ESL1601-2110
Page 1 of 7

ESL1601-2110
SLED Butterfly 1600nm

Revision:

1.0

Date:

01-09-2011

Prepared by:

Raffaele Rezzonico(Product Support Technician)Checked by:

Chris Armistead(Engineering Manager)

Approved by:Philippe Crépellière(Quality Manager)

Authorized by:

Marcus Duelk(CTO)ESL1601-2110
Page 2 of 7

CONTENTS

1.

SCOPE..............................................................................................................3
1.1 PURPOSE ................................................................................................................ 3
1.2 RESPONSIBILITY .................................................................................................. 3

2.

REFERENCE DOCUMENT ..............................................................................3

3.

ELECTRO-OPTICAL PERFORMANCE (TSLED = 20°°C) ..................................34.

ABSOLUTE MAXIMUM RATINGS ...................................................................45.

SCREENING .....................................................................................................46.

PACKAGE DIMENSIONS [MM] .......................................................................57.

FIBRE AND CONNECTOR ...............................................................................58.

IMPORTANT NOTES ........................................................................................69.

ORDERING INFORMATION .............................................................................610.

REVISION HISTORY ........................................................................................7ESL1601-2110
Page 3 of 7
1. SCOPE
1.1 PURPOSEThe purpose of this document is to specify the electro-optical performance and dimensions ofsuperluminescent light emitting diode (SLED) Butterfly.
1.2 RESPONSIBILITYEXALOS is responsible for establishing, implementing and maintaining this procedure. The
Quality representative shall ensure that a timely Engineering Change Notice (ECN) is issued inaccordance with EXALOS procedure for any changes.

2. REFERENCE DOCUMENT•••

EXS-WI-0001 Visual Inspection Criteria SLED Chip on Submount Procedure
MIL STD 883 C method.
Bellcore GR-468-CORE.

3. ELECTRO-OPTICAL PERFORMANCE (TSLED = 20°°C)
Parameter
Operating Current
Power in SMF
Center Wavelength
Bandwith FWHM
Spectral ripple [RB=0.1nm]

SymbolIop
PoλcCond.
Iop,maxIop,maxIop,maxIop,max

Min
00.5
1580
80

Typ1
1600
90
0.1

Max
200
1620
0.2

Unit
mA
mW
nm
nm
dB

ESL1601-2110
Page 4 of 7

4. ABSOLUTE MAXIMUM RATINGS
Stresses beyond the absolute maximum ratings may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Parameter

SymbolCond.

Forward current

IFIF,max

Reverse voltage

VRForward voltage

VFStorage temperature
Operating temperature

Tstg

Storage humidity
Thermoelectric cooler voltage<30°C>30°C
Vtec

Thermoelectric cooler current

ItecThermistor Resistance

RthThermistor constantB

TopMinIF,max-40
IF,max

-20
520°C

Max

Unit

250

mA-2V

285

V°C

65°C

9585
2.5% r.h.
% r.h.
V

1.8

A

12.5KΩ

3892

K

Lead soldering temperature

260°C

Lead soldering duration

10s500

VESD

human b.m

5. SCREENING

The produced 1600nm SLED Module is required to meet all operating conditions specified in Table
3, Electro-Optical Performance Specifications after being subjected to the following screening tests.
Test Item
Seal
Temperature Cycling

Test Conditions
Fine: Condition A1
Gross: Condition C-40°C to +85°C,
ramp rate >= 5°C/min 10 cycles

Reference
MIL-STD-883, Method 1014
MIL-STD-883, Method 1010

ESL1601-2110
Page 5 of 7
3rd Angle
projection

6. PACKAGE DIMENSIONS [mm]Tolerances :.X ± 0.25 mm.XX ± 0.05 mm

30.020.8

7.7
5.50.25
1.5 1.0

12.0

2.55

+3.00
-2.00

ø 2.77 6 5 4 3 2 1

8.9

12.7

15.2

8 9 10 11 12 13 14

26.00.38
0.50

Top view

Pin1234567Ceramic Package
Glass Package

Function

Butterfly Package
Pin

TEC (+)
THERMISTOR
NC
NC
THERMISTOR
NC
NC

891011121314Function
NC
NC
SLED ANODE (+)
SLED CATHODE (-)
NC
NC
TEC (-)

7. FIBRE AND CONNECTOR
Part

Description

SM Fibre

SMF-28, 9/125 µm

Tight buffer secondary coating

900 µmFiber pigtail length [min]1mOptical connector

FC/APC Narrow Key (2.0mm)

ESL1601-2110
Page 6 of 7

8. IMPORTANT NOTES
1. Avoid electrostatic discharges, which may destroy the SLED.
2. Never use the bare die without heat sinking.
3. Adequate eye protection against laser radiation should be used while handling and operating themodule.
4. EXALOS declines any responsibility if the device is used in applications where human life may
be endangered.
5. Back reflections may influence the output power and spectral characteristics of the SLED. The
use of optical isolators and/or angled connectors is recommended. Back reflections of less than-30dB are recommended.

9. ORDERING INFORMATION
Please use the following code system to order products from EXALOS:

Standard product: The Standard product is ESL1601-2110.

ESL

160Wavelength12110Package Fiber Connector Option

Power & Bandwidth

CodeWavelength161600 nm

CodePower in SMF [mW]

Bandwidth [nm]Ripple [dB]01

≥ 0.5 mW

≥ 80 nm≤ 0.2 dB

CodePackage

CodeFiber

CodeConnector

CodeOption

2

Butterfly

1SM 9/125/900µm

1FC/APC

0No Option

ESL1601-2110
Page 7 of 7
10. REVISION HISTORY
Revision History
Rev.

Description

ECN Number

Date (ECN)

Released

1.0

Original version--

01.09.2011