Product Catalog 2024-2025

Embedded IoT Solutions
About Embedded IoT
Embedded Design-in Services
Edge Software, Distribution & Services
Edge AI Software
DeviceOn, Device Management
IoT Security Software
Microsoft Windows IoT & Azure Services
Linux, Embedded BIOS and APIs

Embedded Design-in Platforms
Computer On Modules
Embedded Single Board Computers
Industrial Motherboards
Arm-Based Computing Platforms

Edge Intelligence Systems
Edge AI Solutions
Edge Computers
Digital Signage Solutions

Embedded Application Solutions
EV Charging
Robotics, AMR and Drone
Rugged & Mission Critical
Gaming Computing Platforms

Industrial Peripheral Solutions
Industrial Wireless Solutions
Industrial Wireless ePaper Solutions
Industrial Flash and Memory Solutions
Industrial Display Solutions

www.advantech.com

About Embedded IoT

About Embedded IoT
Shaping the Future of Edge Computing and Emerging Business
From the very beginning, Advantech has been at the forefront of innovation in embedded technologies. Our commitment is toprovide our customers with access to the most cutting-edge solutions available. As a leading brand in the embedded market,
Advantech plays a central role in connecting the entire ecosystem. We collaborate with partners to deliver a range of edge
computing platforms, edge AI and edge software, enhancing the efficiency of application deployments. Additionally, we offer
extensive and seamlessly integrated solutions, with a focus on customer-centric embedded design-in services to facilitate
the global implementation of diverse AIoT applications. We continually adjust our strategies to align with technological trends
and the evolving demands for edge solutions.

Establishing a Value-Add Business Model
Advantech is committed to customizing its designs to meet the distinct requirements of various industries. Thisapproach has bolstered Advantech’s expertise in areas such as heat management, aesthetic design, and I/O
integration. Through collaborations with leading global semiconductor manufacturers such as Intel, NVIDIA, Arm,
NXP, AMD, Qualcomm, and MediaTek, Advantech has solidified its position in the field of edge computing. With
integrated edge AI technology and deepening ties with Microsoft—a provider of global cloud platforms—and Azure
Open AI, Advantech also offers Edge AI SDK, DeviceOn, and IoT Security for industry-specific needs, all of which
contribute to the company’s value-add business model.

Grabbing AIoT Emerging Business Opportunities
Drawing upon four decades of product innovation, Advantech is strategically positioning itself for the future.
The company is aligning product innovation and marketing to address the specific needs of vertical industries,
integrating 5G, AI, and cloud technologies into its new offerings. While maintaining a strong presence inestablished sectors such as medical and automation, Advantech is also expanding into emerging domains
like green energy, EV infrastructure, robotics, and AMR. This initiative is aimed at accelerating the global
deployment of AIoT applications.

1Bridging Technology for AIoT Opportunities
Advantech recognizes that customers face unique challenges in adopting emerging technologies into theirsolutions. We specialize in transforming a range of new technologies into diverse platforms and domain-focused
solutions tailored to address the unique needs of our customers. Our comprehensive service model provides a
one-stop solution for integrating embedded boards, systems, software, displays, and peripherals. This approach
utilizes customer-centric design-in services to accelerate AI and IoT deployment. By collaborating with reliable andexperienced embedded professionals, solution providers can anticipate a streamlined process, reducing the timeand resources typically required for system integration.

Embedded Design-In Services

Embedded Design-In Services

Leading Embedded Technologies
Advantech, as a pioneer and leader in the embedded market, has continuously innovated in the development ofembedded technologies from day one, ensuring that our customers have access to the most advanced solutions on themarket. We provides full scale x86 and Arm-based computing platforms covering various form-factors from MicroATX,
mini-ITX, 3.5” SBC, Pico-ITX, to COM-HPC , COM Express, Qseven, SAMRC, OSM (Open Standard Module)
modules. Advantech continuously engages in research and development with association and partners to provide
innovative form factors, such as COM-HPC by PICMG for high performance computing at edge and solder-on module,
OSM by SGET with miniature embedded technology, ensuring future adaptability.

Multiple Peripheral Module Integration Services
Advantech provides a full range of modules for design-in services, including I/O extension, AI acceleration modules,
SSD, memory, and wireless module solutions. With multiple peripheral modules and integration services, customers
can rapidly implement their solutions.

AIoT Software, Distribution & Services
Harnessing substantial expertise in embedded and edge computing, Advantech features a dedicated global software
solutions team. This team not only provides a range of services, covering Embedded BIOS, OS, software APIs, andutilities but also furnishes comprehensive solutions for AIoT device management, Edge AI, IoT security software andcloud services. By leveraging these seamlessly integrated hardware and software services, embedded developers
can streamline design efforts, reduce project complexity, and expedite product development.

