or unclean cut edges
result either from a dull tool or incorrect feed rate.

Color of milled
channel:The color of the milled channel provides
information on the condition of the tool with somematerials. With epoxy materials, dark insulation
tracks indicate that the tool is sharp, light tracks
that the tool is dull.
Drill burrs occur with dull tools: In this case, replace
the tool (drill). Another possible cause can be toohigh speed during lowering of the machining head.

Drill burrs:

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Deviation of drill: Deviation of the drill occurs particularly with thintools which are no longer fully sharp. However, italso depends on the surface structure of thematerial. For example, when the fiber glass
structure on FR4 materials is pressed through by
the copper, deviation of the drill is unavoidable
even with a sharp tool. On materials withadditional, removable copper foil (FR4 material
with 9 µm or 5 µm Cu coating), deviation of the drill
is very low. The holes can be center-punched firstin an additional step. This also prevents deviationof the drill.

88

Glazing of hole:

The hole tends to become glazed by the basematerial melting when the drill remains in the hole
too long after drilling through. These holes thenpresent problems for through-contacting. If
necessary, reduce drilling times.

Drills break:

Drills tend to break when the drilling plate has
already been used numerous times. The drilling
plate should be changed with each new circuitboard: If a drill hits against the edge of a holealready present in the base plate, breakage canhardly be avoided. Always remove broken tools
from circuit boards and drilling plates.

Uneven milling
channels:Milling channels when milling foil become unevenwhen air is present below the film. If the film isfastened with stretchable adhesive tape, the film
can become wavy after a time. Particularly
important here is the evenness of the milling base
(LPKF engraving foil base).

Burr with foil
milling:

Burrs during foil milling occur either as a result of adull tool or milling too deeply.

Offsets between
top and bottom
sides:

Offset between the top and bottom side occurs
when the HOME position has not been
programmed precisely, the reference hole pins are
positioned at an angle or loose.

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13.0 Other BoardMaster Functions
13.1 Learning Fiducial (Option)
Here the image processing software for the recognition of fiducials is calibrated. Fiducials are learnt and the scale is adapted. For the H100 circles or drill holes, respectively, can be used as fiducials.
Considering the available camera image area, drill holes with a diameterof 1.5mm are especially favourable.
For the calibration proceed as follows:› Choose a 1.5 mm drill and drill a hole on the free area on the basis
material.
› Move the camera directly over the hole (see following image). To dothis, use function "Camera >> Head“ from the menu "Move to".

Figure 67: Drill hole in camera field› Open the dialog FIDUCIALS from menu CONFIGURATION.

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Figure 68: Settings fiducial
recognition

Explanation of the settings:
IMMEDIATELY RECOGNIZED IF HIGHER THAN
The fiducial is considered as immediately recognized if the percentage
recognition is higher than the entered value. In this case it is not tried toget an improved result. If the value is smaller, the detected center of thefiducial is moved to the center of the camera image to perform a further
recognition.
TRY ON NEXT SPIRAL POSITION IF LOWER THAN
When the recognition is lower than the entered value, the next positionin the search area is moved to. The search area is traversed startingfrom the middle in a square-shaped and helical way. The distance
between the search positions is selected such that the whole searcharea is covered.
MOVE TO CENTER IF IMPROVEMENT IS HIGHER THAN
This parameter is connected to „Immediately recognized if higher than“.
If an improvement higher than the entered value is achieved by moving
the fiducial to the center of the image, then another displacement isperformed. At each recognition the center of the fiducial is determinedagain, and used when another displacement takes place. This
displacement and recognition is continued until the improvement is lower
than the entered value, or the value for „Immediately recognized if higher
than“ is reached.
SPIRAL SEARCH AREA SIZE
This defines the area in which a fiducial is searched for. This area ischecked in a helical way, starting from the center of the fiducial in the
LMD data. The area should not be defined larger than 2 mm as thesearch process may then take a very long time.

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This determines for how many seconds each fiducial is shown in thecamera image after a successful recognition before the next fiducial to
be searched for is moved to.
MAX. STRETCH THRESHOLD
During fiducial recognition the distances between the recognizedfiducials are detected. If the difference of the detected fiducials and thefiducials of the LMD data is too big, then the alignment will not takeplace. A corresponding error message is displayed. The entered value
determines the maximum percentage difference.
REQUIRED NO. OF FIDUCIALS
Here is determined how many fiducials must be recognized so that thealignment can be performed. If the number of recognized fiducials is
lower, then an error message is displayed. If the number of required
fiducials is set to 3, but 4 fiducials are present in the data and 4 fiducials
have also been recognized, then the alignment after 4 fiducials is used.
TRAINED FIDUCIAL
The list field shows the stored fiducials. If an entry is selected from thelist, the corresponding image is displayed in the window Trained fiducial.
The image loaded when dialog box FIDUCIAL RECOGNITION
is opened, is again displayed when the dialog box is closed by clicking
on OK or ESCAPE.
LOAD
Click on the button LOAD and the image of the fiducial selected in thelist and displayed in the window TRAINED FIDUCIAL is taken overwhen the dialog box is closed with OK . When the dialog box is closedwith ESCAPE the image loaded when the dialog box FIDUCIAL
RECOGNITION is opened will again be displayed.
DEFAULTA click on the button DEFAULT sets all settings back to the originalvalues. Thus all values are set as after the start of the program.
› To start, press the button CALIBRATE in the static field.
If the calibration was successful, then BoardMaster displays thefollowing message.
Figure 69: Fiducial recognition› Confirm the message by clicking on OK.
There may be several reasons if the calibration was not successful,which can be recognized through the corresponding BoardMaster message:

