Q Bridge Thermal Conductor
GENERAL DESCRIPTIONKYOCERA AVX’s new Q-Bridge Thermal Conductor is manufactured with the highest quality materials forreliable and repeatable performance providing a cost effective thermal management solution. These devices
are constructed with Aluminum Nitride (AlN) or Beryllium Oxide (BeO) and are available in standard EIA formfactors.
Q-Bridge provides the designer with the ability to manage thermal conditions by directing heat to a thermal
ground plane, heat sink or any other specific thermal point of interest. The inherently low capacitance makes
this device virtually transparent at RF/microwave frequencies. This device has the added benefit of offering
additional layers of protection to adjacent components from hot spot thermal loads.
Q-Bridge provides the benefit of increased overall circuit reliability. KYOCERA AVX’s Q-Bridge is manufactured
using one-piece construction, providing a RoHS compliant SMT package that is fully compatible with high speed
automated pick-andplace processing. It is available in multiple different EIA case sizes. Custom configurations
are also available.

FEATURESAPPLICATIONSFUNCTIONAL APPLICATIONS•••••••••••••••••••High Thermal Conductivity
Low Thermal Resistance
Low Capacitance
Increases Circuit Reliability
RoHS Compliant
More efficient thermalmanagement

HOW TO ORDERGaN Power AmplifiersHigh RF Power Amplifiers
Filters
Synthesizers
Industrial Computers
Switch Mode Power Supplies
Pin & Laser Diodes
LNA

QB0603A

25

W

Between active device and adjacent ground planes
Specific contact pad to caseContact pad to contact pad
Direct component contact to via pad or trace
Edges fully metalized

TTQ-BridgePackaging

Case Size

T = 1000pcs., 7" reelT\500 = 500pcs., 7" reelC = Matrix Tray

Please see 'Case Size' Column of
Typical Characteristics Table BelowTermination

Substrate

T = Tin/Nickel Finish
Y = Silver Palladium (Non-Mag)
S = Silver over Nickel Termination
J = 60Sn/40Pb Solder Plated over Nickel

A = AIN
B = BeO

Thickness(mils)

Style

The above part number refers to a Q-Bridge, (EIA case size 0603), Aluminum Nitride Substrate,
Thickness 25 mils., Style W, Y Termination (Silver Platinum Non-Magnetic Termination),with Tape and Reel Packaging.

W = Edge Wrap
E = No Wrap

MECHANICAL CONFIGURATIONS
Edge Wrap (W)Case Size: 0302-1111

Partial Wrap (W)Case Size: 2010-3737

TERMINATION MATERIALSNo Wrap (E)Termination CodeTermination Materials

T

Tin/Nickel Finish

RoHS Compliant

Y

Silver Palladium (Non-Mag)

RoHS Compliant

S

Silver over Nickel Termination

RoHS Compliant

J

60Sn/40Pb Solder Plated over Nickel

Not RoHS Compliant

Case Size: 0302-3737

Note:
Non-edge wrapped style in all case sizes is supplied with S termination.
Edge wrapped style in case sizes 0302 through 1111 is supplied with Y, T, J termination, with a full edge wrap.
Edge wrapped style in case sizes 2010 through 3737 are supplied with S termination, with a partial edge wrap

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0008 | Rev 4– SPECIALTY THIN FILM PRODUCTS –25

Q Bridge Thermal Conductor
TYPICAL CHARACTERISTICS Inches (mm)CaseSize

Length (L)Width (W)Thickness(T)

Terminal(t)0302

0.030 ± 0.004(0.77 ± 0.102)

0.020 ± 0.004(0.51 ± 0.102)

0.02(0.51 ± .05)

0.01
(0.25)

0402

0.040 ± 0.004(1.02 ± 0.102)

0.020 ± 0.004(0.51 ± 0.102)

0.02(0.51 ± .05)

0.01
(0.25)

0505

0.050 ± 0.006(1.27 ± 0.152)

0.050 ± 0.006(1.27 ± 0.152)

0.025(0.64 ± .05)

0.015
(0.38)

0603

0.060 ± 0.006(1.52 ± 0.152)

0.030 ± 0.006(0.77 ± 0.152)

0.025(0.64 ± .05)

0.015
(0.38)

0805

0.080 ± 0.008(2.03 ± 0.203)

0.050 ± 0.008(1.27 ± 0.203)

0.04(1.02 ± .05)

0.02
(0.51)

1005

0.100 ± 0.008(2.54 ± 0.203)

