This may not be the latest edition.
AD2-I20-A049

6mφ Radiometer Space Chamber
Users’ Manual

Advanced Engineering Services Co., Ltd.

This may not be the latest edition.

本文書は、AD2-I20-A004「6mφ放射計スペースチャンバ」初版を英訳したものであり、最新版であることは保証されていません。
英訳版を用いての設備利用検討に当たっては、以下の連絡先にお問い合わせの上、最新情報をご確認ください。
tfcd_rikatsu@aes.co.jp

This document was translated from first edition of AD2-I20-A004 “6mφ Radiometer Space
Chamber Users’ Manual”, which may not be the latest edition. Please contact the following
address for the confirmation of the latest edition or if you have any inquiry concerning thecontents of the English edition.
tfcd_rikatsu@aes.co.jp

This may not be the latest edition.

Table of Contents
1. Introduction .......................................................................................................................................................... 1
2. Brief Overview of this Facility ............................................................................................................................. 2
2.1. System Outline .............................................................................................................................................. 2
2.2. Main Specifications ....................................................................................................................................... 4
2.2.1. Monitor and Control System................................................................................................................... 5
2.2.2. Vacuum Vessel System ........................................................................................................................... 5
2.2.3. Vacuum Equipment System .................................................................................................................. 10
2.2.4. Cryogenic System ................................................................................................................................. 10
2.2.5. Power supply System for IR Heaters .................................................................................................... 122.2.6. Vibration Isolation System.................................................................................................................... 14
2.2.7. Data Acquisition System....................................................................................................................... 20
2.2.8. Utility Equipment ................................................................................................................................. 21
2.2.9. Gadgets and Spares ............................................................................................................................... 23
3. User I/F ............................................................................................................................................................... 26
3.1. Configuration between Inside and Outside of Space Chamber ................................................................... 26
3.2. Measurement and Control Room ................................................................................................................. 26
3.3. Device I/Fs ................................................................................................................................................... 26
3.3.1. Vacuum Vessel ...................................................................................................................................... 26
3.3.2. Cryogenic System ................................................................................................................................. 65
3.3.3. Power Supplies for Heat Sources.......................................................................................................... 65
3.3.4. Control Mode ........................................................................................................................................ 67
3.3.5. Limit Function ...................................................................................................................................... 71
3.3.6. Vibration Control System ..................................................................................................................... 77
3.3.7. Data Acquisition System....................................................................................................................... 78
3.3.8. Utility Facilities .................................................................................................................................... 84
3.4. Facility Belongings ...................................................................................................................................... 88
3.5. Building I/F.................................................................................................................................................. 89
4. Execution of Tests............................................................................................................................................. 101
4.1. Test-related Work Procedure ...................................................................................................................... 101
4.2. Test Procedure ........................................................................................................................................... 102
4.2.1. General Description of Test ................................................................................................................ 102
4.2.2. Standard Chamber Vacuum Curve, etc. .............................................................................................. 104
4.3. Power Failure Protective Measures ........................................................................................................... 105
4.4. Other Remarks ........................................................................................................................................... 108
4.5. Documents to be Submitted at K/O Meeting ............................................................................................. 114
Appendix A Correspondence Table of Channels between Terminal Boards inside Vessel and Data Loggers ...... A-0iThis may not be the latest edition.

List of Figures
Figure 2-1 External View of 6 mφ Radiometer Space Chamber .............................................................................. 2
Figure 2-2 System Diagram and Tree Diagram of 6mφ Radiometer Space Chamber Facility ................................. 3
Figure 2-3 Diagram of Monitor and Control System................................................................................................ 5
Figure 2-4 External View of TS Installation Device................................................................................................. 8
Figure 2-5 Supporting Bench with Cooling Panel .................................................................................................. 11
Figure 2-6 Supporting Bench.................................................................................................................................. 11
Figure 2-7 External View of Power Supplies for Heat Sources .............................................................................. 13
Figure 2-8 System Diagram of Vibration Isolation System .................................................................................... 15
Figure 2-9 Optical Bench........................................................................................................................................ 16
Figure 2-10 Seismic Slab ........................................................................................................................................ 17
Figure 2-11 System Diagram of Vibration Analyzer .............................................................................................. 19
Figure 2-12 System Diagram of Data Acquisition System ..................................................................................... 20
Figure 2-13 Clean Booth ........................................................................................................................................ 22
Figure 2-14 Calorimeter ......................................................................................................................................... 24
Figure 2-15 WBD Example of Calorimeter to Power Supply for Heat Sources..................................................... 25
Figure 3-1 System Diagram for Operation in Preparation Room ........................................................................... 27
Figure 3-2 Configuration of Devices in Measurement and Control Room............................................................. 28
Figure 3-3 Configuration of Feed-through Terminal Nozzles ................................................................................ 29
Figure 3-4 WBD Diagram of Feed-through Terminal ............................................................................................ 34
Figure 3-5 WBD Diagram of Signal Lines for TS .................................................................................................. 35
Figure 3-6 WBD Diagram of EP Lines for TS ....................................................................................................... 36
Figure 3-7 WBD Diagram of Thermocouples/Calorimeters for TS, and Thermocouple Spare Lines .................... 37
Figure 3-8 WBD Diagram of Temperature Sensors for TS .................................................................................... 38
Figure 3-9 WBD Diagram of SBG Temperature Measurement .............................................................................. 39
Figure 3-10 WBD Diagram of 2 kW IR Power Supply Rack ................................................................................. 40
Figure 3-11 WBD Diagram of 60W IR Power Supply Rack .................................................................................. 41
Figure 3-12 Feed-through Terminal for Coaxial Cables of TS ............................................................................... 42
Figure 3-13 Inner-vessel Permanent Terminal Boards – I, II, III ............................................................................ 43
Figure 3-14 External Input Terminal Boards – I, II ................................................................................................ 44
Figure 3-15 Thermocouple Socket Contact (manufactured by Hitachi Power Semiconductor Device, Ltd.) ........ 45
Figure 3-16 Configuration of Hard Ports ................................................................................................................ 47
Figure 3-17 Load Capacity of Supporting Benches with and without Cooling Panel ............................................ 48
Figure 3-18 Load Capacity of Body Shroud Hard Port .......................................................................................... 48
Figure 3-19 Schematic View of Hard Port for Optical Bench Maintenance........................................................... 49
Figure 3-20 System Diagram of Ports for TS ......................................................................................................... 53
Figure 3-21 Diagram of Grayloc Connector for LN2.............................................................................................. 54
Figure 3-22 Diagram of Supply Port Flange for GN2 ............................................................................................. 55
Figure 3-23 Procedure of TS Installation ............................................................................................................... 57
Figure 3-24 Diagram of Optical Window Mounting Flange................................................................................... 58

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Figure 3-25 Optical Window .................................................................................................................................. 59
Figure 3-26 Mounting Positions of Optical Windows ............................................................................................ 60
Figure 3-27 Work Floors inside Vacuum Vessel ..................................................................................................... 62
Figure 3-28 Movable Operation Bench .................................................................................................................. 63
Figure 3-29 Working Platform ................................................................................................................................ 64
Figure 3-30 Diagram of SBG Support .................................................................................................................... 65
Figure 3-31 Grayloc Connector for SBG-cooling He ............................................................................................. 65
Figure 3-32 Work Floor Rails (when mounting SBG) ............................................................................................ 65
Figure 3-33 System Diagram of Holistic System ................................................................................................... 65
Figure 3-34 System Diagram of Power Supply Racks for IR Heaters.................................................................... 66
Figure 3-35 Connection of RTDs ........................................................................................................................... 80
Figure 3-36 Wire Breakage Detection Circuit ........................................................................................................ 81
Figure 3-37 Outline Flow of Clean Booth Operation ............................................................................................. 85
Figure 3-38 Height inside Clean Booth .................................................................................................................. 86
Figure 3-39 Configuration of Clean Booth Ducts................................................................................................... 87
Figure 3-40 Mounting Bench (Large) ..................................................................................................................... 91
Figure 3-41 Configuration of Distribution Boards/Plug Socket Boards ................................................................. 92
Figure 3-42 WBD Diagram of Distribution Boards ............................................................................................... 93
Figure 3-43 Specifications of Socket at Lower Part of Distribution Board and Plug Socket Board (A) ................ 94
Figure 3-44 Circuit Diagram of Branch Power Board for Users ............................................................................ 97
Figure 3-45 Movable Range of Crane in Each Room............................................................................................. 98
Figure 3-46 Diagram of Installation Sites for NVR Plates ..................................................................................... 99
Figure 4-1 Test-related Work Flow ....................................................................................................................... 101
Figure 4-2 Vacuum Curve in Standard Chamber, etc. .......................................................................................... 104
Figure 4-3 Standard Flow in Momentary Power Interruption and Power Failure ................................................ 107
Figure 4-4 Inner-Chamber Pressure Transition during 20-minute Power Failure ................................................ 108
Figure 4-5 Emergency Stop Switch inside Chamber .............................................................................................111
Figure 4-6 Locations of Emergency Stop Switches in Preparation Room and Measurement & Control Room .. 112
Figure 4-7 Location of Emergency Stop Switch on Emergency Stop Console Panel in Measurement & Control
Room ............................................................................................................................................................ 112
Figure 4-8 Position of Emergency Stop Switch on Preparation Room Access Door Console Panel.................... 113

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List of Tables
Table 2-1 Main Performance and Facility Specifications of 6 mφ Radiometer Space Chamber.............................. 4
Table 2-2 Basic Specifications of Moving Dolly...................................................................................................... 6
Table 2-3 Basic Specifications of TS Installation Dolly ........................................................................................... 7
Table 2-4 Basic Specifications of Supporting Bench with Cooling Panel ................................................................ 9
Table 2-5 Basic Specifications of Supporting Bench ............................................................................................... 9
Table 2-6 Basic Specifications of Power Supplies for Heat Sources ...................................................................... 12
Table 2-7 Basic Specifications of Optical Bench ................................................................................................... 14
Table 2-8 Basic Specifications of Vibration Analyzer ............................................................................................ 18
Table 2-9 Basic Specifications of Data Acquisition System ................................................................................... 20
Table 2-10 Basic Specifications of Clean Booth .................................................................................................... 21
Table 3-1 Table of Flanges (1/2) ............................................................................................................................. 30
Table 3-1 Table of Flanges (2/2) ............................................................................................................................. 31
Table 3-2 Table of Feed-through Terminals for Current/Thermocouples (1/2) (Simplified) .................................. 33
Table 3-2 Table of Feed-through Terminals for Current/Thermocouples (2/2) (Detailed) ..................................... 33
Table 3-3 Table of Hard Ports ................................................................................................................................. 46
Table 3-4 Load Capacities of Hard Ports ................................................................................................................ 46
Table 3-5 Load Capacity of Body Shroud Hard Ports ............................................................................................ 48
Table 3-6 Load Capacity of Hard Ports on Optical Bench ..................................................................................... 49
Table 3-7 List of TS LN2 Lines .............................................................................................................................. 50
Table 3-8 General Description of TS Cooling/Heating I/F ..................................................................................... 51
Table 3-9 Rough Levels of LN2 Feed Rate and Valve Opening Percentage ........................................................... 51
Table 3-10 Basic Specifications of SBG I/F ........................................................................................................... 65
Table 3-11 Composition of Primary Components in Power Supplies for Heat Sources ......................................... 65
Table 3-12 Control System of Power Supply Rack ................................................................................................ 67
Table 3-13 Control Methods and Descriptions of PID Control (1/2)...................................................................... 68
Table 3-13 Control Methods and Descriptions of PID Control (2/2)...................................................................... 69
Table 3-14 Table of Limit Functions (1/3) .............................................................................................................. 72
Table 3-14 Table of Limit Functions (2/3) .............................................................................................................. 73
Table 3-14 Table of Limit Functions (3/3) .............................................................................................................. 74
Table 3-15 Contents of Alert for Each Detection Item (1/2)................................................................................... 75
Table 3-15 Contents of Alert for Each Detection Item (2/2)................................................................................... 76
Table 3-16 Correspondence between Acquisition Data and Channel Numbers...................................................... 79
Table 3-17 Recommended Usage Instructions for Wire Breakage Detection Function (1/2) .............................. 82
Table 3-17 Recommended Usage Instructions for Wire Breakage Detection Function (2/2) .............................. 83
Table 3-18 List of Facility Belongings ................................................................................................................... 88
Table 3-19 Basic Descriptions of Hand-pallet Truck .............................................................................................. 89
Table 3-20 List of Distribution Boards for Users ................................................................................................... 90
Table 3-21 Specification of Cranes......................................................................................................................... 95
Table 3-22 Specification of UPS ............................................................................................................................ 96iv

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Table 4-1 Test Methods Corresponding to Test Purposes ..................................................................................... 103
Table 4-2 Summary of Kinds of Tests and Environmental Conditions................................................................. 103
Table 4-3 Requirements for Facility ..................................................................................................................... 115
Table 4-4 List of Nonmetallic Articles Brought into Space Chamber .................................................................. 116

Appendix A
Table A-1 Correspondence Table of Channels between Terminal Boards inside Vessel and Data Loggers（1/5） 1
Table A-1 Correspondence Table of Channels between Terminal Boards inside Vessel and Data Loggers（2/5） 2
Table A-1 Correspondence Table of Channels between Terminal Boards inside Vessel and Data Loggers（3/5） 3
Table A-1 Correspondence Table of Channels between Terminal Boards inside Vessel and Data Loggers（4/5） 4
Table A-1 Correspondence Table of Channels between Terminal Boards inside Vessel and Data Loggers（5/5） 5v

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1. Introduction
This users’ manual is to provide necessary information to the users of 6mφ Radiometer Space Chamber (referred
to as “this facility” hereafter) located in the 6mφ Radiometer Space Chamber Building.
This facility is used for optic tests on different kinds of earth observation radiometers to be mounted on satellites,or thermal vacuum tests on mid/small-size satellites and satellite components, in simulated space environments on
ground.
This facility can reduce the transmission of micro tremors from the ground or the vibration from vacuum pumps,
etc. to a test specimen (■abbreviated as TS hereafter) to the maximum degree, by adopting an isolated base, sothat high-precision optical instruments, etc., can be the subject for a test. Furthermore, this facility achieves spacewith high cleanliness, with its design to satisfy the cleanliness requirements for optical instruments while dealing
with both particulate and molecular contamination.
The major environments in outer space are high vacuum, cryogenic shade, etc. On the geostationary orbit which
is about 36,000 km above the surface of the earth, those environments respectively reach the levels of about 1.3 ×
10-11Pa and 3K, the latter being an infinite heat absorber.
However, it is financially unfeasible to simulate such environments on ground as they are, and therefore thisfacility provides vacuum pressure of 1.3 × 10-4Pa or less and shroud temperature of 100K or lower. In order to meetthe request of temperature planes to be 100K or lower, meanwhile, this facility is equipped with hard ports to mounta space background panel, as well as a He refrigerator and a He supply flange which cool down the panel plane to
20K.
We can verify the reliability of satellite behaviors in space by extrapolating them from the accuracy
assessment on thermal designs under the simulated environments mentioned above.

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2. Brief Overview of this Facility
2.1. System Outline
The external view and system diagram of this facility are shown in Figures 2-1 and 2-2, respectively.

Figure 2-1 External View of 6 mφ Radiometer Space Chamber2This may not be the latest edition.

液体窒素系
LN2
sytem
系

to atmosphere
大気

ﾍﾘｳﾑｶﾞｽ

warmer
加温器

He gas buffer tankﾊﾞｯﾌｧﾀﾝｸvalve弁箱box

液化窒素

LN2 storage
tank

LN2

貯槽

He ﾍﾘｳﾑ冷凍機
refrigerator

mist
気液
separator

shroud heater☆
ｼｭﾗｳﾄﾞ加温ﾋｰﾀ

space backgroundｽﾍﾟｰｽﾊﾞｯｸｸﾞﾗｳﾝﾄﾞ分離器

LN2 LNevaporator
2 蒸発器

He ﾍﾘｳﾑｶﾞｽ送気台
gas supply standｽﾍﾟｰｽﾊﾞｯｸｸﾞﾗｳﾝﾄﾞ系
Space background

ｶﾞｽ窒素系
GN2sytem
系

Atmospheric
大気圧戻し系
returnsystemshroudｼｭﾗｳﾄﾞ
to atmosphere
大気

乾燥器
dryer

regenerator
heater
乾燥器再生ﾋｰﾀ

Outgasheating air inlet
脱ｶﾞｽ用加熱系
systemvalve
大気導入
大気導入ﾋｰﾀ
air inlet

test item

供試体

元弁
air inlet
大気導入
filteroptical
光学窓window外部光源

heaterroughing line valve

加速度計

粗引元弁
ﾌｨﾙﾀ

ﾒｶﾆｶﾙ
mechanical
ｸﾗｲｵｿｰﾌﾟｼｮﾝ
cryosorption
pumps (2) booster
pumps 台)(2)
ﾌﾞｰｽﾀｰﾎﾟﾝﾌﾟ(2pumps
ﾎﾟﾝﾌﾟ(4(4)
台)Roughing
粗引排気系
vacuum system
系
molecular
holding 台)
pumps (2) turbo
ﾎｰﾙﾃﾞｨﾝｸﾞﾎﾟﾝﾌﾟ(2pumps (4)rotary vacuum
油回転ﾎﾟﾝﾌﾟ(2台)external
light

accelerometer

opticalbench
防振架台

ﾀｰﾎﾞ分子ﾎﾟﾝﾌﾟ(4 台)Highvacuum
高真空排気系
systemvibration
analyzer

accelerometer
加速度計

振動解析装置本体
真空容器
chamberfoundation
基礎

LN2
emitter
LN2 放出槽

真空容器

seismic slab
独立基礎

chamber基礎
foundation

seismic
独立基礎slab

LN2

contamination
panel
ｺﾝﾀﾐﾈｰｼｮﾝﾊﾟﾈﾙ

Vibration
isolation
防振系
system系

Monitor & Control System

制御監視系

top
Monitor &Emergency SAbort
Control
Console Operation
Console
制御監視卓
非常停止操作卓Control Unit

運転制御装置Body of Vacuum
Vessel真空容器本体Equipment for Operation and
MaintenanceExamination
運用保守点検作業用設備

Vacuum Vessel System

真空容器系

Vacuum Equipment
Equipment S ystem

真空排気系

Roughing Vacuum Vacuum Pressure
SystemMeasurement System
粗引排気系 真空計測系
High Vacuum System

高真空排気系

Atmospheric Return
System
大気圧戻し系

φ

6 mφ Radiometer Space Chamber

６
ｍ
放
射
計
ス
ペ
ー
ス
チ
ャ
ン
バ

LN2 System

Water System
液化窒素系 Cooling
冷却水設備
GN2 System
Monitor
ガス窒素系 O2
酸素濃度監視装置
Space Background System
Air Package
スペースバックグラウンド系 Instrument
計装空気発生設備

Cryogenic System

極低温系

Power Supply System for
IR Heaters
赤外加熱用電源系

Vibration Isolation System

防振系

Remote
PCController
IR PowerSetting
S upplies
一括リモート制御装置

IR Power S upplies Setting PC

Power Supply Racks☆
試験用電源装置
Seismic Slab Vibration Analyzer

独立基礎 振動解析装置
防振架台

Optical Bench

Data Saving Device

データ保存装置

Data Acquisition System

計測ﾃﾞｰﾀ処理系

Utility Equipment

付帯設備

Data Acquisition
Deviceデータ収集装置
Setting Monitoring
Device
設定監視装置Data Displaying
データ表示用装置
DeviceCommunication
Board (MCC)
Systemfor Operation Power
動力盤(MCC)
作業用通話設備
SearchDevicefor
ITV System Complete
Documents☆
Documents
ITV 装置 完成図書類検索装置
Clean Booth Equipment

クリーンブース設備

Crane Equipment

クレーン設備UPSUPSSpecialized Tools

専用工具

Attachments

付属品

Attachments of Each System (RGA, T-QCM, etc.)

各系付属品(RGA、T-QCM 等)

Figure 2-2 System Diagram and Tree Diagram of 6mφ Radiometer Space Chamber Facility

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2.2. Main Specifications
The main specifications of the whole facility are shown in Table 2-1.

