Jpn. J. Appl. Phys. Vol. 37 (1998) pp. L 855–L 858
Part 2, No. 7B, 15 July 1998
c 1998 Publication Board, Japanese Journal of Applied Physics

Suppression of Geometric Component of Charge Pumping Current
in Thin Film Silicon on Insulator Metal-Oxide-Semiconductor
Field-Effect Transistors
Tran Ngoc D UYET1,∗ , Hiroki I SHIKURO1 , Makoto TAKAMIYA1 ,Takuya S ARAYA1 and Toshiro H IRAMOTO1,2
1 Institute of Industrial Science, University of Tokyo, 7–22–1 Roppongi, Minato-ku, Tokyo 106–8558, Japan
2 VLSI Design and Education Center, University of Tokyo, 7–3–1 Hongo, Bunkyo-ku, Tokyo 113–8656, Japan(Received April 14, 1998; accepted for publication May 27, 1998)

A new reverse pulse method is proposed for precise measurement of charge pumping current in silicon on insulator metaloxide-semiconductor field-effect transistors (SOI MOSFETs), where the reverse pulse voltage is applied to the body only at
the gate voltage rise time. The majority carries of the high resistive body region can be completely removed by applying thereverse pulse to the body. Therefore, the undesirable, geometry-dependent component which causes imprecise measurementof the interface trap density on SOI MOSFETs is suppressed. This method also suppresses the reduction of effective channel
length which takes place when using a DC reverse bias. It is demonstrated that the accurate measurements of the interface
density on SOI MOSFETs are possible.
KEYWORDS: SOI MOSFET, charge pumping, geometric component, effective channel length, DC reverse bias, pulse reversebias

1. Introduction
Charge pumping (CP)1, 2) is a very sensitive method
for the characterization of low concentrations of interface states (109 cm−2 eV−1 ) in short-channel metal-oxidesemiconductor (MOS) devices. The principle of the conventional CP method3, 4) is to repeatedly switch the gate fromaccumulation to inversion and vice versa, while keeping thesource, drain and body contacts grounded or slightly reverse
biased. During accumulation, some of the majority carriers
provided by the body are trapped on the interface states. During the rising edge of the gate pulse, the mobile majority carriers are collected rapidly from the accumulation layer by thebody, and then the trapped majority carriers recombine withthe minority carriers provided by the source and drain. Similarly, during the falling edge of the gate pulse, when the gate
surface is pulsed from inversion to accumulation, the trappedminority carriers recombine with majority carriers. These recombination processes give rise to a dc charge-pumping current (Icp ) in the body (of the same magnitude as an oppositesign current flowing through the source and drain contacts),
which is a frequency-amplified measurement of the densityof interface states. A major problem of the CP measurementon MOSFETs is the so-called “geometric component” of theCP current,1, 4) which occurs if all mobile carriers of one type,majority carriers during the rise and minority ones during thefall of the gate pulse, are not removed rapidly enough before
the arrival of the other type of carrier. The carriers that areleft behind will recombine with carriers of the other type andtherefore an additional component of CP current that does not
involve the interface states arises. This undesirable parasitic
component of Icp is responsible for an unacceptable overestimation of interface state density.
In SOI MOSFETs, particularly in thin film SOI devices,where the resistivity of the body region is comparatively high,this parasitic recombination tends to occur more often, disrupting information from the interface . The geometric component can be suppressed using the reverse bias method.5)

However, using this method, the effective channel length isalso undesirably reduced, therefore the imprecise results of
the CP current and consequently, an underestimation of theinterface state density might be mistakenly obtained. In thispaper, we present a new method to suppress both the parasitic
geometric effects and the reduction of the effective channel
length.
2. Experimental
The devices used in this study are fully-depleted SOINMOSFETS fabricated on SIMOX wafers with n+ polysilicon gate. Figure 1 shows the top view of the fabricated devices. The Si film thickness is 100 nm and the average doping
concentration of the body is N̄ = 1017 cm−3 . The thicknessesof the gate oxide and buried oxide are 5 nm and 98 nm, respectively. For source, drain and the main part of gate polysiliconregions phosphorus was implanted at 25 keV at a dose of 1015
cm−2 , while for the body contact, boron ions were implanted
at 110 keV with a dose of 1015 cm−2 . It should be noted thatboron ions were also implanted to the gate poly region near
the body contact. Therefore, the gate poly has both n+ andp+ regions. The effective gate width is W = 20 µm whereas
the gate length is L g = 5 µm.

