General

JERG-2-200-TP001

Template for Electrical Design Criteria
for Scientific Spacecraft

May 16, 2017

Japan Aerospace Exploration Agency

JERG-2-200-TP001

This is an English Version of JREG-2-200-TP001. Whenever there is anything ambiguous in thisdocument, the original document (the Japanese version) shall be used to clarify the intent of therequirement.

Disclaimer
The information contained herein is for general informational purposes only. JAXA makes nowarranty, express or implied, including as to the accuracy, usefulness or timeliness of any information
herein. JAXA will not be liable for any losses relating to the use of the information.

Published by
Japan Aerospace Exploration Agency
Safety and Mission Assurance Department
2-1-1 Sengen Tsukuba-shi, lbaraki 305-8505, Japan

JERG-2-200-TP001

1.
2

Scope............................................................................................................................................. 1
Related Documents ....................................................................................................................... 1
2.1
Applicable Documents .......................................................................................................... 1
2.2
Reference Documents ........................................................................................................... 2
3
Definitions and Abbreviated Terms .............................................................................................. 3
3.1
Definitions ............................................................................................................................ 3
3.2
Abbreviations ........................................................................................................................ 5
4 Common design requirements ........................................................................................................... 6
4.1
Electrical interfaces ............................................................................................................... 6
4.1.1
Signal interface ............................................................................................................. 8
4.1.1.1 Overview ................................................................................................................... 8
4.1.1.2 Interface Requirements ............................................................................................. 8
4.1.1.3 Signal interface between equipment ......................................................................... 9
4.1.1.3.1
Digital signal interface ......................................................................................94.1.1.3.2
Analog signal ..................................................................................................194.1.1.4 External interface .................................................................................................... 21
4.1.2
Power supply interface ................................................................................................ 22
4.1.2.1 Overview ..................................................................................................................... 22
4.1.2.2.1
Primary power supply bus ..............................................................................23
4.1.2.2.2
N/A ................................................................................................................. 26
4.1.2.2.3
N/A ................................................................................................................. 26
4.1.2.2.4
N/A ................................................................................................................. 26
4.1.2.2.5
Transient characteristics of primary power supply bus...................................26
4.1.2.2.6
ODC (Ordnance Controller) Bus ....................................................................28
4.1.2.2.7
Heater interface ...............................................................................................28
4.1.2.2.8
N/A ................................................................................................................. 31
4.1.2.3 Requirements for onboard equipment ..................................................................... 31
4.1.2.3.1
Input impedance..............................................................................................31
4.1.2.3.2
Maximum input current .................................................................................. 31
4.1.2.3.3
Inrush current .................................................................................................. 31
4.1.2.3.4
The rate of current change ..............................................................................33
4.1.2.3.5
Voltage at input port ........................................................................................ 33
4.1.2.3.6
Power supply line filter ...................................................................................33
4.1.2.3.7
Power-on reset circuit ..................................................................................... 34
4.1.2.3.8
Interconnection between equipment with return of secondary power supply . 34
4.1.2.3.9
Emergency power off ......................................................................................36
4.1.2.3.10 Power supply for relay drive ...........................................................................36
4.1.2.3.11 Power supply for heaters................................................................................. 36
4.1.2.3.12 Continuous power supply ............................................................................... 37
4.1.2.4 Power supply return ................................................................................................ 38
4.1.2.5 Grounding and shield .............................................................................................. 38
4.1.2.6 Protection against overcurrent................................................................................. 40i

JERG-2-200-TP001

4.1.3
High-voltage circuit .................................................................................................... 41
4.2
Commands .......................................................................................................................... 42
4.2.1
General requirements for commands .......................................................................... 42
4.2.2
Types of commands .................................................................................................... 43
4.3
HK data ............................................................................................................................... 45
4.3.1
General requirements for HK data (telemetry) ........................................................... 45
4.3.2
Types of telemetries .................................................................................................... 45
4.4
Data processing margin ....................................................................................................... 47
4.5 Design Requirements for Test and Verification ........................................................................ 48
4.6 Electric Integration Design ....................................................................................................... 48
4.6.1
Wire Harness ............................................................................................................... 48
4.6.1.1 Classifications by Signal Types and Separations of Wire Harness ......................... 49
4.6.1.2 Selections of Wire Materials ................................................................................... 50
4.6.1.2.1
Rated Currents of Wire Harness .....................................................................51
4.6.1.2.2
Precautions when using the fluorine-coated wire ...........................................53
4.6.1.2.3
Wire rods for electrical instrumentation cables connecting equipment .......... 53
4.6.1.3 Wiring Methods ...................................................................................................... 54
4.6.1.4 Electric Power Harness ........................................................................................... 55
4.6.1.5 Wire Splicing .......................................................................................................... 55
4.6.1.6 Fixing of Wires ....................................................................................................... 56
4.6.2
Connectors .................................................................................................................. 56
4.6.2.1 Classification by Signal Types ................................................................................ 56
4.6.2.2 Selections of Connectors ......................................................................................... 56
4.6.2.3 Usage of Connector................................................................................................. 56
4.6.2.4 Junction Terminals .................................................................................................. 59
4.6.2.5 Exposed Printed circuit boards ............................................................................... 59
4.6.3.1.3 Double insulation .................................................................................................63
4.6.3.2 External interface .................................................................................................... 64
4.6.3.2.2
Other external interfaces .................................................................................65
4.6.3.3 Antistatics2 .............................................................................................................. 66
4.6.4
Electric discharge prevention in low vacuum environments ..................................... 66
4.6.5
Items to be considered for High Voltages ................................................................... 66
4.6.6
Protection of power supply bus ................................................................................... 67
4.6.6.1 Protection by fuse ...................................................................................................67
4.6.6.2 Protection by current limiter ................................................................................... 68
4.6.6.3 Load separation ....................................................................................................... 68
4.7
Matters to be considered about ordnances and non explosive actuators ............................. 69
4.7.1
Safety requirements..................................................................................................... 69
4.7.2
Characteristics of EEDs .............................................................................................. 69
4.7.3 Ignition control of ordnances .......................................................................................... 69
4.7.4 Drive control of the non explosive actuator ....................................................................... 70
4.8
Matters to be considered about failure ................................................................................ 71
4.8.1
Derating....................................................................................................................... 71
4.8.2
Separation of continuous power supply circuit ........................................................... 71
4.8.3
Considerations about the use of capacitors ................................................................. 72
4.8.4
Consideration about the use of ferrite beads ............................................................... 73

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JERG-2-200-TP001

5

Individual design requirements ................................................................................................... 73
5.1
Electric power ..................................................................................................................... 73
5.1.1
Scope ........................................................................................................................... 73
5.1.2
Requirements and income/outgo regarding electric power ......................................... 73
5.1.3
Matters to be considered about failure ........................................................................ 74
5.1.3.1 Redundant design .................................................................................................... 75
5.1.3.2 Battery protection.................................................................................................... 75
5.1.4
N/A.............................................................................................................................. 75
5.1.5
N/A.............................................................................................................................. 75
5.1.6
N/A.............................................................................................................................. 75
5.1.7
Wiring and protection ................................................................................................. 75
5.1.7.1 Fundamentals .......................................................................................................... 75
5.2
EMC .................................................................................................................................... 76
5.2.1
System integration design ........................................................................................... 76
5.2.1.1 Grounding and wiring design .................................................................................. 76
5.2.1.1.1 Grounding/Insulation diagram ......................................................................................... 76
5.2.4.2 Test requirements for EMC ......................................................................................... 90
5.2.4.2.1 LISN.....................................................................................................................90
5.3
RF system ........................................................................................................................... 91
5.4
Optical system..................................................................................................................... 91
6
Verification method..................................................................................................................... 92
Appendix A (informative): Outline of the electrical design criteria template for scientific spacecrafts,
etc. ....................................................................................................................................................... 94
A.1 Objectives of this template ....................................................................................................... 94
A.2: About the requirement descriptions in the design standard (Where is the requirement written?)........................................................................................................................................................ 94iii

JERG-2-200-TP001

This “Template for Electrical Design Criteria for Scientific Spacecraft” (hereinafter referred to“design criteria template” or just “templates”) is a requirements document applied to electricaldesign of the spacecraft systems developed by JAXA, which covers both common requirements not
only for electrical interfaces but also and the like applied according to the applicable document (5) in
2.1 and fundamental electrical design requirements regarding electric power and EMC. For
communication and data processing, this design criteria template is applicable to the function andinterface to interconvert logical data and electrical signals concerning HK data/commands.
This template does not cover electric power generation and storage, because they are addressed in a
separate design standard and not in the applicable document (5).
Projects shall define own electrical design criteria which incorporates these aspects referring to therelevant design standards described above.
Note that this template includes requirements which are not in the applicable document (5). They areadded after deliberating the information of the former Design Criteria for Scientific Spacecrafts(JERG-2-020) and the design criteria of the past scientific spacecraft projects.
Where this template does not specify numerical values, it is intended that projects specify them intheir electrical design criteria. The table of contents of this template is compliant to the one of JERG2-200A “Electrical design standard” as its upper applicable document, in order to enhance
traceability. The structure of this template is consistent with that of the superordinate document, butsome requirements are described as “N/A”, because they are not appropriate to be included in thistemplate. On the other hand, there are some added requirements in the template as explained above.
When the superordinate document is revised, the clause numbers of this template shall also be
revised accordingly.

2.1

Applicable Documents

The following documents are applied within the scope called for by this template. When
any inconsistency is found, report to the Secretariat of JAXA Standards or a relevant
standard working group. Unless otherwise specified in the applicable documents, thistemplate takes precedence. The latest version of applicable documents shall be used.

(1) JMR-001 System Safety Standard(2) JMR-002 Rocket Payload Safety Standard(3) JERG-0-041 Space-purpose Electric Wiring Stage Standard(4) JERG-2-143 Radiation Design Standard(5) JERG-2-200 Electrical Design Standard(6) JERG-2-211 Charge/Discharge Design Standard
1

JERG-2-200-TP001(7) JERG-2-212 Wire Derating Design Standard(8) JERG-2-213 Insulation Design Standard(9) JERG-2-214 Power Supply System Design Standard(10) JERG-2-215

Solar Cell Paddle Design Standard(11) JERG-2-241 EMC Design Standard(12) ISO15389 Space systems - Flight-to-ground umbilicals(13) CRA-99004 Shinraisei Gijutsu Jouhou (Alert: JERS-1 Wire Harness anomaly)
2.2

Reference Documents
Reference documents relating to this template are as follows:(1) ANSI/TIA/EIA-422-B-1994
Electrical Characteristics of Balanced Voltage Digital Interface Circuit(2) MIL-STD-1553B
Digital Time Division Command/Response Multiplex Data Bus(3) MIL-HDBK-83575
GENERAL HANDBOOK FOR SPACE VEHICLE WIRING HARNESS DESIGNAND TESTING(4) JERG-2-400 Communication Design Standard(5) DOD-E-8983C
Electronic Equipment, Aerospace, Extended Space Environment, GeneralSpecification for(6) JAXA-QTS-2060D
Connector Common Specification(7) SAE-AS50881
WIRING, AEROSPACE VEHICLE(8) MIL-W-16878/4
WIRE, ELECTRICAL, POLYTETRAFLUOROETHYLENE (PTFE) INSULATED,
200 DEG. C, 600 VOLTS, EXTRUDED INSULATION(9) MIL-HDBK-4001
ELECTRICAL GROUNDING ARCHITECTURE FOR UNMANNEDSPACECRAFT(10) MIL-STD-464A
ELECTROMAGNETIC ENVIROMENTAL EFFECTS REQUIREMENTS FOR
SYSTEMS(11) NASA-HDBK-4002
AVOIDING PROBLEMS CAUSED BY SPACECRAFT ON-ORBIT INTERNALCHARGING EFFECTS(12) NASA Technical Paper 2361
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JERG-2-200-TP001
DESIGN GUIDELINES FOR ASSESSING AND CONTROLLING SPACECRAFTCHARGING EFFECTS(13) MIL-STD-1686C
ELECTROSTATIC DISCHARGE CONTROL PROGRAM FOR PROTECTION OF
ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT(EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES)(14) JIS C 0617 Graphical symbols for diagram(15) ISO/TC20/SC14 International Spacecraft Specifications(a) ISO/DIS 24637 Electromagnetic interference (EMI) test reporting requirements(b) ISO/CD 26871 Pyrotechnics(c) ISO 14621-1 EEE parts – Parts Management(d) ISO 14621-2 EEE parts – Control program requirement(e) ISO 15389 Flight-to-ground umbilical(16) ISO14302 Electromagnetic compatibility requirements(17) JERG-2-200-TM001 Example of signal interface(18) JERG-2-200-TM002 High Speed Data Interface Application Notes(19) JEITA ED-5007 Consolidated High Supply Voltage CMOS interface(20) MIL-STD-461C Requirements for the control of electromagnetic interference characteristics
of subsystems and equipment（To use Version D or later, carefully examine their requirements because they are drasticallychanged)(21) MIL-STD-462C Measurement of electromagnetic interference characteristics（To use Version D or later, carefully examine their requirements because they are drasticallychanged)(22) MIL-STD-1541 Electromagnetic compatibility(23) EEE-INST-002 Instructions for EEE Parts Selection, Screening, Qualification, and Derating(24) NSI/TIA/EIA-644-A-2001, Electrical Characteristics of Low Voltage Differential
Signaling (LVDS) Interface Circuits(25) Telemetry Command Design Criteria for Scientific Spacecraft (To be issued in 2017)(26) Spacecraft SpW User’s Manual (of each Project)

3.1

Definitions
Definitions of terms in this template are as follows:(1) System
A spacecraft unless specified.
(2) Sub-system
A part of a larger system, divided according to functions.
(3) Power system
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JERG-2-200-TP001
A subsystem capable of handling power generation, power control, power storage, and power
distribution (except for power supply harnesses to load equipment) functions, not necessarily"power system = solar cell paddle system + power source system".
(4) Primary power supply
A power source that is generated and controlled by the power system of a spacecraft andcommonly distributed to the load equipment installed in the spacecraft. (A power source is asecondary power supply when the electric power is stepped up or stepped down from a
primary power supply bus within the power system and commonly distributed to the loadequipment in the spacecraft).
(5) Secondary power supply
A power source that is stepped up or down from a primary power supply bus inside or outside
a power system of a spacecraft.
(6) Unregulated bus
A power bus for commonly and directly distributing power from the battery to each loadequipment in the spacecraft.
(7) ODC bus
A power supply bus to distribute electric power exclusively for ordnance ignition.
(8) HK data
Data indicative of an operating condition and status of onboard equipment.
(9) Payload data or mission data
Observation data and such acquired by the payload.
(10) Telemetry
A remote communication of HK data and payload data.
(11) Command
A directive transmitted from a ground station to a spacecraft or a directive produced or
executed by the spacecraft.
(12) Telecommand
A remote communication of a command.
(13) Interruption/Momentary Interruption
Interruption means that either a power supply voltage or a supplied current becomes zero, andis not restored.
Momentary interruption means that either a power supply voltage or a supplied current
becomes zero, but is restored.
(14) Hazard
Human injury; physical damage to public property, private property of a third party, a system,
launch site facility, etc.; and environmental effects.
(15) Hazardous
A hazard potential.
(16) Damage
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JERG-2-200-TP001
A loss of function.
(17) Transmission path
A driver, a connector, a harness, a receiver, and such.
(18) Array circuit
A solar array connected in a parallel mode in correspondence with one shunt device.
(19) Autonomization function
The function which allows the spacecraft to constantly monitors own telemetry, judge
whether its value exceeds the prescribed value, and issue necessary commands. Also calledautonomous function.
3.2

Abbreviations
Abbreviations related to this design standard template are given as follows:
AC

Alternative Current

BTS

Battery Test Simulator

CMD

CoMmanD

DC

Direct Current

DH

Data Handling

EEDElectro Explosive Device

EMC

Electro-Magnetic
Compatibility

EMI

Electro-Magnetic Interference

ETFE

Ethylene TetraFluoroEthylene

FDIR

Failure Detection, Isolation
and Reconfiguration

FG

Frame Ground

FMEA

Failure Mode Effect Analysis

HCE

Heater Control Electronics

HK

House Keeping

LETLine Energy Transfer

LISN

Line Impedance Simulation

Spacecraft monitoring

Network
MD

Manual Disconnect

MLI

Multi Layer Insulation

NEA

Non Explosive Actuator

ODC

OrDnance Controller

PBT

PolyButylene Terephthalate

PSU

Power Supply Unit

PTFE

PolyTetraFluoroEthylene

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JERG-2-200-TP001
PWM

Pulse Width Modulation

RD

Remote Disconnect

RFRadio Frequency

RTN

ReTurNSAS

Solar Array Simulator

SG

Signal Ground

SMU

Spacecraft Management Unit

TLM

TeLeMetryTN

Turn OnUPG

Uni Point Ground

UMB

Umbilical Connector

4.1 Electrical interfaces
This clause specifies the requirements on electrical interfaces described below within spacecraft
as well as between spacecraft and external equipment.
(1) Power supply interface
Interfaces at equipment with the power supply of the system.
The non-regulated primary bus power supply obtained from solar cell and batteries (hereinafterreferred to as “bus power supply”) are fed to each equipment by the power supply distribution
equipment (DIST) and used in each equipment after conversion and stabilization to thenecessary voltages by secondary power supply units. The secondary power supply is sometimes
fed to each equipment from the converter unit (Power Supply Unit: PSU) outside theequipment.
(2) Command/telemetry interface
Command/telemetry interfaces of equipment
Note: A scientific spacecraft is sometimes provided with a SpaceWire (SpW) interface, and may
interface through it. The communication system devices, attitude sensors and other equipmentthat only have limited commands/telemetries shall be connected to an equipment with a SpW
indirectly interfacing with a SpW. As for the details of the SpW interface, refer to documents“the Spacecraft SpW user manual” and “the design standard of telemetry commands”.

6

JERG-2-200-TP001(3) Passive analog/active analog interface
Interfaces to measure the analog signals of the equipment without SpW.
Ex. 1: The passive analog signals of thermal sensors and such interface with HCE or HK
equipment.
Ex. 2: After A/D conversion, the active analog data are output to SMU via the equipment with a
SpW.
(4) Heater control interface
The collective term for heater control circuits, temperature measurement circuits for heater
control, and interface circuits for other equipment.
Ex.: The heater to maintain the operating temperature range of an equipment onboard on ascientific spacecraft shall be controlled by HCE. The special heater for controlling thetemperatures of the limited hardware items inside the equipment shall be controlled individuallyby the equipment.
(5) Hold/Release Mechanism Control Interface with Pyrotechnics/Non- pyrotechnics.
The interface to control driving of the hold/release mechanism using pyrotechnics or nonpyrotechnics devices.
(6) External interface of spacecraftInterfaces to access inside the spacecraft from outside for system tests and launch site
operations. The interfaces have the following three functions.

