MMC Activities..............1
Overseas Trends............5
Members’ Profiles .........6
Information..................8

MMC Activities

The 9th International Micromachine / Nanotech Symposium
The 9th International Micromachine / Nanotech Symposium, which has the subtitle of "Foundationof Industrial Technology in the 21st Century" was held on November 13, 2003, at the Science Museumin Kitanomaru Park, Tokyo. It was organized by Micromachine Center, and was supported by Ministryof Economy, Trade and Industry (METI) and New Energy Developing Organization (NEDO), and was
subsidized by Japan Motorcycle Racing Organization. The lectures and a panel discussion was a
resounding success, as attendees participated actively in the panel discussion and lively exchanged
opinions with panelists.

Opening Address by Mr. Toshiro Shimoyama

In Session 1, "Opening", an opening address was given by Mr. Toshiro Shimoyama, Chairman of theMicromachine Center, followed by a guest speech by Mr. Sakae Takahashi, Executive Director of
NEDO. Mr. Takahashi spoke in particular about the MEMS project begun in Fiscal 2003 as part of the
METI program "Focus 21", and expressed his appreciation to the daily contributions of researchers
cooperating on NEDO projects and activities of the Micromachine Center.

Internet Home Page : http://www.mmc.or.jp/

Special Lecture by Prof. Stephen D. Senturia

Special Lecture by Prof. Nico F. de Rooij

The opening ceremony was followed by two special
lectures presented by pioneers in the field of MEMS in
the West. The first lecture was presented by Professor
Nico F. de Rooij of the University of Neuchatel,
Switzerland, on the theme of "MEMS andOpportunities for University / Industry Technology
Transfer". The lecture discussed cases of technology
transfer to industry in which the University of
Neuchatel was involved and the products thus
developed. The second was presented by Professor
Stephen D. Senturia of the Massachusetts Institute ofTechnology, U.S.A., on "Turning MEMS Ideas into
MEMS Products". The lecture discussed the past andpresent of MEMS, future trends for MEMS, and points
to be considered to commercialize the MEMS ideas.
Session 2, which has the theme of "The Path to
New Industries in the 21st Century", featured threelectures; Session 3, which has the theme of "Innovative
R&D", featured four lectures; and Session 4, which has
the theme of "Strategy for Micro / Nano Technology(Exploring of New MEMS Development)", featured
four lectures. In all, thirteen invited speakers,
including six from overseas, addressed in the
symposium. A panel discussion was made on thetheme of "MEMS industrialization" in Session 4. Seven
panelists answered to the questions from audience,
the lively exchange of Q & A attracted interest of theentire venue.
Of the 218 registered participants, about 83% wereindustry-related persons who are mostly researchers
and the managers, 8% belonged to public agencies
such as the National Institute of Advanced Industrial
Science and Technology (AIST), 7% were fromuniversities, and 2% were from other professions. This
analysis shows that this symposium especially attracts
industrial researchers for their R & D. In total,
participants numbered 297, including registeredparticipants, invited guests, members of the press andothers. With the venue very vibrant from beginning to
the end, the symposium was a great success.
Micromachine Center would like to express deepest
thanks to all participants and everyone to cooperate us.
The next symposium, The 10th International
Micromachine / Nanotech Symposium, will be held on
November 11 (Thu), 2004, at the same Science
Museum in Kitanomaru Park, Tokyo, which is locatednear the Imperial Palace, in conjunction with The 15th
Micromachine Exhibition.

