Annual Technical Report 2016
Year Ended March 31, 2017

OITDA

Optoelectronics Industry and Technology Development Association

Message from OITDA

Yasuhisa Odani
President
Optoelectronics Industry and Technology
Development Association (OITDA)

It is my pleasure to present to you an Annual Technical Report 2016, which outlines the result of our surveys, researchand development activities in FY 2016.
According to the Optoelectronics Industry Trends Survey conducted every year by our association (OITDA), the total
shipments of the optoelectronics industry decreased by 13.7% in FY 2016 to 14,517 billion yen, following a decrease of
5.1% in FY 2015. Domestic production also decreased by 11.9% to 7,837.3 billion yen in FY 2016, following a decreaseof 2.3% in FY 2015. The decrease is mainly attributable to the significant drop in the photovoltaic energy field (-22.9% in
total shipments, -25.5% in domestic production). Total shipments in other fields of the optoelectronics industry also decreased:-14.8% for optical communication equipment/systems, -9.5% for optical storage, -15.8% for display equipment, and -18.7%
for input/output equipment. Various negative conditions occurred at the same time in FY 2016 although the causes of thedecrease varied in each field.
Meanwhile, fields such as laser/optical processing equipment (+13.5% in total shipments), LED lighting equipment(+8.0%), optical communication components (+7.1%), optical sensing and measuring equipment (+2.8%), and image sensors(+2.5%) remained brisk. The good performance in these fields is mainly attributable to the investment in Japanʼs automotive
industry and data centers outside Japan. Typical products of the former includes fiber lasers for processing and image sensors
essential for automated driving systems, while the latter includes components such as light emitting and receiving devices,
optical fibers, and optical sensors. Optical sensors such as image sensors will contribute significantly to the developmentof AI, IoT, robots, and medical equipment technologies which have been strongly promoted by the government. It becomes
more important than ever for optoelectronics industry to formulate technology development strategy, commercialization
strategy, and standardization strategy for these new emerging markets in addition to the existing market.
OITDA has been engaged in the following priority issues in order to select optoelectronics technologies with the potential
to be developed into industry and to turn the potential into realty: (1) survey and research on the optoelectronics technology
and industry; (2) promotion of technology development; (3) promotion of standardization; (4) creation of new business anddevelopment of human resources. In FY 2016, we directed our efforts to these issues as in previous years and, based on the
results of such efforts, also conducted dissemination and education, international exchange and cooperation and provisionof information on the optoelectronics technology and industry.
Details of the activities and the outcomes of individual issues are presented in the report. Here, I would like to introduce
noteworthy events in FY 2016. First, we created a road map for the “automotive photonics”(optoelectronics technologies foran automobile), which has been drawing attention as a new field of the optoelectronics industry as mentioned above, in thehope that it will be utilized as guidelines which contribute to the development of the optoelectronics industry. We presented
the road map at the Symposium on the Optoelectronic Industry and Technology held on February 9, 2017. The road map is
expected to be reflected in R&D activities in industry, academia and government. In terms of standardization, we hosted the
ISO/TC 172/SC 9 meeting on laser measurement in Kurashiki, Japan to promote international contribution. Further in the
project of the Ministry of Economy, Trade and Industry, we created and proposed draft standards for in-vehicle high-speed
optical Ethernet, connector parameters of physically contacting optical fiber, and new laser safety guard material and test
method at IEC, ISO, and IEEE meetings.
In order to support the growth of optoelectronics technology and industry, OITDA will strengthen and enhance ouractivities in accordance with needs, under the guidance of the Ministry of Economy, Trade and Industry and other governmentalorganizations, with the understanding and cooperation of our supporting members and many other people from the businessworld and the academic community who are our important partners. We look forward to your continued guidance, support
and cooperation.

—CONTENTS—
Optoelectronics Industry Trends………………………………………………

2

Technological Strategy Development………………………………………… 11Standardization…………………………………………………………………… 13
Educational and Public Relations Activities………………………………… 20
Supporting Members…………………………………………………………… 22

Optoelectronics Industry Trends
1. Introduction

4. Display and
Solid-state
Lighting:

Since its foundation in 1980, thanks to great support and cooperationof the affiliated members and enterprises, OITDA has conducted its
annual “Survey of Trends in the Optoelectronics Industry.” The data
accumulated continuously over more than 30 years are regarded highly
as basic information on optoelectronics industry trends.
The purpose of this survey is to suggest the future direction of theoptoelectronics industry through an analysis of its current status. In thisfiscal year, as in the previous year, seven field-specific committees:
optical communications, optical storage, input/output equipment, display
and solid-state lighting, photovoltaic energy, laser/optical processing,and sensing and measuring were established under the Optoelectronics
Industry Trend Research Committee (parent committee) to survey andanalyze the trends in each field and the optoelectronics industry as awhole.

5. Photovoltaic
Energy:6. Laser/Optical
Processing:
7. Sensing and
Measuring:
8. Others:(Notes)Flat panel display devices and equipment,
projector, solid-state lighting devices andequipment, LED (for lighting and displays),etc.
Photovoltaic power generation systems,
photovoltaic cells and modules
Laser/Optical processing equipment, lamp/
LD lithography, additive manufacturing (3Dprinter), laser oscillator, etc.
Optical measuring instruments, opticalsensing equipment
Hybrid optical device, etc.

Dotted underline:

2.	Total Shipments and Domestic Production for the
Optoelectronics Industry

Single underline:

2.1	Survey of Total Shipments and Domestic Production for the
Optoelectronics Industry
A survey of total shipments and domestic production for the
optoelectronics industry was conducted as described below.
In order to determine the industry trends of domestic enterprises
which manufacture optoelectronics-related products (optoelectronics
equipment/systems and optical components), questionnaire survey was
carried out by sending questionnaires about actual results of FY2015,
estimated values of FY2016 and qualitative projections for FY2017
concerning all shipments including overseas production and domestic
production to 271 enterprises in October 2016 and collected them from
December 2016 to February 2017.
In addition to the questionnaire survey, we also referred to the dataof Japan Photovoltaic Energy Association (JPEA), Japan Lighting
Manufacturers Association (JLMA), Camera & Imaging Products
Association (CIPA) and Fuji Chimera Research Institute, Inc. forphotovoltaic energy field, solid-state lighting field, display field andinput/output equipment field, respectively.
Based on the results of the questionnaire and the references, total
shipments, domestic production and industry trend in each product field
were analyzed by the field-specific research committees establishedunder the Optoelectronics Industry Trend Research Committee. The
validity of the data and analysis results was reviewed by the
Optoelectronics Industry Trend Research Committee, and the research
results were compiled as a report on Optoelectronics Industry Trend inJapan.
In this survey, the Optoelectronics industry is categorized into thefollowing seven product fields and “Others”, while each product field
is further categorized into equipment/systems and components.

Dashed line:
Wavy line:
Double underline:

2.2 Overview of Survey Results of Total Shipment
Table 1 shows actual total shipments for FY 2015, estimated total
shipments for FY 2016 and a qualitative projection of total shipments
for FY 2017.
The blue shaded sections in Table 1 represent optoelectronics
equipment/systems, and the yellow sections represent opticalcomponents.
● FY 2015 (results): 16,825.9 billion yen, growth rate: −5.1%
In FY 2015, the total shipment value (results) for the optoelectronics
industry was 16,825.9 billion yen (growth rate: −5.1%):11,851 billion
yen for optoelectronics equipment/systems (growth rate: −5.9%,
component ratio: 70.4%) and 4,974.9 billion yen for optical components(growth rate: −2.9%, component ratio: 29.6%).
The shipment value by field was:531.4 billion yen for the optical communication field (growth rate:+2.1%, component ratio: 3.2%),
1,054 billion yen for the optical storage field (growth rate: −6.7%,
component ratio: 6.3%),
4,068.9 billion yen for the input/output equipment field (growth rate:−7.2%, component ratio: 24.2%),
6,544.9 billion yen for the display and solid-state lighting field (growth
rate: +5.3%, component ratio: 38.9%),
3,733.4 billion yen for the photovoltaic energy field (growth rate:−19.6%, component ratio: 22.2%),
558.6 billion yen for the laser/optical processing field (growth rate:+9.2%, component ratio: 3.3%), and249.7 billion yen for the sensing and measuring field (growth rate:+4.6%, component ratio: 1.5%).
● FY 2016 (estimation): 14,517 billion yen, growth rate: −13.7%
The total shipment value for the optoelectronics industry in FY 2016
is estimated to decrease significantly to 14,517 billion yen (growth rate:−13.7%): 10,053.9 billion yen for optoelectronics equipment/systems(growth rate: −15.2%, component ratio: 69.3%) and 4,463.1 billion
yen for optical components (growth rate: −10.3%, component ratio:
30.7%).
The shipment value by field is estimated to be:
528.5 billion yen for the optical communication field (growth rate:

1. Optical
Optical transmission equipment/system,
Communication: optical fiber fusion splicing, light emitting
device, photo detection device, opticalpassive component, optical fiber, opticalconnector, etc.
2. Optical Storage: Optical disc equipment (read-only, recording
and playing types), optical disc media, laser
diodes, etc.
3. Input/Output:
Optical printers, multifunction printers(MFP: optical and ink-jet), digital cameras(interchangeable lenses: single-lens reflex,
mirrorless type (only the body without lensfor both) and compact type), digital video
cameras (including business use), camera
mobile phones, tablet computers, etc.
Annual Technical Report2016 OITDA

Items added to optoelectronics products
since FY 2009 research.
Items added to the optoelectronics
products since FY 2010 research.
Items added to optoelectronics products
since FY 2013 research.
Items added to optoelectronics products
since FY 2014 research
Items added to optoelectronics products
since FY 2015 research.

2

Optoelectronics Industry Trends−0.5%, component ratio: 3.6%),
954.3 billion yen for the optical storage field (growth rate: −9.5%,
component ratio: 6.6%),
3,429.4 billion yen for the input/output equipment field (growth rate:−15.7%, component ratio: 23.6%),
5,746.9 billion yen for the display and solid-state lighting field (growth
rate: −12.2%, component ratio: 39.6%),
2,876.7 billion yen for the photovoltaic energy field (growth rate:−22.9%, component ratio: 19.8%),
634.1 billion yen for the laser/optical processing field (growth rate:+13.5%, component ratio: 4.4%), and
256.8 billion yen for the sensing and measuring field (growth rate:+2.8%, component ratio: 1.8%).
● A slight decrease is likely in FY 2017 (projections)
The total shipment value for the optoelectronics industry in FY 2017is projected to decrease slightly. A slight decrease is projected for both
optoelectronics equipment/systems and optical components. By field,
the optical communication field will remain steady, and the opticalstorage field will slightly decrease. The input/output equipment field
will remain steady, and the display and solid-state lighting field willslightly increase. The photovoltaic energy field will decrease, while thelaser/optical processing field and the sensing and measuring field willslightly increase.

component ratio: 2.6%),
1,008.1 billion yen for the input/output equipment field (growth rate:−7.0%, component ratio: 12.9%),
3,053.9 billion yen for the display and solid-state lighting field (growth
rate: −7.7%, component ratio: 39.0%),
2,258.8 billion yen for the photovoltaic energy field (growth rate:−25.5%, component ratio: 28.8%),
618.1 billion yen for the laser/optical processing field (growth rate:+13.5%, component ratio: 7.9%), and
171.5 billion yen for the sensing and measuring field (growth rate:+2.9%, component ratio: 2.2%).
● A slight decrease is likely in FY 2017 (projections)
Domestic production for the optoelectronics industry in FY 2017 is
projected to decrease slightly. A slight decrease is projected for both
optoelectronics equipment/systems and optical components. By field,
the optical communication field will remain steady, and the opticalstorage field will decrease slightly. The input/output equipment field
will remain steady, and the display and solid-state lighting field willslightly increase. The photovoltaic energy field will decrease, while thelaser/optical processing field and the sensing and measuring field will
increase slightly.
2.4	Trends in the Total Shipment for the Optoelectronics Industry(1) Changes in the Total Shipment for the Optoelectronics
Industry
Figure 1 shows the changes in the total shipment value and the rateof growth from the previous fiscal year for the six years from FY 2009
to FY 2016. The nominal GDP (1/10 of the actual value) and the domestic
and overseas output of the Japanese electronics industry have been added
as a reference for a comparison between the total shipment value forthe optoelectronics industry and domestic production for the Japanese
economy and other industries.
In FY 2014, the overall output of the optoelectronics industry remained
steady (+2.0%) due to the significant increase in the previous fiscal
year. In FY 2015, the output decreased for the first time in three years(−5.1%). In FY 2016, the output is estimated to decrease significantly(−13.7%) due to considerable decrease in the photovoltaic energy field,
etc.
Figure 2 shows the changes by field. In FY 2015, the total shipmentof the display and solid-state lighting field increased slightly due to theincrease in display devices (attributed to the expansion of the smartphone
and tablet device market) and LED lighting devices (attributed to thegrowing awareness to save energy). The laser/optical processing fieldgrew steadily due to the increase in capital investment mainly in theautomotive industry. The sensing and measuring field, in which salesof security devices and in-vehicle cameras, etc. were strong, also showeda slight increase. In the input/output equipment field, image sensors
remained strong, but could not compensate for the decrease in digital
cameras, etc., resulting in a decrease in the total shipment. In the opticalcommunication field, light emitting devices and other components
compensated for the decrease in optical transmission equipment fortrunk lines and metro lines. The shipment almost remained steady. The
optical storage field decreased slightly due to the continuous pricedecline and decrease in demand. The photovoltaic energy field attained
positive growth until the previous fiscal year. It decreased significantly
in FY 2015 due to changes in the Feed-in Tariff (FIT) system and thefalling purchase price.
In FY 2016, the laser/optical processing field and the sensing andmeasuring field are estimated to increase moderately due to the increasein capital investment (mainly in the automotive industry) and strong
sales of security devices and in-vehicle cameras, etc., respectively. In
the optical communication field, optical transmission equipment for

