2020 IEEE 70th Electronic
Components andTechnology Conference(ECTC)

ECTC 2020
Table of Contents
Foreword
Welcome from ECTC Sponsoring Organization
Executive Committee
Program Committee
ECTC 2020 Special Sessions
ECTC 2019 Best of Conference Paper Awards
ECTC & EPS 2020 Awards
ECTC 2020 Major Non-IEEE Sponsors

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Session 1: Fan-Out Technologies for System Integration
InFO_SoW (System-on-Wafer) for High Performance Computing
Shu-Rong Chun (Taiwan Semiconductor Manufacturing Company), Tin-Hao
Kuo (Taiwan Semiconductor Manufacturing Company), Hao-Yi Tsai (Taiwan
Semiconductor Manufacturing Company), Chung-Shi Liu (Taiwan
Semiconductor Manufacturing Company), Chuei-Tang Wang (Taiwan
Semiconductor Manufacturing Company), Jeng-Shien Hsieh (Taiwan
Semiconductor Manufacturing Company), Tsung-Shu Lin (Taiwan
Semiconductor Manufacturing Company), Terry Ku (Taiwan Semiconductor
Manufacturing Company), and Douglas Yu (Taiwan Semiconductor
Manufacturing Company)

1

Fan-Out Wafer Level Packaging of GaN Components for RF Applications
Tanja Braun (Fraunhofer Institute for Reliability andMicrointegration), Thanh Duy Nguyen (Fraunhofer Institute for
Reliability and Microintegration), Steve Voges (Fraunhofer Institutefor Reliability and Microintegration), Markus Wöhrmann (Fraunhofer
Institute for Reliability and Microintegration), Robert Gernhardt(Fraunhofer Institute for Reliability and Microintegration),
Karl-Friedrich Becker (Fraunhofer Institute for Reliability andMicrointegration), Ivan Ndip (Fraunhofer Institute for Reliability andMicrointegration), Damian Freimund (Technical University Berlin),
Martin Schneider-Ramelow (Technical University Berlin), Klaus-Dieter
Lang (Technical University Berlin), Dirk Schwantuschke (Fraunhofer
Institute for Applied), Erdin Ture (Fraunhofer Institute for Applied),Michael Pretl (Rohde & Schwarz GmbH & Co.), and Sven Engels (Rohde &Schwarz GmbH & Co.)

7v

Scalable Chiplet Package using Fan-Out Embedded Bridge
Joe Lin (Siliconware Precision Industries Co., Ltd), C. Key Chung(Siliconware Precision Industries Co., Ltd), C. F. Lin (Siliconware
Precision Industries Co., Ltd), Ally Liao (Siliconware Precision
Industries Co., Ltd), Ying Ju Lu (Siliconware Precision Industries
Co., Ltd), Jia Shuang Chen (Siliconware Precision Industries Co.,Ltd), and Daniel Ng (Siliconware Precision Industries Co., Ltd)

14

Design, Process and Reliability of Face-Up 2-Layer Molded FOWLP Antenna-in-Package
Chai Tai Chong (A*STAR, Singapore), Lim Teck Guan (A*STAR, Singapore),
Han Yong (A*STAR, Singapore), F. X. Che (A*STAR, Singapore), David Ho
Soon Wee (A*STAR, Singapore), and Ser Choong Chong (A*STAR, Singapore)

19

Functional RDL of FOPLP by Using LTPS-TFT Technology for ESD Protection Application
Terry Wang (Industrial Technology Research Institute (ITRI)),
Hsin-Cheng Lai (Industrial Technology Research Institute (ITRI)),
Yu-Hua Chung (Industrial Technology Research Institute (ITRI)),
Chieh-Wei Feng (Industrial Technology Research Institute (ITRI)),
Liang-Cyuan Chang (Industrial Technology Research Institute (ITRI)),
Jui-Wen Yang (Industrial Technology Research Institute (ITRI)),
Tzu-Hao Yu (Industrial Technology Research Institute (ITRI)), Shao-An
Yan (Industrial Technology Research Institute (ITRI)), Yuh-Zheng Lee(Industrial Technology Research Institute (ITRI)), and Steve Chiu
(Industrial Technology Research Institute (ITRI))

25

Development of Embedded Glass Wafer Fan-Out Package with 2D Antenna Arrays for 77GHz
Millimeter-Wave Chip
Tian Yu (Xiamen Uninversity, China), Xiaodong Zhang (Xiamen Sky
Semiconductor, China), Li Chen (Xiamen University, China), Xiaoli Ren(Xiamen Sky Semiconductor, China), Zongming Duan (East China ResearchInstitute of Electronic Engineering, China), and Daquan Yu (Xiamen
University)
Flexible Fan-Out Wafer Level Packaging of Ultra-Thin Dies
Jean-Charles Souriau (Univ. Grenoble Alpes, CEA, LETI), Laëtitia
Castagné (Univ. Grenoble Alpes, CEA, LETI), Carine Ladner (Univ.
Grenoble Alpes, CEA, LETI), Rémi Franiatte (Univ. Grenoble Alpes, CEA,
LETI), and Jennifer Guillaume (Univ. Grenoble Alpes, CEA, LETI)

31

37

Session 2: Innovation on WLCSP and 3D Packaging
Extreme Wafer Thinning and Nano-TSV Processing for 3D Heterogeneous Integration
Anne Jourdain (IMEC), Filip Schleicher (IMEC), Joeri De Vos (IMEC),
Michele Stucchi (IMEC), Emmanuel Chery (IMEC), Andy Miller (IMEC),
Gerald Beyer (IMEC), Geert Van der Plas (IMEC), Edward Walsby (SPTS),
Kerry Roberts (SPTS), Huma Ashraf (SPTS), Dave Thomas (SPTS), and Eric
Beyne (IMEC)

42

Chemical Thinning Approach for High-Topography Glass Wafers
Messaoud Bedjaoui (Univ. Grenoble Alpes, CEA, LETI, DCOS Minatec
Campus), Jean Brun (Univ. Grenoble Alpes, CEA, LETI, DCOS Minatec
Campus), Steve Martin (Univ. Grenoble Alpes, CEA, LETI, DCOS Minatec
Campus), and Raphael Salot (Univ. Grenoble Alpes, CEA, LETI, DCOS
Minatec Campus)

49

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Material Optimization of Permanent and Temporary Adhesives for Wafer-Level
Three-Dimensional Integration
Naoko Araki (DAICEL Corp.), Shinji Maetani (DAICEL Corp.), YoungSuk
Kim (DISCO Corp.), Toshiaki Hirota (TAZMO Co. Ltd.), Tomoji Nakamura(Tokyo Institute of Technology), and Takayuki Ohba (Tokyo Institute ofTechnology)
Fabrication and Reliability Demonstration of 5µm Redistribution Layer Using Low-Stress
Dielectric Dry Film
Pratik Nimbalkar (Georgia Institute of Technology), Fuhan Liu (Georgia
Institute of Technology), Atom Watanabe (Georgia Institute ofTechnology), David Weyers (Georgia Institute of Technology),
Mohanalingam Kathaperumal (Georgia Institute of Technology), Cheng
Ping Lin (Panasonic Corporation, Japan), Fukuya Naohito (Panasonic
Corporation, Japan), Toshiyuki Makita (Panasonic Corporation, Japan),
Naoki Watanabe (Panasonic Industrial Devices Sales Company of America,USA), Atsushi Kubo (Tokyo Ohka Kogyo Co. Ltd., Japan), Madhavan
Swaminathan (Georgia Institute of Technology), and Rao Tummala(Georgia Institute of Technology)
A Novel Design of Temporary Bond Debond Adhesive Technology for Wafer-Level Assembly
Dingying Xu (Intel Corporation), Hsin-Wei Wang (Intel Corporation),
Jigneshkumar Patel (Intel Corporation), Xavier F. Brun (Intel
Corporation), Kosuke Hirota (Intel Corporation), Elliott Capsuto(Shin-Etsu MicroSi Corporation), Hideto Kato (Shin-Etsu Chemical), andMichihiro Sugo (Shin-Etsu Chemical)
Development of Self-Releasing Adhesive Tape as a Temporary Bonding Material for 3D
Integration
Taro Shiojima (SEKISUI CHEMICAL CO., LTD., Japan), Ryoichi Watanabe(SEKISUI CHEMICAL CO., LTD., Japan), Munehiro Hatai (SEKISUI CHEMICAL
CO., LTD., Japan), and Daihei Sugita (SEKISUI CHEMICAL CO., LTD.,
Japan)

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Novel Low Temperature Curable Photo-Patternable Low Dk/Df for Wafer Level Packaging (WLP)
83
Katherine Han (Kayaku Advanced Materials), Yasumasa Akatsuka (Nippon
Kayaku), Jenna Cordero (Kayaku Advanced Materials), Daniel Nawrocki(Kayaku Advanced Materials), and Shinya Inagaki (Nippon Kayaku)

Session 3: Antenna-in-Package for 5G and Radar Systems
Glass-Based IC-Embedded Antenna-Integrated Packages for 28-GHz High-Speed Data
Communications
Atom Watanabe (Georgia Institute of Technology), Muhammad Ali (Georgia
Institute of Technology), Rui Zhang (Georgia Institute of Technology),
Siddharth Ravichandran (Georgia Institute of Technology), Takenori
Kakutani (Taiyo Ink Mfg. Co., Ltd.), Raj Pulugurtha (Florida
International University), Rao Tummala (Georgia Institute ofTechnology), and Madhavan Swaminathan (Georgia Institute ofTechnology)

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3D Integrated Through Fused Silica Via (TFV) Based Array Antenna for mm Wave
Communications
Renuka Bowrothu (University of Florida), Haein Kim (University of
Florida), Yong Kyu Yoon (University of Florida), and Stephan Schmidt(LPKF Laser & Electronics North America)
A Novel Packaging and System-Integration Platform with Integrated Antennas for Scalable,
Low-Cost and High-Performance 5G mmWave Systems
Ivan Ndip (Fraunhofer IZM), Kristoffer Andersson (Ericsson), Stefan
Kosmider (Fraunhofer IZM), Thi Huyen Le (Fraunhofer IZM), Abhijeet
Kanitkar (Fraunhofer IZM), Marius van Dijk (Fraunhofer IZM), KavinSenthil Murugesan (Fraunhofer IZM), Uwe Maaß (Fraunhofer IZM), Thomas
Löher (Fraunhofer IZM), Marco Rossi (Fraunhofer IZM), Johannes
Jaeschke (Fraunhofer IZM), Andreas Ostmann (Fraunhofer IZM), Rolf
Aschenbrenner (Fraunhofer IZM), Martin Schneider-Ramelow (Fraunhofer
IZM), and Klaus-Dieter Lang (Fraunhofer IZM)High Performance mm-Wave MIMO Radar with Integrated Antenna-on-Package
Meysam Moallem (Texas Instruments), Zachary Crawford (Texas
Instruments), Ross Kulak (Texas Instruments), Marc Dewilde (Texas
Instruments), Cathy Chi (Texas Instruments), Athena Lin (Texas
Instruments), and Brian Ginsburg (Texas Instruments)
mmWave AiP Measurement Turnkey Solution in Millimeter-Wave Wireless Communication
Applications
Sheng Chi Hsieh (ASE Group), Fu-Cheng Chu (ASE Group), Cheng-Yu Ho(ASE Group), Wei-Yang Chen (ASE Group), and Chen-Chao Wang (ASE Group)
Imprint-Through Mold Via (i-TMV) with High Aspect Ratio and Narrow Pitch for Antenna inPackage
Xinrong Li (Hitachi Chemical Co., Ltd., Japan), Tsuyoshi Ogawa(Hitachi Chemical Co., Ltd., Japan), Tomoaki Shibata (Hitachi ChemicalCo., Ltd., Japan), Satoshi Yoneda (Hitachi Chemical Co., Ltd., Japan),
Naoya Suzuki (Hitachi Chemical Co., Ltd., Japan), and Toshihisa Nonaka(Hitachi Chemical Co., Ltd., Japan)

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108

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One-Dimensional Steerable End-Fire Orthogonal Beams for 5G Millimeter Wave Applications by
L-Shape Antenna Element Arrangement in Antenna-in-Packaging Design
126
Kuan-Hsun Wu (National Taiwan University), Zhao-He Lin (National
Taiwan University), Hsi-Tseng Chou (National Taiwan University),
Pin-Zhong Shen (National Taiwan University of Science and Technology),
Ding-Bing Lin (National Taiwan University of Science and Technology),
Li-Chih Fang (Powertech Technology Inc.), Ji-Cheng Lin (Powertech
Technology Inc.), Chao-Shun Yang (Powertech Technology Inc.),
Chieh-Wei Chou (Powertech Technology Inc.), Chi-Liang Pan (Powertech
Technology Inc.), and Chun-Te Lin (Powertech Technology Inc.)

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Session 4: Advanced Photonic Integration Packaging
Automated Assembly of High Port Count Silicon Photonic Switches
Nicolas Boyer (IBM Corporation), Fuad Doany (IBM T. J. Watson ResearchCenter, USA), Elaine Cyr (IBM Corporation), Christian W Baks (IBM T.
J. Watson Research Center, USA), Nicolas Dupuis (IBM T. J. Watson
Research Center, USA), Jonathan E. Proesel (IBM T. J. Watson ResearchCenter, USA), Herschel A. Ainspan (IBM T. J. Watson Research Center,
USA), Isabel De Sousa (IBM Corporation), and Benjamin G. Lee (IBM T.
J. Watson Research Center, USA)Electro-Optical Co-Integration of Chip-Components in Optical Transceivers for Optical
Inter-Chip Communication
Krzysztof Nieweglowski (Technische Universität Dresden), Lukas Lorenz(Technische Universität Dresden), Karlheinz Bock (Technische
Universität Dresden), Mircea Catuneanu (Technische Universität
Dresden), and Kambiz Jamshidi (Technische Universität Dresden)
Integrated Optical Single-Mode Waveguide Structures in Thin Glass for Flip-Chip PIC
Assembly
Julian Schwietering (Technical University of Berlin), Christian Herbst(Fraunhofer Institute for Reliability and Microintegration IZM),
Oliver Kirsch (Fraunhofer Institute for Reliability andMicrointegration IZM), Norbert Arndt-Staufenbiel (Fraunhofer Institutefor Reliability and Microintegration IZM), Philipp Wachholz(Fraunhofer Institute for Reliability and Microintegration IZM),
Henning Schroder (Fraunhofer Institute for Reliability andMicrointegration IZM), and Martin Schneider-Ramelow (Technical
University of Berlin)

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148

Multi-channel Single-Mode Polymer Waveguide Fabricated by the Mosquito Method Realizing
Low Connection Loss with Single-Mode Optical Fiber Arrays
156
Sho Yakabe (Keio University / Sumitomo Electric Industries, Ltd.),
Hitomi Matsui (Keio University), Yui Kobayashi (Keio University), andTakaaki Ishigure (Keio University)
Integrated Silicon Photonic True-Time Delay Beam-Former for Wide-Band Phased-Array Antenna
162
Stephen Anderson (Rensselaer Polytechnic Institute), Amir Begović(Rensselaer Polytechnic Institute), Alexander Chen (Rensselaer
Polytechnic Institute), Zhaoran Huang (Rensselaer Polytechnic
Institute), Guifu Sun (Army Research Laboratory), and Weimin Zhou
(Army Research Laboratory)
Hybrid Vanadate Silicon Nanophotonic Platform for Extreme Light Management at Telecom
Bands
Yusheng Bian (Globalfoundries), Ajey Jacob (Globalfoundries), Won Suk
Lee (Globalfoundries), Bo Peng (Globalfoundries.com), Michal Rakowski(Globalfoundries), Abdelsalam Aboketaf (Globalfoundries), and Rod
Augur (Globalfoundries)

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High-Brightness Displays Made with Micro-Transfer Printed Flip-Chip microLEDs
C. A. Bower (X Display Company), S. Bonafede (X Display Company), B.
Raymond (X Display Company), A. Pearson (X Display Company), C.
Prevatte (X Display Company), T. Weeks (X Display Company), E.
Radauscher (X Display Company), E. Vick (X Display Company), C.
Verreen (X Display Company), B. Krongard (X Display Company), and M.
A. Meitl (X Display Company)

175

Session 5: Advanced Bonding Methods and Processing
Low Temperature Direct Bonding of SiN and SiO Interfaces for Packaging Applications
Xavier F. Brun (Intel Corporation), Jürgen Burggraf (EV Group), Barb
Ruxandra-Aida (EV Group), and Christian Mühlstätter (EV Group)

182

Development of Multi-die Stacking with Cu-Cu Interconnects Using Gang Bonding Approach
Ser Choong Chong (Institute of Microelecronics), Ling Xie (Instituteof Microelectronics), Hongyu Li (Institute of Microelectronics), andSeow Huang Lim (Institute of Microelectronics)

188

Bond at the End: A Comprehensive Study of a New High-Throughput Bonding Process
Salwa Ben Jemaa (Université de Sherbrooke), Pascale Gagnon (IBM
Canada), Assane Dione (Université de Sherbrooke), Mamadou Kabirou
Touré (Université de Sherbrooke), Jean-Francois Morissette (Universitéde Sherbrooke), Papa Momar Souare (Université de Sherbrooke), andJulien Sylvestre (Université de Sherbrooke)

194

A Reliable Copper-Free Wafer Level Hybrid Bonding Technology for High-Performance Medical
Imaging Sensors
201
Amandine Jouve (CEA, LETI), E. Lagoutte (CEA, LETI), R. Crochemore(CEA, LETI), G. Mauguen (CEA, LETI), T. Flahaut (CEA, LETI), C.
Dubarry (CEA, LETI), V. Balan (CEA, LETI), F. Fournel (CEA, LETI), E.
Bourjot (CEA, LETI), F. Servant (CEA, LETI), M. Scannell (CEA, LETI),
K. Rohracher (ams AG, Austria), T. Bodner (ams AG, Austria), A. Faes
(ams AG, Austria), and J. Hofrichter (ams AG, Switzerland)
Nanotwinned Copper Hybrid Bonding and Wafer-on-Wafer Integration
Wei-Lan Chiu (Industrial Technology Research Institute (ITRI)),
Kai-Wei Chou (Industrial Technology Research Institute (ITRI)), andHsiang-Hung Chang (Industrial Technology Research Institute (ITRI))

210

Novel Cu/SiCN Surface Topography Control for 1 µm Pitch Hybrid Wafer-to-Wafer Bonding
Soon-Wook Kim (IMEC), Ferenc Fodor (IMEC), Nancy Heylen (IMEC), Serena
Iacovo (IMEC), Joeri De Vos (IMEC), Andy Miller (IMEC), Gerald Beyer(IMEC), and Eric Beyne (IMEC)216

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Formation of Smooth Au Surfaces Produced by Multiple Thin-Film Transfer Process Based on
Template Stripping for Low-Temperature Bonding
223
Eiji Higurashi (National Institute of Advanced Industrial Science andTechnology), Michitaka Yamamoto (National Institute of Advanced
Industrial Science and Technology), Ryutaro Nishimura (The Universityof Tokyo), Takashi Matsumae (National Institute of Advanced Industrial
Science and Technology), Yuichi Kurashima (National Institute ofAdvanced Industrial Science and Technology), Hideki Takagi (National
Institute of Advanced Industrial Science and Technology), Tadatomo
Suga (Meisei University), and Toshihiro Itoh (The University of Tokyo)

Session 6: Interconnect Modeling
Numerical Model for Understanding Failure Mechanism of Back End of Line (BEOL) in Bump
Shear
Wei Wang (Qualcomm Technologies, Inc.), Wei Zhao (Qualcomm
Technologies, Inc.), Mark Nakamoto (Qualcomm Technologies, Inc.), Mark
Schwarz (Qualcomm Technologies, Inc.), Dongming He (Qualcomm
Technologies, Inc.), Xuefeng Zhang (Qualcomm Technologies, Inc.), Lily
Zhao (Qualcomm Technologies, Inc.), and Ahmer Syed (Qualcomm
Technologies, Inc.)
Combined Peridynamic Theory and Kinetic Theory of Fracture for Solder Joint Fatigue Life
Prediction
E. Madenci (University of Arizona), Cagan Diyaroglu (University of
Arizona), Yanan Zhang (University of Arizona), Forest Baber (Virginia
Commonwealth University), and Ibrahim Guven (Virginia Commonwealth
University)
Board Level Reliability Enhancement with Considerations of Solder Ball, Substrate and PCB
Yangming Liu (Western Digital), Bo Yang (Western Digital), Shenghua
Huang (Western Digital), Ning Ye (Western Digital), Shrikar Bhagath(Western Digital), and Rama Shukla (Western Digital)

