Application Note

Assembly Precautions for
the Nichia NF2W757G-MT LEDs
Table of contents
1.
2.
3.
4.
5.
6.

LED Outline Dimensions/Tape and Reel Dimensions ・ ・ ・ ・ ・ ・ ・ 2-3
Handling Precautions ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 4-5
Design Recommendations for Optimal Amount of Solder ・ ・ ・ ・ ・ ・ 6
Precautions for Setting Up a Pick-and-Place Machine/Nozzle ・ ・ ・ 7-10
Precautions When Reflow Soldering ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 11
Verification of the Self-Alignment Capability and Tilting・ ・ ・ ・ 12-13

The part number NF2W757G-MT in this document are the part number of our product, and do not have any
relevance or similarity to other companies' products that may have trademark rights.
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia NF2W757G-MT LEDs

1. LED Outline Dimensions/Tape and Reel Dimensions
Table 1. NF2W757G-MT Product Specifications

光学的中心位置
Location of the optical center

テーピング部
Tape

0.75

4±0.1

Φ1.5 +0.1-00.25±0.05

2

4

3

(2.6)

Cathode Mark(0.02 クロスバー凹部)(0.02 Crossbar Recess)

1

8+0.3
-0.1

3

3.5 ±0.05

Cathode Mark2±0.053.2 ±0.13(2.6)

1.75±0.1

Tape and Reel Dimensions(Standard S-Reel)

LED Outline Dimensions

0.9 ±0.1

4±0.1

Φ1+0.2-0

3.2 ±0.1a(Cathode)b(Anode)* a>bとなる場合、aがカソード側です。
The side with the larger distance is the cathode.
Example: a>b, then a is the side that has the cathode.

リール部（標準 S-Reel)1
Reel (Standard S-Reel) 1
180+0
-3

Anode 23

2K

回路1(6500K)
Circuit 1(6500K)

0.89

4

1
K

A

回路2(2700K)
Circuit 2(2700K)

保護素子
Protection Device

Cathode 1
1.45

0.48

9±0.3

保護素子
Protection Device

2.27

0.5

A

Φ60 +1-0(2.6)

Cathode 2

ラベル
Label

11.4±1* 数量は1リールにつき 4000個入りです。
Reel Size: 4000pcs* 実装作業の中断などでエンボスキャリアテープをリールに 巻き取る場合、
エンボスキャリアテープを強く(10N以上)締めないで下さい。
LEDがカバーテープに貼り付く可能性があります。
When the tape is rewound due to work interruptions,no more than 10N should be applied tothe embossed carrier tape.
The LEDs may stick to the top cover tape.
* JIS C 0806電子部品テーピングに準拠しています。
The tape packing method complies with JIS C 0806
(Packaging of Electronic Components on Continuous Tapes).

Anode 1

Weight: typ. 0.019g(Unit : mm, Tolerance : ±0.2)(Unit : mm)

1 There is also an option to have a larger reel (L-Reel). See Table 2.

This document contains tentative information, Nichia may change the contents without notice.

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Table 2. NF2W757G-MT Taping Specifications (L-Reel)

3.5 ±0.05

2

±0.05

Cathode Mark(0.02 クロスバー凹部)(0.02 Crossbar Recess)0.25±0.05
3.2 ±0.1

4±0.1

Φ1.5 +0.1
-0

8+0.3
-0.1

テーピング部
Tape

1.75±0.1

Tape and Reel Dimensions(Larger Reel Option)

0.9 ±0.1

4±0.1

Φ1+0.2-0

3.2 ±0.1

リール部（オプション L-Reel)
Reel (Larger L-Reel option)
330±2*数量は1リールにつき 16000個入りです。
Reel Size: 16000pcs
9.5±1

When the tape is rewound due to work interruptions,no more than 10N should be applied tothe embossed carrier tape.
The LEDs may stick to the top cover tape.

