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XTC/3
Thin Film Deposition Controller
PN 074-446-P1N

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Trademarks
The trademarks of the products mentioned in this manual are held by the companies that
produce them.
Windows®, Windows 95® and Microsoft® are registered trademarks of Microsoft Corporation.
Viton®, Kalraz® and Teflon® are registered trademarks of DuPont Co.
ConFlat® is a registered trademark of Varian Corporation.
Chemraz® is a registered trademark of Greene, Tweed & Co., Inc.
Cajon® and VCR® are registered trademarks of Cajon Co., Macedonia, OH.
SWAGELOK® is a registered trademark of Swagelok Co.
Inconel® is a registered trademark of Inco Alloys International, Huntington, WV.
All other brand and product names are trademarks or registered trademarks of their respective companies.

Disclaimer
The information contained in this manual is believed to be accurate and reliable. However, INFICON assumes
no responsibility for its use and shall not be liable for any special, incidental, or consequential damages related
to the use of this product.
Due to our continuing program of product improvements, specifications are subject to change without notice.

Copyright©2021 All rights reserved.
Reproduction or adaptation of any part of this document without permission is unlawful.

Declaration Of Conformity
Page 1

Warranty

Warranty
Standard INFICON One Year
Page 1WARRANTY AND LIABILITY - LIMITATION: Seller warrants the products
manufactured by it, or by an affiliated company and sold by it, and described on
the reverse hereof, to be, for the period of warranty coverage specified below, freefrom defects of materials or workmanship under normal proper use and service.
The period of warranty coverage is specified for the respective products in therespective Seller instruction manuals for those products but shall not be less thanWZR () yearV from the date of shipment thereof by Seller. Seller's liability under
this warranty is limited to such of the above products or parts thereof as are
returned, transportation prepaid, to Seller's plant, not later than thirty (30) days
after the expiration of the period of warranty coverage in respect thereof and arefound by Seller's examination to have failed to function properly because of
defective workmanship or materials and not because of improper installation or
misuse and is limited to, at Seller's election, either (a) repairing and returning the
product or part thereof, or (b) furnishing a replacement product or part thereof,transportation prepaid by Seller in either case. In the event Buyer discovers or
learns that a product does not conform to warranty, Buyer shall immediately
notify Seller in writing of such non-conformity, specifying in reasonable detail thenature of such non-conformity. If Seller is not provided with such written
notification, Seller shall not be liable for any further damages which could havebeen avoided if Seller had been provided with immediate written notification.
THIS WARRANTY IS MADE AND ACCEPTED IN LIEU OF ALL OTHERWARRANTIES, EXPRESS OR IMPLIED, WHETHER OF MERCHANTABILITY OR
OF FITNESS FOR A PARTICULAR PURPOSE OR OTHERWISE, AS BUYER'S
EXCLUSIVE REMEDY FOR ANY DEFECTS IN THE PRODUCTS TO BE SOLDHEREUNDER. All other obligations and liabilities of Seller, whether in contract or
tort (including negligence) or otherwise, are expressly EXCLUDED. In no event
shall Seller be liable for any costs, expenses or damages, whether direct orindirect, special, incidental, consequential, or other, on any claim of any defective
product, in excess of the price paid by Buyer for the product plus returntransportation charges prepaid.
No warranty is made by Seller of any Seller product which has been installed,
used or operated contrary to Seller's written instruction manual or which has been
subjected to misuse, negligence or accident or has been repaired or altered byanyone other than Seller or which has been used in a manner or for a purpose forwhich the Seller product was not designed nor against any defects due to plans or
instructions supplied to Seller by or for Buyer.
This manual is intended for private use by INFICON® Inc. and its customers.
Contact INFICON before reproducing its contents.
NOTE: These instructions do not provide for every contingency that may arise inconnection with the installation, operation or maintenance of this equipment.
Should you require further assistance, please contact INFICON.

www.inficon.com

reachus@inficon.com

XTC/3 Operating Manual

Table Of Contents
Cover Page
Trademarks
Disclaimer
Copyright
Declaration Of Conformity
Warranty

Chapter 1
Introduction and Specifications
1.1
1.1.1
1.2
1.2.1
1.2.2
1.2.3
1.2.4
1.3
1.3.1
1.4
1.4.1
1.4.2
1.4.3
1.4.3.1

Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-1
Related Manuals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-2
XTC/3 Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-2
Definition of Notes, Cautions and Warnings. . . . . . . . . . . . . . . . . . . . . . . . .1-2
General Safety Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-3
Earth Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-4
Main Power Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-4
How to Contact INFICON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-5
Returning Sensor to INFICON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-5
XTC/3 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-6
Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-6
Screens and Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-6
Process Recipe Storage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-7
Film Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-7

1.4.4
1.4.5
1.4.6
1.4.7
1.4.8
1.4.9
1.4.101.4.11
1.4.12
1.4.13
1.4.141.4.151.4.16

Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-8
Source / Recorder Outputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-9
Relays / Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-9
Remote Communications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-10
Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-10
Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-10
Operating Environment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-11
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-11
Warm Up Period . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-11
Size. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-11
Connector Clearance Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-11
Weight . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-11
Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-11

TOC - 1

XTC/3 Operating Manual

1.5
1.6
1.6.1
1.6.2
1.6.3
1.6.4
1.7

Unpacking and Inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12
Parts and Options Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12
Base Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12
Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-13
Replacement Cables & Oscillators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14
Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14
Initial Power On Verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16

Chapter 2
Installation and Interfaces
2.1
2.1.1
2.1.2
2.1.3
2.2
2.2.1
2.2.2
2.2.3
2.3
2.3.1
2.3.2
2.3.3
2.3.3.1

Location Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Sensor Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Sensor Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
XTC/3 Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
Avoiding Electrical Interference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
Verifying/Establishing Earth Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
Connections to Earth Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
Minimizing Noise Pickup From External Cabling . . . . . . . . . . . . . . . . . . . . . 2-6
Connecting the Controller. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
Verifying the Correct Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
Routing Oscillator (XIU) Cables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
Interface Cable Fabrication and Pin-Out . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
Source Control Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7

2.3.3.2

Input and Output Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-8

2.3.3.2.1

System I/O Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9

2.3.3.2.2

Aux I/O Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10

2.3.3.2.3

Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-10

2.3.4
2.3.5
2.3.5.1

RS-232C Communications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11
TCP/IP Communications Connection (Optional) . . . . . . . . . . . . . . . . . . . . 2-11
Network Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11

2.3.5.2

Change the IP Address in XTC/3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11

2.3.5.3

PC Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11

Chapter 3
Operation
3.1
3.2
3.3
3.3.1
3.3.2

TOC - 2

Front Panel Controls . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Rear Panel Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
Displays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
Menu Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
Operate Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5

XTC/3 Operating Manual

3.3.2.1

Crystal Life and Starting Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-8

3.3.2.2

Choosing The Right Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-8

3.3.2.3

Percent Life Auto-Zero . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-8

3.3.3
3.3.4
3.3.5
3.3.6
3.3.7
3.3.8
3.4
3.5
3.5.1
3.5.1.1

Film Name Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-9
Process List Display (XTC/3M only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-10
General Parameter Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-11
I/O Map Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-12
Diagnostics Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-12
Sensor Information Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-13
Executing a Process. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-14
State Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-17
Alarms and Stops . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-23
Alarms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-23

3.5.1.2

Stops . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-23

3.5.1.3

Recovering from STOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-24

3.6
3.6.1
3.6.2
3.6.3
3.6.4
3.6.5
3.6.6
3.6.7
3.6.7.1

Special Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-24
Automating a Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-24
Ion Assisted Deposition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-25
Control Delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-25
Shutter Delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-25
Rate Ramp Trigger of Final Thickness . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-25
Transfer Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-25
Crucible Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-26
Bin mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-26

3.6.7.2

BCD mode (XTC/3M only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-26

3.6.8
3.6.8.1

Crystal Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-26
CrystalTwo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-27

3.6.8.2

CrystalSix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-28

3.6.8.3

Crystal12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-28

3.6.8.4

Rotary Sensor Crystal Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-29

3.6.8.5

Dual Head. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-29

3.6.8.6

XTC/3S Sensor Shutter / CrystalSwitch Output . . . . . . . . . . . . . . . . . . . . .3-30

3.6.9
3.6.103.6.11
3.6.12
3.6.133.6.143.6.15

Start Layer Without Backup Crystal Configuration . . . . . . . . . . . . . . . . . . .3-30
RateWatcher. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-31
Hand-held Controller (Option) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-31
Lock Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-32
Parameter Clear . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-32
Datalog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-32
TCP/IP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-33

TOC - 3

XTC/3 Operating Manual

Chapter 4
XTC/3 Programming
4.1
4.2
4.2.1
4.2.2
4.2.3
4.2.3.1

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
Film Set Up Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
Film Set Up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
Film Definition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4
Film Definition Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
Pre/Post Deposition Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5

4.2.3.2

Deposit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7

4.2.3.3

Sensor Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8

4.2.3.3.1

Setting S&Q Parameters (Soft Crystal Failures) . . . . . . . . . . . . . . . . . . . . . 4-9

4.2.3.3.2

Stability. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-9

4.2.3.3.3

Quality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-10

4.2.3.4

Source Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-11

4.2.3.5

Option. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-14

4.3
4.3.1
4.3.1.1

Process Set-Up Overview (XTC/3M only) . . . . . . . . . . . . . . . . . . . . . . . . . 4-16
Process Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-17
Process Number. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-17

4.3.1.2

Process Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-17

4.3.1.3

Building the Layer Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-17

4.4
4.4.1
4.4.2
4.4.2.1

General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-18
Process Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-19
Hardware Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-21
XTC/3S Film Select Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-23

4.4.3
4.4.3.1

Comm Info . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-24
Remote Communication Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-25

4.5
4.5.1
4.5.2
4.5.3
4.5.4

I/O Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-26
XTC/3S Inputs and Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-27
XTC/3M Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-28
XTC/3M Outputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-29
Clear Input or Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-31

Chapter 5
Remote Communications
5.1
5.1.1
5.1.2
5.1.3
5.1.4

TOC - 4

Remote Communications Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
Message Protocols. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
Physical Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2
RS-232C Serial Port. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2
TCP/IP Ethernet Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2

XTC/3 Operating Manual

5.1.4.1

Network Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-2

5.1.4.2

How to Set Up the Network Protocol on the PC . . . . . . . . . . . . . . . . . . . . . .5-3

5.2
5.2.1
5.2.1.1

Standard Protocol Message Format. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-6
Standard Protocol. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-6
Standard Command Packet (Host to XTC/3 Message) . . . . . . . . . . . . . . . .5-6

5.2.1.2

Standard Response Packet (XTC/3 to Host Message) . . . . . . . . . . . . . . . .5-8

5.2.2
5.2.2.1

Standard Communication Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-10
Standard ECHO Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-10

5.2.2.2

Standard HELLO Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-10

5.2.2.3

Standard QUERY Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-11

5.2.2.3.1

Query Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-11

5.2.2.3.2

Standard Query Film Name (XTC3/M only) . . . . . . . . . . . . . . . . . . . . . . . .5-13

5.2.2.3.3

Standard Query Film Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-13

5.2.2.3.4

Standard Query General Parameter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-13

5.2.2.3.5

Standard Query Input Definition (XTC/3M Only) . . . . . . . . . . . . . . . . . . . .5-14

5.2.2.3.6

Standard Query Output Definition (XTC/3M Only) . . . . . . . . . . . . . . . . . . .5-15

5.2.2.3.7

Standard Query Output Type Definition (XTC/3M Only) . . . . . . . . . . . . . .5-18

5.2.2.3.8

Standard Query Process Parameters (XTC/3M Only) . . . . . . . . . . . . . . . .5-18

5.2.2.4

Standard UPDATE Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-19

5.2.2.4.1

Update Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-19

5.2.2.4.2

Standard Update Film Name (XTC/3M only) . . . . . . . . . . . . . . . . . . . . . . .5-20

5.2.2.4.3

Standard Update Film Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-21

5.2.2.4.4

Standard Update General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-25

5.2.2.4.5

Standard Update Input Definition (XTC/3M only) . . . . . . . . . . . . . . . . . . . .5-27

5.2.2.4.6

Standard Update Output Definition (XTC/3M only) . . . . . . . . . . . . . . . . . .5-27

5.2.2.4.7

Standard Update Output Type Definition (XTC/3M Only). . . . . . . . . . . . . .5-28

5.2.2.4.8

Standard Update Process Parameters (XTC/3M only). . . . . . . . . . . . . . . .5-28

5.2.2.5

Standard STATUS Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-29

5.2.2.6

Standard REMOTE Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-34

5.3
5.3.1
5.3.2
5.3.3
5.3.4
5.3.5
5.3.5.1

XTC/2 Protocols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-36
Basic Command Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-36
XTC/2 Serial Communication with Checksum . . . . . . . . . . . . . . . . . . . . . .5-37
XTC/2 Serial Communications - No Checksum . . . . . . . . . . . . . . . . . . . . .5-37
XTC/2 Error Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-38
XTC/2 Message Strings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-39
XTC/2 ECHO Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-39

5.3.5.2

XTC/2 HELLO Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-39

5.3.5.3

XTC/2 QUERY Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-39

TOC - 5

XTC/3 Operating Manual

5.3.5.4

XTC/2 UPDATE Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-41

5.3.5.5

XTC/2 STATUS Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-42

5.3.5.6

XTC/2 REMOTE Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-46

5.3.5.7

XTC/2 Sample Host Programs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-48

5.3.5.7.1

XTC/2 Program Without Checksum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-48

5.3.5.7.2

XTC/2 Program With Checksum . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-49

Chapter 6
Troubleshooting, Status and Error Messages
6.1
6.2
6.3
6.3.1
6.3.2
6.3.2.1

Status and Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
XTC/3 Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-6
Troubleshooting Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-8
Troubleshooting XTC/3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-9
Troubleshooting Transducers/Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-11
Verifying Crystal Switching and Rotation . . . . . . . . . . . . . . . . . . . . . . . . . . 6-11

6.3.2.2

Verifying Sensor Shutter Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-11

6.3.3
6.3.3.1

Troubleshooting Computer Communications . . . . . . . . . . . . . . . . . . . . . . . 6-17
TCP/IP Module LED Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-17

6.4
6.4.1
6.4.2
6.4.3
6.4.4
6.4.5
6.4.6
6.4.7
6.4.8
6.5
6.5.1
6.5.1.1

Replacing the Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-18
Front Load Single Sensors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-18
Shuttered Front Load Single and Front Load Dual Sensors . . . . . . . . . . . 6-19
Cool Drawer Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-19
Bakeable Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-21
Sputtering Sensor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-22
Crystal Snatcher. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-23
CrystalSix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-23
Crystal12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-23
Crystal Sensor Emulator PN 760-601-G2 . . . . . . . . . . . . . . . . . . . . . . . . . 6-24
Diagnostic Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-25
Measurement System Diagnostic Procedure . . . . . . . . . . . . . . . . . . . . . . . 6-25

6.5.1.2

Feed-Through Or In-Vacuum Cable
Diagnostic Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-26

6.5.1.3

Sensor Head Or Monitor Crystal
Diagnostic Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-27

6.5.1.4

System Diagnostics Pass But
Crystal Fail Message Remains. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-28

6.5.2
6.5.3
6.5.3.1% XTAL Life . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-28
Sensor Cover Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-29
Compatible Sensor Heads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-29

6.5.3.2

Incompatible Sensor Heads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-29

TOC - 6

XTC/3 Operating Manual

6.5.4

Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6-30

Chapter 7
Calibration Procedures
7.1
7.2
7.3
7.4
7.5

Importance of Density, Tooling and Z-Ratio . . . . . . . . . . . . . . . . . . . . . . . . .7-1
Determining Density . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-1
Determining Tooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-2
Laboratory Determination of Z-Ratio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-3
Estimating Z-Ratio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7-4

Chapter 8
Measurement and Control Theory
8.1
8.1.1
8.1.2
8.1.3
8.1.4
8.1.5
8.1.6

Basics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-1
Monitor Crystals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-2
Period Measurement Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-4
Z-Match Technique. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-5
Active Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-6
ModeLock Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-7
Control Loop Theory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8-9

Chapter A
Material Table

TOC - 7

XTC/3 Operating Manual

Chapter 1
Introduction and Specifications
1.1 Introduction
XTC/3 is produced in two versions:

XTC/3M Multi-Layer Deposition Controller



XTC/3S Single Layer Deposition Controller

This manual covers both instruments, using the designation XTC/3 when thesubject matter applies to both instruments and XTC/3M or XTC/3S when thesubject matter applies to a specific instrument.
This operating manual provides user information for installing, programming, andoperating the XTC/3.
XTC/3 is a closed loop process controller designed for use primarily in physicalvapor deposition. XTC/3 monitors and/or controls the rate and thickness of thin film
depositions. Deposition rate and thickness are inferred from the frequency change
induced by mass added to a quartz crystal.
This technique positions sensors in the path between, or to the side of, the target
substrate and the source of vaporized material. The sensor incorporates an
exposed oscillating quartz crystal whose frequency decreases as material
accumulates. The change in frequency provides information to determine rate andthickness and to continually control the evaporation power source.
With user-supplied time, thickness, and power limits and with desired rates andmaterial characteristics, XTC/3 is capable of automatically controlling the process
in a precise and repeatable manner. User interaction is accomplished through thefront panel or serial communications, and consists of selection or entry ofparameters to define the process.
The complete system consists of:main control unit (XTC/3)



sensor or sensors

crystal interface unit (XIU) for each attached sensor

These items are generally bundled at the factory and are also sold separately.
When reading this XTC/3 Operating Manual, please pay particular attention to the
NOTES, CAUTIONS, and WARNINGS found throughout the text. The Notes,
Cautions, and Warnings are defined in section 1.2.1 on page 1-2.

1-1

XTC/3 Operating Manual

1.1.1 Related Manuals
Sensors are covered in separate manuals. PDF files of these manuals arecontained in the Thin Flim Manuals CD (PN 074-5000-G1), included in the Ship Kit.


PN 074-154 - Bakeable

PN 074-155 - CrystalSix



PN 074-156 - Single/Dual

PN 074-157 - Sputtering

PN 074-398 - Crystal12

1.2 XTC/3 Safety
1.2.1 Definition of Notes, Cautions and Warnings
When using this manual, please pay attention to the NOTES, CAUTIONS andWARNINGS found throughout. For the purposes of this manual they are defined
as follows:
NOTE: Pertinent information that is useful in achieving maximum XTC/3 efficiency
when followed.

CAUTION
Failure to heed these messages could result in damage
to XTC/3.

WARNING
Failure to heed these messages could result inpersonal injury.

WARNING - Risk Of Electric Shock
Dangerous voltages are present which could result inpersonal injury.

1-2

XTC/3 Operating Manual

1.2.2 General Safety Information
WARNING - Risk Of Electric Shock
Do not open the XTC/3 case! There are nouser-serviceable components within the XTC/3 case.
Dangerous voltages may be present whenever the power
cord or external input/relay connectors are present.
Refer all maintenance to technically qualified personnel.

CAUTION
XTC/3 contains delicate circuitry which is susceptible totransient power line voltages. Disconnect the line cord
whenever making any interface connections. Refer all
maintenance to qualified personnel.

WARNING
Failure to operate XTC/3 in the manner intended by
INFICON can circumvent the safety protection provided
by XTC/3 and may result in personal injury.

1-3

XTC/3 Operating Manual

1.2.3 Earth Ground
XTC/3 is connected to earth ground through a sealed three-core (three-conductor)
power cable, which must be plugged into a socket outlet with a protective earthterminal. Extension cables must always have three conductors including aprotective earth terminal.

WARNING - Risk Of Electric ShockNever interrupt the protective earth circuit.
Any interruption of the protective earth circuit inside oroutside XTC/3, or disconnection of the protective earthterminal is likely to make XTC/3 dangerous.

This symbol indicates where the protective earth groundis connected inside XTC/3. Never unscrew or loosen
this connection.

1.2.4 Main Power Connection
WARNING - Risk Of Electric Shock
XTC/3 has line voltage present on the primary circuits
whenever it is plugged into a main power source.
Never remove the covers from XTC/3 during normal
operation.
There are no operator-serviceable items within XTC/3.
Removal of the top or bottom covers must be done only
by a technically qualified person.

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XTC/3 Operating Manual

1.3 How to Contact INFICONWorldwide customer support information is available under Support >> Support
Worldwide at www.inficon.com:
Sales and Customer ServiceTechnical Support

Repair Service

When communicating with INFICON about a XTC/3, please have the following
information readily available:
The Sales Order or Purchase Order number of the XTC/3 purchase.

The firmware version and software version (displayed at XTC/3 power-up)of the optional applications software.



A description of the problem.

The exact wording of any error messages that may have been received.

An explanation of any corrective action that may have already been attempted.

1.3.1 Returning Sensor to INFICON
Do not return any sensor component to INFICON before speaking with a Customer
Support Representative and obtaining a Return Material Authorization (RMA)
number. XTC/3 will not be serviced without an RMA number.
Packages delivered to INFICON without an RMA number will be held until thecustomer is contacted. This will result in delays in servicing XTC/3.
Prior to being given an RMA number, a completed Declaration Of Contamination(DoC) form will be required. DoC forms must be approved by INFICON before an
RMA number is issued. INFICON may require that the XTC/3 be sent to a
designated decontamination facility, not to the factory.
Before returning XTC/3, create a record of all user-entered parameters so they
may be re-entered, if required.

1-5

XTC/3 Operating Manual

1.4 XTC/3 Specifications
1.4.1 Measurement
Measurement Frequency Range . . . 6.0 to 5.0 MHz (fixed)
Frequency Resolution. . . . . . . . . . . . ± 0.028 Hz @ 6 MHz
Thickness and Rate
Resolution/Measurement . . . . . . . . . ± 0.034 Å @ tooling/density = 100/1
Fundamental frequency = 6 MHz
Measurement Interval. . . . . . . . . . . . 0.25 s
Thickness Accuracy . . . . . . . . . . . . . 0.5% typical, (dependent on process
conditions, especially sensor location,material stress, temperature and density)
Frequency Accuracy . . . . . . . . . . . . . ± 2.5 ppm 0 to 50°C
Measurement Frequency . . . . . . . . . 4 Hz
Measurement Technique . . . . . . . . . ModeLockUser Interface . . . . . . . . . . . . . . . . . . TFT LCD and limited membrane keypad.
All parameters accessible through computercommunications. Multiple message areas forindication of states and detailed indication ofabnormal and stop conditions.

1.4.2 Screens and Parameters
Navigation. . . . . . . . . . . . . . . . . . . . . Menu key to go between screens.
Four cursor keys to go between
parameters on screens.
Structure . . . . . . . . . . . . . . . . . . . . . . Separate screens dedicated to:1) Operate Data Display
2) Film Parameters
3) Process List (XTC/3M only)
4) General Parameters
5) I/O Map
6) Diagnostics
7) Sensor

1-6

XTC/3 Operating Manual

1.4.3 Process Recipe Storage
XTC/3M

XTC/3S

Process Programs

99

1

Film Programs

32

9Process Layers

999
perprocess1

1.4.3.1 Film Parameters
Pre/Post Deposit
Power Ramps. . . . . . . . . . . . . . . . . . 2 per film
Power Level . . . . . . . . . . . . . . . . 0.0 to 100%
Rise Time . . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:sSoak Time . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:s
Idle Ramps . . . . . . . . . . . . . . . . . . . . 1 per film
Idle Power . . . . . . . . . . . . . . . . . 0.0 to 100.0%
Idle Ramp Time . . . . . . . . . . . . . 00:00 to 99:59 min:s
DepositDeposition Rate . . . . . . . . . . . . . . . . 0.0 to 999.9 Å/s (display shows three digits)
Final Thickness . . . . . . . . . . . . . . . . 0.0 to 999.9 kÅ
Thickness Set Point . . . . . . . . . . . . . 0.0 to 999.9 kÅ
Rate Ramp . . . . . . . . . . . . . . . . . . . . 1 per film
New Rate . . . . . . . . . . . . . . . . . . 0.0 to 999.9 Å/s (display shows three digits)
Ramp Time . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:s
RateWatcher® . . . . . . . . . . . . . . . . . Sample and Hold Feature
RateWatch Accuracy . . . . . . . . . 1 to 99%
RateWatch Hold . . . . . . . . . . . . . 00:00 to 99:59 min:sSensorSensor # . . . . . . . . . . . . . . . . . . . . . . 1 or 2
Tooling . . . . . . . . . . . . . . . . . . . . . . . 10.0 to 500.0%
Second Tooling . . . . . . . . . . . . . . . . 10.0 to 500.0%
Crystal Stability, Single. . . . . . . . . . . 0, 25 to 9999 Hz (1 to 24 are excluded)

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XTC/3 Operating Manual

Crystal Stability, Total . . . . . . . . . . . . 0, 25 to 9999 Hz (1 to 24 are excluded)
Crystal Quality Percent. . . . . . . . . . . 0 to 99%
Crystal Quality Counts . . . . . . . . . . . 0 to 99
SourceSource # . . . . . . . . . . . . . . . . . . . . . . 1 or 2
Crucible Selection. . . . . . . . . . . . . . . 0 to 8, each source (0=disabled)
Control Gain . . . . . . . . . . . . . . . . . . . 0.01 to 100 Å/s / %Power
Control Time Constant . . . . . . . . . . . 0.1 to 100.0 s
Control Dead Time . . . . . . . . . . . . . . 0.1 to 100.0 s
Maximum Source Power . . . . . . . . . 0.0 to 100%
Density . . . . . . . . . . . . . . . . . . . . . . . 0.50 to 99.99 g/cm3
Z-Ratio . . . . . . . . . . . . . . . . . . . . . . . 0.100 to 9.999
OptionTime Power . . . . . . . . . . . . . . . . . . . Yes / No
Delay Option. . . . . . . . . . . . . . . . . . . None, Shutter, Control, Both
Transfer Sensor . . . . . . . . . . . . . Yes / No
Transfer Tooling . . . . . . . . . . . . . 10.0 to 500.0%
Control Delay Time . . . . . . . . . . . 00:00 to 99:59 min:s
Ion Assisted Deposit . . . . . . . . . . . . . Yes / No
Name (XTC/3M only) . . . . . . . . . . . . provision for 15 alpha numerics

1.4.4 Display
Type/Color/Size . . . . . . . . . . . . . . . . TFT LCD, 3.8 in. diagonal
Format . . . . . . . . . . . . . . . . . . . . . . . Quarter VGA
Resolution. . . . . . . . . . . . . . . . . . . . . 320 H x 240 V
Thickness Display Range . . . . . . . . . 0.000 to 999.9 kÅ
Thickness Display Resolution. . . . . . 1 Å for 0 to 9.999 kÅ
10 Å for 10.00 to 99.99 kÅ
100 Å for 100.0 to 999.9 kÅ
1 kÅ for 1000 kÅ to 9999 kÅRate Display Range . . . . . . . . . . . . . 0.0 to 99.9 Å/s; 100 to 999 Å/sRate Display Resolution . . . . . . . . . . 0.1 Å for 0 to 99.9 Å/s
1 Å for 100 to 999 Å/s

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XTC/3 Operating Manual

Power Display Range. . . . . . . . . . . . 0.0 to 99.9%
Graphic Display Functions . . . . . . . . Rate Deviation at ± 5, 10, 20, or 40 Å/s orPower at 0.0 to 100%
Display Data Update Rate . . . . . . . . 1 Hz

1.4.5 Source / Recorder Outputs
Quantity . . . . . . . . . . . . . . . . . . . . . . 3 BNC, Female
Configuration . . . . . . . . . . . . . . . . . . Source 1, Source 2, Recorder
Function Ranges
Source Control . . . . . . . . . . . . . . 0 to 10 V, 0 to -10 V, 0 to 5 V,
0 to -5 V, 0 to 2.5 V, 0 to -2.5 V
Recorder Output. . . . . . . . . . . . . 0 to +10 V
Current rating . . . . . . . . . . . . . . . . . . 25 mA max. per channel on Source 1 andSource 2, 5 mA max. on Recorder
Resolution . . . . . . . . . . . . . . . . . . . . 15 bits over full range (10 V)
Update Rate . . . . . . . . . . . . . . . . . . . 4 Hz, maximum, (dependent onsource characteristics).
Recorder Output Functions . . . . . . . Rate or Thickness or Power orRate Deviation
Recorder Output Ranges
Power . . . . . . . . . . . . . . . . . . . . . 0 to 100%Rate . . . . . . . . . . . . . . . . . . . . . . 0 to 100 Å/s, 0 to 1000 Å/s
Thickness . . . . . . . . . . . . . . . . . . 0 to 100 Å, 0 to 1000 Å (both ranges modulo)
Rate Deviation . . . . . . . . . . . . . . Desired rate ± 50 Å/s
Accuracy. . . . . . . . . . . . . . . . . . . . . . 2% full scale

1.4.6 Relays / Inputs
Relays . . . . . . . . . . . . . . . . . . . . . . . SPST 2.5 A relays rated @ 30 V (dc) or
30 V (ac) RMS or 42 V (peak) maximum;
12 standard; D sub connector; relays arenormally open in the power off state, may be
programmed to normally open or normallyclosed during operation on XTC/3M.
Relay Ratings . . . . . . . . . . . . . . . . . . 100 VA inductive; 2.5 A maximum.

1-9

XTC/3 Operating Manual# of TTL Compatible Outputs . . . . . . 8 standard, Internally pulled up to 5 V (dc).
May be pulled up externally to
24 V (dc) through 2.4 k resistor.
minimum high level 0.5 mA load @3.75 V
maximum low level 10 mA load @1.1 V
Inputs (TTL Compatible) . . . . . . . . . . 9 standard
Input Levels
Maximum High . . . . . . . . . . . . . . 24 V
Minimum High. . . . . . . . . . . . . . . 2.5 V
Maximum Low . . . . . . . . . . . . . . 1.1 V
Scan/Update Rate . . . . . . . . . . . . . . 4 Hz

1.4.7 Remote Communications
RS232C Serial Port . . . . . . . . . . . . . Standard; see section 5.1.1 on page 5-1
Baud Rates. . . . . . . . . . . . . . . . . 9,600; 19,200; 38,400; 57,600; 115,200
Ethernet TCP/IP Port . . . . . . . . . . . . Optional. Static address,
DHCP not supported.

1.4.8 Accessories
Handheld Power Controller Option. . (connects to jank on front panel)
Functions . . . . . . . . . . . . . . . . . . Increase or decrease power, Stop,
CrystalSwitch
Connector Kit . . . . . . . . . . . . . . . . . . Connectors for inputs and relays
Operating Manual . . . . . . . . . . . . . . . CD, PN 074-5000-G1

1.4.9 PowerPower . . . . . . . . . . . . . . . . . . . . . . . . 100 - 230 V (ac), 50/60 Hz
Maximum Apparent Power . . . . . . . . 60 VA max.
Fuse . . . . . . . . . . . . . . . . . . . . . . . . . 1.25 A, 250 V, Type (T)Temporary Overvoltages . . . . . . . . . Short Term: 1430 V, <5 sLong Term: 480 V, >5 s

1 - 10XTC/3 Operating Manual

1.4.10 Operating Environment
Usage . . . . . . . . . . . . . . . . . . . . . . . . Indoor only
Temperature . . . . . . . . . . . . . . . . . . . 0 to 50°C (32-122°F)
Humidity . . . . . . . . . . . . . . . . . . . . . . Up to 80% RH. @ 31°C, non-condensing
Altitude . . . . . . . . . . . . . . . . . . . . . . . Up to 2000 m
Installation (Overvoltage) . . . . . . . . . Category II
Measurement Category . . . . . . . . . . II
Pollution Degree. . . . . . . . . . . . . . . . 2

1.4.11 Storage Temperature
Storage Temperature . . . . . . . . . . . . -10 to 70°C (14 to 158°F)

1.4.12 Warm Up Period
Warm Up Period. . . . . . . . . . . . . . . . None required;
For maximum stability allow five minutes.

1.4.13 Size
H x W x L (not including mounts or user connectors)
89 x 203 x 305 mm (3.5 x 8 x 12 in.)1.4.14 Connector Clearance Requirements
Front . . . . . . . . . . . . . . . . . . . . . . . . . Less than 26 mm (1.0 in.)
Rear . . . . . . . . . . . . . . . . . . . . . . . . . Less than 102 mm (4.0 in.)1.4.15 WeightWith all options . . . . . . . . . . . . . . . . . 2.7 kg (6 lb)

1.4.16 Cleaning
Use a mild, nonabrasive cleaner or detergent taking care to prevent cleaner fromentering the unit.

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XTC/3 Operating Manual

1.5 Unpacking and Inspection
1 If XTC/3 control module has not been removed from its shipping container,
do so now.

2 Carefully examine the control module for damage that may have occurred
during shipping. This is especially important if you notice obvious roughhandling on the outside of the container. Immediately report any damage to thecarrier and to INFICON.

3 Do not discard the packing materials until you have taken inventory and haveat least performed a power-on verification.

4 Take an inventory of your order by referring to the order invoice and theinformation contained in section 1.6 on page 1-12.

5 To perform a power-on verification (see section 1.7 on page 1-16).
6 For additional information or technical assistance, contact INFICON(refer to section 1.3 on page 1-5).

1.6 Parts and Options Overview
1.6.1 Base Configurations
XTC/3M Control Unit for nom. 120 V (ac). . . . . . PN XC3M-1xxx
XTC/3M Control Unit for nom. 230 V (ac). . . . . . PN XC3M-2xxx
XTC/3S Control Unit for nom. 120 V (ac) . . . . . . PN XC3S-1xxx
XTC/3S Control Unit for nom. 230 V (ac) . . . . . . PN XC3S-2xxx
Technical Manual . . . . . . . . . . . . . . . . . . . . . . . . PN 074-446 on 074-5000-G1 CD
Handheld Power Controller . . . . . . . . . . . . . . . . PN 755-262-G1, Optional
Ship Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PN 780-603-G1 (120 V (ac)) or
PN 780-603-G2 (230 V (ac))

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XTC/3 Operating Manual

1.6.2 Accessories
Each sensor requires an oscillator kit to interface to the controller:
XTC/3 4.6 m (15 ft.) Oscillator Kit. . . . . . . . . . . . . . . . . . . . . PN 780-611-G15
XTC/3 9.2 m (30 ft.) Oscillator Kit. . . . . . . . . . . . . . . . . . . . . PN 780-611-G30
XTC/3 15.3 m (50 ft.) Oscillator Kit. . . . . . . . . . . . . . . . . . . . PN 780-611-G50
XTC/3 30.5 m (100 ft.) Oscillator Kit. . . . . . . . . . . . . . . . . . . PN 780-611-G100
Above kits consist of oscillator PN 780-600-G1, 15.2 cm (6 in.) BNC oscillator
to feedthrough cable PN 755-257-G6 and multiconductor controller to oscillator
cable PN 600-1261-P15, 600-1261-P30, 600-1261-P50 or 600-1261-P100.
These kits are designed for use with the standard in-vacuum cables ranging inlength from 15.2 cm (6 in.) to 182.9 cm (72 in.). The PN 007-044 standard
in-vacuum cable supplied with the non-UHV Bakeable sensor versions are
78.1 cm (30.75 in.) long.
XTC/3 4.6 m (15 ft.) Oscillator Kit, 4 m / 6 in.. . . . . . . . . . . . PN 780-612-G15
XTC/3 9.2 m (30 ft.) Oscillator Kit, 4 m / 6 in.. . . . . . . . . . . . PN 780-612-G30
XTC/3 15.3 m (50 ft.) Oscillator Kit, 4 m / 6 in.. . . . . . . . . . . PN 780-612-G50
XTC/3 30.5 m (100 ft.) Oscillator Kit, 4 m / 6 in.. . . . . . . . . . PN 780-612-G100
Above kits consist of oscillator PN 780-600-G2 (4 m), 6 in. BNC oscillator
to feedthrough cable PN 755-257-G6, 157.5 in. (4 m) in-vacuum cable
PN 321-039-G16 and multiconductor controller to oscillator cable
PN 600-1261-P15, 600-1261-P30, 600-1261-P50 or 600-1261-P100.
XTC/3 4.6 m (15 ft.) Oscillator Kit, 4 m / 20 in.. . . . . . . . . . . PN 780-613-G15
XTC/3 9.2 m (30 ft.) Oscillator Kit, 4 m / 20 in.. . . . . . . . . . . PN 780-613-G30
XTC/3 15.3 m (50 ft.) Oscillator Kit, 4 m / 20 in.. . . . . . . . . . PN 780-613-G50
XTC/3 30.5 m (100 ft.) Oscillator Kit, 4 m / 20 in.. . . . . . . . . PN 780-613-G100
Above kits consist of oscillator PN 780-600-G2 (4 m), 20 in. BNC oscillator to
feedthrough cable PN 755-257-G20, 138 in. (3.5 m) in-vacuum cable
PN 321-039-G15 and multiconductor controller to oscillator cable
PN 600-1261-P15, 600-1261-P30, 600-1261-P50 or 600-1261-P100.
The 4 m Oscillator Kits permit the total length of coax cables from the output BNCof the oscillator to the Microdot connector at the sensor head to be in the range of
3 m (118 in.) to 4 m (157.5 in.) In the standard oscillator kit series PN 780-611-Gxx,
this length may range from 30.5 cm (12 in.) to 1.98 m (78 in.).
Sensor Emulator Kit (option) . . . . . . . . . . . . . . . . . . . . . . . . PN 760-601-G2
XTC/3 Monitor / Editor Software. . . . . . . . . . . . . . . . . . . . . . PN 780-032-G1
XTC/3 DLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PN 780-034-G1

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XTC/3 Operating Manual

All shuttered sensors and all multi-position sensors require a feedthrough with an
air line and a solenoid valve.
Solenoid Valve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PN 750-420-G1

1.6.3 Replacement Cables & Oscillators
Oscillator to Vacuum Feedthrough
BNC cable, 15.2 cm (6 in.) . . . . . . . . . . . . . . . . . . . . . . . . . .PN 755-257-G6
Oscillator to Vacuum Feedthrough
BNC cable, 50.8 cm (20 in.) . . . . . . . . . . . . . . . . . . . . . . . . .PN 755-257-G20
4 m / 6 in. XIU Cable Kit,
consists of PN 755-257-G6,(6 in. BNC cable) and PN 321-039-G16,(4.0 m In-Vacuum Sensor Cable). . . . . . . . . . . . . . . . . . . . ..PN 760-700-G6
4 m / 20 in. XIU Cable Kit,
consists of PN 755-257-G20,(20 in. BNC cable) and PN 321-039-G15,(3.5 m In-Vacuum Sensor Cable). . . . . . . . . . . . . . . . . . . . .PN 760-701-G20
XTC/3 Unit to Oscillator Cable, 4.6 m (15 ft.) . . . . . . . . . . . .PN 600-1261-P15
XTC/3 Unit to Oscillator Cable, 9.2 m (30 ft.) . . . . . . . . . . . .PN 600-1261-P30
XTC/3 Unit to Oscillator Cable, 15.3 m (50 ft.) . . . . . . . . . . .PN 600-1261-P50
XTC/3 Unit to Oscillator Cable, 30.5 m (100 ft.) . . . . . . . . . .PN 600-1261-P100
Standard XTC/3 Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . .PN 780-600-G1
4 m XTC/3 Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PN 780-600-G2

1.6.4 Sensors
XTC/3 is compatible with the following INFICON sensor types:
Front Load Single Sensor. . . . . . . . . . . . . . . . . . . . . . . . . . .PN SL-xxxx
Front Load Dual Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . .PN DL-Axxx
Cool Drawer Single Sensor . . . . . . . . . . . . . . . . . . . . . . . . .PN CDS-xxFxx
Cool Drawer Dual Sensor. . . . . . . . . . . . . . . . . . . . . . . . . . .PN CDD-xxFxx
Sputtering Sensor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PN 750-618-G1
Front Load Bakeable Sensor . . . . . . . . . . . . . . . . . . . . . . . .PN BK-AxF
CrystalSix Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PN 750-446-G1
Crystal12 Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PN XLI2-1xxxxx
RSH-600 Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PN 15320x-xx

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XTC/3 Operating Manual

For more information about Inficon’s full line of QCM sensors, please contact yourlocal INFICON representative or visit www.inficon.com.
Table 1-1 Crystal12 sensor

Crystal12 Sensor Package XL12-xxxxX

XL12-

Base Unit
None0

Crystal 12 Sensor

1

In-Vacuum Cable Assembly LengthNone078 cm (30.75 in.)1

15.2 cm (6 in.)2

30.5 cm (12 in.)3

61 cm (24 in.)4

91.4 cm (36 in.)5

121.9 cm (48 in.)6

152.4 cm (60 in.)7

182.9 cm (72 in.)8

Crystal Carousel Assembly
One (Included in Base Unit)

0

Spare Crystal Carousel Assembly1

Front Deposition Shield
One (Included in Base Unit)

0

Spare Front Deposition Shield

1

Mounting Post with Hardware
None0

Mounting Post Kit

1

Example: Crystal12 sensor with 78 cm (30.75 in.) cable, sparecarousel, spare front deposition shield, mounting post kit, andsolenoid valve is PN XL12-11111.

