Application Note
RZ/V2M Evaluation Board Kit Booklet

R01AN6495EJ0100
Rev.1.00
July 1, 2022

SummaryThis application note describes the overview of RZ/V2M Evaluation Board Kit (made by Csm Solution Corporation).
Please refer to the hardware manual of RZ/V2M Evaluation Board Kit for details.

Target Device
RZ/V2M Evaluation Board Kit

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Rev.1.00

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Table of Contents
1.

Overview ....................................................................................................................... 3
1.1

Features ............................................................................................................................................ 4

1.2

Block Configuration ........................................................................................................................... 5

1.3

Specifications .................................................................................................................................... 7
1.3.1

V2MEVK Specifications ......................................................................................................... 7

1.3.2

V2MEVK Accessories ............................................................................................................ 8

1.3.3

Outer Appearance .................................................................................................................. 8

REVISION HISTORY ........................................................................................................... 9

RZ/V2M Evaluation Board Kit Booklet

1.

1. Overview

Overview

This evaluation board kit is for the Arm®-based vision-AI MPU RZ/V2M from Renesas Electronics (RZ/V2M
Evaluation Board Kit, hereafter V2MEVK). This manual describes the overview of the V2MEVK.
The V2MEVK consists of the RZ/V2M Board (main), RZ/V2M Base Board (base), CIS IMX415 Board (CIS), and CIS
GND Board (CIS_GND).
Board Name

Overview

RZ/V2M Board (main)● The RZ/V2M is mounted.
● Board on which the main functional components for the RZ/V2M are mounted

RZ/V2M Base Board (base)● Connected to CN12 and CN13 on the RZ/V2M Board● Board for the generation and supply of power

CIS IMX415 Board (CIS)● Connected to the CIS connector 1 on the RZ/V2M Board● Image sensor board (on which IMX415 is mounted)

CIS GND Board (CIS_GND)● Connected to the CIS connector 2 on the RZ/V2M Board● Board for handling unused pins of the CMOS image sensor I/F of the RZ/V2M

Audio Board● Board on which the audio codec IC is mounted*1

Note 1.

The audio board is an optional board provided by Renesas. Users can borrow it for free. For details, contact a Renesas
Electronics sales representative.

The following documents have been prepared for V2MEVK. Make sure to refer to the latest versions of these
documents.
Document Type

Document Title

Document No.

Description

Hardware manual

RZ/V2M Evaluation Board Kit
Hardware Manual

Provided by Csm Solution
Corporation

Hardware specifications of the V2MEVKStart-up guide

RZ/V2M Evaluation Board Kit
Start-Up Guide

R01UH1000EJ0100

The startup procedure of the first bootloader, second boot loader, and U-Booton the RZ/V2M Evaluation Board Kit

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RZ/V2M Evaluation Board Kit Booklet

1.1

1. Overview

FeaturesThis V2MEVK includes the following features.
● LPDDR4: 32 Gbits● eMMC™: 16 GB● CMOS image sensor interface connector: 2 ch. (1ch is in preparation.)● HDMI® Type-A connector: 1 ch.
● Gigabit Ethernet interface connector:1 ch.
● USB3.1 Gen1 Type-C: 1 ch.
● Micro SD card connector: 1. ch.
● SDIO interface connector: 1 ch.
● Pmod™ interface connector: 1 ch.
● Debug serial interface micro USB Type-B: 1 ch.
● Lens motor interface connector: 1 ch.
● Audio interface connector: 1 ch.

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RZ/V2M Evaluation Board Kit Booklet

1.2

1. Overview

Block Configuration
CIS_IMX415_Board
Image Sensor[IMX415]

DCDC

LDO

CIS_GND_Board[ISL8002][RAA214020]

Sensor CN[FX18-60P-08SV]

Sensor CN[FX18-60P-08SV]CIS CN1[FX18-60S-08SH]

RZ/V2M Board

RZ/V2M Base Board

IM0
IMSHUT0,1
IMSTSIG0,1

CIS CN2[FX18-60S-08SH]

