DATASHEETX14 Hyper-E

Best-in-class Performance and Flexibility for Edge Data Centers
Flagship performance in a short-depth
form factors• Short-depth form factor (574mm/22.6“) for spaceconstrained environments• Dual socket architecture featuring Intel® Xeon® 6700 series
processors with E-cores• Hyper-E will also support Intel Xeon 6700 with P-cores in
Q1’25Enhanced serviceability in the field with front I/O• Up to 3 PCIe 5.0 x16 double-width or 6 PCIe 5.0 x16 singlewidth slots• AC and DC power supply options

Short-depth, Maximum Performance

AI at the Edge

Hyper-E brings the performance and flexibility of Supermicro’s
flagship Hyper series to the edge with short-depth form factors
designed for edge data center and telco deployments. Telcooptimized configurations are NEBS Level 3 certified and feature
optional DC power supplies on selected models.

Hyper-E is able to accommodate up to 3 double-width GPU/FPGAcards, enabling it to support demanding AI workloads such as
ML training and data inferencing at the Edge. When combinedwith its compact form factor and front access design, this makes
the Hyper-E a powerful platform for AI inferencing in edge datacenters.

Optimized for 5G and Telco Applications
The compact form factor, many expansion options, and powerfulcompute make Hyper-E ideal for 5G, telco and intelligent edge
applications including Cloud, Network Function Virtualization,
AI Edge Inferencing, Telco Data Center and 5G Core/Edge. All
I/O and expansion slots are front-accessible for easy servicing inspace-constrained environments, while maintenance-friendly
design innovations eliminate the need for tools when servicing,
simplifying rollout and installation.

Powered by Intel® Xeon® 6 Processors withE-coresThe new Intel Xeon 6700 series processors with E-cores bring up
to 2.5x higher core density per rack compared to 4th Gen Intel
Xeon and improved performance per watt to enable Supermicro
X14 multi-node solutions to delivery significantly more compute
capacity in a smaller physical footprint.

X14 HYPER-E

Hyper-E

SYS-222HE-TN

SYS-222HE-FTN

Processor Support

Dual Intel® Xeon® 6700 series processors with E-cores
Up to 350W TDP (air cooled)†

Dual Intel® Xeon® 6700 series processors with E-cores
Up to 350W TDP (air cooled)†

Memory Slots &Capacity

32 DIMM slots; up to 8TB DDR5-5600MT/s

32 DIMM slots; up to 8TB DDR5-5600MT/s

Network Connectivity

2x 100GbE QSFP28 with Broadcom® BCM57508(optional)
2x 100GbE QSFP28 with Intel® E810-CAM2(optional)
2x 100GbE QSFP28 with Mellanox® CX-6 DX(optional)
2x 25GbE SFP28 with Broadcom® BCM57414(optional)
4x 10GbE RJ45 with Intel® X550 (optional)
4x 10GbE SFP+ with Intel® X710-BM2 (optional) via
AIOM
1 RJ45 dedicated BMC LAN port
2 USB 2.0 ports (front)
1 VGA ports

2x 100GbE QSFP28 with Broadcom® BCM57508(optional)
2x 100GbE QSFP28 with Intel® E810-CAM2(optional)
2x 100GbE QSFP28 with Mellanox® CX-6 DX(optional)
2x 25GbE SFP28 with Broadcom® BCM57414(optional)
4x 10GbE RJ45 with Intel® X550 (optional)
4x 10GbE SFP+ with Intel® X710-BM2 (optional) via
AIOM
1 RJ45 dedicated BMC LAN port
2 USB 2.0 ports (front)
1 VGA ports

MotherBoard

X13DEM

X13DEM

Form Factor

2U Rackmount
574mm/22.6” depth

2U Rackmount
574mm/22.6” depth

Expansion Slots

Configurable PCIe slot options:
up to 8 PCIe 5.0 x8 (6 FHFL+ 2 FHHL) or 4 PCIe 5.0 x16 (3 FHFL+ 1 FHHL)

Configurable PCIe slot options:
up to 8 PCIe 5.0 x8 (6 FHFL+ 2 FHHL) or 4 PCIe 5.0 x16 (3 FHFL
+ 1 FHHL)

Drive Bays

6 hot-swap 2.5” NVMe/SAS/SATA drive bays; 6x 2.5” NVMe
hybrid;optional RAID support via RAID controller AOC

6 hot-swap 2.5” NVMe/SAS/SATA drive bays; 6x 2.5” NVMehybrid;
optional RAID support via RAID controller AOCCooling6 heavy duty fans

6 heavy duty fans

Power

Redundant 2000W Titanium level (96%)

Redundant 1300W -48Vdc single output†

CPUs with high TDP supported under specific conditions. Contact Technical Support for details.

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