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XTC/3 Operating Manual

1.7 Initial Power On Verification
A preliminary functional check of XTC/3 can be made before formal installation. It
is not necessary to have sensors, source controls, inputs or relays connected to do
this. For more complete installation information, refer to Chapter 2, Installation andInterfaces.

WARNING - Risk Of Electric Shock
There are no user-serviceable components
within the XTC/3 case.
Dangerous voltages may be present whenever the power
cord or external input/relay connectors are present.
Refer all maintenance to qualified personnel.

WARNING - Risk Of Electric ShockNever interrupt the protective earth circuit.
Any interruption of the protective earth circuit inside oroutside XTC/3, or disconnection of the protective earthterminal is likely to make XTC/3 dangerous.

This symbol indicates where the protective earth groundis connected inside XTC/3. Never unscrew or loosen thisconnection.

1 Confirm that AC line voltage is supplied and proper for XTC/3. Set the powerswitch on XTC/3 rear panel to On.

2 Press the power button on the front panel. A green LED will illuminate next tothe power switch.

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XTC/3 Operating Manual

3 The LCD will display a screen similar to the one shown in Figure 1-1
or Figure 1-2.
Figure 1-1 XTC/3M operate screen

Figure 1-2 XTC/3S operate screen

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XTC/3 Operating Manual

Chapter 2
Installation and Interfaces
2.1 Location Guidelines
Before permanently installing XTC/3, read this entire chapter on Installation andInterfaces. Follow its recommendations as closely as possible. Failure to adhere tothese practices may adversely affect the performance and longevity of XTC/3.

2.1.1 Sensor Types
The choice of sensor type is dictated by the process, the deposition material andthe physical characteristics of the process chamber. General guidelines for eachsensor type produced by INFICON are outlined in the Sensor Data Sheets on the
www.inficon.com website.
For specific recommendations, consult your INFICON representative.
NOTE: If the installation replaces an XTC/2 or XTC/C with a dual sensor, andsensor type CrystalTwo is selected, PN 779-220-G1 (6 in. BNC Cables)
or PN 779-220-G2 (20 in. BNC Cables) and Xtal 2 (CrystalTwo) Switch is
required. XTC/3 uses only one Crystal Interface Unit (XIU) signal
connection at XTC/3 for the dual sensor. The Xtal 2 Switch is wired inparallel with the solenoid valve (PN 750-420-G1) to route the XIU
connection from one to the other crystal at the same time that the shutter
is activated. If sensor type Dual Head is selected, two XIU packages are
required and connected to Sensors 1 and 2.
NOTE: XTC/3 does not support CrystalSix sensor (PN 750-260-G1), which is nolonger produced. Current product CrystalSix (PN 750-446-G1) is fullycompatible with XTC/3.

CAUTION
The performance of XTC/3 depends on the careful installationof the chosen sensor.
Improper installation will cause problems with deposition
repeatability, crystal life and rate stability.

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XTC/3 Operating Manual

2.1.2 Sensor Installation
Figure 2-1 shows a typical installation of an INFICON water cooled crystal sensor
in the vacuum process chamber. Use the illustration and the following guidelines toinstall sensors for optimum performance and convenience.
Figure 2-1 Typical installation

Mounting Brackett
Coax Cable(Routed withwater tubes)

Braze/Weld Joint
or Compression Fittings

SensorShutter
Source to Sensor(10 in. Minimum)
SourceShutter

SourcePneumatic
ActuatorTo
Source Controller
Water In
Water OutIPN 750-420-G1
Solenoid
Valve

Instrument Chassis

XIU (Oscillator)
Air SupplyTo> Sensor

Shutter2-2

XTC/3 Operating Manual

Install the sensor as far as possible from the evaporation source(a minimum of 10 in. [254 mm] is recommended) while still being in a position toaccumulate thickness at a rate proportional to accumulation on the substrate.
Figure 2-2 shows proper and improper methods of installing sensors.
Figure 2-2 Sensor installation guidelines

Correct
Incorrect
Obstruction

Correct

Incorrect

Incorrect

SourceTo guard against spattering, use a source shutter or crystal shutter to shield thesensor during the initial soak periods. If the crystal is hit with even a small particleof molten material, it may be damaged and stop oscillating. Even in cases when it
does not completely stop oscillating, it may become unstable.
Follow these precautions: Mount the sensor to something rigid and fixed in the chamber. Do not rely on
the water tubes to provide support.
 Plan the installation to ensure there are no obstructions blocking the path
between the Sensor and the Source. Be certain to consider rotating
or moving fixtures.
 Install sensors so their central axis (an imaginary line drawn normal to thecenter of the crystal’s face) is aimed directly at the virtual source being
monitored. Verify that the total length of external and internal coax cable fromthe standard PN 780-600-G1 oscillator to the sensor does not exceed
100 in. (254 cm). An optional PN 780-600-G2 oscillator is available to handle
118 in. to 158 in. (3 m to 4 m) long in-vacuum coax cables.
 Ensure there is easy access for the exchange of crystals.
 For systems employing two XTC/3 for simultaneous source evaporation(co-deposition), locate the sensors so the evaporant from each source isflowing to only one sensor. It is not generally possible to do this without special
shielding or optional material directors.

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XTC/3 Operating Manual

2.1.3 XTC/3 Installation
XTC/3 is designed to be rack mounted with the optional rack mount kit(PN 780-702-G1). It may be also used on a table. A two-unit rack mount option kit(PN 780-702-G2) is available for mounting two XTC/3 side by side.
Centrally locate the controller to minimize the length of external cabling.

2.2 Avoiding Electrical Interference
Careful consideration of simple electrical guidelines during installation will avoid
many problems caused by electrical noise.
To maintain the required shielding and internal grounding and ensure safe andproper operation, XTC/3 must be operated with all enclosure covers, sub-panels,
and braces in place and fully secured with the screws and fasteners provided.
NOTE: When using XTC/3 with an RF sputtering system, the cable between
XTC/3 and oscillator should be kept as far away from the RF transmission
cable as possible. Interference from the RF transmission cable may cause
an erroneous crystal fail.

2.2.1 Verifying/Establishing Earth GroundIf a ground must be established, the following procedure is recommended:

2-4Where soil conditions allow, drive two ten foot copper clad steel rods into theground six feet apart. Pour a copper sulfate or a salt solution around to improve
the ground’s conduction. A near zero resistance measurement indicates earth
ground is achieved.

Keep connections to this grounding network as short as possible.

XTC/3 Operating Manual

2.2.2 Connections to Earth Ground
There are two earth connections, both must be present:The ground connection on the controller is a threaded stud with a hex nut. One
suggestion is to connect a ring terminal to the ground strap, thus allowing agood connection to a solid copper bar ground bus, and easy removal andinstallation. Use at least 0.5 in. copper braid strap or 16 AWG copper wire notexceeding 12 in. in length to achieve best immunity against electrical noise.
See Figure 2-3 on page 2-6 for the suggested method of grounding.



XTC/3 is also connected to earth via a sealed three-core power cable, whichmust be plugged into a socket outlet with a protective earth terminal. Extension
cables must always have three conductors including a protective earth
conductor. This ground provides for personal safety but is ineffective forsuppressing electrical noise.

WARNING - Risk Of Electric ShockNever interrupt the protective earthing intentionally. Anyinterruption of the protective earth connection inside oroutside XTC/3, or disconnection of the protective earthterminal is likely to make XTC/3 dangerous.

This symbol indicates where the protective earth groundis connected inside XTC/3. Never unscrew or loosen thisconnection.

CAUTION
An external ground connection is required to ensure
proper operation, especially in electrically noisy
environments.
When used with RF powered sputtering systems, the grounding method may haveto be modified to the specific situation. An informative article on the subject ofGrounding and RFI Prevention was published by H.D. Alcaide, in “Solid State
Technology”, p.117, April, 1982.

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XTC/3 Operating Manual

In many cases, a braided ground strap is sufficient. However, there are cases whena solid copper strap (0.030 in. thick x 1 in. wide) is required because of its
lower RF impedance.
Figure 2-3 System grounding diagram
Back Panel
Transducer
FeedthroughGroundStud

EarthGroundVacuum System

2.2.3 Minimizing Noise Pickup from External Cabling
When a XTC/3 is fully integrated into a deposition system, there are many wire
connections, each a potential path for noise to reach the inside of XTC/3. The
likelihood of these wires causing a problem can be greatly diminished by adheringto the following guidelines:Use shielded coax cable or twisted pairs for all connections.



Minimize cable lengths.



Avoid routing cables near areas that have the potential to generate high levels
of interference. For example, large power supplies such as those used forelectron beam guns or sputtering sources can be a source of large, rapidlychanging electromagnetic fields. Placing cables as little as one foot away fromthese problem areas can significantly reduce noise pickup.

Ensure that a good ground system and straps are in place per therecommendations in section 2.2.2 on page 2-5.

Ensure all XTC/3 covers and option panels are in place and tightly secured withthe provided fasteners.

NOTE: Always use shielded cables when making connections to the XTC/3 rear
panel to minimize electrical noise pickup.

2-6

XTC/3 Operating Manual

2.3 Connecting the Controller
The operation of the XTC/3 depends on the proper connection of power and signal
interfaces to owner equipment and sources.

2.3.1 Verifying the Correct Input Voltage
WARNING - Risk Of Electric Shock
XTC/3 has line voltage present on the primary circuits
whenever it is plugged into a main power source.
Never remove the covers from XTC/3 during
normal operation.
There are no operator serviceable items within XTC/3.
Removal of the top or bottom covers must be done only
by a qualified personnel.
XTC/3 is powered by AC line current. The acceptable voltage input ranges and thefuse rating and type are shown in section 1.4.9 on page 1-10.

2.3.2 Routing Oscillator (XIU) Cables
The signals traveling on this cable are both analog and digital. Do not route thiscable near areas with high levels of electromagnetic interference, even if its lengthmust be somewhat increased.

2.3.3 Interface Cable Fabrication and Pin-Out
It is necessary to fabricate several cables in order to interface the controller to thedeposition system. Refer to section 2.2.3, Minimizing Noise Pickup from External
Cabling, on page 2-6.
2.3.3.1 Source Control Connection
Two BNC connectors, labeled Source 1 and Source 2, provide the analog control
voltage to your source power supply. Standard 50 ohm coaxial cables may be used.

2-7

XTC/3 Operating Manual

2.3.3.2 Input and Output Connections

CAUTION
The relay, relay circuit, and associated pins in the I/O
connector(s) have a maximum voltage rating of
30 V (dc) or 30 V (ac) RMS or 42 V (peak). The maximum
current rating per connector pin or relay contact is
2.5 Amps.
NOTE: I/O functions are fixed in XTC/3S and are identical to the default
assignments in XTC/2.
NOTE: In XTC/3M, the I/O functions are user selectable. The default assignments
are identical to the default assignments in XTC/2.

2-8

XTC/3 Operating Manual

2.3.3.2.1 System I/O Connector
Table 2-1 System I/O connector

Description

Pin #XTC/3S Function

Relay 1

1, 2

Source Shutter 1

Relay 23, 4

Source Shutter 2

Relay 35, 6** Sensor Shutter 1

Relay 47, 8** Sensor Shutter 2

Relay 5

9, 10

Stop

Relay 6

11, 12End of Process

Input 118

Start

Input 219

Stop

Input 320

End deposit

Input 421

* Sample Initiate

Input 522

* Sample Inhibit

Input 623

* Crystal Fail Inhibit

Input 724

* Zero thickness

Input 825

* Soak 2 Hold

Ground13,14,15,16,17

Input Common* These input functions may be reassigned according toTable 2-2.
** Used for Crystal Switching for a XTC/3S.
Table 2-2 Film Select Option selected in XTC/3S General / Process screen

Input #

Pin #Function

Description

4

21

RESET

pin22

pin23

pin24

pin25

Film #

522

Film Select MSB

0

0

0

X

1

6

23

Film Select

0

0

1

0

2

7

24

Film Select

0

0

1

1

3

8

25

Film Select LSB

0

1

0

0

4

0

1

0

1

5

0

1

1

0

6

0

1

1

1

7

1

0

0

0

8

1

0

0

1

9

1

X

1

X

1

X = Does not matter

2-9

XTC/3 Operating Manual

2.3.3.2.2 Aux I/O Connector
Table 2-3 Aux I/O connector

Description

Pin #XTC/3S Function

Relay 71, 2

Thickness Setpoint

Relay 83, 4

Soak 2

Relay 95, 6

Crystal Fail

Relay 107, 8

AlarmsRelay 119, 10

Source 1/Source 2

Relay 12

11, 12

End Deposit (Final Thickness)

TTL Output 1
13 Cruc SRC 1 Bin

18

Crucible Select 1(if active layer is 0 or 1)

TTL Output 2
14 Cruc SRC 1 Bin

19

Crucible Select 2

TTL Output 3
15 Cruc SRC 1 Bin

20

Crucible Select 3

TTL Output 4
16 Cruc SRC 1 Bin

21

Crucible Select 4

TTL Output 5
17 Cruc SRC 1 Bin

22

Crucible Select 5

TTL Output 6
18 Cruc SRC 1 Bin

23

Crucible Select 6

TTL Output 7
19 Cruc SRC 1 Bin

24

Crucible Select 7

TTL Output 8
20 Cruc SRC 1 Bin

25

Crucible Select 8

Input 914

Crucible Valid

Ground13,15,16,17

Common2.3.3.2.3 Inputs
Inputs are activated by pulling the specific input's terminal to ground (<0.8V)
through a contact closure to common (GND) or with TTL/CMOS logic having
current sink capability of 2 mA (1 low power TTL load). These ports are readevery 250 ms; signals must be present during a read cycle.

2 - 10XTC/3 Operating Manual

2.3.4 RS-232C Communications
RS-232C serial communications is standard in XTC/3. RS-232C is used
to remotely control or monitor XTC/3.
Optional Windows® compatible software, INFICON PN 780-032-G1, provides forparameter entry, recipe storage, data logging and monitoring as well as Start, Stopand Reset control.
An industry standard 9-pin D-Sub connector is required for the host computer sideconnection. The permissible length of the cable is governed by publishedstandards.
The controller interface operates as DCE (Data Communication Equipment),
hardware handshaking is not supported.
Pin assignments are for the XTC/3 connector. In most cases, a straight-throughserial cable (not a null modem cable) with a female 9 pin D connector on the PC
end and a male 9 pin D connector at the XTC/3 end will work, however,
only pins 1, 2, 3 and 5 are used.
Table 2-4 RS-232C pin assignments

Signal Name

Pin(s)EIA Name

TX

Transmit Data

2

BA

RX

Receive Data

3

BB

SG

Signal Ground5

AB

Cable Shield

1(Not Used)4, 6, 7, 8

2.3.5 TCP/IP Communications Connection (Optional)
NOTE: This section applies only if the optional TCP/IP interface
has been installed.
The TCP/IP interface option for XTC/3 accepts a standard ethernet TCP/IP
communications connection. If XTC/3 is directly connected from a stand-alone
computer, the ethernet cable should be a crossover cable unless the PC has theability to dynamically reconfigure itself. Static addressing is supported,
DHCP is not supported.
2.3.5.1 Network Connection
If XTC/3 is connected through a network or hub connection, a standard straight
ethernet cable is required.
2.3.5.2 Change the IP Address in XTC/3
See section 4.4.3.1 on page 4-25.
2.3.5.3 PC Setup
See section 5.1.4 on page 5-2.

2 - 11

XTC/3 Operating Manual

Chapter 3
Operation
3.1 Front Panel Controls
Figure 3-1 XTC/3M front panel

1

3

2

4

8

1

7

6

5

System Switches
START, STOP and RESET for process control.

2

LCD Screen
Provides graphical displays, set-up menus, status, and error messages.

3

Data Entry Keys
A keypad array with numerics 0 through 9 with telephone-style assigned letters(XTC/3M only) for parameter entry and keys for HELP, CLEAR▲(up cursor),
MENU and ENTER▼(down cursor). All numeric entries must be followed
by ENTER.
CLEAR is used to erase data entry errors. If an illegal value has been entered,
CLEAR will erase the error message and re-display the last valid data.
MENU is used to navigate through XTC/3 displays.
HELP key brings up context-related text.

4

Cursor Keys
An array of four keys that are used to move the display cursor either up, down,
left or right. The keys auto-repeat; the cursor will continue to move as long as
the key is held down. Depending on the context,▲will function as CLEAR and▼will function as ENTER. The▼and▲keys are also used to increment ordecrement the power level while in Manual operation.

3-1

XTC/3 Operating Manual

5

Power
This switch controls secondary power to XTC/3 between ON and STANDBY.
Power is provided when the button is in its depressed position.

6

Pilot Light
A green LED, adjacent to the power switch, is illuminated when power is on.

7

Remote Control Jack
Receptacle for the optional wired handheld remote controller PN 755-262-G1.

8

Optional Rack Mount Kit (Not Shown)
PN 780-702-G1 for one XTC/3.
PN 780-702-G2 for two XTC/3 mounted side by side.

3.2 Rear Panel Interfaces
Interfaces for XTC/3 are located on the rear panel, see Figure 3-2.
Figure 3-2 XTC/3 rear panel

1

2

3

9
8

7

1

6

5

4

AC Power Inlet and Mains Switch
Provides a common connector for various international plug sets.

2

Source Control DAC Outputs
Provides source control voltage for two sources, (BNC connectors).
Outputs are programmable for various voltage ranges and polarities.

3

Comm Option Connector (Optional TCP/IP)
Provides connections for TCP/IP interface.

4

Sensor Connectors - Channels 1 & 2
Provides connection for the two sensor channels.

3-2

XTC/3 Operating Manual

5

RS-232C Remote Communication Connector
Provides a 9-pin RS-232C communications port.

6

Ground StudSee section 2.2.2, Connections to Earth Ground, on page 2-5.

7

Recorder DAC Output
Provides 0 to 10 V output selectable to correspond to Rate, Rate Deviation, andThickness at various ranges and Power (BNC connector).

8

Aux I/O Connector
Provides pin connection for 6 Relays rated for 30 V (dc) or 30 V (ac) RMS or
42 V (peak) maximum, eight logic outputs, and one logic input.

9

System I/O Connector
Provides pin connection for 6 Relays rated for 30 V (dc) or 30 V (ac) RMS or
42 V (peak) maximum, and 8 logic Inputs.

3-3XTC/3 Operating Manual

3.3 Displays
Seven XTC/3 display screens are used for monitoringand programming processes:
OperateFilm ParameterProcess List (XTC/3M only)

General Parameter

I/O MapDiagnostics

Sensor

To maximize the life of the display, it can be set to dim after a period of 1 to 99
minutes without a key press (see section 4.4.2, Hardware Parameters, on page
4-21, parameter LCD DIMMER TIME).
Pressing a key before the dimmer time elapses resets the dimmer interval
to start over.
The default setting of 0 disables the dimmer function.
When the display is dimmed, its brightness will be:bright if a film is runningdark if a film is not running (as in Ready or Idle)

All keys remain active. To restore the display to full brightness without inadvertently
changing parameters, press either HELP: or ◄ or ►.

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XTC/3 Operating Manual

3.3.1 Menu Display
Pressing MENU while on any other screen will display to the Menu screen. (SeeFigure 3-3.)
The Menu screen allows navigation between all other screens.

1 Using▲or▼, a list of screens can be scrolled through to selectthe desired screen.

2 Press MENU to move the display to the selected screen.
Figure 3-3 Menu Display XTC/3M

If a lock code has been set up from the front panel to prevent unauthorizedparameter entry, the lock code L Lock message will appear on this screen in theupper right corner.
If a lock code has been set up via Remote Communications, the R Lock message
will appear instead.
To enable entering or changing parameters, move the cursor to the lock code
message (located to the right of Sensor), enter the lock code and press ENTER.
The lock code message will disappear.
XTC/3 will be re-locked after entering the Operate screen.

3.3.2 Operate Display
The Operate screen will appear on power-up following the temporary initialization
screen. It contains information pertinent to the currently active film and process.
Information on the Operate screen includes the user-entered name of the process
and film (XTC/3M only), the Rate, Power, Thickness, State, StateTime, Layer Time,
Process Time (XTC/3M only), Source and Sensor in use, Crystal Number,
Percent Life, S and Q values. (See Figure 3-4 and Figure 3-5.)

3-5

XTC/3 Operating Manual

A graphical representation of rate deviation or the power over time will also be
displayed. The graph display can be modified by placing the cursor on the Y-axis
graph label and pressing TOGL to toggle between rate deviation and power. The
rate deviation scale can also be toggled between 5,10, 20 and 40 Å/s when the
cursor is placed on the graph Y-axis value.
System messages and errors are displayed on all screens except I/O Map.
NOTE: On XTC/3M, if there are no Process or Film names — they are replacedby the Process and/or Film number.
Figure 3-4 XTC/3M operate display

6

7
8

5

9

4

10
11
12
13
14
15

3
1, 2

16
17
18

Figure 3-5 XTC/3S operate display

3-6

XTC/3 Operating Manual

Operate Display Description (See Figure 3-4)
1. Layer Currently In Process (Film in XTC/3S)
2. Layer Time
3. Process Time (XTC/3M only)
4. % Power
5. Rate6. Graphical Display of Rate Deviation or Power
7. Layer Thickness
8. Lock Status Area
9. Test Mode Indicator
10. State of Layer
11. State Time
12. Source Number In Use
13. Sensor Number In Use, Crystal in Use (if multi-position sensor)
14. % Crystal Life
15. S and Q Counters (if set to non-zero values)
16. Process Name Being Executed (XTC/3M only)
17. Film Name Being Deposited (Always Film in XTC/3S)
18. Message Area

3-7

XTC/3 Operating Manual

3.3.2.1 Crystal Life and Starting Frequency
On the Operate display, crystal life is shown as a percentage of the nominal 1 MHz
frequency shift, relative to the 5.0 MHz ending frequency allowed by XTC/3. Thisquantity is useful as an indicator of when to change the monitor crystal to safeguard
against crystal failures during deposition. It is normal to change a crystal after a
specific amount of crystal life (% change) is consumed.
It is unusual to use a monitor crystal to 100% of crystal life. Useful crystal life ishighly dependent on the type of material being deposited and the resulting
influence of this material on the quartz monitor crystal. Even for well-behaved
materials, such as copper, the inherent quality, Q, of the monitor crystal degrades
to a point where it is difficult to maintain a sharp resonance and therefore the ability
to measure the monitor crystal's frequency deteriorates before reaching thetheoretical 100% Life point.
When depositing dielectric or optical materials, the life of a gold, alloy or silver
quartz monitor crystal is much shorter — as little as 10% to 20%. This is due tothermal and intrinsic stresses at the quartz-dielectric film interface, which areusually exacerbated by the poor mechanical strength of the film. For thesematerials, the inherent quality, Q, of the quartz has very little to do with the monitor
crystal's failure.
3.3.2.2 Choosing The Right Crystal
Gold crystals are recommnded for most applications. However, silver crystals will
provide superior performance in processes with high heat loads, such as
sputtering. Silver crystals may also improve the deposition of oxides, but try gold
crystals first. Keep in mind that silver tarnishes and cannot be kept in storage forlong periods of time. INFICON silver crystals are shipped in a sealed bag filled withan inert gas to maximize shelf life.
3.3.2.3 Percent Life Auto-Zero
If a new crystal has a starting frequency above 5.92 MHz and is more than
0.04 MHz different from the last valid crystal reading, its % Life will be set to 0. Thisfacilitates using crystals to a uniform known % Life point without wasting usable
crystal life. In all cases, reaching 5.0 MHz results in a crystal life-fail even though% Life may not have reached 100%. For example, a crystal with a starting
frequency of 5.95 MHz will have a % Life reading of 95% when it reaches 5.0 MHz.

3-8

XTC/3 Operating Manual

3.3.3 Film Name Display
Figure 3-6 Film Name display

The Film Name display shows the film parameters and their values. Thirty-two films
may be programmed in XTC/3M; nine in XTC/3S. Pre/Post Deposit, Deposit,
Sensor, Source and Option screens are accessed from the Film Name screen.
If the parameters are locked, the L Lock or R Lock message will be displayed in
the upper right corner. With the parameters locked, the film number may still bechanged to allow viewing of other films.
See section 4.2 on page 4-3 for programming details.

3-9

XTC/3 Operating Manual

3.3.4 Process List Display (XTC/3M only)
The Process screen is present only in XTC/3M.
XTC/3S is a single process, single layer controller.
Figure 3-7 XTC/3M Process display

A process consists of one or more layers, to be run in order. See section 4.3 on
page 4-16 for programming details. 99 Processes may be programmed, each withup to 999 Layers.
On entering the Process screen, the process displayed is the process when theProcess screen was last displayed. A different process can be displayed bymoving to the process number parameter, entering the desired process number
and pressing ENTER.
If the parameters are locked, the L Lock or R Lock message will be displayed in
the upper right corner. The process list will be displayed, but cannot be changed.
However, the process number may still be changed to allow viewing of otherprocesses.
The Select panel contains sets of 10 layers that can be displayedin the parameter panel.

3 - 10XTC/3 Operating Manual

3.3.5 General Parameter Display
Figure 3-8 XTC/3M General parameter display

NOTE: XTC/3S replaces Process to Run with Film To Run.
XTC/3S does not support AutoStart Next Layer.
The General parameter screen is subdivided into Process, Hardware andCommunication Info screens. The L Lock lock code is initially set in
the Process screen.
If the parameters are locked here, the L Lock message will be displayed in theupper right corner. The parameters will be displayed, but cannot be accessed.
See section 4.4 on page 4-18 for programming details.

3 - 11

XTC/3 Operating Manual

3.3.6 I/O Map Display
Figure 3-9 XTC/3M I/O Map display

The I/O Map screen displays the currently selected programmable I/O functions on
XTC/3M or the fixed I/O in XTC/3S. See section 4.5 on page 4-26 for XTC/3M
programming details.

3.3.7 Diagnostics Display
Figure 3-10 Diagnostics display

The Diagnostics display is described under section 6.2, XTC/3 Diagnostics, on
page 6-6. The Diagnostics display: shows firmware version
 shows main board serial number
 shows Crystal Interface Unit (XIU) serial number permits testing the RS 232 interface
 permits testing the active XIU
 allows toggling source and sensor shutters
 allows checking crucible rotation

3 - 12

XTC/3 Operating Manual

3.3.8 Sensor Information Display
Figure 3-11 Typical Sensor Information display

Inactive choices will be gray.
If non-zero values have been programmed for the S and/or Q parameters, theaccumulated counts can be cleared on this screen.
If a multi-position sensor is in use, it can be switched to the next or rotated throughall its positions by positioning the cursor on Switch Crystal or Rotate Headand pressing TOGL.
NOTE: Rotate Head is allowed only in Ready or Idle at the end of a process.
Frequency indicates the current resonance or the last good value prior toa crystal failure.

3 - 13

XTC/3 Operating Manual

3.4 Executing a Process
Once a process has been defined as described in Chapter 4, it is ready to execute.
START, pressed once, will start or continue the process from the point
at which it was stopped.



STOP freezes a process, the status information on the display is maintained
and the control voltage output is set to zero.

RESET, if pressed when XTC/3 is in Stop, takes a process back to
the first layer.

HINT: It may be desirable to execute a new process in TEST (enabled in Process
sub-screen of the General Parameter display, see section 4.4.1 on page4-19) before doing an actual deposition to check correct shutter operation,
sequencing and limits.
The execution of a process is depicted in the following state diagram. (See Figure
3-12 and Figure 3-13.)
Figure 3-12 Symbols used in flow charts

Solid lines indicate the automatic sequence of steps.
Dotted lines indicate steps the user may select.

3 - 14

3 - 15KS)

RET DELAY TIME OUT

N
ENT
ES

ON

YES

CRUCIBLEIN
POSITION?

NO)ON/STBYYES

STBY/PowerFAIL

SHUTTERDELAY

YES

SHUTTER
DELAY
?

NO

SOAK
HOLD 2
INPUT
?

SOAK
TIME
2

RISE
TIME
2

SOAK
TIME
1

RISE TIME
1

SOURCE
SWITCHSAVE
CURRENTPROCESS
DATA

NO

YES

SHUTTER
DELAY
?

YES

NO

CONTROL
DELAY

NO

IDLE
POWER
ZERO
?

YES

MPWR

)

tLOAD FILM
PARAMETERS

SET LAYER
TO START“TO
FAILUREACTIONSTATE”

)

NO

NO

YES

TIME
POWER

FINAL
THICK
?

YES

NO

XTSW

NO

)

TIME
POWER
SELECTED?

INCREMENTLAYER NUMBER
IF NOT READYORSTOP STATE

START
or
AutoStart
Next=YesREADY

Figure 3-13 XTC/3 state diagram

NO

)

SAME
SOURCEAND
CRUCIBLE?

RESETSTANDBY

DESIRED
RATE
=
0.0

YES

NO

YES

GOOD
XTAL
?

SWITCHXTALYESXTAL FAILXTAL FAILXTAL
SWITCH
SELECTED
?

IDLE

NO

YES

THICKNESS

FE
RA

FEE
TIM

ID
RA
TIM

PROCESSCONTINUE
?

NO

ZERO
THICKNESSDEPOSITRATEWATCHERDEPOSIT

FINAL THKTHK LIMITXTAL FAIL?

YES

FINAL THICRATE RAMP THICKN

RATE
RAMP

FINAL THKXTAL FAIL
?

FINAL

DATA
LOG
UPDATEON FINAL THKDECISION

WAS
TIME
POWER
USED
?

XTC/3 Operating ManualXTC/3 Operating Manual

1 Make sure XTC/3 is in READY or IDLE.
2 Press START. The next layer to be run will enter pre-deposition, and continue
on through deposition and post-deposition.

3 When the layer is complete, XTC/3 will go to IDLE. If AutoStart Next Layer(XTC/3M only) has been set to Yes in the Process sub-screen of the General
Parameter display, the next layer, if there is one, will be started automatically.
If not, press START again to begin the next layer. Repeat until the process iscomplete.

4 If at some point there is a need to interrupt or discontinue the process, press
STOP. This will close the sensor and source shutters, set the control voltage
output to zero, and freeze the display. The process can be restarted where it
left off by pressing START. (The pre-deposition phases will be repeated.) To
completely abandon the run, press RESET after STOP.

5 A critical error may occur while a process is running.
For example, a crystal failure on a single crystal sensor head may occur in
pre-deposition. XTC/3 will automatically STOP or go into Time-Power (if thecrystal failure occurs while in Deposit and the Time-Power option is set toYes). Assuming the error has been remedied, the process can be continued
where it left off by pressing START. Pressing RESET will abandon the run.

3 - 16

XTC/3 Operating Manual

3.5 State Descriptions
Table 3-1 State descriptions
STATE

CONDITION

RELAY CONTACTSTATUS
SourceShutter

SensorShutter

NOTE: The following are Pre-Deposit states.
Associated parameters are shown in the CONDITION column surrounded by the [ ] left and rightsquare brackets.

3 - 17READY

XTC/3 will accept a START command.
Rate is displayed and Thickness isaccumulated.

Inactive

Inactive

CRUCIBLE SWITCH

XTC/3 advances to next state when the
Cruc Valid input is low. If IDLE PWR of theprevious layer using this source is notequal to zero, power is set to zero before
the crucible position changes. [Crucible #,Source #]Inactive

Inactive

RISE 1

Source is rising to Soak Power 1 level.
[Rise Time 1]

Inactive

Inactive

SOAK 1

Source is being maintained at Soak Power
1 level. [Soak Time 1, Soak Power 1]

Inactive

Inactive

SOAK HOLD 1 (M only)(Soak 1 state)

Source is being maintained at Soak Powerlevel [Soak Hold 1 input]. Display indicates
SOAK 1.

Inactive

Inactive

RISE 2

Source is rising to Soak Power 2 level.
[Rise Time 2]

Inactive

Inactive

SOAK 2

Source is being maintained at Soak Power
2 level. [Soak Time 2, Soak Power 2]

Inactive

Inactive

SOAK HOLD 2(Soak 2 state)

Source is being maintained at Soak Powerlevel [Soak Hold 2 input]. Display indicates
SOAK 2.

Inactive

Inactive

SHUTTER DEL(AY)

Rate is being controlled. If TRANSFERSENSOR is set to YES, the second sensor
is now in use. Advances to Deposit State
once the Source is in Rate Control within
the greater of 5% or 0.5Å for 5 seconds.
[Delay Option, Shutter Delay ON]

Inactive

ActiveXTC/3 Operating Manual

Table 3-1 State descriptions (continued)
STATE

CONDITION

RELAY CONTACTSTATUS
SourceShutter

SensorShutter

NOTE: The following are Deposit states.
CONTROL DELAY(Deposit state)

Constant Power at Soak Power 2. Begins
rate control when the control delay time
elapses. [Delay Option, Control Delay,
Control Delay Time]

ActiveActiveDEPOSIT

Thickness zeroed upon entry or reset tostored value on Stop/Start without Reset.
Rate control. [Rate, Final Thickness, PID
Control, Process Gain, Primary Time
Constant, System Dead Time]

ActiveActiveRATEWATCHER(SAMPLE)(Deposit state)

Rate control. [RateWatch Accuracy]

ActiveActiveRATEWATCHER(HOLD)(Deposit state)

Constant power, based on last sample’s
average power. [RateWatch Hold Time]

ActiveInactive

RATE RAMP

Rate control, desired rate changing. [NewRate , Start Ramp, Ramp Time ]ActiveActiveMANUAL

Source power controlled by handheld
controller or front panel Up/Down cursor
keys.