2.3	Overview of Survey Results of Domestic Production
Table 2 shows the actual domestic production for FY 2015, estimateddomestic production for FY 2016 and a qualitative projection of thedomestic production for FY 2017.
● FY 2015 (results): 8,896.2 billion yen, growth rate: −2.3%
The domestic production value (results) for the optoelectronics
industry in FY 2015 almost remained steady at 8,896.2 billion yen(growth rate: −2.3%): 5,236.1 billion yen for optoelectronics equipment/
systems (growth rate: −5.0%, component ratio: 58.9%) and 3,660 billion
yen for optical components (growth rate: +1.7%, component ratio:
41.1%).
The production value by field was:450.8 billion yen for the optical communication field (growth rate:+2.7%, component ratio: 5.1%),
234.7 billion yen for the optical storage field (growth rate: +1.0%,
component ratio: 2.6%),
1,084.4 billion yen for the input/output equipment field (growth rate:+1.7%, component ratio: 12.2%),
3,309.9 billion yen for the display and solid-state lighting field (growth
rate: +5.4%, component ratio: 37.2%),
3,030 billion yen for the photovoltaic energy field (growth rate: −13.2%,
component ratio: 34.1%),
544.5 billion yen for the laser/optical processing field (growth rate:+9.2%, component ratio: 6.1%), and
166.8 billion yen for the sensing and measuring field (growth rate:+0.2%, component ratio: 1.9%).
● FY 2016 (estimation): 7,837.3 billion yen, growth rate:−11.9%The domestic production value of the optoelectronics industry in FY
2016 is estimated to decrease significantly to 7,837.3 billion yen (growth
rate: −11.9%): 4,560.9 billion yen for optoelectronics equipment/
systems (growth rate: −12.9%, component ratio: 58.2%) and 3,276.4
billion yen for optical components (growth rate: −10.5%, component
ratio: 41.8%).
The production value by field was:441.8 billion yen for the optical communication field (growth rate:−2.0%, component ratio: 5.6%),
205.9 billion yen for the optical storage field (growth rate: −12.3%,

3

Annual Technical Report2016 OITDA

Table 1
Product Items

Optical Equipment

Optical Communications Field
Optical Communications Field

FY 2014 Shipment Actual(in million yen)
Growth Rate(%)

FY 2015 Shipment Actual(in million yen)
Growth Rate(%)

520,328–8.5

531,358

2.1

528,494–0.5

Stable202,542–23.4

169,728–16.2

144,684–14.8

StableFY 2017 Shipment
Projection

104,323–36.8

93,916–10.0

75,650–19.4

StableSubscriber Line49,825–10.3

38,339–23.1

31,879–16.8

StableRouter and Switch

31,211

12.1

25,407–18.6

25,709Video Transmission (CATV, etc)

3,180

–16.0

2,985

–6.1

3,029

1.5 Positive growth

Optical Fiber Amplifier

14,003

13.6

9,081

–35.1

8,417

–7.3

296,471

3.6

14.1

338,242

1.2 Positive growth

Stable

7.1 Positive growth362,104

Optical Transmission Link

66,1660.9

77,874

17.7

78,964

1.4 Growth

Light Emitting Device

42,00313.5

55,40531.9

67,81022.4

Photo Detectors

13,96418.2

17,07622.3

26,01152.3 Positive growth

Optical Passive Component

23,671–6.1

27,84917.7

28,7993.4

Optical Circuit Component

23,951

23.9

25,967

8.4

27,9197.5 Growth

Optical Fiber

97,058–1.6

105,6858.9

102,882–2.7 Positive growth

Optical Connector

25,952

0.6

24,402–6.0

24,089–1.3

Stable

3,706

32.1

3,984

7.5

5,630

41.3

StableOthers（Semiconductor Amplifying
Element, Composite Optical Device）
Optical Fiber Fusion Splicer
Optical Storage Field

Optical Equipment

FY 2016 Shipment Estimate(in million yen)
Growth Rate(%)

Truck Line and Metro Line

Optical Transmission Components

Optical Component

Shipment Value of the Optoelectronics Industry (Summary)

StableStable21,315

16.3

23,388

9.7

21,706–7.2

Stable1,129,820–5.0

1,053,952–6.7

954,283–9.5

Little negative–5.0

1,031,739–6.5

934,353–9.4

Nagative

1,007,038–4.6

939,653–6.7

847,423–9.8

Nagative

Read-only (CD, CD-ROM UNIT, DVD, BD)

668,848

2.5

632,965–5.4

600,579–5.1

Nagative

Recordable

338,190–16.0

306,688–9.3

246,844–19.5

Little negativeMedia

34,823–16.3

35,871

3.0

36,2331.0

StableOthers (Optical Head)

61,245–3.8

56,215–8.2

50,697–9.8

Little negative

Optical Disk

1,103,106

Equipment

26,714–5.8

22,213–16.8

19,930–10.3

Stable4,383,145

0.5

4,068,914–7.2

3,429,401–15.7

Stable3,855,762–0.9

3,491,820–9.4

2,837,630–18.7

StableStableOptical Equipment

Laser Diode
Input/Output Field
Optical I/O Equipment
Optical Printer・MFP

777,115

8.4

769,431–1.0

726,009–5.6

Digital Camera・Digital Video Camera [Note]

1,216,101－

1,092,906–10.1

890,018–18.6

StableCamera Mobile Phone

1,725,098–0.1

1,508,440–12.6

1,120,089–25.7

Little negative

121,043–11.9

Others（Bar Code Readers, Image Sensor, Tablet Computer, etc）
Image Sensor

Optical Equipment

Display and Solid-state Lighting Field
Display Equipment

137,448

101,514–16.1 Positive growth

11.4

577,0949.4

591,771

2.5 Positive growth

6,215,342–0.9

6,544,918

5.3

5,746,879–12.2 Positive growth–11.0

3,153,734

1.5

2,653,975

3,108,255

Flat Panel Display
Projector
Large-scale LED Display, etc
Display Device–8.4

527,383

2,769,525–13.7

2,826,130

2.0

2,368,043

272,170

17.0

280,299

3.0

244,62166,56025.3

47,305–28.9

2,150,864

15.5

2,372,480

10.3

41,311–15.8

Stable–16.2

Stable–12.7 Growth

Stable–12.7–14.7 Growth2,023,711

LED

377,278–6.4

357,659–5.2

372,681

4.2

Solid-state Lighting

578,94513.7

661,04514.2

696,512

5.4 Positive growth

StableLED Device

474,82815.5

553,891

16.7

598,158

8.0 Positive growth

LED Lamp

104,117

6.4

107,154

2.9

98,354–8.2

Stable4,641,830

9.8

3,733,350–19.6

2,876,685–22.9

Nagative

Photovoltaic Power System

3,151,081

17.0

2,691,860–14.6

2,036,719–24.3

Nagative

Photovoltaic Cell/Module

1,490,749–2.9

1,041,490–30.1

839,966–19.3

Nagative

Laser/Optical Processing Field

511,530

14.1

558,589

9.2

634,149

13.5 Positive growth

13.4

485,0949.6

569,918

Photovoltaic Energy Field

Optical Equipment

Laser and Optical Processing Equipment

442,515

17.5 Positive growth

CO2 Laser

70,54410.3

64,460–8.6

45,847–28.9

Solid State Laser

33,3385.1

37,00011.0

37,334

0.9

Nagative
StableExcimer Lasers

114,819–8.4

124,133

8.1

148,77819.9 Positive growth

Fiber Lasers

35,103137.5

41,65618.7

54,22330.2 Growth

Semiconductor Laser Direct Processing Equipment

2,625

8.2

2,487

–5.3

4,706

89.2 Growth

183,37621.2

211,21015.2

276,280

2,710

377.1

4,148

53.1

2,750

Lamp/LD Exposure Machine
Additive Manufacturing (3D Printer)

30.8 Positive growth–33.7 Growth

69,015

18.3

73,495

6.5

64,231

238,857

3.8

249,735

4.6

256,783

2.8 Positive growth

Optical Measuring Instrument

14,715

4.6

16,51812.3

16,304–1.3 Positive growth

Optical Sensing Equipment

224,1423.8

233,2174.0

240,479

3.1 Positive growth81,51714.5

85,066

4.4

90,318

6.2 Positive growth

Oscillators
Optical Sensing and Measuring Field

Others Field
Product Items

FY 2014 Shipment Actual(in million yen)
Growth Rate(%)

FY 2015 Shipment Actual(in million yen)
Growth Rate(%)–12.6

FY 2016 Shipment Estimate(in million yen)
Growth Rate(%)

StableFY 2017 Shipment
Projection

Sub Total for Optoelectronics Equipment

12,598,261

0.4 11,850,989–5.9 10,053,926–15.2

Little negative

Sub Total for Optoelectronics Components

5,124,108

6.4

–2.9

4,463,066–10.3

Little negative

Total for Optoelectronics Products

17,722,369

2.0 16,825,882–5.1 14,516,992–13.7

Little negative

4,974,893[Note] Digital Video Camera includes cameras for Business use from FY 2014.

Annual Technical Report2016 OITDA

4

Optoelectronics Industry Trends
Table 2
Product Items

Optical Equipment

Optical Communications Field
Optical Communications Field

FY 2014 Production Actual(in million yen)
Growth Rate(%)

FY 2015 Production Actual(in million yen)
Growth Rate(%)

439,151–14.4

450,8272.7

441,837–2.0

Stable182,514–28.2

157,828–13.5

132,815–15.8

Little negative

102,046–37.9

92,370–9.5

74,463–19.4

Little negative

Subscriber Line

47,679–9.0

37,302–21.8

31,299–16.1

StableRouter and Switch

18,949–24.0

17,951–5.3

17,547–2.3 Positive growthVideo Transmission (CATV, etc)

2,905

–15.4

2,900

–0.2

2,928

Optical Fiber Amplifier

10,935

17.4

7,305

–33.2

6,578

235,322

Stable

6.6 Positive growth287,316

39,591–21.7

49,345

24.6

49,187–0.3 Growth30,401–4.9

36,89421.4

46,23525.3

Photo Detectors

8,353

–6.4

11,04232.2

17,02454.2 Positive growth

Optical Passive Component

21,024–5.9

24,86318.3

26,184

5.3 Positive growth

Optical Circuit Component

22,692

24.1

24,237

6.8

25,981

7.2 Growth

Optical Fiber

90,552

3.3

99,98910.4

97,618–2.4 Positive growth

Optical Connector

20,354

1.3

20,299–0.3

20,252–0.2 Positive growth

2,355

345.2

2,942

24.9

4,835

64.3 Positive growth

Optical Storage Field

Optical Equipment

14.6

269,611Light Emitting Device

Optical Fiber Fusion Splicer
Optical Disk

16.3

23,388

9.7

21,706–7.2

Stable232,269–9.8

234,700

1.0

205,857–12.3

Little negative–9.8

234,700

1.0

205,857–12.3

Little negative

214,639–10.8

217,647

1.4

194,030–10.9

Little negative

180,936–10.8

184,927

2.2

179,616–2.9 Positive growth

33,703–10.8

32,720–2.9

14,414–55.9

Nagative

17,6304.4

17,053–3.3

11,827–30.6

Little negative
Stable232,269

Read-only (CD, CD-ROM UNIT, DVD, BD)
Recordable
Media
Optical I/O Equipment

1,065,828–3.5

1,084,399

1.7

1,008,146–7.0

678,898–10.5

659,051–2.9

571,842–13.2

Stable–5.2

Little negative–4.4

117,40512.3

111,276

320,665－

298,152–7.0

271,663–8.9

Little negative

190,035–32.5

187,826–1.2

139,640–25.7

Little negative

63,60645.3

55,668–12.5

49,263–11.5 Positive growth

Optical Printer・MFP

104,592

Digital Camera・Digital Video Camera [Note]
Camera Mobile Phone
Others（Bar Code Readers, Image Sensor, Tablet Computer, etc）
Image Sensor

