®

Thermal Management Materials

CONTENTS
Introduction................................................................................................... 3
Product Portfolio.......................................................................................... 4

THERMAL ADHESIVES
Tapes............................................................................................................... 6
Films............................................................................................................... 7
Liquids............................................................................................................ 8

THERMAL NON-ADHESIVES
Thin Pads..................................................................................................... 10
Gap Fillers.....................................................................................................12
Phase-Change Materials............................................................................ 14
Greases..........................................................................................................15

INTRODUCTION
To address the thermal demands of today’s electronic devices, Henkel has developed a complete portfolio of
high-performance, user-friendly products. Effective control of heat is an increasing concern among today’s electronic
device manufacturers and, as products become smaller, the need to dissipate damaging heat effectively will begreater than ever.
Of course, each application is unique and its requirements specific, which is why Henkel has formulated acomprehensive range of thermal management materials to suit a variety of current and future heat control needs.
Under the banner of the well-respected LOCTITE® and BERGQUIST® brands, Henkel’s thermal management materials
include:THERMAL ADHESIVES• Tapes• Film• Liquids

THERMAL NON-ADHESIVES• Thin Pads
• Gap Fillers• Phase-Change Materials• Greases

As consumer demand and product capability continue todrive greater function within ever-decreasing footprints,
effectively controlling the thermal load will be critical toensuring long product life cycles and expected reliability.
That’s why today’s electronics manufacturers are
increasingly turning to Henkel for trusted, proventhermal management solutions.

Thermal Management Materials | 3

PRODUCT PORTFOLIO

Adhesives

Tapes

Films

Thermally
Conductive

Liquids

Thermally andElectrically
Conductive
Heat Cure

Room Temperature CureBERGQUIST®
BOND-PLY TBP 850

LOCTITE®
ABLESTIK 506

LOCTITEABLESTIK 5025E

LOCTITEABLESTIK 5404

LOCTITEABLESTIK 8700K

LOCTITE315*

LOCTITE
383*

BERGQUIST®
BOND-PLY TBP 800

LOCTITEABLESTIK 561K

LOCTITEABLESTIK CF 3350

LOCTITEABLESTIK QMI529HTLOCTITEABLESTIK E 3503-1

LOCTITE
3873*

LOCTITE
384*

BERGQUIST®
BOND-PLY TBP
1400LMS-HD

LOCTITEABLESTIK 563K

LOCTITEABLESTIK ECF 561E

LOCTITEABLESTIK QMI536HT

LOCTITEABLESTIK TE 3530

LOCTITE
3874*

BERGQUIST®
LIQUI-BOND TLB
SA1000BERGQUIST®
LIQUI-BOND TLB
EA1800BERGQUIST®
LIQUI-BOND TLB
SA2000*Needs Thermally Conductive Activator
LOCTITE 7387