Table 2-1 Main Performance and Facility Specifications of 6 mφ Radiometer Space Chamber
item(1) space chamber

performance/specifications

notes

mailbox typeusable dimensions

6m (dia) × 8m (L)dimensions inside shroud

access door of chamber

6m (W) × 5.1m (H)incl. dolly

shroud temperature

100K or lower,
or ambient temperature ~ 60℃

Max. weight carriable in chamber 4,000 kg

incl. jigvacuum pressure① operational vacuum
pressure

1.33×10-4Pa or less(1×10-6Torr or less)② ultimate vacuum pressure 1.33×10-5Pa or less*1

(1×10-7Torr or less)pumpdown / repressurizing time

8 hours or lessMax. consecutive operation days

45 daysfor 1-min. sampling cycle

black space

95％ or morewhen using supporting bench withcooling panel

space background temperature

20K or lower(2) power supply for IR heaters
power supplies for heat sources

6mφ 60W power supply rack-1: 25

4 racks

6mφ 2 kW power supply rack-1: 10
6mφ 2 kW power supply rack-2: 10*2
6mφ 3 kW power supply rack-1: 10(3) vibration isolation system*1

optical bench dimensions

4m × 6m × 0.5m (D)permanently equipped in chamber

optical bench eigenvalue

30Hz or higher

relative displacement vibration

1.0 μm 0-P or lessbet. bench in chamber and slab outside

relative angle vibration

0.3 μrad P-P or lessbet. bench in chamber and slab outside

w/o TS, TS supporting bench, or IR radiation; shroud being cooled with LN2, within 8 hours after the startof pumpdown.

*2

2 kW power supply rack-2 and power supplies-3, 4 are not available.

4

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2.2.1. Monitor and Control System
This system enables intensive monitoring of the operational status in the space chamber via Human I/F Stations(HIS) based on the process data of the vacuum equipment system, cryogenic system, etc., collected in the DCS
control station (Figure 2-3.)

HIS01

HIS02

Ethernet HUB

process data

equipment, valves, etc.

DCS Control Station

Figure 2-3 Diagram of Monitor and Control System

2.2.2. Vacuum Vessel System
This system consists of a vacuum vessel and equipment for operation and maintenance. The brief explanationof the system is provided as follows.
(1) Vacuum vesselThis cylindrical stainless-steel vessel is shaped like a mailbox, and has a storage space of 6-meter
diameter × 8-meter long (inside shroud.)
The mailbox-like shape of the vacuum vessel achieves a spacious working area and easy access to aTS.
The vacuum pressure inside the vessel is measured by the Pirani gauge and ionization gauge mounted
on the vessel. Their measurement ranges cover successive measurement from the atmospheric pressure to
the ultimate vacuum pressure range, and the data is displayed on the control and monitor console in themeasurement and control room. They are also capable of continued measurement during power failure,with the help of an uninterruptible power supply system.
The vacuum vessel has optical windows to be used for radiometer optical confirmation tests on bothsides of the vacuum vessel body part and the access door for a TS. There also are windows for alignment
measurement on side and top of the body part, and on the access door.
The alignment measurement windows have mounting seats for the ITV facility (cf. section 2.2.8) tomonitor the inside of the vacuum vessel.

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(2) TS installation device
The TS installation device is made up of a moving dolly, a TS installation dolly, and a supporting benchwith a cooling panel (or a supporting bench w/o a cooling panel.) The moving dolly and the TS installation
dolly can be moved with human power, owing to the air bearings attached to them which slightly lift themup. Each of the dollies is briefly explained below. As for how to operate the TS installation device, refer
to 3.3.1.6. Its external view is shown in Figure 2-4.
(a) Moving dolly
The moving dolly can freely move in the preparation room with the TS installation dolly, the TS
supporting bench, and a TS mounted upon it. It also has a bridge board for moving the TS installation
dolly onto the optical bench in the vacuum vessel. Its brief specifications are shown below.

Table 2-2 Basic Specifications of Moving Dolly
item

specification

dimensions

5m (width) × 7.25m (length) × 0.85m (height) (from floor surface)load capacity

Max. 12,400 kg (incl. TS and jig = 4,000 kg)

own weight

7,700 kg

drive system

pushed by hands

movable range

unpacking room, preparation room

length of air-supplying hose

30m

movable load (Max. pulling force)

Max. 52 kg

air consumption

2.0 Nm3 / min

air pressure

0.39 MPa or more(b) TS installation dolly
The TS installation dolly is used for mounting and dismounting the supporting bench with acooling panel or the supporting bench without a cooling panel from/onto the moving dolly onto/fromthe optical bench in the vacuum vessel. The basic specifications of the TS installation dolly are shown
below.

6

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Table 2-3 Basic Specifications of TS Installation Dolly
item
dimensions

specification
3.19m (width) × 5.16m (length) × 0.145m (height)(to the upper end of the jack)load capacity

6,800 kg (incl. TS and jig = 4,000 kg)

own weight

2,100 kg

drive system

pushed by hands

movable range

moving dolly ~ on the optical bench inside the vacuum vessel

length of air-supplying hose

10m

air consumption

2.0 Nm3 / min

air pressure

0.39 MPa or more

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Figure 2-4 External View of TS Installation Device

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(c) TS supporting benchThose supporting benches are used to mount a TS to place it inside the vacuum vessel. That is, a
TS is carried into the vessel by a TS installation device to be placed on the optical bench, while
mounted on a supporting bench all the way through. TS supporting benches can be mainly classified
into two kinds; one is a supporting bench with a cooling panel used for thermal vacuum tests, and theother is a supporting bench (for optic tests) used for optical performance confirmation tests. The basic
specifications of the former are shown in Table 2-4 and Figure 2-5, while those of the latter are shownin Table 2-5 and Figure 2-6. As can be seen from Tables 2-4 and 2-5, their load capacities withstand a
TS (including a jig) weighing up to 4.0t. Information on the I/F, e. g., the diameters of the screw holesof hard ports, etc., is provided in section 3.3.1.3.

Table 2-4 Basic Specifications of Supporting Bench with Cooling Panelitemspecification

dimension

5m (width) × 3.5m (depth)

Max. load mass

4,000 kgmass of bodyabout 2,800 kg

material

aluminum alloy

surface temperature

100K or lower(two out of the LN2 lines for cooling parts of a TS are used)

Table 2-5 Basic Specifications of Supporting Benchitem

specification

dimension

5m (width) × 3.5m (depth)

Max. load mass

4,000 kgmass of bodyabout 2,200 kg

material

alluminum alloy

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2.2.3. Vacuum Equipment System
This system consists of low and high vacuum systems which vacuum the vacuum vessel from the atmosphericpressure to the high vacuum, and an atmospheric return system which raises the pressure inside the vacuum
vessel from the vacuum state to the atmospheric pressure condition with GN2 and dry air.
The standard vacuum curve (without a TS) during a thermal vacuum test is shown in Figure 4-2.

2.2.4. Cryogenic System
This system consists of an aluminum-alloyed fin-tube type shroud that is cooled down to 100K or lower bymeans of LN2 to establish cryogenic environment, and SBG (space background) cooling lines in the vacuum
vessel that are cooled down to 20K or lower by He gas to simulate deep space for radiation cooling. The SBG
itself is to be prepared by users. Refer to section 3.3.2.1 for the I/F to the facility. The SBG cooling lines are
currently in a dormant state, being not ready for use. Users are to contact the Environmental Test Technology
Unit if they want to use SBG cooling lines.
Note) It takes 12 months or longer to get them ready for use.

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Figure 2-5 Supporting Bench with Cooling Panel
Figure 2-6 Supporting Bench

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2.2.5. Power supply System for IR Heaters
These devices are used for IR radiation thermal balance/thermal vacuum tests performed in 6mφ radiometer
space chamber, to supply specified EP to IR lamps as the IR light source or heaters which provide external
thermal input to a satellite, or to simulation heaters for the heat from the equipment mounted on a satellite.
The test data collected by those devices are transmitted to the data acquisition system in 6mφ radiometer
space chamber and recorded thereat.

Table 2-6 Basic Specifications of Power Supplies for Heat Sources
item

specification
6mφ 60W power

6mφ 2 kW power

6mφ 2 kW power

6mφ 3 kW power

supply rack -1

supply rack -1

supply rack -2

supply rack -1

25

10

10

10

DC60V

DC100V

DC100V

DC100V

1A

20A

20A

30A

60W

2 kW

2 kW

3 kW

name

qty
outputvoltage
outputcurrent
output EP
controlremote control (temperature / constant power / manual voltage output control) / local control
methodnotes

2 kW power supply rack -2 and power supplies No. 3, 4 are not available.

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6mφ 3 kW power
supply rack -1

6mφ 2 kW power
supply rack -1

6mφ 2 kW power
supply rack -2

6mφ 60W power
supply rack -1

Figure 2-7 External View of Power Supplies for Heat Sources13This may not be the latest edition.

2.2.6. Vibration Isolation System
This system, which is made up of an optical bench, a seismic slab, and a vibration analyzer, is established to
avoid the bad influence of vibration that is propagated from outside during a radiometer optical confirmation test
performed in the space chamber. The schematic view and basic specifications of this system are shown in Figure
2-8 and below, respectively.
(1) Optical bench (Figure 2-9)This bench is permanently equipped in the vacuum vessel, and used with a TS supporting bench, on
which a TS is mounted, fixed onto the bench. Its main posts are directly connected to the seismic slab via
bellows, penetrating through the vacuum vessel, which perfectly insulates vibration from the vacuum
vessel system.

Table 2-7 Basic Specifications of Optical Benchitem

specification

dimensions

6m (length) × 4m (width) × 0.5m (height)

mass

about 6,500 kg

material

alluminum alloy (A5083P-O)

structure

integrated with a weld box

main post

6 stainless steel pipes

bellows

stainless steel

surface roughness

25 μm or lessflatness

600 μm or lesseigen frequency

optical bench alone: 30Hz or higher in all the directions
w/ supporting bench: about 27Hz in Y direction(2) Seismic slab (Figure 2-10)
The seismic slab is a large slab made of reinforced concrete which is separated from the building
foundation, the chamber foundation, and the machine foundation of the vacuum pumps, etc., to isolate
vibration from them.
When performing an optical confirmation test on radiometers, etc., relative vibration can be controlled
by placing the external light source on this seismic slab, that is, placing the light source and a TS on thesame foundation.
・ Eigen frequency:

20Hz or higher (for up/down and bending modes, according to analysis)

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Vacuum Vessel

Optical Bench

External Optical System

TS
Acceleration Sensor

Relative Angle

Seismic SlabChamber Foundation

Vibration Analyzer

Vibration Measurement with Vibration Isolation System
Figure 2-8 System Diagram of Vibration Isolation System

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TS supporting bench guide22-M16for mounting
TS supporting bench guide10-M24for mounting
TS supporting bench

4-M16
for mounting
TS supporting bench

4-M24
for mounting TS supporting bench guideTS supporting bench guide

bellows

support (main post)
sliding pad

TS supporting bench
optical benchvacuum vesselbase (for main post)

embedded hardware

Figure 2-9 Optical Bench

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anchor bolt
cable passagebuilding wall
TS supporting benchbenchhandrailchamber foundationpile

B-B cross-section 1:200

seismic slab 1:200
vacuum vessel

TS supporting bench
optical bench
cable passage

pilechamber foundation

A-A cross-section 1:200

C-C cross-section 1:200

Figure 2-10 Seismic Slab

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(3) Vibration analyzer
The purpose of this vibration analyzer is to assess and verify the feasibility of an optical property
verification test on a TS especially in micro vibration environments amid the constraints of the vibration
turbulence specific to this facility. It is made up of measuring devices, e. g., accelerometers, drivers, etc.,
and a work station for analyzing data. The basic specifications and system diagram of the vibration
analyzer are shown in Table 2-8 and Figure 2-11, respectively.
If it is planned to be used, contact us 6 months in advance, because it requires a prior-to-use checking
by the facility-side personnel.

Table 2-8 Basic Specifications of Vibration Analyzer
item

specification

data to be dealt withacceleration, relative displacement, relative angle

measurement spots

inside vacuum vessel: optical bench, shroud, vacuum vessel
outside vacuum vessel: seismic slab, optical window

input

deigital signals via accelerometers

outputoutput to monitor, or in digital (binary/text)/analogue data

frequency range

1Hz ~ 1,000Hz

number of measurement channels

31 channels (incl.)
for accelerometers: 30 chs (inside vacuum vessel: 15 chs, outside
vacuum vessel: 15 chs)
for laser doppler displacement gauge: 1chcontents of data analysis

・PSD analysis・transfer function analysis・waveform analysis・FFT
analysis

accelerometer specification*
cryogenic accelerometer (393M33)
8 setsmeasurement range (±G): 2.5
sensitivity (gal/V): 1,000
resolution (μG): 100
working temperature range (℃): －196 ~ ＋121
measurement range (±G): 0.5

high sensitivity accelerometer (393B12)
3 setssensitivity (gal/V): 100
resolution (μG): 8
working temperature range (℃): －46 ~ ＋82
measurement range (±G): 0.5

high sensitivity accelerometer (393B31)
12 sets

sensitivity (gal/V): 100
resolution (μG): 1
working temperature range (℃): －18 ~ ＋65

calibration equipment

LV-2100 manufactured by Ono Sokki Co., Ltd. (laser doppler
displacement gauge)* Accelerometers are fixed with heliserts. Pay enough attention to the screw parts, because they can easily be
jammed.

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relay box

inside vacuum vessel

hermetic connector (×3)

003 low noise cable 25m
accelerometer typeM 003M 025D (6)type 020 twisted wire H. TECHcable 20m
manufactured
M 020C020D (15)drivers

TSP cable 50m

optical bench
plug
type 003 low noise cable 10m type 003 low noise cable 15m
M 003M 159 (9) MIL connector M 003M 015D (9)model #

shroudmodel #

16-channel
flat cable

BNC cable
H. TECHmanufactured

KEMOmanufactured

type 30110
ultra low noise
ICP insulation
amplifierVBF64
32 channel
filter19-inch X-terminal
EDAS 9000 multi channel
signal analysis system

16-channel application software
flat cable
CDS-manufactured SPAGS

type 003 low noise
MIL connector cable 15m

work station
Concuurent-manufactured
type 9100
Real Time UNIX
X-Windows
CPU: R4400 MC (150 Hz)
memory: 64MB
16 bit 32 channel D/SH
harddisc: 1GB
cassette MT: 525MB

OS:

vacuum vessel
model #

outside vacuum
vesseltype 20 twisted wire cable 36m
M 020M 030C (15)uninterruptible
power supply
seismic slab
special type III
grounding(location: LS-1A)

type 20 twisted wire cable 20m
M 020M 020C (6)model # 393B31
type 003 low noise
MIL
connector
cable 10m

optical window

14-inch video terminalmodel # 393M33

for accelerometer calibration

Figure 2-11 System Diagram of Vibration Analyzer

19

lasor printer; A4 size

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2.2.7. Data Acquisition System
This system possesses a function to acquire, process, and save TS data and facility data during a test on asatellite, etc., performed in this facility, while displaying the data in real time to the operator (viz. monitoring
function.) Its basic specifications are shown below. The system diagram of the acquisition system and acorrespondence table of thermocouple channels are shown in Figure 2-12 and Appendix A, respectively.

Table 2-9 Basic Specifications of Data Acquisition Systemitem

specification

Max. consecutive test days

45 days (for sampling cycle = 1 minute)

number of measurement points

thermocouple: 550 chs
TQCM: 4 chs

measurement accuracy(1) temperature: ±1.0℃
uncertainty (incl. thermocouple sensors): 0.9℃ (k = 2)
: 1.4℃ (k = 3)
(2) voltage: measurement range ± 0.1％

sampling rate

1 time/min OR 1 time/2 mins
Min. interval for thermocouple temperature measurement section = 1 sec

compatible thermocouple

T-typecomputer 1
for display

RL basABC

HIS

for users

computer 2
for display

for users

computer 3
for display

for facility

computer 4
for display

for users(preparation room)measurement
computer

Exaquantum

Figure 2-12 System Diagram of Data Acquisition System

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2.2.8. Utility Equipment(1) ITV facility
The ITV facility is a TV system to monitor the ongoing state of equipment and work in this facility
from the measurement and control room. There are two cameras with a turning and zooming function
installed in the preparation room. There also exist two portable cameras (installed on the alignment
windows of the vacuum vessel from outside) to monitor the state inside the vacuum vessel. One of themis a highly-sensitive type and the other is a normal type. There is no ITV camera installed inside thevacuum vessel. The entire images taken by the cameras can be recorded up to 30 days in time-divisiontime lapse videos, allowing the required images to be copied on normal videos.
The jacks of the image/EP cables for the portable cameras are to be plugged in/out after making surethat the power is turned off.
(2) Communication system for operation
This system is made up of wired and wireless paging devices (multi-function telephones and cellular
phones (digital)) which enable mutual communication among test-concerned personnel and announcementof instructions during the operation of the facility or preparation for testing on a TS.
(3) Clean booth
A clean booth is designed to achieve and maintain a highly clean environment for the preparation andexecution of tests. Its basic specifications and external view are shown below and in Figure 2-13,
respectively.

Table 2-10 Basic Specifications of Clean Booth
item
performance, structure

specification
cleanliness: ISO class 5 （equivalent of FED-STD-209 class 100)
temperature: set temperature (20 ~ 23℃) ± 1℃
humidity: 50 ± 10％
dimensions: 6m (width) × 4.6m (depth) × 3.5m (height)
mass: 3,000 kg

location

inside the preparation room or vacuum vessel

installation environment(inside vacuum vessel, preparation room) cleanliness: ISO class 7 (equivalent of FED-STD-209 class 10,000)
temperature: 23 ± 3℃
humidity: 50 ± 10％21This may not be the latest edition.

vibration control metal fittings(spring type)piping in clean boothheater
6 places

nominal dimension of duct
400 × 350

louver damper
6 places

temporary duct
mounting section

nominal dimension of duct 300 ×300

nominal dimension of duct 300 ×300

lighting control board(pendant type)

upper faces of rail andTS supporting bench(same level)
outer-room control board(fixed board)

nominal dimension of duct 300 ×300
TS supporting benchfilter unit with fan(20 places)

manhole for maintenanceaperture for closing/opening curtains

eyebolt
2-revolving light

entrance for clean booth maintenance(2 places across from each other)filter unit with fan

fluorescentlamp
24 places

travelling control board(pendant type)temperature/humidity sensor
3 places
P/No.

fastener
upper surface of rail
drive motor for travelling

total
name of item numbernotemain material: STKR 400
benchmain material: anti-staticshielding sheet
electricity sheet
dolly
main material: SS400
wheel material: MC nylon
main material:
filter unit with fangalvanized steel plate
fluorescent lamp
EP: 40 W
heater
EP: 1.5 kW
temperature/humidity sensornote
M36 (for eyebolt)
8 places (on each vertical post)

reinforcement ribs

Figure 2-13 Clean Booth

22

rail for travelling

dimensions all denote outline dimensions

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2.2.9. Gadgets and Spares(1) Mass-filter-type mass spectrometer (QMG220M3): 1 set
This device measures and analyzes the remnant gas components inside the vacuum vessel with its
quadrupole analyzer.

Mass measurement range: M/e = 1 ~ 300(2) Calorimeter (cf. Figures 2-14, 15): 30 sets
A calorimeter measures the radiant energy irradiated on a satellite from external heat sources, e. g., an
IR lamp, for the purposes of setting, monitoring, and controlling test conditions for each test on a satellite,
etc.
Measurement range: 0.1 kW/m2 ~ 2.0 kW/m2
Compatible thermocouple: copper-constantan(3) TQCM (Thermoelectric Quartz Crystal Microbalance): 4 sets(a) TQCM

Application purpose: for monitoring contamination
Model #: MK10 sensor, MODEL 1900 processor, MODEL 1800 temperature controller,
manufactured by QCM Research Corp.

(b) TQCM mounting table

Mounting part:

hard points on the TS supporting benchNote) Cautions for mounting TQCM sensors
・ The temperature of a TQCM sensor may not go down if it is surrounded by heat sources, e. g., IR
panels, due to the thermal input from them. In that case, measures are to be taken by mounting
the sensor after its heat sink surface is cooled down, for example.
・ When using TQCM with its HEAT PUMP (Peltier device) turned on, use it at – 110℃ or higher.