Display and Solid-state Lighting Field
Display Equipment

386,930

11.7

425,3489.9

436,304

2.6 Positive growth

3,140,705

9.4

3,309,878

5.4

3,053,852–7.7 Positive growth–12.6

508,4631.6

514,977

500,270

1.3 Positive growth

Flat Panel Display

471,857–12.5

481,7812.1

491,851

Projector

25,054–13.8

23,466–6.3

19,629Large-scale LED Display, etc

3,359

–16.4

3,216

–4.3

3,497

1,980,084

20.6

2,075,463

4.8

1,760,257

LED

330,306–9.0

327,664–0.8

349,945

Solid-state Lighting

330,04512.4

398,28820.7

428,673

Display Device

2.1 Positive growth–16.4

Nagative

8.7 Positive growth–15.2 Growth
6.8 Positive growth
7.6 Positive growth

LED Device

318,203

15.2

387,73921.9

418,714

LED Lamp

11,842–31.2

10,549

–10.9

9,959

Photovoltaic Energy Field

Stable21,315Equipment

Input/Output Field

Optical Equipment–2.1

1.0 Positive growth–10.0

Optical Transmission Link

Others（Semiconductor Amplifying
Element, Composite Optical Device）

Optical Equipment

FY 2016 Production Estimate
FY 2017 Production
Projection(in million yen)
Growth Rate(%)

Truck Line and Metro Line

Optical Transmission Components

Optical Component

Domestic Production of the Optoelectronic Industry (Summary)

8.0 Positive growth–5.6

Little negative

3,488,824

4.4

3,030,032–13.2

2,258,811–25.5

Nagative

Photovoltaic Power System

2,980,648

11.5

2,626,198–11.9

1,968,700–25.0

Nagative

Photovoltaic Cell/Module

508,176–24.0

403,834–20.5

290,111–28.2

Nagative

Laser/Optical Processing Field

498,723

16.6

544,4749.2

618,14213.5 Positive growth

16.5

472,004

9.6

554,750

Optical Equipment

Laser and Optical Processing Equipment

430,48617.5 Positive growth

CO2 Laser

68,5998.3

62,696–8.6

43,930–29.9

Solid State Laser

29,404

13.3

32,82011.6

33,203

1.2

19.7 Positive growth

Excimer Lasers

111,096–1.5

120,776

8.7

144,531

Fiber Lasers

32,753

146.4

38,83018.6

49,94828.6 Growth

Semiconductor Laser Direct Processing Equipment

2,548

5.8

2,213

–13.1

4,601

107.9 Growth

183,37621.2

211,21015.2

276,280

2,710

383.1

3,459

27.6

2,257

Lamp/LD Exposure Machine
Additive Manufacturing (3D Printer)

Nagative
Stable30.8 Positive growth–34.7 Growth

68,23717.6

72,470

6.2

63,392

166,407

3.6

166,7630.2

171,527

2.9 Positive growth

Optical Measuring Instrument

13,476

3.5

14,403

6.9

14,455

0.4 Positive growth

Optical Sensing Equipment

152,9313.6

152,360–0.4

157,072

3.1 Positive growth

77,04911.2

75,091–2.5

79,155

5.4 Positive growth

Oscillators
Optical Sensing and Measuring Field

Others Field
Product Items

FY 2014 Production Actual(in million yen)
Growth Rate(%)

FY 2015 Production Actual(in million yen)
Growth Rate(%)–12.5

StableFY 2016 Production Estimate
FY 2017 Production
Projection(in million yen)
Growth Rate(%)

Sub Total for Optoelectronics Equipment

5,511,010

3.2 5,236,134–5.0 4,560,888–12.9

Little negative

Sub Total for Optoelectronics Components

3,597,946

5.7 3,660,030

1.7 3,276,439–10.5

Little negative

Total for Optoelectronics Products

9,108,956

4.1 8,896,164–2.3 7,837,327–11.9

Little negative[Note] Digital Video Camera includes cameras for Business use from FY 2014.

5

Annual Technical Report2016 OITDA

Total Shipment (Trilion yen)

60
50

1.8

40

9.4

1.7

0.0
-1.8

3.3

5.2
30

-11.3

20

-0.8

1.5

2.3

-11.2
2.0

15.3

Nominal GDP (1/10) *1

8.7

-8.9

5.8

10

1.5

-5.1

-5.7

-13.7

Domestic and Overseas Production of Japanese Electronics Companies *2
Total Shipment of Japanese Optoelectronics Companies

0

2010

2009

2011

2012

2013

2014

Fiscal Year

2015

2016
Estimate*1 FY2016 GDP data/FY2017 Econominal Outlook (Dec.2016) [Cabinet Decision]*2 Production Forecasts for the Global Electronics and Infomation Technology Industries, JEITA, Dec. 21, 2016

Figure 1

Changes in Total Shipment Value of Optoelectronics, Nominal GDP and Electronics Production

estimated to continue to decrease significantly due to changes in the
FIT and the falling purchase price.
(2) Changes in the Proportions and Contribution Ratios for the
Total Shipment by Field in the Optoelectronics Industry
Figure 3 shows the changes in the proportion of the total shipment
value of optoelectronics products by field over the five years from FY
2012 (actual results) until FY 2016 (estimate), while Figure 4 shows
the changes in the contribution ratio for changes in the increase/decrease
in total shipment of optoelectronics products for each field.
From the proportions by field (Figure 3), we can see that thephotovoltaic energy field grew in FY 2013, whereas the display andsolid-state lighting field declined.

trunk lines, metro lines, and subscriber lines is estimated to decreasesignificantly. Meanwhile, optical transmission components such as lightemitting/photo detection devices, etc. are estimated to remain steady.
In the display and solid-state lighting field, the solid-state lighting fieldis estimated to remain strong due to the growing awareness to saveenergy. The display field including display devices is projected todecrease significantly due to the slower growth of 4K TV sets, declining
prices due to the globally intense competition, and decrease in demandfor iPhones in the global market. The input/output equipment field isestimated to decrease as a whole due to a significant decrease in sales
related to digital cameras. The optical storage field is estimated todecrease due to the shrinking market. The photovoltaic energy field is

Shipment Value of each ﬁeld (Trillion yen)

9.0

Display and Solid-state
Lighting
Input/Output

8.0

Optical Storage

7.0

Photovoltaic Energy

6.0

Optical Communication

5.0

Laser/Optical Processing

4.0

Sensing and Measuring

3.0
2.0
1.0
0.0
09

10

11

12

13

14

Fiscal year

Figure 2
Annual Technical Report2016 OITDA

15

16
Estimate

Changes in Total Shipment Value by Each Field

6

Optoelectronics Industry Trends
100%

2.5%
3.6%

Propotional ratio of total shipment

90%
80%

8.7%
14.9%

70%
60%
50%

2.6%
3.3%
6.8%

2.9%
2.9%
6.4%

3.3%
3.2%
6.3%

4.4%
3.6%
6.6%

24.3%

26.2%

22.2%

19.8%

0.6%
1.8%

OthersSensing and Measuring

26.9%
25.1%

23.6%

24.2%

24.7%

Laser/Optical Processing
Optical Storage

40%

Optical Communication

30%
20%

Photovoltaic Energy
41.5%

36.1%

39.6%

38.9%

35.1%

Input/Output
Display and Solid-state Lighting

10%0%FY2012
15,115
Billion yen

FY201317,369Billion yen

Figure 3

FY2014
17,722
Billion yen

FY2015FY2016 Estimate
16,826
14,517
Billion yen
Billion yen

Changes in Proportion of Total Shipment Value by Each Field

In FY 2014, the photovoltaic energy field switched places with the
input/output equipment field in shares and leapt into second position.
However, the input/output equipment field returned to second place dueto the decline in the share of the photovoltaic energy field in FY 2015.
The share of the photovoltaic energy field is estimated to further decrease
in FY 2016.
The contribution ratio by field (Figure 4) shows that the photovoltaic
energy field recorded large positive growth, and the display and solidstate lighting, optical communication, laser/optical processing, andsensing and measuring fields inverted to positive in FY 2013. The othertwo fields were negative.
In FY 2014, the display and solid-state lighting, photovoltaic energy,

2,500

Diﬀerence Balance (Billion yen)

2,000
1,500
1,000

laser/optical processing, and sensing and measuring fields maintained
positive growth but the other three fields turned negative. In particular,
growth was substantially inhibited in the photovoltaic energy field.
In FY 2015, the display and solid-state lighting, laser/opticalprocessing and sensing and measuring fields maintained positive growth
but the growth rate decreased significantly. The optical communication,
optical storage and input/output equipment fields remained negative.
In FY 2016, only the laser/optical processing and sensing and measuring
fields are estimated to achieve positive growth, and the display andsolid-state lighting and photovoltaic energy fields are estimated to besignificantly negative.

2,254.2 Billion yen

ディスプレイ・固体照明分野
入出力分野
太陽光発電分野
情報通信分野情報記録分野レ－ザ・光加工分野
センシング・計測分野
その他分野
光製品 合計500
0-500-1,000

Display and Solid-state Lighting
Input/Output
Photovoltaic Energy
Optical Communication
Optical Storage
Laser/Optical Processing
Sensing and Measuring
OthersTotal
6 ,9 82億円

2 3 ,059億 円

353.0 Billion yen

2FY20120 1 1年度実績▲ 1 ,2 9 1億円-906.7 Billion yen

2 0 1FY2013
2 年 度実 績

2 0FY2014
1 3 年 度実 績

2 0FY2015
1 4 年 度 実績

FY2016
Estimate
2 0 1 5 年度
見込

6,815億円▲ yen-896.5 Billion▲ 9 ,0 6 7億円-1,500-2,000-2,308.9 Billion yen-2,500Figure 4

Changes in Contribution Ratio of Total Shipment Fluctuations in Optoelectronics Products for Each Field

7

Annual Technical Report2016 OITDA

0.8 0.2 0.5 0.7

1.0

25

-1.8

1.8
-0.7
7.0

20

-3.5
-12.0

1.7 1.5

0.0

-1.8

-3.2

-0.8
-7.9

14.0

Numeral: Growth ratio comparedto the preceding ﬁscal year
29.2 1.1 0.1

Nominal GDP (x1/20) *1

10Domestic Electronics Production *2

11.2

Domestic Optoelectronics Production

5

0

-4.6

6.5

2.3

-18.2

15

2.5
8.7 1.5

0.8

2.7

5.3 0.6

-26.9

-10.7
7.3

-16.7

-9.5

5.2

2.6

-15.0

-10.5

-2.0

-1.5

-6.1

4.1

21.8

-2.3

-11.9

-15.1

80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 00 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17

Fiscal yearEst
Pre imatediction

Domestic Production (Trillion yen)30

*1 FY2016 GDP data/FY2017 Economical Outlook (Dec.2016) [Cabinet Decision]*2 Production Forecasts for the Global Electronics and Infomation Technology Industries, JEITA, Dec. 21, 2016

Figure 5

Changes in Domestic Optoelectronics, Electronics Production, and Nominal GDP

2.5	Trends in Domestic Production for the Optoelectronics Industry(1) Changes in Domestic Production for the Optoelectronics
Industry
Figure 5 shows the changes in domestic production from FY 1980
to FY 2016 with the nominal GDP (1/20 of the actual value) and thedomestic output of the electronics industry.
Output for the optoelectronics industry was around 80 billion yen in
FY 1980 when our survey on domestic production value started, andgrew in the 80s along with Japanʼs economy. In 1991, it accounted for
one-tenth of the domestic production value for the electronics industry,

and consistently maintained positive growth, exceeding the 7 trillion
yen level in FY 2000. Affected by the IT recession, the optoelectronics
industry recorded negative growth in FY 2001 for the first time since
the survey started. After a rapid recovery, it approached the 10 trillion
yen level in FY 2003, and from there on has been greatly affected by
the macro economy, showing changes linked to GDP and the electronics
industry. Until FY 2007 it grew slowly, but affected by the global
financial recession from FY 2008 to FY 2009, it experienced twoconsecutive years of negative growth. The partial recovery trend seen
in FY 2010 lost steam, and again has been negative in FY 2011 to FY

Domestic Production (Trillion yen)

4.5
Display and Solid-state Lighting

4.0

Input/Output
Optical Storage

3.5

Photovoltaic Energy
Optical Communication

3.0

Laser/Optical Processing
Sensing and Measuring

2.5
2.0
1.5
1.0
0.5

Fiscal year

Figure 6
Annual Technical Report2016 OITDA

Changes in Domestic Optoelectronics Production by Each Field8

ate

91 92 93 94 95 96 97 98 99 00 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16
Es
tim

0.0

Optoelectronics Industry Trends
2012. However, in FY 2013, the economy recovered due to the effectsof Abenomics, as indicated by the 1.7% nominal GDP growth and theincrease in capital investment and general consumption, and the domestic
production value for the entire optoelectronics industry grew substantially(21.8%) for the first time in years. In FY 2014, the production also
increased by 4.1% compared to FY 2013.
In FY 2015, production decreased by 2.3% for the first time in three
years due to the significant decrease in the photovoltaic energy field.
In FY 2016, five fields including photovoltaic energy are estimated tobe negative with a significant decrease by 11.9%.
Figure 6 shows the changes in domestic production of optoelectronics
products for each field over the 22 years from FY 1995 (actual results)
until FY 2016 (estimate) (seven fields, excluding “Other”).
During the 1990s, there was favorable growth in displays, input/output
equipment, optical communications, and optical storage fields, withdomestic production for each increasing to over 1 trillion yen in the year
2000. In the laser/optical processing, sensing and measuring, andphotovoltaic energy fields, they also had performed favorably in the
1990s although the production value was less than 500 billion yen.
However, developments in each field showed significantly different after
the IT bubble burst in 2001.
There was not much decline in the input/output equipment field in
FY 2001, and it also remained steady from FY 2002 onwards, but it
started showing negative growth from FY 2008 onwards. In FY 2011,
although it finally started showing signs of bottoming out, by FY 2012and even in FY 2013 it followed a path of negative growth. In FY 2014,
however, the trend stayed almost flat. The display and solid-state lighting
field continued to grow favorably despite some fluctuations, peaked in
FY 2010, and then nosedived. In particular, the domestic production
value for flat display devices in the two years from FY 2011 decreasedby almost 80%. On the other hand, the solid-state lighting field, which
stands out in this field, attained three-digit growth in FY 2011 anddouble-digit growth in FY 2012. For FY 2013, although the values are
not comparable with values from the previous year because of the
100%

