Application Note

Assembly Precautions for
the Nichia 309 or 319 Series LEDs

Table of contents
1.

LED Outline Dimensions/Tape and Reel Dimensions

2.

Handling Precautions ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 6

3.

Design Recommendations for Optimal Amount of Solder ・ ・ ・ ・ ・ 7-8

4.

Precautions for Setting Up a Pick-and-Place Machine/Nozzle

5.

Precautions When Reflow Soldering

・ ・ ・ ・ ・ ・ ・ 2-5

・ ・ ・ 9-12・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 13

The part number NVSW309A, NVSW309B, NVSW319A and NVSW319B in this document are the part number of our
product, and do not have any relevance or similarity to other companies' products that may have trademark rights.
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 309/319 Series LEDs

1. LED Outline Dimensions(2 Terminals)/Tape and Reel Dimensions
Specific feature for this series

Table 1. NVSW309A Product Specifications

LED Outline Dimensions

Tape and Reel Dimensions

光学的中心位置
Location of the optical center

2±0.05 4±0.1

3.5

5.5 ±0.05

Cathode Mark

Cathode Mark(0.08 クロスバー凹部)(0.08 Crossbar Reduction)

0.4

3.1

0.35±0.05
3.7±0.1

8±0.1

12 +0.3-0.1

Φ1.5 +0.1-01.75±0.1

テーピング部 Tape

2.35±0.1

Φ1.5 +0.2
-0

0.52

3.5

3.7±0.1

2.1

リール部 Reel
330±2

A

3.2

K

Φ80 ±113.5±1

保護素子
Protection Device

Cathode

0.5
3.2

Anode

17.5±1

Reel Size:3,500 LEDs

Weight：typ. 0.032g

ラベル
Label

(Unit : mm)(Unit : ｍｍ,Tolerance : ±0.2mm)

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 309/319 Series LEDs

1. LED Outline Dimensions(2 Terminals)/Tape and Reel Dimensions
Specific feature for this series

Table 2. NVSW309B Product Specifications

LED Outline Dimensions

Tape and Reel Dimensions

光学的中心位置
Location of the optical center

0.77

3.5

3.7 ±0.1

3.5(0.08 クロスバー凹部)(0.08 Crossbar Recess)0.35±0.05

12 +0.3-0.1

2±0.05 4±0.1

Cathode Mark

0.4
Cathode Mark8±0.1

5.5 ±0.05

Φ1.5 +0.1-01.75±0.1

テーピング部 Tape

2.55±0.1

Φ1.5 +0.2-0

2.35

3.7±0.1

リール部 Reel
330±2

13.5±1

3.2

3.2

K

Φ100±1

0.5
A

保護素子
Protection Device

17.5±1

Reel Size:3,000 LEDs

Weight：typ. 0.035g
Catnode

Anode

ラベル
Label

(Unit : ｍｍ,Tolerance : ±0.2mm)(Unit : mm)

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 309/319 Series LEDs

1. LED Outline Dimensions(3 Terminals)/Tape and Reel Dimensions
Specific feature for this series

Table 3. NVSW319A Product Specifications

LED Outline Dimensions

Tape and Reel Dimensions

光学的中心位置
Location of the optical center

2±0.05 4±0.1

3.5

5.5 ±0.05

Cathode Mark

Cathode Mark(0.08 クロスバー凹部)(0.08 Crossbar Recess)

0.4

3.1

0.35±0.05
3.7±0.1

8±0.1

12 +0.3-0.1

Φ1.5 +0.1-01.75±0.1

テーピング部 Tape

2.35±0.1

Φ1.5 +0.2
-0

0.52

3.5

2.1

3.7±0.1

リール部 Reel
330±2

13.5±1

Φ80 ±1

保護素子
Protection Device

Cathodeダイヒートシンク
Die Heat Sink

A

3.2

2.4

K

ダイヒートシンク
Die Heat Sink

1.3

0.5

0.45

3.2

17.5±1

Anode

Reel Size:3,500 LEDs

Weight：typ. 0.032g

ラベル
Label

(Unit : ｍｍ)(Unit : ｍｍ,Tolerance : ±0.2mm)

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 309/319 Series LEDs

1. LED Outline Dimensions(3 Terminals)/Tape and Reel Dimensions
Specific feature for this series

Table 4. NVSW319B Product Specifications

LED Outline Dimensions

Tape and Reel Dimensions

光学的中心位置
Location of the optical center

0.77

3.5

3.7 ±0.1

3.5(0.08 クロスバー凹部)(0.08 Crossbar Recess)0.35±0.05

12 +0.3-0.1

2±0.05 4±0.1

Cathode Mark

0.4
Cathode Mark8±0.1

5.5 ±0.05

Φ1.5 +0.1-01.75±0.1

テーピング部 Tape

2.55±0.1

Φ1.5 +0.2-0

2.35

3.7±0.1

リール部 Reel
330±2

3.2

13.5±1

0.5

0.45
A

保護素子
Protection Device

3.2

2.4

K

Φ100±1

1.3

ダイヒートシンク
Die Heat Sink

CathodeAnodeダイヒートシンク
Die Heat Sink

17.5±1

Reel Size:3,000 LEDs

Weight：typ. 0.035g

ラベル
Label

(Unit : mm, Tolerance : ±0.2mm)(Unit : mm)