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note
1. It denotes the tolerance to the full scale in measurement range.
2. It denotes the time to take for temperature on the optical receiver tochange by 10 ℃ when 1 solar is radiated on it with the initial
temperature of -180℃~-100℃.
3. Size tolerance shown below is to be followed when not specified.

specification

heater leads

measurement range: 0.1~2.0 kW/m2

view angle: hemisphereheater envelope areaclassification by nominal size tolerance>1m

reproducibility: within ±0.5% (note 1)
black coatedresponse time: within 10 sec (note 2)
output level: -5 ~ + 7 mV

weight: 10 g or less (note 4)
applied thermocouple: copper-constantan

solar absorptivity: 0.96 ±0.0.2 (note 6)
φ42 (max)hemisphere IR emissivity: 0.88 ±0.04(note 6)

name
optical receivercaseinsulation
supportdisc>1mpart Aring

black coatedthermocouple (optical receiver)

±0.6
±1
±1.3
±2
±2.5
±3.2
±5
±8
±10

~6
over 6~ 18
over 18 ~ 50
over 50 ~ 120
over 120 ~ 250
over 250 ~ 500
over 500 ~ 1000
over 1000 ~ 2000
over 2000 ~ 3150

accuracy: within ±0.3% (note 1)

4. Heater leads, thermocouple wires, contact pins, and standard
supports are excluded.
5. Heater leads and thermocouple wires are to have a 0.1-mm-φ
central line and 1-m length or more.
6. The measurement values are based on the sample coating.

material
quantityalumina1
Al1
Al Mylar1polyimide resin 3
Al1

spacer (Teflon)

11 (max)
calorimeter

thermocouple (disk)
gold plating

mounting holeenlarged view of part A(appearance of contact pin)manufactured by
Japan Deutsches co.

Figure 2-14 Calorimeter24

fixturestandard support

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optical receiver (Co)disc (Cu)disc (Co)compensation
thermocouple (Cu)compensation
thermocouple (Cu)compensation
thermocouple (Co)compensation
thermocouple (Co)compensation
thermocouple (Cu)compensation
thermocouple (Co)flangecalorimeter

optical receiver (Cu)outside chambercompensation
thermocouple (Cu)compensation
thermocouple (Co)

Figure 2-15 WBD Example of Calorimeter to Power Supply for Heat Sources25

thermometer

inside chamber

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3. User I/F
3.1. Configuration between Inside and Outside of Space Chamber
A system diagram of the post-TS-installation state of this facility is shown in Figure 3-1.

3.2. Measurement and Control Room
The measurement and control room (1F) possesses controllers and monitors for each of the control andmonitor system and the data acquisition system.
The measured TS temperature, etc., can be checked in the data acquisition system, and the operation of thesetting monitoring computer, T-QCM console, vibration analyzer, clean booth operation console, and the power
supplies for heat sources is to be executed by users. If a TS is to be partially cooled or heated (cf. section 3.3.1.5),
inform the company in charge of the facility of the automatic valve aperture percentage.
Figure 3-2 shows the configuration of the devices in the measurement and control room.

3.3. Device I/Fs
3.3.1. Vacuum Vessel
3.3.1.1. Nozzle Configuration in Vacuum Vessel
There are nozzles with flanges all over the vacuum vessel as the I/Fs to connect the inside and outside of thevessel (cf. Figure 3-3.) The nozzles not being used by the facility are available to users.
Especially, the main chamber body (to the measurement and control room side) has flanges for a TS withspecific purposes as signals, EP, thermocouples, waveguides, etc.
In case feed-through terminals other than the ones prepared by the facility are necessary, users are to prepare
the flanges with feed-through terminals to satisfy their designated purposes. A table of flanges is shown in Table
3-1.

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field control
stationlobby

data logger
linearslide

outer-vessel
terminal board
chamber gauge
air supply port
for air bearings

anteroom 1

movableoperation bench
air supply port
for air bearings
working platform

movingdolly

anteroom 2flange sheet surface

TS supporting benchceiling height

hand palette [small]

jig/tool maintenance area

preparation roomclean room

air bearing
work floor storage dolly
filter element storage box
hand palette [large]
TS supporting bench with shroud

preparation room crane control range

unpacking roomclean booth storage benchfore-room
unpacking room/fore-room crane control range
working platform(2) working platform dolly(2)crane control console
working platform floor

Figure 3-1 System Diagram for Operation in Preparation Room

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measurement and control room (1F)
air conditioning machinery room (1F)

maintenance area
fire alarm receiver

P/No.

name of board

dimensions (mm)operator station (monitor & control system)
operator station (data acquisition system)
field control station (monitor & control system)
inter lock & emergency stop board (monitor & control system)
vibration analyzer (vibration isolation system) [color display, console, printer]vibration analyzer (vibration isolation system) [signal conditioner]
vibration analyzer (vibration isolation system) [signal conditioner]
vibration analyzer (vibration isolation system) [uninterruptible power supply]

communication device (cabled)
ITV device
control power supply distribution board
communication device (radio)
remnant gas analyzer (MSQ data acquisition system)
IR power supply system (for high power)
IR power supply system (for low power)
MO disc file system (1) (main system)(missing number)
ITV system monitor(shelf)
ITV system monitor(shelf)clean booth control console
emergency stop operation console
handsettelephone
desktop monitor, speaker
TQCM operation console
time & vacuum level display (17 inch monitor)
oxygen level warning revolving light in vacuum vessel lower part pit

Figure 3-2 Configuration of Devices in Measurement and Control Room28

weight (kg)This may not be the latest edition.

Note) The hatched areas show the flanges available to users.

Figure 3-3 Configuration of Feed-through Terminal Nozzles

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Table 3-1 Table of Flanges (1/2)
signnominal φN-11500 × 800

qty

model #

namenote
straight cylindrical body 1, access door

2

SPECIALman door
1

N-2

1000φ

straight cylindrical body 2, access door
3

SPECIAL

optical window
1straight cylindrical body 11, upper part

N-3

250A

19

JIS VGalignment window
3, access door 5
for CC thermocouples (incl.

N-4

300A

4

JIS VG

for TS thermocouples
calorimeters, spares)for IR power supplies (N-54 is for

N-5

300A

4

JIS VG

current inlet terminal
spare)

N-6

300A

5

JIS VG

current inlet terminal (100V, 5A)

N-7

300A

1

JIS VG

high frequency output signal (coaxial)

N-8

300A

2

JIS VG

for waveguides

for TS signals

only nozzles; N-81 can also be used forthe alignment window.
N-9

300A

1

JIS VG

current inlet terminal (200V, 10A)

N-10

300A

5

JIS VG

spare nozzle

N-11

150A

1

stub end

LN2 piping

N-12

125A

1

stub end

LN2 piping

N-13

150A

2

stub end

LN2 piping

N-14

200A

1

stub end

LN2 piping

N-15

250A

1

stub end

LN2 piping

N-16

150A

4

stub end

LN2 piping

N-17

250A

1

stub end

He piping

N-18

1250A

4

SPECIALcryosorption pump

N-19

500A

4

JIS VG

turbo molecular pump

N-20

500A

1

JIS VG

low vacuum system, vacuuming port

N-21

100A

1

JIS VG

dry air inlet port

N-22

32A

1

ICF 70residual gas analyzer pipe port

N-23

300A

1

JIS VG

current inlet terminal

N-24

150A

3

JIS VG

GN2 entrance

N-25

20A

1

JIS VG

Bourdon tube pressure gauge

N-26

32A

1

ICF 70

Pirani gauge

N-27

32A

1

ICF 70BA gauge

N-28

100A

2

JIS VG

ionization gauge (nude gauge)

N-29

32A

1

ICF 70ionization gauge (wide range A)

N-30

250A

1

JIS VG

GN2 exit

for TS EP

IR gauge30

for vibration analysis

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Table 3-1 Table of Flanges (2/2)
N-31

50A

2

JIS VG

for scavenger cryopanel drains

N-32

300A

1

stub end

for partial cooling of TS

N-33

600A

2

JIS VG

for permanently equipped lighting

N-34

500A

2

JIS VG

manhole (for operation)

IR gaugeon the chamber head 1, on the bottomof the body: 1
N-35

150A

3

JIS VG

GN2 exit

N-36

15A

1

－

GN2 entrance

N-37

32A

1

ICF 70for safety switches

N-38

300A

1

JIS VG

for facility, shroud temperature
measurement
for facility, SBG temperature (incl. TN-39

300A

1

JIS VG
QCM)
attached to the vacuuming port piping

N-40

150A

1

JIS VG

safety deviceof low vacuum system

N-41

32A

1

ICF 70ionization gauge (wide range B)

N-42

20A

1

JIS VG

diaphragm pressure gauge

N-43

300A

1

JIS VG

current inlet terminal

N-44

200A

1

stub end

LN2 piping

N-45

150A

1

stub end

LN2 piping

N-46

20A

1

JIS VG

oximeter

N-47

450A

6

JIS VG

nozzle for optical bench postNote) The shaded lines denote the flanges available to users.

31

for resistor temperature measurement

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3.3.1.2. WBD for EP, Signals, etc.
Refer to the following Figures and Tables for the cabling or the connector WBD between a TS and its checkout devices, etc., inside and outside the chamber, and choose the appropriate items according to the purposes.
(1) Table of Feed-through Terminals for Current/Thermocouples (for users)(Table 3-2)(2) WBD Diagram of Feed-through Terminal(Figure 3-4)(3) WBD Diagram of Signal Lines (5A) for TS [plug signs A1 ~ 100]

(Figure 3-5)(4) WBD Diagram EP Lines (10A) for TS [plug signs B1 ~ 11](Figure 3-6)(5) WBD Diagram of Thermocouples/Calorimeters for TS, and Thermocouple Spare Lines [plug signs C1 ~42, D1 ~ 5, N1 ~ 2]

(Figure 3-7)(6) WBD Diagram Temperature Sensors (thermistor platinum sensors) for TS [plug signs E1 ~ 13](Figure 3-8)(7) WBD Diagram of SBG Temperature Measurement [plug sings G1 ~ 3]

(Figure 3-9)(8) WBD Diagram of 2 kW IR Power Supply Rack (100V, 30A) [plug signs H1 ~ 15](Figure 3-10)(9) WBD Diagram of 60W IR Power Supply Rack (100V, 3A) [plug signs J1 ~ 6]

(Figure 3-11)(10) Feed-through Terminal for Coaxial Cables of TS(Figure 3-12)(11) Inner-vessel Permanent Terminal Boards – I, II, III(Figure 3-13)(12) External Input Terminal Boards – I, II(Figure 3-14)Note) For grounding, the same type of plug as shown in (8) is to be used, which is connected to Q1 on the
inner-vessel permanent terminal board (3); the pins A and B on Q1 respectively correspond to E3 andSE3 for grounding.

[Notes for Wiring Thermocouples]
The thermocouple terminal receptacles on the inner-vessel permanent terminal boards (Figure 3-13) aremanufactured by Japan Deutsches co. while those on the external input terminal boards (Figure 3-14) aremanufactured by Hitachi Power Semiconductor Device, Ltd. The two companies’ receptacles have different
numbers of conductors and pin configurations, which requires attention to the following matters.
(1) The terminal pair on the Japan Deutsches’ connector that corresponds to the J-Q pair on the Hitachi Power
Semiconductor Device’s connector is J-Ċ, due to the lack of terminal Q.
(2) The terminals a and b on the Japan Deutsches’ connector are to be left unused.
(3) Since the K-R and J-Ċ pin pairs on the Japan Deutsches’ connector are located away from each other, theorder of WBD is to be determined with that fact taken into account.
(4) The thermocouple plugs do not include socket contacts, which are therefore to be procured based on thespecifications shown below.
・ Manufactured by Japan Deutsches co.
Socket contact (Cu): model # 0603-34-2039

Socket contact (constantan): model # 105372

・ Manufactured by Hitachi Power Semiconductor Device, Ltd.
Socket contact (Cu)

: Figure 3-15 NM-104-845-article # 1

Socket contact (constantan): Figure 3-15 NM-104-845-article # 2

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sign
A
B
C

application purpose
signal line

specification
100V/5A

connector #A1～A100

EP
thermocouple

100V/10A
CC

B1～B11
C1～C42u s able times situation
499 A29： not available
wired from inside chamber ～ external input terminal board

Figure3-544 wired from inside chamber ～ external input terminal board 3-6
479 C3：ch 2～12 not available
3-7
C14：ch 12 not available
C28：ch 12 not available
C42： all 12chs not available

D
N
E
H

J

calorimeterCCthermocouple spareCCthermometric resistor thermistor, platinum sensor
EP
100V/30A

EP

100V/3A

D1～D5
N2
E1～E1360
11 N2：ch 12 not available
30 via converter board LP910

H1～H1530 H1～H5： connected to 2kW power supply rack-1

3-8

to data acquisition system (logger)

3-10

H6～H10： connected to 3kW power supply rack
H11～H15： 2kW power supply rack-2 (power supplies No.3, 4 are not available.)
H12： for facility supporting bench heater
J1～J5： connected to 60W power supply
30 J6 is wired from inside chamber ～ external input terminal board
3-11

J1～J6

to be prepared by users
item#

application purpose

specification
nozzle allocation
Mi n .
qty of n e c essary qty ofcircuits q t y of pershellssign
1 flange sizec u rrentvo ltage

TS signals (5A)c onductors

conductors

conductors

conductors

calorimeter (60 ch)
spare thermocouple (20 ch)

junction shell

vacuum vessel feed-through terminal
cable clamp

plug

plug

preparation room external input terminal board
cable clamp

cable clamp

junction shell

receptacle

note
plug

conductors

conductors

conductors

Japan Deutsches co.Japan Deutsches co.Japan Deutsches co.

conductors

Hitachi Power
Hitachi Power
Hitachi Power
Hitachi PowerJapan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Semiconductor Device,Electronics Industry, Electronics Industry, Electronics Industry,Semiconductor Device,
Semiconductor Device,
Japan Deutsches co.Electronics Industry, Semiconductor Device,
Ltd.
Ltd.
Ltd.
Ltd.
LimitedLimitedLimitedLimitedHitachi Power
Hitachi Power
Hitachi Power
Hitachi PowerJapan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Semiconductor Device,Electronics Industry, Electronics Industry, Electronics Industry,Semiconductor Device,Semiconductor Device,
Japan Deutsches co.Electronics Industry,Semiconductor Device,
Ltd.
Ltd.
Ltd.
Ltd.
LimitedLimitedLimitedLimitedconductors
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Electronics Industry, Electronics Industry,Electronics Industry, Electronics Industry, Electronics Industry,Electronics Industry, Electronics Industry, Electronics Industry,Electronics Industry, Electronics Industry, Electronics Industry,Electronics Industry, Electronics Industry,
LimitedLimitedLimitedLimitedLimitedLimitedLimitedLimitedLimitedLimitedLimitedLimitedLimitedconnector makerconductors

conductors
Hitachi Power
Hitachi PowerJapan Aviation
Japan Aviation
Semiconductor Device,Electronics Industry,
Electronics Industry,Semiconductor Device,
Ltd.
Ltd.
LimitedLimitedconnector maker
SBG temperature measurement[※1] TQCM

conductors
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Electronics Industry, Electronics Industry,Electronics Industry, Electronics Industry, Electronics Industry,Electronics Industry, Electronics Industry, Electronics Industry,Electronics Industry,
LimitedLimitedLimitedLimitedLimitedLimitedLimitedLimitedLimitedconnector makerIR power supply (100V 30A)
TS grounding

conductors
Japan Aviation
Electronics Industry,
Limitedconnector makerIR power supply (100V 3A)

cable clamp

conductors

connector makershroud temperature measurement

receptacle

Japan Deutsches co.Japan Deutsches co.Japan Deutsches co.

connector maker

TS temperature measurement(thermistor, platinum sensor)

plugJapan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Electronics Industry, Electronics Industry,Electronics Industry, Electronics Industry, Electronics Industry,Electronics Industry, Electronics Industry, Electronics Industry,Electronics Industry, Electronics Industry, Electronics Industry,Electronics Industry, Electronics Industry,
LimitedLimitedLimitedLimitedLimitedLimitedLimitedLimitedLimitedLimitedLimitedLimitedLimitedconnector maker
TS thermocouple

dust cap

Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Electronics Industry, Electronics Industry,Electronics Industry, Electronics Industry, Electronics Industry,Electronics Industry, Electronics Industry, Electronics Industry,Electronics Industry, Electronics Industry, Electronics Industry,Electronics Industry, Electronics Industry,
LimitedLimitedLimitedLimitedLimitedLimitedLimitedLimitedLimitedLimitedLimitedLimitedLimitedconnector maker
TS EP (10A)

inner-vessel permanent terminal board

notes

conductors

DDK Ltd.

DDK. Ltd.

Japan Aviation
Japan Aviation
Japan Aviation
Electronics Industry, Electronics Industry,Electronics Industry,
LimitedLimitedLimitedDDK Ltd.

DDK Ltd.

DDK Ltd.

DDK Ltd.

conductors
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Electronics Industry, Electronics Industry,Electronics Industry, Electronics Industry, Electronics Industry,Electronics Industry,
LimitedLimitedLimitedLimitedLimitedLimitedconnector makerJapan Aviation
Japan Aviation
Japan Aviation
Electronics Industry, Electronics Industry, Electronics Industry,
LimitedLimitedLimitedJapan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Electronics Industry, Electronics Industry, Electronics Industry,Electronics Industry, Electronics Industry,
LimitedLimitedLimitedLimitedLimitedRF coaxial (SMA)
Huber + Suhner/
REPIC corporation

connector makerpermanently-equipped lighting

conductors

conductors
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Electronics Industry, Electronics Industry, Electronics Industry,Electronics Industry,
LimitedLimitedLimitedLimitedconnector maker
all system emergency abort SW.

conductors

conductors
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Japan Aviation
Electronics Industry,Electronics Industry, Electronics Industry, Electronics Industry,Electronics Industry, Electronics Industry, Electronics Industry,Electronics Industry,
LimitedLimitedLimitedLimitedLimitedLimitedLimitedLimitedconnector maker
TS thermocouple relay

Huber + Suhner/
REPIC corporation

conductors

conductors
Japan Aviation
Japan Aviation
Hitachi Power
Hitachi PowerElectronics Industry, Electronics Industry,Semiconductor Device,Semiconductor Device,
LimitedLimitedLtd.
Ltd.

connector maker

Table 3-2 Table of Feed-through Terminals for Current/Thermocouples (1/2) (Simplified)
Table 3-2 Table of Feed-through Terminals for Current/Thermocouples (2/2) (Detailed)33

terminal #for shroud temperature
measurement

for permanently-equipped
lighting(10A)
常設照明用(10 A)

inside vacuum vessel

outside vacuum vessel

TS access door
console

シュラウド
温度計測用
for shroud temperature
measurement

thermocouple, calorimeter
熱電対・ カロ リー メー タ
spare thermocouple
熱電対予備

E1 ～E1 3

resistancethermometer

100V 30A
100V 3A

heaterヒー タ

J1 ～J6S BG温度計測用
for SBG temperature
measurement

SBG

for T-QCM

T-QCM

T- Q CM用

check out system(prepared byusers)

Vacuum Vessel Feed-through Terminal

thermocouple
calorimeter
spare thermocouple

Inner-Vessel Permanent Terminal BoardTSTS signal EP (10A)
供試体信号電力(1 0 A)

IR
power
supplyT-QCM console

monitor& control
system

TS signal input/output(5A)
供試体信号入出力(5A)

External Input Terminal Board

RF circuit (coaxial/SMA)
R F回路(同軸/ S MA)
waveguide
導波管

SBG (for facility)
emergency stop
switchplug sign

vibration

relay box

[note]① The cables represented by solid lines in the figure belong to the chamber as permanently equipped items.
② The inner-vessel permanent terminal boards, etc., have receptacles on them, to which plugs can be connected. The terminals indic ated by○ require both receptacles and plugs to be prepared by users (for those indicated by ●, users are to prepare plugs only.)③ Waveguides including feed-through flanges are to be prepared by users for all the systems.
④ Special cables, e. g., for optical signals, Dsub connectors, etc., are to be prepared by users.
⑤ For coaxial cables, flanges with feed-through terminals are permanently equipped on the chamber.
⑥ The temperature of thermocouples is controlled by IR power supplies.

