Annual Technical Report 2017
Year Ended March 31, 2018

OITDA

Optoelectronics Industry and Technology Development Association

—CONTENTS—
Message from OITDA……………………………………………………………

1

Optoelectronics Industry Trends………………………………………………

2

Technological Strategy Development………………………………………… 11Standardization ………………………………………………………………… 14
Educational and Public Relations Activities ………………………………… 20
Supporting Members…………………………………………………………… 22

Message from OITDA

Yasuhisa Odani
President/Vice Chairman
Optoelectronics Industry and Technology
Development Association (OITDA)

It is my pleasure to present to you our Annual Technical Report 2017, which outlines the result of our surveys, researchand development activities in FY 2017.
According to the Optoelectronics Industry Trends Survey conducted every year by OITDA, the total shipments of theoptoelectronics industry recorded positive growth of 1.2% to reach 14,432.7 billion yen in FY 2017, compared to −15.5%
in FY 2016. Domestic production also showed signs of recovery, with a 1.0% decrease to finish at 7,716.8 billion yen in FY
2017, compared to a decrease of 12.4% in FY 2016. The improvement is attributable to positive growth in shipments inalmost all fields of the optoelectronics industry, with the photovoltaic energy field alone recording a significant drop(−19.3%). The breakdown is: +20.8% for image sensors, +10.1% for laser/optical processing, +9.6% for display equipment,+7.3% for optical sensing and measuring, +4.0% for optical input/output equipment, +3.3% for optical storage, and +2.9%
for LED lighting.
The fields that showed good performance in FY 2017 were led by new emerging markets such as investment in data
centers following the development of artificial intelligence (AI), the Internet of Things (IoT) and Big Data, and automateddriving systems in the automotive field, with the effects of the Winter Olympic and Paralympic Games evident. The newmarkets require new technologies for collection, communication and processing of massive amounts of data as common
technologies. Optoelectronics technologies include many key technologies such as various sensors including image sensors
and high-speed cameras in data collection, high-speed large-capacity optical network systems in data communication, andhigh-speed, low-power optoelectronic integrated circuits in data processing.
OITDA has been promoting the formulation of a research and development strategy and commercialization strategy
through cooperation among industry, academia and government regarding the optoelectronics technologies. At the sametime, OITDA has engaged in the following priority issues: survey and research on the optoelectronics technology andindustry, promotion of technology development, promotion of standardization, creation of new business, and developmentof human resources. In FY 2017, we directed our efforts to these issues as in previous years, and based on the results of such
efforts, also conducted dissemination and education, international exchange and cooperation, and provision of informationon the optoelectronics technology and industry.
Details of the activities and the outcomes of individual issues are presented in the report. Here, I would like to introduce
noteworthy events in FY 2017. First, we established the Automobile/Mobility Photonics Study Group to examine and discuss
optoelectronics technologies utilized in vehicles such as (1) automated driving systems including camera technology andranging technology, (2) in-vehicle networks and (3) data processing technology. Furthermore, in the Optoelectronics
Technological Strategy Development Committee, we drew up a vision for developing optoelectronics technologies toward
the Age of AI/IoT in a broad range of fields, including (1) optical communication systems and optical sensors required for
IoT and (2) optical devices and optical switches required for AI processing systems. This vision was presented at the
Symposium on the Optoelectronics Industry and Technology held on February 7, 2018 and is expected to be reflected
effectively in research and development undertaken by industry, academia, and government.
With regard to standardization, we actively carried out international standardization activities at IEC, ISO, and otherforums, primarily for the standardization of in-vehicle high-speed optical Ethernet, connectors for interconnection of opticalfibers, and optical switches through the project of the Ministry of Economy, Trade and Industry.
In order to support the growth of optoelectronics industry and technology, OITDA will strengthen and enhance ouractivities in accordance with needs, under the guidance of the Ministry of Economy, Trade and Industry and other governmentalorganizations and with the understanding and cooperation of our supporting members and many other people from thebusiness world and the academic community who are our important partners. We look forward to your continued guidance,
support, and cooperation.
1

Annual Technical Report2017 OITDAOptoelectronics Industry Trends
1. Introduction

2. Optical Storage:

Technologies that will dramatically change our society, such as
automated driving, AI and IoT, are rapidly being put into actual use. At
this major turning point, it is crucial to create new technologies andindustries toward our future society and markets. Optoelectronics
technology includes many technologies that will serve as the basis of
new industries, such as communication technology and sensing
technology. The optoelectronics industry, which has greatly contributed
to the economic growth of Japan by leading new innovation andindustrializing advanced technologies, is expected to take further strides
as an industry leader.
Thanks to the great support and cooperation of its affiliated members
and enterprises, OITDA has conducted its annual “Survey of Trends in
the Optoelectronics Industry” since its foundation in 1980. The resulting
data, accumulated over more than 30 years, are highly regarded asproviding basic information on optoelectronics industry trends.
The purpose of this survey is to suggest the future direction of theoptoelectronics industry through an analysis of its current status. In thisfiscal year, as in the previous year, seven field-specific subcommittees̶
namely, on optical communications, optical storage, input/output
equipment, display and solid-state lighting, photovoltaic energy, laser/
optical processing, and sensing and measuring̶were established under
the Optoelectronics Industry Trend Research Committee (parent
committee) to survey and analyze the trends in each field and theoptoelectronics industry as a whole.

disc media, laser diodes, etc.
3. Input/Output:

phones, image sensors, etc.
4. Display and Solidstate Lighting:projectors,

solid-state

5. Photovoltaic Energy: Photovoltaic

lighting

devices

and

power

generation

systems,

photovoltaic cells and modules
6. Laser/Optical

Laser/optical processing equipment, lamp/LD

Processing:lithography, additive manufacturing (3D printers),
laser oscillators

7. Sensing and
Measuring:
8. Others:(Notes)

Optical measuring instruments, optical sensing
equipment
Hybrid optical devices, etc.

Dotted underline:

Single underline:

Dashed underline:

Wavy underline:

Items added to the optoelectronics
products classification since the FY
2009 research.
Items added to the optoelectronics
products classification since the FY2010 research.
Items added to the optoelectronics
products classification since the FY
2013 research.
Items added to the optoelectronics
products classification since the FY
2014 research.

2.2 Overview of Survey Results of Total Shipments
Table 1 shows actual total shipments for FY 2016, estimated total
shipments for FY 2017, and a qualitative projection of total shipments
for FY 2018. The blue shaded sections in Table 1 represent
optoelectronics equipment/systems, and the yellow sections represent
optical components.
● FY 2016 (results): 14,262.0 billion yen, growth rate: −15.5%
In FY 2016, total shipments (results) for the optoelectronics industry
amounted to 14,262.0 billion yen (growth rate: −15.5%). This breaks
down as: 9,812.3 billion yen for optoelectronics equipment/systems(growth rate: −17.6%, component ratio: 68.8%) and 4,449.8 billion
yen for optical components (growth rate: −10.4%, component ratio:
31.2%).
The shipments by field were:523.7 billion yen for the optical communication field (growth rate:−0.5%, component ratio: 3.7%),
1,173.3 billion yen for the optical storage field (growth rate: −3.9%,
component ratio: 8.2%),
3,385.5 billion yen for the input/output equipment field (growth rate:−16.6%, component ratio: 23.7%),
5,343.2 billion yen for the display and solid-state lighting field (growth
rate: −17.1%, component ratio: 37.5%),
2,831.2 billion yen for the photovoltaic energy field (growth rate:−24.2%, component ratio: 19.9%),
658.6 billion yen for the laser/optical processing field (growth rate:+18.1%, component ratio: 4.6%), and260.6 billion yen for the sensing and measuring field (growth rate:+3.5%, component ratio: 1.8%).
● FY 2017 (estimation): 14,432.7 billion yen, growth rate: +1.2%
Total shipments for the optoelectronics industry in FY 2017 are
estimated to remain roughly flat at 14,432.7 billion yen (growth rate:+1.2%). This breaks down as: 9,931.0 billion yen for optoelectronics

Optical transmission equipment/systems, opticalfiber fusion splicer, light emitting devices, photodetectors, optical passive components, opticalfiber, optical connectors, etc.

Annual Technical Report2017 OITDA

Flat panel display devices and equipment,
equipment, LED (for lighting and displays), etc.

2.1 Survey of Total Shipments and Domestic Production for the
Optoelectronics Industry
A survey of total shipments and domestic production for the
optoelectronics industry was conducted as described below.
In order to determine the industry trends of domestic enterprises that
manufacture optoelectronics-related products (optoelectronics equipment/
systems and optical components), a survey was carried out by sending
questionnaires to 263 enterprises in October 2017. Questions were asked
about actual results for FY 2016, estimated values for FY 2017, andqualitative projections for FY 2018 concerning total shipments anddomestic production. The completed questionnaires were then collectedfrom December 2017 to February 2018.
In addition to the questionnaire survey, we also referred to the dataof the Japan Photovoltaic Energy Association (JPEA), Japan Lighting
Manufacturers Association (JLMA), Japan Electronics and Information
Technology Industries Association (JEITA), Camera & Imaging Products
Association (CIPA), and Fuji Chimera Research Institute, Inc. regarding
the photovoltaic energy field, solid-state lighting field, display field,
and input/output equipment field.
Based on the results of the questionnaire and the reference data, total
shipments including overseas production, domestic production, and theindustry trend in each product field were analyzed by the field-specificresearch subcommittees. The validity of the data and analysis results
were reviewed by the Optoelectronics Industry Trend ResearchCommittee, and the research results were compiled as a report on the
optoelectronics industry trends in Japan.
In this survey, the optoelectronics industry is categorized into thefollowing seven product fields, plus an additional field labeled “Others.”
Each product field is further divided into equipment/systems andcomponents.
Communication:

Optical printers, multifunction printers, digital
cameras, digital video cameras, camera mobile

2.	Total Shipments and Domestic Production for the
Optoelectronics Industry

1. Optical

Optical disc equipment (read-only, recordable), optical2

Optoelectronics Industry Trends
The domestic production by field was:424.5 billion yen for the optical communication field (growth rate:−3.8%, component ratio: 5.5%),
218.1 billion yen for the optical storage field (growth rate: −0.3%,
component ratio: 2.8%),
1,071.5 billion yen for the input/output equipment field (growth rate:+3.5%, component ratio: 13.9%),
3,232.1 billion yen for the display and solid-state lighting field (growth
rate: +7.2%, component ratio: 41.9%),
1,794.7 billion yen for the photovoltaic energy field (growth rate:−18.4%, component ratio: 23.3%),
699.4 billion yen for the laser/optical processing field (growth rate:+9.6%, component ratio: 9.1%), and
188.0 billion yen for the sensing and measuring field (growth rate:+8.4%, component ratio: 2.4%).
● FY 2018 (projections): slight increase
Domestic production in FY 2018 is projected to increase slightly forthe optoelectronics industry overall, as well as for optoelectronics
equipment/systems and optical components.
By field, the optical communication field will slightly increase, while
the optical storage field will decrease slightly. The input/output
equipment field and the display and solid-state lighting field will remain
steady. The photovoltaic energy field will decrease, while the laser/
optical processing field and the sensing and measuring field will increaseslightly.

equipment/systems (growth rate: +1.2%, component ratio: 68.8%) and
4,501.6 billion yen for optical components (growth rate: +1.2%,
component ratio: 31.2%).
The shipments by field are estimated to be:
503.7 billion yen for the optical communication field (growth rate:−3.8%, component ratio: 3.5%),
1,211.8 billion yen for the optical storage field (growth rate: +3.3%,
component ratio: 8.4%),
3,635.7 billion yen for the input/output equipment field (growth rate:+7.4%, component ratio: 25.2%),
5,692.5 billion yen for the display and solid-state lighting field (growth
rate: +6.5%, component ratio: 39.4%),
2,285.1 billion yen for the photovoltaic energy field (growth rate:−19.3%, component ratio: 15.8%),
724.9 billion yen for the laser/optical processing field (growth rate:+10.1%, component ratio: 5.0%), and279.5 billion yen for the sensing and measuring field (growth rate:+7.3%, component ratio: 1.9%).
● FY 2018 (projections): slight increase
Total shipments are projected to increase slightly for the
optoelectronics industry overall, as well as for optoelectronics equipment/
systems and optical components in FY 2018.
By field, the optical communication field will increase slightly, andthe optical storage field will slightly decrease. The input/output
equipment field will remain steady, and the display and solid-state
lighting field will remain steady. The photovoltaic energy field will
decrease, while the laser/optical processing field and the sensing andmeasuring field will increase slightly.

