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XTM/2
Deposition Monitor
IPN 074-186

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XTM/2
Deposition Monitor
IPN 074-186STWO TECHNOLOGY PLACE
EAST SYRACUSE, NY 13057-9714 USA

A LT E L A N D S T R A S S E 6
LI-9496 BALZERS, LIECHTENSTEIN

BONNER STRASSE 498
D-50968 COLOGNE, GERMANY

P h o n e : + 3 1 5 . 4 3 4 . 11 0 0
Fax: +315.437.3803
Email: reachus@inficon.com

P h o n e : + 4 2 3 . 3 8 8 . 3 111
Fax: +423.388.3700
Email: reach.liechtenstein@inficon.com

Phone: +49.221.347.40
Fax: +49.221.347.41429
Email: reach.germany@inficon.com

V I S I T U S O N T H E W E B AT w w w. i n f i c o n . c o m©2001 INFICON 092304

Trademarks
The trademarks of the products mentioned in this manual are held by the companies that
produce them.
INFICON®, CrystalSix® are trademarks of INFICON Inc.
All other brand and product names are trademarks or registered trademarks of their respective companies.

The information contained in this manual is believed to be accurate and reliable. However, INFICON assumes
no responsibility for its use and shall not be liable for any special, incidental, or consequential damages related
to the use of this product.
©2001 All rights reserved.
Reproduction or adaptation of any part of this document without permission is unlawful.

DECLARATIONOFCONFORMITYThis is to certify that this equipment, designed and manufactured by:
INFICON Inc.
2 Technology Place
East Syracuse, NY 13057
USA
meets the essential safety requirements of the European Union and is placed on themarket accordingly. It has been constructed in accordance with good engineering
practice in safety matters in force in the Community and does not endanger the safetyof persons, domestic animals or property when properly installed and maintained andused in applications for which it was made.
Equipment Description:

XTM/2 Deposition Monitor, including the Oscillator
Package and Crystal Sensor as properly installed.

Applicable Directives:

73/23/EEC as amended by 93/68/EEC
89/336/EEC as amended by 93/68/EEC

Applicable Standards:

EN 61010-1 : 1993, Fixed Equipment
EN 55011, Group 1, Class A : 1991
EN 50082-2 : 1995

CE Implementation Date:

January 3, 1995
Revised to include EMC Directive: January 2, 1997

Authorized Representative:

Gary W. Lewis
Vice President - Quality Assurance
INFICON Inc.

ANY QUESTIONS RELATIVE TO THIS DECLARATION OR TO THE SAFETY OF INFICON'S PRODUCTS SHOULD BE
DIRECTED, IN WRITING, TO THE QUALITY ASSURANCE DEPARTMENT AT THE ABOVE ADDRESS.
11/14/01

Registration Card
Thank you for selecting INFICON® instrumentation.
Please fill out and return this postage paid card as soon as possible.
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Importance(ranked from
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5 is high)If you have additional comments, please contact INFICON.®
TWO TECHNOLOGY PLACE
EAST SYRACUSE, NY 13057-9714 USA

A LT E L A N D S T R A S S E 6
LI-9496 BALZERS, LIECHTENSTEIN

BONNER STRASSE 498
D-50968 COLOGNE, GERMANY

P h o n e : + 3 1 5 . 4 3 4 . 11 0 0
Fax: +315.437.3803
Email: reachus@inficon.com

P h o n e : + 4 2 3 . 3 8 8 . 3 111
Fax: +423.388.3700
Email: reach.liechtenstein@inficon.com

Phone: +49.221.347.40
Fax: +49.221.347.41429
Email: reach.germany@inficon.com

V I S I T U S O N T H E W E B AT w w w. i n f i c o n . c o m

BUSINESS REPLY MAIL
FIRST CLASS PERMIT NO. 49 EAST SYRACUSE, NEW YORKPOSTAGE WILL BE PAID BY ADDRESSEEINFICON INC.
Two Technology Place
East Syracuse, New York 13057-9714

Warranty
WARRANTY AND LIABILITY - LIMITATION: Seller warrants the products
manufactured by it, or by an affiliated company and sold by it, and described on
the reverse hereof, to be, for the period of warranty coverage specified below, freefrom defects of materials or workmanship under normal proper use and service.
The period of warranty coverage is specified for the respective products in therespective Seller instruction manuals for those products but shall in no event
exceed one (1) year from the date of shipment thereof by Seller. Seller's liability
under this warranty is limited to such of the above products or parts thereof as are
returned, transportation prepaid, to Seller's plant, not later than thirty (30) days
after the expiration of the period of warranty coverage in respect thereof and arefound by Seller's examination to have failed to function properly because of
defective workmanship or materials and not because of improper installation or
misuse and is limited to, at Seller's election, either (a) repairing and returning the
product or part thereof, or (b) furnishing a replacement product or part thereof,transportation prepaid by Seller in either case. In the event Buyer discovers or
learns that a product does not conform to warranty, Buyer shall immediately notify
Seller in writing of such non-conformity, specifying in reasonable detail the natureof such non-conformity. If Seller is not provided with such written notification,
Seller shall not be liable for any further damages which could have been avoided if
Seller had been provided with immediate written notification.
THIS WARRANTY IS MADE AND ACCEPTED IN LIEU OF ALL OTHERWARRANTIES, EXPRESS OR IMPLIED, WHETHER OF MERCHANTABILITY OR
OF FITNESS FOR A PARTICULAR PURPOSE OR OTHERWISE, AS BUYER'S
EXCLUSIVE REMEDY FOR ANY DEFECTS IN THE PRODUCTS TO BE SOLDHEREUNDER. All other obligations and liabilities of Seller, whether in contract or
tort (including negligence) or otherwise, are expressly EXCLUDED. In no event
shall Seller be liable for any costs, expenses or damages, whether direct orindirect, special, incidental, consequential, or other, on any claim of any defective
product, in excess of the price paid by Buyer for the product plus returntransportation charges prepaid.
No warranty is made by Seller of any Seller product which has been installed,
used or operated contrary to Seller's written instruction manual or which has been
subjected to misuse, negligence or accident or has been repaired or altered byanyone other than Seller or which has been used in a manner or for a purpose forwhich the Seller product was not designed nor against any defects due to plans or
instructions supplied to Seller by or for Buyer.
This manual is intended for private use by INFICON® Inc. and its customers.
Contact INFICON before reproducing its contents.
NOTE: These instructions do not provide for every contingency that may arise inconnection with the installation, operation or maintenance of this equipment.
Should you require further assistance, please contact INFICON.

TWO TECHNOLOGY PLACE
EAST SYRACUSE, NY 13057-9714 USA

A LT E L A N D S T R A S S E 6
LI-9496 BALZERS, LIECHTENSTEIN

BONNER STRASSE 498
D-50968 COLOGNE, GERMANY

P h o n e : + 3 1 5 . 4 3 4 . 11 0 0
Fax: +315.437.3803
Email: reachus@inficon.com

P h o n e : + 4 2 3 . 3 8 8 . 3 111
Fax: +423.388.3700
Email: reach.liechtenstein@inficon.com

Phone: +49.221.347.40
Fax: +49.221.347.41429
Email: reach.germany@inficon.com

V I S I T U S O N T H E W E B AT w w w. i n f i c o n . c o m

XTM/2 Operating Manual

Table Of Contents
Chapter 1

IPN 074-186S

Introduction and Specifications
1.1
1.1.1
1.1.2
1.1.3
1.1.4
1.2
1.3
1.3.1
1.3.1.1

Instrument Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
Notes, Cautions, Warnings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
General Safety Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Earth Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
Main Power Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
Introduction to the Instrument . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
Specifications XTM/2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6

1.3.1.2

Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6

1.3.1.3

Recorder Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6

1.3.1.4

Input/Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7

1.3.1.5

Display . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7

1.3.1.6

Process Variable Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7

1.3.1.7

Hardware Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7

1.3.1.8

Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8

1.3.1.9

Mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8

1.3.2
1.3.3
1.4
1.5
1.5.1
1.5.2
1.5.3

Transducer Specifications (optional) . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
XIU (Crystal Interface Unit) Specifications . . . . . . . . . . . . . . . . . . . . . . . 1-9
Guide to the Use of the Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9
How To Contact Customer Support . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
Application Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
Field Service and Repair Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
Returning Your Instrument . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10

Chapter 2
Quick Use Guide
2.1
2.1.1
2.1.2
2.1.2.1

Unpacking, Initial Inspection and Inventory . . . . . . . . . . . . . . . . . . . . . . 2-1
Unpacking and Inspection Procedures . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Inventory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
XTM/2 System Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2

2.1.2.2

Ship Kit - XTM/2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2

2.2
2.3

Voltage Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
Installation Guide and Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7

TOC - 1

XTM/2 Operating Manual

2.5.8
2.5.9
2.5.10
2.6
2.6.1
2.6.2
2.6.3
2.7
2.7.1
2.7.2
2.7.3
2.7.4
2.7.5
2.7.6

XTM/2 Front Panel Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-9
XTM/2 Front Control Panel Description . . . . . . . . . . . . . . . . . . . . . . . . 2-9
XTM/2 Display Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11
XTM/2 Rear Panel Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-13
Power Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14
Configuration Switches 1 & 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-15
Grounding Stud . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-17
System I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-18
RS232 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-19
Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-20
International Warning Symbol for
Users and Technicians . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-20
Recorder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-20
Comm. Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-21
Manufacturer’s Identification and
Serial Number Plate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-21
Operation as a Deposition Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-22
Monitoring - Systems Without a Source Shutter . . . . . . . . . . . . . . . . . 2-22
Monitoring - Systems with a Source Shutter . . . . . . . . . . . . . . . . . . . . 2-23
Rate Sampling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-23
Nontraditional Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-24
Etching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-24
Immersion in Liquids . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-24
Biological . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-25
Measurement of Liquids . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-25
Use as a Frequency Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-25
Contamination Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-26

Chapter 3
Installation
3.1
3.1.1
3.2
3.2.1
3.2.2
3.2.3
3.3
3.3.1
3.3.2
3.4
3.5

TOC - 2

Installing the Instrument - Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Control Unit Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
Electrical Grounding and Shielding Requirements . . . . . . . . . . . . . . . . 3-1
Verifying / Establishing Earth Ground . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
Connections to Earth Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
Minimizing Noise Pickup from External Cabling . . . . . . . . . . . . . . . . . . 3-3
Connection to Rear Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
The BNC Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
The "D" Shell Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
Sensor Selection Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6
Guidelines for Transducer Installation . . . . . . . . . . . . . . . . . . . . . . . . . 3-7

IPN 074-186S

2.4
2.4.1
2.4.2
2.5
2.5.1
2.5.2
2.5.3
2.5.4
2.5.5
2.5.6
2.5.7

IPN 074-186S

XTM/2 Operating Manual

3.5.1
3.5.2
3.5.3
3.6
3.6.1
3.7
3.7.1
3.7.2
3.7.3
3.8
3.8.1
3.8.1.1

Sensor Installation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
CrystalSix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10
Check List for Transducer Installation . . . . . . . . . . . . . . . . . . . . . . . . . 3-11
Use of the Test Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11
Operational Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12
Input and Output Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-14
Relays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-14
Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-15
Chart Recorder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-15
Computer Communications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16
Communications Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-16
IEEE Settings for a National Instruments IEEE-GPIB Board . . . . . . . . 3-17

3.8.2
3.8.3
3.8.4
3.8.5
3.8.5.1

Basic Command Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-18
Service Requests and Message Available . . . . . . . . . . . . . . . . . . . . . . 3-20
Datalogging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-21
Computer Command Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-22
Echo Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-22

3.8.5.2

Hello Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-22

3.8.5.3

Query Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-22

3.8.5.4

Update Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-23

3.8.5.5

Status Command. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-23

3.8.5.6

Remote Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-26

3.8.6
3.8.6.1

Examples of RS232 Programs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-27
Example of SEMI II Program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-29

3.8.7

Example of IEEE488 Program . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-31

Chapter 4
Programming System Operation Details
4.1
4.2
4.3
4.4
4.5
4.6

State and Measurement System Sequencing . . . . . . . . . . . . . . . . . . . . 4-1
State Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
Parameter Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4
Crystal Fail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4
Crystal Fail Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
Crystal Life and Starting Frequency. . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5

Chapter 5
Calibration and Measurement
5.1
5.2
5.3

Importance of Density, Tooling and Z-ratio . . . . . . . . . . . . . . . . . . . . . . 5-1
Determining Density . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
Determining Tooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2

TOC - 3

XTM/2 Operating Manual

5.4
5.5
5.5.1
5.5.2
5.5.3
5.5.4
5.5.5
5.5.6

Laboratory Determination of Z-ratio . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3
Measurement Theory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4
Basics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4
Monitor Crystals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-6
Period Measurement Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8
Z-Match Technique . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9
Active Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9
ModeLock Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12

Chapter 6
6.1
6.2
6.2.1
6.2.2
6.2.3
6.3
6.3.1
6.3.2
6.3.3
6.3.4
6.3.5
6.4
6.4.1
6.4.2
6.4.3
6.4.4
6.4.5
6.5
6.5.1
6.5.1.1

LCD Contrast Adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
Error Messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
Powerup Errors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
Parameter Update Errors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-2
Other Errors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-2
Troubleshooting Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-2
Major Instrument Components, Assemblies and Mating Connectors. . . 6-3
Troubleshooting the Instrument . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4
Troubleshooting Transducers/Sensors . . . . . . . . . . . . . . . . . . . . . . . . . 6-7
Troubleshooting Computer Communications . . . . . . . . . . . . . . . . . . . 6-11
Leaf Spring Concerns. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-14
Replacing the Crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-15
Standard and Compact. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-16
Shuttered and Dual Sensors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-17
Bakeable Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-17
Sputtering Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-18
Crystal Snatcher. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-19
Crystal Sensor Emulator
IPN 760-601-G1 or 760-601-G2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-20
Diagnostic Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-21
Measurement System Diagnostic Procedure . . . . . . . . . . . . . . . . . . . 6-21

6.5.1.2

Feed-Through Or In-Vacuum Cable
Diagnostic Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-22

6.5.1.3

Sensor Head Or Monitor Crystal
Diagnostic Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-23

6.5.1.4

System Diagnostics Pass But
Crystal Fail Message Remains . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-24

6.5.2
6.5.3
6.5.3.1% XTAL Life . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-24
Sensor Cover Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-25
Compatible Sensor Heads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-25

TOC - 4

IPN 074-186S

Adjustments and Problems

XTM/2 Operating Manual

6.5.3.2

Incompatible Sensor Heads. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-25

6.5.4

Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-26

Appendix A
Table of Densities and Z-ratios

IPN 074-186S

Index

TOC - 5

IPN 074-186S

XTM/2 Operating Manual

TOC - 6

XTM/2 Operating Manual

Chapter 1
Introduction and Specifications
1.1 Instrument Safety
1.1.1 Notes, Cautions, Warnings
When using this manual, please pay attention to the NOTES, CAUTIONS andWARNINGS found throughout. For the purposes of this manual they aredefined as follows:
NOTE: Pertinent information that is useful in achieving maximum instrument
efficiency when followed.

CAUTION
Failure to heed these messages could result in damage
to the instrument or the loss of data.

WARNING
Failure to heed these messages could result inpersonal injury.

IPN 074-186SWARNING
Dangerous voltages are present. Failure to heed thesemessages could result in personal injury.

1-1

XTM/2 Operating Manual

1.1.2 General Safety Information
WARNING
There are no user serviceable components within the
instrument case.
Potentially lethal voltages are present when the line
cord or system I/O are connected.
Refer all maintenance to qualified personnel.

CAUTION

IPN 074-186S

This instrument contains delicate circuitry which issusceptible to transient power line voltages.
Disconnect the line cord whenever making any
interface connections. Refer all maintenance toqualified personnel.

1-2

XTM/2 Operating Manual

1.1.3 Earth Ground
This instrument is connected to earth via a sealed three-core (three-conductor)
power cable, which must be plugged into a socket outlet with a protective earthterminal. Extension cables must always have three conductors, including aprotective earth conductor.

WARNING
Never interrupt the protective earth circuit.
Any interruption of the protective earth connection
inside or outside the instrument, or disconnection of
the protective earth terminal is likely to make theinstrument dangerous.

IPN 074-186S

This symbol indicates where the protective earth
ground is connected inside the instrument. Neverunscrew or loosen this connection.

1-3

XTM/2 Operating Manual

1.1.4 Main Power Connection
WARNING
This instrument has a line voltage present on the
primary circuits whenever it is plugged into a main
power source.
Never remove the covers from the instrument during
normal operation.
There is no operator serviceable items within this
instrument.
Removal of the top or bottom covers must be done
only by a technically qualified person.

IPN 074-186S

In order to comply with accepted safety standards, this
instrument must be installed into a rack system whichcontains a mains switch. This switch must break bothsides of the line when it is open and it must notdisconnect the safety ground.

1-4

XTM/2 Operating Manual

1.2 Introduction to the Instrument
The XTM/2 is an economical quartz crystal transducer type deposition/etch
process monitor that incorporates the patented (US#5,117,192 — May
27,1992) ModeLock measurement system. This innovative system provides
process security, measurement speed and precision at a level that no active
oscillator based instrument can provide.The Liquid Crystal Display of the
XTM/2 is easily read and keeps the operator continuously informed withpertinent deposition data including rate, thickness and elapsed time. Special
messages such as Crystal Fail, achievement of setpoints, measurement units
or etch mode are clearly presented to reduce operator uncertainty and eliminate
the possibility of costly mistakes. Basic instrument operation is easily verified
with a built-in test mode and preprogrammed parameters.The set up andstorage of nine different process variable sets is provided.The RATE and
THICKNESS displays as well as the limit parameters may be read andprogrammed in the traditional kÅ units or directly in mass (mg, µgm,ngm).

IPN 074-186SAll units come with RS232 (and support Data Rates to 9,600 Baud).The SECSII
protocol is supported.The optional computer interface is IEEE-488. Four relays
are used to manipulate various external devices such as source and sensor
shutters, heaters or valves.There are five input lines to provide the ability tosense and react to discrete external signals.These instruments are fullycompatible with the complete family of INFICON transducers, excluding Dualand CrystalSix®.

1-5

XTM/2 Operating Manual

1.3 Specifications
At the time of this manual’s writing, the specifications for performance are as
published below. INFICON continuously improves its products, affecting the
instrument’s performance.

1.3.1 Specifications XTM/2
1.3.1.1 General
Usage . . . . . . . . . . . . . . . . . . . . . . Indoor use only.
Altitude Range . . . . . . . . . . . . . . . . Up to 2000 m (6,561 ft)
Pollution Degree . . . . . . . . . . . . . . 1—No pollution occurs
Overvoltage Category . . . . . . . . . . 2—Local level, appliances, etc.
Cleaning . . . . . . . . . . . . . . . . . . . . The unit enclosure can be safely cleaned
with a mild detergent or spray cleaner
designed for that purpose. Care should betaken to prevent any cleaner from entering
the unit.
1.3.1.2 Measurement
Crystal Range & Precision . . . . . . . 6.0 to 5.0 MHz +/- 0.1 Hz(per 250 msec sample)
Thickness & Rate Resolution* . . . . 0.123Å (per 250 msec sample)* Material density = 1.0; Z-ratio = 1.0;
crystal frequency = 6 MHz.
Å/S/M = Angstroms/second/measurement.
Measurements/second . . . . . . . . . . 4 max., user selectable multiple
measurement averaging to 16 seconds infour ranges.
1.3.1.3 Recorder Output
Voltage . . . . . . . . . . . . . . . . . . . . . 0 to ±10 v
Resolution . . . . . . . . . . . . . . . . . . . 13 bits over full range(one reserved for sign)
Update Rate . . . . . . . . . . . . . . . . . 4 Hz
Function. . . . . . . . . . . . . . . . . . . . . Rate / Thickness / Mass
Maximum Load . . . . . . . . . . . . . . . 2.0 KOhm (100 Ohm internal impedance)

1-6

IPN 074-186S

Thickness accuracy . . . . . . . . . . . . 0.5%

XTM/2 Operating Manual

1.3.1.4 Input/Output
Inputs . . . . . . . . . . . . . . . . . . . . . . 5 TTL inputs
Outputs . . . . . . . . . . . . . . . . . . . . . 4 SPST 2.5 amp relays rated@ 30 V(dc) / 30 V(ac) / 42 V(peak) max.
Scan/Change Rate . . . . . . . . . . . . 4 Hz
1.3.1.5 Display
Type . . . . . . . . . . . . . . . . . . . . . . . 2x multiplexed custom LCD
Thickness Resolution* . . . . . . . . . 1 ÅRate Resolution* . . . . . . . . . . . . . .1 Å for 1 to 99.9 Å/sec
1 Å for 100 to 999 Å/sec* Other units appropriately scaled.
Enhanced resolution is achieved when
multiple measurement averaging is
employed.
Update Rate . . . . . . . . . . . . . . . . . 1 Hz
1.3.1.6 Process Variable Storage
Quantity . . . . . . . . . . . . . . . . . . . . 9 sets
Variables per set . . . . . . . . . . . . . . 6
1.3.1.7 Hardware Interface
Sensors . . . . . . . . . . . . . . . . . . . . 1, 15 pin D-Sub type
I/O

IPN 074-186S

Standard (inputs/outputs) . . . . 5/4
Optional . . . . . . . . . . . . . . . . . None
Communications
Standard . . . . . . . . . . . . . . . . . RS232C, 9 Pin D-Sub type
Optional . . . . . . . . . . . . . . . . . IEEE-488
Chart Recorder . . . . . . . . . . . . . . . BNC

1-7

XTM/2 Operating Manual

1.3.1.8 Operation
Power Requirements"115 V" input range. . . . . . . . . . 90 to 132 V(ac), 49 to 61 Hz, 45 VA max.
fused at 3/8 Amp Type T fuse"230 V" input range . . . . . . . . . 180 to 264 V(ac), 49 to 61 Hz, 45 VA max.
fused at 3/16 Amp Type T fuse
Operating Temperature . . . . . . . . . 0 to 50 °C (32 to 122 °F)
1.3.1.9 MechanicalSize . . . . . . . . . . . . . . . . . . . . . . . . 3.5" H x 8" W x 12" D(89 mm H x 203 mm W x 305 D mm)
Weight . . . . . . . . . . . . . . . . . . . . . . 6 lb. (2.7 kg)

1.3.2 Transducer Specifications (optional)
Water Tube & Body & Holder
Coax Length

IPN

Standard Sensor

130 °C

1.063" x 1.33" x .69" high30" (762 mm) 304 SS(27 mm dia. x 34 mm x 17.5 mm high)

750-211-G1

Standard Sensor
with Shutter

130 °C

1.06" x 2.24" x .69" high30" (762 mm) 304 SS(27 mm dia. x 57 mm x 17.5 mm high)

750-211-G2

Sputtering Sensor

105 °C

1.36" dia. x .47" high(34.5 mm dia. x 11.8 mm high)30" (762 mm) Au-plated BeCu

007-031

Compact Sensor

130 °C

1.11" x 1.06" x 1.06" high
(28 mm x 27 mm x 27 mm high)30" (762 mm) 304 SS

750-213-G1

Compact Sensor
with Shutter

130 °C

2.08" x 1.62" x 1.83" high
(53 mm x 41 mm x 46 mm high)30" (762 mm) 304 SS

750-213-G2

UHV Bakeable
Sensor

450 °C

1.35" x 1.38" x .94" high
(34 mm x 35 mm x 24 mm high)12" (305 mm) 304 SS
20" (508 mm)
30" (762 mm)

007-219
007-220007-221

UHV Bakeable
400 °C
Sensor with Shutter

1.46" x 1.37" x 1.21" high
(37 mm x 35 mm x 3.1 mm high)12" (305 mm) 304 SS
20" (508 mm)
30" (762 mm)

750-012-G1
750-012-G2
750-012-G3

Shutter Assembly

two models available

N/A

750-210-G1
750-005-G1(Sputtering)

400 °C

300-series SS*For Bake only; waterflow is required for actual deposition monitoring. These temperatures are conservative maximum
device temperatures, limited by the properties of Teflon (PTFE) at higher temperatures. In usage, the water cooling allows
operation in environments that are significantly elevated, without deleterious affects.

1-8

IPN 074-186S

Max. Bakeout Size (Max. Envelope)
Temperature*XTM/2 Operating Manual

1.3.3 XIU (Crystal Interface Unit) Specifications
The XTM/2 Series instruments use a new type of "passive intelligent" oscillator.
It is available with cable lengths of 15’ (4.572 m), 30’ (9.144 m), 50’ (15.24 m),
and 100’ (30.28 m) as IPN 757-305-G15, G30, G50, or G100, respectively.
Conventional, active style oscillators do not work with these instruments.
In-vacuum cable lengths to a maximum of 2 m (6.6’) are supported with this newtechnology.

1.4 Guide to the Use of the ManualThis manual is configured to be used by both experienced and inexperienced
deposition process engineers. For those with significant experience, especiallyon INFICON controllers, nearly all pertinent information is contained in Chapter
2, Quick Use Guide. Other sections contain the details that supplement the
information in the quick use section.

IPN 074-186S

Every user should read the complete manual. It is strongly suggested that theuser or installer follow the following plan to gain the most information in the
shortest period of time.
Register the instrument to receive updates and important information fromthe factory.



Read section 1.1.1, Notes, Cautions, Warnings, on page 1-1 to understandthe safety related issues.

Read Chapter 2, Quick Use Guide, to become familiar with the instrument’s
needs and capabilities. Use the other sections of the manual to supplement
areas where you do not feel you have an adequate understanding of thematerial. Throughout Chapter 2 there will be frequent references to themanual sections that provide more detailed information. The final sectionsof the Chapter 2 build the understanding of the full use of the instrument ina logical progression, as suggested in section 2.3 on page 2-7.

WARNING
There are no user serviceable components within the
instrument case.
Potentially lethal voltages are present when the line
cord or System I/O are connected.
Refer all maintenance to qualified personnel.

1-9

XTM/2 Operating Manual

1.5 How To Contact Customer Support
If you cannot find the answer to your question in this manual, please contact
one of the following Customer Support groups after deciding whether: your difficulty is with how you are using the instrument—in this case, contact
Application Support.
or your instrument needs repair—in this case, contact Field Service andRepair Support.
When you contact Customer Support, please have this manual at hand, alongwith the following information: The serial number for your instrument.
 A description of your problem.
 An explanation of the corrective action that you may have alreadyattempted.
 The exact wording of any error messages that you have received from the
instrument.
Within the USA, you may reach Customer Support at the following phone
numbers. Please contact the location that is closest to you. If you are locatedoutside of the USA, please contact your sales office. A complete listing of
INFICON Worldwide Service Centers is available at www.inficon.com.

1.5.1 Application Support
Austin, TX . . . . . . ph. 512-448-0488. . . . . . . . . . fax 512-448-0398
San Jose, CA. . . . ph. 408-361-1200 ext. 125 . . . fax 408-362-1556
Syracuse, NY. . . . ph. 315-434-1128 . . . . . . . . . . fax 315-437-3803
If you are located outside the USA, please contact your sales office. A complete
listing of INFICON Worldwide Service Centers is available at www.inficon.com.
Austin, TX . . . . . . ph. 512-448-0488. . . . . . . . . . fax 512-448-0398
San Jose, CA. . . . ph. 408-361-1200 ext. 120 . . . fax 408-362-1556
Syracuse, NY. . . . ph. 315-434-1167 . . . . . . . . . . fax 315-434-2551
If you are located outside the USA, please contact your sales office. A complete
listing of INFICON Worldwide Service Centers is available at www.inficon.com.

1.5.3 Returning Your Instrument
Do not send your instrument without first speaking with a Customer Support
Representative.
You must obtain an RMA (Return Material Authorization) number from theCustomer Support Representative. If the delivery of a package without an RMA
number is attempted, INFICON will refuse the delivery and the package will be
returned to you.
If your instrument has been exposed to process materials, you will be required
to complete a Declaration Of Contamination form.

1 - 10

IPN 074-186S

1.5.2 Field Service and Repair Support

XTM/2 Operating Manual

Chapter 2
Quick Use Guide
2.1 Unpacking, Initial Inspection and Inventory
2.1.1 Unpacking and Inspection Procedures
1 If you haven’t removed the instrument from its shipping containers, do sonow.

2 Carefully examine the unit for damage that may have occurred during
shipping. This is especially important if you notice signs of obvious roughhandling on the outside of the cartons. Report any damage to the carrier and
to INFICON, immediately.

3 DO NOT discard any packing materials until you have taken inventory andhave verified proper instrument operation to your satisfaction. See section
2.2 on page 2-3 for voltage selection and section 3.6 on page 3-11 for test
mode operation.

2.1.2 Inventory

IPN 074-186S

Make sure you have received all of the necessary equipment by checking thecontents of the shipping containers with the parts list below. INFICON ships
these products on a feature-option basis. Check your order for the part number
before comparing to the lists below.

2-1

XTM/2 Operating Manual

2.1.2.1 XTM/2 System Configuration

XTM/2
BASIC CONFIGURATION

IPN #

CODE#

115V 50/60 Hz

758-500-G1

1

230V 50/60 Hz

758-500-G2

2

Optional Computer Communications ModuleNone757-211-G1

1

IEEE-488 Parallel

760-122-G1

2

Sensor/feedthroughcombinations. Some
instruments are sold ascomplete packages.

Rack Mounting
None0

1 Unit Mounting Kit

757-212-G1

1

2 Unit Mounting Kit

757-212-G2

2

2.1.2.2 Ship Kit - XTM/2

Item

Qty
G2 G1
(230V)(115V)IPN Number

Part # and/or Description

01

-

X

758-203-G1

Ship Kit - XTM/2 115V

02

X

-

758-203-G2

Ship Kit - XTM/2 230V

03

-

1

068-0385

North America Power Cord, shielded

04

1

-

068-0390

European Power Cord, shielded

05

1

1

051-485

Conn 9 Pin Male D/Sub Sod. Cup

06

1

1

051-620

Cable Clamp 11.3015

07

1

1

051-483Conn 25 Pin Female D/Sub Sod. Cup

08

1

1

051-619

Cable Clamp

09

-

1

062-011

3/8 Amp Fuse Type T

10

1

-

062-053

3/16 Amp Fuse Type T

11

4

4

070-8118014 Bumpon Feet

In addition, you have already found a copy of this manual, IPN 074-186.

2-2

IPN 074-186S

Both instruments are shipped with the following accessories. To find whichaccessories were shipped with your unit look for the "X" which represents thevoltage of your particular instrument and follow that column.

XTM/2 Operating Manual

2.2 Voltage Selection
Voltage selection is required only between low (nominal 100-120 V) and high(nominal 200-240 V) ranges. There is no distinction between 50 and 60 Hz
supplies. Refer to section 1.3.1 on page 1-6 for specific power requirements.

CAUTION
Verify that the correct fuse is in place by visuallyinspecting the fuse for the proper rating. Use of an
improperly sized fuse may create a safety hazard.
For 100-120 V(ac) operation use a 3/8 Amp Type T fuse.
For 200-240 V(ac) operation use a 3/16 Amp Type T fuse.
NOTE: These instruments are designed to operate between 90 V(ac) and
132 V(ac) on Low Range and between 180 V(ac) and 264 V(ac) on High
Range.

WARNING
This instrument has line voltage present on the
primary circuits whenever it is plugged into a main
power source.
Potentially lethal voltages are present when the line
cord, system I/O or aux I/O are connected.

IPN 074-186S

This instrument must be disconnected from the main
power source before inspecting or replacing the fuse.

2-3

XTM/2 Operating Manual

To inspect the fuse, proceed as follows.

1 Pry open the power entry module cover. See Figure 2-1.
Figure 2-1 Opening the Power Entry Module Cover

2 Pry the fuse holder out of the housing. See Figure 2-2.

IPN 074-186S

Figure 2-2 Removing the Fuse Holder

2-4

XTM/2 Operating Manual

3 Inspect the fuse. See Figure 2-3.
Figure 2-3 Clip, Fuse Holder, Fuse
Conversion Clip

Fuse
HolderFuse

IPN 074-186S

The Corcom fuse holder has chambers for two 1/4" x 1 1/4" (5 mm x 20 mm)
fuses. Since only one fuse is used, that fuse must be on the live (hot) side anda conversion clip is inserted to bridge the unused fuse chamber in the neutralside.
An additional function of the conversion clip is to act as a polarization key toassure that only the neutral line can be bridged leaving the live (hot) line always
fused. A special feature has been built into the live side of the fuse holder
compartment of the housing. It will interfere with the conversion clip andtherefore stop the fuse holder from being inserted fully into the housing if theclip is on the live side.
When the power entry module is flipped around for voltage changing, theconversion clip must be re-installed to the other side. Otherwise, the fuse holder
will not seat completely into the housing and the power entry module will not
function.
The proper location of the conversion clip is at the left hand side of the voltage
number selected, that is, the upright voltage number. See Figure 2-4.

2-5

XTM/2 Operating Manual
Figure 2-4 Proper Clip and Fuse Location

IPN 074-186S

Once the fuse and clip have been configured, the fuse holder is inserted into
the power entry module housing with the fuse towards the bottom of the
instrument (and the clip towards the top) with the desired voltage showing
through the hole into the cover.

2-6

XTM/2 Operating Manual

2.3 Installation Guide and Schematic
Many experienced deposition monitor users will be able to fully install and use
the instrument by studying the installation schematic, Figure 2-5 on the next
page, and the State Sequence Diagram, Figure 4-2 on page 4-2.
A more systematic approach would be to start by reviewing the two figures andthen following the procedure below.

WARNING
Completely review section 1.1 on page 1-1 on safety.
All warnings in this section, as well as ones found inother sections listed below, must be followed to ensure
the safety of the personnel operating this equipment.

1 Check for correct line voltage, section 2.2 on page 2-3.
2 Verify basic unit operation by exercising it in the Test Mode, section 3.6 on
page 3-11.

3 Review the system interface capability as outlined in section 2.5 on page2-13. Be especially attentive of the special features available on theconfiguration switches, section 2.5.2 on page 2-15

4 Wire the necessary connectors following the installation procedures in
section 3.1 on page 3-1, section 3.2 on page 3-1, and section 3.3 on page
3-4.

IPN 074-186S

5 Review the front panel controls and display description per section 2.4 on
page 2-9.

6 Program the desired film parameter values per section 4.1 on page 4-1 andsection 4.2 on page 4-3.

7 Verify the operation of the just programmed film utilizing the Test Mode.
8 Attach the XIU (757-305-G15, G30, or G100) to an existing transducer or
install a new transducer following the guidelines of section 3.5 on page 3-7
and Figure 3-3 on page 3-8.

9 Exit the Test Mode and deposit when ready.

2-7

2-8

Actuator
Power Supply

Compressed Air

RotaryFeedthroughPneumatic
Actuator

IPN 074-186S

Air, 80 PSI, 110 PSI Max.

XIU (Oscillator)
IPN 757-302-G1

Cooling\WaterFeedthroughIPN 750-030-G1(Option)

Oscillator Kit
IPN 757-305-Gxx(Option)

System I/O
see 2.5.4 and 3.7

Source Shutter 1

ManualSource Shutter 1 (N.O. Relay Contact)

Sensor Shutter 1

Outputs
Sensor Shutter 1 (Manual)

From Local Line Power
100 - 120 V(ac) ± 10%
200 - 240 V(ac) ± 10%
50 - 60 Hz

Figure 2-5 Installation Guide Schematic

24 V(ac) or V(dc)Power Supply

Out
Shutter
Solenoid Assy.
In
IPN 007-199

Source Controller
Such As Electron
Beam Gun
Power Supply

SensorShutter

Source to Sensor
10” (254 mm) Minimum

SensorShutterStandard Sensor With Shutter
IPN 750-211-G2(Option)RS232
see 2.5.5
Configuration Switches
see Table 2-1 in section 2.5

REAR PANEL

Sensorsee 2.5.6

IEEE
757-211-G1

Recordersee 2.5.8
see 3.7.3

XTM/2 Operating ManualXTM/2 Operating Manual

2.4 XTM/2 Front Panel Description
Figure 2-6 Front Panel XTM/2

1

2

3

4
5

13

6

12

11

10

9

8

7

2.4.1 XTM/2 Front Control Panel Description
1— LCD DISPLAY
Display of current information and parameters. See section 2.4.2 on page2-11 for details.
2— XTAL
Pressing this key momentarily switches the display to percent of crystal life
used, software version, and crystal frequency, when the display is inoperate mode. If the Frequency display mode is chosen (see section 2.5.2
on page 2-15), pressing this key provides temporary added display
resolution to 0.01 Hz.

IPN 074-186S

3— ZERO
Zeros the displayed thickness and elapsed time when the display is in theoperate mode.
4— OPEN
Closes the "shutter" relay’s contacts and "zeros" the accumulated
thickness (mass) and elapsed time.
5— CLOSE
Opens the "shutter" relay’s contacts and initiates a data log when the
instrument is properly configured. See section 3.8.4 on page 3-21.
6— PROG
Program. Toggles the display between the program and operate modes.
7— ON/STBY
Switches secondary power of the instrument between ON and STANDBY.
8—Green LED illuminates to indicate that the unit is connected to an active line
power source and the ON/STBY switch is set to ON.

2-9

XTM/2 Operating Manual

9—
Access to adjust LCD contrast, see section 6.1 on page 6-1.
10—Enter and cursor down. Two function switch used when the display is in the
program mode.
11— DIGITS (0-9)
Decimal based key pad for data entry.
a. If the zero key is held down during power-up, the communications
interface may be configured (see section 3.8.1 on page 3-16)
b. If the nine key is held down during power-up, all of the LCD segments
will remain lit until the key is released, see Figure 2-7 on page 2-11.
12—
Clear and cursor up. Two function switch that is used when the display isin the program mode.
13—

IPN 074-186S

Optional mounting kit, (IPN 757-212-G1) for mounting one unit in full rackor (757-212-G2) for mounting two units side by side in full rack.

2 - 10XTM/2 Operating Manual

2.4.2 XTM/2 Display Description
Figure 2-7 XTM/2 Display

1

2

11

3

10

4
5
6

9

8

7

1— RATE DISPLAY GROUP
Indicates the deposition or etching rate in the displayed units, or used todisplay the tooling value when the display is in the Program mode. Also
used to briefly display %of Xtal life (based on 5 MHz = 100%) when xtal ispressed and the display is in the operate mode. Displays the mostsignificant frequency information in the frequency monitor mode.

IPN 074-186S

2— THICKNESS/MASS GROUP
Indicates the deposited or etched thickness (mass) in the displayed units.
Also used for briefly displaying the monitor crystal’s frequency when thextal key is pressed in the operate mode. This group is also used for
displaying density (gm/cc) when in the program mode. Displays the leastsignificant frequency information in the frequency monitor mode.
3— STATUS MESSAGE GROUP
When illuminated, indicates that the shutter is open and if the specified limit
was exceeded.
4— TEST MODE INDICATOR
When illuminated, indicates that the test mode configuration switch has
been set.
5— COMPUTER I/O OVERRIDE
Illuminates when control of one or more relays have been reconfigured
through computer communications.
6— ETCH MODE ON INDICATOR
When illuminated, indicates that the etch mode configuration switch has
been set. The thickness display now indicates the amount removed.
7— TIMER GROUP
Elapsed time indicator and unit annunciator. Displays the software version
number when XTAL key is pressed while display is in operate mode.

2 - 11

XTM/2 Operating Manual

8— PROGRAM MODE GROUP
Indicator annunciator and cursor array for the definition of parameters.
9— FILM GROUP
Indicates which stored film’s parameters are being used in the operatemode, or being changed/programmed in the program mode. The active film
may be changed when the cursor is blinking.
10— COMMUNICATIONS ACTIVITY GROUP
Illuminates whenever computer communications are being sent or
received, respectively.

IPN 074-186S

11— CRYSTAL FAIL INDICATOR
Illuminates whenever the ModeLock system cannot drive a crystal, or acrystal has been shifted by loading beyond 5 MHz. May also illuminate
when there is a cable or sensor failure.

2 - 12

XTM/2 Operating Manual

2.5 XTM/2 Rear Panel Description
The rear panel provides the interface for all external connections to the
instrument. Each ballooned item is covered in the following respectively
numbered sub-paragraphs.
Figure 2-8 XTM/2 Rear Panel

10

1

9

8

7
3

2

5

6

IPN 074-186S

4

2 - 13

XTM/2 Operating Manual

2.5.1 Power Module
Allows selection of optional voltages, contains the instrument fuse and provides
modular connection to line power. Refer to section 2.2 on page 2-3.

IPN 074-186S

Figure 2-9 Power Module

2 - 14

XTM/2 Operating Manual

2.5.2 Configuration Switches 1 & 2
Two eight position DIP switches used to customize the instrument as follows.
Figure 2-10 Configuration Switch

CAUTION

IPN 074-186S

The configuration switches are only read on
instrument power up. If an option is changed the
instrument must be switched to standby and thenpowered up to effect the change.

2 - 15

XTM/2 Operating Manual

Table 2-1 Configuration Switch Settings

Switch 1

Test Mode(0 = off, 1 = on)

Switch 2

Parameter Lock(0 = off, 1 = on)

Switch 3

Beep On/Off(0 = on, 1 = off)

Switch 4

Close Shutter on
Crystal Fail(0 = yes, 1 = no)

Switch 5

Continue(0 = off, 1 = on)
Thickness/Timer
Accumulation Option
With Switch 5 in the On position, pressing the OPEN button adds to theThickness and Time counters and does not zero previously accumulated
Thickness or Time. Pressing CLOSE freezes the Thickness and Timedisplayed at the current value. The displayed Rate will not be frozen. The Zerofunction works normally and can be used to zero accumulated Thickness orTime at any time.

Switch 6

UnusedSwitch 7

UnusedSwitch 8

Etch Mode

Switch 9

Displayed units MSB 00 = kÅ, 01 = µgm

Switch 10

Displayed units LSB 10 = mgm, 11 = MHz
Note: recorder function remains as Å/sec or Å in the
MHz setting.

Switch 11

Recorder function
MSB

00 = Rate, ±2000Å/sec, 1000ng/sec or 200µgm/sec
01 = Rate, ±200Å/sec, 100ng/sec or 20 µgm/sec
10 = Rate, ±20Å/sec, 10ng/sec or 2 µgm/sec

Switch 12

Recorder function
LSB

11 = Thickness, Modulus ±2000Å, 2000ng or 2000µgm

Switch 13

Recorder Output &Display Averaging
MSB

00 = 1/4 sec
01 = 1 sec

Switch 14

Recorder Output &Display Averaging
LSB

10 = 4 sec
11 = 16 sec
Note: Display average is always 1 second or greater.

Switch 15

UnusedSwitch 16

Unused (Reserved)

2 - 16

IPN 074-186S(0 = off, 1 = on)XTM/2 Operating Manual

2.5.3 Grounding Stud
Recommended point for connecting the system ground strap. For specificrecommendations see section 3.2, Electrical Grounding and Shielding
Requirements, on page 3-1.

IPN 074-186S

Figure 2-11 Grounding Stud2 - 17

XTM/2 Operating Manual

2.5.4 System I/O
A 25-pin male "D" type connector for interface connection. (See section 3.7 on
page 3-14 for details.) The outputs are normally open type relays.
Figure 2-12 25-Pin Male "D" Connector

Pin #Function*

Outputs
1,2

Source Shutter

3,4

Thickness Setpoint

5,6

Timer Setpoint

7,8

Sensor Fail

Inputs9
14,15,16,17

Crystal Fail Inhibit
INPUT Common (GND)

18

OPEN shutter

19

CLOSE shutter

20

Zero thickness

21

Zero timer

IPN 074-186S*The function of the relay outputs may be altered tobe controlled remotely through the computercommunications, see section 3.8.5.6 on page 3-26
for more information on the Remote Command.

