Topic : MicroNano 2009 / 1
Activities of the Micromachine Center / 5
Activities of the BEANS Laboratory / 10
MicroNano 2009 Concurrent Programs / 12

Topic

Micro/Nano 2009
The 20th Exhibition Micromachine / MEMS
The world’s largest international exhibition on MEMS, ultraprecision machining andmicromachining, nanotechnology, and biotechnology
Date: July 29–31, 2009 (Wed–Fri)
Venue: Tokyo Big Sight (Tokyo International Exhibition Center), East Hall 5Sponsored by the Micromachine Center, Micro/Nano 2009 is acomprehensive event that brings together all the latest technology andproducts in the micro/nano and MEMS-related fields at one venue. Micro/Nano
2009 will be held at Tokyo Big Sight for three days on July 29–31, 2009
(Wed–Fri). Since this year marks the 20 t h holding of the Exhibition
Micromachine/ MEMS, we have prepared a special exhibit that visually
showcases developments in the micro/nano and MEMS industries, and adiverse schedule of events to be held concurrently in two special conference
areas set up at the venue.

S c h e d u l e o f C o n c u r r e n t E v e n t s (No admission fee)
7/29 ■ The 15th International Micromachine/Nanotech Symposium ~MEMS World~ (Conference area A)
Breakthroughs in the industrialization of MEMS and nanodevices achieved through integration andconvergence: experts from Japan and abroad will present the latest information on an intensification of R&D
activities and promising MEMS applications.

■ The Workshop on Industry-Academia Collaboration (Conference area B, morning)
Academic and public research affiliates of the MEMS industry forum will present their latest researchfindings on micromachines and MEMS together with exhibits at the 20th Exhibition Micromachine/MEMS.

■ MEMS Packaging Forum (Conference area B, afternoon)
An event that is new to Micro/Nano 2009, this seminar will focus on MEMS packaging, which is an area being
closely watched in the industry today.

7/30■ Japanese-German Micro/Nano Business Forum (Conference area A)
Organized by Germany’s IVAM Microtechnology Network in cooperation with the MMC, this forum provides agood opportunity for the mostly Europe-based member companies of IVAM to showcase their products andtechnologies and to make business contacts with Japanese companies.

■ The Workshop on Industry-Academia Collaboration (Conference area B, morning)■ BEANS Project Seminar (Conference area B, afternoon)
This seminar will provide an overview of Process Integration Project for Hetero-Functional Integrated
Devices (the BEANS Project), a five-year project initiated in 2008, and to discuss the prospects of core
process technologies required for creating the innovative next-generation devices targeted by the BEANS
Project.

7/31■ MEMS Industry Forum (Conference area A)
This forum provides an opportunity for members and guests to exchange ideas and distribute information.
The forum presents the latest activities of the MIF and the state of regional efforts by affiliated local clusters
and public research institutes to strengthen the infrastructure of the MEMS industry.

■ Presentation of results from the Fine MEMS Project (Conference area B)
This event summarizes the research findings of the three-year NEDO project entitled the Highly Integrated,
Complex MEMS Production Technology Development Project (or the Fine MEMS Project), which concluded
in 2008.

12
3★MMC releases MemsONE commercial version 1.0 (Feb. 2008)★BEANS Project begins (July)★IEC TC47/WG4 upgraded to IEC SC47F (July)★MMC opens "MEMS Mall" (Oct.)★MMC opens "Micromachine Project Archive" (Jan. 2009)★BEANS Laboratory established (Mar.)★MMC opens MEMSPedia (June)

18th Exhibition Micromachine/MEMS held (July)

18th Exhibition 19th Exhibition
Tokyo Big Sight
Changes in sizeof exhibition venue

Micromachine/MEMS held

★MicroNano 2009, 20th Exhibition

Changes in numberof exhibition booths

H1N1 influenza virus pandemic (Apr.)

Obama J.D. inaugurated as U. S. President (Jan.)

Nobel Prize awarded to Prof. Nambu and two others (Oct.)Worldwide financial crisis (Sep.)★MicroNano 2007 held at Tokyo Big Sight (from this time onward)★Game unit equipped with acceleration sensor marketed (Dec.)★MEMS 2007 / 20th anniversary convention (Kobe) (Jan. 2007)

Name changed to 17th Exhibition Micromachine/MEMS (Nov.)(June)★MEMS-ONE Project begins★MEMS Project begins (Apr.)

17th Exhibition
Tokyo
International Forum

Postal services privatized (Oct.)

Many occurrences of deceptive food relabeling discovered (Aug.)

Pluto downgraded from planet to dwarf planet (Aug.)

13th Exhibition

One-segment broadcasting begins (Aug.)

Experimental wireless micromachine system
for inspection on inner surface of tube

Earthquake-resistant strength deception discovered (Nov.)

15th Exhibition★MMC opens MEMStation (July 2005)★IEC standard "MEMS Terms and Definitions" published (proposed by MMC) (Sep.)★MEMS Industry Forum established (March 2006) and merged with Federation of Micromachine Technology (May)★Fine MEMS Project begins (July)★IEC standards "Tensile test for thin film materials" "Standard test piece" (proposed by MMC) (August)★MicroNano 2006 held (Tokyo International Forum)★MEMS Park Consortium established (Oct.)(Mar. 2004)★AIST MEMS Business building completed

marketed (Dec.)
MEMS
2003 (Kyoto) held★
(Jan. 2003)

location (Kanda Sakumagashi)(Feb.)★MMC Foundry Services Industry
Committee established (July)★MMC office moved to present

completed (Mar.)★Micromachine project

Many micromachine project
achievements exhibited (Nov.)★11th Micromachine Exhibition

Optical matrix switch
developed / opticalscanner marketed★MEMS growth phaseshown at 8th Exhibition
Micromachine, MEMS 97(Nagoya) etc. (Jan.- Oct.)★MMC portable exhibits

IEC (International Electrotechnical Commission)
MMC becomes Japanese liaison (1995)

2F

Aichi Expo held (Mar.)

Silicon microphone

Chuetsu Earthquake (Niigata Prefecture) (Oct.)in Japan marketed (Oct.)★World's first silicon microphone

Optical matrix switch

Teito Rapid Transit Authority privatized (Apr.)

Terrestrial digital broadcasting begins (Dec.)

Human genome project completed (Apr.)

11th Exhibition

Nobel Prize awarded to Prof. Koshiba and Mr. Tanaka (Sep.)

