http://support.spring8.or.jp/Report_JSR/PDF_JSR_31A/2019A1618.pdf

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2019A1618BL19B2ࣇ࢙ࣀ࣮ࣝᶞ⬡/࢔࣑ࣝ⟩」ྜᮦࡢ⇕◳໬㐣⛬࡟࠾ࡅࡿᶞ⬡/࢔࣑ࣝ⏺㠃ࡢṧ␃ᛂຊࡑࡢሙほᐹ
Residual Stress Analysis at the Interface between Phenolic Resins andAluminum-foil during Curing Process.
࿴Ἠ ⠜ኈ, ຍࠎⰋ ๛ᚿ
Atsushi Izumi, Takeshi Kakaraఫ཭࣮࣋ࢡࣛ࢖ࢺ㻔ᰴ㻕
Sumitomo Bakelite Co., Ltd.
࢞ࣛࢫ⧄⥔ࢆྵ᭷ࡍࡿࣇ࢙ࣀ࣮ࣝᶞ⬡ᡂᙧ⏝ᮦᩱࢆ⏝࠸ࡓࣇ࢙ࣀ࣮ࣝᶞ⬡/࢔࣑ࣝ⟩」ྜᮦ࡟ࡘ࠸࡚ࠊ⇕◳໬㐣⛬࡟࠾ࡅࡿᶞ⬡/࢔࣑ࣝ⟩⏺㠃ࡢṧ␃ᛂຊኚ໬ࢆ X ⥺ᅇᢡἲ࡟ࡼࡾࡑࡢሙほᐹࡋࡓࠋ⏺㠃ࡢṧ␃ᛂຊࡣࠊ஧ḟඖ᳨ฟჾ Pilatus 300K ࢆ⏝࠸࡚ Al㻔422㻕㠃ࡢᅇᢡࣉࣟࣇ࢕࣮ࣝࢆ ᐃࡋࠊsin2 Ȍ ἲ࡟ࡼࡾゎᯒࡋࡓࠋࡑࡢ⤖ᯝࠊ࢞ࣛࢫ⧄⥔ࢆྵ᭷ࡍࡿࣇ࢙ࣀ࣮ࣝᶞ⬡ᡂᙧ⏝ᮦᩱࡢ⇕⭾ᙇ཰⦰࠾ࡼࡧ◳໬཰⦰࡟క࠺ᶞ⬡/࢔࣑ࣝ⟩⏺㠃ࡢṧ␃ᛂຊኚ໬ࡢほ ࡟ᡂຌࡋࡓࠋ࣮࣮࢟࣡ࢻ㸸 ࣇ࢙ࣀ࣮ࣝᶞ⬡/࢔࣑ࣝ」ྜᮦࠊ⇕◳໬㐣⛬ࠊṧ␃ᛂຊゎᯒ⫼ᬒ࡜◊✲┠ⓗ㸸ࣇ࢙ࣀ࣮ࣝᶞ⬡ࡣ⇕◳໬཯ᛂ࡟ࡼࡗ࡚⦓ᐦ࡞୕ḟඖᯫᶫࢿࢵࢺ࣮࣡ࢡᵓ㐀ࢆᙧᡂࡋࠊඃࢀࡓ⪏⇕ᛶࠊᶵᲔ≉ᛶࠊ㟁Ẽ⤯⦕ᛶ࡞࡝ࡢ≀ᛶࢆⓎ⌧ࡍࡿࡓࡵࠊ㍺㏦ᶵჾࠊ㟁ᏊᶵჾࠊఫᏯ࡞࡝ᵝࠎ࡞⏘ᴗศ㔝࡟࠾࠸࡚⇕◳໬ᛶᶞ⬡࡜ࡋ࡚฼⏝ࡉࢀ࡚࠸ࡿࠋࡑࡢ〇ရᙧែࡢ୍࡜ࡋ࡚ࠊ㟁Ꮚᅇ㊰ᇶᯈ࡟⏝࠸ࡽࢀࡿ㖡ᙇ✚ᒙᯈ࡟௦⾲ࡉࢀࡿࣇ࢙ࣀ࣮ࣝᶞ⬡/㔠ᒓ」ྜᮦࡀᣲࡆࡽࢀࡿࠋ」ྜᮦࡢඃࢀࡓ
