Okmetic K.K.
Sunrise Mita 8F
3-16-12, Shiba
Minato-ku, Tokyo 105-0014
Tel. +81-3-3798-1400
Fax +81-3-3798-1402

Members’ Profiles

Okmetic Oyj
1. Okmetic in general

Cavity SOI advantages

Okmetic is the world’s leading supplier of silicon wafers
for high-performance MEMS sensor manufacturing. We haveacted on the MEMS-market for over twenty years and inJapan since late 1980s.
Okmetic has a global
customer base and sales
network, productions plants
in Finland and the US, andcontract manufacturers inJapan and in China.
Okmetic K.K. in Tokyo
serves our Japanese Okmetic’s solution is our 100200 mm SOI product range withcustomers and gives preprocessed structures
technical support. Our teamis ready to respond to the growing demand for MEMS wafers
in Japan.

1. More freedom in element design.
2. Simplified manufacturing process
3. Improved electrical and mechanical properties
4. Integration of IC and MEMS process possible
5. Yield and material responsibilities at material supplier
Okmetic G-SOI (Gettered SOI) wafers support full CMOSMEMS integration. Their enhanced gettering performanceensures effective binding of impurities to guarantee
maximized yield and design flexibility in CMOS processes.

Key figures

2. Products designed for MEMS
sensor manufacturing(1 Jan – 31 Dec 2007 1,000 euro)
Net sales
Operating profit

64,652
7,121

11
By
developing
more % of net sales
357
intelligent substrates a silicon Personnel at the end of the period
wafer supplier can help to save costs and streamline
microsystem fabrication. Okmetic BSOI (Bonded Silicon onInsulator) product family includes enhanced SOI productsthat meet the most demanding customer requirements. They
enable the development of smaller devices, while allowing
for greater freedom of design and improved yield. We supply
all wafer sizes from 100 mm to 200 mm.
Okmetic BSOI wafers improve cost-efficiency acrossprocesses and boostperformance. Together
withmodernmanufacturing processes(e.g. DRIE) they provide
new opportunities forinnovationandexceptional design. For
the most demanding Device layer thickness variation (9points measurements) of 150 mm
designs, Okmetic 0.3-SOI SOI wafer.
wafers with tighter
device layer thickness tolerance offers even more benefits interms of device performance.
Okmetic C-SOI (Cavity SOI) is a bonded SOI wafer withpre-etched cavities. Embedded under the thin silicondiaphragm, these cavities take device design to the nextlevel. Our C-SOI solutions are optimized to fit the customer’s
device design.

Gettered SOI advantages
1. Proven gettering ability
2. Better gate oxide integrity than in standard BSOI wafers
3. Compatible with CMOS processing on thick SOI
4. No impact on active layer thickness uniformity orother BSOI characteristics

Epitaxial wafers
Okmetic epitaxial wafers offer superior layer uniformityand surface quality, as well as ideal epi thickness. In
anisotropic wet etching of silicon, Okmetic epitaxial layers canbe used as an etch stop in both electrochemical (N/P interface)and chemical (stress-free Ge co-doped P++) etch processes.

Double and single side polished wafers
Okmetic SSP (single side polished) and DSP (doubleside polished) wafers both feature outstanding offorientation accuracy and MEMS-optimized crystal quality. In
addition, our DSP wafers boast superior flatness andthickness variation that enable accurate bulk
micromachining and double-sided lithography.
DSP wafers are also widely used as cap wafers in wafer
level packaging.

Center point thickness variation Total thickness variation (TTV) ofof 150 mm DSP wafer.
150 mm ultra flat DSP wafer.

Boost performance with MEMS-optimized silicon wafers
Okmetic’s way of conducting business is based onmonitoring and analyzing the future needs and material
solutions of our customers industries. With the widest
product selection on the market, we offer silicon solutions
for the rapidly growing and evolving MEMS market.
For more information please contact Okmetic K.K. andvisit www.okmetic.com

MICRONANO No. 64
MICRONANO is published quarterly by Micromachine Center (MMC) to promote the international exchange ofinformation related to micromachines, R&D and other technical topics, and is circulated free of change. Please send
your comments about MICRONANO to the publisher :Keiichi Aoyagi, Executive Director, Micromachine Center (MMC)
MBR99 Bldg., 6F., 67 Kanda Sakumagashi, Chiyoda-ku, Tokyo 101-0026, Japan
Tel : +81-3-5835-1870, Fax : +81-3-5835-1873
Internet Home Page h t t p : / / w w w . m m c . o r . j p /Date of Issue : July 18, 2008

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