Figure 3-4 WBD Diagram of Feed-through Terminal

34

data acquisition systemfor permanentlyequipped lighting

monitor& control
systemThis may not be the latest edition.

vibration
analyzer

This may not be the latest edition.

channel No.
plugs (manufactured by JAE)
model: MS3106B18-1S
external input terminal(manufactured by JAE)

vacuum vessel feed-through terminals
composition of contacts: #16×10
conductors

inner-vessel
permanent terminal board

for TS signals

plugs (manufactured by JAE)
model: MS3106B18-1S
channel No.

A1 ~ A100(DC100V 5A)

Figure 3-5 WBD Diagram of Signal Lines for TS

35

This may not be the latest edition.

channel No.
plugs (manufactured by JAE)
model: MS3106B22-23S
external input terminal(manufactured by JAE)

vacuum vessel feed-through terminals
composition of contacts: #12×8
conductors

inner-vessel
permanent terminal board

for TS EP
plugs (manufactured by JAE)
model: MS3106B22-23S
channel No.

B1 ~ B11(DC100V 10A)

Figure 3-6 WBD Diagram of EP Lines for TS

36

This may not be the latest edition.

Cu pinConstantan pinchannel No.
plugs (manufactured by Hitachi Power
Semiconductor Device, Ltd.)model: JA3106B24J28SC
external input terminal board(manufactured by Hitachi Power
Semiconductor Device, Ltd.)vacuum vessel
feed-through terminals

composition of contacts: #16×24
conductors

inner-vessel
permanent terminal board(manufactured by
Japan Deutsches co.)plugs (manufactured by
Japan Deutsches co.)
AFD56-16-26SN-043
model: AFD56-16-26SN-043
channel No.

C1～C42熱電対用
C1 ~ C42
for thermocouples
D1～D5
カロリーメータ用
D1 ~ D5for calorimeters
sparesN2N2予備composition of contacts: #20×26
conductors

Figure 3-7 WBD Diagram of Thermocouples/Calorimeters for TS, and Thermocouple Spare Lines

37

This may not be the latest edition.

channel No.
plugs (manufactured by JAE)
model: MS3106B18-1S
external input terminal board(manufactured by JAE)

vacuum vessel
feed-through terminals
composition of contacts: #16×10
conductors

inner-vessel
permanent terminal board

for thermistors,
platinum sensors

plugs (manufactured by JAE)
model: MS3106B18-1S
channel No.

E1 ~ E13(DC100V 1A)

Figure 3-8 WBD Diagram of Temperature Sensors for TS

38

This may not be the latest edition.

data acquisition andconversion board

vacuum vessel
feed-through terminals

inner-vessel
permanent terminal board
composition of contacts: #16×10
conductors

plugs (manufactured by JAE)
model: MS3106B18-1S
channel No.

for SBG

Pt – Co thermometric resistor (4 wire system)

Figure 3-9 WBD Diagram of SBG Temperature Measurement

39

G1 ~ G3

This may not be the latest edition.

channel No.
plugs (manufactured by DDK)
model: MS3106B32-17S

external input terminal board(manufactured by DDK)

vacuum vessel
feed-through terminals

composition of contacts: #4×4
conductors

inner-vessel
permanent terminal board(manufactured by DDK)

plugs (manufactured by DDK)
model: MS3106B3218-17S
channel No.

for 2 kWpower supplies
2kW電源用H1~ H15
H1～H15(DC100V
30A)(DC100V 20A)

Figure 3-10 WBD Diagram of 2 kW IR Power Supply Rack

40

This may not be the latest edition.

channel No.
plugs (manufactured by JAE)
model: MS3106B18-1S
external input terminal board(manufactured by JAE)

vacuum vessel
feed-through terminals

composition of contacts: #16×10
conductors

inner-vessel
permanent terminal board(manufactured by JAE)

for 60 W power supplies

plugs (manufactured by JAE)
model: MS3106B18-1S
channel No.

J1 ~ J6(DC100V 3A)

Figure 3-11 WBD Diagram of 60W IR Power Supply Rack

41

This may not be the latest edition.

name plate

RF coaxial (SMA)
Hitachi Power
Semiconductor Device,
Ltd.

Hitachi Power Semiconductor
Device, Ltd.

note

No. name of parts
hermetic seal
flangeplug (attachment)material

total
numbernote

Huber + Suhner 11SMA-50-3-14

Figure 3-12 Feed-through Terminal for Coaxial Cables of TS

42This may not be the latest edition.

SBG Temperature
Measurement

TS Signals

TS
Temperature Measurement(thermistors, platinum sensors)

Spare
Thermocouples Calorimeter

Inner-Vessel Permanent Terminal Board - IITS
Thermocouple

Inner-Vessel Permanent Terminal Board - I
Mounting Positions of Permanent Terminal Boards

IR Power Supply (100V 30A)TS
Grounding

IR Power Supply (100V 3A)

TS EP

Inner-Vessel Permanent Terminal Board I
Inner-Vessel Permanent Terminal Board II
Inner-Vessel Permanent Terminal Board III

Note1) The hatched parts are used by the facility.
Note2) The connection positions for shield earth are shown below.

TS signal lines: J pins at E13 and G3
TS thermocouple lines: Z pins at C14, C28, C42
calorimeters and thermocouple spare lines: Z pin at N2

Inner-Vessel Permanent Terminal Board - III

Figure 3-13 Inner-vessel Permanent Terminal Boards – I, II, III

43

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External Input Terminal Board - I

TS EP (10A)

TS EP (10A)
IR power supply (100V 30A)
IR power supply (100V 3A)
TS grounding

Nitto Electric Works, Ltd.

TS signals (5A)
External Input Terminal Board - II
TS signals (5A)
TS thermocouple
calorimeter

Nitto Electric Works, Ltd. Nitto Electric Works, Ltd.

TS temperature measurement(thermistors, platinum sensors)spare thermocouples
TS temperature meas urement(thermis tor, platinum s ens or)

IR power supply(100V 30A)TS
thermocoupless parethermocouples calorimeter

TS IR power supply
grounding (100V 3A)

External Input Terminal Board - IIExternal Input Terminal Board - INote) The hatched parts are used by the facility.

Data Acquisition System Board
External Input Terminal Board - IIExternal Input Terminal Board - I

duct

Inner-Vessel Permanent Terminal Board - II
Inner-Vessel Permanent Terminal Board - I

Inner-Vessel Permanent Terminal Board - III

Figure 3-14 External Input Terminal Boards – I, II

44This may not be the latest edition.

d

c

a

b

(width of slot)

total number

No.

name of parts

materialasocketcopper (gold plating)b

socketconstantancspringberyllium copper(gold plating)

d

ring

synthetic resins

item #1 item #2

Figure 3-15 Thermocouple Socket Contact (manufactured by Hitachi Power Semiconductor Device, Ltd.)

45

This may not be the latest edition.

3.3.1.3. Details of Hard Ports
There are hard ports as shown in Table 3-3 inside the vacuum vessel. Refer to Figure 3-16 for the hard ports(1) ~ (3) in the Table.

Table 3-3 Table of Hard Ports
No.
(1)
(2)
(3)

location
TS supporting benchsupporting bench with cooling panel
body shroud

qty
45
15
64

(4)
(5)
(6)
(7)

upper part of vacuum vessel
upper part of vacuum vesselon optical bench
on work floor

2
11bolt size＊1 usage, etc.
M20
helisert insert attachedM20
helisert insert attached
M12

M16

support for SBG
for optical bench maintenance＊2
guide for carrying in supporting bench＊3＊4*1

Bolts are to be prepared by users.

*2

Even though “optical bench maintenance” is shown here as the nominal usage, the usage is not restricted
and is at users’ choice.

*3

While these screw holes are used for mounting the guide for carrying in a TS supporting bench, they canbe used as hard ports otherwise.

*4

By arranging attachment jigs, the rails on the work floor can be used.

The load capacities of the hard ports are shown below.
(1) TS supporting benches with and without cooling panel
Refer to Table 3-4 and Figure 3-17.

Table 3-4 Load Capacities of Hard Ports
No. sign
name(1) Fccompressive load
(2)

Ft

tensile load

(3)
(4)
(5)
(6)

Fx
Fy
Mx
My

X-direction load in horizontal plane
Y-direction load in horizontal plane
X-direction moment
Y-direction momentload capacity*2
37262.80 N(for vertical load)
43146.4 kg(for vertical load)
23534.4 N*1
23534.4 N*1
1618 N･m
98.06 N･m

It denotes the load capacity for shearing, but does not guarantee the prevention of lateral slippage.
It denotes the load capacity for the TS supporting benches with and without a cooling panel, obtained
based on safety factor f = 3.

46

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TS supporting bench w/ cooling panelrails

TS supporting bench w/o cooling panel

depth

cover plate for part A

cover plate for part C

depth
note

drilled holecover plate for part B

drilled hole

Figure 3-16 Configuration of Hard Ports

47

The dimensions with ※ show those along the shroud.

This may not be the latest edition.

M20 bolt

Figure 3-17 Load Capacity of Supporting Benches with and without Cooling Panel(2) Body shroud
Refer to Table 3-5 and Figure 3-18.

Table 3-5 Load Capacity of Body Shroud Hard Ports
No. sign
(1)

Ft

(2)

Fs

(3)

M

name

load capacity

tensile load588.36N (for vertical load; the total weight per one shroud is to be under 600 kg.)shearing

294.18N (in the perpendicular direction to the axis; the total weight per one shroud

load

is to be under 600 kg.)

moment7.85 N・m (no more than 8 hard points are to be used per one shroud.)

Figure 3-18 Load Capacity of Body Shroud Hard Port
(3) Upper part of vacuum vessel (support for SBG) … Refer to Figure 3-30 and section 3.3.2.1.
200 kg/ hard port (for vertical load)(4) Upper part of vacuum vessel (for optical bench maintenance)
Even though these hard ports are for “optical bench maintenance”, the usage is not restricted and is at
users’ choice as long as the method below is followed.
These hard ports are attached to the upper side of the vacuum vessel and cannot be used as they are. As
shown in Figure 3-19, they require a rod to be inserted whose user-side mounting section is extended into
the shroud, and users are to place a necessary mounting seat at the end of it.

48

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from the center 1700

vacuum vessel
hard port
shield platerodshroudmounting seat
Figure 3-19 Schematic View of Hard Port for Optical Bench Maintenance
Pay attention to the following matters when inserting a rod.
(a) Load capacity of hard port: 4,500 kg (for vertical load)(b) Opening dimensions of the shroud: 180 × 180
That is, the maximum dimensions of the rod are to be manufactured the way they do not exceed
the limit of enabling it to go through the feed-through hole. Furthermore, there may be manufacture
errors between the vacuum vessel and the shroud, and therefore a rod is to be manufactured with its
shroud-feed-through part in as minimized dimensions as possible.
(c) Rod configuration: Be sure to place a mounting seat at the end of a rod to prevent seizure at the threadpart when bending load acts on the rod; that way, the thread part can be protected from the direct impact
of bending load.
(d) Prevention of seizure: The hard ports being SUS 304 products, a rod made of stainless steel requires
caution not to cause seizure at the thread parts. When using a seizure-preventing agent, make sure tochoose one that does not have bad influence on a TS or the vacuum vessel with its outgas, etc.
(5) On optical bench
Refer to Table 3-6.

Table 3-6 Load Capacity of Hard Ports on Optical Bench
No. sign

nameload capacity

(1)

Ft

tensile load 13728.4N (vertical direction)(2)

M

moment23.53 N・m

49

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(6) Notes
As mentioned in section 2.2.6, the chamber foundations are isolated from the seismic slab which has
an optical bench mounted upon it. When performing an optical property confirmation test that takes accountof micro vibration, make sure to prevent the vibration from the vacuum vessel not to be transmitted via
hard ports. (ex. by tying the tie-wrap that fixes a TS to the body shroud.)

3.3.1.4. Thermal I/F on TS Supporting Bench(1) Supporting bench without cooling panel
The TS supporting bench without a cooling panel cannot be cooled because it is not equipped with an
LN2 circulating structure. Meanwhile, the bench has heaters attached to it, which heat the bench during atest. In other words, it is the balance between cooling by radiation cooling and heating with the heaters that
determines the temperature of the bench. Keep that point in mind when using the TS supporting benchwithout a cooling panel.
(2) Supporting bench with cooling panel
The TS supporting bench with a cooling panel can be deliberately cooled with its attached panel throughwhich LN2 circulates. The hard ports where a TS or a jig is mounted are thermally insulated from the parts
where LN2 runs through. That is, the hard ports are cooled only by radiation cooling. Meanwhile, the bench
is heated by a heater as with the supporting bench without a cooling panel. Therefore, enough level of heatinsulation is necessary when mounting a TS or a jig.

3.3.1.5. TS Cooling/Heating I/F(1) General description
When a jig is manufactured for controlling temperature from the TS side, there are flanges available inthe vacuum vessel that supply LN2 and GN2 for partially cooling and heating a TS, respectively. Refer toFigure 3-20 regarding to ports for TSs. Some of those flanges are for cooling the work floor and others are
dedicated for a supporting bench with a cooling panel (cf. Table 3-7.)

Table 3-7 List of TS LN2 Lines
No. line No.

location application purpose(1)

LN-3145-20-3HV body

cooling work floor / TS(2)

LN-3146-20-3HV headcooling work floor(3)

LN-3147-20-3HV headcooling TS(4)

LN-3148-20-3HV body

cooling TS(5)

LN-3149-20-3HV body

cooling TS

50This may not be the latest edition.

Table 3-8 General Description of TS Cooling/Heating I/F
LN2 line for partial cooling of TS

GN2 line for partial heating of TS

・20A × 5 lines

・150A × 3 lines

・N-32 nozzle (cf. Figure 3-20)

・N-24 nozzle (Figure 3-20)

CASE.1shroud on supporting bench lower plane being not used (4 lines are available for supply temperature: normal temperature

the TS side)~ 60℃

head (2 lines): for work floor – 1 line

body (3 lines):
CASE.2

supply pressure: 0.098 ~ 0.148 MPa

for TS– 1 line

for TS– 3 lines

shroud on supporting bench lower plane being cooled (3 lines are available fortest t item side)
head (2 lines): for work floor / shroud on lower plane of supporting bench – 1 line
for TS – 1 line
body (3 lines): for work floor / shroud on lower plane of supporting bench – 1 line
for TS – 2 lines(2) Feed rate of LN2 and GN2(a) The supply conditions of the LN2 supply line are shown in Table 3-9 below.

Table 3-9 Rough Levels of LN2 Feed Rate and Valve Opening Percentage
feed rate (Nm3/h)

50 60 70

valve opening percentage (%) 24 27 31

The gasification rate is 35%, and the supply pressure is about 0.098 ~ 0.148 MPa.
(b) As for the GN2 supply line, the feed rate is 30 Nm3/h and the supply pressure is about 0.098 ~ 0.158
MPa for the valve opening percentage of 46%.
(3) LN2 supply ports
The LN2 supply ports are connected via Grayloc Connectors (cf. Figure 3-21, tightening torque 260
kg･cm.) Users are to pay attention to the following matters when laying pipes via the Grayloc Connectors
by themselves. (The same cautions are required when laying SBG systems explained in section 3.3.2.1.)(a) The hubs and seal rings shown in Figure 3-21 are to be prepared by users.
(b) Since it normally takes 3 months to have the hubs of Grayloc Connectors procured (seal rings also takelong for procurement), users are to confirm with the manufacturer (NIKKISO CO., LTD.) for the
procurement lead time when they plan the manufacturing process for laying pipes.

51

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(4) GN2 supply ports for heating TS
There are three GN2 supply ports for heating a TS in this facility with their inlets at the chamber headand outlets on the body (cf. Figure 3-20.) The ports have a 150A special VG flange that adopts a metal
tubal O ring. Therefore, users are to pay attention to the following matters when laying pipes by themselves.
(a) The metal tubal O rings (cf. Figure 3-20) and connection pipes are to be prepared by users.
(b) Since it normally takes one month to have metal tubal O rings delivered, it is recommended that they
be ready beforehand. Also, refer to Figure 3-22 which depicts how the flanges of GN2 nozzles are
manufactured, when planning for laying pipes.

52

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N-24 TS heating GN2 entrance
N-35 TS heating GN2 exit
dim ensions of 24, N-35
connector for supply port
flangeO ring used for N-24, N-35
m aterial: SUS321 (Ag)m anufacturer: Nippon Valqua Indu stries, Lt d.

thicknessexternal input term inal board (1)external input terminal board (2)inner-vessel
perm anent term inal board (2)(prepared by users)
clam p(LN2 entrance for cooling work floor)
clam p(LN2 entrance for TS)

inner-vessel
perm anent term inal board (1)clam p(LN2 exit for cooling work floor)

inner-vessel
perm anent term inal boards

clam p(LN2 exit for TS)

nozzle for feed-through term inal

TS supporting bench
clam p(He exit)

inner-vessel work floor
shield plateclamp(He entrance)
inner-vessel
perm anent term inal board (3)cable rack
hard port m ount position

for facility, SBG temperature (incl. TQCM)
clam p(LN2 entrance for cooling work floor)

for facility & shroud temperature measurement
GN2 exit

for heating TS

clamp

for partial cooling of TS (IR gauge)

LN2 exit

clamp

for partial cooling of TS (IR gauge)

LN2 entrance

GN2 exit

for heating TS

GN2 entrance

for heating TS

current inlet terminal

for analyzing vibrationclamp

He pipingHe exitclamp

He pipingHe entrance

clamp(LN2 exit for cooling work floor)
clamp(LN2 entrance for TS)
clam p(LN2 entrance for TS)
clam p(LN2 exit for TS)
clam p(LN2 exit for TS)

spare nozzles
current inlet terminal (200V 10A)

for TS EP

for waveguides

nozzles only

high frequency output signals (coaxial)
current inlet terminal (100V 5A)

for TS signals

current inlet terminal

for IR power supplies

for CC therm ocouples (incl. calorim eters, spares) for TS thermocouples

sign

nom inal φ quantity

formatnamenote

Figure 3-20 System Diagram of Ports for TS

53

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Figure 3-21 Diagram of Grayloc Connector for LN2

54

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carved seal

Figure 3-22 Diagram of Supply Port Flange for GN2

55

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3.3.1.6. I/F on TS Installation Device
A typical procedure of carrying in a TS into the vacuum vessel is shown in Figure 3-23. The operation of theinstallation device is basically executed by the facility side.
The assemble work for a TS is performed on the TS installation dolly.
The maximum load capacities on the moving dolly and the TS installation dolly are presented in section 2.2.2.
Their load capacities vary when the CG of a loaded item deviates from their centers. Therefore, the CG of aloaded item is to be aligned as close as possible to the center of the TS installation dolly. In case the total weightof a TS and a jig exceeds 2,000 kg while their CGs deviate from the center of the TS installation dolly, contact thefacility operation company in advance.

3.3.1.7. Optical Window and Alignment Window
There are three sets of optical window mounting flanges and nineteen sets of alignment windows installed in
the vacuum vessel. For their mounting I/F positions, refer to Figure 3-3.
(1) Optical window flange
The structure of an optical window flange is shown in Figure 3-24. Users are to prepare optical glassand flanges referring to this Figure when using the optical window. The surface roughness on the contact
face to the facility-side flange is to be 50 μm or less. An optical window flange has an adjustment
mechanism which allows the controlling of the slant that can be up to 5.067 × 10-4 rad after vacuumingin the vacuum vessel down to 1 minute (2.9 × 10-4 rad.) The facility possesses an optical window andmounting flanges that used to be applied in the old radiometer space chamber. Their specifications anddrawings are shown in Figure 3-25.
(2) Alignment window
There are alignment windows for the purpose of alignment measurement on a TS. Besides thepermanently-equipped alignment window glass which is made of tempered glass, there are eight (4concentric-type and another 4 eccentric-type) alignment windows (φ96) made of glass (BK7) with a highlyaccurate transmission wave front, which can replace the permanently-equipped alignment window prior to
the execution of a test to satisfy test requirements. Moreover, a theodolite and an ITV device (portable)
shown in section 2.2.8 can be set on the alignment window.
When removing the tempered glass from the alignment window, lay air packing, etc., by way of caution
to prevent damage on the tempered glass in case it is dropped.
The heights from the TS supporting bench to the optical window and to the center of the alignment
window are shown in Figure 3-26.

56

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vacuum vessel
inner-vessel work floor
TS

The TS supporting bench is carried inwhile being jacked up by 50 mm.
travelling guide rails for TS installation dolly

TS supporting bench
optical bench
TS installation dolly

linear slide

vacuum vessel flange
air jack
stroke 50 mm
After the TS supporting bench is installed in thevacuum vessel, it is carried out of there with its air
jack being jacked down.