ActiveActiveTIME-POWER

Crystal failed; source maintained ataverage control power prior to crystal
failure. [Time Power Yes/No]

ActiveActiveNOTE: The following are Post-Deposit states.
IDLE RAMP

Source changing to Idle Power. [Idle Ramp
Time, Idle Power]

Inactive

Inactive

IDLE (=0% Power)

Source maintained at zero power; will
accept a START command.

Inactive

Inactive

IDLE (>0% Power)

Source resting at Idle Power; will accept a
START command. Rise 1 and Soak 1 will
be skipped.

Inactive

Inactive

STOP
Note: Stop is not a
separate state but asuspension of the current
state.

Source output set to zero power. The
display is frozen at the last rate andthickness values.
Ref: Recovering from STOP, see section
3.5.1.3

Inactive

Inactive3 - 18

XTC/3 Operating Manual

Table 3-2 Output states
OutputActiveInactive

Source Shut 1

In any deposit state

When leaving control states

In shutter delay or any deposit
state.
In RateWatcher Sample

Closes when leaving control states.
In RateWatcher Hold

Source Shut 2
1

Sensor Shut 1

1

Sensor Shut 2

Note 1: In XTC/3S, Sensor Shut 1 and Sensor Shut 2 outputs are used to perform the crystal
switch function if a multi-position sensor has been selected.

3 - 19Stop

Enter Stop

Exit Stop

End of Process

When entering Idle if this is lastfilm in the process

When Start or Reset is done

Thick SetpointIn Deposit or Time Power state,
and thickness setpoint is reached

When Start or Reset is done
When Idle is entered

Xtal Fail

When active crystal fails

When active crystal becomes valid.
Digital Set Crystal Fail Inhibit

AlarmsOn Rate Deviation error
On Shutter Delay error
When Max power reached
On Crucible Switch error

As each error is cleared and no othererror is set.
When Start or Reset is done
When Idle ramp is enteredSource in use

When Source 2 is active

When Source 1 is active

Final Thick

Final thickness is reached

When Start or Reset done

End of Film (M only)

Initiate Idle state

When Start or Reset done

In Layer (M only)

When layer is started

Enter Idle or Stop

Ion Assist Dep(M only)Enter any deposit state and Ion
Assist Deposit is enabledEnter Idle ramp
Enter Stop

Xtal Switch 1(M only)

See crystal switching
section 3.6.8

See crystal switching section 3.6.8

Xtal Switch 2(M only)

See crystal switching
section 3.6.8

See crystal switching section 3.6.8

XTC/3 Operating Manual

Table 3-2 Output states (continued)
OutputActiveInactive

When each State starts, the oldand new state output are set or
cleared as necessary

When each State starts, the old andnew state output are set or cleared
as necessary

Max Power (M only)

When power reaches max power

When power is not at max power

Rate Dev Fail(M only)

When the rate deviation is greaterthan 5% or 0.5Å of the desired
rate for 60 seconds or 20 times
the time constant if the time
constant is greater than 3
seconds

When rate deviation is within test
limits.
When Idle Ramp is entered

Xtal Sw Fail(M only)

When an attempted crystal switch
fails

When another crystal switch isstarted

Xtal Switching(M only)

Whenever a crystal switch isactiveWhen the crystal switch is done

Crucib Sw Fail(M only)

No crucible valid input within 30
seconds of a crucible switch

When Start or Reset is done.
If Stop on Alarms is set to No, XTC/3
will give the error message but will
not do anything else, it stays in
Crucible Switch. If the Crucible Valid
input becomes set, the output isclearedReady (M only)
Crucib Switch(M only
Rise 1 (M only)
Soak 1 (M only)
Rise 2 (M only)
Soak 2
Shutter Delay(M only)
Deposit (M only)Rate Ramp (M only)
Manual (M only)
Time Power (M only)
Idle Ramp (M only)
Idle (M only)

3 - 20XTC/3 Operating Manual

Table 3-2 Output states (continued)
OutputActiveInactive

Shutter Delay Fail(M only)

Shutter delay is enabled and therate deviation is greater than 5%
or 0.5 Å of the desired rate for 60
seconds

When Start or Reset is done
If Stop on alarms is set to No, the unit
will give the error but will not doanything else. It stays in Shutter
Delay and controls power to acquire
correct rate. If rate comes into
specified range, then the output iscleared.
When Idle Ramp is entered

Computer Contl(M only)

Set in remote commands

Cleared through remote commands

Cruc Src 1 Bin
Cruc Src 1 BCD(M only)
Cruc Src 2 Bin
Cruc Src 2 BCD(M only)

When a Start is done
Output set and cleared to selectcrucibles as binary (1 of 8) or
BCD

When a Start is done
Output set and cleared to selectcrucibles as binary (1 of 8) or BCD

Table 3-3 Inputs

3 - 21

Input Function

Description

Start

Detection of a falling edge effects a START if a layer is not alreadyrunning.

Stop

Detection of a falling edge effects a STOP.

End Deposit

Detection of a falling edge terminates the Deposit state just as if the
Final Thickness were achieved.

RW Sample Init

Detection of a falling edge initiates a RateWatcher sample if the film is
programmed for this feature.

RW Sample Inhib

Application of a ground reference voltage maintains the RateWatcher
in the Hold condition.

XtalFail Inhibit

Application of a ground reference voltage prohibits the closure of the
Crystal Fail Relay and the associated Stop.

Zero Thick

Detection of a falling edge duplicates the front panel ZERO.

Soak 2 Hold

Application of a ground reference voltage extends the SOAK 2 state
until the signal/closure is removed.

Cruc 1 Valid(in XTC/3S, also
used for Source 2)

Application of a ground reference voltage from the crucible rotation
mechanism is used to signal that the proper crucible for Source 1 (or2 in XTC/3S) has indexed into position and state sequencing may
proceed.

XTC/3 Operating Manual

Table 3-3 Inputs (continued)
Input Function

Description

Cruc 2 Valid(M only)

Application of a ground reference voltage from the crucible rotation
mechanism is used to signal that the proper crucible for Source 2 has
indexed into position and state sequencing may proceed.

Reset (M, S if Film
Select option used)

Detection of a falling edge effects a RESET if in Stop.

Sel Process (4)(M only)

The state of the two associated inputs determines the process, 1 to 4, tobe selected when a START is processed while the unit is in Ready or Idleof the last layer. 00 for 1, 01 for 2, 10 for 3 and 11 for 4.

Sel Process (16)
(M only)

As above, except four inputs are used to select process 1 to 16.

Sel Process (64)
(M only)

As above, except six inputs are used to select process 1 to 64.

Sel Process (99)
(M only)

As above, except seven inputs are used to select process 1 to 99.

Switch Crystal(M only)

Detection of a falling edge duplicates the front panel XTSW.

Non-Dep Hold
(M only)

This feature “holds” the state timer during any non-deposit state.
Non-deposit states include the pre-deposit states: Ready, Crucible
Switch, Rise 1, Soak 1, Rise 2, Soak 2; and the post-deposit states: Idle
Ramp and Idle. For the feature to be activated, the state’s time must be
non zero. The message NON-DEP HOLD is displayed. If XTC/3 is in the
READY or IDLE state and a START command is executed while
NON-DEP HOLD is active, XTC/3 will progress to the first pre-deposit
state with a non zero state time. If XTC/3 is in the Crucible Switch state,
waiting for the Cruc Valid input, and NON-DEP HOLD is activated when
the Cruc Valid input is activated, XTC/3 will progress to the next
pre-deposit state having a non zero state time. XTC/3 is prevented fromcontinuing state processing until the action is deactivated.

Zero Film Time(M only)

Detection of a falling edge will zero the Layer Deposit time for the Layerbeing deposited.

Start Inhibit (M only)

Prevents starting a layer as long as the input remains active.

Soak 1 Hold
(M only)

Application of a ground reference voltage extends the SOAK 1 state
until the signal/closure is removed.

Film Select (S only)

See section 4.4.2.1 on page 4-23

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XTC/3 Operating Manual

3.5.1 Alarms and Stops
There are a number of unusual XTC/3 situations that may require operator
attention. These situations are detected and then treated as ALARMS or STOPS.
Both ALARMs and STOPs can be indicated by a separate relay closure (by default
or selected assignment in XTC/3M, by fixed assignment in XTC/3S).
An ALARM condition is not fatal, XTC/3 will continue the layer or process
to normal termination.
A STOP is fatal, immediately halting the process. If desired, the user may set the
STOP ON ALARM parameter in the Process sub-screen of the General
Parameter display to configure XTC/3 to treat an ALARM the same as STOP
(i.e., halt processing upon detection of the abnormal condition).
3.5.1.1 Alarms
The following conditions are considered ALARMs by XTC/3 and result in theclosure of the ALARM relay (if assigned):Crucible hearth selection is not validated by the CRUC VALID input
within thirty seconds.

Rate control not established during the first sixty seconds of SHUTTER DELAY(or twenty times the TIME CONSTANT if greater).



Rate has been out of control in DEPOSIT for sixty seconds (or twenty times the
TIME CONSTANT if greater). Out of control is defined as a rate error >0.5 Å/sand >5% of setpoint deposit rate.

The source power has exceeded the Maximum Power parameter, set in the
Source sub-screen of the Film Parameter display, for five continuous seconds.

3.5.1.2 Stops
The following actions or conditions produce a STOP state. This condition isindicated by the STOP message on XTC/3 and the closure of the STOP relay(if assigned):3 - 23

An intentional or accidental interruption of power, indicated by
the Power Loss message.



A Switcher Fail message appears as the result of a failure to detect a valid
position in a multi-position sensor.

Pressing the front panel STOP key on XTC/3 or handheld controller.



Initiating a STOP via remote communication.



Activating the STOP external input.



A CRYSTAL FAIL detected during any pre-deposit phase (when crystal
switching is not available).

XTC/3 Operating Manual

A CRYSTAL FAIL detected during the DEPOSIT state if the Time Powerparameter (Option sub-screen of the Film Parameter display ) is set to No(when crystal switching is not available).



Following the POST-DEPOSIT states of a layer when the DEPOSIT statecompletes in TIME POWER.

Any of the ALARM conditions listed in section 3.5.1.1 above if the Stop on
Alarms or Stop on Max Power configuration is activated (Process sub-screenof General Parameter display).

3.5.1.3 Recovering from STOP
An interrupted process can be completed (recovered) from a STOP withoutmanually reprogramming any film or process parameters. Recovery from a STOP
(generated by an operator or any machine induced condition) requires only that the
START command be given. If the STOP was generated by a machine induced
condition such as a crystal fail, that condition must be corrected before the START
command will be accepted. The film in process at the time of the STOP will again
be executed from the beginning, but the displayed thickness will not be zeroed
upon reentry of the DEPOSIT state. Instead, the thickness accumulated at the timeof the generation of the STOP is used. Thickness will accumulate in the normal
fashion from that point. All processing occurs in the normal fashion from reentry of
the DEPOSIT state, forward.
If it is not possible to recover as described above, the process may be reset to thebeginning of layer one by issuing a RESET command prior to a START command.
The RESET command may be given by pressing RESET, through the I/O or
through the remote communications.

3.6 Special Features
3.6.1 Automating a Process
A process can be automated so that a complete process can be executed without
having to press START between all the layers. A process can be automated by anyof the following three methods:
Autostart Next Layer (XTC/3M only): In the Process sub-screen of theGeneral Parameter display, set this option to Yes by pressing TOGL.

Remote communication control: An external computer could be set up tomonitor the status of a process and issue START commands at desired times.
(See Chapter 5, Remote Communications.)Remote input line. A remote input line can be activated to generate a START
command. (See section 4.5.1 on page 4-27.)

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XTC/3 Operating Manual

3.6.2 Ion Assisted Deposition
This feature will activate the designated output if the film currently running is in
Deposit and the Ion Assist Deposit parameter in the Option sub-screen of
the Film Parameter display is set to Yes.

3.6.3 Control Delay
When the source shutter opens at the start of deposition, there often is a significant
rate spike due to the sudden heat load arriving at the crystal. Typically, over amatter of seconds, the crystal equilibrates and becomes stable again. The Control
Delay feature suspends action of the control loop on the source control power fora programmable time interval to prevent the control loop from responding to this
temporary rate spike.

3.6.4 Shutter Delay
This feature ensures that no material is deposited on the substrate until the ratemeets certain requirements. The source shutter relay remains in its normal state
and the sensor shutter relay is active. The sensor, which must be positioned tosample the source flux with the source shutter closed, provides closed loop rate
control. Rate control must be maintained at ± 5% Å/sec or ± 0.5 Å/sec, whicheveris greater, of the desired deposition rate for five seconds before XTC/3 will enter
the DEPOSIT state, opening the source shutter and thus exposing the substrate toa well controlled rate of evaporant flux. If the required rate control accuracy cannot
be achieved within sixty seconds, the Delay Failure alarm message will appear. If
Stop on Alarms has been set to Yes, the layer will STOP at the same time.

3.6.5 Rate Ramp Trigger of Final Thickness
To implement this type of film termination, program the New Rate value of the rate
ramp to 0.1 Å/sec. When the rate ramp is complete, the film program will proceed
as if a Final Thickness limit had been reached.
While a Rate Ramp is being processed, the Rate parameter's internal value iscontinuously updated to match the slope of the Rate Ramp.
NOTE: If the Time-Power state is entered, a rate ramp will not be executed; thefilm will complete at the programmed Final Thickness.

3.6.6 Transfer Sensor
This function provides for the use of a secondary sensor, specified as the Transfer
Sensor, to establish rate control in Shutter Delay prior to entering Deposit, thentransferring back to the film’s sensor upon entering Deposit. The function is
selected in the Option sub-screen of the Film Parameter display. Delay option
must be set to Shutter Delay or Both for the Transfer Sensor function to be

3 - 25

XTC/3 Operating Manual

accessible. If rate control is not achieved (see page 4-14) the Delay Failure Alarm
message appears. If Stop on Alarms is in the default setting of No, the power
continues to increment until Max Power is reached.

3.6.7 Crucible Switching
Crucible position output lines can be used to control evaporation sources with up
to eight crucible positions. When the Crucible parameter for a source is set to be
non-zero, power will not be applied to the source until the Cruc x Valid input
becomes active. A Crucible Sw message will be displayed during that time. After
thirty seconds without the Cruc Valid input becoming true (low), a Crucible Sw
Fail message will be displayed.
3.6.7.1 Bin Mode
In Bin mode, eight individual sequential outputs, labeled Cruc Src 1 Bin for
Source 1 crucibles or Cruc Src 2 Bin (XTC/3M only) for Source 2 crucibles, one
per position, are used. See Table 2-3 on page 2-10 for the fixed XTC/3S TTL output
assignments. These assignments will apply to the currently active source, 1 or 2.
In XTC/3M, either 8 sequential relay outputs or 8 sequential TTL outputs can be
assigned (see section 4.5.3 on page 4-29).
3.6.7.2 BCD Mode (XTC/3M only)
In BCD mode, three sequential outputs are used so that 000 represents position
1 and 111 represents position 8. The BCD outputs, labeled Cruc Src 1 BCD for
Source 1 crucibles and Cruc Src 2 BCD for Source 2 crucibles, can be configured
through the Relay or TTL Outputs sub-screen of the I/O Map screen. (See section
4.5.3 on page 4-29.)

3.6.8 Crystal Switching
XTC/3 offers a choice of Single, CrystalTwo, CrystalSix, Crystal12, Rotary or Dual
Head sensors. The CrystalTwo, CrystalSix, Crystal12, Rotary and Dual Headsensors provide one or more backup crystals in case a crystal fails during
deposition. Sensor types are specified on the Hardware sub-screen of the General
Parameter display (see page 4-21).
The CrystalTwo option requires the PN 750-212-G2 Dual Sensor with a
PN 779-220-G1 or PN 779-220-G2 XTAL 2 Switch.
The Dual Head option requires the PN 750-212-G2 Dual Sensor with a second XIU
in place of the PN 779-220-Gx XTAL 2 Switch. The normally uncovered crystal isconnected to Sensor 1, the backup crystal normally covered by the shutter isconnected to Sensor 2.
All multi-position and shuttered sensors require the Solenoid Valve(PN 750-420-G1) and a feedthrough with an air tube.

3 - 26

XTC/3 Operating Manual

A crystal (sensor in the case of Dual Head) switch will automatically occur when:

XTC/3 is configured for a CrystalTwo or Dual Head sensor type, a film is
STARTed or running and there is another good crystal available when theactive crystal fails.



XTC/3 is configured for a CrystalSix or Crystal12, a film is STARTed or
running, and there is at least one good crystal left in the carousel when theactive crystal fails.



XTC/3 is configured for a Rotary sensor, the film is STARTed or running, andthere is at least one remaining good position in the Rotary sensor when theactive crystal fails.

During a crystal switch while in Deposit, the thickness will be accumulated at the
setpoint rate. Power will be held constant at the average deposition power during
the prior 6.25 seconds, not counting the last two seconds.
A crystal switch will not automatically occur:

During a state of STOP, READY, or IDLE.



During deposition, if the secondary crystal of a Dual Sensor fails, or the last
good crystal of a Rotary, CrystalSix, or Crystal12 fails, a TIME-POWER or
STOP will occur, depending on whether TIME-POWER option Yes or No
is chosen.)A crystal switch can be manually executed via the front panel XTSW key, handheld
controller or remote communications when the system is configured for
CrystalTwo, CrystalSix, Crystal12, Rotary or Dual Head sensors.
NOTE: The crystal fail message appears when no more good crystals remain.
3.6.8.1 CrystalTwo
In the case of the CrystalTwo (PN 750-212-G2 Dual Sensor with PN 779-220-G1
or PN 779-220-G2 XTAL 2 Switch), the CrystalSwitch output must be wired so thatit simultaneously energizes the:

Solenoid Valve (PN 750-420-G1) which applies the air pressure to actuate thedual sensor shutter mechanism.

RF relay in the XTAL 2 Switch, exposing crystal #2 while covering crystal #1
and rerouting the RF signal.

This allows the dual sensor to be operated with only one oscillator kit and requires
only one sensor connection at the controller. Power-up initialization is performed
on a dual sensor to verify that the back-up crystal is good. If a crystal fail occurs
while in Deposit, the XTC/3 will switch to the backup crystal and continue. If
START is attempted following completion of the layer and the next layer uses thesame sensor, START will not be accepted (unless Start Without Backup is set toYes), and the message No Backup Crystal appears.

3 - 27

XTC/3 Operating Manual

The Crystal Fail state can be cleared by pressing TOGL in the Sensors screenwith the cursor on Clear Failed Crystals or by powering down and up again. In
both cases, XTC/3 will run the next layer using the last crystal position it switched
to. Crystal Fail can also be cleared by executing a crystal switch from the front
panel with the XTSW key, by pressing TOGL in the Sensors screen with the cursor
on Switch Crystal or via communications commands R14 (Crystal Switch) or R26(Clear All Crystals). A good crystal must be available to switch to in the case ofusing the crystal switch method.
3.6.8.2 CrystalSix
On power-up, all crystals are read to determine how many good and bad crystals
are present. XTC/3 uniquely identifies and tracks all six positions in the CrystalSix.
During deposition, XTC/3 will automatically switch to the next position with a good
crystal when there is a crystal failure. When the last good crystal fails, XTC/3 will
go directly to Time Power or STOP, as appropriate.
When the sensor selected is a CrystalSix, the relay contacts are pulsed closed forone second, opened for one second, closed for one second, then opened for eachposition. The first one second closure will advance the CrystalSix carousel into anintermediate position between two crystals. Opening the closure for one second
allows the ratchet mechanism to relax whereupon the second contact closure
advances the next crystal into the proper position.
3.6.8.3 Crystal12
When first turn on, XTC/3 will rotate the sensor until position one is detected. Then
XTC/3 will continue to rotate through the other eleven positions to determine thestate of all crystals. At the conclusion of the sequence, the Sensor screen shows
the sensor in position one and the position number of any failed crystals.
XTC/3 verifies that the resistance value is correct at each position. If the value is
not as expected, XTC/3 pulses again and rechecks the position. If position one is
not detected, or after twelve pulses of the wrong value, XTC/3 reports a Crystal
Sw Fail message. In that case, all crystals are also marked as failed.
When the carousel is removed from the sensor for crystal replacements, XTC/3
displays Carousel Open. This message also appears if there is no connection
between the XIU (oscillator) and the sensor.
After the carousel is replaced, XTC/3 assumes the current position is twelve andall crystals are failed. A Crystal Switch or Rotate Head function must be initiatedin the Sensor screen or via Remote Communication to enable XTC/3 to catalog
the state of all crystals and to return to position one. This must also be done after
the sensor type has been changed to Crystal12. The Rotate Head function ispermitted only in Ready or Idle at the end of a process.

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XTC/3 Operating Manual

During deposition, XTC/3 will automatically switch to the next position with a good
crystal when there is a crystal failure. When the last good crystal fails, XTC/3 will
go directly to Time Power or STOP, as appropriate.
When configured for a Crystal12 sensor, the relay contacts are only pulsed closed
for one second then opened again once for each position. There is nointermediate position.
3.6.8.4 Rotary Sensor Crystal Switching
Selecting Rotary sensor type enables sequential crystal switching only for six
positions. Upon a crystal switch, the Crystal Switch Output will close for one second
and then open (i.e., one pulse to move one position); there is no intermediate
position. XTC/3 will not keep track of which position the Rotary Sensor is on nor will
it keep track of which crystals are good and which are failed. All crystals are
assumed to be good following a START command. After the one-second pulse,
XTC/3 will attempt to find the resonant frequency for the crystal in this position.
If XTC/3 is in Deposit and does not find a good resonant frequency for this crystal,
it will again pulse the Crystal Switch Output for one second and attempt to find aresonant frequency at this new position.
There will be a maximum of five attempts to find a good resonant frequency (i.e.,a maximum of five pulses of the crystal switch output). If a good resonant frequency
is not found after five attempts, XTC/3 will then enter the Time Power, Idle-Ramp
or STOP state depending on whether Time Power in the Option sub-screenof the Film Parameter display is set to Yes or No.
3.6.8.5 Dual Head
Only Sensor 1 may be configured as a Dual Head, (PN 750-212-G2 Dual Sensor
with second XIU). Sensor Shut 1 output must be wired so that it energizes the
Solenoid Valve which applies the air pressure to actuate the dual sensor shutter
mechanism, exposing crystal #2 (Sensor 2) while covering crystal #1 (Sensor 1).
Power-up initialization is performed to verify that the back-up crystal is good. If acrystal fail occurs while in Deposit, the XTC/3 will switch to the backup crystal andcontinue. There will not be an automatic crystal switch on failure from the backup
crystal #2 back to crystal #1 even if crystal #1 was not failed.
If START is attempted following completion of the layer and the next layer uses thesame sensor, the START will not be accepted (unless Start Without Backup is set
to Yes), and the message No Backup Crystal appears. The Crystal Fail state canbe cleared by pressing the TOGL key in the Sensors screen with the cursor on
Switch Crystal, by pressing the XTSW key from the Operate screen, via
communications command R14 (Crystal Switch) or by powering down and up
again and executing RESET or START. A good crystal must be available to switch
to in all cases. RateWatcher is not available with the Dual Head configuration but
the Transfer Sensor function is allowed.

3 - 29XTC/3 Operating Manual

3.6.8.6 XTC/3S Sensor Shutter / CrystalSwitch Output
Due to limitations imposed by the fixed I/O functions in XTC/3S, the function of theSensor Shutter outputs depends on the Sensor Type setting in the Hardware
sub-screen of the General Parameter display.
If a single head sensor type is chosen, the Sensor Shutter relay contacts are set to
be inactive. The Sensor Shutter relay contacts become active (opening the shutter)when entering the Deposit state, Shutter Delay or Control Delay, or during the
Sample period of the RateWatcher function.
If a multi-position sensor type is chosen, the Sensor Shutter relay now functions as
a CrystalSwitch relay. The Sensor Shutter relay contacts are active upon initiatinga CrystalSwitch. Due to the change in function of the relay output from that of
Sensor Shutter to one of CrystalSwitch, RateWatcher is disabled when XTC/3S isconfigured for a multi-position sensor.
In XTC/3M, there are separate sensor shutter and crystal switch options so
RateWatcher and multi-position sensors may coexist.

3.6.9 Start Layer Without Backup Crystal Configuration
The following applies only when a film specifies a multi-position sensor like a
CrystalTwo (PN 750-212-G2 Dual Sensor with PN 779-220-G1 or PN 779-220-G2
XTAL 2 Switch), CrystalSix, Crystal12, Rotary Sensor or Dual Head.
If Start Without Backup is set to the default mode No, a layer cannot be started
unless there are at least two known good crystals present in the multi-position
sensor. One of these will be the current crystal in use, the other will be a known
good backup crystal.
If Start Without Backup is set to Yes, a layer with a multi-position sensor can bestarted even if there is only one good crystal.
Additionally, if Start Without Backup is set to Yes and XTC/3 switches to the
backup crystal during the process, it will continue using the backup crystal until theprocess is RESET, even if the primary crystal is replaced. This may becircumvented by manually crystal switching to the primary crystal once the failed
crystal is replaced.

3 - 30XTC/3 Operating Manual

3.6.10 RateWatcher
It is easy to automatically sample the deposition rate periodically and thenmaintain the proper source power level necessary to keep the rate at the set point
for extended periods of time. With inherently stable deposition sources such as theplanar magnetron, an occasional check of the rate (with the associated automatic
recomputation of the necessary power level) is all that is needed.
This sample and hold type of control can supersede the fully active type ofrate control that normally limits utility of the crystal monitor for in-line orload-locked systems.
The RateWatcher feature requires entry of two parameters in the Deposit
sub-screen of the Film Parameter display. First, the process engineer must decideon the RW Accuracy percent (see RW ACCURACY 1 to 99% on page 4-8). Thisparameter sets the accuracy that must be maintained for at least five seconds inorder to leave the Sample state.
NOTE: The minimum accuracy range settings are internally limited to a 0.5 Å/sdifference between the setpoint and the just sampled rate. This avoids
unnecessary power changes.
Second, the RW Hold time must be programmed (see RW HOLD 00:00 to 99:59
min:s on page 4-8). This is the length of time between the completion of the last
sample period (or the achievement of rate control) and the initiation of the next
sample period. The process engineer may set the interval up to a maximum of
99:59 mm:ss for automatic operation. If longer intervals or periodic samples areneeded, RW Sampl Init and RW Sampl Inhib inputs are available on the SYSTEM
I/O connector. During the RateWatch Hold period, thickness is accumulated at the
setpoint Rate and power is held at the internally computed Time-Power value.
At the end of the RateWatch Hold period, RateWatch Delay will be displayed forfive seconds before the RateWatch Sample message appears. During the
RateWatch Sample period, the power will be adjusted according to
the control loop parameters.
Entering a HOLD TIME of 00:00 disables the RateWatcher feature.
NOTE: In XTC/3S, the RateWatcher function is disabled if the sensor type isconfigured for a multi-position sensor head. Also, RateWatcher cannot be
used with the Dual Head configuration.

3.6.11 Hand-held Controller (Option)
A Hand-held Controller is provided as an option. The controller serves as a wired
remote to manually control power, switch crystals and produce a STOP. The
handheld controller is connected to XTC/3 with a coiled cord and attaches with amodular plug to the front panel of XTC/3. The POWER/STOP switch located at the
top of the controller is asymmetrical to increase awareness of the direction of
power increment and decrement.

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XTC/3 Operating Manual

When XTC/3 is placed in the Manual Power mode by pressing the MPWR key,
power is affected by moving the POWER/STOP switch laterally. A STOP is
produced by pressing POWER/STOP.
A crystal switch is activated by pressing the red button on the body of the XTC/3.
This action alternates the active crystal of a dual head configuration or advances
the multi-position sensor to the next available crystal.
NOTE: Upon leaving the MANUAL POWER state, XTC/3 enters the DEPOSIT
state. The deposition will terminate if the Final Thickness parameter value
has been exceeded.
The Hand-held Controller includes a convenience hook for the controller that canbe attached to XTC/3 or other accessible location.

3.6.12 Lock CodeIf a Lock Code has been entered in the Process sub-screen of the General
Parameter screen, the L Lock message will be displayed. If XTC/3 has been
locked via Remote Communications, the R Lock message will be displayed.
Parameters may be viewed but not changed from the front panel, unless thelock code is reentered on the Menu screen while the cursor is positioned at
the LOCK Code selection.
A lost lock code may be cleared by pressing the CLEAR key immediately on
power-up and holding it briefly. User programmed parameters will be retained.
NOTE: If no lock code is present, all parameters will be cleared.

3.6.13 Parameter Clear
If no Lock Code is present, all user-programmed parameters are cleared, except
for the IP Address, setting them to their default values, by pressing the CLEAR key
on power up. Repeat the process if a Lock Code was present.

3.6.14 Datalog
If the communication type is set to Datalog, the RS-232 port will become a "sendonly" port (i.e., will not accept commands from a remote computer). When a layer
leaves deposit (either at the end of deposit or following a Stop), a stream of data
will be output. The data is a series of ASCII strings, each separated by a carriage
return and a line feed, in the order below:

1 Layer x
2 Film x (x = film number or the name if the name (XTC/3M only) is programmed)
3 Rate = xxx.x Å/s (0.0 - 999.9)
4 Thickness x Å (x = 0 - 999999 Angstroms)
5 Deposit Time = xx:xx Min:S
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XTC/3 Operating Manual

6 Average Power = xx.x %7 S Value = 0 to 9999
8 Q Value = 0 to 99
9 Begin Frequency = xxxxxxxx.x Hz
10 End Frequency = xxxxxxxx.x Hz
11 Xtal Life = xx % (0 - 99)
12 Normal Completion or
13 End On Time Power or
14 End In Stop from (Stop Reason). Stop Reasons are one of the following:

Keyboard



Xtal Fail

Max Power

Hand ControllerCommunications



Digital Input

Power Loss

Rate Dev Fail

Crystal Switch Fail

NOTE: If the layer is the first one of a process, a preface Begin Process xxx(xxx is the process number or name (XTC/3M only), if the name isprogrammed.) is output. If the layer is the last one of the process, apostscript End Process is output. The data log information is available via
the remote communications S19 command. See Remote Communication
status commands, section 5.2.2.5 on page 5-28 or section 5.3.5.5 on page
5-42.

3.6.15 TCP/IP
The optional TCP/IP interface will provide all the commands available through thestandard RS232 interface. The interface uses a static address entered via XTC/3
front panel (see section 4.4.3.1 on page 4-25).
DHCP is not supported.

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XTC/3 Operating Manual

Chapter 4
XTC/3 Programming
4.1 Overview
The following basic procedure is used to program XTC/3. If a lock code has been
programmed, it must be entered after cursoring to the Lock Code on the Menu
screen. (All steps do not necessarily have to be followed in the given order.)1 Make sure XTC/3 is in READY.
Some configuration and process parameters can be changed only while XTC/3
is in READY. Parameters such as tooling, rate, final thickness, control loop
settings and many others can be changed even while a layer is being executed.
For initial configuration, if the Operate display does not show READY,
press STOP then RESET.

2 Define Film(s)Defining a film consists of entering parameters in five sub-screens:Pre/Post (Deposit)



Deposit

Sensor

Source

OptionThese parameters establish source preconditioning and cool-down,
deposition rate, final thickness, control loop characteristics and other details
such as density, Z-Ratio, and tooling. Also, a specific sensor and source areassociated with each film. In XTC/3M, all films can be given names.

3 Define Process(es) (XTC/3M only)
Only one Process can be active at any time. All processes can be given a
specific name. A process is an ordered set of Films. Films are entered in thedesired layer order on the PROCESS display. A Film becomes a layer when it
is entered in the Process. Only one layer can be active at any time.
In XTC/3M, all processes can be given names.

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XTC/3 Operating Manual

4 Configure General Parameters
From the General Parameter display, three sub-screens can be accessed:
Process; Hardware; and Comm Info. The Process screen provides for anumber of selections including which process (XTC/3M) or film (XTC/3S) torun. The Hardware screen allows selecting the sensor type, source control
voltage range and polarity, chart recorder mode, audio feedback and LCD
dimmer time. In the Comm Info screen, RS232 baud rate and protocol are
selected as well as IP Address and Net Mask for the optional TCP/IP interface.

4a Configure the Sensor(s)Configuring the sensor type involves designating whether the sensor is aSingle, CrystalTwo, CrystalSix, Crystal12, Rotary or Dual Head. These
parameters are on the Hardware page of the General Parameter display.

4b Configure the Source(s)Configuring the sources involves selecting the digital-to-analog voltage
converter (DAC) output voltage range and polarity on the Hardware page of theGeneral Parameter display. If a source has more than one crucible, this is
set up in the Source screen of the Film Parameter display.

4c Configure Communications
If required, select the appropriate RS232 baud rate and protocol and optional
Ethernet interface IP Address and Net Mask in the Comm Info sub-screenof the General Parameter display.

5 Configure I/O
In XTC/3S the I/O is fixed. In XTC/3M, inputs and outputs are programmable.

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XTC/3 Operating Manual

4.2 Film Set Up Overview
4.2.1 Film Set Up
The film screen appears after pressing the MENU key, then cursoring down
to Film Parameter and pressing Menu.
Figure 4-1 Main Menu screen XTC/3M

Figure 4-2 Pre/Post Film Programming Screen

From the Film Parameter display, Pre/Post, Deposit, Sensor, Source andOption screens can be entered by cursoring to the respective label. The ◄► keys
move between the selection (left) panel and the parameter (right) panel. The ▲▼keys are used to move from selection to selection or parameter to parameter. The
value of most of the film parameters can be updated using the numeric keypad and
ENTER key. In a few cases, e.g., Transfer Sensor, the TOGL key is used to toggle
between a list of choices.

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XTC/3 Operating Manual

4.2.2 Film Definition
A film is defined by the parameters needed to run it, including sensor and source
numbers, source heat-up and cool down parameters, deposition rate and final
thickness, material parameters, control loop parameters, etc. XTC/3M can define
32 films which can be named. All films will start with defaulted values for theparameters. These can be modified in any order. A film becomes a layer in aprocess when its film number is selected in the process.
XTC/3S does not have processes or layers. Nine films, 1 to 9, may be defined but
not named, and a General parameter will indicate which film to run.
On entering the film screen, the film displayed will be the one displayed when thisscreen was last left. A different film can be displayed by moving to the Film
Number and entering that film number.
If the parameters are locked from the keyboard, the L Lock message will be
displayed in the upper right corner. If they are locked via Remote Communications,
the R Lock message will be displayed. The parameter values will be displayed only
and cannot be changed until the lock code is entered. With the parameters locked,
the film number may still be changed to allow viewing of other films.

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XTC/3 Operating Manual

4.2.3 Film Definition Parameters
The Film parameters are entered in the Pre/Post, Deposit, Sensor, Source andOption screens.

4.2.3.1 Pre/Post Deposition Parameters
RISE TIME 1. . . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:s
This parameter provides the time period over which the source poweris ramped from 0 to SOAK POWER 1. The default value is 00:00.
SOAK POWER 1 . . . . . . . . . . . . . . . 0.0 to 100%
This parameter is usually set to the power level at which the source material
just begins to melt. XTC/3 ramps the power level from zero to
SOAK POWER 1 linearly over the time period RISE TIME 1.
The default value is 0%.
SOAK TIME 1. . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:s
This parameter provides the time period for which XTC/3 holds at
SOAK POWER 1. The default value is 00:00.
RISE TIME 2. . . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:s
This parameter provides the time period over which the source power isramped to SOAK POWER 2. The default value is 00:00.
SOAK POWER 2 . . . . . . . . . . . . . . . 0.0 to 100%
This parameter is usually set to the power level at which the source material
evaporates material at about the target rate. XTC/3 ramps the power level fromSOAK POWER 1 to SOAK POWER 2 linearly over the time period
RISE TIME 2. The default value is 0%.
SOAK TIME 2. . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:s
This parameter provides the time period for which XTC/3 holds at
SOAK POWER 2. The default value is 00:00.