2.4 Trends in Total Shipments for the Optoelectronics Industry(1) Changes in Total Shipments for the Optoelectronics Industry
Fig. 1 shows the changes in the total shipments of the Japanese
optoelectronics industry and the rate of growth from the previous fiscal
year for the nine years from FY 2009 to FY 2017. The nominal GDP(one-tenth of the actual value) and the total (domestic and overseas)production of the Japanese electronics industry are added as a reference
to allow comparison between the total shipments for the optoelectronics
industry and domestic production for the Japanese economy and otherindustries.
In FY 2016, the overall output of the optoelectronics industry
decreased considerably (−15.5%) due to the significant decrease in thephotovoltaic energy field.
In FY 2017, the output of the entire industry is expected to remain
steady at +1.2% despite a continued decrease in the photovoltaic energy
field due to positive growth in the fields other than opticalcommunication and photovoltaic energy, especially in the display andsolid-state lighting field and the input/output equipment field.
Fig. 2 shows the changes by field. In FY 2016, five fields, that is,
all fields except for the laser/optical processing field and the sensing
and measuring field, recorded negative growth. The laser/opticalprocessing field increased considerably due to the increase in capital
investment mainly in the automotive industry. The sensing and measuring
field also increased slightly due to strong sales of photoelectric switches,laser microscopes, etc. In the input/output equipment field, image sensors
remained strong but could not compensate for the decrease in digital
cameras, etc., resulting in a significant decrease in the total shipment.
In the display and solid-state lighting field, the total shipment of solidstate lighting remained strong while that of display equipment anddevices decreased significantly because of declining prices due to theglobally intense competition, and decrease in demand for iPhones in
the global market, leading to the overall substantial decrease. The opticalcommunication field remained almost flat, as an increase in light emitting
devices and other components compensated for the decrease in opticaltransmission equipment for trunk lines and metro lines. The opticalstorage field decreased slightly due to the continuous price decline and2.3 Overview of Survey Results of Domestic Production
Table 2 shows the actual domestic production for FY 2016, estimateddomestic production for FY 2017, and a qualitative projection ofdomestic production for FY 2018.
● FY 2016 (results): 7,796.6 billion yen, growth rate: −12.4%
Domestic production (results) for the optoelectronics industry in FY
2016 decreased significantly to 7,796.6 billion yen (growth rate:−12.4%). This breaks down as: 4,519.8 billion yen for optoelectronics
equipment/systems (growth rate: −13.9%, component ratio: 58.0%)
and 3,276.7 billion yen for optical components (growth rate: −10.3%,
component ratio: 42.0%).
The domestic production by field was:441.1 billion yen for the optical communication field (growth rate:−1.2%, component ratio: 5.7%),
218.8 billion yen for the optical storage field (growth rate: −7.1%,
component ratio: 2.8%),
1,035.7 billion yen for the input/output equipment field (growth rate:−2.3%, component ratio: 13.3%),
3,014.8 billion yen for the display and solid-state lighting field (growth
rate: −9.9%, component ratio: 38.7%),
2,198.1 billion yen for the photovoltaic energy field (growth rate:−27.5%, component ratio: 28.2%),
638.3 billion yen for the laser/optical processing field (growth rate:+17.3%, component ratio: 8.2%), and173.5 billion yen for the sensing and measuring field (growth rate:+3.2%, component ratio: 2.2%).
● FY 2017 (estimation): 7,716.8 billion yen, growth rate: −1.0%
The domestic production of the optoelectronics industry in FY 2017is estimated to remain steady at 7,716.8 billion yen (growth rate:−1.0%). This breaks down as: 4,232.1 billion yen for optoelectronics
equipment/systems (growth rate: −6.4%, component ratio: 54.8%) and3,484.7 billion yen for optical components (growth rate: +6.3%,
component ratio: 45.2%).

3

Annual Technical Report2017 OITDA

Table 1
Product Items

Optical Equipment

Optical Communications Field
Optical Transmission Equipment

Optical Component

FY 2015 Shipment Actual(in million yen)
Growth Rate(%)

FY 2016 Shipment Actual(in million yen)
Growth Rate(%)

FY 2017 Shipment Estimate(in million yen)
Growth Rate(%)

526,187

1.7

523,719▲ 0.5

503,681

171,654▲ 16.2

144,701▲ 15.7

136,621

FY 2018 Shipment
Projection▲ 3.8 slight increase
▲ 5.6

flat

Truck Line and Metro Line93,916▲ 10.071,450▲ 23.959,453▲ 16.8flat

Subscriber Line40,437▲ 22.535,551▲ 12.1

39,226

10.3

flat

Router and Switch

25,235▲ 19.1

27,335

8.3

27,498

0.6 slight increase

Video Transmission (CATV, etc)

2,985

▲ 6.1

3,070

2.8

3,347

Optical Fiber Amplifier

9,081▲ 35.1

7,295▲ 19.7

7,097

Optical Transmission Link

77,874

17.7

76,919▲ 1.2

70,592▲ 8.2 slight increase

Light Emitting Device

55,40531.9

66,65820.3

58,518▲ 12.2 slight increase

Photo Detectors

17,07622.3

25,328

48.3

21,103▲ 16.7 slight increase

Optical Fiber

99,635

7.8

98,002▲ 1.6

101,090

3.2 slight increase

Optical Connector

23,222

1.8

23,2270.0

25,61710.3 slight increase

Optical Passive Component

26,85617.3

26,237▲ 2.3

24,980▲ 4.8

Optical Circuit Component

19,203▲ 4.5

28,74949.7

29,738

11,8749.8

Optical Transmission Component

331,145

Others（Semiconductor Amplifying
Device, Composite Optical Device）
Optical Fiber Fusion Splicer
Optical Storage Field

Optical Equipment

Shipment of Optoelectronics Industry (Summary)

Optical Disk

13.7

8.0

357,764

12,644▲ 3.9 slight increase343,706

6.5

9.0 slight increase▲ 2.7 increase

12,068flat

3.4 slight increase

flat

▲ 4.6

9.9 slight increase

23,388

9.7

21,254▲ 9.1

23,354

1,220,344▲ 6.9

1,173,306▲ 3.9

1,211,768

3.3

slight decrease

1,202,197▲ 6.7

1,155,326▲ 3.9

1,194,928

3.4

slight decrease

1,109,427▲ 6.6

1,064,939▲ 4.0

1,106,712

3.9

slight decrease

Read-only (CD, CD-ROM UNIT, DVD, BD)

817,922▲ 4.2

798,612▲ 2.4

835,379

4.6

slight decrease

Recordable

291,505▲ 12.8266,327▲ 8.6

271,333

1.9

36,522▲ 8.7

36,395▲ 0.3

32,106▲ 11.853,992▲ 4.0

Equipment

Media
Others (Optical Head, etc.)

56,248▲ 6.6

56,110flat
slight decrease

3.9

flat

18,147▲ 19.917,980▲ 0.9

16,840▲ 6.3

Input/Output Field

4,060,824▲ 7.4

3,385,544▲ 16.6

3,635,731

7.4

flat

▲ 9.6

2,706,794▲ 22.32,816,136

4.0

flat

▲ 0.8

flat

Optical Equipment

Laser Diode
Optical I/O Equipment
Optical Printer・Multifunction Printer769,431▲ 1.0

720,809▲ 6.3

714,949

Digital Camera・Digital Video Camera

1,092,906▲ 10.1

914,593▲ 16.3

1,003,876

9.8 slight increase

Camera Mobile Phone

1,508,440▲ 12.6

977,123▲ 35.2

1,008,349

3.2

slight decrease

112,953▲ 17.894,269▲ 16.588,962▲ 5.6

slight decrease

Others（Barcode Reader, Image
Scanner, Tablet Computer, etc.）
Image Sensor

Display and Solid-state Lighting Field

Optical Equipment

3,483,730

decrease

Display Equipment

9.4

678,750

17.6

819,595

6,441,759

3.6

5,343,178▲ 17.1

5,692,480

6.5

flat

3,050,215▲ 1.9

2,350,655▲ 22.92,576,992

9.6

flat

7.3

flat

577,094

Flat Panel Display
Projector
Large-scale LED Display, OELD TV, etc.

20.8 increase

2,722,612▲ 1.7

2,064,792▲ 24.22,214,890

280,299

3.0

249,341▲ 11.0268,933

7.9 increase

47,304▲ 28.993,169155.1 increase

36,522－

2,372,839

10.3

1,927,605▲ 18.82,047,055

6.2

LED

357,660▲ 5.2

367,3172.7

357,032▲ 2.8

Solid-state Lighting/Lamp

661,04514.2

697,601

5.5

711,401

2.0

slight decrease

Display Device

flat
flat

LED Lighting

553,89116.7

598,0638.0

615,520

2.9

slight decrease

LED Lamp

107,154

2.9

99,538▲ 7.1

95,881▲ 3.7

slight decrease

Photovoltaic Energy Field

3,733,350▲ 19.6

2,831,220▲ 24.2

2,285,106▲ 19.3decrease

Photovoltaic Power System

2,691,860▲ 14.6

1,983,736▲ 26.3

1,635,006▲ 17.6decrease

Photovoltaic Cell/Module

1,041,490▲ 30.1

847,484▲ 18.6650,100▲ 23.3decrease

Laser/Optical Processing Field

557,574

9.0

658,61518.1

724,9289.4

591,13422.1

652,964

Optical Equipment

Laser and Optical Processing Equipment

484,046

10.1 slight increase
10.5 slight increase

CO2 Laser

64,460▲ 8.6

50,957▲ 20.959,501

16.8

Solid State Laser

37,00211.0

40,2088.7

45,15912.3 slight increase

Excimer Laser

124,133

8.1

151,13621.8

126,465▲ 16.3 slight increase

Fiber Laser

41,656

18.7

68,845

65.3

92,08833.8 slight increase

Semiconductor Laser Direct Processing Equipment

2,487

▲ 5.3

3,145

26.5

5,612

78.4 increase

211,21015.2

274,57330.0

322,074

17.3

flat

3,098

14.3

2,270

▲ 26.7

2,065

▲ 9.0

flat
flat

Lamp/LD Exposure Machine
Additive Manufacturing (3D Printer)slight decrease

73,528

6.5

67,481▲ 8.2

71,964

6.6

251,8457.7

260,602

3.5

279,507

7.3 slight increase

Optical Measuring Instrument

18,62810.8

19,414

4.2

19,631

1.1 slight increase

Optical Sensing Equipment

233,2177.4

241,188

3.4

259,876

7.7 slight increase

84,802

4.3

85,837

1.2

99,46815.9 slight increase

Oscillator
Optical Sensing and Measuring Field

Others Field
Product Items

FY 2015 Shipment Actual(in million yen)
Growth Rate(%)

FY 2016 Shipment Actual(in million yen)
Growth Rate(%)

FY 2017 Shipment Estimate(in million yen)
Growth Rate(%)

FY 2018 Shipment
Projection

Sub Total for Optoelectronics Equipment

11,912,826▲ 6.8

9,812,265▲ 17.6

9,931,028

1.2 slight increase

Sub Total for Optoelectronics Components

4,963,859▲ 2.9

4,449,756▲ 10.44,501,641

1.2 slight increase

Total for Optoelectronics Products

16,876,685▲ 5.7 14,262,021▲ 15.5 14,432,669

1.2 slight increase

Annual Technical Report2017 OITDA

4

Optoelectronics Industry Trends
Table 2
Product Items

Optical Equipment

Optical Transmission Equipment
Optical Communications Field

FY 2015 Production Actual(in million yen)
Growth Rate(%)
446,3741.9

441,070▲ 1.2

424,512▲ 3.8 slight increase▲ 13.8132,538▲ 16.8

123,949

▲ 6.5

flat
flat

92,370▲ 9.5

70,727▲ 23.4

58,635▲ 17.1

Subscriber Line38,909▲ 22.034,260▲ 11.937,926

10.7

Router and Switch

17,779▲ 6.2

18,451

3.8

18,4980.3

Video Transmission (CATV, etc)

2,900

▲ 0.2

3,040

4.8

3,370

10.9 slight increase

Optical Fiber Amplifier

7,305▲ 33.26,060▲ 17.05,520▲ 8.9 increase

Optical Transmission Link

48,88024.3

50,406

3.1

47,869▲ 5.0 slight increase

Light Emitting Device

36,89421.4

43,482

17.9

37,125▲ 14.6

Photo Detectors

11,04232.2

18,23065.1

13,730▲ 24.7 slight increase

Optical Fiber

93,9399.4

94,382

0.5

96,6802.4 slight increase

Optical Connector

19,2052.9

19,005▲ 1.0

20,623

8.5

flat

Optical Passive Component

25,255

19.3

23,712▲ 6.1

22,983

▲ 3.1

flat

Optical Circuit Component

17,802▲ 5.5

26,43548.5

27,36910,706

13.1

Optical Fiber Fusion Splicer

Optical Equipment

Optical Storage Field
Optical Disk

263,723

13.6

8.9

287,278

11,626▲ 3.5 slight increase

277,209

8.6

flatslight decrease

10,830flat

3.5 slight increase

flat

▲ 6.8

9.9 slight increase

23,388

9.7

21,254▲ 9.1

23,354

235,465

0.6

218,837▲ 7.1

218,094▲ 0.3

slight decrease

235,465

0.6

218,837▲ 7.1

218,094▲ 0.3

slight decreaseslight decrease

Equipment

214,927▲ 0.3

203,375▲ 5.4

202,482▲ 0.4

Read-only (CD, CD-ROM UNIT, DVD, BD)

184,927

2.2

175,783▲ 4.9

169,841▲ 3.4 slight increase

Recordable

30,000▲ 13.6

27,592▲ 8.0

32,641

18.3

20,53812.3

15,462▲ 24.7

15,612

1.0

Media, Optical Head, etc.

