ICP-10125 Datasheet
High Accuracy, Low Power, 10atm Waterproof Barometric Pressure
and Temperature Sensor IC
GENERAL INFORMATIONFEATURES

The ICP-10125 pressure sensor is based on MEMS capacitivetechnology, which provides ultra-low noise at the lowest
power, enabling industry leading relative accuracy, sensor
throughput, and temperature stability. The pressure sensor
can measure pressure differences with an accuracy of ±1 Pa,
an accuracy enabling altitude measurement differentials as
small as 8.5 cm, less than the height of a single stair step.
Consuming only 1.3 µA @1 Hz, the device is available in asmall footprint 3.55 mm x 3.55 mm x 1.45 mm chimney
package with waterproofing gel providing IPx8 waterproofing
to 10 ATM. The ICP-10125 is ideally suited for wearable
fitness monitoring and battery powered IoT.
The ICP-10125 offers an industry leading temperature
coefficient offset of ±0.5 Pa/C. The combination of highaccuracy, low power, temperature stability, waterproofing ina small footprint enables higher performance barometricpressure sensing for sports activity identification and mobile
indoor/outdoor navigation.

DEVICE INFORMATIONPARTNUMBER

PACKAGE

LID OPENING

ICP-10125

3.55x3.55x1.45mm
HTCC-10L

Gel filled HTCC package withmachined lid; IPx8
waterproofing to 10 ATM

•
•

•
•
•
•
•
•
•
•
•

Pressure operating range: 30 to 110 kPa
Noise and current consumption
o 0.4 Pa @ 10.4 µA (ULN mode)o 0.8 Pa @ 5.2 µA (LN mode)o 3.2 Pa @ 1.3 µA (LP mode)
Pressure Sensor Relative Accuracy: ±1 Pa for any
10 hPa change over 950 hPa-1050 hPa at 25C
Pressure Sensor Absolute Accuracy: ±1 hPa over
950 hPa-1050 hPa, 0C to 65C
Pressure Sensor Temperature Coefficient Offset:±0.5 Pa/C over 25C to 45C at 100 kPa
Temperature Sensor Absolute Accuracy: ±0.4C
IPx8: Waterproof to 10 ATM
Temperature operating range: -40 °C to 85 °C
Host Interface: I2C at up to 400 kHz
Single Supply voltage: 1.8V ±5%
RoHS and Green compliant

TYPICAL OPERATING CIRCUIT

Denotes RoHS and Green-Compliant Package

BLOCK DIAGRAMSAP/HUB
I2C
ICP-10125

APPLICATIONS
•
•
•
•
•
•

Smart watches
Leisure, Sports, and Fitness Activity Monitoring for
Wearable Sensors
Altimeters and barometers for portable devices
Indoor/Outdoor Navigation (dead-reckoning,
floor/elevator/step detection)
Home and Building Automation
Weather Forecasting

InvenSense, Inc. reserves the right to change
specifications and information herein without notice
unless the product is in mass production and thedatasheet has been designated by InvenSense in writing
as subject to a specified Product / Process Change
Notification Method regulation.

InvenSense, a TDK Group Company
1745 Technology Drive, San Jose, CA 95110 U.S.A+1(408) 988–7339
invensense.tdk.com

Document Number: DS-000329
Revision: 1.1
Release Date: 04/09/2021

ICP-10125
TABLE OF CONTENTS
GENERAL INFORMATION ..................................................................................................................................................1
DEVICE INFORMATION .....................................................................................................................................................1
BLOCK DIAGRAMS...........................................................................................................................................................1
APPLICATIONS ................................................................................................................................................................1
FEATURES .....................................................................................................................................................................1
TYPICAL OPERATING CIRCUIT ............................................................................................................................................1
1

INTRODUCTION .............................................................................................................................................. 5
1.1
1.2

2

PRESSURE AND TEMPERATURE SENSOR SPECIFICATIONS .............................................................................. 6
2.1
2.2
2.3
2.4
2.5

3

INTERFACE SPECIFICATIONS .................................................................................................................................11
PIN OUT DIAGRAM AND SIGNAL DESCRIPTION........................................................................................................11
TYPICAL OPERATING CIRCUIT ..............................................................................................................................12
BILL OF MATERIALS FOR EXTERNAL COMPONENTS...................................................................................................13

OPERATION AND COMMUNICATION ............................................................................................................ 14
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
5.12
5.13
5.14

6

ELECTRICAL CHARACTERISTICS ...............................................................................................................................8
ABSOLUTE MAXIMUM RATINGS.............................................................................................................................9SENSOR SYSTEM TIMING ......................................................................................................................................9I2C TIMING CHARACTERIZATION ..........................................................................................................................10

APPLICATIONS INFORMATION ..................................................................................................................... 11
4.1
4.2
4.3
4.4

5

OPERATION RANGES ...........................................................................................................................................6
OPERATION MODES ............................................................................................................................................6
PRESSURE SENSOR SPECIFICATIONS ........................................................................................................................7
TEMPERATURE SENSOR SPECIFICATIONS ..................................................................................................................7
RECOMMENDED OPERATION CONDITIONS ...............................................................................................................7

ELECTRICAL SPECIFICATIONS .......................................................................................................................... 8
3.1
3.2
3.3
3.4

4

PURPOSE AND SCOPE ..........................................................................................................................................5
PRODUCT OVERVIEW...........................................................................................................................................5