∗ E-mail address: duyet@nano.iis.u-tokyo.ac.jp

Fig. 1. Top view of the fabricated SOI devices.
L 855

L 856

Jpn. J. Appl. Phys. Vol. 37 (1998) Pt. 2, No. 7B

The experimental setup for the new charge pumping measurements on SOI MOSFETs is shown in Fig. 2. The gate ofa MOS transistor is connected to a pulse generator, and a DC
reverse bias or pulse reverse bias is applied to the body while
the current flowing through the source and drain contacts ismeasured.
3. Results and Discussion
Figure 3 shows the results obtained from the variable amplitude CP method, in which the base level of the pulse, VGL ,is fixed while the CP current is measured as a function of theamplitude (i. e. VGH -VGL ) by varying VGH . A strong dependence on the rise/fall time (tr , tf ) can be clearly observed. The
measured CP current at the long rise and fall time tr = 1µs,tf = 1µs is considered as reference data where the minimum
distribution of the geometric component is adjusted.
Two stepwise increases in the CP current are observed.
Tseng et al. also reported the similar results and attributed
the second stepwise increase to interface states at the edges.6)

Fig. 2. Experimental setup for charge pumping measurement on SOIMOSFETs.

Fig. 3. (a) Illustration of applied voltage in the variable amplitude CP
method. (b) Charge pumping current as a function of the top level of thegate pulse. Rise and fall times are changed. Reference data do not haveany geometric component.

T. N. D UYET et al.

In our data, however, the ratio of the magnitudes of the CP
currents and the difference of the gate voltages VGH at whichthese currents start to increase are around 1:3 and 1 V, respectively, being nearly equal to the ratio of the areas and the difference of the work functions of the n+ and p+ polysilicongate regions. It is concluded, therefore, that the second stepwise increase is due to the influence of the p+ polysilicon andnot to edge effects. The influence of this p+ polysilicon region does not affect the results discussed in this paper. The
CP current at the rise and fall times tr = 1µs, tf = 0.1µs is
not significantly different from that in the reference data. A
small difference of these CP currents can be understood as thechange of energy windows which can be scanned by the gate
pulses at different fall times. The channel length (L g = 5 µm)
is short enough to allow the mobile electrons to flow back tothe source and drain contacts before the accumulation layer
is formed. The measured CP current here is attributed to theinterface state recombination, and does not involve bulk recombination. From these results, it can be simply concluded
that in SOI NMOS devices where L g = 5 µm, the mobile
electrons do not play an important role in inducing the geometric current at least at a fall time tf = 0.1 µs.
However, one can easily see from this figure, as the risetime decreases to tr = 0.1 µs, the CP current increases dramatically. The origin of this overshoot current was originally explained in ref. 5. During rise time, the gate surface
goes from accumulation to inversion. Electrons come fromthe source and drain while holes in the channel are forced
to leave and are collected by the body contact. In SOI devices, however, since body contact is only on one side of thedevice resulting in the relatively high resistivity of the bodyregion, some of the holes do not have enough time to travel
through the entire channel width (20 µm in this case) before
the electrons rush in, and these holes may recombine with theincoming electrons before they are collected. This parasitic
recombination is added to the interface-state-based CP current, therefore, the overvalued CP current is experimentallyobserved for the short rise time. The major cause of this undesirable added component is believed to be the result of theinefficiency of the body contact to collect carriers. An illustration of the mobile carriers in the channel during rise andfall time tr , tf is shown in Fig. 4.
To control this extremely unfavorable component, the DC
reverse method5) has been proposed where a DC reverse bias
is applied to the body as shown in Fig. 5. Compared to the reference data at the long rise and fall time (tr = 1 µs, tf = 1 µs)
where the CP current is assumed to not have a geometric component, the recombined Icp at tr = 0.1 µs, tf = 1 µs andVbody = 0 V is comparatively high due to the added geometric component. The geometric component significantlydecreases with an increase in the DC reverse bias. The result with the body contact voltage, Vbody = −0.5 V, shows
practically no geometric component in Icp at a rise time as
short as 0.1 µs. However, as the applied body bias continues
to slightly increase, the CP current steeply decreases due tothe effect of shortening of the effective channel length resulting from an expansion of the depletion regions surrounding
the source and drain. The difference between the curves atVbody = −0.5 V and -0.6 V shows that it is extremely difficult to determine a suitable reverse voltage in the DC bodymethod in order to suppress the geometric component with-Jpn. J. Appl. Phys. Vol. 37 (1998) Pt. 2, No. 7B

Fig. 4. Illustration of mobile carriers in the channel during rise and falltimes (tr , tf ) of the gate pulse. The vertical axis shows gate voltage, electron and hole concentrations. (a) Electrons and holes have enough time
to flow back to source, drain and body contacts, respectively (rise and falltimes tr = 1 µs, tf = 0.1 and 1 µs). (b) Holes are not removed rapidly
enough before the arrivals of electrons (rise time tr = 0.1 µs). The remaining holes recombine with the incoming electrons, resulting in parasitic recombination current.