Panel Discussion

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The 14th Micromachine Exhibition: "Micromachine 2003"
The 14th Micromachine Exhibition, "Micromachine
2003," was held in conjunction with The 9th International
Micromachine/Nanotech Symposium at the Science
Museum in Kitanomaru Park, Tokyo, for 3 days from
November 12 to 14, 2003.
In addition to the Micromachine Center and 14 of it's
supporting member organizations, generous cooperationin the arrangement of exhibitions was also provided byprivate businesses, universities, and independent publicorganizations. A total of 238 displays (323 booths) were
exhibited by representatives of various businesses,
academic groups, universities, and researchorganizations. The theme for this year's exhibition was"Limitless Business Fields Opened up by Micro/Nano
Technology: International Exhibition on MicroUltraprecision/Microfabrication, MEMS, Nanotechnology,
and Biotechnology". France's National Center for
Scientific Research (Centre National de la Recherche
Scientifique) and seven other organizations from abroad
also presented exhibits.
In accordance with the increased number of
exhibitors, the Micromachine 2003 exhibition occupied,
for the first time, the entire first floor hall space and apart of the lounge of the Science Museum.
Furthermore, a total of 77 businesses and academic
groups took part in the exhibition, including 2 companies
participating for the first time, and a wide range of newtechnologies and products in the fields of nanotechnology and micromachines were presented.
Thanks in part to the exhibition being held inconjunction with the 9th International Micromachine/Nanotech Symposium, a record attendance of 8,793 people
was achieved over the three days of the event. Researchers,
engineers, and administrators from the frontlines of various
technological fields accounted for a large number of theseattendees, and through the exchange of ideas and sharingof research information with colleagues from other fields,
the exhibition provided an ideal opportunity for discussionof the possibilities for new technologies and to resolve awide range of developmental issues.

The main products displayed at the exhibition
included micromachines, their associated components
and application systems, MEMS-related systems, nanotechnologies and materials, technologies related to microultraprecision fabrication and production, equipment,
biotechnology and medical systems, evaluation andmeasurement devices, and software. In this regard,
Micromachine 2003 was ideally suited to researchers,
engineers, designers, manufacturers, and managers fromfields such as mechanisms and precision machinery;electrical devices and electronics, medicine; information
technology; automobiles and transportation; biology,
physics, and chemistry; architecture; metallurgy; space
aviation; and shipping and oceanography.
Furthermore, the exhibition provided an excellent
opportunity for the promotion of technologies, devices,and products by businesses in the field of micromachineresearch and development; for the presentation of theresults of research projects by universities and otherresearch organizations, and for the announcement of
products and technologies by other newly participating
businesses. On its opening day, the exhibition was visited
by Mr. Yoshifumi Fujita, Director of the Industrial
Machinery Division of METI's Manufacturing Industries
Bureau, who spoke at the reception that was held
following the exhibition.

The exhibition hall, packed with attendees

Attendees at the post-exhibition reception

Micromachine 2004 will be held from
November 10 (Wednesday) to 12 (Friday),2004 at the Science Museum, Kitanomaru
Park, Tokyo.
T e l: 0 3 - 3 2 6 2 - 8 4 4 1
F a x: 0 3 - 3 2 6 2 - 8 4 4 2
Email:
m i c ro @ m e s a g o - m e s s e f r a n k f u r t . c o m
U R L:
h t t p : / / w w w. m e s a g o messefrankfurt.com/micro

3

International Electrotechnical Commission
IEC/TC47 Delft Conference Reportquestions raised by British and American
representatives about the English phrasing, inrecognition of the fact that such questions wereunrelated to the essence of the proposals, therepresentatives said that they would accept the
proposals. Since this eliminated the basic
problems, approval was given to proceed on to thenext step of developing a committee draft and it
was decided that Japan would submit a draft in
March 2004. Both proposals thereby advanced asingle step further towards approval.

Description of conference
The TC47/WG4 meeting was held in the city ofDelft in the Netherlands on October 28, 2003.
Three proposals for international standardization
Three representatives from Japan attended the
IEC/TC47 (International ElectrotechnicalCommission Technical Committee Meeting No. 47)
held in Delft in the Netherlands on October 28,
2003. In addition to participating in discussions
concerning proposals for international
standardization currently being put forth by Japanstandards for the terminology to be used for
micromachines and MEMS, tensile testing methods
for thin film materials, a proposal for international
standardization developed from the results of the
R&D for Standards Project conducted from 1999
until 2001, and standard specimens for testing-areport was also delivered on plans for fatigue
testing of thin film materials to be performed aspart of the energy usage management systemstandardization research survey begun this year,
and a request was made for international
cooperation in this regard. It was reported thatthese are the only three proposals being put forthat the present time by Japan in the field of
nanotechnology materials.

