資料8-ECommission E (Electromagnetic Noise and Interference) Activity Report
April 2014 - July 2014
Domestic academic activities:
The Technical Committee on Electromagnetic Compatibility (EMCJ) of the Institute ofElectronics, Information and Communication Engineers (IEICE) had four regular technical meetings
in the period of April to July 2014 where 28 regular reports and three special talks were presented. In
May the International Symposium “EMC’14/Tokyo” was held, and hence there was no domestic
EMCJ meeting. The featuring technical topics for the regular EMCJ meetings were “Antennas andPropagation” in April, “PCB, Information Security” in June, and “Discharge, Electronic Packaging”
in July. The first regular meeting in July was the annual“EMCJ Young Researchers’ Presentation
Meeting” (http://www.ieice.org/cs/emcj/jpn/events/wakate/) co- sponsored by the TechnicalCommittee on Electromagnetic Characteristics (TC-EM) of Japan Institute of Electronics Packaging(JIEP), where 9 reports were presented.
“Special Talks” presented in April, June and July meetings were as follows.
（1） Yoshishige Yoshikawa (Panasonic), "Expansion of Wireless Communications for Social
Infrastructure and Their Technologies -- Development of Low-Power Radio Systems for
Machine-to-Machine Communications --".
（2） Mitsuo Yokokawa (Kobe Univ.), "On the occasion of completion of the K computerdevelopment project".
（3） Ryoji Yoshino (Environmental Research Office), "About various activities related toelectromagnetic environmental engineering in Architectural Institute of Japan".
( http://www.ieice.org/ken/program/index.php?instsoc=IEICE-B&tgid=IEICE-EMCJ )International Symposium:
1. “2014 International Symposium on Electromagnetic Compatibility, Tokyo (EMC’14/Tokyo)”.
May 12th to 16th, 2014, at "Hitotsubashi Hall (National Center of Sciences)", Tokyo.
(http://www.ieice.org/~emc14/ )This symposium is the 7th event of the series of EMC Symposium, which was started in 1984 in
Tokyo and has been held every five years in Japan, celebrating its 30th anniversary this time. It wasorganized by IEICE Technical Committee on Electromagnetic Compatibility (EMCJ), sponsored by
IEICE Communications Society. The symposium was technically co-sponsored by the IEEE
Electromagnetic Compatibility Society (EMC-S) and the Technical Committee on EMC of theInstitute of Electrical Engineers of Japan (IEEJ). It was also technically cooperated by 15 national
and international organizations related to academic and standardization activities on electromagneticcompatibility, including URSI. The Organizing Committee of EMC’14/Tokyo was formed underIEICE-CS, with the chairperson Prof. Masao Taki (Tokyo Metropolitan Univ.) and vice chairperson
Prof. Osami Wada (Kyoto Univ.).
Totally 510 persons, including 18 invited attendees, 54 students, and 21 accompanying persons,from 26 countries attended the symposium. Attendees consisted of 339 persons from Japan and 171
persons from foreign countries. Total of 246 papers, that are 125 papers from Japan and 121 papers
from foreign countries, were presented. Technical program of EMC’14 consists of regular sessions,organized sessions, workshops, and tutorial sessions. We note that approximately 1/2 of presentedpapers were from foreign countries. The proceedings of EMC’14/Tokyo include 218 original papers
in total in 28 regular sessions and 17 organized sessions. These papers and additional 28
presentations for workshops and tutorial sessions were presented in four parallel sessions. The
technical topics and the number of papers and presentations in each session are listed in Table 1.

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資料8-EFor regular sessions, 172 papers were submitted from 24 countries, and 117 papers were accepted.
For the organized sessions, 101 original papers were accepted. All the papers, except for two in
regular sessions and two in organized session papers which were accepted but not presented at thesymposium, will be included in the "IEICE Proceedings Archives", the "IEICE Knowledge
Discovery (I-Scover)", and the "IEEE Xplore", based on the agreement between IEICE and IEEE.
Seventeen special topics were selected for organized sessions. In the preparation of the technicalprogram of this symposium, we arranged four of the organized sessions as “Joint Workshops /Organized Sessions” which include original papers and some presentations related to the special
topics, which could help attendees to get overviews of the recent trends and latest information.
The specific topics in EMC’14/Tokyo are “Biological Effect and Safety” (16.5 % of regularsessions and organized sessions papers) and “PCB and Device Level EMC” (15.6 %), though“EMI/EMC Measurement Technology” (17.0 %) has been the largest portion of the topics. In
particular, IC and chip level EMC issues have become a focus of research. “Power System EMC” isanother important topic with increase of papers related to Wireless Power Transfer.
Table 1: Session Topics and Number of Papers in EMC’14/Tokyo
Regular Session Papers"Technical Fields"

