Phoenix
V|tome|x S240 microCTv|tome|x m 240v|tome|x m 300
v|tome|x m dual|tube(+180 kV nanoCT®)The versatile industrial 2D radiography and3D CT system for high resolution inspection
with improved features and design.

Phoenix V|tome|x S240

Phoenix V|tome|x S240 Dual|tube(+180 kV nanoCT®)Inspect with precisionand efficiency.
The bestselling industrial CT workhorse
When being launched in 2003, the Phoenix V|tome|x S has been the first lab size highly
resolving micro- and nanoCT ® system. With its unique Dual|tube configuration option, it
rapidly became the bestselling CT system of that kind worldwide with approximately
500 installations in research institutes and quality labs all over the world.
With the next generation of this trendsetting system now available, customers benefit
from the unprecedented versatility of that 2D inspection and 3D CT system, combining
high-resolution, ease of use and reliability with a great price-performance ratio.

The new Phoenix VItomeIx S240 microCT systemcovers a wide range of application capabilities:

Internal defectanalysis

3D quantitativeporosity analysis

Flexible 2D X-rayinspection

Materials structure
analysis

Assembly control

CAD Data nom/act
comparison

Scan faster and see more.
The Phoenix V|tome|x S240 is one of the few CT systems
worldwide combining the highly efficient Dynamic 41
detector technology and High-flux|target — enabling highimage quality as it scans much faster, or with improved
accuracy, and truly revolutionizing inspection.
We offer several configurations and optional tools to help
you achieve your production throughput goals with extreme
accuracy. With High-flux|target and multi beam-hardening
correction for improved image quality, y­­­­­­ou can increaseprobability of detection (POD) with efficiency and ease.

•FastDual|tube
and easy switch between

micro- and nanofocus X-ray tube.

41 digital detector•HighDynamicdynamic large 16” digital flat
panel detector.

DXR S100 Pro detector•Optional
100 µm pixel pitch detector
for highest resolution inspection.

High-flux|target•Improveefficiency with faster microCT

scans or doubled resolution with higher
power on a smaller focal spot.

•ScanHelix|CTwith improved image quality toincrease probability of detection (POD)with efficiency and ease.

•ScanOffset|CTeven larger parts with up to 100%
larger scanning volume.

correction•TheBeam-hardening
Multi|bhc tool corrects streaking

artifacts which typically occur as multiple
dark streaking bands positioned between
dense areas in multi-material samples.

Datos|x CT software•FullyPhoenix
automate your data acquisition, volume processing, and evaluation with ease.

Full 2D investigation•Manipulator
tilt axis (+/-45°) for fully flexible
radiographic inspection.

image optimization•NextFlash!
generation of superior defectTMdetection, optimized for 2D electronics
and casting inspection.

The micro- and nanoCT®
solution for your specificinspection tasks.
Whether you need to increase speed, detection detail,or do both, the Phoenix V|tome|x S240 can be formatted
for any 3D industrial or scientific microCT task.
To allow high flexibility, the V|tome|x S240 may optionallybe equipped with both, a 180 kV/20 W high-power
nanofocus X-ray tube and a 240 kV/320 W microfocus
X-ray tube. Due to this unique combination, thesystem is an ideal tool for a wide range of applications
from extreme high resolution scans of low absorbing
materials as well as for 3D analysis of high absorbing
objects up to 500 mm in diameter.

Industrial 3D NDTBeyond high-resolution 3D analysis in R&D andfailure analysis labs, this machine allows 3D
production control of injection mouldings, small
castings, electronic devices, sensors, batteries,
complex composites and 3D printed parts.
And with the offset|CT, you can scan even larger
parts with up to 100% larger scanning volume.
•Internal defect analysis / 3D quantitativeporosity analysis•

Assembly control•Materials structure analysis

Research & DevelopmentWith its high-resolution 180 kV nanoCT®
option, the Phoenix V|tome|x S240 opens a
non-destructive third dimension forresearch & development down to thesubmicron scale—with no required
preparation, slicing, coating or vacuum
treatment.

Advanced Tools for Flexibility,
Precisions and Ease of Use.
Waygate Technologies offers several options to increase quality and productivityof your CT scans.
Dual|tube CT

To expand the application range especially for
research and electronics inspection tasks, theV|tome|x S240 can optionally be equipped withan additional 180 kV high power nanofocus X-raytube, enabling nanoCT® with a best detail detectability 200 nanometers. Within few minutes, thetubes will automatically be changed after justswitching the button.

Helix|CT

Phoenix V|tome|x S240 is capable for performing
helical (or spiral) scanning, with your sample
constantly moving upwards in the X-ray beam.
This enables you to scan longer parts faster,eliminating the need to stitch several partial scan
results together afterwards. On the other hand, thisacquisition technique generates significant better
results due to eliminating artifacts on horizontal
surfaces and in the stitching areas.