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XTC/3 Operating Manual

Idle Ramp
The next two parameters define an idle ramp provided to maintain the control
voltage power level after the Deposit state. Control voltage is ramped from thepower level at the end of the Deposit state to the Idle Power level. The control
voltage is maintained at the Idle Power level until XTC/3 enters STOP or until thenext layer, using the specified source, is started, or the turret source is rotated.
NOTE: If the next layer started uses the source at the non-zero idle power, Rise 1
and Soak 1 states are skipped in the pre-deposit sequence.
IDLE RAMP TIME . . . . . . . . . . . . . . 00:00 to 99:59 min:s
This is the time interval over which the source power is ramped linearly fromthe power level at the end of Deposit to the Idle Power. The default value is
00:00.
IDLE POWER. . . . . . . . . . . . . . . . . . 0.0 to 100%
This is one of two parameters used to effect an Idle Power Ramp. This value
is the power level at which the source is maintained after the DEPOSIT phase.
If the material will be used in a subsequent layer, and if it is desired to reduce
cycle time, IDLE POWER should be set to the same value
as SOAK POWER 1.
RISE TIME 1 and SOAK TIME 1 states will be skipped if the IDLE POWER is
non-zero. The default value is 0%.

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XTC/3 Operating Manual

4.2.3.2 Deposit
Figure 4-3 Deposit Film Programming screen

FILM NUMBER . . . . . . . . . . . . . . . . 1 to 32 (XTC/3M)
1 to 9 (XTC/3S)
RATE . . . . . . . . . . . . . . . . . . . . . . . . 0.0 to 999.9 Å/sThis specifies the rate at which the deposition is to be controlled during the
DEPOSIT and Shutter Delay states. A value of 0.0 Å/sec allows skipping of thedeposit state. The default value is 0.0 Å/sec.
FINAL THICKNESS . . . . . . . . . . . . . 0.000 to 999.9 kÅThis is the thickness setting that triggers the end of the DEPOSIT state. The
Source Shutter and Crystal Shutter relays return to their normal states and theLayer enters the Idle Ramp state. The default value is 0.000 kÅ.
THICKNESS SET POINT. . . . . . . . . 0.000 to 999.9 kÅThis sets the thickness at which the Thickness Set Point is triggered and the
New Rate (if non-zero) is initiated. This thickness begins to accumulate after
entering the Deposit state. The state remains active after reaching theThickness Set Point until the beginning of the IDLE state.
The default value is 0.000 kÅ.
NEW RATE. . . . . . . . . . . . . . . . . . . . 0.0 to 999.9 Å/sec
This value sets the newly desired control rate when the Thickness Set Pointis reached. The default value is 0.0 Å/sec which disables the feature. A valueof 0.1 Å/sec triggers Final Thickness at the end of the Rate Ramp Time,see section 3.6.5 on page 3-25.
RATE RAMP TIME . . . . . . . . . . . . . . 00:00 to 99:59 min:s
This value determines the time period over which to ramp the rate from theoriginal rate to the New Rate. The default value is 00:00.

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XTC/3 Operating Manual

RW ACCURACY . . . . . . . . . . . . . . . 1 to 99%
During the rate sampling period, the deposition rate is measured by the crystal
and source power control is active. When the measured rate is within thedesired accuracy continuously for five seconds, the shutter is closed and thedeposition state returns to HOLD. The minimum accuracy is 1% or 0.5 Å/s,whichever is greater. The default value is 5%.
RW HOLD . . . . . . . . . . . . . . . . . . . . 00:00 to 99:59 min:s
RW HOLD determines the time interval between sample periods. The crystal
shutter relay is in its normal state during this time.
The default value is 00:00, which disables the function.
During a Rate Ramp, the Sample and Hold feature is inactive; the crystal
shutter is open and the rate is controlled by the crystal.

4.2.3.3 Sensor Parameters
Figure 4-4 Sensor Film Programming screen

SENSOR . . . . . . . . . . . . . . . . . . . . . 1, 2
Selects the sensor to use for the film. Default value is 1.
TOOLING . . . . . . . . . . . . . . . . . . . . . 10.0 to 500.0%
The TOOLING parameter applies to the primary crystal.
SECOND TOOLING. . . . . . . . . . . . . 10.0 to 500.0%
The SECOND TOOLING parameter applies when the Crystal Two’s crystal
switch relay becomes active. This parameter is not accessible unless a Crystal
Two sensor is in use.
The default value for both is 100%.

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XTC/3 Operating Manual

Tooling is a correction factor used for correlating the rate and thickness
accumulation on the crystal with the thickness accumulation on the substrate.
This thickness difference is due to the geometric distribution of material flux fromthe source.
The tooling factor is calculated using the equation:

T m
Tooling = TF i   -----T x[1]

where TFi = Initial Tooling Factor, Tm = Actual Thickness at the Substrate, andTx = Thickness on the Crystal.
If the TOOLING parameter is changed, the new TOOLING value is used for
subsequent calculation of the rate and thickness. Also, the thickness accumulated
thus far will be re-scaled based on the change to the TOOLING.
4.2.3.3.1 Setting S&Q Parameters (Soft Crystal Failures)
At some point during deposition the crystal may become unstable or erratic
yet continue to oscillate within XTC/3 acceptable frequency range of
6.0 MHz to 5.0 MHz. The resulting rate control will be poor and thickness
measurements may be inaccurate. By programming non-zero values for Stability
and/or Quality, various improvements in process control can be achieved if one ormore backup crystals are available. XTC/3 can be made to automatically switch
to a different crystal and continue the deposition normally, or complete the run in
the TIME-POWER mode or even terminate the process if a backup crystal is
not available.
4.2.3.3.2 Stability
Under ideal conditions, the crystal’s frequency will only decrease during adeposition due to the added mass of the material accumulating on the crystal.
Occasionally however, the crystal’s frequency may increase during a deposition
as a result of an undesired external influence. Stability selects the permissible
increase in frequency between successive measurements of the sensor before thecrystal is declared failed and an automatic crystal switch is initiated (if a backup
crystal or sensor is available) or the layer is completed in TIME-POWER modeor ends in STOP.
There are many reasons for a crystal to exhibit an increase in frequency. For
example, when a crystal is near the end of its life, it is prone to instabilities that may
result in a temporary increase in crystal frequency. Also, an increase in frequency
may occur due to film stress relieving or a film tearing off a crystal. Additionally,
temperature effects may cause an increase in frequency. A crystal subjected totemperatures over 100°C is more sensitive to small changes in temperature,inducing frequency changes. When heat is applied inside a chamber and/or when
the shutter is opened (exposing the crystal to the hot source), the crystal frequency
will increase until thermal equilibrium is obtained. When the active process ends

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XTC/3 Operating Manual

and/or the shutter closes, the crystal frequency will decrease due to cooling.
Because small increases in frequency may normally and unavoidably occur, valuesof 1 to 24 are not allowed for the Single and Total Stability parameters to prevent
false triggering of crystal fails.
NOTE: Stability is disabled in Etch mode.
SINGLE . . . . . . . . . . . . . 0 Hz and 25 to 9999 Hz (Values 1 to 24 are not allowed)
This sets the maximum permissible increase in frequency from one measurement
to the next. The default value is 0 Hz which disables the function.
TOTAL . . . . . . . . . . . . . . 0 Hz and 25 to 9999 Hz (Values 1 to 24 are not allowed)
This sets the maximum total permissible increase in frequency accumulated during
the active layer. The default value is 0 Hz which disables the function.
NOTE: After a crystal fails due to exceeding the allowable Hz value, theCrystal Fail state can be cleared by installing a new crystal or pressing
the TOGL key in the Sensors screen with the cursor on Clear S & Q.
4.2.3.3.3 Quality
Quality selects the permissible rate deviation in percent of the measured rate
relative to the desired rate and how many measurements must be outside therange before the crystal is declared failed.
PERCENT . . . . . . . . . . . 0 to 99% and > 0.5 Å/sec
This sets the deviation that must be exceeded to cause the COUNTS to increment.
The default value is 0% which disables the function.
COUNTS . . . . . . . . . . . . 0 to 99
This sets the number of measurements that must be outside the allowed Percent
before the crystal is declared failed. If the rate deviation relative to the programmed
rate is greater than the programmed threshold limit, the COUNTS value isincremented. If the rate deviation is less than the programmed threshold, the
COUNTS value is decremented. COUNTS is not allowed to have negative values.
If COUNTS exceeds the value programmed, XTC/3 will automatically crystal
switch, complete the process on TIME-POWER or STOP the process. The rate
deviation is computed on each individual rate measurement during the deposit
phase, i.e., every 250 ms. Upon entering Deposit, the Quality Count isdelayed by a time equal to four times the Time Constant plus the Dead Time, toallow for normal control loop stabilization. The Q Count on the Operate screen
will show Delay when in pre-deposit, and during the delay period at the beginningof Deposit.
The default value is 0, which disables the function.
NOTE: After a crystal fails due to exceeding the COUNTS value, the Crystal Failstate can be cleared by installing a new crystal or pressing the TOGL key
in the Sensors screen with the cursor on Clear S & Q.

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4.2.3.4 Source Parameters
Figure 4-5 Source Film Programming screen

SOURCE . . . . . . . . . . . . 1, 2This parameter determines which source output is to be used for source control
voltage for the material being defined. The default is 1. This parameter cannot bechanged while the film is running.
CRUCIBLE . . . . . . . . . . . 0 to 8
This parameter can be used to automatically index the turret position when using
a multiple pocket turret source. The value selected denotes which pocket of theturret source to use on this film. The default value is 0 and indicates a single pocket
source. If a non-zero value is entered, the appropriate outputs are activatedautomatically. Source power will not be applied until the appropriate Cruc Valid
input is activated.

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XTC/3 Operating Manual

CONTROL GAIN . . . . . . 0.01 to 100.0 Å/sec/% Pwr
This parameter determines the change in % Power for a given rate deviation(dRate/dPower). The larger the process gain value, the smaller the change inpower for a given rate error. The default is 10 Å/s/% Pwr.
Figure 4-6 Control Gain

Å/s

%
P

R
A

W

delta Rate = 10

T
E

O

20

10

20

E
R

delta Power = 1

19
0

TIME

CONTROL GAIN = dRate / dPower = 10/1 = 10

TIME CONSTANT . . . . . 0.1 to 100.0 sec
This is the evaporation source’s time constant. This value is defined as the timedifference between the actual start of a change in rate and the time at which 63%
of the rate step is achieved. This value may be measured according to the above
criterion or it may be determined empirically. The default value is 1.
Figure 4-7 Time Constant

TIME CONSTANT
PRO
A

63% POINT

Rate

W

T
E
E

Power

R

0

RATE INCREASE

4 - 12TIMEXTC/3 Operating Manual

DEAD TIME . . . . . . . . . . 0.1 to 100.0 sec
This value is defined as the time difference between a change in % power and thestart of an actual change in rate. The default value is 1.
Figure 4-8 Dead Time

Control DT
P
Rate

R
A

O
W

Power

T
E

E
R

RATE INCREASE

POWER INCREASE

TIME

MAXIMUM POWER . . . . 0.0 to 100.0%
This parameter is used to set the maximum permissible % power level. The control
voltage output will not exceed this limit. The default value is 100.0%.
DENSITY . . . . . . . . . . . . 0.50 to 99.99 g/cm3
This parameter is specific to the material being deposited onto the crystal. It is oneof two parameters that relate the mass loading on the crystal to a thickness.
The default value is 1.00 g/cm3.
Z-Ratio . . . . . . . . . . . . . . 0.100 to 9.999
This parameter is specific to the material being deposited. It is one of two
parameters that relate the mass loading on the crystal to a thickness.
The default value is 1.000. See Chapter A for material density and Z-Ratio values.

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XTC/3 Operating Manual

4.2.3.5 Option
Figure 4-9 XTC/3M Option Film Programming screen

TIME POWER . . . . . . . . Yes / No using TOGL key. Default is No.
The Time-Power state will only be entered while XTC/3 is in the DEPOSIT or
RATE RAMP state and the film program has been set to complete on Time-Powerin the event of a failed crystal when there is no backup crystal. If a crystal fail is
detected during the pre-deposit states XTC/3 will not sequence further, causing an
XTC/3 STOP even if the complete on Time-Power (Yes) option is selected.
Once in the Time-Power state, the source power will remain at the four seconds
average power value of the source control output computed two seconds prior to
the failure. (These times are appropriately modified for PID control.) Thickness isaccumulated at the programmed deposition RATE value. The Time-Power state
will terminate when the FINAL THICKNESS value has been exceeded.
Any post-deposit states will be executed exactly as if a normal deposition had
occurred. When the post-deposit states are complete, XTC/3 will end the layer anddisplay STOP. A RATE RAMP cannot be executed in Time-Power and that stateis consequently skipped.
DELAY OPTION. . . . . . . . . . . . . . . . None, Shutter, Control, Both.
Press the TOGL key to move through the choices. The default value is None forno delay chosen.
Shutter. . . . . . . . Shutter Delay state immediately following Soak Power 2
and preceding DEPOSIT. The source shutter relay remains
in its normal state and the sensor shutter relay is active. The
sensor, which must be positioned to sample the source flux
with the source shutter closed, provides closed loop rate
control.
Rate control must be maintained at +/-5% or +/- 0.5 Å/sec,
whichever is greater, of the desired deposition rate for fiveseconds before XTC/3 will enter the DEPOSIT state,opening the source shutter and thus exposing the substrate

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XTC/3 Operating Manual

to a well controlled rate of evaporant flux. If the required rate
control accuracy cannot be achieved within sixty seconds,
the Delay Failure alarm message will appear. If Stop on
Alarms has been set to Yes, the layer will STOP at thesame time.
Control. . . . . . . . Control Delay state. The Deposit state is entered and theControl Delay suspends control loop action on the source
control power for the time interval programmed in Control
Delay Time.
Source and sensor shutters are activated during Control
Delay. After the Control Delay Time elapses, control loop
action is initiated.
Both . . . . . . . . . . XTC/3 will first enter a Shutter Delay state followed byControl Delay.
TRANSFER SENSOR . . . . . . . . . . . Yes / No
Press the TOGL key to move through the choices. Default is No. This feature canonly be enabled when the Delay option Shutter or Both has been enabled. In
addition, a second sensor must be available to use this feature. If set to Yes, XTC/3
will use the second sensor for rate control during the shutter delay time and revert
back to the primary sensor after the shutter delay time has expired.
TRANSFER TOOLING. . . . . . . . . . . 10.0 to 500.0%
This parameter is enabled if Transfer Sensor has been set to Yes. Sets the toolingfactor to use with the Transfer sensor. See Tooling under section 4.2.3.3, Sensor
Parameters, on page 4-8. Default is 100.0%.
CONTROL DELAY TIME . . . . . . . . . 00:00 to 99:59 mm:ss
If Control Delay or Both were selected under the Delay Option, this parameter isenabled upon entering Deposit and sets the time for which control will besuspended and the power maintained at the Soak 2 power level. Default is 00:00.
ION ASSIST DEPOSIT . . . . . . . . . . Yes / No
Press the TOGL key to move through the choices. Default is No. Yes activates theIon Assist Output upon entering Deposit and deactivates it on leaving Deposit.
NAME (XTC/3M only) . . . . . . . . . . . 15 alphanumeric characters
Accepts up to 15 alphanumeric characters to uniquely identify a film. The film namecan be entered by moving to the Film Name and using the keypad in a manner
similar to a cell phone. For instance, to enter the letter S, press the PQRS key fourtimes. To enter the letter A, press the ABC key once. Figure 4-9 shows a film with
the name: FILM NAME.
Names that have been entered via Communications may contain characters
beyond the 15 alphanumeric ones that can be entered from the front panel.

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XTC/3 Operating Manual

4.3 Process Set-Up Overview (XTC/3M only)
Figure 4-10 Main Menu screen

In XTC/3M, the Process display appears after pressing the MENU key, thencursoring down to Process List and pressing Menu. XTC/3S does not have theProcess List menu option.
XTC/3M can have up to 99 pre-programmed processes. Each process can have alist of up to 999 layers, to be run in order. Additionally, a process can be named,with a name up to 15 alphanumeric characters long. Any of the 99 processes canbe programmed or deleted in any order (e.g., process 5 can be created, even if
process 4 is empty).
To delete a film, cursor to the film to be deleted in the process list. Press the 0 key
followed by the ENTER key. The only restriction on deletion is that theProcess to Run found on the General Screen Process page can not be empty.
If the parameters are locked, the L Lock or R Lock message will be displayed in
the upper right corner of the Process screen. The process list will be displayed, butcannot be changed. With the parameters locked, the process number may still bechanged to allow viewing of other processes.
Pressing ◄or ► keys will move between the selection panel andthe parameter panel.

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XTC/3 Operating Manual

4.3.1 Process Definition
Figure 4-11 Process screen

4.3.1.1 Process Number
PROCESS . . . . . . . . . . . 1 to 99
Upon entering the Process screen, the process displayed will be the one displayedwhen this screen was last left. A different process can be displayed by moving to
the process number parameter and entering the new process number.

4.3.1.2 Process Name
NAME . . . . . . . . . . . . . . . Accepts up to 15 alphanumeric characters.
The process name can be programmed by moving to the process Name and using
the keypad in a manner similar to a cell phone. For instance, to enter the letter S,
press the PQRS key four times. To enter the letter A, press the ABC key once.
If no name is entered, the process number (1 to 99) will be displayed.
Names that have been entered via Remote Communications may containcharacters beyond the 15 alphanumeric ones that can be entered from thefront panel.

4.3.1.3 Building the Layer Sequence
The Select Panel contains sets of 10 layers that can be displayed in the parameter
panel. The ▲or ▼ arrow keys are used to position the cursor at a specific layer inthe process, or at the blank space after the last defined layer.

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XTC/3 Operating ManualEntering a film number between 1 and 32 next to a layer number, followed by the
ENTER key, will place the desired film in that layer. If a film number was previously
entered, it will be replaced. Entering a 0 will delete the specified film and shift all
following films up. It is possible to insert a film into an existing film sequence by
cursoring to the desired layer and selecting the right arrow key. This action will shift
the layer list down to accommodate the added layer. Using the keyboard, input thefilm number to be inserted followed by ENTER. Pressing the CLEAR button willcancel the layer insertion. If the film is named, the film name will appear in the list,
otherwise the film number will appear.

4.4 General Parameters
Figure 4-12 Main Menu screen XTC/3M

NOTE: The Process List line is not present in XTC/3S.
The General Parameter display appears after pressing the MENU key, thencursoring down to General Parameters and pressing MENU.
The General Parameter screen is subdivided into the following screens:Process
HardwareComm(unications) InfoThe ▲or ▼ arrow keys are used to move from parameter to parameter.
The ◄ or ► keys are used to move from selection panel to parameter panel
and back. In most cases, the value can be updated using the TOGL key to toggle
between a series of choices. For a few parameters, the numeric keypad and
ENTER key are used.
If the parameters are locked, the L Lock or R Lock message will be displayedin the upper right corner. The parameter values will be displayed, but cannot
be changed.

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XTC/3 Operating Manual

4.4.1 Process Parameters
Figure 4-13 XTC/3M Process screen

Figure 4-14 XTC/3S Process screen

PROCESS TO RUN . . . . . . . 1 to 99 (XTC/3M only)
Selects the process to be run. Only processes with layers may be entered.
The default is 1. This function is not available in XTC/3S.
FILM TO RUN . . . . . . . . . . . 1 to 9 (XTC/3S only)
Selects the film to be run. The default is 1. This function is not available in XTC/3M.

4 - 19XTC/3 Operating Manual

AUTOSTART NEXT LAYER Yes / No (XTC/3M only)
Press the TOGL key to move through the choices. Default is No.
Yes enables automatically starting the next layer in the process when the previous
layer reaches the Idle state, unless that layer is the last layer in the process.
This function is not available in XTC/3S.
START WITHOUT BACKUP Yes / No
Press the TOGL key to move through the choices. This option is pertinent only
when a multi-position sensor is in use. In the default mode No, a layer cannot be
started unless there is at least one known working backup crystal available.
If set to Yes, a layer may be started without a working backup crystal.
STOP ON ALARMS . . . . . . . Yes / No
Press the TOGL key to move through the choices. Default setting is No.
Alarm conditions are defined in section 3.5.1 on page 3-23.
STOP ON MAX POWER . . . Yes / No
Press the TOGL key to move through the choices. Default setting is No. If set
to Yes, XTC/3 will stop if Max Power condition has been true for 5 seconds
continuously.
DEP/ETCH MODE . . . . . . . . Deposit / Etch
Press the TOGL key to move through the choices. Default mode is Deposit. By
setting the mode to Etch, XTC/3 may be configured to display the thickness ormass removed from the face of a crystal. It is imperative that the material beremoved uniformly over the active area of the crystal or improper readings will betaken. This inaccuracy occurs because of radial mass sensitivity differences acrossthe face of the monitor crystal.
The unit is operated normally, with the ZERO key used to zero the displayed
thickness. The FINAL THICKNESS parameter may be programmed to terminate
the process.
TEST . . . . . . . . . . . . . . . Yes / No
Press the TOGL key to move through the choices. The default is No. XTC/3
contains a software controlled Test Mode which simulates actual operation. The
purpose of the Test Mode is to verify basic operation and for demonstrating typicaloperation to the technician.
The Rate displayed during Test Mode operation is determined as follows:·
40
TOOLING (%)
Displayed Rate = -----------------------------------------------  --------------------------------------- Å/sec
100%
DENSITY (gm/cc)[2]

Relays, inputs, source and recorder outputs operate normally during Test Mode
but Crystal fails are ignored.

4 - 20XTC/3 Operating Manual

LOCK CODE . . . . . . . . . 1 to 9999
The L Lock lock code is set by moving to the Lock Code XXXX and entering thedesired code of up to 4 digits. If no lock code is desired, no entry needs to be made.
Entering a 0 will clear a previously set lock code and allow open access to allparameters. (Note, if there was previously a lock code programmed, the code mustfirst be entered on the Menu screen, with the cursor positioned on Lock Code.)
The lock code can also be cleared by depressing the CLEAR key on power-up,
however, if no lock code has been programmed, this will reset all parameters totheir default values.

4.4.2 Hardware Parameters
Figure 4-15 XTC3/M Hardware screen

SENSOR 1 TYPE . . . . . . Single, CrystalTwo, CrystalSix, Crystal12, Rotary,
Dual Head. Press the TOGL key to move through the
choices. Default is Single.
SENSOR 2 TYPE . . . . . . Single, CrystalTwo, CrystalSix, Crystal12, Rotary.
Press the TOGL key to move through the choices.
Default is Single.
NOTE: When a multi-position sensor type has been chosen, an output must be
selected for the Xtal Switch 1 or Xtal Switch 2 function to enableswitching to the next position. For XTC/3S, see section 3.6.8.6, XTC/3S
Sensor Shutter / CrystalSwitch Output, on page 3-30. For XTC/3M, seesection 4.5.3, XTC/3M Outputs, on page 4-29.
SOURCE CONTROL VOLT . . . . . . . 0 to +10, 0 to -10, 0 to +5,
0 to -5, 0 to +2.5, 0 to -2.5
Press the TOGL key to move through the
choices. Default is 0 to -10.

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XTC/3 Operating Manual

RECORDER MODE . . . . Rate, Thickness, Power, Rate Deviation.
Press the TOGL key to move through the choices.
Default is Rate.
RANGE . . . . . . . 100, 1000
Press the TOGL key to move through the choices. Default is 1000.
Rate clips at range value. Thickness is done modulo the range, meaningeach time the full scale value is exceeded, the recorder output returns to 0 andstarts to ramp up again to produce a sawtooth output. The Recorder output
voltage is 0 to +10 V.
This parameter is ignored if the recorder mode is power or rate deviation.
Power will always be full-scale 100%.
Rate deviation will always be full scale ±50 Angstroms/sec. Unit must be in
Deposit and not in Stop to show a rate deviation.
FILTER . . . . . . . . Smooth / Unfiltered (Rate)
Press the TOGL key to move through the choices. Default is Unfiltered rate.
Unfiltered provides 1/4 second measurement value. Smooth provides a
1 second averaged rate value.
This parameter is ignored if the recorder mode is Thickness, Power,
or Rate deviation.
AUDIO FEEDBACK. . . . Yes / No
Press the TOGL key to move through the choices. Default is No for beep off.
Turns the audible feedback for front panel or handheld controller key depression
on or off.
LCD DIMMER TIME. . . . 0 to 99 min
Determines the time before the backlight dims to conserve lamp life. Default is
0 min which disables the dimmer function. If a process is running, the LCD is
illuminated. If a process is not running, the LCD is extinguished.

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XTC/3 Operating Manual

4.4.2.1 XTC/3S Film Select Option
Figure 4-16 XTC/3S Film SelectINPUT OPTION . . . . . . . . . . . . . . . . Standard, Film Select (XTC/3S only)
Press the TOGL key to move through the choices. Default is Standard. Selecting
the Film Select option allows selecting one of the 9 films based on the state of theFilm Select inputs 5, 6, 7 and 8 as shown in the table below. In addition, input # 4
is reassigned to perform the RESET function.
Table 4-1 XTC/3S Film SelectInput #5 --MSB

Input #6

Input #7

Input #8 --LSB

Film #

00

0

0 or 1

1

0

0

1

0

2

0

0

1

1

3

0

1

0

0

4

0

1

0

1

5

0

1

1

0

6

0

1

1

1

7

1

0

0

0

8

1

0

0

1

9

1

0 or 1

1

0 or 11

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XTC/3 Operating Manual

4.4.3 Comm Info
Figure 4-17 Comm Info Screen with TCP/IP Option installed

NOTE: IP address and net mask are initialized 1 minute after power-up.
IP address and net mask text are grayed if no TCP/IP option is installed or
if communication cannot be established. See section 6.3.3 on page 6-18.

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XTC/3 Operating Manual

4.4.3.1 Remote Communication Parameters
RS-232BAUD RATE. . . . . . . . . . . . . . . . . . . 9600, 19200, 38400, 57600, 115200
Press the TOGL key to move through the choices. Default is 115200
PROTOCOL RS232 . . . . . . . . . . . . . Standard, Datalog, XTC/2 Ck Sum,
XTC/2 No Ck Sum, XTC/C Ck Sum,
XTC/C No Ck Sum
Press the TOGL key to move through the choices. Default is Standard.
See section 5.2 on page 5-6.
Datalog returns response described under section 5.2.2.5 on page 5-28, S19
command whenever the layer leaves the Deposit state.
See also section 3.6.14, Datalog, on page 3-32.
XTC/2 Ck Sum, XTC/C Ck Sum, see section 5.3.2 on page 5-37.
XTC/2 No Ck Sum, XTC/C No Ck Sum, see section 5.3.3 on page 5-37.

CAUTION
Upon changing the protocol to XTC/2 Ck Sum,
XTC/C Ck Sum, XTC/2 No Ck Sum, or XTC/C No Ck Sum,
it is highly recommended to check all prior parameters
entered to verify that they are compatible with the
reduced parameter set available in the XTC/2 protocols.
Otherwise, unexpected behavior may result.
Ethernet Interface Option
The optional TCP/IP interface supports static addresses; DHCP is not supported.
NOTE: IP address and net mask are initialized 1 minute after power-up. After thistime, they may be changed and XTC/3 must be power-cycled for the newvalues to become active.
IP ADDRESS and NET MASK are 32 bit numbers, they are written out
as 4 8-bit numbers, separated by decimals.
IP ADDRESS . . . . . . . . . . . . . . . . . . nnn.nnn.nnn.nnn
Use the up and down cursor keys to scroll through the address and the numerics
keys to enter the desired address. The default address is 10.211.70.203.
NET MASK. . . . . . . . . . . . . . . . . . . . nnn.nnn.nnn.nnn
The net mask is some number of leading bits set to 1, followed by all 0.
The default net mask value is 255.255.0.0:
255.

11111111

255 .
11111111

0.
00000000000000000

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XTC/3 Operating Manual

NOTE: After making changes to either the IP Address or the Net mask, you must
wait for the prompt: "Ethernet values have changed. Changes take effecton power-up." before cycling power to the instrument. This prompt will
occur within ten seconds of the last change. Failure to wait for this prompt
will prevent the complete change from being properly written.

4.5 I/O Overview
Figure 4-18 XTC3/M Main Menu screen

The I/O Map display appears after pressing the MENU key, then cursoring down
to I/O Map and pressing MENU.
Figure 4-19 XTC/3M All I/O screen

The All I/O screen displays the complete digital I/O map. The functions of inputs
1 to 9 are shown in the upper portion of the screen and the status of the outputs isshown on the lower portion of the screen. Active outputs are highlighted.

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XTC/3 Operating Manual

In XTC/3M, the selection panel permits selecting All I/O, Inputs, Relays or TTL
screens. Selecting anything but the All I/O on XTC/3M will allow update of thecorresponding inputs or outputs.
If the parameters are locked, the L Lock or R LOCK message will be displayedin the upper right corner. The Input, Relay, and TTL (Output) screens will not be
available for programming.

4.5.1 XTC/3S Inputs and Outputs
In XTC/3S, the fixed I/O will be displayed on the I/O Map screen. The assignmentof the 9 fixed inputs corresponds to the default assignments in XTC/2.
Also, refer to section 4.4.2.1, XTC/3S Film Select Option, on page 4-23 for inputs.
All relay (1 to 12) and TTL Open Collector outputs (13 to 20) are fixed to performthe functions shown on the screen. These function assignments are identical tothe default configuration provided in XTC/2 per section 2.3.3.2.1 on page 2-9.
Figure 4-20 XTC/3S I/O Map screen, Standard Input option

Figure 4-21 XTC/3S I/O Map screen, Film Select option

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XTC/3 Operating Manual

The fixed functions of inputs 1 to 9 are shown in the upper portion of the screen
and the status of the fixed outputs is shown on the lower portion of the screen.
Active outputs are highlighted.

4.5.2 XTC/3M Inputs
Figure 4-22 Inputs screen 1 (XTC/3M only)

Figure 4-23 Inputs screen 2 (XTC/3M only)

In XTC/3M, this screen allows modification of the 9 inputs. On the right side of theparameter panel will be a column of the inputs as they are currently programmed.
There will be blanks if the input is not defined. For the complete list of input
functions available for XTC/3M, see Table 3-3 on page 3-21.
The scrollable list of allowed input functions will be displayed on the left side of theparameter panel. The ▲▼◄► keys will cursor through this list. Entering a
number (1-9), followed by the ENTER key, will assign the selected input function tothat input number. Any number of inputs may be assigned to the same function,
except Sel Process (XX) which is limited to a single instance.
The ◄► arrow keys will go back and forth between the Inputs choices and theselection panel. The process selected via inputs will become active during
Idle End of Process and Ready.

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XTC/3 Operating Manual

NOTE: If an input is used to select an empty process, the selection will be ignored.
Process to Run will become the active process. If a layer or layers aresubsequently inserted into this previously empty process, its selection bydigital input will not be accepted until a Reset is done.

4.5.3 XTC/3M Outputs
The Relay Outputs and TTL Outputs screens allow modification of the 12 relays
or the 8 TTL outputs, respectively. All relays (1 to 12) and TTL Open Collector
outputs (13 to 20) are selectable to perform the functions shown on the screen. Any
number of outputs may be assigned to the same function. The default assignments
are identical to the default configuration provided in XTC/2 and referenced above.
On the right side of the parameter panel will be a column of the outputs as they are
currently programmed. There will be blanks if the output is not defined.
The scrollable list of allowed output functions will be displayed on the left side of
the parameter panel. The ▲▼◄► keys will cursor through this list. With the
cursor on <More>, press the ▼arrow to access additional functions. With the
cursor on <Previous>, press the ▲ arrow to return. Entering a number (1-12 forrelays, or 13-20 for TTL), followed by the ENTER key, will assign the selected
output function to that output number. Moving the cursor to the extreme rightcolumn permits changing the output between NO (Normally Open) and NC(Normally Closed) by using the TOGL key. With the unit powered off, the outputs
will always be open.
The◄►arrow keys will go back and forth between the selection panel and theparameter panel. For the complete list of output functions available for XTC/3M,
see Table 3-2 on page 3-19.
Figure 4-24 Relay Outputs 1

4 - 29XTC/3 Operating Manual

Figure 4-25 Relay Outputs 2

Figure 4-26 Relay Outputs 3

Figure 4-27 Relay Outputs 4

4 - 30XTC/3 Operating Manual

Figure 4-28 TTL Outputs

NOTE: Three additional selection screens, identical to those for the Relay outputs,
are available for selecting additional TTL Outputs.
NOTE: Three consecutive relay or TTL outputs must be available when selecting
the BCD output function, Cruc Src 1 BCD or Cruc Src 2 BCD.
All three outputs will be inactive for position 1, all three outputs will be
active for position 8. The first output in the sequence is the LSB.
Eight consecutive relay or TTL outputs must be available when selecting
the Bin output function, Cruc Src 1 Bin or Cruc Src 2 Bin. In BIN mode,
only one of these eight outputs will be active at any given time, forexample, output 13 for position 1, output 14 for position 2 etc.

4.5.4 Clear Input or Output
To clear an input or output assignment, cursor to the <Blank> selection on theappropriate screen and enter the input or output number to be cleared.

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XTC/3 Operating Manual

Chapter 5
Remote Communications
5.1 Remote Communications Overview
XTC/3 may be remotely controlled, programmed or interrogated. This isaccomplished through remote communications and the use of a remotecommand set. XTC/3 will respond to messages that contain these commands.
It will accept and operate on messages one at a time. It will respond to eachcommand by carrying out valid operations and/or returning a message to thesender. A host/server relationship is established in remote communications.
XTC/3, as server, responds to the remote host’s commands.
NOTE: Unpredictable RS-232 hardware/software combinations may occasionallycause a command to not be recognized by XTC/3. Consequently, allcommunications should include an automatic retry procedure. If acommand sent via RS-232 does not produce a response from XTC/3
within three seconds, it should be sent again.

5.1.1 Message Protocols
The message protocol serves as a structure for the contained command or
response information. It also can provide a level of acknowledgment between thehost and server and a mechanism for verifying the information content. In addition
to the optional TCP/IP interface, XTC/3 supports the following RS-232 protocols:
Standard, Datalog, XTC/2 Ck Sum, XTC/2 No Ck Sum, XTC/C Ck Sum and
XTC/C No Ck Sum. The Datalog protocol only provides for one-way transmissionof layer data from XTC/3 as described at section 3.6.14 on page 3-32. The last four
protocols are intended to permit an XTC/3S or XTC/3M to respond to commands
previously sent to an XTC/2 to facilitate changeover from an XTC/2 or XTC/C to an
XTC/3 without extensive reprogramming to the external computer or PLC.
NOTE: Unlike XTC/2 and XTC/C, XTC/3 does not support hardware handshaking.

CAUTIONDue to the reduced parameter set accessible under XTC/2
protocols, some parameters entered previously or
subsequently from the front panel, RS-232 or via TCP/IP will
be invisible to XTC/2 protocols but will remain active.
For instance, if the active process is programmed to containmore than three layers by means other than via XTC/2
protocols, any Start command issued after layer 3 is in Idle will
execute layer 4.
NOTE: TCP/IP will always operate using the Standard protocol command set.
It is not affected by the RS-232 Protocol selection.

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XTC/3 Operating Manual

5.1.2 Physical Connections
Two types of data communications hardware ports are available.
Standard equipment includes a bit serial RS-232C port. Optionally, a TCP/IP port
may be added. Generally speaking, both the host and server must have the same
form of communications equipment and complementary set-up. For serial
communications, baud rates must match and so must the data word format.
The word format for bit serial lines (RS-232C) is comprised of ten signal bits —eight data bits, one start bit, one stop bit and no parity. The eight data bits comprise
a byte of information or character whose ASCII value ranges from 0 to 255.
Both RS-232C and TCP/IP ports can be used simultaneously.

5.1.3 RS-232C Serial Port
RS-232C serial communications are accomplished through an industry standard
9-pin female connector found on the rear panel of XTC/3. A mating male connector
is required for attachment of a host interface. The host and XTC/3 can beseparated by up to fifty feet using multiconductor shielded data cable.
XTC/3 is configured as DCE or Data Communications Equipment. The PC or otherhost device should be set for no parity, 8 data bits and 1 Stop bit. Hardware
handshaking is not supported in XTC/3. Refer to section 2.3.4 on page 2-11 forcable connections and pin-outs.
5.1.4 TCP/IP Ethernet Port
XTC/3 communicates via TCP/IP on TCP port number 2101 and uses a variety ofbinary commands as described at section 5.2. See section 2.3.5 on page 2-11 andsection 2.3.5.1 for the appropriate ethernet cable type and section 4.4.3.1 on page
4-25 for determining or changing the IP address. The interface supports static
addressing, DHCP is not supported.
5.1.4.1 Network Connection
If XTC/3 is connected through a network or hub connection, a standard straight
ethernet cable is required.

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XTC/3 Operating Manual

5.1.4.2 How to Set Up the Network Protocol on the PC
Most personal computers are configured to obtain the IP address, an address
which defines the computer on the Internet, automatically from a server.
To communicate directly with XTC/3, the Internet protocol (IP) on the PC must be
configured manually and an ethernet crossover cable (PN 600-1211-P5) must beconnected between the PC and XTC/3. Some PC’s will autoconfigure and workwith either straight or crossover cable. Instructions are provided here for manuallyconfiguring the Internet protocol.
NOTE: If the personal computer only has one ethernet port (i.e., one network
connection) then setting the PC for direct communications will prohibit itfrom accessing the Internet until that setting is reversed.
NOTE: These instructions will set two values — the IP address and the Subnet
mask — which will most likely prohibit access to the Internet. If thesevalues already contain information then this information should berecorded somewhere for use in restoring the Internet connection.
To access the Network Connection on the PC, select Network Connections fromthe Start menu or from the Control Panel, as shown in Figure 5-1.
Figure 5-1 Accessing Network Connections

Select the Local Area Connection to be changed, right-click and selectProperties, as shown in Figure 5-2.

