Application Note

Assembly Precautions
for the Nichia 270B Series LEDs
Table of Contents
1. LED Outline Dimensions/Tape Dimensions

2. Handling Precautions

・ ・ ・ ・ ・ ・ ・ ・ ・ 2-5

・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 6

3. Design Recommendations for Optimal Amount of Solder
4. Precautions for Setting Up a Pick-and-Place Machine/Nozzle
5. Precautions When Reflow Soldering
6. Evaluation of the Effect of Solder Volume

・ ・ ・ ・ ・ 7
・ ・ 8-11・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 12
・ ・ ・ ・ ・ ・ ・ ・ ・ 13-17

The Nichia part numbers NJ2W270B(-PF) and NJ3W270B(-PF) within this document are merely Nichia’s part numbers for thoseNichia products and are not related nor bear resemblance to any other company’s product that might bear a trademark.
This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

1/18

SP-QR-C2-201362-2
Mar. 3, 2022

Assembly Precautions for the Nichia 270B Series LEDs

1. LED Outline Dimensions/Tape Dimensions
Table 1. NJ2W270B Product Specifications

B

0.14

B 1
0.14

(単位
mm)
(単位 Unit:mm,
Tolerance:
±0.1)
(単位
Unit:±0.1)mm)(単位
Unit:公差mm,
公差Unit:Tolerance:

3.5-0Φ1.5+0.1

8±0.1

Cathode

0.14

A

0.14

A 1
0.14

A

A
CathodeCathode

Anode

B

0.3

B0.3

0.4

項目 ItemAnode Anode

B

パッケージ材質
Package
項目 Item
項目 Materials
Itemcathode faces the feeding direction of the tape as shown in the

内容 Description
セラミックス
内容 Description
内容Ceramics
Description

figure above.

蛍光体板材質パッケージ材質
セラミックスパッケージ材質
セラミックス
蛍光体セラミックス
Phosphor
sheetMaterials
Package
Ceramics
Package
Materials
Ceramics
Phosphor
Ceramics
Materials
蛍光体板材質
蛍光体板材質蛍光体セラミックス
蛍光体セラミックス
封止樹脂材質Phosphor
Phosphor
sheet sheet
シリコーン樹脂
Phosphor
Ceramics
Phosphor
Ceramics
Encapsulating
Resin
Materials
Materials
Silicone Resin
Materials
トレーラ部最小160mm（空部）
封止樹脂材質
封止樹脂材質シリコーン樹脂
シリコーン樹脂
電極材質
金メッキ
Encapsulating
Encapsulating
Resin Resin
Trailer 160mm MIN(Empty Pockets)
Silicone
Silicone
Resin Resin
Electrodes
Materials
Au-plated
Materials
Materials

3.5

3.5

3.3

3.5

3.3

Reel Size: 2,000 LEDs

3.3

0.99±0.1

トレーラ部/リーダ部 Trailer and Leader
Direction of the LED in the embossed carrier tape pocket: the

2

0.3

A

A

Φ1.5+0.2

Feeding
Direction

0.2±0.05

3.7±0.1
0.75±0.05

0.4
0.4

Cathode0.75±0.05
0.75±0.05(0.02 クロスバー凹部)(0.02 Crossbar Recess)

3.5
ダイヒートシンク
Chip
Heatsink
Die Heat
Sink
3.5
3.5
ダイヒートシンク
ダイヒートシンク
Die
Heat Sink
Die HeatSink

2±0.05 4±0.1

3.7±0.1B

1.8±0.05

1.8±0.05
1.8±0.05

3.5
3.5

テーピング部 Tape

0.14

3.5

0.6±0.05
0.6±0.05

Embossed Carrier Tape

(単位 NJ2W270B
Unit:±0.1)mm)(単位 Unit: mm, 公差 Tolerance:
NJ2W270B
管理番号管理番号
No. STS-DA7-13889B
No. STS-DA7-13889B

1.75±0.1

3.5* 本製品はRoHS指令に適合しております。
* 本製品はRoHS指令に適合しております。
This productcomplieswith RoHS
This productcomplies
withDirective.
RoHS Directive.
0.6±0.05
3.5

NJ2W270B
管理番号 No. STS-DA7-13889B

LED

5.5±0.05
12+0.3-0.1* 本製品はRoHS指令に適合しております。
This product complies with RoHS Directive.

LED装着部
Loaded Pockets(Unit: mm)

引き出し部最小100mm（空Leader with Top Cover
100mm MIN(Empty Poc

1）The deviation of the center of the emitting area from the center of theelectrodes is ≤ ±0.07mm in both the lateral and longitudinal direction.
リーダ部最小402）The deviation of the center of the LED package from the centerof theLeader without Top Cover
リール部
Reel is ≤ ±0.15mm in both the lateral and longitudinal direction.
electrodes(Unit: mm, Tolerance: ±0.1mm)

ダイヒートシンク材質
金メッキ
電極材質
金メッキ 金メッキ
Die電極材質
Heat Sink
Electrodes
Materials Au-plated
Au-plated
Electrodes
Materials
Au-plated
Materials
ダイヒートシンク材質
ダイヒートシンク材質
質量
金メッキ 金メッキ
Die
Heat Sink
0.022g(TYP)
Die Weight
Heat
Sink
Au-plated
Au-plated
Materials
Materials
A 2* バリは寸法に含まないものとします。
質量 do 質量
Dimensions
not include moldflash.
0.022g(TYP)
0.022g(TYP)
Weight WeightA
A0.3* バリは寸法に含まないものとします。
* バリは寸法に含まないものとします。
Dimensions
do not include
mold flash.
Dimensions
do not include
mold flash.

