System Thermal Test Report
Model: The Tower 500

Version: 20220517A
1

NO:RS202205090001

Table of Contents

A. Introduction
B. Test Configuration
C. Conclusion

2

NO:RS202205090001

A. Introduction
1. Objective
2. Equipment
3. Procedure

3

NO:RS202205090001

1. Objective

Our objective is to find out if the Tower 500 can efficiently extract the heat generated by the latest
components, so we built a system with an Intel i9-12900K and a GIGABYTE AORUS GeForce RTX™ 3090
XTREME and put it to the test. The passing criteria we set was to keep the internal temperature under 45°C
while the system is running at Full load, with two pre-installed fans and a AIO 360 installed.
4

NO:RS202205090001

2. Equipment
The equipment we used in the thermal testing includes:
1. Temperature & Humidity Chamber
2. Data Acquisition Device
3. Thermocouple

The Temp. & Humidity Chamber ensures consistency in the testing environment, particularly temperatureand humidity. The temperature was set at 25°C and the humidity at 50% in the chamber.
The Data Acquisition Device helps us to directly collect the data through thermocouples, which is the mostimportant equipment for our testing. We set up the thermocouple inside the case at various points tomeasure the temperature.

We used AIDA64 Extreme and FurMark ROG Edition to push 100% load on the CPU and GPU and tested for
30 minutes.

5NO:RS202205090001

3. Procedure
Testing steps:

1. Ready the systems
2. Place the chassis into the Temp. & Humidity Chamber
3. Set the thermocouple at the specified places
4. Set up the Temp. & Humidity Chamber - temperature at 25 °C and the humidity at 50%
5. Turn on the Temp. & Humidity Chamber and start testing (for 30 minutes)

6. Check the data acquired from the Data Acquisition device
7. End testing

6

NO:RS202205090001

B. Test Configuration
1. Laboratory Equipment

2. Chassis Hardware List
3. Chassis Fan Allocation
4. Chassis Thermal Airflow
5. Chassis Measured Points
6. Thermal Stress Test
7. AIDA64 & FurMark Test
8. Graphics Performance Testing
9. Acoustic Test

7

NO:RS202205090001

1. Laboratory Equipment

Thermocouple

Thermal Imaging Camera

8Sound Level Meter

Temperature Data Acquisition

Temperature & Humidity ChamberNO:RS202205090001

2. Chassis Hardware ListComponent

Model

Chassis The Tower 500 Snow
Motherboard ASUS ROG MAXIMUS Z690 HEROCPU Intel Core i9-12900K(TDP 125W/OC 241W)GPU GIGABYTE AORUS GeForce RTX™ 3090 XTREMERAM TOUGHRAM Z-ONE RGB DDR5 64G (16G x 4)
SSD Plextor PX-128M6VPSU Toughpower TF1 1550W - TT Premium Edition
CPU Cooler TOUGHLIQUID Ultra 360 All-In-One Liquid Cooler
Fans

9

AIO: TOUGHFAN Turbo 120mm x 3
Chassis: Standard Fan x 2 (Rear)

Software

1.
2.
3.
4.

AIDA64 Extreme
FurMark ROG Edition V0.8.10.0CPU-Z Ver.1.97.0 x64
Core Temp V1.17.1

Full load

30 minutes

CameraTesto 885-2 Thermal Imaging Camera

NO:RS202205090001

3. Chassis Fan Allocation

Fan3Fan4

Fan1

Fan2

Fan5

10

NO:RS202205090001

4. Chassis Thermal Airflow
Cool Airflow Inlets

Hot Airflow Exhausts

TopLeft

Right

Rear

Front
Bottom11

NO:RS202205090001

NO:RS202205090001

5. Chassis Measured Points
Measure Point
12345678910111213

Thermocouple
NumberDescription
Chassis Top Fan (None)VGA Fan (Intake)
VGA Rear Slot (Exhaust)
Chassis Front (Intake)
Chassis Right (Intake)
Chassis Left (Intake)
Chassis Middle-Right (Exhaust)
Chassis Middle-Left (Intake)
Chassis Rear VGA Fan (Exhaust)
Chassis Rear CPU Fan (Exhaust)
PSU Rear (Exhaust)
AIO Fan (Intake)
Chassis Bottom (Intake)

101
102
103
104
105
106
108
110
111
112
113
114
115

3
1

10
6
12

7

2

5

8

911

4

1213

6. Thermal Stress Test••••

13Setting up the chamber temperature and humidity
Temperature: 25°C
Humidity: 50%
Recording Data

