3DIC 2024 Program Schedule
September 25-27, 2024
Conference Venue:
September 25, 2024 at Hotel Metroloplitan Sendai
September 26-27, 2024 at Sendai Kakusai Hotel
SessionLocation
SessionPresentation
Session time
Datetime
Opening Remark
25-Sep-24
13:00-13:10
Keynote Talk I
13:10-13:50
13:10-13:50

as of September 6, 2024

paper_ Categorypaper_title
id
Keynote AI Computing Trends for Mobile Processor DesignAuthors

Affiliations

T. Tanaka
Bor-Sung Liang

Tohoku University
MediaTeck

Takanori Ueda

IBM Research - Tokyo

Keynote Talk II

13:50-14:30

13:50-14:30

Keynote IBM NorthPole: Brain-Inspired Neural Inference
Architecture Intertwining Compute with Memory

Coffee BreakKeynote Talk III

14:30-14:45
14:45-15:25

14:45-15:25

InvitedInvited Talk I
HotelMetropolita Invited Talk IIn Sendai

15:25-15:55

15:25-15:55

Invited

15:55-16:25

15:55-16:25

Invited 3D-Stacked 1Megapixel Time-Gated SPAD Image Sensor Ayman Abdelghafar, Kazuhiro Morimoto, Naoki Isoda,with 2D Interactive Gating Network for Image
Hiroshi Sekine, Junji Iwata, Tetsuya Itano, Yasushi
Alignment-Free Sensor Fusion
Matsuno, Katsuhito Sakurai, Takeshi Ichikawa

Canon Inc.

Invited Talk III

16:25-16:55

16:25-16:55

Alexandra Schewski, Ulrich Schaber, Armin Klumpp

Fraunhofer EMFT

Session 1:Quantum Technology

16:55-17:35

16:55-17:15

4036

Invited Superconducting Titanium Nitride in Through-Silicon
Vias for 3D Integration of Qubits
Lecture Electrochemical Deposition of Indium Thin-Films forScalable 3D Quantum Chiplets

Jowesh Goundar, La Mai, Yugi Otake, Yuki Mori, Hideo
Kosaka, Fumihiro Inoue

Yokohama National University

17:15-17:35

4008

Lecture 3D Stacked Spin Qubit and TCAD Simulations

Tetsufumi Tanamoto

Teikyo University26-Sep-24

PSMC
Makoto Nagata

Kobe Univ.

Banquet18:00-20:00

Keynote Talk IV

08:50-09:30

08:50-09:30

Keynote CHIPS - NAPMP: Overview and Next StepsGeorge Orij

Invited Talk IV

09:30-10:00

09:30-10:00

Kuan-Neng Chen

Invited Talk V

10:00-10:30

10:00-10:30

Shigeki Kobayashi

KioxiaCoffee BreakSession 2:
Process Technology for Hybrid
Bonding

10:30-10:45
10:45-11:05

Invited Development of Hybrid Bonding: Perspectives onMaterial Selection, Structural Design, and Applications
Invited 3D Flash Memory fabricated using CBA (CMOS Directly
Bonded to Array) technology

National Advanced Packaging Manufacturing
Program (NAPMP)
National Yang Ming Chiao Tung University

10:45-11:05

4016

Moeki Nakano, Shigenori Nagahama, Toshio Takahashi, SEKISUI CHEMICAL CO., LTD ,Takuya Yamamoto

11:05-11:25

11:05-11:25

4009

Lecture A Temporary Bonding De-Bonding Tape with High
Thermal Resistance, Easy Peeling and Excellent TTV for
3DIC
Lecture A novel Direct Transfer Bonding process with particle
less tapes for Die to Wafer integration

11:25-11:45

11:25-11:45

4003

Lecture Advanced Technology Development of Squeeze EffectNon-Contact Handling Tool for Semiconductor Chips

13:00-14:30

4010

PosterAntioxidative Cu Electrodeposition for 3D Interconnects Ryo Aizawa (1), Masahiro Sawa (1), Jinta Nampo (1),with Hybrid Bonding
Yurina Fukumoto (1), Murugesan Mariappan (2),Takafumi Fukushima (2)(1) JCU Corporation(2) Tohoku University

