AN90002

Wave soldering guidelines for flatpack packages
Rev. 2 — 2 November 2023

application note

Document information
Information

Content

Keywords

Wave soldering, flatpack, SOD123F, CFP2HP, CFP3, CFP5, CFP15, CFP15B, footprint design

Abstract

This application note provides wave soldering guidelines for Nexperia flatpacks, SOD123F,
CFP2HP (SOD323HP), CFP3 (SOD123W), CFP5 (SOD128) and CFP15 (SOT1289)/CFP15B(SOT1289B). The content includes wave soldering footprint recommendations, wave soldering
process and temperature profile.

AN90002

Nexperia

Wave soldering guidelines for flatpack packages

1. Introduction
This application note provides guidelines for board mounting by wave soldering of five flatpacks(package with flat leads): SOD123F, CFP2HP (SOD323HP), CFP3 (SOD123W), CFP5 (SOD128)
and CFP15 (SOT1289)/CFP15B (SOT1289B).
Although reflow soldering is major technology for soldering of surface mount devices, wave
soldering is also widely applied at many customers, especially for power supply applications.
This application note describes the recommendations for wave soldering of the Printed-Circuit
Board (PCB) land pattern, including:••the guidelines for component mounting
the process requirements for wave soldering

While this application note helps minimizing any unexpected failures, following the advice in thisdocument is not a guarantee for a perfect assembly result. The result may differ depending on themachine capability, ambient conditions, material, etc.

2. SOD123F, CFP2HP (SOD323HP), CFP3 (SOD123W), CFP5 (SOD128) and
CFP15 (SOT1289)/CFP15B (SOT1289B): Package details
SOD123F, CFP2HP(SOD323HP), CFP3 (SOD123W), CFP5 (SOD128) and CFP15 (SOT1289)/
CFP15B (SOT1289B) are plastic, flat leads, Surface-Mounted Device (SMD) packages.
Key features:•••

SOD123F, CFP3 (SOD123W) and CFP5 (SOD128): small and flat lead SMD plastic packages
CFP2HP (SOD323HP), CFP3 (SOD123W), CFP5 (SOD128), CFP15 (SOT1289) and CFP15(SOT1289)/CFP15B (SOT1289B): high power capability due to clip bond technology
CFP15 (SOT1289) and CFP15B (SOT1289B): small and ultra-thin SMD plastic package withheat sink

The visual appearance of SOD123F is shown in Fig. 1 whereas Fig. 2 shows the package
dimensions.
The visual appearance of CFP2HP (SOD323HP) is shown in Fig. 3 whereas Fig. 4 shows the
package dimensions.
The visual appearance of CFP3 (SOD123W) is shown in Fig. 5 whereas Fig. 6 shows the package
dimensions.
The visual appearance of CFP5 (SOD128) is shown in Fig. 7 whereas Fig. 8 shows the package
dimensions.
The visual appearance of CFP15 (SOD1289) is shown in Fig. 9 whereas Fig. 10 shows the
package dimensions.
The visual appearance of CFP15B (SOD1289B) is shown in Fig. 11 whereas Fig. 12 shows the
package dimensions.

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Wave soldering guidelines for flatpack packages

Fig. 1.

SOD123F: visual appearance

Plastic surface-mounted package; 2 leads

SOD123F

D

E

A

A
c
Lp

Lp
HE

0

1

2 mm

scale
1

2

DIMENSIONS (mm are the original dimensions)
bp

wM A

A

bp

c

D

E

HE

Lp

w

mm

1.2
1.0

0.70
0.55

0.25
0.10

2.7
2.5

1.7
1.5

3.6
3.4

0.55
0.35

0.1

Note
1. The marking bar indicates the cathode(1)

OUTLINE
VERSIONUNIT

REFERENCES
IEC

JEDEC

JEITA

AN90002

application note

ISSUE DATE
04-11-29
06-03-16

SOD123F

Fig. 2.

EUROPEAN
PROJECTION

SOD123F: package dimensions

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Wave soldering guidelines for flatpack packages

Fig. 3.

