December 12 15, 2006

Pacifico Yokohama, Yokohama, JapanRO

CONFERENCE

WORKSHOPS

TOPICS

Active Devices a n d Circuits
Low-Noise Devices and Circuits, High-Power Devices and Circuits,
Control Circuits (MIX, Osc., SW, etc.), MMICs and HMICs (Receivers,
Transmitters, etc.), Silicon RF Devices and Circuits (CMOS, SiGe, etc),
High-Speed Digital Circuits, Others」こ→ー） Passive C o m p o n e n t s

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P Filters and Resonators, Ferrite and Surface Wave Components, Packaging
Techniques, Passive Devices and Circuits, Waveguides and Striplines,
Microwave Superconductivity, Others ( W D M Components, RF MEMS, LTCC
Devices, ect.)i.

Systemsi Wireless Systems (Software Defined Radio, U W B Systems, Wireless Ad
hoc Network, Mobile Access, 4G Communication Systems, Quasi-Zenith
Satellite Systems, Digital Broadcasting, HAPS, etc.), Optical Fiber Systems,
Microwave Applications (ITS, SPS, etc.), Microwave Medical & BiologicalApplications/EMC, Millimeter-Wave Radar and Sensor (Remote Sensing,etc.), Microwave Photonics, Measurement Techniques, Others (System on
Package, etc.)

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ii·.．ノ’A n t e n n a a n d Propagation
P Scattering and Propagation, Electromagnetic Field Theory and CAD, Antenna Theory, Microwave Antennas, Antenna Systems(Phased Array, Active
and Adaptive Antennas, M I M O Systems, etc.), Others (Artificial Materials,
Photonic Bandgap, etc.)

AND

SHORT

COURSESThe A P M C 2006 will provide exciting workshops and short courses
conducted by a group of specialists in a wide range of interesting andtimely subjects.
MICROWAVEEXHIBITION

Microwave Exhibition, which is the largest trade show dedicated to RF
and microwaves in Asia, will be held as a part of A P M C 2006 from
Wednesday Dec. 13 to Friday Dec. 15. More than 350 microwave
related companies will exhibit the latest products, and various
technical seminars will also be available. Over 6000 academic andbusiness visitors from around the world will be expected.
TIMETABLE
Paper Submission Closed
For further information, please visit A P M C 2006 web site at
http://www.apmc2006.org
REGISTRATIONFEES

Regular
Early registration (online): 31 Jul. - 30 Sep.,2006
Online registration: 1 Oct. - 30 Nov.,2006
Onsite registration: O n the conference day
Student/RetireeWorkshop/Short course¥42,000.¥47,000.¥55,000.¥15,000.¥ 5,000.-I N F O R M A T I O N : Prof. Masayoshi Aikawa Chair, Steering Committee c/o Real Communications Corp., 3F Shinmatsudo S Bldg., 1-409 Shinmatsudo,
http://www.apmc2006.org
Matsudo 270-0034, Japan Phone: +81-47-309-3616, Fax: +81-47-309-3617, E-mail: mweapmc@io.ocn.ne.jp

PROGRAM AT A GLANCE
12/11(MON) Registration (4:00 p.m. – 7:00 p.m.) “2F, Conference Center”
12/12(TUE)
9:00

A.M.

Room A (301)

Room B (302)

Room C (303)

Room D (304)

Workshop 1

Workshop 2

Workshop 3

Workshop 4

Room E (311+312) Room F (313+314)
Workshop 5

Workshop 6

Room G (501)
Short Course 1

Room H (502)
Short Course 2

System-on-Chip /One-Chip Radio

Advanced MIMO
Antenna Techniques

Standardization of
Measurement Methods
For Microwave andMillimeter Wave Materials

Emerging Technology andApplication of RFID

Millimeter andTerahertz Wave
Applications

Technical Hellenism of RF
and Information Security

Metamaterial
Engineeringfor Microwaves

Digital RF Processor(DRP™): All-Digital TX
and Discrete-Time RX

12:00
LUNCH TIME
1:30

P.M.

4:30

Workshop 7

Workshop 8

Workshop 9

Workshop 10

Workshop 11

Workshop 12

Short Course 3

Short Course 4

Recent Progress in High Power
Widegap Semiconductor Device
and its Application to WirelessCommunication System

Application of CIP Method toElectromagnetic Phenomena

Phase Noise in Oscillator:
An Old and Still New
Technical Issue

High Frequency
Technologies for ITS

Advanced Microwave
Photonics Technologies
and Their Applications

RF BAW Filters for
Mobile Communications

RF MEMS Circuits forHigh Frequency
Applications

Wireless Communications
Standards, Systems,
and RFIC Specifications

Welcome Reception (5:30 p.m. – 7:30 p.m.) “Yokohama Red Brick Warehouses”

12/13(WED)
8:50

Registration ( 8:00 a.m. – 6:00 p.m.) “2F, Conference Center”

Room A (301)

Room B (302)

Room C (303)

Room D (304)

Room E (311+312)

Room F (313+314)

WE1A

WE1B

WE1C

WE1D

WE1E

WE1F

Microwave Control and
Frequency Conversion Circuits

Ultra-Wide Band
Plannar Filters (1)Biomedical Applications and
EMC

Microstrip Patch Antennas

Microwave Photonics andOptical Fiber Systems

Scattering

A.M.

Lounge

10:30
COFFEE BREAK

10:50

WE2G (Room 501+502)

Opening Ceremony
Keynote Address

12:50
LUNCH TIME
2:00

WE3A

WE3B

WE3C

WE3D

WE3E

WE3F

Silicon Power Amplifier
IC Design

Ultra-Wide Band
Plannar Filters (2)Compound Semiconductor
Low-Noise Devices andAmplifiers

Inverted-F Antennas

Waveguide Analysis andDesignNovel Antenna Arrays

P.M.

3:40
COFFEE BREAK

4:00

WE4A

WE4B

WE4C

WE4D

WE4E

WE4F

High-Performance Silicon
Front-End Ics

Device Modeling andCircuit Analysis forPower Amplifiers

SiGe/CMOS Low-Noise
Devices and Circuits for
Wireless Applications

Reconfigurable Antennas

Recent Advances on Periodic
and Multilayered Structures

Packaging Technology

6:00

Microwave Exhibition (10:30 a.m. – 5:30 p.m.) “Exhibition Hall A+B”

12/14(THU)
8:50

2:30 –4:00
WEOF
Open Forum-1

Registration ( 8:00 a.m. – 6:00 p.m.) “2F, Conference Center”

Room A (301)

Room B (302)

Room C (303)

Room D (304)

Room E (311+312)

Room F (313+314)

TH1A

TH1B

TH1C

TH1D

TH1E

TH1F

Microwave Oscillator

Advances in Tunable andMetamaterial Filters andResonators

Miniaturization and Optimizationof Hybrid Couplers

Millimeter Wave andIntegrated Antennas (1)Advanced High Power
Amplifiers

Numerical Analysis

A.M.

10:30

LoungeCOFFEE BREAK

10:50

TH2A

TH2B

TH2C

TH2D

TH2E

TH2F

Frequency Multiplication andConversion Circuits

Design and Implementaion
Techniques for
Microwave Filters

Advanced Coupler Design
and Fabrication Techniques

Millimeter Wave andIntegrated Antennas (2)Modulation and
Related Technologies

Lossy Materials

12:30
LUNCH TIME
2:00

TH3A

TH3B

TH3C

TH3D

TH3E

TH3F

Linearization Technologies forPower Amplifiers

Advanced Divider Analysis
and Designs

Artificial and Novel Materials
for Antenna Applications (1)Novel FDTD Method

System-Related
Technologies (1)Microwave Silicon VCO Design

P.M.

2:30 –4:00
THOF
Open Forum-2

3:40
COFFEE BREAK

4:00

TH4A

TH4B

TH4C

TH4D

TH4E

TH4F

High Power Devices andPower Amplifiers

Power Amplifiers andLinearization Technique

Artificial and Novel Materials
for Antenna Applications (2)Waveguide Based on
Metamaterials

System-Related
Technologies (2)Silicon Frequency Generation
and Conversion Ics

6:00

Tea Ceremony (12:00 p.m. – 4:00 p.m.) “65F, Yokohama Royal Park Hotel in Landmark Tower”
Banquet (6:30 p.m. – 8:40 p.m.) “Inter Continental The Grand Yokohama”
Registration ( 8:00 a.m. – 6:00 p.m.) “2F, Conference Center”

Microwave Exhibition (10:30 a.m. – 5:30 p.m.) “Exhibition Hall A+B”

12/15(FRI)
8:50

Room A (301)

Room B (302)

Room C (303)

Room D (304)

Room E (311+312)

Room F (313+314)

FR1A

FR1B

FR1C

FR1D

FR1E

FR1F

Advances on
Passive Components

Miniature Planar andIntegrated Filters (1)Material Measurements

Small Antennas for RFID

Ubiquitous Communicationsand Location Systems

Design and Analysis Methods
for Printed Antennas

A.M.

Lounge

10:30
COFFEE BREAK

10:50

FR2A

FR2B

FR2C

FR2D

FR2E

FR2F

RF-MEMS and Device Modeling

Miniature Planar andIntegrated Filters (2)New Measurement Methods

Small Antennas for
Mobile Applications

Microwave ApplicationsUWB Antennas

12:30
LUNCH TIME
2:00

P.M.

FR3A

FR3B

FR3C

FR3D

FR3E

FR3F

Active Planer Circuits

Planar Filters with
Extended Stopband
Performance

Millimeter-Wave
Radar Systems

Multiband Antennas

Advanced Technologies forPower Amplifiers

Ferrite and SAW Devices

3:40
4:00

COFFEE BREAK

FR4A

FR4B

FR4C

FR4D

FR4E

FR4F

Transceivers

Multi-Band andMulti-mode Planar Filters

Imaging and Remote Sensing

Propagation

Power Amplifiers for
Mobile Communication

Waveguide Circuits

6:00

Microwave Exhibition (10:30 a.m. – 5:00 p.m.) “Exhibition Hall A+B”

Registration ( 8:00 a.m. –12:00 p.m.) “2F, Conference Center”

i

2:30 –4:00
FROF
Open Forum-3

FLOOR PLAN
Conference Center
LoungeOpen Forum
Room F

314
313

Entrance Hall

312

Registration Desk

Entrance

Room E

311

3F

WC

Foyer

2F

EV

WC

EV

Room B (302)

Room D (304)

Room A (301)

Room C (303)

Foyer

Tea Room

Room 211+212

EV

Map ofPacifico
Yokohama

A National
Big Hall

Microwave
Exhibition 2006
Hall A+B

315

316

Sea Bus Station

Rinko Park

Exhibition Hall

WC

EV

Inter Continental
The Grand Yokohama

Room H (502)
Plaza

Conference
APMC 2006 Center

Foyer

5F

Room G (501)

A route to the meeting place(In case of walking)Pacific Hotel
Yokohama

EV

Minato Mirai Sta.
to Yokohama

Minato-Mirai-Line

Queen’s Square Yokohama

Pacifico YokohamaInter Continental
The Grand Yokohama

Exhibition Hall

Plaza

ii

Conference Center

317

TABLE OF CONTENTSPROGRAM AT A GLANCE.................................................................................................. i
FLOOR PLAN ...................................................................................................................... ii
GREETINGS FROM THE STEERING COMMITTEE CHAIR ......................................... 1
MESSAGE FROM THE TECHNICAL PROGRAM COMMITTEE CHAIR ..................... 1
GENERAL INFORMATION................................................................................................ 2
CONFERENCE SITE ....................................................................................... 2
YOKOHAMA ................................................................................................... 2
REGISTRATION .............................................................................................. 2
HOTEL ACCOMMODATIONS ....................................................................... 3
OFFICIAL TRAVEL AGENT .......................................................................... 4
YOUTH HOSTEL INFORMATION ................................................................ 4
TRANSPORTATION ........................................................................................ 4
VISA REQUIREMENT FOR FOREIGN ATTENDEES ................................. 4
OTHER INFORMATION ................................................................................. 5
SOCIAL PROGRAM........................................................................................ 5
MEETINGS INFORMATION .......................................................................... 7
APMC 2006 PRIZE .............................................................................................................. 7
TECHNICAL SESSION ....................................................................................................... 8
OPEN FORUM ................................................................................................................... 20
WORKSHOP ...................................................................................................................... 25
SHORT COURSE ............................................................................................................... 30
EXHIBITION...................................................................................................................... 31
APMC 2006 COMMITTEE OFFICERS ............................................................................ 34iii

GREETINGS FROM THE STEERING COMMITTEE CHAIR
Welcome to Yokohama and the 2006 Asia-PacificMicrowave Conference (APMC 2006). The Yokohama Bay
Area is faced on the southwest coast of Tokyo Bay and lies
about 30 km south of Tokyo. In the neighborhood of thecity, there are many companies and laboratories dealing withmicrowave and related industries.
APMC 2006 is the 18th APMC, which started in 1986 inIndia, and the 5th to be held here in Japan. During that time,
Microwave technologies made remarkable progress supported by civilian demands. We hold the conference under thetheme of “Sail for the Microwave Ocean” at Yokohama, oneof the eminent harbor towns in Japan.
APMC 2006 will be held at the Conference Center in
Pacifico Yokohama, one of the largest convention centers in
the world, located in the east coast of Yokohama. The details
are given in this brochure.
At the Exhibition Hall adjacent to the ConferenceCenter, an exhibition called “Microwave Exhibition 2006”
will be held from December 13 to 15 as the part of APMC
2006. More than 300 companies dealing with Microwave andrelated industries will participate in this exhibition, notonly from Japan and the United States but also from all over
the world. Technical Seminars about new technologies andproducts will be held. To add to all of this, an exhibition ofJapanese microwave history and another exhibition by theuniversities and colleges will be held in the same hall.
While you are here for APMC 2006, you can visit thesurrounding area. Yokohama is very famous for Chinatown,
one of the biggest in Japan. To the south of Yokohama, there
is Kamakura, a historical and cultural city as there wasshogunal government from 1192 to 1333, where you canenjoy old shrines and temples.
I wish you will join APMC 2006
and sail for a wonderful voyage at theMicrowave oceans, sailing into thebrilliant future.
Masayoshi Aikawa
APMC 2006 Steering Committee Chair

MESSAGE FROM THE TECHNICAL PROGRAM COMMITTEE CHAIR
On behalf of the Technical Program Committee, I
cordially welcome you to APMC 2006 in Yokohama.
The 2006 APMC Technical Program Committee hasorganized a highly qualified and exciting program covering
wide varieties of microwave technologies and related fields.
This year, a total of 694 papers from 42 countries were
submitted to APMC 2006, which is the largest number in
APMC's history held in Japan. Due to the high professional
quality of these papers, it was an extremely difficult task for
the Technical Program Committee to select the 498 papers(312 for oral presentations, 186 for open forums), the maximum allowable number in this location and this period, with192 reviewers around the world participating in the paper
review and selection processes.
The technical activities begin at 9:00 a.m., on Tuesday,
December 12, with workshops and short courses, which havebeen selected from the most exciting topics in our fields.
This year there are 12 workshops and 4 short courses. APMC
regular sessions commence at 8:50 a.m., on Wednesday,
December 13, with 6 sessions proceeding simultaneously.
A total of 66 oral presentation sessions and 3 open

forum sessions are scheduled for paper presentations.
The plenary session is scheduled at 10:40 a.m. on
Wednesday, December 13, where Mr. Toshio Miki, NTT
DoCoMo Inc. will present Keynote Address entitled “Mobile
Communication Evolution”. And Prof. Tatsuo Itoh, UCLA
will present “New Avenues of Microwave Component
Design” as well. This year we have also invited 18 outstanding speakers who are very active in their field.
The Technical Program Committee has worked hard to
make APMC 2006 successful and memorable. I would like toexpress my sincere appreciation to the members and reviewersof the Technical Program Committee
for their dedication in organizing thetechnical program. We are looking forward to meeting you at the conference.
Kiyomichi Araki
Technical Program Committee Chair

1

GENERAL INFORMATION
After November 30, all registration will be accepted at
the conference site, Pacifico Yokohama, Yokohama, Japan,
from December 11 to 15, 2006.

CONFERENCE SITE
The APMC 2006 will be held from December 12 to 15
at the Conference Center in Pacifico Yokohama. Pacifico
Yokohama is one of the largest convention centers in theworld, consisting of the Conference Center, the Exhibition
Hall, a hotel and a big national hall, and is located in the
Minato Mirai 21 (MM21) area of Yokohama (see the map on
the back cover). Its beautiful shell– and– sail – shaped
appearance is impressive when viewed from sea and fromland as well.
The conference will be held in the Conference Center:2nd Floor Entrance Hall for Registration; 3rd Floor Meeting
Rooms and Lounge for Technical Sessions, Workshops andShort Courses; and 5th Floor Meeting Rooms for theOpening Ceremony and Keynote Address.

Registration fees

Regular
Conference
Fee*1

Jul. 31 – Sep. 30, 2006

42,000 JPY

Oct. 1 – Nov. 30, 2006

47,000 JPY

Onsite (Dec. 11 – Dec. 15, 2006) 55,000 JPY
Student*2 (pre-registration/onsite)

15,000 JPY

Retiree*3 (pre-registration/onsite)

15,000 JPY

Workshops and Short Courses Fee*4 (pre-registration/onsite) 5,000 JPY*1. The Conference Fee covers all the technical sessions from
December 13 to 15, but does not cover the Workshops and Short
Courses on December 12. This fee also covers other events such as
the Opening Ceremony, Welcome Reception, Banquet, and theRegistration Kit. The kit includes a nameplate, a conference bag,and a copy of the Conference Proceedings and the CD-ROM.

YOKOHAMA
Yokohama faces the western coast of Tokyo Bay and lies
mere 30 kilometers from Tokyo. The port of Yokohama, anaturally blessed harbor surrounded by gently undulating
hills, opened in 1859, and ever since has played a major roleas the window to the world. Japan’s first Western style hotel
and restaurant were opened in Yokohama, and the city was
also the site of Japan’s first coffee shop and bakery as well as
its first modern waterworks and railroads. Yokohama, built on
its rich heritage of enterprising endeavor, has become a truly
international city and Japan’s largest international trading
port.
Yokohama has a host of exciting places to visit. You cansavor various works of art, familiarize yourself with
Yokohama’s history and culture. Red Brick Warehouse Parkis one of such visiting spots, for example. Lovely red brickbuildings with their original facades (about 100 years old)
have been refurbished from top to bottom. In these buildings,
there is a hall, multipurpose space, a restaurant with live
performances, a beer garden, and 31 shops selling a variety
of food and goods. Outside the building, you can relax withgreenery and trees.
To the south lies Kamakura, once the political and cultural capital of the Shogunate, from 1192 to 1333. It boasts
a heritage comparable with that of Kyoto and Nara. You canexperience the charm of many ancient temples and shrines,
including the famous Great Buddha statue. It can be reachedby train in 30 min from Yokohama.

*2. We will prepare a different type of nameplate for students. The
definition of “student” is as follows: a person who is attending
graduate school, university, junior college, technical college, orsimilar educational institution as of December 12. Please show
your student ID at the registration desk. Without an ID, you will
have to pay extra fee to make up the difference.
*3. The definition of “retiree” is as follows: a person who is attaining
the age of 60 years and not gainfully employed as of December 12,
2006.
*4. The Workshops and Short Courses Fee covers all the Workshop
and Short Course sessions on December 12, but does not cover any
other technical session or event in APMC 2006. Each registrant forWorkshops and Short Courses will receive a copy of the Digest,which includes presentation materials for the Workshops and Short
Courses.
If you are not going to participate in the Conference from
December 13 to 15, please register for Workshops and Short
Courses onsite on December 12, not by pre-registration.

Payment
The payment is accepted only by “Credit Card” inprinciple.
Accompanying Person
Each participant in the Conference from December 13 to
15 (except “Student”) can bring one of her/his family members as an Accompanying Person, who can participate in the
Welcome Reception (free of charge), the Opening Ceremony,
Banquet (free of charge), Tea Ceremony (1,000 JPY), and theTechnical Sessions. The accompanying person will receive a
nameplate, but not a copy of the Conference Proceedings.
Cancellation
In the event of the cancellation, written notification
should be sent to Prof. Masayoshi Aikawa, Chair of theSteering Committee, before October 31, 2006, Japan
Standard Time. A cancellation fee of 5,000 JPY will be
deduced from the refund. After October 31, 2006, no refund

REGISTRATION
Pre-registration is accepted only through APMC 2006
Web site (http://www.apmc2006.org) from July 31 toNovember 30, 2006. All the technical session speakers arerequested to pre-resister by September 15, by declaring the“Presentation No. (e.g.: WE1A-1)” informed in the
Notification of Acceptance on August 1.
2

GENERAL INFORMATION
can be made and a copy of the Conference Proceedings will
be sent to the registrant after the conference.
APMC 2006 Secretariat:
Prof. Masayoshi Aikawa [Chair, Steering Committee]
c/o Real Communications Corp.
3F Shimmatsudo S. Bldg., 1 – 409 Shimmatsudo,
Matsudo, Chiba 270 – 0034, Japan
Phone: +81– 47– 309– 3616, Fax: +81– 47– 309– 3617
E-mail: mweapmc@io.ocn.ne.jp

December 11
December 12
December 13
December 14
December 15

4:00 p.m. – 7:00 p.m.
8:00 a.m.– 6:00 p.m.
8:00 a.m.– 6:00 p.m.
8:00 a.m.– 6:00 p.m.
8:00 a.m.–12:00 p.m.

HOTEL ACCOMMODATIONS
Rooms at nine hotels in Yokohama, which are accessible
from/to Pacifico Yokohama, have been blocked. Reservations
must be made through the web site for the hotel accommodations. Applications should be accompanied by the payment of the hotel accommodation with the handling charge of
525 JPY per request. No reservation will be confirmed in theabsence of the payment.

Registration Desk
The registration and information desk is located at the
2nd Floor Entrance Hall of Pacifico Yokohama ConferenceCenter. It will be open during the following hours:

Hotel Location
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1 Inter Continental The Grand Yokohama
2 Pan Pacific Yokohama
3 Yokohama Royal Park Hotel
4 Navios Yokohama
5 Yokohama Sakuragicho Washington Hotel
6 Sanai Hotel Yokohama Hotel
7 Yokohama Heiwa Plaza Hotel
8 Yokohama Bay Sheraton
9 Camelot Japan

GENERAL INFORMATIONThe nearest station to Pacifico Yokohama is Minato
Mirai Station on the Minato Mirai Line, two stops from
Yokohama Station. The Minato Mirai Line is directly connected to the Tokyu Toyoko Line. It takes about 3 minutes
and costs 180 JPY from Yokohama to Minato Mirai. Pacifico
Yokohama is also conveniently accessed from Sakuragicho
Station on the JR Keihin-Tohoku Line (Negishi Line) and themunicipal subway. (See the map on the back cover.)How to get to Yokohama from Narita Airport
By Japan Railways (JR):The fastest option to get to Yokohama is the JR Narita
Express (NEX), requiring roughly 90 minutes for the one
way journey. All seats are reserved. The one way farebetween Narita Airport and Yokohama Station is about 4,200
JPY. There is about one connection per hour.
The JR Sobu Line (Rapid Service) is a slower, butcheaper JR alternative to the Narita Express. It takes roughly two hours from Narita Airport to Yokohama Station andcosts 1,890 JPY for the one way journey. There is about one
connection per hour.
By Keisei and Keikyu Railways:
Take the Keisei Limited Express from Narita Airport to
Aoto Station (60 minutes) and transfer to a Keikyu train to
Yokohama (60 minutes). A second transfer of trains may berequired at Shinagawa Station. The one way fare is 1,450
JPY. There are about three connections per hour.
By limousine bus:
Limousine buses to the Yokohama City Air Terminal(YCAT) near Yokohama Station depart Narita Airport every
20 to 30 minutes. The one way journey takes about 90 minutes and costs 3,500 JPY. In addition, there are direct limousine bus connections to several major hotels in Yokohama.
By taxi:
Since Narita Airport is located about 60 km outside ofTokyo, a taxi ride into central Tokyo is very expensive andnot recommended to common travelers.
By rental Cars:
Rental cars are available at major railway stations andairports.

OFFICIAL TRAVEL AGENTJTB Metropolitan Corp. Group Tours Office Yokohama
has been appointed as the official travel agent for the
Conference and will handle hotel accommodations.
Applications and Inquiries concerning hotel accommodations should be addressed to:
JTB Metropolitan Corp. Group Tours Office Yokohama
Convention Desk
6F, Yasuda 6th Bldg. 3 – 29 –1, Tsuruya-cho, Kanagawaku, Yokohama 221– 0835, Japan
Phone: +81– 45– 316– 4602 Fax : +81– 45– 316– 5701
E-mail: jtb_convention@jtb.jp
Please contact to JTB for information on sightseeing
tours as well.

YOUTH HOSTEL INFORMATION
Also, for those with very limited budget, you may wantto contact directly with the below Youth Hostel, which isabout a 15 minutes’ walk to the Convention site, Pacifico
Yokohama.
Name : Kanagawa Youth Hostel
TEL : 045– 241– 6503 FAX : 045– 241– 6501
Address : 1 Momijigaoka, Nishi-ku, Yokohama-shi,
Kanagawa-ken 220 – 0044
URL : http://www.jyh.or.jp/english/index.html

TRANSPORTATIONThe closest airports to Yokohama are the international
Narita Airport and the domestic Haneda Airport. Narita
Airport, formerly also known as New Tokyo International
Airport, is located in the city of Narita in Chiba Prefecture,
about 60 km outside of Tokyo. There are heavy traffic jams
in Tokyo and Yokohama area. Public transportation (railways and subways) networks are convenient. Purchase yourticket by cash using the machine at the entrance. For mosttrains no advance reservation is needed. However, for JR
Shinkansen limited express (bullet trains), advance reservation is recommended in order to secure a seat.
Yokohama is served by four railway companies (JREast, Tokyu Railway, Keikyu Railway and Sagami Railway),a municipal subway line and a bus network. The city has two
major railway stations: Yokohama Station and ShinYokohama Station (“New Yokohama Station”). Train lines of
all four railway companies and the subway line pass throughYokohama Station, which is located in the city center. ShinYokohama Station, on the other hand, is located outside of
the city center, about 10 minutes from Yokohama Station by
the JR Yokohama Line or the municipal subway. The
shinkansen stops at Shin-Yokohama Station.

VISA REQUIREMENT FOR
FOREIGN ATTENDEES
Citizens of other countries may have to carry a passport(valid for at least 6 months beyond the applicant’s intended
period of stay in Japan) and a visa to enter Japan. Foreign
participants should contact the Japan Embassy, Consulate, orAgency of Tourism in their home country AS SOON AS
POSSIBLE to determine their particular visa requirements
and time estimate for their visa applications. Participantsrequiring visas must initiate the application process well inadvance of their departure date.
Some general information on visa application procedures can be found on the Japanese Government websites at
4

GENERAL INFORMATION
http://www.mofa.go.jp/j_info/visit/visa/index.html. Due tothe complex nature of visa requirements, the APMC 2006
Committees CANNOT contact or intervene with any Japan
Embassy or Consulate office abroad on your behalf. We
advise you to contact the Consular Section of the Embassy or
Consulate General of Japan in your country for more information and advice.

SOCIAL PROGRAM
The APMC 2006 will provide original and colorful
events: Welcome reception, the Opening Ceremony, Tea
Ceremony, and Banquet.
WELCOME RECEPTION AT “YOKOHAMA RED
BRICK WAREHOUSES”
All the participants in the Conference (from December
13 to 15) are invited to the Welcome Reception to be heldfrom 5:30 p.m. to 7:30 p.m. on Tuesday, December 12, at thehistorical “Yokohama Red Brick Warehouses”, located in
the Yokohama seaside area, about a 15–20 minutes’ walkfrom Pacifico Yokohama. A free bus transportation service
from Pcifico Yokohama will be available for all the
Confefrence participants. A special performance will begiven by the Yokohama Mandolin Club, organized by thecity officers of Yokohama.

OTHER INFORMATIONElectricity
Electricity supply is 100 Volts/50 Hz in eastern Japan
including the Yokohama area, and 100 Volts/60 Hz in western Japan.
Weather
Yokohama lies in the temperate zone and has four distinct seasons. December is the beginning of winter, when
Yokohama is rather cold but rarely has snow. The temperature ranges between 4°C (39F) and 12°C (54F), averaging
8°C (46F). Coats or sweaters are needed.
No Smoking Policy
Smoking is prohibited in the Conference Center except
at limited smoking corners.
Currency
Japanese yen (JPY) is the only currency that is used atstores and restaurants. You can exchange foreign currencies
for Japanese yen at foreign exchange banks and otherauthorized money exchangers by showing your passport.
The exchange rate fluctuates daily.
Traveller’s Checks and Credit Cards
Since traveller’s checks are not common in Japan, you
may use them only at major hotels and leading banks. Major
credit cards, such as VISA, Master Card, AMEX, and JCB,
can be used at restaurants, hotels, souvenir shops, etc.
Tipping
Tipping is not customary in Japan. For example, you do
not need to tip waiters/waitresses at restaurants.
Rental Cars
Rental cars are available at major railway stations (e.g.
Tokyo station) and airports (e.g. Narita airport).
Japanese Traffic
There are heavy traffic jams in Tokyo and Yokohama
area. Public transportation (railways and subways) networks
are convenient. Purchase your ticket by cash using themachine at the entrance. For most trains no advance reservation is needed. However, for JR Shinkansen limited
express (Bullet train), advance reservation is recommended
in order to secure a seat.
Internet connection
Internet connection through Wireless LAN and Ethernet
cable will be available at the Conference Center. There is
no charge for the service.