4031

PosterTohoku University

4037

PosterRoom-Temperature and Compressive Force-Free Metal- Jiayi Shen, Chang Liu, Tetsu Tanaka, Takafumi
Metal Direct Bonding for Heterogeneous Integration of Fukushima
Micro-LED Array on 3D-IC
Plasma Hydrophilic Treatment for Improved Wafer
Daiki Nemoto, Kai Takeuchi, Eiji Higurashi
Bonding Strength via Polysilazane

4019

PosterPoster4007

PosterYu-Lun Liu, Chun-Ta Li, Tzu-Han Sun, Chien-Kang
Hsiung, Kuan-Neng Chen
B. Tanaka (1), T. Shino (2), M. Murugesan (1), T.
Tanaka (1), T. Fukushima (1)Yuya Yamahashi (1), Yuto Ohtera (1), Hiroyuki
Yotsuyanagi (1), Shyue-Kung Lu (2), Masaki
Hashizume (3)National Yang Ming Chiao Tung University

4018

Cost-Effective Low-Temperature Hybrid Bonding Using
Layer Transfer Technology
Characteristics of Ozone-Ethylene Radical Pretreatmentfor Hybrid Bonding Without Water Rinsing Processes
Detectability of Resistive Open Defects with Analog
Relaxation Oscillators Under Unit-to-Unit Variations ofDies

4022

PosterGate Driver IC for GaN Power Devices Suitable for 3DPower IC

Satoshi Matsumoto (1), Yusuke Ohgush (2)4034PosterAhmed Hossam-ELdeen, Sudipta Das, Giuliano Sisto

imec

4025

PosterDesign Enablement of Heterogenous Integration for
3DIC
3D SRAM Design & Optimization with Open Source
Memory Compiler

Yuanqing Cheng (1), Sunan Chen (1), Chao Wu (2),Yuan Guan (2)4021PosterMachine Learning-Based Diagnosis of Defects in Chiplet
Interconnects

Junming Li, Huaguo Liang, Xianrui Dou, Le Yu,Zhengfeng Huang, Yingchun Lu, Cuiyun Jiang(1) Beihang University(2) Beijing Smartchip Microelectronics TechnologyCo., Ltd.
Hefei University of Technology

4027

PosterShunya Nitta, Hiroaki Tatsumi, Hiroshi Nishikawa

Osaka University

4014

PosterCreep Behavior of Low-Temperature Sn-in Solder Using
Nanoindentation Test
16-Layer 3D Stacking Based on Self-AssemblyTechnology for HBM Application

Zehua Du (1), Hiroshi Kikuchi (2), Hishinuma Hayato(2), Tetsu Tanaka (1), Takafumi Fukushima (1)(1) Tohoku University(2) Yamaha Robotics Holdings Co. Ltd.

Lunch

11:45-13:00

Poster Session Core time*

13:00-14:30

SendaiKokusai
Hotel

Poster Session is scheduled on September 26. Poster session core time is 13:00-14:30, September 26.

Tomoka Kirihata (1), Masanori Yamagishi (1), Ichiro
Sano (2), Haruka Morita (2), Yusuke Fumita (1),Shinya Takyu (1)Hayato Hishinuma (1), Masaaki Miyatake (2), Hiroshi
Kikuchi (1), Yuta Tobari (1)(1) LINTEC Corporation(2) TAZMO CO.,LTD.
(1) Yamaha Robotics Holdings Co., Ltd.
(2) Tokyo University of ScienceTohoku University(1) Tohoku University(2) MEIDEN NANOPROCESS INNOVATIONS(1) Tokushima University(2) National Taiwan University of Science andTechnology(3) The Open University of Japan(1) Tokyo Metropolitan University(2) Kyushu Institute of Technology

1Sendai
3DIC 2024 Program
Schedule
Kokusai
September 25-27,2024
Hotel
Conference Venue:
September 25, 2024 at Hotel Metroloplitan Sendai
September 26-27, 2024 at Sendai Kakusai Hotel
SessionLocation
SessionPresentation
Session time
Datetime

