Application Note

Assembly Precautions
for the Nichia B35 Series LEDs

Table of contents
1. LED Outline Dimensions/Tape Dimensions ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 2
2. Handling Precautions

・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 3

3. Design Recommendations for Optimal Amount of Solder・ ・ ・ ・ 4

4. Precautions for Setting Up a Pick-and-Place Machine/Nozzle
5. Precautions When Reflow Soldering・ ・ 5-8・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 9

The part number NV4WB35AM, NV4WB35AR in this document are the part number of our products, anddo not have any relevance or similarity to other companies' products that may have trademark rights.
This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

1/10

SP-QR-C2-192146-3
Mar. 12, 2024

Assembly Precautions for the Nichia B35 Series LEDs

1. LED Outline Dimensions/Tape Dimensions
Table 1. Product Specifications

Part Number

NV4WB35AM, NV4WB35AR
光学的中心位置
Location of the optical center
3.65

3.2

3.12

0.5

3.65

LED

3.2

0.73

3.12

Cathode8±0.1

2±0.05 4±0.1

5.5 ±0.05
12 +0.3-0.1

CathodeEmbossed
CarrierTapeΦ1.5 +0.2-0

3.85±0.1

Anode[unit: mm, Tolerance: ±0.2mm]

0.2 ±0.05

3.85±0.1

Φ1.5 +0.1-01.75±0.10.73

Cathode Mark

1±0.1

Reel Size: 2,000 LEDs

[unit: mm]

This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

2/10

SP-QR-C2-192146-3
Mar. 12, 2024

Assembly Precautions for the Nichia B35 Series LEDs

2. Handling Precautions

Correct

Handling with bare hands
Do not handle the LEDs with bare hands:- this may contaminate the LED surface and have an effect on the optical characteristics,- this may cause the LED to deform and/or the wire to break causing a catastrophic failure (i.e. the LED
not to illuminate),- the lead frame may cause injuries when the LED is handled with bare hands.
Handling with tweezers
Ensure that when handling the LEDs with tweezers, excessive force is not applied to the LED. Otherwise, it
may cause damage to the resin (e.g. cut, scratch, chip, crack, delamination and deformation) and theinternal connection to fail causing a catastrophic failure (i.e. the LED not to illuminate).

Incorrect

ESD Precautions
LEDs are sensitive to transient excessive voltages (e.g. ESD, lightning surge). If this excessive voltage
occurs in the circuit, it may cause the LED to be damaged causing issues (e.g. the LED to have a reductionin the radiant flux or not to illuminate [i.e. catastrophic failure]). When handling the LEDs, ensure thatnecessary measures have been taken to protect them from transient excess voltages. Refer to theapplicable specification for more details.
Stacking assembled PCBs together
Do not stack assembled PCBs together. Otherwise, it may cause damage to the resin (e.g. cut, scratch,chip, crack, delamination and deformation) and the internal connection to fail causing a catastrophic
failure (i.e. the LED not to illuminate).
Storage
The storage/packaging requirements for the Nichia B35 Series LEDs are comparable to JEDEC MoistureSensitivity Level (MSL) 3 or equivalent. Nichia used IPC/JEDEC STD-020 as a reference to rate the MSL ofthis LED. If the “After Opening” storage time has been exceeded or any pink silica gel beads are found,ensure that the LED are baked before use. Baking should only be done once.

Figure 1. Example of an Improper
Holding Position

Table 2. Storage/Baking Conditions
StorageConditions
Before Opening Aluminum Bag

Temperature≤ 30°C

Humidity≤ 90% RHTime
Within 1 Year from Delivery Date

After Opening Aluminum Bag≤ 30°C≤ 70% RH

≤ 168 hours-≥24 hours

Baking65±5°CThis document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

3/10

SP-QR-C2-192146-3
Mar. 12, 2024

Assembly Precautions for the Nichia B35 Series LEDs

3. Design Recommendations for Optimal Amount of Solder
Soldering Pad Pattern/Metal Solder Stencil Aperture
Table 3. Recommended Soldering Pad Pattern/Metal Solder Stencil Aperture

Table 4. Modified Soldering Pad Pattern/Metal Solder Stencil Aperture

Soldering Pad Pattern

Stencil Aperture

Soldering Pad Pattern

Stencil Aperture

4 .1

4 .1

4 .1

4 .1
2 .5

3 .20 .5

3 .20 .6

3 .5

3 .50 .6

0 .7

[unit：mm][unit：mm][unit：mm]⋯ LED outline■ Soldering Pad Pattern■ Stencil Aperture

Table 5. Recommended Solder/Metal Solder Stencil Conditions

Item

RecommendedConditions

Solder Stencil Thickness

120 [μm]

Solder Paste

Sn-3.0Ag-0.5Cu[unit：mm]• The Modified Solder Pad Pattern and Stencil Aperture should
be used to control LED tilting and solder balling.