12th Exhibition★MEMS foundry services begin one after another★64CH optical switch marketed (Apr. 2002)★First optical tunable attenuator

Experimental Catheter-type micromachine system
for repair in narrow complex areas
Examples of Micromachine Project Achievements

World Cup held in Japan and South Korea (May)1990 1991 1992 1993 1994 1995 1996 1997 1998 1999

Nobel Prize for Physics awarded to Prof. Noyori (Oct.)

Other topics

9/11 attacks in U. S. (Sep.)

Changes in number of exhibitor booths
held (Miyazaki)(Jan. 2000)

Changes in size of exhibition venue

BS digital broadcasting begins (Dec.)

9th Exhibition★MEMS 2000

Patent Office IPC "Microstructure technology /nanotechnology" (Jan. 2000)★Micromachine review department established in

exhibition, namechanged to Exhibition
Micromachine (Oct.)★Beginning with 6th★Micromachine project team established within

moved to Kanda
Tsukasa-cho(June)★MMC officeat MEMS 94(Oiso) (Jan.)1990 1991 1992 1993 1994 1995 1996 1997 1998 1999

Nobel Prize for Chemistry awarded to Prof. Shirakawa (Oct.)"Aibo" domestic robot marketed (June)

Euro (EU currency integration) (Jan.)MMC report published (Oct.)★"Technical Terms Micromachine Technology"

standardization workshop in Japan
held (Oct.)Micromachine Exhibition(and subsequent ones
through 16th) held at
Science Museum (Apr.)★4th Industrial

Micromachine Exhibition
held at TEPIA(Aoyama)★3rd Industrial

Micromachine Exhibition
held in Nara, concurrently
with MEMS 91 (Jan.)★2nd Industrial

Micromachine Exhibition
held at Kikai Shinko
Kaikan (Mar.)★1st Industrial★Many microvalves and pumps exhibited

Portable exhibits

Google, Inc. established (Sep.)

6th Exhibition

Winter Olympics held in Nagano (Feb.)

Project (Phase 2)
begins (Apr.)★MITI Micromachine

Summit held
(Mar.)★1st Micromachine★1st micromachine international

Micromachine Summit

COP3 Kyoto Protocol adopted (Dec.)"Tamagocchi" and "Pokemon" become popular (Apr.)"O157" infection / mass outbreak of food poisoning (July)"Dolly", world's first cloned sheep, born (July)

Earthquake
prediction system"Windows 95" released (Nov.)

4th Exhibition
Science Museum

Great Hanshin-Awaji Earthquake (Jan.)Art Contest held

★1st Micromachine

MMC in charge of running secretariat (Apr.)★Federation of Micromachine Technology established;

3rd Industrial Micromachine Exhibition

Nobel Prize for literature awarded to Mr. Oe (Oct.)

Website for prime minister's office established (Aug.)

Japan's first Internet service begins (July)

1st Exhibition

J-League founded (May)

Astronaut Mohri boards space shuttle (Sep.)(Jan.) Office opened in Mita,
Minato Ward (Apr.)★Micromachine Center (MMC) established★MITI Micromachine Project (Phase 1)
begins (Mar. 1991)

silicon cantilever AFM, flow-rate controller,
pressure sensor array, acceleration sensor andother achievements exhibited (1987-1990)★Dawn of MEMS Microgear/motor, comb actuator,

1st Industrial Micromachine Exhibition

Rio Summit held (June)

Carbon nanotubes discovered (June)

Gulf War begins (Jan.)Mr. Akiyama becomes Japan's first astronaut (Dec.)

Reunification of Germany (Oct.)

From Industrial Micromachine Exhibition to Exhibition Micromachine/MEMS: Celebrating 20 Years
2000 2001 2002 2003 2004 2005 2006 2007 2008 20092000 2001 2002 2003 2004 2005 2006 2007 2008 2009

Overview of the Micromachine Center Booth and
BEANS Laboratory Booth
1. Micromachine Center Boothcountries. The booth is sponsored jointly by the BEANS
Laboratory and the New Energy and Industrial Technology
Development Organization (NEDO).
The exhibition will be significant as a venue for unveilingthe achievements of BEANS Project activities during the past
year. More importantly, it is an opportunity to promotewidespread awareness of the BEANS Project itself and givevisitors a sense of the dedicated enthusiasm of the participating
researchers. The content of the exhibits will reflect both ofthese objectives.
The green booth will have zone partitions decorated withthe “beans” that are the project’s symbol. In addition, the booth
will be enclosed by five green message stands that present a
general overview of the BEANS Project. The side of themessage stands that faces the passageway will present an
overview of BEANS headquarters, while the other (inner) side
will provide personal profiles of the researchers involved in the
project and the positioning of the individual research centers inKyushu, Shiga, Tsukuba and Komaba.
The inner walls of the booth will be dedicated to posters
and exhibits with particular emphasis on promoting andoutlining the research efforts of the individual centers: Life
BEANS, Life BEANS Kyushu, 3D BEANS, 3D BEANS Shiga andMacro BEANS.
The main attraction of the booth will be the various exhibits
placed in the very center of the space so as to enable many
visitors to gather around them for viewing. These exhibits will
present the technical details of microfabrication processes thatare difficult to explain using only posters and the like. They will
also include biotech exhibits that are expected to attract many
visitors as a result of TV and newspaper coverage in Januaryand June of this year, and exhibits relating to large-area film
deposition and fibrous nanostructures that were covered in theJuly edition of Nikkei Microdevices. The loom for laboratory usethat is also scheduled to be exhibited is sure to be seen as abreath of fresh air by those in the MEMS industry.
The essential mission of the BEANS Project is to develop
the manufacturing process technologies that will lead to theachievement of next-generation devices, and so the actual workthat researchers are engaged in day and night is fundamental
process development that is by no means glamorous. For thisreason, it is not the essential purpose of the project tointroduce exciting futuristic devices, and unavoidably thecontent tends to consist of unglamorous posters explaining
technical processes. However, nothing will be gained if visitors
do not come to see the exhibition, so we focused our efforts onpresenting in visible form those process development efforts
that are extremely important but essentially difficult to view.
Visitors are invited to come and see for themselves whether ourefforts were in vain or (hopefully) we succeeded beyond ourwildest dreams.
In conjunction with the exhibit content, the 3rd BEANS
Project Seminar will also be held during the afternoon of July 30
at a special venue set up next to the booth. As this will be first
seminar to give a full picture of the BEANS Project, we hopethat all interested parties will attend.