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 309/319 Series LEDs

2. Handling Precautions
2.1 Handling with bare hands

Do not handle the LEDs with bare hands:- this may contaminate the LED surface and have an effect on the optical characteristics,- this may cause the LED to deform and/or the wire to break causing a catastrophic failure (i.e. the LED not toilluminate),- the lead frame may cause injuries when the LED is handled with bare hands.

2.2 Handling with tweezers
Ensure that when handling the LEDs with tweezers, excessive force is not applied to the LED. Otherwise, it may cause
damage to the resin (e.g. cut, scratch, chip, crack, delamination and deformation) and the wire to break causing acatastrophic failure (i.e. the LED not to illuminate).

2.3 ESD Precautions
The LEDs are sensitive to transient excessive voltages (e.g. ESD, lightning surge). If this excessive voltage occurs in thecircuit, it may cause the LED to be damaged causing issues (e.g. the LED to become dimmer or not to illuminate [i.e.
catastrophic failure]). When handling the LEDs, ensure that necessary measures have been taken to protect them fromtransient excess voltages. Refer to the applicable specification for more details.

Correct

Suggestion: Grab/holdthe LEDs with tweezers by
the sides of the substrate.

Incorrect

2.4 Stacking assembled PCBs together
Do not stack assembled PCBs together. Otherwise, it may cause damage to the resin (e.g. cut, scratch, chip, crack,delamination and deformation) and the wire to break causing a catastrophic failure (i.e. the LED not to illuminate).

2.5 Baking

Incorrect

The storage/packaging requirements for the Nichia 309/319 series LEDs are comparable to JEDEC Moisture Sensitivity
Level (MSL) 3 or equivalent. Nichia used IPC/JEDEC STD-020 as a reference to rate the MSL of this LED. If the “After
Opening” storage time has been exceeded or any pink silica gel beads are found, ensure that the LED are baked before
use. Baking should only be done once.

Table 5. Storage/Baking Conditions
Conditions
Storage

Temperature

Humidity

Before Opening Aluminum Bag≤ 30°C≤ 90%RH

Within 1 Year from Delivery Date

After Opening Aluminum Bag≤ 30°C≤ 70%RH≤ 168 hours

65±5°C-≥ 24 hours

Baking(Reel is Removed from Aluminum Bag)Time

Caution: Do not let thetweezers touch the lens(Silicone Resin).
Figure 1. Examples ofproper/improper handlingwith tweezers

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 309/319 Series LEDs

3. Design Recommendations for Optimal Amount of Solder(2 Terminals ※1)
Soldering Pad Pattern/Metal Solder Stencil Aperture※1 Part No.
NVSW309A,NVSW309B

Table 6. Recommended Soldering Pad Pattern/Metal Solder Stencil Aperture
Recommended
Soldering Pad Pattern

Recommended
Metal Solder Stencil Aperture

LED Outline and Electrodes
Soldering Pad Pattern
Solder Stencil Aperture

4.1
0.6

Table 7. Recommended Solder/Metal Solder Stencil Conditionsー3.5

Solder Pad
Pattern andStencil
Aperture asrecommended
in thespecification

Cathode4.1
2.5

Stencil Thickness

120μm

Solder Paste

Sn-3.0Ag-0.5Cu-The Modified Solder Pad Pattern andStencil Aperture should be used tocontrol LED tilting and solder balling.

3.2

3.2

0.5

CathodeRecommended
Conditions

Anode(Unit : mm)

4.1

Modified
Solder Pad
Pattern andStencil
Aperture

Item

Anode

(Unit : mm)

0.7(Unit : mm)-The soldering pattern shapes, metal
solder stencil aperture shapes, andmetal stencil thicknesses shown in
Tables 6 and 7 were selected based on
Nichia’s recommended placement
conditions.
Customers should ensure that there are
no issues with the chosen placement
conditions before use.