CFP2HP (SOD323HP): visual appearance

SOD323HP: plastic surface-mounted package with Side-Wettable Flanks (SWF);
1.3 mm x 2.2 mm x 0.68 mm body
L1

SOD323HP

L

b1

b

w

C A B

H
v

C A B

A
c
C
E

A

B

(1)

1

2
#

#

0

D

1

2 mm

scale
Dimensions (mm are the original dimensions)
Unit
mm

max
nom
min

A

b

b1

c

D

E

H

L

L1

v

w

0.75
0.68
0.61

0.75
0.70
0.65

0.98
0.90
0.82

0.25
0.18
0.11

1.4
1.3
1.2

2.3
2.2
2.1

2.70
2.65
2.60

0.80
0.72
0.64

1.50
1.38
1.26

0.13

0.13

Note
1. (1) The marking band indicates the cathode.
2. # Side wettable Flank (SWF).
Outlineversion
SOD323HP

Fig. 4.

AN90002

application note

sod323hp_po

References
IEC

JEDEC

JEITA

DO-219AD(compatible)

Europeanprojection

Issue date
21-04-02
21-04-07

CFP2HP (SOD323HP): package dimensions

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Wave soldering guidelines for flatpack packages

Fig. 5.

CFP3 (SOD123W): visual appearance

Plastic surface-mounted package; 2 leads

SOD123W

D

A

E

A
c
Lp

Lp
HE
0

(1)
1

2 mm

DIMENSIONS (mm are the original dimensions)

2

bp
w

A

UNIT

A

bp

c

D

E

HE

Lp

w

mm

1.1
0.9

1.05
0.75

0.22
0.10

2.8
2.4

1.9
1.5

3.7
3.3

0.6
0.3

0.13

Note
1. The marking bar indicates the cathode.

REFERENCESOUTLINE
VERSION

1
scale

IEC

JEDEC

EUROPEAN
PROJECTIONJEITAISSUE DATE
07-06-28
08-11-06

SOD123W

Fig. 6.

CFP3 (SOD123W): package dimensions

Fig. 7.

CFP5 (SOD128): visual appearance

Plastic surface-mounted package; 2 leads

SOD128

D

E

A

A
c
HE

1

0

2

wM A

(1)

OUTLINE
VERSION

Lp

UNIT

A

bp

c

D

E

HE

Lp

w

mm

1.1
0.9

1.9
1.6

0.22
0.10

4.0
3.6

2.7
2.3

5.0
4.4

0.6
0.3

0.13

Note
1. The marking bar indicates the cathode

REFERENCES
IEC

JEDEC

JEITA

AN90002

application note

EUROPEAN
PROJECTION

ISSUE DATE
06-03-03
07-09-12

SOD128Fig. 8.

5 mm

DIMENSIONS (mm are the original dimensions)

bp

Lp

2.5
scale

CFP5 (SOD128): package dimensions

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Wave soldering guidelines for flatpack packages

Fig. 9.

CFP15 (SOT1289): visual appearance

CFP15: plastic, thermal enhanced ultra thin SMD package; 3 leads; body: 5.8 x 4.3 x 0.78 mm

SOT1289

b
b2
(2x)

b1

3

L

2

e

L1
L2

1 (2x)

b3
(2x)

b3
D1

E

C
A
D

1

3
2

0

2.5

5 mm

scale
Dimensions (mm are the original dimensions)
Unit
mm

C

D

D1

E

max 0.82 0.24
nom 0.78 0.20
min 0.74 0.16

6.6
6.5
6.4

5.9
5.8
5.7

4.4
4.3
4.2

Outlineversion

A

e

b

b1

b2

b3

L

L1

L2

2.13

4.8
4.6
4.4

4.2
4.0
3.8

1.3
1.1
0.9

0.45
0.35
0.25

3.5
3.3
3.1

2.15
2.05
1.95

1.3
1.2
1.1

References
IEC

JEDEC

JEITA

sot1289_po

Europeanprojection

Issue date
14-07-23
14-09-01

SOT1289

Fig. 10. CFP15 (SOT1289): package dimensions

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Wave soldering guidelines for flatpack packages

Fig. 11. CFP15B (SOT1289B): visual appearance
CFP15B: plastic, thermal enhanced ultra thin SMD package; 3 leads; body: 5.8 x 4.3 x 0.95 mm

SOT1289B

b
b2
(2×)

b1

3

L

2

e

L1

1

L2
(2×)

b3
(2×)

b3
D1

C
(3×)