Φ80 ±1

ラベル
Label*実装作業の中断などでエンボスキャリアテープをリールに巻き取る場合、
エンボスキャリアテープを強く(10N以上)締めないで下さい。
LEDがカバーテープに貼り付く可能性があります。

13.5 ±1*JIS C 0806電子部品テーピングに準拠しています。
The tape packing method complies with JIS C 0806
(Packaging of Electronic Components on Continuous Tapes).

(Unit : mm)
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia NF2W757G-MT LEDs

2. Handling Precautions
2.1 Handling with bare hands
Do not handle the LEDs with bare hands:- this may contaminate the LED surface and have an effect on the optical characteristics,- this may cause the LED to deform and/or the wire to break causing a catastrophic failure (i.e. the LED not toilluminate),- the lead frame may cause injuries when the LED is handled with bare hands.
2.2 Handling with tweezers
Ensure that when handling the LEDs with tweezers, excessive force is not applied to the LED. Otherwise, it may cause
damage to the resin (e.g. cut, scratch, chip, crack, delamination and deformation) and the wire to break causing acatastrophic failure (i.e. the LED not to illuminate).
2.3 ESD Precautions
The LEDs are sensitive to transient excessive voltages (e.g. ESD, lightning surge). If this excessive voltage occurs in thecircuit, it may cause the LED to be damaged causing issues (e.g. the LED to become dimmer or not to illuminate [i.e.
catastrophic failure]). When handling the LEDs, ensure that necessary measures have been taken to protect them fromtransient excess voltages. Refer to the applicable specification for more details.
2.4 Stacking assembled PCBs together
Do not stack assembled PCBs together. Otherwise, it may cause damage to the resin (e.g. cut, scratch, chip, crack,delamination and deformation) and the wire to break causing a catastrophic failure (i.e. the LED not to illuminate).
2.5 Baking
The storage/packaging requirements for the NF2W757G-MT LEDs are comparable to JEDEC Moisture Sensitivity Level(MSL) 3 or equivalent. Nichia used IPC/JEDEC STD-020 as a reference to rate the MSL of this LED. If the “After Opening”
storage time has been exceeded or any pink silica gel beads are found, ensure that the LED are baked before use.
Baking should only be done once.

Table 3. Storage/Baking Conditions
Conditions
Storage

Before Opening Aluminum Bag
After Opening Aluminum Bag

Baking (Reel is Removed from Aluminum Bag)

Temperature

Humidity

Time

≤30°C

≤90%RHWithin 1 Year from Delivery Date

≤30°C

≤70%RH≤168 hours

65±5°C-≥24 hours

Correct

Suggestion: Grab/holdthe LEDs with tweezers by
the sides of the substrate.

Incorrect

Incorrect

Caution: Do not let thetweezers touch theencapsulating resin.

Figure 1. Examples ofproper/improper handlingwith tweezers

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2.6 Handling the larger-sized 757 reels (L-Reel)
When handling the larger-sized 757 reels ensure that excessive force is not applied to the outer edge of the reel where the embossed carrier tape is
exposed. Holding the reel with only one hand may cause the embossed carrier tape to unwind. Additionally, holding it with only one hand may cause theembossed carrier tape to collapse.

Correct

Incorrect

Do not hold the reel where the tape isHold the outer edge of the reel where theEmbossed carrier tape is collapsed.
exposed.
tape is not exposed.
Figure 2. Examples of proper/improper handling of the L-Reel
2.7 Handling the aluminum moisture-proof bags for the larger-sized 757 reels (L-Reel)
When handling the aluminum moisture-proof bag, do not hold the part of the bag where the larger-sized reel is located. If the reel is held even when it isinside the aluminum moisture-proof bag, it may cause the embossed carrier tape to unwind.

Correct

Incorrect

Do not hold thepart of the bagthat contains thereel.