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249

Property-Performance Relationships for Sustained High Temperature Operation of Electronics
257
Pradeep Lall (Auburn University), Yunli Zhang (Auburn University),
Madhu Kasturi (Auburn University), Haotian Wu (Auburn University),
Edward Davis (Auburn University), and Jeff Suhling (Auburn University)
Investigation of Thermo-Mechanical and Phase-Change Behavior in the Sn/Cu Interconnects
During Self-Propagating Exothermic Reaction Bonding
269
Shuibao Liang (Loughborough University, UK), Yi Zhong (Loughborough
University, UK), Stuart Robertson (Loughborough University, UK), Allan
Liu (Loughborough University, UK), Zhaoxia Zhou (Loughborough
University, UK), and Changqing Liu (Loughborough University, UK)
Novel Piezoelectric Force Sensor Array for Investigation of Ultrasonic Wire Bonding
Matthias Arndt (Leibniz University Hannover), Yangyang Long (Leibniz
University Hannover), Folke Dencker (Leibniz University Hannover),Jannik Reimann (Leibniz University Hannover), Jens Twiefel (Leibniz
University Hannover), and Marc Christopher Wurz (Leibniz University
Hannover)xi

276

A Comprehensive Study of Electromigration in Lead-Free Solder Joint
Jiefeng Xu (Binghamton University), Chongyang Cai (Binghamton
University), Vanlai Pham (Binghamton University), Ke Pan (Binghamton
University), Huayan Wang (Binghamton University), and Seungbae Park
(Binghamton University)

284

Session 7: Advances in Packaging at the Wafer/Panel Level
A Production-Worthy Fan-Out Solution – ASE FOCoS Chip Last
Jan-Kuang Fang (Advanced Semiconductor Engineering Inc.), Min-Lung
Huang (Advanced Semiconductor Engineering Inc.), Hung-Jung Tu(Advanced Semiconductor Engineering Inc.), Wen-Long Lu (Advanced
Semiconductor Engineering Inc.), and Peng Yang (Advanced Semiconductor
Engineering Inc.)
Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding andLaser-Assisted Die Transfer.
Koen Kennes (IMEC), Alain Phommahaxay (IMEC), Alice Guerrero (Brewer
Science, Inc.), Olga Bauder (SUSS MicroTec Lithography GmbH), SamuelSuhard (IMEC), Pieter Bex (IMEC), Serena Iacovo (IMEC), Xiao Liu(Brewer Science, Inc.), Thomas Schmidt (SUSS MicroTec LithographyGmbH), Gerald Beyer (IMEC), and Eric Beyne (IMEC)A Study on the Mechanical Debonding Process through Static-Elastic Stress Analysis for 3-D
Wafer Level Packages (WLPs)
Hyeong-Gi Lee (Samsung Electronics Co., Ltd, Republic of Korea),
Dae-Sung Kim (Samsung Electronics Co., Ltd, Republic of Korea),Jung-Hyun Cho (Samsung Electronics Co., Ltd, Republic of Korea),Jung-Hyuk Lee (Samsung Electronics Co., Ltd, Republic of Korea),
Jae-Yong Park (Samsung Electronics Co., Ltd, Republic of Korea),
Min-Ho Kim (Samsung Electronics Co., Ltd, Republic of Korea), and
Jae-Wook Lee (Samsung Electronics Co., Ltd, Republic of Korea)
Study of Submicron Patterning Exposure Tool for Fine 500 mm Panel Size FOPLP
Ken-ichiro Mori (Canon Inc.), Douglas Shelton (Canon Inc.), Yoshio
Goto (Canon Inc.), Hiromi Suda (Canon Inc.), Hiroyuki Wada (Canon
Inc.), Hideo Tanaka (Canon Inc.), and Seiya Miura (Canon Inc.)
Photolithography Solution that Overcomes Significant Die Placement Error for Advanced
PackagingTong Yang (Onto Innovation) and Zhiyang Li (Onto Innovation)
Better Thermal, Mechanical and Dielectric Properties of Cured Polyimides Using Low
Pressure Vacuum Cure Processing
Zia Karim (Yield Engineering Systems), Melvin Zussman (Hitachi
Chemical Dupont MicroSystems, USA), Kenneth Sautter (Yield Engineering
Systems), Kay Song (Yield Engineering Systems), Ron Legario (Hitachi
Chemical Dupont MicroSystems, USA), Charudatta Galande (Yield
Engineering Systems), Sung Yeon Lee (Yield Engineering Systems), andKaushal Singh (Yield Engineering Systems)
Advanced Packaging Cost Reduction by Selective Copper Metallization
Rashid Mavliev (Ipgrip Inc.), Knut Gottfried (Fraunhofer ENAS), andRobert Rhoades (Revasum Inc.)

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296

303

309

315

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327

Session 8: High-Density RDL for Advanced Interconnects
Hybrid Fan-out Package for Vertical Heterogeneous Integration
Po-Yao Chuang (Taiwan Semiconductor Manufacturing Company Ltd.), M.-L.
Lin (Taiwan Semiconductor Manufacturing Company Ltd.), S.-T. Hung
(Taiwan Semiconductor Manufacturing Company Ltd.), Y.-W. Wu (Taiwan
Semiconductor Manufacturing Company Ltd.), D.-C. Wong (Taiwan
Semiconductor Manufacturing Company Ltd.), M.-C. Yew (Taiwan
Semiconductor Manufacturing Company Ltd.), C.-K. Hsu (Taiwan
Semiconductor Manufacturing Company Ltd.), L.-L Liao (Taiwan
Semiconductor Manufacturing Company Ltd.), P.-Y. Lai (Taiwan
Semiconductor Manufacturing Company Ltd.), P.-H. Tsai (Taiwan
Semiconductor Manufacturing Company Ltd.), S.-M. Chen (Taiwan
Semiconductor Manufacturing Company Ltd.), S.-K. Cheng (Taiwan
Semiconductor Manufacturing Company Ltd.), and Shin-Puu Jeng (Taiwan
Semiconductor Manufacturing Company Ltd.)333

Fan-Out RDL-First Panel-Level Packaging for Heterogeneous Integration
John H. Lau (Unimicron Technology Corporation), Cheng-Ta Ko (Unimicron
Technology Corporation), Kai-Ming Yang (Unimicron Technology
Corporation), Chia-Yu Peng (Unimicron Technology Corporation), Tim Xia(Unimicron Technology Corporation), Puru Bruce Lin (Unimicron
Technology Corporation), JJ Chen (Unimicron Technology Corporation),
Po-Chun Huang (Unimicron Technology Corporation), Hsing Ning Liu(Unimicron Technology Corporation), and Tzvy-Jang Tseng (Unimicron
Technology Corporation)

339

Effect of Dielectric Process on the Interfacial Adhesion of RDL for FOWLP
Kirak Son (Andong National University), Gahui Kim (Andong National
University), Hyun-Kyu Ryu (SK Hynix Inc.), and Young-Bae Park (Andong
National University)

348

A Comparative Study of 2.5D and Fan-Out Chip on Substrate: Chip First and Chip Last
Wei-Hong Lai (Advanced Semiconductor Engineering, Inc.), Penny Yang
(Advanced Semiconductor Engineering, Inc.), Ian Hu (Advanced
Semiconductor Engineering, Inc.), Tse-Wei Liao (Advanced Semiconductor
Engineering, Inc.), Karen Yu Chen (Advanced Semiconductor Engineering,Inc.), David Tarng (Advanced Semiconductor Engineering, Inc.), and CP
Hung (Advanced Semiconductor Engineering, Inc.)

354

Electromigration Failure Study of a Fine-Pitch 2µm/2µm L/S Cu Redistribution Line Embedded
in Polyimide for Advanced High-Density Fan-Out Packaging
361
Chien-Lung Liang (National Cheng Kung University, Taiwan), Yung-Sheng
Lin (Advanced Semiconductor Engineering, Inc.), Chin-Li Kao (Advanced
Semiconductor Engineering, Inc.), David Tarng (Advanced Semiconductor
Engineering, Inc.), Shan-Bo Wang (Advanced Semiconductor Engineering,Inc.), Yun-Ching Hung (Advanced Semiconductor Engineering, Inc.), andKwang-Lung Lin (National Cheng Kung University, Taiwan)

xiii

Versatile Electrochemical Plating Process Development for Heterogeneous WLP Structure
Jianwen Han (MacDermid Alpha Electronic Solutions), Stephan Braye(MacDermid Alpha Electronic Solutions), Pingping Ye (MacDermid AlphaElectronic Solutions), David Shaffer (MacDermid Alpha Electronic
Solutions), Kyle Whitten (MacDermid Alpha Electronic Solutions),
Thomas Richardson (MacDermid Alpha Electronic Solutions), and Elie
Najjar (MacDermid Alpha Electronic Solutions)

367

Molded Interconnect Substrate (MIS) Technology for Semiconductor Packages
Michael M. Liu (JCET Group)

374

Session 9: Power Delivery and Conversion
Design and Analysis of Logic-HBM2E Power Delivery System on CoWoS® Platform with Deep
Trench Capacitor
380
Wei-Ting Chen (Taiwan Semiconductor Manufacturing Company, Ltd.),
Chia-Chia Lin (Taiwan Semiconductor Manufacturing Company, Ltd.),
Chung-Hao Tsai (Taiwan Semiconductor Manufacturing Company, Ltd.),
Harry Hsia (Taiwan Semiconductor Manufacturing Company, Ltd.),
Kuo-Chiang Ting (Taiwan Semiconductor Manufacturing Company, Ltd.),
Shang-Yun Hou (Taiwan Semiconductor Manufacturing Company, Ltd.),
Chuei-Tang Wang (Taiwan Semiconductor Manufacturing Company, Ltd.),and Douglas Yu (Taiwan Semiconductor Manufacturing Company, Ltd.)
Performance Improvement for FPGA due to Interposer Metal Insulator Metal Decoupling
Capacitors (MIMCAP)
Myongseob Kim (Xilinx, Inc.), Henley Liu (Xilinx, Inc.), Dima Klokotov(Xilinx, Inc.), Anna Wong (Xilinx, Inc.), Thomas To (Xilinx, Inc.),
and Jonathan Chang (Xilinx, Inc.)
Three-Dimensional Capacitor Embedded in Fully Cu-Filled Through-Silicon Via and Its
Thermo-Mechanical Reliability for Power Delivery Applications
Ye Lin (Nanyang Technological University), Anak Agung Alit Apriyana(Nanyang Technological University), Hong Yu Li (Agency for Science,
Technology and Research (A*STAR)), and Chuan Seng Tan (Nanyang
Technological University)
Magnetic Inductor Arrays for Intel® Fully Integrated Voltage Regulator (FIVR) on 10th
Generation Intel® Core™ SoCs
Malavarayan Sankarasubramanian (Intel Corporation), Kaladhar
Radhakrishnan (Intel Corporation), Yongki Min (Intel Corporation),
William J. Lambert (Intel Corporation), Michael J. Hill (Intel
Corporation), Ashay Dani (Intel Corporation), Ryan Mesch (Intel
Corporation), Leigh Wojewoda (Intel Corporation), Jose Chavarria(Intel Corporation), and Anne Augustine (Intel Corporation)

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393

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Design and Demonstration of Single and Coupled Embedded Toroidal Inductors for 48V to 1V
Integrated Voltage Regulators
405
Claudio Alvarez Barros (Georgia Institute of Technology), Suresh
Srinidhi (Georgia Institute of Technologi), Madhavan Swaminathan(Georgia Institute of Technology), Rao Tummala (Georgia Institute ofTechnology), Daisuke Sasak (Panasonic Corporation), Kazuki Watanabe(Panasonic Corporation), Ryo Nagatsuka (Panasonic Corporation), Cheng
Ping Lin (Panasonic Corporation), Tatsuyoshi Wada (Panasonic
Corporation), and Naoki Watanabe (Panasonic Industrial Devices Sales
Company of America)
Ultra Low Profile Thin Film Capacitor for High Performance Electronic Packages
Kenichi Yoshida (TDK Corporation, Japan), Hitoshi Saita (TDKCorporation, Japan), and Takashi Kariya (TDK Corporation, Japan)
Co-Optimization of PDN Design for Tri-Cluster Multiple CPU Cores of SOC with Various
Decoupling Capacitors Integrated in Small Form-Factor Package
Jisoo Hwang (Samsung Electronics Co. Ltd.), Heejung Choi (Samsung
Electronics Co. Ltd.), Heeseok Lee (Samsung Electronics Co. Ltd.),
James Jeong (Samsung Electronics Co. Ltd.), Yohan Kwon (Samsung
Electronics Co. Ltd.), Jegil Moon (Samsung Electronics Co. Ltd.),
Kyoungsoo Kim (Samsung Electronics Co. Ltd.), Junghwa Kim (Samsung
Electronics Co. Ltd.), Hoi-Jin Lee (Samsung Electronics Co. Ltd.), andYoungmin Shin (Samsung Electronics Co. Ltd.)

414

419

Session 10: MEMS and Sensors
Hybrid Package for high Performance Inertial Measurement Units
Marco Del Sarto (STMicroelectronics), Alex Gritti(STMicroelectronics), Douglas Lodgson (STMicroelectronics), David
Cheng (STMicroelectronics), Nicolo' Manca (STMicroelectronics),
Roseanne Duca (STMicroelectronics), Tom Quoc Lao (STMicroelectronics),
and YiYi Ma (STMicroelectronics)
Cap Fabrication and Transfer Bonding Technology for Hermetic and Quasi Hermetic Wafer
Level MEMS Packaging
Kai Zoschke (Fraunhofer IZM), Piotr Mackowiak (Fraunhofer Institutefor Reliability and Microintegration (IZM)), Kevin Kröhnert(Fraunhofer Institute for Reliability and Microintegration (IZM)),
Hermann Oppermann (Fraunhofer Institute for Reliability andMicrointegration (IZM)), Nils Jürgensen (Fraunhofer Institute for
Reliability and Microintegration (IZM)), Matthias Wietstruck (IHP –Leibniz Institut für Innovative Mikroelektronik), Alexander Göritz
(IHP – Leibniz Institut für Innovative Mikroelektronik), Selin Tolunay
Wipf (IHP – Leibniz Institut für Innovative Mikroelektronik), Mehmet
Kaynak (IHP – Leibniz Institut für Innovative Mikroelektronik), andKlaus-Dieter Lang (Technical University of Berlin)
Giant Magneto-Resistive Effect Based Sensor on Laser Direct Structured MID Substrates
Eike Christian Fischer (Leibniz University Hannover), SebastianBengsch (Leibniz University Hannover), Sascha de Wall (Leibniz
University Hannover), and Marc Christopher Wurz (Leibniz University
Hannover)

xv

425

432

439

Low-Temperature Metallic Joints for Strain-Sensing Sensor Dies
Markus Feisst (University of Freiburg - IMTEK), Joscha Hoffmann(University of Freiburg - IMTEK), and Juergen Wilde (University ofFreiburg - IMTEK)

445

Fan-Out Ultrasound Transducer Array in Substrate
Yao Lu (Institute of Microelectronics of Chinese Academy of Sciences,
China; National Center for Advanced Packaging, China; University ofChinese Academy of Sciences, China) and Lixi Wan (Institute ofMicroelectronics of Chinese Academy of Sciences, China; University ofChinese Academy of Sciences, China)

451

Development and Reliability Study of 3D WLCSP for Automotive CMOS Image Sensor using TSV
Technology
461
Shuying Ma (HuaTian Technology (Kunshan) Electronics Co., Ltd.), Yi
Liu (HuaTian Technology (Kunshan) Electronics Co., Ltd.), Fengxia
Zheng (HuaTian Technology (Kunshan) Electronics Co., Ltd.), Feng Li(HuaTian Technology (Kunshan) Electronics Co., Ltd.), Daquan Yu(Xiamen University), Aimo Xiao (HuaTian Technology (Kunshan)
Electronics Co., Ltd.), and Xiaobing Yang (HuaTian Technology(Kunshan) Electronics Co., Ltd.)Long-Term Encapsulation of Platinum Metallization Using a HfO2 ALD - PDMS Bilayer for
Non-Hermetic Active Implants
Kambiz Nanbakhsh (Delft University of Technology), Riina Ritasalo(Picosun Oy), Wouter A. Serdijn (Delft University of Technology), andVasiliki Giagka (Fraunhofer Institute for Reliability andMicrointragration IZM and Delft University of Technology)

467

Session 11: Reliability of Next-Generation Interconnects
Electromigration Induced Interfacial Microstructure Evolution of Solder Joints inElectronic Packaging
Pilin Liu (Intel Corporation), Alan Overson (Intel Corporation), andDeepak Goyal (Intel Corporation)
Electromigration in 2 µm Redistribution Lines and Cu-Cu Bonds with Highly <111>-Oriented
Nanotwinned Cu
I-Hsin Tseng (National Chiao Tung University), Kai-Cheng Shie(National Chiao Tung University), Benson Tzu-Hung Lin (MediaTek Inc),
Chia-Cheng Chang (MediaTek Inc), and Chih Chen (National Chiao Tung
University)
Effect of Intermetallic Morphology Evolution on Void Formation in Ni/Sn/Ni Micro Joints
Sanoop Thekkut (Binghamton University), Ronit Das (Binghamton
University), Michael Njuki (Binghamton University), Jiaxin Li(Binghamton University), Rajesh Sharma Sivasubramony (Binghamton
University), Firas W Alshatnawi (Binghamton University), Marleen M
Moise (Binghamton University), Christopher M Greene (Binghamton
University), Nikolay G Dimitrov (Binghamton University), Peter
Borgesen (Binghamton University), Ninad Shahane (Texas InstrumentsInc.), Patrick Thompson (Texas Instruments Inc.), and Kabir Mirpuri(NXP Semiconductors N.V.)

xvi

473

479

485

Investigation and Comparison of Aging Effects in SAC+X Solders Exposed to High
Temperatures
Jing Wu (Auburn University), Mohammad S. Alam (Auburn University), KM
Rafidh Hassan (Auburn University), Jeffrey C. Suhling (Auburn
University), and Pradeep Lall (Auburn University)
Corrosion of Copper Wire Bonded Packages by Chlorine Containing Foreign Particles
Varughese Mathew (NXP Semiconductors), Enakshi Wikramanayake (The
University of Texas at Austin), and Sheila Chopin (NXP Semiconductors)
Thermal Aging Reliability of Socketable, Surface-Modified Solder BGAs with and without
Polymer Collars
Omkar Gupte (Georgia Institute of Technology), Gregorio Murtagian(Intel Corporation), Rao Tummala (Georgia Institute of Technology),
and Vanessa Smet (Georgia Institute of Technology)

492

504

512

Key Takeaways and Relevance of Extrinsic Corrosion Mechanisms During Extended Biased HAST
518
Amar Mavinkurve (NXP Semiconductors), K. Kasuriya (NXP
Semiconductors), R.T.H. Rongen (NXP Semiconductors), P. Jirachutiroj(NXP Semiconductors), N. Tappetch (NXP Semiconductors), J. Gülpen (NXP
Semiconductors), and M. van Soestbergen (NXP Semiconductors)

