Dell PowerEdge HS5610
Technical Guide

Regulatory Model: E87S
Regulatory Type: E87S001
June 2024
Rev. A03

Notes, cautions, and warnings
NOTE: A NOTE indicates important information that helps you make better use of your product.
CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid
the problem.
WARNING: A WARNING indicates a potential for property damage, personal injury, or death.

© 2023 - 2024 Dell Inc. or its subsidiaries. All rights reserved. Dell Technologies, Dell, and other trademarks are trademarks of Dell Inc. or its
subsidiaries. Other trademarks may be trademarks of their respective owners.

Contents
Chapter 1: System overview.......................................................................................................... 6
Key workloads...................................................................................................................................................................... 6
New technologies................................................................................................................................................................ 6
Chapter 2: System features and generational comparison............................................................. 8
Chapter 3: Chassis views and features.........................................................................................10
Chassis views......................................................................................................................................................................10
Front view of the system........................................................................................................................................... 10
Rear view of the system.............................................................................................................................................15
Inside the system ........................................................................................................................................................ 17
System diagnostics and indicator codes.................................................................................................................17
Quick Resource Locator............................................................................................................................................. 19
Chapter 4: Processor................................................................................................................... 21
Processor features ........................................................................................................................................................... 21
Supported processors................................................................................................................................................. 21
Chipset.................................................................................................................................................................................22
Chipset features.......................................................................................................................................................... 22
Chapter 5: Memory subsystem.................................................................................................... 23
Supported memory........................................................................................................................................................... 23
General memory module installation guidelines..........................................................................................................24
Chapter 6: Storage......................................................................................................................26
Storage controllers........................................................................................................................................................... 26
Storage controller feature matrix............................................................................................................................ 26
Server storage controllers User Guide................................................................................................................... 28
RAID - Redundant Array of Independent Disks.................................................................................................... 28
Datasheets and PERC performance scaling decks............................................................................................. 28
Boot Optimized Storage Solution (BOSS)............................................................................................................ 28
Supported Drives...............................................................................................................................................................30
External Storage.................................................................................................................................................................31
Chapter 7: Networking................................................................................................................ 32
Overview............................................................................................................................................................................. 32
OCP 3.0 support................................................................................................................................................................32
Supported OCP cards................................................................................................................................................ 32
OCP NIC 3.0 vs. rack Network Daughter Card comparisons........................................................................... 33
Chapter 8: Slot priority matrix.....................................................................................................34
Expansion card installation guidelines.......................................................................................................................... 34

Contents

3

Chapter 9: Power, thermal, and acoustics................................................................................... 45
Power................................................................................................................................................................................... 45
PSU specifications...................................................................................................................................................... 46
Thermal................................................................................................................................................................................ 47
Acoustics............................................................................................................................................................................. 48
Acoustical configurations ......................................................................................................................................... 48
Chapter 10: Rack, rails, and cable management........................................................................... 50
Rails information................................................................................................................................................................50
A11 Sliding Rails features summary......................................................................................................................... 50
A8 Static Rails features summary............................................................................................................................ 51
A22 Blind Mate Power Rail features summary.....................................................................................................52
Cable Management Arm.................................................................................................................................................. 56
Strain Relief Bar ............................................................................................................................................................... 56
Rack Installation.................................................................................................................................................................57
Chapter 11: Supported operating systems.................................................................................... 61
Chapter 12: Dell Systems Management........................................................................................ 62
Integrated Dell Remote Access Controller (iDRAC)................................................................................................. 62
Systems Management software support matrix....................................................................................................... 63
Getting started with Dell Open Server Manager (OSM).........................................................................................64Open Server Manager (OSM) introduction.......................................................................................................... 64
What is OpenBMC? ................................................................................................................................................... 64
Why Dell Open Server Manager? ........................................................................................................................... 64
Why choose Dell Open Server Manager built on OpenBMC? .........................................................................65
Dell Open Server Manager Capabilities ................................................................................................................ 65
Chapter 13: Appendix A. Standards compliance........................................................................... 66
Chapter 14: Appendix B: Additional resources.............................................................................. 67
Customer kits..................................................................................................................................................................... 67
Dell Upgrades................................................................................................................................................................67
Upgrades portfolio.......................................................................................................................................................67
Upgrades reference links...........................................................................................................................................69
Documentation...................................................................................................................................................................69
Chapter 15: Appendix C: Additional specifications....................................................................... 70
Chassis dimensions .......................................................................................................................................................... 70
System weight.................................................................................................................................................................... 71
Video specifications........................................................................................................................................................... 71
USB ports specifications................................................................................................................................................. 72
PSU rating........................................................................................................................................................................... 72
Environmental specifications.......................................................................................................................................... 73
Thermal restrictions.................................................................................................................................................... 74
Chapter 16: Appendix D: Service and support.............................................................................. 94
Default support levels...................................................................................................................................................... 94

4

Contents

Default deployment levels......................................................................................................................................... 94
Other services and support information......................................................................................................................94
Dell deployment services........................................................................................................................................... 94
Dell custom deployment Services........................................................................................................................... 98
Dell Residency Services............................................................................................................................................. 98
Dell Data Migration Services.................................................................................................................................... 98
Dell Enterprise Support Services.............................................................................................................................99
Enterprise connectivity............................................................................................................................................. 101
Dell TechDirect........................................................................................................................................................... 102
Dell Technologies Consulting Services................................................................................................................. 102

Contents5

1
System overview
The Dell PowerEdge HS5610 is Dell's latest 2-socket, 1U rack server designed to run the most popular workloads using highly
scalable memory, I/O, and network options. The systems feature the 4th and 5th Generation Intel® Xeon Scalable Processor(Socket E1/LGA4677-1), up to 16 DIMMs, PCI Express® (PCIe) 5.0 enabled expansion slots, and a broad selection of network
interface technologies.

Topics:••

Key workloads
New technologies

Key workloads
The target workloads for the PowerEdge HS5610 include Virtualization, Scale-Out Database, and Software-Defined Storage
Node.

New technologies
Table 1. New technologies
Technology

Detailed Description

Up to 2 x 5th Gen Intel(R) Xeon(R)Scalable Processors (Emerald Rapids)

Core count: Up to 32 per processor
Up to 3.9 GHz
UPI speed: Up to 3x UPIs/Socket at 12.8 GT/s or 14.4 or 16 GT/s or 20 GT/s
Maximum number of PCIe lanes: Integrated 80 PCIe 5.0 lanes @ 32 GT/s PCIe
Gen5
Maximum TDP: 250 W

Up to 2 x 4th Gen Intel(R) Xeon(R)Scalable Processors (Sapphire Rapids)

Core count: Up to 32 per processor
UPI speed: Up to 3x UPIs/Socket at 12.8 GT/s or 14.4 or 16 GT/s
Maximum number of PCIe lanes: Integrated 80 PCIe 5.0 lanes @ 32 GT/s PCIe
Gen5
Maximum TDP: 250 W

DDR5 ECC memory up to 5600 MT/s

Maximum 8 DIMMs per processor and 16 DIMMs in total
1 DIMMs per channel (1 DPC)
Supports DDR5 registered DIMMs (RDIMMs)

Flex I/O

LOM: 2 x 1 GbE with BCM5720 LAN controller
Rear IO with 1 GbE Dedicated Management Network Port, USB 3.0 x1, USB 2.0 x1
and VGA port
OCP Mezz 3.0 (supported by x8 PCIe lanes)
Serial port option

6

System overview

Table 1. New technologies (continued)
Technology

Detailed Description
6x2.5" config only: 2x FLOPs - Front OCP slots, Front iDRAC/OSM dedicatedmanagement RJ45
port, Front Serial port

CPLD 1-wireSupport payload data of front PERC, Riser, BOSS-N1, BP, and Rear I/O to BIOS
and iDRAC.

Dedicated PERC

Front storage module PERC with front PERC 11/12 and PERC 12.2

Software RAID

OS RAID / S160

Power Supplies

60 mm dimension is the new PSU form factor on 16G design● 700 W Titanium 200–240 VAC/240 VDC● 800 W Platinum 100–240 VAC/ 240 VDC● 1100 W DC/-48–(-60) V● 1100 W Titanium 100–240 VAC/ 240 VDC● 1400 W Titanium 100–240 VAC/ 240 VDC● 1400 W Platinum 100–240 VAC/ 240 VDC● 1400 W Titanium 277 VAC / 366 VDC● 1800 W Titanium 200–240 VAC/ 240 VDC

System overview

7

2
System features and generational
comparison
The following table shows the comparison between the PowerEdge HS5610 with the PowerEdge R650xs.

Table 2. Feature comparison
FeaturePowerEdge HS5610

PowerEdge R650xs

Processor● Up to 2 x 4th Gen Intel(R) Xeon(R) Scalable
Processors (Sapphire Rapids) with up to 32
cores● Up to 2 x 5th Gen Intel(R) Xeon(R) Scalable
Processors (Emerald Rapids) with up to 32
cores

Maximum two 3 rd Generation Intel® Xeon
Scalable Processor

Processor Interconnect Intel Ultra Path Interconnect (UPI) , up to 3 links
per CPUIntel Ultra Path Interconnect (UPI)

Memory16 x RDIMM DDR4 with ECC, Up to 3200
MT/s

16 DDR5 DIMM slots
Supports RDIMM 2 TB max
Speed maximum 5600 MT/s for 5th generation and
4800 MT/s for 4th generation processors
Supports registered ECC DDR5 DIMMs only
NVDIMM : No

Storage Drives

Front bays:● 0 drive bay● Up to 4 x 3.5-inch SAS/SATA (HDD/SSD) max
96 TB● Up to 6 x 2.5-inch SAS/SATA/NVMe (HDD/
SSD) max 92.16 TB● Up to 8 x 2.5-inch SAS/SATA/NVMe (HDD/
SSD) max 122.88 TB● Up to 10 x 2.5-inch SAS/SATA/NVMe (HDD/
SSD) max 153.6 TB
Rear bays:● Up to 2x 2.5-inch SAS/SATA/NVMe (HDD/
SSD) max 15.2 TB

Storage Controllers

Internal controllers: PERC H355, PERC H755, PERC Internal controllers: PERC H345, PERC H355,
H755N, HBA465i HBA355i, HBA465i (post-RTS)
PERC H745, PERC H755, PERC H755N,
HBA355i, S150
Internal Boot: Boot Optimized Storage Subsystem(BOSS-N1): HWRAID 2 x M.2 SSDs and InternalInternal Boot: Internal Dual SD Module, BootUSB
Optimized Storage Subsystem (BOSS S1):HWRAID 2 x M.2 SSDs, USB
External PERC (RAID): HBA355e, H965e
External PERC (RAID): PERC H840, HBA355e
Software RAID: S160

PCIe Slots

Up to 2 x PCIe Gen5 or Up to 3 x PCIe Gen4

Up to 3 x PCIe Gen4

Embedded NIC (LOM)

2 x 1 GbE

2 x 1 GbE

8

System features and generational comparison

Front bays:● 0 drive bay● Up to 4x 3.5-inch SAS/SATA (HDD/SSD)
max 64 TB● Up to 8x 2.5-inch SAS/SATA/NVMe(HDD/SSD) max 61.44 TB● Up to 10x 2.5-inch SAS/SATA/NVMe(HDD/SSD) max 76.8 TB
Rear bays:● Up to 2x 2.5-inch SAS/SATA/NVMe(HDD/SSD) max 15.36 TB

Table 2. Feature comparison (continued)
FeaturePowerEdge HS5610

PowerEdge R650xs

Networking options(OCP 3.0)

Max 1 OCP 3.0 (x8 PCIE lanes)

Max 1 OCP 3.0 (x16 PCIE lanes)

2 x OCP 3.0 (x8 PCIE lanes)

I/O Ports

Front ports:● 1 x iDRAC Direct (Micro-AB USB) port
● 1 x USB 2.0● 1 x VGA
Rear ports:● 1 x Dedicated iDRAC Ethernet port
● 1 x USB 2.0● 1 x USB 3.0● 1 x Serial (optional)● 1 x VGA
● 2 x Ethernet
Internal port
● 1 x USB 3.0 (optional)

Front ports:● 1 x iDRAC Direct (Micro-AB USB) port
● 1 x USB 2.0● 1 x VGA
Rear ports:● 1 x Dedicated iDRAC Ethernet port
● 1 x USB 2.0● 1 x USB 3.0● 1 x Serial (optional)● 1 x VGA
● 2 x Ethernet
Internal port
● 1 x USB 3.0 (optional)

Rack Height

1U

1U

Power Supplies

●
●
●
●
●
●
●
●

700 W Titanium 200-240 VAC/240 VDC
800 W Platinum 100-240 VAC/ 240 VDC
1100 W DC/-48–(-60) V
1100 W Titanium 100-240 VAC/ 240 VDC
1400 W Titanium 100-240 VAC/ 240 VDC
1400 W Platinum 100-240 VAC/ 240 VDC
1400 W Titanium 277 VAC/ 366 VDC
1800 W Titanium 200-240 VAC/240 VDC

●
●
●
●
●
●
●

600 W Platinum 100-240 VAC/ 240 VDC
700 W Titanium 200-240 VAC/240 VDC
800 W Platinum 100-240 VAC/ 240 VDC
1100 W DC/-48–(-60) V
1100 W Titanium 100-240 VAC/ 240 VDC
1400 W Platinum 100-240 VAC/ 240 VDC
1800 W Titanium 200-240 VAC/240 VDC

System Management

●
●
●
●
●
●

iDRAC9iDRAC Direct
iDRAC RESTful API with Redfish
iDRAC Service Module
Open Server Manager
Quick Sync 2 wireless module

●
●
●
●

iDRAC9iDRAC Direct
iDRAC Service Module
Quick Sync 2 wireless module

Availability

Hot-plug drives

Hot-plug drives

Hot-plug redundant cooling

Hot-plug redundant cooling

Hot-plug redundant power supplies

Hot-plug redundant power supplies
IDSDM

System features and generational comparison

93
Chassis views and features
Topics:•Chassis views

Chassis views
Front view of the system

Figure 1. Front view of 4 x 3.5-inch drive system

Table 3. Features available on the front of the system
Item

Ports, panels, and
slots

Icon

Description

1

Left control panel

N/A

Contains the system health, system ID, status LED, and theiDRAC Quick Sync 2 (wireless) indicator.
NOTE: The iDRAC Quick Sync 2 indicator is available only
on certain configurations.
NOTE: OSM (Open Server Manager) does not support
Quick Sync 2, only iDRAC supports Quick Sync 2.
● Status LED: Enables you to identify any failed hardware
components. There are up to five status LEDs and an overallsystem health LED (Chassis health and system ID) bar.
● Quick Sync 2 (wireless): Indicates a Quick Sync enabled
system. The Quick Sync feature is optional. This featureallows management of the system by using mobile devices
called as OpenManage Mobile (OMM) feature. Using iDRAC
Quick Sync 2 with OpenManage Mobile (OMM) aggregateshardware or firmware inventory and various system level
diagnostic and error information that can be used introubleshooting the system. For more information, see theIntegrated Dell Remote Access Controller User's Guide

2

Drive

3

VGA port

4

Right control panel

10

N/A

Enables you to install drives that are supported on your system.
Enables you to connect a display device to the system.

N/A

Chassis views and features

Contains the power button, USB port, iDRAC Direct micro port,
and the iDRAC Direct status LED.
NOTE: iDRAC Direct micro port is not supported with OSM.

Table 3. Features available on the front of the system (continued)
Item

Ports, panels, and
slots

Icon

Description

5

Express service tag

N/A

The Express Service Tag is a slide-out label panel that contains
system information such as Service Tag, NIC, MAC address, andso on. If you have opted for the secure default access to iDRAC,
the Information tag will also contain the iDRAC secure default
password.

Figure 2. Front view of 6 x 2.5-inch drive system
NOTE: The Front I/O designed for serviceability from the datacenter's cold aisle.
NOTE: This configuration is not compatible with bezel.

Table 4. Features available on the front of the system
Item

Ports, panels, and
slots

Icon

Description

1

Left control panel

N/A

Contains the system health, system ID, status LED indicator.
● Status LED: Enables you to identify any failed hardware
components. There are up to five status LEDs and an overallsystem health LED (Chassis health and system ID) bar.

2

Serial port

N/A

Serial connector is a 9-pin connector, Data Terminal Equipment(DTE), 16550-compliant.

3

iDRAC dedicated port

4

BOSS-N1 module

N/A

BOSS module for internal system boot.

5

OCP NIC port (FLOP
assembly)

N/A

This port supports 2 x OCP 3.0.

6

Drive

N/A

Enables you to install drives that are supported on your system.

7

Right control panel

N/A

Contains the power button, USB port, iDRAC Direct micro port,
and the iDRAC Direct status LED.
NOTE: iDRAC Direct micro port is not supported with OSM.

8

VGA port

9

Express service tag

iDRAC Manuals

Enables you to connect a display device to the system.
N/A

The Express Service Tag is a slide-out label panel that contains
system information such as Service Tag, NIC, MAC address, andso on. If you have opted for the secure default access to iDRAC,
the Information tag will also contain the iDRAC secure default
password.

Chassis views and features11

Figure 3. Front view of 8 x 2.5-inch drive system

Table 5. Features available on the front of the system
Item

Ports, panels, and
slots

Icon

Description

1

Left control panel

N/A

Contains the system health, system ID, status LED, and theiDRAC Quick Sync 2 (wireless) indicator.
NOTE: The iDRAC Quick Sync 2 indicator is available only
on certain configurations.
NOTE: OSM (Open Server Manager) does not support
Quick Sync 2, only iDRAC supports Quick Sync 2.
● Status LED: Enables you to identify any failed hardware
components. There are up to five status LEDs and an overallsystem health LED (Chassis health and system ID) bar.
● Quick Sync 2 (wireless): Indicates a Quick Sync enabled
system. The Quick Sync feature is optional. This featureallows management of the system by using mobile devices
called as OpenManage Mobile (OMM) feature. Using iDRAC
Quick Sync 2 with OpenManage Mobile (OMM) aggregateshardware or firmware inventory and various system level
diagnostic and error information that can be used introubleshooting the system. For more information, see theIntegrated Dell Remote Access Controller User's Guide

2

Drive

N/A

Enables you to install drives that are supported on your system.

3

Right control panel

N/A

Contains the power button, USB port, iDRAC Direct micro port,
and the iDRAC Direct status LED.
NOTE: iDRAC Direct micro port is not supported with OSM.

4

VGA port

5

Express service tag

Enables you to connect a display device to the system.
N/A

Figure 4. Front view of 10 x 2.5-inch drive system

12

Chassis views and features

The Express Service Tag is a slide-out label panel that contains
system information such as Service Tag, NIC, MAC address, andso on. If you have opted for the secure default access to iDRAC,
the Information tag will also contain the iDRAC secure default
password.

Table 6. Features available on the front of the system
Item

Ports, panels, and
slots

Icon

Description

1

Left control panel

N/A

Contains the system health, system ID, status LED, and theiDRAC Quick Sync 2 (wireless) indicator.
NOTE: The iDRAC Quick Sync 2 indicator is available only
on certain configurations.
NOTE: OSM (Open Server Manager) does not support
Quick Sync 2, only iDRAC supports Quick Sync 2.
● Status LED: Enables you to identify any failed hardware
components. There are up to five status LEDs and an overallsystem health LED (Chassis health and system ID) bar.
● Quick Sync 2 (wireless): Indicates a Quick Sync enabled
system. The Quick Sync feature is optional. This featureallows management of the system by using mobile devices
called as OpenManage Mobile (OMM) feature. Using iDRAC
Quick Sync 2 with OpenManage Mobile (OMM) aggregateshardware or firmware inventory and various system level
diagnostic and error information that can be used introubleshooting the system. For more information, see theIntegrated Dell Remote Access Controller User's Guide

2

Drive

N/A

Enables you to install drives that are supported on your system.

3

Right control panel

N/A

Contains the power button, USB port, iDRAC Direct micro port,
and the iDRAC Direct status LED.
NOTE: iDRAC Direct micro port is not supported with OSM.

4

VGA port

5

Express service tag

Enables you to connect a display device to the system.
N/A

The Express Service Tag is a slide-out label panel that contains
system information such as Service Tag, NIC, MAC address, andso on. If you have opted for the secure default access to iDRAC,
the Information tag will also contain the iDRAC secure default
password.

Left control panel view

Figure 5. Left control panel

Table 7. Left control panel
Item

Indicator, button, orconnector

Icon

Description

1

Status LED indicators

NA

Indicates the status of the system. For more information, see theStatus LED indicators section.

Chassis views and features

13

Table 7. Left control panel (continued)
Item

Indicator, button, orconnector

2

System health and system
ID indicator

Icon

Description
Indicates the status of the system. For more information, see the
System health and system ID indicator codes section.

Figure 6. Left control panel with optional iDRAC Quick Sync 2 indicator

Table 8. Left control panel with optional iDRAC Quick Sync 2 indicator
Item

Indicator, button, orconnector

Icon

Description

1

Status LED indicators

N/A

Indicates the status of the system. For more information, see theStatus LED indicators section.

2

System health and system
ID indicator

Indicates the status of the system. For more information, see the
System health and system ID indicator codes section.

3

iDRAC Quick Sync
2 wireless indicator(optional)

Indicates if the iDRAC Quick Sync 2 wireless option is
activated. The Quick Sync 2 feature allows management of thesystem using mobile devices. This feature aggregates hardware/
firmware inventory and various system level diagnostic/error
information that can be used in troubleshooting the system. You
can access system inventory, Dell Lifecycle Controller logs orsystem logs, system health status, and also configure iDRAC,
BIOS, and networking parameters. You can also launch the virtual
Keyboard, Video, and Mouse (KVM) viewer and virtual Kernelbased Virtual Machine (KVM), on a supported mobile device.
For more information, see the Integrated Dell Remote AccessController User's Guide at PowerEdge manuals.

NOTE: For more information about the indicator codes, see the System diagnostics and indicator codes section.

14

Chassis views and features

Right control panel view

Figure 7. Right control panel

Table 9. Right control panel
Item

Indicator or button

Icon

Description

1

iDRAC Direct LED
indicator

N/A

The iDRAC Direct LED indicator lights up to indicate that the iDRAC Direct
port is actively connected to a device.

2

USB 2.0-compliant port

The USB port is a 4-pin connector and 2.0-compliant. This port enables
you to connect USB devices to the system.

