p STC-2000A DEPOSITION CONTROLLER y
TFC-2002

JM

USERS MANUAL

518-031

Rev A, January 7, 2004
.current:

Sycon STC-2000A Deposition Controller<<<END>>>>
instruments
STATUS

STOP

MENU

START
HAND CONTROLLERZEROMANUALSTC-2000A THICKNESS / RATE CONTROLLER>SENSOR
I/O 4

I/O 3

I/O 2

instruments

I/O 1
1

R
S
2
3
2

FUSE: 2 X 2.00 AMP
QUICK-ACTING (F) 250V
90-264 VAC, 50-60 Hz, 230 VA MAX

2
1
2
INPUTS / OUTPUTS

M
E
M! WARNING
THE POWER CORD PROTECTIVEGROUNDING CONDUCTOR MUST
BE CONNECTED TO GROUND, NO
USER SERVICEABLE PARTS
INSIDE. REFER SERVICING TOQUALIFIED PERSONNEL

SOURCE
overview w/ generalizations only

< Sycon reserves the right to change any information contained in this manual without notice

SECTION 0.XX

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p STC-2000A DEPOSITION CONTROLLER y© Copyright Sycon Instruments, Inc. & Custom 2003
AMPHENOL®
AMP®
ConFlat®
IBM®
Microsoft®
Microdot ®
SWAGELOK®
Windows®
.

SECTION 0.XX

is a registered trademark of Allied Corporation
is a registered trademark of Tyco/Amp, Inc.
is a registered trademark of Varian Associates, Inc.
Is a registered trademark of IBM Corporation
is a registered trademark of Microsoft Corporation
is a registered trademark of Microdot Inc.
is a trademark owned by Crawford Fitting Company
is a registered trademark of Microsoft Corporation

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p STC-2000A DEPOSITION CONTROLLER y

Warranty.
Sycon Instruments, Inc. (Sycon) warrants that all electronic instrumentation equipment
manufactured by Sycon shall be free from defects in materials and workmanship for a period of 2 years
from date of shipment. Mechanical vacuum components such as feedthroughs, sensors, cables, and shuttersshall be warranted for a period of six months from the date of shipment. For the duration of the warranty
period Sycon will, at its option, either repair or replace any part which is defective in materials orworkmanship without charge to the purchaser. The foregoing shall constitute the exclusive and sole
remedy of the purchaser for any breach by Sycon of this warranty.
This warranty does not apply to any equipment which has not been used in accordance with thespecifications recommended by Sycon for the proper and normal use of the equipment. Sycon shall not beliable under any circumstances for consequential or incidental damages in connection with, or arising out of
the sale, performance, or use of, the equipment covered by this warranty.
This warranty is in lieu of all other warranties by Sycon, expressed or implied, including theimplied warranty of merchantability, the implied warranty of fitness for a particular purpose, and warranty
against infringement of any patent.
This warranty shall not apply if repair has been performed or an alteration made by anyone other than an
authorized Sycon representative or if a malfunction occurs through abuse, misuse, negligence, or accident.
No charge will be made for repairs made under warranty at Sycon's facilities.

Equipment Return
Before returning any equipment to Sycon contact the Product Service Department in your area for
instructions. You must obtain a RA (Return Authorization) number from Sycon Instruments and indicate
this number on all shipping cartons and correspondence. Failure to do so will delay the processing of yourreturned unit. Ship all items in suitable containers with adequate protection from outside damage. Also
include a short description of the problem or condition to facilitate processing.

Sycon Instruments, Inc.
6757 Kinne Street
Syracuse, New York
13057-1215
Phone (315) 463-5297
Fax (315) 463-5298
service@sycon.com

User Responsibility
The user is responsible for proper operation an ordinary maintenance of the equipment, following
procedures described in this manual. Proper operation includes timely replacement of parts that are
missing, broken, or plainly worn. If the user has a reasonable doubt about understanding the use or
installation of a component, Sycon be called.

Safety Warning
General Precautions: Human contact with the voltages present within and around a vacuum system can befatal. Make sure that the input power is turned off before opening the doors or removing panels. Short all
HV feedthrough connections with a grounding hook before accessing the controller main body.
Reproduction of this information and equipment described herein is prohibited without prior writtenconsent from Sycon.

SECTION 0.XX

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p STC-2000A DEPOSITION CONTROLLER y
SECTION 1.0
UnpackingIntroduction.specifications/included materials(no intro here) unpacking.

The STC-2000A comes with a power cord and connectors for the RS-232 interface, the I/Ointerfaces and analog outputs (see the following spare parts included list). If the essential OSC-100A
oscillator or crystals were ordered at the same time, they will also be included. The unit operates from 90
to 264 VAC with no adjustments required. If it is ever necessary to return the unit to Sycon, for any
reason, call and obtain a Return Authorization number (RA#).

Description
The STC-2000A provides both automatic control of single or multi-layer film deposition in either aproduction or development environment and improved predictability and repeatability of deposited film
characteristics through dependable digital control of the deposition process. It runs unattended in the fully
automatic mode and provides a wide number of benefits including performance limit access and setting by
the end user.

SECTION 1.1

DESCRIPTION OF SYMBOLS.note thefollowing
warning/safety/caution symbols [desc. of each].

Please familiarize yourself with the following warning/safety/caution symbols found within this manualand their general meaning:

Note: Highlights an important fact or condition.
Note

CautionStaticSensitive

Caution: Warns of a condition that could cause damage to deposition controller, connected or
associated equipment. Also warns if some action taken could result with an undesireable and/or
unexpected outcome.

or! : Warns of a condition that will likely cause damage to the deposition controller, connected or
associated equipment. Also warns of a possible unsafe situation for the user. Examples are static
sensitivities, maximum component ratings, broken fuses, etc.

orHazardous: Warns of a condition that is hazardous to user, deposition controller, connected or associatedVoltages
equipment.
Present

SECTION 1.XX

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SECTION 1.2

MANUAL DESCRIPTION.[please read and understand this manual before proceeding w/ equipment useage].
Please read and understand the contents of this manual before proceeding with equipment useage in aworking system. This manual will take the reader through the appropriate setup and example steps,
providing along the way, an understanding of how the STC-2000A instrument is used. A test mode isavailable from the SERVICE menu for simulated out of system experiments. Crystal sensor headinformation is simulated (actually rate info is simulated for the film) allowing setup of various
parameters/programming elements without crystal failure halting the simulated process. The power supply
control voltage output is, however, active while in the test mode. All these terms will be described shortly.
This manual is organized into a number of main sections: specifications, generalized overview,
menu programming specifics and setup, hardware setup, detailed host communications, microbalance
theory and maintenance. If any further assistance is needed, please contact Sycon (see section 1.6).
The specifications section describes STC-2000A product specifics, both hardware and software,
along with related necessary and optional product specifics. The software specifics include programmableparameter lists.
The generalized overview section answers the what, the how is it used and the how does it work
questions about the STC-2000A, that is, the solutions this product can provide. This section is intended to
discuss the concepts of main functions and elements with only enough detail to make the conceptualization
clear. In addition, rudimentary specifics are given in a number of other areas as an introduction or a primer
for the next section. This is information you typically only need to look at once. Experienced users (thosefamiliar with deposition controllers) should at least thumb through this section to take an inventory of whatis available.
The menu programming specifics and operational details section provides detailed information
about product programming. Experienced users (those familiar with deposition controllers) may decide tostart here. If some elements are unclear, check back to the previous section. The table of contents and index
are helpful in this pursuit. This section provides descriptions for the programming of film parameters andprocess steps, descriptions of menu navigation, descriptions of screens, descriptions of fixed front panelkeys, descriptions of run modes, parameter details, memory defaults, programming summaries, etc.
The hardware setup section describes and illustrates connectors, interconnections, peripherals,mechanical connections, and the STC-2000A as a component in a larger system.
Detailed host communications are found in section 6.
See section 7 for Microbalance theory and thickness reading calibration with its attendant density,z factor (a material reference table of elements is included) and tooling determination. Each section builds
on the previous sections such that no new elements are used that haven't been defined.
.Some sage advice that isseldom heeded.

If all else fails
read the manual.

You can lead a customer to water
but you can't make them read themanual.

.
The following is text box contains a Quick Index to information for those who are familiar with and know
how to use the STC-2000A. PLEASE BE ADVISED THAT USE OF THE STC-2000A AND
RELATED EQUIPMENT CAN PRESENT MANY HAZARDOUS SITUATIONS WITH SAFETY
CONCERNS THAT INCLUDE ELECTROCUTION AND EXPLOSION. DO NOT USE THE STC2000A AND RELATED EQUIPMENT WITHOUT FULLY UNDERSTANDING HOW THEY ARE
USED. If you don't fully understand how to use this equipment, the Quick Index can be incorrectly
used to create a dangerous situation rapidly. The best method of learning instrument use is to read themanual and exercise the STC-2000A, disconnected from any system, as its features are described.

SECTION 1.XX

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cautions

p STC-2000A DEPOSITION CONTROLLER y
Quick Index
If you are already familiar with and know how to use this product, proceed in this section.
What do you need to do?
[also, consult table of contents and index][see cautions on previous page]

1. Basic System Functionalitya) Select between Process Sequencing and process Non-sequencing.
b) Invoke the Test Mode.
c) Invoke the manual mode.
d) Set up host port communications.
1) user programmable settings.
2) physical connections
3) communication protocols and commandse) Set LCD bias/contrast.
f) Set unit time/date.
g) View installed options information.
h) Configure FILM, PROCESS, and MAP parameters.
i) Set BEEPER on/off.

2. Working Process Functionalitya) Runtime Screen, STATUS key & screens: Alternate Runtime, indexer & channel screens.
b) Select Crystal sensor.
1) Sensor connections.
c) Power supply control.
1) Power supply connections.
d) Adjust power level manually (in manual mode).
e) Input card control.
f) Output card control.
g) Select and Run an I/O program.
h) Write an I/O program.
i) Shutter control.
j) Select crystal stability indicators L/Q, etc.
k) Select / use Sample and Hold.

3. Memorya) Purge the user programmed memory.
b) Set user programmed memory to factory settings.
c) Download user programmable and system parameters to a memory module.
d) Upload user programmable and system parameters from a memory module.
e) Checksums of user programmed parameters.

4. Additional Process Parametersa) View or program I/O programming.
b) View process accounting history.

5. Essential Hardware and Programmed Parameters, Error Conditionsa) Missing or failed Source Sensor Card.
b) Minimum parameter values in non-sequencing mode.
c) Minimum parameter values in sequencing mode.
d) Input/Output card setup.
e) Memory module/memory module interface card setup.
[Useage example: What do you want to do? Set LCD contrast. Find this on above list at 1.e). Turn to Section 10.XX andfind 1.e) description, etc.](If you don't know how to use this product but still think you know what you are doing, don't use the above)

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Turn toSection10.xx

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SECTION 1.3

TABLE OF CONTENTS

TITLE PAGE................................................................................................................................................ 1
WARRANTY ................................................................................................................................................ 3
INTRODUCTION [1.XX] ............................................................................................................................ 4
SECTION 1.0 ................................................................................................................................................ 4
Unpacking Instructions........................................................................................................................... 4
SECTION 1.1 ................................................................................................................................................ 4
Description of Symbols Found in Manual .............................................................................................. 4
SECTION 1.2 ................................................................................................................................................ 5
Manual Description: Usage, Organization, Section Contents Summary ............................................... 5
Quick Index (initial table of keys)......................................................................................................... 6
SECTION 1.3
TABLE OF CONTENTS ...................................................................................................... 7
SECTION 1.4 .............................................................................................................................................. 13
STC-Spare Parts (included w/ STC-2000A) ......................................................................................... 13
STC-Optional Parts .............................................................................................................................. 13
SECTION 1.5 .............................................................................................................................................. 13
STC-Optional Crystal Sensor Parts...................................................................................................... 13
SECTION 1.6 .............................................................................................................................................. 14
Contact Information ............................................................................................................................. 14
SECTION 1.7 .............................................................................................................................................. 15
Product Specifications.......................................................................................................................... 15
SECTION 1.8 ............................................................................................................................................. 16
Programmable Parameter Lists........................................................................................................... 16
Programmable Parameter Dependency Lists ..................................................................................... 19
SECTION 1.9 .............................................................................................................................................. 21
Sensor Specifications............................................................................................................................ 21
SIMPLE QUICK GENERALIZED OVERVIEW [2.XX] ..................................................................... 23
SECTION 2.0 .............................................................................................................................................. 23
For What Is The STC-2000A Used? [The Problem, The Solution] ...................................................... 23
SECTION 2.1 .............................................................................................................................................. 24
How Is It Used? .................................................................................................................................... 24
SECTION 2.2 .............................................................................................................................................. 28
How Does It Work? .............................................................................................................................. 28
Hardware Setup Discussion ................................................................................................................. 32
Sensor Head: Hardware Generalizations............................................................................................. 34
Power Supply Connection .................................................................................................................... 36
Strip Chart Recorder Connection......................................................................................................... 36
RS-232 Communications Connection ................................................................................................... 36
Grounding Stud .................................................................................................................................... 37
Input Card Options............................................................................................................................... 37
Installation/Removal Of Sensor Cards, Input Cards, Output Cards .................................................... 38
Pendant (hand controller) .................................................................................................................... 39
LCD Contrast/Bias ............................................................................................................................... 39
Graphical Display ................................................................................................................................ 40
Mounting .............................................................................................................................................. 40
System Hardware Connections............................................................................................................. 40
Programmable Hardware Setup Discussion ........................................................................................ 40
Select RunTime Mode: Sequencing/Non-Sequencing, Manual Mode, Test Mode............................................ 40
Memory Storage of Menu Parameters ............................................................................................................... 41
Films & Processes / Active, Non-Active ........................................................................................................... 41

SECTION 1.XXe page 7 of 292 ^p STC-2000A DEPOSITION CONTROLLER y
Menu Parameter Dependencies.......................................................................................................................... 41
Tooling: Material Density & Z-Factor............................................................................................................... 41
Power Related Menu Parameters ....................................................................................................................... 42
Power Related Menu Parameter Dependencies ................................................................................................. 43

Initial Programming Setups (menu parameters) .................................................................................. 44
Menu Parameter Values & Programming After Memory Purge........................................................................ 44
Menu Parameter Values & Programming After Factory Restored Memory ...................................................... 45

I/O Programming Introduction ............................................................................................................ 46
Boolean Logic Discussion ................................................................................................................................. 47
Simple I/O Program Examples .......................................................................................................................... 48

How To Develop I/O Programs............................................................................................................ 51
MENU PROGRAMMING AND OPERATION DETAILS [3.XX] ...................................................... 53
SECTION 3.0 .............................................................................................................................................. 53
LCD Touch Panel Overlay ................................................................................................................... 53
Front Panel Definitions ........................................................................................................................ 54
SECTION 3.1 .............................................................................................................................................. 62
Navigating Through STC-2000A Menus .............................................................................................. 62
Menu Tree............................................................................................................................................. 63
SECTION 3.2 .............................................................................................................................................. 64
RunTime Screen Description ................................................................................................................ 64
SECTION 3.3 .............................................................................................................................................. 66
Main Menu Description........................................................................................................................ 66
SECTION 3.4 .............................................................................................................................................. 69
Films And Processes............................................................................................................................. 69
SECTION 3.5 .............................................................................................................................................. 69
Film Edit/Review Mode ........................................................................................................................ 69
Film Parameter Checksum................................................................................................................................. 73
Film Parameter Lock Code ................................................................................................................................ 73
Film Parameter: Source Sensor Map Select....................................................................................................... 74
Review SS MAP................................................................................................................................................ 74
Selecting the Active Film in Non-Sequencing Mode......................................................................................... 75

Detailed Film Parameter Descriptions ................................................................................................ 76
Detailed Map Parameter Descriptions................................................................................................. 84
SECTION 3.6 ............................................................................................................................................. 88
Editing Processes................................................................................................................................. 88
Process Lock Code ............................................................................................................................................ 98
Factory Restoration vs. Purged Settings ............................................................................................................ 98
Changing Memory Settings ............................................................................................................................... 98

SECTION 3.7 .............................................................................................................................................. 98
Set Active Process................................................................................................................................. 98
SECTION 3.8 .............................................................................................................................................. 99
Non-Sequencing Differences ................................................................................................................ 99
SECTION 3.9 ............................................................................................................................................ 102
Software Controlled RunTime Screen Keys........................................................................................ 102
L/Q key (Crystal Quality) ................................................................................................................................ 102
SMPL key (Sample and Hold)......................................................................................................................... 102

SECTION 3.10 .......................................................................................................................................... 103
Manual Power Control....................................................................................................................... 103
Using Pendent.................................................................................................................................................. 103
Using LCD keys .............................................................................................................................................. 105

SECTION 3.11 .......................................................................................................................................... 106
STC-2000A Shutter Delay .................................................................................................................. 106
SECTION 3.12 .......................................................................................................................................... 106
Deposition Source Control Loop Description .................................................................................... 106
SECTION 3.13 .......................................................................................................................................... 108
Film Phases And Parameter Groups.................................................................................................. 108
SECTION 3.14 .......................................................................................................................................... 109

SECTION 1.XXe page 8 of 292 ^p STC-2000A DEPOSITION CONTROLLER y
System Configuration ......................................................................................................................... 109
SECTION 3.15 .......................................................................................................................................... 110
Detailed System Configuration Related Parameters .......................................................................... 110
SECTION 3.16 .......................................................................................................................................... 112
Communications Configuration Related Parameters......................................................................... 112
Detailed Communications Configuration Related Parameters......................................................................... 113

SECTION 3.17 .......................................................................................................................................... 115
STC-2000A Crystal Failure Processing ............................................................................................. 115
SECTION 3.18 .......................................................................................................................................... 119
Process Accounting ............................................................................................................................ 119
SECTION 3.19 .......................................................................................................................................... 121
OPTions/INFo .................................................................................................................................... 121
Checksum Validation ........................................................................................................................ 122
Checksums And Parameters After Purge............................................................................................ 123
SECTION 3.20 .......................................................................................................................................... 125
Memory Module Programming & Usage ........................................................................................... 125
Memory Module Data Transfer ....................................................................................................................... 127
Memory Module Placement............................................................................................................................. 128

SECTION 3.21 .......................................................................................................................................... 129
Programming Example....................................................................................................................... 129
Entering The TEST Mode................................................................................................................................ 129

SECTION 3.22 .......................................................................................................................................... 137
Product Programming Summary........................................................................................................ 137
ELECTRICAL CONNECTIONS AND DESCRIPTIONS [4.XX] ..................................................... 142
SECTION 4.0 ............................................................................................................................................ 142
Sensor Head Installation .................................................................................................................... 142
SECTION 4.1 ............................................................................................................................................ 145
Electrical Connections And Descriptions........................................................................................... 145
SECTION 4.2 ............................................................................................................................................ 145
Line Power ......................................................................................................................................... 145
SECTION 4.3 ............................................................................................................................................ 145
Rack Mounting.................................................................................................................................... 145
SECTION 4.4 ............................................................................................................................................ 146
Vacuum System Grounding ................................................................................................................ 146
SECTION 4.5 ............................................................................................................................................ 147
Sensor Connections ............................................................................................................................ 147
SECTION 4.6 ............................................................................................................................................ 147
Analog Control Voltage Connections................................................................................................. 147
Control Voltage Output Connection................................................................................................... 147
SECTION 4.7 ............................................................................................................................................ 148
Analog Recorder Output Connection ................................................................................................. 148
Analog Recorder Output Specifications ............................................................................................. 148
SECTION 4.8 ............................................................................................................................................ 150
I/O Interface ....................................................................................................................................... 150
SECTION 4.9 ............................................................................................................................................ 153
Relay Outputs (Factory I/O Program) ............................................................................................... 153
SECTION 4.10 .......................................................................................................................................... 154
Remote Inputs (Factory I/O Program) ............................................................................................... 154
SECTION 4.11 .......................................................................................................................................... 154
RS-232 Serial Communications Interface........................................................................................... 154
SECTION 4.12 .......................................................................................................................................... 155
Communications Options ................................................................................................................... 155
I/O PROGRAMMING [5.XX]................................................................................................................ 156
SECTION 5.1 ............................................................................................................................................ 156

SECTION 1.XXe page 9 of 292 ^p STC-2000A DEPOSITION CONTROLLER y
I/O Programming Introduction .......................................................................................................... 156
SECTION 5.2 ............................................................................................................................................ 160
Boolean Definitions ............................................................................................................................ 160
SECTION 5.3 ............................................................................................................................................ 161
States And Events ............................................................................................................................... 161
SECTION 5.4 ............................................................................................................................................ 166
Steady State vs. Edges ........................................................................................................................ 166
SECTION 5.5 ............................................................................................................................................ 166
Input Functions................................................................................................................................... 166
SECTION 5.6 ............................................................................................................................................ 167
Output Functions ................................................................................................................................ 167
SECTION 5.7 ............................................................................................................................................ 167
Softnodes And Sync Events ................................................................................................................. 167
SECTION 5.8 ............................................................................................................................................ 168
Internal Operations ............................................................................................................................ 168
SECTION 5.9 ............................................................................................................................................ 169
Operate Menu..................................................................................................................................... 169
SECTION 5.10 .......................................................................................................................................... 169
Memory Menu..................................................................................................................................... 169
SECTION 5.11 .......................................................................................................................................... 170
Editing An I/O Program ..................................................................................................................... 170
I/O Programming Tree ....................................................................................................................... 172
SECTION 5.12 .......................................................................................................................................... 175
I/O Setup Edit Menu ........................................................................................................................... 175
SECTION 5.13 .......................................................................................................................................... 176
Edit/Change Menu.............................................................................................................................. 176
COMPUTER INTERFACING [6.XX] .................................................................................................. 198
SECTION 6.0 ............................................................................................................................................ 198
Host Port Interface ............................................................................................................................. 198
THEORY AND CALIBRATION [7.XX] .............................................................................................. 266
SECTION 7.0 MEASUREMENT THEORY .................................................................................................... 266
Equation 1 .......................................................................................................................................... 266
SECTION 7.1 CALIBRATION..................................................................................................................... 267
Thickness ............................................................................................................................................ 267
Density Determination....................................................................................................................... 267
Z-Factor Determination ..................................................................................................................... 267
Tooling Dtermination ......................................................................................................................... 267
Material Reference Table:.................................................................................................................. 269
Aluminum Through Indium............................................................................................................................. 269
Indium Intimonide Through Terium ................................................................................................................ 270
Thallium Through Zirconium Oxide................................................................................................................ 271

MAINTENANCE/PROBLEM SOLUTIONS [8.XX]........................................................................... 272
SECTION 8.0 ............................................................................................................................................ 272
Warnings/Cautions ............................................................................................................................. 272
User Correctable System Problems.................................................................................................... 272
SECTION 8.1 REPLACING A SENSOR CRYSTAL ....................................................................................... 274
Cautions/Procedural Steps ................................................................................................................. 274
SECTION 8.2 PERSISTENT CRYSTAL FAIL INDICATION ........................................................................ 274
Discussion .......................................................................................................................................... 274
Hardware Issues................................................................................................................................. 275
SECTION 8.3 FAQS ................................................................................................................................ 276
SECTION 8.4 SYSTEM BATTERY AND MEMORY CONSIDERATIONS ..................................................... 276
Procedure to Change Battery ............................................................................................................. 276

SECTION 1.XXe page 10 of 292 ^p STC-2000A DEPOSITION CONTROLLER y
GLOSSARY [9.XX]................................................................................................................................. 277
QUICK INDEX [10.XX] ......................................................................................................................... 279
Descriptions, etc. - (see prefatory table in section 1.2) ...................................................................... 279
INDEX ....................................................................................................................................................... 287
COPY PARAMETER LISTS.................................................................................................................. 290

FIGURES
Standard Sensors .................................................................................................................................. 21
Sequencing / Non-Sequencing Modes................................................................................................... 26
Process / Film / Map Relationships...................................................................................................... 27
Back Panel Connections (Overview) .................................................................................................... 32
Electrical Connections From Crystal Through Remote Oscillator (Overview) ................................... 34
Input Bd. Jumpers (Overview).............................................................................................................. 37
Installation/Removal Of Back Panel PCB Cards ................................................................................. 39
I/O Programming Notation .................................................................................................................. 48
I/O Programming Description.............................................................................................................. 48
I/O Programming: User Programmable Front Panel Keys/LEDs ....................................................... 49
Example I/O Programs......................................................................................................................... 49
I/O Programming: Modulo 100 Counter Addresses............................................................................. 51
Touch Panel Overlay ............................................................................................................................ 53
Front Panel and Key Descriptions ....................................................................................................... 54
Typical RunTime Screen....................................................................................................................... 55
Status Key Screens................................................................................................................................ 56
Manual Mode Screens .......................................................................................................................... 57
Status Screen Selector Function ........................................................................................................... 60
Start Key Menu ..................................................................................................................................... 60
Start (Key) Process Flowchart ............................................................................................................. 61
Menu Tree............................................................................................................................................. 63
RunTime Screen.................................................................................................................................... 64
Main Menu Screen................................................................................................................................ 66
Executive Menu .................................................................................................................................... 68
Films & Process Storage...................................................................................................................... 69
Review Film Menu................................................................................................................................ 70
Non-Sequencing Mode Screen.............................................................................................................. 75
Rate Sampling, Sample And Hold Operation ....................................................................................... 80
Main Process Review/Edit Screen ........................................................................................................ 88
Service Menu, Memory Configurations ................................................................................................ 98
Setting the Active Process (Sequencing Mode)..................................................................................... 99
Setting The Active Film (Non-Sequencing Mode .................................................................................. 99
RunTime Screen (Non-Sequencing Mode).......................................................................................... 100
RunTime Screen: L/Q ......................................................................................................................... 102
RunTime Screen: Sample & Hold....................................................................................................... 102
Hand Controller/Pendent ................................................................................................................... 103
Manual Power Control....................................................................................................................... 105
Typical Run Cycle............................................................................................................................... 108
System Configuration Screens ............................................................................................................ 109
Communications Menu Screen ........................................................................................................... 112
Process Accounting Screens............................................................................................................... 119
Options Info Screens........................................................................................................................... 121
Memory Module.................................................................................................................................. 125

SECTION 1.XXe page 11 of 292 ^p STC-2000A DEPOSITION CONTROLLER y
RunTime Screen With Test Mode Enabled ......................................................................................... 129
Electrical Connections To Back Panel ............................................................................................... 142
Crystal Head Mounting ...................................................................................................................... 142
Rear Panel.......................................................................................................................................... 145
Recommended System Grounding ...................................................................................................... 146
Rate Mode Recorder Output............................................................................................................... 149
I/O: Input Configuration Jumpers ...................................................................................................... 150
I/O: Input Configuration Jumpers ...................................................................................................... 152
RS232 Interface Cable........................................................................................................................ 155
I/O Programming Menu Screen.......................................................................................................... 156
Relay Ladder Notation........................................................................................................................ 160
Stack I/O Operations .......................................................................................................................... 168
I/O Programming Menu Screen Descriptions .................................................................................... 170
I/O Programming Menu Tree ............................................................................................................. 172
I/O Programming Menu Descriptions ................................................................................................ 173
I/O Programming Edit Menu Description .......................................................................................... 175
I/O Programming EDT/CHG Screens 1-5.......................................................................................... 178
I/O Programming: I/O program Entry ............................................................................................... 181
I/O Programming: Inserting An Empty Rung..................................................................................... 186
I/O Programming: Changing the Rung .............................................................................................. 186
I/O Usage of Hand Controller/Pendent.............................................................................................. 195
Making An RS232 Cable..................................................................................................................... 198
Communications Setup Mode ............................................................................................................. 201
Equation 1 .......................................................................................................................................... 266
Density Calculation ............................................................................................................................ 267
Z-Factor Calculation.......................................................................................................................... 267
Typical Tooling Factors ..................................................................................................................... 268
Sensor Feedthrough Connections....................................................................................................... 275

TABLES
FACTORY SETTINGS, PROCESS PROGRAMS ............................................................................................... 45
BOOLEAN LOGIC ....................................................................................................................................... 47
FACTORY SETTINGS, PROCESS PROGRAMS ............................................................................................... 98
PHASES AND PARAMETERS ..................................................................................................................... 108
CHECKSUMS AFTER PURGED / AFTER FACTORY RESTORED MEMORY ................................................... 123
PRODUCT PROGRAMMING SUMMARY TABLES ........................................................................................ 137
FACTORY RELAY OUTPUT PROGRAM ...................................................................................................... 153
TRUTH TABLE ......................................................................................................................................... 161
EVENT AND STATE ID LIST .................................................................................................................... 162
EVENT AND STATE ID LIST .................................................................................................................... 165
FACTORY INSTALLED I/O PROGRAM ....................................................................................................... 188
MODULO 6 COUNTER PROGRAM ............................................................................................................. 192
FIXED DELAY & PULSE WIDTH I/O PROGRAM........................................................................................ 193
COMMUNICATION PROGRAM WRITTEN IN BASIC ................................................................................... 200
RESPONSE CHARACTER TABLE ............................................................................................................... 202
MATERIAL REFERENCE TABLE ................................................................................................................ 269

SECTION 1.XXe page 12 of 292 ^p STC-2000A DEPOSITION CONTROLLER y
SECTION 1.4.included parts: STC-2000A, power cord, spare parts.

STC-2000A Spare Parts (included with STC-2000A)ASSEMBLY

PART NUMBER

POWER CORD [120 VAC] (1)600-004
FUSES (2 x 2.00A 250VAC F-type)356-014
OPTOCOUPLED INPUTS 25 PIN MALE CONNECTOR (1) 402-222
RELAY OUTPUTS 25 PIN FEMALE CONNECTOR (1)404-020EMI HOOD FOR 25 PIN CONNECTORS (2) .........................404-021
RS-232 9 PIN MALE CONNECTOR (1)..................................404-011
EMI HOOD FOR 9 PIN CONNECTOR (1)..............................404-009
RACK MOUNT EARS (2) ........................................................016-012
RACK MOUNT HDWR (4) ......................................................094-006
MANUAL (this manual)................ ............................................518-031
CONNECTOR KIT / PARTS ....................................................516-017
HAND CONTROLLER (1) .......................................................500-198
COMMUNICATIONS SOFTWARE TOOLS DISK (1) ..........500-046

Optional STC-2000A Hardware / Software
MEMORY MODULE/STRIP CHART INTERFACE PCB
500-212TRANSPORTABLE MEMORY MODULE (32K) .................500-210
TRANSP. MEMORY MODULE SOFTWARE FOR PC .........500-TBD
TRANSP. MEMORY MODULE CABLE FOR PC..................500-TBD

SECTION 1.5

Optional Sensor Parts
Description................................................................. Sycon Part Number
Sensor Body (Low Profile) .......................................................550-222
Sensor Cap (Low Profile) ..........................................................550-223
30 inch In-Vacuum Coax Cable ................................................500-024
10 inch In-Vacuum Coax Cable ................................................500-023
Crystals (box of 10) ...................................................................500-117

Standard Feedthroughs
1" BOLT STANDARD .............................................................500-016
2 3/4" ConFlat STANDARD ....................................................500-017

Standard Sensors
LOW PROFILE .........................................................................500-042
RIGHT ANGLE.........................................................................500-088

SECTION 1.XX

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Cables
10' OSC TO CONTROL UNIT CABLE ..................................500-026
30' OSC TO CONTROL UNIT CABLE ..................................500-027
6" OSC TO FEEDTHROUGH COAX CABLE ........................500-025

Crystal / Oscillator Package (includes the following 4 item numbers)

500-109

6" OSC TO FEEDTHROUGH COAX CABLE ........................500-025
10' OSC TO CONTROL UNIT CABLE ..................................500-026
OSCILLATOR UNIT ...............................................................OSC-100A
10 CRYSTALS ..........................................................................500-117

SECTION 1.6

Contact Information

STC-2000A
STC-2000A DEPOSITION RATE CONTROLLER
Sensor Package and Feedthrough Not Included
All prices FOB East Syracuse, New York Terms: Net 30 days

Sycon Instruments, Inc.
6757 Kinne Street
East Syracuse, New York 13057-1215
Telephone(315) 463-5297
Fax(315) 463-5298
WWW.SYCON.COM
Website.optional STC-2000A parts (1.7)
optional sensor parts (1.6)
STC-2000A specifications (1.3).

SECTION 1.XX

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SECTION 1.7

PRODUCT SPECIFICATIONS

STC-2000A Thin-Film Thickness and Rate Controller Specifications
High Resolution
High Accuracy
High Speed
Measurement Range
Standard Sensor Crystal
Sensor Capacity
Displays
Operation

Film Storage (Standard)

External Storage (Optional)

Hardware I/O (Standard)

Computer Interface
Protocols
Analog Outputs:
As Control Output
As Recorder Output

Power Control:
Automatic
ManualRack Mount
Power Requirements
Weight±0.02Hz(5-6MHz), 0.0088 Angstroms/Measurement (for Aluminum)±0.5% thickness + 1 countTen measurements/second
500KA Aluminum Equivalent
6 MHz AT cut, Plano/Convex
2 per sensor PCB card [1 PCB card max.]
240 x 64 pixel monochrome LCD with Backlight
5 discrete indicator LEDs
Menu driven "Windowing Type"LCD Touch Panel (12 x 4 key matrix)
with 6 fixed function membrane keys
and 4 user programmable fixed membrane keys
1 Active Film Program, 49 Alternate Film Programs
Total 50 Film Programs (with 10 Sensor maps)
9 Sequence recipes, 99 steps per recipe, system total is 250 steps
Film Parameters for films 1-50 and System Parameters I/O programs,
and Process Accounting Can be stored in Transportable Data Module(Optional)
per card: 8 SPDT Relays, 1.0 Amp @ 24 VDC Maximum
per card: 8 Optocoupled Inputs (Electrically Isolated), 5-24VDC [4slots for input and/or output cards]
RS-232C (Sycon Format or ASCII)
12 bit resolution (2 outputs on the 1 sensor card, each for use as control
or recorder)
2.5, 5, 10 volt @10ma. isolated output with range
menu programmable (maximum 2 control outputs per sensor card)
0 to 10 volt @ 10ma, isolated, function programmable(rate, thickness, power, deviation, computer remote) (maximum 1
recorder output per sensor card and per system)

Three Mode Closed Loop Control (PID)
Hand Controller
half width rack mount (std.). 3 1/2" H, 8 5/8" D, full rack extender is
optional
90-264VAC, 50-60Hz (1.4A rms@120VAC, 0.7A rms@230VAC)
equal to or less than 4.7 lbs. depending upon installed options [standard
with: 1 Sensor card, 1 Input Card, 1 Output Card] Sensor card=0.216 lbs.,
Input card=0.135 lbs., Output card=0.14 lbs.

Operating Range
Humidity

SECTION 1.XX

0 to 38°C ambient (power supply/LCD display), 0 to 30°C ambientwith ventilation slots restricted
non-condensing: 5% - 85% RH

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SECTION 1.8

Programmable Parameter Lists(1.4).
__________________________________________________________________
key examples:
Abbreviated Menu Name
Full Parameter Name ⇒Parameter Name⇒
Param N
(text) ⇒ implied parameter text in parenthesis__________________________________________________________________

Film Parameter List:
Review Film (Edit Film)[Menu end point: Review Film

Menu path: Main/Review Film](Material) Density
0.40 to 99.99 gm/cc(Material) Z-Factor
0.100 to 9.999
Setpoint Thickness Limit
0.000 to 999.999 KÅ
Final Thickness Limit (Trigger)
0.000 to 999.999 KÅ (non-sequencing only)
Setpoint Time Limit
0:00 to 99:59 MM:SS
Soak 1 Power level Value
0.0 to 100.0%
Power Ramp 1 Time (to pwr level) 0 to 99:59 MM:SS
Power Soak 1 Time (@ pwr level) 0 to 99:59 MM:SS
Soak 2 Power level Value
0.0 to 100.0%
Power Ramp 2 Time (to pwr level) 0 to 99:59 MM:SS
Power Soak 2 Time (@ pwr level) 0 to 99:59 MM:SS
Soak 3 Power level Value
0.0 to 100.0%
Power Ramp 3 Time (to pwr level) 0 to 99:59 MM:SS
Deposit Rate (requested)
0.0 to 999.9 A/S
Rate Ramp Mode
OFF / ONNew Deposit Rate (Value)
0.0 to 999.9 A/S
Rate Ramp Time (Duration)
0:00 to 99:59 MM:SS
Rate Ramp (Thickn) Trigger Point 0 to 999.999 KÅControl Loop –Proportional term- 1 to 9999
Control Loop –Integral term0.0 to 99.9 sec
Control Loop –Derivative term0.0 to 99.9 sec
Max Power Limit
0.0 to 100.0%
Abort Max Power SWitch
OFF/ONMax Power Dwell
0:01-99:59 MM:SS
Shutter Delay Mode
OFF, ON
Shutter Delay TIMEOUT
0:01-99:59 MM:SS
Shutter Delay QUALITY
1-50%(XTAL) RATE SAMPLING
OFF,TIMED,INTELL.
(XTAL) SAMPLE INTERVAL
0:01-99:59 MM:SS(XTAL) SAMPLE DWELL TIME 0:01-99:59 MM:SS(XTAL) SAMPLE QUAL
1-50%
(XTAL) SAMPLE ALARM TIME 0:01-99:59 MM:SS
FILM Fail Mode
ABORT IF FAIL, TIME POWER
Control Loop Qual Limits
0 to 9XTAL Stability S (Limits)
0 to 9XTAL Life Bounds
0.0-100.0%
Plot Vert Scale Volts
1, 5, 10, 50, 100
Plot Horiz Scale H
1 to 600 samples
Data Plot Type
Rate /Rate Deviation /Power
Source Sensor MAP SELECT
1 - 10SECTION 1.XX

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ble parameter listp STC-2000A DEPOSITION CONTROLLER y
POCKET SELECTETCHING MODE

0 – 63 Pockets
OFF/ON[Menu end point: Review Processes

Process Step elements:

Review Processes (Edit Process)(Edit Process Steps [1-99]) Mode (Skip, Stop, Auto,
End, Wait), Film# (1-50), Thickness (0.0 - 999.999 KÅ)[Menu end point: Main Menu

Main Menu values:

Menu path: Main/Review Processes]

Next Active Process (Select)*
Next Active Film (Select)*Menu path: fixed front panel MENU key/ Main Menu]

1 of 9 processes [sequencing mode only]
1 of 50 films [non-sequencing mode only][*NOTE: press review ______ touch key, then press GO2 ____ to select any one of the 9 processes, 10 maps or 50 films]

RunTime Screen parameters:[Menu end point: RunTime screen

Menu path: programming Menu/ fixed front panel STATUS key/RunTime screen](Crystal Quality Indicator Select) L/Q, Loop x, Qual xx(Crystal Sample Select)(not selected [blank]), SMPL, SMPL+Time, HOLD+Time
START key sequence (fixed front panel) (Note PROCess X: message change after each START process key press)2
STOP key (fixed front panel)
Stops the running process (non-seq mode: stops the 1 inherent process [film])
MANUAL key (fixed front panel)
Switches to manual mode from a running process only. Toggle action.
Zeroes the thickness value
ZERO key (fixed front panel)
Switches from RunTime screen to MAIN menu screen
MENU key (fixed front panel)
Switches to RunTime screen from any menu screen, to large character Run
STATUS key (fixed front panel)
Time, detailed power and crystal info screens from RunTime screen

zero channel 1-2, zero all [2nd STATUS key press from RunTime]zero channel 1-2, zero all, re-verify [3rd STATUS key press from RunTime]fail channel 1-2, fail all, re-verify [3rd STATUS key press from RunTime]

Zero Power [non-active process]Zero Thickness1
Force Fail [non-active process]1

Zero thickness does not affect film thickness value, only Source Sensor card value (use to set tooling factor, diagnose
problems, etc. )2
If the PROCess X: status message does not change when the START key is pressed, check for "STOP: INValid XXX "message or check the OPT/INF menu, page 2 for cards not installed which are enabled in software (MIA). Cycle AC power
OFF ON to re-sync.

System Configuration values:
LCD Contrast / Bias
Password Lock #(Process) Run Number
Recorder Function
Recorder Out Channel
Real Clock Time
Real Clock Date
I/O Slot 1 TypeI/O Slot 2 TypeI/O Slot 3 TypeI/O Slot 4 Type
Memory Module IFC

Communication values:

Absolute Rate, Rate Deviation, Power, Thickness, Computer Remote, I/O Control, Off1 – 2 selects an analog output channel for use (if not off and not used as a source)

HH/MM
MM/DD/YY
UNUSED (DISABLED) / INPUT / OUTPUT
UNUSED (DISABLED) / INPUT / OUTPUT
UNUSED (DISABLED) / INPUT / OUTPUT
UNUSED (DISABLED) / INPUT / OUTPUT
OFF/ON[Menu end point: Comm. Setup

Source Sensor Map elements:

SECTION 1.XX

Menu path: Main/Executive menu/System Configuration]

LOW, MEDIUM, HIGH
0 - 9999
0 to 9999

COM/IO Lock Code
Keyboard Beep
RS232 Baud Rate
RS232 Protocol

Source Sensor Full Power Volts[Menu end point: System Config

Menu path: Main/Executive menu/Communications Setup]

0 - 9999
OFF / ON
300, 1200, 2400, 9600
Sycon, ASCII[Menu end point: Review SS Map

2.5, 5, 10 full scale volts

page 17 of 292

Menu path: Main/Review SS Map]

p STC-2000A DEPOSITION CONTROLLER y
Source Sensor Max Power Value 0.0% - 100.0%
Source Sensor Analog Output Chnl 1 – 2 Channel Selection
Master Tooling Value
10.0% - 400.0%
Minimum Start Xtal Channels
1 – 2 minimum channels
Minimum Backup Xtal Channels 0 – 1 minimum channels
Minumum Active Xtal Channels 1 – 2 minimum channels(Xtal) Channel Drop Filter
NONE, BALANCE [Mask dropped Xtal channel Failure] averaging mode only
Indexer Synchronization Mode
NONE, DELAY, FEEDBACK
Indexer Synchronization Time2 – 999 seconds
Channel 1 Start Mode
OFF, ACTIVE, STANDBY
Channel 1 Fail Action (Mode)
NONE, ABORT FILM
Channel 1 Backup List
X – XX (1 item list to 2 item list), [where X = 1 to 2 (in each position
w/o redundancies, list extends to 0-2 for a 1 item list)]
Channel 1 Tooling Value
10.0% - 400.0%
Channel 1 Weight
10.0% - 400.0%
Channel 2 Start Mode
OFF, ACTIVE, STANDBY
Channel 2 Fail Action (Mode)
NONE, ABORT FILM
Channel 2 Backup List
X – XX, [X = 1 to 2 (in each position w/o redundancies)] see CH1
Channel 2 Tooling Value
10.0% - 400.0%
Channel 2 Weight
10.0% - 400.0%

I/O Function elements:
I/O Relay Functions
I/O Input Functions
I/O Setup
I/O Programming(Front Panel LEDs [4 discrete])(User Front Panel Keys [4])Pendent Keys

Service Menu values:(Test Mode Select)(Seq/Non-seq Mode Select)(Memory Contents)(Reset)[Menu end point: I/O Setup

Menu path: Main/Executive menu/ I/O Setup]user I/O program (8 Form C Relays per card [4 slots available for I or O cards])
user I/O program + PCB jumpers (8 Inputs per card [4 slots for I or O cards])
Memory: save/swap, Operate: run/stop
Edit (Program): IN, NOT, AND, OR, XOR, POSitive, NEGative,
OUT, TRiP, SET, CLeaR, ARM, DRoP, (events/states/logicaloperators), (softnodes) and (numeric elements).
Arithmetic operators/elements: KON# (to input constants), ADD,
SUBtract, MULtiply, DIVide, MODulus, EQUals, GReaTer than,
LESs than, and SELect. Editing: backspace, left/right arrows (to move
cursor), delete, undo, insert/delete line.
I/O programming elements (see table x in section 5xx and Section 2.2)
I/O programming elements (see table x in section 5xx and Section 2.2)
(beyond specified Manual Mode use: I/O programming elements[see table xxx in section 5xx ])[Menu end point: Service

Menu path: Main/Service]

Test Off, Test On [Test Mode won't remain in effect if power is cycled)
Seq(uencing Mode Select en)able, Non-seq(uencing Select enabled)
as is (no modification), purged, factory (defaults) [see section x.2.2xx ],Memory Module to Unit or Unit to Memory Module [see section 3.20]
Arm reset, reset armed [Provide a product reset when back panel powerswitch is not accessible. Also, use to generate ACCEPT key if notpresent (e.g. to end the Test mode when in the Test mode).][Prerequisite states that must be in effect for the following parameters to be fully functional]

SECTION 1.XX

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Film Parameter Dependency List:
Material Density
Not Applicable
Material Z-Factor
N.A.
Setpoint Thickness Limit
N.A.
Final Thickness Limit (Trigger)
Service Menu Parameter: Non Seq / Accept
Setpoint Time Limit
N.A.
Soak 1 Power level Value
N.A.
Power Ramp 1 Time (to pwr level) N.A.
Power Soak 1 Time (@ pwr level) N.A.
Soak 2 Power level Value
N.A.
Power Ramp 2 Time (to pwr level) N.A.
Power Soak 2 Time (@ pwr level) N.A.
Soak 3 Power level Value
N.A.
Power Ramp 3 Time (to pwr level) N.A.
Deposit Rate (requested)
N.A.
Rate Ramp ModeN.A.
New Deposit Rate Value
Film Parameter: Rate Ramp Mode = ON
Rate Ramp Time Duration
Film Parameter: Rate Ramp Mode = ON
Rate Ramp (Thickn) Trigger Point Film Parameter: Rate Ramp Mode = ON
Control Loop –Proportional term- N.A.
Control Loop –Integral termN.A.
Control Loop –Derivative termN.A.
Max Power Limit
N.A.
Abort Max Power SW
N.A.
Max Power Dwell
Film Parameter: Abort Max Power SW = ON
Shutter Delay ModeN.A.
Shutter Delay TIMEOUT
Film Parameter: Shutter Delay Mode = ON
Shutter Delay QUALITY
Film Parameter: Shutter Delay Mode = ON(XTAL) RATE SAMPLING(XTAL) SAMPLE INTERVAL

N.A.
(Film Parameter: (XTAL) RATE SAMPLING = TimedorFilm Parameter: (XTAL) RATE SAMPLING = Inteli)(XTAL) SAMPLE DWELL TIME Film Parameter: (XTAL) RATE SAMPLING = Timed(XTAL) SAMPLE QUALFilm Parameter: (XTAL) RATE SAMPLING = Inteli(XTAL) SAMPLE ALARM TIME Film Parameter: (XTAL) RATE SAMPLING = Inteli
FILM Fail Mode
N.A.
Control Loop Qual LimitsN.A.
XTAL Stability S LimitsN.A.
XTAL Life Bounds
N.A.
Plot Vert Scale Volts
N.A.
Plot Horiz Scale H
N.A.
Data Plot Type
N.A.
Source Sensor MAP SELECT
N.A.
POCKET SELECTN.A.
ETCHING MODE
N.A.

Main Menu value Dependency List:
Next Active Process (Select)1

Service Menu: Sequence Able + Accept keys (for Sequencing Mode)2
If N/A, must use START + Reset / Start Proc keys to start a process.
Service Menu: Non-Sequence + Accept keys (Non-Sequencing Mode)2
Next Active Film (Select)1
Review Process (Select)Service Menu: Sequence Able + Accept keys (for Sequencing Mode)2
Review Film (Select)
N.A.
Review Source/Sensor Map (Sel) N.A.

SECTION 1.XX

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1[NOTE : press to invoke number entry submenu, sequence of 1 or 2 digits is entered or discarded]
2

Note : [the Seq Able / Non Seq key shows the current mode upon entry into theService menu, changing the mode toggles key text and generates the Accept
key that in turn needs to be pressed to accept new mode described on the key
in text]

RunTime Screen parameter Dependency List:(Crystal Quality Indicator Select)(Crystal Sample Select)(Crystal Select)(Process X)

L/Q, Loop x, Qual xx Film Parameters
Film Parameter: (XTAL) Rate Sampling = Timed or Intelligent?
Running in deposit mode
System Config Parameter: Need Source/Sensor Card 1
Review Source Sensor Map Element Parameters:
Minimum Start Xtal Channels
Minumum Active Xtal Channels
Channel X Start Mode
Main Menu Parameter: [Next Process] Digit
Fixed Front Panel START key: sequence from N/A to 1
Service Menu: SEQuence enABLE [sequencing mode]

Layer X (layer = step)

Review Processes X: EDIT: CHANGE, INSERT, DELETE Layers/steps

FILM

Service Menu: SEQuence enABLE [sequencing mode]
Review Processes X: EDIT: CHANGE, INSERT, DELETE films [sequencing mode](Manual mode)
MAP#
SRC x

Review Film X: [non-sequencing mode]
Running Process + Pressing fixed front panel MANUAL key +attached Pendent
Film Parameter: Review Source/Sensor Map SelectReview Source/Sensor Map Parameter: Source Analog Output Channel
Film Parameter: Source/Sensor Map Select (select the map that
contains the above selected Source Analog Output Channel)
NOTE: If SRC is zero, this is an indication that a source analog output control voltage
has been assigned to a source sensor card that is not present, not working, etc.
Remember that the Source/Sensor Card presence and System Configuration parameter:
I/O Slot X type are only evaluated on power up or on reset. Check the OPTions/INFo
menu, page 2 and 3 to see what is currently in effect. To work correctly, the S/S card
must be present and communicating correctly. If the line ends with INCOMPATable!, thesoftware versions in at least some of the various PCB cards is not compatible- check forfield changed PCB cards. If the line ends with MIA, that sensor card is configured but is
not present. [See OPTions/INFo menu]

RUN, PHASE

RUN x
TIME/Day of Week/DATE
Graph(process start)(Test mode) [to enter](Test mode) [to exit]

automatic up/down timers. Function when process/film is started(START key sequence). Effected by film parameters that control film
phases within the deposition cycle.
System Configuration Parameter: Run Number
System Configuration Parameters: Clock Time, Clock Date
Film Parameters: Plot Vert Scale Volts, Plot Horiz Scale H,
Data Plot Type
Carry out the following 2 key sequence up to 3 times.
Press the fixed front panel START key + 1 of 4 touch panel keys:
Break Wait, Next Layer, Restart Layer, Reset / Start Process(see figure in end of section 3.0). Use the appropriate touch key for thetask at hand. If unsure, use Reset / Start Process key in all 3 sequences.
Please read and understand this manual before starting a live process.
Service Menu: Test Off ⇒ Test On (text toggles) + Accept
Service Menu: Arm Reset ⇒ Reset Armed (text toggles) + Accept

Password Dependencies:(Communications values)

SECTION 1.XX

Main Menu/ Executive Menu/ Communications Setup: Com/IO Lock
Code [non-zero value enables the password dependency and is itself thepassword.]**page 20 of 292

p STC-2000A DEPOSITION CONTROLLER y(I/O parameters)(all other parameters)

Main Menu/ Executive Menu/ Communications Setup: Com/IO Lock
Code [non-zero value enables the password dependency and is itself thepassword.]**Main Menu/ Executive Menu/ System Configuration: Password Lock #[non-zero value enables the password dependency and is itself thepassword.]****Note: If password is forgotten and programming has not been saved in someother media, call factory to eliminate passwords without purging memory.

SECTION 1.9.sensor specs(1.5).

Sensor Specifications
Low Profile P/N 500-042

Right Angle P/N 500-088

Figure 2.1: Standard Sensors.

Operation
Maximum Temperature ............................................................. 200 °C
Water Line and Coax Length ................................................... 30 inches
Sensor Mounting ...................................................................... Rear of Body, #4-40 Tapped

Feedthrough Installation
Water
Connections ................................................................ Two Required
Type ........................................................................... 1/8 inch OD. Stainless Tubing
Flow Rate .................................................................... 0.2 to 0.3 gal/min.
Water Temp................................................................. 50 °C max.

SECTION 1.XX

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Electrical
Connections ................................................................ One Coaxial Line
Type ........................................................................... MicroDot Miniature

Materials(in VAC)
Body and Water Lines ............................................... 304 Stainless
Insulators .................................................................... Alumina
Coax Insulator ............................................................ Teflon
Coax Conductor and Shields ...................................... Copper/Silver
Braze Material ............................................................ High VAC Ni/CR/Cu Alloy
CrystalQuartz with Gold Electrodes

SECTION 1.XX

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p STC-2000A DEPOSITION CONTROLLER y

SIMPLE QUICK GENERALIZED OVERVIEWSECTION 2.0

The STC-2000A addresses the needs of thin film deposition within the vacuum coating industry.
The main function of the STC-2000A is to provide the means for a controlled and repeatable process,which is the deposition of material on a target surface. [process in which material is deposited on a target
surface.
Without such control, the power [supplies] used to start (or stop) the generation of deposits could beswitched on (or off) at human reaction speeds. Once on, the power [supply] outputs could be altered to vary
the deposit rate, again at human reaction speeds. From the human perspective, the relatively brief timeintervals typically required would be unwieldy at best for accurate control of even a slow process. Thiskind of direct human control also assumes that a time versus deposition rate and final thickness is known
for the various deposited materials. Factor in the many physical elements that effect deposition and thesystem user, with only time based control, would find it extremely difficult at best for even slowly
accumulating thick depositions, and, for thin depositions, impossible to obtain the desired results, muchless the consistent desired results. The first need is to at least monitor the deposition and know the
thickness (and rate) at any point in time. The next is to be able to control the process based on themonitored information in real time such that the reaction time between monitor and control is at the needed
speeds. Fortunately, the needed monitor/calculation/control speed is easily within the range of amoderately priced microprocessor.
The STC-2000A has a microprocessor: on the sensor card and on the communications/control/database/user interface board (includes interconnected displays, keys, touchscreens, etc.). This multiprocessor
approach provides greater bandwidth and dedication to specialized functions with obvious benefits: speed,
control, etc. The microprocessors used are actually microcontrollers, which can include A/D, D/A,
communications, etc. thus providing cost savings and greater reliability because of the higher degree of
integration.
Along with an oscillator and crystal sensor(s), the STC-2000A instrument is the basis of process control
and repeatability within a material deposition system. The STC-2000A can be used to monitor and control
the process manually, or to monitor and control the process automatically.
Utilizing the inherent flexibility of the STC-2000A, there are many possible levels of manual control(requiring human intervention at user determined points in the process). This is also true of the automatic
process mode. During an automated process, for example, an input state or some other condition can bemade to pause the process for user inspection. If satisfactory, the automated process can be resumed byanother preprogrammed user input. In addition, reactions between monitor and control (response time,overshoot control, etching vs. depositing, etc.) can be tailored to meet various requirements by user
programmable parameters (discussed in PID control section).
The material deposited on the target may be from a single element or a compound (alloy) to create single ormultilayered metal deposits, lens coatings, the creation of an alloy combination that has special properties,
metalized plastic, etc. The products range from sunglasses, jewelry, automotive decoration, CDs at the low
end to optical lenses, mirrors, filters, semiconductors, superconductors, metallurgical research, etc. at thehigh end.

SECTION 2.XX

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SECTION 2.1
how is it used ?
First, a few terms and their definitions are needed.
The material to be deposited shall be alternately and henceforth referred to in this manual as an evaporantsource.
The target surface shall be alternately and henceforth referred to as a substrate.
The material is known as an evaporant when it has reached sufficient temperature/excitation to leave thesurface of the source material supply prior to deposition. The STC-2000A automatically, as it monitors
material deposition rate and thickness, controls the power that generates the evaporant within the bounds ofthe user-defined parameters and other programming. The STC-2000A is programmed through an LCD
screen with a touch panel overlay. All choices are made within groups of predetermined menu selection
alternatives or, as in the case of some data entries, bounded by a screen specified range with software
enforcing the range of entry acceptance.
With the crystal sensor[s] in the same space as, but not necessarily in relative close proximity to, thesubstrate, the crystal sensor[s] should accumulate the same amount (or a ratio) of deposited material as thesubstrate. As the crystal frequency is proportionally related to a deposited mass (within specific bounds),
thickness on a substrate can be inferred and deposition rate can be calculated based on thickness values
through the progression of time. [For additional information, search the web using "quartz crystal microbalances".]
Other dependent factors such as the type of material deposited (as reflected in material density and z factor)
and the physical positioning of the crystal sensor[s] (see tooling factor discussion) are also part of thedeposition calculations and are included among the user programmable parameters of the STC-2000A.
In a typical case of evaporant stream generation, a high current (or high voltage) power supply is used toheat the material in a boat, crucible or coiled filament. This power supply is controlled by the control
output voltage of the STC-2000A sensor card. This power supply can thus be controlled through the STC2000A either manually or automatically. Manual mode can be used to setup the system before the automode is employed. The power supply, in this case, is manually controlled while the deposition ismonitored. In non-sequencing mode (defined shortly), the final thickness parameter can be set to terminate
the process when reached (evaporant source shutter closure). The power could be switched off via an
output relay (a poor man's controller). In the auto mode (sequencing mode), a user programmable PID loop
can be used for process monitor/power supply control with a relatively high degree of precision based onneeded system speed elements. All methods of evaporant stream generation need power supply control. A
power supply that is controlled by the STC-2000A typically provides thermal excitation of the target
material by laser, electron beam (accurate control), resistance heating (low cost/complexity) or sputter(large area) deposition, each process type having favorable attributes for specific process goals.
Regarding higher level system control, the STC-2000A can be programmed to function in this capacity(keeping in mind failsafe measures). [On a higher level of system control].
Using one of the four user programmable fixed front panel keys and output relays, gates/valves could beclosed and pumps could be activated as a prelude to the previously described automated process. A
pressure monitoring device would signal the STC-2000A through an opto-input when the pressure wascorrect and the automated deposition would begin. One of the user programmable front panel indicators
could be used to show this and that of other points during the process had been reached.

SECTION 2.XX

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p STC-2000A DEPOSITION CONTROLLER y
Returning to STC-2000A specifics, some additional STC-2000A terminology definitions must now begiven.
Beyond sensor information and power supply control voltage, the STC-2000A also allows the user todefine the other parameters that are critical in the deposition process.
In STC-2000A terminology, a film is defined as a list of user programmable deposition relatedparameters. Typically, one material deposition is accomplished per film (describes specific: material,mechanical setup, timing, etc.). The STC-2000A can store up to 50 films (referred to as a film recipe
library). A process is a list of film implementations. Each film implementation is referred to as a layer (orstep in the process). Process layers can use the same film many times or use any combination of different
films.
The STC-2000A has 2 basic process control modes: sequencing mode and non-sequencing
mode. While in either one of these modes, manual mode (manual control of power) may be invoked. In
addition, a test mode can be employed to simulate (w/ simulated rate information) a crystal sensor input
while in any combination of the modes just described. Simply put, the sequencing / non-sequencing mode
difference is that of having or not having a process. Non-sequencing mode does not have a process (or atleast nothing named as such). Non-sequencing mode uses 1 implicit process which can run 1 film. The
non-sequencing mode is easiest to configure (user programs an active film). The sequencing mode is more
complicated only by the additional programming of a process[es] that calls out a film or films.
The STC-2000A retains the non-sequencing mode for historical compatibility and for simple
depositions.
On the subject of films and processes, that which is referred to as active is that which is queued to
be run when the start sequence is initiated. In other words, except for a co-deposition process, only one
film is being deposited at one time and one process (the active process) is calling out that one film in one ofits steps. When a process is run (start key sequence), it uses the single process that was selected as theactive process (on the Main Menu). Likewise, the film that was selected by the active process as the active
film will become the running film. [The non-sequencing mode has only one inherent unspecified process
and films are manually selected to be active. Only the film selected as active will be run (Main Menu in
non seq mode).] Regardless of mode selection, an active process or active film can be edited (modified)
while a process or film is running but only in a limited manner. This prevents potentially dangerous
situations from occurring. The limitations, that is, the parameters that are not changeable while a process(or film ) is running include the following:
Film parameters: SS Map Select, Pocket Select, Etching Mode.
Map parameters: CH x Start Mode, Source full power, Source out channel, Indexer Sync Mode.
Min ~~~ XTALS [3 parameters] (evaluated at start only except for RE-VERIFY key usage).
Process: Film# of current running step, Process length (no step insertion/deletion).

A seeming inconsistency can apparently arise when in the non-sequencing mode as the STC-2000A can bestarted using the MANUAL key from the idle state or the ready state. The apparent inconsistency would becaused when a parameter, such as the SOURCE FULL POWER (SS MAP REVIEW), is changed andstarted or restarted using the MANUAL key instead of the START key. The MANUAL key, although
legitimate to use, does not update [resync] parameters as they are reflected on the RUNTIME screen.
Likewise, starting [restarting] and stopping a using the MANUAL key will not incorporate changes madeunless the start key (or a system reset, or power on / off cycle) has been employed. Using the MANUAL
key alone continues with the initial parameter settings and does not utilize the changes, in any, that are
made. Otherwise, in other cases or in sequencing mode, an inhibited error message appears when parameter
updates are attempted during an unsafe period.

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p STC-2000A DEPOSITION CONTROLLER y

NON-SEQ MODE

SEQ MODE

1 implicit active process(user selects 1 active film)

1 active process(process selects 1 or more films)
Up to 9 programmable processes

1 ACTIVE FILM
(up to 50 programmable films)
Film parameters define theconstituent elements of thedeposition

In terms of STC-2000A usage, the simplest configurations would be either in sequencing mode with: 1
crystal, 1 oscillator, 1 process, 1 film, 1 material, and 1 deposit or in non-sequencing mode with: 1 crystal,
1 oscillator, 1 film, 1 material, and 1 deposit. Also for these simplest configurations, in either sequencing
or non-sequencing mode, a single sensor input would be employed along with a single control voltage
output (controls power to that which is generating the evaporant). The simplest means of evaporant stream
generation would be resistive heating.
In terms of unit hardware, this translates into an STC-2000A with its single 2 channel sensor card,
1 output card and 1 input card.
In terms of unit software (menu programming), a specific film is either called by a process (insequencing mode) or called directly (in non-sequencing mode). The film, in turn, calls out a specific sensor
map. Only 1 process, only 1 film, only 1 map can be active (running) at a single point in time. A process
can call a different film at each of its steps (or layers) up to 99 steps.

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p STC-2000A DEPOSITION CONTROLLER y(SEQuencing Mode)
Step# (or Layer#)
Mode: Skip, Stop, Auto, End, Wait

Film #
Thickness-OR-

Implicit Process(NON-SEQuencing Mode)

Film #

Density
Z Factor
Setpoint Limits
Rate Ramp Power/Time
Soak Power/Time
Deposit Rate Values
PID Loop
Max Power Values
Shutter Parameters
Rate Sampling Values
Film Fail Mode
Xtal Loop Stability/Quality
Xtal Life Bounds
Graph Plotting Values

Source Power Options
Master Tooling
Xtals: Start, Backup, Active
Xtal Drop Filter Mask
Indexer
Channel X:
Start mode
Fail action
Backup List
Tooling
WeightMap SelectPocket SelectEtchingMode

The typical usage would not be much beyond the simplest case as described above. This would include
more films (implying more materials), multiple deposits of the same or different materials or more
processes. In addition, a multiple crystal head with an integral either/or shutter is sometimes used as an
input to 2 sensor inputs. Although these configurations represent most systems, the capabilities of the STC2000A are beyond these necessities. [A multiple crystal head that is used as an input to a single sensor input is notsupported with this product (no switching with zeroing on a single input, etc.).

Examples of added usage complications would be using (or using more) digital inputs, relays, a second
crystal, a second sensor channel, external I/O voltages, strip chart recorders, communication terminals, ebeam source indexer (model: SRT-400), etc.
A pendent is supplied for some remote front panel functions and manual mode usage. The pendent plugs
into the front panel of the STC-2000A and has a 6 foot coiled cord.
A sensor card has 2 identical sensor inputs and 2 identical analog outputs. The 2 analog outputs, in thissingle sensor card system, are typically used as 1 control output voltage and 1 strip chart output voltage.
[For multiple sensor card useage, the Sycon STC-2002 can be used.] The strip chart recorder output can be
set up on either of the analog outputs but only one strip chart recorder function per system isprogrammatically allowed. Each of the two analog outputs arrive at the external connector in 2 polarities:
isolated and a negative version of the isolated output. A less expensive non-isolated version of the card is
TBD? There is a slot for 1 sensor card only (1 sensor card is standard in the STC-2000A included parts).
Crystal sensor and control voltage output usage has been described above. If one of the analog outputs isalready programmed for strip chart recorder output, a software menu change can convert the strip chart
output into a second isolated control voltage output.
There is a group of 4 slots for either input cards and/or output cards (1 of each type in the first 2 slots are
standard in the STC-2000A). Input cards have 8 opto-coupled inputs. Output cards have 8 form C (SPDT)
relays. Inputs are typically used to trigger events at some meaningful point in the process or to indicate to
the system user that some point has been reached. Outputs (relays) are typically used to open/close
shutters on material sources and crystal sensors, but are also used to control many other valves, relays,

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p STC-2000A DEPOSITION CONTROLLER ysolenoids, etc. The card IDs (software addresses) of the PCBs (sensor, input, output cards) are not unique
within their PCB types nor are they programmed by hardware or software. It is the location into which
they are connected that gives them their unique identity (software address).
A communication port is used to interrogate the STC-2000A. By using a set of commands, various
information can be downloaded or uploaded, front panel control can be simulated, process control can be
modified/stopped/started/driven, etc.
There are also other useages and subuseages. Some other useages would be test mode and rate sample/holdmode.
Multiple material co-deposition is also possible but with a different Sycon product described in its own
manual.

SECTION 2.2
how does it work ?
Be forewarned that the general information contained herein is meant only as an overview of the system.
The information presented here does not adequately describe the many hazardous situations that could
occur brought about by the incorrect constellation of valve states, temperatures, pressures and voltages.
The system needs to have safety provisions should inadvertent human intervention cause changes or shoulda power failure of any or all parts of the system occur. Safety concerns include electrocution andexplosion.
A generalized, simple, thin film vacuum deposition system (using physical vapor deposition
techniques) needs a number of components. A vacuum chamber provides the space and environment inwhich the deposition process will occur. A vacuum is necessary to provide a decreased potential for atomic
collisions and contamination (better dispersion with less impurities). Vacuum pumps are needed: roughingpump (starts vacuum), cryogenic pump (provides final high vacuum), etc. Relays, valves and solenoids tocontrol the pumps, pump valves and to seal/vent the chamber are needed. A vacuum gauge is needed tomonitor the chamber vacuum. Additional vacuum gauges may be used to monitor other points in thevacuum system. At the appropriate pressures, the system user can close/open valves, start the deposition
process, etc. A heat/excitation source (electron beam, resistive filament, etc.) to react with the source
material to be deposited, the source material itself, a boat, coil or crucible, etc. into which the source
material is placed, a power supply for the heat/excitation source, and the target (substrate) material are allneeded. A source of water for cooling various components is also needed. An air compressor is necessary
to activate solenoid controlled valves, shutters, etc. Various traps can be used to keep gases clean. Crystal
sensor[s] and attendant oscillator need to be connected to the STC_2002. Shutters are usually placed toshield the crystal sensors or the source material's evaporant stream, at least during process startup. The
STC-2000A typically acts to tie most, or all, of these elements together to control the deposition process.
For e-beam use, a sweeper control unit may also be needed. In multipocket (multiple material sources) ebeam gun systems, a pocket indexer or rotator would also be needed.
The roughing pump creates a low vacuum in the chamber first through the open gate valve, the cryopump
and the open rough valve with the purge valve closed. When the desired level of low vacuum is attained,
the roughing pump is powered off as the rough valve between the cryopump and roughing pump is closed.
The cryopump begins to pump the chamber to a higher vacuum (by condensing gas molecules on an
extremely cold surface of a container). When the cryopump reaches saturation, the gate valve is closed andthe purge valve is opened so that the cryopump can be regenerated (a heater may be needed). After
cryopump regeneration is complete (condensed gases have been dissipated), the purge valve is closed, thegate valve is opened and the pump-down to a higher vacuum using the cryopump continues.

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p STC-2000A DEPOSITION CONTROLLER y

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p STC-2000A DEPOSITION CONTROLLER y

ChamberGate Valve

Cryopump

Roughing Pump
Purge Valve

Rough Valve

When the chamber is appropriately pumped down, the source material is heated/excited such that molecules
become the evaporant stream and are dispersed. The source material can be preheated in timed stages thatallow the source material to stabilize at the different power levels.
To reiterate, the source material is known as an evaporant when it has reached sufficienttemperature/excitation to leave the surface of the source material supply prior to deposition. A vacuum isnecessary to provide a decreased potential for atomic collisions and contamination (better dispersion withless impurities). The STC-2000A automatically, as it monitors material deposition rate and thickness,
controls the power that generates the evaporant within the bounds of the user-defined parameters and otherprogramming. The STC-2000A is programmed through an LCD screen with a touch panel overlay. All
choices are deterministic or bounded by a screen-specified range with software enforcing the range of entry
acceptance. The STC-2000A can also be programmed through the communication port.
The STC-2000A monitors material deposition rate and thickness by means of the crystal sensor, which
occupies the same space as the substrate.

As the deposition process is transpiring within a vacuum chamber, the resonant frequency of a quartz
crystal sensor, also exposed to the same evaporant as the substrate within the chamber, accumulates
deposited film[s] on its surface. The equation in section 7 describes the relationship between the mass ofsuch a film deposition and the measured frequency of the sensor crystal. Knowing the frequency change
due to accumulated mass, the film thickness can be determined. The rate of accumulated material
thickness can be calculated using the film thickness along with other elements and progression throughtime. Contributing factors include crystal sensor placement, material characteristics, etc. The STC-2000A
numerically displays rate, thickness and power. It graphically displays rate, power or rate deviation.

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p STC-2000A DEPOSITION CONTROLLER y
As the STC-2000A measures the rate of material deposition (in auto deposit mode), it compares thismeasured value to a user programmed rate setting. If there is a difference between the actual rate and theuser programmed rate, the control voltage (from the sensor card) is used to generate a feedback to adjust
the deposition source power supply keeping it in compliance with the user programmed rate setpoint value.
This method of STC-2000A control has automatic compensation for changing source conditions.
Since there are many different types of deposition power supplies and sources in use today, the deposition
control voltage provided by the STC-2000A has been made user configurable: can be wired positive
isolated or negative isolated and menu scaled for 2.5, 5 or 10 volts full scale. The sense of the control loop
can also be set for either deposition or etching applications by menu programming.
To accommodate the extremely wide range of control loop responses required for the diverse deposition
sources available today, a P-I-D type of control loop has been implemented. With this type of control loop
available to the user, it should be possible to achieve very good control of any deposition source (seesection 3).
All the control loop parameters interact to some degree in the overall response of the control loop resulting
in many combinations of settings that will give equally satisfactory results. Also, the control loop that is
optimized for steady state control will have quite different settings from one requiring fast control
acquisition with minimal overshoot. By supplying real time rate, rate deviation, or control power to thegraph on the STC-2000A RunTime display, determination of control loop settings and performance can be
made. By introducing a change into the control system and observing the graphical display responses, it isquite easy to "tune" the control loop. Source response is another contributing control consideration.
Sources can be categorized as fast responding (electron beam), medium responding (resistive type boats,baskets, or filaments), or slow responding (Knudsen or induction heated types). User programmable
shutter delay can also be used to achieve good deposition rate control before exposing substrates to theevaporant stream. Refer to the I/O programming information later in this section and in section 5 of thismanual for a guide on selecting or implementing the logic used to control the substrate and/or sensor
shutter[s].
There are several phases during a deposition layer of the STC-2000A related to the source and deposition
rate control. There are three main parts to a deposition layer: pre-deposition, deposition control, andpost-deposition. The pre-deposition parameters control the source and material conditioning prior to thefilm deposition. The STC-2000A can control a variety of different types of deposition sources. The typicalrun cycle phases (rise/soak/rise/soak/shutter delay/deposit/rate ramp/deposit/idle ramp/idle) are for anelectron-beam, resistive element or other thermal source. There are also several film parameters (such as
DENSITY and Z FACTOR) and associated map parameters (TOOLING, WEIGHT) which relate to thedeposition material and sensor calibration. All of these issues will be described in greater detail later in thismanual.

Co-deposition: In STC-2000A terms, this is the possibility of running 2 process layers simultaneously (2materials, 2 evaporants, 1 crystal for each of the 2 co-deposition processes). Unlike true co-deposition
where 2 or more sensor channels are under independent PID control, the STC-2000A can co-deposit in alimited fashion that lacks the simultaneity of the 2 sensor channels. This can be accomplished by relying
on the fact that the non-active output control can be left at some power level. One of the 2 pseudo codeposition processes will be designated as the one with a final thickness parameter that will terminate theentire co-deposition process. The co-deposition process without the final thickness parameter designation
will have a parameter specifying its percentage of the thickness rate of the other process. This noncontrolled process is initially set as an active process and then left at a specified power level when the othersensor/control channel is made active. Multiple material co-deposition is possible with an STC-2002 andadditional hardware (2nd set of LED/LCD displays) and different software that is described in a different
manual.
.<< multi-sensor dep >>.

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p STC-2000A DEPOSITION CONTROLLER y
Averaging: In addition to the typical configuration of 1 crystal sensor, 1 oscillator, 1 control voltage
output, the STC-2000A can utilize (by means of the 2nd sensor channel) two sensors to acquire evaporantstream data simultaneously at different locations, insuring greater repeatability of process control as well as
better process control (compensating for the vicissitudes of the evaporant stream in location and in time).
A number of user programmable parameters effect dual sensor depositions. Review Source Sensor Map
chooses the two sensors that are part of the multiple sensor group. Since each sensor has a uniqueparameter group, programming 2 crystals as active automatically invokes an averaging mode. Lost
channels during averaging are handled by menu programmed alternatives (Main Menu/Review SS
Maps/Channel Drop Filter Mask).
Although the STC-2000A cannot control multiple depositions (multiple sources as is the case withco-deposition), it can maintain 2 sources such that one source output is controlled while other source output
can be maintained at a non-zero power level. This would provide the ability to precondition other materials
that could become activated (controlled) when the currently controlled source reaches its preset conditions.
In other words, multiple source outputs can be providing some level of output to multiple power supplies
while deposition control can be focused on a single source output (moved) between the two. The
preconditioning mentioned above would include the soak phases of the deposition process cycle. The soakphase is (or soak phases are) characterized by power being maintained at a constant level.

Note soak power levels in deposition cycle

SECTION 2.XX

Rise
1

Soak Rise
1
2

page 32 of 292

Soak Shutter
Delay2

Deposit

Rate Deposit Idle
Ramp
Ramp
2

Idle

p STC-2000A DEPOSITION CONTROLLER y
Following is a diagram of a typical evaporator installation. This diagram is repeated and described further
in Section 3 (see fig. 3.7).
NOTE: Chart recorder function through memory module connection uses optional hardware and TBD software.

SENSOR
I/O 4

I/O 3

I/O 2

instruments

I/O 1
R
S
2
3
2

1

FUSE: 2 X 2.00 AMP
QUICK-ACTING (F) 250V
90-264 VAC, 50-60 Hz, 230 VA MAX

2
1
2
INPUTS / OUTPUTS

M
E
M! WARNING
THE POWER CORD PROTECTIVEGROUNDING CONDUCTOR MUST
BE CONNECTED TO GROUND, NO
USER SERVICEABLE PARTS
INSIDE. REFER SERVICING TOQUALIFIED PERSONNEL

SOURCECHAMBER

Memory Module

CRYSTAL SENSORSHUTTERCHART RECORDERDATA AQUISITIONDEPOSITION
SOURCECOMPUTEROSCILLATORSECTION 2.XX

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p STC-2000A DEPOSITION CONTROLLER y
Sensor head hardware generalizations (see Section 4 for actual installation details):
A vacuum chamber usually has a number of ports with flanges allowing access to the chamber interior.
A typical vacuum feedthrough is a threaded cylindrical piece of metal that fits into a chamber's flange (hasthe appearance of a large bolt with nut and washer). A vacuum feedthrough can provide for the passage ofwater pipes, compressed air and the electrical connection to the crystal through the chamber wall (or floor)
without leaking under vacuum. The vacuum feedthrough typically has relatively short lengths of pipes
passing through it from end to end, an electrical passthrough consisting of a microdot connector on theinterior side (for the crystal connection) and a BNC connector on the exterior side (for the remote oscillator
connection). Feedthrough placement defines the sensor to feedthrough cable length. Lengths over 30
inches negatively effect crystal stability and usable life. Another pipe may also be provided for compressedair (for shutter activation).

Electrical connections from crystal sensor through feedthrough to remote oscillator cable.

The typical crystal sensor has a microdot coaxial connector located on the perimeter of its body forelectrical connection to the enclosed crystal. A teflon cable brings this connection to the chamber wall
flange through which it proceeds to the exterior of the chamber via a vacuum feedthrough. The electricalcable from the sensor head to the vacuum feedthrough should be wrapped around the water lines [securing]using up all excess length in the process. The chamber, the sensor body, the outer conductor of the
microdot connector and the outer conductor of the BNC connector are electrically interconnected and mustbe at earth ground for proper use with the remote oscillator and the STC-2000A. Grounding also provides
safety benefits and lessens signal noise. The remote oscillator can be connected directly to the exterior of
the feedthrough BNC if room permits. A 6 inch cable is used if there is not enough room. The cable fromthe remote oscillator to the STC-2000A sensor card can be as long as 100 feet. These interconnects are 50
ohm coaxial cables. The STC-2000A sensor card has 2 crystal sensor inputs (BNC males) that, when
installed in the STC-2000A, are labeled on the back panel as: 1 and 2. The text SENSORS also appears on
the back panel to generally describe the connectors in this area.

OSC-100A OSCILLATOR
Push to Test
Serial No.