Weight: typ. 0.022g

1

0.3

2.12
B
BK
K

B

3.3
1

1

2.12

2.12

3.3

3.3

K

0.3

A

A

Light Emitting Diode

13+1
-0

2/18
Φ

保護素子

180+0
-3

This document contains tentative information, Nichia may change the contents without notice.

A* 数量は1リールにつき2000個入りです
SP-QR-C2-201362-2
Reel Size: 2000pcs
Mar. 3, 2022
* 実装作業の中断などでエンボスキャリア

Assembly Precautions for the Nichia 270B Series LEDs

1. LED Outline Dimensions/Tape Dimensions
Table 2. NJ3W270B Product Specifications
LED* 本製品はRoHS指令に適合しております。
product complies with RoHS Directive.
* 本製品はRoHS指令に適合しております。
* This
本製品はRoHS指令に適合しております。
product
complies
with
RoHS
Directive.
ThisThis
product
complies
with
RoHS
Directive.
3.5
3.5
3.5
0.6±0.05

3.53.53.5

3.33.33.3(0.02 クロスバー凹部)(0.02 Crossbar Recess)Φ1.5+0.2

Feeding
Direction

3.7±0.1

0.2±0.05

0.99±0.1

0.75±0.05

3.7±0.1

Anode
Anode
Anode

A A

2±0.05 4±0.1

5.5±0.05
12+0.3-0.1

2.7±0.05
2.7±0.05
0.40.40.4
0.75±0.05
0.75±0.05

A
0.14
0.14
0.14A 1
A

CathodeCathodeCathodeA

8±0.1

Cathode2.7±0.05

3.53.53.5-0
Φ1.5+0.1

1.75±0.1

テーピング部 TapeB
0.14
0.14B 1B
0.14

0.6±0.05
0.6±0.05

3.5
3.53.5ダイヒートシンク
Chip
Heatsink
Die Heat Sink
ダイヒートシンク
ダイヒートシンク
DieDie
Heat
Sink
Heat
Sink

Embossed Carrier Tape

NJ3W270B
管理番号 No. STS-DA7-13894B
NJ3W270B
NJ3W270B
STS-DA7-13894B
管理番号
STS-DA7-13894B
管理番号
No.No.
mm)(単位 Unit:±0.1)(単位 Unit: mm, 公差 Tolerance:
(単位
Unit:
mm)
(単位
Unit:
mm)
(単位
Unit:
mm,
Tolerance:
±0.1)
(単位
Unit:
mm,
公差公差
Tolerance:±0.1)

トレーラ部/リーダ部 Trailer and Leader
Direction of the LED in the embossed carrier tape pocket: theB 2
0.3
0.3 0.3B B

cathode faces the feeding direction of the tape as shown in the
項目 Item
項目項目
Item
Item
パッケージ材質
Materials
Package
パッケージ材質
パッケージ材質
Package
Materials
Package
Materials
蛍光体板材質sheet
Phosphor
蛍光体板材質
蛍光体板材質Materials
Phosphorsheet
Phosphor
sheet
Materials
Materials
封止樹脂材質Resin
Encapsulating
封止樹脂材質
封止樹脂材質Materials Resin
Encapsulating
Encapsulating
Resin
Materials
Materials
電極材質

内容 Description
内容内容
Description
Description
セラミックス
Ceramics
セラミックスセラミックス
Ceramics
Ceramics
蛍光体セラミックス
Ceramics
Phosphor
蛍光体セラミックス
蛍光体セラミックス
Phosphor
Ceramics
Phosphor
Ceramics

figure above.

Reel Size: 2,000 LEDs

シリコーン樹脂
Resin
Silicone
シリコーン樹脂
シリコーン樹脂
トレーラ部最小160mm（空部）
Silicone
Resin
Silicone
Resin
Trailer 160mm MIN(Empty Pockets)
金メッキ
Au-plated
金メッキ
金メッキ
Au-plated
Au-plated
金メッキ
Au-plated
金メッキ
金メッキ
Au-plated
Au-plated

Materials
Electrodes
電極材質
電極材質
Electrodes
Materials
ダイヒートシンク材質
Electrodes
Materials
Die Heat Sink
ダイヒートシンク材質
ダイヒートシンク材質
Materials
Die Die
Heat
SinkSink
Heat
Materials
質量
Materials
0.022g(TYP)
Weight
質量
A 2
0.3
質量
0.022g(TYP)
0.022g(TYP)
WeightWeight0.3 0.3A A * バリは寸法に含まないものとします。
do not include mold flash.
バリは寸法に含まないものとします。
* Dimensions* バリは寸法に含まないものとします。
Dimensions
do notincludemold
flash.
Dimensions
do notincludemold
flash.

(Unit: mm)
LED装着部
Loaded Pockets

引き出し部最小100mm（空Leader with Top Cover
100mm1）The deviation of the center of the emitting area from the centerof the MIN(Empty Po

electrodes is ≤ ±0.07mm in both the lateral and longitudinal direction.
2）The deviation of the center of the LED package from the center of the リーダ部最小40
Leader without Top Coverelectrodes
リール部
Reel is ≤ ±0.15mm in both the lateral and longitudinal direction.
(Unit: mm, Tolerance: ±0.1mm)
Weight: typ. 0.022g

1
1 1
2.12
B
B B
K
K K

2.12
3.32.123.33.3A
A A

Light Emitting Diode

180+0
-3
This document contains tentative information, Nichia may change the contents without notice.
13+1
-0