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 309/319 Series LEDs

3. Design Recommendations for Optimal Amount of Solder(3 Terminals ※2)
Soldering Pad Pattern/Metal Solder Stencil Aperture※2 Part No.
NVSW319A,NVSW319B

Table 8. Recommended Soldering Pad Pattern/Metal Solder Stencil Aperture

4.1
3
2.5
0.8

CathodeDie Heat Sink

Anode
(Unit : mm)

LED Outline and Electrodes
Soldering Pad Pattern
Solder Stencil Aperture

Table 9. Recommended Solder/Metal Solder Stencil Conditions

1.2
2.4

2.1

4.1
3.3
2.3
1.3

1.2

Recommended
Metal Solder Stencil Aperture

3.3

Recommended
Soldering Pad Pattern

Item

Recommended
Conditions

Stencil Thickness

120μm

Solder Paste

Sn-3.0Ag-0.5Cu(Unit : mm)-The soldering pattern shapes, metal solder stencil aperture shapes, and metal stencil thicknesses shown in Tables 8 and 9 were selected based on
Nichia’s recommended placement conditions.
Customers should ensure that there are no issues with the chosen placement conditions before use.

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 309/319 Series LEDs

4. Precautions for Setting Up a Pick-and-Place Machine/Nozzle
Table 10. Cautions/Suggestions for Setting Up Equipment
Item

Recommended Conditions/Specifications

Cautions/Suggestions

Pick-and-Place machine

Modular mounter

See the note below this table.

Pick-and-Place Nozzle

Specially designed nozzle(see Figure 2)

See “Pick-and-Place Nozzle” on Page 10 for the details.

Tape-and-reel feeder

Electrical (motorized) feeder
Tape width: 12mm
Feed length: 8mm

Nozzle height for pick-up
operations

The contact surface of the nozzle head for pick
operations should be adjusted to the top surface of theembossed carrier tape pocket.

See “Recommended Nozzle Height for Pick-up
Operations” on Page 11 for the details.

Nozzle height forplacement operations (i.e.
placement depth)

0.2mm for placement depth

See “Recommended Nozzle Height for Placement
Operations (Placement Depth)” on Page 12 for thedetails.

Imaging-based Automatic
Inspection

Using the electrode as a reference is recommended tolocate the center of the LED.

See "Imaging-based Automatic Inspection" on Page 12
for the details.

See “Tape-and-Reel Feeder” on Page 11 for the details.

Note:
-

The recommended conditions/specifications above have been determined under the following verification conditions:
Pick-and-Place machine (modular mounter):- YS100 High-Speed General-Purpose Modular (manufactured by Yamaha Motor Co., Ltd.)This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 309/319 Series LEDs
4.1 Pick-and-Place Nozzle

0.4

1.9

0.5

1. When selecting/designing the pick-and-place nozzle, it is important to make sure that there isabsolutely no contact between the nozzle and the lens. Ensure proper clearance by taking into
consideration the dimensional tolerance of the nozzle and the dimensional tolerance of the
LED lens. Nichia’s 309/319 series can be used with the pick-and-place nozzle shown in Figure 2.

Φ3.5
4.5

A

0.15
A部拡大
Expansion of A

2. As shown in Figure 2, the nozzle tip should only touch the flat corners of the LED’s top surface tohold the LEDs. Ensure that it does not come in contact with the lens. The LEDs uses a silicone
resin for the lens and internal pre-coating resin; the silicone resin is soft. If pressure is applied to
the lens, it may cause the lens to be damaged, chipped and/or delaminated. If the lens isdamaged, chipped, delaminated and/or deformed, it may cause the internal connection to failcausing a catastrophic failure (i.e. the LED not to illuminate) and/or reliability issues (e.g. the LED
to corrode and/or to become dimmer, the color/directivity to change, etc.) Ensure that no
amount of pressure is applied to the lens.

(単位 Unit: mm)Table 11. Part Height(Unit : mm)
Figure 2. Recommended Nozzle Dimensions

Part Height

NVSW309A
NVSW319A

4.2 Part Height

NVSW309B
NVSW319B

NozzleLED

Figure 3. Cross-sectional view of a nozzle whentransporting a LED to a PCB

0.2

0.77

1.9
(1.55)

0.52

1.9(1.55)Part Height※3

0.2(Unit : mm)※3 Note: The height of the part varies depending on which LEDs are being used (refer to Table 11) for further details.
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 309/319 Series LEDs
4.3 Tape-and-Reel Feeder Top Cover Tape Removal Position

1. Recommended setting for the tape-and-reel feeder.
Tape width: 12mm
Feed length: 8mm
2. Use a tape-and-reel feeder that ensures it does not create excessive
vibrations causing assembly issues.
Example: Electrical (motorized) feeder

Correct
Feed Speed：Slow Vibration：Small
Top Cover Tape
Removal Position

Incorrect
Feed Speed：Fast

Vibration：Large

LED pick up
position

3. When removing the top cover tape it should be done adjacent to thetarget LED (See Figure 4). Otherwise, it may shake the embossed
carrier tape and cause the LED to move within the tape pocket. Thismay cause- the nozzle to fail to pick up the LED or not to pick it up properly
and shift while on the nozzle during the transport to the PCB (i.e.
pick-up/placement failure)- the LED to hit the feeder cover and become damaged.