4571

instruments

East Syracuse, NY

STC-2000A side

Sensor side

The crystal sensor has an opening which presents an area of the crystal surface to the accumulating
deposition material. During setup and initial evaporant material heating/outgassing, this opening on thesensor should be covered to prevent deposition on its surface. Typically a metal shutter (that can be

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p STC-2000A DEPOSITION CONTROLLER ycontrolled by an STC-2000A output card relay connected to a pneumatic value solenoid) is moved remotely
to cover or expose the crystal surface and/or the evaporant source. The STC-2000A also has a user
programmable shutter delay. Tapped holes are provided on the sensor body for mounting the shutter
assembly and/or a mounting bracket to secure the sensor from movement. The sensor body can be openedso that the crystal can be replaced. A "solenoid assembly" is used to provide the compressed air to thepneumatically activated shutter and can be electrically controlled by one of the STC-2000A output relays.
There are available manual shutters activated through a feedthrough.
The sensor head has a minimum distance to the evaporant source of 10 inches to preclude being struck bylarger droplets that which in turn results in incorrect or no readings. These droplets are not part of theevaporant stream and are therefore meaningless to the deposition process measurement. The maximum
distance is that which keeps [maintains] the crystal sensor within the evaporant stream. The crystal sensor's
deposition surface should be perpendicular to the evaporation source. The sensor mounting must not befree to move or vibrate. If the rigidity of the pipes is not sufficient, secure the sensor with a mounting
bracket and screws into the sensor's mounting holes. The evaporant stream needs a clear path (line of sight)
to the crystal sensor's deposition surface otherwise intervening physical elements could cast a shadow in theevaporant stream.

#4-40 Tap -- 4 holes
Equally Spacedon o0.731 B.C.

Water Cooling

Microdot Coaxial Connector

The crystal sensor has a pipe bent around most of its circumference for the purpose of transferring heataway from the crystal. Water is sent through the pipe at a specified minimum flow rate to ensure propercooling. The water lines are typically cut and bent to suit the needs of the chamber interior. The pipes, as
previously noted, also provide mechanical support for the sensor. Sensor pipes can be TIG welded or silver
soldered to feedthrough pipes. Swagelok compression fittings are an alternative to welding or soldering thatallow the easy connect/disconnect of pipes (the long pipes attached to the crystal sensor pass through theSwagelok equipped feedthrough pipes). Covering the pipes and sensor cable as a group with fresh clean
aluminum (or other metal) foil helps dissipate heat from the cable thus allowing higher temperature usage
while minimizing cable movement. This also keeps deposition materials off the pipes and cable for acleaner environment when the foil is changed frequently.

CautionCAUTION
Ensure that the water lines are clear of obstructions and restricting bends before
operating the sensor above room temperature.

Crystal Sensor Variations: The so called "right angle" crystal sensor has the microdot connector
emerging from the bottom flat surface along with the water cooling pipes (there are no shutter mounting
holes on this unit). The so-called "Bakeable" crystal sensor has fixed length water pipes between thesensor body and a thick metal disc, which fits into a flange. Also between the sensor body and the thickmetal disc, is a rigid fixed length tubing that houses the electrical connection to the crystal (this allows
higher temperatures than the teflon cable of the standard configuration). The ends of the water pipes and

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p STC-2000A DEPOSITION CONTROLLER ycrystal connection are on the other side of the thick metal disc (places the 3 terminations outside thechamber). The electrical connection is terminated with a standard male BNC connector. The "bakeable"
unit, therefore, presents itself on the outside of the flange like the standard crystal sensor. The so-called"Dual Shuttered Head" has 2 crystal sensors in tandem on a single assembly. As part of the assembly, ashutter always covers one crystal while exposing the other. When the shutter moves it exposes theformerly covered crystal and covers the formerly exposed crystal. The installation of a dual shutteredsensing head is similar to that of the single head. A second sensing input (Sensor 2) is used on the second
crystal channel. Automatic crystal switching by shutter is accomplished by I/O programming. The primary
crystal sensor channel (Channel 1 in this example) has an associated shutter control bit weight value
accessed through I/O programming (ID#81). The primary crystal sensor channel (Channel 1 in thisexample) and the secondary crystal sensor channel (CHannel 2 in this example) are set to the active state bymenu programming. By opening or closing the shutter associated with the primary crystal sensor channel(Channel 1 in this example), the I/O programming performs the necessary functions for controlling the
shutter of the dual sensor. Proper phasing between the sensor inputs and shutter control can easily bechecked by installing a sensing crystal in only sensor 1 and observing the good and "failed" (absent)
sensing crystal when switching manually between sensor 1 (good) and sensor 2 (failed).
Of course this mechanical method can be supplemented by using 2 sensors without shutters. The primary
crystal sensor channel (Channel 1 in this example) and the secondary crystal sensor channel (CHannel 2 inthis example) can also be selected by I/O programming commands or the active sensor can have a backup
crystal sensor channel list that names channel 2 (or the secondary sensor channel) as the automatic
replacement for the failed primary channel. (Sequence would be: fail primary [by command or 3rd STATUS
menu], backup list provides secondary, re-verify [by command or 3rd STATUS menu] reinstates theprimary.)

Power Supply Connection: This refers to the high current (or voltage) power supply that provides theenergy to create the evaporant stream. The power supply connection on the STC-2000A has the control
voltage that controls the high current (or voltage) power supply. From the STC-2000A point of view, thisis known as the source control voltage. The word source describing the source material of the deposition
process in the form of an evaporant stream. Along the bottom of the back panel, in the area where thesensor card is expected to reside, is the text label SOURCE. This is meant to indicate the 9 pin D-sub
connector that is part of the sensor card. The text label, ½, refers to control voltage outputs. In the sensor
card slot, this indicates control voltage 1 and control voltage 2. Control voltage 1 can be used to control thehigh current (or voltage) power supply just described. The 2nd control voltage could alternately be used tocontrol the high current (or voltage) power supply but is typically used for the strip chart recorder control.
These identical analog outputs can be interchanged. In fact, their function is assigned by means of menu
programming. If the two functions (control voltage and recorder) are assigned by menu programming on
the same analog channel, the control voltage will have precedence and the recorder function will be lost.
After these programmed outputs are used in a film, a conflicting recorder function having been lost in thisway would require a reboot to recognize a correcting change. The analog output used for the control
voltage output has a number of programmable parameters associated with it. One in the MAIN/ REVIEWFILMS menu path is: SS MAP SELECT. Another one in the MAIN/ REVIEW MAPS menu path is: source
out channel. Don't overlook the ground connection (connector shell). Shielding goes a long way toward
noise reduction and ultimately contributes to a stable system. [Section 4.6 has more details]

Strip Chart Recorder Connection: This refers to the STC-2000A output from the 9 pin D-sub on thesensor card that can provide the proper analog signal for a strip chart recorder. Along with the hardware
connection, the analog output used for the strip chart recorder has a number of programmable parameters
associated with it. Two in the MAIN/ EXEC/ SYSTEM CONFIG menu path are: recorder function I/O
control and recorder out channel. This function can be assigned to one or none of the 2 identical source
out channels. Don't overlook the ground connection (connector shell). Shielding goes a long way toward
noise reduction and ultimately contributes to a stable system. (See Power Supply Connection above forother source out channel details) [Section 4.7 has more details]

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p STC-2000A DEPOSITION CONTROLLER y
RS232 Communications Connection: Located in the approximate center of the back panel and labeledwith the text RS232 is a male 9 pin D-sub connector for the purpose of communications with a PC or
laptop computer. A straight through cable (that is, pin 1 at one end is connected to pin 1 at the other end,
pin 2 to pin2, etc.) cannot be used. A cable configuration known as a null modem cable needs to be used.
A diagram of the connections is shown in section 4.11. Operations (start/stop) and menu programming
normally done through the front panel controls can be accomplished remotely by means of the interface.
Software downloads that become the product firmware can also be accomplished through this port. Menu
programming needs to be set for the proper baud rate and communication protocol(Main/Executive/Comm. Setup menus). [Section 3.15 and 3.16 has more details]

Grounding Stud: Located on the back panel near the AC power connector/switch, the ground stud is athreaded screw embedded in the back panel providing an electrical connection to the chassis ground of the
STC-2000A as well as to the ground connection of the AC plug. This should be used to maintain thesystem equipment grounds, including the chamber, at the same potential as earth ground. As there aremany potential sources of high-energy noise that are part of a deposition system, implementation of thisground system can substantially reduce noise resulting in improved system stability. [Section 4 has moredetails]
Input Card Options: An opto-isolated input card can be configured in a number of ways. Inputs can beisolated or non-isolated, internally powered or externally powered (individually or as a group). Jumpers on
the input card are used to make the selections. All of the opto-coupler LED cathodes are brought out to the
25 pin D-sub female (i.e. pins 3,6,9,12,14,17,20,23 [(-) Input Pins]). The opto-coupler LED anodes arebrought into a jumper header (JP1) where each of the anodes can either be routed to a voltage source orsent out to the 25 pin D-sub female (i.e. pins 2,5,8,11,16,19,22,25 [(+) Input Pins]). The voltage source itself
is further selectable on a separate 3 pin jumper header (JP2) such that an internal voltage (+5VDC) can beselected or an external voltage can be selected (comes in on pin 1 of the 25 pin D-sub female). The
voltage source, regardless of the JP2 selection, can therefore be applied to all of the anodes when JP1
selects the voltage source. Any one or more of the anodes can be alternately routed through JP1 to keepthem isolated from the other anodes and the voltage source. Jumpers can short from the center to one of theends. Since there are 8 anodes, there are also 8 JP1 sections. The depiction below is a generalization of asingle LED input (1 of 8). [Section 4.8 has more details]

cathodeD-sub [(-) Input Pins]
JP1

D-sub [(+) Input Pins]

anodeint. pwr.
JP2

D-sub (pin 1 only) ext. pwr.
dig. gnd.

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p STC-2000A DEPOSITION CONTROLLER y

Installation/Removal of Sensor Card, Input Cards, Output Cards: Although other combinations are
possible, the following procedure is recommended for field installations and removals. There are humansafety issues and component damage issues that are addressed by this procedure. Please read thisprocedure in its entirety first before commencing the actual work. Return of the unit is preferred.
1. Disconnect all electrical connections to the STC-2000A. This includes all I/O connections, Sensor cardconnections, RS232 connections, other communications connections, pendent, memory card connections,
ground wires and especially the power cord connection. Ensure that the power cord is removed from theback panel IEC 320 connector and that the STC-2000A unit is on a properly grounded rubber mat (orequivalent). The person doing this work should also be properly grounded by wearing a grounding strap.
2. Remove the four screws that secure the bottom cover. Remove the bottom cover. Store these items
together in anticipation of reassembly.
3. With the bottom cover removed, look inside the STC-2000A. Disconnect the power connection between
the IEC 320 connector/switch assembly (mounted on the back panel) and power supply. This will be a 3
position Molex® type connector housing with red and black wires plugged onto a mating header that is partof the internal power supply. This will allow for the removal of the back panel. Next, disconnect the 4 pin
connector from the RS232 board (mounted on the back panel by its 9 pin D-SUB male connector). Finally,
the quick-disconnect connectors attached to the ferrite bead assemblies may also be removed (one connects
to the internal power supply and the other connects to the DC wire harness). As there is some slack in theseconnections, their disconnection is not imperitive. If left connected, do not subject these connections topulling or twisting stress.
4. Locate the two screws on each of the side panels that hold the back panel in place. These are located on
the side panels near the back panel (the screws go through the side panels and into the back panel).
5. The back panel/PCB assembly can be pulled straight back away from the STC_2002. A slight up anddown rocking may help the connections come apart. Observe that the bus bd. (502-211), is not flexed as thethe back panel is moved. The bus bd. (502-211) can be held from flexure with a thumb. The back panel
assembly will include the power switch/receptacle/wire harness assembly and the PCB cards secured to theback panel. The back panel / PCB assembly must be pulled out straight away from the unit: the header pins
may be bent otherwise.
6. With the back panel / printed circuit board assembly on the grounded mat, remove the hardware (hexshaped screws, hex nuts, etc.) securing the back panel mounted PCB cards that need to be removed. Placethe PCBs to be added or removed PCBs, if any, on the grounded mat.
7. PCB cards may be added or removed from the back panel at this time. PCB mounting hardware isremoved or added. Securing the PCB cards to the back panel is accomplished by use of the connector
mounting hardware.
8. Introduce the back panel assembly back into the unit moving it horizontally across the table while
maintaining its orientation such that the back panel remains parallel to the front panel. Ensure that thepower connector harness wires are not pinched or that the insulation on the wires is not damaged. As the
PCB nears its mating connection, align the assemblies such that the header pins correctly engage and insert
straight.
9. Carefully align all back panel secured PCB connector headers with the mating socket headers on the bus
PCB (502-211). Start alignment at one end of the bus board, holding each back panel secured PCB lightly
in place until all are aligned then press on the bus board to keep it from flexing as all utilized bus board
connectors are fully engaged with the mating back panel secured PCBs.
10. Secure the back panel assembly to the side panels with the 4 screws previously removed.
11. Check PCB interconnections for bent pins or misalignments. If there are problems, reverse process tothe point needed to correct the problem.
12. Reconnect the switch/IEC wiring assembly connector housing to the power supply header. Reconnect
the DC connector housings to the power supply header (6 positions) and ferrite ground assemblies.
13. Replace the bottom cover and secure it with the 4 screws.
14. Reconnect the power cord into the IEC connector.
15. Power on the unit.

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p STC-2000A DEPOSITION CONTROLLER y

A
B
C
D
E
F
G
HI
J
K
L
M

10 11 12 13 14 15 16 17 18 19 20 21
IEC switch/connector
AC power supply header
DC power supply header
Source/Sensor Card
Input Card (I/O 1)
Output Card (I/O 2)
Input Card (I/O 3)
Output Card (I/O 4)
Host Port (RS232) Bd.
Memory Mod. Interface Bd.
Speaker
Bus Board
CPU/Main (CSUB) Bd.
(Remote) Hand Controller Bd.
Ferrite Assemblies
LCD Display/Touch Screen

A14
B11
H11
A15-I15
A16-I16
A17-I17
A18-I18
A19-I19
A14-H14
A14-H14G20
J10-J20
L10-L20
L18-L20
A10, A12
M10-M20

Pendent: Also called a hand controller, may be connected by means of the front panel jack labeled Hand
Controller when certain front panel functions need to be duplicated remotely or when intending to utilize
the Manual mode. When not in use, the pendent may be left plugged into the STC-2000A unit or it may beremoved. The pendent does not contain any active electronics nor is it polled to check for its presence.

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p STC-2000A DEPOSITION CONTROLLER y
LCD contrast/bias: The optimal viewing is designed for perpendicular to about 45° up and about 45° fromperpendicular to either side. Within a few minutes of powering the unit on, there will be some thermal drift
effecting color but this should be relatively unnoticeable. If, however, the unit will be in an environment
having elevated ambient temperatures (above 30° Celsius), the LCD contrast/bias should be set to low
through menu programming (Main/Executive/System Configuration menus).
Graphical Display: Although no hardware other than the LCD display is associated with this item, it needs
to be setup. Three film parameters need to be programmed: Plot Vert Scale Volts, Plot Horiz Scale H, Data
Plot Type. The graphical display, as the name implies, displays, in graph form: rate deviation, rate or
power.
Rack Mounting: Rack mounting ears, extenders and screws are supplied with the STC-2000A for the
purpose of mounting the unit in a standard rack. Don't block ventilation slots or place above heat sources.
Rubber Feet: Rubber feet are not supplied with the STC-2000A. The anticipated usage of the product iswithin a rack. If, however, in the unlikely case where the usage will be on a shelf, table or some other flat
surface, rubber feet should be used to prevent sliding with the possible resultant damage. They should beof the type that sticks on the bottom of the unit. These can be purchased cheaply at many retail outlets.
The waxed paper is first removed from each foot. The foot is then applied to the bottom of the STC-2000A
such that they are placed in each corner an inch from the 2 corner surfaces. Subsequently, if the unit will
be rack mounted, remove the rubber feet.
System Hardware Connections: Except for the generalized previous descriptions, complete system
hardware setup is beyond the scope of this manual. Consult the manuals for each of the components in thesystem. The sum of the manuals is less than the whole: Be forewarned that the general information
contained herein is meant as an overview of the system only, an overview to describe how the STC-2000A
integrates with the other components in the system and some of its' typical usage's. The information
presented here does not adequately describe the many hazardous situations that could occur brought about
by the incorrect constellation of valve states, temperatures, pressures and voltages. The system needs tohave safety provisions should inadvertent human intervention cause changes or should a power failure of
any or all parts of the system occur. Safety concerns include electrocution and explosion.

programmable hardware setup discussion (for detailed setup see Section 3 but please read this overview section first)
Synopsis:
Select mode: sequencing/runtime, sequencing/test, non-sequencing/runtime, non-sequencing/test.
Optional selects: manual mode and test mode. Select memory configuration: factory, purged, as-is.
Program system parameters. Program film parameters (for a single film or multiple films) and process
steps. Set active process. Select crystal. Start process.
The versatility of the STC-2000A translates into many modes, parameters and configurations all of which
arrive from the factory in default states. Except for the Input card hardware configurations (uses jumpers),
all modes, parameters and configurations are user programmable by menu. The VAR or end user must
tailor the unit to work with specific hardware for the desired deposition process.The VAR or end user must
tailor the unit to the specific hardware and deposition process at hand.
Runtime mode is the general name for the mode used for the deposition process whose screen canalways be brought forth from any menu screen by pressing the fixed front panel key labeled STATUS.
A second press of the STATUS key while the RunTime screen is displayed will invoke a screen showing the rate,
power and thickness in large characters. A third press of the STATUS key while the RunTime screen is displayed will
invoke a screen showing, among other elements, active control output channel[s], pocket number[s] and power %expended on each. A forth press of the STATUS key beginning when the RunTime screen was displayed will invoke ascreen showing, among other elements, active sensor channels and their states, rates, thickness', stability's and crystal
lives. This forth screen can be used to fail or reinstate (re-verify) a crystal. Zero thickness at this level is used fortooling setup or diagnostics and has no effect on the deposition thickness.]

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p STC-2000A DEPOSITION CONTROLLER y
The specific functional runtime mode must be chosen: sequencing or non-sequencing. Either ofthese modes can be further switched between the normal run mode and the test mode. This results in 4
mode choices: sequencing/run, sequencing/test, non-sequencing/run, non-sequencing/test. Manual mode(manual control of power) can be selected while a process is running by pressing the fixed front panel
MANUAL key with the pendent connected.
At the same time that these choices are being made, the programmable memory can be kept as itis, purged or set to factory defaults. A memory change can effect film parameters, process steps, runtime
mode, system configuration, I/O programming, process accounting, and communication parameters.
Elsewhere in this manual (appears section 3.21) are tables and lists depicting memory element values after
purge and after factory [settings] are invoked. This memory information by itself is also listed later in thissection.
A film is programmed by selecting the film number (on the main menu), moving through theassociated parameter list, and changing the values as needed. Some of the film parameters are notaccessible or viable when another related film parameter predicates their availability. Up to 50 films canbe programmed. In non-sequencing mode, only 1 film can be run at a time, as there is only one implicit
process. In sequencing mode, a process can call for a film in a process step. There can be up to 99 steps ina process and up to 9 processes. A process is menu programmed by building each line (step) with a mode
value, film number and thickness value.
In the non-sequencing mode, an active film must be menu selected (1 of 50). In the sequencing
mode, an active process must be menu selected (1 of 9). In either case, active indicates that this is the film
or process that will become active when the process starts (initiated by the front panel START key). In
addition, neither a film nor a process may be altered by editing when either is being used in a runningdeposition (for safety reasons). The optional memory module can be used to extend configurations.
Some system configuration parameters also determine the status of some film and map
parameters. Example configuration parameters that fall into this category are: need s/s card x and I/O slot
x type. Check the film parameter dependency list in section 1.8 to find the parameter of interest (allparameters are listed there). Finally, set the status of the controlling parameter such that it allows theparameter of interest to be accessible and appropriately set. Dependencies are also listed later in thissection.
There are some basic parameters that need to be setup. The Density and Z-Factor can beobtained from table 4.1, in section 4.3 [Review Films menu]. Tooling [Review Source Sensor Map menu]
for crystals can be determined empirically by running a trial deposition and using the equation (this will befound in section 4.2):
Tooling = 100 X (Substrate Thickness / Displayed Thickness).
Generally, Tooling is greater than 100% when the sensor sees less deposited material than the substrate(e.g. the sensor is further from the evaporant source than the crystal sensor). Generally, Tooling is less than
100% when the sensor sees more deposited material than the substrate (e.g. the sensor is closer to theevaporant source than the crystal sensor). If 2 crystal sensors are used (assuming the single sensor card isinstalled), Start Xtal (crystal) must match the hardware and positioning used. Obviously, the two crystal
sensors cannot occupy the same space. Therefore each crystal sensor will have a different tooling factor.
Crystal sensor tooling is coordinated by the sensor map menu that selects the sensor along with other sensor
properties. The channel specific applicable Review SS Map menu parameter is CHx Tooling. There isalso a Master Tooling parameter (Review SS Map Menu) that can be used change the ratio of both the
crystal sensors simultaneously in addition to the individual channel tooling. This can be thought of as a
global offset or multiplier used to alter the tooling of both active crystal sensors. In any case, the Toolingfactor is the attempt to describe the ratio of deposited material between the crystal sensor and the substrate.
Max Power Limit, Deposit Rate, Soak Power Value, Power Ramp Time, Power Soak Time,
Setpoint thickness and time limits need to be described. With these parameters entered, the Test mode
could be utilized to check the process behavior. The Max Power indicators show when the Max Powerparameter has been exceeded (LCD alternates with MAX!). To reiterate, the TEST mode only effects the
crystal sensor information being processed, it does not effect anything else (this includes the control output
voltages). This is not the point at which to begin experiments with a live system. This section is meant toprovide a discussion of the issues to familiarize the user with functional themes. Please read further.

SECTION 2.XX

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p STC-2000A DEPOSITION CONTROLLER yWhen the STC-2000A sensor card control voltage output is connected to the evaporant power supply,
Review Source Sensor Map parameters need to be selected for a proper interface (SOURCE OUT CHaNneL,
SOURCE FULL PoWeR, SOURCE MAX PoWeR) and the Map itself needs to be selected by a Film parameter(SS MAP SELECT). Following this, other power supply related parameters must also be contemplated.
Some thermal excitation alternatives include: electron beam: wire fed electron beam source, high vacuum
e-beam w/ small (~2cc) crucible, fixed pocket (large and small), rotary pocket indexers; resistive heater
sources: metal filament boats, coils, oxide crucibles (all for organic material deposition). Crucible
capacities can range from a fraction of a cc to over 500cc. The input control requirements of the highcurrent (or voltage) power supply should be found in the power supply documentation. Don't assume there
is a standard. With the STC-2000A control voltage output controlling the power supply for the thermal
sources described above (the 2nd control output voltage used for power supply control is typically employed
for the recorder function), the film parameters effecting power (processes depend upon films) are:Soak 1 Power level Value
0.0 to 100.0%
Power Ramp 1 Time (to pwr level) 0 to 99:59 MM:SS
Power Soak 1 Time (@ pwr level) 0 to 99:59 MM:SS
Soak 2 Power level Value
0.0 to 100.0%
Power Ramp 2 Time (to pwr level) 0 to 99:59 MM:SS
Power Soak 2 Time (@ pwr level) 0 to 99:59 MM:SS
These parameters are presented
Soak 3 Power level Value
0.0 to 100.0%
here for the purpose of namePower Ramp 3 Time (to pwr level) 0 to 99:59 MM:SS
familiarization and categorization
Control Loop –P-roportional term 1 to 9999
of power related parameters
Control Loop –I-ntegral term
0.0 to 99.9 sec
across menu and screen
Control Loop –D-erivative term
0.0 to 99.9 sec
boundaries.
Max Power Limit
0.0 to 100.0%
Abort Max Power SW
OFF/ONMax Power Dwell
0:01-99:59 MM:SS
Control Loop Qual Limits
0 to 9Plot Vert Scale Volts
1, 5, 10, 50, 100⇐ Graphical display function
Plot Horiz Scale H
1 to 600 samples⇐ Graphical display function
Data Plot Type
Rate /Power /Rate Deviation⇐ Graphical display function
Source Sensor Map Select1 to 10 (Selects the Map that contains Source Sensor analog output parameters)
Etching Mode
Off / On (Rate Direction can be Positive or Negative)
The Power Related RunTime Screen parameters are:(Crystal Quality Indicator Select) L/Q, Loop x, Qual xx(Manual mode)(fixed front panel key)(Manual mode)(pendant arrow keys [increase / decrease power manually])[increase/decrease power manually])(Manual mode)(2nd STATUS screen arrows:(Manual mode)(2nd STATUS screen: zero power key [LCD] on non-active channels)(3rd STATUS screen: zero thick key [LCD] no effect on material thickness)(Manual mode)(Manual mode)(3rd STATUS screen: force fail key [LCD] fail/verify crystal channels)
Menu path: Main/Executive menu/System Configuration]
The Power Related System Configuration values are:Recorder Functions
Rate, Rate Deviation, Power, Thickness, Computer Remote, I/O, Off
Recorder Analog Output ChaNneL
2 Channels (select 1 only) [note possible conflict w/ Source Analog Output]

The Power Related Review Source Sensor Map values are: Menu path: Main/Review SS Map]
Source FS Voltage Scaling PoWeR* 2.5/5/10 Full Scale VOLTS⇐ see Power Supply input requirement
Source Max PoWeR
Source Analog Output CHaNneL

0.0 – 100.0%

2 Channels (select 1 only)

Menu path: Main/Service]
The Power Related Service Menu values are:
(Memory Contents)
as is (no modification), purged, factory (defaults) [see section 3.21 ]note film parameter changes(Reset)Arm reset, reset armed [Provide a product reset when back panel power

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p STC-2000A DEPOSITION CONTROLLER yswitch is not accessible. Also, use to generate ACCEPT key if notpresent (e.g. to end the Test mode when in the Test mode).]*NOTE: Of primary concern when connecting evaporant power supply to the sensor card.

Dependencies[Prerequisite states that must be in effect for the following parameters to be fully functional]

The Power Related Film Parameter Dependency List is:
Max Power Dwell
Film Parameter: Abort Max Power SW = ON
The Power Related RunTime Screen parameter Dependency List is:(Crystal Quality Indicator Select) L/Q, Loop x, Qual xx Film Parameters(Manual mode)
Running Process + Pressing fixed front panel MANUAL key +attached Pendent (or on 2nd STATUS screen: , , zero CH x)(process start).PerformCarry out the following 2 key sequence up to 3 times.
Press the fixed front panel START key + 1 of 4 touch panel keys:
Break Wait, Next Layer, Restart Layer, Reset / Start Process(see figure in end of section 2.7). Use the appropriate touch key for thetask at hand. If unsure, use Reset / Start Process key in all 3 sequences.
Please read and understand this manual before starting a live process.

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p STC-2000A DEPOSITION CONTROLLER y
Initial Programming Setups (menu parameters)
system configuration programming (factory/ default settings, stand alone / computer controlled)
If the STC-2000A has: arrived directly from the factory or the factory settings key has been menu selectedor the purged settings key has been menu selected, the following specifies the parameter values in effect.
The following information will be repeated in later sections in greater detail along with additional related
information. The intent here is to introduce the reader to baseline values and consequently what must be
altered for the intended use. Purge values are listed first, followed by the factory differences.

Film Parameter values after purge:

Communication values after purge:[non-SEQ adds "Final Thick Limit=0.0 KÅ"]Material Density
Material Z-Factor
Setpoint thick limit
Setpoint time limit
Soak 1 Power Value
Power Ramp 1 TimePower Soak 1 Time
Soak 2 Power Value
Power Ramp 2 TimePower Soak 2 Time
Soak 3 Power Value
Power Ramp 3 Time
Deposit Rate
Rate Ramp Mode
New Deposit Rate
Rate Ramp Time
Rate Ramp Trigger
Control Loop P
Control Loop I
Control Loop D
Max Power Limit
Abort Max Power SW
Max Power Dwell
Shutter Delay Mode
Shutter Delay Timeout
Shutter Delay Quality
Rate Sampling
Sample Interval
Sample Dwell Time
Sample Quality
Sample Alarm Time
Film Fail ModeControl Loop Quality L
XTAL Stability S
XTAL Life Bounds
Plot Vert Scale Volts
Plot Horiz Scale H
Data Plot TypeSS Map SelectPocket SelectEtching Mode

SECTION 2.XX

1.00 gm/cc
1.000
0.000 KÅ0:00 MM:SS
0.0%
0:00 MM:SS
0:00 MM:SS
0.0%
0:00 MM:SS
0:00 MM:SS
0.0%
0:00 MM:SS
0.0 A/SOFF
0.0 A/S
0:00 MM:SS
0.000 KÅ100
1.0 secs
1.0 secs
0.0%
ON
0:30 MM:SS
Off
0:30 MM:SS
10
Off
0:30 MM:SS
0:30 MM:SS
10
0:30 MM:SS
Time Power
0
0
0.0%
100
1
RATE DEV
10
Off (pos/neg)

COM/IO Lock Code
Keyboard Beep
RS232 Baud Rate
RS232 Protocol

0
ON
9600
Sycon

System Configuration values after purge:
LCD Contrast
MEDIUM
Password Lock #0
Run Number
0
Recorder Functions
Off
Recorder Output Channel 1 (note conflict: Source Sensor Out is also1)
Clock Timeno change (HH/MM/SS)(w/o battery: 00/01/00)
Clock Date
no change (MM/DD/YY)(w/o battery: 01/01/01)
I/O Slot x TypeDisabled (where x = 1 to 4)
OFF (used w/ installed
Memory Module IFC
memory module option)
RunTime Screen after PURGE:
PROCessLayer
FILM (film in use)
SRC (Source Control Volts Channel)
XTAL
MAP#
RUN time
PHASE time
RUN#
(Graph parameter)
Crystal Quality

1 note1# note111(blank)
1
0:00
0:00
0
Rate Deviation
L/Q (Sample/Hold = blank)

MAIN MENU Screen after PURGE:
Review Film
Review SS Map
Next Process
Review Processes(film 1 will be reviewed)(Map 1 will be reviewed)
1(Process 1 will be reviewed)

note1: non-sequencing mode does not have this function (non-SEQ: ACTIVE FILM is 1).

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p STC-2000A DEPOSITION CONTROLLER y
Review SS Map values after purge:
Source Sensor Full Power Volts
10 volts
Source Sensor Max Power Value 0.0%
Source Sensor Analog Output Chnl 1 (Channel Select)
Master Tooling Value
100.0%
Minimum Start Xtal Channels
1 channel
Minimum Backup Xtal Channels 0 channels
Minumum Active Xtal Channels 1 channel
Xtal Channel Drop Filter
NONE
Indexer Synchronization Mode
NONE
Indexer Synchronization Time
2 seconds
Channel 1 Start ModeOFF
Channel 1 Fail Action Mode
NONE
Channel 1 Backup List
0
Channel 1 Tooling Value
100.0%
Channel 1 Weight100.0%
Channel 2 Start ModeOFF
Channel 2 Fail Action Mode
NONE
Channel 2 Backup List
0
Channel 2 Tooling Value
100.0%
Channel 2 Weight100.0%I/O SETUP values /programs after PURGE:
I/O Programs A & B
Memory Menu
Operate Menu

ClearedA
Running

Film parameter differences: factory restore has: max power limit set to 50% (purge = 0%).
Processes Step differences: As an example, the following is the difference between a factory setting and apurged setting for PROCESS# 3. The factory setting has, for the first and only step (step 01):
MODE=AUTO, FILM#=3, and THICK(Kå)=0.300. The purged setting has an END line as the first andonly step (considered cleared). If process 3 were run with factory settings, AUTO mode would be invokedusing film #3 and running until a final thickness of .300 Kå was achieved.
If process 3 were run with purged settings, the END command would be encountered immediately thus
stopping the process. The table below shows this information as well as information for the otherprocesses.
Factory Settings table for All Process Numbers:
STEP
MODE
FILM#
THICK

Proc# 1
01
AUTO
1
0.100

Proc#2
01
AUTO
2
0.200

Proc#3
01
AUTO
3
0.300

Proc# 4
01
AUTO
4
0.400

Proc#5
01
AUTO
5
0.500

Proc#6
01
AUTO
6
0.600

Proc#7
01
AUTO
7
0.700

Proc#8
01
AUTO
8
0.800

Proc#9
01
AUTO
9
0.900

All factory Processes have END as STEP 02.

I/O programs are not factory restored because of the danger involved. Factory restore will not, therefore,clear or restore the factory I/O program[s] (it leaves them unchanged). Purge will, however, clear I/O
programs. These selections will cause the unit to REBOOT with the new configuration in effect. The
section describing the SERVICE menu will describe these elements in detail. As seen in the above lists,
there are groups of settings (Film parameters, System configuration, Communications, Processes, I/O

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p STC-2000A DEPOSITION CONTROLLER yprograms, etc.) that will be included in these configurations. Valuable process programming could be
lost. The BYE key can be pressed to leave the SERVICE menu without changing anything.
If the password is forgotten and programming has not been saved in some othermedia, call the factory to eliminate passwords without purging memory.

I/O programming Introduction
The I/O programming is what controls the opto-isolated inputs on the Input card and the isolated relay
contacts on the Output card. Similarly controlled, the front panel has 4 LEDs that are intended as user
controlled outputs, 4 user programmable fixed keys that are intended as user controlled inputs and thependent whose alternate function is user I/O programmable inputs. This I/O programming control extends
to input acquisition of front panel key presses, elements of film deposition run cycle states (i.e. rise, soak,
deposit, idle, etc.), various process state conditions, process switching, various crystal states or events,
setpoint conditions, etc. I/O programming also controls by means of general variables, events and states.~
The I/O programming can discern whether an input has changed state and when it has changed state. Whenan input has both state information and temporal information, it is known as an edge event condition. Whenan input has only the state information, it is known as a steady state condition. Outputs also have analogous
edge event and/ steady state conditionality. The output result is, correspondingly, either a pulse or a steadystate.
To reiterate, Runtime mode is the general name for the mode used to run the deposition process
whose screen can always be brought forth from any menu screen by pressing the fixed front panel key
labeled STATUS. The Runtime mode of the STC-2000A has 2 basic process control modes: sequencing
mode and non-sequencing mode. While in either one of these modes, manual mode (manual control ofpower) may be invoked. The specific functional runtime mode must be chosen by menu selection:
sequencing or non-sequencing.
In addition, a test mode can be employed to simulate a crystal sensor input (w/ simulated rate
information) while in any combination of the modes just described. Simply put, the sequencing / nonsequencing mode difference is that of having or not having a process. Non-sequencing mode does not havea process (or at least nothing named as such). Non-sequencing mode uses 1 implicit process which can run
1 film. The non-sequencing mode is easiest to configure (user programs an active film). The sequencing
mode is more complicated only by the additional programming of a process[es] that calls out a film or
films.
Inputs, outputs and all the other states and events have a numeric representation called an ID number. An
ID number is used to numerically represent: inputs, outputs and all the other states and events. They can be
named by their description and classified by state/event condition. A table containing all I/O programming
events and states can be found in this manual. After locating an event or state that the user needs as apivotal point in their process, the identifying ID is found. Next, consideration of the needed I/O
programming function type is assessed. The available function types are: Input, Output, Trip, Arm, Drop,
Set and Clear. The combination of function type and ID number produces (in STC-2000A terminology) a
token. For the sake of LCD screen limitation imposed brevity, only the first letter of the function type isused to describe the function. Token constituent elements can also include other elements such as a single
Boolean operator. Incorrect function type / ID pairings are identified for the user and not allowed as anentry.
Although film parameters provide time, power and thickness based control, I/O programming provides not
only these but added dimensions to the kind of control that is achievable. The number of conditional
elements is increased dramatically.
I/O programs are constructed using the LCD/touch panel menus. Programs are written in Reverse Polish
Notation (RPN) by constructing one (or more) line entities that are called rungs. If a single I/O
programming task of the total work to be accomplished takes more than one line, an intermediate variable
called a softnode can be used to carry the partial result of the task from one line into another line thatcompletes the work.

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Example illustrating softnodes:(where x and y are used like softnodes in the following 3 generalizations)← assignment of the x softnode, one program line (or rung) in Algebraic Notation
2+3+5=x2+5=y← assignment of the y softnode, another program line (or rung) in Algebraic Notation
x+y–3← combining the softnodes, another program line (or rung) in Algebraic Notation
Example illustrating notations:
Algebraic Notation (2 + 3 x 5) vs RPN (2 3 5 x +) answer (in either notation): 17
Algebraic Notation ((2 + 3) x 5) vs RPN (5 3 2 + x) answer (in either notation): 25[RPN is used to eliminate abiguous and error prone precedence rules determining the order of evaluation andbecause of the stack oriented nature of RPN that is conducive to the I/O programming structures.]

The line length limitation is purely a result of LCD screen size limitations. Each program line (or rung)has an input statement, an output and a consecutive line number (for line identification). A softnode can beused as the output of the line (or rung).
Aside from states and events, there are arithmetic, relational, selectional and logical (Boolean)
operators used for I/O programming. The logical operators are AND, OR, XOR and NOT. A Boolean
value can have only 2 states. There are many alternate names for these 2 states (respectively): true/false,
on/off, 1/0, high/low, closed switch/open switch, system voltage/zero voltage, positive voltage/negative
voltage, even negative voltage/positive voltage, etc. Logic levels conform to the following table:
Where logic level 0 = zero volts, logic level 1 = system high volts, Boolean value T = true and Boolean value F = false.
Logic Levels In

Boolean Value In

AND [&] result

OR [¦] result

XOR [^] result

0
1
00
01
10
11

F
T
FF
FT
TF
TT

(2 or more inputs only)(2 or more inputs only)(2 or more inputs only)(2 or more inputs only)(2 or more inputs only)(2 or more inputs only)

F
F
F
T

F
T
T
T

F
T
T
F

(with 3 inputs

)

000
001
010
011
100
101
110
111

(using 2 AND operators

FFF
FFT
FTF
FTT
TFF
TFT
TTF
TTT

F
F
F
F
F
F
F
T

)

(using 2 OR operators

F
T
T
T
T
T
T
T

)

(using 2 XOR operators

NOT [!] result
TF(uses 1 input only)(uses 1 input only)(uses 1 input only)(uses 1 input only)

)

F
T
T
F
T
F
F
T

(uses 1 input only)(uses 1 input only)(uses 1 input only)(uses 1 input only)(uses 1 input only)(uses 1 input only)(uses 1 input only)(uses 1 input only)(uses 1 input only)

Although the above table ends with three inputs, this does not imply an I/O programming input limitationas many elements can be OR'ed, XOR'ed or AND'ed together but there is a syntactical limit of 2 elements
only per each OR, XOR or AND operator. These can be cascaded to the limit of the line length and,beyond that, using softnodes, to the limit of the program maximum length.
The constituent parts of a program line (or rung) consist of logical operators and elements that are logicallycombined or altered by them. These elements involve what was previously described as a token. Token c
Incorrect function type / ID pairings are identified for the user by an error message and not allowed as anentry.
Examples:(where I represents an input, the number an ID representing various system input states)

I90 I91 ¦I90 I91 I97 ¦ ¦SECTION 2.XX

(this ORs inputs 90 and 91 together)(this ORs inputs 91 and 97 together and ORs the result with 90)

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I90 I91 + I97 ¦I90 I91 I97 I100 ¦ ¦ ¦I90 I91 I97 I100 & & &(this ORs inputs 90 and 91 together and ORs the result with I97 [this has
the same result as the 2nd example, an alternate way of writing it])(this ORs inputs 90, 91, 97 and 100 together)(this ANDs inputs 90, 91, 97 and 100 together)

For those expecting something like I90 ⊕ I91 ⊕ I97 ⊕ I100 notation, the ID tokens are written first (at least2) followed by the logical operator token for each pair of Or'ed elements.

( (I90I91) I97)+ + ⇐1st two tokens are OR'ed, their result OR'ed with the lasttoken

[parenthesis are not part of program, they indicate grouping only]

I/O Functions include: INput, OUTput, SET, CLeaR, ARM, DRoP and TRiP (KON may also be considered
as a numerical input).
Logical operators include: AND, OR, XOR, NOT, POSitive and NEGative.
Arithmetic Functions include: ADD, SUBtract, MULtiply, DIVide, MODulus, EQUality, GReaTer than,
LESs than, SELect, KON (numeric constant).
Navigational/Editing functions are also included in the I/O programming menus: ←, → (cursor move),
ENTer (line ENTer [on 5/5] and value ENTer), UNDO, DELete, BAcKSPace, BAcK (1 menu
position), MORe (menu screens), BAcK (leave edit w/o save).
On the LCD screen, the line (rung) number always appears above the token string for which the line has
been constructed.
001:[token string]002:[token string]
003:
END

⇐ the first line of the I/O program, the line number part
⇐ the first line of the I/O program, the token string part
⇐ the second line of the I/O program, the line number part
⇐ the second line of the I/O program, the token string part
⇐ the third line of the I/O program, the line number part
⇐ the third line of the I/O program, the token string partThe shortest possible (though not useful) I/O program:[has 1 line, line is not a screen line but a program line]

001:
END

The following is an I/O program that inputs a user programmable front panel key and outputs the logicalstate of the input to a user programmable front panel LED. The ID numbers specify the rightmost key andLED. The TRIP function is used as an output; therefore the output will be pulsed. (Function types will be
described in section 5.) With this I/O program running, a press of the rightmost user key will result in the
momentary (~1 second) illumination of the rightmost user LED. [An I/O program is running when themenu key run is selected from the choice pair RUN / STOP.] The duration is based on the speed at which
the lines of the I/O program are processed (by an I/O program "clock" [approximately 1 second]).
001:
I71 T67002:
END

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Starting with the above I/O program, the TRIP function is replaced with the OUTPUT function, and theBoolean NOT operator is inserted between the Input and the Output tokens. With this I/O program
running, the LED is immediately illuminated. Pressing the rightmost key causes the rightmost LED to
extinguish. The key is considered a logical False (low) when not pressed. The logical False (low) isconverted to a logical True (high) by the Boolean NOT operator which is in turn sent to the LED output
thus illuminating it. Pressing the key is considered a logical True (high). The logical True (high) isconverted to a logical False (low) by the Boolean NOT operator which is in turn sent to the LED output
thus extinguishing it.
001:
I71 ! O67
002:
END

The following is an I/O program that uses elements of the previous two programs to demonstrate thedifference between the Trip and Output functions. Again, the I/O program inputs a user programmablefront panel key and outputs the logical state of the input to a user programmable front panel LED. The Trip
function will be pulsed whereas the Output function is not. If the 70 key is pressed and held, the 66 LED is
illuminated for about a second, it must be released and pressed again to illuminate the 66 LED once more.
If the 65 key is pressed and held, the 65 LED is illuminated for at least as long as the 65 key is held.
001:
I70 T66002:
I69 O65003:
END

Front Panel Leds >Trip
OutputFront Panel Keys >

64

65

66

67

68

69

70

71

KEY

KEY

KEY

KEY

The following program provides indications of 2 Stopped Mode conditions. The first should be activatedupon pressing the front panel STOP key (leftmost LED). The second LED is illuminated when a process
stops due to failed crystal when running a deposition (LED 2nd from the left). Please note that once theleftmost LED is illuminated, it will not be off until the deposition process is run again. The next LED will
not be off until the deposition process is run again with the crystal replaced and re-verified (menu invokedat the 2nd press of the STATUS Key). Input 73 is not a simple Boolean value as was 71 in the above
example but a scalar numeric value. In the first case (line 001), the Stopped Mode (73) is input andcompared to the constant numeric value of 4 by the EQUality operator. If the input is equal to the value of
4 then it will be passed on to the Output at 64 as a Boolean True. If it is not equal to 4, then it will bepassed on to the Output at 64 as a Boolean False. The LED will, in turn, indicate the result. Line 002 issimilar except that the input is checked against the constant numeric value of 2 and the result is output to adifferent LED.
001:
I73 #4 = O64
002:
I73 #2 = O65
003:
END

⇐ inputs status of Stopped Mode from Front Panel. When true, LED = on
⇐ inputs status of Stopped Mode-Crystal Bad. When true, LED = on

Note: If these entries are added to the above examples in one program (by using higher rung #s), an error message will be
displayed: ERROR: 065 PHASE ERROR
OK. This indicates that the 065 output has already been used and theSTC-2000A software will not allow the rung to be entered as it is. If multiple sources could use the same output, the effectwould be difficult to trace back to all of the causes. The preferred way is to use intermediate elements to combine logic
before the single output. As programs are developed, editing over existing lines with the intent of complete replacement ispossible but there may be outputs used on lines beyond current edit line that may prevent the entry. Delete entire lines byusing the higher level menu key "DELete" to avoid this problem.

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The following I/O program activates relay 2 (if relay card is installed in slot 2) when leftmost user
programmable front panel key is pressed (relay activation can be heard).
001:
I68 O9002:
END⇐ inputs status of leftmost user key, outputs to Relay 2

The following I/O program uses a modulo 100 counter (ID 401) to activate user programmable LEDs on
the front panel. Starting with line (rung) 001, when leftmost user programmable front panel key is pressed,
the counter is advanced on the positive edge (function type set). Line (rung) 002 inputs the value of thecounter and compares this to the constant #0. The logical result of this compare (if it's equal or not)produces a True/False value output. This logic value is output to the rightmost front panel LED. If thelogical value is true, this LED will be illuminated. Line (rung) 003 inputs the value of the counter,compares this to the constant #1, if it's equal (401 contents = 1) the result will be True. Whatever the result,
this logic value is output to the next front panel LED[66]. If the logical value is true, the LED will be
illuminated. Line (rung) 004 inputs the value of the counter, compares this to the constant #2, if it's equal(401 contents = 2) the result will be True. Whatever the result, this logic value is output to the next front
panel LED[65]. If the logical value is true, the LED will be illuminated. Line (rung) 005 inputs the valueof the counter, compares this to the constant #3, if it's equal (401 contents = 3) the result will be True.
Whatever the result, this logic value is output to the leftmost front panel LED[64]. If the logical value istrue, the LED will be illuminated. Line (rung) 006 inputs the value of the counter, compares this to theconstant #6, if it's equal (401 contents = 6) the result will be True. If the result is True, the contents ofaddress 401 is cleared (set to zero). If the result is False, the Clear is not performed and the contents ofaddress 401 is not changed. The STC-2000A schedules the entire I/O program to run every 100ms.
Extremes of bandwidth availability, program length, line length and complication may limit this. There isspace enough in each memory (A and B) for a 1000 tokens (2 kbytes each). As the leftmost user
programmable key is repeatedly pressed, the user programmable front panel LEDs illuminate one at a time
starting with the rightmost LED, proceeding to the leftmost with each key press. Two key presses after theleftmost LED is illuminated (and extinguished), the count gets cleared and the sequence cycles throughagain.
Since this is a longer I/O program, now is a good time to discuss the program checksum. Whenthe above program is entered correctly, the checksum should be A04241 (that is, if it's in the 'A' memory[the MEMORY key of the I/O programming menu will be described in Section 5]). There are 2 nonvolatile memory areas in which I/O programs can be constructed and reside. One memory area is called 'A'
and the other is called 'B'. Only one memory area can be run / edited at a time. By means of a menu key
labeled SWAP, one memory is placed in the active edit/run position while the other memory is placed into
the unused state. The checksum should be B04241 if it's in the 'B' memory.
Stopping and restarting the I/O program does not clear the counter value (I/O menu: RUN/STOP
selections). Switching to the alternate memory and back again (from A to B to A or from B to A to B) willreinitialize the I/O program.
An alternate for line 001 that will automatically advance the counter once a second (see table
5.XX, ID # 224) is: I224 S401 [w/ program ID = A05027]. In cases where the count may have changed by
the time a line is encountered and evaluated (and would need to wait for the counter to cycle aroundthrough the maximum count and return to the checked value), the greater than would ensure an immediatefunction as in: I401 #5 > C401.
001:
I68 S401
002:
I401 #0 = O67
003:
I401 #1 = O66

SECTION 2.XX

⇐ inputs status of leftmost user key, outputs to counter on positive edge (Set to increment counter)⇐ inputs value of counter location, outputs logical evaluation of count (=0?) to rightmost LED⇐ inputs value of counter location, outputs logical evaluation of numeric count (=1?) to next LED

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004:
I401 #2 = O65
005:
I401 #3 = O64
006:
I401 #6 = C401
007:
END

⇐ inputs value of counter location, outputs logical evaluation of numeric count (=2?) to next LED⇐ inputs value of counter location, outputs logical evaluation of count (=3?) to leftmost LED⇐ inputs value of counter location, outputs logical evaluation of count clearing counter when true

As can be seen by the above program, the counter at address location 401 can be used as an input or an
output. The counter can contain a number from 0 to 99. In line 001, it is used as an ouput (set) access point
to advance the count (+1) of this specific counter. When the count increments, the result of some relational
evaluation of the sequential count at the 401 address will be a logic value. In these example cases,
evaluating true is based on that count value and to what it is compared by the equals function. The countthat is needed (to trigger some process element) is selected by comparing it with the needed constant value
to make the selection. For example, to count 50 things using the first Counter (see table 5.6), input thelogic value from count address location 400, and evaluate it using some combination of arithmetic or
logical elements.

Some ways to count 50 things...

I400 #50 =I400 #49 >I400 #50 < !

[contents = 50?][contents > 49?][[contents < 50] Not ]To do the same with the 8th Counter: I407.

Modulo 100 counter addresses (address 401 is used as an example):
400
401
402
403
404
405
406

0

1

2

407

408

409

Contents of 401 is incremented from zero with a press of the 68 key (on Positive edge)
Set is used to increment the couter. When content value equals zero, the result of line 2 is True.
Whenever the value contents equals zero, a logical True is what will be output to the LED 67.
Next Key press increments counter value +1. When 401 content value equals one, the result of line 3 is True.

Whenever the value contents equals one, a logical True is what will be output to the LED 66.

Next Key press increments counter value +1. When 401 content value equals two, the result of line 4 is True.

Whenever the value contents equals two, a logical True is what will be output to the LED 65.

etc.
Key presses increment counter value +1. When 401 content value equals six, the result of line 6 is True.

6

Whenever the value contents equals six, a logical True will effect a clear of 401 contents (to zero).

How to Develop I/O Programs:
This discussion may seem like a lot to absorb for unknown benefits. However, this short
introduction is needed to provide the user with the general I/O programming capabilities of the STC-SECTION 2.XX

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2000A. Once this is known, the system user need only run (or setup) their process until specific needs
become apparent. With a specific need in mind, a perusal of the Event and State ID List (Table 5.3) will
match your need to one or more of the many possible solutions within the expansive repertoire of the STC2000A.
There has also been provided some example I/O programming segments with accompanying
explanations in section 5. These can be used to construct larger programs that fulfill the overall process
goal. Included with the STC-2000A is a CD containing communications programs that allow theconstruction of I/O programs on a P.C. Writing I/O programs in this way is further enhanced as comments
can be added using a comma as a delimiter and not having to use line numbers. The Windows® program
running on the P.C. will strip the comma and all that follows on each line and add the line numbers as the
I/O program is downloaded into the STC-2000A. I/O programs constructed on the STC-2000A may also
be uploaded to a P.C. using the same communication program. The following is an example of such a
program constructed on a P.C. and from the P.C. view (this example [w/ checksum of 41779] is repeatedwith an explanation in a later chapter).
I73 #2 = S8,
I228 C8,
I79 #1 = O9,
I81 #2 & O10,
I221 S11,
I228 C11,
I0 T216,
I0 T202,I1 T200,
I2 T217,I3 T219,
I68 O64,

Stopped Xtal bad sets relay 1 slot 2.
Begin Job/Film Event, clears relay 1 slot 2.
Source 1 shutter connects to relay 2 slot 2.
Sensor 2 shutter connects to relay 3 slot 2.
Setpoint thickness trigger sets relay 4 slot 2.
Begin Job/Film Event, clears relay 4 slot 2.
Input 1 slot 1 is start unconditional.
Input 2 slot 1 is stop.
Input 3 slot 1 is final thickness trigger input.
Input 4 slot 1 is zero substrate thickness trigger.
Input function key 1 to front panel LED 1.

unning a deposition
test mode (introduce concept of, defer desc., user can test drive w/o danger)
run time mode: (concept of, text details only, implementation/screens deferred)
m2.2)

SECTION 2.XX

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SECTION 3.0

Menu Programming and Operation Details

Overview
To reiterate, the STC-2000A is an extremely flexible and versatile deposition process controller.
Through its soft key menus on the LCD display screen it can be configured to do almost any deposition
process and conform to almost all system requirements. (Soft key refers to the LCD overlay touch keys
whose definition, at any point, is software dependent.)
It would be advantageous, while reading this manual, to take an STC-2000A without connections,add the AC power cord and switch the STC-2000A to the power on position. With the unit unconnectedfrom the system and powered-on, try (as far as possible) what is being read from this manual using the
STC-2000A hardware. The RunTime screen will always appear at power up after a correct initialization.
Pressing the fixed front panel MENU key while the RunTime screen is displayed, provides accessto the menus. The programming menus, which concern the deposition process, are the FILM parameters
and the PROCESS listing. Film parameter menus along with an associated source sensor map containmaterial and source dependent parameters. Parameters for 50 material/source combinations can be stored
in the STC-2000A. In the STC-2000A these 50 films can be arranged to form a process of up to 99 layers,
with each layer having an independent final thickness. Nine different processes can be stored. Only one
film within one process can be actively controlling at a given time (non-active sources can be maintained at
non-zero levels). The STATUS key returns the RunTime screen from any menu screen. In addition, the
STATUS key provides detailed source information in two screens when pressed successively begining with
the RunTime screen displayed.
The unit utilizes the extremely sensitive and time proven 6 MHz quartz crystal as the sensor
device. The STC-2000A can operate from 90VAC to 264VAC (50-60Hz, 1.4A rms@120VAC, 0.7A
rms@230VAC). Units are shipped from the factory with a 120V nominal line voltage cordset. Before
attempting to operate the unit with other than this cordset (voltages beyond the 120V nominal range),
proper IEC-320 cordset must be selected as appropriate for the line voltage and mating receptacle
configuration. See section 4.
Deposition Programming
The STC-2000A is a Deposition Rate Controller with an LCD display. It uses keys along withmenus for programming. Programming choices are defined or valid ranges are given. Invalid entries are
ignored. There are three general categories of menu operations performed on the STC-2000A that can beclassified as programming of the instrument. There are a few interdependencies that cross group lines.
1) Deposition Programming

2) Input/Output Programming3) System Configuration Programming

The I/O and System Configuration programming generally occur only at the initial installation orwhen the coating system is physically altered. The first part of Section's Group 3.XX of the manual
describes the Deposition Programming and general operation of the STC-2000A. The later part of thissection's group covers system configuration. If the STC-2000A arrives installed in a system, Section 3 may
be the only section of the manual that is required to be read. Section 4 covers the physical installation of thesensor and unit . Section 5 of this manual describes the operation and use of the programmable I/O whichallows the STC-2000A to be easily interfaced to most systems.
All of these programming functions are performed through the front panel keys of the STC2000A or alternately through one of the computer interfaces described in Section Group 6.XX. Software
controlled touch key areas on the LCD display are shown below. If anything is unclear, return to sectiongroup 2.XX.
LCD display
has a
12 X 4 key
touch panel
overlay.

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STC-2000A Front Panel
There are several areas of interest on the Front Panel. These are illustrated in Fig. 3.1.

user

instruments
STATUS

programmable

STOP

KEYs
(4 elements)
MENU

START
HAND CONTROLLERZEROMANUALpendant jack(manual mode)

STC-2000A THICKNESS / RATE CONTROLLER
user programmable
LEDs (4 elements)

LCD Display/Touch
ScreenFixed Keys: STOP, START, MANUAL, ZERO, MENU, STATUS
Fixed USER programmable software
controlled keys (4) and yellow LED
indicators (4). Software control
is accomplished by user entered
I/O programming.

Figure- 3.1: STC-2000A Front Panel and Key Descriptions

Fixed Keys and Software Controlled Keys (Touch Screen)
The software controlled touch keys and the fixed MENU key are used for programming entries,
numeric and otherwise, and to navigate through the programming menus of the STC-2000A. When the
STC-2000A is initially turned on or generally when it is in operation, the display on the screen will besimilar to the display shown in Figure 3.2. This is called the RunTime screen. It shows most of the vital
parameters of the deposition process and is described more fully in Section 2.3. When the fixed MENU
key is pressed the unit enters its programming menu tree. The touch keys select the menus and program theparameters. When the RunTime screen is displayed, some touch keys are active such as the area
containing the text "L/Q". Pressing this area on the RunTime screen brings forth sequential text for thevarious control loop quality factors (crystal stability modes) (see Section. 2.10). This allows selection of
the alternate modes (1-4). Forcing a sample, if crystal sample and hold is implemented, can also be selectedby pressing the text "SMPL" (see Section. 2.10). The area in figure 3.1 indicating the power% at 31.2 isalso a live area. Pressing this area changes through a sequence of observable parameters: RATE – A/S,
POWER% and THICKNESS – KA. As the graph can be programmed to show: RATE, RATEDEVIATION and POWER (a REVIEW FILM parameter), two parameters can be indicated simultaneously(one graphically and one numerically) on the LCD display.

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Typical Runtime screen.
The fixed STATUS key returns the RunTime Screen from any menu screen. When the RunTime screen isdisplayed, the STATUS key brings forth 3 consecutive screens: the first is another version of the RunTime
screen having the values of RATE, POWER and THICKNESS in large text characters in exchange for the
now missing RUN#, time/date and graph. The second status screen shows source control output/ pocket/
power. The third status screen shows sensor channel contribution and status. The next press of the
STATUS key returns the RunTime screen.
To reiterate, the fixed front panel STATUS key is a multifunction key. The different navigational
functions are based on the screen (or category of screen) that is displayed when the STATUS key ispressed. The following illustrates the 5 possibilities. Four are part of a sequence that begins with the
RunTime screen and returns to the RunTime screen.

4 Part Circular Sequence

RunTimeScreen

1st (detailed)
STATUS Screen

STATUS
key pressed

1st (detailed)
STATUS Screen

STATUS
key pressed

2nd (detailed)
STATUS Screen

2nd (detailed)
STATUS Screen

STATUS
key pressed

3rd (detailed)
STATUS Screen

3rd (detailed)
STATUS Screen

STATUS
key pressed

RunTimeScreenAny Menu
Programming
ScreenSECTION 3.XX

STATUS
key pressed

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The following 3 LCD screen depictions show the second, third and fourth parts of the above 4 partsequence. The following 3 screens will be called the 1st STATUS screen, the 2nd STATUS screen andthe 3rd STATUS screen respectively.

1st STATUS
screen2nd STATUS
screenVariation of 2nd STATUS screen showing MAX power limit indication
2nd STATUS
screen

2nd press of STATUS key from Runtime screen brings forth this screen.

3rd STATUS
screen

3rd press of STATUS key from Runtime screen brings forth this screen.

The following shows a RunTime screen that was put into manual mode by pressing the fixed front panel
MANUAL key while running a deposition cycle. The text MANUAL appears on the screen in place of thetext messages: rise 1, soak 1, rise 2, soak 2, deposit, etc.

SECTION 3.XX

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If manual mode is entered while in the rise, soak or deposit phases of a deposition, the following arrow key
additions will appear on the 2nd STATUS screen. They can be pressed to change the power% value. The Uparrow increases power. The Down arrow decreases power. If the pendant is connected, pendant arrow keys
can be used in conjunction with the LCD arrow keys. If an LCD arrow key and a pendant arrow key areheld depressed simultaneously, the last key pressed and held gets the attention. [Manual mode can be entered bypressing the fixed front panel MANUAL key while in rise, soak or deposit phases of a deposition.]

The ZERO POWER key is used to zero the power on non-active source outputs only. It has no effect on theactive source output. Pressing the key (box) labeled ZERO POWER brings forth a key to the right of it that
can have 3 possibilities: ZERO CHannel 1, ZERO CHannel 2 and ZERO ALL. After the 3rd key label in thesequence, the area to the right of the zero power key reverts to blank. The ZERO POWER key is used to
select the desired function and the key to the right, which indicates the function, is pressed to make theselection.

The ZERO THICK key is used for diagnostics and tooling set up only. It has no effect on the deposition
thickness as seen on the LCD display. What is zeroed is the raw value that comes from the sensor card. For
either FORCE FAIL or ZERO THICK selector keys, the selections appear to the right in the form of a key,that when pressed, will effect the named channel[s] with that function. Also, in either case, pressing the keylabeled FORCE FAIL or ZERO THICK brings forth the key to the right. The ZERO THICK key yields 3
possibilities: ZERO CHannel 1, ZERO CHannel 2 and ZERO ALL. FAIL CHannel 1, FAIL CHannel 2,
FAIL ALL and RE-VERIFY are generated by pressing the FORCE FAIL key. The FORCE FAIL keyyields 4 possibilities: FAIL CHannel 1, FAIL CHannel 2, FAIL ALL and RE-VERIFY. The FORCE FAIL
function can fail any crystal, including the active crystal[s]. When a crystal is failed, the system will look
for a backup crystal or crystals. To re-evaluate/reinstate a failed crystal sensor, by force fail key orotherwise, the RE-VERIFY key is used. The RE-VERIFY key checks all potentially active crystals and reverifies their status as good or bad. This is useful when a nearly loaded crystal is replaced as in thefollowing example scenario.

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Starting with 3 crystal sensors mounted in a chamber, each having external electrical connections
and oscillators in place, one crystal sensor is connected to sensor channel 1, and one crystal sensor isconnected to sensor channel 2. If channel 2 is programmed as its backup, automatic switching to the second
crystal sensor on the second channel is accomplished when the crystal sensor on channel 1 is force failed.
Replacing the broken/loaded crystal on the first channel (with the 3rd unconnected crystal sensor) and reverifying allows the first channel to be used again. This example, meant as glimpse into some possibilities,
presents only the effected topics here but there are other elements such as shutters, thickness values, etc. to
be considered.

An example of a force fail selection appearing to the right (3rd STATUS screen).

An example of a zero thick selection appearing to the right. Next, re-verify BAD crystal.

An example of the 2nd STATUS screen during a deposition when not in manual mode. Note the absence ofarrow keys (not in manual mode).

An example of the 3rd STATUS screen during a deposition when not in manual mode.

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Check crystal and reinstate if good (re-verify).

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The general function of the selector/result/select keys is illustrated below.
(2nd STATUS
screen has
only 1 selector.)

Selector A.

Selector B.

press here to scroll
through selections
shown at right.

press here to scroll
through selections
shown at right.

All Selections
appear here.
Press here toaccept selection.

A selects:
re-verify
fail ch 1
fail ch 2
fail all

B selects:
zero ch 1
zero ch 2
zero all(blank)_____________________________________________________________________
Fixed Keys:
Start and Stop Keys
The following 2 fixed keys are used to start and stop a deposition run.
STOP -The fixed STOP key always terminates the automatic operation of the STC-2000A andbrings the source control voltage to 0 volts (0% Power). The STOP key is always active.
START - The fixed START key in the STC-2000A is multifunctional. It is used to Reset andrecover from abnormal Stop conditions (max. power conditions, sensor failure or manual stop button
pushes) along with STARTing or proceeding through the multi-film process sequencing. When the
START key is pushed a menu which defines all the functions of the START key is displayed. The START
key is active during RunTime screen only. See Figure 4.3 for start menu, which appears in what is
typically the graph display area. The START menu is automatically canceled after 15 seconds without
user activity.

Figure- 5.4: Start Key Menu.

Note[Non-SEQuencing configuration: the boxes now containing “PROC 1: ABRT” and “LAYER #” in Fig. 6.5 will not exist. There will not be a
START key menu. See Non-SEQuencing Section 2.20.]

When the START menu is displayed, press the text box required to select the desired operation of
the start function. Not all selections on this menu are valid at all times. Whether a selection is valid depends
on the state of the STC-2000A. For example, when the unit is first turned on or has experienced anabnormal stop the STC-2000A is in an error state. The START key is first used to reset the error condition(RESET/START PROC). This brings the unit to a Process Resting state, at this point the operator has theoption to restart the process from the beginning of the current film (RESTART FILM); to restart theprocess at the next layer (NEXT LAYER); or to reset the process to the beginning layer by pushing a
START followed by pressing RESET/START PROC. Once the process is reset to its beginning (which isindicated by Layer = '#') the process can be started by pushing the START key followed by pressing
RESET/START PROC. Take note of the changing PROC 1: xxxx messages as the start menu is used.
The BREAK WAIT is valid when the layer sequencing has encountered a WAIT in its processlayer list in the Process menu. (See Section 2.6). Under this condition pushing BREAK WAIT releases thewait and begins the sequence step. The wait can also be released via I/O or computer interface (see sections
5 & 6).

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Flow chart depicting the steps of a START process.

VERIFYXTAL

3rd RESET/START PROCLAYER = #

WAIT
CHECK

BUSY
Proc

ERROR

STOP

1st RESET/START PROCREST

2nd RESET/START PROCFirst press of START key + RESET/START PROC key:
Second press of START key + RESET/START PROC key:

to REST location.
to STOP location.

Third press of START key + RESET/START PROC key: to VERIFY CRYSTAL location.

This sequence was presented to help provide an understanding of a start. Other sequences are possible.

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Fixed Key: Zero Key - Active during runtime screen only.
ZERO - This fixed key zeros the thickness number used and displayed by the STC-2000A.
Pushing the ZERO key stores a new zero reference for the sensing crystal. Any mass from previously
deposited materials is subtracted from the new thickness calculations. Zero thick on 3rd STATUS key press
does not zero the calculated thickness, but is used as a setup/diagnostic to zero the value from the sensor
card.

Fixed Key: Manual Key
MANUAL - Used to enable/disable the manual control of power. (See Section 2.8) This fixed key
toggles the use of the manual power pendent. When in manual phase, the Automatic rate control of the
STC-2000A is inactive, the control voltage to the deposition source can be increased, decreased or set to ‘0’(STOP) with the pendent buttons. Pressing the pendent up and down buttons simultaneously will zero thecontrol voltage without aborting the run. The MANUAL key is only active after a film has been started andduring RunTime screen and other screens available through the STATUS key only. When you leave
MANUAL power control by pressing the MANUAL key a second time, the STC-2000A goes to the
Deposit phase of the film program without zeroing the thickness reading (see Section 2.8). The pendent
STOP button is functional only in the MANUAL mode.

SECTION 3.1

NAVIGATING THROUGH STC-2000A MENUS

Menu TreeAn overview of the main programming menus and screens is shown in Figure 7.3. The keys to navigate
from menu to menu are shown in screenlike boxes with arrows to a general function category. [Theseboxes are not meant to be true LCD depictions.] For example, to display the Main Menu while on the
RunTime screen, the fixed front panel MENU key is pressed, to display the Review Film Menu while on theMain menu screen, the Review Film key is pressed. Refer to Figure 8.3. on the next page.
In the next section, the RunTime Screen and the information and data that appears on it will be
described. The STATUS key returns the RunTime screen from any programming menu location (1st key
press). When the RunTime screen is displayed, pressing the STATUS key will invoke three otherconsecutive screens as described in the previous section.
The Sequencing mode is fully described in the menu tree whereas only the non-sequencing mode
differences are shown.
Please note that the text boxes of the following menu tree are not meant to be true LCD screen
depictions.

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STC-2000A MENU TREE (process sequencing)(non-SEQ differences only)
0.0 A/S

0.0 %PWR

Review FILM#

on Run Time Screen (press fixed MENU key).

0.000 KA

0.0 A/S

REVIEW SS MAP #Review FILM#SERVICE Menu
NEXT ACTIVE FILMEXECUTIVE MENU

Active Film:(See Sect. 2.20 )Set active film to user
specified film number.

0.0 %PWR

Review SS Map #NEXT ACTIVE PROCESS

Review
PROCESSESSERVICE Menu

EXECUTIVE MENU

Press fixed
STATUS key for
RunTime Screen

SQ/non-SQ. (S2.4)
factory settings.
purge stored data.
TEST mode. (S2.7)

Review SS Map:
Source Sensor (See Sect. X)

Review Processes:(See Sect. 2.5,2.6 )Review or edit
process to be
specified by user.

Review Film#:(See Sect. 2.4,2.5 )Review or edit film
parameters of user
specified film.
MAIN / EXECUTIVE MENU

Active Process:(See Sect. 2.19, 2.7 )Set active process touser specified process.

0.000 KA

Only the main
menu screen has
these RunTime
values displayed
at the top.
All other menu
screens have pathinformation onst
the 1 line.

Communications setup

OPT/INF

System configuration
Process accounting

I/O Setup

Process accounting:(See Sect. 2.18 )View process history
accounting screen.

Communications setup:(See Sect. 6.5 )User specifies: Com I/Olock code, keybd. beep,
RS232 baud and protocol.

Opt/Inf: (See Sect.2.21)
Reports on installedinternal and external
options and reports info
about versions, serial #s,
checksums, build codes,
error codes, etc.

System configuration:(See Sect. 2.14, 2.13 )User specifies: shutter
delay enable, 2 sensor
enable, rate sample
enable, LCD contrast,
password lock#, run#,recorder fnct, clock t&d,
deployment of sensor
cards and I/O cards.

[boxes not meant to be true LCD depictions]

I/O setup; Operations:(See sects. 5.9, 5.20 )User selects operations mode:run or stop or bak.

I/O setup; memory:(See sects. 5.10, 5.20 )User selects memory mode:
save, swap or bak.

SECTION 3.XXI/O setup:(See Sect. 5.1 )View, scroll I/O rungs. View
operations status (run/stop)and I.D.#. Further select:
Operations, Edit rung (line)
and Memory.

Figure- 3.4: Menu Treepage 63 of 292

I/O setup; Edit:(See sects. 5.11, 5.12, 5.13, and5.20 )
User edits selected line/rung using
arrow keys or GOTO. Insert / deleterung line, and change rung.

I/O setup; Change:
Build/edit rung with command andlogical operator keys. Edit withundo, delete last character.

p STC-2000A DEPOSITION CONTROLLER y
SECTION 3.2

RunTime Screen

SEE SECTION 2.21 for proper initialization sequence.

When the instrument powers up and has fully initialized, you are presented with the RunTime
Screen. When this display is present, you can start, stop, and view the operation of the STC-2000A.
Figures 9.1 and 10.6, show typical RunTime Screens. While the RunTime screen is displayed, the 1st , 2nd
and 3rd press of the STATUS key will bring forth 3 screens showing a version of the Runtime screen withrunning paramters in large text, and 2 screens showing detailed sensor channel information and live keys.

Note →

The fixed STOP Key is active on any screen.

There are several areas of interest on the RunTime screen.
RunTime Display Description
Area # 1: Rate, Power and Thickness
1. Rate, Power, and Thickness Values. These are the current values of the three most important
process data and their units. These values are displayed on the LCD display
consecutively in text (touch indicated area) or graphically (menu change) andsimultaneously on the first STATUS screen in large format. They are also shown on thefirst line of the main menu screen. When max power is reached: the text PWR% willalternate with [MAX!] (on MAIN menu) and on other various LCD displayed screens.
Area # 2: Current Phase
2. Current Phase. This tells you what phase or stage of your process that you are currently in.
After you power up the STC-2000A or you return from a power loss, it is in a STOPPEDRESET state. Other main states are MANUAL, plus all of the phases associated withsource conditioning and DEPOSITION.
Area # 3: Data Area
3. Data Area. This shows a real-time view of your deposition process (an X/Y graph). Both thevertical and horizontal scale of this display area can be changed to make this display themost meaningful for your process. The data shown in this area during the DEPOSIT
phase can be one of three types; rate deviation, rate, or power. The data type and scale areprogrammable as film parameters. This area is overwritten by the START menu options
when the fixed start key is pressed (shown below).

2

1

5

4

1
Figure- 3.5: RunTime Screen

3
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p STC-2000A DEPOSITION CONTROLLER yArea # 4: Miscellaneous
4. Miscellaneous Area. This has several pieces of data in it. These are:
FILM - Shows film program that you are currently running (1 of 50).
SRC # - Indicates the Source Sensor Analog Output voltage channel. An SRC of zero
indicates that a source analog output control voltage has been assigned to a source sensor
card that is not present, not working, etc.
XTAL 1 and 2 - Shows which sensors are currently active or standby. Active crystals
are indicated by their numeric name. Standby crystals are indicated by their numericname alternating on the screen with a dash at a ~1Hz. rate. Percentage of potential crystal
life left can be viewed by pressing the STATUS key twice. When a new sensing crystal isinstalled it will indicate 99 to 95% of crystal life remaining. A sensing crystal will show
0% remaining when the mass deposited on the surface of the crystal has caused thesensing crystal to shift by 1 MHz. About 500,000 KÅ of aluminum causes a frequency
shift of 1 MHz. Depending on the material being deposited, a sensor may failconsiderably before showing 0% remaining life. This is due mainly to the high film
stress generated by some materials or other characteristics of the deposition material
which causes the sensing crystal and circuit to cease oscillation prior to the full MHz shift
generally possible with deposition materials such as Al, or Cu .
MAP # - Each sensor has various parameters. A map is an associative list of these source
sensors with their parameters along with source power parameters, tooling, etc. This list
can structure the sequence of which crystals start active, which are backups, etc. A
unique map can be identified by its map number. Only one map can be active at a time.
A Map is used when it is called out by the film parameter SS Map Select. A map can be
re-used (called by more than 1 film).
RUN TIME Shows minutes and seconds into the film.
PHASE TIME - Shows minutes and seconds remaining in the current timed phase, or
elapsed for indefinite duration phases (such as DEPOSIT).
RUN # - A user programmable number that increments at the start of every Process.
Area # 5: Process Status Line
5. Process Status Line - These two in-line text boxes running horizontally in the top left sectionof the screen indicate: the process being used, the current layer number, and the process
status when the unit is configured for SEQuencing (non-SEQuencing configuration
blanks these 3 boxes). The process status has one of the five following messages
displayed:a)PROCESS STOP - This message is displayed when the last layer of the process has been
completed or the process has been reset (by using the (START-Reset/Start Proc) from a
PROCESS RESTING. A process must be in this state to start a process from layer 1.
b)
PROCESS WAITING- This message displayed when a WAIT has been encountered in
the layer sequence. A (START-Break Wait) or a programmed I/O input can release thewait. (START-Reset/Start Proc) takes the process to RESTING.
c)
PROCESS RESTING - This message occurs during the reset (START- Reset/Start Proc)of a PROCESS ERROR or PROCESS WAIT condition. While in this condition the user
can reset (START-Reset/Start Proc) to PROCESS STOP, Restart the current layer(START-Restart Film) or start the next layer (START-Next Layer). These options allow
the user to select the error recovery method.
d)
PROCESS BUSY - This message occurs during an operation phase of a deposition
process.
e)
ERROR IN RECIPE - This message occurs when a process is started which has no layer
information programmed.
f)
ERROR-FILM ABORT - This message occurs when an abnormal event occurs during
the running of a film. Anything which stops or aborts a film program causes this message
to occur (i.e. crystal failure, max. power abort, Front Panel STOP key, power loss, etc.).
A reset (START- Reset/Start Proc) takes the process to the PROCESS RESTING phase
where the user can select the path of error recovery desired.

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Main Menu Description

SECTION 3.3

From the RunTime screen, you navigate into the main menu parts of the STC-2000A by using the
fixed MENU key. After pressing it, the Main Menu screen will appear and the display will look like
Figure 11.7. Pressing the fixed STATUS key while navigating menus (including the MAIN MENU)
restores the RunTime screen. Pressing the BYE key while navigating on other menus (highest level) will
restore the MAIN MENU.

Main
menu or
1st
Menu

Figure- 3.6: Main Menu Screen.

Main Menu Selections
There are several options at this point. The keys that are used here are:
Choice: REVIEW FILM#
REVIEW FILM# -Goes into the review/edit film mode to the last film selected. Note that the film
selected for view/edit can be different than the active film. Pressing the Review Film key invokes
the 1st of the following 2 displays. Note on this display that film number 21 is specified. To selecta different film for review/edit, press the GO2 FLM (go to film) key. When the numeric entry
screen appears, enter the film number to edit or review by pressing the digit key[s] that represent
the desired number (tens value first followed by units value or just the units value) and press
ENTer to accept or BAcK to discard. See Section 3.4 for a detailed explanation of the review/edit
capabilities. The current active film is also allowed for review/edit selection.

Choice: REVIEW SS MAP
REVIEW SS MAP - Allows viewing/editing of Source Sensor Maps. Goes into the review mode to thelast map selected. Note that the selected map can be different than the active map. Pressing the
Review SS MAP key invokes the 1st of the following 2 displays. Note on this display that map
number 7 is specified. To select a different Map for review/edit, press the GO2 MAP (go to map)
key. When the numeric entry screen appears, enter the map number to edit or review by pressing
the digit key[s] that represent the desired number (tens value first followed by units value or justthe units value) and press ENTer to accept or BAcK to discard. See Section 3.4 for a detailed
explanation of the review/edit capabilities. The current active map is also allowed for review/edit
selection.

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Choice: Next Process
NEXT ACTIVE PROCESS - This key choice allows the user to change the active process. There isstorage in the STC-2000A for 9 different processes. The box containing the text NEXT PROCESS
is a key used to indirectly input a new active process number. Pressing the NEXT PROCESS key
invokes the following display. Note on the main menu display above that the active process
number specified is 1. To select a different active process, press the NEXT PROCESS key. Whenthe numeric entry screen appears, enter the active process number needed by pressing the digit key
that represents the desired number and press ENTer to accept or BAcK to discard. The number lastentered immediately becomes the specified active process. At times during certain phases ofnormal product use, the number digit will be temporarily replaced with the text NA (notapplicable) indicating that it would not be desirable to change the ACTIVE PROCESS at a time
when it is running. Also, NA appears when beginning with a memory purged unit. The active
process is the process that will begin with the next start. To change an active process, the STC2000A must be reset to the PROCESS STOP condition (Any error condition must be cleared andno process can be running). See Sections 3.6-3.7 for full description. Thus to select a process, thekey text must indicate: NEXT PROCESS x, not UNIT BUSY NA.

