The Premier Exhibition for the Microelectronics Supply Chain in Japan
December 14 ▶ 16, 2016 10:00 ー17:00

Tokyo Big Sight, Tokyo, Japan
Organized by SEMI

Co-located with

Supported by: U.S. Department of Commerce; Japan
LED Association; Japan Institute of Electronics Packaging;
Japan Electronics and Information Technology Industries
Association; The Tokyo Chamber of Commerce and Industry;
The Japanese Liquid Crystal Society; The Vacuum Societyof Japan; Japan Vacuum Industry Association; Japan
Electronics Packaging and Circuits Association; Nippon
Electronic Device Industry Association; Semiconductor
Equipment Association of Japan; Japan Venture Capital
AssociationRegistration ▶▶▶ www.semiconjapan.org

Find Your Roadmap to the Future Here.
Manufacturing
Innovation Pavilion

Global executives will convene at SEMICONJapan to discover the latest technology andWORLD OF IOT is a platform where silicon
technology intersects with the world of IoT.

Explore the challenges and solutions todevice scaling and “More than Moore”
technology.

Showcasing pitch presentations andexhibits from startups and early-stage
companies.

The 40th SEMICON Japan memorial
program to facilitate workforce development
for the future. (Programs on page 2)

business developments. (Schedule onpage 4)

Sustainable
Manufacturing Pavilion

Discover solutions focused on enhanced
sustainability with secondary equipment,environmental compliance and horizontal
specialization.

SEMICON Japan 2016 Sponsors (in alphabetical order)
Platinum Sponsors

Gold Sponsors

As of Oct. 1

East Hall 3

Meet 700 exhibitors who

East Hall 2

Front-end
Process Zone

lead innovation and new

East Hall 1

Back-end Process/Materials &Overall Process Zone

Manufacturing Innovation
Pavilion

Sustainable Manufacturing
Pavilion
Entrance fromnearest station

businesses
Front-end
Process Zone

Explore exhibits thatcover the entire device
manufacturing process

ConferenceTower

East Hall 4

East Hall 5

Visit www.semiconjapan.org for the latest information and list of exhibitors.

▶ Front-end Process Zone
This exhibition zone is for front-end products andservices, from device design through wafer
processing.

the 40th SEMICON Japan
Memorial Program Free▶ Back-end Process/Materials &Overall Process Zone
This exhibition zone is for back-end and“middle-end” products, services and materials.

Regional Pavilionst (FSNBO1BWJMJPOt ,PSFB1BWJMJPOt .PTDPX1BWJMJPOt 641BWJMJPOt 5PIPLV1BWJMJPOt ,ZVTIV1BWJMJPOt 7FOUVSF#VTJOFTT1BWJMJPOt Chamber of Commerce and Industry Pavilion

Students and young engineers bring ourindustry into the future. SEMI opens GAKKO(school) program to help their growth andengagements.
Supported by ● US Department of Commerce andSemiconductor Equipment Association of Japant TECH CAMP@GAKKOt MIRAI COLLEGE@GAKKO

Lectures and booth tours for university
students and graduatest MIRAI PROGRAM@GAKKO

Presentations and discussions for students
and young engineers
t THE KOSEN@GAKKO

Hackathon based program to develop
innovative business planst ACADEMIA@GAKKOExhibits by technical college students on
their unique researchest INNOVATION Reception

University and institute research exhibits
for collaboration with industry

A networking program for students, youngengineers and startups

Show Floor Events
Exhibitor Presentations
Listen to exhibitor presentations on new products,
technologie s and development concepts.
Attendance is free of charge.

Venue ● East Hall 4

Venue ● East Hall 1

Venue ● East Hall 3

FreeDate/time ● Dec. 15 / 16:00–17:00
Venue ● Participating exhibitor booths
Join select exhibitors during this hospitality event. Engageand network in a relaxed environment.

INNOVATE Reception (Invitation Only)FreeDate/time
Venue ● INNOVATION Lounge, East Hall 3
A special networking opportunity for WORLD OF IOT andINNOVATION VILLAGE participants and visiting young engineers.
● Dec. 15 / 17:00–18:00

Partner Events

SEMI Presidents Reception

International Symposium on Semiconductor
Manufacturing (ISSM) 2016

Paid event

Date/time ● Dec. 14 / 17:15–18:30
Venue ● Reception Hall B, Conference Tower 1F
The SEMI Presidents Reception is an ideal opportunity forsemiconductor manufacturers and executives fromequipment and materials companies to get together andnetwork on a global scale.

SEMI Standards Awards Ceremony andFree
Friendship Party
Date/time ● Dec. 15 / 17:30–19:00
Venue ● Room 607, Conference Tower 6F
SEMI Standards members from around the world join tonetwork and celebrate our achievements together, including
presentation of the SEMI Standards Awards.

