MODEL 2227 TACTICAL GRADE Q-MODULE
INERTIAL MEMS ACCELEROMETERECCN 7A994•••••Small Bias and SF Temperature Coefficients
Excellent Long Term In-Run Bias Stability
Calibrated Internal Temperature Sensor±4.0 mA Full Scale Current Output±9 to ±16 Volt DC, 16 mA Maximum

••••

•

-55 to +125°C Operation
Two Built-In Self Tests
Durable to 5000+g Mechanical Shocks
Hermetically Sealed MEMS Accelerometer
Serialized for Traceability & RoHS Compliant

AVAILABLE G-RANGESPin and FormFactor Compatiblewith IndustryStandard Quartz
Accelerometers

Mass: 5.6 grams

FULL SCALE
ACCELERATION± 10 g± 25 g± 50 g

MODELNUMBER
2227-010
2227-025
2227-050

DESCRIPTION
The Model 2227 module combines a high-temperature, open printed circuit board (PCB) specifically designed
to give the high stability required for inertial applications and SDI’s Model 1527 Tactical-Grade InertialNavigation MEMS Accelerometer. The 2227 is a low-mass, low-power module, electrically and mechanicallycompatible with fixtures and equipment designed for industry-standard quartz accelerometers and intended
for use in inertial and tilt applications requiring zero to medium frequency response excellent long-term bias
and scale factor repeatability, and low noise.
The SDI Model 1527 MEMS Accelerometer combines two patented capacitive silicon sense elements and aprecision, custom CMOS integrated circuit in a hermetically sealed LCC package. The differential output
voltage of the MEMS accelerometer is converted on the PCB into a current proportional to the appliedacceleration. Thermal calibration parameters can be provided for the 2227 module to achieve highperformance with user real-time temperature compensation and modeling software.

ZERO (DC) TO MEDIUM FREQUENCY APPLICATIONSPERFORMANCE *PERFORMANCEINPUT RANGE:±10G±25GBias, Typical 1±0.2±0.2
Bias Long-Term Repeatability (1σ)31.00
1.50
Bias Temperature Coefficient, Typical155
In Run Bias Stability at +1g, 2-40,000 sec. (AV Min) Typical
1230
Scale Factor Sensitivity, Nominal, +/- 0.5%400160Scale Factor Long Term Repeatability (1σ)2,3300300
Scale Factor Temperature Coefficient, Typical 11210Input Axis Misalignment, Typical 255Vibration Rectification, Typical210-50 Hz, Random
TBD
3050-200 Hz, Random
100Output White Noise, Typical
1825Velocity Random Walk, Typical
0.007
0.012
RMS Model Residual (+/- 1g), Typical 1,41512Frequency Response, DC to -3 dB, Nominal
0 – 600
0 – 1000* SPECIFIED -55°C TO +85°C, Unless otherwise specified Vin = +/- 12 Volts, TC=25°C

±50G

UNITS

±0.2
3.0
560
80
300
105TBD% of FSmg
PPM/°C of FS
µg
uA/g
PPM
PPM/°Cmradµg/g2 rms

500.025
120 – 1400µg/√Hz rmsm/s√Hr
PPM of FSHzSPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Silicon Designs, Inc. • 13905 NE 128th Street, Kirkland WA 98034 • Phone: 425-391-8329 • Fax: 425-391-0446
www.silicondesigns.com[page 1 of 4]

15-July-2020

MODEL 2227 TACTICAL GRADE Q-MODULEPERFORMANCE * all models

MIN

TYP
1.0
0.5
0.1
0.5

Temperature Sensor Sensitivity, Nominal +/- 0.3°C
Temperature Sensor Calibration Error
Accelerometer Non-Linearity
Turn-On Time to < 150 ppm of Output Value
Operating Voltage for Full Scale Acceleration Input

10-55-55-0.5Operating Temperature
Storage Temperature
Applied Voltage on Digital Self-Test Pins 2 and 7
Peak Continuous Vibration (Operating and Non-operating)
Mechanical Shock (0.1 ms)
Mass
PCB Material: Rigid Polyimide, CTE

uA/°C°C% of FSmSec

0.2+/-9Quiescent Operating Current at +/-12 Volts

Units

MAX+/-16

Volts

12+125+125
5.5
200
5000mA°C°C
Volts
% FS
g - peakgrams
ppm/°C

5.6
16

Note 1: Tested over the range -55°C to +85°C
Note 2: Subject to Change.
Note 3: Long-term aging tests include: Power Cycle 100 x; Shock 500g all axes; Storage at -40°C and +100°C;
Temperature Cycle 10x; -55 to 125C; Random Vibration, 10—1000Hz band, Peak 90% of FS.
Note 4: Recommended Model:• Applied Acceleration = B0+B1*T+B2*T^2+B3*T^3+ Iout*(C0+C1*T+C2*T^2), where parameters are the leastsquares fit, with T = (temperature sensor current - 273C – 25C) and Iout is the Output Current.
• The 2227 uses a temperature sensor thermally coupled to the MEMS accelerometer to measure itstemperature. The nominal current output is calibrated and trimmed to be nominally the same in uA as thetemperature in degrees Kelvin. The value of the current from the temperature sensor is used by SDI todetermine the thermal calibration coefficients. The calibration coefficients used in a system should be adjusted
to reflect the differences in current measurement calibration after the accelerometer has been installed in asystem.
Note 5: All specifications are subject to change without notice.

* NOTICE: Stresses greater than those listed above may cause permanent damage to the device. These aremaximum stress ratings only. Functional operation of the device at or above these conditions is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability andlifespan.