Session 12: Modeling for Heterogeneous Integration: From Wafer
to Board Level
A Novel Warpage Reinforcement Architecture with RDL Interposer for Heterogeneous
Integrated Packages
Chia-Yu Peng (Unimicron Technology Corporation), Puru Bruce Lin(Unimicron Technology Corporation), Cheng-Ta Ko (Unimicron Technology
Corporation), Chi-Wei Wang (National Tsing Hua University), Oscar
Chuang (National Tsing Hua University), and Chang-Chun Lee (National
Tsing Hua University)
Mechanical Deformation Study of Flexible Leadset Components for ElectromechanicalReliability of Wearable Electrocardiogram Sensors
Benjamin G. Stewart (Georgia Institute of Technology), Gabriel Cahn
(Georgia Institute of Technology), David Samet (Georgia Institute ofTechnology), Matthew J. Misner (GE Healthcare), Andrew Burns (GEHealthcare), Darshana L. Weerawarne (Binghamton University), Carol
Lapinski (Dupont Electronic Materials), Shannon Dugan (Dupon
Electronic Materials), Mark D. Poliks (Binghamton University), Azar
Alizadeh (GE Healthcare), Olivier Pierron (Georgia Institute ofTechnology), Antonia Antoniou (Georgia Institute of Technology),
Samuel Graham (Georgia Institute of Technology), and Suresh K.
Sitaraman (Georgia Institute of Technology)
Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using
Face-to-Face Wafer Bonding Technology
Rahul Mathur (Arm Inc, The University of Texas at Austin), Chien-Ju
Chao (Arm Inc), Rossana Liu (Arm Inc), Nikhil Tadepalli (Arm Inc),
Pranavi Chandupatla (Arm Inc), Shawn Hung (Arm Inc), Xiaoqing Xu (ArmInc), Saurabh Sinha (Arm Inc), and Jaydeep Kulkarni (The University ofTexas at Austin)

xvii

526

532

541

Thermal, Mechanical and Reliability Assessment of Hybrid Bonded Wafers, Bonded at 2.5µm
Pitch
548
Vladimir Cherman (IMEC), S. Van Huylenbroeck (IMEC), M. Lofrano(IMEC), X. Chang (IMEC), H. Oprins (IMEC), M. Gonzalez (IMEC), G. Van
der Plas (IMEC), G. Beyer (IMEC), K.J. Rebibis (IMEC), and E. Beyne(IMEC)A Numerical Technique to Evaluate Warpage Behavior of Double Sided Rigid-Flex Board
Assemblies During Reflow Soldering Process
Chun-Sean Lau (Western Digital Corporation), Ning Ye (Western Digital
Corporation), Yi Chun Tan (Western Digital Corporation), and Choon
Kuai Lee (Western Digital Corporation)

554

Thermomechanical Deformations of Power Modules with Sintered Metal Buffer Layers Under
Consideration of the Operating Time and Conditions
561
Alexander Schiffmacher (IMTEK - University of Freiburg), Carsten
Kempiak (IESY - Otto-von Guericke-University), Andreas Lindemann (IESY- Otto-von Guericke-University), Jacek Rudzki (Danfoss Silicon PowerGmbH), Frank Osterwald (Danfoss Silicon Power GmbH), and Juergen Wilde(IMTEK - University of Freiburg)
Bonding Integrity Enhancement in Wafer to Wafer Fine Pitch Hybrid Bonding by Advanced
Numerical Modelling
Lin Ji (Institute of Microelectronics A*STAR), Fa Xing Che (Instituteof Microelectronics A*STAR), Hong Miao Ji (Institute ofMicroelectronics A*STAR), Hong Yu Li (Institute of Microelectronics
A*STAR), and Masaya Kawano (Institute of Microelectronics A*STAR)

568

Session 13: 2.5D and 3D Technology Enabling High Performance
ComputingUltra High Density SoIC with Sub-Micron Bond Pitch
Yi-Hsiu Chen (Taiwan Semiconductor Manufacturing Company, Ltd.),
Chun-An Yang (Taiwan Semiconductor Manufacturing Company, Ltd.),
Chun-Chiang Kuo (Taiwan Semiconductor Manufacturing Company, Ltd.),
Ming-Fa Chen (Taiwan Semiconductor Manufacturing Company, Ltd.),
Chih-Hang Tung (Taiwan Semiconductor Manufacturing Company, Ltd.),
Wen-Chih Chiou (Taiwan Semiconductor Manufacturing Company, Ltd.), andDouglas Yu (Taiwan Semiconductor Manufacturing Company, Ltd.)

576

Waferscale S-MCM for High Performance Computing
Rabindra N. Das (MIT Lincoln Laboratory), Vladimir Bolkhovsky (MIT
Lincoln Laboratory), Alex Wynn (MIT Lincoln Laboratory), Ravi Rastogi(MIT Lincoln Laboratory), Scott Zarr (MIT Lincoln Laboratory), Dmitri
Shapiro (MIT Lincoln Laboratory), Manuel Docanto (MIT Lincoln
Laboratory), Leonard M. Johnson (MIT Lincoln Laboratory), and Eric A.
Dauller (MIT Lincoln Laboratory)

582

Die to Wafer Stacking with Low Temperature Hybrid Bonding
Guilian Gao (Invensas Xperi Corporation), Laura Mirkarimi (Xperi
Corporation), Gill Fountain (Xperi Corporation), Thomas Workman (Xperi
Corporation), Jeremy Theil (Xperi Corporation), Gabe Guevara (Xperi
Corporation), Cyprian Uzoh (Xperi Corporation), Dominik Suwito (Xperi
Corporation), Bongsub Lee (Xperi Corporation), KM Bang (Xperi
Corporation), and Rajesh Katkar (Xperi Corporation)

589

xviii

Face to Face Hybrid Wafer Bonding for Fine Pitch Applications
Daniel Fisher (GLOBALFOUNDRIES, Inc.), Sarah Knickerbocker(GLOBALFOUNDRIES, Inc.), Daniel Smith (GLOBALFOUNDRIES, Inc.), RobertKatz (GLOBALFOUNDRIES, Inc.), John Garant (GLOBALFOUNDRIES, Inc.),
Jorge Lubguban (GLOBALFOUNDRIES, Inc.), Vilmarie Soler(GLOBALFOUNDRIES, Inc.), and Norman Robson (GLOBALFOUNDRIES, Inc.)

595

High Frequency Characteristics of Glass Interposer
Masaya Tanaka (Dai Nippon Printing), Satoru Kuramochi (Dai Nippon
Printing), Takahiro Tai (Dai Nippon Printing), Yoichiro Sato (AGC),
and Nobutaka Kidera (AGC)601

A 2-Tier Embedded 3D Capacitor with High Aspect Ratio TSVKing-Jien Chui (Institute of Microelectronics A*STAR), I-Ting Wang
(Institute of Microelectronics A*STAR), Faxing Che (Institute ofMicroelectronics A*STAR), Zhixian Chen (Institute of Microelectronics
A*STAR), Xiang Yu Wang (Institute of Microelectronics A*STAR), Woon
Leng Loh (Institute of Microelectronics A*STAR), Qin Ren (Institute ofMicroelectronics A*STAR), Lin Ji (Institute of Microelectronics
A*STAR), and Yao Zhu (Institute of Microelectronics A*STAR)611

10 and 7 µm Pitch Thermo-Compression Solder Joint, Using a Novel Solder Pillar and Metal
Spacer Process
Jaber Derakhshandeh (IMEC), Giovanni Capuz (IMEC), Vladimir Cherman(IMEC), Fumihiro Inoue (IMEC), Inge De Preter (IMEC), Lin Hou (IMEC),
Pieter Bex (IMEC), Carine Gerets (IMEC), Tomas Webers (IMEC), Julien
Bertheau (IMEC), Stefaan Van Huylenbroeck (IMEC), Fabrice Duval(IMEC), Alain Phommahaxay (IMEC), Ehsan Shafahian (IMEC), Geert Van
der Plas (IMEC), Eric Beyne (IMEC), Andy Miller (IMEC), and Gerald
Beyer (IMEC)

617

Session 14: Materials for High-Speed/Frequency and 5G
High Aspect Ratio, High Resolution, and Broad Process Window Description of a Low Loss
Photodielectric for 5G HS/HF Applications Using High and Low Numerical Aperture
Photolithography Tools
Colin Hayes (DuPont), Kevin Wang (DuPont), Rosemary Bell (DuPont),
Colin Calabrese (DuPont), Michael Gallagher (DuPont), Kirk Thompson(DuPont), Robert Barr (DuPont), Keith Best (OntoInnovation), Corey
Shay (OntoInnovation), and Christian Ayala (OntoInnovation)
Active Antenna Subsystem Integration of Steerable Boresight Radiation Beams for 5G
Millimeter Wave Applications by System-in-Packaging Process
Pin-Zhong Shen (National Taiwan University of Science and Technology,
Taiwan), Zhao-He Lin (National Taiwan University, Taiwan), Hsi-Tseng
Chou (National Taiwan University, Taiwan), Kuan-Hsun Wu (National
Taiwan University, Taiwan), Ding-Bing Lin (National Taiwan Universityof Science and Technology, Taiwan), Li-Chih Fang (Powertech TechnologyInc.), Chao-Shun Yang (Powertech Technology Inc.), Chieh-Wei Chou
(Powertech Technology Inc.), Chi-Liang Pan (Powertech TechnologyInc.), Chun-Te Lin (Powertech Technology Inc.), and Ji-Cheng Lin(Powertech Technology Inc.)

xix

623

629

Low Permittivity and Dielectric Loss Polyimide with Patternability for High Frequency
Applications
Hitoshi Araki (Toray Industries, Inc.), Yohei Kiuchi (Toray
Industries, Inc.), Akira Shimada (Toray Industries, Inc.), Hisashi
Ogasawara (Toray Industries, Inc.), Masaya Jukei (Toray Industries,Inc.), and Masao Tomikawa (Toray Industries, Inc.)
Development of New Dielectric Material to Reduce Transmission Loss
Isao Nishimura (JSR Corporation), Shintarou Fujitomi (JSR
Corporation), Yuutoku Yamashita (JSR Corporation), Naoyuki Kawashima(JSR Corporation), and Nobuyuki Miyaki (JSR Corporation)

635

641

Evaluation of Package-Level EMI Shielding using Conformally Coated Conductive and Magnetic
Materials in Low and High Frequency Ranges
647
Kisu Joo (Ntrium Inc), Kyu Jae Lee (Ntrium Inc), Hyun Jun Sung (NtriumInc), Seung Jae Lee (Ntrium Inc), Se Young Jeong (Ntrium Inc), Hyun Ho
Park (The University of Suwon), and Yoon-Hyun Kim (Ntrium Inc)
Advanced Low Loss Dielectric Material Reliability and Filter Characteristics at HighFrequency for mmWave Applications
Takenori Kakutani (Taiyo Ink Mfg. Co., Ltd.), Daichi Okamoto (Taiyo
Ink Mfg. Co., Ltd.), Zhong Guan (Taiyo Ink Mfg. Co., Ltd.), Yuya
Suzuki (Taiyo Ink Mfg. Co., Ltd.), Muhammad Ali (Georgia Institute ofTechnology), Atom Watanabe (Georgia Institute of Technology),
Mohanalingam Kathaperumal (Georgia Institute of Technology), andMadhavan Swaminathan (Georgia Institute of Technology)
W-Band and D-Band Transmission Lines on Glass Based Substrates for Sub-THz Modules
Mutee ur Rehman (Georgia Institute of Technology), SiddharthRavichandran (Georgia Institute of Technology), Serhat Erdogan(Georgia Institute of Technology), and Madhavan Swaminathan (Georgia
Institute of Technology)

653

660

Session 15: Flexible and Printed Electronics
Direct Printing of Antennas on Large 3D Printed Plastic Structures
Vincens Gjokaj (Michigan State University), Cameron Crump (Michigan
State University), Brian Wright (Michigan State University), andPremjeet Chahal (Michigan State University)
Remateable and Deformable Area-Array Interconnects in 3D Smart Wireless Sensor Packages
671
Jose F Solis Camara (Florida International University), Sepehr
Soroushiani (Florida International University), Daniel Wilding(Florida International University), Sk Yeahia Been Sayeed (Florida
International University), Md Monirojjaman Monshi (Florida
International University), John L Volakis (Florida International
University), Shubhendu Bhardwa (Florida International University), andMarkondeyaraj Pulugurtha (Florida International University)

xx

666

A Heterogeneously Integrated, High Resolution and Flexible Inorganic muLED Display using
Fan-Out Wafer-Level Packaging
Goutham Ezhilarasu (University of California, Los Angeles), Ajit
Paranjpe (Veeco Instruments Inc.), Jay Lee (DISCO Corporation), FrankWei (DISCO Hi-Tec America, Inc.), and Subramanian S. Iyer (Universityof California, Los Angeles)
Graphene-Based Sensing Skins Manufactured by Scalable and Controllable AssemblyLong Wang (University of California, San Diego), Rui Kou (Universityof California, San Diego), and Ying Zhong (University of South
Florida)Effect of Ni(P) Thickness of Ultrathin ENEPIG on the Interfacial Reaction and Board Level
Reliability of Solder Joints
Yibo Wang (Shanghai Jiao Tong University), Hongfa Pan (Shanghai Jiao
Tong University), Charles Nan-Cheng Chen (Shanghai Jiao Tong
University), Ming Li (Shanghai Jiao Tong University), and Liming Gao(Shanghai Jiao Tong University)

677

685

690

Interposing of Microelectronics by Micro Transfer Printing to Create 3-D Structures
Kevin Oswalt (X-Celeprint Inc.), James Thostenson (X-Celeprint Inc.),
Tanya Moore (X-Celeprint Inc.), David Gomez (X-Celeprint Inc.), Carl
Prevatte (X-Display Co.), Matthew Meitl (X-Display Co.), Salvatore
Bonafede (X-Display Co.), Julia Roe (X-Celeprint Inc.), Ron Cok(X-Celeprint Inc.), and Christopher Bower (X-Display Co.)

696

Heterogenous Bump Metallurgy Through a Sequential Plating Based Process
Abderrahim Amrani (Université de Sherbrooke), Etienne Paradis(Université de Sherbrooke), David Danovitch (Université deSherbrooke), and Dominique Drouin (Université de Sherbrooke)

702

Session 16: Sintering and Interconnect Reliability
Microstructure Evolution and Acceleration Factor (AF) of Micro-Bumps inthrough-Silicon-Via (TSV) in High Temperature Storage (HTS) Conditions
Yoosun Kim (SK Hynix), Joowan Hong (SK Hynix), Yeonji Park (SK Hynix),
Sungho Hyun (SK Hynix), Minsoo Park (SK Hynix), Jaehyun Son (SKHynix), Gyujei Lee (SK Hynix), Hoyoung Son (SK Hynix), Namseok Kim (SKHynix), and Jin-Wook Jang (SK Hynix)
Electro-Migration Evaluation between Organic Interposer and Build-Up Substrate on 2.3D
Organic Package
Kei Murayama (Shinko Electric Industries Co., Ltd.), Shota Miki
(Shinko Electric Industries Co., Ltd.), Hiromi Sugahara (Shinko
Electric Industries Co., Ltd.), and Kiyoshi Oi (Shinko ElectricIndustries Co., Ltd.)
Study of Electromigration Failure in Solder Interconnects Under Low Frequency Pulsed
Direct Current Condition
Yi Ram Kim (University of Texas at Arlington), Allison T. Osmanson(University of Texas at Arlington), Hossein Madanipour (University ofTexas at Arlington), Choong-Un Kim (University of Texas at Arlington),
Patrick F. Thompson (Texas Instruments, Inc.), and Qiao Chen (Texas
Instruments, Inc.)

xxi

710

716

723

Low Temperature Au-Au Bonding Using Ag Nanoparticles as Intermediate
Jun-Peng Fang (Tsinghua University), Jian Cai (Tsinghua University),
Qian Wang (Tsinghua University), and Zhi-Ting Geng (Tsinghua
University)

729

Nickel Dependence of Hydrogen co-Deposition and Nanoporosity in Electrolessly Deposited
Cu-Films
735
Tobias Bernhard (Atotech Deutschland GmbH), Edith Steinhäuser (Atotech
Deutschland GmbH), Stefan Kempa (Atotech Deutschland GmbH), Gerson
Krilles (Atotech Deutschland GmbH), Roger Massey (Atotech DeutschlandGmbH), and Frank Brüning (Atotech Deutschland GmbH)
Plating-Free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip
Chip Joining
Toyohiro Aoki (IBM Research), Eiji Nakamura (IBM Research), Sayuri
Kohara (IBM Research), Chinami Marushima (IBM Research), Kuniaki
Sueoka (IBM Research), Takashi Hisada (IBM Research), Ryota Yamaguchi(DIC Corporation, Japan), Nobuhiro Sekine (DIC Corporation, Japan),
Kenichi Yatsugi (DIC Corporation, Japan), and Makoto Yada (DIC
Corporation, Japan)

742

The Bonding Properties of Various Surface Finishes with Cu Paste for Pressure SinteringJung-Lae Jo (Mitsui Mining & Smelting Co., Ltd.), Kei Anai (Mitsui
Mining & Smelting Co., Ltd.), Sinichi Yamauchi (Mitsui Mining &Smelting Co., Ltd.), Takashi Hattori (Mitsui Mining & Smelting Co.,
Ltd.), and Takahiko Sakaue (Mitsui Mining & Smelting Co., Ltd.)

749

Facile Preparation of Cu-Ag Micro-Nano Composite Paste for High Power Device Packaging
Jiaxin Liu (Huazhong University of Science & Technology), Yun Mou(Huazhong University of Science & Technology), Yang Peng (Huazhong
University of Science & Technology), and Mingxiang Chen (Huazhong
University of Science & Technology)

755

Session 17: Automotive and Harsh Environment Reliability
Reliability Assessment of mmWave Modules
Laura Wambera (Technische Universität Dresden), Karsten Meier(Technische Universität Dresden), Christian Götze (GLOBALFOUNDRIES),
Marcel Wieland (GLOBALFOUNDRIES), and Karlheinz Bock (Technische
Universität Dresden)

762

Module Used in Robotaxi and Autonomous Truck Applications
Dongji Xie (Nvidia Corp.), Joe Hai (Nvidia Corp.), Jack Huang (Nvidia
Corp.), Zhongming Wu (Nvidia Corp.), Vivienne Zou (Nvidia Corp.), andManthos Economou (Nvidia Corp.)

769

Influence of Copper Wire Material Additive Elements to the Reliability of Wire Bonded
Contacts
Robert Klengel (Fraunhofer IMWS), Sandy Klengel (Fraunhofer IMWS), Jan
Schischka (Fraunhofer IMWS), Tino Stephan (Fraunhofer IMWS), Motoki
Eto (Nippon Micrometal Corporation), Noritoshi Araki (Nippon
Micrometal Corporation), Takashi Yamada (Nippon Micrometal
Corporation), and Matthias Petzold (Fraunhofer IMWS)

xxii

774

Extreme Cold-Temperature High-Strain Rate Properties of SAC Solder Alloys
Pradeep Lall (Auburn University), Vikas Yadav (Auburn University),
Vishal Mehta (Auburn University), Jeff Suhling (Auburn University),
and Ken Blecker (US Army Combat Capabilities Development Command Armament Center)
Considerations on a Smart Strategy for Simultaneously Testing Multiple PCB Assemblies in
Board Level Vibration
Varun Thukral (NXP Semiconductors), R. Roucou (NXP Semiconductors), S.
Sauze (NXP Semiconductors), J.J.M. Zaal (NXP Semiconductors), J.
Jalink (NXP Semiconductors), and R.T.H. Rongen (NXP Semiconductors)

782

793

Low Temperature Vibration Reliability of Lead-Free Solder Joints
Karsten Meier (Technische Universität Dresden), Maximilian Ochmann(Technische Universität Dresden), David Leslie (University of
Maryland), Abhijit Dasgupta (University of Maryland), and Karlheinz
Bock (Technische Universität Dresden)

801

Board Level Reliability Study of WLCSP with 5-Sided and 6-Sided Protection
Yen Yao Chi (MediaTek Inc.), Chieh Lung Lai (Siliconware Precision
Industries Co., Ltd.), Jun Yi Huang (Siliconware Precision Industries
Co., Ltd.), C. Key Chung (Siliconware Precision Industries Co., Ltd.),
Chia Yu Kuo (Siliconware Precision Industries Co., Ltd.), Yih Jenn
Jiang (Siliconware Precision Industries Co., Ltd.), Hong da Chang(Siliconware Precision Industries Co., Ltd.), NW Liu (MediaTek Inc.),and Benson Lin (MediaTek Inc.)