3/18

* 数量は1リールにつき2000個入りです
SP-QR-C2-201362-2
Reel Size: 2000pcs
Mar. 3, 2022

Φ

Assembly Precautions for the Nichia 270B Series LEDs

1. LED Outline Dimensions/Tape Dimensions* 本製品はRoHS指令に適合しております。

* This
本製品はRoHS指令に適合しております。
Directive.
complies with RoHS
Table
3.product
NJ2W270B-PF
Product
Specifications

mm)(単位(単位Unit:
Unit:
mm)
±0.1)
(単位
(単位Unit:
Unit:mm,mm, 公差公差Tolerance:
Tolerance:±0.1)

テーピング部 Tape

1.8±0.05
1.8±0.05
1.8±0.05
1.8±0.05
2.4 2.42.4
2.4

3.5 3.53.5
3.5
2
2 2
2

0.7
0.7

A
CathodeCathode0.14
0.14AA 1

0.4 0.40.4
0.4
0.75±0.05
0.75±0.05
0.75±0.05
0.75±0.05

Anode
Anode

3.3 3.33.3
3.3

B
B

BB

0.3 B 20.3 B

0.3
0.3 BB

0.3
0.3 AAA

Φ1.5+0.2

Feeding
Direction

0.99±0.1

Direction of the LED in the embossed carrier tape pocket: the2

項目 Item
内容 Description
cathode faces the feeding direction of the tape as shown in the
項目 Item
内容 Description
セラミックスパッケージ材質
figure above.
Ceramics
Package
セラミックスパッケージ材質
Item
項目
Description
内容
項目Materials
Item
内容
Description
Ceramics
Package Materials
蛍光体板材質
セラミックスパッケージ材質
パッケージ材質
セラミックス
蛍光体セラミックス
sheet
Phosphor
蛍光体板材質Ceramics
Materials
Package
Package
Materials
Ceramics
Ceramics
Phosphor
蛍光体セラミックス
Materials
sheet
Phosphor
Phosphor Ceramics
Reel Size: 2,000 LEDs
蛍光体板材質
蛍光体板材質Materials
蛍光体セラミックス
蛍光体セラミックス
封止樹脂材質sheet
Phosphor
Phosphor
sheet(Unit: mm)
シリコーン樹脂
Phosphor
PhosphorCeramics
Ceramics
Encapsulating
封止樹脂材質Materials
MaterialsResin
トレーラ部最小160mm（空部）
LED装着部
引き出し部最小100mm（空ResinSilicone
シリコーン樹脂
Materials Resin
Encapsulating
TrailerResin
160mm MIN(Empty Pockets)
Loaded Pockets
Leader with Top Cover T
Silicone
封止樹脂材質
封止樹脂材質Materials
シリコーン樹脂
100mm MIN(Empty Poc
シリコーン樹脂
金メッキ
電極材質
Encapsulating
EncapsulatingResin
Resin
1）The
Resin
Silicone
Silicone
Resin deviation of the center of the emitting area from the center of the
Au-plated
Materials
Electrodes
金メッキ
電極材質
Materials
Materials
Materials
Electrodes
electrodes is ≤ ±0.07mm in both the lateral and longitudinal direction.
Weight:typ. 0.025g Au-plated
ダイヒートシンク材質
金メッキ
電極材質
電極材質
金メッキ
リーダ部最小40
金メッキ
Sink
Die HeatMaterials
ダイヒートシンク材質
Au-plated
Electrodes2）The deviation of the center of the LED package from the centerof theElectrodes
Materials
Au-plated
Au-plated
Leader
without Top Cover
金メッキ
Heat Sink
DieMaterials
リール部
Reel is ≤ ±0.15mm in both the lateral and longitudinal direction.
Au-plated
electrodes
ダイヒートシンク材質
ダイヒートシンク材質
Materials
金メッキ
金メッキ
質量 Sink(Unit: mm, Tolerance:±0.1mm)Die
DieHeatHeat
Sink
0.025g(TYP)
Au-plated
Au-plated
Weight質量
Materials
Materials
180+0-30.025g(TYP)
WeightThis
document
contains
tentative information, Nichia may change the contents without notice.
質量
質量0.025g(TYP)
0.025g(TYP)
Weight* 数量は1リールにつき 2000個入りです
Weight
+1

13 -0

4/18

Φ

K

(0.02 クロスバー凹部)(0.02 Crossbar Recess)

トレーラ部/リーダ部 Trailer and Leader

0.3 A
0.3 A

Light Emitting Diode0.2±0.05

3.7±0.1

Anode
Anode

1
1
2.12
2.12
3.3
11
3.3
2.12
2.12
3.3
3.3

2±0.05 4±0.1

0.14 A
0.14 A

3.5 3.53.5
3.5

AA

3.5
3.5
ダイヒートシンク
Sink
Heat
Die
ダイヒートシンク
Chip
Heatsink
3.5
3.5
Die Heat Sink
ダイヒートシンク
ダイヒートシンクDie
Die Heat
HeatSink
Sink

8±0.1

Cathode0.7
0.7

CathodeCathodeA-0
Φ1.5+0.1

0.14
0.14BB 1

3.7±0.1

0.14 B
0.14 B

0.6±0.05
0.6±0.05

Embossed Carrier Tape

1.75±0.1

0.6±0.05
0.6±0.05

LED

3.5
3.5
1.7
1.7
3.5
3.5
1.7
1.7

5.5±0.05
12+0.3-0.1

This product complies with RoHS Directive.
** 本製品はRoHS指令に適合しております。
本製品はRoHS指令に適合しております。
This
This productproduct complies
complies with
with RoHS
RoHSDirective.
Directive.