The linear slide is moved to thevacuum vessel flange.

TSTS supporting benchaccess door

Figure 3-23 Procedure of TS Installation

57

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Figure 3-24 Diagram of Optical Window Mounting Flange58This may not be the latest edition.

note) 1. The accuracy of the transmission wave front on the
φ50 in the effective diameter φ96 is within 0.1 μm.
2. The uniformity of material is Δn = 5 × 10-6 or less.

Figure 3-25 Optical Window

59This may not be the latest edition.

permanently-equipped lighting

mist separator

sign

nominalquant format
φ

name
note
vessel straight
optical window vacuum
cy lindrical body
vacuum vessel straight
optical window cylindrical body
vacuum vessel
optical window accessdoor
vacuum vessel straightalignment window cylindrical bodypart of opticalalignment window upper
window
vacuum vessel straightalignment window cylindrical body
vacuum vessel straightalignment window cylindrical body
upper part of opticalalignment window window
vacuumvessel straightalignment window cy lindricalbodyalignment window vacuum vessel access door
upper part of opticalalignment window window
vacuum vessel accessalignment window door
vessel accessalignment window vacuum
door
vessel accessalignment window vacuum
dooralignment window vacuum vessel ceilingalignment window vacuum vessel ceilingalignment window vacuum vessel ceiling
vessel straightalignment window vacuum
cy lindrical body
vacuum vessel straightalignment window cylindrical body
upper part of man door
alignment window
vessel straightalignment window vacuum
cy lindrical bodyfor waveguides/ vacuum vessel straightalignment window cy lindrical bodyaccess door

operation bench on
outer-wall of vessel

inner-vessel work floor
optical bench
TS supporting bench

about

about

about

(effective test area)
shroudTS supporting bench
about

about

about
about

about

about

inner-vessel work floor

man door

about

about

Figure 3-26 Mounting Positions of Optical Windows

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3.3.1.8. Others (Inner-Vessel Work Floor, Movable Operation Bench, Working Platform)(1) Work floors inside vacuum vessel (cf. Figure 3-27)
The work floors inside the vessel are used for the work to be performed on them after carrying in a TS
into the vacuum vessel. The load capacity of the work floor is 150 kg / piece.
(2) Movable operation bench (cf. Figure 3-28)
There is a movable operation bench for accessing the man door and the optical window. It is available
to users when necessary.
(3) Working platform (cf. Figure 3-29)
There is a working platform for mounting an SBG or accessing the upper part of a TS in the vacuum
vessel. The maximum load mass and usable dimensions are shown below. The assembly and operation of
the platform are to be executed by users.
(a) Max. load mass
① Working platform floor

150 kg② Working platform flip-up floor

100 kg③ Working platform ladder

100 kg(b) Usable dimensions① Max. usable height

3,505 mm

② Storage height

1,705 mm61

work floor size
man door

work floor size
work floor size

from the center of the main body 2150

This may not be the latest edition.

TS supporting bench w/ cooling panel
TS supporting bench with cooling panel
cover plate※ (for TS supporting bench with cooling panel)
cf. figure # 3122-925890

work floor size
ladder(with adjuster)
inner-vessel work floor

from the center of the main body 2150

work floor size※

cover plate※(effective test area)

man door

optical window

inner-vessel work floor
inner-vessel
permanently-equipped
terminal board
ladder(with adjuster)
upper plane of rails

upper plane of work floor

Figure 3-27 Work Floors inside Vacuum Vessel

62

TS supporting bench w/o cooling panel
cover plate※This may not be the latest edition.

Figure 3-28 Movable Operation Bench

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flange sheet surface

working platform in vacuum vessel

Figure 3-29 Working Platform

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3.3.2. Power Supplies for Heat Sources(1) Composition of components
The composition of primary components in the power supplies for heat sources and a system diagramof the holistic system are shown in Table 3-11 and Figure 3-33, respectively. Also, an inter-connection
diagram of power supply racks is shown in Figure 3-34.

Table 3-11 Composition of Primary Components in Power Supplies for Heat Sourcesname of component

model #, etc.

qty(1) controller

HF-W7500 / model 30LX

1(2) setting PC

Endeavor Pro7500

1(3) power supplies for heatnote

qty of power supplies:

sources6mφ 60W power supply rack -1

by AES/ Matsusada Precision Inc.

1 set

25

6mφ 2 kW power supply rack -1 by AES/ Matsusada Precision Inc.

1 set

10

6mφ 2 kW power supply rack -2 by AES/ Matsusada Precision Inc.

1 set

10

6mφ 3 kW power supply rack -1 by AES/ Matsusada Precision Inc.

1 set

10

（「直流安定化電源」
IR power supplies
setting PC

IR power supplies
controller

switching hub

switching hub

temperature
measurement rack

60W

2kW

2kW

3kW

6mφ 60W power supply rack -1

6mφ 2kW power supply rack -1

6mφ 2kW power supply rack -2

6mφ 3kW power supply rack –1(incl. “stabilized DC power
supply” and “PLC”)(incl. “stabilized DC power
supply” and “PLC”)(incl. “stabilized DC power
supply” and “PLC”(incl. “stabilized DC power
supply” and “PLC”)

controlling controller

controlling controller

controlling controller

controlling controller

external input terminal board

heater panel, etc.

vacuum vessel feed-through terminal for EP

temperature
measurement
point

vacuum vessel feed-through terminal for thermocouple

data acquisition system

Figure 3-33 System Diagram of Holistic System

65This may not be the latest edition.

2 kW

2kW電源架-1
power
supply rack- 1
H1

H1

power
supply 1, 2
電源1,２

H2

H2

H2

H2

電源３,４
power
supply 3, 4

H3

H3

H3

H3

電源５,６
power
supply 5, 6

H4

H4

H4

H4

電源７,８
power
supply 7, 8

H5

H5

H5

H5

power
supply 9, 10
電源９,１０

H6

H6

H6

H6

power
supply 1, 2
電源1,２

H7

H7

H7

H7

power
supply 3, 4
電源３,４

H8

H8

H8

H8

power
supply 5, 6
電源５,６

H9

H9

H9

H9

power
supply 7, 8
電源７,８

H10

H10

H10

H10

H11

H11

H11

H11

H12

H-12

H13

H13

H13

H13

電源５,６
power
supply 5, 6

H14

H14

H14

H14

電源７,８
power
supply 7, 8

H15

H15

H15

H15

電源９,１０power
supply 9, 10

J1

J2

J2

J3

J3

J4

J4

J5

J5

V 3A)
supply 100３Ａ）(power（電源１００Ｖ

J1（電源１００Ｖ
V 3A)
supply 100３Ａ）(power

設備で使用
used
by facility

V 30A)
supply 100３０Ａ）(power（電源１００Ｖ

H1（電源１００Ｖ
V 30A)
supply 100３０Ａ）(powerH1

usedby facility
設備で使用

v

2 kW

2kW電源架-2
power
supply rack - 2
power
supply 1, 2
電源1,２
power
supply 3, 4
電源３,４

60 W
60W電源架power supply rack

J1

J1

J2

J2

J3

J3

J4

J4

J5

J5

Figure 3-34 System Diagram of Power Supply Racks for IR Heaters

66

3 kW

3kW電源架-1
power
supply rack - 1

power
supply 9, 10
電源９,１０This may not be the latest edition.

3.3.3. Control Mode
3.3.3.1. Control System(1) Control system of this power supply rack
The control system of power supply racks is shown in the following Table 3-12.

Table 3-12 Control System of Power Supply Rack
based on temperature at one point
based on averaged temperature
among multiple points
PID control (=temperature control)
temperature control in broad definition

based on temperature difference at
one point
based on averaged temperature

controldifference among multiple points
ON/OFF control
constant power control

with load resistance value input
without load resistance value input

manual voltage output control
local control(2) Grouping of multiple power supplies
Power supplies can be grouped for simultaneous operation. The grouping is possible only for the power
supplies on the same rack. The grouping of power supplies for simultaneous controlling can only be applied
to PID control and ON/OFF control.

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3.3.3.2. Temperature Control
PID control denotes the controlling of temperature by using the PID commands sent from a PLC. The control
methods and descriptions of PID control are shown in Table 3-13 below:

Table 3-13 Control Methods and Descriptions of PID Control (1/2)
controlbased ontemperature
at one point

number ofcontrolled
channels
1 temperaturetarget point(s) oftemperature control

brief description of controlling－

The temperature of 1 temperature channel iscontrolled to be as designated.

－

The average temperature of multiple
temperature channels is controlled to be as
designated.

channelbased onaveragedtemperature
among
multipleMax of 10
temperaturechannelspoints1 temperature channel

1
power
based ontemperature
difference at
one point

supply1 temperaturechannelpower
supplygroup

control power
supply basedon temperature
at one point
control power
supply basedon averaged
temperature
among
multiple points
control basedon temperature
at one point
control basedon averaged
temperature
among
multiple points

68

The temperature of 1 temperature channel iscontrolled to be at a constant difference from thetemperature of a reference control temperaturechannel.
The temperature of 1 temperature channel iscontrolled to be at a constant difference from thetemperature of a temperature channel of thereference control power supply.
The temperature of 1 temperature channel iscontrolled to be at a constant difference from theaverage temperature of multiple temperaturechannels of the reference control power supply.
The temperature of 1 temperature channel iscontrolled to be at a constant difference from thetemperature of a temperature channel designatedby the reference control power supply group.
The temperature of 1 temperature channel iscontrolled to be at a constant difference from theaverage temperature of multiple temperaturechannels designated by the reference control
power supply group.

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Table 3-13 Control Methods and Descriptions of PID Control (2/2)
control

number ofcontrolled
channelstarget point(s) oftemperature control

1 temperature channel

1based onaveragedtemperature
differenceamongmultiplepointspower
supplyMax of 10
temperaturechannels

control power
supply basedon temperature
at one point
control power
supply basedon averaged
temperature
among
multiple points
control basedon temperature
at one point

power
supplygroup

control basedon averaged
temperature
among
multiple points

brief description of controlling
The average temperature of multiple
temperature channels is controlled to be at aconstant difference from the temperature of areference control temperature channel.
The average temperature of multiple
temperature channels is controlled to be at aconstant difference from the temperature of atemperature channel of the reference control
power supply.
The average temperature of multiple
temperature channels is controlled to be at aconstant difference from the averagetemperature of multiple temperature channels of
the reference control power supply.
The average temperature of multiple
temperature channels is controlled to be at aconstant difference from the temperature of atemperature channel designated by the reference
control power supply group.
The average temperature of multiple
temperature channels is controlled to be at aconstant difference from the averagetemperature of multiple temperature channels
designated by the reference control power
supply group.

3.3.3.3. ON/OFF Control
The definition of on/off control is that temperature is controlled with the voltage output of a power supply
turned off when the upper temperature limit is exceeded, and turned on when the lower temperature limit isexceeded.
For this control method, the preset ON/OFF control voltage is applied as the output voltage (ON/OFF control
voltage ≦ voltage load tolerance.) On/off temperature control can only be achieved in controlling based on
temperature at one point.

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3.3.3.4. Constant Power Control
The constant power control function is based on the control methods as follows. Controlling is executed every
10 seconds.
(1) With input of load resistance value
Constant power control (with load resistance value input) denotes current control which keeps thetheoretical current calculated from the specified power and load resistance levels. The basic idea is that aheater generates the specified power when theoretical current is applied to the heater. (Here, the variationof heater load resistance is not taken into account.) Based on the theory, the control current value to generate
the target EP at the heater is calculated. Then, the calculated current/voltage values are transmitted to thepower supply via LAN.
The EP of measurement data is obtained by the following equation.
EP (P) = I2 × R [current × current × resistance](2) Without input of load resistance value
For constant power control (without load resistance input), initial current is applied to a circuit to obtainits resistance, from which to derive the current level required to achieve the constant control on the target
output power (output voltage × output current) of a power supply, which is executed via feedback control.
The circuit resistance is updated every 10 seconds for correction.
To be precise, the current levels at the forementioned process are varied in stages, during which theoutput voltage of a power supply is measured. Then the approximate circuit resistance is derived from theoutput voltage/current of the power supply, using which the output power from the power supply iscontrolled to achieve the target EP.
That is, a power supply is controlled the way its output EP, which is calculated from the output
current/voltage of the power supply, achieves the preset target EP. The power supply is used in a constantcurrent mode to ease the influence of the variation in load resistance. The output current/voltage from a
power supply are obtained via LAN, to which then feedback controlling is applied.

3.3.3.5. Manual Voltage Output Control
Via the manual voltage output control function, voltage arbitrarily set by users can be output. To be precise, apower supply can be controlled the way the voltage preset in the “setting PC” or the “controller” can be output.

70This may not be the latest edition.

3.3.3.6. Local Control
When local control is designated for a power supply from the setting screen, the corresponding power supply
can be locally operated on its own (by turning its current/voltage output knob.)
The power supplies for local controlling designated by the setting screen can also measure voltage/current
output, which is sent to PC and recorded thereat, as in other controlling methods.
Local controlling is also applicable to the 60W power supplies pre-installed in the 6mφ chamber, as one of thecontrolling types they can deal with.
Local controlling is possible even when the “setting PC” and the “controller” are not in operation (data cannot
be recorded in that case.)

3.3.4. Limit Function
The limit function can be classified into the three control operations as follows according to the detected
items.
(1) Alert
When the limit that does not require the immediate stop of controlling is chosen to be applied,controlling is sustained while displaying an alert and outputting a PC alarm. It is up to users then whether
or not to change control conditions or to take other countermeasures.
(2) Survival mode
When all the target temperature levels to be controlled turn out to be abnormal, temperature controllingis judged as not continuable. When temperature control is stopped, an immediate temperature drop of a TS
is avoided by maintaining the heater output only to the ratio [%] preset as the control output for the survival
mode case to that at the point of abnormality detection. (The percentage of sustained output is determinedbased on the output at the point when abnormal temperature output takes place.) Then, an alert shows up
on the display while PC/power supply rack alarms go off.
(3) Control abort
Control is stopped when it cannot be sustained due to the abnormality of hardware. Then, an alert shows
up on the display, while PC/power supply rack alarms go off and the stop/abnormality lamp turns on.
Tables 3-14 (1/3)(2/3)(3/3) show the items to be detected by the limit function, immediate control reactions,and the control methods in which the corresponding failures are prone to take place. Alerts are output to thesetting PC and power supply racks. Table 3-15 shows the actions of alert for individual detected phenomena.

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Table 3-14 Table of Limit Functions (1/3)
PID control
based onbased ondetected item

content

controlbased onreaction

temperature
at one point

averagedbased ontemperaturetemperature

among

difference atmultipleone point

pointsControl temperature exceeded the preset temperature(1)

preset temperature

upper limit.

limit

Control temperature exceeded the preset temperature
lower limit.
Average control temperature exceeded the average(2)average temperaturetemperature upper limit.

limit

Average control temperature exceeded the averagetemperature lower limit.
Control temperature difference exceeded the preset(3)

temperature

upper limit.

difference limit

Control temperature difference exceeded the preset
lower limit.
Control temperature difference exceeded the preset(4)

average temperature

upper limit.

difference limit

Control temperature difference exceeded the preset
lower limit.

temperature(5)

overchange
abnormality

Temperature change of over 10℃ in 10 secs wasobserved in control temperature.

averagedtemperature

ON/OFF

difference

controlamongmultiplepoints

alert

○

○

alert

○

○

alert

○

alert

○

alert

○

alert

○

alert

○

alert

○

alert

Temperature change of over 10℃ in 10 secs was

survival

observed for 30 secs in control temperature.

mode

72

○

○

○

○

○

○

○

○

○

○

constant
power
controlmanualvoltage
outputcontrolThis may not be the latest edition.

Table 3-14 Table of Limit Functions (2/3)
PID control
based onbased ondetected item

content

controlbased onreaction

temperature
at one point

averagedbased ontemperaturetemperature

among

difference atmultipleone point

pointsaveragedtemperature

ON/OFF

difference

controlamongconstant
power
controlmanualvoltage
outputcontrolmultiplepointsAbout all the target temperatures to be controlled;(6)

temperature data
abnormality

・Temperature data cannot be acquired for 1 minute.
・Measurement failure due to wire breakage ofthermocouple, for example, took place in temperaturesurvival
mode

○

○

○

○

○

data.
(7)

preset EP upper limit

Control EP exceeded the preset EP upper limit.

○

alert

EP load tolerance was exceeded, the excess being 1%(8)output EP upper
limit

or more to less than 5% of Max. power supply output

alert

○

○

○

○

○

○

○

control abort

○

○

○

○

○

○

○

alert

○

○

○

○

○

○

○

control abort

○

○

○

○

○

○

○

alert

○

○

○

○

○

○

○

control abort

○

○

○

○

○

○

○

EP.
EP load tolerance was exceeded, the excess being 5%
or more of Max. power supply output EP.
Voltage load tolerance was exceeded, the excess
being 1% or more to less than 5% of Max. power(9)

output voltage uppersupply output voltage.

limit

Voltage load tolerance was exceeded, the excess
being 5% or more of Max. power supply output
voltage.
Current load tolerance was exceeded, the excess
being 1% or more to less than 5% of Max. power(10)

output current uppersupply output current.

limit

Current load tolerance was exceeded, the excess
being 5% or more of Max. power supply output
current.

73

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Table 3-14 Table of Limit Functions (3/3)
PID control
based onbased ondetected item

content

controlbased onreaction

temperature
at one point

averagedbased ontemperaturetemperature

among

difference atmultipleone point

points(11)

power supply

Abnormal data was received in STS command fromabnormality

power supply.

communication(12)

failure of power

Communication failure took place.

supplyaveragedtemperature

ON/OFF

difference

controlamongconstant
power
controlmanualvoltage
outputcontrolmultiplepoints

○

○

○

○

○

○

○

○

○

○

○

○

○

○

control abort

○

○

○

○

○

○

○

control abort

○

○

○

○

○

○

○

○

○

○

○

○

○

○

○

○

○

○

○

control abort
outputmaintained

When control input ≧ 2% of Max. output current(13)

heater wire breakage

AND current level ＜ 0.4% of Max. output current

abnormality

in current control (temperature/constant EP control),heater wire breakage abnormality is determined.

(14)

abnormal data from

Measurement failure took place due to abnormality inpower supply

data from power supply.
Abnormality took place during PID control.

(15)

PLC abnormality

Abnormal response from PLC was received.
Communication failure took place.

(16)
(17)

power failure
detection
overcurrent detection

survival
mode
survival
mode
survival
modePower failure or dropping of breaker took place.

control abort

○

○

○

○

○

○

○

Overcurrent was supplied to power supply.

control abort

○

○

○

○

○

○

○

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Table 3-15 Contents of Alert for Each Detection Item (1/2)
detected item

(1)

(2)

(3)

(4)

control

content

reactionsetting
screenlog message

power supply rackalarm

abnormality

soundlamp (red)preset temperature

Control temperature exceeded the preset temperature upper limit.

alert

light fault

alert

○

limit

Control temperature exceeded the preset temperature lower limit.

alert

light fault

alert

○

average

Average control temperature exceeded the average temperature upper limit.

alert

alert

○

Average control temperature exceeded the average temperature lower limit.

alert

light fault

alert

○

temperature

Control temperature difference exceeded the preset upper limit.

alert

light fault

alert

○

difference limit

Control temperature difference exceeded the preset lower limit.

alert

light fault

alert

○

average

Control temperature difference exceeded the preset upper limit.

alert

light fault

alert

○

Control temperature difference exceeded the preset lower limit.

alert

alert

○

alert

○

abnormality○

abnormality

○

alert

○

alert

○

abnormality○

temperature limit

temperature
difference limit

Temperature change of over 10℃ in 10 secs was observed in control
temperature(5)

setting PC

overchange
abnormality

temperature.

light fault

light fault
light fault

alert

Temperature change of over 10℃ in 10 secs was observed for 30 secs in control

survival

heavy

temperature.

mode

fault

buzzer

About all the target temperatures to be controlled;(6)

temperature data

・Temperature data cannot be acquired for 1 minute.

survival

heavy

abnormality

・Measurement failure due to wire breakage of thermocouple, for example,

mode

fault

took place in temperature data.
(7)

preset EP upper
limit

Control EP exceeded the preset EP upper limit.

alert

EP load tolerance was exceeded, the excess being 1% or more to less than 5%(8)output EP upperof Max. power supply output EP.

limit

EP load tolerance was exceeded, the excess being 5% or more of Max. power
supply output EP.