Process selection is notpossible with this indication,use START key to reset.

Choice: Review Processes
REVIEW PROCESSES - This choice allows the product user to review and edit the process layer list
(recipe) of the selected process (1 through 9). Select the process number by pressing the REVIEWPROCESSES key. The process that was last edited is shown in the menu path (top line).
associated digit key. Pressing the REVIEW PROCESSES key invokes the 1st of the following 2
displays. To select a process for edit/review, press the GO2 PRC key. When the numeric entry
screen appears, enter the number of the process to be edited/reviewed by pressing the digit key
that represents the desired number and press ENTer to accept or BAcK to discard. Note that theprocess you are editing does not have to be the active process. The active process is indicated bya "+" on the menu path line of the REVIEW PROCESS menu.

Choice: Executive Menu
EXECUTIVE MENU - Changes how the STC-2000A is configured (communications, system
configuration and I/O setups) and allows access to Process Accounting screen and OPTions/INFo.
(See Section 3.19). A menu as shown in Figure 3.16 will appear. These are mainly system
operations that involve setups/configurations that are infrequently used. I/O setup is described in
Section 5, Communications Setup and computer interfacing in Section 6, Process Accounting in
Section 3.18, and System Configuration/Communications setup in Section 3.16. OPTions/INFo is
described in section 3.19.

SECTION 3.XX

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Figure- 3.7: Executive Menu.
fixed STATUS Key
Fixed STATUS key removes Main Menu (or any other menu screen) and returns the RunTime Screen. The
first press of the STATUS key after the Runtime screen is displayed shows a version of the Runtime screenwith vital parameters in large text characters in place of the graph and date/time, run #, etc. A second andthird press of the STATUS key after the Runtime screen appears will invoke detailed power and crystal
information by channel. [See STATUS key illustrations in section 3.0]
Service Menu
SERVICE menu – This choice brings up the Service MENU which provides selection of : SEQ vs. nonSEQ product function, return to factory settings, purge ALL stored data, and test mode entry.
Keys toggle functions and key labels alternate between TEST on / TEST off, SEQ / non-SEQ,
etc. To initiate any of the Service MENU personalities, any or all four of the choices are toggled
on or off or sequenced as needed and the Accept/Restart Product key is pressed. The productwill restart with the selected personalities in effect. Only the user selected SEQ/non-SEQ
personality will remain in effect upon subsequent product power cycles. AS IS, PURGED and
FACTORY is a three way select. Optional memory interface card [see back panel], when installed,
adds Memory Card key functions to the factory/purge sequence and allows saving or restoring allparameters, films, processes, and I/O programs in memory locations A and B to the memory card.
ARM RESET allows restarting with same features selected.

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SECTION 3.4

Films and Processes

STC – 2000A Film Process Data Storage
FILM # 50 PARAMETERS
FILM # 8 PARAMETERS#9#8

PROCESS LIST

FILM # 7 PARAMETERS#7

PROCESS LIST

FILM # 6 PARAMETERS#6

PROCESS LIST

FILM # 5 PARAMETERS
FILM # 4 PARAMETERS#5

PROCESS LIST

FILM # 3 PARAMETERS

PROCESS LIST

FILM # 1 PARAMETERS

PROCESS LIST
Step

Mode

Film#

1
AUTO
2
AUTO
3
WAIT
4
AUTO
UP
TO
END
99

3
2
3
2

RUNTIMEINFORMATION#4PROCESS LIST

FILM # 2 PARAMETERS

FILM RECIPE LIBRARY

PROCESS LISTPROCESS LIST

#3#2

ACTIVE PROCESS 1-9#11

Thickness KA

USE FILM #

0.030
0.400
0.600
0.250

3
LAYER #

1

PROCESS RECIPE LIBRARY

Figure- 3.8: Film & Process Storage.

Films & Processes Description
A deposition process is controlled by the parameters programmed by the user in the film
parameter and process sequencing lists. Figure 12.8, illustrates the film parameter and process data storage
and the relationship to the RunTime mode. The figure shows a process (Process 1) sequencing through thelayers (currently on layer 1) using the parameters of Film 3. The ending thickness for this layer isdetermined by the final thickness for step 1 (layer 1) programmed in the process list. Each of the nine
processes can have a different set or arrangement of any or all of the 50 films. A process list canrepetitively use a film program for different layers (steps) as in the case for layer 1 & 3 of Process 1. The
ending thickness for each layer is independent of the film parameters and determined by the value
programmed in the process list.

SECTION 3.5

Film Edit/Review Mode

Editing Films
The STC-2000A has storage for 50 sets of film parameters (50 films). Depending on the systemand hardware configurations, up to 42 parameters per film can be stored. On the MAIN MENU, the Review
Film key provides entry into the menu area containing all film edit/review menus. An unprogrammed unit
will start with film 1 selected. When the REVIEW FILM key pressed, this brings into view the film
parameter list, which was last selected as the film to review or edit using the numeric entry screen. The film
number that is currently being viewed and can potentially be edited, is indicated on the top line of thedisplay (menu path/status/ID line) in the form EDIT x, where x is the film now open for viewing/editing.
If the film number that is displayed when is the REVIEW FILM key pressed is not the film needed forviewing/editing, press the GO2 FLM (go to film) key to bring forth the numeric entry screen. This is simply
a vehicle used to go to the film number as indicated by the entered number. This may or may not be theactive film, that is, the current film that is in use. The Active Film number value can be seen, as was theedit film number, on the top line of the REVIEW FILM menu screen in the form ACTIVE x, where x is thefilm now active for a starting process. The Active Film number value is also indicated on the RunTIme
screen [ FILM __ ]. To edit or review a different film while on the REVIEW FILMS menu , press the GO2
FLM key again and change digit[s] as required. The alternate film number will be selected whereupon
editing/reviewing can commence on the subsequent menu screens as well as on the REVIEW FILM menu.

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The GO2 FLM key thus provides lateral navigation from film to film on that menu level. To reiterate,
Selection of the edit film is indicated at this menu level by the text edit appearing in the path line. The
value following the text edit is the current film for review/edit. Selection of the active film is indicated at
this menu level by the text active appearing near the end of the path line. The value following the text
active is the current active film. [note: active film selection will be discussed in detail later. An active film isselected by a process step in sequencing mode and by the NEXT FILM key in non-sequencing mode.] For each film
there are up to 42 parameters that can be programmed. The film parameters are in the format of a long list,
where you have a viewing window which shows 6 parameters at a time and a cursor (*) within the viewing
window that moves from line to line. The cursor indicates the parameter that is currently changeable. The
UP↑ and DOWN↓ keys are used to scroll the screen and select the different parameters. When the cursor isforced beyond the limit of the 6 line window, the page scrolls up/down by five lines plus the line on which
the cursor was last. The BYE key returns the MAIN menu screen.
Changing Parameters

Figure- 3.9: Review Film Menu.
The EDIT (EDT) key brings forth the REVIEW FILM edit screen where the parameter selected by the
cursor is shown by itself. The specific parameter name, its current value, unit value name and value range
appear. On this menu level, scrolling with the arrow keys traverses the list one parameter at a time. If a
screen is password locked, a "LOCK CODE NEEDED" message screen will insert itself when an EDT
entry is attempted (passwords will be discussed shortly).

Figure- 3.10: REVIEW FILM edit screen
Pressing the Change (CHG) key invokes a numeric keypad on which direct number or representative
numeric values are entered. Scrolling at this hierarchical menu level traverses the list one parameter at atime with one notable exception which is the non-presentation of the list items prefixed with the "-".

REVIEW FILM change (CHG) entry screen

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Pressing the BAK key on the above menus cancels the current menu (or keypad) and moves back to theprevious menu. Pressing the BAK key will also discard any edit value while pressing the ENTER (ENT)
key accepts the entered edit value. Numeric keys can be pressed indefinitely and are shifted in from theright until either BAK or ENT are pressed. The entered value appears under the parameter name. In theabove example, the value "1.00" is replaced by zeroes and the first number pressed becomes the rightmost
digit (in the following case, a "1" was pressed). Also, as the first digit is pressed, a clear (CLR) key
appears. Pressing the clear (CLR) key restores the original value. (The fixed STATUS key returns the
RunTime screen from any menu point.)

REVIEW FILM change (CHG) entry screen after first entry
The next digit that is pressed appears in the rightmost position while the previous digit is shifted to the left.
In other words, as key digits are pressed the numeric representations are built from the right and the entries
can continue indefinitely (to make corrections). INVALID will appear if a numerical representation isincorrect.
If an illegal value is ENTered, an error message will appear on the bottom of the screen: "ERROR:VALUE OUT OF RANGE". The legal range of values message is presented, as previously described, as ahelp guide.

When an out of range value has been entered for a parameter, the ERROR message can be cleared bypressing the OK key. Clear also restores the original parameter value. With the error message cleared,
value entry can be resumed (or BAK can be used to abandon the change).
MENU/STATUS Key Descriptions
In order to get back to the RunTime Mode at any time, press the fixed STATUS key (a discussion
about other menu options is found in Section 3.9). Because the most frequent menu activity is to change aparameter and see its effect on the RunTime Screen, pressing the fixed MENU and STATUS keys will
become almost automatic to move back and forth between these two screens. Notice on returning back to
the Review Films Screen that the same parameter appears that was last viewed.
As you proceed through the parameter list, you may notice that some lines begin with a dash (-),
this means that the parameter is dependent upon another parameter that is itself not used or not enabled.
The parameters following RATE RAMP MODE are an example of this. Find this parameter in the Review
Mode and set it to OFF. The 3 following parameters are all associated with RATE RAMP MODE. If it is
set to OFF, then these 3 will have a "-" indicator. Rate Ramp is used to change the desired rate to a newsetting during deposition. As the parameter list is traversed, note that the cursor will skip over the unused
parameters (marked with a “-“) but they can still be viewed. These "-" prefixed parameters will not bepresented if scrolling is accomplished when the single parameter screens are viewed

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These 3 parameters
are dependent on
the RATE RAMP
MODE parameter.

System Related Parameters
The number of film parameters displayed will not vary but the number of accessible elements mayvary with the way the STC-2000A is configured [e.g. SEQ / NON-SEQ mode differences]. The STC2000A determines that if it is configured for certain types of hardware ( example) there are parameters that
do not make any sense. The STC-2000A provides conflict information and only allows running withcorrect parameters depending on its configuration.
General description
To reiterate, there are 42 programmable parameters. There may be less parameters available at times due toparameter mode choices which preclude the availability of other related dependent parameters. The fixed
MENU key is pressed to show the MAIN MENU. The REVIEW FILM key is pressed to enter the
Review(/Edit) Films menu. Different films can be viewed/edited by pressing the GO2 FLM (go to film)
key. In Sequencing mode, the active film is set by the film value on the programmed lines (steps) of aprocess program. In non-sequencing mode, the active film is set by pressing the NEXT FILM key on themain menu (this invokes a numeric entry screen through whose use the film is specified).
The first line of the Review(/Edit) Films menu shows the menu path to the current menu inhierarchical form. On the same line, the film now being viewed is named after the text "EDIT". Likewise,
the film that is now active is named after the text "ACTIVE". The first parameter on the list will appear
first (density) as this is a factory default setting. Thereafter, the last viewed parameter on which the cursor
is left when exiting the menu, returns with the same cursor placement along with its adjacent list
parameters as the point of interest when returning to the list.
If the fixed STATUS key were pressed to leave the REVIEW FILM menu while individual parameters
were being scrolled, a return to the REVIEW FILM menu would return the parameter list not the individual
parameter view.
The following shows the result of entering a number (123.456) into the temporary workspace. This was
accomplished by pressing "1", "2", "3", "4", "5" and then "6". If a mistake were made, the sequence could
begin again at any point in the sequence. Digits move from right to left as they are entered (decimal point is stationary).

After the complete desired number is entered, pressing ENTer will transfer the value from the temporary
workspace to the saved parameter list value. Range boundaries will be enforced by software when notalready enforced by available digits.
Pressing the BAK or CLR keys will result in the abandonment of any values entered in the current
temporary workspace. Clear maintains the screen and resets the workspace to zeroes. BAK returns theparameter list screen.

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Note → X12345 CHECKSUMNOTE: observe the changing checksum of the parameter list as new parameter values are ENTered(designated by the X prefix). This checksum is an aid to identifying a parameter list (all parameter values
together) as unique. This allows tracking of film numbers to obtain specific results and repeatability.
When system problems occur, film numbers can be checked for integrity by use of this checksum. See
section 3.19, Checksum Validation.

For parameters whose values are not numeric, numerically represented values are selected per theirdescriptions on the help line. In the following example, there are three choices to be made: RATE, RATEDEVIATION, and POWER. The RATE choice is made by pressing the "1" key. The RATE DEVIATION
choice is made by pressing the "2" key. The POWER (PWR) choice is made by pressing the "3" key.

Scrolling up beyond the first parameter wraps to the end of the parameter list. Similarly, scrolling down
beyond the end of the parameter list wraps to the beginning of the parameter list. The beginning and end of
the parameter list is demarcated with a list line having the following " - - - -".
When starting from the main REVIEW FILM MENU screen (see Figure 3.9), pressing the EDiT key may
generate the following screen if the PASSWORD LOCK# under the SYSTEM CONFIG. key on the
EXECUTIVE menu has a value other than zero (a non-zero value enables the password and is itself thepassword). The EXECUTIVE menu key is on the MAIN menu.

Using PASSWORD LOCK, enter up to a four digit lock code as the password. Enter a zero to disablepassword entry. Unfortunately, for someone who has forgotten the password, when a password is in force,the password must be used to change it to zero, that is, to disable it. Fortunity, for security this is true.
MENU KEY DEFINITIONSBYE: pressing BYE cancels the review film process and returns to the MAIN MENU screen. The fixed
STATUS key returns the RunTime screen.
BAK: cancels the current menu level and returns the previous menu and/or screen.
GO2 FLM: changes review/edit from current film to named film number via the numeric keypad.
SEQ/non-SEQ product differences (see sections 2.1 and 3.8 for additional information):
SQ: active film# is always selected by a process.
non-SQ: active film# is selected in place of active process# (MAIN menu key label change [nextprocess↔next film] is apparent along with non-appearance of the REVIEW PROCESSES key.

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The following reiterates information providing a starting place for parameter values when the STC-2000A
is received directly from the factory or the unit has had the memory purged or set to factory defaults.
Section3.3 describes the Service menu and memory configuration. Section 3.6 (end of next section) will
also discuss how memory is changed. While viewing the LCD screen, some parameters are not accessible
until other related parameters are in an appropriate state. These parameters are thus dependent upon thecondition of other parameters. A list of these dependent parameters is given along with their controllingparameter (see section 1.7).

Film Parameter: Source Sensor Map SelectSource Sensor Map Select is a film parameter and as such a sensor map may be thought of as an extensionof the film parameters. Each film calls out a specific map. Many different films can reuse a single map.
Maps define many elements including the analog control output voltage and associated parameters, crystal
activity and associated parameters, sensor channel activity and associated parameters.
To Program a sensor map, start with the film parameter Source Sensor Map Select. Select the map numberthat will be edited (or has been edited). Press ENTer to accept the value or BAcK to discard the enrty, ifany. This will select a map as the active map when the calling film is itself active and running. See section
2.1. The MAP# in use is shown on the Runtime screen along with the calling Film.

Film
Parameter

From the Main Menu, select the source sensor map named by the film parameter. This is initiated bypressing the REVIEW S S MAP key. See section 1.8 for all Map parameters.

Result of pressing the Review SS MAP key

Result of pressing the EDiT key

To select a different map than the current map, press the GO2 MAP key. A numeric entry screen will appear that isused to enter the needed map number to be edited. There are 10 maps available. Each map can profile a power supply.
Result ofpressing GO2
MAP key.

As was the case with Film parameters, there arealso Map parameters that are dependent upon otherparameters for accessibility. Note the "-" Prefix.

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p STC-2000A DEPOSITION CONTROLLER y
NON-SEQUENCING MODE: SELECTING THE ACTIVE FILM
NON-SEQUENCING MODE Runtime screen.

NON-SEQUENCING MODE Main Menu (note missing REVIEW PROCESSES and change from NEXT PROCESS
to NEXT FILM). (See section 2.1 for description of modes.)To select the next active film in non-sequencing mode, begin by pressing the NEXT FILM key on the Main
Menu above. This action will result in the following numeric entry screen. The entry made here will
become the active film following the next START sequence. The BAcK key returns to the Main Menu
without change. The ENTer key accepts the entry and returns to the Main Menu. The numeric entry, if
made, will show itself within the "NEXT FILM" key legend and on the runtime screen following the text
"NEXT FILM:" (see above). When the running, this will become the active film and appear after the text "FILM".

Film Parameter values after memory purge:[non-SEQ adds "Final Thick Limit=0.0 KÅ"]See Section 1.8 for Programmable Parameter Lists and Programmable Parameter Dependency Lists.
See Section 2.2 for Menu Parameter Values & Programming After Memory Purge and ...After Factory
Restored Memory.
Film parameter difference (from purge) with a factory restore:
max power limit set to 50% (purge = 0%).

Related System Configuration values after memory purge:
LCD Contrast
Password Lock #Run number

Medium00

Recorder Functions
Recorder Output Channel

Rate
1

I/O Slot X Type
Memory Module IFC

UnusedOff

Related System Config differences (from purge) with factory restore has:recorder function set to show POWER. <<<END>>>SECTION 3.XX

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p STC-2000A DEPOSITION CONTROLLER y

Detailed Film Parameter Descriptions____________________________________________________________________
Parameter
DENSITY
DENSITY VALUE RANGE IS 0.40 - 99.99
Units
gm/CC
Material Density
The Density parameter refers to the measured material in gm/CC. This constant is normally thebulk material value but is sometimes different due to deposition and film growth conditions. This value isutilized in the thickness equation to convert measured mass to a thickness value. See Table 4.1 in Section
4.3 for an extensive value list. See Section 4.2 for calibration information.
____________________________________________________________________
Parameter
Z FACTORZ FACTOR VALUE RANGE IS 0.100 - 9.999
Units
None
Material Z-Factor
The Z-Factor parameter refers to the elastic properties of the measured material. This value isutilized in the thickness equation to match the acoustical properties of the film being measured to theacoustic properties of the base quartz material of the sensor crystal. This correction is necessary to insure
accurate measurements when sensor crystal shifts of greater than 10% are realized. See Table 4.1 for an
extensive material value list. See Section 4.2 for calibration information.
____________________________________________________________________
Parameter
SETPOINT THK LIM
THICKNESS VALUE RANGE IS 0 - 999.999 KA
Units
Kilo Angstroms
Setpoint Thickness Limit
The SETPOINT THICKNESS parameter is used to provide a comparison point for the STC2000A Thickness Setpoint Event. This event will be triggered whenever the thickness display equals or
exceeds the setpoint value. The final or end thickness of a layer is layer dependent and is determined by
the value programmed in the process, it should not be confused with this parameter which is film
associated.
____________________________________________________________________
Parameter
Final Thickness Limit (Trigger)
non-sequencing only
THICKNESS VALUE RANGE IS 0.000 to 999.999 KÅ
Units
Kilo Angstroms
Final Thickness Limit
The FINAL THICKNESS LIMIT parameter is only present in the non-sequencing mode. It is used
to provide an end thickness value whose counterpart in the sequencing mode is the thickness value in aprocess program. This value determines the end of the deposit for the active film.
____________________________________________________________________
Parameter
SETPOINT TIME LIM
ELAPSED TIME RANGE IS 0:00 - 99:59
Units
Min:Sec
Setpoint Time Limit
The SETPOINT TIME LIMIT parameter is used to provide a comparison point for the STC2000A Timer Setpoint Event status. The timer relay status is set when this time is exceeded.
____________________________________________________________________
Parameter
SOAK 1 PWR VALUE
Percentage Value: Range is 0.0 - 100.0
Units
Percent
Soak 1 Power ValueSECTION 3.XX

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p STC-2000A DEPOSITION CONTROLLER yThis parameter sets the deposition source power value to be used as the first level of soak power inthe pre-deposition cycle. This power level will be maintained for the duration of the soak 1 timer. Thislevel is typically used to out gas and condition the source material. A value of 0.0% causes the
RISE/SOAK 1 phases to be skipped.
____________________________________________________________________
Parameter
PWR RAMP 1 TIME
Elapsed Time; Range is 0:00 - 99:59
Units
Min:Sec
Ramp Time To Soak 1
This parameter sets the duration of the power ramp from zero power to the power level set by thesoak 1 power value parameter. The source is typically heated slowly enough to permit outgassing and melt
conditioning without causing actual deposition to take place.
_____________________________________________________________________
Parameter
PWR SOAK 1 TIME
Elapsed Time; Range is 0:00 - 99:59
Units
Min:Sec
Soak 1 Time
This parameter sets the time that the source will remain at the soak 1 power level following thecompletion of the ramp to this level.
____________________________________________________________________
Soak 2 Power Value
Parameter
SOAK 2 PWR VALUE
Percentage Value; Range is 0.0 - 100.0
Units
Percent
This parameter sets the deposition source power value to be used as the second level of soak
power in the pre-deposition cycle. This power level will be maintained for the duration of the soak 2 timer.
This level is typically used to further out gas and condition the source material and actually begin
depositing material at a low rate. A value of 0.0% causes the RISE/SOAK 2 Phases to be skipped.
____________________________________________________________________
Parameter
PWR RAMP 2 TIME
Elapsed Time; Range is 0:00 - 99:59
Units
Min:Sec
Ramp Time to Soak 2
This parameter sets the duration of the power ramp from the soak 1 power value or the idle power
value to the value set by the soak 2 power parameter. The source is typically heated slowly enough topermit further outgassing and melt conditioning and actual deposition may begin during this time period.
____________________________________________________________________
Parameter
PWR SOAK 2 TIME
Elapsed Time; Range is 0:00 - 99:59
Units
Min:Sec
Soak 2 Time
This parameter sets the time that the source will remain at the soak 2 power level following thecompletion of the ramp to this level. At the end of this time the deposition phase begins. An external input
can be programmed using the programmable I/O to hold the film at soak until released (Soak Hold).
____________________________________________________________________
Parameter
SOAK 3 PWR VALUE (IDLE PWR)
Percentage Value; Range is 0.0 - 100.0
Units
Percent
Idle Power Value
This parameter determines the final (idle) power setting at the completion of the entire deposition
profile. If this power level is zero, a START command will begin a new power profile at rise 1, an idle
power setting other than zero will cause the power profile to begin at rise 2 after a START.
_____________________________________________________________________SECTION 3.XX

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p STC-2000A DEPOSITION CONTROLLER yParameter

PWR RAMP 3 TIME (IDLE RAMP TIME)
Elapsed Time; Range is 0:00 - 99:59
Min:Sec

Units
Idle Ramp Time
This parameter sets the duration of the power ramp from the power level at the time that final
thickness was reached until the power reaches the value set by the soak 3 power value parameter.
____________________________________________________________________
Parameter
DEPOSIT RATE
Rate Value; Range is 0.0 - 999.9
UnitsÅ/s (10-8 cm/s)
Deposition Rate
This parameter determines the material deposition rate that the closed loop control system will try
to establish and maintain at the time that closed loop operation begins.
____________________________________________________________________
Parameter
RATE RAMP MODE
On/Off
Units
None
Enabling Rate Ramp Mode
This parameter is an enable/disable switch for the rate ramp function and associated film
parameters. When set to Off the programming cursor window will skip over the associated parameters.
When set to On all associated parameters are accessible and it will be possible to alter the deposition
control rate profile during closed loop control. [The following 3 parameters are dependent upon thisparameter.]____________________________________________________________________
Parameter
NEW DEP RATE
Rate Value; Range is 0.0 - 999.9
Units
Å/s
New Deposition Rate
This parameter sets the new deposition rate value that is to be reached at the end of the rate ramp
operation.
____________________________________________________________________
Parameter
RATE RAMP TIME
Elapsed Time; Range is 0:00 - 99:59
Units
Min:Sec
Rate Ramp Time
This parameter sets the duration of the rate ramp. The rate ramp starts at the rate control value atthe time that the rate ramp trigger is reached and ends at the value set by the new deposition rate parameter.
____________________________________________________________________
Parameter
RATE RAMP TRGR
Thickness Value; Range is 0 - 999.999
Units
Kilo Angstroms
Rate Ramp Trigger Point Thickness
This parameter sets the trigger point for a rate ramp to begin during the deposit phase.
____________________________________________________________________
Parameter
CTL LOOP -PCtrl Loop Gain; Range is 1 - 9999
Units
None
Control Loop Gain Term
This parameter sets the closed loop rate control proportional gain.
____________________________________________________________________
Parameter
CTL LOOP -IControl Loop Time Constant; 0.0 - 99.9
Units
Seconds
Control Loop Integral Term
This parameter sets the closed loop rate control integral term time constant.
____________________________________________________________________SECTION 3.XX

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p STC-2000A DEPOSITION CONTROLLER yParameter

CTL LOOP -DControl Loop Time Constant; 0.0 - 99.9
Units
Seconds
Control Loop Differential Term
This parameter sets the closed loop rate control derivative term time constant.
____________________________________________________________________
Parameter
MAX POWER LIMIT
Percentage Value; Range is 0.0 - 100.0
Units
Percent
Max. Power Limit
This parameter sets the absolute maximum power level that will be allowed to occur at any timefrom the instrument (for the current film in use).
Specifically, this parameter selects the maximum percent of power that will be allowed out of thecontrolled power supply (named by the SOURCE OUTPUT CHANNEL parameter). This parameter andthe Map parameter Source Max Power are redundant but not without good reason. When a process isrunning, the lesser value of these two parameters will be used as the limiting value. Maps are intended to be
more closely associated with the source supply in terms of their definition at setup. One map may be calledby many Films and, as a consequence, a Film may inadvertently set the power at a level beyond what isdesirable for the power supply, wiring, etc. This is a fail safe way to limit a power supply configuration in aplace close to the hardware, that is, in a map configuration.
____________________________________________________________________
Parameter
ABORT MAX PWR SW
On/Off Value
Units
None
Abort On Max. Power Switch
This parameter is a switch value. When set to Off it has no effect on the deposition sequence andthe programming data window will not access the associated max. power dwell parameter. When set to On
a maximum power condition will be allowed for the time duration set by the now accessible max. powerdwell parameter and then the STC-2000A will abort the deposition sequence and power will be set to zero.
____________________________________________________________________
Parameter
MAX POWER DWELL
Elapsed Time; Range is 0:0 - 99:59
Units
Min:SecMax. Power Dwell
This parameter is associated with the max. power abort switch parameter and sets the allowable
duration of a maximum power condition before an abort will occur.
____________________________________________________________________

Shutter Delay (has 2 dependent parameters)
This operating mode, if enabled, allows precise rate control to be established before substrates are
exposed. For this capability the sensor must be located on the source side of the substrate shutter. A sensor
shutter may also be used if desired.
Parameter

SHTR DELAY MODE
On/Off
Units
None
Enabling Shutter Delay Mode
This switch type parameter will allow the shutter delay parameters to become active and the mode
functional on an individual film basis. If set to Off, the parameter window cursor will not access theassociated parameters. If set to On, the delayed shutter operation will be performed as specified by thefollowing parameters. [The following 2 parameters are dependent upon this parameter.]____________________________________________________________________
Parameter
SHTR DLY TIMEOUT
Process Timer; Range 0:01 - 99:59
Units
Min:Sec

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p STC-2000A DEPOSITION CONTROLLER y
Shutter Delay Timeout
This parameter sets a time limit for the delayed shutter operation to be completed. The time period
begins at the beginning of the shutter delay cycle. The sensor is exposed to evaporant with the substrates
remaining shielded. When rate control is established to the programmed accuracy, three things happen.
The substrate shutter is opened, accumulated thickness set to zero, and the programmed deposition profileis then started. If the specified rate control accuracy cannot be met within this time limit, the deposition will
be aborted.
____________________________________________________________________
Parameter
SHTR DLY QUALITY
Range is 1 - 50
Units
Percent
Shutter Delay Quality
This parameter sets the rate control accuracy that must be established for a period of five seconds
in order to complete the delayed shutter sequence. The maximum accuracy settable is 1 percent of thedesired setpoint. However, this is internally limited to 1 angstrom per second for noise and resolution
restrictions.
____________________________________________________________________

Rate Sampling (has 4 dependent parameters)
This operating mode, when enabled, allows the user to expose the crystal sensor for short periodsof time to the evaporant stream, establish rate control, and then shutter the sensor maintaining the power
setting established during exposure. For relatively stable deposition sources or systems that must maintainvacuum integrity for long periods of time, crystal sensor life can be greatly extended. Two sampling modes
are available. One has the exposure time strictly time controlled, the other will expose the sensor only longenough to establish the required accuracy. The exposure period for either mode is also triggerable
externally.
Sample and Hold

Figure- 3.11: Rate Sampling, Sample and Hold Operation.
Parameter

RATE SAMPLING
Rate Sample choices (1 of 3):
OFF
TIMED MODEINTELLIGENT MODE
Units
None
Enabling Rate SamplingThis switch type parameter will allow the rate sampling parameters to become active and the mode
functional on an individual film basis. If set to Off the parameter window cursor will not access theassociated parameters. If Timed Mode is selected, the crystal sensor will be exposed to evaporant for thetime specified by the sample dwell parameter, and will sample at the interval specified by the sample
interval parameter. If Intelligent Mode is selected, then the duration of the sample will only be long enoughto establish the desired accuracy. [The following 4 parameters are dependent upon this parameter.]____________________________________________________________________
Parameter
RATE SAMPLE
On/Off Value: Off or On
Units
On/OffEnabling Rate Sampling

SECTION 3.XX

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p STC-2000A DEPOSITION CONTROLLER yThis parameter assumes there is a shuttered head connected and that Rate Sampling can be used if
the film parameters are programmed for such. (Without the shutter, deposit would be continuous and negate
the advantage of this feature.) This feature extends the apparent life of the sensing crystal. It is used forthick coatings or in systems where it is not possible to break vacuum to change the sensing crystal.
Depending on various factors in your particular system, the apparent crystal life can be extended up to 50
times by using the rate sampling feature of the STC-2000A. Five film parameters which pertain to thisfeature are described in (Section 2.13).
____________________________________________________________________
Parameter
SAMPLE INTERVAL
Process Time; Range is 0:01 - 99:59
Units
Min:Sec
Sample Interval TimeFor either mode of operation this parameter will select the sampling interval of the sensor.
____________________________________________________________________
Parameter
SAMPLE DWELL TIME
Process Time; Range is 0:01 - 99:59
Units
Min:Sec
Sample Dwell TimeFor the Timed Mode selection this parameter sets the duration of sensor exposure.
____________________________________________________________________
Parameter
SAMPLE QUALITY
Quality Value; Range is 1 - 50
Units
Percent
Sample Quality
In the Intelligent Mode this parameter sets the control quality required to terminate the exposure
period of the sensor.
____________________________________________________________________
Parameter
SAMPLE ALARM TIME
Process Time; Range is 0:0 - 99:59
Units
Min:Sec
Sample Alarm TimeIn the Intelligent Mode this parameter sets the maximum allowable time allowed to complete thesensor exposure and control operation. The STC-2000A will treat this as a crystal failure when this limit isexceeded.
____________________________________________________________________
Parameter
FILM FAIL MODE
Meas. Processing: select 1 of 2 choices;
Abort If Fail
Complete On Time Power
Units:
None
Enabling Measurement Fail Processing
This parameter allows the user to select the system execution path if it is no longer possible to getreliable measurement information from the sensor system. This is the last resort choice that will be madeafter all other system configuration options have been exhausted. Choice 1) Abort If Fail, will abort thedeposition and set the output power to zero. Choice 2) Complete On Time Power, will set the unit into atime power completion mode. In this mode the last reliable control power level will be maintained andthickness accumulation will occur in a simulated fashion until the final thickness setpoint is reached. Post
deposition processing then will occur as programmed.
____________________________________________________________________
Parameter
CTL LOOP QUAL L
Select Value; Range is 0 - 9
Units
None

SECTION 3.XX

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p STC-2000A DEPOSITION CONTROLLER y
Control Loop Quality Limit
This parameter is used to set a threshold on acceptable control loop quality. When the threshold isexceeded a sensor fail condition is assumed and the system will process this condition as configured. A
programmed value of 0 disables this test. A value of one gives the tightest limits (5%).
____________________________________________________________________
Parameter
XTL STABILITY
Select Value; Range 0 - 9
Units
None
Crystal Stability Limit
This parameter is used to set a threshold on acceptable sensing crystal performance. When thethreshold is exceeded a sensor fail condition is assumed and the system will process this condition as
configured. A programmed value of 0 disables this test. A value of one gives the tightest limits.
____________________________________________________________________
Parameter
XTAL LIFE BOUNDS
Percentage Value; Range is 0.0 - 100.0
Units
Percent
Crystal Life Limit
This parameter is used to provide a setpoint on the allowable sensing crystal usage. This setpoint
may be utilized through the I/O system as a warning or interlock that sensing crystals need attention.
____________________________________________________________________
The following three parameters are used to select the data type and scale factors for the RunTime
screen graphics area. These parameter values are always reinstated when a film is started.
____________________________________________________________________
Parameter
PLOT VERT SCALE
Vertical Scale;
Select Specific Values 1/5/10/50/100
UnitsÅ/s or % Power as selected
Vertical Scale RunTime Display
This parameter sets the vertical scale factor of the graphics display on the RunTime Screen. If
Rate deviation is the type of data being displayed, generally setting this value to 10 will give a good displayof the deposition control.
____________________________________________________________________
Parameter
PLOT HORIZ SCALE
Horizontal Samples; Range is 1-600
Units
Samples Per Display Point
Horizontal Scale RunTime Display
This parameter sets the horizontal sweep rate of the graphics display on the RunTime screen.
Samples are taken at a rate of 4 per second. A programmed value of 1 will display every sample. The
X-axis is 200 samples wide on the RunTime display. By increasing the sample number the sweep rate isslowed down. Proper selection of this number allows an entire deposition cycle to be displayed on one
sweep of the screen, if desired.
____________________________________________________________________
Parameter
DATA PLOT TYPE
Initial Plot, Select 1 of 3 choices:
Rate
Rate Deviation
Power
Units
Å/S or % Power as selected
Data Plot Type
This parameter selects the type of information to be displayed in the graphics area of the RunTime
screen.
____________________________________________________________________
Parameter
Source Sensor MAP SELECT
Select Value; Range is 1 – 10
Units
maps
Source Sensor Map SelectSECTION 3.XX

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p STC-2000A DEPOSITION CONTROLLER yThis parameter is used to associate a specific sensor map to a specific film. When a film becomes
active, it will invoke the map number named by this parameter. The map itself is edited/changed within the
REVIEW SS MAP menu.
____________________________________________________________________
Parameter
POCKET SELECT
Select Value; Range is 0 – 63
Units
Pockets
Pocket SelectThis parameter is used to provide pocket information from a specific film in conjunction with thess map parameter: indexer sync mode. If indexer sync mode is set for either delay or feedback, thenfollowing an XTAL verify, the indexer activity will commence before arriving at the RISE1 phase. Either a
1 of N or a binary (3 digit) value issued through output relays by I/O programming will select the correct
pocket. If indexer sync mode is set to none, then the POCKET SELECT parameter has no effect.
____________________________________________________________________
Parameter
ETCHING MODE
Polarity Value: OFF/ON
Units
None
Etching Mode
This parameter sets the STC-2000A for either a deposit mode (positive rate) when set to OFF oran etch mode (negative rate) when set to ON.
____________________________________________________________________SECTION 3.XX

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p STC-2000A DEPOSITION CONTROLLER y

Detailed Map Parameter Descriptions____________________________________________________________________
Parameter
SOURCE FULL POWER
Full Scale Volts: [enter representative values 1,2,3 respectively] 2.5, 5, 10
Units
Volts
Source full power Control Voltage Scale SelectThis scales the control voltage of the STC-2000A to match your power supply. Provides
versatility to match supplies whose full power settings are one of these 3 selections. This allows 100%
power from the STC-2000A to be any of 2.5, 5, or 10 volts. (see section 3.9)____________________________________________________________________
Parameter
SOURCE MAX POWER
Percentage Value: 0.0 – 100.0%
Units
power %
Source max power SelectThis parameter selects the maximum percent of power that will be allowed out of the controlled
power supply (named by the SOURCE OUTPUT CHANNEL parameter). This parameter and the Film
parameter Max Power Limit are redundant but not without good reason. When a process is running, thelesser value of these two parameters will be used as the limiting value. Maps are intended to be moreclosely associated with the source supply in terms of their definition at setup. One map may be called bymany Films and, as a consequence, a Film may inadvertently set the power at a level beyond what isdesirable for the power supply, wiring, etc. This is a fail safe way to limit a power supply configuration in aplace close to the hardware, that is, in a map configuration.
____________________________________________________________________
Parameter
SOURCE OUTPUT CHANNEL
Analog Output Channel Selection: 1 - 2
UnitsChannels
Source Output Channel SelectThis parameter selects the channel that will be used as the control voltage output, that is the analog
output from the STC-2000A that controls the power supply that generates the evaporant stream. There are 2
identical analog outputs on the source sensor card. A source output channel (1-2) can be selected for use
here and the other source output channel can be used for the strip chart recorder (defined by a System
Configuration parameter: recorder out chnl). If the source output channel parameter and the recorder output
channel are set to the same channel, the source output channel will be used and the recorder function will
be lost. If this situation should occur, a reboot will be necessary to reassign the recorder output.
____________________________________________________________________
Parameter
MASTER TOOLINGTOOLING VALUE RANGE IS 10.0 - 400.0
Units
Percent
Master Tooling
The TOOLING parameter is used as a correction factor to compensate for geometric positiondifferences between the location of the sensor and the target substrate. Each of the 8 possible sensors has
its own tooling factor. If no correction is required, both the substrate and sensor see the material source inan identical manner and the Tooling Parameter is set to 100%. Generally, if the sensor is farther from thesource than the substrate, the tooling will be set to >100%. If the sensor is closer to the source, the toolingwill be set to < 100%. Master tooling is used in conjunction with the individual tooling for each channel.
The master tooling can be used as a global offset value for individual channel tooling or as a base toolingvalue upon which individual channel tooling is added. This is a parameter with global scope.
____________________________________________________________________
Parameter
MINIMUM START XTALSMinimum Number of Start Crystal Channels: 1 - 2
UnitsChannels
Selecting the minimum number crystal channels with which to start process

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p STC-2000A DEPOSITION CONTROLLER yThis parameter indicates the minimum number of crystals in the starting group when a process isbegun. To reiterate, this is a START value. The intent is to provide a qualification minimum for run
acceptability. If more than 1, averaging is assumed in conjunction with Channel x Start Mode map
parameter programming to more than 1 active sensor. This is a parameter with global scope.
____________________________________________________________________
Parameter
MINIMUM BACKUP XTALSMinimum Number of Backup Crystal Channels: 0 - 1
Units
Channels
Selecting the minimum number crystal channels for possible use as backup crystals
This parameter indicates the minimum number of crystals to be used as backup crystals. This is aparameter with global scope.
____________________________________________________________________
Parameter
MINIMUM ACTIVE XTALSMinimum Number of Active Crystal Channels: 1 - 2
UnitsChannels
Selecting the minimum number crystal channels that are active
This parameter indicates the minimum number of crystals that will be active when a process isstarted. The intent is to provide a guard for the minimum constellation of averaging crystal sensors the user
decides are necessary. For a process to run, this value cannot be greater than that of the minimum start xtals
map parameter value. This is a parameter with global scope.
____________________________________________________________________
Parameter
CHANNEL DROP FILTERChannel Drop Filter Mask Status: none / balance
Units
None
Channel Drop Filter
This parameter enables/disables a filter mask for use during multi-sensor averaging. Each crystal
sensor has a unique map parameter group. Programming 2 crystal sensor channels as active automatically
invokes an averaging mode. Lost channels during averaging are handled by this Channel Drop Filter Mask
parameter when enabled. An example of a crystal sensor/channel loss is crystal life failure. This parameterin the BALANCE setting, provides bumpless rate info if, for example, 2 channels are averaged and one
channel fails and has no assigned backup crystal sensor/channel for the failing channel. This is done bykeeping an historical buffer of the rate info stream for each of the 2 channels in this example case. When achannel fails (without backup), the historical rate info from each of the 2 channels is used to produce acomposite multiplier based on the 2 channels when they were both working that will be used to fill in forthe missing channel's contribution. This is, of course, a simplification for the purposes of discussion. When
averaging, the preferred setting should be BALANCE. The setting of NONE allows the composite rate tojump when a channel is lost (without a backup). The unit can also be set to fail when either of the 2 crystals
fails. This parameter has no effect unless in averaging mode. This is a parameter with global scope.
____________________________________________________________________
Parameter
INDEXER SYNCHRONIZATION MODE
Indexer Synchronization: NONE, DELAY, FEEDBACK
Units
None
Indexer Synchronization Mode
This parameter is used to provide pocket information in conjunction with the Film parameters:
Pocket Select and SS MAP SELECT. If indexer sync mode is set for either delay or feedback, thenfollowing an XTAL verify, the indexer activity will commence before arriving at the RISE1 phase. Either a
1 of N or a binary (3 digit) value issued through output relays by I/O programming will select the correct
pocket. If indexer sync mode is set to none, then the POCKET SELECT parameter has no effect. This is aparameter with global scope.
____________________________________________________________________
Parameter
INDEXER SYNCHRONIZATION TIME
Indexer Synchronization Time: 2 – 999 seconds
Units
Seconds:
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p STC-2000A DEPOSITION CONTROLLER yThis parameter provides the time value when the map parameter Indexer Synchronization Mode is
set to DELAY. The indexer allowed a predetermined pocket search time. This is a parameter with global
scope.
____________________________________________________________________
Parameter
CHANNEL x START MODE
[where x = 1 or 2]
Channel Start Mode: Off, Active, Standby
Units
None
Channel x Start Mode
This indicates which of the crystal sensor channels will be active when a deposition run starts.
Unless the crystal fails, or an I/O program processing event causes a configuration change, this crystal state
will remain in effect throughout the process.
____________________________________________________________________
Parameter
CHANNEL x FAIL ACTION[where x = 1 or 2]
Channel Fail Action: None, Abort Film
Units
None
Channel x Fail Action
This indicates what will occur when a channel fails for whatever reason. NONE provides no failaction. Abort Film provides a film abort when a failure occurs on this channel.
____________________________________________________________________
Parameter
CHANNEL x BACKUP LIST
[where x = 1 or 2]
Channel Backup List: Z – ZZ (1 item list or 2 item list)[where Z = 1 to 2 (in each position w/o redundancies, list extends to 0-2 for a 1 item list)]
Units
None
Channel x Fail Action
This parameter provides a list of potential backup crystal sensors should this channel fail forwhatever reason. The crystal sensor channel switching is automatic when there is a sensor failure.
Thickness and rate control is maintained during the switching operation. Also, for those multiple material
depositions requiring extreme accuracy of measurement that mixing of materials on one sensor could
degrade, it is possible to use a specific sensor for each material type.
comments:
Example backup lists:
0(zero) no backups are defined2
channel 2 is the one and only backup channel
21
backup channels are 2 then 1
11
incorrect list: 1 is repeated____________________________________________________________________
Parameter
CHANNEL x TOOLING[where x = any of 1 or 2]
Tooling Value: RANGE IS 10.0 - 400.0
Units
Percent
Channel x ToolingThis TOOLING parameter is used in conjunction with the MASTER TOOLING parameter as acorrection factor to compensate for geometric position differences between the location of the sensor andthe target substrate. Both of the 2 possible sensors have their own tooling factor. If no correction isrequired, both the substrate and sensor see the material source in an identical manner and the Tooling
Parameter is set to 100%. Generally, if the sensor is farther from the source than the substrate, the toolingwill be set to >100%. If the sensor is closer to the source, the tooling will be set to < 100%. See Section 4.2
for calibration information.
____________________________________________________________________
Parameter
CHANNEL x WEIGHT[where x = 1 or 2]
Weight Value: RANGE IS 10.0 - 400.0
Units
Percent
Channel x WeightThis parameter is used during a multi-sensor averaging process. Programming 2 crystal sensor
channels as active automatically invokes an averaging mode. Weight provides the user with a method toassign each of the sensors a contribution percentage of the total used to determine thickness. When not inaveraging mode, this parameter has no effect.
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p STC-2000A DEPOSITION CONTROLLER y
There are programmable Film and Map parameters that are only viable for particular hardware
configurations. Unless the hardware that is needed to support the programmable parameters is physicallyinstalled and configured appropriately (on the SYSTEM CONFIGURATION menu), the process will not
run and will display various error messages indicating the cause. The SYSTEM CONFIGURATION
menu is accessed through the EXECUTIVE menu which is located on the MAIN menu.
____________________________________________________________________
Examples:Repaired crystal channels (or channels failed by user programming) must be RE-VERIFY'd on the 3rd
STATUS screen before they can be recognized as good again.
If the typical PROCess X: status message does not change when the START key is pressed, check for"STOP: INValid XXX " message and check the OPT/INF menu, page 2 for cards not installedthat are enabled in software (MIA). AC Power must be recycled OFF ON to re-sync.
If SRC is zero, this is an indication that a source analog output control voltage has been assigned to asource sensor card that is not present, not working, etc. Remember that the Source/Sensor Card
connection and System Configuration parameter: I/O Slot X type are only evaluated on power up
or on reset. Check the OPTions/INFo menu, page 2 and 3 to see what is currently in effect. To
work correctly, the S/S x: line should end with OK. If it ends with EMPTY, the card is notpresent or not communicating. If the line ends with INCOMPATable!, the software versions in atleast some of the various PCB cards is not compatible- check for field changed PCB cards. If theline ends with MIA, that sensor card is configured but is not physically present. [See
OPTions/INFo menu]

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Review or Edit Processes

Figure- 3.12: Main Process Review/Edit Screen.

SECTION 3.6

Editing Processes

The STC-2000A has the capability of sequencing through many layers of film. The sequential
arrangement of films is called a process. The STC-2000A has the capability of storing 9 processes. The
maximum length of a single process is 99 layers. The total number of layers in use by the 9 processes is
250 layers. The following are equivalent: a layer, a process step, a line of process programming.
To operate the STC-2000A, a process of at least one layer must be programmed. If a process isstarted with no layer information programmed, the message ERROR IN RECIPE will occur in the process
status area of the screen. This also assumes the STC-2000A is in Sequencing mode ( See section 2.1).
[Memory Purge reduces all process programming to a 1 line process with an END command as the only
function (program starts and ends itself). Factory defaulted memory yields 9 process programs each with
an auto mode, a film number = process number, a thickness = 0.1 multiplied by the process number.]
To edit or review a process, press the REVIEW PROCESSES key on the Main Menu. The screen
appears initially as shown in Figure 13.11. Other sub-menu keys appear as needed. See below for a
detailed description of menu keys. To select a different process for review/edit, press the GO2 PRC (go toprocess) key. This will bring forth a numeric entry screen whose number entry will select the needed
process by its number name.
Each process step (also called layer) has 3 programmable parameters associated with it and is aline in the process program. The steps range from 1 to 99. The programmable parameters available are:Start Mode, Film#, and Thickness. Pressing the EDT (EDIT) key invokes the Process Edit screen thatallows line insertion, deletion and passage into the change/edit menu to modify and build steps using theCHG (change) key as the entry point. The change/edit menu provides entry of Mode, Film number andThickness. The two editing selections that are available for inserting or deleting layers are intended for use
in an existing process or a new process.
When the mode key is pressed, there are five selections as to how the starting of the film will behandled by the layer sequencing of the STC-2000A. The mode choices appear as key legends after themode key is pressed.
The five choices for modes which control the layer starting are: END, AUTO, WAIT, SKIP,
STOP. By selecting the appropriate start mode, a layer can be sequenced automatically or designed to wait
for a Front Panel break-wait or remote break-wait to proceed to the next step or layer. Generally, in an
actual process, only the first three start modes would be used.

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p STC-2000A DEPOSITION CONTROLLER y
Process Start Mode Edit Key Descriptions
Mode Choice: End
The End mode would terminate the process. It is always inserted as the last step of a process.

CautionCAUTION If the END statement is entered in the middle of an existing process, all steps orlayers that originally followed will be deleted.
Mode Choice: AutoIf AUTO is programmed to be the layer start mode, then this layer begins immediately uponcompletion of the previous layer. If layer 1 has AUTO programmed as its start mode then the first
appropriate start command generated begins this layer. Key legend is AUT.

Note

Note
The unit must be reset of any ERROR conditions, and not in the process RESTING
mode but in the PROCESS STOP phase before a start command will be accepted. The fixed START key isalso used to reset any process error conditions and initiate a process reset under some conditions. (See
Section 3.0, START process)Mode Choice: Wait
If WAIT is programmed to be the layer start mode, upon completion of the previous layer, theSTC-2000A enters a wait state. This is useful when some mechanical event such as rotation of a source
pocket, or some process change like gas composition occurs between layers. The appropriate startcommand (START-Break Wait) breaks the wait state and starts the layer. The break-wait command can beissued from either a Front Panel function, a remote input or through one of the computer interfaces. Key
legend is WAI.

Mode Choice: Skip
If SKIP is entered as the start mode, the layer is skipped over (key legend is SKP).

Mode Choice: Stop
If STOP is entered as the start mode, the process will continue until the stop is encountered. The
STOP is similar to an END with the exception that if it is installed in the middle of a process list, the steps
following are not erased.
The SKIP and STOP mode are normally not used in a process recipe. They can be useful during
the development of a process or to recover a process which has been aborted. Key legend is STP.

INSERT and DELETE.
Two list editing choices also become available when the EDT (edit) key is pressed.
Mode Choice: INSERTINSERT inserts a step in an existing list (key legend is INS) after the line with the cursor. [If
END is at line 1, cannot use INSERT. Use MODE to change END to another mode choice and END will
be auto advanced to position 2.]

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p STC-2000A DEPOSITION CONTROLLER yMode Choice: DELETE
DELETE removes a step from the process program list (key legend is DEL) indicated by the
cursor.
The mode for a step or layer can be edited while the process is running if the change is not on theactive layer or the change does not alter the length of the process list. (END, INSERT, and DELETE
generally changes the list length).

FILM# key legend is: FLM.
MODE key legend is: MOD.
THICK key legend is: THK.
ENTER key legend is: ENT.

After the mode is entered, the FILM# key (FLM) can be pressed. (Note that the MODE, FILM#
and THICK keys can be pressed in any order.) After pressing the FILM# key, one of the ninety-nine stored
films can be selected by pressing the digit key[s] followed by the ENTER key (ENT). This associates alayer or step in a process with a film program. The film program stores the material related parameters andcalls out a sensor map that contains source, tooling and crystal related parameters . The same film can be
assigned to multiple steps within a process. After entering the film number, the THICK key (THK) can bepressed. The desired final thickness for that layer is entered/edited by pressing the necessary digit keys
followed by the ENTer key. The number is built by shifting in digits from right to left and can continue
indefinitely until either ENTer or BAK is pressed. This allows entry correction by repeating the number
sequence until correct.
While constructing/editing the elements of a line (MODE, FILM#, THICKNESS), an edit line willappear at the bottom of the LCD screen to indicate that an edit is in progress. The edit line consists of aprompt naming the edit type followed by the value being entered. The edit can either be accepted bypressing ENTer or abandoned by pressing BAK.
Additional steps can be added to the process by repeating the above procedure. A step or steps canbe added to an existing process by positioning the cursor (>) at the step where the new step will be inserted.
The new line will be inserted after the line with the cursor. The former line step occupant and all
subsequent line steps are advanced in their list positions as the new step is added. Press the INSert key andthen a new step will be inserted. When this is done, the default parameters of SKIP, film 1, and thickness
0.000 are entered for the inserted layer. These can then be edited to the desired values.
In multi-layer deposition the same deposition material and source combination are sometimes usedin different film programs. Generally at least two film programs are associated with one material source
combination. One of the film programs contains source parameters (rise and soak time and power levels)
for the initial conditioning of the source or first layer or material usage, the other film program parameters
would be for subsequent layers of the same material.

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p STC-2000A DEPOSITION CONTROLLER y">" iscursor.

Review / Edit Process Specifics.
The following shows the review processes screen. The top line contains the menu path to the current
screen/menu followed by the process# currently being viewed. The Process# is selected by pressing theGO2 PRC (go to process number) key and the digit key[s] on the subsequent numeric entry screen. A "+"appears near the end of the top line (after path information) to indicate when the active process is being
viewed. The recipe ID number is also on this line (use to determine process program integrity). The ID is achecksum of the entire program. The ID with only the END at step 01 is 00000. The second line contains
the column headers, which remain fixed as the list is scrolled.
The angle bracket pointing to Step 01 is the view/edit cursor.
"+"
indicates
activeedit
process.

"+" indicates current step isthe active step.
BYE: pressing this key causes a return to the MAIN MENU. The fixed STATUS key returns the RunTime
screen.
GO2 STP: press this key to move cursor/list segment to indicate and display step number entered bynumeric keys that appear after GO2 STP is pressed (GOTO Step).
GO2 PRC: press this key to bring up a numeric keypad that allows changing the Process number (GOTO
PROCESS). Enter PROCESS# and press ENTer to accept or BAK to abandon.

↑: pressing the UP ↑ key moves the edit cursor toward the first of the four list lines currently on the screen.
When the edit cursor is on the first list line displayed (somewhere in the middle of a 20 line list, forexample) subsequent UP ↑ presses result in moving the line at the top of the displayed section of the list to
the last (4th) position of the displayed section. What were the last three list items are no longer seen andthree consecutively lower, previously unseen, numbers are now occupying the first three of the four
displayed lines. The cursor is always moved to a lesser numbered step number (list line) with each press of
the UP ↑ key (except at step 1). When the edit cursor is coincidental with step number 1 and UP ↑ ispressed, no action is taken other than to beep the audio indicator. In other words, the UP/DN keys movethe edit cursor up or down on the four list lines displayed and if UP/DN exceeds those list lines shown, thelist lines will be advanced or receded by three lines except at the beginning and end of the list lines.
↓ (down): pressing the DN ↓ key moves the edit cursor toward the last of the four list lines currently
displayed on the screen. When the edit cursor is on the last list line displayed, subsequent DOWN ↓presses result in moving the line at the bottom of the displayed section of the list to the top (1st) position of
the displayed section. What were the first three list items are no longer seen and three consecutively higher,

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p STC-2000A DEPOSITION CONTROLLER ypreviously unseen, numbers are now occupying the last three of the four displayed lines. The cursor isalways moved to a higher numbered step number (list line) with each press of the DOWN ↓ key (except at
the last step). When the edit cursor is coincidental with the last step and DOWN ↓ is pressed, no action istaken other than activation of the beep annunciator.
Starting with the cursor at step 01, pressing down ↓ three times moves the edit cursor alone. Scrolling has
the same behavior in all places/menu levels.

Pressing the down ↓ key once again causes the four-line window into the list to be shifted ahead by threelines as shown below. The edit cursor moves to the newly appearing, next consecutive list line. At thispoint, the UP↑ key could be pressed one time and the down ↓ key could be pressed three times with only
the edit cursor moving, that is, before the list lines in the four-line window would change.

The following sequence shows the scrolling behavior using the UP ↑ key. Again, scrolling has the same
behavior in all places/menu levels.

Press the UP ↑ key three times for the following result.

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p STC-2000A DEPOSITION CONTROLLER y

Press the UP ↑ key one more time for the following.

GO2 STP: pressing the GO2 STP (GOTO STEP) key takes you to the step/line whose number you enterand accept by pressing ENT on the number entry key menu. The following screen is the result of pressing
the GO2STP key. If a number is entered that is greater than the last (END) line, the cursor would move tothe last (END) line.

The following screen shows the result of pressing the "1" key followed by pressing the "5" key. This value
can be accepted by pressing the ENT key, abandoned by pressing the BAK key or continued by pressing
more number keys (shifting more digits into the two digit GOTO prompt area at the end of the last line).

the following screen shows the result of pressing GO2STP and entering 15 as the destination (the "1" key,the "5" key and the ENT key)...

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p STC-2000A DEPOSITION CONTROLLER yWhen the destination is greater than 2, the line list will appear with the destination as the third line of thefour displayed lines with the edit cursor on this line. This gives a two previous and one succeeding line
perspective for reference and relational purposes. Near the end of the list this display preference is not in
effect.

Pressing the EDT (edit) key generates the following screen. If a password has been used (a non-zerovalue), an intermediate password entry screen will appear. See the end of this section for more details.

Process Edit
menu

Navigation remains as previously described. Three new edit related choices are now possible: change line
(CHG), insert line (INS), and delete line (DEL). DEL deletes the line with cursor. INS inserts a new line
after the line with the cursor. The following screens will help describe the change (CHG) line (that is, theedited line elements). BAK (back) always returns to the previous screen, discarding entries, if any were
made.
Pressing the CHG (change) key produces the next screen. Take note of the current values on the edited line
(line with the cursor ">"). This screen is the starting point for modification of mode, film# and thickness.
When a line element is edited(changed), an edit line appears at the bottom of the screen and shows thevalue in the temporary workspace.

Process
Edit/Change
menu

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p STC-2000A DEPOSITION CONTROLLER y
Pressing the MOD (mode) key brings forth the mode select menu as follows. SKIP is the default mode
value used when the INSert key creates a new line.

Process
MODE
menu

Pressing the WAI (wait) key changes the proposed mode value as seen next on the edit line.

Now press ENT (enter) to accept WAIT.

Notice that WAIT replaces SKIP on the edited line. MOD (Mode) could be pressed again or FLM (Film) or
THK (thick) could be pressed. The following screen shows the result of pressing the FLM (Film) key.

Process
FILM#
entry

Enter a "3" for film number 3 by pressing the "3" key. Note change in edit line on the following screen. Up
to 2 digits can be entered here as there can be up to 50 films.

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Press BAK (back) to abandon FILM# value edit. Press ENT (enter) to accept entered film number value as
seen next. Note that the FILM# on the edited line has been displaced by the new value of "3".

Once again, the change screen reappears from which any of the three choices could be made. The nextscreen depicts the result of pressing the THK (thick) key.

Process
Thickness
entry menu

Pressing the "1" key and then the "2" key produces the following screen. Numbers can be enteredindefinitely until either the BAK or the ENT (enter) key is pressed.

Pressing the ENT (enter) key returns the change screen. Please note that the decimal point is fixed and thatleading zeroes are suppressed.

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By using the arrow up/down keys, the order of entry could be to change the modes of lines 5, 6 and 7, thenchange the FILM#s of lines 5, 6, and 7 and then change the thickness of lines 5, 6, and 7.
Once in the edit/change mode, different parameters can be changed without leaving the edit mode.
Special Cases
The following screen appears when all of the total unit memory has been used. As the message relates,
recipe memory is used in its entirety. Although there can be up to 99 layers (steps) per process recipe andup to 9 recipes, there is not enough unit memory to have 99 layers for each of all nine recipes. Press the OK
key to clear the message screen.

The following screen appears when an active process is running and someone is attempting to edit theprocess while it is running. Press the OK key to clear the message screen.

If the PASSWORD LOCK# under the SYSTEM CONFIG. key on the EXECUTIVE menu has a value
other than zero (a non-zero value enables password and is itself the password) the following screen willappear when the EDT (edit) key is pressed. The EXECUTIVE menu key is on the MAIN menu.

Enter the lockcode number value in the same way as previously described for other number entries.

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p STC-2000A DEPOSITION CONTROLLER y
Processes: Factory settings vs. purged settings.
The following example LCD displays show the difference between factory settings and purged settings for
PROCESS# 2. The first screen is the factory setting and has, for step 01, MODE=AUTO, FILM#=2, and
THICK(KA)=0.200. The second screen is the purged setting and has only the END line.

Typical Factory Setting

Purged Setting

Factory (defaulted) Settings table for All Process Numbers:
STEP
MODE
FILM#
THICK

Proc# 1
01
AUTO
1
0.100

Proc#2
01
AUTO
2
0.200

Proc#3
01
AUTO
3
0.300

Proc# 4
01
AUTO
4
0.400

Proc#5
01
AUTO
5
0.500

Proc#6
01
AUTO
6
0.600

Proc#7
01
AUTO
7
0.700

Proc#8
01
AUTO
8
0.800

Proc#9
01
AUTO
9
0.900

All factory Processes have END as STEP 02.
To restore factory settings or to purge settings, press the SERVICE key on the MAIN menu. This brings
forth the SERVICE menu as shown below.

CautionPress the AS IS key once for PURGED, twice for FACTORY, thrice toreturn to AS IS.

Please be aware that changing thememory contents by thismeans changes more thanjust the process values. See
section 3.20 for a complete
description.

[See section 3.21, Check sum validation. See section 7.3, battery and memory loss.]

Press the ACCEPT (/ restart) key to accept the configuration as described by all of the key labels. This will
also cause the unit to REBOOT with the new configuration in effect. Please see the section describing theSERVICE menu as there are groups of settings other than those which are PROCESS# related (Filmparameters, I/O programs, etc.) that will be included in this configuration. Valuable processprogramming could be lost. No I/O programs are factory restored because of the danger involved. Purge
will, however, clear I/O programs. See section 5.15 (table 5.4) for I/O program entry.
Press BYE to leave the SERVICE menu without accepting anything changed.

If the password is forgotten and programming has not been saved in someother media, call factory to eliminate passwords without purging memory.
SECTION 3.7

Set Active Process

General Description: (See Section 2.9 and figure 2.12) To change the active process(only allowed when the instrument is in IDLE and the LAYER value is "#" indicating an at rest condition[observe the runtime screen]), press the fixed MENU key, which will produce the MAIN menu screen as
shown in the following figure. Next, press the key area that is labeled on the MAIN menu as ‘NEXT
PROCESS’ and sometimes referred to as the ‘NEXT ACTIVE PROCESS’ selection. The numeric entry

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p STC-2000A DEPOSITION CONTROLLER yscreen will then appear at which time pressing the needed digit will select the next active process. Pressing
the numeric digit keys allows any value from ‘1’ through ‘9’ to be entered as the next active process.
ENTer accepts the entry, BAK discards the entry, if made, key needs to be pressed. The active process willbe the value at which the digit value is left when ENTer is pressed. The next process started will use thisprocess number. Press the fixed STATUS key to return to the RunTime screen. If an attempt to change theactive process is made with the instrument in a non-idle condition either a temporary error message willappear saying ; “INHIBITED: UNIT MUST BE IDLED” or the text UNIT BUSY NA will appear in the
key instead of NEXT PROCESS. When the text "NA" appears on the key, the product is not allowing thealteration because it would not be desirable to change the process while it is running. The result of pressing
the key when UNIT BUSY NA appears will be an acknowledgement beep only. The process must be
stopped. See START: Reset/Start Process diagram below.
Press to change
ACTIVE Process

SECTION 3.8

Non-Sequencing Differences

Non-sequencing mode does not use processes but treats one of the fifty possible films selected as active ina single implicit process.
Note that process related information is not shown on the RunTime screen.

Note that the "Next Process" label has changed to "Next Film" and that the Review Processes key havebeen removed.

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Pressing the NEXT FILM key brings forth the numeric entry screen that is used to select the next active
film. BAcK returns the previous screen and discards the entry, if any. ENTer accepts the digit[s] entered as
the next active film and returns to the previous screen.

If 14 were entered, upon return to the runtime screen, the message "Next Film: 14" would appear as shown
below.

Programming the unit for non-sequencing involves the same type of communications and I/O setups,
system configuration, and film parameter modifications.
Process programming does not exist for non-sequencing product use.
An added parameter is added to the film parameter list: Final Thick Limit.
The final thickness, no longer part of process programming, becomes a parameter.
SEQ: active film# is always selected by a process.
non-SEQ: active film# is selected in place of active process# (MAIN menu key label change is apparent
along with non-appearance of the REVIEW PROCESSES key). [See section 2.1]
The non-sequencing mode has only one inherent unspecified process and films are manually
selected to be active. Only the film selected as active will be run (Main Menu in non seq mode). An
active film can be edited (modified) while it is running but only in a limited manner. This prevents
potentially dangerous situations from occurring. The limitations, that is, the parameters that are notchangeable while a film is running include the following:
Film parameters: SS Map Select, Pocket Select, Etching Mode.
Map parameters: CH x Start Mode, Source full power, Source out channel, Indexer Sync Mode.
Min ~~~ XTALS [3 parameters] (evaluated at start only except for RE-VERIFY key usage).
Next Film #: key legend changes from NEXT FILM x to UNIT BUSY NA.

A seeming inconsistency can apparently arise when in the non-sequencing mode as the STC2000A can be started using the MANUAL key from the idle state or the ready state. The apparent
inconsistancy would be caused when a parameter, such as the SOURCE FULL POWER (SS MAP
REVIEW), is changed and started or restarted using the MANUAL key instead of the START key. The
MANUAL key, although legitamite to use, does not update [resync] parameters, some of which arereflected directly or indirectly on the RUNTIME screen. Likewise, starting [restarting] and stopping using
the MANUAL key will not incorporate changes made unless the start key (or a system reset, or power on /off cycle) has been employed. Using the MANUAL key alone continues with the initial parameter settingsand does not utilize the changes, if any, that are made. Otherwise, in other cases, an inhibited error message
appears when parameter updates are attempted during an unsafe period. Using the example case, SOURCE
FULL POWER (SS MAP REVIEW), the parameter could be changed from 10 volts full scale to 5 volts full

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p STC-2000A DEPOSITION CONTROLLER yscale and [re]started using the manual key. The user might also reconfigure the [external] source power
supply to respond to a zero to 5 volt full scale range. Under these conditions the STC-2000A would
continue to utilize the initial parameter range of 0-10 volts and when the power was increased to 50% the[external] power supply would actually be at 100% power. Please use the START key when parameters
are updated in the non-sequencing mode!
Some error reporting is not the same between sequencing and non-sequencing modes. For
example, if the Source Sensor card were to lose communications with the main CPU card for whateverreason, an error message, STOP: S4 BAD, would appear on the Runtime screen (upper left) when in nonsequencing mode. In sequencing mode, screen 2 on the OPT/INF menu would specifiy the Source Sensor
card status as it would also in the non-sequencing mode, but no Runtime screen message would appear
indicating this error condition. In sequencing mode, the inability to proceed with the start of the process
should prompt the user to check the integrity of the Source Sensor card among other things. This example
problem condition, would require a reset or a power off/on cycle to re-establish communication between
the main CPU card and the Source Sensor card if no permanent hardware failures exist.

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SECTION 3.9

Software Controlled RunTime Screen Keys

There are several software controlled keys that are active in the RunTime Mode.

Crystal Quality Display.
L/Q Key
The rightmost single key area on the second row of the RunTime screen labeled "L/Q" is used to sequence
through the crystal quality indicators displayed on the RunTime screen (as depicted below). The
parameters that can be displayed are LOOP and QUAL. These are described in Section 2.17 under STC2000A Crystal Switch. Each press of the L/Q key, advances through the possibilities as shown. For thosethat are familiar with previous deposition control products, STABility is no longer presented by thismethod due to the increased complexity because of the added crystal possibilities. The STABility
information can now be found on the 3rd STATUS screen under the column header "S".

L/Q

LOOP
14

QUAL
12

L/Q

Stability

STABility now displayed on the 3rd STATUS screen
Related Film parameters: Control Loop Qual Limits
XTAL Stability S (Limits)

0 to 90 to 9Sample and Hold.
SMPL Key
Using the single key area below the L/Q key, the STC-2000A will force a Sample to be taken and restart
the toggling sequence of the Sample and Hold Phases when in a Sample and Hold mode. When in the
Sample and Hold mode, this area will not be empty as is normally the case and will contain text and values
appropriate to the activity which is running. See Section 2.13 for a description of Sample and Hold
operation and the associated parameters (MAIN/REVIEW FILM).
SMPL

SECTION 3.XX

SMPL
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Related Film Parameters: (XTAL) RATE SAMPLING(XTAL) SAMPLE INTERVAL(XTAL) SAMPLE DWELL TIME(XTAL) SAMPLE QUAL(XTAL) SAMPLE ALARM TIMESECTION 3.10

OFF,TIMED,INTELL.
0:01-99:59 MM:SS
0:01-99:59 MM:SS
1-50%
0:01-99:59 MM:SS

Manual Power Control

The Manual Power Mode is a method of controlling the source power manually. It is useful toinitially determine the operating point for the soak and deposition levels. The Manual Power Mode can beentered from the RunTime Screen or either of the 2 STATUS screens (see section 3.0). In addition, a film
and process must be running (not stopped) to enter the Manual Power mode. Section 3.20 defines anddescribes a test program. With this test program is running, all of these functions can be exercised and theireffects observed.

Hand Controller / Manual Power Mode
Although familiarization with the operation of the manual power control can be accomplished byreading alone, with the multilayered test deposition program mentioned above running and used as an aid,familiarization with the operation of the manual power control can be enhanced. By pressing the fixed front
panel MANUAL key, the STC-2000A is placed in a phase similar to DEPOSIT. MANUAL is shown as
the current phase displayed on the RunTime screen. The I/O event status designated as source shutter will
indicate open and the rate control loop is disabled during the Manual Power Mode (with test program
running). When in the MANUAL mode, a means of power adjustment using either one of two vertical
ARROW keys on the pendent becomes available. After entering the MANUAL mode, press one of the twovertical ARROW keys (see figure 3.12) and observe the RunTime screen. The power value indication
shown by the middle LED display section (front panel is labeled with POWER-%) will increase or decreasedepending on the arrow key pressed. You can also use the hand controller (pendent) to put the unit in a
STOPPED state by pressing the pendent STOP button. Pressing both of the pendent arrow keys
simultaneously, zeroes the power value. The twelve foot coiled cord of the hand controller (pendent) plugs
into the jack in the lower left corner of the front panel labeled MANUAL CONTROL.

MANUAL POWER

INC

DEC

STOP
instruments

Figure- 3.13: Hand Controller (pendent).

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press fixed MANUAL key for manual power adjustment using pendant

INC

D EC

STOP

Figure- 14.9 Manual Power Control
When you leave the Manual Power Mode (by pressing the fixed MANUAL key again), the STC2000A will enter the DEPOSIT phase of the film in use. The control loop will be active at this point. If
the Thickness number is greater than the programmed Final Thickness value when you leave MANUAL,
the STC-2000A will go to the next process step.
[The push buttons on the pendent hand controller can be used for other functions when the STC-2000A is notin the Manual Power Mode. By using the programmable I/O, these keys can control internal I/O events or output torelays. One common use example is to assign one of these buttons as an I/O program input to manually trip the final
thickness limit. An example of using these buttons for these functions is given in Example 5 of Section 5 of thismanual.]Manual Power Control (LCD keys)
If the pendent is missing or if the pendent's key functions have been re-programmed (reassigned
functionality) by an I/O program, there are available arrow keys that accomplish the identical functions.
These have already been discussed in section 3.0. To reiterate briefly, switching between DEPOSIT and
MANUAL can be accomplished on the Runtime screen, 1st , 2nd and 3rd STATUS screens. On the 2nd
STATUS screen, two arrow keys appear when switching into MANUAL mode. Press the UP arrow key toincrease power % value. Press the DOWN arrow key to decrease power % value.
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SECTION 3.11

STC-2000A Shutter Delay (Setting Up Shutter Delay Mode)

Shutter Delay Operation
Shutter delay operation is desirable when it is necessary to bring the deposition rate into good
control before exposing substrates to the evaporant stream. When this mode of operation is required it must
be enabled in the Review Film menu parameter list. This is not a global enable and will allow thefollowing associated film parameters of only this specific film to become active and programmable. These
parameters are:Parameter 1
Shutter Delay Mode
(On/Off) This parameter enables the mode of operation for this specific film program and also
allows the following parameters to be accessed when ON.
Parameter 2
Shutter Delay Time Out
Time-Out (Accuracy) 1 To 99:59 M/SThis parameter determines how long the system will keep trying to obtain the control accuracy value before
giving up and aborting the run (process time).
When the desired control accuracy is maintained for a period of 3 seconds before the time-out
limit, the thickness display is set to zero and the substrate shutter relay is energized. All associated crystal
switch, crystal backup, or active sensor selections and operations remain valid in this mode. Proper control
loop P-I-D settings should be previously determined. This will insure minimum delay times and will also
optimize film consistency. Refer to the I/O programming in Section 5 of this manual for a guide on
selecting the logic for use as the substrate and sensor shutter controls.
Parameter 3
Shutter Delay Quality
Control Quality (Accuracy) 1 To 50% Of Setpoint
This parameter sets the desired accuracy of the control loop before the substrate shutter is opened. The
maximum accuracy available is 1% of the deposit rate setpoint or 1 angstrom per second; whichever isgreater. The control accuracy must be maintained for a period of 3 seconds.
Film Parameters (/menu): Shutter Delay Mode
Shutter Delay TIMEOUT
Shutter Delay QUALITYSECTION 3.12

OFF, ON
0:01-99:59 MM:SS
1-50%

Deposition Source Control Loop Description

The STC-2000A instrument is designed to measure the rate of material deposition and compare
this measured value to a programmed rate setting, the difference between the actual and programmed rate isused to generate a feedback control signal to the deposition source power supply. The power supply is thenadjusted by this control signal to achieve the programmed rate setpoint value. This method of control
allows the STC-2000A to compensate automatically for source condition changes.
Control Output Voltage
Since there are many different types of deposition power supplies and sources in use today, thedeposition control voltage provided by the STC-2000A has been made user configurable. This control
voltage can be wired to be either positive or negative from chassis ground and scaled for either 2.5, 5 ,or 10
volts full scale. Full scale corresponds to 100% on the LCD power digits. The control voltage has 12 bit
resolution and 10 milliampere source or sink capability. The sense of the control loop can also be set foretching applications where it must operate in an inverted fashion. This configuration is done on the Review
Films parameter list menu (Etching Mode: Off/On).
P-I-D Control Loop
To accommodate the extremely wide range of control loop responses required for the diverse
deposition sources available today, a P-I-D type of control loop has been implemented. With this type ofcontrol loop available to the user, it should be possible to achieve very good control of any deposition
source. The P or proportional gain term provides a fast response to any system rate control error and sets
the overall control loop gain. The I or integral term forces the rate control error to reach a zero value and

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is typically set to equal the slowest time constant in the control loop. The D or Derivative term helps toanticipate control loop overshoot and negates some of the slowing down effect of the Integral term. This
term is seldom required for systems with time constants faster than 10 seconds. Too much D term canactually contribute to loop drift and instability.

Determining Control Loop Settings
Using Data Display For Tuning
All the control loop parameters interact to some degree in the overall response of the control loop.
Therefore, there are many combinations of settings that will give equally satisfactory results. Also, thecontrol loop that is optimized for steady state control will have quite different settings from one requiring
fast control acquisition with minimal overshoot. The graphics available on the RunTime display cangreatly aid the user in determining the control loop settings and performance. The user can observe realtime rate, rate deviation, or control power on this display. By introducing a step response into the control
system and observing the graphical display responses it is quite easy to "tune" the control loop. There areseveral ways to introduce a step change. The first is by programming a different deposition rate number
while in control. Another way is to go into Manual Power and ramp the power either up or down, thencome out of manual and go back into control.
Setting The P-I-D Terms
The basic philosophy of tuning a control loop is to isolate each of the P, I, and D parameters asmuch as possible. Start off by disabling the I and D terms. The I parameter should be set to 0.0 secs andthe D term to its lowest value (0.0 secs). This isolates just the gain term (P). Start off with a low value of P
and increase it until your system starts to oscillate in response to a step input. Make a note of this number.
Reduce it by 50% as a starting point. You will notice that your desired control point will not be reached byusing this number, (the actual rate will always be below the desired rate). This offset can be eliminated by
setting (to non 0.0) the integral term (I). If you know the time constant of your system, use this number (orslightly longer) as a starting point. Smaller values of the I term will make the system respond faster, but
may cause oscillations. At this point, you can go back and re-adjust (lower) the P term. Keep in mind that
there is interaction between the P term and the I and D terms.
For most systems, these 2 terms (P and I) will be enough to stabilize your system. If you have avery slow system, you will want to use the D parameter also. This term can be helpful in controlling theamount of overshoot you have in your system. If you know what the lag of your system is, set the D term
to it. The D term puts lead into the control loop to compensate for lag in your system. Remember that a
P-I-D control loop is much more difficult to tune than just a P-I loop.

Typical Settings
Typical Sources
Fast responding sources such as electron beam types generally can operate at high gain settings(20 to 200), fast integration times (.1 to .5 sec), and minimal or no derivative term (0 sec). This is
somewhat material sensitive and also is affected by the use or non-use of source liners. These settings arealso typical of most sputtering applications.
Medium response sources such as resistive type boats, baskets, or filaments typically require
lower gain settings (10 to 100), longer integration times (.5 to 10 sec) and some derivative term (0 to 1 sec).
Slow sources such as Knudsen or induction heated types may require lower gains (1 to 50), longer
integration times (5 to 30 sec), and a derivative term approximately 20% of the integral term (1 to 10 sec).