(1) Special 20th Anniversary BoothThis year, to commemorate the 20 t h anniversary of
Exhibition Micromachine/MEMS, the Micromachine Center will
provide a special booth that introduces major topics andreviews the history of the event, showing how it grew from theinitial “Industrial Micromachine Exhibition” to become
Micro/Nano 2009, one of the world’s major integrated events inthis field.
(2) MEMSOne BoothThis marks the second year since full-fledged MemsONE
dissemination activities began. In February of this year, version
2.0 was released, with improved analysis capabilities, ease ofoperation and stability.
To encourage dissemination, a special corner will be set up
at this exhibition for consultations, and a version with a limited
number of licenses will be provided at no charge. Detailed
information will also be provided through video screenings,
demonstrations and so on.
(3) MEMS Mall BoothThis booth will offer exhibits relating to MEMS Mall, whichmakes MEMS products and technologies available on theInternet. MEMS Mall opened in October of last year with theparticipation of the member companies of the MEMS Industry
Forum, and starting this April participation was opened to othercompanies for a fee (with companies exhibiting at Exhibition
Micromachine/MEMS given preferential status). The boothfeatures panels showing the products and services offered by
MEMS Mall as well as participating companies and methods.
There are also computers that visitors can use to visit the mall.
(4) MEMS Foundry Network BoothThis booth provides information about the MEMS Foundry
Network that is made up of MEMS Industry Forum member
companies. It also features MEMStation, a help desk forsubmitting items for prototyping. MEMStation makes it easy foreven users who do not have manufacturing equipment to
conduct MEMS manufacturing.
(5) Standardization BoothThis booth presents the current status of standardization in
the MEMS industry. To promote international standardization
activities in the MEMS industry in a more strategic manner, theMicromachine Center has established a roadmap for MEMS
standardization, and standardization activities are being
conducted in accordance with this roadmap. The boothshowcases the MEMS nomenclature and definitions that havebeen proposed and established, tensile test methods for MEMS
thin membrane materials, standard test specimens for tensile
tests, and fatigue test methods for MEMS thin film materials, inaddition to international draft standards that are currently
being reviewed or are under development.

2. BEANS BoothOne year has passed since Process Integration Project for
Hetero-Functional Integrated Devices (BEANS Project) was
launched in July of last year. This exhibition marks the fullfledged debut of the BEANS Project at a public venue attended
by interested parties in the MEMS area from Japan and other4

Activities of the Micromachine Center

Activities of the Micromachine Center in FY 2008
Overview

encouraging industrial exchange and vitalization (e.g., informal
gatherings on advanced micro/nano technologies),
implementing MEMS training programs to develop personnel
knowledgeable in MEMS development, and encouraging
information exchange among businesses in MEMS and otherindustries (e.g., the MEMS Mall launched October 1, 2008).

The Micromachine Center (MMC) is actively engaged intechnical development projects commissioned by thegovernment and the New Energy and Industrial Technology
Development Organization (NEDO) in an effort to establish
core technologies for micromachines, Micro Electro Mechanical
Systems (MEMS), and other micro/nano-related fields. At thesame time, in order to promote widespread use andindustrialization of these core technologies, the MMC
aggressively pursues activities to improve the environment for
micro/nano technologies. These activities include policy
recommendations, industrial exchange and vitalization,
investigative research, activities to promote standardization andto encourage dissemination and publicity projects designed topromote industrial development in micro/nano fields and tocontribute to the international community.
The following is an outline of the projects that the MMC
conducted in 2008.

3. Investigative Research and Data Collection
and Provision
We also investigated new issues on micro/nano technologies
that arise when merging nanotechnology with technologies inother fields.
The MMC is also collecting information and documents
related to micro/nano technologies from universities, industrial
circles, public organizations, and other sources in Japan andoverseas, which documentation will be consolidated with
documentation from surveys conducted at the MMC. We
periodically issue the Micro/Nano Index, an informational
publication including abstracts of technical documents andmaterials. The collection of technical documents and materials
has been organized and stored in the MMC archives, where they
have been made available for browsing and searching.

1. National / NEDO Projects(1) Highly Integrated and Complex MEMS Manufacturing
Technology Development Project (The Fine MEMS Project)
2008 marked the final year of the Highly Integrated,
Complex MEMS Production Technology Development Project,more commonly referred to as the Fine MEMS Project, which
was a three-year undertaking initiated in 2006. This project
concluded after having achieved its original goals satisfactorily.
The Fine MEMS Project ultimately succeeded in compiling aknowledge database with more than 1,500 items of content,
which will be made available on the Internet in a Wiki format.
Research findings for the fine MEMS integrated design platform
were stored in a Web-based system dubbed an equivalent circuit
generator, which has built-in functions for linking equivalentcircuit models for MEMS and the like and for outputting theelectrical and mechanical properties of the models.

4. Standardization Activities
In 2008 we demonstrated initiative on the international stage
by promoting standardization in the micromachines and MEMS
fields. These activities included examining standard certification
criteria for proposing international standards, following up on a
proposal of standards for fatigue testing of thin film materials,
conducting an investigative study on overseas standards, andpursuing the adoption of a tensile test method for thin film
material as a JIS.

5. Dissemination and Publicity Activities
In 2008 the MMC continued to provide informationinternally and externally through its Web site, publish anddistribute newsletters, hold exhibitions, and otherwise
disseminate information on micromachines and MEMS to
educate the public and publicize the MMC’s activities. This year
also featured the 19th Exhibition Micromachine/MEMS, a threeday event held at Tokyo Big Sight from July 30 to August 1,
2008 as part of Micro/Nano 2008. Over these three days, theexhibition received a total of 14,075 visitors, which was nearly a
12% increase over the previous year (12,424) and a record highfor the event.

(2) The Project to Develop Next-generation Device
Manufacturing Technologies that Fuse Different Fields(The BEANS Project)(Commissioned by METI)The BEANS Laboratory was newly established as acentralized research framework for the Project to Develop
Next-Generation Device Manufacturing Technologies that Use
Different Fields (commonly referred to as the BEANS Project)initiated on July 1, 2008. The BEANS Laboratory has worked to
introduce project management driven by the private sector, tocoordinate R&D activities for the inaugural year, and to installresearch equipment. In 2008, seventeen companies, elevenuniversities, and two research centers participated in the
BEANS project.
(3) Promotion and Dissemination of MemsONE
In an independent project, the MMC has been working with
the MEMS Industry Forum to aggressively promote anddisseminate the MemsONE software, which was the product of
research and development in the MEMS Open Network
Engineering System of Design Tools project. We also worked
with the software vendor to update the software, which is thebasis of our dissemination activities. Hence, Version 1.1
produced at the end of the project was improved and enhanced
and released as the more complete Version 2.0, which has more
powerful functions and greater stability.