Input/Output Field

Optical Equipment

FY 2017 Production Estimate
FY 2018 Production
Projection(in million yen)
Growth Rate(%)

159,263

Others（Semiconductor Amplifying
Device, Composite Optical Device）

Optical I/O Equipment

1,059,868

2.4

1,035,661▲ 2.3

1,071,530

3.5

634,520▲ 2.2

539,974▲ 14.9478,599▲ 11.4

Optical Printer・Multifunction Printer117,405

12.3

87,993▲ 25.1

69,891▲ 20.6flat
slight decrease
flat
flat
slight decrease

Digital Camera・Digital Video Camera

282,972▲ 4.0

264,133▲ 6.7

270,304

2.3

Camera Mobile Phone

190,022▲ 1.9

149,809▲ 21.2

102,488▲ 31.6decrease

Others（Barcode Reader, Image
Scanner, Tablet Computer, etc.）

44,121▲ 20.438,039▲ 13.835,916▲ 5.6slight decrease

Image Sensor
Display and Solid-state Lighting Field

Optical Equipment

FY 2016 Production Actual(in million yen)
Growth Rate(%)

Truck Line and Metro Line

Optical Transmission Component

Optical Component

Domestic Production of Optoelectronics Industry (Summary)

Display Equipmentflat

425,3489.9

495,687

16.5

592,9313,347,281

5.0

3,014,775▲ 9.9

3,232,127

19.6 increase
7.2

flat

543,251▲ 0.8

534,901▲ 1.5

552,733

3.3

flat

Flat Panel Display

481,7812.1

476,660▲ 1.1

466,211▲ 2.2

Projector

23,466▲ 6.3

21,719▲ 7.4

18,353▲ 15.538,004▲ 24.9Large-scale LED Display, OLED TV, etc.

36,522▲ 3.9

68,169flat
slight decrease

86.7 increase

2,078,078

5.0

1,701,622▲ 18.1

1,902,147

11.8

slight decreaseLED327,664▲ 0.8

348,143

6.3

334,217▲ 4.0

slight decrease

Solid-state Lighting/Lamp

398,28820.7

430,1098.0

443,030

Display Device

3.0

slight decrease

LED Lighting

387,73921.9

418,6478.0

430,864

2.9

slight decrease

LED Lamp

10,549▲ 10.911,462

8.7

12,166

6.1

Photovoltaic Energy Field

flat

3,030,032▲ 13.2

2,198,132▲ 27.5

1,794,669▲ 18.4decrease

Photovoltaic Power System

2,626,198▲ 11.91,907,821▲ 27.4

1,588,056▲ 16.8decrease

Photovoltaic Cell/Module

403,834▲ 20.5

290,311▲ 28.1

206,613▲ 28.8decrease

Laser/Optical Processing Field

544,1129.1

638,33817.3

699,3629.6

572,380

21.4

628,422

Optical Equipment

Laser and Optical Processing Equipment

471,642

9.6 slight increase
9.8 slight increase

CO2 Laser

62,696▲ 8.6

47,125▲ 24.857,00821.0

Solid State Laser

32,81911.6

34,2984.5

38,80313.1 slight increase

Excimer Laser

120,776

8.7

147,83122.4

123,531▲ 16.4 slight increase

Fiber Laser

38,83018.6

62,764

61.6

79,321

26.4 slight increase

Semiconductor Laser Direct Processing Equipment

2,213▲ 13.1

3,519

59.0

5,620

59.7 increase

211,21015.2

274,57330.0

322,074

17.3

3,098

14.3

2,270

▲ 26.7

2,065

▲ 9.0

flat

7.6

flat

Lamp/LD Exposure Machine
Additive Manufacturing (3D Printer)
Oscillator

72,4706.2

65,958▲ 9.0

70,940slight decreaseflat

168,067

4.6

173,495

3.2

188,048

8.4 slight increase

Optical Measuring Instrument

15,707

6.3

17,1229.0

16,985▲ 0.8 slight increase

Optical Sensing Equipment

152,360

4.4

156,373

2.6

171,063

9.4 slight increase

71,767▲ 3.4

76,243

6.2

88,50516.1 slight increase

Optical Sensing and Measuring Field

Others Field
Product Items

FY 2015 Production Actual(in million yen)
Growth Rate(%)

FY 2016 Production Actual(in million yen)
Growth Rate(%)

FY 2017 Production Estimate
FY 2018 Production
Projection(in million yen)
Growth Rate(%)

Sub Total for Optoelectronics Equipment

5,249,533▲ 5.0 4,519,847▲ 13.9 4,232,119

Sub Total for Optoelectronics Components

3,653,433

1.7 3,276,704▲ 10.3 3,484,728

6.3 slight increase

Total for Optoelectronics Products

8,902,966▲ 2.4 7,796,551▲ 12.4 7,716,847▲ 1.0 slight increase5▲ 6.4 slight increase

Annual Technical Report2017 OITDA

Total Shipment (Trillion yen)

60
50

1.8

40

9.4

30

0.0

5.2

3.3

14.9

2.0

▲ 0.8

1.3

▲ 8.9

5.1
▲ 12.2

5.8

10

1.5

2.0

1.3

▲ 1.8

▲ 11.3

20

1.7

8.7

▲ 5.7

▲ 5.7

1.2

▲ 15.5Nominal GDP (1/10) *1
Domestic and Overseas Electronics Production *2

0

Total Shipment of Domestic Optoelectronics Companies

09

10

11

12

13

14

15

16

Fiscal Year

17

Estimate*1 “Fiscal 2018 Economic Outlook and Basic Stance for Economic and Fiscal Management” (Jan. 2018) [Cabinet Decision]*2 “Production Forecasts for the Global Electronics and Information Technology Industries,” JEITA, Dec. 19, 2017

Fig.1

Total Optoelectronics Shipment, Nominal GDP, and Domestic & Overseas Electronics Production

is likely to recover from the substantial decrease in the previous year
and remain steady overall with the solid-state lighting field remaining
strong due to the growing awareness of energy conservation and withthe growth of 4K TV sets due to replacement for the Tokyo Olympic
and Paralympic Games and the release of organic EL TV sets. The input/
output equipment field is estimated to increase slightly due to an increase
related to digital cameras and strong sales of image sensors. The opticalstorage field as a whole is estimated to increase slightly due to anincrease in sales related to optical disks for business use. The photovoltaic
energy field is estimated to continue to decrease significantly due tochanges in the FIT and the falling purchase price.

decrease in demand. The photovoltaic energy field decreased significantly
due to changes in the Feed-in Tariff (FIT) system and the falling purchaseprice.
In FY 2017, the laser/optical processing field and the sensing andmeasuring field are estimated to increase moderately due to the increasein capital investment (mainly in the automotive industry) and strong
sales of photoelectric switches and in-vehicle cameras, etc., respectively.
The optical communication field as a whole is estimated to decreaseslightly as optical transmission equipment for trunk lines and metro
lines is likely to decrease substantially due to reduction in domestic
investment, although that for subscriber lines is estimated to increase
due to replacement demand. The display and solid-state lighting field

9.0

Display and Solid-state
Lighting
I/O Equipment

Shipment of Each Field (Trillion yen)

8.0

Optical Storage

7.0

Photovoltaic Energy

6.0

Optical Communication

5.0

Laser Processing

4.0

Sensing/Measuring

3.0
2.0
1.0
0.0
09

10

11

12

13

14

15

Fiscal year

Fig.2
Annual Technical Report2017 OITDA

Shipment by Product Field

6

16

17

Estimate

Optoelectronics Industry Trends
100%
90%

2.6%
3.3%
6.8%

2.9%
2.9%
6.4%

3.3%
3.1%
7.2%

24.3%

26.2%

22.1%

4.6%
3.7%

5.0%
3.5%

8.2%

8.4%

19.9%

15.8%

Proportion of Shipment

80%
70%

0.7%
1.9%

Others

60%
50%

25.1%

24.1%

24.7%

23.7%

25.2%

40%

Optical Communication

36.1%

38.2%

35.1%

37.5%

39.4%

10%
0%

Laser Processing
Optical Storage

30%
20%

Sensing/Measuring

Photovoltaic Energy
I/O Equipment
Display and Solid-state Lighting

FY201317.4 Trillion yen

FY201417.7 Trillion yen

Fig.3

FY201516.9 Trillion yen

FY201614.3 Trillion yen

Proportion of Shipment by Product Field(2) Proportion and Contribution to Total Shipment by Field
Fig. 3 shows the changes in the proportion of the total shipments ofoptoelectronics products by field over the five years from FY 2013(actual results) until FY 2017 (estimate), while Fig. 4 shows the changes
in the contribution of each product field to the increase/decrease in the
total shipments.
From the proportion by field (Fig. 3), we can see that, the photovoltaic
energy field switched places with the input/output equipment field inshares and leapt into second position in FY 2014 due to the rapid growthfrom FY2011.
However, the input/output equipment field returned to second place
due to the decline in the share of the photovoltaic energy field in FY
2015.

25,000FY2017 estimate
14.4 Trillion yen

In FY 2016, the share of the display and solid-state lighting field andthe input/output equipment field decreased while the share of thephotovoltaic energy field continued its rapid decline.
In FY 2017, the share of the display and solid-state lighting field andthe input/output equipment field is likely to increase, but the share of
the photovoltaic energy field is estimated to further decrease.
The contribution to the increase/decrease in the total shipments byfield (Fig. 4) shows that the photovoltaic energy field recorded strong
positive growth, and the display and solid-state lighting, opticalcommunication, laser/optical processing, and sensing and measuring
fields inverted to positive in FY 2013.
In FY 2014, the display and solid-state lighting, photovoltaic energy,
laser/optical processing, and sensing and measuring fields maintained

2,254 Billion yen

Changes from Previous Year (Billion yen)

20,00015,00010,000353 Billion yen

5,000
0-5,000-10,000-15,000-20,000-25,000-30,000

FY2013

FY2014

Display and Solid-state Lighting
I/O Equipment
Photovoltaic Energy
Optical Communication
Optical Storage
Laser Processing
Sensing/Measuring
Others
Total

Fig.4

171 Billion yen
FY2015FY2016FY2017
estimate▲846 Billion yen▲2,615 Billion yen

Contribution to Changes in Total Shipment by Product Field

7

Annual Technical Report2017 OITDA

1.0

25

0.8 0.2

1.8

▲1.8
▲0.7

20

7.0

▲18.2

▲12.0

29.2 1.1 0.1

Domestic Optoelectronics Production
Nominal GDP (x1/20) *1

11.2

Domestic Electronics Production *2

5

2.7

0.0

1.3

2.0

2.5

1.7 1.5

▲1.8

▲0.8
▲7.9

Numeral: Growth ratio comparedto the preceding ﬁscal year

10

0

▲4.6
▲3.2

6.5

2.3
▲3.5

15

8.7

0.5 0.7 0.8

5.3 0.6

14.0

2.6▲26.9 ▲15.0
7.3

▲16.7
▲9.5

▲10.7 ▲2.0
21.8

▲10.5 ▲1.5

5.2

4.1

7.4 2.2▲9.8▲2.3▲12.4 ▲1.0

▲15.1

81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 00 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 18
Estim
Pre atediction

Domestic Production (Trillion yen)

30

Fiscal year
*1 “Fiscal 2018 Economic Outlook and Basic Stance for Economic and Fiscal Management” (Jan. 2018) [Cabinet Decision]*2 “Production Forecasts for the Global Electronics and Information Technology Industries,” JEITA, Dec. 19, 2017

Fig.5

Domestic Optoelectronics Production, Nominal GDP, and Domestic Electronics Production

In FY 2017, positive growth is expected except for in the opticalcommunication and photovoltaic energy fields. The growth of the entire
industry is likely to remain steady.

positive growth but the other three fields turned negative. In particular,
growth was substantially inhibited in the photovoltaic energy field.
In FY 2015, the display and solid-state lighting, laser/opticalprocessing, and sensing and measuring fields maintained positive growth
but the optical communication, optical storage, and input/output
equipment fields remained negative. In particular, the growth inphotovoltaic energy decreased significantly.
In FY 2016, only the laser/optical processing and sensing andmeasuring fields achieved positive growth. The photovoltaic energy,
display and solid-state lighting, and input/output equipment fields
recorded substantially negative growth.