[1] UMB connector
The interface to connect the spacecraft to the ground system with wires until immediately
before the launch. (The interface is separated at the launch.)[2] MD connector
The interface to connect the spacecraft to the ground system for system tests and launch site
operations. (It is not usable after the spacecraft is mounted on a rocket.)[3] TN connector
The separate interface er forconnect the circuits,etc at the groud test.spacecraft It should be
used with attached for the launch.
(7) Signal interface between equipment
This is the generic name for the signal interface between equipment.

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JERG-2-200-TP001
4.1.1

Signal interface

4.1.1.1 Overview
Signals handled in spacecraft operations are classified into 1) signals of mission data acquired by
payloads to achieve the purposes of the spacecraft and 2) signals of housekeeping (HK) data and 3)
command data for spacecraft operations (monitor and control).
Interface points of signals are present among equipment which handle these signals or among
onboard equipment. Generally speaking, these interfaces are provided with connectors for exclusive
use of designated harnesses. Figure 4.1-1 is a conceptual diagram of signal interfaces.
In the diagram, wide solid lines indicate paths for the signals of the payloads, narrow solid lines
represent paths for the HK data and the command signals for the operations of the spacecraft, anddotted lines show paths for connections with respect to a ground station. This conceptual diagram (anexample) shall be replaced with the official diagram by the project.
Interface Point

Interface Point
Telemetry/
Telecommand
Antenna andTransmitter/
ReceiverOnboardCommunication/
Data Processing
SystemEquipment

AtmosphericTransmission

RelatedBus/
Subsystem

AtmosphericTransmission

Interface Point

Interface Point
Telemetry/
Telecommand
GroundEquipment

PayloadGroundEquipment

Display

 Payload Signal:
 Telemetry/Telecommand Signal:
 HK/Command Signal:

Telemetry/Telecommand System

PayloadAntenna andTransmitter/
Receiver

PayloadEquipment

Related Subsystem/

Payload System

Figure 4-1 Signal Interface Conceptual Diagram

4.1.1.2 Interface Requirements(1) For an interface signal, the characteristics of input and output signals (e.g.,connecting harness, groundings on input side and output side, characteristic
impedances, and influences of EMC) shall be in compliance(2) The number of interface circuits types shall be minimized by utilizing the signal
interface types shown in this design standard template to the extent possible and use
corresponding standard interface circuits.
(3) Both the function and performance of onboard equipment shall not be damaged even
8

JERG-2-200-TP001
if a signal is input when a power supply is turned OFF.
(4) Onboard equipment shall not fail or be damaged even if an undefined command is
input when a power supply is turned ON.
(5) A signal interface circuit shall not be damaged and shall not cause a secondary failure
even if adjoining signals come in contact. If it is difficult to meet this requirement
due to resource constraints and such, clause 4.1.1.3 shall be applied.
(6) If a transmission paths consist of a primary and secondary path, any one of thefollowing conditions shall be satisfied.
(a)A failure occurring in one path shall not have an adverse influence on the other path
between primary and secondary transmission paths.
(b)When the failure in one path has an adverse influence on the other path, a proper
function shall be provided outside the transmission path to preserve transmissionfunction.

4.1.1.3 Signal interface between equipment
4.1.1.3.1

Digital signal interface

The digital signal interfaces between equipment shall be the interfaces shown in Table 4-1, except for
the interfaces between the sensor and the sensor signal processing circuit.

Table 4-1 Digital Signal interfaces between equipment
SignalInput Side

Recommended

Use of Secondary Power

SignalSupplyFrequency(Hz)DigitalCircuitSpec (Element

Type

Type)

Pulse

Mechanical(*)
CommonIndividual

DC

YES

YES

Opto-isolator

DC

YES

YES

Comparator

DC

YES

YES

DC～65kYES

NO

65k～600k

YES

YES

Relay

SignalBi-levelwith MUXSingle end

C-MOS（4050/4049）

Differential

EIA(RS)-422A
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JERG-2-200-TP001(Low Power)（incl. HS26C32）

Differential

600k～10M

YES

YES

10M～

YES

YES

(Standard)
Differential

ANSI/TIA/EIA-（Hi-Speed）

644-A (incl.
DS90C32）* Shows the applicability of the circuit types depending on the case that interfacing circuits havethe same (common) secondary converters or the case with different (individual) secondary
converters.

(1) Pulse signal interface
The pulse signal interface is used for outputting commands to the onboard equipment via thededicated line. It is used for transmitting very slow signals including the pulse to drive thelatching relay for turning on and off the equipment. Thus, recommended signal frequency is
DC. Because commands are usually exchanged between the equipment having different returns,
both HOT and RTN signal lines on the received side are not grounded.
A.

As for the relay interface, the command issuance side directly drives the relay on the
onboard equipment side. An example of the interface circuit is shown in Fig.4-2.

Relay

Fig.4-2 Relay interface circuit
B.

Regarding the photo-coupler interface, the onboard equipment receives pulse signals withthe photo coupler, and generates the driving power of the relay under its own power. An
example of the interface circuit is shown in Fig. 4-3.

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JERG-2-200-TP001

Fig. 4-3 Photo-coupler interface circuit(2) Bi-level signal interface
The bi-level signal interface is used for collecting the low frequency of state change is low by
the dedicated line. Since the on-board processor for collecting telemetry (or the equipment in
the upstream of the onboard equipment) usually reads out many channels serially by themultiplexer, the recommended signal frequency is DC.
A.

The active bi-level signal interface transmits and detects the predetermined binary (twovalued) voltage that is output by the onboard equipment. It is used for transmitting theon/off status, etc. of the onboard equipment and their internal circuits. An example of theinterface circuit is shown in Fig. 4-4.

Fig. 4-4 Active bi-level signal interface circuit

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JERG-2-200-TP001
B.

The passive bi-level signal interface detects the open/close status of the no-voltage
contact(s) in the onboard equipment. It is used for the open/close status of switches in the
onboard equipment, etc. An example of the interface circuit is shown in Fig. 4-5.

Fig. 4-5 Passive bi-level signal interface circuit(3) Single-end digital signal interface
The single-end digital signal interface is a C-MOS interface using a +3.3 V or +5 V power
supply. It shall not be used between the equipment with different returns (grounds). As for theinterface between equipment by C-MOS, the element without the input protection diode for the
power supply side shall be used for the input circuit. This is intended to prevent an input signal
from flowing into the power supply via the input protection diode of C-MOS when power isoff, causing the C-MOS at the subsequent stage to malfunction. Specifically, use the standard
logic 4050/4049. However, since 4049 has less noise margin than 4050, it is recommendable touse 4050. Furthermore, although the interface is also defined for the case where the other side is
the TTL device, it shall not be used unless it is unavoidable (from the viewpoint of current routeand noise margin).
A. Interface circuit
Any of the single-end digital signal interface circuits shown in Table 4-2 (A) to (G) or the circuitcompatible with those shall be used. When power supply voltage of the output side element is+3.3 V, it is desirable to use a +3.3 V system for the input side element as well in order to keep a12

JERG-2-200-TP001
sufficient margin between the output voltage and the input threshold.
B. Output signal level(1) +3.3 V system (based on the JEITA ED-5007 “Unified wide power supply voltage
range CMOS DC interface standard for non-terminated digital integrated circuits”)• High level: 0.7Vdd~Vdd +0.3 (Vdd = +3.3V power source voltage at input connector,
relative to signal GND voltage at input)• Low level: 0.3 ~ 0.3Vdd (relative to signal GND voltage at input)(2) +5 V system• High level: (Vdd  0.5) ~ Vdd (Vdd = +5V power source voltage at input connector)• Low level: (Vss  0.3) ~ Vss + 0.3 (Vss = signal GND voltage at input connector)

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JERG-2-200-TP001

Table 4-2 Single-end digital signal interface(Between the equipment using the common secondary power supply converter)

Shall not be
usedNote 1: signal GND.

Note 2: Recommended capacitor capacity, resistance *:220 pF, **: 10KΩ.
(4) Low power differential digital signal interface
This is used for the digital signal interface between the equipment under the following
conditions.
•It is not possible to directly connect the secondary power supply converters return
because different secondary power supply converters are used.
14

JERG-2-200-TP001•The interface signal is within the range of 65 kHz ~ 600 kHz.
A. Interface circuit
The interface circuit is shown in Fig. 4-6. In order to prevent widespread failure in thesubstrate when the failure of any element/device occurs, the power supply on the output
side and input side shall be unified to the same voltage system (+3.3 V system or +5 V
system).
B. Interface conditions(1) Line driver/receiver: EIA (RS)-422A Compatible(2) Output signal level: “1” VAB < -1.0V“0” VAB > +1.0V, VAB ＝point A-pointB(3) Terminal type: Source Termination(4) Current limit resistor: 33Ω (Nominal)(5) Input protection resistor: 511Ω (Nominal)(6) Electrical transmission cable: twisted pair shield wires(7) Length of electrical instrumentation cable: 10m or lessFig. 4-6 Low power differential digital signal interface (EIA (RS)–422A, low power type)The above method of connecting to the ground reference point of the shield ground in the differential
interface is different from the method described in the reference document (17) JERG-2-200TM002. However, the present method is adopted from the viewpoint of EMC (that the signal
grounds that use different secondary power supplies shall not be connected).

15

JERG-2-200-TP001(5) Standard differential digital signal interface
This is used for the digital signal interface between the equipment under the following
conditions.
•It is not possible to directly connect the secondary power supply return because different
secondary power supply converters are used.
•The interface signal is within the range of 600 kHz ~ 10 MHz.
(Regarding the use at 10 MHz or higher, adjustment shall be coordinated with the person
in charge of the system.)
A. Interface circuit
The interface circuit is shown in Fig. 4-7. In order to prevent widespread failure in thesubstrate when the failure of any element/device occurs, the power supply on the output
side and input side shall be unified to the same voltage system (+3.3 V system or +5 V
system).
B. Interface conditions(1) Line driver/receiver: EIA(RS)-422A Compatible(2) Output signal level: “1” VAB < -1.0V“0” VAB < +1.0V, VAB =Point A- Point B(3) Terminal type: Shunt Termination(4) Terminal resistor: 100Ω (Nominal)(5) Input resistor: 160Ω (Nominal)(6) Current Limit resistor: 33Ω (Nominal)(7) Pull up or Pull-down resistor: 2kΩ (Nominal)(8) Electrical transmission cable: Twisted pair shield wires

Fig. 4-7 Standard differential digital signal interface (EIA (RS)–422A, standard type): In thecase where the level determination circuit (the so-called fail safe, etc.) is not installed in thereceiver IC.

16

JERG-2-200-TP001

Fig. 4-8 Standard differential digital signal interface (EIA (RS)–422A, standard type): In thecase where the level determination circuit (the so-called fail safe, etc.) is installed in thereceiver IC.
The above method of connecting to the ground reference point of the shield ground in the differential
interface is different from the method described in the reference document (17) JERG-2-200-TM002.
However, the present method is adopted from the viewpoint of EMC (that the signal grounds that use
different secondary power supplies shall not be connected).
(6) High-speed differential digital signal interface
This is used for the digital signal interface between the equipment under the following
conditions.
• It is not possible to connect the secondary power supply return because different secondary
power supply converters are used.
• The interface signal is 10 MHz or higher.
(Regarding the maximum frequency, adjustment shall be coordinated with the person in
charge of the system.)
A.

Interface circuit
The interface circuit is shown in Fig. 4-9. The interface circuit of the SpaceWire
network that uses LVDS as the physical layer is shown in Fig.4-10. For theprocessing of unused/unconnected pins, the method recommended by the parts
manufacturers providing data sheet, etc. shall be followed. Specifically, even as forthe elements/devices where the unconnected state is not prohibited, take measures to
fix the level, because there are cases where the output varies/oscillates due toinduction from the surrounding environment. Also, in order to prevent the common
mode voltage between the transmission side and reception side from exceeding the17

JERG-2-200-TP001
absolute maximum rating of the elements/devices, control the ground voltage of bothsubstrates.
B.

Interface condition(1) Line driver / receiver ：TIA/EIA－644A compatible(2) Output Signal Level ：“1” VAB < -100 mV：“0” VAB > +100 mV, VAB= point A－Point B(3) Terminal Type ：Shunt Termination(4) Terminal Resistance ：100 Ω (Nominal)(5) Instrumentation Cables ：Twisted Pair Shield Wire

Fig. 4-9 High-speed differential digital signal interface (TIA/EIA – 644A, standard type) In orderto prevent the common mode voltage between both elements/devices from exceeding the absolute
maximum rating of the elements/devices, control the ground voltage of both substrates.
The above method of connecting to the ground reference point of the shield ground in the differential
interface is different from the method described in the reference document (17) JERG-2-200TM002. However, the present method is adopted from the viewpoint of EMC (that the signal
grounds that use different secondary power supplies shall not be connected).

18

JERG-2-200-TP001

Fig. 4-10 SpaceWire interface circuit
4.1.1.3.2

Analog signal

This clause shows the handling of the analog signals used between the system and the subsystemand between subsystems in a spacecraft. Addition/correction/deletion shall be made in the
project as needed.
The details of the analog signal interface except for the following items shall be specified
individually by the ICD of each equipment.
(1) Active analog interface
This interface where the on-board processor for collecting telemetry (or the equipment in the
upstream of the onboard equipment), with the output voltage from the onboard equipment,
performs A/D conversion. It is used for monitoring the secondary voltage and sensor output inthe onboard equipment, etc.

19

JERG-2-200-TP001

TLM Signal(Equipment)

Differential Signal(+)

Differential Signal(-)

Fig. 4-11 Active analog interface circuit(To be replaced with the official version by the project)(2) Passive analog interface
The interface where the on-board processor for collecting telemetry (or the equipment in the
upstream of the onboard equipment), with current supplied to the resistor in the onboard
equipment, performs A/D conversion. It is used for monitoring temperature with athermistor or platinum sensor, etc.

Temperature
SensorFig. 4-12 Passive analog interface circuit (temperature)(This diagram shall be replaced with the official version by the project)

20

JERG-2-200-TP001
4.1.1.4 External interface
The following interfaces are used in scientific spacecrafts.
(1) Umbilical (UMB) interface
From just before launch until launch, it connects with wires the signals that are required to beconnected to outside the spacecraft (ground systems and rockets).
The equipment that outputs signals from the UMB connector to outside the spacecraft shall havean interface that can turn on/off the output signals by the control signal output from the groundcontrol system with wires. (When pulling out the UMB connector, turn off the monitor from theground control system, so that voltage is not applied to the pins of the UMB connector.)
The protection resistor to shield from short circuits between pins or ground faults shall be inserted
since the mating surfaces are exposed after separation.
An example of the signal interface of MONI ON/OFF is shown in Fig. 4-13. In addition to themethod described in Fig. 4-13, MONI can be turned off by turning off the power of the output
device.
It is not acceptable to set the output at a high impedance while the power supply of the device isturned on.
This is to prevent secondary failures of other elements when an abnormal short circuit has
occurred on the output pin and the device is damaged.
(2) MD connector interface
A signal interface required to be connected to the ground system with wires for system tests.
The interface using this connector shall be specified individually by each project.
(3) TN connector interface
Each project shall define this clause after considering the necessity from the viewpoints ofsafety design, testability, maintainability of onboard equipment, etc. Each project shall identify
installation locations with consideration of electrical viewpoint and accessibility.
A signal interface to be connected as a regular circuit only at the time of launch, with apyrotechnic, power supply, etc.
Separation and connection of signals shall be performed by dismounting/mounting of the TN
connector. The interface of a TN connector shall be coordinated individually including the useof the TN connector itself.

Examples of the TN connector are shown below.
21

JERG-2-200-TP001•TN-SC: Separation of the solar array output line in a test
•TN-BAT: Separation of the battery line in a test, and insertion of the fuse in a test
•TN-RCS: Separation from the drive circuit on the spacecraft side for connecting the
propulsion system control signal line and the ground test equipment•TN-IG: Separation of the line between pyrotechnics from the power supply for the igniter•TN-NEA: Separation of the line between NEAs from the NEA drive unit
•TN-NEBAT: Separation of the power supply for NEAs and the NEA drive unit

The contacts of the relay areopen except by pressing the on
or off switch.
The power supply floats against satellite

Fig. 4-13 example of RD MONI ON/OFF interface
4.1.2

Power supply interface

4.1.2.1 Overview
The requirements for power supply interface of the spacecraft shall include the distribution function
from the power generation function to the input interface point of the loading equipment. In thisstandard design, the output interface points of the power supply and the input interface point of theloading equipment shall be clarified.
The power supply characteristics specified here shall be defined at the output interface point of
power supply.
Fig. 4-14 shows the concept of the power supply interface point specified by this document. Eachproject shall specify the interface points of other power supply buses as needed.
The requirements for the loading equipment shall be specified at the input interface point of theloading equipment considering the electrical instrumentation wiring. This provision shall be basedon Fig. 4-14.
22

JERG-2-200-TP001
The requirements from the output interface point of power supply to the input interface point of theloading equipment shall be specified under design of electrical instrumentation wiring in clause 4.6.

Power

Power Control

Distribution

Electric storage

Other

Primary Power Bus

Load Equipment

Generate

Other Power Bus

Load Equipment

Distribution

InstrumentationPowersystemPower

OutputInterface Point

Load Equipment
Input Interface

Fig. 4-14 Concept of Power interface
4.1.2.2 Characteristics of power supply bus
Each equipment uses the bus power distributed by the bus power supply distribution equipment byperforming voltage conversion and stabilization to the secondary power supply.
Voltage conversion and stabilization to the secondary power supply in each equipment are carriedout by the secondary power supply converter inside the equipment or by the secondary power supply
converter of PSU outside the equipment.
Equipment with small power consumption may share secondary power supply converter.
4.1.2.2.1

Primary power supply bus(Each project shall define this clause. The project shall clearly describe the bus types(regulated/unregulated/battery) to be used and specify their characteristics in compliance with
JERG-2-200A “Electrical design standard” clauses 4.1.2.2.2 to 4.1.2.2.4. Note that conventional
scientific spacecrafts use unregulated buses but recently small scientific spacecrafts and MMO
elected to use completely unregulated buses)
This clause describes the requirements for the interface of primary power supply bus.