19th Exhibition Micromachine/MEMS

2. MEMS Industry Forum Projects (for Policy
Recommendations and Industrial Exchange
and Vitalization)
The MEMS Industry Forum (MIF) was established in April
2006 as a special project committee with the goal of supporting
the further development of MEMS industries. Membership in
the MIF increases each year, spurring more and more activity.
In 2008 the MIF continued to promote activities centered on its
MEMS-related member companies in collaboration withaffiliated academies, regional centers, and overseas institutions,
including various activities for proposing policies to thegovernment and related agencies (e.g, encouraging theexchange of ideas between MIF members and the governmentand related agencies at MIF promotion committees),

MEMS Industry Forum (May 2008)5

Research and Standardization Activities
in its manufacture enabledminiaturization of the device.
Issues to be considered withregard to compass performance
include the inclination of thedevice and correction of the
disturbances caused by external
magnetic fields.

MEMS international standardization was reviewed at an
IEC/SC47F meeting held June 17 and 18 at Jeju in Korea, where
three of the Unesco World Heritage sites are located. In
coordination with this meeting, the 5th Japan-Korea-China
MEMS Standardization Workshop was held on June 19. This
workshop is held to promote cooperation and the exchange of
information relating to MEMS standardization on the part ofJapan, Korea and China. The first workshop was held in 2005 in
Tokyo, and each year the venue alternates among the three
countries. The following is an overview of this year’s workshop.

(2) Professor Isono of Kobe University gave a presentation
entitled “Scanning Prove??? Parallel Nanolithography for
NEMS Fabrication Using MEMS Cantilever Array,” relating
to nanoscale patterning and processing using a cantilever
array. Applying bias voltage
with an AFM cantilever during
scanning makes it possible toprocess 50 nm linewidths
during anodic oxidation, selfassembled
monolayer
patterning and EB resist
processing.

1. IEC SC47F / WG1 meeting
Following email review and agreement by specialists
regarding some of the technical issues, it was agreed that the“RF-MEMS Switch” “FBAR Filter” “Tensile Properties Test
Method by Means of Bending” and “Wafer-to-wafer Bonding
Strength Test Method” proposed by Korea would be promoted
from the Committee Draft (CD) stage to the Committee Draft
for Vote (CDV) stage. The response to comments from theother countries regarding the “Fatigue Test Method Using
Resonant Vibration” that had been proposed by Japan andapproved as a New Work Item Proposal (NP) was accepted, anda CD will be prepared in accordance with this response. The“Micropillar Compression Test Method” and “Coefficient ofThermal Expansion Test Method” proposed by Korea did not
attract sufficient project participant countries and were notapproved as NPs. Although the proposals were rejected thistime, they will be resubmitted, and China is expected to
become a project participant next time, resulting in projectapproval.

(3) Professor Ya-pu Zhao of the Chinese Academy of Sciencegave a presentation entitled “Electrowetting on a Lotus Leaf
(EWOL).” Electrowetting is the process of changing theangle of contact by applying voltage. This process is
expected to find applications in fluid variable-focus lenses(Philips) and monitors (e-ink) (Liquavista).
(4) Yong-Hak Huh of the Korea Research Institute of Standards
and Science (KRISS) gave a presentation on a bulge test
method using application of hydraulic pressure,measurement of displacement using a laser interferometer(electronic speckle pattern interferometry or ESPI),
application of gas pressure, and detection of displacement
using capacitance. He also discussed parameters that will be
important for standardization.
(5) Dr. Hojun Ryu of the Electronics and Telecommunications
Research Institute (ETRI) gave a presentation on an
uncooled infrared sensor (bolometer) and said thatstandardization of this infrared sensor would also be
pursued.

2. 5th Japan-Korea-China MEMS Standardization Workshop
The first half of this workshop was devoted to presentations
by representatives from Japan, Korea and China on the latest
news and roadmaps relating to MEMS standardization in eachcountry. The second half of the workshop was devoted to thefollowing MEMS research presentations.

At this workshop, China also announced that it had
established a domestic organization for MEMS standardization,and specifically that it will propose, as an NP, a draft standard
for defining and measuring geometrical shapes. There is great
anticipation with regard to the start of concrete action by
China. While the vibrant activity in MEMS standardization is awelcome development, duplication and competition haveoccurred in the draft standards proposed by the individual
countries, making cooperation and coordination by Japan,
Korea and China all the more essential.

(1) Professor Ohwada of Teikyo University gave a presentation on
an electronic compass that is currently under development.
This electronic compass is made up of biaxial and triaxial
magnetic sensors and an acceleration sensor that detects theinclination of the compass. The use of MEMS technology

6Activities of the MEMS System Development Center
The Center also reviewed Japanese unexamined

Initial Release of MEMSPedia Developed in thepatent applications, patents registered in the U.S., andFine MEMS Project
The Highly Integrated, Complex MEMS Production

PCT applications as far back as the year 2000 andTechnology Development Project (2006–2008)

entered patent information related to this project incommissioned and subsidized by NEDO produced

the database.

significant achievements before coming to a

The MEMS equivalent circuit generator is a design

conclusion last year. In this project, commonly

tool capable of presenting MEMS devices andreferred to as the Fine MEMS Project, theelectronic circuits in the form of equivalent circuit

Micromachine Center (MMC) compiled a knowledge

models. There has been an increase in R&D activity on

database on fine MEMS and developed a fine MEMS

the integration of MEMS and electric circuits and on

integrated design platform aimed at increasing the

integration through combinations of different types of

support and expanding the base of researchers andMEMS. As more successful products emerge throughengineers involved in the development andthis research, the MEMS equivalent circuit generator

manufacturing of advanced MEMS. Both the fine

will provide a new design tool capable of assisting

MEMS knowledge database and the MEMS equivalent

MEMS and electronics engineers in designing devices.

circuit generator developed in this project were madeResearch and development on the fine MEMS

available on the MMC’s Web site on June 8 of this year

integrated design platform conducted between 2007

as MEMSPedia.

and 2008 produced a Web library of MEMS equivalent

By the end of March 2009, the MEMS System

circuits that stores integrated circuit models forDevelopment Center had compiled more than 1,500

various devices studied in the project, and netlists that

items of data in the fine MEMS knowledge databasecan be used in a circuit simulator.

from such sources as R&D findings (research data,

We have made these tools available on the Internet

scientific knowledge, and documentation) ofas an encyclopedia that includes knowledge data,

participants (commissioned and grant-funded) in thedesign support tools, and a variety of open content infine MEMS project, R&D findings from re-the hope of effectively disseminating this knowledgecommissioned university studies, and presented

while encouraging others to expand the information.

papers and technical literature collected by the MMC

We hope you will use MEMSPedia.

at academic conferences in Japan and overseas.

