CONFERENCE
AT A GLANCESUNDAY
15 JANUARYMONDAY
16 JANUARY

08:00

Welcome Address(08:00 - 08:30)

08:30

IEEE Recognition(08:30 - 08:50)

09:00

Plenary I(08:50 - 09:35)

TUESDAY
17 JANUARYWEDNESDAY
18 JANUARYTHURSDAY
19 JANUARYPlenary II(08:30 - 09:15)

Plenary III(08:30 - 09:15)

Plenary IV(08:30 - 09:15)

Session I

Session V

Session IX

Novel MEMS/NEMS Devices
for Computing/Imaging

New Materials,
Fabrication, & Packaging

Optomechanics &Photonics Integration

10:00(09:35 - 10:35)(09:15 - 10:15)(09:15 - 10:00)

10:30

Break & Exhibits(10:35 - 11:05)

Break & Exhibits(10:15 - 10:45)

Break & Exhibits(10:00 - 10:30)

Session VI

Session X

Session XIV

RF MEMS Filters &Resonators (5G & 6G)

New Fabrication Techniques

Session II

Micro- and Nanofluidics& Medical Applications

BioMEMS I(10:45 - 12:00)(10:30 - 11:45)

Awards Ceremony(11:45 - 12:00)

Lunch & Exhibits(11:45 - 13:00)

Conference
Adjourns(12:00)

09:30

11:00
11:30

(11:05 - 12:20)
MEMS 2024 AnncMnt

12:00(12:00 - 12:15)

12:30
Lunch & Exhibits(12:20 - 13:45)

Lunch & Exhibits(12:15 - 13:15)

13:00

Session XIa
Session III

13:30

MEMS Inertial Sensors& Power MEMS

14:00
14:30
15:00

(13:45 - 14:45)

Industry
Session(13:00 - 17:00)

MEMS Fluidic Sensors

MEMS/NEMS
Resonators &Non-Linear
Dynamics(13:15 - 14:30)(13:00 - 14:00)

Session VII

Session XIb
BioSensors I(13:00 - 14:00)

PosterSession I(14:45 - 16:45)

PosterSession II(14:15 - 16:15)

PosterSession III(14:00 - 16:00)

Break & Exhibits(16:15 - 16:45)

Break & Exhibits(15:45 - 16:15)

Break & Exhibits(15:30 - 16:00)

15:30
16:00

MEMS Announcement

16:30(16:45 - 16:50)

Session XIIa

Session VIII
17:00
17:30
18:00
18:30

Conference
Registration& Check-In(17:00 - 19:00)
Welcome
Reception(17:00 - 19:00)

Sonics & Ultrasonics MEMS

Session IV(16:15 - 17:30)

21:00
21:30
22:00

BioSensors II(16:00 - 17:15)(16:00 - 17:15)

BioMEMS II

Adjourn for Day(17:30)Adjourn for Day(18:05)

19:30

20:30

Session XIIb

(16:50 - 18:05)

19:00

20:00

Force &
Displacement/Tactile
Sensors &Human-Machine

Banquetat theLöwenbräu
Keller(19:00 - 22:00)

Adjourn for Day(17:15)

Session XIII
Gas & Flow Sensors(09:15 - 10:15)
Break & Exhibits(10:15 - 10:45)(10:45 - 11:45)

TABLE OF
CONTENTS
Welcome Letter .................................................................................................................................................................................. 3
General Information & Social Events ................................................................................................................................................... 4
Organizing Committees ...................................................................................................................................................................... 5
MEMS Benefactors ............................................................................................................................................................................. 6
Exhibitors ............................................................................................................................................................................................ 8Media Benefactors ........................................................................................................................................................................... 10
Plenary Speakers ............................................................................................................................................................................. 11
Robert Bosch Award Recipient.......................................................................................................................................................... 11

TECHNICAL PROGRAM
Technical Program Information ........................................................................................................................................................ 12
Sunday Program .............................................................................................................................................................................. 13
Monday Program ............................................................................................................................................................................. 15
Tuesday Program ............................................................................................................................................................................. 19
Wednesday Program ........................................................................................................................................................................ 23
Thursday Program ........................................................................................................................................................................... 28
Poster Presentations ........................................................................................................................................................................ 29
Open Posters ................................................................................................................................................................................... 44
Conference Announcements ............................................................................................................................................................ 47
Meeting Space & Poster Floor Plans ................................................................................................................................................ 49

Victory Gate in Munich, Germany. Image by wdreblow0 from Pixabay.

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WELCOMELETTER
Welcome to the 36th IEEE International
Conference on Micro Electro Mechanical
Systems (MEMS 2023) in Munich, Germany!
The IEEE MEMS Conference series originated in 1987, and has been known as the IEEE International Conference on Micro Electro Mechanical
Systems since 1999. Over the last decade, the MEMS community has experienced immense progress in the science and technology ofminiaturization, as well as increasing technical maturity and commercialization of ever smarter products encompassing embedded artiﬁcial
intelligence and wireless connectivity to the Internet-of-Things. Since 2020, the conference is sponsored by the IEEE MEMS Technical Community,a new body within the IEEE dedicated to supporting and developing our MEMS community.
This Conference brings together annually the international MEMS community consisting of top players in academia and industry by providingthem with the latest results on every aspect of MEMS. The organizers this year made a special effort to attract technical contributions from industry,also showcased in the Industry Workshop. We hope that you will enjoy the presentations by our accomplished invited plenary speakers andstringently selected contributed oral and poster presentations.
We would like to express our sincerest gratitude to all the authors who submitted their abstracts. Their high-quality work serves as the foundation
for the success of this conference. A total of 314 papers out of 636 submitted abstracts were carefully selected by 47 experts comprising theTechnical Program Committee (TPC) using a well-established double-blind review process that ensures scientiﬁc quality as the sole selection
criterion. The TPC comprises academic and industrial members, with equal representation from three regional divisions: the Americas, Europe &Africa, and Asia & Oceania. To allow for more focused and careful deliberation, the actual abstract review process divided the overall TPC into
eight sub-committees, each with six members to evaluate and rate each abstract. We are grateful to all TPC members who volunteered theirvaluable time, including participation in a two-day virtual meeting last October, for paper selection.
The conference arranges presentation of accepted papers in a mixed single/parallel session format with 4 invited plenary, 70 oral, 238 poster
presentations, and 15 open poster presentations. In addition, the TPC collectively nominated, based on quality, abstract submissions as ﬁnalists
for the Outstanding Student Paper Awards and images for the Art in Microtechnology prize. These awards aim to recognize excellence amongst
work presented by students and will be announced in a special ceremony to conclude the conference late Thursday morning.
We gratefully acknowledge the industrial support groups, exhibitors, and benefactors for their contributions to this conference. The dedicated andrelentless effort of Ms. Sara Stearns and her team at PMMI in managing this conference is highly appreciated.
In closing, we hope you enjoy the networking, technical presentations, exhibition booths, and events of the 2023 IEEE International MEMS Conference
this week in Munich!

Núria Barniol
Universidad Autonoma Barcelona, SPAIN

Franz Lärmer
Robert Bosch GmbH, GERMANY

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GENERAL INFORMATION& SOCIAL EVENTSGENERAL INFORMATION
Wireless Internet
Wireless Internet will be available in the conference meeting rooms.
• Select “MEMS2023” from the list of available networks.
• Once prompted, the Conference code is: mems2023 (case sensitive).
We ask that you limit your usage to be considerate of other attendees and please logout once you are ﬁnished. There is a bandwidth limit of 2 Mbps per device.

Conference App
Please refer to the conference email you received for instructions on downloading the conference app.

Registration & Information Desk
The Registration and Information Desk will be open during the times listed below. All meeting rooms will close shortly after registration closes each day.
Sunday, 15 January .......................................................... 17:00 – 19:00
Monday, 16 January ......................................................... 07:00 – 18:05
Tuesday, 17 January ......................................................... 08:00 – 17:30
Wednesday, 18 January ................................................... 08:00 – 17:15
Thursday, 19 January ...................................................... 08:00 – 12:00

BreaksAll scheduled breaks will be held on all three ﬂoors of the SCCM. Coffee will be served during scheduled mid-morning and afternoon breaks only.

Cloak Room
There will be a cloak room open during Conference hours. The cloak room is located on the second ﬂoor in Orion 1. Please note that this room is unsecured. Leave personal
property at own risk.

Chimes
The chimes will ring ﬁve minutes before the end of each scheduled break. The sessions will begin on time, so please return to the sessions when you hear the chimes.

Name Badges
All attendees must wear their badge at all times to gain admission to all sessions, exhibits, and social functions.

Job Board
The Job Board will be located on the ground floor. See ﬂoor plan at the end of this program.

Cellular Phones and Alarms
As a courtesy to our speakers and other attendees, please silence any cellular phones and alarms during sessions.

Video Recording
Video recordings are strictly prohibited in the sessions, poster presentations and the exhibit area.

SOCIAL EVENTS
Wine and Cheese Welcome Reception
Sunday, 15 January
17:00 – 19:00
An informal Welcome Reception with be held in conjunction with registrationthroughout the SCCM. This will allow you the opportunity to enjoy
Munich with your colleagues for the remainder of the evening.

CONFERENCE BANQUET at the LÖWENBRÄU KELLER
Tuesday, 17 January
19:00 – 22:00
MEMS 2023 welcomes you to the Löwenbräu Keller. Munich’s tavern culture has been thriving at Löwenbräukeller(Löwenbräu Beer Cellar) on Stiglmaierplatz square for over 130 years. Marked by the distinctive lion sitting aboveits main entrance and the large tower with its green copper spire, Löwenbräukeller is just a few minutes awayfrom Munich Hauptbahnhof (central station) by foot. This traditional tavern houses a rustic restaurant and a historicbeer hall (Schwemme). This event is included in your registration. As of the printing of this program, there are a
few guest tickets remaining. Please visit the Onsite Conference Registration Desk for availability.

4

ORGANIZINGCOMMITTEESCONFERENCE Chairs
Núria Barniol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Universidad Autonoma Barcelona, SPAIN
Franz Lärmer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bosch, GmbH, GERMANY

International Steering Committee
Zhihong Li (Chair) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Peking University, CHINA
Shuji Tanaka (Chair) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tohoku University, JAPAN
Núria Barniol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Universidad Autonoma Barcelona, SPAIN
Karen Cheung . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . University of British Columbia, CANADA
Philip Feng . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . University of Florida, USA
David Horsley . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . University of California, Davis, USA
Hyunjoo Jenny Lee . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Korea Advanced Institute of Science and Technology (KAIST), KOREA
Sheng-Shian Li . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . National Tsing Hua University, TAIWAN
Wen Li . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Michigan State University, USA
Zhihong Li . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Peking University, CHINA
Franz Lärmer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bosch, GmbH, GERMANY
Niclas Roxhed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . KTH Royal Institute of Technology, SWEDEN
Shuji Tanaka . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tohoku University, JAPANDana Weinstein . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purdue University, USA
Haixia “Alice” Zhang . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Peking University, CHINA

Executive Technical Program Committee
Taeko Ando . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ritsumeikan University, JAPAN
Cédric Ayela . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CNRS, FRANCE
Nuria Barniol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Universitat Autonoma de Barcelona, SPAIN
Sarah Bedair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . US Army Research Laboratory, USA
Cristian Cassella . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Northeastern University, USA
Eric Chiou . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . University of California, Los Angeles, USA
Caroline Coutier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CEA-Leti, FRANCE
Philip Feng . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . University of Florida, USA
Irene Fernandez-Cuesta . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . University of Hamburg, GERMANY
Frank Goldschmidtboeing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . University Freiburg, GERMANY
Songbin Gong . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . University of Illinois, USA
Nicole Hashemi . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Iowa State University, USA
Fatimah Ibrahim . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . University Malaya, MALAYSIA
Nathan Jackson . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . University of New Mexico, USA
Michael Kraft . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . KU Leuven, BELGIUM
Franz Laermer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Robert Bosch GmbH, GERMANY
Hyunjoo Jenny Lee . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Korea Advanced Institute of Science and Technology (KAIST), KOREA
Thierry Leichle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CNRS, USA
Sheng-Shian Li . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . National Tsing Hua University, TAIWAN
Wen Li . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Michigan State University, USA
Zhihong Li . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Peking University, CHINA
Andreu Llobera . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Silicon Austria Labs, AUSTRIA
Ruochen Lu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . University of Texas, Austin, USA
Michel Maharbiz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UC Berkeley / iota Biosciences, USA
Jianmin Miao . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Shanghai Jiaotong University, CHINA
Hiroshi Miyajima . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Sumitomo Precision Products Co., Ltd., JAPANMina Rais-Zadeh . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NASA JPL, USA
Niclas Roxhed . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .KTH Royal Institute of Technology, SWEDEN
Jose-Luis Sanchez-Rojas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Universidad de Castilla - La Mancha, SPAIN
Hamed Sattari . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CSEM, SWITZERLAND
Takaaki Suzuki . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gunma University, JAPANMassood Tabib-Azar . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . University of Utah, USA
Shuji Tanaka . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tohoku University, JAPAN
Sindy Tang . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Stanford University, USA
Jaume Verd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . University of the Balearic Islands, SPAIN
Guillermo Villanueva . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EPFL, SWITZERLAND
Sandra Vos . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . NXP, USA
Fei Wang . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SUSTech, CHINA
Dana Weinstein . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Purdue University, USA
Anders Wolff . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Technical University of Denmark DTU, DENMARK
Guoqiang Wu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Wuhan University, CHINA
Yao-Joe Yang . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . National Taiwan University, TAIWAN
Shinya Yoshida . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Shibaura Institute of Technology, JAPANRoland Zengerle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hahn-Schickard & University of Freiburg, GERMANY
Siyang Zheng . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Carnegie Mellon University, USA
Rong Zhu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tsinghua University, CHINA
Yao Zhu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Institute of Microelectronics, A*STAR, SINGAPORE

5

MEMS
BENEFACTORS
We gratefully acknowledge, at the time of printing this program, the financial support of this Conference from the following:

CONFERENCE SPONSORSIEEE – Institute of Electrical and Electronics Engineers
www.ieee.org

IEEE is the world’s largest technical professional organization dedicated to advancing technology for the benefit of humanity. IEEE and its members inspire a global community through its highly cited
publications, conferences, technology standards, and professional and educational activities.

IEEE MEMS Technical Community
ieeememstc.org

IEEE Micro Electro Mechanical Systems (MEMS) Technical Community will keep you abreast of the latest in MEMS ideas, designs, and manufacturing methodologies, many of which could very well spark new
thinking and enable new capabilities in a myriad of IEEE fields. MEMS is an enabling technology harnessing the benefits of miniaturization in physical domains beyond the electrical and found in billions ofdevices today. The field of MEMS encompasses tiny (generally chip-scale) devices or systems capable of realizing functions not easily achievable via macroscopic ones. Many IEEE organizational units alreadybenefit from MEMS, as the utility of its fundamental concepts and technology touches nearly all IEEE field of interest areas.

BENEFACTORSDIAMOND BENEFACTORS
Robert Bosch GmbH
Reutlingen, GERMANY
phone: +49-7121-3530-531
arno.stoetzler@de.bosch.com
www.bosch-sensortec.com
www.bosch-semiconductors.com
Bosch specializes in designing microelectronics for the automotive and consumer world. The portfolio for automotive includes high-performance inertial and pressure sensors, embedding the vast experienceof Bosch as a system supplier. The portfolio for consumer electronics includes 3-axis accelerometers, gyroscopes and magnetometers, integrated 6- and 9-axis sensors, smart sensors, barometric pressure
sensors, humidity sensors, gas sensors, optical microsystems and comprehensive software.

SUSS MicroTec Solutions GmbH & Co. KG
Garching, GERMANY
Phone: +49-89-3200-7397
info@suss.com
www.suss.com
SUSS MicroTec is a leading manufacturer of system and process solutions for micro patterning in the semiconductor industry and related markets. In close collaboration with research institutes and industry
partners, SUSS MicroTec drives the development of next-generation technologies such as 3D integration and nanoimprint lithography as well as key processes for MEMS and LED production. With its global
infrastructure for applications and service, SUSS MicroTec supports more than 8,000 installed systems worldwide. www.suss.com

TDK
San Jose, CA USA
phone: +1-801-209-9748
patrick.christiansen@tdk.com
www.invensense.tdk.com

6

MEMS
BENEFACTORSGOLD BENEFACTOR
STMicroelectronics
www.st.com

At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we workwith more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a moresustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and connectivity. ST is committed to
becoming carbon neutral by 2027. Further information can be found at www.st.com.

SILVER BENEFACTOR
Plasma-Therm, LLC
North, FL USA
phone: +1-7272-577-4999
sales@plasmatherm.com
www.plasmatherm.com
Plasma-Therm is a global manufacturer of advanced plasma processing equipment. Its tools and processes are used to support manufacturing needs in etch, deposition, rapid thermal processing, and plasma
dicing technologies. The company serves the semiconductor and compound semiconductor industries in developing solutions for the wireless, power device, MEMS, photonics, advanced packaging, and data
storage markets. With locations in North America, Europe, and Asia-Pacific, Plasma-Therm meets the diverse needs of its customers with exceptional customer service.

BRONZE BENEFACTORNXP Semiconductors
Chandler, AZ USA
phone: 1-602-509-4897
sandy.vos@nxp.com
www.nxp.com
With 35 years’ experience and >3B sensors shipped worldwide, NXP is a leader serving applications in the automotive, medical and industrial market spaces. NXP’s Sensor solutions include a breadth ofaccelerometers, gyroscopes, magneto-resistive and pressure sensor solutions covering different performance, sensing ranges and form factors.

OUTSTANDING STUDENT ORAL PRESENTATION AWARD SPONSOR
Microsystems & Nanoengineering/Springer Nature
Aerospace Information Research Institute, Chinese Academy of Science
Beijing, CHINA
phone: +86-10-588872222
mine@aircas.ac.cn
www.nature.com/micronano
Microsystems & Nanoengineering is an open access and fully peer-reviewed journal which publishes original articles and reviews on cutting-edge and emerging topics related to MEMS/ NEMS andnanotechnology, and it is the first engineering journal initiated by Nature Publishing Group (now part of Springer Nature) and Chinese Academy of Sciences in 2014. Microsystems & Nanoengineering isabstracted & indexed by SCIE, Ei, PubMed Central, Scopus, DOAJ, etc. The 2021 impact factor is 8.006 (Q1 in the catalogue of “Instruments & Instrumentation”).

OUTSTANDING STUDENT POSTER PRESENTATION AWARD SPONSOR
MDPI - Sensors Journal
Basel, SWITZERLAND
sensors@mdpi.com
www.mdpi.com/journal/sensors
Sensors (IF 3.576, ISSN 1424-8220) is the leading international, peer-reviewed, open access journal on the science and technology of sensors. We provides an advanced forum for the science and technologyof sensor and its applications. It publishes reviews, regular research papers and short notes. Our aim is to encourage scientists to publish their experimental and theoretical results in details.

ART IN MICROTECHNOLOGY AWARD SPONSOR
MDPI - micromachines
Basel, SWITZERLAND
phone: +41-61-683-7734
micromachines@mdpi.com
www.mdpi.com/journal/micromachines
Micromachines (ISSN 2072-666X), is an international, peer-reviewed Open Access journal of micro/nano-scaled structures, devices, systems as well as related micro- and nanotechnology from fundamental
research to applications, published monthly online by MDPI. Launched in 2010, /Micromachines/ has published more than 7000 articles. It is indexed in EI, Scopus, PubMed and Web of Science, and has an
Impact Factor of 3.523 (2021). /Micromachines/ boasts a fast peer-review process and online publishing of original results. Manuscripts are peer-reviewed and a first decision provided to authors approximately
13 days after submission; acceptance to publication is undertaken in 1.9 days (median values for papers published in this journal in the first half of 2022).

LANYARD BENEFACTOR
Lyncée Tec
Lausanne SWITZERLAND
phone: +41-24-552-0420
info@lynceetec.com
www.lynceetec.com
Lyncée Tec - Digital Holographic Microscope (DHM®). Lyncée Tec offers matured holographic microscopes based on the revolutionary patented Digital Holographic Microscope (DHM®) technology as MEMS
vibration analyzer and 4D profilometry. Additionally of having a standard product portfolio, Lyncée Tec has expert competences for customizing system to specific needs, and supplies OEM solutions. Lyncée
Tec is making the invisible visible enabling you to characterize your samples like you couldn’t before!

7

EXHIBITORSEXHIBIT HOURS
Sunday, 15 January
Monday, 16 January
Tuesday, 17 January

17:00 – 19:00 Wednesday, 18 January 08:00 – 17:15
07:00 – 18:05 Thursday, 19 January 08:00 – 10:45
08:00 – 17:30

Exhibitor

Booth

Coventor, SARL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Villebon Sur Yvette, FRANCE
sales@coventor.com
phone: +33-169-29-8494
www.coventor.com
Coventor offers MEMS design automation and process modeling solutions for MEMS and semiconductor devices. Coventor's MEMS design product, CoventorMP, solves MEMS design
problems such as multi-physics interactions, process variations, MEMS+IC integration, and MEMS+package interactions. CoventorMP is being used by organizations worldwide to
develop MEMS and IoT products for automotive, aerospace, industrial, defense and consumer electronics applications.
Heidelberg Instruments Mikrotechnik GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Heidelberg, GERMANY
info@heidelberg-instruments.com
phone: +49-6221-7288-990
www.heidelberg-instruments.com
Heidelberg Instruments is a world leader in the development and production of high-precision maskless laser lithography systems and nanofabrication tools. We provide lithography
solutions specifically tailored to meet all micro- and nanofabrication requirements of our customers in both industry and academia. Application areas include semiconductors, quantum
computing, MEMS, micro-optics, advanced packaging (3DIC), IC, flat panel displays (FPD), microfluidics, sensors, and analog and digital electronic components.
i-ROM GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Neukirchen, GERMANY
info@i-rom.dephone: +49-152-0475-5433
www.i-rom.de
The i-ROM MODELBUILDER is the new generation of software for the design of sensors and actuators. It is suitable for both experienced engineers and students. Its graphical userinterface and intuitive operation make it a must-have for any MEMS design company.
idonus sarl . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Neuchatel, SWITZERLAND
info@idonus.com
phone: +41-3272-44440
www.idonus.com
Founded in 2004, idonus is a Swiss company specialized in the development and fabrication of manufacturing equipment for the MEMS and semiconductor industries. Our productportfolio includes UV LED Exposure and Alignment Systems for Photolithography, Vapour Phase chemical Etcher for silicon-based devices, IR microscope for wafer inspection andother high performance equipment. One of idonus' strengths lies in its ability to customize its products according to the needs of each client. The vertical integration of the company
enables a fast prototyping and shorter lead times for the customer.
IEEE MEMS Technical Community . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
ieeememstc.org
Conference Sponsor
IEEE Micro Electro Mechanical Systems (MEMS) Technical Community will keep you abreast of the latest in MEMS ideas, designs, and manufacturing methodologies, many of which
could very well spark new thinking and enable new capabilities in a myriad of IEEE fields. MEMS is an enabling technology harnessing the benefits of miniaturization in physicaldomains beyond the electrical and found in billions of devices today. The field of MEMS encompasses tiny (generally chip-scale) devices or systems capable of realizing functions
not easily achievable via macroscopic ones. Many IEEE organizational units already benefit from MEMS, as the utility of its fundamental concepts and technology touches nearly all
IEEE field of interest areas.
JX Nippon Mining & Metals Europe GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Frankfurt, GERMANY
SalesEurope@nmm-jx-group.com
phone: +49-69-2193653-0
www.jx-nmm.com/english
JX Nippon Mining & Metals offers sputtering targets for demanding thin film deposition processes including semiconductor, data storage, and optical films. At this conference wepromote advances in RF and MEMS applications through AlSc targets for higher piezoelectric coefficient and KNN as Pb-free eco-friendly material. Telecommunications and IR sensor
chip manufacturers use our InP and CdZnTe compound semiconductor wafers. JX also provides high purity metals for microelectronics research and development.
KLA Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Milpitas, CA, USA
info@kla-tencor.com
phone: +1-408-875-3000
www.kla.com
KLA Corporation develops advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards andflat panel displays. Their wafer processing technologies for MEMS manufacturing include SPTS etch and deposition solutions; Si DRIE for MEMS micromachining, ICP etch, vapor
release etch (HF or XeF2) for MEMS release, low temperature PECVD, PVD and MVD. For more information please visit https://www.spts.com/markets/mems
Lyncée Tec . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Lausanne, SWITZERLAND
info@lynceetec.com
Lanyard Benefactor
phone: +41-24-552-0420
www.lynceetec.com
Lyncée Tec - Digital Holographic Microscope (DHM®). Lyncée Tec offers matured holographic microscopes based on the revolutionary patented Digital Holographic Microscope (DHM®)
technology as MEMS vibration analyzer and 4D profilometry. Additionally of having a standard product portfolio, Lyncée Tec has expert competences for customizing system to specificneeds, and supplies OEM solutions. Lyncée Tec is making the invisible visible enabling you to characterize your samples like you couldn’t before!
memsstar ltd. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Livingston, UK
info@memsstar.com
phone: +49-151-4434-7827
www.memsstar.com
memsstar is a leading process and equipment supplier of etch and deposition solutions for semiconductor and MEMS manufacturing processes. Offering in-depth process expertiseand a range of new and remanufactured etch and deposition equipment, memsstar provides a full complement of processes and related services for multiple applications from R&D
through to high-volume manufacturing. We are market leaders in single-wafer dry release etching using vapor HF and XeF2 chemistries and surface modification (SAM coating)processes.