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SECTION 3.13

Film Phases and Parameter Groups

There are several phases during a deposition layer of the STC-2000A related to the source anddeposition rate control. There are three main parts to a deposition layer. These are pre-deposition,
deposition control, and post-deposition. The pre-deposition parameters control the source and material
conditioning prior to the film deposition. The STC-2000A can control a variety of different types ofdeposition sources. The typical run cycle shown in Figure 3.15 is for an E-B or thermal source.
Typical Film Deposition Cycle

Rise
1

Soak Rise Soak Shutter
Delay
2
1
2

Deposit

Rate Deposit Idle
Ramp
Ramp
2

Idle

Figure- 3.15: Typical Run Cycle.
Table 3.1 which follows provides a list of phases and their associated parameters for all phases ofthe deposition. There are also several film parameters which relate to the deposition material and sensor
calibration . Among these are DENSITY, Z FACTOR and TOOLING. A detailed description of each film
and map parameter is given in section 3.5. Indexing, if used, follows XTAL verify and precedes Rise 1.
Phase

Parameters

Group

RISE 1

SOAK 1 PWR VALUEPWR RAMP 1 TIME

Pre-Deposit

SOAK 1PWR SOAK 1 TIME

RISE 2

SOAK 2 PWR VALUEPWR RAMP 2 TIME

SOAK 2PWR SOAK 2 TIMESHUTTER DELAY

SHTR DELAY MODE
SHTR DLY TIMEOUTSHTR DLY QUALITYDEPOSITDEPOSIT RATECTL LOOP P
CTL LOOP I
CTL LOOP DMAX POWER LIMITABORT MAX PWR SW
MAX POWER DWELL

Deposition

RATE RAMP

RATE RAMP MODE
RATE RAMP TRGRRATE RAMP TIMENEW DEP RATE

Control

DEPOSIT 2

NEW DEP RATEIDLE RAMPIDLE

PWR RAMP 3 TIME
SOAK 3 PWR VALUE

Post-Deposit

Table 3.1: STC-2000A Phases and Parameters.

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SECTION 3.14

System Configuration

System configuration is a category that generally includes parameters that are not deposition
process related, but it has also been the recipient of other miscellaneous parameters that are not strictly
system related. If the STC-2000A is moved among systems, these system configuration parameters need to
be checked for the appropriate system environment. Program checksums can be used to verify integrity
each of the parameter groups.
In order to access this parameter group, start at the RunTime display. Press the fixed MENU key
and the MAIN menu will appear. With the MAIN menu displayed, press the EXECUTIVE MENU key.
When the EXECUTIVE MENU appears, press the SYSTEM CONFIGURATION key and the SYSTEMCONFIGURATION menu will be displayed. There are 12 parameters that have to do with system typeparameters that are programmable. The fixed STATUS key returns the RunTime Screen.
Main Menu: Sequencing Mode

Main Menu: Non-sequencing Mode

Executive Menu

System Configuration Menu

press EDIT
Edit LCD Contrast

Change LCD Contrast

press CHANGE

System Configuration (scroll down)

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SECTION 3.15

Detailed System Configuration Related Parameters____________________________________________________________________
Parameter
LCD CONTRASTLCD Contrast
Low/Medium/High Value: Low or Medium or High
Units
Low/Medium/HighThis parameter tells the STC-2000A how to control the bias voltage to the LCD. Adjust for bestviewing: brightest with the most contrast at the desired viewing angle. Between 45° above andperpendicular to the LCD viewing surface is best (@25°c±5°).
____________________________________________________________________
Parameter
PASSWORD LOCK #Lock Code Value Range is 0 - 9999
Setting The
Units None
Passwords
This allows changes of STC-2000A program parameters to be restricted to only those people
knowing this 4 digit password code. If password lock is programmed with a non-zero value, whenever youaccess a menu that can change a parameter or try to change a parameter, the STC-2000A will ask you forthe password. The exceptions are the I/O Programming menus and the Communications Setup menu thatare password locked by a Lock Code parameter found on the Communication Setup menu (seeCommunications Setup Configurations in the following section).

CautionCAUTION If this password is entered inadvertently or forgotten it can be removed bypurging the unit of all its stored parameters. When this is done all program parameters including I/O
programming, System Configuration, Process Lists and Film Parameters will be lost and require
reprogramming. This could be several hundred items of data. All this data should be recorded prior topurging the memory of the STC-2000A. Recording methods include downloading to a PC from the HOST
port, information written down by making a paper copy of the various parameter tables and circling theselected element, downloading to the memory module. To purge ALL stored data from the STC-2000A,
press the fixed MENU key when on the RunTime screen then select the Service key on the MAIN menu.
Press the Purge (All Stored Data) key and the confirming ACCEPT key. After doing this the STC-2000A
will contain no user programmed information and will have to be completely reprogrammed.
If password is forgotten and programming has not been saved in some othermedia, call factory to eliminate passwords without purging memory.
____________________________________________________________________
Parameter
RUN NUMBER
Run Number Value: 0 - 9999
Units
None
RUN NUMBER
The run number auto-increments with the start of each newprocess [Sequencing: on process start. Non-sequencing: on Film start.].
Run Number
The number entered with this parameter should be thought of as a preusage offset as the run number increments when the process or film
starts. For example, if the run number entered is 2, the next process thatis started will have the run number of 3. Run number is used to identify a specific process run. Run results
can be compared by viewing the PROCESS ACCOUNTING screens (See PROCESS ACCOUNTING in
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p STC-2000A DEPOSITION CONTROLLER yParameter

RECORDER FUNCTION
Analog output type: Rate, Deviation, Power, Thickness, Remote
Units
None
Selecting Recorder Output Type
There are 2 identical analog outputs on each Sensor card in the
STC-2000A. The 9 pin female D-SUB connectors labeled SOURCE x/x
Selecting Recordercontain these analog outputs (see section 3.10), either of which is used
OutputType
for the recorder output. You may program one of five variables toappear on this output. They are absolute rate, rate deviation, power,
thickness or remote. The Remote setting allows a voltage level to be determined by an external computer toappear at this output. (See T command of computer interfacing, Section 6)____________________________________________________________________
Parameter
RECORDER OUT CHANNEL
Analog output Channel: 1 - 2
UnitsChannels
Selecting Recorder Output Channel
There are 2 identical analog outputs on the Sensor card in the
STC-2000A. The 9 pin female D-SUB connector labeled SOURCE 1/2
Recorder Output
contain these analog outputs (see section 3.10), either of which can be
Channelused for the recorder output. A source output channel (1-2) can beselected for use here and the other source output channel can be used forthe strip chart recorder (defined by an SS MAPS parameter: source output chnl). If the source output
channel parameter and the recorder output channel are set to the same channel, the source output channel
will be used and the recorder function will be lost. If this situation should occur, a reboot will be necessary
to reassign the recorder output.
____________________________________________________________________
Parameter
CLOCK TIME
Real Time HH:MM Range is 00:00 - 23:59
Units
Hours:Minutes
Parameter
CLOCK DATEReal Time Data MMDDYY Range is 010100 to 123199
Units
Month Day Year
Setting The Clock
These 2 parameters program the clock of the STC-2000A. These are used in the process
accounting mode. The format for the time is 24 hour time. One o'clock in the afternoon is 13:00. The dateis programmed in month-day-year format without any separators. You need to enter any zeros in the day(March 5th is 05, not just 5) and year fields. The range of dates is from 01/01/1989 through 12/31/2088.
That is to say, 89..99 years are interpreted as 1989..1999. 00 through 88 are interpreted as 2000..2088.
This date is year 2000 compliant, as far as the STC-2000A is concerned. Use of the two digit year numbers
outside of the STC-2000A require proper recognition of the century digits (19 or 20) which are implied but
not included in the exported (via RS232) information.

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SECTION 3.16

Communications Configuration Related Parameters

Communications setup
The Communications setup menu can be located by pressing the fixed MENU key while on the RunTime
screen. Press the EXECUTIVE MENU key on the MAIN menu. Finally, press the COMM. SETUP key
on the EXECUTIVE MENU (the fixed STATUS key returns the Runtime screen).
The following screens illustrate the communications setup programming from general list to specific list
item change. Its programming steps are like those of other programmed elements previously described.
Cursor to the list item using the arrow keys, press the EDT (edit) key, press the CHG (change) key, press
numeric or numeric representation of needed value, and press ENT (enter). Scrolling can take place when
individual elements are displayed or when the list is displayed. The BAK (back) key returns to the previous
menu keys. The BYE key leaves the Communications setup. The STATUS key returns the Runtime screen.

The Communications setup menu. The asterisk represents the arrow key controlled cursor.

Pressing EDIT results in...

Pressing CHANGE results in...

The edit menu screen presents the current value
and the permitted value range.

The edit/change menu provides the new entry
capability. BACK allows return to the previous
screen without change.

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Detailed Communications Configuration Related Parameters____________________________________________________________________
Parameter
COM/IO LOCK CODE
Lock Code Value Range is 0 - 9999
Setting The
Units None
I/O Lock Code
COM/IO LOCK CODE
This allows changes of STC-2000A program parameters to be restricted to only those people
knowing this 4 digit password code. A non-zero number in the range of 1-9999 enables this feature andbecomes the lock code. If the lock code is programmed with a non-zero value, whenever you access an I/O
Program menu that can change a parameter or try to change a Communications Configuration parameter,
the STC-2000A will ask you for this lock code.

CautionCAUTION If this lock code is entered inadvertently or forgotten it can be removed bypurging the unit of all its stored parameters. When this is done all program parameters including I/O
programming, System Configuration, Process Lists and Film Parameters will be lost and require
reprogramming. This could be several hundred items of data. All this data should be recorded prior topurging the memory of the STC-2000A. Recording methods include downloading to a PC from the HOST
port, information written down by making a paper copy of the various parameter tables and circling theselected element (see end of manual), downloading to the memory module. To purge ALL stored data fromthe STC-2000A, press the fixed MENU key when on the RunTime screen then select the Service key on
the MAIN menu. Press the Purge (All Stored Data) key and the confirming ACCEPT key. After doing
this the STC-2000A will contain no user programmed information and will have to be completely
reprogrammed. Default values will be in effect elsewhere.
If lock code is forgotten and programming has not been saved in some othermedia, call factory to eliminate passwords without purging memory.
____________________________________________________________________
Parameter
KEYBOARD BEEP
KEYBOARD BEEP
OFF / ON
Units
None
KEYBOARD BEEP
This parameter tells the STC-2000A whether touch screen activity or fixed front panel key activity
will result in an audible sound upon key press. Key release is never annunciated. Various frequencies are
employed to convey different meanings. For example, a low frequency beep indicates an incorrect entry ora non-existent key area. The STC-2000A audio system has a frequency range of approximately 330 Hz to
10 KHz.
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Parameter
RS 232 BAUD RATE
RS 232 BAUDRS 232 BAUD Values: 300, 1200, 2400, 9600
RATE
Units
BAUD
RS 232 BAUD RATEThis parameter sets the host port communications baud rate. The higher the baud rate, the moredata bit transfer is increased which, generally speaking, results in faster communications. In an electricallynoisy environment, lower baud rates can be tried if communications fail at higher baud rates. In anelectrically noisy environment, the communications may not appear any faster using the higher baud rates
due to the increased number of message retries (corrupted messages are requested by the receiver to be resent). Noise has a greater effect at higher baud rates because the duration of a noise pulse occupies a higher
ratio of time when compared with the duration of a signal pulse. Please ensure proper system grounding ismaintained as well as proper cable grounds and shields.
____________________________________________________________________
Parameter
RS 232 PROTOCOLRS 232
Protocol types: Sycon, ASCIIPROTOCOL TYPE
Units
None
RS 232 PROTOCOLThis parameter sets the host port communications protocol type. The Sycon protocol has a higher
degree of integrity but is a proprietary protocol and will work with Sycon software only. The ASCII
protocol has lower integrity but is universally accepted. There is included with the STC-2000A a CD that
contains various software programs using both protocols.
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SECTION 3.17

STC-2000A Crystal Failure Processing

The STC-2000A instrument gives the user many options in the event of a crystal or sensor failure.
This failure may be a hard sensor failure or caused by tripping over the crystal stability(S) or the control
loop quality(Q) thresholds. Improper setting of the S & Q film parameters may trigger an apparent early
sensor failure. It is possible to switch to other sensors and/or continue operation in a time power fashion,or abort the process. These options are available on a per film basis and are programmable in each film
parameter list. The REVIEW SS MAP menu parameters specify starting crystal[s], backup crystal[s], active
crystal[s], channel [1-2] start mode, channel [1-2] fail action and channel [1-2] backup list. The specific ss
map that defines these parameters is called out by a Film parameter, thus providing the linkage between thefilm and its associated ss map. In addition to being physically installed, the utilized source sensor cards
must be enabled on the SYSTEM CONFIGURATION menu (set to ON) before its sensors can be used as
an option in a film program. This is a global system enable and indicates that proper hardware is installedon the system.

Measurement Fail Parameter
Time Power Mode
The SS Map parameter, Channel [1-2] Fail Action, can provide no action or abort film. The Film
parameter, Film Fail Mode, determines what the instrument will do when all crystal processing options
have been exhausted and there is still no valid sensor data available for processing. The options are 1: toabort the run or 2: to complete the run in a Time Power Mode. If option 1 is selected, the unit will stop withthe last valid thickness showing on the display and the control power will be set to zero. If option 2 isselected, the unit will continue to run using the average deposition power for the 5 second period previous
to the sensor failure, and will simulate the continued accumulation of material on the sensor using thepresent rate setpoint value. Simulated accumulation will continue until the final thickness setpoint isreached. The unit will then do the post deposition sequence as programmed and indicate to the user that atime power completion was achieved.
Using Crystal Switching
If a crystal sensor has been provided with a backup capability by menu programming with theFilm and Map parameters, a sensor failure on the primary sensor will cause a switch to a backup sensor.
Each crystal in succession that fails can have a backup or follow processing as programmed otherwise.

Crystal Switching Function Description
The crystal switching function within the STC-2000A allows for either manual or automatic
switching from one sensor crystal to an alternate sensor crystal. This switch over is done without
introducing rate control transients into the system and also will maintain all valid thickness information
accumulated. The availability of this function can provide an extra measure of safety in insuring proper
deposition completion if the primary sensing crystal should fail or become erratic for some reason.
Crystal Stability Terms
Crystal failures can be of three types. During a hard failure the crystal just stops oscillating. The
other modes of failure are types of erratic operation. When sensor crystals begin to approach the end of
their useful life, they begin to exhibit small positive frequency jumps. These positive jumps can cause
large instantaneous rate error signals to be seen by the control loop. The loop tries to correct for these
false signals and significant short-term rate control errors may occur. These positive frequency jumps also
cause an apparent loss of accumulated thickness on the sensor. Therefore, the final thickness setpoint may
be reached with more material deposited on the substrates than desired. By internally monitoring thesefrequency jumps along with the control loop deviation from the desired control value, an automatic switch
over to a new or fresh sensor crystal can be made to occur. This is done by placing setpoint limits onsustained control deviation error and the number and magnitude of positive frequency jumps allowed.

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Forcing A Crystal Switch
Manual Crystal Switching can be accomplished from the front panel while in the RunTime
display by pressing in the fixed front panel STATUS key 3 times. This will display the 3rd STATUS screen.
On the 3rd STATUS screen, is the FORCE FAIL key. Crystal channel switching is accomplished bymanually failing the primary active channel and allowing its designated backup to automatically takecontrol. Pressing the FORCE FAIL key will change the key legend of the key to the far right to Fail
Channel 1. Subsequent presses will step through all of the installed and enabled channels ending with the
FAIL ALL selection. When the channel that needs to be failed appears, press the key on the far right toaccept. The FORCE FAIL key is the selector and the key to the far right accepts the selection. After FAIL
ALL, the selection returns to RE-VERIFY.
After the FAIL CH X is selected, the crystal designated as its backup is now displayed as the active crystal
number with its life values indicated on the appropriate channel line. Switching can also be done throughthe remote hardware inputs or computer interfaces. To move back to the crystal sensor that was failed, use
FORCE FAIL to select RE-VERIFY and press to accept. If the crystal still has acceptable life, etc. it will
be reinstated as active and the other sensor channel will return to standby. The crystal sensor channel
designated as backup must be set to standby with the SS MAP parameter, CHx START MODE, as well as
the crystal sensor channel designated as primary being set to active with the SS MAP parameter, CHx
START MODE.
Once configured for serial multi sensor operation (one active at a time), Automatic crystal
switching for hard failures is enabled in the same way as it was for manual switching: by setting the
primary channel parameter CH x BACKUP LIST = [select desired 1-2 backup channel], the secondary(backup) channel parameters to CH x START MODE = standby and CH x FAIL ACTION = none in theindividual ss map programs. A hard crystal failure of any kind will now automatically switch to the backup
sensor. Imminent failures predicted by the CRYSTAL STABILITY and CONTROL QUALITY algorithms
will also cause switching to the backup sensor. Setting a setpoint value other than zero for each typeenables the S&Q. Smaller numeric settings cause smaller errors to be tolerated and will typically cause
crystals to be switched sooner than large numbers. Initially these parameters should be set to a high value
or disabled (set to 0). For initial process evaluation a value of 6 is good for both parameters. These
parameters can be tightened as process history is obtained.
The CRYSTAL STABILITY parameter sets a limit on the amount and magnitude of positivefrequency jumps allowed during a deposition control phase. The smaller the setpoint number the fewer
jumps allowed. Due to differing stress values exhibited by different film materials optimum settings arematerial dependent and may require experimental derivation. A good starting point for most applications is
a value of 6.

Hardware Requirements
To utilize the Crystal Switch function, one of the following is required: either a dual sensor headwith shutter or two single sensor heads with shutters. Both primary and backup sensors are operational at
all times and are connected to the appropriate STC-2000A Sensor x BNC connectors through theirrespective oscillator units. When a switch over is desired, one of the I/O relays provided within the STC2000A can be programmed to activate. These contacts should be utilized to operate an air type solenoid
valve that in turn activates the air operated shutter mechanism on the sensor heads. The primary crystal
then becomes shielded and the backup crystal is exposed to the deposition stream.
It should be noted that there are separate TOOLING FACTOR parameters for each sensor. Thisparameter is designed for geometric position correction within the vacuum vessel and is set in theindividual film programs.

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Crystal Stability
The STC-2000A will display the crystal stability value detected during the deposition run on the
2nd STATUS screen (from the RunTime screen press the STATUS key twice). The data will appear below
the S (stability) header between the thickness column and the Life column. The display may read as
follows:
Stability
3
9indicates crystal stability
indicates that the 3 threshold setting was exceeded
indicates that the system was within 90% of exceeding the 4 Threshold

If these are typical run values, a setpoint value of 5 is a reasonable setting. If the readings aremuch higher or lower, the setpoint should be scaled accordingly.
Control Quality
The control quality parameter sets a limit on the amount of sustained control loop deviation error.
Due to differing source and material characteristics optimum settings may need to be arrived atexperimentally. Control loop quality can be effected by EB gun or sputtering target arcs as well the PID
control loop parameters. These areas should be made to operate properly before attempting to set tightswitching threshold on control quality (press L/Q key area twice on RunTime screen).
The parameter values correspond to an allowable sustained deviation in the following manner.
Setpoint
12
3
45% Deviation
5
7.5
10
12.5
15

Setpoint
678
90% Deviation
20
25
30
40
Off

The setpoint values detected and accumulated by these algorithms may be observed on the
RunTime display by pressing the L/Q key. The data will appear below the text label "loop" in the key
graphics area. After several deposition runs the typical values found here may be used for determining theproper setpoint values. The display may read as follows:
Loop indicates control loop quality
2
indicates that the 2 threshold setting was exceeded
7
indicates that the system was within 70% of exceeding the 3 threshold
If these are typical run values a setpoint value of 4 is a reasonable setting. If the readings are muchhigher or lower, the setpoint should be scaled accordingly.

Use for Multi Layer Depositions
Using Separate Crystals For Multi Layer Depositions
Where the ultimate in accuracy is required in a two material deposition, it is desirable to use
separate crystal sensors for each material. This would prevent any errors in Z-Factor correction due to thelayering of different materials to be reduced to the minimum. This mode of operation can be accomplished,
as described above, by programming the starting sensor parameters in the first film/map combination tosensor 1, for example, and set the second film/map combination to start on sensor 2, for example. The CH x
backup parameter should be set to off in each layer as in this example. However, it may be set to ON evenwhen using only 2 crystal channel sensors to allow for a possible crystal failure recovery using the alternate
crystal sensor. A recovery could possibly give a small thickness error due to the mixing of materials but
may be preferred over an aborted or time power completed run. The tooling factors may also be optimized
for differing source geometry's as each sensor has its own tooling factor value in each map parameter
program.

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Averaging with Multiple Active Crystal Sensors and Averaging For Multi Layer Depositions
This adds another level of complexity to the serial multi sensor description above. Instead of asingle sensor being active, the map parameter CH x START MODE defines 2 channels as active, the MIN
START XTALS parameter reflects this same number (at least 2), the MIN ACTIVE XTALS =< MIN
START XTALS (BACKUP channels are optional). By selecting more than 1 active sensor channel,
averaging is automatically assumed. Multi layer would use, as previously described, separate film/map
combinations for each layer except in this case, more than 1 channel is active for each of the multiple
layers. The intent here is toward increased accuracy in a multiple layer material deposition.
The following parameters are described in greater detail in sections 3.5 and 3.15.
Related Film Parameters: FILM Fail ModeControl Loop Qual Limits
XTAL Stability S (Limits)
XTAL Life Bounds
Source Sensor MAP SELECTTIME POWER, ABORT IF FAIL
0 to 90 to 90.0-100.0%
1 - 10Related Map Parameters: Master Tooling Value
Minimum Start Xtal Channels
Minimum Backup Xtal Channels
Minumum Active Xtal Channels
Xtal Channel Drop Filter*
Channel x Start Mode
Channel x Fail Action Mode
Channel x Backup List

10.0% - 400.0%
1 – 2 minimum channels
0 – 1 minimum channels
1 – 2 minimum channels
NONE, BALANCE [dropped Xtal ch Failure]OFF, ACTIVE, STANDBY
NONE, ABORT FILM
X – XX (1 item list to 2 item list), [where X= 1 to 2 (in each position w/o redundancies,
list extends to 0-2 for a 1 item list)]
10.0% - 400.0%
10.0% - 400.0%

Channel x Tooling Value
Channel x Weight*averaging only

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SECTION 3.18

Process Accounting

The process accounting screen displays a summary of the vital parameters of the last four previous
deposition films. It is useful to review this screen at the completion of a deposition run and compare theresults to the previous similar runs. Trends which show changes in source conditions, deposition material
supply or pending crystal failure can sometimes be determined by the comparison of the vital parameters
shown on the process accounting screen.
All the data displayed on this screen can also be 'read' through the computer interface for longerterm storage (more than four runs) or hard copy data logging. Starting at the Runtime screen...
Press the fixed front panel Menu key to invoke
the main menu.

On the Executive menu, press the Process
Accounting key.

The following is the initial screen when process accounting is selected (page 1 of 4). The first line of thelist is RUN# and it remains stationary as the list is scrolled in order to maintain a fixed frame of reference.
The double arrow down moves the list a section at a time so that the list is displayed in 5 line sections in 4
pages (a 5 line window moving down the list). The double up arrow moves the viewed section of the list in
the same way but the direction is up the list. The scrolling function will wrap. After the 4th page, the view
will revert to the 1st page when the double down arrow key is pressed. After the 1st page, the view willrevert to the 4th page when the double up arrow key is pressed.

The following screens show the progression through the list using the double down arrows.
Page 2 of 4

Page 3 of 4

Page 4 of 4

Figure- 3.16: Process Accounting Screens
Please note screens 4 of 4. The XTAL % life is reported for the start condition in the first 3 characters (e.g.
A17, F00, O00, O..) and for the ending condition in the next 3 characters (e.g. A17, F00, O00, O..). The
first of the 3 characters is a letter code that is explained in the table below and the next 2 characters are anumeric value, which is the XTAL % life. The O letter code has an additional differentiation in that if it isfollowed by two periods, this means that there is no sensor card installed for this crystal channel, otherwise

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the presence of 2 zeroes indicates that the sensor card is installed and enabled (by menu parameter) and in
an OFF condition.
general form:

XYYXZZ

where X=Letter Code, YY= starting XTAL%, ZZ= ending XTAL%
starting groupending group

XTAL 1 A91A89
XTAL 3 A97F71
XTAL 5 O00O00= Crystal 1 started a process as active at 91% life and ended a process as active at 89% life.
= Crystal 3 started a process as active at 97% life and ended a process as failed at 71% life.
= Crystal 5 started a process as OFF at zero% life and ended a process as OFF at zero%
life (00 usually indicates that no crystal is connected).
XTAL 7 O21O021 = Crystal 7 started a process as OFF at 21% life and ended a process as OFF at 21% life.
XTAL 8 O..O..
= Crystal 8 is OFF and has no supporting sensor card installed.

The vital parameters stored and displayed are:
RUN:
Run number - increments at the start of each process cycle (beginning at layer #1).**DATE:MMDDYY representation of date the film was started.
TIME:
The time of the start of the run (from the 24 hour clock of the STC-2000A).
P TIME:
Process time - the time from a Start initiation to end of the Film Process.
COMPLT:
Mode of completion of the deposition.
NORMAL
Normal completion of run
0 BHIE Bus Hold interrupt error
Xtal failure occurred, run completed on time-power * INDEXR Indexer failure
TMPWR
BADXTL
Bad Xtal terminated run
INVSRC Invalid SRC
External input terminated run [input card or host port] INVSNS Invalid SNS
REMOTEKEYBRD
Front keypad STOP BUTTON terminated run
REM M1 Remote Aux 1
MAX POWER limit exceeded, run terminated *REM M2 Remote Aux 2
MAXPWRPENDNT
STOP button on Hand Controller terminated run
REM M3 Remote Aux 3
SAFE 1
User Interface Bd. Software watchdog
REM M4 Remote Aux 4
S4 BAD
Source Sensor card failure
SDY FL Quality failure, shutter delay
IO BADI/O card failure
NO QUL Bad quality, dep phase drops out
FILM#
Film # used
PROC#
Process# used
LAYER#
Layer # used
MAP#
Map# used
SRC#
Source channel # used
POCKET#
Pocket # (of indexer) used
D TIME:
Deposition time - the time the source shutter is open in Minutes:Seconds format.
THICK:
Thickness at end of deposition in Angstroms.
RATE:
Deposition rate at end of deposition in Å/Sec.
POWER:
Deposition power for last three seconds of deposition in %.
LOOP:
Accumulated counts in the control quality accumulator. See Section 2.17 for a description of thisvalue.
XTAL 1:The start and ending crystal percent life is shown. See letter code table below.
XTAL 2:Same as above.

Crystal % Life Letter Code Table
O = Off
M = Missing
A = Active
B = Standby
D = Dropped
S = Switched
F = Failed* programmable feature** The letter T appears after the run# when the TEST mode was used.

Note: [STAB: Accumulated counts in the crystal stability accumulator not reported here. See 3rd STATUS screen.]

Purge will clear Process Accounting contents (see section 2.6, Factory Settings vs... and section 2.21,
Check Sum Validation).

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SECTION 3.19
OPTions/INFo: product identification, diagnostics, etc.

OPTIONS/INFO: From the RunTime screen, press the fixed MENU key. Press the EXECUTIVE MENU
key on the MAIN menu. (Press the BYE key to return to the MAIN menu or press the fixed STATUS key
to return to the RunTime screen.) OPT/INF is a selection on the EXECUTIVE menu. The information isintended to be relayed to the factory for the purpose of identification and diagnostics. The information
strings contain: software Version #s, checksums, serial#s, build codes, installed option cards, option codes,
error codes, PCB hex code identifiers, frequency. There can be up to six lines of info per page, MORE
shows next page.
Main Menu
Executive Menu

Options/Info, page 1 of 6 (user interface bd.)
S/W Version, Build/CRC, SCUP COV
Serial number / Build type
Bootloader Build: CRC of BTLR code
UBAS min. ver of UIFC/SBAS min. ver of SCUP
intercommunications
Error Code (Sys Trap)[power up only]

Options/Info, page 2 of 6 (source sensor bd.)
S/W code version / CRC each bd.
OK = present, enabled, working. OK-Unused = not enabled
MIA! = enabled but not physically present
Incompatible! = beyond s/w family compatibility
Failed! = source sensor board has failed
BHIE: if not zero, cycle power off/on, (interrupt
not rec'd from SS board.[ bus-hold interrupt ])Options/Info, page 3 of 6 (input/output bds.)
Options/Info, page 4 of 6
Empty = no module detected, config'd empty
SN / Build typeIn-Disabled = disabled input card in this slot
S/W version
Out-Disabled = disabled output card in this slot
Configuration X CRC
Input = input card detected in this slot
Bootloader CRC
Output = output card detected in this slot
Covenant
In-Mia = missing card, enabled as if input present
Error Code (Sys Trap)
Conflict-I = have output card where input bd called [power up only]
Out-Mia = missing card, enabled as if output present
Conflict-O = have input card where output bd called??? = reply out of range [power up only]

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Options/Info, page 5 of 6
Displays live frequency measurements fromthe installed/enabled source sensor cards.
If no crystal/oscillator w/installed/enabled, freq. = zero

[only screen w/ live update]

Options/Info, page 6 of 6
Displays Memory Module information if theoptional memory module interface bd. and thememory module are installed and the memory
module is enabled. See section 3.20 for details.

CST

This information can be useful to the factory if there is a problem. Information also appears after productpower-on during initialization. The initialization process (for diagnostic purposes) is as follows (withtypical LCD screen information):
1.

2.

LEDs:
LCD display:
LEDs:
LCD display:user programmable LEDs non-illuminated. Power LED illuminated.
screen: clear
backlight: onuser programmable LEDs on (test)[one beep with the appearance of each text line]

APP LOADER V01.00(BUILD 749C)--------------------------------------------->APP FOUND:SECTOR E BUILD F904
>VERIFY APP IN PROGRESS..............................................
Beeper: beeps with the appearance of each line of above text (5 beeps)>APP OK>LAUNCHING APPLICATION...
3.

LCD display:
LEDs:
Beeper:

4.

LCD display:screen clear
user programmable LEDs non-illuminated
2 Lo/Hi beeps

CSUB: VERSION TKAPA03.15 BUILD F904
SYNCING WITH CSUB...60

5.

LCD display:LEDs:

typical RunTime Screen
controlled by I/O programming while running

check sum validation
Check sums are used to validate the integrity of the user programmable functions for the STC-2000A. Of
the programs that use check sums, there are three categorical types: one for the film parameters (Main
Menu: Review Film key), another for the process steps (Main Menu: Review Processes key), and finally

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one for the I/O rungs (Main Menu: Executive Menu: I/O Setup). See sections 2.5, 2.7, 5.10 and 5.13 forrelated details. See the end of section 2.6, Processes: Factory settings vs. purged settings.
Each of the three program types have check sums that can be used to check the integrity of a program
which is a part of a system that has a problem or check the integrity of a program that may have been
inadvertently changed or verify a program that is reentered in its entirety. A group of check sums from thedifferent programs can be used to uniquely identify an entire deposition process. The programs along with
their check sums should be stored both electronically and on paper. Different processes can be identified bya text description coupled with constituent programs and their check sums. When a program is known tobe correct, write the check sum number down in a journal of software entries/programs, having method orrecipe attributes being integral to objectives.
Please note that as changes, additions or deletions are edited, the commensurate check sum change will not
become apparent until the modification is accepted (saved) into the program from the temporary
workspace.
The check sum is a five digit hexadecimal number (e.g. 4A6F6, 5204D). The number is prefixedby the label "ID=" (except for the film parameters check sum, which is prefixed by an "X"). In addition, theI/O program has, following the "ID=", a letter designator indicating the memory sector in which theprogram resides (either an A or B). Using the SWP (swap) key accessed through the MEM key reverses
this.
Check sums and paramters after a PURGE or a FACTORY RESTORE are as follows:

After
PURGE

After
FACTORY RESTORE

Review films 1-9:
Review Process 1:
Review Process 2:
Review Process 3:
Review Process 4:
Review Process 5:
Review Process 6:
Review Process 7:
Review Process 8:
Review Process 9:
I/O Program A:
I/O Program B:

X17523
ID=00000
ID=00000
ID=00000
ID=00000
ID=00000
ID=00000
ID=00000
ID=00000
ID=00000
ID=A24490
ID=B24490

X61037
ID=55274
ID=12121
ID=30944
ID=24150
ID=02503
ID=61768
ID=09958
ID=48200
ID=60411
ID=A24490
ID=B24490

RunTime Mode:

Sequencing

not changed(remains SEQ or NON-SEQ)

Film parameter:
MAX POWER LIMIT

0%

50%

System configuration:
RECORDER FUNCTN:
CLOCK TIME:
CLOCK DATE:
I/O Programs:
PROCESS ACCT'ING:

RATE
not changed
not changed
clearedclearedPOWER
not changed
not changed
not changed
clearedSee section 2.2, Initial Programming Setups (Menu Parameters), for complete listings of parameter states
after factory default memory configuration and purged memory configuration. See next section for optional
external memory save / restore functions.

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The following screens are examples of what may appear after a PURGE/REBOOT sequence:

The letter designators are:

P
I
A
S

Film Parameters
I/O Programs
Process Accounting
Process Sequences

Press the area indicated to acknowledge memory loss in the memory sectors represented by the designators.
The memory loss message is meant to alert the user that a change in memory contents has occurred in theareas represented by the letter designators and that parameter/program dependent processes need to beevaluated and the unit reprogrammed accordingly.

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SECTION 3.20

Memory Module Programming & Usage

The Memory Module (or Memory Card) option allows saving or restoring all parameters, configurations,films, processes, and I/O programs in both memory locations A and B to the memory card. The real timeand date informations are the exceptions. The memory card function needs a memory interface board
installed in the unit. If there is a high density 15 pin D-sub on the back panel (labeled MEM), the memory
interface board is installed. The memory card has a write protect switch (green indicates memory card isready to accept new data as well as be read, red indicates that the write protect is on and that no new data
can be written to the memory card but it can be read).
In the menu path main / executive menu / options + info, page 6 of 6 will indicate whether the
memory module has been recognized. The memory module can be plugged into a powered STC-2000A.
The options/info screen interrogation is not dynamic (a snapshot of how things are when the snapshot istaken) and the 6th screen must be displayed afresh to capture the new status of the memory module.
The memory module has 1 programmable parameter associated with its usage and that is theMemory Module IFC parameter on the System Configuration menu. This must be set to ON. Please notethat save/restore functions to and from the memory module necessitate a unit reboot, which will be initiatedautomatically when directed to save or restore on the service menu. This reboot save/restore process takes
about a minute to complete. If there is a problem, from whatever cause, an error message will be displayed
indicating that the save or restore had failed. This message can be cleared using the fixed front panel
MANUAL key.

Memory Module
On the Executive menu press the
Options/Info key.

Press the More key until the Memory Module info
screen comes into view (page 6 of 6).

STATUS: Unavailable [when the System
Configuration parameter Memory Module IFC
is OFF]

Note serial number 217

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Here are typical Options/Info screen messages [note STATUS line]:
Not detected means that the STC-2000A could not communicate with the memory module. This could
indicate a failure with the memory device within the memory module or a failure along thecommunications path to the module. As previously stated, the memory module needs the optional
memory module interface board installed. This board contains isolation circuitry to protect the
STC-2000A from external electrical damage both on power lines and communication lines. The
LED on the memory module should be illuminated green with the write protect off and red withthe write protect on. If the LED is not illuminated in either switch position, there is a power
problem.
OK, Read + Write indicates that the memory module has been properly accessed and is capable of being
read from and written to by the STC-2000A (the Write Protect switch should be in the WP-OFF
position).
OK, Write protected indicates that the memory module has been properly accessed and is capable ofbeing read from by the STC-2000A (the Write Protect switch should be in the WP-ON position).
Unformatted indicates that the memory module has been properly accessed but has not yet been used. The
first write process automatically formats the memory module (the Write Protect switch must be in
the WP-OFF to format/write and this message indicates that it is in the OFF position).
Unformatted, Write Protected indicates that the memory module has been properly accessed but has not
yet been used. The first write process automatically formats the memory module (the Write
Protect switch must be in the WP-OFF position to format/write but this message indicates that the
WP switch is in the ON position).
Unavailable indicates that the memory module function has not been properly enabled through theMemory Module IFC parameter on the System Configuration menu. This must be set to ON torecognize the memory module. The act of changing this parameter is not recognized for thisfunction (memory module) unless the STC-2000A is reboot or power cycled (it checks thisparameter only at initialization.

The STATUS line will change as the WP switch is changed but in order for the info screen to be
updated, it must be refreshed by scrolling off and then back on it by using the MORE key. In other words,
the info screen contents are not dynamically displayed. The act of calling forth the info screen causes the
STC-2000A to recheck the data upon which the information is based.
Note serial number 113.

Returning to the Executive menu, press the System Config key. Using the arrow key[s], scroll to theMemory Module IFC parameter. Press EDIT to bring forth the Edit/Change menu and press Change tobring forth a numeric entry screen. Pressing the digit 2 will change the value to ON.

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Has ID type 11 indicating 96kbyte module.

DATA TRANSFER
From the main menu, press the service key to bring forth the service menu. On the service menu, press the
key labeled AS IS. This will eventually, with the 3rd and 4th presses, reveal the memory module transaction
related keys. M.M. UNIT takes what is stored in the memory module and transfers it to the STC-2000A,
which is overwritten. UNIT M.M. takes what is in the STC-2000A and stores it into the memory
module. Please note that in both cases, the recipient of the data is overwritten. Pressing the Accept key
finalizes the data transfer directive. Pressing the BYE key leaves the service screen without any effect. Ifother keys are pressed on the service screen, whatever is indicated on the key legends will become
implemented along with the memory module data transfer.

Other lines from the memory module Options Info screen
ID,SRL#: The ID identifies the amount of memory in the module.
9 = 32 kbytes
10 = 64 kbytes
11 = 96 kbytes
The STC-2000A memory usage, at this time, will not exceed 32 kbytes.
The SRL# is a randomly generated serial number when formatted in the field (between 1
and 1000). It is generated and assigned by the STC-2000A to the memory module when it isformatted. The numbers 217 and 113 can be found as serial numbers among the above screen
depictions. Factory formatted modules are assigned numbers to match a bar-coded label placed on
the exterior of the module.
MM DATA: This is a number code that identifies the product with which this memory module has been
used, if formatted. The code "4,3" identifies the STC-2000A deposition controller.
CSUB RQ: This is the number code that the STC-2000A will write to a memory module when formatted.
[The intent is to first identify the memory module in terms of its former usage, if any, and to check whether it
was a deposition controller type (the MM DATA is compared with CSUB RQ). A memory module usedwith another type of product will be reformatted as it is used with an STC-2000A. These 2 number codes
are merely an identification aid for the user.]SECTION 3.XX

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PROBLEM INDICATIONS
If the memory module LED is not illuminated in either or both of the WP switch positions or if the LED isamber in either or both WP switch positions, the memory module is not connected properly, or the
memory module itself (500-210) is malfunctioning or the memory module interface PCB (500-212) ismalfunctioning. In any of these cases, neither the memory integrity of the module nor the integrity of datatransactions with the module should be considered valid.

MEMORY MODULE PLACEMENT

The picture below shows the Memory Module plugged into the STC-2000A back panel. If thisplacement is inconvenient, a standard VGA/SVGA monitor extension cable can be used to bring theMemory Module to a more accessible location.
BELKIN model F2N025-06-E is an example of this type of cable. It has the following
characteristics: high density 15 pin D-sub female at one end, high density 15 pin D-sub male at the otherend, 6 ft. shielded cable w/ 28 AWG stranded wires, pin for pin connections (pin 1 to pin1, pin 2 to pin 2,
etc. except for pin 9 which is a no connect)

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SECTION 3.21

Programming Example

Perhaps the best way to become familiar with the STC-2000A operation and programming is toprogram a simple 6 layer process of two alternating materials and then exercise the process using the test
mode of the STC-2000A. The Test Mode simulates sensor input information (actually rate info issimulated for the film) to the unit and allows the STC-2000A to "run" a process. The source control output
voltage is, however, still fully functional. If the evaporant generating power supply is not needed for the"test"/simulation, disconnect it. With the power supply connected, there could be some dangerous
conditions.
Entering the Test Mode
To activate the Test Mode: from the RunTime screen, press the fixed MENU key then press the
key area labeled SERVICE when the MAIN MENU is displayed. This brings up the SERVICE MENU
which provides selection of : SQ vs. non-SQ product function, return to factory settings, purge ALL stored
data, memory module functions and the test mode entry. A key labeled either "TEST OFF" or "TESTON" is for entry into the test mode. When in the test mode, you will notice in the crystal status area on theupper right corner of the RunTime screen that the text, XTAL, has been replaced with the text, TEST. The
word, TEST, also appears on the 3rd STATUS screen in the LIFE column when a reporting sensor channel
is without a crystal/oscillator. This ‘test’ mode remains in effect until the unit is turned off and back onnormally. On the Service Menu, the TEST mode key has a toggle function (ON/OFF) and the key label
alternates between TEST ON and TEST OFF. To initiate any of the Service MENU personalities, any or
all three of the key choices are toggled/selected as needed and the Accept/Restart Product key is pressed.
The product will restart with the selected personalities in effect. Only the user selected SQ/non-SQ
personality will remain in effect upon subsequent product power cycles. To enter the TEST mode, press the
TEST OFF key so that it reads TEST ON and then press the ACCEPT key. The other keys are not used.

TEST mode: "TEST"
replaces "XTAL".

The text "TEST" remains during simulation.

If no crystal/oscillator is connected, the text "TEST"
will appear on the 3rd STATUS screen.

After a simulation, process accounting willshow the results and add the letter "T" toindicate that this run# was in TEST mode.

If a crystal sensor/oscillator is connected whilein the test mode, the text "TEST" will be overwrittenwith life info. "TEST" will remain on the runtime
screen.

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Programming Process 1 - (Example)
Process Programming Example
If the STC-2000A is already interfaced to a system ( hardware configured and I/O programmed)
the following example covers the majority of what a user needs to know to program a multilayered process.
Defining the Process
For the example, we would like Process 1 to be 6 layers of two alternating materials (Films 1 & 3).
To show the use of independent end thicknesses we will specify the first film to be 200Å thick, with eachsucceeding layer being 50Å thicker then the previous layer. Three entities have to be programmed to
implement this process, Film 1, Film 3 and Process 1. Maps invoked by the films must also be defined. The
order of programming is not important. For this example we will start by programming Process 1.
With the RunTime screen displayed, pushing the fixed MENU key brings up the MAIN MENU.
Press the REVIEW PROCESSES key to bring forth the process view/edit menus. Press the GO2 PROCESS
key, press the 1 digit and accept the entry by pressing the ENTER key. This activity will place the focus of
the review/edit on process 1. The first line of a process layer list, for the process # indicated, is shown on
the screen and is identified as Step 01 at the ">" cursor. The ">" cursor points to the line that can beedited. The cursor can be moved by the GO2STEP, (UP)↑, and (DOWN)↓ keys. [Note: pressing the GO2PRC
key at this point would allow you to select an alternative process# to be reviewed/edited. Pressing the fixed STATUS
key would return to the RunTime screen.] If it is not already the case, program layer 1 (step 1) as shown in

Figure 3.18.

Figure- 3.17: Process Review Screen
Figure 3.17 depicts the initial programming of the product as it leaves the factory. If this is the current
product condition, then just read the following 2 steps and perform the 3rd. If Process# 1 has been
programmed in some other way and can be overwritten, perform the activities in steps 1 through 3. If END
is STEP 01, perform activities in items 2 and 3.
1. Using UP/DOWN arrow keys, move edit cursor to STEP 01. Press keys: edit (EDT), change (CHG) andmode (MOD) then press the END key. This action will delete all lines except the STEP 01 line which now
represents the minimum list, that with the END as the single line list.
2. With the edit cursor on STEP 01, press the MODE key (if necessary press the edit (EDT) and change(CHG) keys first) and then press the AUTO (AUT) key and the enter (ENT) key. On step 01, the END willchange to AUTO. This action inserts a new line and increments the END line to reflect its new list position.
As END assumes its new position, it is given a new consecutive step number (02). The Film# is, by
default, set to film 1. Whether the Film# is entered by default or user entered, the 01 Film# will associate
film program 1 with layer 1.The Thickness is, by default, set to zero.
3. With the edit cursor on STEP 01, press the thickness (THK) key to edit the THICKness_KA column. As
the menu keys change to allow numeric entry, the thickness edit line appears at the bottom of the screen
where the desired end thickness for the first layer is entered (200Å). Press digits as needed in the previously
described manner. Note number to decimal point relationship. When digits are correct press enter (ENT) on
the numeric entry menu to accept these digits. After entering the thickness value, the menu reverts to its
EDT/CHG menu. Film# and Mode could have been included in this edit sequence. Press BAK to return tothe edit menu.
1.) Beginning from the factory setting (see fig. 3.17), press the edit (EDT) key to bring forth the process
edit menu.

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2.) Move the cursor to step 01.
3.) Press the insert (INS) key until the END is on step 07. This action inserts 5 lines with default values.
4.) Move the cursor back to step 01.
5.) Press the change (CHG) key to bring forth the process edit/change menu.
6.) Press the thickness (THK) key and enter the thickness value found in fig. 2.11: 2, 0, 0, ENT.
7.) Press the down arrow ↓ key to cursor to step 02.
8.)a.) Press the mode (MOD) key and enter the mode found in fig. 2.11.
b.) Press the film (FLM) key and enter the film# found in fig. 2.11.
c.) Press the thickness (THK) key and enter the thickness value in fig. 2.11.
In a similar fashion, program the next four layers of process 1 to look like the display shown in Figure15.11. Press the arrow down key to edit the each consecutive line. The most expedient strategy would be
to follow procedure# 8 above. Some of the steps will not require a film entry as the default value will becorrect. Use BAK and BYE to return to the MAIN menu (press fixed STATUS key to return immediately
to RunTime screen.

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Figure- 3.18: Six Layer Test Process.
After programming the above process, note the five digit number that appears in the upper rightarea of the screen labeled ID (a checksum for the seven step process sequence). This is a unique checksum
determined by the numbers and terms programmed into the process. If you have programmed the process
identical to the above example the checksum number will be 44943. After programming an actual process,it is useful to record this number. If you ever have to duplicate a process program all of the data entry canbe verified by comparing this number to original process checksum. See section 2.21: check sum
validation.
Feel free to repeat the above procedural elements with variations that still complete the desired goal as
many alternative paths are possible.

Programming Film 1 & Film 3Film Programming
To complete the programming of Process 1, both Film 1 and Film 3 need to have proper materialand source parameters. To edit or review a film program push the fixed MENU key from the Run Timescreen to bring up the Main Menu. Press the digit associated with and to the right of the REVIEW FILM
key. The digit entry represents the FILM#. Next, press the REVIEW FILM key to select the FILM # toreview/edit as identified by the digit entry. At this point, you will see a display similar to Figure 3.18. The
current parameter will probably be different as the last parameter edited is 'remembered' by the STC-2000A
and this is what will be shown on your display. If the edit film is not Film 1 at this point, pushing the F#
key will allow selection of the Film # as the desired film program to be edited. Pushing the fixed STATUS
key returns you to the RunTime screen.
There are several parameters on each film that need to be programmed in order to do a sample test
run. For Film 1 the parameters that we will change are :SOAK 1 PWR VALUEPWR RAMP 1 TIMEPWR SOAK 1 TIMEDEPOSIT RATEMAX PWR LIM
PLOT VERT SCL VSECTION 3.XX

to
to
to
to
to
to

15.0 %
1:00
0:10
20.0 A/s
100.0%
10page 132 of 292

p STC-2000A DEPOSITION CONTROLLER yThis program for Film 1 will tell the STC-2000A to use a single rise cycle to 15% power over a
one minute period, soak at that power for 10 seconds prior to deposition with a desired rate of 20.0Å/s.
Editing Film Parameters
For a real deposition process you would have to concern yourself about more of the parametersthan the list above. Parameters such as Density and P-I-D control loop values would have to be set to matchthe deposition material and source characteristics.
For our test example, the first parameter that we want to change is the SOAK 1 PWR VALUE. Press
down (or up) arrow repeatedly until this parameter appears on the displayed section of the parameter list
and the cursor points to it. Press the edit (EDT) key and this parameter will appear by itself along with its
current value, unit value name, and value range.
If password is set to a non-zero value, an intermediate password entry screen will appear (see sections: 2.5[end], 2.6 factory settings, 2.14 PASSWORD LOCK#).
Next, press the change (CHG) key and numeric keys appear to enter the desired value. Please note decimal
point location and numerically represented translations in the edit area. Enter the 1, 5 and the 0 so that they
have assumed their appropriate digit positions. The digits represent a temporary workspace that is saved
only when the enter (ENT) key pressed. In the temporary workspace, leading zeroes are suppressed but therange information specifies the upper limit. Pressing the enter (ENT) key accepts the new parameter into
the parameter list, the numeric keys are then removed and the previous keys are returned.
During the parameter value entry, a clear (CLR) key appears and can be used to restore the original value.
Pressing the BAK key during the parameter entry also restores the original value (discarding the edit) andin addition restores the previous screen.
Once a parameter is entered, you can scroll to the next parameter on the edit menu (individual parameters
are shown per each screen at this menu level) or return to the main REVIEW FILM menu and scroll
through the list with 6 parameters displayed at a time (when the parameters are relatively far apart on thelist). After the edit/change is entered, move on to the next parameter that needs to be programmed using
UP/DOWN arrow keys.
With the SOAK 1 PWR VALUE entered, proceed to the PWR RAMP 1 TIME. Please notecolon location. Program this parameter to 1:00. Next program PWR SOAK 1 TIME to 0:10. This
completes the pre-deposit parameters.
Now we must go to the DEPOSIT RATE parameter and set it to 20.0 Å/s It is several
parameters down the screen. The next parameter to program is MAX POWER LIMIT which is several
parameters further down the list. Set it to 100.0%. The last one to program is near the bottom of the list,
which is PLOT VERT SCaLe V. This parameter is different from the others that have been programmedin the sense that the values are not in a continuous range but are a set of specific values {1, 5, 10, 50, 100}.
Selection of these values, although numeric, is not made directly but by selecting numbers that represent
them. Think of them as being on a list and you select them by their position on the list. Entering digits that
do not equal one of these values will be error trapped in software and cause an error message to appear on
the bottom line: ERROR: VALUE OUT OF RANGE. The value we want this parameter to be is ±10
Angstroms deviation, so we press the appropriate digit key (3 not 10), then press ENTer to accept thisvalue. The numeric keys will disappear and the parameter value of 10 will be displayed in the text area
when you do this. This completes the programming of Film 1.

Selecting Different Film to Edit
Changing Edit Film
The second film we are using in our test example is Film 3. To program or change a film (1 of 9
Films), it must first be selected to be the edited Film. There are two ways to accomplish this (continuingfrom above menu location): 1) Push the fixed STATUS key. This will cause a return to the Run Timescreen from which a press of the fixed MENU key will produce the main MENU screen. On the main
MENU, press the digit associated with the REVIEW FILM key such that 3 is entered, then press the
REVIEW FILM key. 2) Push the F# key. This will cause a numeric entry menu to appear. Press the 3
key.
In either case, the 3rd Film list is selected and a new edit Film process can begin. The fact that you
are now editing Film 3 is displayed on the second line of the screen after the path information.

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Note[NOTE: The text ACTIVE will also appear on the second line and designate which Film is active. This same value is displayed on
the Run Time screen as USE FILM #.]To complete the programming of our 6 layer, 2 film test process, program the following
parameters of Film 3.
SOAK 1 PWR VALUEPWR RAMP 1 TIMEPWR SOAK 1 TIME
SOAK 2 PWR VALUEPWR RAMP 2 TIMEPWR SOAK 2 TIMEDEPOSIT RATEMAX PWR LIM
PLOT VERT SCL V

to
to
to
to
to
to
to
to
to

20.0 %
0:10
0:10
25.0 %
0:05
0:05
30.0 A/s
100.0%
10

Selecting The Active Process
Referring to Figure 2.6, notice that the STC-2000A recipe storage is divided into Film Recipes andProcess Recipes. In order to start an automatic deposition process, the user must program the desired
information into the recipe storage area, and then select one of the nine available processes, one of which isthe current ‘active’ process. Active does not refer to the operational state (running or idle) of the process
but refers to it being the default process, which is used when a deposition is activated (started). Each of thenine process recipes (identified by numbers 1 through 9) can have from 0 to 99 layers (steps) in length,with each layer referencing one of the nine available film programs. Processes of 0 layers (END only),quite obviously, are not runable. Starting such a process will result in an error indicating an ERROR IN
RECIPE. Prior to activating an automatic deposition sequence the user must insure that the particular user
defined process recipe has been selected as the ‘ACTIVE PROCESS’. The current or active process
number (1 through 9) is displayed in the middle left hand area of the runtime screen (see figures 2.2, 2.4,2.13), following the label: 'PROC’.
The current layer number, if any, is displayed as well as the status of the process (i.e. PROCESSVERIFY, PROCESS STOP, PROCESS RESETING, PROCESS BUSY, PROCESS WAITING or
ERROR). The active process can be changed providing the status is displayed as LAYER # rather than
LAYER NN where NN is 1 through 99. The # is equivalent to a zero and indicates an illegitimate runvalue.
To change the active process (only allowed when the instrument is in IDLE and the LAYER valueis "#" indicating an at rest condition [observe the runtime screen]), press the fixed MENU key, which willproduce the MAIN menu screen as shown in figure 2.5. Next, press the digit key area that is labeled on the
MAIN menu as the ‘ACTIVE PROCESS’ selection. Only the numeric digit is an active key. The box
with the text ‘ACTIVE PROCESS’ is only a label for the numeric digit (see figure 2.12). Pressing thenumeric digit key increments the value with each press such that ‘1’ through ‘9’ can be entered to select theactive process. Press the fixed STATUS key to return to the Run Time screen. If an attempt to change theactive process is made with the instrument in a non-idle condition, a temporary error message will appear
saying ; “INHIBITED: UNIT MUST BE IDLED”. When the text "NA" appears on the digit key, theproduct is not allowing the alteration because it would not be desirable to change the process while it isrunning. The process must be stopped. See START: Reset/Start Process diagram below. See section 2.19.

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Figure 3.19: Change the Active Process (see Section 2.19)

Running The Test Program
Starting the Test Program
We have now completed all the programming necessary for our 6 layer, 2 film process. We can
now return to the RunTime Screen by pressing the fixed STATUS key. To start our test process we firstneed to reset any error conditions shown in the process status area on the Run Time screen. Since a power
outage is considered to be an abnormal occurrence, the STC-2000A turns on with a process error message
showing. This condition must be reset prior to being able to start a process. This is done by pressing the
key combination that was identified in the START SELECTION menu as Reset / Start Process (fixed
START key). This resets the error condition and takes the STC-2000A to PROCESS RESTING. Pressing
the fixed START key brings up the START SELECTION menu again. If, as in this case, the initial error
condition did not occur in the middle of a process, START: Reset / Start Process is the appropriate choice.
If the power loss or other error condition had occurred in the middle of running a process, START: Restart
Film or START: Next Layer could be used to recover or continue the process. Pressing START: Reset /Start Process again will reset the process to the beginning layer. Pressing START: Reset / Start Process
one more time will begin the process. Once started the process status line across the middle of the screen
will read as follows:

PROC 1 : PROC BUSYLAYER 1Figure 3.20: Process Status LineYou will notice the STC-2000A goes into a XTAL VFY mode for a second, but in the test modethe crystal status is ignored. In the upper right corner "XTAL 1 ???" will appear while in the test mode
before a process is run (BAD after process starts). See START: Reset/Start Process diagram below.

Note

Note If the text 'TEST' does not appear in the box to the left of the crystal information at thispoint, the unit is not in the TEST mode. Enter the TEST mode as described in the second paragraph of
Section 2.7.)
The STC-2000A will then enter the RISE 1 phase for film 1. Notice the RUN (TIME) number on thedisplay counting up while the PHASE (TIME) counts down. When the PHASE (TIME) reaches 0:00, thenext phase is entered. At this point, you will see SOAK 1 appear on the display. The power level willremain at 15.0% for the 10 seconds that the STC-2000A is in the SOAK phase for film 1.
When the DEPOSIT phase is entered, the THICK number on the display is zeroed and will start
accumulating. The PHASE (TIME) now starts counting up. The RATE number is near 20 Å/s and the

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PWR number is moving around 15%. You will notice the graph on the screen start to plot also. This cangive you valuable information on the quality of your control loop and overall process.
Process Wait
Since the start Mode programmed for layer 2 is AUTO, when layer 1 reaches its end thickness
layer 2 begins using parameters from Film 3. When the STC-2000A sequences to layer 5 a PROC[ESS]WAITING message is displayed, this occurs because a WAIT was programmed for the start MODE forlayer 5. To continue the test process through layer 5 & 6, press START: Break Wait.
There are several things that you can do from the RunTime Screen. If you press the fixed ZERO
key, the THICK number will be zeroed. By pressing the fixed STOP key during any phase, the STC2000A will abort the run and the power will go to 0%. By doing this you can become familiar with how
START: Restart Film & Next Layer can be used to recover a process.
This completes the programming example for the 6 layer , 2 film process. If you have followed
along, you have learned how to review and program a process (Process 1), how to select, review and edit
films (Film 1 & 3) and how to start and stop a process. If you are installing the STC-2000A in a system or
programming an actual process, several more parameters would have to be programmed for each film.
These film parameters are detailed in Section 2.12.
Section 2.13 details optional film parameters which appear when some user selected system
options are invoked. This section should be reviewed to see if they pertain to your particular system
configuration requirements.
The example process above was 6 layers using two films. This implies that two sources or two
pockets of a rotatable source would be used in the actual deposition system.
The STC-2000A also allows you to implement either of these configurations by using its versatile
programmable I/O feature. An I/O program for controlling a multipocket source is shown in example 3 in
the I/O Programming Section (Section 5). The I/O program for the dual source configuration is given as
example 4 in Section 5. All the Front Panel controls such as START can also be implemented to becontrolled remotely through the programmable I/O or alternately through one of the other computerinterfaces.
VERIFYXTAL

3rd RESET/START PROCLAYER = #

WAIT
CHECK

BUSY
Proc

ERROR

STOP

1st RESET/START PROCREST

2nd RESET/START PROC

Process START: RESET / START PROCESS diagram
Some ERROR conditions may need 3 RESET/START’s to return to a running process. See "Process
START: RESET/START PROCESS diagram"↑

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Product programming summary

SECTION 3.22

Summary

In all of the following cases, use BAKs and/or BYEs for a return path. The fixed STATUS key can be used
at any time or point to return to the RunTime screen. [Screen in the tables refers to the screen currently
displayed.]
To program for PROCESS NON-SEQUENCING...
ScreenKey[s] to press
RunTimefixed MENU
MAIN MENUSERVICE
Service menu
SEQ [en]ABLE to NON SEQ + ACCEPTTo program for PROCESS SEQUENCING...
Screen
RunTime
MAIN MENU
Service menuKey[s] to press
fixed MENUSERVICENON SEQ to SEQ [en]ABLE + ACCEPT

To put the STC-2000A into TEST MODE...
ScreenKey[s] to press
RunTimefixed MENU
MAIN MENUSERVICE
Service menu
TEST OFF to TEST ON + ACCEPT
Subsequent power cycling automatically sets TEST MODE to OFF.

To PURGE programmed memory...
ScreenKey[s] to press
RunTimefixed MENU
MAIN MENUSERVICE
Service menu
AS IS to PURGE + ACCEPT
Exercise CAUTION PLEASE! See cautions in sections 1.8 and 3.19.

To return to FACTORY settings (programmable elements)...
ScreenKey[s] to press
RunTimefixed MENU
MAIN MENUSERVICE
Service menu
AS IS to PURGE to FACTORY + ACCEPTSECTION 3.XX

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Communications setup includes:
COM/IO lock code
KEYBOARD BEEP
RS232 Baud rate
RS232 Protocol
To view / program one of these...
Screen
RunTime
MAIN MENUEXECUTIVE MENUCOMMUNICATIONS SETUP MENU
( Lock Code, if enabled [see Comm Setup]
COMMUNICATIONS SETUP EDIT MENUCOMMUNICATIONS SETUP EDIT/CHG
MENU

Key[s] to press
fixed MENUEXECUTIVE MENU
COMM. SETUP
arrow[s] ; EDT (edit)
numeric entry + ENT (enter) )arrow[s] ; CHG (change)
numeric entry[s] + ENT (enter)

System Configuration includes:
LCD Contrast / Bias
Password Lock #(Process) Run Number
Recorder Function
Recorder Out Channel
Real Clock Time
Real Clock Date
I/O Slot 1 TypeI/O Slot 2 TypeI/O Slot 3 TypeI/O Slot 4 Type
Memory Module IFC
To view / program one of these...
Screen
RunTime
MAIN MENUEXECUTIVE MENU
System Configuration menu
( Lock Code, if enabled [see Sys Config]
System Configuration Edit menu
System Configuration Edit/Change menu

SECTION 3.XX

Key[s] to press
fixed MENUEXECUTIVE MENUSYSTEM CONFIG
arrow[s] + EDT (edit)
numeric entry + ENT (enter) )arrow[s] + CHG (change)
numeric entry + ENT (enter)page 138 of 292

p STC-2000A DEPOSITION CONTROLLER y

To view / program film parameters...
ScreenKey{s] to press
RunTimefixed MENU
MAIN MENU
REVIEW FILM
REVIEW FILMS menu
GO2 FILM (to select different film, if needed)
REVIEW FILMS menu
arrow[s] + EDT (edit)( Lock Code, if enabled [see Sys Config]
numeric entry + ENT (enter) )Review Films Edit menu
arrow[s] + CHG (change)
Review Films Edit/Change Numeric Entry
numeric entry + ENT (enter)
See Section 1.8 for Programmable Parameter List.

To set the NEXT ACTIVE PROCESS (sequencing mode only)...
ScreenKey[s] to press
RunTimefixed MENU
MAIN MENUNEXT ACTIVE PROCESSNUMERIC ENTRY MENU
Digit (1-9) + ENTER[If UNIT BUSY NA is displayed instead of NEXT PROCESS x, the START key must be used to reset the process from the Runtime
screen]To view / program PROCESS steps (sequencing mode only)...
ScreenKey[s] to press
RunTimefixed MENU
MAIN MENU
REVIEW PROCESSES
Review Processes menu
GO2 PROCESS (to select a different process, if
needed [process selected on numeric entry
screen by digit + ENTER])
Review Processes menu
arrow[s] ; EDT (edit)( Lock Code, if enabled [see Sys Config]
numeric entry + ENT (enter) )Review Processes Edit menu
arrow[s] ; INS (insert) ; DEL (delete) ; CHG(change) step line
Review Processes Edit/Change menu
arrow[s] ; MOD (mode) ; FLM (film) ; THK(thickness)
Review Processes Edit/Change Mode menu
SKP (skip) ; STP (stop) ; AUT (auto) ; END ;WAI (wait) ; ENT (enter)
Review Processes Edit/Change Film menu
numeric entry + ENT (enter)
Review Processes Edit/Change Thickness
numeric entry + ENT (enter)menu

To view Process Accounting History (sequencing mode only)...
ScreenKey[s] to press
RunTimefixed MENU
MAIN MENUEXECUTIVE MENUEXECUTIVE MENUPROCESS ACCNT
Process Accounting History menu
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To view / program I/O Setup...
Screen
RunTime
MAIN MENUEXECUTIVE MENU
I/O Setup MENU
( Lock Code, if enabled [see Comm Setup]
I/O Setup Memory menu
I/O Setup Operating Status menu
I/O Setup Edit menuKey[s] to press
fixed MENUEXECUTIVE MENU
I/O SETUP
arrow[s] ; MEM (memory A or B) ; OPR(operating status) ; EDT (edit)
numeric entry + ENT (enter) )SAV (save) ; SWP (swap A↔B)
RUN ; STP (stop)arrow[s] ; INS (insert) ; DEL (delete) ; CHG(change)

I/O Setup Edit/Change menu

arrow[s] ; IN (input) ; KON# (constant) ; BAK SP(back space) ; DEL (delete) ; UNDO ; [cursor
arrows] ; MOR (more 1 of 5) ; POS (positive edge) ;NEG (negative edge) ; AND ; OR ; XOR ; UNDO ;MOR (more 2 of 5) ; ADD ; SUBtract ; MULtiply ;DIVide ; UNDO ; MODulus ; MOR (more 3 of 5) ;EQUality ; NOT ; GreaTer than ; LESs than ; UNDO; SELect ; MOR (more 4 of 5) ; OUT (output) ; TRP(trip) ; SET ; CLR (clear) ; ARM ; DRP (drop) ; ENT(enter) ; MOR (more 5 of 5) ;I/O Setup Edit/Change menu (numeric entry)

100 (most significant digit, hundreds digit) + 10
(tens digit) + 1 (least significant digit, units
place) ; ENT (enter)To select Crystal Sensor (set secondary crystal[s] as backup, fail primary, re-verify to reinstate primary)...
ScreenKey[s] to press(Setup parameters on FILM REVIEW menu
(Film Review: SS MAP SELECT x, Review SS
and REVIEW SS MAP menu)
MAP: XTALS and CH x related parameters)
RunTimeSTATUS (press three times)
3rd STATUS screen
Use FORCE FAIL to select fail channel and reverify

To adjust Power level % manually (first 2 lines using LCD, second 2 lines using pendent)...
ScreenKey[s] to press
RunTime (with deposition running)
fixed MANUAL, fixed STATUS twice
2nd STATUS (with deposition running)↑ (up arrow) increase, ↓ (down arrow) decrease
RunTime (with deposition running)
fixed MANUAL
RunTime (with deposition running)(Pendent Hand Controller) UP ↑ ; DOWN ↓To select Crystal Stability Indicators "L/Q"...
Screen
RunTime
RunTime
RunTimeSECTION 3.XX

Key[s] to press
L/Q
LOOP
QUAL

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p STC-2000A DEPOSITION CONTROLLER y

To select/use Sample and Hold (see System Configuration parameter)...
ScreenKey[s] to press
RunTime[area below L/Q]
RunTimeSMPL
RunTimeHOLD

To view OPT/INF (options / info)...
Screen
RunTime
MAIN MENUEXECUTIVE MENU
OPT/INF

Key[s] to press
fixed MENUEXECUTIVE MENU
OPT/INF
MORE (more pages)

To select ACTIVE FILM (non-sequencing mode only)...
ScreenKey[s] to press
RunTimefixed MENU
MAIN MENUNEXT ACTIVE FILM
Numeric entry
Digit[s] + ENTER
In SEQUENCING mode, the active film is set by the active process.

SECTION 3.XX

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p STC-2000A DEPOSITION CONTROLLER y

Electrical Connections And Descriptions

Sensor Head Installation

SECTION 4.0

Following is a diagram of a typical evaporator installation. This diagram is repeated and described further
in Section 3 (see fig. 3.7).

SENSOR
I/O 4

I/O 3

I/O 2

instruments

I/O 1
R
S
2
3
2

1

FUSE: 2 X 2.00 AMP
QUICK-ACTING (F) 250V
90-264 VAC, 50-60 Hz, 230 VA MAX

2
1
2

M
E
M

INPUTS / OUTPUTS! WARNING
THE POWER CORD PROTECTIVEGROUNDING CONDUCTOR MUST
BE CONNECTED TO GROUND, NO
USER SERVICEABLE PARTS
INSIDE. REFER SERVICING TOQUALIFIED PERSONNEL

SOURCE

Memory Module

CHAMBERCRYSTAL SENSORSHUTTERCHART RECORDERDATA AQUISITIONDEPOSITION
SOURCECOMPUTEROSCILLATOR

Sensor Installation
As a general rule the sensor head should not be installed closer than 10 inches to the evaporation
source. This minimum distance will generally provide adequate measurement sensitivity while reducing
the possibility of the source spattering small particles onto the sensor. Even small particles hitting the
crystal surface may cause the crystal to become unstable or stop oscillating completely.
The sensor should be shielded from the evaporant source by a shutter or other means whenevaporant material is being initially conditioned or outgassed.
#4-40 Tap -- 4 holes
Equally Spacedon o0.731 B.C.

Water Cooling

Microdot Coaxial Connector

Figure- : 4.1 Head Mounting Dimensions.

SECTION 4.XX

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p STC-2000A DEPOSITION CONTROLLER y
Install the sensor so that the crystal opening is in a direct line with the evaporation source and wellwithin the evaporant stream. Ensure that the sensor is not shadowed by mechanical structures within thevacuum system. The sensor should be held mechanically stable by attaching it to a mounting bracket via
the rear #4-40 tapped holes.

Water Lines
Bend the two sensor water lines into the desired position for connection to the vacuum
feedthrough. Take care not to crimp the lines. There are two methods for attaching the water lines to thefeedthrough. The first is to silver solder or TIG weld the sensor and water lines together. To do this firstlocate the final position of the sensing head and feedthrough. Trim the 1/4" water lines on the feedthroughto the desired length. Bend and fit the sensor water lines as required. Cut the 1/8" water lines to length
allowing 1/4" to 1/2" of extra length to be inserted into the 1/4" feedthrough water lines. Then braze, silver
solder, or TIG weld.
The second is to use Swagelok compression fittings. These are available from Sycon as partnumber 022-001. These can also be purchased from Swagelok as part number SS-300-6-2.

Installing Compression Fittings
Swagelok® Compression Fittings
Swagelok® Tube fittings are installed in three easy steps:
Step 1-simply insert the tubing into the Swagelok® tube fitting. Make sure that the tubing rests firmly on
the shoulder of the fitting and that the nut is finger tight.
Step 2-before tightening the Swagelok ® nut, scribe the nut at the 6 o'clock position.
Step 3-now, while holding the fitting body steady with a backup wrench, tighten the nut 3/4 of a turn.
Watch the scribe mark, and make 3/4 revolution to the 3 o'clock position.
By scribing the nut at the 6 o'clock position as it appears to you, there will be no doubt as to the starting
position. When tightened 3/4 of a turn to the 3 o'clock position you can easily see that the fitting has been
properly installed.

Re-Tightening Instructions
Re-Tightening Water Line Fittings
Connections can be disconnected and re-tightened many times. The same reliable, leak-proof seal
can be obtained every time the connection is remade. First tighten the nut by hand. Then rotate the nut tothe original position (scribe mark at 3 o'clock) with a wrench. An increase in resistance will be felt near
this point. Now tighten an additional 1/8 turn.

Vacuum FeedthroughThe vacuum feedthrough should be installed as close as practically possible to the sensor head.
This allows the shortest length of sensor-to-feedthrough coax cable to be used. Cable lengths greater than
30 inches may reduce crystal life and stability. Install the feedthrough using proper gaskets and vacuum
grease if needed. The small electrical coax connector should be on the vacuum side of the installation.

SECTION 4.XX

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p STC-2000A DEPOSITION CONTROLLER y

Water Line Caution:

CautionCAUTION Ensure that the water lines are clear of obstructions before operating thesensor above room temperature. A water flow rate of 0.2 to 0.3 gpm is adequate for mostapplications.

Electrical In-Vacuum Cable
Vacuum Electrical Connections
The electrical cable from the sensor head to the vacuum feedthrough should be wrapped aroundthe water lines using up all excess length in the process. Firmly tighten the connectors at both the sensor
and feedthrough ends. The water lines and sensor cable should then be wrapped with clean tin foil or othershielding material to prevent evaporant build-up and also to aid cable cooling and mechanical stability.
The sensor head must always be operated at "ground" potential and this connection is carriedthrough the sensor feedthrough coaxial connectors and shields. The remote oscillator is attached to thevacuum feedthrough via the six-inch male/female coax cable. The long coax cable connects the remoteoscillator to the display unit. This cable must be a coaxial 50-ohm type and can be up to 100 feet in length.
For safety purposes and electrical noise immunity, a ground wire should always be installed
between the vacuum vessel and earth ground. Refer to Figure 4.3.

Dual Shuttered Head
The installation of a dual shuttered sensing head is similar to that of the single head. A
second sensing input (Sensor 2) is used for the second crystal channel. If the STC-2000A is
configured in the executive mode for automatic crystal switching the XTAL 2 SELECT output
performs the necessary functions for controlling the shutter of the dual sensor. Proper phasing
between the sensor inputs and shutter control can easily be checked by installing a sensing
crystal in only sensor 1 and observing the good and "failed" (absent) sensing crystal whenswitching manually between sensor 1 (good) and sensor 2 (failed).

SECTION 4.XX

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p STC-2000A DEPOSITION CONTROLLER y
Electrical Connections and Descriptions
All electrical connections to the STC-2000A, with the exception of the remote hand held
power controller, are made at the rear panel of the instrument. Care should be exercised inrouting all cables as far as practically possible from any other cables or wires that may begenerating noise. These may include other line voltage cables, wires to heaters that are SCR-controlled,
and wires or cables to source power supplies that may conduct high transient currents during arc overconditions.

SECTION 4.1

SENSOR
I/O 4

I/O 3

I/O 2

instruments

I/O 1
1

R
S
2
3
2

FUSE: 2 X 2.00 AMP
QUICK-ACTING (F) 250V
90-264 VAC, 50-60 Hz, 230 VA MAX

2
1
2

M
E
M

INPUTS / OUTPUTS! WARNING
THE POWER CORD PROTECTIVEGROUNDING CONDUCTOR MUST
BE CONNECTED TO GROUND, NO
USER SERVICEABLE PARTS
INSIDE. REFER SERVICING TOQUALIFIED PERSONNEL

SOURCE

4.2: Rear Panel

SECTION 4.2

Line PowerLine Power and Fuses
WARNING
Replace broken or blown fuses only with the ratings specified. Failure to do so may
result in unsafe operation and may cause damage to the unit. See back panel for fusespecifications. Fuses are located in IEC power connector. (See section 7.1)
The STC-2000A operates from 90 to 264VAC, 50/60Hz (1.4A rms@120VAC, 0.7A rms@230VAC). No
adjustments are required. A correct IEC or Sycon power cord should be used.

SECTION 4.3

Installation of STC-2000A in a 19" Rack

To install a single STC-2000A in a 19" rack it is recommended that the included mounting
ears and extender be used.

SECTION 4.4

Vacuum System Grounding
GROUND

A ground post is provided on the rear panel. This point should be connected tothe deposition system ground with the shortest convenient length of heavy gauge wire or flat
braided cable. This connection is not required for normal operation but will make the unit less

SECTION 4.XX

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p STC-2000A DEPOSITION CONTROLLER ysusceptible to transient noise and it is highly recommended that it be installed. Refer tofigure below for an example of proper installation.

SENSOR
I/O 4

I/O 3

I/O 2

instruments

I/O 1
R
S
2
3
2

1

CHAMBER

FUSE: 2 X 2.00 AMP
QUICK-ACTING (F) 250V
90-264 VAC, 50-60 Hz, 230 VA MAX

21
2

CRYSTAL SENSORINPUTS / OUTPUTS

M
E
M! WARNING
THE POWER CORD PROTECTIVEGROUNDING CONDUCTOR MUST
BE CONNECTED TO GROUND, NO
USER SERVICEABLE PARTS
INSIDE. REFER SERVICING TOQUALIFIED PERSONNEL

SOURCE

EVAPORATOR
POWER SUPPLYCHAMBER GROUND

Figure- 4.3: Recommended Grounding

CONNECTOR INSTALLATION
Connector Shielding
In systems with a high electrical noise environment, attention needs to be given when wiring
connectors. A little extra time spent here can save hours of frustration later. Sycon provides mating
connectors with each instrument. For best results, use a shielded multi-conductor cable. On the Dsubminiature connectors that are supplied with the units, the metal shells each come with a set of four
grommets. Pick the grommet for the size cable you are using. After making the desired electricalconnections, remove an additional 3/4 inch of the outer insulation of the cable to expose the cable shield tothe grommet. Because the grommet is conductive, just clamping it between the metal shell is sufficient tocomplete the shielding of the cable.
Figure 4.2 shows the Input/Output card card slots (labeled 1, 2, 3 and 4). The typical installation has
slot 1 filled with an input card and slot 2 filled with an output card. Figure 4.2 also shows the Sensor card
slot. The standard installation has this slot filled. The sensor card has 2 crystal inputs and 2 identicalcontrol voltage outputs. Each of these control voltage outputs are both isolated and single ended. In astandard STC-2000A (with 1 sensor card), the control voltage outputs may be configured such that one
output is programmed and intended as a process control voltage while the other control voltage output isprogrammed and intended for use on a strip chart recorder. Back panel designations for slot 1 are: "1" and"2" for sensors 1 and 2 in the area labeled "SENSORS" while in the area labeled "SOURCE", "1/2"
indicates source control voltages 1 and 2 on one 9 pin D-sub female. There are 4 slots for Input and/or
Output cards.

SECTION 4.5

Sensor Connections

Connector Type -- BNC

SECTION 4.XX

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p STC-2000A DEPOSITION CONTROLLER y
Crystal Sensor Inputs
These connectors are the remote sensor oscillator’s interface to the STC-2000A. These
connections are both the signal and power path to the oscillator. The supplied power is 5 volts at 50 mA.
The input impedance is 50 ohms and the signal level is 1 volt peak to peak. This connection should always
be made with coaxial cable. Type RG58 or RG59 is recommended. Cable lengths up to 100 feet are
acceptable. These cables in 10 and 30-foot lengths are available as standard parts from Sycon.

SECTION 4.6

Analog Control Voltage Connections

There are 2 identical analog output voltages available from the sensor card on a single connector.
Power Supply Connection: This refers to the high current (or voltage) power supply that provides theenergy to create the evaporant stream. The power supply connection on the STC-2000A has the control
voltage that controls the high current (or voltage) power supply. From the STC-2000A point of view, thisis known as the source control voltage. The word source describing the source material of the deposition
process in the form of an evaporant stream. Along the bottom of the back panel, in the area where sensor
cards may reside, is the text label SOURCE. This is meant to indicate the 9 pin D-sub that is part of thesensor card. The text labels ½ refers to the control voltage outputs. In the sensor card slot, this indicatescontrol voltage 1 and control voltage 2. Given the standard hardware configuration, that with 1 sensor
card, one of the control voltages is meant to control the high current (or voltage) power supply justdescribed and the other control voltage is normally meant for the strip chart recorder control. These
identical analog outputs can be interchanged. In fact, their function is assigned by means of menu
programming. If the two functions (control voltage and recorder) are assigned by menu programming on
the same analog channel, the control voltage will have precedence and the recorder function will be lost.
After these programmed outputs are used in a film, a conflicting recorder function having been lost in thisway would require a reboot to recognize a correcting change. The analog output used for the control
voltage output has a number of programmable parameters associated with it. One in the MAIN/ REVIEWFILMS menu path is: SS MAP SELECT. Another one in the MAIN/ REVIEW MAPS menu path is: source
out channel. Don't overlook the ground connection (connector shell). Shielding goes a long way toward
noise reduction and ultimately contributes to a stable system.
Strip Chart Recorder Connection: This refers to the STC-2000A output from the 9 pin D-sub on thesensor card that can provide the proper analog signal for a strip chart recorder. Along with the hardware
connection, the analog output used for the strip chart recorder has a number of programmable parameters
associated with it. Two in the MAIN/ EXEC/ SYSTEM CONFIG menu path are: recorder function I/O
control and recorder out channel. Don't overlook the ground connection (connector shell). Shielding goesa long way toward noise reduction and ultimately contributes to a stable system.