POWER-UP AND COMMUNICATION START ............................................................................................................14
MEASUREMENT COMMANDS ..............................................................................................................................14
STARTING A MEASUREMENT ...............................................................................................................................14
SENSOR BEHAVIOR DURING MEASUREMENT ..........................................................................................................14
READOUT OF MEASUREMENT RESULTS .................................................................................................................15
SOFT RESET .....................................................................................................................................................15
READ-OUT OF ID REGISTER .................................................................................................................................15
CHECKSUM CALCULATION ..................................................................................................................................16
CONVERSION OF SIGNAL OUTPUT ........................................................................................................................16
READ-OUT OF CALIBRATION PARAMETERS .............................................................................................................18
SAMPLE CODE: EXAMPLE C SYNTAX .....................................................................................................................18
SAMPLE CODE: CONVERSION FORMULA (EXAMPLE PYTHON SYNTAX) ..........................................................................20
SAMPLE CODE: USING CONVERSION FORMULA (EXAMPLE PYTHON SYNTAX).................................................................21
COMMUNICATION DATA SEQUENCES....................................................................................................................22

ASSEMBLY .................................................................................................................................................... 23
6.1
IMPLEMENTATION AND USAGE RECOMMENDATIONS ...............................................................................................23
6.1.1
Soldering ..............................................................................................................................................23

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ICP-10125
6.1.2

Chemical Exposure and Sensor Protection ...........................................................................................23

7

PACKAGE DIMENSIONS ................................................................................................................................ 24

8

TAPE AND REEL SPECIFICATION .................................................................................................................... 26

9

ORDERING GUIDE ......................................................................................................................................... 27

10

REFERENCES ............................................................................................................................................. 28

11

REVISION HISTORY ................................................................................................................................... 29

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ICP-10125
LIST OF FIGURES
Figure 1. Digital I/O Pads Timing ................................................................................................................ 10
Figure 2. Pin Out Diagram for ICP-10125, 3.55mm x 3.55mm x 1.45mm HTCC ....................................... 11
Figure 3. ICP-10125 Application Schematic ............................................................................................... 12
Figure 4. Typical Application Circuit ............................................................................................................ 13
Figure 5. Communication Data Sequences ................................................................................................ 22
Figure 6. ICP-10125 Package Diagram ...................................................................................................... 24
Figure 7. ICP-10125 recommended PCB land pattern ............................................................................... 25
Figure 8. ICP-10125 Artwork....................................................................................................................... 25
Figure 9. ICP-10125 Tape Dimensions ................................................................................................... 26
Figure 10. Tape and Reel Orientation ......................................................................................................... 26

LIST OF TABLES
Table 1. Operation Ranges ........................................................................................................................... 6
Table 2. Operation Modes............................................................................................................................. 6
Table 3. Pressure Sensor Specifications ...................................................................................................... 7
Table 4. Temperature Sensor Specifications ................................................................................................ 7
Table 5. Electrical Specifications .................................................................................................................. 8
Table 6. Absolute Maximum Ratings ............................................................................................................ 9
Table 7. System Timing Specifications ......................................................................................................... 9
Table 8. I2C Parameters Specification ........................................................................................................ 10
Table 9. Signal Descriptions ....................................................................................................................... 11
Table 10. Bill of Materials ............................................................................................................................ 13
Table 11. ICP-10125 I2C Device Address ................................................................................................... 14
Table 12. Measurement Commands ........................................................................................................... 14
Table 13. Soft Reset Command .................................................................................................................. 15
Table 14. Read-Out Command of ID Register ............................................................................................ 15
Table 15. 16-bit ID Structure ....................................................................................................................... 16
Table 16. ICP-10125 I2C CRC Properties ................................................................................................... 16

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ICP-10125
1 INTRODUCTION
1.1

PURPOSE AND SCOPE

This document is a preliminary product specification, providing a description, specifications, and design related
information for the ICP-10125 Pressure Sensor.
Specifications are subject to change without notice. Final specifications will be updated based uponcharacterization of production silicon.

1.2

PRODUCT OVERVIEWThe ICP-10125 is an ultra-low power, low noise, digital output barometric pressure and temperature sensor IC. It isbased on an innovative MEMS capacitive pressure sensor technology that can measure pressure differences withan accuracy of ±1 Pa at the industry’s lowest power. The high accuracy MEMS capacitive pressure sensor is capableof measuring altitude differentials down to 8.5 cm without the penalty of increased power consumption or
reduced sensor throughput.
The capacitive pressure sensor has a ±1 hPa absolute accuracy over its full range of 300 hPa -1100 hPa. The
pressure sensor has an embedded temperature sensor and 400 kHz I2C bus for communication. For power-criticalapplications, the ICP-10125 features a low power mode of 1.3 µA at a noise of 3.2 Pa or for high performance
applications, it features a low noise mode of 0.8 Pa while only consuming 5.2 µA.
The device is available in a small footprint 3.55 mm x 3.55 mm x 1.45 mm chimney package with waterproofing gel
providing IPx8 waterproofing to 10 ATM.
The ICP-10125 also offers industry leading temperature stability of the pressure sensor with a temperature
coefficient offset of ±0.5 Pa/C. The high accuracy, temperature stability, and market leading low power
consumption of 1.3 µA @1 Hz offered by ICP-10125 makes it ideally suited for applications such as mobile phones,
drone flight control and stabilization, indoor/outdoor navigation (elevator, floor, and stair step detection), sports
and fitness activity monitoring, and battery-powered IoT.

