Specification EXS8310-F411
Rev: 1.0

EXS8310-F411
High Power SLED830 nm
DIL Package

Revision:

1.0

Date:

09-09-2009

Confidentiality:

None

Prepared by:

Raffaele Rezzonico(Product Support Technician)Checked by:

Chris Armistead(Engineering Manager)

Approved by:Philippe Crépellière(Quality Manager)

Authorized by:

Marcus Duelk(CTO)

Page 1 of 7

Specification EXS8310-F411
Rev: 1.0

Page 2 of 7

CONTENTS
1.

SCOPE ...........................................................................................................3
1.1 PURPOSE .............................................................................................................. 3
1.2 RESPONSIBILITY ............................................................................................... 3

2.

REFERENCE DOCUMENT ............................................................................33.

ELECTRO-OPTICAL PERFORMANCE (TSLED = 25°°C) ................................34.

ABSOLUTE MAXIMUM RATINGS .................................................................4

5.

SCREENING ...................................................................................................46.

PACKAGE DIMENSIONS...............................................................................57.

FIBRE AND CONNECTOR.............................................................................58.

IMPORTANT NOTES .....................................................................................69.

ORDERING INFORMATION...........................................................................610.

REVISION HISTORY ......................................................................................7

Specification EXS8310-F411
Rev: 1.0

Page 3 of 7

1. SCOPE
1.1 PURPOSE
The purpose of this document is to specify the electro-optical performance and dimensions ofsuperluminescent light emitting diode (SLED) DIL.
1.2 RESPONSIBILITYEXALOS is responsible for establishing, implementing and maintaining this procedure. The
Quality representative shall ensure that a timely Engineering Change Notice (ECN) is issued inaccordance with EXALOS procedure for any changes.

2. REFERENCE DOCUMENT•••EXS-WI-0001 Visual Inspection Criteria SLED Chip on Submount Procedure
MIL STD 883 C method.
Bellcore GR-468-CORE.

3. ELECTRO-OPTICAL PERFORMANCE (TSLED = 25°°C)

Parameter
Operating Current
Power in SMF
Center Wavelength
Bandwidth FWHM
Spectral ripple [RB=0.1nm]
PD Monitor Current†
PD Monitor Bias Voltage†SymbolIFPoλcIm
VbCond.

Min

TypIF,maxIF,maxIF,maxIF,maxIF,max3800
225820250.1
30Max1408400.2-2Measurement conditions:- IF = IF Max- Monitor PD bias voltage: 0 Volts- Input resistance of the Monitor PD current measurement circuit <0.1 Ohm

UnitmAmW
nm
nmdBmAVSpecification EXS8310-F411
Rev: 1.0Page 4 of 7

4. ABSOLUTE MAXIMUM RATINGS
Stresses beyond the absolute maximum ratings may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ParameterSymbol

Reverse voltage

VR

Forward voltage

VF

Storage temperature
Operating temperature

Tstg

Storage humidity
Thermoelectric cooler voltage<30°C>30°C
Vtec

Thermoelectric cooler currentItecThermistor Resistance

RthThermistor constantBCond.

MinIF,max-40

TopIF,max25°C-205Max

Unit-2V

2.585

V°C

60°C

9585
2.5% r.h.
% r.h.
V

1.8

A

10KΩ

3892

K

Lead soldering temperature

260°C

Lead soldering duration

10s500

VESD

human b.m

5. SCREENING
The produced 830nm SLED Module is required to meet all operating conditions specified in Table
3, Electro-Optical Performance Specifications after being subjected to the following screening tests.
Test Item
Seal

Test Conditions
Fine: Condition A1
Gross: Condition CTemperature Cycling-40°C to +85°C,
ramp rate >= 5°C/min 10 cycles

Reference
MIL-STD-883, Method 1014
Temperature max 85°C
MIL-STD-883, Method 1010

Specification EXS8310-F411
Rev: 1.0

Page 5 of 7

3rd Angle
projection

6. PACKAGE DIMENSIONS
Dimensions [mm]Tolerances :.X ± 0.25 mm.XX ± 0.05 mm

21.8

19.1

7.1

9.1

6

6.4

6
2.54

7.6

ø 0.461418712.7

DIL Package

25.4

15.2
20.8

1.0

Top view
DIL Package (Floating)
Function
PinPinFunction

1TEC (+)

8MONITOR DIODE ANODE2NC9SLED CATHODE (-) (Note 1)

3NC

10CASE GROUND

4NC

11THERMISTOR

5SLED ANODE (+)

12THERMISTOR

6NC13NC

7MONITOR DIODE CATHODE (Note 1)

14TEC (-)- Note 1: Pin # 7 and Pin # 9 are short-circuited.
Attention: Prior to connecting the SLED module to the driver using constant power mode, makesure that your SLED driver supports the so-called ″Common laser cathode/photodiodecathode″″ arrangement and the connections are set accordingly. If this is not the case do not connect
the SLED, otherwise it may result in permanent damage to the SLED.

7. FIBRE AND CONNECTORPartDescription

SM Fibre

SM 5/125 (Corning PureMode HI-780-6)

Loose tube secondary coating

900 µmFiber pigtail length [min]1m

Optical connector

FC/APC Narrow Key (2.0mm)

Specification EXS8310-F411
Rev: 1.0Page 6 of 7

8. IMPORTANT NOTES
1. Avoid electrostatic discharges, which may destroy the SLED.
2. Never use the bare die without heat sinking.
3. Adequate eye protection against laser radiation should be used while handling and operating themodule.
4. EXALOS declines any responsibility if the device is used in applications where human life may
be endangered.
5. Back reflections may influence the output power and spectral characteristics of the SLED. The
use of optical isolators and/or angled connectors is recommended. Back reflections of less than-30dB are recommended.

9. ORDERING INFORMATION
Please use the following code system to order products from EXALOS:

EX

S

831

Wavelength

0F

411

Package Fiber Connector Option

Power & BandwidthCodeWavelength83830 nm

CodePower in SMF [mW]

Bandwidth [nm]Ripple [dB]10≥ 3 mW≥ 22 nm≤ 0.2 dB

CodePackage

CodeFiber

CodeConnector

CodeOption

FDil (Floating)4

SM 5/125/900 LT

1FC/APC

1Monitor Diode

Specification EXS8310-F411
Rev: 1.0

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10. REVISION HISTORY
Revision History
Rev.

Description

1.0

Original version

ECN Number

Date (ECN)

Released
09.09.2009