2024 新機能材料展パネル 【電子・半導体 G】
A1：w594×h841mm

Development
product

Heat resistant dicing sheet

A UV-curable dicing sheet with excellent heat resistancethat can be used in semiconductor manufacturing processes.

PEN typeadhesive strength[N/25 mm]
PEN ﬁlm
UV curing adhesive

50 μm
20 μm

release ﬁlm

initial state

13.0

after UV curing

0.06

heating+ UV curing

0.10※Properties are not guaranteed values.

adhesive strength [N/25 mm]

141210Even if heated at 260℃ for 1 minute,the adhesive strength after UV
will decrease to the same levelas without heating.

86420

nitial state

after UV curing

heating+ UV curing

adhesive strength[N/25 mm]

PVC type
PVC ﬁlm(Gloss or matte selectable)

UV curing adhesive

80 μm
10 μm

release ﬁlm

Competitor's
product①【 Adhesive strength after 1 hour at 120℃ 】
adhesive strength [N/25 mm]

7Competitor's
product②

4.9

1.5

4.0

3.8

6.1

5.6

※Properties are not guaranteed values.
※Additional properties
adhesive strength before heating [N/25mm]
initial state：3.7, after UV curing：0.2
breaking strength[N/10mm]=29.6 elongation rate[%]=3406543210Development
product

only heating

heating+ UV curing

Development
product■ only heating

Competitor's
product①■ heating + UV curing

Competitor's
product②

UV curing performance does notdeteriorate even when heated at
120℃ for 1 hour.
And it has higher heat resistancethan other companies' products.

修正なし

2024 新機能材料展パネル 【電子・半導体 G】
A1：w594×h841mm

UV-LED compatible
dicing sheet

Development
product

A sheet for semiconductor processingthat is compatible with UV-LED irradiation equipment.
Structurevarious ﬁlms
UV curing adhesive

20 μm

release ﬁlm

123

Properties

Cost

Production costs can be reduced by extending the lifespanof LEDs and signiﬁcantly reducing power consumption.

Quality

By removing the eﬀects of infrared rays,
you can reduce heat damage and improve product quality.

Eﬃciency & Environment

UV-LED irradiation equipment

Immediate lighting improves work eﬃciency.
Additionally, since it is ozone-free and does not require exhaust equipment,
it also improves the production environment.

10adhesive strength [N/25 mm]

Features

86420

1 sec

5 sec

10 secUV-LED compatible product■ initial state■after UV curing

1 sec

5 sec

10 secnon-UV-LED compatible product※Properties are not guaranteed values.

Adhesive strength decreases with short irradiation

修正なし

2024 新機能材料展パネル 【電子・半導体 G】
A1：w594×h841mm

Development
product

Ultra-thin double-sided tape

Ultra-thin double-sided tape for electronic components with a total thickness of 10μm.
Structure

release ﬁlm
adhesive
carrier

Total thickness 10 μm（carrier+ adhesive）

adhesive

release ﬁlm

Features

1Although it is a very thin adhesive tape, it has strong adhesion.
In addition, since the carrier is ﬂexible and strong,so it has high followability.

2

It does not easily shift even under load and has excellent heat resistance.

3

Even when heated at high temperatures (180℃ to 200℃),
there is little discoloration and it is not noticeable even on white plates.
［180℃ ］

[initial state]［200℃ ］Development
product

Competitorʼs
product Ａ

Competitorʼsproduct B

adhesive strength [N/10 mm]

543210100

shear adhesive strength [N/cm²]

Properties【adhesive strength】

DevelopmentproductCompetitor's
product A

Competitor's
product B

Strong adhesive
even though it is thin【shear strength】

806040

■ 23℃

200

■ 40℃

■ 80℃
Development
product

Competitor's
product A

Competitor's
product B

Maintains high adhesion
even when heated※Properties are not guaranteed values.

2024 新機能材料展パネル 【電子・半導体 G】
A1：w594×h841mm

L o w D i el ectr i c Adhes ive

Developing

A low dielectric adhesive compatible with high frequency communication

Whatʼs low dielectric?
Evolution of mobile communication systems
1,2,3G

4G

5G

6G

770MHz 〜 3.5GHz〜100GHz100GHz 〜

2010

2020

2030

Transmission
loss

Frequency

Issue

High

low dielectoric material
Enables reduction oftransmission loss

Large

Applications

The adhesive is expected to be used in next-generation high-speed
communication components such as circuit boards and antennas.

Properties

Lower dielectric constant than our conventional products.
Possible to achieve both low dielectricity and adhesiveness.

■DielectricDevelopment
product

Conventional
product

18GHz

2.3

3.5

22GHz

2.0

Dk

25GHz

4.5
4
3.5

3.0

Dk

properties

5

2.5

2.9

1.9

measurement method: free space method■Adhesiveproperties

3structureConventional productDevelopment product

21.5

1823Frequency [GHz]adhesive strength[N/10mm]
P E T ﬁ lm

※low dielectric adhesive
release ﬁlm※Used only for measuring adhesive properties

25 μm
25 μm

Dk decrease

2.3

holding power[mm]0ball tuck [No.]7※Properties are not guaranteed values.

2024 新機能材料展パネル 【電子・半導体 G】
A1：w594×h841mm

Dielectric properties

Almost no frequency dependence, exhibits similar low dielectric properties
up to high frequencies
Structure

P P ﬁ lm

20 μm

P P ﬁ lm

20 μm

low dielectric adhesive30 μm※Structure for measurement.

Dielectric constant / Dissipation tangent
The following data was measured using the resonator method.

DielectricconstantDissipation
tangent

3GHz

15GHz

28GHz

60GHz

80GHz

2.39

2.32

2.38

2.38

2.38

0.013

0.011

0.011

0.011

0.011

※Measurement data arithmetically excludes the value of PP ﬁlm.
※Properties are not guaranteed values.

Split Post

Split Cylinder

3GHz、15GHz

28GHz、60GHz、80GHz