Embedded Core
Design-In Services
Leading Embedded Core Innovation& Design-In Services

Innovative Technology
Software Services
Integration Acceleration

Server-Grade
HPC

ThermalDesignInnovative
Technology
UIO40Express

AIM-Linux

Value-Added Embedded
BIOS
SoftwareRuggedServices

Embedded
PCs

EmbeddedStorages

Integration
Acceleration

Industrial
Display

Wireless
Moduleswww.advantech.com

Advantech Embedded

03

Innovative Technology

Platform Innovation

Innovative Technology

04

Leading Embedded Core Innovation & Design-In
The development of IoT applications has become more specialist and differentiated. This makes the resources of the IoT services we provide
Embedded boards are the core component of all IoT applications, so naturally IoT solution developers have greater expectations on the features
provide that allow them to reduce the time and resources required for system integration.
Advantech’s Embedded Core Design-In Service is designed to respond to these new expectations from IoT solution developers. Embedded Coresoftware add-on services, which are offered with all Advantech embedded boards. These services help developers to integrate their systems andInnovative technology, embedded software, and peripheral integration services are the three major components of Advantech’s Embedded
technology and embedded software, with value added services that help customers integrate IoT application software with our embeddedof peripherals, you won’t need to worry about compatibility and longevity issues. Advantech Embedded Design-In Service is designed to help
you deliver IoT solutions in the fastest time.

*Part of services in this publication are optional offerings, please contact Advantech for further information.

Servicesmore tailored to our customer ’s needs.
and services that embedded boards canTable of Contents

Design-In Service is a series of hardware andachieve faster time to market.
Core Design-In Service. We offer the latest
boards. And with our comprehensive range
overcome any integration difficulties and help

Full Scale Computing Platforms for Applications

05

Server-Grade Solutions in Edge Computing

06

Advanced High Efficiency Cooling Solutions

07

MIO - Domain Focused I/O Extension Solutions

08

UIO40-Express Extension Solutions

09

Wide Temperature Operation Services

10

Conformal Coating Services

11

Extreme Vibration Solutions

12

Advanced Manufacturing Process

13

On Demand Board Custom Services

14

Comprehensive Embedded Software Services

15

Trusted Embedded BIOS Solutions

16

Allied, Industrial & Modular Linux Services (AIM-Linux)

17

Embedded Ubuntu Built-In Services

18

Embedded Feature APIs

19

WISE-PaaS/DeviceOn

20

Multi-Layer Security Solutions

21

Embedded Linux & Android Alliance (ELAA)

22

Embedded PCs: Configuration-to-Order Services

23

Embedded Wireless Modules & Design-in Services

24

Industrial Flash and Memory Solutions

25

Advantech Industrial Display Solutions

27

Product Selection Guide

29

Find More Product Information Online

50

Full Scale Embedded Computing Platforms
Innovative board & modular solutions with x86 and Arm technology

Advantech provides full scale x86 and Arm-based computing platforms covering various form-factors from MicroATX, mini-ITX,
3.5” SBC, Pico-ITX, to COM Express, Qseven, and SAMRC modules. It not only satisfies a variety of applications in terms of
performance and dimensions, but also meets various I/O needs with expansion capacity aimed at vertical markets. Through ourwide standard board offerings, customers get the latest platforms, most up-to-date technology, a lower total cost ownership (TCO),
and faster time-to-market.

™

™

™

3.5” SBC
Micro-ATX
Pico-ITX

Mini-ITX
Qseven

COM
SMARC

RTX

Advantech Embedded Computing Platforms Give You:
Innovative Solutions• Executive member ofindustrial standards• Innovative, high-end
thermal solutions• Wide-temperature
operation of -40~85°C• Local design-in consultant
service• Partnerships withhardware and software
vendors• MIO/UIO modularized
solutions that lower TCO• Conformal coating service
for harsh environments• Create RTX/UTX form
factors for industrial
needs• IPC-A-610G Class 3
assembly quality• Taiwan & China design
centers for onsite jointdesign• Early access to programson the latest platforms

05

Innovative Technology

Powerful Reliability

Design-in Services

Leading Technology•• Expertise in ODM
servicesServer-Grade Solutions in Edge Computing
Innovative solutions that fulfill extreme performance demands

Distributed computing structures have been proven to outperform centralized ones. Nowadays, advanced analytics and massive
data processing place a greater burden on local edge computers compared with remote cloud servers. A server-grade edge platform
should come to grips with intricate computing tasks and the coordination of all endpoints.

Server-Grade Solutions Give You:

Connectivity – Wider bandwidth and fastertransmission rates• 10 Gigabit Ethernet delivers more throughput
for end devices• PCI Express Gen 5 provides top-level
performance for high-end applications

Performance – Powerful CPU and large
memory size
• Up to 16 cores with server-grade CPU
capability• Reliable ECC memory with up to 1TB capacity

Manageability – Secure maintenance• Simply integrate iManager 2.0 API in the OS toenhance system security and reliability• Remote access system edge devices without
OS operation by server technologies IPMI &BMC

Reliability – Designed for industrial
applications• Extended temperature operation from -40°C ~85°C• MIL-STD-810G compliant with customized test
profileProduct Highlights
Computing on Module

High Scalability x Fast Deployment x Easy MaintenanceIndustrial Motherboard

Thermal Solution Ready x Legacy & Modern I/O

COM-HPC

COM-Express Type 7

SOM-8990

SOM-5992

AIMB-290• Intel Xeon D-1500• 128GB memory• Operating Temperature -40~85°C• Intel C3000 SoC Up to 16 Cores• Supports 10GbE, IPMI2.0• Supports 6 SATA storages• Intel Xeon D-2100• 512GB memory• 45 pairs PCIe & 4 ports with
10Gbase-KR

Mini-ITX

Micro-ATX

AIMB-586• Intel 8th/9th Gen Xeon/CORE-i• Supports 8 SATA storage• Supports RAID 0/1/5/10

Innovative Technology

06

Advanced High Efficiency Cooling Solutions
Thermal design innovation for extreme computing performance

To fulfill multiple requirements for high computing performance in medical, factory automation, and edge computing applications, any
thermal solution must tick several boxes such as good heat dissipation, low noise margins, and a compact heat sink. Advantech’s
Quadro Flow Cooling System (QFCS) provides a low profile and cost-effective thermal solution that meets customer requirements.
QFCS is an advanced cooling heatsink which offers ultra-cooling performance, 27mm compact size, and quiet noise out of only
45dB. The mixed fin and utilizing heat pipe design offers a 360° airflow for reliable heat dissipation and quite operation. The dynamic
doubled-layer screw design provides a super reliable hard contact between CPU and heatsink to meet strain gage criteria andprevent board bending. With a slim design and excellent cooling ability, customers can integrate QFCS quickly to speed up theirproduct development.

QFCS Give You:High Efficiency Cooling System• Integrated heat pipe & copper block• Lower heat resistance for quick heatdissipation

A
D

B

C

• Mixed fin & venting hole for best
airflowA

Two-phase change
heat pipe

B

Mixed heat sink

Application Friendly DesignCCPU hard contact• Slim and powerful for high-end
platform

D Vertical airflow• Quiet with smart fan management• Reliable assembly with precise
damping calculation

Comprehensive Validation• Thermal simulation for accurate
designLightweight: 250 gram

Ultra slim: 27mm

Silent: 45dB

CPU no throttling: 45W/60oC• Strain gage valid for board protection• Pre-assembly with board and 100%
test for quality control

Solid Design Process
Design & Simulation
Expert design withsimulation

07

Innovative Technology

Performance Verification
Precise calculation for ultra lowheat resistance

Reliability Validation
Better strain gauge forreliable operation

MIO - Domain Focused I/O Extension Solution
Quick select I/O combination for vertical applications

Advantech MIO Extension solutions provide a fastest way to satisfy specific I/O requirements for various vertical applications
while lowering the total cost of ownership and shortening time-to-market. MIO Extension uses a board-to-board structure whichguarantees mating reliability under industrial and embedded scenarios. An 80-pin connector encloses sufficient interfaces like
PCIex1, DisplayPort, USB, LPC, and SMBus. There are many off-the-shelf modules which target a wide array of vertical applications
and combine with Advantech’s standard MIO-SBC product to achieve customer solutions. Rich design documents and ODM service
allows customers to develop their own I/O modules or outsource to us.

Ruggedsolution• PCIe• DisplayPort• USB3.0/2.0• LPC• SMBus• Audio

Domain-focused
I/O extension

Time-to-market

Full rangeing
SBC forcombination

Compact
DesignMIO Extension Solutions Give You:
Full-Range SBCs

Off-the-Shelf Modules

Design-in Services• Various computing performance range
from Atom, Core, to Xeon

• I/O targeting wide variety of
applications• Available IP building blocks• Compact combination with 3.5" SBC
and Pico-ITX• Lower total cost of ownership• Schematic design guide & layout
checklist• Faster time-to-market• 2D/3D mechanical drawing• Rugged B/B connection

Product Highlights
Smart Parking

MIO-5373

MIOe-210

Intel 8th Gen. Core ULT
Total up to 8 UARTs

Transportation Surveillance

MIO-5393

MIOe-3674

Intel 9th Gen. Xeon/CoreMIO Extend 4 PoE

In Vitro Diagnostics

MIO-5350

MIOe-3680

Intel Pentium/Celeron
MIO Extend 2 isolated CANBus

Innovative Technology

08

UIO40-Express Extension Solutions
Quickly build Arm-based systems for your vertical applications

UIO40-Express is a new I/O extension standard created by Advantech for accelerating the development of Arm-based solutions.
Advantech provides a series of UIO40-Express I/O boards ready for different vertical applications. They allow customers to build
their Arm-based system quickly and flexibly by selecting the I/O and chassis they need. With Advantech’s AIM-Linux and WISEPaaS/DeviceOn support, UIO40-Express is the best time-to-market solution for your Arm-based embedded system.

UIO40-Express Give You:
Compact Structure• 2.5” Pico-ITX core main board• Unified edge I/O definition• Complete wireless expansion

Various I/O Expansion• Unified I/O expansion on 2.5” core board
UIO40-Express I/O interface:
4 USB, 4 GPIO, 3 UART, 1 CAN, 1 I2C,
8 GPIO, 3.3V, 5V• Vertical focused I/O expansion boards• Reference design and customization service

Unified Software Package• AIM-Linux and AIM-Android• Up-to-date and longevity support BSP• WISE-PaaS cloud connectivity enabled service

Service Process2.5” Core Board

Vertical I/O Board

VerticalApplication System

UIO-4030

RSB-3430• NXP i.MX 6 1GHz
• 1 HDMI, Dual LVDS for fullHD display• 2 USB 2.0, 1 GbE,
1 RS-232/422/485

RS-485 x 1, RS-232 x 1,
GPI x 4, GPO x 4

EPC-R3430
EPC-R3710

RSB-3710

Innovative Technology• Secure automateddevice onboarding
monitoring and control

UIO-4032

09

Modularized
Framework

Efficient resource allocation• Remote device

USB 2.0 x 2, RS-232 x 2,
GbE x 1

• Rockchip RK3399 1.8GHz• 4K HDMI, 1 dual channel LVDS
• 1 USB2.0, 1 USB3.0,
2 RS-232

AIM-Linux &AIM-Android

For I/O Board UIO-4030

Value-Added
Industrial App & SDK

Accelerated development

For I/O Board UIO-4032

Longevity BSP
Maintenance

UIO-4034

CAN x 1, RS-232 x 2

For I/O Board UIO-4034

Reliable foundation• Software over-the-air
updateWide Temperature Operation Services
Reliability guaranteed from design and validation to production

As the IoT revolution disrupts industry after industry, demand for wide-ranging temperature support is rising in both traditional
industries like factory automation, defense, and fuel dispensers and also emerging industries like smart cities, electric vehicle
charging systems, and smart parking systems (LPR). Advantech has over 35 years of experience in this field and utilizes its verystrong technical know-how in defining a reliable process for the design and production of extended temperature products thatsatisfies the working needs of harsh indoor and outdoor environments.

Design, Validation & Production Process
Component
Selection

Strict Thermal
DesignLaboratory
Validation

Mass
Production

6 min
85°C
0°C
-40°C

• Industrial grade power
solution• FloTHERM simulation
tool finds hot spots• -40 ~ 85oC companion
chip• Innovation thernal
solution: DHCS, QFCS• Industrial standard-40 ~ 85oC validation:
IEC60068-2-1,
IEC60068-2-2,
IEC60068-2-78,
IEC60068-2-14

Transportation

Outdoor Kiosk• Centralized component
management center(CMC)• Phoenix: 100% testing inchamber before shipping• Phoebus: regularongoing reliability tests(ORT)

Applications
Smart Parking

EV Charging

Innovative Technology

10Conformal Coating Services

One-stop services for moisture, dust, corrosion, and friction resistance
Conformal coating services(with warranty) is offered basedon customers’ demands to protect the PCB and parts fromdust, moisture, fungus, corrosion, and vibration. The coatingis sprayed on to the PCB to help minimize electro migration
between metal conductors. In addition, the use of a conformal
coating can protect circuits and components from direct contactthat can lead to abrasions or electrical short circuits. With
Advantech’s one stop coating services ranging from board
assembly, coating, function testing, and delivery, customers caneasily customize the process without worrying about functionality
and warranty. Advantech conformal coating service is the best
choice for applications in railway, transportation, aerospace, anddefense industries.

Conformal Coating Services Provide:• Rust and corrosion prevention• Electrical insulation• Prolong longevity

Conformal Coating Services Give You:

Qualified coating material: CONAP® CE-1171• Hydrolytic stability & flexibility: MIL-I-46058C• Thermal shock (-65~125°C): MIL-STD-810• Flame resistance, self-extinguishing: FED-STD-406• Fungus resistance, rating 0: MIL-STD-810

Tailored-Made Services• Coating material• Coating for specific part• Coating thickness• Functional check

IPC#1 Factory• ISO standard certified• Automatic coating process• Functional test
• Visual inspection• Failure analysis system

Service Process
Assembly

11

Innovative Technology

Conformal Coating

Verification

DeliveryExtreme Vibration Solutions

MIL-STD-810 anti-vibration design, reliability enhancements, and board verification
The increasing demand in transportation, automation, andmilitary applications has meant anti-vibration features are now
one of the main considerations of customer’s applications.
Military standard MIL-STD-810 is the toughest vibration
requirement in the industry, and where during the development
phase, Advantech provides a variety of services from design tovalidation in order to help customers improve product quality.
Corner bonding for main chips, screw holes for key accessories,
and high frequency vibration tests, are all services that help
customers achieve the reliability needed to meet MIL-STD-810
requirements.

Applications
Transportation

Automation

Defence

Extreme Vibration Services Give You:

DesignAnti-Vibration Design• Key component soldering capability• External mechanical fixing for key accessory

Vibration Test Procedures• Standard IEC60068-2-64 and MIL-STD-810 followed• Test with board operation up to 7.7Grms with in X, Y and Z
axis capability

Reliability Enhancement in Manufacture
Verification

Manufacturing• RTV silicones glue on key connectors• Corner bonding for BGA chips

Optimized Mechanical Design and Custom Services
Corner bond process
Side view

Liquid epoxy

Dispenser

Epoxy

UV light& reflow
Silicon chip

Silicon chip

PCB

PCB

Siliconchip

Bond coverage

Solder bumpPioneering DRAM

Corner Bond Process

Advantech rugged DIMMs are designed with screw holes on
the PCB to prevent vibration and shock impacts. They comewith the flexibility of strong protection and upgrade capability.
Customers can easily maintain and upgrade their memory
without needing special tools. The robust design is suitedfor mission critical environments such as energy mining
machinery and military.

For a product which does not reserve screw holes on PCB,
Advantech provides customization services such as cornerbonding and dispensing for BGA chips or connectors. Cornerbonding and dispensing further secures the chip for ruggedized
applications and can increase reliability for high thermal or
vibration stress, high gravitational acceleration, and high fatigue
cycle applications.

Innovative Technology

12Advanced Manufacturing Process
Improving product quality by IPC-A-610G Class 3 certification
The IPC organization defines 3 classification quality standards fromgeneral level class 1, intermediate level class 2, to the highest levelclass 3. They are awarded to electronic products to determine quality
where continued high performance or equipment downtimes cannot betolerated. They are also given where end-user environments may be
uncommonly harsh, and where equipment must function when required,such as life support systems or other critical systems.
Advantech is one of the industrial vendors who has IPC-A-610G class
3 certified products and can deliver class 3 services from board design,
electronics manufacturing, printed circuit boards (PCB), soldering,assembly equipment, and inspections that fulfill high quality productdemands for markets such as medical, networking, defense, or mining.

IPC J-STD-001/IPC-A-610 Qualified
Manufacturers Listingfor

Advantech Co., Ltd. (Linko Board Factory)
Taoyuan City, Taiwan

The manufactured processes at this facility are in accordance with therequirements of IPC J-STD-001 / IPC-A-610 (Classes 1, 2, and 3).
This site is certified for the QML through April 29, 2022.

Randy Cherry, IPC QPL/QML Director

April 29, 2019

QML-1/610-000042

Date

Certification Number

PCB Design & Manufacturing

PCB Inspection

Board Manufacturing &Inspection

Top Design Quality

Strict Quality Check

High Product Reliability• Strict layout design rules• ISO certified manufacture• Monthly quality testing• IPC-A 6012 Class 3 compliant• Highest IPC standard printed
board inspection• 10% sample tests for each batch
done in house or 3th party lab• IPC-A 600 Class 3 compliant• Inspection with IPC-A qualified• 100% functional check & visualinspection• Regular statistical process &quality track system• IPC-A 600 Class 3 compliant

IPC-A 610G class 3
Manufacturing processes andquality criteria constantly improveand increase product reliability andrequirements for critical applications.

270°
wettedsolderA properly wetted
solder fillet must
circle at least 270°of the way aroundthe lead and barrel
for class 3

Land

Lead

75%
BarrelThe amount ofbarrel fill required forthrough-hole leads
is at least 75% forClass 3 (50% forClass 2).

The wetting of the solder side required
for the land is 270° & lead & barrel mustbe at least 330° for Class 3.
330° wetted solder

13

Innovative Technology

270° wetted solder

On Demand Board Custom Services

Fast and reliable customized services that leverage standard products for quicker timeto-market
The growing demand for embedded applications
rises rapidly, but standard products may not besuitable for customers who seek flexible I/O orform factors. Advantech has multiple options
to support faster development and time-tomarket. For applications that require particularfunctions or platforms with value-added
services, Advantech customization services
are the solution that meets your expectation.
We offer a comprehensive range of products
and services from which to base your solution
on and you benefit from many years of ourexperience in x86 and Arm-based architectures.
We offer many types of customization services
from modular I/O expansion, board redesign, tofull customization. Our exclusive R&D team canhelp customers to design and review their board
solutions so that customers can focus on theirown core technology.

Medical

Networking

Automation

DefenseSemi-System
DesignServices

Thermal &RuggedDesignCarrier Board
Design & Verification

Peripheral
Compatibility

SoftwareService

Board Custom Services Give You:
Leading Embedded
Technologies

Fast Semi-Customized
Services• Early-access programs joined withsilicon partners• Customization based on a standard
foundation with full range of form
factors• Licensed software solutions• Ecosystem partner collaboration• Dedicated support team for hardwareand firmware design

Reliability Enhancement
Services• Product life cycle maintenance• Software maintenance• Logistics management• Extended warranty• Certified peripherals

Innovative Technology

14Comprehensive Embedded Software Services
Accelerate your IoT application development

Any successful project needs to highly integrate hardware and software. Choosing a hardware platform is fairly straightforward,
but finding the right software that can make or break a project takes time and resources. As a leading IPC company, we offer acomprehensive range of hardware platforms, but also on the software side we offer Embedded Software Services aimed at edge
and cloud computing to accelerate your product development.

