Topical Workshop on Electronics for Particle Physics (TWEPP-07), 3-7 Sep. 2007, Prague, Czech Republic

Electronics and Sensor Study with the OKI SOI process
Yasuo Arai(on behalf of SOIPIX collaboration [1])KEK、High Energy Accelerator Research Organization
Institute of Particle and Nuclear Studies
1-1 Oho, Tsukuba, Ibaraki 305-0801, JAPANyasuo.arai@kek.jp
Abstract
While the SOI (Silicon-On-Insulator) device concept isvery old, commercialization of the technology is relatively
new and growing rapidly in high-speed processor and lowpower applications. Furthermore, features such as latch-up
immunity, radiation hardness and high-temperature operation
are very attractive in high energy and space applications.
Once high-quality bonded SOI wafers became available in
the late 90s, it opened up the possibility to get two different
kinds of Si on a single wafer. This makes it possible to realize
an ideal pixel detector; pairing a fully-depleted radiation
sensor with CMOS circuitry in an industrial technology.
In 2005 we started Si pixel R&D with OKI Electric Ind.
Co., Ltd. which is the first market supplier of Fully-Depleted
SOI products. We have developed processes for p+/n+
implants to the substrate and for making connections between
the implants and circuits in the OKI 0.15µm FD-SOI CMOS
process.
We have preformed two Multi Project Wafer (MPW) runs
using this SOI process. We hosted the second MPW run andinvited foreign universities and laboratories to join this MPW
run in addition to Japanese universities and laboratories.

then annealed at ~1300 ºC for 3-6 hours to create a SiO2 layer
under a thin Si layer. Although SIMOX can provide highquality SOI wafers, the wafer cost is relatively high due to thenecessity of large oxygen implantation doses.
Meanwhile, a clever method called Smart-Cut wasdeveloped by M. Bruel [5]. A SOI wafer fabricated using the
Smart-Cut method is called a UNIBOND wafer [ 6], theprocess of which is shown in Figure 1. This process starts
with two different wafers. The first wafer is implanted with
H+ ions and bonded to the second wafer. The first wafer isthen cleaved and a thin Si layer is transferred to the second
wafer.
Normally SOI devices use only the thin upper Si layer(SOI layer) for circuit implementation, and the bottom wafer(handle wafer, substrate) works just as a mechanical structure.
Since the UNIBOND wafer starts with two different Si wafers,
it is easy to bond low-resistivity Si wafer to a high-resistivity
Si wafer. Low-resistive Si is necessary for CMOS circuit
implementation, while a high-resistivity Si substrate can beused as a radiation sensor.

Features of these SOI devices and experiences with SOI
pixel development are presented.

I. INTRODUCTION
A. History of SOI
Since planar processing technology was developed by R.
Noyce in 1959 [2], most of ICs have been built on a bulk Si
wafer. However, the first transistor, patented in 1928 [3] by J.
E. Lilienfeld, was built on a thin semiconductor film
(unfortunately, the technology was not mature at that time andthere is no evidence that this device ever worked). Thistransistor has a structure very similar to that of a SOI device.
In a SOI chip, transistors are built on a very thin Si film
surrounded by insulators, so it has an ideal structure for
integrated circuits. However, mass production of SOI chips
had to wait until 1998 when IBM announced that they would
use SOI technology to make the Power PC MPU.
The first SOI wafer that could be used for integrated
circuits was developed by K. Izumi [4] in 1978. This method
is called SIMOX (Separation by Implanted Oxygen). In
SIMOX, oxygen ions of 120-200 keV energy are implanted
into a Si wafer with a fluence of 4-20x1017 cm-2. The wafer isFigure 1: Flow diagram of the UNIBOND process [6].

B. Bulk CMOS vs. SOI CMOS
Figure 2 shows cross sections of bulk CMOS and SOICMOS transistors. In a bulk CMOS device, each transistor isisolated by reverse-biased p-n junctions in a well structure.
On the other hand, in a SOI CMOS device, each transistor iscompletely isolated by the Oxide insulator. Thus, parasitic
effects in a SOI device are very small.

