Application Note

Assembly Precautions
for the Nichia 385 Series LEDs

Table of contents
1.

LED Outline Dimensions/Tape and Reel Dimensions ・ ・ ・ ・ ・ ・ ・ ・ 2

2.

Handling Precautions ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 3

3.

Design Recommendations for Optimal Amount of Solder

4.

Precautions for Setting Up a Pick-and-Place Machine/Nozzle

5.

Precautions When Reflow Soldering

6.

Verification of the Self-Alignment Capability and Tilting・ ・ ・ ・ ・ 4・ ・ ・ 5-8

・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 8
・ ・ ・ ・ ・ ・ 9

The part number NF2W385AR-V2, NF2W385AR-V3 in this document are the part number of our product, and do nothave any relevance or similarity to other companies' products that may have trademark rights.
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 385 Series LEDs

1. LED Outline Dimensions/Tape and Reel Dimensions
Table 1. NF2W385AR-V2, NF2W385AR-V3 Product Specifications

LED Outline Dimensions

Tape and Reel Dimensions

光学的中心位置
Location of the optical center

3.6

3.5

Cathode Mark-0
Φ1.5 +0.2

0.3 ±0.05

3.8 ±0.1

5.92±0.05 4±0.1

2.58±0.1

4.2 ±0.1

Φ1.5 +0.1-01.75±0.1

テーピング部 Tape

5.5 ±0.05

1

12 +0.3-0.1

4

2.3 ±0.1

3.5
1.75
5.1

リール部 Reel

2.05

0.25

3.2

330±2

13.5±1KA

Φ80 ±11.13

17.5±1

3.3

2.125

保護素子
Protection Device

ダイヒートシンク
Die Heat Sink

Weight：typ. 0.038g
Cathodeダイヒートシンク
Die Heat Sink

Anode

(Unit : mm, Tolerance : ±0.2mm)

Reel Size: 3,500 LEDs
ラベル
Label(Unit : mm)

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Assembly Precautions for the Nichia 385 Series LEDs

2. Handling Precautions

Correct

2.1 Handling with bare hands
Do not handle the LEDs with bare hands:- this may contaminate the LED surface and have an effect on the optical characteristics,- this may cause the LED to deform and/or the wire to break causing a catastrophic failure (i.e. the LED not toilluminate),- the lead frame may cause injuries when the LED is handled with bare hands.

2.2 Handling with tweezers
Ensure that when handling the LEDs with tweezers, excessive force is not applied to the LED. Otherwise, it may cause
damage to the resin (e.g. cut, scratch, chip, crack, delamination and deformation) and the wire to break causing acatastrophic failure (i.e. the LED not to illuminate).

2.3 ESD Precautions

Suggestion: Grab/holdthe LEDs with tweezers by
the sides of the substrate.

Incorrect

The LEDs are sensitive to transient excessive voltages (e.g. ESD, lightning surge). If this excessive voltage occurs in thecircuit, it may cause the LED to be damaged causing issues (e.g. the LED to become dimmer or not to illuminate [i.e.
catastrophic failure]). When handling the LEDs, ensure that necessary measures have been taken to protect them fromtransient excess voltages. Refer to the applicable specification for more details.

2.4 Stacking assembled PCBs together
Do not stack assembled PCBs together. Otherwise, it may cause damage to the resin (e.g. cut, scratch, chip, crack,delamination and deformation) and the wire to break causing a catastrophic failure (i.e. the LED not to illuminate).

Incorrect

2.5 Baking
The storage/packaging requirements for the Nichia NF2W385AR-V2 LEDs are comparable to JEDEC MoistureSensitivity Level (MSL) 3 or equivalent. Nichia used IPC/JEDEC STD-020 as a reference to rate the MSL of this LED. If the“After Opening” storage time has been exceeded or any pink silica gel beads are found, ensure that the LED are baked
before use. Baking should only be done once.
Table 2. Storage/Baking Conditions
Conditions
StorageTemperature

Humidity

Before Opening Aluminum Bag≤ 30°C≤ 90%RH

Within 1 Year from Delivery Date

After Opening Aluminum Bag≤ 30°C≤ 70%RH≤ 168 hours

65±5°C-≥ 24 hours

Baking (Reel is Removed from Aluminum Bag)Time

Caution: Do not let thetweezers touch the lens(Silicone Resin).

