L-7113CGCK
T-1 3/4 (5mm) Solid State Lamp
DESCRIPTIONSPACKAGE DIMENSIONSThe Green source color devices are made withAlGaInP on GaAs substrate Light Emitting Diodez Electrostatic discharge and power surge could
damage the LEDsz It is recommended to use a wrist band oranti-electrostatic glove when handling the LEDsz All devices, equipments and machineries must be
electrically groundedzFEATURESthLow power consumption
Popular T-1 3/4 diameter package
z General purpose leadsz Reliable and ruggedz Long life - solid state reliabilityz Available on tape and reelz RoHS compliantzzginAPPLICATIONS

Status indicator
Illuminatorz Signage applicationsz Decorative and entertainment lightingz Commercial and residential architectural lightingzzATTENTION

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Observe precautions for handlingelectrostatic discharge sensitive devices

Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the leads emerge from the package.
4. The specifications, characteristics and technical data described in the datasheet are subject to changewithout prior notice.

SELECTION GUIDEPart Number

Emitting Color(Material)

Lens Type

L-7113CGCK■ Green (AlGalnP)

Water ClearIv (mcd) @ 20mA [2]Viewing Angle [1]

Min.

Typ.

2θ1/2

700

1400

20°

Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity / luminous flux: +/-15%.
3. Luminous intensity value is traceable to CIE127-2007 standards.

© 2017 Kingbright. All Rights Reserved. Spec No: DSAA9469 / 1101004970 Rev No: V.23B Date: 12/22/2017

Page 1 / 5L-7113CGCKELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C
Parameter

SymbolEmitting Color

Wavelength at Peak Emission IF = 20mA

λpeak

Dominant Wavelength IF = 20mA

Value

Unit

Typ.

Max.

Green

574-nmλdom [1]Green570-nm

Spectral Bandwidth at 50% Φ REL MAX
IF = 20mA

ΔλGreen20-nm

CapacitanceC

Green15-pF

Forward Voltage IF = 20mA

VF [2]

Green

2.1

2.5

V

Reverse Current (VR = 5V)

IRGreen-10uA

Temperature Coefficient of λpeak
IF = 20mA, -10°C ≤ T ≤ 85°CTemperature Coefficient of λdom
IF = 20mA, -10°C ≤ T ≤ 85°C
Temperature Coefficient of VF
IF = 20mA, -10°C ≤ T ≤ 85°Cthgirbgni
KTCλpeakGreen0.12-nm/°C

TCλdomGreen

0.07-nm/°C

TCVGreen-1.9-mV/°C

Notes:
1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. )2. Forward voltage: ±0.1V.
3. Wavelength value is traceable to CIE127-2007 standards.
4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.

ABSOLUTE MAXIMUM RATINGS at TA=25°C
Parameter

SymbolValue

UnitPD

75mW

Reverse Voltage

VR5V

Junction Temperature

Tj115°C

Operating TemperatureTop-40 to +85°C

Storage Temperature

Tstg-40 to +85°C

DC Forward Current

IF30mA

Peak Forward Current

IFM [1]150mA

Electrostatic Discharge Threshold (HBM)

-3000

V

Thermal Resistance (Junction / Ambient)

Rth JA [2]550°C/W

Thermal Resistance (Junction / Solder point)

Rth JS [2]345°C/W

Power Dissipation

Lead Solder Temperature [3]260°C For 3 Seconds

Lead Solder Temperature [4]260°C For 5 Seconds

Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. Rt h JA ,Rt h JS Results from mounting on PC board FR4 (pad size ≥ 16 mm 2 per pad).
3. 2mm below package base.
4. 5mm below package base.
5. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.

© 2017 Kingbright. All Rights Reserved. Spec No: DSAA9469 / 1101004970 Rev No: V.23B Date: 12/22/2017

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L-7113CGCKTECHNICAL DATASPATIAL DISTRIBUTION

RELATIVE INTENSITY vs. WAVELENGTH
GreenRelative Intensity (a. u.)