History of Yokohama Red Brick Warehouses:
The historical Yokohama Red Brick Warehouses wereconstructed between 1911 and 1913 as a symbol of the modernization and development of Yokohama. In 1994, work
began on the restoration and revitalization of the buildings.
After eight years, the valiant figure of these buildings, whichwithstood the Great Kanto Earthquake and the Second World
War, has risen once again. With the restoration work, fromthe standpoint of the conservation of cultural treasures, while
making as much use of the original as possible, advanced
technology was also used, including earthquake resistancestrengthening work, and repair work to the exterior walls
and roofs.

Yokohama Red Brick Warehouses

5GENERAL INFORMATION
the gentle bubbling sound of water in a teakettle, the fragrance of incense, the lovely flower arrangements, and theartistic calligraphy on a scroll hanging in the alcove. The
Way of Tea ceremony “= Chanoyu” is a Japanese cultural tradition. In the 16th century, Tea Master Rikyu Senestablished the foundations of “Chanoyu”, where one
respects everyone without distinction of status or rank. Thatis, the spiritual aspect is the most important in “Chanoyu”.
The culture of “Chanoyu” has greatly influenced various
aspects of Japanese culture, such as architecture, gardening,textiles, food, and cooking. You can experience the entire
process of “Chanoyu” in a hiroma (tatami-mat room) as
shown in the photo 1. For those who prefer a more casualstyle, ryurei-seki (a less formal tea ceremony with tables andchairs) will also be offered for your comfort.
It is our pleasure that we provide you with everything
you need to relax at the tea ceremony room.
Date: Thursday, December 14, 2006
Time: 12:00 p.m. – 4:00 p.m.
Place: Tea ceremony room “Kaiko-an”, 65F, Yokohama
Royal Park Hotel in Landmark Tower
Tickets: 1,000 JPY per person at the registration desk

OPENING CEREMONYThe APMC 2006 Opening Ceremony will be held from10:40 a.m. to 12:50 p.m. in Room 501+502 (5th floor) ofPacifico Yokohama Conference Center on Wednesday,
December 13. A declaration and brief report by the APMC
2006 Steering Committee Chair and congratulatory addresses by invited representatives of sponsoring organizations
including IEEE MTT-S, URSI, EuMA are scheduled at the
beginning of the ceremony. Then, we will have the Keynote
Addresses given by Mr. Toshio Miki, Managing Director ofCommunication Device Development Department, NTT
DoCoMo Inc., and Professor Tatsuo Itoh, UCLA. The
respective titles of their talks are “Mobile Communication
Evolution” and “New Avenues for Microwave Component
Design”.
BANQUET
The APMC 2006 Banquet will be held from 6:30 p.m. to
8:40 p.m. on Thursday, December 14, in the 3rd-floor Grand
Ballroom of the Inter Continental The Grand Yokohama
adjacent to the Conference Center. With a variety of cuisine,
the banquet will introduce winners of Japan Microwave
Prize. The Banquet will be a buffet style so that all theparticipants in the Conference (from December 13 to 15) areinvited. After the greetings by the Conference Chair, youwill experience the ceremony “Kagamiwari”, where a large
barrel of sake (Japanese rice-wine) is cracked on the top
with wooden hammers to celebrate the success of APMC
2006. The APMC 2006 Microwave Prize will be given to thewinners selected by the Prize Committee from all participants presenting a paper at the conference. As special entertainment, the Banquet will feature a professional performance of traditional Japanese drums called “Taiko”. Taikopractitioners have been instrumental in introducing Japanesetraditional culture worldwide, and the performances are said
to convey heart to heart the spirit of Japan.

Photo 1. hiroma

TEA CEREMONY
Would you like to enjoy a tea ceremony between yourbusy sessions or exhibitions? The tea ceremony will be held for
all APMC 2006 participants. Ladies wearing Japanese traditional kimonos will serve you a bowl of green tea “maccha”
and a Japanese-style confection “okashi”. You will find theatmosphere of the tea ceremony comfortable and relaxing —Photo 2. Tea Ceremony in APMC 1998

6

GENERAL INFORMATIONAPMC INTERNATIONAL STEERING COMMITTEEMEETING
The APMC International Steering Committee Meeting
will be held on Thursday, December 14, 2006, from 12:00 p.m.
to 3:00 p.m., at Room 211+212.

MEETINGS INFORMATIONIEEE MTT-S REGION 10 CHAPTER CHAIR’SMEETINGThe IEEE MTT-S Region 10 Chapter Chair’s Meeting
will be held on Wednesday, December 13, 2006, from 1:00 p.m.
to 2:00 p.m., at Room 211+212.

APMC 2006 PRIZE
conference will be awarded the APMC 2006 Student Prize.
These Prizes, which consist of the commemorative certificates and rewards, will be presented to all recipients at the
APMC 2006 Banquet to be held on Thursday, December 14,
2006.

Papers presented at APMC 2006 will be judged by the
APMC 2006 Prize Award Committee, and the authors of
selected papers will be awarded the APMC 2006 Prize foroutstanding contributions to the microwave field.
In addition, outstanding student papers submitted at the7

TECHNICAL SESSION
Wednesday, December 13

8:50 a.m. – 10:30 a.m.

Room A (301)

Room B (302)

Room C (303)

Session WE1A

Session WE1B

Session WE1C

Microwave Control and Frequency Conversion Ultra-Wide Band Plannar Filters (1)Circuits
Chairs : I. Awai, Ryukoku Univ., JAPAN
Chairs : H. Okazaki, NTT DoCoMo, Inc., JAPANK. Miyaguchi, Mitsubishi Electric Corp.,
JAPAN

J.-K. Rhee, Dongguk Univ., KOREA

Biomedical Applications and EMC
Chairs : Y. Nikawa, Kokushikan Univ., JAPANJ. G. Yook, Yonsei Univ., KOREA

WE1A-138-80 GHz SPDT Traveling Wave Switch MMIC Utilizing
Fully Distributed FET

WE1B-1Analysis and Optimization of Ultra-Wideband Bandpass
Filters on Coplanar Waveguide

WE1C-1
Non-Invasive Measurement of Blood Sugar Level byReflection of Millimeter-Waves

H. Mizutani, N. Iwata, Y. Takayama*, and K. Honjo**, NEC
Electronics Corp., *Univ. of Hyogo, **The Univ. of ElectroCommunications, JAPANJ. Gao and L. Zhu, Nanyang Technological Univ., SINGAPORE

Y. Nikawa and T. Michiyama, Kokushikan Univ., JAPANWE1A-2A High Power CMOS SP4T Switch Using a Switched
Resonator for Dual Band Applications

WE1B-2Ultra-Wideband (UWB) Bandpass Filters with Improved
Upper-Stopband Performance

WE1C-2Sub-µW Signal Power Doppler Radar Heart Rate Detection

M. Ahn, J. J. Chang*, W.-M. Woo*, K. Yang, C.-H. Lee*, B.-S. Kim**,and J. Laskar, Georgia Institute of Technology, *Samsung RFIC design
Center at Georgia Tech, U.S.A., **Sungkyunkwan Univ., KOREA

S. W. Wong, S. Sun, L. Zhu, and Z. N. Chen*, Nanyang
Technological Univ., *Institute of Infocomm Research, SINGAPORE

WE1A-3
A Q-band Miniature Monolithic Subharmonically Pumped
Resistive Mixer

WE1B-3
A Novel Ultra Wideband Bandpass Filter Using Microstrip
Double-Ring Resonators

WE1C-3
Analysis of Aperiodic EBG Structures for Suppression of
Ground Bounce Noise

S.-Y. Chen, J.-H. Tsai, P.-S. Wu, T.-W. Huang, and H.
Wang, National Taiwan Univ., TAIWAN

W. Liu, Z. Ma*, C.-P. Chen**, G. Zheng and T. Anada**,Shanghai Univ., CHINA, *Saitama Univ., **Kanagawa
Univ., JAPANJ.-K. Du, J.-M. Kim, S.-S. Oh, and J.-G. Yook, Yonsei Univ.,
KOREA

WE1A-4
Tunable Coplanar Filter for F-band Wireless Receivers

WE1B-4Modeling of an Ultra-Wideband Bandpass Filtering
Structure

WE1C-4
Reduction Effect of Ground Patterns on Conductive Noise
Currents from Printed Circuit Board

K. Li and J.-S. Hong*, NICT, JAPAN, *Heriot-Watt Univ.,
U.K.

T. Maeno*,**, T. Unou*, K. Ichikawa*, and O. Fujiwara**,*DENSO Corp., **Nagoya Institute of Technology, JAPANWE1B-5
An Ultra-Wideband (UWB) Bandpass Filter Using
Broadside-Coupled Structure and Shunt Stub with Chip
Capacitor

WE1C-5
Wave Absorber Based on Reinforced Plastic with Periodic
Lattice for Improving ETC Environment

H. Takahashi, T. Kosugi, A. Hirata, K. Murata, and T.
Nagatsuma, NTT, JAPANWE1A-5
Voltage Controlled Phase Shifters on CMOS Technology
G. Mascarenhas*,**, J. Caldinhas Vaz**, and J. Costa Freire**,*ISEC MAR, REP. DE CABO VERDE, **Instituto de
Telecomunicações, Instituto Superior Técnico, PORTUGAL

Wednesday, December 13

K. Li, Y. Yamamoto*, T. Matsui, and O. Hashimoto*, NICT,*Aoyama Gakuin Univ., JAPANS. Yamada, M. Chen, and V. Lubecke, Univ. of Hawaii at
Manoa, U.S.A.

K. Matsumoto, M. Takimoto, O. Hashimoto, and M. Sakai*,
Aoyama Gakuin Univ., *Mitsui Engineering & Shipbuilding
Co., Ltd., JAPAN

10:50 a.m. – 12:50 p.m.
Room G+H (501+502)
Session WE2G Opening Ceremony

Opening Ceremony
Keynote Addresses (1) : Mobile Communication Evolution

M.S. degrees in electronics engineering from
Kyoto University, Kyoto, Japan, in 1978 and1980, respectively. Since 1980, he has beenwith the Research Labs. of NTT and NTT
DoCoMo. He was a residential researcher of
AT&T Bell Labs. in 1988. From 1999
through 2003, he was the founding President& CEO of DoCoMo Communications
Laboratories USA Inc. After that, he was the
managing Director of Multimedia Labs. in
2004, and Wireless Labs. in 2005.
From 1977 to 1984, he was engaged in the research of digital mobile
communication technologies, in particular, modulation/demodulation anddiversity reception. He started the research of speech coding in 1985,
aiming for PDC (Japanese Digital Cellular Systems). His proposal, PSICELP, was standardized and widely used as PDC half-rate speech codec.
He extended his research field to audio-visual coding in 1994, such as
MPEG-4 and relevant ITU-T standards.
He had been a member of ARIB STD-27 CODEC WG from 1991 through1995 for the work of PDC half-rate speech coding standardization.
From 1995 through 1999, he served as the MPEG-4 subcommittee
chairman of Japanese National Body. He also served as the Co-Chairmanof the Video Verification Tests Ad-Hoc Group and the Audio Error
Resilience Ad-Hoc Group in MPEG.
From 2002 through 2004, he was a trustee of ISOC (Internet Society).
Mr. Miki was awarded the IEEE Vehicular Technology Society Paperof the Year and the IEICE young engineers award in 1984. He received
the Achievement Award of IEICE in 1992. He is a senior member ofIEEE, and a member of IEICE of Japan, IPSCJ, and ISOC.

Speaker : Toshio Miki, Managing Director of Communication Device
Development Department, NTT DoCoMo Inc., Japan
Abstract :With the growing demand for high-speed and high-capacity data transmission in mobile communications, DoCoMo launched 3rd generation(3G) cellular services “FOMA” with the maximum data rate of 384 kbps
in 2001. DoCoMo proposed the “Super 3G concept” as the long-term
evolution of 3G after the global deployment of 3G. This is because thelong-term evolution of 3G is constitutive for 3G system to keep a highly
competitive position. Super 3G also enables a smooth migration path
towards 4th generation (4G) aiming at the target data rate; e.g. 100 Mbps
at high mobility and 1 Gbps at low mobility.
Besides higher data rate, future mobile services will promote a ubiquitouscommunications environment in which all kinds of devices and objects
are interconnected to attain real space and virtual space interaction. They
are expected to facilitate the development of the so-called “mobile ubiquitous world”. In a mobile ubiquitous world, all kinds of things will beinterconnected as needed to form ubiquitous networks that should arise
frequently and simultaneously while changing continuously.
This speech presents the current status of the 3G services, views on the
migration scenario from 3G to 4G, and research activities for achieving
4G services and mobile ubiquitous world.
Toshio Miki is the Managing Director of Communication Device
Development Department, NTT DoCoMo Inc. since July 2006. Mr. Mikiwas born in Osaka, Japan, on March 5, 1956. He received the B.S. and8

TECHNICAL SESSION
8:50 a.m. – 10:30 a.m.

Wednesday, December 13

Room D (304)

Room E (311+312)

Room F (313+314)

Session WE1D

Session WE1E

Session WE1F

Microstrip Patch Antennas
Chairs : K. Y. Yazdandoost, NICT, JAPANK.-M. Luk, City Univ. of Hong Kong, CHINA

Microwave Photonics and Optical Fiber Scattering
Systems
Chairs : A. Matsushima, Kumamoto Univ., JAPAN
Chairs : Y. Horiuchi, KDDI Lab., JAPANJ. H. Tarng, National Chiao Tung Univ.,
TAIWAN

L.-W. Li, National Univ. of Singapore,
SINGAPORE

WE1D-1A New Single-Feed Proximity Coupled Circularly
Polarized Square Ring Antenna

WE1E-1
Proposal of New Optical CDMA Systems and Fast CodeAcquisition Techniques

WE1F-1AIM Analysis of Electromagnetic Transmission ThroughDielectric Radomes

K.-F. Tong, Univ. College London, U.K.

T. Matsuba, T. Ishikawa, H. Fukuyama*, M. Hirata*, M.
Kijima, and M. Muraguchi, Tokyo Univ. of Science, *NTT,
JAPAN

W.-B. Ewe, E.-P. Li, and L.-W. Li*, Institute of High
Performance Computing, *National Univ. of Singapore, SINGAPORE

WE1D-2Gain-Enhanced Slot Antenna Fed by Conductor-Backed
Coplanar Waveguide

WE1E-2
Low-Cost Radio-Over-Fiber in-building Distribution
Network for WLAN, UWB and Digital TV Broadcasting

WE1F-2A Spectral Two-Step Preconditioner for Efficient Solutionof EFIE in The FMM Context

I.-C. Lan and P. Hsu, National Taiwan Univ., TAIWAN

M. Yee, L. Michael Ong, C. Sim, and L. Bin, Institute of
Infocomm Research, SINGAPORE

P. L. Rui and R. S. Chen, Nanjing Univ. of Science andTechnology, CHINA

WE1D-3
Polarization Controllable Microstrip Antenna Using Beam
Lead PIN Diodes

WE1E-3
A Study on a Long-Distance Transmission of Terrestrial
Digital TV Signal Using Optical Fibers

WE1F-3
Low Grazing Incident Effects from Rough Surface

E. Nishiyama and M. Aikawa, Saga Univ., JAPANK. Haeiwa, Y. Toba*, M. Onizawa*, and M. Nakamura**,Hiroshima City Univ., *NEC TOKIN Corp., **NHK, JAPANWE1D-4
A Wideband Circularly Polarized Reconfigurable Patch
Antenna Excited by L-shaped Probes

WE1E-4
Tunable and Configurable Photonic Microwave Bandpass
Filter Implemented in a Radio-over-Fiber Link

WE1F-4
Localization of Electromagnetic Radiating Sources in the
Near-Field of a Uniform Circular Array

S. S. L. Yang and K. M. Luk, City Univ. of Hong Kong,
CHINA

X. Yu, X. Zheng, and H. Zhang, Tsinghua Univ., CHINA

M. J Abedin and A. Sanagavarapu Mohan, UTS, AUSTRALIAWE1D-5
Unidirectional Antenna Composed of a Planar Dipole anda Shorted Patch

WE1E-5
Analysis of The Guided Modes in Photonic Bandgap Fiber
Using Compact 2D-FDTD Method

WE1F-5
Application of BiCG+FFT Techniques to Solution of
Large-Scale Electromagnetic Inverse Problems

H. Wong and K.-M. Luk, City Univ. of Hong Kong, CHINA

J.-J. Wu, R.-J. Li, T.-J. Yang, and J.-H. Tarng, WuFu Rd.,
TAIWANJ.-L. Hu, Northwestern Polytechnical Univ., CHINA

10:50 a.m. – 12:50 p.m.

Wednesday, December 13

Keynote Addresses (2) : New Avenues for Microwave Component
DesignG. Hu*,** and S. Zhang**, *Air Force Engineering Univ.,**Xidian Univ., CHINA

Tatsuo Itoh is Professor of ElectricalEngineering and holder of the Northrop
Grumman Endowed Chair in Microwave andMillimeter Wave Electronics at UCLA. He
is a Fellow of the IEEE, served as the Editorof IEEE Transactions on Microwave Theory
and Techniques, President of the MTTSociety and Editor-in-Chief of IEEE
Microwave and Guided Wave Letters. He
was elected as an Honorary Life Member of
MTT Society in 1994. He received a numberof awards including IEEE Third Millennium Medal and IEEE MTTDistinguished Educator Award. He is a member of National Academy ofEngineering. He has over 1000 publications and generated 65 Ph.D’s.

Speaker : Tatsuo Itoh, Professor of UCLA, U.S.A.
Abstract :This talk will present a subjective view for emerging microwave component and circuit designs deviating from traditional approaches. First, a
trend started about 10 year ago is a global design in which active device
characterizations are combined with passive circuit and electromagnetic
analysis. Second and more recent trend is to take into account the propagation aspects of the communication channel into hardware design. The
third is the dispersion engineering recently coming to greater recognitionby the emergence of metamaterials.

9

TECHNICAL SESSION
Wednesday, December 13

2:00 p.m. – 3:40 p.m.

Room A (301)

Room B (302)

Room C (303)

Session WE3A

Session WE3B

Session WE3C

Silicon Power Amplifier IC Design

Ultra-Wide Band Plannar Filters (2)Chairs : S. Tanaka, Hitachi, Ltd., JAPANH. Wang, National Taiwan Univ., TAIWAN

Chairs : Y. Horii, Kansai Univ., JAPANS.-W. Yun, Sogang Univ., KOREA

WE3A-1SiGe HBT Power Amplifier with Distortion-Controllable
Bias Circuit and Its Application to 802.11g Wireless LANs

WE3B-1
Wideband Chebyshev-Response Bandpass Filter by
Cascading of Cascadable 180° Hybrid Rings

WE3C-1
Coplanar 155 GHz MHEMT MMIC Low Noise
Amplifiers

T. Oka, M. Hirata, Y. Ishimaru, H. Kawamura, and K.
Sakuno, Sharp Corp., JAPANC.-H. Chi and C.-Y. Chang, National Chiao Tung Univ.,
TAIWANM. Kantanen, M. Varonen*, M. Kärkkäinen*, T. Karttaavi, R. Weber**,
A. Leuther**, M. Seelmann-Eggebert**, T. Närhi***, and K. A. I.
Halonen*, Technical Research Centre of Finland, *Helsinki Univ. ofTechnology, FINLAND, **IAF, GERMANY, ***ESTEC, NETHERLANDS

WE3A-2
A Wideband Power Efficient SiGe BiCMOS Medium
Power Amplifier

WE3B-2Compact Planar Ultra-Wide Pass-Band Filters with
Source-Load Coupling and Impedance Stubs
M. Mokhtaari, J. Bornemann, and S. Amari*, Univ. ofVictoria, *Royal Military College of Canada, CANADAWE3C-2A Comparison of Cryogenically Cooled Pseudomorphic
and Lattice Matched InP HEMTs: Implementation in an
Ultra-Low Noise Amplifier

WE3B-3WE3C-312-GHz Low Noise MIC Amplifier with 0.86 dB Noise
FigureH.-C. Bae, S.-H. Kim, S.-H. Lee, H.-K. Yu, and S.-H. Oh*,
ETRI, *National Univ. of Chungnam, KOREA

WE3A-3
Vdd Gate Biasing RF CMOS Amplifier Design Technique
Based on the Effect of Carrier Velocity Saturation
N. Ishihara, Gunma Univ., JAPANWE3A-4A CMOS Power Amplifier for a UHF RFID Reader
Y. Kim, J. Han, D. Lee, C. Park, and S. Hong, KAIST,
KOREA

WE3A-5
A Novel Linearizer and a Fully Integrated CMOS Power
AmplifierSynthesis and Realization of Novel Ultra-Wideband Bandpass
Filters Using 3/4 Wavelength Parallel-Coupled Line
Resonators
P. Cai, Z. Ma*, X. Guan, Y. Kobayashi*, T. Anada**, and G. Hagiwara***,Shanghai Univ., CHINA, *Saitama Univ., **Kanagawa Univ., ***Link
Circuit Inc., JAPANWE3B-4Compact Sub-Millimeter-Wave Ultra-Wideband Bandpass
Filter Using Dual-Mode Ring Resonator and Multiple-Mode
Parallel-Coupled Line Structure
P. Cai, Z. Ma*, X. Guan, Y. Kobayashi*, T. Anada**, and G.
Hagiwara***, Shanghai Univ., CHINA, *Saitama Univ., **Kanagawa
Univ., ***Link Circuit Inc., JAPANWE3B-5
Open Ring Resonators Applicable to Wide-Band BPF
I. Awai and A. K. Saha, Ryukoku Univ., JAPAN

Room A (301)
Session WE4A
High-Performance Silicon Front-End ICs
Chairs : K. Agawa, Toshiba Corp., JAPANN. Suematsu, Mitsubishi Electric Corp.,
JAPAN

Low-Noise

Chairs : Y. Umeda, Tokyo Univ. of Science, JAPANT. Tsukii, Raytheon, U.S.A.

A. Malmros, N. Wadefalk, P. Starski, and J. Grahn,
Chalmers Univ. of Technology, SWEDEN

H. Yukawa, Y. Tsuyama, T. Hamabe*, A. Iida*, Y. Tahara,
K. Mori, and M. Nakayama, Mitsubishi Electric Corp.,*Mitsubishi Electric TOKKI Systems Corp., JAPANWE3C-4Microwave Noise Modeling for PHEMT Using Artificial
Neural Network Technique
J. Gao, X. Li*, and Q.-J. Zhang**, Southeast Univ., *Beijing
Univ. of Posts and Telecommunications, CHINA,**Carleton
Univ., CANADAWE3C-5High Performance LNA in 0.35 um SiGe RF Transceiver
One Chip for Cellular Applications
K.-H. Ahn, D.-J. Keum*, I.-H. Rhyu*, H.-S. Kim*, Y.-B. Jeon*, H.-Y.
Yoo*, J.-Y. Han*, and J.-H. Baek*, Korea Electronics Technology
Institute, *Samsung Electronics Inc., KOREA

S. Ko and J. Lin, Univ. of Florida, U.S.A.

Wednesday, December 13

Compound Semiconductor
Devices and Amplifiers

4:00 p.m. – 6:00 p.m.
Room B (302)

Room C (303)

Session WE4B

Session WE4C

Device Modeling and Circuit Analysis for SiGe/CMOS Low-Noise Devices and Circuits
for Wireless Applications
Power Amplifiers
Chairs : K. Honjo, The Univ. ofElectro-Communications, JAPAN
C. Snowden, Surrey Univ., U.K.

Chairs : Y. Itoh, Shonan Institute of Technology, JAPANM. Madihian, NEC Laboratories America,
Inc., U.S.A.

WE4A-1A Novel CMOS Down-Conversion Mixer with Body
Effect

WE4B-1
Large-Signal Modelling and Comparison of AlGaN/GaN
HEMTs and SiC MESFETs

WE4C-1 (INVITED)A Low Power SiGe GSM/DCS/WCDMA Receiver

H. S. Kang, S. G. Lee, N. G. Myoung *, B. G. Choi*, S. S.
Park*, and C. S.Park, ICU, *ETRI, KOREA

I. Angelov, K. Andersson, D. Schreuers*, N. Rorsman, V.
Desmaris, M. Sudow, and H. Zirath, Chalmers Univ. ofTechnology, SWEDEN, *KU Leuven, BELGIUM

WE4A-210-GHz 0.35-µm SiGe BiCMOS Bottom-LO-SubHarmonic Gilbert Mixer with Lumped-Element Rat-Races

WE4B-2
Application of Optimal Delays Selection on Parallel
Cascade Hammerstein Models for the Prediction of RFPower Amplifier Behavior

S.-C. Tseng and C. Meng, National Chiao Tung Univ.,
TAIWAND. D. Silveira, P. L. Gilabert*, G. Magerl, and E. Bertran*, Vienna Univ.
of Technology, AUSTRIA, *Universitat Politécnica de Catalunya, SPAIN

M. Madihian, NEC Laboratories America, Inc., U.S.A.

WE4C-2
A 5.8 GHz 1.7 dB NF Fully Integrated Differential Low
Noise Amplifier in CMOS
L. Aspemyr*,**, H. Sjöland**, H. Jacobsson*, M. Bao*, and
G. Carchon***, *Ericsson AB, **Lund Univ., SWEDEN,***IMEC, BELGIUM

WE4A-3
A CMOS Transceiver for IEEE 802.11a/b/g Wireless LAN
Applications

WE4B-3
Precise Modeling of Thermal Memory Effect for Power
Amplifier Using Multi-Stage Thermal RC-Ladder Network

Z. Soe, G. Watanabe, S. Zhou, F. Yang, K. Li, and R. Yan,
Realtek Semiconductor Corp., U.S.A.

Y. Takahashi, R. Ishikawa, and K. Honjo, The Univ. ofElectro-Communications, JAPANWE4A-4A CMOS 5GHz RF Transceiver for Wireless HDTV
Distribution

WE4B-4Long-Finger HBT Analysis Based on Device and EM CoSimulation Using FDTD Method

S. Shu, C. Liang, G. Tong, and B. Hu, Amedia Networks,
Inc., U.S.A.

Y. Shinohara, R. Ishikawa, and K. Honjo, The Univ. ofElectro-Communications, JAPANWE4A-5 (INVITED)
Silicon-Based Monolithic Millimeter-Wave Integrated
Circuits

WE4B-5 (INVITED)
Coupled Electrothermal and Electromagnetic Modeling,
Simulation and Design of RF and Microwave Power FETs

WE4C-5A High Performance CMOS LNA for System-on-Chip
GPS

H. Wang, National Taiwan Univ., TAIWAN

C. M. Snowden, Univ. of Surrey, U.K.

B. Bokinge, W. Einerman, A. Emericks, C. Grewing, O.
Pettersson, D. Theil, and S. Waasen, Infineon Technologies
Nordic AB, SWEDEN10

WE4C-3
An Ultra-Low Voltage UWB CMOS Low Noise Amplifier
Y.-H. Yu, Y.-J. E. Chen, and D. Heo*, National Taiwan
Univ., TAIWAN, *Washington State Univ., U.S.A.

WE4C-4
A Ka-Band Low Noise Amplifier Using Standard 0.18 µm
CMOS Technology for Ka-Bnad Communication System
Applications
S.-H. Yen, Y.-S. Lin, and C.-C. Chen, National Chi-Nan
Univ., TAIWANTECHNICAL SESSION
2:00 p.m. – 3:40 p.m.