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XTC/3 Operating Manual

Figure 5-2 Local Area Connection Properties

On the General tab, select Internet Protocol (TCP/IP) and press theProperties button, as shown in Figure 5-3.
Figure 5-3 Internet Protocol (TCP/IP) Properties

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XTC/3 Operating Manual

Select the button for Use the following IP address, enter the IP address: andSubnet mask: shown in Figure 5-4, and press OK. With this selection, the PC isassigned an IP address to use when communicating with XTC/3.
XTC/3 is shipped from INFICON with a pre-assigned address of 10.211.70.203.
To communicate directly with XTC/3 from a PC, the PC must also be assigned anaddress that starts with 10.211.70 but cannot be set to 10.211.70.203.
The example in Figure 5-4 uses the address 10.211.70.100 for the PC.
Figure 5-4 Entering the IP Address and Subnet mask

Click OK to all open dialogs to close out the Internet Protocol setup for
the Local Area Connection.

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XTC/3 Operating Manual

5.2 Standard Protocol Message Format
This message format is in effect if Standard has been selected under
the RS-232 Protocol parameter and is always in effect for the TCP/IP port.
All messages are comprised of serial byte information. The byte values represent
command or response characters, control characters, or numeric values.
Mnemonics will be used to describe portions of each message format.
NOTE: These mnemonics are not part of the message stream; they are used
to represent specific ASCII codes, characters or numeric values thatcomprise the message stream.

5.2.1 Standard ProtocolKey:<> . . . . . . . . . . . . . . . . . . . . . . . . Enclosed element further defined below (orabove, if repeated use)() . . . . . . . . . . . . . . . . . . . . . . . . . Optional Element
I. . . . . . . . . . . . . . . . . . . . . . . . . . Or
x...x. . . . . . . . . . . . . . . . . . . . . . . One or more of x included
5.2.1.1 Standard Command Packet (Host to XTC/3 Message)<length><message><checksum>
Length. . . . . . 2 bytes Low / High (not including checksum or length bytes).
Numeric value from 0 to 57,800 (two bytes) representing thenumber of characters in the command. In order of transmission, thelow byte will precede the high byte. For most commands, thenumber for characters will be less than 256.
In this situation the low byte will contain the character count while
the high byte will have zero value.
Message . . . . . . . . . . . . . . . . . . . . . . <Command>(<Command>...<Command>)Command = <Command Group> (<Command Sub-group>) (<Command ID>)(<Parameter>...<Parameter>)Command Group = 1 ASCII byte, specifying category of command:
E - EchoH - Hello
Q - Query
R - Remote action
S - Status
U - Update

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XTC/3 Operating Manual

Command Sub-group = 1 ASCII byte, used with some command groups tofurther specify commands.
For command Q and U:
F – Film
G - General
I - Input
N - Film NameO - Output
P - Process
T - Output TypeNo sub-groups are allowed for H, E, S or R.
Command ID = 1 binary byte. Defines specific command within somecommand groups and sub-groups.
Parameter = <Byte>|<Integer>|<Float>|<String>|
Byte = 1 byte
Integer = 4 byte, low to highFloat = 4 byte, ANSII standard, single precision, low to highString = Null terminated series of ASCII characters

Checksum . . . . . . . . . . . . . . . . . . . . 1 byte, sum, modulo 256, of all bytes,
not including length.

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XTC/3 Operating Manual

5.2.1.2 Standard Response Packet (XTC/3 to Host Message)<Length><CCB><Timer><Response Message><Checksum>
Length. . . . . . . . . . . . . . . . . . . . . . . . 2 bytes Low / High (not including checksum
or length bytes). Numeric value from 0 to
57,800 (two bytes) representing the numberof characters in the Response Packet
including CCB, Timer, and Response
Message. Length bytes and Checksum are
not included in Length Count. Two byte
values, high and low order, represent thisnumber. In order of transmission, the low
byte will precede the high byte.
CCB . . . . . . . . . . . . . . . . . . . . . . . . . (Condition Code Byte) = 1 byte binary. MSB
set (hex 80) indicates command packet error.
Timer . . . . . . . . . . . . . . . . . . . . . . . . 1 byte binary, number between 0 and 255,
(hex 00 to FF) increments every quartersecond.
Response Message . . . . . . . . . . . . . <Command Response>...<Command
Response>|<Packet Error Code>NOTE: Number of command responses equals number of commands sent.
If CCB MSB is set, (hex 80) indicating a command packet error, the response
message will be a single packet response error.
If the CCB MSB is clear (hex 00), the command packet was parsed and a valid
command packet format was detected.
Command Response = <ACK><response>|<response error code>
NOTE: ACK is the ASCII code with decimal or hex value 6 indicating Positive
Acknowledgement of a command. It is not sent when a Response Error Codeis returned.
Response =(<integer>|<float>|<string>|<other>......<integer>|<float>|<string>|<other>)Integer = 4 byte, low to highFloat = 4 byte, ANSII standard, single precision, low to highString = Null terminated series of ASCII characters

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XTC/3 Operating Manual

Response Error Code = 1 byte ASCII
A= Illegal Command
B = Illegal parameter value
C = Illegal ID
D = Illegal format
E = Data not available
F = Cannot do now (some commands require XTC/3 to be
in Ready/Stop).
L = Length Error, must be greater than 0 and equal to orless than 57,800.
O = Not enough room for response size.
P = Prior command failed (if one command of a multiple command
packet fails, none of the following commands will be done, and thiserror code will be returned).
Packet Error Code = 1 byte ASCII.
C – invalid checksum
F – illegal format (too many bytes for the commands requested or
missing value in command)I – invalid message
L – Length Error, must be greater than 0 and equal to or lessthan 57,800.
M – too many commands (Only 100 allowed)
Checksum . . . . . . . . . . . . . . . . . . . . 1 byte, sum, modulo 256, of all bytes,
including CCB, Timer, and Response
Message but not including length.
Timeouts. . . . . . . . . . . . . . . . . . . . . . If more than 3 seconds pass between
characters of a command packet, XTC/3
will time out. No response packet is sent,
XTC/3 will clear its buffers and assume any
future characters are the beginning of anew packet.

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XTC/3 Operating Manual

5.2.2 Standard Communication Commands
NOTE: The following only include the “command” portion of the command packet
and the “response” portion of the response packet. The headers/trailers
are assumed. (See Protocol documentation above for their definition.)
General definitions<Float> = 4 byte, single precision ANSII standard floating point, low end first<Integer> = 4 byte, signed integer, low end first<String> = variable length, null terminated ASCII characters
5.2.2.1 Standard ECHO Command
Command
E <String>Response:<String> The same string that was sent.
String = Null terminated series of ASCII characters
5.2.2.2 Standard HELLO Command
Command:
H <Command ID>
Response:<String>) | <float>
String = Null terminated series of ASCII characters
Float = 4 byte, ANSII standard, single precision, low to highTable 5-1 Hello command responseStandard
CommandID

Meaning

Response

1

ASCII name and version<String> = “XTC/3x Version y.yy”
x = M or S
y.yy = Firmware version

2

Structure number
Compatibility number
Range number
Unit Type< Integer>< Integer>< Integer><
Integer>(0 = XTC3/M, 1 = XTC3/S)(77 = XTC3/M, 83 = XTC3/S)

3

Firmware version number<Float>5 - 10XTC/3 Operating Manual

5.2.2.3 Standard QUERY Commands
5.2.2.3.1 Query Block
Command:QB<Command ID>
Command ID = See listing below
Response:
Depends on Command ID. See listing that follows
Command ID = 1 ”All Parameters”
The command will return all parameters in the following order. Formats arelisted in the individual commands. Maximum bytes allowed in the response are
57,800. A Command Length error code L is returned if there is too much data.
Response:<Number of Bytes in Response><General Parameters><Film 1
Parameters>…<Film32 Parameters><Inputs><Outputs><Output Types><Film
1 Name>…<Film 32 Name> <Process One>…<Process 99><Process 1
Name>…<Process 99 Name>
Number of Bytes in Response (2 bytes)
All General parameters (4 bytes per parameter)
All parameters for each film (4 bytes per parameter) (9 or 32 films basedon XTC/3S or XTC/3M)
All input definitions (9) (1 byte per input) (XTC/3M only)
All output definitions (20) (1 byte per output) (XTC/3M only)
All output types (20) (1 byte per output) (XTC/3M only)
All Film Names (null terminated) (32 films) (XTC/3M only)
Every process layer list for each process (99) (2 byte length (for the number oflayers programmed) followed by 1 byte for each programmed layer) (XTC/3M
only)
All process Names (null terminated) (99) (XTC/3M only)
Command ID = 2 ”All Parameters without Process Layer lists and Process Names”.
Will return all parameters in the following order, with formats as listed in theindividual commands.

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XTC/3 Operating Manual

Response:<Number of Bytes in Response><General Parameters><Film 1
Parameters>…<Film32 Parameters><Inputs><Outputs><Output Types><Film
1 Name>…<Film 32 Name>
Number of Bytes in Response (2 bytes)
All General parameters (4 bytes per parameter)
All parameters for each film (4 bytes per parameter) (9 or 32 films based on
XTC/3S or XTC/3M)
All input definitions (9) (1 byte per input) (XTC/3M only)
All output definitions (20) (1 byte per output) (XTC/3M only)
All output types (20) (1 byte per output) (XTC/3M only)
All Film Names (null terminated) (32 films) (XTC/3M only)
Command ID = 3 “Lower 50 Processes Information” (XTC/3M only)
Response:<Number of Bytes in Response><Process One>…<Process 50><Process 1
Name>…<Process 50 Name>
Number of Bytes in Response (2 bytes)
Process 1 – 50 layer list (2 byte length (for the number of layers programmed)
followed by 1 byte for each programmed layer)
Process 1 – 50 Names (null terminated)
Command ID = 4 “Upper 49 Processes Information” (XTC/3M only)
Response:<Number of Bytes in Response><Process 51>…<Process 99><Process 51
Name>…<Process 99 Name>
Number of Bytes in Response (2 bytes)
Process 51 – 99 layer list (2 byte length (for the number of layers programmed)
followed by 1 byte for each programmed layer)
Process 51 – 99 Names (null terminated)

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XTC/3 Operating Manual

5.2.2.3.2 Standard Query Film Name (XTC3/M only)
Command:
QN <Film Number>
Film Number = <Byte> 1-32
Response:<String> (maximum 15 characters, plus terminating null character)
String = Null terminated series of ASCII characters
5.2.2.3.3 Standard Query Film Parameters
Command:
QF <Command ID> <Film Number>Command ID = <Byte> See “UF Command ID” column in Table 5-2 on page
5-22.
Film Number = <Byte> 1-9 (XTC/3S ) or 1-32 (XTC/3M)
Response:<Integer> | <Float>
Integer = 4 byte, low to highFloat = 4 byte, ANSII standard, single precision, low to highDescription: Type of response depends on command ID, see “DataType /Format” column of Table 5-2 on page 5-22.
Special Case: QF255 <Film Number> will return all film parameters for the
given film, in numeric order.
5.2.2.3.4 Standard Query General Parameter
Command:
QG <Command ID>
Command ID = <Byte> See “UG Command ID” column inTable 5-3 on page 5-25.
Response:<Integer> | <Float>
Integer = 4 byte, low to highFloat = 4 byte, ANSII standard, single precision, low to highDescription: Type of response depends on command ID, see “DataType /Format” column of Table 5-3 on page 5-25.
Special Case: QG255 will return all general parameters, in numeric order5 - 13

XTC/3 Operating Manual

5.2.2.3.5 Standard Query Input Definition (XTC/3M Only)
Command:
QI <Input Number>
Input Number = <Byte> 1-9, 255 (255=All 9 inputs)
Response:
If Input Number was 1 – 9:
<Input Definition>
If Input Number was 255:
<Input 1 Definition> <Input 2 Definition> … <Input 9 Definition>
Input Definition = < Byte > As decoded below
0 Blank (Input not used)
1 Start2 Stop3 End Deposit
4 Rate Watcher Hold Initiate
5 Rate Watcher Hold Inhibit
6 Crystal Fail Inhibit
7 Zero Thickness
8 Soak 2 Hold
9 Crucible 1 Valid
10 Crucible 2 Valid
11 Reset
12 Select Process 1-4, 2 bits*
13 (Select Process 1-4, 2 bits, bit 2)
14 Select Process 1-16, 4 bits*
15 (Select Process 1-16, 4 bits, bit 2)
16 (Select Process 1-16, 4 bits, bit 3)
17 (Select Process 1-16, 4 bits, bit 4)
18 Select Process 1-64, 6 bits*
19 (Select Process 1-64, 6 bits, bit 2)
20 (Select Process 1-64, 6 bits, bit 3)
21 (Select Process 1-64, 6 bits, bit 4)

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XTC/3 Operating Manual

22 (Select Process 1-64, 6 bits, bit 5)
23 (Select Process 1-64, 6 bits, bit 6)
24 Select Process 1-99, 7 bits*
25 (Select Process 1-99, 7 bits, bit 2)
26 (Select Process 1-99, 7 bits, bit 3)
27 (Select Process 1-99, 7 bits, bit 4)
28 (Select Process 1-99, 7 bits, bit 5)
29 (Select Process 1-99, 7 bits, bit 6)
30 (Select Process 1-99, 7 bits, bit 7)
31 Switch Crystal
32 Non-Deposit Hold
33 Zero Film Time
34 Start Inhibit
35 Soak 1 Hold
* Querying an input that corresponds to a secondary bit of one of the selectprocesses will return the corresponding number. For individual updates, only the
primary bit can be set. The corresponding secondary bits will be set automatically.
For a block update (UI 255 or UB x, see below), when a select process is set, theprimary bit must be set. Each additional bit corresponding to the select process
must have the proper corresponding number, or 0.
5.2.2.3.6 Standard Query Output Definition (XTC/3M Only)
Command:
QO <Output Number>
Output Number = <Byte> 1-20, 255 (255=all outputs)
Response:
If Output Number was 1 – 20:<Output Definition>
If Output Number was 255:
<Output 1 Definition><Output 2 Definition>…<Output 20 Definition>
Output Definition = <Byte> as decoded below
0 Blank (Output not used)
1 Source Shutter 1

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XTC/3 Operating Manual

2 Source Shutter 2
3 Sensor Shutter 1
4 Sensor Shutter 2
5 Stop6 End of Process
7 Thickness Setpoint
8 Crystal Fail
9 Alarms
10 Source in use (Open=1; closed=2)
11 Final Thickness
12 End of Film
13 In Layer
14 Ion Assisted Deposition
15 Crystal Switcher 1
16 Crystal Switcher 2
17 Ready
18 Crucible Switching
19 Rise 1
20 Soak 1
21 Rise 2
22 Soak 2
23 Shutter Delay
24 Deposit
25 Rate Ramp
26 Manual
27 Time Power
28 Idle Ramp
29 Idle30 Max Power
31 Rate Deviation Error
32 Crystal Switcher Fail

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XTC/3 Operating Manual

33 Crystal Switching
34 Crucible Switcher Fail
35 Shutter Delay Error
36 Computer Control
37 Crucible Select Source 1 Binary (8 outputs required, one/position)*
38 (Crucible Select Source 1 Binary, bit 2)
39 (Crucible Select Source 1 Binary, bit 3)
40 (Crucible Select Source 1 Binary, bit 4)
41 (Crucible Select Source 1 Binary, bit 5)
42 (Crucible Select Source 1 Binary, bit 6)
43 (Crucible Select Source 1 Binary, bit 7)
44 (Crucible Select Source 1 Binary, bit 8)
45 Crucible Select Source 1 BCD (3 outputs required BCD)*
46 (Crucible Select Source 1 BCD, bit 2)
47 (Crucible Select Source 1 BCD, bit 3)
48 Crucible Select Source 2 Binary (8 outputs required, one/position)*
49 (Crucible Select Source 2 Binary, bit 2)
50 (Crucible Select Source 2 Binary, bit 3)
51 (Crucible Select Source 2 Binary, bit 4)
52 (Crucible Select Source 2 Binary, bit 5)
53 (Crucible Select Source 2 Binary, bit 6)
54 (Crucible Select Source 2 Binary, bit 7)
55 (Crucible Select Source 2 Binary, bit 8)
56 Crucible Select Source 2 BCD (3 outputs required BCD)*
57 (Crucible Select Source 2 BCD, bit 2)
58 (Crucible Select Source 2 BCD, bit 3)* Querying an output that corresponds to a secondary bit of one of the crucible
select will return the corresponding number. For individual updates, only the
primary bit can be set. The corresponding secondary bits will be set automatically.
For a block update (UO 255 or UB x, see below), when a Crucible Select is set, theprimary bit must be set. Each additional bit corresponding to the Crucible Selectmust have the proper corresponding number, or 0.

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XTC/3 Operating Manual

5.2.2.3.7 Standard Query Output Type Definition (XTC/3M Only)
Command:
QT <Output Number>
Output Number = <Byte> 1-20, 255 (255=all outputs)
Response:
If Output Number was 1 – 20:<Output type>
If Output Number was 255:
< Output 1 type > < Output 2 type > … < Output 20 type >Output type = <Byte>
0 = Normally open
1 = Normally closed
5.2.2.3.8 Standard Query Process Parameters (XTC/3M Only)
Command:
QP <Command ID> <Process Number>[<Parameter>]Command ID = See listing below
Process Number = <Byte> 1-99
<Parameter> = Depends on Command ID (See listing that follows)
Response:
Depends on Command ID. See listing that follows
Command ID = 1 "Layer List"
Response:<Number of Layers> <Layer 1> <Layer 2> … <Layer n>
Number of Layers = <2 Bytes> n = Number of layers in this process
Layer n = <Byte>Film number of each layer, 1 to n, when n = Number ofLayersCommand ID = 2 "Name"
Response:<Process Name>
Process Name = <String> maximum 15 characters plus null terminating
character.

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XTC/3 Operating Manual

Command ID = 3 "Specific Layer"<Parameter> = <2 Bytes>Desired Layer
Response:<Byte> 1-32, film number of given layer
5.2.2.4 Standard UPDATE Commands
5.2.2.4.1 Update Block
Command:UB< Command ID> <List of parameters>
Response:
None (Just header and trailer)
List of parameters for Command ID 1 =<Number of Bytes in Response><General Parameters><Film 1
Parameters>…<Film32 Parameters><Inputs><Outputs><Film 1
Name>…<Film 32 Name> <Process 1>…<Process 99><Process 1
Name>…<Process 99 Name>
Number of Bytes in Response (2 bytes)
All General parameters (4 bytes per parameter)
All parameters for each film (4 bytes per parameter) (9 or 32 films based on
XTC/3S or XTC/3M)
All input definitions (9) (1 byte per input) (XTC/3M only)
All output definitions (20) (1 byte per output) (XTC/3M only)
All output types (20) (1 byte per output) (XTC/3M only)
All Film Names (null terminated) (32 films based on XTC/3M only)
Every process layer list for each process (99) (2 byte length (for the number oflayers programmed) followed by 1 byte for each programmed layer)(XTC/3M only)
All process Names (null terminated) (99) (XTC/3M only)
Note: maximum allowed bytes are 57,800. If there are more bytes in thecommand then the data should be broken into the following commands.
List of parameters for Command ID 2 =<Number of Bytes in Response><General Parameters><Film 1
Parameters>…<Film32 Parameters><Inputs><Outputs><Film 1
Name>…<Film 32 Name
Number of Bytes in Response (2 bytes)

5 - 19XTC/3 Operating Manual

All General parameters (4 bytes per parameter)
All parameters for each film (4 bytes per parameter) (9 or 32 films based on
XTC/3S or XTC/3M)
All input definitions (9) (1 byte per input) (XTC/3M only)
All output definitions (20) (1 byte per output) (XTC/3M only)
All output types (20) (1 byte per output) (XTC/3M only)
All Film Names (null terminated) (32 films based on XTC/3M only)
List of parameters for Command ID 3 = (XTC/3M only)<Number of Bytes in Response><Process 1>…<Process 50><Process 1
Name>…<Process 50 Name>
Number of Bytes in Response (2 bytes)
Every process layer list for each process 1 through 50 (2 byte length (for thenumber of layers programmed) followed by 1 byte for each programmed layer)
All process Names (null terminated) (1 - 50)
List of parameters for Command ID 4 = (XTC/3M only)<Number of Bytes in Response><Process 51>…<Process 99><Process 51
Name>…<Process 99 Name>
Number of Bytes in Response (2 bytes)
Every process layer list for each process 51 through 99 (2 byte length (for thenumber of layers programmed) followed by 1 byte for each programmed layer)
All process Names (null terminated) (51 - 99)
5.2.2.4.2 Standard Update Film Name (XTC/3M only)
Command:
UN <Film Number><Name>
Film Number = <Byte> 1-32
<Name> = string, (maximum 15 characters, characters are restricted to hex
values 20 to 7E inclusive, plus terminating null character)
Response:
None (Just header and trailer)

5 - 20XTC/3 Operating Manual

5.2.2.4.3 Standard Update Film Parameters
Command:
UF <Command ID> <Film Number> <Parameter Value>
Command ID = <Byte>. See “UF Command ID” column of Table 5-2.
Film Number = <Byte> 1-9 (XTC/3S ) or 1-32 (XTC/3M)
Parameter Value = <Integer> | <Float>
Integer = 4 byte, low to highFloat = 4 byte, ANSII standard, single precision, low to highDescription: Type of parameter value depends on command ID,
see “DataType / Format” column of Table 5-2.
Response:
None (Just header and trailer)
Special Case: UF255 <Film Number> <List of all Film Parameter Values inorder> will update all film parameters for the given film, in numeric order.
NOTE: Some limitations apply as to when specific film parameters may be
updated, e.g., Hardware used by a film cannot be redefined while that filmis active. All parameters may be updated in Ready state.

5 - 21

XTC/3 Operating Manual

Table 5-2 Standard film parametersUF(0x5546)
Command ID

NameUnits / Allowed Values/ Notes

Data Type/ Format

Low
Limit

High Limit0(0x00)

Rise Time 1

MM:SS(Seconds)

Int

0

99:59
(5999)

1(0x01)

Soak Power 1

%

Float
xxx.x

0.0

100.0

2
(0x02)

Soak Time 1

MM:SS(Seconds)

Int

0

99:59
(5999)

3(0x03)

Rise Time 2

MM:SS(Seconds)

Int

0

99:59
(5999)

4(0x04)

Soak Power 2

%

Float
xxx.x

0.0

100.0

5
(0x05)

Soak Time 2

MM:SS(Seconds)

Int

0

99:59
(5999)

6(0x06)

Idle Ramp

MM:SS(Seconds)

Int

0

99:59
(5999)

7(0x07)

Idle Power

%

Float
xxx.x

0.0

100.0

8
(0x08)

Deposition Rate

Å/sec

Float
xxx.x

0.000

999.9

9
(0x09)

Final Thickness

kÅ

Float
x.xxx
xx.xx
xxx.x

0.000

999.9

10
(0x0a)

Thickness Set
Point

kÅ

Float
x.xxx
xx.xx
xxx.x

0.000

999.9

11
(0x0b)New Rate

Å/sec

Float
xxx.x

0.0

999.9

12
(0x0c)

Rate Ramp
Time

MM:SS
(Seconds)

Int

0

99:59
(5999)

13(0x0d)

RateWatcher
Accuracy

%

Int

1

99

5 - 22

XTC/3 Operating Manual

Table 5-2 Standard film parameters (continued)

5 - 23UF(0x5546)
Command ID

NameUnits / Allowed Values/ Notes

Data Type/ Format

Low
Limit

High Limit

14(0x0e)RW Hold Time

MM:SS
(Seconds)

Int

0

99:59
(5999)

15(0x0f)

SensorCannot change if film
is running

Int

1

2

16
(0x10)

Tool Factor 1

%

Float
xxx.x

10.0

500.0

17
(0x11)

Tool Factor 2% (only active if
sensor type =CrystalTwo

Float
xxx.x

10.0

500.0

18
(0x12)

Xtal Stability
SingleValues 1 to 24 are notallowed

Int

0

9999

19
(0x13)

Xtal Stability
Total

Values 1 to 24 are notallowed

Int

0

9999

20
(0x14)

Xtal Quality
Percent

%

Int

0

99

21
(0x15)

Xtal Quality
Counts

Int

0

99

22
(0x16)

2Source

Int

1

2

23
(0x17)

2Crucible

Int

0

8

24
(0x18)

Control Gain

Å/sec / %

Float
xx.xx

00.01

100.0

25
(0x19)

Control Time
Constant

Seconds

Float
xxx.x

0.1

100.0

26
(0x1a)

Control Dead
Time

Seconds

Float
xxx.x

0.1

100.0

27
(0x1b)Max Power

%

Float
xxx.x

0.0

100.0

28
(0x1c)

Density

g/cm3

Float
x.xx
xx.xx

0.50

99.99

XTC/3 Operating Manual

Table 5-2 Standard film parameters (continued)UF(0x5546)
Command ID

Name

29
(0x1d)

Z-Ratio30(0x1e)

Time Power31(0x1f)

Units / Allowed Values/ Notes

Data Type/ Format

Low
Limit

High Limit

Float
x.xxx
xx.xx
xxx.x

0.100

9.999

1=Yes,
0 = NoInt

0

1

Delay option

0 = None
1 = Shutter
2 = Control
3 = Both

Int

0

3

32
(0x20)

1Transfer

1=Yes, 0 = No
Cannot change if film
is running

Int

0

1

Sensor33(0x21)

1Transfer

%

Float
xxx.x

10.0

500.0

34
(0x22)

1Control Delay

MM:SS(Seconds)

Int

0

99:59
(5999)

35(0x23)

2Ion Assisted

1=Yes,
0 = No

Int

0

1

36
(0x24)

Graph Label

0 = Rate Dev
1 = Power

Int

0

1

37
(0x25)

Graph Scale

0=5
1 = 102 = 203 = 40

Int

0

3

255
(0xff)

2All Parameters

ToolingTime
Deposit

1 See section 4.2.3.5, Option, on page 4-14

2 Cannot change when a film is running.

5 - 24

XTC/3 Operating Manual

5.2.2.4.4 Standard Update General Parameters
Command:
UG <Command ID> <Parameter Value>
Command ID = <Byte> See “UG Command ID” column of Table 5-3.
Parameter Value = <Integer> | <Float>
Integer = 4 byte, low to highFloat = 4 byte, ANSII standard, single precision, low to highDescription: Type of parameter value depends on command ID, see“DataType” column of Table 5-3.
Response:
None (Just header and trailer)
Special Case: UG255<List of all General Parameter Values in order> will
update all general parameters in numeric order.
NOTE: Some limitations may apply as to when general parameters
may be updated.
Table 5-3 Standard general parameters
UG(0x5547)
Command ID

0(0x00)

Name

Units / Allowed
Values / Notes

1Process to run

Can be changed
only in Ready or Idle
in last layer(XTC/3M only)
1Film to run

DataType /
Format

Low
Limit

High
Limit

1

99

Int

1

9

(XTC/3S only)

5 - 251(0x01)Start Layer Without
Backup Xtal

1 = Yes, 0 = No

Int

0

1

2 (0x02)

Stop on Alarms

1 = Yes, 0 = No

Int

0

1

3 (0x03)

Stop On Max Power

1 = Yes, 0 = No

Int

0

1

4
(0x04)

1Dep/Etch Mode

0 = Deposit
1 = Etch

Int

0

1

5 (0x05)

1Test

1 = Yes, 0 = No

Int

0

1

6
(0x06)

1Sensor 1 Type

0 = Single
1 = CrystalTwo
2 = CrystalSix
3 = Crystal12
4 = Rotary
5 = Dual Head

Int

0

5

XTC/3 Operating Manual

Table 5-3 Standard general parameters (continued)
UG(0x5547)
Command ID

NameUnits / Allowed
Values / Notes

Data
Type /
Format

Low
Limit

High
Limit

7
(0x07)

1Sensor 2 Type

0 = Single
1 = CrystalTwo
2 = CrystalSix
3 = Crystal12
4 = Rotary(On Query only:
5 = Dual Head)

Int

0

4
(5 forQuerycommand)8(0x08)

1Source0 = 0 to +10
1 = 0 to -10
2 = 0 to +5
3 = 0 to -5
4 = 0 to +2.5
5 = 0 to -2.5

Int

0

5

Control Voltage

9(0x09)

Recorder Mode

0 = Rate
1 = Thickness
2 = Power
3 = Rate Deviation

Int

0

3

10
(0x0a)

Recorder Range

0 = 100
1 = 1000

Int

0

1

11
(0x0b)

Recorder Filter

1 = Smooth
0 = Unfiltered

Int

0

1

12 (0x0c)

Audio Feedback

1 = Yes, 0 = No

Int

0

1

13 (0x0d)

Dim LCD

Minutes

Int

0

99

14
(0x0e)

RS232 Baud Rate

0 = 9600
1 = 19200
2 = 38400
3 = 57600
4 = 115200

Int

0

4

15
(0x0f)

RS232 Communications Protocol

0 = Standard RS232
1 = Datalog
2 = XTC/2
w/checksum
3 = XTC/2 nochecksum

Int

0

3

5 - 26

XTC/3 Operating Manual

Table 5-3 Standard general parameters (continued)
UG(0x5547)
Command ID

16 (0x10)

255(0xff)

Name

Units / Allowed
Values / Notes

Auto Start Next Layer(XTC/3M only)

1 = Yes, 0 = No

Input Option(XTC/3S only)

0 = Standard
1 = Film SelectData
Type /
Format

Low
Limit

High
Limit

Int

0

1

1All Parameters(Must be in Ready)

1 Cannot change when a film is running.

5.2.2.4.5 Standard Update Input Definition (XTC/3M only)
Command:
UI <Input Number> <Input Definition>|<Input Number = 255> <Input 1 Definition><Input 2 Definition> … <Input 9 Definition>
Input Number = <Byte> 1-9 (255=All Inputs)
Input Definition= <Byte> refer to section 5.2.2.3.5 on page 5-14
Response:
None (Just header and trailer)
5.2.2.4.6 Standard Update Output Definition (XTC/3M only)
Command:
UO <Output Number> <Output Definition>
Output Number = <Byte> 1-20 (255=All Outputs)
Output Definition = < Byte > refer to section 5.2.2.3.6 on page 5-15
Response:
None (Just header and trailer)
5.2.2.4.7 Standard Update Output Type Definition (XTC/3M Only)
Command:
UT <Output Number> < Output Type>|< Output Number = 255> < Output 1
Type > < Output 2 Type > … < Output 20 Type >Output Number = <Byte> 1-20 (255=All Outputs)
Output Type = <Byte> (0 = Normally open, 1 = Normally closed)
Response:
None (Just header and trailer)

5 - 27

XTC/3 Operating Manual

5.2.2.4.8 Standard Update Process Parameters (XTC/3M only)
Command:
UP <Command ID> <Process Number> <Parameter List> [<Parameter Value >]Command ID = See listing below
Process Number = <Byte> 1-99
Parameter List = Depends on the Command ID (See listing that follows)
Parameter Value = Depends on the Command ID (See listing that follows)

Response:
None (Just header and trailer)
Command ID = 1 "Layer List"
Parameter List = <Number of Layers> <Layer 1> <Layer 2> … <Layer n>
Number of Layers = <2 Bytes> Number of layers in this process
Layer n = Film number the layer is to be programmed with. (1 – 32)
n = Number of Layers
Command ID = 2 "Name"
Parameter List = <Process Name>
Process Name = <String> maximum 15 characters, characters are restricted tohex 20 - hex 7E inclusive, plus null terminating character.
Command ID = 3 "Specific Layer"
Parameter List = Layer to be updated<2 Bytes>
Parameter Value = Film number for given layer to be programmed<Byte> (1 – 32)
5.2.2.5 Standard STATUS Commands
Command:
S <Command ID> (<Action Value>) - see special case S0 below.
Command ID = <Byte> See “S Command ID” column in Table 5-4.
Action Value = <Byte>, only required for S0.
S0 command: The S0 command requires a timer tick to be sent. Timer ticks
increment internally from 0 to 256 (0x00 to 0xFF) at a rate of 4x per second.
XTC/3 stores the S0 data set valid for each timer tick and returns that specific data
set when the S0 command is sent with that particular timer tick. If the timer tick sent
is not the current one, the data returned will be old data and may be as old as 64

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XTC/3 Operating Manual

seconds (256 timer ticks / 4 per second). Therefore, to get current data, the timer
tick must first be extracted from a prior command and then incremented every 250
msec and inserted in the S0 as the <Action Value>.
Response:<Byte|Integer|Float>(<Byte|Integer|Float>…<Byte|Integer|Float>
Integer = 4 byte, low to highFloat = 4 byte, ANSII standard, single precision, low to highTable 5-4 Standard Status commands
S(0x53)
Command ID

0(0x00)

Description

Process
Information:(only valid forspecific timer tick
requested)

Response:
Description (Data Format) Units -Detail-

Returns the following for the timer tick (0x00 to
0xFF) sent
Crystal Status (1 byte)
Bit 0 - 0 = Good, 1 = Failed Crystal
Bit 1 - 0 = Not Switching, 1 = Switching crystal
Bit 2 - 0 Good Reading, 1 = Invalid Reading(reading is invalid during resonance recovery
time of several seconds following loss of sensor
crystal frequency measurement)
State (1 byte)
Active Sensor (1 byte)
Active Crystal (1 byte)* Rate (Float) -One second averageThickness (Float)
Power (Float)*Rate Deviation (Float)
Frequency (Int DDS units). -Multiply by
0.0034924596 to convert to hertz.
Returns No Data if the requested timer tick has
no new data to send.* If in Stop or not in Deposit, Rate and Rate
Deviation return values of zero.

Procedure for extracting the Invalid Reading byte from the Crystal Statusbyte:
1. Send the S1 command to get the rate.
2. From the resulting response packet, find the timer tick value in the fourth
byte of the response packet.
3. Append this timer tick value to the S0 command and send it.
4. Extract the first byte from the Response Message part of the Response
Packet.
5. If bit 2 of that byte is 1, the Crystal Status is invalid, meaning the crystal is inrecovery mode. (The status correlates with the specific rate just received.)

6. Repeat steps 1 to 5

5 - 29XTC/3 Operating Manual

Table 5-4 Standard Status commands (continued)
S(0x53)
Command ID

Description

Response:
Description (Data Format) Units -Detail-

1 (0x01)* Current Rate

(Float) Å/Sec -One second rolling average-

2 (0x02)

Current Power(Float) %3 (0x03)

Current Thickness(Float) kÅ4(0x04)

Current State(Byte) - Decoded as follows: 0 = Ready
1 = Crucible Switch
2 = Rise 1
3 = Soak 1
4 = Rise 2
5 = Soak 2
6 = Shutter Delay
7 = Deposit
8 = Rate Ramp
9 = Manual
10 = Time Power
11 = Idle Ramp
12 = Idle

5 (0x05)

Current State Time

(Int) - Number of seconds -6 (0x06)

Active Layer(Int)

7 (0x07)

Active Film

(Byte)

8 (0x08)

Active Sensor(Byte) ( 1 or 2)

9 (0x09)

Crystal Life

(Byte)

10 (0x0a)Power Source(Byte) ( 1 or 2)

11(0x0b)

Output Status Byte

(4 Byte) - Each bit represents an output (0 = not set, 1 = set)
Output 1 = LSB, Output 20 = 20th bit

5 - 30XTC/3 Operating Manual

Table 5-4 Standard Status commands (continued)
S(0x53)
Command ID

Description

12(0x0c)

Input Status Byte

(2 Byte) - Each bit represents an input (0 = not set, 1 = set)
Input 1 = LSB, Input 9 = 9th bit
0x0100 = Input 1
0x0200 = Input 2
0x0400 = Input 3
0x0800 = Input 40x1000 = Input 50x2000 = Input 60x4000 = Input 70x8000 = Input 80x0001 = Input 90x0300 = Input 1 & 2
0x0101 = Input 1 & 9
0x3800 = Input 4, 5 & 6 etc

13(0x0d)

Raw Frequency(Int DDS units). - Multiply by 0.0034924596 toconvert to hertz.-

Xtal Fail(Byte) 0 = good crystal / not in Xtal Fail;
1 = failed crystal / in Xtal FailMax Power(Byte) 0 = false not in max power;
1 = true in max power

16 (0x10)

Crystal Switching(Byte) 0 = not switching; 1 = switching

17 (0x11)

End of process(Byte) 0 = False; 1 = True

18 (0x12)

Stop(Byte) 0 = False; 1 = True

14(0x0e)
15(0x0f)

5 - 31

Response:
Description (Data Format) Units -Detail-XTC/3 Operating Manual

Table 5-4 Standard Status commands (continued)
S(0x53)
Command ID

Description

Response:
Description (Data Format) Units -Detail-19(0x13)

Data Log

Returns data as follows
Layer # (Int)
Film # (Int)
Rate (Float) Å/Sec - One second averageThickness (Float) kÅ
Deposit time (Int) Seconds
Average power (Float) %S Value (Int)Q Value (Byte)
Begin Frequency (Float) HZ
End Frequency (Float) HZCrystal Life (Byte) %Layer end type (Byte) -Normal end (0), Timepower end (1) or Stop (2) Cause of stop: (Byte)
0 = No stop
1 = Keyboard
5 = Crystal Fail6 = Max Power
7 = Hand Controller
8 = Communications
9 = Digital Input
10 = Power Loss
11 = Rate Dev Error
12 = Crystal Switcher fail

20 (0x14)

Active Process(Byte)

21 (0x15)

Power up error flag

(Byte) Bit is set indicating error as follows:
0 = Parameter loss on power cycle
1 = Process variables loss on power cycle
2 = Power down/up cycle

30(0x1e)

Crystal Status(2 Bytes) Each bit indicates one crystal of amulti-head sensor. 1 = Good Crystal, 0 = Failed
Crystal. LSB is Crystal 1. All bits > number ofcrystals on sensor are 0.