Control Voltage Output Connection
Except for the possible single output per unit used for the strip chart recorder, the other output isintended to provide the rate control voltage for the deposition source power supply. The voltage is
programmable in range through the review maps menu as described previously. The isolated single ended
output provides up to 10 ma at 2.5, 5, and 10 volts, both positive and negative relative to the channel
common. The control output voltage connections for outputs 1 and 2 (on the sensor card) are as follows:[for optimum noise immunity, it is recommended that a shielded, twisted pair cable be used to make the connection
from the STC-2000A to the power supply control input or strip chart recoder of the deposition system]

SECTION 4.XX

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p STC-2000A DEPOSITION CONTROLLER y
Control Signal 1+Output-Output
Analog Ground (common)
ShieldConnector Type – 9 PIN D-SUBMINIATURE female

Pin No.
9
4
5SHLD

Control Signal 2
Pin No.
+Output2-Output
6
Analog Ground (common)
1
ShieldSHLD
Connector Type -- 9 PIN D-SUBMINIATURE (ON THE SAME CONNECTOR DESCRIBED ABOVE)

SECTION 4.7

Analog Recorder Output Connection/Usage

As previously discussed, the analog outputs are identical and interchangeable. One output per
STC-2000A may be used for a strip chart recorder. A standard unit having one sensor card may use thesecond channel for strip chart recording as discussed here. In this example, the second output provides ananalog output voltage proportional to either displayed rate, rate deviation, power, or thickness. The channeland status value are selected using the system configuration menu. The names of the related system
configuration menu items are recorder function and recorder output channel.
The second analog output, here described for possible use as the analog recorder output voltage,
has the connections as described above for Control Signal 2, that is pins 2, 6, 1 and shield. It is
recommended that a shielded, twisted pair cable be used to make the connection from the STC-2000A to
the chart recorder input.

Analog Recorder Output Specifications (any analog output)
Resolution
Accuracy
Loading Capacity
Full Scale Output

12 Bits
0.3 % Fs
5 mA
10 Volts

Analog Recorder Output Calibration / Interpretation
Recorder Output Types
Thickness Mode - The analog recorder output in the thickness mode is always scaled for plus orminus 999 angstroms full-scale (9.99V). Resolution is always one (1) angstrom. Display readings above
999 angstroms will be sent to the recorder output as the remainder of the displayed value divided by 1000.

SECTION 4.XX

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p STC-2000A DEPOSITION CONTROLLER y
10

1000Å

2000Å

3000Å

9
ANALOG OUTPUT
FOR THICKNESS

8
7

V
O6
L 5
T 4
S

3500Å

3
2
1

CHART RECORDING OF 3500Å FILM

Figure- 4.4: Example of Thickness Mode Recorder Output.
Rate Mode - The analog recorder output for the rate mode is scaled for a full scale (999.9 Å/s)reading of 10 volts. Readings up to 100.0 Å/s will be output with a resolution of 0.1 Angstrom and values
above 100.0 Angstroms will be output with a resolution of 1.0 Å/s. This method allows a continuousrecorder accuracy of at least 0.3% and also provides a unique output voltage for any rate value within thedisplayable range of values. This output is unipolar with negative rates clamped at zero volts.
Rate Deviation Mode - linear from 0 to ±999.9 A°/S and 0 to 10 Volts. 0 to 999.9 A°/S generated
by voltages between (and including) 5 and 10 volts. 0 to -999.9 A°/S generated by voltages between (andincluding) 5 and 0 volts. In other words, zero rate deviation is midscale at 5 volts.
Power Mode - The analog recorder output for the power mode is scaled for a full-scale (100%)
reading of 10 volts.
109
8

ANALOG OUPUTFOR RATE

V
7
O
L 6
T
5
S
4

Slope 5.555 mv per Å/s
between 100 Å/s and 1000 Å/s

Slope 50 mv per Å/s
between 0 and 100 Å/s

3
2
1
100

200

300

400

500

600

700

800

900

1000

RATE - ÅNGSTROMS / second

Figure- 4.5: Example of Rate Mode Recorder Output.

SECTION 4.XX

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p STC-2000A DEPOSITION CONTROLLER y

SECTION 4.8

I/O Interface

Input Card Options: An opto-isolated input card can be configured in a number of ways. Inputs can beisolated or non-isolated, internally powered or externally powered (individually or as a group). Jumpers on
the input card are used to make the selections. All of the opto-coupler LED cathodes are brought out to the
25 pin D-sub female (i.e. pins 3,6,9,12,14,17,20,23 [(-) Input Pins]). The opto-coupler LED anodes arebrought into a jumper header (JP1) where each of the anodes can either be routed to a voltage source orsent out to the 25 pin D-sub female (i.e. pins 2,5,8,11,16,19,22,25 [(+) Input Pins]). The voltage source itself
is further selectable on a separate 3 pin jumper header (JP2) such that an internal voltage (+5VDC) can beselected or an external voltage can be selected (connects to pin 1 of the 25 pin D-sub female). The voltage
source, regardless of the JP2 selection, can therefore be applied to any or all of the anodes when JP1 selects
the voltage source. Any one or more of the anodes can be alternately routed through JP1 to keep themisolated from the other anodes and the voltage source. Jumpers can short from the center pin position to
one of the two outer pins (in each of the eight JP1 segments). Since there are 8 anodes, there are also 8 JP1
sections. The depiction below is a generalization of a single LED input (1 of 8). JP2 is a single 3 pin
position selector. [Section 4.8 has more details]

cathodeD-sub [(-) Input Pins, 1 of 8]
JP1

anode

D-sub [(+) Input Pins, 1 of 8]
JP1 has 8 of these 3 pin selectors

int. pwr.
(+5 vdc.)

JP2

JP2 is a 3 pin selector that distributes its center pin to the 8sections of JP1

D-sub (pin 1 only) ext. pwr. DC volts 3.5 to 40 volts, AC volts 5 to
30 Volts rms

dig. gnd.

D-sub (pin 13 only)

The standard I/O INTERFACE of the STC-2000A is comprised of 8 opto-coupled inputs(electrically isolated) on one PCB card and 8 Form C relay outputs on another PCB. The factory default I/O
program, which is described in Section 5.15, utilizes the factory programmed defaults which configures thefirst 4 inputs (1-4) and 4 relay outputs (1-4) to perform functions which suit a majority of deposition
requirements. These are described in sections below. The additional 4 inputs (5-8) and 4 outputs (5-8) are
not programmed at the factory. If the factory I/O program as shown in Section 5.15 is altered ordeleted these functions may not occur as described in the Sections 3.6 and 3.7. A full descriptionof I/O programming is given in Section 5 of this manual.
The OPTOCOUPLER INPUTS connector provides the user an isolated interface to
8 inputs from user equipment. These inputs can be activated in several ways, depending on
Input Ratings user accessible connection options, the following choices are available; DC voltage between
3.5 and 40 volts, AC voltage from 5 to 30 Volts rms, NPN transistor open collector or contact closure, logic
level 3.5 Volts or greater. For non-isolated applications the user can choose to use an internally supplied
5VDC bias voltage for the open collector or contact closure activation method. Isolated open collector

SECTION 4.XX

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p STC-2000A DEPOSITION CONTROLLER yoperation requires the user to supply a separate 5VDC bias, which is not grounded to the STC-2000A unit.
Do not exceed 45 Volts peak on any inputs or damage may occur. Ensure that the proper polarity isapplied to each input.

Input Connections The function of each input is user definable and programmable. However, the first four
inputs are pre-programmed at the factory per the following table. Any input may be
and Functions
reprogrammed or deprogrammed as needed. The pin numbers refer to the contact on the
25 pin D-subminiature female Optocoupler Inputs connector. (See Input Card Options above)
Input No.
1
2
3
4
5
6
7
8

(+) Input Pin No.
(JP1 commons)
2
16
5
19
8
22
11
25

(-) Input Pin No.
(cathodes)
14
3
17
6
20
9
23
12

Function(preprogrammed in I/O program)
Start
Stop
Final Thickness Trigger
Zero Thickness
User DefinedUser DefinedUser DefinedUser Defined

Digital ground (DG) is on pin 13. External power (User supplied voltage, [Vext]) can be applied to pin 1.

If an optional external isolated power supply is utilized, it can be applied on the Optocoupler Input
connector, pin 1 with the RETURN either negative for isolated or using pin 13 for nonisolated systems. This supply should be limited to 1.0 Amp total output current.
Input PCB Card:
Hookups to the optocoupler inputs are facilitated with two pin arrays, JP1 and JP2,
which are right angle mounted on the edge of the Input Module PC-board and accessible Optional ExternalPower Supply
by removal of the top cover. JP1 is a 3 by 8 pin array and JP2 is a 3 pin inline array.
Connection choices are made with 2 pin shorting blocks, as determined by the user for a Connections
particular application. Figure 3.3 shows examples of shorting pin locations, which arerequired to accommodate the various activation methods.

SECTION 4.XX

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p STC-2000A DEPOSITION CONTROLLER y

Hazardous
Voltages
Present

StaticSensitive

STC-2000A Input Module PC Board
Optocoupler
Inputs DB25F
Connector
Optional AC Input: 3.5V<VDC<40V
5<Vrms<30(or Logic Level)
50 - 60 Hz
pin 195VDC ext
JP2(row C is closest to PC board)

5VDC(Internal Vcc)

+ Input 4

JP1

8C

1C

8B

1B

8A

1A

+ Inputs to Opto Circuits
are on Row B

pin 6- Input 4

pin 13

STC-2000A Ground

Isolated
external
groundTwo Pin Shorting
Block LocatedHere for + Input 4

CONNECTIONS FOR AC OR DC
USING INPUT 4

DG
Optional:
Connect grounds for
non-isolated hookup

Input PCB
Card jumper
installation:
See section 7
for shockhazard andESDsensitivity

STC-2000A Input Module PC Board
Optocoupler
Inputs DB25F
Connector

5VDC ext
JP2
5VDC(Internal Vcc)

+5VDC
EXT.

Shorting
Block

pin 1

JP1

(row C is closest to PC board)
8C

1C

8B

1B

8A

1A

+ Inputs to Opto Circuits
are on Row B

Isolated
external
groundNC

Open
Collector

pin 17- Input 3

pin 13

STC-2000A Ground
DG

Contact

Two Pin Shorting
Block Located Herefor + Input 3
Connection to +5VDC

CONNECTIONS FOR CLOSURE TO
ISOLATED GROUND FOR INPUT 3

STC-2000A Input Module PC Board

Optocoupler
Inputs DB25F
Connector

JP2

5VDC ext

5VDC(Internal Vcc)

NC

Shorting
Block

pin 1

(row C is closest to PC board)

JP1

8C

1C

8B

1B

8A

1A

+ Inputs to Opto Circuits
are on Row B

Open
Collector
Contactpin 6- Input 4

pin 13

STC-2000A GroundTwo Pin Shorting
Block Located Herefor + Input 4
Connection to +5VDC

DG

CONNECTIONS FOR CLOSURE TO
NON-ISOLATED GROUND FOR INPUT 4
Figure- 4.6: Examples of Shorting Block Locations to Accommodate the Various
Optocoupler Input Hookup
SECTION 4.XX
pageOptions
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p STC-2000A DEPOSITION CONTROLLER y
The RELAY OUTPUTS connector provides the user an interface to 8 Form C (SPDT) relays. The
contact rating of these relays is 2A at 30 VDC or 2A at 30 VAC maximum. Do not exceed these ratings ordamage will occur.
As with the Optocoupler Inputs, each relay function is definable and programmable. The eight
output relays of the STC-2000A can be programmed to respond to logical combination of the following:
external events (the eight remote inputs); the state of the deposition process; active layers; or
setpoints of the STC-2000A. Programmable internal memory elements within the STC-2000A can
Relayprovide many system control functions, such as cycle counters or sequencers, which previously
required external hardware. The first four relay outputs are pre-programmed at the factory per the Ratings
following table. Any input may be reprogrammed or deprogrammed as needed.

Factory Installed
Relay Output Program

RelaysConnections andFunctions

Rela
y
No.
1

Function

2

Source Shutter
24
Relay
Xtal 2 Select10
Thickness Setpoint
21
User Defined
7
User Defined
18
User Defined
4
User Defined15
pin 1 is not connected

3
4
5
6
7
8

SECTION 4.9

Crystal FailComm
on PinNo.
13

NO
Contact
Pin No.
12

25

23

11

9
20
6
17
3
14

22
8
19
5
16
2

NC Contact Pin No.

Relay Outputs for Factory Installed I/O Program

The standard STC-2000A is equipped with eight SPDT relays. These are Form C (SPDT) relays and havenormally open and normally closed contacts. The normally open contacts become active when theirrespective function is true. It is assumed that the OUTPUT card PCB is in slot 2 (see figure 3.1 for I/O slot
designations).
Factory Output Relays
The definitions of the factory programmed relay outputs are as follows:
Output 1

Output 2
Output 3
Output 4

SECTION 4.XX

Crystal Fail - This Relay provides a contact closure whenever the selected sensor crystal
fails to operate properly or has exceeded its operating range. A flashing XTAL BAD
message will be displayed on the LCD to alert the user of this condition.
Substrate Shutter Relay - This Relay is intended to provide control of the substrate
shutter. It is generally activated during the deposition phase.
Xtal 2 Select - Relay is closed when sensor 2 is the active sensor.
Thickness Setpoint - This Relay provides a contact closure whenever the accumulated
thickness display value equals or exceeds the thickness setpoint parameter value of theactive film. A zero event (front panel or remote) or thickness setpoint parameter change
resets this.

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p STC-2000A DEPOSITION CONTROLLER y
Remote Inputs for Factory Installed I/O Program
The standard STC-2000A is equipped with eight remote input functions. These inputs areintended to be activated in a number of ways depending upon the previously described jumper
SECTION 4.10
placement (see figure 3.3). The signal can be continuously applied or be pulsed. The STC2000A can be programmed to respond to the leading or trailing edge of this pulse. The
minimum pulse width required is 15 ms. All eight of the inputs can be programmed by the user to suit thesystem requirements. It is assumed that the INPUT card PCB is in slot 1 (see figure 3.1 for I/O slot
designations). Initially, the first four inputs are pre-programmed at the factory to the following fourfunctions:
Factory Remote Inputs
Input 1
START - Functionally identical to Front Panel START key with the STC-2000A in theready state. Activating this input with the STC-2000A in either the ready or stopped state
will begin the process cycle.
Input 2STOP -Functionally identical to Front Panel STOP key. Activating this input willterminate the deposition process.
Input 3
Final Thickness Trigger - Activation of this input causes the unit to respond as if the final
thickness has been reached.
Input 4
Zero Film Thickness.

Specifications
External P.S. Activation
Minimum Current

SECTION 4.11

3.5 to 40 VDC , AC voltage from 5 to 30 Volts rms
2 mA

RS-232 Serial Communications Interface

This connection provides a serial data communications link to the STC-2000A. Four standard baud rates
can be selected: 300, 1200, 2400, and 9600. They are selected via the configuration menu. The serialinterface communications protocol is also selectable. The choices are either the Sycon format or ASCII
protocol. The electrical specifications correspond to the EIA RS-232 standard.
RS-232 Connections
STC-2000A Type:
Mating Connector:
STC-2000A Function

9 Pin "D" male
AMP 205203-1 Or Equivalent (Sycon#s: 404-028, 404-019)
Pin Number

RS-232 Received Data

2

RS-232 Transmitted Data
RS-232 Signal Ground
Cable Shield

3
5
Shield Case

SECTION 4.XX

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p STC-2000A DEPOSITION CONTROLLER y
To: STC-2000A

To: PC HOST

2 RxD

RxD

DSR 6
2

3 TxD

TxD
CTS
DTR

3
8
4

GND

5

9
5 GND

SHIELD

9 PIN FEMALE

9 PIN FEMALE

RS-232 CONNECTIONS

To: IBM - PC,XT

To: STC-2000A
2 RxD

TxD

2

3 TxD

RxD

3

CTS

5

9
5 GND
9 PIN FEMALESHIELD

DSR

6

GND

7

DTR

20

Figure- 4.7: Example Cable to Interface STC-2000A To Host PC

SECTION 4.12

Communications Options

Communications Option
The STC-2000A supports one communications option board. This is for an industrial network.
This card uses the rear panel option cutout for external connection. This is a factory-installed option.

SECTION 4.XX

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p STC-2000A DEPOSITION CONTROLLER y

SECTION 5

I/O PROGRAMMINGI/O Programming Introduction
SECTION 5.1

The ability of the user to configure the structure of STC-2000A's inputs and outputs is
one of its most powerful features. The I/O configuration can be customized by the user throughthe use of the I/O setup menus of the STC-2000A. This is accomplished through the LCD display, the fixed
front panel MENU key and the software controlled touch panel LCD display overlay (a 12 column by 4
row key matrix). See section 2.1.

In this section, I/O Setup menus will be used to enter, view and maintain I/O programs through theabove described LCD menus. Section 6.0 will describe host port commands that can duplicate theseactions.
General Description: The LED display indicates run time values of rate/power/thickness. The 1st line of
the LCD indicates the menu path down to the current menu. The next line (central part only) indicates
operations as running or stopped along with the I/O program checksum (prefixed with the label: ID=).
Next, there is an area that shows as many as three I/O Setup list items with the 2nd of 3 list positions
allowing edits (edit line always indicated by -↓↓-). Each list item occupies two display lines (line# on 1st,
tokens on 2nd). In the area on the right, there are 9 touch key areas that can become active or inactive as
appropriate for the various cascading menu usages. The following depicts the main I/O setup menu in its
initial state (with no program entered).
There are four general functions that can be utilized: 1) View the I/O program using GOTO and arrowkeys, 2) Exchange (swap) or save the I/O program using the MEM (memory) key to access a sub-menu, 3)
Run or stop the I/O program using the OPR (operations) key to access a sub-menu, 4) Edit the I/O program(includes adding/deleting/changing lines) using the EDT (edit) key to access a series of sub-menus. See
sections 5.9 and beyond for detailed descriptions.

I/O
PROGRAMMING
MAIN MENUThe I/O program is a list of logical combinations of states or events with their desired results. The
states and events are related to the inputs, outputs and internal operation of the STC-2000A by
identification numbers shown in Table 5.4. These ID's along with a function code form tokens which areevaluated along with Boolean operators (AND, OR & NOT) to cause the desired output results. Each lineof the I/O program is called a rung. The minimal program is shown above, with the END line in the 2nd list
position (display lines 5 and 6). Don't confuse program line (rung) number with the physical LCD display
line number. The display line number will not be used.
An I/O rung consists of three segments: the rung number, the input statement, and the output
token. The rung number is like a line number in a software program. Rungs can be inserted or deleted byediting an I/O program as described in Sections 5.11 through 5.14. When this is done the rungs are
renumbered. The rung number serves as a reference when writing or recording an I/O program.
After the rung number, an input expression follows. This can be a single input token or a logicalexpression of many tokens. When an input expression becomes too complex to fit in the rung, soft nodes

SECTION 5.XX

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p STC-2000A DEPOSITION CONTROLLER ycan be used to store intermediate results. In this case, the soft node forms the output portion of the rung.
The soft node used for intermediate storage can then be used as an input in a later I/O rung to complete thedesired expression. (See the following table 5.1 under the heading of Terms and Definitions for definitionsof input, token, soft node, etc.)

There is room in the STC-2000A for a program of more than 100 rungs. Once installed the I/O
configuration is stored in non-volatile memory within the STC-2000A and need not be reentered orchanged unless the system configuration or requirements change. The STC-2000A is shipped from thefactory with a partial I/O configuration installed. In many installations the factory I/O structure issufficient for system use, as it allows for remotely starting and stopping the deposition cycle along with
controlling the source shutter. Some systems do require more complex controls. The advanced
programmable I/O capabilities of the STC-2000A allows these to be implemented. A description of thefactory programmed I/O functions are described in Section 3.5-3.7.
By writing an I/O program for the STC-2000A, it can often be used as a controller for a portion or
all of your vacuum system. A multi-hearth deposition source may be rotated under the control of the STC2000A to correspond to the selected film material. With the ability to test and set various internal states of
the STC-2000A there is no need to connect relay outputs back to inputs externally. There are 8 optoisolated inputs¹ and 8 relays available for use in a standard STC-2000A. Four of the inputs and relays
normally have common functions preprogrammed at the factory. These can be redefined by changing theI/O program. The remaining 4 inputs and relays are not committed in any way. We recommend that you
use the uncommitted I/O for your system before redefining the factory installed system I/O.
While at a first glance, writing an I/O program may seem overwhelming, knowing the terminology
will help a great deal. You will find that by learning a few consistent rules , writing an I/O program willsolve many of your system problems.

Note

Note Once the I/O is programmed, it should be recorded and stored for safe keeping(see section 2.21). If a unit is replaced because of a failure, the I/O program will haveto be re-installed in the replacement unit in order to perform the same system
functions. Factory restore function does not include I/O programs (See section 3.6,
Processes: Factory Settings…).

Note¹ : Opto anode and cathode are presented to the user through a 25 pin D-sub female typically found in slot1 on the back panellabeled "I/O 1" (see figure 3.1). LEDs can be powered in a number of ways depending upon input card PCB jumper setting (seefigure 3.3 in section 3.5).

Definition Of Common Terms
The first task is to become familiar with the terms used in writing an I/O program. Refer to Table
5.1, it lists common terms and the manual section where a more complete description of each can be found.
The best way to become familiar with writing an I/O program is to go through the examples with aunit in front of you. In case you make a mistake and want to restore the original I/O program, we haveprovided you with the ability to save and recall an I/O program (See Section 5.10). Factory restore does
not include I/O programs.

SECTION 5.XX

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p STC-2000A DEPOSITION CONTROLLER y

Terms and Definitions
State
A testable condition of the Model 880. Examples of states are stopped, deposit, manual, idle, etc. A state does not have anything to
do with time (see Edges). See Section 5.3

Event
An event can be either triggered or tested. It is normally an internal occurrence in the Model 880. Examples of events are zeroing,reaching the final thickness limit, etc. An event is triggered by an Edge.
see Section 5.3

Boolean
A Boolean state can take on only one of two values, commonly referred to as True (on) and False (off). See Section 5.2

Scalar
A variable with a range of 0...N. Also, a special non-Boolean type of scalar whose set is {0,1}. See Section 5.2

Bit Map Scalar (combined bit weights)
A variable whose constituent parts are independent Boolean values combined in a single variable entity. See Section 5.2

AND, OR, NOT
These are logical operators. 'ANDing' can be thought of as relays in series, 'ORing' as relays in parallel, and 'NOTing' orcomplementing as using the normally closed contacts instead of the normally open ones. (for complications of, see section x5.4) See
Section 5.2

Arithmetic
The Arithmetic operators included are: multiply, divide, add and subtract.

Relational
The relational operators included are: greater than, less than and equal to.

Selection
This is a type of IF... THEN... ELSE conditional operator. If something is true, then use value A, if something is not true then use
value B. The selection is between two values (values A or B) and is based upon the truth or falsity of the main argument (something).

Input Function
This is the manner in which states and events are tested or examined. All states and events are examined or read with the same 'I'
input function. See Section 5.5

Output Function
Manner in which relays and events are set or triggered. By providing several different types of output functions, counters and shift
registers can be implemented. See Section 5.6
Table 5.1: Glossary Of Terms continues on following page...
TC "I/O Programming: Glossary of Terms" \ft \l2

SECTION 5.XX

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p STC-2000A DEPOSITION CONTROLLER y

Terms and Definitions

Table 5.1: Glossary Of Terms continues from previous page...

Edges
A condition that has to do with the instant in time of an event's occurrence. An example is the pushing of the zero key. The action
takes place on the edge of pushing the key. Edges are categorized by the direction of change in the associated state. Positive or
rising (↑) and negative or falling (↓) (True to False). See Sections 5.4, 5.5, and 5.6

ID Number
A code that the Model 880 uses to refer to a state or event. It can be up to a 3 digit number. See Sections 5.3 (table 5.6) and 5.7

Token
Either the combination of an input/output (I/O) function and an ID number, or a Boolean, logical, arithmetic, or relational operator.
A token is made up of input or output functions with an ID number. An operator is also a token (not, or, and, etc.). See Section 5.8

Rung
A rung is a line of an I/O program. Each rung has a number associated with it. This term is a carryover from programmable logic
controllers (PLC). An I/O program is made up of rungs of tokens. Each rung has 1 or more input tokens, may contain operators, andhas 1 output token. See Sections 5.6, 5.7 and 5.8

Soft NodeA soft node is a special input / output variable in the Model 880. It is a holding area where intermediate results can be stored. They
are not associated with any machine state. By using soft nodes, complex functions can be implemented such as counters and shift
registers. Soft nodes can also be scalars. See Section 5.7

Stack
The method that the Model 880 uses to evaluate Boolean expressions. Each Boolean value is placed on a stack when an operator or
input expression is encountered and popped off when an output expression is encountered. By using a stack, parenthesis are notneeded in writing I/O programs. See Section 5.8

Push
Every time the Model 880 comes across an input function, the associated value (T/F, On/Off) is pushed on the top of the stack.
Everything else in the stack moves down one position. See Section 5.8

Pop
Every time the Model 880 comes across an output function or operator, the top value(s) is popped off of the stack (and anotherpushed back in the case of operators). In the case of an output function, the value that is popped is used to define the specific output
behavior performed. See Section 5.8
Table 5.2: Glossary Of Terms.

SECTION 5.XX

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p STC-2000A DEPOSITION CONTROLLER y

Boolean Operations
Boolean Definition

SECTION 5.2

A basic understanding of Boolean operations is needed before you can write an I/O program. A
Boolean variable has only 2 states. This can be thought of as on and off, closed and opened, 1 and 0, active
and inactive, or true and false. Only the terminology is different for these examples. The important thing
to keep in mind is that there can be only 2 states.

Boolean Operations
There are 3 basic operations that you can do with Boolean variables. These are 'ANDing', 'ORing',and 'Complementing' (complementing is also known as the 'NOT' operator). For the 'AND' operator, both
input conditions must be true for the output to be true. If you are familiar with relays, this is like putting 2
relays in series with each other. Both relay switches must be closed for the output to become active.
switch 1

switch 2

For the 'OR' operator, either input condition being true will cause the output to become true. In
terms of the relay description, either one of the switches (or both of the switches) can be closed to activate
the output.
switch 1
switch 2
The 'NOT' operator is only used on one input condition. It outputs the reverse state of the input. This is
like using the normally closed (instead of the normally open) contacts of a relay, converting true to false,on to off, off to on, etc.
Figure 5.1 illustrates using relays and the way the STC-2000A represents their function. Many people liketo first write out their solution using relay notation, then translate each rung for the STC-2000A's notation.

Relay Ladder Notation

I1

I0

I0 I1 I2 && O8

I2
O8

OR
I0 I1 & I2 & O8

I0O8

I0 I1 ¦ O8

I1

Figure- 5.1: Relay Ladder Notation [top is 'AND'ing, bottom is 'OR'ing]

SECTION 5.XX

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p STC-2000A DEPOSITION CONTROLLER y

Truth Table Notation
When using Boolean operators, it is common to use a truth table, (Refer to Table 5.3). This shows
all possible combinations of inputs and the resulting outputs. Let's assume that we have 2 input terms
called A and B, and the output term is called C. The operator symbols for 'AND', 'OR' and 'NOT' are &,¦, and ! , respectively. For the following table, we will use TRUE (T) and FALSE (F) to indicate Boolean
states.

& (AND)¦ (OR)! (NOT)

A&B=C

A¦B=C

! A =C

T

T

T

T

T

T

T

F

T

F

F

T

F

T

F

T

F

T

F

F

T

T

F

F

F

F

F

F

Table 5.3: Truth Table.

SECTION 5.3

STC-2000A States and Events

You are already familiar with states of the STC-2000A. Some of them appear on the RunTime
screen and appear as large characters. Common states are STOPPED, DEPOSIT, RISE 1, etc. States are
just a period of time in which the STC-2000A does a particular task. There are many internal states into
which you have access with the I/O program. It is not necessary to fully understand the internal workingsof the STC-2000A in order to write an I/O program, however. By examining the examples later in thissection, you can get a good idea of what is needed.

State Diagram Notation
In writing an I/O program, you can test whether a state is active or not. Events cause something tohappen in the STC-2000A. An example of an event is pushing the START key. In state diagram
notation, events are the lines connecting states together. The I/O system can force events in the STC2000A. Refer to Table 5.4, a list of all of the states and events the I/O system can access. You may wantto copy this table and keep it handy as you go through the examples. It provides a key to the codes in an
I/O program. Four front panel LEDs (output) and four fixed front panel keys (input) have been assigned
ID's which allow them to be incorporated into an I/O program (Table 5.6,#64-71).

SECTION 5.XX

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p STC-2000A DEPOSITION CONTROLLER y
ID Number

Valid Functions - TypeClass

Description

0 To 78 To 1516 To 2324 To 3132 To 3940 To 47
48 To 55
56 To 63
64 To 67
68 To 71
72
73
73
73
73
73
73
73
73
73
73
73
73
74
75
76
77
78
79
80
80
80
80
80
80
80
80
80
80
80
80
80
80
80
80
80
80
80
80
81
81
81
81
81
81
81
81
81
81
82
83
84

I
All
I
All
All
I
All
I
All
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I

I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
IstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateRemote Inputs 1 Through 8 (slot 1)
Relay Outputs 1 Through 8 (slot 2)
Remote Inputs 1 Through 8 (slot 3)
Relay Outputs 1 Through 8 (slot 4)
Relay Outputs 1 Through 8 (slot 1) [see ID 0-7, slot 1]
Remote Inputs 1 Through 8 (slot 2)
Relay Outputs 1 Through 8 (slot 3)
Remote Inputs 1 Through 8 (slot 4)
leftmost=64, rightmost=67 front panel LED indicators
leftmost=68, rightmost=71 fixed front panel function keys
Manual Mode [true/false]
Stopped Mode - Power Up [0]True If Not In Any Stopped Mode [1]Stopped Mode - Crystal Bad [2]Stopped Mode - Remote I/O [3]Stopped Mode – Front Panel [4]Stopped Mode – Max. Power Abort [5]Stopped Mode – Hand Controller [6]Stopped Mode – User Interface Presence Lost [7]Stopped Mode – Measurement Comm. to SS Card Lost [8]Stopped Mode – Communication to I/O Card Lost [9]Stopped Mode – Bus Hold Integrity Error [10]Stopped Mode – Rotator Time-out Failure [11, 12...19]
Film 1 Through 50 Active [# 1-50] (0 if non-sequencing mode)
Process 1 Through 9 Active [# 1-9]
Polling Current Layer Info (0-99)
Sequencer Running a Process = True / at Rest = False
True If Power = 0%. Bitmap 8 sources
True If Source Shutter Open During Deposit Phase
Phase – Power Up [0]Phase – Stopped At Zero Power [1]Phase – Begin Crystal Verify [2]Phase – Rise 1 [3]Phase – Soak 1 [4]Phase – Rise 2 [5]Phase – Soak 2 [6]Phase – Soak Hold [7]Phase – Shutter Delay [8]Phase – Deposit [9]Phase – Rate Ramp [10]Phase – Deposit After Rate Ramp [11]Phase – Time/Power Recovery Phase [12]Phase – Idle Ramp [13]Phase – Idle Power After Successful Deposit [14]Phase – Idle From Time-Power Mode [15]Phase – Manual Control [16]Phase – Ready After Stop – Waiting For Start [17]Phase – Indexing To Pocket [18]Phase – Hold Film Before Rise/Soak [19]XTAL Shutter State- All Sensor Shutters Closed [0]
XTAL Shutter State- Sensor #1 = Shutter Open [1]XTAL Shutter State- Sensor #2 = Shutter Open [2]
N.A.
N.A.
N.A.
N.A.
N.A.
N.A.
XTAL Shutter State- All Sensor Shutters Open [255]
SRC Being Modified or Designated as Active
Xtal Used Map- Sensors Making Active Contribution
Xtal Standby Map- Sensors In Standby Mode

SECTION 5.XX

-

B
B
B
B
B
B
B
B
B
B
B
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
B
M
M
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
M
M
M
M
M
M
M
M
M
M
M
M
M

page 162 of 292

Function Index

I
O
T
A
D
S
C

INPUT
OUTPUT
TRIP
ARM
DROP
SET
CLEAR

Type Values
B
V

BooleanScalarM Bitmap(combined bit
weights)

E

Event

85
86
86
86
87
88
88
88
88
88
88
88
88
88
88
88
89
90
91
92
92
92
92
92
92
93
93
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
111
111
111
111
111
111
111
111
111
112
113
114
115
115
115
115
115
115

SECTION 5.XX

I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I

-

M
V
V
V
M
M
M
M
M
M
M
M
M
M
M
M
B
B
B
V
V
V
V
V
V
V
V
V
B
B
B
B
M
V
B
V
M
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V

IstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateXtal Failed Map- Failed Sensors
Sample / Hold Status- No cycle Activity, State Not Important [0]Sample / Hold Status- Sampling, Xtal is Read for Control [1]Sample / Hold Status- Holding, Xtal Covered, estimated Rate [2]Crystal Life Over Bounds
Max. Power Condition- SRC @ Max Power = True, Else False
Max. Power Condition- No Sources @ Max Power Limit [0]Max. Power Condition- Source #1 @ Max Power Limit [1]Max. Power Condition- Source #2 @ Max Power Limit [2]
N.A.
N.A.
N.A.
N.A.
N.A.
N.A.
Max. Power Condition- All Sources @ Max Power Limit [255]
Increment Key - Hand Controller
Decrement Key - Hand Controller
Stop Key – Hand Controller(sequencing mode only)
Process Verify Phase [0](sequencing mode only)
Process Stopped, Number Displayed [1](sequencing mode only)
Process Resting [2](sequencing mode only)
Process Busy [3](sequencing mode only)
Process Waiting [4](sequencing mode only)
Process Error [5]Process Not Failed [0]Bad Recipe [1]Process Aborted [2]True if front panel is communicatingtrue when Sensor card failure occurs
T=front panel PCB (UIFC) not communicating (w/o STOP key)
True = Crystal Test / Simulate Mode ActivatedRotator Sync Map- Synchronization needed, 1 per each Source
Active Source Being Controlled [1 To 2]
True = Non-Sequencing Mode Active
Active Map of Source Sensor usage
Available Modules (in bit map pairs)
Source 1: Pocket Code [0-63] (in Film Program)
Source 2: Pocket Code [0-63] (in Film Program)
N.A.
N.A.
N.A.
N.A.
N.A.
N.A.
I/O Slot 1: PCB Status: Not Established Yet [0]I/O Slot 1: PCB Status: Not Detected, Config = Empty [1]
I/O Slot 1: PCB Status: Disabled Input Card in Slot [2]I/O Slot 1: PCB Status: Disabled Output Card in Slot [3]I/O Slot 1: PCB Status: Input Card Detected in Slot [4]I/O Slot 1: PCB Status: Output Card Detected in Slot [5]I/O Slot 1: PCB Status: MIA, Config'd Input on Empty Slot [6]1
I/O Slot 1: PCB Status: Conflict, have output, need input card [7]
I/O Slot 1: PCB Status: MIA, Config'd Output on Empty Slot [8]I/O Slot 1: PCB Status: Conflict, have input, need output card [9]I/O Slot 2: PCB Status (see Slot 1 breakout)
I/O Slot 3: PCB Status (see Slot 1 breakout)
I/O Slot 4: PCB Status (see Slot 1 breakout)
Sensor Slot A Status: Unknown (until PCB is polled) [0]Sensor Slot A Status: PCB Located by Communication [1]Sensor Slot A Status: PCB Not Located by Communication [2]Sensor Slot A Status: PCB exists but incorrect Configuration [3]Sensor Slot A Status: No PCB but correct Configuration [4]Sensor Slot A Status: PCB has Incompatible Software Rev [5]page 163 of 292

ID number | Valid Functions – Type | Class | Description

p STC-2000A DEPOSITION CONTROLLER y

115
116
117
118
119
119
119
119
119
119
119
120
121
122
123
124
125
126
127
127
127
127
127
127
127
128
129-149
150
151
152
153
153
153
153
153
153
153
153
153
153
153
154
155
156
157
158-169
170-199
200
201
202
203
204
205
206
207
208
209
210
211
212
213
214
215
216

SECTION 5.XX

I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I

-

V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
M
M
M
M
M
M
M
B

IstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstateIstate

IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO
IO

-

B
B
B
M
M
M
M
M
M
M
M
M
M
M
B
B
V
V

UstateUstateUstateUstateUstateUstateUstateUstateUstateUstateUstateUstateUstateUstateUstateUstateUstateUstateITIT
IT / All
IT / All
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT

Event
Event
Evnt/Stat
Evnt/Stat
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event

Sensor Slot A Status: PCB that was initially OK, now fails [6]
N.A.
N.A.
N.A.
Source Channel 1 Sensor Head Status: Off, Not Needed [0]Source Channel 1 Sensor Head Status: Active, Contributing [1]Source Channel 1 Sensor Head Status: Dropped, OK Failed [2]Source Channel 1 Sensor Head Status: Failed, no replacem't [3]Source Channel 1 Sensor Head Status: Missing, Config Err [4]Source Channel 1 Sensor Head Status: Standby, backup list [5]Source Channel 1 Sensor Head Status: Switched, fail to bak [6]Source Channel 2 Sensor Head Status: (see Channel 1)
N.A.
N.A.
N.A.
N.A.
N.A.
N.A.
Verify Memory: Invalid Section: Film Parameters Area [1]Verify Memory: Invalid Section: I/O Programming Area [2]Verify Memory: Invalid Section: Process Accounting Area [4]Verify Memory: Invalid Section: Process Sequence Area [8]Verify Memory: Invalid Section: Archive fail (to Mem Mod) [16]Verify Memory: Invalid Section: Clone fail (to Dep Contrlr) [32]Verify Memory: Invalid Section: Clone OK [64]Needs Reboot or Service, fatal error
Available
Resets / Sets Soak Hold Mode
Sample Off / On When In Sample/Hold Mode
Film Hold Off / On (requires event trig leave)
Set Deposition Power to 'Zero' (Unconditional) [Off = 0, On = 1]
No Sources Overridden, Source is at System Power [0]Source #1 Overridden to Zero Power [1]Source #2 Overridden to Zero Power [2]
N.A.
N.A.
N.A.
N.A.
N.A.
N.A.
All Sources Overridden To Zero Power [255]
Measured rate not = desired Rate. (>=), set true when Rate > desired, user clr
Check if Zeroing is allowed on entering deposit (T = Skip)
I/O scalar analog out (0-255) times multiplier changes output
Launch Film number ___Available
Computer Events 00 To 29
Stop
Non-Seq Mode = Proc Start Event Req./ Seq Mode = Soft Node
Non-Seq Mode = Generic I/O Start / Seq Mode = Soft Node
Switch to Process 1 and Start it [non-seq mode = to Film]
Switch to Process 2 and Start it [non-seq mode = to Film]
Switch to Process 3 and Start it [non-seq mode = to Film]
Switch to Process 4 and Start it [non-seq mode = to Film]
Switch to Process 5 and Start it [non-seq mode = to Film]
Switch to Process 6 and Start it [non-seq mode = to Film]
Switch to Process 7 and Start it [non-seq mode = to Film]
Switch to Process 8 and Start it [non-seq mode = to Film]
Switch to Process 9 and Start it [non-seq mode = to Film]
Break Process Wait
Restart Film
Start Next Layer
Process Reset / Start
Seq Mode: Unconditional Process Start by I/O or Host Comp.

page 164 of 292

ID number | Valid Functions – Type | Class | Description

p STC-2000A DEPOSITION CONTROLLER yp STC-2000A DEPOSITION CONTROLLER y
217
218
219
220
221
222
223
224
225
226
227
228
229
230
231
232
233
234
235
236
237
238
239
240
241
242
243
244
245
246
247
248
249
250
251
252
253
254
255
256
257
258
259
260
261
262
263
264
265
266
267
268
269
270
271
272
273
274
275-299
300 - 399
400 To 409

IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT
IT

Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event
Event

All
ISCAD

State
Counter

Final Thickness Trigger (from measurement or external)
Rate measurement system (from crystal onward) failed
Zero Thickness Event Requested / Performed
Setpoint Time Triggered Condition
Setpoint Thickness Triggered Condition
Set Manual Mode Off
Set Manual Mode On
Metronome Timer Event in Seconds (Once Per Second Event)Metronome Timer Event in Minutes (Once Per Minute Event)Metronome Timer Event in Hours (Once Per Hour Event)
Begin Job/Process Event
Begin Job/Film Event
Begin Job/Deposit Event
End Of Job/Deposit Event
End Of Job/Film Event
End Of Job/Process Event
Rate Ramp Trigger (Rate Ramp Starts if Enabled)Gun 1: pocket goodGun 2: pocket good
N.A.
N.A.
N.A.
N.A.
N.A.
N.A.
Release Film Hold Event
Release Soak Hold Event
Trigger Request To Rescan Sensor Map Matrix
Channel 1: Thickness Zero
Channel 2: Thickness Zero
N.A.
N.A.
N.A.
N.A.
N.A.
N.A.
Gun 1: Reset Output Power (only works on non-active sources)
Gun 2: Reset Output Power (only works on non-active sources)
N.A.
N.A.
N.A.
N.A.
N.A.
N.A.
Channel 1: User Fource Fails Sensor Channel
Channel 2: User Fource Fails Sensor Channel
N.A.
N.A.
N.A.
N.A.
N.A.
N.A.
(event 154 function duplicate)
Measurement at Rate for 4 Seconds
I/O Auxiliary Stop 1
I/O Auxiliary Stop 2
I/O Auxiliary Stop 3
I/O Auxiliary Stop 4
Start Coupling (for non-sequencing film starts linkage)
Availablest
1 Soft Node To Last Soft NodeModulo 100 Counters [10 counters]

Table 5.4: Event And State ID List. […continued from previous 3 pages]

SECTION 5.XX

page 165 of 292

Function Index

I
O
T
A
D
S
C

INPUT
OUTPUT
TRIP
ARM
DROP
SET
CLEAR

Type Values
B
V

BooleanScalarM Bitmap(combined bit
weights)E

Event

p STC-2000A DEPOSITION CONTROLLER y

SECTION 5.4

Steady State vs. Edges

In order to fully understand how an I/O program works, we need to look at Edge type events.
There is an additional complication using Boolean operators. We need to differentiate not only when avariable is True or False (the steady state condition), but when and if it changes state. Think of what is
involved in zeroing the thickness, for example. When you press the ZERO key, the thickness is actually
zeroed when the key was first detected as being pushed, once only, not continuously.

Edge Events
It is because of this transitioning between States (or Edge Event) that the zeroing happens. It is
important to understand Edge type events in the STC-2000A. If you look at Table 5.4, events that must be
triggered using an edge are numbers 170 through 273. If you try to use a non-edge output operator onthese events, you will get an error message.

SECTION 5.5

Input Functions

Input Functions are used to test the condition or state of something. An Input Function is not limited toonly remote hardware inputs. You are free to use an Input Function on a relay or any other variable. In
this case, you may want to test the condition of something that was set.

Input
Input (I) is the only type of input function. After the prefix I, you will be asked to specify avariable ID number to be used. As an example, if you see I3 in the I/O program, this means use remote
input number 4 (from Table 5.4) as an input. The input function works on steady state types of states topush to the stack the variables current value. That is, if you try to do an input function on an edge type
event
pushes True once on the first occurrence of the event (transient), you will get an error message.
Note: the KON# (constant) could also be thought of as a means to input.

SECTION 5.XX

page 166 of 292

p STC-2000A DEPOSITION CONTROLLER y

SECTION 5.6

Output Functions

There are several ways to evaluate the result of a rung in the STC-2000A. A rung must have 1 andonly 1 output function. Some Output Functions are for use with edges and others are for use with steadystates.
There are several ways of describing edges in the I/O program of the STC-2000A. The Trip
function is used exclusively to force events in the STC-2000A. Arm and Drop are the other two output
functions that operate when triggered by edges, and operate on I/O outputs, softnodes and counters.

OutputThe Output function (O) is used as a steady state output. It will take the evaluated state of therung and use the value as an output. It is common to use the output function for relays and softnodes. Not
available for events, counters, hardware inputs.

Trip
The Trip Function (T) can be used for providing a pulse to an output, either of a relay or softnode.
It is triggered by a positive Edge transition (something that goes from false to true). The output will staytrue for about 1 second, then go back to the false state. This is sometimes known as a 1-shot function. In
addition, all of the events of the STC-2000A can only be triggered using this function. This is indicated inTable 5.4, by having a 'T' in the valid function column.

Arm And Drop
There are two other functions that operate by triggering on edge transitions. These are called arm
and drop (A and D). The identified output will become true when there is a positive edge on the arm
input. The output will remain true until something else makes it false. The drop function is the opposite ofarm. The output will become false on the positive edge of the drop input. These are different from the trip
function because the arm causes the output to go high and stay there. It takes a drop function to cause theoutput to go back low. The arm and drop functions are to be used together. If you use arm on an output,
somewhere in the I/O program you must use a drop or clear on that output, unless the relay or output
activates and latches.

Set And Clear
There are 2 functions that may look like edge events, but they are level triggers. They are called
set and clear (S and C). A true condition on the set of an output will cause the output to become true andstay that way even when the input condition later becomes false. This is known as a latching function.
The clear input will cause the output to become false when the clear becomes true. The clear function is
the opposite of the set function. (The set/clear and the arm/drop can be mixed and matched, i.e. set/drop or
arm/clear)
Note Remember that only a trip function can cause a trigger to an internal
event of the STC-2000A. If you try to program any other output to events, you will get anerror message.
Note

SECTION 5.7

Soft Nodes and Sync EventsSoft nodes in the STC-2000A are a special type of I/O variable. Their ID numbers are 300
through 399. They can act as temporary storage areas for intermediate results. If you develop complex I/Orungs, you can use these soft nodes to break these up into several simpler rungs. Devices such as countersand shift registers can be implemented using soft nodes.

SECTION 5.XX

page 167 of 292

p STC-2000A DEPOSITION CONTROLLER yAnother usage is to re-program some of your relays quickly. Just use the soft nodes asintermediate outputs of your rungs. Then you can have a simple rung that Inputs a Soft Node and Outputs
it to a relay. There is an example later in this section of doing this.

Synchronize Events
There are 30 events (ID#s 170 to 199) that have a special use with the computer interface. They
can be set with commands through the computer. In this manner, you can synchronize events in the STC2000A with an external computer via an active I/O program.

Internal Operations

SECTION 5.8

The way the STC-2000A interprets an I/O program is useful to know, especially when writing
complicated programs. The way variables and functions are evaluated is by using
what is called a stack. By using this method, parentheses are not needed to specify
Stack Operation
order and use of operations. Each item that is entered into your program will either
push something on the stack, pop it off, or modify the stack contents. The variables
are evaluated to be either true or false (or a scalar value if of M or V types) and that value is used. Let us
look at the following rung and see how the stack works. Refer to Table 5.4, for what the ID numbers referto.

I0 I1 ! ¦ O8
Scanning Tokens
The way this is read is: do an input function on ID #0 (remote input #1), do an input function on
ID #1 (remote input #2), complement what is on the top of the stack (the state of remote input #2 in thiscase), do an 'OR' operation, and output the result to ID #8 (relay #1).
Assume That The Variables I0 And I1 Are Both False. As the rung gets evaluated, the stack
will look like this.

I1

I0

¦

!

O8

F

F

T

T

-

-

F

F

-

-

a

b

c

d

e

Figure- 5.2: Stack I/O Operations.
The lines indicate the movement of the stack. A downward slope of the lines in Figure 5.2
indicates a push operation and an upward slope indicates a pop. Notice that when the rung is completely
evaluated, the stack is empty (Figure 5.2e). The stack in this example has a depth of only 2 objects, but the
STC-2000A has a much larger stack. Because you cannot enter a rung longer than a line on the display, it
is not possible to exceed the depth of the stack.
Each token within the rung is scanned, and each rung is scanned. All of the rungs are scanned 10
times per second. An input function causes the evaluated variable to be pushed on the stack. An output
function will cause the stack to be popped. The value that is taken off of the stack is used as the output.
The 'AND', 'OR' operators will pop 2 values off of the stack, do the operation, then push the result back on
the stack. The 'NOT' operator will pop 1 value off of the stack, reverse the state of it, then push it back on.
Likewise, all the other arithmetic, relational and selection operators perform similarly (see chart). The stackis always empty when the STC-2000A starts to evaluate a rung, and must be empty when it finishes

SECTION 5.XX

page 168 of 292

p STC-2000A DEPOSITION CONTROLLER yevaluating a rung. These stack rules are checked when the editing of a rung is completed. If the stack
operations are not balanced when this happens, the STC-2000A will issue an error message.

SECTION 5.9

Operate Menu

There are 2 options under the Operate Menu. These are used to suspend/resume the operation of
the I/O program. The use of turning off the operation of the I/O program is in case something goes
wrong. You can shut off the program while editing changes so relays are not turning on and off before theprogram is completely entered.

Stopping The I/O Program
Use caution when causing the I/O program to stop running. This should be a temporary condition
used for entering or modifying your program only. If someone else does not know the I/O program is
stopped and tries to run the instrument, the results can be serious. See figure 5.3 and OPR key definition insection 5.11.

SECTION 5.10

Memory Menu

Saving Your Program.
This provides you with the ability to save and recall your I/O program. If
you want to try something new with the I/O system, it is a good idea to save what
(See section 2.21 foryou have running before making major changes to the program. The Save option
checksum validation).
will take the entire I/O program and store it in an alternative memory sector. The(See section 2.6 forSwap option will put the active I/O program into inactive status, and take what wasFactory settings...)(See section 3 forin inactive memory and make it active. Both programs (one in alternate memory
memory module.)
and one in active memory) are remembered when power is off. The I/O program
check sum (prefixed with the label ID=) also reflects which memory section is in
use by it's first character: A or B memory.
In addition to saving your program in memory, be sure to record it on a piece of paper also. If aunit ever needs to be replaced, you will have to reprogram its I/O for your system requirements. See figure5.10 and MEM key definition in section 5.11.

SECTION 5.XX

page 169 of 292

p STC-2000A DEPOSITION CONTROLLER y

SECTION 5.11

Editing an I/O Program

In order to get to the I/O screens, you need to navigate through the following sequence. From the
RunTime Screen, press the fixed MENU key. When the MAIN MENU appears, press the EXECUTIVEMENU key and then press the I/O SETUP key and the unit will display the following screen. Rungs (I/O
SETUP Program lines) can range from 001 (END statement only) to 999 (memory constraints aside). 001
and 1 refer to the same rung, etc.
central area
alwayscontains theline (rung)that can beedited. Thisis the EDIT
line. The
down arrows
point toii

I/O Program
Checksum

Figure- 16.10: I/O SETUP MAIN Menu (or 1st I/O SETUP Menu).

scrolling
line
numbersnd

The 2 of 3 lines
displayed is the line
to be edited(indicated by -↓↓immediately over theline to be edited)

Top Level I/O Menu:
See Fig. 5.3. Typical
I/O Program: (with line #002 in the edit position)
See Fig. 5.4.

Figure- 17.11: EDT (edit) menu with typical I/O Program values.

Figure 5.3 is the top level of the I/O menu. Figure 5.5 shows the structure of the various menus.
By pressing the fixed STATUS key while in this set of menus, you will be taken back to the RunTime
screen. The BAK key navigates back up one level and cancels unfinished EDTs (edits). The BYE key
returns to the Executive MENU.

SECTION 5.XX

page 170 of 292

p STC-2000A DEPOSITION CONTROLLER y
A fictitious representative section of the real I/O Programming menu tree on the following page ispresented here as an example. This menu segment is a pseudo composite representation of the first andsecond in a series of 5 menus accessed through the EDIT/CHanGe path of the I/O SETUP menu. The
representation is meant to be like a flowchart. The longest horizontal line is the second screen level fromwhich all selections can be made. The dotted line on the right shows the entry point from the previous
screen (screens can only be traversed in one direction). The double ended arrows are meant to illustrate thatpressing the related key does not remove or modify the current screen (focus remains on the current
screen). Keys UNDO, AND, OR, XOR, DEL are examples of this. BAK returns to the CHanGe Key entry
point from any of the 5 change/edit screens. MORe x/5 invokes the next screen in the 5 screen sequence.
At the 5th screen, MORe 5/5 returns to the 1st of 5 screens.
Note: an unprogrammed unit will have only 1 line showing with the "END" line in theedit window, therefore ↑, ↓, GOTO have only one location to which they can move,that is list item #1. DEL (delete) is similar as the END line cannot be deleted. You
must insert lines to have other line locations. INS (insert) lines or CHG (change) the
END line. See figure 5.3 as an example of an unprogrammed unit.

Note

Fictitious commands ~ABC and ~XYZ have an associated number that must be entered before thetoken is entered on the I/O program line (rung). The completed command entry would be something like"~ABC 121". The ~ABC command flows into the box representing the number entry screen. From thenumber entry screen, BAK will bring back the second screen level throwing out the entire command while
ENTer will accept the command and its associated number and place them on the edited line which is at thesecond screen level. The BAK on the second screen level, returns to the menu point where the decision to
Edit/Change was made (one menu level up from the 5 Edit/Change menus).
BAK
UNDO

(automatic transition to)
Command number entry MENUSECTION 5.XX

BAK

~ABC

AND

~XYZ
XOR

page 171 of 292

DEL

OR

MORe 2/5

p STC-2000A DEPOSITION CONTROLLER y

Programming Tree

GOTO,
UP↑, DN↓(scroll)

BYE(back to Executive MENU)STATUS[fixed front panel key]

I/O SETUP
MENU(back to RunTime screen)

if on, password needed
beyond this point.

OPR (operations

EDiT
(menu
key
labelschange,edit
line in
EDIT
window)menu):

INS(inserts
line
afterline in
EDIT
window)

RUN / STP
(STOP), BAK

BAK

DEL
(deletesline in
EDIT
window)

GOTO,
UP↑, DN↓(scroll)

MEMory(menu
keylabelschange)SWaP
SAVe← movecursorIN

KON#

CHG (Change)
Menu: change
edit line

BAK→ movecursor(automatic transition to)
Command number entry MENU

UNDO
(last
edit
line
item)

BAKSP

BAK

MORe 1/5

DEL

BAK
AND

UNDO

OR

BAK

POS

NEG

XOR

MORe 2/5

BAK

ADD

SUB

MUL

DIV

MOD

UNDO

MORe 3/5

BAK

EQU

NOT

GRT

LES

SEL

UNDO

MORe 4/5

TRiP

SET

ARM

DRoP

CLR

OUT

ENT: edit
line
accepted(edit
line
advances)(automatic transition to)
Command number entry MENU

MORe 5/5

BAK
BAK

Figure- 5.5: I/O Programming Tree.

SECTION 5.XX

page 172 of 292

denotes rungtoken# ENTer

p STC-2000A DEPOSITION CONTROLLER y
General Descriptions of I/O MENUs
GOTO:

Press GOTO to move to a specified line (rung) in the I/O program setup list. This gives
the capability of jumping to a rung if the rung (line) number is known. This is usefulwhen the I/O program is complicated and there is a need to jump around in it rapidly.
When a rung number is entered that exceeds the last existent rung, the GOTO function
will move to the last available rung position (zero moves to 001). Having entered theGOTO function, the BAK key may alternately be pressed, instead of entering a line
number. This will terminate the GOTO without effect. GOTO appears on the I/O Setup
main menu (Fig. 5.3) and on the I/O Setup Edit menu (Fig. 5.4). Pressing the GOTO key
on the main I/O menu (See Fig. 5.3) results in the following screen.

GOTO MENU
To construct entry of"123", Press 100 key once,
10 key twice and 1 key
three times.

(UP)↑:(DOWN)↓:

MENU:
BYE:

SECTION 5.XX

Pressing GOTO changes the key labels (as shown) to reflect a new level of functionality,that is, to enter a number that will be the object of the search and locate process. This
number entry menu has provision to enter numbers in the range of 0-999. Numbers areentered by pressing any one or all of the three digit keys, which represent the total
number. The hundreds digit (100 key) is on the left, the tens digit (10 key) is in the
middle and the units digit (1 key) is on the right. Each digit is incremented from zerowith each key press. When nine is indicated, the subsequent key press will cause that
digit alone to revert to a zero. Digits are independent of each other (no carryover). A key
press of a digit effects only the digit pressed. After the desired number is completely
entered, the ENT key may be pressed to accept the entry.
Navigates up the rung list. The displayed section of the rung list moves toward the
beginning of the rung list. (UP)↑ appears on the I/O Setup main menu (Fig. 5.3) and on
the I/O Setup Edit menu (Fig. 5.4).
Navigates down the rung list. The displayed section of the rung list moves toward the endof the rung list. (DOWN)↓ appears on the I/O Setup main menu (Fig. 5.3) and on the I/O
Setup Edit menu (Fig. 5.4).
Press fixed MENU key to enter the menu system. When the fixed STATUS key ispressed from any place in the menus, the RunTime screen is returned.
Returns to the Executive Menu or one level back. See Fig. 5.3.

page 173 of 292

p STC-2000A DEPOSITION CONTROLLER y
MEM:This allows you to save and exchange (swap) the I/O program that is in memory. A submenu selects among 3 choices: SWP (SWAP), SAV (SAVE), and BAK (BACK 1 level).
Pressing the MEM (memory) key on the main menu (See Fig. 5.3) results in thefollowing screen. See section 5.10.

MEM (memory)
MENU

OPR:

This key (OPeRations) will start and stop the I/O program by means of a sub-menu
selection. Note: display changes to RUNNING when the RUN key is pressed and
STOPPED when the STP (stop) key is pressed. There are times when the OPR function islocked out during the I/O setup. Pressing the OPR (operations) key on the main I/O menu
(Fig. 5.10) results in the following.

OPR(operations)MENU

See section 5.9.
EDT:

The EDT (edit) key is used to insert rungs, delete rungs and go on to enter or change
tokens/operators within a rung. This is the key that initiates the EDIT mode. The Edit
sub-menu offers: arrow cursors, GOTO, CHG (change), INS (insert line), DEL (deleteline) and BAK. Pressing the EDT (edit) key on the I/O Setup main menu (See Fig. 5.3)
results in the appearance of the I/O Setup Edit menu (see Fig. 5.4).

At this point, there are 3 selection keys available (navigation aside): one for an editing sub-menu (EDT),
another for an I/O program related memory option sub-menu (MEM), and a third for the operations control
sub-menu (OPR). (See Fig. 5.3 and screen immediately below)
Also at this point, the display will contain an EDIT(view) window into the I/O program. Specifically, threeconsecutive rungs of the I/O program are displayed with the middle rung as the EDIT line (see figures 5.3
and screen immediately below). Each line of the I/O program is called a rung. Rung 004 is in the line edit
position with contents of "I81 #2 & O10" indicated by -↓↓-. Rungs 003 and 005 are now view only. By
pressing the UP↑ and DOWN↓ arrow keys on the LCD touch Panel, you can move through the I/O
program rung list bringing different rungs into view with middle line ready to edit. GOTO also navigatesby going directly to the entered rung number, making it the current rung in the EDIT window. BYE returns
to the EXECUTIVE MENU. The fixed STATUS key returns to the RunTime screen.

I/O MAIN
MENU

Edit line#[004: -↓↓-]
Edit rung[I81 #2 & O10]SECTION 5.XX

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SECTION 5.12

I/O SETUP Edit Menu

Pressing the EDT (edit) key produces the I/O Setup Edit menu as seen in
figure 5.4. At this menu level, there are 3 edit options (navigation aside): CHG (change line currently in the
2nd [editing position] of the displayed rung list section), INS (insert a new [empty rung] line before the linein the editing [2nd ] position of the displayed rung list section), and DEL (delete line currently in the 2nd,editing position of displayed rung list section).
DEL
This key deletes the rung (line) that currently appears in the EDIT position (centered rungwith -↓↓- above it, see figure 5.3 or 5.4). The END rung cannot be deleted. The next
consecutive rung assumes the place and line number of the rung (line) now vacated by
the deletion. All subsequent rungs (lines), if any, are also moved up with the line number
values decremented by 1.
INS
This key inserts an empty rung (line) into the I/O setup program list with each key press.
The new rung (line) is inserted just ahead of the rung (line) that is in the current edit
position (see figure 5.4). The new rung assumes the EDIT position while previous EDIT
position contents are advanced by one: in screen position, line number value and I/O list
position.
In other words, the INS key inserts an empty rung just before the rung in the current
EDIT position. After pressing the INS key, the new empty rung will occupy the EDIT
position (2nd line) while the former rung is moved to the bottom (3rd) line with the line
number incremented by 1. After a rung is inserted, use the CHG (change) key to alter theempty rung contents.
BAK:
Quits the I/O SETUP Edit menu and returns to the I/O Setup main menu.
CHG:
Can be used to modify (change) the contents of the rung (line) currently in the edit
position (2nd line of displayed rung list section). Used for entering or changing functioncommands/operators within the rung. The CHG (Edit/Change) mode is the mode inwhich you will write your programs. You can construct rungs by adding/subtracting
tokens (see table 5.1). The CHG (Change) key sub-menus are discussed in the next
section (section 5.13).
line# of 1st
displayedrung1st
displayed
rungline# of 3rd
displayedrung
3rd rung (token string)

Rung 009 is in the position that selects it for editing.
Dashed box includes edit line# and rung line in edit
position (2nd of 3 displayed list items).

EDT (edit) MENU

The format of each rung as it appears in the edit/view window is as follows:
Rung (Line) # :Token string of Rung
The format for the middle rung, which is the edit/change position, has the same format except for dashes
and down arrows:

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Rung (Line) # : -↓↓Token string of Rung
Note If an incorrect token string is entered on a rung, an error message will
result when the rung ENT (enter) key is pressed. See section 5.19 for error message
description.

Note

Edit/Change Menu

SECTION 5.13

Pressing the CHG (change) key on the I/O Setup Edit menu opens the I/O Setup Edit/Change menu as
shown below. The CHG (change) key begins the sequence of menu keys by which the program is actuallyentered. Figure 5.5 shows the options under this menu key.
EDT/CHG(edit/change)
MENU.
1st menu group of
5 menu groups

There are 5 sets of menu keys for the I/O Setup Edit/Change menu. They can be navigatedand always appear in the same order by pressing the MORe key.
The rung that was in the edit position on the displayed rung list, is now shown by itself on the
I/O Setup Edit/Change menu screen. In the depiction below, the rung is in the process of being changed
from an END rung to a typical control rung. Three tokens have been added. The cursor position now
follows the I47 entry. This is the 1st of 5 key menus navigated by the MORe key.
←:

→:
ENT:

The rung line that is being edited (following PROPOSED:) has a cursor, which is represented
by an underscore "_". The cursor indicates the point at which entries will be inserted or
removed. Normally, this will be at the end of a new construction and at the beginning of apreviously constructed rung that is being edited. The ← key moves the line cursor to the left
within the range of the existing elements (tokens) on a single rung. Works like the cursor of atext editor using arrow keys.
As the ← , but moves the line cursor to the right.
There are two menu levels within the I/O Setup Edit/Change menu that use an ENT (enter)key. On one level, this key accepts all of the current rung edit[s] into the I/O program. On
another level, the ENT (enter) key accepts the ID# of the command/ID# combination (each of
the function commands entered has an associated ID number that forms a token). A rung isoften built with multiple entries during an Edit/Change where function command/ID#
combinations and logical operators form the constituent parts of a rung. A single press of the
ENT key at the end of a string of edit/change additions will accept all of the rung edits. Of
course, the ENT key must also be pressed after each function command element combinationis added to the rung. The different menus and context should eliminate any confusion.

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press
ENT
here
to
accept#2

pressing
ENT here
accepts
the rung
thoughit's notcomplete

The "rung" ENT
key is used toaccept all edits
made to the rungbeing
edited/changed.

pressing
ENT here
acceptsthefinished
rung

UNDO:
DEL:

Cancels in reverse order insertions and deletions up to 6 changes.
This editing command will erase the item that the erase/insert cursor is on. The UNDO key
will restore something that was just erased. Specifically, DEL deletes the token that is above
the line cursor. Can be used repeatedly to clear a whole rung (line) when the cursor is under
the first token. This action is possible because the space left by the deleted token is
automatically filled by a token moving in from the right portion of the line. All tokens to theright of a deleted token move 1 place to the left.
BAKSP: Deletes the token to the left of the line cursor position. Can be used repeatedly to clear awhole rung (line) when the line cursor is beyond the rightmost token. All tokens to the rightof a deleted token move 1 place to the left to fill the void.
BAK:
Quits the I/O SETUP Edit/Change menu without saving EDITs that were not accepted (saved)by pressing the rung ENT key. Returns to the I/O Setup Edit menu (see fig. 5.4). This key
has both navigational and editorial consequences (see second definition for this same key
below).
The menu keys just described are the keys used to edit, quit or accept the PROPOSED rung. These are
distributed among 5 key type menus all within the scope of the I/O Setup Edit/Change menu.
Navigation within the I/O Setup Edit/Change menu:
MOR:
The MORe key changes the menu key selection groups in ascending sequence from firstthrough to the fifth group of token, navigation and edit keys whereupon the sequence isrepeated as the fifth group is followed by the first group. The 1/5 indicates group 1 of 5, etc.
BAK:
Return 1 menu level back. In this case, returns to the I/O Setup Edit menu. The only way toleave Edit/Change (except for the fixed STATUS key).

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The 5 key type menus are shown immediately below.
EDT/CHGor simply
CHG (change)
MENUs

1st of 5
Edit/Changemenu types

2nd of 5
Edit/Changemenu types

3rd of 5
Edit/Changemenu types

4th of 5
Edit/Changemenu types

5th of 5
Edit/Changemenu types

Token keys (logical operators, command function/ID# combinations)
IN:

OUT:

Used to input a variable. This can be used on any of the states. The current state of thevariable will be pushed on the stack when the term is processed or scanned. When inputing
from scalar (as in softnode use) the stack result is scalar. When inputing from Boolean or
event, the result on the stack is Boolean.
Used to output to an output or user definable soft node. If an Out is specified to a read only
state (an Input for example), an error message will appear on the display. The term being
scanned causes the top of the stack to be popped and sent to the output. When going to scalar(as in softnode use) the stack value result is scalar. When going from scalar to Boolean the
result on the stack is interpreted as Boolean (i.e. 0 = False, non-zero = True).

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AND:

OR:

XOR:

NOT:

POS:

NEG:

This is the AND operator. It will take the top 2 variables from the stack, perform an AND
operation, and push the single result back on the stack. This is a bitwise entity and the stack
result is a scalar.
This is the OR operator. It will take the top 2 variables from the stack, perform an OR
operation, and push the single result back on the stack. This is a bitwise entity and the stack
result is a scalar.
This is the XOR operator. It will take the top 2 variables from the stack, perform an XOR
operation, and push the single result back on the stack. This is a bitwise entity and the stack
result is a scalar.
This is the NOT (or complement) operator. It will take the top variable from the stack,perform a NOT operation, and return it to the top of the stack. This is a logical (Boolean)entity, that is, if the current top of stack is zero, it is replaced with a 1, otherwise, it is replacedwith a zero.
A pos function is mainly used for sensing events, and it becomes true only during a positiveedge of the sensed variable. This can be a scalar entity but is assessed as a Boolean (zero vsnon-zero number) and the stack result is a Boolean.
A neg function is the opposite of pos, and it becomes true only during a negative edge of thesensed variable. This can be a scalar entity but is assessed as a Boolean (zero vs non-zero
number) and the stack result is a Boolean.

I/O Functions
SET:

CLR:

ARM:
DRP:
TRP:

A set can be performed on an output or a soft node (numbers 300 through 399). It willcontinue to force the variable to an on state as long as the set condition remains on. When theset goes back off, the output will remain set (or on) until an overriding clear or drop is
encountered.
A clear is the opposite of set, it will continue to force the variable to an off state as long as theclear condition remains on. NOTE: if during a pass both set and clear are true at the sametime, the last one in the rung order prevails.
An arm condition is similar to a set. The difference is that for an arm, the variable is forced toan on state only during the positive edge of the arm condition.
A drop condition is similar to a clear. The difference is that for a drop, the variable is forced
to an off state only during the positive edge of the drop condition.
TRP (trip) is an edge driven output function. The output will become true for one second
after the trip goes from false to true (a positive edge). These are used to trigger internal
events of the STC-2000A, change internal status, or cause 1 second delay pulses.

Arithmetic/Logical Functions
ADD:
SUB:
MUL:
DIV:
MOD:
EQU:
GRT:

Arithmetic addition as in I5 + I6 (I5 I6 +) will add input 5 to input 6. Positionality is notimportant for this commutative function.
Arithmetic subtraction as in I5 - I6 (I5 I6 -) will subtract input 6 from input 5. Positionality isimportant for this function.
Arithmetic multiplication, as in I5 = I6 (I5 I6 =), will multiply input 6 by input 5.
Positionality is not important for this function.
Arithmetic division as in I5 / I6 (I5 I6 /) will divide input 5 by input 6. Positionality isimportant for this function.
Arithmetic modulus function as in I5 % I6 (I5 I6 %) will divide input 5 by input 6 andgenerate the remainder only. Positionality is important for this function.
A comparison function as in I5 = I6 (I5 I6 =). This can be a scalar entity but the stack result
will be a Boolean. Positionality is not important for this function.
A comparison function as in I5 > I6 (I5 I6 >). This can be a scalar entity but the stack result
will be a Boolean. Positionality is important for this function. This will result in True if I5 >I6.

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LES:

SEL:

KON:

A comparison function as in I5 < I6 (I5 I6 <). This can be a scalar entity but the stack result
will be a Boolean. This can be a scalar entity but the stack result will be a Boolean.
Positionality is important for this function.
Selects which node of the stack that will produce the result, a multiplex function as in I5 < I6.
(Example: I5 I6 I7? [If I7 is True, I6 will result. If I7 is False, I5 is result]) Positionality isimportant for this function. I5 or I6 can be Boolean or scalar. I7 is interpreted Boolean and theresult is a scalar.
Used to input a constant value of scalar type.

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Example 1: Entering a very simple I/O program.
The following screen sequence illustrates the programming of the first I/O program introduced in Section 2
under the heading of I/O Programming Introduction. To reiterate, the I/O program is as follows:[note: the I/O cards must be enabled on the SYSTEM CONFIG menu before programming. reset unit after enabling cards]

001:
I71 T67002:
END

Navigational path is: fixed front panel MENU key, EXECUTIVE MENU key and I/O SETUP key.
The result is the first screen below. This screen depiction assumes that there is no I/O program alreadywritten in the A memory. If there is, switch to the B memory. Memory areas are selected by pressing the
SwaP key which appears after pressing the MEM key on the first screen shown below. Note that ID# starts
with either an A or B designating the memory shown. Use EDIT/DEL to delete rungs (steps) until empty.
Make sure the factory I/O program has been saved first. There will be a need for it later.

I/O program has only END line. Press EDiT key.

Result of pressing EDiT. Press INSert key*.

Result of pressing INSert. Press ChanGe key.

Result of pressing ChanGe key. Press IN key.

Result of pressing IN. Enter 71 by pressing the 10 key 7 times and 1 key once. Result is shown above.

Result of pressing ENTer key. Press MORe key.

Result of pressing MORe. Press MORe again.

Press MORe again. Note menu selection changes and numeric changes on MORe key. Press MORe again.

Press TriP key.

SECTION 5.XX

Result of pressing TriP. Enter 67: press 10 six times,

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press 1 seven times. Press ENTer key to accept.

Press ENTer to accept entire line (rung).

* Although the INSert key was used here, this step could be eliminated by pressing the CHanGe key. The END line would getchanged and a new END line would be automatically regenerated and placed at the new end position.

The result: still in edit mode, automaticallyadvanced to next line, press BAK to exit edit.

Result of pressing BAK. Press BAK again.

Result of pressing BAK. Compare this screen
to the initial screen in this sequence. It is theentry point for I/O Programming. Press ↑.

Demonstrating how up arrow ↑ has changed thefocus of the line edit function. Press BYE orthe fixed front panel STATUS key to leave.

If the second printed line on the LCD is I/O STOPPED instead of I/O RUNNING, return to the first screenin the sequence and press the OPeRations key followed by the RUN key on the subsequent menu. BAK isused to return to the first screen. This has already been discussed earlier in this section under General
Descriptions of I/O MENUs. It is included here for those who thumb through the manual looking for
pictures of what they want to accomplish instead of reading it straight through.
With the I/O program running, pressing the rightmost user programmable fixed front panel key (1 of 4)
should result in the momentary illumination of the rightmost user programmable front panel LED (1 of 4).
The program will work while in the I/O programming menus or by pressing the fixed front panel STATUS
key, work while the runtime screen is displayed.

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Example 2: Editing of a rung
Following is the result of pressing CHG with rung # 004 in the edit/change position:

Press right arrow twice to reposition the EDT/CHG line cursor:

Press the DEL (delete) key to remove the & token:

Press the UNDO key to restore the deleted & token:

Now insert a KON# in between #2 and & by pressing the KON# key with the EDT/CHG line cursor
positioned as shown. On the right side of the screen, the temporary KON appears with zero default zero
value. Press the 1 key and ENT key to accept the constant value:

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Using the BAKSP key, the newly entered #1 can be eliminated:#1 has been removed.

Next, move the cursor back to the end of the edit line (press → twice):
Using the MOR (more) key, repeatedly navigate to the mor 5/5 where the ENTER key is found. Press the
ENTER key to accept the entire rung. The rung is unchanged and this is reflected in the checksum, which isalso unchanged (A41779).
Pressing the ENT key accepts (saves) the rung and as a programming convenience, the next rung is
automatically advanced into the edit/change position. In this case, it is the 5th line. If a new program werebeing constructed, new rungs could be continuously built in this fashion from the END line. A new END
line is automatically placed as the last rung with each new conversion of the current END line.
If a rung is being edited in the middle of an existing program, the next rung will be a rung that will not bechanged (as shown immediately below).

In either case, the BAK key must be used to exit the CHG (change) menu process (the MENU and
STATUS keys can also be used).
The following is the result of pressing the BAK key (follows from above screen).

Please note that as rungs are added to, deleted from or edited in the I/O program, the number prefixed by
the label "ID=" will change. As rungs are being edited (before they are accepted by pressing the rung ENT

SECTION 5.XX

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p STC-2000A DEPOSITION CONTROLLER ykey), the ID number will remain unchanged. This number (with hex digits such as A4F656) is a check sumof the entire I/O program and can be used to uniquely identify an I/O program. This can be used as anintegrity check for this part of a system with a problem or as a means to check that entries have beencorrectly made when entering in a program, for example. When an I/O program is known to be correct,
write the ID number down in a journal of software entries / programs, having method or recipe attributes
being integral to objective. The first character of the ID# will be either an A or B, indicating in whichmemory section the program resides. Using the SWP (swap) key accessed through the MEM key reverses
this. [See section 2.21, Check Sum Validation for checksum discussion. See section 3.6, Factory Settings...
for saving programs. See section 3.20, memory module.)

SECTION 5.14

Example 2 - Power On Relay

Defining The Problem
At this point, a few examples might be helpful. This program is almost trivial, but it will
demonstrate what is needed to write an I/O program. Its job is to close relay number 8 when the STC2000A is powered up. While there are several ways to do this, we will pick the method shown in Figure
5.6.
I0
O15

I0
Figure- 5.6: Power On Relay.

Implementing The Solution
The rung to implement this function is:013:

I0 I0! ¦ O15

At a first glance, this may seem like a roundabout way of implementing the desired function. If
you look through the event and state ID list (Refer to Table 5.4, ), you will not see a state that exists forindicating that power is on. This is not a problem for us however, as we can use a logical identity to
implement the desired function.
What this program does is take remote input 1 and its complemented term, then ORs them
together. One of these terms is always false and the other always true. ORing 2 terms together with one ofthem always true will result in the output always being true. You could pick any state as an input, we justpicked input 1 arbitrarily (the I0 term). Keep in mind that this input is not "used up". We can still use it
for its default use of a remote start, we just needed an input term. The reason for using rung 13 is that thefactory installed program uses rungs 1 through 12. We want to keep our example isolated from the factory
installed I/O program so we can delete it easily later. Remember that the factory installed I/O program iswhat is shipped from the factory and defines the first four remote inputs and relays. Let's go throughprogramming this step by step.
Step 1

Get to the RunTime screen. This is the power-on default display for the STC-2000A, otherwise,press the fixed STATUS key. (See figures 2.1, 2.4)

Step 2

Get to the I/O SETUP menu. This is done by pressing the fixed MENU key, then the
EXECUTIVE Menu key and finally the I/O SETUP key. The display will look like Figure 5.3(except for the rung information). Pressing the fixed MENU key within other menus invokes theMAIN menu.