2

Edge AI Software

Edge AI Software

NVIDIA AI Enterprise (NVAIE)
NVIDIA AI Enterprise (NVAIE)
End-to-End Software Platform & Enterprise Support for Production AI
Overview

NVIDIA AI Enterprise (NVAIE) is an end-to-end, cloud native software platform that accelerates the data science pipeline and streamlines development anddeployment of production-grade AI applications, including generative AI, computer vision, speech AI, and more. Enterprises that run their businesses on AI rely on
the security, support, and stability provided by NVIDIA AI Enterprise to improve productivity of AI teams, reduce total cost of AI infrastructure, and ensure a smoothtransition from pilot to production.

Benefits• Improves productivity and lowers costs with accelerated computing.
• Frees teams to build innovative AI solutions with enterprise-grade security, reliability, and support.
• Is cloud-native and certified to run anywhere and on current and prior GPU generations.
• Speeds time to production with AI workflows and pretrained models.

Features• Data Preparation: Speed data processing time up to 5X while reducing operational costs by 4X.
• Model Training: Create custom, accurate models in hours, instead of months.
• Optimized for Inference: Accelerate up to 8X LLM inference performance and up to 40X inference performance over CPU-only platforms.
• Deploy at Scale: Simplify and optimize the deployment of AI models at scale and in production.
• Enterprise Support: Access to NVIDIA AI experts with service-level agreements (SLAs).

System Requirements• NVIDIA-Certified Systems including servers, workstations, and edge systems.
(https://www.nvidia.com/en-us/data-center/data-center-gpus/qualified-system-catalog/)• Ubuntu 20.04 LTS or 22.04 LTS (Server/Desktop editions)

License Type w/ Support
Services

Subscription, 1-year term

Subscription, 3-year term

Perpetual License + 5-year support
services

Subscription, 5-year term

Business Standard (Included)

Business Critical (Optional Upgrade/Add-on)

SLA: 9 x 5 Business Days

SLA: 24 x 7

Support Options• Services: Issue resolution, bug fixes, software updates, maintenance• Support Channels: Phone, portal, email

On-premises Computer Vision
AI Training SoftwareIntel® Geti™
Overview

Intel’s new software platform enables the building of computer vision models in a fraction of the time and with less data. The platform eases laborious data labeling, modeltraining, and optimization tasks across the AI model development process, empowering teams to produce custom AI models at scale.

Features• Smart Annotations: Expedite data annotation and easily segment images with professional drawing features like a pencil, polygon tool, ora OpenCV GrabCut.
• Interactive Model Training: Get started annotating data with as little as 20-30 images; then let active learning help you teach the model as it learns.
• Multiple Computer Vision Tasks: Create models for AI tasks including classification, object detection, semantic segmentation, or anomaly detection.
• Task Chaining: Train your model into a multistep, smart application by chaining two or more tasks, without the need to write additional code.
• Production-Ready Models: Output deep learning models in TensorFlow or PyTorch formats or as an optimized model for the OpenVINO™ toolkit to run on Intel®
architecture CPUs, GPUs and VPUs.
• REST APIs and SDK: REST APIs and the software development kit (SDK) enable users to push data directly into the platform and pull trained models directly into
their deployment pipelines.

On-Premise HW Installation:

System Requirements• CPU for workstations: Intel® Core™ i7, Intel® Core™ i9, or Intel® Xeon® scalable processors capable of running 20 concurrent threads (K3s) or 48 concurrent
threads (K8s).
• GPU: Min. one NVIDIA GPU with min. 16GB of memory (e.g. RTX 4080, RTX 3090, RTX 6000, RTX 8000, Tesla A100, Tesla V100, Tesla P100, or Tesla T4).
• Memory: Min. 64GB RAM (128GB recommended) per GPU• Disk Space: Min. 1TB (2TB recommended) available space on the root partition• OS: Ubuntu 20.04 LTS or Ubuntu 22.04 LTS

Cloud Deployment:• The Intel® Geti™ platform needs a static IP address to work and cloud providers offer different means to ensure that.
• VM Type: g5.8xlarge (AWS), Standard_NC24s_v3 (Azure)• CPU for cloud deployment: CPUs capable of running min. 24 concurrent threads for K3s or min. 48 concurrent threads for K8s• Disk Space: Min. 500GB (1TB recommended) available space on the root partition• OS: Ubuntu 20.04 LTS or Ubuntu 22.04 LTS

Starter, Annual License:

Professional, Annual License:

Professional, Annual License:• 1 Name User
• 1 Instance• Recommended for POC• Basic Support• Team collaboration• 3 Named users for small teams• 2 Concurrent model trainings• 1 Instance• Recommended for small teams• Basic Support

Recommended HW ssold separately
by Advantech:• ARK-7060, 20 CPU threads for K3S,
64GB RAM: RAM / 1TB SSD• 1 x RTX 4000 GPU with 16GB RAM• Built-in DeviceOn• Built-in Edge AI SDK