≀ᛶࡣ⇕ࣉࣞࢫᡂᙧ࠾ࡼࡧᶞ⬡ࡢ⇕◳໬ࣉࣟࢭࢫࢆ⤒ࡿࡇ࡜࡛Ⓨ⌧ࡍࡿࡀࠊࡇࡢࣉࣟࢭࢫ࡟࠾࠸࡚⥺⭾ᙇಀᩘ㸦CTE㸧ࡀ␗࡞ࡿᶞ⬡࡜㔠ᒓࡢ⏺㠃࡟ࡣ⇕ᛂຊࡀⓎ⏕ࡍࡿࠋࡇࡢ⇕ᛂຊࡀ⏺㠃࡟⵳✚ࡋࡓࡶࡢࡀṧ␃ᛂຊ࡛࠶ࡾࠊṧ␃ᛂຊࡣ」ྜᮦࡢ཯ࡾࡸ⏺㠃๤㞳࡜࠸࠺ᶞ⬡/㔠ᒓ」ྜᮦ࡜ࡗ࡚
⮴࿨ⓗ࡞୙Ⰻࡢせᅉ࡜࡞ࡿࠋᶞ⬡/㔠ᒓ」ྜᮦ࡟࠾ࡅࡿ⏺㠃ᐦ╔ಙ㢗ᛶࡢྥୖࡢࡓࡵ࡟ࡣࠊ⇕◳໬㐣⛬࡟࠾ࡅࡿṧ␃ᛂຊⓎ⏕࣓࢝ࢽࢬ࣒ࡢᢕᥱࡀ㔜せ࡞ㄢ㢟࡛࠶ࡿࠋ␗✀ᮦᩱ⏺㠃ࡢṧ␃ᛂຊゎᯒᡭἲ࡜ࡋ࡚ X ⥺ᅇᢡἲࢆ⏝࠸ࡓ sin2 Ȍ ἲࡀᣲࡆࡽࢀࡿ[1–3]ࠋᡃࠎ
ࡣࡇࡢ sin2 Ȍ ἲࢆ༙ᑟయࣃࢵࢣ࣮ࢪ⏝ᶞ⬡/㖡ᇶᯈ⏺㠃ࡢṧ␃ᛂຊゎᯒ࡟㐺⏝ࡋࠊSPring-8 BL19B2ࣅ࣮࣒ࣛ࢖ࣥ࡟࠾࠸࡚஧ḟඖ᳨ฟჾࢆ⏝࠸ࡓ▷᫬㛫ホ౯ᢏ⾡ࢆ㛤Ⓨࡋ[4–6]ࠊ᭦࡟ࣇ࢙ࣀ࣮ࣝᶞ⬡/㖡⟩」ྜᮦࡢ◳໬ࣉࣟࢭࢫ࡟࠾ࡅࡿṧ␃ᛂຊࡑࡢሙほᐹ࡟ᡂຌࡋࡓ[7–9]ࠋ୺せ࡞ࣇ࢙ࣀ࣮ࣝᶞ⬡/㔠ᒓ」ྜᮦ࡜ࡋ࡚ࡣࠊ㖡ࡔࡅ࡛࡞ࡃ࢔࣑ࣝ࡜ࡢ」ྜᮦࡶᣲࡆࡽࢀࡿࠋࡑࡇ࡛ࠊᐇ〇ရ࡬ࡢ᭦࡞ࡿᢏ⾡ᒎ㛤ࢆ┠ⓗ࡜ࡋࠊࣇ࢙ࣀ࣮ࣝᶞ⬡/࢔࣑ࣝ⟩」ྜᮦࡢ◳໬ࣉࣟࢭࢫ࡟࠾ࡅࡿᶞ⬡/࢔࣑ࣝ⟩⏺㠃ࡢṧ␃ᛂຊࡑࡢሙほᐹ࡟ࡘ࠸᳨࡚ウࡋࡓࠋṧ␃ᛂຊࡣ࢔࣑ࣝ⟩࡟స⏝ࡍࡿຊ࡜ࡋ࡚ゎᯒࡋࡓࠋᐇ㦂㸸ࣇ࢙ࣀ࣮ࣝᶞ⬡/࢔࣑ࣝ⟩」ྜᮦ࡜ࡋ࡚ࠊᶞ⬡ࢆ࢔࣑ࣝ⟩࡛ᣳࢇࡔ 3 ᒙᵓ㐀ရࢆ⇕ࣉࣞࢫ࡟ࡼࡾస〇ࡋࡓࠋᶞ⬡࡜ࡋ࡚࢞ࣛࢫ⧄⥔ࢆྵ᭷ࡍࡿࣇ࢙ࣀ࣮ࣝᶞ⬡ᡂᙧ⏝ᮦᩱࢆࠊ࢔࣑ࣝ⟩࡜ࡋ࡚⾲㠃⢒໬ฎ⌮ࡀ᪋ࡉࢀࡓ࢔࣑ࣝ⟩㸦ཌࡉ 80 ȝm; ᮾὒ࢔࣑ࣝ〇㸧ࢆ౑⏝ࡋࠊ175°C ࡛ 2 ศ㛫ࡢᅽ⦰ᡂᙧ