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Error

Correction

Brightness or
image contrast too low!

Adjust setting at the objective and adjust
brightness.

Hole not roundor too muchburr.

Drill again with new tool.

After the galvanic process
the copper
surface is very
shining, fiducials are notrecognized.

Roughen the surface of the board in the areaof the fiducial holes by means of emery paperor similar material.

Speed for lowering head is too high. Decrease
the speed for lowering by adjusting the throttle
valve.

The representation of the hole to be measured should be as shown in
the following figure.
Figure 70:

Here fiducial recognition is finished.

13.1.1 Adjusting Milling Depth
To adjust the milling depth:› To adjust the milling depth, select a milling cutter from the tool list
field. The tool change will be done automatically.
› Move the machining head with the aid of the arrow keys andincrement adjustment to a free point on the base material where you
can make a cut for checking.
› Set the motion increment to 10 mm.
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Other BoardMaster Functions› Switch on the vacuum system!
› Switch on the motor by clicking› Click the.

raise/lower button to lower the machining head.

› Move the machining head with the arrow keys.
› Click theraise/lower button again to lift the machining head.

› Switch off the motor by clicking.

› Switch off the vacuum system› Move the machining head far enough away from the sample cut andcheck the depth of the cutting line with the aid of the measuring
magnifier.
If the desired depth was not reached, adjust the milling cutter higher orlower with the knurled knob and repeat this operation until the desired
depth or height is reached.

Manual adjustment of the miling depth
The milling depth can be adjusted by turning the knurled nut on theworking depth limiter. When the wheel is turned clockwise, the milling depth is increased, turning counterclockwise reduces the milling depth.
• Turning the knurled nut by one increment changes the milling
depth by approx. 4 µm.
• Turning the knurled nut one complete rotation changes the milling
depth by approx. 0.5 mm.

13.1.2 Drilling Reference Holes in Base Material
This is required if you want to use a new piece or difference piece ofbase material. The values specified here apply for the base material size
present when the machine was delivered (9“ x 12“). For other basematerial sizes, it is necessary to set other increments and where applicable, drill new reference holes in the reference strip. To drill referenceholes, it is necessary to ensure that the circuit board plotter is ready for
operation and BoardMaster is opened. Then proceed as follows› Move the machining head to the PAUSE position by clicking themenu Go to... - Pause position› Carefully remove the reference pins with a pair of flat-nosed pliers.
Ensure that the red reference hole strips do not slip and are notpulled out.
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Other BoardMaster Functions› Position the drill template and base material on top of one anothercentered on the machine board and fasten it on the longitudinal sides
with masking tape (we recommend Tesakrepp 5250).
› Then select Spiral Drill 3.0 mm in the tool list field in BoardMaster.
The mache changes the tool.
› Move to the HOME position (menu bar Go to...- Home position)› Move the machining head with the aid of the arrow keys andincrement adjustment across the base material in the negative X
direction (not in Y direction under any circumstances), until aninterval of approx. 5 mm is present between the front edge of thebase material and drill .
› Move the machining head 295 mm in the X direction (for thispurpose, set increment to 295) and check visually whether adistance of approx. 5 mm is also present between the edge of thebase material and drill to ensure that later holes are not drilled
outside of the material (see figure above).
› Switch on the motor by clicking.

› Switch on the vacuum and click the raise/lower button
the drilling head.
› Click the raise/button again› Switch off the motor by clicking

to lower

to lift the drilling head.
.

› Switch off the vacuum.
› Move the machining head back 295 mm in the negative X direction
and drill the second hole there after performing the same steps as
described above.
› Check whether the rear hole has been drilled all the way through. If
not, move the machining head back 295 mm along the X axis over
the rear hole and adjust the working depth limiter lower as required.
› Redrill the hole according to the same instructions as above.
› Also check the front hole. If it is also necessary to rebuild it, move themachining head to above this hole and perform the same steps as
for the first redrilling operation.
The circuit board plotter only drills the holes in the base material,
because they have to be precise within 1/100th mm. On the other hand,
the holes in the drilling template can be drilled with a normal drill. If you
want to use a different size of base material, first drill new referenceholes in the reference hole strip (see also Chapter "Special Features" onpage 95).

