H274-S61-LAW1

High Density Server - 2U 4-Node DP 8-Bay NVMe/SATAKey Features

Coolant Pipe

LPCoolant Pipe

LPCoolant Pipe

LPCoolant Pipe

LPOCP
OCPOCPOCP• Direct liquid cooling solution• 2U 4-node rear access server system• Dual Intel ® Xeon ® 6 Processors, LGA 4710
• 8-Channel DDR5 RDIMM / MCR DIMM, 16 x DIMMs per node
• Dual ROM Architecture• 8 x 1Gb/s LAN ports via Intel® I350-AM2• 8 x 2.5" Gen5 NVMe/SATA/SAS-4 hot-swappable bays
• 4 x M.2 slots with PCIe Gen4 x4 interface (optional)• 4 x LP PCIe Gen5 x16 slots• 4 x OCP 3.0 Gen5 x16 slots• Dual 3000W 80 PLUS Titanium redundant power supply

Application
High-Performance Computing Server, High Converged Server

Specification
Dimensions

2U 4-Node - Rear access (W438 x H87.5 x D877 mm)

Internal I/O

Motherboard

MS64-HD0

Backplane Board Speed & bandwidth: PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s

CPUIntel® Xeon® 6 Processors- Intel® Xeon® 6700E-Series Processors- Intel® Xeon® 6700P-Series Processors- Intel® Xeon® 6500P-Series Processors
Dual processors per node, TDP up to 225W

SecurityModules

Per node: 1 x TPM header, 1 x PRoT connector, 1 x VROC connector

1 x TPM header with SPI interface per node
- Optional TPM2.0 kit: CTM012
1 x PRoT module connector (M.2 M-key) per node
- Optional PRoT module (AST1060 solution): CSC1200

Power Supply

Dual 3000W 80 PLUS Titanium redundant power supply
AC Input: 100-240V*The system power supply requires C19 power cord.

SystemManagement

ASPEED® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X)

System Fans

4 x 80x80x80mm (16,500rpm)

OperatingProperties

Operating temperature: 10°C to 40°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)Management chip on CMC board: Integrated in ASPEED® AST2620
Storage

PackagingContentTotal 8 x 2.5" Gen5 NVMe/SATA/SAS-4* hot-swappable bays
*SAS card is required to support SAS drives.

1 x H274-S61-LAW1, 8 x CoolIT CPU cold plate loops,
16 x Carriers, 1 x 3-Section Rail kit

Part Numbers

RAID

Require RAID add-in cards

Expansion
Slots

4 x LP PCIe Gen5 x16 slots
4 x OCP 3.0 Gen5 x16 slots (supports NCSI function)

Barebone w/ cold plates: 6NH274S61DR000LAW1*
Barebone w/o cold plates: 6NH274S61DZ000LAW1*- 3-Section Rail kit: 25HB2-A66125-K0R- CoolIT CPU cold plate loop: 25ST7-10000E-C4R- Power supply: 25EP0-23000V-L0S- C19 power cord 125V/15A (US): 25CP1-018000-Q0R (optional)- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)- C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R (optional)- M.2 riser card - CMTP160: 9CMTP160NR-00 (optional)- CoolIT leak sensor board: 6NH274S60S1000LAW10 (optional)

Sock

2 x LGA 4710 per node (Socket E2)

Chipset

System on ChipMemory

Total 64 x DIMM slots (16 x DIMM slots per node)
8-Channel DDR5 RDIMM / MCR DIMM
RDIMM: Up to 6400 MT/s; MCR DIMM: Up to 8000 MT/s
*MCR DIMMs are only supported with Intel Xeon 6 Processors with P-cores.

LAN

8 x 1Gb/s LAN ports (4 x Intel® I350-AM2) - Support NCSI function
4 x 10/100/1000 Mbps Management LANVideoASPEED® AST2600 Integrated 2D Graphic Adapter

Optional 4 x M.2 slots (CMTP160):
M-key, PCIe Gen4 x4, supports 2260/2280/22110 cards
Rear I/O

Per node: 2 x USB 3.2 Gen1, 1 x Mini-DP, 2 x RJ45, 1 x MLAN

Learn more about GIGABYTE server at https://www.gigabyte.com/Enterprise

Designed by* All specifications are subject to change without notice. Please visit our website for the latest information.
* Intel, the Intel logo, Xeon, and other Intel marks are trademarks of Intel Corporation or its subsidiaries.
* All other brands, logos and names are property of their respective owners.
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