0.050 ± 0.008(1.27 ± 0.203)

0.04(1.02 ± .05)

0.02
(0.51)

1020

0.100 ± 0.008(2.54 ± 0.203)

0.200 ± 0.008(5.08 ± 0.203)

0.04(1.02 ± .05)

0.02
(0.51)

1111

0.110 ± 0.008(2.79 ± 0.203)

0.110 ± 0.008(2.79 ± 0.203)

0.04(1.02 ± .05)

0.02
(0.51)

2010.195 ± .010
(4.95 ± .254).095 ± .010
(2.41 ± .254)

0.06(1.52 ± .05)

0.03(0.77)2525.240 ± .010
(6.10 ± .254).250 ± .010
(6.35 ± .254)

0.06(1.52 ± .05)

0.04
(1.02)

3725.370 ± .010
(9.40 ± .254).245± .010
(6.22 ± .254)

0.06(1.52 ± .05)

0.05
(1.27)

3737.365 ± .010
(9.27 ± .254).375 ± .010
(9.53 ± .254)

0.06(1.52 ± .05)

0.05
(1.27)

VoltageRating(V)

Thermal Resistance(°C/W)
AIN

10019200252501025020250

10500

13500

3500

72000

103000

44000

64000

4Thermal Conductivity(mW/°C)

BeO
121671378246343AIN
5340100
5010077320153100
240160240

BeO816115376
153122
508
240
159
380
254
380

Available
Configurations
Style

Termination

W

Y, T, JE

S

W

Y, T, JE

S

W

Y, T, JE

S

W

Y, T, JE

S

W

Y, T, JE

S

W

Y, T, JE

S

W

Y, T, JE

S

W

Y, T, J

E

SW

S

E

SW

S

E

S

W

S

E

SW

S

E

S

Note: Thermal conductivity is normalized to chip size. All values are approximate. Consult factory for extended thermal conductivity options.

CAPACITANCE
Case Size

03020402

0505

0603

0805

1005

26

Part Number

Capacitance (pF)

Case Size

Part Number

Capacitance
(pF)
0.204

QB0302A20WY/T/J

0.039

QB1020A40WY/T/J

QB0302A20ES

0.011

QB1020A40ES

0.121

QB0302B20WY/T/J

0.028

QB1020B40WY/T/J

0.158

QB0302B20ES

0.006

QB1020B40ES

0.092

QB0402A20WY/T/J

0.028

QB1111A40WY/T/J

0.096

QB0402A20ES

0.018

QB1111A40ES

0.042

QB0402B20WY/T/J

0.025

QB0402B20ES

0.009

10201111

QB1111B40WY/T/J

0.078

QB1111B40ES

0.031

QB0505A25WY/T/J

0.070

QB2010A60WS

0.070

QB0505A25ES

0.032

QB2010A60ES

0.042

QB0505B25WY/T/J

0.061

QB0505B25ES

0.027

2010

QB2010B60WS

0.055

QB2010B60ES

0.086
0.156

QB0603A25/WY/T/J

0.035

QB2525A60WS

QB0603A25ES

0.007

QB2525A60ES

0.114

QB0603B25WY/T/J

0.029

QB2525B60WS

0.122
0.075

2525

QB0603B25ES

0.007

QB2525B60ES

QB0805A40WY/T/J

0.081

QB3725A60WS

0.105

QB0805A40ES

0.018

QB3725A60ES

0.076

QB0805B40WY/T/J

0.055

QB3725B60WS

0.080

QB0805B40ES

0.015

QB3725B60ES

0.058

QB1005A40WY/T/J

0.046

QB3737A60W

0.164

QB1005A40ES

0.008

QB3737A60ES

0.130

QB1005B40WY/T/J

0.038

QB1005B40ES

0.007

3725

3737

QB3737B60WS

0.126

QB3737B60ES

0.099

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0008 | Rev 4– SPECIALTY THIN FILM PRODUCTS –Q Bridge Thermal Conductor
Application Notes
GENERAL APPLICATION
Specific applications require certain materials for best use conditions. Non-Magnetic applications are someof the leading examples with the strictest restraints. To accommodate all designs, KYOCERA AVX’s Q-Bridge
offers magnetic and non-magnetic termination styles.
Additionally, the requirements for the component attachment method will differ depending on the application.
Magnetic applications have less constraints and will typically use solder attachment. Nonmagnetic applications
will require conductive epoxy as an alternative attachment method.
The purpose of this app note is to look at the different attachment methods for Q-Bridge’s magnetic and nonmagnetic termination.