23

JERG-2-200-TP001(1)

Bus power supply[1] Power supply system: Regulated or Unregulated DC power supply[2] Output voltage: +16.3 V ~ +27.5 V or +32.5 V ~ +52.0 V (the power supply distribution
output port)
Note: The bus power supply voltage that is input into an equipment has voltage drops due toelectrical instrumentation. The electrical instrumentation shall be designed so that voltage
drops of the bus power supply are minimized to 200 mV or less on the both HOT side/RTN
sides.
[3] Bus power supply output impedanceEach project shall specify the output impedance characteristics of the power bus.
[4] Rate of change in bus voltage = Bus transient
The bus voltage varies due to transient generated by on/off of the high-power equipment andchange in the operation mode of the power supply system at the boundary of the sunlit/eclipse
areas. The equipment using the bus power supply shall normally operate under this rate ofchange.

(2)• Transient by on/off of the high-power equipment:

shall be specified by each project• Change in sunshine/eclipse:

shall be specified by each projectCurrent monitor

The current consumption of the bus power supply is measured in the power supply distribution
equipment on a distribution system basis and is output to the telemetry.

(3)

Turning on/off the bus power supply for the equipment

The power supply distribution equipment shall provide the function to turn on/off the bus power
supply to separate the bus power supply at the overload during failure of the bus power supply
equipment and release the single event latch-up.
The power supply distribution equipment shall be designed so that a single failure cannot cause apermanent short circuit failure of the bus power supply.
Each equipment shall protect the device from the single event latch-up as shown in clause 4.1.2.6.

(4)

Overcurrent protection of bus power supply

The power supply distribution unit shall have an overcurrent protection function (current limiteror circuit breaker) for every distribution system to protect the spacecraft power supply systemfrom overload in the equipment failure and to separate the failure. A block diagram of the24

JERG-2-200-TP001
overcurrent protection function is shown in Fig. 4-15. Recovery after cutoff shall be done bycommand only after confirming the failed element by telemetry.
The overcurrent protection circuit shall have the following functions.
[1] An on/off (FET) switch for the bus power supply[2] Current limiter or circuit breaker[3] Current monitor

BUS Power
Equipment

BUS Power Return

Equipment

Fig. 4-15 Block diagram of the overcurrent protection function in the power supply
distribution equipment(Example)(5)

Stability
The stability of the bus voltage under sunshine shall be 1 V (TBD) or less as a nominal value inthe steady state at the regulation point. In eclipse, it shall be in accordance with the battery
characteristics.

(6)

Ripple and spikeIn this document, ripple is the value of cyclic voltage variation that is superimposed on the power
supply bus voltage. The ripple does not include spikes and transience due to load variation (Fig.
4-16).

Ripple Voltage
Spike
Fig. 4-16 Ripple and spike

25

JERG-2-200-TP001
The ripple voltage in sunlit shall be 1 Vp-p (TBD) or less. The frequency components of theripple shall be individually specified by each project as needed.
Spikes in sunlit (switching noise) shall be 2 Vp-p (TBD) or less and shall remain within a time
domain of 1 μs (TBD) or less.
In eclipse, both the ripple and spikes shall be in accordance with the battery characteristics.
(7)

Power supply impedance
At the regulation point, the impedance of the one operating power source (battery, solar array,etc.) shall be lower than the impedance value shown in Fig.4-14. The power supply output
impedance shall include the power supply control system, and it shall be represented byfrequency characteristics.
An impedance defined as when a power supply side is viewed from each of input impedance
points of load equipment shall set up as an "LISN (line Impedance Simulation Network)"obtained by adding impedances of power distribution and wire harness to a power supply output
impedance, and the LISN shall be specified in clause 5.2.4.2.1.

Impedanceイン
ピーダンス
Zout/（V 2 /P）
1

0.1

0.01

0.001
0.001

0.01

0.1

1

10

100

kHz
Zout:Power Supply Impedance

V:Bus Voltage (V)P:Consumed Power (W)Figure 4.-17 Power Supply Impedance(Confirm each project and change as necessary)

4.1.2.2.2

N/A

4.1.2.2.3

N/A

4.1.2.2.4

N/A

4.1.2.2.5

Transient characteristics of primary power supply bus

This clause shall specify the requirements related to transient characteristics of primary power
26

JERG-2-200-TP001
supply buses.
(1) Disturbances during Normal State
Both a power supply bus voltage and a time under a load transient state of a power supply system
during nominal operations are defined based upon both a stationary disturbance voltage and a
disturbance voltage limiting time (T) shown in Figure 4-18.
Each project shall define specific values.

Voltage
Voltage Under
Stationary State

Stationary Disturbance
Voltage

Disturbance Voltage Limiting Time (T)Disturbance Duration

Figure 4-18 Disturbance During Stationary State(2) Disturbances during Abnormal StateA disturbance during abnormal state is a primary power bus drop caused by the failure of loading
equipment, etc. and specified based upon an abnormal time (T) and a dropped voltage as
indicated in Figure 4-19. A voltage drop rate and a voltage rise rate shall be also specified asnecessary. Recovery from the fuse blown state shall be similarly specified.
Both a power supply and loading equipment shall never be damaged or fail due to disturbances
during an abnormal state. The onboard equipment shall be restored by commands.

27

JERG-2-200-TP001

Voltage
Dropping Ratio

Voltage
Increasing Ratio

Voltage

Voltage During
Stationary State
Abnormal Time (T)Dropped Voltage During
Abnormal StateTim
Figure 4-19 Disturbance During Abnormal State(3) Disturbances during Test
Any of loads shall not generate an aliasing capable of damaging other requirement’s oroperations of a spacecraft within a variation of bus voltages such as an increase of bus voltage
and a drop of bus voltage between 0 V and a maximum bus voltage.
A disturbance during a test is a disturbance of a primary power supply line due to ON/OFF of abus power supply used during the test. Both the power supply and the loading equipment shallnot be damaged under either of ON/OFF conditions of the power supply during interruption or
momentary interruption of a primary power supply.
Both the power supply and the loading equipment shall not be damaged under any one of the
ON/OFF conditions and never induce any failure, under continuous power supply maximum
voltage and minimum voltage anticipated in tests.
4.1.2.2.6

ODC (Ordnance Controller) Bus

The requirements of ignition power supplies to ordnances shall include ignition routes andsequences as well as electric interfaces such as supply voltages, supply currents, and supply pulse
widths. When setting the requirements, consider the various circumstances described in paragraph
4.7.
4.1.2.2.7

Heater interface(Supply voltage and tolerance are important in defining heater interface and they shall be clearly
described in the electrical design standard of the project. The heater interface shall also clearly28

JERG-2-200-TP001
be defined by applicable conditions when the differences in heater interface due to thedifferences in operations modes, orbit conditions, etc. exist.
Sequence control shall be specified to avoid simultaneous supply to heaters when sequencecontrol is used.)
The heaters for thermal control of the entire spacecraft shall be controlled by HCE (Heater
Control Electronics). The heaters inside the equipment based on special requirements of theequipment shall be individually controlled by each equipment. Basic classification of the heaters
for thermal control of the entire spacecraft is shown below:• Heaters to be attached on the spacecraft structure including base plates and panels.
• Heaters to be attached on the mounting block of equipment and thermal doubler• Heaters for the propulsion systems• Heaters for batteries
A block diagram of heater control by HCE is shown in Fig. 4-20. The signals of the various
thermal sensors on the spacecraft are multiplexed in HCE and used for heater control after A/D
conversion. At the same time, they are output as telemetry data.
Based on the command or information of the thermal sensor, the electric power of the heater is
supplied to the heater by switching transistor in HCE.
HCE
A/D converting

Multiplexer

Buffer memory

Control logic

HeaterTelemetry &Command Processing

Fig. 4-20 Block diagram of heater control

29

Thermal sensor

JERG-2-200-TP001(1) HCE heater interface(The numerical values in this clause vary depending on the power supply capacity of the bus andthermal design. Each project shall define appropriate values.)
The heater controlled by HCE shall be designed on the following conditions.
Although power loss due to resistance of instrumentation wiring differs by sensors, 25 W at a
maximum shall be used as a target for electric power per channel. The detailed values shall be
specified by consulting individually with the person in charge of the system considering the lengthof instrumentation wiring.
• Supply voltage (at the input port of the user’s equipment): Bus voltage (In shadow: 36.0 Vmin,
In sunshine: 51.0 ± 1.0 V)• Supply current to heater: 1.0 A/ch. or less(2) Thermal sensor interface
When monitoring the temperature inside the equipment using HCE, the platinum sensor as shownin Table 4-3 and Fig. 4-21 shall be attached at the temperature measurement points. Consult withthe person in charge of the system to use other sensors. Refer to clause 4.1.1.3.2 for the readout
circuit of the sensor.
Table4-3 Sensor Specification for HCE
ItemSpecification

Type

118MF 2000A(JAXA ausorized parts)

Maker

Goodrich(Formerly

Resistance

Rosemount)

2000Ohm±1.0%(@0degeeC)

Fig 4-21 Platinum Sensor for HCE
30

JERG-2-200-TP001(Note) Dimension unit is inch
(3) Heater control method of HCE
A.

Automatic control method
Compare the threshold of the temperature preset by the command and the temperature
measured by the thermal sensor and perform on/off control of the heater based on the
result.

B.

Control method with command
The heater is forcibly turned on/off with a command manually.

(4) Heater control of subsystems other than HCE
The heaters for components inside the equipment including the sensor for observation system. shallbe uniquely controlled by each equipment.
The thermal sensor signals in the equipment other than HCE equipment shall be converted by A/Dconverter at each component and shall be output to telemetry for monitoring.
4.1.2.2.8

N/A

4.1.2.3 Requirements for onboard equipment
4.1.2.3.1

Input impedanceThis clause defines the impedance on the upstream side observable from the input port of the loading(onboard) equipment. This impedance is shown as LISN to the onboard equipment side. The specificvalues are as shown in clause 5.2.4.2.1 (EMC test requirements > LISN).
4.1.2.3.2

Maximum input current

This clause specifies the maximum value of consumption current on the onboard equipment side
including operational transient during steady operations (excluding the time of inrush). The CE13
shown in clause 5.2.4.1 (requirements of EMC) shall be satisfied.
As necessary, consult with the personnel in charge of the system design to relax this requirement inconsideration of the supply capability on the power supply side and the ability of the voltage
converter on the onboard equipment side.
4.1.2.3.3

Inrush current

This clause specifies the maximum value during input of power supply and mode switching. The
CE14/15 shown in clause 5.2.4.1 (requirements of EMC) shall be satisfied.
As necessary, consult with the personnel in charge of the system design to relax this requirement inconsideration of the supply capability on the power supply side and the ability of the voltage converteron the onboard equipment side.
In addition, design shall be satisfied the following.
31

JERG-2-200-TP001(1) Inrush current that occurs when turning on the bus power supply (when the switch isprovided on the PCU side of the power supply distribution equipment)
Each equipment shall limit the current input to the bus power supply to 300 μF (TBD) or
less to control inrush current during the bus power on/off.
(Apply to all equipment except for those turned on when the spacecraft is powered on. Consult
with the person in charge of the system to use 300 μF (TBD) or more.)(2) Inrush current that occurs when turning on the bus power supply (when the switch is notprovided at the PCU side of power supply distribution equipment)
The inrush current that is generated by the on/off operation of equipment including turningon the bus power supply shall satisfy the conditions shown in clause 5.2.4.1.
(Apply to the equipment turned on when the spacecraft is powered on.)(3) Inrush current that occurs when the equipment using secondary power supply is turned on
The equipment to which secondary power supply is fed from another equipment shall be
designed to satisfy the provision of inrush current specified in the equipment of the supply
source (PSU, etc.). Note that this clause does not specify inrush current on the primary power
supply side.
(4) Inrush current that occurs when the equipment using secondary power supply is turned on(5) The large-capacity capacitor shall not be placed at the subsequent stage of a relay to
reduce the inrush current generated when turning on the relay connected to the bus power
supply and secondary power supply in the equipment (Fig 4-22).
When this requirement is not satisfied, the resistor R1 shall be inserted in the front stage(Fig. 4-23).

Power Supply
SidePower SupplySide

CircuitSide(Not Applicable)
Fig 4-22

CircuitSide(Applicable)

Arrangement of relays and large capacity capacitors for reducing rush current

32

JERG-2-200-TP001
R1

CircuitSidePower SupplySide

Fig 4-23

4.1.2.3.4

Reduction of rush current by resistance insertion

The rate of current change

The current rate change shall satisfy the CE13/14/15 shown in clause 5.2.4.1 (requirements of EMC).
However, it shall be specified individually since it depends on the transient response characteristic on
the power supply.
A numerical value shall be specified taking into consideration the transient time and the value ofcurrent change individually.
4.1.2.3.5

Voltage at input port

Bus power supply voltage that is input to an equipment has a voltage drop due to electricalinstrumentation. The electrical instrumentation shall be designed so that voltage drops of the bus
power supply are limited to 200 mV or less on the HOT side as well as on the RTN side.
4.1.2.3.6

Power supply line filter

The filter that can sufficiently attenuate the noise coupling between the power supply
line of the system’s electrical instrumentation and the equipment shall be inserted at
the power supply input port of each equipment.
The values of L and C for the filter circuit shall be suitably selected based on Fig 4-24.
The filter for removing the common mode shall be applied as needed.

33

JERG-2-200-TP001

Power
SupplyEquipment

C: Tantalum Capacitor
Cs: Ceramic Capacitor
L: Coil
R: Resistor for Voltage equalization
Figure 4-24 Power Supply Line Filter

4.1.2.3.7

Power-on reset circuit

The power-on reset circuit of the equipment activated by turning on the power supplyof the spacecraft system or turning on the bus power supply of the equipment shall be
designed so that the power supply voltage fed to the equipment requires max. 100 msec
from turning on of the power supply to voltage stabilization.

4.1.2.3.8

Interconnection between equipment with return of secondary power supply(1) when the common secondary power supply converter is used
Regarding equipment using the common secondary power supply converter, thereturns of the secondary power supply shall be configured by a star connection
from the common secondary power supply converter and the equipment shall not
be interconnected including to the return side of signals. (Fig 4-25) (For signal
connection between equipment, use the C-MOS single-end interface or differential
interface. Refer to Table 4-1.)

34

JERG-2-200-TP001

Secondary Power
SecondaryPower Convertor
signal HOT

Equipment-A

Equipment-B

Secondary Power
SecondaryPower Convertor
signal HOT

Equipment-A

Equipment-B
COM(2)

Fig. 4-25 Prohibition of interconnection between the returns of secondary power supply whencommon secondary power supply converter is used
(2) When different secondary power supply converters are used
Between the equipment using different DC/DC converters, the returns of thesecondary power supply shall not be interconnected including the signal returns.
(Fig. 4-26)(For signal connection between equipment, differential interface shall be applied
as shown in Table 4-1.)

Secondary

Secondary PowerPower Convertor

Secondary Power

Not Applicable
Equipment-A

SecondaryPower Convertor

Equipment-B
COM(2)

Fig. 4-26 Prohibition of interconnection between the returns of secondary power supply whendifferent secondary power supply converters are used

35

JERG-2-200-TP001
4.1.2.3.9

Emergency power off

Each project shall define this clause as needed. An example is shown below.
At the time of emergency to reduce the load on the spacecraft, the data processing system shall issue
the command to reduce it.
.
The following equipment shall be powered off in an emergency.
Common equipment

Observation equipment

Equipment C-1

All Observation equipment

Equipment C-2

Equipment M-1
Equipment M-2|
Equipment M-n

The above equipment shall be designed so that they can be set to the off mode by the commandsequences shown in cases 1 or 2 below and can be restored by commands.
Case1:

Setting the off mode with one command

・command 1 :Power Off command (sent from common equipment A)
Case2 Setting the off mode with two commands (for observation equipment only)・command 1 :Power Off notice command (sent from equipment M-1)
・command 2 :Power Off command (sent from common equipment A)・command interval : Issue command 2 one second after command 1

4.1.2.3.10 Power supply for relay drive
When multiple relays are driven inside the equipment, a suitable time delay shall be provided in thedrive sequence of the relays, to avoid simultaneously driving multiple relays.
The equipment using PS should not exceed the maximum rated output current of the PSU+12 V
system. Unless specially required, use latching relays to save power consumption when they are notdriven.
4.1.2.3.11 Power supply for heaters(1) Recommended power supply
Each project shall specify the power supply for the heater.

36

JERG-2-200-TP001(2) Precautions for heater control[1] Unless the heater current control is performed using PWM (pulse-width modulation), thedecoupling filter at the heater power supply line is not required.
[2] Do not use the heater power supply for series regulation in equipment to reduce loss of power
supply. When necessary, consult with the staff in charge of the system.

(3) Telemetry status
A heater control circuit of the equipment that requires a heater for functional
conservation even when the equipment is powered off shall be placed at thecontinuous power supply unit. (Clause 4.1.2.3.12) The heater on/off status,
auto/manual status and so on shall be correctly output even when the equipment isoff.
4.1.2.3.12 Continuous power supply(1) Continuous power supply equipment
The continuous power supply equipment is an equipment whose power supply
cannot be turned off by a command from the spacecraft or other means after its
power has been supplied by turning on the spacecraft The continuous power supply
is the bare essential to control the spacecraft.
(2) Continuous power supply circuit in each equipment
In the equipment other than the continuous power supply equipment, the following
circuits shall maintain the on state as long as the bus power supply is fed to theequipment (continuous power supply circuit).

[1] Start-up circuit for equipment
The circuit that is required at minimum in the first stage to start up an equipment
such as the processing circuit of a command to turn on the necessary circuit (ex.
CPU_SET/RESET/RUN) and the Power on Reset circuit.
[2] Telemetry processing circuit
T circuit to process and output the telemetry data which requires monitoring evenwhen the equipment is in STBY (standby) state (the state where the all circuits are
not turned off, i.e., power is supplied to some circuits), from the viewpoint of
spacecraft control.
* Example of telemetry data

• Equipment STBY/ON• Heater ON/OFF, ENA/DIS• CPU ON/OFF, SET/RESET, RUN/IPL• HV ON/OFF, HV ENA/DIS
37

JERG-2-200-TP001[3] Memory circuit for storing programs
As for the equipment where the memory for storing programs is not ROM, thememory for storing programs shall be positioned in a continuous power supply
circuit. Furthermore, the STATIC C-MOS IC, etc. shall be used for the continuous
power supply memory, in order to reduce power consumption at non-operation ofequipment.

[4] Heater control circuit
This denotes the heater control circuit, when a heater is required even in the non-operation stateof equipment.

4.1.2.4 Power supply return
Power supply returns shall be selected according to the power supply type and the intended purpose
shown in Table 4-4 to reduce interference and noise.

