Specification EXS8815-2414
Rev: 1.0

EXS8815-2414
880nm High Power SLED
Butterfly Package
With External Monitor Photodiodeand FC/APC connector

Revision:

1.0

Date:

02-06-2010

Confidentiality:

None

Prepared by:

Raffaele Rezzonico(Product Support Technician)Checked by:

Chris Armistead(Engineering Manager)

Approved by:Philippe Crépellière(Quality Manager)

Authorized by:

Marcus Duelk(CTO)

Page 1 of 7

Specification EXS8815-2414
Rev: 1.0

Page 2 of 7

CONTENTS

1.

SCOPE ................................................................................................................3
1.1 PURPOSE.................................................................................................................... 3
1.2 RESPONSIBILITY ..................................................................................................... 3

2.

REFERENCE DOCUMENT.................................................................................33.

ELECTRO-OPTICAL PERFORMANCE (TSLED = 25°°C) ....................................34.

ABSOLUTE MAXIMUM RATINGS .....................................................................4

5.

SCREENING .......................................................................................................46.

PACKAGE DIMENSIONS [MM] .........................................................................57.

FIBRE AND CONNECTOR .................................................................................58.

IMPORTANT NOTES ..........................................................................................6

9.

ORDERING INFORMATION ...............................................................................610. REVISION HISTORY ..........................................................................................7

Specification EXS8815-2414
Rev: 1.0

Page 3 of 7

1. SCOPE
1.1 PURPOSE
The purpose of this document is to specify the electro-optical performance and dimensions ofsuperluminescent light emitting diode (SLED).
1.2 RESPONSIBILITYEXALOS is responsible for establishing, implementing and maintaining this procedure. The
Quality representative shall ensure that a timely Engineering Change Notice (ECN) is issued inaccordance with EXALOS procedure for any changes.

2. REFERENCE DOCUMENT•••

EXS-WI-0001 Visual Inspection Criteria SLED Chip on Submount Procedure
MIL STD 883 C method.
Bellcore GR-468-CORE.

3. ELECTRO-OPTICAL PERFORMANCE (TSLED = 25°°C)
Parameter
Operating Current
Power in SMF
Center Wavelength
Bandwidth FWHM
Spectral ripple [RB=0.1nm]
Polarization Extinction Ratio
Monitor PD Current*
Monitor PD Reverse bias voltage*Symbol Cond.
Iop
PoIop, max
Iop, maxλcIop, maxIop, max
PER Iop, max
IMPD
Iop, max

Min

Typ487050788060
0.1100.10Measurement conditions:- Iop = Iop Max- Monitor PD bias voltage: 0 Volts
Input resistance of the Monitor PD current measurement circuit 10 Ohm

Max200890
0.3
2.5-10UnitmAmWnm
nm
dBdBmAVSpecification EXS8815-2414
Rev: 1.0Page 4 of 7

4. ABSOLUTE MAXIMUM RATINGS
Stresses beyond the absolute maximum ratings may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Parameter

SymbolCond.

MinMaxUnit

Forward current

IF200mA

Reverse voltage

VR-2V

Forward voltage

VFStorage temperature
Operating temperatureTstg

3.085V°C

65°C

Storage humidity
Thermoelectric cooler voltage<30°C>30°CVtec**9585
2.5% r.h.
% r.h.
V

Thermoelectric cooler current

Itec

**

1.8A

Thermistor Resistance

Rth25°C

Thermistor constantBIF,max-40

TopIF,max

-20
510KΩ

3892

K

Lead soldering temperature

260°C

Lead soldering duration

10s500

VESD

human b.m** Performance values with hot side temperatures 27°C / Performance with hot side temperature 85°C (Vmax: 3.4V).

5. SCREENING

The produced 880nm SLED Module is required to meet all operating conditions specified in Table
3, Electro-Optical Performance Specifications after being subjected to the following screening tests.
Test Item
Seal

Test Conditions
Fine: Condition A1
Gross: Condition C

Temperature Cycling-40°C to +85°C,
ramp rate >= 5°C/min 10 cycles

Reference
MIL-STD-883, Method 1014
Temperature max 85°C
MIL-STD-883, Method 1010

Specification EXS8815-2414
Rev: 1.0

Page 5 of 7

3rd Angle
projection

6. PACKAGE DIMENSIONS [mm]Tolerances :.X ± 0.25 mm.XX ± 0.05 mm

30.0
20.8
7.7
5.50.251.0
2.55+2.00

12.0 -2.00

ø 2.7

7 6 5 4 3 2 1

8.9

12.7

15.2

8 9 10 11 12 13 14

26.0

Butterfly Ceramic Package

0.50

Top view

PinFunction

1TEC (+)

23

Butterfly Package
PinFunction

8MONITOR DIODE CATHODE

THERMISTOR

9NC

NC

10

SLED ANODE (+)

4NC

11SLED CATHODE (-)

5THERMISTOR

12NC

6NC

13

CASE GROUND

7MONITOR DIODE ANODE

14

TEC (-)

7. FIBRE AND CONNECTORPart

Description

SM Fibre

SM 5/125 *Loose tube secondary coating

900 µmFiber pigtail length [min]1mOptical connector

FC/APC Narrow Key (2.0mm)* Corning PureMode HI-780-6

Specification EXS8815-2414
Rev: 1.0Page 6 of 7

8. IMPORTANT NOTES
1. Avoid electrostatic discharges, which may destroy the SLED.
2. Never use the bare die without heat sinking.
3. Adequate eye protection against laser radiation should be used while handling and operating themodule.
4. EXALOS declines any responsibility if the device is used in applications where human life may
be endangered.
5. Back reflections may influence the output power and spectral characteristics of the SLED. Theuse of optical isolators and/or angled connectors is recommended. Back reflections of less than-30dB are recommended.

9. ORDERING INFORMATION
Please use the following code system to order products from EXALOS:

EX

S

8812Code

Wavelength88880 nm

CodePower in SMF [mW]

Bandwidth [nm]Ripple [dB]15

≥ 4 mW≥ 50 nm≤ 0.3 dB

CodePackage

Code

Butterfly

44

14Package Fiber Connector Option

Power & Bandwidth

Wavelength

25FibreCodeSM 5/125/900µm

1Connector

CodeFC/APC4Option
External Monitor
Diode (Pin 7 & 8)

Specification EXS8815-2414
Rev: 1.0

Page 7 of 7

10. REVISION HISTORY
Revision History
Rev.

Description

ECN Number

Date (ECN)

Released

1.0

Original version--02.06.2010