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ICP-10125
2 PRESSURE AND TEMPERATURE SENSOR SPECIFICATIONS
2.1

OPERATION RANGESThe sensor shows best performance when operated within the recommended temperature and pressure range(hereafter called normal conditions) of 0°C – 45°C and 95 kPa – 105 kPa, respectively. The following ranges aredefined for the device:
OPERATION RANGEPRESSURE (KPA)TEMPERATURE (C)

Normal95 to 105

0 to 45

Extended

30 to 110

-20 to 65

Maximum

25 to 115

-40 to 85

Table 1. Operation Ranges

2.2

OPERATION MODES

The sensor can be operated in up to four different measurement modes to satisfy different requirements for
power consumption vs. noise, accuracy, and measurement frequency. An overview of the operation modes is given
in Table 2.
PARAMETERCONDITIONSConversion TimeTime between sending last bitof measurement command,and sensor data ready formeasurement

Current
Consumption

Pressure RMS
Noise

1 Hz ODR

Valid for P = 100 kPa, T = 25°C,
and U = 1.8V

SENSOR MODE
Low Power (LP)
Normal (N)

TYP
1.6
5.6

MAX
1.8
6.3

UNITS

NOTES
1
1

Low Noise (LN)
Ultra Low Noise(ULN)
Low Power (LP)
Normal (N)Low Noise (LN)
Ultra Low Noise(ULN)
Low Power (LP)
NormalLow Noise (LN)
Ultra Low Noise
(ULN)

20.8

23.8

ms

1

83.2

94.5

1.3
2.6
5.2

1

µA

10.4
3.2
1.6
0.8

Pa

0.4

Table 2. Operation Modes
Notes:
1.

Guaranteed by design.

Low Power modes supports ODR greater than 500 Hz while the Low Noise mode provides industry leading RMS
noise at a fast 40 Hz ODR. Further decrease in noise may be achieved by software oversampling and filtering
through customer’s software implementation or custom TDK InvenSense operation modes available upon request.

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ICP-10125
2.3

PRESSURE SENSOR SPECIFICATIONS

Pressure sensor specifications are given in Table 3. Default conditions of 25 °C and 1.8V supply voltage apply, unlessotherwise stated.
PARAMETER
Absolute Accuracy
Relative Accuracy
Long-term drift
During 1 year
Solder drift

CONDITIONSNormal range
Extended range
Any step ≤ 1 kPa, 25 °C
Any step ≤ 10 kPa, 25 °C

TYP
±1
±1.5
±1
±3

Normal range
Extended range

±35
±40
1.5

P = 100 kPa
25°C … 45°C
Maximum range

Temperature coefficient offset
Resolution

UNITS

NOTES

hPa

1

Pa
Pa/y
hPa

±0.5

Pa/°C

0.01

Pa

1, 2

Table 3. Pressure Sensor Specifications
Notes:
1.
2.

2.4

Absolute accuracy may be improved through One Point Calibration
Sensor accuracy post Solder reflow may be improved through One Point Calibration

TEMPERATURE SENSOR SPECIFICATIONSSpecifications of the temperature sensor are shown in Table 4.
PARAMETER
Absolute Accuracy
Repeatability
Resolution
Long-term drift

CONDITIONSExtended range
Extended range
Maximum range
Normal range

TYP
±0.4
±0.1
0.01
<0.04

UNITS
°C
°C
°C
°C/y

Table 4. Temperature Sensor Specifications

2.5

RECOMMENDED OPERATION CONDITIONS

The pressure sensor exhibits best performance when operated within the normal pressure and temperature
range 0°C < T < 45°C and 95 kPa < P < 105 kPa.
Injected photo current due to strong light sources can influence the sensor performance and should be avoided toguarantee best operation.
The sensor should not be exposed to high mechanical stress, the resulting deformation of the package can alterinternal dimensions and therefore falsify the sensor signal. Solder reflow may affect device performance. Onepoint calibration can improve the sensor accuracy post solder reflow.

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ICP-10125
3 ELECTRICAL SPECIFICATIONS
3.1

ELECTRICAL CHARACTERISTICS

Default conditions of 25 °C and 1.8V supply voltage apply to values in Table 5, unless otherwise stated.
PARAMETERSYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

1.71

1.8

1.89

V

1.25

1.5

V

100

ms

COMMENTS

Supply voltage

VDD

Power-up/down level

VPOR

Static power supply

1.0

Supply Ramp Time

TRAMP

Monotonic ramp. Ramp rate
is 10% to 90% of the final
value

0.01

Idle state

-

1.0

2.5

µA

Measurement

-

210

300

µA

Current consumption while
sensor is measuring.

