Application Note

Assembly Precautions
for the Nichia NFSWL11A-D6 LED

Table of contents
1.

LED Outline Dimensions/Tape and Reel Dimensions ・ ・ ・ ・ ・ ・ ・ ・ 2

2.

Handling Precautions

3.

Design Recommendations for Optimal Amount of Solder ・ ・ ・ ・ ・ 5-6

4.

Precautions when Soldering the Electrodes ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 7

5.

Precautions for Setting Up a Pick-and-Place Machine/Nozzle

6.

Precautions When Reflow Soldering

・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 3-4

・ ・ ・ 8-11

・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 11NFSWL11A-D6 refers to a Nichia part number. The Nichia part number within this document is merely
Nichia’s part number for the Nichia product and is not related nor bear resemblance to any othercompany’s product that might bear a trademark.
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia NFSWL11A-D6 LED
1. LED Outline Dimensions/Tape and Reel Dimensions
Table 1. NFSWL11A-D6 Product Specifications

Tape

1.1±0.05

Φ1.5 +0.1
-0

4±0.1

3.5 ±0.05

Cathode0.3 ±0.05

1.4 ±0.1

4±0.1

1.1±0.05

2±0.051.25±0.1

光学的中心位置
Location of the optical center

1.75±0.1

Embossed Carrier Tape

8±0.1

LED

Φ0.5 ±0.05(0.02 Crossbar Recess)1.24±0.08

1.25±0.1

ReelΦ180+0-3
9+1-0Cathode

Anode

A

0.9

K

Φ60 +1-0Cathode Mark

Label

0.25
0.9

11.4±1

Weight: typ. 0.024g

Reel Size: 3,000 LEDs

(Unit: mm, Tolerance: ±0.1mm)(Unit: mm)

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia NFSWL11A-D6 LED✔ Correct

2. Handling Precautions
2-1. Handling with Bare Hands
Do not handle the LEDs with bare hands:- this may contaminate the LED surface and have an effect on the optical characteristics,- this may cause the LED to deform causing a catastrophic failure (i.e. the LED not to illuminate),

2-2. Handling with Tweezers
The resin of this LED is very soft. The surface of the resin may be damaged (e.g. cut, scratch, chip, crack, delamination,and deformation) when it is touched while the LED is being handled. Also, if force is applied to the resin, it may cause acatastrophic failure; ensure that when handling the LED with tweezers, excessive force is not applied to the LED.

Incorrect

2-3. ESD Precautions
LEDs are sensitive to transient excessive voltages (e.g. ESD, lightning surge). If this excessive voltage occurs in thecircuit, it may cause the LED to be damaged causing issues (e.g. the LED to have a reduction in the radiant flux or not toilluminate [i.e. catastrophic failure]). When handling the LEDs, ensure that necessary measures have been taken toprotect them from transient excess voltages. Refer to the applicable specification for more details.

2-4. . Handling Assembled PCBs
The resin of this LED is very soft. The surface of the resin may be damaged (e.g. cut, scratch, chip, crack, delamination,and deformation) when it is touched while the LED is being handled. After soldering the LED to a PCB, ensure that theresin does not have contact with any object when handling the assembled PCBs. Also, do not stack assembled PCBs
together. Otherwise, it may cause damage to the resin (e.g. cut, scratch, chip, crack, removal from the PCB, etc.) causing
a catastrophic failure. Nichia recommends that assembled PCBs are stored in a PCB magazine rack, a PCB holder, etc.

✔ Correct

Incorrect

Figure 2. Figure 2. LED Whose
Resin Has Been Removed

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Figure 3. Stacking Assembled PCBs Together

Figure 1. Correct/Incorrect
Examples of Handling withTweezers

Figure 4. Assembled PCBs Stored in a PCB Holder

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Assembly Precautions for the Nichia NFSWL11A-D6 LED
2-5. Storage
The NFSWL11A LED is comparable to JEDEC Moisture Sensitivity Level (MSL) 2a or equivalent. Refer to IPC/JEDEC STD-020 for detailed information
regarding the MSL. Once the moisture-proof aluminum bag is open, ensure that the LED is soldered to a PCB within the range of the conditions below.
To store any remaining unused LEDs, use a hermetically sealed container with silica gel desiccants. Nichia recommends placing them back to theoriginal moisture-proof bag and reseal it.
Table 2. Storage Conditions
Conditions
Storage

Temperature

HumidityTime

Before Opening the Moisture-proof Aluminum Bag≤30ºC≤90%RHWithin 1 Year from Delivery Date

After Opening the Moisture-proof Aluminum Bag≤30ºC≤70%RHWithin 4 weeks

2-6. Packing Assembled PCBs
The resin of this LED is very soft; it may be removed from the PCB if it comes in contact with a packing material. When packing assembled PCBs fortransportation, it must be ensured that the resin will not have contact with any packing materials by using a tray, etc. that is designed accordingly. Do
not pack assembled PCBs directly into an antistatic bag or with antistatic bubble wrap.

