SPECIFICATION AND PERFORMANCE
Series115S

File

115S_spec_2

Date2019/01/21

Scope:

This specification covers the requirements for product performance, test methods andquality assurance provisions of below
SOCKET
P/N
DESCRIPTION
115S-ACA0

P/N

115S-ACA1
115S-ACA2
115S-ACA3

Nano SIM Card Socket, Bar Push, 8u" GoldDESCRIPTION

Tray

Nano SIM Tray, PA46, White color, Reel
Nano SIM Tray, SUS316, Natural color, 18.10mm, Reel
Nano SIM Tray, SUS316, Natural color, 16.31mm, Reel

Performance and Descriptions:

The product is designed to meet the electrical, mechanical and environmental performancerequirements specification. Unless otherwise specified, all tests are performed at ambientenvironmental conditions.

RoHS:All material in according with the RoHS environment related substances list controlled.

MATERIALSNO.

PART NAMEDESCRIPTION

Socket: 115S-ACA0
1Insulator

2

Contact

3Shell456LeverCAM
Latch

LCP S475 +30%GF, UL94V-0, Black
Phosphor Bronze, NKT322-ESH. Contact area: Gold plated 8u", Solder area:
Gold plated 3u”~5u", Under plated: Nickel plated 50u"~120u" over all
SUS301-H,0.1T, Tail area: 1u”~3u” Gold plated min., Under plated:50u”~100u” Nickel plated min.
SUS301-H, 0.3T
SUS301-1/2H, 0.5T
SUS301-H, 0.25T

Plastic Tray: 115S-ACA1
12HousingCover

PA46_TW241F3 PA+15%GF, White color
SUS301-H, 0.1T

Metal Tray: 115S-ACA2 & 115S-ACA3
1Body

SUS316, Natural color

The information contained herein is exclusive property of ATTEND. Do not copy and print except that Attend
accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-1 -ELECTRICAL

ItemLow Level ContactResistance(Contact & Switch)

Requirement
Contact resistance:
50mΩ max. △CR < 3 0 m Ω
after test. Switch resistance:
200mΩ max

Test Condition
Comply with EIA-364-23.
Apply a closed-circuit current of 100 mA
maximum at an open-circuit voltage of20mV maximum on contact point and solder
pad of PCB.

Insulation Resistance(Initial) 1000 MΩ minimum.
(Final) 500 MΩ minimum

Comply with EIA-364-21.
Apply 200 VDC ±10VDC on the adjacentcontacts for 1 minute ±5 seconds

Dielectric Withstanding
Voltage

No shorting, breakdown,
flashover or other damage.

Comply with EIA-364-20.Apply500 VAC for one minute at sea level on
unmated connectors, less than 1 mAleakage current.

Item
Tray Insertion Force

Requirement
20N Max. (25mm/minute)

Test Condition
MIL-STD-1344, Method 2013.1
Applicable Nano SIM Card

Tray Extraction Force

4N min. after 200 cycles (withhands)
3N min. after 4400 cycles(with hands)
No evidence of damage

MIL-STD-1344, Method 2013.1
Applicable Nano SIM Card

MECHANICALThe electrical performances
should meet the spec.
specified.(25mm/minute).
Contact Normal Force

40gf Min./per Pin

0.10mm Gap to housing surface(work position) Speed of 25±3mm/minuteDurability(Mating/ Un-mating)

4N min after 200cycles(with hands)
3N min after 4400cycles(with hands)
No evidence of damage

1. Push tray with card in connector and let
the tray out with pushing Lever (withhands) for 4400 cycles
2. Mating and un-mating connector（with machine） for 200 cycles.
3. Applicable Nano SIM Card (5 pcs bymaximum thickness size card (0.7mm) ) (5pcs by minimum thickness sizecard(0.6mm)) for test.
4. Check point: after 200 cycles

The electrical performances
should meet the spec.
specified

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.
本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-2 -Operating
Random Vibration

Without mechanical damageand electrical discontinuity
greater then 1 μsec (s) shalloccur.
The electrical performances
should meet the spec.
specified.