Wednesday, December 13

Room D (304)

Room E (311+312)

Room F (313+314)

Session WE3D

Session WE3E

Session WE3F

Inverted-F Antennas

Waveguide Analysis and Design

Novel Antenna Arrays

Chairs : K. Li, NICT, JAPANZ. Feng, Tsinghua Univ., CHINA

Chairs : F. Kuroki, Kure National College ofTechnology, JAPANF. Arndt, Univ. of Bremen, GERMANY

Chairs : T. Hirano, Tokyo Institude of Technology,
JAPAN
L. C. Godara, The Univ. of New South
Wales, AUSTRALIAWE3D-1PIFA with Multi-Layered Structure for Bandwidth
Enhancement

WE3E-1
Guided Modes in Shielded Slot Transmission LineWE3F-1
A Wideband Circularly-Polarized Active Van Atta
Retrodirective Transponder with Information Carrying
Ability

K. Huang and T. Chiu, National Central Univ., TAIWAN

F. Kuroki and K. Miyamoto, Kure National College ofTechnology, JAPANL. Chiu, Q. Xue, and C. H. Chan, City Univ. of Hong Kong,
CHINA

WE3D-2
The High Isolation Dual-Band Inverted F Antenna Diversity
System with the Small N-Section Resonators on the Ground
Plane
K.-J. Kim and K.-H. Park, Korea Electronics Technology Institute
Wireless Components & Telecommunication Research Center, KOREA

WE3D-3Compact Internal IFA for 900/1800MHz Mobile Handsets
J. Wu and Z. Feng, Tsinghua Univ., CHINA

WE3E-2
A 3-D Analysis of The Waveguide with Periodic Structure
in Time Domain

WE3F-2
Active Broadband Integrated Antenna for Differential
Application

Z. Yu, Univ. of Electronic Science and Technology of China,
CHINA

S.-Y. Mok, K.-T. Mok, and W.-S. Chan, City Univ. of Hong
Kong, CHINA

WE3E-3Hybrid CAD Techniques for the Efficient Full-Wave
Optimization of Arbitrarily Shaped WaveguideComponents and Large Aperture Antennas

WE3F-3
Multipath Fading Reduction Using a Phase-Conjugating
Array in a Dual-Reflector Environment

F. Arndt, V. Catina, and J. Brandt*, Univ. of Bremen, *MiG,GERMANY

B. O. Takase, R. N. Pang, J. M. Akagi, M. K. Watanabe, G. S. Shiroma,and W. A. Shiroma, Univ. of Hawaii, U.S.A.

WE3D-4
Design of an Enhanced Bandwidth PIFA with Modified
Shorting Strip

WE3E-4
Design of an Inverted Slot Mode Slow-Wave Circuit Using
Quasi-TEM Analysis

WE3F-4
A Novel Dimensionality Metric for Multi-Antenna
Systems

H. Jung, H. Park, S. Hong, U. Kim, and J. Choi, Hanyang
Univ., KOREA

V. L. Christie, L. Kumar, and N. Balakrishnan*, MTRDC,*IISC, INDIA

M. S. Elnaggar, S. Safavi-Naeini, and S. K. Chaudhuri, Univ.
of Waterloo, CANADAWE3D-5
Planar Inverted-F Antenna with Folded Capacitive Feed
Structure

WE3E-5On the Characteristics of Conjugately CharacteristicImpedance Transmission Lines with Active Characteristic
Impedance

WE3F-5A Design of Partitioned Processor for Broadband Antenna
Array Using Convolution Constraints

Y. Ding and Z. Du, Tsinghua Univ., CHINA

S. Lamultree and D. Torrungrueng, Asian Univ., THAILAND

4:00 p.m. – 6:00 p.m.

L. C. Godara and M. R. Sayyah Jahromi, Univ. of New South
Wales, AUSTRALIA

Wednesday, December 13

Room D (304)

Room E (311+312)

Room F (313+314)

Session WE4D

Session WE4E

Session WE4F

Reconfigurable Antennas

Recent Advances on Periodic and Multilayered Packaging Technology
Chairs : K. Nishizawa, Mitsubishi Electric Corp., Structures
Chairs : H. Kondoh, Hitachi, Ltd., JAPANJAPAN
R. Sorrentino, Univ. of Perugia, ITALYWE4D-1 (INVITED)
Dual Band Reconfigurable Beam Forming Networks for
WLAN Applications

Chairs : T. Hiraoka, Kanagawa Univ., JAPAN
C. L. Wang, National Taiwan Univ. of Scienceand Technology, TAIWAN

H. Barnes, Agilent Technologies, U.S.A.

WE4E-1
Control of the Electrodynamic Properties of The
Waveguide Formed by the Gap between Two Periodic
Layered Structures by Means of the External Fields

WE4F-1
Design-for-Manufacturability (DFM) Methodology andYield Analysis for Embedded RF Circuits for System-inPackage (SiP) Applications

A. A. Bulgakov, V. K. Kononenko, and O. V. Kostylyova, Institute ofElectronics and Radiophysics of NAS of Ukraine, UKRAINE

S. Mukherjee and M. Swaminathan, Georgia Institute ofTechnology, U.S.A.

WE4D-2
Waveguide Slot Array In-Motion Antenna for Receiving
Both RHCP and LHCP Using Single Layer Polarizer

WE4E-2
Investigation of Reflection and Transmission Coefficientson Active Multilayered Semiconductor Structure

K.-S. Son, S.-Y. Hwang*, C.-G. Park*, and J.-W. Yu,
KAIST, *Wiworld Co., Ltd., KOREA

A. A. Bulgakov and O. V. Shramkova, The National Academyof Sciences of Ukraine, UKRAINEWE4F-2Estimation of Radiated Emission from the Power/Ground
Planes and Its Reduction Using an Improved Calculation
MethodWE4D-3
Design of Compact Switched Slot Antenna

WE4E-3
Advanced 3D LTCC Passive Components Using Cavity
Structures for 60GHz Gigabit Wireless Systems

WE4F-3Development of a Pogo Pin Assembly and Via Design for
Multi-Gigabit Interfaces on Automatic Test Equipment

J.-H. Lee, N. Kidera*, A. Traille, S. Pinel, J. Laskar, and M.
Tentzeris, Georgia Institute of Technology, U.S.A., *Asahi
Glass Co., Ltd., JAPANH. Barnes, J. Moreira*, H. Ossoinig*, M. Wollitzer**, T. Schmid**and M. Tsai***, Verigy Inc., U.S.A., *Verigy Inc., GERMANY,**Rosenberger, GERMANY, ***Xilinx Inc., U.S.A.

WE4D-4
Realization and Measurements of Planar Switchable
Antenna System

WE4E-4
Wideband Aperture Coupled Stacked Patch Type
Microstrip to Waveguide Transition for V-Band

WE4F-4
A Front-End Module for CDMA Based on Zero Shrinkageof LTCC

J. Sun, W. Chen, X. Wang, Z. Feng, Y. Furuya*, and A.
Kuramoto*, Tsinghua Univ., CHINA, *NEC Corp., JAPANH. Y. Lee, D. S. Jun, S. E. Moon, E. K. Kim, J. H. Park, andK. H. Park, Electronics and Telecommunications ResearchInstitute, KOREA

D. Kim, H.-M. Cho, J.-I. Ryu, J.-C. Kim, J.-C. Park, and N.K. Kang, Korea Electronics Technology Institute, KOREA

WE4D-5
A Consideration On A Beam Adjustable Microstrip Array
Antenna

WE4E-5 (INVITED)
Periodically Loaded Transmission Line Media/Materials
with Infinite Extent on Coplanar Waveguide: GuidedWave Performances

WE4F-5 (INVITED)
On-Wafer Level Packaging of RF MEMS Devices for KaBand Applications

R. Sorrentino, R. V. Gatti, L. Marcaccioli, A. Ocera, E.
Sbarra, and M. A. Corbucci, Univ. of Perugia, ITALYW. H. Chen, Z. H. Feng, J. W. Sun, Y. Furuya*, and A.
Kuramoto*, Tsinghua Univ., CHINA, *NEC Corp., JAPANM. Yassir, Y. Kimura, and M. Haneishi, Saitama Univ.,JAPAN

L. Zhu, Nanyang Technological Univ., SINGAPORE

11S. Kahng, Univ. of Incheon, KOREA

Q. Wu*, B.-S. Jin*, K. Tang*, X.-J. He*, F. Zhang**, and J.C. Lee* , **, *Harbin Institute of Technology, CHINA,**Kwangwoon Univ., KOREATECHNICAL SESSION
Thursday, December 14

8:50 a.m. – 10:30 a.m.

Room A (301)

Room B (302)

Room C (303)

Session TH1A

Session TH1B

Session TH1C

Microwave Oscillator
Chairs : T. Tokumitsu, Eudyna Devices, JAPANK. Itoh, Mitsubishi Electric Corp., JAPANAdvances in Tunable and Metamaterial Miniaturization and Optimization of Hybrid
Filters and Resonators
Couplers
Chairs : M. Miyazaki, Mitsubishi Electric Corp.,JAPAN
C. Quendo, LEST-UBO, FRANCE

Chairs : T. Kawai, Univ. of Hyogo, JAPAN
M. E. Bialkowski, Univ. of Queensland,
AUSTRALIA

TH1B-1
A Widely-Tunable Balanced Bandstop Filter with Low
Reflections and Separate Stop-Bands

TH1C-1
Periodic Stepped-Impedance Rat Race Coupler with
Arbitrary Power Division

C. G. Hwang and N. H. Myung, KAIST, KOREA

H. Uchida, A. Sato, A. Ohno, N. Yoneda, Y. Konishi, and S.
Makino, Mitsubishi Electric Corp., JAPANY.-C. Chiou, J.-S. Wu, and J.-T. Kuo, National Chiao Tung
Univ., TAIWAN

TH1A-2
Technological Scaling and Minimization of 1/f Noise in
SiGe HBTs Coupled Mode N-Push Oscillator/VCO

TH1B-2
Varactor-Tuned Hairpin Bandpass Filter with Enhanced
Stopband Performance

TH1C-2A Compact Rat Race Coupler Design For Dual-Band
Applications

U. L. Rohde and A. K. Poddar, Synergy Microwave Corp.,
U.S.A.

M.-S. Chung, I.-S. Kim, and S.-W. Yun, Sogang Univ.,
KOREA

F.-L. Wong and K.-K. Cheng, The Chinese Univ. of Hong
Kong, CHINA

TH1A-3
A Ku-Band Push-Push VCO Using Phase Shifters

TH1B-3
Coupling Compensated 180° Phase Shift Coupled-Line
Filters Terminated in Arbitrary Impedances

TH1C-3Harmonic Suppression and Size Reduction of Planar RatRace Hybrid Couplers

H.-R. Ahn, K. Min, D. Kang, S. Hong, and B. Kim, POSTECH,
KOREA

P. Mondal and A. Chakrabarty, Indian Institute ofTechnology, INDIA

TH1B-4
Piezoelectric-Based Tunable Microstrip Shunt Resonator

TH1C-4
A Novel Compact-Size Ka-Band Branch-Line Coupler

M. Al-Ahmad, N. Rolland, and P.-A. Rolland, IEMN,FRANCE

S.-S. Liao, P.-T. Sun, H.-W. Liu, and C.-C. Chen, Feng-Chia
Univ., TAIWAN

TH1A-5
Power Enhancement of Microwave Oscillator Using a
High-Q Spiral-Shaped DGS Resonator

TH1B-5
CRLH Zeroth Order Resonator (ZOR) : Experimental
Demonstration of Insensitivity to Losses and to Size

TH1C-5
Wideband Multi-Section Quadrupled InductiveCompensated Parallel-Coupled Lines

J. Jung, D.-J. Woo, C. S. Cho, and T.-K. Lee, Hankuk
Aviation Univ., KOREA

S. Abielmona, H. V. Nguyen, and C. Caloz, École
Polytechnique de Montréal, CANADA

M. Chongcheawchamnan, V. Chamnanphrai**, and R. Phromloungsri*,**,
Research Center of Electromagnetic-Wave Applications, *Mahanakorn
Univ. of Technology, **Rajamangala Univ. of Technology Isan,
THAILAND

TH1A-1Novel Methods for Phase Noise Reduction and Harmonic
Suppression in a Planar Oscillator Circuit Based on Split
Ring Resonators

M. Tsutsumi, T. Tanaka, and M. Aikawa, Saga Univ., JAPANTH1A-4A High-Efficiency GaN/AlGaN HEMT Oscillator
Operating at L-Band
J. S. Kim, W. Wu, J. Lin, A. Verma, S. Jang, F. Ren, S.
Pearton, R. Fitch*, and J. Gillespie*, Univ. of Florida, *AirForce Research Laboratory, U.S.A.

Thursday, December 14

10:50 a.m. – 12:30 p.m.

Room A (301)

Room B (302)

Room C (303)

Session TH2A

Session TH2B

Session TH2C

Frequency Multiplication and Conversion Design and Implementaion Techniques for Advanced Coupler Design and Fabrication
Techniques
Circuits
Microwave Filters
Chairs : N. Itoh, Toshiba Corp., JAPANK. Nishikawa, NTT, JAPAN

Chairs : K. Suzuki, ISTEC, JAPANO. Bartz, Panasonic Electronic Devices
Europe GmbH, GERMANY

Chairs : H. Oh-hashi, Mitsubishi Electric Corp., JAPANK. K. M. Cheng, The Chinese University ofHong Kong, CHINA

TH2A-1A High Performance Ka-Band Push-Push Oscillator Using
Finite Ground CPW Structure

TH2B-1
Efficient Time Domain Calculus of Microwave Resonator
Parameters

Y.-L. Zou and H.-K. Chiou, National Central Univ., TAIWAN

I. Awai, T. Ishida, and Y. Zhang, Ryukoku Univ., JAPANTH2C-1
CMRR Analysis for Wideband Passive Monolithic
Differential Quadrature Coupler Implemented Using GaAs
ProcessK. W. Hamed, A. P. Freundorfer, and Y. M. M. Antar*,
Queen’s Univ., *Royal Military College, CANADA

TH2A-2
A 1V 50 GHz Digital-Controlled CMOS Frequency
Divider

TH2B-2
Full Wave Coupled Resonator Filter Optimization Using a
Multi-Port Admittance-Matrix

TH2C-2High Compactness/High Isolation 3D-Broadside Couplers
Design Methodology

S.-Y. Bai, T.-N. Luo, and Y.-J. Emery Chen, National
Taiwan Univ., TAIWAN

S. Otto, A. Lauer, J. Kassner, and A. Rennings, IMST GmbH,GERMANY

M.-N. Do*, D. Dubuc* , **, K. Grenier*, L. Bary*, L.
Mazenq*, and R. Plana*,**, *LAAS-CNRS, **Paul Sabatier
Univ., FRANCE

TH2A-3
Multi-Band/Multi-Mode Current Folded Up-Convert Mixer
DesignTH2B-3Compact Combline Filter with Improved Cross Coupling
Assembly and Temperature Compensation

C.-C. Huang and W.-T. Chen, Yuan Ze Univ., TAIWAN

M. Höft, S. Burger, T. Magath, and O. Bartz, PanasonicElectronic Devices Europe GmbH, GERMANY

TH2C-3
Non-Uniform Tapered Ultra Wideband Directional
Coupler Design and Modern Ultra Wideband Balun
Integration
P. Salem, C. Wu*, and M. C. E. Yagoub, Univ. of OttawaSITE, *Defence R&D Canada, CANADA

TH2A-4A High-Efficiency, Broadband and High Output PowerPHEMT Balanced K-Band Doubler with Integrated Balun

TH2B-4
A 55GHz 5-pole NRD Guide E-Plane Bandpass Filter forMillimeter Wave OFDM Applications

TH2C-4A CPW Hybrid Coupler with an Enhanced Coupling
Microstructure

W.-R. Lee, S.-F. Chao, Z.-M. Tsai, P.-C. Huang, C.-H. Lien,
J.-H. Tsai, and H. Wang, National Taiwan Univ., TAIWAN

T. Shimizu, Y. Kawahara*, T. Nakagawa**, and T.
Yoneyama, Tohoku Institute of Technology, *MMEx Inc.,**NHK, JAPANY. Kitsukawa, M. Hangai, S.-S. Lee, T. Nishino, Y. Yoshida,
and M. Miyazaki, Mitsubishi Electric Corp., JAPANTH2A-5
A Passive Frequency Tripler Using the New Small-Size
Bandpass Filter with Low Insertion Loss

TH2B-5Ultra-Narrowband HTS Filter with 2.5-Wavelength
Hairpin Resonators in 7 GHz Band

J.-K. Min, H.-J. Kim, Y.-H. Kim, D.-J. Kang*, H.-S. Yun**, and U.-S.
Hong, Kwangwoon Univ., *Korea Information & Communication
Polytechnic College, **Samsung SDS Co., LTD., KOREA

N. Shiokawa, H. Kayano, M. Yamazaki, T. Watanabe, F.
Aiga, and T. Hashimoto, Toshiba Corp., JAPANTH2C-5
Monolithic Integration of Microstrip Line Couplers for
Automotive Radar Applications at 77 GHz Using a Si-HBTTechnology

12

M. Hartmann, K. Seemann, H. Jäeger*, E. Kolmhofer*, and R. Weigel,
Univ. of Erlangen-Nuremberg, GERMANY, *Danube Integrated
Circuit Engineering, AUSTRIATECHNICAL SESSION
8:50 a.m. – 10:30 a.m.

Thursday, December 14

Room D (304)

Room E (311+312)

Room F (313+314)

Session TH1D

Session TH1E

Session TH1F

Millimeter Wave and Integrated Antennas (1) Advanced High Power Amplifiers

Numerical Analysis

Chairs : J. Hirokawa, Tokyo Institute of Technology,
JAPAN
K. Ghorbani, RMIT Univ., AUSTRALIA

Chairs : K. Maruhashi, NEC Corp., JAPAN
H.-K. Chiou, National Central Univ.,
TAIWAN

Chairs : K. Nishimura, Ryukoku Univ., JAPANJ. Rautio, Sonnet Software, Inc., U.S.A.

TH1D-1
InP Aperture Coupled Patch Antenna for MillimeterWave/Photonic Integrated Circuits

TH1E-1
A Family of 20 W Linear Driver ICs for RF High Power
Amplifiers

TH1F-1
Exact Calibration of Multiple Coupled Internal Ports inElectromagnetic Analysis

W. S. T. Rowe and K. Ghorbani, RMIT Univ., AUSTRALIA

C. D. Shih, P. Andersson*, R. Bagger, Y. Yu, A. Rivera, J.
Sjöström**, and R. Hooper, Infineon Technologies, North
American Corp., U.S.A.

J. C. Rautio, Sonnet Software, Inc., U.S.A.

TH1D-2
Flip-Chip Bonded Stacked Patch Antenna for Monolithic
Microwave Integrated Circuits

TH1E-2
Closed-Loop Power Control of Radio Frequency Power
Amplifier Module with an on-Chip Embedded Power
Detector

TH1F-2
Application of Stopband of Composite Right/left-Handed
Transmission Line for Broadband Power Divider Design

A. S. Elmezughi and W. S. T. Rowe, RMIT Univ., AUSTRALIA

K.-H. Tsai and C.-K.Tzuang, National Taiwan Univ., TAIWAN

J.-W. Wu, S.-W. Chen, and C.-W. Tang, National Chung
Cheng Univ., TAIWAN

TH1D-3
Micromachined Inset-Fed Patch Antenna at Ka-Band
P. Sharma, S. K. Koul, and S. Chandra, Indian Institute ofTechnology, INDIA

TH1D-4Ultrawide-Band Integrated Circuit Package Antenna in
LTCC Technology

TH1E-3
1.5 kW, S-Band Solid-State Pulsed Power Amplifier with
Digitally Controlled Automatic Gain Equalizer Circuit

TH1F-3
An Efficient Variant of GMRES Iterative Method for
FMM Implementation

K. H. Kim, Y. R. Lee, J. H. Joo, H. J. Kim, J. J. Choi, and D.
M. Park*, Kwangwoon Univ., *Samsung-Thales Co., Ltd,
KOREA

P. L. Rui and R. S. Chen, Nanjing Univ. of Science andTechnology, CHINA

TH1E-4
Ka-Band Flip-Chip Assembled Power Amplifier

TH1F-4The Multigrid Preconditioned Flexible GMRES Solver
for Hierarchical TVFEM Analysis

M. Sun and Y. P. Zhang, Nanyang Technological Univ.,
SINGAPORE

C.-S. Lee, W.-K. Huang, C.-M. Wang, Y.-M. Hsin, and T.-J.
Yeh*, National Central Univ., *WIN Semiconductors Corp.,
TAIWAN

TH1D-5
Electromagnetic Radiation of Carbon Nanotube Array in
Microwave Frequencies

TH1E-5
A 26 – 65 GHz GaAs pHEMT Cascaded Single Stage
Distributed Amplifier with High Gain/Area Efficiency

TH1F-5The Application of p-Level Schwarz Method forSimulation of Electromagnetic Problems with FEM

Q. Zhu, Univ. of Science and Technology of China, CHINA

K.-Y. Lin, I.-S. Chen, and H.-K. Chiou, National Central
Univ., TAIWAN

X. W. Ping and R. S. Chen, Nanjing Univ. of Science andTechnology, CHINA

X. W. Ping and R. S. Chen, Nanjing Univ. of Science andTechnology, CHINA

10:50 a.m. – 12:30 p.m.
Room D (304)

Room E (311+312)

Session TH2D

Session TH2E

Millimeter Wave and Integrated Antennas (2) Modulation and Related Technologies

Thursday, December 14
Room F (313+314)
Session TH2F

Lossy Materials

Chairs : H. Sato, Tohoku Univ., JAPANK. Eccleston, Univ. of Canterbury, NEWZEALAND

Chairs : H. Furuta, NHK, JAPAN
Chairs : S. Watanabe, Aoyama Gakuin Univ., JAPANW.-M. Woo, Samsung RFIC Design Center
K. L. Wu, Chinese Univ. of Hong Kong,at Georgia Tech, U.S.A.
CHINA

TH2D-1
Design of Millimeter-Wave Microstrip Comb-Line
Antenna Array Beam-Tilting in Perpendicular Plane of
Feeding Line

TH2E-1Frequency and Power Saving of the Future Generation
Wireless Communications by Superconducting Filter

Y. Kashino, K. Sakakibara, Y. Tanaka*, N. Kikuma, and H. Hirayama,
Nagoya Institute of Technology, *Toyota Central R&D Labs., JAPANM. Shigaki, Y. Hagiwara, K. Yamanaka*, and K. Kurihara*,
Fujitsu Wireless Systems Ltd., *Fujitsu Ltd., JAPANTH2F-1
Radiation Characteristics of a Periodically Slotted Parallel
Plate Waveguide Filled with a Transversely Maganetized
FerriteK. Nishimura, Ryukoku Univ., JAPANTH2D-2A Compact Cavity-Backed Annular Slot Antenna Arrayfor 60-GHz Applications

TH2E-2
Spatially Superposed M-Ary QAM Wireless Communication
System

TH2F-2
Physical Model Order Reduction for Multilayer Lossy RF
Embedded Passives

K.-F. Hung and Y.-C. Lin, National Taiwan Univ., TAIWAN

M. Tanaka and T. Eguchi, Nihon Univ., JAPANH. Hu, J. Wang, and K.-L. Wu, the Chinese Univ. of Hong
Kong, CHINA

TH2D-3
Slot Array Antennas Fed by Integrated Wave Guide on
Liquid Crystal Polymer for V-Band Wireless LAN
Application
I.-K. Kim, K.-S. Yang, S. Pinel, and J. Laskar, Georgia
Institute of Technology, U.S.A.

TH2E-3
Evaluation of Millimeter-Wave MIMO-OFDM Transmission
Performance in a TV Studio

TH2F-3
Study of Reflection Properties of Thin Slabs Based on
Artificial Materials

S. Suzuki, T. Nakagawa, H. Furuta, and T. Ikeda, NHK,JAPAN

A. Munir and H. Kubo, Yamaguchi Univ., JAPANTH2D-4
Measurements of a Compact Surface Wave Launcher
Array with Application to Single Frequency Beam Steering
Leaky Wave Antennas
A. P. Freundorfer, M. Z. I. Bekheit, and Y. M. M. Antar*,
Queen’s Univ., *Royal Military College, CANADA

TH2E-4
Analytic Quantization Modeling of OFDM Signals Using
Normal Gaussian Distribution

TH2F-4
Guiding Modes of Electromagnetic Crystal Waveguides
Consisting of Magnetized Ferrite

H. Ehm, S. Winter, and R. Weigel, Univ. of ErlangenNuremberg, GERMANY

H. Jia and K. Yasumoto, Kyushu Univ., JAPANTH2D-5Four-Way Power Combining Integrated Antenna

TH2E-5
A Case Study on Frequency Reuse in OFDMA Systems
Using a Hierarchical Resource Radio Resource
Management

TH2F-5
Analytical Study of Temperature Distribution of OneLayer EM-Absorber Using a Lossy Dielectric Material

K. W. Eccleston, Univ. of Canterbury, NEW ZEALAND

B. Roy, M. Einhaus*, and C. K. Roy, Queen’s Univ., CANADA, *RWTH Aachen Univ., GERMANY

13

S. Watanabe, K. Saito, T. Kurakata, and O. Hashimoto,
Aoyama Gakuin Univ., JAPANTECHNICAL SESSION
Thursday, December 14

2:00 p.m. – 3:40 p.m.

Room A (301)

Room B (302)

Room C (303)

Session TH3A

Session TH3B

Session TH3C

Linearization Technologies for Power Advanced Divider Analysis and Designs
Amplifiers
Chairs : I. Sakagami, Toyama Univ., JAPAN

Artificial and Novel Materials for Antenna
Applications (1)Chairs : T. Nojima, Hokkaido Univ., JAPANY.-H. Jeong, Pohang Univ. of Science andTechnology, KOREA

Chairs : T. Maruyama, NTT DoCoMo, Inc., JAPANK. Eccleston, Univ. of Canterbury, NEWZEALAND

S. Kahng, Univ. of Incheon, KOREA

TH3A-1
Pre-Distortion Linearizer Using Self Base Bias Control
Circuit

TH3B-1A New Parallel-Strip Power Divider with Enhanced
Isolation Performance

TH3C-1
Slotted Composite Right/Left-Handed Strip Lines for
Leaky Wave Antenna Applications

S. Shinjo, K. Totani, H. Tokunaga, K. Mori, and N.
Suematsu, Mitsubishi Electric Corp., JAPANL. Chiu and Q. Xue, City Univ. of Hong Kong , CHINA

Y. Sasaki, A. Sanada, and H. Kubo, Yamaguchi Univ.,
JAPAN

TH3A-2
Series Anti-Parallel Diode Linearizer for Class-B Power
Amplifiers with a Gain Expansion

TH3B-2An UWB Planar Out-of-Phase Power Divider Employing
Microstrip-Slot and Parallel Stripline-Microstrip
Transitions

TH3C-2
Investigation of a Tessellated Meta-Material Planar Circuit

K. Yamauchi, H. Noto, S. Ishizaka, Y. Hamamatsu, M.
Nakayama, and Y. Isota, Mitsubishi Electric Corp., JAPANK. W. Eccleston, Univ. of Canterbury, NEW ZEALAND

A. M. Abbosh*,**, M. E. Bialkowski*, and J. Mazierska***, *Univ. of
Queensland, AUSTRALIA, **Mosul Univ., IRAQ, ***Massey Univ.,
NEW ZEALAND

TH3A-3
Linearity Improvement of RF Power Amplifiers Using a
Simple High-Order Predistorter for WCDMA Applications

TH3B-3
A New Type of 3-Way Power Divider Using An
Intentional Mismatched Termination

Y.-S. Lee, K.-I. Jeon*, and Y.-H. Jeong, Pohang Univ. of
Science and Technology, *RFcore Ltd., KOREA

J.-S. Bae, J.-S. Lim, K.-S. Kim, J. Kim, and D. Ahn,
Soonchunhyang Univ., KOREA

TH3A-4
A Polar Function Linearizer Using Even Order Harmonic
Signals

TH3B-4A Design Method of Dual-Frequency Wilkinson Power
Divider

TH3C-4
Performance Evaluation of a Very Small Magnetic Core
Loop Antenna for an LF Receiver

E.-K. Kim, K.-K. Jeon, Y. Kim, and Y.-C. Yoon*, Kumoh
National Insitute of Technology, *Kwandong Univ., KOREA

T. Kawai, J. Yamasaki*, Y. Kokubo, and I. Ohta, Univ. of
Hyogo, *SANYO Electric Co., Ltd., JAPANK. Abe and J. Takada*, CASIO Computer Co., Ltd., *Tokyo
Institute of Technology, JAPANTH3A-5Adaptive Linearization Technique for a Multi-Port
AmplifierTH3B-5
Half-Mode SIW(HMSIW) Multi-Way Power Divider

TH3C-5
Operational Frequency Tuning for Meander-Line Antenna
Fed by Coplanar Waveguide with Finite Ground Plane

T. Kaho, Y. Yamaguchi, T. Nakagawa, and K. Araki*, NTT,
*Tokyo Institute of Technology, JAPANThursday, December 14

B. Liu*, W. Hong*, L. Tian*, H.-B. Zhu*, W. Jiang*, and K.
Wu* , **, *Southeast Univ., CHINA, **Poly-Grames
Research Center, CANADA

TH3C-3
Electromagnetic Band Gap (EBG) Structure Synthesizer
Using Genetic Algorithm for Wireless System
Applications
T. H. Kim, E. Engin, and M. Swaminathan, Georgia Instituteof Technology, U.S.A.

F. Kuroki and H. Ohta, Kure National College of Technology,
JAPAN

4:00 p.m. – 6:00 p.m.

Room A (301)
Session TH4A
High Power Devices and Power Amplifiers
Chairs : M. Kuzuhara, Fukui Univ., JAPANC.-S. Kwak, ETRI, KOREA

Room B (302)

Room C (303)

Session TH4B

Session TH4C

Power Amplifiers and Linearization Technique Artificial and Novel Materials for Antenna
Applications (2)Chairs : T. Yoshimasu, Waseda Univ., JAPANL. Larson, Univ. of California, San Diego,
U.S.A.

Chairs : A. Sanada, Yamaguchi Univ., JAPANJ. Modelski, Warsaw Univ. of Technology,
POLAND

TH4A-1
Numerical Analysis and IR Scan Test for Thermal
Resistance of GaAs MMIC in a Communications Satellite

TH4B-1High Linearity-Wideband PHEMT Darlington Amplifier
with +40 dBm IP3

C. S. Kwak, K. B. Ahn, D. P. Chang, and I. B. Yom, ETRI,
KOREA

K. W. Kobayashi, Sirenza Microdevices, U.S.A.

J. Modelski and Y. Yashchyshyn, Warsaw Univ. of Technology,
POLAND

TH4A-2A 2.14 GHz Class-E LDMOS Power Amplifier

TH4B-2Development of an MCPA Using Digital Pre-Distortionfor Digital Terrestrial TV Broadcasting

TH4C-2
Power Combining Oscillator Array Using Metamaterial
Based Injection Locking Coupling Network

K. Haeiwa, K. Kanamori*, and T. Abe*, Hiroshima City
Univ., *NHK, JAPANK. M. K. H. Leong, A. Lai, and T. Itoh, UCLA, U.S.A.