Public Cloud &Private Cloud

Azure Cloud Services
Azure Cloud Migration Suite

IoT Device Operation Management

Backup & Recovery Solution• Configuration toolkit• Whitelist protection• Prevent zero-day attacks

Windows 10
Lockdown Utility

BIOS &
EmbeddedController• Whole system backup• Runtime incremental backup• One key recovery

HDD Predictive
Maintenance Quality• Unified Write Filter• Keyboard & USB filter• Block Windows update

Operation
SystemAzure Machine Learning

Microsoft Azure / WISE-PaaS / Data Service Server

Embedded Security Solution

Applications& APIsAI Applications

Embedded
Software APIs

• Storage health monitoring• Support hard disk &SQFlash• HDD lifetime prediction• IoT standard compliant• Multiple I/O control• Cross operation
systems

AIM-Linux | AIM-Android

Multi-Layer Security• Storage security• Booting management• Boot guard, BIOS guard

BIOS Customization Tools• Change logo
• DMI edit
• Configuration tool

Embedded Software Services Give You:
Device to Cloud
Software Service

15

Cross-platform software(CPU/OS/Cloud)Long-Term Supports• Sameness and uniformity• Reusable and H/W independent• Trusted partnership• Reliable and trusted foundation• Quicker development time

• Longevity software maintenance• Instant cloud onboarding• Easier maintenance• Increased product quality andsecurity

Software Services

Trusted Embedded BIOS Solutions
Custom BIOS services with long-term support

Advantech provides full-featured Embedded BIOS solutions of proven quality, rapid execution, backed by industry-leading expertise.
We offer reliable and high-quality BIOS services with solid support from our experienced BIOS team. Multi-function designs
include security, power-management, and boot management to fulfill different applications. Additionally, 10+ years of BIOS version
management benefits our clients for internal management and longevity support for both hardware and BIOS. Our comprehensive
services and long-term support enhances application efficiency, diverse functionality, and optimized performance.

Diverse BIOS Functions

Power
Management

Strong ResourcesLong-Term Maintenance
Services

BIOS Suite

Fast
Boot

Logo
Change

OS
I
B
d
dde
e
b
m
E

Storage
Security
DM
I Ed
itor

Con
figu
rati
on T
ools

Smart Fan

BIOS Suite

H
FLAS
ware
Firm

Embedded BIOS Solutions Give You:
Sufficient Sources

Diverse BIOS Functions• Strong partnership with BIOS
vendors• Multi-layer security• 50+ engineers with deep industrial
BIOS experience• Power management

Solified SPIDMI Editor
nge
Cha
Logo

Smart Battery

Long-Term Maintenance
Services• Platform longevity support• 3“ sec fast boot• 10-year BIOS version control• BIOS remote backup• BIOS suite utility

Value-Added Customization Process
Verification

After Service

IO

S

RD Design

B

Request Evaluation

Software Services

16

Allied, Industrial & Modular Linux Services
Unified embedded modularized Linux service to deploy your applications

Allied, Industrial and Modular Linux Services (AIM-Linux) were created to help our customers accelerate theirsoftware development on Advantech platforms by providing a flexible and modular framework, targeting thefoundations of industrial markets, and focusing on long-term BSP maintenance and longevity support. With the
AIM service, Advantech provides you with a verified solid foundation (Unified Embedded Platforms) and industrial
focused value-added support (app, add-ons, and SDKs), plus embedded Linux and Android that allow you tosimply focus on your own vertical application development.

Explore More

AIM-Linux Services Landscape
PaaS & Cloud
Platform

AIM-Linux/Security

AIM-Linux/Launcher

AIM-Linux/Management AIM-Linux/Distribution• Secure Boot
• License Management• Cipher SDK• Quick Boot • Auto Run• Multi Boot • Splash• Boot Logo Screen• SNMP• Multi-Screen Control• Audio Path Control• Yocto• Debian• Realtime

AIM-Linux/DevelopSDK AIM-Linux/Diagnostic

AIM-Linux/Protocol

AIM-Linux/Edge AI• Qt• Java• HTML5• Python• EdgeX Foundry • Go

• RF Diagnostic• Connection Diagnostic• System Diagnostic• CANopen• J1708• J1939• HD PMQ• Pre-trained Models• Edge AI APP

Unified Core

Industrial I/O Drivers• Ubuntu

App Add-Ons

UnifiedEmbedded
Platforms• MODBUS• 1-Wire

Performance
Optimization

Peripheral
Integration

AIM-Linux Services Give You:
Modularized Framework

17

Value-Added Industrial
Apps & SDKs

Longevity BSP Maintenance• Efficient resource allocation• Accelerated development• Reliable foundation• Unified core structure• High efficient library• LTS kernel selected• Easy migration• Comprehensive documentation• Planned roadmap and validation

Software Services

Embedded Ubuntu Built-In Services
Integrated and ready-to-use Linux OS

Ubuntu is the most famous Linux distribution in the market today, but how to get proper support is an important consideration forembedded developers. Through strong relationships between Advantech and Canonical, we can provide an optimized slim Ubuntu
image for Advantech products with verification. We provide Ubuntu and ready-to-use utility tools via our online store service to help
customers accelerate their application development.

Embedded Ubuntu Built-In Services
Give You:No Compile Linux Solutions• H/W and peripheral integration• Performance fine-tune and optimization• Preload licensed OS for shipping

Lice
nse
d OS

orts
upp
S
t
c
Dire

Function & Security Updates• Independent upgrade (APPs, O.S. & kernel)• Upgrade management• Version upgrade support

Ready-to-Use Utility Tools• Public store for various IoT APPs
• Branding store for own APPs
• Customized store and download authority

Product Highlights

RSB-3430• NXP Cortex-A9 i.MX6 CPU• On board 1GB DDR3-1066 and eMMC 4GB• Dual Display by 24-bit LVDS + HDMI
• 1 GbE, 2 USB, UIO 20/40-Express

RSB-4411• NXP Cortex-A9 i.MX6 CPU• On board 1GB DDR3-1066 and eMMC 4GB• Triple Display by 24-bit LVDS + VGA + HDMI
• 1 GbE, 5 USB, 2 CAN

MIO-5373• Intel 8th Gen. Core U-Series• Dual Channel DDR4-2400 up to 32GB
• eDP/LVDS, HDMI, DP Tripple Displays• USB3.1, CANBus, MIOe, 12~24V

Software Services

18

Embedded Feature APIs

Simplified integration and easy configuration with iManager 3.0 and SUSI APIs
Advantech has created Embedded Feature APIs to simplify application development and offer exclusive services to work with
Advantech’s embedded boards. These APIs make it easier to program and configure features while integrating solutions. With
modular and cross platform designs, these new platforms can be easily upgraded without effort needing to be expended onredesigning applications. Embedded APIs also provide an IoT Translator SDK to assist customers with easily integrating theirown devices on Advantech embedded boards. This SDK effectively plays the role of a translator, allowing plug-in functions toconnect to peripherals and run applications. The full functionality of embedded feature APIs provides a building block to accelerate
development, enhance security, and offer add-on value for your end-user applications.

IoT Translator SDK
3rd Party Devices

Backlight
On/Off
Data
Security

SystemProtection

SystemThrottling

DeviceMonitoring

Watch Dog
Timer

SMBus/I2 C
Smart Fan

PoE

I/O
Control

Application
Extension

G-sensor

GPIO
Hardware
Monitor

ThermalProtection
SystemInformation

Cross-Platform

Intelligent
Display

Brightness

Embedded Feature APIs

Easy Upgrade

Fast Development

Advantech Embedded APIs Give You:
Unified APIs

19

Self Management• Standard API for hardware platform• I/O control• Cross-platform programming• System protection• Easy upgrade and maintenance• Device monitoring• Ready to use IoT translator SDK• Application extension

Software Services

WISE-PaaS/DeviceOn

Power up IoT devices with 24/7 operation management
WISE-PaaS/DeviceOn provides an equipment maintenance and management software solution. Grouping
settings to make instant device onboarding easy to deploy to the cloud. It offers real-time monitoring functions tocheck device status, with remote controls for device operations and troubleshooting. Additional OTA updates andbackups ensure better system security and protection.

UpdateManagement

Explore MoreMonitoring
Control

Alert & Action
DeviceManagement

WISE-Paas/DeviceOn Give You:
Device Management• Mass device onboarding• Cross-platform
deployment to Azure• Group sharing

BIOS & FramworkOTA Update• Remote BIOS andfrimwork updates• BIOS recovery
mechanism• Backup and restore

Remote Monitor& Control• Whitelist protection• USB lock, keyboard filterand screen on/off• Remote terminal• Remote backup andrestoreAlerts & Actions• Notifications by message
and mail• Grouping event log• Remote desktop
troubleshooting• USB device fail resume

Software Services

20

Multi-Layer Security Solutions

Effectively protect your devices from devices to the cloudIn the IoT Era, security becomes more important as more and more devices are connected. At Advantech, we provide multi-layered
security from the edge to cloud. We not only offer secure software security but also secure hardware through functions for device
protection, storage security, and application add-on services. Our multi-layered security provides you with reliable platforms andpeace of mind.

Centralized IoT Device Security Management
McAfee™ embedded solutions provide superior and intelligent security functions, such as whitelisting and blacklisting for protecting
IoT devices and data from zero-day attacks, monitoring/tracking system changes, and guarding entire systems with McAfee Global
Threat Intelligence. WISE-PaaS/Security, empowered by McAfee™, provides a centralized IoT security management console on
Azure for deploying security policies that ensure data and device protection. Our IoT platforms can be configured with McAfee™
function modules to satisfy diverse vertical applications and scenarios.

Convenient and Secure Backup and Recovery Solution
As digital data is an essential asset for any consumer centered business organization, it’s crucial that clients have strong dataprotection systems in place. Additionally, the ability to restore systems to their factory settings on-site saves time and reduces costs
for both system integrators and end users. Leveraging Acronis’ award-winning technology, Acronis OEM solutions are specificallydesigned to satisfy the needs of OEMs.

Application
Add-OnStorage
Security

Flash lock with board
Software protection
AES 256 encryption

DeviceProtection

Advantech Security Solutions Give You:
Device Protection

21

Storage Security

Applications• Secure boot certified device• HDD access control• SSL/TLS• Authority control• Storage encryption• Blacklisting and whitelisting• TPM• Configuration tool

• Powerful recovery and easy backup

Software Services

Embedded Linux & Android Alliance (ELAA)
Ecosystem for embedded Linux & Android industrial applications

Embedded Linux & Android Alliance (ELAA) is an industry alliance committed to driving the unification and board
adoption of an open architecture standard for embedded Linux and Android cores in industrial embedded systems.

ELAA
Marketplace

Explore More

OnlineCommunity

Embedded Linux & Android Alliance

ELAA Unified Development Platform ArchitectureLinux Kernel
Industrial Peripheral Modules
Application Modules
SW Components & MiddlewareStandardized Hardware Solutions
SMARC

QsevenELAA Give You:

RTX

SBC

Unified Architecture

Extensive Software Offerings

The ELAA Unified Development Platform provides a unified
hardware and software architecture across different industrial
embedded applications. Users can leverage resources from one
project to another with minimized learning curves and effort.

Empowered by alliance members, ELAA provides extensive
software offerings throughout various kinds of OS, kernels,
drivers and industrial applications.

Longevity Support

Pre-integrated hardware and software platform to accelerate thePOC to MP cycle.

Provide hardware platform, kernel and firmware upgrades tomembers and customers during the whole SoC life cycle.

Integrated Peripherals
ELAA Unified Development Platform integrates multiple
industrial peripherals verified on different OS and hardware
platforms.

Faster Time-to-market

Global Partner Eco-system
Partners across the supply chain and geo-regions support
customers’ business development and expansion.

Software Services

22

Embedded PCs : Configuration-to-Order Services
Select-and-Go process to fulfill extensive market demands

We live in an era of growing diversity. The variety of digital world and corresponding business models multiplies swiftly. Numerous
combinations among different I/O ports, connectivity options, CPU platforms and OS systems are configured to manage each
dedicated application. Consequently, quick responses to meet all different demands become inevitable.

Select Model
Processor
ThermalI/O Ports
Cable

Adaptor
ChassisMounting Kits

Select Peripherals

Install Software

Ready to Ship

MemoryStorage

Device Management

Riser
Card

Embedded OS

Function Test
Burning Test

Wi-Fi
4G/LTE

Embedded
BIOS

GlobalDeliveryIoT Device Operation Management

SystemAssembly

Advantech CTOS Give You:
Feasibility Verified in NPI• Feasibility verified in NPI• ISO 17025/CNLA & UL certified lab
for EMC, safety & reliability tests• Complete & thorough DQA test flows• All components, peripherals, systems
and software are crosschecked

Global Operations

Step-by-Step Ready• Selection guide ready to build adedicated system• Global manufacturing network readyfor assembly• Comprehensive choices for allcomponents• Global logistics ready for delivery• Just select-and-go, no further effort
required• Global FAE network ready fortechnical support

Product Highlights

EPC-U Series• Small footprint fanless PC• Sufficient connectivity• From Intel® Atom® to CORE-i

23

EPC-S Series• Factory automation & HMI focused• Compact design: 139x100x44mm• Sufficient I/O, USB, COM, DIO,VGA

EPC-T Series

EPC-B Series• Slim 44mm with up to 65W CPU• Plentiful I/O and expansion options• A wide range of CPU options• High performance CPU• Multiple I/O and expansion options• User-friendly mechanical design

Integration Acceleration

EPC-C301

EPC-R Series• Automation & medical application• Compact and efficient Arm-based
focusedPC• Compact size with integrated GbE • Linux/Android OS support
USB CANBus• Industrial peripheral pre-integration• Expansions for WiFi, LTE, NVMe, AI

EPC-P Series• Machine vision industrial PC• Up to 4 PCIe expansions• Intel 8th/9th Gen CORE-I CPU

Embedded Wireless Modules & Design-In Services
Simplifying wireless connectivity for IoT platforms

To help customers quickly develop intelligent platforms with wirelessfunctions, Advantech offers streamlined wireless design-in services
including wireless module design package with RF certification, optimalantennas and module configuration, wireless system performanceverification, and an online document center. All provided by Advantech’s
expert team to help customers create an efficient development
environment.

Benefit from:• Streamlined design-in service• Wireless certification• Conformal coating and underfill• Wide temperature range (-40~85°C)• Various wireless technologies

Industrial Wireless Technology• WiFi/BT• 3G/4G LTE• GPS• LPWAN

Standard Form Factor Mini PCIe
• M.2 1216 solder down
• M.2 2230
• M.2 3042
• Mini PCIe

RF Certification Design Service• RF certification equipment reports• RF test SW/tool

Wireless Software Integration• Multi OS driver• Wireless connection management tool
• SW AP / fast roaming

Product Highlights
LTE

EWM-C148

Mini PCI-e FMC
LTE CAT4

EWM-C117

Mini PCI-e FMC
LTE CAT4GPS

EWM-C148S

LGA solder down
LTE CAT4

Wi-Fi & Bluetooth

EWM-W195

M.2 2230
802.11 a/b/g/n/ac 2*2+BT4.2

EWM-W190

Mini PCI-e HMC
802.11 a/b/g/n/ac 2*2+BT4.2

EWM-G109

Mini PCI-e HMC
NEO-M8N multi-GNSS

NB-IoT

EWM-W158

Mini PCI-e FMC
802.11 b/g/a/n 2*2

EWM-NB147

Mini PCI-e FMC
Cat M1 / NB1 engine

Integration Acceleration24

Industrial Flash and Memory Solutions
High reliability, 360-degree security, and design-in services

Advantech SQFlash SSDs and SQRAM memory modules are designed with the best quality chips from original IC
vendors to ensure consistent quality. They also apply strict 100% screen testing and 3-year longevity to guarantee
industrial-grade stability and reliable 24/7 operation. With SQ security features and smart management software,
SQFlash and SQRAM are the ideal memory products for various AIoT applications.

Explore More

Self-management
Security Inside

Wide Temp.

Comprehensive Security and Software Integration

SQRAM Manager

SQFlash Manager

Cloud-based Management• Operating temperature monitoring• Status and endurance estimation• WISE-PaaS compatible• Temperature alerts when over 65°C

• TCG compliant drive enryption andquick erase• Remote Monitoring• SPD information and timing table

25

Integration Acceleration• Disk security management andencrytion• Predictive MaintenanceAdvanced Thermal Solution
Industrial heatsink cools SSD by up to 30°C

Flexible thermal grease prevents
physical damage

Smart thermal throttling against
sudden performance drop

Remote health and temperaturemonitoring

Flexible Customization• 30-day time to market design-in service• Extended longevity: 3 to 5 years• Early access to the latest Flash technology• System integration with FPGA and firmware support

Product Highlights
SQFlash Storage Modules
Complete Form Factor Selection

Advanced Thermal Solution

2.5" SSD, mSATA, M.2, DOM,
CFast, Half-Slim, etc.

Industrial heatsink on high-capacity
NVMe SSDs

0~55 °C

0~70 °C-10~70 °C-40~70°C

40~85 °CSQRAM Memory Modules
Server-Grade Performance

Thermal & Robust Solution

SODIMM, UDIMM, ECC DIMM, and RDIMM
with monitoring software

Optional heatsinks and rugged DIMMs
against extreme vibration and shock.

Integration Acceleration

26

Advantech Industrial Display Solutions
Seamlessly integrated with all embedded platforms

Advantech designs, develops and manufactures display systems that meet the demands of industrial display markets in gaming,
transportation, medical, and many system integration markets globally. Combining proven technologies and flexible manufacturing,
Advantech creates class leading solutions for your customers that deliver significant product differentiation and competitive
advantage. Our customer-centric approach reinforces all of our activities and is an essential part of the thousands of products weship daily.

Product Highlights
Industrial Touch LCD Kits

IDK-1000 Series

Indoor LCD Kit
5.7"~21.5"

Industrial Monitors

IDK-2000 Series

Outdoor LCD Kit
8.4"~21.5"

IDS-3100/ IDS-3200 Series

IDS-3300 Series

IDP Series Series6.5”~21.5”

15”, 19”, 21.5”

15”, 15.6”, 21.5”

Open Frame/ Panel Mount

IP-65 Rated

Proflat

Digital Signage & Gaming Displays

DSD-3000/ DSD-5000/ DSD-7000 Series

Large Format/ Stretched32"/42"/55"/65", 28"/38", 55"

27

Integration Acceleration

CRV Series(J type/C type)CRV Series(J type/C type)43", 55" UHD

4K C/J Type Curved Display
CRV-430WP / CRV-430JP• Screen size: 43”• Radius: 1500
• Resolution: 3840 x 2160
• Multiple interface: VGA, HDMI, DP• Touch integration: projected capacitive touch• Long backlight lifetime: 50,000 hrs

Ultra Wide Temperature LCD Kit
IDK-2112U• Screen size: 12”• Resolution: 1024 x 768• High brightness: 1200nits• Ruggedized design: -40~70°C operating temperature• Touch integration: projected capacitive touch• Intelligent control: automatic thermal on/off control

4K All-in-One Signage Display
DSD-7055• Screen Size: 55”• High Resolution: 1920 x 1080
• Brightness: 500nits• Backlight life time: 50,000 hrs• Easy maintenance: Intel SDM slot design

Integration Acceleration28

Product Selection Guide

Computer On Modules

Model Name
Form Factor
Pin-out Type

MemoryGraphics

Expansion

Serial Bus

Ethernet

I/O

MechanicalSOM-9590

COM Express BasicCOM Express BasicCOM R3.0 Type 7

COM R3.0 Type 6

COM R3.0 Type 6

COM R3.0 Type 7Intel® 9th/8th Gen. Corei7/i5/i3/Xeon

AMD V1000 V1807B/
V1756B/V1605B/V1202B

Intel® Xeon Processor
D-1500 Product Family
Xeon D-1539

Base Frequency

2.2 - 1.3 GHz

2.2-1.5GHz

3.0 - 1.6 GHz

3.35 - 2.0 GHz

1.6GHz

Processor Core

16/12/8/6/4/2

16/12/8/4/2

6/4

4/2

8

LLC

24/12/6/3MB

16/12/8/4MB

12/9/8/6MB

2/1MB

12MB

CPU TDP

45/35/25W

31/25/16/8.5W

45W

35-54/12-25W

35W

Chipset--Intel QM370/CM246--

Technology

DDR4 2400/2133/1866

DDR4 2400/2133/1866

DDR4 2400/2133

DDR4 3200/2400

DDR4 2133MHzECC Support

ECC and non-ECC

ECC and non-ECC

ECC (Xeon only)

ECC and non-ECC

ECCMax. Capacity

128GB

128GB

96GB (Support withspecific SKUs)

32GB

Up to 32GB

Socket4 x 260P SODIMM

4 x 260P SODIMM

3 x 260P SODIMM

2 x 260P SODIMM

Solder-down memory

Controller--

Intel® UHD Graphics 630/
P630

AMD Vega GPU-

Max. Frequency--

1.2 - 1.0GHz

1.3-1.0GHz

-

VGA

-

-

1

1

-

LCD (TTL/LVDS/eDP)--

LVDS 2-CH 18/24-bit
BOM option support eDP

LVDS 2-CH 18/24-bit
BOM option support eDP-

DDI (HDMI/DVI/
DisplayPort)--2; up to 3

2; up to 3-

Multiple Displays--

Triple-Display

Quad-Display-

PCIe x16

1

-

1

-

1

PCIe x8

1

1

-

1

1

PCIe x4

-

1

-

-

-

PCIe x1

7

-

8

6

7

ISA Bus

-

-

-

-

-

LPC

1

1

1

1

1

SMBus

1

1

1

1

1

I2C Bus

1

1

1

1

1

CAN Bus--

Optional

Optional-

Gigabit Ethernet

Intel® I210AT/ITIntel® I210AT/ITIntel® I219LM

Intel® I210AT

Intel® I210AT/IT

GbE Speed

10/100/1000Mbps

10/100/1000 Mbps

10/100/1000Mbps

10/100/1000Mbps

10/100/1000Mbps

10GB Ethernet

2

4

-

-

2

SATA

2

2

4

2

2

PATA Channel

-

-

-

-

-

USB3.0

4

4

4

3

4

USB2.0

4

4

8

8

4

Audio

-

-

HD Audio

HD Audio-

SPI Bus

1

1

1

1

1

GPIO

8

8

8

8

8

SDIO (GPIO pin shared)--

Optional--

Watchdog

1

1

1

1

1

COM Port

2 (2-wire)

2 (2-wire)

2 (2-wire)

2 (2-wire)

2 Ports (2-Wire)

LPT/FDD

-

-

-

-

-

PS/2

-

-

-

-

-

IR

-

-

-

-

-

Onboard Storage

-

eMMC

-

-

SATA SSD 16GB

TPM2.0TPM2.0TPM2.0TPM2.0TPM2.0

ATX: Vin, VSB, AT: Vin

ATX: Vin, VSB, AT: Vin

ATX: Vin, VSB; AT: Vin

ATX: Vin, VSB, AT: Vin

ATX: Vin, VSB, AT: Vin

Vin: 8.5-20V
VSB: 4.75-5.25V

Vin: 8.5-20V
VSB: 4.75-5.25V

Vin: 8.5-20V
VSB: 4.75-5.25V

Vin: 8.5-20V
VSB: 4.75-5.25V

Vin: 8.5-20V
VSB: 4.75-5.25V

Power Consumption Max.