8

EXHIBITORS
Exhibitor

Booth

Microqubic AG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table-top
Zug, SWITZERLAND
contact@microquibic.com
phone: +41-782-518-844
www.microqubic.com
Founded in 2022 in Switzerland, Microqubic designs and manufactures modular and compact electro-optical systems and 2D/3D microscopes for scientific research, education, andprecision manufacturing. The recent highlight of the company is a multi-modal, motorized, and programmable 3D imaging system that can visualize MEMS and microfluidic chips
from any viewing angle and at a magnification range from centimeters to micrometers.
NAGASE (EUROPA) GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Düsseldorf, GERMANY
cichon@nagase.dephone: +49-211-866-2033
www.nagase.eu
Nagase Corporation is a Custom Formulator and leading supplier of both positive and negative tone photoresists to the global MEMS market. Nagase has an extensive global networkof Manufacturing, Sales and Technical Support to assist you. Our liquid and dry film photoresists are specifically formulated to meet the severe reliability requirements of the MEMS
market.
Nextron Corporation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Busan, KOREA
sales@nextron.co.kr
phone: +82-51-512-6770
microprobesystem.com
Nextron Corporation is the manufacturer of Micro Probe System. Micro Probe System is suitable to analyze the Electrical & Optical properties of the materials. Its advantage is thein-situ measurement of the electrical and optical properties with the unique manual probe under various environmental conditions; Vacuum, Temperature, Gas Flow, Humidity, pressure
control, and Irradiation of Light.
Plasma-Therm, LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
North, FL, USA
sales@plasmatherm.com
phone: +1-7272-577-4999
www.plasmatherm.com
Plasma-Therm is a global manufacturer of advanced plasma processing equipment. Its tools and processes are used to support manufacturing needs in etch, deposition, rapid
thermal processing, and plasma dicing technologies. The company serves the semiconductor and compound semiconductor industries in developing solutions for the wireless, powerdevice, MEMS, photonics, advanced packaging, and data storage markets. With locations in North America, Europe, and Asia-Pacific, Plasma-Therm meets the diverse needs of its
customers with exceptional customer service.
Polytec GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Waldbronn, GERMANY
info@polytec.dephone: +49-7243-6040
www.polytec.com
Polytec presents optical measurement and testing solutions for characterizing the true MEMS dynamics, for reliable FE model validation and model updating, whether measuring Si
encapsulated MEMS using a novel and patented IR laser technology, or up to 6 GHz or for the areal evaluation of form parameters and topography during quality control.
Polyteknik AS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Oeservraa, DENMARK
sales@polyteknik.dk
Silver Benefactor
phone: +45-9689-2800
www.polyteknik.com
Polyteknik AS is a PVD equipment manufacturer with an innovative and best service approach. With more than 25 years in business, a global reference list, and an excellent platformof technology, Polyteknik AS has turned to be an appreciated partner in the thin film industry. Reach out to learn more about our Flextura 200 & 300 Cluster platforms!
Purdue University . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Table-top
West Lafayette, IN, USA
bhave@purdue.edu
phone: +1-510-390-3259
engineering.purdue.edu/oxidemems
In the OxideMEMS Lab at Purdue University, PI Sunil Bhave and his research group explore inter-domain coupling in Opto-mechanical, Spin-Acoustic and Atom-MEMS devices. We
strive to leverage our understanding of these coupled systems to design and fabricate tunable filters, inertial sensors, microwave to optical converters, tunable lasers and nonreciprocal
photonic and microwave systems.
Robert Bosch GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Reutlingen, GERMANY
arno.stoetzler@de.bosch.com
phone: +49-7121-3530-531
www.bosch-sensortec.com
www.bosch-semiconductors.com
Bosch specializes in designing microelectronics for the automotive and consumer world. The portfolio for automotive includes high-performance inertial and pressure sensors,
embedding the vast experience of Bosch as a system supplier. The portfolio for consumer electronics includes 3-axis accelerometers, gyroscopes and magnetometers, integrated
6- and 9-axis sensors, smart sensors, barometric pressure sensors, humidity sensors, gas sensors, optical microsystems and comprehensive software.
scia Systems GmbH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Chemnitz, GERMANY
info@scia-systems.com
phone: +49 371 33561-0
www.scia-systems.com
scia Systems provides precise surface processing equipment based on advanced ion beam and plasma technologies. The systems are applicable for coating, etching, and cleaning
processes, especially for the MEMS, microelectronics, and precision optics industries. Due to their flexible and modular design, the process equipment can be configured according
to customer specific requirements. Together with our worldwide service partners, we offer comprehensive service and superior technology support.
Silicon Austria Labs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Graz, AUSTRIA
contact@silicon-austria.com
silicon-austria-labs.com
Silicon Austria Labs (SAL) is a top research center for Electronic Based Systems (EBS). At three locations (Graz, Villach, Linz), SAL is conducting research along the entire EBS value
chain in the areas of sensor systems, power electronics, intelligent wireless systems and embedded systems to develop future-oriented solutions for industrial production, health,energy, mobility, safety and more. SAL brings together key players from industry, science and research and thus valuable expertise and know-how and conducts cooperative,
application-oriented research along the value chain. Cooperative projects are co-financed by SAL and enable a fast and unbureaucratic project start.

9

EXHIBITORS
Exhibitor

Booth

SmarAct Metrology GmbH & Co. KG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Oldenburg, GERMANY
info-de@smaract.com
phone: +49-4418008-424
www.smaract.com/de/
SmarAct Metrology presents its turnkey solution to measure vibrations of micromechanical structures with sizes that range from just a few μm to multiple cm. With a very compact
measurement head, vibrations at different planes and even through silicon enclosures can be measured in situ and in combination with a nanoprober inside an electron microscope.
STMicroelectronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
www.st.com
Gold Benefactor
At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated
device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges
and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale
deployment of the Internet of Things and connectivity. ST is committed to becoming carbon neutral by 2027. Further information can be found at www.st.com.
Sumitomo Precision Products Co., Ltd. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Amagasaki, JAPANmemssolutions@spp.co.jp
phone: +81-6-6489-5917
www.spp.co.jp/English/
Sumitomo Precision Products Co., Ltd. manufactures and supplies MEMS devices such as MEMS gyroscopes and inertial sensor systems. It has developed Low-k PZT thin film suitedfor transducers application such as PMUTs. Its affiliated company, Silicon Sensing Systems, has supplied high-d31 PZT thin film suited for actuators and subsequent device fabrication
though its MEMS foundry service. By utilizing various technical assets including the above, we will offer new "MEMS Solutions" to customers.
SUSS MicroTec Solutions GmbH & Co. KG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Garching, GERMANY
info@suss.com
Diamond Benefactor
Phone: +49-89-320-070
www.suss.com
SUSS MicroTec is a leading manufacturer of system and process solutions for micro patterning in the semiconductor industry and related markets. In close collaboration with research
institutes and industry partners, SUSS MicroTec drives the development of next-generation technologies such as 3D integration and nanoimprint lithography as well as key processes
for MEMS and LED production. With its global infrastructure for applications and service, SUSS MicroTec supports more than 8,000 installed systems worldwide. www.suss.com
TDK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
San Jose, CA USA
patrick.christiansen@tdk.com
Diamond Benefactor
phone: +1-801-209-9748
www.invensense.tdk.com
Tousimis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Rockville, MD, USA
trc@tousimis.com
phone: +1-881-2450
www.tousimis.com
Tousimis designs and manufactures advanced CPD systems for MEMS and other CPD applications. We are based in the USA and provide global sales and service support. Our CPD
process enables one to reproducibly eliminate surface tensions forces and preserve delicate Micro-Structures during the drying process.
Zurich Instruments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
München, GERMANY
info@zhinst.com
phone: +49-893-704-0047
www.zhinst.com
Zurich Instruments builds lock-in amplifiers, quantum computing control systems, impedance analyzers, arbitrary waveform generators, phase-locked loops and boxcar averagers
for scientists and technologists in advanced research laboratories. In combination with LabOne®, the Zurich Instruments control software, these products exemplify the company’s
mission to simplify laboratory setups, support high-quality data acquisition, and unlock new measurement approaches for cutting-edge research.

MEDIA BENEFACTORS
machines - MDPI Academic Open Access Publishing Since 1996
Basel, 4052 SWITZERLAND
phone: +41-61-683-7734
machines@mdpi.com
www.mdpi.com/journal/machines
Machines (ISSN 2075-1702) [IF 2.899, CiteScore 3.1] is an international, peer-reviewed, open access journal on machinery and engineering published monthly online by MDPI. Journal Rank: JCR - Q2 (Engineering, Mechanical) / JCR - Q2 (Engineering, Electrical & Electronic). Manuscripts are peer-reviewed and a first decision provided to authors approximately 16 days after submission; acceptance to publicationis undertaken in 2.7 days (median values for papers published in this journal in the first half of 2022).

MDPI - Sensors Journal
Basel, 4052 SWITZERLAND
sensors@mdpi.com
www.mdpi.com/journal/sensors
Sensors (IF 3.576, ISSN 1424-8220) is the leading international, peer-reviewed, open access journal on the science and technology of sensors. We provides an advanced forum for the science and technologyof sensor and its applications. It publishes reviews, regular research papers and short notes. Our aim is to encourage scientists to publish their experimental and theoretical results in details.

Microtech Ventures, Inc.
Birmingham, MI USA
info@microtechventures.com
microtechventures.com
Microtech Ventures is focused on strategic venture capital, angel investing, and M&A advisory services. Our mission is to accelerate the development of sensors, MEMS, and microtechnologies for the advancement of civilization and creation of market value. Our deep industry knowledge and extensive network, combined with practical hands-on strategy experience, enables us to quickly identify the connections
that result in multiple opportunities to maximize ownership value, and ensure successful outcomes.

10PLENARY SPEAKERS &ROBERT BOSCH AWARDWEDNESDAY, 18 JANUARYMONDAY, 16 JANUARYPlenary Speaker I

Plenary Speaker III

08:50 - 09:35
FROM ETCH TO EDGE AI: OPENING NEW
HORIZONS WITH SMART SENSORTECHNOLOGIES
Stefan Finkbeiner
Robert Bosch, GmbH

08:30 - 09:15
LEVERAGE SEMICONDUCTOR ECO-SYSTEMSFOR MEMS
Weileun Fang
National Tsing Hua University, TAIWANTUESDAY, 17 JANUARYTHURSDAY, 19 JANUARYPlenary Speaker II

Plenary Speaker IV

08:50 - 09:35
ACOUSTOFLUIDICS: MERGING ACOUSTICS
AND FLUID MECHANICS FOR BIOMEDICALAPPLICATIONS
Tony Jun Huang
Duke University, USA

08:30 - 09:15
MATERIALS ENGINEERING FOR CHEMICALSENSING ENHANCEMENT
Elisabetta Comini
University of Brescia, ITALY

Stephen C. Terry, John H. (Hal) Jerman, both now retired, and the late Prof. James B. Angell, were all involved with thedevelopment of the “gas chromatograph on a chip” project at Stanford University in the 1970’s, and Steve and Hal laterat Microsensor Technology until its sale in 1985. The concept was initially suggested by NASA as an instrument to fly toMars on the early Viking missions, but the technology was not ready for launch. There were three separate iterations of theGC system through the years to increase performance, yield, and to reduce cost of the system. Ultimately, portable GC
systems and a fixed, high-accuracy system for natural gas analysis, containing multiple GC modules, were developed andsold commercially. The concept of a miniature system to combine chemical or biological sample preparation, analysis, anddetection was taken up by multiple researchers through the decades in what is now the field of micro-TAS.
Jim Angell was educated at MIT and was as a professor at Stanford until 2001, and he died in 2006. Many of his students
were involved in what was then micromaching in the 1960’s, 1970’s, and 1980’s. He was a Fellow of the IEEE. Steve Terry
was an undergraduate at MIT and developed the first-generation GC system as his Ph. D. research in 1975. Hal Jerman joined the program from Caltech in
1975, and he fabricated the thin-film thermal conductivity detector as his Ph. D. research while the 2nd generation GC system was being developed. Steve andHal continued work on a wide variety of MEMS and related devices in a number of Silicon Valley companies until their recent retirements. They are named as
inventors on a combined 83 US patents.
11

TECHNICAL PROGRAM
INFORMATION
Oral Sessions

Poster Topic Categories

Oral sessions will be held in Audimax, with the Wednesday parallel concurrent
sessions in Hörsaal. See floor plans at the end of this program.

b - Emerging Technologies and New Opportunities for MEMS/NEMS

Poster Sessionsc - Industry MEMS and Advancing MEMS for Products and Sustainability

Three (3) poster sessions will be held on three floors of the SCCM on Monday,
Tuesday, and Wednesday. All posters are listed with their assigned number and daythat they are on display. Authors will be available for questions during their
appointed time. Posters are color coded by day and poster category.

d - Materials, Fabrication and Packaging for Generic MEMS and NEMSa - Bio and Medical MEMSe - MEMS Actuators and PowerMEMS
f - MEMS Physical and Chemical Sensors
g - Micro- and Nanofluidics

Guide to Understanding Poster Numberingh - Optical, RF and Electromagnetics for MEMS/NEMS

Each poster is assigned a unique number which clearly indicates when and where
the poster is presented.

i - Open Posters
Posters will be on display and available for viewing on their assigned day only.
See poster ﬂoor plans at the end of this program.

Poster number: M01-a
The first character (i.e. M) indicates the day of the Conference:
M = Monday

T = Tuesday

Outstanding Student Paper Award Finalists

W = WednesdayAward Nominees are indicated next to the paper title.
The second character (i.e. 01) is the poster board position on the floor plan.
The last character (i.e. a) is the poster category that is reflected in the Poster
Topic Category chart.

Olympic Tower in Munich, Germany. Image by Renato Canepa from Pixabay

12

SUNDAY
PROGRAMSUNDAY, 15 JANUARY
INDUSTRY SESSION I: From Laboratory to Mass Market
Session Chairs:
Núria Barniol, Universidad Autonoma Barcelona, SPAIN and Franz Lärmer, Robert Bosch GmbH, GERMANY
Hörsaal
13:00

THE MEMS JOURNEY - THE BEST IS YET TO COME
Anton Hofmeister
STMicroelectronics, ITALY

13:30

FROM IDEA TO PRODUCT - FROM ONE TO ONE BILLION
Alfons DeheHahn-Schickard Freiburg, GERMANY

14:00

EUV HIGH-NA LITHOGRAPHY - PROCESS AND METROLOGY ASPECTS FOR MIRROR FABRICATION
Wilhelm Kühn
Carl Zeiss SMT GmbH, GERMANY

14:30

ENVIRONMENTAL SENSORS - THE QUEST FOR SURVIVAL
Christoph Schelling
Robert Bosch GmbH, GERMANY

15:00-15:30

Networking BreakINDUSTRY SESSION II: From Ideas to Start-up’s
Session Chairs:
Núria Barniol, Universidad Autonoma Barcelona, SPAIN and Franz Lärmer, Robert Bosch GmbH, GERMANY
Hörsaal
15:30

MEMS MIRROR TECHNOLOGY - KEY ENABLER FOR AUGMENTED REALITY SMARTGLASSES
Ulrich Hofmann
OQmented, GERMANY

16:00

SILICON MICROGRAVITY: RESONANT MEMS TECHNOLOGY FOR GRAVIMETRY AND PRECISION INERTIAL SENSING
Ashwin A. Seshia
Silicon Microgravity, Ltd. and University of Cambridge, UK

16:30

THE LED OF ACOUSTICS
Ferrucio Bottoni
USound, AUSTRIA

17:00 - 19:00

Welcome Reception

Munich, Germany. Image by David Mark from Pixabay

13

MONDAYPROGRAMMONDAY, 16 JANUARY
Welcome Address
Audimax
08:00

MEMS 2023 Conference Chairs
Núria Barniol, Universitat Autonoma de Barcelona, SPAIN
Franz Lärmer, Robert Bosch GmbH, GERMANY• IEEE Fellows Recognition in the Field of MEMS/NEMS• IEEE Electron Devices Society Robert Bosch Micro and Nano Electro Mechanical Systems Award
08:35

IEEE Electron Devices Society Robert Bosch Micro and Nano Electro Mechanical Systems Award Recipient
John H. (Hal) Jerman will accept on behalf of the Gas Chromatograph on a Chip Project.

Plenary Speaker I
Session Chair:Franz Laermer, Robert Bosch GmbH, GERMANY
Audimax
08:50

FROM ETCH TO EDGE AI: OPENING NEW HORIZONS WITH SMART SENSOR TECHNOLOGIES
Stefan Finkbeiner
Bosch Sensortec GmbH, GERMANY

Session I – Novel MEMS/NEMS Devices for Computing/Imaging
Session Chair:Jose-Luis Sanchez-Rojas, Universidad de Castilla-La Mancha, SPAIN
Audimax
09:35

SUB-300 MILLIVOLT OPERATION IN NONVOLATILE 300 NM X 100 NM PHASE CHANGE NANOELECTROMECHANICAL SWITCH
Mohammad Ayaz Masud and Gianluca Piazza
Carnegie Mellon University, USA

Award Nominee

09:50

A FAST AND ENERGY-EFFICIENT NANOELECTROMECHANICAL NON-VOLATILE MEMORY FOR IN-MEMORY COMPUTING
Yong-Bok Lee1, Min-Ho Gang2, Pan-Kyu Choi1, Su-Hyun Kim1, Tae-Soo Kim1, So-Young Lee1, and Jun-Bo Yoon1
1
Korea Advanced Institute of Science and Technology (KAIST), KOREA and 2National NanoFab Center (NNFC), KOREAAward Nominee

10:05

TOWARDS ULTRA-HIGH SPATIAL RESOLUTION SENSING OF GHZ ULTRASOUND USING STRAIN MODULATION OF FIELD EFFECT TRANSISTORS
Rohan Sanghvi1, Justin Kuo2, Adarsh Ravi1, and Amit Lal1
1
Cornell University, USA and 2Geegah Inc., USA

10:20

Award Nominee

A TACTILE SENSOR ARRAY WITH A MONOLITHICALLY INTEGRATED NEURAL NETWORK FOR EDGE COMPUTATION
Tengteng Lei, Yushen Hu, and Man Wong
Hong Kong University of Science and Technology, HONG KONG

10:35

Break and Exhibit Inspection

Session II – BioMEMS I
Session Chair:
Anders Wolff, Technical University of Denmark DTU, DENMARK
Audimax
11:05

EVALUATION OF LOCAL AND INTERNAL ELASTICITY OF HYDROGEL MATERIALS BY USING LIGHT-DRIVEN GEL ACTUATOR
Hibiki Nakajima1, Yuha Koike1, Yoshiyuki Yokoyama2, Masaya Hagiwara3, and Takeshi Hayakawa1
1
Chuo University, JAPAN, 2Toyama Industrial Technology Research and Development Center, JAPAN, and 3RIKEN, JAPAN

11:20

3D PRINTED MINIATURIZED SOFT MICROSWIMMER FOR MULTIMODAL 3D AIR-LIQUID NAVIGATION AND MANIPULATION
Dominique Decanini1, Abdelmounaim Harouri1, Ayako Mizushima2, Beomjoon Kim2, Yoshio Mita2, and Gilgueng Hwang1,21
Paris-Saclay University, FRANCE and 2University of Tokyo, JAPAN

11:35

SELF-DRIVEN CAPILLARIC VISCOMETER FOR DIRECT OR CASCADED BAR GRAPH READ-OUT OF RELATIVE SAMPLE VISCOSITY
Daniel Mak1, R. Claude Meffan1,2, Julian Menges1, Fabian Dolamore1, Conan Fee1, Renwick C.J. Dobson1, and Volker Nock1
University of Canterbury, NEW ZEALAND and 2Kyoto University, JAPAN

1

11:50

A FLEXIBLE BIOSENSING PLATFORM FOR HIGH-THROUGHPUT MEASUREMENT OF CARDIOMYOCYTE CONTRACTILITY
Wenkun Dou1, Jason Maynes2, and Yu Sun1
University of Toronto, CANADA and 2Hospital for Sick Children, CANADA

Award Nominee

FLEXIBLE BI-DIRECTIONAL BRAIN COMPUTER INTERFACE FOR CONTROLLING TURNING BEHAVIOR OF MICE
Yifei Ye1, Ye Tian1,2, Han Wang1, Qian Cheng1, Kuikui Zhang1, Xueying Wang1,2, Cunkai Zhou1, Chengjian Xu1,
Xiaoling Wei1,2, Zhitao Zhou1,2, Tiger H. Tao1,2,3,4,5,6, and Liuyang Sun1,2
1Chinese Academy of Sciences, CHINA, 2University of Chinese Academy of Sciences, CHINA, 3ShanghaiTech University, CHINA,
4
Neuroxess Co., Ltd. (Jiangxi), CHINA, 5Guangdong Institute of Intelligence Science and Technology, CHINA, and6
Tianqiao and Chrissy Chen Institute for Translational Research, CHINA