3

Power button

Indicates if the system is powered on or off. Press the power button to
manually power on or off the system.
NOTE: Press the power button to gracefully shut down an ACPIcompliant operating system.

4iDRAC Direct port (MicroAB USB)

The iDRAC Direct port (Micro-AB USB) enables you to access the iDRAC
direct Micro-AB USB features. For more information, see the iDRAC
Manuals.
NOTE: You can configure iDRAC Direct by using a USB to micro USB(type AB) cable, which you can connect to your laptop or tablet. Cable
length should not exceed 3 feet (0.91 meters). Performance could be
affected by cable quality.

Rear view of the system

Figure 8. Rear view of the system

Chassis views and features

15

Table 10. Rear view of the system
Item

Ports, panels, or slots

Icon

Description

1

PCIe expansion card riser
1 (slot 1)

N/A

Enables you to connect PCI Express expansion cards.

2

BOSS riser

N/A

Enables you to connect BOSS card.

3

PCIe expansion card riser
2 (slot 2 and slot 3)

N/A

Enables you to connect PCI Express expansion cards.
Oror
Rear drive module

Enables you to install rear drives that are supported on yoursystem.

4

Power supply unit (PSU 1)

IPSU1 is the primary PSU of the system.

5

Power supply unit (PSU2)

PSU2 is the secondary PSU of the system.

6

System identification
buttonPress the system ID button:● To locate a particular system within a rack.
● To turn the system ID on or off.
To reset iDRAC, press and hold the button for 16 seconds.
NOTE:● To reset iDRAC using system ID, ensure that the system ID
button is enabled in the iDRAC setup.
● If the system stops responding during POST, press and holdthe system ID button (for more than five seconds) to enter
the BIOS progress mode.

7

VGA port

8

OCP NIC port

9

USB 3.0 port

This port is USB 3.0-compliant.

10

USB 2.0 port

This port is USB 2.0-compliant.

11

iDRAC dedicated port

Enables you to remotely access iDRAC. For more information, see
the iDRAC User’s Guide at PowerEdge manuals.

12

NIC ports

The NIC ports that are integrated on the system board provide
network connectivity. These NIC ports can also be shared with
iDRAC when iDRAC network settings is set to shared mode.

16

Chassis views and features

Enables you to connect a display device to the system.
N/A

This port supports OCP 3.0.

Inside the system

Figure 9. Inside the system
1. OCP NIC ports (available in 6 x 2.5-inch configuration)
3. Fan5. Memory module slots
7. PSU 1 and PSU 2
9. BOSS riser
11. Drive backplane

2. BOSS-N1 (available in 6 x 2.5-inch configuration)
4. Intrusion switch
6. Riser 2
8. Riser 1
10. Heat sink
12. Express service tag

System diagnostics and indicator codes
The diagnostic indicators on the system front panel display system status during system startup.

Status LED indicators
NOTE: The indicators display solid amber if any error occurs.

Chassis views and features

17

Figure 10. Status LED indicators

Table 11. Status LED indicators and descriptions
Icon

Description

Condition

Drive indicator● Check the System Event Log to determine if thedrive has an error.
● Run the appropriate Online Diagnostics test.
The indicator turns solid amber if
Restart the system and run embedded
there is a drive error.
diagnostics (ePSA).
● If the drives are configured in a RAID array,
restart the system, and enter the host adapter
configuration utility program.

Temperature
indicator

The indicator turns solid amber if
the system experiences a thermal
error (for example, the ambient
temperature is out of range orthere is a fan failure).

Electricalindicator

The indicator turns solid amber
if the system experiences anelectrical error (for example,
voltage out of range, or a failed
power supply unit (PSU) or
voltage regulator).

Corrective action

Ensure that none of the following conditions exist:● A cooling fan has been removed or has failed.
● System cover, air shrouds, or back filler bracket
has been removed.
● Ambient temperature is too high.
● External airflow is obstructed.
If the problem persists, see the Getting help section.
Check the System Event Log or system messages
for the specific issue. If it is due to a problem with
the PSU, check the LED on the PSU. Reseat thePSU.
If the problem persists, see theGetting help section.

Check the System Event Log or system messages
for the location of the failed memory. Reseat the
memory module.

Memory indicator

The indicator turns solid amber if amemory error occurs.
If the problem persists, see theGetting help section.

Restart the system. Update any required drivers for
the PCIe card. Reinstall the card.

PCIe indicator

18

The indicator turns solid amber if a
PCIe card experiences an error.

Chassis views and features

If the problem persists, see theGetting help section.
NOTE: For more information about the
supported PCIe cards, see the Expansion cards
and expansion card risers > Expansion card
installation guidelines section.

System health and system ID indicator codes
The system health and system ID indicator is located on the left control panel of the system.

Figure 11. System health and system ID indicator

Table 12. System health and system ID indicator codes
System health and system Condition
ID indicator code
Solid blue

Indicates that the system is powered on, is healthy, and system ID mode is not active. Press
the system health and system ID button to switch to system ID mode.

Blinking blue

Indicates that the system ID mode is active. Press the system health and system ID button toswitch to system health mode.

Solid amber

Indicates that the system is in fail-safe mode. If the problem persists, see the Getting help
section.

Blinking amber

Indicates that the system is experiencing a fault. Check the System Event Log for specificerror messages. For information about the event and error messages generated by thesystem firmware and agents that monitor system components, go to QRL > Look Up > Error
Code, type the error code, and then click Look it up.

Quick Resource Locator
The QRL on everything (SILs, GSG, Owner's Manual except on the EST) is a generic QRL for HS5610 that leads to a webpage
for that product. That webpage has links for things like setup and service videos, iDRAC manual, and other things that apply tothe platform. The QRL on the EST is unique and specific to that service tag and will contain the Service Tag number and theiDRAC password. The label and the QRL code within it are printed on demand at the L10 factories. This QRL links to a webpage
that shows the exact configuration as built for that customer, and the specific warranty purchased. It is one click away from thesame content of generic information that applies to HS5610 that is available in the other QRLs.

Chassis views and features

19

Figure 12. Quick Resource Locator for PowerEdge HS5610 system

20

Chassis views and features

4
Processor
Topics:••Processor features
Chipset

Processor features
The Intel 4 th and 5 th Generation Xeon ® Scalable Processors stack is the next-generation data center processor offering withsignificant performance increases, integrated acceleration, and next-generation memory and I/O. Sapphire Rapids and Emerald
Rapids accelerate customer usage with unique workload optimizations and provide the following feature improvements:● Faster UPI with up to three Intel Ultra Path Interconnect (Intel UPI) at up to 20 GT/s, increasing multisocket bandwidth● More, faster I/O with PCI Express 5 and up to 80 lanes (per socket)● Enhanced Memory Performance with DDR5 support and memory speed up to 5600 MT/s in one DIMM per channel (1DPC)● New onboard accelerators for data analytics, networking, storage, crypto, and data compression● Enhanced security for virtualized environments with Intel Trust Domain Extensions (IntelR TDX) for confidential computing

Supported processors
The following table shows the Intel Sapphire Rapids and Intel Emerald Rapids SKUs that are supported on the HS5610.

Table 13. Supported Processors for HS5610
Processor

Clock
Speed
(GHz)

Cache
(M)

UPI (GT/s)

Cores

Threads

Turbo

MemorySpeed (MT/s)

TDP

6548N *

2.8

60

20

32

64

Turbo

5200

250 W

6548Y+ *

2.5

60

20

32

64

Turbo

5200

250 W

6542Y *

2.9

60

20

24

48

Turbo

5200

250 W

6534 *

3.9

22.5

20

8

16

Turbo

4800

195 W

6526Y*

2.8

37.5

20

16

32

Turbo

5200

195 W

5512U *

2.1

52.5

N/A

28

56

Turbo

4800

185 W

4514Y *

2.0

30

16

16

32

Turbo

4400

150 W

4510 *

2.4

30

16

12

24

Turbo

4400

150 W

4509Y*

2.6

23

16

8

16

Turbo

4400

125 W

6448Y

2.2

60

16

32

64

Turbo

4800

225 W

6444Y

3.5

45

16

16

32

Turbo

4800

270 W

6442Y

2.6

60

16

24

48

Turbo

4800

225 W

6438Y+

2.0

60

16

32

64

Turbo

4800

205 W

6438M

2.2

60

16

32

64

Turbo

4800

205 W

6434

3.7

23

16

8

16

Turbo

4800

205 W

6426Y

2.6

38

16

16

32

Turbo

4800

185 W

Processor

21

Table 13. Supported Processors for HS5610 (continued)
Processor

Clock
Speed
(GHz)

Cache
(M)

UPI (GT/s)

Cores

Threads

Turbo

MemorySpeed (MT/
s)

TDP

6414U

2.0

60

16

32

64

Turbo

4800

250 W

5420+

2.0

53

16

28

56

Turbo

4400

205 W

5418Y

2.0

45

16

24

48

Turbo

4400

185 W

5415+

2.9

23

16

8

16

Turbo

4400

150 W

5412U

2.1

45

16

24

48

Turbo

4400

185 W

4416+

2.0

38

16

20

40

Turbo

4000

165 W

4410Y

2.0

30

16

12

24

Turbo

4000

150 W

3408U

1.8

23

16

8

16

No Turbo

4000

125 W

NOTE: The asterisk symbol next to the processor denotes they are Intel 5th Generation Xeon® Emerald Rapids Scalable
Processors .
NOTE: 6444Y does not operate at the standard 270W spec because of a 250W motherboard limit. However, this does not
result in a meaningful loss of core count or performance (1-2% of throughput in Dell Internal Testing). Users can also select225W or 200W in the BIOS set-up menu.

ChipsetThe system supports Intel ® C741 series chipset.
DMI - 3.0 speed (port width x8, x4)
USB ports - up to 10 superspeed (USB 3.1), 14 highspeed (USB 2.0)
SATA ports - up to 20 SATA port
PCIe Express - Up to 20 lanes, PCIe 3.0

Chipset features● PCI-E interfaces○ Integrated PCI Express Gen5 for improved bandwidth and connectivity○ Up to 80 lanes per processor○ Connect PCIe x1 to iDRAC- integrated VGA chip
● Integrated USB - maximum of 10 SuperSpeed (USB 3.1), 14 highspeed (USB 2.0)
○ One front port (USB 2.0 / Right front I/O)
○ Two rear ports (USB 2.0/3.0)

22Processor

5Memory subsystem
Topics:••Supported memory
General memory module installation guidelines

Supported memory
Table 14. Memory technology comparison
FeaturePowerEdge HS5610 (DDR5)

DIMM type

RDIMM

Transfer speed

5600 MT/s(1DPC)
NOTE: Maximum DIMM transfer speed support
dependent on CPU SKU and DIMM population

Voltage

1.1 V

Table 15. Supported DIMMs
DIMM PN

Rated DIMM
Speed (MT/s)

DIMM TypeDIMM
Capacity (GB)

Ranks per
DIMM

Data Width

DIMM Volts
(V)

1V1N1

4800

RDIMM

16

1

x8

1.1

W08W9

4800

RDIMM

32

2

x8

1.1

J52K5

4800

RDIMM

64

2

x4

1.1

MMWR9

4800

RDIMM

128

4

x4

1.1

5DR48

5600

RDIMM

16

1

x8

1.1

P8XPW

5600

RDIMM

32

2

x8

1.1

58F8N

5600

RDIMM

64

2

x4

1.1

FFX9N

5600

RDIMM

96

2

x4

1.1

GD7H7

5600

RDIMM

128

4

x4

1.1

Table 16. Supported memory matrix
DIMM type

RDIMM

Rank

1R

Capacity

16 GB

DIMM rated voltage
and speed

Operating Speed

DDR5 (1.1 V), 4800
MT/s

Up to 4800 MT/s

1 DIMM per channel(DPC)

Up to 5200 MT/s

DDR5 (1.1 V), 5600
MT/s
2R

32 GB, 64 GB, 96 GB

DDR5 (1.1 V), 4800
MT/s

Up to 4800 MT/s
Up to 5200 MT/s

Memory subsystem

23

Table 16. Supported memory matrix (continued)
DIMM type

Rank

Capacity

DIMM rated voltage
and speed

Operating Speed
1 DIMM per channel(DPC)

DDR5 (1.1 V), 5600
MT/s
4R

128 GB

DDR5 (1.1 V), 4800
MT/s

Up to 4800 MT/s
Up to 5200 MT/s

DDR5 (1.1 V), 5600
MT/s
NOTE: 5600 MT/s RDIMMs are applicable for 5th Gen IntelR XeonR Scalable Processors.
NOTE: The processor may reduce the performance of the rated DIMM speed.

General memory module installation guidelines
To ensure optimal performance of your system, observe the following general guidelines when configuring your system memory.
If your system's memory configuration fails to observe these guidelines, your system might not boot, stop responding during
memory configuration, or operate with reduced memory.
The memory bus may operate at speeds of 5600 MT/s, 5200 MT/s, 4800 MT/s, 4400 MT/s or 4000 MT/s depending on thefollowing factors:● System profile selected (for example, Performance, Performance Per Watt Optimized (OS), or Custom [can be run at highspeed or lower])● Maximum supported DIMM speed of the processors● Maximum supported speed of the DIMMs
NOTE: MT/s indicates DIMM speed in MegaTransfers per second.
The system supports Flexible Memory Configuration, enabling the system to be configured and run in any valid chipset
architectural configuration. The following are the recommended guidelines for installing memory modules:●●●●

All DIMMs must be DDR5.
Memory mixing is not supported for different DIMM capacities.
If memory modules with different speeds are installed, they operate at the speed of the slowest installed memory module(s).
Populate memory module sockets only if a processor is installed.
○ For single-processor systems, sockets A1 to A8 are available.
○ For dual-processor systems, sockets A1 to A8 and sockets B1 to B8 are available.
○ A minimum of 1 DIMM must be populated for each installed processor.
● In Optimizer Mode, the DRAM controllers operate independently in the 64-bit mode and provide optimized memory
performance.

Table 17. Memory population rules

24

Processor

Configuration

Memory population

Memory population
information

Single processor

Optimizer (Independent
channel) population order

A{1}, A{2}, A{3}, A{4}, A{5}, A{6},
A{7}, A{8}1, 2, 4, 6, 8 DIMMs areallowed.

Dual processor (Start withprocessor1. Processor 1
and processor 2 population
should match)

Optimizer (Independent
channel) population order

A{1}, B{1}, A{2}, B{2}, A{3}, B{3}, 2, 4, 8, 12, 16 DIMMs are
A{4}, B{4}, A{5}, B{5}, A{6}, B{6}, supported per system .
A{7}, B{7} A{8}, B{8}NOTE: Optimizer
population order is not
traditional for 8 and 16
DIMMs installations fordual processor.

Memory subsystem

●
●
●
●

Always populate memory channels identically with equal DIMMs for best performance.
Supported RDIMM configurations are 1, 2, 4, 6, and 8 DIMMs per processor.
Supported 96 GB RDIMM configurations are 1, 6 and 8 DIMMs per processor.
Populate eight equal memory modules per processor (one DIMM per channel) at a time to maximize performance.
NOTE: Equal memory modules refer to DIMMs with identical electrical specification and capacity that may be fromdifferent vendors.

Memory subsystem

25

6Storage
Topics:•••Storage controllers
Supported Drives
External Storage

Storage controllers
Dell RAID controller options offer performance improvements, including the fPERC solution. fPERC provides a base RAID HW
controller without consuming a PCIe slot by using a small form factor and high-density connector to the base planar.
16G PERC Controller offerings are a heavy leverage of 15G PERC family. The Value and Value Performance levels carry overto 16G from 15G. New to 16G is the Avenger-based Premium Performance tier offering. This high-end offering drives IOPs
performance and enhanced SSD performance.

Table 18. PERC Series controller offerings
Performance Level

Controller and Description

Entry

S160

Value

H355, HBA465 (internal), HBA355 (internal/external)

Value Performance

H755, H755N

Premium Performance

Avenger 1
Memory: 8GB DDR4 NV cache72-bit memory 2133 MHz
Low profile form factors
Dual A15 1.2 GHz CPU
X8PCIe 3.0, x8 12Gb SAS

NOTE: For more information about the features of the Dell PowerEdge RAID controllers (PERC), Software RAID
controllers, or BOSS card, and on deploying the cards, see the storage controller documentation at Storage Controller
Manuals.
NOTE: From December 2021, H355 replaces H345 as the entry raid controller. H345 is deprecated in January 2022.

Storage controller feature matrix
Table 19. Storage controller feature matrix
Model &
Form
Factors

Interface Support

PCI
SAS
Suppo ConnectionrtCach Write Back
e
Cache
Mem
ory
Size

RAID
LevelsPowerEdge Server-Storage Controllers (PERC) Series 12.2

26

Storage

Max Drive
SupportRAID
SupportTable 19. Storage controller feature matrix (continued)
Model &
Form
Factors

Interface Support

PCI
SAS
Suppo ConnectionrtCach Write Back
e
Cache
Mem
ory
Size

RAID
LevelsMax Drive
SupportRAID
Support

HBA465i
Front

24Gb/s SAS

PCIe
Gen 4

N/A

N/A

16/
controller

N/A

16 ports/lanes- 2x8 Internal

NA

6Gb/s SAS/SATA

50 with SAS
ExpanderPowerEdge Server-Storage Controllers (PERC) Series 12
S160
SoftwareRAID

Gen4 (16 GT/s)
NVMe

PCIe
Gen 4

N/A

No
Cach
e

No Cache

0,1,5,10

8

Software
RAID Windows
onlyPowerEdge Server-Storage Controllers (PERC & SAS HBA) Series 11
H755
Adapter

12Gb/s SAS

PCIe
Gen 4

16 ports- 2x8Internal

8GB
NV

Flash

0,1,5,6,10,50 16/,60controller

Hardware6Gb/s SAS/SATA

Backed3Gb/s SAS/SATACache

50 with SAS
ExpanderFlash

0,1,5,6,10,50 8/ controller Hardware,60

Gen3 (8 GT/s) NVMe
Gen4 (16 GT/s)
NVMe
H755N
Front
(NVMe
Only)

Gen3 (8 GT/s) NVMe PCIe
Gen 4
Gen4 (16 GT/s)
NVMe

16 ports- 2x8Internal

H755 Front( SAS/SATA only)

12Gb/s SAS

PCIe
Gen 4

16 ports- 2x8Internal

HBA355i
Adapter

8GB
NV

Backed
Cache
8GB
NV

Flash

6Gb/s SAS/SATA

Backed3Gb/s SAS/SATA

Cache

12Gb/s SAS

PCIe
Gen 4

16 ports- 2x8Internal

N/A

N/A

0,1,5,6,10,50 16/,60controller
50 with SAS
ExpanderN/A

6Gb/s SAS/SATA

12Gb/s SAS

PCIe
Gen 4

16 ports- 2x8Internal

N/A

N/A

N/A

6Gb/s SAS/SATA

12Gb/s SAS

N/A

16/
controller
50 with SAS
Expander3Gb/s SAS/SATA
HBA355e
Adapter

N/A

16/
controller
50 with SAS
Expander3Gb/s SAS/SATA
HBA355i
Front

Hardware

PCIe
Gen 4

16 ports- 4x4
external

N/A

N/A

N/A

240

N/A

PCIe
Gen 4

16 ports- 2x8Internal

No
Cach
e

No Cache

0,1, 10

Up to 32
RAID, or 32
Non- RAID

Hardware6Gb/s SAS/SATA
3Gb/s SAS/SATA
H355
Adapter

12Gb/s SAS
6Gb/s SAS/SATA

Storage27

Table 19. Storage controller feature matrix (continued)
Model &
Form
Factors

Interface Support

PCI
SAS
Suppo ConnectionrtCach Write Back
e
Cache
Mem
ory
Size

RAID
LevelsMax Drive
SupportRAID
SupportH355 Front

12Gb/s SAS

PCIe
Gen 4

No
Cach
e

0,1, 10

Up to 32
RAID, or 32
Non- RAID

Hardware16 ports- 2x8Internal

6Gb/s SAS/SATANo Cache

NOTE:
1. RAID 5/50 removed from entry RAID card
2. SWRAID support for Linus provides a pre-boot configuration utility to configure MDRAID and degraded boot capability.
3. For information, post-RTS, see the Storage controller documentation at www.dell.com/stroagecontrollermanuals.
This document is updated as changes happen, so for the latest version be sure to bookmark it rather than downloading an
offline copy or refer to the Storage Controller Matrix on sales portal.

Server storage controllers User Guide● Server-Storage Controllers User's Guides, click here

RAID - Redundant Array of Independent Disks● Link to Help Me Choose: RAID Configuration here

Datasheets and PERC performance scaling decks● Resource Page for Server-Storage (Sales Portal) click here
● PERC & SAS HBA Datasheets (To be updated)

Boot Optimized Storage Solution (BOSS)
BOSS is a RAID solution that is designed to boot operating systems and segregate operating system boot drives from data on
server-internal storage.

