DATA SHEETMINIATURE SIGNAL RELAY

RoHS2 Compliant

UA2/UB2 SERIESSUPER-COMPACT SIZE, SLIM-PACKAGEDESCRIPTIONNEXEM UA2/UB2 relay is a new generation miniature signal relay, super-compact and slim.

FEATURES□ Small mounting size of slim package for dense mounting□ Telcordia (2500 V) and FCC (1500 V) surge capacity□ IEC62368-1/ EN62368-1 spacing (Basic insulation class on 200 V working voltage)□ Low power consumption (100-230 mW)□ NZF type (high power switching) is UL recognized / CSA Certificated for 30VDC, 2A (resistive load), supports
maximum switching power of 60 W and maximum switching and carrying current of 2 A.

□ Moisture Barrier Bag (MBB) packaged UB2 relays meet moisture sensibility level (MSL) of IPC/JEDEC-STD-020, 075.

APPLICATIONSElectronic switching systems, PBX, Terminal equipment, Telephone system

For Right Use of Miniature Relays
DO NOT EXCEED MAXIMUM RATINGS.
Do not use relays under exceeding conditions such as over ambient temperature, over voltage and overcurrent. Incorrect use could result in abnormal heating, damage to related parts or cause burning.
READ CAUTIONS IN THE SELECTION GUIDE.
Read the cautions described in EM Devices' "Miniature Relays" when you choose relays for your application.

The information in this document is subject to change without notice.
© EM Devices Corporation 2023

●All specifications in this catalog and production status of products are subject to change without notice. Prior to the purchase, please contact EM Devices for updated product data.
●Please request for a specification sheet for detailed product data prior to the purchase.
●Before using the product in this catalog, please read "NOTES ON CORRECT USE" in the selection guide2023.12.1

EMDSD4VOL03E2312H

UA2/UB2 SERIESMARKINGS (Top view)
（4）

（1）

（1）
（2）
（3）
（4）
（5）

（5）

（2）

Part number
Manufacturer
Country of origin
Date code
Direction mark (pin No. 1 and 8)（3）

DIMENSIONS

UA2 SERIES

Unit: mm (inch)

DIMENSIONSPAD LAYOUTS (Bottom view)

STANDARD / TRIMMED LEAD TYPE
10.6 (0.417)[mm]
5.7 (0.224)

[1.5]
3.2

0.5
(0.02)

[1.5]

7.6
2.2

2.2

8-φ0.858.0(0.315)3.2
3.4(0.134)

3.2
2.2
2.2
(0.126) (0.087) (0.087)

Tolerance of lead pitch is ± 0.15mm (0.006inch)
Other tolerances ± 0.3mm (0.012inch)[1.3]

NOTE. General tolerance: ± 0.1

3.2(0.126)(Bottom view)

Lead size 0.4 x 0.2 ± 0.1

Trimmed lead type: Lead length 2.8mm

PIN CONFIGURATIONS (Bottom view)Non-latch type

Single coil latch type

(Not energized position)

S: Coil polarity for Set
R: Coil polarity for Reset(Reset position)

2●All specifications in this catalog and production status of products are subject to change without notice. Prior to the purchase, please contact EM Devices for updated product data.
●Please request for a specification sheet for detailed product data prior to the purchase.
●Before using the product in this catalog, please read "NOTES ON CORRECT USE" in the selection guide2023.12.1

EMDSD4VOL03E2312H

UA2/UB2 SERIESUB2 SERIES

Unit: mm (inch)

DIMENSIONSPAD LAYOUTS (Top view)

STANDARD[mm]

10.6 (0.417)[1.5]

5.7 (0.224)

[1]

[1.5]

7.6

8.8
max.
(0.346)

5.3
3.1

3.2
(0.126)2.2
3.2
2.2(0.126) (0.087) (0.087)

7.4 (0.291)

Tolerance of lead pitch is ±0.15mm (0.006inch)
Other tolerances ±0.3mm (0.012inch)
Coplanarity of terminals is 0.1mm Max.

0.8

Lead size 0.4x0.2 ±0.1

NOTE. General tolerance: ±0.1

MINIMUM FOOTPRINT TYPE

[mm]
[1.5]

10.6 (0.417)

5.7 (0.224)

[1.5]

7.6
3.2

2.2

2.2

9.0
max.
[1.2] (0.354)

4.6
2.25

3.2
(0.126)3.2
2.2
2.2(0.126) (0.087)(0.087)

Tolerance of lead pitch is ±0.15mm (0.006inch)
Other tolerances ±0.3mm (0.012inch)
Coplanarity of terminals is 0.1mm Max.