PWEN1,3,4

IM1
IMSHUT0,1
IMSTSIG0,1

LVRX AD0
D0~3 AIN3
LVRX
CK0

LVRX
D4~7
LVRX
CK1

PWEN1,3,4

Key SW

AD0
AIN4[G-22AP]

Key SW[EVQP2P02W]
ADI Pin Header[PSM-420336-15]

IMSHUT0,1
IMSTSIG0,1

AD1AIN0~7

MTR CN[FX18-60S-0.8SV10]
CSI4

PM14

SDIO CN[FX18-40S-0.8SV10]

PWEN1,3,4
ADI0_1

SDI0

SDI1
PWC

PM8~PM15
CSI4

CSI4

Main Connector 2[46557-3545]
Main Connector 2[46556-3145][FXMAR2104]

CSI4_LS

Level
Shifter

INEXINT1/4/5/6_LS[FXMAR2104]

R

Audio CN[TSM-107-01-L-DV]

Reset IC[BU4224]

RTC

CSI5

Reset SW
[EVQP2P02W]

PWSYSRSTNRTRSTN[FXMAR2104]

Level
Shifter

Reset IC[LTC2916]

PWRSTN32.768kHz

AUI
MD[2:0]=“110”(Select：eMMC)
MODE SW[CHS-04]

MD3~6

LED
[SML-P11]

MD8

RZ/V2MBoot

LPDDR4[MT53D1024M32D4]

DDI(R9A09G011GBG)

JTAG CN[HIF3FC-20PA]

DEBUG
PWC_RSTn

INEXINTeMMC[THGAMRG7T13BAIL]

I2C
NFI
GPIO

Pin Header(CN15)[1241150-4]

CSI5
PWM0_7

P00_08,09
P00_12,13

I2C0/1

P06_00PM12CSTXD2/CSRXD2AUMCLK/AUPLLCLK

P06_08~P06_11

P06_08_LS~P06_11_LS

AUMCLK_LS/AUPLLCLK_LS

PM13_LS/PM14_LS

CSTXD2_LS/CSRXD2_LS
PM12_LS
P06_00_LS

PM13/14

CSI2_3
PM2

HMI
R(select)

CSI0

ETH

CPG

UART-USB
Bridge[CP2105-F01GMR]

25MHz
Ether PHY
[RTL8211FG-CG]

HDSCL
HDSDA

I2C0
USTX,RXUSOVCUSOTGID
USPWENUSB TypeC
USB VBUS
Controller
Controller[HD3SS3220][TPS66020YBGR]

Level
ShifterR[FXMAR2104]

USB Micro-B[ZX62D-B-5PA8]

Pin Header(CN14)[1241150-6]

RJ45 ｗPT[093627360x]

USB TypeC[CX90B1-24P]

AND Gate[NL17SZ08]

USB

48MHz
R
(select)

USVBUS
USDP,DM

Level Shifter[FXMAR2102]
HDTX0~2HDTXC
HDMI CN[1747981-1]

Pow SW[G-22AP]PWEN0~4

LDO[ISL80505](RTVDD1.5)

LDO[ISL80505](RTVDD0.8)

DCDC[RAA211650](VDD5.0_0)

DCDC[RAA211650](VDD5.0_0_V2M)

LDO[MM3532T](SDIO0)LDO[MM3532T](SDIO1)DCDC[ISL8002](VDD3.3_4)

DCDC[ISL8002](VDD1.8_1)

LoadSwitch[TCK207G](VDD0.8_USB_5)

LoadSwitch[TCK207G](VDD0.8_LPVDD)

DCDC[ISL8002](VDD1.8_3)

LDO[ISL9021A](VDD1.2_4)

LDO[ISL80505](PWVDD1.8)

LDO[ISL80505](PWVDD0.8)

DCDC[ISL8002](VDD1.1_1)

DCDC[ISL8002](VDD0.8_2)

DCDC[ISL8026](VDD0.8_1)

DCDC[ISL85412](RTPWVDD3.0)

POW_ENPower IC[FXMAR2104]

Level
Shifter

DC Jack[FXMAR2104]

INEXINT7
Shutter SW510[EVQP2P02W]