Hold the bag at
the heated seal
Figure 3. Examples of proper/improper handling of the aluminum moisture-proof bags for the L-Reel

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia NF2W757G-MT LEDs

3. Design Recommendations for Optimal Amount of Solder

LED Outline and Electrodes
Soldering Pad Pattern
Solder Stencil Aperture

Soldering Pad Pattern/Metal Solder Stencil Aperture

Table 4. Recommended Soldering Pad Pattern/Metal Solder Stencil Aperture
Recommended Soldering Pad Pattern9

Anode 6500K

0.85

2.3

0.85

0.7

0.4

2
2.3
3.15

2.3
3.15

Cathode 6500K

Recommended Metal Solder Stencil Aperture

Cathode 2700K

0.6

Anode 2700K

1.53
0.69

0.6

0.6
0.58

1.45

0.95

0.6
0.4

(unit : mm)(unit : mm)Table 5. Recommended Solder/Metal Solder Stencil Conditions
Item

Recommended Conditions

Stencil Thickness

100μm

Solder Paste

Sn-3.0Ag-0.5Cu

The soldering pattern shapes, metal solder stencil apertureshapes, and metal stencil thicknesses shown in Tables 4 and 5
were selected based on Nichia’s recommended placement
conditions.
Customers should ensure that there are no issues with thechosen placement conditions before use.

This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia NF2W757G-MT LEDs

4. Precautions for Setting Up a Pick-and-Place Machine/Nozzle
Table 6. Cautions/Suggestions for Setting Up Equipment
Item

Recommended Conditions/Specifications

Cautions/Suggestions

Pick-and-Place machine

Modular mounter

See the note below this table.

Pick-and-Place Nozzle

Specially designed nozzle(see Figure 4)

See “Pick-and-Place Nozzle” on Page 8 for the details.

Tape-and-reel feeder

Electrical (motorized) feeder
Tape width: 8mm
Feed length: 4mm

Nozzle height for pick-up
operations

The contact surface of the nozzle head for pick
operations should be adjusted to the top surface of theembossed carrier tape pocket.

See “Recommended Nozzle Height for Pick-up
Operations” on Page 9 for the details.

Nozzle height forplacement operations (i.e.
placement depth)

0.2mm for placement depth

See “Recommended Nozzle Height for Placement
Operations (Placement Depth)” on Page 10 for thedetails.

Imaging-based Automatic
Inspection

Using the electrode as a reference is recommended tolocate the center of the LED.

See “Imaging-based Automatic Inspection” on Page 10
for the details.

See “Tape-and-Reel Feeder” on Page 9 for the details.

Note:
-

The recommended conditions/specifications above have been determined under the following verification conditions:
Pick-and-Place machine (modular mounter):- YS100 High-Speed General-Purpose Modular (manufactured by Yamaha Motor Co., Ltd.)This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia NF2W757G-MT LEDs
4.1 Pick-and-Place Nozzle

3.1

(φ1)

Correct

Ideal size (Outer dimension 3.1x3.1) and position for the pick-up nozzle
Φ2.7

Incorrect

(0.5)
3.1
(unit: mm)

Figure 4. Recommended Nozzle Dimensions

Ensure sure that the nozzle suction area islarger than the encapsulating resin areaof the LED (2.6mm x 2.6mm) to avoid possible
damage to the emission area resulting in the LED not
illuminating.

Example A: (Outer dimension φ2.5) = Not Recommended

Incorrect

See Figure 5 for examples of how the nozzle positionand size effects the pick-up of the LED.

