Application Note

Assembly Precautions
for the Nichia 757 Series LEDs
Table of contents
1.
2.
3.
4.
5.
6.

LED Outline Dimensions/Tape and Reel Dimensions ・ ・ ・ ・ ・ ・ ・ 2-6
Handling Precautions ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 7-8
Design Recommendations for Optimal Amount of Solder ・ ・ ・ ・ ・ ・ 9
Precautions for Setting Up a Pick-and-Place Machine/Nozzle ・ ・ ・ 10-13
Precautions When Reflow Soldering ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 14
Verification of the Self-Alignment Capability and Tilting ・ ・ ・ ・ ・ 15-16

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 757 Series LEDs

1. LED Outline Dimensions/ Tape and Reel Dimensions
TM

Table 1. Nichia 757G-V1, 757G, 757GR-V1U4, 757-Optisolis

Specific feature for this series

Series

LED Outline Dimensions

Tape and Reel Dimensions(Standard S-Reel)

4±0.1

3.5 ±0.05

3

（2.6）

Cathode Mark4±0.1

0.8 ±0.1

Φ1+0.2-0

2.6

リール部（標準 S Reel) 1
Reel (Standard S Reel)1a>bとなる場合、aがカソード側です。
The side with the larger distance isthe cathode. Example: a>b, then a isthe side that has the cathode.

Anode
0.48

Weight: typ. 0.018g

Light Emitting Diode* 実装作業の中断などでエンボスキャリアテープをリールに巻き取る場合、
エンボスキャリアテープを強く(10N以上)締めないで下さい。
LEDがカバーテープに貼り付く可能性があります。
When the tape is rewound due to work interruptions,no more than 10N should be applied tothe embossed carrier tape.
The LEDs may stick to the top cover tape.

ラベル
Label

(Unit: mm, Tolerance: ±0.2)

1 There is also an option to have a larger reel (L-Reel). See Table 5.

* 数量は1リールにつき 5000個入りです。
Reel Size: 5000pcs* JIS C 0806電子部品テーピングに準拠しています。
The tape packing method complies with JIS C 0806
(Packaging of Electronic Components on Continuous Tapes).

保護素子
Protection Device

Cathode11.4±1
9±0.3

A

2.27

K

180+0
-3

Φ60 +1-0b(Anode)1.42

0.2 ±0.05

3.18±0.1

Cathode Marka(Cathode)

2±0.053.18±0.1

Φ1.5 +0.1
-0

8+0.3
-0.1

テーピング部
Tape

0.65

1.75±0.1

3（2.6）(Unit: mm)

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 757 Series LEDs

1. LED Outline Dimensions/ Tape and Reel Dimensions
Specific feature for this series

Table 2. Nichia 757G-V2, 757G-V3 Series

LED Outline Dimensions

Tape and Reel Dimensions(Standard S-Reel)

4±0.1

Φ1.5 +0.1-02±0.053.5 ±0.05

3

（2.6）

Cathode Mark0.8 ±0.1

4±0.1

Φ1+0.2-03.18±0.1

Cathode Marka(Cathode)

0.2 ±0.05
3.18±0.1

テーピング部
Tape

0.65

8+0.3
-0.1

光学的中心位置
Location of the optical center

1.75±0.1

3
（2.6）

b
(Anode)2.6

リール部（標準 S Reel) 1
Reel (Standard S Reel)1a>bとなる場合、aがカソード側です。
The side with the larger distance isthe cathode. Example: a>b, then a isthe side that has the cathode.

180+0
-3
9+1
-0

A

2.27

Φ60 +1-0K

保護素子
Protection Device* 数量は1リールにつき 5000個入りです。
Reel Size: 5000pcs* 実装作業の中断などでエンボスキャリアテープをリールに巻き取る場合、
エンボスキャリアテープを強く(10N以上)締めないで下さい。
LEDがカバーテープに貼り付く可能性があります。
When the tape is rewound due to work interruptions,no more than 10N should be applied tothe embossed carrier tape.
The LEDs may stick to the top cover tape.

