THCV2712_Design Guide_Rev.1.00_E

THCV2712 Design Guide
System Diagram and PCB Design Guideline

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Contents
Contents.................................................................................................................................................................. 2
Application diagram.............................................................................................................................................. 3
Example: Distribution Mode 1................................................................................................................................................. 3
Example: Distribution Mode 2................................................................................................................................................. 4
Example: Switch Mode (1:2 Switch Function) ....................................................................................................................... 5
Example: Switch Mode (2:1 Switch Function) ....................................................................................................................... 6
Example: Switch Mode for THCS251 ..................................................................................................................................... 7

PCB Layout Considerations ................................................................................................................................. 8
Notices and Requests ............................................................................................................................................. 9

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Application diagram
Example: Distribution Mode 1
V-by-One HS
Tx

THCV2712

V-by-One HS
Rx0

TXP

AINP

AOUTP0RXP

TXN

AINN

AOUTN0RXN

AOUTN1PDNAOUTP1

LOCKN
BOUTP

BINP1

BOUTN

BINN1NC

BINN0

HTPDN

BINP03.3V

EQ
DRV

VCC (Pin 23)

10uF

1uF

1uF

0.1uF

PATHSEL[0]PATHSEL[1]1uF

REG25 (Pin34)

EQ
DRV 3.3V

V-by-One HS
Rx1

RXP

RXN
PDN
LOCKN

0.1uF

HTPDN

REG25 (Pin16)

0.1uF REG25 (Pin7)

MODE
PD

LOCKN
HTPDN

1uF

0.1uF REG15

GND

(*1)

(*1) Refer to a datasheet for Equalizer settings.
NC / 0Ω

EQ
NC / 0Ω

NC / 0Ω

DRV
NC / 0Ω

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THCV2712_Design Guide_Rev.1.00_E
Example: Distribution Mode 2
V-by-One HS
Tx

THCV2712

V-by-One HS
Rx0

TXP

AINP

AOUTP0RXP

TXN

AINN

AOUTN0RXN

AOUTN1PDNAOUTP1

LOCKN
BOUTP

BINP1

BOUTN

BINN1

NC

BINN0

HTPDN

BINP03.3V

EQ
DRV

VCC (Pin 23)

10uF

1uF

PATHSEL[0]PATHSEL[1]

1uF

1uF

0.1uF

REG25 (Pin34)

EQ
DRV 3.3V

V-by-One HS
Rx1

RXP

RXN
PDN
LOCKN

0.1uF

HTPDN

REG25 (Pin16)

0.1uF REG25 (Pin7)

MODE
PD

LOCKN
HTPDN

1uF

NC / 0Ω

NC / 0Ω

0.1uF REG15

GND

(*1)

(*1) Refer to a datasheet for Equalizer settings.
EQ
NC / 0Ω

DRV
NC / 0Ω

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THCV2712_Design Guide_Rev.1.00_E
Example: Switch Mode (1:2 Switch Function)
V-by-One HS
Tx

THCV2712

V-by-One HS
Rx0

TXPAINPAOUTP0RXP

TXN

AINN

AOUTN0RXN

AOUTN1PDNAOUTP1

LOCKN
BOUTP

BINP1BOUTN

BINN1NC

BINN0

HTPDN

BINP03.3V

EQ
DRV

VCC (Pin 23)

10uF

1uF

PATHSEL[0]PATHSEL[1]

1uF

1uF

0.1uF

EQ

V-by-One HS
Rx1

DRV

RXP

PATHSEL_0

RXN

PATHSEL_1
PDN

REG25 (Pin34)

LOCKN
0.1uF

REG25 (Pin16)

0.1uF REG25 (Pin7)

3.3V

HTPDN

MODE
PD

LOCKN
HTPDN

1uF

GND

0.1uF REG1501

PATHSEL_1
01

PATHSEL_1(*1)(*1) Refer to a datasheet for Equalizer settings.
NC / 0Ω

EQ
NC / 0Ω

NC / 0Ω

DRV
NC / 0Ω

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THCV2712_Design Guide_Rev.1.00_E
Example: Switch Mode (2:1 Switch Function)
V-by-One HS
Rx

THCV2712

V-by-One HS
Tx1

AINP

AOUTP0TXPAINN

AOUTN0TXN

AOUTN1PDNAOUTP1

LOCKN
RXP

BOUTP

BINP1RXN

BOUTN

BINN1NC

BINN0

HTPDN

BINP0
3.3V

EQ
DRV

VCC (Pin 23)

10uF

1uF

PATHSEL[0]PATHSEL[1]

1uF

1uF

0.1uF

EQ

V-by-One HS
Tx0DRVTXPPATHSEL_0

TXN

PATHSEL_1
PDN

REG25 (Pin34)

LOCKN
0.1uF

REG25 (Pin16)

0.1uF REG25 (Pin7)

3.3V

HTPDN

MODE
PD

LOCKN
HTPDN

1uF

GND

0.1uF REG1501

PATHSEL_1
01

PATHSEL_1(*1)(*1) Refer to a datasheet for Equalizer settings.
NC / 0Ω

EQ
NC / 0Ω

NC / 0Ω

DRV
NC / 0Ω

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THCV2712_Design Guide_Rev.1.00_E
Example: Switch Mode for THCS251
THCS251(Master)

