Application Note

Assembly Precautions
for the NVSW719AC LEDs
Table of Contents
1. LED Outline Dimensions/Tape Dimensions ・ ・ ・ ・ 2
2. Handling Precautions ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 3
3. Design Recommendations for Optimal
Amount of Solder ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 4
4. Precautions for Setting Up a Pick-and-Place
Machine/Nozzle ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 5-8
5. Precautions When Reflow Soldering

・ ・ ・ ・ ・ ・ 9

The Nichia part number NVSW719AC within this document is merely Nichia’s part number forthis Nichia product and is not related nor bears resemblance to any other company’s productthat might bear a trademark.
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the NVSW719AC LEDs

1. LED Outline Dimensions/Tape Dimensions
Table 1. Product Specifications
LEDEmbossed Carrier Tape

Cathode Mark5.5±0.05

3.52

Cathode Mark

0.42

Φ1.5+0.2-0(0.02 クロスバー凹部)(0.02 Crossbar Recess)

0.88

3.5

0.2±0.05
3.73 ±0.1

2±0.05 4±0.112 ±0.18±0.1

Φ1.5+0.1-0

1.75±0.1

テーピング部 Tape

光学的中心位置
Location of the optical center

1.25 ±0.1

3.73 ±0.1

180+0-3
13 +1-03.20.50.45
A

保護素子
Protection Device

3.22.4K

Φ60 +1-01.3

ダイヒートシンク
Die Heat Sink

CathodeAnodeダイヒートシンク
Die Heat Sink

ラベル
Label

15.4±1

Weight: typ. 0.030g

Reel Size: 1,600 LEDs

(Unit: mm, Tolerance: ±0.2mm)(Unit: mm)
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the NVSW719AC LEDs

2. Handling Precautions
2-1. Handling with Bare Hands

Do not handle the LEDs with bare hands:- this may contaminate the LED surface and have an effect on the optical characteristics,- this may cause the LED to deform and/or the internal connection to fail causing a catastrophic failure (i.e. the LED notto illuminate).

✔ Correct

2-2. Handling with Tweezers

Ensure that when handling the LEDs with tweezers, excessive force is not applied to the LED. Otherwise, it may cause
damage to the resin (e.g. cut, scratch, chip, crack, delamination and deformation) and/or the internal connection to failcausing a catastrophic failure.

Incorrect

2-3. ESD Precautions

The LEDs are sensitive to transient excessive voltages (e.g. ESD, lightning surge). If this excessive voltage occurs in thecircuit, it may cause the LED to be damaged causing issues (e.g. the LED to become dimmer or not to illuminate [i.e.
catastrophic failure]). When handling the LEDs, ensure that necessary measures have been taken to protect them fromtransient excess voltages. Refer to the applicable specification for more details.

2-4. Stacking Assembled PCBs Together

Do not stack assembled PCBs together. Otherwise, it may cause damage to the resin (e.g. cut, scratch, chip, crack,delamination and deformation) and the internal connection to fail causing a catastrophic failure.

Figure 1. Correct/Incorrect
Examples of Handling withTweezers

2-5. Storage

The storage/packaging requirements for this LED are comparable to JEDEC Moisture Sensitivity Level (MSL) 3 orequivalent. Nichia used IPC/JEDEC STD-020 as a reference to rate the MSL of this LED. If the “After Opening” storage
time has been exceeded or any pink silica gel beads are found, ensure that the LED are baked before use. Baking should
only be done once.

Table 2. Storage Conditions
Conditions
Storage

Temperature

HumidityTime

Before Opening the Moisture-proof Aluminum Bag≤30ºC≤90%RHWithin 1 Year from Delivery Date

After Opening the Moisture-proof Aluminum Bag≤30ºC≤70%RHWithin 168 Hours

65±5°C-Baking (Remove the reel of the LEDs from the moisture-proof
aluminum bag for baking)Light Emitting Diode≥24 Hours

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the NVSW719AC LEDs

3. Design Recommendations for Optimal Amount of Solder
Soldering Pad Pattern/Metal Solder Stencil Aperture

Table 3. Recommended Soldering Pad Pattern/Metal Solder Stencil Aperture

Table 4. Recommended Solder/Metal Solder Stencil Conditions
Item

Recommended Conditions

Metal Solder
Stencil (Thickness)