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13.1.3 Special Features
13.1.3.1 Tool box dialog box
Access to the tool Box dialog box is possible by clicking TOOL BOX... inthe menu CONFIGURATION.
Figure 71: Tool Magazine

The TOOL BOX dialog provides information about the tool magazine of
the machine. Moreover, properties can be modified.
Within the tool list, modifications may be made for
Name, XY Position, life cycle.
CURRENTThe current working time of the marked tool, in mm.
MAXIMUM
The maximum service life of the marked tool (in mm or strokes)
HEAD UP/DOWN
By means of this button the mill/drill head can be moved upward or
downward with the value that is set for the selected tool (function is not
required for normal operation)
MAIN/AUX CLAMP OPEN / CLOSE
With this button the clamp can be opend or closed if a tool is to be removed or inserted. The clamp should be kept closed To protect the material
from wear the clamp should be kept in a closed state.
Press the SERVICE button: you are asked to enter the service password(see „Service password dialog box“ on page 96). Subsequently all control elements that were so far inactive are then represented as active.
Here, a manual check of the positions preset by LPKF for automatic toolchange is possible. Normally, it is not necessary for the user to makeany changes, because this has no effect on the milling and drilling. The
numerical values entered are a configuration example.

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The coordinates entered can be written over by the momentary positionof the machining head by pressing the ACCEPT button. Check theposition of the machining head carefully before activating ACCEPT.
Clicking CHECK moves the head to the corresponding point to checkthe position.
CHECK:The position of the selected tool is checked. If there is no tool selected,
the first position will be checked. The head with the camera moves to theset position.
ACCEPTThe values entered in the list are stored.
CAUTION: Always observe that it is possible to write over thecurrent, correct positions that a hazard for the user and damage tothe machine are possible!
SEARCH (only possible with camera option)
Tool positions 1 to 10 are newly measured. This function is only required
for the initial adjustment of the machine at the company site.
INTERPOLATE
The positions are detected using the interpolation method. Basis values
are the first and the last position. If you have made modifications, thenyou must press ACCEPT to store the values.
CHECK TOOL POSITIONSThis function can be used to check the tool change after a calibration
has taken place. The positions are checked depending on the checkboxes that are selected. The tool is seized and immediately put back down
again. In case a position is not equipped with a tool then the position
remains grey and cannot be selected.
Note! The circuit board plotter must be switched on and connected
to exit the TOOL BOX WINDOW.

13.1.3.2 Service password dialog box
For service, the following box appears requesting entry of the password
after clicking SERVICE in the dialog box TOOL BOX... in the
CONFIGURATION menu.
Figure 72: Service Password

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It is then possible to change the settings in the dialog boxes specified.
CAUTION: These changes should be accomplished only by
personnel trained in the function and operation of the ProtoMat
S62! Always observe the operating notes and safety precautions toprevent injuries to humans and damage to the machine! If you areauthorized to make such changes, enter the password[ bmaster ].

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14.0 Special Applications
14.1 Front Panel Engraving
It is possible to engrave the front panel (e.g. on electronic housings) withthe circuit board plotter. Symbols and labels can be created in thismanner.
Figure 73: End mill and universalcutter

1

2

1- Two-tip cutter

2-Universal cutter

When engraving it is necessary to adapt the feed rate to the engraving
depth and material.
Use LPKF universal milling cutters or LPKF two-tip cutters.
Danger! When engraving, always work with vacuum! Danger of
unhealthy dust!
It is possible to cut through aluminum front panels with a material
thickness of up to 3 mm.

14.2 Milling Solder Resist Foils
So-called solder resist foils such as are frequently used in circuit board
production, can be completed with the circuit board plotter. The following
description assumes complete knowledge of the operation of the circuitboard plotter including the BoardMaster software. This chapter can beskipped by beginners for the time being during initialfamiliarization and read later as required.
Settings:
Tool:
Tool diameter:
Rotary speed:
Speed:

Micro cutter
0.15 mm40,000 rpm
10 mm/s

Adjust the milling depths in the unused marginal area of the solder resist
foil as follows:

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Special Applications› Mill a square with dimensions of 2 x 2 mm with the GO TO button in
BoardMaster with motor and vacuum switched on to determine themilling depth.
› Measure the current milling depth (width), correct as required andmill another square to check.
› Then start the milling operation with the data prepared with the data
edited with CircuitCAM.
› After completion of the milling operation, check whether all pads
have been cut out. If not, start the milling operation a second time.