TH4A-3
Reduced Gate Leakage-Current and RF Power Performanceof AlGaN/GaN HEMTs with an Inner Field-Plate

TH4B-3
A Recursive Digital Predistorter for Linearizing RF Power
Amplifiers with Memory Effects

K. Lee, K. Ko, S. Lee, and K. Yang, KAIST, KOREA

P. L. Gilabert, G. Montoro, and A. Cesari*, Universitat
Politècnica de Catalunya, SPAIN, *LAAS-CNRS, FRANCE

TH4C-3
Design of an 8-Element Planar Composite Right/LeftHanded Leaky Wave Antenna Array for 2-D Beam
Steering

Y.-S. Lee, K.-I. Jeon*, and Y.-H. Joeng, Pohang Univ. of
Science and Technology, *RFcore Ltd., KOREA

TH4C-1 (INVITED)
Semiconductor and Ferroelectric Antennas

T. Kaneda, A. Sanada, and H. Kubo, Yamaguchi Univ.,
JAPAN

TH4A-4
Prospective and Issues for GaN Microwave Electronics
into Space Satellites

TH4B-4
Short Term Memory Effects Study for Optimal PredistortionBased Linearization of Base-Stations Wireless Transmitters

TH4C-4On the Reduction of Mutual Couplings between Closely
Separated Patch Antennas

J.-L. Cazaux, S. Forestier, J.-F. Villemazet, O. Vendier, C.
Schaffauser, C. Drevon, and J.-L. Muraro, Alcatel Alenia
Space, FRANCE

M. Helaoui*,**, S. Boumaiza*, A. Ghazel**, and F. M. Ghannouchi*,*Univ. of Calgary, CANADA, **École Supérieure des Communications
de Tunis, TUNISIA

G. S. A. Shaker and S. Safavi-Naeini, Univ. of Waterloo,
CANADA

TH4A-5 (INVITED)
Recent Progress of High Power GaN-HEMT for WirelessApplication

TH4B-5 (INVITED)
Digital Predistortion Techniques for Linearized Power
Amplifiers

TH4C-5
A Broadband Planar Patch Array Resonator Antenna

K. Joshin and T. Kikkawa, Fujitsu Laboratories Ltd., JAPANL. Larson, D. Kimball, P. Asbeck, P. Draxler, J. Deng, and
M. Li, Univ. of California, San Diego, U.S.A.

14

D. Kim, M. Kim, M. Tanaka*, and K. Matsugatani*, Korea
Univ., KOREA, *DENSO Corp., JAPANTECHNICAL SESSION
2:00 p.m. – 3:40 p.m.

Thursday, December 14

Room D (304)

Room E (311+312)

Room F (313+314)

Session TH3D

Session TH3E

Session TH3F

Novel FDTD Method

System-Related Technologies (1)Microwave Silicon VCO Design

Chairs : K. Fujimori, Okayama Univ., JAPANF.-C. Chen, National Chiao Tung Univ.,
TAIWAN

Chairs : D. Gray, NICT, JAPANT. Liu, Univ. of Calgary, CANADA

Chairs : H. Sato, Renesas Technology Corp., JAPANH. Zirath, Chalmers Univ. of Technology,
SWEDEN

TH3D-1
Effect of the Conductivity Profile on the Stability of the
ADI-FDTD Method with Split-Field PML

TH3E-1
Dynamic Nonlinear Behavior Characterization for Wideband
RF Transmitters Using Augmented Hammerstein Models

TH3F-1
A 5.5GHz, 8mW, LC Tank CMOS VCO with Optimal
Phase Noise Performance

J.-N. Hwang and F.-C. Chen, National Chiao Tung Univ.,
TAIWANT. Liu, S. Boumaiza, A. B. Sesay, and F. M. Ghannouchi,
Univ. of Calgary, CANADA

S.-M. Oh, B.-H. Jo, Y.-S. Na, and T.-S. Kim, Samsung
Electro-Mechanics Corp., KOREA

TH3D-2Hybrid PML-ABC Truncation Techniques for FiniteVolume Time-Domain Simulations

TH3E-2
Analog Integrator and Analog-to-Digital Converter Effecton a Multi-Resolution Spectrum Sensing (MRSS) for
Cognitive Radio Systems

TH3F-2Differential VCO Design with a Wide Frequency Tuning
Range

K. Sankaran, C. Fumeaux, and R. Vahldieck, ETH Zurich,
SWITZERLAND

TH3D-3
A Novel Extended FDTD Method for the Analysis of the
Active Integrated Circuit and Antenna Mounted NonLinear Devices
N. Kawashima, K. Fujimori, M. Sanagi, and S. Nogi,
Okayama Univ., JAPANTH3D-4
An Efficient FDTD Algorithm for Computation of
Resonance Frequencies of an Inhomogeneous Cylindrical
Structure

J. Park, Y. Hur*, K. Lim, C.-H. Lee*, H. Kim**, and J. Laskar,
Georgia Institute of Technology, *Samsung RFIC Design Center at
Georgia Tech., U.S.A., **Hanbat National Univ., KOREA

TH3E-3
A Study of Wireless Parallel Data Transmission ofExtremely High Data Rate up to 6.17 Gbps per Channel

TH3F-3
A Low Noise Bulk-Coupled Colpitts CMOS Quadrature
VCO

P. Håkansson, A. Huynh, and S. Gong, Linköping Univ.,
SWEDENY.-H. Cho, F.-C. Chang, M.-F. Lei, M.-D. Tsai, H.-Y.
Chang, and H. Wang, National Taiwan Univ., TAIWAN

TH3E-4
Review of Helices for DTV Broadcast from Prototype
HAPS Airship

TH3F-4
Design of Low Power and High Efficiency Colpitts VCO
with a Cascoded NMOS Cross-Coupled pair

D. Gray, M. Nagatsuka, and R. Miura, NICT, JAPAN

C. I. Shie, J. M. Lin, and Y. C. Chiang, Chang Gung Univ.,
TAIWAN

TH3E-5
A New Long-Distance Deley Profile Measuring Equipment
for Single Frequency Networks in Digital Terrestrial TV
Broadcasting

TH3F-5
A 2.5 GHz CMOS LC VCO with Improved Phase Noise
Based on the Transformer Feedback Scheme

K. V. Srivastava, V. V. Mishra, and A. Biswas, Indian
Institute of Technology, INDIA

TH3D-5
Efficient Analysis of Resonator by the Three-Dimensional
Iterative ADI-FDTD Method
Z. B. Ye and R. S. Chen, Nanjing Univ. of Science andTechnology, CHINA

L. Lin, W.-Y. Yin, J. Mao, and Y.-Y. Wang, Shanghai Jiao
Tong Univ., CHINA

K. Kitayama, K. Haeiwa*, Y. Kawana**, and Y. Morii***, NHK
Integrated Technology, *Hiroshima City Univ., **NHK Engineering
Administration Dept., ***NHK Engineering Service, JAPANY. Hara, H. Sakurai, and Y. Sugimoto, Chuo Univ., JAPAN

4:00 p.m. – 6:00 p.m.
Room D (304)
Session TH4D

Room E (311+312)
Session TH4E

Thursday, December 14
Room F (313+314)
Session TH4F

Waveguide Based on Metamaterials

System-Related Technologies (2)Chairs : H. Kubo, Yamaguchi Univ., JAPANT. Itoh, UCLA, U.S.A.

Chairs : K. Hamaguchi, NICT, JAPANR. Weigel, Univ. of Erlangen-Nuremberg,
GERMANY

TH4D-1
Leaky Wave Radiation from Left-Handed Transmission
Lines Composed of a Cut-off Parallel-Plate Waveguide
Loaded with Dielectric Resonators

TH4E-1
Dual-Mode & Dual-Band RF Module Designed Based on
Homodyne Technology

TH4F-1
A Double Tuned Ku-Band SiGe-MMIC VCO with
Variable Feed-Back Capacitor

Z. Jiang, J. Zhao*, and X. Zhu, Southeast Univ., *Greast
Communication Technology Co., Ltd., CHINA

K. Tsutsumi, M. Kagano, and N. Suematsu, Mitsubishi
Electric Corp., JAPAN

TH4D-2
Guided-Wave Characteristics of Coplanar WaveguideMetamaterials Composed of Unsymmetrical Unit Cells

TH4E-2
A Novel Linear Polar Transmitter Architecture Using
Low-Power Analog Predistortion for EDGE Applications

TH4F-2
A Low Phase Noise 26-GHz Push-Push VCO with a Wide
Tuning Range in 0.18-µm CMOS Technology

J. Gao and L. Zhu, Nanyang Technological Univ., SINGAPORE

W. Woo, K. H. An*, O. Lee*, J. J. Chang, C.-H. Lee, K. Yang*, H.
Kim**, and J. Laskar*, Samsung RFIC Design Center at Georgia Tech,*Georgia Institute of Technology, U.S.A., *Hanbat National Univ.,
KOREA

C.-H. Chiu, K.-H. Liang, H.-Y. Chang, and Y.-J. Chan,National Central Univ., TAIWAN

TH4D-3
Metallic Wire Substrate (MWS) for Miniaturization in
Planar Microwave Applications

TH4E-3
All-Microstrip Design of Three Multiplexed Antennas and
LNA for UWB Systems

TH4F-3A 16-GHz CMOS Differential Colpitts VCO for DS-UWB
and 60-GHz Applications

H. V. Nguyen, J. Gauthier, J. M. Fernandez*, M. S. Sierra-Castañer*,and C. Caloz, École Polytechnique de Montréal, CANADA*Universidad Politécnica de Madrid, SPAIN

A. Serban, M. Karlsson, and S. Gong, Linköping Univ.,
SWEDEN

C.-C. Lee, C.-L. Lu*, and H.-R. Chuang, National Cheng
Kung Univ., *Kun Shan Univ., TAIWAN

TH4D-4
Parallel Conductor Particle for Artificial Magnetic Materialin Microwave Frequency

TH4E-4
Design and Characteristics of High Order Derivative
Gaussian Pulse Generator for DS-UWB

TH4F-4
A 1.5-V 2.4 GHz CMOS Variable Gain Front-End forBluetooth and Wireless LAN Applications

H. Kubo, A. Matsumoto, and A. Sanada, Yamaguchi Univ.,
JAPAN

D.-H. Kim, G.-N. Bang, and C. Park, Myongji Univ., KOREA

S. K. Alam, The Ohio State Univ., U.S.A.

TH4D-5 (INVITED)
Left-Handed Wave Propagation in Rod Media

TH4E-5 (INVITED)The System Design of Integrated Passive Transponder
Devices

TH4F-5 (INVITED)CMOS Devices and Circuits for Microwave and Millimetre
Wave Applications

K. Seemann and *R. Weigel, Univ. of Erlangen-Nuremberg,
GERMANY

H. Zirath*,**, M. Ferndahl*, B. M. Motlagh*, A. Masud*, I. Angelov*,and H.-O. Vickes***, *Chalmers Univ. of Technology, **Ericsson AB,***Ericsson Microwave Systems, SWEDEN

T. Ueda, A. Lai*, N. Michishita*, and T. Itoh*, Kyoto
Institute of Technology, JAPAN, *UCLA, U.S.A.

A. Sanada, Yamaguchi Univ., JAPAN

15

Silicon Frequency Generation and Conversion
ICs
Chairs : T. Masuda, Hitachi, Ltd., JAPANM. Madihian, NEC Laboratories America,
Inc., U.S.A.

TECHNICAL SESSION
Friday, December 15

8:50 a.m. – 10:30 a.m.

Room A (301)

Room B (302)

Room C (303)

Session FR1A

Session FR1B

Session FR1C

Advances on Passive Components

Miniature Planar and Integrated Filters (1)Material Measurements

Chairs : A. Sanada, Yamaguchi Univ., JAPAN
Chairs : Z. Ma, Saitama Univ., JAPAN
Chairs : S. Kurokawa, AIST, JAPAN
C. Caloz, École Polytechnique de Montréal,
C. Phongcharoenpanich, King Mongkut
M. Jacob, James Cook Univ., AUSTRALIACANADA
Institute of Technology Ladkrabang,
THAILAND
FR1A-1
Extended Composite Right/Left-Handed (E-CRLH)
Metamaterial and its Application as Quadband QuarterWavelength Transmission Line

FR1B-1
Miniaturized Microstrip Interlocked-Coupled Bandpass
Filters Using Folded Quarter-Wavelength Resonators

FR1C-1
Study on Complex Permittivity of Materials With
Temperature Change by Microwave Heating

S.-C. Lin, Y.-S. Lin, and C. H. Chen, National Taiwan Univ.,
TAIWANY. Guan* , **, T. Nakayama*, and Y. Nikawa**, *Micro
Denshi Co., Ltd., **Kokushikan Univ., JAPANFR1A-2
Group Delay Compensation Technique for UWB MMIC
Using Composite Right/Left-Handed Circuit

FR1B-2Compact Bandpass Filters Based on Microstrip and
Coplanar Waveguide Resonators

FR1C-2Temperature Dependence of Complex Permittivity of
Planar Microwave Materials

K. Murase, R. Ishikawa, and K. Honjo, The Univ. of ElectroCommunications, JAPANT.-N. Kuo, S.-C. Lin, C.-H. Wang, and C.-H. Chen, National
Taiwan Univ., TAIWAN

M. V. Jacob*, J. Krupka**, J. Mazierska*,***, and M. Bialkowski****,*James Cook Univ., AUSTRALIA, **Politechniki Warszawskiej,
POLAND, ***Massey Univ., NEW ZEALAND, ****Univ. of
Queensland, AUSTRALIAFR1A-3A Single-Diode Frequency Doubler Using a Feed-Forward
Technique

FR1B-3
A Novel Compact Microstrip Bandstop Filter Based onComplementary Split-Ring Resonators

FR1C-3
Evaluation of Complex Permittivity of Materials Partially
Filled in Coaxial Line by Using Hybrid Numerical Method

P. Rajanaronk, A. Namahoot, and P. Akkaraekthalin,
King Mongkut’s Institute of Technology North Bangkok,
THAILAND

J.-H. Lee, Y.-C. Oh, and N.-H. Myung, KAIST, KOREA

H. Yoshitake, H. Miyagawa, T. Nishikawa, K. Wakino, andT. Kitazawa, Ritsumeikan Univ., JAPANFR1A-4Use of Quad-Phase Surface Acoustic Wave Filters as
Power Combiner/Divider for RF Power Amplifiers

FR1B-4A Miniaturized Microstrip Common Resonator Triplexer
without Extra Matching Network

FR1C-4
A Short-Circuit Transmission Line Method for PIM
Evaluation of Metalic Materials

J. G. Wen* , **, K. Hashimoto**, and M. Yamaguchi**,*University of Electronic Science and Technology of China,
CHINA, **Chiba Univ., JAPANC.-F. Chen, T.-Y. Huang, T.-M. Shen, and R.-B. Wu,
National Taiwan Univ., TAIWAN

Y. Yamamoto and N. Kuga, Yokohama National Univ.,
JAPAN

FR1A-5
An Ultra-Low-Loss Micromachined RF Monolithic
Transformer with Partial Pattern Ground Shields (PPGS)
for UWB RFIC Applications

FR1B-5A Compact Multilayered Balanced Filter Using Resonators
Based on Interdigitally-Coupled Lines

FR1C-5
Measurement Accuracy of a TM0m0 Mode Cavity Method
To Measure Complex Permittivity of Rod Samples

T. Fukunaga and K. Wada*, TDK Corp., *The Univ. ofElectro-Communications, JAPANH. Kawabata, T. Kobayashi*, Y. Kobayashi*, and Z. Ma*,
Gunma Industrial Technology Center, *Saitama Univ.,
JAPAN

A. Rennings, S. Otto, J. Mosig, C. Caloz*, and I. Wolff, IMST GmbH,GERMANY, *École Polytechnique de Montréal, CANADA

Y.-S. Lin, C.-C. Chen, H.-B. Liang, T. Wang*, and S.-S. Lu*, National
Chi-Nan Univ., *National Taiwan Univ., TAIWAN

Friday, December 15

10:50 a.m. – 12:30 p.m.

Room A (301)
Session FR2A

Room B (302)
Session FR2B

Room C (303)
Session FR2C

RF-MEMS and Device Modeling

Miniature Planar and Integrated Filters (2)New Measurement Methods

Chairs : T. Nishino, Mitsubishi Electric Corp.,
JAPANK. Wu, École Polytechnique de Montréal,
CANADA

Chairs : J.-P. Hsu, Kanagawa Univ., JAPANT. Ishizaki, Panasonic Electronic Devices
Co., Ltd., JAPAN

Chairs : I. Ida, Fujitsu Ltd., JAPAN
N. Cherpak, National Academy of Sciencesof Ukraine, UKRAINEFR2A-1
Design of H-Shaped Low Actuation-Voltage RF-MEMS
Switches

FR2B-1The Microstrip Filter With Multiple Stacked CapacitivelyLoaded Coupled Lines

A. Batmanov, E. K. I. Hamad, E. P. Burte, and A. S. Omar,
Univ. of Magdeburg, GERMANY

C.-W. Tang, J.-W. Wu, C.-C. Hu, H.-C. Lin*, and S.-S.
Yeh*, National Chung Cheng Univ., *Industrial Technology
Research Institute, TAIWAN

FR2C-1Millimeter Wave Measurements of Complex Permittivityof Lossy Liquids Based on Whispering Gallery DielectricResonator Method

FR2A-2Top vs. Bottom Charging of the Dielectric in RF MEMS
Capacitive Switches

FR2B-2
A Novel Bandpass Filter Design Using Cascaded
CPW/Slotline Ring Resonators with Tapered Step
Impedance CPW Fed Structure

FR2C-2
A Method for Evaluating a Complex Permittivity ofDielectric Material by Using Whispering Gallery modes ona Sphererical Resonator

C.-F. Tai, I.-C. Chen, and H.-K. Chiou, National Central
Univ., TAIWAN

M. Matsubara, Y. Kogami, and Y. Tomabechi, Utsunomiya
Univ., JAPANFR2B-3
A Design of Vertical Coupled Stacked Bandpass Filter
Using Multilayer Structure without Via

FR2C-3High Frequency Characteristics of Cu/Ta/Hydrogen
Silsesquioxane (HSQ) System and the Effects of NH3
Plasma Treatment on the Electrical Properties for
Hydrogen Silsesquioxane

Z. Peng, X. Yuan, J. C. M. Hwang, D. Forehand*, and C. L.
Goldsmith*, Lehigh Univ., *MEMtronics Corp., U.S.A.

FR2A-3
Scalable Nonlinear Resistor Model for GaAs MMIC
Y. Zhu, C. Wei, O. Klimashov, C. Zhang, and Y. Tkachenko,
Skyworks Solution Inc., U.S.A.

W.-J. Guan and L.A. Carpenter, Penn State Univ., U.S.A.

N. T. Cherpak, A. A. Barannik, Y. V. Prokopenko, A. Y. Kirichenko,
E. N. Shaforost, and I. A. Shipilova, National Academy of Sciences of
Ukraine, UKRAINE

C.-C. Ho and B.-S. Chiou, National Chiao Tung Univ., TAIWAN

FR2A-4
An Inductor with Taper Stacked Metals on Silicon Chip
S.-Y. Lee, VIA Technologies, Inc., TAIWAN

FR2B-494 GHz CPW Branch-Line Bandpass Filter for Planar
Integrated Millimeter-Wave Circuits
H.-J. Kwon, S.-W. Moon, D. An, M.-K. Lee, S.-J. Lee, B.-C.
Jun, D.-H. Shin, H.-C. Park, and J.-K. Rhee, Dongguk Univ.,
KOREA

FR2A-5
Barium Strontium Titanate Thin Film Varactors on RPlane Sapphire

FR2B-5
Miniaturized Dual-Mode Quasi-Elliptic Function Bandpass
Filter with Wide Rejection Bandwidth

E. A. Fardin, A. S. Holland, K. Ghorbani, W. K. Simon*, E.
K. Akdogan*, and A. Safari*, RMIT Univ., AUSTRALIA,*The State Univ. of New Jersey, U.S.A.

Y.-Z. Wang, C.-A. Wang, and K.-Y. Lin, Nan Kai Institute ofTechnology, TAIWAN16

FR2C-4Multiport Scattering Matrix Measurement with a Two-port
Network Analyzer Using Only Virtual Auxiliary
Terminations
C.-J. Chen and T.-H. Chu, National Taiwan Univ., TAIWAN

FR2C-5
10,000 Parallel Heterodyne System for Instantaneous
Photonics-Based Acquisition of Near-Fields Images over
Microwave Devices/Circuits
K. Sasagawa, T. Kawanishi, and M. Tsuchiya, NICT, JAPANTECHNICAL SESSION
8:50 a.m. – 10:30 a.m.

Friday, December 15

Room D (304)

Room E (311+312)

Room F (313+314)

Session FR1D

Session FR1E

Session FR1F

Small Antennas for RFID
Chairs : Y. Karasawa, The Univ. ofElectro-Communications, JAPANJ. Choi, Hanyang Univ., KOREA
FR1D-1A Novel Design of an UHF RFID Reader Antenna for PDA
S. Kim, H. Park, D. Lee, and J. Choi, Hanyang Univ.,
KOREA

Ubiquitous Communications and Location Design and Analysis Methods for Printed
Systems
Antennas
Chairs : T. Wada, Kansai Univ., JAPANS. Tenqchen, Chunghwa Telecom
Telecommunication Labs., TAIWAN

Chairs : M. Haneishi, Saitama Univ., JAPANJ.-S. Sun, National Taipei Univ. ofTechnology, TAIWAN

FR1E-1
Design and Development of Novel Miniaturized UHF
RFID Tags on Ultra-Low-Cost Paper-Based Substrates

FR1F-1Analyzing Radiation From a Cylindrical-Rectangular
Microstrip Patch Antenna Loaded with a Superstrate andan Air Gap, Using The Electric Surface Current Model

L. Yang, S. Basat, A. Rida, and M. M. Tentzeris, Georgia
Institute of Technology, U.S.A.

FR1D-2Development of Insensitive RFID Tag for Variation ofChip ImpedanceFR1E-2
Helping to Collect Traffic Information Using RFID Tag
Implemented on Urban-bus for Traffic Information

K.-S. Min and J.-W. Kim, Korea Maritime Univ., KOREA

S. Tenqchen, F.-S. Chang*, Y.-C. Lee**, C.-H. Wang, C.-H. Lee, and
S.-L. Tung, Chunghwa Telecom Telecommunication Labs., *Ministryof Transportation and Communication, **THI Asia Consultants Ltd.,TAIWAN

FR1D-3
Trapezoidal Dual Loop Antenna for Radio Frequency
Identification (RFID) System at Low Frequency

FR1E-3
Low Cost Transceiver for DSRC Applications

C. Mansap, P. Wounchoum, C. Phongcharoenpanich, and D.
Torrungrueng*, King Mongkut’s Institute of Technology
Ladkrabang, *Asian Univ., THAILAND

N. Almeida, R. Abreu, J. N. Matos, N. B. Carvalho, and J. S.
Gomes*, Univ. de Aveiro, *Brisa Autoestradas de Portugal,
PORTUGAL

F. R. Cooray and J. S. Kot, CSIRO ICT Centre, AUSTRALIA

FR1F-2
L-Probe Fed Multiband Microstrip Antennas with Slots
C. D. Salamat, M. Haneishi, and Y. Kimura, Saitama Univ.,
JAPAN

FR1F-3
Study of Various Slots in Circular Patch for Circularly
Polarized Antennas and Enhancing their Gain by Short
Horns
N. Nasimuddin, K. P. Esselle, and A. K. Verma, Macquarie
Univ., AUSTRALIA

FR1D-4
Feeding Point Determination Regarding Hand Effect of
PIFA for Mobile RFID Band

FR1E-4
Transmission Performance of UWB-IR System using DLLTiming Synchronization

FR1F-4Characterization of Elliptically Polarized Antenna byComplex Effective Length

Y. H. Lim, K. Chang, Y. J. Yoon, and Y. Kim*, Yonsei
Univ., *Samsung Advanced Institute of Technology, KOREA

T. Wada and H. Okada, Kansai Univ., JAPANJ. Kapor, National Communication Authority, HUNGARY

FR1D-5
A Passive UHF RFID Meandered Tag Antenna with
Tuning Stubs

FR1E-5
Position Estimation Techniques for the Local Position
Measurement System LPM

S.-J. Wu and T.-G. Ma, National Taiwan Univ. of Science andTechnology, TAIWANK. Pourvoyeur, A. Stelzer*, and G. Gassenbauer**, LCM,
*Univ. of Linz, **Abatec Electronic AG, AUSTRIAFR1F-5
Theoretical Analysis on the Radiation Properties of a
Circular Sector Microstrip Antenna Under Re-Entry
Conditions
D. Bhatnagar, A. Kimothi, V. K. Tiwari, V. K. Saxena, and J.
S. Saini, Univ. of Rajasthan, INDIA

10:50 a.m. – 12:30 p.m.
Room D (304)

Room E (311+312)

Session FR2D

Session FR2E

Friday, December 15
Room F (313+314)
Session FR2F

Small Antennas for Mobile Applications

Microwave ApplicationsUWB Antennas

Chairs : Q. Chen, Tohoku Univ., JAPANK. Tong, Univ. College London, U.K.

Chairs : Y. Nikawa, Kokushikan Univ., JAPANY. Lu, Nanyang Technological Univ.,
SINGAPORE

Chairs : N. Kuga, Yokohama National Univ., JAPANY.-J. Yoon, Yonsei Univ., KOREA

FR2D-1Compact 2-Channel MIMO Antenna for WiBro Handy
Terminal Application

FR2E-1
M. Furukawa, Y. Takahashi*1, T. Fujiwara*2, S. Mihara*3, T. Saito*3,

FR2F-1
Rolled Monopole with Bandstop Function for UWB
Applications

D.-J. Kim, K.-S. Min, Y.-M. Moon*, and Y.-E. Kim*, Korea
Maritime Univ., *Samsung Advanced Institute of Technology,
KOREA

Y. Kobayashi*3, S. Kawasaki*4, N. Shinohara*4, Y. Fujino*5, K. Tanaka*6,
and S. Sasaki*6, Nihon Dengyo Kousaku Co., Ltd., *1IHI AerospaceCo., Ltd., *2Sho Engineering Co., Ltd., *3Institute for Unmanned Space
Experiment Free Flyer, *4Kyoto Univ., *5NICT, *6JAXA, JAPAN

H.-K. Yoon, W.-S. Kang, Y.-J. Yoon, S.-M. Han*, and Y.-H.
Kim*, Yonsei Univ., *Samsung Advanced Institute ofTechnology, KOREA

FR2D-2
Effects of Bending GPS Antennas

FR2E-2A Self-Steering Array and its Application to Phase
Synchronization

FR2F-2CPW-Fed UWB Slot Antenna

T. Kellomäki, J. Heikkinen, and M. Kivikoski, Tampere
Univ. of Technology, FINLAND

FR2D-3
Design of an Internal DTV Antenna for Portable
Multimedia Player

5.8-GHz Planar Hybrid Rectenna for Wireless Powered Applications

K. Hashimoto, H. Shibata*, and H. Matsumoto, Kyoto Univ.,*Ministry of Land, Infrastructure and Transport Govermentof Japan, JAPANFR2E-3Patch Array to Heat Thin Material Using Microwave
Y. Nikawa and Y. Guan, Kokushikan Univ., JAPANY.-S. Yu, D.-H. Seo, S.-G. Jeon, and J.-H. Choi, Hanyang
Univ., KOREA

Y.-C. Lee, S.-C. Lin, and J.-S. Sun, National Taipei Univ. ofTechnology, TAIWAN

FR2F-3
A Compact Microstrip Slot Antennas Fed by a Microstrip
Line with a Multi Tuning Stubs for UWB Applications
I. Fitri and E. T. Rahardjo, Univ. of Indonesia, INDONESIA

FR2D-4A Design of Wide Band Small Chip Antenna Using the
Branch Structure for Mobile Phone

FR2E-4
A Micro-machined Cantilever PSA Sensor with Digital
Wireless Interface

M. Kim, S. Park, J. Min, and H. Kim, Hanyang Univ.,
KOREA

H.-T. Chou, R.-Z. Hwang, C.-M. Hung, L.-S. Huang, and S.S. Lu, National Taiwan Univ., TAIWAN

FR2D-5
Design of Ceramic Chip Antenna for Bluetooth
Application in LTCC Technology

FR2E-5
An Experimental GSM Based Passive Radar

FR2F-5UWB Antenna for Wireless Body Area Network

Y. Lu, D. Tan, and H. Sun, Nanyang Technological Univ.,
SINGAPORE

K. Y. Yazdandoost and R. Kohno, NICT, JAPANH.-Y. Zou*,**, Q.-X. Liang*, and Q.-X. Chu*, *South China
Univ. of Technology, **Xidian Univ., CHINA

17

FR2F-4Ultra-Wideband Circularly-Polarized Patch Antenna
K. W. Khoo, Y. X. Guo, and L. C. Ong, Institute for
Infocomm Research, SINGAPORETECHNICAL SESSION
Friday, December 15

2:00 p.m. – 3:40 p.m.