Comply with method EIA-364-46B.
1. The power supply shall be capable ofsupplying 100mili-amperes DC. and open
circuit voltage not to exceed 5.0 volts.
2. Mated dummy card shall be subjectedduring test.
3. Vibration Profile: As following

Non-Operating
Random Vibration

Without mechanical damage.
The electrical performances
should meet the spec.
specified.

Vibration Profile: As following

OperatingSine Vibration

Without mechanical damageand electrical discontinuity
greater then 1 μsec (s) shalloccur.

Comply with method EIA-364-46B.
1. The power supply shall be capable ofsupplying 100mili-amperes DC and open
circuit voltage not to exceed 5 volts.
2. Mated dummy card shall be subjectedduring test.
3. Vibration Profile: As following

The electrical performances
should meet the spec.
specified

Operating MechanicalShock

No electrical discontinuity
greater than 1 μ second shalloccur.
The electrical performances
should meet the spec.
specifiedComply with method EIA-364-46B.
1. The power supply shall be capable ofsupplying 100mili-amperes DC and open
circuit voltage not to exceed 5.0 volts.
2. Mated dummy card shall be subjectedduring test.
3. 50G/11ms half-sine wave shock.
4. 3 shocks in each direction. Total of 6
directions.
5. Total of 18 shocks.

Non-Operating
Mechanical Shock

There is no crack,
deformation or other damageof connector.

1. Mated dummy card shall be subjectedduring test.
2. 500G/2ms half-sine wave shock.

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.
本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-3 -3. 3 shocks in each direction. Total of 6directions.
4. Total of 18 shocks.

Item
Operating
Heat ResistanceOperating
Cold Resistance

ENVIRONMENTAL

Requirement
No evidence of damage
The electrical performances
should meet the spec.
specifiedTest Condition
1. Operating test current: 0.2A
2. Mated dummy card shall be
subjected during test.
3. Temperature:70±3°C
4 Duration time: 240 hours. It shall bemaintained at standard atmosphericcondition for 30 min after measurement
shall be made.

No evidence of damage
The electrical performances
should meet the spec.
specified.

1. Operating test current: 0.2A
2. Mated dummy card shall be subjectedduring test.
3. Temperature:-20±3°C
4. Duration time: 240 hours.
It shall be maintained at standard
atmospheric condition for 30 min after
measurement shall be made.

Non-Operating
Heat ResistanceNo evidence of damage
The electrical performances
should meet the spec.
specified

1. Mated dummy card shall be subjectedduring test.
2. Temperature:85±3°C
3. Duration time: 240 hours.
It shall be maintained at standard
atmospheric condition for 30 min after
measurement shall be made.

Non-Operating
Cold ResistanceNo evidence of damage
The electrical performances
should meet the spec.
specified.

1. Mated dummy card shall be subjectedduring test.
2. Temperature:-40±3°C
3. Duration time: 240 hours.
It shall be maintained at standard
atmospheric condition for 30 min aftermeasurement shall be madeNon-Operating
Thermal ShockNo evidence of damage
The electrical performances
should meet the spec.
specified.

Subject mated connector to 32 cycles
between -40 ± 3°C/ 30 minutes and +85±3°C/ 30 minutes

Operating Temperature

No evidence of damage
The electrical performances

MIL-STD-202, Method 107
1. Operating test current: 0.2A
2. Mated dummy card shall be subjectedduring test.

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.
本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-4 -3. Temperature:60±2°C
4. Humidity: 95%RH
5. Duration time: 240 hours.
No evidence of damage
The electrical performances
should meet the spec.
specified.
Electrical performance
specified in table 1 shall besatisfied.
No harmful deformation,
cracking and chip etc., onfunction.
No mechanical damage; No
harmful corrosion occurs oncontact.

1. Temperature:70±2°C
2. Humidity: 90%RH
3. Duration time: 240 hours.

Tray Push In Strength(Tray Left Oblique)As show below, No problem toconnector performance

The evaluation tray is left oblique by 45
degree and the load of 2kg is added in 20
seconds by 10pcs

Tray Push In
Strength(Tray Right Oblique)As show below, No problem toconnector performance

The evaluation tray is right oblique by
45 degree and the load of 2kg is addedin 20 seconds by 10pcs.

