DISCRETE SEMICONDUCTORSDATA SHEET

M3D744

PMEG1020EV
Ultra low VF MEGA Schottky barrier
rectifierProduct data sheet

2003 Jul 15

NXP Semiconductors

Product data sheet

Ultra low VF MEGA Schottky barrier
rectifier
FEATURES

PMEG1020EV
PINNING• Forward current: 2 APIN

• Reverse voltage: 10 V

1cathode• Ultra low forward voltage

2cathode• Ultra small plastic SMD package.

3

anode

DESCRIPTION

4

anode

APPLICATIONS

5cathode• Low voltage rectification

6cathode• High efficiency DC/DC conversion• Switch mode power supply• Inverse polarity protection• Low power consumption applications.
handbook, halfpage
654DESCRIPTION
1, 25, 6Planar Maximum Efficiency General Application (MEGA)
Schottky barrier rectifier with an integrated guard ring forstress protection encapsulated in a SOT666 ultra small
plastic SMD package.

3, 4MHC310

123

Marking code: F2.

Fig.1 Simplified outline (SOT666) and symbol.

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOLPARAMETERCONDITIONS

MIN.

MAX.

UNITVR

continuous reverse voltage−10VIFcontinuous forward current

Tsp ≤ 55 °C; note 1−2A

IFRM

repetitive peak forward current

tp ≤ 1 ms; δ ≤ 0.5; note 1−

3.2AIFSM

non-repetitive peak forward current

tp = 8 ms square wave; note 1−

9ATstgstorage temperature−65+150°C

Tj

junction temperature−150°C

Tamboperating ambient temperature−65+150°C

Note
1. Only valid if pins 3 and 4 are connected in parallel.

2003 Jul 152

NXP Semiconductors

Product data sheet

Ultra low VF MEGA Schottky barrier
rectifier

PMEG1020EV

ELECTRICAL CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOLVF

IRCdPARAMETER
forward voltage

CONDITIONS

TYP.

MAX.

UNIT

see Fig.2; note 1reverse current

IF = 0.01 A

100130mV

IF = 0.1 A

164200mV

IF = 1 A

255

350mV

IF = 2 A

306460mV

VR = 5 V

0.72mA

VR = 8 V

12.5mA

VR = 10 V

1.23mA

3745pF

see Fig.3 note 2

diode capacitance

VR = 5 V; f = 1 MHz; see Fig.4

Notes
1. Pulse test: tp = 300 μs; δ = 0.02.
2. For Schottky barrier rectifiers thermal runaway has to be considered, as in some applications the reverse powerlosses (PR) are a significant part of the total power losses.
THERMAL CHARACTERISTICSSYMBOLPARAMETERCONDITIONS

Rth j-athermal resistance from junction to ambient

Rth j-sthermal resistance from junction to solder point

VALUE

UNIT

note 1405

K/W

note 2215

K/W

note 380

K/W

Notes
1. Refer to SOT666 standard mounting conditions.
2. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for cathode 1 cm2.
3. Solder point of cathode tabs.
Soldering
Reflow soldering is the only recommended soldering method.

2003 Jul 153

NXP Semiconductors

Product data sheet

Ultra low VF MEGA Schottky barrier
rectifier

PMEG1020EV

GRAPHICAL DATAMDB591

104
handbook, halfpage

MDB195105
handbook, halfpage
IR(μA)

IF(mA)

(1)

104

103

103
(1)

102

(2)

(2)

(3)

102
1010(3)10100

2003001400500
VF (mV)02(1) Tamb = 85 °C.
(2) Tamb = 25 °C.
(3) Tamb = −40 °C.

(1) Tamb = 85 °C.
(2) Tamb = 25 °C.
(3) Tamb = −40 °C.

Fig.2

Fig.3

Forward current as a function of forward
voltage; typical values.

MDB196120

handbook, halfpage

Cd(pF)

10080

60

40202046810VR (V)f = 1 MHz; Tamb = 25 °C.

Fig.4

Diode capacitance as a function of reverse
voltage; typical values.

2003 Jul 15

446810VR (V)Reverse current as a function of reverse
voltage; typical values.

NXP Semiconductors

Product data sheet

Ultra low VF MEGA Schottky barrier
rectifier

PMEG1020EV

PACKAGE OUTLINE

Plastic surface mounted package; 6 leads

SOT666

DE

AX

Y SS

HE

654pin 1 index
A12e1

bpc3w M A

Lpedetail X

012 mmscale

DIMENSIONS (mm are the original dimensions)
UNIT

A

bpc

DEee1

HE

Lpw

y

mm

0.6
0.5

0.27
0.17

0.18
0.08

1.7
1.5

1.3
1.1

1.0

0.5

1.7
1.5

0.3
0.1

0.1

0.1

OUTLINE
VERSION

REFERENCES
IEC

JEDEC

EIAJ

ISSUE DATE
01-01-04
01-08-27

SOT666

2003 Jul 15

EUROPEAN
PROJECTION

5NXP Semiconductors

Product data sheet

Ultra low VF MEGA Schottky barrierrectifier

PMEG1020EV

DATA SHEET STATUS
DOCUMENTSTATUS(1)PRODUCTSTATUS(2)Objective data sheet

Development

This document contains data from the objective specification for productdevelopment.

Preliminary data sheet

Qualification

This document contains data from the preliminary specification.

Product data sheet

Production

This document contains the product specification.

DEFINITION

Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was publishedand may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS

above those given in the Characteristics sections of thisdocument is not implied. Exposure to limiting values forextended periods may affect device reliability.

General ⎯ Information in this document is believed to beaccurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completenessof such information and shall have no liability for theconsequences of use of such information.

Terms and conditions of sale ⎯ NXP Semiconductors
products are sold subject to the general terms andconditions of commercial sale, as published at
http://www.nxp.com/profile/terms, including thosepertaining to warranty, intellectual property rights
infringement and limitation of liability, unless explicitly
otherwise agreed to in writing by NXP Semiconductors. In
case of any inconsistency or conflict between informationin this document and such terms and conditions, the latter
will prevail.

Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time andwithout notice. This document supersedes and replaces all
information supplied prior to the publication hereof.

No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell productsthat is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents orother industrial or intellectual property rights.

Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be suitable foruse in medical, military, aircraft, space or life support
equipment, nor in applications where failure or malfunctionof an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment orapplications and therefore such inclusion and/or use is at
the customer’s own risk.

Export control ⎯ This document as well as the item(s)described herein may be subject to export control
regulations. Export might require a prior authorization fromnational authorities.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values andCharacteristics sections of this document, and as such is
not complete, exhaustive or legally binding.

Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation orwarranty that such applications will be suitable for thespecified use without further testing or modification.
Limiting values ⎯ Stress above one or more limitingvalues (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage tothe device. Limiting values are stress ratings only andoperation of the device at these or any other conditions

2003 Jul 156

NXP Semiconductors

Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors. No changes weremade to the content, except for the legal definitions and disclaimers.

Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com© NXP B.V. 2009
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any licenseunder patent- or other industrial or intellectual property rights.
Printed in The Netherlands

613514/01/pp7

Date of release: 2003 Jul 15

Document order number: 9397 750 11686