࡟ࡼࡾ༙◳໬≧ែࡢ」ྜᮦ㸦┤ᚄ 24 mm × ཌࡉ 1.5 mm㸧ࢆᚓࡓࠋX ⥺ᅇᢡ ᐃࡣ BL19B2 ࣅ࣮࣒ࣛ࢖࡛ࣥᐇ᪋ࡋࠊAl㻔422㻕㠃ࡢᅇᢡࣉࣟࣇ࢕࣮ࣝࢆከ㍈ᅇᢡィ㸦HUBER ♫㸧࠾ࡼࡧ 2 ḟඖ᳨ฟჾ PILATUS 300K㸦DECTRIS ♫㸧ࢆ⏝࠸࡚ ᐃࡋࡓ㸦Fig. 1㸧ࠋ⇕◳໬ࣉࣟࢭࢫࡣ X ⥺ᅇᢡᐇ㦂⏝ࢻ࣮࣒ᆺຍ⇕ࢫࢸ࣮ࢪ DHS-1100㸦Anton-Paar ♫㸧ࢆ⏝࠸ࠊ࢝ࣉࢺ
ࣥࢻ࣮࣒ෆ࡟࡚኱Ẽ㞺ᅖẼୗ࡛ᐇ᪋ࡋࡓࠋධᑕ X ⥺ࡢ࢚ࢿࣝࢠ࣮ࡣ 8.0 keV ࡜ࡋࠊධᑕഃࡢࢫࣜ
ࢵࢺࢧ࢖ࢬࡣ⦪ 1 mm × ᖜ 6 mm ࡜ࡋࡓࠋsin2 Ȍ ἲࡣ୪ഴἲ࡛⾜࠸[1]ࠊ࢜ࣇࢭࢵࢺゅ㸦Ȍ㸧ࡣ 0.0, 20.7,30.0, 37.8, 45.0°ࡢ 5 Ⅼ࡜ࡋࠊྛ Ȍ ࡛ࡢ X ⥺㟢ග᫬㛫ࡣ 10 ⛊࡜ࡋࡓࠋ⇕◳໬ฎ⌮ࡢࡓࡵࡢヨᩱຍ⇕ ᗘࣉࣟࣇ࢕࣮ࣝࡣࠊ45°C ࠿ࡽ 180°C ࡲ࡛᪼ ࠊ180°C ࡛ 8 ᫬㛫䠉㻝㻠䠉
ಖᣢࠊ180°C ࠿ࡽ 45°C ࡲ࡛㝆 ࠊ࡜ࡋࡓࠋ᪼㝆 㐣⛬࡛ࡣ 50°C ௨ୖ࡟࠾࠸࡚ 10°C 㛫㝸࡛ ᗘࢆಖᣢࡋࡓ≧ែ࡛ᛂຊ ᐃࢆ⾜࠸ࠊ180°C ಖᣢ㐣⛬࡛ࡣ⣙ 7 ศࢧ࢖ࢡ࡛ࣝᛂຊ ᐃࢆ⾜ࡗࡓࠋ᪼㝆㏿ᗘࡣs1°C/min ࡜ࡋࡓࠋ᭦࡟ࠊ෭⇕⾪ᧁヨ㦂ࢆ᝿ᐃࡋࡓ 45°C ࡜ 180°C ࡢ෭⇕ࢧ࢖ࢡࣝࢆ 2 ࢧ࢖ࢡࣝᐇ᪋ࡋࡓࠋྛ ᗘࡣヨᩱࢫࢸ࣮ࢪ ᗘࡢ್࡜ࡋ࡚ไᚚࡋࡓࠋ࡞࠾ࠊ⇕⭾ᙇࡸ◳໬཰⦰࡞࡝࡟క࠺ヨᩱ㧗ࡉࡢኚ໬ࢆ⿵ṇࡍࡿࡓࡵ࡟ࠊ༙๭ㄪᩚࢆ඲࡚ࡢᛂຊ ᐃ๓࡟ᐇ᪋ࡋࡓࠋṧ␃ᛂຊ㸦ı㸧࡜ࡑࡢㄗᕪࡣࠊ2ș*–sin2 Ȍ ⥺ᅗࡢ㏆ఝ┤⥺ࡢഴࡁ㸦㻔2ș*㻕/㻔sin2 Ȍ㻕㸧࡜ࡑࡢᶆ‽ㄗᕪࢆ⏝࠸ࠊeq. 1 ࡟ࡼࡾ⟬ฟࡋࡓࠋࡇࡇ࡛ࠊ2ș*ࡣほ ࡉࢀࡓ Al㻔422㻕㠃ࡢࣆ࣮ࢡࢺࢵࣉ࡛࠶ࡿࠋ
ı = í{E / 2㻔1 + Ȟ㻕}㻔1 / tan ș*0㻕 㻔ʌ / 180㻕 {㻔2ș*㻕 / 㻔sin2Ȍ㻕}㻔1㻕ࡇࡇ࡛ࠊı ࡢ್ࡀ㈇ࡢሙྜࡣᅽ⦰ᛂຊࠊṇࡢሙྜࡣᘬᙇᛂຊࢆ♧ࡍࠋE ࠾ࡼࡧ Ȟ ࡣ࢔࣑ࣝ⟩ࡢᙎᛶ⋡࡜࣏࢔ࢯࣥẚ࡛࠶ࡾࠊ⏝࠸ࡓ್ࡣ E = 70.6 GPaࠊȞ = 0.345 ࡛࠶ࡿࠋࡲࡓࠊ2ș*0 ࡣ Al㻔422㻕㠃ࡢ↓ṍᅇᢡゅ࡛࠶ࡾࠊୖ㏙ࡢ X⥺࢚ࢿࣝࢠ࣮࡟࠾ࡅࡿ 25 °C ࡢ್ࢆ 2ș*0 = 139.10°࡜ࡋࠊྛ ᐃ ᗘࡢ್ࡣ࢔࣑ࣝࡢ CTE = 23.1 ppm Kí1 ࢆ⏝࠸࡚⿵ṇࡋࡓࠋ2ș*ࡣࠊྲྀᚓࡋࡓ 2 ḟඖᅇᢡࢹ࣮ࢱࢆᅇᢡゅ㸦2ș㸧࡜ᅇᢡᙉᗘ㸦I㻔2ș㻕㸧ࡢ 1 ḟඖࣉࣟࣇ࢕࣮ࣝ࡟ኚ᥮
ࡋࠊ␲ఝ Voigt 㛵ᩘ࡟୍ḟ㛵ᩘࢆ࣮࣋ࢫࣛ࢖ࣥ⿵ṇ㡯࡜ࡋ࡚ຍ࠼ࡓ㛵ᩘ࡟ࡼࡿࣇ࢕ࢵࢸ࢕ࣥࢢ࡛⟬ฟࡋࡓࠋ࡞࠾ࠊ௒ᅇࡢᐇ㦂᮲௳࡟࠾࠸࡚ࠊȌ ࢆኚ໬ࡉࡏࡿࡓ Fig.1㸬 Instrumental-setup image for the
residual-stress analysis at theࡵࡢከ㍈ᅇᢡィࡢ㍈⛣ືࢆྵࡵࡓ 5 Ⅼࡢᅇᢡࣉࣟࣇ࢕࣮
BL19B2 beamline.
ࣝ ᐃ࡟せࡍࡿ᫬㛫ࡣ⣙ 2.5 ศ࡛࠶ࡾࠊࡇࡢ᫬㛫ෆࡢᵓ㐀ኚ໬ࡣ↓ど࡛ࡁࡿ࡜௬ᐃࡋ࡚ゎᯒࢆ⾜ࡗࡓࠋ300