120 (μm)

Solder Paste(Composition)

Sn-3.0Ag-0.5Cu

1.2
2.4

4.1
3
2.5
0.8

2.1

4.1
3.3
2.3
1.3

1.2

Recommended Metal SolderStencil Aperture

3.3

Recommended Soldering
Pad Pattern--- LED Outline + Electrodes■ Soldering Pad Pattern■ Metal Solder Stencil Aperture
CathodeDie Heat Sink

Anode

(Unit: mm)(Unit: mm)

The recommended soldering pad pattern, metal solder stencil aperture, and thickness of the metal solder stencil
provided in Tables 3 and 4 have been determined under Nichia’s conditions: ensure that there are no issues with thechosen assembly conditions prior to use.

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the NVSW719AC LEDs

4. Precautions for Setting Up a Pick-and-Place Machine/Nozzle
Table 5. Cautions/Suggestions for Setting Up Equipment
Recommended
Conditions/Specifications

Item

Cautions/Suggestions

Pick-and-Place Machine

Modular mounter

The recommended conditions/specifications herein have been
determined using YS100 High-Speed General-Purpose Modular(manufactured by Yamaha Motor Co., Ltd.).

Pick-and-Place Nozzle

Use a nozzle that is specificallydesigned for the LED.

See “4-1. Pick-and-Place Nozzle” on Page 6 for details.

Tape-and-Reel Feeder

Electrical (motorized) feeder
Tape width: 12mm
Feeder pitch: 8mm

See “4-2. Tape-and-Reel Feeder” on Page 7 for the details.

Nozzle Height for Pick-upOperations

The contact surface of the nozzle headfor pick operations should be adjusted
to 0.35mm below the edge of theembossed carrier tape pocket.

See “4-3. Recommended Nozzle Height for Pick-up Operations” onPage 8 for the details.

Nozzle Height for Placement
Operations (i.e. Placement
Depth)

0.2mm for placement depth

See “4-4. Recommended Nozzle Height for Placement Operations(Placement Depth)” on Page 8 for the details.

Imaging-based AutomaticInspection

Using the electrode as a reference isrecommended to locate the center ofthe LED.

See "4-5. Imaging-based Automatic Inspection" on Page 9 for thedetails.

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the NVSW719AC LEDs

4-1. Pick-and-Place Nozzle：Pick-and-Place Nozzle

Emitting Area4✔ Correct

Incorrect

Incorrect

Φ1Φ1.5⇒ The LED may be
picked up in atilted position.

(単位 Unit: mm)

Φ3(Unit: mm)

Figure 2. Recommended Nozzle Tip⇒ The LED may bechipped.

Figure 3. Examples of Correct/Incorrect LED Pick-up Positions

1. Figure 2 shows the nozzle tip Nichia recommends.
2. If the LED pick-up position is far from the center of the emitting area or if the size and/or shape of the pick-and-placenozzle being used is inappropriate, it may cause the LED to be picked up in a tilted position and/or chipped; see Figure 3.
3. Ensure that the maximum force applied to the LED during the pick-up and placement operations does not exceed 5N.

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the NVSW719AC LEDs

4-2. Tape-and-Reel Feeder✔

Recommended Top CoverTape Removal Position

Correct
Feed Speed: Slow Vibration: Small

LED Pick-up
Position

Top Cover Tape
Removal Position

Incorrect
Feed Speed: Fast Vibration: Large

LED Pick-up
Position

Figure 4. Recommended/Not Recommended Top
Cover Tape Removal Positions
1. For the tape-and-reel feeder, the tape width is set to 12mm and the feeder pitch is set to 8mm.
2. Use a tape-and-reel feeder that ensures it does not create excessive vibrations causing assembly issues.
Example: Electric (motorized) feeder
3. It is recommended to remove the top cover tape at the recommended position shown in Figure 4(i.e. immediately before LED pick-up).
・If the top cover tape is removed at a point far away from the LED pick-up position, it may cause the LED
to be damaged and/or picked up in a tilted position.