Award Nominee

1

12:05

15

MONDAY
PROGRAM
12:20

Lunch and Exhibit Inspection

Session III – MEMS Inertial Sensors and Power MEMS
Session Chair:Frank Goldschmidtboeing, University Freiburg, GERMANY
Audimax
13:45

HIGH SENSITIVITY MEMS Z-AXIS ACCELEROMETER WITH IN-PLANE DIFFERENTIAL READOUT
Valentina Zega1, Gabriele Gattere2, Manuel Riani2, Francesco Rizzini2, and Attilio Frangi1
1
Politecnico di Milano, ITALY and 2STMicroelectronics, ITALY

14:00

TWO-AXIS ELECTROMAGNETIC SCANNER INTEGRATED WITH AN ELECTROSTATIC XY-STAGE POSITIONER
Yuki Okamoto, Hironao Okada, and Masaaki Ichiki
National Institute of Advanced Industrial Science and Technology (AIST), JAPAN

14:15

MEMS SHOCK ABSORBERS INTEGRATED WITH AL2O3-REINFORCED, MECHANICALLY RESILIENT NANOTUBE ARRAYS
Hojoon Lee1, Eunhwan Jo1, Jae-Ik Lee2, and Jongbaeg Kim1
1
Yonsei University, KOREA and 2Harvard Medical School, USA

14:30

HIGH-INDUCTANCE-DENSITY MEMS 3D-SOLENOID TRANSFORMERS WITH INSERTED THIN-FILM FERRITE MAGNETIC CORE FOR
ON-CHIP INTEGRATED DC-DC POWER CONVERSIONS
Changnan Chen1,2, Pichao Pan1,2, Jiebin Gu1,2, and Xinxin Li1,2
1
Chinese Academy of Sciences, CHINA and 2University of Chinese Academy of Sciences, CHINA

Award Nominee

Poster Session I
14:45
16:15

Poster Session I
Poster presentations are listed by topic category with their assigned number starting on page 29.
Break and Exhibit Inspection

MEMS Community Announcement
Audimax
16:45

Clark T.-C. Nguyen, University of California, Berkeley, USA

Session IV – BioMEMS II
Session Chair:
Niclas Roxhed, KTH Royal Institute of Technology, SWEDEN
Audimax
16:50

MICRON-SIZED PARYLENE-IN-OIL WATER PROTECTION LAYER
Kuang-Ming Shang1, Haixu Shen1, Ningxuan Dai1, David Kong1,2, Tzung Hsiai3, and Yu-Chong Tai1
1
California Institute of Technology, USA, 2Harvard University, USA, and 3University of California, Los Angeles, USA

17:05

A PIPETTE TIP INTEGRATED WITH A CAPACITIVE MICROSENSOR FABRICATED BY COMBINED 3D PRINTING AND MEMS PROCESS FOR CELL DETECTION
AND TRANSPORTATION
Satoshi Amaya, Hirotaka Sugiura, Bilal Turan, Shingo Kaneko, and Fumihito Arai
University of Tokyo, JAPAN

17:20

FOLDABLE POLYMER STENT INTEGRATED WITH WIRELESS PRESSURE SENSOR FOR BLOOD PRESSURE MONITORING
Nomin-Erdene Oyunbaatar and Dong-Weon Lee
Chonnam National University, KOREA

17:35

A DYNAMIC MICROARRAY DEVICE FOR SELECTIVE PAIRING AND ELECTROFUSION OF LIPOSOMES
Sho Takamori1, Hisatoshi Mimura1, Toshihisa Osaki1, and Shoji Takeuchi1,2
1Kanagawa Institute of Industrial Science and Technology, JAPAN and 2University of Tokyo, JAPAN

17:50

Award Nominee
REAL-TIME FUNCTIONAL BRAIN MAPPING BASED ON HIGH-CHANNEL-COUNT, ULTRA-CONFORMAL NEURAL INTERFACE
Xiner Wang1,2, Zhaohan Chen3, Jizhi Liang1,2, Xiaoling Wei1,2, Liuyang Sun1,2, Meng Li1,2, Zhitao Zhou1,2, and Tiger H. Tao1,2,4,5,6
1
Chinese Academy of Sciences, CHINA, 2University of Chinese Academy of Science, CHINA, 3Shanghai Normal University, CHINA, 4Neuroxess Co., Ltd. (Jiangxi), CHINA,
5
Guangdong Institute of Intelligence Science and Technology, CHINA, and 6Tianqiao and Chrissy Chen Institute for Translational Research, CHINA

18:05

Adjourn for the day

16

Award Nominee

TUESDAYPROGRAMTUESDAY, 17 JANUARYPlenary Speaker II
Session Chair:
Núria Barniol, Universitat Autonoma de Barcelona, SPAIN
Audimax
08:30

ACOUSTOFLUIDICS: MERGING ACOUSTICS AND FLUID MECHANICS FOR BIOMEDICAL APPLICATIONS
Tony Jun Huang
Duke University, USA

Session V - New Materials, Fabrication, and Packaging
Session Chair:
Hiroshi Miyajima, Sumitomo Precision Products Co.,Ltd., JAPAN
Audimax
09:15

SILICON CARBIDE REINFORCED VERTICALLY ALIGNED CARBON NANOTUBE COMPOSITE FOR HARSH ENVIRONMENT MEMS
Jiarui Mo, Shreyas Shankar, Guoqi Zhang, and Sten Vollebregt
Delft University of Techonology, NETHERLANDS

09:30

A RELIABLE RELEASE METHOD FOR A BACK-END-OF-LINE NEMS SWITCH OF A MONOLITHIC THREE-DIMENSIONAL INTEGRATED CMOS-NEMS CIRCUIT
Tae-Soo Kim, Yong-Bok Lee, So-Young Lee, Seung-Jun Lee, and Jun-Bo Yoon
Korea Advanced Institute of Science and Technology (KAIST), KOREA

09:45

INCREASE OF EXPANSION RATE AND DIRECTION CONTROL OF MICROGEL ACTUATORS FOR SINGLE CELL MANIPULATIONS
Kyoka Nakano1, Hiroki Wada1, Yoshiyuki Yokoyama2, and Takeshi Hayakawa1
1
Chuo University, JAPAN and 2Toyama Industrial Technology Research and Development Center, JAPAN

10:00

GENERALIZED-ACCUMULATED-TEMPERATURE PARAMETER FOR CHARACTERISTIC PREDICTION OF METAL-BASED MEMS CANTILEVER
Yulong Zhang1, Jianwen Sun1, Huiliang Liu2, and Zewen Liu1
1
Tsinghua University, CHINA and 2China Academy of Space Technology, CHINA

10:15

Award Nominee

Award Nominee

Break and Exhibit Inspection

Session VI - Micro- and Nanofluidics and Medical Applications
Session Chair:
Andreu Llobera, Silicon Austria Labs (SAL), AUSTRIA
Audimax
10:45

11:00

MEMS-BASED WATER COLLECTION CONDENSATION PARTICLE COUNTER (WCCPC) OPTIMIZED FOR MULTI-POINT MONITORING OF AIRBORNE NANOPARTICLES
Seong-Jae Yoo and Yong-Jun Kim
Yonsei University, KOREA
RECONSTITUTING FUNDAMENTALS OF BACTERIA MEDIATED CANCER THERAPY ON A CHIP
Wonjun Lee1, Jiin Park2, Dongil Kang3, and Seungbeum Suh4
Seoul National University, KOREA, 2Ewha Womans University, KOREA, 3Hanyang University, KOREA, and 4Korea Institute of Science and Technology (KIST), KOREA

1

11:15

3D SPATIAL FOCAL CONTROL BY ARRAYED OPTOFLUIDIC PRISMS
Cheng-Hsun Lee, Yeonwoo Lee, and Sung-Yong ParkSan Diego State University, USA

11:30

HIGH-SPEED AND PINPOINT LIQUID EXCHANGE ON MICROFLUIDIC CHIP USING 3D PRINTED DOUBLE-BARRELED MICROPROBE WITH DUAL PUMPS
Xu Du1, Shingo Kaneko2, Hisataka Maruyama1, Hirotaka Sugiura2, and Fumihito Arai1,2
1
Nagoya University, JAPAN and 2University of Tokyo, JAPAN

11:45

DESIGN OF A DNA SYNTHESIS CHIP FOR DATA STORAGE WITH ULTRA-HIGH THROUGHPUT AND DENSITY FEATURING LARGE-SCALEINTEGRATED CIRCUITS AND MICROFLUIDIC CONFINEMENT
Ning Wang1,2,3, Shijia Yang1,3, Dayin Wang1,2,3, Zhen Cao4, Yuan Luo1,3, and Jianlong Zhao1,31Chinese Academy of Sciences, CHINA, 2ShanghaiTech University, CHINA, 3University of Chinese Academy of Sciences, CHINA, and 4Zhejiang University, CHINA

MEMS 2024 Announcement
Audimax
12:00

12:15

MEMS 2024 Conference Chairs
Wen Li, Michigan State University, USA
Dana Weinstein, Purdue University, USA
Lunch and Exhibit Inspection

19

TUESDAYPROGRAM
Session VII - MEMS Fluidic Sensors
Session Chair:
Roland Zengerle, Hahn-Schickard & University of Freiburg, GERMANY
Audimax
13:15

13:30

13:45

14:00

A REAL-TIME WIRELESS CALORIMETRIC FLOW SENSOR SYSTEM WITH A WIDE LINEAR RANGE FOR LOW-COST RESPIRATORY MONITORING
Lifeng Huang1, Izhar2,4, Xiaoyong Zhou3, Mingdong Fang3, Siwei Huang1, Yi-Kuen Lee2, Xiaofang Pan1, and Wei Xu1
1
Shenzhen University, CHINA, 2Hong Kong University of Science and Technology, CHINA,
3
Mindray Medical International Limited, CHINA, and 4University of Pennsylvania, USA

Award Nominee

ADVANCED THERMOPHYSICAL PROPERTIES MEASUREMENTS USING HEATER-INTEGRATED FLUIDIC RESONATORS
Juhee Ko, Bong Jae Lee, and Jungchul Lee
Korea Advanced Institute of Science and Technology (KAIST), KOREAAward Nominee

A MINIATURIZED TRANSIT-TIME ULTRASONIC FLOWMETER USING PMUTS FOR LOW-FLOW MEASUREMENT IN SMALL-DIAMETER CHANNELS
Yunfei Gao1,2, Zhipeng Wu2, Minkan Chen2, and Liang Lou1,2
Shanghai University, CHINA and 2Shanghai Industrial μ Technology Research Institute, CHINA

1Award Nominee

MEMS DIFFERENTIAL THERMOPILES FOR HIGHLY-SENSITIVE HYDROGEN GAS DETECTION
Haozhi Zhang1,2, Hao Jia1,2, Ming Li1,2, Pengcheng Xu1,2, and Xinxin Li1,2
Chinese Academy of Sciences, CHINA and 2University of Chinese Academy of Sciences, CHINA

Award Nominee

1

Poster Session II
14:15

Poster Session II
Poster presentations are listed by topic category with their assigned number starting on page 29.

15:45

Break and Exhibit Inspection

Session VIII - Sonics & Ultrasonics MEMS
Session Chair:
Mina Rais-Zadeh, NASA JPL, USA
Audimax
16:15

DOMAIN/BOUNDARY VARIATION IN CANTILEVER ARRAY FOR BANDWIDTH ENHANCEMENT OF PZT MEMS MICROSPEAKER
Shu-Wei Chang1, Ting-Chou Wei1, Sung-Cheng Lo2, and Weileun Fang1
1
National Tsing Hua University, TAIWAN and 2Transducer Star Technology Inc., TAIWAN

16:30

ON THE DESIGN OF PIEZOELECTRIC MEMS MICROSPEAKER WITH HIGH FIDELITY AND WIDE BANDWIDTH
Ting-Chou Wei, Zih-Song Hu, Shu-Wei Chang, and Weileun Fang
National Tsing Hua University, TAIWAN

16:45

HIGH-PERFORMANCE WAFER-SCALE TRANSFER-FREE GRAPHENE MICROPHONES
Roberto Pezone, Gabriele Baglioni, Pasqualina M. Sarro, Peter G. Steeneken, and Sten Vollebregt
Delft University of Technology, NETHERLANDS

17:00

Award Nominee

HIGH-SPL AND LOW-DRIVING-VOLTAGE PMUTS BY SPUTTERED POTASSIUM SODIUM NIOBATEFan Xia1,2, Yande Peng1,2, Sedat Pala1,2, Ryuichi Arakawa1,3, Wei Yue1,2, Pei-Chi Tsao2, Chun-Ming Chen2, Hanxiao Liu1,2, Megan Teng2, Jong Ha Park1,2, and Liwei Lin1,2
Berkeley Sensor and Actuator Center, USA, 2University of California, Berkeley, USA, and 3NGK Spark Plug Co., JAPAN

1

17:15

17:30

EPITAXIAL PB(ZR,TI)O3-BASED PIEZOELECTRIC MICROMACHINED ULTRASONIC TRANSDUCER FABRICATED ON SILICON-ON-NOTHING (SON) STRUCTURE
Takuma Sekiguchi1, Shinya Yoshida2, Yoshiaki Kanamori1, and Shuji Tanaka1
1
Tohoku University, JAPAN and 2Shibaura Institute of Technology, JAPANAdjourn for the day

Tuesday Banquet at the Löwenbräu Keller
19:00 – Banquet at the Löwenbräu Keller
22:00 MEMS 2023 welcomes you to the historic Löwenbräu Keller. Join us for a memorable evening of networking with colleagues in a traditional German beer hall.

20

WEDNESDAYPROGRAMWEDNESDAY, 18 JANUARYPlenary Speaker III
Session Chair:Franz Laermer, Robert Bosch GmbH, GERMANY
Audimax
08:30

LEVERAGING SEMICONDUCTOR ECOSYSTEMS TO MEMS
Weileun Fang, Sheng-Shian Li, and Ming-Huang Li
National Tsing Hua University, TAIWAN

Session IX - Optomechanics & Photonics Integration
Session Chair:
Dana Weinstein, Purdue University, USA
Audimax
09:15

PROGRAMMABLE SILICON NITRIDE PHOTONIC INTEGRATED CIRCUITS
Hao Tian1, Alaina G. Attanasio1, Anat Siddharth2, Andrey Voloshin2, Viacheslav Snigirev2,
Grigory Lihachev2, Andrea Bancora2, Vladimir Shadymov2, Rui N. Wang2,
Johann Riemensberger2, Tobias J. Kippenberg2, and Sunil A. Bhave1
1
Purdue University, USA and 2Swiss Federal Institute of Technology Lausanne (EPFL), SWITZERLAND

09:30

MULTIFREQUENCY NANOMECHANICAL MASS SPECTROMETER PROTOTYPE FOR MEASURING VIRAL PARTICLES USING OPTOMECHANICAL DISK RESONATORS
Oscar Malvar1, Eduardo Gil-Santos1, Jose J. Ruz1, Elena Sentre-Arribas1, Adrián Sanz-Jiménez1, Priscila M. Kosaka1, Sergio García-López1, Álvaro San Paulo1,
Samantha Sbarra2, Louis Waquier2, Ivan Favero2, Maurits van der Heiden3, Robert K. Altmann3, Dimitris Papanastasiou4, Diamantis Kounadis4, Ilias Panagiotopoulos4,
Jesús Mingorance5, María Rodríguez-Tejedor5, Rafael Delgado6, Montserrat Calleja1, and Javier Tamayo1
1
Instituto de Micro y Nanotechnologis, IMN-CSIC, CSIC (CEI UAM+CSIC), SPAIN, 2Université Paris Cité, FRANCE, 3The Netherland Organization for Applied Scientific Research(TNO), NETHERLANDS, 4Fasmatech Science and Technology, GREECE, 5Hospital Universitario La Paz, SPAIN, and 6Hospital Universitario 12 de Octubre, SPAIN

09:45

A MICROFABRICATED DIAMOND QUANTUM MAGNETOMETER WITH PICOTESLA SCALE SENSITIVITY
Fei Xie1,2, Qihui Liu1,2, Yuqiang Hu3,4, Lingyun Li1,2, Zhichao Chen1,2, Jin Zhang1, Yonggui Zhang1,2, Yuyao Zhang3,4, Yang Wang1,2,
Jiangong Cheng1,2, Hao Chen1,2, and Zhenyu Wu1,2,3,4
1
Chinese Academy of Sciences, CHINA, 2University of Chinese Academy of Sciences, CHINA, 3Shanghai University, CHINA, and4
Shanghai Industrial μTechnology Research Institute, CHINA

10:00

Break and Exhibit Inspection

Award Nominee

Session X - RF MEMS Filters & Resonators (5G & 6G)
Session Chair:
Sheng Shian Li, National Tsing Hua University, TAIWAN
Audimax

10:30

A NON-VOLATILE THRESHOLD SENSING SYSTEM USING A FERROELECTRIC HF0.5ZR0.5O2 DEVICEAND A LINbO3 MICROACOUSTIC RESONATOR
Onurcan Kaya, Luca Colombo, Benyamin Davaji, and Cristian Cassella
Northeastern University, USA

10:45

RESONANT CONFINERS FOR ACOUSTIC LOSS MITIGATION IN BULK ACOUSTIC WAVE RESONATORS
Jeronimo Segovia-Fernandez and Ernest T.-T. Yen
Texas Instruments, Kilby Labs, USA

11:00

HIGH-CRYSTALLINITY 30% SCALN ENABLING HIGH FIGURE OF MERIT X-BAND MICROACOUSTIC RESONATORS FOR MID-BAND 6G
Gabriel Giribaldi, Pietro Simeoni, Luca Colombo, and Matteo Rinaldi
Northeastern University, USA

11:15

FERRITE-ROD ANTENNA DRIVEN WIRELESS RESOSWITCH RECEIVER
Kevin H. Zheng, Qiutong Jin, and Clark T.-C. Nguyen
University of California, Berkeley, USA

11:30

ULTRA-WIDEBAND MEMS FILTERS USING LOCALIZED THINNED 128° Y-CUT THIN-FILM LITHIUM NIOBATE
Jinbo Wu1,2,3, Shibin Zhang1, Pengcheng Zheng1,2, Liping Zhang1,2, Hulin Yao1,2, Xiaoli Fang1,2, Xuedi Tian1,2, Xiaomeng Zhao1, Tao Wu3, and Xin Ou1,2
1
Shanghai Institute of Microsystem and Information Technology, CHINA, 2University of Chinese Academy of Sciences, CHINA, and 3ShanghaiTech University, CHINA

11:45

Award Nominee

Lunch and Exhibit Inspection

Women in Engineering-MEMS Group Networking Event
Courtyard Marriott Restaurant
11:45

1

2

Dana Weinstein , Hyunjoo “Jenny” Lee , and Irene Fernandez-Cuesta3
1
Purdue University, USA, 2Korea Advanced Institute of Science and Technology (KAIST), KOREA, and 3University of Hamburg, GERMANY
Actively participate through a mobile application to answer questions and situations. We envision a very interactive and fun event! Open to all conference attendees.

23

WEDNESDAYPROGRAM
Session XIa - MEMS/NEMS Resonators & Non-Linear Dynamics

Session XIb - BioSensors I

Session Chair:
Guillermo Villanueva, EPFL, SWITZERLAND

Session Chair:
Michael Kraft, KU Leuven, BELGIUM

Audimax

Hörsaal

13:00

ATTRACTOR EXCHANGER FOR OPEN-LOOP OPERATION OF
MICROMECHANICAL NONLINEAR RESONATORS USING
GAP-SPACING CONTINUATION
Chun-Pu Tsai and Wei-Chang Li
National Taiwan University, TAIWAN

13:00

A MULTIPLEXED BIOAFFINITY BIOSENSING PATCH FOR
POINT-OF-CARE CHRONIC ULCER MONITORING
Md Sharifuzzaman, Dongkyun Kim, Md Selim Reza, SeongHoon Jeong,
Hye Su Song, Md Abu Zahed, and Jae Yeong Park
Kwangwoon University, KOREA

13:15

A CMOS-MEMS ULTRASENSITIVE THERMOMETER USING INTERNALRESONANCE INDUCED FREQUENCY COMBS
Ting-Yi Chen, Chun-Pu Tsai, and Wei-Chang Li
National Taiwan University, TAIWAN

13:15

3-DOF BIOHYBRID ACTUATOR WITH MULTIPLE SKELETAL MUSCLE TISSUES
Xinzhu Ren, Yuya Morimoto, and Shoji Takeuchi
University of Tokyo, JAPAN

13:30
13:30

ATOMICALLY THIN NEMS FREQUENCY COMB WITH BOTH FREQUENCYTUNABILITY AND RECONFIGURABLE VIA SIMULTANEOUS
1:2 AND 1:3 MODE COUPLING
Bo Xu, Jiankai Zhu, Chenyin Jiao, Jianglong Chen, and Zenghui Wang
University of Electronic Science and Technology of China, CHINA

13:45

INSTRUMENTAL ANALYSIS OF ADVANCED CATALYSTS BASED ON
RESONANT MICROCANTILEVERS
Award Nominee
Xinyu Li1,2, Pengcheng Xu1,2, Ying Chen1,
Haitao Yu1, and Xinxin Li1,2
1
Chinese Academy of Sciences, CHINA and2
University of Chinese Academy of Sciences, CHINA

A LOW NOISE MICROELECTRODE ARRAY FOR SPECIFIC CELL ACTIVITY
MODULATION FROM CELL TO TISSUE
Bohan Zhang1,2, Huiran Yang2, Xiner Wang2,3, Ziyi Zhu2,3, Zongxing He1,
Wanqi Jiang2,3, Chen Tao1,2, Dujuan Zou2,3, Meng Li2,3, Zhitao Zhou2,3,
Liuyang Sun2,3, Tiger H. Tao1,2,3,4,5,6, and Xiaoling Wei2,31
ShanghaiTech University, CHINA, 2Chinese Academy of Sciences, CHINA,
3
University of Chinese Academy of Sciences, CHINA, 4Neuroxess Co., Ltd.
(Jiangxi), CHINA, 5Guangdong Institute of Intelligence Science and Technology,
CHINA, and 6Tianqiao and Chrissy Chen Institute for Translational Research, CHINA

13:45

BIONIC MECHANICAL HAND INTEGRATED WITH ARTIFICIAL OLFACTORYSENSOR ARRAY FOR ENHANCED OBJECT RECOGNITION
Jiachuang Wang1,2, Xiaohui Li1,2, MengWei Liu1,2, Pingping Zhang3,
Tiger H. Tao1,2,4, and Nan Qin1,2
1Chinese Academy of Sciences, CHINA, 2University of Chinese Academy of
Sciences, CHINA, 3Suzhou Huiwen Nanotechnology Co., Ltd., CHINA, and4
Neuroxess Co., Ltd. (Jiangxi), CHINA