31(0x1f)

Rolling Average(Float) Å/Sec Returns a rolling 6.25-second
average of the measurement rate. Updated
every 0.25 seconds.

32 (0x20)

Active Crystal(Byte) Crystal of the current sensor that is in use.

5 - 32

XTC/3 Operating Manual

Table 5-4 Standard Status commands (continued)

5 - 33S(0x53)
Command ID

Description

Response:
Description (Data Format) Units -Detail-33(0x21)

Status Messages(4 bytes) Each bit indicates which status
message is displayed.
0x80000000 = Max Power0x40000000 = Crystal Fail
0x20000000 = Crystal Switch Fail
0x10000000 = Crystal Switching
0x08000000 = Carousel Open0x04000000 = Control Delay
0x02000000 = Transfer Delay
0x01000000 = Delay Failure
0x00800000 = End of Process
0x00400000 = RateWatcher Delay
0x00200000 = RateWatcher Hold0x00100000 = RateWatcher Sample
0x00080000 = Crucible Switch Fail
0x00040000 = Soak Hold
0x00020000 = Non Deposit Hold
0x00010000 = Etch Mode
0x00008000 = Local Lock
0x00004000 = Remote Lock
0x00002000 = Test
0x00001000 = Delayed Start
0x00000800 = Testing XIU
0x00000400 = Layer Insert
0x00000200 - 0x00000001 not defined

34 (0x22)

Raw Rate(Float) Rate Å/Sec

35(0x23)

Ethernetparameters(8 bytes) First 4 bytes = IP address (xx.xx.xx.xx)
Second 4 bytes = Net Mask (xx.xx.xx.xx)
where the left most xx group is the MSB in both

XTC/3 Operating Manual

5.2.2.6 Standard REMOTE Commands
R <Command ID> (<Action Value>)Command ID = <Byte>. See "R Command ID" column in Table 5-5.
Action Value = <Byte> | <Float>
Float = 4 byte, ANSII standard, single precision, low to highA few commands have a value with them. See Table 5-5.
Response = None (Just header and trailer)
Table 5-5 Standard remote commands
FunctionR(0x52)
Command ID

Description

0 (0x00)

Start

Starts the next layer of the active process.

1(0x01)

Stop

Stops the layer, puts power to zero,closes shutters, etc.

2(0x02)

Reset

If in Stop, resets XTC/3 to the Ready state,at the beginning of the process.

3(0x03)

Remote lock on

Prevents the update of parameters via
the front panel.

4 (0x04)

Remote lock off

Removes the remote lock.

5(0x05)

Crystal fail inhibit on

Prohibits the crystal fail relay from activating.

6 (0x06)

Crystal fail inhibit off

The crystal fail relay will act normally.

7(0x07)

Soak Hold 2 onWill cause the unit to stay in Soak 2 state,once entered, until the Soak Hold is removed(R8)

8 (0x08)

Soak Hold 2 off

Will allow the unit to leave the Soak 2 state.

9 (0x09)

Manual on

Places the unit in the Manual power state.

10(0x0a)

Manual off

Removes the unit from Manual power state,
and puts it into the Deposit state.

11(0x0b)

Set power to <Value> vv

Active layer to vv % power.
vv = <Float> 0 - 100 (Note: Only allowed if
current state is Manual)

5 - 34

XTC/3 Operating Manual

Table 5-5 Standard remote commands (continued)
R(0x52)
Command ID

5 - 35Function

Description

12 (0x0c)

Zero thickness

Zeroes the thickness of the current layer.

13(0x0d)

Final thickness trigger

Causes the active film to react as if the final
thickness was reached.

14(0x0e)

Crystal switch

If a multi-crystal sensor is attached to theunit, it will switch to the next position.

15(0x0f)

Enter comm. I/O mode
XTC/3S only.

This indicates that all digital outputs areunder remote communications control,
and their normal functions are overridden.
XTC/3 must be in this mode to remotely set
or clear relays (R17 and R18). If the unit is an
XTC/3M an Illegal ID error is returned.

16(0x10)

Exit comm. I/O mode
Used in XTC/3S only.

Exits the Communication I/O mode, returns
all digital outputs to normal, XTC/3 controlled
operation. If the unit is an XTC/3M an Illegal
ID error is returned.

17(0x11)

Set (close) digital output<Value> vv

vv = <Byte> (output # 1- 20).
In XTC/3S the Communication I/O modemust be active for this command to operate.
In XTC/3M, the selected output must be set
to Computer Control for this command tooperate.

18(0x12)

Clear (open) digital output<Value> vv

vv = <Byte> (output # 1-20).
In XTC/3S the Communication I/O modemust be active for this command to operate.
In XTC/3M, the selected output must be set
to Computer Control for this command tooperate.

19 (0x13)

Turn Backlight on

Turns the LCD backlight full on

20 (0x14)

Turn Backlight off

Turns the LCD backlight full off

21 (0x15)

Trigger beeper

Sounds an audible beep

22 (0x16)

Clear power up error flag

Clears the power up error.

26(0x1a)

Clear All Crystals

Sets the crystal status for all the crystals
in the current sensor to good.

XTC/3 Operating Manual

Table 5-5 Standard remote commands (continued)
R(0x52)
Command ID

Function

Description

27(0x1b)

Rotate head

If the current sensor selected is a CrystalSix,
Crystal12, Rotary or Dual Head, the sensor
will perform a full rotation and all crystals will
be verified. Returns an A response error
code if configured for a Single, Crystal Twoor Dual Head.
Returns a F response error code if no output
is defined.

28(0x1c)

Clear S and Q counts

Clears the accumulated stability andquality counts.

5.3 XTC/2 Protocols
One of these protocols is in effect if XTC/2 Ck Sum, XTC/2 No Ck Sum,
XTC/C Ck Sum or XTC/C No Ck Sum has been selected under the
RS-232 Protocol parameter. TCP/IP always uses the Standard protocol.
Unlike XTC/3’s standard protocol, which is binary based, XTC/2 protocols are
ASCII based. That is, numbers are represented by their ASCII codes, not as"floats" or "ints".

5.3.1 Basic Command Structure
The following commands are available via the computer communications:E . . . . . . . Echo. Returns the sent message.
H . . . . . . . Hello. Returns the model and software version number.
Q. . . . . . . Query. Interrogates the programmable parameters and returns the valueof parameter requested.
U . . . . . . Update. Replaces the particular parameter with the value sent.
S . . . . . . . Status. Sends back pertinent information based on the specificrequest made.
R . . . . . . . Remote. Perform an action based on the specific command given.
The send and receive protocol formats are described below .
NOTE: When transmitting commands directly by typing on a keyboard, the entire
command, including the ACK, must be entered quickly. Otherwise, XTC/3
will fail to recognize the transmission as a valid command.

5 - 36

XTC/3 Operating Manual

5.3.2 XTC/2 Serial Communication with ChecksumThis portion of the protocol is in effect in addition to the portion described under
section 5.3.1 above if XTC/2 Ck Sum or XTC/C Ck Sum has been selected under
the RS-232 Protocol parameter.
ACK . . . . . . . Command acknowledged character, ASCII character value d06,
Control F from keyboard.
NAK . . . . . . . Command not acknowledged character, ASCII character value d21.
STX . . . . . . . Start of transmission character, ASCII character value d02
00,NN . . . . . . The size of the command is 2 bytes long with 00 representing thehigh order Byte and NN representing the low order byte.
CS . . . . . . . . Checksum, modulo 256 value of message_string and ACK or NAK
To XTC: STX 00 NN message_string CS
From XTC: STX 00 NN ACK message_string CS (if success)- or STX 00 NN NAK error code CS (if failure)

5.3.3 XTC/2 Serial Communications - No ChecksumThis portion of the protocol is in effect in addition to the portion described under
section 5.3.1 above if XTC/2 No Ck Sum or XTC/C No Ck Sum has been selectedunder the RS-232 Protocol parameter.
ACK . . . . . . . Command acknowledged character, ASCII character value d06,
Control F from keyboard.
NAK . . . . . . . Command not acknowledged character, ASCII character value d21.
To XTC: message_string ACK
From XTC: message_string ACK (if success)- or error_code NAK (if failure)5 - 37

XTC/3 Operating Manual

5.3.4 XTC/2 Error Codes
Table 5-6 XTC/2 error codes

Code

Description

A

Illegal command

B

Illegal ValueC

Illegal ID

D

Illegal command format

E

No data to retrieve

F

Cannot change value nowG

Bad checksum

5 - 38

XTC/3 Operating Manual

5.3.5 XTC/2 Message Strings
5.3.5.1 XTC/2 ECHO Command
Echoes the message, i.e., returns the sent message.
The format is: E message string
5.3.5.2 XTC/2 HELLO Command
The HELLO command will return the string XTC/y VERSION x.xx where y is 2 orC, depending on the RS232 protocol set, and x.xx is the software revision code.
The format is: H
5.3.5.3 XTC/2 QUERY Command
The Query command returns information concerning current XTC/3 parametervalues.
The format of the query command is:
Q pp F - Query parameter pp of film F or Q pp L for layer parameters. A space isused as a delimiter between Q and pp as well as pp and F, where F (or L), is a digit
between 1 and 9, L is a digit between 0 and 3, inclusive, and represents theinterrogated film or layer number.
NOTE: If pp is set to 99, output all parameters in the order specified below;
each parameter is separated by a space. This command allows a rapid
block transfer of data which is convenient for downloading films.
Table 5-7 XTC/2 parameter definition table (for QUERY and UPDATE commands)

XTC/2
PP

5 - 39XTC/3

Parameter Range0

Rise Time 1

0 - 5999 or 00:00 - 99:59

1

Soak Power 1

0.0 - 100.0

2

Soak Time 1

0 - 5999 or 00:00 - 99:59

3

Rise Time 2

0 - 5999 or 00:00 - 99:59

4

Soak Power 2

0.0 - 100.0

5Soak Time 2

0 - 5999 or 00:00 - 99:59

6

Shutter Delay

0 to 1

7

New Rate

0.0 - 999.98Rate Ramp Time

0 - 5999 or 00:00 - 99:59

9

Idle Ramp

0 - 5999 or 00:00 - 99:59

10

Idle Power

0.0 - 100.0

11Time Power

1 or 0 or 'Y' or 'y' or 'N' or 'n'

12

Xtal Switch S

0 - 9 (See XTC/2 manual section 4.6)

XTC/3 Operating Manual

Table 5-7 XTC/2 parameter definition table (for QUERY and UPDATE commands)

XTC/2
PP

XTC/3

Parameter Range

13

Xtal Switch Q

0 - 9 (See XTC/2 manual section 4.6)

14

Tool Factor 1

10 - 500.0

15Tool Factor 2

10 - 500.0

16Deposition Rate

0 - 999.9

17

Final Thickness

0.0 - 999.9

18

Thickness Spt

0.0 - 999.9

19

Density

0.5 - 99.99

20

Z-Ratio

0.1 - 9.999

21

Sensor1-2

22

Source1-2

23

Crucible

0-8

24

Control Gain

0.01- 100.0

25

Control TC

0.1 - 100

26

Control DT

0.1 - 100

27

Max Power

0.0 - 100.028

Sample0 - 9929

Hold Time

0 - 5999 or 00:00 - 99:59

30-39 **NOT USED **

40

Layer

99

All

1-31 0-92

1) May be 0 for Q command; if 0, will return values for layers 1 - 3.
In an XTC3/S there is only one layer. Q 40 2 or Q 40 3 returns an error.
Q 40 0 returns 1 0 0. In XTC/3M, if there is no film in the layer, Q 40 2 or Q
40 3 will return a NO DATA error.
2) Only applies to U 40 command. 0 is not allowed for layer 1.

5 - 40XTC/3 Operating Manual

Table 5-8 Q40 command responses

Command

XTC/3S Response

XTC/3M Response

Q40 0"a 0 0 " (a = 1 to 9,
0 = no film in layer)"a b c" (a = 1 to 32, b = 0 to 32,
c = 0 to 32)

Q40 1"a" (a = 1 to 9)"a" (a = 1 to 32)

Q40 2"No Data" error"b" if b = 1 to 32"No Data" error if b = 0

Q40 3"No Data" error"c" if c = 1 to 32"No Data" error if c= 0

a = Film # in Layer 1
b = Film # in Layer 2
c = Film # in Layer 3

5.3.5.4 XTC/2 UPDATE Command
The Update command replaces the current parameter value with the DATA Sent.
To update film parameters the format of the update command is:
U pp F vvv - Parameter pp of film F, value vvv.
Update parameter pp of film F, with value vvv, a space is used as a delimiter
between the pp and F values as well as the F and vvv values, where F is a digit
between 1 and 9. Refer to Table 5-7 for a numbered list of parameters and theirlimits. If value vvv is left blank, the command will be accepted and a value of 0 willbe transmitted.
NOTE: If pp is set to 99, the data is a list of all parameters in the order specified.
This command allows a rapid block transfer of data which is convenient for
downloading films. Each parameter value must be separated by a space.
To update layers, the format of the update command is:
U 40 L v
Where 40 designates a layer is to be updated. The value L indicates which layer toupdate. The value of L can be 1, 2, or 3, and v designates the film number to insert
into layer L.
For example, the update command
U 40 1 4
will enter film number 4 into layer 1.

5 - 41

XTC/3 Operating Manual

NOTE: In XTC/2 one can program a zero film number in layer two and a good film
number in layer three. This is not allowed in XTC3. If a zero is programmedin layer two and there is a good film number in layer three the film in layer
three is then placed in layer two. Layer three is then empty.
U 40 2 v or U 40 3 v is not allowed in XTC3S since only one film is allowedin XTC3S.
5.3.5.5 XTC/2 STATUS CommandSends back information based on specific request made.
The format of the status command is:
S xx . . . . Return the status (value) of xx
where:
S . . . . . . . Is the literal S
xx . . . . . . One or two digit code per list below:
S0 . . . . . Process information. All the information from S1 to S10, separated
by spaces.
S1 . . . . . . Rate (Å/s) currently read. x.x to xxx.x Å/sS2 . . . . . . Power (%) currently output. x.x to xxx.x %S3 . . . . . . Thickness (KÅ) currently accumulated. x.xxxx kÅ to xxxx.xxxx kÅ
S4 . . . . . . Phase currently in process. x
S4 Response Codes
0 . . . . . . . Ready phase
1 . . . . . . . Source switch phase
2 . . . . . . . Rise 1 phase
3 . . . . . . . Soak 1 phase
4 . . . . . . . .Rise 2 phase
5 . . . . . . . Soak 2 phase
6 . . . . . . . Shutter delay phase
7 . . . . . . . Deposit phase
8 . . . . . . . Rate ramp phase
9 . . . . . . . Manual phase
10 . . . . . . Time power phase
11 . . . . . . Idle ramp phase
12 . . . . . . Idle phase
S5 . . . . . . Phase time (mm:ss). xx:xx

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XTC/3 Operating Manual

S6 . . . . . . Active layer. x
S7 . . . . . . Active film x
S8 . . . . . . Active sensor. x
S9 . . . . . . Crystal life (%). x % to xx %S10 . . . . . Power source number. x (1 or 2)
S11 . . . . . Output status - returns a string of 16 ASCII bytes, 1 per output. Eachbyte has an ASCII value of 0 or 1, corresponding to the output status.
Response Format (Non-Checksum):
Byte1............Byte16<ACK> where byte 1 corresponds to output 1.
Table 5-9 XTC/2 Output Status bits

Output#Output Default
function

Output state

1

Source Shutter 1

1=open, 0=closed

2

Source Shutter 2

1=open, 0=closed

3

Sensor Shutter 1

1=open, 0=closed

4

Sensor Shutter 2

1=open, 0=closed

5

Stop

1=Stop, 0=not stop

6

End of Process

1=End of process, 0=not end of process

7

Thickness Setpoint

1=Thk Setpoint

8

Soak 2

1=Soak 2 phase9

Crystal Fail

1=Xtal Fail

10

Alarms1=Alarm Cond.

11

Source 1/Source 2,(toggle)1=Source 2, 0=Source 1

12

End Deposit(Final Thickness)

1=End Deposit (Final Thickness) reached13

Crucible Select LSB(XTC/2)14

5 - 43

Crucible Select(XTC/2)15

Crucible Select MSB(XTC/2)

16

unusedBCD value representing crucible positionof active source:
000 = Position 0 or 1
111 = Position 8

XTC/3 Operating Manual

S12 . . . . . Input status - returns 9 ASCII bytes in order byte 1 to 9, 1 byte per input.
Each byte has an ASCII value of 0 or 1, corresponding to the input’s
status. 0 = grounded (active), 1 = open or high (inactive).
Table 5-10 S12 Command Input status

Input #
Byte #

Function

1

Start

2

Stop

3

End

4

Sample Initiate

5Sample Inhibit

6

Crystal Fail Inhibit

7

Zero Thickness

8

Soak 2 Hold9

Crucible Valid

S13 . . . . . Raw frequency - Frequency of crystal being read. xxxxxxx.x Hz[negative of last good frequency if failed]
S14 . . . . . Xtal Fail - Returns ASCII 1 if currently failed crystal, 0 if not.
S15 . . . . . Max Power - Returns ASCII 1 if currently outputting maximum power,
0 if not.
S16 . . . . . Crystal switching - Returns ASCII 1 if currently crystal switching, 0 if not.
S17 . . . . . End of process - Returns ASCII 1 if process has ended, 0 if not.
S18 . . . . . STOP - Returns ASCII 1 if process is in STOP.
S19 . . . . . DATALOG - Returns the datalog string, refer to section 5.2.2.5, S19
command for details. Data is separated by spaces instead of CR/LF.
The last byte returned identifies the End on Time Power or Normal Completion
information as 1 or 0 respectively. Also, when using the S19 command theBegin Process and End Process messages are not returned.
S20 . . . . . Present Configuration Selections - returns 16 ASCII bytes witha value of 0 or 1.
Data byte order (Non-checksum): 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 <ACK>

5 - 44

XTC/3 Operating Manual

1 = Selection active, 0 = default state for selection
Also see S22 below.
NOTE: In the default configuration, bits 8 and 9 will return values of 1 whereas thedefaults for these bits was 0 in XTC/2. If it is desired to make the S20
response equal to XTC/2 default response, change the Recorder Range to
100 and the Audio Feedback to Yes, both per section 4.4.2 on page 4-21.
Table 5-11 S20 Command Input status

Byte #

Function

State

#1

Test Mode(0 = off, 1 = on)#2

Parameter Lock(0 = off, 1 = on)#3

Control Mode

(0 = deposit, 1 = etch)#4

Stop On Alarms(0 = no, 1 = yes)#5

Stop on Max Power(0 = no, 1 = yes)

#6
#7

Recorder Type(in order:
Byte 6, 7, 8)#8#9Beep On/Off(0=on, 1=off)# 10

Backlight Dim(0 = no, 1 = yes)

# 11Start Layer without
backup crystal(0 = no, 1 = yes)
NOTE: See section 3.6.9 on page 3-30 for
description# 12

Input Option

0 = Standard, 1 =Film Select# 13

Not used, returns 0# 14

Sensor Type(in order: Byte 14,15)00 = Single Head(s)10 = Single CrystalSix on sensor 1
11= Two CrystalSix sensors

Source Control
Voltage polarity

0 = neg, 1 = pos

# 15
# 16

5 - 45000 designates Rate, 100 Å/s full scale(unfiltered)
001 designates Rate, 1000 Å/s full scale(unfiltered)
010 designates Thickness, 100 Å full scale
011 designates, 1000 Å full scale
100 designates Power %101 designates Rate Deviation (±50 Å/s)
110 designates Rate 100 Å/s full scale smoothed
111 designates Rate 1000 Å/s full scale smoothedXTC/3 Operating Manual

S21 . . . . . Error Flag - If more than one error code exists, the response string will
return them all, each separated by a single space.
S21 Response Codes:
0 Error 0
2 Power Fail or STBY/ON sequence
9 Error 9
10 No Errors
S22 . . . . . XTC/3 configuration readout, same as S20.
S30 . . . . . Returns status of each crystal of a multi-head sensor.
S31 . . . . . Returns a rolling 6.25 second average (updated every 0.25 seconds) of
the measurement rate.
5.3.5.6 XTC/2 REMOTE Commands
The format of the Remote command is:
R xx vvv (a space is required between the xx and the vvv)
where:
R . . . . . . Is the literal R.
xx . . . . . . Is the remote code per list below.
vvv . . . . . Is the associated value needed for some remote commands.
R0 . . . . . . Start. Equivalent to pressing the START key.
R1 . . . . . . Stop. Equivalent to pressing the STOP key.
R2 . . . . . . Reset. Equivalent to pressing the RESET key.
R3 . . . . . . Remote Lock On. Prohibits any parameter from being entered
via the front panel.
R4 . . . . . . Remote Lock Off. Clears remote lock condition.
R5 . . . . . . Crystal fail inhibit on. Simulates remote input.
R6 . . . . . . Crystal fail inhibit off. Simulates release of remote input.
R7 . . . . . . Soak hold 2 on. Simulates remote input.
R8 . . . . . . Soak hold 2 off. Equivalent release of remote input.
R9 . . . . . . Manual on. Equivalent to front panel MPWR keystroke.
R10 . . . . . Manual off. Equivalent to front panel MPWR keystroke.
R11 . . . . . Set power level vv. Sets the active source’s power to vv% if unit isin Manual mode.

5 - 46

XTC/3 Operating Manual

R12. . . . . Zero thickness. Simulates remote input or front panel ZERO keystroke.
R13. . . . . Final thickness-end deposit trigger. Simulates remote input.
R14. . . . . CrystalSwitch. Equivalent to front panel XTSW keystroke.
R15. . . . . XTC/3S only. Enter communication I/O mode — See R16 (Only applies
when in communication I/O mode)
R16. . . . . XTC/3S only. Exit communication I/O mode — See R15 (Only applies
when in communication I/O mode)
R17. . . . . Set (close) relay xx (xx = 1-12) (Works also in XTC/3M if that output has
been selected as "Computer Contl" type)
R18. . . . . Clear (open) relay xx (xx = 1-12) (Works also in XTC/3M if that output
has been selected as "Computer Contl" type)
R19. . . . . Turn backlight ON
R20. . . . . Turn backlight OFF
R21. . . . . Trigger beeper
R22. . . . . Clear Error Flag
R23. . . . . Not supported
R24. . . . . Not supported
R25. . . . . Set upper frequency limit to 6.027 MHz. (This command is accepted
but not executed since the default upper frequency limit
exceeds 6.027 MHz.)The following additional commands were available on XTC/C only:
R30. . . . . Test ON
R31. . . . . Test OFF
R32. . . . . Control Mode Deposit
R33. . . . . Control Mode Etch
R34. . . . . Stop on Alarms
R35. . . . . No Stop on Alarms
R36. . . . . Stop on Max Power
R37. . . . . No stop on Max Power

5 - 47

XTC/3 Operating ManualR38 x . . . Recorder Type x (0 = Rate 0 to 100 Å/s,
1 = Rate 0 to 1000 Å/s,
2 = Thickness 0 to 100 Å,
3 = Thickness 0 to 1000 Å,
4 = Power,
5 = Rate Deviation,
6 = Rate 0 to 100 Å/s smoothed,
7 = Rate 0 to 1000 Å/s smoothed)R39 . . . . . Not supported
R40 . . . . . Not supported
R41 . . . . . Not supported
R42 . . . . . Not supported
R43 . . . . . Not supported
5.3.5.7 XTC/2 Sample Host Programs
5.3.5.7.1 XTC/2 Program Without Checksum
10 ’----XTC/3 RS232 COMMUNICATIONS PROGRAM WITHOUT CHECKSUM---20 ’
30 ’------THIS PROGRAM IS DESIGNED TO TRANSMIT INDIVIDUAL COMMANDS TO XTC/3 AND
ACCEPT THE APPROPRIATE RESPONSE FROM XTC/3, WRITTEN IN GWBASIC 2.32.
40 ’
50 OPEN "COM1:9600,N,8,1,CS,DS" AS #1 :’--OPEN COMM PORT 1
60 NAK$ = CHR$(21): ACK$ = CHR$(6) :’--DEFINE ASCII CODES
70 ’
80 INPUT "ENTER COMMAND"; CMD$ :’--ENTER COMMAND TO XTC/3
90 GOSUB 130 :’--GOTO TRANSMIT COMMAND
SUBROUTINE.
100 PRINT RESPONSE$ :’--PRINT XTC/3 RESPONSE
110 GOTO 80 :’--LOOP BACK FOR ANOTHER
COMMAND.
120 ’
130 ’----TRANSMIT COMMAND AND RECEIVE RESPONSE SUBROUTINE---140 ’
150 ’----SEND COMMAND MESSAGE STREAM TO XTC/3---160 PRINT #1, CMD$ + ACK$;170 ’
180 ’----RECEIVE RESPONSE MESSAAGE FROM XTC/3---190 RESPONSE$ = "" :’--NULL THE RESPONSE
200 TOUT = 3: GOSUB 260 :’ STRING AND SET TIMER.
210 IF I$ = ACK$ THEN RETURN :’--IF THE END OF RESPONSE

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XTC/3 Operating Manual

220 IF I$ = NAK$ THEN RETURN :’ CHARACTER IS RECEIVED
GOTO PRINT RESPONSE.
230 RESPONSE$ = RESPONSE$ + I$ :’--BUILD RESPONSE STRING
240 GOTO 200 :’ CHARACTER BY CHARACTER.
250 ’
260 ’----READ SERIALLY EACH CHARACTER FROM THE INSTRUMENT INTO VARIABLE I$---270 ON TIMER (TOUT) GOSUB 300: TIMER ON
280 IF LOC(1) < 1 THEN 280 ELSE TIMER OFF: I$ = INPUT$(1,#1)
290 RETURN
300 TIMER OFF :’--INDICATE IF A CHARACTER
310 RESPONSE$ = "RECEIVE TIMEOUT" :’ IS NOT RECEIVED WITHIN
320 I$ = NAK$: RETURN 290 :’ 3 SECS.

5.3.5.7.2 XTC/2 Program With Checksum
10 ’--XTC/3 RS232 COMMUNICATIONS PROGRAM WITH CHECKSUM USING THE INFICONFORMAT-20 ’
30 ’------THIS PROGRAM IS DESIGNED TO TRANSMIT INDIVIDUAL COMMANDS TO XTC/3
AND ACCEPT THE APPROPRIATE RESPONSE FROM XTC/3, WRITTEN IN GWBASIC 2.32.
40 ’
50 OPEN "COM1:9600,N,8,1,cs,ds" AS #1 :’--OPEN COMM PORT 1
60 STX$ = CHR$(2) : NAK$ = CHR$(21) : ACK$ = CHR$(6) :’--DEFINE ASCII CODES
70 ’
80 INPUT "ENTER COMMAND"; CMD$ :’--ENTER COMMAND TO XTC/3
90 GOSUB 170 :’--GOTO TRANSMIT COMMAND SUBROUTINE
100 IF RESPONSE$ = "RECEIVE TIMEOUT" THEN 140
110 L = LEN(RESPONSE$): L = L-1 :’--STRIP OFF THE ACK OR
120 RESPONSE$ = RIGHT$(RESPONSE$,L) :’ NAK CHARACTER FROM THE
130 ’ :’ RESPONSE STRING.
140 PRINT RESPONSE$ :’--PRINT XTC/3 RESPONSE
150 GOTO 80 :’--LOOP BACK FOR ANOTHER COMMAND.
160 ’
170 ’----TRANSMIT COMMAND AND RECEIVE RESPONSE SUBROUTINE---180 ’
190 ’--BUILD COMMAND MESSAGE STREAM AND SEND TO XTC/3-200 SIZEM$ = CHR$(LEN(CMD$) / 256) :’--CALCULATE THE 2 BYTE
210 SIZEL$ = CHR$(LEN(CMD$) MOD 256) :’ SIZE OF THE COMMAND.
220 ’
230 CHECKSUM = 0 :’--INITIALIZE CHECKSUM TO
240 FOR X = 1 TO LEN(CMD$) :’ ZERO AND CALCULATE A
250 CHECKSUM = CHECKSUM + ASC(MID$(CMD$,X,1)) :’ CHECKSUM ON THE COMMAND
260 NEXT X :’ STRING.
270 CHECKSUM$ = CHR$(CHECKSUM AND 255) :’--USE LOW ORDER BYTE AS CHECKSUM.

5 - 49XTC/3 Operating Manual

280 ’
290 PRINT #1, STX$ + SIZEM$ + SIZEL$ + CMD$ + CHECKSUM$
300 ’
310 ’----RECEIVE RESPONSE MESSAGE FROM XTC/3---320 TOUT = 3: GOSUB 510 :’--SET TIMER AND WAIT FOR
330 IF I$ <> STX$ THEN 290 :’ START OF TRANSMISSION CHARACTER.
340 TOUT = 3: GOSUB 510 :’--RECEIVE HIGH ORDER BYTE
350 SIZE = 256 * ASC(I$) :’ OF TWO BYTE RESPONSE SIZE.
360 TOUT = 3: GOSUB 510 :’--RECEIVE LOW ORDER BYTE
370 SIZE = SIZE + ASC(I$) :’ OF TWO BYTE RESPONSE SIZE.
380 CHECKSUM = 0 :’--SET CHECKSUM TO ZERO390 RESPONSE$ = "" :’ AND NULL THE RESPONSE
400 FOR I = 1 TO SIZE :’ STRING.BUILD THE
410 TOUT = 3: GOSUB 510 :’ RESPONSE STRING AND
420 RESPONSE$ = RESPONSE$ + I$ :’ CALCULATE THE CHECKSUM
430 CHECKSUM = CHECKSUM + ASC(I$) :’ CHARACTER BY CHARACTER.
440 NEXT I
450 TOUT = 3: GOSUB 510 :’--RECIEVE THE CHECKSUM
460 N = ASC(I$) :’ CHARACTER AND COMPARE
470 Z = (CHECKSUM AND 255) :’ IT TO THE LOW ORDER
480 IF N <> Z THEN PRINT "RESPONSE CHECKSUM ERROR" :’ BYTE OF THE CALCULATED
490 RETURN :’ CHECKSUM.
500 ’
510 ’----READ SERIALLY EACH CHARACTER FROM THE INSTRUMENT INTO VARIABLE I$---520 ON TIMER (TOUT) GOSUB 550: TIMER ON
530 IF LOC(1) < 1 THEN 530 ELSE TIMER OFF: I$ = INPUT$(1,#1)
540 RETURN
550 TIMER OFF :’--INDICATE IF A CHARACTER
560 RESPONSE$ ="RECEIVE TIMEOUT": RETURN 570 :’ IS NOT RECEIVED WITHIN
570 RETURN 490 :’ 3 SECS.

5 - 50XTC/3 Operating Manual

Chapter 6
Troubleshooting, Status and Error Messages
6.1 Status and Error Messages
ALREADY RUNNING
This message appears if a START command is given to the layer and thelayer is already in progress.
ALREADY SWITCHING
An attempt is being made to switch a crystal or switch a crucible while acrystal switch or crucible switch is already in progress.
CAN’T EMPTY ACTIVE PROCESS
Can’t delete all layers in the active process.
CAROUSEL OPEN
The crystal carousel assembly has been removed from a Crystal12 sensor.
COMMUNICATION
Unit has gone into STOP because a Stop command was received.
CONTROL DELAY
Indicates that XTC/3 is in the Control Delay state.
CRUCIBLE FAIL
Unit has gone into STOP because of a Crucible Switch error.
CRUCIBLE SW
Indicates a crucible switch is in progress.
CRUCIBLE SW FAIL
This error occurs when a layer has been in the Crucible Switch state forgreater than 30 sec. without receiving a Cruc Valid feedback input signal.
CRYSTAL FAIL
Unit is unable to detect a resonance or a crystal has exceeded its allowed
S or Q thresholds.
CRYSTAL SWITCH
Crystal switching is in progress.
CRYSTAL SW FAIL
Crystal switching failed to complete.
DELAY FAILURE
Indicates that XTC/3 was unable to achieve rate control during the
Shutter Delay state.
DELAYED START
Start will be executed after XTC/3 completes internal processing.

6-1

XTC/3 Operating Manual

DIGITAL INPUT
Unit has gone into STOP because the designated Stop Input was activated.
EMPTY PROCESS
Indicates that the selected process has no layers and therefore cannot
be selected to run.
END OF PROCESS
Indicates that the last layer in the process has reached the Idle state.
ETCH MODE
Indicates that XTC/3 is in the etch mode.
ETHERNET IN USE
Ethernet values cannot be changed at this time.
ETHERNET VALUES HAVE CHANGED
Changes take effect on power up.
FRONT PANEL
Indicates that XTC/3 was stopped by pressing STOP on the front panel.
HANDCONTROL
Indicates that XTC/3 was stopped by pressing STOP on the
Handheld Controller.
INCORRECT TIME
Incorrect value was entered.
INPUT INCORRECT
Incorrect lock code was entered to unlock the unit.
INVALID MASK
Gateway mask value is Incorrect.
L LOCK
Indicates XTC/3 is in a Local Program Lock mode. This prohibits any
parameter from being entered from the front panel until the Program Lock
Code is entered.
LAYER INSERT
Appears in Process List to indicate that Layer Insert was successful.
MAX POWER
Indicates the specified maximum power has been reached. The power value
will be displayed in red.
NO BACKUP CRYSTAL
An attempt is being made to start a layer and there are no good crystals
remaining in the sensor head. This message will appear unless ’Start without
Backup’ is enabled.
NO GOOD XTAL TO SW
There are no good crystals available to switch to.

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XTC/3 Operating Manual

NO MANUAL XTAL FAIL
Unable to enter Manual operation.
NO MANUAL IN STOP
Unable to enter Manual operation.
NO MANUAL IN IDLE
Unable to enter Manual operation.
NO OUTPUT FOR SW
A rotate or switch crystal head function cannot be performed if no output has
been set for the function.
NO SWITCH SINGLE
A crystal switch function cannot be done on a single sensor.
NON-DEP HOLD
Indicates the Non-Dep Hold input is set and will maintain the layer in the
non-deposit hold state if the layer is not already in Deposit or Shutter Delay.
NOT RELAY OUTPUT
This message appears when attempting to set a TTL output on the
Relay screen.
NOT TTL OUTPUT
This message appears when attempting to set a Relay output on
the TTL screen.
ONE SEL PROC ONLYThis message appears when attempting to set more than one Select Process
input event.
ONE WIRE READ FAIL
(Diagnostic Page) Contact INFICON.
PARAMETER DEFAULT
Indicates XTC/3 parameters have been set to their default values. Any
previously programmed values will have been changed to the default values.
POWER LOSS
Indicates XTC/3 lost line power immediately prior to the current
power on cycle.
PROCESS RUNNING
Message appears if trying to enter the Diagnostics mode while a process
is running.
PROCESS VAR DEFAULT
Indicates XTC/3 process variables have been set to their default values. Any
previous process variables will have been changed to the default values.