* JIS C 0806電子部品テーピングに準拠しています。
The tape packing method complies with JIS C 0806
(Packaging of Electronic Components on Continuous Tapes).

11.4±1

Cathode

Anode
1.42

0.48

Weight: typ. 0.018g(Unit: mm, Tolerance: ±0.2)

1 There is also an option to have a larger reel (L-Reel). See Table 5.

Light Emitting Diode

ラベル
Label

(Unit: mm)

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 757 Series LEDs

1. LED Outline Dimensions/ Tape and Reel Dimensions
Specific feature for this series

Table 3. Nichia 757H Series

LED Outline Dimensions

Tape and Reel Dimensions(Standard S-Reel)
テーピング部
Tape

0.8

4±0.1

Φ1.5 +0.1-02±0.053.5 ±0.05

3

（2.6）

Cathode Mark4±0.1

0.95±0.1

Φ1+0.2-0(0.02 クロスバー凹部)(0.02 Crossbar Recess)3.18±0.1

Cathode Marka(Cathode)

0.2 ±0.05
3.18±0.1

光学的中心位置
Location of the optical center

8+0.1
-0.1

（2.6）

1.75±0.1

3b(Anode)2.6

リール部（標準 S Reel) 1
Reel (Standard S Reel)1a>bとなる場合、aがカソード側です。
The side with the larger distance isthe cathode. Example: a>b, then a isthe side that has the cathode.

180+0
-3
9+1
-0

A

Φ60 +1
-0

2.27

K

保護素子
Protection Device* 数量は1リールにつき 4000個入りです。
Reel Size: 4000pcs* 実装作業の中断などでエンボスキャリアテープをリールに巻き取る場合、
エンボスキャリアテープを強く(10N以上)締めないで下さい。
LEDがカバーテープに貼り付く可能性があります。
When the tape is rewound due to work interruptions,no more than 10N should be applied tothe embossed carrier tape.
The LEDs may stick to the top cover tape.

* JIS C 0806電子部品テーピングに準拠しています。
The tape packing method complies with JIS C 0806
(Packaging of Electronic Components on Continuous Tapes).

11.4±1
Cathode

Anode
1.42

0.48

Weight: typ. 0.020g(Unit: mm, Tolerance: ±0.2)

1 There is also an option to have a larger reel (L-Reel). See Table 5.

Light Emitting Diode

ラベル
Label

(Unit: mm)

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 757 Series LEDs

1. LED Outline Dimensions/ Tape and Reel Dimensions
Specific feature for this series

Table 4. Nichia 757G-P5, 757GR-V3, 757GR-V4 Series

LED Outline Dimensions

Tape and Reel Dimensions(Standard S-Reel)

4±0.1

Φ1.5 +0.1-02±0.053.5 ±0.05

3

（2.6）

Cathode Mark4±0.1

0.8 ±0.1

Φ1+0.2-03.18±0.1

Cathode Marka(Cathode)

0.2 ±0.05
3.18±0.1

テーピング部
Tape

0.65

8+0.3
-0.1

光学的中心位置
Location of the optical center

1.75±0.1

3（2.6）

リール部（標準 S Reel) 1
Reel (Standard S Reel)1b>aとなる場合、aがカソード側です。

b(Anode)The side with the smaller distance isthe cathode. Example: b>a, then a isthe side that has the cathode.

2.6

180+0-3
9+1-0

A

Φ60 +1-0

2.27

K* 数量は1リールにつき 5000個入りです。
Reel Size: 5000pcs* 実装作業の中断などでエンボスキャリアテープをリールに巻き取る場合、
エンボスキャリアテープを強く(10N以上)締めないで下さい。
LEDがカバーテープに貼り付く可能性があります。
When the tape is rewound due to work interruptions,no more than 10N should be applied tothe embossed carrier tape.
The LEDs may stick to the top cover tape.

* JIS C 0806電子部品テーピングに準拠しています。
The tape packing method complies with JIS C 0806
(Packaging of Electronic Components on Continuous Tapes).