807

Session 18: Emerging Flexible Hybrid Electronics
RDL-First Flexible FOWLP Technology with Dielets Embedded in Hydrogel
Noriyuki Takahashi (Tohoku University), Yuki Susumago (Tohoku
University), Sungho Lee (Tohoku University), Yuki Miwa (Tohoku
University), Hisashi Kino (Tohoku University), Tetsu Tanaka (Tohoku
University), and Takafumi Fukushima (Tohoku University)

811

Wafer Scale Flexible Interconnect Transfer for Hetrogeneous Integration
Pan Liu (Fudan University), Jian Li (Delft University of Technology),
Henk van Zeijl (Delft University of Technology), and Guoqi Zhang(Delft University of Technology)

817

Heterogenous Integration of MEMS Gas Sensor Using FOWLP: Personal Environment Monitors
824
Samatha Benedict (University of California, Los Angeles), Ashvin
Nagarajan (University of California, Los Angeles), Thejas Kumar(Indian Institute of Science), Arsalan Alam (University of California,
Los Angeles), Murugaiya Sridar Illango (Indian Institute of Science),
Goutham Ezhilarasu (University of California, Los Angeles), Chandra
Shekhar Prajapati (Indian Institute of Science), Navakanta Bhat
(Indian Institute of Science), and Subramanian Iyer (University ofCalifornia, Los Angeles)xxiii

Development of Next Generation Stretchable Materials for Flexible Hybrid Electronics (FHE)S. Manian Ramkumar (Sun Ray Scientific LLC), Andrew Stemmermann (SunRay Scientific LLC), Benny Mathew Rajan (Sun Ray Scientific LLC),
Isabelle Quelhas (Sun Ray Scientific LLC), Mohammed Alhendi(Binghamton University), Mark Poliks (Binghamton University), El Mehdi
Abbara (Binghamton University), Benson Chan (Binghamton University),Toshiaki Ogiwara (NAMICS Corporation), Nori Saki (NAMICS Corporation),
Masayoshi Otomo (NAMICS Corporation), and Ken Araujo (NAMICS
Corporation)

829

High-Density Embedded Electronics in Textiles with 3D Flex Package Transfer
Md Monirojjaman Monshi (Florida International University), Jose-Solis
Camara (Florida International University), Shubhendu Bhardwaj (Florida
International University), John Volakis (Florida International
University), and Pulugurtha Markondeya Raj (Florida International
University)

835

Development of Dry EEG Electrodes and Dry EEG Cap for Neuromonitoring
Maria Ramona Ninfa Bautista Damalerio (Institute of Microelectronics,
A-STAR) and Ming-Yuan Cheng (Institute of Microelectronics, A-STAR)

841

Computational Modeling of Flexible Biodegradable Films with Engineered Defects
R. Waxman (Virginia Commonwealth University), Ibrahim Guven (Virginia
Commonwealth University), and Vamsi Yadavalli (Virginia Commonwealth
University)

847

Session 19: Embedded and Heterogeneous Integration
SoIC for Low-Temperature, Multi-layer 3D Memory Integration
Ming-Fa Chen (Taiwan Semiconductor Manufacturing Company, Ltd.),
Chen-Sheng Lin (Taiwan Semiconductor Manufacturing Company, Ltd.),
Ebin Liao (Taiwan Semiconductor Manufacturing Company, Ltd.), Wen-Chih
Chiou (Taiwan Semiconductor Manufacturing Company, Ltd.), Chun-Chiang
Kuo (Taiwan Semiconductor Manufacturing Company, Ltd.), Chih-Chia Hu(Taiwan Semiconductor Manufacturing Company, Ltd.), Chung-Hao Tsai
(Taiwan Semiconductor Manufacturing Company, Ltd.), Chuei-Tang Wang
(Taiwan Semiconductor Manufacturing Company, Ltd.), and Douglas Yu(Taiwan Semiconductor Manufacturing Company, Ltd.)855

Ultra-Low ESL Capacitor Based on Silicon Technology with Substrate Embedded Platform
JungHwa Kim (Samsung Electronics, Korea), Heeseok Lee (Samsung
Electronics, Korea), Jisoo Hwang (Samsung Electronics, Korea), andJongkyu Yoo (Samsung Electronics, Korea)

861

Fine-Pitch Interconnection and Highly Integrated Assembly Packaging with FOMIP (Fan-Out
Mediatek Innovation Package) Technology
Ming-Che Hsieh (JCET Group Co. Ltd.), Ian Hsu (MediaTek, Inc.),
Chi-Yuan Chen (MediaTek, Inc.), Stanley Lin (MediaTek, Inc.), Ta-Jen
Yu (MediaTek, Inc.), KeonTaek Kang (JCET Group Co. Ltd.), and Seung
Wook Yoon (JCET Group Co. Ltd.)
Demonstration of Vertically Integrated POP Using FOWLP Approach
Ser Choong Chong (Institute of Microelectronics), Leong Ching Eva(Institute of Microelectronics), Pei Siang Lim (Institute ofMicroelectronics), Siak Boon Lim (Institute of Microelectronics), andTai Chong Chai (Institute of Microelectronics)
xxiv

867

873

Large-Body-Sized Glass-Based Active Interposer for High-Performance Computing
Siddharth Ravichandran (Georgia Institute of Technology), Mohanalingam
Kathaperumal (Georgia Institute of Technology), Madhavan Swaminathan(Georgia Institute of Technology), and Rao Tummala (Georgia Instituteof Technology)

879

Heterogeneous Integration Using Organic Interposer Technology
George Scott (Amkor Technology, Inc.), JaeHun Bae (Amkor Technology,Inc.), KiYeul Yang (Amkor Technology, Inc.), WonMyoung Ki (Amkor
Technology, Inc.), Nathan Whitchurch (Amkor Technology, Inc.), Mike
Kelly (Amkor Technology, Inc.), Curtis Zwenger (Amkor Technology,Inc.), JongHyun Jeon (Amkor Technology, Inc,), and TaeKyeong Hwang(Amkor Technology, Inc.)

885

Session 20: Materials and Processes for FOWLP and PLP
Reliability Investigation of Ultra Fine Line, Multi-layer Copper Routing for Fan-Out
Packaging Using a Newly Designed Micro Tensile Test Method
Markus Woehrmann (Fraunhofer IZM), Aleksander Keller (Fraunhofer IZM),
Thomas Fritzsch (Fraunhofer IZM), Michael Schiffer (Fraunhofer IZM),
Martin Schneider-Ramelow (Technical University Berlin), Klaus-Dieter
Lang (Technical University Berlin), Hans Walter (Fraunhofer IZM), andAstrid Gollhardt (Fraunhofer IZM)
Polyimide Fine-Via Etching and Low-Damage Surface-Modification Process for High-Density
Fan-Out Wafer Level Package
Yasuhiro Morikawa (ULVAC, Inc), Daisuke Hironiwa (ULVAC, Inc), andTakahide Murayama (ULVAC, Inc)
Effect of Annealing on the Toughness of 40-µm-Wide Nanotwinned Cu Lines
Wei-You Hsu (National Chiao Tung University), Yu-Jin Li (National
Chiao Tung University), I-Hsin Tseng (National Chiao Tung University),
Benson Tzu-Hung Lin (MediaTek Inc.), Chia-Cheng Chang (MediaTek Inc.),
and Chih Chen (National Chiao Tung University)
Novel Photosensitive Dielectric Material with Superior Electric Insulation and Warpage
Suppression for Organic Interposers in Reliable 2.1D Package
Shunsuke Katagiri (Mitsubishi Gas Chemical Company, Inc.), Seiji Shika(Mitsubishi Gas Chemical Company, Inc.), Yune Kumazawa (Mitsubishi Gas
Chemical Company, Inc.), Katsuhiko Shimura (Mitsubishi Gas Chemical
Company, Inc.), Takuya Suzuki (Mitsubishi Gas Chemical Company, Inc.),
Tsuyoshi Kida (Mitsubishi Gas Chemical Company, Inc.), and Shu Yoshida(Mitsubishi Gas Chemical Company, Inc.)
Adaptive Shot Technology to Address Severe Lithography Challenges for Advanced FOPLPJohn Chang (Onto Innovation), Keith Best (Onto Innovation), Jian Lu(Onto Innovation), Burhan Ali (Onto Innovation), and Mike Marshall(Onto Innovation)

893

900

906

912

918

Low Warpage Liquid Compression Molding (LCM) Material for High Density Fan-out and Wafer
Level Packaging Applications
924
Jay Chao (Henkel Corporation), Rong Zhang (Henkel Corporation), Tu Do(Henkel Corporation), AnhBinh Tong (Henkel Corporation), Yijia Ma(Henkel Corporation), David Grimes (Henkel Corporation), RamachandranK. Trichur (Henkel Corporation), and Lirong Bao (Henkel Corporation)xxv

Session 21: High Speed in Signal Integrity
EMI Shielding Technology in 5G RF System in Package Module
Jay Li (Siliconware Precision Industries Co. Ltd.), Mike Tsai
(Siliconware Precision Industries Co. Ltd.), Ryan Chiu (Siliconware
Precision Industries Co. Ltd.), Eric He (Siliconware Precision
Industries Co. Ltd.), Alex Hsieh (Siliconware Precision Industries Co.
Ltd.), Ming-fan Tsai (Siliconware Precision Industries Co. Ltd.),
Frank Chu (Siliconware Precision Industries Co. Ltd.), J. Y. Chen
(Siliconware Precision Industries Co. Ltd.), Shunyu Jian (Siliconware
Precision Industries Co. Ltd.), Simon Chen (Siliconware Precision
Industries Co. Ltd.), and Yu-Po Wang (Siliconware Precision Industries
Co. Ltd.)931

Complex Permittivity Measurements in a Wide Temperature Range for Printed Circuit Board
Material Used in Millimeter Wave Band
938
Kazuki Takahashi (Fujitsu Advanced Technologies Limited), Shunichi
Kikuchi (Fujitsu Advanced Technologies Limited), Akiko Matsui (Fujitsu
Advanced Technologies Limited), Mitsunori Abe (Fujitsu Advanced
Technologies Limited), and Kouhei Chouraku (Fujitsu Advanced
Technologies Limited)
Minimally Invasive 3D Printed Fixtures for Multi Gb/s Channel Characterization with a
Logic Analyzer
Matteo Cocchini (IBM Corporation), Khaalid McMillan (IBM Corporation),
Wiren D. Becker (IBM Corporation), Michael Cracraft (IBM Corporation),Matt Doyle (IBM Corporation), and Jason Bjorgaard (IBM Corporation)
CTLE Adaptation Using Deep Learning in High-Speed SerDes Link
Bowen Li (North Carolina State University), Brandon Jiao (Xilinx
Inc.), Chih-Hsun Chou (Xilinx Inc.), Romi Mayder (Xilinx Inc.), andPaul Franzon (North Carolina State University)
An Efficient and Fast 112Gbps/PAM4 Signal Line Design with Conventional FCBGA Substrate
Based on a 3-D Component Library
Ryuichi Oikawa (Renesas Electronics Corporation)
Optimization of High-Speed Package Design on Statistical Domain
Il-Joon Kim (Samsung Electronics Company, Ltd.), Manho Lee (Samsung
Electronics Company, Ltd.), Ki Jin Han (Dongguk University), Gyoungbum
Kim (Samsung Electronics Company, Ltd.), Dae-Woo Kim (Samsung
Electronics Company, Ltd.), and Dan Oh (Samsung Electronics Company,
Ltd.)

xxvi

946

952

956
964

OpenCAPI Memory Interface Simulation and Test for Differential DIMM Channel with SNIASFF-TA-1002 Connector
Biao Cai (IBM Corporation), Jose Hejase (IBM Corporation), Kevin
Mcilvain (IBM Corporation), Kyle Giesen (IBM Corporation), Zhaoqin
Chen (IBM Corporation), Hongqing Zhang (IBM Corporation), Junyan Tang(IBM Corporation), Megan Nguyen (IBM Corporation), Devon Baughen (IBM
Corporation), Daniel Dreps (IBM Corporation), Brian Connolly (IBM
Corporation), Glen Wiedemeier (IBM Corporation), Dale Becker (IBM
Corporation), Sungjun Chun (IBM Corporation), Brian Beaman (IBM
Corporation), Zhineng Fan (Amphenol ICC), Yifan Huang (Amphenol ICC),
Abhijit Wander (Amphenol ICC), and Victor Mahran (Smart Modular
Technologies)

970

Session 22: Advanced Biosensors and Bioelectronics
Smart and Connected Physiological Monitoring Enabled by Stretchable Bioelectronics andDeep-Learning AlgorithmMusa Mahmood (Georgia Institute of Technology), Young-Tae Kwon
(Georgia Institute of Technology), Yun-Soung Kim (Georgia Institute ofTechnology), Jongsu Kim (Georgia Institute of Technology), andWoon-Hong Yeo (Georgia Institute of Technology)

979

A High Spatial Resolution Surface Electromyography (sEMG) System Using Fan-Out Wafer-Level
Packaging on FlexTrateTM
985
Arsalan Alam (University of California, Los Angeles), Michael Molter(University of California, Los Angeles), Bilwaj Gaonkar (University ofCalifornia, Los Angeles), Amir Hanna (University of California, Los
Angeles), Randall Irwin (University of California, Los Angeles),Samatha Benedict (University of California, Los Angeles), Goutham
Ezhilarasu (University of California, Los Angeles), Luke Macyszyn(University of California, Los Angeles), Michael Selvan Joseph(Calfornia State University, Los Angeles), and Subramanian S. Iyer
(University of California, Los Angeles)
Microfabricated SERF Atomic Magnetometers for Measurement of Weak Magnetic Field
Kangni Liu (Southeast University), Jintang Shang (Southeast
University), Jin Zhang (Southeast University), Xiang Yue (Southeast
University), Chen Ye (Southeast University), Jianfeng Zhang (Southeast
University), and Ching-Ping Wong (Georgia Institute of Technology)
Development of Long Term Stable Multiple-Ion-Selective Sensors for Agriculture andAquaculture Applications
Yu Chen (Institute of Microelectronics (IME)), Shermin S. Goh(Institute of Materials Research and Engineering (IMRE)), Ramona
Damalerio (Institute of Microelectronics (IME)), Weiguo Chen
(Institute of Microelectronics (IME)), David Choong (Institute ofMicroelectronics (IME)), Jason Y.C. Lim (Institute of Materials
Research and Engineering (IMRE)), Lionel C.H. Lim (Institute ofMaterials Research and Engineering (IMRE)), Georgina E.K.K. Seah(Institute of Materials Research and Engineering (IMRE)), and Angeline
Y.X. Tan (Institute of Materials Research and Engineering (IMRE))

xxvii

991

997

3D Heterogeneous and Flexible Package Integration for Zero-Power Wireless Neural Recording
1003
Sk Yeahia Been Sayeed (Florida International University), Satheesh
Bojja Venkatakrishnan (Florida International University), Md
Monirojjaman Monshi (Florida International University), Abdal
Abdulhameed (Florida International University), John L. Volakis(Florida International University), and P. M Raj (Florida
International University)
A Compact Wireless Passive Breath Analyzer for Health Monitoring
Saranraj Karuppuswami (Michigan State University), Saikat Mondal(Michigan State University), Deepak Kumar (Michigan State University),and Premjeet Chahal (Michigan State University)

1010

Session 23: Advanced Dicing and Laser-Assisted Bonding
Laser-Assisted Bonding (LAB) and de-Bonding (LAdB) as an Advanced Process Solution for
Selective Repair of 3D and Multi-die Chip Packages
Matthias Fettke (PacTech GmbH), Timo Kubsch (PacTech GmbH), Andrej
Kolbasow (PacTech GmbH), Vinith Bejugam (PacTech GmbH), Alexander
Frick (PacTech GmbH), and Thorsten Teutsch (PacTech GmbH)
High-Performance Flip Chip Bonding Mechanism Study with Laser Assisted Bonding
MinHo Gim (Amkor Technology), ChoongHoe Kim (Amkor Technology), SeokHo
Na (Amkor Technology), DongSu Ryu (Amkor Technology), KyungRok Park
(Amkor Technology), and JinYoung Kim (Amkor Technology)

1016

1025

Development of Digital Signage Modules Composed of Mini-LEDs Using Laser-Assisted Bonding(LAB) Technology
1031
Choi Kwang-Seong (ETRI), Joo Jiho (ETRI), Jang Ki-seok (ETRI), EomYong-Sung (ETRI), Choi Gwang-Mun (ETRI), Yun Ho-Gyeong (ETRI), Moon
Seok Hwan (ETRI), Kim Jong-Sun (SiliconInside Co., Ltd), Oh Mingyun(SiliconInside Co., Ltd), Choi Ji-Hoon (AQLASER Co., Ltd), Choi
Ji-Woong (AQLASER Co., Ltd), Choi Shin (LB Lusem Co., Ltd), Park
Sang-Hong (LB Lusem Co., Ltd), Kim Sang-Ki (HS Semicon), Kim Jin Sung
(JIST Co. Ltd), and Yoo Sehoon (KITECH)
Step Coverage Improvement for Electromagnetic Interference (EMI) Shield Film by Forming
Bevel-Shaped Packages
1037
Byeongdeck Jang (DISCO Corporation), Fumio Uchida (DISCO Corporation),
Shigenori Harada (DISCO Corporation), Naotaka Oshima (DISCO
Corporation), Satoshi Sawaki (DISCO Corporation), Shigeru Ishii (DISCO
Corporation), Takuya Kaminaga (DISCO Corporation), Hayato Kiuchi(DISCO Corporation), Tomoharu Takita (DISCO Corporation), and Young
Suk Kim (DISCO Corporation)
Damage-Less Singulation of Ultra-Thin Wafers Using Stealth Dicing
Natsuki Suzuki (Tokyo Institute of Technology), Tomoji Nakamura (Tokyo
Institute of Technology), Yuta Kondo (Hamamatusu Photonics K. K.,
Japan), Shimpei Tominaga (Hamamatusu Photonics K. K.), Kazuhiro Atsumi(Hamamatusu Photonics K. K.), and Takayuki Ohba (Tokyo Institute ofTechnology)

xxviii

1043

In-Process Measurement of the Grinding Force in Silicon Wafer Self-Rotating Grinding
Process
Lixiang Zhang (Beijing University of Technology), Fei Qin (Beijing
University of Technology), Pei Chen (Beijing University ofTechnology), Tong An (Beijing University of Technology), Yanwei Dai(Beijing University of Technology), Zhongbo Yi (The 45th ResearchInstitute of China Electronic Technology Corporation), and Haiming
Wang (The 45th Research Institute of China Electronic Technology
Corporation)

1050

High Expansion Tape for Fan-Out WLP Applying a Novel Stress-Strain Curve Measuring Method
1057
Ken Takano (LINTEC Corporation), Tadatomo Yamada (LINTEC Corporation),
Toshiaki Menjo (LINTEC Corporation), and Shinya Takyu (LINTEC
Corporation)

Session 24: Material and Interface Modeling
A Direct Multi-Field Coupling Methodology for Modeling Moisture-Induced Stresses andDelamination in Electronic Packages
Liangbiao Chen (ON Semi), Xuejun Fan (Lamar University), and Yong Liu(ON Semi)
Accuracy, Hysteresis and Extended Time Stability of Additively Printed Temperature and
Humidity Sensors
Pradeep Lall (Auburn University), Kartik Goyal (Auburn University),and Jinesh Narangaparambil (Auburn University)