-

1.3

-

µA

Current consumption incontinuous operation @ 1 Hz
ODR in LP Mode

-

5.2

-

µA

Current consumption incontinuous operation @1 Hz
ODR in LN Mode

Supply current

IDD
AverageLow level input voltage

VIL

0

-

0.3 VDD

V

High level input voltage

VIH

0.7 VDD-

VDD

V

Low level output voltage

VOL

0 < IOL < 3 mA--

0.2 VDDV

VOL = 0.4V

3.1

4.1

-

mA

Output Sink Current

IOL
VOL = 0.6V

3.5

4.5

-

mA

Table 5. Electrical Specifications

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ICP-10125
3.2

ABSOLUTE MAXIMUM RATINGS

Stress levels beyond those listed in Table 6 may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these conditions cannot be guaranteed. Exposure to the absolute
maximum rating conditions for extended periods may affect the reliability of the device.
PARAMETERRATING

Supply voltage, VDD-0.3V to 2.16V

Supply Voltage, SCL & SDA-0.3V to VDD 0.3V

Operating temperature range-40°C to 85°C

Storage temperature range-40°C to 125°C

ESD HBM

2.0 kVESD CDM

250V

Latch up, JESD78 Class II, 85°C

100 mA

Overpressure>600kPa
Table 6. Absolute Maximum Ratings

3.3

SENSOR SYSTEM TIMING

Default conditions of 25°C and 1.8V supply voltage apply to typ. values listed in Table 7, unless otherwise stated.
Max. values apply over the specified operating range of VDD and over the operating temperature range.
PARAMETERSYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

COMMENTSPower-up timetPU

After hard reset, VDD ≥ VPOR

-

170

-

µs

Time between VDD reaching VPU
and sensor entering idle stateSoft reset timetSR

After soft reset

-

170

-

µs

Time between ACK of soft reset
command and sensor entering
idle state

Measurement durationtMEAS

LN Mode

-

20.8

23.8

ms

Duration for a pressure andtemperature measurement

Table 7. System Timing Specifications

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ICP-10125
3.4

I2C TIMING CHARACTERIZATION

Default conditions of 25°C and 1.8V supply voltage apply to values in Table 8, unless otherwise stated.
PARAMETERSYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

0

-

400

kHz

0.6

-

-

µs

SCL clock frequency

fSCL

Hold time (repeated) START condition

tHD;STALOW period of the SCL clock

tLOW

1.3

-

-

µs

HIGH period of the SCL clock

tHIGH

0.6

-

-

µs

Set-up time for a repeated START
condition

tSU;STA

0.6

-

-

µs

SDA hold time

tHD;DAT

0

-

-

µs

SDA set-up time

tSU;DAT

100

-

-

ns

SCL/SDA rise time

tR

20

-

300

ns

SCL/SDA fall time

tF

-

-

300

ns

SDA valid timetVD;DAT

-

-

0.9

µs

Set-up time for STOP conditiontSU;STO

0.6

-

-

µs

CB

-

-

400

pF

Capacitive load on bus line

After this period, the firstclock pulse is generated

Table 8. I2C Parameters Specification
1/fSC
tHIGH

L

tLOW

tR

tF
70
%
30
%

SCL
tSU;D
DATA INATtHD;DA
T

70
%
30
%

SDA
tVD;DATtF

tR

DATA OUT

SDA
Figure 1. Digital I/O Pads Timing

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70
%
30
%

ICP-10125
4 APPLICATIONS INFORMATION
4.1

INTERFACE SPECIFICATIONSThe ICP-10125 supports I2C fast mode, SCL clock frequency from 0 to 400 kHz.

4.2

PIN OUT DIAGRAM AND SIGNAL DESCRIPTIONPIN NUMBER
1
2
3
4
5
6
7
8
9
10

PIN NAME
RESV
SCL
RESV
SDA
VDD
RESV
RESV
RESV
VSS
RESV

DESCRIPTIONNo Connect (NC) or Connect to GND
I2C Serial ClockConnect to GroundI2C Serial Data
Power Supply VDD
No Connect (NC) or Connect to GND
No Connect (NC) or Connect to GND
Connect to Ground
Connect to Ground
No Connect (NC) or Connect to GND
Table 9. Signal Descriptions

8

9

10

RESV

VSS

RESV
Pin 1 Indicator

7

1

RESV

RESV

BOTTOM
VIEW

6

2

RESV

SCL

5

4

3

VDD

SDA

RESV

Figure 2. Pin Out Diagram for ICP-10125, 3.55mm x 3.55mm x 1.45mm HTCC

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ICP-10125
4.3

TYPICAL OPERATING CIRCUIT

GND

GND

GND

Pin 1 Indicator

GND

GND

GND

SCL

VDD
C1, 100nF

SDA

GND

GND

Figure 3. ICP-10125 Application SchematicPower supply pins supply voltage (VDD) and ground (VSS) must be decoupled with a 100 nF capacitor that shall beplaced as close to the sensor as possible. Connections shown as dashed lines are recommended for mechanicalstability of the sensor (see Figure 4).

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ICP-10125

Connections shown as dashed lines are recommended for mechanical stability of the sensor
Figure 4. Typical Application Circuit

SCL is used to synchronize the communication between the microcontroller and the sensor. The master must keep
the clock frequency within 0 to 400 kHz as specified in Table 8.
The SDA pin is used to transfer data in and out of the sensor. For safe communication, the timing specifications
defined in the I2C manual must be met.
To avoid signal contention, the microcontroller must only drive SDA and SCL low. External pull-up resistors (i.e.
10 kΩ) are required to pull the signal high. For dimensioning resistor sizes, user should also consider bus capacity
requirements. It should be noted that pull-up resistors may be included in I/O circuits of microcontrollers.

