MLX91216
High Speed Current Sensor IC
Datasheet

1. Features and Benefits▪

IMC-Hall® Technology▪

High Field, Very High Field and Extra High
Field variants▪

End-of-line programmable sensor▪

Selectable analog ratiometric output▪

Programmable sensitivity from ±20 to±350mV/mT▪

Measurement range up to 90 mT▪

Wideband sensing: DC to 250kHz▪

Very fast response time (2µs)▪

High linearity down to ±0.2% full scale▪

Very low thermal drift▪

Offset drift (<5mV)▪

Sensitivity drift (<1%)▪

Programmable output clamping levels▪

Broken wire detection and diagnostics▪

AEC-Q100 – Grade 0 Automotive Qualified▪

RoHS compliant▪

SOIC-8 package

▪

MSL-3

2. Application Examples▪

High Voltage Traction Motor Inverter▪

48V Boost Recuperation Inverter▪

DCDC Converter▪

Smart Battery Junction Boxes▪

Smart Fuse Overcurrent Detection

Figure 1. Typical IMC-Hall® Current Sensing Application

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3. Description
The MLX91216 is a monolithic Hall-effect sensor
utilizing the IMC-Hall® technology. The sensor
provides an analog output voltage proportional tothe applied magnetic flux density parallel to the IC
surface.
The transfer characteristic of the MLX91216 isfactory trimmed over temperature, and is
programmable (offset, sensitivity, clamping,filtering) during end-of-line customer calibration.
The output clamping levels and on-chip filtering arealso programmable as a function of applicationneeds. With the 250kHz bandwidth and fast
response time, it is particularly adapted for highspeed applications such as inverters andconverters where fast response time due to fastswitching is required.
In a typical current sensing application, the sensor
is used in combination with a U-shaped shieldwhich facilitates the mechanical assembly of thecurrent sensor over traditional ferromagnetic
cores. This shield is recommended to be laminatedfor high bandwidth applications. The MLX91216
can then be mounted over the bus bar andseparated from it by the PCB. As the shield does
not serve the primary purpose of concentration, it
can be made smaller and lighter thanferromagnetic cores without losing signal thanks to
the integrated magnetic concentrator (IMC)
depicted also in Figure 1. Typical IMC-Hall® Current
Sensing Application. As a result, dense powerelectronics can be achieved enabling systemsavings and surface mount assembly.

Figure 2. General Block Diagram

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MLX91216 High Speed Current Sensor
DatasheetContents
1. Features and Benefits ............................................................................................................................ 1
2. Application Examples............................................................................................................................. 1
3. Description ............................................................................................................................................ 1
4. Ordering Information ............................................................................................................................ 3
5. Functional Diagram ............................................................................................................................... 5
6. Glossary of Terms .................................................................................................................................. 5
7. Pin Definitions and Descriptions ............................................................................................................ 6
8. Absolute Maximum Ratings ................................................................................................................... 7
9. General Electrical Specifications ............................................................................................................ 8
10. Magnetic specification......................................................................................................................... 910.1. High Field version (option code ACH) .............................................................................................. 910.2. Very High Field version (option code ACV)...................................................................................... 910.3. Extra High Field version (option code ACX) ..................................................................................... 9
11. Analog output specification ............................................................................................................... 10
11.1. Accuracy specifications .................................................................................................................. 1011.2. Timing specifications ...................................................................................................................... 10
12. Self-diagnostic ................................................................................................................................... 11
13. Recommended Application Diagram ................................................................................................. 12
14. Programmable items ......................................................................................................................... 12
15. Standard Information ........................................................................................................................ 14
16. ESD Precautions................................................................................................................................. 14
17. Packaging information ....................................................................................................................... 15
17.1. SOIC-8 Pinout and Marking ............................................................................................................ 15
17.2. Hall plate position ........................................................................................................................... 16
17.3. IMC Position and Sensing Direction ............................................................................................... 16
18. Contact .............................................................................................................................................. 17
19. Disclaimer .......................................................................................................................................... 17Doc.№ 390109121603
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4. Ordering Information
Product