75

light fault
light fault

alert

control abort

heavy
fault

△

△

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Table 3-15 Contents of Alert for Each Detection Item (2/2)
detected item

control

content

reaction

Voltage load tolerance was exceeded, the excess being 1% or more to less than
(9)

output voltage

5% of Max. power supply output voltage.

upper limit

Voltage load tolerance was exceeded, the excess being 5% or more of Max. power
supply output voltage.
Current load tolerance was exceeded, the excess being 1% or more to less than

(10)

output current

5% of Max. power supply output current.

upper limit

Current load tolerance was exceeded, the excess being 5% or more of Max.
power supply output current.

(11)

power supply
abnormality

Abnormal data was received in STS command from power supply.

failure of power

Communication failure took place.

supply(13)(14)

heater wire

When control input ≧ 2% of Max. output current AND current level ＜breakage

0.4% of Max. output current in current control (temperature/constant EP

abnormality

control), heater wire breakage abnormality is determined.

abnormal data frompower supply

Measurement failure took place due to abnormality in data from power supply.

Abnormality took place during PID control.

(15)

PLC abnormality

Abnormal response from PLC was received.

Communication failure took place.

setting
screenlog message

light fault
alert

control abort

heavy
fault

control abort

heavy
fault
heavy
fault

outputheavy

maintained

fault

control abort

control abort

heavy
fault
heavy
fault

survival

heavy

mode

fault

survival

heavy

mode

fault

survival

heavy

mode

fault

power supply rackalarm

abnormality

soundlamp (red)

alert

○

abnormality

○

alert

○

abnormality

△

○

△

△

abnormality

○

△

△

abnormality

○

△

△

abnormality

○

△

△

abnormality

○

△

△

abnormality○

abnormality○

abnormality○* △ denotes that the abnormality lamps and buzzers are turned on only on the power supply racks that contain abnormality-detected power supplies.

76

buzzer△light fault
alert

control abortcommunication(12)

setting PC

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3.3.5. Vibration Control System
Among the work concerning the vibration control system, the preparatory work and operation of a vibration
analyzer are to be executed by users. For using a vibration analyzer, users are to install accelerometers and cables,and set the analyzer itself by themselves. The points to be taken into account and cautions for the preparation andoperation of a vibration analyzer are shown below. Ask the operation company of the facility for more details.
(1) Accelerometers for different usage purposes
As Table 2-8 shows, there are three kinds of accelerometers prepared in this system for different usage
purposes according to resolution, applied temperature range, etc. The installation sites where they are used
are mostly assumed as below.
(a) 393M33: inside vacuum vessel (shroud, supporting bench with cooling panel, vacuum vessel, optical
window)(b) 393B12: inside vacuum vessel (optical bench, TS supporting bench)(c) 393B31: seismic slab
Those accelerometers are not restricted to the locations shown above; 393B31, for example, can bemounted on the TS supporting bench in the vacuum vessel, as long as thermal insulation measures weretaken by protecting it with insulating materials, etc. (That way, it is applicable in vacuum.)(2) Accelerometer I/F(a) Cable connecting I/F
As you can see from Figure 2-11, the cable connection I/F inside and outside the vacuum vessel
are different from each other. Inside the vacuum vessel, accelerometers are connected to the MIL
connectors at the end of the low noise cables stored in the cutouts on the vacuum vessel body shroud.
Outside the vessel, e. g., on the seismic slab, meanwhile, they are connected to the relay box in thelower pit of the vacuum vessel via twisted wire cables. The wiring from the relay box to the vibration
analyzer is completed in advance. Accelerometers are designated to be assigned to the channels 1 ~ 15
for installation inside the vacuum vessel and to the channels 16 ~ 30 for installation outside the vessel.
As for the former group of channels, the wiring between the inner-vessel MIL connectors and the relay
box is completed in advance.
(b) I/F for installation
The general description of the I/F for installation is provided as follows.
In case there is not enough number of purpose-made plates mentioned below, users are to prepare
them. Accelerometers can be fixed not only to the pre-designated places but anywhere using kapton
tape, etc.
① Seismic slab
The seismic slab has screw holes for fixing an I/F on it for mounting accelerometers. That I/F
is to be made for the specific purpose.
② Optical bench
Mount a purpose-made plate on the optical bench as the I/F, using the screw holes on it for
mounting a TS supporting bench guide.

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③ TS supporting bench
Mount a purpose-made plate on the TS supporting bench as the I/F using the hard ports on it.
④ Shroud
There are purpose-made mounting points near the man door on the body part.
⑤ Vacuum vessel
There are purpose-made mounting points near the manhole at the bottom of the vacuum vessel.
⑥ Optical window
There are purpose-made mounting points on three places at the bottom of the optical window.
(3) Cautions for executing analysis
Acceleration data can be obtained for three minutes at the sampling frequency of 800Hz due to therestriction of the hard disc capacity. Choose “monitor mode” (ask the operation company of the facility fordetails) when long-term monitoring is desired.
(4) Data transfer
The acceleration/displacement data acquired by the vibration analyzer and the FFT results obtained bypost-processing those data are saved in the work station in binary format. There are three ways oftransferring data as below (recording media is to be prepared by users.)(a) Copy binary data on magnetic tape, and bring it out.
(b) Convert binary data to text data, copy it on a data storage device via LAN, and bring it out in MO.
(c) Copy binary data on a data storage device via LAN in a binary mode, and bring it out in MO (data canbe corrupted during transference unless it is kept in a binary mode.)

When using magnetic tape, choose one with a capacity of 525 MB.

3.3.6. Data Acquisition System
3.3.6.1. Registration of Measurement Conditions
Input measurement conditions following the users’ manual for the system. (Information can be input in a formof a file.)
The format of the “measurement ID” to be made for measurement ID/mode settings is 8 alphanumeric letters.
Do not use half-width spaces before and after a measurement ID.

3.3.6.2. Data Distribution
After a test, the recorded measurement data is to be CSV-converted and handed to a TS manufacturer.

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3.3.6.3. Content of Data obtained by Data Acquisition System
The data obtainable by the data acquisition system are as follows.
・ Thermocouple temperature
・ Calorimeter output
・ Temperature by resistance temperature detector (■abbreviated as RTD hereafter)
・ T-QCM output
・ IR power supply current/voltage output
・ Vacuum pressure
Users can monitor those data from the data displaying devices 1 ~ 4.
The correspondence between the channel numbers of the input signals for the data acquisition system and theplug signs on the inner-vessel permanent terminal board are shown in Figure 3-4 and Table 3-16. According tothem, for example, the thermocouple lines for a TS (600 channels in total) which do not go through IR power
supplies correspond to the plugs C1 ~ C41, D1 ~ D6, N1~ N2 on the inner-vessel permanent terminal board,which correspond to the channel numbers 1 ~ 600 in the data acquisition system.

Table 3-16 Correspondence between Acquisition Data and Channel Numbers
channel No.

plug sign name of data
C1 ~ 41

1～600

D1 ~ 6TS temperature*

N1 ~ 2613～648―standard signals

601～612―spare

649～6721001～1016 ―T-QCM

3001～3420 ―power supplies for heat sources

Refer to the correspondence table of channels in Appendix A for details.
* Among the pairs of pins, the 12th pair of C14 and C28 is occupied for grounding, which leaves 11 pairs
available.

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3.3.6.4. Resistance Temperature Detector
The output resistance of the RTDs to be connected is to be between 0 ~ 3 kW. They are basically to be JAXAcertified products. The resistance levels of measurement data are converted into temperature only via the dataprocessing system. That is, they are displayed as they are in the data gathering system. Refer to the following
figure for how RTDs are connected.

converter

4-wiresystemconverter

3-wiresystemconverter

2-wiresystemNote) The converters all have a three-wire system.
Figure 3-35 Connection of RTDs
Also, a conversion sheet for resistance and temperature is to be prepared in the tabular format of EXCEL. The
data acquisition system generates an approximate line by connecting the values designated in the sheet with linear
lines. Up to 32 contact points can be specified.
There are default conversion sheets for the ten kinds of RTDs as shown below.
(1) Thermistor (cf. NASDA-QTS-23648A)
・ THS51CNA501, 102
・ THS51CNB222, 302
・ THS51CNC502
・ THS51CND103
・ THS51CNE153, 303(2) Platinum temperature sensor (cf. NASDA-QTS-1043A)
・ N1043501-90-300, N1043501-91-600
3.3.6.5. Wire Breakage Detection Function and How to Use it(1) Wire breakage detection function
A detection circuit for wire breakage is installed for thermocouple-adopted temperature measurement
to detect a broken wire in a thermocouple circuit by deflecting signals to the maximum limit, so thattemperature can be controlled to the safety side. The detection circuit for wire breakage is of a voltage
impression type as shown in Figure 3-36. When a thermocouple circuit has no defects, the detection current
for wire breakage flows into a thermocouple.
(2) Wire breakage detection function in 6mφ Radiometer Space Chamber
The wire breakage detection function in this facility has a high resistance of 10 MΩ and voltage of 2.5V
loaded on its input circuit as shown in Figure 3-36. That is, detection current of about 0.25 μA is flowing
to the thermocouple side.
When this detection current for wire breakage is interrupted, the wire breakage of a thermocouple isdetected.

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2.5V
high resistance
10MΩ

wire
resistancedetection current for
breakage of wire

24mV orhigherwire breakage

thermocouple

Figure 3-36 Wire Breakage Detection Circuit(3) How to use it
As can be seen from (2) above, “0.25 μA × the voltage for the wiring resistance of a thermocouple”
is added to the temperature measured by a thermocouple (electromotive force), because current of 0.25 μA
is flowing to the thermocouple side. That is how wiring resistance increases with a longer wire of athermocouple, which pushes up measurement errors derived from the detection current for breakage ofwire. In case of 6mφ radiometer space chamber, the thermocouple wiring resistance to the facility side is20Ω, which denotes exceeded measurement accuracy of the logger (within ±1℃) when the thermocouple
wiring resistance to the TS side goes over 80Ω.
Therefore, it is recommended to follow the instructions in Table 3-17 when using the wire breakage
detection function.

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Table 3-17 Recommended Usage Instructions for Wire Breakage Detection Function (1/2)
over 80Ω

thermocouple wiring80Ω or lessresistance for the TS

temperature monitor channelsidetemperature control channel

ON/OFF of wire
breakage detection

It can be either turned on or off.

It is recommended to be turned off.

It is to be turned on.

-200℃ ～ -130℃: Ask the facility-200℃ ～ -130℃: Ask the facility staff

The following accuracy can be assured if systemstaff because measurement errors

because measurement errors differ

calibration is executed in advance using the wiring

differ depending on temperaturedepending on temperature (nonlinear.)resistance of a thermocouple.

(nonlinear.)-130℃ ～：within ±1℃-200℃ ～ -130℃: Ask the facility staff because

functionmeasurement accuracy-130℃ ～：within ±1℃

measurement errors differ depending on
temperature (nonlinear.)-130℃ ～：within ±1℃

When wire breakage detection

In the data display area and the graphfunction is on：

display area;

The data display area shows

・The graph display of temperaturescreen display for wire

“breaking of wire.”

becomes unstable.

breakage

When wire breakage detection

・Abnormal values are displayed.

function is off：
The graph display of temperature
becomes unstable.

82

The data display area shows “breaking of wire.”This may not be the latest edition.

Table 3-17 Recommended Usage Instructions for Wire Breakage Detection Function (2/2)
over 80Ω

thermocouple wiring
resistance for the TS80Ω or lesstemperature monitor channelsidetemperature control channel

With no wire breakage, normal

・With no wire breakage, normal

・When wire breakage takes place, the heattemperature measurement istemperature measurement is possible

source power supply maintains the preset values

possible regardless of the wiring

regardless of the wiring resistance of a(e. g., 50% output, etc.)

resistance of a thermocouple.

thermocouple.

・When system calibration is required to be

・When unstable temperatures or

executed by the facility staff prior to theabnormal values are indicated, it isinstallation of a TS into the chamber, that is

possible to check the existence of wire

subject to additional charge to cover calibration on

breakage by temporarily turning on theabout 30 channels a day in the chamber. Re-

wire breakage detection function.

execution of system calibration will be necessary

how to use the function(including restrictions,cautions, etc.)

after the test to restore the facility to the pre-teststate (which costs the same amount of charge as
above.)
Users are to prepare a list of channels to becalibrated and thermocouple wires with theequivalent resistance as of those used for the testin advance.

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3.3.6.6. Cautions
The data input device, the data gathering device, and the data processing device have their power supplied
from the uninterruptible power supply. When power failure takes place, take measures, e. g., normal termination
operation, etc., within the operation time (10 minutes) of the uninterruptible power supply system.

3.3.7. Utility Facilities
3.3.7.1. Clean Booth I/F(1) General operation procedure
The outline flow of executing an optical performance confirmation test on a TS in the clean booth while
mounted on the moving dolly is shown in Figure 3-37. It is to be noted that in the procedure of carrying
the moving dolly into the vacuum vessel, when its ducts have to be removed, the clean booth cannot
maintain the cleanliness of ISO5[ISO14644] (class M3.5, equivalent of class 100 [FED-STD-209E].）(2) I/F inside clean booth
The effective test area (volume) in the clean booth is 3,500 mm (width) × 5,000 mm (depth) ×
2,110 mm (height, with a clearance of 100 mm from the thermohydrometer.) (cf. Figure 3-38.)(3) Required time for achieving ISO5 [ISO14644] (class M3.5, equivalent of class 100 [FED-STD-209E]）
It takes about thirty minutes to establish an ISO5 [ISO14644] (class M3.5, equivalent of class 100[FED-STD-209E]）environment in the clean booth with no personnel inside.
(4) Max. capacity in the room
The clean booth can hold up to three people.
(5) Monitoring of temperature/humidity
The temperature and humidity data inside the clean booth can be monitored and checked during theoperation of the clean booth from its operation console via three points for each of temperature andhumidity. Among the three points, the temperature and humidity of the one in the center are recorded andsaved in the data acquisition system.
(6) Configuration of related equipment
The usage of the clean booth requires air-conditioning ducts to be configured, and therefore limits theusable range for setting test-related equipment next to the chamber as shown in Figure 3-39.

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After connecting the TS installation bench to the vacuum vessel, move the clean booth into the vacuum vessel.

After disconnecting the TS installation bench from the vacuum vessel,
mount a TS on the installation bench using a crane.

After connecting the TS installation bench to the vacuum vessel again, move the clean booth onto theinstallation bench.

Figure 3-37 Outline Flow of Clean Booth Operation

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effective test area

TS

depth

TS supporting bench

Figure 3-38 Height inside Clean Booth

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pit

pit

pipe joint (1:15)
12 parts
protective cover for pipe joint
pipe joint

permanent
facility

flexible hosespiral duct

temporaryfacility

pipe joint

pipe joint

joint flange

test equipment setting area
pipe dolly 1
vibration isolation
rubber platepipe joint
pipe joint
pipe joint

pipe joint

swivelable wheels with brakes

P/No.

name of item

total
numberpipe material:cold insulator:
exterior:
pipe material:cold insulator:
exterior:
pipe material:cold insulator:
exterior:
pipe material:cold insulator:
exterior:
pipe material:cold insulator:
exterior:

note
zinc plateweight: about 6 kg
urethane foamcolor iron plate (painted in ivory)
zinc plateweight: about 20 kg
urethane foamcolor iron plate (painted in ivory)
zinc plateweight: about 25 kg
urethane foamcolor iron plate (painted in ivory)
zinc plateweight: about 48 kg
urethane foamcolor iron plate (painted in ivory)
zinc plateweight: about 38 kg
urethane foamcolor iron plate (painted in ivory)

pipe material:cold insulator:
exterior:
pipe material:cold insulator:
exterior:

vinyl chloride
glass wool
vinyl chloride film
vinyl chloride
glass wool
vinyl chloride film

length: 0.5 m
weight: about 4 kg

flexible hose 3

pipe material:cold insulator:
exterior:

vinyl chloride
glass wool
vinyl chloride film

length: 14 m
weight: about 30 kg

flexible hose 4

pipe material:cold insulator:
exterior:

vinyl chloride
glass wool
vinyl chloride film

length: 2.5 m
weight: about 18 kg

pipe dolly 1with swivelable wheels

weight: about 12 kg

pipe dolly 2

with swivelable wheels

weight: about 25 kg

protective coverfor pipe joints

cold insulator:
exterior:

elbow pipe
spiral duct 1
spiral duct 2
spiral duct 3
spiral duct 4

vacuum vessel

preparation roomclean room

flexible hose 1

flexible hose 2

pipe I/F
pipe dolly 2
clean booth body
pipe joint

pipe joint
pipe joint

vibration isolation
rubber platepipe joint
swivelable wheels
with brakes

Figure 3-39 Configuration of Clean Booth Ducts

87

length: 3.5 m
weight: about 25 kg

heat&chemical resistant weight: about 2.8 kg
silicon coating glass fiber clothnote
1. the dimensions in ( ) show approximate dimensions.

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3.4. Facility BelongingsThis facility is equipped with the following connectors, etc., necessary for obtaining data during a test, which
can be rented out for users. The procedures for renting and returning the items are shown under the table.

Table 3-18 List of Facility Belongings
item

usage purpose

model #

connector (plug) for signals, EP, IR power supplies, andRTDs

for thermocouples

socket contact*

for thermocouples

owned qty

MS3106B18-1S─MS3106B22-23S

─MS3106B32-17S

─

AFD56-16-26SN

─

JA3106B24-J28SC

─0603-34-2039

─105372

─

NM-104-845#1

─

NM-104-845#2

─

calorimeterfor radiation intensity measurement

ST4356A

30

T-QCM

for contamination monitoring

MK-10 sensor

4 setsMODEL1900 processor
MODEL1800 temperature controller* Socket contacts (for thermocouples) are crimp-type, and are therefore not reusable. Users are to preparethem by themselves. In case they cannot be procured on time for the schedule, those equipped in the facility
are also available. In that case, make sure to return equivalent items later.
Note) Users are also to prepare plugs by themselves as much as possible. In case they cannot be procured ontime for the schedule, those equipped in the facility are also available. In that case, users are to pull out
the pins of thermocouple plugs, or clean solder off other equipment before returning them.

[Procedures for Renting and Returning Items](1) When renting items, users are to fill in the acknowledgement form of rent (prepared by the operationcompany of the facility) with the names, quantity, etc., of necessary items.
(2) The items are to be returned as soon as the tenancy is over. Expendables (e. g., socket contacts, etc.) are to
be replaced by the same number of the same new items.
(3) The items with solder applied (e. g., connectors, etc.), if any, are to be returned after wiping off the solder
clearly, or to be refilled with the same number of the same new items.
(4) The operation company of the facility will explain anything not yet clear to users concerning the procedures
for renting and returning items.

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3.5. Building I/F(1) Preparation room
This room, where the chamber is located, is used as a working area for users to carry out preparatory
work and tests.
(a) Gradient of floor and load capacity
The floor of the preparation room has a gradient of 3/1000 or less because the TS installation device
moves on it. The floor therefore has a specified load capacity, which is 9.8 kPa for widely-spread load
and 7.85 MPa (= compressive strength of floor coating material. The compressive strength of concrete(for temporary load) is 23.8 MPa) for concentrated load (e. g., casters of a bench, etc.) The floor
requires prior curing even for an item weighing less than the specified load capacity if it has any
possibility of damaging the floor.
(b) Hand-pallet truck
A hand-pallet truck can be used for moving heavy items in the preparation room. There are largesize and small-size hand-pallet trucks. The former is the same as the TS installation dolly (cf. section
2.2.2), with the same dimensions and capacity. The basic descriptions of the smaller hand-palled truck
are shown below.

Table 3-19 Basic Descriptions of Hand-pallet Truck
hand-pallet truck (small)dimensions

1,230W × 1,600L × 193H

capacity

2,400 kg

When moving a TS, etc., using the larger hand-pallet truck, it is convenient to use the satellite
mounting bench (large) (cf. Figure 3-40.) Its mass and the maximum load mass are 2,100 kg and 4,000
kg, respectively.
(c) Temperature/humidity monitoring
The temperature and humidity in the preparation room can be displayed on a portable monitor.
(d) Particles (cleanliness)
Particles are being counted by the dust counter located in the preparation room.
(e) Max. capacity in the room
The preparation room can hold up to 15 people.
(2) Measurement and control room
Users carry in check-out devices, etc., into this room, for performing data analysis, etc.