1064

1070

Viscoelastic Modeling for Heterogeneous Fan-out Wafer Molding Process
Shu-Shen Yeh (Taiwan Semiconductor Manufacturing Company), P. Y. Lin(Taiwan Semiconductor Manufacturing Company), K. C. Lee (Taiwan
Semiconductor Manufacturing Company), M. C. Yew (Taiwan Semiconductor
Manufacturing Company), C. C. Yang (Taiwan Semiconductor Manufacturing
Company), J. H. Wang (Taiwan Semiconductor Manufacturing Company), C.
K. Hsu (Taiwan Semiconductor Manufacturing Company), P. C. Lai (Taiwan
Semiconductor Manufacturing Company), Dion Tseng (Taiwan Semiconductor
Manufacturing Company), S. K. Cheng (Taiwan Semiconductor
Manufacturing Company), and Shin-Puu Jeng (Taiwan Semiconductor
Manufacturing Company)

1081

A Mechanistic Study of Underfill Cracks by the Confocal-DIC Method
Ying Yang (3IT, University of Sherbrooke, Canada), Fakhreddine Habib(3IT, University of Sherbrooke, Canada), Papa Momar Souare (3IT,
University of Sherbrooke, Canada), Eric Duchesne (IBM Bromont,
Canada), and Julien Sylvestre (3IT, University of Sherbrooke, Canada)

1087

Mechanical Characterization of Dual Curable Adhesives
Sukrut Prashant Phansalkar (University of Maryland, College Park),
Changsu Kim (University of Maryland, College Park), and Bongtae Han(University of Maryland, College Park)

1094

xxix

Chip Package Interaction (CPI) Risk Assessment of 22FDX® Wafer Level Chip Scale Package(WLCSP) Using 2D Finite Element Analysis Modeling
Kashi Vishwanath Machani (GLOBALFOUNDRIES Dresden Module One LLC & Co.
KG), Frank Kuechenmeister (GLOBALFOUNDRIES Dresden Module One LLC &Co. KG), Dirk Breuer (GLOBALFOUNDRIES Dresden Module One LLC & Co.
KG), Christian Klewer (GLOBALFOUNDRIES Dresden Module One LLC & Co.
KG), Jae Kyu Cho (GLOBALFOUNDRIES Inc.), and Kristina Young-Fisher(GLOBALFOUNDRIES Inc.)
Biaxial Inflation Stretch Test for Printed Electronics
Benjamin G. Stewart (Georgia Institute of Technology), Nicholas J.
Ginga (Georgia Institute of Technology), and Suresh K. Sitaraman(Georgia Institute of Technology)

1100

1106

Session 25: High Density Fan-Out Technology
Process Window Enhancement of Via Holes for Fine Pitch RDL by Design Optimization
Cliff McCold (Veeco Instruments, Inc., USA), Robert Hsieh (Veeco
Instruments, Inc., USA), Ha-Ai Nguyen (Veeco Instruments, Inc., USA),
Warren W. Flack (Veeco Instruments, Inc., USA), John Slabbekoorn(IMEC, Belgium), and Andy Miller (IMEC, Belgium)

1114

Applications and Reliability Study of InFO_UHD (Ultra-High-Density) Technology
Ting-Chu Ko (Taiwan Semiconductor Manufacturing Company, Ltd.),
Han-Ping Pu (Taiwan Semiconductor Manufacturing Company, Ltd.),
Yung-Ping Chiang (Taiwan Semiconductor Manufacturing Company, Ltd.),
Huang-Jui Kuo (Taiwan Semiconductor Manufacturing Company, Ltd.),
Chuei-Tang Wang (Taiwan Semiconductor Manufacturing Company, Ltd.),
Chung-Shi Liu (Taiwan Semiconductor Manufacturing Company, Ltd.), andDouglas C. H. Yu (Taiwan Semiconductor Manufacturing Company, Ltd.)

1120

Fine-Pitch RDL Integration for Fan-Out Wafer-Level Packaging
Ser Choong Chong (Institute of Microelectronics), Soon Wee David Ho(Institute of Microelectronics), Siew Boon Serine Soh (Institute ofMicroelectronics), Seow Huang Sharon Lim (Institute ofMicroelectronics), Hung Ming Calvin Chua (Institute ofMicroelectronics), Ahmad Abdillah Haron (Institute ofMicroelectronics), Huan Ching Kenneth Lee (Institute ofMicroelectronics), Mingsheng Zhang (Institute of Materials Researchand Engineering), Zhi Hao Ko (WinTech Nano-Technology Services Pte.
Ltd.), Ye Ko San (WinTech Nano-Technology Services Pte. Ltd.), Henry
Leong (WinTech Nano-Technology Services Pte. Ltd.), Chin Wei Tan(Applied Materials), Qi Jie Peng (Applied Materials), Abdul Hakim
Jumat (Applied Materials), Xundong Dai (Applied Materials), Khai Mum
Peter Fung (Applied Materials), Guan Huei See (Applied Materials), andPrayudi Lianto (Applied Materials)

1126

xxx

Advances in High Performance RDL Technologies for Enabling IO Density of 500 IOs/mm/layerand 8-µm IO Pitch Using Low-k Dielectrics
1132
Fuhan Liu (Georgia Institute of Technology), Rui Zhang (Georgia
Institute of Technology), Bartlet DeProspo (Georgia Institute ofTechnology), Shreya Dwarakanath (Georgia Institute of Technology),
Pratik Nimbalkar (Georgia Institute of Technology), SiddharthRavichandran (Georgia Institute of Technology), David Weyers (Georgia
Institute of Technology), Mohanalingam Kathaperumal (Georgia Instituteof Technology), Rao Tummala (Georgia Institute of Technology), andMadhavan Swaminathan (Georgia Institute of Technology)
Challenges of Large Fan out Multi-chip Module and Fine Cu Line Space
Yu Lung Huang (Siliconware Precision Industries Co., Ltd), C. Key
Chung (Siliconware Precision Industries Co., Ltd), C. F. Lin(Siliconware Precision Industries Co., Ltd), Guan Hua Lu (Siliconware
Precision Industries Co., Ltd), Ching Hung Tseng (Siliconware
Precision Industries Co., Ltd), Hong Da Chang (Siliconware Precision
Industries Co., Ltd), Chih Hsun Hsu (Siliconware Precision Industries
Co., Ltd), and Bruce Xu (Siliconware Precision Industries Co., Ltd)

1140

Fan-In Panel-Level with Multiple Diced Wafers Packaging
John H. Lau (Unimicron Technology Corporation), Cheng-Ta Ko (Unimicron
Technology Corporation), Tzvy-Jang Tseng (Unimicron Technology
Corporation), Kai-Ming Yang (Unimicron Technology Corporation),
Chia-Yu Peng (Unimicron Technology Corporation), Tim Xia (Unimicron
Technology Corporation), Puru Bruce Lin (Unimicron Technology
Corporation), Eagle Lin (Unimicron Technology Corporation), Leo Chang(Unimicron Technology Corporation), Hsing Ning Liu (Unimicron
Technology Corporation), and David Cheng (Unimicron Technology
Corporation)

1146

Development of Mold-First Fan-Out Panel-Level Packaging (FO-PLP) on 600mm x 600mm Size
Panel
1154
Srinivasa Rao Vempati (Institute of Microelectronics), Ser Choong
Chong (Institute of Microelectronics), and Yamamoto Kazunori(Institute of Microelectronics)

Session 26: Breakthroughs in TSV and TGV Technologies
Trench Isolation Technology for Cost-Effective Wafer-Level 3D Integration with One-Step
TSV
Masaya Kawano (Institute of Microelectronics, A*STAR), Xiang-Yu Wang
(Institute of Microelectronics, A*STAR), and Qin Ren (Institute ofMicroelectronics, A*STAR)
Coaxial Through-Silicon-Vias Using Low-k SiO2 Insulator
Pengbo Yu1 (Tsinghua University), Hongxiao Lin (China Agricultural
University), Zhiwei He (China Agricultural University), Changming Song(Tsinghua University), Jian Cai (Tsinghua University), Qian Wang
(Tsinghua University), and Zheyao Wang (Tsinghua University)

xxxi

1161

1167

Study of the Impact of Pitch Distance on the Statistical Variation of TSV Protrusion andthe Underlying Mechanisms
Golareh Jalilvand (University of Central Florida), Omar Ahmed(University of Central Florida), Nicolas Dube (University of Central
Florida), and Tengfei Jiang (University of Central Florida)
Defect Localization in Through-Si-Interposer Based 2.5DICs
Sajay Bhuvanendran Nair Gourikutty (Institute of Microelectronics,
A*STAR), Yew Meng Chow (Xilinx Asia Pacific Pte Ltd.), Jesse Alton(TeraView Limited), Ratan Bhimrao Umralkar (Institute ofMicroelectronics, A*STAR), Haonan Bai (Xilinx Asia Pacific Pte Ltd.),
Kok Keng Chua (Xilinx Asia Pacific Pte Ltd.), and Surya Bhattacharya(Institute of Microelectronics, A*STAR)Interfacial Crack Initiation and Delamination Propagation in Cu-Filled TSV Structure by
Incorporating Cohesive Zone Model and Finite Element Method
Jiu-Bin Fei (South China University of Technology), Tao Xu (South
China University of Technology), Jie-Ying Zhou (South China Universityof Technology), Chang-Bo Ke (South China University of Technology),
and Xin-Ping Zhang (South China University of Technology)

1173

1180

1186

Fabrication and Characterization of Through-Glass Vias (TGV) Based 3D Spiral and Toroidal
Inductors by Cost-Effective ECDM Process
1192
Harindra Kumar Kannojia (Indian Institute of Technology Bombay),
Julfekar Arab (Indian Institute of Technology Bombay), Aboobackkar
Sidhique (Indian Institute of Technology Bombay), Dileep Kumar Mishra(Indian Institute of Technology Bombay), Ritesh Kumar (Research &Development Establishment (Engineers)), Jaising Pednekar (Research &Development Establishment (Engineers)), and Pradeep Dixit (Indian
Institute of Technology Bombay)
Low-Temperature Multichip-to-Wafer 3D Integration Based on Via-Last TSV with OER-TEOS-CVD
and Microbump Bonding without Solder Extrusion
1199
Kousei Kumahara (Tohoku University), Rui Liang (Tohoku University),
Sungho Lee (Tohoku University), Yuki Miwa (Tohoku University),
Mariappan Murugesan (Tohoku University), Hisashi Kino (Tohoku
University), Takafumi Fukushima (Tohoku University), and Tetsu Tanaka(Tohoku University)

Session 27: WLP and Advanced Technology Reliability
A Mechanics Model for the Moisture Induced Delamination in Fan-Out Wafer-Level Package 1205
Tz-Cheng Chiu (National Cheng Kung University), Ji-Yen Wu (National
Cheng Kung University), Wei-Te Liu (National Cheng Kung University),
Chang-Wei Liu (National Cheng Kung University), Dao-Long Chen
(Advanced Semiconductor Engineering, Inc.), MengKai Shih (Advanced
Semiconductor Engineering, Inc.), and David Tarng (Advanced
Semiconductor Engineering, Inc.)WLCSP Solder Ball Interconnection Enhancement for High Temperature Stress Reliability
C.C. Chen (Taiwan Semiconductor Manufacturing Company, Ltd.), K.H Chen
(Taiwan Semiconductor Manufacturing Company, Ltd.), Y.S Wu (Taiwan
Semiconductor Manufacturing Company, Ltd.), P.H Tsao (Taiwan
Semiconductor Manufacturing Company, Ltd.), and S.T Leu (Taiwan
Semiconductor Manufacturing Company, Ltd.)
xxxii

1212

Investigation into the Failure Mechanism of Silver Nanowire Network Film Under ElectricalStressKaiqing Wang (Fudan University), Yunxia Jin (Fudan University),
Xiaocun Wang (Fudan University), Baifan Qian (Fudan University),
Jianzhong Wang (Fudan University), and Fei Xiao (Fudan University)

1218

Damage Accumulation in Printed Interconnects on Flex Under Combinations of Bending andTension with Different Amplitudes
1225
Rajesh Sharma Sivasubramony (Binghamton University), Mohammed Alhendi(Binghamton University), Maan Kokash (Binghamton University), Manu
Yadav (Binghamton University), Arun Raj (Binghamton University),
Sanoop Thekkut (Binghamton University), Emuobosan Enakerakpo(Binghamton University), Nardeeka Adams (Binghamton University), Peter
Borgesen (Binghamton University), and Mark Poliks (Binghamton
University)
Photosensitive Polymer Reliability for Fine Pitch RDL Applications
Emmanuel Chery (IMEC), Fabrice Duval (IMEC), Michele Stucchi (IMEC),John Slabbekoorn (IMEC), Kristof Croes (IMEC), and Eric Beyne (IMEC)

1234

Atomic Layer Deposited Al_2O_3 Encapsulation for the Silicon Interconnect Fabric
Niloofar Shakoorzadeh Chase (University of California, Los Angeles),Krutikesh Sahoo (University of California, Los Angeles), Yu Tao Yang
(University of California, Los Angeles), and Subramanian S. Iyer
(University of California, Los Angeles)

1241

Process-Consistency-Performance Relationships for Additively Printed Z-Axis Interconnects
in Multilayer Circuits
1247
Pradeep Lall (Auburn University), Kartik Goyal (Auburn University),
Nakul Kothari (Auburn University), and Scott Miller (NextFlex National
Manufacturing Institute)

Session 28: Enhanced Manufacturing and Process Integration
Varied Ball BGA Technology to Eliminate Solder Ball Bridging Defects in SMT
Xiao Lu (Intel Corporation) and Heuijong Ju (SSP Company)

1259

Full Low Temperature Solder BGA Development for Large Size BGA Package
Masateru Koide (Fujitsu Advanced Technologies Limited), Kenji Fukuzono(Fujitsu Advanced Technologies Limited), Manabu Watanabe (Fujitsu
Advanced Technologies Limited), Tsuyoshi Yamamoto (Fujitsu Advanced
Technologies Limited), and Seiki Sakuyama (Service Platform BusinessGroup Fujitsu Limited)

1265

Thermal Compression Bonding with Pre-Applied Underfill for Very Large Die
Divya Taneja (University of Sherbrooke), David Danovitch (Universityof Sherbrooke), Ahmed Chakroun (Kulicke and Soffa Industries Inc.),
Catherine Dufort (IBM-Canada), Pascale Gagnon (IBM-Canada), and RobertMartel (IBM-Canada)

1270

xxxiii

Thermo Compression Bonding for Large Dies Under Protective Atmosphere
Jonathan Abdilla (BESI Austria GmbH), Uwe Bayer (Besi Austria GmbH),
Ruurd Boomsma (Besi Austria GmbH), Stephan Bulacher (Besi AustriaGmbH), Alexander Kalss (Besi Austria GmbH), Stephan Martin (Besi
Austria GmbH), Harald Meixner (Besi Austria GmbH), Thiago Moura (Besi
Austria GmbH), Hubert Selhofer (Besi Austria GmbH), Wolfgang Voegele(Besi Austria GmbH), and Martin Widauer (Besi Austria GmbH)The Effect of Solder Paste Volume on Solder Joint Shape and Self-Alignment of Passive
Components
Ke Pan (Binghamton University), Jong Hwan Ha (Binghamton University),
Van Lai Pham (Binghamton University), Huayan Wang (Binghamton
University), Jiefeng Xu (Binghamton University), and Seungbae Park
(Binghamton University)

1277

1289

Achieving Selective Cleaning on Semiconductors Packaging Using Atmospheric Pressure Plasma
1298
Sagung Dewi Kencana (National Taiwan University of Science andTechnology), Wallace Chuang (Robert Bosch Taiwan Co., Ltd.), Clarissa
Changraini (National Taiwan University of Science and Technology),
Eckart Schellkes (Robert Bosch Taiwan Co., Ltd.), Yu-Lin Kuo (National
Taiwan University of Science and Technology), and Ken Chang (Robert
Bosch Taiwan Co., Ltd.)An Additive Production Approach for Microvias and Multilayered Polymer Substrate
Patterning of 2.5 µm Feature Sizes
Sarthak Acharya (Luleå Technical University), Shailesh Singh Chouhan(Luleå Technical University), and Jerker Delsing (Luleå Technical
University)

1304

Session 29: Advances in Bonding Materials and Processes
Development of Bonding Process for Flexible Devices with Fine-Pitch Interconnection Using
Anisotropic Solder Paste and Laser-Assisted Bonding Technology
1309
Jiho Joo (Electronics and Telecommunications Research Institute),
Yong-Sung Eom (Electronics and Telecommunications Research Institute),
Ki-seok Jang (Electronics and Telecommunications Research Institute),
Gwang-Mun Choi (Electronics and Telecommunications ResearchInstitute), and Kwang-Seong Choi (Electronics and Telecommunications
Research Institute)
Demonstration of a Collective Hybrid Die-to-Wafer Integration
Samuel Suhard (IMEC), Alain Phommahaxay (IMEC), Koen Kennes (IMEC),
Pieter Bex (IMEC), Ferenc Fodor (IMEC), Maarten Liebens (IMEC), John
Slabbekoorn (IMEC), Andy Miller (IMEC), Gerald Beyer (IMEC), and Eric
Beyne (IMEC)A Novel Low-Temperature Cu-Cu Direct Bonding with Cr Wetting Layer and Au Passivation
Layer
Demin Liu (National Chiao Tung University), Po-Chih Chen (National
Chiao Tung University), and Kuan-Neng Chen (National Chiao Tung
University)
Direct Bonding of GaN to Diamond Substrate at Room Temperature
Tadatomo Suga (Meisei University) and Fengwen Mu (Meisei University)

xxxiv

1315

1322

1328

Development of an Extremely High Thermal Conductivity TIM for Large Electronics Packagesin the 4th Industrial Revolution Era
1332
Mikyeong Choi (Amkor Technology), HyunHye Jung (Amkor Technology),
KwangSeok Oh (Amkor Technology), DongSu Ryu (Amkor Technology),
SangHyoun Lee (Amkor Technology), WonChul Do (Amkor Technology),
YoungDo Kweon (Amkor Technology), Mike Kelly (Amkor Technology),
KyungRok Park (Amkor Technology), JinYoung Khim (Amkor Technology),
and Ron Huemoeller (Amkor Technology)
Pressureless Sintering Process of Ag Sinter Paste Bonding Ag Si Die on Bare Cu DBC Using
Convection Reflow Oven in Nitrogen for Die Attach
Guangyu Fan (Indium Corporation of America), Christine LaBarbera(Indium Corporation of America), Ning-Cheng Lee (Indium Corporation ofAmerica), Zachary Boushie (Rochester Institute of Technology), andNicole Lockwood (Rochester Institute of Technology)
Characterization and Application of a Novel Permanent Bonding Material
Xiao Liu (Brewer Science, Inc), Trevor Stanley (Brewer Science, Inc.),
and Reihaneh Sejoubsari (Brewer Science, Inc.)

