REVISIONSLTR

DESCRIPTION
Update boilerplate paragraphs to current
requirements. - roA
B

Update the JEDEC package from MO-178-AA to
MO-178 along with the maximum “L” dimension.
Update document paragraphs to current
requirements. - ro

DATE

APPROVED

12-11-13

C. SAFFLE

19-03-04

C. SAFFLE[!].

.

CURRENT DESIGN ACTIVITY CAGE CODE 16236
HAS CHANGED NAMES TO:
DLA LAND AND MARITIMECOLUMBUS, OHIO 43218-3990
Prepared in accordance with ASME Y14.24

Vendor item drawing

REVPAGEREVPAGEREV STATUS
OF PAGES

REVB

BBB

B

B

BBB

B

B

B

PAGE

123456789101112

PMIC N/A

PREPARED BY
RICK OFFICER

Original date of drawing
YY-MM-DD

CHECKED BYRAJESH PITHADIA

07-07-31

APPROVED BYROBERT M. HEBERSIZEAREVDEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
TITLE
MICROCIRCUIT, LINEAR, CURRENT SHUNTMONITORS, MONOLITHIC SILICON

CODE IDENT. NO.

DWG NO.

V62/07638

16236
B

PAGE

AMSC N/A
DISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.

1OF125962-V007-19

1. SCOPE
1.1 Scope. This drawing documents the general requirements of a high performance current shunt monitors microcircuit, with anoperating temperature range of -55°C to +125°C.
1.2 Vendor Item Drawing Administrative Control Number. The manufacturer’s PIN is the item of identification. The vendor item
drawing establishes an administrative control number for identifying the item on the engineering documentation:
V62/07638-01XI

Drawing
numberEI

Device type(See 1.2.1)

I

Case outline(See 1.2.2)

Lead finish(See 1.2.3)

1.2.1 Device type(s).
Device type

GenericGain

Circuit function

0102
03
04
0506

INA193A
INA194A
INA195A
INA196A
INA197A
INA198A

20 V/V
50 V/V
100 V/V
20 V/V
50 V/V
100 V/V

Current shunt monitors
Current shunt monitors
Current shunt monitors
Current shunt monitors
Current shunt monitors
Current shunt monitors

1.2.2 Case outline(s). The case outline(s) are as specified herein.
Outline letter

Number of pins

JEDEC PUB 95

Package styleX

5MO-178

Plastic surface mount1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacture:
Finish designator
ABCDEFZ

DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO

Material
Hot solder dip
Tin-lead plate
Gold plate
PalladiumGold flash palladium
Tin-lead alloy (BGA/CGA)
Other

SIZE
A

CODE IDENT NO.
16236
REVB

DWG NO.

V62/07638
PAGE2

1.3 Absolute maximum ratings.

1/Supply voltage (VS) .................................................................................................................. 18 V maximum
Analog input voltage range
Differential (+VIN – (-VIN)) .................................................................................................... -18 V to +18 VCommon mode ..................................................................................................................... -16 V to +80 V 2/
Analog output voltage range (OUT) ......................................................................................... GND – 0.3 V to +VS + 0.3 V 2/
Input current into any pin .......................................................................................................... 5 mA maximum 2/
Operating temperature range ................................................................................................... -55°C to +150°C
Storage temperature range (TSTG) .......................................................................................... -65°C to +150°C
Junction temperature range (TJ) .............................................................................................. +150°C maximumElectrostatic discharge (ESD) ratings:
Human body model (HBM) ................................................................................................... 4000 V maximum
Charged device model (CDM) .............................................................................................. 1000 V maximum
1.4 Recommended operating conditions. 3/
Supply voltage range (VS) ........................................................................................................ 12 V
Operating free-air temperature range (TA) ............................................................................... -55°C to +125°C

1/2/
3/

Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stressratings only, and functional operation of the device at these or any other conditions beyond those indicated under“recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may
affect device reliability.
Input voltage at any pin may exceed the voltage shown if the current at that pin is limited to 5 mA.
Use of this product beyond the manufacturers design rules or stated parameters is done at the user’s risk. The manufacturer
and/or distributor maintain no responsibility or liability for product used beyond the stated limits.

DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO

SIZE
ACODE IDENT NO.
16236
REVB

DWG NO.

V62/07638
PAGE32. APPLICABLE DOCUMENTSJEDEC Solid State Technology Association
JEDEC PUB 95 –Registered and Standard Outlines for Semiconductor Devices(Copies of these documents are available online at https://www.jedec.org.)
3. REQUIREMENTS
3.1 Marking. Parts shall be permanently and legibly marked with the manufacturer’s part number as shown in 6.3 herein and as
follows:A.
B.
C.