This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

4/10

SP-QR-C2-192146-3
Mar. 12, 2024

Assembly Precautions for the Nichia B35 Series LEDs

4. Precautions for Setting Up a Pick-and-Place Machine/Nozzle
Table 6. Cautions/Suggestions for setting up equipment

Item

Recommended Conditions/Specifications

Cautions/Suggestions

Pick-and-place machine1

Modular mounter

Pick-and-place nozzle

Smaller than the emission area(< □3.12mm)

See “Pick-and-Place Nozzle” on
Page 6 for the details.

Tape-and-reel feeder

Electrical (motorized) feeder
Tape width: 12mm
Feed length: 8mm

See “Tape-and-Reel Feeder” onPage 7 for the details.

Nozzle height for pick-up
operations

The contact surface of the nozzle head for pick
operations should be adjusted to the top surface of theembossed carrier tape pocket.

See “Recommended Nozzle Heightfor Pick-up Operations” on Page 7for the details.

Nozzle height for placementoperations (i.e. placement depth)

0.2mm for placement depth

See “Recommended Nozzle Heightfor Placement Operations(Placement Depth)” on Page 8 forthe details.

Imaging-based AutomaticInspection

Using the electrode as a reference is recommended tolocate the center of the LED.

See "Imaging-based Automatic
Inspection" on Page 8 for thedetails.

Note:
1 The recommended conditions/specifications above have been determined under the following verification conditions:
Pick-and-place machine (modular mounter):- YS100 High-Speed General-Purpose Modular (manufactured by Yamaha Motor Co., Ltd.)This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

5/10

SP-QR-C2-192146-3
Mar. 12, 2024

Assembly Precautions for the Nichia B35 Series LEDs
4-1. Pick-and-Place Nozzle

Correct

Case1

3 .12

3 .12

[Nozzle Size <3.12mm][unit：mm][LED][Contact Position]

Incorrect

Case2：Emission Area
＝Contact Area

Figure 2. Emission Area of NICHA B35 Series• Nozzle suction area should be smaller than the emission
area of the LED(3.12mm×3.12mm).
• Contact on the emission area.

[Nozzle Size <3.12mm][LED]Incorrect

Case3[Nozzle Size >3.12mm][Contact Position][LED][Contact Position]

Figure 3. Example of the pick-up by different nozzle and contact position.
This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

6/10

SP-QR-C2-192146-3
Mar. 12, 2024

Assembly Precautions for the Nichia B35 Series LEDs
4-2. Tape-and-Reel Feeder

Nozzle• Tape width:12mm / Feed length:8mm

Correct• The chosen tape feeder should be one that has a slower
feeding speed (e.g. electrical feeders).

Tape Removal Position• The recommended tape removal position is right next towhere the pick-and-place nozzle picks up the LEDs toprevent the LEDs from tilting within the tape pocket andbecoming damaged by the feeder shutter and/or nozzle.

Incorrect
Figure 4. Examples of Correct/Incorrect Top Cover Tape Removal Positions

4-3. Recommended Nozzle Height for Placement• Ensure that the nozzle only goes down to the top edge of the tape pocket andOperations (Placement Depth)
does not directly come into contact with the LED.

Note: The reference level for the nozzle setting is at the top edge of the tapepocket.
Nozzle• The recommended nozzle height for pick-up operations has been determined by
Nichia under the verification conditions (See Table 6) and may not function as
expected with some other pick-and-place machines. If the pick-up operations are
unstable even with using the recommended nozzle height, adjust the nozzle heightappropriate for the pick-and-place machine being used.
Nozzle Position
Embossed Carrier
TapeFigure 5. Recommended Nozzle Height for Pick-up Operations

If the pick point of the nozzle is too high,- it may cause insufficient suction power leading to picking errors (e.g. the nozzle’s
failure to pick/lift the LED into the air, incorrect picking causing the LED to tilt
when in the air).
If the pick point of the nozzle is too low,
- it may cause issues (e.g. causing the embossed carrier tape to shake, causing thetape pocket to deform) leading to picking failure and/or damage to the LED.