4 | Thermal Management Materials

Non-Adhesives

Thin Pads

Gap Fillers

Phase-Change Materials

Greases

ElectricallyInsulating

Non-electricallyInsulating

Pads

Liquids

Pads

Liquids

BERGQUIST®
SIL PAD® TSP 900

BERGQUIST®
SIL PAD® TSP Q2500

BERGQUIST®
GAP PAD®
TGP 1000VOUS

BERGQUIST®
GAP FILLER
TGF 1000SR

BERGQUIST®
HI-FLOW THF 1600P

LOCTITETCP 4000 SERIESLOCTITETC 4

BERGQUIST®
SIL PAD® TSP 1600S

BERGQUIST®
SIL PAD® TSP Q2000

BERGQUIST®
GAP PAD® TGP 1000SFBERGQUIST®
GAP FILLER TGF 1500

BERGQUIST®
HI-FLOW THF 3000UTLOCTITETCP 7000LOCTITE
TC 8M

BERGQUIST®
SIL PAD® TSP 1100ST

BERGQUIST®
GAP PAD® TGP 1100SF

BERGQUIST®
GAP FILLER
TGF 1500LVO

BERGQUIST®
HI-FLOW THF 1500P

LOCTITETCP 8175M1

BERGQUIST®
SIL PAD® TSP 1800

BERGQUIST®
GAP PAD® TGP 1500

BERGQUIST®
GAP FILLERTGF 3500LVO

LOCTITE
EIF 1000LOCTITETG 100BERGQUIST®
SIL PAD® TSP 1800ST

BERGQUIST®
GAP PAD® TGP 1500R

BERGQUIST®
GAP FILLER TGF 3600

LOCTITETCF 1000BERGQUIST®
SIL PAD® TSP 3500

BERGQUIST®
GAP PAD®
TGP 2200SF

BERGQUIST®
GAP FILLER TGF 4000

LOCTITETCF 2000 AF

BERGQUIST®
SIL PAD® K-10

BERGQUIST®
GAP PAD®
TGP 3004SF

BERGQUIST®
LIQUI-FORM
TLF LF3500

LOCTITETCF 4000 PXF

BERGQUIST®
GAP PAD®
TGP 3500ULM
BERGQUIST®
GAP PAD®
TGP HC3000
BERGQUIST®
GAP PAD®
TGP HC5000

Thermal Management Materials | 5

ADHESIVES | TAPESThe BOND-PLY family of materials are thermally conductive and electrically isolating. BOND-PLY is available in apressure-sensetive adhesive (PSA) or laminating format. BOND-PLY provides for the decoupling of bonded materials withmismatched thermal coefficients of expansion. BOND-PLY provides:• A replacement to heat cure adhesives• A replacement to screw mounting• A replacement to clip mounting

Tapes

BERGQUIST®
BOND-PLY TBP 850

BERGQUIST®
BOND-PLY TBP 800

BERGQUIST® BOND-PLY
TBP 1400LMS-HD

DESCRIPTIONCOLOR

THICKNESS(in.)

LAP SHEER
AT RT
(psi)

BREAKDOWNVOLTAGE
(VAC)

FLAME
RATING(UL 94)

THERMALCONDUCTIVITY(W/m-K)

THERMAL
IMPEDANCE(°C-in.2/W)

BERGQUIST® BOND-PLY TBP 850(Formerly know as BOND-PLY 100)

Fiberglass-reinforced
pressure-sensitiveadhesive tape

White

0.005
0.008
0.011

100

3,000
6,000
8,500

V-0

0.8

0.52
0.78
1.01

BERGQUIST® BOND-PLY TBP 800(Formerly know as BOND-PLY 800)

Fiberglass-reinforced
pressure-sensitiveadhesive tape

Gray

0.005
0.008

150

4,000
6,000

V-0

0.8

0.60
0.72

BERGQUIST® BOND-PLY TBP 1400LMS-HD(Formerly know as BOND-PLY LMS-HD)

Silicone, high-durability
laminate material

Yellow

0.010
0.012

200

5,000

V-0

1.4(1)

2.1 (°C/W)(2)PRODUCT

Tapes(1) The ASTM D5470 (BERGQUIST® modified) test procedure was used on post-cured BERGQUIST® BOND-PLY TBP 1400LMS-HD material. The recorded value includes interfacial thermal resistance. These values are
given for customer reference only.
(2) TO-220 Thermal Performance testing, per the BERGQUIST® RD2010 specification for laminates, was completed on pre-laminated TO-220 assemblies. Lamination was completed at the pressure levels referenced
above. Actual pressure during performance testing was limited to the inherent weight distribution of the TO-220 component. No additional pressure was applied.

6 | Thermal Management Materials

ADHESIVES | FILMS
When there is a requirement for bonding large areas or complex parts together, thermal adhesive films are the preferredmaterials. Larger bonding areas are problematic for liquid-based mediums as voids may result; films, however, deliver
uniform, void-free bondlines and controlled thicknesses. Supplied in custom, pre-cut formats, Henkel’s line of thermal
adhesive films offers a clean, waste-free, easily-processed solution with a low total cost of ownership in thermally andelectrically-conductive formulas.

Films

Thermally Conductive

Thermally and Electrically
Conductive

LOCTITE®
ABLESTIK 506

LOCTITEABLESTIK 5025E

LOCTITEABLESTIK 561K

LOCTITEABLESTIK CF 3350

LOCTITEABLESTIK 563K

LOCTITEABLESTIK ECF 561E

DESCRIPTIONTENSILESTRENGTH LAPSHEAR (psi)

THERMALCONDUCTIVITY(W/m-K)

VOLUMERESISTIVITY(Ω-cm)PRIMARY
CURE CYCLE

SHELF
LIFE

FILM
THICKNESSAVAILABLE (mil)

LOCTITE®
ABLESTIK 506

Flexible film adhesive designed for bonding
mismatched CTE materials; slight tack can simplify
assembly

1,200

0.9

7 X 1012

1 hr. at 150°C

6 months at-40°C

4, 5, 6LOCTITEABLESTIK 561K

High adhesion strength with excellent flexibility forbonding mismatched CTE materials

3,300

0.9

9 X 1012

30 min. at 150°C

1 year at -40°C

4, 5, 6LOCTITEABLESTIK 563K

Electrically insulating film with high thermal
conductivity and adhesion strength; available either
unsupported or with a fiberglass carrier