NO:RS202205090001

6. Thermal Stress Test

Temperature Data Recoding
14NO:RS202205090001

6. Thermal Stress Test
System Thermal Stress Test - The Tower 500
Chassis Left (Intake)
Chassis Bottom (Intake)
Chassis Front (Intake)
Chassis Middle-Left (Intake)
VGA Rear Slot (Exhaust)
Chassis Top Fan (None )Chassis Rear VGA Fan (Exhaust)
Chassis Right (Intake)
VGA Fan (Intake)
Chassis Rear CPU Fan (Exhaust)
Chassis Middle-Right (Exhaust)
AIO Fan (Intake)
PSU Rear (Exhaust)

0.00
0.00
0.00
0.00
0.21
0.62
1.13

CPU- Intel Core i9-12900K 0.00
GPU-AORUS-RTX3090 XTREME
Ambient Temperature: 25°C
Humidity: 50%
Loading 100% with AIDA64 & FurMark

4.27
5.05
6.90

10.00

ΔT

25.00
25.00
25.00
25.00
25.00
25.00
25.00
25.00
25.00
25.00
16.03
25.00
18.49
25.00
25.00

25.00
25.00
25.00
25.00
25.21
25.62
26.13
29.27
30.05
31.90

20.00

30.00

Load Temp.

41.03
43.49
32.33

57.33
40.00

Ambient Temp.

50.00

60.00

70.00

Temperature - Degree CLower is Better

We expected to see higher temperature at the exhaust points and relatively lower temperature at the intake positions. The
highest temperature was found at the AIO exhaust, which is reasonable given the CPU was running at full load. Most ofthe intake positions recorded a temperature lower than 30°C since they were drawing air from environment. Two criticalpositions we were looking at are NO. 102 VGA Fan and NO. 114 AIO Fan, which were drawing internal air to cool two of themost important components.
15

NO:RS202205090001

7. AIDA64 & FurMark Test
We used AIDA64 Extreme (stress both CPU and FPU) and FurMark ROG Edition (resolution:3840 x 2160) to push 100% load on the CPU and GPU for 30 minutes.

AIDA64 Extreme

16FurMarkIdle

Full load

NO:RS202205090001

7. AIDA64 & FurMark Test

CPU & GPU Thermal Stress Test
The Tower 500

46CPU813525GPU7348010CPU- Intel Core i9-12900K
GPU-AORUS-RTX3090 XTREME
Ambient Temperature: 25°C
Humidity: 50%
Loading with AIDA64 & FurMark

17203040

ΔTLoad Temp.

50Idle Temp.

60

70

8090

Temperature - Degree CLower is Better

NO:RS202205090001

8. Graphics Performance Testing

18NO:RS202205090001

9. Acoustic Sound Pressure Level Test
Test Environment：Thermaltake Taipei Office
Test Model: The Tower 500
Test Ambience: 21.7 ℃(Temperature) / 69% R.H.(Relative Humidity)
Microphone position: 50 cm / in front of PC system
Background Noise：37.7 dBA.

30°

50 cm

Microphone position
19Test Ambience

NO:RS202205090001

9. Acoustic Sound Pressure Level Test
Idle – 38.6dBA

3DMARK Loading - 41dBA

Full load - 47.7dBA
Loading with AIDA64 & FurMark

20

NO:RS202205090001

9. Acoustic Sound Pressure Level Test
Acoustic Sound Pressure Level Test

CPU- Intel Core i9-12900K
GIGABYTE RTX 3090 XTREME
Ambient Temperature: 21.7°C
Humidity: 69%

The Tower 500
Test Condition
Full Load

1. CPU Fan 12cm x 3, 2500 rpm
2. Chassis Fan 12cm x 2, 1318 rpm
3. GPU Fan 10cm x 3, 1872 rpm

3DMARK

1. CPU Fan 12cm x 3, 1245 rpm
2. Chassis Fan 12cm x 2, 1148 rpm
3. GPU Fan 10cm x 3, 2064 rpm

Idle

1. CPU Fan 12cm x 3, 890 rpm
2. Chassis Fan 12cm x 2, 1331 rpm
3. GPU Fan 10cm x 3, 0 rpm

Loading with AIDA64 & FurMark

47.74138.6

Background Noise

37.70102030

Sound Pressure Level (dBA)
21405060

C. Conclusion

22NO:RS202205090001

Conclusion
Front View

Rear View

Full Load

Full
Full LoadLoadAIDA64 Extreme (stress both CPU and FPU) and FurMark ROG Edition (resolution: 3840 x 2160) to push 100% loadon the CPU and GPU for 30 minutes.

-INTEL I9 12900K，CPU Temp. (Max)：81℃-GIGABYTE AORUS GeForce RTX™ 3090 XTREME，GPU Temp. (Max)：73℃
Through the thermal image, we found that the internal heat was effectively directed to designatedexhaustion vents, keeping the system operating at a cooler temperature. This finding validates how
efficient Tower 500 is regarding cooling performance.
23

NO:RS202205090001

24