Room A (301)

Room B (302)

Room C (303)

Session FR3A

Session FR3B

Session FR3C

Active Planer Circuits

Planar Filters with Extended Stopband Performance Millimeter-Wave Radar Systems
Chairs : J. Bae, Nagoya Institute of Technology, Chairs : K. Wada, The Univ. of
Chairs : K. Sato, Toyota R&D Labs. Inc., JAPANElectro-Communications, JAPANJAPAN
T. Derham, NHK, JAPANT. Ishizaki, Panasonic Electronic Devices
A. Freundorfer, Queen’s Univ., CANADA
Co., Ltd., JAPANFR3A-1
Design and Characterization of a 45 GHz Yagi-Uda Antenna
Receiver Fabricated on GaAs Micromachined Membrane

FR3B-1
Microstrip Parallel-Coupled Bandpass Filters With SourceLoad Coupling

FR3C-1
Digital Signal Processing of Multi-Reflection for Short
Range Detection Using NRD Guide Pulse Radar FrontEnd at 60 GHz

D. Neculoiu, G. Konstantinidis*, A. Muller, A. Stavinidris*, D.
Vasilache, Z. Chatzopoulos*, L. Bary**, and R. Plana**, IMTBucharest, ROMANIA, *MRG-IESL-FORTH Heraklion, GREECE,**LAAS CNRS Toulouse, FRANCE

C.-H. Wu, C.-H. Wang, and C.-H. Chen, National Taiwan
Univ., TAIWAN

FR3A-2A GaAs pHEMT Based V-Band Balanced Amplifier Using
Uniplanar Tandem Couplers

FR3B-2The Microstrip Bandpass Filters with Wide Stopband
Range

FR3C-2Estimation of FMCW Radar System Performance Using
Measurement Data of a 77-GHz Transmitter

S.-W. Moon, M. Han, J.-H. Oh, H.-J. Kwon, H.-C. Park, J.K. Rhee, and S.-D. Kim, Dongguk Univ., KOREA

M.-G. Chen, C.-W. Tang, P.-J. Hsieh, and J.-W. Wu,
National Chung Cheng Univ., TAIWAN

C. Wagner, A. Stelzer*, and H. Jäger, DICE Gmbh & Co
KG, *Univ. of Linz (ICIE), AUSTRIAFR3A-3
A Direct Digital 2 Gb/s Modulator/Demodulator
Experiment in GaAs HBT at 30 GHz

FR3B-3
A Novel Bandpass Filter with Sharp Attenuations andWide Stopband Developed through the Combined Use ofComposite Resonators and Stepped Impedance Resonators

FR3C-3Modeling and Development of Software-Configurable
Range RadarA. P. Freundorfer, K. Hamed, Y. Sun, Y. Antar, P. Frank*,
and D. Sawatzky*, Queen’s Univ., *Gain Microwave,
CANADA

FR3A-4
A BPSK Modulator Using a Ring-Hybrid and HFET
Switches

H. Miki, Z. Ma, and Y. Kobayashi, Saitama Univ., JAPANFR3B-4Compact Low-Pass Filter for Harmonics Suppression

C. E. Saavedra and Y. Zheng, Queen’s Univ., CANADA

R. Li, D. I. Kim, and C. M. Choi, Korea Maritime Univ.,
KOREA

FR3A-5
Doppler Frequency Converter Using a Semiconductor
Plasma Boundary Moving at a Relativistic Speed

FR3B-5Multi-Path Design for Stepped-Impedance Low-Pass Filter
to Create Transmission Zeros and Wide Rejection Band

J. Bae, Y. J. Xian, and S. Yamada, Nagoya Institute ofTechnology, JAPAN

M.-C. Kang and J.-T. Kuo, National Chiao Tung Univ.,
TAIWAN

Friday, December 15

F. Kuroki, T. Izuho, and T. Yoneyama*, Kure National College ofTechnology, *Tohoku Institute of Technology, JAPANH. Zhang, L. Li, and K. Wu, Polytechnique de Montreal,
CANADA

FR3C-4
Target Identification With Polarization Dependent Transfer
FunctionsS. Hantscher, A. Reisenzahn, and C. G. Diskus, Johannes
Kepler Univ., AUSTRIAFR3C-5
A Method of Imaging by Standing Wave RadarY. Okubo and T. Uebo, Saika Technological InstituteFoundation, JAPAN

4:00 p.m. – 6:00 p.m.

Room A (301)
Session FR4A

Room B (302)
Session FR4B

Room C (303)
Session FR4C

Transceivers

Multi-Band and Multi-mode Planar Filters

Chairs : T. Nakagawa, NTT, JAPAN
B. Staszewski, Texas Instruments Inc.,
U.S.A.

Chairs : Y. Kogami, Utsunomiya Univ., JAPAN
Chairs : K. Sakakibara, Nagoya Institute of
J.-T. Kuo, National Chiao Tung Univ.,
Technology, JAPANTAIWANF. Yanovsky, National Aviation Univ.,
UKRAINE

FR4A-1
A Fully Integrated 2.4 GHz IEEE 802.15.4 Transceiverfor Zigbee Applications

FR4B-1
Dual-Behavior Resonator (DBR) Filters with Spurious
Responses Suppression

FR4C-1 (INVITED)Comparison of the Capabilities of the Millimeter Wave
Region and the THz Region

J. H. Lim, K. S. Cho, B. L. Seo, Y. I. Kwon, W. S. Lee, K.
M. Lee, M. S. Kim, S. H. Min, and T. J. Park, SAMSUNGElectro-Mechanics, KOREA

A. Manchec, C. Quendo, E. Rius, J. F. Favennec, and C.
Person, LEST-UMR CNRS, FRANCE

K. Mizuno, Tohoku Univ., JAPANFR4A-2
A Novel TDD Mode Direct Conversion Digital
Transceiver Using Six-Port Technology

FR4B-2Dual-Behavior Resonator (DBR) C-Band Planar BandPass Filter for a Space Application

FR4C-2Frequency-Encoding Technique for Active MMW Imaging

H. S. Lim, W. K. Kim, J. W. Yu, H. C. Park*, W. J. Byun**,and M. S. Song**, KAIST, *Hanbat National Univ., **ETRI,
KOREA

E. Rius, C. Quendo, Y. Clavet, A. Manchec, C. Person, J. F. Favennec,
P. Moroni*, J. C. Cayrou*, and J. L. Cazaux*, LEST Laboratoired’Electronique et des Systemes de Telecommunications, *Alcatel
Alenia Space France, FRANCE

FR4A-3
Programmable Microwave Function Array, PROMFA

FR4B-3
Design of Microstrip Miniature Dual-Band Filter Using
Embedded Resonators

FR4C-3
Design of Detector Circuit for Layer Structured Imaging
ModuleC.-Y. Hsu, C.-Y. Chen*, and H.-R. Chuang, National Cheng
Kung Univ., *Southern Taiwan Univ. of Technology, TAIWAN

K. Ohkawa, K. Sakakibara, Y. Aoki*, N. Kikuma, and H.
Hirayama, Nagoya Institute of technology, *Denso Corp.,
JAPAN

FR4B-4Novel Compact Dual-Band Bandpass Filters Using
Composite Resonators to Obtain Separately Controllable
Passbands

FR4C-4
Doppler-Polarimetric Microwave Remote Sensing of
Clouds and Precipitation: Models and Algorithms

C. Samuelsson and A. Ouacha, Swedish Defence Research
Agency, SWEDEN

FR4A-4
Serial-Parallel Connection of Direct Sampling Mixer
Y. Morishita, K. Araki, Y. Hosokawa*, K. Abe*, and N.
Saito*, Tokyo Institute of Technology, *Matsushita ElectricIndustrial Co., Ltd., JAPANFR4A-5 (INVITED)
Fully-Integrated CMOS RF Transceivers
W. Krenik and B. Staszewski, Texas Instruments Inc., U.S.A.

Z. Ma, T. Shimizu, Y. Kobayashi, T. Anada*, and G. Hagiwara**,Saitama Univ., *Kanagawa Univ., **Link Circuit Inc., JAPANFR4B-5 (INVITED)
Novel Design and Implementation Methods of HighPerformance RF/Microwave Filters Using Composite
Resonators
Z. Ma, Saitama Univ., JAPAN18

Imaging and Remote Sensing

T. Derham, H. Kamoda, and T. Kuki, NHK, JAPANF. J. Yanovsky, V. V. Marchuk*, and Y. P. Ostrovsky*,
IRCTR, NETHERLANDS, *National Aviation Univ., UKRAINE

FR4C-5
Sensitivity of FMCW 95GHz Cloud Radar for High Clouds
J. Yamaguchi, T. Takano, K. Akita, T. Takamura, H. Kumagai*,and Y. Ohno*, Chiba Univ., *NICT, JAPANTECHNICAL SESSION
2:00 p.m. – 3:40 p.m.

Friday, December 15

Room D (304)

Room E (311+312)

Room F (313+314)

Session FR3D

Session FR3E

Session FR3F

Multiband Antennas

Advanced Technologies for Power Amplifiers Ferrite and SAW Devices

Chairs : T. Teshirogi, Anritsu Corp., JAPANW. Hong, Southeast Univ., CHINA

Chairs : Y. Takayama, Univ. of Hyogo, JAPANT.-W. Huang, National Taiwan Univ.,
TAIWAN

Chairs : M. Tsutsumi, Fukui Univ. of Technology,
JAPAN
A. Alphones, Nanyang Technological
Univ., SINGAPORE

FR3D-1A Printed Triple-Band Antenna for WiFi and WiMAX
Applications

FR3E-1
Improvement of Intermodulation Distortion in Microwave
Power Amplifiers with Intrinsic Second-Harmonic ShortCircuit Termination

FR3F-1
Micromachined GaN-Based FBAR Structures for Microwave Applications

K. Watanabe, Y. Takayama, K. Yamaguchi, T. Fujita, and K.
Maenaka, Univ. of Hyogo, JAPANK. Mutamba, D. Neculoiu*, A. Muller*, G. Konstantinidis**, D.
Vasilache*, C. Sydlo, A. Kostopoulos**, A. Adikimenakis**, A.
Georgakilas**, and H. L. Hartnagel, Technische Universitaet
Darmstadt, GERMANY, *IMT Bucharest, ROMANIA, **MRG-IESLFORTH, GREECE

FR3E-2Compact Device-Level Linearisation Technique Using a
Reduced Complexity Derivative Superposition Approach

FR3F-2
Prediction of Phase Noise in 2.4GHz SAW Oscillator with
Surface Transverse Wave Resonator

R. Negra* , **, F. M. Ghannouchi**, and W. Bächtold*,*ETH Zurich, SWITZERLAND, **Univ. of Calgary, CANADA

J.-H. Lin and Y.-H. Kao, National Chiao-Tung Univ., TAIWAN

FR3D-3
The Performance of Dual-Band CPW-Fed Printed
Antennas for Wireless Body-Worn Applications

FR3E-3
Minimum ACPR “Sweet-Spot” Using Statistical PowerDistribution Function

FR3F-3
Some Nonlinear Properties on the Electromagnetic Waves
in Magnetic Material

X. Qiu and A. S. Mohan, Univ. of Technology, Sydney,
AUSTRALIA

J.-H. Tsai, S.-Y. Chen, W.-C. Chen, and T.-W. Huang,
National Taiwan Univ., TAIWAN

K. Kawabe, T. Kodera*, and Y. Satomura, Osaka Institiute ofTechnology, *ATR, JAPANFR3D-4Compact Multi-Band Antenn for Mobile Telephone
Applications

FR3E-4
InGaP/GaAs HBT Power Amplifier Based on Flexible
Printed Circuit Board

FR3F-4
Effect of Nonuniform Magnetic Field on Left Handed
Ferrite Microstrip Line

S.-Y. Huang and J.-S. Sun, National Taipei Univ. ofTechnology, TAIWAN

S.-S. Myoung, S-H. Cheon*, J.-W. Park*, J.-S. Jang**, M.H. Dong**, and J.-G. Yook, Yonsei Univ., *Agency for
Defense Development, **Knowledge*on, KOREA

K. Okubo and M. Tsutsumi*, Okayama Prefectural Univ.,*Fukui Univ. of Technology, JAPANFR3D-5Dual-Band Printed T-Shaped Slot Antenna for WLAN
Application

FR3E-5
Third-Order Intermodulation Distortion Characteristics ofMillimeter-Wave Self-Heterodyne Transmission
Techniques

FR3F-5
Tunable Stepped Impedance Resonator Bandpass Filter
Using Ferroelectric Materials

Y.-C. Shen, Y.-S. Wang, and S.-J. Chung, National Chiao
Tung Univ., TAIWAN

FR3D-2A Design of Miniaturized Built-in Penta Band Chip
Antenna For EGSM/GPS/DCS-1800/USPCS/WCDMA
Mobile Handset
H. Choi, D. Shin, J. Cho, and H. Kim, Hanyang Univ.,
KOREA

S.-S. Zhong and X.-L. Liang, Shanghai Univ., CHINA

C.-S. Choi and Y. Shoji, NICT, JAPANT.-S. Yun*, H.-S. Kim**, T.-S. Hyun**, S.-S. Kwoun*,***,
H.-G. Kim**, and J.-C. Lee*, *Kwangwoon Univ., **KAIST,***LG-Nortel R&D Conplex, KOREA

4:00 p.m. – 6:00 p.m.
Room D (304)
Session FR4D

Friday, December 15

Room E (311+312)

Room F (313+314)

Session FR4E

Session FR4F

Propagation

Power Amplifiers for Mobile Communication Waveguide Circuits

Chairs : T. Fujii, Japan Telecom., JAPANS. Takahashi, Hiroshima City Univ., JAPAN

Chairs : K. Mori, Mitsubishi Electric Corp., JAPANB. Kim, Pohang Univ. of Science andTechnology, KOREA

Chairs : T. Yakabe, The Univ. ofElectro-Communications, JAPANC.-H. Chen, National Taiwan Unv., TAIWAN

FR4D-1
Measurements on UHF Radio Propagation over the Seto
Inland Sea

FR4E-1
Surface-Mount Power Amplifier Module for WiMAX
Application

FR4F-1 (INVITED)
Substrate Integrated Circuits for Radio-Frequency andMillimeter-Wave System Applications-Status and Outlook

M. Nishi, T. Iwami, S. Takahashi, and T. Yoshida, Hiroshima
City Univ., JAPANN. Yoshimura, K. Matsuzaki, T. Hashinaga, and S. Nakajima,
Eudyna Devices Inc., JAPANK. Wu, Ecole Polytechnique (Univ. of Montreal), CANADAFR4D-2Millimeter Wave Propagation in a Short Outdoor Link
Using the Vectorial Gaussian Beam Tracing Method

FR4E-2
GaAs HBT Power Amplifier for WiBro Applications

FR4F-2
Design of Substrate Integrated Waveguide Sum-Difference
Comparator

M. Shabani and A. A. Shishegar, Sharif Univ. of Technology,
IRAN

P. Li, H. Fuh, L. Prestia, C. Huber, S. Kadambala, C. Masse,
D. Wilson, and E. Balboni, Analog Devices, Inc., U.S.A.

Y. Tang and W. Wu, Nanjing Univ. of Science andTechnology, CHINA

FR4D-3
Proposal of Novel Statistic Channel Model for MillimeterWave WPAN

FR4E-3
Reduced Gain Variation against Temperature with
Thermistor on HPA Module for W-CDMA System

FR4F-3
Low-Loss LIGA-Fabricated Coplanar Waveguide andFilters

H. Sawada, Y. Shoji, and C.-S. Choi, NICT, JAPANA. Kuriyama, S. Yuyama*, M. Ohnishi, H. Matsumoto, T.
Tanoue*, and I. Ohbu*, Hitachi, Ltd., *Renesas Technology
Corp., JAPANM. A. Forman, Sandia National Laboratories, U.S.A.

FR4D-4
A New Computational Parallel Model Applied in 3D RayTracing Techniques for Radio-Propagation Prediction

FR4E-4
A Doherty Power Amplifier Module for Mobile Terminals
with Variable Linearity Function

FR4F-4
A Broadband, Low-Reflection H-Plane Waveguide Cornerwith a Dielectric Circular Post

A. Cavalcante, M. Sousa, J. Crisostomo, C. Frances, and G.
Cavalcante, Federal Univ. of Pará, BRAZIL

T. Kato, K. Yamaguchi, and Y. Kuriyama, Toshiba Corp.,
JAPAN

K. Toda, I. Ohta, and M. Kishihara*, Univ. of Hyogo, *Okayama
Prefectural Univ., JAPANFR4D-5 (INVITED)MIMO Multidimensional Propagation Channel Modeling

FR4E-5 (INVITED)
Doherty Linear Power Amplifiers for Mobile Handset
Applications

FR4F-5
Analysis of Quadruple-Ridged Square Waveguide by
Multilayer Perceptron Neural Network Model

B. Kim, J. Nam, and D. Yu, Pohang Univ. of Science andTechnology, KOREA

Y. Tang and W. Wu, Nanjing Univ. of Science and Technology,
CHINA

Y. Karasawa, The Univ. of Electro-Communications, JAPAN19

OPEN FORUM
2:30 p.m. – 4:00 p.m.

Wednesday, December 13
LoungeSession WEOF
WEOF-01
Comparison of CMOS LNAs Implemented with Different
Capacitor and Inductor Structures

WEOF-14The Suppression of Intermodulation Products in
Multichannel Amplifiers Close to Saturation

WEOF-27
A High Linear Upconversion Mixer and VCO Design
Using Fully Integrated Current Injection Technique

M. T. A. Gusad and L. P. Alarcon, Univ. of the Philippines,
PHILIPPINES

N. Maleš-Ilić and B. Milovanović, Univ. of Nis, SERBIA

M.-J. Kim and N.-Y. Kim, Kwangwoon Univ., KOREA

WEOF-02
A 1V, 0.9dB Noise-Figure High Linearity LNA MMIC
for Concurrent GPS Handset Application

WEOF-15
Volterra Series Approach to Behavioral Modeling:
Application to an FET Amplifier

WEOF-28
A Novel Approach for Implementation of a Matrix
AmplifierY. H. Chow, T. L. Tan, and W.-K. Kim*, Avago
Technologies Malaysia, MALAYSIA, *Avago Technologies
Korea, KOREA

C. Crespo-Cadenas, J. Reina-Tosina, and M. J. Madero-Ayora,
Univ. of Seville, SPAIN

G. Moradi and A. Abdipour, Amirkabir Univ. of Technology,
IRAN

WEOF-03
1.5V 5 GHz Low Noise Amplifier With Source
Degeneration

WEOF-16
Investigation into RF Feedback for Improving The
Efficiency-Linearity Trade-off in Power Amplifiers

WEOF-29
Design of Cartesian Feedback Loop Linearization Chip
for UHF Band

M.-T. Hsu, T.-Y. Chih, and G.-R. Li, National Yunlin Univ.
of Science and Technology, TAIWAN

Y. J. Tian and D. G. Haigh, Imperial College London, U.K.

M.-S. Kang, Y.-J. Chong, S.-J. You, and T.-J. Chung, ETRI,
KOREA

WEOF-04
The Design of Full-Band (3.1–10.6GHZ) CMOS UWBLow Noise Amplifier with Thermal Noise Canceling

WEOF-17
A High Power Performance 60 GHz Push-Push Oscillator
MMIC in Metamorphic HEMT Technology

WEOF-30
A Low Power 0.18µm CMOS Even-Harmonic Mixer

S.-C. Chen, R.-L. Wang*, H.-C. Kuo, and M.-L. Kung, National Yunlin
Univ. of Science & Technology, *National Kaohsiung Marine Univ. of
Science & Technology, TAIWAN

J.-W. Lee, K. Seol*, and K. Seo*, Kyung Hee Univ., *Seoul
National Univ., KOREA

Y.-C. Chen, T.-N. Luo, Y.-H. Yu, Y.-J. E. Chen, and D.
Heo*, National Taiwan Univ., TAIWAN, *Washington State
Univ., U.S.A.

WEOF-05
Dual-Band LNA for 2.4/5.2GHz Applications

WEOF-18
Accurately Measure Phase-Locked Loop (PLL) Lock Timein Production

WEOF-31
Differential Power Combining Technique for General
Power Amplifiers Using Lumped Component Network

L. Zhang, Texas Instruments, Inc., U.S.A.

H.-L. Chang, P.-T. Lin, W.-C. Hua, C.-P. Lin, C.-Y. Lin, C.W. Liu, T.-Y. Yang*, and G.-K. Ma*, National Taiwan
Univ., *Industrial Technology Research Institute, TAIWANWEOF-19
Intermodulation Nulling in Anti-Parallel Diode Pair Mixers

WEOF-32
0.25 µm CMOS Resistive Ring Subthreshold Mixer

V. Gutta, T. Fattorini*, and A. Parker, Macquarie Univ.,*Mimix Broadband, AUSTRALIA

X. Wang, M. Chen, and O. Boric-Lubecke, Univ. of Hawaii
at Manoa, U.S.A.

WEOF-07
Numerical Analysis of Pulsed I-V Curves and Current
Compression in GaN FETs

WEOF-20
A Simple Oscillator Design with the Frequency Controlled
by Patch Size

K. Itagaki, H. Takayanagi, H. Nakano, and K. Horio,
Shibaura Institute of Technology, JAPAND. H. Lee, J. I. Lee, J.-S. Rieh, and M. Kim, Korea Univ.,
KOREA

WEOF-33
A New Implemenation for RF SiCMOS Transistor Model
Using SDD for Quantifying Individual Contribution toDistortion from Transistor's Nonlinear Parameters

WEOF-08
Closed-Form Expression of IMD Considering Input/Output
Frequency Responses in Nonlinear RF Power Amplifiers
for Digital Predistortion

WEOF-21
Wide BST-Based Tuning of Voltage Controlled Oscillator

V. K. Dao, B. G. Choi, Q. D. Bui, and C. S. Park, ICU,
KOREA

WEOF-06
A CMOS Ultra-Wideband Differential Low Noise
AmplifierT. B. Merkin, S. Jung, J. Gao, and Y. Joo*, The Univ. of
Texas at Arlington, *Arizona State Univ., U.S.A.

M. Al-Ahmad, C. Loyez, N. Rolland, and P.-A. Rolland, IEMN,FRANCE

A. Abuelmaatti, I. Thayne, I. McGregor, and E. Wasige,
Univ. of Glasgow, U.K.

WEOF-34
A Reconfigurable CMOS Power Amplifier with Flexible
Matching Network
S.-O. Yun and H.-J. Yoo, ICU, KOREA

H. Ku, Konkuk Univ., KOREA

WEOF-09
Quasi-Invariant Single-Parameter Criterion
Unconditional Stability: Review and ApplicationforE. L. Tan, Nanyang Technological Univ., SINGAPORE

WEOF-22
Residual and Oscillator Phase Noise in GaAs HEMTs
M. Ferndahl* and H. Zirath*,**, *Chalmers Univ., **Ericsson
AB, SWEDEN

WEOF-35
High Susceptibility of Micro-Phonic and Phase-Hit Dual
Loop Push-Push Synthesizer Design for High Modulation
Microwave Digital Radios
Y. Shen, L. Villeneuve, and N. Hassaine, Harris Corp., U.S.A.

WEOF-10
Numerical Investigation on Thermal Characteristics of
GaN HFETs for High Power Applications
J. Xu, W.-Y. Yin, and J. Mao, Shanghai Jiao Tong Univ.,
CHINA

WEOF-23
Switchless Bi-Directional Amplifier
C. S. Yu, K. T. Mok, and W. S. Chan, City Univ. of Hong Kong,
CHINA

WEOF-36
13 GHz Cascaded 4:1 CMOS Injection Locked Frerquency
Divider
P. Mayr, T. Mronga*, M. Tiebout**, C. Kienmayer**, R.
Thueringer***, and U. Langmann, Ruhr-Universitaet Bochum, *Altek
GmbH, GERMANY, **Infineon Technologies AG, AUSTRIA,***Infineon Technologies AG, GERMANY

WEOF-11
Harmonic Orthogonality Condition in RF Class-E Power
Amplifiers

WEOF-24On the Improvement of the Linear Dynamic Range of KaBand Up-Converters

WEOF-37
Experimental Evaluation of Service Area in WirelessService Over IP Systems

M. A. Yarleque Medina, D. Schreurs, and B. Nauwelaers,
Katholieke Universiteit Leuven, BELGIUM

E. Bertran, J. Berenguer, G. Montoro, and A. Cidronali*,Technical Univ. of Catalonia, SPAIN, *Univ. of Firenze,
ITALY

Y. Fujisawa, T. Higashino, K. Tsukamoto, and S. Komaki,
Osaka Univ., JAPANWEOF-12An Accurate Technique for Characterizing Non-Linear
Currents in MESFET/HEMT Devices

WEOF-25
Five-Port Software Defined Radio Receiver Implementationin Ka-Band

WEOF-38
SSR-MAC: A Novel MAC Protocol for Mobile Ad Hoc
Network

S. L. Henriquez, A. J. Ogunniyi, C. Karangu, D. Harvey, and
C. White, Morgan State Univ., U.S.A.

R. Mirzavand, A. Mohammadi, and A. Abdipour, Amirkabir
Univ., IRAN

F. Jun, L. Zhitang, and W. Li, Huazhong Univ of Sci & Tech,
CHINA

WEOF-13
Single-Stage, High Efficiency, 26-Watt Power Amplifier
Using SiC LE-MESFETWEOF-26
Sub Milli-Watt, 2.4 GHz, Super-Regenerative Transceiverwith Ultra Low Duty Cycle

WEOF-39
The Remote HF-Doppler Detection of the Sunrise Effect

S. Azam*, R. Jonsson**, and Q. Wahab*,**, *Linköping
Univ., **Swedish Defence Research Agency, SWEDEN

I. McGregor, E. Wasige, and I. Thayne, Glasgow Univ., U.K.

20

Y. Zhang and Y. Wang, Dalian Maritime Univ., CHINA

OPEN FORUM
2:30 p.m. – 4:00 p.m.