Part No. NJ2W270B-PF
NJ2W270B-PF
No.
Part
STS-DA7-16494
No.
No. STS-DA7-16494
NJ2W270B-PF
No.
Part
Part
No.
NJ2W270B-PF
mm)
Unit:±0.1)(単位(単位 Unit: mm, 公差 Tolerance:
STS-DA7-16494
No.
No.
STS-DA7-16494
mm)
Unit:±0.1)(単位
Tolerance:(単位 Unit: mm, 公差

SP-QR-C2-201362-2

Reel Size: 2000pcs
Mar. 3, 2022
* 実装作業の中断などでエンボスキャリア

Assembly Precautions for the Nichia 270B Series LEDs

1. LED Outline Dimensions/Tape Dimensions* 本製品はRoHS指令に適合しております。
complies with RoHS Directive.
* This
本製品はRoHS指令に適合しております。
Table
4.product
NJ3W270B-PF
Product Specifications
This product complies with RoHS Directive.
* *本製品はRoHS指令に適合しております。
本製品はRoHS指令に適合しております。
Thisproductproductcomplies
complieswith
withRoHS
RoHSDirective.
Directive.
This

Part No. NJ3W270B-PF
No.
STS-DA7-16499
Part
No.
NJ3W270B-PF
No. STS-DA7-16499(単位
Unit:±0.1)mm)(単位 Unit: mm, Part
公差No.
Tolerance:
PartNo.
NJ3W270B-PF
NJ3W270B-PF(単位
Unit:±0.1)mm)(単位 Unit: mm, 公差
Tolerance:No.
STS-DA7-16499
No.
STS-DA7-16499

3.5
3.5
1.7
1.7
3.5
3.5
1.7
1.7

(単位Unit:
Unit:
mm)(単位Unit:
Unit:mm,mm, 公差公差Tolerance:
Tolerance:
±0.1)
(単位
mm)
(単位
±0.1)

0.14AA 1
0.14

BB1.75±0.1

Φ1.5+0.2

Feeding
Direction

0.99±0.1

0.4 0.40.4
0.4
0.75±0.05
0.75±0.05
0.75±0.05
0.75±0.05

トレーラ部/リーダ部 Trailer and Leader
Direction of the LED in the embossed carrier tape pocket: the

Anode
Anode

0.3 B
0.3 B

2

0.3
0.3BB

Anode
Anode

1
2.12
1
3.3
2.12
1
3.31
2.12
2.12
3.3
3.3

0.3 A
0.3 A
0.3
0.3AA

Light Emitting DiodeAA

2

項目 Item
内容 Description
cathode faces the feeding direction of the tape as shown in the
項目 Item
内容 Description
パッケージ材質
セラミックスfigure above.
Package
Materials
Ceramics
パッケージ材質
セラミックス
項目
内容
Description
項目ItemItem
内容
Description
Package Materials
Ceramics
蛍光体板材質パッケージ材質
セラミックス
蛍光体セラミックス
パッケージ材質
セラミックス
Phosphor
sheet
蛍光体板材質Package
Materials
Ceramics
Phosphor
Ceramics
Package
Materials
Ceramics
蛍光体セラミックス
Materials
Phosphorsheet
Phosphor Ceramics
Reel Size: 2,000 LEDs
蛍光体板材質
蛍光体板材質Materials
蛍光体セラミックス
蛍光体セラミックス
封止樹脂材質Phosphorsheet
Phosphorsheet
シリコーン樹脂(Unit: mm)
Phosphor
PhosphorCeramics
Ceramics
Encapsulating
封止樹脂材質Materials
MaterialsResin
SiliconeResin
トレーラ部最小160mm（空部）
LED装着部
シリコーン樹脂
引き出し部最小100mm（空Materials Resin
Encapsulating
Trailer
160mm MIN(Empty Pockets)
Loaded Pockets
Silicone
Resin
Leader with Top Cover
封止樹脂材質
封止樹脂材質Materials
シリコーン樹脂
電極材質
金メッキ
シリコーン樹脂
100mm MIN(Empty Poc
Encapsulating
EncapsulatingResin
Resin
1）The
Silicone
Resin
Electrodes
Materials
Au-plated
Silicone
Resin deviation of the center of the emitting area from the center of the
電極材質
金メッキ
Materials
Materials
Electrodes
Materials
electrodes is ≤ ±0.07mm in both the lateral and longitudinal direction.
Weight:typ. 0.026g Au-plated
ダイヒートシンク材質
電極材質
金メッキ
電極材質
金メッキ
金メッキ
Die
Heat
Sink
ダイヒートシンク材質
2）The deviation of the center of the LED package from the centerof the リーダ部最小40Electrodes
Materials
Au-plated
Electrodes
Materials
Au-plated
Au-plated
金メッキ
Leader without Top Cover
DieMaterials
Heat Sink
Au-plated
リール部
Reel is ≤ ±0.15mm in both the lateral and longitudinal direction.
electrodes
ダイヒートシンク材質
ダイヒートシンク材質
Materials
金メッキ
金メッキ
質量
(Unit: mm, Tolerance:±0.1mm) 0.026g(TYP)
Die
DieHeatHeatSink
Sink
Au-plated
Au-plated
Weight質量
Materials
Materials
180+00.026g(TYP)-3
WeightThis
document
contains
tentative information, Nichia may change the contents without notice.
質量
質量0.026g(TYP)
0.026g(TYP)
WeightWeight* 数量は1リールにつき 2000個入りです
+1

13 -0

5/18

Φ

K
K

(0.02 クロスバー凹部)(0.02 Crossbar Recess)0.2±0.05

3.7±0.1

3.5 3.53.5
3.5

B
B

2±0.05 4±0.1

3.7±0.1

2.7±0.05
2.7±0.05
2.7±0.05
2.7±0.05
3.3 3.33.3
3.3

3.5 3.53.5
3.5
2.9 2.92.9
2.9
3.3 3.33.3
3.3

AA

3.5
3.5
ダイヒートシンク
Die
Heat
Sink
Chip
Heatsink
ダイヒートシンク
3.5
3.5
Die Heat Sink
ダイヒートシンク
ダイヒートシンク
Die
DieHeatHeatSink
Sink