Classification
Bus Power

Table 4-4 Classification of Power Supply Return
Applied secondary
ReturnPurposeVoltageCOM(1)Bus Power Return

SecondaryPower
Supply

+5V
+12V
-12V

COM(2)

Secondary Power Return+12V(RL)+29V

COM(RL)COM(29)Other than thoseabove

COM(Voltage)

Relay Drive Power Return
Heater Power Return
RCS thruster Drive Return
Individual Use

4.1.2.5 Grounding and shield(1) Classification of grounding
A. Case ground
Grounding directly to an equipment case
B. Body structure ground
Grounding to the body structure of a spacecraft.
(2) Grounding of power supply return
Requirements on power supply return grounding are shown below.
(Refer to Fig 4-27.)
A. Bus power supply
38

JERG-2-200-TP001
The bus power supply return is grounded at one point on the case in the power
supply distribution equipment (DIST) and grounded to the body structure of thespacecraft via the case. Therefore, the bus power supply return and load on bus
power supply in the equipment shall be electrically insulated from the case/bodystructure of the spacecraft. Insulation resistance shall be 1 MΩ or more with DC
resistance.
When the above requirements cannot be satisfied, consult with the personnel incharge of the system design.

EQUIPMENTEQUIPMENTBUS Power

Fig. 4-27 Grounding system diagram

B. Grounding of secondary power supply return
The secondary power supply return of each equipment shall be grounded at one point on the casein the secondary power supply converter and grounded to the body structure of the spacecraft via
the case. (Type B of Fig. 4-28)
In an equipment without the secondary power supply converter, the secondary power supply
return shall be electrically insulated from the case/body structure of the spacecraft. Insulation
resistance shall be 1 MΩ or more with DC resistance. (Type A of Fig. 4-28)
C. Connection of the power source return to the case ground via the capacitanceTo connect the bus power supply return or the secondary power supply return to the case ground39

JERG-2-200-TP001
via the capacitance in order to avoid AC ground loop, consult with the personnel in charge of thesystem design. (Type C of Fig. 4-28)
Note that consultation is not required when the capacitance is inserted between the bus power
supply return and the case ground to return the common mode current that flows from theprimary side to the secondary side to the bus power supply return in the secondary power supply
converter.

Fig. 4-28 Grounding of the power supply return and the case
4.1.2.6 Protection against overcurrent
As shown in clause 4.1.2.2.1(4), the spacecraft power supply system shall be protected from theovercurrent due to an equipment failure by providing the overcurrent protection function in the
power supply distribution equipment.
The equipment shall protect the device from overcurrent due to the latch-up of C-MOS.
The design requirements per protection method are shown below. for the device shallprovide countermeasure for the Single Event Latch-up (SELs) caused by cosmic
radiation with consideration for the SEL tolerability (LETth) of the device.
Regarding the overcurrent protection against radiation, confirm the part/component
program, and regarding the radiation environment, confirm the design standard of spaceenvironment.
Example: Countermeasures of overcurrent protection against SEL are not required for
devices of LETth ≧ 80 MeV•cm2/mg.
(1) Overcurrent protection resistanceAn example of the circuit for protective resistance is shown in Note 1: To reduce the dynamic
40

JERG-2-200-TP001
impedance of the power supply line, insert the suitable capacitor (about 1000 pF).
Fig. 4-29. R1, C1, and C2 shall be set with consideration for the device properties, necessary line
impedance, weight of equipment, power consumption, etc.

Note 1: To reduce the dynamic impedance of the power supply line, insert the suitable capacitor(about 1000 pF).
Fig. 4-29 Example of the circuit for overcurrent protection resistance(2) Circuit breaker
When the equipment uses circuit breakers, all systems to be interrupted shall be cut
off simultaneously to keep the balance of voltage in the equipment. The equipment
hall also has the off command during interruption, the reset function for restart andson so that recovery to the normal state can be attempted.
Clause “4.6.6 Protection of power supply bus” shall be applied for fuses, the current
interruption circuit and separation of load.

4.1.3

High-voltage circuit

A voltage of 100 V or more is defined as high voltage. 100 V for an electric circuit side, and 200 V
for wiring are defined as high voltage. When 100 V is exceeded as electrical circuit design, consider
a high-voltage circuit. The equipment ICD shall identify the high voltage circuit if used. The highvoltage power supply shall have the high-voltage enable circuit as shown below.
(1) High-voltage enable circuit
41

JERG-2-200-TP001
High voltage ON shall be executed with the “HV ENA” and “HV ON” commands.

(2) High-voltage level setting
If it is necessary to change the high-voltage level in the equipment, the change shall be possible
even during HV ON.

(3) Protection of high-voltage power supply
An automatic shutoff function shall be provided in each equipment for any problems generated
in the high-voltage power supply to minimize equipment damage. The HV-ENA plug may beprovided to ensure safety during ground processing.

4.2

Commands

4.2.1

General requirements for commands

Commands are to perform on/off operations of onboard equipments, ENA/DIS of functions,control parameter setting, loading of memory images from the ground, etc. This clause shows
general requirements for commands. As for details of design of commands and protocols to be
adopted based on these requirements, refer to the “Telemetry command design standard for scientificspacecrafts” (JERG-2-TBD). Note that “on-board processor” in the following paragraphs
denotes the onboard computer for data processing which delivers commands to the
onboard equipment (called DHU or SMU in conventional scientific spacecrafts).
(1) Onboard equipments shall have functions capable of confirming execution of all commands by
the following:(a)To output HK data by which execution of all executable commands (e.g., ON/OFF commands)
can be directly confirmed.
(b) To download parameters configured by parameter setting commands by telemetry.
(c) To download data uploaded by upload commands by telemetry.
(2) The onboard equipments shall not change execution content defined for a command during a
mission period. Also the onboard equipments shall not change execution content defined for acommand by chronologically previous execution of its own or other commands.
(3) The onboard equipments shall be able to execute the same commands in succession to the extent
possible. Though in this case the command execution shall not change the corresponding HK
data, it is important that the same command can be executed without being rejected prior to the
execution. When any constraints exist for successive command execution, it shall be clearly
documented as equipment specifications and negotiate with the personnel in charge of the systemdesign.

42

JERG-2-200-TP001(4) The onboard equipment shall provide at least two inhibits ("Arm/Safe" and "Enable/Disable") ina line where a hazard may occur. Each inhibit shall be controlled by independent commands.
Refer to JAXA system safety standard (JMR-001) and rocket payload safety standard (JMR-002)
to control hazards.
(5) All commands to change onboard equipment configurations on orbit shall also be executable bycommands transmitted from a ground station.
(6) The functions to issue the onboard commands in (5) above shall be able to be inhibited bycommands from the ground except when inhibiting the functions endanger the spacecraft.
(7) The onboard equipments shall output HK data by which capable of confirming the operating
status of the functions to issue onboard commands in (5) above.
(8) The commands that cannot be produced unless telemetry is referred, as shown in Appendix I of
Chapter 7 in JERG-2-200, shall not be used.
(9) The onboard equipments shall not output/execute error commands by input interpretated as
undefined commands.
(10) Onboard processors shall not output commands when power supply voltages of the own
processors are not in the nominal state.
(11) The onboard processors shall be able to control the priority order of ground and onboard
commands.
(12) The onboard equipments shall have functions to download monitoring items that are not included
in normal telemetries to indicate some internal status by the commands designating the items, as
needed.
(13) The on-board processors shall have functions to execute commands by grouping.
(14) The onboard equipments shall not have commands to change the equipment status each time they
are received (so-called toggle commands).
4.2.2

Types of commands

The types of commands classified by signal interfaces are shown in Table 4-5.
Table 4-5 Types of commands
Type

Signal interface

Definition

Discrete command

Pulse

The commands output pulses to[Refer to 4.1.1.3.1(1).]predetermined equipments via
dedicated lines. For example they areused for pulse signals to drive on/off
relays of onboard equipments.

Serial magnitude command

Serial (e.g., RS-422.)

The commands output serial data to[Refer to 4.1.1.3.1(4), (5)predetermined equipments via

43

JERG-2-200-TP001
and (6).]

dedicated lines. For example they areused for commands for nonintelligent onboard equipments (e.g.,transponders) that cannot beinterfaced with the onboard network.

General command

Onboard network (e.g.,

The commands are used for general-

SpaceWire)

purposes via the onboard network.

[Refer to 4.1.1.3.1(4), (5)Command messages are deliveredand (6).]

based on the onboard network
protocols.

44

JERG-2-200-TP001
4.3 HK data
4.3.1

General requirements for HK data (telemetry)
The HK data (telemetry) are collected and downlinked to the ground to monitor the state ofspacecrafts, including analog values that indicate the equipment status such as voltage, current,
and temperature, ON/OFF status of circuits and switches, and internal conditions of on-board
software, etc. This clause describes general requirements for HK data. For the details oftelemetry design and protocols to be adopted based on these requirements, refer to the“Telemetry command design standard for scientific spacecrafts” (JERG-2-TBD).
(1) The onboard equipments shall output HK data (status data to judge the state of theequipments, etc.) required to change equipment configurations during the operational phase.
(2) The onboard equipments shall satisfy measuring precision requirements of the data to bemonitored by designing measuring precision, measuring ranges, and sampling periods of the
HK data appropriately.
(3) Spacecrafts shall output bus voltages and load currents of all primary power supply as
HK data.
(4) The onboard equipments whose functions or performance are dependent on temperatureshall have temperature monitoring functions including temperature sensors inside theequipments.
(5) The onboard equipments whose heat generation may exceed a value specified by the
spacecraft project including the case of some failures, shall have the temperature monitoring
functions.
(6) The equipments required to notify such as anomalies and events to the ground, in addition
to periodical telemetries, shall output one-shot telemetries for the notification.
(7) Time tags whose precision and accuracy can satisfy requirements of utilization andanalyses on the ground shall be attached to the telemetries.
(8) The onboard processors shall have functions to change the output pattern of telemetries(cycle, precision, etc.) according to the operations phases and the bit rate of communication
with the ground as needed.

4.3.2

Types of telemetries

The types of telemetries classified by signal interfaces are shown in Table 4-6.

45

JERG-2-200-TP001

Table 4-6 Types of telemetries
Type

Signal interface

Remarks

Active analog

Active analog

The telemetries are voltages whichtelemetry[Refer to 4.1.1.3.2(1)]onboard equipments output. The onboard processors for collecting thetelemetries (or the equipments
controlling the onboard equipments)
performs A/D conversion. For example
they are used to monitor the secondary
voltage and sensor output in the
onboard equipment.

Passive analog

Passive analog

The telemetries are currents supplied totelemetry[Refer to 4.1.1.3.2(2).]the resistors installed within the
onboard equipments. The on-board
processors for collecting the telemetries(or the equipments controlling theonboard equipments) performs A/D
conversion. For example they are used
to monitor temperatures by thermistors
or platinum sensors.

Active bi-level

Active bi-level

The telemetries are the predetermined

telemetry[Refer to 4.1.1.3.1(2) A.]

binary voltage output by the onboard
equipments. The onboard processors
for collecting the telemetries (or theequipments controlling the onboard
equipments) detect the telemetries. For
example they are used for the on/off
status of the onboard equipments andtheir internal circuits.

46

JERG-2-200-TP001
Type

Signal interface

Remarks

Passive bi-level

Passive bi-level

The telemetries are the Open/Close

telemetry[Refer to 4.1.1.3.1(2) .]status of dry contact inside the onboard
equipments. The onboard processors
for collecting the telemetries (or theequipments controlling the onboard
equipments) detect the telemetries. For
example they are used for the
open/close status of switches in the
onboard equipments.

Serial digital

Serial (RS-422, etc.)

The telemetries are by serial data via

telemetry[Refer to

the dedicated line. The onboard

4.1.1.3.1(4)(5)(6)]

processors for collecting the telemetries(or the equipments controlling theonboard equipments) collects thetelemetries without using the on-board
network. For example they are used tomonitor the non-intelligent onboard
equipments (e.g., transponders) thatcannot be interfaced with the onboard
network.

4.4

General-purpose

On-board network

The telemetries are used for general-telemetry(SpaceWire, etc.)

purposes via the on-board network.

[Refer to

Telemetry messages are collected based

4.1.1.3.1(4)(5)(6)]on the on-board network protocol.

Data processing margin

This clause specifies general requirements on the margins for using computers and networks. Thisclause is not applicable to sequencers and time division multiplexing which have few uncertainties.
(1) By the development phase, memory sizes and load factors of processors shall have sufficiently
large margins against the anticipated peak demands: The target margins are 50 %. This clause is
not applicable when there are no uncertainties.
(2) By the development phase, onboard data buses shall have sufficiently large margins against the
anticipated maximum traffics (peak demands) : The target margins are 50 %. This clause is notapplicable when there are no uncertainties.

47

JERG-2-200-TP001
4.5 Design Requirements for Test and Verification
This clause specifies design requirements to test and verify onboard equipments.
(1) Test terminals and connectors (terminals and connectors exclusively used for ground tests) of theonboard equipments shall be directly connectable with the test equipment.
(2) The test terminals and connectors of the onboard equipments shall not be damaged even when the
maximum absolute voltage determined by each spacecraft project is applied or when they arecontacted to the ground.

The terminals to which voltages are applied shall be protected byprotection resistors, if necessary.
(3) The test terminals and connectors of the onboard equipments shall be sealed at the time of flight.
Appropriate treatment such as EMI caps and blank panels (to prevent foreign objects fromentering) shall be executed.
(4) When flight connectors are used for the tests, the number of connection and disconnection of theflight connectors shall be limited by using saver connectors and the like. The saver connectors shallnot affect functions and performance of the equipments under test. This clause is not applicable tothe tests requiring direct connection with the flight connectors.
(5) The test monitor circuits in the onboard equipments shall not disturb their normal operations.
(6) The functions of redundant systems (including internal redundancy) shall be verified in systemtests. When verification in the system tests is difficult as for majority decision redundancy, thebehavior at the system level shall be assured by combining the subsystem or component tests orsimulations.
(7) If malfunctions of FDIR, protection circuits, active redundant circuits may become causes ofcritical hazards for spacecrafts, the validity of these functions shall be verified in the tests. When
verification in the system test is difficult, the behavior at the system level shall be assured by
combining the subsystem or component tests or simulations.
4.6 Electric Integration Design
Electric integration design is a part of tasks by the spacecraft systems. General requirements are as
follows.
 EMC which has a close relationship with the electric integration design shall be carefully
considered.
 Eliminate mutual interference between harnesses and by spatial electromagnetic fields shallbe eliminated to the extent possible.
 Electric discharges and potential distributions caused by electrification of the spacecrafts shallbe restrainted to the extent possible.
 Attention from mechanical and thermal viewpoints shall be given.
4.6.1

Wire Harness

It is important for spacecraft electric instrumentation design to avoid electromagnetic interferences
48

JERG-2-200-TP001
in circuits with different kinds of signals, because spacecraft is equipped with noise generating circuits(e.g., power lines and large-amplitude switching circuits), high sensitivity circuits with sensor signals
and digital signals, ordnance circuits, etc.
Generally speaking, modes of electromagnetic interference in circuits differ based upon distances
between circuits, lengths of circuits, return paths, impedances, types of signals of voltages, current
levels, frequencies, etc.
As a consequence, in order to avoid the electromagnetic interference, the circuits/signal types shall be
categorized by these factors, and a proper wiring method shall be employed with respect to thecategories for each harness.
Refer to the Appendix II in JERG-2-200 Electrical Design Standard for classifications based uponinterface circuit types, as an example for connecting onboard equipment according to circuit/signal
classification.
4.6.1.1 Classifications by Signal Types and Separations of Wire Harness(1) Wire harnesses for connecting onboard equipment shall be used based upon the classification
shown in Table 4-7.
(2) The wire harnesses shall be bundled by category as necessary, and placed apart from each otherto prevent electromagnetic inefrences.
(3) Ordnance circuits harnesses shall be placed apart from those in other categories.
(4) When wire harnesses of different categories are connected to the same connector, a pin layout
should use spare pins to separate the wire harnesses.
(5) The wire harnesses in the same category shall be separated in critical circuits based on the
project decision.
(6) Primary and secondary harnesses shall be protected from phsycal and thermal failure propagation
to the extent possible.

49

JERG-2-200-TP001
Table 4-7 Classification by Signal Types
CategoryI

Signal TypeElectric Power andHigh Level Signal

III

Low Level Signal

V
VI
VII

Ordnance CircuitPurpose

Connector Sharing
Permitted.

Control

II

IVClassification(Classifications are based on MILHDBK-83575 and explained inclause 4.6.1.3.)

High Frequency

Permitted.
Permitted.
Not permitted.
Permitted.

SignalOther Special

Optical Fiber. High Voltage (higher

purposethan or equal to 200 V*1) etc.

Test purpose

For ground testing, not used on orbit

Not permitted.
Permitted.

*1: In order to be consistent with Clause 4.6.5, the high voltage was set to 200 V or more, which islower than that specified in JERG-2-200Note) When the signals of different categories are used in the same connector, connector pin
assignment and arrangement shall be set with a specific care to signal isolation.
Demarcations of high frequencies shall be defined by the project considering their specificrequirements.
As to umbilical connectors, the classification based upon signal type is not required.
4.6.1.2 Selections of Wire Materials(1) Wire materials for instrumentation cables shall be selected from the JAXA recommended parts
list, or equivalent materials shall be used. In the latter case, (2) below shall be considered.
(2) When wire materials (i.e., wires and cables) for spacecraft are selected, the following
requirements shall be considered:(a) Current Capacities(b) Withstanding Voltages(c) Voltage Drops(d) Flexibility(e) Operating Environment Temperatures(f) Outgas(g) Cold Flow Resistance (fluidity)*1(h) Radiation Resistance(i) Ultraviolet Resistance*2(j) Atomic-state Oxygen Resistance*3(k) Anti-Arc Tracking Characteristic*450

JERG-2-200-TP001(l) Mechanical Sterngths*5*1: A cold flow phenomenon is a phenomenon that the insulating materials (PTFE, or
so-called Teflon) are deformed and become thin when they are contacted to eachother. Bridge ETFE and the like has better cold flow resistance characteristics.
*2: Consider when wire materials are exposed to a space environment.
*3: An oxidizing phenomenon by atomic-state oxygen in a Low Earth Orbit (LEO). Pay
special attention when wire materials are exposed in the LEO environment. For
detailed requirements, refer to JAXA Radiation Resistance Design Standard (JERG2-143) and Shinraisei Gizyutsu Joho (Reliability Technical Information) CRA99004.
*4: Broadly speaking, a tracking is a phenomenon that a deteriorated electric conducting
path (track) is formed by discharge in an electric field along a surface direction of an
insulating material. An arc tracking is a phenomenon that arc discharge forms aelectric conducting path having a low resistance because of a carbonized organic
insulation surface or an electric conductive product due to heat generated by arc
discharge (i.e,. vapor-deposited electrode metals). Carbonization due to arc discharge
heat tends to occur with materials having large carbon content. However, thematerials having N, O, and the like wintin the main carbon chain such as amino resinand polyamide resin are hardly carbonized having superior anti-arc tracking
characteristics. In addition, fluorine-containing materials such as PTFE and ETFE
have superior anti-arc tracking characteristics. On the other hand, materials
containing aromatic rings in their molecules such as phenol resin, PBT, andpolyimide resin have inferior anti-arc characteristics. For the materials having
adhesions of electric conductive products by arc discharge, times up to arc tracking
differ according to the differences in electrode materials, discharge energy, discharge
numbers, etc. Note that the data about the anti-arc tracking characteristic can beacquired as one of the safety verification test data of the JAXA Material Database
System (http://matdb.jaxa.jp/).
*5: Wire materials with small diameters (large wire gage numbers) shall be used withattention for wire disconnection, etc. When a high tensile strength wire is used to
improve mechanical properties, pay attention to the higher resistence than that ofannealed copper wire.
4.6.1.2.1

Rated Currents of Wire Harness

The rated currents of electric wires are determined based upon sizes of the electric wires. The rated
currents for bundled lines shall be derated by considering temperature increases as in Table 4-8. Thisrequirement is based on the Wire Derating Design Standard (JERG-2-212).