保護素子
Protection Device

11.4±1

Cathode

Anode
1.42

0.48

Weight: typ. 0.018g(Unit: mm, Tolerance: ±0.2)

1 There is also an option to have a larger reel (L-Reel). See Table 5.

Light Emitting Diode

ラベル
Label

(Unit: mm)

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 757 Series LEDs
Table 5. Nichia 757 Series Taping Specifications (L-Reel)

4±0.1

2±0.053.5 ±0.05

Cathode Mark

4±0.1
(0.02 クロスバー凹部)(0.02 Crossbar Recess)

X

Nichia 757 Series

3.18±0.1

Φ1.5 +0.1
-0

8+0.1
-0.1

テーピング部
Tape

1.75±0.1

Tape and Reel Dimensions(Larger Reel Option)YΦ1+0.2-0

X

Y

数量 Reel Size

757G-V1,757G,757GR-V1U4,
757-OptisolisTM,757G-V2,
757G-V3,757G-P5,757GR-V3,
757GR-V4

0.15±0.05

0.8020000pcs

757H

0.2±0.05

0.95

16000pcs

3.18±0.1

リール部（オプション L Reel)
Reel (Option L Reel)330±2

Φ80 ±19.5 ±1

ラベル
Label* 実装作業の中断などでエンボスキャリアテープをリールに巻き取る場合、
エンボスキャリアテープを強く(10N以上)締めないで下さい。
LEDがカバーテープに貼り付く可能性があります。
When the tape is rewound due to work interruptions,no more than 10N should be applied tothe embossed carrier tape.
The LEDs may stick to the top cover tape.
* JIS C 0806電子部品テーピングに準拠しています。
The tape packing method complies with JIS C 0806
(Packaging of Electronic Components on Continuous Tapes).

13.5 ±1(Unit: mm)
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 757 Series LEDs

Correct

2. Handling Precautions
2.1 Handling with bare hands
Do not handle the LEDs with bare hands:- this may contaminate the LED surface and have an effect on the optical characteristics,- this may cause the LED to deform and/or the wire to break causing a catastrophic failure (i.e. the LED not toilluminate),- the lead frame may cause injuries when the LED is handled with bare hands.
2.2 Handling with tweezers
Ensure that when handling the LEDs with tweezers, excessive force is not applied to the LED. Otherwise, it may cause
damage to the resin (e.g. cut, scratch, chip, crack, delamination and deformation) and the wire to break causing acatastrophic failure (i.e. the LED not to illuminate).
2.3 ESD Precautions
The LEDs are sensitive to transient excessive voltages (e.g. ESD, lightning surge). If this excessive voltage occurs in thecircuit, it may cause the LED to be damaged causing issues (e.g. the LED to become dimmer or not to illuminate [i.e.
catastrophic failure]). When handling the LEDs, ensure that necessary measures have been taken to protect them fromtransient excess voltages. Refer to the applicable specification for more details.
2.4 Stacking assembled PCBs together
Do not stack assembled PCBs together. Otherwise, it may cause damage to the resin (e.g. cut, scratch, chip, crack,delamination and deformation) and the wire to break causing a catastrophic failure (i.e. the LED not to illuminate).
2.5 Baking
The storage/packaging requirements for the NICHIA 757 series LEDs are comparable to JEDEC Moisture Sensitivity
Level (MSL) 3 or equivalent. Nichia used IPC/JEDEC STD-020 as a reference to rate the MSL of this LED. If the “After
Opening” storage time has been exceeded or any pink silica gel beads are found, ensure that the LED are baked before
use. Baking should only be done once.

Table 6. Storage/Baking Conditions
Conditions
Storage

Temperature

Humidity

Before Opening Aluminum Bag≤ 30°C≤ 90%RH

Within 1 Year from Delivery Date

After Opening Aluminum Bag≤ 30°C≤ 70%RH≤ 168 hours

65±5°C-≥ 24 hours

Baking (Reel is Removed from Aluminum Bag)

Time

Suggestion: Grab/holdthe LEDs with tweezers by
the sides of the substrate.