II. FEATURES OF FD-SOI
There are many fascinating features of a FD-SOI device.
In general, a SOI device has 20-30% better performance thana bulk device for the same photolithography, due to its smaller
junction capacitance. Below are described some of thefeatures relevant to high energy and space experiments [9].
Figure 2: Cross sections of bulk CMOS and SOI CMOS transistors.

C. PD-SOI and FD-SOI
There are two kinds of SOI devices; Partially Depleted(PD)-SOI and Fully Depleted (FD)-SOI (Figure 3). The PDSOI has a relatively thick SOI Si thickness (100-200 nm),while in the FD-SOI the SOI thickness is less than 50 nm.
In PD-SOI, there remains a neutral region in the body.
This causes large floating body effects such as ‘history’ and‘kink’ effects [7]. The 'history effect' makes it difficult tosimulate circuits. The 'kink effect' increases the drivability ofa transistor, so it is useful for high-speed digital circuits, but
not good for analog circuits.
In FD-SOI, the whole body under the gate will deplete,thus floating body effects are reduced. In addition, the wholegate voltage is used efficiently to deplete the body region, so
sub-threshold slopes are steep (Figure 4). This makes it
possible to lower the threshold voltage and is good in low
voltage (power) applications.
Today, many PD-SOI devices are available; IBM
PowerPC, AMD Athelon, Sony Cell processor and so on.
However, mass production of the FD-SOI is currently only
performed by OKI, mainly for radio-controlled solar watches.

A. Latch-up free
It is well known that there is a parasitic PNPN structure inbulk CMOS devices and this may cause latch-up of the device.
As seen in Figure 5, there is no such parasitic structure in a
SOI device.
Although there is a parasitic bipolar effect [10] in PD-SOI,
which might reduce drain breakdown voltage, the effect isvery small in FD-SOI.

Figure 5: Parasitic PNPN structure in bulk CMOS and SOI CMOS
structure [7].

B. Area reduction
Since there is no well isolation in a SOI device, as seen in
Figure 5, a more compact layout is possible in a SOI IC.
PMOS and NMOS can be located side-by-side if necessary. In
a SRAM cell layout, for example, more than 30% reduction ofarea is reported when the same feature size technology is used.

C. Circuit isolation

Figure 3 : Transistor structure of (a) PD-FOI and (b) FD-SOI.

In a SOI device, each transistor is isolated by Oxides(Field Oxide and BOX), thus higher isolation is observed in
SOI compared with bulk technology (Figure 6). When a highresistivity substrate is used, 10-40dB better isolation isreported, up to 10 GHz [11].

Figure 4: (a) Sub-threshold slope of FD-SOI transistors and bulk
CMOS transistors. (b) Comparison of leak current (Idoff) vs. Vth [8]in different technologies.
Figure 6: Noise travelling path in bulk and SOI devices.

D. High-Temperature operation
As stated before, a SOI device is immune to latch-up
phenomena. The small junction area of FD-SOI devices
reduces the high-temperature leakage currents by as much as
3 to 4 orders of magnitude compared to bulk CMOS devices.
Threshold voltage variation with temperature is 2 to 3 times
smaller than in bulk devices. These properties enable thefabrication of digital and analog SOI circuits operating up to
and over 300°C with little performance degradation [12].

E. Single Event
Since the active Si thickness of the SOI transistor is very
thin, the number of generated charges in the active area isvery small, compared with bulk transistors (Figure 7). Thus
higher immunity to single event effects (SEEs) is expected in
a SOI device. Thus many SOI devices have been used insatellite instruments.
Although the SEE cross-section is already small in SOI
devices, excellent SEE immunity is available by combining
with the hardness-by-design (HBD) techniques [13].

