www.sunon.com

Headquarters
Sunonwealth Electric Machine Industry Co., Ltd.
TEL : +886-7-8135888
E-mail : sunon@sunon.com

Sunon Inc. (U.S.A.)TEL : +1-714-255-0208
E-mail : info@sunon.com

Sunon SAS (Europe)
TEL : +33-1-46154515
E-mail : europe@sunon.com

2022/06/03 (268-W)© 2022 SUNONWEALTH Electric Machine Industry Co., Ltd.

*All products are RoHS compliant.

SUNON’s Total Solution

Reduce Cost

ABOUT SUNON

Increases product profitability

Save Ti m e

Over 41 years, SUNON has specialized in various types ofthermal solutions related to motors, fans, and ventilators for awide range of applications. We offer optimal thermal solutions
and prompt responses to clients’ needs, with customer service
and technical support networks all around the world.

Reduces development costs and increases profits

Cost- e f f e c t i v e
Strong Technical S e r v i c

Decreases prototype development time
Provides the most economic design solutione

Thermal Module Applications

15G

07

Automotive

11

Industrial

13Entertainment

152

SUNON Comprehensive
Thermal Solution and Technical Support ServiceSUNON is an original cooling product manufacturer. We are 100% research-based, designing andmanufacturing a variety of fans, vapor chambers and heat pipes and more, We can configure bothactive and passive cooling components to provide our clients a full range of cooling solutions
through the use of scientific simulation and equipment. SUNON aims to give excellent service inthermal solutions, satisfying clients’ thermal requirements for any function, sizes, and budget.

CC o-DesignM

M odel Building

Customer's
Cooling
Request

SUNONCMSEMSUNON Optimal Cooling SolutionSE

S imulation &Optimization

E stimation &Validation

New ProductLaunch

M
ProductInfoFeatures

Air Cooling

Liquid Cooling

FanCooling Module

Cold Plates

Heat Sink(HS)Heat Pipe(HP)

Vapor Chamber(VC)

Custom Design

IntegralPipelining
Embedded

Extrusion
Die Casting
Skived Fin
Stacked Fin

Mesh
GroovedSintered Powder
Composite

Mesh
Sintered Powder•The most efficientheat dissipation
solution•Compact design•Large power carrier•Effective space
utilization

M ass Production

Passive Cooling•High reliability•Economic thermalsolution•Various pipedesign•Flexible
configuration•Better isothermalsystem•High Qmax
•High power densityCMSEM One-Stop
Thermal Solution Service

SUNON provides a set of CMSEM services, designing thermal solutions fromscratch. We work together with our clients to design the best thermal
modules for their individual needs. Then, we create a model to simulate
and optimize each module’s thermal performance, which is passed throughvarious estimation and mass-production phrases. Through collaboration,
the highest quality of service, and a timesaving process of solving heatproblems, SUNON provides our clients with optimal thermal solutions.
4Application
Industrial Equipment

Cold Plates

Inverter Drive
ADAS ECU

Greater thermal efficiency, suitable for applications with high power
density and in need of quick power transfer.
Compact design for limited spaces and flexible customization of ourliquid cold plates to suit your needs.

2 pass4 passCM036-20001N

6 passCM036-20002N

Leaking safety and high reliability assured based on the strong thermal
design and stimulation analysis on request.

CM036-20003N

Copper Tube Embedded in Aluminum Base | Tube Dim.(mm) 9.50 O.D x7.02 I.D
Description

5Flow Rate PerformancePart# ofTube Passes

Weight(g)Plate Dim.
(mm)

Overall Length(mm)Power Watt
(W)

CM036-20001N

2180

57.20

57.20

14.00

133.40CM036-20002N

4940

152.40127.0015.20

CM036-20003N

61230

177.80172.50

14.00

1 GPM

1.5 GPM

2 GPM

2.5 GPM

R
(℃/W)

PD
(psi)

R
(℃/W)

PD
(psi)

R
(℃/W)

PD
(psi)

R
(℃/W)

PD
(psi)

500

0.05800.80

0.04421.80

0.04003.20

0.03804.80

228.001000

0.01402.00

0.01124.00

0.01006.00

0.00939.20

233.401000

0.01163.20

0.00965.00

0.00877.00

0.008011.00
610.000
8.75007.50006.2500Air Cooling
Solution

Before5.0000Vapor Chamber & Cold Plate
Solution

After

Customized air cooling configuration design :3.75002.50001.25000.00001.9073Fin

Flexible and customized design that sustains high thermal effectiveness.

Space utilization and maximal thermal effectiveness.

2.54322.2252Slim-shaped design and suitable for limited system spaces.

ADC and AL and fan die-casting techniques.

Speed (m/s)

Performance

1.5895Fin

1.2716
0.95367

Steady and fast thermal uniformity that ensures better system function.

Inlet
Flow0.63578

OutletFlow

0.317890.0000Speed (m/s)

Dimensions (mm)113 x 78 x 24.7

113 x 78 x 64

Weight (g)250435

TDP (W)

205300Material

Aluminum, Copper, ADC10TIM

Nickle Plating
SHIN-ETSUX23-7921

CPU Support

Intel® Ice Lake / Cooper Lake Processor

CPU Socket

FCLGA 4189-4/5 (Socket P4/P5)

1.00

0.20

0.80

0.15

0.60

0.10

0.40

0.05

0.20

0.00

ICX 1U
51015

0.25

2025
Air Flow (CFM)
Rth30

35

0.00

0.35

Pressure Drop

0.20

0.28

0.15

0.21

0.10

0.14

0.05

0.070.00

ICX 2U510152025
Air Flow (CFM)

30350.00

Eagle Stream (Sapphirepphire Rapids)
Product Name
Sunon P/N
Dimensions (mm)