0.8

5.7 (0.224)

Lead size 0.4x0.2 ±0.1

NOTE. General tolerance: ±0.1
(Top view)

PIN CONFIGURATIONS (Top view)Non-latch type

Single coil latch type

(Not energized position)

S: Coil polarity for Set
R: Coil polarity for Reset(Reset position)

3●All specifications in this catalog and production status of products are subject to change without notice. Prior to the purchase, please contact EM Devices for updated product data.
●Please request for a specification sheet for detailed product data prior to the purchase.
●Before using the product in this catalog, please read "NOTES ON CORRECT USE" in the selection guide2023.12.1

EMDSD4VOL03E2312H

UA2/UB2 SERIESGENERAL SPECIFICATIONSContact Form

2 Form C
Standard

Contact Material

Silver alloy with gold alloy overlay

High power switching type

Silver with gold alloy overlay

Maximum SwitchingStandard

30 W, 37.5 VA (resistive)

Power

High power switching type

60 W, 37.5 VA (resistive)

Maximum Switching Voltage

220 VDC, 250 VAC

Maximum SwitchingStandard

1A

Current

High power switching type

2A

Maximum Carrying

Standard

1A

Current

High power switching type

2A

Minimum Contact Ratings

10 m VDC, 10µA *1

Initial Contact Resistance

100 m Ω max. (Initial)

Operate Time [Set Time] (Excluding bounce)

Approx. 2 ms [2ms]Release Time [Reset Time] (Excluding bounce)

Approx. 1 ms [2ms] (Without diode)

Insulation Resistance1000 MΩ at 500 VDCWithstanding
Voltage

Between open contacts

1000 VAC (for one minute), 1500 V surge (10x160 µs *2)

Between adjacent contacts

1000 VAC (for one minute), 1500 V surge (10x160 µs *2)

Between coil and contacts

1800 VAC (for one minute), 2500 V surge (2x10 µs *3)
735 m/s2 (75G) (misoperation)

Shock Resistance

980 m/s2 (100G) (destructive failure)
10 to 55 Hz, double amplitude 3 mm (196 m/s2) (misoperation)

Vibration Resistance

10 to 55 Hz, double amplitude 5 mm (294 m/s2) (destructive failure)-40 to +85 ℃

Ambient Temperature

13 ℃ / 100mW, 18 ℃ / 140mW, 28 ℃ / 230mW at nominal coil

Coil Temperature Rise

Voltage
Non-load

RunningSpecifications

Load(Only High powerswitching type）

Weight5x107 operations (Non-latch type) *4
1x107 operations (latch type)
30 VDC 1A (resistive), 1x105 operations at 20°C,1Hz
125 VAC 0.3A (resistive), 1x105 operations at 20°C,1Hz
30 VDC 2A (resistive), 5x104 operations at 20°C,1Hz
Approx. 1 g* 1 This value is a reference value in the resistive load.

Minimum capacity changes depending on switching frequency and environment temperature and the load.

* 2 rise time: 10μs, decay time to half crest: 160μs* 3 rise time: 2μs, decay time to half crest: 10μs
* 4 This shows the number of operations with fatal defects. Stable characteristics are maintained for 1 × 107 operations.

4●All specifications in this catalog and production status of products are subject to change without notice. Prior to the purchase, please contact EM Devices for updated product data.
●Please request for a specification sheet for detailed product data prior to the purchase.
●Before using the product in this catalog, please read "NOTES ON CORRECT USE" in the selection guide2023.12.1

EMDSD4VOL03E2312H

UA2/UB2 SERIESCOIL SPECIFICATIONS
Non-latch Type
NominalCoil

Must Operate

Must Releaseat 20°C
NominalCoil Voltage

Resistance

Voltage*

Voltage*

Operating Power(VDC)(Ω)±10%

(VDC)

(VDC)

(mW)

3
4.5
5
9
12
24

64.3
145
178
579
1028
2504

2.25
3.38
3.75
6.75
9.0
18.0

0.3
0.45
0.5
0.9
1.2
2.4

140
140
140
140
140
230

Single Coil Latch Type
Nominal

Coil

Set

Reset

at 20°C
NominalCoil Voltage

Resistance

Voltage*

Voltage*

Operating Power(VDC)(Ω)±10%

(VDC)

