BM56 Series

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

0.35mm Pitch, 2.2mm Width, 0.6mm Stacking Height,
Multi-RF Compatible FPC-to-Board Connector

Jan. 2023

BM56 Series/0.35mm Pitch, 2.2mm Width, 0.6mm Stacking Height, Multi-RF Compatible FPC-to-Board Connector

1. Compact, Multi- RF capable
FPC Connector, World' s
Smallest Width Class

2.2mm

Features

Header

2.2mm

3.7mm

Pitch : 0. 35mm, Width: 2. 2mm,
Stacking Height : 0. 6mm

Receptacle

Mated Condition
0.6mm

2. Contact Design Ideal for Both
Digital and RF Signal

Conventional Connection
1 Board-to-Board Connector +2 RF Connectors

BM56G

Support Multiple RF andDigital Signals
with 1 FPC Connector
3.7
2.2

7.0

4.0

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

3.34mmPCB
Mounting Space

28mm2

71% Size
Reduction

PCB
Mounting Space8.14 mm2

Digital and RF Signals Combined

3. Superior RF Signal
Transmission
V. S. W. R.
DC to 1GHz : 1. 2 Max.
1 to 6GHz : 1. 3 Max.
6 to 20GHz : 1. 5 Max

4. Double Shield Enhances EMI
Prevention

Without Shield
Conventional Product (BM28)

Good EMI Resistance

2Double Shield
BM56G

BM56 Series/0.35mm Pitch, 2.2mm Width, 0.6mm Stacking Height, Multi-RF Compatible FPC-to-Board Connector

5. Robust Mating Guides

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

Metal Guide Design

6. Halogen- free
No chlorine or bromine exceeding the standard
values are used in this connector.
In accordance with IEC 61249- 2- 21
Br : 900ppm max, Cl : 900ppm max, Br+ Cl : 1500ppm max

Applications
Devices that require low- profile, compact design such as smartphones, wearable terminals and tablet PCs.

Conventional Internal Connection

New Connection Proposal

RF Connection: RF Cable + RF Connector
Other Connections: FPC + Board-to-Board Connector

Connect RF and Other Signals withFPC and FPC-to-Board Connector

Other Connections

RF Cable + RF Connector

FPC + FPC-to-Board Connector

BM56G

Integrating FPC
andFPC-to-Board

FPC can be placed on top of the battery
No space for other parts

Other parts can be mounted

3FPC

BM56 Series/0.35mm Pitch, 2.2mm Width, 0.6mm Stacking Height, Multi-RF Compatible FPC-to-Board Connector

Product Specifications
Rated Current

Signal Contact : 1.0A

Operating Temperature (Note 1)-55 to ＋ 85℃

Rated Voltage

30V AC/DC

Operating Humidity Range (Note 2)

90% RH Max.

Storage Temperature Range (Note 3)-10 to ＋ 60℃

Storage Humidity Range (Note 2)(Note 3)

90% RH Max.

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

Characteristic Impedance

Items

50 Ω

Rated Frequency

Specifications

DC to 20GHz

Conditions

ContactResistance

Signal Contact 50m Ω Max.

Measured at 20mV AC, 1kHz, and 1mA

Insulation
Resistance

100 ＭΩ Min.

Measured at 100V DC

Withstanding
VoltageNo flashover or dielectric
breakdown

150V AC for 1 min.

MatingDurability

Signal Contact 50m Ω Max.

10 cycles

Vibration
ResistanceNo electrical discontinuity of 1μ sor more.

Frequency : 10 to 55Hz ; half amplitude of 0.75mm,10 cycles in each of 3 axis
directions for 5 minutes/cycle, 10 cycles each, 30 cycles total

Shock
ResistanceNo electrical discontinuity of 1μ sor more.

Acceleration : 450m/s2, duration : 11ms, 3-axis half sine wave in 3 directions, 3cycles for each

Humidity
Resistance

Signal Contact : 50m Ω Max.
Insulation Resistance : 50M Ω Min.

