IO-Link at a Glance
Viktor Schiffer
Rockwell Automation
Technical Trackwww.odva.org

Agenda Introduction
 The IO-Link Technology
 IO-Link Integration into CIP

Technical Track© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 2www.odva.org

Agenda Introduction
 The IO-Link Technology
 IO-Link Integration into CIP

Technical Track© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 3www.odva.org

End user requirements
Microcontroller-based intelligent smallsensors and actuators (devices) have alot of different built-in parameters, yetthey are not easily accessible. However,users are asking for functionality like

Expanded diagnostics
Simplified installation
Automated parameter setting

Technical Track© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
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Other Key Requirements
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The communication interface shall have thefunctionality of transmitting cyclic process data
as well as acyclic data.
Cycle times for process data shall meet therequirements for typical factory automation
applications.
The cycle time shall be scalable, providing
process data transmission within 2ms.
The communication interface shall be suitable forsensors and actuators as well and work reliably ina factory automation environment, therefore
meeting all EMC requirements.

Technical Track© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

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Easy Integration into Different
FieldbusesThe communication interface standard shouldhave no restrictions and have to be open to any
vendor or supplier for masters and devices.
Users want to have an accepted technology allover the world, fitting into all PLCs and fieldbuses.
All devices are to be integrated into specificengineering tools in an easy way.
Management overhead such as using addresses,switches and bus administration should beavoided.

Technical Track© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
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IO-Link Technology Domain

Technical Track© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
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IO-Link on the “Last Mile”

Technical Track© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

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Why IO-Link?
Target use casesPrecise analog value transmission in harshenvironments
Replacement of analog 4..20mA interfaces
Parameterization of small devices (sensors andactuators)
Getting detailed diagnostic data
Monitoring of device conditions

Technical Track© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 9www.odva.org

Agenda Introduction
 The IO-Link Technology
 IO-Link Integration into CIP

Technical Track© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 10www.odva.org

IO-Link Compatibility withIEC 61131-2

Technical Track© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
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Data Model of IO-Link

Technical Track© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

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Device Description IODD
XML-based Mandatory for all devices
 Enables user-friendly integration into PLC engineering
tools or into an FDT container environmentTechnical Track© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
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Data Transfer at theApplication Layer Level

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2012 ODVA Industry Conference & 15th Annual Meeting
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IO-Link Transmission Frames(Subset)Type_0Type_1_1

Type_2_1

Technical Track© 2012 ODVA, Inc.

MCMCMC

CKT

CKT

CKTOD

PD0

CKS

PD1

OD

2012 ODVA Industry Conference & 15th Annual Meeting
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PDCKSCKS

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IO-Link Specifications

Technical Track© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
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Agenda Introduction
 The IO-Link Technology
 IO-Link Integration into CIP

Technical Track© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

page 17www.odva.org

IO-Link functions to be supported
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Process data transmission (1 Bit to 32 Byte)
Service Data transmission (16 Bit index range)
Event handling
Direct parameter page support
System commands
Transmission of block parameters
Easy device exchange based on the identificationof devices
Automatic device data exchange without tooling
Change from communication into SIO mode andvice versa.
Hot plug functionality

Technical Track© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

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Current State of SIG Activities
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The SIG and its work plan have been establishedCompanies involved in the SIG so far:• Balluff, Comtrol, Molex, Murrelektronik, Omron, Panduit,
Rockwell Automation, Sick, TMG, Turck

Two SIG meetings via teleconference have takenplace
The next teleconference is scheduled for October24, 15:00 hours CEST, 9 a.m. Eastern DST,contact ODVA and Frank Moritz(Frank.Moritz@sick.de) if you want to participate
Several possible integration concepts will bepresented at the October 24 teleconference

Technical Track© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

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Thank you for listening
Any Questions?

Technical Track© 2012 ODVA, Inc.

2012 ODVA Industry Conference & 15th Annual Meeting
All rights reserved.

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