Temperature Package

Option Code

Packing Form

Typical Sensitivity

MLX91216

L

DC

ACH – 000RE

100 mV/mT(prog: 50..350mV/mT)

MLX91216

L

DC

ACH – 0021

RE

155 mV/mT(prog: 50..350mV/mT)

MLX91216

LDC

ACV – 000

RE

40 mV/mT(prog: 30..200mV/mT)

MLX91216

LDC

ACV – 001

RE

60 mV/mT(prog: 30..200mV/mT)

MLX91216

LDC

ACV – 002

RE

30 mV/mT(prog: 30..200mV/mT)

MLX91216

L

DC

ACX – 000

RE

25 mV/mT(prog: 20..125mV/mT)

MLX91216

L

DC

ACX – 001

RE

30 mV/mT(prog: 20..125mV/mT)

MLX91216

L

DC

ACX – 002

RE

20 mV/mT(prog: 20..125mV/mT)

Table 1: Available ordering codes.

1

MLX91216LDC-ACH-002: customized offset, VOQ = 1V

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Legend:Temperature
Code:

L

from -40°C to 150°C ambient temperature

Package Code:DC

for SOIC8 package, refer to Chapter 17 for detailed drawings

Option Code:ACH-000

for sensitivity 100 mV/mT; (programmable range: 50-350mV/mT)

ACH-0021

for sensitivity 155 mV/mT; VOQ=1V (programmable range: 50-350mV/mT)

ACV-000

for sensitivity 40 mV/mT; (programmable range: 30-200mV/mT)

ACV-001

for sensitivity 60 mV/mT; (programmable range: 30-200mV/mT)

ACV-002

for sensitivity 30 mV/mT; (programmable range: 30-200mV/mT)

ACX-000

for sensitivity 25 mV/mT; (programmable range: 20-125mV/mT)

ACX-001

for sensitivity 30 mV/mT; (programmable range: 20-125mV/mT)

ACX-002

for sensitivity 20 mV/mT; (programmable range: 20-125mV/mT)

Packing Form:
Ordering
Example:RE

for Plastic Reel.

“MLX91216LDC-ACV-001-RE”
MLX91216 IMC-Hall® current sensor in SOIC8 package, temperature range -40°C to 150°C.
Sensitivity 60mV/mT. Parts delivered in Plastic Reel.

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5. Functional Diagram

Figure 3: MLX91216 Block Diagram

6. Glossary of Terms
Terms

DefinitionTC

Temperature CoefficientFS

Full Scale, output referred. Corresponds to 2V excursion around 2.5V V OQ point 1

T, mT

Tesla, milliTesla = units for the magnetic flux density

G

Gauss = unit for the magnetic flux density [1mT = 10G]

PTC

Programming Through Connector

IMC

Integrated Magnetic Concentrator

Table 2: Glossary of Terms

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7. Pin Definitions and Descriptions

Pin #

Name

Type

Description

1

VDEC

DigitalDigital Supply Voltage

2

NC

-

Not Connected

3

GND

GroundSupply Voltage

4

TEST

DigitalTest and Factory Calibration

5

VDD

SupplySupply Voltage

6

OUT

AnalogCurrent Sensor Output

7,8

NC

-

Not Connected

Table 3: Pin definitions and descriptions (MLX91216 is pin-to-pin compatible with MLX91208)

For optimal EMC performance, it is recommended to connect the unused (NC) pins to the Ground.

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8. Absolute Maximum Ratings
Parameter

Symbol

Value

Unit

Positive Supply Voltage (overvoltage)

VDD

+10

V

Reverse Voltage Protection

VSREV

-0.3

V

Positive Output Voltage

VOUT

+10

V

Output Current

IOUT

±70

mA

Reverse Output Voltage

VOREV

-0.3

V

Reverse Output Current

IOREV

-50

mA

Maximum Junction Temperature

Tj,max-55 to 155°C

Operating Ambient Temperature RangeTA-40 to +150

°C

Storage Temperature RangeTS-55 to +165

°C

ja

174

°C/W

ESDHBM

2

kV

BMAX

±3

T

Package Thermal Resistance (junction-to-ambient)ja is defined according to JEDEC 1s0p board
ESD – Human Body Model(Applicable for all pins)
Magnetic Flux Density
Table 4: Absolute maximum ratings

Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximum rated conditions for extended periods of time may affect device reliability.

