Apalis HeatsinkDatasheet

Apalis Heatsink Datasheet

Revision History
DateDoc. Rev.

Heatsink Version

Changes

07-Nov-2014

Rev. 1.0

V1.0A

Initial release13-Nov-2013

Rev 1.1

V1.0A

Section 3, Compatibility: minor updates
Section 2, Technical specifications: updated details

25-Nov-2014

Rev 1.2

V1.0A

Section 4, Mechanical Dimensions: updated figure 1 (TIM padthickness, Type 1)
Section 5, Assembly: minor updates
Section 6, Product Compliance: added compliance details

04-April-2016

Rev 1.3

V1.0A

Section 3, Compatibility: updated compatible module list. Apalis
Heatsink Type 3 can be used with Apalis TK1 module

12-Jan-2017

Rev 1.4

V1.0A

Section 3, Compatibility: updated compatible module list. AddApalis iMX6D IT
Section 1.1, Reference Documents: Added reference documents
section07-July-2017

Rev 1.5

V1.0A
Section 2: Technical specification: Updated TIM Volume Resistivity
value, added TIM supplier contact details

20-Dec-2017

Rev 1.6

V1.0B

New product release V1.0B. New TIM details added to thedocument
Various small modifications.

26-Sept-2018

Rev 1.7

V1.0B

Section 1.1, Reference Documents: Added reference to compatible
Fans and Screws
Section 2, Technical Specification: Updated section headings

07-Nov-2018

Rev 1.8

V1.0A (Type-4)

Section 3, Compatibility: Updated compatible module list. Add
Apalis iMX8
Section 4, Mechanical Dimensions: Added Apalis Heatsink Type -4
dimensional diagram
Document: Updated section headings to include the Apalis
Heatsink Type4 V1.0B product version. Various cosmetic
improvements.
Section 1, Introduction: Updated compatible Fan reference

21-Jan-2021

Rev 1.9

V1.0B

Section 3, Compatibility: Updated compatible module list. Add
Apalis iMX8X
Section 4, Mechanical Dimensions: Updated Apalis Heatsink Type 4 mechanical drawing
Section 7, Storage Requirements: This section has been added tothe document
Section 4.2: Added general tolerances

6-Oct-2022

Rev 1.10

V1.0B

Section 5.1: Added details about screws maximum tightening
torqueChanged contact email address

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Apalis Heatsink Datasheet

Contents
1.

Introduction ........................................................................................................................................... 4
1.1. Reference Documents ......................................................................................................................... 4
1.1.1
Apalis Computer Modules............................................................................................................ 4
1.1.2
Toradex Developer Website - Apalis Carrier Boards............................................................... 4
1.1.3
Thermal Interface Material (TSP600) Datasheets ................................................................... 4
1.1.4
Compatible Fan: Apalis Heatsink Fan........................................................................................ 4
1.1.5
TIM Supplier Contact Details ...................................................................................................... 42.

Technical Specifications..................................................................................................................... 5
2.1.

Apalis Heatsink V1.0A (Type – 1/2/3) ................................................................................................ 5

2.2.

Apalis Heatsink V1.0B (Type – 1/2/3) and V1.0A/V1.0B (Type – 4) ............................................. 5

3.

Compatibility ......................................................................................................................................... 6

4.

Mechanical Dimensions ...................................................................................................................... 7

5.

4.1.

Heatsink Dimensions ............................................................................................................................ 7

4.2.

General Tolerances .............................................................................................................................. 8

Assembly ............................................................................................................................................... 9
5.1.

Assembly procedure ............................................................................................................................. 9

6.

Product Compliance .......................................................................................................................... 117.

Storage Requirements ...................................................................................................................... 12Toradex AG l Ebenaustrasse 10 l 6048 Horw l Switzerland l +41 41 500 48 00 l www.toradex.com l support@toradex.com

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Apalis Heatsink Datasheet

1. Introduction
The Apalis Heatsink is a complete thermal solution. It is mounted to the Apalis carrier board bymeans of 4 screws of M3 thread each. The screws can be mounted from the top. There are
additional threaded holes for attaching a fan to the carrier board, if required.

1.1. Reference Documents
For detailed technical information about suitable computer modules, please refer to the documents
listed below.