Recommended HW sold separately by
Advantech:• ARK-510, 20 CPU threads for K3S,
64GB RAM: RAM / 1TB SSD• 2 x RTX 4000 GPU with 16GB RAM• Built-in DeviceOn• Built-in Edge AI SDK• Team collaboration• 3 Named users• Up to 4 medium-sized modeltrainings• 1 Instance• Recommended for medium-sized
teams• Basic support

License Types

1130-day Free Trial Term
License:• Proof of value• Incur no cost for using the softwareand generating models• Enables unlimited usage

Embedded Single Board Computers

Embedded Single Board Computers3.5" MI/O-Compact and 4" EPIC

Model Name

MIO-4370

MIO-5377

MIO-5376

MIO-5375

4" MIO SBC

3.5" MIO SBC

3.5" MIO SBC

3.5" SBC w/MIO Extension

i9-14900T/i9-13900TE/i9-12900TE/i7-14700T/
i7-13700TE/i7-12700TE/i5-14500T/i5-13500TE/
i5-12500TE/i3-14100T/i3-13100TE/i3-12100TE

i7-1370PE/i7-1370PRE/i7-1365UE/i7-1365URE/
i7-1270PE/i7-1265UE/i5-1345UE/i5-1245UE/
i3-1315UE/i3-1215UE/U300E

AMD Ryzen R2314/ *2514

i7-1185GRE/ i7-1185G7E/ i5-1145G7E/
i3-1115G4E# of Cores

4 ~ 24

1P+4E ~ 6P+8E

4

4~8# of Threads

8 ~ 326 ~ 204~8

4~8Max. Turbo Frequency

4.0GHz ~ 5.5GHz

4.3GHz ~ 4.8GHz

3.5GHz ~ 3.7GHz

3.90GHz ~ 4.40GHz

Base Frequency

1.0GHz ~ 2.1GHz

1.0GHz ~ 1.9GHz

2.1GHz

1.50GHz ~ 3.0GHz

Last Level Cache (LLC)

12MB ~ 36MB

8MB ~ 24MB

4MB

4MB ~ 12MB

35W

15W/ 28W

15W

15W/ 28W

BIOS

AMI UEFI 256Mb

AMI UEFI 256Mb

AMI UEFI 256Mb

AMI EFI 256Mb

Technology

DDR5-4800 MHz

DDR5-4800 MHz

DDR4-2667MHz

DDR4-3200MHz

Max. Capacity

32GB

64GB

32GB

64GB

# of Channels

1

2

2

2

# of Sockets

1

2

2

2

ECC Support

Support by PCH SKU

Support by CPU SKU

Form Factor
CPU

Processor
System

CPU TDP (Watts)

MemorySupport by CPU SKU-

Integrated GFx

Integrated GFx

Integrated GFx

Integrated GFxIntel® UHD Graphics 770/730

Intel Iris Xe Graphics/Intel® UHD Graphics for 13th
Gen Intel®Processors

AMD Radeon RX Vega 8Intel® UHD Graphics 630

DX12, OGL4.5, OCL3.0

DX12.1, OGL4.6, OCL3.0

DX12, OGL

DX12.1, OGL4.6, OCL2.0

-

-

-

-

LVDS

-

48-bit, 1920 x 1200 @ 60Hz

48-bit, 1920 x 1200 @ 60Hz

48-bit, 1920 x 1200 @ 60Hz

eDP

eDP1.4b5120 x 3200@60Hz, 24bpp--

Opt. eDP1.4
3840 x 2160@60Hz, 30bpp
4096 x 2304@60Hz, 24bpp

HDMI1

HDMI1.2, 1920 x 1200@60Hz, 24bpp

HDMI 2.0b, up to 4096 x 2160 @60Hz, 24bpp

HDMI 2.0, 4096 x 2160@60Hz, 24bpp

HDMI1.4, 4096 x 2304@30Hz, 24bpp

HDMI2

HDMI1.2, 1920 x 1200@60Hz, 24bpp

-

-

-

-

DP1.4a, up to 4096 x 2160@60Hz, 36bpp

DP1.4/ DP++, 4096 x 2160 x 36bpp@60Hz,
36bpp

HDMI2.0, 4096 x 2304@60Hz, 24bpp

ChipsetController
3D Accelerator
VGA

Graphics

LFP

DisplayPort 1# of Display Pipelines(Multi-Display)

3

4

3

4

LAN1

i225

i219

i226

i219

LAN2

i225

i226

i226

i210

LAN3

-

-

i226

-

# of Ports

-

1

1

1, option to M.2 M-Key

Ethernet

SATA

USB
I/O

UART

Serial Bus
Audio

Storage

Speed-

Gen3 (6.0Gb/s)

Gen3 (6.0Gb/s)

Gen3 (6.0Gb/s)