2 - 18

XTM/2 Operating Manual

2.5.5 RS232
A 9-pin female "D" type connector which enables the instrument to be controlled
by a host computer. See section 3.8 on page 3-16 for details.
Figure 2-13 9-Pin Type "D" Female Connector

IBM Compatible
Host Computer
Pin #Description1

Not used

DB9-Pin DB 25-Pin
1-

2 TXD Data transmitted from XTM2

2

3

3 RXD Data received by XTM/2

3

2

4

4

-

5 GND Signal ground

5

7

6 DTR Output from XTM/2 indicating ready to transmit

6

6

7 CTS Input to XTM/2 indicating stop transmitting

7

4

8

8

-

9

-

Not usedNot used

IPN 074-186S

9 GND Shield ground2 - 19

XTM/2 Operating Manual

2.5.6 Sensor
High density 15-Pin female "D" type input connectors for intelligent oscillators(IPN757-302-G1). These oscillators are normally supplied with 15’ (4.572 m)
cables as IPN 757-305-G15. These are specifiable as 30’ (9.144 m) and 100’
(30.28 m) by changing the group (G-xx) designation to 30 or 100, respectively.
Figure 2-14 15-Pin Type "D" Female Connector

2.5.7 International Warning Symbol for
Users and TechniciansThis symbol is intended to alert the user to the presence of important
operating and maintenance (servicing) instructions in the literatureaccompanying the instrument.

2.5.8 Recorder
A BNC type connector that supplies analog voltage proportional to rate or
thickness (mass). The specific function is determined by configuration switches
9-14, refer to section 2.5.2 on page 2-15.
IPN 074-186S

Figure 2-15 BNC Connector

2 - 20XTM/2 Operating Manual

2.5.9 Comm. Option
Location of optional computer interface, see section 3.8 on page 3-16 for setup
details.
Figure 2-16 IEEE-488 Option

2.5.10 Manufacturer’s Identification and
Serial Number Plate
This plate is installed at final assembly to identify the instrument’s model andserial numbers.

IPN 074-186S

Figure 2-17 Serial Number Plate

2 - 21

XTM/2 Operating Manual

2.6 Operation as a Deposition Monitor
Although this instrument is designed as a vacuum deposition/etch monitor, it isalso easily used for many other types of mass measurement applications. It iseasily installed by reviewing section 2.3 on page 2-7 for a schematic view of theinstallation requirements and section section 4.1 on page 4-1 for an overview
of instrument function.
The following discussion is divided into four segments. The first is forapplications that do not require a source shutter. The second relates to thosethat use a source shutter. The third section is a simple application of the
instrument for manual rate sampling. The fourth segment is directed towards
those applications that are nontraditional; including biological, electroplating,etching and the measurement of liquid samples. The units may be programmedin Å/KÅ or µgm/mgm/ngm depending on the setting of configuration switches 9
and 10, refer to section 2.5.2 on page 2-15. If these switches are subsequently
changed, the two thickness parameter values of the active film areappropriately recomputed.

2.6.1 Monitoring - Systems Without a Source Shutter
To operate the instrument as a film rate/thickness monitor only the following
three parameters need to be programmed. Press the PROG key to switch thedisplay in the program mode and enter the appropriate values. The values
entered for these parameters are independent of which units are chosen for
display (thickness or mass).

Z-RATIO . . . . . . . . . . . . . . . . . . . . Depends on the material to be measured,
see Appendix A, Table of Densities andZ-ratios.
TOOLING . . . . . . . . . . . . . . . . . . . Corrects for the geometrical differences
between the sensor and the substrate, seesection 5.3 on page 5-2.
Properly mount and attach the appropriate transducer (see section 3.5 on page
3-7).
Press the PROG key to change the display between the program and operatemodes.
The Rate display group will indicate the evaporation rate and the Thickness(mass) display group will increment accordingly. The front panel controls worknormally.

2 - 22

IPN 074-186S

DENSITY . . . . . . . . . . . . . . . . . . . Depends on the material to be measured,
see Appendix A, Table of Densities andZ-ratios.

XTM/2 Operating Manual

2.6.2 Monitoring - Systems with a Source Shutter
In addition to measuring rate and thickness, these instruments can be used toterminate the deposition at the proper thickness. Implementation requires thatthe deposition system have a source (or substrate) shutter capable of automatic
operation. The source shutter controller must be wired through the SYSTEM I/O
connector on the rear panel of the instrument. The following parameters (inaddition to those required in section 2.6.1 on page 2-22) must also be
programmed.
FINAL THICKNESS . . . . . . . . . . . Program to the desired film thickness (ormass).
The operator manually increases the source power (using the source power
supply’s control) to the nominal operating level. Once the user is satisfied, thedeposition begins when the OPEN switch is pressed. This action zeros theaccumulated thickness display and opens the source shutter. The operator
must then adjust the source power manually to achieve the desired rate. The
shutter will close automatically when the final thickness set point is achieved.

2.6.3 Rate Sampling
It is possible to use these instruments to periodically sample the rate in adeposition system. A shuttered transducer must be used, see section 3.4 on
page 3-6.

IPN 074-186S

NOTE: It will be useful to refer to the separate INFICON Crystal Sensor Manual(see list below) for transducer and actuator control valve installation.
IPN
Type
074-154 . . . . . . Bakeable
074-155 . . . . . . CrystalSix
074-156 . . . . . . Standard, Compact and Dual074-157 . . . . . . Sputtering

1 Electrically connect the pneumatic shutter actuator control valve (IPN
007-199) to the sensor shutter pins (1, 2) of the SYSTEM I/O connector.

2 Program the FINAL THICKNESS parameter to a value which allows
approximately 20 seconds of material accumulation onto the sensor head.
For example, if the nominal rate is 20 Å/sec, set the final thickness to 20 sec
x 20 Å/sec = 400Å. If the sample time is too short there could be errors
induced by temperature transients across the monitor crystal.
A sample is initiated by pressing OPEN. This zeros the displayed thickness andopens the sensor shutter. The operator may view the deposition rate display(allowing it to stabilize) and then comparing it to the desired rate. If a time longer
than the programmed sample time is required to adjust the actual deposition
rate the operator can increase the FINAL THICKNESS value.
NOTE: This arrangement does not allow automatic substrate final thickness
termination.

2 - 23

XTM/2 Operating Manual

2.7 Nontraditional Applications
In addition to their normal application as a deposition monitor/controller, quartz
crystal microbalances have significant utility as generalized mass sensors. Thisparticular instrument family is capable of measuring mass increases ordecreases on the face of the monitor crystal to an accuracy of +/- 1.23
nanograms/cm2 in a single 250 ms measurement (density = 1.00, z = 1.00). As
always, it is imperative that the mass be well adhered to the face of the crystal
or improper readings will be taken. It is especially important to recognize thisrequirement for measurements of liquids or other non-rigid materials.
INFICON’s 6MHz crystal holders have an open area of ~0.535 cm2. For thehighest accuracy possible, it is suggested that the individual crystal holder bemeasured with a traveling microscope to determine the exact opening area.

2.7.1 Etching
The instrument may be configured to display the thickness or mass removed
from the face of a crystal. It is imperative that the material be removed uniformly
over the active area of the crystal or improper readings will be taken. This
inaccuracy occurs because of radial mass sensitivity differences across theface of the monitor crystal.
The etch mode is established by setting a configuration switch (refer to section
2.5.2 on page 2-15) on the back of the instrument.
The unit is operated normally, with the ZERO or START keys used to zero thedisplayed thickness. The FINAL THICKNESS parameter may be programmed
to terminate the process.

Measurement of mass change in liquids is a relatively new field, consequently
application information is limited. The energy loss from the vibrating crystal into
the liquid environment is high, limiting the accuracy of the measurement insome cases. The ModeLock oscillator again provides superior performance,
allowing operation in liquids of higher viscosity than an active oscillator system
would provide. The presence of bubbles on the face of the crystal as it isimmersed will drastically change the noted frequency shift and alter thesensitivity of the technique from immersion to immersion. Special transducers
may be required as many liquids can electrically short the crystal’s drive voltage
and induce a crystal failure.
NOTE: It is not recommended to use standard INFICON transducers in liquids
without modification.

2 - 24

IPN 074-186S

2.7.2 Immersion in Liquids

XTM/2 Operating Manual

2.7.3 Biological
The measurement of biological specimens is subject to many of the sameproblems as covered in the measurement of liquids.

2.7.4 Measurement of Liquids
The measurement of the mass of a liquid on the face of a crystal is a techniquethat is subject to very large errors. The two primary problems with liquids arethat they are not infinitely rigid structures and do not necessarily form in uniform
layers. Because liquids do not oscillate as a rigid solid, not all of the mass
participates in the resonance. Consequently, not all of the liquid is detected. In
some ways, the crystal is more appropriately called a viscosity sensor. The
second problem is that liquids tend to form spheres on the face of the crystal
after only very modest accumulations of a few monolayers. This aggravates the
problem caused by non-infinite rigidity. Another aspect of the problem is that theliquid spheres form at random locations across the crystal. Because monitor
crystals have differential radial mass sensitivity an uncontrollable measurement
problem exists. Spheres formed at the center of the crystal contribute more thanspheres formed near the edge of the sensor’s aperture.

2.7.5 Use as a Frequency Counter

IPN 074-186S

The ability to measure a crystal’s frequency between 6.000000 and 5.000000
MHz may be accessed by setting the "displayed units" configuration switches 9
and 10 (refer to section 2.5.2 on page 2-15). The displayed frequency isaveraged according to the setting of the recorder and display averaging
configuration switches. In addition, by pressing the LIFE key, even finer
frequency resolution is displayed (x.xx or x.x Hz), suppressing the mostsignificant data. Data to 0.1 Hz is always available through the computerinterface for the latest 0.25 sec. measurement.
The recorder output and programmed limits of this instrument behave as if the"displayed units" configuration switches were set to 00 or "kÅ".

2 - 25

XTM/2 Operating Manual

2.7.6 Contamination Detection
The measurement of a crystal’s mass loss or gain is enhanced by utilizing the
averaging and displayed units configuration switches, refer to section 2.5.2 on
page 2-15. These may be used to directly display the mass change inmicrograms (µgm) or milligrams (mg). In addition, the displayed resolution may
be enhanced by increasing the measurement time averaging to as long as 16
seconds. This technique reduces the relative noise in the ratio of the squareroot of the sample time.

IPN 074-186S

The limiting problem will most probably be either temperature changes of themonitor crystal or the instrument’s reference crystal. Careful temperature
control can minimize these effects.

2 - 26

XTM/2 Operating Manual

Chapter 3
Installation
3.1 Installing the Instrument - Details
A general schematic of instrument installation is given in section 2.3 on page
2-7, use it for reference. The importance of grounding the instrument cannot be
over emphasized for both safety and performance needs.

3.1.1 Control Unit Installation
Review the specific suggestions and warnings concerning safety andinstallation that are presented in section 1.1 on page 1-1.
It is generally advisable to centrally locate the controller, minimizing the lengthof external cabling. The cable from the instrument to the XIU is 15’ (4.572 m).
Longer cables are specifiable as 30’ (9.144 m) or 100’ (30.28 m), refer tosection 2.5.6 on page 2-20 for ordering details.
The monitor unit is designed to be rack mounted. It may be also used on a table;
four self-adhesive rubber feet are included in the ship kit for this purpose.

3.2 Electrical Grounding and Shielding
Requirements

IPN 074-186S

Careful consideration of simple electrical guidelines during installation will
avoid many problems caused by electrical noise.
To maintain the required shielding and internal grounding as well as insuring
safe and proper operation, the instrument must be operated with all enclosure
covers and option panels in place. These must be fully secured with the screws
and fasteners provided.

3-1

XTM/2 Operating Manual

3.2.1 Verifying / Establishing Earth GroundIf local facilities engineering cannot provide a low impedance earth groundclose to the instrument, the following procedure is recommended.
Where soil conditions allow, drive two ten foot copper clad steel rods into theground six feet apart. Pour a copper sulfate or other salt solution around therods to improve the soil’s conduction. A near zero resistance measurement
between the two rods indicates that a desirable earth ground has been
established. In severe cases it may take several soakings of solution over
several days to reach this condition.
NOTE: Keep connections to this grounding network as short as possible. Most
noise transients contain significant power at high frequencies. A long
path adds to the ground circuit's inductance and thereby increases its
impedance at these frequencies.

3.2.2 Connections to Earth GroundThe ground connection on the instrument is a threaded stud with a hex nut. It
is convenient to connect a ring terminal to the ground strap, thus allowing agood connection with easy removal and installation. See Figure 3-1 for thesuggested grounding scheme. In many cases, a braided ground strap issufficient. However, there are cases when a solid copper strap (0.030" (0.762mm) thick X 1" (25.4 mm) wide) is more suitable because of its lower RF
impedance.
Figure 3-1 System Grounding Diagram%DFN3DQHO
7UDQVGXFHU)HHGWKURXJK
IPN 074-186S*URXQG6WXG(DUWK*URXQG

3-2

9DFXXP6\VWHP

XTM/2 Operating Manual

CAUTION
An external ground connection is required to ensure
proper operation, especially in electrically noisy
environments.
When used with RF powered sputtering systems, the grounding scheme may
have to be modified to optimize the specific situation. An informative article on
the subject of "Grounding and RFI Prevention" was published by H.D. Alcaide,in "Solid State Technology", p 117 (April, 1982).

3.2.3 Minimizing Noise Pickup from External Cabling

IPN 074-186S

When an instrument is fully integrated into a deposition system, there are many
wire connections; each a potential path for noise to be conducted to the inside.
The likelihood of these wires causing a problem can be greatly diminished byusing the following guidelines:Use shielded coax cable or twisted pairs for all connections.



Minimize cable lengths by centralizing the controller.



Avoid routing cables near areas that have the potential to generate highlevels of electrical interference. For example, large power supplies, such as
those used for electron beam guns or sputtering sources, can be a sourceof large and rapidly changing electro-magnetic fields. Placing cables as little
as 1 foot (305 mm) from these problem areas can be a very significant
improvement.

Be sure that a good ground system and straps are in place asrecommended above.

Ensure that all instrument covers and option panels are in place and tightly
secured with the provided fasteners.

3-3

XTM/2 Operating Manual

3.3 Connection to Rear Panel
The long term performance of this instrumentation is dependent on the qualityof the installation. A first rate installation includes the proper assembly of theuser/OEM installed cabling. The assembly instructions for the connectors usedon this instrumentation are shown in the following sections.

3.3.1 The BNC Connectors
Because complete BNC cables are so common, there are no mating connectors
supplied in the ship kit for the source and recorder outputs. It is recommended
that completed BNC type cables be purchased locally, even if one end is cut off
for connection to the external apparatus.

3.3.2 The "D" Shell Connectors
The "D" shell connectors use solder cup contacts that will accept solid or
stranded wire with a maximum individual wire size of 20 AWG. Multiple stranded
wire jumpers may equal 18 AWG, or two 22 AWG wires may be employed. The
recommended wire strip length is 1/4" (6.4 mm).
The duplex tin/lead solder cup readily accepts tinned leads and will securely
strain-relieve wires when properly soldered. See Figure 3-2 on page 3-5.
The American National Standards Institute Standards For Soldering Electronic
Interconnections (ANSI/IPC-S-815A) is recommended for establishingsoldering quality guidelines.
The soldering procedure is as follows:

1 Obtain a connector and wire(s) of the type and size required for yourapplication.
that may inhibit solderability.

3 Strip wire(s) to recommended strip length of 1/4" (6.4 mm). Tin the leads if
required.

4 Obtain resin flux, 40/60 alloy solder, and a low-wattage soldering iron.
NOTE: It is common to use heat shrink tubing over solder joints to insulate theexposed solder connection at the cup. If using heat shrink tubing,ensure that the tubing sections are cut to proper length and placed on
the wire(s) prior to soldering. After wires are terminated, slide tubing
over solder connections and shrink with an appropriate heat source.

3-4

IPN 074-186S

2 Ensure that surfaces to be soldered are clean and free of any contaminants

XTM/2 Operating Manual

5 Coat the stripped portion of the wire(s) with the flux and insert into the solder
cup of the contact until the conductor is bottomed in the cavity.

6 Heat the solder cup with the soldering iron and allow the solder to flow into
the cup until the cavity is filled but not over filled.

7 Continue soldering wires until all terminations are complete.
8 Clean the soldered connections with a suitable alcohol/water rinse toremove flux and solder residue.
Figure 3-2 Solder Cup Connector

Wire Strip
Length 1/4" (6.4 mm)
Solder Cup
Contacts

IPN 074-186S

GroundingIndents(Plug Only)

3-5

XTM/2 Operating Manual

3.4 Sensor Selection Guide
The choice of sensor type must be dictated by the process, the depositionmaterial and the physical characteristics of the process chamber. General
guidelines for each sensor type produced by INFICON are outlined in the
Sensor Selection table below. For specific recommendations, consult your
INFICON representative.
Table 3-1 Sensor Selection Table

Name

IPN

Temp
°C

Crystal
Exchange

Utility
Connector

Comments

Standard

750-211-G1

130°

Front

Side

Standard
w/Shutter

750-211-G2

130°

Front

Side

Compact

750-213-G1

130°

Front

Rear

For tight spaces

Compact
W/Shutter

750-213-G2

130°

Front

Rear

For tight spaces

Dual750-212-G2

130°

Front

Side

Two crystals forcrystal switch.
Includes Shutter

Sputtering

007-031

130°

Rear

Side

For RF and diodesputtering. (Optional
shutter available.)

007-219
007-220007-221

450°

Front

Side

Must remove watercooling and open the
tubes prior to bakeout12" (304.8 mm)
20" (508 mm)
30" (762 mm)

750-012-G1
750-012-G2
750-012-G3

450°

Front

Side

Must remove watercooling and open the
tubes prior to bakeout

CrystalSix

750-446-G1

130°

Front

Side

6 crystals for processsecurity.

Bakeable12" (304.8 mm)
20" (508 mm)
30" (762 mm)*These temperatures are conservative maximum device temperatures, limited by the propertiesof Teflon at higher temperatures. In usage, the water cooling allows operation in environmentsthat are significantly elevated, without deleterious effects.

NOTE: Do not allow water tubes to freeze. This may happen if the tubes passthrough a cryogenic shroud and the water flow is interrupted.
NOTE: For best operation, limit the maximum input water temperature to lessthan 30 °C.
NOTE: In high temperature environments more heat may transfer to the water
through the water tubes than through the actual transducer. In extreme
cases it may be advantageous to use a radiation shield over the watertubes.

3-6

IPN 074-186S

Bakeable
w/ShutterXTM/2 Operating Manual

3.5 Guidelines for Transducer Installation
WARNING
The performance of this instrument depends on the
careful installation of the chosen transducer. Improper
installation will cause problems with deposition
repeatability, crystal life and rate stability.

3.5.1 Sensor Installation

IPN 074-186S

Figure 3-3 shows a typical installation of an INFICON water cooled crystal
sensor in the vacuum process chamber. Use the illustration and the following
guidelines to install your sensors for optimum performance and convenience.

3-7

XTM/2 Operating Manual
Figure 3-3 Typical Installation

Mounting Bracket
Coax Cable(Routed with
Water Tubes)

SensorShutter
Brazing
Adapters
Or,
Customer Supplied
Cajon Coupling

Source to Sensor
10" Minimum
SourceShutter

SourcePneumatic
ActuatorTo
Source Controller

Water InIPN 007-199
Shutter
Solenoid
AssemblyOutIn

XIU (Oscillator)
IPN 757-302-G1
IPN 074-186S

ManualControl

To Pins 1, 2
or System I/O

Water Out

Air, 80 PSI, 110 PSI Max.

ManualSwitching

3-8

XTM/2 Operating Manual

Generally, install the sensor as far as possible from the evaporation source (aminimum of 10" or 254 mm) while still being in a position to accumulate
thickness at a rate proportional to accumulation on the substrate. Figure 3-4
shows proper and improper methods of installing sensors.
To guard against spattering, use a source shutter or crystal shutter to shield thesensor during the initial soak periods. If the crystal is hit with even a minuteparticle of molten material, it may be damaged and stop oscillating. Even incases when it does not completely stop oscillating, it may become unstable.
SENSORS
Figure 3-4 Sensor Installation GuidelinesC O RREC T

INC O RREC TO BSTRUC TIO N

INC O RREC T

C O RREC T

INC O RREC T

IPN 074-186S

SO URC E

3-9

XTM/2 Operating Manual

3.5.2 CrystalSix
Installing the CrystalSix transducer requires that the crystals be manuallyadvanced. Follow the guidelines in the CrystalSix Operating Manual (IPN
074-155) and Figure 3-5.

IPN 074-186S

Figure 3-5 CrystalSix Installation for XTM/2

3 - 10XTM/2 Operating Manual

3.5.3 Check List for Transducer Installation


Mount the sensor to something rigid and fixed in the chamber. Do not relyon the water tubes to provide support.

Plan the installation to insure that there are no obstructions blocking thepath between the Sensor and the Source. Be certain to consider rotating or
moving fixtures.

Install sensors so their central axis (an imaginary line drawn normal to thecenter of the crystal’s face) is aimed directly at the virtual source being
monitored.

Be sure there is easy access for the exchange of crystals.

For systems employing simultaneous source evaporation (co-dep), try tolocate the sensors so the evaporant from each source is only flowing to one
sensor. This is not generally possible to do without special shielding or
optional "material directors" for the transducers.



The use of water cooling is always recommended, even at very low heatloads and low rates.

If penetrating a cryogenic shroud, be sure that the cooling water is kept
flowing or drained between uses. Failure to do so could cause the water tofreeze and the water tubing to rupture.



Avoid running cold water tubes where condensation can drip into thefeedthroughs. This condensate can effectively short the crystal drive
voltage, causing premature crystal failure.

IPN 074-186S

3.6 Use of the Test Mode
This instrument contains a software controlled test mode which simulates
actual operation. The purpose of the Test Mode is to verify basic operation andfor demonstrating typical operation to the technician.
The Rate displayed during Test Mode operation is determined as follows:·
40
TOOLING (%)
Displayed Rate = -------------------------------------------------- × ---------------------------------------- Å/sec
DENSITY (gm/cc)
100%

[1]

All relays and inputs operate normally during Test Mode operation.