3.2%
5.2%

Proportional Ratio of Domestic Production

90%

2.2%

6.7%

2.9%
4.9%

1.8%

changes in the aggregation method, production itself seems to be steadily
increasing until FY 2016. However, the overall production is estimatedto decrease significantly due to the decrease in the demand for TV sets
and falling price, etc.
Recently, the photovoltaic energy field has been leading growth inthe optoelectronics field, and has been rising rapidly since FY 2008. In
particular, since the introduction of Feed in Tariff (FIT) in July 2012,production for the power industry grew substantially, and this fieldshowed the highest proportion of the domestic production value in FY
2013. (Customarily, the display and solid-state lighting field has been
the highest.) However, the growth rate dropped sharply in FY 2014,
resulting in a significant decrease in FY 2015. Production is estimatedto continue to decrease significantly in FY 2016.
The optical storage field is continuing its prolonged decline. It fell
below 250 billion yen in FY 2012 (−40.4%) but rebounded tosignificantly increase by 17.1% in FY 2013. However, it reversed to a
decline of −9.8% in FY 2014, and remained steady with an increaseof 1.0% in FY 2015. In FY 2016, it is estimated to decrease significantly
again by 12.3%.
Optical communications, laser/optical processing, and sensing andmeasuring, which are mainly related to the domestic market, are easily
influenced by domestic economic conditions and capital investments,
are reflecting the trends in the economic conditions, and grew
substantially in FY 2013. In FY 2014, the laser/optical processing fieldgrew significantly by 16.6%, and the sensing and measuring field grewslightly by 3.6%. These two fields showed a similar trend in FY 2015
and later.
Optical communications had a negative growth of −14.4% in FY
2014 due to underperformance in trunk and metro lines, etc. In FY 2015,
optical transmission equipment/system was negative, but components
were strong, resulting in an overall increase of 2.7%. It is estimated toremain almost flat in FY 2016.

1.8%

2.5%
5.5%

2.6%
6.1%

5.9%

4.8%

5.1%

38.2%

38.3%

34.1%

80%
70%

27.2%

60%

1.9%

2.6%

2.2%

7.9%
5.6%

28.8%
OthersSensing and Measuring
Laser/Optical Processing

50%
20.3%

40%

12.6%

11.7%

12.2%

12.9%

Optical Storage
Optical Communication
Photovoltaic Energy

30%

Input/Output

20%

34.2%

32.8%

34.5%

FY2012
7,178.3
Billion yen

FY20138,746.3
Billion yen

FY2014
9,109.0
Billion yen

37.2%

39.0%

Display and Solid-state Lighting

10%0%

Figure 7

FY2015 FY2016 Estimate
7,837.3
8,896.2
Billion yen Billion yen

Changes in the Proprtion of Domestic Optoelectronics Production by Each Field

9

Annual Technical Report2016 OITDA

Diﬀerence Balance (Billion yen)

1,600

1,568.0 Billion yen

Display and Solid-state Lighting

1,400

Input/Output

1,200

Optical Communication

Photovoltaic Energy
Optical Storage

1,000

Laser/Optical Processing

800

Sensing and Measuring
Others

600

Total

400
200
0
-200

362.7 Billion yen
FY2012-107.9 Billion yen

FY2013

FY2014FY2015FY2016 estimate-212.8 Billion yen

-400
-600
-800
-1,000-1,058.8 Billion yen-1,200Figure 8

Changes in Contribution Ratio of Domestic Optoelectronics Production Fluctuations for Each Field(2) Changes in the Proportions and Contribution Ratios for theDomestic Production by Field in the Optoelectronics Industry
Figure 7 shows the changes in the proportion of products for thefields comprising the domestic production value for the optoelectronics
products over the five years from FY 2012 (actual results) until FY 2016
(estimate), while Figure 8 shows the changes in the contribution ratio
for changes in the domestic production of Optoelectronics products foreach field.
Looking at Figure 7 showing the proportion by field, three fields(display and solid state lighting, input/output equipment, and photovoltaic
energy) account for approximately 80% of the whole, but due to thedifference between the extents of recovery after the FY 2009 global
recession, the proportions have been changing drastically. The
photovoltaic energy field has continued to rise very rapidly due to FIT
and the excess power purchase system, subsidies, etc.; it leapt to the top
in FY 2013. In the display and solid-state lighting field, due to the
response to the vigorous demand before the complete transition to digitalterrestrial broadcasting (DTB) in 2011, the stronger yen, as well as theshift towards overseas production due to continuously declining prices,the domestic production of flat display devices fell nearly 80% in two
years. On the other hand, solid-state lighting has continued to growrapidly due to the growing awareness of energy conservation, but thisdid not fully compensate for the decline in the display field, and as a

Annual Technical Report2016 OITDA

result, its component ratio fell by 1.4% from FY 2012 to FY 2013. In
FY 2015, its component ratio returned to the top position due to thedecrease in the photovoltaic energy field. In FY 2016, it decreased
significantly, but the photovoltaic energy field also decreased
significantly. Thus, its component ratio is estimated to continue to beat the top.
The input/output equipment field is estimated to decline by 7.4%
from FY 2012 to FY 2016, due to the slump in the market for devices
such as digital cameras and camera phones.
Regarding the contribution ratio for each field (Figure 8), thephotovoltaic energy field showed a strong positive contribution in FY
2013. Only the input/output equipment field was negative. By field, thedisplay and solid-state lighting field inverted to positive in FY 2013,
but is estimated to be significantly negative in FY 2016.
The input/output equipment field finally showed signs of recovery
in FY 2014. It turned slightly positive in FY 2015, but is projected tobe negative again in FY 2016.
The optical communication and optical storage fields turned positiveslightly in FY 2013, but inverted to negative in FY 2014 again. They
showed slight positive growth in FY 2015, but are estimated to be
negative again in FY 2016. Although the amount is small, the laser/
optical processing and sensing and measuring fields are estimated toincrease steadily in FY 2016.

10

Technological Strategy Development
1. Introduction

Note that, for the same automated driving level, the technology level
required for expressways is significantly lower than that for generalroads. On expressways, the types of targets to be recognized are limited
because only vehicles should be handled as dynamic targets in principle,
thus requiring a small sensing angle. The time required for emergency
avoidance can be also longer than that on general roads if an appropriate
distance is kept from the preceding vehicle, although long-distancesensing is required.
On general roads, on the other hand, there are many types of targets
to be recognized, such as vehicles, pedestrians, and animals. The moving
pattern and speed are different depending on the target, requiring wideangle sensing. Given the possibility of pedestrians rushing suddenly
into the road, etc., the time for emergency avoidance should be shortalthough the sensing distance can be short.
In general, the technology level required for automated driving on
general roads is higher, and so the deployment of automated driving on
general roads is anticipated to take longer than on expressways. Thus,
we presumed that the Level 3 automated driving on expressways would
be deployed by 2025, Level 3 automated driving on general roads by
2030, and Level 4 fully automated driving in 2031 or later.
In Figure 9, system technologies required for each automated driving
level are summarised. It is noteworthy that after the deployment of fully
automated driving, vehicles are expected to be used in unconventionalways, and new businesses that utilize the network of automated driving
systems and the cabin space during travel are expected to emerge because
the fully automated driving does not need driverʼs intervention.
In Figure 10, optoelectronics technologies and specifications necessary
for achieving respective system technologies are mapped into three
categories with the timing of deployment: sensor technologies for detecting
the situation outside the vehicle, human machine interface (HMI)
technologies for providing external information to the driver or enabling
the vehicle to monitor the driverʼs cognitive performance, andcommunication technologies outside or inside the vehicle.

Since 1996, OITDA has undertaken “Optoelectronics Technology
Roadmap Development” activities, with the aim of ascertaining the future
growth of the optoelectronics industry, and seeking a direction for
optoelectronics technology R&D. These activities have become one ofthe platforms for launching many national projects in the fields of opticalcommunication, optical storage, displays, light energy and laser
processing, and have contributed extensively to the development of the
Optoelectronics industry and technology. In the roadmap development,
we took an approach to take social needs as a starting point, that is, wefirst envisioned the future of society in order to anticipate social needs
and issues, and then identified the technologies required to solve theissues.
In FY 2016, “Automotive Photonics” was selected as a theme of theroadmap, focusing on automated driving which has witnessed significant
technology innovation and has attracted much public attention withgrowing expectations in recent years. The Automotive Photonics
Technology Roadmap Committee was established, consisting of eight
experts in this field from industry and academia. The committee
investigated the current status and future outlook of optoelectronics
technology for advancing automated driving technologies, and formulated
the “Automotive Photonics” technology roadmap.

2. “Automotive Photonics” Technology Roadmap

An overview of the “Automotive Photonics” technology roadmap isshown in Figure 9 and Figure 10.
Automated driving can be classified into five levels (including thelevel at which no driver assistance is available) based on the system
automation level and the extent of responsibility transferred to thesystem. In the roadmap, needs are indicated by the level of automateddriving. As commercial vehicles are equipped with Level 2 systems asof 2016, we identify the required technologies from Level 3 at which
the system performs all the operations (acceleration, steering, andcontrol) and the driver takes action when requested by the system.

～2025

2016
Target(Needs)

Deployment of Level 3
automated driving[Expressways]～2030

Deployment of Level 4
fully automated driving
Businesses that utilize
the network of automated driving
systems or the cabin space
during travel

Advanced driving judgmentby the vehicle

Advanced driving
judgment/control by the vehicle

External sensing (object recognition)

Systemtechnology

Collection andtransmission of probe data

Low-latency collection andtransmission of probe data

Data reception
from the traﬃc network

V2V/V2P
data communication

Monitoring of the driver’s status

Alertness of driver

Information regarding the driver’s
understanding of the vehicle status

Real-time mapping
technology
Judgment support system for
integrated traﬃc networkthat utilizes information frommultiple vehicles and pedestrians

Information regarding the vehicle
and status around the vehicle presented to the driver
FOV presentation from multiple points

Figure 92031～

Deployment of Level 3
automated driving[General roads]

Entertainment for occupants

Automotive photonics technology roadmap (system technology)

11

Annual Technical Report2016 OITDA

2016
Target(Needs)Sensor requirements
speciﬁcation①Recognition technology
CameraSingle-camera
technology

SensorMultiple-camera
technology

Technology～2025(Angle of view)

Scanning type

Array type
Data rate

Forward: 20° or more (H), 15° or more (V)Rear: 20° or more (H), 15° or more (V)

4K2K, 60 fps

8K4K, 60 fps

6 cameras (forward, rear, side×4): 4K2K,
60 fps, 24 bpp (total rate: 84 Gbps)

1500 kbps @2K1K(H.265)

8K4K, 60 fps

2K1K, 60 fps

1500 kbps～1000 kbps @2K1K
6000 kbps～4000 kbps @4K2K

6 cameras (forward, rear, side×4): 8K4K,
60 fps, 24 bpp (total rate: 332 Gbps)
1200 kbps～800 kbps @2K1K
4800 kbps～3200 kbps @4K2K
19200 kbps～12800 kbps @8K4K

Processing system capable of recognition and judgment with latency of 100 ms or lessAccurate synthesis and mapping of camera images from diﬀerent positions during cruising(Maximum distance)

200 m(Resolution)
1024 pt×16 pt×30 fps(View)
360° H/15° V(Maximum distance)
50 m

2048 pt×32 pt×60 fps
360° H/30° V
100 m

200 m

(Resolution)
128 pt×32 pt×30 fps
60° H/15° V(View)
100 Mbps/sensor

512 pt×128 pt×60 fps
120° H/30° V
1 Gbps/sensor

1024 pt×256 pt×100 fps
120° H/30° V
10 Gbps/sensor

Detection of line of sight andNon-contact detection of vital data (brain wave, heart rate) (wearable)
Expressways: 10 s, general roads: 5 s(display resolution: UXGA)Technology to present (display resolution: SXGA)
the traﬃc environment
Vehicular projection mapping/advanced FOV (Field of View): Viewpoint (1)1 Gbps Ethernet (metal/optical)
Obstacle detection image compression (－500 Mbps)
Safe driving support (－100 Mbps)

Wide-area network

Figure 10

Annual Technical Report2016 OITDA

Deployment of Level 4
fully automated driving
Businesses that utilize the networkof automated driving systems
or the cabin space during travel

360° (H), 30° or more (V)