2T * / °intensity / a.u.

250⤖ᯝ࠾ࡼࡧ⪃ᐹ㸸\ = 0.0°◳໬཯ᛂ๓ 45°C ࡟࠾ࡅࡿ Al㻔422㻕㠃ࡢ 1 ḟඖᅇᢡࣉࣟ
200\ = 20.7°
ࣇ࢕࣮ࣝࢆ Fig. 2 ࡟♧ࡍࠋᅇᢡࣉࣟࣇ࢕࣮ࣝࡣ Ȍ ቑຍ࡜150࡜ࡶ࡟పゅࢩࣇࢺࡋ࡚࠾ࡾࠊᶞ⬡/࢔࣑ࣝ⏺㠃࡟ṧ␃ᛂຊ\ = 30.0°ࡀᏑᅾࡍࡿࡇ࡜ࡀ☜ㄆ࡛ࡁࡿࠋFig. 3 ࡟♧ࡍ 2ș*–sin2 Ȍ100
\ = 37.8°⥺ᅗࡢ㏆ఝ┤⥺ࡢഴࡁࡼࡾࠊṧ␃ᛂຊࡣ 19.0 ± 0.5 MPa50
࡜⟬ฟࡉࢀࠊ࢔࣑ࣝ࡟ᘬᙇᛂຊࡀస⏝ࡋ࡚࠸ࡓࡇ࡜ࡀ᫂
\ = 45.0°0ࡽ࠿࡜࡞ࡗࡓࠋࡇࡢ⤖ᯝࡣࠊᶞ⬡/࢔࣑ࣝ」ྜᮦࡢᡂᙧ᫬
138.0 138.5 139.0 139.5 140.0࡟ࠊ⁐⼥ᶞ⬡ࡀ༙◳໬ࡍࡿࡇ࡜࡛ᶞ⬡࡜࢔࣑ࣝࡢ᥋╔⏺
2T / °
㠃ࡀᙧᡂࡉࢀ(i.e. ı § 0)ࠊ㔠ᆺࡼࡾྲྀࡾฟࡉࢀࡓᡂᙧရࡀ
Fig. 2㸬 X-ray diffraction profiles of the෭༷ࡉࢀࡿ㐣⛬࡛ࠊ┦ᑐⓗ࡟ CTE ࡢᑠࡉ࡞࢔࣑ࣝࡢ⇕Al㻔422㻕-plane at 45°C before཰⦰㔞ࡀᶞ⬡ࡢ཰⦰㔞ࡼࡾࡶ኱ࡁࡃ࡞ࡿࡓࡵ࡟ࠊ࢔࣑ࣝ
curing process. The solid lines࡟㠃ෆ᪉ྥࡢᘬᙇຊࡀస⏝ࡋࡓࠊ࡜ࡋ࡚ㄝ᫂ࡀྍ⬟࡛࠶
represent fitting curves.
ࡿࠋࡲࡓࠊ」ྜᮦࡢᵓ㐀ࡣࠊᶞ⬡ࡀ࢔࣑ࣝ⟩࡟ᣳࡲࢀࡓ
ᑐ⛠࡞ 3 ᒙᵓ㐀࡛࠶ࡿࡓࡵࠊ࣐ࢡࣟ࡞ᮦᩱኚᙧࠊࡍ࡞ࢃ
139.10slope = 0.1108 ± 0.0027
ࡕ཯ࡾ࡟ࡼࡿᛂຊ⦆࿴ࡣ㐍⾜ࡏࡎࠊᘬᙇຊࡀṧ␃ᛂຊ࡜ࡋ࡚⵳✚ࡉࢀࡓ࡜⪃࠼ࡽࢀࡿࠋ๓ᅇࡢᶞ⬡/㖡⟩」ྜᮦࢆ
139.08⏝࠸ࡓ᳨ウ࡛ࡣࠊ㖡࡟స⏝ࡋ࡚࠸ࡓᛂຊࡣᅽ⦰ᛂຊ࡛࠶ࡗࡓࡀ[9]ࠊࡇࢀࡣ⏝࠸ࡓᶞ⬡ࡢ CTE ࡀ㖡ࡼࡾ኱ࡁࡃࠊ
139.06
࢔࣑ࣝࡼࡾᑠࡉ࠸ࡓࡵ࡛࠶ࡿࠋFig. 4 ࡟⇕◳໬ࣉࣟࢭࢫ࠾ࡼࡧ෭⇕ヨ㦂࡟࠾ࡅࡿᶞ⬡/
139.04࢔࣑ࣝ⟩⏺㠃ࡢṧ␃ᛂຊኚ໬ࢆ♧ࡍࠋࡲࡎࠊ᪼ ࡟క࠸࢔࣑ࣝ࡟స⏝ࡍࡿᛂຊࡀᅽ⦰᪉ྥ࡟኱ࡁࡃࢩࣇࢺࡋࡓࠋ
0.0
0.1
0.2
0.3
0.4
0.5
ࡇࢀࡣୖ㏙ࡢᣲື࡜ྠᵝ࡟ࠊ࢔࣑ࣝࡢ⇕⭾ᙇ㔞ࡀᶞ⬡ࡼ
sin \ࡾࡶ኱ࡁ࠸ࡓࡵࠊ᪼ ࡟క࠸ᘬᙇᛂຊࡀῶᑡࡋࠊᅽ⦰᪉Fig. 3㸬 2ș*–sin2 ȥ diagram of theྥ࡟ࢩࣇࢺࡋࡓࡓࡵ࡜᥎ᐃࡉࢀࡿࠋḟ࡟ࠊ180°C ಖᣢ㐣Al(422)-plane at 45°C before⛬࡟࠾࠸࡚ࠊᛂຊࡀᚎࠎ࡟ᅽ⦰᪉ྥ࡟ኚ໬ࡋࡓࠋࡇࡢᣲ
curing process. The solid line
2represents the fitting line.
䠉㻝㻡䠉