3 - 11

XTM/2 Operating Manual

3.6.1 Operational Test
The power switch should be in the STBY position before the instrument isconnected to line power.
Perform the self test as follows:

1 Verify that no system cables other than the power cord are connected to theunit. Relays may be verified with an ohm meter or custom test box.

2 Set configuration switch 1 to the "ON" position.
3 Press the ON/STBY switch, the green power LED should illuminate. If Err
is displayed on the LCD, see section 6.2 on page 6-1.

4 The following LCD displays will appear:
TEST
XX:XX PHASE MIN:SEC
XTAL FAIL

5 Press the PROG key. The program display will appear and the cursor will
be located beside DENSITY.

6 Refer to the list of parameters in Table 3-2 and enter the dataas they are given.
Table 3-2 Operational Test Parameters

02.73

Z-RATIO

1.000

TOOLING

110

gm/cc
%

FINAL THICKNESS 2.000

KÅ

SPT THICKNESS

1.000

KÅ

SPT TIMER

1:00

min:sec

NOTE: There is a built-in "TEST FILM" with all of the parameters
preprogrammed, as shown in Table 3-2. It is accessed by moving
the cursor to the FILM parameter and entering zero. The two
thickness values will be modified if the mgm or µgm display mode
has been selected. Press the PROG key to exit the display modeand continue with step 9.

7 When the correct sequence of numerals appear in the flashing display,press thekey to enter and store the data.

8 Press the PROG key to exit the program display.
9 Press OPEN to begin the programmed sequence.
10 The SHUTTER OPEN annunciator is displayed.

3 - 12

IPN 074-186S

DENSITYXTM/2 Operating Manual

11 The time begins to increment from 00:00 and the deposition rate will be 16.1
Å/s. The THICK SPT annunciator is lit at 1.000 kÅ and the TIMER SPT lights
at 1:00 min:sec. Reaching the FINAL THICKNESS parameter of 2.000 kÅ
takes and elapsed time of 02:05, then after reaching FINAL THICKNESS
limit the SHUTTER OPEN annunciator disappears. The clock immediately
begins counting up from 00:00 again.

12 The instrument will remain in this mode until OPEN is pressed.
13 When OPEN is pressed, the process will repeat steps 11 through 13.
14 After successful completion of the above steps, power down the instrument

IPN 074-186S

to leave the TEST mode by turning configuration switch 1 "OFF" and thenplacing the unit first in STBY and then "ON" to read the new configuration.

3 - 13

XTM/2 Operating Manual

3.7 Input and Output Details
3.7.1 Relays
WARNINGThe relay, relay circuit, and associated pins in the I/O
connector(s) have a maximum voltage rating of
30 V(dc) or 30 V(ac) RMS or 42 V(peak). The maximum
current rating per connector pin or relay contact is
2.5 Amps.
Their function is as follows:
Table 3-3 System I/O Connector

Pin #Function*

Closed Contacts

Open Contacts

Relay #

1,2

Source Shutter

During "Shutter Open"State.

Balance1

3,4

Thickness
Setpoint

When SPTTHICKNESS is
exceeded.

Balance2

5,6Timer Setpoint

When SPT TIMER is
exceeded.

Balance3

7,8

Crystal Fail

When crystal fails tooscillate.

Balance

4

IPN 074-186S

Function may be overwritten by Remote Communications Commands "R6 - R9", seesection 3.8.5 on page 3-22.

3 - 14

XTM/2 Operating Manual

3.7.2 Inputs
Inputs are activated by pulling the specific input's terminal to ground (<0.8V)
through a contact closure to common (GND) or with TTL/CMOS logic having
current sink capability of 2 ma (1 low power TTL load). These ports are readevery 250 ms; signals must be present during a read cycle.
Table 3-4 System I/O Connector

Pin #Function

Description

Input Common (GND)

Used as reference for activating
any of the inputs

18

OPEN

Detection of a falling edge
duplicates front panel OPEN

1

19

CLOSE

Detection of a falling edge
duplicates front panel CLOSE

29CRYSTAL FAIL
INHIBIT

Presence of a closure to groundreference prohibits the closureof the Crystal Fail Relay.

3

20

ZERO thickness

Detection of a falling edge
duplicates the front panel
ZERO, for thickness only.

4

21

ZERO timer

Detection of a falling edge
duplicates the front panel ZEROfor the timer only.

5

14,15,16,17

Input #

IPN 074-186S

3.7.3 Chart Recorder
The chart recorder output has 12 bit resolution with one additional bit of sign
information over the range of -10 to +10 volts. It can supply up to 5 milliamps
and has an internal resistance of 100 ohms. The output is proportional to rate,
thickness or rate deviation depending on the setting of the configuration
switches; see section 2.5.2 on page 2-15. It is normal for ripple to appear onthese outputs to a maximum of 5 mV at ~84 Hz. This output is updated every
250 milliseconds.

3 - 15

XTM/2 Operating Manual

3.8 Computer Communications
This instrument supports a number of standard and optional computercommunications protocol formats. RS232 is standard, operating in either
INFICON checksum or non-checksum as well as SECS II formats. The unit may
also be configured to automatically output process data (data logging) uponreaching FINAL THICKNESS. Pressing the shutter CLOSE switch on the front
panel will also initiate a data dump.

3.8.1 Communications Setup
The XTM/2 has serial communications as a standard feature. Rates from 1200
to 9600 baud are accommodated. Refer to section 2.5.5 on page 2-19 for
RS232 connector details.
To configure the remote communication interface, hold down the 0 key during
power up. The following set of parameters can then be entered using the digits,
enter, and clear keys.
tyPE(0 = INFICON Checksum, 1 = INFICON no checksum, 2 = SECS, 3 = Datalog)d ID(Device ID 0-32767)

t1(Timer 1 per SECS definition) (0-10.0 seconds)

t2(Timer 2 per SECS definition) (0.2-25.0 seconds in 0.2 increments)

rtrY(Retry limit per SECS definition) (0-31)

dUPL(Duplicate block per SECS definition)

baUd (0=1200, 1=2400, 2=4800, 3=9600)
IEEE(IEEE address, 0-30) - requires optional hardware

When this list is complete, the RECEIVE message is flashed and the choice will
be given to either repeat the list or continue with normal operation. Pressing
ENTER will continue with normal operation. Pressing CLEAR will repeat the list.
NOTE: Do not turn the unit off while in the Communications Program Mode,otherwise the new parameter values will not be saved properly.

3 - 16

IPN 074-186S(If SECS is chosen for tyPE the next 5 parameters are accessed):XTM/2 Operating Manual

3.8.1.1 IEEE Settings for a National Instruments IEEE-GPIB Board
When establishing IEEE communications the following settings are found towork using a National Instruments IEEE-GPIB board. These values are set
using the IBCONF.EXE file provided by National Instruments.
Figure 3-6 Board Characteristics

IPN 074-186S

Figure 3-7 Device Characteristics

3 - 17

XTM/2 Operating Manual

3.8.2 Basic Command Structure
The following commands are available via the computer communications:E . . . . . . Echo. Returns the sent message.
H . . . . . . Hello. Returns the model and software version number.
Q . . . . . . Query. Interrogates the programmable parameters and returns thevalue of parameter requested.
U . . . . . . Update. Replaces the particular parameter with the value sent.
S . . . . . . Status. Sends back pertinent information based on the specificrequest made.
R . . . . . . Remote. Perform an action based on the specific command given.
Many of these mimic front panel keystrokes.
The send and receive protocol formats are described below and use thefollowing abbreviations:
STX . . . . Start of transmission character
00,NN . . The size of the command is 2 bytes long with 00 representing thehigh order Byte and NN representing the low order byte.
ACK . . . . Command acknowledged character
NAK . . . . Command not acknowledged character
LF . . . . . Line Feed (EOT byte for IEEE)
CS . . . . . Checksum
CR . . . . . Carriage Return

To XTM/2:

STX 00 NN message_string CS

From XTM/2:

STX 00 NN ACK message_string CS(if success)- or STX 00 NN NAK error_code CS(if failure)

NONCHECKSUM FORMAT (Message Protocol) (RS232)
To XTM/2:

message_string ACK

From XTM/2:

message_string ACK(if success)- or error_code NAK

3 - 18(if failure)

IPN 074-186S

CHECKSUM FORMAT (Message Protocol)

XTM/2 Operating Manual

IEEE488 FORMAT (Message Protocol)
To XTM/2:

message_string LF d10 (CHR$10)

From XTM/2:

message_string LF(if success)- or error_code LF(if failure)

SECS FORMAT (Message Protocol)
To XTM/2:

NN SECS_10_BYTE_HEADER message CS CS

From XTM/2:

NN SECS_10_BYTE_HEADER ACK message CS CS(if success)- or NN SECS_10_BYTE_HEADER NAK error_code CS CS(if not)

If there is a problem, the unit will return a NAK preceded by one of the following
Error Codes:
A. . . . . . . Illegal command
B. . . . . . . Illegal Value
C . . . . . . Illegal ID
D . . . . . . Illegal command format
E. . . . . . . No data to retrieve
F . . . . . . . Cannot change value now

IPN 074-186S

G . . . . . . Bad checksum
NOTE: When transmitting commands directly by typing on a keyboard, theentire command, including the "ACK", must be entered quickly.
Otherwise, the instrument will fail to recognize the transmission as avalid command.

3 - 19

XTM/2 Operating Manual

3.8.3 Service Requests and Message Available
In the IEEE mode there are a number of events which will trigger service
requests, a request by the instrument to transmit information to the host. The
instrument does this by triggering the RQS bit of the Status Byte. A host initiatedserial poll then identifies the requesting device by the presence of a 1 in the
RQS (26) bit of the status byte. The particular service request generator event
is encoded in bits 20 - 23 inclusive, as shown below:
RQS
27

26

not
used

MAV
25

24

23

22

21

20

Result of Serial Poll

not
used
Service request
generation encoding

Generator Event

Code

Value

FINAL THICKNESS

0001

1

STBY/ON sequence

0100

4

Crystal Fail

0110

6

250ms DATA READY. Available only
after R23 is issued, see page 3-26.
This is automatically cleared on
crystal failure.

0111

7

TIMER SPT exceeded

1000

8

THICKNESS SPT exceeded

1001

9

It takes the instrument various lengths of time to formulate a correct response
to queries for information. To avoid unnecessarily repeated bus traffic, it issuggested that the host monitor the MAV (message available) status bit todetermine when a response for information is fully assembled and ready totransmit.

3 - 20

IPN 074-186S

Table 3-5 Service Request EncodingXTM/2 Operating Manual

3.8.4 Datalogging
Data logging may be configured to be automatic, see section 3.8.1 on page3-16. The RS232 port is then configured to output the DATALOG information
only and cannot receive commands from a host computer. The IEEE option, if
installed, will continue to work in the normal fashion.
The Datalog data output represents the information concerning the latest
SHUTTER OPEN to SHUTTER CLOSE sequence. The data is a series of ASCII
strings, each separated by a carriage return (CR) and line feed (LF), in the order
below:
1

Film #

2

Rate = _ _ _.__Å/s [or ngm/sec or µgm/sec] [Last good rate if crystal failed]3

Thickness = _ _ _ _._ _ _ _ kÅ [or µgm or mgm] [Last good thickness if crystal failed]4

Deposit Time = _ _:_ _ Min:Sec.

5

Begin Frequency = _ _ _ _ _ _ ._ Hz

6

End Frequency = _ _ _ _ _ _ ._ Hz [negative of last good frequency if crystal fail]7

Crystal Life = _ _%IPN 074-186S

In addition to automatic datalogging, the datalog information string is available
via execution of the S12 communications command, or may be manually
initiated by pressing the CLOSE (shutter) key on the front panel.

3 - 21

XTM/2 Operating Manual

3.8.5 Computer Command Details
3.8.5.1 Echo Command
Echoes the message, i.e., returns the sent message.
The format is: E message string
3.8.5.2 Hello Command
The HELLO command will return the string "XTM/2 VERSION x.xx" where x.xx
is the software revision code.
The format is: H
3.8.5.3 Query Command
The Query command returns information concerning current instrument
parameter values.
The format of the query command is:
Q P F - Query parameter P of film F. A space is used as a delimiter between P
and F, where F is a digit between 1 and 9, inclusive,orQ 6 - Query the current film number.

PP

XTC/2 Parameter

Range

0

Tooling

10 to 500.9 (%)

1

Final Thickness

0 to 999.9999 (kÅ/µgm/mgm)

2

SPT Thickness

0 to 999.9999 (kÅ/µgm/mgm)

3

Density

0.5 to 99.999 (gm/cc)

4

Z-ratio

0.1 to 9.999

5

SPT Time

00:00 to 99:59 (min:sec)

6

Film Number

1-9

99

All

See note below

Note: Q 99 F returns parameters 0 to 5 for film F in theorder and ranges as specified above; each parameter isseparated by a space.

3 - 22

IPN 074-186S

Table 3-6 Parameter Definition Table (for Query and Update Commands)

XTM/2 Operating Manual

3.8.5.4 Update Command
The format of the update command is:U P F vvv.
Update parameter P of film F, with value vvv. A space is used as a delimiter
between the P and F values as well as the F and vvv values, where F is a digit
between 1 and 9;inclusive. Refer to Table 4-2 on page 4-4 for a numbered listof parameters and their limits.
or
U6F
Set the current film number to film F
See Query Command Parameter Definition Table for numbered list ofparameters.
NOTE: The command "U 99 F Tooling Final Thickness SPT Thickness Density
Z-ratio SPT Time" will update all parameters for film F. All parametervalues must be separated by spaces and must use allowed values per
those shown in the Parameter Definition Table.
3.8.5.5 Status CommandSends back information based on specific request made.
The format of the status command is:
S xx . . . . Return the status (value) of xx
where:
S. . . . . . . Is the literal S
IPN 074-186S

xx . . . . . . One or two digit code per list below:
S 0 . . . . . Rate, Thickness, Time, Xtal-Life
S 1 . . . . . Rate
S 2 . . . . . Thickness
S 3 . . . . . TimeS 4 . . . . . Film
S 5 . . . . . Crystal life (%)

3 - 23

XTM/2 Operating Manual

S 6 . . . . . Output status - returns 8 ASCII bytes each with a value of 0 or 1.
S6 Response String
Output # Function
1

Source Shutter

2

Thick SPT

3

Timer SPT

4

Sensor Fail
Byte

8

7

6

5

not used

4

3

2

1

1 = closed contacts

S 7 . . . . . Input status - returns 8 ASCII bytes each with a value of 0 or 1.
S7 Response Strings
Input #

Function

1

Open Shutter

2

Close Shutter

3

Zero Thickness

4

Zero Timer

5

Crystal Fail Inhibit
Byte

8

7
not used

6

5

4

3

2

1

1 = grounded (active)

S 8 . . . . . Present frequency of Crystal

where
x is any digit 0 to 9
S character is a space when good readings are available or anegative sign for failed crystals
D character is:
0 when there is 0.25 second averaging
0 or 5 when there is 1 second averaging
Even Digit when there is 4 second averaging
x when there is 16 second averaging
S 9 . . . . . Crystal fail, 1 = Fail, 0 = Good3 - 24

IPN 074-186S

Sxxxxxx.xD

XTM/2 Operating Manual

S 10 . . . . Present configuration switch settings—returns 16 ASCII bytes with avalue of 0 or 1, corresponding to the position of switches 1-16. Byte
1 corresponds to switch 1. See S13 also.
S10 Response Strings
Byte 16 15 14 13 12 11 10 9

8

7

6

5

4

3

2

1

[1 = switch on, refer to section 2.5.2 on page 2-15]

S 11 . . . . Power-up errors
S11 Response Codes
0. . . . Parameter data checksum error—indicates a loss of stored
parameter data.
1. . . . STBY/ON sequence since last query—the front panel powerswitch has been used since the last inquiry.
2. . . . Line power failure.
9. . . . Process data checksum error—indicates a loss of processdata.
10. . . No errors.
NOTE: If more than 1 error condition exists, the response string will
list them all, each separated by a single space.
NOTE: STBY/ON status is cleared automatically by issuing an S11command. All others require intentional clearing (available
via remote command).

IPN 074-186SS 12 . . . . Datalog output, see section 3.8.4 on page 3-21. The data isseparated by a space instead of CR LF.
S 13 . . . . Instrument Configuration, the position of the configuration switchesat the last STBY/ON sequence. Use this command to determine theinstrument’s current operating configuration. See S10 also.

3 - 25

XTM/2 Operating Manual

3.8.5.6 Remote Command
The format of the remote command is:
R xx # . . A space is used as a delimiter between xx and #where:
R . . . . . . Is the literal R
xx . . . . . Is the remote code per list below.
# . . . . . . Is the associated value needed for some remote commands.
R 0. . . . . Open Shutter
R 1. . . . . Close Shutter
R 2. . . . . Locks out parameters via the front panel
R 3. . . . . Unlocks parameter changes via the front panel
R 4. . . . . Zeros Thickness accumulation
R 5. . . . . Zeros Timer
R 6. . . . . Output override on. [Allows external control of relays.]
R 7. . . . . Output override off.
R 8 # . . . Set output # (if output override on). [Closes Relay #, see section
3.7.1 on page 3-14.]
R 9 # . . . Clears output # (if output override on). [See R8.]
R 10. . . . Clear power up error messages. [See S11 commands.]
R 23. . . . Set "250ms Data Ready" Service request (IEEE only).

IPN 074-186S

R 24. . . . Clear "250ms Data Ready" Service request (IEEE only).

3 - 26

XTM/2 Operating Manual

3.8.6 Examples of RS232 Programs

IPN 074-186S

10 ’----XTM/2 RS232 COMMUNICATIONS PROGRAM WITHOUT CHECKSUM---20 ’
30 ’------THIS PROGRAM IS DESIGNED TO TRANSMIT INDIVIDUAL COMMANDS TO THE XTM/2
AND ACCEPT THE APPROPRIATE RESPONSE FROM THE XTM/2, WRITTEN IN GWBASIC 2.32.
40 ’
50 OPEN “COM1:9600,N,8,1,CS,DS” AS #1:’--OPEN COMM PORT 1
60 NAK$ = CHR$(21): ACK$ = CHR$(6):’--DEFINE ASCII CODES
70 ’
80 INPUT “ENTER COMMAND”; CMD$:’--ENTER COMMAND TO XTM/2
90 GOSUB 130:’--GOTO TRANSMIT COMMAND SUBROUTINE.
100 PRINT RESPONSE$:’--PRINT XTM/2 RESPONSE
110 GOTO 80:’--LOOP BACK FOR ANOTHER COMMAND.
120 ’
130 ’----TRANSMIT COMMAND AND RECEIVE RESPONSE SUBROUTINE---140 ’
150 ’----SEND COMMAND MESSAGE STREAM TO THE XTM/2---160 PRINT #1, CMD$ + ACK$;170 ’
180 ’----RECEIVE RESPONSE MESSAGE FROM THE XTM/2---190 RESPONSE$ = “”:’--NULL THE RESPONSE
200 TOUT = 3: GOSUB 260:’ STRING AND SET TIMER.
210 IF I$ = ACK$ THEN RETURN:’--IF THE END OF RESPONSE
220 IF I$ = NAK$ THEN RETURN:’ CHARACTER IS RECEIVED:’ GOTO PRINT RESPONSE.
230 RESPONSE$ = RESPONSE$ + I$:’--BUILD RESPONSE STRING
240 GOTO 200:’ CHARACTER BY CHARACTER.
250 ’
260 ’----READ SERIALLY EACH CHARACTER FROM THE INSTRUMENT INTO VARIABLE I$---270 ON TIMER (TOUT) GOSUB 300: TIMER ON
280 IF LOC(1) < 1 THEN 280 ELSE TIMER OFF: I$ = INPUT$(1,#1)
290 RETURN
300 TIMER OFF:’--INDICATE IF A CHARACTER
310 RESPONSE$ = “RECEIVE TIMEOUT”:’ IS NOT RECEIVED WITHIN
320 I$ = NAK$: RETURN 290:’ 3 SECS.

