MCP2551
High-Speed CAN Transceiver
Package Types• Supports 1 Mb/s operation• Implements ISO-11898 standard physical layer
requirements• Suitable for 12V and 24V systems• Externally-controlled slope for reduced RFI
emissions• Detection of ground fault (permanent Dominant)on TXD input• Power-on Reset and voltage brown-out protection• An unpowered node or brown-out event will not
disturb the CAN bus• Low current standby operation• Protection against damage due to short-circuit
conditions (positive or negative battery voltage)• Protection against high-voltage transients• Automatic thermal shutdown protection• Up to 112 nodes can be connected• High-noise immunity due to differential bus
implementation• Temperature ranges:- Industrial (I): -40°C to +85°C- Extended (E): -40°C to +125°C

PDIP/SOIC
TXD

1

VSS

2

VDD

3

RXD

4

MCP2551

Features

8

RS

7

CANH

6

CANL

5

VREF

Block Diagram
VDD
TXD
Dominant
Detect

VDD

DriverControl

TXD

RS

Slope
ControlPower-On
Reset

RXD
VREF

ThermalShutdown

CANH
0.5 VDD
GND

Reference
Voltage

CANL

ReceiverVSS© 2010 Microchip Technology Inc.

DS21667F-page 1

MCP2551
NOTES:

DS21667F-page 2© 2010 Microchip Technology Inc.

MCP2551
1.0

DEVICE OVERVIEW

1.4

Operating Modes

The MCP2551 is a high-speed CAN, fault-tolerant
device that serves as the interface between a CAN
protocol controller and the physical bus. The MCP2551
device provides differential transmit and receive
capability for the CAN protocol controller, and is fullycompatible with the ISO-11898 standard, including 24V
requirements. It will operate at speeds of up to 1 Mb/s.

The RS pin allows three modes of operation to be
selected:

Typically, each node in a CAN system must have a
device to convert the digital signals generated by a
CAN controller to signals suitable for transmission overthe bus cabling (differential output). It also provides abuffer between the CAN controller and the high-voltage
spikes that can be generated on the CAN bus byoutside sources (EMI, ESD, electrical transients, etc.).

When in High-Speed or Slope-Control mode, thedrivers for the CANH and CANL signals are internallyregulated to provide controlled symmetry in order tominimize EMI emissions.

1.1

Transmitter Function

The CAN bus has two states: Dominant andRecessive. A Dominant state occurs when the
differential voltage between CANH and CANL isgreater than a defined voltage (e.g.,1.2V). A Recessive
state occurs when the differential voltage is less than adefined voltage (typically 0V). The Dominant andRecessive states correspond to the Low and High stateof the TXD input pin, respectively. However, aDominant state initiated by another CAN node will
override a Recessive state on the CAN bus.

1.1.1

MAXIMUM NUMBER OF NODESThe MCP2551 CAN outputs will drive a minimum loadof 45Ω, allowing a maximum of 112 nodes to beconnected (given a minimum differential input
resistance of 20 kΩ and a nominal termination resistor
value of 120Ω).

1.2

Receiver Function

The RXD output pin reflects the differential bus voltage
between CANH and CANL. The Low and High states of
the RXD output pin correspond to the Dominant andRecessive states of the CAN bus, respectively.

1.3

Internal Protection

CANH and CANL are protected against battery shortcircuits and electrical transients that can occur on the
CAN bus. This feature prevents destruction of thetransmitter output stage during such a fault condition.

• High-Speed• Slope-Control• Standby
These modes are summarized in Table 1-1.

Additionally, the slope of the signal transitions on
CANH and CANL can be controlled with a resistor
connected from pin 8 (RS) to ground. The slope must
be proportional to the current output at RS, which willfurther reduce EMI emissions.

1.4.1

HIGH-SPEED

High-Speed mode is selected by connecting the RS pin
to VSS. In this mode, the transmitter output drivers havefast output rise and fall times to support high-speed
CAN bus rates.