BOSS feature matrix
Table 20. BOSS feature matrix for 6 x 2.5-inch configuration
BOSS
card

Drive
Size

RAID
levelsStripesize

BOSSN1Monolithic

M.2
devices
are
read-

RAID1
and
RAID0

Support Nonesdefault
64K

28

Storage

Virtualdisk
cachefunctio
n

Maxim
um
numbe
r of
virtual
disks

Maxim
um
numbe
r of
drivessuppor
ted

Drive
types

PCIe
suppor
t

Disk
cache
policySupport for
NonRAID
disks

Crypto Hot
graphi Plugcdigitalsignature toverifyfirmwarepayloa
d

1

2

M.2
NVMe
SSDs

Gen3

Drive
default

No

Yes

Yes

Table 20. BOSS feature matrix for 6 x 2.5-inch configuration
BOSS
card

Drive
Size

RAID
levelsintensiv
e with480 GBor 960GB
capacityStripesize

Virtualdisk
cachefunctio
n

Maxim
um
numbe
r of
virtual
disks

Maxim
um
numbe
r of
drivessuppor
ted

Drive
types

PCIe
suppor
t

Disk
cache
policySupport for
NonRAID
disks

Crypto Hot
graphi Plugcdigitalsignature toverifyfirmwarepayload

stripesize
onlyTable 21. BOSS feature matrix for 4 x 3.5-inch, 8 x 2.5-inch, 10 x 2.5-inch configurations
BOSS
card

Drive
Size

BOSS- M.2
N1
devicesModular are
readintensiv
e with480 GBor 960GB
capacity

RAIDlevelsStripesize

Virtualdisk
cachefunctio
n

RAID1
and
RAID0

Support Nonesdefault
64K
stripe
size
only

Maxim
um
numbe
r of
virtual
disks

Maxim
um
numbe
r of
drivessuppor
ted

Drive
types

PCIe
suppor
t

Disk
cache
policySupport for
NonRAID
disks

Crypto Hot
graphi Plugcdigitalsignature toverifyfirmwarepayloa
d

1

2

M.2
NVMe
SSDs

Gen3

Drive
default

No

Yes

No

BOSS-N1
BOSS-N1 is offered as a means of booting 16G servers to a full OS when the target OS is a full OS (not just a hypervisor), or theuser does not wish to trade off standard hot plug drive slots for OS install.
The HW RAID BOSS-N1 card is a RAID controller with a limited feature set that presents M.2 NVMe-only SSDs as either a
RAID0 disk or a single RAID1 volume with 2 disks. BOSS-N1 enables support for 480/960 GB Disks from Factory Install.
Hardware: BOSS-N1 Controller and Carrier (x2) for 6 x 2.5-inch configuration
Hardware: BOSS-N1 Controller for 4 x 3.5-inch, 8 x 2.5-inch, 10 x 2.5-inch configurations
Reliability: Enterprise-Class M.2 NVMe SSDs
Supports dual 80 mm, Read Intensive (1DWPD), M.2 devices 480 GB/960 GB Standard - 1.92 TB QNS
Accessibility: Front Facing for 6 x 2.5-inch configuration
Serviceability: Full Hot-Plug Support for 6 x 2.5-inch configuration
Accessibility: Internal for 4 x 3.5-inch, 8 x 2.5-inch, 10 x 2.5-inch configurations
Serviceability: Cold-swap for 4 x 3.5-inch, 8 x 2.5-inch, 10 x 2.5-inch configurations

Storage29

Supports Hardware RAID1 and RAID0
Supports UEFI bootMarvell 88NR2241 NVMe RAID Controller
Controlled Firmware Upgrade through iDRAC

Figure 13. BOSS-N1 Controller for 6 x 2.5-inch configuration

Figure 14. BOSS-N1 Controller for 4 x 3.5-inch, 8 x 2.5-inch, 10 x 2.5-inch configurations

Datasheets● BOSS-N1 (to be updated)

BOSS User Guides● BOSS-N1

Supported Drives
The table shown below lists the internal drives supported by the HS5610. Refer to Agile for the latest SDL

Table 22. Supported Drives
Form Factor

Type

Speed

Rotational
Speed

Capacities

2.5 inches

vSAS

12 Gb

SSD

1.92 TB, 3.84 TB, 960 GB, 7.62 TB

2.5 inches

SAS

24 Gb

SSD

1.92 TB, 1.6 TB, 800 GB, 3.84 TB, 960 GB, 7.68 TB

2.5 inches

SATA

6 Gb

SSD

1.92 TB, 480 GB, 960 GB, 3.84 TB

2.5 inches

NVMe

Gen4

SSD

1.6 TB, 3.2 TB, 6.4 TB, 1.92 TB, 3.84 TB, 15.63 TB, 7.68 TB

2.5 inches

DC NVMe

Gen4

SSD

3.84 TB, 960 GB

2.5 inches

SAS

12 Gb

10 K

600 GB, 1.2 TB, 2.4 TB

30

StorageTable 22. Supported Drives (continued)
Form Factor

Type

Speed

Rotational
Speed

Capacities

3.5 inches

SATA

6 Gb

7.2 K

2 TB, 4 TB, 8 TB, 12 TB, 16 TB, 20 TB, 24 TB

3.5 inches

SAS

12 Gb

7.2 K

2 TB, 4 TB, 8 TB, 12 TB, 16 TB, 20 TB, 24 TB

External Storage
The HS5610 support the external storage device types listed in the table below.

Table 23. Support External Storage Devices
Device Type

Description

External Tape

Supports connection to external USB tape products

NAS/IDM appliance software

Supports NAS software stack

JBOD

Supports connection to 12 Gb MD-series JBODs

Storage31

7
Networking
Topics:••Overview
OCP 3.0 support

Overview
PowerEdge offers a wide variety of options to get information moving to and from our servers. Industry best technologies arechosen, and systems management features are added by our partners to firmware to tie in with iDRAC. These adapters are
rigorously validated for worry-free, fully supported use in Dell servers. In addition, HS5610 offers a selection of devices withchannel (original vendor) firmware. These are fully qualified and supported, but offer increased inter-operability in multi-vendor
server fleets.

OCP 3.0 support
Table 24. OCP 3.0 feature list
FeatureOCP 3.0

Form factor

SFF

PCIe Gen

Gen4

Max PCIe widthx8

Max no. of ports

4

Port type

BT/SFP/SFP+/SFP28/SFP56

Max port speed

25 GbE

NC-SI

Yes

WoL

Yes

Power consumption

15 W–35 W

Supported OCP cards
Table 25. Supported OCP cards
Form factor Vendor

Port speed

Port typePort count

OCP 3.0

10 GbEBT

2

25 GbESFP28

2

25 GbE

SFP28

4

1 GbE

BT

4

10 GbE

BT

4

1 GbE

BT

4

Broadcom

Intel

32

Networking

Table 25. Supported OCP cards (continued)
Form factor Vendor

Port speed

Port typePort count

10 GbEBT

2

10 GbEBT

4

25 GbESFP28

2

25 GbESFP28

4OCP NIC 3.0 vs. rack Network Daughter Card comparisons
Table 26. OCP 3.0, 2.0, and rNDC NIC comparison
Form Factor

Dell rNDC

OCP 2.0 (LOM Mezz) OCP 3.0

Notes

PCIe Gen

Gen 3

Gen 3

Gen 4

Supported OCP3 are
SFF (small form factor)

Max PCIe Lanes

x8

Up to x16

Up to x8

See server slot priority
matrixShared LOM

Yes

Yes

Yes

This is iDRAC port
redirect

Aux Power

Yes

Yes

Yes

Used for Shared LOM

Networking

33

8
Slot priority matrix
For add-in cards that can be mapped to the HS5610 and guidelines for installing expansion cards, see the HS5610 slot priority
matrix file on Sales Portal.
Link:https://www.delltechnologies.com/resources/en-us/auth/products/servers/category.htm

Topics:•Expansion card installation guidelines

Expansion card installation guidelines

Figure 15. Expansion card slot connectors
1. Riser 2E cable connector
3. Riser 2 connector
5. Riser 1 connector

2. Riser 2E cable connector
4. BOSS riser connector
6. Riser 1B, 2D cable connector

The following table describes the expansion card riser configurations:34

Slot priority matrix

Table 27. Expansion card riser configurations
Configurations Expansion card PCIe Slots
risersControlling
processor

HeightLengthSlot width

Config0.

No riser

NA

NA

NA

NA

NA

Config1. with 3x
LP

R1a

1

Processor 1

Low Profile

Half length

x16

R2a

2 and 3

Processor 2

Low Profile

Half length

x8 + x8

Config2. with 2x R1a
LP
R2e

1

Processor 1

Low Profile

Half lengthx16

2 (Gen5)

Processor 2

Low Profile

Half lengthx16

Config3. with 1x
LP

R1a

1

Processor 1

Low Profile

Half lengthx16

Config4. with 1xLP

R1a + Reardrives1

Processor 1

Low Profile

Half lengthx16

Config5. with 2x R1a
LP
R2d

1

Processor 1

Low Profile

Half lengthx16

2 (Gen5)

Processor 1

Low Profile

Half lengthx8

Config6. with 2x R1b
LP
R2e

1

Processor 1

Low Profile

Half lengthx8

2

Processor 2

Low Profile

Half lengthx16

Config11. with
2x LP

R1a

1

Processor 1

Low Profile

Half length

x16

R2c

3

Processor 2

Low Profile

Half lengthx16

Config12. with
0x LP

No riser + FLOP

No

NA

NA

NA

NA

Config13. with
2x LP

R1a + FLOP

1

Processor 1

Low Profile

Half length

x16

R2c

3

Processor 2

Low Profile

Half lengthx16

Config14. with
2x LP

R1b + FLOP

1

Processor 1

Low Profile

Half length

x8

R2e

2

Processor 2

Low Profile

Half length

x16

Figure 16. Riser 1aSlot priority matrix

35

Figure 17. Riser 1b
1. Slot 1, x8, LP-HL
2. Signal cable connector

Figure 18. Riser 2a

Figure 19. Riser 2c

36

Slot priority matrix

Figure 20. Riser 2d
1. Signal cable connector
2. Slot 2, x8, LP-HL
3. Power cable connector

Figure 21. Riser 2e
1. Slot 2, x16, LP-HL
3. Signal cable connector

2. Power cable connector
4. Signal cable connector

NOTE: The expansion-card slots are not hot-swappable.
The following table provides guidelines for installing expansion cards to ensure proper cooling and mechanical fit. The expansion
cards with the highest priority should be installed first using the slot priority indicated. All the other expansion cards should beinstalled in the card priority and slot priority order.

Table 28. Configuration 0: No Riser
Card type

Slot priority

Maximum number of cards

Foxconn Front PERC 12/11

Integrated slot

1Intel (OCP: 100Gb)

Integrated slot

1

Mellanox (OCP: 100Gb)

Integrated slot

1

Broadcom (OCP: 25Gb)

Integrated slot

1Intel (OCP: 25Gb)

Integrated slot

1

Broadcom (OCP: 10Gb)

Integrated slot

1

Broadcom (OCP: 1Gb)

Integrated slot

1

Dell BOSS N1 Module

Integrated slot

1

Slot priority matrix

37

Table 29. Configuration 1: R1a+ R2a
Card type

Slot priority

Maximum number of cards

Inventec Serial port module (LP)2

1

Foxconn Front PERC 12/11

Integrated slot

1Intel (OCP: 100Gb)

Integrated slot

1

Mellanox (OCP: 100Gb)

Integrated slot

1

Broadcom (OCP: 25Gb)

Integrated slot

1Intel (OCP: 25Gb)

Integrated slot

1

Broadcom (OCP: 10Gb)

Integrated slot

1

Broadcom (OCP: 1Gb)

Integrated slot

1

Dell BOSS N1 Module

Integrated slot

1

Mellanox (NIC: HDR100 VPI)

1

1

Mellanox (NIC: HDR VPI)

1

1

Mellanox (NIC: 100Gb)

1

1

Broadcom (NIC: 100Gb)

1

1

Intel (NIC: 100Gb)

1

1

Mellanox (NIC: 25Gb)

1

1

Mellanox (NIC: 25Gb)

3, 1, 2

3Intel (NIC: 25Gb)

3, 1, 2

3

Broadcom (HBA: FC64)

3, 1, 2

3

Broadcom (HBA: FC32)

3, 1, 2

3

Qlogic (Marvell) (HBA: FC32)

3, 1, 2

3

Broadcom (NIC: 25Gb)

3, 1, 2

3

Broadcom (NIC: 10Gb)

3, 1, 2

3Intel (NIC: 10Gb)

3, 1, 2

3Intel(NIC: 1Gb)

3, 1, 2

3

Broadcom (NIC: 1Gb)

3, 1, 2

3

Foxconn External PERC Adapter

3, 1, 2

3

Card type

Slot priority

Maximum number of cards

Inventec Serial port module (LP)31

Foxconn Front PERC 12/11

Integrated slot

1Intel (OCP: 100Gb)

Integrated slot

1

Mellanox (OCP: 100Gb)

Integrated slot

1

Broadcom (OCP: 25Gb)

Integrated slot

1Intel (OCP: 25Gb)

Integrated slot

1

Broadcom (OCP: 10Gb)

Integrated slot

1

Broadcom (OCP: 1Gb)

Integrated slot

1

Dell BOSS N1 Module

Integrated slot

1

Table 30. Configuration 2: R1a+R2e

38

Slot priority matrix

Table 30. Configuration 2: R1a+R2e (continued)
Card type

Slot priority

Maximum number of cards

Mellanox (NIC: NDR100)

2

1

Mellanox (NIC: NDR200)

2

1

Mellanox (NIC: HDR100 VPI)

2,1

2

Mellanox (NIC: HDR VPI)

2,1

2

Mellanox (NIC: 100Gb)

2,1

2

Broadcom (NIC: 100Gb)

2,1

2Intel (NIC: 100Gb)

2,1

2

Mellanox (NIC: 25Gb)

2,1

2Intel (NIC: 25Gb)

2,1

2

Broadcom (HBA: FC64)

2,1

2

Broadcom (HBA: FC32)

2,1

2

Qlogic (Marvell) (HBA: FC32)

2,1

2

Broadcom (NIC: 25Gb)

2,1

2

Broadcom (NIC: 10Gb)

2,1

2Intel (NIC: 10Gb)

2,1

2Intel(NIC: 1Gb)

2,1

2

Broadcom (NIC: 1Gb)2,12

Foxconn External PERC Adapter

2,12

Card type

Slot priority

Maximum number of cards

Inventec Serial port module (LP)1

1

Foxconn Front PERC 12/11

Integrated slot

1Intel (OCP: 100Gb)

Integrated slot

1

Mellanox (OCP: 100Gb)

Integrated slot

1

Broadcom (OCP: 25Gb)

Integrated slot

1Intel (OCP: 25Gb)

Integrated slot

1

Broadcom (OCP: 10Gb)

Integrated slot

1

Broadcom (OCP: 1Gb)

Integrated slot

1

Dell BOSS N1 Module

Integrated slot

1

Mellanox (NIC: HDR100 VPI)

1

1

Mellanox (NIC: HDR VPI)

1

1

Mellanox (NIC: 100Gb)

1

1

Broadcom (NIC: 100Gb)

1

1

Intel (NIC: 100Gb)

1

1

Mellanox (NIC: 25Gb)

1

1Intel (NIC: 25Gb)

1

1

Broadcom (HBA: FC64)

1

1

Table 31. Configuration 3: R1aSlot priority matrix

39

Table 31. Configuration 3: R1a (continued)
Card type

Slot priority

Maximum number of cards

Broadcom (HBA: FC32)

1

1

Qlogic (Marvell) (HBA: FC32)

1

1

Broadcom (NIC: 25Gb)

1

1

Broadcom (NIC: 10Gb)

1

1Intel (NIC: 10Gb)

1

1Intel(NIC: 1Gb)

1

1Broadcom (NIC: 1Gb)

1

1

Foxconn External PERC Adapter

1

1

Table 32. Configuration 4: R1a+Rear drives
Card type

Slot priority

Maximum number of cards

Inventec Serial port module (LP)1

1

Foxconn Front PERC 12/11

Integrated slot

1Intel (OCP: 100Gb)

Integrated slot

1

Mellanox (OCP: 100Gb)

Integrated slot

1

Broadcom (OCP: 25Gb)

Integrated slot

1Intel (OCP: 25Gb)

Integrated slot

1

Broadcom (OCP: 10Gb)

Integrated slot

1

Broadcom (OCP: 1Gb)

Integrated slot

1

Dell BOSS N1 Module

Integrated slot

1

Mellanox (NIC: HDR100 VPI)

1

1

Mellanox (NIC: HDR VPI)

1

1

Mellanox (NIC: 100Gb)

1

1

Broadcom (NIC: 100Gb)

1

1

Intel (NIC: 100Gb)

1

1

Mellanox (NIC: 25Gb)

1

1Intel (NIC: 25Gb)

1

1

Broadcom (HBA: FC64)

1

1

Broadcom (HBA: FC32)

1

1

Qlogic (Marvell) (HBA: FC32)

1

1

Broadcom (NIC: 25Gb)

1

1

Broadcom (NIC: 10Gb)

1

1Intel (NIC: 10Gb)

1

1Intel(NIC: 1Gb)

1

1Broadcom (NIC: 1Gb)

1

1

Foxconn External PERC Adapter

1

1

40

Slot priority matrix

Table 33. Configuration 5: R1a+R2d
Card type

Slot priority

Maximum number of cards

Inventec Serial port module (LP)31

Foxconn Front PERC 12/11

Integrated slot

1Intel (OCP: 100Gb)

Integrated slot

1

Mellanox (OCP: 100Gb)

Integrated slot

1

Broadcom (OCP: 25Gb)

Integrated slot

1Intel (OCP: 25Gb)

Integrated slot

1

Broadcom (OCP: 10Gb)

Integrated slot

1

Broadcom (OCP: 1Gb)

Integrated slot

1

Dell BOSS N1 Module

Integrated slot

1

Mellanox (NIC: HDR100 VPI)

1

1

Mellanox (NIC: HDR VPI)

1

1

Mellanox (NIC: 100Gb)

1

1

Broadcom (NIC: 100Gb)

1

1

Intel (NIC: 100Gb)

1

1

Mellanox (NIC: 25Gb)

1

1

Mellanox (NIC: 25Gb)

2,1

2Intel (NIC: 25Gb)

2,1

2

Broadcom (HBA: FC64)

2,1

2

Broadcom (HBA: FC32)

2,1

2

Qlogic (Marvell) (HBA: FC32)

2,1

2

Broadcom (NIC: 25Gb)

2,1

2

Broadcom (NIC: 10Gb)

2,1

2Intel (NIC: 10Gb)

2,1

2Intel(NIC: 1Gb)

2,1

2

Broadcom (NIC: 1Gb)2,12

Foxconn External PERC Adapter

2,12

Card type

Slot priority

Maximum number of cards

Inventec Serial port module (LP)31

Foxconn Front PERC 12/11

Integrated slot

1Intel (OCP: 100Gb)

Integrated slot

1

Mellanox (OCP: 100Gb)

Integrated slot

1

Broadcom (OCP: 25Gb)

Integrated slot

1Intel (OCP: 25Gb)

Integrated slot

1

Broadcom (OCP: 10Gb)

Integrated slot

1

Broadcom (OCP: 1Gb)

Integrated slot

1

Dell BOSS N1 Module

Integrated slot

1

Table 34. Configuration 6: R1b+R2e

Slot priority matrix

41

Table 34. Configuration 6: R1b+R2e (continued)
Card type

Slot priority

Maximum number of cards

Mellanox (NIC: NDR100)

2

1

Mellanox (NIC: NDR200)

2

1

Mellanox (NIC: HDR100 VPI)

2

1

Mellanox (NIC: HDR VPI)

2

1

Mellanox (NIC: 100Gb)

2

1

Broadcom (NIC: 100Gb)

2

1

Intel (NIC: 100Gb)

2

1

Mellanox (NIC: 25Gb)

2

1

Mellanox (NIC: 25Gb)

2,1

2Intel (NIC: 25Gb)

2,1

2

Broadcom (HBA: FC64)

2,1

2

Broadcom (HBA: FC32)

2,1

2

Qlogic (Marvell) (HBA: FC32)

2,1

2

Broadcom (NIC: 25Gb)

2,1

2

Broadcom (NIC: 10Gb)

2,1

2Intel (NIC: 10Gb)

2,1

2Intel(NIC: 1Gb)

2,1

2

Broadcom (NIC: 1Gb)2,12

Foxconn External PERC Adapter

2,12

Card type

Slot priority

Maximum number of cards

Inventec Serial port module (LP)2

1

Foxconn Front PERC 12/11

Integrated slot

1Intel (OCP: 100Gb)

Integrated slot

1

Mellanox (OCP: 100Gb)

Integrated slot

1

Broadcom (OCP: 25Gb)

Integrated slot

1Intel (OCP: 25Gb)

Integrated slot

1

Broadcom (OCP: 10Gb)

Integrated slot

1

Broadcom (OCP: 1Gb)

Integrated slot

1

Dell BOSS N1 Module

Integrated slot

1

Mellanox (NIC: HDR100 VPI)

3,1

2

Mellanox (NIC: HDR VPI)

3,1

2

Mellanox (NIC: 100Gb)

3,1

2

Broadcom (NIC: 100Gb)

3,1

2Intel (NIC: 100Gb)

3,1

2

Mellanox (NIC: 25Gb)

3,1

2Intel (NIC: 25Gb)

3,1

2

Table 35. Configuration 11: R1a+R2c

42

Slot priority matrix

Table 35. Configuration 11: R1a+R2c (continued)
Card type

Slot priority

Maximum number of cards

Broadcom (HBA: FC64)

3,1

2

Broadcom (HBA: FC32)

3,1

2

Qlogic (Marvell) (HBA: FC32)

3,1

2

Broadcom (NIC: 25Gb)

3,1

2

Broadcom (NIC: 10Gb)

3,1

2

Intel (NIC: 10Gb)

3,1

2

Intel(NIC: 1Gb)

2,1

2

Broadcom (NIC: 1Gb)2,12

Foxconn External PERC Adapter

2,1

2

Table 36. Configuration 12: No Riser + FLOP
Card type

Slot priority

Maximum number of cards

Foxconn Front PERC 12/11

Integrated slot

1Intel (OCP: 100Gb)

F2, F1

2

Mellanox (OCP: 100Gb)

F2, F1

2

Broadcom (OCP: 25Gb)

F2, F1

2Intel (OCP: 25Gb)

F2, F1

2

Broadcom (OCP: 10Gb)

F2, F1

2

Broadcom (OCP: 1Gb)

F2, F1

2

Dell BOSS N1 Module

Integrated slot

2

Table 37. Configuration 13: R1a+R2c+FLOP
Card type

Slot priority

Maximum number of cards

Foxconn Front PERC 12/11

Integrated slot

1Intel (OCP: 100Gb)

F2, F1

2

Mellanox (OCP: 100Gb)

F2, F1

2

Broadcom (OCP: 25Gb)

F2, F1

2Intel (OCP: 25Gb)

F2, F1

2

Broadcom (OCP: 10Gb)

F2, F1

2

Broadcom (OCP: 1Gb)

F2, F1

2

Dell BOSS N1 Module

Integrated slot

2

Mellanox (NIC: HDR100 VPI)

3,1

2

Mellanox (NIC: HDR VPI)

3,1

2

Mellanox (NIC: 100Gb)

3,1

2

Broadcom (NIC: 100Gb)

3,1

2Intel (NIC: 100Gb)

3,1

2

Mellanox (NIC: 25Gb)

3,1

2Intel (NIC: 25Gb)

3,1

2

Broadcom (HBA: FC64)

3,1

2

Slot priority matrix

43

Table 37. Configuration 13: R1a+R2c+FLOP (continued)
Card type

Slot priority

Maximum number of cards

Broadcom (HBA: FC32)

3,1

2

Qlogic (Marvell) (HBA: FC32)

3,1

2

Broadcom (NIC: 25Gb)

3,1

2

Broadcom (NIC: 10Gb)

3,1

2

Intel (NIC: 10Gb)

3,1

2

Intel(NIC: 1Gb)

2,1

2

Broadcom (NIC: 1Gb)2,12

Foxconn External PERC Adapter

2,1

2

Table 38. Configuration 14: R1b+R2e+FLOP
Card type

Slot priority

Maximum number of cards

Foxconn Front PERC 12/11

Integrated slot

1Intel (OCP: 100Gb)

F2, F1

2

Mellanox (OCP: 100Gb)

F2, F1

2

Broadcom (OCP: 25Gb)

F2, F1

2Intel (OCP: 25Gb)

F2, F1

2

Broadcom (OCP: 10Gb)

F2, F1

2

Broadcom (OCP: 1Gb)

F2, F1

2

Dell BOSS N1 Module

Integrated slot

2

Mellanox (NIC: NDR100)

2

1

Mellanox (NIC: NDR200)

2

1

Mellanox (NIC: HDR100 VPI)

2

1

Mellanox (NIC: HDR VPI)

2

1

Mellanox (NIC: 100Gb)

2

1

Broadcom (NIC: 100Gb)

2

1

Intel (NIC: 100Gb)

2

1

Mellanox (NIC: 25Gb)

2

1

Mellanox (NIC: 25Gb)

2,1

2Intel (NIC: 25Gb)

2,1

2

Broadcom (HBA: FC64)

2,1

2

Broadcom (HBA: FC32)

2,1

2

Qlogic (Marvell) (HBA: FC32)

2,1

2

Broadcom (NIC: 25Gb)

2,1

2

Broadcom (NIC: 10Gb)

2,1

2Intel (NIC: 10Gb)

2,1

2Intel(NIC: 1Gb)

2,1

2

Broadcom (NIC: 1Gb)2,12

Foxconn External PERC Adapter

2,1

2

44

Slot priority matrix

9Power, thermal, and acoustics
PowerEdge servers have an extensive collection of sensors that automatically track thermal activity, which helps to regulate
temperature by reducing server noise and power consumption. The table below lists the tools and technologies Dell offers tolower power consumption and increase energy efficiency.