LED pick up
position

1. Ensure that the nozzle only goes down to the top edge of the tapepocket and does not directly come into contact with the LED.

Figure 4. Examples of Correct/Incorrect Top Cover Tape Removal Positions

Note: The reference level for the nozzle setting is at the top edge ofthe tape pocket.

4.4 Recommended Nozzle Height for Pick-up Operations

2. The recommended nozzle height for pick-up operations has been
determined by Nichia under the verification conditions (See Table 10)
and may not function as expected with some other pick-and-placemachines. If the pick-up operations are unstable even with using therecommended nozzle height, adjust the nozzle height appropriate forthe pick-and-place machine being used.

NozzleIf the pick point of the nozzle is too high,- it may cause insufficient suction power leading to picking
errors (e.g. the nozzle’s failure to pick/lift the LED into the air,incorrect picking causing the LED to tilt when in the air).

Nozzle position

LED

Embossed carrier tapeFigure 5. Cross-sectional view of a nozzle when transporting a LED to a PCB

If the pick point of the nozzle is too low,
- it may cause issues (e.g. causing the embossed carrier tape toshake, causing the tape pocket to deform) leading to picking
failure and/or damage to the LED.

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 309/319 Series LEDs
4.5 Recommended Nozzle Height for Placement Operations (Placement Depth)
1. After the LED is mounted onto solder paste on the PCB, thenozzle should further press the LED 0.2mm into the PCB.

NozzleIf the release point of the nozzle is too high,- it may cause placement issues (e.g. the LED to stick to
the nozzle after placement, the LED to become soldered
to the PCB in a tilted position, etc.).

LED

If the release point of the nozzle is too low,
- excessive forces may be applied to the LED during
placement and it may cause the LED to become
damaged.

Press
0.2mm

2. The height of the part varies depending on which LEDs arebeing used. Customers must check the Nichia specifications
before mounting the LEDs.

Board

Figure 6. Recommended Nozzle Height for Placement (Placement Depth)

4.6 Imaging-based Automatic Inspection
Electrode Location Detection/ Recognition
Points

2 Terminals

1. Nichia recommends using the electrodes as a reference tolocate the center of the LED.
2. If the imaging device has trouble detecting/recognizing theelectrodes due to the uniqueness of the electrode pattern,
adjust it to detect/recognize the outer portions of theelectrodes (i.e. the areas circled in red in Figure 7 to the left).

3 Terminals

Figure 7. Recommended reference points to detect, recognize, or locate the electrodes
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 309/319 Series LEDs

5. Precautions When Reflow Soldering

1. Reflow soldering must not be performed more than twice.
2. Using the recommended reflow soldering conditions (See Figure 8 to the left) asa reference, modify if necessary, the recommended reflow conditions specified
by the manufacturer of the solder paste being used.
Note: To ensure that these reflow conditions have no negative effect on theLEDs, perform sufficient verification prior to use.
3. When cooling the LEDs from the peak temperature a gradual cooling slope isrecommended; do not cool the LEDs rapidly.
4. During reflow soldering, the heat and atmosphere in the reflow oven may cause
the optical characteristics to degrade. In particular, reflow soldering performed
with an air atmosphere may have a greater negative effect on the opticalcharacteristics than if a nitrogen atmosphere is used; Nichia recommends using anitrogen reflow atmosphere.

Figure 8. Recommended Reflow Soldering Condition(Lead-free Solder)This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 309/319 Series LEDs

Disclaimer
This application note is a controlled document of Nichia Corporation (Nichia) published to provide technical information/data forreference purposes only. By using this application note, the user agrees to the following:• This application note has been prepared solely for reference on the subject matters incorporated within it and Nichia makes noguarantee that customers will see the same results for their chosen application.
• The information/data contained herein are only typical examples of performances and/or applications for the product. Nichia
does not provide any guarantees or grant any license under or immunity from any intellectual property rights or other rights
held by Nichia or third parties.
• Nichia makes no representation or warranty, express or implied, as to the accuracy, completeness or usefulness of any
information contained herein. In addition, Nichia shall not be liable for any damages or losses arising out of exploiting, using,or downloading or otherwise this document, or any other acts associated with this document.
• The content of this application note may be changed without any prior or subsequent notice.
• Copyrights and all other rights regarding the content of this document are reserved by Nichia or the right holders who havepermitted Nichia to use the content. Without prior written consent of Nichia, republication, reproduction, and/or redistributionof the content of this document in any form or by any means, whether in whole or in part, including modifications or derivative
works hereof, is strictly prohibited.

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TOKUSHIMA 774-8601, JAPAN
Phone: +81-884-22-2311 Fax: +81-884-21-0148

NICHIA CORPORATION
http://www.nichia.co.jp

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