1.4.2

SLOPE-CONTROL

Slope-Control mode further reduces EMI by limiting therise and fall times of CANH and CANL. The slope, or
slew rate (SR), is controlled by connecting an external
resistor (REXT) between RS and VOL (usually ground).
The slope is proportional to the current output at the RS
pin. Since the current is primarily determined by theslope-control resistance value REXT, a certain slew rateis achieved by applying a specific resistance.
Figure 1-1 illustrates typical slew rate values as afunction of the slope-control resistance value.

1.4.3

STANDBY MODE

The device may be placed in Standby or SLEEP mode
by applying a high-level to the RS pin. In SLEEP mode,
the transmitter is switched off and the receiver operates
at a lower current. The receive pin on the controller side(RXD) is still functional, but will operate at a slower
rate. The attached microcontroller can monitor RXD for
CAN bus activity and place the transceiver into normal
operation via the RS pin (at higher bus rates, the first
CAN message may be lost).

The device is further protected from excessive current
loading by thermal shutdown circuitry that disables theoutput drivers when the junction temperature exceeds
a nominal limit of 165°C. All other parts of the chip
remain operational, and the chip temperature is lowered due to the decreased power dissipation in thetransmitter outputs. This protection is essential toprotect against bus line short-circuit-induced damage.

© 2010 Microchip Technology Inc.

DS21667F-page 3

MCP2551
TABLE 1-1:

MODES OF OPERATION

Mode

Current at Rs Pin

StandbySlope-Control
High-Speed

Resulting Voltage at RS Pin-IRS < 10 µA
10 µA < -IRS < 200 µA-IRS < 610 µA

TABLE 1-2:

VRS > 0.75 VDD
0.4 VDD < VRS < 0.6 VDD
0 < VRS < 0.3VDD

TRANSCEIVER TRUTH TABLE

VDD

VRS

TXD

CANH

Bus State( 1)

CANL

HIGH
LOW
Dominant
Not Driven
Not Driven
Recessive
Not Driven
Not Driven
Recessive
VRS > 0.75 VDD
HIGH
LOW
Dominant
VRS < 0.75 VDD
VPOR < VDD < 4.5V
Not Driven
Not Driven
Recessive(See Note 3)
Not Driven
Not Driven
Recessive
VRS > 0.75 VDD
Not Driven/
Not Driven/
0 < VDD < VPORXXHigh Impedance
No LoadNo LoadNote 1: If another bus node is transmitting a Dominant bit on the CAN bus, then RXD is a logic ‘0’.
2: X = “don’t care”.
3: Device drivers will function, although outputs are not ensured to meet the ISO-11898 specification.
VRS < 0.75 VDD

4.5V ≤ VDD ≤ 5.5V

FIGURE 1-1:

0
1 or floatingX
0
1 or floating
X

RXD( 1)
0
1
1
0
1
1
X

SLEW RATE VS. SLOPE-CONTROL RESISTANCE VALUE

25

Slew Rate V/μs

20
15
10
5
0
10

20

30

40

49

60

70

76

90 100 110 120

Resistance (k)DS21667F-page 4© 2010 Microchip Technology Inc.

MCP2551
1.5

TXD Permanent Dominant
Detection

If the MCP2551 detects an extended Low state on the
TXD input, it will disable the CANH and CANL output
drivers in order to prevent the corruption of data on the
CAN bus. The drivers are disabled if TXD is Low for
more than 1.25 ms (minimum). This implies amaximum bit time of 62.5 µs (16 kb/s bus rate),allowing up to 20 consecutive transmitted Dominant
bits during a multiple bit error and error frame scenario.
The drivers remain disabled as long as TXD remains
Low. A rising edge on TXD will reset the timer logic andenable the CANH and CANL output drivers.