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15.0 Appendix
15.1 Switching over the device voltage
If it is necessary to change the machine voltage, proceed asfollows:
Danger! Before working on the fuses or opening the machine,
always disconnect the line power plug to exclude electric shocks!
The LPKF ProtoMat electronic box is fused on the primary side as well
as secondary side. The line power side fuses (primary side) are locatedin the line power connection for the control and are accessible from theoutside.
Note: To have easier access to the fuses it is recommended to
unscrew the right-hand part of the cover using the 20-torx tool(contained in the accessories)!
The voltage value located at the mark (2) is always set (seeillustration below)› Carefully pull the labeled cover (1 in figure below) out of the line
power filter housing with the aid of a screwdriver.
› Then insert the fuse module into the line power filter housing turned
around.
Fig. 74:Voltage setting and fuses

1
2
The secondary side fuses are located inside the control. In order to haveaccess to the control board, the machine must be disassembled.
› Displace table to the rear side of the machine› Detach the screws› Pull out the upper plate› Detach four screws› Move the detached lower plate to the rear.
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Figure 75: Fixing screws of base
plate

1

1

1

1 Schrauben

Then the control board is accessible, see following figure.
Fig. 76:Control board with fuseholders

1
3
2
1- Fuse holder, current for spindle motor
2- Fuse holder, current for X/Y/Z axis
3- Fuse holder, current for 5V, 24 V

› Remove the fuse holder.

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Figure 77: Fuse holder

12

1- Fuse holder
2- Fuse› Pull fuse out of holder and exchange it.
The secondary circuits are protected by fine fuses as follows:

Fuse

Type

Circuit

F1

1AM

Spindle motor

F2

2.5 A M

X/Y/Z axis

F3

3.15 A M+5V , 24V

Reassemble the units in the opposite order as described above fordisassembly.
If the table cannot be displacing due to a defective stepper motor, thenthe machine must be put on its side so that you have access to thecontrol board from the bottom side.
› Put machine on one side inside the hood
› Detach 8 screws at the bottom› Pull out board with transformer› Exchange fuse.
Reassemble the units in the opposite order as described above fordisassembly.

Before switching on, always ensure that the head and motor cables are
positioned correctly.
The fuses in the primary fuses are located in the line power switch which
also contains the line power filter and line power changeover switch(e.g. 230 V/115 V). The fuses should be slow-blow:• 230 V fuse with 3.15 A / T• 115 V fuse with 3.15 A / T

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15.2 MaintenanceIn order to guarantee a long-term and reliable operation of the circuitboard plotter, it es necessary to perform some maintenance work withincertain time intervals. This maintenance is limited to actions that are
simple and easy to execute and hardly need any time. The maintenanceintervals given refer to a plotter that is in use on a daily basis.
General checks:
The O-ring seals in the tool holders of the magazine should be greased
every 12 months to enable the optimal tool change.

› Grease with LPKF special grease (item no. 102244) every 3 months.
Caution! Use only small amount of grease!

15.2.1 X Axis, Y-Axis and Z Axis
• Check the guide shafts for the X and Z axis for cleanliness andgrease. If the shafts are dirty first clean them (brush or rag) andthen regrease lightly with standard commercial machine grease,
under all circumstances.
• Caution! Grease the transport spindle for the X axis regularly(LPKF special grease, item no. 102244)!
› To have access to the Y axis, loosen the two screws at the front andpull out the base plate to the front.
› To have access to the X axis, pull off the vacuum hose and loosen
the two screws of the casing.
Fig. 78:X and Z axis guide shafts

3

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Figure 79:Guide shafts andtransport spindle

2

1

1- Guide shafts Y-axis

2- Transport spindle Y-axis

15.2.2 Maintenance on Working Depth Limiter
Disassemble and clean the working depth limiter according to the
instructions below every three months when the circuit board plotter isused daily.
Danger: Always switch off the circuit board plotter with the main
switch before disassembling and cleaning the working depth
limiter. Otherwise, a pinching hazard exists from uncontrolled
motion of the machining head! There must be no tool in the collet!
After switching off the machine, proceed as follows (the numbers inparenthesis refer to the numbers in the illustration above):› Pull the plug from the head illumination (2) to the right.
› Pull the vacuum hose (3) away to the left.
› Loosen and remove the retaining block (1) using a Torx tool
Figure 80: Removing the retaining
block

2

1

3

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Fig. 81:Sequence for cleaning
working depth limiter

5
4› The working depths limiter (4) can then be pressed downward andpulled out to the side for cleaning.
› Unscrew knurled nut (5) from working depth limiter, clean thread withthe brush supplied and lubricate with graphite grease.
› After cleaning reinstall the working depth limiter in the opposite
order. Ensure that the retaining block fits in the groove in theworking depth limiter and that the knurled knut is engaged in
the retaining plate! The knurled knot must be able to rotate.
› Then assemble the retaining block.
› Connect vacuum hose and head illumination again
If the plastic foot of the working depth limiter needs to be exchanged,
e.g. because it scratches the material or if reference holes are to be drilled, then press the foot slightly and pull it out downward.
› To mount the foot, press it upward and let it engage (.
Caution, danger of injury during the mounting of the working depth
limiter if there should still be a tool in the collet!
For daily use of the circuit board plotter the food needs to be exchanged
approx. every four weeks.