Organized Sessions and Workshop/Tutorial
RS Session Topics

Session Topics(RS, OS, WS/TU)
Biological Effect andSafety(22, 14, 0)

Biological Effects, EMF Safety & EMC
in Medical Applications and Safety
Numerical Modeling/ Biological Effects

PCB and Device Level
EMC(19, 15, 6)

EMI/EMC
Measurement Technology(18, 19, 12)

Chip, Package, PCB & Cables

EMC Management and Standards

EMC Measurements
Power System EMC(10, 14, 7)Power Electronics &Vehicles (8, 7, 1)Aerospace EMC(0, 5, 0)
Numerical Modeling(14, 10, 0)

EM Absorber andShielding (11, 0, 0)
Immunity, ESD andTransient (8, 4, 0)Communication System
EMC (7, 0, 0)
EM Information Leakage(0, 6, 0)
Earthquake Prediction(0, 7, 0)Lightning(0, 0, 5)High Power & High Voltage EMC
Power System EMC(EMC Aspects of Wireless Power
Transfer Systems)
Power Electronics & Vehicles

OS WS/TU
18 Recent Trends of Standardization Activities 7and Evaluation Techniques for the Electromagnetic Exposure to the Human Body
4 Active Implantable Medical Device EMI
719 Signal Integrity and Unintentional EM
Radiation Related to Printed Circuit Boards
3D-IC and Packages
IC Chip Level EMC for
Telecommunication
4 [Tutorial]: Recent Topics of EMC
Standardization - Role of ACEC
Improving the Measurement Uncertaintyof EMI Testing
Metrological Approach for Result
Validation and Improvement ofMeasurement Quality
Photonics-applied Electromagnetic
Measurement
14 Photonics-applied Electromagnetic
Measurement for EMC
5 EMC Topics Related to Smart Grid
4 Recent Trend of EMC on Smart Grid
1 EMC Aspects of Wireless Power Transfer
Systems
8 Automotive EMC

6286557167756Shielding, Grounding & Materials
Immunity / Susceptibility, ESD andTransients
Communication System EMC

8 Electromagnetic Noise Radiation and EMI
Effects Caused by ESD
74EM Information Leakage

37

Aerospace EMC
14 Computational Techniques, Modeling, andSimulation for Electromagnetics
GPU Computing-based Acceleration ofElectromagnetic Simulation
11

Numerical Modeling

146

Electromagnetic Phenomena Associated 7with Earthquakes: Earthquake Prediction
Recent Lightning Current Data from5
Instrumented Towers
Sum 117
Sum 101 28

RS=Regular Session, OS=Organized Session, WS=Workshop, TU=Tutorial

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資料8-EA Plenary Session was organized under the title of “New Horizon of EMC Research”, and twotalks below were given.
“A New Paradigm in ICT and the Role of EMC Research” by Dr. Masao Sakauchi, National
Institute of Information and Communications Technology, Japan.
“EMC Applications of Electromagnetic Time Reversal” by Dr. Farhad Rachidi, Swiss
Federal Institute of Technology, Switzerland
There also was a Keynote Session titled “Overview of EMC Research Trends”, and the following
three talks were given.
“EMC Research Trends in the USA” by Dr. Robert Scully, NASA, President of IEEE EMC
Society, USA.

“EMC Research Trends in Europe” by Prof. Marcello D’Amore, Sapienza University ofRome, Italy.
“Overview of EMC Related Issues in Japan and Vicinity” by Prof. Liuji R. Koga, Okayama
University, Japan.

Future International Conferences and Meetings:
1. “2014 International Symposium on EMC”, August 3-8, 2014, Raleigh, NC USA.
(http://www.emc2014.org/).
2. “EMC Europe 2014", Sept. 1-4, 2014, Gothenburg, Sweden. (www.emceurope2014.org)
3. "Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC 2015)",May 26-29, 2015, Taipei, Taiwan. (http://www.apemc2015.org/ ) ; Special Session Submission:
Sept. 1, 2014; Preliminary paper submission: Nov. 1, 2014; Final Paper Submission: Feb. 15,2015.

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