27-Sep-24

Sendai
KokusaiHotel

as of September 6, 2024

paper_ Categorypaper_title
id4029Poster Temporary Adhesive Effect on Multichip Thinning forRapid Prototyping of 3D-IC from 2D-IC Fabricated in
Foundry Shuttle Services
4038
Poster Activation of Copper Surfaces by VUV-Redox Method
Using a Xenon Excimer lampAuthors

Affiliations

Shinichi EndoUshio Inc.,

4012

PosterClean Dicing: an Alternative Blade Dicing Technique for
Minimising Particles in 3D Heterogeneous Integration

Imec

4006

PosterImpact of 2-Dimensional Materials for 3D Power IC

Akito Hiro, Damien Jon Leech, Geert Schoofs, John
Slabbekoorn, Alain Phommahaxay, Koen Kennes,
Gerald Beyer, Eric Beyne
Satoshi Matsumoto (1)(3), Masataka Hasegawa (2),Ayano Furue (1),4035

Poster

Thermal Flow Simulation and Measurements of 3D Si
Chip Stacks with TSVs

Shuhei Yokota , Rikuu Hasegawa , Kazuki Monta,Takaaki Okidono, Takuji Miki , Makoto Nagata

Kobe Unversity

4033

Poster

Suppression of TSV-Induced Stress by Using Negative
Thermal Expansion Material

Hisashi Kino (1), Takafumi Fukushima (2), Tetsu
Tanaka (2)(1) Kyushu University(2) Tohoku University

4030

PosterTSV Formation Using a Direct Cu Electroplating onElectroless Plated Barrier Layer with a Low Resistivity

Yuko Ishii, Takanobu Hamamura, Tomohiro Shimizu,Takeshi Ito, Shoso Shingubara

Kansai University

CAD tools for 3DIC

Moderator: Paul D. Franzon
Panelists: Juan Rey (Siemens EDA), Robert Patti(Nhanced Semicon), others

North Carolina State University

Noriaki Matsunaga

Applied Materials Japan

Ole Hölck

Fraunhofer IZMAkihiro Tominaga, Jiayi Shen, Chang Liu, Tetsu Tanaka Tohoku Universityand Takafumi Fukushima(1) Tokyo Metropolitan University(2) AirMembrane Corporation(3) Kyushu Institute of Technology

Panel Session

14:30-15:15

14:30-15:15

PanelCoffee BreakInvited Talk VI

15:15-15:30
15:30-16:00

15:30-16:00

Invited Talk VII

16:00-16:30

16:00-16:30

Invited Advanced packaging process technologies forheterogeneous integration
Invited Fan-Out Panel Level Packaging revisited

Session 3:
Advanced Interposers

16:30-17:30

16:30-16:50

4011

Lecture Process development for a novel low loss and non-PFAS Hamideh Jafarpoorchekab, Xiao Sun, Angel Uruena,
photo imageable dielectric for RF silicon interposer
Siddhartha Sinha, Nelson Pinho, Andy Miller, Nadine
applications
Collaert

Imec

16:50-17:10

4015

Lecture Ultra-High Density Deep Trench Capacitor (DTC) for
3DIC Integration

Hsin-Li Cheng, Jyun-Ying Lin, Ting-Chen Hsu, ChunYen Peng, Felix Ying-Kit Tsui, Shih-Fen Huang

TSMC

17:10-17:30

4013

Lecture Direct Sputtered Copper Seed Layer Formation on Low
Dielectric Resin to Reduce Transmission LossAkihiro Shimizu (1), Kazuhiro Fukada (2), ShinichiEndo (1), Mitsunori Abe (3), Akiko Matsui (3)(1) Ushio Inc.
(2) Shibaura Machine Co.
(3) NTT Devices Cross Technologies Corporation

KeynoteRobert Patti

NHanced Semiconductors

Exhibition
Keynote Talk V

10:00-18:00
08:50-09:20

10:00-18:00
08:50-09:20

Session 4:
Design&Thermal Management

09:20-10:20

09:20-09:40

4005

09:40-10:00

4032

10:00-10:20

4026

10:20-10:35
10:35-10:55

4002

Lecture Face-Down and Heterogeneous Chip Bonding
Technology on Waffle Wafer for Bumpless Chip-onWafer (COW) Package