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15.2.3 Maintenance instruction for Machining Head
Depending on the use of the machine the collet of the SF-Spindle should
be cleaned from time to time at a ProtoMat S62 system.
› Remove the connector of the head illumination (1).
› For cleaning, remove any tool that might still be in the collet.
› Dismount the foot of the working depth limiter (2).
Figure 82: Machining head

1
2
Cleaning the collet:
For the cleaning of the collet we recommend to use a special pipe brush(2) of the appropriate size.
Figure 83: Cleaning the collet

12

1 Collet2 Pipe brushCaution! Do not clean with compressed air! This would damage thecollet.

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15.3 Checking and adjusting the tool positions bymeans of the camera
It may be necessary to check and adjust the tool positions in themagazine if there are problems occuring during tool change.
› In order to check and adjust the tool positions of the magazin bymeans of the camera, first remove the tools from the magazine.
› Put measure insert (1 in the following figure, cap of the visionsystem, item no. 115 789) into the tool holder position that is to bechecked.
Figure 84: Measuring insert

1› Close the hood
› In the menu bar choose CONFIG and then TOOL BOX to open thetool dialog box. (A first setting is already stored stemming from thefirst installation of BoardMaster at the factory site).
› In the tool list click on the tool position that is to be checked› Press the SERVICE button
You are asked to enter the password› Enter password BMASTER› Press button CHECK (the number indicates the position to be chekked)› Move the processing head above the tool position using the arrow
keys of the main dialog ini the background until the cross hairs are
centered over the tool position.
› Click on button ACCEPTThen the tool position is entered. Repeat the process with other tool
positions if these are to be checked, too.
› Quit the tool dialog with OK› Open the hood and remove the measuring cap from the tool magazine.
› Open the tool magazin dialog under CONFIG in the menu bar› Confirm the enquiry „Move to pause position“› Insert the tools again in the tool magazine according to the tool list.

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Appendix› The measured settings are stored in the INI file. Quit and restart
BoardMaster so that the values are taken over.
Note! If there occurs a disturbance during the measurement and novalue can be measured for a position or the image in the camera field isblurred, it may be necessary to adjust the focus of the camera (see„Camera Functions (only for S62 with camera option)“ on page 54).

15.4 Checking and adjusting tool positions without
cameraThe tool magazine must be completely filled with tools in order to checkand adjust the tool positions in the magazine without a camera. There
must be no tool in the collet and the hood must be closed.
› In the menu bar press CONFIG and then HEADS
There must be no offset entered in this field, should there be entered
an offset then replace it by entering value zero. Close the dialog withOK.
› Open the „Configuration ... tool magazin“ dialog in the menu bar.
› Press the SERVICE button
The password is enquired› Enter password BMASTER› Use the mouse key to displace the dialog box to the bottom of thescreen, as you need to have access to the menu bar.
› Click on OPEN COLLET/AUX. CLAMP› Use the mouse key to click on the first position in the tool list
› Press CHECK
The machine moves to the first position of the tool magazine.
› Enter a high step width, e.g. 35 mm, in the main dialog under Z
A message is displayed asking if the movement border is to bereached. This message always appears when the value entered understep width reaches the area of the limit switches.
› Confirm with YES› Press button MOVE IN - Z DIRECTION
The machine head moves downward
If the correct value is adjusted, the machine head moves completely tothe bottom and upward again without the tool getting stuck in the collet
or being removed from the magazine.
If the value is not correctly adjusted and the machine head does not
move downward completely or the tool gets stuck, then modify thevalues for X or Y in the main dialog using small step widths of 0,1 mm
and test by renewed moving of the head until the head can move
downward completely and without problems.
› Store the correct value by pressing the button ACCEPT.
› Do the same for each tool holder position.

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Appendix› At the end quit the tool dialog box with OK› Quit BoardMaster and start it again so that the values stored in the
INI-file are taken over.