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XTC/3 Operating Manual

R LOCK
Indicates XTC/3 is in a Remote Program Lock mode. This prohibits any
parameter from being entered from the front panel until the lock is released
via remote communications.
RATE DEV ERR
Indicates XTC/3 entered the Stop mode because rate control was notachieved within 60 seconds.
RATEWATCH DELAY
The RateWatcher feature is active. The sensor is stabilizing for 5 seconds
before SAMPLE. The previous sample period’s Average Rate is being
integrated for thickness. The previous sample period’s Average Power isbeing held constant.
RATEWATCH HOLDThe RateWatcher feature is active. The sensor shutter is closed. The
previous sample period’s Average Rate is being integrated for thickness.
The previous sample period’s Average Power is being held constant.
RATEWATCH SAMPLEThe RateWatcher feature is active. The sensor shutter is open. The source
rate is being measured and it’s power controlled.
RS-232 FAILED
Indicates the self test with the loop back connector failed. Indicates a
hardware defect either in XTC/3 or the loop-back connector.
RS-232 PASSED
Indicates the self test with the loop back connector passed.
SHUTTER DELAY
The layer is in the Stop state because rate control was not achieved within
60 seconds while in the Shutter Delay state.
SOAK HOLD
The current source has paused execution and will maintain the current power
level until the hold is turned off.
START INHIBITED
The Start command was not processed because the Start Inhibit input is set.
STOP
The layer is in the STOP state. There will always be another message on thescreen at the same time to indicate the cause of the Stop.
SWITCHER FAIL
Indicates defect in multi-position sensor.
TEST
Indicates XTC/3 is in TEST mode.

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XTC/3 Operating Manual

TESTING XIUXIU test in progress.
TIME POWER
Indicates XTC/3 entered the Time Power mode due to a crystal failure of thelast good crystal and Time Power was set to Yes.
TRANSFER DELAY
Indicates XTC/3 is in the transition from the pre-deposit sensor to the deposit
sensor.
VALUE TOO LOWParameter entry is out of range. Allowable values will vary according to yourunit configuration or the parameter being defined. Press CLEAR to delete thevalue and enter again.
VALUE TOO HIGH
Parameter entry is out of range. Allowable values will vary according to yourunit configuration or the parameter being defined. Press CLEAR to delete thevalue and enter again.
XIU NOT ATTACHED(Diagnostics Page) XIU and XIU cable are not attached for the specificsensor channel.
XIU TEST FAILED
The Crystal Interface Unit (XIU) has failed the XIU test.
XIU TEST PASSEDThe Crystal Interface Unit (XIU) has passed the XIU test.

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XTC/3 Operating Manual

6.2 XTC/3 Diagnostics
The initial page shows the revision level of the firmware as well as serial numbers.
Figure 6-1 Diagnostics display

Pressing Enter permits various test and maintenance functions.
Figure 6-2 Diagnostics Test/Maintenance display

6-6

XTC/3 Operating Manual

Output Set or Clear
To verify operation of outputs, cursor to the desired output and press the TOGL
key. The output state and the set/clear display will change accordingly.
Only active outputs, like Source 1 Shutter, Source 2 Shutter, Sensor 1
Shutter and Sensor 2 Shutter in the Figure 6-2 example above, can be
toggled. The cursor will skip over greyed out, indicating they are inactive,
outputs like Advance Crucible 1 and Advance Crucible 2 in the Figure 6-2
example above.
Active XIU Test
To initiate the XIU Self Test, disconnect the XIU BNC cable at the sensor
feedthrough, move the cursor onto the item and press the TOGL key. The XIU
Self Test determines whether the Crystal Interface Unit (XIU), interconnect
cable and Measurement circuit for the active sensor are operating properly.
NOTE: The XIU (PN 780-600-GX) must have the 15 cm (6 in.) BNC cable (PN
755-257-G6) attached and must be disconnected from the sensor
feedthrough. The XIU Self Test is not compatible with a 50 cm (20 in.)
BNC cable.
RS-232 Loopback
To initiate the RS-232C COMM PORT self test, install the Loop Back connector,
move the cursor onto the item and press the TOGL key. Upon completion of thetest, the unit will display a message indicating the test was successful and theCOMM PORT is okay; or the test failed and the COMM PORT is bad.
NOTE: The RS-232C Loop Back connector, PN 760-406-P1 must be installedon XTC/3 RS-232C port for the self-test to work properly.

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XTC/3 Operating Manual

6.3 Troubleshooting Guide
If XTC/3 fails to work, or appears to have diminished performance, the following
Symptom/Cause/Remedy chart may be helpful.

CAUTION
There are no user serviceable components within the
XTC/3 case.

WARNING - Risk Of Electric ShockPotentially lethal voltages are present when the line cord,
Inputs or Outputs are connected.

CAUTION
Refer all maintenance to technically qualified personnel.

CAUTION
XTC/3 contains delicate circuitry which is susceptible
to transients. Disconnect the line cord whenever making
any interface connections. Refer all maintenance toqualified personnel.

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XTC/3 Operating Manual

6.3.1 Troubleshooting XTC/3
Table 6-1 Troubleshooting XTC/3

SYMPTOM
1. power on LED not
illuminatedCAUSE
a. blown fuse/circuit
breaker tripped

REMEDYa.have qualified personnel replacefuse/reset circuit breakerb. electrical cord unplugged b. reconnect power cordfrom wall or back of XTC/3
c. incorrect line voltage
2. XTC/3 "locks" upa. cover or back panels not a. ensure all covers and panels areattached to XTC/3
in place and securely fastenedb. high electrical noise
environmentb. reroute cables to reduce noise
pickup (1 ft away from high power
conducting lines makes a sizable
reduction in the amount of noise
entering XTC/3), keep all groundwires short with large surface area
to minimize ground impedancec. poor grounds or poor
grounding practicec. verify proper earth ground, useappropriate ground strap, eliminate
ground loops by establishing thecorrect system grounding, verify
proper XTC/3 grounding

a. faulty static RAM

a. SRAM battery has a normal life
expectancy of ten years. If your
XTC/3 has an SRAM problem
contact INFICON

b. power supply problem

b. contact INFICON

c. dead batteryc. contact INFICON

4. some keys on front
panel function whileothers do nota. faulty keypad or faulty
keypad ribbon cablea. contact INFICON

5. all keys on the front
panel fail to function

a. XTC/3 is "locked" upa. turn power to OFF or to STBY,
then to ON, see item 2 above

3. XTC/3 does notretain parameters on
power down (loss ofparameters on power
up)

6-9

c. have qualified personnel verify
line voltage

XTC/3 Operating Manual

Table 6-1 Troubleshooting XTC/3 (continued)

SYMPTOM
6. control voltage
output does not
function properly

CAUSE
a. XTC/3 damaged fromapplying voltage to thecontrol voltage output

REMEDYa. ensure cable connection to theSource output does not have apotential across the contacts,
contact INFICON

b. reversed polarity ofb. verify Source output polarity andcontrol voltage relative to the required input polarity of thethat accepted by the source source power supply, refer to thepower supply
instruction manual to reconfigure
XTC/3 if necessary

7. LCD display blank

8. poor rate control

c. improper control cablefabricationc.check for correct cable wiringin the appropriate section of themanuala. LCD or CRT/power
supply problem

a. contact INFICON

b. LCD Dimmer Time has
elapsed.

b. press the cursor key to redraw
the screen.

a. control loop parameters a. refer to the instruction manual
improperly selected
section on tuning control loop
parameters
b. electron beam sweep
frequency "beating" with
XTC/3 measurement
frequency

9. power-on LED
blinking

b. adjust the sweep frequency so it
is not a multiple of XTC/3
measurement frequency (4 Hz)

a. internal hardware defect a. contact INFICON

6 - 10XTC/3 Operating Manual

Table 6-1 Troubleshooting XTC/3 (continued)

SYMPTOM

CAUSE

10. crystal fail message a. XIU/oscillator not
is always onconnected

REMEDYa. verify proper sensor/oscillator
connections

b. XIU oscillator
malfunctioning

b. if available, insert a known
working XIU/oscillator in place ofsuspect one; if XIU/oscillator isconfirmed bad, contact INFICON

c. defective cable fromfeedthrough to
XIU/oscillator or from
XTC/3 to XIU/oscillator

c. use an ohm meter or DVM tocheck electrical continuity or
isolation as appropriate

d. poor electrical contact in d. use an ohm meter or DVM tothe transducer,
check electrical continuity or
feedthroughs, or in-vacuum isolation as appropriate
cable
e. failed crystal/no crystal

e. replace crystal/insert crystal

f. two crystals placed into
the crystal holder

f. remove one of the crystals

g. frequency of crystal out of g. verify that the crystal frequency is
range
within the required range, use
INFICON crystals.
h. Xtal failed due to S or Q h. clear S & Q values on
failure.
Sensor page

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XTC/3 Operating Manual

6.3.2 Troubleshooting Transducers/Sensors
Many sensor head problems may be diagnosed with a DVM (Digital Volt Meter).
Disconnect the short oscillator cable from the feedthrough and measure theresistance from the feedthrough’s center pin to ground. If the reading is less than
1-2 MΩ, the source of the leakage should be found and corrected. Likewise, withthe vacuum system open check for center conductor continuity, a reading of morethan 1 Ω from the feedthrough to the transducer contact indicates a problem.
Cleaning contacts or replacing the in-vacuum cable may be required.
A more thorough diagnosis may be performed with the optional Crystal Sensor
Emulator, PN 760-601-G2. See section 6.5 on page 6-25 for a discussion of its use
and diagnostic capabilities.
6.3.2.1 Verifying Crystal Switching and Rotation
The Sensor Information screen allows checking active sensor function from XTC/3
front panel. Refer to section 3.3.8, Sensor Information Display, on page 3-13.
6.3.2.2 Verifying Sensor Shutter Operation
To exercise the shutter on a Crystal Two, use the Switch Crystal function as
described under section 3.3.8. To exercise the shutter on a shuttered sensor,(Standard, Compact, Sputtering, CrystalSix, Crystal12, Rotary or UHV Bakeable
sensor with shutter), use the Diagnostics screen Toggle Shutter function for theappropriate sensor per Figure 6-2 on page 6-6 above.
NOTE: A more detailed troubleshooting guide is shipped with the sensor.
Refer to the sensor operating manual.

6 - 12

XTC/3 Operating Manual.

Table 6-2 Troubleshooting transducers/sensors

SYMPTOM

CAUSE

1. large jumps of thickness a. mode hopping due toreading during deposition defective crystal

REMEDYa. replace crystal

b. stress causes film to peel b. replace crystal
from crystal surfacec. particulate or "spatter"c. thermally condition thefrom molten source striking source thoroughly before
crystaldeposition, use a shutter toprotect the crystal during
source conditioningd. scratches or foreign
particles on the crystal
holder seating surface(improper crystal seating)d. clean and polish the
crystal seating surface on
the crystal holder

e. small pieces of material
fell on crystal (for crystal
facing up sputteringsituation)e. check the crystal surface
and blow it off with clean air

f. small pieces of magnetic
material being attracted by
the sensor magnet andcontacting the crystal(sputtering sensor head)f. check the sensor cover's
aperture and remove any
foreign material that may be
restricting full crystal
coveragea. thermally condition the
2. crystal ceases to oscillate a. crystal struck byduring deposition before it particulate or "spatter" from source thoroughly before
deposition, use a shutter tomolten source
reaches its "normal" life
protect the crystal during
source conditioningb. material on crystal holder b. clean crystal holder
partially masking crystal
cover aperture

6 - 13c. existence of electricalshort or open conditionc.using an ohm meteror DVM, check for electricalcontinuity in the sensor
cable, connector, contact
springs, connecting wire
inside sensor, andfeedthroughsd. check for thermallyinduced electrical short oropen conditiond. see C above

XTC/3 Operating Manual

Table 6-2 Troubleshooting transducers/sensors (continued)

SYMPTOMCAUSE

REMEDYNOTE: Crystal life is highly dependent on process conditions of rate, power radiatedfrom source, location, material, and residual gas composition.
3. crystal does not oscillate a. intermittent or poora. use an ohm meter oror oscillates intermittently electrical contact (contacts DVM to check electrical(both in vacuum and in air) oxidized)
continuity, clean contacts
b. leaf springs have lostb. bend leaves toretentivity (ceramic retainer, approximately 45°
center insulator)
c. RF interference fromsputtering power supply

c. verify earth ground, useground strap adequate for
RF ground, change locationof XTC/3 and oscillator
cabling away from RF
power lines, connect XTC/3
to a different power line

d. cables/oscillator not
d. verify proper
connected, or connected to connections, and inputs
wrong sensor input
relative to programmed
sensor parameter
4. crystal oscillates ina. crystal was near the end a. replace crystal
vacuum but stops
of its life; opening to air
oscillation after open to air causes film oxidation which
increases film stressb. excessive moistureb. turn off cooling water toaccumulates on the crystal sensor prior to venting, flow
warm water through sensor
while chamber is open

6 - 14

XTC/3 Operating Manual

Table 6-2 Troubleshooting transducers/sensors (continued)

SYMPTOM
5. thermal instability: largechanges in thickness
reading during source
warm-up (usually causes
thickness reading todecrease) and after thetermination of deposition(usually causes thickness
reading to increase)

CAUSE

REMEDYa. inadequate coolingwater/cooling watertemperature too higha. check cooling water flow
rate, be certain that coolingwater temperature is lessthan 30°C; refer toappropriate sensor manualb. excessive heat input tothe crystal

b. if heat is due to radiationfrom the evaporation
source, move sensor
further away from source
and use sputtering crystals
for better thermal stability;
install radiation shieldc. crystal not seatedproperly in holder

c. clean or polish the crystal
seating surface on the
crystal holder

d. crystal heating caused by d. use a sputteringhigh energy electron flux
sensor head
(often found in RF
sputtering)6 - 15e. poor thermal transferfrom water tube to body(CrystalSix or Crystal12
sensor)e. use a new water tube
whenever the clamping
assembly has been
removed from the body; if a
new water tube is notavailable, use a single layerof aluminum foil between
the cooling tube and sensor
body, if your process allows

f. poor thermal transfer(Bakeable)

f. use Al or Au foil washer
between crystal holder andsensor body

XTC/3 Operating Manual

Table 6-2 Troubleshooting transducers/sensors (continued)

SYMPTOM
6. poor thickness
reproducibility

CAUSE
a. variable source flux
distribution

REMEDYa. move sensor to a more
central location to reliably
sample evaporant, ensure
constant relative poolheight of melt, avoid
tunneling into the meltb. sweep, dither, or position b. maintain consistentwhere the electron beamsource distribution by
strikes the melt has been maintaining consistentchanged since the last
sweep frequencies, sweep
deposition
amplitude and electron
beam position settingsc. material does not adhere c. make certain the crystal
to the crystal
surface is clean; avoid
touching crystal with
fingers, make use of anintermediate adhesion layer

7. large drift in thickness(greater than 200 A for adensity of 5.00 g/cc) aftertermination of sputteringd. cyclic change in rate

d. make certain source's
sweep frequency is not"beating" with XTC/3
measurement frequency

a. crystal heating due topoor thermal contact

a. clean or polish the crystal
seating surface on the
crystal holder

b. external magnetic field b. rotate sensor magnet tointerfering with the sensor's proper orientation withmagnetic field (sputtering external magnetic field,
refer to the sputtering
sensor)sensor manual (CDPN 074-5000)
c. sensor magnet cracked
or demagnetized(sputtering sensor)

c. check sensor magnetic
field strength, the maximum
field at the center of theaperture should be 700
gauss or greater

6 - 16

XTC/3 Operating Manual

Table 6-2 Troubleshooting transducers/sensors (continued)

SYMPTOMCAUSE

REMEDY

8. CrystalSix and Crystal12: a. loss of pneumatic supply, a. ensure air supply is
crystal switch problem
or pressure is insufficientregulated at 80-90 PSIG
(does not advance or not
for proper operation
centered in aperture)b. operation has beenb. clean material
impaired as a result of
accumulation as needed,material accumulation on refer to either the CrystalSix
cover
manual PN 074-155 or
Crystal12 manual
PN 074-398 on CD
PN 074-5000 for
maintenance

9. Crystal12: Carousel
Open and Xtal Failmessages remain after
installing carouselc. improper alignmentc. realign as per instructions
in either the CrystalSix
manual PN 074-155 or
Crystal12 manual
PN 074-398 on CD
PN 074-5000

d. 0.0225 in. diameterorifice not installed on the
supply side of solenoid
valve assembly.

d. install orifice as shown ineither the CrystalSix
manual PN 074-155 or
Crystal12 manual
PN 074-398 on CD
PN 074-5000

a. open circuit

a. initiate a Crystal Switch
or Rotate Head function

10. Crystal12: Unit indexes a. loss of electrical signal
twelve times and displays
Xtal Switch Error, Xtal Fail,b. resistor #1 is open
and Carousel Openmessagec. no carousel installed

a. check for electricalcontinuity and isolationb. check for electricalcontinuity and isolationc. install carouseld. torsion spring of electrical d. replace electricalconnection assembly —connection assemblyrefer to Crystal12 manual
brokenPN 074-398 on CD
PN 074-5000

6 - 17

XTC/3 Operating Manual

6.3.3 Troubleshooting Computer Communications
Table 6-3 Troubleshooting computer communications

SYMPTOM

CAUSE

1. communications cannot a. improper cablebe established between the connection
host computer and XTC/3

REMEDYa. verify for correct cablewiring as described in
the manualb. BAUD rate in hostcomputer not the same as
XTC/3

b. verify BAUD rate in the
host's applications
program, verify BAUD ratein XTC/3

c. incompatible protocols
being usedc. verify that XTC/3
protocol: RS232, TCP/IP,
matches hostd. incorrect device address d. verify device address in(TCP/IP)host's applications programand verify XTC/3 address
2. ’Standard’ protocol:
Error code returned in
Packet Error byte or
Response Error byte

a. various

a. Refer to section 5.2.1.2
on page 5-8

3. ’XTC/2’ protocol:
Error code returned

a. various

a. Refer to section 5.3.4 on
page 5-38

6.3.3.1 TCP/IP Module LED Diagnostics
Table 6-4 TCP/IP module LEDs

LED

Description

Green(Top left)

Serial port activity: Off - serial port is idle;
On - serial data is transmitted or received

Green(Top right)

Network link status: Off - no link has been detected;
On - a link has been detected

Red
Diagnostics: Blinking 1-1-1 - starting the operating(Bottom left) system;
Blinking 1-5-1 - configuration has been returned to factory
default; contact INFICON Service if other blinking patterns
occur;On - normal operation
Yellow
Blinking - network data is transmitted or received(Bottom right)

6 - 18

XTC/3 Operating Manual

6.4 Replacing the Crystal
The procedure for replacing the crystal is basically the same with all transducers,
except the Cool Drawer, RSH-600, CrystalSix and Crystal12.

CAUTION
Always use clean nylon lab gloves and plastic tweezers
for handling the crystal (to avoid contamination which
may lead to poor adhesion of the film to the electrode).
Do not rotate the ceramic retainer assembly after it isseated (as this will scratch the crystal electrode andcause poor contact).
Do not use excessive force when handling the ceramic
retainer assembly since breakage may occur.
NOTE: Certain materials, especially dielectrics, may not adhere strongly to the
crystal surface and may cause erratic readings.
NOTE: Thick deposits of some materials, such as SiO, Si, and Ni will normallypeel off the crystal when it is exposed to air, as a result of changes infilm stress caused by gas absorption. When you observe peeling, replace
the crystals.

6.4.1 Front Load Single Sensors
Follow the procedure below to replace the crystal in the Front Load Single sensor(see Figure 6-3):

1 Gripping the crystal holder with your fingers, pull it straight out of
the sensor body.

2 Gently pry the crystal retainer from the holder (or use the Crystal Snatcher;see Figure 6-8 on page 6-24).

3 Turn the retainer over and the crystal will drop out.
4 Install a new crystal, with the patterned electrode face up.
5 Push the retainer back into the holder and replace the holder inthe sensor body.

6 - 19XTC/3 Operating Manual

Figure 6-3 Front load single sensor (exploded)Standard Crystal Holder(PN 750-172-G1)

Crystal (PN 008-010-G10)
Fully Coated Face (Gold)
Crystal Retainer(PN 007-023)
Finger Spring Contact(PN 750-171-P1)

Standard Crystal Sensor
Body (PN 750-207-G1)

In-Vacuum
Cable to XIU

Water Tubes

6.4.2 Shuttered Front Load Single and Front Load Dual Sensors
There is no difference in the crystal replacement procedure between shuttered andnon-shuttered Front Load Single sensors, since the shutter pivots away from thecrystal opening when the shutter is in the relaxed state.

6.4.3 Cool Drawer Sensor
Follow the procedure below to replace the crystal in a Next Generation Cool
Drawer™ sensor:

1 Using your thumb and index fingers, gently squeeze the sides of the retainer
at the mid section then lift it up, away from the drawer.
See Figure 6-4 on page 6-21.

6 - 20XTC/3 Operating Manual

2 Hold the drawer by the handle and turn it upside down to remove
the spent crystal.

3 Install a new crystal in the drawer. Observe its orientation. The patternelectrode should face upward as shown in Figure 6-5.

4 Hold the retainer by its sides. Align its orientation notch with the drawer thengently and evenly push the retainer down until it snaps firmly into the drawer.
see Figure 6-5. Never push down (or pull up) on the contact spring, doing so
may permanently damage it.
Inspect the whole assembly. The retainer should be even and engage the drawer
at all four corners.
Figure 6-4 Cool drawer - removing the crystal

Figure 6-5 Cool drawer - replacing the crystal

6 - 21

XTC/3 Operating Manual

6.4.4 Bakeable Sensor
For the Bakeable sensor, the procedure is the same as the Front Load Single
sensor except that the cam assembly must be unlocked by flipping it up. Once thecrystal has been replaced, place a flat edge of the holder flush with the cammechanism and lock it in place with the cam. See Figure 6-6.
Figure 6-6 Bakeable crystal sensor

Crystal Holder &Retainer Spring
PN 007-154

Crystal PN 008-010-G10
Fully Coated Face (Gold)

Crystal Retainer PN 007-064

Clamping Spring PN 007-094

Contact
PN 007-099
Spreader Bar
PN 007-267-P2

Insulator
PN 007-103

Shoulder Washer
PN 007-268-P1
Two Required
Shoulder Washer
PN 007-269-P1
Cam Mechanism
PN 007-168
Cover
PN 007-101

6 - 22

XTC/3 Operating Manual

6.4.5 Sputtering Sensor
Observe the general precautions for replacing crystals and follow the instructions
below to replace the crystal in a sputtering sensor.

1 Grip the body assembly with your fingers and pull it straight out to separate itfrom the water-cooled front part. (You may have to disconnect the sensor cablein order to separate the parts.) See Figure 6-7.

2 Pull the crystal holder straight out from the front of the sensor.
3 Remove the ceramic retainer from the crystal holder by pulling it straight out
with the crystal snatcher (see section 6.4.6 on page 6-24).

4 Turn the crystal holder over so that the crystal drops out.
5 Install a new crystal into the crystal holder with the patterned electrode facing
the back and contacting the leaf springs on the ceramic retainer. (Use only
special crystals for sputtering, PN 008-009-G10.)

6 Put the ceramic retainer back into the crystal holder and put the holder into thefront cover of the sensor.

7 Align the position of the back part so that the connector matches with the notchon the front of the sensor. Snap the two parts together. Reconnect the sensor
cable if it has been disconnected.
Figure 6-7 Sputtering crystal sensor
Body Assembly
PN 750-619-G1
In-vacuum Cable
Assembly (30.75 in. [781 mm])
PN 007-044
Ceramic Retainer
PN 007-023
Crystal
PN 008-009-G10(Silver)
Crystal Holder
PN 007-049

Sensor
Front Cover
PN 007-047

6 - 23

XTC/3 Operating Manual

6.4.6 Crystal Snatcher
Use the crystal snatcher, supplied with the sensor (excluding Cool Drawer
sensors), as follows:

1 Insert crystal snatcher into ceramic retainer (1) and apply a small amount ofpressure. This locks the retainer to the snatcher and allows the retainer to bepulled straight out (2).

2 Reinsert the retainer into the holder after the crystal has been replaced.
3 Release the crystal snatcher with a slight side-to-side motion.
Figure 6-8 Use of the crystal snatcher

6.4.7 CrystalSix
Refer to the CrystalSix Operating Manual (PN 074-155 on CD PN 074-5000-G1)
for specific instructions for this device.

6.4.8 Crystal12
Refer to the Crystal12 Operating Manual (PN 074-398 on CD PN 074-5000-G1)
for specific instructions for this device.

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XTC/3 Operating Manual

6.5 Crystal Sensor Emulator PN 760-601-G2
NOTE: 760-601-G2 is fully compatible with all INFICON thin film
deposition controllers.
The Crystal Sensor Emulator option is used in conjunction with the Thin Film
Deposition Controller to rapidly diagnose problems with the Deposition Controller's
measurement system. See Figure 6-9.
Figure 6-9 Crystal sensor emulator
Female
BNC
Connector

SensorCoverConnector

FemaleMicrodot
Connector

The Crystal Sensor Emulator may be attached at various points in themeasurement system, from the oscillator to the sensor head. It provides a known
good monitor crystal with known good electrical connections. Using the emulator
and the controller in a systematic manner provides a fast means of isolating
measurement system, cable, or sensor problems. See Figure 6-10.
Figure 6-10 Crystal sensor emulator attachment points
Sensor Head
B

Thin Film
Controller

A

C

Crystal Interface
Unit (Oscillator)

CAUTION
This product is designed as a diagnostic tool, and is
not intended for use in vacuum. Do not leave the Crystal
Sensor Emulator installed in the vacuum system during
processing.

6 - 25

XTC/3 Operating Manual

6.5.1 Diagnostic Procedures
The following diagnostic procedures employ the Crystal Sensor Emulator to
analyze a constant Crystal Fail message. The symptom is a Crystal Fail message
that is displayed by the Deposition Controller even after the monitor crystal has
been replaced with a new “good” monitor crystal.
6.5.1.1 Measurement System Diagnostic Procedure

1 Refer to Figure 6-10 on page 6-25. Remove the 6 in. BNC cable from theFeed-Through at point A.

2 Connect the Crystal Sensor Emulator to the 6 in. BNC cable at Point A.


If the XTAL Fail message disappears after approximately five seconds, themeasurement system is working properly. Re-install the 6 in. BNC cable to
the Feed-Through. Go to section 6.5.1.2.



If the XTAL Fail message remains, continue at step 3.

3 Disconnect the 6 in. BNC cable from the Oscillator and from the Emulator.
4 Visually inspect the 6 in. BNC cable to verify that the center pins are seatedproperly.

5 Use an Ohm meter to verify the electrical connections on the 6 in. BNC cable.


There must be continuity (<0.2 Ω) between the center pins.



There must be isolation (>10 MΩ) between the center pins and theconnector shield.

There must be continuity between the connector shields.

Replace the 6 in. BNC cable if it is found to be defective and repeat Step 2 ofthis procedure.

6 If the 6 in. BNC cable is not defective, re-connect the 6 in. cable to the oscillator
and to the Crystal Sensor Emulator. If the XTAL Fail message remains, contact
INFICON (refer to section 1.3 on page 1-5).

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XTC/3 Operating Manual

6.5.1.2 Feed-Through Or In-Vacuum Cable
Diagnostic Procedure

1 Refer to Figure 6-10 on page 6-25. Remove the In-Vacuum cable from theSensor Head at point B.

2 Connect the Crystal Sensor Emulator to the In-Vacuum cable.


If the XTAL Fail message disappears after approximately five seconds, theFeed-Through and In-Vacuum Cable are working properly. Re-install the
In-Vacuum cable to the Sensor Head. Go to section 6.5.1.3 on page 6-28.



If the XTAL Fail message remains, continue at step 3.

3 Disconnect the In-Vacuum cable from the Feed-Through and the Emulator.
Disconnect the 6 in. BNC cable from the Feed-Through.

4 Using an Ohm Meter, verify electrical continuity from the BNC center pin on the
Feed-Through to the Microdot center pin on the Feed-Through. A typical value
would be less than 0.2 Ω.

5 Verify electrical isolation of the center pin on the Feed-Through from theelectrical ground (Feed-Through body). A typical value would be in excess of
10 MΩ.
If the Feed-Through is found to be defective, replace the Feed-Through, re-attach
the BNC and In-Vacuum cables, and repeat this procedure starting at Step 2,otherwise continue at step 6.

6 Verify electrical continuity from center pin to center pin on the In-Vacuum cable.
7 Verify that the center pin of the In-Vacuum cable is electrically isolated from the
In-Vacuum cable shield.
If the In-Vacuum cable is found to be defective, replace the In-Vacuum cable.
Re-attach the BNC and In-Vacuum cables, and repeat this procedure starting at
Step 2, otherwise continue at step 8.

8 Connect the In-Vacuum Cable to the Feed-Through.
9 Verify electrical continuity from the center pin on the BNC connector of the
Feed-Through to the center pin on the un-terminated end of the In-Vacuum
cable.

10 Verify electrical isolation from the center pin to electrical ground (Feed-Throughbody).
If the Feed-Through/In-Vacuum cable system is found to be defective, look for
defective electrical contacts at the Feed-Through to In-Vacuum cable connection.
Repair or replace the Feed-Through as necessary. Re-attach the BNC
and In-Vacuum cables and repeat this procedure starting at step 2.
Otherwise, continue at step 11.

6 - 27

XTC/3 Operating Manual

11 Connect the 6 in. BNC cable to the Feed-Through and disconnect it from the
Crystal Interface Unit (or Oscillator)

12 Verify electrical continuity from the center pin of the Microdot connector on
the Feed-Through to the un-terminated end of the 6 in. BNC cable.

13 Verify electrical isolation from the center pin to electrical ground(Feed-Through body).
If the Feed-Through/6 in. BNC cable system is found to be defective, look for
defective contacts at the Feed-Through to BNC cable connection. Repair or
replace the Feed-Through as necessary, re-attach the BNC cable to the XIU and
In-Vacuum cable to the Crystal head and repeat this procedure starting at step 2.
6.5.1.3 Sensor Head Or Monitor Crystal
Diagnostic Procedure

1 Remove the Crystal Cover from the Sensor Head.
2 Refer to Figure 6-10 on page 6-25. Connect the Crystal Sensor Emulator to the
Sensor Head at Point C.


If the XTAL Fail message disappears after approximately five seconds, thethe Sensor Head is operating properly. Re-insert the Crystal Cover into the
Sensor Head and go to section 6.5.1.4 on page 6-29.



If the XTAL Fail message remains, continue at step 3.

3 Disconnect the In-Vacuum cable from the Sensor Head and the Feed-Through.
Remove the Crystal Sensor Emulator from the Sensor Head.

4 Using an Ohm meter, verify the electrical connections on the Sensor Head.


Verify there is electrical continuity from the center pin contact on theMicrodot connector on the Sensor Head to the finger spring contact in
the Sensor Head.



There must be electrical isolation between the center pin of the Microdot
connector and the Sensor Head body.

If the Sensor Head is found to be defective, contact INFICON to have the Sensor
Head repaired. Refer to section 1.3 on page 1-5.

6 - 28

XTC/3 Operating Manual

5 Connect the In-Vacuum Cable to the Sensor Head.


Verify there is continuity (<0.2 Ω) from the finger spring contact in
the Sensor Head to the center pin on the un-terminated end of the
In-Vacuum cable.



Verify there is isolation (>10 MΩ) between the finger spring contact andthe In-Vacuum cable shield.

If the Sensor Head or the In-Vacuum cable system is found to be defective, look for
defective contacts at the In-Vacuum cable to Sensor Head connection, repair or
replace the Sensor Head as necessary. Re-attach the In-Vacuum cable to theFeed-Through and repeat this procedure starting at step 2.

6 Ensure that the leaf springs in the Sensor Head and those in the ceramic
retainer are bent to an angle of approximately 60 degrees.
6.5.1.4 System Diagnostics Pass But
Crystal Fail Message Remains
If the system is operating properly, yet the Crystal Fail message is still displayed,
perform the following tasks.

1 On the ceramic retainer verify that the center rivet is secure. Repair or replace
the ceramic retainer as necessary.

2 Inspect the inside of the Crystal Cover for build-up of material. Clean or replace
the Crystal Cover as necessary.
After verifying the Sensor Head contacts, the Sensor Head/In-Vacuum cableconnection, and the ceramic retainer contacts, re-assemble the system. If the
Crystal Fail message remains, replace the monitor crystal with a good monitor
crystal. Verify that the monitor crystal works properly by inserting it into a known
good measurement system. If you continue to experience problems, contact
INFICON, refer to section 1.3 on page 1-5.

6.5.2 % XTAL Life
The Crystal Sensor Emulator contains a quartz crystal having a fundamental
frequency at 5.5 MHz. With the Crystal Sensor Emulator connected, the % XTALLife display should read approximately 50%.

6 - 29XTC/3 Operating Manual

6.5.3 Sensor Cover Connection
The Crystal Sensor Emulator can be used to verify the measurement system for
INFICON Thin Film Deposition Controllers and Monitors.
However, the Crystal Sensor Emulator's Sensor Cover Connector is compatible
with some sensor heads, and is incompatible with others. This is discussed in thefollowing sections.
6.5.3.1 Compatible Sensor Heads
The Sensor Cover Connection will fit the sensor heads shown in Table 6-5.
Table 6-5 Compatible sensor heads

Sensor HeadPart Number

Front Load Single Sensor Head

SL-XXXXX

Front Load Dual Sensor HeadDL-AEXX

6.5.3.2 Incompatible Sensor Heads
The Sensor Heads for which the Crystal Sensor Emulator's Sensor CoverConnector will not fit are shown in Table 6-6.
Table 6-6 Incompatible sensor heads

Sensor HeadPart Number

Front Load UHV Bakeable Sensor Head

BK-AXX

Cool Drawer Single Sensor Head

CDS-XXXXX

Sputtering Sensor Head

750-618-G1

CrystalSix Sensor Head

750-446-G1

Cool Drawer Dual Sensor Head

CDD-XXXX

Crystal12 Sensor Head

XL12-XXXXXX

RSH-600 Sensor Head

15320X-XX

NOTE: The Crystal Sensor Emulator’s Sensor Cover will not fit the crystal holder
opening of the older style INFICON transducers that have the solderedfinger springs.

6 - 30XTC/3 Operating Manual

6.5.4 Specifications
Dimensions
1.58 in. diameter x 1.79 in.
(40.13 mm diameter x 45.47 mm)
Temperature Range
0 to 50°C
Frequency
PN 760-601-G2: 5.5 MHz ± 1 ppm at room temperature
Materials
304 Stainless Steel, Nylon, Teflon®, brass. Some internal components contain zinc,tin, and lead.

6 - 31

XTC/3 Operating Manual

Chapter 7
Calibration Procedures
7.1 Importance of Density, Tooling and Z-Ratio
The quartz crystal microbalance (QCM) is capable of precisely measuring themass added to the face of the oscillating quartz crystal sensor. XTC/3 knowledgeof the density of this added material (specified in the density parameter in theFilm/Source parameters set up) allows conversion of the mass information into
thickness. In some instances, where highest accuracy is required, it is necessary
to make a density calibration as outlined in section 7.2.
Because the flow of material from a deposition is not uniform, it is necessary to
account for the different amount of material flow onto the sensor compared to thesubstrates. This factor is accounted for in the tooling parameter in the Film/Sensor
Parameters set up. The tooling factor can be experimentally established byfollowing the guidelines in section 7.3.
If the Z-Ratio is not known, it could be determined from the procedure outlined in
section 7.4, estimated as outlined in section 7.5 or set to the default value of 1.0.
The resulting thickness error due to an estimated value will be non-linear andincreases with the total thickness, number of layers of alternate materials and thedifference from the actual Z-Ratio. Generally, if the crystal is replaced before crystal
life reaches 10%, the size of the thickness error will be small enough to be
disregarded in most applications.

7.2 Determining Density
NOTE: The bulk density values retrieved from the Material Library are sufficiently
accurate for most applications.
Follow the steps below to determine density value:

1 Place a substrate (with proper masking for film thickness measurement)
adjacent to the sensor, so that the same thickness will be accumulated on the
crystal and this substrate.

2 Set density to the bulk value of the film material or to an approximate value.
3 Set Z-ratio to 1.000 and tooling to 100%.
4 Place a new crystal in the sensor and make a short deposition(1000-5000 Å), using manual control.

5 After deposition, remove the test substrate and measure the film thickness witheither a multiple beam interferometer or a stylus-type profilometer.

7-1

XTC/3 Operating Manual

6 Determine the new density value with the following equation: Tx 
3
Density  g  cm  = D 1  ------ T m

[1]

where:
D1 = Initial density setting
Tx = Thickness reading on Cygnus
Tm = Measured thickness

7 A quick check of the calculated density may be made by programming XTC/3
with the new density value and observing that the displayed thickness is equal
to the measured thickness, provided that XTC/3's thickness has not been
zeroed between the test deposition and entering the calculated density.
NOTE: Slight adjustment of density may be necessary in order toachieve Tx = Tm.

7.3 Determining Tooling
1 Place a test substrate in the system's substrate holder.
2 Make a short deposition and determine actual thickness.
3 Calculate tooling from the relationship: T m
Tooling (%) = TF i  ------ Tx 

[2]

whereTm = Actual thickness at substrate holder
Tx = Thickness reading on Cygnus
TFi = Initial tooling factor

4 Round off percent tooling to the nearest 0.1%.
5 When entering this new value for tooling into the program, Tm will equal Tx if
calculations are done properly.