51

JERG-2-200-TP001
Table 4-8 Recommended maximum current for single line
Wire

30

28

26

24

22

20

18

16

14

12

10

8

6

4

1.3

1.8

2.5

3.3

4.5

6.5

9.2

13

19

25

33

44

60

81

Diameter(AWG)
Current(A)* Note
The above is based on MIL-STD-975 APPENDIX A3.16 that has been widely applied andNASA Instruction EEE-INST-002SECTION W1 that is recently used. (The current value for asingle wire is the same in these standards.) These values are recommendable current under thethermal vacuum environment at an ambient temperature of 70°C.
For reference, the (nominal) DC resistance values of wire rods and the attenuation rate of coaxial
cables are described below:(1) DC resistance value
AWG20

34.4 mΩ/m (annealed copper wire)

AWG22

54.8 mΩ/m (annealed copper wire)

AWG26

147.0 mΩ/m (high-tensile wire)(2) Coaxial cable①②

Semi-rigid coaxial cable (M17/113-RG316)
2.2 GHz0.60 dB/m

8.4 GHz1.30 dB/m

Flexible coaxial cable (M17/130-RG402)
2.2 GHz1.60 dB/m

8.4 GHz2.05 dB/m

The maximum voltage drops by electrical instrumentation cables are shown in Table 4-9. If the drop
values need to be modified, consult with the personnel in charge of the system design using the ICD.
Table 4-9 Example of the maximum voltage drop value by electrical instrumentation cables(Each project must review below and describe the appropriate values.
Take care to be consistent with the Clause 4.1.2.3.5 “Voltage at input port.”)Power Supply Line

Maximum Voltage Drop(mV)

BUS(50V)

200

COM(1)-12V, +12V

120

+5V

50

COM(2)

50+29V, COM(29)200

COM(RL)120

52

JERG-2-200-TP001
4.6.1.2.2

Precautions when using the fluorine-coated wireNASA reported that the metal portion of a wire harness terminal corroded when a fluorine-coated wire
harness was stored in a sealed container. (http://nepp.nasa.gov/npsl/Wire/22759/22759aps.htm,
http://nepp.nasa.gov/npsl/Wire/NA-GSFC-2003-03.pdf)

The followings are recommended: Inspect

to ensure that no corrosion has occurred. Store in an open package so that outgas can escape.
4.6.1.2.3

Wire rods for electrical instrumentation cables connecting equipment

The minimum thickness of electrical instrumentation cables connecting equipment is shown on asignal use basis. Use the wire rods that exceed these thicknesses in all cases.
(Each project shall review and modify this clause issue own electrical design standard. Specifically,
pay attention to whether there is a bias in favor of a specific company, and if so, whether the case isintentional.)(1) Power supply and heater line
• Annealed copper wire (AWG20)• Annealed copper wire (AWG22)• High-tensile wire (AWG26)(2) Signal line
[1] Digital signal line
• High-tensile wire (AWG26)[2] High-speed digital signal line
• High-tensile twist pair shielded wire (AWG26)• Wire of SpaceWire standard (ECSS-E-ST-50-12C)• In the line where noise radiation etc. can become a problem, such as high-speed LVDS,
use cables with impedance matching. Apply the outer shielded wire with both ends
connected to FG, as needed.
[3] Voltage monitor line
• High-tensile twist pair wire (AWG26)[4] Analog signal line
• High-tensile twist pair wire (AWG26)• High-tensile shielded wire (AWG26)• High-tensile twist pair shielded wire (AWG26)[5] Temperature monitor line
• High-tensile twist pair wire (AWG26)(3) RF interface• Flexible coaxial cable (MIL part name: M17/113-RG316 or equivalent)• Semi-rigid coaxial cable (MIL part name: M17/130-RG402 or equivalent)

53

JERG-2-200-TP001
4.6.1.3 Wiring Methods
It is important to avoid electromagnetic interference between circuits. Noises radiated from noise
generating circuits shall be suppressed to the minimum levels. Wiring for high sensitivity circuits shallbe performed by considering protection from the noises.
(1) Wiring of Category I (Electric Power and Control)(a) Hots and returns of power lines such as primary/secondary power supplies, heaters
and the like shall be wired with a twisted pair wiring for every pair. A shieldedwire shall not be utilized in the power line that does not have a failure isolation
measure for a primary power supply in case of a shortcircuit.
(b) With respect to control lines, refer to the classification in 4.6.1.2.3 to appropriately
select the twited pair wires, twisted shielded pair wires, and so on.
(2) Wiring of Category II (High Level Signaling: higher than, or equal to 20 V)(a) High level signal paths shall be wired by either multi-core twisted cables or multicore twisted shielded cables.
(b) The multi-core twisted cables shall be shielded in the unit of bundled line.
(c) The shield shall be grounded at one end on the signal source (output) side unlessotherwise necessrary. If the signal source side is different depending on the multicore shielded cable lines or the like (e,g., A signal direction of the whole shieldedline cannot be clearly defined.), both ends of the ground wire may be grounded.
(3) Wiring of Category III (Low Level Signaling: lower than 20 V)(a) Low level signal paths shall be wired by either multi-core twisted cables or multicore twisted shield cables.
(b) Multi-core twisted cables shall be shielded in the unit of bundled line.
(c) For shielding multi-core twisted cables with low impedance outputs, one terminalof the shielded wires shall be grounded on the input side unless otherwise
necessrary. With high impedance outputs; ground at both terminals or at
multiple points in long cables.
(4) Wiring of Category IV (Ordnance Circuits)(a) Ordnance circuits shall be wired by twisted pair shielded cables.
(b) Category IV wiring shall be separated from wiring of other categories.
(c) The cables shall be shielded for every one pair of hot and return.

The shields

shall be grounded at both terminals; or at multiple points in long cables.
(d) In order to secure necessary safety margins, measures to protect the ordnancecircuits from electromagnetic interference shall be taken. When cables are

54

JERG-2-200-TP001
shielded bundle by bundle, the shielded wires shall be grounded at multiple points
to avoid RF gaps.
(5) Wiring of Category V (High Frequency Signals)(a) High frequency signal paths shall be wired by coaxial cables, shielded cables,
balanced cables, and so on, considering specific characteristics of high frequency
signal circuits.
(b) Shielded cables shall be grounded at both terminals, or at multiple points in a longcable.
(c) Category V cables shall be separated from those of other categories to the extent
possible.
(6) Wiring of Category VI (Other Specific Circuits)(a) High voltage cables utilized in high voltage circuits shall be wired separatedly andindependently from the cables of other categories, while considering static shields.
(b) Optical cables shall be wired by considering specific characteristics of the opticalcables.
(c) When the high voltage cables are wired, avoid forming sharp corners to prevent
discharges.
(d) When the high voltage cables are wired, pay attention to a gas accumulation
within vacuum atmosphere.
(7) Wiring of Category VII (Test Purpose)
Test cables shall be wired separatedly and independently from the cables of othercategories.
4.6.1.4 Electric Power Harness(1) Electric power distribution wire harness shall not be used as mechanical supporting members.
(2) Each of power distribution lines shall be twisted in such a manner that a current loop area becomesminimum and an inductance value of harness becomes minimum. The spacecraft body structure
shall not be used as a power return path.
(3) Overcurrent protective measures (such as individual overcurrent protection, propagation
prevention by spatial separation of wires, and use of heat resistant coating) shall be employed sothat damage due to overcurrent heat generation does not propagate to other lines within the power
distribution wires.
4.6.1.5 Wire Splicing(1) Use of wire splicing shall be decided after consulting with the project.
(2) Wire splicing shall be implemented only after work procedures are established. Soldering shall55

JERG-2-200-TP001
not be used.
(3) Applying wire splicing for the ordnance lines is prohibited.
(4) Wire splicing shall not be used in a power supply line. If unavoidable, use wire splicing after
adequate investigation of safety.
4.6.1.6 Fixing of Wires
When wires are fixed by clamps and straps, the diameters of the harnesses and clamps shall match toprevent insulation defect caused by the deformation of wire harness coating or internal insulating
layers after clamping.
Refer to clause 5.4 "Clustering and Protecting of Assembled Electric Wires" of the Spacecraft-purpose
Electric Wiring Step Standard (JERG-0-041) for detailed procedures.
4.6.2

Connectors

4.6.2.1 Classification by Signal Types
Onboard equipment shall use connectors based upon signal types indicated in Table 4-7.
4.6.2.2 Selections of Connectors
Connectors used in the onboard equipment and wire harnesses shall be selected from connectors
described in the JAXA Recommended Parts List, or equivalent. When using a connector anythingother than those mentioned above, the equipment provider shall supply the equipment instrumentation
wiring connector to the system after coordinating with the personnel in charge of the system design.
To select connectors for spacecraft, the following shall be considered:(1) Rated voltage(2) Rated currents(3) Use Temperature Ranges(3) Applied Electric Wire Ranges(4) Insulation Resistances(5) Withstanding Voltages(6) Contact Resistances(7) Outgas(8) Altitude Withstanding Voltage Characteristics (Break Down Voltage Characteristics for
Atmospheric Pressure)(9) Residual Flux Characteristics(10) Frequency Characteristics
4.6.2.3 Usage of Connector
Connectors shall be used with the seletion of proper rated values and the consideration of various
connector characteristics. Other factors including connector assignment, installation, and use of56

JERG-2-200-TP001
contacts shall also be considered. For the use of connectors in the housings of onboard equipment,
refer to DOD-E-8983C, specification common to electronic equipment for aerospace use, which
defines the assignment and mounting of the connectors and the use of the contacts.
(1) Assignment of Connectors(a) Connectors to be installed on onboard equipment shall be assigned with the considerationof connectivity and prevention of mis-connections.

A table 4-10 gives some measures toprevent mis-connections.
(b) Connectors of redundant intefaces shall be independent of each other as required in clause
4.8 (2).
Table 4-10 Connector Assignments to Prevent Mis-connections
Item

Measures to Prevent Mis-connection

Directions ofWhen same type connectors are used side by side, connector directions

Connectors

shall be easily identified.

Stamping Locations

A label shall be provided at the places observable from a far place after
the instrumentation connectors are installed.

KeyingAll connectors shall be keyed if necessary and possible.

(2) Mounting of Connectors
Connector shells shall be grounded with own onboard equipment housings. Thisrequirement is applicable if the connector shells are grounded via other onboard equipment
housings.
(3) Use of Pins/Sockets(a) Pins should be used on the side of signal inputs, and sockets shall be used on the side ofsignal outputs.
(b) When inputs and outputs are in the same connector, pins/sockets and pin assignments shallbe determined after individually coordinating with the project personnel.
(c) Coaxial connectors of onboard equipment shall be females.
(4) Power Supply Contacts(a)Two, or more contacts shall be used for power supplies.
(b) The rated current per one contact should be the maximum load current of an onboad
equpement or higher.
(c) The number of contacts shall be added if required to satisfy the maximum load current
considering derating. Even when one of the contacts is broken down, the remaining
contacts shall be able to carry the maximum load curernt.
(d) Be ware of unbalance between contacts when derating is considered.
57

JERG-2-200-TP001(e) Power supply lines and signal lines shall be bundled separately.It is desirable that a bundle
consists of only power supply lines and connected to a single connector that is not used forother purposes.
(5) Grounding Contacts(a) Any of connectors having multiple contacts shall have chassis grounding pins.
(b) Wiring lines between grounding pins and chassises shall be made as short as possible.
(6) Signal Return Contacts(a) Each of input/output signals and its signal return shall be established via a connector
contact. A chassis or the like shall not be used as the signal return.
(b) In the case that an equi-potential is required between onboard equipments whose
secondary sides are interfaced, signal return contacts shall have pins for this purpose.
(7) Contacts for twisted wires
Twisted wires shall be used with pairing contacts that are in the proximity in connectors.
(8) Spare Contacts (Spare Pins)(a) 10 % of spare pins should be left with multi-contact connectors at the initial stages ofdevelopment.
(b) To prevent antistatics, unused pins shall be grounded. However, when the pins only havecontacts only and do not have wiring to outside the connector, they may not be grounded.1(9) Test Connectors(a) Connectors for tests shall be socket contacts.
(b)All contacts in a single connector shall not damage onboard equipment when shortcircuited to any adjuscent contact.
(c) Test terminals or test connectors of on-board equipment shall be sealed at the time offlight. EMI caps, blank panels (to preclude the entry of foreign matter) or other appropirate
measures shall be taken.
(10) Special connector
Consult with some personnel in charge of the system design to use a special connector.

1

According to the paragraph 5.2.10 in Spacecraft Charging and Discharging Design Standard(JERG - 2 - 211), floating conductors with a surface area of 2 cm 2 or less are exempt from ESD
evaluation.
However, if iconnector pins can be easily grounded like an L type connector onboard on a printed
circuit board, they shall be grounded.
Grounding cables are not necessary for connectors directly attached to the panels.
58

JERG-2-200-TP001(11) Connector incorporating the EMI filter(a) The articles incorporating a component that has a short circuit failure mode — including
chip inductors with electrodes — shall not be used for the power supply connector. If the use
is unavoidable, consults with the personnel in charge of the system design to clarify the
specifications of the connector.
(b) The use of these connectors shall be described in the ICD. Since the tightening torque may
be different from that of common products, it shall be clearly indicated not only in theelectrical part but also in the mechanical part.
(12) MDM connector(a) Jack posts shall be mounted on the equipment side. JAXA uses inch screws.
(b) Note that only thin wire rods AWG26 or less, can be used.
(c) The shell of a MDM connector shall be plated with gold or nickel. When the use of otherplating cannot be avoided, coordinate with the personnel in charge of the system design.
(13) D-sub connector(a)Jack posts shall be mounted on the equipment side. JAXA uses inch screws.

4.6.2.4 Junction Terminals
Junction terminals shall be coated by an insulating material.
4.6.2.5 Exposed Printed circuit boards
When printed circuit boards are installed on structural panels, the exposed boards shall be coated byan insulating material so as to prevent an electrical short circuit.
Grounding and insulation
4.6.3.1 Internal interface
4.6.3.1.1 Grounding
As a grounding target in the system, the metallic body structure parts, bus bars for grounding, etc.
shall be prepared. They can be used as the reference point of zero potential, which is suitably
provided in the body structures. The following matters shall be considered.
(1) The relationships with the return/reference potential for both the power supply system and thesignal system shall be indicated.
(2) The impedance of connection with regard to the preceding item shall be shown. In that case,matters regarding what type of power supply and signals are using the common routes(harnesses, body structures and cases) shall be identified, and they shall be considered in therange of the affected signal spectrum.

The specific values for the resistance and inductance ofeach element in the electrical network, which is provided as the grounding target, shall be
59

JERG-2-200-TP001
specified as needed. Using these values makes it possible to calculate the common mode
voltage at each reference point within the circuit, and to compare with the requirements of the
conducted susceptibility of each component. The schematic diagrams of grounding/insulationof the spacecraft system/subsystems and components shall be prepared, and the compatibility ofthe total system shall be confirmed. In order not to use the body structures as return routes, thegrounding point of the primary power supply for the body structures shall be a single point. The
return of the isolated type secondary power supply shall be grounded. This shall be performedat the output port of the power supply in general. However, when it is desirable to use anothergrounding point due to requirements of function/performance of the onboard equipments, thegrounding point can be changed after consultation with the system person in charge. As also
shown in clause 4.1.2.5 and 5.2.3.1, insulation resistance of 1 MΩ or more shall be kept
between the primary/secondary power bus.
4.6.3.1.2 Insulation design
This clause is intended for application in the power supply lines of spacecrafts with a bus voltage of
100 V (nominal) or lower.

However, the insulation design of printed-circuit boards shall be basedon JERG-0-042 “Design standard of printed-wiring board & assembly,” and it shall be exempt fromthis clause.
(1) Insulation design by gaseous dielectric
When vacuum or atmospheric air is used as an insulator, a distance of 1.0 mm or more between
conductors shall be provided, at the maximum operating voltage of 210 V or lower. In this case,dust and humidity shall be controlled.
(2) Insulation design by solid dielectric
The dielectric breakdowns of common materials for spacecrafts is developments are shown in
Table 4-11. Here, V0 denotes the dielectric breakdown in a short time (within 20 sec) for AC 50
Hz at room temperaturefor materials without use history. VEFF shall be used in the design
process.
Table 4-11 Dielectric breakdowns of solid dielectrics（Ref：JERG-2-213A Design Standard Insulation）
Material

Thickness

Effective

Nominalwithstandbreakdown

voltagevoltage

V EFF

Vo

50 μm

2.5 kV

6.3 kV25 μm

1.2 kV

5.5 kVCHO THERMⓇ

0.38 mm

7.7 kV

12.0 kV

SOLITHANE

0.20 mm

2.9 kV12.8 kV

PTFE tapeⓇ

KAPTON

tape

60

Remarks

200 HzJERG-2-200-TP001
PARYLENE

20 μm

170 V

3.2 kV

Mica

75 μm

1.4 kV

8.0 kV

1.0 mm

8.2 kV

27.0 kV

LUMIRRORRⓇ

50 μm

2.1 kV

6.5 kV

Heat-shrinkable

0.18 mm

340 V

9.5 kV

Glass epoxy

0.2 mm

2.7 kV11.7 kV

RTV(S-691)

1.0 mm

9.9 kV

29 kV 200 Hz

200 HzETFE wire

0.15 mm

2.4 kV

9.2 kV

200 Hz

diX C

20 μm

250 V

2.8 kVBT resin

0.1 mm

1.1 kV

5.0 kV

Arathane

0.2 mm

2.1 kV

10.8 kV

RTV566

0.2 mm

440 V

4.2 kV

RTV1420.2 mm

2.7 kV

7.7 kV

Polyimide wire

0.16mm

1.0kV

14.3kVURALANEⓇ

100 kHz
200 Hz
100 kHztube

coating
Note: Calculating conditions of VEFF:
Temperature: 100°C; Frequency: 200 kHz (However, as for materials whose dielectric strength
value at 200 kHz has not been obtained, the calculations have been performed
with the frequencies described in the remarks.)
Thickness:

Nominal thickness of each specimen (Refer to the above description. The tapethickness does not include the thickness of the adhesive.)