Figure 1. Examples ofproper/improper handlingwith tweezers

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Assembly Precautions for the Nichia 385 Series LEDs

3. Design Recommendations for Optimal Amount of Solder
Soldering Pad Pattern/Metal Solder Stencil Aperture

Correct― LED Outline and Electrodes▨ Copper Layer□ Soldering Pad Pattern

LED Outline and Electrodes
Soldering Pad Pattern
Solder Stencil Aperture

Table 3. Recommended Soldering Pad Pattern/Metal Solder Stencil Aperture
Recommended
Soldering Pad Pattern

Recommended
Metal Solder Stencil Aperture

4.8
3.2
1.3

C0.2

4.7
3.48
0.9

CathodeDie Heat Sink

Nichia recommends ensuring that the die heat sink area and cathodeelectrode area are connected using a pattern that improves the heatdissipation.
● Connect to anode terminal

Die Heat Sink

● Connect to cathode terminal

1.6
3.5

2.3
3.6

Incorrect

CathodeAnodeAnode

(Unit : mm)(Unit : mm)Table 4. Recommended Solder/Metal Solder Stencil Conditions

CathodeItem

Recommended Conditions

Stencil Thickness

150μm

Solder Paste

Sn-3.0Ag-0.5Cu

The soldering pattern shapes, metal solder stencil aperture shapes, and metal stencil thicknesses shown in Tables
3 and 4 were selected based on Nichia’s recommended placement conditions.
Customers should ensure that there are no issues with the chosen placement conditions before use.

Die Heat Sink

Anode

On the back of the LED, there is a circular conductive area that isconnected to the electrode terminal. On the anode electrode side,
the circular conductive parts of different poles are in close
proximity to each other, extra caution must be taken when
designing the board. To prevent the possibility of a short-circuit, do
not put a copper foil wiring section directly below the circular
conductive section on the anode electrode side.

Figure 2. Precautions for board design

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Assembly Precautions for the Nichia 385 Series LEDs

4. Precautions for Setting Up a Pick-and-Place Machine/Nozzle
Table 5. Cautions/Suggestions for Setting Up Equipment
Item

Recommended Conditions/Specifications

Cautions/Suggestions

Pick-and-Place machine

Modular mounter

See the note below this table.

Pick-and-Place Nozzle

Specially designed nozzle(see Figure 3)

See “Pick-and-Place Nozzle” on Page 6 for the details.

Tape-and-reel feeder

Electrical (motorized) feeder
Tape width: 12mmFeed length: 8mmNozzle height for pick-up
operations

The contact surface of the nozzle head for pick
operations should be adjusted to 1.7mm below the edgeof the embossed carrier tape pocket.

See “Recommended Nozzle Height for Pick-up
Operations” on Page 7 for the details.

Nozzle height forplacement operations(i.e. placement depth)

0.2mm for placement depth

See “Recommended Nozzle Height for Placement
Operations (Placement Depth)” on Page 7 for thedetails.

Imaging-based Automatic
Inspection

Using the electrode as a reference is recommended tolocate the center of the LED.

See "Imaging-based Automatic Inspection" on Page 8for the details.

See “Tape-and-Reel Feeder” on Page 6 for the details.

Note:-The recommended conditions/specifications above have been determined under the following verification conditions:
Pick-and-Place machine (modular mounter):- YS100 High-Speed General-Purpose Modular (manufactured by Yamaha Motor Co., Ltd.)This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 385 Series LEDs
4.1 Pick-and-Place Nozzle

2R0 .15

1. As shown in Figure 4, the nozzle tip should only touch
the flat corners of the LED’s top surface to hold theLEDs. Ensure that it does not come in contact with thelens. The LEDs uses a silicone resin for the lens andinternal pre-coating resin; the silicone resin is soft. IfNozzlepressure is applied to the lens, it may cause the lens to
be damaged, chipped and/or delaminated. If the lens isdamaged, chipped, delaminated and/or deformed, itLED
may cause the wire to break causing a catastrophic
failure (i.e. the LED not to illuminate) and/or reliability
0.6mm issues (e.g. the LED to corrode and/or to become
dimmer, the color/directivity to change, etc.) Ensurethat no amount of pressure is applied to the lens.

Φ3 .84 .4

2. Part height for the nozzle to pick up the LEDs: 0.6mm(Unit : mm)

Figure 3. Recommended Nozzle Dimensions

Figure 4. Cross-sectional view of a nozzle
when transporting a LED to a PCB

Top Cover Tape
Removal Position

4.2 Tape-and-Reel Feeder

1. Recommended setting for the tape-and-reel feeder.
Tape width: 12mmFeed length: 8mm✔
OK Top Cover Tape

Removal Position

Feed Speed：Slow

Vibration：SmallNG
Feed Speed：Fast

Vibration：Large

LED pick up
position

LED pick up
position

2. Use a tape-and-reel feeder that ensures it does notcreate excessive vibrations causing assembly issues.
Example: Electrical (motorized) feeder
3. When removing the top cover tape it should be done
adjacent to the target LED (See Figure 5). Otherwise, it
may shake the embossed carrier tape and cause the LED
to move within the tape pocket. This may cause- the nozzle to fail to pick up the LED or not to pick it
up properly and shift while on the nozzle during thetransport to the PCB (i.e. pick-up/placement failure)- the LED to hit the feeder cover and become damaged.

