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DISCRETE SEMICONDUCTORSDATA SHEETage

M3D102

PBSS5140U
40 V low VCEsat PNP transistor
Product data sheet
Supersedes data of 2001 Mar 27

2001 Jul 20

NXP Semiconductors

Product data sheet

40 V low VCEsat PNP transistor

PBSS5140UFEATURESQUICK REFERENCE DATA

• Low collector-emitter saturation voltage

SYMBOL• High current capability

VCEO
ICM
RCEsat• Improved device reliability due to reduced heatgeneration• Enhanced performance over SOT23 1A standard
packaged transistor.

PARAMETERMAX.

UNIT

collector-emitter voltage−40V

peak collector current−2A

equivalent on-resistance<500mΩPINNINGAPPLICATIONSPIN• General purpose switching and muting

1base

2emitter

3collector• LCD back lighting• Supply line switching circuits

DESCRIPTION• Battery driven equipment (mobile phones, video
cameras and hand-held devices).

3

handbook, halfpage

3

DESCRIPTIONPNP low VCEsat transistor in a SOT323 (SC-70) plasticpackage.

12MARKING
1TYPE NUMBER
PBSS5140U

MARKING CODE

Top view

MAM04851t
Fig.1

2001 Jul 2022

Simplified outline (SOT323; SC-70) andsymbol.

NXP Semiconductors

Product data sheet

40 V low VCEsat PNP transistor

PBSS5140U

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOLPARAMETERCONDITIONS

MIN.

MAX.

UNIT

VCBO

collector-base voltage

open emitter

−−40

V

VCEO

collector-emitter voltage

open base

−−40

V

VEBO

emitter-base voltage

open collector

−−5

V

IC

collector current (DC)

−−1

A

ICM

peak collector current−−2AIBM

peak base current

−−1A

Ptot

total power dissipation

Tamb ≤ 25 °C; note 1−250mW

Tamb ≤ 25 °C; note 2−350mW

Tstg

storage temperature−65+150°C

Tj

junction temperature−150°C

Tamb

operating ambient temperature−65+150°C

Notes
1. Device mounted on a printed-circuit board, single sided copper, tinplated and standard footprint.
2. Device mounted on a printed-circuit board, single sided copper, tinplated and mounting pad for collector 1 cm2.
THERMAL CHARACTERISTICSSYMBOLRth j-aPARAMETER
thermal resistance from junction toambient

CONDITIONSVALUEUNIT

in free air; note 1500

K/W

in free air; note 2357

K/W

Notes
1. Device mounted on a printed-circuit board, single sided copper, tinplated and standard footprint.
2. Device mounted on a printed-circuit board, single sided copper, tinplated and mounting pad for collector 1 cm2.

2001 Jul 203

NXP Semiconductors

Product data sheet

40 V low VCEsat PNP transistor

PBSS5140U

CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOLICBOPARAMETER
collector-base cut-off current

CONDITIONS

MIN.

TYP.

MAX.

UNIT

VCB = −40 V; IC = 0−−−100nA

VCB = −40 V; IC = 0; Tamb = 150 °C−−−50μA

ICEO

collector-emitter cut-off current

VCE = −30 V; IB = 0−−−100nA

IEBO

emitter-base cut-off current

VEB = −5 V; IC = 0−−−100nAhFE

DC current gain

VCE = −5 V; IC = −1 mA

300−−VCE = −5 V; IC = −100 mA

300−800

VCE = −5 V; IC = −500 mA

250−−VCE = −5 V; IC = −1 A

160−−IC = −100 mA; IB = −1 mA−−−200mV

IC = −500 mA; IB = −50 mA−−−250mV

IC = −1 A; IB = −100 mA−−−500mV

VCEsatsaturation voltage

RCEsatequivalent on-resistance

IC = −500 mA; IB = −50 mA; note 1−300<500mΩ

VBEsatbase-emitter saturation voltage

IC = −1 A; IB = −50 mA−−−1.1VVBEon

base-emitter turn-on voltage

VCE = −5 V; IC = −1 A−−−1V

fTtransition frequency

IC = −50 mA; VCE = −10 V;
f = 100 MHz

150−−MHzCc

collector capacitance

VCB = −10 V; IE = Ie = 0; f = 1 MHz−−12pFNote
1. Pulse test: tp ≤ 300 μs; δ ≤ 0.02.

2001 Jul 204

NXP Semiconductors

Product data sheet

40 V low VCEsat PNP transistor

PBSS5140U

MLD5431200

MLD544−10handbook, halfpage

handbook, halfpage

hFE
VBE
(V)

(1)

800

−1(1)

(2)

(2)

400

(3)
(3)

0−10−1−1−10−102−10−1−10−1−103−104
IC (mA)−1VCE = −5 V.
(1) Tamb = 150 °C.
(2) Tamb = 25 °C.
(3) Tamb = −55 °C.