4K2K, 60 fps

Technology to monitor posture/judgment of the status posture/judgment of the status(General roads) Judgment time: 1.4 s(Expressways) Judgment time: 4 s
the driver’s cognitive
General roads: HUD function,
performance Expressways: Utilization of HUD functions
bird’s-eye view

In-vehicle network

2031～

Forward: 200 m, side: 10 m, rear: 130 m(Visible light camera)(RGB + IR camera)(FIR camera)
2 cameras (forward, rear): 2K1K,
60 fps, 24 bpp (total rate: 7 Gbps)

Detection of line of sight and

HMI

Deployment of Level 3
automated driving[General roads](Measurement distance)

Image compression
technology
Image recognition
technology
Real time synthesizing
technology of multiple images②Distance measuring technology
LiDAR

Communication～2030

Deployment of Level 3
automated driving[Expressways]

100 Gbps Ethernet (optical/metal)
Recognition of obstacles (pedestrians), uncompressed image (－84 Gbps)
Comfortable driving support (－1 Gbps)

400 Gbps/Link (optical)

1.6 Tbps/Link (optical)

Multiple viewpoints (5)400 Gbps Ethernet (optical)
High-speed/high-deﬁnition image (uncompressed) (－332 Gbps)
Proposal of a comfortable cabin space during travel (－10 Gbps)
6.4 Tbps/Link (optical), multicore ﬁber

Automotive photonics technology roadmap (optoelectronics technology)

12

Standardization
1. Introduction

Table 3 Activities at the IECmeetings in FY2016（TC 86/SC 86C/WG 2）Standardization has been one of OITDAʼs major activities since its
establishment, and has been promoted broadly across the optoelectronics
industry. OITDA standardization efforts are mainly focused on the opticaltransmission field, but they also include several fiber optics application
fields and lasers. Besides working for domestic standardization(JIS,OITDA standards and Technical papers), OITDA is also working on
international standardization such as IEC and ISO through field specificmeetings in order to respond quickly to the fast changing industrial
structure.
Discussed below are the results of OITDAʼs international
standardization activities at IEC, ISO, and IEEE and trends in FY 2016,as well as OITDAʼs activities in three international standardization
projects contracted by the Ministry of Economy, Trade and Industry,
etc.: “international standardization/dissemination of large-diameter
multimode optical fiber connectors and their communications
performance,” “international standardization of fiber optic connector
optical interfaces for fiber PC connectors,” and “international
standardization of test procedures for highly laser-resistant laser guards.”

Date

May
30
2016

Place

Documents

IEC 61757-1 Ed.3：Fibre optic sensors-Part1:
Generic speciﬁcation
IEC 61757-2-1 Ed.1: Temperature sensors basedLimerick on ﬁbre Bragg gratings（Ireland） Distributed ﬁbre strain sensors
Distributed ﬁbre acoustic sensors
Current measurement ‒ Polarimetric current
Measurement

IEC 61757 Ed.1：Fibre optic sensors-Part1:
Generic speciﬁcation
IEC 61757-2-1 Ed.1：Temperature sensors basedOcton ﬁbre Bragg gratings
Frankfurt
1
Strain measurement ‒ Distributed strain（Germany）
2016
measurement
Acoustic sensing ‒ Distributed acoustic sensing
PNW IEC 61757-4-3 Current measurement–
Polarimetric current Measurement

2. IECThe document for optical fiber current sensors was subject to NP
voting in February 2017, and approval was given to develop the standard.
Japan was approved to serve as the project leader in WG 2. IEC 617574-3 Ed.1 (Fibre optic sensors - Part 4-3: Optical current sensors basedon the polarimetric method) will be officially reviewed at the IEC
meeting.

2.1 Fiber Optics Standardization
2.1.1 Dynamic Module (IEC TC 86/SC 86C/WG 5)
Six IEC deliberation documents were reviewed: IEC 62343 Ed.2
(Dynamic modules – General and guidance), IEC 62343-3-4 (Dynamic
modules - Part 3-4: Performance specification templates - Multicast
optical switches), IEC 62343-5-2 (Dynamic modules - Part 5-2: Test
methods - 1xN fixed-grid WSS - Dynamic crosstalk measurement), IEC
TR 62343-6-4 (Dynamic modules - Part 6-4: Design guides Reconfigurable optical add/drop multiplexer), IEC TR 62343-6-6(Dynamic modules - Part 6-6: Design guide - Failure mode effect analysis
for optical units of dynamic modules), and IEC TR 62343-6-10 (Dynamic
modules - Part 6-10: Design guide - Intermediate controller for multiple
dynamic module systems).
These six documents were reviewed at the Frankfurt meeting in
October 2016. Based on the questionnaire results reported from Japan,
it was agreed to prepare a template for reliability test items and atechnical report on the MCOS control interface.

2.2 Optical Fibers
2.2.1 Optical Fibers (IEC TC 86/SC 86A/WG 1)
At the IEC SC 86A/WG 1 Frankfurt meeting in October 2016, active
discussions were held regarding the change of names of optical fibers(IEC 60793-2-10, IEC 60793-2-50). A policy was established to change
the indication of A1 multimode optical fibers to A1-OMx and theindication of B single-mode optical fibers to B.65x.
Regarding the existing documents, discussions were held to add thespecifications of wideband multimode fiber (WBMMF) (wavelength
range used: 850–950 nm) to IEC 60793-2-10 (Optical fibres - Part 2-10:
Product specifications - Sectional specification for category A1
multimode fibres). Regarding IEC 60793-2-50 (Optical fibres - Part
2-50: Product specifications - Sectional specification for class B singlemode fibres), progress was made in handling of the capability to remove
the coating of 200 μm coated optical fibers. It was agreed that in-depth
discussions will be continuously held in the Correspondence Group(CG).
Regarding the polarization-maintaining optical fibers, continuous
efforts were made to achieve IEC standardization of the enacted JIS.
Specifically, it was agreed to use IEC 60793-2-70, IEC 60793-1-60, andIEC 60793-1-61 (i.e., IEC drafts corresponding to JIS C 6873
[Polarization-maintaining optical fiber], JIS C 6840 [Polarization
crosstalk measurement of optical fiber], and JIS C 6872 [Beat length
measurement of polarization-maintaining optical fibers]) as a Committee
Draft for Vote (CDV) at the Arlington meeting in May 2016. The
documents were approved by voting based on the CDV in December,and the International Standard (IS) was published in February 2017.

2.1.2 Optical Fiber Sensors (IEC TC 86/SC 86C/ WG 2)
The review of IEC 61757-1-1 (Fibre optic sensors - Part 1-1: Strain
measurement - Strain sensors based on fibre Bragg gratings) and IEC
61757-2-2 (Fibre optic sensors - Part 2-2: Temperature measurement Distributed sensing) started two years ago. These two documents were
published in February and May 2016, respectively. The review of IEC
61757-1 (Fibre optic sensors - Part 1: Generic specification) also started
because the numbers assigned to the standards were reorganized in thecourse of reviewing these two documents.
Meanwhile, Japan proposed IEC standardization for the optical fiber
current sensors which have been introduced in the electricity market in
Japan, in order to promote application of these sensors in other markets.
New proposals were made by other countries regarding IEC 61757-2-1(Fibre optic sensors - Part 2-1: Temperature measurement - Temperature
sensors based on fibre Bragg gratings), IEC 61757-1-2 (Fibre optic
sensors - Part 1-2: Strain measurement - Distributed sensing), IEC 617573-2 (Fibre optic sensors - Part 3-2: Distributed acoustic sensing), etc.
The submeeting and IEC/TC 86/SC 86C/WG 2 are expected to become
increasingly active (Table 3).

2.2.2 Optical Fiber Cables (IEC TC 86/SC 86A/WG 3)
At the IEC SC 86A/WG 3 Frankfurt meeting in October 2016, progress
was made in developing IEC 60794-1-31 (Optical fibre cables Part 1-31:
Sectional specification for cable element - Optical fibre ribbons) underJapanʼs initiative and it was agreed to circulate the 2nd CD. Discussions
were also held regarding the optical cable standard for outdoor/indoor
shared fiber cables which had been agreed to be standardized at the13

Annual Technical Report2016 OITDA

previous meeting.
Regarding the revision of existing documents, the optical cable test
methods and specifications for optical cable family were reviewed. It
was agreed to make efforts to publish an amendment for the opticalcable mechanical test methods (including the test method for the friction
coefficient between cables as proposed by Japan) at an early stage.
China made a new proposal regarding the family specifications forthe aerial optical cables along power transmission lines. These Optical
Phase Power Conductor (OPPC) cables can be used at high voltages far
exceeding that of the Optical Ground Wire (OPGW), and arecharacterized by high reliability and low cost. It was decided to holddiscussions in the CG by the next meeting.

optical passive components including optical connectors and closures.
In that series, IEC 61300-2 series describes test procedures, and IEC
61300-3 series describes measurement procedures.
At the Locarno meeting in April 2016, nine documents were reviewed
and five presentations were given. The meeting proceeded smoothly,reflecting Japanʼs standards and opinions. It was agreed that the testingof the strength of mounted adaptors proposed by Japan should proceed
to CDV. Japanʼs commitment was well accepted.
At the Frankfurt meeting in October 2016, nine documents werereviewed and five presentations were given. The meeting proceededsmoothly, reflecting Japanʼs standards and opinions. It was agreed thatthe testing of the strength of mounted adaptors proposed by Japan should
proceed to FDIS. Regarding the measurement of the angular
misalignment between bore and axes of cylindrical ferrules, clarificationof the measurement uncertainty was required before CDV. Action will
be taken in cooperation with the U.S.

2.3	Fiber Optic Connectors and Optical Passive Components (IEC TC 86/
SC 86B)
2.3.1 Fiber Optic Connectors (IEC TC 86/SC 86B/WG 6)
At the Locarno meeting in April 2016, NC comments were resolved
for the Japan-related documents. Progress was made such as approvalof the draft documents for the next stage, etc.
Regarding the mechanical interface standard for the two-row MPO
connectors, it was agreed to change the spring force in the rejected FDIS
draft to 20 N for CDV.
Regarding the general and guidance for the fiber optic interconnecting
devices and the passive components performance standard (IEC 617531), comments were resolved, and it was agreed to revise the 2nd CD andcirculate the 3rd CD.
At the Frankfurt meeting in October 2016, Japan-NC comments for
one Japan-related document (optical compatibility) were resolved, andit was agreed to develop an IS. Explanations were given about two draft
CDs (mechanical interface standards), and it was agreed to circulate theCDs.
In the process of resolving comments for IEC 61753-1, the toleranceof loss variation during testing was discussed. It was agreed to reflect
Japanʼs proposals for CDV.
Corning proposed that a grade without core alignment be added to
the IEC 61755-3 series. It was decided to hold discussions among
stakeholders. Votes will be cast to decide whether the CD should becirculated at the next meeting.
Regarding the rigorousness of the connector endface standard, a
proposal was made to set the same conditions of Zone B for the gradesof respective sales companies. Japan maintained that the contamination
condition differs depending on the reflection amount. It was decided to
conduct a review again.

2.4 Optical Amplifier (IEC TC 86/SC 86C/WG 3)
Japan submitted a new IEC draft document based on OITDAʼs new
standard published in the last fiscal year regarding the test methods forgain transient parameters – single channel optical amplifiers in gain
control.
Regarding the IEC technical report (IEC/TR 61292-3) on theclassification, characteristics, and applications of optical amplifiers, it
was decided to revise the TR, including a significant change in the
document organization and additional descriptions on array amplifiers,
space-division multiplexing amplifiers, and remote optically pumped
optical amplifier, etc. Japan proposed a draft of contents for this revisionat the IEC meeting.
2.5	Optical Amplifier and Optical Active Device (IEC TC 86/SC 86C/WG 3-WG 4)
Regarding the gain ripple measurement method for semiconductor
optical amplifiers (SOAs) which had been jointly reviewed from the last
fiscal year by the Optical Amplifier Standardization Meeting, Optical
Active Device Standardization Meeting, and IEC/SC 86C/WG 3 andWG 4 domestic committee, Japan proposed a plan to add the SOA gain
ripple evaluation items to IEC 61290-1-1 (Optical amplifiers - Test
methods - Part 1-1: Power and gain parameters - Optical spectrum
analyzer method) at the IEC/SC 86C/WG 3-WG 4 Frankfurt joint
meeting in October 2016, and the plan was approved. The proposal
documents are being prepared and will be submitted early in the next
fiscal year.

2.3.2 Optical Passive Components (IEC TC 86/SC 86B/WG 7)
WG 7 (optical passive components) reviews the generic specifications,performance standards, reliability documents, technical specifications,and technical reports. This year, the generic specifications for opticalisolators were published. The performance standards for pigtailed-style
fixed optical attenuators (Categories U and C) and cyclic-frequency
AWG (Categories C and O) were also published.
Regarding the technical specifications, IEC TS 62627-09 (in which
common terminology proposed by Japan was defined) was publishedin October 2016. As of February 2017, the working group reviewed
three circulation documents including maintenance documents (onedocument each on general specifications, performance standards, andreliability).