8±0.1

Cathode0.14 A
0.14 A

0.7
0.7

ACathodeCathode-0
Φ1.5+0.1

0.14BB 1
0.14

0.7
0.7

CathodeCathodeA

テーピング部 Tape

0.14 B
0.14 B

0.6±0.05
0.6±0.05

Embossed Carrier Tape

5.5±0.05
12+0.3-0.1

0.6±0.05
0.6±0.05

LED

SP-QR-C2-201362-2

Reel Size: 2000pcs
Mar. 3, 2022
* 実装作業の中断などでエンボスキャリア

Assembly Precautions for the Nichia 270B Series LEDs

2. Handling Precautions

Correct

2.1 Handling with bare hands
Do not handle the LEDs with bare hands. This may contaminate the LED surface and have an effect on the opticalcharacteristics.
2.2 Handling with tweezers
Ensure that when handling the LEDs with tweezers, grab/hold the LEDs by the sides of the ceramic substrate andensure that excessive force is not applied to the LED. Otherwise, it may cause damage to the light emitting area and/or
the silicone resin (e.g. cut, scratch, chip, crack, etc.) and have an effect on the optical characteristics and/or the
reliability.
2.3 ESD Precautions
The LEDs are sensitive to transient excessive voltages (e.g. ESD, lightning surge). If this excessive voltage occurs in thecircuit, it may cause the LED to be damaged causing issues (e.g. the LED to become dimmer or not to illuminate [i.e.
catastrophic failure]). When handling the LEDs, ensure that necessary measures have been taken to protect them fromtransient excess voltages. Refer to the applicable specification for more details.
2.4 Stacking assembled PCBs together
Do not stack assembled PCBs together. Otherwise, it may cause damage to the light emitting area (e.g. cut, scratch,chip, crack, etc.) and have an effect on the optical characteristics and/or the reliability.
2.5 Baking
The storage/packaging requirements for the Nichia 270B Series LEDs are comparable to JEDEC Moisture Sensitivity
Level (MSL) 3 or equivalent. Nichia used IPC/JEDEC STD-020 as a reference to rate the MSL of this LED. If the “After
Opening” storage time has been exceeded or any pink silica gel beads are found, ensure that the LED are baked before
use. Baking should only be done once.
Table 5. Storage/Baking Conditions
Conditions
Storage

Temperature

HumidityTime

Before Opening Aluminum Bag≤ 30℃≤ 90%RH

Within 1 Year from Delivery Date

After Opening Aluminum Bag≤ 30℃≤ 70%RH≤ 168 hours

65±5℃

-

≥ 24 hours

Baking

Suggestion: Grab/holdthe LEDs with tweezers by
the sides of the ceramic
substrate.

Incorrect

Caution: Do not touchthe emitting area.

Incorrect

Caution: Do not touch
the silicone resin.

Figure 1. Correct/Incorrect
Examples of Handling withTweezers

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 270B Series LEDs

3. Design Recommendations for Optimal Amount of Solder
Soldering Pad Pattern/Metal Solder Stencil Aperture

Table 6. Recommended Soldering Pad Pattern/Metal Solder Stencil Aperture
Recommended Soldering Pad Pattern

Recommended Metal Solder Stencil Aperture

3 .4
2 .12
1

3 .25
2 .27
0 .77

LED Outline
Electrodes and Chip Heatsink
Center of the Soldering Pad Pattern
Soldering Pad Pattern

3 .1

3 .4

Metal Solder Stencil Aperture(Unit: mm)(Unit: mm)Table 7. Recommended Solder/Metal Solder Stencil Conditions
Item

Recommended Conditions

Metal Solder Stencil (Thickness)

100 (μm)

Solder Paste (Composition)

Sn-3.0Ag-0.5Cu

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 270B Series LEDs

4. Precautions for Setting Up a Pick-and-Place Machine/Nozzle
Table 8. Cautions/Suggestions for Setting Up Equipment

Item

Recommended Conditions/Specifications

Cautions/Suggestions

Pick-and-place machine

Modular mounter

See the note below this table.

Pick-and-Place Nozzle

Using a nozzle with a rubber tip specificallydesigned for the LEDs is recommended.
(see Figure 2)

See “Pick-and-Place Nozzle” on Page 9 for the details.

Tape-and-reel feeder

Electrical (motorized) feeder
Tape width: 12mm
Feeder pitch: 8mm

See “Tape-and-Reel Feeder” on Page 10 for the details.

Nozzle height for pick-up
operations

The contact surface of the nozzle head forpick operations should be adjusted to 0.2mm
below the edge of the embossed carrier tapepocket.

See “Recommended Nozzle Height for Pick-up Operations” on
Page 10 for the details.

Nozzle height forplacement operations (i.e.
placement depth)

0.2mm for placement depth

See “Recommended Nozzle Height for Placement Operations(Placement Depth)” on Page 11 for the details.

Imaging-based Automatic
Inspection

Using the electrode as a reference isrecommended to locate the center of theLED.

See "Imaging-based Automatic Inspection" on Page 11 for thedetails.