Topics:
•
•
•

Power
ThermalAcoustics

Power
Table 39. Power tools and technologies
FeatureDescription

Power Supply Units(PSU)
portfolio

Dell's PSU portfolio includes intelligent features such as dynamically optimizing efficiency while
maintaining availability and redundancy. Find additional information in the Power supply units
section.

Tools for right sizing

Enterprise Infrastructure Planning Tool (EIPT) is a tool that can help you determine the mostefficient configuration possible. With Dell's EIPT, you can calculate the power consumptionof your hardware, power infrastructure, and storage at a given workload. Learn more atwww.dell.com/calc.

Industry Compliance

Dell's servers are compliant with all relevant industry certifications and guide lines, including 80
PLUS, Climate Savers and ENERGY STAR.

Power monitoring accuracy

PSU power monitoring improvements include:● Dell's power monitoring accuracy is currently 1%, whereas the industry standard is 5%● More accurate reporting of power● Better performance under a power cap

Power capping

Use Dell's systems management to set the power cap limit for your systems to limit the output
of a PSU and reduce system power consumption. Dell is the first hardware vendor to leverageIntel Node Manager for circuit-breaker fast capping.

Systems Management

iDRAC Enterprise and Datacenter provides server-level management that monitors, reports andcontrols power consumption at the processor, memory and system level.
Dell OpenManage Power Center delivers group power management at the rack, row, and data
center level for servers, power distribution units, and uninterruptible power supplies.

Active power management

Intel Node Manager is an embedded technology that provides individual server-level power
reporting and power limiting functionality. Dell offers a complete power management solution
comprised of Intel Node Manager accessed through Dell iDRAC9 Datacenter and OpenManage
Power Center that allows policy-based management of power and thermal at the individual
server, rack, and data center level. Hot spare reduces power consumption of redundant power
supplies. Thermal control off a speed optimizes the thermal settings for your environment to
reduce fan consumption and lower system power consumption.
Idle power enables Dell servers to run as efficiently when idle as when at full workload.

Rack infrastructure

Dell offers some of the industry's highest-efficiency power infrastructure solutions, including:Power, thermal, and acoustics

45

Table 39. Power tools and technologies (continued)
FeatureDescription● Power distribution units (PDUs)● Uninterruptible power supplies (UPSs)● Energy Smart containment rack enclosures
Find additional information at: https://www.delltechnologies.com/en-us/servers/power-andcooling.htm.

PSU specifications
The PowerEdge HS5610 system supports up to two AC or DC power supply units (PSUs).

Table 40. HS5610 PSU specifications
PSU

Class

700 W
mixed
mode
HLAC

Titanium

Heat
Frequ AC Voltage
dissipati encyon(Hz) 100–120 200–240
VV(maximum)(BTU/hr)
2625

N/A

800 W
mixed
mode

Platinum

3000

1100 W-48 V DC

N/A

4265

1100 W
mixed
mode

Titanium

4125

1400 W
mixed
mode

Titanium

1400 W
mixed
mode

Platin
um

N/A

N/A

N/A

336 V

- (48 V
— 60 V)

N/A

N/A

N/A

N/A

4.1 A

N/A

N/A

N/A

N/A

700 W

N/A

N/A

3.4 A

800 W

800 W

N/A

N/A

N/A

N/A

9.2 A - 4.7
A

N/A

N/A

N/A

800 W

N/A

N/A

3.8 A

N/A

N/A

N/A

N/A

N/A

1100 W

27 A

1050 W

1100 W

N/A

N/A

N/A

N/A

12 A - 6.3 A

N/A

N/A

N/A

1100 W

N/A

N/A

5.2 A

1050 W

1400 W

N/A

N/A

N/A

N/A

12 A - 8 A

N/A

N/A

N/A

1400 W

N/A

N/A

6.5 A

1050 W

1400 W

N/A

N/A

N/A

N/A

12 A - 8 A

N/A

N/A

N/A

1400 W

N/A

N/A

6.6 A

50/60

N/A
50/60

50/60
N/A

5250

240 V

700 W

N/A
5250

277 V

Current(A)

50/60 N/A

N/A

N/A

DC Voltage

50/60
N/A

1400 W
Titani
277 V AC um
and HVDC

5250

50/60 N/A

N/A

1400 W

N/A

N/A

N/A

5.8 A

5250

N/A

N/A

N/A

N/A

N/A

1400 W

N/A

5.17 A

1800 W
mixed
mode
HLAC

6610

50/60 N/A

1800 W

N/A

N/A

N/A

N/A

10 A

N/A

N/A

N/A

1800 W

N/A

N/A

8.2 A

Titanium
N/A

N/A

NOTE: Heat dissipation is calculated using the PSU wattage rating.
NOTE: HLAC stands for High-Line AC, with a range of 200 - 240V AC. HVDC stands for High-Voltage DC, with 336V DC.
NOTE: When selecting or upgrading the system configuration, to ensure optimum power utilization, verify the system
power consumption with the Enterprise Infrastructure Planning Tool available at calc.

46

Power, thermal, and acoustics

Figure 22. PSU power cords

Figure 23. APP 2006G1 power cord

Figure 24. Lotes DC PSU connector

Table 41. PSU power cords
Form factor

OutputPower cord

Redundant 60 mm

700 W Mixed Mode HLAC

C13800 W Mixed Mode

C131100 W Mixed Mode

C131100 W -48 V DC

Lotes DC PSU connector

1400 W Mixed Mode

C13

1400 W 277 VAC and HVDC

APP 2006G1

1800 W Mixed Mode HLAC

C15

NOTE: C13 power cord combined with C14 to C15 jumper power cord can be used to adapt 1800 W PSU.

ThermalPowerEdge servers have an extensive collection of sensors that automatically track thermal activity, which helps regulate
temperature thereby reducing server noise and power consumption.

Power, thermal, and acoustics

47

Acoustics
Acoustical configurations
Dell Cloud Server Provider HS5610 is a rack-mount server appropriate for attended data center environment. However, lower
acoustical output is attainable with proper hardware or software configurations.

Table 42. Configurations tested for acoustical experience
Configuration

Quiet

VOLUME 1 - 2.5-inch

VOLUME 2 - 3.5-inch with
Rear Storage

CPU TypeIntel Sapphire Rapids

Intel Sapphire Rapids

Intel Sapphire Rapids

CPU TDP125 W / 8C

185 W / 16C

185 W / 16C

CPU Quantity

1

2

2

RDIMM Memory

16 GB DDR5

16 GB DDR5

32 GB DDR5

Memory Quantity

2

16

16

Backplane Type8 x 2.5-inch BP for iDRAC

10 x 2.5-inch BP

4 x 3.5-inch BP

10 x 2.5-inch BP for OSM
HDD Type

2.5" SAS 600G

NVMe 1.6T

3.5-inch SATA 12T+NVMe
1.6T rear

HDD Quantity

2

8

4+2

PSU Type

600 W

800 W

1400 WPSU Quantity

1

2

2

M.2

X

BOSS-N1

BOSS-N1

OCP

OCP(3.0)-4 port NIC
Card(1G) for iDRAC

Dual Port 10GbE

Dual Port 25GbE

NA for OSM
PCI 1

X

LP 25Gb 2-port Networking
card

LP 25Gb 2-port Networking
card

PCI 2

X

LP 25Gb 2-port Networking
card

X

Front PERC

HBA355I

X

H755

LOM Card

X

X

X

PERC

X

X

X

Table 43. Acoustical experience of HS5610 (iDRAC) configurations
Configuration

Quiet

VOLUME 1 - 2.5inch

VOLUME 2 - 3.5inchwith Rear Storage

Acoustical Performance: Idle/ Operating @ 25°C Ambient
L wA,m (B)K v (B)

L pA,m (dB)48

Idle (4)

4.8

6.2

6.1

Operating (5)

4.9

6.2

6.2

Idle (4)

0.4

0.4

0.4

Operating (5)

0.4

0.4

0.4

Idle (4)

32

46

45

Operating (5)

33

46

44

Power, thermal, and acoustics

Table 43. Acoustical experience of HS5610 (iDRAC) configurations (continued)
Configuration

Quiet

VOLUME 1 - 2.5inch

Prominent tones

No prominent tones in Idle and Operating

VOLUME 2 - 3.5inchwith Rear Storage

Acoustical Performance: Idle @ 28°C Ambient
L wA,m (1) (B)

4.9

6.5

6.4

K v (B)

0.4

0.4

0.4

L pA,m (2) (dB)

33

48

47

Acoustical Performance: Max. loading @ 35°C Ambient
L wA,m (1) (B)

6.3

7.6

7.3

K v (B)

0.4

0.4

0.4

L pA,m (2) (dB)

47

59

57

VOLUME 1 - 2.5inch

VOLUME 2 - 3.5-inchwith Rear Storage

Table 44. Acoustical experience of HS5610 (OSM) configurations
Configuration

Quiet

Acoustical Performance: Idle/ Operating @ 25°C Ambient
L wA,m (B)K v (B)

L pA,m (dB)

Idle (4)

6

7.4

7.5

Operating (5)

6.1

7.4

7.5

Idle (4)

0.4

0.4

0.4

Operating (5)

0.4

0.4

0.4

Idle (4)

43

58

58

Operating (5)

45

58

58

Prominent tones

No prominent tones in Idle and Operating

Acoustical Performance: Idle @ 28°C Ambient
L wA,m (1) (B)

6.3

7.5

7.7

K v (B)

0.4

0.4

0.4

L pA,m (2) (dB)

48

60

60

Acoustical Performance: Max. loading @ 35°C Ambient
L wA,m (1) (B)

7

8

7.9

K v (B)

0.4

0.4

0.4

L pA,m (2) (dB)

53

64

64

(1) LwA,m: The declared mean A-weighted sound power level (LwA) is calculated per section 5.2 of ISO 9296 (2017) with datacollected using the methods that are described in ISO 7779 (2010). Engineering data presented here may not be fully compliant
with ISO 7779 declaration requirement.
(2) LpA,m: The declared mean A-weighted emission sound pressure level is at the bystander position per section 5.3 of ISO 9296

(2017) and measured using methods that are described in ISO 7779 (2010). The system is placed in a 24U rack enclosure, 25 cm
above a reflective floor. Engineering data presented here may not be fully compliant with ISO 7779 declaration requirement.
(3) Prominent tones: Criteria of Annex D of ECMA-74 and Prominence Ratio method of ECMA-418 are followed to determine if

discrete tones are prominent and to report them, if so.
(4) Idle mode: The steady-state condition in which the server is energized but not operating any intended function.
(5) Operating mode: The maximum of the steady state acoustical output at 50% of CPU TDP or active storage drives for therespective sections of Annex C of ECMA-74.

Power, thermal, and acoustics

49

10
Rack, rails, and cable management
Topics:••••Rails information
Cable Management Arm
Strain Relief Bar
Rack Installation

Rails information
The rail offerings for the HS5610 consist of two general types: sliding and static. The cable management offerings consist of an
optional cable management arm (CMA) and an strain relief bar (SRB).
For the HS5610 CSP Cold -Asile Service Configuration, there is also a Blind Mate Power (Static) Rail Kit, which is notcompatible with any cable management offerings.
See the Dell Enterprise Systems Rail Sizing and Rack Compatibility Matrix available at rail-rack-matrix for information regarding:●●●●Specific details about rail types.
Rail adjustability ranges for various rack mounting flange types
Rail depth with and without cable management accessories
Rack types that are supported for various rack mounting flange types

Key factors governing proper rail selection include the following:● Identifying the type of rack in which they will be installed.
● The spacing between the front and rear mounting flanges of the rack.
● The type and location of any equipment mounted in the back of the rack such as power distribution units (PDUs), and theoverall depth of the rack
● Overall depth of the rack

A11 Sliding Rails features summary
The sliding rails allow the system to be fully extended out of the rack for service. The sliding rails have a Cable Management Arm(CMA) and a Strain Relief Bar (SRB) option.
There are one types of sliding rails available:● Stab-in/Drop-in sliding rails

A11 Stab-in/Drop-in sliding rails for 4-post racks● Supports Drop-in or Stab-in installation of the chassis to the rails● Supports tool-less installation in 19-inch EIA-310-E compliant square, unthreaded round hole racks including all generations ofDell racks.
Also supports tool-less installation in threaded round hole 4-post racks● Support for tool-less installation in Dell Titan or Titan-D racks● Supports full extension of the system out of the rack to allow serviceability of key internal components●
NOTE: For situations where CMA support is not required, the outer CMA mounting brackets can be uninstalled fromthe sliding rails. This reduces the overall length of the rails and eliminates the potential interferences with rear mounted
PDUs or the rear rack door.
Supports optional Cable Management Arm (CMA)

50

Rack, rails, and cable management

● Supports optional Strain Relief Bar (SRB)NOTE: Scan the QRL code for the documentation and troubleshooting information regarding the installation procedures for
Drop-in/Stab-in rail types.

Figure 25. Quick resource locator for combo rails

A8 Static Rails features summary
The static rails, which are shown in the figure below, support a wider variety of racks than the sliding rails, but do not support
serviceability in the rack. The static rails are not compatible with the CMA and SRB.
● Supports Stab-in installation of the chassis to the rails● Supports tool-less installation in 19-inch EIA-310-E compliant square or unthreaded round hole 4-post racks including all
generations of Dell racks● Supports tooled installation in 19-inch EIA-310-E compliant threaded hole 4-post and 2-post racks● Supports tooled installation in Dell Titan or Titan-D rack
NOTE:
● Screws are not included with the static rail kit since racks are offered with various thread types.
● Screw head diameter should be 10mm or less.

Figure 26. Static rails
2-Post racks installation
If installing to 2-Post (Telco) racks, the ReadyRails II static rails (A8) must be used. Sliding rails support mounting in 4-post
racks only.

Rack, rails, and cable management

51

Figure 27. Static rails in 2-post center mount configuration
Installation in the Dell Titan or Titan-D racks
For tool-less installation in Titan or Titan-D racks, the Stab-in/Drop-in sliding rails (A11) must be used. This rail collapses down
sufficiently to fit in the rack with mounting flanges that are spaced about 24 inches apart from front to back. The Stab-in/
Drop-in sliding rail allows bezels of the servers and storage systems to be aligned when installed in these racks. For tooled
installation, Stab-in Static rails (A8) must be used for bezel alignment with storage systems.

A22 Blind Mate Power Rail features summary
These rails are compatible with the HS5610 CSP Cold-Aisle-Service Configuration.
The Blind mate Power Rails are Static Rail which include extra power pass-thru, bracket assemblies to allow for the ability
to connect power, and then remove/service the HS5610 CSP, without needing Hot-Aisle access. These rails do not allow for
hot-swapping of internal components or in-rack serviceability, and are not compatible with SRB.
● Supports Stab-in installation of the chassis to the rails● Supports tool-less installation in 19-inch EIA-310-E compliant square or unthreaded round hole 4-post racks including all
generations of Dell racks● Supports tooled installation in 19-inch EIA-310-E compliant threaded hole 4-post and 2-post racks● Supports tooled installation in Dell Titan or Titan-D rack
NOTE:
● Screws are not included with the static rail kit since racks are offered with various thread types.
● Screw head diameter should be 10mm or less.

52

Rack, rails, and cable management

Figure 28. Blind Mate Rails, Rack cabinet members setup

A22 Blind Mate Power Rail Power Pass-Thru Setup
The Blind Mate Power Rails require extra setup to enable the blind mate ability and cold-aisle serviceability, by installing 2 powerpass-thru brackets.
The "inner" bracket will be installed behind the rear of the server, attached to the rail chassis members, and the cable
sub-assembly will be plugged into the server PSUs as shown below:

Rack, rails, and cable management

53Figure 29. Inner rail installation
The "outer" bracket will be installed to the rail cabinet members, in the rack, after the individual cabinet members have been
installed. Users will plug live power to the rear cable assembly, just as they would to the server in the standard setups, as shown
below:

54

Rack, rails, and cable management

Figure 30. Outer rail installation
Installation of the server will follow the traditional Stab-in process, where the pass-thru brackets and connectors will mate as
the server rack ears meet the front rack flange. Visual Indicators are present to identify Blind Mate Power setups from the Cold
Aisle.

A22 Blind mate installation steps
WARNING: Whenever you need to lift the system, get others to assist you. To avoid injury, do not attempt to lift
the system by yourself. Get others to assist you or use a mechanical lift.
NOTE: Begin installing the rails in the allotted space that is closest to the bottom of the rack enclosure.

Rack, rails, and cable management55

Cable Management Arm
The optional Cable Management Arm (CMA) for the system organizes and secures the cords and cables exiting the back of theserver and unfolds to allow the server to extend out of the rack without having to detach the cables.
Some key features of the CMA include:
●
●
●
●
●
●

Large U-shaped baskets to support dense cable loads
Open vent pattern for optimal airflow
Support for mounting on either side by swinging the spring-loaded brackets from one side to the otherUtilizes hook-and-loop straps rather than plastic tie wraps to eliminate the risk of cable damage during cycling
Includes a low-profile fixed tray to both support and retain the CMA in its fully closed position
Both the CMA and the tray mount without the use of tools through simple and intuitive snap-in designs

The CMA can be mounted to either side of the sliding rails without the use of tools or the need for conversion. For systems
with one power supply unit (PSU), it is recommended to mount on the side opposite to that of the power supply to allow easieraccess to it and the rear drives (if applicable) for service or replacement.

Figure 31. Cable Management Arm

Strain Relief Bar
The optional strain relief bar (SRB) for the HS5610 organizes and supports cable connections at the rear end of the server toavoid damage from bending.

Figure 32. Cabled strain relief bar

56

Rack, rails, and cable management

Sliding rails with optional SRB:●●●●

Support tool-less attachment to rails
Support two depth positions to accommodate various cable loads and rack depths
Support cable loads and controls stress on server connectors
Support cables can be segregated into discrete, purpose-specific bundles

Rack Installation
Drop-in design means that the system is installed vertically into the rails by inserting the standoffs on the sides of the system
into the J-slots in the inner rail members with the rails in the fully extended position. The recommended method of installation
is to first insert the rear standoffs on the system into the rear J-slots on the rails to free up a hand and then rotate the systemdown into the remaining J-slots while using the free hand to hold the rail against the side of the system.
Stab-in design means that the inner (chassis) rail members must first be attached to the sides of the system and then inserted
into the outer (cabinet) members installed in the rack.

Installing system into the rack (option A: Drop-In)
1. Pull the inner rails out of the rack until they lock into place.

Figure 33. Pull out inner rail
2. Locate the rear rail standoff on each side of the system and lower them into the rear J-slots on the slide assemblies.
3. Rotate the system downward until all the rail standoffs are seated in the J-slots.

Rack, rails, and cable management

57

Figure 34. Rail standoffs seated in J-slots
4. Push the system inward until the lock levers click into place.
5. Pull the blue side release lock tabs forward or backward on both rails and slide the system into the rack until the system is in
the rack.

Figure 35. Slide system into the rackInstalling the system into the rack (option B: Stab-In)
1. Pull the intermediate rails out of the rack until they lock into place.
2. Release the inner rail lock by pulling forward on the white tabs and sliding the inner rail out of the intermediate rails.

58

Rack, rails, and cable management

Figure 36. Pull out the intermediate rail

Table 45. Rail component label
NumberComponent

1

Intermediate rail

2

Inner rail

3. Attach the inner rails to the sides of the system by aligning the J-slots on the rail with the standoffs on the system andsliding forward on the system until they lock into place.

Figure 37. Attach the inner rails to the system
4. With the intermediate rails extended, install the system into the extended rails.

Rack, rails, and cable management

59Figure 38. Install system into the extended rails
5. Pull blue slide release lock tabs forward or backward on both rails, and slide the system into the rack.

Figure 39. Slide system into the rack60

Rack, rails, and cable management

11
Supported operating systems
The PowerEdge HS5610 system supports the following operating systems:
●
●
●
●
●

Canonical Ubuntu Server LTS
Microsoft Windows Server with Hyper-V
Red Hat Enterprise LinuxSUSE Linux Enterprise Server
VMware vSAN/ESXi

For more information, go to Operating System Manuals.

