★★★ ＜第38回知的財産翻訳検定試験【第20回和文英訳】＞ ★★★
≪１級課題 –電気・電子工学≫【問 1】[0008]

Here, in a case where a blockchain for virtual currency is applied toevidence of agreement on a contract, the problem lies in how to prove thatthe contents of the contract have been agreed upon between two or moreparties. As described above, the electronic signature system adopted in theblockchain for the virtual currency is based solely on the electronic signatureof the remitter, and does not require the electronic signature of the remittee.
Meanwhile, in a case where a contract is made between two or more parties,
the contract cannot be concluded by unilateral issuance of the contract, andagreement of all the parties concerned, who are the parties to the contract, isalways required. However, since only the electronic signature of a sender isincluded in a single transaction forming a blockchain, evidence of agreement
on a contract by a recipient will not remain in the transaction.
[0009]As a simple solution to the problem described above, for example, it isconceivable to include the electronic signatures of all parties concerned in asingle transaction. A mechanism called multi-signature is adopted for
virtual currency, which allows for the creation of an address where atransaction is not approved without a certain number or more of electronicsignatures.
However, a procedure for including multiple electronic
signatures in a single transaction becomes complicated in terms of, forexample, which electronic signatures are required in advance, how a
pre-approval transaction is shared between the parties concerned, and wheremultiple private keys are collected for signing.

【問 2】[0021]

According to a planar component arrangement such as in a surface
mount product, the wiring between components tends to be redundant. In
contrast, according to an RFID tag including a multilayer printed wiringboard as in the present invention, it is possible to shorten the wiring length

by utilizing a space between the layers of the multilayer board, and it istherefore possible to reduce power loss due to wiring resistance. It is thus
possible to reduce the size of the RFID tag 10 and to maintain thecommunication performance of the RFID tag 10.
[0022]
Here, the data communication principle of the RFID tag 10 isdescribed.
In order to read/write the identification data of the RFID tag 10, an
RFID reader/writer device (not illustrated) transmits radio waves to theRFID tag 10. The radio waves are reflected by the metal body 30 to which
the RFID tag 10 is attached, so that interference occurs. At this time,surface waves are generated on the surface of the metal body 30 with which
the radio waves have collided. The surface waves are then collected by thefirst antenna circuit 16a due to dielectric action. The surface waves
collected by the first antenna circuit 16a are sent through through-holes 18
to the second antenna circuit 16b and a third antenna circuit 16c, where theradio waves of a specific frequency are resonated and used. The resonatedand amplified radio waves of the specific frequency are sent to the RFID tag
chip 14. When receiving the radio waves, the RFID tag chip 14 sends theradio waves that carries data stored in the RFID tag chip 14, back to theRFID reader/writer device via the second antenna circuit 16b and the thirdantenna circuit 16c. The RFID reader/writer then receives the radio waves
sent back. The data communication is thus completed.
That is, the first antenna circuit 16a is an antenna circuit for
capturing the surface waves generated on the metal body 30, and the second
antenna circuit 16b and the third antenna circuit 16c are antenna circuits forresonating the radio waves collected by the first antenna circuit 16a at thespecific frequency to send the radio waves to the RFID tag chip 14, and fortransmitting the radio waves carrying the data in the RFID tag chip.
[0023]In addition, since the RFID tag 10 utilizes the metal body 30 as anantenna circuit that collects the radio waves transmitted from the RFID
reader/writer device, communication gain is higher than that in a case where
the object to which the RFID tag 10 is attached is a non-metal body.

【問 3】[Claim 1]
A semiconductor device comprising:a semiconductor substrate having a high impurity concentration;a parallel pn layer provided on a surface of the semiconductor
substrate, the parallel pn layer including first conductivity typesemiconductor regions and second conductivity type semiconductor regionsthat are arranged alternately;a base region of a second conductivity type provided on a surface
layer of each of the second conductivity type semiconductor regions;a source region of a first conductivity type provided on a surface layerof the base region;a gate electrode provided on a surface of the parallel pn layer via agate oxide film; anda source electrode electrically connected to the source region and thebase region and provided apart from the gate electrode,
wherein the semiconductor device comprises an insulating film
selectively provided between the surface of the parallel pn layer and the gateelectrode, the insulating film being thicker than the gate oxide film,
wherein a first area in which the gate electrode covers a neck portion
except the base region and the source region on the surface of the parallel pnlayer and a second area in which the gate electrode covers the insulating filmin the first area satisfy a relation of 0.1 ≤ second area/first area ≤ 0.4,
wherein, in a direction perpendicular to an interface between eachfirst conductivity type semiconductor region and the corresponding secondconductivity type semiconductor region, a plurality of islands of theinsulating film are respectively provided on surfaces of the neck portions
each located between the first conductivity type semiconductor regions
adjacent to each other, andwherein the insulating films that are different from each other areprovided so as to respectively cover a plurality of electric field concentration
regions each generated between the adjacent first conductivity typesemiconductor regions.