Incorrect

Figure 5. Assembled PCB that is Wrappedwith Antistatic Bubble Wrap

Incorrect

Figure 6. Assembled PCB that isPacked in an Antistatic Bag✔ Correct

Figure 7. Example of a Tray

2-7. Repair/Rework for Assembled PCBs
The electrodes of this LED are very small; once the LEDs are soldered to a PCB, Nichia does not recommend repairing/reworking the assembled PCBs. If
it must be done, ensure that it is done properly (i.e. the amount of solder, LED mounting technique, temperature control, etc. are appropriate).
Otherwise, it may cause a solder joint failure, tilted LED on the PCB, discoloration of the PCB, etc.
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia NFSWL11A-D6 LED
3. Design Recommendations for Optimal Amount of Solder
Soldering Pad Pattern/Metal Solder Stencil Aperture
3-1. PCB to assemble the LED
This LED has a wide directivity; light emitted fromthe LED hits the PCB and/or solder resist and it may
cause the PCB/solder resist to discolor, crack, etc.
around the soldering pad pattern. When selecting a
PCB and solder resist, perform a sufficientverification in advance with theconditions/environments in which the chosen
application containing the LED will actually be used.

PCB Used

Table 3. Evaluation Result for the Appearance of PCBs after High
Temperature Operation (For Reference Purposes)

High Temperature Operation: 100ºC, IF=250mA
0h

500h

FR4/CEM3• The PCB base material was slightly
discolored.
• Results will vary depending on thecopper layer design (i.e. SMD vs
NSMD)1.
• If an FR4/CEM3 PCB is used for theLEDs under high temperatures, thebase material may significantly discolor.

Flexible• The PCB base material was
significantly discolored.
• The PCB base material discoloredeven at room temperature.
• Do not use a flexible PCB for this LED.

Directivity1-20°

Radiation Angle

-30°

-10°

0°

10°

20°
30°

-40°

40°

-50°

50°

-60°

60°

-70°

70°

-80°

80°

-90°

90°

Figure 8. Directivity

Comments

1000h

1 Nichia recommends Solder Mask Defined (SMD) for the copper layer design.

Table 4. Evaluation Result for the Appearance of Solder Resist after High Temperature Operation(For Reference Purposes)
Solder Resist
Used

High Temperature Operation: 100ºC, IF=250mA
0h

500h

1000h

Comments

Alkaline
Developable• The solder resist was slightly
discolored.
• Nichia recommends using a highreflective and light-resistant solder
resist.

UV curable• The solder resist was significantly
discolored.
• Nichia does not recommend using
UV curable solder resist.

Figure 9. Illuminated LEDs

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Assembly Precautions for the Nichia NFSWL11A-D6 LED
3-2. Design Recommendations for Optimal Amount of Solder Soldering Pad Pattern/Metal Solder Stencil Aperture
Table 5. Recommended Soldering Pad Pattern/
Metal Solder Stencil Aperture

Recommended Soldering
Pad Pattern--- LED Outline + Electrodes■ Soldering Pad Pattern■ Metal Solder Stencil Aperture

Table 6. Recommended Solder/Metal Solder Stencil Conditions

Recommended Metal Solder
Stencil Aperture

Item

Recommended
Conditions

0.81

Metal Solder Stencil(Thickness)

100μm

Solder Paste (Composition)

Sn-3.0Ag-0.5Cu

0.9

0.65

1

CathodeAnode
0.25(Unit: mm)

Soldering padpattern
Solder Mask

0.35
(Unit: mm)
Solder Mask Defined (SMD)(Recommended)

Non-solder Mask Defined(NSMD)

Figure 10.Copper Layer Designs to Create the Soldering Pad Pattern•

The recommended soldering pad pattern, metal solder stencil aperture, and thickness of the metal solder stencil provided in Tables 5 and 6 havebeen determined under Nichia’s conditions: ensure that there are no issues with the chosen assembly conditions prior to use.

•

If a soldering pad pattern that is different from Nichia's recommendation (see Table 5) is used, the distance between the anode and cathode should
be as recommended (i.e. 0.25mm). Otherwise, it may cause a solder joint failure leading to emission failure and/or a performance/reliability
degradation of the LEDs.

