May 15, 2023
NEWS RELEASE

Expansion of Facility Manufacturing HRDP®, a Specialty Carrier for Next Generation SemiconductorPackaging— Second Line to be installed and DOE Facility to be Expanded —Mitsui Mining and Smelting Co., Ltd (President and Representative Director: NOU Takeshi; hereinafter “MitsuiKinzoku”) and GEOMATEC Co., Ltd (CEO: MATSUZAKI Kentaro; hereinafter “GEOMATEC”) have beenworking together to establish a mass production system for the commercialization of HRDP®,1 a specialty carrier for
next-generation semiconductor packaging. Mitsui Kinzoku is pleased to announce that we have decided to invest ina second production line in GEOMATEC’s Ako plant to increase production capacity and expand the DOE facility.
Developed by Mitsui Kinzoku, HRDP® is a specialty carrier that achieves an ultra-high-density design with an L/Sof 2/2 μm or less which is necessary for next-generation semiconductor packaging.
Currently, several major semiconductor companies have begun the full-scale development of their next-generation
semiconductor packages using HRDP®. In response to this, Mitsui Kinzoku has decided to further improve qualityand increase production capacity by introducing a second HRDP® line at GEOMATEC’s Ako plant, scheduled tostart operation in 2025. At the same time, GEOMATEC will invest in the thin-film process used on this second line.
In addition, by expanding the DOE facility2 already in operation, we will accelerate joint development with major
semiconductor companies using HRDP®. This will enable customers to shorten cycle times.3
With the installation of the second line and the expansion of the DOE facility, we will be able to respond quickly tothe increasing demand for development and move toward the adoption of HRDP® and the expansion of its use inmass production in the next-generation semiconductor market in the future. This capital investment will be made insteps from 2023 to 2025.
Based on our purpose, “We promote the well-being of the world through a spirit of exploration and diversetechnologies.” We will contribute to the semiconductor packaging market by expanding our HRDP® business andcontribute to the creation of a sustainable society through our business activities.

300mm wafer type HRDP® products(In a special case for shipping products)

600mm panel type HRDP® product as a work in progress after mold resin encapsulation on a semiconductor package
manufacturing process (including Line/Space 2/2μm RDL4)
For more information, please contact:
Corporate Communications Department, Corporate Planning Division, Mitsui Kinzoku Co., Ltd.
TEL: 03-5437-8028 E-mail: PR@mitsui-kinzoku.com

Explanation of Terms
1. High Resolution Debondable Panel.
2. DOE: Design of Experiments. A development facility for identifying and resolving issues in advance by verifying
customer designs.
3. The number of processes and the time required to manufacture a semiconductor package. If these can be reduced,optimal semiconductor device manufacturing efficiency can be achieved.
4. Re-Distribution Layer
References
Development of HRDPTM Material for Formation of Ultra-Fine Circuits with Glass Carrier for Fan Out Panel Level
Package (release dated January 25, 2018)https://www.mitsui-kinzoku.com/Portals/0/resource/uploads/topics_180125e.pdf?TabModule1277=1

Initiation of the Mass Production of HRDP®, a Special Glass Carrier for Next-Generation Semiconductor
Packaging Devices (release dated January 25, 2021)
https://www.mitsuikinzoku.com/LinkClick.aspx?fileticket=rh%2bDH1M4W%2bs%3d&tabid=278&mid=824&TabModule1277=1
Mass Production of the HRDP® Special Carrier for Next-generation Semiconductor Packaging Device begins
for the Overseas market (release dated December 14, 2021)
https://www.mitsuikinzoku.com/LinkClick.aspx?fileticket=rf%2bLsUEKH8g%3d&tabid=278&mid=824&TabModule1277=1
Video illustrating the chip last process using HRDP®
https://www.youtube.com/watch?v=vHhng-NV9QA