1338

1344

Session 30: RF and Power Components and Modules
Metamaterial-Inspired Dual-Function Loop Antenna for Wireless Power Transfer and WirelessCommunications
1351
Woosol Lee (University of Florida), Haein Kim (University of Florida),
and Yong-Kyu Yoon (University of Florida)
Power Integrity Performance Gain of a Novel Integrated Stack Capacitor (ISC) Solution for
High-End Computing Applications
Eunseok Song (Samsung Electronics Company, Ltd.), Dan (Kyung Suk) Oh(Samsung Electronics Company, Ltd.), Seung-Yong Cha (Samsung
Electronics Company, Ltd.), Jaejune Jang (Samsung Electronics Company,
Ltd.), Taejoo Hwang (Samsung Electronics Company, Ltd.), Gyoungbum Kim(Samsung Electronics Company, Ltd.), Jongkook Kim (Samsung Electronics
Company, Ltd.), Sunghwan Min (Samsung Electronics Company, Ltd.),
Kilsoo Kim (Samsung Electronics Company, Ltd.), Dae-Woo Kim (Samsung
Electronics Company, Ltd.), and Seungwook Yoon (Samsung Electronics
Company, Ltd.)
Integrated Magnetic Cores in FOWLP and Their Applications
Xiao Sun (IMEC), John Slabbekoorn (IMEC), Dimitrios Velenis (IMEC),
Pieter Bex (IMEC), Fabrice Duval (IMEC), Tom Sterken (IMEC), Giacomo
Talmelli (IMEC), Inge de Preter (IMEC), Tomas Webers (IMEC), Christoph
Adelmann (IMEC), Andy Miller (IMEC), Geert Van der Plas (IMEC), andEric Beyne (IMEC)
Multi-physical Simulations and Modelling of an Integrated GaN-on-Si Module Concept forMillimetre-Wave Communications
Kimmo Rasilainen (Chalmers University of Technology), Koen Buisman(Chalmers University of Technology), Kristoffer Andersson (Ericsson
AB), and Christian Fager (Chalmers University of Technology)

xxxv

1358

1363

1369

Heterogeneous Integration of 5G and Millimeter-Wave Diplexers with 3D Glass Substrates
Muhammad Ali (Georgia Institute of Technology), Atom Watanabe (Georgia
Institute of Technology), Takenori Kakutani (Taiyo Ink Mfg. Co.,
Ltd.), Pulugurtha M. Raj (Florida International University), Rao R.
Tummala (Georgia Institute of Technology), and Madhavan Swaminathan(Georgia Institute of Technology)

1376

Modeling and Characterization of Through-Silicon-Vias (TSVs) in Radio Frequency Regime inan Active Interposer Technology
1383
Arian Rahimi (Intel Corporation), Pratheesh Somarajan (Intel
Corporation), and Qiang Yu (Intel Corporation)
Co-Design of a Highly Integrated, High Peformance, 16-Channel Pulsers and Tx/Rx Switches
for Ultrasound Imaging Systems
1390
Prashuk Jain (Texas Instruments, Inc.), Jie Chen (Texas Instruments,Inc.), Rajen Murugan (Texas Instruments, Inc.), Vajeed Nimran (Texas
Instruments, Inc.), Aravind Miriyala (Texas Instruments, Inc.), andTony Tang (Texas Instruments, Inc.)

Session 31: Automotive and Power Electronics Packaging
Imaging Sub-Surface Defects in Power Electronic Modules using Shear-Force Microscopy
Vijay Venkatesh (The Ohio State University), Shailesh N Joshi (Toyota
Research Institute of North America), and Vishnu Baba Sundaresan (TheOhio State University)
Very low Parasitic Inductance Double Side Cooling Power Modules Based on Ceramic
Substrates and GaN Devices
Christine Laurant (CEA, France), Johan Delaine (CEA, France), Pierre
Périchon (CEA, France), Charley Lanneluc (CEA, France), Benoit Thollin(CEA, France), Antoine Izoulet (CEA, France), Manon Porlan (CEA,
France), René Escoffier (CEA, France), Jean Brun (CEA, France), andJacques Favre (aPSI3D)
Advanced SiC Power Module Packaging Technology Direct on DBA Substrate for High
Temperature Applications: Ag Sinter Joining and Encapsulation Resin Adhesion
Chuantong Chen (Osaka University), Zheng Zhang (Osaka University), andKatsuaki Suganuma (Osaka University)
High Thermal Die-Attach Paste Development for Analog Devices
Kiichiro Higaki (Amkor Technology, Inc.), Toru Takahashi (Amkor
Technology, Inc.), Akinori Ono (Amkor Technology, Inc.), Daisuke Koike(Toshiba Electronic Devices & Storage Corporation), Masahiko Hori
(Toshiba Electronic Devices & Storage Corporation), Keiichi Kusaka(Sumitomo Bakelite Company, Limited), Takayuki Nishi (Sumitomo
Bakelite Company, Limited), and Takeshi Mori (Sumitomo BakeliteCompany, Limited)

1396

1402

1408

1414

Demonstration of Package Level 3D-Printed Direct Jet Impingement Cooling Applied to HighPower, Large Die Applications
1422
Tiwei Wei (IMEC), Herman Oprins (IMEC), Vladimir Cherman (IMEC), Zhi
Yang (GLOBALFOUNDRIES), Katie Rivera (GLOBALFOUNDRIES), Geert Van derPlas (IMEC), Bartek Pawlak (GLOBALFOUNDRIES), Luke England(GLOBALFOUNDRIES), Eric Beyne (IMEC), and Martine Baelmans (KU Leuven)xxxvi

Sintered Micro-Silver Paste Doped with Indium for Die Attachment Applications of Power ICs
1430
Chin-Hao Tsai (National Taiwan University), Wei-Chen Huang (National
Taiwan University), Ly May Chew (Heraeus Deutschland GmbH & Co. KG),
Wolfgang Schmitt (Heraeus Deutschland GmbH & Co. KG), Hiroshi
Nishikawa (Osaka University), and C. Robert Kao (National Taiwan
University)
Direct Bonding of Diamond and Si Substrates at Low Temperatures Under Atmospheric
Conditions
Takashi Matsumae (National Institute of Advanced Industrial Scienceand Technology), Yuichi Kurashima (National Institute of Advanced
Industrial Science and Technology), Hitoshi Umezawa (National
Institute of Advanced Industrial Science and Technology), and Hideki
Takagi (National Institute of Advanced Industrial Science andTechnology)

1436

Session 32: Stacking and Bonding Technologies
A Novel iso-Thermal Intermetallic Compound Insertion Bonding Approach to Improve
Throughput for 3D die to Wafer Stacking
Lin Hou (IMEC), Jaber Derakhshandeh (IMEC), Giovanni Capuz (IMEC),
Ingrid De Wolf (IMEC), Eric Beyne (IMEC), Andy Miller (IMEC), Gerald
Beyer (IMEC), and Melina Lofrano (IMEC)
Tight-Pitch Au-Sn Interconnections for 3D-ICs Integration and Packaging Applications
Murugesan Mariappan (Tohoku University), Mitsumasa Koyanagi (Tohoku
University), and Takafumi Fukushima (Tohoku University)

1442

1448

7-µm-Thick NCF Technology with Low-Height Solder Microbump Bonding for 3D Integration 1453
Yuki Miwa (Tohoku University), Kousei Kumahara (Tohoku University),
Sungho Lee (Tohoku University), Rui Liang (Tohoku University), Hisashi
Kino (Tohoku University), Takafumi Fukushima (Tohoku University), andTetsu Tanaka (Tohoku University)
BEOL-Embedded 3D Polylithic Integration: Thermal and Interconnection Considerations
Ankit Kaul (Georgia Institute of Technology), Sreejith Kochupurackal
Rajan (Georgia Institute of Technology), Md Obaidul Hossen (Georgia
Institute of Technology), Gary S. May (Georgia Institute ofTechnology; University of California, Davis), and Muhannad S. Bakir(Georgia Institute of Technology)

1459

Quasi-Ambient Bonding Semiconductor Components for Power Electronics Integration
Yi Zhong (Loughborough University Leicestershire), Allan Yu Liu(Loughborough University Leicestershire), Stuart Robertson(Loughborough University Leicestershire), Shuibao Liang (Loughborough
University Leicestershire), Canyu Liu (Loughborough University
Leicestershire), Zhaoxia Zhou (Loughborough University
Leicestershire), and Changqing Liu (Loughborough University
Leicestershire)

1468

xxxviiDevelopment of CMOS-Compatible Low Temperature Cu Bonding Optimized by the Response
Surface Methodology
1474
Haesung Park (Seoul National University of Science and Technology),
Han Kyeol Seo (Seoul National University of Science and Technology),
Manseok Park (Seoul Technopark), and Sarah Eunkyung Kim (Seoul
National University of Science and Technology)
Design and Simulation of Symmetric Wafer-to-Wafer Bonding Compesating a Gravity Effect 1480
Kyeongbin Lim (Samsung Electronics Company, Ltd.), Minsoo Han (Samsung
Electronics Company, Ltd.), Gwanghee Jo (Samsung Electronics Company,
Ltd.), Hyeonjun Yun (Samsung Electronics Company, Ltd.), Jewon Lee(Samsung Electronics Company, Ltd.), Jun Hyung Kim (Samsung
Electronics Company, Ltd.), SeungDae Seok (Samsung Electronics
Company, Ltd.), and Minwoo Daniel Rhee (Samsung Electronics Company,
Ltd.)

Session 33: Advances in Reliability Assessment
Investigation on the Mechanical Behavior Evolution Occurring in Lead Free Solder Joints
Exposed to Thermal Cycling
Abdullah Fahim (Auburn University), S M Kamrul Hasan (Auburn
University), Jeffrey C. Suhling (Auburn University), and Pradeep Lall
(Auburn University)
Reliability of Homogeneous Sn-Bi and Hybrid Sn-Bi/SAC BGAs
Chongyang Cai (Binghamton University), Jiefeng Xu (Binghamton
University), Huayan Wang (Binghamton University), and Seungbae Park
(Binghamton University)

1486

1496

Empirical Model for the Degradation of IMC in SACQ Solder Bumps During High Temperature
Storage
1502
R. Roucou (NXP Semiconductors), C. Bestory (Nexperia), A. Mavinkurve(NXP Semiconductors), and R.T.H. Rongen (NXP Semiconductors)
Package on System Level Solder Joint Stress Analysis Under Shock Test
Hsin-Chih Shih (Advanced Semiconductor Engineering), Howard TW Liao
(Advanced Semiconductor Engineering), Ryan Chen (Advanced
Semiconductor Engineering), York Liao (Universal Scientific Industrial(USI) Co. Ltd.), David Tarng (Advanced Semiconductor Engineering(ASE), Inc.), and CP Hung (Advanced Semiconductor Engineering (ASE),
Inc.)
An Effective and Application-Specific Evaluation of Low-k Dielectric Integration Integrity
Using Copper Pillar Shear Testing
Arman Ahari (Portland State University), Omar Ahmed (University ofCentral Florida), Peng Su (Juniper Networks), Bernard Glasauer(Juniper Networks), Tengfei Jiang (University of Central Florida), and
Tae-Kyu Lee (Portland State University)
Thermal Aging Induced Underfill Degradation and Its Effect on Reliability of Advanced
Packaging
Faxing X. Che (Institute of Microelectronics A*STAR), X. R. Zhang(Xilinx Asia Pacific Pte. Ltd.), and L. Ji (Institute ofMicroelectronics A*STAR)xxxviii

1509

1517

1525

Stretchability of Serpentine Interconnect on Polymer Substrate for Flexible Electronics: A
Geometry and Material Sensitivity Analysis
Chong Ye (Georgia Institute of Technology), Benjamin G Stewart(Georgia Institute of Technology), and Suresh K. Sitaraman (Georgia
Institute of Technology)

1533

Session 34: Emerging Materials and Processing
Effect of a Backing Material on the Bendability of Flexible Substrates with Passive SMD
Components
Kartik Sondhi (University of Florida), Sai Guruva Reddy Avuthu (Jabil
Inc.), Nathaniel Richards (Jabil Inc.), Z. Hugh Fan (University of
Florida), and Toshikazu Nishida (University of Florida)
Nanowire Impregnated Poly-Dimethyl Siloxane for Flexible, Thermally Conductive Fan-Out
Wafer-Level Packaging
Randall Irwin (University of California, Los Angeles Center for
Heterogeneous Integration and Performance Scaling (UCLA CHIPS)), Yuan
Hu (University of California, Los Angeles Center for Heterogeneous
Integration and Performance Scaling (UCLA CHIPS)), Arsalan Alam
(University of California, Los Angeles Center for Heterogeneous
Integration and Performance Scaling (UCLA CHIPS)), Samatha Benedict(University of California, Los Angeles Center for Heterogeneous
Integration and Performance Scaling (UCLA CHIPS)), Timothy Fisher(University of California, Los Angeles Center for Heterogeneous
Integration and Performance Scaling (UCLA CHIPS)), and SubramanianIyer (University of California, Los Angeles Center for Heterogeneous
Integration and Performance Scaling (UCLA CHIPS))
A Flexible Resistive Pressure Sensor Based on Thermally Expandable Microspheres
Jianing Wu (Fudan University, China), Miao Tang (Fudan University,
China), Haoyue Zhuo (Fudan University, China), Hongkun Lv (State Grid
Zhejiang Electric Research Institute, China), Jiecong Cai (State Grid
Zhejiang Electric Research Institute, China), and Zhuo Li (Fudan
University, China)

1542

1548

1554

Panel Packaging Approach to Micro Thin-Film Battery Sealing for Healthcare and Internet ofThings (IoT) Applications
1560
Qianwen Chen (IBM Corporation), Bing Dang (IBM Corporation), Leanna
Pancoast (IBM Corporation), Jae-woong Nah (IBM Corporation), John
Knickerbocker (IBM Corporation), Andy Shih (Front Edge Technologies
Inc.), Bo Wen Cheng (Front Edge Technologies Inc.), Kai Liu (Front
Edge Technologies Inc.), Mengnian Niu (Front Edge Technologies Inc.),and Simon Nieh (Front Edge Technologies Inc.)
Embedded Power Inductor in Organic Substrate with Novel Magnetic Epoxy
Chi-Hao Chiang (Advanced Semiconductor Engineering, Inc), Thomas Wang
(Advanced Semiconductor Engineering, Inc), Shu-Ting Yang (Advanced
Semiconductor Engineering, Inc), Pao-Nan Lee (Advanced Semiconductor
Engineering, Inc), Wei-Yu Nien (Advanced Semiconductor Engineering,Inc), CT Lee (Advanced Semiconductor Engineering, Inc), Sidney Huang(Advanced Semiconductor Engineering, Inc), and Harrison Chang(Advanced Semiconductor Engineering, Inc)

xxxix

1566

The Real Demonstration of High-Quality Carbon Nano-Tubes (CNTs) as the Electrical
Connection for the Potential Application in a Vertical 3D Integrated Technology
P.-Y. Lu (National Taiwan University), Y.-R. Li (National Taiwan
University), C.-M. Yen (National Taiwan University), H.-T. Hung
(National Taiwan University), C.-R. Kao (National Taiwan University),
W.-C. Pu (National Taiwan University of Science and Technology), C.-C.
A. Chen (National Taiwan University of Science and Technology), M.-H.
Lee (National Taiwan Normal University), and Ming-Han Liao (National
Taiwan University)

1573

Session 35: Additive Manufacturing and Innovative Materials for
Packaging
A Comparative Study of Aerosol Jet Printing on Polyimide and Liquid Crystal Polymer
Substrates for RF Applications
Mohammed Alhendi (Binghamton University), Ashraf Umar (Binghamton
University), El Mehdi Abbara (Binghamton University), Ryan Cadwell(Binghamton University), Nancy Huang (Binghamton University), Darshana
L. Weerawarne (University of Colombo), Peter Borgesen (Binghamton
University), Joseph Iannotti (GE Global Research), Nancy Stoffel (GEGlobal Research), and Mark D. Poliks (Binghamton University)

1579

Development of Integrated Pressure and Temperature Sensing Strips for Monitoring Venous
Leg Ulcer Application
1586
Ruiqi Lim (Institute of Microelectronics), David Sze Wai Choong(Institute of Microelectronics), and Ming-Yuan Cheng (Institute ofMicroelectronics)
Investigation of Pressureless Sintered Interconnections on Plasma Based Additive Copper
Metallization for 3-Dimentional Ceramic Substrates for Surface Acoustic Wave Sensors inHigh Temperature Applications
Christian Schwarzer (Aschaffenburg University of Applied Sciences),
Alexander Hensel (Friedrich-Alexander-University Erlangen-Nuremberg),
Frederik Roth (Aschaffenburg University of Applied Sciences), Joerg
Franke (Friedrich-Alexander-University Erlangen-Nuremberg), andMichael Kaloudis (Aschaffenburg University of Applied Sciences)
Electrical Isolation Performance of Microgasket Technology for Implant Packaging
Paritosh Rustogi (University of Florida) and Jack W. Judy (University
of Florida)

1592

1601

Thermomechanical Reliability Enhancement of High-Power MEMS with Movable Structure Basedon Implanted Skin Hairs
1608
Yunna Sun (Shanghai Jiao Tong University), Yongpeng Wu (Shanghai Jiao
Tong University), Hongfang Li (Shanghai Jiao Tong University), Yan
Wang (Shanghai Jiao Tong University), Zhuoqing Yang (Shanghai Jiao
Tong University), Yuzhuo Fu (Shanghai Jiao Tong University), and Guifu
Ding (Shanghai Jiao Tong University)
Integrated and Discrete Ultra-Thin Capacitors Based on Carbon Nanofibers with HighCapacitance Density
Rickard Andersson (Smoltek AB), Maria Bylund (Smoltek AB), Sascha
Krause (Smoltek AB), Victor Marknäs (Smoltek AB), Amin M Saleem(Smoltek AB), Elisa Passalacqua (Smoltek AB), Mohammad S Kabir(Smoltek AB), and Vincent Desmaris (Smoltek AB)
xl

1614

Role of Grain Size on the Effective Resistivity of Cu-Graphene Hybrid Interconnects
Rahul Kumar (IIT Ropar), Sunil Pathania (IIT Ropar), Surila Guglani(IIT Roorkee), Amit Kumar (IIT Roorkee), Somesh Kumar (ABV-IIITM
Gwalior), Sourajeet Roy (IIT Roorkee), Brajesh Kumar Kaushik (IIT
Roorkee), and Rohit Sharma (Indian Institute of Technology Ropar)

1620

Session 36: Multiphysics and AI-Enhanced Modeling Approaches
Prediction of Fan-out Panel Level Warpage using Neural Network Model with Edge Detection
Enhancement
1626
S. W. Liu (National Tsing Hua University), S. K. Panigrahy (National
Tsing Hua University), and K. N. Chiang (National Tsing Hua
University)
Implementation of General Coupling Model of Electromigration in ANSYS
Zhen Cui (Delft University of Technology), Xuejun Fan (Lamar
University), and Guoqi Zhang (Delft University of Technology)
Learning the Stress-Strain Relationships of Ultra-Thin Package Materials using a BayesianApproach
Cheryl Selvanayagam (Singapore University of Technology and Design;
Advanced Micro Devices (AMD)), Pham Luu Trung Duong (Singapore
University of Technology and Design), and Nagarajan Raghavan(Singapore University of Technology and Design)
Numerical Study of Edge Condensation in Wafer to Wafer Bonding Process with Lattice
Boltzmann Approach
Jung Shin Lee (Samsung Electronics Company, Ltd.), Jun Hyung Kim(Samsung Electronics Company, Ltd.), and Daniel Min Woo Rhee (Samsung
Electronics Company, Ltd.)
Coupled Thermal-Mechanical Simulation Methodology to Estimate BGA Reliability of 2.5D
Packages
Manish Nayini (Marvell Semiconductor), Timothy Horn (GLOBALFOUNDRIES),
Janak Patel (Marvell Semiconductor), and Lloyd Burrell(GLOBALFOUNDRIES)

1632

1638

1646

1653

Three-Dimensional Simulation of Effects of Electro-Thermo-Mechanical Multi-physical Fields
on Cu Protrusion and Performance of Micro-Bump Joints in TSVs Based High Bandwidth Memory(HBM) Structures
1659
Jie-Ying Zhou (South China University of Technology), Zheng Wang
(South China University of Technology), Cheng Wei (South China
University of Technology), Jiu-Bin Fei (South China University ofTechnology), Chang-Bo Ke (South China University of Technology), and
Xin-Ping Zhang (South China University of Technology)

Session 37: New Methods, Techniques and Devices in Packaging
Bending Effects on a Fabric-Based Antenna for Wearable Applications
Hsuan-ling Kao (Chang Gung University) and Chun-Hsiang Chuang (Chang
Gung University)

xli

1665

Progress and Applications of Embedded System in Chip (eSinC®) Technology
Shuying Ma (HuaTian Technology (Kunshan) Electronics Co., Ltd.),
Jianwei Chang (HuaTian Technology (Kunshan) Electronics Co., Ltd.),
Jiao Wang (HuaTian Technology (Kunshan) Electronics Co., Ltd.), Daquan
Yu (Xiamen University), Xiaobing Yang (HuaTian Technology (Kunshan)
Electronics Co., Ltd.), Tony Curtis (HuaTian Technology (Kunshan)
Electronics Co., Ltd.), and Aimo Xiao (HuaTian Technology (Kunshan)
Electronics Co., Ltd.)