55.5W

32.67W

57.7W

39.98 W

48.891W

Power Consumption Idle

12.3W

11.88W

7.1W

7.34 W

12.756W

Operating Temp.

0 ~ 60° C (32 ~ 140° F)

0 ~ 60 °C (32 ~ 140 °F)

0 ~ 60 °C (32 ~ 140 °F)

0 ~ 60 °C (32 ~ 140 °F)

0 ~ 60 °C (32 ~ 140 °F)

Extended Temp.(Optional)-40 ~ 85 °C (-40 ~ 185 °F) -40 ~ 85 °C (-40 ~ 185 °F) -40 ~ 85 °C (-40 ~ 185 °F)--40 ~ 85 °C (-40 ~ 185 °F)

125 x 95mm
(4.92" x 3.74")

125 x 95 mm(4.92" x 3.74")

Supply Voltage

Dimensions

Note: “-” : means Not Applicable (N/A)

29

SOM-5871

COM Express BasicIntel® Atom® Processor
C3000 Series

Power Type

Environment

SOM-5899/SOM-5899R

COM R3.0 Type 7

TPM

Power

SOM-5962
COM Express BasicIntel® Xeon Processor
D-1500 Product Family

CPU
Processor
System

SOM-5992
COM Express Basic

Product Selection Guide

125 x 95mm
(4.92" x 3.74")

125 x 95 mm(4.92" x 3.74")

125 x 95mm
(4.92" x 3.74")

Product Selection Guide

Form Factor
Pin-out Type

Model Name

Base Frequency

1.6-1.1GHz

2.2 -1.7 GHz

1.6-1.1GHz

1.6-1.1GHz

1.6 - 1.1 GHz

Processor Core
LLC
CPU TDP
Chipset

4/2
2MB
12/9.5/6.5/6W
-

4/2
4/2MB
15W
-

4/2
2MB
12/9/6W-

4/2
2MB
12/9.5/6.5/6W-

DDR3L 1866/1600

DDR4 2400

4/2
2MB
6/6/12/9.5/6.5W
DDR3L 1866 for nonECC/1600 for ECC
A1: non-ECC; B1: ECC(E3900 SKU only)
8GB

LPDDR4 2400

LPDDR4 2400

ECC Support
Max. Capacity

LCD (TTL/LVDS/eDP)
DDI (HDMI/DVI/
DisplayPort)
Multiple Displays
PCIe x16
PCIe x8

Serial Bus

Ethernet

I/O

-

-

8GB

8GB

Intel® HD Graphics
750-550MHz
LVDS: 1-CH 18/24-bit
BOM optional eDP12 (DDI2 for option)

2 (DDI2 for option)

1

2

Dual-Display-

Triple-Display-

Dual-Display-

Triple-Display-

4 (optional 5)

4 (optional 1 PCIex4)

4

1
1
1
OptionalIntel® I210IT/I210AT
10/100/1000Mbps
2
2
8
HD Audio
1
8
1

1
1
1
OptionalIntel® I211AT
10/100/1000 Mbps-

1
1
1
OptionalIntel® I210AT/IT
10/100/1000Mbps
1
2
6
HD Audio / I2S AudioYes
Up to 12
Optional
1
4 (2 Ports: 4-wire/2 Ports:
2-wire)eMMC
TPM2.0
ATX: Vin; AT: Vin-

2 x 204P SODIMM--

Intel® HD Graphics
750 - 550MHz
1
LVDS 2-CH 18/24-bit
BOM optional eDPIntel® HD Graphics
750-550MHz
LVDS 2-CH 18/24-bit
BOM optional eDPIntel® HD Graphics
750-550MHz
LVDS 2-CH 18/24-bit
BOM optional eDP

PCIe x1

4 (optional 1PCIe x4)
1
1
1
OptionalIntel® I210AT/IT
10/100/1000Mbps
2
2
8
HD Audio181
2 (2-Wire)

2 (2-wire)

2 (2-wire)eMMC
TPM2.0ATX:Vin, VSB, AT:Vin
ATX (Vin 4.75-20V,
Vsb 4.75-5.25V)
AT (Vin 4.75-20V)
12.886Watt. (N4200),
11.999Watt. (N3350)
2.555Watt.(N4200),
2.783Watt. (N3350)
0 ~ 60 °C (32 ~ 140 °F)-40 ~ 85 °C (-40 ~ 185 °F)(E3900 SKU only)
84 x 55 mm(3.3" x 2.17")

eMMC
TPM2.0
ATX: Vin, VSB; AT: Vin

TPM2.0
ATX: Vin, VSB; AT: Vin
ATX (Vin 4.75-20V,
Vsb 4.75-5.25V)
AT (Vin 4.75-20V)

1(Optional 2)
8
HD Audio
1
SD3.0
1
1
2 (4-wire COM 1 port,
2-wire COM 1 port)
eMMC
TPM2.0
ATX: Vin, VSB, AT: Vin
Vin: 5V±5%,
VSB: 5V±5%,
RTC Battery: 2.0-3.3V

14.76W

5.89W

Supply Voltage
Power Consumption Max.
Power Consumption Idle

Mechanical

32GB
2 x 260P SO-DIMM (Dual
Channel)Intel® UHD Graphics 620
1.15 GHz-1.0 GHz
1
LVDS 2-CH 18/24-bit
BOM optional eDP

PCI Masters
ISA BusLPC
SMBus
I2C BusCAN BusController
Speed
10GB Ethernet
SATA
PATA Channel
USB3.1
USB3.0USB2.0Audio
SPI BusGPIO
SDIO (GPIO pin shared)
Watchdog

LPT/FDD
PS/2
IR
Onboard Storage
TPM
Power Type

Environment

ECC (E3900 SKU only)
and non-ECC
8GB

Triple-Display
4 PCIe x1 +1 PCIe x4(optional 5)1
1
1
OptionalIntel® I219 LM
10/100/1000Mbps
2 (3 for Optional)
1
4
8
HD Audio
1
8
Optional
1

COM Port

Power

SOM-2569

SMARC Small
SMARCIntel® Atom E3900/
Pentium/Celeron Series

Controller
Max. Frequency
VGA

Expansion

SOM-3569

QSeven
QSeven 2.1
Intel® Atom E3900/
Pentium/Celeron Series

SocketGraphics

SOM-6869

COM Express Compact
COM R2.1 Type 6Intel® Atom E3900/
Pentium/Celeron Series

Technology
MemorySOM-6882

COM Express Compact
COM R3.0 Type 6Intel® 8th Gen Core i7/i5/
i3/Celeron series

CPU
Processor
System

SOM-7569

COM-Express Mini
COM R2.1 Type 10
Intel® Atom E3900/
Pentium/Celeron Series

Operating Temp.
Extended Temp. (Optional)
Dimensions

Vin: 8.5-20V
VSB: 4.75-5.25V
59.72W

Vin: 4.75-5.25V
14.11 W

4.2 W

4.46W

3.71W

3.45 W

0 ~ 60 °C (32 ~ 140 °F)-40 ~ 85 °C(-40 ~ 185 °F)
95 x 95 mm(3.74'' x 3.74")

0 ~ 60° C (32 ~ 140° F)-40 ~ 85 °C(-40 ~ 185 °F)
95 x 95 mm(3.74" x 3.74")

0 ~ 60 °C (32 ~ 140 °F)-40 ~ 85 °C(-40 ~ 185 °F)
70 x 70 mm(2.75" x 2.75")

0 ~ 60 °C (32 ~ 140 °F)-40 ~ 85 °C (-40 ~ 185 °F)(Atom x7-E3950 Only)
82 x 50mm(3.23" x 1.97")

Product Selection Guide

30

Product Selection Guide

Embedded Single Board Computers
MI/O Extension 3.5" SBCs

Form Factor

Model NameCPUCPU TDP

Processor
SystemMemoryFrequency
Core Number
Last Level Cache
BIOS
ChipsetTechnology
Max. Capacity
SocketController
Graphic Memory

Display

Expansion
Interface

VGA
LCD (LVDS/eDP)
DDI (HDMI/DVI/
DisplayPort)
Multiple Display
Mini PCIeSIM Socket
SMBus
I2C
M.2 slot
MIOe

Ethernet

Audio
WatchDog Timer
Storage

I/O

SecurityPower

Controller
Speed
Connector
Audio Interface
CODEC
AmplifierConnector
SATA
mSATA
CFast
USB3.0USB2.0GPIO
COM Port
Reset Button
Smart Fan
TPMPower TypePower Supply Voltage
Connector
Power Consumption(Idle)
Power Consumption(Full Load)

Environment
PhysicalCharacteristics
Operating
SystemCertification

31

Battery
Operational
Temperature
Dimensions(L x W x H)
Microsoft WindowsLinux
SUSIAccess/
WISE-PaaS/RMM
iManager/SUSI 4.0
EMC

Product Selection Guide

MIO-5393

3.5" MI/O-Compact
Intel® Xeon® E-2276ME/®
Intel Core™ i7-9850HE/i7-9850HL/i5-8400H
45W/45W/25W/45W
2.8 GHz (Turbo: 4.5GHz) / 2.7 GHz (Turbo: 4.4GHz) /1.9 GHz (Turbo: 4.1GHz) / 2.5 GHz (Turbo: 4.2GHz)
6/ 6/ 6/ 4
12MB/ 9MB/ 9MB/ 8MB
AMI UEFI 256Mb
Intel CM246 / QM370
DDR4 up to 2400MHz
up to 64G
2x 260P SODIMM
Intel Gen 9 low power graphics (Intel® UHD Graphics P630/630)
HW Decode:AVC/VC1/MPEG2/HEVC/VP8/JPEG
HW Encode: AVC/MPEG2/HEVC/VP8/JPEG
48-bit LVDS up to WUXGA 1920 x 1200 at 60Hz
Supports 3.3/5/12V for VDD power, 5/12V for inverter
HDMI 1.4 up to 4096 x 2160 @ 30Hz ;DisplayPort 1.2 up to 4096 x 2304 @ 60Hz
Triple simultaneous displays with HDMI + DP + LVDS
1
1
1
1 x E-Key 2230; 1 x B-Key 2280/3042 (*optional M-Key 2280)
DDI x 1, 4 PCIe x1, USB3.0/2.0
LPC, SMBUS, rest, line out, power on
GbE1: Intel I219
GbE2: Intel I210
10/100/1000Mbps
RJ45 x 2
High Definition Audio
Realtek ALC888S
optional via MIOe
Line-in, Line-out, Mic-in
255 level timer interval
2, up to 6Gb/s (600 MB/s)
4 (USB 3.1 Gen.2)
2 (Internal)
2 x 8bit GPIO (5V tolerance)
2 x RS-232/422/485 from COM1/2 with auto flow control(ESD protection: air gap ±15kV, contact ±8kV)1
1
TPM 2.0
single 12V DC power input
12V ± 10%
ATX 2x2P (DC Jack optional)
E-2276ME/i7-9850HE/i7-9850HL/i58400H: 11.55W

MIO-5391

3.5" MI/O-Compact
Intel® Xeon® E3-1505MV6/®
Intel Core™ i7-7820EQ/i5-7442EQ/i3-7102E
45W/45W/25W/25W
3.0 GHz (Turbo: 4.0GHz)/3.0 GHz (Turbo: 3.7GHz) /2.1 GHz (Turbo: 2.9GHz) / 2.1 GHz (Turbo: 2.1GHz
4/4/4/2
8MB/8MB/6MB/3MB
AMI UEFI 128Mb
Intel CM238 / QM175
DDR4 up to 2400MHz
up to 32G
2x 260P SODIMM
Intel Gen 9 low power graphics (Intel® HD Graphics P630/630)
HW Codec: H.265/HEVC 8bit/10bit encode/decode
48-bit LVDS up to WUXGA 1920 x 1200 at 60Hz
Supports 3.3/5/12V for VDD power, 5/12V for inverter
Supports 2 x HDMI 1.4 for HD Video playback
Max resolution up to 4096 x 2304 @ 30Hz
HDMI + LVDS, Dual HDMI + LVDS
1 x Full-size
11
1 (Shared with SMBus pin)
DDI x 1, 4 PCIe x1, USB2.0
LPC, SMBUS, rest, line out, power on
GbE1: Intel I219
GbE2: Intel I210
10/100/1000Mbps
RJ45 x 2
High Definition Audio
Realtek ALC888S
optional via MIOe
Line-in, Line-out, Mic-in
255 level timer interval
2, up to 6Gb/s (600 MB/s)
supports either mSATA or full size miniPCIe
4
2 (Internal)
2 x 8bit GPIO (5V tolerance)
2 x RS-232/422/485 from COM1/2 with auto flow control(ESD protection: air gap ±15kV, contact ±8kV)1
1
TPM 2.0
single 12V DC power input
12V ± 10%
ATX 2x2P (DC Jack optional)
i7-7820EQ: 8.2W
I5-7440EQ: 6.595W
I3-7100E: 5.333 W

E-2276ME: 102.75W
i7-9850HE: 95.38W
i7-9850HL: 44.55W
i5-8400H: 74.44W
Lithium 3V/210mAH
0 ~ 60 °C (32 ~ 140 °F); Extend: -40 ~ 85 °C (-40 ~ 185 °F)(Operational humidity: 40 °C @ 95% RH Non-Condensing)

Lithium 3V/210mAH
0 ~ 60 °C (32 ~ 140 °F); Extend: -40 ~ 85 °C (-40 ~ 185 °F)(Operational humidity: 40 °C @ 95% RH Non-Condensing)

146 x 102 mm (5.7" x 4")

146 x 102 mm (5.7" x 4")

Yes
Yes

Yes
Yes

i7-7820EQ 67.6W
I5-7440EQ: 50.729W
I3-7100E: 29.623 W

Yes

Yes

Yes
CE, FCCYes
CE, FCC

Product Selection Guide

MI/O Extension 3.5" SBCs

Form Factor

Model Name

CPU TDPFrequency

1.70 GHz/ 1.60 GHz/ 2.20 GHz

CPU

Processor
SystemMemory

Display

Expansion
Interface

Audio

I/O

SecurityPower

LCD (LVDS/eDP)

LVDS 48-bit, up to 1920 x 1200 at 60Hz

DDI (HDMI/DVI/
DisplayPort)

HDMI: up to 4096 x 2160 at 24 Hz

HDMI: up to 4096 x 2160 at 24 Hz

48-bit LVDS/eDP+HDMI+DP
11
1
1 x M.2 E-key 2230
1 x M.2 M-key 2280 support SATA or NVMe,
optional B-key 3042

VGA + HDMI + LVDS
2 x Full-size
11
1 (Shares with SMBus pin)--

SMBus, USB3.0, LPC, 2 x PCIe, line-out
Displayport (optional), Reset,
PowerOn, +5Vsb, +12Vsb
GbE1: Intel i219, GbE2: Intel i210
10/ 100/ 1000 Mbps
RJ45 x 2
High Definition Audio
Realtek ALC888S
Optional via MIOe
Line-in, Line-out, Mic-in

Displayport (optional), SMBus, 3 x USB2.0,
LPC, 1 x PCIe x1, line out, +5 Vsb/+12 Vsb
power, Power On, Reset#
GbE1 & GbE2: Intel i210
10/100/1000Mbps
RJ45 x 2
High Definition Audio
Realtek ALC888S
Optional via MIOe
Line-in, Line-out, Mic-in
255 levels timer interval, programmable bysoftware
2* SATAIII (Max. Data Transfer Rate up to
6.0 Gb/s)

M.2 slot

Controller
Speed
Connector
Audio Interface
CODEC
AmplifierConnector

PhysicalCharacteristics
Operating
SystemCertification

4 PCIex1(x1/x2/x4), USB2.0, LPC, SMBus,
Line-out, 12V/5V Power supply
GbE1: Intel i219, GbE2: Intel i210
10/ 100/ 1000 Mbps
RJ45 x 2
High Definition Audio
Realtek ALC888S
Optional via MIOe
Line-in, Line-out, Mic-in
255 levels timer interval

255 levels timer interval

SATA2, up to 6 Gb/s (600 MB/s)

2, up to 6 Gb/s (600 MB/s)

mSATA

-

CFast
USB3.1
USB3.0USB2.0GPIO

Reset Button
Smart Fan
TPMPower TypePower Supply Voltage
Connector

42 (from internal)
16-bit general purpose input/output
1 x RS-232/422/485,
2 x GPIO 8b (default) or
2 x RS-232 (*by request)
1
TPM 2.0
AT/ATX
12V-24V +/- 10%
ATX 2x2P (DC Jack optional)

Power Consumption(Idle)

i7-8665UE: 6.61W (12V)
i7-8665UE: 7.42W (24V)

Power Consumption(Full Load)

i7-8665UE: 30.10W (12V)
i7-8665UE: 33.33W (24V)COM Port

Battery
Environment

1.1GHz/1.1GHz/1.6GHz/1.6GHz/1.3GHz

AMI UEFI 256Mbit
DDR4-2400MT/s
32 GB
2 x 204-pin SODIMM
Intel® WHL-U SoC integrated
Shared with system memory up to 3968MB-

WatchDog Timer

Storage

MIO-5350

3.5” MI/O-Compact
Intel Pentium N4200 Celeron N3350 &Atom™ E3950/E3940/E3930
6W/6W/12W/9W/6W®

4/2/4/4/2
2
AMI UEFI 64 Mb
DDR3L 1867 MHZ
8 GB
1 x 204-pin SODIMM
Intel Gen9 graphic engine
Shared with system memory up to 1792MB
2560 x 1600 at 60Hz
48-bit LVDS up to WUXGA 1920 x 1200
at 60HzHDMI 1.4a for HD video playback, 1080P
at 60Hz
Displayport*, up to 2560 x 1600 at 60Hz
VGA + LVDS (eDP *) + HDMI (DP*)
1 x Full size
1
1 (Shares with SMBus pin)

Multiple Display
Mini PCIeSIM Socket
SMBus
I 2C

4/4/2
2MB

MIO 5272

3.5" MI/O-Compact
Intel Core i7-7600U/i7-6600U/
i5-6300U/i3-6100U/Celeron 3955U*
15W
2.8(Turbo: 3.9)GHz/
2.6(Turbo: 3.4)GHz/
2.4(Turbo: 3.0) GHz/
2.3 GHz/ 2.0 GHz
2
4MB/4MB/ 3MB/ 3MB/ 2MB
AMI UEFI 128 Mbit
DDR3L 1333/1600 MHz
16 GB
2 x 204-pin SODIMM
Intel® HD Graphics 620/520/510 (Celeron)
Shared with system memory up to 3968MB
Up to 1920 x 1200 at 60 Hz
LVDS 48-bit, up to1920 x 1200 at 60Hz