EST 1U

EST 2U

SM320-21001Y

SM421-21002Y

118 x78 x 30.43

118 x 78 x 64

Weight (g)

270

450

TDP (W)

205

350

Material
Surface Treatment
TIM

Aluminum, Copper, ADC10
Nickle Plating
SHIN-ETSUX23-7921

CPU Support

Intel® Eagle Stream Processor

CPU Socket

LGA4677

Therrmal Resistance (℃/W)

SM420-20001Y

0.25

1.00
Rth0.25

0.90

Pressure Drop

0.80
0.70

0.20

0.60

0.15

0.50
0.40

0.100.300.200.050.00

0.10

EST 1U
1012141618202224260.00

Air Flow (CFM)
0.5

0.20
Therrmal Resistance (℃/W)

SM316-20001Y

Pressure Drop

Pressure Drop (in-H2O)

Sunon P/N

Surface Treatment

7

ICX 2UICX 1U

Rth

Passive CPU Cooler Thermal Resistance
0.30

1.20

Pressure Drop (in-H2O)

Product Name

Therrmal Resistance (℃/W)

Whitley(Ice Lake)

Therrmal Resistance (℃/W)

0.30

Pressure Drop (in-H2O)

Passive CPU Cooler Thermal ResistanceRth

Pressure Drop
0.4

0.15

0.3
0.10
0.2
0.05

00.1

EST 2U101520253035

Air Flow (CFM)404550Pressure Drop (in-H2O)

5G08

High Power Heat Pipe Solution

AIR FLOW : 100 CFM

5G Networking
We customize a full range of cooling solutions to offer
the best thermal solutions, meeting clients’ goals andneeds for any function, sizes, and budget.

R (C/W)> Higher level thermal conductivity : 92~100w TDP.
> Excellent thermal equilibrium, 80% plus increase inthermal effectiveness.
> Can be configured with other components for highpowered applications to reduce thermal resistance.

0.1
0.090.08

Qmax
550~600W

0.07
0.06
0.05
0.04
0.03
0.02
200
20300

400

500

600

700

800
Power (W)Immersion Cooling Solution
Water Block Solution

Storagednaegd
Eolers andoCUPCl
ication foret
ermal specif
For Inthsttela,eing modules
develops thd
ign cool
troduces ancustom-des> SUNON inand variousserolcoeds.
PUneC
ermal
Intel server
plications’ th
apng
ki
or
tw
fy ne
to fully satis

1U

2UEVAC

odulesCustomized M

Cold Plates

Routerdnahceritw
S
design powFor
e of thermal
a wide rang

eds.
lutions withsystems’ ne> Cooling sodepending onw
0020tofrom 20w

20W ~

100W~

> Low vibration and power-saving module> Low maintenance and enhanced system effectivenessss> High reliability

200W~

400W~

1000W~

2000W

Cold Plates / Customized

Extrusion / Stacked Fin / Customized
9

Fan / Heat Pipes / AL Fin

Fan / Heat Pipes / AL Fin

Heat Pipes / AL Fin

Heat Pipes / AL Fin
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Automotive

~20W
20W

Heat Sink+Fan

200W
200Heat Pipe

5PUBM4PMVUJPO1000W~W~$PME1MBUF

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Application )6% "%"4 &7DBSDIBSHFS#FBNMJHIU

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Application

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12Industrial
High-Efficiency Transfer Heat

IPC

Power watt: 40+6+8, total 54W
Module size: 200x100x20mm

CPU : 40W

Ta: 50℃
T-CPU <80℃,
T1<110 ℃
T2<110 ℃

T1 : 6W

T2 : 8W

Original

10~100W
10~100SUNON80.5 ℃
75.5 ℃

1375.5 ℃
74.5 ℃

73.0 ℃

100~200W
200W

200~1000W
200~10

Aluminum Heatsink
Cooper Heatsink
Die-casting Heatsink

Heat Pipe
Vapor Chamber
Air Cooling Module

Integral / Embedded
dCold Plate

˙ Thermal Reliability

˙ Better Isothermal System˙˙Economical Cooling SolutionsApplication

72.9 ℃

IPC, Embedded System

Excellent Cooling EffectivenessApplication

˙ Compact Design
˙Space Utilization

Application

1000W~HeatH
eat Exchanger
˙ Efficient Heat Dissipation"QQMJDBUJPO

1PXFS4VQQMZ&NCFEEFE4ZTUFNDrive, IGBT modules

Drive, IPC

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14

Heat Sink

Thermal Pad (TIM)
SSD Chip
Thermal Pad (TIM)

Heat Sink

available

Slot MachineeGaming PC

SSD Chip Temperature Distribution*PS5 available

80.371

Solid Temperature (℃)

Solid State Disk (SSD))

76.99873.626

Before70.25366.881

TDP

30W

TDP

250W

Product Name

SD-2280

Dimensions (mm)48 x 88 x 23.5

Dimensions (mm)135.33 x138 x 164

Sunon P/N

SA007-21001S

Materials

Heat Sink + Fan Module

Materials

Heat pipe modules+12025 Fan

Dimensions (mm)80 x 22 x 11.5

Materials

Aluminum, Thermalpad

Application

Suitable for 2280 SSD ( 1TB, 2TB, 4TB capacity )*GZPVOFFETQFDJBMTQFDJDBUJPO1MFBTFDPOUBDU4VOPOTBMFT4QFDJDBUJPOTBSFTVCKFDUUPDIBOHFXJUIPVUOPUJDF4QFDJDBUJPOTJOUIJTDBUBMPHBSFGPSSFGFSFODF

63.50960.13656.76453.391

After

50.01946.64643.273

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39.901Entertainment
1516