VCE = −5 V.
(1) Tamb = −55 °C.
(2) Tamb = 25 °C.
(3) Tamb = 150 °C.

Fig.2

Fig.3

DC current gain as a function of collectorcurrent; typical values.

MLD545−103
handbook, halfpage−10−102

Base-emitter voltage as a function ofcollector current; typical values.

MLD677102
handbook, halfpage

VCEsat−103−104
IC (mA)

RCEsat
(Ω)

(mV)
(1)

−102

10(3)
(1)

(2)

(2)

−101(3)−1−1−10−102−103

IC (mA)

10−1−10−1−104−1IC/IB = 10.
(1) Tamb = 150 °C.
(2) Tamb = 25 °C.
(3) Tamb = −55 °C.

IC/IB = 10.
(1) Tamb = 150 °C.
(2) Tamb = 25 °C.
(3) Tamb = −55 °C.

Fig.4

Fig.5

Collector-emitter saturation voltage as afunction of collector current; typical values.

2001 Jul 20

5−10−10−2−10−3−10−4
IC (mA)

Equivalent on-resistance as a function ofcollector current; typical values.

NXP Semiconductors

Product data sheet

40 V low VCEsat PNP transistor

PBSS5140U

MLD678300

handbook, halfpagefT
(MHz)
200

1000−2000−400−600−800−1000
IC (mA)

VCE = −10 V.
(1) Tamb = 150 °C.
(2) Tamb = 25 °C.
(3) Tamb = −55 °C.

Fig.6

Transition frequency as a function ofcollector current; typical values.

2001 Jul 206NXP Semiconductors

Product data sheet

40 V low VCEsat PNP transistor

PBSS5140U

PACKAGE OUTLINE

Plastic surface mounted package; 3 leads

SOT323DEB

AX

HEyv M A

3QA

A1c12
e1

bp

Lpw M Bedetail X

012 mmscale

DIMENSIONS (mm are the original dimensions)
UNITAA1maxbpc

DEee1

HE

Lp

Qv

w

mm

1.1
0.8

0.1

0.4
0.3

0.25
0.10

2.2
1.8

1.35
1.15

1.3

0.65

2.2
2.0

0.45
0.15

0.23
0.13

0.2

0.2

OUTLINE
VERSION
SOT3232001 Jul 20

REFERENCES
IEC

JEDEC

EIAJ
SC-70

7

EUROPEAN
PROJECTION

ISSUE DATE
97-02-28

NXP Semiconductors

Product data sheet

40 V low VCEsat PNP transistor

PBSS5140UDATA SHEET STATUS
DOCUMENTSTATUS(1)PRODUCTSTATUS(2)Objective data sheet

Development

This document contains data from the objective specification for productdevelopment.

Preliminary data sheet

Qualification

This document contains data from the preliminary specification.

Product data sheet

Production

This document contains the product specification.

DEFINITION

Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was publishedand may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage tothe device. Limiting values are stress ratings only andoperation of the device at these or any other conditions
above those given in the Characteristics sections of thisdocument is not implied. Exposure to limiting values forextended periods may affect device reliability.

DISCLAIMERS
General ⎯ Information in this document is believed to beaccurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completenessof such information and shall have no liability for theconsequences of use of such information.
Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time andwithout notice. This document supersedes and replaces all
information supplied prior to the publication hereof.

Terms and conditions of sale ⎯ NXP Semiconductors
products are sold subject to the general terms andconditions of commercial sale, as published at
http://www.nxp.com/profile/terms, including thosepertaining to warranty, intellectual property rights
infringement and limitation of liability, unless explicitly
otherwise agreed to in writing by NXP Semiconductors. In
case of any inconsistency or conflict between informationin this document and such terms and conditions, the latter
will prevail.

Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be suitable foruse in medical, military, aircraft, space or life support
equipment, nor in applications where failure or malfunctionof an NXP Semiconductors product can reasonably beexpected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment orapplications and therefore such inclusion and/or use is at
the customer’s own risk.

No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell productsthat is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents orother industrial or intellectual property rights.
Export control ⎯ This document as well as the item(s)described herein may be subject to export control
regulations. Export might require a prior authorization fromnational authorities.

Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for thespecified use without further testing or modification.

2001 Jul 20

Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values andCharacteristics sections of this document, and as such is
not complete, exhaustive or legally binding.

8NXP Semiconductors

Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors. No changes weremade to the content, except for the legal definitions and disclaimers.

Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com© NXP B.V. 2009
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any licenseunder patent- or other industrial or intellectual property rights.
Printed in The Netherlands

613514/02/pp9

Date of release: 2001 Jul 20

Document order number: 9397 750 08432