3 - 27

10 ’--XTM/2 RS232 COMMUNICATIONS PROGRAM WITH CHECKSUM USING THE INFICON FORMAT-20 ’
30 ’------THIS PROGRAM IS DESIGNED TO TRANSMIT INDIVIDUAL COMMANDS TO THE XTM/2
AND ACCEPT THE APPROPRIATE RESPONSE FROM THE XTM/2, WRITTEN IN GWBASIC 2.32.
40 ’
50 OPEN “COM1:9600,N,8,1,cs,ds” AS #1:’--OPEN COMM PORT 1
60 STX$ = CHR$(2) : NAK$ = CHR$(21) : ACK$ = CHR$(6):’--DEFINE ASCII CODES
70 ’
80 INPUT “ENTER COMMAND”; CMD$:’--ENTER COMMAND TO XTM/2
90 GOSUB 170:’--GOTO TRANSMIT COMMAND SUBROUTINE
100 IF RESPONSE$ = “RECEIVE TIMEOUT” THEN 140
110 L = LEN(RESPONSE$): L = L-1:’--STRIP OFF THE ACK OR
120 RESPONSE$ = RIGHT$(RESPONSE$,L):’ NAK CHARACTER FROM THE
130 ’:’ RESPONSE STRING.
140 PRINT RESPONSE$:’--PRINT XTM/2 RESPONSE
150 GOTO 80:’--LOOP BACK FOR ANOTHER COMMAND.
160 ’
170 ’----TRANSMIT COMMAND AND RECEIVE RESPONSE SUBROUTINE---180 ’
190 ’--BUILD COMMAND MESSAGE STREAM AND SEND TO THE XTM/2-200 SIZEM$ = CHR$(LEN(CMD$) / 256):’--CALCULATE THE 2 BYTE
210 SIZEL$ = CHR$(LEN(CMD$) MOD 256):’ SIZE OF THE COMMAND.
220 ’
230 CHECKSUM = 0:’--INITIALIZE CHECKSUM TO
240 FOR X = 1 TO LEN(CMD$):’ ZERO AND CALCULATE A
250 CHECKSUM = CHECKSUM + ASC(MID$(CMD$,X,1)):’ CHECKSUM ON THE COMMAND
260 NEXT X:’ STRING.
270 CHECKSUM$ = CHR$(CHECKSUM AND 255):’--USE LOW ORDER BYTE AS CHECKSUM.
280 ’
290 PRINT #1, STX$ + SIZEM$ + SIZEL$ + CMD$ + CHECKSUM$
300 ’
310 ’----RECEIVE RESPONSE MESSAGE FROM THE XTM/2---320 TOUT = 3: GOSUB 510:’--SET TIMER AND WAIT FOR
330 IF I$ <> STX$ THEN 290:’ START OF TRANSMISSION CHARACTER.
340 TOUT = 3: GOSUB 510:’--RECIEVE HIGH ORDER BYTE
350 SIZE = 256 * ASC(I$):’ OF TWO BYTE RESPONSE SIZE.
360 TOUT = 3: GOSUB 510:’--RECIEVE LOW ORDER BYTE
370 SIZE = SIZE + ASC(I$):’ OF TWO BYTE RESPONSE SIZE.
380 CHECKSUM = 0:’--SET CHECKSUM TO ZERO390 RESPONSE$ = “”:’ AND NULL THE RESPONSE
400 FOR I = 1 TO SIZE:’ STRING.BUILD THE
410 TOUT = 3: GOSUB 510:’ RESPONSE STRING AND
420 RESPONSE$ = RESPONSE$ + I$:’ CALCULATE THE CHECKSUM
430 CHECKSUM = CHECKSUM + ASC(I$):’ CHARACTER BY CHARACTER.
440 NEXT I
450 TOUT = 3: GOSUB 510:’--RECIEVE THE CHECKSUM
460 N = ASC(I$):’ CHARACTER AND COMPARE
470 Z = (CHECKSUM AND 255):’ IT TO THE LOW ORDER
480 IF N <> Z THEN PRINT “RESPONSE CHECKSUM ERROR”:’ BYTE OF THE CALCULATED
490 RETURN:’ CHECKSUM.
500 ’
510 ’----READ SERIALLY EACH CHARACTER FROM THE INSTRUMENT INTO VARIABLE I$---520 ON TIMER (TOUT) GOSUB 550: TIMER ON
530 IF LOC(1) < 1 THEN 530 ELSE TIMER OFF: I$ = INPUT$(1,#1)
540 RETURN
550 TIMER OFF:’--INDICATE IF A CHARACTER
560 RESPONSE$ =”RECEIVE TIMEOUT”: RETURN 570:’ IS NOT RECEIVED WITHIN
570 RETURN 490:’ 3 SECS.

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XTM/2 Operating ManualXTM/2 Operating Manual

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3.8.6.1 Example of SEMI II Program
10 ’XTM/2 RS232 COMMUNICATIONS PROGRAM USING THE SECS FORMAT
20 ’———THIS PROGRAM IS DESIGNED TO TRANSMIT———30 ’————INDIVIDUAL COMMANDS TO THE XTM/2—————
40 CLS
50 ’
60 ’
70 OPEN “COM1:2400,N,8,1,CS,DS” FOR RANDOM AS #1
80 EOT$ = CHR$(4): ENQ$ = CHR$(5): ACK$ = CHR$(6): NAK$ = CHR$(21)90 TOUT = 3
100 C = 0:CHECKSUM = 0: CHEKSUMM$ = CHR$(0): CHEKSUML$ = CHR$(0)110 INPUT “ENTER COMMAND”; CMD$
120 CMDLEN = LEN(CMD$): ’ CALUCULATE THE COMMAND LENGTH
130 ’
140 ’——ADD THE TWO BYTE PREAMBLE TO THE COMMAND——
150 PRE$ = CHR$(65) + CHR$(CMDLEN)
160 CMD$ = PRE$ + CMD$
170 CMDLEN = CMDLEN + 2
180 ’
190 ’——BUILD LENGTH BYTE, HEADER, TEXT, AND CHECKSUM BLOCK———
200 ’
210 ’—BUILD HEADER——
220 DID = 257: ’ DEVICE ID
230 ’RBIT = 0,:’ MESSAGE DIRECTION IS FROM HOST TO DEVICE
240 ’
250 ’——DETERMINE THE STREAM AND FUNCTION CODES——
260 ’
270 STREAM$ = CHR$(64): ’ USER DEFINED STREAM CODE
280 FUNCTION$ = CHR$(65): ’ USER DEFINED FUNCTION CODE
290 ’
300 ’
310 WBIT$ = CHR$(128): ’RESPONSE FROM XTM/2 REQUIRED320 STREAM$ = CHR$(ASC(WBIT$) + ASC(STREAM$))330 ’
340 ’——ENTER THE BLOCK BYTES——
350 ’
360 BYTE5$ = CHR$(128): ’ LAST BLOCK IN THE SERIES
370 BYTE6$ = CHR$(1): ’ ONLY BLOCK IN THE SERIES
380 ’
390 ’——ENTER THE SYSTEM BYTES——
400 ’
410 BYTE7$ = CHR$(0): BYTE8$ = CHR$(0): BYTE9$ = CHR$(0): BYTE10$ = CHR$(1)420 ’
430 ’———CALCULATE THE LENGTH BYTE————
440 LTHBYT = CMDLEN + 10: LTHBYT$ = CHR$(LTHBYT)
450 ’
460 ’———CALCULATE THE CHECKSUM————
470 FOR X = 1 TO CMDLEN
480 CHECKSUM = CHECKSUM + ASC(MID$(CMD$, X, 1))
490 NEXT X
500 BYTE1$ = CHR$(DID / 256)510 BYTE2$ = CHR$(DID MOD 256)520 CHECKSUM = ASC(BYTE1$) + ASC(BYTE2$) + ASC(STREAM$) + ASC(FUNCTION$) + ASC(BYTE5$) +ASC(BYTE6$) + ASC(BYTE7$) + ASC(BYTE8$) + ASC(BYTE9$) + ASC(BYTE10$) + CHECKSUM
530 CHEKSUMM$ = CHR$(FIX(CHECKSUM / 256))
540 CHEKSUML$ = CHR$(CHECKSUM MOD 256)
550 ’———HOST BID FOR LINE / DEVICE BID FOR LINE———
560 ’
570 PRINT #1, ENQ$;
580 I$ = “”: RESPONSE$ = “”590 C = C + 1
600 ON TIMER(TOUT) GOSUB 1000: TIMER ON

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610 IF LOC(1) < 1 THEN 610 ELSE TIMER OFF: I$ = INPUT$(1, #1)
620 IF C = 3 THEN 660
630 IF I$ = ACK$ THEN GOTO 580
640 IF I$ = NAK$ THEN RESPONSE$ = “COMMAND NOT ACKNOWLEDGED”: GOTO 1010
650 IF I$ = EOT$ THEN 690 ELSE REPOSNSE$ = “DEVICE NOT ACKNOWLEDGED”: GOTO 1010
660 IF I$ = ENQ$ THEN 790 ELSE RESPONSE$ = “DEVICE DID NOT BID FOR LINE”: GOTO 1010
670 ’
680 ’
690 ’———SEND COMMAND TO XTM/2——
700 ’
710 ’
720 HEADER$ = BYTE1$ + BYTE2$ + STREAM$ + FUNCTION$ + BYTE5$ + BYTE6$ + BYTE7$ + BYTE8$ + BYTE9$ +BYTE10$730 PRINT #1, LTHBYT$; HEADER$; CMD$; CHEKSUMM$; CHEKSUML$;
740 GOTO 580
750 ’
760 ’
770 ’———WAIT FOR DATA FROM XTM/2———
780 ’
790 ’———FIND SIZE OF RESPONSE——
800 ’
810 PRINT #1, EOT$;
820 I$ = “”
830 ON TIMER(TOUT) GOSUB 1000: TIMER ON
840 IF LOC(1) < 1 THEN 840 ELSE TIMER OFF: I$ = INPUT$(1, #1)
850 S = ASC(I$): L = S - 13
860 S = S + 2
870 ’
880 ’———RECEIVE RESPONSE TO COMMAND———
890 ’
900 I$ = “”: RESPONSE$ = “”910 FOR R = 1 TO S
920 ON TIMER(TOUT) GOSUB 1000: TIMER ON
930 IF LOC(1) < 1 THEN 930 ELSE TIMER OFF: I$ = INPUT$(1, #1)
940 RESPONSE$ = RESPONSE$ + I$
950 NEXT R
960 PRINT #1, ACK$;
970 RESPONSE$ = MID$(RESPONSE$, 13, L)
980 ’
990 GOTO 1010
1000 TIMER OFF: RESPONSE$ = “RECEIVE TIMEOUT”
1010 PRINT RESPONSE$
1020 ’
1030 GOTO 90

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XTM/2 Operating ManualXTM/2 Operating Manual

3.8.7 Example of IEEE488 Program

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10 ’----------------------XTM/2 GPIB COMMUNICATIONS PROGRAM-------------------20 ’------THIS PROGRAM IS DESIGNED TO TRANSMIT INDIVIDUAL COMMANDS TO THE XTM/2
AND ACCEPT THE APPROPRIATE RESPONSE FROM THE XTM/2, WRITTEN IN GWBASIC 2.32.
30 ’
40 ’----THE NEXT 5 LINES DEFINE THE IEEE DRIVERS USED AND ARE SPECIFIC TO THE
PARTICULAR IEEE BOARD IN YOUR COMPUTER AND THE LANGUAGE USED-------50 ’
60 CLEAR ,55000! : IBINIT1 = 55000! : IBINIT2 = IBINIT1 + 3
70 BLOAD “bib.m”,IBINIT1
80 CALL IBINIT1(IBFIND,IBTRG,IBCLR,IBPCT,IBSIC,IBLOC,IBPPC,IBBNA,IBONL,IBRSC,IBSRE,IBRSV,IBPAD,IBSAD,IBIST,IBDMA,IBEOS,IBTMO,IBEOT,IBRDF,IBWRTF)
90 CALL IBINIT2(IBGTS,IBCAC,IBWAIT,IBPOKE,IBWRT,IBWRTA,IBCMD,IBCMDA,IBRD,IBRDA,
IBSTOP,IBRPP,IBRSP,IBDIAG,IBXTRC,IBRDI,IBWRTI,IBRDIA,IBWRTIA,IBSTA%,IBERR%,IBCNT%)
100 ’
110 GPIB$=”GPIB0" :CALL IBFIND(GPIB$,GPIB%)’--OPEN BOARD FOR COMM
120 CALL IBSIC(GPIB%)’--SEND INTERFACE CLEAR
130 XTM2$=”XTM2" : CALL IBFIND(XTM2$,XTM2%)’--OPEN DEVICE 0
140 V% = &HA’--SET THE END OF STRING
150 CALL IBEOS(GPIB%,V%)’ BYTE TO LINE FEED
160 V%=1 : CALL IBEOT(XTM2%,V%)’--ASSERT EOI ON WRITE
170 V%=12 : CALL IBTMO(XTM2%,V%)’--SET THREE SEC TIMEOUT
180 INPUT “ENTER COMMAND”;COMMAND$’--ENTER COMMAND TO XTM/2
190 CALL IBCLR(XTM2%)’--CLEAR THE XTM/2 COMM
200 GOSUB 240’--GOTO TRANSMIT COMMAND SUBROUTINE.
210 PRINT I$’--PRINT XTM/2 RESPONSE
220 GOTO 180’--LOOP BACK FOR ANOTHER COMMAND.
230 ’
240 ’----TRANSMIT COMMAND & RECEIVE RESPONSE SUBROUTINE---250 ’
260 ’----SEND COMMAND MESSAGE STREAM TO THE XTM/2---270 COMMAND$ = COMMAND$ + CHR$(&HA)
280 CALL IBWRT(XTM2%,COMMAND$)
290 ’
300 ’----RECEIVE RESPONSE MESSAGE FROM THE XTM/2---310 ’
320 I$=SPACE$(40) : CALL IBRD(XTM2%,I$)
330 IF (IBSTA% AND &H4000) THEN 340 ELSE 350’--INDICATE IF A RESPONSE
340 PRINT “RECEIVE TIMEOUT”: GOTO 180’ IS NOT RECEIVED WITHIN
350 RETURN’ 3 SECS.

To implement serial polling of the Message Available (MAV) bit the following
lines may be added to the IEEE488 program listed above.

285 CALL IBRSP (XTM2%,SPR%)
287 B = SPR% / 16: B = INT(B)289 IF B = 1 THEN 290 ELSE 285
After sending a command to the XTM/2 the Status Byte is polled. The responseto the command is retrieved only after the MAV bit is set (2^4 = 16).

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XTM/2 Operating Manual

To implement serial polling of the Request for Service bit you need only test for
the RQS bit to be set.
For example:(serial poll) CALL IBRSP (XTM2%,SPR%)

B = SPR% / 64 : B = INT(B)IF B = 1 THEN (continue prog) ELSE (serial poll)

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If the RQS bit is set, the program may then be made to read the first 4 bits of
the Status Byte (2^0 through 2^3) to determine which event generated theservice request. Once this is determined the appropriate action may be taken.

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XTM/2 Operating Manual

Chapter 4
Programming System Operation Details
4.1 State and Measurement System Sequencing
The following pages give an overview of the XTM/2’s operational flow. There
are two basic loops: the Measurement Loop and the Display Loop. These twoloops operate independently of each other. The following symbols are used inthese flow charts:

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Figure 4-1 Symbols Used in Flow Charts

4-1

XTM/2 Operating Manual

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Figure 4-2 State Diagram for a Film

NOTE: The flow diagram presented, while generally accurate, is not complete
from the standpoint of containing enough information to cover all
possible eventualities. it is presented as a means of quick overview of
the instrument’s operation.

4-2

XTM/2 Operating Manual

4.2 State Descriptions
Operating the XTM/2 as a film thickness/rate monitor requires programing thefilm parameters, refer to section 2.6 on page 2-22. A film sequence begins witha OPEN command and ends when the film in process reaches the FINALTHICKNESS or the CLOSE switch is pressed. The RATE and THICKNESS
displayed is modified by the values programmed in the possible parameters
and the units used are set by the configuration switches, refer to section 2.5.2
on page 2-15.
In reviewing the state diagram of Figure 4-2 on page 4-2, note that there are
only two basic machine states, SHUTTER OPEN or SHUTTER CLOSED. On
power-up, the machine proceeds to the SHUTTER CLOSED state after
performing a series of memory checks. Various abnormal conditions areindicated by ERR# messages, see section 6.2.1 on page 6-1 and section 6.2.2
on page 6-2. The operations indicated by a pointing finger are manual key
strokes or the equivalent system hardware input or computer communicationscommand.
Table 4-1 State Descriptions

State

Condition

SourceShutter

1. SHUTTER CLOSEDWill accept an OPEN command.

Open

2. SHUTTER OPEN

Will accept a CLOSE command.

ClosedIPN 074-186S

In addition, there are two basic display modes: Operate and Program. Pressing
the PROG switch at any time alternates between these modes.
Information may be stored and recalled for nine setups. The particular setup ischosen by moving the cursor to the FILM parameter and selecting 1-9. In
addition, Film 0 is preprogrammed for Test Mode use, refer to section 3.6 on
page 3-11.

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4.3 Parameter Limits
The variable parameters and their limits are listed below. The two thickness(mass) parameters may be set over a wider range of values through thecomputer communications interface. If a value outside the stated limits is
attempted, the message “ERR1” is displayed, see section 6.2.2 on page 6-2.
When the “Displayed Units” configuration switches are changed (refer tosection 2.5.2 on page 2-15) the FINAL THICKNESS and SPT THICKNESS
values are automatically scaled to preserve the settings. If a value rescales outof limits, “ERR 3” is displayed.
Table 4-2 Parameters and Limits

Parameter

Limits

Units

FILM

1 - 9, 0 in Test Mode--

DENSITY

0.500 - 99.99

gm/cc

Z-RATIO

0.1 - 9.999--

TOOLING

10.0 - 500%

FINAL THICKNESS

0.000 - 999.9*

kÅ/µgm/mgm

SPT THICKNESS

0.000 - 999.9*

kÅ/µgm/mgm

SPT TIMER

00:00 - 99:59

MIN:SEC*Although the full value range of the parameter may be entered, themaximum mass loading on a 6 MHz crystal is about 16 mgm.

Whenever the ModeLock measurement system is unable to effectively identify
and drive a monitor crystal, a special set of sweep and find instructions are
executed. This sequence takes up to five seconds as it is repeated a number oftimes. If the measurement system is unable to recover, the message XTAL FAIL
is displayed and the last "good" rate and thickness values are preserved on theoperate screen until the monitor crystal is replaced or recovers.
Sometimes a monitor crystal will spontaneously recover if its temperature is
reduced or sufficient time passes and the stress induced by the coating isnaturally relieved. Even with the XTAL FAIL message displayed themeasurement system will continue to attempt to find the fundamental resonant
mode’s frequency. This message will disappear when the crystal recovers or is
replaced.
Additional information on crystal failures is presented in section 6.3.2 on page
6-4. The ModeLock oscillator is more fully explained in section 5.5.5 on page
5-9 and section 5.5.6 on page 5-12.

4-4

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4.4 Crystal Fail

XTM/2 Operating Manual

4.5 Crystal Fail Inhibit
In many coating plants the crystal fail output relay closure is given major
importance and causes the entire system to shut down. This can cause
problems when the crystal is changed as part of the normal reloading
procedure. This potential conflict is resolved by utilizing the crystal fail inhibit
input; refer to section 2.5.4 on page 2-18. When this input is activated the
crystal fail relay will not close on crystal fail. The front panel messages andinstrument operation still work normally. The operator may now change thecrystal and verify that it is operating without inducing a major processinterruption.

4.6 Crystal Life and Starting Frequency
Crystal life is displayed as a percentage of the monitor crystal's frequency shift
relative to the 1 MHz frequency shift allowed by the instrument. This quantity isuseful as an indicator of when to change the monitor crystal to safeguard
against crystal failures during deposition. It is normal to change a crystal after
a specific amount of crystal life (% change) is consumed.

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It is not always possible to use a monitor crystal to 100% of crystal life. Useful
crystal life is highly dependent on the type of material being deposited and theresulting influence of this material on the quartz monitor crystal. For well
behaved materials, such as copper, at about 100% crystal life the inherent
quality, Q, of the monitor crystal degrades to a point where it is difficult tomaintain a sharp resonance and therefore the ability to measure the monitor
crystal's frequency deteriorates.
When depositing dielectric oroptical materials, the life of a gold, aluminum or
silver quartz monitor crystal is much shorter; as much as 10 to 20%. This is dueto thermal and intrinsic stresses at the quartz-dielectric film interface, which areusually exacerbated by the poor mechanical strength of the film. For thesematerials, the inherent quality of the quartz has very little to do with the monitor
crystal's failure.
It is normal for a brand new quartz monitor crystal to display a crystal life
anywhere from 0 to 5% due to process variations in producing the crystal.
Naturally, this invites the question: "Is a brand new crystal indicating 5% life
spent inferior to a crystal indicating 1% life spent?"
If a new crystal indicates 5% life spent, it means that either the quartz blank isslightly thicker than normal (more mechanical robustness), or the gold
electrode is slightly thicker than normal (better thermal and electricalproperties), or both. In either case, its useful life with regard to material
deposition should not be adversely affected. To verify this assertion, laboratory
testing was performed on crystals which covered the crystal life range inquestion. Results indicate that a brand new crystal which indicates 3 to 5% life
spent is just as good, if not better than a crystal indicating 0 to 2% life spent.
As a consequence, it is important to consider the change in crystal life (%), notjust the absolute crystal life (%) Indicated.

4-5

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This page is intentionally blank.

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XTM/2 Operating Manual

Chapter 5
Calibration and Measurement
5.1 Importance of Density, Tooling and Z-ratio
The quartz crystal microbalance is capable of precisely measuring the massadded to the face of the oscillating quartz crystal sensor. The instrument's
knowledge of the density of this added material (specified by the film’s density
parameter in Material Set-Up) allows conversion of the mass information into
thickness. In some instances, where highest accuracy is required, it isnecessary to make a density calibration as outlined in section 5.2.
Because the flow of material from a deposition is not uniform, it is necessary to
account for the different amount of material flow onto the sensor compared tothe substrates. This factor is accounted for by the film’s tooling parameter. The
tooling factor can be experimentally established by following the guidelines in
section 5.3 on page 5-2.
Z-ratio is a parameter that corrects the frequency change to thickness transfer
function for the effects of acoustic impedance mismatch between the crystal
and the coated material.

5.2 Determining Density
NOTE: The bulk density values retrieved from Appendix A, Table of Densities
and Z-ratios, are sufficiently accurate for most applications.
Follow the steps below to determine density value:
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1 Place a substrate (with proper masking for film thickness measurement)
adjacent to the sensor, so that the same thickness will be accumulated on
the crystal and this substrate.

2 Set density to the bulk value of the film material or to an approximate value.
3 Set Z-ratio to 1.000 and tooling to 100%.
4 Place a new crystal in the sensor and make a short deposition(1000-5000 Å).

5 After deposition, remove the test substrate and measure the film thickness
with either a multiple beam interferometer or a stylus-type profilometer.

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XTM/2 Operating Manual

6 Determine the new density value with the following equation:
Tx
3
Density ( gm ⁄ cm ) = D 1 ⎛ -------⎞⎝ T m⎠[1]

where:
D1 = Initial density setting
Tx = Thickness reading on the display
Tm = Measured thickness

7 A quick check of the calculated density may be made by programming the
instrument with the new density value and observing that the displayed
thickness is equal to the measured thickness, provided that the instrument's
thickness has not been zeroed between the test deposition and entering the
calculated density.
NOTE: Slight adjustment of density may be necessary in order toachieve Tx = Tm.

5.3 Determining Tooling
1 Place a test substrate in the system's substrate holder.
2 Make a short deposition and determine actual thickness.
3 Calculate tooling from the relationship:Tm
Tooling (%) = TF i ⎛⎝ -------⎞⎠Tx[2]

Tm = Actual thickness at substrate holder
Tx = Thickness reading on the display
TFi = Initial tooling factor

4 Round off percent tooling to the nearest 0.1 %.
5 When entering this new value for tooling into the program, Tm will equal Tx
if calculations are done properly.
NOTE: It is recommended that a minimum of three separate evaporations be
made when calibrating tooling. Variations in source distribution andother system factors will contribute to slight thickness variations. An
average value tooling factor should be used for final calibrations.