Holding of a new WG meeting
The Korean delegation proposed that a WG
meeting be held in June 2004 in Geneva or Phoenix
to discuss the creation of generic specifications for
MEMS. The stated purpose of this meeting would
be to start to establish a position for lists oftechnical terms, tensile testing methods, fatigue
testing methods, and other MEMS standards to be
developed in the future. The Japanese delegation
expressed its agreement with this proposal and it
was decided that the WG meeting would be held.
Persons in attendance
The persons who attended the meeting are as
listed below:
R. Turner (Convenor,UK KBCI)
Kuniki Owada(International Standardization Engineering
Laboratory)
Akira Umeda(Japan, National Institute of Advanced Industrial
Science and Technology)
M. Konno (Japan, Micromachine Center)Sekwang Park
(Korea, Kyungpook National University)
Sang-Geun Lee(Korea, Agency for Technology and Standards)
Bo Cui(China, Heibei Semiconductor Research Institute)
Miao Lu(China, Heibei Semiconductor Research Institute)

Discussion of individual proposals
A discussion was held on comments submitted
by Korea and China concerning the proposal for
micromachine and MEMS terminology submitted
by the Micromachine Center in July of 2002 now at
the stage of a committee draft and it was decided
that the terms would be prepared as a committee
draft for vote. However it was requested thatclarification be made of the scheduling ofmaintenance before a final draft for vote be
written.
As for the two proposals concerning thin film
materials tensile testing, these proposals had
already been presented in July earlier this year,
and while they had only been adopted as new
proposals as of October 10, although there were
4

Overseas Trends

Recent MEMS Trends in the U.S.
the MEMS infrastructure was fully developed, the foundry wastransferred to a private company. The MEMS Exchange,
currently in operation, is a network of fabrication facilities atuniversities designed to aid universities and small to mediumsize companies. By linking the facilities at these universities,
the project is beneficial for universities that conduct only smallscale MEMS research.
With the support of DARPA and other organizations, startup
companies have started to commercialize the results of research
conducted by universities. Some professors and university
researchers who pioneered the field of MEMS are taking twoyear long sabbaticals to launch their own venture companies,
where their achievements are put into practical use. Dr. Gabriel,
former professor of Carnegie Mellon University, created an
innovative method for developing MEMS-based speaker andmicrophone chips. About two years ago, he founded a fablesscompany named Akustica with some twenty employees and iscurrently involved in operations, while on sabbatical from CMU.
Akustica is expected to break even by 2005. Since startup
companies like Akustica rely on investments from venture capitaland individual investors, their success depends both on thetechnology to be commercialized and their fund-raising ability.
California is a center for hi-tech companies, such as thoselocated in Silicon Valley, and academic research. The state has
many prestigious universities, such as the University ofCalifornia, Berkeley, but since their campuses have reached asaturation point for research facilities, additional facilities andfaculties for advanced research are being constructed in Irvine,
located 40 mile south of Los Angeles. Many biotechnology
companies and other ventures are flocking to Irvine because of
the venture capital available and are working closely with UC
Irvine in biotechnology research. Irvine is already beginning totake the form of a "Bio Valley."
Normally new companies look outside the company fortechnological seeds to develop MEMS products, but U.S.
companies establish relationships, in the form of joint researchand the dispatch of in-house researchers, with universities thathave accumulated technological expertise through advanced
research. Intel Corporation, for example, has begun conducting
biotechnological research in cooperation with universities.
According to comments we received, it is extremely
important for startup fabless companies to find foundry services
that can maintain repeatability in product quality andperformance.
A widely used technology, MEMS is being incorporated into
various devices developed with CMOS, SiC and other materials.
As measuring technology is becoming vital to the application of
MEMS, the MEMS Industry Group (MIG) is holding workshops
to address this issue.
The U.S. MEMS community has been shifting to applicationoriented research, while firms offering integrated services havealso expressed an interest in MEMS technology. Advanced
research covers the potential uses of not only silicon but also
new innovative materials for MEMS device. Many experts haveindicated that commercialization of MEMS technology must
include an improvement in reliability and reduction in costs,
particularly packaging costs.