Left for 96 hours at a temperature of 40 ± 2℃ and a humidity range from 90 to95%

Temperature
Cycle

Signal Contact : 50m Ω Max.
Insulation Resistance : 50M Ω Min.

-55℃ for 30 minutes → +85 for 30 minutes,
5 cyclesSolder HeatResistance

No dissolution or resin meltingthat will affect performance.

Reflow : At recommended temperature profile
Hand solde : Solder iron temperature of 350℃ for 3 seconds Max.

V.S.W.R.

DC to 1GHz : 1.2 Max.
1 to 6GHz : 1.3 Max.
6 to 20GHz : 1.5 Max

Note 1 : Includes temperature rise caused by current flow.
Note 2 : Use without condensation.
Note 3 : Storage refers to long-term storage of unused items before they are mounted on the PCB.
Operating temperature and humidity range apply when the product is not powered after PCB mounting and when temporarily stored during transportation.

Materials / Finish
PartHeader
Receptacle

Component

Materials

FinishUL Standard

Insulator

LCPBlack

Contact

Copper Alloy

Gold Plated-Shield

Copper Alloy

Gold Plated-4UL94V-0

BM56 Series/0.35mm Pitch, 2.2mm Width, 0.6mm Stacking Height, Multi-RF Compatible FPC-to-Board Connector

Product Number Structure
Refer to the chart below when determining the product specifications from the product number.
Please select from the product numbers listed in this catalog when placing orders.
● Header/Receptacle

BM56G - 10 DP - 0.35 V（##)❶❷❶ Series Name

❹

❺

❻

BM56G

❹ Contact Pitch

0.35mm❷ Contacts

10❺ Terminal Design

V : Straight SMT❸ Connector TypeDP : Header
DS : ReceptaclePlating❻ Specifications
and Packaging(51) : Standard, Embossed Packaging(20,000pcs per reel)(53) : Embossed Packaging(1,000pcs per reel)No. of Signal

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

❸5BM56 Series/0.35mm Pitch, 2.2mm Width, 0.6mm Stacking Height, Multi-RF Compatible FPC-to-Board Connector

Header
A
B

0.86

2.2

0.82

P=0.35

0.46

0.58

0.13
P=0.35C(Mask Thickness : 0.08mm)

2.2±0.01

J±0.01
P＝0.35±0.01

K±0.010.19±0.01

0.18±0.01

0.18±0.01

0.78±0.02

0.25±0.01

0.35±0.02

0.63±0.02

0.25±0.02

0.21±0.02

0.19±0.01

0.18±0.02

0.18±0.020.26±0.01

0.19±0.02
0.24±0.01

P=0.35±0.02

E±0.020.21±0.01

F±0.020.35±0.01

G±0.020.63±0.01

D±0.02

1.4±0.01
1.06±0.01

0.19±0.02

0.26±0.02● Recommended Metal Mask Dimensions

1.4±0.02
1.06±0.02

0.24±0.02● Recommended PCB Layout

2.2±0.02

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

0.12

0.78±0.01
L±0.01

H±0.02

M±0.01
N±0.01

Unit : mm

Purchase Unit
Part No.

BM56G-10DP-0.35V(##)

HRS No.

CL0673-7500-0-##

No. of Pos.

10AB

CDEFG

3.7

1.4

2.61

3.8

1.4

1.05

2.27

HJKLMN

2.61

3.8

1.4

1.05

2.27

2.61

Note : This connector has no polarity.

6(##) : (51)(##) : (53)

20,000pcs
per reel

1,000pcs
per reelBM56 Series/0.35mm Pitch, 2.2mm Width, 0.6mm Stacking Height, Multi-RF Compatible FPC-to-Board Connector

Receptacle
AB

2.2

1.35

P=0.350.52
P=0.35
0.5
C● Recommended Metal Mask Dimensions(Mask Thickness : 0.08mm)

0.25±0.01

0.26±0.01

1.6±0.01

0.22±0.01

P=0.35±0.01
0.18±0.01

0.7±0.01

2.2±0.01

0.25±0.02

J±0.01
K±0.011.55±0.01
0.61±0.01

0.26±0.02

1.6±0.02

0.18±0.02

0.7±0.02

P=0.35±0.02

0.19±0.01

D±0.02
E±0.020.22±0.02

0.19±0.02● Recommended PCB Layout

2.2±0.02
1.55±0.02
0.16±0.02

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

0.12

0.7±0.02

0.21±0.02
0.35±0.02

0.21±0.01

F±0.02
G±0.020.7±0.01

0.35±0.01
L±0.01

H±0.02

M±0.01
N±0.01

Unit : mm

Purchase Unit
Part No.