1.6

When the device is powered on, CANH and CANL
remain in a high-impedance state until VDD reaches thevoltage-level VPORH. In addition, CANH and CANL willremain in a high-impedance state if TXD is Low when
VDD reaches VPORH. CANH and CANL will become
active only after TXD is asserted High. Once powered
on, CANH and CANL will enter a high-impedance state
if the voltage level at VDD falls below VPORL, providing
voltage brown-out protection during normal operation.

1.7.2

GROUND SUPPLY (VSS)

Ground supply pin.

SUPPLY VOLTAGE (VDD)

Positive supply voltage pin.

1.7.4

RECEIVER DATA OUTPUT (RXD)

RXD is a CMOS-compatible output that drives High or
Low depending on the differential signals on the CANH
and CANL pins and is usually connected to the receiverdata input of the CAN controller device. RXD is Highwhen the CAN bus is Recessive and Low in the
Dominant state.

1.7.5

Pin Descriptions

TRANSMITTER DATA INPUT (TXD)

TXD is a TTL-compatible input pin. The data on this pin
is driven out on the CANH and CANL differential output
pins. It is usually connected to the transmitter data
output of the CAN controller device. When TXD is Low,
CANH and CANL are in the Dominant state. When TXD
is High, CANH and CANL are in the Recessive state,provided that another CAN node is not driving the CAN
bus with a Dominant state. TXD has an internal pull-up
resistor (nominal 25 kΩ to VDD).

1.7.3

Power-on Reset

1.7

1.7.1

REFERENCE VOLTAGE (VREF)

Reference Voltage Output (defined as VDD/2).

The 8-pin pinout is listed in Table 1-3.

1.7.6
TABLE 1-3:

MCP2551 PINOUTCAN LOW (CANL)The CANL output drives the Low side of the CAN
differential bus. This pin is also tied internally to thereceive input comparator.

Pin
Number

Pin
Name

1

TXD

Transmit Data Input

1.7.7

2

VSS

Ground3

VDD

Supply Voltage

4

RXD

Receive Data Output

The CANH output drives the high-side of the CAN
differential bus. This pin is also tied internally to thereceive input comparator.

5

VREF

Reference Output Voltage

1.7.8

6

CANL

CAN Low-Level Voltage I/O

7

CANH

CAN High-Level Voltage I/O

The RS pin is used to select High-Speed, Slope-Control
or Standby modes via an external biasing resistor.

8

RS

Pin Function

CAN HIGH (CANH)SLOPE RESISTOR INPUT (RS)

Slope-Control Input© 2010 Microchip Technology Inc.

DS21667F-page 5

MCP2551
NOTES:

DS21667F-page 6© 2010 Microchip Technology Inc.

MCP2551
2.0

ELECTRICAL
CHARACTERISTICS

2.1

Terms and Definitions

A number of terms are defined in ISO-11898 that areused to describe the electrical characteristics of a CAN
transceiver device. These terms and definitions are
summarized in this section.

2.1.1

BUS VOLTAGEVCANL and VCANH denote the voltages of the bus line
wires CANL and CANH relative to ground of eachindividual CAN node.

2.1.2

COMMON MODE BUS VOLTAGE
RANGE

Boundary voltage levels of VCANL and VCANH withrespect to ground, for which proper operation will occur,
if up to the maximum number of CAN nodes areconnected to the bus.

2.1.3

2.1.5

DIFFERENTIAL VOLTAGE, VDIFF(OF CAN BUS)

Differential voltage of the two-wire CAN bus, value
VDIFF = VCANH - VCANL.

2.1.6

INTERNAL CAPACITANCE, CIN(OF A CAN NODE)

Capacitance seen between CANL (or CANH) andground during the Recessive state when the CAN node
is disconnected from the bus (see Figure 2-1).

2.1.7

INTERNAL RESISTANCE, RIN(OF A CAN NODE)

Resistance seen between CANL (or CANH) andground during the Recessive state when the CAN node
is disconnected from the bus (see Figure 2-1).