SEMI Standards Meetings

Networking Events
SEMICON Japan Happy Hour

Conference Tower Events

FreeDate/time ● December 14–16 / 8:00–17:00
Venue ● Rooms on Conference Tower 6&7F
SEMI Standards are used extensively around the world inthe microelectronics manufacturing. Any registered SEMI
Standards member may participate in the meetings.

Date/time ● December 12–13
Venue ● KFC Hall & Rooms, Sumida-ku, Tokyo
ISSM's mission is to achieve the continued prosperity ofthe semiconductor industry by bringing about breakthroughs
in semiconductor manufacturing technologies.
Registration ● https://www.semiconportal.com/ISSM

AGRO Innovation 2016
<AGRI TECHNO WEEK 2016>
Date/time ● December 14–16
Venue ● West Hall, Tokyo Big Sight
Organizer ● Japan Management Association
You can visit the professional exhibition showcasing frontline technologies for the agricultural business with yourSEMICON Japan badge.
Registration ● http://www.jma.or.jp/ai/en/

Exhibitor Search Tool
The Exhibitor Search engine will be available through
SEMICON Japan website in November to help planning
your visit with detailed exhibitor information.

Follow SEMICON Japan on SNSSearch semicon japan

onfacebook andtwitter

WORLD OF IOT related programs

MIRAI GAKKO related programs

Venue: East Hall 1, Tokyo Big Sight

10:20–12:00Thu., Dec. 15

Asia Semiconductor Market Seminar

Overview of Semiconductor Device
Fabrication Process ̶ presented by SEMI

Flexible Hybrid Electronics Forum (1)
12:50–14:30

15:10–16:50Fri., Dec. 16

Wed., Dec. 14
Trends in the China and India
Experts will discuss future trends in China. Additionally,representatives of the Indian semiconductor sector will
describe the present status of the Indian semiconductor
industry and the outlook for the future.

FHE in the IoT and wearable devices
In 2015, SEMI formed a strategic partnership with theFlexTech Alliance. This session will discuss newtechnologies of IoT and wearable devices, based onconventional semiconductor and ﬂexible electronics
technologies.

MIRAI PROGRAMS@GAKKOThis session will cover key features of semiconductor
production technology, structure of CMOS, individual
technologies used in the production of MOS LSIs,
applications, principles and the basic structure of devices.

Sustainable Manufacturing & HighTech Facility Forum (1)STS Packaging Session
Fan-out Wafer Level Packaging Technologies
In this session, experts from OSAT and assembly
equipment and materials suppliers will present the latest
case studies of the development of fan-out WLP
products and technology.

STS TSV/2.5D/3D Session

Towards Increased Efficiency Through Reduced
Energy Consumption
This forum examines environmental, health, and safety(EHS) issues, focusing not only on energy savings inindividual ﬁelds, but also on the needs of end users andsolution technologies suppliers offer.

TSV 3D Business in FutureThis session will present a cost image of 3D TSV
mounting and consider the future prospects for 3D
mounting, using GPU and semiconductor embedded
substratesas case studies, from the viewpoint of EDA.

Flexible Hybrid Electronics Forum (2)STS Test Session

Academia Session

Developments in FHE applications
This session will focus on end products as case studiesof applications of FHE. Begin with the latest trends anddevelopment case studies in wearable products,
personal devices and IoT-related applications.

Testing Technology for IoT Devices
This session will feature presentations on test technology
required in the development and mass production of IoT
devices by speakers at the forefront of the sector.

ACADEMIA@GAKKO
Seven schools selected from among the more than 40
schools that exhibited at Academia@GAKKO will present
the results of their latest research.

Venue: East Hall 3, Tokyo Big Sight
STS MEMS/Sensor Session (1)
10:20–12:00

12:50–14:30

15:10–16:50Widening Applications for Sensors
This session will examine case studies of the applicationof sensors in three high-proﬁle areas: sports science,
construction machinery, and drones, exploringthe potentialof the industry and technology.

IoT and Innovation Village Joint
Talk Session
Manufacturing Startups today
The number of university-related research & development
startups and manufacturing startups in Japan has been
growing in recent years. This session will bring together
leading entrepreneurs to explore these issues.

The Healthy Life of the Future, Built on IoTThis forum will look at the future that the incorporationof information technology into health and medical carewill bring, and will present the latest technologies andsolutions.

STS MEMS/Sensor Session (2)INNOVATION VILLAGE Pitch (1)IOT Platform Forum

Heterogeneous-Integration in MEMS
Microsystems are expected to bring about a qualitativetransformation. This session will explore the potential ofheterogeneous integration through presentations on markets,
application technologies and elemental technologies.