Conventional

Offset|CT

With its Offset|CT scan capability, compact CT
systems like the V|tome|x S240 can scan bigger
parts than ever before, or the same size parts,
but with higher resolution.
objectX-ray source

higherresolution

detectorlarger part

Click&measure|CT

Helix|CTYour entire CT process chain can be fully automated with the push of a single button. It reduces
operator time and influence, while dramaticallyincreasing productivity as well as reproducibility ofyour CT results.

Measure with InsightNon-destructive CT based coordinate measurement3D CT offers big advantages overconventional tactile or opticalcoordinate measuring machines (CMM)— especially if there are complex parts
with hidden or difficult surfaces.

••
•
•
•

Nominal-actual CAD comparison
Dimensional measurements / wall thickness analysis
First article inspection
Tool Compensation
Reverse engineering

General specifications
Phoenix V|tome|x S240
X-ray tube typeOpen directional high-power microfocus X-ray tube, closed cooling water circuit.
Optional additional (open) transmission high-power nanofocus X-ray tube

Max. voltage / power

240 kV / 320 WDual|tube option for nanoCT®: additional 180 kV / 20 W high-power nanofocus tube
with Diamond|window & easy tube exchange just by a push of a button

Geometrical magnification (3D)

1.39 x to 100 x; up to 400 x with nanofocus tube

Detail detectability

Down to < 1 µm (microfocus tube); optional down to 0.2 µm (nanofocus tube)

Min. voxel size

Down to 2 µm (microfocus tube)
Optional down to <1 µm (nanofocus tube)

Detector type(all according US
ASTM E2597 standard)

Temperature stabilized Dynamic 41|200p+ large area detector with superior image and result quality, 410x 410 mm (16” x 16”), 200 µm pixel size, 2036 x 2036 pixels (4 MP),
extremely high dynamic range > 10000:1
Optional temperature stabilized digital DXR detector array, 200 µm pixel size, 1,000 x 1,000pixels, 200 x 200 mm (8”), 2 x virtual detector enlargement
Optional DXR S100 Pro detector, 100 µm pixel size, 2,500 x 3,000 pixels for superior resolution
imaging and outstanding detectability on a 300 mm x 250 mm large active area - optional with 1.3x virtual detector enlargement

Manipulation

5-axes metal precision manipulator, optimized construction for high mechanical stability

Focus-detector-distance

800 mm (8” detector + IMR) & 940 mm (16” detector)

Max. sample
diameter x heightMax. 3D scan size up to 425 mm Ø x 360 mm with optional Offset|CT (16”),
max. 500 mm Ø x 275 mm with opt. Offset|CT (8”) detector

Max. sample weight

10 kg (22 lbs.)

Max. focus object distance

580 mm (microfocus tube)

System dimensions W x H x D

2,550 mm x 1,905 mm x 1,275 mm (100,4” x 75” x 50,2”)

System weight

Appr. 4,050 kg / 8,990 lbs. (without ext. components)

Temperature stabilization

Active X-ray tube cooling & temperature stabilized detector

2D inspection bundle

Tilt and rotation axes for tilted 2D inspection of samples up to 10 kg (22 lbs.) &2D X|act inspection software including industry leading Flash!™ intelligent image
processing technology for optimized failure detection

Optional High-flux|target

2 times faster CT scans or doubled resolution; X-ray inspection power up to 100 W

Opt. measurement
package (alsoupgrade option)

Phoenix Datos|x CT software package measurement

Opt. Helix|CT & Offset|CT

Advanced scanning trajectories for improved scanning volume and data quality:
Helix|CT for long part scans with less artifacts and better quality,
Offset|CT to scan bigger parts or same size with higher resolution

Opt. Click&measure|CT

Optional fully automated CT process chain

SoftwarePhoenix Datos|x 3D computed tomography acquisition and reconstruction software. Different 3Devaluation software packages for 3D metrology, failure or structure analysis on request

Radiation protection

Radiation safety cabinet for full protective installation without type approval according to German
StrSchG/StrSchV. It complies with French NFC 74 100 and the US Performance Standard 21 CFR
Subchapter J. For operation, other official licenses may be necessary.

2 calibration objects

A partnership for improvedperformance.
The excellent price/performance ratio of the versatile Phoenix V|tome|x S240
is just one example of how Waygate Technologies makes scientific research
as well as industrial quality assurance and manufacturing processes more
efficient. With our entire precision CT line, a variety of optional innovations,and expert service, we are committed to enhancing precision andproductivity for your operations through our global service network.

Waygate Technologies

Niels-Bohr-Str. 731515 Wunstorf
Germany
Tel.: +49 5031 172 100
Fax: +49 5031 172 299
E-mail: phoenix-info@bakerhughes.com

Waygate Technologies USA LP

Customer Solutions Center Cincinnati
11988 Tramway Drive
Cincinnati Ohio 45039
Tel.: +1 513 996 7505
E-mail: csc.cincinnati@bakerhughes.com

For more detailed information or to request a demo, please visit our website or contact us.

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