Sample Report
Typical LCD Panel Analysis Menu

1. Optical Characteristics non-destructive
2. Driving Characteristics non-destructive
3. Mechanism analysis
4. Panel analysis
5. Circuit analysis
6. Cross sections

LTEC Corporation１. Optical Characteristics （AUO LCD module)

Photo.1-1-1 Monitor

1
0.9
0.8

Green

0.7

y0.6
0.5
0.4
0.3

White

0.2

RedBlue

0.1
00

0.1

0.2

0.3

0.4

0.5

0.6

0.7

x

Fig.2-1 Chromaticity Coordinates

LTEC Corporation

0.8

0.9

1

1.2

1Luminance(A.U)

0.8

0.6

0.4

0.2

0rightleftFig.2-3 Luminance Variation(X-direction)rightleft

White Display

LTEC Corporation

2. Driving Characteristics
2-1. Measuring terminal

Source Driver

Commonelectrode(Vcom)

Gate Driver

Source line
Gate line

Gate line1
Gate line2

Source line1 Source line3
Source line2

Photo.1-2-1 Measurement part
LTEC Corporation

2-2. Pixel layout
The connection of the source line
reverses in the direction of the column of the pixel.

Source line

common line

gate line

Source line 1

Source line 2

Source line 3
Gate line 1

ACOM_L1

ACOM_L1

ACOM_L1

ACOM_L1

Gate line 2

ACOM_L1

ACOM_L1

ACOM_L1

ACOM_L1

Gate line 3

ACOM_L1

ACOM_L1

ACOM_L1

ACOM_L1

Gate line 4

ACOM_L1

ACOM_L1

ACOM_L1

ACOM_L1

Fig.1-3-1 Estimated pixel circuit
LTEC Corporation

2-3 Signal waveform acquisition
The image data of the following table created with PC is displayed on theanalysis products, and the signal waveform at that time is acquired.
The graphics format is set to JPEG.
Resolution of image data is set to the 2048x1536 pixel, same as the display
resolution of the analyzed product.

Table.1-4-1 Display image composition list
Image dataBlackWhiteRedGreenBlueBlack

Data composition(8bit)
RG
B
000255255
255
255000255000255

Image size(pixel)
2048×1536
2048×1536
2048×1536
2048×1536
2048×1536

White

Fig.1-4-2 Example of display image

LTEC CorporationRed2V/div

Source line

Fig.1-5-6 Frame waveform of source line_1 (Red image display)

Source line

2V/div

RG GR

G G

R R

Fig.1-5-7 Waveform of source line_1 (Red image display)

LTEC Corporation

Gate line
Gate line2
Gate line1

5V/div

1 frame period≒16.7ms

Fig.1-5-32 Frame waveform of gate line

Gate line2
Gate line1

5V/div

Fig.1-5-33 Waveform of gate line

LTEC Corporation

3. Mechanism analysis

AUO LCD module

Photo.3-1 LCD Module (Top View)

Photo.3-2 LCD Module (Bottom View)
LTEC Corporation

ABBA
Light guide plate
Flexible substrate
Optical sheets
Liquid crystal panel
Resin frame
Buffer member(1st～3rd)

Metal frame

LEDLED board

Rear frame

Reflective sheet

Fig.1-1 Cross-sectional view module

LTEC Corporation

Wiring board

ICOptical sheet

Optical sheet

Rear frame

・The position of an optical sheet is fixed by the rear frame.

Photo.3-21 Module (Top View)
LTEC Corporation※After removing
the metal frame, Panel,Resin framePhoto.3-33 Rear frame
LTEC Corporation

Photography direction

Photo.3-36 Light source (LED)

LTEC Corporation

4. Panel analysis

4-1 Liquid crystal panel peripheral area OM image

Driver IC

Photo.3-1-2

Photo.3-1-1 Panel peripheral area OM image (display side)

LTEC Corporation

Photo.3-1-3

Photo.3-1-4

Photo.3-1-5

Photo.3-1-2 Display region peripheral area OM image (display side)

LTEC Corporation

5 Circuit analysis
signal line

signal line

wiring A
wiring A

wiring Bwiring B

Photo.3-1-3 Static protection element OM image (display side)
LTEC Corporation

wiring A16145

commonbus line
Dummy scanning line

1wiring B

Common wiring

scanning line
signal line

Display region

wiring C

Dummy signal line

1536

Dummy scanning line
wiring D
wiring E

wiring D’

Static protection element

Driver IC

Fig.4-1 Array substrate peripheral layout
LTEC Corporation

Flexible substrate5 Circuit analysis

A10

in2-out2 wire

in1-out1wire
A11
VVDD

Vss
int.CKV
int./CKVPhoto.31 Shift Register Cell(Scanning Line)

LTEC Corporation

LTEC Corporation

in1out1A11out4out3

Fig.11.3 Shift Register Cell(Scanning Line)

*2P

*2P

out2in2

Vssint./CKV
int.CKV*Pは並列接続数*Sは直列接続数
Logicの上部にはP-Mos,下部にはN-Mosの並列接続数を示す

VVDD

A10=

out4out1

Shift
Resistor1

in2

out2
out3in1

6. Cross-section analysis

TPO panel module

6-1 TFT cross-sectional STEM
observation
direction

Photo.4-1-1 TFT cross-sectional observation point

Photo.4-1-8

Photo.4-1-3

Photo.4-1-2 TFT cross-sectional STEM image

LTEC Corporation

TFT cross-sectional STEM-EDX
Si、NC、OMo、OSi

SourceelectrodeAlSi

Si、N

Organic film
Protectionfilm

Mo、O

Semiconductor
layer (n)Semiconductor
layer (i)Gateinsulating film

Mo、O

Gate electrode

Si、N

Al
Si、O、Ca

In、O

Pixel electrode
Insulating film
Si、N

Oppositeelectrode
Organic film
In、OIn、O

Photo.4-1’-1 TFT EDX analysis summary
LTEC Corporation

Transparent glass substrate

Photo.4-1’-2 EDX analysis point (Transparent glass substrate)
Si・ Sample creation ：FIB (using Ga ions)・ Sample mesh ：Made of Cu

O※Transparent glass substrate：Si、O、Ca（Cu、Al is dispersion from the circumference. ）

AlCu
Cu
Ca

Fig.4-1’-1 EDX analysis results (Transparent glass substrate)
LTEC Corporation