E

A
D

1

3
2

0

2.5

5 mm

scale
Dimensions (mm are the original dimensions)
Unit
mm

C

D

D1

E

e

b

b1

b2

b3

L

L1

L2

max 0.99 0.24
nom 0.95 0.20
min 0.91 0.16

6.9
6.8
6.7

5.9
5.8
5.7

4.4
4.3
4.2

4.96
2.13 4.76
4.56

4.2
4.0
3.8

1.44
1.24
1.04

0.6
0.5
0.4

3.5
3.3
3.1

2.15
2.05
1.95

1.3
1.2
1.1

Outlineversion
SOT1289B

A

References
IEC

JEDEC

JEITA

---

sot1289b_po

Europeanprojection

Issue date18-02-01
19-01-10

Fig. 12. CFP15B (SOT1289B): package dimensions

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Wave soldering guidelines for flatpack packages

3. PCB requirements and solder pattern
3.1. PCB material and surface finishing
The substrates used for mounting the packages can be made of a variety of materials with different
properties such as FR4, FR5, Bismaleimide-Triazine resin (BT), flexible polymers (polyimides or
polyamide), etc. There are no special constraint for wave soldering application, as long as theboard can sustain wave-soldering temperature.
Common board finishes include NiAu, Organic Solderability Preservative (OSP), immersion Sn and
Hot Air Surface Leveling (HASL). Although finishes may look different after soldering, and someappear to have better wetting characteristics than other, all common finishes can be used, provided
that they are in accordance with the specifications (for example IPC-A-610).

3.2. Solder mask (resist) design
There are two types of solder pad / solder resist designs:
Solder Mask Defined (SMD) and Non-Solder Mask Defined (NSMD).
SMD is a method of designing the solder resist to partially overlap the copper (Cu) landing patternon the PCB. NSMD designs have a gap between the solder resist and the Cu landing pattern on
the PCB. These two types are described in more details on Fig. 13.
For wave soldering, any of the solder mask configurations can be used without significant impact tosoldering outcome. It is recommended to use NSMD in this document, because it is an easy PCB
manufacturing method.

001aac831

Fig. 13. SMD solder pad

AN90002

application note

001aac832

Fig. 14. NSMD solder pad

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Wave soldering guidelines for flatpack packages

3.3. Solder land (footprint) design
A footprint design describes the recommended dimensions of the solder lands on the PCB, tomake reliable solder joints between the semiconductor package and the PCB. In wave soldering,
the solder pad dimensions should be larger than normal footprint dimensions for reflow soldering.
This is to allow the molten solder from the wave to have enough contact area with Cu pad, and apath to flow through the pad underneath the package.
Reduce the glue volume to a minimum, as long as it can hold the package. To avoid excessive gluethat may spread onto solder pads, place two small glue dots at side of the package. However, if
glue volume is controlled to avoid that the glue spreads onto Cu pads, it is sufficient to apply one
glue dot at the center of the device for SOD123F, CFP3 (SOD123W) and CFP5 (SOD128).
In addition, to give the glue some room under the plastic body of a package, dummy tracks on PCB
can be designed under the plastic body. Etch away the Cu and make an opening in solder resist to
generate a trench underneath the plastic body. A similar effect can be achieved with NSMD tracks.
This is a known method to balance surface topography differences of the PCB by designing either
normal or dummy tracks underneath a component.
Wave soldering footprint design for SOD123F, CFP2HP(SOD323HP), CFP3 (SOD123W), CFP5
(SOD128) and CFP15 (SOT1289)/CFP15B (SOT1289B), including glue dot, are shown in Fig. 15,
Fig. 16, Fig. 17, Fig. 18 and Fig. 19, respectively.
8.3

3.5

4.8

3.5

2.55
(2x)

2.4
(2x)

3 (2x)

1.6

0.61
(2x)

1.5

3.15 (2x)2.6 (2x)

solder resist

occupied area

glue dot

solder lands

dummy track
solder resist and Cu freepackage outline

Dimensions in mm
aaa-027586

package outline

Fig. 15. SOD123F: recommended wave soldering footprint
4.5

2.65

4.9
0.08

0.48

pCL

3.7 2.4 1.0

1.60

0.9 2.4

0.5 1.2
0.65

3.25

2.5
0.5 (2×)

preferred transport direction
during soldering
pCL = package center line

occupied area

solder resist(0.05 mm offset from Cu)

glue dot (0.1 mm stencil thickness)solder land

package outline

package outline

Fig. 16. CFP2HP (SOD323HP): recommended wave soldering footprint

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Wave soldering guidelines for flatpack packages
8.3