Domestic Production (Trillion yen)

4.50

2.5 Trends in Domestic Production for the Optoelectronics Industry(1) Changes in Domestic Production for the Optoelectronics
Industry
Fig. 5 shows the changes in domestic production from FY 1980 toFY 2017 alongside nominal GDP (one-twentieth of the actual value)
and the domestic output of the electronics industry.
Output for the optoelectronics industry was around 80 billion yen in

Display and Solid-state Lighting

4.00

I/O Equipment

3.50

Photovoltaic Energy

Optical Storage
Optical Communication
Laser Processing

3.00

Sensing/Measuring

2.50
2.00
1.50
1.00
0.50

96

97

98

99

00

01 02

03 04

05 06 07 08

09 10

11 12

Fiscal year

Fig.6
Annual Technical Report2017 OITDA

Domestic Optoelectronics Production by Field

8

13 14

15 16 17
ate

95

Es
tim

0.00

Optoelectronics Industry Trends
FY 1980, when our survey on domestic production value started. It grewin the 1980s in line with Japanʼs economic growth. In 1991, it accounted
for a tenth of the domestic production value of the electronics industry,
and consistently maintained a positive growth trend, exceeding the 7
trillion yen level in FY 2000. Affected by the recession following the
dot-com bust, the optoelectronics industry recorded negative growth in
FY 2001 for the first time since the survey started. After a rapid recovery,
it approached the 10 trillion yen level in FY 2003, and has since been
greatly affected by the macro economy, showing changes linked to GDP
and the electronics industry. It grew slowly until FY 2007, but thereafter
experienced two consecutive years of negative growth, being affectedby the global financial recession from FY 2008 to FY 2009. The partial
recovery trend seen in FY 2010 lost steam, and again turned negativein FY 2011 to FY 2012. In FY 2013, however, the economy recoveredon the back of Abenomics, as indicated by the 1.7% nominal GDP
growth, and the domestic production value for the entire optoelectronics
industry grew substantially (21.8%) for the first time in years due to theincrease in capital investment and general consumption. In FY 2014,
production also increased by 4.1% compared to FY 2013.
In FY 2015, production decreased by 2.3% for the first time in three
years due to the significant decrease in the photovoltaic energy field.
In FY 2016, five fields, including photovoltaic energy, recorded
negative growth, with a significant decrease of 12.4%.
In FY 2017, five fields, including display and solid-state lighting, areestimated to compensate for negative growth in the opticalcommunication and photovoltaic energy fields, resulting in flat growth.
Fig.6 shows the changes in domestic production of optoelectronics
products for each field (seven fields, excluding “Others”) over the 23
years from FY 1995 (actual results) to FY 2017 (estimate).
During the 1990s, there was favorable growth in the display, input/
output equipment, optical communications, and optical storage fields,with domestic production for each increasing to over 1 trillion yen in
the year 2000. The laser/optical processing, sensing and measuring, andphotovoltaic energy fields also performed favorably in the 1990s,
although the production value was less than 500 billion yen. However,developments in each field showed significant differences after the dot-

100%

Proportion of Domestic Production

90%

2.9%
4.9%

1.8%

2.5%
5.5%
4.8%

5.9%

1.8%

2.6%
6.1%

com bubble burst in 2001.
There was not much of a decline in the input/output equipment field
in FY 2001, and it remained steady from FY 2002 onwards. However,it started showing negative growth from FY 2008 onwards. Although it
had finally started showing signs of bottoming out in FY 2011, by FY
2012 and even in FY 2013 it followed a path of negative growth. In FY
2014, however, the trend stayed almost flat.
The display and solid-state lighting field continued to grow favorably
despite some fluctuations, peaked in FY 2010, and then nosedived. In
particular, the domestic production value for flat display devices in the
two years from FY 2011 decreased by almost 80%. On the other hand,the solid-state lighting field attained a three-digit growth rate in FY
2011 and double-digit growth in FY 2012. Although the values for FY
2013 are not comparable with values from the previous year because of
the changes in the aggregation method, production itself steadily
increased until FY 2015. Despite the significant decrease due to thedecrease in the demand for TV sets and falling price, etc. in FY 2016,solid-state lighting is estimated to increase moderately in FY 2017 dueto the growing awareness of energy conservation. The field as a wholeis estimated to remain steady, with the growth of 4K TV sets due toreplacement for the Tokyo Olympic and Paralympic Games and therelease of organic EL TV sets.
The photovoltaic energy field had been leading the growth in the
optoelectronics industry since FY 2008. In particular, since theintroduction of Feed in Tariffs (FITs) in July 2012, production for the
power industry grew substantially, and this field accounted for the largest
share of the domestic production value in FY 2013. However, the growthrate dropped sharply in FY 2014, resulting in a significant decrease in
FY 2015 and FY 2016. Production is estimated to continue to decreasesignificantly in FY 2017.
The optical storage field is continuing its prolonged decline. It fell
below 250 billion yen in FY 2012 (−40.4%) but rebounded tosignificantly increase by 17.1% in FY 2013. It reversed to a decline of−9.8% in FY 2014, remained steady with an increase of 0.6% in FY
2015, and decreased again in FY 2016 by 7.1%. It is estimated to remain
flat with a 0.3% decrease in FY 2017.

1.9%

2.8%

5.0%

80%
70%
60%

38.2%

38.3%

34.0%

2.8%

8.2%

9.1%

5.7%

5.5%

28.2%

23.3%
Others

12.6%

11.7%

13.3%

11.9%

13.9%

Optical Storage
Laser Processing

Optical Communication
Photovoltaic Energy

30%
20%

2.4%

Sensing/Measuring

50%
40%

2.2%

I/O Equipment

32.8%

34.5%

37.6%

38.7%

41.9%

FY20138,746.3
billion yen

FY2014
9,109.0
billion yen

FY2015
8,903.0
billion yen

FY2016
7,796.6
billion yen

FY2017 estimate
7,716.8billion yen

Display and Solid-state Lighting

10%
0%

Fig.7

Proportion of Domestic Optoelectronics Production by Field

9

Annual Technical Report2017 OITDA

Changes from Previous Year (Billion yen)

16,000

Display and Solid-state Lighting

1,568 Billion yen

I/O Equipment

14,000

Photovoltaic Energy

12,000

Optical Communication
Optical Storage

10,000Laser Processing

8,000

Sensing/Measuring
Others

6,000
4,000
2,000

Total

363 Billion yen
FY2013

FY2014FY2015FY2016FY2017 estimate

0-2,000▲80 Billion yen-4,000▲206 Billion yen-6,000-8,000-10,000▲1,106 Billion yen-12,000

Fig.8

Contribution to Changes in Domestic Production by Field

share by 2.2 points from FY 2014 to FY 2017.
Regarding the contribution of each field (Fig. 8) to domestic
production, the photovoltaic energy field showed a strong positive
contribution and only the input/output equipment field was negative in
FY 2013.
In FY 2014, no field stood out, but the display and solid-state lighting,photovoltaic energy, laser/optical processing, and sensing and measuring
fields achieved positive growth while the three other fields recorded
negative growth.
Since FY 2015, the photovoltaic energy field has dragged down overall
growth.
Particularly in FY 2016, when five fields other than the laser/opticalprocessing field and the sensing and measuring field recorded negative
growth, the entire optoelectronics industry recorded a decrease of about
1.1 trillion yen.
In FY 2017, the negative growth of the industry is estimated to remain
at the level of about 80 billion yen as the display and solid-state lighting
and input/output equipment fields turned positive while the decrease in
the photovoltaic energy field shrank.

Optical communications, laser/optical processing, and sensing andmeasuring, which mainly focus on the domestic market, are easily
influenced by domestic economic conditions and capital investments
and reflect the trends in the economic conditions, grew substantially in
FY 2013. In FY 2014, the laser/optical processing field and the sensing
and measuring field grew significantly by 16.6% and 19.2%, respectively.
These two fields showed a similar trend in FY 2015 and onwards.
Optical communications had a 2.9% rate of growth in FY 2014 due
to underperformance in trunk and metro lines, etc. In FY 2015, opticaltransmission equipment/system was negative, but components werestrong, resulting in an overall increase of 1.9%. It remained almost flatat −1.2% in FY 2016 and is estimated to decrease slightly by 3.8% in
FY 2017.
(2) Proportion and Contribution to Domestic Production by
Field
Fig. 7 shows the changes in the proportion of the domestic production
for each field of optoelectronics products over the five years from FY
2013 (actual results) until FY 2017 (estimate), while Fig. 8 shows thechanges in the contribution of each product field to the increase/decreasein domestic production.
Looking at Fig. 7, which shows the proportion by field, it is foundthat three fields (display and solid-state lighting, input/output equipment,
and photovoltaic energy) account for approximately 80% of the whole.
The photovoltaic energy field has continued to rise very rapidly due
to FIT and the excess power purchase system, subsidies, etc.; it leapt tothe top in FY 2013, but its share decreased substantially after FY 2015.
In the display and solid-state lighting field, solid-state lighting has
continued to grow rapidly due to the growing awareness of energy
conservation despite the decline in the display field. In FY 2015, theproportion of the display and solid-state lighting field returned to the
top position due to the decrease in the photovoltaic energy field.
Although production of the display and solid-state lighting field
substantially decreased in FY 2016, the field held onto the top share
due to a considerable decrease in the photovoltaic energy field, and islikely to increase its share with increasing production in FY 2017.
The input/output equipment field seemed to hit a bottom after
declining due to the slump in the market for devices such as digital
cameras and camera mobile phones, and is estimated to increase its
Annual Technical Report2017 OITDA

10Technological Strategy Development
1. Introduction

consumption, and categorized the technologies and required performanceparameters into (1) optoelectronics technology at the edge, (2)optoelectronics technology in the cloud, and (3) optical transport network
technology, as shown in Fig. 9 We also discussed (4) photoelectronic
integration technology as a fundamental technology for implementing
the abovementioned technologies.

Since 1996, OITDA has undertaken “Optoelectronics Technology
Roadmap Development” activities, with the aim of ascertaining the future
growth of the optoelectronics industry, and seeking a direction for
optoelectronics technology R&D. These activities have become one ofthe platforms for launching numerous national projects in the fields of
optical communication, optical storage, displays, light energy, and laser
processing, and have contributed extensively to the development of theoptoelectronics industry and its technology.
Starting in FY 2011, OITDA developed the “Optoelectronics
Technology Roadmap Toward the 2030s” as its five-year plan for thefive selected technological fields of information processing photonics,
safety and security photonics, optical user interfaces, opticalcommunications, and optical processing/measurement to broadly show
the future vision for optoelectronics technology in the 2030s. From FY
2016, we introduced a new approach in the strategy development inwhich we clarify how optoelectronics technology can contribute tospecific fields of application, rather than to each technological field, as
the goal of the activity. In FY 2016, as the first year of the new initiative,
we selected automotive photonics as our theme and investigated strategies
and a technological roadmap for developing optoelectronics technology
in automated driving. For FY 2017, we studied a strategy on
optoelectronics technology toward the age of AI (artificial intelligence)and IoT (Internet of Things), with the aim of clarifying how
optoelectronics technology can contribute to AI and IoT, which havebeen undergoing rapid technological development and been used
increasingly in industrial applications in recent years.

2.1 Optoelectronics Technology at the Edge
Sensors that gather diverse types of data from the surrounding
environment at the edge play a very important part in automated driving,
medical diagnosis, disaster prevention, smart manufacturing, etc.
One of the most important sensors using optoelectronics technologies
is the image sensor. With the remarkable technological advancement of
CMOS image sensors in recent years, substantial improvements havebeen made for higher definition and higher sensitivity. In automateddriving, it is crucial to accurately grasp surrounding traffic conditions,
including other vehicles, pedestrians, and road signs, meaning that theroles that image sensors must play will increase. In light of the ongoingadvancement of in-vehicle cameras toward higher definition, image
sensors that have definition higher than 8K may become essential in the
future. In the security field, for instance, higher definition is necessary
to track a specific person in a crowd. Monitoring cameras may have 8K
or higher definition in the future.
For automated driving at night and medical diagnosis, it seems useful
to obtain information on wavelength spectra other than normal visible
light. At night, obtaining infrared light together with an image is expected
to prevent accidents that may otherwise occur when a pedestrian rushes
out into the street. It is also anticipated that a wide variety of vital
information obtained from infrared light data would help medical
diagnosis. These kinds of multi-spectrum image sensors will become
extremely important.
Sensors that obtain non-image information simultaneously with image
data are likely to play increasingly important roles. In the area of
automated driving, R&D on optical radars that can obtain more accurate
distance information is being intensified. The integration of distancesensors with image sensors becomes important in the area of security
as well. For example, Appleʼs iPhone X® has put into practical use
personal authentication that combines a distance sensor using a surfaceemitting laser array and an image sensor. Furthermore, obtaining data,such as sound and distortion, together with image data is expected to

2. Optoelectronics Technology Required for the Age of AI/IoT
As the first step of our study, we envisaged the future society in theage of AI and IoT and shared our understanding that the rapid expansionof IoT and advancement of AI will require the:・sensing and collection of diverse types of information at the edge,・transfer and consolidation of the various kinds and vast amounts of
information between the edge and the cloud via optical networks, and・learning and deduction processing using vast amounts of information
by AI on the cloud side.
Based on this understanding, we discussed what kind of optoelectronics
technology is required and how optoelectronics technology can contributeto implement these processes at high speeds and with low power

Fig.9

Conceptual image of the edge, cloud, and optical network

11

Annual Technical Report2017 OITDAdevices increases in the future, the volume of machine-to-machine(M2M) traffic, which does not require human intervention, is expected
to increase a thousandfold, meaning that network transmission capacity
must increase by a thousandfold or greater. Backbone transmission
capacity, which is currently about 10 Tbps, must be tens of Pbps in the
future. Access network transmission capacity must be sped up fromtodayʼs one to several Gbps to several Tbps, which requires theadvancement of optoelectronics technology, including spatial
multiplexing optical transmission technology, multi-dimensional
modulation and demodulation technology, error correction/digital signal
processing technology, and technology for highly integrated opticaltransmitter and receiver modules. Additionally, as 5G wireless networks
will be put into practical use in the future, optical wireless integrated
access technology and network virtualization technology will become
extremely important.

enable us to identify aging parts of infrastructure, such as bridges andtunnels, and detect abnormalities at factories. Multi-sensor cameras that
integrate diverse sensors with high-definition image sensors may achievesensing beyond human perception and may open up new areas ofapplication when combined with AI technology.
Depending on the area of application, AI deduction processing is also
required at the edge. For example, automated driving, which requires
low latency, cannot rely on cloud-based deduction processing.
Furthermore, as mentioned earlier, automated driving in the future
will use 8K or higher definition video. Normally, video data is reducedin size with image compression when transmitted, but automated driving,in which low latency is crucial, requires transmission of uncompressedvideo data. When transmitting uncompressed video data of 8K or higher
definition, transmission speed of around 100 Gbps is required. Therefore,
in-vehicle data transmission that needs optical transmission between
multiple cameras and an AI unit requires technology for optical input/
output interfacing of 100 Gbps or greater transmission capacity. In
medical applications, similar high-speed optical interfacing is needed
for low-latency transmission of 8K images for telemedicine.