Figure 7: Charge distribution in bulk and SOI devices generated by
the passage of a charged particle.

The UNIBOND SOI wafer is a key component to realize
such monolithic pixel detector. Pioneering work for a SOI
pixel detector has been done by the SUCIMA collaboration[17]. Unfortunately the technology used there was rather
obsolete (CMOS 3 µm technology), and suffered from manytechnical problems.
We have started SOI pixel detector R&D in collaboration
with OKI Electric Industry Co. Ltd., in summer 2005 [18, 19,20]. OKI is renown as the world’s first supplier of FD-SOI
products. The basis technology for fabricating the pixel
detector is OKI's fully-depleted 0.15µm CMOS SOI process.
Additional processing steps to create substrate implants andcontact formation were developed by this collaboration.
Figure 8 illustrates a representative cross-section of the
pixel detector. Several implant position arrangements arebeing tried. Two submissions to the OKI process were done
and these processes were completed in spring 2006 (FY05
run) and 2007 (FY06 run). Especially in the FY06 run, we
called for chip designs outside of our collaboration. Figure 9shows a photograph of the FY06 MPW wafer. Mask size ofthe process is 20.8 mm and we shared the mask among 17
user designs.

Figure 8: Representative cross-sectional view of the SOI pixel
detector.

F. Total Ionizing Dose
Since the SOI transistor has many Si-SiO2 interfaces (gateoxide, BOX, Field oxide), it is somewhat sensitive to Total
Ionizing Dose (TID). Nevertheless, thanks to the fine device
structure, transistors in the OKI 0.15 µm process show
radiation tolerance up to a few hundred kRad (Si) [14]. This is
usually enough for space applications. At much higher doses,
holes are mainly trapped at the Si-BOX interface, andthreshold voltage shift develops due to the back gate bias. The
back gate effect is discussed in section IV. It can be partly
compensated by biasing the substrate [15].

III. SOI PIXEL DETECTOR
Many attempts have been made to integrate pixel sensors
and readout electronics into a monolithic device [16]. Highlyresistive Si must be used to make a thick depletion layer,
which is necessary to get high-speed signal collection and toachieve high radiation detection efficiency. On the other hand,
a LSI circuit needs low-resistivity Si to control appropriate
transistor parameters.

Figure 9: Photograph of the FY06 run MPW wafer. Wafer size is 6
inch in diameter, and the mask size is 20.8mm x 20.8 mm. The wafer
includes submissions from Osaka Univ., Tokyo Univ., U. of Hawaii,
JAXA/ISAS, Fermilab, LBNL, and KEK.

Table 1: Features of the OKI SOI CMOS process
Process
SOI wafer

Backside
Supply Voltage
Transistors

0.15µm Fully-Depleted SOI CMOS process,1 Poly, 5 Metal layers.
Diameter: 150 mmφ (SOITEC)Top Si : Cz, ~18 Ω-cm, p-type, ~40 nm thickBuried Oxide: 200 nm thickHandle wafer: Cz、700 Ω-cm, 650 μm thickThinned to 350 µm and plated with Al (200 nm).
Core 1V, I/O 1~1.8V
High Voltage Tr (I/O), High Threshold Tr,
Low Threshold Tr.
Floating body and body tight

A. SOI Process
Characteristics of our SOI process are summarized inTable 1. We used a SOI wafer of low resistivity p-type Si on
top, and a high resistivity (700 Ω•cm) n-type substrate on thebottom.
The process flow of the SOI pixel is depicted in Figure 10.
Implantation of p+/n+ to the substrate is performed after
cutting the SOI and BOX layer. In the FY05 run, the implant
was done under the same conditions as the transistor
drain/source region, so the depth of the implant was only ~0.1
µm. In FY06 run we tried deeper implants by changing theimplant energy and using lighter implant particles, targeting a~4.7 deeper implant profile. After forming contacts between
the p+/n+ implants and the 1st metal layer, normal SOICMOS processing is performed.
After wafer processing, the wafer backside is groundmechanically from 650 µm to ~350 µm, then plated with
200nm of aluminium. Detector voltage can be applied bothfrom bottom and top pads, which are connected to a highvoltage (HV) n+ implant ring.