THCV2712

THCS251(Slave0)

TXP

AINPAOUTP0

RXP

TXN

AINN

AOUTN0RXN

AOUTN1TXNAOUTP1RXN

BOUTP

BINP1RXP

BOUTN

BINN1NC

BINN0

TXP

THCS251(Slave1)

BINP0
3.3V
10uF

EQ
VCC (Pin 23)
1uF

DRV

PATHSEL[0]PATHSEL[1]

1uF

0.1uF

1uF

0.1uF

EQ
DRV
PATHSEL_0
PATHSEL_1

RXP
RXN
TXN
TXP

REG25 (Pin34)
REG25 (Pin16)

0.1uF REG25 (Pin7)

3.3V
MODE
PD

1uF

0.1uF REG15

GND

(*1)

(*1) Refer to a datasheet for Equalizer settings.
NC / 0Ω

EQ
NC / 0Ω

NC / 0Ω

DRV
NC / 0ΩCopyright© 2020 THine Electronics, Inc.

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THCV2712_Design Guide_Rev.1.00_E

PCB Layout Considerations





Use at least four-layer PCB with signals, ground, power, and signals assigned for each layer. (Refer to figurebelow.)
PCB traces for high-speed signals must be single-ended micorstirp lines or coupled microstrip lines for 100Ωdifferential characteristic impedance.
Minimize the distance between traces of a differential pair (S1) to maximize common mode rejection andcoupling effect which works to reduce EMI (Electro-Magnetic Interference).
Route differential signal traces symmetrically.
For high speed signals, avoid right-angle bends in a trace. Route them at least with two 45° corners orround bend. Also avoid transmission line with vias in signal routings for signal integrity. If it is impossible,
trace the differential line vias with symmetrically during and manage via impedance for required
characteristic impedance.
Mismatch among impedances of PCB traces, connectors and cables also caused reflection, limiting thebandwidth of the high-speed channels.
Using common-mode choke filter on differential traces would reduce system EMI. Pay attention onparasitic capacitance for the component and differential mode attenuation for high speed signal. For
example, in case of 3Gbps data-rate, low impedance of common mode at 1.5GHz would reduce the EMI,
however low impedance of differential mode at 1.5GHz would make signal integrity worse.

PCB Cross-sectional View
for Microstrip Lines> 3 x S1

S1

> 3 x S1GNDGND

Layer1: Signals
Layer2: Ground
Layer3: Power
Layer3: Signals
Figure 1 PCB cross-sectional view

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THCV2712_Design Guide_Rev.1.00_E

Notices and Requests
1. The product specifications described in this material are subject to change without prior notice.
2. The circuit diagrams described in this material are examples of the application which may not always apply tothe customer's design. THine Electronics, Inc. (“THine”) is not responsible for possible errors and omissions
in this material. Please note even if errors or omissions should be found in this material, THine may not beable to correct them immediately.
3. This material contains THine’s copyright, know-how or other proprietary. Copying or disclosing to thirdparties the contents of this material without THine’s prior permission is prohibited.
4. Note that even if infringement of any third party's industrial ownership should occur by using this product,
THine will be exempted from the responsibility unless it directly relates to the production process or functionsof the product.
5. Product Application
5.1 Application of this product is intended for and limited to the following applications: audio-video device,office automation device, communication device, consumer electronics, smartphone, feature phone, andamusement machine device. This product must not be used for applications that require extremely highreliability/safety such as aerospace device, traffic device, transportation device, nuclear power control device,
combustion chamber device, medical device related to critical care, or any kind of safety device.
5.2 This product is not intended to be used as an automotive part, unless the product is specified as a productconforming to the demands and specifications of IATF16949 ("the Specified Product") in this data sheet.
THine accepts no liability whatsoever for any product other than the Specified Product for it not conforming
to the aforementioned demands and specifications.
5.3 THine accepts liability for demands and specifications of the Specified Product only to the extent that theuser and THine have been previously and explicitly agreed to each other.
6. Despite our utmost efforts to improve the quality and reliability of the product, faults will occur with a certain
small probability, which is inevitable to a semi-conductor product. Therefore, you are encouraged to havesufficiently redundant or error preventive design applied to the use of the product so as not to have ourproduct cause any social or public damage.
7. Please note that this product is not designed to be radiation-proof.
8. Testing and other quality control techniques are used to this product to the extent THine deems necessary tosupport warranty for performance of this product. Except where mandated by applicable law or deemednecessary by THine based on the user’s request, testing of all functions and performance of the product is notnecessarily performed.
9. Customers are asked, if required, to judge by themselves if this product falls under the category of strategic
goods under the Foreign Exchange and Foreign Trade Act.
10. The product or peripheral parts may be damaged by a surge in voltage over the absolute maximum ratings ormalfunction, if pins of the product are shorted by such as foreign substance. The damages may cause asmoking and ignition. Therefore, you are encouraged to implement safety measures by adding protection
devices, such as fuses.

THine Electronics, Inc.
https://www.thine.co.jp

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