Supported operating systems

61

12Dell Systems Management
Dell delivers management solutions that help IT administrators effectively deploy, update, monitor, and manage IT assets. Dellsolutions and tools enable you to quickly respond to problems by helping them to manage Dell servers efficiently; in physical,
virtual, local, and remote environments; all without the need to install an agent in the operating system.

Topics:•••Integrated Dell Remote Access Controller (iDRAC)
Systems Management software support matrix
Getting started with Dell Open Server Manager (OSM)

Integrated Dell Remote Access Controller (iDRAC)
iDRAC9 delivers advanced, agent-free, local and remote server administration. Embedded in every PowerEdge server, iDRAC9
provides a secure means to automate a multitude of common management tasks. Because iDRAC is embedded within every
PowerEdge server, there is no additional software to install; just plug in power and network cables, and iDRAC is ready to go.
Even before installing an operating system (operating system) or hypervisor, IT administrators have a complete set of server
management features at their fingertips.
With iDRAC9 in-place across the Dell PowerEdge portfolio, the same IT administration techniques and tools can be applied
throughout. This consistent management platform allows easy scaling of PowerEdge servers as an organization's infrastructure
grows. Customers can use the iDRAC RESTful API for the latest in scalable administration methods of PowerEdge servers. With
this API, iDRAC enables support for the Redfish standard and enhances it with Dell extensions to optimize at-scale managementof PowerEdge servers. By having iDRAC at the core, the entire OpenManage portfolio of Systems Management tools allows
every customer to tailor an effective, affordable solution for any size environment.
Zero Touch Provisioning (ZTP) is embedded in iDRAC. ZTP - Zero Touch Provisioning is Intelligent Automation Dell's agent-freemanagement puts IT administrators in control. Once a PowerEdge server is connected to power and networking, that system
can be monitored and fully managed, whether you're standing in front of the server or remotely over a network. In fact,with no need for software agents, an IT administrator can: • Monitor • Manage • Update • Troubleshoot and remediate Dell
servers With features like zero-touch deployment and provisioning, iDRAC Group Manager, and System Lockdown, iDRAC9 is
purpose-built to make server administration quick and easy. For those customers whose existing management platform utilizes
in-band management, Dell does provide iDRAC Service Module, a lightweight service that can interact with both iDRAC9 andthe host operating system to support legacy management platforms.
When ordered with DHCP enabled from the factory, PowerEdge servers can be automatically configured when they are
initially powered up and connected to your network. This process uses profile-based configurations that ensure each server isconfigured per your specifications. This feature requires an iDRAC Enterprise license.
iDRAC9 offers following license tiers:

Table 46. iDRAC9 license tiers
LicenseDescription

iDRAC9 Basic● Available only on 100-500 series rack/tower● Basic instrumentation with iDRAC web UI● For cost conscious customers that see limited value in management

iDRAC9
Express● Default on 600+ series rack/tower, modular, and XR series● Includes all features of Basic● Expanded remote management and server life-cycle features

iDRAC9Enterprise● Available as an upsell on all servers● Includes all features of Basic and Express. Includes key features such as virtual console, AD/LDAP
support, and more
● Remote presence features with advanced, Enterprise-class, management capabilities

62

Dell Systems Management

Table 46. iDRAC9 license tiers (continued)
LicenseDescription

iDRAC9
Datacenter● Available as an upsell on all servers● Includes all features of Basic, Express, and Enterprise. Includes key features such as telemetry streaming,
Thermal Manage, automated certificate management, and more
● Extended remote insight into server details, focused on high end server options, granular power, andthermal management

For a full list of iDRAC features by license tier, see Integrated Dell Remote Access Controller 9 User's Guide at Dell.com.
For more details on iDRAC9 including white papers and videos, see:● Support for Integrated Dell Remote Access Controller 9 (iDRAC9) on the Knowledge Base page at Dell.com

Systems Management software support matrix
Table 47. Systems Management software support matrix
Categories

Features

PE mainstream

Embedded Management and In-band
Services

iDRAC9 (Express, Enterprise, and Datacenter licenses)

Supported

OpenManage Mobile

SupportedOM Server Administrator (OMSA)

Supported

iDRAC Service Module (iSM)

Supported

Driver Pack

Supported

Update Tools (Repository Manager, DSU, Catalogs)

Supported

Server Update Utility

Supported

Lifecycle Controller Driver Pack

Supported

Bootable ISO

Supported

OpenManage Enterprise

Supported

Power Manager Plug-in

Supported

Update Manager Plug-in

Supported

SupportAssist Plug-in

Supported

CloudIQ

SupportedOM Integration with VMware Vcenter/vROps

SupportedOM Integration with Microsoft System Center (OMIMSC)

Supported

Integrations with Microsoft System Center and Windows
Admin Center (WAC)

Supported

ServiceNow

Supported

AnsibleSupported

Third-party Connectors (Nagios, Tivoli, Microfocus)

Supported

Secure Enterprise Key Management

Supported

Secure Component Verification

Supported

Red Hat Enterprise Linux, SUSE, Windows Server 2019 or
2022, Ubuntu, CentOS

Supported (Tier-1)

Change Management

Console and Plug-ins

Integrations and connections

SecurityStandard operating system

Dell Systems Management

63Getting started with Dell Open Server Manager(OSM)
Dell Open Server Manager is available on select PowerEdge configurations as a factory option. Choose the embedded systems
management option (iDRAC or Open Server Manager) at the time of purchase. Both options run on the same silicon with thesame hardware, and ship directly from the factory. It's your choice.
Contact your Dell account team to learn more about Dell's Open Server Manager built on OpenBMC™ available exclusively
through the Hyperscale Next program for select customers by invitation only. For more information and to find out customer
eligibility, please contact your Dell account team.

Open Server Manager (OSM) introduction
Cloud service and hosting providers managing large-scale datacenters face many challenges accelerating their infrastructure
and managing multiple systems across different vendors. Updating firmware can be challenging, even across many generationsof hardware from a single vendor. The simplicity of a single, open embedded system management stack allows for scalable
operations, and easier migration paths across different or newer infrastructure.
Introducing Dell Open Server Manager built on OpenBMC™ enabling open, embedded systems management on select Dell
PowerEdge cloud scale servers. Explicitly designed for Cloud Server Providers managing large-scale data centers, Dell Open
Server Manager is designed, tested, and validated to securely run on select Dell PowerEdge platforms and configurations. We
offer a cohesive migration path for our customers looking to adopt OpenBMC for their environments while optimizing operations
and minimizing management with choices you can count on.

What is OpenBMC?
OpenBMC is an open-source BMC firmware stack designed to run on various infrastructures. It is a Linux Foundation projectwith the backing of Intel®, IBM®, Microsoft®, and Google™. OpenBMC™ aims to run the same embedded management
software on all of your systems to bring consistent management across your environment. Dell Open Server Manager isDell's implementation of OpenBMC. More information on Open Server Manager (OSM) can be found at https://www.dell.com/
support/home/en-us/product-support/product/open-server-manager/docs.

Why Dell Open Server Manager?
Dell Open Server Manager built on OpenBMC includes pure OpenBMC plus the security, manageability, and support that
customer's expect from PowerEdge servers:

64

Dell Systems Management

Proven Security

Lifecycle Management

Dell-signed firmware with silicon root-of- BIOS configuration via Redfish™ API
trust (RoT)
Root shell access disabled by default

Global Services & Support
Standard Dell standard support andwarranties

Firmware update support via Dell Update Ability to convert to/from Open Server
Packages for BIOS, Backplane, PowerManager and iDRAC
Supply, Open Server Manager, andiDRAC

Improved User Experience

Why choose Dell Open Server Manager built on OpenBMC?
OpenBMC is designed to provide consistent systems management software across heterogeneous infrastructure. Based on
upstream OpenBMC 2.11, Dell Open Server Manager enables OpenBMC to run securely on select PowerEdge servers byleveraging the same BMC silicon that iDRAC uses. In doing so, this added silicon Root-of-Trust ensures that only the Dell version
of OpenBMC - thoroughly tested and validated - runs seamlessly on PowerEdge servers, giving our customers the security,
support, and manageability they expect. .
Ensuring malicious OpenBMC firmware doesn't make its way onto your servers, Dell lifecycle management is also enabled to
install Dell-signed firmware update packages from within Dell Open Server Manager for the BIOS, backplane, power supplies,
and iDRAC and Dell Open Server Manager.Additionally, the ability to export OpenBMC logs into a log package for SupportAssist
allows Dell to provide a full warranty and support.

Dell Open Server Manager Capabilities
Dell Open Server Manager provides many core systems management capabilities through multiple interfaces, including
Redfish™, IPMI, and a web-based user interface.
●
●
●
●
●
●
●

Get an overview of the system
View event and POST code logs
Observe hardware status and inventory, including channel firmware devices
Access the virtual KVM with virtual media capability
Update firmware
Perform server power operations and configure power consumption
Configure settings such as the date, time, network, users, sessions, and policies

Everything visible in the GUI - except for the virtual KVM and media - is accessible through Redfish.
Redfish allows you to manage the server through a RESTful API programmatically. This feature is vital for autonomous systems
management.

Configuring Dell Open Server Manager
Provisioning a new server consists of three activities● Configure the hardware● Install an operating system● Deploy applications and workloads
Firmware updates for other devices must be done through the operating system or with device-specific vendor tools. Dell Open
Server Manager accepts the same Dell firmware update packages used by iDRAC or for the operating system; and can be
downloaded from dell.com
An operating system can be installed using the virtual KVM and virtual media capability, or the server can be configured to PXEboot to deploy the operating system and applications over the network.

Dell Systems Management65

13
Appendix A. Standards compliance
The system conforms to the following industry standards.

Table 48. Industry standard documents
Standard

URL for information and specifications

ACPIAdvance Configuration and Power Interface
Specification, v6.4

Uefi specifications and tools

Ethernet IEEE Std 802.3-2022

ieee standards

MSFT WHQL Microsoft Windows Hardware Quality Labs

microsoft.com/whdc/system/platform/pcdesign/desguide/serverdg.mspx

IPMI Intelligent Platform Management Interface, v2.0

intel.com/design/servers/ipmi

DDR5 Memory DDR5 SDRAM Specification

jedec.org/standards-documents/docs/jesd79-4.pdf

PCI Express PCI Express Base Specification, v5.0

pcisig.com/specifications/pciexpress

PMBus Power System Management Protocol Specification,
v1.2

pmbus specification and revisions

SAS Serial Attached SCSI, 3 (SAS-3) (T10/INCITS 519)SCSI storage interfaces information

SATA Serial ATA Rev. 3.3

sata-io.org page

SMBIOS System Management BIOS Reference Specification,
v3.3.0BIOS reference specification page

TPM Trusted Platform Module Specification, v1.2 and v2.0

trustedcomputinggroup org page

UEFI Unified Extensible Firmware Interface Specification, v2.7 UEFIF specifications
PI Platform Initialization Specification, v1.7
USB Universal Serial Bus v2.0 and SuperSpeed v3.0 (USB 3.1
Gen1)

USB Implementers Forum, Inc. USB document library

NVMe Express Base Specification. Revision 2.0c

NVME specifications

NVMe Command Set Specifications
1. NVM Express NVM Command Set Specification. Revision
1.1c
2. NVM Express Zoned Namespaces Command Set. Revision
1.0c
3. NVM Express® Key Value Command Set. Revision 1.0c
NVMe Transport Specifications
1. NVM Express over PCIe Transport. Revision 1.0c
2. NVM Express RDMA Transport Revision. 1.0b
3. NVM Express TCP Transport. Revision 1.0c
NVMe NVM Express Management Interface. Revision 1.2c
NVMe NVMe Boot Specification. Revision 1.0

66

Appendix A. Standards compliance14
Appendix B: Additional resources
Topics:••Customer kits
Documentation

Customer kits
Dell Upgrades
It is not always possible to plan for new applications, future workloads, and business needs. Unleash the full power of yourDell Technologies Infrastructure. When budget does not permit the purchase of new servers, Dell Upgrades is a cost-effective
method to repurpose and unleash the full power of existing server, storage, and networking infrastructure.
● Protect your mission-critical operations by using only genuine Dell OEM-validated Upgrades and the technical expertise ofDell ProSupport● Flex and scale existing infrastructure by upgrading, adding memory or storage drives to cost-effectively and quickly meet
new workloads and demands● Dell Upgrades are the same peripheral commodities that your customer may improve or maintain their server after the initialpoint of saleUpgrades portfolio
Table 49. Upgrade category
Dell Upgrade Category
MemorySample Picture

Dell Upgrade Category Offerings
DDR5 5600 MT/s and 4800 MT/s

Memory upgrades are essential forkeeping your customers operating at
peak performance as their businessneeds grow and their workloads
increase. We tend to see strong demand
for server memory because it is theeasiest and most cost-effective way to
improve system performance.
Storage

HDD: SATA, SAS interface

Dell offers both solid-state drive andhard disk drive storage options forenterprise systems with SATA, SAS or
NVMe interfaces. SSDs excel in speed,
high-performance I/O requirements, andhigh reliability due to the lack of spinningdisks. Hard Disk Drives (HDDs) store
data on spinning disks and offer value forthe amount of data storage for the price.

SSD: SATA, SAS, PCI
NVMe interface Tape Drive or Media

Dell offers both solid-state drive andhard disk drive storage options forenterprise systems with SATA, SAS

Appendix B: Additional resources67

Table 49. Upgrade category (continued)
Dell Upgrade Category

Sample Picture

Dell Upgrade Category Offerings

interfaces. SSDs excel in speed, highperformance I/O requirements, and highreliability due to the lack of spinningdisks. Hard Disk Drives (HDDs) store
data on spinning disks and offer value forthe amount of data storage for the price.
Processor

Processors (Intel)

Processor upgrades help customers
perform and accomplish more tasks
overall, saving them valuable time.
Our processor upgrades include Intel®
Xeon® Scalable processors to meetyour customers workload needs withincreased cores and improved security.

Heat sinks

Networking and Optics

Network cards

Our networking and optics components—network interface cards, transceivers,
optical cables, and more—are key intoday’s data center environment, helping
customers to improve bandwidth tobetter manage increase in workloads,
devices, users, and interconnected
systems.

Transceivers (Optics)

Accessories: Dell sells accessories like
power supplies, cables and power cables,
bezels, controller cards, GPU, PERC andother components to complete the Dell
Upgrades portfolio and redundancies.

Controller cards
Power supplies
CablesRail kits
BezelsPower cords
GPU
PERC
BOSS
Power cords
Cable Management Arm (CAM)
Fans
Serial board
Internal USB

68

Appendix B: Additional resourcesUpgrades reference links● Main Upgrades Page
● Customer Kit Selector● Dell Parts Finder Tool (Customer Facing Tool)

Documentation
This section provides information about the documentation resources for your system.

Table 50. Documentation resources
Document

Location

Factory Configuration Matrix

Sales Portal

SPM (Slot Priority Matrix)

Sales Portal

NDA Deck

Sales Portal

Installation and Service Manual (ISM)

PowerEdge Manuals

Field Service Manual (FSM)

PowerEdge Manuals > Sing inTechnical Guide

Dell Support page > Products > IT infrastructure >Products

Spec Sheet

Dell Support page > Products > IT infrastructure >Products

Appendix B: Additional resources69

15
Appendix C: Additional specifications
Topics:
•
•
•
•
•
•

Chassis dimensions
System weight
Video specifications
USB ports specifications
PSU rating
Environmental specifications

Chassis dimensions

Figure 40. Chassis dimensions

Table 51. PowerEdge HS5610 chassis dimensions
DrivesXa

Xb

Y

10 or 6 or 4
SATA/SAS/
NVMe drives

482 mm (18.976
inches)434.0 mm (17inches)42.8 mm
35.84 mm (1.41 677.1 mm(1.685 inches) inches)With(26.65 inches)bezel
Ear to rear wall70

Appendix C: Additional specifications

Za

Zb

Zc
712.95 mm(28.05 inches)Table 51. PowerEdge HS5610 chassis dimensions (continued)
Drives

Xa

Xb

Y

Za

8 NVMe drives

8 SATA/SAS
drives or No
backplane
configuration

482 mm (18.976
inches)434.0 mm (17inches)Zb

Zc

22 mm (0.86
inches)Without
bezel

Ear to PSU
handle without
velcro strap

42.8 mm
35.84 mm (1.41 626.42 mm(1.685 inches) inches)With(24.66 inches)bezel
Ear to rear wall
22 mm (0.86
inches)Without
bezel

661.37 mm(26.03 inches)
Ear to PSU
handle without
velcro strap

NOTE: Zb is the nominal rear wall external surface where the system board I/O connectors reside.

System weight
Table 52. PowerEdge HS5610 system weight
System configuration

Maximum weight (with all drives/SSDs)

10 x 2.5-inch

18.74 kg (41.31 pound)4 x 3.5-inch

19.45 Kg (55.33 pound)8 x 2.5-inch

18.25 kg (40.23 pound)

6 x 2.5-inch

18.1 kg (39.90 pound)No backplane configuration

15.38 kg (33.90 pound)

Table 53. PowerEdge system weight handling recommendations
Chassis weight

Description

40 pounds - 70 pounds

Recommend two person to lift

70 pounds- 120 pounds

Recommend three person to lift

≥ 121 pounds

Recommend to use a server-lift

Video specifications
The PowerEdge HS5610 system supports integrated Matrox G200 graphics controller with 16 MB of video frame buffer.

Table 54. Supported video resolution options for the system
Resolution

Refresh rate (Hz)Color depth (bits)

1024 x 768

60

8, 16, 32

1280 x 800

60

8, 16, 32

1280 x 1024

60

8, 16, 32

1360 x 768

60

8, 16, 32

1440 x 900

60

8, 16, 32

1600 x 900

60

8, 16, 32

1600 x 1200

60

8, 16, 32

1680 x 1050

60

8, 16, 32

Appendix C: Additional specifications

71

Table 54. Supported video resolution options for the system (continued)
Resolution

Refresh rate (Hz)Color depth (bits)

1920 x 1080

60

8, 16, 32

1920 x 1200

60

8, 16, 32

USB ports specifications
Table 55. PowerEdge HS5610 system USB ports specifications
Front
USB port type
USB 2.0compliant port

Rear
No. of ports

USB port typeInternal (Optional)
No. of ports

One

USB 2.0compliant port

One

iDRAC Direct port One(Micro-AB USB
2.0-compliant
port)

USB 3.0compliant portOne

USB port typeInternal USB 3.0compliant port

No. of ports
One

NOTE: The micro USB 2.0 compliant port can only be used as an iDRAC Direct or a management port.
NOTE: The USB 2.0 specifications provide a 5 V supply on a single wire to power connected USB devices. A unit load isdefined as 100 mA in USB 2.0, and 150 mA in USB 3.0. A device may draw a maximum of 5 unit loads (500 mA) from a port
in USB 2.0; 6 (900 mA) in USB 3.0.
NOTE: The USB 2.0 interface can provide power to low-power peripherals but must adhere to USB specification. An
external power source is required for higher-power peripherals to function, such as external CD/DVD Drives.

PSU rating
Below table lists the power capacity the PSUs in high/low line operation mode.

Table 56. PSUs highline and lowline ratings—

700 W
Titanium

800 W
Platinum1100 W
Titanium

1100 W -48
VDC

1400 W Platinum

1800 W Titanium

Peak Power(Highline/-72
VDC)

1190 W

1360 W

1870 W

1870 W

2380 W

3060 W

Highline/-72
VDC

700 W

800 W

1100 W

1100 W

1400 W

1800 W

Peak Power(Lowline/-40
VDC)

N/A

1360 W

1785 W

N/A

1785 W

N/A

Lowline/-40
VDC

N/A

800 W

1050 W

N/A

1050 W

N/A

Highline 240
VDC

700 W

800 W

1100 W

N/A

1400 W

1800 W

DC-48-60 V

N/A

N/A

N/A

1100 W

N/A

N/A

The PowerEdge HS5610 supports up to two AC power supplies with 1+1 redundancy, autosensing, and auto switching capability.

72

Appendix C: Additional specifications

If two PSUs are present during POST, a comparison is made between the wattage capacities of the PSUs. In case the PSU
wattages do not match, the larger of the two PSUs is enabled. Also, there is a PSU mismatch warning that is displayed in BIOS,
iDRAC, or on the system LCD.
If a second PSU is added at run-time, in order for that particular PSU to be enabled, the wattage capacity of the first PSU must
equal the second PSU. Otherwise, the PSU is flagged as unmatched in iDRAC and the second PSU is not enabled.
Dell PSUs have achieved Platinum efficiency levels as shown in the table below.

Table 57. PSU efficiency level
Efficiency Targets by Load
Form factor

Output

Class

10%

20%

50%

100%

Redundant 60 mm

700 W AC

Titanium

90.00%

94.00%

96.00%

91.50%

800 W AC

Platinum

89.00%

93.00%

94.00%

91.50%

1100 W AC

Titanium

90.00%

94.00%

96.00%

91.50%

1100 W -48
VDC

N/A

85.00%

90.00%

92.00%

90.00%

1400 W AC

Platinum

89.00%

93.00%

94.00%

91.50%

1800 W AC

Titanium

90.00%

94.00%

96.00%

94.00%

Environmental specifications
NOTE: For additional information about environmental certifications, refer to the Product Environmental Datasheet locatedwith the Documentation on Dell Support.