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the NVSW719AC LEDs

4-3. Recommended Nozzle Height for Pick-up Operations
Pick-and-Place
NozzleEmbossed Carrier
Tape

LED

0.35mmRecommended
Nozzle Height

Figure 5. Recommended Nozzle Height for
Pick-up Operations

1. Ensure that the nozzle goes down onto the LED in the tape pocket until thetip touches the emitting surface of the LED. Pick-up depth: 0.35mm
Note: If the reference level for the nozzle setting is at the edge of the tapepocket.

2. The recommended nozzle height for pick-up operations has been
determined by Nichia under the verification conditions (See Table 5) andmay not function as expected with some other pick-and-place machines. If
the pick-up operations are unstable even with using the recommended
nozzle height, adjust the nozzle height appropriate for the pick-and-placemachine being used.
If the pick point of the nozzle is too high,- it may cause insufficient suction power leading to picking errors (e.g. thenozzle’s failure to pick/lift the LED into the air, incorrect picking causing
the LED to tilt when in the air).
If the pick point of the nozzle is too low,
- it may cause issues (e.g. causing the embossed carrier tape to shake,causing the tape pocket to deform) leading to picking failure.

4-4. Recommended Nozzle Height for Placement Operations (Placement Depth)
Pick-and-Place Nozzle

LEDPCB

Placement Depth
0.2mm

Figure 6. Recommended Nozzle Height for Placement(Placement Depth)Light Emitting Diode

1. The nozzle should further press the LED 0.2mm onto the PCB from theheight where the LED first touches solder paste.
If the release point of the nozzle is too high,- it may cause placement issues (e.g. the LED to stick to the nozzle afterplacement, the LED to be mounted in an incorrect place/rotatedposition, the LED to become soldered to the PCB in a tilted position,etc.).
If the release point of the nozzle is too low,
- excessive forces may be applied to the LED during placement and it
may cause the LED to become damaged.
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the NVSW719AC LEDs

4-5. Imaging-based Automatic Inspection
Electrode Location
Detection/Recognition Points

1. Nichia recommends using the electrodes as a reference to locate
the center of the LED.
2. If the imaging device has trouble detecting/recognizing theelectrodes, adjust the settings (i.e. the brightness of the light, etc.)of the pick-and-place machine.

Figure 7. Recommended Reference Points toDetect, Recognize, or Locate the Electrodes

5. Precautions When Reflow Soldering

1~5℃/secPre-heat180~200℃

260℃ Max
10sec Max

220℃ Max
60sec Max

120sec Max

Figure 8. Recommended Reflow Soldering Condition(Lead-free Solder)

1. Reflow soldering must not be performed more than twice.
2. Nichia recommends using the reflow soldering conditions detailedin Figure 8 to the left; use the recommended reflow conditions
specified by the manufacturer of the solder paste being used if itworks better for the chosen application.
Note: To ensure that these reflow conditions have no negative
effect on the LEDs, perform sufficient verification prior to use.
3. When cooling the LEDs from the peak temperature a gradualcooling slope is recommended; do not cool the LEDs rapidly.
4. During reflow soldering, the heat and atmosphere in the reflow
oven may cause the optical characteristics to degrade. In particular,
reflow soldering performed with an air atmosphere may have agreater negative effect on the optical characteristics than if anitrogen atmosphere is used; Nichia recommends using a nitrogen
reflow atmosphere.
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the NVSW719AC LEDsDisclaimer
This application note is a controlled document of Nichia Corporation (Nichia) published to provide technical information/data forreference purposes only. By using this application note, the user agrees to the following:• This application note has been prepared solely for reference on the subject matters incorporated within it and Nichia makes noguarantee that customers will see the same results for their chosen application.
• The information/data contained herein are only typical examples of performances and/or applications for the product. Nichia
does not provide any guarantees or grant any license under or immunity from any intellectual property rights or other rights
held by Nichia or third parties.
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works hereof, is strictly prohibited.

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TOKUSHIMA 774-8601, JAPAN
Phone: +81-884-22-2311 Fax: +81-884-21-0148NICHIA CORPORATION
http://www.nichia.co.jp

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