MEMSPedia: fine MEMS knowledge database

MEMSPedia: MEMS equivalent circuit generator

7

MEMS Industry Forum Activities
The MEMS Industry Forum (MIF) was established to help

Industrial Technology Development Organization (NEDO).

strengthen the international competitiveness of the MEMS

This study was conducted to study and analyze MEMS

industry in Japan. Members are primarily companies in areas

industry trends and to determine how devices, application

related to the MEMS industry. The MIF promotes various

equipment etc. using MEMS technologies should be deployed,

activities in cooperation with affiliated academies, regional

as well as ways to achieve market expansion.

centers, overseas institutions and so on.

The main content of the study includes the following:- Industry trends as seen by the papers presented at

1. Planning of Fiscal Year 2009

international conferences and the patent applications that

Under control of the MIF Executive Committee, three

have been filed

special committees (Industrial Networking Committee, Foundry- Analysis of individual application fields in order toService Industry Committee and International Networking

determine application trends

Committee) have been established to implement specific- Analysis of the current status of players in the MEMS fieldproject activities. From May through June, the MIF Executive

in order to determine trends at MEMS-related companies

Committee and the three special committees held their first

The study provides basic data on the overall industry as

committee meetings and finalized their activity schedules forwell as information on strategy formulation by individual

the fiscal year.

companies. In the near future, the study will be made available

At the MIF Executive Committee meeting held on June 12,

on the MIF Supporting Member page.

the overall schedule of activities for the current fiscal year was

3. International Networking Activities (Hanover
Messe, Micromachine Summit, LETI Workshop)

approved. The main components of this fiscal year’s activities
include the following:

As international Networking activities, the MIF engages in

1. Continue the ongoing survey of industry trends withbusiness-related and academic international interchanges that

increased depth of focus

include sponsoring international symposiums and dispatching

2. Study how the Nanotech Arena concept (being promoted

overseas study missions.

primarily by the Ministry of Economy, Trade andSo far during this fiscal year, the MIF has exhibited

Industry) could be employed by the MIF
3. Support personnel training activities being implemented

products and presented papers at the Hanover Messe (inin regional areas and begin the process of organizing

Hanover, Germany) held April 21 - 25, and presented papers

these activities as an ongoing effort

and participated in interchange activities at the MMC/LETI
Workshop held June 11 - 12 in Grenoble, France. Attendance by

4. Intensify efforts to disseminate the achievements of past

Japan at the Micromachine Summit held May 5 - 8 inprojects such as MemsONE

Edmonton, Canada was canceled due to the H1N1 influenza

5. Prioritize international networking activities in the midst

outbreak.

of the tight budgetary environment
The three special committee activity schedules were

The MMC/LETI Workshop was held to provide a venue forfinalized in accordance with this overall activity schedule andthe presentation of MEMS-related papers and to study ways toimplementation of the projects for the fiscal year has begun.

enhance cooperation with LETI/MINATEC, an MIF overseas
affiliate and one of the centers for device research in Europe.
Japanese universities and companies participated in theworkshop in addition to representatives from the Ministry of
Economy, Trade and Industry and NEDO. The workshop andrelated facility visits provided valuable stimulation with regard
to future projects, research activities and policy research.

1 s t MIF Executive Committee Meeting

2. MMC Survey of MEMS Industry Trends
A report was compiled that added a relevant study
conducted by the MMC Industrial Trends Research Committee
to the “Survey of Domestic and International Technology
Workshop participants from Japan in front of
LETI/MINATEC (Grenoble, France)

Trends for the Formulation of Strategies in the MEMS Field”
compiled last year at the request of the New Energy and8Dissemination and Publicity Projects
This session focused on the latest dissemination andrelated companies and make the MEMS Mall a portal site forpublicity activities conducted by the Micromachine Center and

MEMS business.

the Beans Laboratory.
(5) News Blog

1. Meeting of the Dissemination and Publicity
Committee

been started on the Micromachine Center Web site to provide

The first meeting of the Dissemination and Publicity

quick updates on the latest activities of the Micromachine

A Blog entitled “MEMS Wave @ Micromachine Center” hasCommittee for FY 2009 was held on June 3. The committee

Center. Please feel free to visit to the Blog.

reviewed the dissemination and publicity activities of the

URL : http://beanspj.cocolog-nifty.com/mems/

Micromachine Center for the current fiscal year and approved

3. Dissemination of Domestic Project Achievements

the schedule of activities.
The Center’s Commercialization and Publicrelations(1) MEMS-ONE Project

Department also makes information available on its Web site to

The MemsONE Support Center has taken the lead inin an effort to publicize the achievements of national projects

holding training sessions and technology exchange seminars

and stimulate MEMS industries.

and so on to promote dissemination of the design tool“MemsONE R ” achieved by the MEMS Open Network

2. Information-providing Activities

Engineering System of Design Tools (MEMS-ONE)(1) Publication of Quarterly Magazine “MICRONANO”

Development Project (FY 2004 - 2006).

Beginning this fiscal year, MICRONANO is being publishedjointly under the name of both the Micromachine Center and(2) Fine MEMS Project

the BEANS Laboratory. Each issue covers the status and(MEMS System Development Center)achievements of project activities as well as upcoming projects

The Fine MEMS knowledge database and the MEMS

and events.

equivalent circuit generator achieved as a result of the Highly- Japanese edition (MICRONANO)

Integrated Complex MEMS (Fine MEMS) Production

Published quarterly and distributed in print form as well asTechnology Development Project (FY 2006 - 2008) have beenin electronic form on the Center’s Web sitemade available in the form of the “MEMSPedia” Web content on- English edition (MICRONANO) (English translation of

the Micromachine Center’s Web site.

Japanese magazine)
Published quarterly in electronic form on the Center’s Web site

(3) BEANS Project (BEANS Laboratory)
Starting in FY 2009, the BEANS Laboratory became theimplementing entity for the BEANS Project (FY 2008 - 2012).