Thursday, December 14
LoungeSession THOF

WEOF-40
Markov Characterization of Channels and its Applications
in Powerline Communications Systems

WEOF-53
Analysis of Coupled Anisotropic Optical Waveguides
M. A. Boroujeni and M. Shahabadi, Univ. of Tehran, IRAN

M. Zhai, North China Electric Power Univ., CHINA

WEOF-41
A Novel Simulation Testbed for Space-Time Signal
Processor of Smart Antenna System Based on HILS
Technology

S. Singh and B. Rawat, Univ. of Nevada, U.S.A.

WEOF-54
FIR Cavity for Terahertz Laser
A. Dubey and H. Dave, Physical Research Laboratory,
INDIA

W. Liu, Q. Zhang, and Z. Feng, Tsinghua Univ., CHINA

WEOF-42
The New Approach to Microwave RFID
I. B. Shirokov and Y. B. Gimpilevich, Sevastopol National
Technical Univ., UKRAINEWEOF-43
Detection of Dielectric Contrast of Breast Tissues Using
Confocal Microwave Technique
G. Bindu, C. K. Aanandan*, K. T. Mathew*, and S. J.
Abraham**, Manipal Institute of Technology, *Cochin Univ.
of Science and Technology, **Lourde Hospital, INDIA

WEOF-44
EM Field Coupling to Coplanar Transmission Lines
H. Khodabakhshi, A. Cheldavi, and M. Khalaj-Amirhosseini,
Iran Univ. of Science and Technology, IRAN

WEOF-45
Electric and Magnetic Shielding Effectiveness of Metallic
Enclosures with Apertures
M. Z. M. Jenu and F. A. Po’ad, Kolej Universiti Teknologi
Tun Hussein Onn, MALAYSIA

THOF-01
DGS Based SIR Filters for Wireless Communication on
Anisotropic Substrate

THOF-02
Circuit Direct Replacement Method Enhanced Skirt
Response of Open Stub Low-Pass Filter
J.-D. Tseng and W.-T. Liu, Chin Yi Institute of Technology,
TAIWANWEOF-55
A Proposal for High-Precision Fiber Optic Displacement
Sensor

THOF-03
Design of a Vertically Stacked Waveguide Filter with
Novel Cross Coupling Structures in LTCC

M. Noshad, H. Hedayati, and A. Rostami, Univ. of Tabriz,
IRAN

T.-M. Shen, T.-Y. Hung, C.-F. Chen, and R.-B. Wu, National
Taiwan Univ., TAIWANWEOF-56
Enhanced Linear Dynamic Range of Electrooptic
Modulators Based on Birefringent Gires -Tournois
Interferometer

THOF-04
A Bandpass Filter with Cross-Coupled L-Shape Folded
Resonators for Compact Size and Spurious Suppression

J. E. B. Oliveira and B. F. R. Sakamoto, Instituto Tecnológico de
Aeronáutica ITA - Brazilian Air Force, BRAZIL

P. Akkaraekthalin, S. Hongdamnuen, and V. Vivek, King
Mongkut’s Institute of Technology North Bangkok, THAILAND

WEOF-57
Measurements of Conductivity of Thin Gold Films at
Microwave Frequencies Employing Resonant Techniques

THOF-05
Novel Compact Dual-Band Bandpass Filter with Improved
Stopband Characteristics

T. Zychowicz, J. Krupka, and J. Mazierska*, Warsaw Univ.
of Technology, POLAND, *Massey Univ., NEW ZEALAND

X. Guan, Z. Ma*, P. Cai, D. Xu, T. Anada**, and G.
Hagiwara***, Shanghai Univ., CHINA, *Saitama Univ.,**Kanagawa Univ., ***Link Circuit Inc., JAPANWEOF-58
Removing S-Parameters on-Wafer Measurements Parasitic
Elements Using Time Domain Gating: Application toTransmission Lines

THOF-06
A Hybrid Synthesis Technique for N-tuplets Microwave
Filters Cascaded by Resonator

D. Abessolo-Bidzo*,**, P. Poirier*, P. Descamps*, and O.
Hubert**, *LaMIP, **Philips Semiconductors, FRANCE

W. Meng and K.-L. Wu, the Chinese Univ. of Hong Kong,
CHINA

WEOF-46
Analysis of Electromagnetic Noise Suppression in
Microstrip Lines with Absorber Sheets

WEOF-59
Characterization of Dielectric Properties for PZN-PMN-PT
Ferroelectric Thin Films at Microwave Frequencies

THOF-07
Novel Microstrip Dual-Band Bandstop Filter with
Controllable Dual-Stopband Response

V. B. Bregar*,** and A. Žnidaršič*,**, *Nanotesla Institute,**Iskra Feriti, SLOVENIA

H. M. Wong, B. Luo*, L. C. Ong*, and K. Yao**, Nanyang
Technological Univ., *Institute for Infocomm Research, **Institute ofMaterials Research and Engineering, SINGAPORE

Z. Ma, K. Kikuchi, Y. Kobayashi, T. Anada*, and G.
Hagiwara**, Saitama Univ., *Kanagawa Univ., **Link
Circuit Inc., JAPANWEOF-47
Microwave Measurement of Biological and Allied
Materials

WEOF-60
A Measurement System for Space-Time Variation ofRainfall Rate and Millimeter-Wave Specific Attenuation inIndonesia

THOF-08
A Novel Suspended Substrate Bandpass Filter Using HShaped Resonator

D. Faktorová and K. Grondžák, Univ. of Žilina, SLOVAKREPUBLIC

G. Hendrantoro, A. Mauludiyanto, and P. Handayani, Institut
Teknologi Sepuluh Nopember, INDONESIA

J. S. Kim, Y. J. Kim*, W. G. Moon*, and S. G. Byeon, Korea
Electronics Technology Institute, *Acewavetech, KOREA

WEOF-48
Effect of Metallic Helmet on the Microwave Absorption ina Spherical Phantom of a Dipole Antenna User HeadWEOF-61
Obliquely Cut Open Ended Coaxial Probe for Obtaining
Complex Permittivity of Lossy Materials

THOF-09
A Method of Synthesis of Cross-Coupled Bandpass
Resonator Filters by Using Genetic Algorithms

V. V. Radchenko and A. I. Nosich, NASU, UKRAINE

T. Michiyama, E. Tanabe*, and Y. Nikawa, Kokushikan
Univ., *AET, Inc., JAPANY. Hsu and Z.-H. Feng, Tsinghua Univ., CHINA

WEOF-49
Analytic Solutions of Ground Bounces in PCBs Using
Perfect Magnetic Wall Approximations

WEOF-62
New Technique for Analysing Coplanar Lines on Ceramic
Up to 110 GHz

THOF-10Vibration Modal Analysis Used Finite Element Methodof Microwave Amplitude Equalizer

C.-C. Huang, Yuan Ze Univ., TAIWAN

C. Min and C. E. Free, Univ. of Surrey, U.K.

M. Yang* , **, X. Du**, D. Zhang**, and Z. Niu**,*Zhengzhou Univ., **Information Engineering Univ., CHINA

WEOF-50
A Radar for Range-Finding of Multiple Targets Based ona Simplified FMCW Method

WEOF-63
Measurements of Complex Permittivity and Permeability
with Changing an Angle of Incidence of Parallel Beamgenerated by Dielectric Lenses

THOF-11
Reduced-Sized Single Coupled-Line Low Pass Filter

T. Uebo and Y. Okubo, Saika Technological Institute Foundation,
JAPAN

J.-D. Tseng and P.-S. Chen, Chin Yi Institute of Technology,
TAIWANH. Suzuki, T. Hocchi, and M. Inoue, KEYCOM Corp., JAPANWEOF-51
Dual-Frequency SAR for the Measurement of Soil
Moisture at Depth

THOF-12A Semicircle DGS With High Q Factor for Microstrip
Line and Low-Pass Filter

X. Zhang, W. Zhang, X. Lu, G. Kang, and G. Fang, Chinese
Academy of Sciences, CHINA

S. Lin*,**, W. Tian*,**, S. Zheng*,**, and X. Sun*, *Shanghai
Institute of Micro-system & Information Technology,**Chinese Academy of Science, CHINA

WEOF-52

THOF-13
Dielectric Loaded Cavity Filter with Wide Spurious Free
Region and Better Out-of-Band Rejection

Observations of Cloud Properties Using the Millimeter-Wave
FM-CW Radar of Chiba Univ.
T. Takano, J. Yamaguchi, H. Abe, K. Futaba, S. Yokote, H. Kubo, K. Akita,
Y. Kawamura, H. Kumagai*1, Y. Ohno*1, T. Takamura, T. Nakajima*2, H.
Okamoto*3, Y. Fujiyoshi*4, and N. Sugimoto*5, Chiba Univ., *1NICT,*2The Univ. of Tokyo, *3Tohoku Univ., *4Hokkaido Univ., *5NIES, JAPANX.-G. Sun, Transcend Communication Co., CHINA

21

OPEN FORUM
Thursday, December 14

2:30 p.m. – 4:00 p.m.

THOF-14
A Novel Compact Defected Ground Structure (DGS) Low
Pass Filter

THOF-27
A Class of UWB Microstrip Bandpass Filter Using QuasiLumped Element Resonators with Controllable Stopbands

A. Mohan and A. Biswas, Indian Institute of Technology,
INDIA

T. Ohno, Y. Ohno, K. Wada*, and O. Hashimoto, Aoyama
Gakuin Univ., *The Univ. of Electro-Communications, JAPANTHOF-15
Sharp-Rejection, Compact Wide-Band Bandpass Filters

THOF-28
Improved High-Q Microwave Dielectric Resonator Using
B2O3 Doped Nd(Co1/2Ti1/2)O3 Ceramics

M. K. Mandal and S. Sanyal, Indian Institute of Technology,
INDIA

C.-F. Tseng and C.-L. Huang, National Cheng Kung Univ.,
TAIWAN

THOF-40
A Microwave Modeling of Multilayered Chip Inductors
B.-H. Choi, J.-H. Lim, and T.-Y. Yun, Hanyang Univ.,
KOREA

THOF-41
Tunable Optical Delay Line Using Two Port Ring Resonator
G. Rostami* , **, A. Rostami*, H. Akhavan**, and A.
Zarifkar**, *Univ. of Tabriz, **ITRC, IRAN

THOF-16
Equalizing of Group Delay for Feed Forward Amplifier
Using Dielectric Filters

THOF-29
Group Delay Analysis of Differential-Mode Coupled FourLines Bandpass Filters

THOF-42
Identification of Complex Bragg Gratings (Apodized andChirped) Using Artificial Neural Networks (ANN)J. Hayashi and Y. Nikawa*, Soshin Electric Co., Ltd.,*Kokushikan Univ., JAPANK.-P. Ahn, A. Saitou*, and K. Honjo, The Univ. of ElectroCommunications, *YKC Corp., JAPANA. Rostami and A. Yazdanpanah-Goharrizi, Univ. of Tabriz,
IRAN

THOF-17
Low Loss Planar Dielectric Waveguide Filter with Cross
Coupling Using LTCC Technology at 60GHz Band

THOF-30
Coupled-Line Sharp Notch Filter with Significant
Improvement of Attenuation

THOF-43
Design of High Power Phase Shifter with Left-Handed
Transmission Line

D.-S. Jun, H.-C. Kim, and H.-K. Yu, ETRI, KOREA

H. Ishida and K. Araki*, NICT, *Tokyo Institute of Technology,
JAPAN

S.-Y. Wang, Q. Zhu, and J.-F. Zhu, Univ. of Science andTechnology of China, CHINA

THOF-18
Ultra-Wideband (UWB) Bandpass Filters Using Hybrid
Microstrip/CPW Structures

THOF-31Microwave Characterization of High-Tc Superconducting
Microstrip Line Using FDTD Technique

THOF-44
An Left Handed Material on Si CMOS Chip with Wafer
Level Package Process

H. Wang, L. Zhu, W. Menzel*, and Z. N. Chen**, Nanyang
Technological Univ., SINGAPORE, *Univ. of Ulm, GERMANY, **Institute for Infocomm Research, SINGAPORE

H. Ghamlouche, M. Benkraouda, M. Hussein, and T.
Badarneh, United Arab Emirates Univ., U.A.E.

J.-G. Kim, K. Okada, T. Yammouch, T. Sato, and K. Masu,
Tokyo Institute of Technology, JAPANTHOF-19
The Microstrip Bandpass Filters With Wide Outband
Suppression

THOF-32
A New Compact Capacitive-Gap-Coupled Microstrip
Bandpass Filter Using Arrowhead Shape as Defected
Ground Structure (DGS)

THOF-45
A Single Matching Network Design for a Double Band
PIFA Antenna Via Simplified Real Frequency Technique

C.-W. Tang, C.-C. Hu, J.-W. Wu, and S.-F. You, National
Chung Cheng Univ., TAIWAN

THOF-20
The Multilayered Triplexer with Low Insertion Loss
C.-W. Tang, J.-W. Wu, C.-C. Hu, S.-F. You, H.-C. Lin*, andS.-S. Yeh*, National Chung Cheng Univ., *Industrial
Technology Research Institute, TAIWAN

A. Boutejdar, A. Elsherbiny*, and A. S. Omar, Univ. of Magdeburg,
GERMANY, *Ain Shams Univ., EGYPTTHOF-33
A New Mathematical Design Method of Microstrip
Tapped-Line Filters
I.-W. Lee, S.-H. Han, T.-S. Yun, K.-C. Yoon, Z. Fang, andJ.-C. Lee, Kwangwoon Univ., KOREA

THOF-21
Compact Microstrip Diplexers Based on a Dual-Passband
Filter

THOF-34
A Tunable Bandpass Filter Using Tapped λ/4 Resonators
Loaded with Inductive Variable Capacitor

P.-H. Deng, C.-H. Wang, and C.-H. Chen, National Taiwan
Univ., TAIWAN

T. Ohno, K. Omata, K. Wada*, and O. Hashimoto, Aoyama
Gakuin Univ., *The Univ. of Electro-Communications,JAPAN

THOF-22
Design of a Novel Microstrip Bandstop Filter Using One
Compact C-Open-Loop Resonator

THOF-35
High-Temperature Superconducting Reaction-TypeTransmitting Filter Consisting of Novel Split Open-Ring
Resonators

A. Boutejdar, A. Elsherbini*, S. Amari**, M. Awida*, and A. S. Omar,
Univ. of Magdeburg, GERMANY, *Ain Shams Univ., EGYPT, **Royal
Military College of Canada, CANADA

THOF-23
A Microstrip Bandpass Filter Using a Line Periodically
Loaded with Unbalanced SIRs for Size Reduction andSpurious Suppression

B. S. Yarman, M. Sengul*, P. Lindberg**, and A. Rydberg**,
Tokyo Institute of Technology, JAPAN, *Kadir Has
Univ.,TURKEY, **Uppsala Univ., SWEDEN

THOF-46
Highly Miniaturized On-Chip Impedance Transformers
Employing PPGM with Single-Sided Via Holes forApplication to GaAs MMIC
Y. Yun, C.-R. Kim, and K.-S. Lee, Korea Maritime Univ.,
KOREA

THOF-47
RF Passives on a 0.25µm Digital CMOS Process
J. Hizon, M. Rosales, H. Tan*, L. Alarcon, and D. Sabido**,Univ. of the Philippines, *Intel Manufacturing Philippines,**Eaxiz Inc., PHILIPPINES

THOF-48
Power Control in Passive Waveguide Circuits
J. Zehentner, J. Machac, and P. Zabloudil, Czech Technical
Univ., CZECH REPUBLIC

S. Futatsumori, T. Hikage, and T. Nojima, Hokkaido Univ.,JAPAN

THOF-36
Evaluation of Loss and APHC of DC-Biased Low K
Transmission Line in MMICs Technologies

THOF-49
A Novel Type of Wideband Self-Adapting Coplanar
Feeding Network

H-W. Wu, M.-H. Weng*, Y.-K. Su, C.-Y. Hung, and R.-Y.
Yang, National Cheng Kung Univ., *National Nano Device
Laboratories, TAIWAN

W. Chai and X. Zhang, Chinese Academy of Sciences, CHINA

T. Majaeng, S. Chaimool, J. Jantree, and P. Akkaraekthalin, King
Mongkut’s Institute of Technology North Bangkok, THAILAND

THOF-24
Design of Microstrip Dual-Band Filters Using DoubleDiplexing Configuration

THOF-37
Efficient Evaluation of a 2-Feed Method to Reduce Fields
along the Edge of the Power/Ground Planes

C.-L. Hsu and J.-T. Kuo, National Chiao Tung Univ., TAIWAN

S. Kahng, Univ. of Incheon, KOREA

THOF-50
Coupled Mode Theory Approximation for Arbitrary
Conventional/Metamaterial Contradirectional CoupledLine Couplers
H. V. Nguyen and C. Caloz, École Polytechnique de Montréal,
CANADA

THOF-25
Simulation of Resonant Frequencies of the Metal Cavity by
the Unconditionally Stable 3D Crank-Nicolson FDTD
MethodTHOF-38
A Novel Planar Structure of Double Negative Material
Z. Zhang and S. Xu, Univ. of Science and Technology ofChina, CHINA

THOF-51
Compact CPW Rat-Race and Branch-Line Hybrids Utilizing
Slow-Wave Structure
T. Fujii, Y. Kokubo, and I. Ohta, Univ. of Hyogo, JAPANY. Yang and R. S. Chen, Nanjing Univ. of Science andTechnology, CHINA

THOF-26
An Ultrawide Bandpass Filter Using Ceramic Multilayer
Configuration

THOF-39
Standing Waves in a Coaxial Cavity Gyrotron with a
Corrugated Insert

THOF-52
A New Type of Multi-Way Microwave Power Divider
Based on Bagley Polygon Power Divider

C.-S. Yoo, J.-K. Lee, D. Kim, H.-C. Jung, N.-K. Kang, K.-S.
Seo, and W.-S. Lee, Korea Electronics Technology Institute,
KOREA

O. Kononenko and Y. Gandel, Kharkov National Univ.,
UKRAINE

I. Sakagami, T. Wuren, M. Fujii, and Y. Tomoda, Toyama
Univ., JAPAN22

OPEN FORUM
2:30 p.m. – 4:00 p.m.

Friday, December 15

LoungeSession FROF
THOF-53
Transient Analysis of Multi-Section Wilkinson Power
Divider Using MCD Method

FROF-01
Estimation of Rain Induced Attenuation at 10–300 GHz
over Earth-Space Path Links Over Amritsar (India)

FROF-14
A P-Version Multigrid Method for Fast Hierarchical
Vector Finite-Element Analysis of Waveguiding Structures

K. Murakami, Kinki Univ., JAPANI. S. Hudiara, P. Sharma*, and M. L. Singh*, K C College ofEngg., And IT, *Guru Nanak Dev Univ., INDIA

J. Zhu and R. S. Chen, Nanjing Univ. of Science andTechnology, CHINA

THOF-54
Modeling of Carbon Nanotube Interconnects andComparative Analysis with Cu Interconnects

FROF-02
A New Microwave-Excited Plasma Source Using an
Internal Dielectric Microwave Applicator

FROF-15
On Dispersion in Different Position of Microstrip Line

H. Li, W.-Y. Yin, and J.-F. Mao, Shanghai Jiao Tong Univ.,
CHINA

K. Shimatani, Y. Tsugami, and I. P. Ganachev, Shibaura
Mechatronics Corp., JAPANTHOF-55
Performances Optimization of Capacitive Parallel MEMS
Switches

FROF-03
Observation of VHF Broadcast Radio Waves Propagating
From China

FROF-16
Theoretical Analysis of Field Distribution and Radiation ofVivaldiC. Bordas, K. Grenier, D. Dubuc, M. Paillard*, J.-L.
Cazaux*, and R. Plana, Univ. Toulouse, *Alcatel Alenia
Space Corp., FRANCE

M. Yoneji, T. Takano, H. Nakata, and S. Shimakura, Chiba
Univ., JAPANY. Yao and Z. Feng, Tsinghua Univ., CHINA

THOF-56
Integrated Switchable Inductors with Symmetric Differential
LayoutFROF-04
The Concept and Evaluation of GPS Skyward Visibility
Archive for Future-Oriented Vehicular Satellite
Communications

FROF-17
A Novel Band-Notched Ultra-Wideband Microstrip-Line
Fed Wide-Slot Antenna

J.-L. Wang, Y.-R. Tzeng, and T.-H. Huang, National ChengKung Univ., TAIWAN

P. Shi, X. Yin, and W. Hong, Southeast Univ., CHINA

Y. Yao and Z. Feng, Tsinghua Univ., CHINA

M. Takahashi, Univ. of Tokyo, NICT, JAPANTHOF-57
A Micromachined Wide-Band Suspended-Line Coupler at
24GHz for Vehicle Radar Applications

FROF-05
Coupled Computational Intelligence and Time-Domain
Method for Design of the Microwave Devices

FROF-18
Stacked Square Microstrip Antenna with a Shorting Postfor Dual Band Operation in WLAN Applications

A. Corona-Chavez, I. Llamas-Garro, J.-M. Kim*, and Y.-K.
Kim*, INAOE, MEXICO, *Seoul National Univ., KOREA

H. S. Chu, E.-P. Li, E. Liu, and J.-L. Dubard*, Institute ofHigh Performance Computing, SINGAPORE *Univ. de NiceSophia Antipolis, FRANCE

T. Fujimoto and K. Tanaka, Nagasaki Univ., JAPANTHOF-58
A Branch Line Hybrid Having Arbitrary Power Division
Ratio and Port Impedances

FROF-06
Edge-Based Vector FEM for Electromagnetic Wave Tool

FROF-19
Parasitically Loaded Broad Band Microstrip Antennas for
Proposed IEEE 802.15.3a (UWB) Communication
Systems

A. Chen, A. Chen, and D. Su, Beijing Univ., CHINA

Y.-B. Kim, H.-T. Kim, K.-S. Kim, J.-S. Lim, and D. Ahn,
Soonchunhyang Univ., KOREA

S. Chakraborty, U. K. Dey, S. Panda, and B. Gupta, Jadavpur
Univ., INDIA

THOF-59
Design High-Directivity Parallel-Coupled Lines Using
Quadrupled Inductive-Compensated Technique

FROF-07
A Novel High Order MoM/PO Hybrid Method for 3D EM
Scattering Problems

R. Phromloungsri, V. Chamnanphrai*, and M. Chongcheawchamnan,
Mahanakorn Univ. of Technology, *Rajamangala Univ. of Technology
Isan (RMUTI), THAILAND

S. Liu and X. Zhang, Chinese Academy of Science, CHINA

Y.-C. Lee, C.-J. Wang, and J.-S. Sun, Taipei Univ. ofTechnology, TAIWAN

THOF-60
Analysis of a Directional Coupler Using Magnetic/
Dielectric Hybrid Transmission-Line for Cellular Phone

FROF-08
Macro Element Methods in FEM for 3-D Electromagnetic
Radiation Problems

FROF-21
Unequal Cross Aperture Coupled Compact CP Antenna
with Four Y-Shaped Slits and Four Normal Slits

K. Takizawa, S. Mizuta, M. Nakazawa, T. Sato, K. Yamasawa, Y.
Miura, Y. Miyake*, M. Akie*, Y. Uehara*, M. Munakata**, and M.
Yagi**, Shinshu Univ., *Fujitsu Ltd., **Sojo Univ., JAPANN. Feng, D. Shuo, Z. Lezhu, and X. Mingyao, Peking Univ.,
CHINA

Y.-A. Lee, H.-Y. Kim, B.-I. Mun, and H.-M. Lee, Kyonggi
Univ., KOREA

THOF-61
Terahertz Waveguide Design for GaSb Quantum Cascade
Laser

FROF-09
Efficient Design Approach of MW-Class RF-Dc
Conversion Rectenna Circuits by FDTD Analysis

FROF-22
Inverted Triangle Printed Monopole Antenna with Halfdisk for UWB Applications

H. Yasuda, I. Hosako, and N. Sekine, NICT, JAPANT. Takagaki, T. Yamamoto, K. Fujimori, M. Sanagi, and S.
Nogi, Okayama Univ., JAPANR. Chayono, M. Haneishi, and Y. Kimura, Saitama Univ.,JAPAN

THOF-62
The Propagation Characteristics of Double-Layer Substrate
Integrated Waveguide (SIW) Structure

FROF-10Microwave Absorption Studies of the Granular Magnetic
Plate

FROF-23
Spectral Domain Analysis of Resonant Characteristics of a
Circular Patch Microstrip Antenna on Uniaxial Substrate

W. Che, L. Xu, L. Geng, and D. Wang, Nanjing Univ. of Science &Technology, CHINA

A. V. Babushkin, I. V. Bychkov*, and V. D. Buchel’nikov*,Federal State Unitary Enterprise, *Chelyabinsk State Univ.,
RUSSIA

A. Motevasselian and A. Tavakoli, Amirkabir Univ. ofTechnology, IRAN

THOF-63
Low-Loss Millimeter-Wave Waveguide Using a Mutilayer
Printed-Circuit Board Technology

FROF-11
An efficient Modified Interpolation Technique for theTranslation Operators in MLFMM with Curvilinear RWG
Basis

FROF-24
A Novel Wideband Patch Antenna for 2.4/5 GHz WLAN
Applications

N. Ranjkesh and M. Shahabadi, Univ. of Tehran, IRAN

D. Z. Ding, R. S. Chen, C. Wang, and Q. L. Zhang, Nanjing
Univ. of Science and Technology, CHINA

THOF-64
A Generalized Partial Capacitance/Elastance Approach to
the Analysis of Transmission Lines on Multilayered
Substrates

FROF-12
Embedding of Short-Open Calibration Technique in
Commercial MoM Simulators for Parameter Extraction of
Planar Integrated Circuits

A. N. Sychev, Tomsk State Univ., RUSSIA

L. Han*, K. Wu*,**, W. Hong*, L. Li**, and X. Chen*, *Southeast
Univ., CHINA, **École Polytechnique de Montréal, CANADA

THOF-65
Wideband Slotline-to-Rectangular Waveguide Transition
Using Truncated Bow-Tie Antenna

FROF-13
An Enhancement of Input Impedance Bandwidth of
Circular-Disc Loaded Monopole Antenna with Horizontal
and Vertical Parasitic Strips

R.-Y. Fang and C.-L. Wang, National Taiwan Univ. of
Science and Technology, TAIWAN

J. W. Lee, K. K. Kang, C.-S. Cho, and J. Kim*, Hankuk Aviation Univ.,*Information and Communications Univ., KOREA

23

FROF-20
A New Half-Loop Antenna for UWB Spectrum

K. S. Yoon, S. M. Kim, and W. G. Yang, Univ. of Incheon,
KOREA

FROF-25
A Wideband Rectangular Ring Antenna Fed by Planar
Disc Monopole
S. Lamultree*,**, C. Phongcharoenpanich**, S. Kosulvit**,and M. Krairiksh**, *Asian Univ., **King Mongkut’s Instituteof Technology Ladkrabang, THAILAND

FROF-26
CPW-Fed Ultra Wideband (UWB) Monopoles with Band
Rejection Characteristic on Ultra Thin Organic Substrate
S. Nikolaou, B. Kim, Y.-S. Kim*, J. Papapolymerou, and M.
M. Tentzeris, Georgia Institute of Technology, U.S.A.,*Korea Univ., KOREA

OPEN FORUM
Friday, December 15

2:30 p.m. – 4:00 p.m.

FROF-27
On the Design of Fractal Elements for Miniaturized
Antenna Applications
G. S. A. Shaker and S. Safavi-Naeini, Univ. of Waterloo,
CANADA

FROF-28
Dual-Band and Dual-Polarization Patch Antenna withHigh Isolation Characteristic
D.-H. Choi and S.-O. Park, Information and Communications
Univ., KOREA

FROF-40
Radiation from an Antenna in Manhole
S. Mizushina, A. Adachi, and T. Watanabe*, Enegene Co.,
Ltd., *Shizuoka Univ., JAPANFROF-41
Novel S-DMB Antenna Design Using Modified QHA
G.-S. Chae, Y.-C. Park, J.-S. Lim, and M.-N. Kim, Baekseok
Univ., KOREA

FROF-53
Simulation Study on a Multi-band Adaptive Hemispherical
Helix Array
D. Li, Z. Feng, and L. Zhang, Tsinghua Univ., CHINA

FROF-54
A Dual Feed Switched-Beam Patch Antenna for a Phased
Array of Switched-Beam Elements
J. Tagapanij, C. Phongcharoenpanich, and M. Krairiksh,
King Mongkut’s Institute of Technology Ladkrabang, THAILAND

FROF-29
Antenna in HSBGA Package for 2.4 GHz WLAN
Application

FROF-42
Reconfigurable Antenna for Korean WIBRO and DMB
Systems

FROF-55
An LTCC-Based Compact Folded Rotman Lens for
Phased Array Applications

T.-H. Lu, S.-H. Yeh, and C.-L. Tang, Industrial Technology
Research Institute, TAIWAN

S.-B. Byun, J.-A. Lee, J.-H. Lim, and T.-Y. Yun, Hanyang
Univ., KOREA

G. Tudosie and R. Vahldieck, ETH Zurich, SWITZERLAND

FROF-30
Influence of Coupling and Diagram Correlation on MIMO
Capacity Performances at 2 GHz

FROF-43
Design of Magnetic Antenna with Dual Circular
Polarizations

FROF-56
Post-IDFT Multidimensional Beamforming for STCOFDM Systems

S. Vergerio, J.-P. Rossi, and P. Sabouroux*, France Télécom
R&D, *Institut Fresnel, FRANCE

W. Hong, H.-H. Wang, Y.-D. Lin*, and T. Kitazawa**,
National Changhua Univ. of Education, *National Chiao
Tung Univ., TAIWAN, **Ritsumeikan Univ., JAPANH. Liu and Q. Feng, Southwest Jiaotong Univ., CHINA

FROF-31
A Wideband C-Shaped Vertical Patch Antenna

FROF-44
Antenna Arrays with Linear and Circular Polarization for
The Meteorological Radar

FROF-57
New Methods of Reducing The Phase Quantization Error
Effects on Beam Pointing and Parasitic Side Lobe Level of
The Phased Array Antennas

K.-L. Lau, K.-M. Luk, and K.-F. Lee*, City Univ. of Hong
Kong, CHINA, *The Univ. of Mississippi, U.S.A.

S. T. Knyazev, B. A. Panchenko, and S. N. Shabunin, Ural
State Technical Univ., RUSSIA

S. Taheri and F. Farzaneh, Sharif Univ. of Technology, IRAN

FROF-32
A Novel Planar Highly Shaped-Beam Antenna Using
Leaky-Wave Characteristics

FROF-45A Dual-Band Beam-Switched Slot Array for GSM
900/1800MHz

FROF-58
Experimental Study on The Radiation Beam Scan of a
Waveguide Slot Array Antenna Filled with a Ferrite

R. B. Hwang, National Chiao Tung Univ., TAIWAN

Y. Liu, Z. Shen, B. Zheng, and W. Tan, Nanyang Technological
Univ., SINGAPORE

H. Shimasaki and T. Itoh, Kyoto Institute of Technology,
JAPAN

FROF-33
Development of Low-Loss Millimeter-Wave Antennas on
Fluorine Substrate Using Electro-Fine-Forming
Fabrication

FROF-46
Wide-Band Circular Antenna Arrays Consisting of Bicone,
Semi Bicone or Bowtie elements

N. Ito*,**, A. Mase*, N. Seko***, M. Tamada***, E. Sakata**, and Y.
Kogi*, *Kyushu Univ., **Kyushu Hitachi Maxell, Ltd., ***Japan
Atomic Energy Agency, JAPANFROF-34
Performance of Reflectarray Cells Printed on Liquid
Crystal Film
M. Y. Ismail*,**, W. Hu*, R. Cahill*, H. S. Gamble*, R. Dickie*, V.
F. Fusco*, D. Linton*, S. P. Rea**, and N. Grant***, *Queen’s Univ.
Belfast, **Univ. College of Technology of Tun Hussein Onn, ***EADSASTRIUM Ltd., U.K

R. Gunnarsson, T. Martin, and A. Ouacha, Swedish Defence
Research Agency, SWEDEN

FROF-47
A Four-Element Reflecto-Nulling Antenna Array
S.-N. Hsieh and T.-H. Chu, National Taiwan Univ., TAIWANFROF-35
Three-Dimensional On-Chip Conical Spiral Antennas on
Video-Monitored Micromachined (100) Silicon Wafers

FROF-48
A Recursive Procedure for Evaluating the ImpedanceMatrix of the Peano-Gosper Fractal Array

H. Sedaghat-Pisheh, S. Mohajerzadeh, and M. Shahabadi,
Univ. of Tehran, IRAN

W. Kuhirun, Kasetsart Univ., THAILAND

FROF-36High Transmission Gain Slot Antennas on Silicon
Substrate for Wireless Interconnect

FROF-49
Proximity-Coupled and Dual-Polarized Microstrip Patch
Antenna for WCDMA Base Station Arrays

L. Jiang, J. Mao, and W.-Y. Yin, Shanghai Jiao Tong Univ.,
CHINA

J. Säily, VTT Technical Research Centre of Finland, FINLAND

FROF-37
A Dielectric-Position-Controlled Beam Adjustable LeakyWave Antenna

FROF-50
Sidelobe Reduction in Square-Planar Fractal Arrays
Synthesis Using Genetic Algorithms

C.-C. Hsiao and R. B. Hwang*, Ching Yun Univ., *National
Chiao Tung Univ., TAIWAN

M. Polpasee and N. Homsup, Kasetsart Univ., THAILAND

FROF-38
A Study of the Performance of a Small Radiator near a
Miniaturized Artificial Magnetic Surface (AMC)

FROF-51
Analysis of Mutual Coupling in MIMO Antenna Array by
TARC Calculation

G. S. A. Shaker and S. Safavi-Naeini, Univ. of Waterloo,
CANADAS. H. Chae, W. I. Kawk, S.-O. Park, and K. Lee*,
Information and Communications Univ., *Electronics andTelecommunications Research Institute, KOREA

FROF-39
Study on COBRA Lens Horn for Miniaturization and
Improvement of Pattern

FROF-52
Radiations from Swichable Rectangular Planar Array
Antenna in L-Band

S. H. Lee, J. Ahn, Y. J. Yoon, and J.-H. So*, Yonsei Univ.,*Agency for Defense Development, KOREA

D. Kumar and P. K. S. Pourush, Agra College, INDIA

24

WORKSHOP
Tuesday, December 12

9:00 a.m. – 12:00 p.m.