CSI1

HDHPD

PWEN4,5
PWSD0~1SEL
PWMEMSWIENA

Main Connector 1[46557-3545]

Level
Shifter

AUBICK_LS/AULRCK_LS/AUDO_LS/AUDI_LS

Level
Shifter

Figure 1.2-1

CPG
RSTN

PWM8_15

PM15

Audio CN[TSM-120-01-L-DV]

PM8_LS～
PM11_LS

MTR
Level
Shifter[NLSV4T244E]

PWEN1,3,4

PWEN1,3,4
PWOUT0,1
CIF

STG

MTR_

Main Connector 1[46556-3145]

Level Shifter
Enable SW[CHS-06]

PWKY0~4N

Micro SD
[DM3AT-SF-PEJM5][PJ-063AH]

INEXINT0
Shutter SW509[EVQP2P02W]

PMOD CN
TYPE6(I2C_2)[PPPC061LGBN-RC]

PMOD CN
TYPE1(GPIO)[PPPC061LGBN-RC]

V2MEVK Block Diagram

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RZ/V2M Evaluation Board Kit Booklet

1. Overview

RZ/V2M Base Board
D12.0VDC
Jack

AC Adapter
12V/5ARTPWVDD3.0

DCDC[ISL85412]

EN

EN

LDO
[ISL80505]

RTVDD1.5

EN

LDO[ISL80505]

RTVDD0.8

Reset ICRTRSTN

PWEN0
PWEN1
PWEN2
PWEN3
PWEN4
PWEN5
PWSD0SELPWSD1SELRTVDDRTPWVDD3.0
RTVDD08
R

RTRSTN[BU4224-FVE]

CIS_IMX415_Board
Image Sensor[IMX415]PWMEMSWIENA

Power
ON/OFFLDO[ISL80505]

EN

POW_ENPower
SwitchPWVDD1.8

PWVDD

2.9V
PWEN4

PWKY0N~4N

PWVDD0.8

VDD5.0_0

PWRSTNPWRSTNRZ/V2M

VDD5.0_0[RAA211650]

PWEN0

DCDC

VDD5.0_0_V2M[RAA211650]

PWEN4
PWSD1
SEL

VDD5.0_0R(slct)

R(slct)(I2C2)PWEN3

DCDC[ISL8002]

DCDC[ISL8002]

VDD3.3_4

VDD1.8_3
PWVDD1.8

Push
Push
Push
SwitchSwitchSwitchPush
Push
SwitchSwitchPH(slct)

Level
Shifter

DCDC[ISL8002]

VDD1.8_1

VDD1.1_1

PWEN1

DCDC
[ISL8002]

VDD1.8_1

PWEN4

Audio CN
(40pin)R(slct)

SD1FVDDR

SD1FMODVDD

VDD3.3_4

VDD1.8_3 or VDD3.3_4(slct)IM0MODVDD
IM1MODVDD
PAMODVDD
NAMODVDDD
PWKY0N~2N
VDD1.8_3

VDD1.8_1

VDD1.8_1

VDD1.1_1

VDD1.1_1

VDD1.2_4

VDD1.2_4

DCDC[ISL8026]

VDD0.8_1

VDD0.8_1

PWEN1

DCDC
[ISL8002]

VDD0.8_2

VDD0.8_2

PWEN2

VDD0.8_1

VDD0.8_2

Load
SwitchPWEN5
R(slct)

Audio CN
(14pin)MTR_CN(MotorConnector)

LPDDR4LDO[ISL9021A]

VDD0.8_USB_5

Load VDD0.8_LPVDD
SwitchVDD33, USVD330, USVPH

Micro SD
Card CNGEMODVDD, NAMODVDD
IM0MODVDD, IM1MODVDDPAMODVDD, PBMODVDD, PCMODVDD

SD1FMODVDDSDIO CN
SD0PREDVDD
NAPREDVDD, GEPREDVDDPAPREDVDD, PBPREDVDD, PCPREDVDDPREDVDD33, IM0PREDVDD, IM1PREDVDDOTVDD18, LVRXAVCC, PCVDD18
TS0AVDD18, TS1AVDD18, HDAVDD18
PLVDD1/2/3/4/6/7, DSMSVDD18, USVDDH
AD0AVCCA, AD1AVCCA