24

WEDNESDAYPROGRAM
Poster Session III
14:00
15:30

Poster Session III
Poster presentations are listed by topic category with their assigned number starting on page 29.
Break and Exhibit Inspection

Session XIIa - Force & Displacement/Tactile Sensors & Human-Machine

Session XIIb - BioSensors II

Session Chair:
Nathan Jackson, University of New Mexico, USA

Session Chair:
Nicole Hashemi, Iowa State University, USA

Audimax

Hörsaal

16:00

HIGH RESOLUTION TACTILE SENSOR FOR MEASUREMENT OF ACOMPLICATED TACTILE FEELING OF “SHITTORI” WITH MOISTNESSGenki Yamada, Yuto Morita, Kyohei Terao,Award Nominee
Fusao Shimokawa, and Hidekuni Takao
Kagawa University, JAPAN

16:15

PYRAMIDAL STRUCTURED MXENE/ECOFLEX COMPOSITE-BASEDTOROIDAL TRIBOELECTRIC SELF-POWERED SENSOR FOR
HUMAN-MACHINE INTERFACE
Award Nominee
Shipeng Zhang, Sm Sohel Rana,
Gagan Bahadur Pradhan, Trilochan Bhatta,
Seonghoon Jeong, and Jae Yeong Park
Kangwoon University, KOREA

16:00

ONE PUSH MEMBRANE FORMATION FOR ITERATIVE MEASUREMENTOF ION CHANNEL ACTIVITY ON ARRAYED CHIP
Hisatoshi Mimura1, Toshihisa Osaki1,2, Sho Takamori1, Kenji Nakao2,
and Shoji Takeuchi1,3
1Kanagawa Institute of Industrial Science and Technology (KISTEC), JAPAN,
2
Maqsys Inc., JAPAN, and 3University of Tokyo, JAPAN

16:15

AN IMPLANTABLE DIFFERENTIAL SENSOR WITH PASSIVE WIRELESSINTERROGATION FOR IN-SITU EARLY DETECTION OF PERIPROSTHETICJOINT INFECTION
Jiaxin Jiang, Cole Napier, Chandrashekhar Choudhary, H. Claude Sagi,
Chia-Ying Lin, Michael T. Archdeacon, and Tao Li
University of Cincinnati, USA

16:30

LIG-BASED TRIAXIAL TACTILE SENSOR UTILIZING ROTATIONALERECTION SYSTEM
Rihachiro Nakashima1, Nagi Nakamura2, Tomohiko G. Sano1,
Eiji Iwase2, and Hidetoshi Takahashi11Keio University, JAPAN and 2Waseda University, JAPAN

16:30

MICROMACHINED PIEZOELECTRIC FILM-BASED FLEXIBLE ELECTRONICS
WITH INTEGRATION OF FILM-SELF TEMPERATURE-DETECTING BREATHSENSOR AND ACETONE GAS SENSOR
Hung-Yu Yeh and Guo-Hua Feng
National Tsing Hua University, TAIWAN

16:45

A STRETCHABLE STRAIN-INSENSITIVE SMART GLOVE FOR SIMULTANEOUS
DETECTION OF PRESSURE AND TEMPERATURE
Sudeep Sharma, Gagan Bahadur Pradhan, Seonghoon Jeong,and Jae Yeong Park
Kwangwoon University, KOREA

16:45

17:00

A GESTURE RECOGNITION GLOVE ASSEMBLED WITH
NANOFOREST-INTEGRATED INFRARED THERMOPILES
Mao Li1,2, Meng Shi1,2, Guidong Chen1,2, Na Zhou1,2,
Haiyang Mao1,2, and Chengjun Huang1,21Chinese Academy of Sciences, CHINA and2
University of Chinese Academy of Sciences, CHINAFLEXIBLE TACTILE SENSING ARRAY WITH HIGH SPACIAL DENSITY BASEDON PARYLENE MEMS TECHNIQUE
Meixuan Zhang1, Zetian Wang1, Han Xu2, Lang Chen1, Yufeng Jin2,3,
and Wei Wang1,3,4
1Peking University, CHINA, 2Peking University Shenzhen Graduate School, CHINA,
3
National Key Lab of Micro/Nano Fabrication Technology, CHINA, and4
Beijing Advanced Innovation Center for Integrated Circuits, CHINA

17:00

SILK-ENABLED FOLDABLE AND CONFORMAL NEURAL INTERFACEWITH IN-PLANE SHIELDING FOR HIGH-QUALITY
ELECTROPHYSIOLOGICAL RECORDINGS
Jizhi Liang1,2, Zhaohan Chen1,3, Xiner Wang1,2, Feihong Xu1,2, Xiaoling Wei1,2,
Liuyang Sun1,2, Meng Li1,2, Tiger H. Tao1,2,4,5,6,7, and Zhitao Zhou1,21Chinese Academy of Sciences, CHINA, 2University of Chinese Academy of
Sciences, CHINA, 3Shanghai Normal University, CHINA, 4ShanghaiTech
University, CHINA, 5Neuroxess Co., Ltd. (Jiangxi), CHINA, 6Guangdong Instituteof Intelligence Science and Technology, CHINA and 7Tianqiao and Chrissy
Chen Institute for Translational Research, CHINA

17:15

Adjourn for the day

25THURSDAYPROGRAMTHURSDAY, 19 JANUARYPlenary Speaker IV
Session Chair:
Núria Barniol, Universitat Autonoma de Barcelona, SPAIN
Audimax
08:30

MATERIALS ENGINEERING FOR CHEMICAL SENSING ENHANCEMENT
Navpreet Kaur, Dario Zappa, and Elisabetta Comini
University of Brescia, ITALY

Session XIII - Gas & Flow Sensors
Session Chair:
Cristian Cassella, Northeastern University, USA
Audimax
09:15

ON-DEMAND PREPARATION OF GAS-SENSING MATERIALS GUIDED BY RESONANT CANTILEVER-BASED THERMOGRAVIMETRIC ANALYSIS
Yufan Zhou1,2, Ming Li1,2, Ying Chen1,2, Xinyu Li1,2, Pengcheng Xu1,2, and Xinyu Li1,2
1
Chinese Academy of Sciences, CHINA and 2University of Chinese Academy of Sciences, CHINA

09:30

AN INTELLIGENT GAS ANALYSIS SYSTEM CONSISTING OF SENSORS AND A NEURAL NETWORK IMPLEMENTED USING THIN-FILM TRANSISTORS
Zong Liu1,2, Yushen Hu1,2, Gabriel E. Carranza1, Fei Wang2, and Man Wong1
1
Hong Kong University of Science and Technology, HONG KONG and 2Southern University of Science and Technology, CHINA

09:45

SINGLE-LAYER-ELECTRODE TEMPERATURE-MODULATED SNO2 GAS SENSOR CELL WITH LOW POWER CONSUMPTION FOR DISCRIMINATION OF FOOD ODORS
Chong Xing, Ruichen Liu, Yan Zhang, Dongcheng Xie, Yudong Wang, Yuan Huang, Muhammad Mustafa, Haochen Zhang, Zhongyu Shi, Lei Xu, and Feng Wu
University of Science and Technology of China, CHINA

10:00

A PERFORMANCE ENHANCED THERMAL FLOW SENSOR WITH NOVEL DUAL-HEATER STRUCTURE USING CMOS COMPATIBLE FABRICATION PROCESS
Zhongyi Liu1, Ruoqin Wang2, Gai Yang1, Xinyuan Zhang1, Rui Jiao2, Xuejiao Li1, Jiali Qi3, Hongyu Yu2, Huikai Xie1,4, and Xiaoyi Wang1,41
Beijing Institute of Technology, CHINA, 2Hong Kong University of Science and Technology, HONG KONG, 3Hangzhou Dianzi University, CHINA, and4
BIT Chongqing Institute of Microelectronics and Microsystems, CHINA

Session XIV - New Fabrication Techniques
Session Chair:
Shuji Tanaka, Tohoku University, JAPAN
Audimax
10:45

LOCAL METAL DEPOSITION ON HYDROGELS USING MICRO-PLASMA-BUBBLESHaruna Takahashi, Yu Yamashita, Naotomo Tottori, Shinya Sakuma, and Yoko Yamanishi
Kyushu University, JAPAN

11:00

FOLDING METHOD OF KIRIGAMI STRUCTURE WITH FOLDING LINES
Nagi Nakamura and Eiji Iwase
Waseda University, JAPAN

11:15

BUBBLE-ASSISTED RE-FORMATION OF INDIVIDUAL LIPID BILAYERS IN ARRAYED DEVICE
Izumi Hashimoto1,2, Toshihisa Osaki2, Hisatoshi Mimura2, Sho Takamori2, Norihisa Miki1,2, and Shoji Takeuchi2,3Keio University, JAPAN, 2Kanagawa Institute of Industrial Science and Technology, JAPAN, and 3University of Tokyo, JAPAN

1

11:30

LARGE-SCALE ARRAYS OF TUNABLE MONOLAYER MoS2 NANOELECTROMECHANICAL RESONATORS
Zuheng Liu1, Luming Wang3, Pengcheng Zhang1, Maosong Xie1, Yueyang Jia1, Ying Chen4, Hao Jia4, Zenghui Wang3, and Rui Yang1,2
1
University of Michigan – Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University, CHINA, 2Shanghai Jiao Tong University, CHINA,
3
University of Electronic Science and Technology of China, CHINA, and 4Chinese Academy of Sciences, CHINA

Awards Ceremony
11:45

Awards Ceremony

11:55

Final Remarks

12:00

Conference Adjourns

28

POSTERPRESENTATIONS
Ground, First, and Second Floors
MONDAY, 16 JANUARY
14:45 – 16:45

TUESDAY, 17 JANUARY
14:15 – 16:15

WEDNESDAY, 18 JANUARY
14:00 – 16:00

Poster Topic Categories(last character of poster number)a - Bio and Medical MEMSb - Emerging Technologies and New Opportunities for MEMS/NEMS
c - Industry MEMS and Advancing MEMS for Products and Sustainabilityd - Materials, Fabrication and Packaging for Generic MEMS and NEMSe - MEMS Actuators and PowerMEMS
f - MEMS Physical and Chemical Sensors
g - Micro- and Nanofluidics
h - Optical, RF and Electromagnetics for MEMS/NEMS
i - Open Posters
Posters will be on display and available for viewing on their assigned day only.
See poster ﬂoor plans at the end of this program.

a - Bio and Medical MEMS
Biosensors and Bioreactors
M01-a

ANTIFOULING FOR ELECTROCHEMICALLY BIOSENSING IN BODY FLUIDS
Wenzheng He1, Changdong Zhou2, Yang Lin2, Yuxin Tian2, Liying Liu2, Qifu Zhang2, Xiongying Ye1, and Tianhong Cui3
1
Tsinghua University, CHINA, 2Jilin Cancer Hospital, CHINA, and 3University of Minnesota, USA

T01-a

ELECTRO-MAGNETIC SENSOR MEDIATED BY MAGNETIC BIOMOLECULES
Qian Cheng1,2, Yuqing Ge1, Hongju Mao1,2, Lin Zhou1, and Jianlong Zhao1,21Chinese Academy of Science, CHINA and 2University of Chinese Academy of Sciences, CHINA

W01-a

GAS-FLOW DEVICE FOR EFFECTIVE DISSOLUTION OF GAS-PHASE ODORANTS UTILIZED FOR BIOHYBRID SENSORS
Takuma Nakane1,2, Toshihisa Osaki2, Hisatoshi Mimura2, Sho Takamori2, Norihisa Miki1,2, and Shoji Takeuchi2,31Keio University, JAPAN, 2Kanagawa Institute of Industrial Science and Technology, JAPAN, and 3University of Tokyo, JAPAN

M02-a

MULTIPLE WELLS ON A CMOS-MEA FOR CELL-BASED BIOHYBRID ODORANT SENSORS
Yujia Lian, Haruka Oda, Minghao Nie, and Shoji Takeuchi
University of Tokyo, JAPAN

T02-a

THE INTEGRATED RGO/PEDOT: PSS-MODIFIED ULTRAFLEXIBLE MICROELECTRODES TOWARDS LONG-TERM NEUROPHYSIOLOGICAL SIGNALINGAND DOPAMINE SENSITIVE DETECTION
Xueying Wang1,2, Huiran Yang1, Bohan Zhang1,3, Meng Li1,2, Liuyang Sun1,2, Zhitao Zhou1,2, Tiger H. Tao1,2,3,4,5,6, and Xiaoling Wei1,21Chinese Academy of Sciences, CHINA, 2University of Chinese Academy of Sciences, CHINA, 3Shanghai Tech University, CHINA, 4Neuroxess Co., Ltd. (Jiangxi), CHINA,
5
Guangdong Institute of Intelligence Science and Technology, CHINA, and 6Tianqiao and Chrissy Chen Institute for Translational Research, CHINA

Devices & Systems for Cellular and Molecular Studies
W02-a

COMPARISON OF SELECTIVE FILTRATION OF ON-CHIP GLOMERULUS COMPRISED OF ORGANOID-DERIVED AND IMMORTALIZED PODOCYTES
Ayumu Tabuchi1, Kensuke Yabuuchi2,3, Yoshiki Sahara2, Minoru Takasato2,4, Kazuya Fujimoto1, and Ryuji Yokokawa1
1
Kyoto university, JAPAN, 2RIKEN, JAPAN, and 3Osaka University, JAPAN

M03-a

CONTROLLING FIRING POINT OF MICROFIBER-SHAPED HIPSC-DERIVED CARDIAC TISSUE WITH LOCALIZED ELECTRICAL STIMULATION DEVICE
Akari Masuda1, Shun Itai1, Yuta Kurashina2, Shugo Tohyama1, and Hiroaki Onoe1
1
Keio University, JAPAN and 2Tokyo University of Agriculture and Technology, JAPAN

T03-a

DEVELOPMENTAL PHASES OF ON-CHIP VASCULOGENESIS CLASSIFIED USING A DEEP LEARNING VISUAL MODEL
Taiga Irisa, Hang Zhou, Kazuya Fujimoto, and Ryuji Yokokawa
Kyoto University, JAPAN

W03-a

HAND-DRIVEN DEVICE FOR PREPARATION OF LINEARLY ALIGNED HYDROGEL SHEETS
Aoi Kato1,2, Haruka Oda3, Sho Takamori2, Hisatoshi Mimura2, Toshihisa Osaki2, Norihisa Miki1,2, and Shoji Takeuchi2,31Keio University, JAPAN, 2Kanagawa Institute of Industrial Science and Technology, JAPAN, and 3University of Tokyo, JAPAN

M04-a

MICROFABRICATION AND CHARACTERIZATION OF MICRO-STEREOLITHOGRAPHICALLY 3D PRINTED, AND DOUBLEMETALLIZED BIOPLATES WITH 3D MICROELECTRODE ARRAYS FOR IN-VITRO ANALYSIS OF CARDIAC ORGANOIDS
Jorge Manrique Castro, Isaac Johnson, and Swaminathan Rajaraman
University of Central Florida, USA

29

Award Nominee

POSTERPRESENTATIONS
T04-a

OIL-SEALED RGD-MODIFIED HYDROGEL MICROWELL ARRAY WITH SIZE- SELECTIVE PERMEATION FOR ANALYSIS ON EXOSOMES FROM SINGLE CELLS
Chisaki Yamagata1, Shun Itai1, Yuta Kurashina2, Makoto Asai1, Ayuko Hoshino3, and Hiroaki Onoe1
Award Nominee
1
Keio University, JAPAN, 2Tokyo University of Agriculture and Technology, JAPAN, and 3Tokyo Institute of Technology, JAPAN

W04-a

PICKING SINGEL CELLS FROM 10 ML SAMPLE BASED ON A MICROFILTRATION- LIFT COMBINATION PLATFORM
Qingmei Xu1, Yuntong Wang2,3, Xiao Ma4, Hang Li5, Ying Xue5, Yi Zhang1, Songtao Dou1, Huan Wang2, Bei Li2,5, and Wei Wang1,6,7
1
Peking University, CHINA, 2Chinese Academy of Sciences, CHINA, 3University of Chinese Academy of Sciences, CHINA,
4
Hangzhou Branemagic Medical Technology Co. Ltd., CHINA, 5Hooke Laboratory, CHINA, 6National Key Lab of Micro/NanoFabrication Technology, CHINA, and 7Beijing Advanced Innovation Center for Integrated Circuits, Beijing, CHINA

Flexible and Wearable Devices and Systems
M05-a

A TRANSFER METHOD FOR EMBEDDING CONDUCTIVE FILLERS ON THE SURFACE OF MULTI-SCALE STRUCTURES FOR 3D FLEXIBLE CONDUCTORS
Dongwoo Yoo, Sangmok Kim, Jeonghyeon Hwang, and Joonwon Kim
Pohang University of Science and Technology (POSTECH), KOREA

T05-a

FABRICATION OF HIGH FREQUENCY 2D FLEXIBLE PMUT ARRAY
Sanjog V. Joshi, Sina Sadeghpour, and Michael Kraft
KU Leuven, BELGIUM

W05-a

FLEXIBLE SILK-BASED GRAPHENE BIOELECTRONICS FOR WEARABLE MULTIMODAL PHYSIOLOGICAL MONITORING
Sajjad Mirbakht1, Ata Golparvar1,2, Muhammad Umar1, and Murat Kaya Yapici1,3
1
Sabanci University, TURKEY, 2École Polytechnique Fédérale de Lausanne (EPFL), SWITZERLAND, and 3University of Washington, USA

M06-a

HIGHLY ACCURATE MEASUREMENT OF CONTACT RESISTANCE BETWEEN GALINSTAN AND COPPER USING TRANSFER LENGTH METHOD
Takashi Sato and Eiji Iwase
Waseda University, JAPAN

T06-a

MACHINE LEARNING ENABLED HIND FOOT DEFORMITY DETECTION USING INDIVIDUALLY ADDRESSABLE HYBRID PRESSURE SENSOR MATRIX
Nadeem Tariq Beigh, Faizan Beigh, Sourav Naval, Dibyajyoti Mukherjee, and Dhiman Mallick
Indian Institute of Technology, Delhi, INDIA

W06-a

MULTI-MODE E-SKIN INTEGRATING CAPACITIVE-PIEZOELECTRIC SENSORS FOR STATIC-DYNAMIC MECHANORESPONSE WITH WIDE SENSING RANGE
Mujeeb Yousuf1, Sushil Kumar1, Dhairya Singh Arya2, Manu Garg1, Khanjhan Joshi1, and Pushpapraj Singh1
1
Indian Institute of Technology, Delhi, INDIA and 2CSIR-Central Scientific Instruments Organisation (CSIO), INDIA

M07-a

NON-INVASIVE INSTANT MEASUREMENT OF ARTERIAL STIFFNESS BASED ON HIGH-DENSITY FLEXIBLE SENSOR ARRAYFang Wang1,2, Heng Yang1,2, Ke Sun1, Yi Sun1, and Xinxin Li1,2
1
Chinese Academy of Sciences, CHINA and 2University of Chinese Academy of Sciences, CHINA

T07-a

SUPPRESSION OF BIOELECTRICAL NOISE SIGNALS IN MOTION STATE BY LOW-COST MICROPILLAR HYDROGEL ELECTRODE
Gencai Shen, Nan Zhao, Chunpeng Jiang, Zhuangzhuang Wang, and Jingquan Liu
Shanghai Jiao Tong University, CHINA

W07-a

ULTRA-THIN MEMS PACKAGING BASED ON AUXETIC STRETCHABLE STRUCTURES FOR APPLICATIONS IN WEARABLE ELECTRONICS
Daniel Zymelka, Toshihiro Takeshita, Yusuke Takei, and Takeshi Kobayashi
National Institute of Advanced Industrial Science and Technology, JAPAN

M08-a

ULTRALOW POWER FLEXIBLE OCULAR MICROSYSTEM FOR VERGENCE AND DISTANCE SENSING BASED ON PASSIVE DIFFERENTIAL MAGNETOMETRY
Adwait Deshpande, Mohit U. Karkhanis, Chayanjit Ghosh, Hanseup Kim, and Carlos H. Mastrangelo
University of Utah, USA

Manufacturing for Bio- & Medical MEMS
T08-a

ELECTROHYDRODYNAMIC NEBULISER (eNEB) FOR DIRECT PULMONARY DRUG DELIVERY APPLICATION
Trung-Hieu Vu1, Luan Ngoc Mai2,3, Tuan-Hung Nguyen1, Dang Tran1, Tuan-Khoa Nguyen1, Thanh Nguyen4, Jarred Fastier-Woollel1,5,
Canh-Dung Tran4, Toan Dinh4, Hong-Quan Nguyen1, Dzung Viet Dao1, and Van Thanh Dau1
1
Griffith University, AUSTRALIA, 2Ho Chi Minh City University of Technology (HCMUT), VIETNAM, 3Vietnam National University, VIETNAM,
4
University of Southern Queensland, AUSTRALIA, and 5University of Tokyo, JAPANW08-a

FLEXIBLE POLYMER OPTICAL WAVEGUIDES FOR INTEGRATED OPTOGENETIC BRAIN IMPLANTS
Julian A. Singer1, Till Stramm2, Jens Fasel2, Oliver Schween2, Anton Gelaeschus1, Andreas Bahr1,3, and Matthias Kuhl4
1
Hamburg University of Technology, GERMANY, 2TU Dortmund University, GERMANY, 3University of Kiel, GERMANY, and 4University of Freiburg, GERMANY

M09-a

HIGHLY REPRODUCIBLE TISSUE POSITIONING WITH TAPERED PILLAR DESIGN IN ENGINEERED HEART TISSUE PLATFORMS
Milica Dostanic1,2, Laura M. Windt2, Maury Wiendels2, Berend J. van Meer2, Christine L. Mummery2,3, Pasqualina M. Sarro1, and Massimo Mastrangeli1
1
Delft University of Technology, NETHERLANDS, 2Leiden University Medical Center, NETHERLANDS, and 3University of Twente, NETHERLANDS

T09-a

IN VITRO ASSEMBLY OF MUSCLE RINGS AND BIOPRINTED HYDROGEL FOR BRANCHING TUBULAR TISSUE CONSTRUCTS
Tomohiro Morita, Byeongwook Jo, Minghao Nie, and Shoji Takeuchi
University of Tokyo, JAPAN

W09-a

MICROELECTRODES FABRICATED BY VACUUM FILLING WITH LOW MELTING-POINT ALLOY FOR MUSCLE TISSUE STIMULATION
Tingyu Li, Minghao Nie, Yuya Morimoto, and Shoji Takeuchi
University of Tokyo, JAPAN

M10-a

OPTOELECTRONIC INTEGRATED ULTRAMICROELECTRODE FOR OPTICAL STIMULATION AND ELECTRICAL RECORDING OF SINGLE-CELL
Qingda Xu, Ye Xi, Zhiyuan Du, Longchun Wang, Tao Ruan, Mengfei Xu, Jiawei Cao, Bin Yang, and Jingquan Liu
Shanghai Jiao Tong University, CHINA

