(1) (2) (3) (4) (5) (6) (7) (8)SLUAA13 – June 2020

Powering Multiple Image Sensors with the Same PowerManagement ICDavid Arciniega, Gerard Copeland

1Introduction
Image sensors in automotive applications have become the mainstream. As more and more sensors arebeing integrated into automobiles, the need for automotive camera modules has increased significantly.
Thermals, size, and performance are all critical in the design of the automotive camera modules and areequally important. Therefore, the camera module designer must take all three items into account. Withmultiple sensor vendors and each sensor vendor offering multiple sensor options, designing the camera
module can be simplified if the same power scheme can be used on all designs.

2Device Overview
Powering all the various image sensors out in the market today can be simplified by using a fully
programmable Power Management IC such as the TPS650330-Q1 Power Management IC. The
TPS650330-Q1 Power Management IC has been designed to accept an input voltage range from 4 V to18.3 V since camera modules are being used in a wide range of applications, such as surround viewcameras, smart rear view cameras, remote front cameras, driver monitoring, and cabin monitoring. Witheach voltage rail having its own independent input and output pins, designing over a wide range ofapplications is simplified.

3Device Description
For applications which require functional safety, such as 360° view L5 autonomous driving, blind spot
detection, and eMirrors, the TPS650330-Q1 is part of a pin compatible drop in replacement family which
integrates functional safety features. Contact Texas Instruments™ for additional information on thesedevices.
With the TPS650330-Q1 Power Management IC, the required voltages to power any Image Sensor are
fully programmable. If power sequencing is needed, the TPS650330-Q1 can be programmed to meet thepower sequencing requirements. All this is done internal to the device eliminating the need to use external
resistors for voltage settings or connections to meet the power sequencing requirements. By integratingthese features, the overall solution size is reduced.
The examples shown in Figure 1, Figure 2, and Figure 3 highlight how one Power Management IC can beused to power multiple sensors from different sensor vendors in a Power over Coax (PoC) application. At
least one of the output voltage settings is different in each example, and the same device is being usedsince the TPS650330-Q1 is fully programmable.

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Texas Instruments is a trademark of Texas Instruments.
AR02333 is a trademark of Aptina Imaging Corporation.
Aptina is a registered trademark of Aptina Imaging Corporation.
OV2775 is a trademark of OmniVision Technologies Inc.
Omnivision is a registered trademark of OmniVision Technologies Inc.
IMX390 is a trademark of Sony Corporation.
Sony is a registered trademark of Sony Corporation.
All other trademarks are the property of their respective owners.

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Device Description

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TPS650330-Q1
3.3 V
BUCK1
4 V to18.3 V

CoaxialCable
POC Filter

2.9 V
LDO

1.8 V
IMX390

BUCK2

1.2 V
BUCK3VideoSerializerFigure 1. Sony® IMX390™ Powered by the TPS650330-Q1 Power Management IC (Texas Instruments
Reference Design TIDA-020003)

TPS650330-Q1
3.3 V
BUCK1
4 V to18.3 V

CoaxialCable
POC Filter

2.8 V
LDO

1.8 VAR0233

BUCK2

1.2 V
BUCK3VideoSerializer

Figure 2. Aptina® AR02333™ Powered by the TPS650330-Q1 Power Management IC (Texas Instruments
Reference Design TIDA-050035)

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TPS650330-Q1
3.8 V
BUCK14 V to18.3 V

CoaxialCable3.3 V

POC Filter

LDO

1.8 V
OV2775

BUCK2

1.3 V
BUCK3VideoSerializer

Figure 3. Omnivision® OV2775™ Powered by the TPS650330-Q1 Power Management IC
The TPS650330-Q1 device integrates highly efficient regulators to meet the strict system-level thermalrequirements. The configuration of the TPS650330-Q1 device also plays a key role in making sure theoverall system-level efficiency minimizes the power dissipation. The following graph compares threedifferent configurations for a power over coaxial application.