3,000

1

1 X 1013

30 min. at 150°C

1 year at -40°C

2, 3, 4, 5, 6

PRODUCT

Thermally Conductive

Thermally and Electrically Conductive
LOCTITEABLESTIK 5025E

Sister formulation to LOCTITE ABLESTIK CF 3350 thathas been certified to MIL-STD-883, Method 5011

2,500

6.5

2 X 10-4

30 min. at 150°C

6 months
at 5°C2, 3, 4, 5, 6

LOCTITEABLESTIK CF 3350

Silver-filled film with an excellent balance of adhesion
strength, electrical and thermal conductivity, andprocessability; especially suited for RF applications

3,400

7

2 X 10-4

30 min. at 150°C

9 months
at 5°C

2, 4

LOCTITEABLESTIK ECF 561E

Most flexible of the fiberglass-supported, electricallyconductive products

2,000

1.6

6.0 X 10-3

1 hr. at
150°C

1 year at -40°C

4, 5, 6

Thermal Management Materials | 7

ADHESIVES | LIQUIDS
Henkel’s heat-cure liquid adhesives provide robust mechanical attachment, allowing for the elimination of fasteners
such as screws and clips, which also helps reduce device size and weight to align with the trend toward electronics
miniaturization. These are ideal for coupling “hot” electronic components mounted on PC boards with an adjacent metalcase or heat sink.

Liquids

Heat Cure

LOCTITE® ABLESTIK 5404

LOCTITE ABLESTIK E 3503-1

LOCTITE ABLESTIK QMI529HTLOCTITE ABLESTIK TE 3530

LOCTITE ABLESTIK QMI536HT

BERGQUIST® LIQUI-BOND
TLB SA1000

LOCTITE ABLESTIK 8700K

BERGQUIST® LIQUI-BOND
TLB SA2000

DESCRIPTION

CURE
TYPE

CURE SCHEDULE

VISCOSITY(cP)

THERMALCONDUCTIVITY(W/m-K)

VOLUMERESISTIVITY(Ω-cm)SHELF LIFE

LOCTITE® ABLESTIK 5404

Self-shimming, flexible silicone adhesivefor high-temperature-resistant applications
such as ceramic boards

Heat

10 min. at 150°C

Paste

1

2.9 X 1014

5 months
at 5°CLOCTITE ABLESTIK QMI529HT

Electrically conductive, silver-filled adhesivewith high thermal conductivity

Heat

Snap Cure (single zone):
60 sec. at 185°C.
Oven Cure: 30 min. at 185°C

18,500

6

4 X 10-5

12 months at-40°C

LOCTITE ABLESTIK QMI536HT

Boron nitride-filled, electrically nonconductive paste

Heat

Skip Cure: 0.8 sec. at 150°C
Oven Cure: 15 min. at 15°C

13,0000.9

1.0 X 1013

12 months at-40°C

LOCTITE ABLESTIK 8700K

Mil standard certified, one-component,
thermally-conductive epoxy adhesiveHeat

60 min. at 175°C
2 hrs. at 160°C

45,0000.5

3.0 X 1014

9 months at-40°C

LOCTITE ABLESTIK E 3503-1

Smooth paste assuring minimum bondline
thickness for lower overall thermal
resistanceHeat

30 min. at 100°C
10 min. at 120°C
5 min. at 150°C

60,0001

1.0 X 1014

6 months at-18°C to -25°C

LOCTITE ABLESTIK TE 3530

One-component, low-temperature curing,thermally-conductive epoxy adhesiveHeat

30 min. at 100°C

60,0002.3

1.0 X 1015

6 months at-18°C to -25°C

BERGQUIST® LIQUI-BOND TLB SA1000(Formerly know as LIQUI-BOND SA1000)

One-component, thermally-conductive
silicone adhesiveHeat

20 min. at 125°C
10 min. at 150°C

125,000

1.0

1.0 X 1010

6 months at
10°C

BERGQUIST® LIQUI-BOND TLB SA2000(Formerly know as LIQUI-BOND SA2000)

One-component, thermally-conductive
silicone adhesiveHeat

20 min. at 125°C
10 min. at 150°C

200,000

2.0

1.0 X 1011

6 months at
10°C

PRODUCT

Heat Cure

8 | Thermal Management Materials

ADHESIVES | LIQUIDS
Henkel’s room-temperature cure adhesives can be utilized with typical applications include bonding transformers,
transistors and other heat-generating electronic components to printed circuit board assemblies or heat sinks. With
the ability to maintain thin bondlines and excellent thermal paths, LOCTITE® and BERGQUIST® brand liquid adhesives
provide superb thermal management.