T10-a

THERMOFORMING OF PARYLENE C TO FORM HELICAL STRUCTURES
Brianna L. Thielen and Ellis Meng
University of Southern California, Los Angeles, USA

30

POSTERPRESENTATIONS
Materials for Bio- and Medical MEMS
W10-a

FABRICATION OF BIODEGRADABLE SOFT TISSUE-MIMICKED MICROELECTRODE ARRAYS FOR IMPLANTED NEURAL INTERFACING
Wei-Chen Huang1, Wan-Lou Lei1, and Chih-Wei Peng2
1
National Yang Ming Chiao Tung University, TAIWAN and 2Taipei Medical University, TAIWAN

Medical Microsystems
M1-a

AN OPTIMIZATION OF PERFORATION DESIGN ON A PIEZOELECTRIC-BASED SMART STENT FOR BLOOD PRESSURE MONITORING AND
LOW-FREQUENCY VIBRATIONAL ENERGY HARVESTING
Jun Ying Tan1, Sayemul Islam2, Yuankai Li3, Albert Kim2, and Jungkwun “JK” Kim1
1
University of North Texas, USA, 2University of South Florida, USA, and 3Kansas State University, USA

W11-a

DEVELOPMENT OF AN ELECTRICAL-STIMULATION-INDUCED MECHANOMYOGRAM PROBE FOR MUSCLE CONTRACTION CHARACTERISTICS EVALUATION
Yusuke Takei, Toshihiro Takeshita, Daniel Zymelka, and Takeshi Kobayashi
National Institute of Advanced Industrial Science and Technology (AIST), JAPAN

M12-a

DUAL-FREQUENCY PIEZOELECTRIC MICROMACHINED ULTRASONIC TRANSDUCERS FOR FUNDAMENTAL AND HARMONIC IMAGING
Yanfen Zhai, Waleed Maqsood, Zhou Da, Nikolai Andrianov, Yucheng Zhang, Mohssen Moridi, and Lixiang Wu
Silicon Austria Labs GmbH, AUSTRIA

T12-a

FRACTAL MICROELECTRODES INTEGRATED WITH THE CATHETER FOR LOW-VOLTAGE PULSED FIELD ABLATION
Mengfei Xu1, Mu Qin2, Ziliang Song3, Wen Hong1, Qingda Xu1, Jiawei Cao1, Kejun Tu1, Longchun Wang1, Bin Yang1, and Jingquan Liu1
1
Shanghai Jiao Tong University, CHINA, 2Shanghai Chest Hospital Affiliated to Shanghai Jiao Tong University, CHINA, and3
Shanghai General Hospital Shanghai Jiao Tong University School of Medicine, CHINA

W12-a

HIERARCHICAL BONDING YIELD TEST STRUCTURE FOR FLEXIBLE HIGH CHANNEL-COUNT NEURAL PROBES INTERFACING ASIC CHIPS
Marie C. Odenthal, Victor Claar, Oliver Paul, and Patrick Ruther
University of Freiburg, GERMANY

M13-a

MICROWAVE-INDUCED THERMOACOUSTIC IMAGING USING ALUMINUM NITRIDE PMUT
Yiwei Wang1, Lejia Zhang1, Junxiang Cai1,2,3, Baosheng Wang1,2,3, Yuandong Alex Gu5, Liang Lou5, Xiong Wang1,2,3,4, and Tao Wu1,2,3,4
1
ShanghaiTech University, CHINA, 2Chinese Academy of Sciences, CHINA, 3University of Chinese Academy of Sciences, CHINA, 4Shanghai Engineering
Research Center of Energy Efficient and Custom AI IC, CHINA, and 5Shanghai Industrial μTechnology Research Institute, CHINA

T13-a

NEEDLE-FREE DRUG INJECTION USING A SHOCK WAVE FOCUSING SYSTEM WITH THE FUNCTION OF REAL-TIME MICROBUBBLE-BASED DISTANCE SENSING
Yibo Ma, Wenjing Huang, Keita Ichikawa, and Yoko Yamanishi
Kyushu University, JAPANW13-a

NEW WAFER-LEVEL FABRICATION OF ULTRATHIN SILICON INSERTION SHUTTLES FOR FLEXIBLE NEURAL IMPLANTS
Kirti Sharma1, Christian Boehler1, Maria Asplund1,2, Oliver Paul1, and Patrick Ruther1
1
University of Freiburg, GERMANY and 2Chalmers University of Technology, SWEDEN

M14-a

REAL-TIME DYNAMIC LACTATE DETECTION IN A PIPELINE USING A MICROSENSING NEEDLE FOR ICU PATIENT MONITORING APPLICATION
Yuan-Sin Tang1, Tung-Lin Yang2, Yu-Ting Cheng1, Hsiao-En Tsai2,3, and Yih-Shurng Chen3,41
National Yang Ming Chiao Tung University, TAIWAN, 2National Taiwan Hospital HsinChu Branch, TAIWAN, 3National Taiwan University College ofMedicine Graduate Institute of Clinical Medicine, TAIWAN, and 4National Taiwan University Hospital, TAIWAN

T14-a

THREE-DIMENSIONAL FLEXIBLE NEURAL OPTO-ELECTRONIC ARRAY WITH SILK-BASED SHUTTLE-FREE IMPLANTATION
Chi Gu2,3, Huiran Yang2, Bohan Zhang2,4, Zhitao Zhou2, Liuyang Sun2,3, Meng Li2,3, Xiaoling Wei2,3, and Tiger H. Tao1,2,3,4,5,6
1
Guangdong Institute of Intelligence Science and Technology, CHINA, 2Chinese Academy of Sciences, CHINA, 3University of Chinese Academy of Sciences, CHINA,
4
ShanghaiTech University, CHINA, 5Neuroxess Co., Ltd. (Jiangxi), CHINA, and 6Tianqiao and Chrissy Chen Institute for Translational Research, CHINA

Award Nominee

MEMS & BioMEMS for Fighting COVID-19 & Future Pandemic
W14-a

A MICROFLUIDIC BIOSENSOR FOR RAPID DETECTION OF COVID-19
Sura A. Muhsin1, Ying He1, Muthana Al-Amidie1, Karen Sergovia1, Amjed Abdullah1, Yang Wang1, Omar Alkorjia1, Robert A. Hulsey2,
Gary L. Hunter2, Zeynep Erdal2, Ryan J. Pletka2, George S. Hyleme2, Xiu-Feng Wan1,2, and Mahmoud Almasri1
1
University of Missouri, USA and 2Black and Veatch, USA

M15-a

A LOOP-MEDIATED ISOTHERMAL AMPLIFICATION (LAMP)-BASED POINT-OF-CARE SYSTEM FOR RAPID ON-SITE CLINICAL DETECTION OF SARS-COV-2 VIRUSES
Trieu Nguyen1, Aaydha Chidambara Vinayaka1, Van Ngoc Huynh1, Quyen Than Linh1, Sune Zoëga Andreasen1, Mohsen Golabi1, Dang Duong Bang1,
Jens Kjølseth Møller2, and Anders Wolff1
1Technical University of Denmark, DENMARK and 2University Hospital of Southern Denmark, DENMARKMEMS & BioMEMS for Healthcare and Public Health
T15-a

A SOLAR-DRIVEN WEARABLE MULTIPLEXED BIO-SENSING SYSTEM FOR NONINVASIVE HEALTHCARE MONITORING IN SWEAT
Jujhar Singh, Bianca Ning, Paul Lee, and Lin Liu
Seattle Pacific University, USA

W15-a

HIGH-THROUGHPUT MASS MEASUREMENT OF SINGLE BACTERIAL CELLS BY SILICON NITRIDE MEMBRANE RESONATORS
Adrián Sanz-Jiménez1, Oscar Malvar1, Jose J. Ruz1, Sergio García-López1, Priscila M. Kosaka1, Eduardo Gil-Santos1, Álvaro Cano1, Dimitris Papanastasiou2,
Diamantis Kounadis2, Elias Panagiotopoulos2, Jesús Mingorance3, María Rodríguez-Tejedor3, Álvaro San Paulo1, Montserrat Calleja1, and Javier Tamayo1
1
Instituto de Micro y Nanotecnología, SPAIN, 2Fasmatech Science & Technology, Lefkippos TESPA, Demokritos NCSR, Patriarchou Gregoriou & Neapoleos, GREECE, and3
Hospital Universitario La Paz, Madrid, SPAIN

M16-a

MICROFABRICATED ISOTHERMAL EG-FET SENSOR FOR LAMP MEDIATED CRISPR/CAS12A DETECTION OF HEPATITIS C VIRUS
Hsin-Ying Ho, Wei-Sin Kao, Piyush Deval, Ling-Shan Yu, and Che-Hsin Lin
National Sun Yat-sen Universit, TAIWAN

31

POSTERPRESENTATIONS
T16-a

SMART ELECTRODE ARRAY FOR COCHLEAR IMPLANTS
Ahmad Itawi1, Soﬁane Ghenna1, Guillaume Tourrel2, Sébastien Grondel1, Cedric Plesse3, Tran Minh Giao Nguyen3, Frédéric Vidal3, Yinoussa Adagolodjo4,
Lingxiao Xun4, Gang Zheng4, Alexandre Kruszewski4, Christian Duriez4, and Eric Cattan1
1
University Polytechnique Hauts-de-France, FRANCE, 2Oticon Medical, FRANCE, 3CY Cergy Paris Université, FRANCE, and 4University of Lille, FRANCE

Tissue Engineering
W16-a

A THREE-DIMENSIONAL ARTIFICIAL INTESTINAL TISSUE WITH A CRYPT-LIKE INNER SURFACE
Shuma Tanaka1, Shun Itai2, and Hiroaki Onoe1
1
Keio University, JAPAN and 2Tohoku University, JAPAN

M17-a

TISSUE-ENGINEERED PENNATE MUSCLES ON A CHIP
Motoki Ito, Yuya Morimoto, and Shoji Takeuchi
University of Tokyo, JAPAN

T17-a

WEIGHT TRAINING DEVICE TO PROMOTE MATURATION IN SKELETAL MUSCLE TISSUES
Kentaro Motoi, Byeongwook Jo, Yuya Morimoto, and Shoji Takeuchi
University of Tokyo, JAPAN

Other Bio and Medical MEMS
W17-a

MICROSYSTEM VIBRATING MESH ATOMIZER WITH INTEGRATED MICROHEATER FOR HIGH VISCOSITY LIQUID AEROSOL GENERATION
Pallavi Sharma, Irma Rocio Vazquez, and Nathan Jackson
University of New Mexico, USA

M18-a

SCALABLE MODULAR MEASUREMENT SYSTEM FOR CONTINUOUS BLOOD MONITORING WITH PIEZOELECTRIC MEMS RESONATORS
Michael Schneider1, Bernhard Kößl1, Suresh Alasatri1, Ingrid A.M. Magnet2, and Ulrich Schmid1
1
TU Wien, AUSTRIA and 2Medical University of Vienna, AUSTRIA

T18-a

SILICON COMPATIBLE PROCESS TO INTEGRATE IMPEDANCE CYTOMETRY WITH MECHANICAL CHARACTERIZATION
Quentin Rezard1, Faruk Azam Shaik1,2, Jean Claude Gerbedoen1,2, Fabrizio Cleri1, Dominique Collard1,2, Chann Lagadec1, and Mehmet C. Tarhan1,2
1
University of Lille, FRANCE and 2University of Tokyo, Lille, FRANCE

W18-a

SORTING OF EXTRACELLULAR VESICLES BY USING OPTICALLY-INDUCED DIELECTROPHORESIS ON AN INTEGRATED MICROFLUIDIC CHIP
Wei-Jen Soong, Chih-Hung Wang, Yi-Sin Chen, Chihchen Chen, and Gwo-Bin Lee
National Tsing Hua University, TAIWAN

b - Emerging Technologies and New Opportunities for MEMS/NEMS
Internet of Things (IoT) with MEMS/NEMS
M19-b

A REPROGRAMMABLE MEM SWITCH UTILIZING CONTROLLED CONTACT WELDING
Tsegereda K. Esatu, Hei Kam, Lars P. Tatum, Xiaoer Hu, Urmita Sikder, Sergio Almeida, Junqiao Wu, and Tsu-Jae King Liu
University of California, Berkeley, USA

T19-b

MICROMECHANICAL RSSI BASED ON FORCE INTERACTION DERIVED TAPPING BANDWIDTH VARIATION IN VIBRO-IMPACT RESONATORS
Yi-Hsuan Huang, Hong-Sen Zheng, Chun-Pu Tsai, and Wei-Chang Li
National Taiwan University, TAIWAN

W19-b

WAKE-UP IOT WIRELESS SENSING NODE BASED ON A LOW-G THRESHOLD MEMS INERTIAL SWITCH WITH RELIABLE CONTACTS
Sagnik Ghosh1, Duan Jian Goh1, Yul Koh1, Jaibir Sharma1, Wei Da Toh1, Weiguo Chen1, Yao Zhang1, Eldwin Ng1, Amit Lal2, and Joshua E.-Y. Lee1
1
Agency for Science, Technology and Research (A*STAR), SINGAPORE and 2Cornell University, USA

Machine Learning (ML) & Artificial Intelligence (AI) Enhanced MEMS/NEMS Design, Manufacturing, and Applications
M20-b

ARTIFICIAL INTELLIGENCE (AI)-ENHANCED E-SKIN WITH ARTIFICIAL SYNAPSE SENSORY OUTPUT FOR HUMANOID ROBOTIC FINGER OF MULTIMODAL PERCEPTION
Xinge Guo1,2 and Chengkuo Lee1
1
National University of Singapore, SINGAPORE and 2Agency for Science, Technology and Research (A*STAR), SINGAPORE

T20-b

MULTI-MEMS DIFFERENTIAL PRESSURE SENSOR ELEMENTS-BASED AIRFLOW SENSOR WITH NEURAL NETWORK MODEL
Kotaro Haneda, Kenei Matsudaira, and Hidetoshi Takahashi
Keio University, JAPAN

W20-b

TRIAL-AND-ERROR LEARNING FOR MEMS STRUCTURAL DESIGN ENABLED BY DEEP REINFORCEMENT LEARNING
Fanping Sui1, Wei Yue1, Ziqi Zhang2, Ruiqi Guo1, and Liwei Lin1,2
1
University of California, Berkeley, USA and 2TSinghua University, CHINA

New Computing Devices and Systems with MEMS/NEMS
M21-b

FULLY MICROELECTROMECHANICAL NON-VOLATILE MEMORY CELL
Elliott Worsey, Mukesh K. Kulsreshath, Qi Tang, and Dinesh Pamunuwa
University of Bristol, UK

T21-b

NONVOLATILE STATE CONFIGURATION OF NANO-WATT PARAMETRIC ISING SPINS THROUGH FERROELECTRIC HAFNIUM ZIRCONIUM OXIDE MEMS VARACTORS
Nicolas Casilli1, Onurcan Kaya1, Tahmid Kaisar2, Benyamin Davaji1, Philip X.-L. Feng2, and Cristian Cassella1
1
Northeastern University, USA and 2University of Florida, USA

W21-b

PHYSICAL RESERVOIR COMPUTING USING NONLINEAR MEMS RESONATOR HAVING HIGH MEMORY CAPACITY AT “EDGE OF CHAOS”
Hiroki Takemura, Takahiro Mizumoto, Amit Banerjee, Jun Hirotani, and Toshiyuki Tsuchiya
Kyoto University, JAPAN32

POSTERPRESENTATIONS
M22-b

PROGRAMMABLE FERROELECTRIC HZO NEMS MECHANICAL MULTIPLIER FOR IN-MEMORY COMPUTING
Shubham Jadhav, Ved Gund, and Amit Lal
Cornell University, USA

T22-b

STORING MEMS INTERFACES WITHOUT ELECTRICAL AUXILIARY ENERGY FOR LONG-TIME MONITORING
Martin Hoffmann1, Philip Schmitt1, Steffen Wittemeier3, Falk Schaller2, Alexey Shaporin3, Chris Stöckel2,3, Volker Geneiß3, Roman Forke3, Christian Hedayat3,
Ulrich Hilleringmann4, Harald Kuhn2,3, and Sven Zimmermann2,3
1
Ruhr-Universität Bochum, GERMANY, 2Chemnitz University of Technology, GERMANY, 3Fraunhofer Institute for Electronic Nano Systems ENAS, GERMANY, and4
University of Paderborn, GERMANY

Nonlinear Dynamics in MEMS/NEMS
W22-b

A NEW FINDING ON NONLINEAR DAMPING AND STIFFNESS OF FLEXURAL MODE CAPACITIVE MEMS RESONATORS
Hung-Yu Chen, Ming-Huang Li, and Sheng-Shian Li
National Tsing Hua University, TAIWAN

M23-b

EXPLOITING PARAMETRIC INSTABILITY IN BISTABLE MEMS ACTUATORS
Daniel Platz, Johannes Fabian, Elisabeth Samm, Mahdi Mortada, Michael Schneider, and Ulrich Schmid
TU Wien, AUSTRIA

T23-b

FIRST PROTOTYPE OF POLYMER MICROMACHINED FLAPPING WING NANO AIR VEHICLE
Rashmikant, Ryotaro Suetsugu, Minato Onishi, and Daisuke Ishihara
Kyushu Institute of Technology, JAPAN

W23-b

ITERATIVE LEARNING CONTROL FOR QUASI-STATIC MEMS MIRROR WITH SWITCHING OPERATION
Matthias Macho1, Han Woong Yoo1, Richard Schroedter2, and Georg Schitter1
1
TU Wien, AUSTRIA and 2TU Dresden, GERMANY

Quantum Devices and Systems with MEMS/NEMS
M24-b

Mz ATOMIC MAGNETOMETER USING A 3D MEMS GLASS ALKALI VAPOR CELL WITH VERTICAL SIDEWALLSJin Zhang, Jianfeng Zhang, Wenqi Li, Ziji Wang, and Jintang ShangSoutheast University, CHINA

T24-b

ON-CHIP HEATING NOISE SUPPRESSION OF 3D CHIP-SCALE ATOMIC MAGNETOMETER USING SINGLE-LAYER SHIFTED HEATER
Ziji Wang, Junming Wu, Jin Zhang, and Jintang ShangSoutheast University, CHINA

c - Industry MEMS and Advancing MEMS for Products and Sustainability
Barriers to Commercialization & Research Needs for Future Products
W24-c

LABOR-SAVING PLATFORM FOR CHARACTERIZATION OF MEMBRANE PROTEINS BY AUTOMATED MONITORING AND DATA REPORTING
Kazuto Ogishi1, Toshihisa Osaki2, Yuya Morimoto1, and Shoji Takeuchi1,2
1
University of Tokyo, JAPAN and 2Kanagawa Institute of Industrial Science and Technology, JAPANMEMS Packaging Techniques
M25-c

MODELLING IMPACT OF VISCOELASTIC PROPERTIES OF DIE-ATTACH MATERIAL ON THE BIAS RESPONSE OF RESONANT INERTIAL SENSORS
Theo Miani1, Lokesh Gurung1, Guillermo Sobreviela-Falces1, Douglas Young1, Colin Baker1, and Ashwin A. Seshia2
1
Silicon Microgravity Ltd., UK and 2University of Cambridge, UK

MEMS/NEMS - CMOS Integration
T25-c

CMOS-EMBEDDED 3D MICRO/NANOFLUIDICS EMPLOYING TOP-DOWN BEOL SINGLE-STEP WET-ETCHING TECHNIQUE
Wei-Yang Weng, Hung-Yu Hou, Yueh-Jung Chao, Shwu-Jen Liaw, and Jun-Chau Chien
National Taiwan University, TAIWAN

W25-c

IMPLEMENTATION OF A MONOLITHIC SOC ENVIRONMENTAL SENSING HUB USING CMOS-MEMS TECHNIQUE
Ya-Chu Lee1, Tung-Lin Chien1, Chi-Te Fang1, Yuanyuan Huang1, Wei-Lun Sung2, Yen-Chang Chu2, Rongshun Chen1, and Weileun Fang1
1
National Tsing Hua University, TAIWAN and 2PixArt Imaging Inc., TAIWAN

M26-c

MONOLITHICALLY AND VERTICALLY INTEGRATED ENVIRONMENTAL SENSING HUB WITH NOVEL AIR-BASED HUMIDITY SENSOR DESIGN
Tung-Lin Chien, Yuanyuan Huang, Fuchi Shih, and Weileun Fang
National Tsing Hua University, TAIWANNew MEMS System Design and Integration Approaches
T26-c

A SELF-CORRECTED, SELF-CLEANED MEMS AND SUITABLE FOR ADVANCED FOUNDRY MULTI-PROJECT WAFER (MPW)
Sushil Kumar, Dhairya Singh Arya, Manu Garg, and Pushpapraj Singh
Indian Institute of Technology, New-Delhi, INDIA

W26-c

MONOLITHIC INTEGRATION OF HUMIDITY/FLOW/TEMPERATURE SENSORS AS ENVIRONMENT SENSING HUB FOR APPARENT-TEMPERATURE DETECTION
Yu-Hsuan Li, Tung-Lin Chien, Fuchi Shih, Yuanyuan Huang, and Weileun Fang
National Tsing Hua University, TAIWAN

M27-c

PIEZORESISTIVE PRESSURE SENSOR WITH MONOLITHICALLY INTEGRATED AMPLIFIER BASED ON METAL-OXIDE TRANSISTORS
Runxiao Shi1, Dequan Lin1, Kevin Chau1,2, and Man Wang1
1
Hong Kong University of Science and Technology, HONG KONG and 2Chinese Academy of Sciences, CHINA

33

POSTERPRESENTATIONS
d - Materials, Fabrication and Packaging for Generic MEMS and NEMS
Advancement in Conventional Materials for MEMS & NEMS
T27-d

A PERFORMANCE ENHANCEMENT METHOD FOR THERMOPILE SENSORS USING A CHIP PROBE TEST SYSTEM
Meng Shi1,2, Mao Li1,2, Yue Ni3, Chenchen Zhang1, Na Zhou1,2, Haiyang Mao1,2, and Chengjun Huang1,21Chinese Academy of Sciences, CHINA, 2University of Chinese Academy of Sciences, CHINA, and 3Jiangsu Hinovaic Technologies Co., Ltd, CHINA

W27-d

CHARACTERIZING INDUCTIVELY-COUPLED-PLASMA ETCHING OF SINGLE CRYSTALLINE LITHIUM TANTALATE FOR MICRO-ACOUSTIC APPLICATIONS
Yasaman Majd, Jorge Manrique Castro, Hakhamanesh Mansoorzare, and Reza Abdolvand
University of Central Florida, USA

M28-d

ROBUST POLYCRYSTALLINE 3C-SIC-ON-SI HETEROSTRUCTURES WITH LOW CTE MISMATCH UP TO 900 °C FOR MEMS
Philipp Moll, Georg Pfusterschmied, and Ulrich Schmid
TU Wien, AUSTRIA