Room A (301)system can achieve reliable wireless communications by the spacetime coding that is a combination of the MIMO system and thecoding technique.
In this workshop, starting from overview of MIMO technologies, performance evaluation of MIMO systems in home and cellular environments will be presented. Furthermore, considerations
on antenna configuration of MIMO systems will be given. The
workshop will be useful for understanding of the latest MIMO
technologies.

Workshop 1
System-on-Chip/One-Chip Radio
Organizer: Tadao Nakagawa, NTT, Japan
Chair:
Tadao Nakagawa, NTT, JapanThe demand for small, inexpensive radio modules is increasing.
RF integrated circuits on Si, which are the key components of radio
modules, have evolved remarkably in recent years. RF systems
on a chip (SoC) that integrate RF, analog, and digital circuits havebeen developed to reduce occupied circuit area and off-chip discrete components that add to assembly and test costs. Today, theRF SoC is dominant in applications such as Bluetooth and wirelessLAN, and many RF SoC devices have been developed in applications
such as GPS, ETC, and GSM. Moreover, the demand for multi-band
and multi-mode transceivers that can be used in various applications and that are able to connect to networks anytime, anywhere
using the most suitable application among all available applications
is increasing. RF SoC devices are indispensable in making multiband and multi-mode transceivers small and economical.
This workshop presents a review of the SoC developments invarious applications and of the technical issues that must be overcome.

WS2-1 Overview of MIMO Technologies and their Applications
Yasutaka Ogawa, Hokkaido Univ., Japan
WS2-2 Performance Evaluation of MIMO Communication
Systems in Home Environment
Kei Sakaguchi, Tokyo Institute of Technology, Japan
WS2-3 MIMO Techniques and Experiments for Future
Broadband Mobile Communications
Mamoru Sawahashi, Kenichi Higuchi*, Hidekazu Taoka*
and Dai Ki*, Musashi Institute of Technology, *NTT
DoCoMo, Japan
WS2-4 Handset MIMO Technologies: Antenna Configurations,
Analysis and Measurements Systems
Koichi Ogawa, Matsushita Electric Industrial Co., Ltd.,Japan

WS1-1 A 1-V operation single chip bluetooh RF transceiver
Mitsuru Harada, NTT, Japan
WS1-2 SiGe-MMIC transceiver for 5.8GHz ETC Terminals
Noriharu Suematsu, Mitsubishi Electric Corp., Japan

Room C (303)WS1-3 Caliblation Systems on RFICs
Satoshi Tanaka, Hitachi, Ltd., Japan

Workshop 3Standardization of Measurement Methods for Microwave andMillimeter Wave Materials
Organizer: Osamu Hashimoto, Aoyama Gakuin Univ., Japan
Chair:
Yoshinori Kogami, Utsunomiya Univ., Japan

Room B (302)

Workshop 2

Microwave and millimeter-wave technologies have been developed further and their applications have been spread widely inrecent years. The standardization of these technologies which has
been discussed in the International Electro-technical Commission
is necessary for us to promote the international cooperation. The
role of IEC, which attained the one hundredth anniversary of its
existence, becomes still more important.
In this workshop, the activity of the standardization and its
recent trend will be discussed at first. The actions on the standardization of the evaluation method for the microwave and millimeterwave materials, which have been investigated in the IEC domestic
committees in Japan, will be introduced subsequently.

Advanced MIMO Antenna Technologies
Organizer: Yoshihide Yamada,National Defense Academy, Japan
Chair:
Yoshihide Yamada,National Defense Academy, Japan
High speed transmission through a limited frequency bandwidth is strongly demanded in such systems as wireless local area
networks (LANs) and cellular networks. Multiple-Input MultipleOutput (MIMO) systems that have multiple antennas at both of thetransmitter and receiver in multipath channel environments haveattracted much attention for these years. When independent signals
are transmitted from the different antennas and they are separated
at the receiver side, transmission speed is increased by the numberof the transmit antennas. Also, if the transmitter side has multipath
channel state information, maximum throughput can be achievedby the eigen beamforming technique. In frequency selective multipath channels, the MIMO technique is employed together withorthogonal frequency division multiplexing (MIMO-OFDM).
Other than the above spatial multiplexing technique, the MIMO

WS3-1 Address for the 100 Anniversary IEC
Akira Izumi, Ministry of Economy, Trade and Industry,Japan
WS3-2 Standardization Activities of the IEICE Japan.
Shozo Komaki, Osaka Univ., Japan
25

WORKSHOP
9:00 a.m. – 12:00 p.m.

Tuesday, December 12

WS3-3 Activity of IEC/TC49 Japanese National Committee for
Measurement Method of Complex Permittivity at
Microwave and Millimeter Wave Frequencies
Hiroshi Tamura, Murata Manufacturing Co., Ltd., Japan

WS4-4 Multipurpose Sensor RFID Tag
Jin Mitsugi, Keio Univ., Japan

Room E (311+312)
WS3-4 Electronic Characteristic Measurements — Surface
Resistance of Superconductors at Microwave Frequencies
Haruhiko Obara and Shin Kosaka, NAIST (National
Institute of Advanced Industrial Science and Technology),
Japan

Workshop 5
Millimeter and Terahertz Wave Applications
Organizer: Tadao Nagatsuma, NTT, Japan
Chair:
Tadao Nagatsuma, NTT, Japan
Electromagnetic waves called “millimeter waves” (30 GHz–
300 GHz) and/or “terahertz waves” (100 GHz–10 THz) are considered to be major resources for mankind in the 21st century.
These frequency bands cover interdisciplinary regions between
radio waves and light waves, which are both bases of today’s
telecommunications technologies, i.e., wireless and fiber-optic
communications. The exploration of such undeveloped frequencies
has recently been accelerated with rapid evolutions of both electronic and photonic device/circuit technologies. This workshop
will address an overview of the latest development in the millimeterand terahertz-wave devices and their applications to communications, sensors and measurements. The first part of the workshop
will concentrate on millimeter-wave technologies, and in the second
part, emerging terahertz device technologies and their promising
applications will be presented.

WS3-5 Measurement Method for Complex Permittivity of Low
Loss Dielectric Materials in Microwave and Millimeter
Wave Frequency Range
Akira Nakayama, Kyocera Corp., Japan
WS3-6 Measurement Methods for Reflectivity of Electromagnetic
Absorbers in Millimeter Wave Frequency
Yutaka Higashida, Japan Fine Ceramics Center, Japan

Room D (304)

Workshop 4
Emerging Technologies and Applications of RFID
Organizer: Jin Mitsugi, Keio Univ., Japan
Chair:Jin Mitsugi, Keio Univ., Japan

WS5-1 Millimeter-Wave Devices and Circuits
Toshihiko Kosugi, NTT, Japan

RFID (Radio Frequency Identification) has been gathering significant industrial interests. Contactless card type RFID has alreadywidely adopted in commercial uses. Long range RFID and fusionof RFID and sensors/actuators are in the early stage of the industrial adoptions. The major technical difficulties for long range
RFID resides in the fast and stable reading performance and the
avoidance of interference among transmitters. The proper definitionand evaluation of RFID wireless system needs to be exploited.
Since the long range RFID and sensor RFID are still in their infancy,
the technical requirements from industries need to be understoodby the technology proponents. In this workshop, Emerging
Technologies and Applications in RFID, accordingly, leading
researches and expectations from industry on long range and sensor
RFID technology are presented.

WS5-2 Millimeter-Wave Wireless Personal Area Network
Systems
Yozo Shoji, NICT, Japan
WS5-3 Trends in Terahertz Device Technologies
Taiichi Otsuji, Tohoku Univ., Japan
WS5-4 Promising Areas of Terahertz Application
Iwao Hosako, NICT, Japan

Room F (313+314)

Workshop 6

WS4-1 RFID: Expectation and Requirement from Consumer
Electronics Industry
Tatsuya Yoshimura, SONY, Japan

Technical Hellenism of RF and Information Security
Organizer: Takashi Ohira, ATR, Japan
Chair:
Takashi Ohira, ATR, Japan

WS4-2 Advanced RFID Multi-Reading Using Independent
Component Analysis
Hidehisa Shiomi and Yasuyuki Okamoto, Osaka Univ.,
Japan

While the demand for data communications over wireless links is
rapidly growing, there is strong social interest in guarding personal
information and official secrets. Wireless security is inevitable formicrowave and RF systems to break through the worldwide market. This session explores span-new possibility of harmonizing
two originally different technical topics: RF and security. You
will find technical Hellenism between Maxwellian engineering andinformation theory in the three invited presentations.

WS4-3 Interference Avoidance Technologies for Passive RFID
Systems
Yoshinori Tanaka, Fujitsu Laboratory, Japan

26

WORKSHOP
Tuesday, December 12

WS6-1 IEEE802.15.4 Wireless Secret Key Generator
Takashi Ohira and Hideichi Sasaoka*, ATR, *Doshisha
Univ., Japan

1:30 p.m. – 4:30 p.m.

WS7-3 High Power GaN-Based Heterojunction FETs for Base
Station Applications
Y. Ando, Y. Okamoto, A. Wakejima, T. Inoue, T.
Nakayama, Y. Murase, K. Ota, K. Yamanoguchi, N.
Kuroda, M. Tanomura, K. Matsunaga, H. Miyamoto,R&D Association of Future Electron Devices, Japan

WS6-2 Security Performance of Esparskey as Viewed from
Information Theory
Hideki Imai and Kazukuni Kobara*, Chuo Univ., *AIST,Japan

Room B (302)
WS6-3 Mathematical Aspects Common to Microwave Filters
and Elliptic Encryptors
Kiyomichi Araki, Tokyo Institute of Technology, Japan

Workshop 8
Application of CIP Method to Electromagnetic Phenomena
Organizers: Takashi Yabe, Tokyo Institute of Technology, Japan
Yoichi Ogata, Tokyo Institute of Technology, Japan
Chair:
Takashi Yabe, Tokyo Institute of Technology, Japan

Room A (301)

Workshop 7

The CIP method (Cubic Interpolated Propagation / Constrainedinterpolation Profile) that gives quite accurate and less-diffusive
results is known as a powerful hyperbolic equations solver. The
CIP method has been developed to various sophisticated versions,and although it has been applied to all kinds of phenomena likehydrodynamics for around 20 years, it is proved that CIP method
is very effective for electromagnetic phenomena that can be also
described by hyperbolic equations system as well, compared to theother conventional schemes.
In this workshop, new improvement of simulation techniques
by CIP method and the latest practical applications of CIP method
for electromagnetic phenomena will be presented. The subject
matter ranges widely, such as “electromagnetic field analysis basedon Maxwell’s Equations”, “plasma physics and astrophysics basedon magnetohydrodynamics (MHD)” and “thermal radiation”. In
order to discuss the theme from these points mentioned above, wehave invited six distinguished speakers.

Recent Progress in High Power Widegap Semiconductor
Device and its Application to Wireless Communication System
Organizer: Hajime Okumura, National Institute of Advanced
Industrial Science and Technology (AIST), Japan
Chair:
Hajime Okumura, National Institute of Advanced
Industrial Science and Technology (AIST), JapanFor the development of information and communication technology to support the advanced information society of the 21st
century, the large-capacity high-speed information communication connecting a wide range of information processing hardware
to a network is indispensable. It is wireless communication technology, together with optical communication technology. In thewireless communication, one hundred and several tens of Mbps
class speed will be required for a mobile access system; and ahigh-power high-frequency (HF) device operating with high efficiency in the frequency range from several GHz to several tens of
GHz is the most important key issue for this purpose.
In this technological domain, any essential development cannot
be expected even though there are huge needs, as long as conventional semiconductor devices made of Si or GaAs are used, because
the characteristic parameters of Si and GaAs are not enough as
semiconductor materials. For a breakthrough in this domain, thedevelopment of high-performance devices made of widegap semiconductors such as GaN is indispensable. Recently, the innovation
has come to exhibit a reality owing to the progress of device
process and crystal growth technologies for the widegap semiconductors.
In this workshop, the role of wireless communication in the IT
society and the present status of widegap semiconductor highpower HF devices are introduced, and the future prospect is discussed.

WS8-1 Plasma and Fluid Flow in Magnetohydrodynamical
Energy Conversion
Yoshihiro Okuno, Tokyo Institute of Technology, Japan
WS8-2 Appliciation of CIP-Based MHD Code in Astrophysics
Takahiro Kudoh, National Astronomical Observatory ofJapan, Japan
WS8-3 CIP Method of Characteristics for Maxwell Equation
Yoichi Ogata and Takashi Yabe, Tokyo Institute ofTechnology, Japan
WS8-4 Modified CIP Method for Light Propagation in Absorbing
Media
Daisuke Barada*,**, Takashi Fukuda*,**, Masahide
Itoh**, and Toyohiko Yatagai**, *AIST, **Univ. of
Tsukuba, Japan
WS8-5 Simulation of Thermal Radiation Emitted from Atomic
Lattice through CIP and MD Methods
Takushi Kawaguchi, Teppei Masuhara, and Katsunori
Hanamura, Tokyo Institute of Technology, Japan

WS7-1 Widegap Semiconductor High-Frequency Device inFuture IT Society
Masaaki Kuzuhara, Fukui Univ., Japan
WS7-2 Physics and Prospects of III-Nitride MIS Devices
Narihiko Maeda, NTT, Japan
27

WORKSHOP
1:30 p.m. – 4:30 p.m.

Tuesday, December 12

WS8-6 Numerical Analysis for Thermal Radiation Emitted froma Ni Recutangular Micro-Cavity
Daisuke Hirashima, Yuki Kameya, and Katsunori
Hanamura, Tokyo Institute of Technology, Japannext-generation ITS, various technologies, such as those for sensing,communications, information processing and high frequency technologies, need to be developed and integrated. In this workshop,
the latest vehicular communication systems and high frequency
technologies for ITS will be introduced. The first two presentations
will focus on UWB (Ultra Wideband) ranging and inter-vehiclecommunication systems for car safety. The following two presentations will focus on electromagnetic simulation technique and designof automotive microwave and millimeter-wave applications, suchas tire pressure monitoring systems, millimeter-wave radar systems
and so on.

Room C (303)

Workshop 9
Phase Noise in Oscillator: An Old and Still New Technical Issue
Organizer:
Kenji Itoh, Mitsubishi Electric Corp., Japan
Co-organizer: Takashi Ohira, ATR, Japan
Chair:
Kenji Itoh, Mitsubishi Electric Corp., Japan

WS10-1 26GHz-Band UWB Ranging and Communication
Systems
Yasushi Aoyagi, Masaharu Uchino*, Toshiyuki Hirose**,Kenichi Takizawa***, Kiyoshi Hamaguchi***, andRyuji Kohno***, The Furukawa Electric Co., Ltd.,*Anritsu Corp., **Siemens K.K., ***NICT, Japan

Phase noise is an old and still new technical issue for oscillator
designers. For fundamental understandings on phase noise, weneed knowledge on communication system, PLL system, oscillator
circuits, semiconductor devices, resonators and mathematicalrepresentation of phase noise itself. This makes difficulties forunderstanding of oscillator phase noise. In this workshop, phasenoise is discussed from several technical aspects: (a) Phase noise
influence on system performance of radio communication systems,(b) Recent progress of low phase noise oscillators on Si RF-IC,(c) Principal definition of “Leeson’s Q” for phase noise characterization, (d) Mathematical formulation method for phase noise simulation.

WS10-2 Inter-Vehicle Safety Communication Systems
Noriyoshi Suzuki, Toyota Central R&D Labs. Inc.,
Japan
WS10-3 Electrical Field Simulations of a Car and Applications
Yoshihide Yamada, Kazuo Sato*, Satoru Horiuchi**,and Eiji Hirose***, National Defense Academy, *Toyota
Central R&D Labs. Inc., **Yazaki Corp., ***The
Yokohama Rubber Co., Ltd., Japan

WS9-1 Welcome Address
WS9-2 Why Low Phase Noise in Modern Radio Systems ?
Kenji Itoh, Mitsubishi Electric Corp., Japan

WS10-4 Millimeter-Wave Antenna Technologies for Automotive
Radar and Sensor Systems
Kunio Sakakibara, Nagoya Institute of Technology,
Japan

WS9-3 Phase Noise in Modern Si-Integrated VCOs
Larry Larson, Univ. of California, San Diego, U.S.A.

Room E (311+312)

WS9-4 A Simple but Persuading Approach to Oscillator
Characterization
Takashi Ohira, ATR, Japan

Workshop 11
Advanced Microwave Photonics Technologies and Their
Applications
Organizer: Katsutoshi Tsukamoto, Osaka Univ., Japan
Chair:
Katsutoshi Tsukamoto, Osaka Univ., Japan

WS9-5 Simulation Methods for Oscillator Noises
Makiko Okumura, Kanagawa Institute of Technology,Japan

A rapid progress in broadband wireless communication technologies accelerates the realization of ubiquitous networks, where
various types of wireless and broadcasting services are convergedin common infrastructure. Microwave photonics (MWP) can makea great contribution towards such a convergence between fixed
and mobile communication (FMC), because its wideband andtransparency capability for various types of wireless communication and broadcasting services will provide a seamless connectablecommon platform. In this workshop, the first two presentations
will introduce the latest applications of MWP technologies tomobile communications and terrestrial broadcasting networks.
Furthermore, the following two presentations will focus on future
millimeter-wave photonic communication networks using coherent
photonic techniques and advanced microwave-lightwave convert-

Room D (304)

Workshop 10
High Frequency Technologies for ITS
Organizer: Kazuo Sato, Toyota Central R&D Labs. Inc., Japan
Chair:
Kazuo Sato, Toyota Central R&D Labs. Inc., JapanAs further advances are made in sensing technologies and communication technologies in the future, ITS (Intelligent Transportsystems) are expected to become more comprehensive, linking
vehicles to infrastructures and even to people, through information.
I believe that these advances in ITS will help decrease traffic accidents, traffic congestion and environmental impact. To realize
28

WORKSHOP
Tuesday, December 12

1:30 p.m. – 4:30 p.m.

ket from RF SAW devices. RF BAW devices are also paid muchattention for the use as a core element for the development ofsophisticated RF front-end and/or one-chip radio modules based on
the system-on-chip (SoC) or system-in-package (SiP) integration
with active circuitry.
In this workshop, speakers from leading-edge companies(Avagotech, Triquint/SAWTEK, Infineon Technologies, FujitsuLabs, EPCOS) will report on the latest developments and future
trends in the RF BAW devices for the mobile communications.
Fabrication technologies and approaches will be discussed fromvarious aspects for the realization of state-of-the-art RF BAW
devices. Their implementation in RF modules will be demonstrated.

er technology for RoF (radio on fiber) systems such as advanced
optical SSB modulators, broadband photodetectors so on.
WS11-1 Future Millimeter-Wave Photonics Communication
Networks
Toshiaki Kuri, NICT, Japan
WS11-2 Advanced Millimeter-Wave-Lightwave Converter
Technology for ROF Systems
Hiroshi Murata, Osaka Univ., Japan
WS11-3 ROF Applicationsfor Mobile Phone Systems Applications
Yukio Horiuchi, KDDI R&D Laboratories, Co., Ltd.,Japan

WS12-1 Overview of FBAR Filters, Duplexers, Quadraplexers,
Quintiplexers, and Front End Modules (FEM) at Avago(formerly of Agilent)
Rich Ruby, Avagotech, U.S.A.

WS11-4 Recent Trends of Light Microwave Fused Technology in
Broadcasting
Kazuhisa Haeiwa, Hiroshima City Univ., Japan

WS12-2 Bulk Acoustic Wave Filters for RF Applications
Gernot Fattinger, et al., TriQuint/SAWTEK, U.S.A.

Room F (313+314)

Workshop 12

WS12-3 Challenges and Success Factors of High Volume BAW
Manufacturing in a CMOS FabLueder Elbrecht, Infineon Technologies AG, Germany

RF BAW Filters for Mobile Communications
Organizers: Ken-ya Hashimoto, Chiba Univ., Japan
Robert Weigel, Univ. of Erlangen-Nürnberg, Germany
Chairs:Ken-ya Hashimoto, Chiba Univ., Japan
Robert Weigel, Univ. of Erlangen-Nürnberg, Germany

WS12-4 FBAR and SAW Technologies and their Applicationsfor Mobile Communications
Masanori Ueda, Fujitsu Laboratories, JapanFor long years, surface acoustic wave (SAW) filters have been
widely used as the radio frequency (RF) front-end filters andduplexers for modern mobile communication systems. Recently,
RF bulk acoustic wave devices (BAW) have been evolved surprisingly and are attempting to take over the current RF filter mar-

WS12-5 Solidly Mounted BAW Resonator Technology for Use
in Mobile Communication Systems
Stefan Marksteiner, EPCOS AG, Germany

29

SHORT COURSE
Tuesday, December 12

9:00 a.m. – 12:00 p.m.

Tuesday, December 12

1:30 p.m. – 4:30 p.m.

Room G (501)

Room G (501)

Short Course 1

Short Course 3

Metamaterial Engineering for Microwaves
Lecturer: Tatsuo Itoh, UCLA, U.S.A.

RF MEMS Circuits for High Frequency Applications
Lecturer: Linda Katehi and Dimitris Peroulis*, Univ. of Illinois,*Purdue Univ., U.S.A.

This course is intended to provide realistic approaches to applications of metamaterial structures, specifically the so-called left
handed or double negative materials, for microwave engineering.
After brief historical remarks, some fundamental concepts are
explained. A number of microwave components with unique characteristics are presented mostly based on the transmission line
approach, called the Composite Right/Left Handed structure.
Classes of the components discussed are antennas, passive devices,
active and nonlinear circuits, and two-dimensional beam optics
structures. Engineering aspects including the fabrication issues
and homogeneity problems are discussed.

RF MEMS has been identified as an area which has the potential
to provide a major impact on existing RF architectures in sensors(radar) and communications by reducing weight, cost, size, andpower dissipation. The impact of this technology to communication
system cost, size and volume is a few orders of magnitude. Key
MEMS devices for current RF architectures are switches andmicrorelays in radar systems and filters in communications systems. Several RF MEMS switches have been developed in thepast decade. The main driving force behind these efforts is theoutstanding RF performance demonstrated by the MEMS devices.
In most cases, RF MEMS switches have been electrostatic innature. They have the distinct advantage of using only a few mWof DC power as compared to several mW for solid state devices.
This presentation will cover a broad range of RF MEMS devices
including switches and varactors and will discuss in detail issues
related to device architecture and device reliability.

Room H (502)

Room H (502)

Short Course 2

Short Course 4

Digital RF Processor (DRPTM): All-Digital TX and DiscreteTime RX
Lecturer: Robert Bogdan Staszewski, Texas Instruments, U.S.A.

Wireless Communications Standards, Systems, and RFIC
Specifications
Lecturer: Jenshan Lin, Univ. of Florida, U.S.A.

RF circuits for multi-GHz frequencies have recently migrated
to low-cost digital deep-submicron CMOS processes.
Unfortunately, this process environment, which is optimized only
for digital logic and SRAM memory, is extremely unfriendly forconventional analog and RF designs. We present fundamental techniques recently developed that transform the RF and analog circuitdesign complexity to digital domain for a wireless RF transceiver,so that it enjoys the benefits of digital approach, such as process
node scaling and design automation. All-digital phase locked loop,
all-digital control of phase and amplitude of a polar transmitter, anddirect RF sampling techniques allow great flexibility in reconfigurable radio design. Digital signal processing concepts are used tohelp relieve analog design complexity, allowing one to reduce costand power consumption in a reconfigurable design environment.
The ideas presented have been used in Texas Instruments to develop two generations of commercial digital RF processors: a singlechip Bluetooth radio and a single-chip GSM radio.

This tutorial links RFIC design specifications and system
requirements defined in wireless communications standards.
Many RFIC designers design the circuits without knowing where
and how the specifications come from. The objective of this tutorial is to let attendees learn how to derive RFIC specifications
from wireless communication standards, tradeoffs in different
transceiver architectures, and an overall picture of RFIC and wireless communication systems. As RFIC design advances from component-level building blocks to system-level integration, this link
between standards and RFIC specifications is becoming more
important. A reference system design of GSM receiver will begiven as an example.

30

EXHIBITION· The historical exhibition of microwave technologies inJapan, where more than 100 panels as well as productswith respect to antennas, semiconductors, filters andsystems will be displayed.
· Display of a satellite model and demonstration of multimedia mobile access systems in the special area.
· The university exhibition, where more than twenty
universities will demonstrate their unique research
activities in the field of microwaves.
This exhibition is open to all visitors with no entrance
fee. In order to enter, you need to show your participant
badge, which is given to you after the free registration at
the reception desk in the Exhibition Hall. The Conference
participants in APMC 2006 can also enter the exhibition hall
freely by showing the registration nameplate. All visitors
will be provided with a free guidebook. A copy of the textbook for the tutorial lectures is 2,000 JPY.

Microwave Exhibition 2006 will be held in association
with the 2006 Asia-Pacific Microwave Conference (APMC2006) at the Exhibition Hall A and B in Pacifico Yokohama,the venue of the conference, from Wednesday, December 13
to Friday, December 15, 2006.
More than 300 microwave-related companies from allover the world will display their latest products and services
including systems, sub-systems, components, parts, materials, instruments and CAD softwares. The main language inthe Exhibition Hall is Japanese.
At the same time, the following attractive programs arealso featured:· Technical seminars on the new technologies and products presented by the exhibitors.
· Tutorial lectures related to foundations for microwave
semiconductor devices, active and passive circuits, andmobile & fixed telecommunication systems, provided
in Japanese by Japanese authorities.

EXHIBITORS(Following is the list of exhibiting companies as ofAugust 31 and those who exhibited in 2005)
ACE TRONIX CO., LTD.
ADVANCED TECHNOLOGY, INC.
ADVANTEST CORP.
AET JAPAN, INC.
AGILENT TECHNOLOGIES JAPAN LTD.
AIAA-JFSCAMTECHS CORP.
AMT INC.
ANRITSU CORP.
ANSOFT JAPAN K.K.
APOLLOWAVE CORP.
ARUMOTECH CORP.
ASAHI GLASS CO., LTD.
ATN JAPAN, LTD.
ATRAVAGO TECHNOLOGIES JAPAN, LTD.
CADENCE DESIGN SYSTEMS, JAPANCANDOX SYSTEMS, INC.
CASCADE MICROTECH JAPAN, INC.
CHRONIX INC.
CIRCUIT DESIGN, INC.
COAX CO., LTD.
COMCRAFT CORP.
COMTECS CO., LTD.
CORNES DODWELL LTD.
COTEAU VERT CO., LTD.
CRC SOLUTIONS CORP.
CYBERNET SYSTEMS CO., LTD.
DAIDO STEEL CO., LTD.
DEVICE CO., LTD.
DIGITAL SIGNAL TECHNOLOGY, INC.
E&C ENGINEERING K.K.
ELENA ELECTRONICS CO., LTD.
ETS-LINDGREN JAPAN, INC.
EUDYNA DEVICES INC.
FARAD CORP.
FLOMERICS, LTD.
FREESCALE SEMICONDUCTOR JAPAN LTD.
FUJI DENKA, INC.
FUJITSU LTD.