2.6 Optical Subsystem (IEC TC 86/SC 86C/WG 1)
At the IEC/TC 86/SC 86C/WG 1 Frankfurt meeting in October 2016,
Japan proposed a revision of IEC 61281-1 (Fibre optic communication
subsystems - Part 1: Generic specification) (e.g., addition of terminology
and transmission characteristics parameters). Japan serves as the project
leader of the revision process.
CDV circulation of IEC 61280-4-4 (Fibre optic communication
subsystem test procedures - Part 4-4: Cable plants and links - Polarization
mode dispersion measurement for installed links), which reflectedchanges based on Japanʼs findings regarding the omission of a diagram,etc., was closed before the Frankfurt meeting. It was confirmed that anagreement was reached without any comments.
2.7 Optical Measuring Instrument (IEC TC 86/WG 4)
Toward the standardization of the IEC 62129-3 Ed.1.0 (Calibrationof wavelength/optical frequency measurement instruments - Part 3:
Optical frequency meters using optical frequency combs) on which an
agreement was reached at the Gwangju meeting in 2015 based on Japanʼs

2.3.3	Standard Tests and Measurement Methods for Fiber Optic Connectors
and Optical Passive Components (IEC TC 86/SC 86B/WG 4)
Test and measurement procedures standardized under the IEC 61300
series have been established for fiber optic interconnecting devices andAnnual Technical Report2016 OITDA

14

Standardization
proposal, Japan prepared the 1st CD as the project leader and comments
were received from respective countries. The document and comments
were reviewed at the Frankfurt meeting in October 2016. It was agreed
to prepare the 2nd CD following the modification of the 1st CD and tocontinue the discussion in 2017 and beyond.
Regarding the revision of other existing documents, discussions were
held on the revision of IEC 61315 Ed.3.0 (Calibration of fibre-optic
power meters) and IEC 61745 Ed.2.0 (End-face image analysis procedure
for the calibration of optical fibre geometry test sets).
Regarding calibration of fiber optic power meters, it was decided tocontinue the discussion in 2017 and beyond.
Regarding the end-face image analysis procedure for the calibrationof optical fiber geometry test sets, it was decided to prepare a CDV tobe subject to voting by countries in 2017.
Regarding IEC 61315:2005 Ed.2.0 (an international standard whose
revision was approved at IEC TC 86/WG 4 in 2015), the CD for IEC
61315 Ed.3.0 was circulated. Japan submitted technical comments, etc.
through the national committee.

2-22 (Medical electrical equipment - Part 2-22: Particular requirements
for basic safety and essential performance of surgical, cosmetic,
therapeutic and diagnostic laser equipment), discussions were held about
the comments for the 2nd CD circulation. A revised draft will becirculated for CDV.
Regarding the revision of IEC/TR 60825-8 Ed.3 (Safety of laser
products - Part 8: Guidelines for the safe use of laser beams on humans),efforts have been made to circulate the CD so that discussions can beheld about comments at the Milan meeting in the next fiscal year. It wasagreed that IEC/TR 62471-3 (Photobiological safety of lamps and lamp
systems - Part 3: Guidelines for the safe use of intense pulsed lightsource equipment on humans) (including high-brightness LEDs) will
be integrated to IEC/TR 60825-8 in the near future.
Regarding the risks of ophthalmopathy in the treatment of the upper
part of the eyelid using a laser or Intense Pulsed Light (IPL), twostandards were developed in ISO/TC 94/SC 6/JWG 1 with cooperationfrom IEC/TC 76/JWG 12. The opinions of WG 4 about this project(ISO/TR 22463 and ISO 12609-1) were compiled and proposed to the
JWG above.

2.8 Laser Safety (IEC TC 76)
Regarding the IEC/TC 76 meeting, the annual meeting was held in
Beijing in October in this fiscal year. The interim meetings of WG 1
and WG 8 were held in Atlanta in March. Regarding the JWG, thedocuments are being reviewed by relevant TCs other than TC 76.
The status of review of standard documents by respective WGs isoutlined below, focusing mainly on the meetings in Beijing and Atlanta.

2.8.4 Safety of fiber optics communications systems (IEC TC 76/WG 5)
Japan was elected as the new project leader for the next editions of
IEC 60825-2 and IEC 60825-12 (which were delayed). The revisionproject has been accelerated.
The policy for handling comments for the CDV circulation wascompiled for IEC 60825-12 Ed.2 (“Safety of free space opticalcommunication systems used for transmission of information), and thedraft for FDIS circulation was sent to the TC 76 secretary.
Toward IEC 60825-2 Ed.4 (Safety of laser products - Part 2: Safetyof optical fiber communication systems (OFCS)), a policy wasestablished to (1) take into account both C7 (whose wavelength
dependence is exponential) and MPE (of the skin) and (2) to set themeasurement condition 2 (magnifying lens observation condition) to
the measurement distance of 14 mm and aperture stop diameter of 3.5
mm in the full spectrum. The draft for CD circulation was sent to the
TC 76 secretary. Regarding the current edition of IEC 60825-2 (Ed.3.2),
it was decided to publish an I-SH to confirm that the upper limit of C7
is eight.
Regarding extraction of the requirements from IEC/TR 60825-17(Safety of laser products - Part 17: Safety aspects for use of opticalpassive components and optical cables in high power optical fibre
communication systems) and transition to IEC 60825-2, it was decided
to take action in Ed.5 or later. This will inevitably require cooperation
with IEC/TC 86. The correspondence between TC 86 and TC 76 is being
reorganized.

2.8.1 Optical radiation safety (IEC TC 76/WG 1)
Regarding IEC 60825-1 Ed.3 (Laser Equipment classification andrequirements) published in 2014, a policy was adopted to apply theInterpretation Sheet (I-SH) after publication of Ed.3 without reflecting
technical comments in the CDV stage. Thus, two separate documents
are being reviewed: I-SH1 (some complex extended sources of irregular
temporal emmission: related to Subclause 4.3) and I-SH2 (laser radiation
designed to function as a conventional lamps: related to Subclause 4.4).
In this fiscal year, a review for DC circulation was made at the Beijing
meeting. Subsequently, the draft for FDIS circulation was fixed at the
Atlanta meeting.
Discussions have started for the next edition (Ed.4) of IEC 60825-1.
A project group was established so that a draft can be submitted at
the IEC/TC 76 Milan meeting in November in the next fiscal year
regarding the handling of the virtual enclosure (sensors detect the humanbody interrupting the beam and reduce the risk of exposure) and moving
platform (the position of the aperture stop for measurement around amoving object including the laser equipment changes depending on the
speed).
Meanwhile, discussions have started with the International
Commission on Non-Ionizing Radiation Protection (ICNIRP) to relax
the ICNIRP guidelines on ultraviolet radiation (wavelength: 270 nm orless) and infrared radiation (wavelength: 1 400 nm or more).

2.8.5 High power lasers (IEC TC 76/WG 7)
The CDV of IEC 60825-4 Ed.3 (Safety of laser products - Part 4:
Laser guards) was circulated. The NP of IEC 60825-18 (Guided beam
delivery systems) (which extracts the provisions of Annex G of IEC
60825-4) was also circulated. Annex G of IEC 60825-4 will be deleted
when IEC 60825-18 is published.
At the plenary session of the Beijing meeting, Japan proposed thatthe new evaluation method, which can evaluate the performance of highly
laser-resistant laser guards (capable of protection against high output
laser beams of 5 kW or more), be added to the Annex to IEC 60825-4(refer to Section 7). This proposal will be reviewed as amendment or
Ed.4 after publication of IEC 60825-4 Ed.3.

2.8.2 Laser radiation measurement (IEC TC 76/WG 3)
Discussions have been held on an ongoing basis about action items
to revise IEC/TR 60825-13 Ed.2 (Safety of laser products - Part 13:
Measurements for classification of laser products) in 2018. The newitem is the guidelines for the ultra-short pulse duration measurement
method. The definition of the ultra-short pulse was changed from lessthan 100 fs to less than 100 ps. Efforts have been made to circulate the
CD in May in the next fiscal year.

2.8.6 Development and maintenance of basic standards (IEC TC 76/WG 8)
The details of I-SH for IEC 60825-1 Ed.3 have been almost fixed.
Thus, a project will be fully launched to prepare a CD of IEC/TR 60825-

2.8.3 Safety of medical laser equipment (IEC TC 76/WG 4)
In the Ed.4 project to add the Class 1C requirements to IEC 60601-

15

Annual Technical Report2016 OITDA

comments for the circulated CD.

14 Ed.2 (Safety of laser products - Part 14: A userʼs guide) (including
relevant information for an I-SH). Regarding the project to revise IEC/
TR 60825-3 Ed.3 (Safety of laser products - Part 3: Guidance for laser
displays and shows), additional information will be collected after the
Atlanta meeting, and an RR will be circulated subsequently.
The 2nd CD for IEC/TR 60825-5 Ed.3 (Safety of laser products - Part
5: Manufacturer's checklist for IEC 60825-1) was circulated, andcomments were reviewed. There were requests to distribute IEC/TR
60825-5 as an editable file. An editable checklist would be useful forusers, and an inquiry has been made to the IEC Central Office to see
whether IEC/TR can offer such a checklist.
Regarding the Commission Decision of 5 February 2014 on the safety
requirements to be met by European standards for consumer laser
products pursuant to Directive 2001/95/EC of the European Parliamentand of the Council on general product safety, the European Committee
for Electrotechnical Standardization (CENELEC) will have to publish
the safety standards for consumer laser products by December 2017. At
present, the European standards do not apply as IEC standards.
Under the provisions of the European standards, consumer laser
products for general purposes (including toys) should be Class 1. Class
1M, Class 2M, and Class 3R (visible pulse) apply to consumer laser
products for special purposes that require risk analysis. Class 2 andClass 3R (visible CW) apply to consumer laser products for general
purposes that do not require risk analysis.

2.8.9	Safety of lasers and laser equipment in an industrial materials
processing environment (IEC TC 76/JWG 10)
Activities are underway as the JWG with ISO/TC 172/SC 9/JWG 3
to review the ISO/IEC 11553 series. Regarding the revision of ISO/IEC
11553-1 (Safety of machinery - Laser processing machines - Part 1:
General safety requirements) and ISO/IEC 11553-2 (Safety of machinery- Laser processing machines - Part 2: Safety requirements for hand-heldlaser processing devices), comments for the 2nd CD circulation werechecked at the Beijing meeting, and the CDV was circulated concurrently
with ISO. The FDIS will be circulated at the next meeting.
2.8.10 	Eye and face protection against laser radiation (IEC TC 76/JWG 12)
Activities are underway as the JWG with ISO/TC 94/SC 6/JWG 1.
A review is being conducted at the ISO meeting, and web meetings areheld as appropriate. The documents in the WD stage are circulated basedon the ISO numbers.
Regarding ISO/IEC 19818 Ed.1 (Eye and face protection - Protection
against laser radiation - requirements and test methods), the comment(N44) for the WD (N 36) was discussed at the Beijing meeting.
In terms of the combination table for optical density (OD) and laser
resistance class (RC), discussions were held about the RCʼs division
into steps (whether to make 1 step 10 times or 100 times). It was decided
to continue the review. Respective countries showed understanding about
the change in threshold for mode lock lasers and femtosecond lasers as
proposed by Japan.
Meanwhile, it was decided to conduct investigations by the ad hocgroup and complete the table due to insufficient data on material damage
for femtosecond lasers. A CD which reflects other review matters will
be circulated.
Comments for the WD of ISO/TR 22463 (Patient/client eye protectors
for protection against laser/intense light source (ILS) equipment usedon humans for cosmetic and medical applications - Guidance forselection and use) were discussed at the Beijing meeting to fix the details
and circulate a CD.

2.8.7 Non-coherent sources (IEC TC 76/WG 9)
IEC 62471-1 will be discussed in 2.8.8. This section explains otherstandards of the IEC 62471 series. The 2nd CD of IEC/TR 62471-4 Ed.1
(Photobiological Safety of Lamps and Lamp Systems: Measuring
Methods) was circulated, but the comments about the 1st CD were notfully discussed. The discussions about the parent standard (IEC 624711) have not been completed yet. Thus, the policy to circulate a CD again
was confirmed.
IEC 62471-6 (Photobiological safety of ultraviolet lamp products),
which was once rejected due to a shortage of experts, was subject to NP
again, and is expected to be approved as a project.

