ESL1410-2113
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ESL1410-2113
SLED Butterfly 1380nm

Revision:

1.0

Date:

10-09-2012

Prepared by:

Raffaele Rezzonico(Product Support Technician)Checked by:

Chris Armistead(Engineering Manager)

Approved by:Philippe Crépellière(Quality Manager)

Authorized by:

Marcus Duelk(CTO)ESL1410-2113
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CONTENTS

1.

SCOPE..............................................................................................................3
1.1 PURPOSE ................................................................................................................ 3
1.2 RESPONSIBILITY .................................................................................................. 3

2.

REFERENCE DOCUMENT ..............................................................................3

3.

ELECTRO-OPTICAL PERFORMANCE (TSLED = 20°°C) ..................................3

4.

ABSOLUTE MAXIMUM RATINGS ...................................................................4

5.

SCREENING .....................................................................................................46.

PACKAGE DIMENSIONS [MM] .......................................................................57.

FIBRE AND CONNECTOR ...............................................................................58.

IMPORTANT NOTES ........................................................................................69.

ORDERING INFORMATION .............................................................................610.

REVISION HISTORY ........................................................................................7ESL1410-2113
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1. SCOPE
1.1 PURPOSE
The purpose of this document is to specify the electro-optical performance and dimensions ofsuperluminescent light emitting diode (SLED) Butterfly.
1.2 RESPONSIBILITYEXALOS is responsible for establishing, implementing and maintaining this procedure. The
Quality representative shall ensure that a timely Engineering Change Notice (ECN) is issued inaccordance with EXALOS procedure for any changes.

2. REFERENCE DOCUMENT•••

EXS-WI-0001 Visual Inspection Criteria SLED Chip on Submount Procedure
MIL STD 883 C method.
Bellcore GR-468-CORE.

3. ELECTRO-OPTICAL PERFORMANCE (TSLED = 20°°C)
Parameter
Operating Current
Power in SMF
Center Wavelength
Bandwith FWHM
Spectral ripple [RB=0.1nm]
Monitor Diode Current *Monitor diode bias voltage*SymbolIop
Poλc

IMPD
VBias

Cond.
Iop,maxIop,maxIop,maxIop,max

Min051360
30

Typ
81380
40
0.2

0.1
0Measurement conditions:- Iop = Iop Max- Monitor PD bias voltage: 0 Volts
Input resistance of the Monitor PD current measurement circuit 10 Ohm

Max
250
1400
0.4-12UnitmAmW
nmnmdBmAVESL1410-2113
Page 4 of 74. ABSOLUTE MAXIMUM RATINGS
Stresses beyond the absolute maximum ratings may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Parameter

SymbolCond.

Forward current

IFIF,max

Reverse voltage

VR

Forward voltage

VF

Storage temperature
Operating temperature

Tstg

Storage humidity
Thermoelectric cooler voltage<30°C>30°C
Vtec

Thermoelectric cooler current

Itec

Thermistor Resistance

RthThermistor constant

BTopMinIF,max-40
IF,max

-20
520°C

Max

Unit

300mA-2V285V°C

65°C

9585
2.5% r.h.
% r.h.
V

1.8A

12.5KΩ

3892

K

Lead soldering temperature

260°C

Lead soldering duration

10s500

VESD

human b.m

5. SCREENING

The produced 1380nm SLED Module is required to meet all operating conditions specified in Table
3, Electro-Optical Performance Specifications after being subjected to the following screening tests.
Test Item
Seal
Temperature Cycling

Test Conditions
Fine: Condition A1
Gross: Condition C-40°C to +85°C,
ramp rate >= 5°C/min 10 cycles

ReferenceMIL-STD-883, Method 1014
MIL-STD-883, Method 1010

ESL1410-2113
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6. PACKAGE DIMENSIONS [mm]3rd Angle
projection

Tolerances :.X ± 0.25 mm.XX ± 0.05 mm

30.0
20.8

7.7
5.50.25
1.5 1.0

12.0

2.55

+3.00-2.00

ø 2.7

7 6 5 4 3 2 18.9

12.7

15.28 9 10 11 12 13 14

26.0

0.38
0.50

Top view

Pin1234567

Ceramic Package
Glass Package

Function

Butterfly Package
Pin

TEC (+)
THERMISTORMONITOR DIODE ANODEMONITOR DIODE CATHODE
THERMISTOR
NCNC891011121314Function
NCNCSLED ANODE (+)
SLED CATHODE (-)
NC
CASE GROUNDTEC (-)

7. FIBRE AND CONNECTORPartDescription

SM Fibre

SMF-28, 9/125 µm

Tight buffer secondary coating

900 µmFiber pigtail length [min]1m

Optical connector

FC/APC Narrow Key (2.0mm)

ESL1410-2113
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8. IMPORTANT NOTES
1. Avoid electrostatic discharges, which may destroy the SLED.
2. Never use the bare die without heat sinking.
3. Adequate eye protection against laser radiation should be used while handling and operating themodule.
4. EXALOS declines any responsibility if the device is used in applications where human life may
be endangered.
5. Back reflections may influence the output power and spectral characteristics of the SLED. The
use of optical isolators and/or angled connectors is recommended. Back reflections of less than-30dB are recommended.
6. The measured optical spectrum of the 1380nm shows strong absorption lines in the wavelength
range from 1340nm to 1490nm which are believed to origin from absorptions in the atmosphere.

9. ORDERING INFORMATION
Please use the following code system to order products from EXALOS:

Standard product: The Standard product is ESL1410-2113.

ESL

141

Wavelength

02Wavelength

141380 nm

CodePower in SMF [mW]

Bandwidth [nm]Ripple [dB]10≥ 5 mW

≥ 30 nm≤ 0.4 dB

FiberCodeSM 9/125/900µm

12Package

Code

Butterfly

113Package Fiber Connector Option

Power & Bandwidth

Code

Code

1Connector

CodeOption

FC/APC

3

External Monitor DiodeESL1410-2113
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10. REVISION HISTORY
Revision History
Rev.

Description

ECN Number

Date (ECN)

Released

1.0

Original version--10.09.2012