Microelectromechanical Systems (MEMS) is a technologicalconcept that originated in the U.S. in the late 1980s. MEMS
function to form electromechanical devices by integrating thefunctions of actuators and other mechanical elements withcircuitry on wafers using microfabrication. Following subsidies
provided by the National Science Foundation (NSF) to support
MEMS, the Defense Advanced Research Project Agency(DARPA) began a full-scale MEMS program with an annual
budget of $40-50 million.
We interviewed academic and industrial experts tounderstand the current state of MEMS in the U.S. as part of asurvey commissioned by the Japan Industrial Policy ResearchInstitute. Contacts are listed below.
Prof. Wen Ko, Case Western Reserve University
Has been studying pressure sensors since the 1960s
and is now conducting training on MEMS in China.
Dr. Clement, Managing Director, MEMS Industry Group
Serves as the day-to-day manager of MIG operations
and activities.
Dr. Gabriel, Akustica, former Prof. of Carnegie Mellon
University
Served as Director in the initial DARPA MEMS
Program and contributed to establishing the existing
MEMS research system.
Dr. Bob Rao, Technology and Manufacturing Group, Intel
Corporate
Actively involved in research on microsystems andnanotechnology
Prof. Tang, UC Irvine, former MEMS Director of DARPA
Former MEMS Director at DARPA and is now
launching MEMS research at UC Irvine.
MEMS research and infrastructure in the U.S. have beendeveloped under the sponsorship of DARPA. DARPA's goals insupporting MEMS R&D are to determine potential applicationsof MEMS technology in national defense, as well as commercial
applications. Accordingly, DARPA has continuously funded
MEMS projects anticipated to spark developments in
microfabrication technology, changing the focus of the research
topics to meet the needs of the times. In the initial stages of the
MEMS Program, DARPA aimed at enhancing overall MEMS
technology and subsequently focused on applied research in thefields of optics and biotechnology. At present, the agency has
shifted its research thrust to biotechnology and wirelesstechnology from optical switches, which it had supported duringthe "IT bubble era."
In order to ensure that research findings lead tocommercialized products, DARPA has recently sought toinclude private companies in the program. In addition, theagency undergoes strict evaluations at the completion of each
18-month phase in a total of three phases.
DARPA also funds research conducted by startup
companies until they can find venture capital and other financial
sources. The funding has proved effective in luring serious
investors. As the MEMS infrastructure is still in its growing
stage, DARPA supported a foundry service based onstandardized multiuser MEMS processes (MUMPs) that enable
us to fabricate different types of devices on a single wafer. After

5

Members' Profiles

Micro Device Center
Yamatake Corporation
1. Challenge of Micromachine Technology
We have been developing business operations with the aim of
improving the energy and resource efficiency in buildings, plants, andfactories under the visionary slogan "Providing Greater Comfort for
People and the Earth." To achieve our business goals, sensing andcontrol technologies are essential. Hence, we have placed emphasis on
microelectromechanical systems (MEMS) for developing miniature,high-performance sensors and actuators to be installed on the ends ofmeasuring devices in the field.
We first tackled micromachine technology with the inauguration of
our corporate research center in the middle of 1980. Since then, we
have established a business partnership with Honeywell Inc. (U.S., now
Honeywell International Inc ) for the purpose of researching andcommercializing micromachine technology. Today, we are taking on
both R&D and fabrication of microdevices, from sensor elements topackages, and are functioning as an organization capable of making
microdevices for in-house use available commercially through divisions
products. Since it requires much time and effort to discover new
products and businesses with marketability, a separate organization
has been created in the Research & Development Headquarters to
perform exploratory seeds development function.

Shunichiro Awa
Director, Micro Device Center
primarily in air conditioning systems for buildings, while increasingly
attracting the attention of both national and international users.

2) Microflow Sensors
We began full-scale development of thermal flow sensors in the late1980's, with the aim of applying this knowledge to gas flow measurement.
In 1994 we succeeded in mass-producing microflow sensors with 1.7
millimeters square chip. The sensor possesses outstanding features, suchas a high sensitivity capable of measuring a flow rate of 1 cm/sec or less.
We improved the performance and functionality of the sensor throughthe production of numerous prototypes and repeated field tests. In
addition, we collected and evaluated sensors that had been installed in
the field for more than ten years. Then proved the long term reliability ofour products. Using this microflow sensor, we have developed a highspeed, high-accuracy flow measurement technology for a wide range ofapplications, from ultra low flow rates to high flow rates. In addition,
many results have been obtained by applying this microflow sensor tostudies of flows on wall surfaces.