(VDC)

(mW)

3
90
2.25
2.25
100
4.5
202.5
3.38
3.38
100
5
250
3.75
3.75
100
9
810
6.75
6.75
100
12
1440
9.0
9.0
100
Note: Apply the coil voltage so that the No.1 pin is on the + side when set and the No.8 pin is on the + side when reset.
Non-latch Low Power Consumption Type
Nominal
Coil
Coil Voltage

Must Operate

Must Releaseat 20°C
NominalResistance

Voltage*

Voltage*

Operating Power(Ω)±10%

(VDC)

(VDC)

(mW)

3
90
4.5
202.5
5
250
Note: * Test by pulse voltage

2.25
3.38
3.75

0.3
0.45
0.5

100
100
100

(VDC)

SAFETY STANDARD AND RATINGCSA Certificated(CSA C22.2 No14) **File No LR46266

UL Recognized(UL508) *File No E73266

TUV Certificate(EN61810-1)
No. 2050596 ***Standard
30 VDC, 1 A (Resistive)
110 VDC, 0.3 A (Resistive)
125 VAC, 0.3 A (Resistive)

Creepage and clearance of
coil to contact is more than 2 mm.

High power switching type
30 VDC, 2 A (Resistive)
110 VDC, 0.3 A (Resistive)
125 VAC, 0.3 A (Resistive)* Spacing: UL840, **Spacing: CSA std950(According to EN62368-1)
Basic insulation class***High power switching type are not supported TUV certified.

RECOMMENDED RELAY DRIVE CONDITIONSDrive under conditions.

Non-latch type

Single coil latch type

Voltage: within ±5% of nominal voltage
Square pulse (rise and fall time is rapid)
pulse height: within ±5% of nominal voltage
pulse width: more than 10 ms

Ambient temperature- 40 to +85 °C

5●All specifications in this catalog and production status of products are subject to change without notice. Prior to the purchase, please contact EM Devices for updated product data.
●Please request for a specification sheet for detailed product data prior to the purchase.
●Before using the product in this catalog, please read "NOTES ON CORRECT USE" in the selection guide2023.12.1

EMDSD4VOL03E2312H

UA2/UB2 SERIESPART NUMBER SYSTEM
UA2 – 3 S NU
Option
NU:
NJ:
NE:
NZF:

Standard
Trimmed lead typeLow power consumption typeHigh power switching type

Latch type
Nil:
Non-latch typeS:
Single coil latch type
Nominal coil voltage(A numerical value of coil voltage)
UA2 series

UB2 – 3 S NU – L
Packing
Nil:
Tube
L:
Embossed carrying tape
L8:
Embossed carrying tape with Moisture Barrier Bag (MBB)(To meet for 250 °C reflow condition: MSL 4)
OptionNU: Standard
NUN: Minimum footprint typeNE:
Low power consumption type
NEN: Low power consumption, Minimum footprint type
NZF:
High power switching type
NZFN: High power switching, Minimum footprint type
Latch type
Nil: Non-latch type
S: Single coil latch type
Nominal coil voltage(A numerical value of coil voltage)
UB2 series

ORDERING PART NUMBERS□ UA2 series
OptionTerminal

PackingStandard

Tube

Trimmedlead

Coil Type

NominalCoil
Voltage(VDC)

Non-latchSingle Coil Latch

Non-latch
Low power
consumption3

UA2-3NU

UA2-3SNU

UA2-3NE

4.5

UA2-4.5NU

UA2-4.5SNU

UA2-4.5NE5

UA2-5NU

UA2-5SNU

UA2-5NE9

UA2-9NU

UA2-9SNU-

12

UA2-12NU

UA2-12SNU-

24

UA2-24NU--

3

UA2-3NJ

UA2-3SNJ-

4.5

UA2-4.5NJ

UA2-4.5SNJ-

5

UA2-5NJ

UA2-5SNJ-9

UA2-9NJ

UA2-9SNJ-

12

UA2-12NJ

UA2-12SNJ-

24

UA2-24NJ-

6●All specifications in this catalog and production status of products are subject to change without notice. Prior to the purchase, please contact EM Devices for updated product data.
●Please request for a specification sheet for detailed product data prior to the purchase.
●Before using the product in this catalog, please read "NOTES ON CORRECT USE" in the selection guide2023.12.1