100%

Ta = 25 °C

Ta = 25 °C

80%

-15°

0°

15°
30°

-30°

45°

-45°

60%

60°

-60°

40%
20%

75°

-75°

0%
350

400

450

500
550
600
Wavelength (nm)

650

700

750

800

-90°
1.0

0.5

0.0

90°
1.00.5GREEN

Forward current (mA)

Ta = 25 °C
4030
20
10

1.7
1.9
2.1
2.3
Forward voltage (V)2.5Permissible forward current (mA)

Luminous intensity normalised at
20 mA

5001.5

Forward Current Derating Curve

Luminous Intensity vs.
Forward Current

Ta = 25 °C

2.0
1.5
1.00.02.5010203040
Forward current (mA)

50ni
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RECOMMENDED WAVE SOLDERING PROFILE

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0.5th

50

3020100-40 -20 0 20 40 60 80 100
Ambient temperature (°C)

Luminous Intensity vs.
Ambient Temperature

Luminous intensity normalised at
Ta = 25 °C

Forward Current vs.
Forward Voltage

2.5
2.0
1.5
1.0
0.5
0.0-40 -20 0 20 40 60 80 100
Ambient temperature (°C)

Notes:
1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple
attached to the LED pins) prior to immersion in the solder wave with a maximum solder bathtemperature of 260°C
2. Peak wave soldering temperature between 245°C ~ 255°C for 3 sec (5 sec max).
3. Do not apply stress to the epoxy resin while the temperature is above 85°C.
4. Fixtures should not incur stress on the component when mounting and during soldering process.
5. SAC 305 solder alloy is recommended.
6. No more than one wave soldering pass.

PACKING & LABEL SPECIFICATIONS© 2017 Kingbright. All Rights Reserved. Spec No: DSAA9469 / 1101004970 Rev No: V.23B Date: 12/22/2017

Page 3 / 5

L-7113CGCKPRECAUTIONSStorage conditions
1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambienttemperature.
2. LEDs should be stored with temperature ≤ 30°C and relative humidity < 60%.
3. Product in the original sealed package is recommended to be assembled within 72 hours of opening.
Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100°C.

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inLED Mounting Method

1. The lead pitch of the LED must match thepitch of the mounting holes on the PCB
during component placement.
Lead-forming may be required to insure
the lead pitch matches the hole pitch.
Refer to the figure below for proper lead
forming procedures.

KNote 1-3: Do not route PCB trace in the contact area between theleadframe and the PCB to prevent short-circuits.

" ○" Correct mounting method " x " Incorrect mounting method

2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact.
Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads. Pinching stress on the LED leads may damage theinternal structures and cause failure.

3. Use stand-offs (Fig.1) or spacers (Fig.2) to securely position the LED above the PCB.
4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first leadbend (Fig. 3 ,Fig. 4).
5. During lead forming, use tools or jigs to hold the leads securely so that the bending force
will not be transmitted to the LED lens and its internal structures. Do not perform lead
forming once the component has been mounted onto the PCB. (Fig. 5 )© 2017 Kingbright. All Rights Reserved. Spec No: DSAA9469 / 1101004970 Rev No: V.23B Date: 12/22/2017

Page 4 / 5

L-7113CGCK
Lead Forming Procedures
1. Do not bend the leads more than twice. (Fig. 6 )2. During soldering, component covers and holders should leave
clearance to avoid placing damaging stress on the LED duringsoldering. (Fig. 7)
3. The tip of the soldering iron should never touch the lens epoxy.
4. Through-hole LEDs are incompatible with reflow soldering.
5. If the LED will undergo multiple soldering passes or face otherprocesses where the part may be subjected to intense heat,please check with Kingbright for compatibility.

thgirbginK

PRECAUTIONARY NOTES

1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.
2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer tothe latest datasheet for the updated specifications.
3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If
customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.
4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening
liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.
5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.
6. All design applications should refer to Kingbright application notes available at http://www.kingbright.com/application_notes© 2017 Kingbright. All Rights Reserved. Spec No: DSAA9469 / 1101004970 Rev No: V.23B Date: 12/22/2017

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