1.1.1

Apalis Computer Modules

An overview of the Apalis product family:
https://www.toradex.com/computer-on-modules/apalis-arm-family

1.1.2

Toradex Developer Website - Apalis Carrier Boards

http://developer.toradex.com/products/apalis-evaluation-board
http://developer.toradex.com/products/ixora-carrier-board

1.1.3

Thermal Interface Material (TSP600) Datasheets

The datasheets of Thermal Interface Material used on the Apalis Heatsink can be downloaded byusing the following links:
Apalis Heatsink V1.0A (Type – 1/2/3)
https://docs1.toradex.com/104905-apalis-Heatsink-thermal-interface-material-tsp600-g35datasheet.pdf
Apalis Heatsink V1.0B (Type – 1/2/3) and V1.0A/V1.0B (Type – 4)https://docs1.toradex.com/104906-apalis-Heatsink-thermal-interface-material-tsp600-z45datasheet.pdf

1.1.4

Compatible Fan: Apalis Heatsink Fan

https://developer1.toradex.com/products/accessories/add-on/apalis-heatsink-fan

1.1.5

TIM Supplier Contact Details

CTX Thermal Solutions GmbHLötscher Weg 104D-41334 Nettetal
Telefon: +49 2153 7374 -0
Telefax: +49 2153 7374 -10
E-Mail: info@ctx.eu
Website: www.ctx.eu

Toradex AG l Ebenaustrasse 10 l 6048 Horw l Switzerland l +41 41 500 48 00 l www.toradex.com l support@toradex.com

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Apalis Heatsink Datasheet

2. Technical Specifications
2.1. Apalis Heatsink V1.0A (Type – 1/2/3)
MaterialAluminum alloy AL6063-T5

CoatingBlack anodized

Thermal conductivity

190 to 221 W/(mK)Weight39 grams

TIM, Thermal conductivity

6.0 W/(mK)TIM, Flame Rating

UL 94V-0

TIM, Volume Resistivity

6.510 Ohm-meter

TIM, Dielectric Constant

26.7 @ 1000 Hz

TIM, Dielectric Breakdown Voltage>1500~>5500 V(AC)TIM, Continuous Use Temperature-40°C to +200°C

TIM, Density

3.7 g/cc

TIM, Tensile strength

28 PSI

TIM, Hardness Bulk Rubber

30~55 (Shore C)

Thermal resistance (Module-Alu)

TBD

Thermal resistance (Alu-Ambient without fan)

<5.90 °C/W

Thermal resistance (Alu-Ambient with fan)

<2.90 °C/W

Remarks

Temperature Range: 40°C to 100°C

Thermal Interface Material (TSP600-G35)

Please note that the temperature of themodule is measured by the on-module
thermal sensor.

Test fan details:
Dimensions: 40mmX40mmX10mm(LxWxH)
Speed: 4000 RPM
Air Flow: 4.81 CFM

2.2. Apalis Heatsink V1.0B (Type – 1/2/3) and V1.0A/V1.0B (Type – 4)
Material

Aluminum alloy AL6063-T5

Coating

Black anodized

Thermal conductivity

190 to 221 W/(mK)Weight39 grams

TIM, Thermal conductivity

6.0 W/(mK)TIM, Flame Rating

UL 94V-0

TIM, Volume Resistivity

1014 Ohm-meter

TIM, Dielectric Constant

4.84 @ 1000 Hz

TIM, Dielectric Breakdown Voltage

7.5 (KV/AC)

TIM, Continuous Use Temperature-40°C to +200°C

TIM, Density

3.3±0. 2 g/cc

TIM, Tensile strength29.526 PSI

TIM, Hardness Bulk Rubber

45 (Shore C)

Thermal resistance (Module-Alu)

TBD

Thermal resistance (Alu-Ambient without fan)

<5.90 °C/W

Thermal resistance (Alu-Ambient with fan)

<2.90 °C/W

Remarks

Temperature Range: 40°C to 100°C

Thermal Interface Material (TSP600-Z45)

Please note that the temperature of themodule is measured by the on-module
thermal sensor.

Test fan details:
Dimensions: 40mmX40mmX10mm(LxWxH)
Speed: 4000 RPM
Air Flow: 4.81 CFM

Toradex AG l Ebenaustrasse 10 l 6048 Horw l Switzerland l +41 41 500 48 00 l www.toradex.com l support@toradex.com

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Apalis Heatsink Datasheet

3. Compatibility
There are multiple types of Apalis Heatsinks. Each type of Apalis Heatsink is compatible withspecific Apalis modules.
The following table shows the compatibility of the Apalis Heatsinks and the Apalis modules:
Apalis Module

Compatible Apalis Heatsink

Apalis iMX6Q IT and Apalis iMX6D IT

23051000 Apalis Heatsink Type 1 V1.0A
23051001 Apalis Heatsink Type 1 V1.0B

Apalis T30

23061000 Apalis Heatsink Type 2 V1.0A
23061001 Apalis Heatsink Type 2 V1.0B

Apalis iMX6Q, Apalis iMX6D and Apalis TK1

23071000 Apalis Heatsink Type 3 V1.0A
23071001 Apalis Heatsink Type 3 V1.0B

Apalis iMX8

2308100 Apalis Heatsink Type 4 V1.0A

Apalis iMX8, Apalis iMX8X

2308101 Apalis Heatsink Type 4 V1.0B

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Apalis Heatsink Datasheet

4. Mechanical Dimensions
The following drawings illustrate the mechanical dimensions of the Apalis Heatsink.
All measurements are in millimeters (mm).