Liquids

Room Temperature Cure

LOCTITE 315*

LOCTITE 384*

LOCTITE 3873*

LOCTITE 3874*

LOCTITE 383*

BERGQUIST® LIQUI-BOND
TLB EA1800

DESCRIPTIONCURE TYPE

CURE SCHEDULES

VISCOSITY(cP)

THERMALCONDUCTIVITY(W/m-K)

VOLUMERESISTIVITY(Ω-cm)SHELF
LIFE

LOCTITE 315

A self-shimming, thermally-conductive, one-partadhesive for bonding electrical components toheat sinks with an insulating gap

Activator(LOCTITE 7387)

24 to 72 hr.
at 20°C

600,000

0.81

1.3 X 1012

9 months
at 5°CLOCTITE 3873

Self-shimming adhesive with high bonding
strength for heat sink application

Activator(LOCTITE 7387)

24 to 72 hr.
at 20°C

200,000

1.25

4.3 X 1014

21
monthsat 5°CLOCTITE 383

High-strength, room-temperature curing adhesive
for permanent assemblies

Activator(LOCTITE 7387)

24 to 72 hr.
at 20°C

500,000

0.6

5.2 x 1011

9 months
at 5°CLOCTITE 384

Repairable, room-temperature curing adhesive
utilized for parts subject to disassembly

Activator(LOCTITE 7387)

24 to 72 hr.
at 20°C

100,000

0.76

1.3 X 1012

9 months
at 5°CLOCTITE 3874

Fast-curing, high-conductivity adhesive for bonding
heat-generating devices to a thermal spreader“without glass beads”

Activator(LOCTITE 7387)

24 to 72 hr.
at 20°C

800,000

1.25

4.3 X 1014

9 months
at 5°C

Two-component, epoxy-based,liquid-dispensable adhesive

Room orelevated
temperature

10 hr. at 25°C
10 min. at 125°C

Part A: 60
Part B: 62

1.8

1 X 1014

6 months
at 25°CPRODUCT

Room-Temperature CureBERGQUIST® LIQUI-BOND TLB EA1800(Formerly know as LIQUI-BOND EA1805)

Thermal Management Materials | 9

NON-ADHESIVES | THIN PADS
More than 35 years ago, Henkel set the standard for elastomeric thermal interface materials with the introductionof SIL PAD®. Today, Henkel is a world leader with a complete family of SIL PAD® materials to meet the critical needs of a
rapidly changing electronics industry. In their many forms, SIL PAD® thermally conductive insulators continue tobe a clean and efficient alternative to mica, ceramics, or grease for a wide range of electronic applications. Henkel
application specialists work closely with customers to specify the proper SIL PAD® material for every unique thermal
management requirement.

Thin Pads

Electrically Insulating

BERGQUIST®
SIL PAD® TSP 900

BERGQUIST®
SIL PAD® 1500ST

BERGQUIST®
SIL PAD® 900S

BERGQUIST®
SIL PAD® 2000

BERGQUIST®
SIL PAD® 1100ST

BERGQUIST®
SIL PAD® K-10

BERGQUIST®
SIL PAD® 1200

DESCRIPTIONCOLOR

THICKNESS(in.)

VOLTAGEBREAKDOWN(VAC)VOLUMERESISTIVITY(Ω-m)

THERMALCONDUCTIVITY(W/m-K)

THERMAL
IMPEDANCEat 50 psi(°C-in.2/W)

FLAME
RATING(UL 94)BERGQUIST® SIL PAD® TSP 900(Formerly know as SIL PAD® 400)

The original fiberglass-reinforced, siliconebased insulator

Grey

0.007
0.009

3,500
4,500

1 X 1011

0.9

1.13

V-0

BERGQUIST® SIL PAD® TSP 1600S(Formerly know as SIL PAD® 900S)

Value fiberglass-reinforced,
silicone-based insulator

Pink

0.009

5,500

1 X 1010

1.6

0.61

V-0

BERGQUIST® SIL PAD® TSP 1100ST(Formerly know as SIL PAD® 1100ST)

Low-pressure, fiberglass-reinforced, siliconebased insulator

Yellow

0.012

5,000

1 X 1010

1.1

0.66

V-0

BERGQUIST® SIL PAD® TSP 1800
(Formerly know as SIL PAD® 1200)