Start-Up Presentations
The Innovation Village will showcase start-ups
presenting unique ideas, technologies, products,and services.

IoT Platform Utilization Technology for Manufacturing Industry
This forum will look at how platforms can be used toachieve a more organic fusion between manufacturing
and IoT devices, and create more services and business
opportunities.

STS Special Session –AI–INNOVATION VILLAGE Pitch (2)Smart Manufacturing ForumAI technology
In this special session, speakers at the forefront of theAI ﬁeld will outline the evolution of AI technology, its
potential for application in daily life, and the challenges
to overcome.

Start-Up Presentations
The Innovation Village will showcase start-ups
presenting unique ideas, technologies, products,and services.

Representatives of the Industrial Internet Consortium(IIC), which has grown rapidly since its foundation inMarch 2014, will discuss their vision for IoT technologies
with speciﬁc case studies.

STS Power Device Session (1)–12:00

12:50–14:30

15:10–16:50FreeSmart Healthcare Forum

Venue: East Hall 5, Tokyo Big Sight

10:20

Free

The New Material Power Semiconductor (1)The commercialization of power devices using new materials
is beginning to gather momentum. This session will cover thepresent situation in SiC and GaN power devices and mounting,and peripheral technologies, including market trends.

FreeSTS Advanced Lithography Session (1) Semiconductor Used Equipment
Progress of EUV lithography for HVMBusiness Seminar
It is said that the application of EUVL to the mass
production of semiconductors is only a matter of time.
This session will examine the current state of readinessand recent developments in EUVL.

Solutions Supporting the Expanding 200mm Market
This session will begin with an update on the Chinese
market. Followed by the utilization of used devices, andan analysis of future trends in the 200mm market.

STS Power Device Session (2)STS Advanced Lithography Session (2) STS Advanced Device Session (1)The New Material Power Semiconductor (2)The commercialization of power devices using new materials
is beginning to gather momentum. This session will cover thepresent situation in SiC and GaN power devices and mounting,and peripheral technologies, including market trends.

Status of Lithography Extensions
This session will introduce the latest developments inlithography technology including immersion exposure,nano-imprint technology, and multi-electron beamtechnology.

Future Visions for Advanced Devices (1)Understanding the cutting-edge device and process is the key
to mobile and IoT, development of logic, memory, and image
sensor devices continues. In this session, leading engineers
will present the latest technological trends and developments.

CGMG Forum

Challenges of Young Engineers

STS Advanced Device Session (2)Chemicals & Gases
This forum will look at the materials requirements forhigh-volume semiconductor manufacturing at 10, 7, and5 nm. Speakers will review device makersʼ expectations
and requirements of new materials and process gases.

MIRAI PROGRAMS@GAKKO
Young engineers describe their experiences andapproaches to their work. This session presents anoutstanding opportunity for young engineers to gain
inspiration and ideas for the future.

Future Visions for Advanced Devices (2)Understanding the cutting-edge device and process is the key
to mobile and IoT, development of logic, memory, and image
sensor devices continues. In this session, leading engineers
will present the latest technological trends and developments.

Venue: Reception Hall A, Conference Tower 1F, Tokyo Big Sight

FreeJapanese-English Interpretation Available
Donʼt miss connecting to the latest information and insight from the worldʼs top executives andleading technology experts!

Wed., Dec. 14
9:40–10:10

10:20–12:00Thu., Dec. 15

Opening Ceremony
Opening Keynotes

Industrial IoT Forum

Technology Trend Forum

Into the Future
Computers are changing the world of the future,transforming our culture. What must we do in this newworld? The worldʼs leading researchers will present theirunique insights into the future.

Competition in Manufacturing Industry Digitizes
IoT technologies bring great changes in themanufacturing. In this forum, directors of leading
Japanese, German and US core companies will explore
long-term technological and business outlook andgrowth strategies at a global level.

The Tokyo 2020 Olympics: Innovation for All
What science and technology can do for the 2020 Tokyo
Olympics, regardless of language and culturaldifferences? This session will discuss visions, initiatives
and new technologies in every ﬁeld.

Dario Gil
Vice President
Science & Solutions
IBM Research

Yoichi Ochiai
Assistant Professor
Head of Digital Nature Group
University of Tsukuba

The Creation of New Business Opportunities
Top executives from the global semiconductor industry
will look to the future with views into new businesscreation and its role in enriching our lives.