4.1. Heatsink Dimensions

Figure 1-A: Apalis Heatsink Dimensions (Type-1/2/3)

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Apalis Heatsink Datasheet

Figure 1-B: Apalis Heatsink Dimensions (Type-4)

4.2. General Tolerances
When not explicitly specified, the following tolerances apply to the product:
Dimensions

Tolerance

Over 1000±1.20

400~1000±0.80

120~400±0.50

30~120±0.30

6~30±0.20

0.5~6±0.10

ANGLES

0.5°

R or C angle is less than 0.5° if not indicated.

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Apalis Heatsink Datasheet

5. Assembly
Assembly must be done very carefully since putting the Apalis Heatsink in a wrong orientation will
damage the Apalis module or prevent the system from working correctly. The illustration shown
below represents how to attach the heatsink solution.

M3 Screw X 4

Apalis Heatsink

Figure 2: Apalis Heatsink assembly

5.1. Assembly procedure
The following procedure demonstrates how to attach the Apalis Heatsink to the Apalis module tocomplete the heatsink solution. Please read the instructions and follow the procedure very carefully
to ensure that the module does not get damaged. Necessary precautions should be taken to avoid
the build-up of electrostatic charges.
1. Clean the processor’s top surface using an anti-static cloth.
2. Insert the Apalis module in the MXM socket X1 on the Apalis carrier board.
3. Carefully remove the plastic foil from the TIM.

Figure 3: Remove plastic foil from the TIM

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Page | 9Apalis Heatsink Datasheet
4. Carefully align the mounting holes {1}, {2}, {3}, and {4} on the Apalis Heatsink to be inline with fasteners available on the Apalis carrier board. Place the Apalis Heatsink on thesystem.

1243

Figure 4: Align Apalis Heatsink screw holes with the fasteners
5. Use four units of M3-sized screws to affix the Apalis Heatsink to the system. The maximum
tightening torque specified by the spacers mounted on the Apalis carrier boards is 0.2 Nm.

1243

6.
Figure 5: Affix Apalis Heatsink with the system using M3 sized screws
7. Done. The system is now ready for use.
8. For application, which results in the prolonged overheating of the processor, either due toenvironmental conditions (like higher ambient temperature) or due to very highcomputational power; the DC fan can be mounted on the Apalis' top Heatsink using 2.5m
screws (4 units).
For the majority of the end applications, an additional heatsink fan will not be required.

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Page | 10Apalis Heatsink Datasheet

6. Product Compliance
Up-to-date information about product compliance such as RoHS, CE, UL-94, Conflict Mineral,REACH, etc. can be found on our website at http://www.toradex.com/support/product-compliance

Toradex AG l Ebenaustrasse 10 l 6048 Horw l Switzerland l +41 41 500 48 00 l www.toradex.com l support@toradex.com

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Apalis Heatsink Datasheet

7. Storage Requirements
Shelf life is the period of time that a product is expected to remain within its approved productspecification while stored under defined conditions.
The most significant factor limiting the Apalis Heatsink's shelf life is the mylar film used to protect
the TIM when the product is not assembled on the computer module.
The following table shows the storage requirements and the shelf life of the Apalis Heatsink.
Short periods during which the product is subjected to slightly off-specification environmental
conditions will not significantly impact shelf life.
Storage Measures

Ambient Atmosphere

Storage Temperature

Storage Relative Humidity

Maximum Storage TimeOriginal packing

Air

20°C to 30°C

40% to 60%

24 months

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Apalis Heatsink Datasheet

DISCLAIMER:
Copyright © Toradex AG. All rights are reserved. The information and content in this document areprovided “as-is” with no warranties of any kind and are for informational purposes only. Data andinformation have been carefully checked and are believed to be accurate; however, no liability orresponsibility for any errors, omissions or inaccuracies is assumed.
Brand and product names are trademarks or registered trademarks of their respective owners.
Specifications are subject to change without notice.

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