Incorrect

Incorrect

Caution: Do not let thetweezers touch theencapsulating resin.

Figure 1. Examples ofproper/improper handlingwith tweezers

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 757 Series LEDs
2.6 Handling the larger-sized 757 reels (L-Reel)
When handling the larger-sized 757 reels ensure that excessive force is not applied to the outer edge of the reel where the embossed carrier tape is
exposed. Holding the reel with only one hand may cause the embossed carrier tape to unwind. Additionally, holding it with only one hand may cause theembossed carrier tape to collapse.

Correct

Incorrect

Do not hold the reel where the tape isHold the outer edge of the reel where theEmbossed carrier tape is collapsed.
exposed.
tape is not exposed.
Figure 2. Examples of proper/improper handling of the Large reel
2.7 Handling the aluminum moisture-proof bags for the larger-sized 757 reels (L-Reel)
When handling the aluminum moisture-proof bag, do not hold the part of the bag where the larger-sized reel is located. If the reel is held even when it isinside the aluminum moisture-proof bag, it may cause the embossed carrier tape to unwind.

Correct

Incorrect

Do not hold thepart of the bagthat contains thereel.

Hold the bag at
the heated seal
Figure 3. Examples of proper/improper handling of the aluminum moisture-proof bags for the Large reelThis document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 757 Series LEDs

3. Design Recommendations for Optimal Amount of Solder
Soldering Pad Pattern/Metal Solder Stencil Aperture

Table 8. Recommended Solder/Metal Solder
Stencil Conditions

Table 7. Recommended Soldering Pad Pattern/Metal Solder Stencil Aperture
Recommended
Soldering Pad Pattern

Recommended Metal
Solder Stencil Aperture

4
2.8
2.3

4
2.8

Cathode

0.13

0.69

Anode

0.05

StencilThickness

100μm

Solder Paste

Sn-3.0Ag-0.5Cu

LED Outline and Electrodes
Soldering Pad Pattern
Solder Stencil Aperture

0.95(unit: mm)(unit: mm)

43
2-C0.22-C0.55

Same as above

1.5
3.15

Modified
Stencil
Aperture

Recommended
Conditions

2
2.3
3.15

2.3
3.15

Solder Pad
Pattern andStencil
Aperture asrecommended
in thespecification

Item

2-C0.38

2-C0.1

0.03

0.89(unit: mm)

The Modified Stencil Aperture should
be used to control LED tilting andsolder balling. See section 6.
Verification of the Self-Alignment
Capability for details.
The soldering pattern shapes, metal
solder stencil aperture shapes, andmetal stencil thicknesses shown in
Tables 7 and 8 were selected basedon Nichia’s recommended
placement conditions.
Customers should ensure that there
are no issues with the chosen
placement conditions before use.

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 757 Series LEDs

4. Precautions for Setting Up a Pick-and-Place Machine/Nozzle
Table 9. Cautions/Suggestions for Setting Up Equipment
Item

Recommended Conditions/Specifications

Cautions/Suggestions

Pick-and-Place machine

Modular mounter

See the note below this table.

Pick-and-Place Nozzle

Specially designed nozzle(see Figure 4)

See “Pick-and-Place Nozzle” on Page 11 for the details.

Tape-and-reel feeder

Electrical (motorized) feeder
Tape width: 8mm
Feed length: 4mm

Nozzle height for pick-up
operations

The contact surface of the nozzle head for pick
operations should be adjusted to the top surface of theembossed carrier tape pocket.

See “Recommended Nozzle Height for Pick-up
Operations” on Page 12 for the details.

Nozzle height forplacement operations(i.e. placement depth)

0.2mm for placement depth

See “Recommended Nozzle Height for Placement
Operations (Placement Depth)” on Page 13 for thedetails.

Imaging-based Automatic
Inspection

Using the electrode as a reference is recommended tolocate the center of the LED.

See "Imaging-based Automatic Inspection" on Page13
for the details.

See “Tape-and-Reel Feeder” on Page 12 for the details.