Note:-

The recommended conditions/specifications above have been determined under the following verification conditions:
Pick-and-place machine (modular mounter):- YS100 High-Speed General-Purpose Modular (manufactured by Yamaha Motor Co., Ltd.)This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 270B Series LEDs
4.1 Pick-and-Place Nozzle
1. Figure 2 shows the recommended dimensions for the pick-and-place nozzle.
The recommended material of the nozzle tip (i.e. the suction part) is rubber.
A

A
C0.1
1.4
2.5

C0.1
A部拡大
Expansion of A

Φ1.4
1.4
Φ2.5
2.5

A部拡大

Expansion(Unit:mm) of A

Figure 2. Recommended Nozzle Dimensions• Ensure that the size, shape, and material of the nozzle tip are appropriate for the LEDs.
Otherwise, this may damage the LED (i.e. scratch, chip, crack, etc.), affecting the opticalcharacteristics and/or the reliability. This may also lead to an incorrect pick up (i.e. the
LED is picked up in a tilted position).
2. When setting the LED pick-up position, ensure that the center of the nozzle and thecenter of the emitting area of the LED are aligned (See Figure 3). Do not apply excessive(単位 Unit: mm)force to the emitting area when picking up the LED.
• If thenozzle(単位Unit:mm) does not pick up the LED at the center of the emitting area, and/or if

excessive force is applied to the LED, this may damage the LEDs (i.e. scratch, chip, crack,etc.), affecting the optical characteristics and/or the reliability. This may also lead to anincorrect pick up (i.e. the LED is picked up in a tilted position).

Pick-and-Place Nozzle
NJ2W270B

NJ3W270B

NJ2W270B-PF

NJ3W270B-PF

Figure 3. Examples of Recommended Nozzle Dimensions and LED Pick-up Positions for the Nichia 270B Series LEDs
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 270B Series LEDs
4.2 Tape-and-Reel Feeder
Recommended Top Cover Tape
Removal Position
Feeder Cover
Top Cover Tape

1. Recommended setting for the tape-and-reel feeder.
Tape width: 12mm
Feeder pitch: 8mm

Pick-and-Place Nozzle

LED pick up
position

Feeding Direction of the Embossed
Carrier Tape

2. Use a tape-and-reel feeder that ensures it does notcreate excessive vibrations causing assembly issues.
Example: Electrical (motorized) feeder
3. It is recommended to remove the top cover tape atthe recommended position shown in Figure 4.

Figure 4. Top Cover Tape Removal Position

4.3 Recommended Nozzle Height for Pick-up Operations

Pick-and-Place
NozzleLED

Embossed Carrier Tape
(Pocket)0.2mm below the edgeof the tape pocket (i.e.
Pick-up depth)

Figure 5. Recommended Nozzle Height for Pick-up Operations

1. Ensure that the nozzle goes down onto the LED in the tape pocket until the tip
touches the flat surface around the lens.
Pick-up depth: 0.2mm
Note: If the reference level for the nozzle setting is at the edge of the tape pocket.
2. The recommended nozzle height for pick-up operations has been determined by
Nichia under the verification conditions (See Table 8) and may not function as
expected with some other pick-and-place machines. If the pick-up operations are
unstable even with using the recommended nozzle height, adjust the nozzle heightappropriate for the pick-and-place machine being used.
If the pick point of the nozzle is too high,- it may cause insufficient suction power leading to picking errors (e.g. thenozzle’s failure to pick/lift the LED into the air, incorrect picking causing the
LED to tilt when in the air).
If the pick point of the nozzle is too low,
- it may cause issues (e.g. causing the embossed carrier tape to shake, causing
the tape pocket to deform) leading to picking failure.
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 270B Series LEDs
4.4 Recommended Nozzle Height for Placement Operations (Placement Depth)
1. The nozzle should further press the LED 0.2mm onto the PCB from theheight where the LED first touches solder paste.

Pick-and-Place Nozzle

If the release point of the nozzle is too high,- it may cause placement issues (e.g. the LED to stick to the nozzle
after placement, the LED to be mounted in an incorrect
place/rotated position, the LED to become soldered to the PCB ina tilted position, etc.).

LED

Placement
Depth
0.2mm

If the release point of the nozzle is too low,
- excessive forces may be applied to the LED during placement andit may cause the LED to become damaged.

PCB

Figure 6. Recommended Nozzle Height for Placement (Placement Depth)

4.5 Imaging-based Automatic Inspection

Electrode Location
Detection/
Recognition Points

1. Nichia recommends using the electrodes as a reference to locate thecenter of the LED.
2. If the imaging device has trouble detecting/recognizing the electrodes,
adjust the settings (i.e. the brightness of the light, etc.) of the pick-andplace machine.

Figure 7. Recommended Reference Points to Detect, Recognize, or Locate the Electrodes
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 270B Series LEDs

5. Precautions When Reflow Soldering
1. Reflow soldering must not be performed more than twice.
1~5℃/sec

Pre-heat180~200℃

260℃ Max
10sec Max

220℃ Max
60sec Max

120sec Max

Figure 8. Recommended Reflow Soldering Condition(Lead-free Solder)

2. Nichia recommends using the reflow soldering conditions detailed in Figure 8
to the left; use the recommended reflow conditions specified by the
manufacturer of the solder paste being used if it works better for the chosen
application.
Note: To ensure that these reflow conditions have no negative effect on theLEDs, perform sufficient verification prior to use.
3. When cooling the LEDs from the peak temperature a gradual cooling slope isrecommended; do not cool the LEDs rapidly.
4. During reflow soldering, the heat and atmosphere in the reflow oven may cause
the optical characteristics to degrade. In particular, reflow soldering performed
with an air atmosphere may have a greater negative effect on the opticalcharacteristics than if a nitrogen atmosphere is used; Nichia recommends using
a nitrogen reflow atmosphere.