Type-C-

1x USB 4 (20 ~ 40 Gbps, USB 3.2, Display & PCIe)+ 1x USB 3.2 (10 Gbps w/DP Alt. Mode)-

1x USB 3.2 (10 Gbps w/DP Alt. Mode)USB 3.1

4 (10 Gbps)

4 (10 Gbps)

2 (10 Gbps)

4 (10 Gbps)

USB 3.0--

2 (Internal)-

USB 2.0

2 (Internal)

2 (Internal)

2 (Internal)

2 (Internal)

RS-232/422/485

2

2

2

2

RS-232-2

2 (4-wire)

2 (4-wire)

I2C Bus

1

3

1

1

SMBus

(I2C Opt. to Smbus)(1x I2C Opt. to Smbus)(I2C Opt. to Smbus)(I2C Opt. to Smbus)

CANBus

1

2

1

1

CODEC

Realtek ALC888S

Realtek ALC888S

Realtek ALC888S

Realtek ALC888S

GPIO (DIO)

8-bit

8-bit

8-bit

8-bit

mSATA

-

-

-

-

eMMC

-

-

-

-

1 (PCIe x1, USB 2.0)

1 (PCIe x1, USB 2.0)

1 (PCIe x1, USB 2.0)

1 (PCIe x1, USB 2.0)

M.2 E-Key 2230

Expansion

M.2 B-Key 2242-

M.2 B-Key 3042

Optional (PCIex1, USB 2.0) w/bracket

1 (PCIe x1, USB 2.0, SATA)

Optional (USB 3.2, USB 2.0, PCIe x1)

1 (USB 2.0)

M.2 B-Key 3052

Optional (PCIex1, USB 2.0) w/bracket

Optional (PCIe x1, USB 2.0, SATA)

1 (USB3.2, USB 2.0, PCIe x1)-

M.2 M-Key 2242

-

-

-

-

M.2 B-Key 2280

-

-

-

-

M.2 M-Key 2280

2 (PCIe Gen.4 x4), 1x Opt. to B-Key

1 (PCIe Gen.4 x4)

1 (PCIe Gen.3 x4, SATA)

1 (PCIe Gen.4 x4, optional w/SATA)

Mini-PCIe
TPM
OthersFan
Watchdog Timer

Power

Environment

21

-

-

-

TPM 2.0

TPM 2.0

TPM 2.0

1 x SMART Fan, 4-wire

1 x SMART Fan, 4-wire

1 x SMART Fan, 4-wire

1 x SMART Fan, 4-wire65536 Levels, Minutes or Seconds

65536 Levels, Minutes or Seconds

65536 Levels, Minutes or Seconds

65536 Levels, Minutes or Seconds

Power Type

AT, ATX

AT, ATX

AT, ATX

AT, ATX

Power Supply Voltage

12V

12~24V

12V~24V

12V~24V

ATX 2x2p 180D, Optional 90D

ATX 2x2p 90D, Optional 180D, DC-Jack

1x2p Pheonix connector

ATX 2x2p 90D, Optional 180D, DC-Jack

ACPI

ACPI

ACPI

ACPI

Active (Fan Base)

Active (Fan Base)/ Passive (Fan-less)

Active (Fan Base)/ Passive (Fan-less)

Active (Fan Base)/ Passive (Fan-less)

Operating Temperature(air flow 0.7 m/sec)

0 ~ 60°C

0 ~ 60°C;
Extend: -40 ~ 85°C

0 ~ 60°C

0 ~ 60°C;
Extend: -40 ~ 85°C

Storage Temperature-40~85°C-40~85°C-40~85°C-40~85°C

Relative Humidity(Operating)

40°C @ 95% RH Non-Condensing

40°C @ 95% RH Non-Condensing

40°C @ 95% RH Non-Condensing

40°C @ 95% RH Non-Condensing

Relative Humidity(Storage)-40 ~ 85°C and 60°C @ 95% RH
Non-Condensing-40 ~ 85°C and 60°C @ 95% RH
Non-Condensing-40 ~ 85°C and 60°C @ 95% RH
Non-Condensing-40 ~ 85°C and 60°C @ 95% RH
Non-Condensing

Connector
Power Management

Thermal

TPM 2.0 / fTPM by SKU

Fan or Fanless

Mechanical

Dimensions (W x H x D)

165 x 114 mm

146 x 102 mm

146 x 102 mm

146 x 102 mm

Certification

EMC

CE/FCC Class B

CE/FCC Class B

CE/FCC Class B

CE/FCC Class B

Note: “-” : means Not Applicable (N/A)