(2) MMC-MIF-BEANS Monthly
Starting this fiscal year, MMC-MIF-BEANS Monthly is being

Accordingly, the Micromachine Center is participating in the

published jointly by the Micromachine Center and the BEANS

BEANS Project as a member, providing appropriate personnel

Laboratory. The monthly newsletter covers the status of activities,

and financial support to ensure the success of the project.

policy trends, information on upcoming events and so on.
(4) Other Activities
1Micromachine Technology Project(3) MicroNano Net
This occasional bulletin is published via mailing list and sent

The MMPJ Archive has been made available on theto supporting members of the Micromachine Center, MEMS

Micromachine Center’s Web site. The MMPJ Archive organizes

Industry Forum members and so on. It provides information on

the achievements of the Micromachine Technology Research

MicroNano-related industry-academic joint activities andand Development Project (FY 1991 - 2000) in Web contents,

upcoming events.

enabling information to be retrieved as needed.
2Study Report Data Service (Research and Standardization
Department)(4) MEMS Mall
Since April 2009, not only MEMS Industry Forum members

The Information Service Activities page of the

but also general companies have been able to list products andMicromachine Center’s Web site contains a list of researchtechnologies on the MEMS Mall. Access has been expanded inreports published in 1997 and thereafter, and also provides

this manner in order to invite participation from more MEMS-

these reports at cost.

9Activities of the BEANS Laboratory

Goals of the BEANS Project
3. 3D Nanostructure Formation Processes

One goal of the BEANS Project is to establish integrated
micro/nano manufacturing technologies that combine the topdown approach of micromachining with the bottom-up
approach of nano/bio processes, the objective being to produce
innovative devices that will revolutionize our lives in such areas
as the environment and energy, medical care and welfare, andsafety and security. Specifically, we are attempting to merge
science and engineering while fusing dissimilar fields such as
MEMS and nano/bioengineering. Another goal of the project isto develop a set of new core process technologies (BEANS
processes) required to create innovative next-generation
devices (BEANS) and to establish these core process
technologies as the BEANS platform.

• To produce damage-free 3D nanostructures (nanosize holes

with an aspect ratio of 100 or greater) in the etching surface
with atomic layer control by developing ultra-low-damage
neutral beam etching for use on glass, compound
semiconductors, and organic semiconductor material in
addition to silicon. Combining this technology withfemtosecond laser modification will give us a processing
technology for forming complex 3D nanostructures with a
precisely controlled isotropic/anisotropic nature to suit thedevice structure.
• To establish coating and deposition techniques for preventing
microstructures from sticking to one another due tointerfacial tension, using supercritical carbon dioxide fluid totransport raw material deep into the 3D nanostructure. This
technique will also be expanded to embed metal, oxide film,
block polymers, and other materials in microtrenches andmicroholes of 3D nanostructures (nanosize holes with an
aspect ratio of 100 or greater) with no gaps. The feasibility ofthese 3D nanostructure processes will be verified based onenvisioned devices.

Target of BEANS Project

4. Micro/Nanostructure Large-Area Continuous
Manufacturing Processes• To

develop process technologies capable of forming
functional films with electronic functions having an electron
mobility of 1 cm 2 /V-sec or greater and thin films withmechanical functions constructing micro/nano structures
while achieving a practical deposition rate using non-vacuum
deposition processes such as coating or self-assembly
processes.
• To establish a process technology capable of forming theabove high-level functional film over a meter-scale large-area
substrate by scanning the substrate to deposit a uniform film
_ 10%, with a patterning resolution no
thickness within +greater than 200 µm and a processing time no greater thanthat of current vacuum devices.
• To develop processes for forming 3D nanostructures on a
fibrous substrate coated with a nanofunctional film at aprocessing speed of 20 m/min or better, and to develop
weaving integration process technologies to create sheet-likedevices that function even when deformed threedimensionally and to verify the functions of flexible sheet-likedevices.

Below is a description of the goals we hope to achieve uponcompletion of the project based on the R&D tasks set forth in
the basic project plan, and the rippling effect theseachievements will have on industry.

1. Bio Integration Processes• To conduct R&D on processes for forming biomaterials, suchas hydrogels and artificial lipid bilayers, having long-term
stability. The purpose of this R&D is to establish processes
for forming artificial lipid bilayers that are capable ofperforming biomolecular measurements with great sensitivity
and can remain stable for at least one day in biocompatible
materials, such as hydrogel and microfluidic devices capableof functioning continuously in the body for at least threemonths.
• To produce advanced functions by constructing artificial cells
and artificial tissues. This will be achieved by establishingprocess technologies for producing bead capsules using a
microbead technique, synthesizing peptides for cell adhesion,and assembling 3D structures of micro-organs and cells forexpressing and preserving biofunctions.

In order to apply the achievements acquired above
extensively to BEANS manufacturing methods as a platform forprocesses that fuse different fields, future core processing
technologies will be modeled to simulate the processes. We will
also create a database with related processing knowledge andexpertise to build a design infrastructure for BEANS processes,
and will provide licensing for intellectual property rights
essential for commercializing BEANS manufacturing techniques
in order to remove all obstacles in the patenting process.
In the event that the BEANS Project achieves all of thegoals set forth above, BEANS processes will be recognized as aplatform for producing innovative devices that can revolutionize
the way we live. It is our hope that this platform will contributeextensively to business development and the cultivation of new
industries when adopted by companies in diverse industrial
fields.

2. Organic Material Integration Processes• To conduct R&D on producing high-performance organic

photovoltaic devices. Through this R&D, we hope to establish
processes for forming self-assembled nanostructures, such asorganic molecular nanopillars spaced at the sub-200-nm
carrier diffusion length of the organic semiconductor, organic
molecular nanoporous structures with uniform sub-100 nm
pores, and mesh or linear structures having a sub-100 nm
line-and-space (L/S) pattern. Basic functions such as theconversion rate will be verified based on the envisioned
design.

10

BEANS Project Seminar Report
The BEANS Project Seminar was held for two dayson May 19 - 20, 2009 at X Wave Fuchu in Fuchu City,
Tokyo Prefecture. The seminar featured invited guests
from the Ministry of Economy, Trade and Industry(METI) and the New Energy and Industrial
Technology Development Organization (NEDO) and
was attended by a total of members. The purpose of
the seminar was to report on research anddevelopment efforts during the previous fiscal year byresearchers in each research area, and to discuss thecreation of new technologies through technology
fusion between individual centers and the future thatwill be created by BEANS. Organizers also hoped theseminar would help to improve intra-project
cooperation and competitiveness.
The May 19 session featured opening remarks fromBEANS Project leader Atsushi Yusa and thepresentation of research achievements during theprevious fiscal year in poster format, followed byindividual discussions in preparation for the group
discussions to be held on the following day.
In his opening remarks, BEANS Project Leader
Yusa spoke about the purpose, objectives andsignificance of the seminar, as well as the mission of
the BEANS Project members. He also noted theimportance of efforts to embody the research visionand scenario in practical form.
Next, 44 research and development achievements
for the previous fiscal year were presented in poster
form. Individual researchers used their allotted time togive presentations on their posters, hoping to receive
the Best Poster Award, and the session included many
valuable discussions.

