Tuesday, June 19th
PLENARY

Wednesday, June 20th \\\\\ MORNING
8:30 a.m. WELCOME COFFEE

Microelectronics and microsystems
components and technologies
9:30 a.m. WELCOME - REGISTRATION

Chairman: Simon Deleonibus

10:00 a.m. Leti’s Vision: Dr L.Malier, CEA-Leti
10:30 a.m. Large-Scale Integrated Photonics for High-Performance

Interconnects: Moore’s Law for Photonics in HighPerformance Data Centers: R.Beausoleil, HP Labs
Advisor

11:30 a.m. Semicon for Healthcare: S.Picaud, Institut de la vision
12:00 a.m. Semicon for Automotive: D.Griot, DNG Conseil12:30 a.m. LUNCH

Modelling the Application LandscapeThrough Technology

A
AUDITORIUM

8:30 a.m. WELCOME COFFEEGRAND SALON

Chairman: Ahmed Jerraya

9:00 a.m. Welcome: Dr S.Deleonibus, CEA-Leti

B

Advanced IC Design for Green IT

The semiconductor business is assimilating
Emerging Technologies to face the various scaling
challenges or strengthen new applications areas.
Sufficient maturity is gained by Nanoelectronics
to introduce new architectures featuring
neuromimetism, reconfigurability at a high levelwith low power consumption or highly integrated
sensing. This happens in the frame of a strong
demand for energy and its management, such as
in automotive or transportation, illustrated here.

Filling the Gap
from Design to Application

11:00 a.m. Semicon for Power Devices: B. Murari, STM Scientific

8:30 a.m. WELCOME COFFEE

Chairman: Alain Merle

The main driver for semiconductor has moved
from only Cost/performance tradeoff, to energy
efficiency and extreme miniaturization due toportability and long battery lifetime requirements ofmobile computing. To reach the required objectives
circuit design solutions need to be aligned with bothfabrication technologies and applications.
This session introduces key technologies formastering future generations of system on chips(SoC) that require energy efficient computing, RFand imagers.

ROOM 222-224

Cybersecurity is a key challenge for the today andfuture connected world. It is assumed that secure
hardware components offer a real improvement for
securing more complex systems, from user identification and authentication (e-banking, e-identity), up
to computers or mobile devices (Trusted computing).
However, even secure components are subject to attacks and security should be continuously improved.
This session intends to highlight the key actors
needs and to place the CEA- Leti’s research works
in this perspective.

Cyber security of the armed forces, new threats & newtechnical issues: G.Poupard, DGA
9:40 a.m. Cyber Security, Emerging Threats, Efficient
Solutions & Research Challenges: L.Duflot, ANSSI

9:10 a.m. Green Computing: John Goodcare, ARM

No-Standby-Power Nonvolatile Logic with STTMRAM Technology: Dr. T.Endoh, Univ Tohoku
9:40 a.m. Advanced Embedded Memories: B.De Salvo, CEA-Leti
10:10 a.m. NEMS from Components Research to Applications:
P.Puget, APIXC

9:00 a.m. Welcome: A.Merle, CEA-Leti

9:00 a.m. Welcome: Dr A.Jerraya, CEA-Leti

9:10 a.m. Restructuring of Memory Hierarchy in System andCyber Security

9:10 a.m.

9:40 a.m. Evolution of short range communication, NFC andothers: B.Charrat, Inside Secure

10:10 a.m. 3D Integration for Energy Efficient Computing:

10:10 a.m. Cyber Defence: J-P.Quémard, Cassidian

D.Dutoit, CEA-Leti

10:40 a.m. BREAK 30’

10:40 a.m. BREAK 30’

10:40 a.m. BREAK 30’

11:10 a.m. Power Electronic Components for Future

11:10 a.m. Green RF Design: E.Mercier, CEA-Leti

11:10 a.m. Attacks on Secure Devices: J.Cledière, CEA-Leti

11:40 a.m. Going Green With Image Sensors: A.Dupret, CEA-Leti

11:40 a.m. What’s new in secure device protections?: A.Tria,

12:10 a.m. LUNCH

12:10 a.m. LUNCH

Automotives and Mobility: F.Kawai, Toyota Motors

2:00 p.m. Energy Management systems: S.Dauvé, CEA-Leti

11:40 a.m. GaN/Si power electronics : From devices to modules:

2:20 p.m. Internet of Things: L.Hérault, CEA-Leti

12:10 a.m. LUNCH

CEA-Leti

J-J. Aubert, CEA-Leti

2:40 p.m. Optimizing the Brain Computer Interface: Dr D.Lobel,

Clinatec

3:00 p.m. Human Machine Interfaces and their Evolutions:

S.Cina, CEA-Leti

3:20 p.m. BREAK 30’

Venturing the future with success stories

Wednesday, June 20th \\\\\ AFTERNOON
Biomedical

Chairman: Patrick Boisseau

CEA-Leti
4:20 p.m. APIX: J-P.Braun

4:40 p.m. BeSpoon: J-M.André
5:00
3:20 p.m. Multix: P.Radisson
5:20 p.m. Fluoptics: O. Allard & Ph.Rizo

Since 1992, Soitec built its reputation in generating revolutionary
semiconductor materials and strove for leadership in performanceand energy efficiency innovation. Soitec technologies are at theheart of today’s most critical challenges of energy savings andgreen energy production that will launch sustainable markets.
5:50 p.m. A-J. Auberton-Hervé, Soitec
6:20 p.m.

