Topic : MicroNano 2009 / 1
Activities of the Micromachine Center / 5
Activities of the BEANS Laboratory / 10
MicroNano 2009 Concurrent Programs / 12

TopicMicro/Nano 2009
The 20th Exhibition Micromachine / MEMS
The world’s largest international exhibition on MEMS, ultraprecision machining andmicromachining, nanotechnology, and biotechnology
Date: July 29–31, 2009 (Wed–Fri)
Venue: Tokyo Big Sight (Tokyo International Exhibition Center), East Hall 5Sponsored by the Micromachine Center, Micro/Nano 2009 is acomprehensive event that brings together all the latest technology andproducts in the micro/nano and MEMS-related fields at one venue. Micro/Nano
2009 will be held at Tokyo Big Sight for three days on July 29–31, 2009
(Wed–Fri). Since this year marks the 20 t h holding of the Exhibition
Micromachine/ MEMS, we have prepared a special exhibit that visually
showcases developments in the micro/nano and MEMS industries, and adiverse schedule of events to be held concurrently in two special conference
areas set up at the venue.

S c h e d u l e o f C o n c u r r e n t E v e n t s (No admission fee)
7/29 ■ The 15th International Micromachine/Nanotech Symposium ~MEMS World~ (Conference area A)
Breakthroughs in the industrialization of MEMS and nanodevices achieved through integration andconvergence: experts from Japan and abroad will present the latest information on an intensification of R&D
activities and promising MEMS applications.

■ The Workshop on Industry-Academia Collaboration (Conference area B, morning)
Academic and public research affiliates of the MEMS industry forum will present their latest researchfindings on micromachines and MEMS together with exhibits at the 20th Exhibition Micromachine/MEMS.

■ MEMS Packaging Forum (Conference area B, afternoon)
An event that is new to Micro/Nano 2009, this seminar will focus on MEMS packaging, which is an area being
closely watched in the industry today.

7/30■ Japanese-German Micro/Nano Business Forum (Conference area A)
Organized by Germany’s IVAM Microtechnology Network in cooperation with the MMC, this forum provides agood opportunity for the mostly Europe-based member companies of IVAM to showcase their products andtechnologies and to make business contacts with Japanese companies.

■ The Workshop on Industry-Academia Collaboration (Conference area B, morning)■ BEANS Project Seminar (Conference area B, afternoon)
This seminar will provide an overview of Process Integration Project for Hetero-Functional IntegratedDevices (the BEANS Project), a five-year project initiated in 2008, and to discuss the prospects of core
process technologies required for creating the innovative next-generation devices targeted by the BEANSProject.

7/31■ MEMS Industry Forum (Conference area A)
This forum provides an opportunity for members and guests to exchange ideas and distribute information.
The forum presents the latest activities of the MIF and the state of regional efforts by affiliated local clusters
and public research institutes to strengthen the infrastructure of the MEMS industry.

■ Presentation of results from the Fine MEMS Project (Conference area B)
This event summarizes the research findings of the three-year NEDO project entitled the Highly Integrated,
Complex MEMS Production Technology Development Project (or the Fine MEMS Project), which concludedin 2008.

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