Example B: (Outer dimension 1.7x1.2) = Not Recommended(unit : mm)

Figure 5. Examples of the pick-up by different nozzles
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Assembly Precautions for the Nichia NF2W757G-MT LEDs
4.2 Tape-and-Reel Feeder
Pick-and-Place nozzle
Top Cover Tape
Removal Position

Correct

Top Cover Tape

Feed Direction of the Carrier Tape

1. Recommended setting for the tape-and-reel feeder.
Tape width: 8mm
Feed length: 4mm
2. Use a tape-and-reel feeder that ensures it does not create excessive
vibrations causing assembly issues.
Example: Electrical (motorized) feeder
3. When removing the top cover tape, it should be done past three
LEDs away from the target LED (See Figure 6). Otherwise, it may
shake the embossed carrier tape and cause the LED to move within
the tape pocket. This may cause- the nozzle to fail to pick up the LED or not to pick it up properly
and shift while on the nozzle during the transport to the PCB (i.e.
pick-up/placement failure)

Pick-and-Place nozzle
Top Cover Tape
Removal Position
Top Cover Tape

Incorrect
Feed Direction of the Carrier Tape

- the LED to hit the feeder cover and become damaged.

Figure 6. Examples of Correct/Incorrect Top Cover Tape Removal Positions

1. Ensure that the nozzle only goes down to the top edge of the tapepocket and does not directly come into contact with the LED.

4.3 Recommended Nozzle Height for Pick-up Operations

Note: The reference level for the nozzle setting is at the top edge ofthe tape pocket.
2. The recommended nozzle height for pick-up operations has been
determined by Nichia under the verification conditions (See Table 6)
and may not function as expected with some other pick-and-placemachines. If the pick-up operations are unstable even with using therecommended nozzle height, adjust the nozzle height appropriate forthe pick-and-place machine being used.

NozzleNozzle position
Embossed carrier tape

If the pick point of the nozzle is too high,- it may cause insufficient suction power leading to picking
errors (e.g. the nozzle’s failure to pick/lift the LED into the air,incorrect picking causing the LED to tilt when in the air).

Figure 7. Cross-sectional view of a nozzle when transporting an NF2W757G-MT
LED to a PCB

If the pick point of the nozzle is too low,
- it may cause issues (e.g. causing the embossed carrier tape toshake, causing the tape pocket to deform) leading to picking
failure and/or damage to the LED.

This document contains tentative information, Nichia may change the contents without notice.

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4.4 Recommended Nozzle Height for Placement Operations (Placement Depth)
1. After the LED is mounted onto solder paste on the PCB, thenozzle should further press the LED 0.2mm into the PCB.
NozzleLED

If the release point of the nozzle is too high,- it may cause placement issues (e.g. the LED to stick to
the nozzle after placement, the LED to become soldered
to the PCB in a tilted position, etc.).
Press
0.2mm

If the release point of the nozzle is too low,
- excessive forces may be applied to the LED during
placement and it may cause the LED to become
damaged.

Board
Figure 8. Recommended Nozzle Height for Placement (Placement Depth)

1. Nichia recommends using the electrodes as a reference tolocate the center of the LED.
2. If the imaging device has trouble detecting/recognizing theelectrodes due to the uniqueness of the electrode pattern,
adjust it to detect/recognize the outer portions of theelectrodes (i.e. the areas circled in red in Figure 9 to the left).

4.5 Imaging-based Automatic Inspection

Polarity Detection/
Recognition Point

Electrode Location
Detection/
Recognition Points

3. If an automatic polarity detector is used for the LEDs, set up
the imaging device to detect the empty space between theanode and cathode electrodes (i.e. Polarity
Detection/Recognition Point in Figure 9 to the left). In theexample in Figure 9, the equipment measures the brightnessof the empty space against the threshold to locate theelectrodes and/or determine the polarity.

Figure 9. Recommended reference points to detect, recognize, or locate the polarity/electrodes
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Assembly Precautions for the Nichia NF2W757G-MT LEDs

5. Precautions When Reflow Soldering

1. Reflow soldering must not be performed more than twice.
2. Using the recommended reflow soldering conditions (See Figure 10 tothe left) as a reference, modify if necessary, the recommended reflow
conditions specified by the manufacturer of the solder paste being used.
Note: To ensure that these reflow conditions have no negative effect on
the LEDs, perform sufficient verification prior to use.
3. When cooling the LEDs from the peak temperature a gradual coolingslope is recommended; do not cool the LEDs rapidly.
4. During reflow soldering, the heat and atmosphere in the reflow ovenmay cause the optical characteristics to degrade. In particular, reflow
soldering performed with an air atmosphere may have a greater
negative effect on the optical characteristics than if a nitrogen
atmosphere is used; Nichia recommends using a nitrogen reflow
atmosphere.