3. ISO

2.8.8 IEC 62471-1 Special Joint TC (JTC 5)
The project to revise CIE S009/IEC 62471 (Photobiological Safetyof Lamps and Lamp Systems) as CIE S009/IEC 62471-1 has been
underway since April 2013 by Div. 2 and Div. 6 of CIE and TC 34 andTC 76 of IEC as Joint TC (JTC 5). The circulation of CD has been
delayed. In this fiscal year, neither an interim meeting nor a web meeting
was held. The policy for the CD was reviewed again at the Beijing
meeting.
The draft that was distributed immediately before the Beijing meeting
proposed that the organization of the annexes be changed. It was decidedin Annexes A–K (which were significantly reorganized) that provisions
regarding measurement (which were reviewed by Div. 2 of CIE) be
reflected in Annexes G–J.
It was decided to review the possibility of transitioning part of IEC/
TR 62471-2 in Section 9 (requirements for manufacturers). Regarding
the evaluation conditions, the basic policy to specify the default
conditions in IEC 62471-1 (i.e., horizontal standard) and set the productconditions in the vertical standards was reconfirmed.
The conversion of distance conditions based on the inverse-squarelaw (about which Japan and the U.K. expressed concern) remains
included. It will be required to demonstrate based on actual data thatthe scope in which the inverse-square law is effective is limited. The
revised draft based on the discussions will be circulated as CD.
The JTC 5 meeting will be the CIE interim meeting (Jeju) or IEC/
TC 76 Milan meeting. It was decided to hold a web meeting to review
Annual Technical Report2016 OITDA

3.1 Electro-Optical Systems (ISO/TC 172/SC 9)
This meeting compiles domestic opinions and reflects Japanʼs
proposals on the international standards, etc. proposed by ISO/TC 172/
SC 9 (composed of WG 1: Terminology and test methods for lasers,
WG 4: Laser systems for medical applications, WG 7: Electro-opticalsystems other than lasers, and JWG 3: Joint ISO/TC 172/SC 9-IEC/TC
76 WG: Machines safety), which is in charge of preparing international
standards on lasers.
In this fiscal year, a domestic meeting was held in September 2016
to deliberate on international meeting strategy. In February 2017, areport was submitted at the international meeting, and the strategy forthe next international meeting, etc. was reviewed.
In this fiscal year, Japan served as the host country, and theinternational meeting was held in Kojima, Kurashiki City, Okayama
Prefecture for three days from November 30 to December 2, 2016. Thirty
individuals participated from seven countries in total: four from China,
one from France, seven from Germany, one from South Korea, one fromthe U.K., three from the U.S., and 13 from Japan.
The main points reviewed in the international meeting are reported
below.
3.1.1 Plenary
The term of the chairperson (U.S.) ended, and a new chairperson(Germany) took office. The secretary (Germany) also changed. The next16

Standardization
5.	International Standardization and Dissemination
Committee for High-speed Communication Network
Performance over Large Core Multimode Optical Fibermeeting will be held in Boulder (U.S.) in 2017.
3.1.2 Terminology and test methods for lasers (ISO/TC 172/ SC 9 WG 1)
Regarding ISO/DIS 11554 (Optics and optical instruments - Laserand laser-related equipment - Test methods for laser beam power, energy
and temporal characteristics) (in which Japan serves as the project
leader), it was decided to skip the Final Draft International Standard(FDIS) and publish the standard.
Regarding ISO/DTR 20811 (Qualification of laser optics for space
applications), comments made by Japan were approved, and theabbreviation “LIC” (Laser Induced Contamination) was changed to“LIMC” (Laser Induced Molecular Contamination). It was decided to
publish ISO/DTR 20811 as a Technical Report (TR).
At first, ISO/TS 17915: 2013 (Optics and photonics - Measurement
method of semiconductor lasers for sensing) was published as a Technical
Specification (TS) based on Japanʼs proposal. It was decided to publish
ISO/TS 17915: 2013 as an IS.

5.1 Objective
This project builds the foundations for international standardizationand dissemination of communication networks mainly using shortdistance optical fibers with the aim of generalizing in-vehicle opticalcomponents and reducing their costs.
Specifically, targeting high-speed in-vehicle LANs using large coremultimode optical fibers, which will become the mainstream,international standards on test and measurement methods for opticalsignals are developed in IEC, and international standards on opticalcomponents such as connectors and cables for in-vehicle LANs aredeveloped in ISO.
In addition to the development of international standards, the project
ensures consistency between IEEE standards and IEC/ISO standards on
in-vehicle LANs using large core multimode optical fibers throughactivities on in-vehicle Ethernet in the IEEE as part of the efforts fordissemination. The project also reviews the generalization to relevant
housing and industrial machinery fields.
Moreover, the project indicates the effectiveness of the international
standards and IEEE standards, develops demonstration systems including
devices and their evaluation tools, and promotes dissemination of thenext generation vehicles. Use of optical fibers in in-vehicle LANs can
reduce carbon dioxide emissions and improve fuel consumption due tothe reduced weight and power saving, so that it contributes to savingenergy in automobiles.

3.1.3 Laser systems for medical applications (ISO/TC 172/ SC 9 WG 4)
ISO/DIS 11990 (Lasers and laser-related equipment - Determinationof laser resistance of tracheal tube and tracheal cuffs) has been developed
jointly with ISO/TC 121/SC 2 (a liaison). It was decided to submit a
Draft International Standard (DIS) by December 20, 2016.
3.1.4 Electro-optical systems other than lasers (ISO/TC 172/SC 9 WG 7)
Regarding ISO 11807-1, -2 (Integrated optics - Vocabulary - Part 1:
Basic terms and symbols, - Part 2: Terms used in classification), andISO 14881 (Integrated optics - Interfaces - Parameters relevant tocoupling properties), it was decided that Japan will serve as the project
leader to revise these three standards for the first time in 15 years.
Regarding ISO 14880-1 (Optics and photonics - Microlens arrays Part 1: Vocabulary and general properties), a revised edition was
published in April 2016 with Japan and the U.K. serving as the project
leaders. The Central Secretariat (CS) revised the Final Draft International
Standard (FDIS) without confirmation and published it. A misprint was
found, and it was decided to revise the standard to publish it again. It
was also decided to submit a DIS in June 2017.

5.2 Status of activities
The ultimate goal of the project, the goal and results for this fiscal
year, and future tasks are summarized in Table 4.
The IEC and IEEE documents, which had been prepared respectively
from the first fiscal year (FY 2014), were published by the end of the
fiscal year. Regarding the two ISO documents which were proposed tobe newly developed in FY 2015, Japan played a key role as a convenor
and project leader, respectively. Discussions are underway to publish
the documents by the end of FY 2018.
Notably, Japan could make proposals ahead of international trends
in ISO. The structure of the standard was upgraded as “In-vehicle
Ethernet” (in-vehicle backbone standard for automated driving) byincorporating electrical Ethernet.
Meanwhile, the preparations to propose the standard on Ethernet
exceeding 1 Gbit/s (which was planned to be proposed to IEEE by theend of FY 2016) were delayed.

4. IEEE
4.1 Intra-Building Optical Wiring System (IEEE 802.3)
At IEEE, Japan and other countries proposed standardization in March
2014. The draft standard for the physical/link layer of Gigabit Ethernet
over a large-diameter SI-type Plastic Optical Fiber (POF) (port name:
1000BASE-RH) has been prepared by the Task Force under the project
name of P802.3bv. At the bimonthly meeting, a draft was prepared,comments were resolved, and a revision was conducted.
For home network applications with the maximum interconnection
length of 50 m, provisions were added for plugless connections in terms
of printing on POF cables and transceivers, cable tearing length andretention force, etc. At the meeting in July 2016, votes were cast at the
802.3 Working Group (WG), and the transition from the WG voting
phase to the sponsor voting phase was approved.
The draft standard was circulated, subjected to voting, and revised
repeatedly. Based on the voting at the 802.3 WG in November 2016,
revision of the draft standard and an application for the next step (i.e.,
review by the Standards Review Committee) were approved. The sponsor
circulation phase was completed in January 2017. The work moved on
to the peer review phase by the final review committee. The amendmentof the standard will be published in spring of 2017.

6.	Committee for International Standardization of Fiber Optic
Connector Optical Interfaces for Fiber PC Connectors
6.1 Objective
Fiber PC (Physical Contact) connectors are suitable for multi-fiber
optical interconnection within a board/between boards in various typesof information processing equipment and optical communications
equipment. The mechanical interface standard for SF connectors was
published as IEC 61754-26 Ed.1: 2012 (Fibre optic interconnecting
devices and passive components - Fibre optic connector interfaces - Part
26: Type SF connector family).
Thus far, fiber optic connector optical interfaces standards have beendeveloped for various connector configuration (e.g., cylindrical orrectangular ferrules), but no optical compatibility standard has beendeveloped for fiber PC connectors.
To encourage the widespread use of fiber PC connectors for ultra
high-speed, ultra high-density optical interconnection, the mechanicalinterface standard needs to be developed, and the fiber optic connector

17

Annual Technical Report2016 OITDA

Table 4
International
standard
Place ofproposalDomestic
Committee
Ultimate
Goal(–2018)Goal forthis fiscal
year (2016)

Results forthis fiscal
year (2016)

Summary of progress of international standardization

IEC

ISO

IEEE

TC 86/SC 86B/WG 4

TC 22/SC 31/WG 3
TC 22/SC 32/WG 10

P802.3bv

Institute of Electronics, Information andCommunication Engineers
86B Optical Component Subcommittee

Society of Automotive Engineers ofJapan
Optical Communications Subcommittee

JasPar/Next Generation
High-Speed LAN WG
OPEN Alliance SIG /TC 7(1) ‌EAF measurement method (2014)(2) ‌Specification of an EAF template forloss measurement (2016)(3) Common‌
for in-vehiclecommunication systems (2018)(4) ‌Physical layer of in-vehicle opticalgigabit communication (2018)(5) In-vehicle‌
optical gigabit
communication parts (2018)(6) In-vehicle‌
Ethernet (1 Gbit/s) (2016)(7) In-vehicle‌
Ethernet (10 Gbit/s)(2020–)(1) ‌None (The IS for IEC 61300-3-53
was published in FY 2014.)(2) ‌Efforts will be made to publish an IS
by the end of this fiscal year.

(3)–(5)
Efforts will be made to prepare a WD by
May, start discussions in the WG, andsubmit a CD in December 2016.
Regarding (5), the possibility of handlingeach chapter as an independent
standard document will be reviewed.

(6) Efforts‌will be made to publish
1000BASE-RH by the end of thisfiscal year.
(7) The‌
goal is to make a new proposal
regarding speeds exceeding 1 Gbit/s by the end of this fiscal year by
ascertaining the market situation.
・ ‌Efforts will be made to spread thein-vehicle optical LAN by presenting
the results of the project at scientificmeetings, exhibitions, etc.

(1) ‌The method to reduce the dispersionof the EAF curve based on themeasurement method of the
published standard was reviewed.
(2) ‌The EAF template for loss
measurement (which was derived
from experiments and round robintests under this project) was added
to IEC 61300-1 and published. An
application was made for early
maintenance to reflect the results of
the round robin tests in Japan andthe U.K. and was approved.

(3)–(5)
During preparation of draft documents
for ISO 21111-1 (related to (3) and (4)adopted as a NWIP by January 2016)
and ISO 21111-3 (related to (5)), a
request from Europe and the U.S. to
include the electrical Ethernet standard
in the ISO 21111 family was accepted.
ISO 21111-1 was split into (3) ISO
21111-2 and (4) ISO 21111-3 ((3) iscommon for electrical and optical
Ethernet), and ISO 21111-3 transitioned
to (5) ISO 21111-4.
Based on these discussions, submissionof the WG draft was postponed until
July 2017.

(6) In‌ IEEE P802.3bv, Japan worked
with Spain and Germany to promote
standardization of short-distance 1
Gbit/s Ethernet communication (forautomobiles, housing, and industrial
machinery) using multimode opticalfibers. Response to all the comments
was completed by January 2017. The
document was published in March.
(7) A‌ Study Group on the physical layerof in-vehicle Ethernet with speeds
exceeding 1 Gbit/s was established
in IEEE 802.3 to start discussions
on the specifications. Preparations
for a presentation have been madewith the target of 10 Gbit/s for
optical Ethernet.
・ ‌A demonstration was held topromote standardization activities in
the IEEE international meeting(Paris) and exhibition (Tokyo) tosolicit needs and feedback fromusers.

components - Fibre optic connector optical interface - Part 3-10:
Connector parameters of non-dispersion shifted single mode physicallycontacting fibres - non-angled, ferrule-less, bore alignment connectors)
was published in December 2016.
In the published IEC 61755-3-10 optical interfaces standard, the optical
performance is Grade D because only the established optical fiber
standard (B1 fiber) can be used as the basis. However, the results of asimulation conducted in this fiscal year showed that Grade C or Grade
B may be attained by using commercially available fibers. The results
are considered to benefit users. Consultations with IEC members willcommence so that the document for commercially available fibers canbe published as a Technical Report (TR).

optical interfaces will need to be standardized.
This committee covers international standardization of fiber optic
connector optical interfaces for fiber PC connectors, and prepares adraft standardization document.
6.2 Status of activities
In response to the negative comments at the IEC TC 86/SC 86B
Gwangju meeting in October 2015, Monte-Carlo simulation andverification by experiment were conducted taking into account the bore
diameter, bore length, core connectivity error, and chamfer angle at theend of the optical fiber, in order to increase the data accuracy andrepropose the CDV document. The results showed that the optical
performance may be Grade D when B1 fiber is used. Thus, the CDV
document was revised.
Japan gave explanations again based on the revised CDV document
at WG 6 of the SC 86B Locarno meeting in April 2016. Detailed
explanations were given to resolve all the questions of respective
countries. It was agreed to circulate the CDV based on the revised edition.
The CDV was circulated in July 2016.
The RVC document was reviewed at WG 6 of the SC 86B Frankfurt
meeting in October 2016. No against votes were cast, and only editorialcomments were made. The establishment of the IS was approved without
the FDIS. The IS draft was submitted in November 2016. As a result,
IEC 61755-3-10 Ed.1 (Fibre optic interconnecting devices and passive
Annual Technical Report2016 OITDA