2. Development of Micromachine Technology
Here, we will introduce some of the microdevices we havesuccessfully developed and commercialized.

1) Humidity sensors
Humidity sensors are next in importance after temperature sensors interms of controlling the air condition in a building. A stable humiditysensitive polymer film was developed through joint research with
universities conducted over several years, enabling us to develop advanced
humidity sensors. Evaluations conducted by an independent Swiss
institute revealed that our product is superior to other major humidity
sensors in the world in dew point stability and chlorine resistance.
Accordingly, Yamatake humidity sensors are being widely employed,

Humidity sensing elements

3) Pressure Sensors
The most basic targets of industrial measurements are flow rate
and pressure. A pressure sensor measures not only pressure, but also
flow rate calculated based on the pressure differential across thediaphragm, or orifice, formed in the piping. The pressure sensor is theoldest MEMS sensor that has been widely used in industrial
applications. Yamatake has also conducted intensive research anddevelopment since the inauguration of the corporate research centerand the Micro Device Center. We successfully developed pressure
sensors utilizing piezoresistive pressure sensing elements andmarketed them as the world's smallest microprocessor-based pressure
sensors. Our primary pressure sensors have high accuracy and hightemperature stability.
In order to meet the demands for pressure measurements underhigh-temperature and corrosive environments, we developed the
Sapphire capacitive sensor that can offer excellent resistance to heatand corrosion. The sensor element is produced from 100% sapphireand can directly measure temperatures of several hundreds of degrees,
as well as pressures on corrosive media. Since the development phase,the sensor has received high praise from customers in the finechemical and semiconductor industries. We hope to acceleratecommercialization of this sensor.

Microflow sensing elements

3. Future Challenges

Piezo-resistive pressure
sensing elements

As described above, humidity, flow rate, and pressure are basic
targets of sensing in thefield of measurement and control. We continue to conduct researchand development to meet the needs of our customers. In addition, we
will employ a comprehensive technology accumulated through thedevelopment of in-house microdevices to take a further step toward
developing and producing commercial devices for outside customers.

Sapphire pressure sensing
elements

6

ULVAC, Inc.

1. The Challenge of MEMSULVAC has been supplying advanced vacuum
technology products, such as semiconductor production
equipment, flat panel displays and other production
equipment based on myriad technical development in thecore of vacuum technologies Some ULVAC Group
companies have been involved in such advanced
materials as ultrafine particles, and surface analysis
equipment. In addition, ULVAC plans to enter new fields,
including biotechnology, fine mechatronics, and finechemicals. We have added to our equipment lineup with
the SME-200 sputtering device for forming high-dielectricfilms and SAW device electrodes, the CME-200 CVD
device for forming silicon oxide films and nitride films,
and the NLD-6000, which demonstrates its efficiency inthe deep etching of quartz.

Hiroyuki Yamakawa,
Managing Director and General Manager of the Tsukuba
Institute for Super Materials

water-shedding quality, hydrophilicity, biocompatibility,
antifungal properties and other properties to various
types of samples. It also provides excellent step coverage
enabling the formation of a uniform polymerization film
over the details of a fine processing shape. Using thesetechnologies, ULVAC has undertaken some processingsof brought -in materials for deposition and etching onto
customer's wafers.
We have received an increasing number of requests
from customers to manufacture MEMS devices in
addition to these processing services. To meet suchdemands, we have prepared lithography and other MEMS
processing lines and have established an integrated
production line from design to dicing and bonding, to say
nothing of the deposition and etching processes, in orderto launch our MEMS foundry service.

2. Launching a MEMS Foundry Service
ULVAC develops distinctive semiconductor wafer
processing technologies, including deposition of highdielectric films, magnetic films, and other functional
materials that are difficult to form with conventional
equipment, as well as deep etching of quartz, and dry
etching of materials that could not be etched until now
due to low vapor pressure. The vapor deposition
polymerization method developed by ULVAC can add a

Vacuum chamber

Evacuation

Substrate

3. Features of the ULVAC Foundry Service
Our foundry service has the following two features:
1. Utilizing ULVAC's distinctive technologies for vapor
deposition polymerization, dielectric deposition, and
NLD dry etching, we fabricate MEMS devices andmanufacture and provide materials. The ULVAC
foundry also provides a wide range of materials forpurposes other than silicon processing.
2. Utilizing our technologies and know-how to develop
equipment and processes as an equipment
manufacturer, we provide rapid services for processingthat requires new processes and equipment to meetcustomer demands.