TERMINATION OPTIONSRECOMMENDED ATTACHMENT

Magnetic Terminations

S & T Termination Option• Silver Over Magnetic Termination (S Option)• Tin Plated Over Nickel Over Silver Platinum (T Option)• Best Use Attachment Method: Solder
Y Termination Option

Non-Magnetic Termination• Silver Platinum: Non-Magnetic Termination (Y Option)• Best Use Attachment Method: Epoxy• Alternative Attachment: Solder (Requires Additional Solder)

RECOMMENDED SOLDER PROFILEWRAP STYLE OPTIONS

Edge Wrap: Option W

No Wrap: Option E

RECOMMENDED SOLDER PROFILE: S & T TERMINATION• Mounted and Soldered Using 96.5% Sn, 3.0% Ag, 0.5% Cu Solder• Had Solder Wetting
QB0603A25WT: T TERMINATION, EDGE WRAP

QB0603A25ES: S TERMINATION, NON-WRAP

FRONT VIEW

SIDE VIEWFRONT VIEW

SIDE VIEW

RECOMMENDED SOLDER PROFILE: Y TERMINATION, EDGE WRAP
• Mounted and Soldered Using 96.5% Sn, 3.0% Ag, 0.5% Cu Solder• Additional Solder was Used
QB0603A25WY: AFTER REFLOW

QB0603A25WY: BEFORE REFLOWTOP VIEWFRONT VIEW
The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0008 | Rev 4– SPECIALTY THIN FILM PRODUCTS –SIDE VIEW

27

Q Bridge Thermal Conductor
Application Notes
SUGGESTED FOOTPRINT

Case Size

A Min.

B Min.

C Min.

D Min.

0302

0.0216(0.55)

0.02(0.51)

0.01(0.25)

0.05(1.27)0402

0.0216(0.55)

0.02(0.51)

0505

0.0512(1.3)

0.0275
(0.7)

0.02
(0.5)

0.075
(1.9)

0603

0.0315(0.8)

0.0275(0.7)

0.0275(0.7)

0.0825(2.1)

0805

0.0512
(1.3)

0.039
(1)

0.039
(1)

0.118
(3)

1005

0.0512
(1.3)

0.039
(1)

0.059
(1.5)

0.138
(3.5)

1020

0.212
(5.4)

0.039
(1)

0.059
(1.5)

0.138
(3.5)

1111

0.118
(3)

0.039
(1)

0.063
(1.6)

0.142
(3.6)

2010

0.118
(3)

0.059
(1.5)

0.126
(3.2)

0.244
(6.2)

2525

0.252(6.4)

0.079
(2)

0.15(3.81)

0.3075(7.81)

3725

0.252
(6.4)

0.1(2.54)

0.266(6.75)

0.466(11.83)

3737

0.386
(9.8)

0.1(2.54)

0.266(6.75)

0.466(11.83)0.01970.06
Dimensions
inches.
(0.50) are in(1.52)

Recommend max filled via density for your board in the pad of
the Q Bridge going to ground/heat sync

28

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0008 | Rev 4– SPECIALTY THIN FILM PRODUCTS –Q Bridge Thermal Conductor
Application Notes
RECOMMENDED Q BRIDGE SIZINGFor optimal results in power handling we recommend using a Q Bridge that matches the component footprint that you are attempting to pull heat away from fora standard surface mount component. For a device that has pins that you are attempting to remove heat from, the suggested Q Bridge would match the widthof the Q Bridge with the length of the pad for those pins.

MEASURED Q BRIDGE PERFORMANCE
Change in Power of an off the shelf 2010 size 1k ohm Resistor withQ Bridge
1.75
1.5Power (W)

1.25
1Length is 2x Width Q Bridge
0.75

No Q Bridge
No Qbridge Heat Pad

0.5
0.25
025354555

6575

8595105115

125

Temperature (°C)

Test performed at room temperature (25C) with resistor mounted on test board as baseline, using
a metal pad heat sync of the same board space required for a Q Bridge, and the Q Bridge thatmatches the footprint of the resistor itself

Resistor without any added heatremoval, power output 841mW

Resistor with added metal heatsync, power output 841mW

Resistor with added 2010 Q
Bridge, power output 841mW

The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
TDS-STFP-0008 | Rev 4– SPECIALTY THIN FILM PRODUCTS –29