15.5 The Teach-In Dialog Box
BoardMaster offer the possibility of programming drilling and milling datafrom a template (film or circuit board) with the aid of a Teach-In process.
For this purpose, fasten the template to the circuit board plotter andmove to the individual positions to be programmed with the aid of thecamera image in LPKF CircuitView (option). The HP- GL file completed
in this manner can be read into BoardMaster after programming andoutput to the circuit board plotter.
When TEACH-IN in the EDIT menu is called, the following dialog box
appears.
Figure 85: Teach-In

STEP [MM]The values entered under X and Y [mm] indicates the distance moved
when the motion buttons (+X, -X, +Y and -Y) are pressed once.
To program the holes in an IC enter a value of 2.54 mm here. This
corresponds to a pad interval of 1/10".
HEAD:
The command for lifting or lowering the head can be programmed byclicking one of the two radio buttons (UP, DOWN). The head remains inthe selected position until the other radio button is activated.
This function is not used to create a drilling file, but only for programming
milling or contour data.
RECORD MOVEMENTS:
All movement command are stored in the selected file when this checkbox is activated.
PEN:
The pin number entered in this editing field is written to the selected fileas the Select pin command. This allows all drilling data even withdifferent diameters to be combined in one drilling file. Example: Pin 1 for
0.7mm, pin 2 for 0.9 mm, etc.
+X, -X, +Y, -Y:
These buttons serve for moving to a desired position. If one of thesebuttons is clicked, the machining head moves in the selected direction
by the value entered under STEP.

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EXIT:
Clicking this button discontinues the Teach-In process and closes therecorded drilling or milling file.
CREATE FILE:
After clicking this button BoardMaster requests entry of the name of a filein which the data to be programmed are to be stored. Here, it is possible
to either create a new file or to write over a file already present.
APPEND FILE:
Pressing this button, selects a drilling or milling file which already exists
to which the additional drilling or milling data are to be appended. The
new data are appended at the end of the selected file.
PIN [SP]:
The pin or tool number selected under Pin is added to the drilling or
milling file as the Select Pin (SP) command when this button is clicked. It
serves for differentiation of the individual drill diameters.
PLOT [PA]:With the aid of this button, the head (when RECORD MOVEMENT isswitched off), can be moved at angles not equal to 90°.
DRILL [PD;PU;]:
Press this button to program a hole at a position moved to previously.
This causes the command sequence Pen Down, Pen Up to be written
into the file. This command chain corresponds to a drilling command forthe circuit board plotter.
Procedure› Fasten the template (film or circuit board) on the circuit board plotter
as parallel as possible to the axis
› Open the TEACH-IN dialog box in the Edit menu
› Press the key CREATE FILE to create a file in which the data is to be
stored. Enter a name for the file.
After you have entered the corresponding name, the TEACH-IN dialog
box reappears.
› Switch on the option RECORD MOVEMENTS, before starting thereading operation.
The file to be created is an HPGL file meaning that it is also written
according to the steam for an HPGL file.
› First enter the desired pin number under PIN and then click the PIN(SP) button.
› Then move with the aid of the motion keys (+X, -X, +Y, -Y) to thehole positions to be read in and press the DRILL (PD;PU) button.
› After reading in all of the required holes, the data is storedautomatically, you can exit the TEACH-IN dialog box by pressing the
EXIT button.
The coordinates recorded are then available in the HPGL file createdpreviously.
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Appendix› Now select IMPORT - HPGL TO - NEW LPR... in the file menu,
select the HP-GL file just created and enter a name for the new LPR
project› To produce something with this newly created file using BoardMasterand the machine, open the EDIT PROJECT dialog box to assign all
required product phases and tools to the HP-GL file.
Moreover, set the unit corresponding to the machine resolution (e.g.
0.0079375) in the EDIT PROJECT dialog box (this value is also
given in the settings SETTINGS DIALOG BOX in the
CONFIGURATION menu).
Please do not forget to reset the unit back to the original value after
completion of this operation.
› Then continue as with LMD files imported from CircuitCAM.

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Options

16.0 Options
16.1 Installing the camera
The camera system for automatic fiducial recognition enables thedetection of the position of a panel or PCB on the table.
The camera is installed as follows.

In order to mount the camera (1 in following figure) at the machining
head, proceed as follows:› Remove the aluminium block (2) at the machining head.

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Figure 86: Mounting the camera

12› Fix the camera flush-left at the machining head using the screws thatare supplied.
Figure 87: Fixing the camera› Connect the camera cable on top of the camera (3) and then connect
the cable to the PC. To run the cable, use the supplied cablebrackets (4) at the exhaust hose.
Figure 88: Camera cable guidance

3
4

5

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Options› Connect the cable for the illumination (5) on the left side of thecamera (remove a peg first, if there should be one there).
Caution! After the installation of the camera the camera check box
in the parameter dialog must be activated (see figure 10.2.2 on
page 59 ) and the spring force at the mill/drill head must be
adjusted (see „Spring setting at the machining head“ on page 116).
Moreover, the camera focus must be determined (see figure 9.6 on
page 54) as well as the camera offset (see figure 10.2.5 on page 64).