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 270B Series LEDs

6. Evaluation of the Effect of Solder Volume
Nichia evaluated the effect of solder volume for reflow-soldering the LEDs (i.e. the parallel/angular deviations and self-alignment performance) using
different solder volumes (i.e. three aperture ratios and three thicknesses for the metal solder stencil) including the recommended amount. For details,
see Table 9.
The evaluation results provided herein were obtained under Nichia’s evaluation conditions/environments; Nichia makes no guarantee that customers
will see the same results for their chosen application. Perform a sufficient verification to ensure that there are no issues with the chosenconditions/environments.
Table 9. Solder Volumes and Soldering Pad Patterns

3 .4
2 .12
1

3 .3
2 .12
1

NSMD

3 .3

100μm
(Nichia’s
Recommendation)

3 .25
2 .27
0 .77

Soldering Pad Pattern

100%

3 .4
3 .6

3 .11
2 .41
0 .54

3 .1

80μm

75% (Nichia’s
Recommendation)

53%

3 .1

Aperture
Ratio3Thickness

1 .2
1 .92
3 .6

120μm
(Unit: mm)(Unit: mm)

3 Aperture Ratio = Area of Aperture/(Areas of the Electrodes + Area of Chip Heatsink)(Unit: mm)(Unit: mm)

LED Outline
Electrodes and Chip Heatsink
Center of the Soldering Pad Pattern

LED Part No. Evaluated: NJ2W270B
Sample Size for the Placement Accuracy Evaluation: 320 LEDs per Condition

Soldering Pad PatternMetal Solder Stencil Aperture
Solder Mask ApertureThis document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 270B Series LEDs

6. Evaluation of the Effect of Solder Volume (Continued)
Table 10. Evaluation Results
Thickness
Solder Volume

80μm(＊) Nichia's Recommendation
120μm

100μm (＊)

Note

Aperture
Ratio

53%

75%

100%

53%

75%
(＊)

100%

53%

75%

100%

⊿x

◎

◎

◎

◎

◎

◎

◎

◎

◎

⊿y

◎

○

○

◎

○

▲

◎

○

×

⊿θ

○

○

○

○

○

○

○

○

○

6-3. Self-Alignment
Performance in the x and y
Directions4

▲

○

◎

▲

◎

◎

○

◎

◎

See Page 16
for details.

6-4. Self-Alignment
Performance in the Angular
Direction4

×

○

○

×

○

◎

○

○

◎

See Page 17
for details.

6-1. Placement
Accuracy in the x andy Directions

6-2. Placement
Accuracy in the
Angular Direction◎：Very Good ○：Good▲：Not GoodSee Page 15
for details.

✖：Bad

4 The self-alignment performance evaluation is relative to the placement accuracy that was seen when the LED was soldered without intentionally

being shifted/rotated.

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 270B Series LEDs
6-1. Placement Accuracy in x and y Directions
Nichia evaluated the placement accuracy of the reflow-soldered LEDs in the x and y directions from the center of the soldering pad pattern using
different solder volumes (i.e. three aperture ratios and three thicknesses for the metal solder stencil). The amount of the deviation from the center ofthe soldering pad pattern in the x and y directions are described as ⊿x and ⊿y respectively.
0.3

+

0.2

⊿x

+

0.1
0
-0.1
-0.2

＋：Center of the LED

80μm

Soldering Pad Pattern

0
-0.1

-0.3

53% 75% 100% 53% 75% 100% 53% 75% 100%＋：Center of the－Average ±3σ

0.1

-0.2

-0.3

Package● Average

0.2－Average ±3σ⊿y (mm)－－⊿x (mm)⊿y

0.3● Average

100μm

53% 75% 100% 53% 75% 100% 53% 75% 100%

120μm

80μm

100μm

120μm

Solder Volume (Aperture Ratio and Thickness)

Solder Volume (Aperture Ratio and Thickness)

・ There was no significant difference seen in the average andthe deviation of ⊿x of the evaluated LEDs per condition.

・ The deviation of ⊿y of the evaluated LEDs became larger
as the solder volume increased.

6-2. Placement Accuracy in the Angular Direction
Nichia evaluated the placement accuracy of the reflow-soldered LEDs in the angular direction from the reference axis of the soldering pad patternusing different solder volumes (i.e. three aperture ratios and three thicknesses for the metal solder stencil). The amount of the deviation from thereference axis in the angular direction is described as ⊿θ.
2+● Average

1.5＋：Reference Axis of
the LED Package＋：Reference Axis of the⊿θ (°)－－Average ±3σ

1

⊿θ

0.5
0

・ There was no significant difference seen in the average and thedeviation of ⊿θ of the evaluated LEDs per condition.

-0.5
-1
-1.5
-2

53% 75% 100% 53% 75% 100% 53% 75% 100%

Soldering Pad Pattern

80μm

100μm

120μm

Solder Volume (Aperture Ratio and Thickness)

Light Emitting Diode

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 270B Series LEDs
6-3. Self-alignment Performance in the x and y Directions
Nichia evaluated the self-alignment performance of the reflow-soldered LEDs using different solder volumes (i.e. three aperture ratios and three
thicknesses for the metal solder stencil): the evaluation LEDs were placed on specified points (i.e. x = -0.2mm and y = +0.2mm/x = +0.2mm andy = +0.2mm from the center of the soldering pad pattern). Sample Size: 20 LEDs per condition
0.2

Aperture Ratio: 100%

Soldering Pad Pattern

LED Placement Position

0.1

0.05

0.05

0.05

-0.05

-0.1

-0.1

-0.1

□：Soldering Pad Pattern＋：Center of theSoldering Pad Pattern＋：Center of the Evaluated

LED Placement Position

-0.15

-0.1

-0.05

0

x (mm)

0.05

0.1

-0.15
-0.25

0.15

y (mm)

-0.15

-0.1

-0.05

0

x (mm)

