Application Note

Assembly Precautions
for the Nichia 129 Series LEDs
Table of contents
1.

LED Outline Dimensions/Tape and Reel Dimensions ・ ・ ・ ・ ・ ・ ・ ・ 2

2.

Handling Precautions ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 3

3.

Design Recommendations for Optimal Amount of Solder

4.

Precautions for Setting Up a Pick-and-Place Machine/Nozzle

5.

Precautions When Reflow Soldering ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 9

・ ・ ・ ・ ・ 4
・ ・ ・ 5-9

NSSW129 and NSSx129x refer to Nichia part numbers. These Nichia part numbers within this document
are merely Nichia’s part numbers for those Nichia products and are not related nor bear resemblance toany other company’s product that might bear a trademark.
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 129 Series LEDs
1. LED Outline Dimensions/Tape and Reel Dimensions
Table 1. NSSx129x Product Specifications
LED

Embossed Carrier Tape

Cathode Mark2±0.05 4±0.1

5.5 ±0.05

Cathode Mark0.4 ±0.1

Φ1±0.13.9 ±0.18±0.1

12 +0.3-0.1

3.6(2.95)

Φ1.5 +0.1-01.75±0.1

テーピング部 Tape

Cathode Mark4.3 ±0.14(2.8)(2.4)

4.3 ±0.1

4

リール部 Reel

330±2

17.5±113.5±1*0.9

2.8

Φ80 ±1

3.4

KA
ラベル
Label

保護素子
Protection Device

CathodeAnodeWeight: typ. 0.078g(Unit: mm, Tolerance: ±0.2mm)

The weight value provided in Table 1 is the weight for the NSSW129 LED.

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Reel Size: 2,000 LEDs
(Unit: mm)

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Assembly Precautions for the Nichia 129 Series LEDs
2. Handling Precautions✔ Correct

2-1. Handling with Bare Hands

Do not handle the LEDs with bare hands:- this may contaminate the LED surface and have an effect on the optical characteristics,- this may cause the LED to deform and/or the wire to break causing a catastrophic failure (i.e. the LED not toilluminate),

2-2. Handling with Tweezers

Ensure that when handling the LEDs with tweezers, excessive force is not applied to the LED. Otherwise, it may causedamage to the resin (e.g. cut, scratch, chip, crack, delamination and deformation) and/or the wire to break causing acatastrophic failure.

2-3. ESD Precautions

The LEDs are sensitive to transient excessive voltages (e.g. ESD, lightning surge). If this excessive voltage occurs in thecircuit, it may cause the LED to be damaged causing issues (e.g. the LED to become dimmer or not to illuminate [i.e.
catastrophic failure]). When handling the LEDs, ensure that necessary measures have been taken to protect them fromtransient excess voltages. Refer to the applicable specification for more details.

Incorrect

2-4. Stacking Assembled PCBs Together

Do not stack assembled PCBs together. Otherwise, it may cause damage to the resin (e.g. cut, scratch, chip, crack,delamination and deformation) and the wire to break causing a catastrophic failure.

2-5. Baking

The NSSx129x LEDs are comparable to JEDEC Moisture Sensitivity Level (MSL) 3 or equivalent. Refer to IPC/JEDEC STD020 for detailed information regarding the MSL. If the "after opening" storage time is exceeded, or if pink silica gel
beads are found, make sure the LEDs are baked before use. Baking should be done only once. When baking the LEDs,
remove the reel of the LEDs from the moisture-proof aluminum bag.

Incorrect

Table 2. Storage/Baking Conditions
Conditions
Before Opening the MoistureStorage

proof Aluminum Bag
After Opening the Moistureproof Aluminum Bag
BakingTemperature

HumidityTime≤30ºC≤90%RHWithin 1 Year from Delivery Date

≤30ºC

≤70%RHWithin 168 Hours

65±5°C-Figure 1. Correct/Incorrect Examplesof Handling with Tweezers≥24 Hours

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Assembly Precautions for the Nichia 129 Series LEDs
3. Design Recommendations for Optimal Amount of Solder
Soldering Pad Pattern/Metal Solder Stencil Aperture
Table 3. Recommended Soldering Pad Pattern/Metal Solder Stencil Aperture

Recommended Soldering
Pad Pattern

Recommended Metal Solder Stencil Aperture

3.7

3.7

1.2

1.2

3

1.2

3

1.2

--- LED Outline + Electrodes■ Soldering Pad Pattern■ Metal Solder Stencil Aperture

