Datasheet
V50-850-Cxx

50 Gbit/s VCSEL (850 nm)
Contact type: GS/SG
Product Code:
V50-850-C1

1x1

V50-850-C4

4x1

V50-850-C12 12x1
Sample image only. Actual product may vary.

Product Description

These compact and very high modulation rate top-emitting GaAs-based vertical cavity surface emitting
laser (VCSEL) chips and 1xN (N=4,12) arrays are available as engineering samples for use in thedevelopment and evaluation of optical interconnections, optical backplanes and integrated
waveguides, and next-generation optical data communications systems. The VCSELs are contacted on
the top-surface individually using ground-source (GS) microprobes, wire bonds, or flip-chip bonds.
Optical aperture: ~5-7µmFeatures· 4-ch or 12 chip arrays· Up to 56 Gbit/s per channel· Device-to-device pitch of 250 µm· Suitable for wire or flip-chip bonding

Parameter

TypicalEmission wavelength

850 nmData rate~56 Gbit/s

Threshold current
Peak output power~ 0.5 mA
~3 mW @85°C

Applications· Ethernet· Proprietary optical interconnects· Active Optical Cables (AOC)· Short-reach 25G and 100G Ethernet

All product specifications and descriptions are subject to change without noticeNo. 190850-Rev 2.0 W59

Notes
PAM-4

VI Systems GmbH Hardenbergstrasse 7 D-10623 Berlin
December 2021

Datasheet
V50-850-Cxx

Electro-Optical Specifications (T = 0 to 85°C)
Parameter

SymbolEmission wavelength
Maximum data rate
Optical bandwidth
Slope efficiency
Threshold current
Differential resistanceBeam divergence
Peak output power
Spectral bandwidth (RMS)λBR
BW (f3dBo)
ηIthRdΘPmax
ΔλRMS

Condition

MinTyp840

5 mA
25-85°C
5 mA
FWHM0.3251680
2030.65 mAMaxUnit

860
28180.50.8
100nm
GBaud/s
GHzW/AmAΩ°mWnm50.8*anti-reflection coating is optimized for <1% reflectivity within the range 840 nm - 960 nm

LIV Characteristics

Optical Spectrum

25 Gbit/s NRZ 25°C 6 mA 500 mVpp

25 Gbit/s NRZ 85°C 6 mA 500 mVpp

Transmitter: SHF BPG 12104A. Receiver: Tektronix DSA8300 w. 80C15 Optical Sampling Module.
Eye diagrams show intrinsic performance of the chip. No equalization or signal processing was applied.

All product specifications and descriptions are subject to change without noticeNo. 190850-Rev 2.0 W59

VI Systems GmbH Hardenbergstrasse 7 D-10623 Berlin
December 2021

Datasheet
V50-850-Cxx

Absolute Maximum Ratings
SymbolParameter

IfVrv
TopTstTsl

Peak forward current
Maximum reverse voltage
Operating temperature
Storage temperature
Soldering temperature

ConditionMin

Typ-40max 260 sec

MaxUnit

9585
100
150mA
V°C°C°C

Stress in excess of any of the individual Absolute Maximum Ratings can cause immediate irreversible
damage to the component even if all other parameters are within the electro-optical specifications.
Exposure to any of the Absolute Maximum Ratings for extended periods can adversely affect thereliability of these chips.
Mechanical Dimensions
Parameter

TypeMin

TypMaxUnit

VCSEL pitchAll

250

Length 1x1 VCSEL chip

V50-850-C1210

250µm

Length 1x4 VCSEL array

V50-850-C4960

1000µmLength 1x12 VCSEL array

V50-850-C122960

3000µmHeightWidthAllAll

150210160
250µm
µm

140µm

V50-850-C1 Dimensions

All product specifications and descriptions are subject to change without noticeNo. 190850-Rev 2.0 W59

VI Systems GmbH Hardenbergstrasse 7 D-10623 Berlin
December 2021

Datasheet
V50-850-Cxx

V50-850-C4 Array dimensions

Qualification Notification
The V50-850-Cxx has been qualified to meet the specifications outlined in this data. A reliability
assessment report is available as a separate document.

VI Systems GmbH
Hardenbergstrasse 710623 Berlin
Tel.: +49 30 3083143 30
Fax: +49 30 3083143 59
sales@v-i-systems.com
www.v-i-systems.com

All product specifications and descriptions are subject to change without noticeNo. 190850-Rev 2.0 W59

VI Systems GmbH Hardenbergstrasse 7 D-10623 Berlin
December 2021