10:55-11:15

4020

Lecture Low-Temperature Adhesive Hybrid Bonding Technology Tzu-Han Sun, Yu-Lun Liu, Chun-Ta Li, Wen-Tzu Tsai,with Novel Area-Selective Passivation Layer
Mu-Ping Hsu, Kuan-Neng Chen

National Yang Ming Chiao Tung University

11:15-11:35

4017

Lecture Die-to-Wafer Hybrid Bonding Impact at mm-Wave
Frequencies(1) CEA-LETI, Univ. Grenoble Alpes(2) TIMA, Univ. Grenoble Alpes, CNRS
(3) CIME, Univ. Grenoble Alpes, CNRS
(4) STMicroelectronics

11:35-11:55

4028

11:55-12:15

4024

Coffee BreakSession 5:
Bumpless and Hybrid Bonding
TechnologyAward Ceremony and Closing
Remark

10:20-10:35
10:35-12:15

12:15-12:30

Poster Session is scheduled on September 26. Poster session core time is 13:00-14:30, September 26.

Eren Kurshan (1), Paul Franzon (2)Lecture Towards 3D AI Hardware: Fine-Grain Hardware
Characterization of 3D Stacks for Heterogeneous
System Integration & AI SystemsLecture A Novel Multi-Chip Cooling System Using Direct On-Chip Akshat Hetal Patel, Ketan Yogi, Gopinath Sahu, Tiwei
Jet Impingement for High-Performance Interposer
WeiPackages
A. Noriki (1), H. Uemura (2), H. Kuwatsuka (1), N.
Lecture Thermal Analysis of Reflow Process for PIC-Embedded
Package Substrate with 2.3D RDL Interposer for CoMatsui (2), R. Motoji (2), D. Maeda (2), T. Sugita (2),Packaged Optics
F. Nakamura (1), T. Amano (1)Purdue University(1) National Institute of Advanced Industrial Scienceand Technology (AIST)(2) Kyocera Corporation

Yoshiaki Satake (1)(2), Tatsuya Funaki (1)(2), Wataru (1) Murat a Manufacturing Co., Ltd.
Doi (1)(2), Hajime Kato (2)(3), Shogo Okita (2)(3),(2) Tokyo Institute of Technology
Takayuki Ohba (2)(3) Panasonic Connect Co., Ltd.

Mohammad Alsukour (1) (2), Olivier Valorge (1),Margot Faure (1), Loïc Vincent (3), Victor Milon (4),
PascalChevalier (4) Jean Daniel Arnould (2), EmmanuelPistono (2), Christophe Dubarry (1)Lecture Impact of Cu Pad Density on Cu-CMP and Bonding Yield M. Murugesan (1), H. Hashimoto (1), K. Mihara (2), F.
for Chip-to-Wafer Hybrid Bonding
Inoue (3), A. Uedono (4), T. Hare (2), T. Fukushima(1)
Lecture Surface Modification for Ultrasonic Cu-to-Cu DirectBonding(1) Princeton University(2) North Carolina State University

Wei Ting Chen Chih Hsien Chiu, Jenn Ming Song

(1) Tohoku University(2) Toray Engineering Co. Ltd.
(3) Yokohama National University(4) The University of Tsukuba
National Chung Hsing University

2

3DIC 2024 Program Schedule
September 25-27, 2024
Conference Venue:
September 25, 2024 at Hotel Metroloplitan Sendai
September 26-27, 2024 at Sendai Kakusai Hotel
SessionLocation
SessionPresentation
Session time
Datetime
Aobayama NanoTerasu Visit in Japanese
14:00-15:00
campusTohoku
NanoTerasu Visit in English
15:00-16:00
Univ.

Poster Session is scheduled on September 26. Poster session core time is 13:00-14:30, September 26.

as of September 6, 2024

paper_ Categorypaper_title
idAuthorsAffiliations

3