AnodeCathode(Unit: mm)(Unit: mm)Table 4. Recommended Solder/Metal Solder Stencil Conditions

Item

Recommended Conditions

Metal Solder Stencil (Thickness)

150μm

Solder Paste (Composition)

Sn-3.0Ag-0.5Cu

The recommended soldering pad pattern, metal solder stencil aperture, and thickness of the metal solder stencil provided in Tables 3 and 4 have been determined
under Nichia’s conditions: ensure that there are no issues with the chosen assembly conditions prior to use.
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Assembly Precautions for the Nichia 129 Series LEDs
4. Precautions for Setting Up a Pick-and-Place Machine/Nozzle
Table 5. Cautions/Suggestions for Setting Up Equipment

RecommendedConditions/Specifications

ItemCautions/Suggestions

Pick-and-Place Machine

Modular mounter

The recommended conditions/specifications herein have been
determined using YS100 High-Speed General-Purpose Modular(manufactured by Yamaha Motor Co., Ltd.).

Pick-and-Place Nozzle

Use a nozzle that is appropriate for thedimensions of the LED.

See “4-1. Pick-and-Place Nozzle” on Page 6 for details.

Tape-and-Reel Feeder

Electrical (motorized) feederTape width: 12mm
Feeder pitch: 8mm

See “4-2. Tape-and-Reel Feeder” on Page 7 for details.

Top Cover Tape Removal
Position

Sufficiently far away from the LED pickup position.

Nozzle Height for Pick-up
Operations

The contact surface of the nozzle headfor pick operations should be adjusted
to 0.3mm below the edge of theembossed carrier tape pocket.

See “4-3. Recommended Nozzle Height for Pick-up Operations” onPage 8 for details.

Nozzle Height for Placement
Operations (i.e. PlacementDepth)

0.2mm for placement depth

See “4-4. Recommended Nozzle Height for Placement Operations(Placement Depth)” on Page 8 for details.

Imaging-based AutomaticInspection

Using the electrode as a reference isrecommended to locate the center ofthe LED.

See “4-2. Tape-and-Reel Feeder” on Page 7 for details.

See "4-5. Imaging-based Automatic Inspection" on Page 9 for details.

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Assembly Precautions for the Nichia 129 Series LEDs
4-1. Pick-and-Place Nozzle

Incorrect

Pick up the LEDs at the flat area.

Φ1.5 +0.1-0

Do not pick up the LEDs atthe sloped area.

8±0.1

2±0.05 4±0.1

LED Pick-up Position

Figure 2. Correct/Incorrect LED Pick-up Position

5.5 ±0.05

Cathode Mark1.75±0.1✔Correct

3. Figure 4 shows the pick-up position for the LEDs in the embossed carrier
tape pocket.

12 +0.3-0.1

1. Pick up the LEDs at the flat area of the LED; do not pick up theLEDs at the sloped area (see Figure 2).

Φ1±0.1(Unit: mm)

2. Use a nozzle that is appropriate for the LED (i.e. the nozzledimensions are appropriate for the dimensions of therecommended pick-up position for the LED). Figure 3 shows anexample of a recommended nozzle tip.

Figure 4. LED Pick-up Position in the Embossed Carrier Tape Pocket

0.9(0.6)

1.7
(1.4)

(Unit: mm)

Figure 3. Example of a Recommended Nozzle Tip
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Assembly Precautions for the Nichia 129 Series LEDs
4-2. Tape-and-Reel Feeder• It is recommended to remove the top cover tapeat a point sufficiently far away from the LED pick-up position.

1. For the tape-and-reel feeder, the tape width is set to 12mm and thefeeder pitch is set to 8mm.

Top Cover Tape Removal Position

2. Use a tape-and-reel feeder that ensures it does not create excessive
vibrations causing assembly issues (e.g. an electrical [motorized]feeder).

Feed Speed: Slow Vibration: Small・ When the tape feeder feed rate is fast, the LEDs in the embossed
carrier tape pockets may not be in the correct position when pickedby the nozzle; it may be improved by reducing the tape feeder feedrate.