–14:30

Yasuo Naruke
Representative Executive Officer, Corporate Senior
Executive Vice PresidentPresident and CEO, Storage& Electronic Devices Solutions Company
TOSHIBA

Yasuhiro KANATANI
Director
Department of Health Crisis Management
National Institute of Public Health
Masahiro Ido
Executive Officer / Director of Tokyo Olympic & Paralympic
Enterprise Division / Director of Business Solution Division
Panasonic

Manufacturing Innovation Forum
Breakthrough Technologies for the Future
The semiconductor industry has begun to follow two
different paths: further device scaling and a new
approach high performance. Executives from leading
companies the way in manufacturing innovation will
discuss their strategies and outlooks.

Masayuki Habaguchi
Operating Officer
Automobile R&D CenterHonda R&D

Shigeyuki Uzawa
Managing Executive Officer
Chief Executive, Optical Products Operations
CanonYang Pan
Chief Technology Officer
Global Products GroupLam ResearchToru BajiGPU Evangelist
NVIDIA
Katsuhiko Itagaki
Corporate Chief Professional for Automotive
1st Solution Business Unit
Renesas Electronics

Toshi Nishigaki
VP ＆ General Manager
Development ＆ Production Division
TOKYO ELECTRONSEMI Market ForumUS Commercial Service IT ForumIOT Innovation ForumThe Electronics Manufacturing Supply Chain
Industry consolidation, advanced technology adoption,and China market development continue to shape theelectronics manufacturing sector. This forum will provideexpert insights on these complex factors and updated
forecasts for the electronics value chain.

Cyber Security for the Manufacturing Industry
Top executives from the worldʼs leading IT companies
will discuss "Cyber Security" in the manufacturingsector, with the full support of the Commercial Sectionof the United States Embassy.

Semiconductor Devices for IoT
The emerging technology market is set to grow. In thisforum, executives from leading semiconductor
companies will discuss technology outlook and strategies
for the future.

Akira Minamikawa
Research Director
Technology Research
IHS Markit

Scott Jarkoff
Senior Security Advisor
Cyber Security Initiative Office, Sales Engineering
McAfee, Intel Security Group

G. Dan Hutcheson
CEOVLSI ResearchJohn Kirch
Regional Director – North Asia
Darktrace

Clark Tseng
Sr. ManagerIndustry Research & Statistics
SEMI Taiwan

Yoshiyuki Hamada
Director Chief Technology Officer andInnovation Center Tokyo
Cisco Systems

Dan Tracy
Senior Director
Industry Research & Statistics
SEMIMihoko Matsubara
Chief Security Officer Japan
Palo Alto Networks

How to Register
Please visit▶

Mayoran Rajendra
Solution Architect
GE Digital
GE International

Automated Driving and Safety Control
Directors of leading companies working to develop
comfortable motorized society will examine thechallenges facing the industry, propose solutions, andreveal their outlook for the future.

Hiroshi Iwatsubo
Executive Vice President（Board Member）
Corporate Technology & Business Development Unit
Murata Manufacturing–16:50

Eizo Matsumoto
Deputy Director General for Science,
Technology and Innovation
Cabinet Office

Autonomous & Connected Car
Forum

Jack Sun
VP of R&D, CTO
Research and Pathfinding
TSMC

15:10

Taro Shimada
Senior Executive Operating Officer, Division Lead Japan
Digital Factory/Process Industries and Drives Division
Siemens Japan

Kiyonori Inaba
Member of the Board Executive Managing Officer
General Manager, ROBOT Business Division
FANUC

Semiconductor Executive Forum

12:50

Fri., Dec. 16

www.semiconjapan.org

Visitors of the exhibition are strongly encouraged to
pre-register via the website.
Pre-registration is required for all sessions and events.

Inquiries SEMICON Japan Executive Secretariat
Tel: +81-50-5804-1281 Email: semicon@sakurain.co.jp
Open: 9:30–17:00 weekdays (excluding 12:00–13:00)

Martin Cotter
Vice PresidentInternet of Things (IoT) and Healthcare andConsumer Business Units
Analog Devices
Infineon Technologies

CP Hung
Vice President
Corporate R&D
ASE GROUPTokyo Big Sight Access Information

Hotel

By train

Hotels in the vicinity of Tokyo Big Sight can be reserved
at special reduced rates.

t Tokyo Waterfront Area Rapid Transit, Rinkai Line, get off
at the Kokusai Tenjijo Station, 7 min walkt New Transit System, Yurikamome, get off at the
Kokusai-tenjijo-seimon Station, 3 min walkBy limousine bus from the airportt "QQSPYNJOVUFTGSPN/BSJUB"JSQPSU HFUPGGBUTokyo Bay Ariake Washington Hotel, 3 min. walk)t "QQSPYNJOVUFTGSPN/BSJUB"JSQPSU HFUPGGBU5PLZPBig Sight)

Inquiries/Application
JTB Global Marketing & Travel
SEMICON Japan 2016 JTB Desk
Tel: +81-3-5796-5446
Email: semicon2016@gmt.jtb.jp