5-2

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where

XTM/2 Operating Manual

5.4 Laboratory Determination of Z-ratio
A list of Z-values for materials commonly used is available in Appendix A, Tableof Densities and Z-ratios. For other materials, Z can be calculated from thefollowing formula:1--⎛ d q µ q⎞ 2

Z = ⎜ -------------⎟⎝ df µf ⎠[3]5

Z = 9.378 × 10 ( d f µ f )

1
- --2

[4]

where:
df = density (g/cm3) of deposited film
µf = shear modulus (dynes/cm2) of deposited film
dq = density of quartz (crystal) (2.649 gm/cm3)µq = shear modulus of quartz (crystal) (3.32 x 1011 dynes/cm2 )The densities and shear moduli of many materials can be found in a number ofhandbooks.
Laboratory results indicate that Z-values of materials in thin-film form are very
close to the bulk values. However, for high stress producing materials, Z-valuesof thin films are slightly smaller than those of the bulk materials. For
applications that require more precise calibration, the following direct method
is suggested:
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1 Using the calibrated density and 100% tooling, make a deposition such thatthe percent crystal life display will read approximately 50%, or near the endof crystal life for the particular material, whichever is smaller.

2 Place a new substrate next to the sensor and make a second, short
deposition (1000 - 5000Å).

3 Determine the actual thickness on the substrate (as suggested in density
calibration).

4 Adjust Z-ratio value in the instrument to bring the thickness reading inagreement with actual thickness.

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XTM/2 Operating Manual

For multiple layer deposition (for example, two layers), the Z-value used for thesecond layer is determined by the relative thickness of the two layers. For mostapplications the following three rules will provide reasonable accuracies:


If the thickness of layer 1 is large compared to layer 2, use material 1’s
Z-value for both layers.



If the thickness of layer 1 is thin compared to layer 2, use material 2’s
Z-value for both layers.



If the thickness of both layers is similar, use a value for Z-ratio which is theweighted average of the two Z-values for deposition of layer 2 andsubsequent layers.

5.5 Measurement Theory
5.5.1 Basics

In the late 1950’s it was noted by Sauerbrey1,2 and Lostis3 that the change infrequency, DF = Fq-Fc, of a quartz crystal with coated (or composite) anduncoated frequencies, Fc and Fq respectively, is related to the change in massfrom the added material, Mf , as follows:

M∆F )-------f = (----------Mq
Fq
where Mq is the mass of the uncoated quartz crystal.

1.G. Z. Sauerbrey, Phys. Verhand.8, 193 (1957)
2.G. Z. Sauerbrey, Z. Phys. 155,206 (1959)
3.P. Lostis, Rev. Opt. 38,1 (1959)

5-4

[5]

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The Quartz Crystal deposition Monitor, or QCM, utilizes the piezoelectric
sensitivity of a quartz monitor crystal’s resonance to added mass. The QCM
uses this mass sensitivity to control the deposition rate and final thickness of avacuum deposition. When a voltage is applied across the faces of a properly
shaped piezoelectric crystal, the crystal is distorted and changes shape in
proportion to the applied voltage. At certain discrete frequencies of applied
voltage, a condition of very sharp electro-mechanical resonance isencountered. When mass is added to the face of a resonating quartz crystal,
the frequency of these resonances are reduced. This change in frequency isvery repeatable and is precisely understood for specific oscillating modes ofquartz. This heuristically easy to understand phenomenon is the basis of an
indispensable measurement and process control tool that can easily detect theaddition of less than an atomic layer of an adhered foreign material.

XTM/2 Operating Manual

Simple substitutions lead to the equation that was used with the first “frequency
measurement” instruments:

K ( ∆F )T f = ---------------df[6]

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where the film thickness, Tf, is proportional (through K) to the frequencychange, DF, and inversely proportional to the density of the film, df. The
constant, K = Natdq/Fq2; where dq (= 2.649 gm/cm3) is the density of single
crystal quartz and Nat (=166100 Hz cm) is the frequency constant of AT cut
quartz. A crystal with a starting frequency of 6.0 MHz will display a reduction of
its frequency by 2.27 Hz when 1 angstrom of Aluminum (density of 2.77
gm/cm3) is added to its surface. In this manner the thickness of a rigid adlayer
is inferred from the precise measurement of the crystal’s frequency shift. The
quantitative knowledge of this effect provides a means of determining how
much material is being deposited on a substrate in a vacuum system, ameasurement that was not convenient or practical prior to this understanding.

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5.5.2 Monitor Crystals
No matter how sophisticated the electronics surrounding it, the essential deviceof the deposition monitor is the quartz crystal. The quartz resonator shown in
Figure 5-1 has a frequency response spectrum that is schematically shown in
Figure 5-2. The ordinate represents the magnitude of response, or current flowof the crystal, at the specified frequency.
Figure 5-1 Quartz Resonator

1
10

6

7

17

18

Frequency (in MHz)The lowest frequency response is primarily a “thickness shear” mode that iscalled the fundamental. The characteristic movement of the thickness shear
mode is for displacement to take place parallel to the major monitor crystal
faces. In other words, the faces are displacement antinodes as shown in Figure5-3. The responses located slightly higher in frequency are called anharmonics;
they are a combination of the thickness shear and thickness twist modes. The

5-6

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18.133 MHz 350 ohm

17.957 MHz 311 ohm

17.792 MHz 278 ohm

6.419 MHz 350 ohm

6.333 MHz 142 ohm
6.337 MHz 105 ohm
6.348 MHz 322 ohm

11000

6.153 MHz 50 ohm
6.194 MHz 40 ohm

1100
5.981 MHz 15 ohm

Log of relative intensity (Admittance)

Figure 5-2 Frequency Response Spectrum

XTM/2 Operating Manual

response at about three times the frequency of the fundamental is called thethird quasiharmonic. There are also a series of anharmonics slightly higher infrequency associated with the quasiharmonic.
Figure 5-3 Thickness Shear Displacement

E

X2

displacement node

X1

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X
3

The monitor crystal design depicted in Figure 5-1 is the result of several
significant improvements from the square crystals with fully electroded plane
parallel faces that were first used. The first improvement was to use circular
crystals. This increased symmetry greatly reduced the number of allowed
vibrational modes. The second set of improvements was to contour one face ofthe crystal and to reduce the size of the exciting electrode. These
improvements have the effect of trapping the acoustic energy. Reducing theelectrode diameter limits the excitation to the central area. Contouring
dissipates the energy of the traveling acoustic wave before it reaches the edgeof the crystal. Energy is not reflected back to the center where it can interferewith other newly launched waves, essentially making a small crystal appear to
behave as though it is infinite in extent. With the crystal’s vibrations restricted
to the center, it is practical to clamp the outer edges of the crystal to a holder
and not produce any undesirable effects. Contouring also reduces the intensityof response of the generally unwanted anharmonic modes; hence, the potential
for an oscillator to sustain an unwanted oscillation is substantially reduced.
The use of an adhesion layer has improved the electrode-to-quartz bonding,
reducing “rate spikes” caused by micro-tears between the electrode and thequartz as film stress rises. These micro-tears leave portions of the deposited
film unattached and therefore unable to participate in the oscillation. These free
portions are no longer detected and the wrong thickness consequently inferred.

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The “AT” resonator is usually chosen for deposition monitoring because at room
temperature it can be made to exhibit a very small frequency change due totemperature changes. Since there is presently no way to separate thefrequency change caused by added mass (which is negative) or even thefrequency changes caused by temperature gradients across the crystal or film
induced stresses, it is essential to minimize these temperature-inducedchanges. It is only in this way that small changes in mass can be measured
accurately.

5.5.3 Period Measurement Technique
Although instruments using equation [6] were very useful, it was soon noted
they had a very limited range of accuracy, typically holding accuracy for ∆F lessthan 0.02 Fq. In 1961 it was recognized by Behrndt4 that:[7]

where Tc and Tq are the periods of oscillation of the crystal with film and thebare crystal respectively. The period measurement technique was theoutgrowth of two factors; first, the digital implementation of time measurement,
and second, the recognition of the mathematically rigorous formulation of the
proportionality between the crystal’s thickness, Lq, and the period of oscillation,
Tq = 1/Fq. Electronically the period measurement technique uses a second
crystal oscillator, or reference oscillator, not affected by the deposition andusually much higher in frequency than the monitor crystal. This reference
oscillator is used to generate small precision time intervals which are used todetermine the oscillation period of the monitor crystal. This is done by using two
pulse accumulators. The first is used to accumulate a fixed number of cycles,m, of the monitor crystal. The second is turned on at the same time andaccumulates cycles from the reference oscillator until m counts areaccumulated in the first. Since the frequency of the reference is stable andknown, the time to accumulate the m counts is known to an accuracy equal to± 2/Fr where Fr is the reference oscillator’s frequency. The monitor crystal’s
period is (n/Fr)/m where n is the number of counts in the second accumulator.
The precision of the measurement is determined by the speed of the reference
clock and the length of the gate time (which is set by the size of m). Increasing
one or both of these leads to improved measurement precision.
Having a high frequency reference oscillator is important for rapid
measurements (which require short gating times), low deposition rates and low
density materials. All of these require high time precision to resolve the small,mass induced frequency shifts between measurements. When the change of amonitor crystal’s frequency between measurements is small, that is, on the

4.K. H. Behrndt, J. Vac. Sci. Technol. 8, 622 (1961)

5-8

IPN 074-186S

M( Tc – Tq )∆F )-------f = ---------------------- = (----------Mq
Tq
Fc

XTM/2 Operating Manualsame order of size as the measurement precision, it is not possible to establish
quality rate control. The uncertainty of the measurement injects more noise into
the control loop, which can be counteracted only by longer time constants. Long
time constants cause the correction of rate errors to be very slow, resulting in
relatively long term deviations from the desired rate. These deviations may not
be important for some simple films, but can cause unacceptable errors in the
production of critical films such as optical filters or very thin layered
superlattices grown at low rates. In many cases the desired properties of thesefilms can be lost if the layer to layer reproducibility exceeds one, or two,
percent. Ultimately, the practical stability and frequency of the reference
oscillator limits the precision of measurement for conventional instrumentation.

5.5.4 Z-Match Technique
After learning of fundamental work by Miller and Bolef 5, which rigorously
treated the resonating quartz and deposited film system as a one-dimensional
continuous acoustic resonator, Lu and Lewis6 developed the simplifying
Z-Match equation in 1972. Advances in electronics taking place at the sametime, namely the micro-processor, made it practical to solve the Z-Matchequation in “real-time”. Most deposition process controllers sold today use thissophisticated equation that takes into account the acoustic properties of theresonating quartz and film system as shown in equation [8].

IPN 074-186S

N at d q
π ( Fq – Fc )T f = ⎛ ------------------⎞ arctan ⎛ Z tan --------------------------- ⎞⎝ πd f F c Z⎠
⎝
⎠
Fq

[8]

where Z=(dquq/dfuf)1/2 is the acoustic impedance ratio and uq and uf are theshear moduli of the quartz and film, respectively. Finally, there was afundamental understanding of the frequency-to-thickness conversion that could
yield theoretically correct results in a time frame that was practical for processcontrol. To achieve this new level of accuracy requires only that the user enteran additional material parameter, Z, for the film being deposited. This equation
has been tested for a number of materials, and has been found to be valid for
frequency shifts equivalent to Ff = 0.4Fq. Keep in mind that equation [6] wasvalid to only 0.02Fq and equation [7] was valid only to ~0.05Fq.

5.5.5 Active Oscillator
All of the instrumentation developed to date has relied on the use of an active
oscillator circuit, generally the type schematically shown in Figure 5-4. This
circuit actively keeps the crystal in resonance, so that any type of period orfrequency measurement may be made. In this type of circuit, oscillation is

5.J. G. Miller and D. I. Bolef, J. Appl. Phys. 39, 5815, 4589 (1968)
6.C. Lu and O. Lewis, J Appl. Phys. 43, 4385 (1972)

5-9

XTM/2 Operating Manual

sustained as long as the gain provided by the amplifiers is sufficient to offset
losses in the crystal and circuit and the crystal can provide the required phaseshift.
Figure 5-4 Active Oscillator Circuit

The basic crystal oscillator’s stability is derived from the rapid change of phase
for a small change in the crystal’s frequency near the series resonance point,
as shown in Figure 5-5.

IPN 074-186S

Figure 5-5 Crystal Frequency Near Series Resonance Point

5 - 10XTM/2 Operating Manual

The active oscillator circuit is designed so the crystal is required to produce aphase shift, θ, of 0 degrees, which allows it to operate at the series resonancepoint. Long- and short-term frequency stabilities are a property of crystal
oscillators because very small frequency changes are needed to sustain thephase shift required for oscillation. Frequency stability is provided by the quartz
crystal even though there are long term changes in electrical component values
caused by temperature or aging or short-term noise-induced phase jitter.
As mass is added to a crystal, its electrical characteristics change. Figure 5-6
is the same plot as Figure 5-5 overlaid with the response of a heavily loaded
crystal. The crystal has lost the steep slope displayed in Figure 5-5. Because
the phase slope is less steep, any noise in the oscillator circuit translates intoa greater frequency shift than that which would be produced with a new crystal.
In the extreme, the basic phase/frequency shape is not preserved and the
crystal is not able to provide a full 90 degrees of phase shift.
The impedance, | Z |, is also noted to rise to an extremely high value. When thishappens it is often more favorable for the oscillator to resonate at one of theanharmonic frequencies. This condition is sometimes short lived, with theoscillator switching between the fundamental and anharmonic modes, or it may
continue to oscillate at the anharmonic. This condition is known as mode
hopping and in addition to annoying rate noise can also lead to false terminationof the film because of the apparent frequency change. It is important to note thatthe controller will frequently continue to operate under these conditions; in fact
there is no way to tell this has happened except that the film’s thickness issuddenly apparently thinner by an amount equivalent to the frequency
difference between the fundamental and the anharmonic that is sustaining theoscillation.

IPN 074-186S

Figure 5-6 Heavily Loaded Crystal

5 - 11

XTM/2 Operating Manual

5.5.6 ModeLock Oscillator
INFICON has created a new technology7 that eliminates the active oscillator
and its limitations. This new system constantly tests the crystal’s response toan applied frequency in order to not only determine the resonant frequency, butalso to verify that the crystal is oscillating in the desired mode. This new systemis essentially immune to mode hopping and the resulting inaccuracies. It is fast
and accurate, determining the crystal’s frequency to less than 0.05 Hz at a rateof 4 times per second. Because of the system’s ability to identify and thenmeasure particular crystal modes, it is now possible to offer new features thattake advantage of the additional informational content of these modes.

For AT crystals we know that the lowest frequency event encountered is thefundamental. The events slightly higher in frequency are anharmonics. This
information is useful not only for initialization, but also for the rare case when
the instrument loses track of the fundamental. Once the frequency spectrum of
the crystal is determined the instrument’s task is to follow the changing
resonance frequency and to periodically provide a measurement of thefrequency for subsequent conversion to thickness.
The use of the “intelligent” measurement system has a series of very apparent
advantages when compared to the previous generation of active oscillators;
namely immunity from mode hopping, speed of measurement, precision of
measurement, and the ability to measure heavily loaded (damped) crystals.

7.US Patent 5,117,192 (May 27 1992)

5 - 12

IPN 074-186S

This “intelligent” measurement system uses the phase/frequency properties of
the quartz crystal to determine the resonant frequency. It operates by applying
a synthesized sine wave of specific frequency to the crystal and measuring thephase difference between the applied signal’s voltage and the current passing
through the crystal. At series resonance, this phase difference is exactly 0
degrees; that is, the crystal behaves like a pure resistance. By separating theapplied voltage and the current returned from the crystal and monitoring theoutput of a phase comparator it is possible to establish whether the appliedfrequency is higher or lower than the crystal’s resonance point. At frequencies
well below the fundamental, the crystal’s impedance is capacitive and at
frequencies slightly higher than resonance it is inductive in nature. This
information is useful if the resonance frequency of a crystal is unknown. A quick
sweep of frequencies can be undertaken until the output of the phasecomparator changes, marking the resonance event.

XTM/2 Operating Manual

Chapter 6
Adjustments and Problems
The only user serviceable adjustment is the LCD contrast (see below). There
are no user serviceable components inside the instrument enclosures.

WARNING
There are potentially lethal voltages inside this
instrument’s enclosure. The source of these voltages
are from the line power and also from the System I/O
connector.

6.1 LCD Contrast Adjustment
The LCD contrast is optimized for "above the display" viewing angles andadjusted at the factory. It may be better optimized on site for use in positions
that place the instrument in extreme viewing angles.
To adjust for best possible contrast in the installed position use a potentiometer
adjustment tool or small common screwdriver carefully inserted through thefront panel (see section 2.4 on page 2-9, Item 11) and turn clockwise or counterclockwise to obtain the best possible display contrast for your viewing angle.

6.2 Error Messages

IPN 074-186S

The following error codes are generated and displayed by the XTM/2.

6.2.1 Powerup Errors
ERR 0 . . . . . . Film parameters lost on power up. This may be cleared bypressing any key. All film and layer parameters will have to be
re-entered.
ERR 2 . . . . . . Line power loss. This message is cleared by pressing any key.
ERR 9 . . . . . . Process data lost on power up. This is cleared by pressing any
key. Automatic process recovery will not be possible.
NOTE: Upon detection of power failure, all current layer and process data isnormally saved for process recovery use on subsequent deposition
system recovery.

6-1

XTM/2 Operating Manual

6.2.2 Parameter Update Errors
ERR 1 . . . . . Parameter out of range; the value attempted to be entered wasoutside of the instrument’s acceptable range. This is cleared withthekey. Refer to Table 4-2 on page 4-4 for parameter ranges.
ERR 3 . . . . . Parameter out of range as the result of a change in the displayed
units. This is cleared with any key.
LOC . . . . . . . Parameter entry (or alteration) attempted while the PARAMETERLOCK configuration switch is set or the parameters are locked
out through remote communications. LOC is also displayed whenattempting to update certain parameters (sensor, source, layer)
during an active process.

6.2.3 Other Errors
Err 7 . . . . . . Processor out of time error. It is not expected that this error will
be seen by a user.

6.3 Troubleshooting Guide
If the instrument fails to work, or appears to have diminished performance, theSymptom/Cause chart in section 6.3.2 on page 6-4 may be helpful.

WARNING
There are no user serviceable components within the
instrument case.

Refer all maintenance to qualified personnel.

CAUTION
This instrument contains delicate circuitry which issusceptible to transients. Disconnect the line cord
whenever making any interface connections. Refer all
maintenance to qualified personnel.

6-2

IPN 074-186S

Potentially lethal voltages are present when the line
cord, or system I/O or aux I/O are connected.