High-performance,
fiberglass-reinforced,
silicone-based insulator

Black

0.009
0.012
0.016

6,000

1 X 109

1.8

0.53

V-0

BERGQUIST® SIL PAD® TSP 1800ST(Formerly know as SIL PAD® 1500ST)

Low-pressure, high-performance, siliconebased insulator

Blue

0.008

3,000

1 X 1011

1.8

0.23

V-0

BERGQUIST® SIL PAD® TSP 3500
(Formerly know as SIL PAD® 2000)

Fiberglass-reinforced, silicone-based insulator
with very high performance capabilities;
designed for defense and aerospace
applications

White

0.010
0.015
0.020

4,000

1 X 1011

3.5

0.33
0.37
0.55

V-0

BERGQUIST® SIL PAD® TSP K1300(Formerly know as SIL PAD® K-10)

High-performance, film-reinforced, siliconebased insulator

Beige

0.006

6,000

1 X 1012

1.3

0.41

VTM-0

PRODUCT

Electrically Insulating

10 | Thermal Management Materials

NON-ADHESIVES | THIN PADS
These materials are designed for those applications when maximum heat transfer is needed and electrical isolation is
not required, making SIL PAD® the ideal thermal interface material to replace messy thermal-grease compounds. Thinpads eliminate problems associated with grease, such as contamination of re-flow solder or cleaning operations. Unlike
grease, BERGQUIST® SIL PAD® TSP Q2500 can be used prior to these operations. BERGQUIST® SIL PAD® TSP Q2500 also
eliminates dust collection, which can cause possible surface shorting or heat buildup.

Thin Pads

Non-electrically Insulating

BERGQUIST®
SIL PAD® TSP Q2500

BERGQUIST®
SIL PAD® TSP Q2000

PRODUCTDESCRIPTIONCOLOR

THICKNESS(in.)

VOLTAGEBREAKDOWN(VAC)VOLUMERESISTIVITY(Ω-m)

THERMALCONDUCTIVITY(W/m-K)

THERMAL IMPEDANCE
at 50 psi(°C-in.2/W)

FLAME
RATING(UL 94)Non-electrically Insulating
BERGQUIST® SIL PAD® TSP Q2500(Formerly know as Q PAD II)

Aluminum-foil substrate,
silicone-based grease
replacement

Black

0.006

Non-insulating

1 X 102

2.5

0.22

V-0

BERGQUIST® SIL PAD® TSP Q2000(Formerly know as Q PAD 3)

Fiberglass-reinforced,
silicone-based grease
replacement

Black

0.005

Non-insulating

1 X 102

2.0

0.35

V-0

Thermal Management Materials | 11

NON-ADHESIVES | GAP PAD®
Henkel developed the GAP PAD® thermal interface material family to meet the electronic industry’s growing need forinterface materials with greater conformability, higher thermal performance, and easier application.
GAP PAD® provides an effective thermal interface between heat sinks and electronic devices where uneven surface
topography, air gaps and rough surface textures are present.

GAP PAD®
Pads
BERGQUIST® GAP PAD®
TGP 1000VOUS

BERGQUIST® GAP PAD®
TGP 1500R

BERGQUIST® GAP PAD®
TGP HC3000

BERGQUIST® GAP PAD®
TGP 1100SF

BERGQUIST® GAP PAD®
TGP 2200SF

BERGQUIST®GAP PAD®
TGP HC5000

BERGQUIST® GAP PAD®
TGP 1350

BERGQUIST® GAP PAD®
TGP 3004SF

BERGQUIST® GAP PAD®
TGP 1500

BERGQUIST® GAP PAD®
TGP 3500ULM

HARDNESS,VOLTAGEBULK RUBBER BREAKDOWN(Shore 00)(VAC)

VOLUMERESISTIVITY(Ω-m)

THERMALCONDUCTIVITY(W/m-K)1 X 1011

1.0

THERMAL
IMPEDANCE(% Strain)(°C-in.2/W)

FLAME
RATING(UL 94)DESCRIPTIONCOLOR

THICKNESS(in.)