•

There are two types of copper layer designs to create the soldering pad pattern: Non-Solder Mask Defined (NSMD) and Solder Mask Defined(SMD). For this LED, Nichia recommends SMD to protect the PCB from the light that hits the PCB.
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Assembly Precautions for the Nichia NFSWL11A-D6 LED
4. Precautions when Soldering the Electrodes
4-1. Electrodes of the LED

This LED has large electrodes to improve the placement accuracy (see Figure 11); if solder paste is not applied to a sufficient area between
the electrodes and soldering pad pattern, it may cause the heat dissipation performance of the LED to be reduced resulting in reduced
reliability (see Figure 12). To achieve the performance that is specified in the applicable specification of the LED, ensure that the electrodes
are soldered to the PCB properly.

✔ Correct

Electrode

Incorrect：Thermal path

LED chipElectrode
Solder
Soldering Pad Pattern
PCB

Figure 11. Appearance of the Electrodes

Figure 12. LED Heat Dissipation Reference Images for the LED

4-2. Recommended Ratio of the Solder Joint Area to the Area of the ElectrodeTo achieve the specification’s performance for the LED, Nichia recommends each of the electrodes is soldered
to the PCB with solder paste covering ≥75% of the electrode. Ensure that an adequate area is covered bysolder paste using an X-ray examination, etc. The ratio of the solder joint area to the area of the electrode iscalculated using the equation below.

：Electrodes：Soldering Area
：Solder Voids

Ratio of the solder joint area to the area of the electrode = Area of the solder joint except for non-bondingarea (e.g. voids)/Area of the electrode × 100
Nichia did not confirm any solder joint failure leading to a performance/reliability degradation of the LEDs
under Nichia’s evaluation conditions. Perform a verification with the chosen conditions to ensure that the ratioof the solder joint area to the area of the electrode is sufficient.
Figure 13. Example of an X-ray Image
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Assembly Precautions for the Nichia NFSWL11A-D6 LED
5. Precautions for Setting Up a Pick-and-Place Machine/Nozzle
Table 7. Cautions/Suggestions for Setting Up Equipment

Recommended
Conditions/Specifications

Item

Cautions/Suggestions

Pick-and-Place Machine

Modular mounter

The recommended conditions/specifications herein have been
determined using YS100 High-Speed General-Purpose Modular(manufactured by Yamaha Motor Co., Ltd.).

Pick-and-Place Nozzle

Use a nozzle that is appropriate for thedimensions of the LED.

See “5-1. Pick-and-Place Nozzle” on Page 9 for details.

Tape-and-Reel Feeder

Electrical (motorized) feeder
Tape width: 8mm
Feeder pitch: 4mm

See “5-2. Tape-and-Reel Feeder” on Page 9 for details.

Top Cover Tape Removal
Position

Sufficiently far away from the LED pickup position.

Nozzle Height for Pick-up
Operations

The contact surface of the nozzle headfor pick operations should be adjusted
to the height of the edge of theembossed carrier tape pocket.

See “5-3. Recommended Nozzle Height for Pick-up Operations” on
Page 10 for details.

Nozzle Height for Placement
Operations (i.e. Placement
Depth)

0.2mm for placement depth

See “5-4. Recommended Nozzle Height for Placement Operations(Placement Depth)” on Page 10 for details.

Imaging-based Automatic
Inspection

To locate the center of the LED, using
the outline as a reference isrecommended.

See "5-5. Imaging-based Automatic Inspection" on Page 10 for details.

See “5-2. Tape-and-Reel Feeder” on Page 9 for details.

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Assembly Precautions for the Nichia NFSWL11A-D6 LED
5-1. Pick-and-Place Nozzle✔ Correct

Incorrect

Incorrect

1. Use a pick-and-place nozzle that is smaller than the outline dimensionsof the LED (i.e. 1.1mm x 1.1mm). Ensure that the LED is picked up at thecenter of the emitting surface.
2．If the size and shape of the nozzle tip are not appropriate for the LED or
if the nozzle does not pick up the LED at the center of the emitting
surface, this may damage the LED (i.e. chipped, deformed, etc.) and/or
lead to an incorrect pick up (i.e. the LED is picked up in a tilted position).

Figure 14. Examples of Correct/Incorrect Nozzle Dimensions

5-2. Tape-and-Reel Feeder
It is recommended to remove the top cover tapeat a point sufficiently far away from the LED pick-up position.

3． Ensure that the maximum force applied to the LED during the pick-up
and placement operations does not exceed 5N.

1. For the tape-and-reel feeder, the tape width is set to 8mm and thefeeder pitch is set to 4mm.
2. Use a tape-and-reel feeder that ensures it does not create excessive
vibrations causing assembly issues (e.g. an electrical [motorized] feeder).
・ When the tape feeder feed rate is fast, the LEDs in the embossed carrier
tape pockets may not be in the correct position when picked by thenozzle; it may be improved by reducing the tape feeder feed rate.
3. It is recommended to remove the top cover tape at a point sufficiently
far away from the LED pick-up position.