Table 58. Continuous Operation Specifications for ASHRAE A2
Operational climatic range for category A2

Allowable continuous operations

Temperature range for altitudes <= 900 m (<=2953 ft)

10–35°C (50–95°F) with no direct sunlight on the equipment

Humidity percent range (non-condensing at all
times)

8% RH with -12°C (10.4°F) minimum dew point to 80% RH with 21°C
(69.8°F) maximum dew point

Operational altitude de-rating

Maximum temperature is reduced by 1°C/300 m (1.8°F/984 Ft) above 900
m (2953 Ft)

Table 59. Continuous Operation Specifications for ASHRAE A3
Operational climatic range for category A3

Allowable continuous operations

Temperature range for altitudes <= 900 m (<=2953 ft)

5–40°C (41–104°F) with no direct sunlight on the equipment

Humidity percent range (non-condensing at all
times)

8% RH with -12°C (10.4°F) minimum dew point to 85% RH with 24°C
(75.2°F) maximum dew point

Operational altitude de-rating

Maximum temperature is reduced by 1°C/175 m (1.8°F/574 Ft) above 900
m (2953 Ft)

Table 60. Continuous Operation Specifications for ASHRAE A4
Operational climatic range for category A4

Allowable continuous operations

Temperature range for altitudes <= 900 m (<=2953 ft)

5–45°C (41–113°F) with no direct sunlight on the equipment

Humidity percent range (non-condensing at all
times)

8% RH with -12°C (10.4°F) minimum dew point to 90% RH with 24°C
(75.2°F) maximum dew point

Appendix C: Additional specifications73

Table 60. Continuous Operation Specifications for ASHRAE A4 (continued)
Operational climatic range for category A4

Allowable continuous operations

Operational altitude de-rating

Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900
m (2953 Ft)

Table 61. Continuous Operation Specifications for Rugged Environment
Operational climatic range for category A4

Allowable continuous operations

Temperature range for altitudes <= 900 m (<=2953 ft)

5–45°C (41–113°F) with no direct sunlight on the equipment

Humidity percent range (non-condensing at all
times)

8% RH with -12°C (10.4°F) minimum dew point to 90% RH with 24°C
(75.2°F) maximum dew point

Operational altitude de-rating

Maximum temperature is reduced by 1°C/125 m (1.8°F/410 Ft) above 900
m (2953 Ft)

Table 62. Common Environmental Specifications for ASHRAE A2, A3, A4 and Rugged
Environmental Specifications for ASHRAE
A2, A3, A4 and Rugged

Allowable continuous operations

Maximum temperature gradient (applies to both
operation and non-operation)

20°C in an hour* (36°F in an hour) and 5°C in 15 minutes (9°F in 15
minutes), 5°C in an hour* (9°F in an hour) for tape
NOTE: * - Per ASHRAE thermal guidelines for tape hardware, these are
not instantaneous rates of temperature change.

Non-operational temperature limits-40 to 65°C (-104 to 149°F)

Non-operational humidity limits

5% to 95% RH with 27°C (80.6°F) maximum dew point

Maximum non-operational altitude

12,000 meters (39,370 feet)

Maximum operational altitude

3,048 meters (10,000 feet)

Table 63. Maximum vibration specifications
Maximum vibration

Specifications

Operating

0.21 G rms at 5 Hz to 500 Hz for 10 minutes (all operation orientations)

Storage

1.88 G rms at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

Table 64. Maximum shock pulse specifications
Maximum shock pulse

Specifications

Operating

Six consecutively executed shock pulses in the positive and negative x, y,
and z axis of 6 G for up to 11 ms.

Storage

Six consecutively executed shock pulses in the positive and negative x, y,
and z axis (one pulse on each side of the system) of 71 G for up to 2 ms.

Thermal restrictions
Table 65. Thermal restriction matrix for processor and fans with iDRAC
Configu No Backplaneration /Processor TDP6 x 2.5-inch
NVMe coldasile

4 x 3.5-inch SAS/SATA

8 x 2.5-inch SAS3/SATA

10 x 2.5-inch
SAS3/SATA

Rear
Storage

Rear 3 LP

Rear 3 LP

Rear 3 LP

1 LP + 2 ReardrivesRear 3 LP

Rear 1 LP + 2
Rear drives

Rear 3 LP

DIMM

14W (128 GB)

14W (128 GB)

12W (96 GB)

12W (96 GB)

14W (128 GB)

14W (128 GB)

14W (128 GB)

74

Appendix C: Additional specifications

Table 65. Thermal restriction matrix for processor and fans with iDRAC (continued)
Configu No Backplaneration /Processor TDP6 x 2.5-inch
NVMe coldasile

4 x 3.5-inch SAS/SATA

8 x 2.5-inch SAS3/SATA

10 x 2.5-inch
SAS3/SATA

125 W

STD fan

HPR (Gold) fan

STD fan

STD fan

STD fan

STD fan

STD HSK

STD HSK

STD HSK

STD HSK

STD HSK

45 °C

40 °C

40 °C

35 °C

HPR (Gold)fan
STD HSK

40 °C

STD HSK
40 °C

35 °C
135 W

STD fan

STD fan

STD fan

STD fan

STD fan

STD HSK

STD HSK

STD HSK

STD HSK

STD HSK

45 °C

40 °C

40 °C

35 °C

HPR (Gold)fan
STD HSK

40 °C

STD fan
STD HSK
40 °C

35 °C
150 W

STD fan

STD fan

STD fan

STD fan

STD fan

STD HSK

STD HSK

STD HSK

STD HSK

STD HSK

40 °C

40 °C

40 °C

35 °C

HPR (Gold)fan
STD HSK

40 °C

STD fan
STD HSK
40 °C

35 °C
165 W

STD fan

HPR (Gold) fan

STD fan

HPR HSKHPR HSKHPR HSK

40 °C

35 °C

HPR (Gold)fan
HPR HSK

35 °C

STD fan

HPR (Gold)fan

HPR (Gold)fan

HPR HSKHPR HSK

35 °C

35 °C

HPR (Gold)fan

HPR (Gold)fan

HPR HSKHPR HSK

35 °C

35 °C

****HPR(Gold) fan

HPR (Gold)fan

HPR (Gold)fan

HPR HSKHPR HSKHPR HSK

35 °C

35 °C

35 °C

****STD fan

HPR (Gold)fan

HPR (Gold)fan

HPR HSKHPR HSK

35 °C

35 °C

HPR (Gold)fan

HPR (Gold)fan

HPR (Gold)fan

HPR HSKHPR HSKHPR HSK

35 °C

35 °C

35 °C

HPR HSK
35 °C

35 °C
185 W

STD fan

HPR (Gold) fan

STD fan

HPR HSKHPR HSKHPR HSK

40 °C

35 °C

HPR (Gold)fan
HPR HSK

35 °C

STD fan
HPR HSK
35 °C

35 °C
195 W

205 W

STD fan

HPR (Gold) fan

STD fan

STD fan

HPR HSKHPR HSKHPR HSKHPR HSK

35 °C

35 °C

35 °C

35 °C

STD fan

HPR (Gold) fan

STD fan

HPR HSKHPR HSKHPR HSK

35 °C

35 °C

35 °C

HPR (Gold)fan
HPR HSKHPR HSK
35 °C

35 °C
225 W

STD fan

HPR (Gold) fan

HPR HSKHPR HSK

35 °C

35 °C

*

*

Table 66. Thermal restriction matrix for processor and fans with iDRAC
Configuration /
Processor TDP

10 x 2.5-inch SAS4/SATA

8 x 2.5-inch NVMe

10 x 2.5-inch NVMe

Rear
Storage

Rear 3 LP

1 LP + 2 ReardrivesRear 3 LP

1 LP + 2 ReardrivesRear 3 LP

1 LP + 2 ReardrivesDIMM

14W (128 GB)

14W (128 GB)

14W (128 GB)

14W (128 GB)

14W (128 GB)

14W (128 GB)

125 W

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

Appendix C: Additional specifications

75

Table 66. Thermal restriction matrix for processor and fans with iDRAC (continued)
Configuration /
Processo
r TDP

135 W

150 W

165 W

185 W

195 W

205 W

225 W

10 x 2.5-inch SAS4/SATA

8 x 2.5-inch NVMe

10 x 2.5-inch NVMe

STD HSK

STD HSK

STD HSK

STD HSK

STD HSK

STD HSK

40 °C

35 °C

40 °C

35 °C

40 °C

35 °C

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

STD HSK

STD HSK

STD HSK

STD HSK

STD HSK

STD HSK

40 °C

35 °C

40 °C

35 °C

40 °C

35 °C

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

STD HSK

STD HSK

STD HSK

STD HSK

STD HSK

STD HSK

40 °C

35 °C

40 °C

35 °C

40 °C

35 °C

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR HSKHPR HSKHPR HSKHPR HSKHPR HSKHPR HSK

35 °C

35 °C

35 °C

35 °C

35 °C

35 °C

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR HSKHPR HSKHPR HSKHPR HSKHPR HSKHPR HSK

35 °C

35 °C

35 °C

35 °C

35 °C

35 °C

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR HSKHPR HSKHPR HSKHPR HSKHPR HSKHPR HSK

35 °C

30 °C

35 °C

30 °C

35 °C

30 °C

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR HSKHPR HSKHPR HSKHPR HSKHPR HSKHPR HSK

35 °C

30 °C

35 °C

30 °C

35 °C

30 °C

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR HSKHPR HSKHPR HSKHPR HSKHPR HSKHPR HSK

35 °C

30 °C

35 °C

30 °C

35 °C

30 °C

NOTE:
*Configs supported in the " CPU TDP> 205W,225W and configurations with HW Restriction "** Cold Aisle 6 x 2.5 NVMe configuration always requires 7 VHP fans** Except cold aisle configuration: 5 fans is required for 1 x Processor + W/O RM configuration*** Except cold aisle configuration: 7 fans is required for 2 x Processors configuration. and 1 x Processor + RM
configuration**** Intel 6434/6526Y/6534 205W CPU would need HPR Gold Fan to support in this configuration.
EMR CPU tested could only support DIMM frequency up-to 5200MHz. 5600MHz DIMM will need to be re-tested for new
CPU support DIMM frequency 5600MHz.
4x3.5" SAS/SATA config only support DIMM up to 96G and all the other configs support DIMM up to 128G.

76

Appendix C: Additional specifications

Table 67. Thermal restriction matrix for processor and fans with iDRAC with TDP > 205 W, 225 W
SM
Configuration
withRestricti
ons

No Backplane

6 x 2.5-inch
NVMe cold asile

2 x 3.5-inch SAS/SATA

4 x 2.5-inch SAS3/SATA

DrivesNo

HDD 0 ~ 5

HDD 0 ~ 1

HDD 0 ~ 3

DIMM

14W (128 GB)

14W (128 GB)

12W (96 GB)

12W (96 GB)

14W (128 GB)

14W (128 GB)

Rear
Storage

Rear 3 LP

Rear 3 LP

PCIe 1 + OCP
only. PCIe
2,PCIe 3 andBOSS are notsupported

1 LP + 2 ReardrivesRear 3 LP

Rear 1 LP + 2
Rear drives

225 W

*

*

STD fan

STD fan**

HPR HSKHPR HSK

35 °C

30 °C

250 W

STD fan

HPR (Gold) fan

STD fan

STD fan

HPR (Gold) fan

HPR (Gold) fan

HPR HSKHPR HSKHPR HSKHPR HSK

STD HSK

STD HSK

35 °C

35 °C

35 °C

30 °C

35 °C

35 °C

Table 68. Thermal restriction matrix for processor and fans with iDRAC with TDP > 205 W, 225 W
SM
Configuration
withRestricti
ons

6 x 2.5-inch SAS4/SATA

4 x 2.5-inch NVMe

4 x 2.5-inch NVMe

DrivesHDD 0 ~ 5

HDD 0 ~ 3

HDD 0 ~ 3

DIMM

14W (128 GB)

14W (128 GB)

14W (128 GB)

14W (128 GB)

14W (128 GB)

14W (128 GB)

Rear
Storage

Rear 3 LP

1 LP + 2 ReardrivesRear 3 LP

1 LP + 2 ReardrivesRear 3 LP

1 LP + 2 Reardrives

225 W

*

*

*

*

*

*

250 W

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR HSKHPR HSKHPR HSKHPR HSKHPR HSKHPR HSK

35 °C

30 °C

35 °C

30 °C

35 °C

30 °C

NOTE:
*Configs supported in the " CPU <205W,225W without HW restriction thermal restriction table"** 2 x3.5" SAS/SATA config only support DIMM up to 96G and all the other configs support DIMM up to 128G.

Table 69. Thermal restriction matrix for processor and fans with OSM
Configur No Backplane
ation /
Processor TDP

6 x 2.5-inch
NVMe cold asile

4 x 3.5-inch SAS/SATA

8 x 2.5-inch SAS3/SATA

Rear
Storage

Rear 3 LP

Rear 3 LP

Rear 3 LP

1 LP + 2 ReardrivesRear 3 LP

1 LP + 2 Reardrives125 W

HPR (Gold) fan

HPR (Gold) fan

STD fan

STD fan

HPR (Gold) fan

HPR (Gold) fan

STD HSK

STD HSK

STD HSK

STD HSK

STD HSK

STD HSK

Appendix C: Additional specifications

77

Table 69. Thermal restriction matrix for processor and fans with OSM (continued)
Configur No Backplane
ation /
Processo
r TDP

135 W

150 W

165 W

185 W

205 W

225 W

6 x 2.5-inch
NVMe cold asile

4 x 3.5-inch SAS/SATA

8 x 2.5-inch SAS3/SATA

35 °C

35 °C

35 °C

35 °C

35 °C

35 °C

HPR (Gold) fan

HPR (Gold) fan

STD fan

STD fan

HPR (Gold) fan

HPR (Gold) fan

STD HSK

STD HSK

STD HSK

STD HSK

STD HSK

STD HSK

35 °C

35 °C

35 °C

35 °C

35 °C

35 °C

HPR (Gold) fan

HPR (Gold) fan

STD fan

STD fan

HPR (Gold) fan

HPR (Gold) fan

STD HSK

STD HSK

STD HSK

STD HSK

STD HSK

STD HSK

35 °C

35 °C

35 °C

35 °C

35 °C

35 °C

HPR (Gold) fan

HPR (Gold) fan

STD fan

STD fan

HPR (Gold) fan

HPR (Gold) fan

HPR HSKHPR HSKHPR HSKHPR HSKHPR HSKHPR HSK

35 °C

35 °C

35 °C

35 °C

35 °C

35 °C

HPR (Gold) fan

HPR (Gold) fan

STD fan

STD fan

HPR (Gold) fan

HPR (Gold) fan

HPR HSKHPR HSKHPR HSKHPR HSKHPR HSKHPR HSK

35 °C

35 °C

35 °C

35 °C

35 °C

35 °C

HPR (Gold) fan

HPR (Gold) fan

STD fan*

HPR (Gold) fan

HPR (Gold) fan

HPR HSKHPR HSKHPR HSKHPR HSKHPR HSK

35 °C

35 °C

35 °C

35 °C

30 °C

HPR (Gold) fan

HPR (Gold) fan

*

*

*

HPR HSKHPR HSK

35 °C

35 °C

*

Table 70. Thermal restriction matrix for processor and fans with OSM
Configu 10 x 2.5-inch SAS4/SATA
ration /Processor
TDP

8 x 2.5-inch NVMe

10 x 2.5-inch
SAS3/SATA

10 x 2.5-inch NVMe

Rear
Storage

Rear 3 LP

Rear 3 LP

Rear 3 LP

Rear 3 LP

1 LP + 2 Reardrives125 W

HPR (Gold) fan HPR (Gold) fan HPR (Gold) fan HPR (Gold) fan STD fan

HPR (Gold)fan

HPR (Gold)fan

STD HSK

STD HSK

35 °C

35 °C

HPR (Gold)fan

HPR (Gold)fan

STD HSK

STD HSK

35 °C

35 °C

HPR (Gold)fan

HPR (Gold)fan

STD HSK

STD HSK

35 °C

35 °C

135 W

150 W

78

1 LP + 2 Reardrives

1 LP + 2 ReardrivesSTD HSK

STD HSK

STD HSK

STD HSK

STD HSK

35 °C

35 °C

35 °C

35 °C

35 °C

HPR (Gold) fan HPR (Gold) fan HPR (Gold) fan HPR (Gold) fan STD fan
STD HSK

STD HSK

STD HSK

STD HSK

STD HSK

35 °C

35 °C

35 °C

35 °C

35 °C

HPR (Gold) fan HPR (Gold) fan HPR (Gold) fan HPR (Gold) fan STD fan
STD HSK

STD HSK

STD HSK

STD HSK

STD HSK

35 °C

35 °C

35 °C

35 °C

35 °C

Appendix C: Additional specifications

Table 70. Thermal restriction matrix for processor and fans with OSM (continued)
Configu 10 x 2.5-inch SAS4/SATA
ration /Proces
sor
TDP
165 W

185 W

205 W

225 W

8 x 2.5-inch NVMe

10 x 2.5-inch
SAS3/SATA

10 x 2.5-inch NVMe

HPR (Gold) fan HPR (Gold) fan HPR (Gold) fan HPR (Gold) fan HPR (Gold)fan
HPR HSKHPR HSKHPR HSKHPR HSKHPR HSK
35 °C
35 °C
35 °C
35 °C
35 °C

HPR (Gold)fan

HPR (Gold)fan

HPR HSKHPR HSK

35 °C

35 °C

HPR (Gold) fan HPR (Gold) fan HPR (Gold) fan HPR (Gold) fan HPR (Gold)fan
HPR HSKHPR HSKHPR HSKHPR HSKHPR HSK
35 °C
35 °C
35 °C
35 °C
35 °C

HPR (Gold)fan

HPR (Gold)fan

HPR HSKHPR HSK

35 °C

35 °C

HPR (Gold) fan HPR (Gold) fan HPR (Gold) fan HPR (Gold) fan HPR (Gold)fan
HPR HSKHPR HSKHPR HSKHPR HSKHPR HSK
35 °C
30 °C
35 °C
30 °C
35 °C

HPR (Gold)fan

HPR (Gold)fan

HPR HSKHPR HSK

35 °C

30 °C

*

*

*

*

*

*

HPR (Gold)fan
HPR HSK
35 °C

NOTE:
* Configs supported in the table of "without HW restriction thermal restriction table"** All configs always requires 7x fans.
*** Matrix are developed based on not support fan redundancy and allow system showing events at fan failure condition.
4x3.5" SAS/SATA config only support DIMM up to 64G and all the other configs support DIMM up to 128G.
195 W CPU restriction will follow 205 W CPU restriction.

Table 71. Thermal restriction matrix for processor and fans with OSM with TDP>185W, 205W & 225W
config with HW restriction
SM
Configuration

No Backplane

6 x 2.5-inch
NVMe cold asile

4 x 3.5-inch SAS/SATA

8 x 2.5-inch SAS/SATA

Driveswith HW
Restricti
ons

No HDDHDD 0 ~ 5

HDD 0 ~ 1

HDD 0 ~ 3

Rear
Storage

Rear 3 LP

Rear 3 LP

PCIe 1 + OCP
only. PCIe
2,PCIe 3 andBOSS are notsupported

1 LP + 2 ReardrivesRear 3 LP

1 LP+2 reardrives

205 W

*

*

*

STD fan**

HPR (Gold) fan

HPR (Gold) fan

HPR HSK
30 °C
225 W

*

*

STD fan

STD fanAppendix C: Additional specifications

79

Table 71. Thermal restriction matrix for processor and fans with OSM with TDP>185W, 205W & 225W
config with HW restriction (continued)
SM
Configuration

No Backplane

250 W

6 x 2.5-inch
NVMe cold asile

4 x 3.5-inch SAS/SATA

8 x 2.5-inch SAS/SATA

HPR HSKHPR HSKHPR HSKHPR HSK

35 °C

30 °C

35 °C

30 °C

Not supported

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

HPR (Gold) fan

STD fan

HPR HSKHPR HSKHPR HSKHPR HSKHPR HSK

35 °C

35 °C

35 °C

35 °C

30 °C

Table 72. Thermal restriction matrix for processor and fans with OSM with TDP>185W, 205W & 225W
config with HW restrictionSM
10 x 2.5-inch
Configu SAS3/SATA
ration10 x 2.5-inch SAS3/SATA

8 x 2.5-inch NVMe

10 x 2.5-inch NVMe

Driveswith
HW
Restric
tions

HDD 0 ~ 5

HDD 0 ~ 5

HDD 0 ~ 3

HDD 0 ~ 5

Rear
Storage

Rear 3 LP

Rear 3 LP

1 LP+2 reardrivesRear 3 LP

1 LP+2 reardrivesRear 3 LP

1 LP+2 reardrives

205 W

*

*

*

*

*

*

*

225 W

*

HPR (Gold)fan

HPR (Gold)fan

HPR (Gold)fan

HPR (Gold)fan

HPR (Gold)fan

HPR (Gold)fan

HPR HSKHPR HSKHPR HSKHPR HSKHPR HSKHPR HSK

35 °C

30 °C

35 °C

30 °C

35 °C

30 °C

HPR (Gold)fan

HPR (Gold)fan

HPR (Gold)fan

HPR (Gold)fan

HPR (Gold)fan

HPR (Gold)fan

HPR HSKHPR HSKHPR HSKHPR HSKHPR HSKHPR HSK

35 °C

30 °C

35 °C

30 °C

35 °C

30 °C

250 W

HPR (Gold) fan
HPR HSK
35 °C

NOTE: * Configs supported in the table of "without HW restriction thermal restriction table"** All configs always requires 7x fans.
*** Matrix are developed based on not support fan redundancy and allow system showing events at fan failure condition.

Table 73. Label reference
Label

Description

STD

StandardLP

Low Profile

HPR (Gold)

High performance (gold grade)

HSK

Heat sink80

Appendix C: Additional specifications

Thermal Restriction for ASHRAE A2/A3/A4
Table 74. No BP Configuration with iDRAC
Dell PowerEdge Server Standard
Operating Support (ASHRAE A2
compliant) All options supported
unless otherwise noted.

Dell PowerEdge Server Extended
Inletient 40° C Operating Support(ASHRAE A3 compliant)

Dell PowerEdge Server Extended
Inletient 45° C Operating Support(ASHRAE A4 compliant)● STD (Brickfielder) Fan is required.
● STD HSK is required for CPU Base
TDP <=150W● HPR HSK is required for CPU Base
TDP >150W● 2-processor all configs or 1-processor
with RM config requires 7x fans
● 1-processor without RM config
requires 5x fans
● 100G PCIe NIC could notsupport MFS1S00-VxxE (spec 75C)
transceiver● 100G OCP3.0 NIC could only support
optic transceiver with thermal
spec 85C and power <=2.5W( DPN:4WGYD)● 25G OCP3.0 NIC with 4 ports or
PCIe cooling tier higher than orequal to 5 could only support optic
transceiver with thermal spec 85C
and power <=1.2W ( DPN: M14MK)● 25G OCP3.0 NIC with PCIe coolingtier lower than 5 could not support
spec 70C optic transceiver withpower higher than 1.2W ( DPN:
0YR96)● H965e cannot not be installed in
PCIe slot1● Not support CPU Base TDP > 185W
● STD (Brickfielder) Fan is required.
● STD HSK is required for CPU Base
TDP <=150W● HPR HSK is required for CPU Base
TDP >150W.
● Not support BOSS M.2 Module● Not support Non-Dell qualified
peripheral cards and Channel devices(FW) cards● Not support NIC consuming power>= 25W.
● Not Support Config with RM● Not support OCP transfer rate >25G
or cooling tier > 9● Optic Transceiver with spec 85C isrequired● Two PSUs are required. System
performance may be reduced in theevent of a PSU failure● Not support CPU Base TDP > 135W
● STD (Brickfielder) Fan and STD HSK
is required.
● Not support BOSS M.2 Module● Not support Non-Dell qualified
peripheral cards and Channel devices(FW) cards● Not support NIC consuming power>= 25W. Or PCIe cooling Tier> 5● Not Support Config with RM● Not support OCP3.0 transfer rate
>25G or OCP3.0 cooling tier > 6● Optic Transceiver with spec 85C isrequired.
● Two PSUs are required. System
performance may be reduced in theevent of a PSU failure

Table 75. 6 x 2.5-inch Cold Aisle Configuration with iDRAC
Dell PowerEdge Server Standard
Operating Support (ASHRAE A2
compliant) All options supported
unless otherwise noted.