FIGURE 2-1:

PHYSICAL LAYER
DEFINITIONSECUDIFFERENTIAL INTERNALCAPACITANCE, CDIFF(OF A CAN NODE)

RIN

Capacitance seen between CANL and CANH during
the Recessive state when the CAN node is
disconnected from the bus (see Figure 2-1).

RIN

CANL

CANH
CIN

2.1.4

DIFFERENTIAL INTERNALRESISTANCE, RDIFF(OF A CAN NODE)

CDIFF

RDIFF
CIN

GROUND

Resistance seen between CANL and CANH during theRecessive state when the CAN node is disconnectedfrom the bus (see Figure 2-1).

© 2010 Microchip Technology Inc.

DS21667F-page 7

MCP2551
Absolute Maximum Ratings†
VDD .............................................................................................................................................................................7.0V
DC Voltage at TXD, RXD, VREF and VS ............................................................................................ -0.3V to VDD + 0.3V
DC Voltage at CANH, CANL (Note 1) .......................................................................................................... -42V to +42V
Transient Voltage on Pins 6 and 7 (Note 2) ............................................................................................. -250V to +250V
Storage temperature ...............................................................................................................................-55°C to +150°C
Operating ambient temperature ..............................................................................................................-40°C to +125°C
Virtual Junction Temperature, TVJ (Note 3).............................................................................................-40°C to +150°C
Soldering temperature of leads (10 seconds) .......................................................................................................+300°C
ESD protection on CANH and CANL pins (Note 4) ...................................................................................................6 kV
ESD protection on all other pins (Note 4) ..................................................................................................................4 kV
Note 1: Short-circuit applied when TXD is High and Low.
2: In accordance with ISO-7637.
3: In accordance with IEC 60747-1.
4: Classification A: Human Body Model.
† NOTICE: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. Thisis a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.

DS21667F-page 8© 2010 Microchip Technology Inc.

MCP2551
2.2

DC Characteristics
Electrical Characteristics:
Industrial (I): TAMB = -40°C to +85°C VDD = 4.5V to 5.5V
Extended (E): TAMB = -40°C to +125°C VDD = 4.5V to 5.5V

DC Specifications
Param
No.

Sym

Characteristic

Min

Max

Units

Conditions

D1

—

75

mA

Dominant; VTXD = 0.8V; VDD

D2

—

10

mA

Recessive; VTXD = +2V;
RS = 47 kW

—

365

µA

-40°C ≤ TAMB ≤ +85°C, Standby;(Note 2)

—

465

µA

-40°C ≤ TAMB ≤ +125°C,
Standby; (Note 2)

SupplyIDD

Supply Current

D3

D4

VPORH

High-level of the Power-on
Reset comparator

3.8

4.3

V

CANH, CANL outputs are active
when VDD > VPORH

D5

VPORL

Low-level of the Power-on
Reset comparator

3.4

4.0

V

CANH, CANL outputs are notactive when VDD < VPORL

D6

VPORD

Hysteresis of Power-on
Reset comparator

0.3

0.8

V

Note 1

2.0

3.0

V

VTXD = VDD; no load.

-2

+2

mA

-2V < V(CAHL,CANH) < +7V,
0V <VDD < 5.5V

-10

+10

mA

-5V < V(CANL,CANH) < +40V,
0V <VDD < 5.5V

Bus Line (CANH; CANL) Transmitter
D7
D8
D9

VCANH(r);VCANL(r)CANH, CANL Recessivebus voltage

IO(CANH)(reces)
Recessive output current
IO(CANL)(reces)

D10

VO(CANH)CANH Dominant
output voltage

2.75

4.5

V

VTXD = 0.8V

D11

VO(CANL)CANL Dominant
output voltage

0.5

2.25

V

VTXD = 0.8V

D12

VDIFF(r)(o)Recessive differential
output voltage

-500

+50

mV

VTXD = 2V; no load

D13

VDIFF(d)(o)Dominant differential
output voltage

1.5

3.0

V

VTXD = 0.8V; VDD = 5V
40W < RL < 60W (Note 2)