Non-Operating
Temperature And Humidity

H2SCorrosion Resistance

Salt Spray

MIL-STD-202, Method 1010
Temperature: 40±2°C
Gas concentration: 3±1ppm
Humidity: 75% to 80% RH Duration: 24H
Temperature: 35±2°C
NaCl: 5%Duration: 48H
After test wash parts and return

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.
本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-5 -Left ObliqueInsertion Resistance

As show below, No problem toconnector performance

The actual card with evaluation Tray isinserted by left oblique, and ejected(pushing Eject Bar).
It is Repeated 100 cycles.

Right ObliqueInsertion Resistance

As show below, No problem toconnector performance

The actual card with evaluation Tray isinserted by right oblique, and ejected(pushing Eject Bar).
It is Repeated 100 cycles

Tray Reversed
Insertion Resistance

As show below, No problem toconnector performance

The evaluation tray is reversed and theload of 2kg is added in 20 seconds(50cycle)

Cutting-SIM Card
Test

No evidence of damage
The electrical performances
should meet the spec.
specified

5pcs Micro SIM cut into Nano SIM(Micro SIM type thickness: 0.84mm)
Test method: 1,000 cycles as defined
to insert cutting-SIM card into theconnector, and remove the cutting-SIMcard.

Misuse test For SIMCard Connector

Testing orientation of object:
Normal/ Reverse/ Bottom-up
Sample quantity: 5(straight)+5(left slant)+5(rightslant)+5(upper slant)+5(lower slant)
No problem to connector
performance

Insert the maximum size micro SD
conn card along straight/left slant/rightslant/upper slant/lower slant
deflection, and then remove Micro SD
tray. Perform this action for 10 times
for each sample. Totally for 5 samples
for each side

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.
本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-6 -Table II:
Test Description

Products qualification test sequence
Test Group and Sequence

ABCDEFG

H

JKL

M

NO

P

Q

RS

TU

1. Visual inspection

1,15 1,9 1,9 1,9 1,9 1,9 1,9 1,9 1,9 1,9 1,9 1,9 1,9 1,9 1,9 1,3 1,3 1,3 1,3 1,3

2. Low level contact resistance2,9 2,6 2,6 2,6 2,6 2,6 2,6 2,6 2,6 2,6 2,6 2,6 2,6 2,6 2,63. Insulation Resistance

3,10 3,7 3,7 3,7 3,7 3,7 3,7 3,7 3,7 3,7 3,7 3,7 3,7 3,7 3,74. Dielectric Withstanding Voltage

4,11 4,8 4,8 4,8 4,8 4,8 4,8 4,8 4,8 4,8 4,8 4,8 4,8 4,8 4,85. Tray Insertion Force

5,12

6. Tray Extraction Force

6,13

7. Contact Normal Force

7,4

8. Durability

8

9. Operating Random Vibration

5

10. Non-operating Random Vibration

5

11. Operating Sine Vibration

5

12. Operating Mechanical Shock5

13. Non-operating Mechanical Shock5

14. Operating Heat Resistance5

15. Operating Cold Resistance5

16. Non-operating Heat Resistance5

17. Non-operating Cold Resistance518. Non-operating Thermal Shock5

19. Operating Temperature andHumidity
20. Non-operating Temperature and55Humidity
21. H2S Corrosion Resistance5

22. Salt Spray

5

23. Tray Push in Strength2(tray Left Oblique)
24. Tray Push in Strength2(tray Right Oblique)
25. Left Oblique Insertion Resistance2

26. Right Oblique Insertion Resistance2

27. Tray Reversed Insertion ResistanceSample size

2104444444444444444444

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.
本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-7 -Reflow Profile

Preheating temperature: 150 ~ 200°C, 60~120 seconds
Liquidus temperature (TL): 217°C, 60~150 seconds
Peak temperature: 260°C
Time within 5 °C of peak temperature (Tc): 255°C, 30seconds

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts.
本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。

-8 -