LED Pick-up
Position

Figure 5. Top Cover Tape Removal Position

3. It is recommended to remove the top cover tape at a point sufficiently
far away from the LED pick-up position.

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Assembly Precautions for the Nichia 129 Series LEDs
4-3. Recommended Nozzle Height for Pick-up Operations
Pick-and-Place Nozzle
0.3mm below the edge ofthe tape pocket (i.e. Pick-updepth)

LED

Embossed Carrier Tape (Pocket)

Figure 6. Recommended Nozzle Height for Pick-up Operations

4-4. Recommended Nozzle Height for Placement Operations(Placement Depth)
Pick-and-Place Nozzle

1. Ensure that the nozzle goes down onto the LED in the tape pocket until
the tip touches the flat surface of the LED.
Pick-up depth: 0.3mm
Note: If the reference level for the nozzle setting is at the edge of thetape pocket.
2. The recommended nozzle height for pick-up operations has been
determined by Nichia under the verification conditions and may not
function as expected with some other pick-and-place machines. If thepick-up operations are unstable even with using the recommended
nozzle height, adjust the nozzle height appropriate for the pick-andplace machine being used.
If the pick point of the nozzle is too high,- it may cause insufficient suction power leading to picking errors(e.g. the nozzle’s failure to pick/lift the LED into the air, incorrect
picking causing the LED to tilt when in the air).
If the pick point of the nozzle is too low,
- it may cause issues (e.g. causing the embossed carrier tape toshake, causing the tape pocket to deform) leading to picking
failure.
1. The nozzle should further press the LED 0.2mm onto the PCB from theheight where the LED first touches solder paste.
If the release point of the nozzle is too high,- it may cause placement issues (e.g. the LED to stick to thenozzle after placement, the LED to be mounted in an incorrect
place/rotated position, the LED to become soldered to the PCB
in a tilted position, etc.).

Placement Depth: 0.2mm

If the release point of the nozzle is too low,
- excessive forces may be applied to the LED during placement
and it may cause the LED to become damaged.

LEDPCB

Figure 7. Recommended Nozzle Height for Placement Operations(Placement Depth)Light Emitting Diode

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Assembly Precautions for the Nichia 129 Series LEDs
4-5. Imaging-based Automatic Inspection
1. Nichia recommends using the electrodes as a reference to locate thecenter of the LED.
Electrode Location
Detection/ RecognitionPoints

2. If the imaging device has trouble detecting/recognizing the electrodes,
adjust the settings (i.e. the brightness of the light, etc.) of the pickand-place machine.

Figure 8. Recommended Reference Points to Detect, Recognize, orLocate the Electrodes

5. Precautions When Reflow Soldering

1~5℃/sec

Pre-heat180~200℃

260℃ Max
10sec Max

220℃ Max
60sec Max

120sec Max

Figure 9. Recommended Reflow Soldering Condition(Lead-free Solder)

1. Reflow soldering must not be performed more than twice.
2. Nichia recommends using the reflow soldering conditions detailed inFigure 9 to the left; use the recommended reflow conditions specified
by the manufacturer of the solder paste being used if it works betterfor the chosen application.

Note: To ensure that these reflow conditions have no negative effecton the LEDs, perform sufficient verification prior to use.
3. When cooling the LEDs from the peak temperature a gradual coolingslope is recommended; do not cool the LEDs rapidly.
4. During reflow soldering, the heat and atmosphere in the reflow ovenmay cause the optical characteristics to degrade. In particular, reflowsoldering performed with an air atmosphere may have a greater
negative effect on the optical characteristics than if a nitrogen
atmosphere is used; Nichia recommends using a nitrogen reflow
atmosphere.

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Assembly Precautions for the Nichia 129 Series LEDs

Disclaimer
This application note is a controlled document of Nichia Corporation (Nichia) published to provide technical information/data forreference purposes only. By using this application note, the user agrees to the following:• This application note has been prepared solely for reference on the subject matters incorporated within it and Nichia makes noguarantee that customers will see the same results for their chosen application.
• The information/data contained herein are only typical examples of performances and/or applications for the product. Nichia
does not provide any guarantees or grant any license under or immunity from any intellectual property rights or other rights
held by Nichia or third parties.
• Nichia makes no representation or warranty, express or implied, as to the accuracy, completeness or usefulness of any
information contained herein. In addition, Nichia shall not be liable for any damages or losses arising out of exploiting, using,or downloading or otherwise this document, or any other acts associated with this document.
• The content of this application note may be changed without any prior or subsequent notice.
• Copyrights and all other rights regarding the content of this document are reserved by Nichia or the right holders who havepermitted Nichia to use the content. Without prior written consent of Nichia, republication, reproduction, and/or redistributionof the content of this document in any form or by any means, whether in whole or in part, including modifications or derivative
works hereof, is strictly prohibited.

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TOKUSHIMA 774-8601, JAPAN
Phone: +81-884-22-2311 Fax: +81-884-21-0148

NICHIA CORPORATION
http://www.nichia.co.jp

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