30

195
180

150
135
120

10

105
90
75

060

stresstemperature–10temperature / °C

residual stress / MPa

165
2003

6459121518

21

30

time / hFig. 4㸬 Change in the residual stress during curing and thermal-testing process, in which positive andnegative values of the stress denote tensile and compressive stresses, respectively. The
dashed-line represents the zero-stress line.
ືࡣᶞ⬡ࡢ◳໬཰⦰ࡢ⤖ᯝ࡜ࡋ࡚᫂☜࡟ㄝ࡛᫂ࡁࠊᮏヨᩱ࡟࠾࠸࡚ࡣ 8 ᫬㛫࡟Ώࡾ◳໬཰⦰ࡀ㐍⾜ࡋ࡚࠸ࡓ࡜᥎ᐃࡉࢀࡿࠋḟ࡟ࠊ45°C ࡬ࡢ㝆 㐣⛬࡟࠾࠸࡚ࡣࠊ180°C ࠿ࡽ 150°C ࡲ࡛ࡣ࢔࣑ࣝ
࡟ຍࢃࡿᛂຊࡀᅽ⦰᪉ྥ࡟ࢩࣇࢺࡋࠊ150°C ௨ୗ࡛ࡣ㏫࡟ᘬᙇ᪉ྥ࡟ࢩࣇࢺࡋࡓࠋࡇࡢ 150°C ๓ᚋ࡛ࡢᣲືኚ໬ࡣࠊ◳໬ᶞ⬡ࡢ࢞ࣛࢫ㌿⛣࡜㛵ಀࡋ࡚࠾ࡾࠊ150°C ௨ୖࡢࢦ࣒≧ែࡢᶞ⬡ࡣ CTEࡀ࢔࣑ࣝࡼࡾ኱ࡁࡃࠊ150°C ௨ୗࡢ࢞ࣛࢫ≧ែࡢᶞ⬡ࡣ CTE ࡀ࢔࣑ࣝࡼࡾᑠࡉ࠸ࡓࡵ࡜᥎ᐃࡉࢀࡿࠋࡍ࡞ࢃࡕࠊᶞ⬡࡜࢔࣑ࣝࡢ཰⦰㔞ᕪࡀ 