SDL-5M3EATYFeatureHigh Luminous Output Yellow LED Lamp
Chip Technology ─ AlInGaP/Sapphire

Standard 5mm (T-1 3/4) Water Clear Packages

Viewing Angle 8 Degree (Reference)Specification
Absolute Maximum Ratings
ItemSymbol

Absolute Maximum Rating

Unit

DC Forward Current
Peak Pulsed Forward Current ※IF

50mAIFP

100mA

Reverse Voltage

VR5V

Power Dissipation

Pd120mW

Operating TemperatureTopr-30 ~ +85°C

Storage Temperature

Tstg-40 ~ +100°C

Solder Dipping Temperature

Tsld260℃ for 5 sec※ IFP = Pulse Width≦10 ms, Duty Ratio≦1/10

Electrical / Optical Characteristics
Item

Ta = 25°C

SymbolCondition

Min

TypMaxUnit

Forward Voltage

VF

IF=20mA

2.1

2.4

V

Reverse Current

IR

VR=5V

50µA

Luminous Intensity

IF=20mA

21000

Dominant Wavelength

IV
λd

60000

mcd

IF=20mA

585

595

nm

Peak WavelengthλpIF=20mA

593

nm

Spectral Half Width

Δλ1/2

IF=20mA

15nm

590

Reversion 1-2 September 2009www.sanderled.tw-1-Luminous Intensity Bin Table
IF=20mA
Rank nameMin (mcd)

Max (mcd)

ZB

21000

27300

ZC

27300

35500

ZD35500

46150

ZE

46150

60000※ Tolerance for each bin limit is ±15%

Color Bin Table
IF=20mA
Rank nameMin (nm)

Max (nm)

1585

587.5

2587.5590

3590592.5

4592.5595※ Tolerance for each bin limit is ± 1nm

Note
1.
2.
3.

One delivery will include several color ranks and Iv ranks of products.
The quantity-ratio of the different rank is decided by Sander.
Bin Name typed on the Label: IV RANK + Color Rank.
For Example, BIN ZB3 Means IV: 21000～27300mcd and Color: 590nm～592.5nm
Sander has the right to update the information without notice.
Please double confirm the Spec details before place an order.

Reversion 1-2 September 2009www.sanderled.tw-2-Outline Dimensions

Lamps without Standoffs

ItemMaterials

Resin

Epoxy Resin

Lead FrameAg Plating on SPCC

Note
1. All Dimensions are in Millimeters

Reversion 1-2 September 2009www.sanderled.tw-3-

Electrical-Optical Characteristics

50.0

2.5

40.0

2

30.0

1.5

1

20.0

0.5

10.0

0

0.0
0.0

0.8

1.6

2.4

3.2

0

4.0

60

1.2

50

1.0

40

0.8

1020304050620

660

TA=25℃
IF =20mA

0.6

30

0.4

200.2

100.00020406080500

100540580700

Reversion 1-2 September 2009www.sanderled.tw-4-Soldering Conditions - Lamp Type LED

Solder the LED no closer than 3mm from the base of the epoxy bulb. Soldering beyond the base ofthe tie bar is recommended
Recommended soldering conditions

Dip Soldering
Pre-Heat
Pre-Heat Time
Solder Bath Temperature
Dipping Time
Dipping Position

100℃ Max.
60 sec. Max.
260℃ Max.
5 sec. Max.
No lower than 3mm from the base of the epoxy bulb.

Hand Soldering
3Ø Series
Temperature
Soldering timePosition

Others (Including Lead-Free Solder)

300℃ Max.
3 sec. Max.
No closer than 3mm fromthe base of the epoxy bulb.

350℃ Max.
3 sec. Max.
No closer than 3mm fromthe base of the epoxy bulb.

Do not apply any stress to the lead, particularly when heated

The LEDs must not be repositioned after soldering
After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration
until the LEDs return to room temperature.
Direct soldering onto a PC board should be avoided. Mechanical stress to the resin may be caused by
the PC board warping or from the clinching and cutting of the leadframes. When it is absolutely
necessary, the LEDs may be mounted in this fashion, but, the User will assume responsibility for any
problems. Direct soldering should only be done after testing has confirmed that no damage, such as
wire bond failure or resin deterioration, will occur. Sander’s LEDs should not be soldered directly to
double sided PC boards because the heat will deteriorate the epoxy resin.
When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize themechanical stress on the LEDs.

Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may
cause LED failure.

Reversion 1-2 September 2009www.sanderled.tw-5-