BM56G-10DS-0.35V(##)

HRS No.

CL0673-7501-0-##

No. of Pos.

10AB

CDEFG

3.34

1.4

2.29

3.6

1.4

1.05

2.29

HJKLM

N

2.37

3.6

1.4

1.05

2.29

2.37

Note : This connector has no polarity.

7(##) : (51)(##) : (53)

20,000pcs
per reel

1,000pcs
per reelBM56 Series/0.35mm Pitch, 2.2mm Width, 0.6mm Stacking Height, Multi-RF Compatible FPC-to-Board Connector

Packaging Specifications Diagram
IEC 60286-3, JIS C 0806 CompliantHeader●Reel Dimensions
φ1.5
Feed Holed-d0.23.0±φ1C±1D±1

Note: The (53) speciﬁcation is φ180 ±2.
0.2±0.15
0.7±0.15

dbbb-bUnreeling Direction

Unit : mmPart No.

No. of Pos.

AB

CD

105.5

12.0

13.4

17.4

BM56G-10DP-0.35V(##)

Receptacle●Reel Dimensions
φ1.5
Feed Holed-d0.23.0±φ1

Note: The (53) speciﬁcation is φ180 ±2.

b-b

C±1
D±1

0.2±0.15
0.7±0.15dbφ80±1dA±0.1
B±0.3.1+0 04.0±0.1

φ380±2 (Note)

2.0±0.1
4.0±0.1

1.75±0.1●Embossed Tape Dimensions.5φ1

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

A±0.1.1+0 0d

φ380±2 (Note)

4.0±0.1

B±0.3.5
φ1

2.0±0.1
4.0±0.1φ80±11.75±0.1●Embossed Tape Dimensionsb
Unreeling Direction

Unit : mm

Part No.
BM56G-10DS-0.35V(##)

No. of Pos.

ABCD

105.5

12.0

13.4

17.48

BM56 Series/0.35mm Pitch, 2.2mm Width, 0.6mm Stacking Height, Multi-RF Compatible FPC-to-Board Connector

Temperature (℃)

Usage Precautions
250220℃60 sec.
Max.

200180℃
150

Recommended
Temperature Profile

250℃150℃
90-120 sec.

10050NormalTemperatureSep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

050

100

150

200
250300
Heating Time (sec.)【Conditions】
1. Peak Temperature : 250℃
2. Heating : 220℃ min. for 60 sec. max.
3. Preheating : 150 to 180℃, 90 to 120 sec.
4. Number of Reﬂow Cycles : 2 cycles max.
Note 1 : Temperature refers to the surface temperature of theboard near the connector lead.
Note 2 : When using nitrogen reﬂow, oxygen concentrationmust be 1000 [ppm] or more for mounting.
If it is less than 1000 [ppm],
please contact a Hirose representative.

Recommended Manual
Soldering Conditions

Soldering iron temperature : 340 ± 10℃ ;Soldering time : within 3 seconds

Recommended Metal Mask
Thickness and Open Area toPCB Pattern Area Ratio

Thickness : 0.08mm
Aperture Ratio : Header Side : 100%, Receptacle Side : 100%

Board Warpage

Max. of 0.02mm at the center in reference to both ends of the connector

Cleaning

Cleaning is not recommended.
If you clean this product, please evaluate its performance before using it.
(Cleaning may impair the mating/unmating properties and lower resistance to environmental factors.)