3.5

4.8

3.5

2.55
(2x)

2.4
(2x)

3 (2x)

1.85

0.9
(2x)

1.7

3.15 (2x)2.7 (2x)

solder resist

occupied area

glue dot

solder lands

dummy track
solder resist and Cu freepackage outline

Dimensions in mm
aaa-027587

package outline

Fig. 17. CFP3 (SOD123W): recommended wave soldering footprint
10.2

4.7

5.8

5.7

4.2
(2x)

4.35
(2x)

3.5 (2x)

2.6

1.75
(2x)

2.4

3.65 (2x)3.8 (2x)

solder resist

occupied area

glue dot

solder lands

dummy track
solder resist and Cu freepackage outline

Dimensions in mm
aaa-027588

package outline

Fig. 18. CFP5 (SOD128): recommended wave soldering footprint
9.1
6.1

2.1

1.35 (2x)3.6 3.5

2.13 4.2

4.3 2.05
1.45 (2x)

6.2

2.2

5.8

9.4

solder resist

package outline

solder lands

occupied area

glue dot

Dimensions in mm

package outline

aaa-037761

Fig. 19. CFP15 (SOT1289)/CFP15B (SOT1289B): recommended wave soldering footprint

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Wave soldering guidelines for flatpack packages

3.4. Component orientation
The component orientation on board refers to the direction of the component on the wave solderingmachine conveyor. The orientation can be either:••

0 °: The long axis of the component is parallel to the direction of board traveling along the wave
soldering machine conveyor.
90 °: The long axis of the component is perpendicular to the direction of board traveling along
the wave soldering machine conveyor.

According to the standard IPC-7351, an orientation of 90 ° is preferable for SOD123F, CFP3
(SOD123W), CFP3 (SOD123W), CFP5 (SOD128) and CFP15 (SOT1289)/CFP15B (SOT1289B).
However, Nexperia investigations confirmed that both travel directions result in good solder
connections.

4. Wave soldering process
4.1. Adhesive
To hold components on the board during wave soldering, it is necessary to bond them to the
PCB with adhesive dots. The glue must be tacky enough and have sufficent volume so that thecomponent would not move or fall off during transport from peak and place machine to curing
equipment. It also must have good adhesion strength after curing to prevent it from falling off during
the whole wave soldering process.

4.1.1. Applying adhesive
For SOD123F, CFP2HP (SOD323HP), CFP3 (SOD123W), CFP5 (SOD128) and CFP15(SOT1289)/CFP15B (SOT1289B), either printing or dispensing of adhesive is possible. In order toachieve better planarity and consistent volume, Nexperia wave soldering investigations used themethod of printing with stencil thickness of 0.1 mm (4 mil).

4.1.2. Curing adhesive
Adhesive must be cured according to the specified conditions of the supplier. Glue should be fully
cured before wave soldering.

4.2. Solder flux
Fluxing is necessary to promote wetting of both the PCB and the mounted components. Fluxing
ensures good and even solder joints. After the fluxing process, the solder side of the PCB(including the components) is covered with a thin layer of flux. Flux can be applied onto PCB byspraying or foaming.
Use no-clean flux with low corrosive content like Rosin Mildly Activated (RMA) flux.

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Wave soldering guidelines for flatpack packages

4.3. Wave soldering
Recommended wave soldering profile is described in Fig. 20 and Table 1.
temperaturetp
Tp

second wave

first waveTspreheat

ramp-down

25 °C

time
aaa-027581

Fig. 20. Wave soldering profile

AN90002

application note

Table 1. Wave soldering parameters
Profile Feature
SnBb eutectic assemblyPb-free assembly

Average ramp-up rate

~ 200 °C/s

~ 200 °C/s

Heating rate during preheat

1°C/s to 2 °C/s typical, 4 °C/s
maximum

1°C/s to 2 °C/s typical, 4 °C/s
maximum

Final preheat temperature Ts~ 130 °C

~ 130 °C

Peak temperature Tp

235 °C

260 °C

Maximum time within peaktemperature tp

10 s

10 s

Ramp-down rate

5 °C/s maximum

5 °C/s maximum

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Wave soldering guidelines for flatpack packages