16.2 Mounting the Vacuum Table
The vacuum table enables the fixing of rigid, flexible and flex-rigidmaterial free from distortion and warping. Thus fixing with adhesive tapeis no longer required. The table is connected to the exhaust system andconsists of the table and the sintered board.
To mount the table, it should be moved to the PAUSE Position.
› Connect the vacuum hoses of the exhaust system to both sides ofthe vacuum table (bayonet lock)› Screw the vacuum table to the base plate
Figure 89: Fixing screws vacuum
table

1
1

1- Screws for fixing the vacuum table

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Figure 90: Vacuum table,
connection to vacuum
hose

1

2

1 Connection hoses of exhaust system

12 Sintered board› Press the sintered board into the vacuum table.
› Unscrew the rear of the hood
› Remove the screws from the exhaust adapter inside of the rear
› Remove the exhaust adapter› Remove the seals for the vacuum table from the connections for theexhaust adapter
Figure 91:Connections to exhaustsystem, backside

2

3
1

1 Connections vacuum hoses (equipped withseals if no vacuum table is connected)
2 Rear wall

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Options

Figure 92:Backside open

2
1

1 Connection vacuum hoses

2 screws to be removed from the inside› Screw the connecting pieces to the backside› Insert O-ring seals› Put on exhaust adapter› Screw on the screws on the inside of the machine› Screw tight the rear part of the hood
Caution! After the vacuum table is mounted, the machine settingsmust be adjusted and a check mark must be set in the field vacuum
table in the parameter dialog so that the correct working height istaken into account (s. "Machine Settings" on page 59)!
For a fast disassembling the removal of the rear part is not required:› unscrew the table› loosen the hoses (bayonet lock)› provide hoses with seals
Caution! Take care that during disassembly the vacuum hoseremains beside the machine and does not get ini the way of thetable, otherwise the table will be blocked!

16.3 Spring setting at the machining head
Depending on the option that is used with the circuit board plotter, thespring at the machining head needs to be adjusted. There are four
different settings, see following figure.
1 = Standard or basic setting, no options present
2 = Machine with camera option
3 = Machine with vacuum table
4 = Machine with camera and vacuum table

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Figure 93: Spring adjustment,machining head view
from the right side

4
3
2
1

5

6

1--4 Spring settings
5- Spring head6- Spring adjustment screw› To adjust the spring, loosen the screw (6 in figure above) and let the
spring engage in the position according to the option that is used.
Then tighten screw again.

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Technical Data

17.0 Technical Data
Machine operating voltage: ........... 100-140 VAC / 200-260 VAC
Power consumption: ...................... 300 VA
Speed of machining spindle:.......... 15.000 - 62.000 rpm.
Permissible humidity:..................... max. 60%
Operating temperature: ................. 15-25°C (59-77°F)
Weight (without/with hood): ........... 42 kg / 55 kg
Dimensions (WxHxD): ................... 650 x 520 x 750 mm
Airborne noise at workplace: ......... 71dB (A) without vacuum
Minimum conductor width:............. 0.1 mm
Minimum conductor interval:.......... 0.1 mm
Minimum hole diameter: ................ 0.15 mm
Motion range:................................. 12“ x 9“
Repetition accuracy: ...................... +/- 2.5 µm
Positioning accuracy...................... +/- 5 µm
(after warming-up phase)
Machining spindle:......................... EC motor 15,000-62,000/min.
Tool change: .................................. Automatic (10 stations)
Tool mount: .................................... 1/8“ clamping collet
Drilling capacity: ............................ max. 150 strokes/min.
Resolution (minimum motion step):0.00025 mm (0.25µm)
Motion rate:.................................... 150 mm /sec. (max.)Milling depth adjustment:............... mechanical sensing, manually
X/Y drive: ....................................... Incremental motors, precision....................................................... spindle
Z stroke:......................................... approx. 38 mm
Applications:118

All 1 and 2-sided types of circuitboard with usual equipment density(FR3, FR4,FR5, G10), flexible
substrates, RF-substrates,milling
cut-outs in front-panels, drilling test
adapters, structuring film layouts,
solder frames for PCB assembly, as
well as SMD fine conductor
technology, contour milling, front
panel/plate engraving,multilayer up
to 8 layers incombination with LPKF
MiniContac and MultiPress

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Declaration of Conformity

18.0 Declaration of Conformity
EC Declaration of Conformity
according to EU Machine Guidelines 98/37 EC.
Manufacturer

LPKF Laser & Electronics AG
Osteriede 730827 Garbsen
Germany
herewith declares that the following productProduct namecircuit board plotter
Series / Type designation ProtoMat S62
is a machine according to EU Machine Guideline 98/37 EC.
Any modification to the designated machine not coordinated with
manufacturer invalidates this declaration for this machine.
We maintain a quality assurance system certified by Daimler-Chrysler
according to ISO 9001 and have therefore observe the following EC
Guidelines and EN Standards in development and production of themachine:EC Guidelines:• EC Machine Guidelines 98/37 EC• Low voltage operating equipment 73/23 EEC• EMC 89/336 EEC
Harmonized Standards:• EN 292-1• EN 349• EN 626-1• EN 60204• EN 61000-6-2:2001• EN 55022:1994 A2• EN 292-2• EN 614-1• EN 1050:1996• EN 61000-6-1:2001• EN 61000-6-4:2001•1

CE approval symbol was attached to the machine in accordance with
Guideline 97/37 EC.