CANH short-circuit
output current

—

-200

mA

VCANH = -5V

IO(SC)(CANH)—-100(typical)mA

VCANH = -40V, +40V. (Note 1)

IO(SC)(CANL)lCANL short-circuit
output current

—

200

mA

VCANL = -40V, +40V. (Note 1)

-1.0

+0.5

V

VDIFF(r)(i)Recessive differential
input voltage-2V < V(CANL, CANH) < +7V(Note 3)

-1.0

+0.4

V

-12V < V(CANL, CANH) < +12V
(Note 3)

D14
D15
D16

D17

Note 1:
2:
3:This parameter is periodically sampled and not 100% tested.
ITXD = IRXD = IVREF = 0 mA; 0V < VCANL < VDD; 0V < VCANH < VDD; VRS = VDD.
This is valid for the receiver in all modes; High-speed, Slope-control and Standby.

© 2010 Microchip Technology Inc.

DS21667F-page 9

MCP2551
2.2

DC Characteristics (Continued)
Electrical Characteristics:
Industrial (I): TAMB = -40°C to +85°C VDD = 4.5V to 5.5V
Extended (E): TAMB = -40°C to +125°C VDD = 4.5V to 5.5V

DC Specifications (Continued)
Param
No.

Sym

Characteristic

Min

Max

Units

Conditions

Bus Line (CANH; CANL) Receiver: [TXD = 2V; pins 6 and 7 externally driven]

D18

D19

VDIFF(d)(i)Dominant differential
input voltage

0.9

5.0

V

-2V < V(CANL, CANH) < +7V(Note 3)

1.0

5.0

V

-12V < V(CANL, CANH) < +12V
(Note 3)See Figure 2-3 (Note 1)

VDIFF(h)(i)Differential input hysteresis

100

200

mV

D20

RIN

CANH, CANL Commonmode input resistance

5

50

kW

D21

RIN(d)

Deviation between CANH
and CANL Common-mode
input resistance

-3

+3

%

VCANH = VCANLBus Line (CANH; CANL) Receiver: [TXD = 2V; pins 6 and 7 externally driven]
D22
D24

RDIFF

Differential input resistance

20

100

kW

ILI

CANH, CANL input leakage
current

—

150

µA

VDD < VPOR;VCANH = VCANL = +5V

V

Output Recessive

Transmitter Data Input (TXD)
D25

VIH

High-level input voltage

2.0

VDD

D26

VIL

Low-level input voltage

VSS

+0.8

V

Output Dominant

D27

IIH

High-level input current

-1

+1

µA

VTXD = VDD

D28

IIL

Low-level input current

-100

-400

µA

VTXD = 0V—

V

IOH = 8 mA

0.8V

IOL = 8 mAV

-50 µA < IVREF < 50 µA

Receiver Data Output (RXD)
D31

VOH

High-level output voltage

D32

VOL

Low-level output voltage

0.7 VD
D—

Voltage Reference Output (VREF)
D33

VREF

Reference output voltage

0.45 V 0.55 VD
DD

DStandby/Slope-Control (RS pin)
D34

VSTB

Input voltage for standby
mode

D35

ISLOPE

Slope-control mode current

D36

VSLOPE

Slope-control mode voltage

0.75 VDD-10
0.4 VD
D

—

V

-200

µA

0.6 VDD

V

Thermal Shutdown
D37

TJ(sd)

Shutdown junction
temperature

155

180

o

C

Note 1

D38

TJ(h)Shutdown temperaturehysteresis

20

30

o

-12V < V(CANL, CANH) < +12V
(Note 3)Note 1:
2:
3:

CThis parameter is periodically sampled and not 100% tested.
ITXD = IRXD = IVREF = 0 mA; 0V < VCANL < VDD; 0V < VCANH < VDD; VRS = VDD.
This is valid for the receiver in all modes; High-speed, Slope-control and Standby.

