SDL-3N4EAG-30Feature
High Luminous Output Pure-Green LED Lamp

Chip Technology ─ InGaNStandard 3mm Water Clear Packages

Viewing Angle 30 Degree (Reference)Specification
Absolute Maximum Ratings
ItemSymbol

Absolute Maximum Rating

Unit

DC Forward Current

IF30mA

Peak Pulsed Forward Current ※IFP

100mA

Reverse Voltage

VR5V

Power Dissipation

Pd108mW

Operating TemperatureTopr-30 ~ +85°C

Storage Temperature

Tstg-40 ~ +100°C

Solder Dipping Temperature

Tsld260℃ for 5 sec※ IFP = Pulse Width≦10 ms, Duty Ratio≦1/10Electrical / Optical Characteristics
Item

Ta = 25°C

SymbolCondition

Min

TypMaxUnit

Forward Voltage

VF

IF=20mA

2.7

2.9

3.4

V

Reverse Current

IR

VR=5V

10µA

Luminous Intensity

IV

IF=20mA

9300

17000

27300

mcd

Dominant WavelengthλdIF=20mA

515

525

535nm

Peak WavelengthλpIF=20mA

518

nm

Spectral Half Width

Δλ1/2

IF=20mA

30nm
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Luminous Intensity Bin Table
IF=20mA
Rank nameMin (mcd)

Max (mcd)

Y

9300

12000

Z

12000

15700

ZA

15700

21000ZB

2100027300※ Tolerance for each bin limit is ±15%

Color Bin Table
IF=20mARank nameMin (nm)

Max (nm)

1515520252052535255304530535※ Tolerance for each bin limit is ± 1nm

Note
1. One delivery will include several color ranks and Iv ranks of products.
The quantity-ratio of the different ranks is decided by Sander.
2. Bin Name typed on the Label: IV RANK + Color Rank.
For Example, BIN Z2 Means IV: 12000~15700mcd and Color: 520nm~525nm
3. Static Electricity or Surge Voltage damages the LEDs.
It is recommended to use a wrist band or Anti-Electrostatic glove when handling the LEDs.
4. Sander has the right to update the information without notice.
Please double confirm the Spec details before placing an order.

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Lamps without Standoffs

ItemMaterials

Resin

Epoxy Resin

Lead FrameAg Plating on SPCC

Note
1. All Dimensions are in Millimeters

Reversion 1-1 March 2018www.sanderled.tw-5-Electrical-Optical Characteristics

30

1.6
1.4

25

1.2
20

1.0

15

0.8
0.6

100.450.2

00.0
0.0

1.0

2.0

3.0

4.0

5.0035

1.230

1.0

25

510

15202530

TA=25℃
IF=20mA

0.8

200.6

150.4

100.2

50.0

00204060

80

100

300

400

500

600

700

800

Reversion 1-1 March 2018www.sanderled.tw-6-Soldering Conditions - Lamp Type LEDSolder the LED no closer than 3mm from the base of the epoxy bulb. Soldering beyond the base of
the tie bar is recommended
Recommended soldering conditions

Dip Soldering
Pre-Heat
Pre-Heat Time
Solder Bath Temperature
Dipping Time
Dipping Position

100℃ Max.
60 sec. Max.
260℃ Max.
5 sec. Max.
No lower than 3mm from the base of the epoxy bulb.

Hand Soldering
3Ø Series
Temperature
Soldering timePosition
Others (Including Lead-Free Solder)

300℃ Max.
3 sec. Max.
No closer than 3mm fromthe base of the epoxy bulb.

350℃ Max.
3 sec. Max.
No closer than 3mm fromthe base of the epoxy bulb.

Do not apply any stress to the lead, particularly when heated
The LEDs must not be repositioned after soldering
After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration
until the LEDs return to room temperature.
Direct soldering onto a PC board should be avoided. Mechanical stress to the resin may be caused by
the PC board warping or from the clinching and cutting of the leadframes. When it is absolutely
necessary, the LEDs may be mounted in this fashion, but, the User will assume responsibility for any
problems. Direct soldering should only be done after testing has confirmed that no damage, such as
wire bond failure or resin deterioration, will occur. Sander’s LEDs should not be soldered directly to
double sided PC boards because the heat will deteriorate the epoxy resin.
When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize themechanical stress on the LEDs.
Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may
cause LED failure.

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