Note:
-

The recommended conditions/specifications above have been determined under the following verification conditions:
Pick-and-Place machine (modular mounter):- YS100 High-Speed General-Purpose Modular (manufactured by Yamaha Motor Co., Ltd.)This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 757 Series LEDs
4.1 Pick-and-Place Nozzle

3.1

(φ1)

Correct

Ideal size and position for the pick-up nozzle
Φ2.7

(0.5)

Incorrect

3.1(unit: mm)

Figure 4. Recommended Nozzle Dimensions

Ensure sure that the nozzle suction area islarger than the encapsulating resin areaof the LED (2.6mm x 2.6mm) to avoid possible
damage to the emission area resulting in the LED not
illuminating.

Example A: (Outer dimension φ2.5) = Not Recommended

Incorrect

See Figure 5 for examples of how the nozzle positionand size effects the pick-up of the LED.

Example B: (Outer dimension 1.7x1.2) = Not Recommended(unit: mm)

Figure 5. Examples of the pick-up by different nozzles
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 757 Series LEDs
4.2 Tape-and-Reel Feeder
Pick-and-Place nozzle
Top Cover Tape
Removal Position

Correct

Top Cover Tape

Feed Direction of the Carrier Tape

1. Recommended setting for the tape-and-reel feeder.
Tape width: 8mm
Feed length: 4mm
2. Use a tape-and-reel feeder that ensures it does not create excessive
vibrations causing assembly issues.
Example: Electrical (motorized) feeder
3. When removing the top cover tape, it should be done past three
LEDs away from the target LED (See Figure 6). Otherwise, it may
shake the embossed carrier tape and cause the LED to move within
the tape pocket. This may cause- the nozzle to fail to pick up the LED or not to pick it up properly
and shift while on the nozzle during the transport to the PCB (i.e.
pick-up/placement failure)

Pick-and-Place nozzle
Top Cover Tape
Removal Position
Top Cover Tape

Incorrect
Feed Direction of the Carrier Tape

- the LED to hit the feeder cover and become damaged.

Figure 6. Examples of Correct/Incorrect Top Cover Tape Removal Positions

1. Ensure that the nozzle only goes down to the top edge of the tapepocket and does not directly come into contact with the LED.

4.3 Recommended Nozzle Height for Pick-up Operations

Note: The reference level for the nozzle setting is at the top edge ofthe tape pocket.
2. The recommended nozzle height for pick-up operations has been
determined by Nichia under the verification conditions (See Table 9)
and may not function as expected with some other pick-and-placemachines. If the pick-up operations are unstable even with using therecommended nozzle height, adjust the nozzle height appropriate forthe pick-and-place machine being used.

NozzleNozzle position
Embossed carrier tape

If the pick point of the nozzle is too high,- it may cause insufficient suction power leading to picking
errors (e.g. the nozzle’s failure to pick/lift the LED into the air,incorrect picking causing the LED to tilt when in the air).
If the pick point of the nozzle is too low,
- it may cause issues (e.g. causing the embossed carrier tape toshake, causing the tape pocket to deform) leading to picking
failure and/or damage to the LED.

Figure 7. Cross-sectional view of a nozzle when transporting
an Nichia 757 series LEDs to a PCBThis document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 757 Series LEDs
4.4 Recommended Nozzle Height for Placement Operations (Placement Depth)
1. After the LED is mounted onto solder paste on the PCB, the nozzle
should further press the LED 0.2mm into the PCB.

NozzleLED

If the release point of the nozzle is too high,- it may cause placement issues (e.g. the LED to stick to thenozzle after placement, the LED to become soldered to the PCB
in a tilted position, etc.).

If the release point of the nozzle is too low,
- excessive forces may be applied to the LED during placement
and it may cause the LED to become damaged.