XTM/2 Operating Manual

6.3.1 Major Instrument Components, Assemblies andMating Connectors
Figure 6-1 Components, Assemblies and Mating Connectors
System I/O Connector
Both IPN 051-483& IPN 051-619
Power Cord
N. American: IPN 068-0385
European: IPN 068-0390

RS232 Connector
Both IPN 051-485& IPN 051-620

Display Board Assembly(Included LCD Display)
IPN 758-112-G1
Top/Bottom CoverIPN 757-007-P2

Graphic & Switch
Overlay
IPN 758-009-P1

COM Option
Connector
PROM Upgrade / Replacement Kit
IPN 758-207-G1

LCD Display
IPN 758-006-P1

IPN 074-186S

Main Board Assembly
IPN 758-1002-G1

6-3

XTM/2 Operating Manual

6.3.2 Troubleshooting the Instrument
Table 6-1 Troubleshooting the Instrument

SYMPTOMCAUSE

REMEDY

1. power on LED not
illuminateda. blown fuse/circuit breaker a. have qualified personnel
trippedreplace fuse/reset circuit
breakerb. electrical cord unplugged b. re-connect power cordfrom wall or back of
instrument
c. incorrect line voltage

a. cover or back panels not a. ensure all covers andattached to the instrument. panels are in place andsecurely fastenedb. high electrical noise
environmentb. re-route cables to reducenoise pickup (1’ (305 mm)
away from high power
conducting lines makes a
sizeable reduction in theamount of noise entering
the instrument), keep all
ground wires short withlarge surface area tominimize ground
impedancec. poor grounds or poor
grounding practicec.verfify proper earth
ground, use appropriate
ground strap, eliminate
ground loops byestablishing the correct
system grounding, verify
proper instrument
groundinga. faulty static RAM
3. instrument does notretain parameters on power
down (loss of parameterson power up)

6-4

a. SRAM battery has anormal life expectancy often years, contact INFICON
service department

b. power supply problem

b. contact INFICON service
department

4. some keys on front panel a. faulty keypad or faulty
function while others do not keypad ribbon cablea. contact INFICON service
department

IPN 074-186S

2.unit "locks" upc. have qualified personnel
verify line voltage, verify the
instrument is configured forthe correct voltage

XTM/2 Operating Manual
Table 6-1 Troubleshooting the Instrument (continued)

SYMPTOMCAUSE

REMEDY

5. all keys on the front panel a. instrument is "locked" up a. turn power to OFF or to
fail to function
STBY, then to on, see item 2
above
6. control voltage output
does not function properly

a. DAC board damaged
a. ensure cable connection
from applying voltage to the to the DAC board does notcontrol voltage output
have a potential across thecontacts, contact INFICON
service department
b. verify source output
b. reversed polarity ofpolarity of DAC and thecontrol voltage relative tothat accepted by the source required input polarity of thesource power supply, refer
power supply
to the instruction manual toreconfigure the instrument if
necessaryc. improper control cablefabrication

7. CRT or LCD display dull a. brightness/contrast
or blank
adjustment required

IPN 074-186S

8. poor rate control

c.check for correct cablewiring in the appropriate
section of the manuala. refer to manual for
location of adjustment
potentiometer, adjust as
requiredb. LCD or CRT/power
supply problem

b. contact INFICON service
department

a. control loop parameters
improperly selected

a. refer to the instruction
manual section on tuning
control loop parameters

b. adjust the sweepb. electron beam sweep
frequency "beating" with the frequency so it is not a
instrument’s measurement multiple of the instruments
measurement frequency
frequency

6-5

XTM/2 Operating Manual
Table 6-1 Troubleshooting the Instrument (continued)

SYMPTOMCAUSE

REMEDY

9. crystal fail always on

a. XIU/oscillator notconnected

verify proper
sensor/oscillator
connections

b. XIU/oscillator
malfunctioning

b. if available, insert aknown working
XIU/oscillator in place of thesuspect one; if
XIU/oscillator is confirmed
bad, contact INFICON
service departmentc. defective cable fromfeedthrough to
XIU/oscillator or from
instrument to XIU/oscillator

c. use an ohm meter or
DVM to check electricalcontinuity or isolation as
appropriate

d. poor electrical contact in d. use an ohm meter or
DVM to check electricalthe transducer,
feedthroughs, or in-vacuum continuity or isolation as
appropriate
cable
e. failed crystal/no crystal

e. replace crystal/insert
crystal

IPN 074-186S

f. two crystals placed in the f. remove one of the crystals
same crystal holder

6-6

XTM/2 Operating Manual

6.3.3 Troubleshooting Transducers/Sensors
NOTE: The most useful tool for diagnosing sensor head problems is the DVM(Digital Volt Meter). Disconnect the short oscillator cable from thefeedthrough and measure the resistance from the center pin to ground.
If the reading is less than 1-2 megohms, the source of the leakage
should be found and corrected. Likewise, with the vacuum system open
check for center conductor continuity, a reading of more than 1 ohm
from the feedthrough to the transducer contact indicates a problem.
Cleaning contacts or replacing the in-vacuum cable may be required.
A somewhat more thorough diagnosis may be performed with theoptional Crystal Sensor Emulator, 760-601-G1. See section 6.5 on
page 6-20 for a discussion of its use and diagnostic capabilities.
NOTE: A more detailed troubleshooting guide is shipped with the sensor. Referto the sensor’s manual for more detailed information, in some cases.
Table 6-2 Troubleshooting Transducers/Sensors

SYMPTOM

CAUSE

1. large jumps of thickness a. mode hopping due toreading during deposition
defective crystal

REMEDYa. replace crystal. use
ModeLock measurement
system

IPN 074-186S

b. stress causes film to peel b. replace crystal or use
from crystal surface
high performance buffered
crystal; consult factoryc. thermally condition thec. particulate or "spatter"from molten source striking source thoroughly before
deposition, use a shutter tocrystalprotect the crystal during
source conditioningd. scratches or foreign
particles on the crystal
holder seating surface(improper crystal seating)d. clean and polish the
crystal seating surface on
the crystal holder

e. small pieces of material
fell on crystal (for crystal
facing up sputteringsituation)e. check the crystal surface
and blow it off with clean air

f. small pieces of magnetic
material being attracted by
the sensor magnet andcontacting the crystal(sputtering sensor head)f. check the sensor cover’s
aperture and remove any
foreign material that may be
restricting full crystal
coverage

6-7

XTM/2 Operating Manual
Table 6-2 Troubleshooting Transducers/Sensors (continued)

SYMPTOMCAUSE

REMEDYa. thermally condition the
2. crystal ceases to oscillate a. crystal struck byduring deposition before it particulate or "spatter" from source thoroughly before
deposition, use a shutter tomolten source
reaches its "normal" life
protect the crystal during
source conditioningb. material on crystal holder b.clean crystal holder
partially masking crystal
cover aperturec. existence of electricalshort or open conditionc. using an ohm meter or
DVM, check for electricalcontinuity in the senor
cable, connector, contact
springs, connecting wire
inside sensor, andfeedthroughsd. check for thermallyinduced electrical short oropen conditiond. see "c" above

NOTE: Crystal life is highly dependent on process conditions of rate, power radiatedfrom source, location, material, and residual gas composition.
a. use an ohm meter or
3. crystal does not oscillate a. intermittent or pooror oscillates intermittently electrical contact (contacts DVM to check electricalcontinuity, clean contacts(both in vacuum and in air) oxidized)c. RF interference fromsputtering power supply

c. verify earth ground, useground strap adequate for
RF ground, change locationof instrument and oscillator
cabling away from RF
power lines, connect
instrument to a different
power line

d. cable/oscillator not
d. verify proper
connected, or connected to connections, and inputs
wrong sensor input
relative to programmed
sensor parameter

6-8

IPN 074-186S

b. rebend leafs tob. leaf springs have lost
retentivity (ceramic retainer, approximately 60°. See
section 6.3.5 on page 6-14
center insulator)

XTM/2 Operating Manual
Table 6-2 Troubleshooting Transducers/Sensors (continued)

SYMPTOMCAUSE

REMEDYa. crystal was near the end a. replace crystal
4. crystal oscillates inof its life; opening to air
vacuum but stops
oscillation after open to air causes film oxidation which
increases film stressb. excessive moistureb. turn off cooling water toaccumulates on the crystal sensor prior to venting, flow
warm water through sensor
while chamber is open

IPN 074-186S

5. thermal instability: largechanges in thickness
reading during source
warm-up (usually causes
thickness reading todecrease) and after thetermination of deposition(usually causes thickness
reading to increase)a. inadequate coolingwater/cooling watertemperature too higha. check cooling water flow
rate, be certain that coolingwater temperature is lessthan 30 °C; refer toappropriate sensor manualb. excessive heat input tothe crystal

b. if heat is due to radiationfrom the evaporation
source, move sensor further
away from source and use
sputtering crystals for better
thermal stability; installradiation shieldc. crystal not seatedproperly in holder

c. clean or polish the crystal
seating surface on the
crystal holder

d. crystal heating caused by d. use a sputtering sensor
headhigh energy electron flux
(often found in RF
sputtering)e. poor thermal transferfrom water line to body(CrystalSix sensor)

e. use a new water tube
whenever the clamping
assembly has been
removed from the body; if a
new water tube is notavailable, use a single layerof aluminum foil between
the cooling tube and sensor
body, if your process allows

f. poor thermal transfer(Bakeable)

f. use Al or Au foil washer
between crystal holder andsensor body

6-9

XTM/2 Operating Manual
Table 6-2 Troubleshooting Transducers/Sensors (continued)

SYMPTOMCAUSE

REMEDY

6. poor thickness
reproducibility

a. variable source flux
distribution

a. move sensor to a more
central location to reliably
sample evaporant, ensure
constant relative pool heightof melt, avoid tunneling into
the meltb. sweep, dither, or position b. maintain consistentsource distribution by
where the electron beam
maintaining consistentstrikes the melt has been
sweep frequencies, sweepchanged since the last
amplitude and electron
deposition
beam position settings

7. large drift in thickness(greater than 200 Å for adensity of 5.00 g/cc) aftertermination of sputtering

6 - 10d. cyclic change in rate

d. make certain source’s
sweep frequency is not"beating" with themeasurement frequency[nearly the same frequency
or a near multiple of themeasurement (4 Hz)]a. crystal heating due topoor thermal contact

a. clean or polish the crystal
seating surface on the
crystal holder

b. external magnetic fieldinterfering with the sensors
magnetic field (sputtering
sensor)b. rotate sensor magnet toproper orientation withexternal magnetic field,
refer to sputtering sensor
manual IPN 074-157

c. sensor magnet cracked
or demagnetized(sputtering sensor)

c. check sensor magnetic
field strength, the maximum
field at the center of theaperture should be 700
gauss or greater

IPN 074-186S

c. material does not adhere c. make certain the crystal’s
to crystal
surface is clean; avoid
touching crystal with
fingers, make use of anintermediate adhesion layerXTM/2 Operating Manual
Table 6-2 Troubleshooting Transducers/Sensors (continued)

SYMPTOMCAUSE

REMEDY

8. CrystalSix, crystal switch a. loss of pneumatic supply, a. ensure air supply isregulated at 80-90 PSI
problem (does not advance or pressure is insufficient
or not centered in aperture) for proper operationb. operation has been
impaired as a result ofmaterial accumulation on
cover

b. clean material
accumulation as needed,refer to CrystalSix manual
IPN 074-155 formaintenancec. improper alignmentc. realign as per instructions
in CrystalSix manual IPN
074-155

d. 0.0225" diameter orifice
not installed on the supply
side of solenoid valve
assemblyd. install orifice as shown in
the CrystalSix manual IPN
074-155

6.3.4 Troubleshooting Computer Communications
Table 6-3 Troubleshooting Computer Communications

SYMPTOMCAUSE

IPN 074-186S

1. communications cannot a. improper cablebe established between the connection
host computer and the
instrument

REMEDYa. verify for correct cablewiring as described in the
manualb. BAUD rate in hostcomputer not the same as
the instrument

b. verify BAUD rate in thehost’s applications
program, verify BAUD ratein the instrument

c. incompatible protocols
being usedc. verify the instrument
protocol: RS232, SECS,
GPIB, DATALOG,CHECKSUM, matches hostd. incorrect device address d. verify device address in(GPIB or SECS protocol)
host’s applications
program, (or in IBCONF filefor National Instrs. GPIB)
and verify instrument
address

6 - 11

XTM/2 Operating Manual
Table 6-3 Troubleshooting Computer Communications (continued)

CAUSE

REMEDY

2. error code returneda. A = illegal commanda. the command sent was
not valid; verify command
syntax as shown in the
instrument’s manual(placement of spaces within
the command string areimportant)b. B = illegal valueb. the parameter’s value
sent is outside the range forthe given parameter, verify
parameter’s range

c. C = illegal IDc. the command sent wasfor a parameter which
doesn’t exist; verify thecorrect parameter number

d. D = illegal command
formatd. the command sent is not
valid; verify command
syntax as shown in the
instrument’s manual(placement of spaces within
the command string areimportant)e. E = no data to retrieve

e. some parameters may
not be in use, depending on
the value of otherparameters

IPN 074-186S

SYMPTOM

6 - 12

XTM/2 Operating Manual
Table 6-3 Troubleshooting Computer Communications (continued)

SYMPTOMCAUSE

REMEDYf. F = cannot change value f. the command sent is for anow
parameter that cannot bechanged while theinstrument is executing a
Process; place theinstrument in the READY
state in order to change thevalue.
g. checksum value does notmatch the value sent by thehost’s application program,may be caused by noise on
the RS232 cable or the
checksum is not calculated
properly by the applications
program.

h. O = data overrun

h. I/O port unable to keep
up with data transfer rate;
lower BAUD rate, increase
speed of host’s applications
program by using acompiled version of the
program, stream lining
program execution, a fasterCPU

IPN 074-186S

g. G = bad checksum

6 - 13

XTM/2 Operating Manual

6.3.5 Leaf Spring Concerns
Spring conditions should be observed as part of the routine maintenanceinterval. Insufficient bends or deformities in the spring contacts in the sensor
body are common causes of crystal problems. Lift each leaf spring up
approximately 60°. See Figure 6-2.
Figure 6-2 Shaping the Leaf Spring

Avoid kinking
leaf spring

Leaf
Spring

IPN 074-186S

60°

6 - 14

XTM/2 Operating Manual

6.4 Replacing the Crystal
The procedure for replacing the crystal is basically the same with alltransducers, except the CrystalSix.

CAUTION
Always use clean nylon lab gloves and plastic
tweezers for handling the crystal (to avoid
contamination which may lead to poor adhesion of thefilm to the electrode).
Do not rotate the ceramic retainer assembly after it isseated (as this will scratch the crystal electrode andcause poor contact).
Do not use excessive force when handling the ceramic
retainer assembly since breakage may occur.
NOTE: Certain materials, especially dielectrics, may not adhere strongly to the
crystal surface and may cause erratic readings.

IPN 074-186S

Thick deposits of some materials, such as SiO, Si, and Ni will normallypeel off the crystal when it is exposed to air, as a result of changes infilm stress caused by gas absorption. When you observe peeling,change the crystals.

6 - 15

XTM/2 Operating Manual

6.4.1 Standard and Compact
Follow the procedure below to replace the crystal in the Standard and Compact
sensor: (see Figure 6-3)

1 Gripping the crystal holder with your fingers, pull it straight out of the sensor
body.

2 Gently pry the crystal retainer from the holder (or use crystal snatcher; see
Figure 6-6 on page 6-19).

3 Turn the retainer over and the crystal will drop out.
4 Install a new crystal, with the patterned electrode face up.
5 Push the retainer back into the holder and replace the holder in the sensor
body.

IPN 074-186S

Figure 6-3 Standard Crystal Sensor (Exploded) (750-030/S&D HEAD)

6 - 16

XTM/2 Operating Manual

6.4.2 Shuttered and Dual Sensors
There is no difference in the crystal changing procedure between shuttered andnon-shuttered Standard and Compact sensors, since the shutter pivots awayfrom the crystal opening when the shutter is in the relaxed state.

6.4.3 Bakeable Sensor
For the Bakeable sensor, the procedure is the same as the regular crystal
except that you must first unlock the cam assembly by flipping it up. Once thecrystal has been replaced, place a flat edge of the holder flush with the cammechanism and lock it in place with the cam (Figure 6-4).

IPN 074-186S

Figure 6-4 Bakeable Crystal Sensor (Exploded) (750-030/BAKEABLE)

6 - 17

XTM/2 Operating Manual

6.4.4 Sputtering Sensor
Observe the general precautions (section 6.4 on page 6-15) for replacing
crystals and follow the instructions below to replace the crystal in a sputtering
sensor.

1 Grip the body assembly with your fingers and pull it straight out to separate
it from the water-cooled front part. (You may have to disconnect the sensor
cable in order to separate the parts.) See Figure 6-5.

2 Pull the crystal holder straight out from the front of the sensor.
3 Remove the ceramic retainer from the crystal holder by pulling it straight out
with the crystal snatcher (see section 6.4.5 on page 6-19).

4 Turn the crystal holder over so that the crystal drops out.
5 Install a new crystal into the crystal holder with the patterned electrodefacing the back and contacting the leaf springs on the ceramic retainer. (Useonly special crystals for sputtering, IPN 008-009-G10.)

6 Put the ceramic retainer back into the crystal holder and put the holder into
the front cover of the sensor.

7 Align the position of the back part so that the connector matches with thenotch on the front of the sensor. Snap the two parts together. Reconnect thesensor cable if it has been disconnected.

IPN 074-186S

Figure 6-5 Sputtering Crystal Sensor (Exploded)

6 - 18

XTM/2 Operating Manual

6.4.5 Crystal Snatcher
To use the crystal snatcher supplied with the sensor follow the instructions
below (see Figure 6-6):

1 Insert crystal snatcher into ceramic retainer (1) and apply a small amount ofpressure. This locks the retainer to the snatcher and allows the retainer tobe pulled straight out (2).

2 Re-insert the retainer into the holder after the crystal has been changed.
3 Release the crystal snatcher with a slight side-to-side motion.

IPN 074-186S

Figure 6-6 Use of Crystal Snatcher

6 - 19

XTM/2 Operating Manual

6.5 Crystal Sensor Emulator
IPN 760-601-G1 or 760-601-G2
NOTE: 760-601-G1 (obsolete) is not compatible for use with an IC/5 and IC/4.
760-601-G2 is fully compatible with all thin film deposition controllers.
The Crystal Sensor Emulator option is used in conjunction with the Thin Film
Deposition Controller to rapidly diagnose problems with the Deposition
Controller's measurement system. See Figure 6-7.
Figure 6-7 Crystal Sensor Emulator

Female
BNC
Connector

SensorCoverConnector

FemaleMicrodot
Connector

The Crystal Sensor Emulator may be attached at various points in themeasurement system, from the oscillator to the sensor head. It provides aknown "good" monitor crystal with known "good" electrical connections. Using
the emulator and the controller in a systematic manner provides a fast meansof isolating measurement system, cable, or sensor problems. See Figure 6-8.
Figure 6-8 Crystal Sensor Emulator Attachment Points

Sensor HeadThin Film
Controller

A

C

Crystal Interface
Unit (Oscillator)

CAUTION
This product is designed as a diagnostic tool, and is
not intended for use in vacuum. Do not leave theCrystal Sensor Emulator installed in the vacuum
system during processing.

6 - 20

IPN 074-186SB

XTM/2 Operating Manual

6.5.1 Diagnostic Procedures
The following diagnostic procedures employ the Crystal Sensor Emulator to
analyze a constant Crystal Fail message. The symptom is a Crystal Failmessage that is displayed by the Deposition Controller even after the monitor
crystal has been replaced with a new “good” monitor crystal.
NOTE: The "Unable To Auto Z" message will be displayed if the Crystal Sensor
Emulator is attached to a deposition controller and you are attempting
to use the Auto Z feature. This is to be expected and is normal.
6.5.1.1 Measurement System Diagnostic Procedure

1 Refer to Figure 6-8 on page 6-20. Remove the six-inch BNC cable from theFeed-Through at point A.

2 Connect the Crystal Sensor Emulator to the 6 inch BNC cable at Point A.


If the XTAL Fail message disappears after approximately five seconds,
the measurement system is working properly. Re-install the six-inch
BNC cable to the Feed-Through. Go to section 6.5.1.2.



If the XTAL Fail message remains, continue at step 3.

3 Disconnect the six-inch BNC cable from the Oscillator and from theEmulator.

4 Visually inspect the six-inch BNC cable to verify that the center pins areseated properly.

5 Use an Ohm meter to verify the electrical connections on the six-inch BNC

IPN 074-186S

cable.


There must be continuity (<0.2 ohms) between the center pins.



There must be isolation (>10 megohms) between the center pins andthe connector shield.

There must be continuity between the connector shields.

Replace the six-inch BNC cable if it is found to be defective and repeat Step
2 of this procedure.

6 If the six-inch BNC cable is not defective, re-connect the six-inch cable tothe oscillator and to the Crystal Sensor Emulator. If the XTAL Fail message
remains, contact INFICON's Service Department.

6 - 21

XTM/2 Operating Manual

6.5.1.2 Feed-Through Or In-Vacuum Cable
Diagnostic Procedure

1 Refer to Figure 6-8 on page 6-20. Remove the In-Vacuum cable from theSensor Head at point B.

2 Connect the Crystal Sensor Emulator to the In-Vacuum cable.


If the XTAL Fail message disappears after approximately five seconds,
the Feed-Through and In-Vacuum Cable are working properly. Re-install
the In-Vacuum cable to the Sensor Head. Go to section 6.5.1.3 on page
6-23.



If the XTAL Fail message remains, continue at step 3.

3 Disconnect the In-Vacuum cable from the Feed-Through and the Emulator.
Disconnect the six-inch BNC cable from the Feed-Through.

4 Using an Ohm Meter, verify electrical continuity from the BNC center pin on
the Feed-Through to the Microdot center pin on the Feed-Through. A typicalvalue would be less than 0.2 ohms.

5 Verify electrical isolation of the center pin on the Feed-Through from theelectrical ground (Feed-Through body). A typical value would be in excess
of 10 megohms.
If the Feed-Through is found to be defective, replace the Feed-Through,re-attach the BNC and In-Vacuum cables, and repeat this procedure starting at
Step 2, otherwise continue at step 6.

6 Verify electrical continuity from center pin to center pin on the In-Vacuum
cable.

7 Verify that the center pin of the In-Vacuum cable is electrically isolated fromIf the In-Vacuum cable is found to be defective, replace the In-Vacuum cable.
Re-attach the BNC and In-Vacuum cables, and repeat this procedure startingat Step 2, otherwise continue at step 8.

8 Connect the In-Vacuum Cable to the Feed-Through.
9 Verify electrical continuity from the center pin on the BNC connector of the
Feed-Through to the center pin on the un-terminated end of the In-Vacuum
cable.

10 Verify electrical isolation from the center pin to electrical ground(Feed-Through body).
If the Feed-Through/In-Vacuum cable system is found to be defective, look for
defective electrical contacts at the Feed-Through to In-Vacuum cableconnection. Repair or replace the Feed-Through as necessary. Re-attach the
BNC and In-Vacuum cables and repeat this procedure starting at step 2.
Otherwise, continue at step 11.

6 - 22

IPN 074-186S

the In-Vacuum cable shield.

XTM/2 Operating Manual

11 Connect the six-inch BNC cable to the Feed-Through and disconnect it fromthe Crystal Interface Unit (or Oscillator)

12 Verify electrical continuity from the center pin of the Microdot connector on
the Feed-Through to the un-terminated end of the six-inch BNC cable.

13 Verify electrical isolation from the center pin to electrical ground(Feed-Through body).
If the Feed-Through/six-inch BNC cable system is found to be defective, lookfor defective contacts at the Feed-Through to BNC cable connection. Repair or
replace the Feed-Through as necessary, re-attach the BNC cable to the XIU
and In-Vacuum cable to the Crystal head and repeat this procedure starting atstep 2.
6.5.1.3 Sensor Head Or Monitor Crystal
Diagnostic Procedure

1 Remove the Crystal Cover from the Sensor Head.
2 Refer to Figure 6-7 on page 6-20. Connect the Crystal Sensor Emulator to
the Sensor Head at Point C.


If the XTAL Fail message disappears after approximately 5 sec. then the
Sensor Head is operating properly. Re-insert the Crystal Cover into the
Sensor Head.



If the XTAL Fail message remains, continue at step 3.

3 Disconnect the In-Vacuum cable from the Sensor Head and theFeed-Through. Remove the Crystal Sensor Emulator from the Sensor
Head.

IPN 074-186S

4 Using an Ohm meter, verify the electrical connections on the Sensor Head.


Verify there is electrical continuity from the center pin contact on theMicrodot connector on the Sensor Head to the finger spring contact in
the Sensor Head.



There must be electrical isolation between the center pin of the Microdot
connector and the Sensor Head body.

If the Sensor Head is found to be defective, contact INFICON’s Service
Department to have the Sensor Head repaired.

6 - 23

XTM/2 Operating Manual

5 Connect the In-Vacuum Cable to the Sensor Head.


Verify there is continuity (<0.2 ohm) from the finger spring contact in the
Sensor Head to the center pin on the un-terminated end of the
In-Vacuum cable.



Verify there is isolation (>10 megohm) between the finger spring contact
and the In-Vacuum cable shield.