1671

Effects of Two-Step Plasma Treatment on Cu and SiO2 Surfaces for 3D Bonding Applications
1677
Han Kyeol Seo (Seoul National University of Science and Technology),
Hae Sung Park (Seoul National University of Science and Technology),
Gahui Kim (Andong National University), Young-Bae Park (Andong
National University), and Sarah Eunkyung Kim (Seoul National
University of Science and Technology)
A Study of the Board Level Reliability of Large 16FF Wafer Level Package for RF
Transceivers
Andreas Wolter (Intel Deutschland GmbH), Horst Baumeister (Intel
Deutschland GmbH), Ceren Yeni (Intel Deutschland GmbH), Bernd Waidhas(Intel Deutschland GmbH), Jan Proschwitz (Intel Deutschland GmbH),
Thomas Wagner (Intel Deutschland GmbH), and Beth Keser (Intel
Deutschland GmbH)

1684

Application of Package-Level High-Performance EMI Shield Material with a Novel NozzlelessSpray Coating Technology
1691
Stuart Erickson (Ultrasonic Systems, Inc.) and Mike Sakaguchi (Tatsuta
Wire & Chemical Co., Ltd.)A Highly Reliable Die Bonding Approach for high Power Devices by Low Temperature
Pressureless Sintering using a Novel Cu Nanoparticle Paste
Hai-Jun Huang (South China University of Technology), Xue Wu (South
China University of Technology), Min-Bo Zhou (South China Universityof Technology), and Xin-Ping Zhang (South China University ofTechnology)
Integration of GaN-LEDs with Heterogeneous Device Components by Epitaxil Film Bonding
Mitsuhiko Ogihara (Filnex Corporation Hachioji, Japan), Yoshiteru
Amemiya (Hiroshima University), and Shin Yokoyama (Hiroshima
University)
Evaluation of ICP Sputter Etch with Reducing Atmosphere for the Improvement of Rc in
UBM/RDL Applications
Patrik Carazzetti (Evatec AG), Juergen Weichart (Evatec AG), Andreas
Erhart (Evatec AG), Mohamed Elghazzali (Evatec AG), and Ewald Strolz(Evatec AG)

1697

1703

1711

Chip/Package/Board Co-Design Methodology Applied to Full-Custom Heterogeneous Integration
1718
Thomas Brandtner (Infineon Technologies Austria AG, Austria), Klaus
Pressel (Infineon Technologies AG, Germany), Natalia Floman (Infineon
Technologies Austria AG, Austria), Michael Schultz (Infineon
Technologies AG, Germany), and Michael Vogl (Infineon Technologies AG,
Germany)xlii

3D FOWLP Integration
Teck Guan Lim (Institute of Microelectronic), David Soon Wee Ho(Institute of Microelectronic), Chai Tai Chong (Institute ofMicroelectronic), and Surya Bhattacharya (Institute ofMicroelectronic)
Impact of Electroless-Ni Seed Layer on Cu-Bottom-up Electroplating in High Aspect Ratio(>10) TSVs for 3D-IC Packaging Applications
Murugesan Mariappan (Tohoku University), Mitsumasa Koyanagi (Tohoku
University), and Takafumi Fukushima (Tohoku University)

1728

1736

Session 38: 5G, mm-Wave and RF Packaging
Stripline-Slotline Rectangular Resonators for Measurement of Uniaxial Anisotropic
Permittivity of Composite PCB Dielectric Material
Zhaoqing Chen (IBM Corporation)
High Bandwidth and Multi-channel Power over Coaxial Filters for Automotive Low-Voltage
Differential Signaling Interconnect
Yutaka Uematsu (The Center for Technology Innovation, Hitachi, Ltd.,
Japan) and Hideyuki Sakamoto (Smart Digital Solution Business
Development Division, Hitachi Ltd., Japan)

1742

1749

"Molded-Package-Last" Process for Fan-out System in Package (FO-SiP)
Tomoaki Shibata (Hitachi Chemical Co., Ltd.), Tsuyoshi Ogawa (Hitachi
Chemical Co., Ltd.), Xinrong Li (Hitachi Chemical Co., Ltd.), Satoshi
Yoneda (Hitachi Chemical Co., Ltd.), Naoya Suzuki (Hitachi ChemicalCo., Ltd.), and Toshihisa Nonaka (Hitachi Chemical Co., Ltd.)

1757

A Pen-Writable Electroless Plating Method for Large-Area RF Circuit Applications
Yihang Chu (Michigan State University) and Premjeet Chahal (Michigan
State University)

1763

Extracting Power Supply Current Profile by using Interposer-Based Low-Noise Probing
Technique for PDN Design of High-Density POP
Heeseok Lee (Samsung Electronics, Co. Ltd.), Hoi-Jin Lee (Samsung
Electronics, Co. Ltd.), Jisoo Hwang (Samsung Electronics, Co. Ltd.),
Taekeun An (Samsung Electronics, Co. Ltd.), Seokjoon Hong (Samsung
Electronics, Co. Ltd.), and Youngmin Shin (Samsung Electronics, Co.
Ltd.)
Design and Fabrication of Band-Pass Filter on Glass IPD for 5G New Radio
Pan-Nan Lee (Advanced Semiconductor Engineering (ASE), Inc.), Yu-Chang
Hsieh (Advanced Semiconductor Engineering (ASE), Inc.), Sheng-Chi
Hsieh (Advanced Semiconductor Engineering (ASE), Inc.), Cheng-Yuan
Kung (Advanced Semiconductor Engineering (ASE), Inc.), and Chen-Chao
Wang (Advanced Semiconductor Engineering (ASE), Inc.)

1769

1775

A new C-FDFD Method Capturing Per-Unit Length Parameter of Quasi-TEM Mode Transmission
Line with Reduced Computational Resource
1781
Heeseok Lee (Samsung Electronics, Co. Ltd.), Jisoo Hwang (Samsung
Electronics, Co. Ltd.), and Taekeun An (Samsung Electronics, Co. Ltd.)

xliii

Antenna on Silicon Interconnect FabricArpan Dasgupta (University of California, Los Angeles), Arsalan Alam
(University of California, Los Angeles), Guangqi Ouyang (University ofCalifornia, Los Angeles), SivaChandra Jangam (University ofCalifornia, Los Angeles), and Subramanian S. Iyer (University ofCalifornia, Los Angeles)

1788

Low Loss BT Resin for Substrates in 5G Communication Module
Katsuya Yamamoto (Mitsubishi Gas Chemical Company, Inc.), Shouta Koga
(Mitsubishi Gas Chemical Company, Inc.), Saori Seino (Mitsubishi Gas
Chemical Company, Inc.), Kazuyuki Higashita (Mitsubishi Gas Chemical
Company, Inc.), Keiichi Hasebe (Mitsubishi Gas Chemical Company,
Inc.), Eisuke Shiga (Mitsubishi Gas Chemical Company, Inc.), Tsuyoshi
Kida (Mitsubishi Gas Chemical Company, Inc.), and Syu Yoshida(Mitsubishi Gas Chemical Company, Inc.)

1795

Demonstration of a Low Latency (<20 ps) Fine-Pitch (≤10 µm) Assembly on the Silicon
Interconnect Fabric
SivaChandra Jangam (University of California, Los Angeles), Uneeb
Rathore (University of California, Los Angeles), Sumeet Nagi
(University of California, Los Angeles), Dejan Markovic (University ofCalifornia, Los Angeles), and Subramanian Iyer (University ofCalifornia, Los Angeles)

1801

Beamforming Design using Millimeter Wave Dual-Polarized FSS Transmit-Array for 5G Small
Cell Base-Station Applications
1806
Chi-Hau Yang (National Sun Yat-Sen University), Chung-Yi Hsu (National
Sun Yat-Sen University), Hung-Wei Chung (National Sun Yat-Sen
University), and Lih-Tyng Hwang (National Sun Yat-Sen University)
Guided-Mode Resonance Filter for Micro-Optic Spectrometer
Junichi Inoue (Kyoto Institute of Technology), Shogo Ura (Kyoto
Institute of Technology), and Kenji Kintaka (National Institute ofAdvanced Industrial Science and Technology)

1812

Wideband Low-Profile AMC-Based Patch Antenna for 5G Antenna-in-Package Application
Weikang Wan (Institute of Microelectronics of Chinese Academy of
Sciences), Mei Xue (Institute of Microelectronics of Chinese Academyof Sciences), Liqiang Cao (Institute of Microelectronics of Chinese
Academy of Sciences), Tianchun Ye (Institute of Microelectronics ofChinese Academy of Sciences), and Qidong Wang (Institute ofMicroelectronics of Chinese Academy of Sciences)

1818

Flexible Inkjet-Printed Patch Antenna Array on Mesoporous PET Substrate for 5G
Applications with Stable RF Performance After Mechanical Stress Cycling
Gurvinder Singh Khinda (Binghamton University), Ashraf Umar
(Binghamton University), Ryan J. Cadwell (Binghamton University),
Mohammed Alhendi (Binghamton University), Nancy C. Stoffel (General
Electric Research Center), Peter Borgesen (Binghamton University), andMark D. Poliks (Binghamton University)

xliv

1824

Session 39: Current Trends in High Speed Interconnects
High Bandwidth Low Power 2.5D Interconnect Modeling and Design
Qian Ding (Intel Corporation), Hui Liu (Intel Corporation), Yee Huan
Yew (Intel Corporation), and Jenny Jiang (Intel Corporation)

1832

Irregular Bumps Design Planning for Modern Ball Grid Array Packages
Hsin-Yu Chang (National Chiao Tung University), Hung-Ming Chen(National Chiao Tung University), Yun-Chih Kuo (MediaTek Inc.,
Taiwan), Hsien-Ting Tsai (MediaTek Inc., Taiwan), Simon Yi-Hung Chen
(MediaTek Inc., Taiwan), Jyun-Ru Jiang (National Chiao Tung
University), Ya-Ying Chien (National Chiao Tung University), andYu-Yang Chen (MediaTek Inc., Taiwan)

1838

3D Composite Glass-Silicon Interposer Integrated with Polymer Arrayed Waveguide Grating 1844
Ziji Wang (Southeast University) and Jintang Shang (Southeast
University)
Design and Validation of Reliability Physics for Interconnect Architectures Induced from
Inclusive TM/SM/EM Effects
Chang-Chun Lee (National Tsing Hua University), Jui-Chang Chuang(National Tsing Hua University), Steve Chiu (Industrial Technology
Research Institute), Shau-Fei Cheng (Industrial Technology ResearchInstitute), Chen-Tsai Yang (Industrial Technology Research Institute),
and Wei-Yuan Cheng (Industrial Technology Research Institute)Pressureless Transient Liquid Phase Sintering Bonding using SAC305 with Hybrid Ag
Particles for High–Temperature Packaging Applications
Byeong-Uk Hwang (Sungkyunkwan University), Kyung Deuk Min(Sungkyunkwan University), Kwang-Ho Jung (Sungkyunkwan University),
Choong-Jae Lee (Sungkyunkwan University), Jae-Ha Kim (Sungkyunkwan
University), and Seung-Boo Jung (Sungkyunkwan University)
Demonstration of Superconducting Interconnects on the Silicon Interconnect Fabric Using
Thermocompression Bonding
Yu-Tao Yang (University of California, Los Angeles), Chaowei Hu(University of California, Los Angeles), Jazmine Green (University ofCalifornia, Los Angeles), Peng Zhang (University of California, Los
Angeles), Niloofar Shakoorzadeh (University of California, Los
Angeles), Pranav Ambhore (University of California, Los Angeles),Umesha Mogera (University of California, Los Angeles), Ni Ni(University of California, Los Angeles), Kang L. Wang (University ofCalifornia, Los Angeles), and Subramanian S. Iyer (University ofCalifornia, Los Angeles)
Embedded 3D-IPD Technology Based on Conformal 3D-RDL: Application for Design andFabrication of Compact, High-Performance Diplexer and Ultra-Wide Band Balun
Ayad Ghannam (3DiS Technologies S.A.S, France), Alessandro Magnani(3DiS Technologies S.A.S, France), David Bourrier (3DiS Technologies
S.A.S, France), and Thierry Parra (3DiS Technologies S.A.S, France)
Tri-Axis Polarized Loop Antenna for mmWave Wireless Inter/Intra Chip Communications
Hae-in Kim (University of Florida), Renuka Bowrothu (University of
Florida), and Yong-Kyu Yoon (University of Florida)

xlv

1849

1855

1861

1867

1875

Growth Mechanism of Interfacial IMCs on (111) Preferred Orientation Nanotwinned Cu UBM for
3D IC Packaging
1881
M.L. Huang (Dalian University of Technology) and Y. Wu (Dalian
University of Technology)
3D Micro Bump Interface Enabling Top Die Interconnect to True Circuit Through Silicon Via
Wafer
Nistec Chang (Siliconware Precision Industries Co., Ltd.), C. Key
Chung (Siliconware Precision Industries Co., Ltd.), Yu-Po Wang
(Siliconware Precision Industries Co., Ltd.), C. F. Lin (Siliconware
Precision Industries Co., Ltd.), PJ Su (Siliconware Precision
Industries Co., Ltd.), Teny Shih (Siliconware Precision Industries
Co., Ltd.), Nicholas Kao (Siliconware Precision Industries Co., Ltd.),
and Joe Hung (Siliconware Precision Industries Co., Ltd.)
Visualization and Modeling of Microstructural Evolution in SAC305 BGA Joints During
Extreme High Temperature Aging
KM Rafidh Hassan (Auburn University), Mohammad Alam (Auburn
University), Jing Wu (Auburn University), Jeffrey Suhling (Auburn
University), and Pradeep Lall (Auburn University)

1888

1894

Session 40: Manufacturing Techniques for Advanced Packaging
Study on Advanced Substrate for Double-Side Package to Reduce Module Size
Ji-Hee Kim (Daeduck Electronics Co. Ltd.), Kwan-Sun Yoon (Daeduck
Electronics Co., Ltd.), Hwa-Dong Oh (Daeduck Electronics Co., Ltd.),
Eun-Chul Ahn (Daeduck Electronics Co., Ltd.), Young-Hwan Shin (Daeduck
Electronics Co., Ltd.), and Young-Jae Kim (Daeduck Electronics Co.,Ltd.)
A New RDL-First PoP Fan-Out Wafer-Level Package Process with Chip-to-Wafer Bonding
Technology
SeungNam Son (Amkor Technology Korea, Inc.), DongHyun Khim (Amkor
Technology Korea, Inc.), SeokHun Yun (Amkor Technology Korea, Inc.),
JunHwan Park (Amkor Technology Korea, Inc.), EunTaek Jeong (Amkor
Technology Korea, Inc.), JiHun Yi (Amkor Technology Korea, Inc.),
JinKun Yoo (Amkor Technology Korea, Inc.), KiYeul Yang (Amkor
Technology Korea, Inc.), MinJae Yi (Amkor Technology Korea, Inc.),
SangHyoun Lee (Amkor Technology Korea, Inc.), WonChul Do (Amkor
Technology Korea, Inc.), and JinYoung Khim (Amkor Technology Korea,
Inc.)
Growth Kinetics of Intermetallic Compound Layers at the Interface During Laser-Assisted
Bonding Depending on Surface Finish
Hong-Sub Joo (Sungkyunkwan University, SAMSUNG Electronics), Kyung
Deuk Min (Sungkyunkwan University), Choong-Jae Lee (Sungkyunkwan
University), Byeong-Uk Hwang (Sungkyunkwan University), and Seung-Boo
Jung (Sungkyunkwan University)

xlvi

1904

1910

1916

Processing Glass Substrate for Advanced Packaging using Laser Induced Deep Etching
Rafael Santos (LPKF Laser & Electronics AG, Germany), Jean-Pol Delrue(LPKF Laser & Electronics AG, Germany), Norbert Ambrosius (LPKF Laser& Electronics AG, Germany), Roman Ostholt (LPKF Laser & Electronics
AG, Germany), and Stephan Schmidt (LPKF Laser & Electronics AG,
Germany)1922

A Study on Laser-Assisted Bonding (LAB) and Its Influence on Luminescence Characteristics
of Blue and YAG Phosphor Encapsulated InGaN LEDs
1928
Matthias Fettke (PacTech GmbH), Andrej Kolbasow (PacTech GmbH), Vinith
Bejugam (PacTech GmbH), Timo Kubsch (PacTech GmbH), Alexander Frick(PacTech GmbH), Thorsten Teutsch (PacTech GmbH), Yu-Chung Wang (Inkron
Limited), and Juha Rantala (Inkron Limited)
Study of Solder Interconnect Configurations and Performance of Vertical Laser Assisted
Assembled "3.5D" Packages
Kolbasow Andrej (Pac Tech GmbH), Fettke Matthias (Pac Tech GmbH),
Kubsch Timo (Pac Tech GmbH), Bejugam Vinith (Pac Tech GmbH), andTeutsch Thorsten (Pac Tech GmbH)1936

High-Speed Ultra-Accurate Direct C2W Bonding
Birgit Brandstätter (Besi Austria GmbH), Daniel Aschenwald (Besi
Austria GmbH), Benedikt Auer (Besi Austria GmbH), Norbert Bilewicz(Besi Austria GmbH), Ruurd Boomsma (Besi Austria GmbH), ChristophKröll (Besi Austria GmbH), Andreas Mayr (Besi Austria GmbH), Richard
Neumayr (Besi Austria GmbH), Hannes Rieser (Besi Austria GmbH), MarioSchernthaner (Besi Austria GmbH), Hubert Selhofer (Besi Austria GmbH),
Florian Speer (Besi Austria GmbH), Peter Unterwaditzer (Besi AustriaGmbH), András Vidéki (Besi Austria GmbH), Martin Widauer (Besi AustriaGmbH), and Thomas Widmann (Besi Austria GmbH)

1943

Strategies Relating to CMP for Die to Wafer Interconnects Utilizing Hybrid Direct Bonding
Jonatan A. Sierra Suarez (Sandia National Laboratories), John P.
Mudrick (Sandia National Laboratories), Crystal C. Sennett (Sandia
National Laboratories), T. A. Friedmann (Sandia National
Laboratories), Shawn Arterburn (Sandia National Laboratories), Matthew
B. Jordan (Sandia National Laboratories), Lisa Caravello (Sandia
National Laboratories), Jordan E. Gutierrez (Sandia National
Laboratories), and M. David Henry (Sandia National Laboratories)

1950

New Molding Technology Enabling Advanced Packaging Technology
Takashi Saito (APIC YAMADA Corporation), Tokuyuki Kitajima (APIC
YAMADA Corporation), Makoto Kawaguchi (APIC YAMADA Corporation),
Shinya Tajima (APIC YAMADA Corporation), and Masashi Okamoto (APIC
YAMADA Corporation)

1957

Development of Compression Molding Process for Fan-Out Wafer Level Packaging
Julien Bertheau (IMEC), Fabrice Duval (IMEC), Tadashi Kubota (Towa),
Bex Pieter (IMEC), Koen Kennes (IMEC), Alain Phommahaxay (IMEC),
Arnita Podpod (IMEC), Eric Beyne (IMEC), Andy Miller (IMEC), andGerald Beyer (IMEC)1965

LTCC PoP Technology Based Novel Approach for mm-Wave 5G System for Next Generation
Communication System
1973
Surender Singh (Cadence Design System) and Taranjit Kukal (Cadence
Design System)xlvii

Session 41: Characterization and Analysis of Packaging Materials
Autocatalytic Tin – How to Overcome Process Limitations to Introduce a New Solution for
Thick Tin Plating
Kuldip Johal (Atotech USA LLC), Britta Schafsteller (Atotech
Deutschland GmbH), Gustavo Ramos (Atotech Deutschland GmbH), Kadir
Tuna (Atotech Deutschland GmbH), and Sandra Nelle (Atotech Deutschland
GmbH)

1979

A Handling Solution for Easy Processing of Thin Glass with TGV
Shelby F Nelson (Mosaic Microsystems), David H Levy (Mosaic
Microsystems), and Aric B Shorey (Mosaic Microsystems)