EMDSD4VOL03E2312H

UA2/UB2 SERIES□ UB2 series
OptionTerminal

Coil Type

Packing

Tube

Standard

TapingTaping(MBB)

Tube

Minimum
footprint

TapingTaping(MBB)

Nominal Coil Voltage(VDC)

Non-latchSingle Coil Latch

Non-latch
Low power
consumption3

UB2-3NU

UB2-3SNU

UB2-3NE

4.5

UB2-4.5NU

UB2-4.5SNU

UB2-4.5NE

5

UB2-5NU

UB2-5SNU

UB2-5NE9

UB2-9NU

UB2-9SNU-

12

UB2-12NU

UB2-12SNU-

24

UB2-24NU--

3

UB2-3NU-L

UB2-3SNU-L

UB2-3NE-L

4.5

UB2-4.5NU-L

UB2-4.5SNU-L

UB2-4.5NE-L

5

UB2-5NU-L

UB2-5SNU-L

UB2-5NE-L9

UB2-9NU-L

UB2-9SNU-L-

12

UB2-12NU-L

UB2-12SNU-L-

24

UB2-24NU-L

-

-

3

UB2-3NU-L8

UB2-3SNU-L8

UB2-3NE-L8

4.5

UB2-4.5NU-L8

UB2-4.5SNU-L8

UB2-4.5NE-L85

UB2-5NU-L8

UB2-5SNU-L8

UB2-5NE-L89

UB2-9NU-L8

UB2-9SNU-L8-

12

UB2-12NU-L8

UB2-12SNU-L8-

24

UB2-24NU-L8

-

-

3

UB2-3NUN

UB2-3SNUN

UB2-3NEN

4.5

UB2-4.5NUN

UB2-4.5SNUN

UB2-4.5NEN

5

UB2-5NUN

UB2-5SNUN

UB2-5NEN9

UB2-9NUN

UB2-9SNUN-

12

UB2-12NUN

UB2-12SNUN-

24

UB2-24NUN--

3

UB2-3NUN-L

UB2-3SNUN-L

UB2-3NEN-L

4.5

UB2-4.5NUN-L

UB2-4.5SNUN-L

UB2-4.5NEN-L

5

UB2-5NUN-L

UB2-5SNUN-L

UB2-5NEN-L9

UB2-9NUN-L

UB2-9SNUN-L-

12

UB2-12NUN-L

UB2-12SNUN-L-

24

UB2-24NUN-L

-

-

3

UB2-3NUN-L8

UB2-3SNUN-L8

UB2-3NEN-L8

4.5

UB2-4.5NUN-L8

UB2-4.5SNUN-L8

UB2-4.5NEN-L85

UB2-5NUN-L8

UB2-5SNUN-L8

UB2-5NEN-L89

UB2-9NUN-L8

UB2-9SNUN-L8-

12

UB2-12NUN-L8

UB2-12SNUN-L8-

24

UB2-24NUN-L8

-

-

Note:
1. Only MBB packaging part numbers meet MSL (L8: MSL 4). However, it does not fully conform to JEDEC standards.
Please note that part numbers other without MBB packaging do not meet MSL.

7●All specifications in this catalog and production status of products are subject to change without notice. Prior to the purchase, please contact EM Devices for updated product data.
●Please request for a specification sheet for detailed product data prior to the purchase.
●Before using the product in this catalog, please read "NOTES ON CORRECT USE" in the selection guide2023.12.1

EMDSD4VOL03E2312H

UA2/UB2 SERIES□ UA2 series／High power switching type
OptionTerminal

PackingStandard

Nominal Coil Voltage
(VDC)

Tube

Coil Type
Non-latchSingle Coil Latch

3

UA2-3NZF

UA2-3SNZF

4.5

UA2-4.5NZF

UA2-4.5SNZF

5

UA2-5NZF

UA2-5SNZF9

UA2-9NZF

UA2-9SNZF

12

UA2-12NZF

UA2-12SNZF

24

UA2-24NZF-□ UB2 series／High power switching type
OptionTerminal

Standard

Minimum
footprint

PackingNominal Coil Voltage(VDC)