Manufacturer’s name, CAGE code, or logo
Pin 1 identifierESDS identification (optional)

3.2 Unit container. The unit container shall be marked with the manufacturer’s part number and with items A and C (if applicable)
above.
3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics areas specified in 1.3, 1.4, and table I herein.
3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein.
3.5 Diagrams.
3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1.
3.5.2 Terminal connections. The terminal connections shall be as shown in figure 2.

DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO

SIZE
ACODE IDENT NO.
16236
REVB

DWG NO.

V62/07638
PAGE4

TABLE I. Electrical performance characteristics. 1/
Test

SymbolConditions 2/

Temperature,TA

DevicetypeLimits
Min

Unit
Max

Input section
Full scale input voltage

VSENSE

Common mode input
range

VCM

Common mode
rejection

CMR

Offset voltage,referred to input (RTI)

VOS

Offset voltage, (RTI)
versus temperature∆VOS /∆T

Offset voltage, (RTI)
versus power supply

PSR

Input bias current at-VIN pin

IBAll-55°C to +125°C

All-16+VIN = -16 V to 80 V+25°C

All

80+VIN = 12 V to 80 V-55°C to +125°C

V80

VdB100All+25°C

2VS = 2.7 V to 18 V,mV

3+25°CAll

2.5 typical-55°C to +125°C

All

100

µV / V-55°C to +125°C

All

±23µA

+25°C

01,04

20 typical

02,05

50 typical

03,06

100 typical

All

±1

µV /°C+VIN = 18 V( VSENSE ≥ 20 mV )GGain error

VSENSE = 20 mV to 100 mV+25°C-55°C to +125°C

Total output error 3/

All+25°C

Nonlinearity error

VSENSE = 20 mV to 100 mVRO

Maximum capacitiveload

No sustained oscillation

V/V%±2%±2.2-55°C to +125°C

Output impedance(VS – 0.2 ) /Gain-55°C to +125°C

Output section
Gain+25°C

VSENSE = +VIN - -VIN

±3+25°C

All%+25°CAll

1.5 typical

Ω

+25°C

All

10 typical

nF

±0.1

See footnotes at end of table.

DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIOSIZEACODE IDENT NO.
16236
REVB

DWG NO.

V62/07638
PAGE5Symbol

TABLE I. Electrical performance characteristics – Continued. 1/-16 V ≤ VCM < 0 V

Output voltage( VSENSE < 20 mV ) 4/

Output section-TestConditions 2/

Temperature,TA

DevicetypeLimits
Min

Voltage output section

Unit
Max

-+25°CVS < VCM ≤ 80 V

01,04

+25°C

0 V ≤ VCM ≤ VS, VS = 5 V

All

+25°C

300 typical
0.4

300 typicalAll

203,06

102,05mVVmV

5/-Swing to +VS power
supply rail
Swing to GND 6/--55°C to +125°C

RL = 100 kΩ to GND-55°C to +125°C

RL = 100 kΩ to GND

All
AllmVVGND+ 50

V+VS-0.2

Frequency response section
Bandwidth

Phase margin
Slew rate+25°C

CLOAD < 10 nF

PM+25°C

CLOAD = 5 pF

BWSR

Settling time (1 %)tS

VSENSE = 10 mV to 100 mVPP,

01,04

500 typical

40 typicalAll

200 typical

03,06

300 typical

02,05

All+25°C

All+25°C

1 typical

kHz

DegreesV/µs

2 typicalµs

CLOAD = 5 pF
Referred to input (RTI) noise section
Voltage noise density+25°C

All

40 typical_fnV / HzPower supply section
Operating range
Quiescent current-55°C to +125°C

VSIQ-55°C to +125°C

VOUT = 2 V

All

2.7

All

181300VµA

950

VSENSE = 0 mV
See footnotes at end of table.

DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO

SIZE
ACODE IDENT NO.
16236
REV

DWG NO.

V62/07638

B

PAGE

6

TABLE I. Electrical performance characteristics – Continued. 1/Test

SymbolConditions -2/Temperature,TA

DevicetypeLimits
MinUnit

I Max

Temperature range section
Thermal resistance,
junction to ambient

All+25°C

θJA200 typical°C/W

1/

Testing and other quality control techniques are used to the extent deemed necessary to assure product performance overthe specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters
may not necessarily be tested. In the absence of specific parametric testing, product performance is assured by characterization
and/or design.

2/

Unless otherwise specified, VS = +12 V, +VIN = 12 V, and VSENSE = 100 mV.

3/

Total output error includes effects of gain error and VOS.

4/

For details on this region of operation, see the Accuracy variations as a result of VSENSE and common mode voltage sectionin the applications information of the manufacturer’s datasheet.

5/See figure 3.

6/Specified by design.

DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO

SIZE
ACODE IDENT NO.
16236
REV

B

DWG NO.

V62/07638
PAGE

7

Case X

7js~LS

I 1~~1----;.0~0:::-8-:-:CO:--.-2O_l_®_I

GAGE
PLANE
I~DETAIL AFIGURE 1. Case outline.

DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO

SIZE
ACODE IDENT NO.
16236
REVBDWG NO.

V62/07638
PAGE

8Case X - continuedDimensions
SymbolInchMillimeters

MinMaxMinMax

A---.057---

1.45

A1.000

.005

0.00

0.15

b.011

.019

0.30

0.50

c.003

.008

0.08

0.22

D.108

.120

2.75

3.05

E.057

.068

1.45

1.75

E1.102

.118

2.60

3.00

e
L.037 BSC
.011

0.95 BSC
.023

0.30

0.60

L1.009 BSC

0.25 BSC

n5 leads

5 leads

NOTES:
1. Controlling dimensions are millimeter, inch dimensions are given for reference only.
2. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not
exceed 0.15 mm (.005 inch) per side
3. Falls with JEDEC MO-178.
FIGURE 1. Case outline – Continued.

DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO

SIZE
ACODE IDENT NO.
16236
REVB

DWG NO.

V62/07638
PAGE

9Device types

01, 02, 03

04, 05, 06Case outline

X

Terminal number

Terminal symbol

1

OUT

OUT

2

GND

GND

3+VIN+VS

4-VIN+VIN

5+VS-VIN

FIGURE 2. Terminal connections.

DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIOSIZE
A

CODE IDENT NO.
16236
REVB

DWG NO.

V62/07638
PAGE10121110

V5 = 12 V --1------+-----"....,_----1_.....:::,,,,.,....---+-.....:::,,,.,....__----1
SOURCING CURRENT

9>

8w
(.!)

<(7I-...J

06

I-5>
::::>

a..

I-::::>

4

V5 = 3 V - - - + - - - - - - - - - , 1 - - - - - - + - - - - - - - - - - - - 1

SOURCING CURRENT-40"C

03OUTPUT STAGE IS DESIGNEDTO SOURCE CURRENT.
CURRENT SINKING CAPABILITY
IS APPROXIMATELY 400 f.JA.

2115202530

OUTPUT CURRENT CmAIFIGURE 3. Positive output voltage swing versus output current.

DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIOSIZEACODE IDENT NO.
16236
REV

B

DWG NO.

V62/07638
PAGE

11

4. VERIFICATION
4.1 Product assurance requirements. The manufacturer is responsible for performing all inspection and test requirements as
indicated in their internal documentation. Such procedures should include proper handling of electrostatic sensitive devices,classification, packaging, and labeling of moisture sensitive devices, as applicable.
5. PREPARATION FOR DELIVERY
5.1 Packaging. Preservation, packaging, labeling, and marking shall be in accordance with the manufacturer’s standard commercial
practices for electrostatic discharge sensitive devices.
6. NOTES
6.1 ESDS. Devices are electrostatic discharge sensitive and are classified as ESDS class 1 minimum.
6.2 Configuration control. The data contained herein is based on the salient characteristics of the device manufacturer’s data book.
The device manufacturer reserves the right to make changes without notice. This drawing will be modified as changes are provided.
6.3 Suggested source(s) of supply. Identification of the suggested source(s) of supply herein is not to be construed as a guaranteeof present or continued availability as a source of supply for the item. DLA Land and Maritime maintains an online database of all
current sources of supply at https://landandmaritimeapps.dla.mil/Programs/Smcr/.

Vendor item drawing
administrative control
number 1/

Devicemanufacturer
CAGE code

Package 2/Top sidedmarking

Vendor part number

V62/07638-01XE01295SOT23-5-DBV

CCC

INA193AMDBVREP

V62/07638-02XE

3/

SOT23-5-DBV---

INA194AMDBVREP

V62/07638-03XE

3/

SOT23-5-DBV---

INA195AMDBVREP

V62/07638-04EX

3/

SOT23-5-DBV---

INA196AMDBVREP

V62/07638-05XE

3/

SOT23-5-DBV---

INA197AMDBVREP

V62/07638-06XE

3/

SOT23-5-DBV---

INA198AMDBVREP

1/ The vendor item drawing establishes an administrative control number for identifying the item on theengineering documentation.
2/ For the most current package and ordering information, see the package option addendum at the endof the vendor datasheet.
3/ Product preview.
CAGE code

Source of supply

01295

Texas Instruments, Inc.
Semiconductor Group
8505 Forest Ln.
P.O. Box 660199
Dallas, TX 75243

DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO

SIZE
ACODE IDENT NO.
16236
REVB

DWG NO.

V62/07638
PAGE12