If the Sensor Head or the In-Vacuum cable system is found to be defective, lookfor defective contacts at the In-Vacuum cable to Sensor Head connection,
repair or replace the Sensor Head as necessary. Re-attach the In-Vacuum
cable to the Feed-Through and repeat this procedure starting at step 2.

6 Ensure that the leaf springs in the Sensor Head and those in the ceramic
retainer are bent to an angle of approximately 60 degrees from flat.
6.5.1.4 System Diagnostics Pass But
Crystal Fail Message Remains
If the system is operating properly, yet the Crystal Fail message is still
displayed, perform the following tasks.

1 On the ceramic retainer verify that the center rivet is secure. Repair or
replace the ceramic retainer as necessary.

2 Inspect the inside of the Crystal Cover for build-up of material. Clean or
replace the Crystal Cover as necessary.

6.5.2 % XTAL Life
The Crystal Sensor Emulator contains a quartz crystal having a fundamental
frequency at 5.5 MHz. With the Crystal Sensor Emulator connected, the% XTAL Life display should read:6 - 24

approximately 45% for deposition controllers which allow a 1 MHz
frequency shift.



approximately 38% for deposition controllers which allow a 1.25 MHz
frequency shiftapproximately 30% for deposition controllers which allow a 1.5 MHz
frequency

IPN 074-186S

After verifying the Sensor Head contacts, the Sensor Head/In-Vacuum cableconnection, and the ceramic retainer contacts, re-assemble the system. If the
Crystal Fail message remains, replace the monitor crystal with a good monitor
crystal. Verify that the monitor crystal works properly by inserting it into a known
good measurement system. If you continue to experience problems, contact an
INFICON Applications Engineer for Technical Support.

XTM/2 Operating Manual

6.5.3 Sensor Cover Connection
The Crystal Sensor Emulator can be used to verify the measurement system for
INFICON's Thin Film Deposition Controllers and Monitors, including theIC6000, XTC, IC/4 Plus, IC/4 MPT, XTC/2, XTC/C, XTM/2, and the IC/5.
NOTE: 760-601-G1 (obsolete) is not compatible for use with an IC/5 and IC/4.
760-601-G2 is fully compatible with all thin film deposition controllers.
However, the Crystal Sensor Emulator's Sensor Cover Connector is compatible
with some sensor heads, and is incompatible with others. This is discussed in
the following sections.
6.5.3.1 Compatible Sensor Heads
The Sensor Cover Connection will fit the sensor heads shown in Table 6-4.
Table 6-4 Compatible Sensor Heads

Sensor HeadPart Number

Standard Sensor Head

750-211-G1

Standard Sensor Head with Shutter

750-211-G2

Compact Sensor Head

750-213-G1

Compact Sensor Head with Shutter

750-213-G2

Dual Sensor Head

750-212-G2

6.5.3.2 Incompatible Sensor Heads
The Sensor Heads for which the Crystal Sensor Emulator's Sensor CoverConnector will not fit are shown in Table 6-5.

IPN 074-186S

Table 6-5 Incompatible Sensor Heads

Sensor HeadPart Number

UHV Bakeable Sensor Head (12 inch)

007-219

UHV Bakeable Sensor Head (20 inch)

007-220

UHV Bakeable Sensor Head (30 inch)

007-221

UHV Bakeable Sensor Head w/ Shutter (12 inch)

750-012-G1

UHV Bakeable Sensor Head w/ Shutter (20 inch)

750-012-G2

UHV Bakeable Sensor Head w/ Shutter (30 inch)

750-012-G3

Sputtering Sensor Head

007-031

CrystalSix Sensor Head with position select750-446-G1

CrystalSix Sensor Head

750-260-G1

NOTE: The Crystal Sensor Emulator’s Sensor Cover will not fit the crystal
holder opening of the older style INFICON transducers that have the"soldered" finger springs.

6 - 25

XTM/2 Operating Manual

6.5.4 Specifications
Dimensions
1.58 in. diameter x 1.79 in.
(40.13 mm diameter x 45.47 mm)
Temperature Range
0 to 50 oC
Frequency
760-601-G1: 5.5 MHz ± 30 ppm at room temperature
760-601-G2: 5.5 MHz ± 1 ppm at room temperature
Materials

IPN 074-186S

304 Stainless Steel, Nylon, Teflon, brass. Some internal components containzinc, tin, and lead.

6 - 26

XTM/2 Operating Manual

Appendix A
Table of Densities and Z-ratios
The following table represents the content of the instrument's material library.
The list is alphabetical by chemical formula.

CAUTION
Some of these materials are toxic. Please consult thematerial safety data sheet and safety instructions
before use.
Remote Communications Responses and Commands use the code value torepresent a specific material. An * is used to indicate that a Z-ratio has not been
established for a certain material. A value of 1.000 is defaulted in thesesituations.

IPN 074-186S

Table A-1 Material Table

FormulaDensityZ-ratio

Material Name

Ag

10.5000

0.529

Silver

AgBr

6.470

1.180

Silver Bromide

AgCl

5.560

1.320

Silver Chloride

Al

2.700

1.080

Aluminum

Al2O3

3.970

0.336

Aluminum Oxide

Al4C3

2.360

*1.000

Aluminum Carbide

AIF3

3.070

*1.000

Aluminum Fluoride

AIN

3.260

*1.000

Aluminum Nitride

AlSb

4.360

0.743

Aluminum Antimonide

As

5.730

0.966

Arsenic

As2Se34.750*1.000Arsenic SelenideAu

19.300

0.381

Gold

B

2.370

0.389

Boron

B 2O 31.820*1.000Boron Oxide

B 4C

2.370

*1.000Boron Carbide

Ba

3.500

2.100

Barium

BaF2

4.886

0.793

Barium Fluoride

BaN2O6

3.244

1.261

Barium Nitrate

BaO

5.720

*1.000Barium Oxide

A-1

XTM/2 Operating Manual

A-2

FormulaDensityZ-ratio

Material NameBaTiO3

5.999

0.464

Barium Titanate (Tetr)

BaTiO3

6.035

0.412

Barium Titanate (Cubic)

Be

1.850

0.543

Beryllium

BeF2

1.990

*1.000Beryllium Fluoride

BeO

3.010

*1.000Beryllium Oxide

Bi

9.800

0.790

Bismuth

Bi2O3

8.900

*1.000

Bismuth Oxide

Bi2S3

7.390

*1.000

Bismuth Trisulphide

Bi2Se36.820*1.000

Bismuth Selenide

Bi2Te37.700*1.000

Bismuth Telluride

BiF3

5.320

*1.000

Bismuth Fluoride

BN

1.860

*1.000Boron Nitride

C

2.250

3.260

Carbon (Graphite)

C

3.520

0.220

Carbon (Diamond)C 8H 81.100*1.000

Parlyene (Union Carbide)

Ca

1.550

2.620

Calcium

CaF2

3.180

0.775

Calcium Fluoride

CaO

3.350

*1.000

Calcium Oxide

CaO-SiO2

2.900*1.000

Calcium Silicate (3)

CaSO4

2.962

0.955

Calcium Sulfate

CaTiO34.100*1.000

Calcium Titanate

CaWO4

6.060

*1.000

Calcium Tungstate

Cd

8.640

0.682

Cadmium

CdF2

6.640

*1.000Cadmium Fluoride

CdO

8.150

*1.000Cadmium Oxide

CdS

4.830

1.020

Cadmium Sulfide

CdSe

5.810

*1.000Cadmium Selenide,

CdTe

6.200

0.980

Cadmium Telluride

Ce

6.780

*1.000Cerium

CeF3

6.160

*1.000Cerium (111) Fluoride

CeO2

7.130

*1.000Cerium (IV) Dioxide

Co

8.900

0.343

Cobalt

CoO

6.440

0.412

Cobalt Oxide

IPN 074-186S

Table A-1 Material Table (continued)

XTM/2 Operating Manual

IPN 074-186S

Table A-1 Material Table (continued)

FormulaDensityZ-ratio

Material Name

Cr

7.200

0.305

Chromium

Cr2O3

5.210

*1.000Chromium (111) Oxide

Cr3C2

6.680

*1.000Chromium Carbide

CrB

6.170

*1.000Chromium Boride

Cs

1.870

*1.000Cesium

Cs2SO4

4.243

1.212

Cesium Sulfate

CsBr

4.456

1.410

Cesium Bromide

CsCI

3.988

1.399

Cesium Chloride

CsI

4.516

1.542

Cesium Iodide

Cu

8.930

0.437

Copper

Cu2O

6.000

*1.000

Copper Oxide

Cu2S

5.600

0.690

Copper (I) Sulfide (Alpha)

Cu2S

5.800

0.670

Copper (I) Sulfide (Beta)

CuS

4.600

0.820

Copper (11) Sulfide

Dy

8.550

0.600

Dysprosium

Dy2O3

7.810

*1.000

Dysprosium Oxide

Er

9.050

0.740

Erbium

Er2O3

8.640

*1.000Erbium Oxide

Eu

5.260

*1.000Europium

EuF2

6.500

*1.000Europium Fluoride

Fe

7.860

0.349

Iron

Fe2O3

5.240

*1.000Iron Oxide

FeO

5.700

*1.000Iron Oxide

FeS

4.840

*1.000Iron Sulphide

Ga.

5.930

0.593

Gallium

Ga2O3

5.880

*1.000

Gallium Oxide (B)

GaAs

5.310

1.590

Gallium Arsenide

GaN

6.100

*1.000

Gallium Nitride

GaP

4.100

*1.000

Gallium Phosphide

GaSb

5.600

*1.000

Gallium Antimonide

Gd

7.890

0.670

Gadolinium

Gd2O3

7.410

*1.000Gadolinium Oxide

Ge

5.350

0.516

Germanium

A-3

XTM/2 Operating Manual

A-4

FormulaDensityZ-ratio

Material Name

Ge3N2

5.200

*1.000Germanium Nitride

GeO2

6.240

*1.000Germanium Oxide

GeTe

6.200

*1.000Germanium TellurideHf

13.0900.360

Hafnium

HfB2

10.500*1.000Hafnium Boride,

HfC

12.200*1.000Hafnium Carbide

HfN

13.800*1.000Hafnium Nitride

HfO2

9.680

*1.000Hafnium Oxide

HfSi2

7.200

*1.000Hafnium Silicide,Hg

13.4600.740

Mercury

Ho

8.800

0.580

Holminum

Ho2O3

8.410

*1.000Holminum Oxide

In

7.300

0.841

Indium

In2O3

7.180

*1.000Indiurn Sesquioxide,

In2Se35.700*1.000Indium Selenide

In2Te35.800*1.000Indium Telluride

InAs

5.700

*1.000Indium Arsenide

InP

4.800

*1.000Indium Phosphide

InSb

5.760

0.769

Indium Antimonide

Ir

22.4000.129

IridiumK

0.860

10.189

Potassium

KBr

2.750

1.893

Potassium Bromide

KCI

1.980

2.050

Potassium Chloride

KF

2.480

*1.000

Potassium Fluoride

KI

3.128

2.077

Potassium Iodide

La

6.170

0.920

Lanthanum

La2O3

6.510

*1.000Lanthanum Oxide

LaB6

2.610

*1.000Lanthanurn Boride

LaF3

5.940

*1.000Lanthanum Fluoride

Li

0.530

5.900

Lithium

LiBr

3.470

1.230

Lithium Bromide

LiF

2.638

0.778

Lithium Fluoride

LiNbO3

4.700

0.463

Lithium Niobate

IPN 074-186S

Table A-1 Material Table (continued)

XTM/2 Operating Manual

IPN 074-186S

Table A-1 Material Table (continued)

FormulaDensityZ-ratio

Material Name

Lu

9.840

*1.000

Lutetium

Mg

1.740

1.610

Magnesium

MgAl2O4

3.600*1.000Magnesium Aluminate

MgAl2O6

8.000*1.000Spinel

MgF2

3.180

0.637

Magnesium Fluoride

MgO

3.580

0.411

Magnesium Oxide

MgO3Al2O3

8.000*1.000Spinel

Mn

7.200

0.377

Manganese

MnO

5.390

0.467

Manganese Oxide

MnS

3.990

0.940

Manganese (ll) Sulfide

Mo

10.2000.257

Molybdenum

Mo2C

9.180

*1.000

Molybdenum Carbide

MoB2

7.120

*1.000

Molybdenum Boride

MoO3

4.700

*1.000

Molybdenum Trioxdide

MoS2

4.800

*1.000

Molybdenum Disulfide

Na

0.970

4.800

SodiumNa3AIF6

2.900*1.000Cryolite

Na5Al3F14

2.900*1.000Chiolite

NaBr

3.200

*1.000Sodium Bromide

NaCl

2.170

1.570

Sodium Chloride

NaCIO3

2.164

1.565

Sodium Chlorate

NaF

2.558

0.949

Sodium Fluoride

NaNO3

2.270

1.194

Sodium Nitrate

Nb

8.578

0.492

Niobium (Columbium)

Nb2O3

7.500

*1.000

Niobium Trioxide

Nb2O5

4.470

*1.000

Niobium (V) Oxide

NbB2

6.970

*1.000

Niobium Boride

NbC

7.820

*1.000

Niobium Carbide

NbN

8.400

*1.000

Niobiunn Nitride

Nd

7.000

*1.000

Neodynium

Nd2O3

7.240

*1.000

Neodynium Oxide

NdF3

6.506

*1.000

Neodynium Fluoride

Ni

8.910

0.331

NickelA-5

XTM/2 Operating Manual

A-6

FormulaDensityZ-ratio

Material Name

NiCr

8.500

*1.000Nichrome

NiCrFe8.500*1.000

Inconel

NiFe

8.700

*1.000

Permalloy

NiFeMo8.900*1.000Supermalloy

NiO

7.450

*1.000

Nickel Oxide

P 3N 52.510*1.000

Phosphorus NitridePb

11.300

1.130

Lead

PbCl2

5.850

*1.000

Lead Chloride

PbF2

8.240

0.661

Lead Fluoride

PbO

9.530

*1.000

Lead Oxide

PbS

7.500

0.566

Lead Sulfide

PbSe

8.100

*1.000

Lead Selenide,

PbSnO38.100*1.000

Lead Stannate

PbTe

8.160

0.651

Lead Telluride

PbTiO37.50

1.16

Lead TitanatePd

12.0380.357

Palladium

PdO

8.310

*1.000Palladium Oxide

Po

9.400

*1.000

Polonium

Pr

6.780

*1.000Praseodymium

Pr2O3

6.880

*1.000Praseodymium Oxide

Pt

21.4000.245

Platinum

PtO2

10.200*1.000

Platinum Oxide

Ra

5.000

*1.000Radium

Rb

1.530

2.540

Rubidium

RbI

3.550

*1.000

Rubidiurn Iodide

Re

21.0400.150

RheniumRh

12.4100.210

RhodiumRu

12.362

0.182

Ruthenium

S8

2.070

2.290

Sulphur

Sb

6.620

0.768

Antimony

Sb2O3

5.200

*1.000Antimony Trioxide

Sb2S3

4.640

*1.000Antimony Trisulfide

Sc

3.000

0.910

Scandiurn

IPN 074-186S

Table A-1 Material Table (continued)

XTM/2 Operating Manual

IPN 074-186S

Table A-1 Material Table (continued)

FormulaDensityZ-ratio

Material Name

Sc2O3

3.860

*1.000Scandiurn Oxide

Se

4.810

0.864

Selenium

Si

2.320

0.712

Silicon

Si3N4

3.440

*1.000Silicon Nitride

SiC

3.220

*1.000Silicon Carbide

SiO

2.130

0.870

Silicon (II) Oxide

SiO2

2.648

1.000

Silicon Dioxide

Sm

7.540

0.890

Samarium

Sm2O3

7.430

*1.000Samariurn Oxide

Sn

7.300

0.724

Tin

SnO2

6.950

*1.000Tin Oxide

SnS

5.080

*1.000Tin Sulfide

SnSe

6.180

*1.000Tin Selenide

SnTe

6.440

*1.000Tin Telluride

Sr

2.600

*1.000Strontium

SrF2

4.277

0.727

Strontium Fluroide

SrTiO3

5.123

0.31

Strontium Titanate

SrO

4.990

0.517

Strontium Oxide

Ta

16.6000.262

Tantalum

Ta2O5

8.200

0.300

Tantalum (V) Oxide

TaB2

11.150*1.000

Tantalum Boride

TaC

13.900*1.000

Tantalum Carbide

TaN

16.300*1.000

Tantalum Nitride

Tb

8.270

0.660

TerbiumTc

11.500*1.000Technetium

Te

6.250

0.900

Tellurium

TeO2

5.990

0.862

Tellurium Oxide

Th

11.694

0.484

Thorium

ThF4

6.320

*1.000Thorium.(IV) Fluoride

ThO2

9.860

0.284

Thorium Dioxide

ThOF2

9.100

*1.000Thorium Oxyfluoricle

Ti

4.500

0.628

Titanium

Ti2O3

4.600

*1.000Titanium Sesquioxide

A-7

XTM/2 Operating Manual

A-8

FormulaDensityZ-ratio

Material Name

TiB2

4.500

*1.000Titanium Boride

TiC

4.930

*1.000Titanium Carbide

TiN

5.430

*1.000Titanium Nitride

TiO

4.900

*1.000Titanium Oxide

TiO2

4.260

0.400

Titanium (IV) Oxide

TI

11.8501.550

Thallium

TIBr

7.560

*1.000Thallium Bromide

TICI

7.000

*1.000Thallium Chloride

TII

7.090

*1.000Thalliurn Iodide (B)U

19.0500.238

Uranium

U 3O 88.300*1.000Tri Uranium Octoxide

U 4O 910.9690.348

Uranium Oxide

UO2

10.9700.286

Uranium Dioxide

V

5.960

0.530

Vanadium

V 2O 53.360*1.000

Vanadium Pentoxide

VB2

5.100

*1.000

Vanadium Boride

VC

5.770

*1.000

Vanadium Carbide

VN

6.130

*1.000

Vanadium Nitride

VO2

4.340

*1.000

Vanadium Dioxide

W19.3000.163

Tungsten

WB2

10.770*1.000Tungsten BorideWC

15.6000.151

Tungsten Carbide

WO3

7.160

*1.000Tungsten Trioxide

WS2

7.500

*1.000Tungsten Disulphicle

WSi2

9.400

*1.000Tungsten Silicide

Y

4.340

0.835

Yttrium

Y 2O 35.010*1.000Yttrium Oxide

Yb

6.980

1.130

Ytterbium

Yb2O3

9.170

*1.000Ytterbium Oxide

Zn

7.040

0.514

Zinc

Zn3Sb26.300*1.000Zinc Antimonide

ZnF2

4.950

*1.000Zinc Fluoride

ZnO

5.610

0.556

Zinc Oxide

IPN 074-186S

Table A-1 Material Table (continued)

XTM/2 Operating Manual
Table A-1 Material Table (continued)

DensityZ-ratio

Material Name

ZnS

4.090

0.775

Zinc Sulfide

ZnSe

5.260

0.722

Zinc Selenide

ZnTe

6.340

0.770

Zinc Telluride

Zr

6.490

0.600

Zirconium

ZrB2

6.080

*1.000

Zirconium Boride

ZrC

6.730

0.264

Zirconium Carbide

ZrN

7.090

*1.000

Zirconium Nitride

ZrO2

5.600

*1.000

Zirconium Oxide

10.000*1.000

USER

IPN 074-186S

Formula

A-9

XTM/2 Operating Manual

IPN 074-186S

This page is intentionally blank.

A - 10XTM/2 Operating Manual

Index
A

F

active oscillator 5-9, 5-12
anharmonic 5-6, 5-7, 5-11
application support 1-10
applications 2-22
AT
crystal 5-12
resonator 5-8

field service 1-10
fundamental 5-11, 5-12

Bbakeable sensor 3-6
Biological 2-22
biological measurement 2-25

IPN 074-186S

C
calibration 5-1, 5-3
chart recorder 3-15
command structure 3-18
compact sensor 3-6
computer communications 3-16
configuration switches 2-15
contamination
declaration of contamination 1-10
crystalfrequency spectrum 5-12
resonance point 5-12
crystal fail 4-4
crystal replacement 6-15
crystal snatcher 6-19
CrystalSix 3-10
CrystalSix sensor 3-6

Ggrounding stud 2-17
grounding, electrical 3-2

L
LCD Contrast 6-1
liquid measurement 2-25

Mmass sensitivity 5-4
measurement theory 5-4
mode hopping 5-11
ModeLock 5-12
monitor crystals 5-6
Monitoring
Systems with a Source Shutter 2-23
Systems without a Source Shutter 2-22
multiple layer deposition 5-4

Nnoise pickup 3-3O
operation 1-8
oscillator 1-9, 5-12
oscillator circuit 5-11

DP

density 5-1
calibration 5-1
value 5-1
deposition monitor 2-22
Dual sensor 3-6

parameter update errors 6-2
period measurement technique 5-8
process variable storage 1-7
programming 4-1
pulse accumulator 5-8

EQ

earth ground 1-3, 3-2
electrode-to-quartz bond 5-7
electroplating 2-22
error messages 6-1
etching 2-22, 2-24

quality rate control 5-9
quartz crystal 5-4, 5-6
quasiharmonic 5-7
quick use guide 2-1

R
rate sampling 2-23

Index - 1

XTM/2 Operating Manual

rear panel 2-13
recorder output 1-6
reference oscillator 5-8
relays 3-14
Remote command 3-26
repair support 1-10
resonance 5-9
return material authorization 1-10

S
series resonance 5-12
source shutter 3-14
specifications 1-6
sputtering sensor 3-6
standard sensor 3-6
Status command 3-23

T
test mode 3-11
thickness shear mode 5-6
thickness twist mode 5-6
tooling 5-1, 5-2

U
unpacking 2-1
Update Command 3-23

V
voltage selection 2-3

XZzero displayed thickness 2-9
Z-Match equation 5-9
Z-Match technique 5-9
Z-Ratio 5-1, 5-3, A-1

Index - 2

IPN 074-186S

XIU (Crystal Interface Unit) 1-9