Monomer A

Monomer B

NLD-6000 MEMS dry etcher
and processed sample

Our own vapor deposition polymerization
technology for forming uniform polymer
film over complex substrates

4. Future Challenges

SME-200 PVD device forforming high-dielectric films
and MEMS electrodes

In addition to these technologies, ULVAC has carbon
nanotube and ultrafine particle manufacturing
technologies and powerful surface analysis tools.
Through the integrated application of our technologies,
we hope to provide our foundry service, while
simultaneously developing MEMS devices and processes.

CME-200 PE-CVD device forforming SiO2 and SiNx films

7Worldwide R&DIntelligent Formative Engineering, Department of Intelligent Mechanical
Systems Engineering, Faculty of Engineering, Kagawa University
Gen Hashiguchi, Associate Professor
E-mail: hasiguti@eng.kagawa-u.ac.jp
1. Introduction
The Faculty of Engineering at Kagawa University isrelatively new in that the first class enrolled in April 1998.
Intelligent Formative Engineering, one research group in the
Department of Intelligent Mechanical Systems Engineering, has
focused on semiconductor microfabrication technology since its
inauguration. We were granted permission to share the clean
room in the Future Research Center On To The New Millennium
KAGAWA (FROM Kagawa) in October 2000. Since then, we
have been intensively studying micromachine technology.
Professors Yutaka Mihara, Fumikazu Ohira, and I have beenworking together to raise funds and operate the clean room.
This year we intensified our research activities by adding
Research Associate Maho Hosogi to our group.

2. Research Facilities
We received permission to use the facilities at FROM
Kagawa, including a Class 1000 clean room having an area of
70m2 (see Fig. 1), two laboratories, a conference room, and asitting room, for a total floor area in the five rooms of 300m2.
The clean room is equipped with photolithographic devices suchas a two-sided mask aligner, draft chambers for treating organic
and acid chemical wastes, an RF sputterer, a reactive ion etcher(RIE), and a STS-manufactured inductively-coupled plasma RIE,
which we persuaded Kagawa Prefecture to install. Additional
measuring equipment includes a measuring microscope andsurface profiler. The electric furnace room is equipped with anoxidation furnace having an external combustion tube , asintering furnace, an annealing furnace, and an SiN low-pressurechemical vapor deposition furnace. Except for an ion implanter ,Fig. 1 Class 1000 Clean Room (70m 2)

the facilities include all basic equipment required for research on
semiconductor microfabrication.

3. Research Themes
The research group of Intelligent Formative Engineering
conducts numerous studies with a focus on the following topics.
• Micromolding• MEMS-based optical communications• Wearable sensors• Microdevices for DNA analysis• Probes for nanofabrication
In addition to conventional electroplating technology,
micromolding research covers processing technology using
superplastic titanium. MEMS-based optical communication
research is the study of phase variable filters and opticalswitches that can maintain communication lines when electric
power is interrupted. Under the theme of wearable sensors, astethoscopic sensor is being developed for detecting vital signs.
Recently we have also turned our attention tobionanotechnology, working with Tokushima University and the
University of Tokyo to establish microdisection for the specificisolation of DNA molecules from solution using a DNA nano pin
set (see Fig. 2) and to fabricate prototypes of multi-nanoprobes
for AFM field processing.

4. Conclusion
Owing to use of the clean room over the past three years, wehave learned basic micromachining processes and production
techniques for MEMS devices. We are committed to moving
forward with our research in order to prove our competence as a
MEMS research laboratory.

Fig. 2 DNA nano pin set, SEM photo of
microdisectioned DNA cells (-DNA)MICROMACHINE No. 46
MICROMACHINE is published quarterly by Micromachine Center (MMC) to promote the international exchange of
information related to micromachines, R&D and other technical topics, and is circulated free of change. Please send
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