Digital Micromanufacturing
T28-d

A 3D PRINTED FUNCTIONAL MEMS ACCELEROMETER
Simone Pagliano1, David E. Marschner1, Damien Maillard2, Nils Ehrmann3, Göran Stemme1, Stefan Braun3, Luis Guillermo Villanueva2, and Frank Niklaus1
1
KTH Royal Institute of Technology, SWEDEN, 2École Polytechnique Fédérale de Lausanne (EPFL), SWITZERLAND, and 3Hochschule Kaiserslautern, GERMANY

W28-d

A FULLY 3D PRINTED METHOD FOR MONOLITHIC INTEGRATION OF AN ACCELEROMETER AND A FORCE SENSOR
Guandong Liu1,2, Changhai Wang1, Kexin Wang1, Zhili Jia3, Ruiqi Luo2, and Wei Ma2,4
1
Heriot-Watt University, UK, 2Zhejiang Lab, CHINA, 3National Institute of Metrology, CHINA, and 4Zhejiang University, CHINA

Generic MEMS & NEMS Manufacturing Techniques
M29-d

CHARACTERIZATION OF VAPOR HF SACRIFICIAL ETCHING THROUGH SUBMICRON RELASE HOLES FOR WAFER-LEVEL VACUUM PACKAGING
BASED ON SILICON MIGRATION SEAL
Tianjiao Gong1, Yukio Suzuki1, Muhammad J. Khan1, Karla Hiller2, and Shuji Tanaka1
1
Tohoku University, JAPAN and 2Fraunhofer Institute for Electronic Nano Systems, GERMANY

T29-d

DAMAGE PROFILE MODELING AND EXPERIMENT OF SILICON CARBIDE SUBSTRATES IN MICRO-NANO STRUCTURE FABRICATED BY HELIUM FOCUSED ION BEAM
Shupeng Gao, Xi Chen, Qianhuang Chen, Qi Li, and Yan Xing
Southeast University, CHINA

W29-d

LIQUID-IMMERSION INCLINED-ROTATED UV LITHOGRAPHY FOR MICRO SUCTION CUP ARRAY
Gakuto Kagawa and Hidetoshi Takahashi
Keio University, JAPANNew & Emerging Materials for MEMS/NEMS
M30-d

PARAMETRIC AMPLIFICATION AND PHONONIC FREQUENCY COMB GENERATION IN MoS2 NANOELECTROMECHANICAL RESONATORSS M Enamul Hoque Yousuf1, Yunong Wang1, Jaesung Lee1, Steven W. Shaw2,3, and Philip X.-L. Feng1
1
University of Florida, USA, 2Florida Institute of Technology, USA, and 3Michigan State University, USA

T30-d

PARYLENE-N AS A HIGH TEMPERATURE THIN FILM PIEZOELECTRIC MATERIAL
Nathan Jackson and Deepak Kunwar
University of New Mexico, USA

W30-d

SILICON CARBIDE-ON-INSULATOR THERMAL-PIEZORESISTIVE RESONATOR FOR HARSH ENVIRONMENT APPLICATION
Baoyun Sun1,2, Jiarui Mo1, Hemin Zhang3, Henk W. van Zeijl1, Willem D. van Driel1, and Guoqi Zhang1
1
Delft University of Technology, NETHERLANDS, 2China University of Petroleum, CHINA, and 3KU Leuven, BELGIUM

M31-d

SPIN COATING OF HIGHLY ALIGNED AGCN MICROWIRES EPITAXIALLY GROWN ON 2D MATERIALS
Jimin Ham, Jaemook Lim, Joowon Lim, Gunyoung Jang, Sueng Yoon Lee, Dohyun Lim, Sukjoon Hong, and Won Chul Lee
Hanyang Universit, Ansan, KOREA

T31-d

SUSPENDED TWO-DIMENSIONAL MATERIAL MEMBRANES FOR SENSOR APPLICATIONS FABRICATED WITH A HIGH-YIELD TRANSFER PROCESS
Sebastian Lukas1, Ines Kraiem1,2, Maximilian Prechtl3, Oliver Hartwig3, Annika Grundmann1, Holger Kalisch1, Satender Kataria1, Michael Heuken1,4,
Andrei Vescan1, Georg S. Duesberg3, and Max C. Lemme1,2
1
RWTH Aachen University, GERMANY, 2AMO GmbH, GERMANY, 3University of the Bundeswehr Munich, GERMANY, and 4AIXTRON SE, GERMANY

W31-d

TCF-IMPROVED SH0 MODE ACOUSTIC RESONATORS BASED ON 30°YX-LINBO3/SIO2 MEMBRANE
Shuxian Wu1, Zonglin Wu1, Hangyu Qian1, Feihong Bao1, Gongbin Tang2, Feng Xu1, and Jie Zou1
1
Fudan University, CHINA and 2Shandong University, CHINA

M32-d

WAFER SCALE MULTILAYER GRAPHENE BASED BRAIN PROBES BY SPIN-SPRAYING METHODS FOR MAGNETIC RESONANCE IMAGING
Kejun Tu, Zhejun Guo, Mengfei Xu, Bin Yang, and Jingquan Liu
Shanghai Jiao Tong University, CHINA

New Fabrication Processes for Making MEMS/NEMS
T32-d

3D SELF-ALIGNED FABRICATION OF SUSPENDED NANOWIRES BY CRYSTALLOGRAPHIC NANOLITHOGRAPHY
Erwin J.W. Berenschot, Yasser Pordeli, Lucas J. Kooijman, Yves L. Janssens, Roald M. Tiggelaar, and Niels R. Tas
University of Twente, NETHERLANDS

34

POSTERPRESENTATIONS
W32-d

A SIMPLE PROCESS FOR THE FABRICATION OF PARALLEL-PLATE ELECTROSTATIC MEMS RESONATORS BY GOLD THERMOCOMPRESSION BONDING
Dolores Manrique Juarez1, Fabrice Mathieu1, Guillaume Libaude1, David Bourrier1, Samuel Charlot1, Laurent Mazenq1, Véronique Conédéra1,
Ludovic Salvagnac1, Isabelle Dufour2, Liviu Nicu1, and Thierry Leïchlé1,3
1
LAAS-CNRS, FRANCE, 2Université de Bordeaux, IMS UMR-CNRS, FRANCE, and 3Georgia Tech, USA

M33-d

ELECTROMECHANICALLY STABLE INTERCONNECTION BETWEEN LIG AND THICK DAM-SHAPED METALLIC ELECTRODE VIA STORED AG MICROPARTICLE SOLUTION
Saeyoung Park, Yoo-Kyum Shin, and Min-Ho Seo
Pusan National University, KOREA

T33-d

FREE-STANDING MEMBRANES WITH SELF-ASSEMBLED NANOPORE ARRAYS FOR TEM OBSERVATION OF LIQUID SAMPLES
Joowon Lim1, Jimin Ham1, Sungho Jeon1, Yuna Bae2,3, Minho Kang2,3, Sueng Yoon Lee1, Jungwon Park2,3, and Won Chul Lee1
1
Hanyang University, KOREA, 2Seoul National University, KOREA, and 3Institute of Basic Science (IBS), KOREA

W33-d

NONPLANAR NANOFABRICATION VIA INTERFACE ENGINEERING
Sarah O. Spector, Peter F. Satterthwaite, and Farnaz Niroui
Massachusetts Institute of Technology, USA

M34-d

WAFER-LEVEL FABRICATION OF CONFORMAL SUB 10-NM NANOGAPS
Sayali Tope, Seungbeom Noh, and Hanseup Kim
University of Utah, USA

Award Nominee

Packaging & Assembly
T34-d

MEMS RESONATOR VACUUM-SEALED BY SILICON MIGRATION AND HYDROGEN OUTDIFFUSION
Muhammad Jehanzeb Khan, Yukio Suzuki, Tianjiao Gong, Takashiro Tsukamoto, and Shuji Tanaka
Tohoku University, JAPAN

W34-d

MEMS THIN-FILM VACUUM PACKAGE UTILIZING GLOW DISCHARGE GETTER
Vikram Maharshi1, Manjeet Kumar1, Ajay Agarwal2, and Bhaskar Mitra1
1
Indian Institute of Technology, Delhi, INDIA and 2Indian Institute of Technology, Jodhpur, INDIAe – MEMS Actuators and PowerMEMS
Actuator Components & Systems
M35-e

LNOI THIN-FILM DUAL-AXIS RESONANT MICRO-MIRROR WITH E16 TORSIONAL ACTUATION
Yaoqing Lu1,2,3, Kangfu Liu1,2,3, Yuxi Wang1,2,3, Ran Nie1, and Tao Wu1,2,3,4
1
ShanghaiTech University, CHINA, 2Chinese Academy of Sciences, CHINA, 3University of Chinese Academy of Sciences, CHINA, and4
Shanghai Engineering Research Center of Energy Efficient and Custom AI IC, CHINA

T35-e

A PIEZOELECTRIC MEMS SPEAKER WITH STRETCHABLE FILM SEALING
Linbing Xu, Mingchao Sun, Menglun Zhang, Chengze Liu, Xiaopeng Yang, and Wei Pang
Tianjin University, CHINA

W35-e

BROADBAND MEMS SPEAKER BY SINGLE-WAY MULTI-RESONANCE ARRAY WITH ACOUSTIC DAMPING TUNING: A PROOF OF CONCEPT
Mingchao Sun, Menglun Zhang, Chengze Liu, and Wei Pang
Tianjin University, CHINA

M36-e

IONIC LIQUID ELECTROSPRAY THRUSTER WITH TWO-STAGE ELECTRODES ON GLASS SUBSTRATE
Akane Nishimura1, Yoshinori Takao2, Toshiyuki Tsuchiya1, and Yoshinori Takao2
1
Kyoto University, JAPAN and 2Yokohama National University, JAPAN

W36-e

MONOLITHIC INTEGRATION OF PZT ACTUATION UNITS OF VARIOUS ACTIVATED RESONANCES FOR FULL-RANGE MEMS SPEAKER ARRAY
Hsu-Hsiang Cheng1, Sung-Cheng Lo1, Yu-Chen Chen1, Ming-Ching Cheng1, Ting-Chou Wei1, Mingching Wu2, and Weileun Fang1
1
National Tsing Hua University, TAIWAN and 2CoretronicMEMS Co., Ltd., TAIWAN

M37-e

PULL-IN VOLTAGE REDUCTION IN ELECTROSTATIC AIRGAP ACTUATOR USING 12 NM-ULTRATHIN INTERNAL DIELECTRIC TRANSDUCTION
Satish K. Verma and Bhaskar Mitra
Indian Institute of Technology, New Delhi, INDIA

Energy Harvesting Materials, Structures, and Transducers
T37-e

A REVERSE ELECTROWETTING-ON-DIELECTRIC (REWOD) ENERGY HARVESTER USING NONWETTING GALLIUM COATED ELECTRODE ANDULTRATHIN GALLIUM OXIDE SHELL AS DIELECTRIC LAYER
Jinwon Jeong, Bokyung Suh, and Jeong Bong (JB) Lee
University of Texas at Dallas, USA

W37-e

ASYMMETRIC QUAD LEG ORTHOPLANAR SPRING FOR WIDEBAND PIEZOELECTRIC MICRO ENERGY HARVESTING
Ali Mohammadi, Shamin Sadrafshari, Alborz Shokrani, and Chris R. Bowen
University of Bath, UK

M38-e

EVALUATION OF THERMOELECTRIC PROPERTIES OF MONOLITHICALLY-INTEGRATED CORE-SHELL Si NANOWIRE BRIDGES
Akio Uesugi, Shusuke Nishiyori, Koji Sugano, and Yoshitada Isono
Kobe University, JAPAN

T38-e

GLAZE TILE-INSPIRED LIQUID-SOLID POWER GENERATOR FOR CONTINUOUS WATER FLOW ENERGY HARVESTING
Dezhi Nie1, Boming Lyu1, Yongbo Hu1, Jian Zhang1, Yongqing Fu2, Honglong Chang1, and Kai Tao1
1
Northwestern Polytechnical University, CHINA and 2Northumbria University, UK

35

POSTERPRESENTATIONS
W38-e

MEMS CANTILEVERED ENERGY HARVESTER WITH TAPERED THICKNESS FOR STRESS CONTROL
Takahito Yokota, Kensuke Kanda, Takayuki Fujita, and Kazusuke Maenaka
University of Hyogo, JAPAN

M39-e

TAPERED HELMHOLTZ RESONATOR WIND ENERGY HARVESTER DRIVEN BY AEROACOUSTICS
Chen Hua, Liyun Zhen, Jingquan Liu, and Bin Yang
Shanghai Jiao Tong University, CHINA

Manufacturing for Actuators & Power MEMS
T39-e

ANDROMEDA: A FLEXIBLE MEMS TECHNOLOGY PLATFORM FOR A VARIETY OF PIEZOELECTRICALLY ACTUACTED MICROMIRRORS
Irene Martini, Anna Alessandri, Marta Carminati, Roberto Carminati, Paolo Ferrarini, Daniela A.L. Gatti, Riccardo Gianola, Borka Lazarova,
Carla M. Lazzari, Andrea Nomellini, Laura Oggioni, Claudia Pedrini, Carlo L. Prelini, Riccardo Tacchini, and Michele Vimercati
STMicroelectronis, ITALY

W39-e

DESIGN OF BUTTERFLY PLATE PIEZOELECTRIC ACTUATOR WITH DUAL DRIVING ELECTRODES FOR MEMS MICRO-MIRROR
Si-Han Chen1, Shih-Chi Liu1, Hao-Chien Cheng1, Hung-Yu Lin1, Kai-Chih Liang2, Mingching Wu2, and Weileun Fang1
1
National Tsing Hua University, TAIWAN and 2Coretronic MEMS Corporation, TAIWAN

M40-e

FULLY-FLEXIBLE MICRO-SCALE ACTUATOR ARRAY WITH THE LIQUID-GAS PHASE CHANGE MATERIALS
Sangjun Sim, Kyubin Bae, and Jongbaeg Kim
School of Mechanical Engineering, Yonsei University, KOREA

Power MEMS Components & Systems
T40-e

A NOVEL COMB DESIGN FOR ENHANCED POWER AND BANDWIDTH IN ELECTROSTATIC MEMS ENERGY CONVERTORS
Jinglun Li1, Habilou Ouro-Koura1, Hannah Arnow1, Arian Nowbahari2, Mathew Galarza1, Meg Obispo1, Xing Tong1, Mehdi Azadmehr2,
Mona M. Hella1, John A. Tichy1, and Diana-Andra Borca-Tasciuc1
1
Rensselaer Polytechnic Institute, USA and 2University of South-Eastern Norway, NORWAY

Self-Powered Devices and Microsystems
W40-e

A HYBRID NANOGENERTOR-DRIVEN SELF-POWERED WEARABLE PERSPIRATION MONITORING SYSTEM
Md Abu Zahed, S M Sohel Rana, Md Sharifuzzaman, Seonghoon Jeong, Gagan Bahadur Pradhan, Hye Su Song, and Jae Yeong Park
Kwangwoon University, KOREA

M41-e

A MONOLITHIC INTEGRATED AND TRANSPARENT MICROSYSTEM CONSTRUCTED BY USING AMORPHOUS INGAZNO FILM
Bin Jia, Chao Zhang, and Xiaodong Huang
Southeast University, CHINA

T41-e

FLOWING WATER ENABLES STEERABLE CHARGE DISTRIBUTION ON ELECTRET SURFACE
Boming Lyu1, Jian Zhang1, Yunjia Li2, Yongqing Fu3, Honglong Chang1, Weizheng Yuan1, and Kai Tao1
1
Northwestern Polytechnical University, CHINA, 2Xi'an Jiaotong University, CHINA, and 3University of Northumbria, UK

W41-e

SELF-POWERED FLEXIBLE PIEZOELECTRET ARRAY FOR WEARABLE APPLICATIONSHao Yang1,2, Rui M.R. Pinto1, Pedro González1, Alar Ainla1, Mohammadmahdi Faraji1, and K.B. Vinayakumar1
1International Iberian Nanotechnology Laboratory, PORTUGAL and 2Xi'an Jiaotong University, CHINA

f - MEMS Physical and Chemical Sensors
Fluidic Sensors
M42-f

A BULK-TYPE PRESSURE SENSOR WITH FULL-BRIDGE IMPLEMENTATION ENABLED BY STRESS-MODIFYING TRENCHES
Dequan Lin1, Man Wong1, and Kevin Chau1,2
1Hong Kong University of Science and Technology, CHINA and 2Chinese Academy of Science, CHINA

T42-f

A CMOS COMPATIBLE MICRO PIRANI GAUGE WITH STRUCTURE OPTIMIZATION FOR PERFORMANCE ENHANCEMENT
Rui Jiao1, Gai Yang2, Ruoqin Wang1, Yue Tang2, Zhongyi Liu2, Huikai Xie2,3, Hongyu Yu1, and Xiaoyi Wang2,3
1Hong Kong University of Science and Technology, HONG KONG, 2Beijing Institute of Technology, CHINA, and3
BIT Chongqing Institute of Microelectronics and Microsystems, CHINA

W42-f

A THERMAL AIRFLOW SENSOR BASED ON MN-CO-NI-O THIN FILM
Jie Wang, Yunfei Liu, Zhezheng Zhu, Chengchen Gao, Zhenchuan Yang, and Yilong Hao
Peking University, CHINA

M43-f

HIGHLY SENSITIVE WAVE HEIGHT SENSOR WITH MEMS PIEZORESISTIVE CANTILEVER AND WATERPROOF MEMBRANE
Takuto Hirayama and Hidetoshi Takahashi
Keio University, JAPAN

T43-f

MEMS CAPACITANCE DIAPHRAGM GAUGE WITH TWO SEALED REFERENCE CAVITIESXiaodong Han1,2, Jingzhen Li3, Gang Li4, and Yongjian Feng1
1
Xiamen University, CHINA, 2University of Twente, NETHERLANDS, 3Beijing University of Technology, CHINA, and 4Lanzhou Institute of Physics, CHINA

W43-f

TOWARDS A GAS INDEPENDENT THERMAL FLOW METER
Shirin Azadi Keari1, Remco J. Wiegerink1, Remco G.P. Sanders1, and Joost C. Lotters1,2
1
University of Twente, NETHERLANDS and 2Bronkhorst High-Tech BV, NETHERLANDS

36

Award Nominee

POSTERPRESENTATIONS
Force & Displacement Sensors
M44-f

AN INTEGRATED MEMS DEVICE FOR IN-SITU FOUR-PROBE ELECTRO-MECHANICAL CHARACTERIZATION OF PT NANOBEAM
Yuheng Huang, Meng Nie, Binghui Li, Kuibo Yin, and Litao Sun
Southeast University, CHINA

T44-f

FINGERLIKE TACTILE TEXTURE INTEGRATED SENSOR WITH COLD AND WARM SENSATIONS OF SUB-MM SPATIAL RESOLUTION
Nachi Mise, Mitsuki Kozasa, Kyohei Terao, Fusao Shimokawa, and Hidekuni Takao
Kagawa University, JAPAN

W44-f

MODIFIED BEAM STRUCTURES FOR IMPROVED RESONANT SENSING
Erfan Ghaderi and Behraad Bahreyni
Simon Fraser University, CANADA

M45-f

OCCLUSAL PAPER-BASED FLEXIBLE PRESSURE SENSOR FOR IN SITU MEASURING ORAL OCCLUSAL FORCE
Wenduo Wang, Xin Zhang, Ning Zhao, Jingquan Liu, and Bin Yang
Shanghai Jiao Tong University, CHINA

T45-f

SUCTION CUP ARRAY WORKING ALSO AS TACTILE SENSOR TO DETECT CUPS DEFORMATION USING KCF AND CNN
Toshihiro Shiratori, Jinya Sakamoto, Yuki Kumokita, Masato Suzuki, Tomokazu Takahashi, and Seiji Aoyagi
Kansai University, JAPANW45-f

VERTICAL INTEGRATION OF FORCE TRANSMISSION STRUCTURE ON CAPACITIVE CMOS-MEMS TACTILE FORCE SENSOR FOR SENSITIVITY IMPROVEMENT
Yuanyuan Huang, Yen-Lin Chen, Shihwei Lin, Fuchi Shih, Zihsong Hu, and Weileun Fang
National Tsing Hua University, TAIWANAward Nominee

Gas & Chemical Sensors
M46-f

1-OCTADECANETHIOL SAM ON CMOS-MEMS GOLD PLATED RESONATOR VIA DIP-CAST FOR VOCs SENSING
Rafel Perelló-Roig1,2, Jaume Verd1,2, Sebastià Bota1,2, Bartomeu Soberats1, Antonio Costa1, and Jaume Segura1,2
1
University of the Balearic Islands, SPAIN and 2Health Research Institute of the Balearic Islands, SPAIN

T46-f

APPLICATION OF DEEP LEARNING NETWORK FOR HUMIDITY COMPENSATION OF SEMICONDUCTOR METAL OXIDE GAS SENSORS
Mingu Kang, Incheol Cho, and Inkyu Park
Korea Advanced Institute of Science and Technology (KAIST), KOREA

W46-f

DEVELOPMENT OF MONOLITHIC MICRO-LED GAS SENSOR BASED E-NOSE SYSTEM FOR REAL-TIME, SELECTIVE GAS PREDICTION
Kichul Lee, Mingu Kang, and Inkyu Park
Korea Advanced Institute of Science and Technology (KAIST), KOREA

M47-f

ELECTRONIC-NOSE: AN ARRAY OF 16 MOS-GAS SENSORS INTEGRATED WITH TEMPERATURE AND MOISTURE SENSING CAPABILITIESXiawei Yue1,2, Shuai Wei1,2, Pingping Zhang3, Zhitao Zhou1, Tiger Tao1,2,4,5,6, and Nan Qin1
1Chinese Academy of Sciences (CAS), CHINA, 2University of Chinese Academy of Sciences, CHINA, 3Suzhou Huiwen Nanotechnology Co. Ltd., CHINA,
4
ShanghaiTech University, CHINA, 5Shanghai Research Center for Brain Science and Brain-Inspired Intelligence, CHINA and
6
Neuroxess Co., Ltd. (Jiangxi), CHINA

T47-f

ENHANCEMENT OF SENSITIVITY IN PHOTONIC CRYSTAL BASED CHEMICAL SENSOR USING CHEMO-MECHANICAL BILAYER EFFECT
Seyeon Lee1, Naik T. Banabathi1, Dongwon Kang3, Sookyung Kang2, Kyungsuk Cho2, Jungwook Kim1, and Jungyul Park1
1Sogang University, KOREA, 2Iwha University, KOREA, and 3University of California, Los Angeles, USA

W47-f

METAL ION RECOGNITION SENSOR BASED ON RESISTANCE SWITCHING EFFECT
Tian Kang, Yusa Chen, Guanzhou Lin, Shengxiao Jin, Liye Li, Hongshun Sun, Senyong Hu, and Wengang Wu
Peking University, CHINA

M48-f

MULTI-HOTSPOT MID-IR NANOANTENNAS WITH MATCHED LOSS AND HIGH-INTENSITY NEAR-FIELD FOR SUB-PPM-LEVEL GAS DETECTION
Hong Zhou, Zhihao Ren, Cheng Xu, Liangge Xu, Xinge Guo, and Chengkuo Lee
National University of Singapore, SINGAPORE