4.4

BILL OF MATERIALS FOR EXTERNAL COMPONENTSCOMPONENTVDD Bypass Capacitor

LABEL

SPECIFICATIONQUANTITY

C1

Ceramic, X7R, 100 nF ±10%

1Table 10. Bill of Materials

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ICP-10125
5 OPERATION AND COMMUNICATION
All commands and memory locations of the ICP-10125 are mapped to a 16-bit address space which can be accessed
via the I2C protocol.
ICP-10125

BINARYDECIMALHEXADECIMAL

I2C address

110’0011

99

0x63

Table 11. ICP-10125 I2C Device Address

5.1

POWER-UP AND COMMUNICATION START

When VDD reaches the power-up voltage level VPOR, the ICP-10125 enters idle state after a duration of tPU. In idle
state, the ICP-10125 is ready to receive commands from the master (microcontroller).
Each transmission sequence begins with START condition (S) and ends with an (optional) STOP condition (P) as
described in the I2C-bus specification. Whenever the sensor is powered up, but not performing a measurement orcommunicating, it automatically enters idle state for energy saving.

5.2

MEASUREMENT COMMANDSThe ICP-10125 provides the possibility to define the sensor behavior during measurement as well as thetransmission sequence of measurement results. These characteristics are defined by the appropriate
measurement command.
Each measurement command triggers both a temperature and a pressure measurement.
OPERATION MODE
Low Power (LP)
Normal (N)Low Noise (LN)
Ultra-Low Noise (ULN)

TRANSMIT T FIRST
0x609C0x68250x70DF0x7866

TRANSMIT P FIRST
0x401A
0x48A30x50590x58E0

Table 12. Measurement Commands

5.3

STARTING A MEASUREMENT

A measurement communication sequence consists of a START condition followed by the I2C header with the 7-bit
I2C device address and a write bit (write W: ‘0’, 8-bit word including I2C header: 0xC6). The sensor indicates theproper reception of a byte by pulling the SDA pin low (ACK bit) after the falling edge of the 8th SCL clock. Then thesensor is ready to receive a 16-bit measurement command. Again, the ICP-10125 acknowledges the proper
reception of each byte with ACK condition. A complete measurement cycle is presented in Figure 5.
With the acknowledgement of the measurement command, the ICP-10125 starts measuring pressure andtemperature.

5.4

SENSOR BEHAVIOR DURING MEASUREMENT

In general, the sensor does not respond to any I2C activity during measurement, i.e. I2C read and write headers are
not acknowledged (NACK).

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ICP-10125
5.5

READOUT OF MEASUREMENT RESULTS

After a measurement command has been issued and the sensor has completed the measurement, the master canread the measurement results by sending a START condition followed by an I2C read header (8-bit word including
I2C header: 0xC7). The sensor will acknowledge the reception of the read header and send the measured data inthe specified order to the master. The MSB of the corresponding data is always transmitted first. Temperature
data is transmitted in two 8-bit words and pressure data is transmitted in four 8-bit words. Regarding the pressuredata, only the first three words MMSB, MLSB and LMSB contain information about the ADC pressure value p_dout.
Therefore, for retrieving the ADC pressure value, LLSB must be disregarded:
p_dout = MMSB ≪ 16 | MLSB ≪ 8| LMSB.
Two bytes of data are always followed by one byte CRC checksum, for calculation see section 5.8. Each byte mustbe acknowledged by the microcontroller with an ACK condition for the sensor to continue sending data. If the ICP10125 does not receive an ACK from the master after any byte of data, it will not continue sending data.
Whether the sensor sends out pressure or temperature data first depends on the measurement command thatwas sent to the sensor to initiate the measurement (see Table 12).
The I2C master can abort the read transfer with a NACK condition after any data byte if it is not interested insubsequent data, e.g. the CRC byte or the second measurement result, to save time.

5.6

SOFT RESETThe ICP-10125 provides a soft reset mechanism that forces the system into a well-defined state without removing
the power supply. If the system is in idle state (i.e. if no measurement is in progress) the soft reset command will
be accepted by ICP-10125. This triggers the sensor to reset all internal state machines and reload calibration datafrom the memory.
COMMANDHEXADECIMAL CODE

BINARY CODE

Soft reset

0x805D

1000’0000’0101’1101

Table 13. Soft Reset Command

5.7

READ-OUT OF ID REGISTERThe ICP-10125 has an ID register which contains a specific product code. The read-out of the ID register can beused to verify the presence of the sensor and proper communication. The command to read the ID register isshown in Table 14.
COMMANDHEXADECIMAL CODE

BINARY CODE

Read ID register

0xEFC81110’1111’1100’1000

Table 14. Read-Out Command of ID Register

It needs to be sent to the ICP-10125 after an I2C write header. After the ICP-10125 has acknowledged the proper
reception of the command, the master can send an I2C read header and the ICP-10125 will submit the 16-bit ID
followed by 8 bits of CRC. The structure of the ID is described in Table 15. Bits 15:6 of the ID contain unspecified
information (marked as “x”), which may vary from sensor to sensor, while bits 5:0 contain the ICP-10125 specificproduct code.