BERGQUIST® GAP PAD® TGP 1000VOUS(Formerly know as GAP PAD® VOUS)

Fiberglass-reinforced,
silicone-based pad

Mauve/
Pink

0.020 to 0.250

BERGQUIST® GAP PAD® TGP 1100SF(Formerly know as GAP PAD® 1000SF)

Fiberglass-reinforced,
silicone-free polymer pad

Green0.010 to 0.125

40> 6,000

1 X 1010

0.9

—

V-1

BERGQUIST® GAP PAD® TGP 1350
(Formerly know as GAP PAD® 1450)

Silicone-based pad with apermanent liner

Light
Pink

0.020 to 0.125

30> 6,000

1 X 109

1.3

—

V-0

BERGQUIST GAP PAD TGP 1500
(Formerly know as GAP PAD® 1500)

Unreinforced,
silicone-based pad

Black0.020 to 0.200

40> 6,000

1 X 1011

1.5

BERGQUIST® GAP PAD® TGP 1500R(Formerly know as GAP PAD®1500R)

Fiberglass-reinforced,
silicone-based pad

Black0.010 to 0.020

45> 6,000

1 X 1011

1.5

BERGQUIST® GAP PAD® TGP 2200SF(Formerly know as GAP PAD® 2200SF)

Fiberglass-reinforced,
silicone-free polymer pad

Green0.010 to 0.125

70> 5,000

1 X 108

2.0

—

V-0

BERGQUIST GAP PAD TGP 3004SF(Formerly know as GAP PAD® 3004SF)

Slicone-free polymer padwith a permanent liner

Light
Grey

0.010 to 0.125

70> 5,000

1 X 1011

3.0

—

V-0

BERGQUIST® GAP PAD® TGP 3500ULM(Formerly know as GAP PAD® 3500ULM)

Ultra-low modulus,
fiberglass-reinforced,
silicone-based pad

Grey0.020 to 0.125—> 5,000

1 X 1010

3.5

BERGQUIST® GAP PAD® TGP HC3000(Formerly know as GAP PAD® HC3.0)

Fiberglass-reinforced,
silicone-based pad

Blue0.020 to 0.125

15> 5,000

1 X 1010

3.0

BERGQUIST® GAP PAD® TGP HC5000(Formerly know as GAP PAD® HC5.0)

Fiberglass-reinforced,
silicone-based pad

VioletPRODUCT

Pads

®

®

®

®

12 | Thermal Management Materials

0.020 to 0.125

5

35

6,000

> 5,000

1 X 1010

5.0

10%

20% 30%

1.97

1.87

V-0

1.68

10%

20% 30%

1.62

1.50

10%

20% 30%1.07

0.88 0.82

1.33

10%

20% 30%0.50

0.44 0.39

10%20% 30%0.57

0.49 0.44

10%20% 30%0.35

0.30 0.26

V-0
V-0

V-0

V-0

V-0

NON-ADHESIVES | GAP FILLERS
Henkel’s BERGQUIST® brand of highly-engineered, thermally-conductive liquids are specifically designed to support
optimized dispensing control with excellent thermal and mechanical performance. Dispensed in a liquid state, thematerial creates virtually zero stress on components. It can be used to interface and conform to the most intricate
topographies and multilevel surfaces.
Henkel has teamed with the highly respected automated dispensing equipment companies of Musashi Engineering,
RAMPF, Scheugenpflug AG, bdtronic, and Graco to further assist our customers in creating an optimized dispensing
process. Like Henkel, they are the best in the world at supplying intelligent world-class solutions. By joining in the“solutions partnership,” we amplify our capabilities as the total solution provider.

Gap Fillers
Liquids

BERGQUIST® GAP FILLER
TGF 1000SR

BERGQUIST® GAP FILLERTGF 3600

BERGQUIST® GAP FILLER
TGF 1500

BERGQUIST® GAP FILLERTGF 4000BERGQUIST® GAP FILLER
TGF 1500LVO

BERGQUIST® LIQUI-FORM
TLF LF3500

BERGQUIST® GAP FILLERTGF 3500LVO

DESCRIPTIONCURE TYPE

CURE
SCHEDULESVISCOSITY

THERMALCONDUCTIVITY(W/m-K)

VOLUMERESISTIVITY(Ω-m)

SHELF LIFE
(months)

BERGQUIST® GAP FILLER TGF 1000SR(Formerly know as GAP FILLER 1000SR)

Two-part, liquid gap-filling materialfeaturing outstanding slump
resistance

RT or Heat

20 hr. at 25°C
10 min. at 100°C

20 Pa-s, High Shear

1.0

1 X 1011

6

BERGQUIST® GAP FILLER TGF 1500
(Formerly know as GAP FILLER 1500)

Two-part, liquid gap-filling material
with high-shear thinning for easeof dispensing

RT or Heat

5 hr. at 25°C
10 min. at 100°C

250,000 cP, As Mixed

1.8

1 X 1010

6BERGQUIST® GAP FILLER TGF 1500LVO(Formerly know as GAP FILLER 1500LV)

Two-part, liquid gap-filling material
with significantly lower levels ofsilicone outgassing