NOTE: It is recommended that a minimum of three separate evaporations be
made when calibrating tooling. Variations in source distribution and othersystem factors will contribute to slight thickness variations. An averagevalue tooling factor should be used for final calibration.

7-2

XTC/3 Operating Manual

7.4 Laboratory Determination of Z-Ratio
A list of Z-values for materials commonly used is available in the Material Library.
For other materials, Z can be calculated from the following formula:1--d q q 2

Z =  ------------ df f [3]

5

Z = 9.378  10  d f  f 

1
- --2

[4]

where:
df = density (g/cm3) of deposited film
μf = shear modulus (dynes/cm2) of deposited film
dq = density of quartz (crystal) (2.649 g/cm3)
μq = shear modulus of quartz (crystal) (3.32 x 1011 dynes/cm2)
The densities and shear moduli of many materials can be found in a number ofhandbooks.
Laboratory results indicate that Z-values of materials in thin film form are very close
to the bulk values. However, for high stress producing materials, Z-values of thinfilms are slightly smaller than those of the bulk materials. For applications that
require more precise calibration, the following direct method is suggested:

1 Establish the correct density value as described in section 7.2 on page 7-1.
2 Install a new crystal and record its starting frequency Fco. It will be necessary
to send the S13 command to get this information (refer to Chapter 5, Remote
Communications).

3 Make a deposition on a test substrate such that the percent crystal life display
will read approximately 50%, or near the end of crystal life for the particularmaterial, whichever is smaller.

4 Stop the deposition and record the ending crystal frequency Fc using the S13
command.

5 Remove the test substrate and measure the film thickness with either a multiple
beam interferometer or a stylus-type profilometer.

6 Using the density value from step 1 and the recorded values for Fco and Fc,

adjust the Z-Ratio value in thickness equation [5] to bring the calculated
thickness value into agreement with the actual thickness. If the calculated value

7-3

XTC/3 Operating Manualof thickness is greater than the actual thickness, increase the Z-Ratio value. If
the calculated value of thickness is less than the actual thickness, decrease the
Z-Ratio value.
4

Z q  10   1  F co   1  F c  
T f = -------------------  -------- ATan  zTan  -----------  –  ----- ATan  zTan  ---------  Fc2zp  F co
Fq
Fq 

[5]

where:
Tf = thickness of deposited film (kÅ)
Fco = starting frequency of the sensor crystal (Hz)Fc = Final frequency of the sensor crystal (Hz)Fq = Nominal blank frequency = 6045000 (Hz)z = Z-Ratio of deposited film material
Zq = Specific acoustic impedance of quartz = 8765000 (MKS units)p = density of deposited film (g/cc)

7.5 Estimating Z-Ratio
For multiple layer deposition (for example, two layers), the Z-value used for thesecond layer can be estimated based on the relative thickness of the two layers.
For most applications the following three rules will provide reasonable accuracies:

7-4



If the thickness of layer 1 is large compared to layer 2, use material 1 Z-value
for both layers.



If the thickness of layer 1 is thin compared to layer 2, use material 2 Z-value forboth layers.



If the thickness of both layers is similar, use a value for Z-Ratio which is theweighted average of the two Z values for deposition of layer 2 and subsequent
layers.

XTC/3 Operating Manual

Chapter 8
Measurement and Control Theory
8.1 Basics
The Quartz Crystal deposition monitor, or QCM, utilizes the piezoelectric sensitivityof a quartz monitor crystal to added mass. The QCM uses this mass sensitivity tocontrol the deposition rate and final thickness of a vacuum deposition.
When a voltage is applied across the faces of a properly shaped piezoelectric
crystal, the crystal is distorted and changes shape in proportion to the applied
voltage. At certain discrete frequencies of applied voltage, a condition of very sharp
electro-mechanical resonance is encountered.
When mass is added to the face of a resonating quartz crystal, the frequency ofthese resonances is reduced. This change in frequency is very repeatable and isprecisely understood for specific oscillating modes of quartz. This heuristicallyeasy-to-understand phenomenon is the basis of an indispensable measurement
and process control tool that can easily detect the addition of less than an atomic
layer of an adhered foreign material.
In the late 1950’s it was noted by Sauerbrey1,2 and Lostis3 that the change infrequency, F = Fq-Fc, of a quartz crystal with coated (or composite) and uncoatedfrequencies, Fc and Fq respectively, is related to the change in mass from theadded material, Mf , as follows:MF -------f = ----------Mq
Fq[1]

where Mq is the mass of the uncoated quartz crystal. Simple substitutions
lead to the equation that was used with the first “frequency measurement”
instruments:

K  F 
T f = ---------------df[2]

where the film thickness, Tf, is proportional (through K) to the frequency change,
F, and inversely proportional to the density of the film, df. The constant, K =Natdq/Fq2; where dq (= 2.649 g/cm3) is the density of single crystal quartz and Nat(=166100 Hz cm) is the frequency constant of AT cut quartz. A crystal with astarting frequency of 6.0 MHz will display a reduction of its frequency by 2.27 Hz

1.G. Z. Sauerbrey, Phys. Verhand .8, 193 (1957)
2.G. Z. Sauerbrey, Z. Phys. 155,206 (1959)
3.P. Lostis, Rev. Opt. 38,1 (1959)

8-1

XTC/3 Operating Manual

when 1 angstrom of Aluminum (density of 2.77 g/cm3) is added to its surface. In
this manner the thickness of a rigid adlayer is inferred from the precise
measurement of the crystal’s frequency shift. The quantitative knowledge of thiseffect provides a means of determining how much material is being deposited on asubstrate in a vacuum system, a measurement that was not convenient or practicalprior to this understanding.

8.1.1 Monitor Crystals
No matter how sophisticated the electronics surrounding it, the essential device ofthe deposition monitor is the quartz crystal. The quartz resonator shown in Figure8-1 has a frequency response spectrum that is schematically shown in Figure 8-2.
The ordinate represents the magnitude of response, or current flow of the crystal,at the specified frequency.
Figure 8-1 Quartz resonator

The lowest frequency response is primarily a “thickness shear” mode that is called
the fundamental. The characteristic movement of the thickness shear mode is fordisplacement to take place parallel to the major monitor crystal faces. In otherwords, the faces are displacement antinodes as shown in Figure 8-3.
The responses located slightly higher in frequency are called anharmonics; they
are a combination of the thickness shear and thickness twist modes. The responseat about three times the frequency of the fundamental is called the third
quasiharmonic. There is also a series of anharmonics slightly higher in frequency
associated with the quasiharmonic.
The monitor crystal design depicted in Figure 8-1 is the result of several significant
improvements from the square crystals with fully electroded plane parallel facesthat were first used.
The first improvement was to use circular crystals. This increased symmetry
greatly reduced the number of allowed vibrational modes. The second set of
improvements was to contour one face of the crystal and to reduce the size of theexciting electrode. These improvements have the effect of trapping the acoustic
energy. Reducing the electrode diameter limits the excitation to the central area.

8-2

XTC/3 Operating Manual

Contouring dissipates the energy of the traveling acoustic wave before it
reaches the edge of the crystal. Energy is not reflected back to the center where it
can interfere with other newly launched waves, essentially making a small crystal
appear to behave as though it is infinite in extent. With the crystal’s vibrations
restricted to the center, it is practical to clamp the outer edges of the crystal toa holder and not produce any undesirable effects.
Contouring also reduces the intensity of response of the generally unwanted
anharmonic modes; hence,the potential for an oscillator to sustain an unwanted oscillation is substantiallyreduced.

1
10

6

7

17

18.133 MHz 350 ohm

17.957 MHz 311 ohm

17.792 MHz 278 ohm

6.419 MHz 350 ohm

6.333 MHz 142 ohm
6.337 MHz 105 ohm
6.348 MHz 322 ohm

11000

6.153 MHz 50 ohm
6.194 MHz 40 ohm

1100
5.981 MHz 15 ohm

Log of relative intensity (Admittance)

Figure 8-2 Frequency response spectrum

18

Frequency (in MHz)The use of an adhesion layer has improved the electrode-to-quartz bonding,
reducing “rate spikes” caused by micro-tears between the electrode and thequartz as film stress rises. These micro-tears leave portions of the deposited film
unattached and therefore unable to participate in the oscillation. These free
portions are no longer detected and the wrong thickness consequently inferred.
The “AT” resonator is usually chosen for deposition monitoring because at room
temperature it can be made to exhibit a very small frequency change due totemperature changes. Since there is presently no way to separate the frequencychange caused by added mass (which is negative) or even the frequency changes
caused by temperature gradients across the crystal or film induced stresses, it isessential to minimize these temperature-induced changes. It is only in this way that
small changes in mass can be measured accurately.

8-3

XTC/3 Operating Manual

Figure 8-3 Thickness shear displacement

E

X2

displacement node

X
1
X
3

8.1.2 Period Measurement Technique
Although instruments using equation [2] were very useful, it was soon noted they
had a very limited range of accuracy, typically holding accuracy for F less than
0.02 Fq. In 1961 it was recognized by Behrndt4 that:M Tc – Tq  F 
-------f = ---------------------= ----------Mq
Tq
Fc

[3]

where Tc and Tq are the periods of oscillation of the crystal with film (composite)
and the bare crystal respectively.
The period measurement technique was the outgrowth of two factors; first, thedigital implementation of time measurement, and second, the recognition of themathematically rigorous formulation of the proportionality between the crystal’s
thickness, Iq, and the period of oscillation, Tq = 1/Fq.
Electronically, the period measurement technique uses a second crystal oscillator,
or reference oscillator, not affected by the deposition and usually much higher infrequency than the monitor crystal. This reference oscillator is used to generatesmall precision time intervals which are used to determine the oscillation period of
the monitor crystal. This is done by using two pulse accumulators. The first is used
to accumulate a fixed number of cycles, m, of the monitor crystal. The second isturned on at the same time and accumulates cycles from the reference oscillator
until m counts are accumulated in the first.

4.K. H. Behrndt, J. Vac. Sci. Technol. 8, 622 (1961)

8-4

XTC/3 Operating Manual

Since the frequency of the reference is stable and known, the time to accumulate
the m counts is known to an accuracy equal to ± 2/Fr where Fr is the reference
oscillator’s frequency. The monitor crystal’s period is (n/Fr)/m where n is thenumber of counts in the second accumulator. The precision of the measurement isdetermined by the speed of the reference clock and the length of the gate time
(which is set by the size of m). Increasing one or both of these leads to improved
measurement precision.
Having a high frequency reference oscillator is important for rapid measurements(which require short gating times), low deposition rates and low density materials.
All of these require high time precision to resolve the small, mass induced
frequency shifts between measurements. When the change of a monitor crystal’sfrequency between measurements is small, that is, on the same order of size as
the measurement precision, it is not possible to establish quality rate control. The
uncertainty of the measurement injects more noise into the control loop, which canbe counteracted only by longer time constants. Long time constants cause thecorrection of rate errors to be very slow, resulting in relatively long term deviations
from the desired rate. These deviations may not be important for some simple films,
but can cause unacceptable errors in the production of critical films such as opticalfilters or very thin layered superlattices grown at low rates. In many cases thedesired properties of these films can be lost if the layer to layer reproducibility
exceeds one, or two, percent. Ultimately, the practical stability and frequency of thereference oscillator limits the precision of measurement for conventional
instrumentation.

8.1.3 Z-Match Technique
After learning of fundamental work by Miller and Bolef 5, which rigorously treatedthe resonating quartz and deposited film system as a one-dimensional continuous
acoustic resonator, Lu and Lewis6 developed the simplifying Z-Match™ equationin 1972. Advances in electronics taking place at the same time, namely the
micro-processor, made it practical to solve the Z-Match equation in “real-time”.
Most deposition process controllers sold today use this sophisticated equation thattakes into account the acoustic properties of the resonating quartz and film system
as shown in equation [4].

  Fq – Fc  
N at d q arctan  Z tan ------------------------T f =  ----------------- d F Z


Fq
f c

[4]

where Z=(dquq/dfuf)1/2 is the acoustic impedance ratio and uq and uf are the shear
moduli of the quartz and film, respectively. Finally, there was a fundamental
understanding of the frequency-to-thickness conversion that could yieldtheoretically correct results in a time frame that was practical for process control.

5.J. G. Miller and D. I. Bolef, J. Appl. Phys. 39, 5815, 4589 (1968)
6.C. Lu and O. Lewis, J Appl. Phys. 43, 4385 (1972)

8-5

XTC/3 Operating ManualTo achieve this new level of accuracy requires only that the user enter an additional
material parameter, Z, for the film being deposited. This equation has been tested
for a number of materials, and has been found to be valid for frequency shifts
equivalent to Ff = 0.4Fq. Keep in mind that equation [2] was valid to only 0.02Fq
and equation [3] was valid only to ~0.05Fq.

8.1.4 Active Oscillator
All of the instrumentation developed to date has relied on the use of an active
oscillator circuit, generally the type schematically shown in Figure 8-4. This circuit
actively keeps the crystal in resonance, so that any type of period or frequency
measurement may be made. In this type of circuit, oscillation is sustained as longas the gain provided by the amplifiers is sufficient to offset losses in the crystal andcircuit and the crystal can provide the required phase shift. The basic crystal
oscillator’s stability is derived from the rapid change of phase for a small change inthe crystal’s frequency near the series resonance point, as shown in Figure 8-5.
Figure 8-4 Active oscillator circuit+ V (dc)

A

OUT
Amplifierș

Crystalȕ

The active oscillator circuit is designed so the crystal is required to produce a phaseshift of 0 degrees, which allows it to operate at the series resonance point. Longand short-term frequency stabilities are a property of crystal oscillators becausevery small frequency changes are needed to sustain the phase shift required foroscillation. Frequency stability is provided by the quartz crystal even though there
are long term changes in electrical component values caused by temperature or
aging or short-term noise-induced phase jitter.
As mass is added to a crystal, its electrical characteristics change. Figure 8-6 onpage 8-8 is the same plot as Figure 8-5 overlaid with the response of a heavily
loaded crystal. The crystal has lost the steep slope displayed in Figure 8-5.
Because the phase slope is less steep, any noise in the oscillator circuit translates

8-6

XTC/3 Operating Manual

into a greater frequency shift than that which would be produced with a new crystal.
In the extreme, the basic phase/frequency shape is not preserved and the crystal
is not able to provide a full 90 degrees of phase shift.
The impedance, | Z |, is also noted to rise to an extremely high value. When thishappens it is often more favorable for the oscillator to resonate at one of theanharmonic frequencies. This condition is sometimes short lived, with the oscillator
switching between the fundamental and anharmonic modes, or it may continue tooscillate at the anharmonic. This condition is known as mode hopping and in
addition to annoying rate noise can also lead to false termination of the film
because of the apparent frequency change. It is important to note that the controller
will frequently continue to operate under these conditions; in fact there is no way totell this has happened except that the film’s thickness is suddenly apparently
thinner by an amount equivalent to the frequency difference between thefundamental and the anharmonic that is sustaining the oscillation.
Figure 8-5 Crystal frequency near series resonance point+90

Impedance
0

1CO

Phase (degrees)

Log |Z| (ohms)

Phase

Series resonance
1C-90
5.965500

5.966500

5.967500

5.968500

Frequency (MHz)8.1.5 ModeLock Oscillator
INFICON has created a new technology that eliminates the active oscillator and its
limitations. This new system constantly tests the crystal’s response to an appliedfrequency in order to not only determine the resonant frequency, but also to verify
that the crystal is oscillating in the desired mode. This new system is essentiallyimmune to mode hopping and the resulting inaccuracies. It is fast and accurate,
determining the crystal’s frequency to less than .05 Hz at a rate of 4 times per
second.
Because of the system’s ability to identify and then measure particular crystal
modes, it is now possible to offer new features that take advantage of the additional
informational content of these modes. This new “intelligent” measurement system

8-7

XTC/3 Operating Manual

uses the phase/frequency properties of the quartz crystal to determine theresonant frequency. It operates by applying a synthesized sine wave of specificfrequency to the crystal and measuring the phase difference between the applied
signal’s voltage and the current passing through the crystal. At series resonance,
this phase difference is exactly 0 degrees; that is, the crystal behaves like a pureresistance. By separating the applied voltage and the current returned from thecrystal and monitoring the output of a phase comparator it is possible to establish
whether the applied frequency is higher or lower than the crystal’s resonance point.
At frequencies well below the fundamental, the crystal’s impedance is capacitive
and at frequencies slightly higher than resonance it is inductive in nature. This
information is useful if the resonance frequency of a crystal is unknown. A quick
sweep of frequencies can be undertaken until the output of the phase comparator
changes, marking the resonance event. For AT crystals we know that the lowest
frequency event encountered is the fundamental. The events slightly higher infrequency are anharmonics. This information is useful not only for initialization, butalso for the rare case when the instrument loses track of the fundamental. Oncethe frequency spectrum of the crystal is determined, the instrument’s task is tofollow the changing resonance frequency and to periodically provide ameasurement of the frequency for subsequent conversion to thickness.
Figure 8-6 Heavily loaded crystal

Phase
0

1000

Impedance
100

Phase (degrees)

Log |Z| (ohms)+90

Series resonance-90
4.541500

4.512500

4.543600

4.544500

4.544500

Frequency (MHz)The use of the “intelligent” measurement system has a series of very apparent
advantages when compared to the previous generation of active oscillators,
namely immunity from mode hopping, speed of measurement and precision of
measurement.

8-8

XTC/3 Operating Manual

8.1.6 Control Loop Theory
The instrumental advances in measurement speed, precision and reliability would
not be complete without a means of translating this improved information into
improved process control. For a deposition process, this means keeping thedeposition rate as close as possible to the desired rate. The purpose of a control
loop is to take the information flow from the measurement system and to makepower corrections that are appropriate to the characteristics of the particularevaporation source. When properly operating, the control system translates small
errors in the controlled parameter, or rate, into the appropriate corrections in the
manipulated parameter, power. The controller’s ability to quickly and accurately
measure and then react appropriately to the small changes keeps the process fromdeviating very far from the set point.
The controller model most commonly chosen, for converting error into action iscalled PID. In the PID, P stands for proportional, I stands for integral and D stands
for derivative action. Certain aspects of this model will be examined in detail a little
further on. The responsiveness of an evaporation source can be found byrepetitively observing the system response to a disturbance under a particular setof controller settings. After observing the response, improved controller parameters
are estimated and then tried again until satisfactory control is obtained. Control,when it is finally optimized, essentially matches the parameters of the controller
model to the characteristics of the evaporation source.
Techniques for calculating optimum source control parameters can be classified by
the type of data used for tuning. They fall into basically three categories:

Closed Loop Methods

Open Loop MethodsFrequency Response Methods

Of these categories, the open loop methods are considered superior. They are
considered superior because of the ease with which the necessary experimental
data can be obtained and because of the elimination (to a large extent) of trial anderror when the technique is applied. The important response characteristics are
determined as shown in Figure 8-7.
In general, it is not possible to characterize all processes exactly; someapproximation must be applied. The most common is to assume that the dynamic
characteristics of the process can be represented by a first-order lag plus a deadtime. The Laplace transform for this model (conversion to the s domain) is
approximated as:

K p exp  – L s 
Output------------------ = -----------------------------Input
T1 s + 1[5]

8-9

XTC/3 Operating Manual

Three parameters are determined from the process reaction curve. They are thesteady state gain, Kp, the dead time, L, and the time constant, T1. Several methods
have been proposed to extract the required parameters from the system response
as graphed in Figure 8-7. These are: a one point fit at 63.2% of the transition (onetime constant); a two point exponential fit; and a weighted least-square-exponential
fit. From the above information a process is sufficiently characterized so that acontroller algorithm may be customized.
Figure 8-7 Response of process to an open loop step change(at t=0 control signal is increased)

1.00

Kp

0.632 Kp

Point ofMaximumSlope0t(0.632)

LTime, tT1 = t(0.632) - L
Kp = (Change in Output) / (Change in Control Signal)
A controller model used extensively is the PID type, shown in Laplace form inequation [6].

1M  s  = K c  1 + ------- + T d s Es


Ts

[6]

i

Where


M(s) = manipulated variable or power

Kc = controller gain (the proportional term)Ti = integral time

Td = derivative timeE(s) = process error

Figure 8-8 represents the controller algorithm and a process with first order lag plus
a dead time. The process block implicitly includes the dynamics of the measuring
devices and the final control elements, in our case the evaporator power supply.

8 - 10XTC/3 Operating ManualR(s) represents the rate setpoint. The feedback mechanism is the error generated
by the difference between the measured deposition rate, C(s), and the rate set
point, R(s).
Figure 8-8 PID controller block diagram

Setpoint

Error

Deposition
RateRs +

Es

Cs

S

1
K c  1 + ------- + T d s


Ti s

K p exp  – L s -----------------------------T1 s + 1[Controller][Process]

The key to using any control system is to choose the proper values of Kc, Td and
Ti. Optimum control is a somewhat subjective quantity as noted by the presence ofseveral mathematical definitions as shown below.
The integral of the squared error (ISE) is a commonly proposed criterion of
performance for control systems.
It can be described as:
2

ISE =  e  t dt[7]where error = e = setpoint minus the measured rate. The ISE measure is relatively
insensitive to small errors, but large errors contribute heavily to the value of theintegral. Consequently, using ISE as a criterion of performance will result in
responses with small overshoots but long settling times, since small errors
occurring late in time contribute little to the integral.
The integral of the absolute value of the error (IAE) has been frequently proposed
as a criterion of performance:

IAE =  e  t  dt

[8]This criterion is more sensitive to small errors, but less sensitive to large errors,
than ISE.
Graham and Lathrop7 introduced the integral of time multiplied by the absolute
error (ITAE) as an alternate criterion of performance:

ITAE =  t e  t  dt

[9]

7.Graham, D., and Lanthrop, R.C., “The Synthesis of Optimum Transient Response: Criteria andStandard Forms, Transactions IEEE, vol. 72 pt. II, November 1953.

8 - 11

XTC/3 Operating Manual

ITAE is insensitive to the initial and somewhat unavoidable errors, but it will weightheavily any errors occurring late in time. Optimum responses defined by ITAE willconsequently show short total response times and larger overshoots than witheither of the other criteria. It has been found that this criteria is generally mostuseful for deposition process control.
The most satisfactory performance criterion for deposition controllers is the ITAE.
There will be overshoot, but the response time is quick, and the settling time isshort. For all of the above integral performance criteria, controller tuning relations
have been developed to minimize the associated errors. Using manually enteredor experimentally determined process response coefficients, ideal PID controller
coefficients can be readily calculated for the ITAE criteria as shown below.

K c =  1.36  K p   L  T 1 
T i =  1.19T 1   L  T 1 – 0.947

0.738

T d =  0.381T 1   L  T 1 

0.995

[10]
[11]
[12]

For slow systems, in order to help avoid controller windup (windup is the rapid
increase in control signal before the system has the chance to respond to thechanged signal), the time period between manipulated variable (control voltage)changes is lengthened. This allows the system to respond to the previous controller
setting change, and aggressive controller settings can be used.
A secondary advantage is that immunity to process noise is increased since thedata used for control is now comprised of multiple readings instead of a single ratemeasurement, taking advantage of the mass integrating nature of the quartz
crystal.
With process systems that respond quickly (short time constant) and with little tono measurable dead time, the PID controller often has difficulty with the deposition
process noise (beam sweep, fast thermal shorts of melt to crucible, etc.). In thesesituations a control algorithm used successfully is an integral/reset type ofcontroller. This type of controller will always integrate the error, driving the system
towards zero error. This technique works well when there is little or no dead time.
If this technique is used on a process with measurable lag or dead time, then thecontrol loop will tend to be oscillatory due to the control loop over-compensating
the control signal before the system has a chance to respond.

8 - 12

XTC/3 Operating Manual

Chapter A
Material Table
CAUTION
Some of these materials are toxic. Please consult
the material safety data sheet and safety instructions
before use.
An * is used to indicate that a Z-Ratio has not been established for a certain
material. A value of 1.000 is defaulted in these situations.
Table A-1 Material table

FormulaDensity

Z-Ratio

Material Name

Ag

10.5000.529

silver

AgBr

6.470

1.180

silver bromide

AgCl

5.560

1.320

silver chloride

Al

2.700

1.080

aluminum

Al2O3

3.970

0.336

aluminum oxide

Al4C3

2.360

*1.000aluminum carbide

AIF3

3.070

*1.000aluminum fluoride

AIN

3.260

*1.000aluminum nitride

AlSb

4.360

0.743

aluminum antimonide

As

5.730

0.966

arsenic

As2Se34.750*1.000arsenic selenideAu

19.300

0.381

gold

B

2.370

0.389

boron

B203

1.820

*1.000boron oxide

B4C

2.370

*1.000boron carbide

BN

1.860

*1.000boron nitride

Ba

3.500

2.100

barium

BaF2

4.886

0.793

barium fluoride

BaN2O6

3.244

1.261

barium nitrate

BaO

5.720

*1.000barium oxide

BaTiO3

5.999

0.464

barium titanate (tetr)

BaTiO3

6.035

0.412

barium titanate (cubic)

A-1

XTC/3 Operating Manual

Table A-1 Material table (continued)

A-2

FormulaDensity

Z-Ratio

Material Name

Be

1.850

0.543

beryllium

BeF2

1.990

*1.000beryllium fluoride

BeO

3.010

*1.000beryllium oxide

Bi

9.800

0.790

bismuth

Bi2O3

8.900

*1.000

bismuth oxide

Bi2S3

7.390

*1.000

bismuth trisulfide

Bi2Se36.820*1.000

bismuth selenide

Bi2Te37.700*1.000

bismuth telluride

BiF3

5.320

*1.000

bismuth fluoride

C

2.250

3.260

carbon (graphite)

C

3.520

0.220

carbon (diamond)

C8H8

1.100

*1.000parlyene (union carbide)

Ca

1.550

2.620

calcium

CaF2

3.180

0.775

calcium fluoride

CaO

3.350

*1.000calcium oxide

CaO-SiO2

2.900*1.000calcium silicate (3)

CaSO4

2.962

0.955

calcium sulfate

CaTiO34.100*1.000calcium titanate

CaWO4

6.060

*1.000calcium tungstate

Cd

8.640

0.682

cadmium

CdF2

6.640

*1.000

cadmium fluoride

CdO

8.150

*1.000

cadmium oxide

CdS

4.830

1.020

cadmium sulfide

CdSe

5.810

*1.000

cadmium selenide

CdTe

6.200

0.980

cadmium telluride

Ce

6.780

*1.000cerium

CeF3

6.160

*1.000cerium (III) fluoride

CeO2

7.130

*1.000cerium (IV) dioxide

Co

8.900

0.343

cobalt

CoO

6.440

0.412

cobalt oxide

Cr

7.200

0.305

chromium

Cr2O3

5.210

*1.000chromium (III) oxide

Cr3C2

6.680

*1.000chromium carbide

XTC/3 Operating Manual

Table A-1 Material table (continued)

FormulaDensity

Z-Ratio

Material Name

CrB

6.170

*1.000chromium boride

Cs

1.870

*1.000cesium

Cs2SO4

4.243

1.212

cesium sulfate

CsBr

4.456

1.410

cesium bromide

CsCI

3.988

1.399

cesium chloride

CsI

4.516

1.542

cesium iodide

Cu

8.930

0.437

copper

Cu2O

6.000

*1.000copper oxide

Cu2S

5.600

0.690

copper (I) sulfide (alpha)

Cu2S

5.800

0.670

copper (I) sulfide (beta)

CuS

4.600

0.820

copper (II) sulfide

Dy

8.550

0.600

dysprosium

DY2O3

7.810

*1.000dysprosium oxide

Er

9.050

0.740

erbium

Er2O3

8.640

*1.000erbium oxide

Eu

5.260

*1.000europium

EuF2

6.500

*1.000europium fluoride

Fe

7.860

0.349

iron

Fe2O3

5.240

*1.000iron oxide

FeO

5.700

*1.000iron oxide

FeS

4.840

*1.000iron sulfide

Ga

5.930

0.593

gallium

Ga2O3

5.880

*1.000gallium oxide (B)

GaAs

5.310

1.590

gallium arsenide

GaN

6.100

*1.000gallium nitride

GaP

4.100

*1.000gallium phosphide

GaSb

5.600

*1.000gallium antimonide

Gd

7.890

0.670

gadolinium

Gd2O3

7.410

*1.000gadolinium oxide

Ge

5.350

0.516

germanium

Ge3N2

5.200

*1.000germanium nitride

GeO2

6.240

*1.000germanium oxide

GeTe

6.200

*1.000germanium telluride

A-3

XTC/3 Operating Manual

Table A-1 Material table (continued)

A-4

FormulaDensity

Z-Ratio

Material Name

Hf

13.0900.360

hafnium

HfB2

10.500*1.000hafnium boride

HfC

12.200*1.000hafnium carbide

HfN

13.800*1.000hafnium nitride

HfO2

9.680

*1.000hafnium oxide

HfSi2

7.200

*1.000hafnium silicideHg

13.4600.740

mercury

Ho

8.800

0.580

holmium

Ho2O3

8.410

*1.000holmium oxide

In

7.300

0.841

indium

In2O3

7.180

*1.000

indium sesquioxide

In2Se35.700*1.000

indium selenide

In2Te35.800*1.000

indium telluride

InAs

5.700

*1.000

indium arsenide

InP

4.800

*1.000

indium phosphide

InSb

5.760

0.769

indium antimonide

Ir

22.4000.129

iridiumK

0.860

10.189potassium

KBr

2.750

1.893

potassium bromide

KCI

1.980

2.050

potassium chloride

KF

2.480

*1.000potassium fluoride

KI

3.128

2.077

potassium iodide

La

6.170

0.920

lanthanum

La2O3

6.510

*1.000lanthanum oxide

LaB6

2.610

*1.000lanthanum boride

LaF3

5.940

*1.000lanthanum fluoride

Li

0.530

5.900

lithium

LiBr

3.470

1.230

lithium bromide

LiF

2.638

0.778

lithium fluoride

LiNbO3

4.700

0.463

lithium niobate

Lu

9.840

*1.000lutetium

Mg

1.740

1.610

magnesium

MgAl2O4

3.600*1.000magnesium aluminate

XTC/3 Operating Manual

Table A-1 Material table (continued)

FormulaDensity

Z-Ratio

Material Name

MgAl2O6

8.000*1.000spinel

MgF2

3.180

0.637

magnesium fluoride

MgO

3.580

0.411

magnesium oxide

Mn

7.200

0.377

manganese

MnO

5.390

0.467

manganese oxide

MnS

3.990

0.940

manganese (II) sulfide

Mo

10.2000.257

molybdenum

Mo2C

9.180

*1.000molybdenum carbide

MoB2

7.120

*1.000molybdenum boride

MoO3

4.700

*1.000molybdenum trioxide

MoS2

4.800

*1.000molybdenum disulfide

Na

0.970

4.800

sodiumNa3AIF6

2.900*1.000cryolite

Na5Al3F14

2.900*1.000chiolite

NaBr

3.200

*1.000sodium bromide

NaCl

2.170

1.570

sodium chloride

NaCIO3

2.164

1.565

sodium chlorate

NaF

2.558

0.949

sodium fluoride

NaNO3

2.270

1.194

sodium nitrate

Nb

8.578

0.492

niobium (columbium)

Nb2O3

7.500

*1.000niobium trioxide

Nb2O5

4.470

*1.000niobium (V) oxide

NbB2

6.970

*1.000niobium boride

NbC

7.820

*1.000niobium carbide

NbN

8.400

*1.000niobium nitride

Nd

7.000

*1.000neodymium

Nd2O3

7.240

*1.000neodymium oxide

NdF3

6.506

*1.000neodymium fluoride

Ni

8.910

0.331

nickel

NiCr

8.500

*1.000nichrome

NiCrFe8.500*1.000

Inconel

NiFe

8.700

*1.000permalloy

NiFeMo8.900*1.000supermalloy

A-5

XTC/3 Operating Manual

Table A-1 Material table (continued)

A-6

FormulaDensity

Z-Ratio

Material Name

NiO

7.450

*1.000nickel oxide

P3N5

2.510

*1.000phosphorus nitridePb

11.300

1.130

lead

PbCl2

5.850

*1.000lead chloride

PbF2

8.240

0.661

lead fluoride

PbO

9.530

*1.000lead oxide

PbS

7.500

0.566

lead sulfide

PbSe

8.100

*1.000lead selenide

PbSnO38.100*1.000lead stannate

PbTe

8.160

0.651

lead telluridePd

12.0380.357

palladium

PdO

8.310

*1.000palladium oxide

Po

9.400

*1.000polonium

Pr

6.780

*1.000praseodymium

Pr2O3

6.880

*1.000praseodymium oxidePt21.4000.245

platinum

PtO2

10.200*1.000

platinum oxide

Ra

5.000

*1.000radium

Rb

1.530

2.540

rubidium

RbI

3.550

*1.000rubidium iodide

Re

21.0400.150

rheniumRh

12.4100.210

rhodiumRu

12.362

0.182

ruthenium

S8

2.070

2.290

sulfur

Sb

6.620

0.768

antimony

Sb2O3

5.200

*1.000antimony trioxide

Sb2S3

4.640

*1.000antimony trisulfide

Sc

3.000

0.910

scandium

Sc2O3

3.860

*1.000scandium oxide

Se

4.810

0.864

selenium

Si

2.320

0.712

silicon

Si3N4

3.440

*1.000silicon nitride

SiC

3.220

*1.000silicon carbide

XTC/3 Operating Manual

Table A-1 Material table (continued)

FormulaDensity

Z-Ratio

Material Name

SiO

2.130

0.870

silicon (II) oxide

SiO2

2.648

1.000

silicon dioxide

Sm

7.540

0.890

samarium

Sm2O3

7.430

*1.000samarium oxide

Sn

7.300

0.724

tin

SnO2

6.950

*1.000tin oxide

SnS

5.080

*1.000tin sulfide

SnSe

6.180

*1.000tin selenide

SnTe

6.440

*1.000tin telluride

Sr

2.600

*1.000strontium

SrF2

4.277

0.727

strontium fluoride

SrO

4.990

0.517

strontium oxide

Ta16.6000.262

tantalum

Ta2O5

8.200

0.300

tantalum (V) oxide

TaB2

11.150*1.000tantalum boride

TaC

13.900*1.000tantalum carbide

TaN

16.300*1.000tantalum nitride

Tb

8.270

0.660

terbiumTc

11.500*1.000technetium

Te

6.250

0.900

tellurium

TeO2

5.990

0.862

tellurium oxideTh

11.694

0.484

thorium

ThF4

6.320

*1.000thorium (IV) fluoride

ThO2

9.860

0.284

thorium dioxide

ThOF2

9.100

*1.000thorium oxyfluoride

Ti

4.500

0.628

titanium

Ti203

4.600

*1.000titanium sesquioxide

TiB2

4.500

*1.000titanium boride

TiC

4.930

*1.000titanium carbide

TiN

5.430

*1.000titanium nitride

TiO

4.900

*1.000titanium oxide

TiO2

4.260

0.400

titanium (IV) oxide

TI

11.8501.550

thallium

A-7

XTC/3 Operating Manual

Table A-1 Material table (continued)

A-8

FormulaDensity

Z-Ratio

Material Name

TIBr

7.560

*1.000thallium bromide

TICI

7.000

*1.000thallium chloride

TII

7.090

*1.000thallium iodide (B)U

19.0500.238

uranium

U3O8

8.300

*1.000

tri uranium octoxide

U4O9

10.9690.348

uranium oxide

UO2

10.970

0.286

uranium dioxide

V

5.960

0.530

vanadium

V2O5

3.360

*1.000

vanadium pentoxide

VB2

5.100

*1.000

vanadium boride

VC

5.770

*1.000

vanadium carbide

VN

6.130

*1.000

vanadium nitride

VO2

4.340

*1.000

vanadium dioxide

W19.3000.163

tungsten

WB2

10.770*1.000tungsten borideWC

15.6000.151

tungsten carbide

WO3

7.160

*1.000tungsten trioxide

WS2

7.500

*1.000tungsten disulfide

WSi2

9.400

*1.000tungsten silicide

Y

4.340

0.835

yttrium

Y203

5.010

*1.000yttrium oxide

Yb

6.980

1.130

ytterbium

Yb2O3

9.170

*1.000ytterbium oxide

Zn

7.040

0.514

zinc

Zn3Sb26.300*1.000zinc antimonide

ZnF2

4.950

*1.000zinc fluoride

ZnO

5.610

0.556

zinc oxide

ZnS

4.090

0.775

zinc sulfide

ZnSe

5.260

0.722

zinc selenide

ZnTe

6.340

0.770

zinc telluride

Zr

6.490

0.600

zirconium

ZrB2

6.080

*1.000zirconium boride

ZrC

6.730

0.264

zirconium carbide

XTC/3 Operating Manual

Table A-1 Material table (continued)

FormulaDensity

Z-Ratio

Material Name

ZrN

7.090

*1.000zirconium nitride

ZrO2

5.600

*1.000zirconium oxide

A-9

XTC/3 Operating Manual®
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