END

8:15 p.m.

GALA DINNER

Restaurant Le Téléphérique, Fort de la Bastille

AUDITORIUM

Photonics

2:00 p.m. Welcome: Dr P.Boisseau, CEA-Leti
2:10 p.m. From Therapeutic Molecules to Therapeutic Solutions:P.Ferrara, Sanofi-Aventis
2:40 p.m. Latest Development in Nanodelivery Systems: N.Desai,
CelGene3:10 p.m. Lipidots® lipid nano dropplets: Dr I.Texier, CEA-Leti
3:40 p.m. BREAK 30’
4:10 p.m. Delivery Device for Biotherapies: D.Hoarau,

BD-Pharma
4:40 p.m. Microencapsulation of Human Cells: J.Oberholzer,
UIC Chicago
5:10 p.m. Micro-Pump for Drug Delivery: Dr R.Campagnolo,
CEA-Leti

E

Chairman: Laurent Fulbert

Delivering biological or chemical therapeutics is amajor part of medical therapy. It can be envisaged byusing delivery systems or delivery devices, ranging
from nanoscale to macroscale. New developments
in physics, chemistry and engineering enable thedesign of highly innovative delivery systems or revisit
old concepts.
This session will cover some of the most significant
technological developments or address the next frontiers to deliver innovative therapeutics like small chemical entities, biopharmaceuticals or human cells.

4:00 p.m. Start-ups & Leti, Success & Ambition: Dr L.Malier,

Closing : 20 years of thinking, 20 years ahead

D

GRAND SALON

Smart Systems

Chairman: Céline Soubeyrat

Theperformanceevolutionofboth
telecommunication networks and computingsystems requires increasing communication
bandwidth at all interconnects levels. Photonic
technology is considered as a means to overcome
the interconnect bottleneck by utilizing opticallinks to replace the long metallic wires.
This session will review the application roadmaps
and the different challenges that silicon photonics
is facing in terms of materials, fabrication andpackaging.

FROOM 222-224

Today, the integration of Smart Systems into our daily
lives opens many ways for innovating to the industry:
housing, lighting, eHealth, transportations… CEALeti has developed methodologies for driving theinnovation process from the concept to the product:
identification of the sweet spot, integration of
the most advanced technologies and support forindustrialization.
This session will present real life examples of Smart
Systems and will, then, focus on one of the mostcritical challenges: the autonomy of Smart Devices.

2:00 p.m. Welcome: L.Fulbert, CEA-Leti
2:10 p.m. Optical Interconnection / Polymer Waveguide Integrated
Package: H.Yonekura, Shinko
2:40 p.m. Kotura Silicon Photonics, a WDM Approach to Optical
Interconnect: J-L.Malinge, Kotura
3:10 p.m. Challenges & Opportunities for Optical Interconnects inComputing: B.Offrein, IBM Zurich
3:40 p.m. BREAK 30’

2:00 p.m. Welcome: C.Soubeyrat, CEA-Leti

4:10 p.m. 3D Integration & Silicon Photonics for Green IT: Dr A.Jerraya,
CEA-Leti

4:10 p.m. Movea® Motion Intelligence Makes Sports and Fitness

4:35 p.m. Silicon Photonics Developments at ST: STMicroelectronics

4:40 p.m. Vibration Energy Harvesting: toward autonomous

2:10 p.m. Transfering Technological Value to SME: Pepite’s

Model: T.Delhome, CEA-Leti

2:40 p.m. Autonomous Roller Blind: T.Fritsch, Bubbendorf
3:10 p.m. Smart Device for Observance: C.Sivera, INLAB
3:40 p.m.

BREAK 30’

Fun “: B.Flament, Movea

5:10 p.m. Technology Developments for Silicon Photonics: J-M.Fedeli,CEA-LetiWireless Sensor Nodes for Industry: S.Boisseau, CEALeti
5:10 p.m. Smart Lighting: A.Lagrange, CEA-Leti

5:45 p.m. FINAL CONCLUSION: Dr L.Malier, CEA-Leti

5:45 p.m. FINAL CONCLUSION: Dr L.Malier, CEA-Leti

5:45 p.m. FINAL CONCLUSION: Dr L.Malier, CEA-Leti

6:00 p.m. END

6:00 p.m. END

6:00 p.m. END

5:00 p.m. Silicon Photonics, from Design to Circuits: S.Menezo, CEA-Leti