RT or Heat

8 hr. at 25°C
10 min. at 100°C

75 Pa-s, High Shear

1.8

1 X 1010

6BERGQUIST® GAP FILLER TGF 3500LVO(Formerly know as GAP FILLER 3500LV)

High-performance, two-part,
liquid gap-filling material withsignificantly lower levels of silicone
outgassing

RT or Heat

24 hr. at 25°C
30 min. at 100°C

45 Pa-s, High Shear

3.5

1 X 1010

5BERGQUIST® GAP FILLER TGF 3600
(Formerly know as GAP FILLER 3500S35)

High-performance, two-part,
liquid gap-filling material withexceptional softness

RT or Heat

15 hr. at 25°C
30 min. at 100°C

150,000 cP, As Mixed

3.6

1 X 1095

BERGQUIST® GAP FILLER TGF 4000
(Formerly know as GAP FILLER 4000)

High-performance, two-part, liquid
gap-filling material

RT or Heat

24 hr. at 25°C
30 min. at 100°C

50 Pa-s, High Shear

4.0

1 X 1010

5BERGQUIST® LIQUI-FORM TLF LF3500(Formerly know as LIQUI-FORM 3500)

High-performance, one-part, cured
gel with thixotropic properties——

40 g/min.,Dispense Rate

3.5

1 X 1011

6

PRODUCT

Liquids

Thermal Management Materials | 13

NON-ADHESIVES | PHASE-CHANGE MATERIALS
Ideal for high-performance, solid-state devices such as CPUs, GPUs, IGBTs and discrete components, LOCTITE® and
BERGQUIST® brand phase-change materials deliver on-demand performance with none of the drawbacks of traditional
greases. These materials are solid at room temperature but melt and flow during device operation to provide a thinbondline and high reliability without the pump-out often experienced with some thermal greases. Phase-changematerials offer an excellent alternative to grease.

Phase-Change Materials

Pads

Liquids

BERGQUIST® HI-FLOW
THF 1600P

LOCTITE EIF 1000

LOCTITE TCP 4000 SERIESBERGQUIST® HI-FLOW
THF 3000UTLOCTITE TCF 1000

LOCTITE TCP 7000

BERGQUIST® HI-FLOW
THF 1500P

LOCTITE TCF 2000AF
LOCTITE TCF 4000PXF

DESCRIPTIONTHERMAL
IMPEDANCETHERMALCONDUCTIVITY(W/m-K)

BERGQUIST® HI-FLOW THF 1600P(Formerly know as HI-FLOW 300P)

Dry compound, coated on thermally-conductive
polyimide film

0.13°C-in2/W
at 25 psi

1.655

1 X 1012

5,000

0.00400.00450.0050BERGQUIST® HI-FLOW THF 3000UT(Formerly know as HI-FLOW 565UT)

Naturally tacky, unreinforced phase-change material
supplied in an easy-to-use tabulated pad

0.05°C-in2/W
at 25 psi

3.0

52

N/A

N/A

0.005
0.010

BERGQUIST® HI-FLOW THF 1500P(Formerly know as HI-FLOW 650P)

Phase-change material coated on thermally-conductive
polymide film with one side that is naturally tacky

0.20°C-in2/W
at 25 psi
(0.0045” thick)

1.5

52

1 X 1012

5,000

0.00450.00500.0055LOCTITE EIF 1000

Phase-change material coated onthermally-conductive polyimide film

0.12°C-in2/W
at 80 psi

0.45

60

N/A

4,500

KA: 0.003
KB: 0.005
K3: 0.007

LOCTITE TCF 1000

Phase-change material coated on aluminum foil

0.14°C-in2/W
at 80 psi

1.0

60

1 X 1012

N/A

AL: 0.005
ALH: 0.006

LOCTITE TCF 2000AF

High-performance phase-change material coated onaluminum foil

0.009°C-in2/W
at 80 psi

3.0

51

N/A

N/A

0.005

LOCTITE TCF 4000PXF

Non-silicone, reworkable phase-change material, freestanding film supplied between two release liners

0.019°C-in2/W
at 80 psi

3.4

45

N/A

N/A

0.008

Supplied as a paste that can be stenciled,needle-dispensed or screen-printed onto a heat sink,base plate or other surfaces