Core Number
L2 CacheL3 Cache
BIOS
ChipsetTechnology
Max. Capacity
SocketController
Graphic Memory
VGA

MIOe
Ethernet

MIO-5373

3.5" MI/O-Compact
Intel Core i7-8665UE/i5-8365UE/
i3-8145UE/Celeron 4305U*
15W

Operational
Temperature
Dimensions (L x W x H)
Microsoft WindowsLinux
SUSIAccess/
WISE-PaaS/RMM
iManager/SUSI 4.0
EMC

Supports either mSATA or full size miniPCIe,default support mSATA-

1 x Full size-2
4 (2 from rear, 2 from internal)
8-bit general purpose input/output

2
4 (2 from Rear, 2 from Internal)
8-bit general purpose input/output

2 x RS-232/422/485
with RS-485 auto flow control

2xRS-232, 2xRS-232/422/485 with RS-485
auto flow control
1
TPM 2.0 (optional)
Single 12V DC power input
Supports single 12V input,±10%
ATX 2x2P/ DC Jack

Lithium 3 V / 210 mA
0 ~ 60 °C (32 ~ 140 °F)(Operational humidity: 40 °C @ 95% RH
Non-Condensing)1
TPM 2.0 (optional)
Single 12V DC power input
Supports single 12V input, ± 10%
ATX 2x2P (DC Jack optional)
i7 7600U: 6.46W / i7 6600U: 6.46 W/
i5 6300U: 5.26 W / i3 6100U: 5.02 W/
Celeron 3955U: 4.88 W
i7 7600U: 22.03 W
i7 6600U: 22.03 W/
i5 6300U: 20.87 W/
i3 6100U: 20.45 W/
Celeron 3955U: 17.81 W
Lithium 3 V / 210 mA
0 ~ 60 °C (32 ~ 140 °F)(Operational humidity: 40 °C@ 95% RH Non-Condensing)

146 x 102 mm (5.7" x 4")

146 x 102 mm (5.7" x 4")

146 x 102 mm (5.7" x 4")

Yes
Yes

Yes
Yes

Yes
Yes

Yes

Yes

Yes

Yes
CE, FCCYes
CE, FCCYes
CE, FCC

N4200: 0.4A @ 12V (4.80W)
N3350: 0.4A @ 12V (4.80W
N4200: 1.26A @ 12V (15.12W)
N3350: 1.29 @ 12V (15.48W)
Lithium 3 V / 210 mAH
0 ~ 60 °C (32 ~ 140 °F)(Operational humidity: 40 °C@ 95% RH Non-Condensing)

Product Selection Guide

32

Product Selection Guide

Embedded Single Board Computers3.5" Single Board Computers

Form Factor

Model Name

CPU TDPFrequency
Core Number
L2 Cache
BIOS
Chipset3.5" SBCIntel® Pentium N4200 Celeron N3350 &Atom™ E3950/E3940/E3930
6W/6W/12W/9W/6W
1.1GHz/1.1GHz/1.6GHz/1.6GHz/1.3GHz
4/2/4/4/2
2MB
AMI EFI 16Mbit-

Technology

DDR3L-1866MHzCPU

Processor System

Memory

Display

Expansion Interface

Ethernet

Audio
WatchDog Timer

Storage

I/O

Power

Max. Capacity
SocketOnboard Memory
Controller
Graphic Memory
VGA
LCD (TTL/LVDS/eDP)
DDI (HDMI/DVI/DisplayPort)
Multiple Display
Mini PCIeSIM Socket
SMBus
I2C BusPC/104
PCI-104
M.2
Controller
Speed
Connector
Audio Interface
CODEC
AmplifierConnector
SATA
mSATA
IDE
CompactFlash
FloppyUSB3.0USB2.0GPIO
LPTCOM Port
PS/2 KB/Mouse
Reset Button
Smart FanPower TypePower Supply Voltage
Connector

8GB
1 x 204-pin SODIMM
Intel Gen9 graphic engine
Share with system memory up to 1792MB
up to 1920x1200
48-bit LVDS up to WUXGA1920 x 1200 at 60Hz
HDMI 1.4a for HD video playback, 1080P at 60Hz
VGA + LVDS * eDP + HDMI
1 x Full size11
1 (Shares with SMBus pin)
1 (Key E)
GbE1: Intel i210 GbE2: Intel i210
10/100/1000Mbps
RJ45 x 2
HD Audio
Realtek ALC888S
Line-in, Line-out, Mic-in
1* SATAIII (Max. Data Transfer Rate up to 6.0 Gb/s)
1 x Full size
2
4
16-bit general purpose input/output
2xRS-232, 2xRS-232/422/485 with RS-485 auto flow control
1
AT/ATX
9 (-5%) - 36 (+10%)V DC power input
2x2P phenix power connector

Power Consumption (Idle)

N4200: 0.4A @ 12V (4.80W)
N3350: 0.4A @ 12V (4.80W

Power Consumption(Full Load)

N4200: 1.26A @ 12V (15.12W)
N3350: 1.29 @ 12V (15.48W)

Battery

Lithium 3 V / 210 mAH

Environment

Operational Temperature(Operational humidity: 40 °C @ 95% RH Non-Condensing)

PhysicalCharacteristics

Dimensions (L x W x H)
Construction
Microsoft WindowsLinux
SUSIAccessiManager
EMC

146 x 102 mm (5.7" x 4")
Yes
Yes
Yes
Yes
CE, FCC

Operating System
Certification

Note: “-” : means Not Applicable (N/A)

33

PCM-9366

Product Selection Guide

PCM-9365
3.5" SBCIntel Celeron N2930/Intel Atom E3825
7.5W/ 6W
1.83/ 1.33 GHz (Burst: 2.16 GHz/ -)4/2
2MB/ 1MBAMI UEFI BIOS at 64 Mbit
DDR3L 1333 MHz for N2930,
DDR3L 1066 MHz for E3825
4 GB
Onboard 2GB/ 4GBIntel Gen7 graphic engine
2560 x 1600 at 60Hz
48-bit dual LVDS up to WUXGA 1920 x 1200 at 60Hz, the 2nd
LVDS is supported by request Supports 3.3/5/12V for VDD
power, 1A@5V/12V for inverter
HDMI 1.4a for HD video playback, 1080P at 60Hz
VGA + LVDS, HDMI*+ LVDS, LVDS + LVDS*
1 x Full-size
1
1 (shared with SMBus pin)
1
Realtek RTL8111E-VL-CG
10/100/1000Mbps
RJ45 x 2
HD Audio
Realtek ALC888S
pin header (Line-in, Line out, Mic-in)Yes
1, up to 3Gb/s (300 MB/s)
1 x Full-size
4
8-bit
3 RS-232 (ESD protection: Air gap ±15kV, Contact ±8kV)
12V ± 10%1 x 4-pin power connector
PCM-9365E-2GS3A1E: 0.39A @ 12V (4.68W)
PCM-9365EV-4GS3A1E: 0.44A @ 12V (5.28W)
PCM-9365N-4GS8A1E: 0.509A @ 12V (6.108W)
PCM-9365E-2GS3A1E: 0.49A @ 12V (5.88W)
PCM-9365EV-4GS3A1E: 0.554A @ 12V (6.648W)
PCM-9365N-4GS8A1E: 0.745A @ 12V (8.94W)
Lithium 3 V / 210 mAH
0 ~ 60 °C (32 ~ 140 °F)(Operational humidity: 40 °C @85% RH non-condensing)
146 x 102 mm (5.7" x 4"), same as 3.5"
Aluminum with fanless design
Yes
Yes
SUSI4
Yes
CE,FCCModel Name

Form Factor

CPU TDPFrequency
Core Number
L2 Cache
BIOS
Technology
Max. Capacity
SocketOnboard Memory
Controller
Graphic Memory

Intel® Atom SoC integrated

VGA
LCD (TTL/LVDS/eDP)
DDI (HDMI/DVI/
DisplayPort)
Multiple Display
Mini PCIeSIM Socket
SMBus
I2 C

48-bit LVDS,
up to 1920 x 1200
HDMI 1.4b: up to
3840 x 2160 at 30Hz
HDMI + LVDS
1 x Full-size
1
1 (shared with SMBus pin)

CPU
Processor
SystemMemory

Display

Expansion
Interface

Ethernet

Audio

MIOe
64-pin connecter A
64-pin connecter B
Controller
Speed
Connector
Audio Interface
CODEC
AmplifierConnector

WatchDog Timer
Storage

I/O

EnvironmentIntel® i210IT/i210AT
10/100/1000 Mbps
RJ45 x 2
High Definition Audio
Realtek ALC888S
Line-in, Line-out, Mic-in
Yes

SATA
mSATA
CompactFlashUSB3.0USB2.01, up to 6Gb/s (600MB/s)
1 x Full-size*
2
2

GPIO

16bit GPIO (5V tolerance)

COM Port
Reset Button
FanPower TypePower Supply
Voltage
Connector

Power

MIO-2361

2.5" MI/O-Ultra (Pico-ITX)Intel® Atom™ E3900 series/
Pentium N4200/
Celeron N3350
12W
2.0 GHz/2.5GHz/2.4GHz
4/4/2
2M
AMI EFI 64 Mbit
LPDDR4-2400MT/s
Onboard LPDDR4®
Intel Gen9 graphic engine

Power
Consumption (Idle)
Power
Consumption(Full Load)
Battery
Operational
Temperature

PhysicalDimensions
Characteristics (L x W x H)
Microsoft Windows
Linux
Operating
SUSIAccess/
System
WISE-PaaS/RMM
iManager
Certification
EMC

2 x RS-232/422/485
1
AT/ATX

PC/104 CPU Modules

MIO-23602.5" MI/O-Ultra (Pico-ITX)

Model Name

Form Factor

Intel® Pentium N4200/
Intel® Celeron N3350
6W
2.5GHz/2.4GHz
4/2
2M
AMI EFI 64 Mbit
DDR3L-1866MHz
8GB
1 x 204-pin SODIMM
Intel® Gen9 graphic engine
Shared with system memory
up to 1792MB
up to 1920x1200 at 60Hz
24-bitup to 1440 x 900 at 60Hz
HDMI
1.4b(3840x2160@30Hz)
VGA+LVDS, HDMI+LVDS
1 x Half size
1
1 (Shares with SMBus pin)
SMBus, 2 x USB3.0, LPC,
2 x PCIe x1, line out,
DisplayPort/HDMI*,+5 Vsb/+12 Vsb power,
Power On, Reset, SATA*
Intel i210
10/100/1000Mbps
RJ45 x 1
High Definition Audio
Realtek ALC888S
Line-in, Line-out
255 levels timer interval,
programmable by software
1, up to 6Gb/s (600 MB/s)
1
2
6

Processor
System

2 x RS-232/422/485
1
Single 12V DC power input
single 12V input, ±10%

ATX 1x2p, DC Jack
(optional)
E3950: 8.59 W (12V)
E3950: 8.81 W (24V)

ATX 1x2p, DC Jack
(optional)
N4200: 4.89 W (12V)
N3350: 4.61 W (12V)

E3950: 26.27 W (12V)
E3950: 26.51 W (24V)

N4200: 12.90 W (12V)
N3350: 17.18 W (12V)

Lithium 3V/ 210mAH

Lithium 3 V / 210 mAH
0 ~ 60 °C (32 ~ 140 °F)(Operational humidity:
40 °C @ 95% RH
Non-Condensing)

100 x 72 mm (3.9" x 2.8")

100 x 72 mm (3.9" x 2.8")

Yes
Yes

Yes
Yes

Yes

Yes

Yes
CE, FCCCE, FCCCPU
Frequency
Core Number
L2 CacheL3 Cache
BIOS
ChipsetTechnology

MemoryMax. Capacity
SocketOnboard Memory
Controller
Graphics Engine

Display

Graphics Memory
HDMI/DVI
Multiple Displays
Mini PCIe

Expansion
Interface

Ethernet

Audio

SMBus
I2C BusPC/104
PCI-104
PC/104-Plus
Controller
Speed
Connector
CodecsWatchDog Timer
SATA
mSATA
Storage

8-bit general purpose input/
output12V or 24V +/- 10%

0 ~ 60 °C (32 ~ 140 °F),
Extend: -40 ~ 85 °C(-40 ~ 185 °F)

Product Selection Guide

MI/O Extension 2.5" Pico-ITX

I/O

IDE
CompactFlash
Onboard Flash
FloppyUSB2.0SPI BusGPIOLPTCOM Port
PS/2 KB/Mouse
Power TypePower Supply
Voltage

Power

Power
Consumption (Idle)
Power
Consumption(Full Load)
Battery

Environment

Operational
Temperature

Non-Operational
Temperature
Dimensions
Physical(L x W x H)
Characteristics
WeightMicrosoft Windows
OperatingLinux
SystemSUSIAccessCertifications
EMC

PCM-3365

PC/104-PlusIntel Atom E3825/E3845/N2930
1.33GHz/ 1.91GHz/ 1.83GHz
2/4/4
1MB/2MB/2MB
AMI UEFI BIOS at 64 Mb
1 x 204-pin SODIMM
DDR3L 1066MHz/ 1333MHz/
1333MHz8GB
1 x 204-pin SODIMM
Intel Gen7 graphic engine
DirectX11, OpenGL3.2, OpenCL1.1
Full HW acceleration, decode: H.264,
MPEG2/4, VC-1, WMV9. Encode:
H.264, MPEG2
Optimized shared memoryarchitecture up to 384 MB systemmemoryHDMI1.4a for HD video playback,1080P at 60Hz, up to 1920 x 1080,
DVI1.0 (DVI-D),
up to 1920 x 1080
VGA + LVDS, VGA + HDMI/DVI,HDMI/DVI + LVDS
1 x Full-size
1 (configurable to I2C by customer's
request)1 (supported by request)
1Intel I210
10/100/1000 Mbps
Pin Header
Intel High Definition audio interface(requires an audio extension module
P/N:
PCE-SA01-00A1E
Output System Reset, Programmablecounterfrom 1 ~ 255 sec
1 SATA II
1 x Full-size (default, SATA signal
shared with Onboard flash)
16GB/32GB/64GB (by request)
6
8-bit GPIO
3 (1 x RS-232/422/485, 2 RS-232)
1
AT/ATX
5 V ± 5% only to boot up(12 V is optional for LCD inverter andadd on card)
E3825: 4.474W
E3845: 4.72W
N2930: 4.417W
E3825: 5.675W
E3845: 7.686W
N2930: 6.843W
Lithium 3 V / 210 mAH
0 ~ 60 °C (32 ~ 140 °F) (Operational
humidity:
40 °C @ 85% RH non-condensing)-40 °C ~ 85 °C and 60 °C @ 95% RH
non-condensing
96 x 90 mm (3.8" x 3.5")
0.735kg (1.62lb) (with heat-sink)
Yes
Yes
Yes
CE, FCC

Product Selection Guide

34

Product Selection Guide

Industrial Motherboards
UTX

Model Name
Form Factor
CPU
SocketMax. Speed
Processor System

Expansion Slot

TDP

BGA1528

FCBGA

FCBGA

2.2/1.7/1.6 GHz

QC 1.6 GHz

QC 1.6/ DC 1.3 GHz
2M

L3 Cache---

Chipset

-

-

-

BIOS

AMI EFI 32MB, SPIAMI EFI 128 Mbit SPIAMI EFI 128 Mbit SPI
1 (E-Key)

M.2

3 ( M-key, E-key, B-Key)

1 (E-Key)

PCI

-

-

-

Mini PCIe-

1 (F/S)

1 (F/S)

PCIe

-

-

-

DDR4 2400MHz SDRAM

Single channel DDR3L
1866/ 1600/ 1333 Mhz SDRAM

Single channel DDR3L
1866/ 1600/ 1333 Mhz SDRAM

Max. Capacity

16 GB per DIMM

8GB

8GB

1 x 260-pin SODIMM

1 X 204-pin SODIMM

1 X 204-pin SODIMM

Intel HD Graphics

Intel HD Graphics

Intel HD Graphics

LCD

Dual channel 24-bit LVDS / eDP(BOM Option)

Dual channel 48-bit LVDS
(colay with eDP)

Dual channel 48-bit LVDS
(colay with eDP)

HDMI

2

1

1

DVI

-

-

-

Interface

10/100/1000 Mbps

10/100/1000 Mbps

10/100/1000 Mbps

Controller

LAN1: Intel i219LM
LAN2: Intel i211AT

LAN1: Intel i211AT
LAN2: Intel i211AT
LAN3: Realtek RTL8111G

LAN1: Realtek RTL8111G
LAN2: Realtek RTL8111G

Connector

RJ45 x 2

RJ-45 x3

RJ-45 x2

Optional

Optional

Optional

600 MB/s

600 MB/s

600 MB/s

Channel111

eSATA/mSATA--/--/-/-/1/1-/-/2/-(type C Alt.)-/-/1/1

Ethernet

2

3

2

USB

2

4 x USB3.0

4 x USB3.0

Audio

1

Line outLine out

Serial

-

-

-

PS/2

-

-

-

DC Jack

1

1

1
1

LVDS & Inverter

1, optional

1

DVI

-

-

-

USB

2

2 (USB2.0)

2 (1 x RS-232; 1 x RS-422 or 485)

Serial44 (2 x RS-232, 2 x RS-232 or 422 or 485)

Parallel

-

-

-

SATA

1

1

1

CompactFlash/ eMMC--/1 (128GB), optional-/1 (128GB), optional

GPIO

16 bit GPIO

16-bit GPIO

8-bit GPIOCANBus-1 (Isolated CANBus)

1

MDB

-

-

1 (colay with RS-232)

ccTALK--

1 (colay with RS-422/ 485)

Note: “-” : means Not Applicable (N/A)

35Intel E3950/ E3930

12W/ 6.5W

VGA/DVI/HDMI/DPInternal Connector

Intel E3950/ E3940

2M

Max Data Transfer Rate

Rear I/O

UTXIntel® 8th Gen Core i7/i5/i3

12W/ 9.5W

TPM
SATA

AIMB-U117-

Controller

Ethernet

UTX-E

15 W

SocketGraphics

AIMB-U217

UTX-E

L2 CacheTechnology
MemoryAIMB-U233

Product Selection Guide

Product Selection Guide

Mini-ITX

Form Factor

Model NameCPU
SocketMax. Speed

Processor System

TDP
L2 CacheL3 CacheExpansion Slot

ChipsetBIOS
M.2
Mini PCIe
PCIe
Technology

MemoryMax. Capacity
SocketController

Graphics

Ethernet

TPM
SATA

LCD
HDMI
DVI
Type C Alt.
Interface--AMI EFI 128Mbit, SPI
2 (B key + E key)-

PCIe x 16, 1 slot

PCIe x 4, 1 slot

PCIe x1, 1 slot

PCIe x1, 1 slot

Dual Chaneel DDR4
2666 MHz SDRAM

Dual Chaneel DDR4
2666 MHz SDRAM

Dual channel DDR4
2400MHz SDRAM

Dual channel DDR4
3200MHz SDRAM

64 GB/ up to 32 GB per
DIMM
2 x 260-pin SODIMM
Intel® UHD Graphics
Dual channel 48-bit
LVDS
1 (HDMI2.0a)10/100/1000 Mbps

64 GB/ up to 32 GB per
DIMM
2 x 260-pin SODIMM
Intel HD Graphics
Dual channel 48-bit
LVDS
1
10/100/1000 Mbps
LAN1: Realtek 8111G
LAN2: Realtek 8111G(only for F/G2 SKU)
LAN3: Intel i211AT (onlyfor F SKU)
RJ-45 x 3
(AIMB-286F: 3; AIMB286G2: 2; AIMB-286L: 1)
Optional
600 MB/s
3-/-

32 GB/ up to 16 GB per
DIMM
2 x 260-pin SODIMM
Intel HD Graphics
Dual channel 48-bit
LVDS
1 (HDMI 2.0a)110/100/1000 Mbps

64 GB/ up to 32 GB per
DIMM
2 x 260-pin SODIMM
Intel HD Graphics
Dual channel 48-bit
LVDS
1
10/100/1000 Mbps

AMI EFI 128Mbit, SPI
2 (B key + E key)
PCIe x 8, 1 slot
(Only PCIex4 signal for
R1000)
Dual channel DDR4
2400/2666/3200 MHz
SDRAM
32 GB/ up to 16 GB per
DIMM
2 x 260-pin SODIMM
CPU Integrated Vega
Dual channel 48-bit
LVDS
10/100/1000 Mbps

