Introducing process inverse problem analysis software
Yasunori Suzuki, Group Leader, Mathematical Systems, Inc.
• Mask data file output (the format conforms to theframework)• Process recipe file output (the format conforms tothe framework)

PurposeIn designing MEMS devices, the design of themasks used in the processes is a major task, while atthe same time, it involves very difficult problems. A
skilled practitioner who has a thorough knowledge ofMEMS can use their experience and knowledge toestablish the necessary processes. However, for abeginner, it is very difficult to draw a MEMS pattern
while thinking through the processes, and it is not
unusual to draw patterns that are impossible.
This software facilitates design by resolving thedifficult problems of MEMS device design whileproviding the user with guidance, and it is expected to
be an effective learning tool especially for MEMS
beginners.

To enable the user to perform analysis easily, thesettings can be performed using a wizard (thescreenshot shows a prototype).

Functions
The software has the following functions for
performing inverse problem analysis.
• Load MEMS device pattern (top, cross section) files• Specify MEMS device pattern dimensions• Set process conditions (equipment used, processes etc.)• Inverse process guidance for MEMS device patterns• Framework linkage

State of development
Following specification development last year, thesoftware is now in the development phase. The firststage of development will be completed this year, andthe  version is scheduled for release in 2006.

Introducing about package bonding analysis software
Yinsheng Li, Senior Manager, Social Technology Office
Engineering Services Department, Mizuho Information & Research Institute, Inc.
Bonding technology is a technology that is used for
MEMS processes and packaging. When dissimilarmaterials are bonded, damage to the bonded interface
and edges may occur due to the influence ofdifferences in the physical properties of the dissimilarmaterials such as their Young's modulus, Poisson's
ratio, coefficient of thermal expansion and so on, andthe geometric configuration of the bonded edges, thematerials and dimensions of the intermediate layers
and other factors.

The package bonding analysis software supports
the design and development of MEMS that may
experience this kind of problem. It includes a materialcompatibility analysis function for evaluating thestress singularity at bonded edges, a function foranalyzing the deformation and temperature history
and inheritance arising from changes in the materialand form, a reliability analysis function for evaluatingbond strength.

Development of original Japanese analysis functions
Higher functionality, performance and reliability for MEMS products
Practical systems organically linked to material and process databases
Material &process database

Configuration &dimensions ofthe bonded structure

Dissimilar material
bonding compatibility

Judgment of theSiugularity stresscharacteristics

Distribution &time history oftemperature & stress

History of changes
in the form & material

Environmental factors &atmosphereResponse analysis
corresponding
to temperature change

Reliability
analysis

Selection of bonded
materials and bonding
conditions

Influence ofintermediate layers
and adhesion layers

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Heat &loading history

Fatigue life