Arm-Based Computing Platforms

Arm-Based Computing Platforms
Computer-on-Modules

Model Name
Form Factor
NPU
Compatible Careeier Board
Processor System

MemoryCPU
Technology
Capacity
Flash

LVDS

MIPI-DSI

Graphics

ROM-5780

ROM-5820

ROM-5880

ROM-6881

SMARC V2.1
ROM-DB5901-SWA2
SOM-DB2510-R0A1
Rockchip Arm RK3399 Cortex-A72
1.8 GHzLPDDR4 3732 MT/s
On-board LPDDR4 2 GB/4 GB
16 GB/32 GB eMMC NAND Flash for
O.S. and 8 MB SPI NOR Flash for board
information
1 x Single Channel 24-bits
LVDS(Default) or 1 x Dual Channel
24-bits LVDS (Shared with eDP, by
BOM Option)
1 x 4-lane MIPI DSI, up to 1920 x 1080
at 60Hz (Shared with 4-lane MIPI-CSI,
by S/W Configuration)

SMARC 2.1
Neural Network accelerator

SMARC 2.1
Integrated NPU 1 Tops

SMARC2.1
Up to 6.0 Tops

SOM-DB2510-R0A1

SOM-DB2510-R0A1

SOM-DB2510-R0A1

NXP i.MX95 Cortex-A55 Six core
(up to 2.0GHz)
LPDDR5 6400MT/s
On-board 8GB LPDDR5

RK3568 4 x Arm Cortex A55,
Up to 2.0 GHz
LPDDR4 4266MT/s
On-board LPDDR4 2/4 GB

Rockchip RK3588 Cortex-A76, A55
Octa-Core,up to 2.4 GHz
LPDDR4 3733 MT/s
On-board LPDDR4 4 GB

16GB eMMC NAND Flash

16/32 GB eMMC NAND Flash for O.S

32GB eMMC NAND Flash for OS andboot loader

1 x Dual channel LVDS

1 x LVDS (default)

1 x single channel LVDS (default) or
1 x dual channel LVDS,
up to 1920 x 1200 (BOM option)

1 x 4 lane MIPI-DSI (Optional)

1 x 4 lane MIPI-DSI (Share LVDS port)

1 x MIPI-DSI(BOM option, shared with LVDS0)eDP

1 x eDP 1.3

-

HDMI

3840 x 2160@60Hz-

Mali-T860MP4 GPU, supports OpenGL
ES1.1/2.0/3.0, OpenCL1.2,
DirectX 11.1

2D/3D Graphic Acceleration
supporting2D/3D Graphic Acceleration
supporting

H/W Video Codec

Decoder: H.265 (up to 4Kx2K@60fps),
H.264, H.263, VC-1, VP9, VP8, MVC,
MPEG-1/2/4
Encoder: H.264 up to HP@
level4.1, MVC and VP8

Decoder: H.264/ H.265, 4K@30fps
Encoder: H.264/ H.265, 4K@30fps

Chipset1 x Rockchip RK3399 Integrated RGMII

Speed

Parallel RGB
VGADP
Graphics Engine

1 x eDP1.3 up to 2560x1600@60Hz(Share with LVDS, by bom option)
1 x HDMI2.0,
up to 3840 x 2160@60Hz
3D Graphics Engine Mali-G52

Decoder: H.264 /H.265 /VP9
(4K@60fps)
Encoder: H.264 /H.265 (2K@60fps)

1 x eDP
1 x HDMI2.1
1 x DP1.4
Arm Mali-G610 MP4 GPU, high-performance OpenGL ES 1.1, 2.0
and 3.2, OpenCL 2.2, Vulkan 1.2, etc.
Decoder: Decoder: H.265/ VP9(8K@60fps), H.264 (8K@30fps),
H.263,VC-1, VP8, MVC, AV1,
MPEG-4/2/1
Encoder: H.264/ H.265 8K@30fps,
parallel encoder for multichannel,
lower resolution

2 x YT8531

2 x Rockchip RK3588 Integrated RGMII

10/100/1000 Mbps
Yes

1 x NXP i.MX95 integrated USXGMII,
2 x NXP i.MX95 integrated RGMII
1 x 10 GbE, 2 x 10/100/1000 Mbps
Yes

10/100/1000 Mbps
Yes

WatchDog Timer

1~6553s, default 60s, power on/off 1s

Yes

HW watchdog by MCU

10/100/1000 Mbps
Yes
HW watchdog by MCU. 1~6527s,
default 60s, power on/off 1s

TPM

TPM2.0 (ST33HTPH2E32AHC2) (BOM
Option)TPM 2.0

Ethernet
RTC

1 x SATA II-

2 x USB3.2 Gen1 by 1,
3 x USB 2.0 Host,
1 x USB 2.0 OTG
2 x I2S
1
3 UART (2 x 2-wire, one share withdebug console by jumper selection,
1 x 4-wire with H/W flow control)
1125

1 x USB3.2 Gen1 by 1,
4 x USB 2.0,
1 x USB 2.0 OTG
2 x I2S1
2 x 4-wire UART
2 x 2-wire UART