LAN1: Intel i219LM
LAN2: Intel i211AT

LAN1: Realtek 8111H
LAN2: Realtek 8111H

LAN1: Realtek 8111G
LAN2: Realtek 8111G

RJ45 x 2

RJ45 x 2

RJ45 x 2

Optional
600 MB/s
1-

Optional
600 MB/s
1--/-/1/2-/-/1/1-/-/1/1(type C Alt.)-/-/1/1

2

F SKU: 3
G2 SKU: 2
L SKU: 1

Optional
600MB/s2-/-/-/V1000: 4-/-/-/R1000: 3

2

2

2

4 (USB3.0)

3 USB 3.1 + 1 USB 3.1
Type C (optional)

2 USB 3.1 + 2 USB 2.0

2 USB 3.1 + 2 USB 2.0

Mic-in, Line-out
1

Mic-in, Line-out-

Line-out-

Mic-in, Line-out-

Optional
600 MB/s
3-/-

DC Jack
LVDS & Inverter
DVI
USB

Internal Connector-

Max Data Transfer Rate
ChanneleSATA/mSATA

Serial

5 USB3.1 + 1 USB 3.1
type C (optional) +2 USB3.0
Mic-in, Line-out, Line-in
1(4-pin phoenix connector)
12 (USB 3.0)

2 (1 x RS-232;
1 x RS-232/422/485)

Parallel

-

SATA

3

eMMC/UFS
GPIO-/8-bit GPIO

THIN Mini-ITX
Intel Pentium/Celeron/
Atom
FCBGA

AIMB-228

AMI EFI 32Mbit, SPI
2 (M key + E key)
1 (F/S)

RJ-45 x 2

Audio
SerialPS/2

AIMB-218

THIN Mini-ITX
Intel® 8th Gen Core i7/i5/
i3/Celeron
BGA1528

Connector

USB

AIMB-233

THIN Mini-ITX
Intel 9th/8th Core i7/ i5 /
i3 / Pentium/Celeron
LGA1151
3.7/3.6/3.2/3.1/3.0/2.9/
2.4/2.1GHz
65W/54W/35W
12MB/9 MB/6 MB/4
MB/2 MBIntel H310
AMI EFI 128 Mbits, SPI
2 (B key + E key)0

LAN1: Intel i219LM
LAN2: Intel i211AT

Ethernet

AIMB-286

Mini-ITXIntel 9th/8th Core i7/ i5 /
i3 / Pentium/Celeron
LGA1151
3.7/3.6/3.2/3.1/3.0/2.9/
2.4/2.1GHz
65W/54W/35W
12MB/9 MB/6 MB/
4 MB/2 MBIntel Q370
AMI EFI 256 Mbits, SPI
2 (B key + E key)
0

Controller

VGA/DVI/HDMI/DP

Rear I/O

AIMB-276

2.2/1.7/1.6/2.0 GHz

2.0 GHz

15W/15W/15W/15W-

12 W/6 W-

THIN Mini-ITX
AMD Ryzen Embedded
V/R-Series
FP5
QC 3.35GHz/ QC
2.00GHz/ DC 2.30GHz
45W/ 15W/ 15W
2M/2M/1M

1

1

1

1

1
-

1, optional
2 x USB 3.0 +2 x USB 2.0

1, optional-

1(optional)-

1 USB 3.0 + 3 USB 2.0

2 USB 2.0

6 (5 x RS-232,
1 x RS-232/422/485)

6 (4 x RS-232,
2 x RS-232/422/485)

4 USB2.0(only for F/G2 SKU)F SKU: 6 (4 x RS-232,
2 x RS-232/422/485,
RS-422/485 support by
BOM optional)
G2/L SKU: 2 (1 x RS232, 1 x RS-232/422/485,
RS-422/485 support by
BOM optional)
F/G2 SKU: 3
L SKU: 2-/16-bit GPIO

6 (5 x RS-232,
1 x RS-232/422/485)

-

-

-

2

1

2

-/8 bit GPIO-/1 (256GB), optional
8 bit GPIO-/16-bit GPIO

Product Selection Guide

36

Product Selection Guide

Industrial Motherboards
Micro-ATX

Model Name
Form Factor
CPU
SocketMax. Speed
Processor System

TDP

Ethernet

80W/71W/65W/35W

65W /58W/35W-

ChipsetIntel Q370/C246/H310

Intel H310

BIOS

AMI EFI 256 Mbits, SPIAMI EFI 128 Mbits, SPI-

2 (L Sku: 0)

PCIe x16

1 (QG2/L: x16 link, WG2: x8 link)

1

PCIe x8

1 (WG2 only)-

PCIe x4

1-

PCIe x1

1 (QG2/WG2 only)1-/ 2 (M & E key, QG2/WG2 only)-/ 1 (B-Key, L Sku:0)

Technology

Dual Channel DDR4 2400/2666 MHz SDRAM

Dual Channel DDR4 2400/2666 MHz SDRAM

Max. Capacity

128 GB/ up to 32 GB per DIMM

64 GB/ up to 32 GB per DIMM

Socket4 x 288-pin DIMM

2 x 288-pin DIMM

Controller

Intel HD Graphics

Intel HD Graphics

Shared system memory up to 1 GB

Shared system memory up to 1 GB

VGA

-

1

LCD

Dual channel 48-bit LVDS(option)

Dual Channel 48-bit LVDS (Optional)

DVI-D

-

1

HDMI

1 (option to HDMI2.0a)-

DP/eDP2 / 1 (L: eDP is option)

1/1 ( G2/ L sku without eDP)

Dual Display

DP++ + HDMI, DP++ + DP++, DP++ + eDP/LVDS,HDMI + eDP/LVDS

DP+ DVI-D, DP+VGA, DVI-D+VGA, DP+eDP(LVDS),
DVI-D+eDP(LVDS), VGA+eDP(LVDS)

Triple Display

DP++ + DP++ + HDMI, DP++ + DP++ + eDP/LVDS,DP++ + HDMI + eDP/LVDS-

Interface

10/100/1000 Mbps

10/100/1000 Mbps

Controller

LAN1: Intel I219LM (QG2/WG2/L)
LAN2: Intel I211AT (QG2)
I210AT (WG2)
LAN3/4: Realtek 8111G (Option)

LAN1: Realtek RLT8111G
LAN2: Realtek RLT8111G

Connector

RJ-45 x 4 (2 option)

RJ-45 x2

ChannelmSATA/ M.2

Optional

Optional

600 MB/s

600 MB/s

6 -QG2 sku; 8 - WG2 sku (SW RAID)

3- / 1 (M key)

-

VGA

-

1

USB

4 USB3.1 (L:4 USB3.0 + 8 USB2.0, 2 option)

F sku: 20 (8 USB3.0 + 12 USB2.0)
G2 sku: 12 (4 USB3.0 + 8 USB2.0)
L sku: 8 (4 USB3.0 + 4 USB2.0)

Serial6 (QG2/WG2: 5x RS-232, 1x RS-232/422/485)
2 (L: 1x RS-232, 1x RS-232/422/485)

F sku: 14 (12 x RS-232; 2 x RS-232/422/485)
G2 sku: 10 (8 x RS-232; 2 x RS-232/422/485)
L sku: 2 (2 x RS-232)

Parallel--

SIM Card Holder-

1 (L Sku:0)

PS/2

1(onboard)

1

Ethernet (GbE)

4 (2 option)

2

IEEE 1394

-

-

Audio

Mic-in, Line-out

Mic-in, Line-out

GPIO

16-bit16-bitNote: “-” : means Not Applicable (N/A)

37

LGA1151
3.7/3.6/3.2/3.0/2.9 GHz

12 MB/ 9MB /6MB /2MBMax Data Transfer

I/O Interface

LGA1151
3.7/3.6/3.4/3.2/3.1/ 3.0/2.9/2.4/2.1 GHz

12MB/9 MB/8 MB/6 MB/4 MB/2 MB

TPM
SATA

Intel 9th & 8th Gen Core i7/i5/i3/Pentium/ CeleronL3 cache

VRAM

Graphics

Micro-ATXIntel 9th & 8th Xeon/Core i7/i5/i3 / Pentium/Celeron-mini-PCIe / M.2
MemoryAIMB-506

Micro-ATX

L2 cache

PCI

Expansion Slot

AIMB-586

Product Selection Guide

Product Selection Guide

Arm-Based Computing Platforms
Computer-on-Modules

Model Name
Form Factor
Processor System

MemoryCPU

DDR3L 1066 MT/s

LPDDR4 1866 MT/s

Capacity

On-board LPDDR4 4 GB

On-board DDR3L 2 GB

On-board LPDDR4 2 GB

Flash

16 GB eMMC NAND Flash for O.S.and
32MB QSPI NOR FLASH for Advantech
boot loader

8 GB eMMC NAND Flash for O.S. and4 MB SPI NOR Flash for Advantech bootloader

16 GB eMMC NAND Flash for
O.S. and 8MB QSPI NOR FLASHfor board information

LVDS

2 x 24-bit LVDS, 1366 x 768 for 1ch;
1920 x 1080 for 2ch at 60Hz

1 x 24-bit dual channel LVDS,
1920 x 1200

-

-

-

1 x 4-Lane MIPI DSI

4096 x 2160 at 60Hz

1920 x 1080 at 60Hz

4096 x 2160 at 60Hz

Parallel RGB

-

-

-

VGA

-

-

-

Graphics Engine

Vivante GC7000XS/VX

2D-Graphics Accelerator (BB2D)
Subsystem and Dual-Core PowerVR®
SGX544™ 3D GPU

GC7000L/GC7000LVX

H/W Video Codec

Decoder: HEVC/H.265(4Kp60),
VP9(4Kp60), H.264(4Kp30), MPEG-2,
MPEG-4p2, VC-1, VP8, RV9, AVS, MJPEG,
H.263

Video Processing Engine (VPE)

Decoder: HEVC/H.265(4Kp60),
VP9(4Kp60), H.264(4Kp30), MPEG-2,
MPEG-4p2, VC-1, VP8, RV9, AVS, MJPEG,
H.263

ChipsetNXP i.MX8 Integrated RGMIITI Sitara Integrated RGMII

1 x NXP i.MX8M Integrated RGMII
1 x RTL8119I PCIE GbE controller

Speed

1 x 10/100/1000 Mbps

1 x 10/100/1000 Mbps

2 x 10/100/1000 Mbps

Yes

Yes

Yes

1~6553s, default 60s, power on/off 1s

1~6553s, default 60s, power on/off 1s

1~6553s, default 60s, power on/off 1s

PCIe

2 PCIe 1x

2 PCIe 1x

1 PCIe 1x

SATA

1 SATA III

1 SATA II-

USB

3 USB 3.0,
1 USB 2.0 OTG

1 USB 3.0, 1 USB 2.0 OTG,
4 USB 2.0 Host

2 USB 3.0, 4 USB 2.0,
1 USB 2.0 OTG

Audio

I2S

I2S

2 x I2S

SPDIF

-

-

-

SDIO

1

1

1

WatchDog Timer

Serial Port

2 UART (2 x 4-wire)

2 UART (2 x 4-wire)

4 UART (1 x 4-wire, 3 x 2-wire)

SPI

1

1

1

CAN

1 x CAN bus 2.0 A/B

1 x CAN bus 2.0 A/B

-

GPIO

8

8

12

I2C

Power

Environment
Mechanical

NXP Arm Cortex-A53 i.MX8M 1.5 GHz

TI Sitara Cortex-A15 AM5728 1.5 GHz

LPDDR4 1200 MT/s

RTC

I/O

ROM-5720
SMARC V2.0

NXP Arm Cortex-A72 i.MX8 1.6 GHz

MIPI-DSI

Ethernet

ROM-7510
Qseven V2.0

Technology

HDMI

Graphics

ROM-7720
Qseven V2.1

2

2

4

Camera Input

1 x 4-Lane MIPI CSI-2
1 x 2-Lane MIPI CSI-2-

1 x 4-Lane MIPI CSI-2
1 x 2-Lane MIPI CSI-2

System Bus

-

-

-

Touch

-

-

-

Keypad

-

-

-

PWM

-

2

-

Power Supply Voltage

5V

5V

Fixed 5V DC source and allow
3.3 V ~ 5.25 V operates directly from single
level Lithium-ion cells

Power Consumption

TBD

10W (Max)

5.3W (Max)Operating Temperature

0 ~ 60 ℃ / -40 ~ 85 ℃

0 ~ 60 ℃ / -40 ~ 85 ℃

0 ~ 60 ℃ / -40 ~ 85 ℃

Operating Humidity

5% ~ 95% Relative Humidity,
non-condensing

5%~95% Relative Humidity,
non-condensing

5% ~ 95% Relative Humidity,
non-condensing

Dimensions (W x D)

70 x 70 mm

70 x 70 mm

82 x 50 mm

Linux
Android

Linux

Linux
Android

CE/FCC Class B

CE/FCC Class B

CE/FCC Class B

Operating System
Certifications
Note: “-” : means Not Applicable (N/A)

Product Selection Guide

38

Product Selection Guide

Arm-Based Computing Platforms
Computer-on-Modules

Model Name
Form Factor
Processor System

MemoryCPU

Ethernet

Mechanical

NXP Arm Cortex-A9 i.MX6 1 GHz

LPDDR4 1200 MT/s

DDR3 1066 MT/s

On-board LPDDR4 2 GB

On-board DDR3 1 GB / 2 GB

Flash

8 GB eMMC NAND Flash for O.S. and
8MB QSPI NOR FLASH for Advantech
boot loader

16 GB eMMC NAND Flash for O.S.
and 8MB QSPI NOR FLASH for board
information

4 GB eMMC NAND Flash for O.S. and4 MB SPI NOR Flash for Advantech bootloaderLVDS

1 x 24-bit dual channel LVDS*

2 x 24-bit single channel LVDS*

1 x 24-bit LVDS,
1366 x 768 at 60Hz

1 x 4-Lane MIPI-DSI*

2 x 4-Lane MIPI DSI*

-

HDMI

-

-

1920 x 1080 at 60Hz

Parallel RGB--

1 x 24-bit TTL,
1920 x 1200 at 60Hz

-

VGA

-

-

Graphics Engine

Vivante GC320, GC NanoUltra 3D GPU
Support OpenGL ES 2.0, VG 1.1

Vivante GC7000 Lite

2 x IPUs. OpenGL ES 2.0 for 3D, BitBlt for2D and OpenVG 1.1

H/W Video Codec

Decoder: H.265, H.264, VP8/9 1080p
Encoder: H.264, VP8 1080p

Decoder: HEVC/H.265(4Kp60),
VP9(4Kp60), H.264(4Kp30), MPEG-2,
MPEG-4p2, VC-1, VP8, RV9, AVS, MJPEG,
H.263

Decoder: MPEG-4 ASP, H.264 HP, H.263,
MPEG-2 MP, MJPEG BP
Encoder: MPEG-4 SP, H.264 BP, H.263,
MJPEG BP

ChipsetNXP i.MX8M Mini Integrated RGMII

2 x NXP i.MX8X Integrated RGMII

NXP i.MX6 Integrated RGMII

Speed

1 x 10/100/1000 Mbps

2 x 10/100/1000 Mbps

1 x 10/100/1000 Mbps

Yes

Yes

Yes

1~6553s, default 60s, power on/off 1s

1~6553s, default 60s, power on/off 1s

256-level timer interval, from 0 ~ 128 sec

PCIe

1 PCIe 1x

1 PCIe 1x

1 PCIe 1x

SATA

-

-

1 SATA II

USB

4 USB 2.0,
1 USB 2.0 OTG

1 USB 3.0,
2 USB 2.0 OTG

1 USB 2.0,
1 USB 2.0 OTG

Audio

2 x I2S

2 x I2S

I2S

SPDIF

-

-

-

SDIO

1

1

1
3 UART (3 x 4-wire)

4 UART (2 x 2-wire, 2 x 4-wire)

3 UART (1 x 4-wire, 2 x 2-wire)

SPI

2

2

2

CAN

-

2 x CAN bus 2.0 A/B

2 x CAN bus 2.0 A/B

GPIO

12

12

10

I2C

4

4

4

Camera Input

1 x 4-Lane MIPI CSI-2

1 x 4-Lane MIPI CSI-2

1 x 4-Lane MIPI CSI-2

System Bus--

Address: 26 bits
Data: 16 bits

Touch

-

-

-

Keypad

-

-

-

PWM

-

-

-

Fixed 5V DC source and allow
3.3 V ~ 5.25 V operates directly from single
level Lithium-ion cells

Fixed 5V DC source and allow
3.3 V ~ 5.25 V operates directly from single
level Lithium-ion cells

5 ~ 24 V

Power Supply Voltage
Power Consumption

TBD

4.45W (Max)3.3W (Max)Operating Temperature

0 ~ 60 °C / -40 ~ 85 °C

0 ~ 60 °C / -40 ~ 85 °C

0 ~ 60 °C / -40 ~ 85 °C

Operating Humidity

5% ~ 95% Relative Humidity,
non-condensing

5% ~ 95% Relative Humidity,
non-condensing

5%~95% Relative Humidity,
non-condensing

Dimensions (W x D)

82 x 50 mm

82 x 50 mm

68 x 68 mm

Linux
AndroidLinux
AndroidLinux
Android

CE/FCC Class B

CE/FCC Class B

CE/FCC Class B

Operating System
Certifications
Note: “-” : means Not Applicable (N/A)*LVDS & MIPI-DSI are shared interface

39

NXP Arm Cortex-A35 i.MX8X 1.2 GHzLPDDR4 1866 MT/s

Serial Port

Environment

RTX V2.0

NXP Arm Cortex-A53 i.MX8M Mini 1.8 GHz
On-board LPDDR4 2 GB

WatchDog Timer

Power

ROM-3420

Technology

RTC

I/O

ROM-5620
SMARC V2.0

Capacity

MIPI-DSI

Graphics

ROM-5721
SMARC V2.0

Product Selection Guide

Product Selection Guide

Single Board Computers

Model Name

RSB-3430

RSB-4411CPUNXP Arm Cortex-A9 i.MX6 1 GHz

NXP Arm Cortex-A9 i.MX6 1 GHz

Technology
Capacity

DDR3 1066 MT/s
On-board DDR3 1 GB
4 GB eMMC NAND Flash for O.S.
and 4 MB SPI NOR Flash for
Advantech boot loader

1920 x 1080 at 60Hz
2 IPUs. OpenGL ES 2.0 for 3D,
BitBlt for 2D and OpenVG 1.1

DDR3 1066 MT/s
On-board DDR3 1 GB
4 GB eMMC NAND Flash for O.S.
and 4 MB SPI NOR Flash for
Advantech boot loader
1 x 18/24-bit LVDS,
1366 x 768 for 1ch;
1920 x 1080 for 2ch at 60Hz
1920 x 1080 at 60Hz
1920 x 1080 at 60Hz
2 IPUs. OpenGL ES 2.0 for 3D,
BitBlt for 2D and OpenVG 1.1

Decoder: MPEG-4 ASP, H.264 HP,
H.263, MPEG-2 MP, MJPEG BP
Encoder: MPEG-4 SP, H.264 BP,
H.263, MJPEG BP

Decoder: MPEG-4 ASP, H.264 HP,
H.263, MPEG-2 MP, MJPEG BP
Encoder: MPEG-4 SP, H.264 BP,
H.263, MJPEG BP

NXP i.MX6 Integrated RGMII
1 x 10/100/1000 Mbps
1~6553s, default 60s,
power on/off 1s-

1
NXP i.MX6 Integrated RGMII
1 x 10/100/1000 Mbps
1~6553s, default 60s,
power on/off 1s
1
1

2 x USB 2.0 Type A,
4 x USB 2.0 in UIO 20/40

1 x USB 2.0 OTG, 2 x USB Type A,
3 x USB pin header

1 x Line-out, 1 x Line-in via pinheader
-1 x Line-out,
1 x Mic-in via pin header
1 x SD slot

3 x 2-wire RS-232 in UIO 20/40
1 x 4-wire RSB-232/422/485, DB9

2 x 2-wire RS-232 pin header
1 x 4-wire RS-232/422/485

Form Factor
Processor
SystemMemoryFlash
LVDS

Graphics

HDMI
VGA
eDP
Graphics Engine

H/W Video Codec

Video in
Ethernet

MIPI CSI
Chipset
Speed

WatchDog Timer
SATA
SATA Power
USB
Audio
SPDIF
SDIO

I/O

Serial Port
SPI
CAN
GPIO
I2C
System Bus
Touch
KeypadButtonIndicator

LED

Expansion

M.2
SD Socket
SIM
Power Supply
VoltagePower TypePower
Consumption
OperatingTemperature
Operating
Humidity
Dimensions(W x D x H)

Mini PCIePower

Environment
Mechanical

Operating System
Certifications

2.5" SBC

2 x 18/24-bit LVDS, 1366 x 768 for
1ch; 1920 x 1080 for 2ch at 60Hz

1 CAN 2.0B in UIO 20/40(share w/ UART)
12 GPIO, 4 GPIO in UIO 20/40 and
8 GPIO in UIO 20/40, 3.3V level
1 in UIO 20/40-

3.5" SBC

RSB-4680

RSB-4710

3.5" SBC
Rockchip Arm Cortex-A17 RK3288
1.6 GHz
DDR3L 1333 MT/s
On-board DDR3L 2 GB

3.5" SBC
Rockchip Cortex-A72 RK3399
1.8 GHzLPDDR4On-board 2 / 4GB

8 GB eMMC NAND Flash for O.S.
and Advantech boot loader

8 / 16 GB eMMC NAND Flashfor O.S.