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(3) Distribution boards for users
The installation sites and usage purposes of the distribution boards and plug socket boards necessary
for performing a test are shown in Table 3-20. Each distribution board has a plug socket board at the lower
part of itself. In addition to that, LS-1B and 1C each has a surface plug socket board (A.) Refer to Figure3-41 for their locations. The WBD diagram of distribution boards is shown in Figure 3-42. The
specifications of the plug socket board at the lower part of a distribution board and the surface plug socket
board (A) (configuration of sockets) are shown in Figure 3-43.
Since the distribution boards are also connected to the emergency power supply system, they can all
gain power from the private power generator in the power building in case the commercial power supply
is interrupted. It takes about 10 minutes before the private power generator finally gets to supply power,
which then starts supplying power to the distribution boards in the order of priority. Likewise, power failure
takes place for about 10 minutes at the time of power restoration by the commercial power supply.

Table 3-20 List of Distribution Boards for Users
distribution board #installation siteusage purpose

LS-1B

preparation room

for sockets and devices

LS-1C

preparation room

for sockets and devices

LS-1E

fore-room

for sockets and devices

LS-1I

measurement and control room for sockets and devices

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drilledhole(15 places)

Figure 3-40 Mounting Bench (Large)

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LS-1I
計測制御室
measurement & control room

ユーザ用
UPS
UPS
for users(CP315BCAP2
AP2分岐盤)board)(CP315BC
distribution
plug
socket board (A)LS-1B
コンセント盤(A)チャンバ
chamber

LS-1C

unpacking
解梱室
room

preparation
準備室 roomplug
socket board (A)コンセント盤(A)fore-room
前室

LS-1E
LS-1E

Figure 3-41 Configuration of Distribution Boards/Plug Socket Boards

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branchboard electrical main board
circuitcircuit capacity
name/ mode
and
(VA)
type main line circuit structure sign breaker
PAF/AT
LS-1B
selfsupported
flush typename of load

isolation transformer
isolation transformer

note

branchboard electrical main board
circuitcircuit capacity
name/ modeandsign breaker (VA)
typemain line circuit structure
PAF/AT
LS-1C
selfsupported
flush typename of load
isolation transformer
isolation transformer

note

branchboard electrical main board
circuitcircuit capacity
name/ mode
and
(VA)
type main line circuit structure sign breaker
PAF/AT
LS-1E
selfsupported
flush typename of load
isolation transformer
for devices

note

branchboard electrical main board
circuitcircuit capacity
andname/ mode
(VA)
type main line circuit structure sign breaker
PAF/AT
LS-1I
selfsupported
surface typename of load
isolation transformer
for devices

isolation transformer

isolation transformer

for devices

for devices

plug socket board (1)plug socket board (1)plug socket board (1)plug socket board (1)plug socket board
plug socket board

plug socket board
plug socket board

plug socket board (1)plug socket board (1)plug socket board

plug socket board

plug socket board (1)plug socket board (1)plug socket board (1)plug socket board (1)plug socket board (1)plug socket board (1)plug socket board
plug socket board
plug socket board

plug socket board
plug socket board
plug socket board

plug socket board (1)plug socket board (1)plug socket board (1)plug socket board (1)plug socket board
plug socket board

plug socket board
plug socket board

plug socket board (A)plug socket board (A)plug socket board (A)plug socket board (A)socketfor devices
for devices

plug socket board (A)plug socket board (A)plug socket board (A)plug socket board (A)plug socket board (A)plug socket board (A)plug socket board (A)plug socket board (A)for devices
for devices

plug socket board (A)plug socket board (A)for devices

plug socket board (A)plug socket board (A)socketsocketfor devices
for devices

for devices
for devices

for devices
for devices

for devices
for devices

for devices
for devices

for devices

for devices

for devices
for devices

for devices
for devices

socketfor devices
for devices
for devices

for devices
for devices

for devices

for devices

separator

plug socket board
separator

plug socket board
plug socket board
for devices

for devices

for devices

plug socket board

for devices

for devices

plug socket board
plug socket board
for devices

separator

separator

plug socket board (1)plug socket board (1)plug socket board (1)plug socket board (1)plug socket board (1)plug socket board (1)plug socket board (A)plug socket board (A)plug socket board (A)plug socket board (A)plug socket board (A)plug socket board (A)

spare

spare

separator
lower part plug socket board
separator
socketlower part plug socket board

separator
lower part plug socket board (1)socketsocketsocketseparator
socketlower part plug socket board (1)socketsocketsocketsocketsocketsocketsocketsocketsocketsocketsocketFigure 3-42 WBD Diagram of Distribution Boards

93

note

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Figure 3-43 Specifications of Socket at Lower Part of Distribution Board and Plug Socket Board (A)94This may not be the latest edition.

(4) Cranes
There are cranes between the unpacking room and the fore-room, and in the preparation room, which
can be used for carrying in a TS, etc. When using them, they are to be operated only by qualified people,
who are always to fill in the specified record form with the track record of use. There is a rail switch
mechanism between the unpacking room and the fore-room crane, which allows the transportation of itemswith the crane between the two rooms with the shutter open. The specifications of the cranes are shown in
Table 3-21. Each crane is oil-drip proofed, but a TS is to be protected by a cover, etc., for precaution’s sake.
Refer to Figure 3-45 for the movable range of each crane. The cranes require about ten seconds to be readyfor operation after the “on” button on the pendant switch is pressed due to the installed inverter, while there
is a little time lag before completely stopping after the “stop” button is pressed (same with the case of theiractivation.)
The hook is to be wound up to the limit after using the crane.

Table 3-21 Specification of Cranes
installation site

unpacking room ~ fore-room

preparation room

type

monorail hoist type 4.8t

doublerail hoist type 4.8t

rated load

4.8t

4.8t

lifting height

11.0m (below hook: 10.71m)

13.6m (below hook: 13.54m)

hoist speed (Min/max)

0.4/4.0 (m/min)

0.4/4.0 (m/min)traverse speed (Min/max)

1.25/12.5 (m/min)

1.25/12.5 (m/min)travel speed (Min/max)

2/20 (m/min)

2/20 (m/min)

operation method

press button on the floorpress button on the floor

Note 1) The speed can be changed by pressing the buttons for low and high speeds.
Note 2) The low speed at the first step is changable. The speed range, however, is within 1/10 of the top
speed.

(5) Unpacking room
The shutter facing the outside has a slight opening, through which rain, etc., can enter the room at theoccasion of typhoon, etc. Therefore, no jigs or measurement instruments are to be placed near the shutter.
(6) UPS for users
There is a UPS available to users in the preparation room. Contact the facility operation company inadvance if it is planned to be used.
(a) Location
Refer to Figure 3-41.
(b) Specifications① Max. total output capacity: 15.0 kVA② Backup duration: 10 min or longer③ Output rating/wiring number

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Table 3-22 Specification of UPS
output rating

wiring # on branch power board
U1, V1, W1
U2, V2, W2

AC200V

three-phase three-wire 50Hz total: 4 circuits
U3, V3, W3
U4, V4, W4
U5, V5AC200V single-phase two-wire 50Hz

total: 3 circuits V6, W6
W7, U7
U8, N8AC100V single-phase two-wire 50Hz

total: 3 circuits V9, N9W10, N10*

Wiring is to be performed after checking the wiring numbers shown on the branch power board
at site.

(c) Others
A circuit diagram of the branch power board is shown in Figure 3-44.
The total load from the equipment mounted by users is to be 75A or less.

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direct input 1

direct output 1

direct input 2

direct output 2

AC input 1 42I1

AC output

AC input 2 42I2

The terminals in the bold frame are available to users.

Figure 3-44 Circuit Diagram of Branch Power Board for Users

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rail revolution device
shutterspan

movable range

unpacking room/fore-room

power supply box

movable range of hook

preparation room

span 25000

insulated
trolley

position of stopper

Figure 3-45 Movable Range of Crane in Each Room98

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(7) Contamination control(a) The requirements for optical sensors are becoming more and more demanding compared to general
TSs. That is why this facility executes more strict contamination control than other facilities in TsukubaSpace Center. Precisely, the following measures are being taken.
① Particulate contamination is controlled abiding by ISO7 [ISO14644] (class M5.5, equivalent ofclass 10,000 [FED-STD-209E].）② Molecular contamination is prevented by refraining from using oil as the lubricant for the sliding
parts of equipment used in the preparation room as much as possible; otherwise, the oil-appliedparts are tightly sealed.
(b) When testing an optical sensor that calls for especially demanding cleanliness requirements, the cleanbooth will help establishing the ISO5 [ISO14644] (class M3.5, class 100 [FED-STD-209E] ）environment.
(c) The preparation room and the clean booth are designed to retain cleanliness for their Max. capacities
of fifteen and three people, respectively. The number of people exceeding the capacities may fail tosatisfy the cleanliness. Never enter or leave the preparation room without clearly indicating theentering/leaving state on the management board at the entry/exit.
(d) NVR plates for detecting non-volatile residue are set in the chamber all through a test to check forcontamination on a TS and the facilities. Refer to Figure 3-46 for the installation sites of NVR plates.
It takes about a week to complete the analysis on the amount of contamination, and users may berequired to clean inside the chamber or perform a verification test (including analysis) at users’ expense
when the analysis results suggest the existence of contamination on the facilities (viz. the amount of
NVR on work floor: 1.5 mg/0.1m2 or more*). It takes about two weeks to clean inside the chamber andcomplete a verification test.
*

Policy for contamination measurement in thermal vacuum tests (GCT-2011023)

真空容器内

insidechamber
作業床
work
floor

ｺﾝﾀﾐﾈｰｼｮﾝﾊﾟﾈﾙ
scavenger
cryopanelneighborhood
供試体近傍
of TS

clean
room
ｸﾘｰﾝﾙｰﾑ

door

Figure 3-46 Diagram of Installation Sites for NVR Plates99This may not be the latest edition.

(e) General cautions in the clean room
The rules shown below are especially crucial for users to follow when using the clean room.
① Clean garment
Users are to wear one of the following clean garments depending on the cleanliness
requirements of a TS.

ISO5 [ISO14644] (class M3.5, equivalent of class 100 [FED-STD-209E]): overall, hood, mask,boots
ISO7 [ISO14644] (class M5.5, equivalent of class 10,000 [FED-STD-209E]): overall, hood, boots(or shoes, shoes cover.)
ISO8 [ISO14644] (class M6.5, equivalent of class 100,000 [FED-STD-209E]): overall (the kindsame as those used in other clean rooms is acceptable), cap, short boots.

When coping with contamination-sensitive surfaces, wear a pair of gloves in addition to theitems above.
For a test in a clean booth, a clean garment that meets class 100 requirements is to be prepared.
For reference, some examples of clean garments (model numbers) used by the facility are shown
below.

Overall: FB102C
Hood:

FB405C

Boots: FE652C
Mask: FZ554C
Gloves: Cleanfast1000

manufactured by Toyo Lintfree Co.
*

The clean garments used by facility-side personnels are the kinds to satisfy the cleanlinessstandards of both ISO5 and ISO7 [ISO14644.]② Stationary articles
Refrain from bringing in paper into the preparation room to the extent possible. If not
avoidable, choose dust-free paper. As a writing tool, use a ballpoint pen.

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4. Execution of Tests
4.1. Test-related Work Procedure
Each work in the course of a test is executed based on the test implementation plan sheet presented by the TSside. The following Figure 4-1 shows a general flow of test-related work. (The hatched boxes show the work to bedone by the TS side.)installation of TS
into the building*1

start of vacuuming*2

cooling of shroud

mounting test
item on TS
installation device

installation of
TS in chamberclosing ofchamber door

final checking

test mode setting
testvisual inspection*1

removal of TS

checking of TS cables,
thermocouples, cablerouting, and conduction

normaltemperature/atmospherereturndismounting ofGrayloc
Connector

dismounting TS fromTS installation device

carrying out TS
from chamber

A TS is to be left in the fore-room for about 1 hour to wait for the recovery of cleanliness, before being
carried into the preparation room.

*2

mounting ofGrayloc
Connector

A test schedule is to be arranged the way low vacuuming starts at 13:00.

Figure 4-1 Test-related Work Flow101

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4.2. Test Procedure
4.2.1. General Description of Test
In this facility, tests are classified in two ways according to their purposes and methods. Each classification is
described below. The selectable test methods are determined by test purposes. Refer to Table 4-1 for more details.
(1) Classification according to purposes
In this facility, environmental tests, e. g., (a) radiometer optical property tests, (b) IR radiation thermalbalance/thermal vacuum tests, etc., can be performed. The general description of each environmental test
is provided below. The environmental conditions of each test are described in Table 4-2.
(a) Radiometer optical property test
It is a test for checking the optical properties, etc., of a TS in the high vacuum and cryogenic
temperature simulating outer space and in the atmospheric pressure and normal temperature.
(b) IR radiation thermal balance/thermal vacuum test
A thermal balance test confirms the thermal design, etc., of a TS in the high vacuum and cryogenic
temperature that simulate outer space, while a thermal vacuum test confirms the environmental
resistance of equipment mounted on a TS to the thermal environment in space, that is, high and low
temperatures and the back-and-forth transition between them. IR lamps or heaters are used as the heatsources.
(2) Classification according to methods
The following three modes can be chosen as a testing method.
(a) Mode 1
In this mode, shrouds are started to be cooled after the chamber is vacuumed with a cryosorption
pump to the level passed the discharge-hazardous range. That way a TS can be protected fromexcessive cooling. Thermal vacuum/balance tests are basically performed in this mode.
Note) There is a case in which the reached level is found to be in the discharge-hazardous range whena cryosorption pump is stopped after the shroud temperature is raised during atmosphere return,depending on the amount of outgas from a TS.
(b) Mode 2
In this mode, the chamber is started to be vacuumed with a cryosorption pump after the shroud iscooled down, for the purpose of performing thermal vacuum/balance tests. This mode enables the quick
establishment of test conditions when there is no fear of damage on a TS caused by excessive cooling.
(c) Mode 3This mode denotes a vacuum test in normal temperature. That is, only a vacuum state is establishedwithout cooling the shroud.

The correspondence between test purposes and test methods is shown below.

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Table 4-1 Test Methods Corresponding to Test Purposes
test purpose

test method

radiometer optical property test

modes 1, 2, 3

IR radiation thermal vacuum/balance test modes 1, 2

Table 4-2 Summary of Kinds of Tests and Environmental Conditions
kinds of tests
environment

radiometer optical property test

(1) chamber pressure 1.33×10-4Pa or lessIR radiation thermal balance/thermal vacuum test
1.33×10-4Pa or lessor atmospheric pressure(2) IR intensity

20 kW (max)

20 kW (max)(3) shroud

100K or lower

100K or lower

temperatureor 300K (normal temperature)103

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4.2.2. Standard Chamber Vacuum Curve, etc.
Figure 4-2 “Standard Chamber Vacuum Curve, etc.” shows a standard chamber vacuum curve in mode 1 (withno TS placed inside), a standard operation procedure, and a shroud temperature curve.

start of low
vacuuming normally at 13:05
通常13:05に粗引排気開始
10:00

12:00

14:00

16:00

18:00

20:00

22:00

冷却水・計空設備
cold water, vacuum gauge
油回転ポンプrotary vacuum pump
メカニカルブースタポンプ
mechanical booster pump
ホールディングポンプ
holding pumpvalve
“ opened”
元弁「開」

valve
“ closed”
元弁「閉」

ターボ分子ポンプ
turbo molecular pump
コンタミネーションパネル
scavenger cryopanel

元弁「開」
valve
“ opened”

valve“ closed”
元弁「閉」

クライオソープションポンプ
cryosorption pump
シュラウド冷却shroud cooling
シュラウド加温shroud heating
GN
2リーク
GN2
leak
大気圧戻し
atmosphere return“ opening” of low vacuuming
粗引元弁「開」
valve
105

GN
GN2
leak
2リーク

メカニカルブースタポンプ排気
mechanical booster pump vacuuming

104

Gradual atmosphere return is
乾燥空気による大気圧戻しを徐々に行います。空気導入は約3時間弱かかりま
executed by letting in dry air, taking
す。
about 3 hours.

103

チャンバ内圧力[Pa]Inner-chamber Pressure [Pa]102

13.3Paまで粗引排気した後、
shifting
to TMP vacuuming after low
ターボ分子ポンプによる排気vacuuming
to 13.3 Pa

10

All the vacuum valves are closed.

1

The inner-chamber pressure is
全排気元弁を閉めます。チャンバ内圧力
boosted up then, which is further
が急速に上昇しますが、放電し易い領域（注1）での滞在時間を短くするため、GNpressurized to reach around 2660 Pa2
リークにより強制的にチャンバ内圧力をby means of GN2 leak, to shorten
2660Pa程度まで昇温します。
the dwell time in the discharge注1：4-3(1)参照

コンタミネーションパネル冷却scavenger cryopanel cooling

10-1

チャンバ内の汚染防止のため、コンタミネーションパネルを
Sharp
drop of pressure when scavenger cryopanel is cooledby液体窒素により冷却することにより、急激に圧力が下がります。
LN2 to prevent contamination in chamber.
10

-2

10

-3

クライオソープションポンプ排気
CSP vacuuming

シュラウド冷却shroudcooling
シュラウドに液体窒素を供給して冷却します。この操作が完了する
Shroudis cooled down by LN2 supplied into it. The completion of this-4と、熱真空試験の環境条件(1.33×10
operation
denotes the establishment ofPa,シュラウド100K以下が成environmental conditions for a thermal
立します。
vacuumtest (1.33 × 10 -4 P a, shroud being 100 K or lower.)

10-5

300

シュラウド温度[Ｋ]GN2リーク
GN2 leak-3
Cryosorption
pump is activated around 1.33 × 10-3 Pa, for
1.33×10
Pa付近でクライオソープションポンプを起動させ、更に真空排気を続けます。
further vacuuming.

10-4

Shroud Temperature [K]hazardous range.
note: cf. 4-3

シュラウド加温shroud heating
シュラウドにGN
Shroud is heatedby GN2 running
2を流し、昇温します。この時点でチャンバ内圧力はthrough it. The inner-chamber pressure-4
1.33×10
Pa程度になります。
at this point
is about 1.33 × 10-4 Pa.

establishmentof test environment in about
真空引きから約7.5Hで試験環境成立
7.5 hrs after the start of vacuuming.

供試体試験
test on TS

シュラウド
shroud250

シュラウド
shroud

200
150
100
50

コンタミネーションパネル
scavenger cryopanel
コンタミネーションパネル
scavenger cryopanel0

図 4-1 標準チャンバ排気曲線等

Figure 4-2 Vacuum Curve in Standard Chamber, etc.

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4.3. Power Failure Protective Measures
The general flow of measures against momentary power interruption or power failure is shown in Figure 4-3.
(1) Momentary power interruption(a) All the devices but the instrument air compressor in this facility are equipped with two-second
momentary power interruption measures, which enables continued operation of vacuum pumps, etc.,
during power interruption of two seconds or shorter.
(b) Even though the instrument air compressor is aborted at the momentary power interruption of shorter
than two seconds, it has no impact on test environments owing to the automatic backup by GN2.
(2) Power failure(a) In the power failure of two seconds or longer, all the mechanical vacuuming pumps, etc., are aborted,
except for the cooler for shrouds and scavenger cryopanels. Then, it is to be determined whether tokeep cooling the shrouds to avoid rapid pressure raise or stop cooling them by introducing GN2, basedon the power failure duration and the state of excessive cooling protection measures being taken for aTS. (Generally, continuous cooling of shrouds is chosen while waiting for power recovery.)(b) When power failure lasts for two seconds or longer, the inner-chamber pressure rises up to thedischarge-hazardous range (1.3 × 10-3Pa) in about ten minutes. Therefore, discharge prevention
measures, e. g., shifting a TS into a launch mode, etc., are to be taken as soon as power failure takes
place.
(c) A 15 kVA UPS is prepared in the preparation room for users. It is recommended that the heater systems(e. g., power supply for IR heaters) wished to be heated during power failure or the checkout devices,
etc., wished to be controlled and monitored during power failure be connected to the UPS in advance.
Refer to section 3.5 for how to connect the UPS for users.
The power supply for IR heaters and checkout devices not connected to the UPS for users will be turned
off during power failure.
(d) After about 10 minutes of power failure, the emergency power generator in the power building ofTsukuba Space Center starts supplying EP. Its pre-activation stand-by time and EP capacity varydepending on the state of its application by other facilities and equipment. Figure 4-4 shows thepressure transition inside the chamber during an assumed power failure of 20 minutes.
(e) The control device, data processing device, a remote setting PC for the power supply for IR heaters,
communication system, and oximeter are connected to a UPS (uninterruptible power supply) which
can supply power for 10 minutes or longer.
(f) In case power failure is not recovered for 10 minutes or longer, the saved data is to be stored in theexternal medium to make provision for hard disc failure due to the forced termination of the dataacquisition system (measurement can be continued.)(g) The power supply from the emergency power generator in the power building of Tsukuba Space Center
is finite. Therefore, unnecessary lights or devices are to be turned off while the emergency power
generator is supplying EP, for the sake of saving EP to the extent possible.