Coil Type
Non-latchSingle Coil Latch

3

UB2-3NZF-L8

UB2-3SNZF-L8

4.5

UB2-4.5NZF-L8

UB2-4.5SNZF-L8

Taping5

UB2-5NZF-L8

UB2-5SNZF-L8

(MBB)

9

UB2-9NZF-L8

UB2-9SNZF-L8

12

UB2-12NZF-L8

UB2-12SNZF-L8

Taping(MBB)

24

UB2-24NZF-L8-3

UB2-3NZFN-L8

UB2-3SNZFN-L8

4.5

UB2-4.5NZFN-L8

UB2-4.5SNZFN-L85

UB2-5NZFN-L8

UB2-5SNZFN-L8

9

UB2-9NZFN-L8

UB2-9SNZFN-L8

12

UB2-12NZFN-L8

UB2-12SNZFN-L8

24

UB2-24NZFN-L8

-

Note:
2. The packaging specification for UB2 relay high power switching type is only Taping with MBB (MSL 4). Please note that otherpackaging specifications are not supported.

PERFORMANCE DATA□COIL TEMPERATURE RISE
Temperature is measured by coil resistance.

8●All specifications in this catalog and production status of products are subject to change without notice. Prior to the purchase, please contact EM Devices for updated product data.
●Please request for a specification sheet for detailed product data prior to the purchase.
●Before using the product in this catalog, please read "NOTES ON CORRECT USE" in the selection guide2023.12.1

EMDSD4VOL03E2312H

UA2/UB2 SERIES□SWITCHING CAPACITY
This is allowed maximum value.
Inquire with EM Devices for maximum value under continuous use.

(Standard)(High power switching type)□MAXIMUM COIL VOLTAGE
This is a maximum value of permissible alteration.
Inquire with EM Devices under continuous use.

□ APPLIED POWER VS. TIMING(Sample: UA2-5NU)

9●All specifications in this catalog and production status of products are subject to change without notice. Prior to the purchase, please contact EM Devices for updated product data.
●Please request for a specification sheet for detailed product data prior to the purchase.
●Before using the product in this catalog, please read "NOTES ON CORRECT USE" in the selection guide2023.12.1

EMDSD4VOL03E2312H

UA2/UB2 SERIES□OPERATE AND RELEASE VOLTAGE VS. AMBIENT TEMPERATURE
This shows a typical change of operate (release) voltage. The value of must operate is estimated, so coil voltage must be applied more than thisvalue for safety operation. For hot start operation, please inquire with EM Devices.

□RUNNING TEST (Non-load)(Load: none, Drive: 5VDC, 50Hz, 50%duty, Ambient temperature: room temperature, Sample: UA2-5NU, 20pieces)□RUNNING TEST (Load)(Load: 50VDC 0.1A resistive, Drive: 5VDC, 5Hz, 50%duty, Ambient temperature:85°C, Sample: UA2-5NU, 10pieces)

10●All specifications in this catalog and production status of products are subject to change without notice. Prior to the purchase, please contact EM Devices for updated product data.
●Please request for a specification sheet for detailed product data prior to the purchase.
●Before using the product in this catalog, please read "NOTES ON CORRECT USE" in the selection guide2023.12.1

EMDSD4VOL03E2312H

UA2/UB2 SERIES□BREAKDOWN VOLTAGE
Sample: UA2-5NU 10peices(a) Between open contacts(b) Between adjacent contacts(c) Between coil and contacts

Note: Applying 2.8 kV or more
may cause of breakdown
outside U series relay(between terminals).

□ALTERNATION OF VOLTAGE AT DENSELY MOUNTING (Magnet interference)
Alternation of operate voltage

Alternation of release voltage

Device under test
ON

ON

OFF

ON

OFF

OFF
3mm
OFF

ON
c

b

a

ON

OFF

ON

OFF

ON

2.6mm

d

OFF
e

f

11

●All specifications in this catalog and production status of products are subject to change without notice. Prior to the purchase, please contact EM Devices for updated product data.
●Please request for a specification sheet for detailed product data prior to the purchase.
●Before using the product in this catalog, please read "NOTES ON CORRECT USE" in the selection guide2023.12.1

EMDSD4VOL03E2312H

UA2/UB2 SERIES(Unit: mm)

PACKING DIMENSIONSTUBE PACKING (UA2/UB2)
15.1

50 pieces / Tube (anti-static)

560

10.1
Rubber stopper (Yellow)

Rubber stopper (Green)