2 x 4-wire UART
2 x 2-wire UART

2
2 x CAN2.0
145

1
2 x CAN2.0
145

1 x 4-lane MIPI CSI-2
1 x 2-lane MIPI CSI-2

1 x 4-lane MIPI CSI

1 x 4-lane MIPI CSI

4.75~5.25V
8.52W (Max)0 ~ 60 °C/ -20 ~ 85 °C
5% ~ 95% Relative Humidity,
non-condensing
82 x 50 mm
Debian Linux, Android
CE/FCC Class B

Fixed 5V DC source
TBD
0 ~ 60 °C/ -40 ~ 85 °C
5 ~ 95% relative humidity,
non-condensing
82 x 50 mm
Yocto Linux
CE/FCC Class B

4.75~5.25V
4.57W
0 ~ 60 °C/ -40 ~ 85 °C
5 ~ 95% relative humidity,
non-condensing
82 x 50 mm
Linux Debian 10, Android 12
CE/UKCA/FCC Class B

PCIe

1 x PCIe 2.0 x1

SATA
USB
Audio
SPDIF
SDIO
I/O

Serial Port
SPI
CAN
GPIO
I2C
Camera Input

Power
Environment
Mechanical
Operating System
Certifications

2 x PCIe 3.0 x1,
1 x PCIe 2.0 x1 (shared with SATA, by
BOM option)
1 x SATA3.0(default)(shared with PCIE2.0, by BOM option)
1 x USB 3.0,
2 x USB 2.0,
1 x USB 3.0 OTG
1 x I2S
1

System Bus
Touch
KeypadPower Supply Voltage
Power Consumption
Operational Temperature
Operating Humidity
Dimensions (W x D)

Note: “-” : means Not Applicable (N/A)*LVDS & MIPI-DSI are shared interface** Quad Core SKU support LVDS by default** Dual/Core SKU support MIPI-DSI by default

2 x PCIe 3.0

4 x PCIe 3.0, 1 lane
1 x SATA 3.0
2 x USB 3.0 signal,
3 x USB 2.0,
1 x USB 2.0 OTG
1 x I2S1
1 x 2-wire UART for debugging
1 x 2-wire UART
2 x 4-wire UART
2
2 x CAN2.0
125
2 x MIPI CSI (1 x 2 lane, 1 x 4 lane)
2 x MIPI CSI by FCC CONN on board(4 lane)4.75 V ~ 5.25 V DC source
8.32W @ 5V (Max), 1.34W @ 5V (Idle)
0°C ~ 60°C / -40°C ~ 85°C
5 ~ 95% relative humidity,
non-condensing
82 x 80 mm
Linux, Debian 11, Android 13
CE/UKCA/FCC Class B

36

Arm-Based Computing Platforms

Arm-Based Computing Platforms
UIO40-Express I/O Expansion Boards
UIO-4030

UIO-4032

1 x RS-485
1 x RS-232
4 x DI & 4 x DO

1 x GbE
2 x USB2.0
2 x RS-232

Specifications

Specifications

GeneralUSB
RS-232
RS-485GPIO
CAN BusGbE
Dimension
Environment
WeightOperating Humidity
Operating Temperature
Storage Temperature–
1 x 2-wire RS-232
1 x RS-485
4 x DI, 4 x DO(2.5~24V)––
146 x 31 x 22 mm
180g
5% ~ 95% relative humidity, non-condensing-40 ~ 85 °C-40 ~ 85 °C and 60 °C @ 95% RH Non-Condensing

GeneralUSB
RS-232
RS-485GPIO
CAN BusGbE
Dimension
Environment
WeightOperating Humidity
Operating Temperature
Storage Temperature

2 x USB 2.0
2 x 2-wire RS-232–––
1 x GbE
146 x 31 x 22 mm
200g
5% ~ 95% relative humidity, non-condensing-40 ~ 85 °C-40 ~ 85 °C and 60 °C @ 95% RH Non-Condensing

Ordering Information

Ordering Information

P/N
UIO-4030

P/N
UIO-4032

Description
UIO-4030, 1 x RS232, 4 x DI, 4 x DO, 1 x RS-485

UIO-4031

UIO-4034

4 x RS-485
2 x RS-232
4 x DI & 4 x DO
2 x CAN FD

1 x CAN bus
2 x RS-232

Specifications

Specifications

GeneralUSB
RS-232
RS-485GPIO
CAN BusGbE
Dimension
Environment
WeightOperating Humidity
Operating Temperature
Storage Temperature–
2 x 2-wire non-isolated RS232
4 x 2-wire non-isolated RS485
4 x non-isolated DI and 4 x non-isolated DO
2 x non-isolated CAN FD–146 x 31 x 22 mm
TBD
5% ~ 95% relative humidity, non-condensing-40 ~ 85 °C-40 ~ 85 °C

GeneralUSB
RS-232
RS-485GPIO
CAN BusGbE
Dimension
Environment
WeightOperating Humidity
Operating Temperature
Storage Temperature