Opening Remarks
from Project Leader

In the group discussions, the attendees weredivided into groups containing a mix of researchers
from the individual BEANS research centers and fromindustry, government and academia. Two of thesegroups debated each of the three discussion topics:
Future Development of BEANS Processes, Objectivesof the BEANS Project and Integration of BEANS
Research Areas. The results of the group discussions
were presented in a panel discussion format, withparticipants presenting the most important and uniqueviews and approaches that came out of the group
discussions on the topic. Many members of theaudience expressed their views as well.
Summaries of the previous fiscal year’s researchachievements were also presented by the directors ofeach of the individual BEANS research centers:
Professor Shoji Takeuchi of Life BEANS Center,
Professor Chihaya Adachi of Life BEANS Kyushu
Center, Professor Masakazu Sugiyama of 3D Beans
Center, Professor Masafumi Kimata of 3D BEANS Shiga
Center and Mr. Toshihiro Ito of Macro BEANS Center.
The oral presentations featured the following
outstanding research presentations by researchers
recommended by the Center directors. Each
presentation was followed by a spirited question-andanswer session.
Life BEANS Center
Yukiko Tsuda
Life BEANS Kyushu Center Masaya Hirade
3D BEANS Center
Tomohiro Kubota
3D BEANS Shiga Center
Shimpei Ogawa
Macro BEANS Center
Sohei Matsumoto
The awards ceremony acknowledged theachievements of these researchers. In addition, thefollowing persons were awarded the prizes foroutstanding poster. The award certificates were
presented by Sub-Project Leader Masafumi Kimata.
Best Poster Award
Hideaki Shibata
Outstanding Poster Award
Takeshi Momose,
Yoshihiko Watanabe,
Makoto Kashiwagi,
Shozo Hirata
The conference concluded with an overallsummary and review by Sub-Project Leader, Prof.
Hiroyuki Fujita.

Poster Presentation

Following the poster presentations and a break forlunch, discussions to prepare for the group discussions
on the following day were held, continuing until late
into the night.
The session on the 20 t h featured the group
discussions and a report on their results, an overview
of the previous fiscal year’s research achievements,
oral research presentations and the Best Poster Award
and Outstanding Research Award ceremony.

Group Discussion

11

Oral Presentation

Mi c ro N a n o 2 0 0 9

Co n c u r re n t Pro g r a m s

15 th International Micromachine Nanotech Symposium ~MEMS World~ Program“MEMS/NEMS evolved by integration and convergence” ~ Breakthrough for industrialization, Concentration of R&D activities into several major international institutes and Promising applications ~Sponsor: Micromachine Center / MEMS Industry Forum

Special Venue A
7/29
(Wedn
esday)

Chair: Ryutaro Maeda, Prime Senior Researcher, National Institute of Advanced Industrial Science and Technology

Opening
10:30-10:35 Opening Remarks
10:35-10:40 Guest Speech
Keynote sessionConcentration of R&D into Major International Institutes
10:40-11:10 MEMS in France: the R&D model and vision at LETI / MINATEC
11:10-11:40 Towards micro and nano technologies for integrated systems

Tamotsu Nomakuchi, Micromachine Center
Takeshi Yonemura, Manufacturing Industries Bureau, METI

Andre Rouzaud, Silicon Heterogenous Integration Dept. CEA-LETI. MINATEC
Thomas Gessner, Prof. Head of Fraunhofer ENAS (Research Institution for Electronic Nano Systems)
11:40-12:10 Worldwide Growth Opportunities for MEMS: MIG’s Perspective on MEMS Activities in the US and Emerging Technologies
Karen Lightman, Managing Director, MEMS Industry Group
Session 1
New World Explored by MEMS
13:10-13:40 Animal Watch Sensor System for Human Health and Food Safety
Toshihiro Ito, Group Leader, Networked MEMS Technology Group, Advanced Manufacturing Research Institute, National Institute of Advanced Industrial Science and Technology
13:40-14:10 Silicon Light Modulators: An Enabling Technology
14:10-14:40 Wearable Sensor Technologies for Realizing Safe, Secure and Healthy Societies
14:40-15:10 Harsh Environment Wireless MEMS Sensors for Energy & Power
Session 2
Latest Fabrication Process and Material Corresponding to Development Frontline
15:20-15:45 Can SOI break the MEMS law ? A material supplier’s view
15:45-16:10 Chip to Wafer bonding: The latest technology and future prospective

Thilo Sandner, Fraunhofer Institute for Photonic Microsystems
Kiyoshi Itao, Prof., Tokyo University of Science
Albert P. Pisano, Prof. and Chair, Department of Mechanical Engineering, UC Berkeley, BSAC
Markku Tilli, Senior Vice President, Research, Okmetic Oyj
Sunil Wickramanayaka, Director of Technology, Technology Div., EVGroup
Marco Moraja, Business Manager, Getter for MEMS, SAES Getters S.p.A.

16:10-16:35 Hermetic packaging designs of MEMS : past and future prospective
Closing
16:35-16:45 Closing Remarks

Keiichi Aoyagi, Micromachine Center

MEMS Mounting & Packaging ForumSponsor: Micromachine Center / MEMS Industry Forum Japan Welding Society / Microbonding Study GroupSpecial Venue B

13:00-13:10
13:10-13:50
13:50-14:30
14:30-14:50
14:50-15:10

Opening Remarks

Keiichi Aoyagi, Micromachine Center

Progress in MEMS Integration and Hopes for the Creation of New Industries
Advances in Electronic Device Mounting and New Trends

Susumu Sugiyama, Ritsumeikan University
Kozo Fujimoto, Osaka University

Creation of Functionally Integrated MEMS Through Wafer-level Packaging

Masao Kubo, Panasonic Electric Works Co., Ltd.

Development of Heterogeneous Material Multilayer MEMS Integration Technologies
15:10-15:30 Development of Low-cost RF-MEMS Variable Capacitors using In-Line WLP (Wafer Level Package) Technology
15:30-15:50 Patterning Technology for Three-dimensional Substrates using Non-linear Lithography

Ryo Ota, Olympus Corporation
Susumu Obata, Toshiba Corporation
Hiroaki Nishiyama, Osaka University

Special Venue A

Japan-Germany MicroNano Business ForumSponsor: IVAM Microtechnology Network

Cosponsor: Micromachine Center / MEMS Industry Forum

Time: 10:30 a.m. - 2:15 p.m.
Program: This forum is sponsored by the IVAM Microtechnology Network based in the North Rhine-Westphalia (NRW) province of Germany. It introduces the technologies and products of IVAM member
companies (located mainly in Europe) and also provides opportunities for business tie-ups between IVAM member companies and Japanese companies.