Dell PowerEdge Server Extended
Inletient 40° C Operating Support(ASHRAE A3 compliant)

Dell PowerEdge Server Extended
Inletient 45° C Operating Support(ASHRAE A4 compliant)● HPR Gold (VHP) Fan is required.
● STD HSK is required for CPU Base
TDP <=150W● HPR HSK is required for CPU Base
TDP >150W● All config requires 7x fans
● ·● Not support CPU Base TDP > 150W
● Not support BOSS M.2 Module● Not support Non-Dell qualified
peripheral cards and Channel devices(FW) cards● Not support NIC consuming power>= 25W.
● Not Support Config with RM● Not support OCP transfer rate >25G
or cooling tier > 10
● Optic Transceiver with spec 85C isrequired● Two PSUs are required. System
performance may be reduced in theevent of a PSU failure● Not support

100G PCIe NIC could notsupport MFS1S00-VxxE (spec 75C)
transceiver but could support optic
transceiver with thermal spec 70C
and 85C.

Appendix C: Additional specifications

81

Table 76. 4 x 3.5-inch SAS/SATA Configuration with iDRAC
Dell PowerEdge Server Standard
Operating Support (ASHRAE A2
compliant) All options supported
unless otherwise noted.

Dell PowerEdge Server Extended
Inletient 40° C Operating Support(ASHRAE A3 compliant)

Dell PowerEdge Server Extended
Inletient 45° C Operating Support(ASHRAE A4 compliant)● STD (Brickfielder) Fan is required.
● STD HSK is required for CPU Base
TDP <=150W● HPR HSK is required for CPU Base
TDP >150W● 2-processor all configs or 1-processor
with RM config requires 7x fans
● 1-processor without RM config
requires 5x fans
● HW restriction is required for CPU
Base TDP >205W○ SM only support 2x3.5 at HDD#0,
HDD1 and HDD Blank F3F7V x
2 are required at HDD#2 andHDD#3○ RIO only support PCIe1 and
OCP3.0. Could not support
BOSS, PCIe2 and PCIe3.
○ With RM config only support max.
30C ambient.
● Only support DDR5 DIMM up to 96
GB.
● 100G PCIe NIC could notsupport MFS1S00-VxxE (spec 75C)
transceiver.
● 100G PCIe and OCP3.0 NIC could
only support optic transceiver withthermal Spec 85C and power<=2.5W● 25G PCIe NIC could only support
optic transceiver with thermal Spec
85C and power <=1.2W● 25G OCP3.0 NIC with 4 ports or
PCIe cooling tier higher than 5 could
only support optic transceiver withthermal spec 85C and power <=1.2W● 25G OCP3.0 NIC with PCIe coolingtier lower than or equal to 5 could
not support thermal spec 70C optic
transceiver with power higher than
1.2W
● The following SAS drives could NOT
support in RM. (But could support infront SM)○ Kioxia PM6 SAS all capacities○ SATA SSD, Hynix SE5031 all
capacities or thermal spec <70C
● H965e cannot not be installed in
PCIe slot1

●
●
●
●
●

● Not support

82

●
●
●
●
●

Not support CPU Base TDP > 150W
STD (Brickfielder) Fan is required.
STD HSK is required
Not support BOSS M.2 Module
Not support Non-Dell qualified
peripheral cards and Channel devices(FW) cards
Not support NIC consuming power>= 25W.
Not Support Config with RM
Not support OCP transfer rate >25G
or cooling tier > 10
Optic Transceiver with spec 85C isrequired
Two PSUs are required. System
performance may be reduced in theevent of a PSU failure

Appendix C: Additional specifications

Table 77. 8 x 2.5-inch SAS3/SATA Configuration with iDRAC
Dell PowerEdge Server Standard
Operating Support (ASHRAE A2
compliant) All options supported
unless otherwise noted.

Dell PowerEdge Server Extended
Inletient 40° C Operating Support(ASHRAE A3 compliant)

Dell PowerEdge Server Extended
Inletient 45° C Operating Support(ASHRAE A4 compliant)● STD (Brickfielder) Fan is required for
CPU Base TDP<=205W● HPR Gold (VHP) Fan is required
for CPU Base TDP>205W and Intel
6434/6526Y/6534 CPU with base
TDP 205 W● STD HSK is required for CPU Base
TDP <=150W● HPR HSK is required for CPU Base
TDP >150W● 2-processor all configs or 1-processor
with RM config requires 7x fans
● 1-processor without RM config
requires 5x fans
● HW restriction is required for CPU
Base TDP >225W○ SM only support 4x2.5"SAS/SATA drives at HDD#0~3, and
HDD Bracket GG6M3 x1 andM8KTX x1 are required at empty
HDD bay● 100G PCIe and OCP3.0 NIC could
only support optic transceiver withthermal Spec 85C and power<=2.5W● 25G PCIe NIC could only support
optic transceiver with thermal Spec
85C and power <=1.2W● 25G OCP3.0 NIC with 4 ports or
PCIe cooling tier higher than 5 could
only support optic transceiver withthermal spec 85C and power <=1.2W● 25G OCP3.0 NIC with PCIe coolingtier lower than or equal to 5 could
not support thermal spec 70C optic
transceiver with power higher than
1.2W
● The following SAS drives could NOT
support in RM. (But could support infront SM)○ Kioxia PM6 SAS all capacities○ SATA SSD, Hynix SE5031 all
capacities or thermal spec <70C
● H965e cannot not be installed in
PCIe slot1

●
●
●
●
●

● Not support

●
●
●
●
●

Not support CPU Base TDP > 150W
STD (Brickfielder) Fan is required.
STD HSK is required
Not support BOSS M.2 Module
Not support Non-Dell qualified
peripheral cards and Channel devices(FW) cards
Not support NIC consuming power>= 25W.
Not Support Config with RM
Not support OCP transfer rate >25G
or cooling tier > 10
Optic Transceiver with spec 85C isrequired
Two PSUs are required. System
performance may be reduced in theevent of a PSU failure

Table 78. 10 x 2.5-inch SAS3/SATA Configuration with iDRAC
Dell PowerEdge Server Standard
Operating Support (ASHRAE A2
compliant) All options supported
unless otherwise noted.

Dell PowerEdge Server Extended
Inletient 40° C Operating Support(ASHRAE A3 compliant)

Dell PowerEdge Server Extended
Inletient 45° C Operating Support(ASHRAE A4 compliant)● STD (Brickfielder) Fan is required for
CPU Base TDP<=150W● HPR Gold (VHP) Fan is required for
CPU Base TDP>150W

●
●
●
●

● Not support

Not support CPU Base TDP > 150W
STD (Brickfielder) Fan is required.
STD HSK is required
Not support BOSS M.2 Module

Appendix C: Additional specifications

83

Table 78. 10 x 2.5-inch SAS3/SATA Configuration with iDRAC
Dell PowerEdge Server Standard
Operating Support (ASHRAE A2
compliant) All options supported
unless otherwise noted.

Dell PowerEdge Server Extended
Inletient 40° C Operating Support(ASHRAE A3 compliant)● STD HSK is required for CPU Base
TDP <=150W● HPR HSK is required for CPU Base
TDP >150W● 2-processor all configs or 1-processor
with RM config requires 7x fans
● 1-processor without RM config
requires 5x fans
● HW restriction is required for CPU
Base TDP >225W○ SM only support 6x2.5"SAS/SATA drives at HDD#0~5, and
HDD Bracket GG6M3 x2 arerequired at empty HDD bay.
● 100G PCIe and OCP3.0 NIC could
only support optic transceiver withthermal Spec 85C and power<=2.5W● 25G PCIe NIC could not support
thermal spec 70C optic transceiverwith power higher than 1.2W
● 25G OCP3.0 NIC with 4 ports or
PCIe cooling tier higher than 5 could
only support optic transceiver withthermal spec 85C and power <=1.2W● 25G OCP3.0 NIC with PCIe coolingtier lower than or equal to 5 could
not support thermal spec 70C optic
transceiver with power higher than
1.2W
● H965e cannot not be installed in
PCIe slot1● Not support Non-Dell qualified
peripheral cards and Channel devices(FW) cards● Not support NIC consuming power>= 25W.
● Not Support Config with RM● Not support OCP transfer rate >25G
or cooling tier > 10
● Optic Transceiver with spec 85C isrequired● Two PSUs are required. System
performance may be reduced in theevent of a PSU failure

Dell PowerEdge Server Extended
Inletient 45° C Operating Support(ASHRAE A4 compliant)

Table 79. 10 x 2.5-inch SAS4/SATA Configuration with iDRAC
Dell PowerEdge Server Standard
Operating Support (ASHRAE A2
compliant) All options supported
unless otherwise noted.

Dell PowerEdge Server Extended
Inletient 40° C Operating Support(ASHRAE A3 compliant)

Dell PowerEdge Server Extended
Inletient 45° C Operating Support(ASHRAE A4 compliant)● HPR Gold (VHP) Fan is required for
all configurations● STD HSK is required for CPU Base
TDP <=150W● HPR HSK is required for CPU Base
TDP >150W● 2-processor all configs or 1-processor
with RM config requires 7x fans
● 1-processor without RM config
requires 5x fans
● HW restriction is required for CPU
Base TDP >225W○ SM only support 6x2.5"SAS/SATA drives at HDD#0~5, and
HDD Bracket GG6M3 x2 arerequired at empty HDD bay.

● Not support CPU Base TDP > 150W
● ·● Not support

84

HPR Gold (VHP) Fan is required.
● STD HSK is required● Not support BOSS M.2 Module● Not support Non-Dell qualified
peripheral cards and Channel devices(FW) cards● Not support NIC consuming power>= 25W.
● Not Support Config with RM● Not support OCP transfer rate >25G
or cooling tier > 10
● Optic Transceiver with spec 85C isrequired

Appendix C: Additional specifications

Table 79. 10 x 2.5-inch SAS4/SATA Configuration with iDRAC
Dell PowerEdge Server Standard
Operating Support (ASHRAE A2
compliant) All options supported
unless otherwise noted.

Dell PowerEdge Server Extended
Inletient 40° C Operating Support(ASHRAE A3 compliant)● 100G PCIe and OCP3.0 NIC could
only support optic transceiver withthermal Spec 85C and power<=2.5W● 25G PCIe NIC could not support
thermal spec 70C optic transceiverwith power higher than 1.2W ·● 25G OCP3.0 NIC with 4 ports or
PCIe cooling tier higher 5 could
only support optic transceiver withthermal spec 85C and power <=1.2W● 25G OCP3.0 NIC with PCIe coolingtier lower than or equal to 5 could
not support thermal spec 70C optic
transceiver with power higher than
1.2W
● With RM config only support max.
30C ambient when CPU Base
TDP>=205W● The following SAS drives could NOT
support in RM. (But could support infront SM)○ Kioxia PM6 SAS all capacities○ SATA SSD, Hynix SE5031 all
capacities or thermal spec <70C

● Two PSUs are required. System
performance may be reduced in theevent of a PSU failure

Dell PowerEdge Server Extended
Inletient 45° C Operating Support(ASHRAE A4 compliant)

Table 80. 8 x 2.5-inch NVMe configuration with iDRAC
Dell PowerEdge Server Standard
Operating Support (ASHRAE A2
compliant) All options supported
unless otherwise noted.

Dell PowerEdge Server Extended
Inletient 40° C Operating Support(ASHRAE A3 compliant)

Dell PowerEdge Server Extended
Inletient 45° C Operating Support(ASHRAE A4 compliant)● HPR Gold (VHP) Fan is required for
all configurations● STD HSK is required for CPU Base
TDP <=150W● HPR HSK is required for CPU Base
TDP >150W● 2-processor all configs or 1-processor
with RM config requires 7x fans
● 1-processor without RM config
requires 5x fans
● HW restriction is required for CPU
Base TDP >225W○ SM only support 4x2.5"NVMeat HDD#0~3, and HDD Bracket
GG6M3 x3 are required at empty
HDD bay.
● 100G PCIe and OCP3.0 NIC could
only support optic transceiver withthermal spec 85C and power <=2.5W● 25G OCP3.0 NIC with 4 ports or
PCIe cooling tier higher 5 could
only support optic transceiver withthermal spec 85C and power <=1.2W

●
●
●
●
●

● Not support

●
●
●
●
●

Not support CPU Base TDP > 150W
HPR Gold (VHP) Fan is required.
STD HSK is required
Not support BOSS M.2 Module
Not support Non-Dell qualified
peripheral cards and Channel devices(FW) cards
Not support NIC consuming power>= 25W.
Not Support Config with RM
Not support OCP transfer rate >25G
or cooling tier > 10
Optic Transceiver with spec 85C isrequired
Two PSUs are required. System
performance may be reduced in theevent of a PSU failure

Appendix C: Additional specifications

85

Table 80. 8 x 2.5-inch NVMe configuration with iDRAC
Dell PowerEdge Server Standard
Operating Support (ASHRAE A2
compliant) All options supported
unless otherwise noted.

Dell PowerEdge Server Extended
Inletient 40° C Operating Support(ASHRAE A3 compliant)

Dell PowerEdge Server Extended
Inletient 45° C Operating Support(ASHRAE A4 compliant)● 25G OCP3.0 NIC with PCIe coolingtier lower than or equal to 5 could
not support thermal spec 70C optic
transceiver with power higher than
1.2W
● With RM config only support max.
30C ambient when CPU Base
TDP>=205W● The following NVMe drives could
NOT support in RM. (But could
support in front SM)○ Samsung PM1735a/PM1735
Capacities > 6.4TB○ Samsung PM1733a/PM1733
Capacities > 7.68TB○ Skhynix PE8010 Capacity > 960
GB○ Kioxia CM6 all capacities○ Redtail NVMe all capacities○ Skhynix PE8110 capacity > 960
GB

Table 81. 10 x 2.5-inch NVMe configuration with iDRAC
Dell PowerEdge Server Standard
Operating Support (ASHRAE A2
compliant) All options supported
unless otherwise noted.

Dell PowerEdge Server Extended
Inletient 40° C Operating Support(ASHRAE A3 compliant)

Dell PowerEdge Server Extended
Inletient 45° C Operating Support(ASHRAE A4 compliant)● HPR Gold (VHP) Fan is required for
all configurations● STD HSK is required for CPU Base
TDP <=150W● HPR HSK is required for CPU Base
TDP >150W● 2-processor all configs or 1-processor
with RM config requires 7x fans
● 1-processor without RM config
requires 5x fans
● HW restriction is required for CPU
Base TDP >225W○ SM only support 4x2.5"NVMeat HDD#0~3, and HDD Bracket
GG6M3 x3 are required at empty
HDD bay. .
● 100G PCIe NIC could notsupport MFS1S00-VxxE (spec 75C)
transceiver but could support optic
transceiver with thermal spec 70C
and 85C.
● 100G PCIe and OCP3.0 NIC could
only support optic transceiver withthermal spec 85C and power <=2.5W● 25G OCP3.0 NIC with 4 ports or
PCIe cooling tier higher 5 could
only support optic transceiver withthermal spec 85C and power <=1.2W

●
●
●
●
●

● Not support

86

●
●
●
●
●

Not support CPU Base TDP > 150W
HPR Gold (VHP) Fan is required.
STD HSK is required
Not support BOSS M.2 Module
Not support Non-Dell qualified
peripheral cards and Channel devices(FW) cards
Not support NIC consuming power>= 25W.
Not Support Config with RM
Not support OCP transfer rate >25G
or cooling tier > 10
Optic Transceiver with spec 85C isrequired
Two PSUs are required. System
performance may be reduced in theevent of a PSU failure

Appendix C: Additional specifications

Table 81. 10 x 2.5-inch NVMe configuration with iDRAC
Dell PowerEdge Server Standard
Operating Support (ASHRAE A2
compliant) All options supported
unless otherwise noted.

Dell PowerEdge Server Extended
Inletient 40° C Operating Support(ASHRAE A3 compliant)

Dell PowerEdge Server Extended
Inletient 45° C Operating Support(ASHRAE A4 compliant)● 25G OCP3.0 NIC with PCIe coolingtier lower than or equal to 5 could
not support thermal spec 70C optic
transceiver with power higher than
1.2W
● With RM config only support max.
30C ambient when CPU Base
TDP>=205W● The following NVMe drives could
NOT support in RM. (But could
support in front SM)○ Samsung PM1735a/PM1735
Capacities > 6.4TB○ Samsung PM1733a/PM1733
Capacities > 7.68TB○ Skhynix PE8010 capacity > 960
GB○ Kioxia CM6 all capacities○ Redtail NVMe all capacities○ Skhynix PE8110 capacity > 960
GB

Table 82. Thermal Solution Configuration with iDRAC
ConfigurationsRear drive
configurations

Processo Fan typer (TDP)

Heat sink Air
type
ShroudMemoryBlank

Processo Fanr Blank
CountsFanBlank

6 x 2.5inch
NVMe
Cold Aisle

without reardrives

TDP <=150 W

HPR GoldFan(VHP)

STD HSK

Yes

No

Only
requiredonprocessor
2 forConfiguration

7 x fans

No

4 x 3.5inch
driveswithout reardrives

TDP <=150 W

STD fan

STD HSKYes

No

150 W <
TDP <=205 W

STD fan

HPR HSK

TDP <=150 W

STD fan

STD HSK

Only
requiredonprocessor
2 for 1processor
Configuration

7 x fansfor 2
processor
s and
1xProcessor + Rear
HDD
Configura
tion

Only
requiredon fanSlot 1 andslot 2 for
5x Fans
configuration

150 W <
TDP <=
250 W

with rear dries

150 W <
TDP <=
205 W
8 x 2.5without rearinch SAS/ drives
SATA
drivesHPR HSKYes

HPR HSK

TDP <=150 W

STD fan

STD HSK

150 W <
TDP <=
205 W

**STD
fan

HPR HSK

205 W <
TDP <=225 W

HPR GoldFan(VHP)

HPR HSKNo

5 x fans
for 1
processorsConfiguration + W/
O RearHDDs
ConfigAppendix C: Additional specifications

87

Table 82. Thermal Solution Configuration with iDRAC (continued)
ConfigurationsRear drive
configurations

Processo Fan typer (TDP)

Heat sink Air
type
ShroudMemoryBlank

8 x 2.5with rear dries
inch SAS/
SATA
drives

TDP <=150 W

HPR GoldFan(VHP)

STD HSKYes

10 x 2.5inch
SAS3/
SATA
driveswithout reardrives

TDP <=150 W

STD fan

STD HSK

150 W <
TDP <=225 W

HPR GoldFan(VHP)

HPR HSK

10 x 2.5inch
SAS4/
SATA
driveswithout reardrives

TDP <=150 W

HPR GoldFan(VHP)

STD HSKHPR GoldFan(VHP)

STD HSKHPR GoldFan(VHP)

STD HSKHPR GoldFan(VHP)

STD HSKSTD fan

STD HSK

150 W <
TDP <=
225 W

150 W <
TDP <=
225 W
with rear dries

TDP <=
150 W
150 W <
TDP <=
225 W

8 and 10 x without rear
2.5-inchdrivesNVMedrives

TDP <=
150 W

8 and 10 x with rear dries
2.5-inchNVMedrives

TDP <=
150 W

No
without rear
Backplane drives

TDP <=
150 W

150 W <
TDP <=
225 W

150 W <
TDP <=
225 W

150 W <
TDP <=
250 W

Processo Fanr Blank
CountsFanBlank

HPR HSKNo

No

HPR HSKYes

HPR HSKYes

HPR HSKYes

HPR HSKNo

HPR HSKNOTE:* Based on test result, 4x3.5 config could only support CPU TDP up to 205W and DDR5 DIMM up to 12W (96GB)** Intel 6434/6526Y/6534 CPU Base TDP 205 W should use HPR Gold (VHP) Fan

Table 83. Thermal Solution Configuration with iDRAC with TDP > 205 W, 225 W
Configura Rear
tions
drive
configurations
3.5-inch
HDDs x2(3.5-inch
HDDs x4

88

Processor Fan type
(TDP)

205W
W/O RM<TDP<=
SupportPCIe Slot 1 250W
+ OCP3.0

Brickfielde
r Fan
(STD)

Appendix C: Additional specifications

Heat sinktype

Air
ShroudMemoryBlank

Processor Fan
Blank
CountsHPR HSYesNo

Yes for 1x
Processor
configFan Blank

5x Fans
Yes for 5xfor
Fans
1xProcesso Config. @Table 83. Thermal Solution Configuration with iDRAC with TDP > 205 W, 225 W (continued)
Configura Rear
tions
drive
configurations
configremoveHDD 2 & 3
andreplace by
HDD
blank)

Only (noBOSS &
PCIe slot 2
and 3)

2.5-inch
SAS3/
SATA x4(2.5-inch
SAS3/
SATAx8
configremoveHDD 4 ~ 7
andreplace by
SM blank)

without
rear drives

2.5-inch
SAS3/
SATA 6(2.5-inch
SAS3/
SATAx10
configremoveHDD 6 ~ 9andreplace by
SM blank)

Processor Fan type
(TDP)

Heat sinktype

Air
ShroudMemoryBlank

No for 2x
Processor
Configwith RM

Yes
225W<TDP<=250W

HPR Gold HPR HS
Fan (VHP)

without
rear drives

225W<TDP<=250W

HPR Gold HPR HS
Fan (VHP)

No

2.5-inch
NVME x4(2.5-inch
NVMex10
configremoveHDD 4 ~ 9andreplace by
SM blank)

without
rear drives

225W<TDP<=250W

HPR Gold HPR HS
Fan (VHP)