Description
UIO-4032, 1 x GbE, 2 x USB, 2 x RS-232–
2 x 2-wire RS-232––
1 x CAN bus 2.0B, 1 Mbps–
146 x 31 x 22 mm
180g
5% ~ 95% relative humidity, non-condensing-40 ~ 85 °C-40 ~ 85 °C and 60 °C @ 95% RH Non-Condensing

Ordering Information

Ordering Information

P/N
UIO-4031

P/N
UIO-4034

Description
UIO-4031, 2 x RS232, 4 x RS-485, 2 x CAN FD, 4 x DI, 4 x DO

Description
UIO-4034, 1 x CAN, 2 x RS-232

Compatible Main Boards
Part No.
RSB-3430XD-PXA1E*
RSB-3720XX-XCA1E*
RSB-3710XX-XXA1E*

Description
RSB-3430 NXP i.MX6 Series 2.5" UIO Main Board
RSB-3720 NXP i.MX8M Plus Series 2.5" UIO Main Board
RSB-3710 Rockchip RK3399 Series 2.5" UIO Main Board*X indicates different configurations, please refer to each main board's datasheet for complete P/N to order.

42

Edge AI Solutions

Edge AI Solutions
Edge AI Inference Systems

Model

AIR-030

AIR-150

AIR-310NVIDIA Jetson AGX Orin 32G/64G

13th Gen Intel Core™ i3/i5 processor

14th Gen Intel Core™ i3/i5/i7/i9 processor

up to 275 TOPS

Bundled with Hailo-8 AI module, up to 26 TOPS

Compatible with Intel Arc A370M/Quadro® A2000,
up to 60W

Technology

LPDDR5

DDR5 5200 MHz

DDR5 5600MHz

Max. Capacity

32GB/64GB

Up to 64 GB

Up to 64 GB

Socketon board

2x 262 pin SO-DIMM

2 x 262-pin SO-DIMM

1 x HDMI 2.0, 3840 x 2160@60Hz

2x HDMI 2.0, 4096x2160@60Hz

1 x HDMI 2.0, 4096x2160@60Hz
1 x DP 1.4, 4096x2160@60Hz

3 x 2.5GbE, Intel I225-LM

1x GbE, Intel I219-LM
1 x 2.5 GbE, Intel I226-LM

1 x GbE, Intel I219-LM
2 x 2.5 GbE, Intel I226-LM

CPU/Platform
AI Performance

Memory

Display
Speed/Controller
Ethernet

Wake on LAN

Yes (suspend only)

Yes

Yes

-

-

4 x USB 3.2
2 x USB 2.0 (internal)

3 x USB 3.2
1 x USB 2.0

4 x USB 3.2

USB Type C

1

-

-

OTG USB

1 x Micro USB (for system recovery only)

-

-

COM

4 x RS232/422/485

2 x RS-232/422/485
1 x RS-485

2 x RS232/422/485

DIO

16-bit8-bit

16-bitUSB 3.0 / USB 2.0

CANBus

2

2

2

Audio

Line-out

Line-out/Mic-in (switch)

Line-out/Mic-in (switch)

eMMC

64GB

-

-

-

-

1

1 x M.2 B-Key 2280/3052 (PCIe x2, USB 3.0)

1 x M.2 M-Key 2280 (PCIe Gen4 x4, SATA)

1 x M.2 M-Key 2280 (PCIe Gen3 x4, SATA)

-

-

-

2.5" SATA
Storage

M.2
mSATA
SATA Slim
SD Card--

1 x M.2 E-Key 2230

1 x M.2 E-Key 2230
1 x M.2 B-Key 3042 (default w/ Hailo module)

1 x M.2 E-Key 2230

PCI Express

1 x PCIe x16 (Optional, signal: PCIe x 8)--

SIM Socket

1

-

-

GPU Card--

1 x MXM3.1 Type A up to 60W

MIPI
OthersPower

1 x SATA Slim
1 x SD 3.0 slot

M.2

Expansion®

LAN1 & 2 optional, by adding MIOe-PSE

PoE

I/O Ports®

Trusted Platform Module
IPMI
Power Input
Power TypeOperating System
Operating temp. (with 0.7 m/s air flow)
Weight (kg)Dimensions (W x H x D)

2

-

-

on-board TPM 2.0

on-board TPM 2.0

on-board TPM 2.0

-

-

-

9-36V

12-24V

12-24V

ATX/AT mode, ATX default

ATX/AT mode, ATX default

ATX/AT mode, ATX default

Built-in Linux Ubuntu 20.04 (JetPack 5.1.2)

Windows 11/10 IoT/Ubuntu 22.04

Windows 11/10 IoT/Ubuntu 22.04-10~60°C (MODE_50W)-20~60°C

0~55°C (w/o MXM GPU)
0~50°C (w/ MXM GPU)