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9. General Electrical Specifications
Operating Parameters T A = -40 to 150°C, VDD = 5V±10%, unless otherwise specified.

Parameter

SymbolTest Conditions

Min.

Typ.

Max.

Units

4.5

5

5.5

V

Nominal Supply Voltage

VDD

Supply Current

IDD

No OUT load
LOW_POWER_MODE=0 2
LOW_POWER_MODE=1

12.5
10

15
13

mA
mA

Output Impedance

ROUT

Vout = 50% Vdd, RL = 10kΩ

1

5



10
47

nF
nF

200

k

1

Output Capacitive LoadCLOUT_MODE=0
OUT_MODE=1

Output Resistive Load

RL

Output resistive load for high linearityand diagnostic band.

Output Short Circuit
Current

ISHORT

Output shorted permanent to VDD.
Output shorted permanent to GND.

Linear Output Range

VOLINpull-down ≥ 10 kΩ

10

90

%Vdd

Diagnostic Band 3

DIAG

RL ≥ 10kΩ, RL ≤ 200 kΩ, VDD =5V
DIAG_LEVEL = 0
DIAG_LEVEL = 1

0
96

4
100

%Vdd
%Vdd

BrokenGND Output Level 3

RL ≥ 10kΩ, VDD = 5V

96

100

%Vdd

BrokenVDD Output Level 3

RL ≥ 10kΩ, VDD = 5V

0

4

%Vdd

VDD_UVD

Detected Voltage (Low to High)

4.0

4.5

V

VDD_UVH

Hysteresis

0.01

0.2

V

VDD_OVD1

Detected Voltage (Low to High)

6.7

7.4

V

VDD_OVH1

Hysteresis

0.37

0.66

V

VDD_OVD2

Detected Voltage (Low to High)

8.3

9.5

V

VDD_OVH2

Hysteresis

0.2

0.8

V

Under-voltage detection 3
Over-voltage detection 1 3Over-voltage detection 2 3

Clamped Output Level

1
10
10

25

Not Destroyed
Not Destroyed

Clamp_lo0 CLAMP_LEVEL=0

5

6

7

%Vdd

Clamp_hi0 CLAMP_LEVEL=0

92

93

94

%Vdd

Clamp_lo1 CLAMP_LEVEL=1

5

6

7

%Vdd

Clamp_hi1 CLAMP_LEVEL=1

93

94

95

%Vdd

Clamp_lo2 CLAMP_LEVEL=2

7

8

9

%Vdd

Clamp_hi2 CLAMP_LEVEL=2

91

92

93

%Vdd

Clamp_lo3 CLAMP_LEVEL=3

9

10

11

%Vdd

Clamp_hi3 CLAMP_LEVEL=3

89

90

91

%Vdd

Table 5: General electrical parameters

2
3

Default Factory Calibration
Please refer to section 12 for more information on self-diagnostic modes.

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10. Magnetic specification
Operating Parameters T A = -40 to 150°C, VDD = 5V±10%, unless otherwise specified.

10.1. High Field version (option code ACH)
Parameter

SymbolTest Conditions

Min

Typ

Max

Units

±25

mT

Operational Magnetic Field Range

BOP

Linearity Error (Magnetic)

NL

B within B OP, TA = 25°C

±0.5

%FS

Hysteresis – Remanent Field

BR

Measured after B = B OP

±25

µT

Programmable Sensitivity

S

MLX91216LDC-ACH-000
MLX91216LDC-ACH-002

350
350

mV/mT

Sensitivity Programming Resolution

SRES

B = BOP

50
50

100
155
0.1

%

Table 6: Magnetic specification High Field version

10.2. Very High Field version (option code ACV)
Parameter

SymbolTest Conditions

Min

Typ

Max

Units

±60

mT

Operational Magnetic Field Range

BOP

Linearity Error (Magnetic)