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Using The Goto Function
Step 3

Get to the rung that is to be changed. There are two ways to do this. The first is to press the ↓(down arrow) key 12 times (because we want to get to rung 13). The other way is to press the
GOTO key. This is the GOTO command. You will be prompted for the rung number that you
want as a destination. In this case, enter the number 13 by pressing the 10 key once (for the 1) andthe 1 key thrice (for the 3). Press ENT to accept the digits entered. The thirteenth line of the I/O
program will now appear in the EDIT window being the 2nd of 3 consecutive rungs from the I/O
program. Since END is the last rung, an empty line appears as the 3rd consecutive line.

(a)
Step 4

Figure- 5.7: Goto Examples.

(b)Enter the edit mode by pressing the EDIT key. Insert an empty rung. First, press INS key. This
will place an empty rung in the list position formerly occupied by the END statement. The END
statement is advanced on the list by one and its line value is changed to reflect it's new position.
The display will look like Figure 5.8 a&b. Notice the ID (checksum) change from (a) to (b).

Inserting An Empty Rung(a)
Step 5Figure- 5.8: Empty Rung Display. (b)Put the program in the rung. Press the CHG key to begin the edit/change process. The line (rung)list area on the LCD display will change. The line (rung) that occupied the edit position (in thiscase, rung#012) will appear by itself but in two manifestations. The first will be the current stateof the rung (labeled CURRENT). The second is the edit/change line that will accumulate the user
entries that will become the constituent parts forming the entire rung (labeled PROPOSED). (SeeFigure 5.9). [The rung could also have been entered by edit/chg'ing the END line as described in section 5.13, example
1.]

Figure- 5.9: Changing The Rung.

Programming The Rung
We are now ready to enter the program in. The first element to enter is I0. Pressing the IN key
tells the STC-2000A that an input function is wanted. After the IN key is pressed, you will be automatically
prompted for the ID number. A temporary token construction area appears on the upper right of the LCD
display. As the digits are zeroes by default, no digit entries are needed, press ENT (enter). The
PROPOSED: line of the display will reflect the change.

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We will do the same thing again, press the IN key again and enter an I0. The display will now look likethe 1st screen in Figure 5.10

Figure- 5.10: Entering Input Functions and Starting Output Function.

Entering The Program
We now want to complement the second I0. This is done by selecting the NOT function bypressing the NOT key (! appears). Now we want to OR these two terms together. Select OR by pressing
the OR key (¦ appears). See the 2nd screen in figure 5.10 for these two entries (the MORE key navigates).
The last function to enter is the output to which the result is sent. Because we have defined relay 8 for this,we want to enter an O15. See Table 5.4, for a list of all States and Events. Press the OUT key to selectan Output function. You will be prompted for the ID number. Enter a 15 for the ID#. Press the 10 key
once for the 1, and the 1 key five times for the 5 (See the 2nd screen in figure 5.10). Follow the digit entries
with the ENT key to accept the digit entries. The display will look like figure 5.11.

Figure- 5.11: Finishing the Output Function Entry.

Entering Tokens
Press (rung) ENT to accept complete rung. Result is in screen 2 of figure 5.11. Rung 012 is now
finished and saved as part of the I/O Setup program. Use BAK to leave the CHG/EDT line process. The
relay number 8 will close at this point (you can probably hear it click on). The ID (I/O program checksum)
should be: B07587. This finishes entering this I/O program. Return to the RunTime screen by pressing the
fixed STATUS key.

SECTION 5.15

Example 2 - Factory Installed I/O ProgramThis I/O program is the one that is shipped standard with the STC-2000A. Its functions are:Factory Set Outputs
Output 1 Crystal Fail - This relay provides a contact closure whenever the film program stops because of
mapped (selected) sensors failing to operate properly (or sensors exceeding the user defined
operating range). A STOP: XTAL message will be displayed on the LCD display to alert the userof this condition.
Output 2 Source #1 Shutter Relay - This relay is intended to provide control of the source shutter. It is
generally activated during the deposition phase when source #1 is active.
Output 3 Xtal 2 Select - Output 3 is enabled when sensor 2 is an active sensor.
Output 4 Thickness Setpoint - This relay provides a contact closure whenever the accumulated thickness
display value equals or exceeds the thickness setpoint parameter value.

Factory Set Inputs

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Input 1 Start Process Film – In sequencing mode, functionally identical to the fixed Front Panel START
key followed by the RESET/START PROC key with the STC-2000A in the process stop state.
Activating this input with the STC-2000A in any state except busy and wait will begin the active
process. In non-sequencing mode, starts current active film unconditionally.
Input 2 Stop -Functionally identical to fixed Front Panel STOP key. Activating this input will terminate
the deposition process. Displays STOP: REMOTE in the Runtime status area on the LCD screen.
Input 3 Final Thickness Trigger - Activation of this input causes the unit to respond as if the final
thickness has been reached.
Input 4 Substrate thickness zero trigger – Activating this input (active true edge) causes the accumulated
thickness to be reset to zero.

Factory Installed I/O Program with checksum ID=B41779(if SWP key reversed locations, ID=X41779, where X is either memory section A or B)
The listing of the program to implement this is below in Table 5.5. (non-sequencing mode is addressed inline 8) Each rung of the program is described following the program listing.

1:
2:
3:
4:
5:
6:
7:
8:
9:
10:
11:
12:

I73 #2 = S8
(Cobra ship pgm 2003/5/22 CRC 41779)
I228 C8(Xtal Fail Stop to Relay 1)
I79 #1 = O9
I81 #2 & O10
I221 S11
I228 C11
I0 T216
I0 T202I1 T200
I2 T217I3 T219
I68 O64
Table 5.5: Factory Installed I/O Program [in B memory].

Rung 001: This line along with rung 2 is used to control the crystal failure relay (Output 1, ID# 8). Thisline examines the STOPPED status condition (I73) and compares it for a value of 2 (XBAD).
When the unit is aborted or stopped for a Xtal failure condition (related to sensor failure during
deposition), the relay is set (S8). It remains set until cleared in rung 2 (see below).
Rung 002: This line is used to reset or clear relay 1 (ID# 8). A detection of the Begin of Job/Film event(I228) causes the clearing of the state of the resource #8 (Relay 1). Since this rung follows theprevious rung #1, even if the stopped condition (I73 equals 2) continued to persist, the clear
behavior would override the earlier set behavior, causing the relay to be cleared or reset. The
Begin Job/Film event is triggered or tripped at the start of every active film (leaving stop or idle
and entering the Begin/XtalVerify state). At this time the health of the sensors configured in the
Active Film/Active Map programming is re-evaluated. This is the point at which the earlier stateof a bad crystal is 'thrown out' and new condition ascertained. Of course, if the sensors are still
bad, the film will abort again, and the relay will close again due to rung #1 above.
Rung 003: This rung controls the Source shutter relay (Output 2, ID# 9). It does this by examining the stateof resource ID #79 (the Source Shutter bitmap value), which is the combined value of eight

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p STC-2000A DEPOSITION CONTROLLER ydifferent bit weights. This combined map value encodes the state of each of the possible eightsource's active deposition state. When a source is being used for an active deposit (manual,deposit, rate-ramp, time-power, etc) phase, the associated bit weight for that source will be true.
For the case of source #1 (first of two sources on the first Source/Sensor card), the least significant
bit weight (value of 1) is used. This bit is detected via the #1 = test. Since only one source can be
active at a time (non-codeposition mode), the test for which source is in use can be a simple
equality comparison. If source two were desired, the bit weight/value would be 2. Source threewould be a value of 4, with a doubling to 8, 16, 32, 64, 128 for each higher numbered source's
shutter.
Rung 004: This rung controls a relay that can be used to operate a dual shuttered head. When sensor two is
contributing to a measurement (active mode), its bit-weight (#2) will be true in the bitmap I/O
resource #81 (XTLSHUT, or crystal shutter). Rung 4 examines the value of resource 81 (I81),
placing the combined state of all 8 sensors as a scalar value on the I/O program stack. The
constant value 2 is then stacked, and the bitwise AND operator (&) is performed, leaving either a0 or 2 value remaining on the stack. The O10 output token evaluates the top of stack (TOS) value,
and if non-zero (in this case, 2), results in a TRUE state to resource 10 (Relay 3). If sensor two is
not being used (and most likely # 1 is), then the result will be 0 or FALSE, and the relay will not
be activated. In this way the exclusive (one or the other) use of the standard two sensor channels
can control an electrical/pneumatic/mechanical shutter to cover/expose the appropriate crystal.
Rung 005: This rung, in combination with rung #6, controls relay 4 (resource ID #11) to indicate when afilm's setpoint thickness threshold has been reached. This rung examines the event 221 (I221 for
setpoint thickness event) and when the instrument signals/triggers the internal event whichindicates the accumulated thickness has exceeded the programmed threshold, sets the relay via theS11 token. It remains set until a subsequent clear operation is caused in rung #6 (see below),which is at the start of a new film job. In this way the signal is a steady state throughout thedeposit phase in which it is detected and occurs. Such a relay could be used to turn on a process
variable such as heat, gas flow, etc..
Rung 006: This rung examines the occurrence of the 228 (Begin Job/Film) event via the I228 token, and on
occurrence of the event (starting up a film execution) places a TRUE value to the stack (TOS) for
one evaluation of the logic program. This single occurrence of the TRUE is used to activate theC11 token, which clears or reset relay 4. The combined behavior of rungs 5 and 6 produce a relay
closure which lasts from the time when a deposit thickness accumulation exceeds the programmed
thickness setpoint threshold until the next film is started. Alternatively the EndJobDeposit or
EndJobFilm (230 or 231) events could be used to cancel the relay at the end of the deposit, so therelay would be active only during the deposit cycle which closed it. Exactly what is needed is up
to the end user's requirements.
Rung 007: This rung connects (logically, cause and effect wise) the external input 1 to event 216, thesequencing mode Start/Unconditional event. Triggering this event has the effect, if the unit isoperating in the sequencing mode, of starting the currently selected ActiveProcess. In this way a
stopped unit will start at layer 0 whether at an idle resting state or stopped in an error condition,
without the need for multiple starts as would be needed from the front panel. If the unit is in the
NON-sequencing mode, triggering this event has no effect, and this rung is harmless. It is includedin this program so the program is generic and works whether in sequencing or non-sequencing
mode. The transition of the input from FALSE to TRUE creates the edge which triggers the event.
Continued persistence in the TRUE state does nothing, and the signal must go FALSE longenough to be sensed FALSE (minimally 1/4 second to be sure), before going TRUE again cancause another process start. Only a process at rest can respond to the process start. Process starts
that occur while a process is already running are ignored, not queued up. Once the process stops,
the next occurring new trigger of a start event causes the process to restart.
Rung 008: This rung connects (logically, cause and effect-wise) the external input 1 to event 202, theNON-sequencing mode Generic Start Film event. Triggering this event has the effect, if the unit is

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p STC-2000A DEPOSITION CONTROLLER yoperating in the NON-sequencing mode, of starting the currently selected ActiveFilm. In this way
a stopped unit will start a film up whether at an idle resting state or stopped in an error condition,
without the possible need for multiple starts as would be needed from the front panel (STOP to
READY, then READY to Running Film). If the unit is in the Sequencing mode, the resource 202
is treated as a softnode, rather than as an event, and triggering it will cause the softnode behavior
at 202 (a one-second TRUE state which reverts back to FALSE). This re-mapping of unused
events between sequencing and non-sequencing modes insures that a working program for one
mode will not produce a syntax error if the mode of the instrument is changed. That is because asoftnode has universal usage (In/Out/Trip/Set/Clear/etc.) and if legal in the intended mode(sequencing or non-sequencing), it will still be legal ,although non-functional, in the alternate
mode. It is NOT recommended, however, to use the alternative function softnode as a softnode
intentionally. Under such conditions a program could be written which uses other than the T (trip)
token, and then if the unit is alterred to from a sequencing to a non-sequencing unit, or vice versa,
the I/O program would be a syntactically invalid program. This rung is included in this program
so the program is generic and works when in non-sequencing mode. The transition of the input
from FALSE to TRUE creates the edge which triggers the event. Continued persistence in the
TRUE state does nothing, and the signal must go FALSE long enough to be sensed FALSE(minimally 1/4 second to be sure), before going TRUE again can cause another Active film start.
Only a film at rest can respond to the film start. Film starts which occur while a film is alreadyrunning are ignored, not queued up. Once the film stops, the next occurring new trigger of a start
event causes the film to restart.
Rung 009: This rung connects (logically, cause and effect wise) the external input 2 (I1) to event 200, theabort/stop event. This event is the same event which is used by all internal systems logic to stop
the running film/processes, and will have the same behavior. The uniqueness of this stop is that,along with a computer communications caused stop, it will display STOP: REMOTE on screen,
and the stop type (resource #73) will be a value of 3. The transition of the input from FALSE to
TRUE creates the edge which triggers the event. Continued persistence in the TRUE state doesnothing, and the signal must go FALSE long enough to be sensed FALSE (minimally 1/4 second
to be sure), before going TRUE again can cause another STOP. Only an actively running film can
respond to the STOP. Film stops which occur while a film is already stopped are ignored, notqueued up, since the automatic process is already stopped. Once the film is running, the next
occurring new trigger of a stop event causes the running film to abort/stop.
Rung 010: This rung connects (logically, cause and effect wise) the external input 3 (I2) to event 217, thefinal thickness trigger event. When the change of input edge event of the external input 3 occurs, it
triggers the final thickness trigger event. This event is used in the process automation logic toterminate a deposit phase (deposit, rate-ramp, post rate ramp deposit, time power, etc). It is
automatically generated internally when the measured accumulated thickness exceeds the final
thickness as programmed in the film (for non-sequencing) or process (for sequencing). By
triggering the same event remotely, the deposition ends (prematurely) and the film enters the post
deposit idle phases and eventually terminates. To use this, the external termination signal fromsome other form of endpoint determination (optical monitor, resistance monitor, etc..) is wired into
this input, and the film or process layer thickness is set to a high value such that the measured
accumulated thickness would not normally trip the final thickness event. Then when the external
system determines sufficient coating has occurred, it triggers the event via a hardware input signal
long enough to be seen and coupled into the processing.
Rung 011: This rung connects (logically, cause and effect wise) the external input 4 (I3) to event 219, thezero substrate thickness event. When the change of input edge event of the external input 4 occurs,
it triggers a zero thickness event which is the same one that is used to zero thickness when thefront panel button is pressed. In this way the accumulated thickness value can be reset to zero froma remote input.
Rung 012: This rung connects (logically, cause and effect wise) the user definable front panel function key
F1 (leftmost membrane switch under the yellow user-LEDs) (I68) to the leftmost yellow user LED

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p STC-2000A DEPOSITION CONTROLLER y(O64). This rung serves no useful purpose other than to demonstrate the use of one of the foursoft-switch inputs and one of the uncommitted LED indicators. When the unit is running, pressing
the leftmost membrane key will light the LED for the duration of the depression. A slight lag
between activation and deactivation of switch and the tracking of the LED illumination is normal.
Pressing and releasing the front panel switch quickly enough will result in no LED lighting,demonstrating the need to have inputs persist long enough to be sampled and recognized.

I18

Stopped - Crystal Bad001:

Rem ote Input 1
I0

007:
Crystal Fail

S8
Relay 1
C8

I38

Unconditional
Process Stop
Rem ote Input 2
I1
T96

008:

002:

STOP

Crystal Verify
Relay 2
I45

I35

003:

O9

Deposit009:

O141
Soft Node

I46

Substrate Shutter Open

Rate Ram p
Relay 3

I47

Replace incorrect drawing.

P109

T131

Deposit after Rate Ram p

I55

004:

O10
I48
Tim e / Power Recovery

Sensor 2 Selected

I141

I2
P112

Setpoint Thickness

005:

010:

T108

Rem ote Input 3
S11
Relay4
C11

Soft NodeFinal Thickness
Trigger

I3

011:

T114

I38
Rem ote Input 4006:

Use Sensor 2

Crystal Verify

OUTPUTSINPUTS

Figure- 5.12: Factory Installed I/O Relay Ladder Notation.

SECTION 5.16

Modulo 100 Counters ID# 400-409

Ten Modulo 100 counters are incorporated into the STC-2000A I/O structure. Each counter isrepresented by a unique ID number. The status of these counter states can be used as inputs with the I/O
programming statements. The counters can alternately be named with letters in consecutive order based on
their numeric sequence (eg. 400=A, 401=B, etc.).

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p STC-2000A DEPOSITION CONTROLLER yCounters
Counter A Is represented by the ID 400. Using the 400 identification, the counter when used as an
output can have current count, count advancement (increment) and count reset to zero (clear). Similarly,
using the 400 identification, the counter as an input can have values written to the counter. The function
code I is valid to test a state. The I/O term I400 would be true at the positive transition to count 44 of thecounter. The I/O term I344 is true while counter A exists at count 44.

Outputs
Outputs of logical I/O expressions can clear or advance the count within a counter. These are of
the form s400 (set), c400 (clear), a400 (arm), or d400 (drop). Set and arm act identically when used withcounters. Each positive edge of these terms advances the counter one count, incrementing the counter in a
00..01..02..03......98..99..00..01 sequence.

Resetting
Clear (C400) and drop (D400) are two ways to reset the counter to its 00 count. Clear is a levelsensitive clear which sets the counter to its 00 state and keeps it there as long as it is true. Any attempts toadvance the count (S400 or A400) while C400 is active will be ignored. The drop (D400) input is positiveedge sensitive and thus sets the counter to its 00 state on the positive occurrence of the drop event (D400).
The fact that D400 remains true does not affect the ability of the counter to be advanced by either S400 or
A400 commands. If during a single I/O program evaluation pass, both a set (or arm) and clear (or drop) are
active, the clear has priority and count will go to zero and the advance count event will be lost.

Example 3 - A Modulo 6 Counter
A Modulo 6 counter will be implemented which closes output relay 8 for 1 second on every fifth
push of the INC push key on the hand controller (not really too useful but demonstrates some fundamentals
and can be easily tested). Also, each press alternates the illumination state of the LED#2 between off andon.

The Program
The following program implements this modulo 6 counter.
1:
2:
3:
4:
5:

I89 P 0350
I350 S400
I400 #5 = I350 & D400
I400 #5 = N T15
I400 #1 & O65

Table 18.1: Modulo 6 Counter Program

Rung By Rung
rung 1: Examines the INC push key (I89) and produces an event on the positive edge to softnode 350.
rung 2: The occurrence of the positive edge of the soft node is used to advance the counter.
rung 3: When the counter is in the state 05, and the soft node then goes True, the counter is cleared to zerorather than advancing to 6.
rung 4: Generates a one second (trip) pulse on relay 8 (ID#15) when the counter has been incremented
from the 5 state to the 00 state, each 5th press of the INC hand controller key.
rung 5: Masks the least significant bit of counter 400 and displays it to LED#2.

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p STC-2000A DEPOSITION CONTROLLER yEntering The Program
For a little practice with counters or using the I/O, this program can be entered at the end of an
existing I/O program or in the alternate I/O memory and tested. Once installed, listen for the one second
click of relay 8 after every sixth push of the INC key on the hand control, and observe LED#2 either toggle
ON or OFF with each press of the INC key.

Example 4 - Fixed Delay & Pulse Width
The internal modulo 100 counters of the STC's I/O can easily be used along with the Time events(ID# 1224 - once per second, ID# 225 - once per minute, ID# 226 once per hour) to generate a desired
pulse width after a fixed time delay after the occurrence of some internal or external event.

The Program
The following program implements a five second pulse on an output relay 50 seconds after theoccurrence of an external input to the STC-2000A.
1:
I224 I400 #0 > & I68 P ¦ S400
2:I400 #50 > O15
3:I400 #55 > C400
4:
I15 O65
Table 19.6: Fixed Delay & Pulse Width I/O Program

Rung By Rung
rung 1: is the rung which advances the ID# 400 counter. The first advance occurs on the positive edge ofthe external input applied to remote Input 8 (ID# 07), once the counter is 'started' the once persecond event ID# 224 continues to advance the counter. [Change I68 to I7 to use an opto-input
instead of the programmable front panel key for input triggering method]rung 2: Approximately 50 seconds later, when the counter reaches the value of 51, the second rung causes
Output Relay 8 to close (ID# 15).
rung 3: value of the comparison ">55" becomes True when the counter value exceeds 55, then the "C400"
resets the counter to the zero value state.
rung 4: copies the relay 8 state to LED#2.

STC-2000A/SRT-400 Interconnect Cable:

Example 5 - I/O Program for Four Pocket Source
Input/Output assignments are as follows:
012
Relay 5, Pins 6(NO)&7(COM) of the RELAY OUTPUTS connector.
013
Relay 6, Pins 17(NO)&18(COM) of the RELAY OUTPUTS connector.
I7
Input 8, Pin 12(cathode) of the OPTOCOUPLER INPUTS connector(assumes LED anode is pulled high via jumper headers JP1, JP2 and/or Pin 25 [see figurex4.3]).

to:to:

STC-2000A
400

SRT-

relay pins(F)pins(F)

6 -------------------- 1
17 ------------------ 2
3 -------------------- 7

I104 #1 - #1 & O12,
for LSB CRC=58129
I104 #1 - #2 & O13,
is 0..3
I68 I7 | O300,
pocket good to softnode 300

NEW4POCK.IO 2003-5-20 Relay 5

14 ------------------ 3
7,18,4,15 --------- 6

RELAY 6 for MSB of Source 2/ 1..4
External input 8 or F.P. Func1 is

input pins(M)12 ------------------ 5
13 ------------------ 6[see figure x4.3]

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p STC-2000A DEPOSITION CONTROLLER y
I98 #2 / #1 & O301,
I301 I300 & T235,
I12 O67,
I13 O66,
I104 #4 > I104 #1 < | O302,
I80 #18 = P O303,
I303 N I302 & T270,
I301 O65,

Bit D1 of RTRSYNC shifted/masked to LSB SN301
When PocketGood signal TRUE and Source 2 syncing/ trig PG2Copy state of relay 5 to LED D (rightmost)
Copy state of relay 6 to LED C (for MSB weight)
Test valid range of pocket source 2 as 1..4
When enter INDEXER state generate event to SN303
After delay of SN303/ if SN302 TRUE/invalid range/stop270
Map SN301 state when looking for pocket good to LED B (2nd)Four softnodes are used: 300, 301, 302, 303.
.I/O Program Contents
Rung#
Expression
Film Hold
#12
P38
T86
#13
P38
T145
#14
`
N145
S146

Description
Xtal Verify set film hold.
Soft Node 145 used for 1 sec delay.
Soft Node 146 to extend delayed verify.
event until end of Hold.
When hold cleared remove 146.
Hold reset; When in layer after verify
and pocket good

#15
#16

P85
C146
I146 17 * T85

Pocket Selection
Decoding
#17
#18
#19

I24 I26 I28 I30 + + + 0147
I32 I147 + 0147
I25 I26 I29 I30 + + + 0148

LSB
Films 1,3,5,7,9 have LSB on.
MBS on in films 2,3,6,7.

Pocket Selection
#20
#21
#22
#23
#24

P38 0149
I149 I147 I12 ^ * * S12
I149 I148 I13 ^ * * S13
I149 I147 ^ I12 * * C12
I149 I148 ^ I13 * * C13

Selection Strobe; Begin crystal verify.
Pocket selection relays.
Using outputs as cross coupled flip flops
prevents sending false position
information to the indexer.

SECTION 5.17

Layer number ID# 900-999

The current layer # is indicated by this ID#. ID 900 is true when the process is stopped ("#" sign
shown on display).These IDs can be only used as inputs to an I/O equation using the I, P, and N functions.
Example: The I/O rung 1: N904 T14 causes output relay 7 to close for 1 second after the endof layer 4 in a process.

SECTION 5.18
Function Keys

Hand Controller Push Buttons / Front Panel LEDs and

The Hand Controller, see Figure 5.13, was designed to increase, decrease, or terminate the control
voltage to the deposition power source while in manual operation. When the STC-2000A is not in the
manual mode the three keys can be used for other functions. The keys INC, DEC, and STOP have been
assigned ID's which allow them to be incorporated into an I/O program.

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p STC-2000A DEPOSITION CONTROLLER y
MANUAL POWER

INC

DEC

STOP
instruments

Figure- 5.13: Hand Controller (also called a Pendant).
One common usage of a remote stop key is when the STC-2000A is used in conjunction with an
optical monitor. An I/O rung is added which triggers an external final thickness. Thus an operator viewing
the optical monitor results can manually terminate the deposition remotely by adding a single I/O rung,
which provides this function.
1: I91 I72 ! & T217
The input portion of this statement tests the status of the STOP key on the Hand Controller (I91)
and logically 'ANDs' it with the complement of the manual mode state (I72!). The output portion of thisstatement triggers the final thickness when the input conditions are met. With this I/O statement installed,
pushing the STOP key on the Hand Controller while in non-manual deposition will cause the deposition to
be terminated as if the set point final thickness had been achieved. In practice, the set point is set slightly
above the predicted desired thickness and then the deposition terminates either manually by the operator or
automatically at some safety thickness if the operator misjudges his optical results. Likewise the INC andDEC keys could be programmed to raise and lower the vacuum chamber or do some other useful tasks byadding an additional I/O rung or two.
Four front panel LED indicators ( for output) and four fixed front panel function keys (for input)
have been assigned ID's which allow them to be incorporated into an I/O program as are the pendent keys
(See Table 5.3, ID#s: 64 through 71). The leftmost LED has an ID# of 64 and the following LED ID#s
increment consecutively to the rightmost LED whose ID# is 67. The leftmost function key has an ID# of 68
and the key ID#s increment consecutively to the rightmost function key whose ID# is 71. The LEDs can beused to indicate progression through a process, a single event, a series of unrelated single events, indicatethat a function key has accomplished its programmed function, etc. The function keys can be used totrigger events, provide or release a pause in a process, provide a decision capability by waiting for the pressof one of two (or three) keys at some point in a process, etc.

SECTION 5.19

I/O ERROR MESSAGESWhen entering or editing an I/O program several Error Messages might occur. These messages
indicate that the rung which was changed contains an error in form or content. The following error
messages may appear during the process of entering an I/O rung or trying to leave an I/O program which
has been altered.
ERROR
Probable Cause
Phase Error
Multiple use of an output ID code somewhere in the I/O program. The following
I/O program will cause a Phase Error message:
1: I1 O7
2: I2 O7
It is desired to have both Remote input 2 & 3 (ID#'s 1 & 2) close Output Relay 1(ID# 7). The proper way to do this is to logically combine the input portion of
the I/O statements as follows:
1: I1 I2 ¦ O7

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p STC-2000A DEPOSITION CONTROLLER y
Nest Too deepThe I/O rung contains an extra input or is missing a logical operator or output term.

Stack under flow

Extra logical operator or output term or missing an input term

Bad node ID

Using an unassigned ID # (Reserved)

Invalid Operation

A non-valid function assigned to an ID#. Example: Trying to assign the output function
to an Remote Input ID by forming output token (O3) would give this error.

Out of I/O Memory

I/O program too long to fit available memory

Typical error sequence example: two input tokens are created, ENT (enter) is pressed, the CHG (change)
screen appears with an error message on the last line. Press the OK key to acknowledge error message andreturn to 1st screen pictured below. Use editing facilities (eg. BAKSP, DEL, etc.) to make corrections.

SECTION 5.20

I/O SETUP Menu Summary

See chapter 3, section 3.22, Product Programming Summary for I/O Menu summary.

Positive And Negative
The other 2 input functions are for use with Edges. These are called pos and neg (P and N), andthey become true only once following an Edge event occurrence. The duration of this true value is nolonger than 100 milliseconds, the interval of time between scans of the I/O program. If you test an event
within the STC-2000A, you must use a Positive function. This is because Events are Edges in nature. A
zero thickness event is an example of this. Remember that States are steady state conditions and can betested using either input, Positive, or Negative. The positive test of an input yields TRUE once on a change
from False to True. The negative does similarly on a True to False change.

RS-232 communications
connections (3.11)
software (section 6 [include connections])
communications options(3.12)
guided tour/ examples
programming examples (2.7 lead in...)process programming (p.2-26)
film programming (p.2-27)
running example programs
manual power control (2.8)
appendix
hardware connections: roughly section 3 + pendent (2.8)

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p STC-2000A DEPOSITION CONTROLLER y<

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p STC-2000A DEPOSITION CONTROLLER y

Computer Interfacing

SECTION 6.0

The STC-2000A can be connected to a computer in a variety of ways. An RS-232 interface isstandard and an industrial bus interface <not yet software implemented> such as DeviceNet, PROFIBUS-x
or CANopen can be factory added as an option. There is room for only one optional card. There is also
another hardware option for an external I2C connection <not yet software implemented>.
For the RS-232 interface, either a Sycon protocol or a simple ASCII protocol can be selected. This section
will describe the hardware with each interface, and give an example of how to interface to a PC host.

RS-232 Interface Description
RS-232 is an electrical specification for the transmission of data in a serial format. What thismeans is that the mechanism for transmitting data is defined by RS-232. The particular set of commands isdefined by each vendor as they see fit. There is no computer program that will "communicate with all
RS-232 devices". Different sets of commands and miscellaneous overhead must be handled differently.
The Sycon protocol incorporates message length and checksum characters which insure the integrity of thedata transmission.

Baud Rates And Cabling
No matter what protocol you are using, the first order of business is to get the STC-2000A
connected to the host computer and set up the baud rates. Figure 6.1 shows how to connect to an IBM-PC
and IBM-AT. Note that the connectors are different for each end, label similar ends accordingly.

Making An RS-232 Cable
to: STC-2000A

IBM-AT

2 RxD

RxD

DSR 6
2

3 TxD

TxD
CTS
DTR

3
8
4

GND

5

9
5 GND

SHIELD

9 PIN FEMALE

9 PIN FEMALE

IBM - PC,XT

to: STC-2000A
2 RxD

TxD

2

3 TxD

RxD

3

CTS

5

9
5 GND
9 PIN FEMALESHIELD

DSR

6

GND

7

DTR

20

Figure- 6.1: Example Cable: Connections From STC-2000A To MS-DOS Computer.

SECTION 6.XX

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p STC-2000A DEPOSITION CONTROLLER y
After the proper cable is made or purchased, make sure the baud rate of the computer and STC2000A are the same. This is done by going into the Executive Menu (by pressing the fixed MENU key,followed by the EXECUTIVE MENU key) and selecting the communications setup option. You will see ascreen with the current baud rate on it. Section 6.4 describes programming these parameters in detail.

Setting The Baud Rate
Make sure that the baud rate on your computer is set to the same baud rate. The STC-2000A is
shipped from the factory set at 9600 baud. To set an IBM-PC to the same baud rate, at a DOS prompt typein:Mode Com1:9600,N,8,1 <Enter>
This will set the IBM for 9600 baud, 8 data bits, no parity, and 1 stop bit on its COM1 port. It is
important to use 8 data bits because the protocols use all of them.

SECTION 6.1

Sycon Protocol

The STC-2000A does not initiate any messages on its own. It responds only when "spoken" to. Inorder for error-free communications to occur, several safeguards are built into the Sycon protocol forchecking data integrity. The general format for sending and receiving commands is:(STX) (Data Length) (Data(Data..Data)) (Checksum)

RS-232 Message Format
The STX character (hex 02) indicates a start of message sequence. The STC-2000A uses this as asynchronization point. It just sits in a loop waiting for the STX character. If a different character isreceived, it is discarded. When the STX character is received, the STC-2000A looks at the rest of thecharacters in the command.
The data length is a ASCII character from SOH (1 decimal) through CR (13 decimal) andindicates the number of data characters in the message. The data is defined in the protocol below. The
STC-2000A uses this number to determine where the end of the command is. If there is a mismatch
between this number and the actual number of data characters in the message, one of two things canhappen. If the data length number is low, the STC-2000A will terminate the command prematurely. The
checksum will not match and an error will be recognized by the STC-2000A. It will not respond in any
way.

Message Length
If the data length number is high, the STC-2000A will be waiting for more characters than actuallycontained in the message. In order to recover from either kind of error, the host computer must have atime-out/retry capability built into the software. There is a maximum of 13 data characters allowed in any
communications message. This does not include any packet formatting characters.

Checksum - Error Recovery
The checksum is the sum (modulo 256) of only the data bytes. If this does not match the actual
checksum of the data, an error condition is recognized by the STC-2000A. It will not respond to thecommand.
Table 6.1 is a basic program that will run on an IBM-PC. It prompts you for a command to send
to the STC-2000A and will print the response on the display. It is written in BASICA program, but will
also run under Microsoft GWBASIC. This program prompts the user for the STC-2000A command; thenadds the STX, data length and checksum before it transmits the message to the STC-2000A.

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p STC-2000A DEPOSITION CONTROLLER y
Table 6.1
Basic Driver Routine
4 Rem Sycon STC-2000A Communications Demo Routine. 6/12/1989 S. Bender
5 Rem
Sycon Instruments Inc. E. Syracuse, NY 13057
6 Rem***-----------------------------------------------------------8 Rem ============ Establish Communications Parameters And Open As File #1.
10 Open "Com1:9600,N,8,1,Cs,Cd" As #1
29 Rem ============ Get Console User Input To Be Sent To STC As A Command.
30 Input "Enter Message To Send"; Msg$
34 Rem ============ Enter Stop At Prompt To Exit Program.
35 If (Msg$="Stop" Or Msg$="Stop") Then 1000
39 Rem ============ Send Message And Get Reply, Or Else Some Kind Of Error.
40 Gosub 500
50 Print Rply$
54 Rem ============ For Debug Purposes, Show Returned Reply In Hex Codes Too.
55 Print "Hex Data is {";60 For Cnt=1 To Len(Rply$)
70 Print Using "\\" ;Hex$(Asc(Mid$(Rply$,Cnt,1)));75 If Cnt <> Len(Rply$) Then Print ":";
80 Next Cnt
90 Print "}"99 Rem ============ Loop Until Break Or User Exit.
100 Goto 30
101 Rem ============ ******* End Of Main Program Body***********
102 Rem ***********************************************
103 Rem ============ **** Start Of Msg/Reply Driver Subroutine ****
499 Rem ============ Initialize Variables.
500 Outcnt=Len(Msg$):Cksum=0509 Rem ============ Compute Outgoing Message Check Sum.
510 For Indx= 1 To Outcnt:Cksum=Cksum+Asc(Mid$(Msg$,Indx,1)):Next Indx
519 Rem ============ Send Msg To STC, ASCII Stx, Count, And Checksum.
520 Print#1,Chr$(2)+Chr$(Outcnt)+Msg$+Chr$(Cksum And 255);
529 Rem ============ Get Returned Chars From STC-200/SQ And Check For ASCII Stx.
530 Gosub 600:If Char$ <> Chr$(2) Then 520
539 Rem ============ Got ASCII STX, Next Data is Length In Binary, Get It.
540 Gosub 600:Incnt=Asc(Char$)
544 Rem ============ Init Variables For Receiving Incoming Reply.
545 Cksum=0:Rply$=""549 Rem ============ Loop Inputting The Remote Reply Message.
550 For Indx=1 To Incnt
560 Gosub 600:Rply$=Rply$+Char$:Cksum=Cksum+Asc(Char$)
565 Next Indx
569 Rem ============ Get Final Data, The Checksum.
570 Gosub 600
579 Rem ============ Check For Valid Checksum And Data Integrity.
580 If (Asc(Char$))<>(Cksum And 255) Then Print "Bad Reply Checksum"
590 Return
591 Rem ============ ******* End Of Msg/Reply Driver Subroutine *********
592 Rem ***********************************************
593 Rem ============** Start Of Receive A Char From Com1 Subroutine **600 On Timer(3) Gosub 620 : Timer On
610 If Loc(1)<1 Then 610 Else Timer Off : Char$=Input$(1,#1) : Return
620 Timer Off : Print "Receive Timeout" : Close #1 : Return 10
621 Rem ============**** End Of Receive A Char From Com1 Subroutine **1000 Print:Print "Program Terminated By User":Print

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SECTION 6.2

ASCII Protocol

While the ASCII protocol is the simplest to use it doesn't provide for any error checking of thedata transmission. The format of the ASCII protocol is as follows:('$')((data)(data...........Data)) CR(LF)
The '$' is the start of a message. A single command is contained in the data fields. A CR(LF)
terminates the message. The line feed is optional, the CR must terminate the command immediately after
the final character of data.

SECTION 6.3

Communications Setup

Before you can communicate with the STC-2000A, there are several communications oriented
parameters that you need to program. While the RunTime screen is displayed, the MAIN menu can beaccessed by pressing the fixed MENU key. After the fixed MENU key is pressed, you will see the screen
as in Figure 6.2(a) which is the MAIN menu.

(a)(b)
Figure- 6.2: Fixed Menu, Executive Menu and Comm. Setup keys

Getting Into The Communications Setup Mode
From the MAIN menu, the Executive Menu can be selected. This is done by pressing the
EXECUTIVE MENU key, the results of which are shown in figure 6.2(b). From this point, we can selectcommunications setup by pressing the COMM. SETUP key. Figure 6.3 will then be on the display.

Figure- 6.3: Communications Setup Mode.

Communications Setup Parameters
There are 4 parameters that can be programmed from this screen.

Comm./IO Lock Code
The Comm. / IO Lock Code parameter provides safeguarding against tampering with either the
I/O program or the communications parameters. You can enter any 4 digit number for a lock code. A codeof 0 disables this feature. If you use it, whenever you enter into this menu or try to change the I/O program,
you will be prompted for the lock code. Make sure that you don't forget what you set it to, as there is no
way to disable this feature unless you know the code.

Keyboard Beep
The Keyboard Beep parameter, which controls the audible feedback when pressing keys, can bedisabled if desired. A value of 1 will turn the beeper Off and a value of 2 will turn it on.

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RS-232 Baud Rate
The RS-232 Baud Rate parameter sets the baud rate for the RS-232 interface. It can be
programmed to one of 4 values. A value of 1 is 300 baud, 2 is 1200 baud, 3 is 2400 baud, and 4 is 9600
baud.

RS-232 Protocol
The RS232 protocol parameter selects one of the two RS-232 protocols available. A 0 will selectthe Sycon protocol and a 1 will select the ASCII protocol.

Optional: Addresses<not implemented> If you use an optional communications card, you will need to assign bus
addresses.

Optional: Checksum Mode<not implemented> If the optional communications card is installed, this parameter allows anoptional checksum character to be used with the message packets.

SECTION 6.4

Industrial Interface Option<not implemented>

SECTION 6.5

Response Format

All commands received by the STC-2000A will return a response. The minimum response (notincluding protocol dependent characters) is a single ASCII character. This character indicates two things.
First the success or failure of the command which was sent. One of six result types is returned, toindicate success (AOK), illegal command token (Groups 1..16), illegal data value (number out of range forcommand), illegal syntax (something other than required = sent after command token), inhibited operation(changing the film number while depositing for instance) and I/O sequencing error.
Second, the returned response character reports the power on reset status of the STC-2000A. Eachof the four response codes (see below) is modified after a reset until the ? command resets the power failure
flag. In this way each response message informs the host as to the occurrence of an instrument reset since
the last exchange. The reason this is done is so that in every communication exchange a power on reset canbe detected and the correct exception processing be performed via host software, without special polling
overhead.
Response character
Power Lost
Message AOK
B
Illegal Command
G
Illegal Data ValueI
Illegal Syntax
K
Inhibited Operation
M
I/O Sequencing Error
O
Table 6.2: Response Character Table.

No Reset
A
F
H
J
L
N

______________________________________________________________________SECTION 6.6
Result Codes Returned: The first letter of the reply message sent from the STC-2000A to the hostcomputer is from the set of result codes detailed below. For each type of result one of two reply
characters is returned depending on the nature of the power up acknowledge flag of the
instrument. The second letter of the two for each type of result is returned after any previous

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p STC-2000A DEPOSITION CONTROLLER ypower failures or resets (such as when the unit is first powered up). Once this condition isrecognized and handled (bringing the host and the STC-2000A into synchronization) and the hostsends the '?' command to the STC-2000A, then the power loss/reset is acknowledged by the hostand replies from the STC-2000A are then prefixed with the first letter of the particular response
type.
Returned values following ACK and Reset, their meanings and their searchable mnemonic tags (searchable
in the electronic form of this document).
The response letters, mnemonic tag types and meanings are as follows:
Mnemonic Tag
Meaning
Returned Value(following ACK/RESET)

A
F
H
J
L
N
R

B
G
I
K
M
O
S

RZCD_AOKRZCD_ILCDRZCD_ILDVRZCD_ILSNRZCD_INHB
RZCD_IOSQRZCD_OBSOIResult returned as expected
Illegal Command Token
Illegal Data Value
Illegal Syntax, # of args, delimiters, etc.
inhibited operation, unable to process now
sequence error when downloading rung data
Old obsolete command received, command
ignored. This occurs when old commands to write
to obsolete parameters are encountered.

Note: A delimiter is either a single comma, one or more spaces, or zero or more spaces preceding a comma followedby zero or more spaces. An assignment operator ('=') is the equals sign preceded or followed by 0 or more spacecharacters.
Delimiter Examples: (ignore verticle lines || as they are used to define the area surrounding the delimiter text)||
is a delimiter.
|,|is a delimiter.
|, |is a delimiter.
| , |is a delimiter.
|, |is a delimiter.
|,,|is illegal as a single delimiter.
|,,|is illegal as a single delimiter.

SECTION 6.7

Communication Commands

While there are 2 protocols for RS-232, the command set for both of these is the same. The only
things that change between the two RS-232 protocols are the prefix before the command and the suffix
after. All commands and data are in printable ASCII form. Only the prefix and suffix characters that makeup the protocol-dependent data are allowed to be possibly non-printable. There are 16 types or groups ofcommands. These 16 group types are: Initialization commands; Read, Write Film Parameters; Read, Write
System Parameters; Read RunTime Data; Read, Set Status Information; Read, Trigger Events; I/O Status
Commands; Read Process Accounting; Read, Load I/O Program; I/O Program Editing; Set Analog
Output(T); Process Sequencing – Process Size, Memory; Process Sequencing – Read, Write, Edit
Processes; Measurement Substitution Group; Purge All I/O Programs; External Memory Module Status.
Please note that there is a difference between menu programming numerically represented selections andcommunication commanding numerically represented selections. Menu selections using menu programmingmight be 1, 2, 3 while communication commands for the same group might be 0, 1, 2. Therefore, menu selection
1 is equivalant to command selection 0, menu selection 2 is equivalant to command selection 1, menu selection 3
is equivalant to command selection 2. For example, using communication command selection for BAUD rate: 0
is 300, 1 is 1200, 2 is 2400, and 3 is 9600 Baud while using menu programming selection: 1 is 300, 2 is1200, 3 is 2400, And 4 is 9600 Baud.

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INITIALIZATION COMMANDS

Initialization Commands Group 1-Commands @ & ?
Initialize communications and read version. There are 2 commands that are typically used toinitiate communications with the STC-2000A. The @ command will request the software version and is agood command to start off with. The ? command resets a power fail condition. This is used after any
power lost condition to reset the power lost status of the STC-2000A.

Detailed Command Description:
Initialization Commands - Initialization (@),(?)
There are only 2 commands in this group, and they have no arguments.
______________________________________________________________________

Initialize -@- Get Software Version
This is used to get the current version of software back from the STC-2000A.
Command:Mnemonic:
Parameters:
Description:@
EXCT_whatv (what version)
None or numeric 0..16,30..33 to retrieve platform configurationand manufacturing information.
Returns the current software version or other information
as shown in chart below.

Returns:
For @ or @0[RZCD_AOK]ASTCXMM.NN
Where XMM.NN is version identifier, such as B01.01, RZCD_AOK is either the letter Aor B, depending on power failure or reset history. X is A or B for nonsequencing or sequencing variety, MM.NN is version identity.
For @1[RZCD_AOK]SERIAL/BTYPEFor @2[RZCD_AOK]OPTIONS/FWSIGFor @3[RZCD_AOK]BTLSIGFor @4[RZCD_AOK]UIF_COVEN
For @5..@8[RZCD_AOK]AAAN.M/xxxx
S4 module software revision information for each of the four modules (1..4 respectively).
The N.M is the revision code, the xxxx is the checksum for the firmware, and
the AAA field identifies generic module identity.
For @9[RZCD_AOK]UIFBASE_NUM
UIFBASE_NUM is a decimal number which defines the minimum UIFC version basedesired for use with SCUP. Returns decimal number, encoded version 02.12
would return 212. This insures that the proper version compatibility exists
between the SCUP and UIFC boards.
For @10..@16[RZCD_AOK]{reply from UIFC to its @0..@6 commands}

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p STC-2000A DEPOSITION CONTROLLER y@10 = response from SCUP UIFC vrsn string info.
@11 = UIFC Code signature.
@12 = UIFC Bootloader signature.
@13 = UIFC serial/build.
@14 = Base SCUP version for UIFC.
@15 = UIFC Glossary covenant.
@16 = UIFC sys_trap codes. In nnnn,nnnn form.
Read at power up, can be refreshed for recent reading from UIFC via ^U?
command. Reset from SCUP via ^U! command. Note, the ^U? command
requests a new sys_trap code from UIFC, but requires a separate @16 tointerrogate the reading if changed. Once a sys_trap code is non-zero, it will notchange or be overwritten until cleared from the UIFC front panel or via the YH
command passthru or the ^U! command.
@17..@29 reserved for future UIFC codes.
@30 = ReadBack SCUP Memory Module status. Returns CRDSTAT_class integer.
0 CRDSTAT_uninst Uninstalled option.
1 CRDSTAT_error Unavailable or unpresent when spoken to.
2 CRDSTAT_unfmtRO Present but format not recognized.
3 CRDSTAT_unfmt Present but format not recognized.
4 CRDSTAT_wrprot Present but write-protected.
5 CRDSTAT_readwrite Totally available.
@31 = Readback MemModule ProdID & Serial# returns integer, integer where first
integer is 9/10/11 for FRAM memory module w/1/2/3 chips. If chip's status is
not above unformatted, then returns 0,0. Serial number in range of 1..1000 is one
which was formatted automatically on SCUP system. Factory registered ones
start at serial # 2001 and up. This leaves an additional area from 1001..2000 for
future special purpose.
@32 = Readback Data Compatibility code returns number,number where 1st number
is product code (such as COBRASCUP #4) and second number is a dialect/data
representation covenant code which determines whether the data saved to file isexpected to be interpreted for read/write of params/accounting/sequences/ andRLLE steps. If chip's status is not above unfmt, then returns 0,0 . This
information pertains to the portable data on the CARD.
@33 = Readback Data Compatibility code returns number,number where 1st number
is product code (such as COBRASCUP #4) and second number is a dialect/data
representation covenant code which determines whether the data saved to file isexpected to be interpreted. This information pertains to the SCUP firmware's
desired/expected information profile. It must MATCH EXACTLY the card inorder to load/clone.
______________________________________________________________________
Initialization Commands Example
Command@
Response
ASTC200/B15
Description
The version request message. Where the 'A' might be a 'B' if the instrument was reset
since the last power loss acknowledgment message.
______________________________________________________________________

Reset Power Lost Status
This is used to reset the power lost status of the STC-2000A. See Section 3 for a complete description.
Command:Mnemonic:
Parameters:
Description:
Returns:

SECTION 6.XX?
EXCT_ackpl (acknowledge power loss)
None
Acknowledge Power Loss status.
[RZCD_AOK] (an A or B)

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p STC-2000A DEPOSITION CONTROLLER y______________________________________________________________________
Initialization Commands Example
Command?
ResponseA
Description
The reset power loss status message. Always an A since the message resets the 'B' statuscondition.

Table 6.3: Initialization Commands Examples______________________________________________________________________
Read, Write Film Parameters

Read, Write Film Parameters Group 2-Commands A & B
(A)

(B)

Read film parameters. These commands are used to read all of the film parameters. The groupcommand is the letter A followed by the film number, which can be from 1 through 50, followed
by a parameter number. Either a comma or white space needs to separate the arguments. Eachfilm parameter has a number associated with it.
Write film parameters. These commands are used to set the film parameters of the STC-2000A.
Its format is similar to the read commands above. The command is the letter B followed by thefilm number (1 through 50), the film parameter number, the character =, and the data value (asreturned with a matching A query).

Command:Mnemonic:
Parameters:
Description:

A
EXCT_rdfp (read film parameters)[1..50] [delimiter] [1 .. 46]
corresponding to film # 1..50 and parameter types DENS .. FRATDR .
Requests a read back from the selected film of the selected parameter value. See thelist of parameters and the corresponding ID code below.

Returns:[RZCD_AOK][param_value]
if proper film # (1..50) and parameter id were sent. Exact format of [param_value]depends on the particular parameter for which the data was requested.
[RZCD_ILDV] (H or I) if improper value for parameter arguments.
[RZCD_ILSN] (J or K) if too many arguments, wrong delimiters, etc.
______________________________________________________________________
Command:B
Mnemonic:
EXCT_wrfp (write film parameters)
Parameters: [1..50] [delimiter] [1 .. 46] [assign_delim] [desired_value] corresponding to film # 1..50
and parameter types DENS .. FRATDR as in A command above. The assign_delim is zero or
more spaces preceding the '=' sign followed by zero or more spaces. The desired_value is anumeric data item of proper range and representation (# of decimals points, etc..) used to
update or change the value of the parameter to. This value is expressed in the same manneras returned to the host when an A type command is issued. Therefore the data return froman 'A [FILM#] [PARAM#]' query command can be appended to a 'B [FILM#] [PARAM#]=' command, forming a legal B command which will download the same value to aparameter as was uploaded with the 'A' command. This makes it easy to save and restore the
STC-2000A instrument's parameters via a host computer.
Description: Command to set or store a new parameter value into one of the film programs.
Returns:[RZCD_AOK] (A or B) if correctly processed.

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p STC-2000A DEPOSITION CONTROLLER y[RZCD_ILDV] (H or I) if film #, parameter #, or new value is of improper value.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..
______________________________________________________________________
Film parameter access values:______________________________________________________________________
Parameter 1
Densityaccess:DENS
Value Range
0.40 - 99.99
Units
gm/cc
Reads Or Sets The Density Parameter depending which prefix letter A or B is used.
______________________________________________________________________
Parameter 2
Z Factor
access:ZRATioValue Range
0.100 - 9.999
Units None
Reads Or Sets The Z Factor Parameter depending which prefix letter A or B is used.
______________________________________________________________________(Obsolete)
Parameter 3
Tooling Xtal 1
access:OBSOLETE Was sensor 1 tool
Value Range
10.0 - 400.0
Units
Percent______________________________________________________________________(Obsolete)
Parameter 4
Tooling Xtal 2
access:OBSOLETE Was sensor 2 tool
Value Range
10.0 - 400.0
Units
Percent
Reads or sets depending which prefix letter A or B is used, the tooling factor parameters.
These correspond to the two sensors available on the STC-2000A.
______________________________________________________________________(Obsolete)
Parameter 5
Start Xtal #access:OBSOLETE Was initial channel
Value Range
0,1
Units
0 is Sensor 1, 1 is Sensor 2This indicates which of the 2 sensor crystals will be used for a deposition run.
______________________________________________________________________
Parameter 6
Setpoint Thk Lim
access:
STHK
Setpoint Thickness Limit
Value Range
0.000 - 999.999
Units
Kilo Angstroms
The setpoint thickness parameter is used to provide a comparison point for the STC2000A thickness setpoint event. This event will be triggered whenever the thickness
display equals or exceeds the setpoint value.
______________________________________________________________________(non-sequencing mode only)
Parameter 7
Final Thickness Limit (Trigger)
FTHK final thickness, end of run trigger
access:Value Range
0.000 - 999.999
Units
Kilo Angstroms

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p STC-2000A DEPOSITION CONTROLLER y
Used to stop the deposition process in non-sequencing mode. Non-sequencing mode does
not use a process program but rather a film, which is invoked by making it the next active
film and pressing the START key sequence to begin the deposition process. It has,
therefore, one implicit process. The Final Thickness Limit Trigger stops the selected film
deposition when the thickness reaches this user entered thickness value. This value isanalgous to the thickness value in a process program when in sequencing mode.
______________________________________________________________________
Parameter 8
Setpoint Time Limit
access:SPTM
Value Range
0:00 - 99:59
Units
Min:Sec
The setpoint time limit parameter is used to provide a comparison point for the STC2000A timer setpoint event status.
______________________________________________________________________
Parameter 9
Soak 1 Power Value
access:PWR1 power condition power level 1
Value Range
0.0 - 100.0
Units
Percent
This parameter sets the deposition source power value to be used as the first level of soak
power in the pre-deposition cycle. This power level will be maintained for the duration of
the soak 1 timer. This level is typically used to out gas and condition the source material.
A value of 0.0% causes the rise/soak 1 phase to be skipped.
______________________________________________________________________
Parameter 10 Power Ramp 1 Time
access:RMP1 ramp time to power level 1
Value Range
0:00 - 99:59
Units
Min:Sec
This parameter sets the duration of the power ramp from zero power to the power levelset by the soak 1 power value parameter.
______________________________________________________________________
Parameter 11 Power Soak 1 Time
access:
SKT1 soak time at power level 1
Value Range
0:00 - 99:59
Units
Min:Sec
This parameter sets the time that the source will remain at the soak 1 power level
following the completion of the ramp to this level.
______________________________________________________________________
Parameter 12 Soak 2 Power Value
access:PWR2 power condition power level 2
Value Range
0.0 - 100.0
Units
Percent
This parameter sets the deposition source power value to be used as the second level ofsoak power in the pre-deposition cycle. This power level will be maintained for theduration of the soak 2 timer. A value of 0.0% skips the rise/soak 2 phases.
______________________________________________________________________

Parameter 13
access:Value Range
Units

SECTION 6.XX

Power Ramp 2 Time
RMP2 ramp time to power level 2
0:00 - 99:59
Min:Sec

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p STC-2000A DEPOSITION CONTROLLER yThis parameter sets the duration of the power ramp from the soak 1 power value or theidle power value to the value set by the soak 2 power parameter.
______________________________________________________________________
Parameter 14 Power Soak 2 Time
access:
SKT2 soak time at power level 2
Value Range
0:00 - 99:59
Units
Min:Sec
This parameter sets the time that the source will remain at the soak 2 power level
following the completion of the ramp to this level.
______________________________________________________________________
Parameter 15 Idle Power
access:PWR3 power condition power level 3
Value Range
0.0 - 100.0
Units
Percent
This parameter determines the final (idle) power setting at the completion of the entire
deposition profile. If this power level is zero a start command will begin a new power
profile at rise 1. An idle power setting other than zero will cause the power profile tobegin at rise 2 after a start.
______________________________________________________________________
Parameter 16 Idle Ramp Time
access:RMP3 ramp time to power level 3
Value Range
0:00 - 99:59
Units
Min:Sec
This parameter sets the duration of the power ramp from the power level at the time that
final thickness was reached until the power reaches the value set by the idle power
parameter.
______________________________________________________________________
Parameter 17
access:Value Range

Deposit Rate
RATE requested rate for deposition
0.0 - 999.9
Å/s (10-8 cm/s)

Units
This parameter determines the material deposition rate that the closed loop control system
will try to establish and maintain at the time that closed loop operation begins.
______________________________________________________________________
Parameter 18 Rate Ramp Mode
access:RRMD rate ramp mode, on/off
Value Range
0,1
Units
0 is Off, 1 is On
This parameter is a disable/enable switch for the rate ramp function and associated film
parameters. When set to Off the programming cursor window will skip over the
associated parameters. When set to on all associated parameters are accessible and it will
be possible to alter the deposition control rate profile during closed loop control.
______________________________________________________________________
Parameter 19 New Deposite Rate
access:NRAT new rate to ramp to
Value Range
0.0 - 999.9
Units
Å/s
This parameter sets the new deposition rate value that is to be reached at the end of therate ramp operation.
______________________________________________________________________SECTION 6.XX

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p STC-2000A DEPOSITION CONTROLLER yParameter 20 Rate Ramp Time
access:RRTM rate ramp time
Value Range
0:00 - 99:59
Units
Min:Sec
This parameter sets the duration of the rate ramp. The rate ramp starts at the rate control
value at the time that the rate ramp trigger is reached and ends at the value set by the new
Dep rate parameter.
______________________________________________________________________
Parameter 21 Rate Ramp Trigger
access:RRTG rate ramp thickness trigger
Value Range
0 - 999.999
Units
Kilo angstroms
This parameter sets the trigger point for a rate ramp to begin during deposit.
______________________________________________________________________
Parameter 22 Ctl Loop -Paccess:
PROP control loop proportional term gain
Value Range
1 - 9999
Units
None
This parameter sets the closed loop rate control proportional gain.
______________________________________________________________________
Parameter 23 Ctl Loop -Iaccess:
INTG control loop integral term
Value Range
0.0 - 99.9
Units
Seconds
This parameter sets the closed loop rate control integral term time constant.
______________________________________________________________________
Parameter 24 Ctl Loop -Daccess:
DRIV control loop derivative term
Value Range
0.0 - 99.9
Units
Seconds
This parameter sets the closed loop rate control derivative term time constant.
______________________________________________________________________
Parameter 25 Max. Power Limit
access:MAXP max power limit
Value Range
0.0 - 100.0
Units
Percent
This parameter sets the absolute maximum power level that will be allowed to occur at
any time from the instrument (film dependent).
______________________________________________________________________
Parameter 26 Abort Max. Pwr Switch
access:ABMP abort on max power on/off
Value Range
0,1
Units
0 is Off, 1 is On
This parameter is a switch value. When set to Off it has no effect on the deposition
sequence and the programming data window will not access the associated max. powerdwell parameter. When set to on a maximum power condition will be allowed for thetime duration set by the now accessible max. power dwell parameter and then the STC2000A will abort the deposition sequence and power will be set to zero.
______________________________________________________________________SECTION 6.XX

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p STC-2000A DEPOSITION CONTROLLER yParameter 27 Max. Power Dwell
access:MPTM max power time interval
Value Range
0:0 - 99:59
Units Min:Sec
This parameter is associated with the max. power abort switch parameter and sets theallowable duration of a maximum power condition before an abort will occur.
______________________________________________________________________
Parameter 28 Shutter Delay Mode Enable
SDMD shutter delay mode, on/off
access:Value Range
0,1
Units
0 is Off, 1 is On
This switch type parameter will allow the shutter delay parameters to become active andthe mode functional on a individual film basis. If set to Off, the parameter window cursor
will not access the associated parameters. If set to On, the delayed shutter operation will
be performed as specified by the following parameters.
______________________________________________________________________
Parameter 29 Shutter Delay Time-Out
SDTM time to achieve control without alarmaccess:Value Range
0:01 - 99:59
Units
Min:Sec
This parameter sets a time limit for the delayed shutter operation to be completed. The
time period begins at the beginning of the shutter delay cycle. The sensor is exposed toevaporant with the substrates remaining shielded. When rate control is established to theprogrammed accuracy, three things happen. The substrate shutter is opened, accumulated
thickness set to zero, and the programmed deposition profile is then started. If thespecified rate control accuracy cannot be met within this time limit, the deposition will beaborted.
______________________________________________________________________
Parameter 30 Shutter Delay Quality
access:SDAC shutter delay accuracy factor
Value Range
1 - 50
Units
Percent
This parameter sets the rate control accuracy that must be established for a period of fiveseconds in order to complete the delayed shutter sequence. The maximum accuracy set
able is 1 percent of the desired setpoint. However, this is internally limited to 1 Å/s.
______________________________________________________________________
Parameter 31 Rate Sampling
access:XSMD crystal sample mode, off/timed/intel
Value Range
0 To 2Units
0 is Off, 1 is Timed Mode, 2 is Intelligent Mode
This switch type parameter will allow the rate sampling parameters to become active andthe mode functional on an individual film basis. If set to Off the parameter window
cursor will not access the associated parameters. If timed mode is selected, the crystal
sensor will be exposed to evaporant for the time specified by the sample dwell parameter,
and will sample at the interval specified by the sample interval parameter. If intelligent
mode is selected, then the duration of the sample will only be long enough to establish
the desired accuracy.
______________________________________________________________________
Parameter 32

SECTION 6.XX

Sample Interval

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p STC-2000A DEPOSITION CONTROLLER yaccess:XSTI crystal sample time interval
Value Range
0:01 - 99:59
Units
Min:Sec
For either mode of operation this parameter will select the sampling interval of thesensor.
______________________________________________________________________

Parameter 33 Sample Dwell TimeXSDW xtal sample dwell time for timed mode
access:Value Range
0:01 - 99:59
Units
Min:Sec
For the timed mode selection this parameter sets the duration of sensor exposure.
______________________________________________________________________
Parameter 34 Sample Quality
access:XSAC xtal sample accuracy for intel mode
Value Range
1 - 50
Units
Percent
In the intelligent mode of rate sampling this parameter sets the control quality required toterminate the exposure period of the sensor.
______________________________________________________________________
Parameter 35 Sample Alarm TimeXSTM xtal sample alarm time for accuracy monitor
access:Value Range
0:0 - 99:59
Units
Min:Sec
In the intelligent mode this parameter sets the maximum allowable time allowed tocomplete the sensor exposure and control operation. The STC-2000A will go into timepower when outside the time limit.
______________________________________________________________________
Parameter 36 Measurement Fail Proc
XFMD xtal fail mode, stop or complete on time power
access:Value Range
0,1
Units
0 is Abort On Fail, 1 is Complete On Time PowerThis parameter allows the user to select the system execution path if it is no longer
possible to get reliable measurement information from the sensor system. This is the lastresort choice that will be made after all other system configuration options have been
exhausted. A choice of zero (0) will abort the deposition and set the output power to zero.
A choice of one (1) will set the unit into a time power completion mode. In this mode thelast reliable control power level will be maintained and thickness accumulation will occur
in a simulated fashion until the final thickness setpoint is reached. Post deposition
processing then will occur as programmed.
______________________________________________________________________(Obsolete)
Parameter 37 Xtal Backup ModeOBSO Was crystal backup switch desired yes/noaccess:Value Range
0,1
Units
0 is Off, 1 is On
This parameter allows crystal sensor switching to automatically take place if a sensor
failure of any type is determined. Thickness and rate control is maintained during theoperation.
______________________________________________________________________
Parameter 38

SECTION 6.XX

Ctl Loop Qual

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p STC-2000A DEPOSITION CONTROLLER yaccess:
CLQU control loop quality limit
Value Range
0-9
Units
None
This parameter is used to set a threshold on acceptable control loop quality. When thethreshold is exceeded a sensor fail condition is assumed and the system will process thiscondition as configured. A programmed value of 0 disables this test. A value of one
gives the tightest limits (5%).
______________________________________________________________________
Parameter 39 Xtal Stability
access:XLQU crystal oscillation quality limit
Value Range
0-9
Units
None
This parameter is used to set a threshold on acceptable sensing crystal performance.
When the threshold is exceeded a sensor fail condition is assumed and the system willprocess this condition as configured. A programmed value of 0 disables this test. A valueof one gives the tightest limits.
______________________________________________________________________
Parameter 40 Xtal Life Bounds
access:
LIFB life bounds for I/O event
Value Range
0.0 - 100.0
Units
Percent
This parameter is used to provide a setpoint on the allowable sensing crystal usage. This
setpoint may be utilized through the I/O system as a warning or interlock that sensing
crystals need attention.
______________________________________________________________________
Parameter 41 Plot Vertical Scale
access:VSCL vertical scale units, 1..5..10..etc.
Value Range
0-4
Units
1,5,10,50,100 Å/s Or % Power As Selected
This parameter sets the vertical scale factor of the graphics display on the RunTime
screen.
______________________________________________________________________
Parameter 42 Plot Horizontal Scale
HSPL horizontal sampling, 1,2,3.. samples per point
access:Value Range
1-600
Units
Samples Per Display Point
This parameter sets the horizontal sweep rate of the graphics display on the RunTime
screen. Samples are taken at a rate of 4 per second. A programmed value of 1 will display
every sample. The x-axis is 200 samples wide on the RunTime display.
______________________________________________________________________
Parameter 43 Data Plot TypeIPLT initial plot variable, chosen at start time
access:Value Range
0-2
Units
0 is Rate, 1 is Rate Deviation, 2 is PowerThis parameter selects the type of information to be displayed on the RunTime graphics
screen.
______________________________________________________________________
Parameter 44
access:Value Range

SECTION 6.XX

Source Sensor MAP SELECTSMAP Source/Sensor map associated, 1..30

1 - 30page 213 of 292

p STC-2000A DEPOSITION CONTROLLER y
Units
map#
This parameter selects the map that is to be associated with film that invokes it.
______________________________________________________________________
Parameter 45 POCKET SELECT
access:PSEL Pocket select 0..63
Value Range
0 – 63
Units
Pockets
This parameter selects the type of information to be displayed on the RunTime graphics
screen.
______________________________________________________________________
Parameter 46 ETCHING MODE
access:
FRATDR Film Rate Direction/EtchMode if true, otherwise deposit.
Value Range
OFF/ON
Units
None
When ON, this parameter selects the deposition controller perspective such that anegative (etching) process will be indicated with positive values and that setpoints, etc.
will trigger based on these values. When OFF deposition will be indicated with positive
values.
______________________________________________________________________

Read, Write Film Parameters Examples
Command Examples
Command
Response
Description

A1 25 or A 1,25 or A 1 25
A0.0
To Request Film 1, Parameter 25 The Max. Power Limit Parameter. The Current
Parameter Setting, In This Case 0.0 %.

Command
Response
Description

A9 18
A0
To Request Film 9, Parameter 18, Rate Ramp Mode. Rate Ramp Mode is Off.

Command
Response
Description

B1 25=50.2 or B 1,25 = 50.2
A
To Set Film 1, Parameter 25 (The Max. Power Limit Parameter) To 50.2 %. Message
Understood And Accepted.

Command
Response
Description

B1 25=100.4
H
To Set The Parameter To A Value Exceeding 100%, Which is Illegal! Response is
Signifying An Illegal Data Value Being Used, command ignored.

Table 6.4: Group 2 Examples.
____________________________________________________________________________________________________________________________________________
Read, Write System Parameters

SECTION 6.XX

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p STC-2000A DEPOSITION CONTROLLER y
SECTION 6.8

Read, Write System Parameters Group 3-Commands C & D(C)Read system parameters. These commands read the system oriented commands, that is those notassociated with any film. The group command is the letter C followed by a system parameter
number.
(D)
Write System Parameters. These commands are used to set the system parameters. The groupcommand is the letter D followed by the system parameter number, the character "=", and the data
value.
______________________________________________________________________
Command:Mnemonic:
Parameters:
Description:

C
EXCT_rdsp (read system parameters)[2..32] corresponding to system parameter types AFILM..REQMEMMOD .
Requests a read back from the selected system parameter value. See the list ofparameters and the corresponding ident code below.

Returns:[RZCD_AOK][param_value] if proper parameter id was sent. Exact format of[param_value] depends on the particular parameter for which the data wasrequested.
[RZCD_ILDV] if improper value for parameter argument.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..
______________________________________________________________________
Command:Mnemonic:
Parameters:

Description:

D
EXCT_wrsp (write system parameters)[2 .. 32] [assign_delim] [desired_value] corresponding to parameter types
AFILM..REQMEMMOD as in C command above. The desired_value is a numeric
data item of proper range and representation (# of decimals points, etc..) used to
update or change the value of the parameter to. This value is expressed in the samemanner as returned to the host when a C type command is issued (See A and B
commands above).
Command to set or store a new parameter value into one of the system parametervariables.

Returns:[RZCD_AOK] (A or B) if correctly processed.
[RZCD_ILDV] if improper value for parameter argument.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..
[RZCD_INHB] if chosen parameter can not be programmed at this time. Thisapplies to run number, active film or process, system configuration, etc..

Commands C and D, System Parameters
Parameter 1
Rate sample able, dual sensor able, shutter delay able
access value:
OBSO Was CNFG, no longer used.
Value Range
0-1
Units
On / Off______________________________________________________________________
Parameter 2
access value:
Value Range
Units

SECTION 6.XX

Active Process Number
AFILM active film / or active process, depending on sequencing
1 To 9None

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p STC-2000A DEPOSITION CONTROLLER y
Read or set the process number that is currently active. The set command is inhibited if a process isrunning.
______________________________________________________________________
Parameter 3
Process Run Number
access value:
RUNNO run number
Value Range
0 To 9999
Units
None
Read or set the run number. The set command is inhibited if a film is running.
______________________________________________________________________
Parameter 4
Password Lock # - Parameters And Executive
access value:
LOCKN param & exec lock number
Value Range
0 To 9999
Units
None
This allows certain areas of the STC-2000A to be restricted to those people knowing the password code. If
this is programmed with a non-zero value the value enables the password function and is itself thepassword. Whenever accessing a menu that can change a parameter, the STC-2000A will ask for the
password.
______________________________________________________________________
Parameter 5
Password Lock # - I/O And Communications
access value:
COMLOK I/O and communications lock code
Value Range
0 To 9999
Units
None
This allows certain areas of the STC-2000A to be restricted to those people knowing the password code. If
this is programmed with a non-zero value the value enables the password function and is itself thepassword. Whenever accessing a menu that can change an I/O programming parameter or acommunications parameter, the STC-2000A will ask for the password.
______________________________________________________________________
Parameter 6
NAaccess value: OBSO Was control loop polarity______________________________________________________________________
Parameter 7
Control F.S. Volt
Control Loop Full Scale Voltage
access value:
OBSO Was control loop full scale volts choice
Value Range
0 , 1 or 2
Units
0 = 2 Volts, 1 = 5 Volts, 2 = 10 Volts
This scales the control voltage of the STC-2000A to match your power supply. While most supplies are set
to -10 volts for full power, not all are. This allows 100% power from the STC-2000A to be either 2, 5, or
10 volts.
______________________________________________________________________
Parameter 8
Rate Directionaccess value:
OBSO Was rate direction, positive, negative
Value Range
0,1
Units
0 = Positive, 1 = Negative
This parameter sets the STC-2000A for either a deposit mode (positive) or an etch mode (negative).
______________________________________________________________________
Parameter 9
access value:
Value Range
Units

SECTION 6.XX

Recorder Function
ARFNC analog recorder function select, ARFC_class RATE/RDEV/PWRL THIK/REMOTE/IOACC/NONE

0 To 60=Rate, 1=Rate Deviation, 2=Power, 3=Thickness, 4=Computer Remote, 5=I/O Control, 6=Off

page 216 of 292

p STC-2000A DEPOSITION CONTROLLER y
There are 2 analog outputs on the STC-2000A. One analog output per STC-2000A can be used as arecorder output. You may program one of seven variables to appear on this output. These are absoluterate, rate deviation, power, thickness, remote computer or off.
______________________________________________________________________
Parameter 10 Clock Time
access value:
RTHST real time hours:minutes set param access id.
Value Range
00:00 - 23:59
Units
Hours:Minutes______________________________________________________________________
Parameter 11 Clock Date
access value:
RTCLS real time date set MMDDYY 010100 .. 123199. param access id.
Value Range
010189 To 123188
Units
Month Day Year
These 2 parameters program the clock of the STC-2000A. These are used in the process accounting mode.
The format for the time is 24 hour time. One O'clock in the afternoon is 13:00. The date is programmed inmonth-day-year format without any separators. You need to enter any zeros in the day (March 5th is '05',
not just '5'). The range of dates is from 01/01/1989 through 12/31/2088______________________________________________________________________
Parameter 12 LCD Contrast/Bias Control
access value:
CRTL crt control, 1 of 3, 0=dim, 1=medium, 2=bright.
Value Range
1,2,3
Units
LOW, MEDIUM, HIGH
This parameter adjusts the contrast/bias of the LCD.
______________________________________________________________________
Parameter 13 Beeper Control
Enabling The Beeper
access value:
BEEP beep, on/off type 0=off, 1=on.
Value Range
0 To 1Units
0 is Off, 1 is On
This parameter controls if the beeper of the STC-2000A is turned On or Off.
______________________________________________________________________
Parameter 14
access value:

Baud Rate
BAUD baud , 1 of 4, 0=300, 1=1200, 2=2400, 3=9600. Takes effect immediately. This
will most likely break current communication
Value Range
0 To 3Units
0 is 300, 1 is 1200, 2 is 2400, And 3 is 9600 BaudThis parameter controls the baud rate of the STC-2000A. It takes effect immediately. This likely means
future communications will fail until the host is set to the new value.
______________________________________________________________________
Parameter 15 Protocol Selection
Communications Protocol Selectionaccess value:
PROT protocol, selection, SYCON(0)/SECS(1), requires reset.
Value Range
0,1,2
Units
0,1 is Sycon Protocol, 2 is ASCII Protocol
This parameter selects which RS-232 protocol will be used, either Sycon or simple ASCII. It takes effectonly during a power up condition.
______________________________________________________________________
Parameter 16
NAaccess value: OBSO Was secs address.
______________________________________________________________________
Parameter 17

SECTION 6.XX

NA

access value: OBSO

Was link mode.

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p STC-2000A DEPOSITION CONTROLLER y______________________________________________________________________
Parameter 18
NAaccess value: OBSO Was ieee-488 address.
______________________________________________________________________
Parameter 19
NAaccess value: OBSO Was bit bus address.
______________________________________________________________________
Parameter 20
NAaccess value: OBSO Was gpib checksum control param code.
______________________________________________________________________
Parameter 21
NAaccess value: OBSO Was line frequency param code.
______________________________________________________________________
Parameter 22 Sequence Inhibit
Inhibit Sequence Mode
access value:
SQINH sequence inhibit, set true when cant sequence, Needs reset.
Value Range
0,1
Units
None
This parameter (when set to 1) allows a STC-2000A to operate like a non SQ. This can be polled/set via
RS232 or changed on the SERVICE menu (see Section 2).
______________________________________________________________________
Parameter 23
access value:
Units

Recorder Out Channel
ROUTS Analog output channel select, when ARFNC not off, then active datalogging
value output to analog channel 1 or 2 providing no conflict with process control.
None
1 – 2 selects an analog output channel for use (if not off and not used as a source)______________________________________________________________________
Parameter 24 N.A.
______________________________________________________________________
Parameter 25 N.A.
______________________________________________________________________
Parameter 26 N.A.
______________________________________________________________________
Parameter 27 N.A.
______________________________________________________________________
Parameter 28 I/O Slot 1 Typeaccess value:
REQIO1 Require Input/Output 1 in system, CFGIOS_class DSBL/Inp/Outp
Value Range
UNUSED (DISABLED) / INPUT / OUTPUT
Units
None
______________________________________________________________________
Parameter 29 I/O Slot 2 Typeaccess value:
REQIO2 Require Input/Output 2 in system, CFGIOS_class
Value Range
UNUSED (DISABLED) / INPUT / OUTPUT
Units
None
______________________________________________________________________
Parameter 30
access value:
Value Range

SECTION 6.XXI/O Slot 3 TypeREQIO3 Require Input/Output 3 in system, CFGIOS_class
UNUSED (DISABLED) / INPUT / OUTPUT

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p STC-2000A DEPOSITION CONTROLLER y
Units
None
______________________________________________________________________
Parameter 31 I/O Slot 4 Typeaccess value:
REQIO4 Require Input/Output 4 in system, CFGIOS_class
Value Range
UNUSED (DISABLED) / INPUT / OUTPUT
Units
None
______________________________________________________________________
Parameter 32 Memory Module IFC
REQMEMMOD Require memory module option installation. Not auto detectable Boolean 1/0 True/False.
access value:
Value Range
OFF/ON
Units
None____________________________________________________________________________________________________________________________________________
Read, Write System Parameters Command Examples
Command
C10 or C 10
Response
A15:33
Read system parameter # 10, system clock time. Result is 15:33 hrs:mins, 3:33 p.m. time.
Description
Command
Response
Description

C18
A5
Read system parameter # 18, NA.

Command
Response
Description

D11 = 70689
A

Command
Response
Description

D 14= 1
A (Possible missed due baud change)
Set baud rate 1200 baud.

Set system parameter 11, calendar date to July 6, 1989. Command received and accepted.

Table 6.5: Group 3 Examples.
____________________________________________________________________________________________________________________________________________

Read RunTime Data

Read RunTime Data Group 4 -Command E(E)

Read RunTime Data. These commands are used for reading back real time numerical informationfrom STC-2000A. This includes information such as rate, thickness, power, etc. The groupcommand is the letter E followed by a parameter number.

Command:Mnemonic:
Parameters:
Description:

E
EXCT_rdata (read runtime data)[1..61] corresponding to real time data types PWRLVL..XSTAB8 .
Requests a read back of real time (not fixed parameters) system data. See the list ofdata and the corresponding ident code below.

Returns:

SECTION 6.XX

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p STC-2000A DEPOSITION CONTROLLER y[RZCD_AOK][data_value] if proper data # (1..13) id was sent. Exact format of [data_value]depends on the particular parameter for which the data was requested.
[RZCD_ILDV] if improper value for parameter argument.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..