2.4 Photoelectronic Integration Technology
Ultrahigh-speed interfaces at edge and cloud, ultrahigh-speed opticaltransmission between edge and cloud, and high performance sensors at
the edge require advanced photoelectronic integrated circuit technology
as their foundation. In particular, integration density of photonic
integrated circuits using silicon photonics technology doubles every
year, meaning that it is becoming possible to create more complicatedphotonic integrated circuits by silicon photonics. Further, as technology
for fabricating photonic integrated circuits integrally with electronic
circuits necessary for operating the photonic integrated circuits andthree-dimensional mounting technology become possible, integral designof photonic circuits and electronic circuits will become essential in the
future.
Currently, in Europe and the United States, the unified environment
for design and operation analysis of photoelectronic integrated circuits
are being put in place and the fabless model using common fabrication
facilities for production is being established. Like LSI, integral design
will inevitably become the standard for design and production ofphotoelectronic integrated circuits. Thus, in the age of AI and IoT, it isnecessary to establish a design flow that uses a common design
environment for device design and circuit design, analyzes device
operation through device/process simulators and circuit simulators, andre-designs to satisfy the desired performance. It will also become
important to establish a fabless model in which a design rule checker
verifies the design data if there are any problems in production before
the design data is smoothly transferred to fabrication facilities for
production. By establishing a platform for the design and production ofphotoelectronic integrated circuits, advanced optoelectronics technologies
and devices required in the age of AI and IoT can be realized.

2.2 Optoelectronics Technology in the Cloud
Clouds require large-scale AI learning based on the large amounts of
information obtained at the edge. To facilitate high-speed learning usinglarge amounts of information, parallel learning is essential. To exchange
parameters updated through learning at each AI server, networks thatconnect server racks at high speeds are necessary. However, electric
switches require an extremely large amount of power. Considering thatthe performance improvement of large-scale integrated circuits (LSI)
according to Mooreʼs law can no longer be expected in the future, theperformance improvement in electric switches is likely to slow down.
Therefore, to realize the large-scale parallel processing in clouds, theroles of switches using optoelectronics technology will become
important.
Additionally, the transmission of large-scale data sets for learningand learned parameters will require ultrahigh-speed interfaces. However,as mentioned above, it is also difficult to secure a communication bandof 100 Gbps or greater with electric interfaces, as the rate of improvementof LSI performance is likely to plateau. With no prospect for dramatic
improvements in the performance of electric interfaces, their replacementwith optical interfaces is necessary. It is desired that research will
advance the implementation of optical interfaces on LSI using silicon
photonics technology, which has been advancing to a remarkable degree
in recent years. If optical interfaces could achieve bandwidths of 10 to
100 Tbps per chip, it would be a major technological innovation.
Optoelectronics technology is also expected to play an important rolein the search for new computing architecture in the post-Moore age. If
it becomes possible to provide high-speed power-saving optical interfaces
for LSI that surpass electric interfaces, new architecture that carries on
computing while transferring data between computing units, each ofwhich is adapted to a specific type of processing, may be put into
practical use. Realization of the architecture would bring about aconsiderable change in computing technology. Meanwhile, as proposals
on new methods of computing that take advantage of opticalcharacteristics, such as optical arithmetic operations and optical deeplearning, are increasing, optoelectronics technology is expected tocontribute in the search for new computing methods surpassing
conventional arithmetic operation using CMOS circuits.

3. Proposals(1) Optoelectronics technology at the Edge
A combination of high-definition multi-sensor cameras that havesensing functions surpassing the human five senses with AI will open
up new areas of application. In automated driving, ultrahigh-speed opticalinterfaces must be achieved to transfer high-definition video data to an
AI unit in the same edge node with low latency.
(2) Optoelectronics technology in the CloudTo achieve information processing functions required for AI learning,
it is necessary to provide LSI with optical interfaces that are high speed,large capacity, and power saving. Additionally, in achieving network
functions required for parallel processing during AI learning, high-speed,
high-port-count and low-power consumption optical switch technology
is crucial. Furthermore, the search for new computing architecture
following the end of Mooreʼs law and research into new arithmetic
operation method using optoelectronics technology will also become

2.3 Optical Transport Network Technology between Edge and CloudIn the age of AI and IoT, enormous amounts of information sensed
at the edge, including high-definition video data, will be transferred to
AI servers and data centers on the cloud side. As the number of IoT
Annual Technical Report2017 OITDA

12

Technological
Optoelectronics
Strategy
Industry
Development
Trendsimportant.
(3) Optical transport network technology between Edge andCloud
Expanding the bandwidth for optical transmission with multiplexing
technology and digital technology is necessary. Additionally, thecombination and integration of optical communication with 5G andother wireless networks both in hardware and software will become
important.
(4) Photoelectronic integration technology
As foundational technology to realize various optoelectronics
technologies and devices, photoelectronic integration technology, suchas silicon photonics, becomes increasingly important.
In the future, a fabless model in which design and production are
separated will be the standard for optical integrated circuits. Therefore,
it is crucial to develop the design environment, the test environment,
and the educational environment for photoelectronic integrated circuits
in an integrated manner.

13

Annual Technical Report2017 OITDA

Standardization
1. Introduction

Japan offered a new proposal on JIS C 6837 (all plastic multimodeoptical fibres). It was agreed to add it to the A4 category of IEC 607932-40. Japan became the project leader and the preparation of a draft
revision started.

Standardization has been one of OITDAʼs major activities since its
establishment, and has been promoted broadly across the optoelectronics
industry. OITDAʼs standardization efforts are mainly focused on the
optical transmission field, but they also include several fiber optics
application fields and lasers. Besides working for domestic
standardization (JIS, OITDA standards, and Technical papers), OITDA
is also working on international standardization such as IEC and ISO
through field-specific meetings in order to respond quickly to the fastchanging industrial structure.
Outlined below are the results and trends of OITDAʼs international
standardization activities at IEC TC 86 “Fibre optics” and TC 76 “Opticalradiation safety and laser equipment” and at ISO TC 172/SC 9 “Laserand electro-optical systems” in FY 2017, as well as OITDAʼs activities
in two international standardization projects commissioned by the
Ministry of Economy, Trade and Industry: “International standardization
on EMC characteristic evaluation, etc. of the high-speed in-vehicle
Ethernet physical layer” and “International standardization on reliability,
etc. of narrow-pitch multi-fiber optic connectors.”

2.2.2 Cables (IEC TC 86/SC 86A/WG 3)
At the IEC SC 86A/WG 3 Vladivostok meeting in Russia, Japanproposed that the in-conduit freezing test method be added to the cable
external freezing test methods in IEC 60794-1-22 (Generic specification- Basic optical cable test procedures - Environmental test methods).
After additional reporting on the results of experiments, the meeting
agreed to add the proposed test method, and move it forward to the IEC
60794-1-215 NWP stage. Regarding IEC 60794-1-23 (Genericspecification - Basic optical cable test procedures - Cable element test
methods), the FDIS was not approved as a result of negative voting thatJapan called for. Japan explained the background and it was agreed toreturn it to the CD stage for discussion
2.3	Fibre Optic Interconnecting Devices and Passive Components (IEC TC
86/SC 86B)
IEC/TC 86/SC 86B, which has been working on the standardizationof fibre optic interconnecting devices and passive components, held
meetings in Kona, U.S.A. in April and Vladivostok, Russia in October2017.

2. Fibre Optics (IEC TC 86)
IEC/TC 86 held its annual meeting for FY 2017 in conjunction with
the IEC 81st General Meeting in Vladivostok, which was held in October
2017. Each working group held an interim meeting as needed in spring.
2.1 Fibre Optic Test Equipment Calibration (IEC TC 86/WG 4)
IEC/TC 86/WG 4 (Fibre optic test equipment calibration) under IEC/
TC 86 held the Vladivostok meeting in Russia in October 2017.
The Vladivostok meeting discussed comments from the respective
countries on the 2nd CD (committee draft), which was circulated inadvance, for the standardization of calibration of wavelength/opticalfrequency measurement instruments (IEC 62129-3 Ed.1.0). Regarding
the document, an NP (new work item proposal) from Japan was agreed
at the Kwangju meeting in 2015, and Japan has been serving as the
project leader. The policy for handling comments from the respective
countries on the 2nd CD was discussed at the Optical Measurement
Instruments Standardization Meeting, approved at the IEC TC 86
domestic committee, and then submitted to the Vladivostok meeting,where it was decided to modify the 2nd CD based on the commentsfrom the respective countries and prepare a CDV (committee draft forvote) for the official CDV publication in spring 2018. Regarding therevision of existing documents, the meeting discussed revising calibrationof fibre-optic power meters (IEC 61315 Ed.3.0) and agreed to publish
a CDV document. With regard to calibration of optical fibre geometry
test sets, it was reported that an IS (international standard) was publishedin July 2017.

2.3.1	Standard Tests and Measurement Methods for Fibre Optic
Interconnecting Devices and Passive Components (IEC TC 86/SC
86B/WG 4)
The IEC 61300 series provides standards related to tests andmeasurement methods (WG 4), and specifies tests and measurement
methods for fibre optic interconnecting devices and passive components.
Regarding measurement methods for fibre optic passive components,
revised versions of the documents IEC 61300-3-7 (Examinations andmeasurements - Wavelength dependence of attenuation and return lossof single mode components) and IEC 61300-3-21 (Examinations andmeasurements - Switching time) are under discussion.
It was also proposed that a new standard for measurement of switching
reproducibility be established under the IEC 61300 series.
2.3.2	Standards and Specifications for Fibre Optic Interconnecting Devices
and Related Components (IEC TC 86/SC 86B/WG 6)
With regard to fibre optic interconnecting devices (WG 6), IEC 617544-1 related to simplified receptacle (F16 type) and IEC 61754-6-1 related
to simplified receptacle (F17 type) were replaced with IEC 61754-4-100
and IEC 61754-6-100, respectively, to avoid the overlap between
component numbers.
An international standard related to interfaces of F13-type fibre optic
interconnecting devices, IEC 61754-7 used to specify fibre optic
interconnecting devices with one row or two rows of fibre. With theaddition of provisions on interfaces with fibre optic transceivers, IEC
61754-7-1, Ed.1 about interfaces for type MPO family of connectors
with one row of fibre and IEC 61754-7-2, Ed.1 about the standard
interfaces for type MPO family of connectors with two rows of fibre
were published.

2.2 Fibres and Cables (IEC TC 86/SC 86A)
IEC/TC 86/SC 86A, which has been working on the standardizationof optical fibres and cables, held a meeting in Vladivostok, Russia in
October 2017.
2.2.1 Fibres and Associated Measuring Methods (IEC TC 86/SC 86A/WG 1)
At the IEC SC 86A/WG 1 Vladivostok meeting in Russia, Japanproposed, with regard to the issue of making the provision on loss of
cabling in IEC 60793-2-50 (Product specifications - Sectional
specification for class B single-mode fibres) conform to ITU-T, that anote on the increase of loss due to cabling be added. Regarding IEC
60793-2-40 (Product specifications - Sectional specification for category
A4 multimode fibres), changing “NA” in the automobile application
category was proposed and agreement was reached to move toward CD
preparation.
Annual Technical Report2017 OITDA

2.3.3	Standards and Specifications for Fibre Optic Passive Components(IEC TC 86/SC 86B/WG 7)
As of February 2018, documents related to fibre optic passive
components (WG 7) under circulation are: IEC 63032 (Fibre optic
tuneable bandpass filters - Generic specification), IEC 60869-1 (Fibre
optic passive power control devices: ED5), IEC 61753-1 (Performancestandard: ED2), and IEC 62005-9-4 (High power qualification of passive

14

Standardizationnext meeting.
・ IEC 61290-1-2 Ed.2 (Power and gain parameters - Electrical spectrum
analyzer method): The project leader proposed a five-yearreconfirmation, but Japan pointed out the need to consider consistency
with the umbrella document. SD discussion will be held at the next
meeting.
・Publication of IEC/TR 61290-4-3 Ed.2 (Power transient parameters- Single channel optical amplifiers in output power control):Discussion on the CDV comments was completed. After circulating
the RVC (result of voting on CDV), the FDIS (final draft international
standard) was circulated.
・IEC 61290-10-5 Ed.1 (Multichannel parameters - Distributed Raman
amplifier gain and noise figure): SD discussion was held and a threeyear extension was decided.
・IEC 61291-4 Ed.3 (Multichannel applications - Performance
specification template): SD discussion was held and a three-year
extension was decided.
・Revision of IEC/TR 61292-3 Ed.2 (Technical report - Opticalamplifiers - Classification, characteristics and applications): Japan
insisted on taking charge of revision, and it was agreed. A revision
proposal that deletes EWDA, which is not put into practical use, fromthe existing document, moves PDFA and TDFA to the Annex, andadds array amplifiers and spatial multiplexing amplifiers will be
explained at the next meeting.
・Revision of IEC/TR 61292-4 Ed.3 (Technical report - Opticalamplifiers - Maximum permissible optical power for the damage-freeand safe use of optical amplifiers): It was proposed that the document
be revised by reflecting the revision of IEC 60825-1 on safety of laser
products, but a three-year extension of the existing documentʼs SD(stability date) was agreed with the goal of revising the document
after the planned revision of IEC 60825-2 is completed.
・Publication of IEC/TR 61292-8 Ed.1 (Technical report - Optical
Amplifiers - High-power amplifiers): Discussion on CD comments
was completed. To move forward to the 2nd CD or DTR (draft
technical report).
・ Revision of IEC/TR 61292-9 Ed.2 (Optical amplifiers - Semiconductor
optical amplifiers (SOAs)): DTR circulation and discussion oncomments were completed. To be published in December 2017.
Discussions on new documents on ROPA (remote optically pumped
amplifier), optical amplifiers for spatial multiplexing optical fibretransmission and other new optical amplification technologies, wideband optical amplifier (C+L-band, O-band), pluggable amplifier (XFP,
CFP), burst-mode EDFA, etc. started. There is a policy to prepare adocument on ROPA.