Fluence of electron beam:
1 × 1015/cm2 (This corresponds to the exposed dose for about one year on thesurface of a geostationary spacecraft. However, since the mechanical strength of
the PTFE tape is significantly lowered at 1×1015/cm2, it has been calculated at
1×1014/cm2.)
Exposure to ultraviolet radiation:
800 ESD at the wavelength band of 200 to 400 nm (applicable only to Kapton
and ETFE wires)
Time of electric charging:
0.1 million hours (corresponding to about 11 years)
ここまで(3) Creeping insulation design
Regarding requirements for creeping distance of solid dielectric, the creeping distance shall belonger than 1.0 mm for the maximum operating voltage of 210 V or lower. If this value cannot beensured, the adequacy of the design shall be judged after consulting with the staff in charge of the61

JERG-2-200-TP001
system, by other means of insulation, or by conducting analysis or evaluation. Furthermore, as
for the parts in which the creeping distance between conductors is less than this value, the usage
shall be allowed on the condition that the performance of the parts is guaranteed by qualification
tests, etc. and with consideration for the actual operation results on the orbit.

62

JERG-2-200-TP001

4.6.3.1.3 Double insulation
Since a short circuit of the primary power supply bus line as well as the battery line is the most fatal,
and countermeasures after occurrence are also impossible, the double insulation shall be applied. It
shall be applied to the upstream of the primary power supply bus line that including the fault
separation circuit, the place that the primary power supply bus line and a battery line which make ashort circuit of one location, specifically, the places are as follows.
(1) Primary power supply bus line: At the solar battery paddle side that transmits the generated
electric power to the primary power supply bus line, it ranges from the place that short-circuits
the primary power supply bus line by a short circuit of one location, to the input port of theshort circuit fault separation circuit of the load side equipment which receives distribution andsupply from the primary power supply bus line. Depending on the system of the short circuit
fault separation circuit, there are cases where application is required beyond that range.
Regarding this matter, refer to clause 4.6.6.2 (Protection by current interruption circuit).
(2) Battery line: The battery line shall include the charge array line (in a charge array system), thepower line inside the battery, the cell case, battery case, and the ignition power supply line forpyrotechnic, in addition to the battery output line.
However, it shall not be applied when redundancy can be provided (when a redundant system
exists and separation of the failed system is possible by the overcurrent protection circuit,current limiter, etc.). Also, double insulation is not applied to inside semiconductor components
such as ICs, transistors, diodes, etc., and to the insides of the parts, such as connectors, relays,
capacitors, etc. (including hermetic seal parts).
Double insulation denotes the method whereby two different methods selected from thefollowing [1] and [2] in clause (4) are used, and if one side is short-circuited, insulation issecured so as not to short-circuit another side by the same cause.
When use of same material is unavoidable due to electrical, mechanical, thermal, or otherrestrictions, configuration is allowable only for the material that has actual results of flight or ofevaluation, as well as data on its insulation properties, mechanical strength, thermal tolerability,
etc., and that can secure a sufficient safety margin. However, even in that case, select and use amaterial from the following [2] in clause (4).
(3) Space insulation (the gap between two conductors)
In an area to be insulated, a distance shall be included to prevent shorting between conductors
caused by foreign matters and displacement expected in the area.
If a distance of 1mm or more is provided, it is regarded as an insulating material.
If a distance of 1mm or more is provided between two bare conductors and no insulating
material exists between them, it is regarded as single insulation. If the gap between two
conductors is filled with an insulating material, it is regarded as double insulation.
63

JERG-2-200-TP001(4) Solid body insulation
Insulation is provided using the following solid body insulation material:(1) Solid body insulation material(a) Resin board(b) Resin sheet(c) Resin mold(d) Coating(e) Mica board(f) Glass fiber(g) Glass hermetic sealing(h) Ceramic board(i) Ceramic hermetic sealing(2) Items allowed for using for double insulation with the same material.
(a) Resin sheet: BT resin, Lumirror sheet(b) Resin board: GFRP, Rexolite(c) Tape: Polyester tape, Kapton ® tape(d) Wire material sheathing: Wire material shall be certified for installing on aircraft(3) Items not regarded as insulation material(a) Solder resist on printed circuit board(b) Surface treatment on alloy(Except for the cases where insulation is secured by types of treatment or application to
insulation design.)(c) Ferrite
4.6.3.2 External interface
4.6.3.2.1 Umbilical Interfaces
Detailed contents of umbilical interfaces shall be defined based upon interface specification
documents with respect to rockets.
In order to ensure electrical continuities, the following items shall be considered:(1) Grounding and Electrical Continuities
Spacecrafts are required to be connected up to final grounding points of launch site facilities via
either umbilical cables or rockets, while electrical continuities shall be secured.
(2) Umbilical Connections(a) Umbilical connectors shall be provided independent from internal connectors of anotherspacecraft.
(b) In accordance with ISO15389, clause 4.10 (Electrical connectors) and clause 5.2.2.4 (Design64

JERG-2-200-TP001
guidelines Electrical connectors), data buses whose frequencies are higher than, or equal to 500 kHz,low frequency signals, command functions, and ground electric power shall be, in principle,
separated from each other by employing individual connectors as being permitted as possible.
(c) As described in ISO15389, clause 4.10 (Electrical connectors), in order to prevent short circuits,
electric connectors shall be made as dead-face type connectors in which pin tips are located at
positions deeper than engaging planes.

Also, as defined in ISO15389, clause 4.2.3 (Alignment),

electric connectors shall be equipped with engaging guides in order to be easily inserted/pulled out.
(d) In order to prevent erroneous joints, shapes of electric connectors shall be changed, or electric
connectors should be discriminated by employing symbols, or discrimination marks.
(e) A care shall be taken to such an item that interface circuits via umbilical connectors do not, inprinciple, propagate failures to signal circuits of internal/external interfaces.
(f) Pin assignment, voltages, currents, and maximum allowable voltage values shall be determined.
(g) As to interfaces of end-to-end, namely spacecrafts-to-rockets-launch side facilities, not only pin
assignment shall be confirmed at umbilical connector terminals, but also umbilical connectors shallbe confirmed before connecting actual spacecrafts by executing such a method for utilizing
validation-purpose cables equivalent to cable provided on the side of rockets, and spacecraft
simulating apparatuses.
(h) As to connectors which are exposed to aerospace after rockets are separated, while charging
measures are included, EMC requirements from flight hardware shall be established and measures
shall be taken, as defined in ISO15389, clause 4.12 (Electromagnetic compatibility (EMC).
(i) After rockets are separated, umbilical connectors shall not propagate failures to spacecraft
systems even when any of failures occur.

4.6.3.2.2

Other external interfaces

Regarding the test equipment and facilities that interface electronically with spacecraft, pay attention
to the following matters.
(1) Install a grounding wire that connects the spacecraft and the ground system, in advance of all
operations and power activation.
(2) Regarding the electric power line, the test equipment and facility side shall have protectivefunctions.
(3) The regulation of disturbances at tests shall be satisfied.
(4) Grasp the mutual grounding system among the spacecraft, test equipment, and facility, andsecure a suitable connection.
(5) As for the circuits that interface with spacecraft, perform interface FMEA as needed.
(6) Grasp the electrical restrictions of the test equipment and facility in advance, and clarify theinterfaces with the spacecraft.

65

JERG-2-200-TP001
4.6.3.3 Antistatics2Countermeasures for electrostatic charge shall be executed in order to prevent accidents due toelectrostatic charge on an orbit. The basic way of thinking is shown below. (The details shall be
specified for each project according to the environmental conditions of the spacecraft.)(1) The conductors exposed to the outside surface of a spacecraft shall be earthed to the bodystructure ground, using bonding wires, etc.
(2) Even if the outside surface of a spacecraft is an insulator, the conductor of the inner surface orinside shall be earthed to the body structure ground, when the inner surface or inside is aconductor.
(3) When a MLI (Multiple Layer Insulator) is used, the metal vapor deposition surface of eachlayer shall be totally conducted electrically, and earthed to the body structure ground. The
number of grounding wires shall be two up to an area of 2 m2, and if this is exceeded, increaseat a rate of one piece/m2, in accordance with the antistatic standard. (The necessity of
application of redundant grounding shall be judged for each project.)
Furthermore, grounding resistance for the purpose of antistatic can be allowed up to 1 MΩ.
4.6.4

Electric discharge prevention in low vacuum environments 2

Regarding the onboard equipment that may generate glow discharge during transition to vacuum
condition (at critical pressure), discharge prevention shall be considered. The following examples are
considered:(1) The onboard equipment which the primary power supply is activated during the launch(2) The component which its capacitor bank, etc. may remain charged(3) The transmission filter (or diplexer) when a high-power transmitter outputs
The mutual relationship between the discharge speed of the outgas quantity that is discharged
from air holes and the transition rate of the vacuum depending on the launching height of therocket shall be considered.

4.6.5

Items to be considered for High Voltages

A high voltage implies a voltage at which either partial discharge or corona discharge occurs.
In an actual case, the high voltage is higher than, or equal to approximately 200 V.
(1) High voltage equipment shall be designed and manufactured by considering a latent discharge
phenomenon occurred in accordance with the Paschen curve under environments encounteredduring mission terms.
(2) The high voltage equipment shall be designed in such a manner that both DC field strengths2

According to appendix I.8.4 of the electrostatic charge/discharge design standard (JERG-2-211), in
low vacuum environments, Paschen discharge does not occur unless the voltage becomes 330 V
DC or more, and this voltage decreases at AC and high frequency.
Therefore, regarding the low voltage environments that are generally the target of this document,
there is basically no need to consider the above-mentioned issue.
66

JERG-2-200-TP001
and AC field strengths in the worst event become smaller than, or equal to 1/2 of discharge
starting field strength values.
(3) Degrees of vacuum at which the high voltage equipment are designed and tested shall be lower
than, or equal to 10 Pa.
(4) In potting circuits, glass transfer points of potting materials shall be present outside authorized
temperature ranges.
(5) Minimum bending diameters of high voltage cables shall satisfy items recommended bywiring cable manufactures.
4.6.6

Protection of power supply bus

The overcurrent protection is handled in order so short circuit failure on the load side of the
primary power supply (onboard equipment and wire harness) does not cause abnormal it on thefeeding side of the primary power supply. Regarding this, any single point failure shall not cause ashort circuit on the primary power bus.
Accordingly, when overcurrent protection is to be realized on the load side, the design where a single
failure causes a short circuit failure shall not be made for the primary power supply input circuit, andthe design of instrumentation wiring to the load equipment shall be made with double insulation.
Regarding the portions where overcurrent protection cannot be executed in the primary power
supply bus (including the bus bar, harness, and connector), protection by double insulation shall bemade up to the point of the first protection equipment (fuse, circuit breaker, current limiter, or backflow preventing diode).

4.6.6.1 Protection by fuse
Fuses shall not be used, unless unavoidable. This is because fuses cannot be recovered when
operated (melted down), and the existence of fusion cannot be confirmed easily.
(1) Load of primary power supply (precaution for power consuming equipment design)(a) When short circuit prevention is performed by using a fuse on the onboard equipment side,
the use method shall be sufficiently considered. Specifically, note that a fuse on the returnside is useless against a short circuit to the case (ground fault).
(b) The fuses inside the onboard equipment shall be parallel redundant configuration, except if
used for failure separation of the redundant configuration, and in principle, confirmation
about the integrity of individual fuses from outside the onboard equipment shall be madepossible.
(c) The fusing characteristics of fuses shall be sufficiently considered. The fuse selected shallhave such features that it will not melt down due to the anticipated instantaneous large
load, but will certainly melt down in the event of a problem that can affect the equipment
located upstream and other equipment.
67

JERG-2-200-TP001(d) When a fuse is provided at the subsequent stage of the DC/DC converter, consider fusing
the characteristics of the fuse, and use a DC/DC converter that has the ability to certainly
melt down the fuse.
(2) Feeding side of primary power supply(a) When an onboard equipment uses the fuse, the feeding side of the primary power supply
must confirm the fusing characteristics of the fuse on the onboard equipment side, and also
confirm that the specification during disturbance by problems is satisfied.
(b) When a fuse is used for the protection of the primary power supply bus, it shall be
designed so that the fuse can be melted down within the time allowable for the system,
when a load short occurs.
(c) When the primary power supply bus is protected by using a fuse, it shall be possible toconfirm the open status of the fuse from the outside of the component. It is desirable to beaccessible and replaceable even during the integration of spacecraft.
4.6.6.2 Protection by current limiter(1) In the case that overcurrent protection is carried out by current limiting circuits and the like,
limiting systems thereof (insulations made by current limiting circuits/current limiting
resistors/fuses/commands etc.) should be clearly distinguished, and current limiting values/time
characteristics/other items should be clearly defined.
Specifically, proper margins and redundancy should be considered with a care for inrush
currents when power supplies are turned ON.
(2) When current detection is carried out on the return side, a short circuit to the body structure of
the spacecraft (ground fault) cannot be detected. Therefore, perform double insulation of boththe hot side and the return side, and also at the downstream of the circuit breaker/current limiter.
(3) When combining the current detector and circuit breaker/current limiter, if the detector part andthe breaker/limiter part are different (for example, when current is detected at the return side,and breaker/limiter are done at the hot side), it shall be designed so that the current that flows at
both sides will always be the same, including at the time of a failure. For example, when
multiple detection–interruption systems exist, never mutually connect them not only on the hotside but also on the return side.
4.6.6.3 Load separation(1) On primary power supply line interfaces, it shall be required that any load equipment whereabnormal events have occurred can be separated from the line at the supply side and/or the loadside so as not to influence the failure on other onboard equipment.
(2) When both the supply side and load side have protection functions (regardless of the
primary/secondary side), the separation function on the loading equipment side shall be
designed so that it operates earlier than that of the supply side: if the supply side operates

68

JERG-2-200-TP001
earlier, it is not possible to also supply electric power to the normal loading equipment that areconnected in parallel with the loading equipment to be separated.
4.7

Matters to be considered about ordnances and non explosive actuators

4.7.1

Safety requirements

Ordnances and Non Explosive Actuator (NEA) are required to be one-shot devices, and have higher
safety characteristics. Among the spacecraft onboard ordnances, electro-explosive devices (will bereferred to as "EEDs" hereinafter) shall be cared in the highest degree in their electrical design.
Circuit design, integration design, and operations with respect to EEDs and NEAs shall comply thesafety requirements defined in the Rocket Payload Safety Standard (JMR-002) such as isolations of
the circuits, inhibits, safety margins, shielding, bonding, electrostatic protection, and tests.
4.7.2

Characteristics of EEDs

Circuit and integration design and operations shall comply with each EED specification such as
maximum non-firing currents, maximum testing currents, maximum/minimum firing currents, bridge
wire resistances, insulation resistances, withstanding voltages, electrostatic discharge, chattering,
electromagnetic compatibility, protection line, Faraday caps, electrical bonding, environmental
conditions, and the like.
4.7.3

Ignition control of ordnances

Regarding the ignition control of ordnances, the following matters shall be considered.
(1) Regarding all systems from the supply source of ignition power to the ordnances, clarify theroute, including the relationship with the power supply system and the grounding of thespacecraft.
(2) Clarify the operation sequence to reach the ignition.
(3) Protect the ignition power supply lines from being the short circuit mode.
(4) Clarify the principal specifications such as the power sources, ordnances, relays, and antistatic
resistors, and the ignition current as well as the energizing time necessary for the ignition ofordnances.
(5) The circuit for ordnances from ODC to the port of ordnances shall be wired with the twist pairshielded wires.
(6) When verifying the ordnances, pay attention to the following matters.
(a) The electric system shall be confirmable from end to end.
(b) After finishing end-to-end confirmation of the electric system, it shall be possible toconfirm the soundness of the ordnances and connections, by continuously measuring theresistance value of the ordnances, etc.
(c) It shall be possible to perform an operation check of the ODC, in addition to an end-to-end
test of the electric system. For example, it shall be possible to monitor the signal
waveform.
69

JERG-2-200-TP001(d) Regarding the drive system of ordnances, whether the fitting is correctly done cannot be
confirmed, by the functional tests after the final fitting of the TN connector. Consider thismatter when clarifying the verification plans from the design phase, and incorporate it into
the design as needed.
(7) It is sometimes desirable from the viewpoint of safety that the energy line of the development
driving system is physically separated until just before the launch. Therefore, in that case, TNNEBAT shall be arranged so as to be accessible from the fairing window of the rocket,
considering the fitting (mating) at the launching site.
4.7.4 Drive control of the non explosive actuator
Note the following matters regarding the Non Explosive Actuators (NEAs) that are not ordnances,
but these utilization is increasing for the use of releasing the various holding portions, for which
ordnances were used for old-style spacecrafts.
(1) Regarding all systems from the supply source of driving electric power to the NEAs, clarify theroute, including the relationship with the power supply system and the grounding of thespacecraft.
(2) Clarify the operation sequence to reach the hold releasing operation.
(3) Protect the driving electric power supply lines from being the short circuit mode.
(4) Clarify the principal specifications such as the power supply sources, NEAs, relays andantistatic resistors, and the driving current of the NEAs as well as the energizing time necessary
for driving.
(5) The NEA circuit from the power supply source to the port of NEAs shall be wired with a twist
pair shielded wire.
(6) When verifying the NEAs, pay attention to the following matters.
(a) It shall be possible to confirm the electric system from end to end.
(b) After finishing end-to-end confirmation of the electric system, it shall be possible toconfirm the soundness of the NEAs, and of the connections.
(c) It shall be possible to perform a necessary operation check, in addition to an end-to-end
test of the electric system. For example, it shall be possible to monitor the signal
waveform.
(d) Regarding the drive system of NEAs, whether the fitting is performed correctly cannot be
confirmed, by the functional tests after the final fitting of the TN connector. Consider thismatter when clarifying the verification plans from the design phase, and incorporate it into
the design as needed.
(7) It is sometimes desirable from the viewpoint of safety that the energy line of the development
driving system is physically separated until just before the launch. Therefore, in that case, TN-

70

JERG-2-200-TP001
NEBAT shall be arranged so as to be accessible from the fairing window of the rocket,
considering the fitting (mating) at the launching site.
4.8

Matters to be considered about failure

Items to be considered for failures are indicated as follows:
In the case that the following requirements cannot be satisfied, substitution means shall be separately
taken.
(1) A failure occurred in one system in a redundant arrangement shall not be propagated to the othersystems.
(2) In principle, a connector of a master system signal and a connector of a slave system signal of aredundant interface shall independently employed (namely, master system signal and slave
system signal shall not be assigned to the same connector).
(3) In redundant interfaces, at least interface-purpose drivers/receiver circuits and the like shall not
propagate failures to the master system and the slave system in physical and thermal manners. 3(4) In cross strap connections, a failure of an interface circuit of one system shall not induces a failureof an interface circuit of the other system.
(5) In redundant systems, propagations of failures shall be prevented by physical and thermal isolationsof either onboard equipment or circuits.
(6) In hazardous circuits, a hazard shall not be produced in response to two arbitrary failures.
4.8.1

Derating

In principle, the regulation of MIL-STD-975 APPENDIX-A shall be complied with. Regarding
components that are not described in MIL-STD-975, derating shall be set on the basis of theregulation of MIL-STD-975 APPENDIX-A. Specifically, a tantalum capacitor shall be used so thatthe charge and discharge rate becomes 1 A or less, and for that purpose, a current-limiting resistor
shall be added in series as needed. Moreover, when a ceramic capacitor that is not for space use isutilized at a low bias voltage, note that the high withstand voltage type is required.