BEANS Project Seminar
Sponsor :New Energy and Industrial Technology Development Organization (NEDO) / BEANS Laboratory
13:10-13:15 Opening Remarks from Sponsor
13:15-13:25 Opening Remarks from Project Leader

7/30
Special Venue B

(Thur
sday)

13:25-13:55
13:55-14:25
14:35-14:55
14:55-15:15
15:15-15:35
15:35-15:55
15:55-16:15
16:15-16:35
16:35-16:55
16:55-17:00

Special Venue A

7/31

Atsushi Yusa, BEANS Laboratory
Masayoshi Esashi, Tohoku University
Tsuneyuki Miyake, Nikkei Microdevices

Prospects for MEMS and Expectations for BEANS Project
The MEMS Market and Recent Technical Trends
The Structure and Significance of the BEANS Project
Use of Hydrogel Beads for Enclosure, Embedding and Assembly

Hiroyuki Fujita, Tokyo University
Shoji Takeuchi, Tokyo University

Manufacture of Organic Nanostructures to Achieve Dramatic Improvement in Organic Semiconductor PerformanceSupercritical Film Formation Technologies for Filling In Nanogaps
Ultra-low Damage Neutral Particle Beam Etching Technologies
Application of MicroNano Processing Technologies to Infrared Sensors for Use in Outer Space
Macro-BEANS Strategies for Achieving Meter-class Large-area Advanced Devices

Chihaya Adachi, Kyushu University
Masakazu Sugiyama, Tokyo University

Seiji Samukawa, Tohoku University
Masaaki Kimata, Ritsumeikan University
Toshihiro Ito, National Institute of Advanced Industrial Science and Technology (AIST)

Closing Remarks

Keiichi Aoyagi, Micromachine Center

MicroNano 2009 MEMS Industry Forum(Friday)

Moderator: Yutaka Takei, BEANS Laboratory
Akira Uehara, New Energy and Industrial Technology Development Organization (NEDO)-Achieving Growth and Broadening the Base of the MEMS Industry: New Ideas from the MEMS Industry Forum-

Sponsor: Micromachine Center / MEMS Industry Forum
Moderator: Masahiro Katashiro Micromachine Center / MEMS Industry Forum
Opening
10:30-10:35 Opening Remarks
Koichi Imanaka Omron Corporation (Vice Chairman, MEMS Industry Forum)
10:35-10:50 Introductory Talk: What is Needed for MEMS Industry Development? - The Role and Activities of the MEMS Industry Forum Keiichi Aoyagi Micromachine Center
Session 1
Data Evidence for MEMS Industry Growth
10:50-11:10 Current Trends in MEMS Technology and Future Prospects as Seen in International Conferences
Shuichi Shoji Waseda University
11:10-11:30 The Main Players in the MEMS Industry (Survey of Industry Trends in the MEMS Field)
Shun'ichi Adegawa Micromachine Center
11:30-11:50 Latest Trends in MEMS International Standardization - Growth in Demand and Business Activity Kuniki Ohwada Teikyo University
11:50-12:10 How to Use International Standards to Evaluate MEMS Materials
Kazuki Takashima Kumamoto University
Session 2
Prevailing in International Competition Through Research and Development & Improvement of Manufacturing Infrastructure
13:05-13:25 Creating a MEMS "Integrated Center of Knowledge and Experience" in the Nanotech Arena
Masahiro Katashiro Micromachine Center / MEMS Industry Forum
13:25-13:45 Improving the MEMS Foundry Network System- Incorporation into Standard Processes Fumihiko Sato, Omron Corporation
13:45-14:05 MemsONE: A Verification Tool for Issues in the MEMS Design and Manufacturing Process
Yoshiharu Suizu Micromachine Center
14:05-14:25 MEMSPedia: An Encyclopedia for the MEMS Field
Tomoyuki Koike Micromachine Center
14:25-14:45 Personnel Training in New Project Development & Innovation in the Area of MicroNano Mass Production Technologies and Applied Device Manufacturing
Masaharu Takahashi National Institute of Advanced Industrial Science and Technology (AIST)
14:45-15:15 Research & Development for Establishing a MEMS Industry in Korea
Korea Institute of Industrial Technology (KITECH), Senior Researcher, Sung Ho Lee, Ph.D
Session 3
Expectations for the Establishment of R & D Centers for the MEMS Industry
15:15-15:35 MEMS Industry Efforts in Tohoku
Yutaka Takei General Coordinator, Tohoku Industrial Cluster & MEMS PARK CONSORTIUM
15:35-15:55 Microfabrication Technology Efforts in Kyushu
Nagao Miyashita Industry-Academia Cooperation Center, Kita-Kyushu Foundation for the Advancement of Industry, Science and Technology
15:55-16:15 Establishing MicroNano Technology Centers Through Transcription - Deployment in the Sustainable Energy Field Tadashi Hattori Hyogo Prefectural University
Closing
16:15-16:20 Closing Remarks
Keiichi Aoyagi Micromachine Center

Special Venue B

Fine MEMS Project Achievements Seminar
Sponsor: New Energy and Industrial Technology Development Organization (NEDO)This seminar will present the total research and development achievements of the Highly Integrated and Complex MEMS Manufacturing Technology Development Project (Fine MEMS Project) (FY 20062008) that ended in FY 2008, in the Project's four development categories (MEMS/nano-function composite technology, MEMS/semiconductor integrated fabrication technology, MEMS/MEMS highintegration composite technology, and establishment of a database of high integration composite MEMS knowledge) as well as in terms of the development of a fine MEMS system design platform.
Note: The details of the program have not yet been finalized.

MICRONANO No. 68
MICRONANO is published quarterly by Micromachine Center (MMC), BEANS Technical Research Association(BEANS . TRA) to promote the international exchange of information related to micromachines, R&D and othertechnical topics, and is circulated free of change. Please send your comments about MICRONANO to the publisher :Keiichi Aoyagi, Executive Director, Micromachine Center (MMC)
MBR99 Bldg., 6F., 67 Kanda Sakumagashi, Chiyoda-ku, Tokyo 101-0026, Japan
Tel : +81-3-5835-1870, Fax : +81-3-5835-1873
Internet Home Page h t t p : / / w w w . m m c . o r . j p /Date of Issue : August 21, 2009