DS21667F-page 10© 2010 Microchip Technology Inc.

MCP2551
FIGURE 2-1:

TEST CIRCUIT FOR ELECTRICAL CHARACTERISTICS
0.1µF

VDD
CANH

TXD
VREF

CAN
Transceiver60 Ω

100 pF

RXD
CANL

30 pF

RS

GND

Rext

Note:

FIGURE 2-2:

RS may be connected to VDD or GND via a load resistor depending on desired
operating mode as described in Section 1.7.3 “Supply Voltage (VDD)”.

TEST CIRCUIT FOR AUTOMOTIVE TRANSIENTS
CANH

TXD
VREF

CAN
Transceiver

500 pF60Ω

Schaffner
Generator

RXD
CANL

500 pF

RS

GND

Note:

Rext

RS may be connected to VDD or
GND via a load resistor depending
on desired operating mode as
described in Section 1.7.8 “Slope
Resistor Input (Rs)”.

The wave forms of the applied transients shall be in accordance with “ISO-7637, Part 1”, test pulses 1, 2, 3a and 3b.

FIGURE 2-3:

HYSTERESIS OF THE RECEIVER

RXD (receive data
output voltage)

VOH
VDIFF (r)(i)

VDIFF (d)(i)VOLhysteresis
D19

0.5

0.9
VDIFF (V)© 2010 Microchip Technology Inc.

DS21667F-page 11

MCP2551
2.3

AC Characteristics
Electrical Characteristics:
Industrial (I): TAMB = -40°C to +85°C VDD = 4.5V to 5.5V
Extended (E): TAMB = -40°C to +125°C VDD = 4.5V to 5.5V

AC Specifications
Param
No.

Sym

1

tBIT

2

fBIT

3

TtxL2bus(d)

4

5

6

TtxH2bus(r)TtxL2rx(d)TtxH2rx(r)Characteristic

Min

Max

Units

Bit time

1

62.5

µs

VRS = 0V

Bit frequency

16

1000

kHz

VRS = 0V

Delay TXD to bus active

—

70

ns

-40°C ≤ TAMB ≤ +125°C,
VRS = 0V

—

125

ns

-40°C ≤ TAMB ≤ +85°C,
VRS = 0V

—

170

ns

-40°C ≤ TAMB ≤ +125°C,
VRS = 0V

—

130

ns

-40°C ≤ TAMB ≤ +125°C,
VRS = 0V

—

250

ns

-40°C ≤ TAMB ≤ +125°C,
RS = 47 kΩ

—

175

ns

-40°C ≤ TAMB ≤ +85°C,
VRS = 0V

—

225

ns

-40°C ≤ TAMB ≤ +85°C,
RS = 47 kΩ

—

235

ns

-40°C ≤ TAMB ≤ +125°C,
VRS = 0V

—

400

ns

-40°C ≤ TAMB ≤ +125°C,
RS = 47 kΩ

Delay TXD to bus inactive

Delay TXD to receive active

Delay TXD to receiverinactive

Conditions

7

SR

CANH, CANL slew rate

5.5

8.5

V/µs

Refer to Figure 2-1;
RS = 47 kΩ, (Note 1)

10

tWAKE

Wake-up time from standby(Rs pin)—5µs

See Figure 2-5

11

TbusD2rx(s)Bus Dominant to RXD Low(Standby mode)

—

550

ns

VRS = +4V; (See Figure 2-6)

12

CIN(CANH)
CIN(CANL)CANH; CANL input
capacitance—20(typical)pF

1 Mb/s data rate;
VTXD = VDD, (Note 1)

13

CDIFF

Differential input
capacitance—10(typical)pF

1 Mb/s data rate
(Note 1)

14

TtxL2busZ

TX Permanent Dominant
Timer Disable Time

1.25

4

ms

15

TtxR2pdt(res)

TX Permanent Dominant
Timer Reset Time

—

1

µs

Rising edge on TXD whiledevice is in permanent
Dominant state

Note 1: This parameter is periodically sampled and not 100% tested.