5. Nexperia wave soldering trials
Nexperia performed wave soldering trials at third party institute for SOD123F, CFP2HP(SOD323HP), CFP3 (SOD123W), CFP5 (SOD128) and CFP15 (SOT1289). The trials werebased on already mentioned designs, recommendations and guidelines . The results of the trials
confirmed the recommendations given in this application note. The complete report is available on
request.
Due to very similar construction and body dimensions of CFP15 (SOT1289) and CFP15B(SOT1289B) wave solder performance for CFP15B was not evaluated, but the evaluation of the
CFP15 (SOT1289) is applicable.
The results from wave soldering trials are summarized in Table 2.
Table 2. Wave soldering trials
Performances

SOD123F

CFP2HP(SOD323HP)

CFP3(SOD123W)

CFP5(SOD128)

CFP15(SOT1289)

Adhesive printing

Good

Good

Good

Good

Good

Component placement

Good

Good

Good

Good

Good

Shear force - After adhesive curing> 1500 g> 2600 g> 1400 g> 3200 g

Pass

Solder joint

Good

Good

Good

Good

Good

Shear force - After wave soldering> 5600 g> 5200 g> 6700 g> 10700 g> 15000 g

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Wave soldering guidelines for flatpack packages

SOD123F_0°

SOD123F_90°

CFP2HP (SOD323HP)_0°

CFP3 (SOD123W)_0°

CFP3 (SOD123W)_90°

CFP5 (SOD128)_0°

CFP5 (SOD128)_90°

CFP15 (SOT1289)_0°

CFP15 (SOT1289)_90°
aaa-027582

Fig. 21. After adhesive printing

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Wave soldering guidelines for flatpack packages

SOD123F_0°

SOD123F_90°

CFP2HP (SOD323HP)_0°

CFP3 (SOD123W)_0°

CFP3 (SOD123W)_90°

CFP5 (SOD128)_0°

CFP5 (SOD128)_90°

CFP15 (SOT1289)_0°

CFP15 (SOT1289)_90°
aaa-027583

Fig. 22. After component placement and adhesive curing

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Wave soldering guidelines for flatpack packages

SOD123F_0°

SOD123F_90°

CFP2HP (SOD323HP)_0º

CFP3 (SOD123W)_0°

CFP3 (SOD123W)_90°

CFP5 (SOD128)_0°

CFP5 (SOD128)_90°

CFP15 (SOT1289)_0°

CFP15 (SOT1289)_90°
aaa-027584

Fig. 23. After wave soldering

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Fig. 24. Cross-section inspection

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Wave soldering guidelines for flatpack packages

6.
Table 3. Revision history
Revision
Date
numberDescription

2.0

20231102

Update, CFP2HP (SOD323HP) and CFP15B (SOT1289B) are added

1.0

20171130

Initial version of the document

Table 4. Contact information
For more information, please visit: http://www.nexperia.com
For sales office addresses, please send an email to: salesaddresses@nexperia.com

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7. Legal information
Definitions
Draft — The document is a draft version only. The content is still underinternal review and subject to formal approval, which may result in
modifications or additions. Nexperia does not give any representations or
warranties as to the accuracy or completeness of information included hereinand shall have no liability for the consequences of use of such information.

Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, Nexperia does not give any
representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for theconsequences of use of such information. Nexperia takes no responsibility
for the content in this document if provided by an information source outsideof Nexperia.
In no event shall Nexperia be liable for any indirect, incidental, punitive,
special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removalor replacement of any products or rework charges) whether or not suchdamages are based on tort (including negligence), warranty, breach ofcontract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, Nexperia’s aggregate and cumulative liability towards customer
for the products described herein shall be limited in accordance with theTerms and conditions of commercial sale of Nexperia.
Right to make changes — Nexperia reserves the right to make changes
to information published in this document, including without limitation
specifications and product descriptions, at any time and without notice. This
document supersedes and replaces all information supplied prior to the
publication hereof.
Suitability for use — Nexperia products are not designed, authorized or
warranted to be suitable for use in life support, life-critical or safety-criticalsystems or equipment, nor in applications where failure or malfunctionof an Nexperia product can reasonably be expected to result in personal
injury, death or severe property or environmental damage. Nexperia and its
suppliers accept no liability for inclusion and/or use of Nexperia products insuch equipment or applications and therefore such inclusion and/or use is at
the customer’s own risk.
Applications — Applications that are described herein for any of theseproducts are for illustrative purposes only. Nexperia makes no representation
or warranty that such applications will be suitable for the specified use
without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using Nexperia products, and Nexperia accepts no liability forany assistance with applications or customer product design. It is customer’ssole responsibility to determine whether the Nexperia product is suitableand fit for the customer’s applications and products planned, as well as
for the planned application and use of customer’s third party customer(s).
Customers should provide appropriate design and operating safeguards tominimize the risks associated with their applications and products.
Nexperia does not accept any liability related to any default, damage, costs
or problem which is based on any weakness or default in the customer’s
applications or products, or the application or use by customer’s third party
customer(s). Customer is responsible for doing all necessary testing for thecustomer’s applications and products using Nexperia products in order toavoid a default of the applications and the products or of the application or
use by customer’s third party customer(s). Nexperia does not accept any
liability in this respect.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a priorauthorization from competent authorities.
Translations — A non-English (translated) version of a document is forreference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.

Trademarks
Notice: All referenced brands, product names, service names andtrademarks are the property of their respective owners.

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Wave soldering guidelines for flatpack packages

List of Tables
Table 1. Wave soldering parameters................................. 12
Table 2. Wave soldering trials............................................13

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AN90002

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Wave soldering guidelines for flatpack packages

List of Figures
Fig. 1. SOD123F: visual appearance...................................3
Fig. 2. SOD123F: package dimensions............................... 3
Fig. 3. CFP2HP (SOD323HP): visual appearance...............4
Fig. 4. CFP2HP (SOD323HP): package dimensions........... 4
Fig. 5. CFP3 (SOD123W): visual appearance..................... 5
Fig. 6. CFP3 (SOD123W): package dimensions..................5
Fig. 7. CFP5 (SOD128): visual appearance........................ 5
Fig. 8. CFP5 (SOD128): package dimensions..................... 5
Fig. 9. CFP15 (SOT1289): visual appearance..................... 6
Fig. 10. CFP15 (SOT1289): package dimensions............... 6
Fig. 11. CFP15B (SOT1289B): visual appearance...............7
Fig. 12. CFP15B (SOT1289B): package dimensions...........7
Fig. 13. SMD solder pad...................................................... 8
Fig. 14. NSMD solder pad................................................... 8
Fig. 15. SOD123F: recommended wave soldering footprint 9
Fig. 16. CFP2HP (SOD323HP): recommended wave
soldering footprint.................................................................9
Fig. 17. CFP3 (SOD123W): recommended wave
soldering footprint...............................................................10
Fig. 18. CFP5 (SOD128): recommended wave
soldering footprint...............................................................10
Fig. 19. CFP15 (SOT1289)/CFP15B (SOT1289B):
recommended wave soldering footprint............................. 10
Fig. 20. Wave soldering profile.......................................... 12
Fig. 21. After adhesive printing.......................................... 14
Fig. 22. After component placement and adhesive curing. 15
Fig. 23. After wave soldering............................................. 16
Fig. 24. Cross-section inspection....................................... 17

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AN90002

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Wave soldering guidelines for flatpack packages

Contents
1. Introduction................................................................... 2
2. SOD123F, CFP2HP (SOD323HP), CFP3
(SOD123W), CFP5 (SOD128) and CFP15(SOT1289)/CFP15B (SOT1289B): Package details.......... 2
3. PCB requirements and solder pattern........................ 8
3.1. PCB material and surface finishing............................. 8
3.2. Solder mask (resist) design......................................... 8
3.3. Solder land (footprint) design...................................... 93.4. Component orientation.............................................. 11
4. Wave soldering process............................................ 11
4.1. Adhesive.................................................................... 11
4.1.1. Applying adhesive...................................................11
4.1.2. Curing adhesive......................................................11
4.2. Solder flux..................................................................11
4.3. Wave soldering.......................................................... 12
5. Nexperia wave soldering trials.................................. 13
6. ....................................................................................... 18
7. Legal information........................................................19© Nexperia B.V. 2023. All rights reserved

For more information, please visit: http://www.nexperia.com
For sales office addresses, please send an email to: salesaddresses@nexperia.com
Date of release: 2 November 2023

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