Figure 11: TEM photograph of the p+ implant and contact crosssection.

Figure 11 shows a TEM photograph of the cross section of
the p+ implant to the substrate and contact to the 1st metal
layer. Sheet resistance of the p+ (n+) implant is measured to
be 136 (33) Ω/square, and the resistance of the 0.16 x 0.16µm2 contact to the p+ (n+) implant is 218 (87) Ω. These
values agreed with expectation.

B. Pixel TEG
We have developed simple pixel detectors with a pixel
size of 20 µm by 20 µm. The pixel circuit is a standard active
pixel type with a storage capacitor, illustrated in Figure 12. At
the periphery of the chip there exist row and column selects,
control logic, and reference voltage generator circuits.
Layout of a single pixel cell is shown in Figure 13. The
centre of each pixel (5.4 µm x 5.4 µm) is open (no metal) toallow light illumination testing. Four p+ junctions are createdin each pixel, with each junction of octagonal shape and awidth of 4.4 µm.
I-V characteristics of the detector are shown in Figure 14.
Voltage is applied from the backside Al pad. Almost the samecharacteristics are obtained using the HV ring pad. We could
apply more than 90V without breakdown for FY05 chip. In
the FY06 chip we have used a smoother corner for the bias
and guard rings, increasing the breakdown voltage to 110 V.
As stated before, we also fabricated a deeper implant chip,and it could extend breakdown voltage to 130V.
Due to the back gate effect, which will be discussed in thenext section, detector voltage operation is limited to a much
lower value to permit operation of the electronic circuits.

Figure 10: Simplified SOI pixel process flow.

We took images of a plastic mask placed in front of the
pixel detector and illuminated with red laser light (670 nm
wavelength). An image taken with 128 x 128 pixels is shownin Figure 15. The detector bias voltage is 1V and theintegration time is 24 µs. The pedestal voltage during a reset
period is subtracted for each pixel. The signal collected in thewhite (saturated) part of the detector is estimated to be about
20,000 photons based on laser intensity and pixel geometry.
Pixel capacitance is estimated roughly as 8 fF, so the induced
voltage of the sensor node is about 400 mV. This is consistent
with the observed signal amplitude.

We also confirmed the sensitivity to β-rays by using aSr β-ray source. We observed a signal voltage jump of
70mV in the sensor. This is consistent with a depletion depthof 44 μm and a generated charge of 3500 e- (0.6 fC).
90

Figure 12: Schematics of a single pixel circuit.

Figure 15: An image taken by the pixel sensor with a 'KEK2007'
mask. Exposure time is about 24 µs, and detector bias voltage is 1V.
Characters are written on a plastic mask for printed circuit
lithography and the diameter of the laser light is about 3mm φ

IV. TCAD STUDIES
To understand the behaviour of the SOI pixel detector,
Technology CAD (TCAD) which simulates process anddevice operation is very useful. We used a 3D-TCAD
simulator called ENEXSS [21], which is developed by aJapanese consortium called SELETE.
Some of the preliminary results are shown below, thoughthese results are extracted from a very small scale simulationand do not yet cover a full size detector.

A. Back Gate EffectFigure 13: Layout of a pixel cell. Each pixel has 4 p+ implants ofoctagonal shape. At the right of the cell is the storage capacitor. The
pixel centre is left free of metal to allow light illumination testing.