Pin Header[CN11] (ADI)NAMODVDD

VDD18, LPVAALPVDDQ

eMMC

Ether PHY

DSMVDD12

PAMODVDD

Pin Header[CN14] (UART)

UART-USB
Bridge

VBUS

USB Micro-B
Connector

OTVDD08, LVRXAVDD, PCVDD08
TS0DVDD08A, TS1DVDD08A, HDAVDD08
PLDVDD081/082/083/084/086/087, DSMSVDD0P8

VBUS
Controller

VBUS

USB TypeC
Connector

USDVDD, USVP, USVPTXUSB TypeC
Controller

PAMODVDD

VDD08

JTAG CN

LPVDD
VDD3.3_4

PWMEMSWIENA

DCDC[ISL8002]

SD0MODVDD

抵抗
抵抗
抵抗
抵抗
抵抗
抵抗
切替
R切替
切替
切替
切替
切替

VDD1.8_3(R9A09G011GBG)

PWEN1SD1FMODVDD
R(slct)

SD0VDD_4(3.3/1.8V)

PWKY3N~4N

VDD1.8_3

VDD3.3_4

Level
Level
Level
Level
ShifterLevel
ShifterLevel
Shifter
Shifter
Shifter
ShifterR

ToggleToggleSwitchSwitchPWEN1

SD1VDD_4(3.3/1.8V)

VDD3.3_4

Main Connector

PMOD CNLDO[MM3532T]

PWEN4
PWSD0
SEL

VDD3.3_4

PWEN4

LDO
[MM3532T]

IM1MODVDDCIS_CN2VDD5.0_0#MR

Reset IC[LTC2916]

CIS_GND
Board

DCDC

(GPIO)

VDD1.8_3

PWVDD08
R

Push
SwitchPMOD CN

CIS_CN1LDO[ISL80505]

1.1V
1.8V

LDO
[RAA214020]

IM0MODVDDEN

PWC_RSTn

VDD5.0_0

RZ/V2M Board
Power Control Signals

VDD1.8_3
VDD1.8_1
VDD5.0_0

Level Shifter(HDMI DDC)AND Gate(HDMI HPD)
Load Switch(HDMI 5V)

HDMI CNPower Control Signals

Figure 1.2-2

V2MEVK Power Supply Block Diagram

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RZ/V2M Evaluation Board Kit Booklet

1.3

Specifications

1.3.1

V2MEVK Specifications

Table 1.3-1

1. Overview

V2MEVK Specifications

Item

Specification

MPU

R9A09G011GBG (RZ/V2M)

Board size

Main: 120 × 105 × 1.6 mm
Base: 155 × 105 × 1.6 mm

LPDDR4Micron MT53D1024M32D4
32 Gb Dual-Rank

eMMC

Kioxia THGBMJG7C1LBAIL 16 GB (or same specification product)

HDMI

Connector: Type-A (standard)USB

Connector: Type-C

Ethernet

Connector: RJ45
Ethernet PHY IC: RTL8211FG-CG

Audio I/F

Connector: 40 pins with 2.54-mm pitch
Connector: 14 pins with 2.54-mm pitch
For connecting to the TLV Audio Board*1

SD Card I/FConnector: Micro SD

SDIO

Connector: FX18-40S-0.8SV10

Image sensor I/F

Connector: FX18-60S-0.8SH
Connected to the CIS IMX415 Board and CIS GND Board connectors*2

Motor control I/F

Connector: FX18-60S-0.8SV10

Debug I/F

Connector: USB Micro-B
UART-USB bridge: CP2105

LED

For power supply (VDD5.0): Yellow green (main)
For boot (MD8): Yellow green (main)
For power supply (RTPWVDD3.0): Yellow green (base)SwitchFor mode setting: DIP ×1 (main)
For level shifters setting: DIP × 1 (base)For power supply: Toggle ×1 (base)
For audio interface IO power setting: Pin header × 1 (base)Power supply

AC adapter: 12V/5A*2

Note 1.