4.8.2

Separation of continuous power supply circuit

Not only in the case of an interface between equipment but also in the case of inside the equipment,
the element/device without the input protection diode to the power supply side shall be used, inprinciple, for the input circuit at the interface between the constant power supply circuit and othercircuits. 4050 and 4049 correspond to the case of standard C-MOS. (However, since the noise
margin of 4049 is less than that of 4050, it is recommendable to use 4050.) This is intended toprevent an input signal from flowing into the power supply via the protection diode of C-MOS when

3

Prevention of fault propagation can(?) be implemented within a practical range.
For example, it is realistic to put the circuit of main system and subordinate system on the same
circuit board but the packages should be allocated separately.
71

JERG-2-200-TP001
the power supply of the input circuit is turned off; otherwise, the circuit of the subsequent stage
could operate or the protection diode could burn out due to overcurrent. When use of anelement/device with the protection diode is unavoidable, use the circuit as shown in

Fig. 4-30, and prevent flowing into the power supply on the input circuit side.

Fig. 4-30 Separation of constant power supply circuit. A C-MOS shall be used for the input
element/device.
4.8.3

Considerations about the use of capacitors

Regarding capacitors (notably, tantalum capacitor) that have a high possibility to provoke a shortcircuit of the power supply due to a short circuit failure, take the preventive measures shown in

Not Applicable

Applicable
Note

R: Voltage equalization

Fig. 4-31. Components for which series redundancy is impossible, such as feed-through capacitors,
72

JERG-2-200-TP001
etc. shall not be used for the power supply filter. When non-application is desired because reliability
can be ensured by another method, etc., consult with the staff in charge of the system.

Not Applicable
Note

Applicable

R: Voltage equalization

Fig. 4-31 Preventive measures for short circuit of tantalum capacitors
4.8.4

Consideration about the use of ferrite beads

Regarding ferrite beads, the following precautions during mounting shall be carried out in order toavoid insulation failure when mechanical damage is generated by impact, etc. However, theseprecautions are not applicable to chip components.
(1) When being used near the circuit patterns, cover them with an insulation sheet.
(2) As a preventive measure against scattering apart at breakage, coat the beads with an adhesive (asoft type such as silicone series, etc.).
(3) Ferrite is not deemed as an insulator from the viewpoint of insulation design (clause 5.2.1.2 (3)of the insulation design standard JERG-2-213A). Therefore, the ferrite bead shall be deemed as
an electric conductor, and an insulation distance to the bead shall be sufficiently kept. It is same
when using at the back side of connectors.

5.1 Electric power
Herein, “electric power” denotes the electric power supply system of spacecraft, namely the primary
power supply.

5.1.1

Scope

Power supply subsystems supply electric power capable of operating spacecraft systems andequipment. Requirements of power generation, storage, power control, line protection anddistribution shall be applied by Solar Paddle design standard (JERG - 2 - 215B) and Power Supply
System design standard (JERG -2 -214A).
5.1.2

Requirements and income/outgo regarding electric power

The income/outgo and margin regarding electric power shall be set based on the design standard of
power supply system (JERG-2-214), and the following requirements are given for the income/outgo

73

JERG-2-200-TP001
and margin of electric power.
(1) The hardware and software that configure the power supply subsystem shall fulfill theirfunctions over the total operations in the environment actually encountered.
(2) When designing the power supply subsystem, analyze the system electric power profile for all
stages of the mission, and then analyze the energy demand during the total operation period
while considering the inrush power and peak power, eclipse, incidence angle of the sun, anddirectional misalignment. The income/outgo balance of electric power based on the abovementioned peak power value (supply capacity of peak power) and the income/outgo balance ofenergy based on the average power value (charge and discharge income/outgo of battery) shallbe established and maintained. The following items shall be considered in the above-mentioned
income/outgo.
(a) Distance from spacecraft to the sun(b) Duration of sunlight and eclipse(c) Aspect angle of the sun(d) Pointing accuracy(e) Influence by the environment temperature and deterioration(f)Matters relevant to reliability (influence of failure)(3) As for the available electric power, it shall be possible to supply the required power even if a
failure occurs in the solar battery array circuit or the battery cell has failed, under the worst
condition until the end of life. As for the state of a failure, a power loss by 5% of total
generation power before the occurrence of the failure, or by the portion of one array circuit,whichever is larger, regarding the solar battery array4, and the short circuit or open of one cell
regarding the battery cell5 shall be assumed.
(4) In order to maintain system safety and battery functions, a fault detection function for thebattery shall be provided.
(5) The scale of the solar battery array, battery, power control equipment, and power distribution
equipment of the spacecraft shall be designed based on the above-mentioned income/outgo ofelectric power.
5.1.3

Matters to be considered about failure

The power supply system shall be designed so that it is possible to protect the spacecraft power
supply system and to separate failure from the spacecraft power supply system, against overload in a
failure of the downstream.

45: JERG-2-215A: JERG-2-214A

From clause 5.1.1.2(a) of the design standard of solar battery paddle systems
From clause 4.5.2(7) of the design standard of power supply systems
74

JERG-2-200-TP001
5.1.3.1 Redundant design(1) The power supply system shall not have a single point of failure that can be assumed by fault
analysis. When a single point of failure remains, identify that, and show the reason why it isaccepted. This reason shall include technical evaluation of the possibility of occurrence,
observation of means that enable removal of the point if the means exists, and countermeasures
for reducing the probability of occurrence or influence of a potential failure.
(2) Regarding the problems/failure due to open/short circuit of parts, etc., take countermeasures byseries-parallel connection, redundancy of circuits and equipment, etc. However, pay attention to
the failure rate of OR circuits, switching circuits, etc. to achieve redundant configuration.
(3) Any protective function that supports the essential function inside the converter or regulator
connected to the primary power supply shall not be implemented in the same hybrid IC or in thesame IC, and furthermore, the reference voltage and power supply that are independent fromthe circuit to be protected shall be utilized.6 However, the above-mentioned matters shall not
apply to hybrid ICs that incorporate the functions that are physically separated so as not to leadto the fault chain.
(4) The primary power supply shall be restorable when an abnormal state (for example, solarpower loss due to anomalies of attitude, etc.) has been removed, also including the case where
secondary electric power has been lost.
5.1.3.2 Battery protection(1) The protective function shall be provided, so that anomalies such as short circuit, open, etc. of abattery cell do not affect other battery cells or the primary power supply bus.
(2) A protective function such as stopping of charging, etc. shall be implemented, so as to preventthe battery from causing a fatal failure when it has undergone overheating.
5.1.4

N/A

5.1.5

N/A

5.1.6

N/A

5.1.7

Wiring and protection

5.1.7.1 Fundamentals(1) The primary power supply shall be connected to a single ground point (UPG) of a spacecraft.
The body structure shall not be used as the power supply RTN.
(2) Regarding the portion that is not protected by any device in power distribution of the primary
power supply bus, it shall be protected by the double insulation method up to the point of firstprotection device (fuse, circuit breaker, or current limiter), as the minimum requirement. The

6

The intention is that the protection of the primary power bus. shall not fail due to a currentlimiter/circuit-breaker failure caused by a preceding failure of another portion..
75

JERG-2-200-TP001
details of double insulation shall be in accordance with clause 4.6.3.1.3 or the insulation design
standard (JERG-2-213A), which is the source document.
(3) In all loading paths, provide a protection circuit as close to the power supply as possible.
(4) When the power distribution cable of the primary power supply bus is protected by using a
fuse, it shall be verified by analysis, that the fuse does not operate by the maximum current in
the loading path including the transient state (by rush current, etc.), and that the fuse certainly
melts down when a short circuit failure occurs.
(5) When the primary power supply bus is protected by a fuse, that shall be accessible andreplaceable even during the integration of spacecraft.
(6) When the power distribution line of the primary power supply bus is protected by a fuse, thepower supply system shall be designed so that the fuse can be melted down within a suitable
time, when a load short occurs.
(7) Regarding all current limiters and the circuits where the power supply is automatically cut off,the operating status of the protection circuits shall be monitored by HK data. Even if thismonitoring has failed, it shall not provoke problems with the protected elements/components.
(8) When the relay that turns on/off the primary power supply line is used, the peak voltage at thecontact when the power supply is cut off shall not exceed the spec at disturbance during
abnormal state.
5.2

EMC
This clause describes important factors to achieve EMC performance even if they are alreadydescribed in other clauses.
Therefore, all equipment designers are expected to read this clause carefully to deepen
understanding of related requirements in other clauses.
This clause is compiled based on the EMC Design Standard rev. A. (JERG-2-241A)

5.2.1

System integration design

In system integration design of the onboard equipment, the bonding, grounding, insulation, cables,
shielded wire, connector, electrical harness (including the harness routing), filtering, shield ofchassis, lightning protection/arc discharge, antistatic surface finish, pyrotechnic circuit, andequipment location, etc. shall be designed and studied at the system level.
5.2.1.1 Grounding and wiring design
5.2.1.1.1 Grounding/Insulation diagram
Since grounding and insulation are closely related to the EMC of the spacecraft system, theschematic diagram of the grounding/insulation of the spacecraft system/subsystem and equipment
shall be prepared and the compatibility of the total system shall be confirmed.

76

JERG-2-200-TP001
5.2.1.1.2 Grounding point
The grounding point shall be set on the metallic structure part, bus bar for grounding, etc. that can beused as the reference point of zero potential that is suitably provided in the spacecraft body structure.
The details shall be clarified in the EMC control plan, including the following;(1) The relationships to the return/reference potential of both the electrical power lines and thesignal lines shall be identified.
(2) As for preceding paragraph, connective impedance of the wirings shall be specified. The line
types — such as electrical power line or signal line — using the common route (e.g., wiring, bodystructure, and chassis) shall be identified. They shall be considered in the frequency range of affectedsignal spectrum.
The specific values may be assigned to the resistance and the inductance of each element in theelectrical network which serves as the grounding point. (Refer to clause A.1.1 of the EMC design
standard (JERG-2-241).) Using these values makes it possible to calculate the common mode
voltage at the reference point of each circuit to compare with the requirements of conductedsusceptibility of each equipment.

5.2.1.1.3 Wire harness
The hot side and the return side of the line shall be in the same bundled harness. The wires shall be
twisted pair cables wherever possible. The body structure of the spacecraft shall not be used as thesignal/electrical power return line. As for the classification of cables and their wiring, it is consideredon the subsystem basis.
5.2.2 System EMC design
The system EMC design shall consider 1) EMC/electrical interface study and adjustment and 2)
special requirements. Specifically, the grounding concept of the power supply unit shall be specified
as a part of the electrical power system design concept. In order not to use the body structure as a
power return route, the grounding point of the primary power system to the body structure shall be
the single point throughout the entire system.
5.2.2.1 Electrical bonding
The bonding resistance between each metallic chassis of all electrical equipment and its mounting
portions (metal), as well as between these mounting portions and the metallic payload body structure
and of conductive components of non-electric systems shall be 1 Ω or less. However, the followings
shall be satisfied.
(1) When Multiple Layer Insulator (MLI) is used, the metal vapor deposition surface of each layer
shall be totally conducted electrically and it shall be connected from the grounding point of MLI to
the body structure of the spacecraft by 1 Ω or less.
77

JERG-2-200-TP001(2) The conductors exposed to the outside of the spacecraft structure shall be connected to the bodystructure of the spacecraft at 1 MΩ or less by bonding wires and the like. (for antistatics purpose)(3) Even if the outside surface of a spacecraft is an insulator, the conductor of the inner surface orinside shall be connected to the body structure of the spacecraft at 1 MΩ or less when the innersurface or inside is a conductor. (for antistatics purpose)(4) The grounding between the chassis for the equipment of the propulsion system and the structureof the system shall be at 10 mΩ or less including the portion of cumulative impact between all close
contact surfaces. (In accordance with clause 5.3.1.4 of the Payload Safety Standard (JMR-002B).)(5) The places between individual tightly-attached surfaces inside the equipment such as between
sub-assemblies or sections of the propulsion system shall be connected at 2.5 mΩ or less. (Inaccordance with clause 5.3.1.4 of the Payload Safety Standard (JMR-002B).)(6) All the members that constitute the body structure panels including internal cores andfront/back skins shall be internally bonded. The bonding resistance between the front and back sides
skin of the panel shall be 10 mΩ or less. During spacecraft assembly, bonding between panels shallbe achieved by mounting each panel. When this requirement is not met, coordinate with thepersonnel in charge of the system design.
5.2.2.2 Body structure shielding of spacecraft
The electrical discontinuity parts of the spacecraft body structure (cover, inspection hole, connecting
part, etc.) shall be minimized. The discontinuous parts in the elements important for the RFinterference and the radiated susceptibility shall be electrically conducted by a low-impedance
conduction path.

5.2.3 Subsystem EMC design/Grounding and insulation of electrical power system(1) Primary power system
The grounding of power system shall be decided based on the concept of power system design. In
order not to use the body structure as a return route, the grounding point to the body structure shallbe the single point throughout the entire system.
(2) Secondary power system
It is necessary to control the return of secondary power system as a spacecraft system. It shall begrounded by either of the onboard equipment, the subsystem, or the system and at the feeding port ofthe secondary power system. When the Power Supply Unit (PSU) and electrical consuming
equipment are separated, perform grounding at the PSU side. When grounding at another point isdesired for the functional performance of the onboard equipment, consult with the personnel incharge of the system design. Insulation resistance of 1 MΩ or more shall be kept between the
primary and secondary power supply.
5.2.3.1.1 Connection to single point ground78

JERG-2-200-TP001
The grounding point shall be located on the body structure via the nearest route from the power
supply return terminal. This line shall not go through another onboard component.

5.2.3.2. Grounding and insulation of the onboard equipment, etc.
(1)

When the onboard equipment is not connected to the power supply of the spacecraft,insulation resistance of 1 MΩ or more shall be kept between the primary power supply input line ofeach onboard equipment and the chassis of the onboard equipment.
(2) N/A(3) Insulation resistance of 1 MΩ or more shall be kept at the signal return of the onboard
equipment that generates high frequency or operates at high frequency, at the secondary power
supply return, and at the primary power supply return.
(4) In order to completely control the grounding points as a system, the grounding of the circuit
ground and secondary power supply return shall be at the feeding port of the secondary power
supply. If this requirement is not met, coordinate with the personnel in charge of the system design.
When grounding is secured at a place other than the feeding port of the secondary power supply, use
the grounding and insulation schematic diagram to confirm at the system level that there is no
unintended current loop via the signal return, secondary power supply return, or chassis ground.
5.2.3.3. Filtering
The electronic equipment and cables outside the body structure shall have individual shields to keepa margin of at least 6 dB against the electromagnetic environment of the spacecraft.
5.2.3.4. Magnetic characteristic
The magnetic torque by interaction between the magnetic dipole moment of the spacecraft andmagnetic field of the earth is one of the primary factors of attitude disturbance torque of thespacecraft. When the magnetic field of the earth is small as in the case of geostationary spacecraft orwhen the magnetic dipole moment of the spacecraft is small, disturbance by magnetic torque issmall. However, the magnetic dipole moment of low-altitude spacecraft orbiting comparatively large
orbiting comparatively large magnetic field of the earth may affect the attitude control system of thespacecraft.
The magnetic dipole moment of the spacecraft may interfere with the measurement of magnetic
field.
The following shall be met to minimize the magnetic dipole moment.
5.2.3.4.1 Magnetic materials
The use of magnetic materials shall be kept to the minimum. The use of permanent magnets,
electrical magnets, etc. shall be avoided wherever possible. When the use of magnetic materials
79

JERG-2-200-TP001
cannot be avoided, consult with the personnel in charge of the system design and also consider theconfiguration to minimize the magnetic dipole moment. Furthermore, information about use andconfiguration of the magnetic materials shall be given in the Interface Control Drawing (ICD).
5.2.3.4.2 Current loop
Except for the magnetic torquer for spacecraft attitude control, the area of current loop shall be
kept to the minimum. As for the line where the hot and return are clear, use the twisted pair cableeven if current loop is small.
5.2.4 EMC requirement for subsystems and equipment
The following requirements shall be complied with. For test requirements and other details, refer toclause 5.2 of JERG-2-241A “EMC design standard rev. A.”(Each project shall investigate the requirements and tailor them as necessary. Note that MIL-STD461/462 Revision C and Revision D measurement requirements are qualitatively different and boththe measurement method and the standard shall be changed at the same time.)
5.2.4.1. Requirements for EMC
The EMC requirements structure is shown in Fig. 5-1. and the requirements for the electromagnetic
interference limit are shown in Table 5-1.
Confirm through test or analysis that each onboard equipment satisfies the above-mentioned
requirements. When a developed product has the EMC test results that satisfy the above-mentioned
requirements, the test can be omitted.
When these requirements are not satisfied or any issues exist for conducting tests,, coordinate withthe person in charge of the system.

