EXS210044-01
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EXS210044-01
EXS0650-006-10-0C00000
TO-8 Cooled Package 650nm

Revision:

1.0

Date:

03-05-2012

Confidentiality:

None

Prepared by:

Raffaele Rezzonico(Product Support Technician)Checked by:

Chris Armistead(Engineering Manager)

Approved by:Philippe Crépellière(Quality Manager)

Authorized by:

Marcus Duelk(CTO)

EXS210044-01
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CONTENTS
1.

SCOPE..............................................................................................................3

1.1

PURPOSE ....................................................................................................................... 3

1.2

RESPONSIBILITY ......................................................................................................... 3

2.

REFERENCE DOCUMENT ..............................................................................33.

ELECTRO-OPTICAL PERFORMANCE (TSLED = 25°°C) ..................................34.

SCREENING TESTS ........................................................................................45.

ABSOLUTE MAXIMUM RATINGS ...................................................................46.

PACKAGE DIMENSIONS [MM] .......................................................................56.1

PACKAGE DIMENSIONS WITHOUT CAP ................................................................ 56.2

PACKAGE DIMENSIONS WITH CAP ........................................................................ 5

6.3

PACKAGE PIN CONFIGURATION............................................................................. 6

6.4

PACKAGE ASSEMBLY TOLERANCES..................................................................... 76.5

SLED MOUNTING AXIS AND PACKAGE REFERENCE KEY ORIENTATION ... 76.6

SLED EMISSION ANGLE ............................................................................................ 76.7

SLED WINDOW POSITION ......................................................................................... 76.8

SLED CENTRATION .................................................................................................... 86.9

TOLERANCES ............................................................................................................... 87.

HEATSINKING / MOUNT REQUIREMENTS ....................................................88.

IMPORTANT NOTES ........................................................................................99.

ORDERING INFORMATION .............................................................................99.1

TECHNICAL DESCRIPTION ....................................................................................... 910.

REVISION HISTORY ......................................................................................10EXS210044-01
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1.

SCOPE

1.1

PURPOSEThe purpose of this document is to specify the electro-optical performance and dimensions ofsuperluminescent light emitting diode (SLED) TO-8 cooled package.

1.2

RESPONSIBILITYEXALOS is responsible for establishing, implementing and maintaining this procedure. The
Quality representative shall ensure that a timely Engineering Change Notice (ECN) is issued inaccordance with EXALOS procedure for any changes.

2.

REFERENCE DOCUMENT•••3.

EXS-WI-0001 Visual Inspection Criteria SLED Chip on Submount Procedure
MIL STD 883 C method.
Bellcore GR-468-CORE

ELECTRO-OPTICAL PERFORMANCE (TSLED = 25°°C)

Parameter
Operating Current
Power ex-Window
Centre Wavelength*
Bandwidth (3dB)
Vertical Far Field Angle
Horizontal Far Field Angle*SymbolIFPo
λ0∆λ3dBθ⊥θ||Min056304-Typ10650
64015Max120670-UnitmAmW
nm
nm
deg
deg

Spectral verification is performed by sampling at the manufacturing batch level. Manufacturing batches are defined byepitaxial wafer growth run.

EXS210044-01
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SCREENING TESTS••Module environmental temperature cycling: -40°C to +85°C, ramp rate >= 5°C/min 10cycles according to MIL-STD-883, Method 1010
Module seal:o Fine: condition A1,o Gross: Condition C according to MIL-STD-883, Method 1014

5.
ABSOLUTE MAXIMUM RATINGS
Stresses beyond the absolute maximum ratings may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Parameter

SymbolCond.

MinMaxUnit

Forward current

IF130mA

Reverse voltage

VR-2V

Forward voltage
Thermistor resistance
Thermistor constant
TEC Heat Pump Temperature
Difference†§
Thermoelectric cooler voltage

VFRthBIF,max
25°C

3VkΩ

∆TMAX

Top > TSLED,IF,max

30°C

Vtec

25°C

2.5

V

Thermoelectric cooler current

Itec25°C

Storage temperature
Operating temperature‡

Tstg

-40

1.585A°C-2065°C

260°C300

VTop

TSLED = 25°C,IF,max

Lead soldering temperature
ESD†‡human b.m103892

Heat pump capacity when module case (Top) is above the temperature of the chip (TSLED), i.e. TEC is cooling chip.