Figure 5. Examples of Correct/Incorrect Top Cover Tape Removal Positions
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Assembly Precautions for the Nichia 385 Series LEDs
4.3 Recommended Nozzle Height for Pick-up Operations

1. Ensure that the nozzle goes down onto the LED in the tape pocket until
the tip touches the flat surface around the lens.

NozzlePick-up depth: 1.7mm
Note: If the reference level for the nozzle setting is at the edge of thetape pocket.

1.7mm below the edgeof the tape pocket(i.e. Pick-up depth)

2. The recommended nozzle height for pick-up operations has been
determined by Nichia under the verification conditions (See Table5) and may not function as expected with some other pick-andplace machines. If the pick-up operations are unstable even withusing the recommended nozzle height, adjust the nozzle heightappropriate for the pick-and-place machine being used.

LEDIf the pick point of the nozzle is too high,- it may cause insufficient suction power leading to picking
errors (e.g. the nozzle’s failure to pick/lift the LED into theair, incorrect picking causing the LED to tilt when in the air).

Embossed carrier tapeFigure 6. Cross-sectional view of a nozzle when transporting a LED to a PCB

If the pick point of the nozzle is too low,
- it may cause issues (e.g. causing the embossed carrier tape
to shake, causing the tape pocket to deform) leading topicking failure and/or damage to the LED.

4.4 Recommended Nozzle Height for Placement

Operations (Placement Depth)

1. After the LED is placed onto the solder paste on the PCB, the nozzle
should further press the LED 0.2mm into the PCB.

NozzleIf the release point of the nozzle is too high,- it may cause placement issues (e.g. the LED to stick to the nozzle
after placement, the LED to become soldered to the PCB in atilted position, etc.).

LED

If the release point of the nozzle is too low,- excessive forces may be applied to the LED during placement andit may cause the LED to become damaged.

Press0.2mm

Board
Figure 7. Recommended Nozzle Height for Placement (Placement Depth)
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Assembly Precautions for the Nichia 385 Series LEDs
4.6 Imaging-based Automatic Inspection
1. Nichia recommends using the electrodes as a reference to locate the centerof the LED.

Figure 8. Recommended reference points to detect, recognize, or locate the electrodes

5. Precautions When Reflow Soldering

1. Reflow soldering must not be performed more than twice.
2. Using the recommended reflow soldering conditions (See Figure 8 to the left) asa reference, modify if necessary, the recommended reflow conditions specified
by the manufacturer of the solder paste being used.
Note: To ensure that these reflow conditions have no negative effect on theLEDs, perform sufficient verification prior to use.
3. When cooling the LEDs from the peak temperature a gradual cooling slope isrecommended; do not cool the LEDs rapidly.
4. During reflow soldering, the heat and atmosphere in the reflow oven may cause
the optical characteristics to degrade. In particular, reflow soldering performed
with an air atmosphere may have a greater negative effect on the opticalcharacteristics than if a nitrogen atmosphere is used; Nichia recommends using anitrogen reflow atmosphere.

Figure 9. Recommended Reflow Soldering Condition(Lead-free Solder)

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Assembly Precautions for the Nichia 385 Series LEDsy6. Verification of the Self-Alignment Capability and TiltingθSelf-alignment was confirmed using the soldering pad pattern and metal solder stencil
aperture shape shown in Table 3 in Section 2.
x

6.1 Test Materials

Substrate: CEM3 on one side; copper foil thickness: 35µm; board thickness: 0.9mm
Stencil thickness: 120µm, 150µm, 200µm
Number of LEDs tested per condition: 10CathodeAnode6.2 Evaluation Results

The LED placement position was intentionally shifted before reflow and the position was checked afterreflow; the self-alignment was confirmed as good for all conditions.

Figure 10. LED misalignment Conditions

Table 6. Misalignment Evaluation Results
x direction+0.2mmx direction-0.2mmy direction+0.2mmy direction-0.2mmθ direction 30°

θ direction 45°

Position before reflow

120μm

Appearance
after
reflow

Stencilthickness

150μm

200μm
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Assembly Precautions for the Nichia 385 Series LEDs

Disclaimer
This application note is a controlled document of Nichia Corporation (Nichia) published to provide technical information/data forreference purposes only. By using this application note, the user agrees to the following:• This application note has been prepared solely for reference on the subject matters incorporated within it and Nichia makes noguarantee that customers will see the same results for their chosen application.
• The information/data contained herein are only typical examples of performances and/or applications for the product. Nichia
does not provide any guarantees or grant any license under or immunity from any intellectual property rights or other rights
held by Nichia or third parties.
• Nichia makes no representation or warranty, express or implied, as to the accuracy, completeness or usefulness of any
information contained herein. In addition, Nichia shall not be liable for any damages or losses arising out of exploiting, using,or downloading or otherwise this document, or any other acts associated with this document.
• The content of this application note may be changed without any prior or subsequent notice.
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works hereof, is strictly prohibited.

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Phone: +81-884-22-2311 Fax: +81-884-21-0148

NICHIA CORPORATION
http://www.nichia.co.jp

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