TLV Audio Board is an optional board provided by Renesas. Users can borrow it for free. For details, contact a Renesas
Electronics sales representative.

Note 2.

AC adapter and CS mount lens for camera are requested to prepare separately as needed.

Table 1.3-2

CIS IMX415 Board Specification

Item

Specification

CMOS image sensor

IMX415 (Made by SONY)*1

Note 1.

IMX415 is used in sensor slave mode with the ISP support package.

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RZ/V2M Evaluation Board Kit Booklet

1.3.2

V2MEVK Accessories

Table 1.3-3

V2MEVK Accessories

Item

Specification

Upper plate

Material: Acrylic
Size: 155 × 105 × 3 mmBase plate

Material: Acrylic
Size: 200 × 150 × 5 mm

Rubber feetSize: 12.7 × 12.7 × 3 mm, Qty: 4

Board spacers

M3 × 20 mm, Qty: 4
M3 × 8 mm, Qty: 4
M3 × 10 mm, Qty: 4

M3 screws

M3 × 10, Qty:6

Jumper connector

For CN508

1.3.3

1. Overview

Outer Appearance

RZ/V2M Board

RZ/V2M

CIS IMX415 BoardCIS GND Board
RZ/V2M Base Board

Figure 1.3-1Outer Appearance of V2MEVK

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RZ/V2M

REVISION HISTORYREVISION HISTORY

RZ/V2M Evaluation Board Kit Booklet

REVISION HISTORY
Description
Rev.

Date

Page

1.00

July 1, 2022⎯

R01AN6495EJ0100
July 1, 2022

Rev.1.00

SummaryFirst edition issued

Page 9 of 12

General Precautions in the Handling of Microprocessing Unit andMicrocontroller Unit Products
The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the
products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.
1.

Precaution against Electrostatic Discharge (ESD)
A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps
must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must be
adequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity.
Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test andmeasurement tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor
devices must not be touched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices.

2.

Processing at power-on
The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states ofregister settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external resetpin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins
in a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches thelevel at which resetting is specified.

3.

Input of signal during power-off state
Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O
pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal
elements. Follow the guideline for input signal during power-off state as described in your product documentation.

4.

Handling of unused pins
Handle unused pins in accordance with the directions given under handling of unused pins in the manual. The input pins of CMOS products are
generally in the high-impedance state. In operation with an unused pin in the open-circuit state, extra electromagnetic noise is induced in the vicinity of
the LSI, an associated shoot-through current flows internally, and malfunctions occur due to the false recognition of the pin state as an input signal
become possible.

5.

Clock signals
After applying a reset, only release the reset line after the operating clock signal becomes stable. When switching the clock signal during program
execution, wait until the target clock signal is stabilized. When the clock signal is generated with an external resonator or from an external oscillator
during a reset, ensure that the reset line is only released after full stabilization of the clock signal. Additionally, when switching to a clock signal
produced with an external resonator or by an external oscillator while program execution is in progress, wait until the target clock signal is stable.

6.

Voltage application waveform at input pin
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL(Max.) and VIH (Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the
input level is fixed, and also in the transition period when the input level passes through the area between VIL (Max.) and VIH (Min.).

7.

Prohibition of access to reserved addresses
Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access theseaddresses as the correct operation of the LSI is not guaranteed.

8.

Differences between products
Before changing from one product to another, for example to a product with a different part number, confirm that the change will not lead to problems.
The characteristics of a microprocessing unit or microcontroller unit products in the same group but having a different part number might differ in termsof internal memory capacity, layout pattern, and other factors, which can affect the ranges of electrical characteristics, such as characteristic values,
operating margins, immunity to noise, and amount of radiated noise. When changing to a product with a different part number, implement a systemevaluation test for the given product.

Notice1.

Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products
and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of yourproduct or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from the useof these circuits, software, or information.
2. Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights,
or other intellectual property rights of third parties, by or arising from the use of Renesas Electronics products or technical information described in thisdocument, including but not limited to, the product data, drawings, charts, programs, algorithms, and application examples.
3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics
or others.
4. You shall be responsible for determining what licenses are required from any third parties, and obtaining such licenses for the lawful import, export,
manufacture, sales, utilization, distribution or other disposal of any products incorporating Renesas Electronics products, if required.
5. You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any
and all liability for any losses or damages incurred by you or third parties arising from such alteration, modification, copying or reverse engineering.
6. Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications foreach Renesas Electronics product depends on the product’s quality grade, as indicated below.
"Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; homeelectronic appliances; machine tools; personal electronic equipment; industrial robots; etc.
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key
financial terminal systems; safety control equipment; etc.
Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas
Electronics document, Renesas Electronics products are not intended or authorized for use in products or systems that may pose a direct threat tohuman life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause serious property damage (spacesystem; undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics
disclaims any and all liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics productthat is inconsistent with any Renesas Electronics data sheet, user’s manual or other Renesas Electronics document.
7. No semiconductor product is absolutely secure. Notwithstanding any security measures or features that may be implemented in Renesas Electronics
hardware or software products, Renesas Electronics shall have absolutely no liability arising out of any vulnerability or security breach, including but
not limited to any unauthorized access to or use of a Renesas Electronics product or a system that uses a Renesas Electronics product. RENESASELECTRONICS DOES NOT WARRANT OR GUARANTEE THAT RENESAS ELECTRONICS PRODUCTS, OR ANY SYSTEMS CREATED USINGRENESAS ELECTRONICS PRODUCTS WILL BE INVULNERABLE OR FREE FROM CORRUPTION, ATTACK, VIRUSES, INTERFERENCE,
HACKING, DATA LOSS OR THEFT, OR OTHER SECURITY INTRUSION (“Vulnerability Issues”). RENESAS ELECTRONICS DISCLAIMS ANY AND
ALL RESPONSIBILITY OR LIABILITY ARISING FROM OR RELATED TO ANY VULNERABILITY ISSUES. FURTHERMORE, TO THE EXTENTPERMITTED BY APPLICABLE LAW, RENESAS ELECTRONICS DISCLAIMS ANY AND ALL WARRANTIES, EXPRESS OR IMPLIED, WITHRESPECT TO THIS DOCUMENT AND ANY RELATED OR ACCOMPANYING SOFTWARE OR HARDWARE, INCLUDING BUT NOT LIMITED TO
THE IMPLIED WARRANTIES OF MERCHANTABILITY, OR FITNESS FOR A PARTICULAR PURPOSE.
8. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for
Handling and Using Semiconductor Devices” in the reliability handbook, etc.), and ensure that usage conditions are within the ranges specified byRenesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characteristics, installation, etc. Renesas
Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of suchspecified ranges.
9. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specificcharacteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability
product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics
products are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily
injury, injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as
safety design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment foraging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you areresponsible for evaluating the safety of the final products or systems manufactured by you.
10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas
Electronics product. You are responsible for carefully and sufficiently investigating applicable laws and regulations that regulate the inclusion or use ofcontrolled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics products in compliance with all theseapplicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliancewith applicable laws and regulations.
11. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale isprohibited under any applicable domestic or foreign laws or regulations. You shall comply with any applicable export control laws and regulations
promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions.
12. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells ortransfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this document.
13. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.
14. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas
Electronics products.
(Note1)“Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlledsubsidiaries.

(Note2)“Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(Rev.5.0-1

October 2020)

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Trademarks
Renesas and the Renesas logo are trademarks of Renesas Electronics
Corporation. All trademarks and registered trademarks are the property of
their respective owners.

© 2022 Renesas Electronics Corporation. All rights reserved.

Trademarks (continued)
Examples of trademarks or registered trademarks used in the document of RZ/V2M;
Arm® is a registered trademark of Arm Limited or its subsidiaries.
HDMI® is a registered trademark of HDMI Licensing, LLC.
eMMC™ is a trademark of MultiMediaCard Association.
Pmod™ is a registered trademark of Digilent Inc.
Note that in each section of the Manual, trademark notation of ® and TM may be omitted.
All other trademarks and registered trademarks are the property of their respective owners.

© 2022 Renesas Electronics Corporation. All rights reserved.