Application Note

Assembly Precautions
for the Nichia 585 Series LEDs

Table of contents
1.

LED Outline Dimensions/Tape Dimensions

2.

Handling Precautions ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 3

3.

Design Recommendations for Optimal Amount of Solder

4.

Precautions for Setting Up a Pick-and-Place Machine/Nozzle

5.

Precautions When Reflow Soldering

6.

Evaluation of the Effect of Solder Volume

7.

Verification of the Self-Alignment Capability ・ ・ ・ ・ ・ ・ ・ ・ ・ 11-12・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 2
・ ・ ・ ・ ・ 4
・ ・ ・ 5-8・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 8

・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 9-10

The part number NF2W585AR, NF2W585AR-P8, NF3W585AR, NF3W585AR-V1 and NF4W585AM-V1 in this document are thepart number of our product, and do not have any relevance or similarity to other companies' products that may have
trademark rights.
This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 585 Series LEDs

1. LED Outline Dimensions/Tape Dimensions
Table 1. NF2W585AR, NF2W585AR-P8, NF3W585AR, NF3W585AR-V1, NF4W585AM-V1 Product Specifications

Tape and Reel Dimensions

LED Outline Dimensions
光学的中心位置
Location of the optical centerΦ1.5 +0.2-0Cathode Mark3.8 ±0.1

3.5

5.9

3.6

3.5

Cathode Mark0.3 ±0.05

2.5

2±0.05 4±0.1

4.2 ±0.18±0.1

5.5 ±0.05

Φ1.5 +0.1-01.75±0.1

テーピング部 Tape

4

12 +0.3-0.1

Cathode Mark2.3 ±0.1

1.75

3.2

5.1

2.05

0.25

リール部 Reel
330±2

1.13
1.78

Anode

Part Number
NF2W585AR
NF3W585AR
NF2W585AR-P8
NF3W585AR-V1
NF4W585AM-V1

Weight(typ.)0.036g0.036g0.037g0.037g0.037g(Unit: mm, Tolerance: ±0.2mm)

Φ80 ±1

2.5

Cathode2.9

13.5±117.5±1

ラベル
Label

Reel Size:3,500 LEDs
(Unit: mm)

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Assembly Precautions for the Nichia 585 Series LEDs

2. Handling Precautions
2.1 Handling with bare hands
Do not handle the LEDs with bare hands:- this may contaminate the LED surface and have an effect on the optical characteristics,- this may cause the LED to deform and/or the wire to break causing a catastrophic failure (i.e. the LED not toilluminate),- the lead frame may cause injuries when the LED is handled with bare hands.

2.2 Handling with tweezers
Ensure that when handling the LEDs with tweezers, excessive force is not applied to the LED. Otherwise, it may cause
damage to the resin (e.g. cut, scratch, chip, crack, delamination and deformation) and the wire to break causing acatastrophic failure (i.e. the LED not to illuminate).

2.3 ESD Precautions

Correct

Suggestion: Grab/holdthe LEDs with tweezers by
the sides of the substrate.

Incorrect

The LEDs are sensitive to transient excessive voltages (e.g. ESD, lightning surge). If this excessive voltage occurs in thecircuit, it may cause the LED to be damaged causing issues (e.g. the LED to become dimmer or not to illuminate [i.e.
catastrophic failure]). When handling the LEDs, ensure that necessary measures have been taken to protect them fromtransient excess voltages. Refer to the applicable specification for more details.

2.4 Stacking assembled PCBs together
Do not stack assembled PCBs together. Otherwise, it may cause damage to the resin (e.g. cut, scratch, chip, crack,delamination and deformation) and the wire to break causing a catastrophic failure (i.e. the LED not to illuminate).

Incorrect

2.5 Baking
The storage/packaging requirements for the NICHIA 585 Series LEDs are comparable to JEDEC Moisture Sensitivity
Level (MSL) 3 or equivalent. Nichia used IPC/JEDEC STD-020 as a reference to rate the MSL of this LED. If the “After
Opening” storage time has been exceeded or any pink silica gel beads are found, ensure that the LED are baked before
use. Baking should only be done once.
Table 2. Storage/Baking Conditions
Conditions
Storage

Temperature

Humidity

Before Opening Aluminum Bag≤ 30°C≤ 90%RH

Within 1 Year from Delivery Date

After Opening Aluminum Bag≤ 30°C≤ 70%RH≤ 168 hours

65±5°C-≥ 24 hours

Baking (Reel is Removed from Aluminum Bag)Time

Caution: Do not let thetweezers touch the lens(Silicone Resin).