1 x 18/24/30-bit LVDS,
1366 x 768 for 1ch;
1 x dual channel LVDS
1920 x 1080 for 2ch at 60Hz
3840 x 2160 at 60Hz
2 (4Kp60 + 1080P)
1920 x 1200 at 60Hz
1OpenGL,ES1.1/2.0/3.0,
OpenGL ES 1.1/2.0/3.1, OpenCL
OpenCL1.1,DirectX11
1.1, DirectX 11
Decoder: MPEG-1, MPEG-2,
Decoder: MPEG-1, MPEG-2,
MPEG-4, H.263, H.264, AVS,
MPEG-4, H.263, H.264, AVS,
VC-1, VP8, MVC, HEVC/H.265
VC-1, VP8, MVC, HEVC/H.265
decoder, 4kp60
decoder, 4k@60FPS
Encoder: H.264 (BP@level4.0, MP, Encoder: H.264 (BP@level4.0, MP,
HP@level4.0), MVC and VP8
HP@level4.0), MVC and VP8
1
TI DP83867
RTL8211FSI
1 x 10/100/1000 Mbps
2 x 10/100/1000 Mbps
0~22s, default 22s

0~22s, default 22s
1 x USB 3.0 +1 x USB 2.0 TypeA,
3 x USB 2.0 pin header
1 x USB 2.0 OTG
1 x Line-out/Mic-in/Line-in/Speakerby pin header-

1

1 x USB 2.0 OTG,
2 x USB 2.0 Type A,
3 x USB 2.0 pin header
1 x Line-out,
1 x Mic-in via pin header
1 x Micro SD slot
1 x 4-wire RS-232/485, DB9
1 x 2-wire RS-232/Debug port,
pin header selected by jumper
4 x 4-wire RS-232, pin header
1

2

-

-

20 GPIO w/o Isolation
via pin header
2-

8 GPIO via pin header(3.3V TTL level)1
1 Reset Button
1 Power Button by pin header

1--

4 x RS-232
2 x 4-wire RS-232/485
1

6

1 Reset Button

1 Power LED
1 Programmable LED
1 x mini PCIe slot
(USB signal only)
1 x M.2 2230 Key E slot
1 x Micro SD slot
1 x SIM slot

1 x mini PCIe slot

1 x mini PCIe slot

1 x mini PCIe slot

1 x M.2 2230 Key E slot
1 x SD slot
1 x SIM slot

1 x M.2 2230 Key E slot
1 x Micro SD Slot
1 x SIM slot

1 x M.2 2230 Key E slot
1 x Mirco SD slot
1 x nano SIM slot

1 Power LED

1 Power LED

1 Power LED

12 V

12~24V

12V

12 V

DC-in

DC-in

DC-in

DC-in

TBD

5.6W (Max)11.6W (Max)TBD

0 ~ 60 °C / -40 ~ 85 °C

0 ~ 60 °C / -40 ~ 85 °C

0 ~ 60°C / -20 ~ 85°C

0 ~ 60 ℃ / -20 ~ 85 ℃

5 ~ 95% Relative Humidity,
non-condensing

5 ~ 95% Relative Humidity,
non-condensing

5 ~ 95% Relative Humidity,
non-condensing

5 ~ 95% Relative Humidity,
non-condensing

100 x 72 x 20 mm

146 x 102 x 20 mm

146 x 102 x 20 mm

146 x 102 x 20 mm

Linux
Android
CE/FCC Class B

Linux
Android
CE/FCC Class B

Android
DebianCE/FCC Class B

Android
DebianCE/FCC Class B

Product Selection Guide

40

Product Selection Guide

Embedded PCs
EPC-S & EPC-C Series

Barebone system

Model Name

Processor System

Description

Compatible Motherboard

Thermal Solution

AMI UEFI 64Mb SPIAMI UEFI 256Mb SPIMax. Capacity

Default 2GB adopted, up to 8GB

DDR3L-1866
8GB

DDR4-2400

2.5" HDD Bay

Room for 1 x 2.5" SSD, max. 9.5mm
heightM.2 Slot

Connector
Codec

Mini-PCIe

M-Key 2280 (PCIe Gen.3 x4, SATA III)

10/100/1000 Mbps

10/100/1000 Mbps

Half size SATAIIIIntel i210
RJ45

Realtek ALC888

Full size PCIe Gen2-

SIM slot

1

-

DP++

-

-

-

32GB

Intel® UHD Graphics 620

-

1

-

-

LAN1: Intel i219; LAN2: Intel i210
LAN3: Intel i210; LAN4: Intel i210
RJ-45 x 4

Realtek ALC888

Full size PCIe Gen3

1 x E-Key 2230 (PCIe x1, USB2.0)
1 x B-Key 3042 (PCIe x1, USB2.0)
1 x Nano SIM--

HDMI 1.4: up to 4096 x 2160 at 30Hz
DP 1.2: up to 4096x2306@60Hz(Note: not support Audio & Hot-plug)

HDMI 1.4b up to 2560 x 1600

Opt. HDMI 1.4b up to 3840 x 2160

VGA

1

1

COM

-

1 (RS-232/422/485)

2 (RS-232/422/485)

4 (USB2.0 x 2, USB3.0 x 2)

2 x USB3.0

8 (USB3.0 x4, USB2.0 x4)

up to 2-

DVI

Audio JackDP++

DP/HDMI
VGA
DVI

-

2

-

1

-

Line-in/Line-out--

up to 1
-

-

-

-

-

-

-

-

4

MIC/Line-out
-

-

-

-

COM

4 (2 x RS-232, 2 x RS-232/422/485)

1 (RS-232/422/485)

2 (RS-232/422/485)

USB

2 (USB2.0)

-

-

LAN

Audio JackGPIO

CANBuss

Antenna (optional)

LED Indicators

SwitchCircular Cutouts
Power Voltage

Power Input Type (Inlet)
Consumption

Operating Temperature

Non-operating Temperature
Humidity
Vibration (5 ~ 500Hz)
Shock

Certification-

Line-in, Line-out, Mic-in

Dimensions (W x H x D)
WeightProduct Selection Guide

-

-

-

-

8-bit

8-bit

8-bit

up to 1-

up to 4-2 (Power LED, HDD LED)-

1 (Power LED)

2

1 (Power LED)

1 (Power Switch)

1 (Power Switch)

1 (Power Switch)

Desk mount, VESA mount, DIN rail

Desk mount, Wall mount, DIN rail

Wall mount, DIN rail

Phoenix DC plug-in

Phoenix DC plug-in

DC Jack

1

12V DC-in

4.5W (idle with Celeron N3060)
0 ~ 50 °C (32 ~ 122 °F)-40 ~ 85 °C (-40 ~ 185 °F)

Operating: 40 °C @ 95% RH,
non-condensing Storage: 60 °C @ 95%
RH, non-condensing
IEC60068-2-64 random 3.0Grms
IEC60068-2-6 sinusoidal 2.0G

IEC60068-2-27 half-sine 30G/11ms
CE/FCC Class B CB/UL/CCC/BSMI

Note: “-” : means Not Applicable (N/A)

41

RJ-45 x 2

Realtek ALC892

2 x 260-pin SODIMM-

Full size PCIe Gen2 (opt. 2 slots)

Antenna (optional)

Physical Characteristics

10/100/1000 Mbps

Intel Gen9LP

M.2

USB

Environment-

LAN1: Realtek RTL8111E
LAN2: Realtek RTL8111E

LAN

Power Requirements

Intel Gen8LP

Controller

DP/HDMI

Mounting

DDR3L-1600

Full size SATAIII (opt. mPCIe)

SD slot

Miscellaneous

AMI UEFI 64Mb SPI

mSATA Slot
Interface

Rear Panel/Side Panel

Fanless

1 x 204-pin SODIMM

Chipset Integrated

Front Panel

MIO-5373

1 x 204-pin SODIMM

SocketGraphics

Internal expansion Slot

Fanless

MIO-2360

Intel Core i7-8665UE/i5-8365UE

Technology

Audio

Fanless

PCM-9310

EPC-C301

Fanless barebone system

Intel Celeron N3350 1.10GHz

MemoryEthernet

EPC-S201

Fanless barebone system

Intel Celeron N3160/N3060,
Atom x5-E8000

CPU
BIOS

Storage

EPC-S101

Fanless barebone system w/ memory

188 x 39 x 150 mm
0.95kg-

12V DC-in

N3350: 0.41 @ 12V (4.89 W)
0 ~ 50 °C (32 ~ 122 °F)-40 ~ 85 °C (-40 ~ 185 °F)-

12V/24V DC-in
TBD-20 ~ 60 °C-40 ~ 85 °C (-40 ~ 185 °F)

Operating: 40 °C @ 95% RH,
non-condensing Storage: 60 °C @ 95%
RH, non-condensing

Operating: 40 °C @ 95% RH,
non-condensing Storage: 60 °C @ 95%
RH, non-condensing

IEC60068-2-27 half-sine 30G/11ms

IEC60068-2-27 half-sine 30G/11ms

IEC60068-2-64 random 3.0Grms
IEC60068-2-6 sinusoidal 2.0G

CE/FCC Class B CB/UL/CCC/BSMI/
KCC
134 x 100 x 44mm
0.6Kg

IEC60068-2-64 random 3.0Grms
IEC60068-2-6 sinusoidal 2.0G

CE/FCC ClassB/CB/UL/CCC/BSMI
170 x 118 x 70mm
1.5Kg

Product Selection Guide

EPC-B, EPC-T & EPC-P Series

Model Name
Barebone system

Description
Compatible Motherboard
Thermal Solution

Processor System

CPU
BIOS
SocketMemoryTechnology

Graphics

Max. Capacity
Chipset Integrated

Storage2.5" HDD Bay
mSATA Slot
Interface

Ethernet

Controller
Connector

AudioInternal expansion Slot

Front Panel

Rear Panel

Codec
Mini-PCIe
M.2
SIM slotSD slot
DP++
DP/HDMI
VGA
DVI
COM
LAN
USB
Audio Jack
Antenna (optional)
DP++
DP/HDMI
VGA
DVI
COM
LAN
USB
Audio Jack
GPIO
Antenna (optional)
LED Indicators

Miscellaneous

Mounting
Power Requirements

Environment

Certification
Physical Characteristics

SwitchCircular Cutouts
Power Voltage
Power Input Type (Inlet)
Consumption
Operating Temperature
Non-operating Temperature
Humidity
Vibration (5 ~500Hz)
Shock
Dimensions (W x H x D)
Weight

EPC-B2205

Fan-base barebone, w/ 150W PSU,
w/o HDD, memory
AIMB-205G2-00A1E
2 x chassis fan (7cm/28CFM)Intel® 7th Gen Core™ & 6th Gen
Core™ i processor /Pentium / Celeron(LGA1151) with Intel H110 chipset
AMI EFI 128 Mbit SPI
2 x 260-pin DDR4 SO-DIMM
Dual channel DDR4 2400/2133 MHz
non ECC SDRAM (Only supports DDR42133 MHz SDRAM for SKL-S CPU)Up to 32GB (16GB per SO-DIMM)
Integrated Intel® HD Graphics 530
2 (supports 2 x 2.5" HDD/SSD, or 1 slim
ODD & 1 x 2.5" HDD/SSD)
1(share w/ full size Mini-PCIe slot)
10/100/1000 Mbps

EPC-T4286

EPC-P3066

w/Fan, w/o adaptor, memory

w/Fan, w/o adaptor, memory

AIMB-286
2 Chassis Fans, 1 CPU cooler

Proprietary
2 Chassis Fans, 1 CPU coolerIntel® 8th /9th Gen Desktop Core i CPU

I7-9700E

AMI EFI 128 Mbit SPI
2 260-Pin SODIMMAMI EFI 128 Mbit SPI
2 260-Pin SODIMM

DDR4 2666

DDR4 2666

32GBIntel® UHD Graphics 630

32GBIntel® UHD Graphics 630

1

2

-

-

10/100/1000 Mbps Ethernet

RJ45

10/100/1000 Mbps Ethernet
LAN1: Intel Clarkville: I219LM GbE PHY
LAN 2: Intel Springville: i210AT GbE
LAN 3: Realtek: RTL8111H GbE
RJ45

Realtek ALC892

Realtek ALC892

2 (RJ-45)
4 (USB3.0); 4 (USB2.0)
3 (line-in, line-out, mic-in)
8 bits (Optional)-

2, 1 B-Key, 1 E-Key
1
1
1 HDMI
2 (RS-232)
3 (GbE)
6 (4 USB3.0, 2 USB2.0)
2 (1 Line-out, 1 Mic-in)
1
4 (RS-232)
22 (Power LED, HDD LED)

2 (Power, HDD)

2 (F/S)2, 1 B-Key, 1 E-Key
1 HDMI1
6 (2 RS-232/422/485, 4 RS-232)
3 (GbE)
6 USB3.0
5 (COM1 TX/RX, COM2 TX/RX, HDD
LED)

LAN1: Realtek RTL8111G
LAN2: Realtek RTL8111G
2 (RJ-45)
Realtek ALC892,
High Definition Audio (HD)1 (Full-size)
1 x M.2 Key B slot (2242)
4 (Optional)
2 (USB2.0; Optional)
up to 21/0
1
1 (DVI-D)

1 (Power Switch);
1 (Reset Switch)
Wall mountPower Voltage: 100V~240V AC input
Power Code input
TBD
0 ~ 40 °C (32 ~ 104 °F)-20 ~ 60 °C (-4 ~ 140 °F)
10~95% @ 40°C, non-condensing
1 Grms (HDD*1+ODD*1);
0.5 Grms (HDD*2)
CE, FCC
250 x 98 x 255 mm(9.84" x 3.86" x 10.04")
3.8kg

GbE LAN1/2: Realtek 8111G
GbE LAN3: Intel i211AT

1 Power Switch-

1 Power Switch-

12V DC-In
DC Jack
120W
0 ~ 45 ℃-40 ~ 85 ℃
10~95% @ 40°C, non-condensing

12 ~ 24V DC-In
4 Pin Phoenix Connector
220W
0 ~ 50 ℃-40 ~ 85 ℃
10~95% @ 40°C, non-condensing
3G(With SSD and w/o expansion options)

3G (with SSD)
CE / FCC

CE / FCC

188 x 44 x 188 mm

335 x 88 x 260 mm

3.1 Kg5.5 KgProduct Selection Guide

42

Product Selection Guide

Embedded PCs
EPC-U Series

BarebonesystemModel Name

Processor
SystemMemoryGraphics

Description
Compatible
Motherboard
Thermal Solution
CPU
BIOS
SocketTechnology
Max. Capacity
Chipset Integrated
2.5" HDD Bay

StoragemSATA Slot
eMMC
Interface

Ethernet

Controller
Connector

AudioInternal
expansion
Slot

Front Panel

Rear Panel

Miscellaneous
Mounting
Power
Requirements

Codec
Mini-PCIe
M.2
SIM slotSD slot
DP++
DP/HDMI
VGA
DVI
COM
LAN
USB
Audio Jack
Antenna (optional)
DP++
DP/HDMIVGA
CAN bus
COM
LAN
USB
Audio Jack
GPIO
Antenna (optional)
LED Indicators
SwitchCircular Cutouts
Power Voltage
Power Input Type
(Inlet)Consumption
OperatingTemperature

Environment

Certification

Non-operating
Temperature
Humidity
Vibration(5 ~500Hz)
Shock

Dimensions
Physical(W x H x D)
Characteristics
WeightNote: “-” : means Not Applicable (N/A)

43

Product Selection Guide

EPC-R Series

EPC-U2217
Fanless w/Adapter, memory

Barebone
SystemModel Name

AIMB-U217N-00A1E
Heatsink
Intel Atom E3940 (on board)
AMI EFI 16Mbit SPI
1 X 204-pin DDR3L SODIMM(Non-ECC)
DDR3L 1866MHz SDRAM
Up to 8GB SODIMM
Intel HD Graphics GEN91(support 2.5" HDD/SSD,
max 7.5mm height)
1, colay with F/S miniPCIE
Onboard eMMC 5.1 upto
128GB
10/100/1000 GbE LANs.
LAN1/2 Intel i210TE
LAN 3 Realtek RTL8111G
3(RJ-45)
Realtek ALC892, HighDefinition Audio(HD)2 (1xF/S miniPCIE slot,
1 M.2(E-Key)
3 x RS-232
1 x RS-422/RS-485
3
4 X USB 3.0
1
1/1
1
2 x 8 bit
Up to 4
1 x Power Switch
Wall mount, Din Rail mount
12V~24V DC-in
2 pin Phenix Connector
12V@1.409A-20 ~ 60 °C (32 ~ 104 °F)
with RF module by max
system performance-40 ~ 85 °C and 95% @40 °C
Non-Condensing

Processor
SystemMemoryGraphics
Storage

Ethernet
Audio
Internal
expansion Slot

Front Panel

Rear Panel/Side
Panel

170 X 52.6 X 117
1.2KG

Compatible
Motherboard
Thermal Solution

On-board StoragemSATA Slot
InterfaceController
Connector
Codec
Mini-PCIe
M.2
SIM slotSD slot
DP++
DP/HDMI
VGA
DVI
COM
GPIO
LAN
USB
Audio Jack
Antenna (optional)
DP++
DP/HDMI
VGA
DVI

-

USB

1 USB2.0 OTG

SwitchPower Voltage
Power Input Type
(Inlet)Consumption
OperatingTemperature
Non-operating
Temperature
Humidity
Vibration(5 ~ 500Hz)
Shock

PhysicalCharacteristics

8 GB of eMMC NAND Flash for
OS and 4 MB of SPI NOR Flashfor Advantech boot loade
2 x 10/100/1000 Mbps
TI AM3352 Integrated RGMII
2 x RJ45
1 x Full-size
1 x Nano SIM slot
1 x Micro SD slot
2 x 4-wire RS-232/485
6
2
-

COM

Mounting

Certification

Fanless
Rockchip Arm
Cortex-A17 RK3288
Quad core 1.6 GHz
Advantech boot loader
On-board
DDR3L 1333MHz
2 GB
Mali-T764 GPU processor with
OpenGL ES3.0, OpenCL1.1 andDirectX11

LAN 1

Circular Cutouts

Environment

RSB-4680

Advantech boot loader
On-board
DDR3 800MHz
1 GB

LED Indicators

Power
Requirements

Fanless

CPU

Chipset Integrated

Dimensions(W x H x D)
Weight

EPC-R4680

Arm based Fan-less Barebone
SystemBIOS
SocketTechnology
Max. Capacity

GPIO
Antenna (optional)
Miscellaneous

EPC-R3220

Arm based Fan-less Barebone
SystemTI Sitara™ AM3352
Cortex®-A8 800MHz

Audio Jack

3G (with 2.5” SSD)
CE/FCC/CCC/BSMI

Description

4 x Antenna holes
1 LED for system power
3 LEDs for user to define
1 x Reset button
Wall mount/DIN rail mount(option)12~24V