80

JERG-2-200-TP001

BR01

電気的ﾎﾞﾝﾃﾞｨﾝｸﾞ及び絶縁抵抗
Electrical bonding and insulation resistance

Requirement
tree
ＥＭＩ限界
for limit of EMI

Conducted
伝導雑音
EmissionConducti
on noise

Power
電源ﾗｲﾝ
supply line

要求体系

Steadystate
定常時CE01,CE03,CE11

ﾄﾗﾝｼﾞｪﾝﾄ時At
transientCE13,CE14,CE15

Spurious signal at
ｱﾝﾃﾅ端子ｽﾌﾟﾘｱｽ
antenna terminal
Conducted
伝導感受性
SusceptibilityCon
duction sensitivity

CE06

Power
supply line
電源ﾗｲﾝ

Steadystate
定常時
Atﾄﾗﾝｼﾞｪﾝﾄ時
transient

CS06

相互変調
Intermodulation

CS03

Out-of-band
帯域外応答
handling

CS04,CS05

Receiver’s
受信機
antenna terminal
ｱﾝﾃﾅ端子Radiated
放射雑音
Emission

Radiated
放射感受性
Susceptibility
Radiation
sensitivity

CS01,CS02

Field radiated

電界放射雑音emissionradiation noise

RE02

Magnetic field radiated
磁界放射雑音 noise
emissionradiation

RE01

Field radiated
電界放射感受性
susceptibility
radiation sensitivity
Magnetic field

定常時
Steady state

RS03

Electrostatic
静電干渉

RS11

interference

磁界放射感受性
Magnetic
field radiatedradiation sensitivity

RS02

susceptibility

Note:BR01, CE11, 13, 14, 15, and RS11 areunique established in these criteria standard, and theyare(注)BR01、CE11,13,14,15、RS11は、本基準書で制定したものであり、MIL
体系
symbols that are not used in the MIL standardsMIL system.

では使用していない記号である。

Fig. 5-1 EMC requirementsrequirement tree81

JERG-2-200-TP001
Table 5-1 Requirements for EMC (1/6)
No.
1

2

Item
Electricalbonding, andinsulation
resistance(BR01)

Conducted
emission Limit(CE01,CE03)

Contents(1) Electrical bonding
In the EMC test, the electrical bonding resistance between the equipment
grounded in the EMC shield room shall be 2.5 mΩ or less.
(2) Insulation resistanceAt each equipment, the following insulation resistance shall be 1 MΩ or
more.
a. Bus power supply return and the chassisb. Bus power supply return and secondary power supply returnc. Between the secondary power supply return and the chassis(excluding the RF equipment and SpW equipment)d. Signal return and the chassis (excluding the equipment that receives
feeding of the secondary power supply from another equipment, RF
equipment, and SpW equipment)
The conducted noise current that is output from the power supply line ofeach equipment shall not exceed the following allowable values.
• 0.1 Hz to 20 kHz: 3%p-p of maximum input current or less• 20 kHz to 100 MHz: Attenuation from above-mentioned value of 20
Hz, by –20 dB/DEC
The minimum value shall be 30 dBμA (RMS) or less.
Furthermore, the current ripples at communication by SpW are excluded.
3%p-p of maximum
input current or less3

Limit ofbouncing ripple
voltage (CE11)

The bouncing ripple voltage that is output from the power supply line ofeach equipment shall not exceed the following allowable values.
Furthermore, the spike component is not included.
• DC load input span
• 10 mV o-p or less (10 W or less)• 1 mV o-p or less (10 W or more)• Measurement bandwidth: 10 Hz ~ 100 MHz* The definition of electric power shall be the nominal power
consumption value specified in the ICD of each equipment.

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JERG-2-200-TP001
Table 5-1: Requirements for EMC (2/6)
No.
4

Item
SwitchingTransient limit(CE13)(CE14)(CE15)

Contents(1) Noise current in power supply line (CE13)
It shall be as follows under operational transient during nominal
operation.
• Peak current: 1.25 times the steady current or less
• Transient time: 50 ms or less• Absolute value of current change rate (|di/dt|):
1 × 105 A/s or less(2) Transient current (per one input) (CE14)①The maximum value of the transient current to the primary power
supply line when the power supply of the equipment is turned onshall be as follows.
・For steady current is 1 A or less: 2 A or less・1 A ~ 15 A: It shall not exceed two times the steady current.
・15A or more: 30 A or less
②The absolute value of the current change rate (|di/dt|) of thetransient current shall be 2 × 104 A/s or less. Regarding heaters,
however, it shall be 1 × 105 A/s or less.
③The maximum variation of electric charge shall be
16 m Coulomb or less.

∆Q Coulomb

𝐼peak

𝐼 𝑑𝑡

0

④After turning on, it shall become a steady current value within 50
ms.
Note: Regarding equipment that cannot comply with the provisionof within 50 ms as mentioned above, coordinate with the staff
in charge of the system design.

83

JERG-2-200-TP001
Table 5-1: Requirements for EMC (3/6)
No.
4

Item

Contents（３）Inrush current (CE15)①The amplitude of the inrush current when switching oneach equipment that has an on/off switch on the power
supply shall be as follows.
・ For steady current is 1 A or less: 2 A or less・
1 A ~ 5 A: 2 times the steady load
current or less・
5 A or more: The current value
where 5 A is added tothe steady load current,
or 30 A, whichever issmaller, or less.
②Furthermore, the absolute value of the current change rate(|di/dt|) of the transient current shall be 1 × 105 A/s or less.
③Moreover, the maximum variation of the electric charge
shall be 16 mCoulomb or less during 1 ms.
∆Q Coulomb

𝐼 𝑑𝑡④However, Δt from turning on of power supply to the peak
point of current shall be 1 ms, or the time until the peak
point, whichever is shorter.

(CE13)
Power supply on(CE14, CE15)
Power supply off

Transient current profile (CE13, CE14, CE15)84

JERG-2-200-TP001
Table 5-1: Requirements for EMC (4/6)
No.
5

6

7

Item
Spurious conductedemission limit at antenna
terminal(CE06)
Conducted susceptibility
Limit in power supply line
(CS01, CS02)

Transient limit(CS06)

Contents
It shall be in accordance with the spurious characteristics ofeach transmitter’s antenna.
It is not applicable to items except for the transmitter.
Even if the following sinusoidal voltage is superimposed on
the temporary power supply line of each equipment, thefunction and performance shall not be decreased.
• 0.1 Hz ~ 15 kHz: 3.0 Vp-p
• 15 kHz ~ 400 MHz: −20 dB/dec
However, the minimum value shall be 1.0 Vp-p.

Even if the following pulse voltage is superimposed between
the hot/return bus line as well as the line and the chassis in thepositive and negative directions, the function and performanceshall not be decreased.
+6V
Main bus
voltage

1 μs or lessIn the diagram, the main bus voltage is 32.1 V to 52.0 V (at the
input port of the equipment), according to the bus interface
requirements in clause 4.1.2.2.1.
When there is a restriction such as applying stress, etc. to theequipment by conduct the transient voltage test of +6 V and –6
V relative to the main bus voltage at each equipment, set themain bus voltage to the possible range, and conduct thetransient voltage test of +6 V and –6 V.

85

JERG-2-200-TP001
Table 5-1: Requirements for EMC (5/6)
No.
8

9

10

Item
Intermodulation conductedsusceptibility at receiver’s
antenna terminal(CS03)

Out-of-band response
conducted susceptibility atreceiver’s antenna terminal(CS04, CS05)
Radiated emission limit(RE02)

Contents
When RF noises of two waves or more that may possibly be
input to a receiver at the antenna part are actually input to thereceiver, the receiver shall not respond due to intermodulation.
The receiving frequency band is also excluded in this case.
This is not applicable to items except for the receiver.
It shall be in accordance with the out-of-band response
characteristics at each receiver’s antenna terminal.
This is not applicable to items except for the receiver.
The electric field radiation noise emitted from each equipment
shall not exceed the below-mentioned allowable value.
“General requirements”
The requirements are shown in Fig.5-2.
MIL-STD-461C Part3 RE02 Fig3-8 & Fig3-9 (ClassA2a)11

Magnetic field radiatedemission noise limit(RE01)“Rule of coordinating the requirements depending on themounting location”
Individual requirements of RE02 are shown in Table 5 2.
The magnetic field radiation noise emitted from each equipment
shall not exceed the allowable value shown in Fig.5-4. The
measurement distance shall be 7cm from the surface of theequipment.

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Table 5-1: Requirements for EMC (6/6)
No.
12

Item
Field radiatedsusceptibility limit(RS03)

Contents
Even if each equipment is exposed to the following electricfield, its function and performance shall not be decreased.
“General requirements”
14 kHz ~ 30 MHz: ≥ 10 V/m
30 MHz ~ 10 GHz: ≥ 5 V/m
10 GHz ~ 43 GHz: ≥ 1 V/m

13Electrostatic interference
limit (RS11)

14

Magnetic field radiatedsusceptibility limit(RS02)“Rule of coordinating the requirements depending on themounting location”
Individual requirements of RS03 are shown in Table 5-3.
Regarding the equipment where malfunctions, etc. may occur
due to electrostatic charge and discharge by space plasma,conduct the test under the following conditions, and confirm
that there are no problems with the functions. (To be inaccordance with MIL-STD-1541, clause 6.7.2)• Gap voltage: 10 kV (arc discharge of electrostatic charge)• Pulse rate: 1 pulse/s• Spacing between test piece and gap: 30 cm
To be in accordance with the Part I Spike#1, in MIL-STD-461C
Part3 RS02 Since the above-mentioned matter would be an
unrealistic requirement in some cases, take care when judging theapplicability of adoption and selecting the level.
(1) Flow a current of 20 A at a power supply frequency into thetest wire, and confirm that there is no decrease inperformance.
(2) Flow the predetermined spike current into a test wire towhich 5Ω has been added, and confirm that there is no
decrease in performance.

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Fig. 5-2 Radiated emission limit (RE02 wide band) (Redrawn on the basis of MIL-STD-461C
Figure 3-9)

Fig. 5-3 Fig. 5 3 Radiated emission limit (RE02 narrow band) (Redrawn on the basis of MIL88

JERG-2-200-TP001
STD-461C Figure 3-8)

Fig. 5-4 Magnetic field radiation noise limit (RE01) (Redrawn on the basis of MIL-STD-461C
Figure 3-7)
Table 5-2 Individual requirements of RE02 (Example)(When other external equipment and frequency other than the S-band are used—such as using the Xband for command, etc., —specify on a project basis.)
Equipment

S band2081-2102 MHz

STT

16.0 dBμV/m

Onboard equipment in Bus Structure

29.0 dBμV/m*1: When the general requirements are more severe, the general requirements shall be prioritized.
*2: When other external onboard equipment and frequencies other than the S-band are used, specify
on a project basis.

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Table 5-3 Field radiation sensitivity limit (RS03) individual requirements (example)
Equipment
STT
CSAS
Equipment
Installed in
BUS structure

S Band2271.6MHz±15 MHz
1.5
14.5
0.5

X Band8180 MHz±150 MHz
6.5
3.0
0.5

UHF
400MHz~500MHz0.5

UHFT
2200MHz~2290 MHz0.5

RT5230 MHz~
5760 MHz
2.0

V/m
Note: When the level of the general requirements is stronger, the general requirements shall be prioritized.
The requirements for EMC from the rocket side is based on the premise of Epsilon. For cases other than
Epsilon, specify by on a project basis. Regarding external equipment including other missions, specify on a
project basis.

5.2.4.2 Test requirements for EMC
The test shall be conducted according ｒto MIL-STD-462C.
5.2.4.2.1 LISN
When measuring the noise/sensitivity of the bus power supply line, insert the LISN between the power
supply for the test and the device under test to simulate the impedance of the power supply system on
the spacecraft. The frequency characteristics of the LISN circuit and suitable impedance aredetermined by the mask of impedance of the bus and the harness. The LISN circuit shown in Fig. 5-5(an appropriate value of the circuit constant shall be decided by the projects) and the frequency
characteristics of appropriate impedance shall be used.

Fig. 5-5 LISN circuit diagram (example)

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5.3

RF system

The requirements for the RF system shall be in accordance with the Electrical Design Standard(JERG-2-200A).
5.4

Optical system

The requirements for the optical system shall be in accordance with the Electrical Design Standard(JERG-2-200A).

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Design verification methods are classified in terms of the similarity, analysis, inspection, and test.
This clause identifies the items in Chapter 4 that must be verified by test and summarizes the test
methods for the system and onboard equipment as in Table 6-1.
Note that these are just standard methods. In the actual design/manufacture/testing of actual
spacecraft, they shall be specified in each individual specification/plan document, etc., withconsideration for the phase of development of the onboard equipment, etc.
Table 6-1 Verification method
Item in Chapter 4

4.1.2.2.1

System test

Onboard equipment test(including when assembling the(including when assembling thesystem)onboard equipment)

Primary

Take measurement of the steady state(Power supply system)

power supply

voltage and ripples at the input port

Measurement shall be done at thebusof the electrical consuming

output port of the power supply

equipment.

system.

Basically, it shall be conducted by

If at all possible, conduct the test

using the solar-array simulator

by using the SAS/BTS or the(SAS), battery simulator (BTS), or

actual battery for the system test.

actual battery.

The load conditions at the test

As the test condition, it shall beshall be the maximum andcarried out by a combination ofminimum conditions.

max./min. solar battery output and(Electrical consuming equipment)

max./min. load power.

Conduct a performance test of theonboard equipment at the
maximum and minimum states of
the input port voltage of theonboard equipment.

4.1.2.2.5

Transient

Take measurement of the disturbance(Power supply system)

voltageat the steady state associated with theTake measurement of the bus

characteristics

on/off status of the large electric

voltage behavior due to the on/offof primary

power load.

status, quasi-short circuit ofpower supply

dummy load, etc.

bus

(Electrical consuming equipment)
Disturbances in the nominal stateshall be tested as the EMC testing.

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Item in Chapter 4

4.1.2.2.6

ODC bus

System test

Onboard equipment test(including when assembling the(including when assembling thesystem)onboard equipment)

Take measure of the ignition(Ignition controller)

current/ignition time, etc. under theTake measurement of the ignition

dummy pyrotechnic load.

current/ignition time, etc. under the

As the test condition, it shall bedummy pyrotechnic load.

conducted under the max./min.

As the test condition, it shall be

conditions of supply voltage andcarried out under the max./min.

max./min. conditions of the load.

conditions of input voltage andConfirm the ignition function withmax./min. conditions of the load.

the actual pyrotechnic.
4.2, 4.3

Command

Confirmation about transmission of(Onboard equipment of DH

HK dataoverall command

system)Confirmation of command waveform

Confirmation by using a load

Confirmation about reception ofdummy

overall HK data

(Electrical consuming equipment)
Confirmation by using thesimulator for onboard equipmentof DH system

4.6.6.2

Protection by

Confirmation of over current

over current

protection characteristics

shutdown
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A.1 Objectives of this template
This document shows the necessary requirements to carry out electrical design for scientificspacecrafts, which considers the electrical interface, best practice and notes when developing such
equipment that include new technology, and those equipment frequently applied.
Fig. A shows the framework of this document. It is also necessary for a project to refer to thecorresponding design such standard, as power generation, electrical storage, and communication
mainly related to bus equipment, the standard relating to optical equipment, and the EMC design
standard.
Also, this standard shall be prior to other document, which describes any duplication, etc.

JERG-2-200
Electrical DesignStandard(INDEX)
1.------2.------3.------4.------5.------6.-------

JERG-2-200-TP001
Scientific Satellite
Design Standard(INDEX)
1.------＋α2.------Descriptionfor3.------scientific satellite
4.------5.------6.------＋α7.------・EMC
・Power・Comm・etc.

Conformity of Index

JERG-2-241
EMC
JERG-2-214
Power Supply
JERG-2-400
Communication

Small Scientific Satellite
Electrical Design STD
SP-101

ASTRO-HElectrical
STD
ASTH-101

DesignHayabusa2 Onboard
Equipment
Electrical
Design STD
PME-210011

WG27 Activity
Identify
difference
Identify mutualreferences
Support formaking TP

SOLAR-B
Electrical Design
STD SLB-120

Fig. A-1: Configuration of the electrical design standard for scientific spacecrafts
A.2: About the requirement descriptions in the design standard (Where is the requirement written?)
Fig. A-2 shows the configuration of the spacecraft and onboard equipment assumed in thisdocument, which describes in some clauses the requirements as system, subsystem, and onboard
equipment, and shows in other clauses the wire harness, connector, and parts according to their94

JERG-2-200-TP001
necessity.
Such requirements regarding grounding and insulation, antistatic, and EMC, are shown as system,
subsystem, and the onboard equipment, and in this document are as follows;• Grounding and insulation
4.6.3 shows the requirements for the system, subsystem, and onboard equipment, which is related
existing JERG-2-213 Insulation design standard.
• Antistatic
4.6.4 “Antistatic in the low vacuum environment,” refers to JERG-2-211 Electrostatic charge &electric discharge design standard, which are the requirements for system, subsystem, equipment,
etc. under the exposed environment.
• EMC
Clause 5.2 “EMC” shows requirements for the system, subsystem, and onboard equipment, whichis related to existing JERG-2-241 EMC design standard.
Regarding the derating, the targets of requirements are the wire harness, connector, and parts, andin this document, the requirements are shown below.
• Derating
The requirements are shown in 4.6.1 “Wire harnesses,” 4.6.2 “Connectors,” and 5.1.3 “Parts”,
which is related to JERG-2-212 Wire derating design standard.

■ Satellite: electric(system/subsystem:
electric)

Wire harness

Connectors

Power supply feeding subsystem

Power supply reception subsystem

Mission equipment
Subsystem■ Onboardequipment: electric• Bus equipment• Mission equipment

Harnesses(between modules)

Technical
requirements
Derating
Antistatic
EMC
Grounding andinsulation---

Connectors

Module/printed-circuit board
Parts

Fig. A-2: Configuration of the spacecraft and onboard equipment presupposed in the electricaldesign standard for scientific spacecraft95

JERG-2-200-TP001

A.3: Outline of comparison between new version and old version of standards

In developing this Template for Electrical Design Criteria, various electric standards of the spacescience projects were studies in a cross-sectional manner. This document is outlined according to theindex of the electrical design standard (JERG-2-200).

[1] JERG-2-200A Electrical design standard[2] JERG-2-200-TP001 Template for Electrical Design Criteria[3] JERG-2-020 Previous Electrical design standard for scientific spacecrafts

JERG-2-200-TP001 is compiled to correspond the index of the electrical design standard (JERG-2200A). Furthermore, those requirements described in previous JERG-2-020, which are not described
in JERG-2-200A, have been discussed in JAXA Design Standard Working Groupe #27; Theelectrical design criteria for scientific spacecraft, and the table of contents of [2] have beencoordinated, and some clause numbers have been added or designated as vacant numbers.

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