Command E, Read RunTime Data Parameters______________________________________________________________________
Parameter 1
Power Level Output
access index:
PWRLVL power level, in units of .1 percent, 0.. 1000, of active source.
Value Range
0 To 1000
Units
10 X Percent
This parameter reads the current power being supplied to the active control output. It is in percent of fullscale x 10. If the number 123 is returned, this represents 12.3%.
______________________________________________________________________
Parameter 2
Deposition Rate
access index:
RATEVL rate value, +- 0 .. 999.9 A/s, as 0 .. 9999
Value Range
0 To 9999
Units
10 X Å/s
This is the current deposition rate as is displayed on the RunTime display. If the number 123 is returned,
this represents 12.3 Å/s.
______________________________________________________________________
Parameter 3
Thickness
access index:
THKVL thickness value, angstroms, 0 .. +- 999999
Value Range
0 To 999999
Units
Angstroms
This is the current thickness value as is displayed on the RunTime display. The units that are displayed arein KÅ, but the units sent across the computer interface are in angstroms. A number returned of 1234 means
1.234 KÅ.
______________________________________________________________________
Parameter 4
Phase Timeraccess index:
PHSTMR phase timer, counts up or down
Value Range
0 To 5999
Units
Seconds
This returns the time into the current phase (such as deposit). This is similar to the number on the RunTime
display, except that the time is in seconds instead of minutes:seconds.
______________________________________________________________________
Parameter 5
Running Timeraccess index:
RUNTMR running timer, counts up
Value Range
0 To 5999
Units
Seconds
This returns a general timer function that is always running during a process. It pegs at 5999 and resets
when you start a new process.
______________________________________________________________________
Parameter 6
access index:
Value Range
Units

SECTION 6.XX

Rate Deviation
RDEVTN rate deviation value, +- 0 .. 999.9 A/s, as 0 .. 9999
0 To ±9999
10 X Å/spage 220 of 292

p STC-2000A DEPOSITION CONTROLLER yThis parameter returns the current deviation from the programmed rate setpoint. A negative number
indicates the actual value is below the programmed one. A returned number of -123 indicates that the rate
is 12.3 Å/s below whatever the programmed value is.
______________________________________________________________________
Parameter 7
Crystal Life (primary sensor)
access index:
XLIFE crystal life value, 0..99 percent., primary crystal.
Value Range
0 To 99
Units
Percent
This parameter returns the percentage of the crystal life that is left on the primary crystal sensor. It is thesame number as on the RunTime display.
______________________________________________________________________
Parameter 8
Sensor Channel And Status (active channel)
access index:
XCHNL crystal channel in use.
Value Range
0 To 5Units
None
This is a composite number where the lsb is 0 for sensor 1 selected, 1 for sensor 2 selected; bit 1 is 0 if thesensor is not good, 1 if it is good; and bit 2 is 0 if the sensor has not failed, and 1 if the sensor has failed. If
bits 1 and 2 are both 0, this indicates that the sensor status is unknown.
______________________________________________________________________
Parameter 9
Crystal Stability Value
access index:
XSTAB crystal stability value
Value Range
0 To 99
Units
None
The tens digit of this number is incremented when the stability level is violated. The units digit indicates
10 x of range violated to get to the next stability level.
______________________________________________________________________
Parameter 10 Process Quality Value
access index:
PQUAL process quality value
Value Range
0 To 99
Units
None
The tens digit of this number is incremented when the quality level is violated. The units digit indicates 10
x of range violated to get to the next quality level.
______________________________________________________________________
Parameter 11 Control Quality Value
access index:
CQUAL control quality, instantaneous
Value Range
0 To 99
Units
Percent
This parameter indicates how good the control loop is. It is the deviation expressed as a percentage of the
setpoint.
______________________________________________________________________
Parameter 12 Sample Hold Time
access index:
SHTIME sample hold time
Value Range
0 To 5999
Units
Seconds
This is the time remaining in the current sample/hold phase.
______________________________________________________________________
Parameter 13
access index:

SECTION 6.XX

Crystal Frequency
FREQ Crystal Frequency 5 Mhz to 6 Mhz to .1 hertz, 0 if bad. from primary (when not
averaging) sensor crystal.

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p STC-2000A DEPOSITION CONTROLLER y
Value Range
5000000.0…6000000.0, 0.0 if bad crystal
Units
Hz
This is the measured frequency of the active sensing crystal.
______________________________________________________________________
The following parameters (14-61) are the values as reported by physically present and enabled source
sensor card[s].
______________________________________________________________________
Parameter 14 Crystal frequency from Sensor 1
access index:
FREQ1 Crystal frequency from Sensor 1 in centiHz (0.01Hz) resolution.
Value Range
500,000,000-600,000,000
Units
centiHz (0.01Hz)
Crystal frequency from Sensor 1 in centiHz (0.01Hz) resolution [6 MHz looks like 600,000,000].
Associated card needs to be physically installed and enabled before a reboot.
______________________________________________________________________
Parameter 15 Crystal frequency from Sensor 2
access index:
FREQ2 Crystal frequency from Sensor 2 in centiHz (0.01Hz) resolution.
Value Range
500,000,000-600,000,000
Units
centiHz (0.01Hz)
Crystal frequency from Sensor 2 in centiHz (0.01Hz) resolution [6 MHz looks like 600,000,000].
Associated card needs to be physically installed and enabled before a reboot.
______________________________________________________________________
Parameter 16 N.A.
______________________________________________________________________
Parameter 17 N.A.
______________________________________________________________________
Parameter 18 N.A.
______________________________________________________________________
Parameter 19 N.A.
______________________________________________________________________
Parameter 20 N.A.
______________________________________________________________________
Parameter 21 N.A.
______________________________________________________________________
Parameter 22 source 1 power level
access index:
POWR1 power level, in units of .1 percent, 0.. 1000, of source 1.
Value Range
0 to 1000
Units.1 Percent
source 1 power level in units of .1 percent [100% looks like 1000]. Associated card needs to be physicallyinstalled and enabled before a reboot.
______________________________________________________________________
Parameter 23
access index:
Value Range
Units

SECTION 6.XX

source 2 power level
POWR2 power level, in units of .1 percent, 0.. 1000, of source 2.
0 to 1000.1 Percent

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p STC-2000A DEPOSITION CONTROLLER ysource 2 power level in units of .1 percent [100% looks like 1000]. Associated card needs to be physicallyinstalled and enabled before a reboot.
______________________________________________________________________
Parameter 24 N.A.
______________________________________________________________________
Parameter 25 N.A.
______________________________________________________________________
Parameter 26 N.A.
______________________________________________________________________
Parameter 27 N.A.
______________________________________________________________________
Parameter 28 N.A.
______________________________________________________________________
Parameter 29 N.A.
______________________________________________________________________
Parameter 30 Sensor 1 thickness
access index:
THICK1 thick from sensor.
Value Range
0 To 999,999
Units
Angstroms
Thickness from sensor 1. 1 of 8 in a contiguous block. Associated card needs to be physically installed andenabled before a reboot.
______________________________________________________________________
Parameter 31 Sensor 2 thickness
access index:
THICK2 thick from sensor.
Value Range
0 To 999,999
Units
Angstroms
Thickness from sensor 2. 2 of 8 in a contiguous block. Associated card needs to be physically installed andenabled before a reboot.
______________________________________________________________________
Parameter 32 N.A.
______________________________________________________________________
Parameter 33 N.A.
______________________________________________________________________
Parameter 34 N.A.
______________________________________________________________________
Parameter 35 N.A.
______________________________________________________________________
Parameter 36 N.A.
______________________________________________________________________
Parameter 37 N.A.
______________________________________________________________________SECTION 6.XX

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p STC-2000A DEPOSITION CONTROLLER yParameter 38 rate from sensor 1
access index:
RATE1
Value Range
0 To 9999 [integer]
Units
Deci-angstroms/sec
The rate reported from sensor 1 with 9999 representing 999.9 Å/S. 1 of 8 in a contiguous block. Associatedcard needs to be physically installed and enabled before a reboot.
______________________________________________________________________
Parameter 39 rate from sensor 2
access index:
RATE2
Value Range
0 To 9999 [integer]
Units
Deci-angstroms/sec
The rate reported from sensor 2 with 9999 representing 999.9 Å/S. 2 of 8 in a contiguous block. Associatedcard needs to be physically installed and enabled before a reboot.
______________________________________________________________________
Parameter 40 N.A.
______________________________________________________________________
Parameter 41 N.A.
______________________________________________________________________
Parameter 42 N.A.
______________________________________________________________________
Parameter 43 N.A.
______________________________________________________________________
Parameter 44 N.A.
______________________________________________________________________
Parameter 45 N.A.
______________________________________________________________________
Parameter 46 xtal life/status from sensor 1
access index:
XLIFE1
Value Range
0 To 99
Units
Percent
xtal life/status from sensor 1. This parameter along with the following seven parameters form a contiguous
block of 8. Associated card needs to be physically installed and enabled before a reboot.
______________________________________________________________________
Parameter 47 xtal life/status from sensor 2
access index:
XLIFE2
Value Range
0 To 99
Units
Percent
xtal life/status from sensor 2. 2nd in a contiguous block of 8. Associated card needs to be physicallyinstalled and enabled before a reboot.
______________________________________________________________________
Parameter 48 N.A.
______________________________________________________________________
Parameter 49 N.A.
______________________________________________________________________SECTION 6.XX

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p STC-2000A DEPOSITION CONTROLLER yParameter 50 N.A.
______________________________________________________________________
Parameter 51 N.A.
______________________________________________________________________
Parameter 52 N.A.
______________________________________________________________________
Parameter 53 N.A.
______________________________________________________________________
Parameter 54 xtal stability accumulated from sensor 1
access index:
XSTAB1
Value Range
0 To 9Units
None
1 of 8 in a contiguous block. Associated card needs to be physically installed and enabled before a reboot.
______________________________________________________________________
Parameter 55 xtal stability accumulated from sensor 2
access index:
XSTAB2
Value Range
0 To 9Units
None
2 of 8 in a contiguous block. Associated card needs to be physically installed and enabled before a reboot.
______________________________________________________________________
Parameter 56 N.A.
______________________________________________________________________
Parameter 57 N.A.
______________________________________________________________________
Parameter 58 N.A.
______________________________________________________________________
Parameter 59 N.A.
______________________________________________________________________
Parameter 60 N.A.
______________________________________________________________________
Parameter 61 N.A.
_____________________________________________________________________
Read RunTime Data Command Examples
CommandE3 or E 3
Response
A-1
Description
Read Deposition Thickness In Angstroms. Thickness is Minus 1 Angstrom.
Command
E4
Response
A93
Description
Read Phase Timer. Timer is 93 Seconds, Or 1 Minute, 33 Seconds.
Table 20.2: Group 4 Examples.
______________________________________________________________________SECTION 6.XX

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p STC-2000A DEPOSITION CONTROLLER y

Read, Set Status Information

Read, Set Status Information Group 5-Commands F & G(F)Read Status Information. These commands will read certain status data from the STC-2000A.
This includes information such as whether the unit is stopped, what film is active, is the unit at max. power,
etc. This information is in a more condensed form then available through the I/O system. The command is
the letter F followed by a parameter number.
(G)
Set Status Information. This forces certain status to occur in the STC-2000A. The groupcommand is the letter G followed by {1|2|3|17|21|22|23|24} = {0|1|2|3}. Note: 2,3 only allowed on G3 =form. There are only 8 parameter options in this group.

Command:Mnemonic:
Parameters:
Description:

F
EXCT_rstat (read status)[1..66] corresponding to system status types SKHLD..LAUNCHFNO
Requests a read back of status information regarding the current operating
status of the instrument.

Returns:[RZCD_AOK][status_value] if proper type # (1..66) id was sent. Exact value of[status_value] depends on the particular parameter for which the data was requested.
[RZCD_ILDV] if improper value for parameter arguments.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc.
______________________________________________________________________
Command:Mnemonic:
Parameters:

G
EXCT_wstat (write status)[1,2,3,17,21,22,23,40,66] [assign_delim] [status_value] with 1,2,3,...40,60
corresponding to system status types SKHLD..MCTL, FLMHLD, JAMZPR,
ATRATE, ZERO, IO_SCALAR_ANALOG and LAUNCHFNO. The status_value isthe new intended status value for the status parameter to take on.
Description: Command allowing certain internal status conditions (SKHLD, FORSPL, MCTL,FLMHLD, JAMZPR, ATRATE, ZERO, XTST, IO_SCALAR_ANALOG and
LAUNCHFNO) to be set to specific status values via the communications interface. See the Fcommand for status read for valid range of [status_value] argument for a given value of thestatus variable selection index (SKHLD, FORSPL, MCTL, FLMHLD, JAMZPR, ATRATE,
ZERO, IO_SCALAR_ANALOG, LAUNCHFNO ).
Returns:[RZCD_AOK] if proper type # (1..3,17,21,22,23,40,66) id and proper [status_value] was sent.
Exact format of [status_value] depends on the particular status variable for which the data
is being set to.
[RZCD_ILDV] if improper value for parameter arguments.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc.
____________________________________________________________________________________________________________________________________________
Commands F and G, Status Information Parameters

SECTION 6.XX

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p STC-2000A DEPOSITION CONTROLLER yParameter 1
Soak Hold Status
Value Range
0,1
Units False/TrueThis parameter indicates if a soak hold state is requested. A value of 1 returned indicates that it isrequested. A setting of true means that the soak 2 phase will be held overtime and prevented from entering
the deposit phase until the soak-hold is released (made false). This status and others are alterable via G
and/or I/O logic.
access: SKHLD soak hold status control variable, false(0)/true(1) status. program will stop at SOAK
HOLD state prior to deposition if this status was true(1). Requires an event trigger to break out of film hold
(RLSSKHLD event).
0 SKHLD_FALSE
1 SKHLD_TRUE______________________________________________________________________
Parameter 2
Forced Sample
Value Range
0,1
Units Off / On
This parameter indicates if a forced sample state is in progress. A value of 1 returned indicates that aforced sample condition is desired. This state can be changed from the computer interface (G2), I/O logic,
or front panel (hold/release ‘8’ key) when on RunTime screen.
access: FORSPL forced sample, false(0)/true(1) status.
0 FORSPL_off
1 FORSPL_on______________________________________________________________________
Parameter 3
Manual Controller Status
Value Range
0 To 3
Units None
This parameter indicates the last status of the manual hand controller according to the following values:0
At Rest1
Both Up And Down (zero power without aborting)
2
Up
3
Down
These are for simulating the hand controller through the computer interface only. This parameter does notreflect the physical status of the hand controller.
access: MCTL manual controller status, 0..3 for at rest, Both, Up, Down.
0 MCTL_ATRST
1 MCTL_ZERO
2 MCTL_UP
3 MCTL_DWN______________________________________________________________________
Parameter 4
Manual Mode Active
Value Range
0,1
Units False/TrueThis parameter indicates if the STC-2000A is in the manual mode. A returned value of 1 indicates that it isin manual. This is a read only parameter, not available for G command.
access: MANL system in manual mode false(0)/true(1).
0 MANL_FALSE
1 MANL_TRUE______________________________________________________________________
Parameter 5
Value Range
Units None

SECTION 6.XX

Stopped Mode0 To 6page 227 of 292

p STC-2000A DEPOSITION CONTROLLER yThis parameter is used to indicate that the STC-2000A is in a stopped state. The following returned values
are:0
Stopped From A Power Up Condition
1
Stopped From A Crystal Bad Condition2
Stopped From The I/O System Or Computer
3
Stopped From The Front Panel Key
4
Stopped From A Max. Power Condition
5
Stopped From The Hand Controller Button
6
Not Stopped
This is a read only parameter.
access: SMODE Stop mode, set when a stop event declared, set to one of the following STPCD_ types.
0 STPCD_CLEAN stopped at power up, no reason yet.
1 STPCD_GONE
when stop condition cleared.
2 STPCD_XBAD
crystal head or heads bad.
3 STPCD_RMOTE remote from I/O system.
4 STPCD_FPNL
front panel.
5 STPCD_MAXP
max power condition persisted too long.
6 STPCD_PEND
remote pendant stop.
7 STPCD_UIFLST user interface presence lost.
8 STPCD_MEASCRIT critical measurement failure, comm lost to S4 card required for usage per config.
9 STPCD_IOCRIT critical I/O failure, comm lost to I/O or a detectable/unrecoverable failure.
10 STPCD_BHIE_ERR Bus Hold Integrity error failure caused.
11 STPCD_INDEXER_FAIL Rotator failed to signal done in time.
12 STPCD_INVALID_SRC Invalid source programmed in recipe.
13 STPCD_INVALID_SNS Invalid sensor channel in recipe.
14 STPCD_IO_AX1 Auxiliary I/O stop 1.
15 STPCD_IO_AX2 Auxiliary I/O stop 2.
16 STPCD_IO_AX3 Auxiliary I/O stop 3.
17 STPCD_IO_AX4 Auxiliary I/O stop 4.
18 STPCD_QUALDLY Shutter delay quality failure
19 STPCD_QUALDEP Deposition quality failure.
______________________________________________________________________
Parameter 6
Active Film Number
Value Range
1 To 50
Units Film NumberThis parameter returns the current active film number. This is a read only parameter.
access: AFPN active film processing # 1..50.
______________________________________________________________________
Parameter 7
Running A Process (Process Running Flag)
Value Range
0,1
Units False / True
This parameter indicates that a process is running. A returned value of 1 indicates that a process is running.
This is a read only parameter.
access: RNMD true when sequencer running a process, false(0)/true(1) false when at rest.
0 RNMD_FALSE
1 RNMD_TRUE______________________________________________________________________
Parameter 8
Substrate Shutter Status
Value Range
0,1
Units Closed, OpenThis parameter indicates if the substrate shutter is open or closed. A returned value of 0 indicates that the
shutter is closed and a value of 1 indicates that it is open. This is a read only parameter.

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p STC-2000A DEPOSITION CONTROLLER yaccess: SRCSHUT bitmap true(1) when source shutter open, false(0) if closed. One per active source ident(1..8) LSB to MSB. In non-codeposition systems, only one shutter can be open at any one time.
0 ALL SOURCE SHUTTERS CLOSED
1 Source # 1 SRCSHUT OPEN
2 Source # 2 SRCSHUT OPEN
4 Source # 3 SRCSHUT OPEN
8 Source # 4 SRCSHUT OPEN
16 Source # 5 SRCSHUT OPEN
32 Source # 6 SRCSHUT OPEN
64 Source # 7 SRCSHUT OPEN
128 Source # 8 SRCSHUT OPEN
255 ALL SOURCE SHUTTERS OPENED______________________________________________________________________
Parameter 9
Phase Status
Value Range
0 To 17
Units None
This parameter indicates the phase that the STC-2000A is in according to the following Table:
0Power Up
1
Stopped
2
Crystal Verify 3
Rise 1
4
Soak 1 5
Rise 2
6
Soak 2 7
Soak Hold
8
Shutter Delay
9
Deposit
10
Rate Ramp
11
Deposit After Rate Ramp
12
Time Power Recovery
13
Rise 3
14
Idle
15
Idle After Time Power
16
Manual 17
Ready
Table 21.3: Phase Status.
This is a read only parameter.
access: SQPHS sequencer phase, holds one of PCD_class (process code) data.
0 PCD_pup
Power Up.
1 PCD_szp
Stopped/Zero power.
2 PCD_bxvfy Crystal Verify.
3 PCD_ris1
Rise 1.
4 PCD_sok1
Soak 1.
5 PCD_ris2
Rise 2.
6 PCD_sok2
Soak 2.
7 PCD_skhl
Soak Hold.
8 PCD_sdly
Shutter Delay.
9 PCD_dpos
Deposit.
10 PCD_rtrp
Rate Ramp.
11 PCD_dpo2
Deposit phase after a rate ramp
12 PCD_tpwr
Time power recovery phase
13 PCD_ris3
Idle ramp.
14 PCD_idlpr Idle power after successful deposit.
15 PCD_idltp Idle after ending deposit with a time/power phase.
16 PCD_manl
Manual phase
17 PCD_rdy
Ready phase
18 PCD_index Indexing to pocket
19 PCD_fhold Film Holding before rise/soaks.
______________________________________________________________________
Parameter 10
Crystal Shutter Status
Value Range
0,1
Units Open, Closed
This parameter indicates if the crystal shutter is closed. A returned value of 0 indicate that the shutter isopen (making measurements) and a value of 1 indicates that it is closed. This is a read only parameter.

SECTION 6.XX

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p STC-2000A DEPOSITION CONTROLLER yaccess: XTLSHUT xtal shutter state, true(1) when using a xtal, false(0) when ignoring data from crystal,
shuttered off. Identical to XTLUSMAP except during sample/hold mode, sensors mapped off to 0 whenhiding. One per active sensor ident (1..8) LSB to MSB.
0 ALL SENSOR SHUTTERS CLOSED, SENSORS NOT USED
1 Sensor # 1 XTLSHUT OPEN
2 Sensor # 2 XTLSHUT OPEN
4 Sensor # 3 XTLSHUT OPEN
8 Sensor # 4 XTLSHUT OPEN
16 Sensor # 5 XTLSHUT OPEN
32 Sensor # 6 XTLSHUT OPEN
64 Sensor # 7 XTLSHUT OPEN
128 Sensor # 8 XTLSHUT OPEN
255 ALL SENSOR SHUTTERS OPENED______________________________________________________________________
Parameter 11
Sample/Hold Status
Value Range
0 To 2
Units None
This parameter indicates the status of sample/hold operation according to the following table:0
Sample/Hold Not Active
1
Sampling
2
Holding
This is a read only parameter.
access: SPLHLD sample hold status, of SPLHLD_class.
0 SPLHLD_NUL not being cycled, so current state not important.
1 SPLHLD_SAM sampling, xtal being read for control.
2 SPLHLD_HOL holding, xtal being covered, pretend rate being used to accumulate thickness.
______________________________________________________________________
Parameter 12
Max. Power Limit Status
Value Range
0,1
Units False / True
This parameter indicates if the STC-2000A is at the max. power limit (indicated by a flashing power valueon the RunTime display). A value of 0 returned indicates that the STC-2000A is not at the max. power
limit. This is a read only parameter.
access: MAXPL true(1)/false(0) if at max power limit now. One per active source ident (1..8) LSB to
MSB.
0 No sources at MAX power limit.
1 Source # 1 at Max Power limit.
2 Source # 2 at Max Power limit.
4 Source # 3 at Max Power limit.
8 Source # 4 at Max Power limit.
16 Source # 5 at Max Power limit.
32 Source # 6 at Max Power limit.
64 Source # 7 at Max Power limit.
128 Source # 8 at Max Power limit.
255 ALL sources at MAX power limit.
______________________________________________________________________
Parameter 13
Non-Volatile Memory Status
Value Range
0 To 7
Units None
This parameter indicates the status of non-volatile memory according to the following Table:
0
Everything OK
1
Film Parameter Error
2
I/O Program Error

SECTION 6.XX

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p STC-2000A DEPOSITION CONTROLLER y
4
Process Accounting Error
8
Process Sequence
The values are added together to form a composite error number. A returned value of 5 would indicate that
there was a film parameter error and a process accounting error. This is a read only parameter.
access: VMEMS volatile memory status, bit weight composite which indicates which memory regions
have a failed checksum.
0 VMEMS_aok
All good is 0.
1 VMEMS_fpms
Film params defaulted.
2 VMEMS_iopg
IO program defaulted to empty.
4 VMEMS_pact
Process accounting region data lost.
8 VMEMS_sequ
Process sequence region data lost.
______________________________________________________________________
Parameter 14
Hand Power Pendant INC Button
Value Range
0,1
Units False, True
This parameter is true while the INC button on the hand power pendant is pressed. This is a read only
parameter.
access: PNDUP pendant up power button pushed status, true (1) when pushed.
______________________________________________________________________
Parameter 15
Hand Power Pendant DEC Button
Value Range
0,1
Units False, True
This parameter is true while the DEC button on the hand power pendant is pressed. This is a read only
parameter.
access: PNDWN pendant down power button pushed status, true (1) when pushed.
______________________________________________________________________
Parameter 16
Hand Power Pendant Stop Button
Value Range
0,1
Units False, True
This parameter is true while the STOP button on the hand power pendant is pressed. This is a read only
parameter.
access: PNDSP pendant stop button pushed status, true (1) when pushed.
______________________________________________________________________
Parameter 17
Film Hold
Value Range
0,1
Units False, True
If this parameter is true prior to start of film, film will remain in crystal verify phase until this parameter isfalse. Settable via RS232or I/O Logic. This is a read only parameter.
access: FLMHLD film hold, program will stop at FHOLD state when started if this status was true(1).
Requires an event trigger to break out of film hold (RLSFHLD event).
______________________________________________________________________
Parameter 18
Active Layer
Value Range
0...99Units Process Layer
This parameter reports the active layer as displayed on the screen. If sequence is reset and "#" is displayedon the screen, this parameter is "0". This is a read only parameter.
access: PROCIP process in process. 0 if # on screen, is layer step # if not. Valid range 0..99.
______________________________________________________________________SECTION 6.XX

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p STC-2000A DEPOSITION CONTROLLER yParameter 19
Process Fail
Value Range
0,1,2
Units None
This parameter reports if a process has been terminated by other than normal completion. This is a read
only parameter.
0
Process Not Failed1
Bad recipe, generally no layer programmed in process. Occur at process verify phase after aprocess has been started.
2
Process error- sequence has been aborted due to some failure to complete film or external stop.
access: PRCFAIL PRCFAIL_class value of how process failed if was failed.
0 PRCFAIL_NOFAIL Not failed.
1 PRCFAIL_BADREC Bad recipe, invalid step #/recipe size.
2 PRCFAIL_ABORT Sequence aborted, film stopped.
______________________________________________________________________
Parameter 20
Process/Layer State
Range 0....5
Units None
This parameter reports the phase or state of a layer of process. This is a read only parameter.
0
Process verify- checking to see if process is properly programmed. this occurs at the start of aprocess and is of short duration.
1
Process stopped. Layer 0- this is the normal condition to start a process from its beginning.
2
Layer active, process resting- resetting a process error condition brings the unit to this state. At
this point by using different start functions, the unit can be made to restart the layer, start the next layer, or
reset to layer 0.
3
Process Busy- Process and layer are busy running a film.
4
Process Waiting- a wait has been encountered during the process sequence. A break wait startcommand releases this condition.
5
Process Error
access: LYRCD layer state code, LYRCD_class, vfy, stop, etc
0 LYRCD_vfy
Verifying recipe.Short lived.
1 LYRCD_stop
Process stopped, # displayed.
2 LYRCD_active Process resting.
3 LYRCD_busy
Process Busy, running film.
4 LYRCD_waitchk Process Waiting.
5 LYRCD_error
Error condition.
______________________________________________________________________
Parameter 21
Reset To Zero Power
Value Range
0,1
Units None
This parameter reports if the source control voltage has been set to zero volts by either an I/O or external
command. Settable by computer (G21=0|1), or I/O Logic.
0
Not Set To Zero Volts.
1
Source control voltage has been set to zero volts.
access: JAMZPR Jam zero power, JAMZPR_class, off (0), on (1).
One per active source ident (1..8) LSB to MSB.
0 No sources overiden, source is at system power.
1 Source # 1 overiden to zero power.
2 Source # 2 overiden to zero power.
4 Source # 3 overiden to zero power.
8 Source # 4 overiden to zero power.
16 Source # 5 overiden to zero power.
32 Source # 6 overiden to zero power.
64 Source # 7 overiden to zero power.
128 Source # 8 overiden to zero power.

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p STC-2000A DEPOSITION CONTROLLER y
255 ALL sources overiden to zero power.
______________________________________________________________________
Parameter 22
At Rate (Deposition is at Desired Rate)
Value Range0, 1Units False, True
This parameter is TRUE if the measured rate is equal to the desired rate, else (0) not at desired rate.
access: ATRATE Deposition was at rate, NOT (0), YES (1). Set by measurement once rate is > desired.
Only cleared in I/O program if used by customer. Better to use event code for ATRATE.
______________________________________________________________________
Parameter 23
Allow Zeroing
Value Range0, 1Units False, True
Check if Zeroing allowed when entering deposit. If this parameter is true (1) then Zeroing is inhibited onentering a deposit.
access: ZERO Allow normal zeroing (0=ZERO_NORM) or inhibit it (1=ZERO_SKIP) when entering
deposit.
______________________________________________________________________
Parameter 24
Crystal Test Mode
Value Range0, 1Units False, True
If this parameter is true, a dual sensor configured STC-2000A will successfully start a film with only one
sensor operational (the limp along mode).
access: SCUP_SEES_UIFC Set true when UIFC detected.
______________________________________________________________________
Parameter 25
access: MEAS_DEAD Set true when measurement system fatal failure detected. This is a hardware
problem which is unrecoverable without recycling power and possibly repairing unit.
______________________________________________________________________
Parameter 26
access: UIF_DOGDIE Set true when UIFC dog times out and stop occurs.
______________________________________________________________________
Parameter 27
access: TEST_MODE Set true when the test/simulate mode is active.
______________________________________________________________________
Parameter 28
access: RTRSYNC
Rotator Synchronization needed, 1 per source.
______________________________________________________________________
Parameter 29
access: ACTSRC
Active source being controlled, 1..8.
______________________________________________________________________
Parameter 30
access: NON_SEQ
Non-sequencing when true.
______________________________________________________________________
Parameter 31
access: SA1_POCKET source Channel 1 pocket, 0-63______________________________________________________________________
Parameter 32
access: SA2_POCKET source Channel 2 pocket, 0-63______________________________________________________________________
Parameter 33

SECTION 6.XX

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p STC-2000A DEPOSITION CONTROLLER y
N.A.

______________________________________________________________________
Parameter 34
N.A.

______________________________________________________________________
Parameter 35
N.A.

______________________________________________________________________
Parameter 36
N.A.

______________________________________________________________________
Parameter 37
N.A.

______________________________________________________________________
Parameter 38
N.A.

______________________________________________________________________
Parameter 39
access: AMAPID active map, contains 1..10 indicating current active map.
______________________________________________________________________
Parameter 40
access: IO_SCALAR_ANALOG, numeric value 0..255 which controls a chart recorder analog output value
0..FullScale if chart recorder option set to IOACC control mode.
______________________________________________________________________
Parameter 41
access: LFOVER, xtal life over limit bit map, bits set for xtal channels which are giving valid readings forwhich the life value is less than the limit value in the active film program.
______________________________________________________________________
Parameter 42
access: ZPWRS, bit map of which sources are at 0 power or unused, 1 if source has power or is strip-chart
recorder usage.
______________________________________________________________________
Parameter 43
access: XTLAVAIL, bit map in pairs, shows what modules are avail.
______________________________________________________________________
Parameter 44
access: IO1_MODSTS
I/O slot 1 module status.
______________________________________________________________________
Parameter 45
access: IO2_MODSTS
I/O slot 2 module status.
______________________________________________________________________
Parameter 46
access: IO3_MODSTS
I/O slot 3 module status.
______________________________________________________________________
Parameter 47
access: IO4_MODSTS
I/O slot 4 module status.
______________________________________________________________________
Parameter 48
access: XTLDEADMAP
Bitmap, sensors detected as dead.
______________________________________________________________________
Parameter 49
access: XTLSBYMAP
Bitmap, sensors in standby.
______________________________________________________________________
Parameter 50
access: XTLUSMAP
Bitmap, sensors in use contributing.
______________________________________________________________________
Parameter 51

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p STC-2000A DEPOSITION CONTROLLER yaccess: SA1_HEADSTATE Source Board-A chl1 head status of HSTAT_class______________________________________________________________________
Parameter 52
access: SA2_HEADSTATE Source Board-A chl2 head status of HSTAT_class______________________________________________________________________
Parameter 53
access: SB3_HEADSTATE Source Board-B chl3 head status of HSTAT_class______________________________________________________________________
Parameter 54
access: SB4_HEADSTATE Source Board-B chl4 head status of HSTAT_class______________________________________________________________________
Parameter 55
access: SC5_HEADSTATE Source Board-C chl5 head status of HSTAT_class______________________________________________________________________
Parameter 56
access: SC6_HEADSTATE Source Board-C chl6 head status of HSTAT_class______________________________________________________________________
Parameter 57
access: SD7_HEADSTATE Source Board-D chl7 head status of HSTAT_class______________________________________________________________________
Parameter 58
access: SD8_HEADSTATE Source Board-D chl8 head status of HSTAT_class______________________________________________________________________
Parameter 59
access: ACPROC
Active process.
______________________________________________________________________
Parameter 60
access: ACTSRCMAP
Active source bitmap.
______________________________________________________________________
Parameter 61
access: S4A_BRDSTS
Board slot A S4 status______________________________________________________________________
Parameter 62
access: S4B_BRDSTS
Board slot B S4 status______________________________________________________________________
Parameter 63
access: S4C_BRDSTS
Board slot C S4 status______________________________________________________________________
Parameter 64
access: S4D_BRDSTS
Board slot D S4 status______________________________________________________________________
Parameter 65
access: BOX_FATAL_MD Instrument is in fatal unrecoverable mode.
______________________________________________________________________
Parameter 66
access: LAUNCHFNO
Launch Film number, accessible when Non-sequencing. Can be set to range
1..LastFilm value and is used to augment use of the event code STARTCPL which starts
whichever film value is stored in LAUNCHFNO.
______________________________________________________________________
Read, Status Information Command Examples
Command
Response
Description

SECTION 6.XX

F6A1
Query The Status Parameter 6, Active Film #. Active Film # is 1.

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p STC-2000A DEPOSITION CONTROLLER y
Command
Response
Description

F9
A17
Query The Status Parameter 9, Phase Status. Process Sequence is At Ready Phase.

Command
Response
Description

F 10
A0
Query The Crystal Shutter Status. Shutter is Non-Eclipsed, Not In Hold Mode.

Table 68: Group 5 Examples.
______________________________________________________________________
Write Status Information (G)Only eight parameters are valid (1,2,3,17,21, 22, 23,24). See above for access.
______________________________________________________________________
Parameter 1
Soak Hold Status
Value Range
0,1
Units False/TrueThis parameter sets if a soak hold state is desired. A value of 1 forces it to be scheduled. If soak hold isenabled, this prevents the deposit phase from being entered.
______________________________________________________________________
Parameter 2
Forced Sample
Value Range
0,1
Units Off / On
This parameter forces a sample state On or Off. A value of 1 forces a sample.
______________________________________________________________________
Parameter 3
Manual Controller Status
Value Range
0 To 3
Units None
This parameter forces the status of the manual hand controller. It is used with a command in the next groupcalled manual pendant update. If you issue either an up or down command, it stays in effect (ramping thepower) until you issue an at rest command.
0
At Rest
1
Zero
2
Up
3
Down
______________________________________________________________________
Parameter 17
Film Hold
Value Range
0,1
Units False, True
If true, this parameter holds a film at the crystal verify state. The crystal verify state occurs immediately
after a film is started.
______________________________________________________________________
Parameter 21
Source Voltage Set To Zero
Value Range
0,1
Units False, True
If true, this parameter forces the source control voltage to zero volts. A false value remover this override
condition.
______________________________________________________________________
Parameter 22
At RateValue Range0, 1Units False, TrueSECTION 6.XX

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p STC-2000A DEPOSITION CONTROLLER y
Deposition is at Desired Rate. If this parameter is TRUE the measured rate is equal to the desired rate, else(0) not at desired rate.
______________________________________________________________________
Parameter 23
Allow Zeroing
Value Range0, 1Units False, True
Zeroing allowed when entering deposit. If this parameter is true (1) then Zeroing is inhibited on entering adeposit, else it is allowed [default].
______________________________________________________________________
Parameter 24
Crystal Test Mode
Value Range0, 1Units 0 normal (need both working), 1 limp along on 1 crystal.
Normally, a unit configured for dual sensor operation requires both channels to be valid at the start of adeposition. In a multi-film deposition, it is possible to have a crystal failure on one of the channels after
successfully finishing several initial layers. By disabling the need for both channels to be valid in later
layers, the process can continue automatically with only one remaining crystal.
______________________________________________________________________
Command Examples
Command
G1=1
ResponseA
Description
Set status parameter 1 (soak hold status) to 1 or true. This will cause the process sequence
to hold at the end of soak 2 and wait for the soak hold status to become false. Command understood andaccepted.
Table 6.9: More Group 5 Examples.

Read, Trigger Events

Group 6-- Read, Trigger Events
Commands H & I(H,I)

Event Commands. These commands read and force certain conditions to occur in the STC2000A. When setting an event, only the parameter number is needed. There is no data associatedwith the parameter. (See Table 6.15)

Event Commands (H,I)
These commands are used to poll and trigger certain events in the STC-2000A. When polling, avalue of 0 or 1 is returned indicating not occurred or occurred. The poll status is latching, that is if an event
happens, its poll status remains until read by the computer interface. It is then reset and waiting to be set bythat event again.
When triggering an event, no value is required since the action of sending the parameter triggers the event.
The following is a Table showing parameter numbers and their equivalent I/O events:
List of computer pollable event codes:
Parameter#

Mnemonic

1
2
3
4

STOP
START
STARTGSTART1SECTION 6.XX

I/O ID#

Description

Any stop event, internal or external.
Any simple start event, internal or external.
General start event, either I/O or computer.
Select & Start Film 1, generated via I/O,COMM in nonsequencing option unit, or via sequence logic in sequencing-

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5
6
7
8
9
10
11
12
13
14
15

START2
START3
START4
START5
START6
START7
START8START9MANLONMANLOF
MUPDT

16

FTRG

17

XFAIL

18

MLACK

19

ZERO

20
21
22
23
24

SPTIMESPTHIK
PHANTOM
PHANTOMCILK00

25
26
27
28
29
30
31
32
33
34

CILK01
CILK02
CILK03
CILK04
CILK05
CILK06
CILK07
CILK08
CILK09
BRKWT

35

FLMRE

36

LYRADV

37

PRCRE

38

STRTUNC

39

SECTIM

40

MINTIM

41

HRSTIMSECTION 6.XX

capable option unit.
Same as START1 except for Film 2.
Same as START1 except for Film 3.
Same as START1 except for Film 4.
Same as START1 except for Film 5.
Same as START1 except for Film 6.
Same as START1 except for Film 7.
Same as START1 except for Film 8.
Same as START1 except for Film 9.
A manual on event triggered, possible ignored.
A manual off event, possible ignored.
A manual pendant update generated, caused by pendant logic orcomputer interface to control manual power when in manual. Ties
into status command G MCTL(3) = 0..3.
Final thickness trigger event. Caused by measurement logic or
I/O or computer interface.
Crystal fail event. Caused by measurement logic or I/O orcomputer interface.
Memory Loss Acknowledge event. Caused at power up by
depressing manual button when prompted, or can be caused
through computer interface.
Thickness zero event, caused through automatic process flow or
via computer interface, I/O or front panel.
Setpoint time event.
Setpoint thickness event.
Obsolete, no longer used.
Obsolete, no longer used.
Computer event links, can only be caused by an RS232/commandor the I/O logic system. Used to tie the I/O ladder system into theremote host.
See CILK00.
See CILK00.
See CILK00.
See CILK00.
See CILK00.
See CILK00.
See CILK00.
See CILK00.
See CILK00.
Break wait event, caused by I/O system, Front Panel Start or hostcomputer in systems with sequencing enabled.
Film reset event, caused by I/O system, Front Panel Start or hostcomputer in systems with sequencing enabled.
Layer Advance, caused by I/O system, Front Panel Start or hostcomputer in systems with sequencing enabled.
Process reset, caused by I/O system, Front Panel Start or hostcomputer in systems with sequencing enabled.
Process start unconditional, caused by I/O system or hostcomputer in systems with sequencing enabled.
Second metronome timer event, triggered on period of one
second. Usefull for establishing timebase in I/O or host interfaces.
Minutes metronome timer event, triggered on period of one
minute. Usefull for establishing timebase in I/O or host interfaces.
Hours metronome timer event, triggered on period of one hour.

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42

BOJDPOS43

EOJDPOS44

EOJFILM45

EOJPROC46

STPROC1

47
48
49
50
51
52
53
54
55

STPROC2STPROC3STPROC4STPROC5STPROC6STPROC7STPROC8STPROC9RRTRIG

56
57
58
59

PHANTOMBOJPROCBOJFILMRLSFHLD

60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80

CILK10
CILK11
CILK12
CILK13
CILK14
CILK15
CILK16
CILK17
CILK18
CILK19CILK20
CILK21
CILK22
CILK23
CILK24
CILK25
CILK26
CILK27
CILK28
CILK29RLSSKHLD81

RSYNC_PG
1
RSYNC_PG
282

SECTION 6.XX

Usefull for establishing timebase in I/O or host interfaces.
Begin of deposit cycle, film being processed has begun thedeposit/rate-ramp/deposit-2/manual phase area, after precondition/shutter-delay phases, shutter is open.
End of deposit cycle, film being processed has left thedeposit/rate-ramp/deposit-2/manual phase area for idle-ramp/idle
or stop phases.
End of Film event, film being processed has reached an idle or
stopped phase.
End of process event, last film in a process sequence hascompleted, process is over.
Select & Start Process 1, generated via I/O,COMM in sequencing
option unit.
Same as STPROC1 except for Process 2.
Same as STPROC1 except for Process 3.
Same as STPROC1 except for Process 4.
Same as STPROC1 except for Process 5.
Same as STPROC1 except for Process 6.
Same as STPROC1 except for Process 7.
Same as STPROC1 except for Process 8.
Same as STPROC1 except for Process 9.
Rate Ramp Trigger, causes system to enter the rate ramp on an
external request, providing properly program-med.
Obsolete, no longer used. Was LIMPX.
Begin of job/process, new to STC-2000A
Begin of job/film, new to STC-2000A
Release from a film hold condition. Trigger of this event releases
a film FSM to leave film hold and go on to rise/soaks as needed.
See CILK00.
See CILK00.
See CILK00.
See CILK00.
See CILK00.
See CILK00.
See CILK00.
See CILK00.
See CILK00.
See CILK00.
See CILK00.
See CILK00.
See CILK00.
See CILK00.
See CILK00.
See CILK00.
See CILK00.
See CILK00.
See CILK00.
See CILK00.
Release from a soak hold condition. Trigger of this event releases
a film FSM to leave soak hold and go on to rise/soaks as needed.
Pocket good, gun1.
Pocket good, gun2.

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83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110

SECTION 6.XX

RSYNC_PG
3
RSYNC_PG
4
RSYNC_PG
5
RSYNC_PG
6
RSYNC_PG
7
RSYNC_PG
8
REVERIFYZROTK_SS
1
ZROTK_SS
2
ZROTK_SS
3
ZROTK_SS
4
ZROTK_SS
5
ZROTK_SS
6
ZROTK_SS
7
ZROTK_SS8
CNCLPR_S
S1
CNCLPR_SS2
CNCLPR_SS3
CNCLPR_SS4
CNCLPR_SS5
CNCLPR_SS6
CNCLPR_SS7
CNCLPR_S
S8FAILSCL_CHL1
FAILSCL_CHL2
FAILSCL_CHL3
FAILSCL_CHL4
FAILSCL_
CHL5

Pocket good, gun3.
Pocket good, gun4.
Pocket good, gun5.
Pocket good, gun6.
Pocket good, gun7.
Pocket good, gun8.
Trigger a request for MEAS to re-scan map matrix
Thickness zero, chnl1.
Thickness zero, chnl2.
Thickness zero, chnl3.
Thickness zero, chnl4.
Thickness zero, chnl5.
Thickness zero, chnl6.
Thickness zero, chnl7.
Thickness zero, chnl8.
Reset output power, gun1.
Reset output power, gun2.
Reset output power, gun3.
Reset output power, gun4.
Reset output power, gun5.
Reset output power, gun6.
Reset output power, gun7.
Reset output power, gun8.
Fail sensor channel, chnl1.
Fail sensor channel, chnl2.
N.A.
N.A.
N.A.

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111
112
113
114
115
116
117
118
119

FAILSCL_CHL6
FAILSCL_CHL7
FAILSCL_CHL8
ATRATE_MEZ
STP_IO_A
X1
STP_IO_A
X2
STP_IO_A
X3
STP_IO_A
X4
STARTCPL

N.A.
N.A.
N.A.

At rate during measurement.
I/O auxiliary stop 1.
I/O auxiliary stop 2.
I/O auxiliary stop 3.
I/O auxiliary stop 4.
Event which is only available when non-sequencing. Whentriggered will request a start of the film which has been written
into SSS_LAUNCHFNO via I/O or parser.

Table 22.4: Event Commands.
*Can be polled with ‘H’ command but not triggered with ‘I’ command.
Note 1: This command is available only through the computer interface. It updates the status set byparameter 3 of the 'G' command set.
Note 2: This command acknowledges a memory loss condition. Normally, the operator has to push the
MANUAL key to continue past where a memory loss is detected (during the power up phase).
______________________________________________________________________
Command Examples
Command
H21
Response
A0
Description
Poll whether a setpoint thickness condition has been triggered since the last time polled
by the computer interface (computer). A 0, or False, indicating that the event has not yet taken place.
Command
H1
Response
A1
Description
Poll whether the system stop event has occurred since the last time a poll was requestedof this event. A 1, or true response, indicating that the event has occurred since the last time polled. Issuing
the poll again will result (most likely) in a 0 response, since no new stop has occurred in the time between
successive polls.
Command
I1
ResponseA
Description
Signal the STC-2000A to trigger a stop event. The STC-2000A will react as though thefront panel STOP button was depressed. If the unit was not already stopped (such as at idle or ready) thenthe screen of the STC-2000A will display "stopped remote". The A response indicates command
understood and performed.
Command
I18
ResponseA
Description
Trigger the "acknowledge program memory loss" event within the STC-2000A. This
event is duplicated from the front panel when pushing the manual button during the time that the screen
indicates a program data loss. By triggering this event via the computer, and then downloading new
information, a program data loss can be recovered fully automatically, without an operator. This can bedone if the status poll of the non-volatile memory status ("f13") yields a non-zero result. Response
indicates the command was understood and performed.

SECTION 6.XX

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Command
I5
ResponseA
Description
Start process unconditionally, using film #2. Response indicates command understoodand performed.
Table 23.5: Groups 9 And 10 Examples.
______________________________________________________________________
Command:H
Mnemonic:
EXCT_epoll (event poll)
Parameters:[1..119] corresponding to event selection codes STOP..STARTCPL as listed below:
Description:
Requests return of selected event condition history since last poll. If selected event has
had an occurrence since last computer poll (RS232 parser, beware of intermingled requests for thisinformation) then will return a true (1) value. If no events at all or since last poll then will return false (0).

Returns:[RZCD_AOK][0 or 1] if proper event id [1..119] was sent.
[RZCD_ILDV] if improper value for parameter arguments.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..
NOTE: Certain events may be disallowed depending on whether or not sequencing is enabledin the instrument.
Command:I
Mnemonic:
EXCT_etrig (event trigger)
Parameters:[1..119] corresponding to event selection codes STOP..STARTCPL as listed above
Description:
Causes the selected event to be triggered or made to occur such that any othersystem logic can detect it and then perform as designed. I/O can respond to events, the auto-matic
process sequence system can respond to events, etc.
Returns:[RZCD_AOK] if proper event id [1..119] was sent.
[RZCD_ILDV] if improper value for parameter argument.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..
NOTE: Certain events may be disallowed depending on whether or not sequencing
is enabled in the instrument.

I/O Status Commands

I/O Status Commands Group 7 -Command J(J)

Read I/O Information. These commands will read the states of the remote inputs and relays, status
codes, softnodes, counter values.
Command:J
Mnemonic:
EXCT_ioexm (I/O exam)
Parameters:[0..71, 72..128, 150..157, 300..399, 400..409]
Description:
Requests a read of state of I/O nodes which correspond to the identifier code (0..128,
150..157, etc..). A return of non-zero indicates TRUE or active. A return of 0 indicates FALSE orinactive. Scalar types can return numeric values between 0 and 255 (such as bit maps,
counters,etc). These values are only usable (dynamically updated with new information) if thecorresponding node identifier is actually being used within the live (active) I/O program. The state

SECTION 6.XX

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p STC-2000A DEPOSITION CONTROLLER yof value which is then being stored into these node areas during program evaluation are what thequery (exam) returns. A value of 256 will be returned from nodes which are not being used in an
I/O program. If a running I/O program is edited such that a node is no longer referenced in the I/O
program, the next query will return a 256 value. This functionality is intended to aid in
introspection and debugging of I/O programs by allowing remote determination of I/O node states,
especially those which are internal, such as softnodes and counters, for which there is no otherindependent view. The assignment of the numbers to internal I/O conditions matches thedefinitions used to program the I/O system. Missing codes of 129 to 149 are reserved for future
status pollable nodes. Codes from 158 to 169 are reserved for future settable/pollable status nodes.
Codes from 170 to 299 are event type codes and are not pollable by this command but can belooked at via the 'H' command and the appropriate command code (see description above). Notethere is no simple correspondence between I/O event codes and 'H' command event id indices.
Returns:[RZCD_AOK][0..255, 256] if proper I/O node id argument was sent. Returns a logical or scalarvalue (0,1 for boolean, 0..255 for scalar) for nodes which are being used in I/O program. Returns
256 for nodes which are not in program, information is not representative of system meaning.
[RZCD_ILDV] if improper value for parameter argument.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc.

I/O Status Command (J)The J set of commands can detect certain states and events in the I/O system. The parameter thatis passed is the ID number used by the I/O system. The data returned is either a 0 or 1, depending on thestate. The following ID's are always available:
0 To 7 Remote Inputs 1 Through 88 To 15 Relays 1 Through 8
16 To 72
IState81 To 94
UState141 To 190
Soft Nodes
300 To 899
Counter
900 To 999
Layer Number
Other states and events are available if the I/O program uses them. The ID number that is used as aparameter number is found in Table 5.3. If you ask for something that is not in the above list or in the I/O
system, the result will not be valid.
Command Examples
Command
J0
Response
A0
Description
Read Boolean state of I/O node 0, hardware input number 1. Response of 0, input is not
active (is ungrounded).
Command
J8
Response
A1
Description
Read Boolean state of I/O node 8, hardware relay number 1 output contacts. Response of
1, output is active (assuming I/O rungs in program make it so).
Command
J141
Response
A1
Description
Read status of I/O soft node, # 141. Assuming the node is assigned somewhere in the I/O
program, this statement will query the current state of it. This aids in debugging complicated I/O programs.
Soft Node is Set True.
Table 24.6: Group 7 Examples.
______________________________________________________________________SECTION 6.XX

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Kill Command

Command:K
Mnemonic:
EXCT_kill (KILL, causes equivalent to reset of CPU)Parameters:=200 literal string with special numeric value to trigger.
Description:
Commands STC-2000A to stop satisfying internal watchdog circuit thereby causing a
hardware reset within approximately 400 milliseconds. This command should be sent only tocause a remote power up condition similar to a power-off/power-on sequence. This causes acomplete hardware reset of the instrument, and can be used to cause certain parameters (such as
sequencing/non-sequencing, etc..) to be reloaded after being changed by the host computerinterface. =200 will reboot both the UIFC processor and the SCUP processor.
Returns:
May not return anything if watchdog causes a reset before reply message is requested received athost or may return partial message if reset during RS232 reply.
[RZCD_AOK] if proper safety code (=200) was sent.
[RZCD_ILDV] if improper value for parameter argument.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..

Read Process Accounting

Read Process Accounting Group 8 -Command L(L)

Process Accounting. These commands can upload the information in the process accounting
display. See Section 2.18 for a description of these parameters.

Command:L
Mnemonic:
EXCT_prac (process accounting access)Parameters:[0..3] [0..23] corresponding to most recent history (0) to oldest (3) account record logged
for data items
Description:
Requests return of information saved during a process run. The STC-2000A saves
information for the last four completed film deposition runs. Each time a new film is completed
the information summary (detailed below) for the run is stored away as the latest result (index 0
for first argument) and the previous latest run (old index 3 before this data log operationcommenced) data is lost. Data recorded as index 0 through 2 before a new run completion are thenaccessed by index numbers 1 through 3. Since each log has date/time and run number (and layer
number in the case of sequencing) information stamped with it, tracing which data applies to what
run is simple. The list of processing accounting data element access indices is below.
Returns:[RZCD_AOK][param_value] if proper log item ident code argument was sent. Exact format of[param_value] depends on the particular log item for which the data was requested.
[RZCD_ILDV] if improper value for parameter argument.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc.

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The set of L commands are used to read the process accounting information from the STC-2000A
to the host computer. There are 2 parameters that are passed. The first is a single digit from 0 through 3.
This indicates which set of parameters is to be read. The number 0 is the most recent and 3 is the oldest.
The second parameter defines what piece of information will be read. Table 6.18 lists the numbers andparameters.
Process Accounting
Mnemonic
Index

Description

Address

/ ID
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23

PA_datePA_timePA_rnnoPA_procid
PA_lyrn
PA_flmn
PA_mapPA_source
PA_pocket
PA_tdep
PA_ethk
PA_erate
PA_pwrv
PA_loopPA_x1use
PA_x2use
PA_x3use
PA_x4use
PA_x5use
PA_x6use
PA_x7use
PA_x8use
PA_tproc
PA_stat

SECTION 6.XX

Date of process run, calendar MM/DD/YY as 6 digits.
Time, clock hrs/mins in military HH:MM .
Run #, 0.9999. Followed by 'T' if a test mode run.
Process #, 1..9 if sequencing, 0 if non-sequencing.
Layer number if sequencing, 1..99, # of step in sequence.
Film # , 1..50.
Source-Sensor Map reference number, 1..10.
Source channel for power, 1..2 or 0 if invalid source.
Pocket number associated with film. 0..63.
Time of shutter open in seconds.
Ending thickness.
Ending rate.
Power value at shutter close.
Loop accum at shutter close, 0..99.
Life reading for xtal 1 at beginning/end.
Life reading for xtal 2 at beginning/end.
Life reading for xtal 3 at beginning/end.
Life reading for xtal 4 at beginning/end.
Life reading for xtal 5 at beginning/end.
Life reading for xtal 6 at beginning/end.
Life reading for xtal 7 at beginning/end.
Life reading for xtal 8 at beginning/end
Time of process, start to idle or stop.
Process run completion status, stopped/why, normal idle, tpwr, etc... fromcompletion status messages below.
0
NORMALnormal completion, reached idle.
1
TIMPWR
completed to idle, time power during deposit.
2
BADXTL
crystal bad.
3
REMOTE
remote from I/O system.
4
KEYBRD
front panel
5
MAXPWRmax power condition persisted too long.
6
PENDNT
remote pendant stop.
7
SAFE 1
User Interface subsystem failure.
8
S4 BAD
Measurement module systems failure
9
IO BADI/O module/plugin failure.
10 0 BHIE
Measurement Bus Hold failure.
11 INDEXR
Indexer feedback timeout failure
12 INVSRC
Invalid source associated with Map/Film
13 INVSNS
Invalid sensor associated with Map.
14 IO_AX1
I/O auxiliary stop 1
15 IO_AX2
I/O auxiliary stop 2
16 IO_AX3
I/O auxiliary stop 3
17 IO_AX4
I/O auxiliary stop 4
18 QUALDLY Failed quality while in shutter delay

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19 QUALDEP
Failed quality while in deposit
Table 6.13: Process Accounting Id List.
______________________________________________________________________

Command Examples
Command
L0 2
Response
A1234
Description
Read the 0th (most recent of the four) process log item # 2, the run #. run # 1234 was therun most recently completed.
Command
L32
Response
A ”BLANK” spelled out
Description
Read the 3rd (oldest of the four) process log item # 2, the run #. The log has no
information in this entry, fewer than four processes have been logged into the history.
Command
L0 14
Response
A BADXTL
Description
Read the 0th (most recent of the four) process log item # 14, the completion status of theprocess. A bad crystal caused the stopping or aborting of the run.
Table 25.7: Group 8 Examples.

Read, Load I/O program

Read, Load I/O program Group 9 -Commands M,N & O(M) (N) (O)I/O Program Reading And Loading. These commands are used for uploading anddownloading the I/O rungs. These commands are not used for controlling the I/O program, justgetting it in and out of the STC-2000A.
M - read I/O rungN - select I/O rung for change
O - I/O rung data
Load I/O Program (M, N, O)
These commands Read and Set I/O rung expression contents. Follow M with number n for whichrung is to be read (n can be 1,2 or 3 digits from 1 to 999). If the M command is followed immediately by =, it means repeat the transmission of the same information. If it is followed immediately by + , it means
advance to the next portion of rung information. This is needed in order to keep the I/O buffers short. It is
possible for the rung length to exceed the STC-2000A buffer which is 13 bytes long. In this case it isbroken up into several lines of information.
If n is beyond the last rung with contents, the STC-2000A will return end and the rung number ofthe END rung as follows: "A.END nn".
The N command is used to change a rung to new data. The N is followed with number n to
identify which rung to change. After the initial N command, subsequent 'O' commands specify the newrung data.
The O command sends an I/O expression to the STC-2000A. The O is followed immediately witheither a period ('.') or a sequence digit '0' .. '9' and the ASCII rung information. The entire string of the 'O',
the '.' or digit, and the following rung symbolic must not exceed 13 characters. Lines longer than this use

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p STC-2000A DEPOSITION CONTROLLER y
the sequence number to indicate a continuation is needed, with the final portion (or only portion if smallenough) having a '.' where the digit goes.
______________________________________________________________________
Command:M
Mnemonic:
EXCT_iord (I/O read)
Parameters:[1..LASTRUNG] or [=] or [+]Description:
Requests a read-back of the current active I/O program's symbolic I/O rung data
expression. If 1..LASTRUNG (where LASTRUNG is any number greater than or equal to the actual
last rung in program storage) then the command will return the reply result (RZCD_AOK, etc..) followed
by a sequence code (see description below) followed by symbolic rung expression data. A simple example
exchange will clarify this:
SEND:
M1

M=

M+

Description
Request Rung 1

RECEIVE:

Description

A0I18 P109 +Part of rung sequence code 0
indicates 1st part of line.

A0I18 P109 +Used if a com link error
caused last data to be lost. This way
there is no need to start at beginningof rung again.

A.S8

Final contents of rung sent inresponse to the M+ advancecommand. Un-limited numbers of
M= can be sent to request this again
until received without data error.

Request to resend last data without
scanning ahead to remainder of line.

Request additional information as theprevious reply had a sequence code #(0..9) rather than a '.' as terminator.

Returns:[RZCD_AOK][SEQUENCE_CODE][RUNG_SYMBOLIC_DATA] if proper parameters weresent. Exact content of [SEQUENCE_CODE] and [RUNG_SYMBOLIC_DATA] depend
on what was programmed into the I/O program. If the rung # parameter is beyond the lastrung of the I/O program, then the STC-2000A will return "A.END nn" with nn being one
rung beyond the last valid rung number. In this way the length of the program can beascertained by reading back with a M999 request. This is sure to be longer than thecurrent program (storage allows for a maximum of about 400 rungs) and will respondwith the rung number of the last line of the I/O program.
[RZCD_ILDV] if improper value for parameter arguments.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..
______________________________________________________________________
Command:Mnemonic:
Parameters:
Description:

N
EXCT_iochg (I/O change rung number set)
[1..LAST_RUNG] where the parameter number is the number of the rung to
be changed or edited.
Designates the rung id to be alterred with a new symbolic rung expression which will
follow in subsequent 'O' commands which are described below. If the rung identifier isbeyond the end of the program then the command is automatically interpreted to meanalter the end of the program which currently contains END, thereby extending the
program.

Returns:

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p STC-2000A DEPOSITION CONTROLLER y[RZCD_AOK] upon success.
[RZCD_ILDV] if improper value for parameter arguments.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..
______________________________________________________________________
Command:Mnemonic:
Parameters:
Description:O
EXCT_ioexp (I/O expression for changes))[SEQUENCE_CODE][RUNG_SYMBOLIC_DATA]
Sends an I/O logical expression symbolic string to the STC to compose the new runginformation for the rung which was set up in the preceding N command. The[SEQUENCE_CODE] and [RUNG_SYMBOLIC_DATA] information complies with thedescription given above for the M command, such that replies from the STC-2000A canbe modified and then downloaded back to the STC-2000A. This makes uploading anddownloading the I/O program uncomplicated. If the I/O rung data can fit in a single
expression then the [SEQUENCE_CODE] is the '.' character, indicating the final (andpossibly only) sub-string to compose the desired rung content. If the I/O rung datarequires multiple messages, then the [SEQUENCE_CODE] is sent (0,1,etc.) until
completed, with the last string having a '.' [SEQUENCE_CODE] token. Should a reply tosuch a 'O' message be garbled or indicate error (RZCD_AOK not received) then it can besent again with the [SEQUENCE_CODE] insuring that the STC-2000A does not take themessage to contain the next string of data. If the STC-2000A determines redundantrepeated [SEQUENCE_CODE] substrings, they are ignored. Should the STC-2000A
receive [SEQUENCE_CODE] tokens out of order (not 0,1,2,etc..) then the RZCD_IOSQ
code will be returned.

Returns:[RZCD_AOK] if proper sequence and data were sent.
[RZCD_ILDV] if improper value for parameter arguments.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..
[RZCD_IOSQ] if sequence codes out of sequence.
______________________________________________________________________
Command Examples
Command
M1
Response
A0I18 P109 +Description
Request upload of rung # 1. The 'A' indicates understood, the '0' indicates the runginformation is being blocked in multiple records, this being the 0th, the rest of the packet is the first part of
the rung contents, "I18 P109 +".
Command
M=
Response
A0I18 P109 +Description
Request the same information again as the last response was unintelligible (checksum
error, for instance). A duplicate of the above response, to insure reception. The sequence information
insures that the assembly of multi-packet rungs is valid.
Command
M+
Response
A.S8
Description
Request additional information on the rung specified in the "M 1" command, since theprevious packet had a sequence # associated with it. The '.' where the sequence # goes indicates this is final
packet of the rung description. By pasting the "S8" onto the "I18 P109 +" from the first packet, the totalrung contents of "I18 P109 + S8" is uploaded. Longer rungs may require more packets. Each packet isnumbered, starting at 0, then 1, 2 etc., until the final '.' packet.
Command
Response

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Description
Request rung # 999 data (rungs will not go that high since data storage allows for a
maximum of 400 rungs). The end information indicates that the rung requested is beyond the last rung
which has program information in it. The number 12 after the end word indicates that rung # 12 is the end
rung, and rung # 11 is the last rung of the program containing boolean expressions.
Command
N23
ResponseA
Description
Signal the desire to change or alter rung # 23. If no rung #23 exists (as is the case withthe program shipped with the unit, which stops at rung 11), then the end rung (#12 in this case) will bechanged, extending the program. Command understood and performed, future 'O' commands will referencerung 23.
Command
O.IO 0141
ResponseA
Description
Send a terminal packet (because of the '.') defining the selected rung as "I0 O141". This
sets the rung to input-from-0 output-to-softnode-141. Command understood and performed, rung modified.
New 'O' commands will require a new 'N' command prefix in order to specify which rung to modify orchange next.
Command
Response
Description

N9
A
Request Change To Rung 9. Command Understood And Performed.

Command
Response
Description

O0I45 I46 I47
AEnter 0th packet of rung symbolic. Command understood and performed.

Command
Response
Description

O1I48+++AEnter 1st packet of rung symbolic. Command understood and performed.

Command
O.O141
ResponseA
Description
Enter final packet of rung symbolic. Command understood and performed, rung in placeas "I45 I46 I47 I48 + + + O141" .
Table 26.8: Group 9 Examples.
______________________________________________________________________

I/O Program Editing

I/O Program Editing Group 10 -Commands P,Q,R,S(P) (Q) (R) (S) I/O Editing Commands. This set of commands will do the following editing functions in
the I/O program:P - Delete A Rung
Q - Select The I/O Program (Primary Or Alternate)

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R - Insert An Empty Rung
S - Store The I/O Program Into The Alternate Memory
Editing The I/O Program (P, Q, R, S)
The P command is used to delete an I/O rung, followed by a rung number value.
The Q command is used to select the I/O rung bank or query it. Follow the Q by a 1 or 2 to selectbank a or b (similar to swap only explicit). If the Q is followed by a 3, the STC-2000A returns a result
message of "An d crc" where n is an error number from the I/O error codes list below, d is a bank code,
either 'A' or 'B, and crc is the rung program checksum, 1 to 5 digits, 0 to 65535 in value. The error code
pertains to the last N/O command series which failed.
The R command will insert a blank rung. It is followed by a rung number n and will insert a blankline unless the I/O program has no more room, or n is higher than END rung #.
The S command saves an I/O program from the current bank into the alternate memory bank forsafekeeping. Must be followed with the number 200 to activate, so that inadvertent operation is not
triggered with a simple single letter command.
I/O Error Codes List:
0
No Error, Command Accepted.
1
Unrecognized Characters Or Format, Missing Spaces, Etc.
2
Unmatched Pushes And Pops.
3
Not Enough Pushes For The Pop Operators.
4
Illegal I/O Node Identifier #. See List Of Legal Ids.
5
Invalid Op code For Selected Node Id.
6
Existing Use Of Node-Id Conflicts With New Use.
9
Nothing On Line At All.
10Out Of Memory, No Room For Rung Data.
______________________________________________________________________
Command:P
Mnemonic:
EXCT_iodel (I/O rung delete)
Parameters:[1..MAXRUN] where the parameter value identifies the rung number of the currently
active I/O program to delete.
Description:
Commands the STC-2000A to remove from the I/O program the rung entry identified by
the parameter value.
Returns:[RZCD_AOK] if proper rung number id was sent and such a rung exists.
[RZCD_INHB] if the requested rung number is beyond the last valid step in the program.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..
______________________________________________________________________
Command:Q
Mnemonic:
EXCT_iosel (I/O select bank)
Parameters:[1,2,3]
Description:
If the parameter is 1 or 2 then the STC-2000A is commanded to select the 'A' or 'B' I/O
program memory, respectively. This has utility like the SWAP command of the user interface but is explicit
as to the desired active program selection. If the parameter is a 3 then the command queries the I/O
program and replies with a response indicating the condition of the active I/O program. The condition
information includes which bank is active (A or B), what if any errors exist with the I/O program (see error
codes below) and what the I/O program space CRC checksum is. The checksum is a code which is derived
from the symbolic contents (and order) of the rung information and can be used to identify (via signature
value) the I/O program contents. Any changes to the I/O program will result in a modified CRC value. In
this way a quick check of the authorized I/O program can be made without a rung by rung comparison witha source document. If the number is the same as recorded for the authorized version then it is safe toassume the program is the intended authorized version.
List of I/O error codes

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0 IOERR_GOOD No error, I/O program has acceptible syntax.
1 IOERR_UNREC Unrecognized format for tokens.
2 IOERR_2DEEP Stack nested too deep.
3 IOERR_UNFLW Stack underflow, nothing to pop.
4 IOERR_BADNID Bad node id, wrong # .
5 IOERR_BADMIX Wrong opcode in mix with #.
6 IOERR_PHASE Conflict between usages.
7 IOERR_UNBAL Unbalanced set/clear.
8 IOERR_UNRFI Unreferenced input, being read with nothing to write to it.
9 IOERR_EMPTY Nothing on line at all.
10 IOERR_OUTMM Out of memory.
Returns:
If Q1 or Q2 sent:[RZCD_AOK]If Q3 sent:[RZCD_AOK][err_no] space [bank_code][crc_value]
where err_no is 0..10 (see chart above)bank_code is either 'A' or 'B'.
crc_value is 1 to 5 digits, ranging from 0 (for blank program) through 65535, depending
on result of 16 bit CRC on rung data.
[RZCD_ILDV] if improper value for parameter arguments.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..
______________________________________________________________________
Command:R
Mnemonic:
EXCT_ioins (I/O insert blank rung)Parameters:[1..LASTRUNG]
Description:
Commands the STC to place an empty rung ({ }) into the active I/O program at rungnumber specified, forcing current occupant of the rung and any others after it to be renumbered one higher.
Used to make a gap in rung list so can place useful rung data in proper sequence or location as program
maintenance causes changes in rung contents.
Returns:[RZCD_AOK] if rung number is valid (between 1 and current end rung)[RZCD_INHB] if rung number is beyond the "END" last rung identifier.
Use the M999 query which returns "[RZCD_AOK].END nn" to identify the last rungavailable for empty rung insert.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..
______________________________________________________________________
Command:S
Mnemonic:
EXCT_iosav (I/O save active bank to alternate)Parameters:
200 as a safety value.
Description:
Commands the STC to save the current I/O program rung data into the alternate inactive
I/O program space, erasing any previous I/O program held there. For instance, if the 'A' bank is active, willsave the program in the 'A' bank to the 'B' bank, making them identical.
Returns:[RZCD_AOK] if safety # (200) was sent.
[RZCD_ILDV] if improper value for parameter argument.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..

Command Examples
Command
Response

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P3
A

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Description
Delete rung # 3 from the program, just as if the user used the I/O menu screen to do so.
Rungs after #3 are renumbered to be one lower. Command understood and performed.
Command
P900
Response
L
Description
Request to delete rung # 900. Error, operation syntactically correct, but inhibited sinceno rung # 900 exists to delete. This error will return anytime a delete is commanded for a rung at or past theend of the program.
Command
Q3
ResponseA0 B39983
Description
Query the I/O program status. The 0 code is the last error result of previous I/O changecommands. If an I/O change ('O') command returns an error, then a query of this type will return a # (seeabove I/O error codes) which will explain the nature of the error. The B code indicates the B memory is theactive I/O program. The 39983 is the checksum of the program. This is a CRC algorithmic sum which aids
the user in identifying changes to the program. If a known good I/O program is generated by the user, thenthis number can be recorded and used to insure that the I/O program has not been altered since a change tothe program would result in a new and different CRC number. This saves the user from having to scan along I/O program list to verify program integrity.
Command
Q1
ResponseA
Description
Switch to bank A use a 2 to go to bank B. Command understood and performed, if notalready using bank A, will switch to it.
Command
R2
ResponseA
Description
Insert a blank in rung 2, old rung numbers 2.. the END become 3 .. END+1. Command
understood and performed, a new gap is inserted in the program and all subsequent rungs are renumbered
one higher.
Command
R 99
Response
L
Description
Insert a blank in rung 99, old rung numbers 99.. The END become 100 .. End+1. Error
code, operation inhibited since rung # 99 is beyond the current program. Legal values of the # are from 1
through the last ("end") rung, inclusive. Use the "M999" command to determine the final rung first.
Command
R2
Response
L
Description
Insert a blank in rung 2, old rung numbers 2.. the end become 3 .. End+1. Program
memory filled up, no room for another rung.
Command
S200
ResponseA
Description
Request a save from current bank to backup. Command understood and performed, both
memory banks have the exact same programs in them after execution.
Table 27.9: Group 10 Examples.
______________________________________________________________________

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Set Analog Output (T) Group 11 -Command T(T)

This command allows the analog output which normally reports either rate, thickness or power
information to be controlled by an external computer to a voltage between plus and minus 10
volts. (note: this option must be selected in the system configuration procedure)______________________________________________________________________
Command:T
Mnemonic:
EXCT_setdac (Set DataLog dac value)
Parameters:[ -32767 .. 0 .. 32767]
Description:
Sets Analog Data log value from 0 to +10 volts in 12 bit precision. Analog voltage will
track this value if the ARFNC system parameter is set to 4, computer control of analog output(either via user menu or computer). Output voltage is linear with respect to parameter value.
Range of value is backwards compatible to STC200 (signed 16bit) but STC-2000A generation
hardware is single ended and 12 bit, therefore granularity of output is courser, with a single bitchange at DAC every 8 counts (3 LSBs of argument are don't cares). Negative values are inverted
so output is essentially the absolute value of input argument.
Returns:[RZCD_AOK] if proper DAC value # (-32767 .. 32767) was sent.
[RZCD_ILDV] if improper value for parameter arguments.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..

Set Analog Output (T)This command sets analog data log value from -10 volts to +10 volts in 16 bit precision. Analog voltage
will track this value if the #9 system parameter (Group 3/C/D) is set to 4, computer control of analog output(either via user menu or remote RS232 D9=4 command). The range of numbers is -32767…32767.
Command Examples
Command
T=-6556
ResponseA
Description
Sets DAC to -6556 counts, which will produce approximately -2.05 volts at the analog
output if the system parameter for analog output function is set to REMOTE.
Table 28.10: Group 11 Examples.

______________________________________________________________________

Process Sequencing - Process Size, Memory

Process Sequencing - Process Size, Memory Group 12 -Commands U & V(U,V)

These commands determine the number of steps in a process and the amount of process memorystorage available.

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p STC-2000A DEPOSITION CONTROLLER y(U) - Reads Number Of Steps (00 ...99) In A Given Process (1.....9)(V) - Reads Process Step Memory Storage Still Available

Process Sequencing - Process Size Memory(U,V)
The U command requests a readback of the number of steps in use in the designated process recipe (as per
the parameter 1..9). A recipe with only the END layer present uses zero (0) steps.
The V command requests a readback of number of process steps storage still available for use in the STC2000A instrument. There is a capacity within the instrument for a total of 250 process steps, which may be
assigned from 0 to 99 to a process recipe. For example, nine processes each having 27 steps in each would
use up 243 steps, leaving a remainder of 7 available. This is the value (7) returned by this query. Anyprocess which has fewer than 99 steps may be extended with more steps providing there is memory
available (as indicated by the return of this command). Deletion of steps of some other process may benecessary to free up steps should no steps be available to extend the process which needs extension.
______________________________________________________________________
Command:U
Mnemonic:
EXCT_plenth (Process Length)
Parameters:[1..9] corresponding to process recipe programs 1..9.
Description:
Requests a readback of the number of steps in the designated process recipe.
Returns:[RZCD_AOK][0..99] if proper process # (1..9) was sent.
[RZCD_ILCD] if unit is non-sequencing instrument.
[RZCD_ILDV] if improper value for parameter argument.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..
______________________________________________________________________
Command:V
Mnemonic:
EXCT_pavail (Process steps available)
Parameters:
None
Description:
Request readback of number of process steps storage still available for use in STC-2000A
instrument. There is capacity within the instrument for a total of 250 process steps, which may be
assigned from 0 to 99 to a process recipe. Nine processes each having 27 steps each would use up
243 steps, leaving a remainder of 7 available. This is the value returned by this query. Any process
which has fewer than 99 steps may be extended with more steps providing there is memory
available (as indicated by the return of this command). Deletion of steps of some other process
may be necessary to free up steps should no steps be available to extend the process which needs
extension.
Returns:[RZCD_AOK][0..250] indicating the number of available process steps left to be assigned to aprocess recipe.
[RZCD_ILCD] if unit is non-sequencing instrument.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..
______________________________________________________________________

Command Examples
Command
Response
Description

U2
A17
Query of process 2 indicates 17 layers of a possible 99 are programmed.

Command
Response

V
A250

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Description
Query of free (unused) steps available indicates 250 are unused. This means none havebeen used for any processes, therefore, no processes can be run at this time. Once a process sequence isprogrammed, this number will be reduced to show the remaining free space.
Table 29.11: Group 12 Examples.
______________________________________________________________________

Process Sequencing - Read, Write, Edit Processes

Process Sequencing - Read, Write, Edit Processes Group 13 -Commands W-Z, a-dCommands W, X, Y, Z, a, b, c, dThese Commands Read, Write, Or Edit The Process Sequencing Steps.
(W) - Erase Process Step(X) - Insert Process Step(Y) - Read Layer Mode Setting(Z) - Set Layer Mode Setting(a) - Read Layer Film Setting(b) - Write Layer Film Setting(c) - Read Layer Final Thickness Setting(d) - Write Layer Final Thickness Setting______________________________________________________________________
Process Sequencing Read, Write, Edit Processes(W,X,Y,Z,a,b,c,d)
The W command requests that the designated step of the selected process be erased, and any steps
following will be compacted up.
The X command commands the STC-2000A to insert a new step into recipe, with the mode type as
specified. Defaults the new step’s film number to 1, and its final thickness limit to 0 Angstroms. Afterinsertion of a new step the film and thickness values can be changes with the ‘b’ & ‘d’ commands.
PROCID ranges 1..9 to select the process to insert the new step into. STEPID ranges from 1..99 and if it
exceeds the current length of the process it will be interpreted so as to add a new step at the end.
The Y command requests a readback of a process step’s mode setting. Returns a numeric value
corresponding to a mode per the chart below.
List of valid mode codes for a step:
End of recipe, some earlier step last valid step, use ‘U’ command above.
0. MODE_end
1. MODE_autoAuto start, this step will run at the end of previous step automatically.
2. MODE_wait
Wait at this step for a process.
3. MODE_skip
Skip this step and advance to others, if any.
4. MODE_stop
Stop the process run, prepare to reset again.
‘Z’ commands the STC-2000A to set process step’s mode to a new value. This command issimilar to the ‘X’ command except it changes mode of existing step rather than inserting a new one.
Changing mode to MODE_end truncates the rest of the process recipe, freeing up step memory to available
list (see ‘V’ command above).
The ‘a’ command requests a readback of a process step’s film number setting. Returns a numericvalue (1..99) identifying the film program which the process step will execute when active.
The ‘b’ command requests the STC-2000A to set a process step’s film selection to a new value.
The ‘c’ command requests a readback of a process step’s final thickness limit value setting. It returns anumeric value (0-9999999 angstroms) for the current setting of the target process step.

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The ‘d’ commands the STC-2000A to set a process step’s thickness limit to a new value.
______________________________________________________________________
Command:Mnemonic:
Parameters:
Description:

W
EXCT_perase (Process erase)[PROCID] [STEPID] with PROCID ranging from 1..9 to select the recipe to alter.
STEPID ranging from 1..99 selecting the step to delete.
Request that the designated step of the selected process be erased, and any steps
following will be compacted up.

Returns:[RZCD_AOK] if proper recipe # and step # sent and able to delete the step.
[RZCD_ILCD] if unit is non-sequencing instrument.
[RZCD_ILDV] if improper value for parameter arguments.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..
[RZCD_INHB] if the requested step number is beyond the last valid step in the program or the
instrument is running a process and the selected process is the active process.
______________________________________________________________________
Command:Mnemonic:
Parameters:
Description:

X
EXCT_pinsrt (Process insert)[PROCID] [STEPID] [assign_delim] [MODE_TYPE]
Commands STC-2000A to insert a new step into recipe, with the mode type as specified.
Defaults the new step's film number to 1, and the final thickness limit to 0 Angstroms.
After insertion of new step the film and thickness values can be changed with the
EXCT_pwfilm & EXCT_pwthik commands. PROCID ranges 1..9 to select the process toinsert the new step into. STEPID ranges from 1..99 and if exceeds the current length ofthe process will interpret to add a new step at the end.

List of the Valid modes for a step.
1 MODE_autoAuto-start, this step will run at end of previous automatically.
2 MODE_wait
Wait at this step for a process.
3 MODE_skip
Skip this step and advance to others, if any, also used for insert.
4 MODE_stop
Stop the process run, prepare to reset again.
Returns:[RZCD_AOK] if proper process, step and mode numbers were sent.
[RZCD_ILCD] if unit is non-sequencing instrument.
[RZCD_ILDV] if improper value for parameter arguments.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..
[RZCD_INHB] if the instrument is running a process and the selected process is the active
process.
______________________________________________________________________
Command:Mnemonic:
Parameters:
Description:

Y
EXCT_prmode (Process read mode)[PROCID] [STEPID] where PROCID is 1..9 and STEPID is step selector 1..99.
Request a readback of a process step's mode setting. Returns a numeric value
corresponding to a mode per the chart below.