optical components for environmental category C).
For these documents, Japan provided support, which included revising
IEC 60869-1 (Fibre optic passive power control devices - Genericspecification) and providing comments on circulation document IEC
63032 (Fibre optic tuneable bandpass filters - Generic specification).
Per the request of IEC, Japan also conducted a market survey on tunablebandpass filters.
2.4 Fibre Optic Systems and Active Devices (IEC TC 86/SC 86C)
IEC/TC 86/SC 86C, which has worked on standardization of fibre
optic systems and active devices, held meetings in San Luis Obispo,
U.S.A. in March and in Vladivostok, Russia in October 2017.
2.4.1 Fibre Optic Communications Systems and Subsystems (IEC TC 86/
SC 86C/WG 1)
IEC/TC 86/SC 86C/WG 1, which deals with standardization of thephysical layer of fibre optic communications systems and subsystems,
is establishing fibre optic system design guidelines and standardizing
test methods for fibre optic systems (systems in general, digital systems,
fibre optic cable facilities and optical links). To more aggressively put
forward proposals on technologies in which Japan is leading to IEC,
Japan participated in two standardization discussions of IEC/TC 86/SC
86C/WG 1, one in San Luis Obispo and the other in Vladivostok. Fibre
optic communication subsystems - Part 1: Generic specification (IEC61281-1), which was revised with Japan serving as the project leader,
was published after the handling of comments received during the CDV
circulation.
2.4.2 Fibre Optic Sensors (IEC TC 86/SC 86C/WG 2)(1) Discussions at IEC meetings
IEC/TC 86/SC 86C/WG 2 is working on standardization documents
for fibre optic sensors that are expected to be introduced aggressively.
This fiscal year, meetings were held in San Luis Obispo, U.S.A. in Marchand Vladivostok, Russia to revise IEC 61757 (Fibre optic sensors:
Generic specification) and fully discuss the IEC document proposed by
Japan (IEC 61757-4-3 Fibre optic sensors Part4-2: Optical current
sensors based on the polarimetric method). European countries and theUnited States are about to submit NPs (IEC 61757-1-2 Fibre optic sensors
Part1-2 Strain sensing -Distributed sensing and IEC 61757-3-2 Fibre
optic sensors Part3-2: Acoustic sensing using distributed sensing).
(2) Status of optical current sensors (61757-4-3)
Regarding IEC 61757-4-3 (Fibre optic sensors Part4-2: Optical current
sensors based on the polarimetric method), which Japan proposed to
TC 86/SC 86C/WG 2, IEC/TC 38 (Instrument transformers) pointed
out an overlap of contents. In response, it was decided to insist that TC
86 has priority because TC 38 published IEC 60044-8 (which refers tocurrent sensors in its scope) in 2002 while TC 86 published IEC 617571 (which refers to fibre optic current sensors in its scope) earlier, in
1998. A liaison will be established to continue discussions between thetwo parties. To wait until the issue is solved with TC 38, discussion
continues by postponing circulation of IEC 61757-4-3 CD to June 2,
2018, one year behind schedule.

2.4.4	Fibre Optic Active Components and Devices (IEC TC 86/SC 86C/WG 4)
SC 86C/WG 4 deals with fibre optic active components and devices
in general, excluding optical fibre amplifiers. At the Vladivostok meetingin October 2017, it was decided to move the PIC (photonic integrated
circuit), which Japan proposed in 2015, forward to CDV circulation on
package interface standard and to CD circulation for performancestandard. Preparations for standardization have been steadily made. It
is anticipated to lead PIC-related standardization globally after 2018.
The SOA gain ripple measurement method, on which WG 4 and WG
3 have held coordinated discussions at the IEC/SC 86C domestic
committee since FY 2015, was proposed and agreed at the IEC/SC 86C/
WG 3-WG 4 joint meeting held in Frankfurt in October 2016. Documents
are being prepared to propose a new measurement method within FY
2018. Activities to make an international standard, including ensuringconsistency with conventional methods and clarifying the scope of
application, will be made through cooperation with related parties.

2.4.3 Optical Amplifiers (IEC TC 86/SC 86C/WG 3)
IEC/SC 86C/WG 3 led the survey on international standardization
related to optical amplifiers, while working with the IEC/TC 86 domestic
committee to review the following at the IEC/SC 86C/WG 3 meetings
in San Luis Obispo and Vladivostok:
・ Revision of IEC 61290-1-1 Ed.4 (Power and gain parameters - Optical
spectrum analyzer method) with the addition of SOA gain ripple
evaluation items: Proposed and discussed a CD about adding SOA
gain ripple measurement. A modified draft will be discussed at the15

Annual Technical Report2017 OITDA2.4.5 Dynamic Modules and Devices (IEC TC 86/SC 86C/WG 5)
IEC standard documents reviewed this fiscal year include: Dynamic
modules - General and guidance (IEC 62343), Performance standards- General conditions (IEC 62343-1), Reliability qualification test
template (IEC 62343-2-1), Performance specification templates Wavelength selective switches (WSS) (IEC 62343-3-3), Performance
specification templates – Multicast optical switches (MCOS) (IEC62343-3-4), and Test methods - 1 x N fixed-grid WSS - Dynamic
crosstalk measurement (IEC 62343-5-2).
At the IEC San Luis Obispo meeting in March 2017, documents on
MCOS performance specification templates and WSS dynamic crosstalkmeasurement test methods were discussed and a policy for preparing
general conditions documents on reliability qualification test template
and performance standards were discussed.
At the IEC Vladivostok meeting in October 2017, discussions on two
documents continued while Japan presented an NP on the reliability
qualification test template, for which agreement to move forward to NP
circulation was achieved. With the goal of aligning the content of the
dynamic module reliability qualification test with recent industry survey
results, it was proposed to revise the Annex of Performance standards- General conditions. The need for revision was acknowledged and it
was agreed to move the modified draft forward to CD circulation.

Regarding the revision of IEC/TR 60825-8 Ed.3, approval was received
to start a project at the Milan meeting and WG 4 is reviewing the draft.
Discussion on ISO/TR 22463, which is related to eye damage risk
associated with treatment of the upper eyelid using laser or intense
pulsed light (IPL) source equipment, was carried out jointly with IEC/
TC 76/JWG 12 (see 3.10).
3.4	Safety of Fibre and Free Space Optical Communications Systems (IECTC 76/WG 5)
Japan, as the project leader of IEC 60825-2 and IEC 60825-12, isleading revision efforts.
RVC circulation of IEC 60825-12 (Safety of free space opticalcommunication systems used for transmission of information) Ed.2 wasconducted, and the draft for FDIS circulation was sent to the TC 76
secretary. WG 5 is discussing the content of the supplement to Ed.2.
A policy to circulate the CD of IEC 60825-2 (Safety of optical fibre
communication systems) Ed.4 and discuss comments from the respective
countries at the Milan meeting for the 2nd CD circulation was finalized.
The results were circulated as a CC (compilation of comments on CD).
The proposal to set the measurement condition 2 (magnifying lensobservation condition) to the measurement distance of 14 mm andaperture stop diameter of 3.5 mm in the full spectrum was approved.
The proposal to set the MPE (of the skin) upper limit to C7 (where
wavelength dependence is exponential) was still under discussion at
WG 5 to reach consensus. Meanwhile, regarding the current version of
IEC 60825-2 (Ed.3), ISH2 FDIS circulation to confirm that the upper
limit of C7 is 8 started. With regard to the safety of laser products inhigh-power optical fibre communication systems, JWG (joint working
group) 10 was established under IEC/TC 86 to promote a cooperative
relationship with TC 86.

3. Optical Radiation Safety and Laser Equipment (IEC TC 76)
This fiscal year, IEC/TC 76 held a meeting in Milan, Italy in October.
Regarding JWG, related TCs other than TC 76 are discussing documents.
The following outlines the status of discussions on standard documents
at each WG, primarily at the Milan meeting.
3.1 Optical Radiation Safety (IEC TC 76/WG 1)
The policy for IEC 60825-1 (Safety of laser products - Equipmentclassification and requirements) Ed.3, which was published in 2014,
was to publish an ISH (interpretation sheet) instead of reflecting technicalcomments received at the CDV stage. This fiscal year, after FDIS
circulation of two documents, ISH1 (radiation of multiple wavelengths,
radiation from extended sources; non-uniform, non-circular or multiple
apparent sources: related to 4.3) and ISH2 (conventional lamp
replacement: related to 4.4), the two ISHs were published in December.
To supplement IEC 60825-1 Ed.3, a project was launched to work on
virtual protective housing (where sensors detect human access to thebeam to reduce exposure risks) and on moving platform (where theposition of the measurement aperture surrounding a mobile object,including laser equipment, changes depending on the speed).

3.5 High Power Lasers (IEC TC 76/WG 7)
Comments received during CDV circulation of IEC 60825-4 (Safetyof laser products - Laser guards) Ed.3 were discussed, and many technicalcomments made by Japan on Annex D were adopted. After unifying thestyle of the CDV, an FDIS will be circulated.
With regard to IEC 60825-18 (Guided beam delivery systems), thenumber of experts did not reach the specified number at the time of lastyearʼs NP circulation, so NP circulation was carried out again this fiscal
year. A total of five experts got together to start a project.
3.6 Development and Maintenance of Basic Standards (IEC TC 76/WG 8)
The revised draft of IEC/TR 60825-3 (Guidance for laser displays
and shows) Ed.3 was discussed at the Milan meeting. It was decided
that the applicable scope of this standard be class 3B or above outside
the scope of IEC 60825-1 4.4. The draft will be edited by taking into
account the comments received at the meeting and a CD will becirculated.
The DTR of IEC/TR 60825-5 (Manufacturerʼs checklist for IEC
60825-1) Ed.3 was circulated, and comments were reviewed at the Milan
meeting. There were requests to distribute IEC/TR 60825-5, which is achecklist, as an editable file. Whether such a file can be distributed or
not is being confirmed with the IEC Central Office.
The CD draft of IEC/TR 60825-14 (Safety of laser products - A userʼsguide) was reviewed at the Milan meeting. Its consistency with IEC
60825-1 Ed.3 ISH1 was confirmed and appropriate information onprotective eyewear from the ISO draft was added. A CD reflecting thecomments will be circulated.
In relation to the EU Directive issued in February 2014 on the safety
requirements for consumer laser products, safety standards for consumer
laser products that were to be published by the European Committee
for Electrotechnical Standardization (CENELEC) was introduced. The

3.2 Laser Radiation Measurement (IEC TC 76/WG 3)
Discussion on action items continued, with the goal of revising IEC/
TR 60825-13 Ed.2 (Measurements for classification of laser products)
in FY 2018. WG 3 aims to complete a draft that includes new items,
such as a policy on failure analysis, for RR (review report) and CD
circulation.
3.3 Safety of Medical Laser Equipment (IEC TC 76/WG 4)
Regarding the Ed.4 Project, which aims to add requirements for class
1C to IEC 60601-2-22 (Particular requirements for basic safety andessential performance of surgical, cosmetic, therapeutic and diagnostic
laser equipment), CDV was circulated. To expedite IS, it was decided
to review Japanʼs proposal that interlock mechanism evaluation methods
be modified when preparing Ed.5.
IEC/TR 60825-8 (Guidelines for the safe use of laser beams onhumans) has a lot in common with IEC/TR 62471-3 (Guidelines for thesafe use of intense pulsed light source equipment on humans), andtherefore the latter will be abolished and integrated into the former.
Annual Technical Report2017 OITDA

16

Standardization
RC categorization were decided: C for “continuous–0.1 s,” P for “under
0.1 s–10 µs or higher,” Q for “under 10 µs–1 ns or higher,” and U for“under 1 ns” (pulse width in parentheses). As resistance data of protective
eyewear for type U laser was not sufficient, type U laser testing would
not be included in the requirements but the test results would be compiled
as an annex (reference). In relation to that, round robin tests will be
conducted, but mutual comparison is unlikely to be easy because ofdifferences in specifications between organizations.
The DTR of ISO/TR 22463 (Patient/client eye protectors for protection
against laser/intense light source (ILS) equipment used on humans forcosmetic and medical applications - Guidance for selection and use)
was discussed at the Milan meeting. The 2nd DTR reflecting thediscussion will be circulated.

draft European standard allows consumer laser products of Class 2 or
below, excluding toys for children, while requiring a manufacturersʼ risk
assessment for Classes 1M, 2M, and 3R. The safety standards were tobe published by December 2017, but publication is behind schedule.
3.7 Non Coherent Sources (IEC TC 76/WG 9)
The 3rd CD of IEC/TR 62471-4 (Photobiological safety of lamps andlamp systems: measuring methods) Ed.1 was circulated, but the content
overlap with IEC 62471-1 was not resolved. According to the convenorʼs
judgment that the IEC 62471-1 side should determine the division of
measurement-related contents, discussion on IEC/TR 62471-4 wassuspended. IEC 62471-6 (Photobiological safety of ultraviolet lamp
products), which was subject to NP again due to a shortage of experts,
was approved and the CD draft was discussed at the Milan meeting.
Japan pointed out that a wide range of UV lamp products were to becovered but not defined. The lower limit of the applicable scope ofwavelength was changed from 180 nm to 200 nm.