Precautions

・Be careful when mating/unmating the connector when it is not mounted on thePCB as it may cause damage/deformation to contacts.
・Avoid supporting the PCB only with the connectors.
Support it by other means such as bolts, screws, posts, etc.
・Excessive prying during unmating/mating may result in damage.
・In the case of hand soldering, please do not apply any flux which could cause flux wicking.
・This product may have slight color differences due to production lot variability,
but this does not affect the performance.
・Please refer to the following page for handling precautions when inserting and removing.
・Because the product can disengage if dropped(or other impact), or by FPC routing, it is advised to secure the mated connectors tothe board with housings and cushioning materials.
・Do not use the connector in non-recommended conditions(i.e., rated current, rated voltage, PCB design and operating environment, etc.).
Such usage could lead to material outgassing, ignition, or short-circuit, etc.
Refer to the specifications and guidelines for board pattern dimensions,board cautions, and connector treatment.
Please contact Hirose if connector usage in conditions other than those described in thespecifications and the guidelines is being considered.

9BM56 Series/0.35mm Pitch, 2.2mm Width, 0.6mm Stacking Height, Multi-RF Compatible FPC-to-Board Connector

Connector Handling Precautions【 Mating Disengagement Prevention】
Please use cushioning.
This connector may come off due to impact such as dropping.
Cushioning should be large enough to cover the entire connector.

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

Cushioning【 Mating Method】
1．Locate the guide port and align. This product has a guide rib on the header to ensure proper engagement.
Align the connector so that it is in this position.

2. Once aligned, the connector engages. You can feel the mated height of the connector lower.

Move the connector forward and backward,
left and right to ﬁnd the guide port.

Move Slightly

The mated height lowers
to the perfect mated condition.

10

BM56 Series/0.35mm Pitch, 2.2mm Width, 0.6mm Stacking Height, Multi-RF Compatible FPC-to-Board Connector

3. In the engaged state, the connectors are parallel to each other, and the connectors cannot move forward,backward, left, or right. Complete mating from this state.

Move Slightly

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

4. Check that mating is completed.
If one side is floating, or if it is mated at a diagonal, remove and re- mate.

11

BM56 Series/0.35mm Pitch, 2.2mm Width, 0.6mm Stacking Height, Multi-RF Compatible FPC-to-Board Connector【 Handling Precautions for Connector Removal】

Sep.1.2024 Copyright 2024 HIROSE ELECTRIC CO., LTD. All Rights Reserved.

1. When removing the connector, it is preferable to pull it out in the upward direction from the connector
mounting surface.
However, when removing the FPC from the circuit board it becomes more difficult to remove it verticallywith higher pin counts and thin FPCs.

2. If difficult to remove, extract the connector diagonally in the direction of the pitch.
Note that removal from the widthwise side will apply a large load to the contacts.
When removing from the width direction, pull the end of the FPC in the upward direction.
( When a force is applied in the horizontal direction, a large load is applied to the contact. )3. If the FPC does not have sufficient rigidity, solder stripping or connector breakage may occur.
Please use it after checking the repetitive operation with a flexible board in advance,such as during a trial manufacture run.
Refrain from holding the corner of the flexible board and removing it diagonally as it will result in a large load to thecontacts.

While Taking into Consideration
Specifications mentioned in this catalog are reference values.
When considering to order or use this product, please confirm the Drawing and Product Specifications sheets.
Use an appropriate cable when using the connector in combination with cables.
If considering usage of a non- specified cable, please contact your sales representative.
If assembly process is done by jigs & tools which are not identified by Hirose, assurance will not be given.
If considering usage for below mentioned applications, please contact your sales representative.
In cases where the application will demand a high level of reliability, such as automotive, medical instruments, publicinfrastructure, aerospace/ defense etc. Hirose must review before assurance of reliability can be given.

HIROSE
2-6-3,Nakagawa Chuoh,Tsuzuki-Ku,Yokohama-Shi 224-8540,JAPANhttps://www.hirose.com※ The contents of this catalog are current as of date of 1/ 2023. Contents are subject to change without notice for the purpose of improvements.
※ The HRS logo and "HIROSE" are trademarks of HIROSE ELECTRIC CO., LTD.

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