T. N. D UYET et al.

L 857

Fig. 6. The reverse pulse method: (a) The waveforms of the pulses applied
to the gate and body contacts. (b) Body pulse top level dependence of thecharge pumping current.

Fig. 5. DC body bias dependence of the charge pumping current.

Fig. 7. Charge pumping current as a function of DC body bias Vbody andbody pulse top level Vp : The DC reverse and pulse reverse methods arecompared. The horizontal axis is Vbody for the DC reverse method and Vp
for the reverse pulse method.

out the effect of shortening of the channel length and it is also
expected that this shortening effect of the channel length will
become even more significant as the devices are scaled down.
Since the geometric component is caused by the holes nothaving enough time to flow back to the body contact only
during the rise time of the gate voltage, the reverse pulse bias
is applied on the body contact only at the rise time to improve the situation in the proposed reverse pulse method. The
waveforms of the pulse voltages applied to the gate and thebody contacts used in the reverse pulse method are shown inFig. 6(a). The body pulse bias is ‘ON’ only at the rise edgeof the gate pulse and ‘OFF’ at all the rest of it. It is clearthat the body pulse bias does not influence the device when
the gate surface is accumulated and inverted. As can be seenfrom Fig. 6(b) where the body pulse top level dependence of
the CP current is displayed, an increase in the top level Vp
leads to a marked decline in the geometric current. When thetop level Vp = −0.6 V, the result shows the same effect in
restraining the geometric component as when using the DC
reverse bias at Vbody = −0.5 V. In addition, even when increasing the top level to Vp = −0.8V, the CP current does notdecrease, remaining nearly constant as indicated in the reference data. It is obvious that the reverse pulse bias does notaffect the effective channel length.
The comparison of both methods is illustrated in Fig. 7
where the recombined Icp is plotted as a function of the DC
reverse voltage Vbody and the top level of the pulse bias Vp .
The horizontal axis is Vbody for the DC reverse method andVp for the reverse pulse method. When Vbody and Vp are
0 V, the large geometric component is observed. As Vbody andVp increase, both methods effectively suppress the geometriccomponent until -0.5 V. However, when Vbody and Vp exceed-0.5 V, the measured CP current using the DC reverse method
decreases sharply due to the reduction of effective channel

L 858

Jpn. J. Appl. Phys. Vol. 37 (1998) Pt. 2, No. 7Blength L eff while that of the proposed reverse pulse method
levels off. The results in Fig. 7 reveal that by using the reverse pulse method, one can not only suppress the geometric component in the CP current, but also avoid the effect ofshortening of the channel length.
The reverse pulse method can be similarly used by applying
the pulse bias to the source and drain contacts of the devices
where mobile minority carriers (electrons for NMOS) are amajor cause of the parasitic geometric current.
4. Conclusions
A new reverse pulse method to suppress the geometriccomponent in the CP current in thin film SOI MOSFETs has
been developed. Since the reverse pulse bias is applied tothe body contact only at the rise time of the gate pulse, theelectrical parameters of the device are not affected during theinterface state recombination process (accumulation and inversion of the gate surface). The reverse pulse method showsan advantage over the DC reverse method in that it does notT. N. D UYET et al.

cause an undesirable effect from shortening of the channel
length. Therefore, precisely measured CP current and consequently, an accurate evaluated interface state density of thedevices can be obtained. This new method is also expected
to be more powerful in scaled MOS devices where a slight
reduction in the effective channel may lead to a significant
decrease in the charge pumping current.

1) J. S. Brugler and P. G. A. Jespers: IEEE Trans. Electron Devices 16(1969) 297.
2) H. Haddara: Characterization methods for submicron MOSFETs(Kluwer Academic Publishers, Massachusetts, 1995) Chap. 3, p. 67.
3) A. B. M. Elliot: Solid-State Electron. 19 (1976) 241.
4) G. Groeseneken, H. E. Maes, N. Belmán and R.F.D. Keersmaecker: IEEE
Trans. Electron Devices 31 (1984) 42.
5) Y. Li and T. P. Ma: Proc. Int. Symp. VLSI Technology, Systems & Applications, 1995 (IEEE, Taiwan, 1995) p. 144.
6) Y. C. Tseng, J. Collett, T. O. Vu, J. S. Cable and J. C. S. Woo: Proc. Int.
SOI Conf. 1996 (IEEE, Florida, 1996) p. 90.