NL

B within B OP, TA = 25°C

±0.5

%FS

Hysteresis – Remanent Field

BR

Measured after B = B OP

±60

µT

Programmable Sensitivity

S

MLX91216LDC-ACV-000
MLX91216LDC-ACV-001

200
200

mV/mT

Sensitivity Programming Resolution

SRES

B = BOP

30
30

40
60
0.1

%

Table 7: Magnetic specification Very High Field version

10.3. Extra High Field version (option code ACX)Parameter

SymbolTest Conditions

Min

Typ

Max

Units

±90

mT

Operational Magnetic Field Range

BOP

Linearity Error (Magnetic)

NL

B within B OP, TA = 25°C

±0.5

%FS

Hysteresis – Remanent Field

BR

Measured after B = B OP

±90

µT

Programmable Sensitivity

S

MLX91216LDC-ACX-000
MLX91216LDC-ACX-001
MLX91216LDC-ACX-002

125
125
125

mV/mT

Sensitivity Programming Resolution

SRES

B = BOP

20
20
20

25
30
20
0.1

%

Table 8: Magnetic specification Extra High Field version

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11. Analog output specification
11.1. Accuracy specifications
Operating Parameters T A = -40 to 150°C, VDD = 5V±10%, unless otherwise specified.
Parameter

SymbolTest Conditions

Thermal Offset DriftΔTVOQTA = -40 to 125°C
TA = -40 to 150°C
MLX91216LDC-ACH-002, TA = -40 to 125°C
TA = -40 to 125°C
TA = -40 to 150°C
MLX91216LDC-ACH-002, TA = -40 to 125°C
Scales with typical sensitivity of Table 1
for given IMC type (HF, VHF, XHF)
MLX91216LDC-ACH-000
MLX91216LDC-ACV-000
MLX91216LDC-ACV-002 (NOISE_FILTER
1)
MLX91216LDC-ACX-000

Min

Typ

Max

Units

±5
±8

mV
mV
mV

±1.0
±1.2
±1.2

%S
%S
%S

±20

Thermal Sensitivity DriftΔTSRMS Output Noise

N RMS

VOQ Ratiometry

ΔRVOQ

VDD = 5V±5%, VOQ = 50%V DDx
VDD = 5V±5%, VOQ = 20%VDDx

±10

mV

Sensitivity Ratiometry

Δ RS

VDD = 5V±5%, B = BOP

±0.4

%S

Clamped output accuracy

CLACC

±1

%Vdd

8
6.5
4.5
6.5

mVRMS
mVRMS
mVRMS
mVRMS

Table 9: Accuracy specifications – analog parameters

The accuracy specifications are defined for the factory calibrated sensitivity. The achievable accuracy isdependent on the user’s end-of-line calibration. Resolution for offset and offset drift calibration is better than
0.02%VDD. Trimming capability is higher than measurement accuracy. End-user calibration can therefore
increase the accuracy of the system.

11.2. Timing specifications
Operating Parameters TA = -40 to 150°C, Vdd = 5V±10%, unless otherwise specified.

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Parameter

SymbolTest Conditions

Min Typ

Refresh rate

Max

Units

Trr

LOW_POWER_MODE=0

0.8

1

2

μs

Step Response TimeTR

CL=10nF
NOISE_FILTER=0, LOW_POWER_MODE=0NOISE_FILTER=0, LOW_POWER_MODE=1
NOISE_FILTER=1, LOW_POWER_MODE=0NOISE_FILTER=1, LOW_POWER_MODE=1
NOISE_FILTER=2, LOW_POWER_MODE=0NOISE_FILTER=2, LOW_POWER_MODE=1
NOISE_FILTER=3, LOW_POWER_MODE=0NOISE_FILTER=3, LOW_POWER_MODE=1

2
3
3
5
4
6
8
10

3
4
4
6
5
7
9
11

μs
μs
μs
μs
μs
μs
μs
μs

Power on Delay

TPOD

Vout =100% of F.S.