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ICP-10125
16-bit ID
xxxx'xxxx’xx 00’1000

bits 5 to 0: ICP-10125-specific product code
bits 15 to 6: unspecified information
Table 15. 16-bit ID Structure

5.8

CHECKSUM CALCULATION

The 8-bit CRC checksum transmitted after each data word is generated by a CRC algorithm with the properties
displayed in Table 16. The CRC covers the contents of the two previously transmitted data bytes.
PROPERTY

VALUE

Name

CRC-8

Width

8 bitsPolynomial

0x31 (x8 + x5 + x4 + 1)

Initialization

0xFF

Reflect input

false

Reflect output

false

Final XOR

0x00

ExamplesCRC(0x00) = 0xAC
CRC(0xBEEF) = 0x92
Table 16. ICP-10125 I2C CRC Properties

5.9

CONVERSION OF SIGNAL OUTPUT

Pressure measurement data is always transferred as 4 8-bit words; temperature measurement data is always
transferred as two 8-bit words. Please see section 5.5 for more details.
Temperature measurement values t_dout are linearized by the ICP-10125 and must be calculated to °C by the user
via the following formula:T = - 45°C +175°C
× t_dout.
216

For retrieving physical pressure values in Pa the following conversion formula has to be used:

P=A+

B
,
C + pdout

where p_dout is the sensor’s raw pressure output. The converted output is compensated for temperature effects
via the temperature dependent functions A, B and C. Besides the raw temperature output t_dout, the calculationof A, B and C requires to access calibration parameters OTP0, OTP1, OTP2, OTP3 stored in the OTP of the sensor.
Read-out of OTP parameters is described in section 5.10.
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ICP-10125
Full sample code for calculating physical pressure values is given in section 5.11. The general workflow of theconversion is done by:1) Import class Invensense_pressure_conversion
2) Read out values OTP0, …, OTP3 and save to c1, …, c43) Create object name for an individual sensor with parameter values c1, …, c4
name = Invensense_pressure_conversion([c1,c2,c3,c4])4) Get raw pressure p_dout and temperature t_dout data from the sensor as described in chapter 5.5.

5) Call function get_pressure:name.get_pressure(p_dout, t_dout)

The sample code from section 5.13 gives an example of this workflow.

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ICP-10125
5.10 READ-OUT OF CALIBRATION PARAMETERS
For converting raw pressure data to physical values, four calibration parameters have to be retrieved from the OTPof the sensor.
Set up of OTP read:1) Send I2C write header 0xC62) Send command 0xC595 (move pointer in address register)3) Send address parameter together with its CRC 0x00669C
Steps 1) – 3) can be executed on many platforms by a single I2C write of the value 0xC59500669C.
Read out parameters:
Repeat the following procedure 4 times:
Send I2C write header 0xC6a)b) Send command 0xC7F7 (incremental read-out of OTP)
Send I2C read header 0xC7c)d) Read 3B (2B of data and 1B of CRC)e)

Decode data as 16bit big endian signed integer and store result into n-th calibration parameter cn.

Steps a) to d) can be executed on many platforms by a single write 0xC7F7 to the chip address followed by a single
read of 3 B from the chip address.

5.11 SAMPLE CODE: EXAMPLE C SYNTAX/* data structure to hold pressure sensor related parameters */typedef struct inv_invpres{
struct inv_invpres_serif serif;
uint32_t min_delay_us;
uint8_t pressure_en;
uint8_t temperature_en;
float sensor_constants[4]; // OTP values
float p_Pa_calib[3];float LUT_lower;
float LUT_upper;
float quadr_factor;
float offst_factor;} inv_invpres_t;

int inv_invpres_init(struct inv_invpres * s){short otp[4];read_otp_from_i2c(s, otp);
init_base(s, otp);
return 0;}
int read_otp_from_i2c(struct inv_invpres * s, short *out){
unsigned char data_write[10];unsigned char data_read[10] = {0};int status;
int i;// OTP Read mode

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ICP-10125
data_write[0] = 0xC5;
data_write[1] = 0x95;
data_write[2] = 0x00;
data_write[3] = 0x66;
data_write[4] = 0x9C;
status = inv_invpres_serif_write_reg(&s->serif, ICC_ADDR_PRS, data_write, 5);
if (status)
return status;// Read OTP valuesfor (i = 0; i < 4; i++) {data_write[0] = 0xC7;
data_write[1] = 0xF7;
status = inv_invpres_serif_write_reg(&s->serif, ICC_ADDR_PRS, data_write, 2);
if (status)
return status;
status = inv_invpres_serif_read_reg(&s->serif, ICC_ADDR_PRS, data_read, 3);
if (status)
return status;
out[i] = data_read[0]<<8 | data_read[1];}return 0;}
void init_base(struct inv_invpres * s, short *otp){
int i;
for(i = 0; i < 4; i++)s->sensor_constants[i] = (float)otp[i];s->p_Pa_calib[0] = 45000.0;
s->p_Pa_calib[1] = 80000.0;
s->p_Pa_calib[2] = 105000.0;
s->LUT_lower = 3.5 * (1<<20);s->LUT_upper = 11.5 * (1<<20);s->quadr_factor = 1 / 16777216.0;
s->offst_factor = 2048.0;}// p_LSB -- Raw pressure data from sensor// T_LSB -- Raw temperature data from sensor
int inv_invpres_process_data(struct inv_invpres * s, int p_LSB, int T_LSB,
float * pressure, float * temperature){
float t;float s1,s2,s3;
float in[3];float out[3];float A,B,C;t = (float)(T_LSB - 32768);
s1 = s->LUT_lower + (float)(s->sensor_constants[0] * t * t) * s->quadr_factor;
s2 = s->offst_factor * s->sensor_constants[3] + (float)(s->sensor_constants[1] * t * t) * s->quadr_factor;
s3 = s->LUT_upper + (float)(s->sensor_constants[2] * t * t) * s->quadr_factor;
in[0] = s1;
in[1] = s2;
in[2] = s3;
calculate_conversion_constants(s, s->p_Pa_calib, in, out);
A = out[0];B = out[1];C = out[2];*pressure = A + B / (C + p_LSB);*temperature = -45.f + 175.f/65536.f * T_LSB;
return 0;}// p_Pa -- List of 3 values corresponding to applied pressure in Pa// p_LUT -- List of 3 values corresponding to the measured p_LUT values at the applied pressures.
void calculate_conversion_constants(struct inv_invpres * s, float *p_Pa,
float *p_LUT, float *out)