85

Efficiency (%)

8075

7065

1 MV + 2 LV + 1 LDO
2 MV + 2 LDO
1 MV + 1 LV + 2 LDO

600100200300400500600
DVDDOP (1.8 V) Load Current (mA)

700D001

Figure 4. Overall System Level Efficiency Comparison Graph (9)(9)

Legend:•MV—Refers to a Mid Voltage Buck•
LV—Refers to a Low Voltage Buck•
LDO—Refers to a Low Dropout Regulator

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The 1 MV + 2 LV + 1 LDO configuration is for the TPS650330-Q1. Comparing Figure 5 and Figure 6
shows the impact the 2 MV + 2 LDO and 1 MV + 1 LV + 2 LDO configurations have on the overall systemlevel efficiency.
CoaxialCable

8.0 V
POC Filter

3.3 V
BUCK

2.8 V
LDO

Image
Sensor

1.8 V
BUCK

LDO

1.2 V

Video

Serializer

Figure 5. 2 MV + 2 LDO Configuration
CoaxialCable

8.0 V
POC Filter

3.3 V
BUCK

LDO

2.8 V

Image
Sensor

1.8 V
BUCK

LDO

1.2 V

Video

Serializer

Figure 6. 1 MV + 1 LV + 2 LDO Configuration
The overall solution size challenge is accomplished with the design of the internal regulators. The
regulators have been designed to take advantage of the smallest external components available in themarket today which meet the overall system load requirements.
Figure 7 and Figure 8 provide examples of small, single board solution sizes that can be achieved. The
layouts include the TPS650330-Q1 PMIC, the DS90UB953-Q1 serializer, and their required passive
components including the Power Over Coax (POC) filter. A typical image sensor is shown on the opposite
side for size reference.

4Powering Multiple Image Sensors with the Same Power Management IC
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Figure 7. Layout Example – Double Sided

Figure 8. Layout Example – Single Sided
From a performance point of view, noise and EMI are two items which impact the system-levelperformance. The TPS650330-Q1 device integrates a low noise LDO that can be used to power sensitive
analog rails of the Image Sensors. EMI reduction techniques have been implemented in the integrated
DCDC converters of the TPS650330-Q1. One such technique is the implementation of an Adaptive
Randomized Spread Spectrum (ARSS), which is a technique patented by Texas Instruments. See thePassing CISPR-25 Radiated and Conduction Emissions Using the TPS65033x-Q1 application report for
more information regarding TPS650330-Q1 EMI performance. Collectively, these items help the camera
module designer meet some of the performance challenges being dealt with today.

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Camera Module designers may conclude that a high current load on the LDO output will result in a higher
power loss and that using a DCDC converter may make sense even though the integrated LDO cansupport a sizeable current load. In this case, see Figure 9 for an example of how one of the integrated
DCDC converters can be used to power the analog rail in order to minimize the power loss.

TPS650330-Q1
2.8 V
BUCK1
4 V to18.3 VCoaxialCable
POC Filter

LDO

ImageSensor
1.8 V

BUCK21.2 VBUCK3VideoSerializer

Figure 9. Using a DCDC Converter to Power the Analog Rail.

4Summary
The flexibility of the TPS650330-Q1 device makes it the ideal power solution for any camera module
design. Using the TPS650330-Q1 Power Management IC reduces time to market and adds the peace ofmind that a proven power solution on one camera module design will easily port over to any camera
module design. By minimizing external components and integrating functional safety features into pin
compatible PMICs, layout and component changes become a thing of the past with the TPS650330-Q1.

5References
1. Automotive 2-MP Camera Module Reference Design with MIPI CSI-2 Interface, PMIC, FPD-Link III andPOC (TIDA-020003).
2. Scalable Automotive 2-MP Camera Module Reference Design with Camera PMIC (TIDA-050035).
3. Passing CISPR-25 Radiated and Conduction Emissions Using the TPS65033x-Q1 (SLVAEN0).

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