Measured at the case of the TO-CAN. Good heatsinking is essential to correct operation of the TO-CAN. See section
7, “HEATSINKING / MOUNT REQUIREMENTS”

EXS210044-01
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6.
6.1

PACKAGE DIMENSIONS [MM]
PACKAGE DIMENSIONS WITHOUT CAPTolerances:.X ± 0.25 mm unless stated
All Dimensions in mmTolerances:.X ± 0.25 mm unless stated
All Dimensions in mm

Package Top View (Window Side)

6.2

PACKAGE DIMENSIONS WITH CAP

Package Side View

EXS210044-01
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6.3

PACKAGE PIN CONFIGURATION

Package Top View (Window Side)

Pin
123Description
TEC CathodeThermistor
TEC Anode

456Thermistor
SLED AnodeNo Connection

789

No Connection
No Connection
No Connection

101112

SLED CathodeCase
No Connection

Package Back View (Pin Side)EXS210044-01
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6.4

PACKAGE ASSEMBLY TOLERANCES

6.5

SLED MOUNTING AXIS AND PACKAGE REFERENCE KEY ORIENTATION

Package Top View (Window Side)

6.6

SLED EMISSION ANGLE

Cross section through TO-CAN cap window.

6.7

SLED WINDOW POSITION

Cross section through TO-CAN cap window.

EXS210044-01
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6.8

SLED CENTRATION

Package Top View (Window Side)

6.9

TOLERANCES

Design Item

Design Conditions

DetailEmission orientation

Orientation between SLED mounting axis andpackage reference key

θparallel = 45° ± 1°

Emission angle

Angle between SLED chip facet and TO-CANwindowθfacet = 0° ± 5°

SLED facet to TO-CAN
window distanceDistance from SLED chip facet to TO-CAN
inside window

0.07 < dS-W < 0.85 mm
Typical 0.47 mm

SLED Centration

Offset distance of SLED emission spot fromTO-CAN axis

Dhoriz < 250µm
Dvert < 150µm

7.
HEATSINKING / MOUNT REQUIREMENTS
The specified performance of the module is only guaranteed when appropriate heatsinking isprovided for the package. The TO8 package assembly requires heat pumped out of the SLED chipby the TEC and generated by the TEC itself to be extracted and dissipated so that the TEC heatpump does not experience a ∆T value greater than the specification (section 5).
The module thermal power generated at maximum TEC power and SLED power is approximately 3Watts. The TO-CAN case must not rise above the maximum operating temperature defined in
section 5. A heatpump assembly or heatsink capable of removing the thermal power from the TOCAN base and stub is recommended. Good thermal contact between this heatsink and the TO-CAN
base/stub is essential.

EXS210044-01
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8.
IMPORTANT NOTES
1. Avoid electrostatic discharges, which may destroy the SLED.
2. Never use the TO-CAN die without heat sinking.
3. Adequate eye protection against laser radiation should be used while handling and operating themodule.
4. EXALOS declines any responsibility if the device is used in applications where human life may
be endangered.
5. Back reflections may influence the output power and spectral characteristics of the SLED. The
use of optical isolators and/or angled connectors is recommended. Back reflections of less than-30dB are recommended.

9.

ORDERING INFORMATION
Please use the following part number to order product from EXALOS:

E X S

9.1

E

21000

406041TECHNICAL DESCRIPTION

XS065

Wavelength00

Bandwidth10

Output power

0C

00000

PackageFiberConnector
MPDOption

EXS210044-01
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10. REVISION HISTORY
Revision History
Rev.

Description

ECN Number

Date (ECN)

Released

1.0

Original version--

03.05.2012