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ICP-10125{
float A,B,C;
C = (p_LUT[0] * p_LUT[1] * (p_Pa[0] - p_Pa[1]) +p_LUT[1] * p_LUT[2] * (p_Pa[1] - p_Pa[2]) +p_LUT[2] * p_LUT[0] * (p_Pa[2] - p_Pa[0])) /(p_LUT[2] * (p_Pa[0] - p_Pa[1]) +p_LUT[0] * (p_Pa[1] - p_Pa[2]) +p_LUT[1] * (p_Pa[2] - p_Pa[0]));A = (p_Pa[0] * p_LUT[0] - p_Pa[1] * p_LUT[1] - (p_Pa[1] - p_Pa[0]) * C) / (p_LUT[0] - p_LUT[1]);B = (p_Pa[0] - A) * (p_LUT[0] + C);
out[0] = A;out[1] = B;out[2] = C;}

5.12 SAMPLE CODE: CONVERSION FORMULA (EXAMPLE PYTHON SYNTAX)
class

InvensensePressureConversion:""" Class for conversion of the pressure and temperature output of the Invensense sensor"""def __init__(self, sensor_constants):""" Initialize customer formula

Arguments:
sensor_constants -- list of 4 integers: [c1, c2, c3, c4]"""
self.sensor_constants = sensor_constants# configuration for ICP-10125 Samples
self.p_Pa_calib = [45000.0, 80000.0, 105000.0]
self.LUT_lower = 3.5 * (2**20)
self.LUT_upper = 11.5 * (2**20)
self.quadr_factor = 1 / 16777216.0
self.offst_factor = 2048.0

def calculate_conversion_constants(self, p_Pa, p_LUT):""" calculate temperature dependent constants

Arguments:
p_Pa -- List of 3 values corresponding to applied pressure in Pa
p_LUT -- List of 3 values corresponding to the measured p_LUT values at the applied pressures.
"""C = (p_LUT[0] * p_LUT[1] * (p_Pa[0] - p_Pa[1]) +p_LUT[1] * p_LUT[2] * (p_Pa[1] - p_Pa[2]) +p_LUT[2] * p_LUT[0] * (p_Pa[2] - p_Pa[0])) / \(p_LUT[2] * (p_Pa[0] - p_Pa[1]) +p_LUT[0] * (p_Pa[1] - p_Pa[2]) +p_LUT[1] * (p_Pa[2] - p_Pa[0]))A = (p_Pa[0] * p_LUT[0] - p_Pa[1] * p_LUT[1] - (p_Pa[1] - p_Pa[0]) * C) / (p_LUT[0] - p_LUT[1])Document Number: DS-000329
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ICP-10125
B = (p_Pa[0] - A) * (p_LUT[0] + C)

return [A, B, C]

def get_pressure(self, p_LSB, T_LSB):""" Convert an output from a calibrated sensor to a pressure in Pa.

Arguments:
p_LSB -- Raw pressure data from sensor
T_LSB -- Raw temperature data from sensor"""
t = T_LSB - 32768.0
s1 = self.LUT_lower + float(self.sensor_constants[0] * t * t) * self.quadr_factor
s2 = self.offst_factor * self.sensor_constants[3] + float(self.sensor_constants[1] * t * t) * self.quadr_factor
s3 = self.LUT_upper + float(self.sensor_constants[2] * t * t) * self.quadr_factor
A, B, C = self.calculate_conversion_constants(self.p_Pa_calib, [s1, s2, s3])
return A + B / (C + p_LSB)[end of the pseudocode]

5.13 SAMPLE CODE: USING CONVERSION FORMULA (EXAMPLE PYTHON SYNTAX)
def read_otp_from_i2c():# TODO: implement read from I2C# refer to data sheet for I2C commands to read OTP
return 1000, 2000, 3000, 4000

def read_raw_pressure_temp_from_i2c():# TODO: implement read from I2C# refer to data sheet for I2C commands to read pressure and temperature
return 8000000, 32000# Sample code to readfrom

Invensense_pressure_conversion import

Invensense_pressure_conversion# -- initialization
c1, c2, c3, c4 = read_otp_from_i2c()
conversion =Invensense_pressure_conversion([c1, c2, c3, c4])# -- read raw pressure and temp data, calculate pressurep, T = read_raw_pressure_temp_from_i2c()
pressure = conversion.get_pressure(p, T)
print 'Pressure: %f' % pressure[end of the pseudocode]