Garbsen, 10.02.2005

Bernd Hackmann (CEO)This Declaration confirms conformance with the specified guidelines,
however, is not a guarantee of properties. The safety precautions in the
product documentation supplied are to be observed..

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Index19.0 Index
A
Airborne noise ................................................................................................. 118
B
Base material .......................................................................................... 5, 35, 81
Baudrate ..............................................................................................................22
BMaster ................................................................................................................28
BoardMaster .................................................................................................. 5, 11
Bringing into service ......................................................................................26
C
Camera ............................................................................................. 56, 64, 89, 112
Camera functions ............................................................................................54
Camera offset ....................................................................................................64
Caution ............................................................................................................. 4, 17Centering a project .........................................................................................74
Centering project .............................................................................................74
CircuitCAM ...........................................................................................................5
Cleaning ...............................................................................................................86
Configuration .....................................................................................................68
Control functions .............................................................................................53
Conventions .........................................................................................................4
Copper laminate ................................................................................................5
Create project ...................................................................................................71
D
Danger ....................................................................................................................4
Data ........................................................................................................................28
Deleting a project ............................................................................................74
Dimensions ....................................................................................................... 118
Display scroll bars .......................................................................................... 35
Drilling ...................................................................................................................83
E
Engraving ............................................................................................................98
F
Feed rate .............................................................................................................63
FIFO .......................................................................................................................22
Font ........................................................................................................................78
Front view ............................................................................................................21
Function bar .......................................................................................................35
H
Hardware-Handshake ................................................................................... 59
Head downtime ................................................................................................62
HOME position ........................................................................................... 29, 56
HP-GL ...................................................................................................................69
I
III ................................................................................................................................4
Intended Use .......................................................................................................5

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IndexJ
Job .......................................................................................................................... 34
L
Layer ...................................................................................................................... 72
Life cycle .............................................................................................................. 62
Light dot ............................................................................................................... 64
LMD ........................................................................................................................ 69
Load ....................................................................................................................... 66
Loops ..................................................................................................................... 87
LPR ......................................................................................................................... 69
M
Machine greenhorn .......................................................................................... 5
Menu bar ............................................................................................................. 35
Milling ........................................................................................................ 83, 84, 98
Milling depth ....................................................................................................... 87
Motion range ...................................................................................................... 35
N
Note .......................................................................................................................... 5O
Operating temperature ............................................................................... 118
Optimal speed ................................................................................................... 63
Origin ..................................................................................................................... 73
P
Parameter ........................................................................................................... 50
PAUSE position ................................................................................................ 56
Permissible humidity ................................................................................... 118
Phase file ............................................................................................................. 72
Phases .................................................................................................................. 65
Placement ........................................................................................................... 73
Power consumption ..................................................................................... 118
Processor ............................................................................................................ 26
Production phase ............................................................................................ 78
R
Rotation .......................................................................................................... 63, 73
S
Safety Notes ...................................................................................................... 14
Scale ...................................................................................................................... 73
Serial interface ................................................................................................. 57
Service .................................................................................................................. 96
Set ........................................................................................................................... 67
Solder resist foil ................................................................................................. 5
Solder resist foils ............................................................................................. 98
Sources of error ............................................................................................... 87
Spacer ring ......................................................................................................... 82
Start line ............................................................................................................... 61
Status bar ............................................................................................................ 35
Symbols ................................................................................................................. 4
T
Target Group ........................................................................................................ 5
Teach-in .............................................................................................................. 109

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Terminology ..........................................................................................................5
Title bar .................................................................................................................34
Tool changing position ............................................................................ 35, 56
Tool Parameter .................................................................................................61
Tutor.job ...............................................................................................................34
U
USB ........................................................................................................................26
USB cable ..................................................................................................... 16, 23
USB connection ......................................................................................... 19, 23
USB driver ...........................................................................................................28
USB repeater ............................................................................................... 16, 23
V
Vacuum .................................................................................................................82
Vacuum system ................................................................................................16
Vacuum Table .................................................................................................. 114
Vector index .......................................................................................................50
W
Weight ................................................................................................................. 118
Windows ..............................................................................................................26
Working Depth Limiter ................................................................................ 104
workplace ............................................................................................................14X
X Offset .................................................................................................................64
Y
Y=>-Y ....................................................................................................................72
Z
Zoom area ...........................................................................................................77

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