4. Laser and Electro-Optical Systems (ISO/TC 172/SC 9)
This meeting compiles domestic opinions and reflects Japanʼs
proposals on the international standards proposed by ISO/TC 172/SC
9, which is in charge of preparing international standards on lasers.
This fiscal year, the domestic meeting, with a new additional member,
was held in August 2017 and in March 2018 to deliberate on international
meeting strategy.
For three days from September 20 to 22, 2017, an international meeting
was held at the National Institute of Standards and Technology (NIST)
in Boulder, U.S.A., with a total of 21 participants from four countries:
four from France, seven from Germany, three from the U.S.A., and sevenfrom Japan. Discussions and decisions at the international meeting wereas follows:

3.8 IEC 62471-1 Special Joint TC (JTC 5)
Since April 2013, CIE Div.2 and Div.6 and the joint TC of IEC/TC
34 and TC 76 (JTC 5) have been revising CIE S009/IEC 62471(Photobiological safety of lamps and lamp systems) for republication
as CIE S009/IEC 62471-1. This fiscal year, the CD was discussed at
the Jeju meeting in October and the Milan meeting in November.
The Jeju meeting discussed the policy of removing general lighting
service (GLS) from the applicable scope of IEC 62471-1 to be coveredin the revised version of IEC 62471-2, but the Milan meeting decided
that there should be no specification to “exclude GLS” and thatdifferentiation should be made under the measurement conditions.
Regarding GLS, coordination with IEC/TC 34 is also needed.
While discussions on measurement distance continued, several experts
have different intentions with regard to separating the 1 m condition
and 200 mm condition, etc., so that discussion remained chaotic.
An agreement is being made to follow the discussion and voting
procedures in line with CIE operational rules and to make a proposal
to IEC/TC 76 at the FDIS stage.

4.1 Plenary
・The Chairman (Germany) proposed to change the name of ISO/TC
172/SC 9 from Electro-optical systems to Laser and electro-opticalsystems. It was decided to seek approval of TC 172.
・WG 7ʼs convenor (Japan), who served in the role for years, resigned
and a new convenor (Japan) was selected.
・One person from Germany and one person from Japan were selected
as liaisons for IEC/TC 62/SC 62D (Electromedical equipment).
・One person from Japan was selected as a liaison for IEC/TC 47/SC
47E (Discrete semiconductor devices).
・The next meeting in 2018 will be held in France. The meeting in 2019and meeting in 2020 will be held in China and the Americas,
respectively.

3.9	Safety of Lasers and Laser Equipment in an Industrial Materials
Processing Environment (IEC TC 76/JWG 10)
JWG 10, as a JWG with ISO/TC 172/SC 9/JWG 3, is discussing
standards of the ISO/IEC 11553 series.
With regard to ISO/IEC 11553-1 (Safety of machinery - Laser
processing machines – Part 1: General safety requirements) and ISO/IEC 11553-2 (Part 2: Safety requirements for hand-held laser processing
devices), the machinery safety consultant of Comité Européen deNormalisation (CEN) provided many technical comments on the Ed.2
CDV circulation, with the result that the convenor and the project leader
had an ad hoc meeting. The agreed draft was discussed at the Milan
meeting, and the FDIS reflecting the discussion will be circulated.
Currently, however, there is no project leader familiar with hand-heldlaser processing devices regarding ISO/IEC 11553-2.

4.2 Terminology and Test Methods for Lasers (ISO/TC 172/ SC 9 WG 1)
・ISO/PWI 22247 (Effective numerical aperture of laser-lenses in thefield of laser beam forming – Definition and verification procedure):
It was decided to work on it as an NP and a project leader (PL) was
selected.
・ISO/CD 19986 (Lasers and laser-related equipment - Test method forangle resolved scattering): It was decided to circulate a CD (committee
draft) after a web meeting. As the draft tended to explain specifications
regarding IOF (German) equipment, it was decided to change thedraft to provide a more general description.
・ISO/AW21254-1, -2, and -3 (Laser and laser-related equipment – Test
methods for laser-induced damage threshold Parts 1, 2, and 3): A
person from Germany was selected as the project leader. How torevise Part 1 and 2 was discussed. Regarding raster scan, in particular,
it was decided to collect the respective companiesʼ procedures in orderto summarize the procedures. The project leader of Part 3 proposed
evaluation procedures and it was decided to conduct a round robintest in the United States following the proposed procedures.
・ISO/WD 11551 (Optical and Photonics – Lasers and laser-related
equipment – Test method for absorptance of optical laser components):

3.10 Eye and Face Protection against Laser Radiation (IEC TC 76/JWG 12)
Activities are underway as the JWG with ISO/TC 94/SC 6/JWG 1.
A review is being conducted at the ISO meeting, and web meetings areheld as appropriate. The documents in the WD stage are circulated basedon the ISO numbers.
Regarding ISO/IEC 19818 (Eye and face protection - Protection
against laser radiation - requirements and test methods) Ed.1, the WD(N76) was discussed at the Milan meeting. As the laser resistance class(RC) can be confused with laser classification, it was decided to readRC as “laser resistance category.” Four symbols and divisions used for

17

Annual Technical Report2017 OITDAA test report was introduced. It was decided to consider standardization
within a limited scope and work on a WD (working draft).
・ISO/DIS 17915 (Optics and photonics – Measurement method ofsemiconductor laser for sensing): Transition from TS (technicalspecifications) to IS (international standard) was approved. It was
decided to discuss comments received from the respective countries
and move on to the FDIS (final draft international standard) stage by
the end of the year.

optic harnesses while leading the development of optical communication
standards
5.2 Activities and results of this fiscal year
The following (1) through (4) were conducted as international
standardization activities.
(1) Developing IEC and ISO standards
Worked with standardization organizations and related organizations
to prepare drafts and provide proposals on: (1) 1 Gbps in-vehicle optical
Ethernet communication standards (ISO 21111-3), (2) 1 Gbps in-vehicle
optical Ethernet component standards (ISO 21111-4), (3) multi-giga
in-vehicle Ethernet (ISO 21111-X), (4) EMC evaluation of transceivers- Ethernet transceivers (IEC 62228-5), (5) Fibre optic interconnecting
devices and passive components - Basic test and measurement procedures- General and guidance (IEC 61300-1), and (6) Optical fibres - Productspecifications - Sectional specification for category A4 multimode fibres(IEC 60793-2-40).
Table 3 summarizes the progress made in this fiscal year and thefuture schedule.
(2) EMC-based prototyping and operation verification of invehicle optical communication systems
Prototyped and verified communication chips, communication boards,
and other components to lead the development of in-vehicle Ethernet
standards.
(3) Building in-vehicle LAN simulators and systems
Built an optical communication simulator implementing the developed
standards to facilitate the dissemination of the standards andcommunication systems. Reflected the MPD communication model thatshould be developed to build the simulator in the standards. Demonstrated
and verified EMC resistance and effectiveness of high-speed sensor
networks by using actual vehicles.
(4) Dissemination activities at IEEE, etc.
Participated in IEEEʼs standardization activities related to in-vehicle
Ethernet, and promoted technical discussions and advocated the standards
at academic conferences and standardization meetings attended by invehicle communication engineers from carmakers.

4.3 Laser Systems for Medical Applications (ISO/TC 172/ SC 9 WG 4)・ISO/DIS 11990 (Lasers and laser-related equipment – Determinationof laser resistance of tracheal tube and tracheal cuffs): It was decided
to move forward to the FDIS stage.
・ISO/PWI 22248 (Laser and laser-related equipment – Test methods
for laser-induced damage threshold – Classification of medical laserdelivery and application systems): Based on the discussion at a joint
meeting with WG 1, it was decided to move forward to the NP stage.
4.4 Electro-Optical Systems other than Lasers (ISO/TC 172/SC 9 WG 7)(1) ISO/AWI 11807-1 and -2 (Integrated optics – Vocabulary – Part 1:
Basic terms and symbols) (Part 2: Terms used in classification), ISO/AWI 14881 (Integrated optics – Interfaces – Parameters relevant tocoupling properties)
・The secretary introduced and demonstrated the ISO/IEC terminology
search system.
・It was found that the use of the system can facilitate development
efforts, with the result that the information was given to the groupmembers.
・Because of a correspondence to the IEC/TC 86 SC terminology, it
was decided to coordinate with the IEC side by holding a meetingwith IEC in April 2018 in Milan (Italy).
・ It was decided to move forward to the WD stage by the end of January
2018 and to the CD stage by the end of June 2018, but in fact thework is behind schedule.
・A working group meeting was held in Mishima in January 2018 toprepare a WD.

6.	International Standardization on Reliability of NarrowPitch Multi-Fiber Optic Connectors (NP Pro)

4.5 ISO Standards Voted On and PublishedThis fiscal year, seven projects were subject to voting (DIS [draft
international standard]: 5, FDIS: 1, CIB [committee internal balloting]:1), and the following two were published as ISO standards.
・ISO 11554:2017 (Optics and photonics -- Lasers and laser-related
equipment -- Test methods for laser beam power, energy and temporalcharacteristics)
・ISO/TR 20811:2017 (Optics and photonics -- Lasers and laser-related
equipment -- Laser-induced molecular contamination testing)

6.1 Objective
With the advance of cloud computing in recent years, the volume ofdata processed and the communication volume at data centers are
increasing, which poses an issue around controlling power consumption.
To address the issue, high-density optical interconnect is being applied
to servers and routers at data centers around the globe. To bring abouthigh-density optical interconnect, this project works on the international
standardization of narrow-pitch multi-fiber optic connectors to which
optical fibers that are narrower than conventional optical fibers areapplied. With the goal of registering an NP (New work item Preposal)
by FY 2019, the project will propose one draft international standard
NP on narrow-pitch multi-fiber optic connectors to IEC/TC 86.

5.	International Standardization on Evaluation of EMC andrelated Characteristics of High-Speed In-Vehicle Ethernet
Physical Layer (V Pro 3)
5.1 Objective
Increasing the capacity of in-vehicle communications is expected foradvanced driving support systems and automated driving. In-vehicle
Ethernet standards with an enhanced real-time property and fail-safe
property are required to be highly reliable for the communication
backbone connecting backbone units of self-driving vehicles and forsensor networks. Particularly with regard to EMC, reliable in-vehiclecommunication systems will become possible by combining
communication boards with superior EMC characteristics and fiber
optic harnesses that do not generate and are not subject to electromagnetic
noise. This project proposes coordination between EMC standards forcommunication chips and communication boards and standards for fiber
Annual Technical Report2017 OITDA

6.2 Progress in this fiscal year
In this fiscal year, as the first year of the three-year plan, conducted
technical review based on experiments on insertion loss of prototype
connectors for international standardization of narrow-pitch multi-fiber
optic connectors, and proposed the content of the new standard to IEC/
TC 86 in October 2017. Progress made in this fiscal year is as follows:(1) Established an international standardization proposal committee on
reliability of narrow-pitch multi-fiber optic connectors in order tostandardize draft specifications of narrow-pitch multi-fiber optic
connectors with the same outer dimension as MT ferrule, guide pin

18Standardization
Table 3Standard No.

Proposed to

ISO 21111-3

ISO/TC 22/
SC 31/WG 3

ISO 21111-4

Progress of international standardization

Ultimate goal(–FY 2019)

Results in FY 2017

Future schedule

Document
publication

Division of the document at the WD
preparation stage was decided. A
reconstructed WD was prepared, andregistration of the CD was approved.

Discuss the CD to prepare a DIS by
the end of FY 2018.

ISO/TC 22/
SC 31/WG 10

Document
publication

Document development activity was
carried out to move to the CD voting
process.

Summarize the CD voting results,
hold F2F meeting in May 2018, andprepare DIS in July 2018.

ISO 21111-X

ISO/TC 22/
SC 32/WG 10

Committee draft
registration
approval

Transmission characteristics andmode characteristics of multi-mode
optical fibers were evaluated andissues related to in-vehicle
installation were confirmed.

Confirm optical harness
characteristics for the in-vehicle
environment, and submit new work
item proposals.

IEC 62228-5

IEC/TC 47/
SC 47A/WG 9

Circulation ofcommittee draftfor vote

Questions were posed and a survey
was conducted on Germany’s noticeof an NP. The proposal was provided
in January 2018.

Review the NP from Germany in April
2018. Continue review of the proposal
to reflect Japan’s opinion.

IEC 61300-1

IEC/TC 86/ SC
86B/WG 4

Registration ofdraft
international
standard

As the draft revision of 61300-1 wasmerged into 61300-3-53, it was
decided to reflect the draft revision in
61300-3-53. The revision wasapproved at the WG 4 meeting.

Submit a draft to the SC 86B interim
meeting in April 2018. After NP
approval, start official revision efforts.