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ICP-10125
5

6

7

8

S 1 1 0 0 0 1 1 0

I2C address + write

9

10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28

0 1 0 1 0 0 0 0
Measurement command
MSB

0 1 0 1 1 0 0 1
Measurement command
LSB

S 1 1 0 0 0 1 1 1

NACK

29 30 31 32 33 34 35 36 37 38 39

repeated I2C address +read while meas. is inprog. (polling)P

ICP-10125
measuringmeasurement
cont’dmeasurement
completed0 0 0 1 1 1 0 0
Pressure CRC
checksum

Pressure MLSB

Pressure LMSB

0 0 0 1 1 1 0 0

ACK

0 0 1 1 0 0 1 1

ACK

ACK

77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103

1 0 1 0 0 0 0 1

Pressure CRC
checksum

Pressure LLSB

Temperature MSB

Temperature LSB

1 1 0 0 0 1 1 1

NACK

1 0 0 0 1 0 1 1

ACK

ACK

104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131

0 1 1 0 0 1 0 0PTemperature CRC
checksum

Figure 5. Communication Data Sequences

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Measurement in progress

ICP-10125 inSidle state

ACK

ACK

ACK

Pressure MMSB

0 0 1 1 0 0 1 1

ICP-10125 measuring

40 41 42 43 44 45 46 47 48 49

50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76

1 0 1 0 0 0 0 1

P

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1 1 0 0 0 1 1 1

I2C address + read

ACK

4

ACK

3

ACK

1 2

ACK

5.14 COMMUNICATION DATA SEQUENCESICP-10125
6 ASSEMBLY
This section provides general guidelines for assembling TDK-InvenSense Micro Electro-Mechanical Systems (MEMS)
pressure sensors.

6.1

IMPLEMENTATION AND USAGE RECOMMENDATIONS

6.1.1 Soldering
When soldering, use the standard soldering profile IPC/JEDEC J-STD-020 with peak temperatures of 260°C. ICP10125 may exhibit a pressure offset after soldering, some settling time may be required depending on soldering
properties, PCB properties, and ambient conditions.
The ICP-10125 package consists of a chimney port that opens to the sensing element. Special care must be taken
during soldering process to avoid contaminating the sensor through the open chimney.
1.

Solder the sensor as a second soldering operation, after other components have been soldered2.

Use No-Clean solder paste

3.

Sensor must not be subjected to board washing of any kind (critical)

6.1.2 Chemical Exposure and Sensor Protection
The ICP-10125 must not be exposed to particulates or liquids. If any type of protective coating must be applied tothe circuit board, the sensor must be protected during the coating process.
For further information on assembly, please refer to AN-000140 TDK-InvenSense Pressure Sensor PCB
Design Guidelines.

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ICP-10125
7 PACKAGE DIMENSIONS
Package dimensions for the ICP-10125:

Top View

Side & Bottom View

Figure 6. ICP-10125 Package Diagram
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ICP-10125
Recommended PCB land pattern for the ICP-10125:

3.6mm
1.4mm

10

9

8

1

7

0.7mm
0.45mm2

3.6mm

Pin 1 Indicator

6

3

4

5

0.75mm0.6mm R

0.95mmTop View
Figure 7. ICP-10125 recommended PCB land pattern

Product artwork for the ICP-10125:
Pin 1 Indicator

Pin 1 corner marking (front view)

Front View

Back View

Figure 8. ICP-10125 Artwork

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Side View

ICP-10125
8 TAPE AND REEL SPECIFICATION

Figure 9. ICP-10125 Tape Dimensions

Figure 10. Tape and Reel Orientation
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ICP-10125
9 ORDERING GUIDEPARTTEMP RANGEPACKAGE BODYQUANTITY

PACKAGING

ICP-10125†−40°C to +85°C

3.55x3.55x1.45mm HTCC-10L

3000

13” Tape and Reel

†Denotes RoHS and Green-Compliant Package

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ICP-10125
10 REFERENCES
Please refer to “InvenSense MEMS Handling Application Note (AN-IVS-0002A-00)” for the following information:• Manufacturing Recommendationso Assembly Guidelines and Recommendationso PCB Design Guidelines and Recommendationso MEMS Handling Instructionso ESD Considerations
o Reflow Specificationo Storage Specificationso Package Marking Specificationo Tape & Reel Specificationo Reel & Pizza Box Labelo Packaging
o Representative Shipping Carton Label• Complianceo Environmental Complianceo DRC Complianceo Compliance Declaration Disclaimer

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ICP-10125
11 REVISION HISTORYREVISION DATEREVISIONDESCRIPTION

09/04/2020

1.0

Initial Release

04/09/2021

1.1

Formatting Updates; Updated Pressure Sensor Specs (Table 3); Added Tape and Reel
Specification (Section 8)

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ICP-10125

This information furnished by InvenSense or its affiliates (“TDK InvenSense”) is believed to be accurate and reliable. However, no responsibility is assumed by TDKInvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without
notice. TDK InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance,
without prior notice. TDK InvenSense makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document.
TDK InvenSense assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services
detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual
property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or otherwise under any
patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are
the property of their respective companies. TDK InvenSense sensors should not be used or sold in the development, storage, production or utilization of any
conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical
equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment.
©2020—2021 InvenSense. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, AAR, and theInvenSense logo are trademarks of InvenSense, Inc. The TDK logo is a trademark of TDK Corporation. Other company and product names may be trademarks of therespective companies with which they are associated.

©2020—2021 InvenSense. All rights reserved.

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