The potential under the BOX acts as a back gate of thetransistors in the top Si. As the back gate voltage is increased,
the NMOS transistor threshold voltage is decreased and thatof the PMOS is increased. Finally the circuit stops working
for excessive back gate voltage.
This is confirmed in test chips by observing an inputoutput signal of the I/O buffers where no p+ implant exists, so
the detector voltage is almost directly applied to the back of
the I/O buffers. In this case the output signal becomes verysmall when the back voltage exceeds 15V.
This back gate voltage can be reduced by placing a p+
implant near transistors and connecting it to ground voltage.
This is confirmed with ENEXSS simulation as shown in
Figure 16. By placing the p+ implants within 10 µm of thetransistors, the threshold voltage shift can be reduced to lessthan 100 mV at a back voltage of 40V.

Figure 14: Measured Iback -Vback curves for various OKI SOI pixel
detectors.

Since there was no time to redesign new I/O buffer cells,
we just surrounded the I/O buffers with a p+ ring as close as
possible. We observed the back gate effect is greatly reduced

and the I/O signal does not disappeared even in 40V backvoltage.

B.

Circuit to Sensor cross talk

In a SOI pixel detector, the electronics circuit and thesensor are separated by the BOX layer. The thickness of BOX
in the present process is 200 nm. Although good isolation
between circuit elements is expected in SOI, as stated in theprevious section, cross talk studies between circuitry andsensor is still important.
Figure 17 shows simulated electric field strength and lines
of electric force. There is a p+ implant in the upper left and a
metal signal line at the upper right. Voltage change in themetal line disturbs the electric field, so some amount ofcharge is induced through capacitive coupling. In some
applications, this may not be negligible. In that case, weshould use differential signals and/or make guard structures tosensors. Proposed transistor structures for the next generation,such as double gate and FIN transistors (Figure 18), might
reduce the cross talk.

Figure 17: Electric field map and lines of electric force around a p+
sensor node simulated using ENEXSS.

Figure 18: Structures of future SOI transistors; (a) double gate
transistor, (b) FIN transistor.

V. SUMMARY AND FUTURE PLAN
SOI technology is envisaged as a mainstream technology
in future LSI processes. In addition, it has many fascinating
features useful for high-energy and space applications.
We have started a development of a monolithic SOI pixel
detector. The detector consists of a wafer-bonded sensor ofhigh-resistivity Si mated to a CMOS circuit in low-resistivity
Si. We use a commercial (OKI 0.15 µm SOI) process withcommercial wafers (SOITEC).
Figure 16: Simulation for NMOS threshold voltage vs. back voltage(Vback). Each curve corresponds to the distance between the NMOS
and the p+ implant. By placing p+ implant near the NMOS, the shiftof the threshold voltage is reduced.
Table 2: Process differences between OKI 0.15 µm and 0.2 µm SOICMOS processes.
Process
Wafer DiameterCore (I/O) Voltage
Gate Length
Gate Oxide
Thickness
BOX Thickness
Off state Tr. Leak
Current (Ioff)

0.15 µm
6 inches
1.0V (1.8V)
0.14 µm

0.2 µm8 inches
1.8V (1.8/3.3V)
0.2 µm

2.5 / 5 nm
200 nm

4.5 / 7 nm
200 nm< 100 pA/mm< 0.1 pA/mm

Two submissions in this process were done and showed
good initial performance for light and β-ray detection. Several
issues specific to the SOI structure are being studied with
ENEXSS simulations.
We are planning the next submission for December 2007
(FY07 run). Due to a process line change at OKI, we will use
a 0.2 µm SOI CMOS process in the next MPW run. Major
differences between these processes are listed in Table 2.
Although the feature size is somewhat increased, higher
operating voltage and reduced transistor leakage current canbe obtained in the 0.2 µm process. We welcome moreparticipants to join the MPW run.

ACKNOWLEDGEMENT
The author wishes to thank all SOIPIX group members fortheir excellent work, especially M. Ohno, J, Ida, K. Fukuda,

Y.Hayashi and H. Komatsubara of OKI Electric Industory Co..
Ltd. I would also like to thank F. Takasaki, T. Kondo and J.
Haba for their continued support of this project.

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