0.05

0.1

0.2

Aperture Ratio: 100%

0.15

LED Placement Position

Aperture Ratio: 53%

0.2

Aperture Ratio: 75%

Aperture Ratio: 100%

0.15

LED Placement Position

0.1

0.1

0.05

0.05

0.05

0
-0.05

-0.05

-0.1

-0.1

-0.1

0.05

0.1

0.15

0.2

0.25

Metal Solder Stencil Thicknesses: 80μm

-0.15
-0.15 -0.1 -0.05
00.05
x (mm)

0.1

0.15

0.2

0.25

Metal Solder Stencil Thicknesses: 100μm

Aperture Ratio: 75%
Aperture Ratio: 100%
LED Placement Position

0

-0.05

-0.15
-0.15 -0.1 -0.05
0x (mm)

0.15

0.25

0.1

0

0.1

Metal Solder Stencil Thicknesses: 120μm

Aperture Ratio: 53%

Aperture Ratio: 75%

LED Placement Position-0.15-0.25 -0.2 -0.15 -0.1 -0.05
00.05
x (mm)

0.15

0.25
Aperture Ratio: 53%

0.2

-0.2

Metal Solder Stencil Thicknesses: 100μm0.25

x=＋0.2mm
y=＋0.2mmx-0.2

Aperture Ratio: 100%

0

-0.05

0.15

y

0

-0.05

Metal Solder Stencil Thicknesses: 80μm

Evaluated LED Placement
Position 2

y (mm)

0.1

0Aperture Ratio: 75%

0.15

LED Placement Position

0.1

-0.15
-0.25

＋：Center of the Evaluated

Aperture Ratio: 100%y (mm)□：Soldering Pad Pattern＋：Center of the

0.2

Aperture Ratio: 75%

0.15

LED Placement Positiony (mm)x

0.2

Aperture Ratio: 75%

y (mm)y (mm)

x=－0.2mm
y=＋0.2mm

Aperture Ratio: 53%

Aperture Ratio: 53%

Aperture Ratio: 53%

0.15

y

0.25

0.25

0.25

Evaluated LED Placement
Position 1-0.15-0.15 -0.1 -0.05
00.05
x (mm)

0.1

0.15

0.2

0.25

Metal Solder Stencil Thicknesses: 120μm

・ Except for the two conditions with the least solder volume5, the self-alignment performance was good; the LEDs moved to positions that were sufficiently
close to the correct one (i.e. the amount of the deviation was almost the same as the evaluation results of the evaluation 6-1. See section 6-1.) by
5 The conditions with the metal solder stencil thickness of 80/100μm and the aperture ratio of 53%
themselves during reflow soldering.

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 270B Series LEDs
6-4. Self-alignment Performance in the Angular Direction
Nichia evaluated the self-alignment performance of the reflow-soldered LEDs using different solder volumes (i.e. three aperture ratios and three
thicknesses for the metal solder stencil): the evaluation LEDs were intentionally rotated (i.e. ⊿θ = +5/10° from the reference axis whose origin was
the center of the soldering pad pattern).
Sample Size: 20 LEDs per condition

Evaluated LED Placement
Position 3
θ=+5° Rotated

Evaluated LED Placement
Position 44

θ=+10° Rotated□：Soldering Pad Pattern＋：Reference Axis of theSoldering pad pattern＋：Reference Axis of the

Evaluated LED Placement
Position

3

θ

2
1
0
-1
53%

75%

80μm

100%

53%

75%

100μm

100%

53%

75%

120μm

Solder Volume (Aperture Ratio and Thickness)100%⊿θ (°)

θ⊿θ (°)

3

4□：Soldering Pad Pattern＋：Reference Axis of the

2
1
0
-1

Soldering pad pattern＋：Reference Axis of the

Evaluated LED Placement
Position

53%

75%
80μm

100%

53%

75%
100μm

100%

53%

75%

100%

120μm

Solder Volume (Aperture Ratio and Thickness)

・ The self-alignment performance was low in the two conditions with the least solder volume6; the LEDs did not move to positions that were
sufficiently close to the correct one (i.e. the amount of the deviation was obviously greater than the evaluation results of the evaluation 6-2. See
section 6-2.) by themselves during reflow soldering.
6 The conditions with the metal solder stencil thickness of 80/100μm and the aperture ratio of 53%

・ As shown in the evaluation results above, Nichia has concluded that the larger the solder volume is, the better the self-alignment performance
will be.

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 270B Series LEDs

Disclaimer
This application note is a controlled document of Nichia Corporation (Nichia) published to provide technical information/data forreference purposes only. By using this application note, the user agrees to the following:• This application note has been prepared solely for reference on the subject matters incorporated within it and Nichia makes noguarantee that customers will see the same results for their chosen application.
• The information/data contained herein are only typical examples of performances and/or applications for the product. Nichia
does not provide any guarantees or grant any license under or immunity from any intellectual property rights or other rights
held by Nichia or third parties.
• Nichia makes no representation or warranty, express or implied, as to the accuracy, completeness or usefulness of any
information contained herein. In addition, Nichia shall not be liable for any damages or losses arising out of exploiting, using,or downloading or otherwise this document, or any other acts associated with this document.
• The content of this application note may be changed without any prior or subsequent notice.
• Copyrights and all other rights regarding the content of this document are reserved by Nichia or the right holders who havepermitted Nichia to use the content. Without prior written consent of Nichia, republication, reproduction, and/or redistributionof the content of this document in any form or by any means, whether in whole or in part, including modifications or derivative
works hereof, is strictly prohibited.

491 Oka, Kaminaka-Cho, Anan-Shi,
TOKUSHIMA 774-8601, JAPAN
Phone: +81-884-22-2311 Fax: +81-884-21-0148

NICHIA CORPORATION
http://www.nichia.co.jp

This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

18/18

SP-QR-C2-201362-2
Mar. 3, 2022