Direction of relay direction mark

TAPE PACKING (UB2)APPEARANCE
Reel material:

Reel

Corrugated Cardboard（L）
PS（L8：MBB）

EmbossRelay quantity:

800 pieces / Reel（L）

Reel diameter:

750 pieces / Reel（L8：MBB）*Two reels are sealed in one MBB.
380mm

Carrying tape

Top cover tape2
4

12Max. 9.8
8.2
0.4

1.75

φ1.5

11.4
9.5

24.0

11.5

TAPE DIMENSIONS

8.7
6.1

2.4

RELAY DIRECTION AND TAPE CARRYING DIRECTION
Sprocket hole

Direction markDirection of unreeling

12●All specifications in this catalog and production status of products are subject to change without notice. Prior to the purchase, please contact EM Devices for updated product data.
●Please request for a specification sheet for detailed product data prior to the purchase.
●Before using the product in this catalog, please read "NOTES ON CORRECT USE" in the selection guide2023.12.1

EMDSD4VOL03E2312H

UA2/UB2 SERIESSOLDERING TEMPERATURE CONDITION
THROUGH-HOLE MOUNTING (UA2)
1. Automatic soldering
Preheating: 110~ 120°C /110 s. (max.)
Solder temperature: 260°C max.
Solder time: 5 s max.
Note: EM Devices recommends cooling down a printed circuit board less than 110°C within 40 s after soldering.
2. Manual soldering

Solder temperature: 350°C max.
Solder time: 3 s max.

Note: Heating of this product by automatic soldering and manual soldering is limited to a total of three times.

SURFACE-MOUNTING TYPE (UB2)
1. Reflow Method (NEXEM recommend profile)
Temperature(°C)

max. 240°C
220
200
180

*Temperature profile shows printed
circuit board surface temperature on
the relay terminal portion.

45 (max.70)

Time (s)70 (max.120)
190 (max.300)

2. Reflow Method (JEDEC compliant profile)*Product name only to meet for 250 °C reflow condition (L8 packaging)Temperature(°C)

max. 480
245 ºC (max. 250 ºC – 5 ºC)

250max. 3 ºC / sec.

max. 6 ºC / sec.

217
200

*Temperature profile shows body
(cover) temperature.

150

max. 30
25

max. 120

max. 110Time (s)Note:
1. Heating by reflow should be limited to two times. However, allow sufficient time for cooling of the product between the firstand second reflow.
2. Check the actual soldering condition to use other method except above mentioned temperature profiles.

13●All specifications in this catalog and production status of products are subject to change without notice. Prior to the purchase, please contact EM Devices for updated product data.
●Please request for a specification sheet for detailed product data prior to the purchase.
●Before using the product in this catalog, please read "NOTES ON CORRECT USE" in the selection guide2023.12.1

EMDSD4VOL03E2312H

UA2/UB2 SERIESNOTE ON CORRECT USE
1. Notes on contact load
Make sure that the contact load is within the specified range;otherwise, the lifetime of the contacts will be shortened
considerably.
Note that the running performance shown is an example, andthat it varies depending on parameters such as the type of load,
switching frequency, driver circuit, and ambient temperature
under the actual operating conditions. Evaluate theperformance by using the actual circuit before using the relay.

2. Driving relays- If the internal connection diagram of a relay shows + and symbols on the coil, apply the rated voltage to the relay in thespecified direction. If a rippled DC current source is used,abnormalities such as beat at the coil may occur.
- The maximum voltage that can be applied to the coil of therelay varies depending on the ambient temperature. Generally,
the higher the voltage applied to the coil, the shorter theoperating time. Note, however, that a high voltage also
increases the bounce of the contacts and the contact opening
and closing frequency, which may shorten the lifetime of thecontacts.

insulation or contact performance.
- If the relay is used for a long period of time in highly humid(RH 85% or higher) environment, moisture may be absorbed
into the relay. This moisture may react with the NOx and SOx
generated by glow discharges that occur when the contacts
are opened or closed, producing nitric or sulfuric acid. If thishappens, the acid produced may corrode the metallic parts of
the relay, causing operational malfunction.
- If any material containing silicone (silicone rubber, silicone oil,and silicone-based coating material) is used in theneighborhood of relay, there is some possibility that thesematerials will emit silicone gas that will penetrate the relay. In
this case, the switching contact may generate siliconcompounds on the surface of contacts. This siliconcompound may result in contact failure. Avoid use of relay insuch an environment.
- Because the operating temperature range varies dependingon the humidity, use the relay in the temperature range
illustrated in the figure below. Prevent the relay from being
frozen and avoid the generation of condensation.