Press
0.2mm

Board
Figure 8. Recommended Nozzle Height for Placement (Placement Depth)

4.5 Imaging-based Automatic Inspection

Polarity Detection/
Recognition Point

1. Nichia recommends using the electrodes as a reference to locate thecenter of the LED.
2. If the imaging device has trouble detecting/recognizing the electrodes
due to the uniqueness of the electrode pattern, adjust it todetect/recognize the outer portions of the electrodes (i.e. the areas
circled in red in Figure 9 to the left).
3. If an automatic polarity detector is used for the LEDs, set up theimaging device to detect the empty space between the anode andcathode electrodes (i.e. Polarity Detection/Recognition Point in Figure
9 to the left). In the example in Figure 9, the equipment measures thebrightness of the empty space against the threshold to locate theelectrodes and/or determine the polarity.

Electrode Location
Detection/
Recognition Points

Figure 9. Recommended reference points to detect, recognize, or locate the polarity/electrodes
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 757 Series LEDs

5. Precautions When Reflow Soldering

1. Reflow soldering must not be performed more than twice.
2. Using the recommended reflow soldering conditions (See Figure 10 to the left) asa reference, modify if necessary, the recommended reflow conditions specified
by the manufacturer of the solder paste being used.
Note: To ensure that these reflow conditions have no negative effect on theLEDs, perform sufficient verification prior to use.
3. When cooling the LEDs from the peak temperature a gradual cooling slope isrecommended; do not cool the LEDs rapidly.
4. During reflow soldering, the heat and atmosphere in the reflow oven may cause
the optical characteristics to degrade. In particular, reflow soldering performed
with an air atmosphere may have a greater negative effect on the opticalcharacteristics than if a nitrogen atmosphere is used; Nichia recommends using anitrogen reflow atmosphere.

Figure 10. Recommended Reflow Soldering Condition(Lead-free Solder)This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 757 Series LEDs

6. Verification of the Self-Alignment Capability and Tilting
6.1 Self-Alignment Capability Method/Conditions
Nichia has verified the self-alignment capability of the LEDs using two different solder stencil
apertures shown on page 9. Evaluation LEDs were placed on specified points or intentionallyrotated to create a parallel/angular misalignment from the center of the soldering pad pattern(see Figure 11 to the right). After reflow soldering, LED positions and angles were measured foreach stencil aperture to determine the amount of misalignment.
Board: CEM3
Board thickness: 1.6mm
Copper Thickness: 35μm
Metal Solder Stencil Thickness: 100μm
Parallel Deviation Condition: ∆x,y = x=+0.2mm, y=+0.2mm, y=-0.2mm
Angular Deviation Condition: ∆θ = 30°, 45°
Sample Size: 15 LEDs per condition (i.e. stencil aperture)

Anode

CathodeFigure 11. LED misalignment Conditions

6.2 Self-Alignment Capability Conclusions
LED Parallel Misalignment- If the misalignment is within 0.2mm in both the x and y coordinates, it will not have aneffect on the self-alignment capability.
LED Angular Misalignment- Since all the rotated LEDs moved back to the correction position (i.e. the center of thesoldering pad pattern) by themselves during reflow soldering, there are no issues with theself-alignment capability against the evaluated angular deviation.

For more details, refer to Table 10 on the next page.

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 757 Series LEDs
Table 10. Misalignment Evaluation Results
Conditionx : +0.2mm

Ref.

y: +0.2mm+0.2mmy:-0.2mmy:y:-0.2mm

θ=30°

θ=45°

Stencil
Aperture asrecommended
in thespecification
After
Reflow
Modified
Stencil
Aperture

Table 11. Tilting Measurement Results

6.3 Tilting Measurement

Z(Tilting)

Stencil Design

Z (Tilting)

Stencil Aperture as recommended in thespecification

0.060mm

Modified Stencil Aperture

0.042mm

Sample Size: 15 LEDs per condition (i.e. stencil aperture)

Solder Paste

Board

Figure 12. Tilting Measurement Method

X-Y=Z (Tilting)

The tilting was less with LEDs soldered using the modified stencil
aperture.
- The size of aperture on the modified stencil is 77.5% of the one
recommended in the specification. If tilting occurs, try adjusting theamount of solder paste to see if the result improves.

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Assembly Precautions for the Nichia 757 Series LEDs

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