8GB eMMC NAND Flash for
O.S. and Advantech boot loader
10/100/1000 Mbps
TI DP83867
RJ45
Realtek ALC5660
1 x Full-size
1 x M.2 Key E slot
1
1 x Micro SD slot
4 x 4-wire RS-232
3 USB2.0
3 x antenna hole
1x HDMI 2.0 up to 3840 x 2160
1
1 x 4-wire RS-232/485
1 x 2-wire RS-232/Debug port
1
2 x USB2.0 Host
1 x USB2.0 OTG
1 x Line out
1 x Mic in
8 x GPIO by DB9
2 x Antenna holes
1 Green LED for system power
1 Orange LED for WLAN
1 x Reset button
1 x Power button
Wall mount12V

2-pole lockable DC-in

DC-in

4.7W (Burning)

11.6W (heavy loading burning)-20 ~ 70 °C

0 ~ 55 °C/-20 ~ 70 °C-40 ~ 85 °C-40 ~ 85 °C

5 ~ 95% Relative
Humidity,
non-condensing
IEC60068-2-64 random 2.0Grms
IEC60068-2-6 sinusoidal 2.0G
IEC60068-2-27 halfsine
10G/11ms
CE/FCC/CCC/BSMI/SRRC

IEC60068-2-64 random 2.0Grms
IEC60068-2-6 sinusoidal 2.0G
IEC60068-2-27 halfsine
10G/11ms
CE/FCC Class B/CCC/BSMI

139 x 85 x 30 mm

190 x 150 x 43 mm

0.6KG

0.95KG

5 ~ 95% Relative Humidity,
non-condensing

Product Selection Guide

Embedded Wireless Modules
4G LTE CAT1/CAT4/CAT6

EWM-C163

EWM-C145

EWM-C148

Part Number

Model Name

EWM-C128FG01E

EWM-C128

EWM-C117FL03E

EWM-C117
EWM-C117FL04E

EWM-C163M201E

EWM-C145FL01E

EWM-C148FL02E
mini PCI-e FMC

Form Factor

Full-size Mini PCIe

Full-size Mini PCIe

Full-size Mini PCIe

M.2 3042 (B key)

Full Size Mini PCI-e

SIM Slot

With SIM card slot

With SIM card slot

With SIM card slot

No SIM card slot

With SIM card slotnoRadio Technology

LTE CAT1+GPS

LTE CAT4

LTE CAT4

LTE CAT6

LTE CAT4+GPS

CAT4

Downlink/ Uplink

DL:10 Mbps, UL:5 Mbps

FDD LTE
Max150Mbps(DL) /50Mbps(UL)

FDD
LTEMax150Mbps(DL) /50Mbps(UL)

FDD
LTEMax300Mbps(DL) /50Mbps(UL)

FDD
LTEMax150Mbps(DL) /50Mbps(UL) TDD-LTE:
132 Mbps DL, 30
Mbps UL

150Mbps/50Mbps

Frequency Band

4G/LTE Cat. 1: Bands 3,
8, 28 for Taiwan
3G UMTS: band 1

4G LTE bands 2 / 4 /5 / 7 / 17, 3G bands
1/2/4/5/8, GPRS band
850 / 900 / 1800 / 1900

4G LTE bands 1 / 3 / 5/ 7 / 8 / 20, 3G bands
1/2/5/8, GPRS: 850/
900/1800/1900MHz

4G LTE FDD: Band 1,
3, 7, 8, 20, 28, 32 3G
bands: 1, 8

FDD-LTE: B1/B3/B5/B8
TDD-LTE: B38/B39/
B40/B41
TD-SCDMA: B34/B39
EVDO/CDMA: BC0

FDD-LTE: Band
1,3,5,7,8,20,28
TDD-LTE: Band38,40,41

Main Chipset

u-blox LARAR280+M8M-0 GNSS
engineu-blox TOBY-L200

u-blox TOBY-L210

Intel 7262

Qualcomm MDM9X07

Qualcomm MDM9X07

Operating Temperature(-40~+85) (Operating)-40 ~ +85 °C(Operating)-40 ~ +85 °C(Operating)-30 ~ +65 °C(Operating)(-40~+85) (Operating)

Extended: -40 ~ +85 °C

Signal Protocol

USB 2.0

USB 2.0

USB 2.0

USB 2.0

USB 2.0

USB 2.0

Support Area

Taiwan/Australia

US

EU/APAC

EMEA

China

EU

Wi-Fi 6

Model Name
Part Number
Form Factor
Wireless Standard
ChipsetSignal Protocol
Antenna

Wi-Fi

EWM-W158

EWM-W170

EWM-W260M201E

EWM-W260

Part Number

EWM-W158F01E

EWM-W170H01E

M.2 2230 E-key

Form Factor

Full Size Mini PCI-e

Half Size Mini PCI-e

802.11 a/b/g/n/ac/ax+BT5.1
QCA6391
PCI-e/USB 2.0
2 antenna

Operating Voltage

3.3V

Temperature Range

TBD

Dimensions (LxWxH)
Security

22 x 30 x 2.2 mm
WEP 64-bit and 128-bit encryption with H/W TKIP processing
WPA/WPA2 (Wi-Fi Protected Access); WAPISISO/MIMO

2T2R MIMO

Data Rate

802.11ax:up to 1774.5Mbps

Bluetooth

BT5.1

O.S Supported

Win10

Host Connector TypeM.2 card

Model Name

Wireless Standard
ChipsetSignal Protocol
Antenna

802.11 a/b/g/n

802.11a/b/g/n/ac

Atheros AR9592- AR1B

Atheros QCA9377-7

PCIe Differential

USB Differential

2 x U.FL connectors

2*U.FL connectors

Operating Voltage

DC 3.3V ± 5%

DC 3.3V+-5%

Temperature Range-40 ~ 85 °C (Operating)(-20~+70) (Operating)Dimensions (L x W x H)

50.8 x 29.85 x 2.86 mm

26.65*29.85*2.75mm

Security

64/128-bit WEP, WPA,
WPA2, 802.1x, TKIP andAES

WAPI, 64/ 128-bit WEP,
WPA/WPA2 TKIP and AES

SISO/MIMO

2T2R MIMO

1T1R

Data Rate

300Mbps

433MbpsBluetooth--O.S Supported

Win 7/ 8/ 8.1

Win7/8/8.1/10

Host connector type

PCIe Mini card

PCIe Mini card

Product Selection Guide

44

Product Selection Guide

Embedded Wireless Modules
GPS

LPWAN

Model Name

EWM-G109

Part Number

EWM-G109H01E

Form Factor

Half Size Mini PCI-e

EWM-G110

Hardware standalone

Hardware standalone

ChipsetNEO-M8N

NEO-M8U+3D inertial
sensorsUSB

Operating Temperature-40 to +85 °C

RF Receiver TypeGPS Acquisition
GPS Accuracy
GPS Sensitivity

Aided starts: 2

Aided starts: 2

Cold starts: 26s / Aided
starts: 2

Cold starts: 26s / Aided
starts: 2

Tracking: -167 dBm /Cold starts: -148 dBm /Reacquisition: -160 dBm

Tracking: -167 dBm /Cold starts: -148 dBm /Reacquisition: -160 dBm

Full Size Mini PCI-e

SIM slot

With SIM card slot

Radio Technology

LTE Cat M1 / NB1

DL 375 kb/s Cat M1 Half-duplex
UL 375 kb/s Cat M1 Half-duplex

Downlink/ Uplink-40 to +85° C

GPS module, multi-GNSS(GPS, Beidou, GLONASS,
Galileo, QZSS and SBAS)

EWM-NB147F02E

Form Factor

USB

GPS module, multi-GNSS(GPS, Beidou, GLONASS,
Galileo,
QZSS and SBAS)

EWM-NB147

Part Number

Half Size Mini PCI-e

GPS Type

Signal Protocol

Model Name

EWM-G110H01E

Frequency Band

4G/LTE Cat. 1: Bands 2, 3, 4, 5, 8, 12, 13, 20, 28

Main Chipset

u-blox SARA-R410-02B engine

Operating Temperature
Signal protocol(-40 ~ +85 °C) (Operating)USB 2.0

FCC, ISED, GCF, NCC, PTCRB, RCM, AT&T, Telstra,
T-Mobile, Verizon

support area

Wi-Fi & Bluetooth Combo

Model Name

EWM-W157

Part Number

M.2-2230(A-E key)

Half Size Mini PCI-e

802.11a/b/g/n/ac+BT4.2

802.11a/b/g/n/ac+BT4.2

802.11a/b/g/n/ac+BT4.2

Realtek RTL8821CE

Atheros QCA6174A-5

Atheros QCA6174A-5

Atheros QCA6174A-5

802.11 ac/a/b/g/n + Bluetooth
5.0

2 x I-PEX MHF4 connectors

2 x I-PEX MHF4 connectors

2*U.FL connectors

2*I-PEX MHF4 connectors

2 antenna

0 ~ 70 °C (Operating)

Extended Operating
temperature: -20 ~ 85 °C-40 ~ 85° C (Operating)-40 ~ 85° C (Operating)

0 ~ +70°C

64/128-bit WEP, WPA, WPA2,
802.1x, TKIP
and AE22 x 30 x 2.3 mm

26.65*29.85*2.75mm

22*30*2.3mm

WAPI, 64/ 128-bit WEP,
WPA/WPA2 TKIP and AES

WAPI, 64/ 128-bit WEP,
WPA/WPA2 TKIP and AES

WAPI, 64/ 128-bit WEP,
WPA/WPA2 TKIP and AES

433Mbps

1T1R

2T2R MIMO

2T2R MIMO

2T2R MIMO

2.1, 2.1+EDR, 3.0, 3.0+HS,
4.0 (BLE), 4.1,4.2

867Mbps

2.1, 2.1+EDR, 3.0, 3.0+HS,
4.0 (BLE), 4.1, 4.2

2.1,2.1+EDR,3.0,3.0+HS,
4.0(BLE), 4.1, 4.2

2.1,2.1+EDR,3.0,3.0+HS,
4.0(BLE), 4.1, 4.2

M.2 card

M.2 card

PCIe Mini card

M.2 card

M.2-2230 (A-E key)

WiFi: PCIe
BT: USB Differential

Signal Protocol

DC 3.3V ± 5%

Temperature Range

Security
SISO/MIMO

Data Rate
BluetoothO.S Supported

22 x 30 x 2.3 mm

Host TypeWin 7/8/8.1/10

WiFi: PCIe
BT: USB Differential

WiFi: PCIe
BT: USB Differential

DC 3.3V ± 5%

Win7/8/8.1/10

DC 3.3V+-5%

Optional Antenna Selection

Part Number

Size (cm)Support Frequency
Antenna Gain
Polarization

Connector

Impedance

45

EWM-W159

EWM-W159M201E

ChipsetDimensions (L x W x H)

802.11 ac/a/b/g/n+BT4.2

EWM-W195

EWM-W195M201E

Wireless Standard

Operating Voltage

EWM-W163M201E

EWM-W190

EWM-W190H01E

Form Factor

Antenna

EWM-W163

EWM-W157M201E

Product Selection Guide

1750008717-01
10.9 x 1.0

WiFi Dual band antenna(2.4Ghz and 5Ghz)

2.89 dBi @ 2.4-2.5GHZ,
3.58dBi @ 5.15-5.85GHz
Linear

RP-SMA male
50 ohm

867Mbps

Win7/8/8.1/10

M.2-2230(A-E key)

WiFi: PCIe
BT: USB Differential

M.2 2230 A-E key

RTL 8822CE-CG
PCI-e/USB 2.0

DC 3.3V+-5%

3.3V

22 x 30 x 2.2 mm

WPA/WPA2 (Wi-Fi Protected
Access) / WAPI / WEP 64-bitwith H/W TKIP
2T2R MIMO

867Mbps

Win7/8/8.1/10

867Mbps
BT5.0

Windows 7/8.x/10
M.2 card

Optional Accessories

1750008772-01
15 x 1.0

WiFi Dual band antenna(2.4Ghz and 5Ghz)

2.93 dBi @ 2.4-2.5GHZ,
4.4dBi @ 5.15-5.85GHz
Linear

RP-SMA male
50 ohmPart Number

1750008767-01

Length (cm)150

Cable Type

WiFi cable

Cable Loss

0.62dB@2500MHz for 1Meter

Polarization

LinearConnector

SMA(F)/SMA(M)

Impedance

50 ohmProduct Selection Guide

Industrial Flash and Memory Solutions
SQFlash Industrial Storage Modules
NVMe SSD

Model Name
Form factor
Transfer Protocol

SATA SSD

SQF-C25920 series

SQF-CM8920 series

SQF-CM3
720 series

SQF-CMS710 series

SQF-S25845 series

SQF-S25840 series

SQF-SM8840 series

2.5" U.2 NVMe SSD

M.2 2280 NVMe
SSD (NGFF)

M.2 2230 NVMe
SSD (NGFF)

Full-size Mini PCIe
SSD

2.5" SATA SSD

2.5" SATA SSD

M.2 2280 SATA SSD(NGFF)SATA 6Gb/s

SATA 6Gb/s

SATA 6Gb/s

PCIe Gen3 x4

PCIe Gen3 x4

PCIe Gen3 x2

PCIe Gen3 x2Connector

U.2 NVMe Interface(SFF 8639)

M.2 M-key with PCIe
pin-out

M.2 A+E key with
PCIe pin-out

Mini PCIe with PCIe
pin-out

7+15 pin SATA

7 + 15 pin SATA

M.2 with B+M key
SATA pin-out

Flash Type

3D TLC (BiCS3)

3D TLC (BiCS3)

3D TLC (BiCS3)

3D TLC (BiCS3)

3D eTLC (BiCS3)

3D TLC (BiCS3)

3D TLC (BiCS3)

Maximum Power
Consumption

790 mA

2,430 mA

910mA

957 mA

900mA

720 mA

900 mA

Capacity

240GB ~ 7.6TB

240GB ~ 1.9TB

128GB ~ 512GB

64GB-1TB

480GB ~ 1.9TB

240GB ~ 7.6TB

240GB ~ 1.9TB

Maimum Read /Write Performance(MB/s)

Read: upto 3,200
Write: upto 3,000

Read: upto 3,200
Write: upto 2,700

Read: upto 850
Write: upto 780

Read: upto 1,560
Write: upto 1,000

Sequential:
560.1/ 533.3
Random IOPS@4K:
98K/72K

Sequential:
550 / 530
Random IOPS@4K:
100K/90K

Sequential:
550 / 530
Random IOPS@4K:
100K/90K

Op. Temperature

0 ~ 70 °C /-40 ~ 85 °C

0 ~ 70 °C /-40 ~ 85 °C

0 ~ 70 °C /-40 ~ 85 °C

0 ~ 70 °C /-40 ~ 85 °C

0~70°C

0 ~ 70 °C /-40 ~ 85 °C

0 ~ 70 °C /-40 ~ 85 °C

SQFlash Utility/
SQFlash Manager

Supported

Supported

Supported

Supported

Supported

Supported

Supported

Shock

1,500G, Peak /0.5 ms1,500G, Peak /0.5 ms1,500G, Peak /0.5ms

1,500G, Peak /0.5 ms1,500G, Peak /0.5ms

1,500G, Peak /0.5 ms1,500G, Peak /0.5 msVibration

20G, Peak /80 ~2,000 Hz

20G, Peak /80 ~ 2,000 Hz

20G, Peak /80~2,000Hz

20G, Peak / 80
~2,000 Hz

20G, Peak /80~2,000Hz

20G, Peak /80 ~ 2,000 Hz

20G, Peak /80 ~ 2,000 Hz

SATA SSD

SQF-S25830 series

SQF-SMS
830 series

SQF-SM8830 series

SQF-S25
640 series

SQF-SM8640 series

SQF-SM4
640 series

SQF-SMS
640 series

2.5" SATA SSD

mSATA SSD
(MO-300A)

M.2 2280 SATA
SSD (NGFF)

2.5" SATA SSD

M.2 2280 SATA
SSD (NGFF)

M.2 2242 SATA
SSD (NGFF)

mSATA SSD
(MO-300A)

CFast

SATA 6Gb/s

SATA 6Gb/s

SATA 6Gb/s

SATA 6Gb/s

SATA 6Gb/s

SATA 6Gb/s

SATA 6Gb/s

SATA 6Gb/s

Connector

7 + 15 pin SATA

Mini PCIe with
SATA pin-out

M.2 with B+M key
SATA pin-out

7 + 15 pin SATA

M.2 with B+M key
SATA pin-out

M.2 with B+M key
SATA pin-out

Mini PCIe with
SATA pin-out

CFast Type-I

Flash TypeSLC / Ultra MLC/ MLC

SLC / Ultra MLC/ MLC

SLC / Ultra MLC/ MLC

Ultra MLC / MLC /3D TLC (BiCS3)

Ultra MLC / MLC /3D TLC (BiCS3)

Ultra MLC / MLC /3D TLC (BiCS3)

Ultra MLC / MLC /3D TLC (BiCS3)

Ultra MLC / MLC /3D TLC (BiCS3)

Maximum Power
Consumption

1,080 mA

1,260 mA

1,260 mA

530 mA

750 mA

500 mA

750 mA

500 mA

Capacity

64GB ~ 2TB

32GB ~ 1TB

32GB ~ 1TB

16GB ~ 1TB

16GB ~ 512GB

16GB ~ 512GB

16GB ~ 1TB

16GB ~ 256GB

Maimum Read /Write Performance(MB/s)

Sequential:
550 / 530
RandomIOPS@4K:
100K / 100K

Sequential:
540 / 480
RandomIOPS@4K: 88K/ 91K

Sequential:
540 / 480
RandomIOPS@4K: 88K/ 91K

Sequential:
560 / 490
RandomIOPS@4K: 86K/ 91K

Sequential:
560 / 490
RandomIOPS@4K: 86K/ 91K

Sequential:
560 / 500
RandomIOPS@4K: 86K/ 91K

Sequential:
560 / 490
RandomIOPS@4K:
86K / 91K

Sequential:
560 / 470
RandomIOPS@4K:
82K / 82K

Op. Temperature

0 ~ 70 °C /-40 ~ 85 °C

0 ~ 70 °C

0 ~ 70 °C

0 ~ 70 °C /-40 ~ 85 °C

0 ~ 70 °C /-40 ~ 85 °C

0 ~ 70 °C /-40 ~ 85 °C

0 ~ 70 °C /-40 ~ 85 °C

0 ~ 70 °C /-40 ~ 85 °C

SQFlash Utility/
SQFlash Manager

Supported

Supported

Supported

Supported

Supported

Supported

Supported

Supported

Shock

1,500G, Peak /0.5 ms1,500G, Peak /0.5 ms1,500G, Peak /0.5 ms1,500G, Peak /0.5 ms1,500G, Peak /0.5 ms1,500G, Peak /0.5 ms1,500G, Peak /0.5 ms1,500G, Peak /0.5 msVibration

20G, Peak /80 ~2,000 Hz

20G, Peak /80 ~2,000 Hz

20G, Peak /80 ~2,000 Hz

20G, Peak /80 ~2,000 Hz

20G, Peak /80 ~2,000 Hz

20G, Peak /80 ~2,000 Hz

20G, Peak /80 ~2,000 Hz

20G, Peak /80 ~2,000 Hz

Model Name
Form factor
Transfer Protocol

SQF-S10640 series

Product Selection Guide

46

Product Selection Guide

Industrial Flash and Memory Solutions
SQRAM Industrial Memory Modules
SODIMM

Model

UDIMM

SQR-SD4N

SQR-SD3N

SQR-SD3M

SQR-SD4I

SQR-SD3I

SQR-SD2ISQR-UD4N

DDR

DDR4

DDR3L

DDR3L

DDR4

DDR3L

DDR2

DDR4

DDR3L

DIMM TypeSODIMM

SODIMM

SODIMM

SODIMM

SODIMM

SODIMM

UDIMM

UDIMM

Pin Number

SQR-UD3N

260pin204pin204pin260pin204pin200pin288pin240pinFrequence(MHz)3200/2666/2400

1866/1600

1866/1600

3200/2666/2400

1866/1600

800/667

3200/2666/2400

1866/1600

Capacity

2/4/8/16/32GB

2/4/8GB

2/4/8GB

4/8/16/32GB

2/4/8GB

1/2GB

2/4/8/16/32GB

2/4/8GB

Voltage

1.2V

1.35V/1.5V

1.35V/1.5V

1.2V

1.35V/1.5V

1.8V

1.2V

1.35V/1.5V

0 ~ 85 °C

0 ~ 85 °C-20 ~ 85 °C-40 ~ 85 °C-40 ~ 85 °C-40 ~ 85 °C

0 ~ 85 °C

0 ~ 85 °C

Operating Temperature
SQRAM Manager

Supported

SQR-RD4N

SQR-RD4I

SQR-SD4 (ECC)SQR-UD4N (ECC)