- If the driving voltage waveform of the relay coil rises andfalls gradually, the inherent performance of the relay may
not be fully realized. Make sure that the voltage waveform
instantaneously rises and falls as a pulse.

- For a latching relay, apply a voltage to the coil according

to the polarity specified in the internal connection
diagram of the relay.
- If a current is applied to the coil over a long period of time,
the coil temperature rises, promoting generation of organic
gas inside the relay, which may result in faulty contacts. In
this case, use of a latching relay is recommended.
- The operating time and release time indicate the timerequired for each contact to close after the voltage has been
applied to or removed from the coil. However, because therelay has a mechanical structure, a bounce state exists at theend of the operating and release times. Furthermore,because additional time is required until the contact stabilizes
after being in a high-resistance state, care must be taken
when using the relay at high speeds.

3. Operating environment- Make sure that the relay mounted in the application set isused within the specified temperature range. Use of a relay at
a temperature outside this range may adversely affect- The same applies when the relay is stored or transported.
Keep the upper-limit value of the temperature to which therelay is exposed after it is removed from the carton box towithin 50°C. Please also refer to “5. Handling” for SMT relays.
- Permanent magnets are used in polarized relays. For thisreason, when magnets, transformers, or speakers arelocated nearby the relay characteristics may change andfaulty operations may result.
- The relay maintains constant sealability under normal
atmospheric pressure (810 to 1,200 hPa). Its sealability may
be degraded or the relay may be deformed and malfunction if
it is used under barometric conditions exceeding thespecified range.
- If excessive vibration or shock is applied to the relay, it
may malfunction, and the contacts remain closed.
Vibration or shock applied to the relay during operation
may cause considerable damage to or wearing of thecontacts. Note that operation of a snap switch mounted
close to the relay or shock due to the operation ofmagnetic solenoid may also cause malfunctioning.

14●All specifications in this catalog and production status of products are subject to change without notice. Prior to the purchase, please contact EM Devices for updated product data.
●Please request for a specification sheet for detailed product data prior to the purchase.
●Before using the product in this catalog, please read "NOTES ON CORRECT USE" in the selection guide2023.12.1

EMDSD4VOL03E2312H

UA2/UB2 SERIES
4. Notes on mounting relays- When mounting a relay onto a PC board using an automatic
chip mounter, if excessive force is applied to the cover of therelay when the relay is chucked or inserted, the cover may bedamaged, or the characteristics of the relay degraded. Keepthe force applied to the relay to within 1 kg.
- Avoid bending the pins to temporarily secure the relay to the
PC board. Bending the pins may degrade sealability or
adversely affect the internal mechanism.
- It is recommended to solder the relay onto a PC board
under the following conditions:<1> Reflow soldering
Refer to the recommended soldering temperature profile.
Please note that excessive heating beyond the specified
peak temperature or heating time will damage theairtightness.
<2> Flow soldering
Solder temperature:

260°C max., Time: 5 s max.

Preheating:110~ 120°C /110 s. (max.)

EM Devices recommends cooling down a printed circuitboard less than 110°C within 40 seconds after soldering.
<3> Manual soldering
Solder temperature:

350°C, Time: 3 s max.

Avoid immersing the relay in cleaning solvent
immediately after soldering due to the danger of thermal
shock being applied to the relay.
- Use an alcohol-based or water-based cleaning solvent.
Never use thinner and benzene because they may damage
the relay housing.
- Do not use ultrasonic cleaning because the vibration energy
generated by the ultrasonic waves may cause the contacts toremain closed.

5. Handling- Relays are packaged in magazine cases for shipment. If a
space is created in the case after some relays have been
removed, be sure to insert a stopper to secure the remaining
relays in the case. If relays are not well secured, vibration
during transportation may cause malfunctioning of thecontacts.
- Exercise care in handling the relay so as to avoid dropping it
or allowing it to fall. Do not use a relay that has been dropped.
If a relay drops from a workbench to the floor, a shock of
9,800 m/s2 (1,000 G) or more is applied to the relay, possibly
damaging its functions. Even if a light shock has been
applied to the relay, thoroughly evaluate its operation before
using it.
- Latching relays are factory-set to the reset state for shipment.
A latching relay may be set, however, by vibration or shock
applied while being transported. Be sure to forcibly reset therelay before using it in the application set. Also note that therelay may be set by unexpected vibration or shock when it isused in a portable set.