7.	Committee for International Standardization of Highly
Laser-resistant Laser Guards
7.1 Objective
Laser guards are a means of protection (shield plates or equipment)that shield against laser beams. In general, they are constructed of metals
such as aluminum alloys. However, with the development of high power
laser technology, even safer protective measures are demanded.
There is an international standard for laser guards: IEC 60825-4. One
problem is that guard materials that are sufficiently durable against highpower laser beams and their evaluation method have not been proposed.
The purpose of this project is to build prototype laser guards using

18

Standardization
survey results.
As a result, a quantitative evaluation method appropriate for CFRP
laser guards was developed, and it was demonstrated to achieve protection
against high power laser beams (5 kW or more). Conventional laser
guards constructed of metals could not provide protection.
The results of the project were presented at a laser-related international
scientific meeting (ICALEO 2017) and IEC/TC 76 Beijing meeting.
Japan proposed to IEC to revise the annex to IEC 60825-4 and add theperformance evaluation method for CFRP laser guards.

the superior qualities of Carbon Fiber Reinforced Plastics (CFRPs),
conduct evaluation tests to verify their high protection performanceagainst laser beams, establish a method to properly evaluate theperformance characteristics as laser guards, and propose a newinternational standard.
7.2 Status of activities
This fiscal year, which is the last fiscal year of the three-year plan,laser radiation tests were conducted using CFRPs and conventional laser
guard materials (e.g., aluminum) as comparison samples based on the

19

Annual Technical Report2016 OITDAEducational and Public Relations Activities
1.	FY 2016 Symposium on the Optoelectronics Industry andTechnology

medical imaging, technology roadmaps for automotive photonics, anddevelopment of integrated photonics-electronics convergence systemtechnology under the theme of “Photonics that Underpins the Future ofAutomobiles, Robots, and Industrial Equipment”, and the future visionof Japanʼs optoelectronics industry and technology was actively discussed(Table 5).

The FY 2016 Symposium on the Optoelectronics Industry andTechnology was held at the Rihga Royal Hotel Tokyo on Thursday,
February 9, 2017, jointly sponsored by OITDA and the Photonics
Electronics Technology Research Association (PETRA) with the supportof the Ministry of Economy, Trade and Industry.

2. InterOpto 2016
InterOpto 2016, an international exhibition of cutting-edge
optoelectronics technology, was held at Pacifico Yokohama for threedays from Wednesday, September 14 to Friday, September 16 with thesupport and cooperation of “the Ministry of Economy, Trade andIndustry” and many other organizations.
The exhibition covered a wide range of fields such as; lasers/lightsources, optical elements/parts, materials, optical equipment/devices,
optical industry related services/software and 103 exhibitors including
optoelectronics manufacturers, trading companies, etc. (93 the last year)
participated in the exhibition with 146 booths (148 the last year).

While there has been rapid progress in utilization of AI, IoT and big
data in recent years, the development of optoelectronics technology is
expected to create innovation which leads automobile (e.g., automateddriving), robot, and industrial equipment industries as well as to serveas the fundamental technology which supports Japanʼs industry andsociety.
In the symposium, with more than 290 participants, experts fromvarious fields gave presentations on automated driving and security,
LiDAR (Light Detection and Ranging) technologies, robot evolution,

Table 5FY 2016 Symposium on the Optoelectronics Industry and Technology

Opening Remarks

Mr. Yasuhisa Odani
President, OITDA

Guest Greeting

Mr. Takatoshi Miura
Director, Information and Communication Electronics
Division, Commerce and Information Policy Bureau,
METI

10:15 〜 11:15

Keynote Speech:
Automated Driving and Security in Control System

Dr. Seiichi Shin
Professor, Graduate School of Information andEngineering, The University of Electro-Communications

11:15 〜 12:00

Amazon Picking Challenge and Evolution of Robot

Mr. Taizan Yonetsuji
Engineer, Preferred Networks

LiDAR Technologies for Automated Driving

Mr. Eiji Muramatsu
Director, Autonomous Driving Systems Business
Development Division, Pioneer Corporation

13:45 〜 14:30

Optoelectronics Technology Roadmap−Automotive Photonics−

Dr. Nobuhiko Nishiyama
Associate Professor, School of Engineering, Tokyo
Institute of Technology

14:45 〜 15:30

8K Television Technology and its Application for
Endoscopic surgery

Dr. Kenkichi Tanioka
Vice Chairman, Medical Imaging Consortium

15:30 〜 16:15

Integrated Photonics-Electronics Convergence System
Technology−Performance and system evaluation of Optical I/O
core−

Mr. Junichi Tsuchida
Photonics Electronics Technology Research Association(PETRA)

16:20 〜 17:00

The Award Ceremony of 32nd Kenjiro Sakurai Memorial Prize

17:00 〜 19:00

Get-together

10:00 〜 10:05

10:05 〜 10:15

13:00 〜 13:45

Annual Technical Report2016 OITDA

20

Educational and Public Relations Activities
As well as Japanese companies and institutes, foreign companies
from North America, Europe, Asia, etc. joined the exhibition to shareoptical technologies and information and give an overview of cuttingedge optical products and their development status from a global
viewpoint.
This year, MEMS Sensing & Network System 2016 was also held
simultaneously at the same venue in addition to the three exhibitions of
optical-related technologies (LED JAPAN 2016, BioOpto Japan 2016,
and LaserTech 2016) which have been held with InterOpto in past years.
There were totally 7,718 registered visitors (including visitors to thesimultaneously held exhibitions above) over the three days.
A “Notable Optoelectronics Technology and Special Exhibit Zone”
was set up in the Exhibition Hall. In this zone, eight companies
recommended by each working group of OITDAʼs Optoelectronics
Technology Trend Committee exhibited their recommended technologies
and products. A Notable Optoelectronics Technology Seminar was also
held for two days from September 15 to 16 at the seminar site in the
Exhibition Hall.
Further, in Seminar Room of the Annex Hall, a special lecture entitled“Optical Submarine Cabled Observation System and Its Applications”
was presented by Dr. Katsuyoshi Kawaguchi, Deputy Director of R&D
Center for Earthquake and Tsunami, Japan Agency for Marine-Earth
Science and Technology, and seminars on technology trends in seven
optoelectronics technology fields were held on September 15. And on
September 16, Professor Hiroyuki Morikawa, Research Center for
Advanced Science and Technology, the University of Tokyo gave a special
lecture entitled “The way of Value Creation in the Fourth Industrial
Revolution - Current Status and Future Outlook of IoT-” and seminars
on the optoelectronics industry trends in seven product fields andoverview trends were presented. These seminars attracted large audiences
and stimulated exchanges of opinion among the audiences.

Awardees of 32nd Kenjiro Sakurai Memorial Prize(From left) Mr. Kurobe, Dr. Mukaihara, Mr. Kimura, Mr. Koshi(Photo on the right) Dr. Koyama

Dr. Toshikazu Mukaihara and co-workers of Furukawa Electric Co.,
Ltd. have successfully realized a light source for a narrow line width
wavelength tunable laser having the highest level power and stability inthe world, by developing an optical compound semiconductor technology
to monolithically integrate multi-wavelength arrays, which consist of
many DFB lasers, and a plurality of optical functional elements on thesame substrate, resin bonding technology to halve the package volume
compared to the conventional packages, and high-performance electronic
control circuit technology, through their commitment to developing alight source for digital coherent communication. The development andimplementation of the light source for a narrow line width wavelength
tunable laser is a great achievement that will contribute significantly tothe development and dissemination of digital coherent communication
as a new technology for increasing the traffic capacity and upgrading
the network.
Dr. Fumio Koyama of Tokyo Institute of Technology received theprize for continuing research on improving the performance of Vertical
Cavity Surface Emitting Laser (VCSEL) and creating new functions
after achieving room-temperature continuous wave oscillation of VCSEL
with Dr. Kenichi Iga, Professor Emeritus of Tokyo Institute of Technology(who received the prize in FY 1987) for the first time in the world in1988, thereby opening up the possibility of VCSEL integrated photonics
having new technologies such as wavelength control by MEMS mirror
and slow light waveguide. R&D on VCSEL has stimulated thedevelopment of technologies such as optical interconnection at data
centers and laser printers originated from Japan. This is a great
accomplishment that will contribute significantly to new developmentsin the optoelectronics industry and technologies.
The commendation ceremony was held on February 9, 2017 following
the FY 2016 Symposium on the Optoelectronics Industry and Technology.
At the ceremony, Dr. Yasuhiko Arakawa (Professor at the University ofTokyo), chairperson of the Kenjiro Sakurai Memorial Prize Committee,
reported on the selection process and results. After that, the certificates,
medals and extra prizes were presented to the awardees.

3. 32nd Kenjiro Sakurai Memorial Prize
The Kenjiro Sakurai Prize was established as a memorial to the late
Dr. Kenjiro Sakurai, who was a Director of OITDA and played a majorrole in developing the optoelectronics industry, and for the purpose ofpromoting technological development of the optoelectronics industry.
The prize has been awarded to 23 individuals and 36 groups, totaling
142 people, in the past 31 times.
This year, the Sakurai Memorial Prize was awarded to two applicants
among 13 applicants for achievements in their pioneering roles in the
optoelectronics industry and technology since 2006.
The prize for “Realizing development of a narrow line width
wavelength variable light source for digital coherent communication”
was awarded to Dr. Toshikazu Mukaihara, Mr. Toshio Kimura, Mr.
Hiroyuki Koshi, Mr. Tatsuro Kurobe of Furukawa Electric Co., Ltd. andthe prize for “Development of Photonics Integration Technologies basedon VCSEL Photonics” was awarded to Dr. Fumio Koyama of Tokyo
Institute of Technology.

21

Annual Technical Report2016 OITDASupporting Members(As of March 31, 2017)[Textile & Pulp][Electronics & Electronic Appliances][Precision Instrument]

Mitsubishi Rayon Co., Ltd.

Anritsu Corporation

Canon Inc.

Enplas Corporation

Konica Minolta, Inc.

[Chemistry]

Fujitsu Limited

Nikon Corporation

Fujifilm Corporation

Hamamatsu Photonics K.K.

Olympus Corporation

Nissan Chemical Industries, Ltd.

Hirose Electric Co., Ltd.

Ricoh Company, Ltd.

Shin-Etsu Chemical Co., Ltd.

Hitachi, Ltd.

Seiko Instruments Inc.

Sumitomo Bakelite Co., Ltd.

Honda Tsushin Kogyo Co., Ltd.

Seikoh Giken Co., Ltd.

Yamamoto Kogaku Co., Ltd.

Huawei Technologies Japan K.K.

Sigma Koki Co., Ltd.

Japan Aviation Electronics Industry, Ltd.

Suruga Seiki Co., Ltd.

Kyocera Corporation

Topcon Corporation[Glass & Ceramics]
Asahi Glass Co., Ltd.
Corning International K.K.
Nippon Sheet Glass Co., Ltd.
Sumitomo Osaka Cement Co., Ltd.
Technical Co., Ltd.
Toyo Seikan Group Holdings, Ltd.

Macom Japan Limited
Mitsubishi Electric Corporation[Commercial & Advertisement]

Murata Mfg. Co., Ltd.

Hakuto Co., Ltd.

NEC Corporation

JTB Communication Design, Inc.

NTT Electronics Corporation

Marubun Corporation

Oclaro Japan, Inc.

The Optronics Co., Ltd.

Oki Electric Industry Co., Ltd.
[Steel & Non-Ferrous]
Nippon Steel & Sumikin Welding Co., Ltd.

Panasonic Corporation
Pioneer Corporation
Rohm Co., Ltd.

[Electric Power]Central Research Institute ofElectric Power Industry

Santec Corporation[Electric Wire & Cable]
Fujikura Ltd.
Fujikura Dia Cable Ltd.
Furukawa Electric Co., Ltd.
Okano Electric Wire Co., Ltd.
Sumitomo Electric Industries, Ltd.
SWCC Showa Holdings Co., Ltd.

Sanwa Denki Kogyo Co., Ltd.
Sharp Corporation[Other Manufacturing]
Adamant Co., Ltd.

Sony Corporation

Dai Nippon Printing Co., Ltd.

Taiyo Yuden Co., Ltd.
Toshiba Corporation

Iwasaki Electric Co., Ltd.
Optoquest Co., Ltd.

Tyco Electronics Japan G.K.
Ushio Inc.
Yamaichi Electronics Co., Ltd.
Yamamura_Photonics Co., Ltd.
Yokogawa Electric Corporation[Others]
Granopt Ltd.
Institute for Laser Technology
Japan Optomechatronics Association
KDDI R&D Laboratories Inc.
Nippon Telegraph and TelephoneCorporation
NTT Advanced Technology Corporation
Photonics Electronics Technology

Annual Technical Report2016 OITDA

22

Research Association

1-20-10, Sekiguchi, Bunkyo, Tokyo, Japan, 112-0014
Phone: +81 3 5225 6431
URL: http://www.oitda.or.jp