1

ms

Ratiometry Cut-off
Frequency

FRAT

250

Hz

Table 10: Timing specifications of the high-speed analog output

12. Self-diagnostic
MLX91216 provides several self-diagnostic features, which prevent the IC from providing erroneous output signal in case ofinternal or external failure modes.

Error

Effect on Output

Remarks

Calibration data CRC Error

DIAG_LEVEL=0 → active pull-down to GND
DIAG_LEVEL=1 → active pull-up to VDD

At power up and in normal mode

Power-On Delay

Pull-down to GND

1ms max followed by settling

Over-voltage Mode 1

Active pull-down to GND

Over-voltage Mode 2

DIAG_LEVEL=0 → active pull-down to GND
DIAG_LEVEL=1 → active pull-up to VDD

Under-voltage Mode

DIAG_LEVEL=0 → active pull-down to GND
DIAG_LEVEL=1 → active pull-up to VDD

Broken OUT

Active pull-down to GND

Broken GND

Output pulled up to VDD

IC is switched off

Broken VDD

Output pulled down to GND

IC is switched off

Valid with enabled ratiometry(Default: RATIOEN = 1)

Table 11: Description of the self-diagnostic modes in MLX91216

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13. Recommended Application Diagram

Figure 4: Application Diagram with external Pull-Down resistancePart

Description

Value

Unit

C1

Supply capacitor, EMI, ESD

100

nF

C2

Decoupling, EMI, ESD, OUT_MODE=0
Decoupling, EMI, ESD, OUT_MODE=1

1-10
10-47

nF
nF

C3

Decoupling, EMI, ESD

47

nF

R1

Pull down resistor

10-200kΩ

Table 12: Resistor and capacitor values

14. Programmable items
Customers can re-program the parameters described in the table below by using the PTC-04 hardware and
the Product Specific Functions (PSF) libraries provided by Melexis. We recommend using the latest version of
the PSF and the firmware, with a communication speed of 10kbps (maximum output capacitor of 47nF).
Please contact your sales representative to get access to Melexis SoftDist platform and download the latest
software.

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Parameter

Bits

Factory Setting

Function

ROUGHGAIN

3

TrimmedRough gain trimming

FINEGAIN

10

TrimmedFine gain trimming

VOQ

12

TrimmedOffset trimming

OUT_MODE100: low capacitive load (see section 13)
1: high capacitive load (see section 13)

DIAG_LEVEL

1

0

0: in diagnostic, output is pulled down to GND
1: in diagnostic, output is pulled up to Vdd

LOW_POWER_MODE

10

0: normal mode
1: low power mode with slower response time

CLAMP_LEVEL

2

1

Select clamping level (%VDD)
0: 6%/93%,
1: 6%/94%,
2: 8%/92%,
3: 10%/90%

NOISE FILTER

2

0/14

0: Noise filter: deactivated
1: Noise filter: 120kHz
2: Noise filter: 60kHz
3: Noise filter: 15kHz

CSTID

17

N/A

Customer ID

Table 12: Customer Programmable Items

4

The Noise Filter parameter is set to 1 for MLX91216LDC-ACV-002 IC version. The Noise Filter is deactivated for allother option codes.
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15. Standard Information
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity
level according to standards in place in Semiconductor industry.
Reflow Soldering SMD’s (Surface Mount Devices)••

IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing(reflow profiles according to table 2)

Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)••

EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices

Iron Soldering THD’s (Through Hole Devices)•

EN60749-15
Resistance to soldering temperature for through-hole mounted devices

Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)•

EIA/JEDEC JESD22-B102 and EN60749-21
Solderability

For further details about test method references and for compliance verification of selected soldering method
for product integration, Melexis recommends reviewing on our web site the General Guidelines soldering
recommendation. For all soldering technologies deviating from the one mentioned in above document(regarding peak temperature, temperature gradient, temperature profile etc), additional classification andqualification tests have to be agreed upon with Melexis.
For package technology embedding trim and form post-delivery capability, Melexis recommends to consult
the dedicated trim&form recommendation application note: lead trimming and forming recommendations.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of
the use of certain Hazardous Substances) please visit the quality page on our
website: http://www.melexis.com/en/quality-environment

16. ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.