DDR

Model

DDR4

DDR4

DDR4

DDR4

DDR4

DIMM Type

RDIMM

RDIMM

SODIMM

UDIMM

Rugged SODIMM
260pinPin Number
Frequence(MHz)CapacitySQR-YD4I

288pin288pin260pin288pin3200/2933/2666

2400

2666/2400

2666/2400

2666

8/16/32GB

8/16/32GB

4/8/16/32GB

4/8/16/32GB

8/16/32GB

Voltage

1.2V

1.2V

1.2V

1.2V

1.2V

0 ~ 85 °C-40 ~ 85 °C

0 ~ 85 °C / -40 ~ 85 °C

0 ~ 85 °C

0 ~ 85 °C / -40 ~ 85 °C

Function

ECC

ECC

ECC

ECC

ECC (optional)

Register

Yes

Yes

-

-

-

No support

No support

Supported

Supported

Supported

Operating Temperature

SQRAM Manager

EXM Embedded Extension Modules

Model NameType
Communication
Interface

EXM-523

EXM-510(EMIO-100E)

EXM-520(EMIO-200SA)

EXM-522

EXM-322(EMIO-220S)

EXM-321(EMIO-210S)

EXM-CMPF1(A key)

EXM-CMPF1(E key)PCIe to 2-Ch
Giga LAN port

PCIe to 1-Ch
Giga LAN port

PCIe to 2-Ch
SATA III port

PCIe to 2-Ch
USB 2.0 port

USB to 2-Ch High
Speed RS-422/
RS-485 port

USB to 2-Ch
High Speed RS232 port

M.2 (NGFF)
to mPCIe(PCIe+USB)
adapter

M.2 (NGFF)
to mPCIe(PCIe+USB)
adapter

PCIe

PCIe

PCIe

PCIe

Combo USB
(Internal/
External)

Combo USB
(Internal/
External)

PCIe and USB

PCIe and USB

Internal USB
port: MiniPCIe
thru USB
External USB
port: 2.0 mm,
1x4-pin, male
type wafer box

MiniPCIe thru
PCIe and USB

MiniPCIe thru
PCIe and USB

2

1 (2230/2242
A key)

1 (2230/2242
E key)

Interface Connector

MiniPCIe thru
PCIe

MiniPCIe thru
PCIe

MiniPCIe thru
PCIe

H/S MiniPCIe
thru PCIe

Internal USB
port: MiniPCIe
thru USB
External USB
port: 2.0 mm,
1x4-pin, male
type wafer box

Channel Connector

2

1

2

2

2

Operating Temperature

0 ~ 70°C-40 ~ 85°C

-10 ~ 70°C

-40 ~ 85°C

-40 ~ 85°C

-40 ~ 85°C

-40 ~ 85°C

-40 ~ 85°C

Storage Temperature-40 ~ 85°C

-40 ~ 85°C

-40 ~ 85°C

-40 ~ 85°C

-40 ~ 85°C

-40 ~ 85°C

-40 ~ 85°C

-40 ~ 85°C

Power On/Off:Red LED
COM-1 working :Green LED
COM-2 working:Green LED

Activatedindicator

Activatedindicator

50.59 x 30 x
15 mm

50.59 x 30 x
15 mm

50.59 x 30 x
15 mm

LED Status

Reserve the LED Reserve the LED
signal for external signal for external
usage
usage

Activatedindicator-

Power On/Off:Red LED
COM-1 working :Green LED
COM-2 working:Green LED

Dimensions (L x W x H)

50.59 x 30 x 20
mm + iDoor PCB
Board

50.59 x 30 x
20 mm

26.65 x 30 x
15 mm

50.59 x 30 x w20mm

Note: “-” : means Not Applicable (N/A)

47

Product Selection Guide

50.59 x 30 x
20 mm

Industrial Display Kit IDK-1000 Series
IDK-1105

IDK-065

640 x 480
(VGA)

640 x 480
(VGA)

800 x 480
(WVGA)

1024 x 600(WSVGA)

1024 x 600(WSVGA)

800 x 600(SVGA)

1024 x600(WSVGA)

Viewing Angle(H/V°)

140/100

160/140

160/160

150/145140/120160/140

120/140

Touchscreen

4-WireResistive

4-WireResistive

4-WireResistive

4-WireResistive

P-cap

30,00050,00050,00050,00050,000Size
Resolution
Brightness (cd/m2)

Contrast Ratio

Signal Interface

Backlight Life (hrs)

Durability (touches)
OperatingTemperature

5.7"

500

Brightness (cd/m2)

800

250:1

400

750:1

LVDS

LVDS

800 x 600(SVGA)

170/170

160/130

176/176

700:1

1000:1

500

500:1

400

800:1

4-WireResistive

4-WireResistive

P-cap

50,00050,00050,000

LVDS

10.4"

1280 x 800(WXGA)

LVDS

500

4-WireResistive

LVDS

1024 x 768
(XGA)

P-cap

LVDS

LVDS

50,00050,000

1 million

1 million

1 million

50 million ~1 million

1 million

50 million ~1 million

50 million ~-10 ~ 60°C

-5 ~ 60°C-20 ~ 70°C

-20 ~ 70°C

-10 ~ 60°C

-5 ~ 60°C-20 ~ 65°C

-10 ~ 60°C

-20 ~ 70°C

IDK-1112

IDK-1115

12.1"

800 x 600 (SVGA)

1024 x 768 (XGA)

500
178/178

Contrast Ratio

700:1

Touchscreen

5-Wire Resistive
LVDS

1000:115.6"

1366x768(WXGA)

1024 x 768 (XGA)

500

50,000

IDK-1115WP

15”

178/178

OperatingTemperature

IDK-1110

1 million450

Durability (touches)

550

600:1

LVDS

10.1"

-20 ~ 70°C

160/140Signal Interface

450

600:1

LVDS

IDK-1110W

8.4"

500

700:1

Viewing Angle(H/V°)

Backlight Life (hrs)IDK-1108

7"

400

600:1

LVDS

Size
Resolution

IDK-1107W

6.5"

500

19"

IDK-1121W
21.5"

1920x1080(FHD)

1280 x 1024
(SXGA)

1920 x 1080
(FHD)

170/170

170/160

178/178

178/178450

160/150

2500:1

IDK-1119

350

300

1920 x 1080
(FHD)
250

5-Wire Resistive
and P-cap

5-Wire Resistive
and P-cap

600:1

800:1

1000:1

5000:1

1000:1

P-cap

P-cap

5-Wire Resistive

5-Wire Resistive

P-cap

30,00070,00050,000LVDS

2 Channel LVDS

2 Channel LVDS

2 Channel LVDS

2 Channel LVDS

LVDS

LVDS

50,00050,000

Product Selection Guide

Industrial Display Systems

50,00030,000

10 million

10 / 50 million ~10 / 50 million ~50 million ~50 million ~10 million

10 million

50 million ~-20 ~ 70°C

-20 ~ 70°C

-20 ~ 70°C

-10 ~ 70°C

-20 ~ 70°C

0 ~ 50°C

0 ~ 60°C

0 ~ 50°C

High Brightness Display Kit IDK-2000 SeriesSize

IDK-2108
8.4"

IDK-2110
10.4"

IDK-2112

800 x 600(SVGA)

800 x 600(SVGA)

Viewing Angle(H/V°)

160/140

160/130

Touchscreen

4-WireResistive

4-WireResistive

4-WireResistive

5-WireResistive

Signal Interface

LVDS

LVDS

LVDS

LVDS

Resolution
Brightness (cd/m2)

Contrast Ratio

Backlight Life (hrs)

Durability (touches)
OperatingTemperature

1200

600:1

50,000

1200

500:1

50,000

12.1"

IDK-2115

IDK-2117

IDK-2119

IDK-2121

1024 x 768(XGA)

1024 x 768(XGA)

1280 x 1024
(SXGA)

1280 x 1024
(SXGA)

1920 x 1080
(FHD)

15"

17"

19"

21.5"

1024 x 768(XGA)

800 x 600(SVGA)

170/170

160/140

178/178

178/178

170/160

170/160

178/178

700:1

1000:1

2500:1

1000:1

1000:1

5000:1

1300

1200

700:1

70,0001200

50,000

1200

P-cap

5-WireResistive

LVDS

LVDS

50,0001200

5-WireResistive

50,0001200

5-WireResistive

1200

5-WireResistive

2 Channel
LVDS

2 Channel
LVDS

2 Channel
LVDS

50,00050,00050,000

1 millions

1 million

1 million

10 million

50 million ~10 million

10 million

10 million

10 million-20 ~ 70°C

-10~60°C-10~60°C-20 ~ 70°C

-20 ~ 70°C

-20 ~ 70°C

0 ~ 50°C

0 ~ 50°C

0 ~ 55°C

Slim Open Frame/Panel Mount Monitors IDS-3000 Series
Size
Resolution
Brightness (cd/m2)

Viewing Angle(H/V°)
Contrast Ratio
Touchscreen
Backlight Life (hrs)
Durability
OperatingTemperature
I/O Ports
OSD

IDS-3106/
IDS-3206
6.5"

IDS-3110/
IDS-3210
10.4"

IDS-3112/
IDS-321212.1"

800 x 600 (SVGA) 800 x 600 (SVGA) 800 x 600 (SVGA)
1024 x 768 (XGA) 1024 x 768 (XGA) 1024 x 768 (XGA)
800

160/140600 : 1

400/500

160/140700 : 1450/600

160/140700 : 1

IDS-3115/
IDS-3215

IDS-3117/
IDS-3217

IDS-3118W/
IDS-3218W

IDS-3119/
IDS-3219

IDS-3121W/
IDS-3221

1024 x 768(XGA)

1280 x 1024
(SXGA)

1366 x 768 (HD)1280 x 1024,(SXGA)

1920 x 1080
(FHD)

160/140

170/160

170/160

170/160

178/178

5-wire resistive
and P-cap

5-wire resistive
and P-cap

5-wire resistive
and P-cap

15"500/1200
700 : 117"350

800 : 1

18.5"

300

1000:119"

350

1000:121.5"

250

1000:1

5-wire resistive
and P-cap

5-wire resistive
and P-cap

5-wire resistive
and P-cap

5-Wire Resistive

1 million
touches

10/50 million
touches

10/50 million
touches

10/50 million
touches

10 million
touches

10/50 million
touches

10/50 million
touches

10/50 million
touches0 ~ 50° C- 20 ~ 60° C- 20 ~ 60° C- 20 ~ 60° C- 20 ~ 60° C

0 ~ 55° C

0 ~ 45° C

0 ~ 45° C

4-Wire Resistive
50,000

VGA x 1; DVI x 1;
12 VDC Jack x 1;
USB x 150,00050,00050,00050,00050,00050,00050,000

VGA x 1; DVI x 1; HDMI x 1 (selected models);
12 VDC Jack x 1; USB x 1; RS-232 x 1
Keys: Power on/off, Menu/Enter, Left/Up, Right/Down, Exit/Auto, Source
Menu Functions: Brightness, Contrast, Screen Setting, Color Temp, OSD Language, VGA/DVI, Reset, Auto Adjust

Product Selection Guide

48

Product Selection Guide

Industrial Display Systems
IP65 Monitors IDS-3300 Series
IDS-3315

IDS-3319

15"

19"

21.5"

1024 x 768 (XGA)

1280 x 1024 (SXGA)1920 x 1080 (FHD)

Size
Resolution

IDS-3321W

Brightness (cd/m2)

500 / 1200

350

250

Viewing Angle (H/V°)

160/140

170/160

178/178

Contrast Ratio

2500:1

1000:1

1000:1

Touchscreen

5-wire resistive and P-cap

5-wire resistive and P-cap

5-wire resistive and P-cap

Backlight Life (hrs)

50,00050,00050,000

Durability

10/50 million
touches

10/50 million
touches

10/50 million
touches

OperatingTemperature- 20 ~ 60° C

0 ~ 45° C

0 ~ 45° C

VGA x 1; DVI x 1; HDMI x 1
12VDC Jack x 1; USB x 1; RS-232 x 1

I/O Ports

Configurable Industrial Monitors IDS31 Series
IDS31-070W

IDS31-104

IDS31-156W

IDS31-185W

IDS31-190

IDS31-215W

IDS31-230W

Size

7" Wide10.4"

15.6" Wide

18.5" Wide

19"

21.5" Wide

23" Wide 32"

IDS31-320W
32" Wide

Resolution

800 x 480

800 x 600

1366 x 768

1366 x 768

1280 x 1024

1920 x 1080

1920 x 1080

1920 x 1080

Brightness (cd/m2)

400

230

300

300

350

250

300

350

Viewing Angle (H/V°)

80,80,60,80

60,60,55,45

85,85,80,80

85,85,80,80

85,85,80,80

89,89,89,89

89,89,89,89

89,89,89,89

500 : 1500 : 1500 : 11000 : 1

1000 : 1

5000 : 1

1000 : 1

1000 : 1

5 wire AR

Projected
Capacitive

Projected
Capacitive

Projected
Capacitive

Projected
Capacitive

Projected
Capacitive

Surface /Projected
Capacitive

Contrast Ratio
Touchscreen

5 wire AR

Backlight Life (hrs)OperatingTemperature

50,00030,00050,00050,00050,00030,00030,00050,0000 ~ +50° C

0 ~ +50° C

0 ~ +50° C

0 ~ +50° C

0 ~ +50° C

0 ~ +50° C

0 ~ +50° C

0 ~ +50° C

Digital Signage Displays DSD-3000/5000 Series
DSD-3032

DSD-3042

DSD-3055

DSD-5028

32"

42"

55"

28"

38"

1920 x 1080

1920 x 1080

1920 x 1080

1920 x 358

1920 x 538

Size
Resolution
Brightness (cd/m2)

350

500

450

700

800

Viewing Angle (H/V°)

178/178

178/178

178/178

178/178

176/176
4000:1

Contrast Ratio

3000:1

4000:1

4000:1

3000:1

Touchscreen

Optical Touch

Optical Touch

Optical Touch

N/A

N/A

Signal Interface

HDMI/VGA/ DisplayPort

HDMI/VGA/ DisplayPort

HDMI/VGA/ DisplayPort

VGA/DVI

VGA/DVI
50,000

Backlight Life (hrs)
Durability
OperatingTemperature

50,00050,00050,00050,000

10 million touches

10 million touches

10 million touches

N/A

N/A

5 ~ 45° C

5 ~ 45° C

5 ~ 45° C

0 ~ 45° C

0 ~ 45° C

Ultra Thin Proflat Monitors IDP31 Series
Size
Resolution

Cureved Display CRV Series

IDP31-150

IDP31-156W

IDP31-215W

15”

15.6”

21.5" WideSize

1024 x 768

1920 X 1080

1920 x 1080

Resolution

CRV-430JP

43" C type43” J type3840 x 2160 UHD

500

450

250

Viewing Angle (H/V°)

160 / 140

170 / 170

178 / 178

Contrast Ratio

Contrast Ratio

2500:1800:11000 : 1

Curved Radius

1500

Touchscreen

P-cap

P-cap

P-cap

Touchscreen

Multi-touch PCT(10 touches)

Durability

Brightness (cd/m2)

CRV-430WP

Brightness (cd/m2)

Backlight Life (hrs)450
1100:1 (8ms)

50,00050,00050,000Cover Glass

4mm

50 million touches

50 million touches

50 million touches

0 ~ 50° C-20 ~ 60

-20 ~ 60

0 ~ 45

OperatingTemperature

OperatingTemperature49

DSD-5038

Product Selection Guide

I/O Ports

HDMI 1.4 (2 ports), HDMI 2.0 (2 ports), DisplayPort, VGA

Find More Product Information Online
Computer On Module

Product Selection

Solution Site

Embedded Single Board Computer

Product Selection

Solution Site

Industrial Motherboard

Product Selection

Solution Site

Product Selection

Solution Site

Advantech Computer on Module series includes the COM-HPC,
COM-Express, SMARC, ETX, and Qseven, offering professional
design-in services to help customers reduce time to market byless efforts.

Advantech Embedded Single Board Computer series includes afull selection of small, rugged, reliable computing platforms from
2.5“ Pico-ITX, 3.5" SBC, PC/104, to 5.25" EBX boards, apartfrom a variety of MIOe I/O Expansion Cards that are designed toaccelerate domain-specific development.

Advantech industrial motherboard series, ranging fromUTX motherboards, Mini-ITX motherboard and Micro ATX
motherboard, is ideal for customers who are used to using
commercial off-the-shelf products but require expansion andindustrial features such as longevity and reliability.

Arm-Based Computing Platforms

In Advantech Arm-based product offerings, we are dedicated todeveloping various Arm SoC-based products by standard form
factor, including Qseven, SMARC, RTX, 2.5” and 3.5” SBC; andthrough AIM-Linux and AIM-Android to provide an agile softwaredevelopment package.

Embedded Computers

Advantech Embedded PCs (EPC) are a full range enclosuresand systems designed for 2.5” and 3.5“ single board computers
and Mini-ITX motherboards for both x86 and Arm-based
platform, featuring optimized mechanical design and flexible
I/O interface options, assuring maximum flexibility for quick
integration.
*Part of services in this publication are optional offerings,
please contact Advantech for further information.

Product Selection

Find More Product Information Online

50

Embedded Core Design-In Services
As a pioneer and leader in the embedded market,
Advantech offers a one-stop service to integrate
embedded boards, software, and peripherals withcustomer-centric design-in services for a variety
of industries. Engaging with Advantech can savedecision making and provide real-time service
around the world.
View MoreRegional Service & Customization Centers
China Kunshan

Taiwan86-512-5777-5666

Worldwide Offices
Greater China
China
Toll Free
BeijingShanghai
Shenzhen
ChengduHong Kong

800-810-0345
86-10-6298-4346
86-21-3632-1616
86-755-8212-4222
86-28-8545-0198
852-2720-5118

TaiwanToll Free
0800-777-111
Taipei & IoT Campus 886-2-2792-7818
Taichung
886-4-2372-5058
Kaohsiung886-7-392-3600

Middle East and Africa
Israel072-2410527

Taipei
886-2-2792-7818

Netherlands Eindhoven

31-40-267-7000

Warsaw00800-2426-8080

EuropeAsia

Japan
Toll Free
Tokyo
Osaka
NagoyaPoland0800-500-1055
81-3-6802-1021
81-6-6267-1887
81-0800-500-1055

Netherlands
EindhovenBreda

31-40-267-7000
31-76-523-3100
00800-2426-8080/81
49-89-12599-0
49-2103-97-855-0

Korea
Toll Free
Seoul

080-363-9494/5
82-2-3660-9255

Germany
Toll Free
MunichDüsseldorf

Singapore
Singapore

65-6442-1000

FranceParis33-1-4119-4666

Malaysia
Kuala Lumpur
Penang60-3-7725-4188
60-4-537-9188

Italy
Milan

39-02-9544-961

Thailand
Bangkok

66-02-2488306-9

Newcastle
LondonVietnamHanoi

84-24-3399-1155

Spain
Madrid34-91-668-86-76

Indonesia
Jakarta

62-21-751-1939

SwedenStockholm

46-0-864-60-500

PolandWarsaw

48-22-31-51-100

Australia
Toll Free
Melbourne

1300-308-531
61-3-9797-0100

India
BangalorePune

91-80-2545-0206
91-94-2260-2349

UK
44-0-191-262-4844
44-0-870-493-1433

RussiaMoscow
St. Petersburg

USA

Milpitas, CA
1-408-519-3898

8-800-555-01-50
7-812-332-5727;
7-921-575-1359

Czech RepublicÚstí nad Orlicí420-465-524-421

IrelandGalway353-91-792444

AmericasNorth America
Toll Free
Cincinnati
Milpitas
IrvineOttawa1-888-576-9668
1-513-742-8895
1-408-519-3898
1-949-420-2500
1-815-433-5100

BrazilToll Free
São Paulo

0800-770-5355
55-11-5592-5367

MexicoToll Free
Mexico City

1-800-467-2415
52-55-6275-2727

www.advantech.com

Please verify specifications before ordering. This guide is intended for reference purposes only.
All product specifications are subject to change without notice.
No part of this publication may be reproduced in any form or by any means, electronic, photocopying,recording or otherwise, without prior written permission of the publisher.
All brand and product names are trademarks or registered trademarks of their respective companies.
© Advantech Co., Ltd. 2020

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