DS21667F-page 12© 2010 Microchip Technology Inc.

MCP2551
2.4

Timing Diagrams and Specifications

FIGURE 2-4:

TIMING DIAGRAM FOR AC CHARACTERISTICS

VDD

TXD (transmit data
input voltage)

0V
VDIFF (CANH,CANL differential
voltage)
RXD (receive data
output voltage)

0.5V

0.9V

0.7 VDD

0.3 VDD

3

4

5

6

FIGURE 2-5:

TIMING DIAGRAM FOR WAKE-UP FROM STANDBYVRS Slope resistor
input voltage

VDD
0.6 VDD
0V

VRXD Receive data
output voltage
0.3 VDD

10
VTXD = 0.8V

FIGURE 2-6:

TIMING DIAGRAM FOR BUS DOMINANT TO RXD LOW (STANDBY MODE)
1.5V

VDIFF, Differential
voltage

0.9V
0V

Receive data
output voltage
0.3 VDD

11
VRS = 4V; VTXD = 2V

© 2010 Microchip Technology Inc.

DS21667F-page 13

MCP2551
NOTES:

DS21667F-page 14© 2010 Microchip Technology Inc.

MCP2551
3.0

PACKAGING INFORMATION

3.1

Package Marking Information
8-Lead PDIP (300 mil)
XXXXXXXXXXXXXNNNYYWW

MCP2551
3
I/P e^^2561019

8-Lead SOIC (150 mil)

Example:XXXXXXXXXXXXYYWWNNN

MCP2551E
3
SN e^^1019
256

Legend: XX...X
Y
YY
WW
NNN

e3
*
Note:

Example:Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability codePb-free JEDEC designator for Matte Tin (Sn)This package is Pb-free. The Pb-free JEDEC designator ( e3)can be found on the outer packaging for this package.

In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

© 2010 Microchip Technology Inc.

DS21667F-page 15

MCP2551
        

3 & ' !&" & 4# *!( !!&    4 %&  &#&
&& 255***'    '5 4N

NOTE 1
E1

1

3

2
D

E
A2

A

L

A1

c

e
eB

b1
b
6&!
'! 9'&!
7"')  %!

7,8.
7

7

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& &7:1,



=

=



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

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=

=

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.



-

-

 ##4"# & 

4!!

"# >#& ##4>#&

.





<

:  9&



-<

-?



 & &

9



-



9#

4!!



<





 9#>#&

)



?



9 * 9#>#&

)



<



:   * +

1

=

=

6

-
    !"#$%&" '  ()"&'"!&) &#*& &  & #  +%&,  & !&- '! !#.#  &"#' #%!   & "! ! #%!   & "! !!  &$#/  !# '! #&    .0
1,21!'!   &$& "! **& "&&  !
  DS21667F-page 16     * ,<1© 2010 Microchip Technology Inc.

MCP2551
    !  ""#$%& !'

3 & ' !&" & 4# *!( !!&    4 %&  &#&
&& 255***'    '5 4
D
e
N

E
E1

NOTE 1
1

2

3
α

h

b
h

A2

A

c

φ

L

A1

L1

6&!
'! 9'&!
7"')  %!

β

99. .
7

7

7:

;

<

&



:  8 &



=

=





=

=





=



 ##44!!

&# %%+1,:  >#&.

 ##4>#&.

-1,:  9&1,, '% @
3& A?1,



=





=

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&9&

9

3

& &

9

3

&

I

B

=

<B





=

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)

-

=



 # %&

D

B

=

B

 # %&1 && '

E

B

=

9#

4!!

