TOKYO ELECTRON ANNUAL REPORT 2013

PAGE10CONTENTSCONTENTS

Financial Highlights

Business Overview

Top Message

Review of Operations
and Business Outlook

Special Feature

Corporate GovernanceFeatures — Technological Innovation in Pursuit of Growth
Feature 3: Technology Acquisitions

Corporate CitizenshipIntellectual Property

Financial Section

Corporate Data

Feature 1: Product Development / Feature 2: Research and Development

Feature 4: Manufacturing

Features: Technological Innovation in Pursuit of Growth
Feature 1: Product Development

Feature 2: Research and Development

Increasing Business Opportunities through Production
Equipment Innovation
Until recently, PCs drove the semiconductor market, but in the past year
mobile devices such as smartphones
and tablets have come to the fore. Theirconsiderable growth is also expected totrigger demand for servers and storage
for the cloud services. The year was ahistoric turning point that changed thefuture course of the industry.
The higher speed and lower power consumption demanded of semiconductor

Hikaru Ito
Corporate Director,
Executive V.P., SPE,
Senior General Manager,
SPE Sales Division &General Manager, ESBU

from customers. In memory chips, 3Dstructures are expected to be employed inNAND flash memory. In these structures,Tokyo Electron is attracting attention for its
deep silicon etch technology, used in
DRAM trench processes. Also garneringinterest is our wafer bonding technology
used in bonders/debonders, in the area ofadvanced packaging technologies.
Improving equipment productivity is an

The semiconductor technology is facing
two serious bottlenecks: miniaturizationand power consumption. To realize
continuous growth, we must create
innovative technologies that overcome
these bottlenecks.
In order to continue scaling semicon-devices have become more important thanever. Development is advancing in an
extremely wide variety of semiconductor

important task as the number of wafer
process steps increases. Tokyo Electron’s
new NT333™ ALD system, CLEAN
TRACK™ LITHIUS Pro™ Z coater/devel-process technologies, including patterningtechnology centered on conventional lithography, 3D structures, materials and packag-oper, CELLESTA™ -i single wafer cleaning system and nearly all of theCompany’s products used in wafer pro-with consortia around the world. Also,
Tokyo Electron has superior multiple patterning technology using etching combined with unique film deposition,achieving 11nm line patterns. Single digit

ing. In close collaboration with its
customers, Tokyo Electron is conducting
advanced technological development inthese and other core areas.
Demand is rising for equipment thatrealizes low damage and high selectivity,
especially in 3D structure devices, which
are gaining momentum as they shrink

cesses feature productivity that is 1.5 to 2
times higher than previous generations.
Furthermore, we are advancing development of new products for the 450mm
wafer generation.
Moving forward, the product cycle ofadvanced electronics will continue toshorten, and speed will be increasingly
important in the development of production equipment. Tokyo Electron will meetthe needs of the era through allianceswith customers, consortia and universities, and by offering production equipment for next-generation technology
before anyone else.

below 20nm. Tokyo Electron is meetingthese needs with proprietary RLSA™ etching technology, dry cleaning technology,
and wet cleaning technology acquired withFSI International last year that eliminates
the need for ashing. These are garneringhigh levels of interest and tool evaluations

Aiming for sales expansion through product development in response to new technologiesThe latest coater/developermodel, with increased
through-put and enhanced
defect reduction for furtherminiaturization

Semi-batch ALD system
employing a concept different from existing ALD
processes, realizing highquality nano-scale deposition while maintaining
high productivity.
ALD System
NT333™

Boldly Advancing Innovative TechnologicalDevelopment

Coater/Developer
CLEAN TRACK™ LITHIUS Pro™ Z

Silicon plasma etch systemcharacterized by low damage and high selectivity,with excellent 3D structuretransistor formation process performance
Plasma Etch System
Tactras™ RLSA™ Etch

ductors, Tokyo Electron is developing
technologies for EUV* lithography, apromising next-generation technology,

nm lines are now in sight. In addition,
Tokyo Electron is developing DSA** technology which makes circuit patterns byusing chemical reactions, without exposure and development. Through theseefforts, Tokyo Electron is pursuing a fullrange of technological development
aimed at further miniaturization.
Technologies that solve the problemof power consumption will make use of
new semiconductor materials to reduce
operating voltage and to reduce standby power by introducing nonvolatilememory to replace DRAM and SRAM.
Research into germanium (Ge) andindium gallium arsenide (InGaAs) as new
semiconductor materials with high carrier
mobility is advancing. Integrating these different types of semiconductors on silicon
substrates will mean a great upheaval,
equivalent to restarting the development ofsilicon semiconductor device production
processes. To face this change, Tokyo
Electron is developing manufacturing technology based on bold ideas that transcend
conventional wisdom.
MRAM is currently the only candidate

for nonvolatile memory to replace today’s
standard forms of working memory. The
key to realizing highly integrated magnetic
memory lies in magnetic materials andproduction technology to integrate them.
In order to pursue development of manufacturing technology optimized for thesematerials, we are accelerating development via joint research with world leader
Tohoku University.
Tokyo Electron is also tackling environmental and energy-related problems inorder to realize a more sustainable society. The Company is actively engaging indevelopment of thin-film silicon photovol-

Shigetoshi Hosaka
Senior Vice President,
General Manager,
Corporate Development Division

taic panels to provide green energy andOLED panel production technology,
which is expected to achieve commercial
viability and promises high luminosity andlow power consumption.
In these and other areas, Tokyo
Electron continues to boldly advance innovative technological development of rapidlychanging, cutting edge technology.
* EUV: extreme ultraviolet** DSA: directed self-assembly

11nm line pattern realized withmultiple patterning technology

Tohoku University Center for Innovative Integrated Electronic Systems, Research andDevelopment Building, completed April 2013

Tokyo Electron is taking part in the research and development program conducted by Tohoku University Center
for Innovative Integrated Electronic Systems, with the aim of quickly establishing production equipment technology for MRAM (magnetoresistive random access memory), which is attracting attention as a next-generation
memory device.