1986

Printing Unifrom QDs Polymer Thin Film for QLED Application
Ning Tu (The Hong Kong University of Science and Technology), Jeffery
C.C. Lo (The Hong Kong University of Science and Technology), and Shi
Wei Lee (The Hong Kong University of Science and Technology)

1992

Ultrasonic-Assisted Nano Ag-Al Alloy Sintering to Enable High-Temperature Electronic
Interconnections
Canyu Liu (Loughborough University), Allan Liu (Loughborough
University), Yi Zhong (Loughborough University), Stuart Robertson(Loughborough University), Zhaoxia Zhou (Loughborough University), andChangqing Liu (Loughborough University)
The Influence of Different-Sized Ni Micro-and Nanopowders on the Processing andMicrostructural Properties of Sn-Ag-Cu-Solder with Low Ag Content
Simon Keim (Technische Hochschule Ingolstadt), Ulrich Tetzlaff(Technische Hochschule Ingolstadt), and Gordon Elger (Technische
Hochschule Ingolstadt)
Effective Thermal Solution via Wafer Level Packaging Materials
Junghwa Kim (Samsung SDI), Wool-Chul Na (Samsung SDI), JungSeob Kim(Samsung SDI), Sumi Im (Samsung SDI), Dong-Hwan Lee (Samsung SDI),
Sanghak Lim (Samsung SDI), and Sang-Kyun Kim (Samsung SDI)
Synthesis of Boron Nitride Coated Silica Filler for Preparing Thermally Conductive Epoxy
Composites
Jiaxiong Li (Georgia Institute of Technology), Yanjuan Ren (Georgia
Institute of Technology), Dong An (Georgia Institute of Technology),
Kyoung-sik Moon (Georgia Institute of Technology), and Ching-ping Wong
(Georgia Institute of Technology)
Characteristics of Plasma-Activated Dielectric Film Surfaces for Direct Wafer Bonding
Seongmin Son (Samsung Electronics Co., Ltd), Junhong Min (Samsung
Electronics Co., Ltd), Eunsuk Jung (Samsung Electronics Co., Ltd),
Hoechul Kim (Samsung Electronics Co., Ltd), Taeyeong Kim (Samsung
Electronics Co., Ltd), Hyungjun Jeon (Samsung Electronics Co., Ltd),
Jinnam Kim (Samsung Electronics Co., Ltd), Seokho Kim (Samsung
Electronics Co., Ltd), Kwangjin Moon (Samsung Electronics Co., Ltd),
Hoonjoo Na (Samsung Electronics Co., Ltd), Kihyun Hwang (Samsung
Electronics Co., Ltd), and Geun Young Yeom (Sungkyunkwan University)

xlviii

1999

2005

2013

2019

2025

Molecular Dynamics Study of the Influence of Aggregation and Percolation in
Al2O3/polyethylene Oxide Nanofluids on the Effective Thermal Conductivity.
Barbara Poliks (Binghamton University) and Bahgat Sammaki (Binghamton
University)
Curekinetic Modeling of Interfacial Reactions between Epoxy and Silica Filler Suspension
System in Non-Conductive Paste (NCP) for 3DIC Packaging
Min Woo Rhee (Mechatronics R&D Center, Samsung Electronics)
Evolution of the Properties of SAC-Bi-Ni-Sb Lead Free Solder During Mechanical Cycling
Mohd Aminul Hoque (Auburn University), Mohammad Ashraful Haq (Auburn
University), Md Mahmudur Chowdhury (Auburn University), Jeffrey C.
Suhling (Auburn University), and Pradeep Lall (Auburn University)

2033

2040
2048

Session 42: Thermo-Mechanical Effects in Packaging
Turbulent Flows Impinging on High Power Multi-chip Bare Die Package
Prabhakar Subrahmanyam (Intel Corporation) and Ying-Feng Pang (Intel
Corporation)

2058

Warpage and Void Simulation of System in Package
Eric Ouyang (JCETglobal), Yonghyuk Jeong (JCET Group), JaeMyong Kim(JCET Group), Susan Lin (Moldex3D), Jay Vang (Moldex3D), and Anthony
Yang (Moldex3D)

2066

Thermal and Power Delivery Aware Floorplanning for Heterogeneous Multi Core Design
Yunhyeok Im (Samsung Electronics), Young-Sang Cho (Samsung
Electronics), Jisoo Hwang (Samsung Electronics), Heeseok Lee (Samsung
Electronics), Jongkyu Yoo (Samsung Electronics), James Jung (Samsung
Electronics), Heejung Choi (Samsung Electronics), Yohan Kwon (Samsung
Electronics), Hoi-Jin Lee (Samsung Electronics), and Youngmin Shin(Samsung Electronics)

2072

Thermal Analysis, Characterization and Material Selection for SiC Based Intelligent Power
Modules
Gongyue Tang (Institute of Microelectronics), Leong Ching Wai(Institute of Microelectronics), Siak Boon Lim (Institute ofMicroelectronics), Boon Long Lau (Institute of Microelectronics),
Kazunori Yamamoto (Institute of Microelectronics), and Xiao Wu Zhang(Institute of Microelectronics)
Finite Element Modeling Methodology for Monotonic Bend Test of Flip-Chip BGA Package
Scott McCann (Xilinx, Inc.), Tom Lee (Xilinx, Inc.), and Suresh
Ramalingam (Xilinx, Inc.)

2078

2086

Constant Poisson's Ratio of Thermosetting Polymers: Is it Reasonable for Accurate Thermal
Stress Analysis?
2092
Hyun Lee (University of Maryland), Sukrut Phansalkar (University of
Maryland), and Bongtae Han (University of Maryland)
Panel Warpage and Die Shift Simulation and Characterization of Fan-Out Panel-Level
Packaging
Che Faxing (Institute of Microelectronics, A*STAR), Kazunori Yamamoto(Institute of Microelectronics, A*STAR), and Vempati Srinivasa Rao(Institute of Microelectronics, A*STAR)

xlix

2097

Thermal Management of Glass Panel Embedded Packages: Package Architecture vs. PowerDensity2105
Ryan Wong (Georgia Institute of Technology), Siddharth Ravichandran(Georgia Institute of Technology), Haksun Lee (Georgia Institute ofTechnology), and Vanessa Smet (Georgia Institute of Technology)
Electromechanical Finite Element Analysis for Designed Low-Frequency MEMS PiezoelectricVibration Energy Harvester
2112
Ling Xu (Fudan University, China), Shengrui Zhou (Fudan University,
China), Yingfei Xiang (Fudan University, China), and Yinglin Yang
(Fudan University, China)

Session 43: Reliability and Failure Analyses of Emerging Materials
The Board Level Reliability Performance and Process Challenges of Ultra-Thin WLP (Package
Height < 250 µm)
2118
Kuei Hsiao Kuo Frank (SPIL, Taiwan R.O.C.), Chun Yi Chiang (SPIL,
Taiwan R.O.C.), Kuang Hsin Chen (SPIL, Taiwan R.O.C.), Ting-en Lin(SPIL, Taiwan R.O.C.), Stan Chen (SPIL, Taiwan R.O.C.), and Feng Lung
Chien (SPIL, Taiwan R.O.C.)
Moisture Effect on Physical Failure of Plastic Molded SiP Module
Jeffrey ChangBing Lee (iST), Cheng-Chih Chen (iST), Dem Lee (iST), andJess Chen (iST)
Outstanding Reliability Performances of Silicon Capacitors for 200°C Automotive
Applications
Sebastien Jacqueline (Murata Integrated Passive Solutions), Catherine
Bunel (Murata Integrated Passive Solutions), and Laurent Lengignon(Murata Integrated Passive Solutions)

2124

2133

Robustness of Carbon Nanofiber-Based MIM Capacitors with Ultra-High Capacitance Density toElectrical and Thermal Stress
2139
Maria Bylund (Smoltek AB), Rickard Andersson (Smoltek AB), Sascha
Krause (Smoltek AB), Amin M Saleem (Smoltek AB), Victor Marknäs(Smoltek AB), Elisa Passalacqua (Smoltek AB), M Shafiq Kabir (Smoltek
AB), and Vincent Desmaris (Smoltek AB)
Assembly Technologies for Piezoelectric Sensors up to 1000 °C
Fabian Kohler (University of Freiburg, IMTEK) and Jürgen Wilde(University of Freiburg, IMTEK)

2145

45RFSOI WLCSP Board Level Package Risk Assessment and Solder Joint Reliability Performance
Improvement
2151
Haojun Zhang (GlobalFoundries US Inc.), Zhuo-Jie Wu (GlobalFoundries
US Inc.), John Malinowski (GlobalFoundries US Inc.), Millete Carino(GlobalFoundries US Inc.), Kristina Young-Fisher (GlobalFoundries US
Inc.), Jean Trewhella (GlobalFoundries US Inc.), and Patrick Justiso(GlobalFoundries US Inc.)lA Study of Electromechanical Behaviors of Printed Conductive Leads on Stretchable Textiles
for Smart Clothing
2157
K. U. S. Somarathna (The State University of New York at Binghanton),
B. Garakani (The State University of New York at Binghamton), M.
Alhendi (The State University of New York at Binghamton), E.
Enakerakpo (The State University of New York at Binghamton), P.
Borgesen (The State University of New York at Binghamton), M.D. Poliks(The State University of New York at Binghamton), and A. Alizadeh(General Electric Global Research)
Effects of Process Parameters and Isothermal Fatigue Cycling on Electromechanical
Properties of Screen-Printed Interconnect on Nonwovens for Wearable Electronics
Behnam Garakani (Binghamton University), Kankanige Udara S. Somarathna(Binghamton University), Gurvinder Singh Khinda (Binghamton
University), Emuobosan Enakerakpo (Binghamton University), Mohammed
Alhendi (Binghamton University), Mark D. Poliks (Binghamton
University), Peter Borgesen (Binghamton University), and Azar Alizadeh(General Electric Global Research Center)
Investigation of the Mechanical Behavior of SAC305 Solder Joints at Extreme High
Temperatures Using Nanoindentation
Mohammad S. Alam (Auburn University), KM Rafidh Hassan (Auburn
University), Abdullah Fahim (Auburn University), Jing Wu (Auburn
University), Jeffrey C. Suhling (Auburn University), Pradeep Lall
(Auburn University), and Sudan Ahmed (Auburn University)

2167

2175

Session 44: Optoelectronics, Flex and Emerging Technologies
Controls on the Transport of Particles/Cells in Deterministic Lateral Displacement via
Symmetric Airfoil with Angle of Attacks
Kawkab Ahasan (Washington State University), Brian Senf (Washington
State University), and Jong-Hoon Kim (Washington State University)

2185

Optical Platform for Highly Precise Optical Components
Sebastian Bengsch (Leibniz University Hannover), Eike Fischer (Leibniz
University Hannover), Sascha de Wall (Leibniz University Hannover),
Timo Schelm (Leibniz University Hannover), Matthias Arndt (Leibniz
University Hannover), and Marc Christopher Wurz (Leibniz University
Hannover)2191

A Design and Fabrication of Transmission Line for eSiFO in Millimeter-Wave Applications
Shengjuan Zhou (Tsinghua University), Jian Cai (Tsinghua University;
Beijing National Research Center for Information Science andTechnology), Qian Wang (Tsinghua University; Beijing National ResearchCenter for Information Science and Technology), Xiuyu Shi (Tsinghua
University), Xuesong Zhang (Tsinghua University), Changming Song(Tsinghua University), and Yu Chen (Tsinghua University)

2197

li

Low Power SOC Based on High Density MIM Capacitor for Beyond Moore Era by Robust Power
Integrity Achievement
2203
Jisoo Hwang (Samsung Electronics, Co. Ltd.), Hoi-Jin Lee (Samsung
Electronics, Co. Ltd.), Hyun-Jong Lee (Samsung Electronics, Co. Ltd.),
Heeseok Lee (Samsung Electronics, Co. Ltd.), Minkyu Mike Kim (Samsung
Electronics, Co. Ltd.), and Youngmin Shin (Samsung Electronics, Co.
Ltd.)
Design of Optical Transmitter Module for O-Band Silicon Photonic Engine
Hsien Wu (National Kaohsiung University of Science and Technology),
Pei-Hao Tseng (Teratech Optical Communication Inc.), Chun-Nien Liu(National Chung Hsing University), Jau-Ji Jou (National Kaohsiung
University of Science and Technology), Wood - Hi Cheng (National Chung
Hsing University), Yaw-Dung Wu (National Kaohsiung University of
Science and Technology), Po-Jui Chiang (National Kaohsiung Universityof Science and Technology), Ting-Jen Hsueh (National Kaohsiung
University of Science and Technology), and Tien-Tsorng Shih (National
Kaohsiung University of Science and Technology)
Flexible Batteries Under Dynamic Folding and Flex-to-Install with Varying C-Rates andTemperatures
Pradeep Lall (Auburn University), Ved Soni (Auburn University), andScott Miller (NextFlex National Manufacturing Institute)

2209

2215

An Embedded SiC Module with Using NMPB Interconnection for Chevron Shaped Cu Lead andElectrodes
2226
Naoki Fukui (Waseda University), Keiko Koshiba (Waseda University),
Itaru Miyazaki (Waseda University), Isamu Morisako (Waseda
University), Tomonori Iizuka (Waseda University), Tomoya Itose (Kyushu
Institute of Technology), Masayuki Hikita (Kyushu Institute ofTechnology), Rikiya Kamimura (Kitakyushu Foundation for the
Advancement of Industry, Science and Technology, Japan), and Kohei
Tatsumi (Waseda University)
Design, Fabrication and Characterization of a Q-Band Patch Antenna Integrated on Stacked
Interposers
2230
Yunheng Sun (Peking University), Yufeng Jin (Peking University),
Tingting Lian (Xiamen University), Shenglin Ma (Xiamen University),
Yuchi Yang (Peking University), Wei Wang (Peking University), Liulin
Hu (Chengdu Ganide Technology CO., Ltd), and Shuwei He (Chengdu Ganide
Technology CO., Ltd)

Session 45: Student Session
A Design Flow for Micro Bump and Stripe Planning on Modern Chip-Package Co-Design
Ming-Yu Huang (National Chiao Tung University), Hung-Ming Chen(National Chiao Tung University), Kuan-Neng Chen (National Chiao Tung
University), Shih-Hsien Wu (Industrial Technology Research Institute),
Yu-Min Lee (National Chiao Tung University), and An-Yu Su (National
Chiao Tung University)

lii

2236

Planar-Radial Structured Thermoelectric Cooler for Local Hot Spot Cooling in Mobile
Electronics
Cheol Kim (Seoul National University, Republic of Korea), Haishan Shen
(Sungkyunkwan University, Republic of Korea), Jeonglim Yoon
(Soonchunhyang University, Republic of Korea), Min-Woo Jeong (Seoul
National University, Republic of Korea), Sungtae Kim (Seoul National
University, Republic of Korea), Seung-Hyun Oh (Seoul National
University, Republic of Korea), So-Yeon Lee (Seoul National
University, Republic of Korea), Hoojeong Lee (Sungkyunkwan University,
Republic of Korea), Youngcheol Joo (Soonchunhyang University, Republicof Korea), and Young-Chang Joo (Seoul National University, Republic ofKorea)

2242

Preparation of Autonomously Self-Healing Electrode Based on Double Network Supramolecular
Elastomer
2247
Miao Tang (Fudan University), Jianing Wu (Fudan University), Kaiqing
Wang (Fudan University), Mingliang Ying (State Grid Zhejiang ElectricResearch Institute), Hongkun Lv (State Grid Zhejiang Electric ResearchInstitute), and Zhuo Li (Fudan University)
Investigation of Underfilling BGAs Packages – Thermal Fatigue
Van Lai Pham (Binghamton University), Jiefeng Xu (Binghamton
University), Huayan Wang (Xilinx), Ke Pan (Binghamton University),
Charandeep Singh (Corning), Jing Wang (Binghamton University), andSeungbae Park (Binghamton University)
Design and Fabrication of an Ultra-Thin Silicon Vapor Chamber for Compact Electronic
Cooling
Quentin Struss (Université de Sherbrooke, Canada), Perceval Coudrain(CEA-LETI, France), Jean-Philippe Colonna (CEA-LETI, France),
Abdelkader Souifi (Institut des Nanotechnologies de Lyon, France),
Christian Gontrand (Institut des Nanotechnologies de Lyon, France),
Édouard Deschaseaux (CEA-LETI, France), Gaëlle Mauguen (CEA-LETI,France), Vincent Mathieu (CEA-LETI, France), Thomas Magis (CEA-LETI,France), Gilles Simon (CEA-LETI, France), and Luc G. Fréchette(Université de Sherbrooke, Canada)
Impact of Viscoelastic Properties of Low Loss Printed Circuit Boards (PCBs) on Reliabilityof WCSP Packages Under Drop Test
Akshay Lakshminarayana (University of Texas at Arlington), Abel Misrak(University of Texas at Arlington), Rabin Bhandari (University ofTexas at Arlington), Tushar Chauhan (University of Texas at
Arlington), A S M Raufur Chowdhury (University of Texas at Arlington),and Dereje Agonafer (University of Texas at Arlington)

liii

2252

2259

2266

Design of 4-Channel 25 Gbaud/s PAM-4 Optical Transmitter Module for Short Reach
Applications
I-Cheng Hou (National Kaohsiung University of Science and Technology),
Pei-Hao Tseng (Teratech Optical Communication Inc.), Jau-Ji Jou(National Kaohsiung University of Science and Technology), Chung-Han
Chang (National Kaohsiung University of Science and Technology),
Yaw-Dung Wu (National Kaohsiung University of Science and Technology),
Po-Jui Chiang (National Kaohsiung University of Science andTechnology), Ting-Jen Hsueh (National Kaohsiung University of Scienceand Technology), and Tien-Tsorng Shih (National Kaohsiung Universityof Science and Technology)First Principle Analysis of Li-Doped Armchair Graphene Nanoribbons for Nanoscale Metal
Interconnect Applications
Vipul Kumar Nishad (IIT Ropar) and Rohit Sharma (Indian Institute ofTechnology Ropar)

2272

2278

A Semi-Hemispherical High Q-Factor Resonators Fabricated using a Hybrid Rigid-Flex Process
2284
Vincens Gjokaj (Michigan State University) and Premjeet Chahal(Michigan State University)
A Wireless Battery-Less Seat Sensor for Autonomous Vehicles
Saikat Mondal (Michigan State University), Kanishka Wijewardena(Michigan State University), Saranraj Karrapuswami (Michigan State
University), Deepak Kumar (Michigan State University), Premjeet Chahal(Michigan State University), Mahmoud Ghannam (Ford Motor Company), andMark Cuddihy (Ford Motor Company)

2289

Deep Trench Capacitors in Silicon Interconnect FabricKannan Kalappurakal Thankappan (University of California, Los Angeles)
and Subramanian Iyer (University of California, Los Angeles)

2295

Strain and Surface Warping Detection of Interconnect Microstructures via Laser Diffraction 2302
Todd Houghton (Arizona State University) and Hongbin Yu (Arizona State
University)
Inverse Design of Substrate from Warpage Surrogate Model Using Global Optimisation
Algorithms in Ultra-Thin Packages
Cheryl Selvanayagam (Singapore University of Technology and Design(SUTD)), Pham Luu Trung Duong (Singapore University of Technology and
Design (SUTD)), and Nagarajan Raghavan (Singapore University ofTechnology and Design (SUTD))
Identification of Polymer Materials in Electronic Packages Including Counterfeit
Prevention
Junbo Yang (SUNY Binghamton), Jiefeng Xu (SUNY Binghamton), andSeungbae Park (SUNY Binghamton)
Screen-Printed Inductive Silver Ink Strain Sensor on Stretchable TPU Substrate
Connor S. Smith (University of Florida), Kartik Sondhi (University of
Florida), Beatriz Jimenez (University of Florida), Z. Hugh Fan(University of Florida), Toshikazu Nishida (University of Florida),
and David P. Arnold (University of Florida)

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Author Index

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