FUJITSU MEDIA DEVICE LTD.
FUSOH SHOJI CO., LTD.
G. T. ELECTRONICS CORP.
HIGHTECH CORP.
HIROSE ELECTRIC CO., LTD.
HISOL, INC.
HI-TECHNOLOGY TRADING, INC.
HONDA TSUSHIN KOGYO CO., LTD.
IDAQS CO., LTD.
INNERTRON ELECTRONICS CO., LTD.
JAPAN TELEGARTNER LTD.
JUNKOSHA INC.
KANAGAWA INDUSTRIAL TECHNOLOGYRESEARCH INSTITUTE
KANTO ELECTRONICS APPLICATION &DEVELOPMENT INC.
KAWASHIMA MANUFACTURING CO., LTD.
KEISOKU ENGINEERING SYSTEM CO., LTD.
KEYCOM CORP.
KIETHLEY INSTRUMENTS, K.K.
KIKUSUI ELECTRONICS CORP.
KITAGAWA INDUSTRIES CO., LTD.
KNOWLEDGE*ON INC.
KODEN ELECTRONICS CO., LTD.
KOZO KEIKAKU ENGINEERING INC.
KYOKUTO BOEKI KAISHA, LTD.
LPKF JAPAN CO., LTD.
MAJ CO., LTD.
MARUWA CO., LTD.
MATSUSHITA ELECTRIC WORKS, LTD.
MEL INC.
MICRO WAVE FACTORY CO., LTD.
MIDORIYA ELECTRIC CO., LTD.
MINI-CIRCUITS YOKOHAMA, LTD.
MITS ELECTRONICS
MITSUBISHI ELECTRIC CORP.
MITSUBISHI ELECTRIC TOKKI SYSTEMSCORP.
MIYAZAKI ELECTRIC WIRE & CABLE CO.,LTD.
MKT TAISEI CO., LTD.
MMEX, INC.
MOUBIC INC.
MPD DEVICE CO., LTD.
M-RF CO., LTD.

31

MURATA MANUFACTURING CO., LTD.
NAGASE & CO., LTD.
NAKA & CO., LTD.
NAKAO CORP.
NATIONAL INSTRUMENTS JAPAN CORP.
NEC COMPOUND SEMICONDUCTOR DEVICES,LTD.
NEC ELECTRONICS CORP.
NEC ENGINEERING, LTD.
NEC MICROWAVE TUBE, LTD.
NETWELL CORP.
NEW JAPAN RADIO CO., LTD.
NEW METALS AND CHEMICALS CO., LTD.
NGK SPARK PLUG CO., LTD.
NHK
NIDEC COPAL ELECTRONICS CORP.
NIHON DEMPA KOGYO CO., LTD.
NIHON KOSHUHA CO., LTD.
NIHON RADIALL K.K.
NIPPO ELECTRONICS CO., LTD.
NIPPON PILLAR PACKING CO., LTD.
NIPPON STEEL CHEMICAL CO., LTD.
NIPPON TUNGSTEN CO., LTD.
NPS, INC.
OKAYA ELECTRIC INDUSTRIES CO., LTD.
OMRON CORP.
OPTOSIRIUS CORP.
ORIENT MICROWAVE CORP.
OTSUKA CHEMICAL CO., LTD.
POLYPLASTICS CO., LTD.
PTM CORP.
PVJ INC.
R&K CO., LTD.
REPIC CORP.
RF DEVICE CO., LTD.
RICHARADSON ELECTRONICS K.K.
RIKEI CORP.
RIKEN CORP.
RIKEN DENGU SEIZO CO., LTD.
ROHDE & SCHWARZ JAPAN K.K.
SAINT TECHNOLOGY CORP.
SANKEN CO., LTD.
SANYU SWITCH CO., LTD.
SEKI TECHNOTRON CORP.
SHINKO PHOTO SERVICE CO., LTD.

EXHIBITIONSHINTAKE SANGYO CO., LTD.
SHOSHIN CORP.
SOGO ELECTRONICS, INC.
SONNET GIKEN CO., LTD.
SOSHIN ELECTRIC CO., LTD.
SPC ELECTRONICS CORP.
STACK ELECTRONICS CO., LTD.
SUMITOMO METAL(SMI) ELECTRONICS
DEVICES INC.
SUSS MICROTEC KKSYSTEC RESEARCH INC.
TAMA DEVICE CO., LTD.
TAMAGAWA ELECTRONICS CO., LTD.
TAMAOKI ELECTRONICS CO., LTD.
TDK CORP.
TECDIA CO., LTD.
TECHNOPROBE CO., LTD.
TEKTRONIX JAPAN, LTD.
TOKIMEC INC.
TOKO DENSHI CO., LTD.
TOKO TRADING INC.
TOSHIBA CORP.
TOTAL SHIELDING SYSTEMS JAPANTOYO MEDIC CO., LTD.
UBE INDUSTRIES, LTD.
UM-SERVICES, LTD.
UNIVERSAL SYSTEMS CO., LTD.
VEGA TECHNOLOGY INC.
WAKA MANUFACTURING CO., LTD.
WAKOH COMMUNICATION INDUSTRIAL
CO., LTD.
WAVE TECHNOLOGY INC.
W. L. GORE & ASSOCIATES, INC.
YOKOGAWA ELECTRIC CORP.
YOKOHAMA DENSHI SEIKO CO., LTD.
YOKOWO DS CO., LTD.
YUETSU SEIKI CO., LTD.

(The list of overseas exhibitors with Japanese
Agent in 2005)
AC MICROWAVE GMBH
ACTIVE AND PASSIVE TECHNOLOGY CO.,LTD.
ADVANCED CONTROL COMPONENTS INC.
ADVANCED ELECTRONICS TECHNOLOGYASSOCIATES, INC.
ADVANCED FERRITE TECHNOLOGY GMBHADVANCED MICROWAVE, INC.
ADVANCED POWER TECHNOLOGY, INC.
ADVANCED SEMICONDUCTOR BUSINESSINC.
ADVANCED SEMICONDUCTOR, INC.
ADVANCED TECHNICAL MATERIALS, INC.
ADVANCED TECHNOLOGY GROUP, INC.
ADVANTECH-ADVANCED MICROWAVETECHNOLOGIES INC.
AEROCOMM CO., LTD.
AEROFLEX METELICS CORP.
AEROSCOUT USA
AEROTEK CO., LTD.
AKON, INC.
ALAN INDUSTRIES, INC.
ALC MICROWAVE INC.
ALDETEC, INC.
ALTRONIC RESEARCH, INC.
AMERICAN OIL & SUPPLY CO.
AMERICAN TECHNICAL CERAMICS CORP.
AMPLICAL CORP.
AMPLITECH, INC.

ANAREN MICROWAVE, INC.
ANTCOM CORP.
APOLLO MICROWAVES LTD.
APPLIED ENGINEERING PRODUCTSAPPLIED SYSTEMS ENGINEERING, INC.
ARAFTEK, INC.
ARLON, INC. MATERIALS FOR ELECTRONIDSDIVISION
ARRA, INC.
ARRIS CXMARTECH HOUSE PUBLISHERSASCOR, INC.
ATLANTIC MICROWAVE CORP.
ATLANTIC MICROWAVE LTD.
BABCOCK, INC.
BANDWIDTH SEMICONDUCTOR, LLC
BECKELEC INC.
BETA THERM IRELAND LTD.
BOARDTEK ELECTRONICS CORP.
BSC FILTERS LTD.
CALIFORNIA TUBE LABORATORY, INC.
CAP WIRELESS, INC.
CENTELLAX INC.
CENTER TECHNOLOGIESCENTRE FOR INTEGRATED PHOTONICS,LTD.
CERAGON NETWORK LTD.
CERNEX, INC.
CHANNEL MICROWAVE CORP.
CHIN NAN® PRECISION ELECTRONICS CO.,LTD.
CHRONIX INC.
CIAO WIRELESS, INC.
CML ENGINEERING SALES, INC.
COM DEV LTD.
COMMERCIAL MICROWAVE TECHNOLOGY,
INC.
COMOTECH
COMPEX CORP.
COMSOL AB
COMTECH PST CORP.
CONTINENTAL MICROWAVE & TOOL COMPANY,
INC.
CORNING GILBERT INC.
CREE, INC.
CST GMBH
C-TECH CO., LTD.
CUMING CORP.
CUSTOM MICROWAVE COMPONENTS, INC.
CUSTOM MICROWAVE, INC.
CYBER WIRELESS CORP.
DAICO INDUSTRIES, INC.
DB CONTROLDBP MICROWAVEDELTA ELECTRONICS, INC.
DIAMOND ANTENNA & MICROWAVECORP.
DIELECTRIC LABORATORIES INC.
DISCERA INC.
DITOM MICROWAVE, INC.
DORADO INTERNATIONAL CORP.
DOW-KEY MICROWAVE CORP.
DUCOMMUN TECHNOLOGIES, INC.(DMT)DYNAMICWAVE TELECOM, INC.
DYNETICS, INC.
E2V TECHNOLOGIESEAGLE
EAGLEWARE CORP.
ECLIPSE MICROWAVE, INC.

32

EDO RECONNAISSANCE AND SURVEILLANCESYSTEMSEKSPLA
ELCOM THCHNOLOGIES, INC.
ELVA-1 LTD.
EMCORE CORP.
EMC TECHNOLOGYEM RESEARCH, INC.
EM SOFTWARE & SYSTEMSENDWAVE CORP.
ENON MICROWAVE, INC. MICRONETICSENSIGN POWER SYSTEMS, INC.
ENVIRO MENTOR AB
ERICKSON INSTRUMENTS LLCEUROPEAN ANTENNAS LTD.
EVERBEING INT'L CORP.
EXCELICS SEMICONDUCTOR, INC.
EZ FORM CABLE CORP.
FARRAN TECHNOLOGY, LTD.(A SMITHS
DETECTION COMPANY)
FILTRONIC COMPOUND SEMICONDUCTORSFILTRONIC PTY LTD, AUSTRALIAFLEXCO MICROWAVE INC.
FLORIDA RF LABS
FOCUS MICROWAVES, INC.
FREESCALE SEMICONDUCTOR JAPAN LTD.
FREQUENCY ELECTRONICS, INC.
GIGAANTGIGALANE CO., LTD.
GIGA TECH CO., LTD.
GIGA-TRONICS, INC.
GLOBAL COMMUNICATION SEMICONDUCTORS,
INC.
G.T. MICROWAVE, INC.
HEATWAVE LABS, INC.
HEI, INC.
HERLEY-CTIHERLEY, INDUSTORIES, INC.
HEROTEK, INC.
HITTITE MICROWAVE CORP.
HNL, INC.
HUBER+SUHNER AG
ICS/MICRO NETWORKS CORP.
IEEE-PRESSIF ENGINEERING CORP.
INFINION TECHNOLOGIESINMET CORP.
INPHI CORP.
INTEGRA TECHNOLOGIES, INC.
INTER-CONTINENTAL MICROWAVEIRONCAD LLC
ITERRA COMMUNICATIONSIW (INSULATED WIRE INC.)
JACKET MICRO DEVICES INC.
JFW INDUSTRIES, INC.
J MICRO TECHNOLOGYJOHNSON COMPONENTS, INC.
JOHN WILEY & SONS, LTD.
KEVLIN CORP.
K & L MICROWAVE, INC.
KMIC TECHNOLOGY, INC.
KRYTAR
L-3 COMMUNICATIONS, ELECTRON DEVICES
L-3 COMMUNICATIONS, NARDA MICROWAVEEAST
L-3 COMMUNICATIONS, NARDA MICROWAVEWESTLABTECH LTD.
LINX TECHNOLOGIES INC.
LITEPOINT, CORP.

EXHIBITION
LOGUS MICROWAVE CORP.
LORCH MICROWAVELPKF LASER & ELECTRONICS AG
LUCIX CORP.
LUNEBERG TECHNOLOGIES
M/A-COM, INC.
MARKI MICROWAVEMATRIX SYSTEMS CORP.
MAURY MICROWAVE, CORP.
MCL, INC.
MEGA INDUSTRIESMEGAPHASE LLC
MERET OPTICAL COMMUNICATIONS(OSICOMTECHNOLOGIES, INC.)
MICA MICROWAVE CORP.
MICRO-COAX INC.
MICRO CRYSTAL(A DIV.OF ETA SA)MICROELECTRONICS CAPACITORS LTD.
MICROKIM
MICROLAB/FXRMICRO LAMBDA WIRELESS, INC.
MICRO METALSMITHS, LTD.
MICROSEMI MICROWAVE PRODUCTS
MICROSOURCE, INC.
MICRO SUBSTRATES CORP.
MICROTECH INC.
MICRO-TRONICS, INC.
MICROWAVE AMPLIFIERS LTD.
MICROWAVE DEVELOPMENT LABORATORIES,
INC.
MICROWAVE DEVICE TECHNOLOGY CORP.
MICROWAVE DYNAMICS
MICROWAVE ENGINEERING CORP.
MICROWAVE PHOTONIC SYSTEMS, INC.
MICROWAVE SOLUTIONS, INC.
MICROWAVE TECHNOLOGY CORP.
MICROWAVE TECHNOLOGY, INC.
MICROWAVE & VIDEO SYSTEMS, INC.
MIDWEST MICROWAVE INTERNATIONAL,LTD.
MILLITECH, LLC
MIMIX BROADBAND, INC.
MINI-CIRCUITSMINI-SYSTEMS, INC.
MI TECHNOLOGIES, LLC
MITEQ, INC.
MMCOMM INC.
M&M INDUSTRIES, INC.
MODCO, INC.
M-PULSE MICROWAVEMUEGGE ELECTRONIC GMBH
M-WAVE
NAKA & CO., LTD.
NALLATECH LTD.
NARDA SAFETY TEST SOLUTIONS GMBH
NEARFIELD SYSTEMS, INC.
NEXTEC MICROWAVE & RF INC.
NOBLE PUBLISHING CORP.
NORDIX GRUPONORTHROP GRUMMAN SPACE TECHNOLOGYVELOCIUM PRODUCTS
NUBICOM INC.
NURAD TECHNOLOGIES INC.
OEWAVESOLESON MICROWAVE LABS.
OMNIYIG, INC.
ORBIT/FR-ENGINEERING LTD.
ORTEL A DIVISION OF EMCOREOSCILLOQURTZ SA
PACIFIC MILLIMETER PRODUCTS

PACIFIC MONOLITHICS, INC.
PASCALL ELECTRONICS, LTD.(ENGLAND)PASTERNACK ENTERPRISES, LLC
PENN ENGINEERING COMPONENTS
PEREGRINE SEMICONDUCTOR, INC.
PHASE MATRIX, INC.
PHASE ONE MICROWAVE, INC.
PICONICS, INC.
PILKOR ELECTRONICS CO., LTD.
PLANAR ELECTRONICS TECHNOLOGY, INC.
POLYFET RF DEVICESPOLYPHASER CORP.
PRESIDIO COMPONENTS, INC.
PUESCHNER GMBH
PULSAR MICROWAVE CORP.
QMC INSTRUMENTS LTD.
QPAR ANGUS LTD.
QUINSTAR TECHNOLOGY, INC.
RADAR TECHNOLOGY, INC.
RADIOMETER PHYSICS GMBH
RADITEKRALTRON ELECTRONICS CORP.
REACTEL, INC.
RELCOMM TECHNOLOGIES, INC.
RES LTD.
RESOTECH, INC.
RFCORE CO., LTD.
RFHIC
RFHIC COMPANY
R.F. HITEC, INC.
RFIC TECHNOLOGY CORP.
RF TECHNOLOGIES CORP.
RH LABORATORIES, INC.
RICHARDSON ELECTRONICS, LTD.
RLC ELECTRONICS, INC.
ROGERS CORP. ADVANCED CIRCUIT
MATERIALS DIVISIONROSENBERGERRS MICROWAVE COMPANY, INC.
SAGE LABORATORIESSAMSYS TECHNOLOGIES INC.
SANGSHIN ELECOM CO., LTD.
SAWCOM TECH, INC.
SCIENTIFIC MICROWAVE CORP.
SDP COMPONENTS INC.
SEASOLVE SOFTWARE, INC.
SECTOR MICROWAVE INDUSTRIES, INC.
SEMELAB PLC
SEMFLEX, INC.
SG MCGEARY COMPANYSHENGLU AUTENNA CO., LTD.
SIERRA MICROWAVE TECHNOLOGYSIGNAL TECHNOLOGY CORP., KELTECOPERATIONSIMLAB SOFTWARE GMBH
SIRENZA MICRODEVICES, INC.
SIVERS IMA, AB
SIVERS LAB, AB
SKYWORKS SOLUTIONS, INC.
SONNET SOFTWARE, INC.
SONOMA INSTRUMENT
SOUTHWEST MICROWAVE, INC.
SPACEK LABS, INC.
SPECTRACOM
SPECTRA-MAT, INC.
SPECTRUM CONTROL, INC.
SPECTRUM ELECTROTECHNIK GMBH
SPECTRUM MICROWAVE, INC.
SPINNAKER MICROWAVESPINNER GMBH

33

SPIRENT COMMUNICATIONS(SW) LTD.
SSI CABLE CORP.
STANFORD RESEARCH SYSTEMS, INC.
STANGENES INDUSTRIES, INC.
STATE OF THE ART, INC.
STC MICROWAVE SYSTEMS, ARIZONA.
STC MICROWAVE SYSTEMS, OLEKTRONSTORM PRODUCTS CORP.
STRATEDGE CORP.
SUMMITEK INSTRUMENTS, INC.
SUNNY ELECTRONICS
SUPERCONDUCTOR TECHNOLOGIES INC.
SV MICROWAVESYFER TECHNOLOGY, LTD.
SYNERGY MICROWAVE CORP.
TACONIC CO., LTD.
TECHFILM SERVICES INC.
TECHNICAL SERVICES LABORATORY, INC.
TECHTROL CYCLONETICS, INC.
TECOM INDUSTRIES, INC.
TELEDYNE COUGAR(COUGAR COMPONENTS)
TELEDYNE COUGAR(TELEDYNE MICROWAVE,
INC.)
TELEDYNE MICROWAVETENSOLITETERABEAM CORP.
THE FERRITE COMPONENTS, INC.
THE MCGRAW-HILL CO.
(INTERNATIONAL MARKETING MCGRAWHILL PROFESSIONAL)
THE PHOENIX COMPANY OF CHICAGO,
INC.
THE WAVEGUIDE SOLUTION LTD.
THOMAS KEATING LTD.
TIMES MICROWAVE SYSTEMSTLC PRECISION WAFER TECHNOLOGY,
INC.
TRAK MICROWAVE CORP.
TRANS-TECH, INC.
TRILITHIC, INC.
TRONSER INC.
TRU CORP.
T-TECH, INC.
TYCO ELECTRONICS AMPUNITED MONOLITHIC SEMICONDUCTORS
S.A.S.
UNIVERSAL MICROWAVE TECHNOLOGY,
INC.
VECTOR FIELDS LTD.
VECTRON INTERNATIONALVERTEX MICROWAVE PRODUCTS, INC.
VICTORY MICROWAVE CORP.
VIDA PRODUCTS, INC.
VIRGINIA DIODES, INC.
WEINSCHEL ASSOCIATESWEINSCHEL CORP.
WEST · BOND INC.
WIDE BAND SYSTEMS, INC.
WISEWAVE TECHNOLOGIES, INC.
WJ COMMUNICATIONS
W. L. GORE & ASSOCIATES, INC.
XICOM TECHNOLOGY, INC.
X-IDENT TECHNOLOGY GMBH
XSIS ELECTRONICS, INC.
ZELAND SOFTWARE, INC.
ZELIGSOFTAPMC 2006 COMMITTEE OFFICERS
Toshio MASAKI
Tatsuro MASAMURA
Masaharu MIURA
Koji MIZUNO
Katsutoshi NAKADA
Masao NAKAGAWA
Nobuo NAKAJIMA
Ryugo NISHIKAWA
Toshio NISHIKAWA
Shingo OHMORI
Isao OHTA
Shun SAKURAI

CONFERENCE CHAIR
Makoto NAGAO

NICTVICE CHAIR
Hiroshi MATSUMOTO

Kyoto University

ADVISORS
Nobuaki KUMAGAI
Moriji KUWABARA
Kazuhiro MIYAUCHI
Shizuo MIZUSHINA
Norihiko MORINAGA
Yoshiyuki NAITO
Bun-ichi OGUCHI
Sogo OKAMURA
Shigebumi SAITO
Keiji TACHIKAWA
Michiyuki UENOHARA
Eikichi YAMASHITA
Tsukasa YONEYAMA

University of Hyogo
Kuwabara Information Institute Inc.
Science University of Tokyo
Emeritus Professor of Shizuoka University
Hiroshima International University
Emeritus Professor of Tokyo Institute ofTechnology
IEICE
Tokyo Denki University
Emeritus Professor of University of Tokyo
JAXA
Emeritus Professor of Tama University
Emeritus Professor of The University ofElectro-Communications
Tohoku Institute of Technology

Nobuo SHIGA
Harushige SUGIMOTO
Tadashi TAKAGI
Takeshi TAKANO
Yoichiro TAKAYAMA
Kosaku NAKANO
Kenkichi TANIOKA
Kazuhiro TSUGA
Makoto TSUTSUMI
Yoshiki UENO
Takanori UTANOTakashi WAKABAYASHI
Kikuo WAKINO
Heiichi YAMAMOTO

AUDITORS
Yasutake HIRACHI
Iwao MATSUMOTOTokyo Institute of Technology
Seki Technotron Corp.

ORGANIZING COMMITTEE

Ryozo YAMAUCHI
Kiyotoshi YASUMOTO

Toshiba Corp.
Japan Radio Co., Ltd.
Space Communications Corp.
Tohoku University
NEC TOSHIBA Space Systems, Ltd .
Keio University
The University of Electro-Communications
Mitsubishi Electric Corp.
TOYO Corp.
NICT
University of Hyogo
Ministry of Internal Affairs andCommunications
Eudina Devices Inc.
Oki Electric Industry Co., Ltd.
Tohoku University
Fujitsu Laboratories Ltd.
University of Hyogo
The Furukawa Electric Co., Ltd.
NHK
Matsushita Electric Industrial Co., Ltd.
Fukui University of Technology
Denso Corp.
NTT DoCoMo, Inc.
Anritsu Corp.
Ritsumeikan University
Nara Institute of Science andTechnology
Fujikura Corp.
Kyushu University

Chair:
Yoshio KOBAYASHI

Secretary:

Saitma University

Toshio NOJIMA

Hokkaido University

Vice Chairs:
Masayoshi AIKAWA
Kiyomichi ARAKI
Takashi OHIRA

INTERNATIONAL STEERINGCOMMITTEE

Saga University
Tokyo Institute of Technology
ATR

Chair:
Members:
Masami AKAIKE
Makoto ANDO
Seiichi ARAI
Ikuo AWAI
Toru CHIBA
Nobuyoshi FUGONO
Yoji FURUHAMA
Misao HANEISHI
Kozo HASHIMOTO
Masahiro HASHIMOTO
Makoto HONDA
Shigekazu HORI
Yasushi HORIKAWA
Jui-Pang HSU
Haruhisa ICHIKAWA
Osami ISHIDA
Jiro KATOH
Susumu KITAZUME
Ryuji KOHNO
Shozo KOMAKI
Hiroshi KONDOH

Takashi OHIRA
Science University of Tokyo
Tokyo Institute of Technology
Murata Mfg. Co., Ltd.
Ryukoku University
Sharp Corp.
ATR
Electro Design Center Inc.
Saitama University
Kyoto University
Osaka Electro-Communication
University
Agilent Technologies Japan, Ltd.
Alpine Electronics, Inc.
JAXA
Kanagawa University
NTT
Okinawa National College ofTechnology
ADVANTEST Corp.
World Spectrum, Inc.
Yokohama National University
Osaka University
Hitachi, Ltd.

ATR

Vice Chair:
Noriharu SUEMATSU

Mitsubishi Electric Corp.

Secretary:
Atsushi SANADA

Yamaguchi University

STEERING COMMITTEE
Chair:
Masayoshi AIKAWA

Saga University

Vice Chairs:
Hiroyo OGAWA
Kazuhiko HONJONICTThe University of Electro-Communications

Members:
Kunio AKADA
Tetsuo ANADA
Makoto ANDO
Yoichi ARAI
Mitsuo HASEGAWA
Osamu HASHIMOTO

34

R&K Co., Ltd.
Kanagawa University
Tokyo Institute of Technology
AI Electronics Ltd.
Fujitsu Component Ltd.
Aoyama Gakuin University

APMC 2006 COMMITTEE OFFICERS
Shigekazu HORI
Ichirou IDA
Masao IDA
Kazufumi IGARASHI
Akio IIDA
Shinsuke INUI
Osami ISHIDA
Yoshihiro ISHITA
Masanobu ITOH
Ryuichi IWAKAMI
Toru IWASAKI
Kazukiyo JOSHIN
Naoto KADOWAKI
Tadashi KAWAI
Masayuki KIMISHIMA
Susumu KITAZUME
Yoshinori KOGAMI
Takao KUKI
Hiromichi KURODA
Futoshi KUROKI
Keren LI
Zhewang MA
Toru MANIWA
Ken-ichi MARUHASHI
Moriyasu MIYAZAKI
Hiroshi NAKANO
Masatoshi NAKAYAMA
Shoichi NARAHASHI
Yoshio NIKAWA
Kazuya NISHIHORIKenjiro NISHIKAWA
Juichi OZAKI
Morikazu SAGAWA
Keiichi SAKUNO
Atsushi SANADA
Minoru SANAGI
Tsugumichi SHIBATA
Masafumi SHIGAKI
Jun-ichi TAKADA
Kazuaki TAKAHASHI
Yoichiro TAKAYAMA
Ken TAKEI
Masaharu TAKEI
Yukio TAKIMOTO
Osamu TAMURA
Satoshi TANAKA
Tsuneo TOKUMITSU
Tomoki UWANO
Kouji WADA
Shigeru YANAGAWA
Naofumi YONEDA

Members:

Alpine Electronics, Inc.
Fujitsu Laboratories Ltd.
NGK Spark Plug Co., Ltd.
Japan Radio Co., Ltd.
Mitsubishi Electric Tokki Systems Corp.
Micro Mobio Corp.
Okinawa National College ofTechnology
Anritsu Corp.
AI Electronics Ltd.
Waka Manufacturing Co., Ltd.
NHK
Fujitsu Laboratories Ltd.
ATR
University of Hyogo
ADVANTEST Corp.
World Spectrum, Inc.
Utsunomiya University
NHK
Toshiba Corp.
Kure National College of Technology
NICT
Saitama University
Fujitsu Laboratories Ltd.
NEC Corp.
Mitsubishi Electric Corp.
Eudina Devices Inc.
Mitsubishi Electric Corp.
NTT DoCoMo, Inc.
Kokushikan University
Toshiba Corp.
NTT
Toshiba Corp.
Matsushita Electric Industrial Co., Ltd.
Sharp Corp.
Yamaguchi University
Okayama University
NTT
Fujitsu Ltd.
Tokyo Institute of Technology
Matsushita Electric Industrial Co., Ltd.
University of Hyogo
Hitachi, Ltd.
Eudina Devices Expert Service Inc.
Shonan Institute of Technology
Agilent Technologies Japan, Ltd.
Hitachi, Ltd.
Eudina Devices Inc.
Matsushita Electric Industrial Co., Ltd.
The University of Electro-Communications
Toshiba Electro-Wave Components Co.,Ltd.
Mitsubishi Electric Corp.

Kiyoshi HAMAGUCHI
Shinji HARA
Ken-ya HASHIMOTO
Osamu HASHIMOTO
Takaharu HIRAOKA
Masanobu HIROSE
Kazuhiko HONJO
Keizo INAGAKI
Koichi ITO
Kenji ITOH
Tatsuo ITOH
Yasushi ITOH
Yoshio KARASAWA
Tadashi KAWAI
Yoshinori KOGAMI
Keren LI
Zhewang MA
Mohammad MADIHIAN
Hiroaki MIYASHITA
Moriyasu MIYAZAKI
Tadao NAGATSUMA
Tadao NAKAGAWA
Yoji OHASHI
Hajime OKUMURA
Atsushi SANADA
Katsuyoshi SATO
Kazuo SATO
Hiroshi SHIRAI
Hiroki SHOKI
Yoichiro TAKAYAMA
Satoshi TANAKA
Hiroyuki TODA
Mikio TSUJI
Katsutoshi TSUKAMOTO
Kikuo TSUNODA
Kouji WADA
Robert WEIGEL
Toshiyuki YAKABE
Yoshihide YAMADARyo YAMAGUCHIYo YAMAGUCHIAWARDS COMMITTEE
Chair:
Koji MIZUNOTECHNICAL PROGRAM COMMITTEE
Chair:
Kiyomichi ARAKITokyo Institute of Technology

Vice Chairs:
Masahiro MURAGUCHI
Noriharu SUEMATSU

NICT
Sharp Corp.
Chiba University
Aoyama Gakuin University
Kanagawa University
AIST
The University of Electro-Communications
ATR
Chiba University
Mitsubishi Electric Corp.
UCLA
Shonan Institute of Technology
The University of Electro-Communications
University of Hyogo
Utsunomiya University
NICT
Saitama University
NEC Laboratories America, Inc.
Mitsubishi Electric Corp.
Mitsubishi Electric Corp.
NTT
NTT
Fujitsu Laboratories Ltd.
AIST
Yamaguchi University
NICT
Toyota Central R&D Labs., Inc.
Chuo University
Toshiba Corp.
University of Hyogo
Hitachi, Ltd.
Doshisha University
Doshisha University
Osaka University
Murata Mfg. Co., Ltd.
The University of Electro-Communications
Universitat Erlangen-Nurnberg
The University of Electro-Communications
National Defense Academy
NTT DoCoMo, Inc.
NTT

Science University of Tokyo
Mitsubishi Electric Corp.

35

Tohoku University