List of the Valid modes for a step readback.
0 MODE_end
End of recipe, previous step last valid step.
1 MODE_autoAuto-start, this step will run at end of previous automatically.
2 MODE_wait
Wait at this step for a process.
3 MODE_skip
Skip this step and advance to others, if any, also used for insert.
4 MODE_stop
Stop the process run, prepare to reset again.
Returns:

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p STC-2000A DEPOSITION CONTROLLER y[RZCD_AOK][mode_value] if proper process and step #s were sent.
[RZCD_ILCD] if unit is non-sequencing instrument.
[RZCD_ILDV] if improper value for parameter arguments.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..
[RZCD_INHB] if step number not valid in specific process program.
______________________________________________________________________
Command:Mnemonic:
Parameters:

Z
EXCT_pwmode (Process write mode)[PROCID] [STEPID] [assign_delim] [MODE_TYPE] where
PROCID identifies target process,
STEPID identifies target step within process,
MODE_TYPE specifies new mode for step from set of types in list below.
Description:
Commands STC to set process step's mode to new value. Command is similar to
EXCT_pinsrt 'X' command above except changes mode of existing step rather than inserting newone. Changing mode to MODE_end truncates the rest of process recipe, freeing up step memory toavailable list (see V command EXCT_pavail above).
List of modes to set step to.
0 MODE_end
End of recipe, previous step last valid step.
1 MODE_autoAuto-start, this step will run at end of previous automatically.
2 MODE_wait
Wait at this step for a process.
3 MODE_skip
Skip this step and advance to others, if any, also used for insert.
4 MODE_stop
Stop the process run, prepare to reset again.
Returns:[RZCD_AOK] if proper process, step and mode numbers were sent.
[RZCD_ILCD] if unit is non-sequencing instrument.
[RZCD_ILDV] if improper value for parameter arguments.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..
[RZCD_INHB] if the requested step number is beyond the last valid step in the program or the
instrument is running a process and the selected process is the active process and the step
being alterred is the current active layer step. Programming the mode for steps other thanthe current active step is valid and allowed.
______________________________________________________________________
Command:aMnemonic:
EXCT_prfilm (Process read film)
Parameters:[PROCID] [STEPID] where PROCID is 1..9 and STEPID is step selector 1..99.
Description:
Request a readback of a process step's film number setting. Returns a numeric value(1..50) identifying the film program which the process step will execute when active.
Returns:[RZCD_AOK][film_value 1..50] if proper process and step #s were sent.
[RZCD_ILCD] if unit is non-sequencing instrument.
[RZCD_ILDV] if improper value for parameter arguments.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..
[RZCD_INHB] if step number not valid in specific process program.
______________________________________________________________________
Command:Mnemonic:
Parameters:

Description:
Returns:

SECTION 6.XXb
EXCT_pwfilm (Process write film)[PROCID] [STEPID] [assign_delim] [FILM_NUMBER] where
PROCID identifies target process,
STEPID identifies target step within process,
FILM_NUMBER specifies new film selection 1-50 for step.
Commands STC to set process step's film selection to new value.

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p STC-2000A DEPOSITION CONTROLLER y[RZCD_AOK] if proper process, step and film numbers were sent.
[RZCD_ILCD] if unit is non-sequencing instrument.
[RZCD_ILDV] if improper value for parameter arguments.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..
[RZCD_INHB] if the requested step number is beyond the last valid step in the program or the
instrument is running a process and the selected process is the active process and the step
being alterred is the current active layer step. Programming the film for steps other thanthe current active step is valid and allowed.
______________________________________________________________________
Command:Mnemonic:
Parameters:
Description:c
EXCT_prthik (Process read thickness)[PROCID] [STEPID] where PROCID is 1..9 and STEPID is step selector 1..99.
Request a readback of a process step's final thickness limit value setting. Returns anumeric value (0-9999999 angstroms) for the current setting of the target process step.

Returns:[RZCD_AOK][thik_value] if proper process and step #s were sent.
[RZCD_ILCD] if unit is non-sequencing instrument.
[RZCD_ILDV] if improper value for parameter arguments.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..
[RZCD_INHB] if step number not valid in specific process program.
______________________________________________________________________
Command:Mnemonic:
Parameters:d
EXCT_pwthik (Process write thickness)[PROCID] [STEPID] [assign_delim] [THIK_VAL] where
PROCID identifies target process,
STEPID identifies target step within process,
THIK_VAL specifies new final thickness value 0..999999 angstroms for step.
Commands STC to set process step's thickness limit to new value.

Description:
Returns:[RZCD_AOK] if proper process, step and thickness numbers were sent.
[RZCD_ILCD] if unit is non-sequencing instrument.
[RZCD_ILDV] if improper value for parameter arguments.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..
[RZCD_INHB] if the requested step number is beyond the last valid step in the program. It isalways legal to change the final thickness value in the recipe, even when the program isrunning the targeted process step layer.
______________________________________________________________________
Command Examples
Command
W2 57
Response
L
Description
Command to erase step 57 of process 2 is invalid because no such step exists, or process
is currently active.
Command
Response
Description

W1 13
ACommand to erase step 13 of process 1 is successful.

Command
X1 89=1
ResponseA
Description
Command to insert a step in a process has succeeded. Any step which were already at orafter the 89th step have been renumbered so as to follow step 89. If the last preexisting step was less than

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p STC-2000A DEPOSITION CONTROLLER y
89, the inserted step is placed at the previous last step plus one. For example, if prior to the X1, 89=1
command above the last step was 3, then a new step 4 was created.
Command
Y1 13
Response
A1
Description
Command to query step 13 of process 1 is successful. The 1 value indicates the step is
occupied and is an AUTO step.
Command
Response
Description
WAIT.

Z1 13=2
A
Command to reprogram step 13 of process 1 is successful. The new mode of the step isCommanda9 3
Response
A4
Description
Command to query step 3 of process 9 is successful. The numeric return of 4 indicatesfilm 4 is the active film for step 3 of process 9.
Command
Response
Description

b4,5=6
A4
Command to set step 5 of process 4 to film #6 is successful.

______________________________________________________________________

Measurement Substitution Group

Measurement Substitution Group Group 14 –Commands e,f,g
These commands substitute or over-ride measurement modes.
(e) - Over-rides thickness measurement.
(f) - Substitutes measurement mode.
(g) - Substitutes rate measurement mode.
Measurement Substitution Group(e,f,g)
The ‘e’ command either queries (if parameter is ?) or sets the measurement override system. A
setting of 0 disables the override and allows the system to make measurements from the crystal sensor. A
value of 1 selects thickness override and the STC-2000A uses thickness values provided via thecommunications link using the (‘f’) command below. A value of 2 selects rate override mode, where the‘f’ command updates rate information, and this rate is integrated to produce thickness update within the
instrument. A value of 3 selects dual override, where both datum are substituted, with the thickness value
sent with the ‘f’ command, and the rate encoded with the ‘g’ command.
The ‘f’ command sends a numeric value which has meaning when the instrument is set in a
thickness override (1,3) or rate override (2) mode. If instrument is in 0 mod, then the value is ignored.
Values from -9999999 to 9999999 allowed. Tenth Angstrom or hundredths A°/sec units.
The ‘g’ command sends a numeric value which has meaning when the instrument is set in dual
rate/thickness override (3) mode. If the instrument is in modes 0,1,2 then the value is ignored. Values
from -999999 to 9999999 hundredths A°/sec allowed______________________________________________________________________SECTION 6.XX

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p STC-2000A DEPOSITION CONTROLLER y______________________________________________________________________

Purge all I.O Programs

Purge all I.O Programs Group 15 –Command hThis command clears the entire I/O program of the current bank to empty.
Purge all of I/O Program (h)The ‘h’ command clears the entire I/O program of it’s current bank to empty. Requires =200 towork as a safety.
______________________________________________________________________

Command:hMnemonic:
EXCT_iopurg
Parameters:=200 as a safety.
Description:
Clears entire I/O program of current bank to empty.
Returns:[RZCD_AOK] if proper parameter value was sent.
[RZCD_ILDV] if improper value for parameter arguments.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..

External Memory Module Status

External Memory Module Status Group 16 –Command IThis command queries the STC-2000A for current status of the optional external memory module <notimplemented>.
External Memory Module Status (i)The ‘I’ command queries the STC-2000A for current status of the External Memory Module.
Returns 0,1, or 2 indicating: (0) not installed, (1) installed, or (2) bogus, meaning system hung waiting forclear key to be pressed.
Command:Mnemonic:
Parameters:
Description:
Returns:i
EXCT_mrxstat
none.
Queries STC-2000A for current status of Memory Module.
Numeric value 0, 1 , 2 for not installed, installed, bogus. Bogus means system is menu
hung until a clear key is pressed.
[RZCD_AOK] if proper parameter value was sent.
[RZCD_ILDV] if improper value for parameter arguments.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc.

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Command
Response
Descriptioni
A0
Memory Module not installed.

______________________________________________________________________

Command:^Mnemonic:
EXCT_trapinfo
Parameters:? or ! with no delimiters or U followed by ? or ! for UIFC.
Description:
sys_trap information display (?), clear (!).
Returns:[RZCD_AOK] if proper parameter value was sent. If was a ^? or ^U? query then returns a resultof the form:
J,N
where J and N are major and minor sys_trap numbers whose meaning is dependent on
the source code. Values of 0,0 indicate no captured error states.
[RZCD_ILDV] if 2nd character (parameter) is other than ? or ! or U ; or if 2nd character is a U
and third character is other than ? or !.
[RZCD_ILCD] if command expression too long or too short (more than correct trailing parametersor missing any argument parameter info).
Examples:^?
query current state of SCUP sys_trap error codes. Returns valid reply per syntax above such as:
A1,2^! clear sys_trap error codes to 0,0 . Armed to get new error conditions. Replies with just the
RZCD_AOK value.
^ missing needed argument, returns RZCD_ILCD.
^ABC More argument than needed, returns RZCD_ILCD.
^4 Argument wrong value, returns RZCD_ILDV.
______________________________________________________________________
Command:Mnemonic:
Parameters:
Description:j
EXCT_flush=2001
Flush non-vol and reboot as if a Service-Purge performed. The syntax of the j command
allows spaces around the '=' operator. The numeric value of 2001 is a security key toinsure that the function is only activated intentionally to purge parameter, sequencing,process accounting and I/O memory.

Returns:[RZCD_AOK] if proper parameter value was sent. Unit will reboot after approximately 2 seconds,
and recover to a runtime mode with the system 'hung' in a state which requires user
acknowledgement (via front panel or RS232 event) before deposition can occur.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc. such that format is not of the form
j=NUMBER.
[RZCD_ILDV] if NUMBER following the = operator is other than the correct value of 2001.

______________________________________________________________________
Command:Mnemonic:

SECTION 6.XXl
EXCT_CfgManip

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p STC-2000A DEPOSITION CONTROLLER yParameters:either ID=VAL or ID
ID is a firmware dependent value which can range from 1 to QUAN_COPTCS, currently
4 (see table below). The value of VAL (when used) can range 0..254, but only legal
values will actually be stored into the ID slot. What values are legal for each specific ID
are detailed in the table below.
Description:
Manipulate configuration items for new reboot. If the 'l' token is followed by just the ID(see table below) then the current value of the service configuration entry is returned. If the parameter is of
the form ID=VAL, then the service configuration value is modified to the new value VAL, and the previous
value is returned (before modification) as though a simple query was sent. Allows setting of Service mode
reboot attributes akin to what the user can do via the Service menu screen, giving remote computer controlof the Test mode, Purge, Factory, etc. modes.
Returns:
Table of ID values and VAL values and their meanings.
ID#
VAL Range
Description
1
0..1
Test mode, set to true (1) if desire test mode. Default is 0, or false. Any non-zerovalue for VAL when sending the l1=NNN message will be interpreted as TRUE and store a legal 1
value.That value can be later polled with a l1 query. When unit is rebooted, a TRUE setting will
be acted upon, and the TEST mode will be in effect until the next reset/reboot. The setting of theconfiguration values is not 'sticky', meaning they are lost after reboot and need to be re-sent if
desired to take action again.
2
0..1
Make the SQ unit type act like Non-SQ (A) after rebooting. Like ID 1 above, any
non-zero VAL value is interpreted as TRUE.
3
0..1
Make the non-SQ unit type act as SEQ (B) after rebooting. Like ID 1 above, any
non-zero VAL value is interpreted as TRUE. NOTE: no more than one of the two ID 2 and 3
values above should be set to TRUE (1), since they are mutually contradictory. Both can be set to
FALSE (the default) since no action would then be taken during the next reboot. If both options
are set to TRUE, then the ID # 3 option (act like sequencing) has the priority, and the unit will
power up in a SQ capable mode.
4
0..4
Want a power up force of data base to other than remembered nonvolatile state. The
three value choices of 0,1 and 2 correspond to the following meanings:
0 PRGMOD_as is : leave memory state as is. The default state, in effect, take no action.
1 PRGMOD_purged : everything set to forgotten default values. safe. The unit will haveno usefull program content and will need programming by the customer.
2 PRGMOD_factory: everything set to as if RS232 download, same as purge above,
except the I/O program is left alone and certain film and sys. configuration parameters
are preloaded to allow the customer to run simple film operations as in instruc. manual.
3 PRGMOD_clone
4 PRGMOD_archiveID#
VALUE Range Description
1
0..1
Test mode, set to true (1) if desire test mode. Default is 0, or false. Any
non-zero value for VAL when sending the l1=NNN message will beinterpreted as TRUE and store a legal 1 value.That value can be later polledwith a l1 query. When unit is rebooted, a TRUE setting will be acted upon,
and the TEST mode will be in effect until the next reset/reboot. The settingof the configuration values is not 'sticky', meaning they are lost after reboot
and need to be re-sent if desired to take action again.
2
0..1
Make the SQ unit type act like Non-SQ (A) after rebooting. Like ID 1
above, any non-zero VAL value is interpreted as TRUE.
3
0..1
Make the non-SQ unit type act as SEQ (B) after rebooting. Like ID 1 above,
any non-zero VAL value is interpreted as TRUE. NOTE: no more than oneof the two ID 2 and 3 values above should be set to TRUE (1), since they
are mutually contradictory. Both can be set to FALSE (the default) since noaction would then be taken during the next reboot. If both options are set to
TRUE, then the ID # 3 option (act like sequencing) has the priority, and theunit will power up in a SQ capable mode.
4
0..4
Want a power up force of data base to other than remembered nonvolatile

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p STC-2000A DEPOSITION CONTROLLER ystate. The five value choices of 0,1, 2, 3 and 4 correspond to the following
meanings:
Value Access
Description
0
PRGMOD_as isleave memory state as is. The default state,in effect, take no action.
1
PRGMOD_purged
everything set to forgotten default values.
safe. The unit will have no usefull programcontent and will need programming by thecustomer.
2
PRGMOD_factory
everything set to as if RS232 download,same as purge above, except the I/O
program is left alone and certain film andsys. configuration parameters are preloaded
to allow the customer to run simple film
operations as in instruction manual.
3
PRGMOD_clone
program STC-2000A from memory
module contents
4
PRGMOD_archivesave STC-2000A programming to memory
module______________________________________________________________________
Command:m
Mnemonic:
EXCT_SSMAP_QRY
Parameters:either <SSMAP#>,<SPARM#9..N> or <SSMAP#>,<CHNL#1..8>,<CPARM#1..N>
Description:
Command to query the multichannel Source/Sensor map parameters used to configure themeasurement process applied to a film. SSMAP# is an integer, 1..10, identifying which map is being
interrogated. The second parameter, when in the range of 1 or 2, indicates a sensor channel (crystal head)
configuration is targeted, with the third parameter CPARM# ranging from 1..N (see table of
SnsChnlAtrb_class SCA_xxx_G values below). The second parameter, when in the range of 9..N, willassociate with the sensor map SPID_OUTFS (FIRST_GENERIC_SENSOR_MAP_P) thru
LAST_GENERIC_SENSOR_MAP_P (SPID_SFAILM) value per the SPARM# table below.
______________________________________________________________________
Table of Sensor Map non-channel related parameter SPARM#s for second parameter in range of 9..NSPARM#

Label

Description

9

OUTFS

Source output full scale volt. Is an enumeration value of CFSV_class

10

SMAXP

0

CFSV_2V

2.5 volts full scale.

1

CFSV_5V

5 volts F.S.

2

CFSV_10V

10 volts F.S.

Source output max power (additional) percentage.
0.0 to 100.0 percent.

11

SOCHL

Source output analog channel number 1 or 2

12

MTOOL

Master tooling 10.0-400.0%, like tooling.

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13

MINSC

Minimum Starting Contributors, 1 or 2.

14

MINRB

Minimum Remaining Backups for good start, 0..1 .

15

PLTUN

Platoon strength, min. # of contrib channels 1..2.

16

SFAILM

Sensor failure mask, how to recover when averaging mode has a sensor
channel failure (FMSK_class)
0 FMSK_NONE
No channel-failure rate-glitch correction.
Whatever happens with missing contributor occurs.
1 FMSK_FULL_MASK Full substitute via aggreg. multi-plier for rate
glitch continuously.

17

RSYN

Rotator synchronization type, none, delayed, feedback

18

RSYNTM

Rotator synchronization time 2..999 secs.

______________________________________________________________________
Table of SnsChnlAtrb_class CPARM# values as third parameter
when second parameter for CHNL# channel 1-2.
---------------------------------------------------------CPARM#

Label

Description

1

SSMOD

Starting Mode: of SMOD_class 1..30 SMOD_OFF
channel not active
1 SMOD_ACTIVE channel active at start
2 SMOD_STANDBY channel needed as backup

2

SFOP

Sensor Fail Operation of SFMOD_class 1..2
0 SFMOD_NOTHING no special failure operation
1 SFMOD_FILM_FAIL film failure signalled.
3 SBAKS Sensor Backup list, ordered list of channel numbers
which is saved as long integer form of decimallist of 8 digits, from 00 (0) to 22.
Any form not exceeding the digit 2 and mathematicallybetween 0..22 can be conceptually entered,but data entry process will compress the information
into minimum form by removing redundant(subsequent) numbers.

4

STOOL

Sensor Tooling factor 10.0 to 400.0 percent.

5

SWGHT

Sensor averaging weighting factor. 10.0 to 400.0.

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Returns: Error codes typical to format or range failure if format is incorrect. Returns [RZCD_AOK]
followed by parameter's value as stored in system ( enumerations start w/0 values, numbers having numeric
meanings stored naturally except floating point values are stored as integer values with implied decimal
points of fixed precision ). For example, m2,2,4 will query SS Map # 2, Crystal/Sensor channel 2, toolingvalue from 10.0 to 400.0 percent for internal storage value of 100 to 4000 .
______________________________________________________________________
Command:Mnemonic:
Parameters:n
EXCT_SSMAP_UPD
either <SSMAP#>,<SPARM#9..N>=<QQ> or<SSMAP#>,<CHNL#1..2>,<CPARM#1..N>=<QQ>
Description:
Command to set/program the multichannel Source/Sensor map parameters used toconfigure the measurement process applied to a film. SSMAP# is an integer, 1..10, identifying which map
is being programmed. The second parameter, when in the range of 1..2, indicates a sensor channel (crystal
head) configuration is targeted, with the third parameter CPARM# ranging from 1..N (see table of
SnsChnlAtrb_class SCA_xxx_G values in 'm' command above). The second parameter, when in the rangeof 10..N, will associate with the sensor map SPID_OUTFS (FIRST_GENERIC_SENSOR_MAP_P) thru
LAST_GENERIC_SENSOR_MAP_P (SPID_SFAILM) value per the SPARM# table above ( see 'm'command above).
Returns:[RZCD_AOK] (A or B) if correctly processed.
[RZCD_ILDV] if improper value for parameter argument.
[RZCD_ILSN] if too many arguments, wrong delimiters, etc..
[RZCD_INHB] if chosen parameter can not be programmed at this time. This currently does not
apply to any sensor map parameters, but could change in future, as needed.
______________________________________________________________________
Command:]Mnemonic:
EXCT_echochek
Parameters:
Any and all
Description:
Special test code to implement test software, will echo back complete string content
identical to what was sent in. That is, sending ]HELLO returns the result of [RZCD_AOK]]HELLO where[RZCD_AOK] is either an A or B.
Returns:[RZCD_AOK]]xxxxx where xxxx is whatever was sent in to the parser following the ] character.

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SECTION 7.0

Theory and Calibration

Measurement Theory
The STC-2000A uses the resonant frequency of an exposed quartz crystal to sense the mass ofdeposited films attached to its surface. There is a known relationship between the mass of such a film andthe measured frequency of the sensor crystal. Knowing the frequency change due to accumulated mass,film thickness is determined by the following equation:

Equation 1:⎡ Π • ( Fq - Fc) ⎤⎤⎡ ( Nq • Dq ) ⎤
⎡
•
⎢
⎥⎥
Z
Tan
Af = ⎢⎥ • ArcTan ⎢
Fq
(
)
⎢
⎥⎦⎦
Π
•
•
•
Df
Z
Fc
⎣
⎣
⎢⎣
⎥⎦

Where the terms used in the equation are defined as:
Af
Film Thickness, in Angstroms (1a=10-10 Meters)
Nq
Dq

Π
Df
Z

Fq
Fc

Frequency Constant for AT Cut Crystal, 1.668 X 1013 Hz/ÅDensity of Quartz 2.648 gm/cm3
The Constant Pi, 3.14159265358979324
Density Of Film Material in gm/cm3
Z-Factor of material, is the square root of the ratio [(Dq*uq)/(Df*uf)]. Dq and Df are thedensities as above and uq and uf are the shear moduli of quartz and the film, respectively.
These values are available in several materials handbooks.
Frequency of sensor crystal prior to depositing film material on it. This value is amanufacturing controlled constant.
Frequency Of Loaded Sensor Crystal.

Measuring Period
By measuring the period of the sensor oscillator signal and using a stable reference clock, an
extremely accurate frequency value for Fc is derived using advanced counter technology. Ten times per
second, a new value is determined and used to update the above equation. The mathematics is computed
using IEEE double precision floating point format, ensuring the most accurate results obtainable from theexact equation, even over wide extremes of the Z-Factor and density parameters used in thin film
deposition. Use of the tangent and arctangent functions to compute the film thickness to the resolution of
the floating point numeric format (56 bits of resolution) ensures maximum accuracy. Previous solutions
incorporated approximations to eq1 or dealt strictly with the period type of measurement solution. The
thickness zero function stores as a base or offset the current sensor frequency and film thickness
information, which is then continuously subtracted from the later updated readings, yielding a deposited
film thickness value based on accumulated material since the latest zero function was performed.

Rate Computation
Rate computation is based on the rate of change of these thickness readings, updated ten times per
second, then filtered for display. Also available from the instrument is the raw measured frequency of thesensor crystal.

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Thickness Reading Calibration

SECTION 7.1
Thickness

Instrument calibration is affected by three different parameters, material density, material
Z-Factor, and tooling. Tooling is a deposition system geometry correction (location of sensor relative to
substrates). Density and Z-Factor are material factors.

Density Determination
Use of the material bulk density value will normally provide sufficient film thickness accuracy. If
additional accuracy is required, the following procedure may be used:

Density
Using a new sensor crystal (this eliminates Z-Factor errors) place a substrate adjacent to the sensor
so that both sensor and substrate see the same evaporant stream. Set the instrument density to the bulk
value of the material (see the Material Reference Table in Section 7.2). Set the Z-Factor to 1.000 and theTooling Factor to 100%. Deposit approximately 5000 Angstroms of material on the sensor and substrate.
After deposition remove the substrate and measure the film thickness with a profilometer or multiple beaminterferometer. The correct density value may be determined by the formula:( Density Parameter) • (Reading)⎛ Gm ⎞⎟ =Density ⎜⎝ cc ⎠(Measured Thickness)
The calculated value may be checked by setting the STC-2000A density parameter to thecalculated value and observing that the STC-2000A thickness display shows the corrected reading. Minor
value adjustments can be made to make the measurements and calculations exactly equal.

Z-Factor Determination
A list of Z-Factor values may be found in the Material Reference Table in Section 7.2. For othermaterials Z-Factor may be calculated by the following formula:

Z-Factor
1
2⎡ Dq • Uq ⎤Z - Factor = ⎢⎣ Df • U f ⎦⎥Dq = Density Of Quartz
Uq = Shear Modulus Of Quartz
Df = Density Of Film
Uf = Shear Modulus Of Film
The density and shear modulus values may be found in many material reference handbooks.
Z-Factor values are typically very close to bulk values. High stress materials seem to have values
slightly lower than expected.
For a more exact solution make a calibration deposition similar to the density method. Use thecalibrated density value, a Z-Factor of 1.000 and a tooling of 100%. Deposit a thick film using at least 50%of the sensor crystal life. Measure the substrate and then adjust the STC-2000A Z-Factor parameter until
the correct thickness is displayed.

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Tooling Determination
Place a substrate in the normal holder location and deposit a film of approximately 5000
Angstroms using either bulk or calibrated density and Z-Factor values. Make sure that when doing thiscalibration the tooling is set to 100%. Measure the substrate film thickness as in the density calibration
method and determine the correct Tooling Factor value by the following formula:

Substrate
SensorSensorSubstrate

SourceSourceTOOLING > 100%TOOLING < 100%

Figure- 31.13: Typical Tooling factors

Tooling

SECTION 7.XX

%

= 100

×

( Substrate Thickness( Displayed Thickness

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p STC-2000A DEPOSITION CONTROLLER y
SECTION 7.2

Material Reference Table
Common Material
Bulk Density And Z-Factor Values

Material

SymbolBulk Density
gm/cc

Z Factor

Aluminum
Aluminum Oxide
Antimony
Arsenic
BariumBeryllium
Bismuth
Bismuth Oxide
Boron
Cadmium
Cadmium Selenide
Cadmium Sulfide
Cadmium Telluride
Calcium
Calcium Fluoride
Carbon (Diamond)
Carbon (Graphite)
Cerium (III) Fluoride
Cerium (IV) Oxide
Chromium
Chromium (III) Oxide
CobaltCopperCopper (I) Sulfide (A)Copper (I) Sulfide (B)Copper (III) Sulfide
Dysprosium
ErbiumGadolinium
Gallium
Gallium Arsenide
GermaniumGold
Hafnium
Hafnium Oxide
Holnium
Indium

Al
Al2O3
Sb
As
Ba
Be
Bi
Bi2O3
B
Cd
Cdse
Cds
Cdte
Ca
CaF2
C
C
CeF3
CeO2
Cr
Cr2O3
Co
Cu
Cu2S (A)Cu2S (B)
CuS
Dy
Er
Gd
Ga
GaAs
Ge
Au
Hf
HfO2
Ho
In

2.73
3.97
6.62
5.73
3.50
1.85
9.80
8.90
2.54
8.64
5.81
4.83
5.85
1.55
3.18
3.52
2.25
6.16
7.13
7.20
5.21
8.71
8.93
5.60
5.80
4.60
8.54
9.05
7.89
5.93
5.31
5.35
19.3
13.1
9.63
8.80
7.30

1.080
-------0.768
0.966
2.100
0.543
0.790
-------0.389
0.682-------1.020
0.980
2.620
0.775
0.220
3.260
--------------0.305-------0.343
0.437
0.690
0.670
0.820
0.600
0.740
0.670
0.593
1.590
0.516
0.381
0.360
-------0.580
1.650

Table 7.1: Material Reference Table. Continued

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Aluminum throughIndiump STC-2000A DEPOSITION CONTROLLER y
Material

SymbolBulk Density
gm/cc

Z Factor

Indium Intimonide
Indium Oxide
Iridium
Iron
Lanthanum
Lanthanum Fluoride
Lanthanum Oxide
Lead
Lead Sulfide
Lithium
Lithium Fluoride
Magnesium
Magnesium Fluoride
Magnesium Oxide
Manganese
Manganese (II) Sulfide
Mercury
Molybdenum
Neodynium Fluoride
Neodynium Oxide
Nickel
Niobium
Niobium (V) Oxide
Palladium
Platinum
Potasium Chloride
Rhenium
Rhodium
Rubidium
Samarium
Scandium
Selenium
SiliconSilicon (II) Oxide
Silicon Dioxide
SilverSilver Bromide
Silver Chloride
Sodium
Sodium Chloride
SulfurTantalum
Tantalum (IV) Oxide
Tellurium
Terbium

InSb
In2O3
Ir
Fe
La
LaF3
LaO3
Pb
PbS
Li
LiF
Mg
MgF2
MgO
Mn
MnS
Hg
Mo
NdF3
Nd2O3
Ni
Nb
Nb2O5
Pd
Pt
KCl
Re
Rh
Rb
Sm
Sc
Se
Si
SiO
SiO2
Ag
AgBr
AgCl
Na
NaCl
S
Ta
Ta2O5
Te
Tb

5.76
7.18
22.4
7.86
6.17
5.94
6.51
11.3
7.50
0.53
2.64
1.74
3.00
3.58
7.20
3.99
13.46
10.2
6.506
7.24
8.91
8.57
4.47
12.0
21.4
1.98
21.04
12.41
1.53
7.54
3.00
4.82
2.32
2.13
2.20
10.5
6.47
5.56
0.97
2.17
2.07
16.6
8.20
6.25
8.27

0.769
-------0.129
0.349
0.920
--------------1.130
0.566
5.900
0.774
1.610
-------0.411
0.377
0.940
0.740
0.257
--------------0.331
0.493-------0.357
0.245
2.050
0.150
0.210
2.540
0.890
0.910
0.864
0.712
0.870
1.070
0.529
1.180
1.320
4.800
1.570
2.290
0.262
0.300
0.900
0.660

Table 7.1: Material Reference Table. Continued.

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Indium Intimonide
Through Terbiump STC-2000A DEPOSITION CONTROLLER y
Material

Thallium
Thorium (IV) Fluoride
Tin
Titanium
Titanium (IV) Oxide
Titanium Oxide
TungstenTungsten Carbide
Uranium
Vanadium
Ytterbium
Yttrium
Yttrium Oxide
Zinc
Zinc Oxide
Zinc Selenide
Zinc Sulfide
Zirconium
Zirconium Oxide

SECTION 7.XX

SymbolBulk Density
gm/cc

Tl
11.85
ThF4
6.32
Sn
7.30
Ti
4.50
TiO2
4.26
TiO
4.90
W
19.3
WC
15.6
U
18.7
V
5.96
Yb
6.98
Y
4.34
Y2O3
5.01
Zn
7.04
ZnO
5.61
ZnSe
5.26
ZnS
4.09
Zr
6.51
ZrO2
5.6
Table 7.1: Material Reference Table.

page 271 of 292

Z Factor

1.550-------0.724
0.628
0.400
-------0.163
0.151
0.238
0.530
1.130
0.835
-------0.514
0.556
0.722
0.775
0.600
--------

Thallium throughZirconium Oxide

p STC-2000A DEPOSITION CONTROLLER y

Section 8.0 Maintenance/Problem Solutions
Maintenance of STC-2000A Deposition Controller

Hazardous Voltages Present
WARNING There are potentially lethal voltages present within the STC-2000A control unit witha line cord or an INPUT/OUTPUT cable attached. Service should be attempted by qualified personnel
only. Disconnect all cables and power cord when removing, installing, or servicing any component of the
STC-2000A instrument.
See Section 3.19,"OPTions/INFo" for diagnostics
Static Sensitive
CAUTION The STC-2000A and remote oscillator contain static sensitive components. Use
adequate and appropriate precautions when attempting any service to these devices. Discharge yourself bytouching the ground stud on the STC-2000A before disconnecting the power cord. The power cord
provides a path back to earth ground through the AC outlet. This will equalize the voltage potential
between you and the STC-2000A. It is recommended that work be done on a properly grounded mat ortable surface.
User Correctable System Problems

SYMPTOMCAUSE

REMEDY

1. No LED/LCD displaysa. Blown fuse (1 or more of 3)b. Power switch offc. Line cord loose or unplugged

Replace fuse(s)Switch on unit.
Tighten cord.

a. Bad or severely oxidized
sensorb. Crystal cable connections tooscillator or sensor missing or
loose
c. Severe material buildup onedges of crystal holder causing ashort at the sensor
a. Defective crystal

New crystal.

b. Crystal near end of lifec. Particles or flakes on crystal
seating surface
4. Crystal stops suddenly during a. Crystal being hit by small
deposition before reaching typical droplets of molten material
source life expectancy.
5. Thermal instability (large
a. Poor crystal seatingchange in thickness reading
during source warm-up)
b. Poor or no water flowc. Excessive heating due tosecondary electron formation insome sputtering systems

New crystal.
Clean sensor.

(See section 2.21 for additional
diagnostic information)

2. Constant crystal fail message

3. Large thickness jumps during
deposition

SECTION 8.XX

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Check cables.

Clean sensor.

New crystal.

Move farther from source.

Clean sensor.

Correct flow.
Increase water flow to
sensor.

p STC-2000A DEPOSITION CONTROLLER y

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SYMPTOM

CAUSE

6. Poor thickness reproducibility

a. Poor source emission pattern

7. Computer interface failure

SECTION 8.1

REMEDY

Move sensor.
Check source.
b. Material adhesion to sensor poor New crystal.
a. Baud rate wrong
Correct configure.
b. Format wrong
Correct configure.
c. Device address wrong
Correct configure.
d. Cable connection bad
Check wiring.

Replacing A Sensor Crystal

The procedure for replacing the 6 MHz sensor crystal is the same for any type sensor head. Usecaution in handling the crystals as they are very fragile. Chipped, cracked, dirty or stained crystals should
not be used.
CAUTION
Crystals should never be handled with bare hands! Always use clean lab gloves
and plastic tweezers to handle a crystal. This will avoid surface contamination of the crystal thatmight lead to poor electrical surface contact and possible poor film adhesion.
Dielectric films sometimes do not adhere strongly to the crystal surface and can cause erratic
readings. Some dielectric will peel off the crystal when it is exposed to air. This is caused by gas absorption
greatly changing the film stress characteristics. If peeling is observed, change to a new clean crystal.
Follow the procedures outlined below to change a sensor crystal.
1.
Grip the sensor cap with a gloved hand and pull to unsnap the cap. The sensor crystal is captured
in the cap. Place the sensor cap on a flat surface with the front face up and pop the crystal out bypressing gently down on the coated crystal surface with clean plastic tweezers or a similar type
instrument. The crystal should come out easily. Take care not to damage the cap aperture opening
to the crystal. Turn the cap over and place a new crystal with the fully coated surface towards theaperture opening (this side receives the evaporate stream) in the sensor cap. Use plastic tweezers
to handle the new crystal.
2.
Gently press the crystal into the finger spring holders using the plastic tweezers. This operation
does not require much force. The crystal movement to become held by the finger springs is only
about 25 thousandths of an inch. The sensor cap now holds the sensor crystal firmly in place. The
cap may now be snapped into the sensor body.
3.
Verify that the newly installed crystal is operating by looking at the STC-2000A "XTAL x
XX%" indicator legend in the upper left of the LCD display. The XTAL x XX% should report
some percentage of crystal life. If the "XTAL x BAD" legend is present check for damaged
cables, a cracked or broken crystal, or dirty contact surfaces in the sensor cap.

SECTION 8.2

Persistent Crystal Fail Indication

If you have replaced the sensing crystal and the XTAL x BAD indication persists, the problem caneither be in the electronics of the STC-2000A or in the sensing head or the cabling and connections to thesensing head. Historically most problems have been found to be somewhere in the electrical connection
path. Many mechanical electrical connections exist between the sensing crystal and the oscillator unit andit is therefore sometimes difficult to locate this problem. Remote oscillators have a test feature to help
isolate this type of problem, refer to Figure 8.3. A test push-button is provided on the oscillator. Thisbutton connects an internal test crystal located inside the remote oscillator in place of the normal sensing
head. (By pressing this switch, the electrical path to the sensor from the oscillator is broken and a fixed
5.500MHz crystal inside of the OSC-100 is substituted.) If the STC-2000A and remote oscillator are
functioning correctly the bad crystal indication will go away and the crystal life indication on the STC-SECTION 8.XX

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2000A should read about 50% while this button is depressed. If this is observed while this button isdepressed the problem of the persistent bad crystal indication has been isolated to be in the path between
the remote oscillator and the sensing crystal. If the bad crystal indication continues while this button isdepressed, then the failure is: in the programming of the sensor selection, in the electronics of the remoteoscillator, in the STC-2000A unit itself or in the connecting cable. This push-button can be activated byinserting a small rod or wire, like a straightened paper clip in the 'push to test' hole and depressing theswitch.

Figure 8.1: Sensor and Feedthrough Connections.

OSC-100A OSCILLATOR
Push to Test
Serial No.

4571

instruments

East Syracuse, NY

Figure 8.2: Test Oscillator OSC-100A.
The fastest and easiest way to check for a good connection path between the Remote Oscillator
and the sensing crystal is to measure the electrical resistance of the cables with a Ohm meter capable ofreading 0.10 Ω. Remove the oscillator from the 6" BNC cable, and remove the sensor cover and sensing
crystal from the sensing head. Measure the resistance from one of the center push spring contacts inside
the sensor unit to the center conductor of the cable normally connected to the oscillator. The reading
should be less than 0.20 Ω. The center conductor to the cable shield should be open (greater than 30 MΩ)with respect to the outside ground shield of the cable. This check will verify all the connections from thesensor, the InVac cable, the vacuum feedthrough, and the BNC cable.

®

Figure 8.3: SM75, MicroDot Connector.
If the reading from the continuity test is not as stated, disconnect one part of the chain and repeat
the test. Repeat this last step until the bad connection is isolated. From experience, most often, when a®

problem occurs it has been found that the SM75, MicroDot , connectors on the InVac cable are notconnected securely to the sensor or the feed through. If this is found to be true then the cable should be
replaced. Also the center pin on the InVac cable can become damaged and not make contact with themating connector, Refer to Figure 32.14. The center pin of the connector should extend slightly beyond theend of threaded ferrule. If the pin is damaged the cable should be replaced.

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SECTION 8.3

FAQs

Question: Why, when exiting a deposit mode (system shutter closing), does the thickness reading fluctuate
greatly?
Answer: There are several possible causes for this phenomenon. First, if the system shutter closing causes
any electrical noise in the system and the instrument is not grounded properly, thickness fluctuations may
be experienced. There is a #6-32 threaded ground stud near the AC power connector on the back panel ofthe STC-2000A. This stud should be used to make an electrical connection between the STC-2000A andsystem ground, which should be earth ground as well. This connection should be made with a 16 AWG (orlarger) gauge stranded copper wire. Second, a loose cable connection may cause these fluctuations simply
from the mechanical vibrations of the system. Check all cable connections to be sure that they are tight.
The most likely culprit is the in-vacuum cable (silver braided sheathing) between the feedthrough andsensor head.
Question: When entering deposit and the system shutter opens, why, does the substrate sensor indicate anegative rate?
Answer: This will typically occur in,but is not limited to, a resistive source system that has not been bakedout adequately, possibly just pumped down from atmosphere. What causes this is water vapor that hascondensed on the surface of the crystal. When the system shutter is opened, the heat from the resistive
source causes the water to evaporate from the crystal sensor surface. This evaporation translates to the
STC-2000A as a negative rate since the loading on the crystal is decreasing momentarily, rather thanincreasing (as it would in a deposition).

SECTION 8.4

System Battery and Memory Considerations

The STC-2000A system board contains a 3V Lithium backup battery. This battery maintains thecontents of the real time and date memory while the STC-2000A is turned off. Under normal
circumstances the battery has an average life of 4+ years.

SHOCK HAZARD
Replacement of the battery toward the end of its life should be performed to eliminate memory
loss problems due to battery failure. The battery should be replaced with the same type, 3V Lithium,
Rayovac BR1225, Sycon Part Number 360-001.
Replacing the Battery: observe precautions described at the start of this section
The battery is held in a 12mm horizontal 'coin slot' holder on the main CPU board.

WARNING There are potentially lethal voltages present within the STC-2000A control unit
with a line cord or an INPUT/OUTPUT cable attached. Service should be attempted by qualified personnel
only. Disconnect all cables and power cord when removing, installing, or servicing any component of the
STC-2000A instrument.
Remove the bottom cover of the unit, the battery is located on the PCB having the 9 pin D-sub thatprovides the RS232 connection as indicated on the rear panel. This PCB is labed 502-196. Remove the oldbattery and replace it with the new one. Place a label on the inside of the unit case, near the battery,
specifying when it was replaced to facilitate future maintenance.
Re-Entering Time and Date Parameters
The Non-Volatile memory will still be intact but the time and date information may not be correct.
Re-enter and verify this information before putting the unit back into service (See section 3.14).

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Section 9.0

Glossary

If a term cannot be found here in the glossary, check the programmable parameter lists as these terms are
not repeated here. The index and table of contents can also be checked.
Crystal generally refers to the quartz crystal within a crystal sensor head used in a vacuum chamber whose
wired interaction with an oscillator circuit produces an output that is used as an input to an STC2000A sensor card. The STC-2000A also uses crystals in its own circuitry for microprocessor
support, time base/signal comparisons and real time calculations.
Film, in STC-2000A terminology, is defined as a list of user programmable deposition related parameters.
Typically, one material deposition is accomplished per film (describes specific: material,mechanical setup, timing, etc.). The STC-2000A can store up to 50 films (referred to as a film
recipe library). A list of film implementations can be placed into a process. Each film
implementation is referred to as a layer (or step in the process). Process layers can use the same
film many times or use any combination of different films.
manual mode is a possible sub-mode of either non-sequencing mode or sequencing mode. As the nameimplies, it is intended to provide a means for the manual control of power, that is, the control ofthe source control voltage output from the source sensor card that, in turn, controls the evaporantgenerating power supply.
Memory Module (or Memory Card) option allows saving or restoring all parameters, configurations, films,
processes, process accounting and I/O programs in both memory locations A and B to the memory
card. The memory card function needs a memory interface board installed in the unit. If there is ahigh density 15 pin female D-sub on the back panel, the memory interface board is installed. The
memory card has a write protect switch (LED status: green indicates memory card is ready toaccept new data as well as be read, red indicates that the write protect is on and that no new data
can be written to the memory card but it can be read). See also Glossary WP (write protect).
Microbalance theory
Non-sequencing mode is one of two basic deposition process control modes that uses a menu
programmable process entity called a film. Non-sequencing mode does not have a process (or atleast anything named as such). Non-sequencing mode uses 1 implicit process that can run 1 film.
The non-sequencing mode is easiest to configure (user programs what will become an active film).
The sequencing mode is more complicated only by the additional programming of a process[es]that calls out a film or films. Simply put, the sequencing / non-sequencing mode difference is thatof having or not having a process. The STC-2000A retains the non-sequencing mode for historicalcompatibility and for simple depositions.
OSC-100A oscillator
password is a numeric sequence of up to 4 digits used to limit access to various programming menus. It is
intended as a protection device against unauthorized reprogramming of the film, map, process andsystem configuration parameters (controlled by System Configuration menu's Password Lock #parameter) and key beep, RS-232 interface and I/O programming parameters (controlled by
Communication Setup menu's Com I/O Lock Code parameter). A zero value is a non-password.
Any password value other than zero is considered a password. Consult factory to undo forgotten
passwords.
process is a list of film implementations. Each film implementation is referred to as a layer (or step in theprocess). Process layers can use the same film many times or use any combination of different
films.
sequencing mode is one of two basic deposition process control modes that uses a menu programmableprocess entity called (not coincidentally) a process. Each step of a process invokes a film.
Soft key refers to the LCD overlay touch keys whose definition, at any point, is software dependent.
test mode is a possible sub-mode of either non-sequencing mode or sequencing mode. Test mode isavailable from the SERVICE menu for simulated out of system experiments. Crystal sensor headinformation is simulated (actually rate info is simulated for the film) allowing setup of various
parameters/programming elements without crystal failure halting the simulated process. The
power supply control voltage output is, however, active while in the test mode.

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p STC-2000A DEPOSITION CONTROLLER y
Employed to simulate (w/ simulated rate information) a crystal sensor input while in any
combination of the modes just described.
WP (Memory Module): WP (write protect) works like the write protect on a floppy disk, that is, when it isin the protect position, writes to the media cannot be made. When a floppy disk is in use, the write
protect is not physically accessible. Unfortunately (and for the following reason only), the WP
switch on the Memory Module is physically accessible when it is in use. If the WP is switchedwhile data is being transferred, non-transfer of all data or data corruption will result. The
WP may, however, be switched while the memory module is powered and not having datatransferred.

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Section 10.0
QUICK INDEX (continued from section 1.2)
All menu navigation begins with the Runtime screen displayed. Pressing the fixed STATUS key whilenavigating the programming menus provides an exit from the menu system.
1. a) description: Process sequencing mode employs a user generated recipe of deposition layers where
each layer is a step in the recipe program. Each layer/step contains MODE type, FILM number and layer
final thickness. The MODES are SKIP, STOP, WAIT, AUTO and END. FILMs are user programmed foreach process step and identified by film number. Process non-sequencing mode has only 1 implicit processlayer/step. The film number is directly user entered by selecting the active film and the final thickness is auser programmed parameter on the REVIEW FILM menu.
purpose: Select process sequencing or process non-sequencing mode. Generally speaking, to make single
layer deposits use the non-sequencing mode, to make multiple layer depositions use the Sequencing mode.
background/conceptual info: pages section 2.1, pages 24, 25, 26; section 2.2, page 40 [Programmablehardware setup discussion].
detailed info: pages section 3.3, page 66
see index keyword
programming summary: Selecting between Process Sequencing and process Non-sequencing modes isaccomplished by: Fixed MENU key ⇒ SERVICE key → SEQ ABLE /(NON SEQ) → [ARM RESET]→ ACCEPT. Unit will reset after ACCEPT key is pressed.
1. b) description: The TEST mode supplies simulated rate information which, in turn, simulates a crystal
sensor input while in any combination of sequencing mode, non-sequencing mode, auto or manual modes.
purpose: To run through a deposition process without a crystal sensor signal. Please note that the power
control outputs remain active when the TEST mode is enabled.
background/conceptual info: pages 24
detailed info: pages
see index keyword
programming summary: Selecting the TEST mode is accomplished by pressing: Fixed MENU key ⇒SERVICE key → TEST OFF / (TEST ON) → [ARM RESET] → ACCEPT. Unit will reset after
ACCEPT key is pressed.
1. c) description: The MANUAL mode is used to manually alter the power level of the control outputs that
control the external power supply. Only the active control output is effected. The unit needs to be running adeposition before manual mode can be invoked. Manual control is accomplished by means of the arrow
keys on the pendant or by the arrow keys on the 2nd STATUS screen. There are 2 analog outputs and they
reside on the 9 pin D-Sub connector on the back panel, which is labeled SOURCE.
purpose: Adjust control output voltage manually.
background/conceptual info: pages
detailed info: pages
see index keyword
programming summary: Fixed MANUAL key (while deposition [rise, soak, or deposit phases] isrunning)
1. d1) description: The host port communications include an alternate means of programming the unit
other than by front panel keys, reading status information, reading runtime information, control of various
aspects of a deposition, downloading/uploading data in selected areas, etc.
purpose: Set up host port communications, user programmable settings
background/conceptual info: pages
detailed info: pages Section 6.3
see index keyword
programming summary: Fixed MENU key ⇒ EXECUTIVE MENU key → COMM. SETUP key →RS232 BAUD RATE and/or RS232 PROTOCOL (EDIT/CHANGE).

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1. d2) description: The host port communications include an alternate means of programming the unit
other than by front panel keys, reading status information, reading runtime information, control of various
aspects of a deposition, downloading/uploading data in selected areas, etc.
purpose: Set up host port communications, physical connections
background/conceptual info: pages
detailed info: pages See Section 6.0
see index keyword
programming summary: <not applicable>
1. d3) description: Communicate with unit to download/upload I/O programs, view/edit user
programmable parameters, unit status in many various areas, deposition status in many various areas.
The host port communications include an alternate means of programming the unit other than by front
panel keys, reading status information, reading runtime information, control of various aspects of adeposition, downloading/uploading data in selected areas, etc.
purpose: Use host port communications with defined protocols and commands
background/conceptual info: pages
detailed info: pages See Section 6.1, 6.2, 6.7
see index keyword
programming summary: protocols [Fixed MENU key ⇒ EXECUTIVE MENU key → COMM.
SETUP key → RS232 PROTOCOL (EDIT/CHANGE)].
1. e) description: The LCD screen viewability is temperature sensitive and has a viewing range in terms ofangle from the perpendicular. To compensate for these environmental variations and user viewing position,a means of adjustment has been provided. The adjustment is software controlled by user programmed menu
selection or host port communications.
purpose: Set LCD bias/contrast to suit user needs.
background/conceptual info: pages
detailed info: pages
see index keyword
programming summary: Fixed MENU key ⇒ EXECUTIVE MENU key → SYSTEM CONFIG key→ LCD CONTRAST (EDIT/CHANGE).
1. f) description: The unit has a real time clock that is supported with a battery when the power is off. This
time / date function is viewable on the Runtime screen. Other than for the user's convenience, the time /date information is only used for a time / date stamp on the Process [History] Accounting screens.
purpose: Set unit time and/or date.
background/conceptual info: pages
detailed info: pages
see index keyword
programming summary: Fixed MENU key ⇒ EXECUTIVE MENU key → SYSTEM CONFIG key→ CLOCK TIME or CLOCK DATE (EDIT/CHANGE).
1. g) description: There are 6 options/info screens. These screens provide information about installedsoftware versions, unit serial number, error codes, I/O slot reporting, raw frequency values from the sensor
channels, software compatibility between various cards, memory card and memory card interface reporting.
purpose: View installed options information. View elements as discussed above for diagnostic evaluation
when calling the factory with an apparent problem.
background/conceptual info: pages
detailed info: pages
see index keyword
programming summary: Selecting the OPTions/INFormation menu is accomplished by pressing: Fixed
MENU key ⇒ EXECUTIVE MENU key → OPT/INF key

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1. h) description: Configuration of FILM, PROCESS, and MAP parameters can be accomplished bymenu keys or by host port commands. Since these parameters will be specific to the deposition process athand, specific details cannot be supplied here but must be tailored to the goal of the end user. All
parameters have default values, which may not reflect values needed for a specific deposition.
These three categories of parameters are interrelated as the MAP parameter set/group is called out
by a FILM parameter and a process parameter calls out the FILM parameter set.
There are 42 FILM parameters and these describe elements such as material density, z-factor,
material thickness, time setpoints for various parameters, power (ramp, soak and max power levels),
deposit rate, control loop parameters, shutter control, crystal parameters (sample control, stability and life
bounds), graphical data plot parameters, MAP select, indexer pocket select, and various mode selects: rate
ramp, shutter delay, FILM fail, and etching modes. These are generally related to a specific film deposition.
There are 20 Source Sensor MAP parameters and these are related to power supply parameters,
tooling factors, crystal channel configuration and behavior, indexer synchronization, and individual crystal
channel configuration and behaviors. These can be related to a specific power supply. There can be up to
10 sets of MAP parameters, each identified by a number from 1 to 10.
There can be up to 9 processes (9 process lists [or recipes]). Each process recipe is given an
identification number from 1 to 9. Each process recipe can have up to 99 steps [or layers]. Each step callsout 1 FILM to be active. Non-sequencing mode has 1 implicit process and 1 active FILM. The active FILM
calls out 1 set of MAP parameters.
purpose: To program the unit to suit the deposition process needed (material, thickness, etc.).
background/conceptual info: pages
detailed info: pages
see index keyword
programming summary: All three parameter categories can be accessed from the MAIN menu. The
MAIN menu is invoked by pressing the fixed MENU key. The FILM parameters can be reviewed/edited bypressing the REVIEW FILM key. The MAP parameters can be reviewed/edited by pressing the REVIEWSS MAP key. The PROCESS parameters can be reviewed/edited by pressing the REVIEW PROCESSES
key. The active PROCESS can be set by pressing the NEXT PROCESS key. Different sets of FILMs,
MAPs, and PROCESSES can be accessed by using the GO2 key on each menu: GO2 FLM (go to FILM),
GO2 MAP (go to MAP), GO2 PRC (go to PROCESS).
1. i) description: The BEEPER provides audio indications during power up and when keys are pressed. A
user programmable parameter allows the beeper to be disabled as a keyboard annunciator. The power on
beeper sequence cannot be disabled. There are various tonalities used to indicate various functions (eg. thedifference between a correct key press and incorrect key press [within LCD key graphic and outside of
LCD key graphics]).
purpose: Set BEEPER function to suit user needs.
background/conceptual info: pages
detailed info: pages
see index keyword
programming summary: Fixed MENU key ⇒ EXECUTIVE MENU key → COMM. SETUP key →KEYBOARD BEEP (EDIT/CHANGE).
2. a) description: The Runtime Screen is the screen that appears after the power on sequence is complete.
Pressing the fixed STATUS key from any menu screen will return the Runtime screen. Pressing the fixed
STATUS key while the Runtime screen is displayed will invoke 3 other status screens, in sequence, before
returning to the Runtime screen. The 3 other screens invoked by the STATUS key are referred to by theirnumerical appearance in the sequence of screens: Alternate Runtime (1st STATUS screen), indexer status(2nd STATUS screen) and channel status screens (3rd STATUS screen). The runtime screen is thenavigational beginning point of discussions about menu programming in this section. All menu references
are relative to the Runtime screen.
purpose: To check the status of the instrument, some of its parameters and elements of the deposition
process through various status screens. In addition, there are also some live keys that are related to thefunctions at hand.
background/conceptual info: pages
detailed info: pages 54,55 See Section 3.0

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see index keyword
programming summary: Fixed STATUS key ⇒ Fixed STATUS key ⇒ Fixed STATUS key ⇒ FixedSTATUS key (starting with Runtime screen, shows 3 STATUS screens and returns to the Runtime screen).
2. b) description: During a deposition, selecting a different Crystal sensor is accomplished by failing thecurrent active crystal sensor channel and, having preset an alternate crystal channel as the backup,
automatically switch from one crystal sensor to an alternate. This process can be reversed by a re-verify.
Before a deposition, the active crystal channel and its potential backup channel are set using the Source
Sensor MAP menu.
purpose: Select a Crystal sensor for active use in the current process.
background/conceptual info: pages
detailed info: pages
see index keyword
programming summary: Fixed MENU key ⇒ REVIEW SS MAP key →MINimum START XTALSMINimum BACKUP XTALSMINimum ACTIVE XTALSChannel x START MODE
Channel x FAIL ACTION
Channel x BACKUP LIST
Fixed STATUS key ⇒ Fixed STATUS key ⇒ Fixed STATUS key ⇒ FORCE FAIL (to fail crystal channel).
Fixed STATUS key ⇒ Fixed STATUS key ⇒ Fixed STATUS key ⇒ RE-VERIFY (to reinstate a failed
working crystal channel).
[Note: pressing the fixed STATUS key 3 times, beginning at the runtime screen, produces the 3rd STATUS screen.]

2. b1) description: The physical crystal Sensor connections involve electrical connections, mechanicalattachments, plumbing (air and water), wiring considerations, oscillator placement. Electrically, the crystal
sensor head is connected to the oscillator, which is in turn connected to the deposition control unit.
Specifically, the crystal is connected with a teflon wire to a feedthrough (with its connectors), then a lengthof BNC terminated cable (keep short), the oscillator, another length of BNC terminated cable (up to 100ft.), and finally to the deposition control unit. The BNC cables are 50 Ω coaxial cables. The back panel
connections for the crystal/oscillator inputs are labeled SENSOR 1 and SENSOR 2. The length of wire
between the feedthrough and the oscillator should be 30" or less. If there is enough room on the outside of
the chamber, the oscillator can be directly connected to the feedthrough connector, otherwise a 6" BNC
terminated cable is used to interconnect the oscillator to the feedthrough. The water pipes or separate
mounting hardware provides mechanical support for the crystal sensor head in the vacuum chamber.
Plumbing is accomplished by bending, cutting, TIG welding, silver soldering or by using Swagelok
compression fittings. The crystal sensor head, as it is mounted in the chamber, typically sees more or less ofa deposition than the substrate. (The crystal sensor head may be closer or further away from the source thanis the substrate.) To compensate for this, the tooling factors are user entered via programming menus. To
exclude particle droplets, the crystal sensor should be at least 10" from the evaporant source. Water flowrate needs to be adequate to properly cool the crystal sensor head[s] (typically 0.2 – 0.3 gpm). Shutters arecontrolled by compressed air, which is controlled by solenoids, which are controlled by output relays,
which are controlled by an I/O program. A host port command can indirectly control a relay through arunning I/O program.
purpose: Connect a crystal sensor head to the deposition controller to make thickness measurements or tocontrol a deposition process that is programmed to deposit a material [or materials] at a programmed
thickness.
background/conceptual info: pages 33, section 2
detailed info: pages
see index keyword
programming summary: Fixed MENU key ⇒ REVIEW SS MAP key →MASTER TOOLING (global tooling offset)
Channel x TOOLING (individual channel tooling)

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p STC-2000A DEPOSITION CONTROLLER y
2. c) description: Power supply control describes the analog output from the 9 pin D-sub female labeled
source in the back panel of the unit. The analog output is connected to an external high current or highvoltage power supply that is used to generate the evaporant stream within the vacuum chamber.
purpose: Control the power used to generate the evaporant stream which becomes the deposition thickness.
background/conceptual info: pages
detailed info: pages
see index keyword
programming summary: Fixed MENU key ⇒ REVIEW SS MAP key →SOURCE FULL POWER
SOURCE MAX POWER
SOURCE OUTput ChaNneL
Fixed MENU key ⇒ REVIEW FILMS key →MAX POWER LIMITABORT MAX POWER SWITCH
MAX POWER DWELL
Fixed MENU key ⇒ EXECUTIVE MENU key → SYSTEM CONFIG key → RECORDER OUTPUT
CHANNEL.
[Note: there is redundancy in these two parameters: SOURCE MAX POWER and MAX POWER LIMIT. The
lowest value of the two will be used to limit the power. The MAP parameter is intended to be a characterization of aparticular power supply whose max power limit may be predetermined. Along with other power supply relatedparameters, a particular map may be conceptually tied to a specific power supply. This being done, the FILM parametercan never exceed the maximum power limitation.]

2. c1) description: The electrical connections for the two sets of analog power output control lines arefound on a single 9 pin D-sub female connector. Each analog output set has a plus (+) and a minus (-)
output, an analog ground and a ground shield connection.
Control Signal 2 Pin
Control Signal 1 Pin+ OUTPUT9+ OUTPUT2-OUTPUT4-OUTPUT
6analog GND
5analog GND
1shieldshieldshieldshieldpurpose: Connect the analog output control voltage[s].
background/conceptual info: pages
detailed info: pages 145
see index keyword
programming summary: n.a.
2. d) description: The analog power output control voltage can be adjusted manually (while in manualmode). Further, a deposition must be running before the manual mode can be invoked. The adjustment canbe made in any of 3 ways: pendant arrow buttons, 2nd STATUS screen arrow keys or by host portcommand.
purpose: Adjust power level manually (in manual mode)
background/conceptual info: pages
detailed info: pages
see index keyword
programming summary:
2. e) description: INPUT card control encompasses both hardware and software configuration. Input cards
must be defined and enabled in software before they will be recognized by the system (I/O SLOT TYPE).
Each input card has 8 opto-isolated inputs that can be either isolated or not isolated, internally powered or
externally powered (individually or as a group of 8). The inputs are recognized by I/O programming andcan be used to trigger various entities or start a sequence of events. The standard factory unit configurationhas 1 input card in I/O slot 1. Up to 4 input cards can be installed (at the expense of OUTPUT cards that
use the same I/O slots).

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p STC-2000A DEPOSITION CONTROLLER ypurpose: INPUT card control
background/conceptual info: page 36, section 2.2.
detailed info: pages 147-149, section 4.8 (jumper configuration), page 148 (pin connections)see index keyword
programming summary: Fixed MENU key ⇒ EXECUTIVE MENU key → SYSTEM CONFIG key→ I/O SLOT x TYPE
2. f) description: OUTPUT card control needs software configuration. Output cards must be defined andenabled in software before they will be recognized by the system (I/O SLOT TYPE). Each output card has
8 relays. The outputs (activation side of the relays) are controlled by I/O programming (can be enabled anddisabled). The standard factory unit configuration has 1 output card in I/O slot 2. Up to 4 output cards canbe installed (at the expense of INPUT cards that use the same I/O slots).
purpose: OUTPUT card control.
background/conceptual info: pages
detailed info: pages 150, sections 4.8, 4.9
see index keyword
programming summary: : Fixed MENU key ⇒ EXECUTIVE MENU key → SYSTEM CONFIG key→ I/O SLOT x TYPE
2. g) description: Select and Run an I/O program. I/O Memory is selected between A and B programs by atoggle function of the SWaP key (A memory switches to B memory and back to A with each press of the
SWaP key). I/O programs are run by pressing the RUN key. The second line of the I/O program screen
indicates, in text, that the I/O program is running or stopped.
purpose: Select and Run an I/O program.
background/conceptual info: pages
detailed info: pages
see index keyword
programming summary: Fixed MENU key ⇒ EXECUTIVE MENU key → I/O SETUP key →MEMory → SWaP
[SAVe saves the current I/O program]Fixed MENU key ⇒ EXECUTIVE MENU key → I/O SETUP key → OPeRate → RUN[STP stops the I/O program]
2. h) description: Write an I/O program.
purpose: Write an I/O program.
background/conceptual info: pages
detailed info: pages
see index keyword
programming summary: Fixed MENU key ⇒ EXECUTIVE MENU key → I/O SETUP key → EDiT
→ CHanGe (INSert, DELete) → IN, KON, POS, NEG, AND, OR, XOR, ADD, SUB, MUL, DIV, MOD,
EQU, NOT, GRT, LES, SEL, OUT, TRP, SET, CLR, ARM, DRP, 000-999
2. i) description: Shutter control can be configured by FILM parameters, I/O programming and I/O card
setup.
purpose: Shutter control.
background/conceptual info: pages
detailed info: pages
see index keyword
programming summary: Fixed MENU key ⇒ REVIEW FILMS key →SHuTteR DELAY MODE
SHuTteR DeLaY TIMEOUT
SHuTteR DeLaY QUALITY
2. j) description: Select crystal stability indicators L/Q, etc.
purpose: Select crystal stability indicators L/Q, etc.

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p STC-2000A DEPOSITION CONTROLLER ybackground/conceptual info: pages
detailed info: pages
see index keyword
programming summary: Runtime Screen → L/Q [LOOP, QUAL]
2. k) description: Select / use Sample and Hold.
purpose: Select / use Sample and Hold.
background/conceptual info: pages
detailed info: pages
see index keyword
programming summary:
3. a) description: Purge the user programmed memory.
purpose: Purge the user programmed memory.
background/conceptual info: pages
detailed info: pages
see index keyword
programming summary: Fixed MENU key ⇒ SERVICE key → [AS IS] PURGED → [ARM RESET]→ ACCEPT
3. b) description: Set user programmed memory to factory settings.
purpose: Set user programmed memory to factory settings.
background/conceptual info: pages
detailed info: pages
see index keyword
programming summary: Fixed MENU key ⇒ SERVICE key → [AS IS, PURGED] FACTORY →[ARM RESET] → ACCEPT
3. c) description: Download user programmable and system parameters to a memory module. With thememory module write protect off, the current unit parameters will overwrite what is stored in the memory
module without further warnings.
purpose: Download user programmable and system parameters to a memory module.
background/conceptual info: pages
detailed info: pages 122 –125, section 3.20
see index keyword
programming summary: Fixed MENU key ⇒ SERVICE key → [AS IS, PURGED, FACTORY, M.M.
−> UNIT] UNIT −> M.M. → [ARM RESET] → ACCEPT
3. d) description: Upload user programmable and system parameters from a memory module. All current
unit parameters will be overwritten without further warnings.
purpose: Upload user programmable and system parameters from a memory module.
background/conceptual info: pages
detailed info: pages 122 –125, section 3.20
see index keyword
programming summary: Fixed MENU key ⇒ SERVICE key → [AS IS, PURGED, FACTORY] M.M.
−> UNIT → [ARM RESET] → ACCEPT
3. e) description: Checksums of user programmed parameters are useful to insure program integrity andtherefore process integrity. There are checksums for each individual set of parameters in each of theparameter groups. The parameter groups include FILMs, MAPs, PROCESSes, and I/O programs. FILM
and MAP checksums have an x prefix and are located on the 1st line of the REVIEW FILM or SS MAP
menus. PROCESS and I/O program checksums have an ID= prefix. The PROCESS checksum is located on
the 1st line of the REVIEW PROCESSES menu. The I/O program checksum is located on the 2nd line of the
I/O SETUP menu. Since there can be up to 50 films, there can be up to 50 FILM checksums. Since there
can be up to 10 maps, there can be up to 10 MAP checksums. Since there can be up to 9 processes, there

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p STC-2000A DEPOSITION CONTROLLER ycan be up to 9 PROCESS checksums. Since there can be up to 2 I/O programs (A and B), there can be up to
2 I/O PROGRAM checksums. Checksums are generated automatically and updated automatically as values
are altered and saved. For record keeping, equate FILM, MAP and PROCESS numbers with checksums.
The I/O program has embedded letter designators indicating the A memory or the B memory.
purpose: Checksums of user programmed parameter sets are unique for each non-identical set.
background/conceptual info: pages
detailed info: pages 120,
see index keyword
programming summary: Fixed MENU key ⇒ REVIEW FILM key → x
Fixed MENU key ⇒ REVIEW SS MAP key → x
Fixed MENU key ⇒ REVIEW PROCESSES key → ID=
Fixed MENU key ⇒ EXECUTIVE MENU key → I/O SETUP key → ID=
1. a) description:
purpose:background/conceptual info: pages
detailed info: pages
see index keyword
programming summary:

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p STC-2000A DEPOSITION CONTROLLER y

INDEXin Z-Factor, thickness ................................ 115
inhibited message ........................................ 25
inhibited, set active process ......................... 98
initial, abnormal stop ................................... 59
input, I/O programming ............................. 164
L/Q, loop deviation.................................... 115
list of codes, I/O......................................... 247
memory module......................................... 123
non-seq, inhibited ........................................ 99
non-seq/seq mode differences.................... 100
OUT, I/O programming ............................. 176
PID, rate control ........................................ 105
process edit, in recipe .................................. 87
process, reset................................................ 88
response format, communications ............. 199
Review FILM, range.................................... 70
RS-232 communication ............................. 197
rung 007, 008, I/O program ....................... 187
stack balance, I/O programming................ 167
START process diagram............................ 134
system, process ............................................ 86
token string, I/O programming .................. 174
where displayed, recovery select ................. 64
xtal stab, instantaneous rate ....................... 113
xtal switch.................................................. 114
Z-Factor ..................................................... 264

1
1st STATUS screen...........................................56
2
2nd STATUS screen..........................................56
A
Analog output
D-SUB connections ....................................146
B
Battery
description, replacement, effect on clock
memory, hazards.....................................273
system config, effect on clock ......................44
C
Checksum
FILM parameters ..........................................72
host port communication command, I/O
programming ..........................................245
host port communication command, parameterstatus.......................................................227
host port communication commands, I/O
program editing ..............................247, 249
host port communication commands, productfirmware .................................................201
host port communications error recovery ...197
host port communications protocol ....196, 197
I/O programming ........154, 167, 182, 183, 185
I/O programming overview ....................50, 52
I/O programming, A/B memory change.....184
I/O programming, factory installed ............186
parameter validation ...................................120
parameters after purge/factory restore ........121
PROCESS parameters ..................................90
PROCESS programming ............................130
product software .........................................119
quick index .................................................282E
error
bus hold, process, Event/State ID...............160
clear to select active process.........................66
codes , OPT/INF.........................................119edge event, I/O programming.....................164
event, I/O programming .............................165
I/O messages, causes ..................................193
in I/O programming................................47, 49
in recipe, FILM abort ...................................64

SECTION 11.XX

I
Input cardconnection hazards .................................... 269
described in factory I/O program............... 186
described in host port communication
parameters.............................................. 215
described in I/O program ................... 183, 185
described in I/O program example............. 191
described in I/O program for 4 pocket source............................................................... 191
description, card options & pin connections............................................................... 148
host port communications, status commands............................................................... 239
I/O function elements .................................. 18
I/O programming control overview ............. 46
I/O programming errors............................. 193
I/O programming, function not limited to...164
I/O programming, scanning tokens............ 166
I/O programming, used with arithmetic/logical
functions ................................................ 177
installation, shielding................................. 144
installation/removal ..................................... 38
jumpers .............................................. 148, 150
no need to interconnect relays to inputs..... 155

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p STC-2000A DEPOSITION CONTROLLER y
options overview ..........................................37
overview .....................................25, 26, 27, 40
parameter copy form...................................289
physical location...........................................39
process accounting
REMOTE................................................118
programming dependencies..........................20
quick index description...............................280
remote inputs on I/O program table............160
specs .............................................................15
status on options/info screen.......................119
system config values,I/O slot type................17
use in I/O program........................................52
use with factory installed I/O program .......152
used for power SOAK hold ..........................76
used with I/O programming........................154
Input card [notesource sensor card inputs are not I/O
programming inputs] ................................26
Input statement
I/O programming overview ..........................47
M
Manual key
description ....................................................61
O
Output cardconnection hazards .....................................269
host port communications, status commands................................................................239
parameter copy form...................................289
physical location...........................................39
programming dependencies..........................20
quick index description...............................281
relay connections & functions ....................151
status on options/info screen.......................119
P
PID
control quality, setpoint, deviation, L/Q key................................................................115
copy FILM parameter list ...........................287
deposition source control loop descriptions104
host port communications...........................207
on FILM parameter list.................................16
on FILM parameter list after purge ..............44
overview ...........................................23, 24, 31
overview, pseudo co-dp................................31
parameter descriptions..................................77
specs .............................................................15
R
RAMP
copy FILM parameter list ...........................287
FILM parameter dependency list..................19

SECTION 11.XX

host communications, event codes............. 234
host communications, manual power......... 233
host communications, phase status ............ 226
host port communications.................. 205, 211
I/O program table....................................... 160
I/O programming ....................................... 187
manual control while setting PID .............. 105
on FILM parameter list................................ 16
on FILM parameter list after purge.............. 44
overview .......................................... 31, 41, 42
power ramp time.......................................... 76
quick index desc. ....................................... 278
rate ramp mode ............................................ 70
run cycle phase .......................................... 106
RunTimedata
host port communications...................... 216
modemanual key description ............................ 61
overview ............................................ 40, 41
overview, I/O programming intro............ 46
purge/factory differences ....................... 121
zero key description................................. 61
screendescription ......................................... 53, 54
detailed description.................................. 63
FILM/MAP description ........................... 73
forcing a crystal switch from ................. 114
graphics area descriptions........................ 81
host port communications, graphics ...... 211
host port communications, graphics area210
in manual mode ....................................... 56
in TEST mode........................................ 127
L/Q description ...................................... 115
manual mode description....................... 103
menu navigation summaries from.......... 135
menu tree description, navigationfrom .... 61
non-sequencing mode .............................. 74
non-sequencing mode differences ........... 98
overview .................................................. 40
overview, power related screen parameter
dependencies........................................ 43
overview, power related screen parameters............................................................. 42
overview, screen after purge.................... 44
parameter dependencies........................... 20
parameters................................................ 17
parameters not updated ............................ 25
screens preceeding ................................. 120
set active PROCESS ................................ 97
software controlled keys on ................... 101
START key description ........................... 59
START key flowchart............................ 134
states of (I/O programming) .................. 159
typical runtime screen.............................. 55

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p STC-2000A DEPOSITION CONTROLLER y
S
SOAK
copy FILM parameter list ...........................287
host communications, phase status .............226
host port communications...........................205
I/O program table .......................................160
on FILM parameter list.................................16
on FILM parameter list after purge ..............44
overview .................................................31, 42
power soak time............................................76
run cycle phase ...........................................106
soak power....................................................76
Source control voltage
D-SUB connections ....................................146
Source power
control voltage output overview ...................26
Source Sensor card
analog control voltage connections ............145
D-SUB connections ....................................146

SECTION 11.XX

effect of zero thickness on value.................. 17
overview ...................................................... 26
physical location .......................................... 39
programmable parameters ........................... 18
programming dependencies ......................... 20
recorder function/output .............................. 17
status on options/info screen...................... 119
Specifications
Product......................................................... 15
T
test mode
Running Process Simulation. 5, 25, 28, 40, 41,
46, 52, 67, 127, 133, 274
Z
Zero keydescription ................................................... 61

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p STC-2000A DEPOSITION CONTROLLER y[copy this page to record film parameters]
Film Parameters for Film #________ in Process #________:
date___-___-___(Material) Density
0.40 to 99.99 gm/cc(Material) Z-Factor
0.100 to 9.999
Setpoint Thickness Limit
0.000 to 999.999 KÅ
Final Thickness Limit (Trigger)
0.000 to 999.999 KÅ (non-sequencing only)
Setpoint Time Limit
0:00 to 99:59 MM:SS
Soak 1 Power level Value
0.0 to 100.0%
Power Ramp 1 Time (to pwr level) 0 to 99:59 MM:SS
Power Soak 1 Time (@ pwr level) 0 to 99:59 MM:SS
Soak 2 Power level Value
0.0 to 100.0%
Power Ramp 2 Time (to pwr level) 0 to 99:59 MM:SS
Power Soak 2 Time (@ pwr level) 0 to 99:59 MM:SS
Soak 3 Power level Value
0.0 to 100.0%
Power Ramp 3 Time (to pwr level) 0 to 99:59 MM:SS
Deposit Rate (requested)
0.0 to 999.9 A/S
Rate Ramp Mode
OFF / ONNew Deposit Rate (Value)
0.0 to 999.9 A/S
Rate Ramp Time (Duration)
0:00 to 99:59 MM:SS
Rate Ramp (Thickn) Trigger Point 0 to 999.999 KÅControl Loop –Proportional term- 1 to 9999
Control Loop –Integral term0.0 to 99.9 sec
Control Loop –Derivative term0.0 to 99.9 sec
Max Power Limit
0.0 to 100.0%
Abort Max Power SW
OFF/ONMax Power Dwell
0:01-99:59 MM:SS
Shutter Delay Mode
OFF, ON
Shutter Delay TIMEOUT
0:01-99:59 MM:SS
Shutter Delay QUALITY
1-50%(XTAL) RATE SAMPLING
OFF,TIMED,INTELL.
(XTAL) SAMPLE INTERVAL
0:01-99:59 MM:SS(XTAL) SAMPLE DWELL TIME 0:01-99:59 MM:SS(XTAL) SAMPLE QUAL
1-50%
(XTAL) SAMPLE ALARM TIME 0:01-99:59 MM:SS
FILM Fail Mode
TIME POWER, ABORT IF FAIL
Control Loop Qual Limits
0 to 9XTAL Stability S (Limits)
0 to 9XTAL Life Bounds
0.0-100.0%
Plot Vert Scale Volts
1, 5, 10, 50, 100
Plot Horiz Scale H
1 to 600 samples
Data Plot Type
Rate /Power /Rate Deviation
Source Sensor MAP SELECT
1 – 10
POCKET SELECT
0 – 63 Pockets
ETCHING MODE
OFF/ONSECTION 12.XX

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p STC-2000A DEPOSITION CONTROLLER y
date___-___-___[copy this page to record map parameters]

Source Sensor Map Parameters for Map #________ in Film #_______ in Process #________:
Source Sensor Full Power Volts
2.5, 5, 10 full scale volts
Source Sensor Max Power Value 0.0% - 100.0%
Source Sensor Analog Output Chnl 1 – 2 Channel Selection
Master Tooling Value
10.0% - 400.0%
Minimum Start Xtal Channels
1 – 2 minimum channels
Minimum Backup Xtal Channels 0 – 1 minimum channels
Minumum Active Xtal Channels 1 – 2 minimum channels
Xtal Channel Drop Filter
NONE, BALANCE
Indexer Synchronization Mode
NONE, DELAY, FEEDBACK
Indexer Synchronization Time2 – 999 seconds
Channel 1 Start Mode
OFF, ACTIVE, STANDBY
Channel 1 Fail Action Mode
NONE, ABORT FILM
Channel 1 Backup List
X – XXXXXXXXChannel 1 Tooling Value
10.0% - 400.0%
Channel 1 Weight
10.0% - 400.0%
Channel 2 Start Mode
OFF, ACTIVE, STANDBY
Channel 2 Fail Action Mode
NONE, ABORT FILM
Channel 2 Backup List
X – XXXXXXXXChannel 2 Tooling Value
10.0% - 400.0%
Channel 2 Weight
10.0% - 400.0%

SECTION 12.XX

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p STC-2000A DEPOSITION CONTROLLER y[copy this page to record configuration parameters]
System Configuration Parameters for Process #________:

date___-___-___LCD Contrast / Bias

LOW, MEDIUM, HIGH

Password Lock #0 – 9999(Process) Run Number

0 to 9999

Recorder Function

Rate, Rate Deviation, Power, Thickness, Computer Remote, I/O Control, Off

Recorder Out Channel

1 – 2 selects analog output channel

Real Clock Time

HH/MM/SS

Real Clock Date

MM/DD/YY

I/O Slot 1 TypeUNUSED (DISABLED) / INPUT / OUTPUT

I/O Slot 2 TypeUNUSED (DISABLED) / INPUT / OUTPUT

I/O Slot 3 TypeUNUSED (DISABLED) / INPUT / OUTPUT

I/O Slot 4 TypeUNUSED (DISABLED) / INPUT / OUTPUT

Memory Module IFC

OFF/ON

Communication Parameters for Process #________:
COM/IO Lock Code0 – 9999

Keyboard Beep

OFF / ON

RS232 Baud Rate

300, 1200, 2400, 9600

RS232 Protocol

Sycon, ASCIISECTION 12.XX

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