Feed Speed: Slow Vibration: Small

LED Pick-up
Position

Figure 15. Top Cover Tape Removal Position
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Assembly Precautions for the Nichia NFSWL11A-D6 LED
5-3. Recommended Nozzle Height for Pick-up Operations

1. Ensure that the nozzle only goes down to the top edge of the tape pocket
and does not directly come into contact with the LED.

Pick-and-Place Nozzle

Nozzle Height

Note: The reference level for the nozzle setting is at the top edge of thetape pocket.
2. The recommended nozzle height for pick-up operations has been
determined by Nichia under the verification conditions and may not
function as expected with some other pick-and-place machines. If the pickup operations are unstable even with using the recommended nozzle
height, adjust the nozzle height appropriate for the pick-and-place machine
being used.
If the pick point of the nozzle is too high,-it may cause insufficient suction power leading to picking errors (e.g. thenozzle’s failure to pick/lift the LED into the air, incorrect picking causing
the LED to tilt when in the air).

LED
Embossed Carrier Tape (Pocket)

If the pick point of the nozzle is too low,

Figure 16. Recommended Nozzle Height for Pick-up Operations-it may cause issues (e.g. causing the embossed carrier tape to shake,causing the tape pocket to deform) leading to picking failure and/or
damage to the LED.

5-4. Recommended Nozzle Height for Placement
Operations (Placement Depth)
Pick-and-Place Nozzle

1. After the LED is mounted onto solder paste on the PCB, the nozzle should
further press the LED 0.2mm into the PCB.
If the release point of the nozzle is too high,-it may cause placement issues (e.g. the LED to stick to the nozzle after
placement, the LED to become soldered to the PCB in a tilted position,etc.).

Placement Depth: 0.2mm

If the release point of the nozzle is too low,LED

-excessive forces may be applied to the LED during placement and it may
cause the LED to become damaged.

PCB

Figure 17. Recommended Nozzle Height for Placement (Placement Depth)
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Assembly Precautions for the Nichia NFSWL11A-D6 LED
5-5. Imaging-based Automatic Inspection✔ Correct

1. Nichia recommends using the outlines of the LED as a reference to locate thecenter of the LED.

Incorrect

2. If the imaging device has trouble detecting/recognizing the LED, adjust thesettings (i.e. the brightness of the light, etc.) of the pick-and-place machine.

OutlineElectrodes

Figure 18. Correct/Incorrect reference Points to Locate the Center of theLED

6. Precautions When Reflow Soldering

1 to 5°C per sec
Pre-heat
180 to 200°C

1. Reflow soldering must not be performed more than twice.

2. Using the recommended reflow soldering conditions (See Figure 19 to theleft) as a reference, modify if necessary, the recommended reflow conditions
specified by the manufacturer of the solder paste being used.
260°CMax
10sec Max

60sec Max
Above 220°C
120sec Max

Figure 19. Recommended Reflow Soldering
Condition (Lead-free Solder)Note:
To ensure that these reflow conditions have no negative effect on theLEDs, perform sufficient verification prior to use.
3. When cooling the LEDs from the peak temperature a gradual cooling slope isrecommended; do not cool the LEDs rapidly.
4. During reflow soldering, the heat and atmosphere in the reflow oven may
cause the optical characteristics to degrade. In particular, reflow soldering
performed with an air atmosphere may have a greater negative effect on the
optical characteristics than if a nitrogen atmosphere is used; Nichia
recommends using a nitrogen reflow atmosphere.
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Assembly Precautions for the Nichia NFSWL11A-D6 LED

Disclaimer
This application note is a controlled document of Nichia Corporation (Nichia) published to provide technical information/data forreference purposes only. By using this application note, the user agrees to the following:• This application note has been prepared solely for reference on the subject matters incorporated within it and Nichia makes noguarantee that customers will see the same results for their chosen application.
• The information/data contained herein are only typical examples of performances and/or applications for the product. Nichia
does not provide any guarantees or grant any license under or immunity from any intellectual property rights or other rights
held by Nichia or third parties.
• Nichia makes no representation or warranty, express or implied, as to the accuracy, completeness or usefulness of any
information contained herein. In addition, Nichia shall not be liable for any damages or losses arising out of exploiting, using,or downloading or otherwise this document, or any other acts associated with this document.
• The content of this application note may be changed without any prior or subsequent notice.
• Copyrights and all other rights regarding the content of this document are reserved by Nichia or the right holders who havepermitted Nichia to use the content. Without prior written consent of Nichia, republication, reproduction, and/or redistributionof the content of this document in any form or by any means, whether in whole or in part, including modifications or derivative
works hereof, is strictly prohibited.

491 Oka, Kaminaka-Cho, Anan-Shi,
TOKUSHIMA 774-8601, JAPAN
Phone: +81-884-22-2311 Fax: +81-884-21-0148

NICHIA CORPORATION
http://www.nichia.co.jp

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