T48-f

PALLADIUM BASED MEMS HYDROGEN SENSORSMax Hoffmann1, Marion Wienecke1, Maren Lengert2, Michael H. Weidner2, and Jan Heeg2
1
Hochschule Wismar, Institut fur̈ Oberflächen- und Dun̈ nschichttechnik, GERMANY and 2Materion GmbH, GERMANY

W48-f

SELECTIVE DISCRIMINATION OF PPB-LEVEL VOCS USING MOS GAS SENSOR IN PULSE-HEATING MODE WITH THE MODIFIED HILL’S MODEL
Gaoqiang Niu, Yi Zhuang, Yushen Hu, Zong Liu, and Fei Wang
Southern University of Science and Technology, CHINA

M49-f

THERMAL CONDUCTIVITY DETECTOR (TCD)-TYPE GAS SENSOR BASED ON THE SUSPENDED 1D NANOHEATER FOR IOT APPLICATIONS
Wootaek Cho, Jong-Hyun Kwak, Taejung Kim, and Heungjoo Shin
Ulsan National Institute of Science and Technology (UNIST), KOREAAward Nominee

Inertial Sensors
T49-f

120 PPM QUALITY FACTOR THERMAL STABILITY FROM -40°C TO +60°C OF A DUAL-AXIS MEMS GYROSCOPE BASED ON JOULE EFFECT DYNAMIC CONTROL
Jian Cui1,2 and Qiancheng Zhao1,2
1Peking University, CHINA and 2Beijing Advanced Innovation Center for Integrated Circuits, CHINA

W49-f

A FORCE-BANLANCE CAPACITIVE MEMS GRAVIMETER WITH SUPERIOR RESPONSE TIME, SELF-NOISE AND DRIFTLe Gao1, Fangzheng Li1, Jian Zhang1, Bingyang Cai1, Wenjie Wu1, and Liangcheng Tu2
1
Huazhong University of Science and Technology, CHINA and 2Sun Yat-sen University, CHINA

37

POSTERPRESENTATIONS
M50-f

A MEMS-BASED GRAVIMETER FOR SIMULTANEOUS VERTICAL AND HORIZONTAL EARTH TIDES MEASUREMENTS
Lujia Yang1, Xiaochao Xu1, Qian Wang1, Ji'ao Tian1, Yanyan Fang1, Chun Zhao1, Wenjie Wu1, Fangjing Hu1, and Liangcheng Tu1,2
1
Huazhong University of Science and Technology, CHINA and 2Sun Yat-sen University, CHINA

T50-f

A NOVEL MULTIPLE FOLDED BEAM DISK RESONATOR FOR MAXIMIZING THE THERMOELASTIC QUALITY FACTOR
Xiaopeng Sun1, Xin Zhou1, Lei Yu2, Kaixuan He2, Xuezhong Wu1, and Dingbang Xiao1
1
National University of Defense Technology, CHINA and 2East China Institute of Photo-Electronic IC, CHINA

W50-f

A TIME-SERIES CONFIGURATION METHOD OF MODE REVERSAL MEMS GYROSCOPES UNDER DIFFERENT TEMPERATURE-VARYING CONDITIONS
Liangqian Chen, Tongqiao Miao, Qingsong Li, Peng Wang, Junjian Li, Xuezhong Wu, Dingbang Xiao, and Xiang Xi
National University of Defense Technology, CHINA

M51-f

ACOUSTICALLY ISOLATED MEMS BAW GYROSCOPES
Diego Emilio Serrano, Amir Rahafrooz, Duane Younkin, Kieran Nunan, Mitul Dalal, Sagnik Pal, and Ijaz Jafri
Panasonic Device Solutions Laboratory of Massachusetts, USA

T51-f

ACTIVE QUALITY FACTOR STABILIZATION OF MEMS RESONATOR UTILIZING ELECTRICAL DISSIPATION REGULATION
Yang Zhao, Qin Shi, Guoming Xia, and Anping Qiu
Nanjing University of Science and Technology, CHINA

W51-f

DEMONSTRATION OF GYRO-LESS NORTH FINDING USING A T-SHAPED MEMS DIFFERENTIAL RESONANT ACCELEROMETER
Kei Masunishi, Etsuji Ogawa, Daiki Ono, Fumito Miyazaki, Hiroki Hiraga, Kengo Uchida, Jumpei Ogawa, Hideaki Murase, and Yasushi Tomizawa
Toshiba Corporation, JAPAN

M52-f

ENHANCED STIFFNESS SENSITIVITY IN A MODE LOCALIZED SENSOR USING INTERNAL RESONANCE ACTUATION
Jianlin Chen1, Hemin Zhang2, Takashiro Tsukamoto1, Michael Kraft2, and Shuji Tanaka1
1
Tohoku University, JAPAN and 2KU Leuven, BELGIUM

T52-f

MODELING STRESS EFFECTS ON FREQUENCIES OF A MEMS RING GYROSCOPE
Mehran Hosseini-Pishrobat, Baha Erim Uzunoglu, and Erdinc Tatar
Bilkent University, TURKEY

W52-f

RATE INTEGRATING GYROSCOPE TUNED BY FOCUS ION BEAM TRIMMING AND INDEPENDENT CW/CCW MODES CONTROL
Jianlin Chen1, Takashiro Tsukamoto1, Giacomo Langfelder2, and Shuji Tanaka1
1
Tohoku University, JAPAN and 2Politecnico di Milano, ITALY

M53-f

TEMPERATURE DEPENDENCE OF QUALITY FACTORS AT HIGH FREQUENCIES IN MEMS GYROSCOPES
Daniel Schiwietz1,2, Eva M. Weig2, and Peter Degenfeld-Schonburg1
1
Robert Bosch GmbH, GERMANY and 2Technical University of Munich, GERMANY

Manufacturing Techniques for Physical Sensors
T53-f

0.5MM×0.5MM 150KPA-MEASURE-RANGE HIGH-TEMPERATURE PRESSURE SENSOR WITH HIGH-PERFORMANCE AND LOW FABRICATION-COST
Peng Li1,2, Wei Li1, Changnan Chen1,3, Ke Sun1, Min Liu1, Sheng Wu1, Pichao Pan1,3, Jiachou Wang1,3, and Xinxin Li1,2,3
1Chinese Academy of Sciences, CHINA, 2Fudan University, CHINA, and 3University of Chinese Academy of Sciences, CHINA

W53-f

AUTOMATIC PICO LASER TRIMMING SYSTEM FOR SILICON MEMS RESONANT DEVICES BASED ON IMAGE RECOGNITION
Yuxian Liu1, Qiancheng Zhao1,2, Dacheng Zhang1, and Jian Cui1,21Peking University, CHINA and 2Beijing Advanced Innovation Center for Integrated Circuits, CHINA

M54-f

MICROMACHINING FUSED SILICA MICRO SHELL RESONATOR WITH QUARTZ GLASS MOLD BY THERMAL REFLOW
Zhaoxi Su, Bin Luo, Qiankai Tang, Linqian Zhu, and Jintang ShangSoutheast University, CHINA

T54-f

WAFER-LEVEL PATTERNING OF TIN OXIDE NANOSHEETS FOR MEMS GAS SENSORS
Mingjie Li, Wenxin Luo, Xiaojiang Liu, Gaoqiang Niu, and Fei Wang
Southern University of Science and Technology, CHINA

Materials for Physical Sensors
W54-f

AIR DAMPING EFFECTS ON DIFFERENT MODES OF AlN-on-Si MICROELECTROMECHANICAL RESONATORS
Yuncong Liu1, S M Enamul Hoque Yousuf1, Afzaal Qamar2, Mina Rais-Zadeh2,3, and Philip X.-L. Feng1
1
University of Florida, USA, 2University of Michigan, USA, and 3California Institute of Technology, USA

M55-f

A NOVEL PIEZORESISTIVE PRESSURE SENSOR BASED ON CR-DOPED V2O3 THIN FILM
Michiel Gidts, Wei-Fan Hsu, María Recaman Payo, Shashwat Kushwaha, Chen Wang, Frederik Ceyssens, Dominiek Reynaerts, Jean-Pierre Locquet, and Michael Kraft
KU Leuven, BELGIUM

Metrology and Measurement Techniques for MEMS/NEMS Sensors
T55-f

A NOVEL FEEDTHROUGH CANCELLATION TECHNIQUE FOR PIEZOELECTRIC MEMS RESONANT SENSORS IN IONIC LIQUID MEDIUM
Cheng-Yen Wu, Zhong-Wei Lin, and Sheng-Shian Li
National Tsing Hua University, TAIWAN

W55-f

CHARACTERIZATION OF PACKAGING STRESS WITH A CAPACITIVE STRESS SENSOR ARRAY
Tolga Veske1, Derin Erkan1, and Erdinc Tatar1,2
1
Bilkent University, TURKEY and 2National Nanotechnology Research Center (UNAM), TURKEY

M56-f

MILLISECOND-LEVEL PULSE-HEATING SENSING SYSTEM FOR MEMS-BASED GAS SENSORSYi Zhuang, Gaoqiang Niu, Lang Wu, and Fei Wang
Southern University of Science and Technology, CHINA

38

POSTERPRESENTATIONS
T56-f

MULTIPLE PARAMETER DECOUPLING USING A SINGLE RESONANT MEMS SENSOR VIA BLUE SIDEBAND EXCITATION
Jingqian Xi1, Lei Xu1, Yuan Wang2, Fangjing Hu1, Chengxin Li4, Linlin Wang4,Huafeng Liu1, Chen Wang4, Michael Kraft4, and Chun Zhao3
1
Huazhong University of Science and Technology, CHINA, 2University of Macau, CHINA, 3University of York, UK, and 4University Leuven, BELGIUM

Nanoscale Physical Sensors
W56-f

DIAMOND NANOWIRES ARRAY PREPARED BY ANNEALING NANO-CRYSTALLINE DIAMOND IN AIR AND ITS APPLICATION IN FIELD EMISSION
Yang Wang, Chen Lin, and Jinwen Zhang
Peking University, CHINA

M57-f

QUANTIFIED STRESS RELAXATION IN CARBON NANOTUBE RESONATORS
Morten Vollmann, Cosmin Roman, Miroslav Haluska, and Christofer Hierold
ETH Zürich, SWITZERLAND

T57-f

SELF-REFERENCED TEMPERATURE SENSORS BASED ON CASCADED SILICON RING RESONATOR
Xiantao Zhu, Minmin You, Zude Lin, Bin Yang, and Jingquan Liu
Shanghai Jiao Tong University, CHINA

Sonic & Ultrasonic MEMS Transducers
2

W57-f

A 0.35 mm SYSTEM ON CHIP LEVEL DETECTOR BASED ON AN ANNULAR PMUT-ON-CMOS ARRAY
Eyglis Ledesma, Iván Zamora, Francesc Torres, Arantxa Uranga, and Núria Barniol
Universitat Autònoma de Barcelona, SPAIN

M58-f

AN ALSCN PMUT-ON-CMOS SENSOR FOR MONITORING FLUIDS’ DENSITY, VISCOSITY, SOUND VELOCITY, AND COMPRESSIBILITY
Eyglis Ledesma, Iván Zamora, Jesús Yanez, Arantxa Uranga, and Núria Barniol
Universitat Autònoma de Barcelona, SPAIN

T58-f

AUTO-POSITIONING AND HAPTIC STIMULATIONS VIA A 35 MM SQUARE PMUT ARRAY
Wei Yue1, Yande Peng1, Hanxiao Liu1, Fan Xia1, Fanping Sui1, Seiji Umezawa2, Shinsuke Ikeuchi2, Yasuhiro Aida2, and Liwei Lin1
1
University of California, Berkeley, USA and 2Murata Manufacturing Co., Ltd., JAPAN

W58-f

BODY FORCE BASED DROPLET EJECTION BY GHZ ACOUSTIC MICRO-TRANSDUCER
Haitao Zhang, Yangchao Zhou, Menglun Zhang, Wenlan Guo, Chen Sun, Xuexin Duan, and Wei Pang
Tianjin University, CHINA

M59-f

BONE CONDUCTION PICKUP BASED ON PIEZOELECTRIC MICROMACHINED ULTRASONIC TRANSDUCERS
Chongbin Liu1, Xiangyang Wang1, Yong Xie2, and Guoqiang Wu1
1
Wuhan University, CHINA and 2Xidian University, CHINA

T59-f

BREAKING THE DEAD ZONE LIMITATION OF PMUTS BASED ON A PHASE SHIFT OF DRIVING WAVEFORM WITH WINDOW FUNCTION
Chun-You Liu, Chin-Yu Chang, and Sheng-Shian Li
National Tsing Hua University, TAIWAN

W59-f

DRONE-MOUNTED LOW-FREQUENCY PMUTS FOR > 6-METER RANGEFINDER IN AIR
Hanxiao Liu1, Yande Peng1, Wei Yue1, Seiji Umezawa2, Shinsuke Ikeuchi2, Yasuhiro Aida2, Chunming Chen1, Peggy Tsao1, and Liwei Lin1
1
University of California, Berkeley, USA and 2Murata Manufacturing Co., Ltd., JAPAN

M60-f

MASS PRODUCED MICROMACHINED ULTRASONIC TIME-OF-FLIGHT SENSORS OPERATING IN DIFFERENT FREQUENCY BANDS
Richard J. Przybyla1, Stefon E. Shelton1, Cathy Lee1, Ben Eovino1, Quy Chau1, Mitchell H. Kline1, Oleg I. Izyumin1, and David A. Horsley1,2
1
TDK Invensense, USA and 2University of California, Davis, USA

T60-f

MEMS FIRST-ORDER BESSEL BEAM ACOUSTIC TRANSDUCER FOR PARTICLE TRAPPING AND CONTROLLABLE ROTATING
Jiaqi Li1, Zhenhuan Sun1, Yuyu Jia1, Teng Li1, Haojian Lu2, Lurui Zhao3, Hai Liu3, and Song Liu1
1
ShanghaiTech University, CHINA, 2Zhejiang University, CHINA, and 3University of Southern California, Los Angeles, USA

W60-f

NON-INVASIVE CAROTID ARTERY MONITORING BY USING ALUMINUM NITRIDE PMUT CLOSE-PACKED ARRAYS
Sheng Wu1,2,3, Kangfu Liu2, Shuai Shao2, Wei Li1,3, Ying Chen1,3, Tao Wu2, and Xinxin Li1,3
1
Chinese Academy of Sciences, CHINA, 2ShanghaiTech University, CHINA, and 3University of Chinese Academy of Sciences, CHINA

M61-f

NON-LINEAR BEHAVIORAL MODELING OF CAPACITIVE MEMS MICROPHONES
Sebastian Anzinger1,2, Hutomo Suryo Wasisto1, Abhiraj Basavanna1, and Alfons Dehé2,3
1
Infineon Technologies AG, GERMANY, 2University of Freiburg, GERMANY, and 3Hahn-Schickard-Gesellschaft, GERMANY

T61-f

VORTEX-BEAM ACOUSTIC TRANSDUCER FOR UNDERWATER PROPULSION
Jaehoon Lee, Kianoush Sadeghian Esfahani, and Eun S. Kim
University of Southern California, USA

W61-f

WIDEBAND AND HIGHLY SENSITIVE MICROMACHINED PZT FILM-BASED ULTRASONIC MICROPHONE WITH PARYLENE FILM AND FLEXIBLEHELMHOLTZ RESONATOR ENHANCEMENT
Chung-Hao Huang and Guo-Hua Feng
National Tsing Hua University, TAIWAN

Other Physical Sensors
M62-f

HALBACH-ARRAY MAGNETIC COIL ARRANGEMENT ON CMOS CHIP FOR SENSITIVITY ENHANCEMENT OF INDUCTIVE TACTILE SENSOR
Tien Chou, Zih-Song Hu, and Weileun Fang
National Tsing Hua University, TAIWAN

39

POSTERPRESENTATIONS
T62-f

ON-MEMS-CHIP COMPACT TEMPERATURE SENSOR FOR LARGE-VOLUME, LOW-COST SENSOR CALIBRATION
Paolo Frigerio1, Andrea Fagnani1, Valentina Zega1, Gabriele Gattere2, Attilio Frangi1, and Giacomo Langfelder1
1
Politecnico di Milano, ITALY and 2STMicroelectronics, ITALY

W62-f

PARTICULATE MATTER SENSOR BASED ON TWO STAGE CASCADE VIRTUAL IMPACTORS AND THERMOPHORETIC MICROHEATERS
Kwang-Wook Choi1, Ilhwan Kim1, Seokwhan Chung1, Gi-Bong Sung2, and Se-Jin Yook2
1
Samsung Advanced Institute of Technology, KOREA and 2Hanyang University, KOREA

g – Micro- and Nanofluidics
Biological and Medical Microfluidics and Nanofluidics
M63-g

A MICROFLUIDIC OXYGEN GRADIENT GENERATOR FOR THE STUDY OF AEROTROPISM IN HYPHAE OF OOMYCETES
Ayelen Tayagui1,2, Yiling Sun1,2, Ashley Garrill1, and Volker Nock1,2
1
University of Canterbury, NEW ZEALAND and 2MacDiarmid Institute for Advanced Materials and Nanotechnology, NEW ZEALAND

T63-g

A PAPER-BASED DUAL APTAMER ASSAY ON AN INTEGRATED MICROFLUIDIC SYSTEM FOR DETECTION OF HNP 1 AS A BIOMARKER FORPERIPROSTHETIC JOINT INFECTIONS
Rishabh Gandotra1, Feng-Chih Kuo2, Mel S. Lee3, and Gwo-Bin Lee1
1
National Tsing Hua University, TAIWAN, 2Kaohsiung Chang Gung Memorial Hospital, TAIWAN, and 3Paochien Hospital, TAIWAN

W63-g

AN INTEGRATED MICROFLUIDIC PLATFORM FOR TUMOR CELL SEPARATION AND FLUORESCENCE IN SITU HYBRIDIZATION AT SINGLE CELL LEVEL
Shihui Qiu1,2, Na Li1,2, Zhenhua Wu1,2, Jianlong Zhao1,2, and Hongju Mao1,21Chinese Academy of Science, CHINA and 2University of Chinese Academy of Sciences, CHINA

M64-g

CHARACTERIZATION OF OOCYTE HARDENING USING A MICROFLUIDIC ASPIRATION-ASSISTED ELECTRICAL IMPEDANCE SPECTROSCOPY SYSTEM
Yuan Cao, Julia Floehr, and Uwe Schnakenberg
RWTH Aachen University, GERMANY

T64-g

DOUBLE PULSE IRRADIATION OF FS LASER FOR ENHANCING THE PERFORMANCE OF PRECISE LASER SORTING METHOD
Ryota Kiya1, Yoshinaga Rintaro1, Yo Tanaka2, Yaxiaer Yalikun1,2, and Yoichiroh Hosokawa1
1
Nara Institute of Science and Technology, JAPAN and 2Institute of Physical and Chemical Research (RIKEN), JAPAN

W64-g

DROPLET BASED HIGH THROUGHPUT SINGLE-SPERM CRYOPRESERVATION PLATFORM
Na Li1,2, Shihui Qiu1,3, Zhenhua Wu1,3, and Hongju Mao1,31Chinese Academy of Sciences, CHINA, 2ShanghaiTech University, CHINA, and 3University of Chinese Academy of Sciences, CHINA

M65-g

DUAL ION-SELECTIVE MEMBRANE DEPOSITED ION-SENSITIVE FIELD-EFFECT TRANSISTOR (DISM-ISFET) INTEGRATING WHOLE BLOOD PROCESSING
MICROCHAMBER FOR IN SITU BLOOD ION TESTING
Xiao-Wen Chen, Syuan-Rong Huang, and Nien-Tsu Huang
National Taiwan University, TAIWAN

Generic Microfluidics & Nanofluidics
W65-g

STRONG MICROSTREAMING FROM A PINNED OSCILLATING MEMBRANE AND APPLICATION TO GAS EXCHANGE
Anthony L. Mercader and Sung Kwon Cho
University of Pittsburgh, USA

M66-g

TUNABLE NANOPORE-INTEGRATED MICRO-/NANOFLUIDIC PLATFORM FOR ION TRANSPORT CONTROL IN THE PRESENCE
OF CONCENTRATION AND TEMPERATURE GRADIENTS
Dongwoo Seo1, Dongjun Kim1, Jongwan Lee1, Cong Wang2, Jungyul Park2, and Taesung Kim1
1
Ulsan National Institute of Science and Technology (UNIST), KOREA and 2Sogang University, KOREAAward Nominee

Integrated/Embedded Microfluidics and Nanofluidic Systems & Platforms
W66-g

QUANTITATIVE ASSESSMENT OF CAPTURED MAGNETIC NANOPARTICLES USING SELF-POWERED MAGNETOELECTRIC PLATFORM FOR BIOLOGICAL APPLICATIONS
Pankaj Pathak, Vinit K. Yadav, Samaresh Das, and Dhiman Mallick
Indian Institute Of Technology Delhi, INDIA

M67-g

REAL-TIME OPERATION OF MICROCANTILEVER-BASED IN-PLANE RESONATORS PARTIALLY IMMERSED IN A MICROFLUIDIC SAMPLER
Jiushuai Xu, Entian Cao, Michael Fahrbach, Vladislav Agluschewitsch, Andreas Waag, and Erwin Peiner
Technische Universität Braunschweig, GERMANY

T67-g

SUSPENDED NANOCHANNEL RESONATORS MADE BY NANOIMPRINT AND GAS PHASE DEPOSITION
Manuel Müller1, Jeremy Teuber1, Rukan Nasri1, Francesc Torres Canals2, Núria Barniol2, Jordi Llobet Sixto3, Xavier Borrise3,
Francesc Perez-Murano3, and Irene Fernandez-Cuesta1
1
University of Hamburg, GERMANY, 2Universitat Autónoma de Barcelona, SPAIN, and 3IMB-CNM CSIC, SPAIN

Manufacturing for Micro- and Nanofluidics
W67-g

DEVELOPING AN EXTREMELY HIGH FLOW RATE PNEUMATIC PERISTALTIC MICROPUMP FOR BLOOD PLASMA SEPARATION WITH INERTIAL PARTICLE
FOCUSING TECHNIQUE FROM FINGERTIP BLOOD WITH LANCETS
Tuan N.A. Vo1,2,3, Pin-Chuan Chen1, and Pai-Shan Chen4
1
National Taiwan University of Science and Technology, TAIWAN, 2Ho Chi Minh City University of Technology (HCMUT), VIETNAM, 3Vietnam National University, VIETNAM, and4
National Taiwan University, TAIWAN

M68-g

DIRECT PATTERNING ON POROUS SURFACE USING DROP IMPACT PRINTING
Bheema Sankar Reddy1, Chandantaru Dey Modak1,2, Rutvik Lathia1, Bhawana Agarwal1,3, Ebinesh Abraham R1, and Prosenjit Sen1
1
Indian Institute of Science, Bangalore, INDIA, 2CNRS - ESPCI PSL, FRANCE, and3Johns Hopkins University, USA