150°C ࡛㏫㌿ࡋࠊᶞ⬡ࡀࢦ࣒≧ែ࡛ࡢ෭༷㐣⛬࡛ࡣᅽ⦰᪉ྥࠊ࢞ࣛࢫ≧ែࡢ෭༷㐣⛬࡛ࡣᘬᙇ᪉ྥࡢᛂຊࡀ࢔࣑ࣝ࡟స⏝ࡋࡓ࡜᥎ᐃࡉࢀࡿࠋ◳໬ᚋࡢ෭⇕ࢧ࢖ࢡࣝヨ㦂࡟࠾࠸࡚ࡣࠊ1 ࢧ࢖ࢡࣝ┠࡜ 2 ࢧ࢖ࢡࣝ┠࡛ྠᵝࡢᛂຊኚ໬ࡀほ ࡉࢀࠊᶞ⬡ࡢ⇕⭾ᙇ࠾ࡼࡧ⇕཰⦰ࡀྍ㏫ⓗ࡟㐍⾜ࡋࠊ୙ྍ㏫ⓗ࡞ᵓ㐀ኚ໬ࡣ⏕ࡌ࡚࠸࡞࠸࡜⪃࠼ࡽࢀࡿࠋࡇࡇ࡛ࠊ๓ᅇࡢ㖡⟩ࢆ⏝࠸ࡓ᳨ウ࡛ࡣࠊ⇕◳໬ࣉࣟࢭࢫ 8 ᫬㛫⤒㐣ᚋ࡟࠾ࡅࡿ 180°C ࡢᛂຊ࡜ࠊ෭⇕ࢧ࢖ࢡࣝヨ㦂 180°C ᪼ ᫬ࡢᛂຊࡣ␗࡞ࡾࠊ◳໬㐣⛬࡟࠾࠸࡚Ⓨ⏕ࡋࡓᯫᶫṍࡀ෭⇕ࢧ࢖ࢡࣝ࡟ࡼࡗ࡚⦆࿴ࡉࢀࡿ࡜࠸࠺ᣲືࡀ☜ㄆࡉࢀ࡚࠸ࡿ[9]ࠋ௒ᅇࡢ࢔࣑ࣝ⟩ࢆ⏝࠸ࡓ᳨ウ࡛ࡣࠊ⇕◳໬ࣉࣟࢭࢫ⤊஢᫬࡟࢔࣑ࣝ࡟స⏝ࡍࡿ⇕᫬ᛂຊࡣ࡯ࡰ 0 MPa ࡜ࡳ࡞ࡏࠊᶞ⬡/࢔࣑ࣝ⟩⏺㠃ࡣᛂຊࣇ࣮ࣜ≧ែ࡛࠶ࡗࡓࡓࡵࠊ㖡⟩࡛ほ ࡉࢀࡓ෭⇕ࢧ࢖ࢡࣝ࡟࠾ࡅࡿᛂຊ⦆࿴ᣲືࡣほᐹࡉࢀ࡞࠿ࡗࡓ࡜⪃࠼ࡽࢀࡿࠋ௒ᚋࡢㄢ㢟㸸ᮏᐇ㦂࡛ࡣ࢞ࣛࢫ⧄⥔ࢆྵ᭷ࡍࡿࣇ࢙ࣀ࣮ࣝᶞ⬡ᡂᙧ⏝ᮦᩱࢆ⏝࠸ࠊ㖡⟩ࢆ⏝࠸ࡓ㝿ࡢᡭἲࢆ㐺⏝ࡍࡿࡇ࡜࡛ࠊࣇ࢙ࣀ࣮ࣝᶞ⬡/࢔࣑ࣝ⟩」ྜᮦࡢ◳໬㐣⛬࠾ࡼࡧ෭⇕ࢧ࢖ࢡࣝヨ㦂ṧ␃ᛂຊኚ໬ࢆ᫂☜࡟ᤊ࠼ࡿࡇ࡜࡟ᡂຌࡋࡓࠋ୍᪉ࠊ࢔࣑ࣝ⟩࡟ࡣ⤖ᬗ㓄ྥࡀᏑᅾࡍࡿࡓࡵࠊṧ␃ᛂຊホ౯࡟㐺ࡋࡓ࢔࣑ࣝ⟩ࡢ᥈⣴ࡀ௒ᚋࡢㄢ㢟࡛࠶ࡿࠋཧ⪃ᩥ⊩㸸
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