Figure 10. Recommended Reflow Soldering Condition (Lead-free Solder)This document contains tentative information, Nichia may change the contents without notice.

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6. Verification of the Self-Alignment Capability and Tiltingyθ

6.1 Self-Alignment Capability Method/Conditions
Nichia has verified the self-alignment capability of the LEDs using solder stencil apertures
shown on page 6. Evaluation LEDs were placed on specified points or intentionally rotated tocreate a parallel/angular misalignment from the center of the soldering pad pattern (see Figure
11 to the right). After reflow soldering, LED positions and angles were measured for eachstencil aperture to determine the amount of misalignment.
Board: FR4
Board thickness: 1.6mm
Copper Thickness: 35μm
Metal Solder Stencil Thickness: 100μm
Parallel Deviation Condition: ∆x,y = x=-0.2mm/y=+0.2mm,x=+0.2mm/y=-0.2mm
Angular Deviation Condition: ∆θ = 5°,10°, 30°
Sample Size: 15 LEDs per condition (i.e. stencil aperture)

Ⅹ

Figure 11. LED misalignment Conditions

6.2 Self-Alignment Capability Conclusions
LED Parallel Misalignment- If the misalignment is within 0.2mm in both the x and y coordinates, it will not have aneffect on the self-alignment capability.
LED Angular Misalignment- Since all the rotated LEDs moved back to the correction position (i.e. the center of thesoldering pad pattern) by themselves during reflow soldering, there are no issues with theself-alignment capability against the evaluated angular deviation.

For more details, refer to Table 7 on the next page.

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Table 7. Misalignment Evaluation Results
Δx : -0.2mm
Δy : +0.2mm

Δx : 0mm
Δy : 0mm

Δx : +0.2mm
Δy : -0.2mm

Δθ=5°Δθ=10°

Δθ=30°

LED Parallel/Angular
Misalignment

No issue

No issue

No issue

No issue

No issue

No issue

Emission
Inspection

LED emitted

LED emitted

LED emitted

LED emitted

LED emitted

LED emitted

LED
Misalignment
Conditions

After
Reflow
Soldering

X-Ray
Image

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Disclaimer
This application note is a controlled document of Nichia Corporation (Nichia) published to provide technical information/data forreference purposes only. By using this application note, the user agrees to the following:• This application note has been prepared solely for reference on the subject matters incorporated within it and Nichia makes noguarantee that customers will see the same results for their chosen application.
• The information/data contained herein are only typical examples of performances and/or applications for the product. Nichia
does not provide any guarantees or grant any license under or immunity from any intellectual property rights or other rights
held by Nichia or third parties.
• Nichia makes no representation or warranty, express or implied, as to the accuracy, completeness or usefulness of any
information contained herein. In addition, Nichia shall not be liable for any damages or losses arising out of exploiting, using,or downloading or otherwise this document, or any other acts associated with this document.
• The content of this application note may be changed without any prior or subsequent notice.
• Copyrights and all other rights regarding the content of this document are reserved by Nichia or the right holders who havepermitted Nichia to use the content. Without prior written consent of Nichia, republication, reproduction, and/or redistributionof the content of this document in any form or by any means, whether in whole or in part, including modifications or derivative
works hereof, is strictly prohibited.

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TOKUSHIMA 774-8601, JAPAN
Phone: +81-884-22-2311 Fax: +81-884-21-0148

NICHIA CORPORATION
http://www.nichia.co.jp

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