3.63

1.3

2.4

200 x 220 x 74 mm

156 x 112 x 60 mm

215 x 220 x 55 mm

Note: “-” : means Not Applicable (N/A)

50

Industrial Display Solutions

Industrial Display Solutions

IDK-1000 Indoor LCD Kits
IDK-1105

IDK-1106

IDK-1107W

IDK-1110W

IDK-1110

5.7"

6.5"

7"

10.1"

10.4"

640 x 480,
VGA

640 x 480,
VGA

800 x 480, WVGA1024 x 600, WVGA1024 x 600, WSVGA

1280 x 800, WXGA

800 x 600, SVGA

1024 x 768, XGA

500

800

500

500

500

500

400

500

Viewing Angle(H/V°)

140/100

160/140

178/178

178/178

140/120

170/170

160/130

176/176Contrast Ratio

250:1

600:1

800:1

800:1

500:1

800:1

700:1

1000:1

Touchscreen

4-Wire Resistive

4-Wire Resistive

5-Wire Resistive and
P-cap

P-cap

4-Wire Resistive

P-cap

4-Wire Resistive

4-Wire Resistive
and P-cap

Size
Resolution
Brightness (cd/m2)

Signal Interface

LVDS

LVDS

LVDS

LVDS

LVDS

LVDS

LVDS

LVDS

Backlight Life (hrs)

30,00050,00050,00050,00050,00050,00050,00050,000

Durability (touches)

1 million

1 million

1 million

No limit

1 million

No limit

1 million

1 million

OperatingTemperature-20 ~ 70°C

-10 ~ 60°C

-5 ~ 60°C-20 ~ 70°C

-5 ~ 60°C-20 ~ 65°C

-10 ~ 60°C

-10 ~ 60°C

IDK-1112

IDK-1115

IDK-1115WP

12.1"

15”

15.6"

1024 x 768,
XGA

1024 x 768,
XGA

1920 x 1080,
FHD

Size
Resolution
Brightness (cd/m )2

Viewing Angle(H/V°)

IDK-1121W
21.5"
1920 x 1080, FHD

1920 x 1080, FHD

500

500

450

300

250

178/178

178/178

170/170

178/178

178/178
1000:1

Contrast Ratio

1000:1

2500:1800:1

5000:1

Touchscreen

5-Wire Resistive and P-cap

5-Wire Resistive and P-cap

P-cap

5-Wire Resistive

P-cap

Signal Interface

LVDS

LVDS

2 Channel LVDS

2 Channel LVDS

2 Channel LVDS

Backlight Life (hrs)

30,00070,00050,00050,00030,000

Durability (touches)

10 / No limit

10 / No limit

No limit

10 million

No limit

OperatingTemperature-20 ~ 70°C

-20 ~ 70°C

-20 ~ 70°C

0 ~ 60°C

0 ~ 50°C

IDK-2000 Outdoor LCD Kits
Size
Resolution

IDK-2108

IDK-2110W

IDK-2110

IDK-2115

IDK-2115W

7"

8.4"

10.1"

10.4"

15"

15.6”

21.5"

1024x600
WSVGA

800 x 600
SVGA

1280x800
WXGA

1024 x 768
XGA

1920 x 1080
FHD

1920 x 1080
FHD

800 x 600
SVGA

1024 x 768
XGA

IDK-2121W

Brightness (cd/m2)

1000

1200

1500

1200

1000

1200

1200

1200

Viewing Angle(H/V°)

170/170

160/140

170/170

160/130

176/176

178/178

170/170

178/178
5000:1

Contrast Ratio

800:1

600:1

800:1

500:1

1000:1

2500:1

800:1

Touchscreen

P-CAP

4-Wire Resistive

P-CAP

4-Wire Resistive

P-CAP

5-Wire Resistive

PCAP

P-CAP

Signal Interface

LVDS

LVDS

LVDS

LVDS

LVDS

LVDS

2 Channel LVDS

2 Channel LVDS

Backlight Life (hrs)

50,00050,00050,00050,00050,00050,00050,00050,000

Durability (touches)

No limit

1 million

No limit

1 million

No limit

10 million

No limit

No limit-20 ~ 70°C

-20 ~ 70°C

-20 ~ 70°C

-10 ~ 60°C

-20 ~ 70°C

-20 ~ 70°C

0 ~ 55°C

0 ~ 60°C

OperatingTemperature81

IDK-2107

Mission

Enabling an Intelligent Planet

Growth Model

Segmented Business Units
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Focus & Goal
The Global Leader ofEmbedded & Automation Solutions
for iWorld System Integrators

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Mexico City

1-800-467-2415
52-55-6275-2727

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072-2410527
90-212-222-0422
90-224-413-3134

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Please verify specifications before quoting. This guide is intended for reference purposes only.
All product specifications are subject to change without notice.
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