40

POSTERPRESENTATIONS
T68-g

MANUFACTURING 3D-PRINTED PAPER MICROFLUIDICS INTEGRATED WITH IONIZATION MASS-SPECTROMETRY FOR ILLICIT DRUGS ANALYSISAND ON-CHIP CHROMATOGRAPHY
Muhammad Faizul Zaki1, Pin-Chuan Chen1, Yi-Xin Wu2, and Pai-Shan Chen2
1
National Taiwan University of Science and Technology, TAIWAN and 2National Taiwan University, TAIWAN

Materials for Micro & Microfluidics
W68-g

DETECTION LIMITS IN NANOMECHANICAL MASS FLOW SENSING FOR NANOFLUIDICS WITH NANOWIRE OPEN CHANNELS
Javier E. Escobar, Juan Molina, Eduardo Gil-Santos, José J. Ruz, Óscar Malvar, Priscila M. Kosaka,
Javier Tamayo, Álvaro San Paulo, and Montserrat Calleja
Instituto de Micro y Nanotecnología, IMN-CNM (CSIC), SPAIN

Award Nominee

Modeling of Micro & Nanofluidics
M69-g

CONTROLLING PARTICLE AGGREGATION AND SEPARATION IN LIQUID ON MEMBRANE RESONATORS
Haoran Zhang1,2, Hao Jia1,2, and Xinxin Li1,2
1
Chinese Academy of Sciences, CHINA and 2University of Chinese Academy of Sciences, CHINA

T69-g

DEVELOPMENT OF BOAT MODEL POWERED BY ELECTRO-HYDRODYNAMIC PROPULSION SYSTEM
Luan Ngoc Mai1,2, Tuan-Khoa Nguyen3, Trung Hieu Vu3, Thien Xuan Dinh4, Canh-Dung Tran5, Hoang-Phuong Phan6, Toan Dinh5, Thanh Nguyen5,
Nam-Trung Nguyen3, Dzung Viet Dao3, and Van Thanh Dau3
1
Ho Chi Minh City University of Technology, VIETNAM, 2Vietnam National University Ho Chi Minh City, VIETNAM, 3Griffith University, AUSTRALIA,
4
Explosion Research Institute Inc., JAPAN, 5University of Southern Queensland, AUSTRALIA, and 6University of New South Wales, AUSTRALIA

W69-g

HEMODYNAMIC ANALYSIS OF CARDIOMEMS: ADVERSE HEMODYNAMIC EFFECTS
Zhenhao Liu1, Jiangli Han2, and Xing Chen1
1
Beihang University, CHINA and 2Peking University Third Hospital, CHINA

M70-g

MODAL QUALITY FACTOR INVERSION OF NON-SLENDER MEMS RESONATORS BETWEEN GASES AND LIQUIDSAndre L. Gesing, Thomas Tran, Daniel Platz, and Ulrich Schmid
TU Wien, AUSTRIAOther Micro- and Nanofluidics
T70-g

CLASSIFYING CELL CYCLE BY ELECTRICAL PROPERTIES USING MACHINE LEARNING
Jian Wei and Xiaoxing Xing
Beijing University of Chemical Technology, CHINA

W70-g

HIGH-THROUGHPUT SPHERICAL SUPRAPARTICLE SELF-ASSEMBLY BY ENHANCED EVAPORATION OF COLLOIDAL WATER DROPLETS THROUGH
THIN FILM OF WATER-SOLUBLE OIL
Wonhyung Lee, Joowon Rhee, and Joonwon Kim
Pohang University of Science and Technology (POSTECH), KOREA

M71-g

IN-ICE POLYMERIZATION FOR FUNCTIONAL HYDROGEL MICROBEAD WITH FLASH FREEZING CENTRIFUGAL MICROFLUIDIC DEVICE
Tomomi Murayama1, Koki Yoshida1, Yuta Kurashina2, and Hiroaki Onoe1
1
Keio University, JAPAN and 2Tokyo University of Agriculture and Technology, JAPAN

T71-g

TEMPERATURE-RESPONSIVE MICROCAPSULES MANUFACTURED BY PROMOTING CONTROLLED CLOAKING WITH THE HELP OF MICRO/NANOPARTICLES
Rutvik Lathia1, Bheema Sankar Reddy1, Chandantaru Dey Modak1,2, Satchit Nagpal1,3, and Prosenjit Sen1
1
Indian Institute of Science, INDIA, 2CNRS - ESPCI PSL, FRANCE, and 3Texas A&M University, USA

W71-g

WATER VITRIFICATION IN A MICROCHANNEL AT LOW COOLING RATE
Ayane Sato, Tomohiro Hayashi, and Tadashi Ishida
Tokyo Institute of Technology, JAPANh - Optical, RF and Electromagnetics for MEMS/NEMSElectrical Field and Magnetic Field Sensors and Transducers
M72-h

A HIGHLY SENSITIVE 3-AXIS MICRO SEARCH-COIL MAGNETOMETER ENABLED BY HIGH DENSITY THROUGH-SILICON-VIA PROCESS
Hadi Tavakkoli, Mingzheng Duan, Longheng Qi, Izhar, Xu Zhao, and Yi-Kuen Lee
Hong Kong University of Science and Technology, HONG KONG

T72-h

FULLY INTEGRATED BACK-BIASED 3D HALL SENSOR WITH WAFER-LEVEL INTEGRATED PERMANENT MICROMAGNETS
Björn Gojdka1, Daniel Cichon2, Markus Stahl-Offergeld2, Dominik Schröder3, Niels Clausen1, Christian Hedayat3, Hans-Peter Hohe2, and Thomas Lisec1
1
Fraunhofer Institute for Silicon Technology ISIT, GERMANY, 2Fraunhofer Institute for Integrated Circuits IIS, GERMANY, and3
Fraunhofer Institute for Electronic Nano Systems ENAS, GERMANY

Free Space Optical Components & Systems
W72-h

A LARGE-STROKE TIP-TILT-PISTON MICROMIRROR WITH ELECTROMAGNETIC ACTUATORS BASED ON METALLIC GLASS
Chuan-Hui Ou, Nguyen V. Toan, and Takahito Ono
Tohoku University, JAPAN

M73-h

ARBITRARY SHAPED BACKSIDE REINFORCEMENT FOR TWO DIMENSIONAL RESONANT MICROMIRRORS
Takashi Sasaki, Adrien Piot, Anton Lagosh, Clement Fleury, Markus Bainschab, Yanfen Zhai, Marcus Baumgart, Sara Guerreiro,
Dominik Holzmann, Aleš Travnik, and Mohssen Moridi
Silicon Austria Labs, AUSTRIA

41

POSTERPRESENTATIONS
T73-h

HIGH TRANSMITTANCE METASURFACE HOLOGRAMS USING SILICON NITRIDE
Masakazu Yamaguchi, Hiroki Saito, Satoshi Ikezawa, and Kentaro Iwami
Tokyo University of Agriculture and Technology, JAPAN

W73-h

MULTIFUNCTIONAL OPTICAL METASURFACE FOR ANOMALOUS REFLECTION, STRUCTURAL COLOR, AND SURFACE LATTICE RESONANCE
Liye Li1, Hongshun Sun1, Yifan Ouyang1, Shengxiao Jin1, Tian Kang1, Zhimei Qi2, and Wengang Wu1
1
Peking University, CHINA and 2Chinese Academy of Science, CHINA

M74-h

NOVEL WAVEFRONT-SPLITTING INTERFEROMETER FOR ULTRA-COMPACT BROADBAND FT-IR SPECTROSCOPY EXTENDING TO VISIBLE RANGE
Bassem Mortada1, Yasser M. Sabry1,2, Bassam Saadany1, Tarik Bourouina3, and Diaa Khalil2
1
Si-Ware Systems, EGYPT, 2Ain Shams University, EGYPT, and 3Université Gustave Eiffel, FRANCE

T74-h

PIEZOELECTRICALLY ACTUATED MICROMIRROR WITH DYNAMIC DEFORMATION COMPENSATION MECHANISM
Takashi Sasaki, Adrien Piot, Jaka Pribošek, Anton Lagosh, Clement Fleury, Markus Bainschab, Yanfen Zhai, Marcus Baumgart,
Sara Guerreiro, Dominik Holzmann, Aleš Travnik, and Mohssen Moridi
Silicon Austria Labs, AUSTRIA

W74-h

RESONANT d33 MODE PZT MEMS MIRROR EXCITED WITH DIRECTIONAL INTERDIGITATED ELECTRODES
Pooja Thakkar, Anton Lagosh, Takashi Sasaki, Markus Bainschab, and Jaka Pribošek
Silicon Austria Labs GmbH, AUSTRIA

M75-h

RESONANT PIEZOELECTRIC VARIFOCAL MIRROR WITH ON-CHIP INTEGRATED DIFFRACTIVE OPTICS FOR INCREASED FREQUENCY RESPONSE
Jaka Pribošek, Anton Lagosh, Pooja Thakkar, Takashi Sasaki, and Markus Bainschab
Silicon Austria Labs, AUSTRIA

T75-h

UNIQUE DISPERSION RELATION FOR PLASMONIC PHOTODETECTORS WITH SUBMICRON GRATING
Yuki Kaneda1, Masaaki Oshita1, Utana Yamaoka1, Shiro Saito2, and Tetsuo Kan1
1
University of Electro-Communications, JAPAN and 2IMRA JAPAN Co., LTD., JAPANInfrared (IR) Sensors and Imaging Systems
W75-h

INTEGRATION OF A HIGH TEMPERATURE TRANSITION METAL OXIDE NTC THIN FILM IN A MICROBOLOMETER FOR LWIR DETECTION
Sarah Risquez1, Sebastian Redolﬁ2, Clement Fleury1, Matthias Wulf2, Ali Roshanghias1, Adrien Piot1, Jeremy Streque1, Kerstin Schmoltner2,
Thang Duy Dao1, Markus Puff2, and Mohssen Moridi1
1
Silicon Austria Labs GmbH, AUSTRIA and 2TDK Electronics GmbH & Co OG, AUSTRIA

M76-h

PERIODIC CAVITIES ON THE IR-ABSORBER FOR RESPONSIVITY ENHANCEMENT OF CMOS-MEMS THERMOELECTRIC IR SENSOR
Yung-Chen Li, Tien Chou, Pen-Sheng Lin, Yu-Cheng Huang, Fuchi Shih, You-An Lin, Da-Jen Yen, Mei-Feng Lai, and Weileun Fang
National Tsing Hua University, TAIWAN

T76-h

ULTRA-LARGE PIXEL ARRAY PHOTOTHERMAL TRANSDUCER AND ITS THERMAL PERFORMANCE PREDICTION STRATEGY
Defang Li1,3, Jinying Zhang1,2, Jiushuai Xu3, Erwin Peiner3, Zhuo Li1,2, Xin Wang1, Suhui Yang1, and Yanze Gao1
1
Beijing Institute of Technology, CHINA, 2Yangtze Delta Region Academy of Beijing Institute of Technology, CHINA, and 3Technische Universität Braunschweig, GERMANY

MEMS for Timing & Frequency Control
W76-h

A CMOS-MEMS BEAM RESONATOR WITH Q > 10,000
Ting-Yi Chen and Wei-Chang Li
National Taiwan University, TAIWAN

M77-h

GENERIC TEMPERATURE COMPENSATION SCHEME FOR CMOS-MEMS RESONATORS BASED ON ARC-BEAM DERIVED ELECTRICAL STIFFNESS FREQUENCY PULLING
I-Chieh Hsieh, Hong-Sen Zheng, Chun-Pu Tsai, Ting-Yi Chen, and Wei-Chang Li
National Taiwan University, TAIWAN

T77-h

HIGH-Q AND LOW-MOTIONAL IMPEDANCE PIEZOELECTRIC MEMS RESONATOR THROUGH MECHANICAL MODE COUPLING
Linhai Huang1, Zhihong Feng1, Yuhao Xiao2, Fengpei Sun1, and Jinghui Xu1
1
Huawei Technologies Company Ltd., CHINA and 2Wuhan University, CHINA

Photonic Components & Systems
W77-h

CROSSTALK-FREE LARGE APERTURE 2D GIMBAL MICROMIRROR
Behrad Ghazinouri and Siyuan He
Toronto Metropolitan University, CANADA

M78-h

INVERSE INTERFERENCE EFFECT-ENHANCED ULTRASENSITIVE SENSING VIA MID-IR NANOANTENNAS
Hong Zhou, Dongxiao Li, Xinge Guo, Zhihao Ren, and Chengkuo Lee
National University of Singapore, SINGAPORE

T78-h

TWISTED AND CONTACTED AU MICRO-RODS 3D CHIRAL METAMATERIALS WITH CIRCULAR DICHROISM VIA AN ABSORPTIVE ROUTE IN LONG-WAVELENGTH INFRARED
Gaku Furusawa1, Natsuki Kanda2, Ryusuke Matsunaga2, and Tetsuo Kan1
1
University of Electro-Communications, JAPAN and 2University of Tokyo, JAPANRF MEMS Components & Systems
W78-h

3D HYBRID ACOUSTIC RESONATOR WITH COUPLED FREQUENCY RESPONSES OF SURFACE ACOUSTIC WAVE AND BULK ACOUSTIC WAVE
Liping Zhang1,2, Shibin Zhang1, Jinbo Wu1,2, Pengcheng Zheng1,2, Hulin Yao1,2, Yang Chen1,2, Kai Huang1,2, Xiaomeng Zhao1, Min Zhou1, and Xin Ou1,21
Chinese Academy of Sciences, CHINA and 2University of Chinese Academy of Sciences, CHINA

42

POSTERPRESENTATIONS
M79-h

A C/KU DUAL-BAND RECONFIGURABLE BAW FILTER USING POLARIZATION TUNING IN LAYERED SCALN
Dicheng Mo, Shaurya Dabas, Sushant Rassay, and Roozbeh Tabrizian
University of Florida, USA

T79-h

ACOUSTOELECTRIC-DRIVEN FREQUENCY MIXING IN MICROMACHINED LITHIUM NIOBATE ON SILICON WAVEGUIDES
Hakhamanesh Mansoorzare and Reza Abdolvand
University of Central Florida, USA

W79-h

EFFECT OF SCANDIUM COMPOSITION ON THE PHONON SCATTERING LIFETIME OF ALUMINUM SCANDIUM NITRIDE ACOUSTIC WAVE RESONATORSYue Zheng1, Mingyo Park1, Chao Yuan2, and Azadeh Ansari1
1
Georgia Institute of Technology, USA and 2Wuhan University, CHINA

M80-h

LITHIUM NIOBATE THIN FILM BASED A1 MODE RESONATORS WITH FREQUENCY UP TO 16 GHZ AND ELECTROMECHANICAL COUPLING FACTOR NEAR 35%
Rongxuan Su1, Zhenyi Yu2, Sulei Fu1, Huiping Xu1, Shuai Zhang1, Peisen Liu1, Yu Guo2, Cheng Song1, Fei Zeng1, and Feng Pan1
1
Tsinghua University, CHINA and 2Jiangnan University, CHINA

T80-h

SUB-3 DB INSERTION LOSS BROADBAND ACOUSTIC DELAY LINES AND HIGH FOM RESONATORS IN LINBO3/SIO2/SI FUNCTIONAL SUBSTRATE
Chun-Chen Yeh, Chia-Hsien Tsai, Guan-Lin Wu, Tzu-Hsuan Hsu, and Ming-Huang Li
National Tsing Hua University, TAIWAN

W80-h

SUPPRESSION OF SPURIOUS MODES IN ALUMINUM NITRIDE S1 LAMB WAVE RESONATORS USING A MECHANICAL SOFT-CONTACT SCHEME
Shao-Siang Tung1, Tzu-Hsuan Hsu1, Yens Ho2, Yung-Hsiang Chen2, Yelehanka R. Pradeep3, Rakesh Chand3, and Ming-Huang Li1
1
National Tsing Hua University, TAIWAN, 2Vanguard International Semiconductor Corporation, TAIWAN, and3
Vanguard International Semiconductor Corporation Singapore PTE. Ltd., SINGAPORE

THz MEMS Components & Systems
M81-h

TERAHERTZ REFLECTIVE METALENS FOR ARBITRARY OFF-AXIS FOCUSING WITH LARGE DEPTH OF FOCUS
Jiahao Miao, Yi Liu, Cong Lin, Zhanxuan Zhou, and Xiaomei Yu
Peking University, CHINA

Other Electromagnetic MEMS/NEMS
T81-h

TOWARDS A BETTER CMOS-MEMS RESOSWITCH USING ELECTROLESS PLATING FOR CONTACT ENGINEERING
Ting-Jui Liou, Chun-Pu Tsai, Ting-Yi Chen, and Wei-Chang Li
National Taiwan University, TAIWAN

43Award Nominee

OPEN
POSTERSi - Open Posters
W81-i

A MEMS-CMOS INFRA-RED MICROSYSTEM WITH IN-SENSOR MACHINE LEARNING CAPABILITIESMarco Castellano, Ugo Garozzo, Luca Gandolﬁ, Davide Ruggiero, and Giuseppe Bruno
STMicroelectronics, ITALY

M82-i

A NOVEL BAROMETRIC PRESSURE SENSOR WITH A CAPACITVE TRANSDUCER AND IMPROVED PERFORMANCE
Thomas Friedrich1, Volkmar Senz1, and Ferenc Lukacs2
1
Robert Bosch GmbH, GERMANY and 2Robert Bosch Kft., HUNGARY

T82-i

A NOVEL CLASS OF MOTION SENSORS FEATURED WITH AN ELECTRIC POTENTIAL SENSING CHANNEL
Enrico R. Alessi, Fabio Passaniti, and Emanuele Lavelli
STMicroelectronics, ITALY

W82-i

A STABLE MIR PHOTODETECTOR BASED ON 2D PTSI/P-SI NANOHOLE ARRAYS
Ashenaﬁ A. Elyas, Masahiko Shiraishi, and Tetsuo Kan
University of Electro-communications, JAPAN

M83-i

AN EQUIVALENT CIRCUIT MODEL FOR THE PHASE GRADIENT METASURFACE ANALYSIS IN VISIBLE BAND
Liye Li1, Senyong Hu1, Yifan Ouyang1, Yusa Chen1, Meizhang Wu2, and Wengang Wu1
1
Peking University, CHINA and 2University of Science and Technology Beijing, CHINA

T83-i

DETECTION OF MASS AND MATERIAL NATURE OF MICROPARTICLES BY A PIEZOELCTRIC MEMSFrancesco Foncellino and Luigi Barretta
STMicroelectronics, ITALY

W83-i

ELECTRO-OPTICAL TESTING SOLUTION FOR TMOS MEMS SENSOR SENSITIVITY ASSESSMENT AT WAFER LEVEL
Roberta Carbone, Dario Premi, and Marco Rossi
STMicroelectronics, ITALY

T84-i

HIGH PERFORMANCE SPUTTERED PZT PMUTS OPERATING IN THE ULTRASOUND IMAGING RANGE REPRODUCIBLE AT WAFER-SCALE
Jihang Liu1, David Sze Wai Choong1, Duan Jian Goh1, Merugu Srinivas1, Qing Xin Zhang1, Steven Lee Hou Jang1, Huamao Lin1, Fabio Quaglia3,
Domenico Giusti3, Laura Castoldi3, Claudia Pedrini3, Luca Barabani3, Annachiara Esposito3, Luigi Barretta3, Rossana Scaldaferri3,
Alberto Leotti2, Adriyan Hidayat Mohamed Hamsah3, Peter Chang Hyun Kee1, and Lee En-Yuan Joshua1
1Institute of Microelectronics, SINGAPORE, 2ST Microelectronics, SINGAPORE, and 3ST Microelectronics, ITALY

W84-i

PIEZOELECTRIC ACTUATOR INTRODUCTION FOR ACCURATE POSITIONING READ/WRITE ELEMENT IN HARD DISK DRIVE (HDD)
Domenico Giusti and Marco Ferrera
STMicroelectronics, ITALY

M85-i

PIEZOELECTRIC MEMS FOR MICROPARTICLES DETECTION: ALTERNATIVE READOUT FOR MASS DETECTION
Luigi Barretta and Francesco Foncellino
STMicroelectronics, ITALY

T85-i

SIDE WALL DETECTION TYPE SPR SENSOR WITH GOLD GRATING ON GLASS
Masaaki Oshita, Shinichi Suzuki, Kazuto Masamoto, and Tetsuo Kan
University of Electro-Communications, JAPAN

W85-i

SPUTTERED PZT AIR-COUPLED PMUTS WITH WIDE BANDWIDTH AND LONG DETECTION RANGE FOR RANGING APPLICATIONS
Mantalena Saraﬁanou1, David Sze Wai Choong1, Duan Jian Goh1, Jihang Liu1, Joshua En-Yuan Lee1, Srinivas Merugu1, Qing Xin Zhang1,
Peter Hyun Kee Chang1, Fabio Quaglia2, Domenico Giusti2, Laura Castoldi2, Filippo D'Ercoli2, Riccardo Tacchini2, Alberto Leotti3, and Dao Hao Sim3
1
Institute of Microelectronics, SINGAPORE, 2ST Microelectronics, ITALY, and 3ST Microelectronics, SINGAPORE

M86-i

THERMOELECTRIC MIROPHONE
Akash Gupta1, Dr. Achim Bittner1, Prof. Dr.-Ing, and Alfons Dehe1,2
1
Hahn-Schickard Institute for Applied Research e.V., GERMANY and 2University of Freiburg, GERMANY

T86-i

ULTRA-PRECISE DEPOSITION: DIGITAL MICROMANUFACTURING FOR ADVANCED PACKAGING
Lukasz Witczak, Jolanta Gadzalinska, Iwona Gradzka-Kurzaj, Mateusz Lysien, Ludovic Schneider, Aneta Wiatrowska, Karolina Fiaczyk,
Piotr Kowalczewski, Lukasz Kosior, and Filip Granek
XTPL SA, POLAND

W86-i

WAFER-LEVEL DEFECT CHARACTERIZATION AND POLARITY-DEPENDENT RESISTANCE DEGRADATION OF SPUTTERED SODIUM POTASSIUM NIOBATE THIN FILMS
Kuan-Ting Ho1, Daniel Monteiro Diniz Reis1, and Karla Hiller2
1
Robert Bosch GmbH, GERMANY and 2Technical University Chemnitz, GERMANY

Skyline – Munich, Germany. Image by Ric Sti from Pixabay

44MEETING SPACE &POSTER FLOOR PLANSLEGEND
Plenary Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Audimax (entrance on First & Second Floors)
Concurrent Sessions A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Audimax (entrance on First & Second Floors)
Concurrent Sessions B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hörsaal – Ground Floor
Industry Session . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hörsaal – Ground Floor
Award Presentations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Audimax (entrance on First & Second Floors)
Poster Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ground, First, and Second Floors
Exhibits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ground, First, and Second Floors
Breaks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ground, First, and Second Floors
Registration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ground Floor
Cloak Room . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Orion 1
Job Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ground Floor
Poster Presenter Listing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Ground Floor

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MEETING SPACE &POSTER FLOOR PLANS
ORION
CLOAK
ROOM

50