0.003°C-in2/W
at 80 psi

3.4

45

N/A

N/A

0.0005 to
0.010+

Non-silicone, reworkable phase-change material
supplied in cartridges

–

> 3.0

45

N/A

N/A

N/A

PRODUCTPHASE
VOLUMEDIELECTRIC
THICKNESSCHANGE TEMP RESISTIVITY BREAKDOWN
(in.)
(°C)
(Ω-m)
VOLTAGE

Pads

Liquids
LOCTITE TCP 4000 SERIESLOCTITE TCP 7000

14 | Thermal Management Materials

NON-ADHESIVES | GREASESFor manufacturers with a preference for traditional thermal greases, Henkel has several RoHS-compliant formulations.
Used in high-performance applications where minimal bondline thickness is essential for high-thermal performance,
greases offer immediate functionality upon application. In addition, greases have a tendency to compensate for voids
easily so they are a particularly viable solution for devices that have flatness or coplanarity issues. Available in cartridges
or bulk containers, Henkel’s thermal greases include high-performance,high-temperature reliability, silicone-free andwater-cleanable formulas.

GreaseLOCTITE TC 4

LOCTITE TC 8M

LOCTITE TCP 8175M1

LOCTITE TG 100

DESCRIPTIONTHERMALCONDUCTIVITY(W/m-K)

VOLUMERESISTIVITY(Ω-cm)

DIELECTRIC
STRENGTH(V/mil)

THICKNESS(in.)

LOCTITE TC 4

Thermally-conductive, high-temperature silicone thermal
grease0.6

1 X 1013500

0.0005 to 0.010+

LOCTITE TC 8M

High-thermal conductivity, high-temperature thermal grease

1.3

1 X 1014500

0.0005 to 0.010+

LOCTITE TCP 8175M1

High-thermal conductivity, high-temperature stability,
high-thixotropic (or non-sag), electrically-insulating, selfshimming silicone thermal grease

1.3

8.2 X 1012

480

0.007 (spacer)

Ultra-high-performance thermal grease

3.4

N/A

N/A

0.0005 to 0.010+

PRODUCT

Greases

LOCTITE TG 100

Thermal Management Materials | 15®
®

AMERICAS

ASIA-PACIFICEUROPEUNITED STATES
Henkel Corporation
14000 Jamboree Road
Irvine, CA 92606
United States
Tel: +1.888.943.6535
Fax: +1.714.368.2265

CHINA
Henkel Management Center
Building 7, No. 99 Jiang Wan Cheng Road
Shanghai 200438,
China
Tel: +86.21.2891.8000
Fax: +86.21.2891.8952

BELGIUM
Henkel Belgium N.V.
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B-2260 Westerlo
Belgium
Tel: +32.1457.5611
Fax: +32.1458.5530

Henkel Corporation
20021 Susana Road
Rancho Dominguez, CA 90221
United States
Tel: +1.310.764.4600
Fax: +1.310.605.2274

ABLESTIK (Shanghai) LIMITED
No. 332 Meigui South Road
WaiGaoQiao Free Trade Zone, Pu Dong
Shanghai 200131,
China
Tel: +86.21.2702.5888
Fax: +86.21.5048.4169

UNITED KINGDOM
Henkel Ltd.
Adhesives Limited Technologies House
Wood Lane End
Hemel Hempstead
Hertfordshire HP2 4RQ
United Kingdom
Tel: +44.1442.278000
Fax: +44.1442.278071

Henkel Corporation
18930 W. 78th Street
Chanhassen, MN 55317
United States
Tel: +1.952.835.2322
Tel: +1.800.347.4572
Fax: +1.952.835.0430
BRAZIL
Henkel Brazil
Av. Prof. Vernon Krieble, 9106690-070 Itapevi, Sao Paulo
BrazilTel: +55.11.3205.7001
Fax: +55.11.3205.7100

JAPAN
Henkel Japan Ltd.
27-7, Shin Isogo-cho
Isogo-ku Yokohama, 235-0017
Japan
Tel: +81.45.286.0161
Email: jp.ae-csdesk@henkel.com
KOREA
Henkel Korea Co Ltd.
18th Floor of tower B, BYC High City Bldg
Gasan Digital 1-ro, Geumcheon-gu,
Seoul, 08506
South Korea
Tel: +82.2.6150.3000
Fax: +82.2.6947.5203
SINGAPORE
Henkel Singapore Pte Ltd.
401, Commonwealth Drive#03-01/02 Haw Par Technocentre,
Singapore 149598
Tel: +65.6266.0100
Fax: +65.6472.8738 / +65.6266.1161
TAIWAN
Henkel Taiwan Ltd.
10F, No. 866, Zhongzheng Road,
Zhonghe District, New Taipei City, 23586
TaiwanTel: +866.2.22271988
Fax: +866.2.22268699

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© 2019 Henkel Corporation. All rights reserved. LT-4988 (07/19) US

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