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Page 2Model 200
Dimpling Grinder

State-of-the-art mechanical grinder for
preparing electron microscopy samples
EXCELLENCE…MAGNIFIED

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Page 3Model 200 Dimpling Grinder• Pre-thin for ion milling.
• Polish to electron transparency.
• Controlled grinding rate.
• Precise indication of specimen thickness.
• Easy programming.
• Accepts mounted specimens from the Model 160
Specimen Grinder.
The ultra-precise Model 200 Dimpling Grinder is indispensable when ion milling isused for final specimen thinning. Because the specimen is pre-thinned by dimpling, ion
milling must remove only relatively small amounts of material. This creates specimens
free from uneven thinning, surface defects, and irradiation damage.
Dimpling
High-quality specimens for transmission electron microscopy (TEM) need to have a large electron transparent area for
analysis, but yet be rugged. One method that accomplishes both of these prerequisites is dimpling.
Dimpling is a rapid technique that involves simultaneously rotating the specimen about one axis and a grinding wheel
about a perpendicular and intersecting axis. This combination of motions provides a specimen with its central area
reduced to a thickness of a few microns.
By thinning only the central area of the specimen, a thick, rugged outer rim remains, eliminating the need for special
handling techniques for fragile specimens. An abrasive slurry that is in contact with the grinding wheel and the specimen
removes the material.

Versatile

By simply changing tools, the Model 200 can be used to flat grind bulk
specimens, dimple, and then finally polish the specimen to electron transparency.

Precise specimen
positioning

A key component of the Model 200 is the specimen stage that precisely rotates thespecimen. The specimen is mounted with a low melting point polymer to the top halfof a two-piece platen. The platen fits into a magnetic base, which is coupled to thespecimen stage by a rare-earth magnet. This magnetic coupling allows the base to bepositioned so that a particular area of the specimen can be precisely placed under thegrinding wheel. Positioning can be observed through a 40X optical microscope.
The specimen can be readily removed for inspection and then precisely repositioned forcontinued grinding. Specimen rotation speed is continuously varied by a front panel
mounted potentiometer.

Optimized
grinding control

For effective preparation and to avoid specimen damage, an electromechanical stage
lowers the grinding wheel at an optimized rate. This creates a very controlled reductionof specimen thickness. Wear on the grinding wheel is uniform, virtually eliminating

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eccentric tool-induced vibration and ensuring grinding without the risk ofspecimen fracture.
At the conclusion of the grinding process, the advanced instrument control halts both
the wheel and specimen rotation and then automatically lifts the grinding wheel fromthe specimen surface.

Vibration-free grinding

The precision fit of the grinding wheel to the shaft minimizes eccentricity. Bothadvanced rotary bearing technology and a specially designed drive system virtuallyeliminate wheel vibration. Grinding wheel rotation speed is continuously adjustable
via a front panel mounted potentiometer.
The Model 200 can incorporate different types of wheels:• Grinding wheels for rapid material removal without scratching.
• Polishing wheels for an optimal surface finish.
• Wheels with different diameters for various dimple profiles.
A variety of wheel materials are available and can be specially matched to given
applications.

Controlled grinding
force and rate

The grinding wheel stage is pivoted to present the grinding wheel to the specimen. It
contains a micrometer-type, adjustable counterweight system to regulate the applied
grinding force. Because both grinding force and grinding rate are controlled, specimens
with exceptional quality are produced.
Fourier filtered HRTEM image of a Co/Ru
artificial superlattice obtained from a dimple
ground XTEM specimen. The specimen wassubsequently argon ion milled at a voltageof 4kV, a current of 4mA, and an incident
milling angle of 7°. The specimen was cooled
to L N2 temperature and fully rotated (360°)
during ion milling.
Image courtesy of K. Hono and D.H. Ping, NIMS (Japan)

Easy programming

Programming is extremely easy via akeypad mounted on the front panel. A mode
key used in conjunction with four arrow keys
allows the input of the various dimpling
parameters. Prompts help guide the user
through quick and easy programming steps.
A liquid crystal display continuously shows
performance information.
Zeroing is initiated by pressing the Zero key. A zero position can be established oneither the surface of the platen or the surface of the specimen. This facilitates the ability
to either dimple to a given thickness, or to remove a specific amount of material fromthe specimen.

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Process termination

Page 1

Final specimen thickness is readily programmed for accurate, unattended operation.
However, at any time, the process can be either paused for specimen inspection orstopped. During grinding, specimen thickness is continuously displayed.
The Model 200 also features a time-based polishing mode. At the conclusion of anelapsed set time, the process automatically terminates.

Transmitted orreflected illumination

The platen that holds the specimen has a glass center section that allows light to betransmitted through the specimen from a source located beneath the specimen stage.
The intensity level of the transmitted light is adjustable for optimal specimen
observation. This is particularly important when dimpling silicon, which undergoeschanges in color as the specimen approaches electron transparency.
The Model 200 also features illumination with reflected light from a high intensity
lamp, powered by the Model 200’s power supply.

Microscope fordirect observation

A 40X microscope attachment allows direct observation without the need to remove
the specimen.

Model 200
specifications

Grinding control

Specimen stage
User interface
Specimen illumination
EnclosurePower requirements
Warranty

Automated grinding rate control
Grinding force adjustable with micrometer counterweight system
Independent control of grinding wheel and specimen rotation speeds
Precise specimen stage rotation
Magnetic mount allows easy specimen positioning
All program inputs via front panel keypad
Specimen thickness indicated on a liquid crystal display
Specimen observation in either transmitted or reflected light
Weight: 18 lb (8.2kg)
Size: 8.2" (208mm) W x 6.5" (165mm) H x 13.5" (343mm) D
110/220 VAC, 50/60 Hz, 375 watts
One year

Cover image: Optical image of a dimple ground XTEM specimen consisting of
19 individual sections of a microelectronic material. The image was taken usingtransmitted light and shows a color contrast due to the decreasing thickness of siliconas the center of the specimen is approached.

EXCELLENCE…MAGNIFIED

E.A. Fischione Instruments, Inc.
9003 Corporate Circle
Export, PA 15632 USA
Tel: 724.325.5444
Fax: 724.325.5443
E-mail:info@fischione.com
Website: www.fischione.com
Part No. 006-0376, Rev. 1