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(h) Once the emergency power generator in the power building of Tsukuba Space Center starts to supply
EP, high vacuum operation (1 × 10-4Pa or less) can be restarted with the help of cryosorption pumps(CSP) and turbo molecular pumps (TMP.)(3) Power restoration(a) A momentary power interruption takes place at the moment of power restoration when power supply
shifts from the emergency power generator in the power building of Tsukuba Space Center to theregular power supply.
(b) High vacuum operation can be recovered in about thirty minutes after power restoration unless GN2 or
dry air was introduced into the chamber during power failure.

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momentary power interruption/
瞬停／停電発生
power failure

状況確認
statuschecking
momentary power interruptionof shorter
than 2 seconds
2秒未満の瞬停
duration停電時間
of power failure

2秒以上の停電
momentary power interruption of

2 seconds or longer, OR power failure

計装空気圧縮機
reactivation of
instrument
air compressor
再起動

discharge
prevention measures
供試体放電対策for TS

Yes

recovery of
10分以内に商用
commercial EP within
電力の復電
10 minutes

No
power supply from
動力棟自家発電機
privatepower generator
in による給電
power building

no power supply

給電さ
2次的な災害等によ(due toれず(
secondarydisaster, etc.) り )給電Nowhether or not TS can
供試体は放電しやすい
wait in discharge領域内で待機可能か
hazardous range

power supply

※1*1
・TMP,
CSP
reactivation 排気再開）(revacuuming)
・ TMP、・heating
ofCSP再起動（
TS with power
supply・for試験用電源等によheat sources, etc. る 供試体加温Yes①
recoveryof commercial EP
商用電力の復電Noreactivationof all devices
全装置の再起動Yes
momentary
power interruption
due to the
商用電力への切替えに伴う
shift to commercial
EP 瞬停

・シュラウド冷却停止
・abortof shroud cooling
・GN2
leak
・GN2リーク

試験再開
restartof testTMP,
CSP reactivation
TMP､C
SP再起動（排気再開）(revacuuming)
confirmation of recovery
高真空への復帰を
to high vacuum確認

confirmation of recovery
高真空への復帰を
to high vacuum確認

liftingof discharge prevention
供試体放電対策解除
measures for TS

liftingof discharge prevention
供試体放電対策解除
measures for TS

response
meeting
対策会議

①へ

試験中止

abort of test

極低温／高真空維持運転
cryogenic/highvacuum maintenance
operation(test continued)（ 試験継続）大気圧戻し
atmospherereturnof test)（(abort
試験中止）※1 TMP:
TMP： ターボ分子ポンturbo
molecular プ
pump
CSP:
pump ン ポン プ
CSP： cryosorption
ク ラ イ オソ ープショ

図４ －２

瞬停・ 停電時の標準フ ロ ーFigure 4-3 Standard Flow in Momentary Power Interruption and Power Failure

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power failure

start of power supply
from emergency
power generator

restart of CSP and TMP vacuuming

restart of CSP and
TMP vacuuming
momentary power interruption
due to shift from emergency tocommercial power supplies

power failure duration

Figure 4-4 Inner-Chamber Pressure Transition during 20-minute Power Failure

4.4. Other Remarks(1) Matters to be confirmed for test
The environment in the space chamber is the same as outer space in that it cannot be accessed promptly
even when abnormalities are found on a TS. Bearing that in mind, the following matters are to be checked.
(a) Matters concerning chamber contamination① Whether or not anything with high steam pressure or susceptibility to evaporation from heating isused in the chamber.
② Whether or not commercial products that are not made for the usage in space are being used. (Arethere commercially available glues or adhesive tapes being used?)③ Is the applied material less likely to generate outgas?
④ Whether or not a TS, jigs, etc., that are coated with paint have been put through enough baking.
(b) Matters concerning vacuum① Whether or not there is gas leakage from gas-sealed equipment.
② Whether or not there is any chance that MLI might block vent holes (See if MLI does not cover
the vent holes of tanks, etc.)③ Whether or not MLI has vent holes, or one end of it is not fixed.
④ Whether or not there is a problem when inner or outer pressure is loaded.
⑤ Whether or not the vacuum seals on vacuum seal connectors have been closely inspected.
⑥ Whether or not leakage has been thoroughly inspected in case the vacuum vessel has any feedthrough equipment (waveguide, tube, etc.)(c) Harmful effects of low temperature① Whether or not the material has low temperature brittleness that can cause a problem.
② Whether or not polymer material (rubber, etc.) is used in the parts that become cold.
③ Whether or not there is any item whose temperature won’t go up readily during normal
temperature atmosphere return. If there is any, it is to be checked if it is equipped with any
mechanism to raise its temperature.
④ Whether or not a fluid is freeze-proven, if it is planned to be used.
(d) Matters concerning vacuum discharge108This may not be the latest edition.

① Electric discharge is generally said to take place in the pressure range around 1.33 × 10-3 ~ 1.33
× 104Pa, where loading of high voltage may damange a TS due to electric discharge (cf. JERG2-130-HB005 Handbook of Thermal Vacuum Test, section 3.7.1.)② It is required that the electric-discharge-hazardous pressure range be determined by the TS sideand reported to the facility-side personnel in advance.
③ It is to be confirmed that loading of voltage is avoided in the electric-discharge-hazardous pressure
range, or discharge prevention measures are taken in case that is not possible.
(e) Considerations for high pressure gas safety law① The facility-side pipes in the vacuum vessel of this facility are not subject to the High Pressure
Gas Safety Law. When users prepare LN2/GN2 panels, make sure they are designed not to be theregulated objects of the law.
(f) The I/F to the facility is to be checked not only by a drawing, but also by visual observation on it.
① I/F to TS supporting bench② I/F to inner-chamber protruding objects (sensors, work floor, tubes, etc.)(2) Important matters for using this facility
Here, especially important matters concerning the equipment of this facility are provided for the caseof using it. For more detail, refer to the users’ manual of each equipment.
(a) General matters① Users are to mount a TS on a TS supporting bench and control the IR heat source power supply(when used) by themselves, following the users’ manual. (The TS supporting bench is brought inand out of the chamber by the facility-side personnel.)② Especially the domestic products of Aeroglaze Z306 (black), which is used for painting satellites,
tend to generate a big amount of outgas, and therefore is to be refrained from being used inside
the chamber to prevent contamination. When it is used nevertheless, sufficient baking is requiredin advance. In case of using paint whose outgas components are unknown, outgas analysis is tobe performed on it, followed by the same procedure as above if it is found to generate excessive
amount of outgas.
③ The air introduced into the chamber during atmosphere return passes through a drier, which
generates absorption heat from the absorbent filled inside. That absorption heat together with thecompression heat generated from the introduced air sometimes raises the temperature of air
introduced into the chamber (the level of the temperature rise depends on the outdoor temperatureand humidity, reaching highest in summer.) Users are to pay attention to this point when
performing a test on a temperature-sensitive TS, taking necessary measures for it.

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(b) Chamber system① When feed-through flanges such as a waveguide or a connector are used on the chamber nozzle
for users, they are to be subject to the prior checking on leakage from their vacuum-sealed parts.
② The hard ports being made of SUS304, users are to watch out for “seizure” if they prepare screws
that are SUS products whose surfaces are not coated. In case an SUS screw is thrusted into thehelisert of the hard port, enough caution is required to do it by hand at first, for example.
③ Emergency stop switch
This facility has emergency stop switches, which abort all the facilities when emergency stop
is needed (ex. a person is locked into the chamber.) Users are to check the actual switch with theirown eyes before using the facility.
・ Emergency stop switch inside chamber
The “switch” consists of the receptacle and plug of an MS connector; the contact point is
disconnected when the plug is pulled out, which activates the interlock to abort the facility.
In case someone was locked into the chamber, he or she has to pull out the switch. The
location of the switch is shown in Figure 4-5.
・ Emergency stop switch inside control room
It is a button-type switch, which aborts all the facilities when its protection pin is pulled out
and the button is pressed. The location of the switch is shown in Figures 4-6 and 4-7.
・ Emergency stop switch in preparation room
It is a button-type switch, which aborts all the facilities when its protection pin is pulled out
and the button is pressed. The location of the switch is shown in Figures 4-6 and 4-8.

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TSTS supporting benchdooremergency stop switch
in chamber

how to operate
Grab the plug by its root, turn it anticlockwise to
the limit, and unplug it.

② unplug it.

① turn the plug anticlockwise.

Figure 4-5 Emergency Stop Switch inside Chamber111

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空調機械室

計測制御室
Measurement& Control Room

玄関ホール
計測制御室内emergency
stop switch
緊急停止スイッチ
in measurement& control room
（非常停止
(on emergency
stop operation console)
操作卓上）

機械室

Unpacking
開梱室
Room

emergency stop switch
in preparation room
準備室内緊急停止(on accessdoor console)
スイッチ（供試体搬入扉操作盤上）

真空容器
VacuumVessel

控室1

控室2

前室
Fore-Room

図4-3 準備室・計測制御室緊急停止スイッチ位置

CP103-B
emergency
stop operation console
非常停止操作卓

all system
全系緊急停止emergencystop

LCD guide
液晶ガイド

ハイブリッドhybridrecorderレコーダ

Pull
out the protection pin and
保護ピンを外し、押下する。
press
the button.

図4-4 計測制御室非常停止操作盤上 緊急停止スイッチ位置

Figure 4-6 Locations of Emergency Stop Switches in Preparation Room and Measurement & Control RoomFigure 4-7 Location of Emergency Stop Switch on Emergency Stop Console Panel in Measurement &Control Room

112

This may not be the latest edition.

Figure 4-8 Position of Emergency Stop Switch on Preparation Room Access Door Console Panel

113

This may not be the latest edition.

4.5. Documents to be Submitted at K/O Meeting
The following documents are to be submitted to the personnel in charge of the facility at the K/O meeting.
・ Test implementation plan
・ Requirements for the facility (cf. Table 4-3)
・ List of nonmetallic articles brought into chamber (cf. Table 4-4)

114

This may not be the latest edition.

Table 4-3 Requirements for Facility>>>These requirements are to be submitted at K/O meeting to the personnel in charge of operating the facility.<<<6mφ Radiometer Space Chamber
documentation date：name of testYear
facility users’ nametest conditions, etc.

Pa or lessdischarge-hazardous rangePa～shroud temperaturePa
K or lower

temperature：

23 ± 3℃

humidity：

30 ~ 60％(preparation room)

ISO7 [ISO14644] (class M5.5,
equivalent of class 10,000 [FED-

cleanliness：

STD-209E])

test mode
type of test specimen supporting
bench

mode：
w/ cooling panel ・ w/o cooling panel

test method, used equipment, etc.

6mφ 60W power supply rack -1：
6mφ 2,kW power supply rack -1：
power supplies for heat sources
6mφ 2,kW power supply rack -2：
6mφ 3 kW power supply rack -1：
LN2 (GN2) for test specimen

not use／use

UPS for test specimen

not use／use

vibration analyzer

not use／use

not use／use

393M33：accelerometer
393M12：
393M31：clean booth
TQCM

Day

note

inner-chamber pressure

environment of clean roomMonthnot use／／use

not use

115

use
(qty)

This may not be the latest edition.

Table 4-4 List of Nonmetallic Articles Brought into Space Chamber>>>This list is to be submitted at K/O meeting to the personnel in charge of operating the facility.<<<name of test:
component～

test period:
material

application purpose

used amount

TML

CVCM

track record of use

1. test specimen

2. jigNote 1) It is the basic rule that a test specimen and all the jigs are put through baking in another facility before performing a test on them,unless they are true with the cases as below.
・A thermal vacuum test has been already performed on the test specimen and jigs, and the nonexistence of outgas from them is apparent.
・When baking can be proved unnecessary from this list. In that case, never fail to write in the TML and CVCM of the materials.
Note 2) The materials are to accompany their trade names and model numbers.
Note 3) When the used amount of materials is not clear, write in the maximum amount. For silicone grease, for example,
50 g × 2 would be written. When the amount is just a little, write so.
Note 4) If baking is not necessary, provide the basis for that. ex) The amount is just a little, being in the specified levels of both TML and
CVCM.

116

This may not be the latest edition.

Appendix A

Correspondence Table of Channels between Terminal
Boards inside Vessel and Data Loggers

Appendix A Correspondence Table of Channels between Terminal
Boards inside Vessel and Data Loggers

This may not be the latest edition.

Table A-1 Correspondence Table of Channels between Terminal Boards inside Vessel and Data Loggers（1/5）
ch serial#connectors on inner-vessel terminal boards side#connector CH

1

1

2

2

3

3

4

4

5

5

6

6
1

C1

7

7

8

8

9

9

10

10

11

11

12

12

13

1

14

2

15

3

16

4

17

5

18

6
2

C2

19

7

20

8

21

9

22

10

23

11

24

12

25

1

26

2

27

3

28

4

29

5

30

6
3

C3

31

7

32

8

33

9

34

10

35

11

36

12

PIN

material

A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y
A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y
A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y

copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan

ch serial#connector model#

connectors on inner-vessel terminal boards side#connector CH

37

1

38

2

39

3

40

4

41

5

42
AFD56-16-26SN

6
4

C4

43

7

44

8

45

9

46

10

47

11

48

12

49

1

50

2

51

3

52

4

53

5

54
AFD56-16-26SN

6
5

C5

55

7

56

8

57

9

58

10

59

11

60

12

61

1

62

2

63

3

64

4

65

5

66
AFD56-16-26SN

6
6

A-1

C6

67

7

68

8

69

9

70

10

71

11

72

12

PIN

material

A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y
A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y
A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y

copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan

connector model#

AFD56-16-26SN

AFD56-16-26SN

AFD56-16-26SN

This may not be the latest edition.

Table A-1 Correspondence Table of Channels between Terminal Boards inside Vessel and Data Loggers（2/5）
ch serial#connectors on inner-vessel terminal boards side#connector CH

73

1

74

2

75

3

76

4

77

5

78

6
7

C7

79

7

80

8

81

9

82

10

83

11

84

12

85

1

86

2

87

3

88

4

89

5

90

6
8

C8

91

7

92

8

93

9

94

10

95

11

96

12

97

1

98

2

99

3

100

4

101

5

102

6
9

C9

103

7

104

8

105

9

106

10

107

11

108

12

PIN

material

A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y
A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y
A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y

copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan

ch serial#connector model#

connectors on inner-vessel terminal boards side#connector CH

109

1

110

2

111

3

112

4

113

5

114
AFD56-16-26SN

6
10

C10

115

7

116

8

117

9

118

10

119

11

120

12

121

1

122

2

123

3

124

4

125

5

126
AFD56-16-26SN

6
11

C11

127

7

128

8

129

9

130

10

131

11

132

12

133

1

134

2

135

3

136

4

137

5

138
AFD56-16-26SN

6
12

A-2

C12

139

7

140

8

141

9

142

10

143

11

144

12

PIN

material

A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y
A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y
A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y

copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan

connector model#

AFD56-16-26SN

AFD56-16-26SN

AFD56-16-26SN

This may not be the latest edition.

Table A-1 Correspondence Table of Channels between Terminal Boards inside Vessel and Data Loggers（3/5）
ch serial#connectors on inner-vessel terminal boards side#connector CH

145

1

146

2

147

3

148

4

149

5

150

6
13

C13

151

7

152

8

153

9

154

10

155

11

156

12

157

1

158

2

159

3

160

4

161

5

162

6
14

C14

163

7

164

8

165

9

166

10

167

11

168

12

169

1

170

2

171

3

172

4

173

5

174

6
15

C15

175

7

176

8

177

9

178

10

179

11

180

12

PIN

material

A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y
A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y
A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y

copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan

ch serial#connector model#

connectors on inner-vessel terminal boards side#connector CH

181

1

182

2

183

3

184

4

185

5

186
AFD56-16-26SN

6
16

C16

187

7

188

8

189

9

190

10

191

11

192

12

193

1

194

2

195

3

196

4

197

5

198
AFD56-16-26SN

6
17

C17

199

7

200

8

201

9

202

10

203

11

204

12

205

1

206

2

207

3

208

4

209

5

210
AFD56-16-26SN

6
18

A-3

C18

211

7

212

8

213

9

214

10

215

11

216

12

PIN

material

A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y
A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y
A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y

copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan

connector model#

AFD56-16-26SN

AFD56-16-26SN

AFD56-16-26SN

This may not be the latest edition.

Table A-1 Correspondence Table of Channels between Terminal Boards inside Vessel and Data Loggers（4/5）
ch serial#connectors on inner-vessel terminal boards side#connector

217

CH

1

218

2

219

3

220

4

221

5

222

6
19

C19

223

7

224

8

225

9

226

10

227

11

228

12

229

1

230

2

231

3

232

4

233

5

234

6
20

C20

235

7

236

8

237

9

238

10

239

11

240

12

241

1

242

2

243

3

244

4

245

5

246

6
21

C21

247

7

248

8

249

9

250

10

251

11

252

12

PIN

material

A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y
A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y
A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y

copperch serial#connector model#

constantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
coppercoppercopperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
coppercopper

255

3

256

4

257

5

258

6
C22

259

7

260

8

261

9

262

10

263

11

264

12

265

1

266

2

267

3

268

4

269

5
6
23

coppercopperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
coppercopper2

270

constantan

constantan

254

AFD56-16-26SN

constantan

7

272

8

273

9

274

10

275

11

276

12

277

1

278

2

279

3

280

4

281

5

282

6
24

copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan

A-4

C23

271

AFD56-16-26SN

constantan

CH

1

22

constantan

connector

253

AFD56-16-26SN

constantan

constantan

connectors on inner-vessel terminal boards side
#

C24

283

7

284

8

285

9

286

10

287

11

288

12

PIN

material

A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y
A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y
A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y

copperconnector model#

constantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copper

AFD56-16-26SN

constantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copper

AFD56-16-26SN

constantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan

AFD56-16-26SN

This may not be the latest edition.

Table A-1 Correspondence Table of Channels between Terminal Boards inside Vessel and Data Loggers（5/5）
ch serial#connectors on inner-vessel terminal boards side#connector CH

289

1

290

2

291

3

292

4

293

5

294

6
25

C25

295

7

296

8

297

9

298

10

299

11

300

12

301

1

302

2

303

3

304

4

305

5

306

6
26

C26

307

7

308

8

309

9

310

10

311

11

312

12

313

1

314

2

315

3

316

4

317

5

318

6
27

C27

319

7

320

8

321

9

322

10

323

11

324

12

PIN

material

A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y
A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y
A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y

copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan

ch serial#connector model#

connectors on inner-vessel terminal boards side#connector CH

325

1

326

2

327

3

328

4

329

5

330
AFD56-16-26SN

6
28

C28

331

7

332

8

333

9

334

10

335

11

336

12

337

1

338

2

339

3

340

4

341

5

342
AFD56-16-26SN

6
29

C29

343

7

344

8

345

9

346

10

347

11

348

12

349

1

350

2

351

3

352

4

353

5

354
AFD56-16-26SN

6
30

A-5

C30

355

7

356

8

357

9

358

10

359

11

360

12

PIN

material

A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y
A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y
A
B
D
C
F
E
H
G
c
J
K
R
M
L
N
P
S
T
U
V
W
X
Z
Y

copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan
copperconstantan

connector model#

AFD56-16-26SN

AFD56-16-26SN

AFD56-16-26SN