IEC 60793-2-40

IEC/TC 86/
SC 86A/WG 1

Circulation ofcommittee draftfor vote

A revision proposal was presented.
Approval was given for the proposal
to be integrated with the addition of aseparately proposed new subcategory
into a task.

Prepare a CD and submit it to be
discussed at the WG 1 meeting in
April 2018.

IEEE802.3
Multi-Giga
Automotive
Ethernet PHY
Study Group

Establishing aforum to discuss
multi-giga
in-vehicle
optical Ethernet
standard

In response to the rejection of themulti-giga in-vehicle optical Ethernet
standard at the meeting in July,
information collection and lobbying
activities were continued with a view
to submitting a new proposal in thenext fiscal year.

Provide a CFI proposal on the 10-G
in-vehicle Ethernet standard at a
meeting in March 2019.

IEEE 802.3ch(adding optical fiber
to the scope)diameter of 0.55 mm, optical fiber pitch of 125 µm, and up to 32
fibers (1 line).
(2) At the IEC/TC 86 presentation session and TC 86 FOCI (Fibre Optic
Common Interest), held on October 8 in Vladivostok, made apresentation on the direction of and need for developing narrow-pitch
optical connectors and proposed that standardization efforts bedivided between SC 86A, SC 86B, and JWG 9 in the future. The
proposal was discussed.
(3) Simulated random insertion loss by using single mode optical fiberwith outer diameter of 80 µm and 24-fiber narrow-pitch ferrule, andreviewed the relationship between ferrule accuracy and insertion
loss of narrow-pitch multi-fiber optic connectors. Conducted
technical review based on experiments on insertion loss of prototype
connectors.
(4) Carried out discussions on standardization of narrow-pitch multifiber optic connectors at the IEC SM and MM Optical Interface Task
Group Meeting, and conducted a technical survey on opticalinterconnect at the international academic conference of SPIE
Photonics West to gain knowledge for future NP submission to IEC.

19

Annual Technical Report2017 OITDAEducational and Public Relations Activities
1.	FY 2017 Symposium on the Optoelectronics Industry andTechnology

photonics transceiver applicable to AI/IoT, and the future vision ofJapanʼs optoelectronics industry and technology was actively discussed.

The FY 2017 Symposium on the Optoelectronics Industry andTechnology was held at the Rihga Royal Hotel Tokyo on Wednesday,
February 7, 2018. The event was jointly sponsored by OITDA and the
Photonics Electronics Technology Research Association (PETRA), withsupport from the Ministry of Economy, Trade and Industry.
While there has been rapid progress in the utilization of AI, IoT, andBig Data in recent years, the development of optoelectronics technology
is expected to drive innovation that will lead Japanese industry andsociety forward. Optoelectronics technology is also predicted to provide
fundamental support to the coming AI, IoT, and Big Data society.
The symposium attracted around 300 participants. Under the themeof “Photonics Technologies Underpinning the AI/IoT Era”, experts fromvarious fields gave presentations on AI-oriented supercomputers,machine learning platforms, “trillion IoT,” the strategy for photonics
technology for the AI/IoT era, and development of a compact silicon

Table 4

2. InterOpto 2017
InterOpto 2017, an international exhibition of cutting-edge
optoelectronics technology, was held at Makuhari Messe for three days
from Wednesday, October 4 to Friday, October 6, with support andcooperation from the Ministry of Economy, Trade and Industry andmany other organizations.
The event this year was held concurrently with CEATEC JAPAN 2017as well as LED JAPAN 2017, BioOpto Japan 2017, LaserTech 2017,
and MEMS Sensing & Network System 2017, in an effort to showcase
all the latest technologies and products ranging from device components
to the hottest IoT, AI, and automotive applications together, so that
visitors could gather information more efficiently and effectively, while
opportunities for collaboration between exhibitors were dramaticallyincreased.
Covering a wide range of exhibition categories, including laser/lightsources, optical devices/modules, materials, optical equipment/
instruments, and services/software related to the optoelectronics industry,
InterOpto exhibited a broad range of technologies from optoelectronicsrelated materials to optical application systems.
InterOpto alone featured 106 booths set up by 86 exhibitors from inand outside Japan, including optoelectronics manufacturers and trading
companies. The total number of exhibitors and booths for the five
exhibitions excluding CEATEC was 269 and 292, respectively. As tickets
for each exhibition included admission to the others, many CEATEC
visitors dropped by the other exhibitions, with the bustling exhibition
halls holding several times as many visitors as last year.
A “Notable Optoelectronics Technology and Special Exhibit Zone”
was set up in the Exhibition Hall. In this zone, eight companies
recommended by the working groups of OITDAʼs Optoelectronics

FY 2017 Symposium on the Optoelectronics Industry and Technology

Opening Remarks

Mr. Yasuhisa Odani
President / Vice Chairman, OITDA

Guest Greeting

Mr. Tatsuji Narita
Director, IT Industry Division, Commerce and Information
Policy Bureau, METI

10:15 − 11:15

Keynote Speech:
Supercomputer TSUBAME3 and ABCI (AI-Based
Bridging Cloud Infrastructure), and Photonics
Technology for Them

Dr. Satoshi Matsuoka
Professor, Global Scientific Information and Computing
Center, Tokyo Institute of Technology

11:15 − 12:00

Googleʼs Easy to Use Machine Learning

Mr. Kazunori Sato
Staff Developer Advocate, Cloud Platform, Google

13:00 − 13:45

Trillion IoT, Edge Computing and Their Standardization

Dr. Taizo Kinoshita
Board of Directors, New Generation M2M Consortium

Photonics Technology Strategies for AI / IoT Era

Dr. Mitsuru Takenaka
Associate Professor, Department of Electrical Engineering
and Information Systems, The University of Tokyo

14:45 − 15:30“Optical I/O Core” Small Optical Transceiver and New
Optical Market

Mr. Tomoyuki Fujita
CEO, AIO Core Co., Ltd.

15:30 − 16:15

Integrated Photonics-Electronics Convergence
System Technology− Compact and Large Capacity Optical Interconnect
between CPUs

Dr. Shigeaki Sekiguchi
Photonics Electronics Technology Research Association(PETRA)

16:20 − 17:00

Award ceremony for the 33rd Kenjiro Sakurai Memorial Prize

17:00 − 19:00

Get-together

10:00 − 10:05
10:05 − 10:15

13:45 − 14:30

Annual Technical Report2017 OITDA

20

Educational and Public Relations Activities
Technology Trend Committee exhibited their technologies and products.
A Notable Optoelectronics Technology Seminar was also held for twodays from October 5 to 6 at the seminar site in the Exhibition Hall.
In the Seminar Room of the International Conference Hall, a special
lecture titled “Recent Advances and Applications of VCSEL Integrated
Photonics” was presented by Prof. Fumio Koyama from the Laboratory
for Future Interdisciplinary Research of Science and Technology at theTokyo Institute of Technology, and seminars on technological trends inseven optoelectronics technology fields were held on October 5. On
October 6, Mr. Toshimitsu Kawano of Beckoff Automation gave a special
talk titled “Industry 4.0: Introducing an Industrial IoT and Business
Model,” and seminars on optoelectronics industry trends in seven productfields and overview trends were presented. These seminars attracted
large audiences and stimulated exchanges of opinions among audience
members.

Awardees of the 33rd Kenjiro Sakurai Memorial Prize
Back row, from left: Dr. Nishi, Dr. Fujimoto, Dr. Kakizaki
Front row, from left: Mr. Takemasa, Dr. Sugawara, Dr. Mizoguchi, Prof. Watanabe

technology to form 10 nm self-assembled semiconductor quantum dots
in a multilayer configuration with high density and high uniformity. In
doing so, they achieved characteristics that had been expected fromquantum dot semiconductor lasers, such as low threshold current
characteristics, high temperature operation characteristics, and hightolerance to optical feedback, and promoted technological development
for the practical use and mass production of quantum dot lasers, which
has led to applications in a wide variety of areas, including 1.3 µm band
optical communications, light sources for optical interconnect, andsensing under high-temperature environments. The development,
practical use, and mass production of quantum dot lasers represent asignificant contribution by the optoelectronics industry to thedevelopment of an IoT society where everything is networked.
The award ceremony was held on February 7, 2018 following the FY
2017 Symposium on the Optoelectronics Industry and Technology. At
the ceremony, Prof. Yasuhiko Arakawa (The University of Tokyo) who
is the chairperson of the Kenjiro Sakurai Memorial Prize Committee,
reported on the selection process and results. This was followed by thepresentation of certificates, medals, and extra prizes to the awardees.

3. 33rd Kenjiro Sakurai Memorial Prize
The Kenjiro Sakurai prize was established as a memorial to the late
Dr. Kenjiro Sakurai, a former director of OITDA who played a majorrole in developing the optoelectronics industry. Its purpose is to promote
the technological development of the industry. The prize has been givenout 32 times to 24 individuals and 37 groups, for a total of 147 awardees.
This year, the Kenjiro Sakurai Memorial Prize was awarded to twogroups out of 14 applications for their pioneering achievements in the
optoelectronics industry and technology since 2007.
One prize was awarded to Dr. Hakaru Mizoguchi, Dr. Junichi Fujimoto,and Dr. Koji Kakizaki of Gigaphoton Inc. and Prof. Shuntaro Watanabeof the Tokyo University of Science for their “Development andimplementation of high power ArF excimer laser for semiconductor
lithography.” The other prize was awarded to Dr. Mitsuru Sugawara, Mr.
Keizo Takemasa, and Dr. Kenichi Nishi of QD Laser, Inc. for their“Development and practical use of high-temperature semiconductor
quantum dot lasers.”
Dr. Mizoguchi and his colleagues at Gigaphoton have worked on thedevelopment and implementation of light sources for semiconductor
lithography for many years. They achieved the worldʼs first injection
lock technology for deep ultraviolet light source lithography, andsucceeded in developing a high-power ArF excimer laser for
semiconductor lithography achieving the worldʼs top-level efficiency,
high output power, tunable output power, and high beam stability. The
technological development resulted in a number of wins, including
helping Gigaphoton attain a major market share for global excimer lasers
for semiconductor lithography, and significantly contributed to the global
development of semiconductor manufacturing and Japanʼs optoelectronics
industry.
Dr. Sugawara and his team at QD Laser have developed crystal growth21

Annual Technical Report2017 OITDASupporting Members(As of March 31, 2018)[Chemistry][Electronics & Electronic Appliances][Precision Instrument]

Fujifilm Corporation

Anritsu Corporation

Canon Inc.

Mitsubishi Chemical Corporation

Enplas Laboratories Inc.

Konica Minolta, Inc.

Nissan Chemical Industries, Ltd.

Fujitsu Limited

Nikon Corporation

Shin-Etsu Chemical Co., Ltd.

Hamamatsu Photonics K.K.

Olympus Corporation

Sumitomo Bakelite Co., Ltd.

Hirose Electric Co., Ltd.

Ricoh Company, Ltd.

Yamamoto Kogaku Co., Ltd.

Hitachi, Ltd.

Seiko Instruments Inc.

Honda Tsushin Kogyo Co., Ltd.

Seikoh Giken Co., Ltd.

[Glass & Ceramics]

Huawei Technologies Japan K.K.

Sigma Koki Co., Ltd.

Asahi Glass Co., Ltd.

Japan Aviation Electronics Industry, Ltd.

Suruga Seiki Co., Ltd.

Corning International K.K.

Kyocera Corporation

Topcon Corporation

Nippon Sheet Glass Co., Ltd.

Macom Japan Limited

Sumitomo Osaka Cement Co., Ltd.

Mitsubishi Electric Corporation[Commercial & Advertisement]

Technical Co., Ltd.

Murata Mfg. Co., Ltd.

Hakuto Co., Ltd.

Toyo Seikan Group Holdings, Ltd.

NEC Corporation

JTB Communication Design, Inc.

NTT Electronics Corporation

Marubun Corporation

Oclaro Japan, Inc.

The Optronics Co., Ltd.

[Electric Wire & Cable]
Fujikura Ltd.
Fujikura Dia Cable Ltd.
Furukawa Electric Co., Ltd.
Okano Electric Wire Co., Ltd.
Sumitomo Electric Industries, Ltd.
SWCC Showa Holdings Co., Ltd.

Oki Electric Industry Co., Ltd.
Panasonic Corporation
Pioneer Corporation
Rohm Co., Ltd.

[Electric Power]Central Research Institute ofElectric Power Industry

Santec Corporation
Sanwa Denki Kogyo Co., Ltd.
Sharp Corporation[Other Manufacturing]
Adamant Namiki Precision Jewel Co., Ltd.

Sony Corporation

Dai Nippon Printing Co., Ltd.

Taiyo Yuden Co., Ltd.
Toshiba Corporation

Iwasaki Electric Co., Ltd.
Optoquest Co., Ltd.

Tyco Electronics Japan G.K.
Ushio Inc.
Yamaichi Electronics Co., Ltd.
Yamamura Photonics Co., Ltd.
Yokogawa Electric Corporation[Others]
Granopt Ltd.
Institute for Laser Technology
Japan Optomechatronics Association
KDDI Research Inc.
Nippon Telegraph and Telephon
Corporation
NTT Advanced Technology Corporation
Photonics Electronics Technology

Annual Technical Report2017 OITDA

22

Research Association

1-20-10, Sekiguchi, Bunkyo, Tokyo, Japan, 112-0014
Phone: +81 3 5225 6431
URL: http://www.oitda.or.jp