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17. Packaging information

Figure 5: SOIC8 - Package Information

17.1. SOIC-8 Pinout and Marking

Package Top Marking

8Marking Description
Line 1: 91216AC

Product and IC revisionLine 2: XXXXXX

Wafer Lot Nb

Line 3: YY

Calendar Year (last 2 digits)

Line 3: WW

Calendar Week

Line 3: ZZ

EH = High Field IMC
EV = Very High Field IMC
EX = Extra High Field IMC

591216ACXXXXXXYYWWZZ
1

4

Figure 6: SOIC8 - Pinout and marking

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17.2. Hall plate position

0.46 +/- 0.06
1.85
2.15

2.35
2.55

Figure 7: Hall plate position

17.3. IMC Position and Sensing Direction

B extern

B extern

Figure 8 IMC position and geometry high field (HF) version

B extern

B extern

Figure 9 IMC position and geometry very high field (VHF) version

B extern

B extern

Figure 10 IMC position and geometry extra high field (XHF) version
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18. Contact
For the latest version of this document, go to our website at http://www.melexis.com/MLX91216.
For additional information, please contact our Direct Sales team and get help for your specific needs:
Europe, Africa

Email : sales_europe@melexis.com

Americas

Email : sales_usa@melexis.com

Asia

Email : sales_asia@melexis.com

19. Disclaimer
The content of this document is believed to be correct and accurate. However, the content of this document is furnished "as is" for informational use only andno representation, nor warranty is provided by Melexis about its accuracy, nor about the results of its implementation. Melexis assumes no responsibility or
liability for any errors or inaccuracies that may appear in this document. Customer will follow the practices contained in this document under its sole
responsibility. This documentation is in fact provided without warranty, term, or condition of any kind, either implied or expressed, including but not limited to
warranties of merchantability, satisfactory quality, non-infringement, and fitness for purpose. Melexis, its employees and agents and its affiliates' and theiremployees and agents will not be responsible for any loss, however arising, from the use of, or reliance on this document. Notwithstanding the foregoing,
contractual obligations expressly undertaken in writing by Melexis prevail over this disclaimer.
This document is subject to change without notice, and should not be construed as a commitment by Melexis. Therefore, before placing orders or prior todesigning the product into a system, users or any third party should obtain the latest version of the relevant information.
Users or any third party must determine the suitability of the product described in this document for its application, including the level of reliability required
and determine whether it is fit for a particular purpose.
This document as well as the product here described may be subject to export control regulations. Be aware that export might require a prior authorizationfrom competent authorities. The product is not designed, authorized or warranted to be suitable in applications requiring extended temperature range and/or
unusual environmental requirements. High reliability applications, such as medical life-support or life-sustaining equipment or avionics application are
specifically excluded by Melexis. The product may not be used for the following applications subject to export control regulations: the development, production,
processing, operation, maintenance, storage, recognition or proliferation of:
1. chemical, biological or nuclear weapons, or for the development, production, maintenance or storage of missiles for such weapons;
2. civil firearms, including spare parts or ammunition for such arms;
3. defense related products, or other material for military use or for law enforcement;
4. any applications that, alone or in combination with other goods, substances or organisms could cause serious harm to persons or goods and that can beused as a means of violence in an armed conflict or any similar violent situation.
No license nor any other right or interest is granted to any of Melexis' or third party's intellectual property rights.
If this document is marked “restricted” or with similar words, or if in any case the content of this document is to be reasonably understood as being confidential,
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confidentiality terms substantially similar to those in this disclaimer; (iii) use the document only in connection with the purpose for which this document wasreceived, and reproduce document only to the extent necessary for such purposes; (iv) not use the document for commercial purposes or to the detriment ofMelexis or its customers. The confidentiality obligations set forth in this disclaimer will have indefinite duration and in any case they will be effective for no lessthan 10 years from the receipt of this document.
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The previous versions of this document are repealed.
Melexis © - No part of this document may be reproduced without the prior written consent of Melexis. (2022)
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