- The sealability of a surface mount type (SMT) relay may belost if the relay absorbs moisture and is then heated during
soldering. When storing relays, therefore, observe thefollowing points:<1> For standard packing(a). Pack state
Term:Less than 12 months after our shipment.
(Recommend using the product as soon
as possible.)

Conditions: <30 °C, <60% RH(b). Require bake before mounting, when relays not
used within the above (a) period or was stored
outside above (a) conditions.
Simple relay: Please dehumidify 85 ± 5 °C, 48
hours or more after transferring to aheat-resistant container.
Tape packing: Please dehumidify 50 ± 5 °C, 300
hours or more in reel condition.
Tube packaging should be baking on simple relays,
removed from tube.
Relays after baking should be mounted within 3 months
under the conditions in (a).
Standard packaging specification products do not meetwith the JEDEC standard's Moisture Sensitivity Level(MSL) because they are not MBB packaged. If MSL
compliance is required, use MBB packaging
specification products.
<2> For MBB packing(a). MBB state
Term:Less than 12 months after our shipment

Conditions: <30 °C, <60% RH(b). After opening of MBB
Term:Within the time limit indicated on thecaution label attached to MBB.

Conditions: <30 °C, <60% RH(c). Require bake before mounting, when relays not
used within the above (a) or (b) period or wasstored outside above conditions.
Simple relay: Please dehumidify 85 ± 5 °C, 48
hours or more after transferring to aheat-resistant container.
Tape packing: Please dehumidify 50 ± 5 °C, 300
hours or more in reel condition.
Please keep in mind that barrier
pack needs to remove in that case.
Relays after baking should be mounted within the time
limits according to MSL on the caution label under theconditions in (b).
The humidity indicator card included in MBB package
immediately after opening should also be used as abasis for judging baking procedures.

15●All specifications in this catalog and production status of products are subject to change without notice. Prior to the purchase, please contact EM Devices for updated product data.
●Please request for a specification sheet for detailed product data prior to the purchase.
●Before using the product in this catalog, please read "NOTES ON CORRECT USE" in the selection guide2023.12.1

EMDSD4VOL03E2312H

UA2/UB2 SERIESNo part of this document may be copied or reproduced in any form or by any means without the prior writtenconsent of EM Devices Corporation. EM Devices Corporation assumes no responsibility for any errors which
may appear in this document.
EM Devices Corporation does not assume any liability for infringement of patents, copyrights or otherintellectual property rights of third parties by or arising from use of a device described herein or any otherliability arising from use of such device. No license, either express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of EM Devices Corporation or others.
While EM Devices Corporation has been making continuous effort to enhance the reliability of its electronic
components, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to
persons or property arising from a defect in an EM Devices electronic component, customers must incorporate
sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features.
EM Devices' products are classified into the following three quality grades: "Standard", "Special", and "Specific".
The Specific quality grade applies only to devices developed based on a customer designated "quality
assurance program" for a specific application. The recommended applications of a device depend on its quality
grade, as indicated below. Customers must check the quality grade of each device before using it in a particularapplication. If customers intend to use EM Devices' products for applications other than those specified forStandard quality grade, they should contact an EM Devices sales representative in advance, as specifications
must be exchanged with EM Devices.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronicequipment and industrial robots
Special:Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disastersystems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)

Specific:

Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.

The quality grade of EM Devices' products is "Standard" unless otherwise specified in EM Devices' Data Sheets
or Data Books. EM Devices cannot guarantee the quality of our products if the product is used for applications
other than "Standard" applications without exchanging specifications with EM Devices, or if the product is used
for "Standard" applications under conditions or in environments not described in this document.
(Note)The information in this document is subject to change without notice. Please refer to the latest data sheet
when designing for mass production.

16●All specifications in this catalog and production status of products are subject to change without notice. Prior to the purchase, please contact EM Devices for updated product data.
●Please request for a specification sheet for detailed product data prior to the purchase.
●Before using the product in this catalog, please read "NOTES ON CORRECT USE" in the selection guide2023.12.1

EMDSD4VOL03E2312H