This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

7/10

SP-QR-C2-192146-3
Mar. 12, 2024

Assembly Precautions for the Nichia B35 Series LEDs
4-4. Recommended Nozzle Height forPlacement Operations (Placement Depth)• After the LED is mounted onto solder paste on the PCB, thenozzle should further press the LED 0.2mm into the PCB.

NozzleIf the press force is too weak,- Assembly failure may occur since the LED may float on top ofthe PCB or it may not separate from the nozzle.
Press
0.2 mm

If press force is too strong,- LED may receive excessive stress which may cause the LED tobe damaged.

BoardFigure 6. Recommended Nozzle Height for Placement (Placement Depth)

4-5. Imaging-based Automatic Inspection

Polarity Detection/Recognition Points

Electrode Location
Detection/Recogniti
on Points• Nichia recommends using the electrodes as a reference tolocate the center of the LED.
• If it cannot be recognized, adjust the recognition conditions
such as lighting, size, Threshold.
• If an automatic polarity detector is used for the LEDs, set up theimaging device to detect the cathode mark(fig.7
Recognition Point)

Figure 7. Imaging-based Automatic Inspection
This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

8/10

SP-QR-C2-192146-3
Mar. 12, 2024

Assembly Precautions for the Nichia B35 Series LEDs

5. Precautions When Reflow Soldering• Reflow soldering must not be performed more than twice.

1 to 5°C per sec
Pre-heat
180 to 200°C• Using the recommended reflow soldering conditions (See Figure 8 to theleft) as a reference, modify if necessary, the recommended reflow
conditions specified by the manufacturer of the solder paste being used.
260°CMax
10sec Max

60sec Max
Above 220°C
120sec Max

Figure 8. Recommended Reflow Soldering Condition(Lead-free Solder)Note:
To ensure that these reflow conditions have no negative effect on theLEDs, perform sufficient verification prior to use.
• When cooling the LEDs from the peak temperature a gradual coolingslope is recommended; do not cool the LEDs rapidly.
• During reflow soldering, the heat and atmosphere in the reflow oven may
cause the optical characteristics to degrade. In particular, reflow soldering
performed with an air atmosphere may have a greater negative effect on
the optical characteristics than if a nitrogen atmosphere is used; Nichiarecommends using a nitrogen reflow atmosphere.

This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

9/10

SP-QR-C2-192146-3
Mar. 12, 2024

Assembly Precautions for the Nichia B35 Series LEDs
Disclaimer
This application note is a controlled document of Nichia Corporation (Nichia) published to provide technical information/data forreference purposes only. By using this application note, the user agrees to the following:• This application note has been prepared solely for reference on the subject matters incorporated within it and Nichia makes noguarantee that customers will see the same results for their chosen application.
• The information/data contained herein are only typical examples of performances and/or applications for the product. Nichia
does not provide any guarantees or grant any license under or immunity from any intellectual property rights or other rights
held by Nichia or third parties.
• Nichia makes no representation or warranty, express or implied, as to the accuracy, completeness or usefulness of any
information contained herein. In addition, Nichia shall not be liable for any damages or losses arising out of exploiting, using,or downloading or otherwise this document, or any other acts associated with this document.
• The content of this application note may be changed without any prior or subsequent notice.
• Copyrights and all other rights regarding the content of this document are reserved by Nichia or the right holders who havepermitted Nichia to use the content. Without prior written consent of Nichia, republication, reproduction, and/or redistributionof the content of this document in any form or by any means, whether in whole or in part, including modifications or derivative
works hereof, is strictly prohibited.

491 Oka, Kaminaka-Cho, Anan-Shi,
TOKUSHIMA 774-8601, JAPAN
Phone: +81-884-22-2311 Fax: +81-884-21-0148

NICHIA CORPORATION
http://www.nichia.co.jp

This document contains tentative information, Nichia may change the contents without notice.

Light Emitting Diode

10/10

SP-QR-C2-192146-3
Mar. 12, 2024