The model 2227 input axis is perpendicular to the PCB.
The seismic center is located at the center of the PCB
inside the LCC accelerometer, approximately 0.110 inches(2.75 mm) above the top of the PCB, the reference surface
for the 2227.
The Model 2227 generates an output current, the value of
which varies with acceleration as shown in the adjacentfigure.

OUTPUT CURRENT (mA)

OPERATION
4.0
3.0
2.0
1.00.0-1.0-2.0-3.0-4.0-Full Scale

TRANSFER FUNCTION

0ACCELERATION+ Full Scale

SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Silicon Designs, Inc. • 13905 NE 128th Street, Kirkland WA 98034 • Phone: 425-391-8329 • Fax: 425-391-0446
www.silicondesigns.com[page 2 of 4]

15-July-2020

MODEL 2227 TACTICAL GRADE Q-MODULE
SIGNAL DESCRIPTIONS
Pin 1 – Measured Acceleration (Output): The value of the applied acceleration is measured by a current from thispin to Ground (pin 8). An external sensing resistor is normally used to convert this current into a voltage.
Pin 2 – CapTest (Digital Input): A digital-logic True (+5 volts) applied to this pin causes the accelerometer todisconnect the sense element and substitute a fixed capacitor array that is measured by the CMOS ASIC. The
accelerometer is insensitive to applied acceleration while this pin is True. An internal 5K resistor is connected fromthis pin to Ground. If not used, this pin can be left open or connected to Ground.
Pin 3 – Negative Supply Voltage (Input): A voltage of -9 to -18 volts is required.
Pin 4 – Positive Supply Voltage (Input): A voltage of +9 to +18 volts is required.
Pin 5 – Internal Reference Voltage (Output): This pin reflects the voltage from an internal voltage reference that
supplies VDD and VR to the LCC accelerometer. This pin is isolated from the reference by a 1K ohm resistor. For
automatic compensation for voltage reference aging, the voltage on this pin, relative to the Ground terminal, canbe amplified by a high input impedance op-amp and its output used as the reference for an A/D converter.
Alternatively, the voltage can also be measured by an A/D, and the compensation done in software. If not used, thispin should be left open.
Pin 6 – Temperature (Output): This pin has current output to Ground proportional to the LCC temperature in degrees
Kelvin. The nominal value of temperature sensor scale factor is trimmed to 1.0uA/deg K. If not used, this pin canbe left open.
Pin 7 – Sense Element Test (Digital Input): A digital-logic True (+5 volts) applied to this pin causes the DV pin of theLCC to be connected to the internal reference voltage (VR), applying an additional positive electrostatic force on thesense element; the sense element responds by deflecting in a positive direction, producing a positive-going increasein the accelerometer output. The accelerometer continues to sense and measure applied acceleration plus thisadditional simulated acceleration while this pin is active. An internal 10K resistor is connected from this pin toGround. If not used, this pin can be left open or connected to Ground.
Pin 8 – Ground (Input and Output): This pin is the power return for the positive and negative supply voltages. It also
is the signal return for the current measuring the applied acceleration.

PACKAGE DIMENSIONS

4521678

Positive
Acceleration

-xxx
1527J
XXXXXX

3.xx ±.010.xxx ±.005

SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Silicon Designs, Inc. • 13905 NE 128th Street, Kirkland WA 98034 • Phone: 425-391-8329 • Fax: 425-391-0446
www.silicondesigns.com[page 3 of 4]

15-July-2020

MODEL 2227 TACTICAL GRADE Q-MODULE

CONNECTIONSREQUIRED CONNECTIONS
The following connections are needed to operate the module:1) Power: +9 Volts to +18 Volts to pin 4, -9 Volts to -18 Volts to pin 3 and Power Supply Ground to pin 8; and2) Sensing Resistor: A sensing resistor between the output (pin 1) and Ground (pin8). To utilize the full input rangeof the accelerometer, the sensing resistor with a value of 1K ohms or less should be used to convert this current
into a voltage. If only a portion of the full-scale range is needed, a larger value resistor can be used, where thepeak voltage across it is limited to +/- 4.0 volts over the input range.
Selection and connection of the sensing resistor is critical for accurate acceleration measurement. The measured
bias and scale factor temperature coefficients (TCs) for the module will include the TC of the sensing resistor. If
the sensing resistor is located where its temperature is changing, it is recommended that the sensing resistor havea TC is less than or equal to 2-3 ppm per degree C. Connections of the sensing resistor to the A/D measuring theaccelerometer output should be at locations where the resistor and the circuit between the connections carries
only the current that originates from the output (pin 1).

OPTIONAL CONNECTIONS
Temperature measurement: The current output can be converted to a voltage using a 1.0K to 5.0K ohm resistor
connected between pins 6 and Ground, (pin 8). The two self-test pins (pins 2 and 7) can be left unconnected,connected to Ground or connected to a digital source. The reference voltage on pin 5 and be used as describedabove or left unconnected.
Thermal Stress Relief: For a wide temperature range of operation, it is recommended that the PCB be attached tothe mating surface in such a way that CTE differences can be accommodated by flexing of the mounts or sliding on
the mating surface without significant stretching or compression of the PCB.

SOLDERING/CLEANINGDo NOT use ultrasonic cleaners. Ultrasonic cleaning may break internal wire bonds and void thewarranty.

SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Silicon Designs, Inc. • 13905 NE 128th Street, Kirkland WA 98034 • Phone: 425-391-8329 • Fax: 425-391-0446
www.silicondesigns.com[page 4 of 4]

15-July-2020