.3

B    !"#$%&" '  ()"&'"!&) &#*& &  & #  +%&,  & !&- '! !#.#  &"#' #%!   & "! ! #%!   & "! !!  &$#''  !# '! #&    .0
1,2 1!'!   &$& "! **& "&&  !
.32 % '! ("!"*& "&&  (% % '&  " !!   © 2010 Microchip Technology Inc.

     * ,1

DS21667F-page 17

MCP2551
    !  ""#$%& !'

3 & ' !&" & 4# *!( !!&    4 %&  &#&
&& 255***'    '5 4DS21667F-page 18© 2010 Microchip Technology Inc.

MCP2551
APPENDIX A:REVISION HISTORY

Revision F (July 2010)
The following is the list of modifications:1.

Updates to the packaging diagrams.

Revision E (January 2007)
The following is the list of modifications:1.

Updates to the packaging diagrams.

Revision D (October 2003)
The following is the list of modifications:1.

Undocumented changes.

Revision C (November 2002)
The following is the list of modifications:1.

Undocumented changes.

Revision B (June 2002)
The following is the list of modifications:1.

Undocumented changes.

Revision A (June 2001)• Original Release of this Document.

© 2010 Microchip Technology Inc.

DS21667F-page 19

MCP2551
NOTES:

DS21667F-page 20© 2010 Microchip Technology Inc.

MCP2551
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.

-X

/XX

XXX

DeviceTemperature
Range

Package

Pattern

Examples:a)b)Device:

MCP2551: High-Speed CAN Transceiver
MCP2551T: High-Speed CAN Transceiver(Tape and Reel)c)d)Temperature
Range:

I
E

Package:

P
SN

=
=

-40°C to +85°C-40°C to +125°C==© 2010 Microchip Technology Inc.

Plastic DIP (300 mil Body) 8-lead
Plastic SOIC (150 mil Body) 8-leade)f)

MCP2551-I/P:

Industrial temperature,
PDIP package.
MCP2551-E/P:
Extended temperature,
PDIP package.
MCP2551-I/SN: Industrial temperature,
SOIC package.
MCP2551T-I/SN: Tape and Reel,
Industrial Temperature,
SOIC package.
MCP2551T-E/SN: Tape and Reel,
Extended Temperature,
SOIC package.
MCP2551-E/SN: Extended Temperature,
SOIC package.

DS21667F-page 21

MCP2551
NOTES:

DS21667F-page 22© 2010 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:•

Microchip products meet the specification contained in their particular Microchip Data Sheet.

•

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in theintended manner and under normal conditions.

•

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to ourknowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

•

Microchip is willing to work with the customer who is concerned about the integrity of their code.

•

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does notmean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device
applications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchip
intellectual property rights.

Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,PIC32 logo, rfPIC and UNI/O are registered trademarks ofMicrochip Technology Incorporated in the U.S.A. and othercountries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of theirrespective companies.
© 2010, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.

ISBN:
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler andTempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and proceduresare for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory andanalog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

© 2010 Microchip Technology Inc.

DS21667F-page 23

WORLDWIDE SALES AND SERVICEAMERICAS

ASIA/PACIFIC

ASIA/PACIFICEUROPE

Corporate Office2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:www.microchip.com

Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431

India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632

Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829

India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513

France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79

Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122

Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44

Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
BostonWestborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
ChicagoItasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
DallasAddison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
KokomoKokomo, IN
Tel: 765-864-8360
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Los Angeles
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Tel: 949-462-9523
Fax: 949-462-9608
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Santa Clara, CA
Tel: 408-961-6444
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TorontoMississauga, Ontario,
CanadaTel: 905-673-0699
Fax: 905-673-6509

Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889

Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302

China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500

Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934

China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431

Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859

China - Nanjing
Tel: 86-25-8473-2460
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Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068

China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205

Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069

China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066

Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850

China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393

Taiwan - Hsin Chu
Tel: 886-3-6578-300
Fax: 886-3-6578-370

China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760

Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803

China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118

Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102

China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256

Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350

Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820

China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049

01/05/10

DS21667F-page 24© 2010 Microchip Technology Inc.