Yes

2.5-inch
SAS4/
SATA x6(2.5-inch
SAS4/
SATAx10
configremoveHDD 6 ~ 9andreplace by
SM blank

without
rear drives

225W<TDP<=250W

HPR Gold HPR HS
Fan (VHP)

with reardrieswith reardrieswith reardries

Processor Fan
Blank
CountsNo
Yes

Fan Blank

r + W/O
Fan slot 1
Rear HDDs and 2 for
Config5x Fans
configurati
7x Fans for on
2xProcessors Config
and
1xProcesso
r + Rear
HDD
Config

Yes

No
Yes

Appendix C: Additional specifications

89

Table 84. Thermal Solution Configuration with OSM
Configu
rations

Rear drive
Process
configuration or
s
(TDP)

Fan
type

Heat
sink
type

6 x 2.5inch
NVMe
Cold
Aisle

without reardrives

HPRGold Fan(VHP)

STD HSK Yes

HPRGold Fan(VHP)

STD HSK Yes

HPRGold Fan(VHP)

STD HSK Yes

HPRGold Fan(VHP)

STD HSK Yes

HPRGold Fan(VHP)

STD HSK Yes

HPRGold Fan(VHP)

STD HSK Yes

TDP <=150 W

STD Fan

STD HSK Yes

150 W <
TDP <=205 W

HPR
Gold Fan
(VHP)

HPR
HSK

TDP <=150 W

HPR
Gold Fan(VHP)

STD HSK Yes

TDP <=
150 W
150 W <
TDP <=
250 W

No
without rear
Backplan drivese

TDP <=
150 W

8 x 2.5inch
drivesSAS3/
SATA

without reardrives

TDP <=
150 W

8 x 2.5inch
drivesSAS3/
SATA

with rear dries

150 W <
TDP <=
250 W

150 W <
TDP <=205 W
TDP <=
150 W
150 W <
TDP <=
205 W*4 x 3.5- without rearinch
drivesdriveswith rear dries

TDP <=
150 W
150 W <
TDP <=205 W
TDP <=
150 W
150 W <
TDP <=
185 W

10 x 2.5inch
drivesSAS4/
SATA

without reardrives

10 x 2.5inch
drivesSAS4/
SATA

with rear dries

90

150 W <
TDP <=
205 W

Appendix C: Additional specifications

Air Shroud

MemoryBlank

Processor
Blank

Fan
CountsNo

Onlyrequired onprocessor 2
for 1
processor
Configuration

7 x Fans for No
all
Configurati
ons

No

Only
required onprocessor 2
for 1
processor
Configuration

7 x Fans for No
all
Configurati
ons

No

Only
required onprocessor 2
for 1
processor
Configuration

7 x Fans for No
all
Configurati
ons

Yes

Only
required onprocessor 2
for 1
processor
Configuration

7 x Fans for No
all
Configurati
ons

No

Only
required onprocessor 2
for 1
processor
Configuration

7 x Fans for No
all
Configurati
ons

Yes

Only
required onprocessor 2
for 1
processor
Configuration

7 x Fans for No
all
Configurati
ons

No

Only
required onprocessor 2
for 1
processor
Configuration

7 x Fans for No
all
Configurati
ons

Yes

Only
required onprocessor 2
for 1
processor

7 x Fans for No
all
Configurati
ons

HPR
HSK

HPR
HSK

HPR
HSK

HPR
HSK

HPR
HSK

HPR
HSK

HPR
HSK

Fan
Blank

Table 84. Thermal Solution Configuration with OSM (continued)
Configu
rations

Rear drive
Process
configuration or
s
(TDP)

Fan
type

Heat
sink
type

Air Shroud

MemoryBlank

Processor
Blank

Fan
CountsFan
Blank

Configuration
8 x 2.5inch
NVMe

without reardrives8 x 2.5inch
NVMewith rear dries

10 x 2.5inch
SAS3/
SATA
driveswithout reardrives

10 x 2.5inch
NVMe
driveswithout reardrives

10 x 2.5inch
NVMe
driveswith rear dries

TDP <=
150 W
150 W <
TDP <=205 W
TDP <=
150 W
150 W <
TDP <=205 W
TDP <=
150 W
150 W <
TDP <=205 W
TDP <=
150 W
150 W <
TDP <=205 W
TDP <=
150 W
150 W <
TDP <=205 W

HPR
Gold Fan(VHP)

STD HSK Yes

HPRGold Fan(VHP)

STD HSK Yes

HPRGold Fan(VHP)

STD HSK Yes

HPRGold Fan(VHP)

STD HSK Yes

HPRGold Fan(VHP)

STD HSK Yes

Yes

Only
required onprocessor 2
for 1
processor
Configuration

7 x Fans for No
all
Configurati
ons

Yes

Only
required onprocessor 2
for 1
processor
Configuration

7 x Fans for No
all
Configurati
ons

No

Only
required onprocessor 2
for 1
processor
Configuration

7 x Fans for No
all
Configurati
ons

Yes

Only
required onprocessor 2
for 1
processor
Configuration

7 x Fans for No
all
Configurati
ons

Yes

Only
required onprocessor 2
for 1
processor
Configuration

7 x Fans for No
all
Configurati
ons

HPR
HSK

HPR
HSK

HPR
HSK

HPR
HSK

HPR
HSK

Table 85. Thermal Solution Configuration with OSM with TDP > 185 W, 205 W, 225 W
Configura Rear
tions
drive
configurations
3.5-inch
HDDs x2(3.5-inch
HDDs x4
configremoveHDD 2 & 3
andreplace by
HDD
blank)

Processor Fan type
(TDP)

W/O RM
205W
Support<TDP<=
PCIe Slot 1 250W
+ OCP3.0
Only (noBOSS &
PCIe slot 2
and 3)

Brickfielde
r Fan
(STD)

with reardrivesBrickfielde
r Fan
(STD)

185W
<TDP<=
225W

Heat sinktype

Air
ShroudMemoryBlank

Processor Fan
Blank
CountsHPR HSYesNo

Yes for 1x
Processor
configFan Blank

7 x Fans
Nofor allConfigurations

No for 2x
Processor
Config
HPR HSYes

Appendix C: Additional specifications

91

Table 85. Thermal Solution Configuration with OSM with TDP > 185 W, 205 W, 225 W (continued)
Configura Rear
tions
drive
configurations
2.5-inch
SAS3/
SATA x4
2.5-inch
SAS3/
SATAx8
configremoveHDD #4 ~#7 andreplace by
SM blank

without
rear drives
with reardrivesProcessor Fan type
(TDP)

Heat sink
type

205W
<TDP<=250W

HPR Gold HPR HS
Fan (VHP)

Air
ShroudMemory
Blank

No
Yes

2.5-inch
SAS3/
SATA x6(2.5-inch
SAS3/
SATAx10
configremoveHDD 6 ~ 9andreplace by
SM blank)

without
rear drives

225W<TDP<=250W

HPR Gold HPR HS
Fan (VHP)

No

2.5-inch
SAS4/
SATA x6

without
rear drives

205W<TDP<=250W

HPR Gold HPR HS
Fan (VHP)

No

205W<TDP<=250W

HPR Gold HPR HS
Fan (VHP)

Yes

205W
<TDP<=250W

HPR Gold HPR HS
Fan (VHP)

Yes

2.5-inch
SAS4/
SATAx10
configremoveHDD #6 ~#9 andreplace by
SM blank

with reardrives2.5-inchwithout
NMVe x4
rear drives(2.5-inch
NVMe x10,
2.5 -inch
NVMex8
configremoveHDD 4 ~ 9andreplace by
SM blank)
2.5-inch
NVMe x4

with reardrivesYes

2.5-inch
NVMe x102.5-inch

92

Appendix C: Additional specifications

Processor Fan
Blank
CountsFan Blank

Table 85. Thermal Solution Configuration with OSM with TDP > 185 W, 205 W, 225 W (continued)
Configura Rear
tions
drive
configurations

Processor Fan type
(TDP)

Heat sinktype

Air
ShroudMemoryBlank

Processor Fan
Blank
CountsFan Blank

NVMe x8
configremoveHDD #5 ~#9 andreplace by
SM blank
NOTE: * Based on test result, 4x3.5 config could only support CPU TDP up to 205W and DDR5 DIMM up to 12W (64G)

HS5610 Thermal Restriction (OSM)
Rear NVMe /SAS/SATA drives Thermal Restriction
The following NVMe /SAS drives could NOT support in RM . (But could support in front SM)
●
●
●
●
●
●
●
●

Samsung PM1735a/PM1735 Capacities > 6.4TB in all configs.
Samsung PM1733a/PM1733 Capacities > 7.68TB in all configs.
Skhynix PE8010 Capacity >960GB in 3.5-inch config.
Skhynix PE8010 Capacity >1.92TB in 2.5-inch config.
Kioxia CM6 all capacities in all configs.
Kioxia PM6 SAS all capacities in all configs.
Redtail NVMe all capacities in all configs.
Hynix SATA SSD SE5031 all capacities or SSD with thermal spec <70C.

Optic Transceiver Restriction
Optic transceiver with thermal spec 85C are required for all PCIe and OCP3.0 NIC cards in OSM system.

Appendix C: Additional specifications

93

16
Appendix D: Service and support
Topics:••Default support levels
Other services and support information

Default support levels
This system offers 3 years Dell ProSupport Next Business Day (NBD), including 24x7 phone support and NBD parts and laborsupport.

Default deployment levels
This system is defaulted to the ProDeploy Dell Server which includes onsite hardware installation and remote software
configuration. Optionally, the customer may choose to any of the factory or field deployment offers listed below.

Other services and support information
Dell Technologies Services include a wide, customizable range of service options to simplify the assessment, design,
implementation, management and maintenance of IT environments and to help transition from platform to platform.
Depending on the current business requirements and correct level of service for customers, we provide factory, onsite, remote,modular, and specialized services that fit the customer requirements and budget. We will help with a little or a lot, based on thecustomers choice, and provide access to our global resources.

Dell deployment services
Dell ProDeploy Infrastructure Suite
ProDeploy Infrastructure Suite provides a variety of deployment offerings that satisfy a customer's unique needs. It is madeup of 5 offers: ProDeploy Configuration Services, ProDeploy Rack Integration Services, Basic Deployment, ProDeploy, andProDeploy Plus.

94

Appendix D: Service and support

Figure 41. ProDeploy Infrastructure Suite for servers
The new Factory Services consist of two tiers of deployment that happen prior to shipping to the customer's site.
Factory Based Services:● ProDeploy Factory Configuration - Ideal for customers buying servers in volume and seeking pre-configuration prior toshipping such as: custom image, system settings, and asset tagging so it arrives ready to use out of the box. Furthermore,servers can be packaged and bundled to meet specific shipping and distribution requirements for each customer location tofacilitate the rollout process. Upsell one of the field based services (below) if a customer needs assistance with the final
server installation.
● ProDeploy Rack Integration - Ideal for customers seeking to build out fully integrated racks prior to shipping. These rackbuilds include hardware install, cabling, and full system configuration. You can also add-on a factory stress test and optional
on-site final rack configuration to complete the rack installation.
○ STANDARD SKUs for Rack Integration is available in US only and requires:￭ 20 or more devices (R and C series servers and all Dell or non-Dell switches). Use Informational SKUs for Dellswitches or 3rd party products￭ Shipping to contiguous US○ USE CUSTOM QUOTE for Rack Integration for:￭ All countries except USA￭ Racks containing less than 20 servers￭ Any rack that includes VxRail or Storage￭ Shipping outside contiguous US￭ Shipping to multiple locations
Field Based Services:● Basic Deployment consists of the hardware installation, cabling and firmware update during normal standard business hours.
Basic Deployment is traditionally sold to Competency Enabled Partners. Competency enabled partners often have Dell do thehardware installation while they complete the software configuration.
● ProDeploy consists of your hardware installation and configuration of the software using offshore resources. ProDeploy isgreat for customers who are price sensitive or who are remote from their data centers and don't require an onsite presence.
● ProDeploy Plus will give you in-region or onsite resources to complete the engagement for the customer. It also comes withadditional features such as Post Deployment Configuration Assistance and Training Credits.

Appendix D: Service and support

95

Figure 42. ProDeploy Infrastructure Suite - Factory services

Figure 43. ProDeploy Infrastructure Suite - Field services

Dell ProDeploy Plus for Infrastructure
From beginning to end, ProDeploy Plus provides the skill and scale that is must successfully perform demanding deployments intoday's complex IT environments. Certified Dell experts start with extensive environmental assessments and detailed migration

96

Appendix D: Service and support

planning and recommendations. Software installation includes set up of our enterprise connectivity solution (secure connect
gateway) and OpenManage system management utilities.
Postdeployment configuration assistance, testing, and product orientation services are also available.

Dell ProDeploy for Infrastructure
ProDeploy provides full-service installation and configuration of both server hardware and system software by certified
deployment engineers including set up of leading operating systems and hypervisors as well our enterprise connectivity solution(secure connect gateway) and OpenManage system management utilities. To prepare for the deployment, we conduct asite readiness review and implementation planning exercise. System testing, validation, and full project documentation withknowledge transfer complete the process.

Dell Basic Deployment
Basic Deployment delivers worry-free professional installation by experienced technicians who know Dell servers inside and out.

Additional Deployment Services
You can tailor the ProDeploy Infrastructure Suite offer to meet your customer's unique needs by leveraging "Additional
Deployment Time." ADT will cover additional tasks above the normal scope of the standard offers. ADT can be sold for ProjectManagement or Technical Resources and is sold as blocks of four hours remote or eight hours on-site.

Dell ProDeploy for HPC (available in US/Canada only. All other regions use custom)
HPC deployments require specialists that understand that cutting edge is yesterday's news. Dell deploys the world 's fastest
systems and understands the nuances that make them perform. ProDeploy for HPC provides:● Global team of dedicated HPC specialists● Proven track record, thousands of successful HPC deployments● Design validation, benchmarking, and product orientation
Learn more at Dell.com/HPC-Services.

Appendix D: Service and support

97

Figure 44. ProDeploy Expansion for HPC

Dell custom deployment Services
Dell custom rack integration and other Dell configuration services help customers save time by providing systems that are
racked, cabled, tested, and ready to be integrated into the data center. Dell support preconfigure RAID, BIOS and iDRAC
settings, install system images, and even install third-party hardware and software.
For more information, see Server Configuration Services.

Dell Residency Services
Residency Services help customers transition to new capabilities quickly with the assistance of onsite or remote Dell experts
whose priorities and time they control.
Residency experts can provide post implementation management and knowledge transfer that is related to a new technology
acquisition or day-to-day operational management of the IT infrastructure.

Dell Data Migration Services
Protect business and data of the customer with our single point of contact to manage data migration projects.
A customer project manager works with our experienced team of experts to create a plan using industry-leading tools andproven processes that are based on global best practices to migrate existing files and data, so business systems are up andrunning quickly and smoothly.

98

Appendix D: Service and support

Dell Enterprise Support Services
Dell ProSupport Enterprise Suite
With the ProSupport Enterprise Suite, we help keep IT systems running smoothly, so customers can focus on running theirbusiness. We help maintain peak performance and availability of the most essential workloads. ProSupport Enterprise Suite is asuite of support services that enable customers to build the solution that is right for their organization. They choose supportmodels that are based on how they use technology and where they want to allocate resources. From the desktop to the data
center, address everyday IT challenges, such as unplanned downtime, mission-critical needs, data and asset protection, support
planning, resource allocation, software application management and more. Optimize customer IT resources by choosing the rightsupport model.

Table 86. ProSupport Enterprise Suite
Service

Support model

Description

ProSupport Enterprise Suite

ProSupport Plus for Enterprise

Proactive, predictive, and reactive
support for systems that look after
your business-critical applications andworkloads

ProSupport for EnterpriseComprehensive 24 x 7 predictive andreactive support for hardware andsoftware

Basic hardware support

Reactive hardware support during
normal business hours

Dell ProSupport Plus for Enterprise
When customers purchase PowerEdge server, we recommend ProSupport Plus, our proactive and preventative support service
for business-critical systems. ProSupport Plus provides all the benefits of ProSupport, plus the following:● An assigned Services Account Manager who knows their business and environment● Immediate advanced troubleshooting from an engineer● Personalized, preventive recommendations that are based on analysis of support trends and best practices from across theDell Technologies infrastructure solutions customer base to reduce support issues and improve performance● Predictive analysis for issue prevention and optimization that is enabled by secure connect gateway technology● Proactive monitoring, issue detection, notification, and automated case creation for accelerated issue resolution enabled by
secure connect gateway● On-demand reporting and analytics-based recommendations that are enabled by secure connect gateway and TechDirect

Dell ProSupport for Enterprise
ProSupport service offers highly trained experts around the clock and around the globe to address IT needs. We help minimize
disruptions and maximize availability of PowerEdge server workloads with:
●
●
●
●
●
●

24x7 support through phone, chat and online
Predictive, automated tools and innovative technology
A central point of accountability for all hardware and software issues
Collaborative third-party support
Hypervisor, operating system and application support
Consistent experience regardless of where customers are located or what language they speak
NOTE: Subject to service offer country or region availability.

● Optional onsite parts and labor response options including next business day or four-hour mission critical

Appendix D: Service and support

99

Figure 45. ProSupport Enterprise Suite

Dell ProSupport One for Data Center
ProSupport One for Data Center offers flexible site-wide support for large and distributed data centers with more than 1,000
assets. This offering is built on standard ProSupport components that leverage our global scale but are tailored to a customer's
needs. While not for everyone, this service option offers a truly unique solution for Dell Technologies largest customers with themost complex environments.
●
●
●
●
●

Team of assigned Services Account Managers with remote, on-site options
Assigned ProSupport One technical and field engineers who are trained on the customer’s environment and configurations
On-demand reporting and analytics-based recommendations that are enabled by secure connect gateway and TechDirect
Flexible on-site support and parts options that fit their operational model
A tailored support plan and training for their operations staff

Dell ProSupport Add-on for HPC
The ProSupport Add-on for HPC provides solution-aware support including:●●●●Access to senior HPC experts
Advanced HPC cluster assistance: performance, interoperability, and configuration
Enhanced HPC solution level end-to-end support
Remote presupport engagement with HPC Specialists during ProDeploy implementation

Learn more at Dell.com/HPC-Services.

100

Appendix D: Service and support

Figure 46. ProSupport Add-on for HPC is an add-on to PS or PSP

Support Technologies
Powering the support experience with predictive, data-driven technologies.
NOTE: SupportAssist Enterprise capabilities are now part of the secure connect gateway technology.

Enterprise connectivity
The best time to solve a problem is before it happens. The automated proactive and predictive support features enabled by the
secure connect gateway technology helps reduce steps and time to resolution, often detecting issues before they become acrisis. The gateway technology is available in virtual and application editions. It is also implemented as a direct connect version
for select Dell hardware and a Services plugin within OpenManage Enterprise for PowerEdge servers. The legacy SupportAssist
Enterprise solution has been retired and is now replaced by the secure connect gateway solutions.
Benefits include:●●●●

Value: Our connectivity solutions are available to all customers at no additional charge
Improve productivity: Replace manual, high-effort routines with automated support
Accelerate time to resolution: Receive issue alerts, automatic case creation, and proactive contact from Dell experts
Gain insight and control: Optimize enterprise devices with insights in portals reporting like TechDirect, and get predictive
issue detection before the problem starts
NOTE: Connect devices can access these features. Features vary depending on the service level agreement for theconnected device. ProSupport Plus customers experience the full set of automated support capabilities.

Table 87. Features enabled by connectivity—

Basic hardware
warranty

ProSupport

ProSupport Plus

Automated issue detection and system
state information collection

Supported

Supported

Supported

Proactive, automated case creation andnotification

Not supported

Supported

Supported

Appendix D: Service and support101

Table 87. Features enabled by connectivity (continued)—

Basic hardware
warranty

ProSupport

ProSupport Plus

Predictive issue detection for failure
prevention

Not supported

Not supported

Supported

Get started at DellTechnologies.com/secureconnectgateway.

Dell TechDirect
TechDirect helps boost IT team productivity when supporting Dell systems.
Boost your productivity with online servoce for Dell products from TechDirect. From deployment to technical support,
TechDirect lets you do more with less effort and faster resolution. You can:
●
●
●
●
●
●

OPen and manage support requests or in-warranty systems
Execute online self-service for parts dispatch
Collaborate on ProDeploy infrastructure deployment projects online
Manage proactive and preditive alerts from secure connect gateway technology that help maximize uptime
Integrate services functionality into your help desk with TechDirect APIs
Join over 10,000 companies that choose TechDirect

Register at TechDirect.Dell.com.

Dell Technologies Consulting Services
Our expert consultants help customers transform faster, and quickly achieve business outcomes for the high value
workloads Dell PowerEdge systems can handle. From strategy to full-scale implementation, Dell Technologies Consulting canhelp determine how to perform IT, workforce, or application transformation. We use prescriptive approaches and provenmethodologies that are combined with portfolio and partner ecosystem of Dell Technologies to help achieve real businessoutcomes. From multi cloud, applications, DevOps, and infrastructure transformations, to business resiliency, data center
modernization, analytics, workforce collaboration, and user experiences-we are here to help.

Dell Managed Services
Some customers prefer Dell to manage the complexity and risk of daily IT operations, Dell Managed Services utilizes proactive,
AI enabled delivery operations and modern automation to help customers realize desired business outcomes from theirinfrastructure investments. With these technologies, our experts run, update and fine-tune customer environments alignedwith service levels, while providing environment-wide and down-to-the-device visibility. There are two types of managed service
offers. First the outsourcing model or CAPEX model where Dell manages the customer owned assets using our people andtools. The second is the as-a-Service model or OPEX model called APEX. In this service, Dell owns all technology and all the
management of it. Many customers will have a blend of the two management types depending on the goals of the organization.

102

Appendix D: Service and support

Figure 47. Dell Managed Services

Dell Technologies Education Services
Build the IT skills required to influence the transformational outcomes of the business. Enable talent and empower teams withthe right skills to lead and perform transformational strategy that drives competitive advantage. Leverage the training andcertification required for real transformation.
Dell Technologies Education Services offers PowerEdge server training and certifications that are designed to help customers
achieve more from their hardware investment. The curriculum delivers the information and the practical, firsthand skills that
their team must confidently install, configure, manage, and troubleshoot Dell servers.
To learn more or register for a class today, see Education.Dell.com.

Appendix D: Service and support

103