Figure 1. Examples ofproper/improper handlingwith tweezers

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Assembly Precautions for the Nichia 585 Series LEDs

3. Design Recommendations for Optimal Amount of Solder
Soldering Pad Pattern/Metal Solder Stencil Aperture― LED Outline and Electrodes■ Soldering Pad Pattern■ Metal Solder Stencil Aperture

Table 3. Recommended Soldering Pad Pattern/Metal Solder Stencil Aperture
Recommended
Soldering Pad Pattern

Recommended
Metal Solder Stencil Aperture

0 .64

Correct

2 .26
3 .2
4 .8

▩: Do not have the solder pads in the area

Incorrect

3 .5

3 .1

2 .4

1 .07

1 .28
2 .9
3 .6

0 .43

1 .76
3 .48
3 .88
4 .7

If this area is covered by a copper foil layer that has beenconnected to the cathode, there is the potential for ashort circuit due to contact with the anode of the LED.

Figure 2. Prohibited Area for the Copper Layer

shaded with crossed diagonal lines.

(Unit: mm)(Unit: mm)Table 4. Recommended Solder/Metal Solder Stencil Conditions
Item

Recommended Conditions

Stencil Thickness

150μm

Solder Paste

Sn-3.0Ag-0.5Cu― LED Outline and Electrodes▨ Copper Layer□ Soldering Pad Pattern

The soldering pattern shapes, metal solder stencil
aperture shapes, and metal stencil thicknesses shownin Tables 3 and 4 were selected based on Nichia’s
recommended placement conditions.
Customers should ensure that there are no issues withthe chosen placement conditions before use.

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Assembly Precautions for the Nichia 585 Series LEDs

4. Precautions for Setting Up a Pick-and-Place Machine/Nozzle
Table 5. Cautions/Suggestions for Setting Up Equipment
Item

Recommended Conditions/Specifications

Cautions/Suggestions

Pick-and-Place machine

Modular mounter

See the note below this table.

Pick-and-Place Nozzle

Specially designed nozzle(see Figure 3)

See “Pick-and-Place Nozzle” on Page 6 for the details.

Tape-and-reel feeder

Electrical (motorized) feeder
Tape width: 12mm
Feed length: 8mm

See “Tape-and-Reel Feeder” on Page 6 for the details.

Nozzle height for pick-up
operations

The contact surface of the nozzle head for pick
operations should be adjusted to 1.7mm below the edgeof the embossed carrier tape pocket.

See “Recommended Nozzle Height for Pick-up
Operations” on Page 7 for the details.

Nozzle height forplacement operations(i.e. placement depth)

0.2mm for placement depth

See “Recommended Nozzle Height for Placement
Operations (Placement Depth)” on Page 7 for thedetails.

Imaging-based Automatic
Inspection

Using the electrode as a reference is recommended tolocate the center of the LED.

See "Imaging-based Automatic Inspection" on Page 8
for the details.

Note:
-

The recommended conditions/specifications above have been determined under the following verification conditions:
Pick-and-Place machine (modular mounter):- YS100 High-Speed General-Purpose Modular (manufactured by Yamaha Motor Co., Ltd.)This document contains tentative information, Nichia may change the contents without notice.

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Assembly Precautions for the Nichia 585 Series LEDs
4.1 Pick-and-Place Nozzle

Pick-andPlace Nozzle
LED

0.6mm

2

R0 .15
Φ3 .8
4 .4[Unit: mm]

Figure 4. Cross-sectional view of a nozzle whentransporting a NICHIA 585 Series LED to a PCB

Figure 3. Recommended Nozzle
Dimensions

4.2 Tape-and-Reel Feeder

Correct
LED pick up
position

Top Cover Tape
Removal Position

Incorrect
Feed Speed: Fast Vibration: Large

2. Part height for the nozzle to pick up the LEDs: 0.6mm

1. Recommended setting for the tape-and-reel feeder.
Tape width: 12mm
Feed length: 8mm

Recommended Top Cover Tape
Removal Position

Feed Speed: Slow Vibration: Small

1. As shown in Figure 4, the nozzle tip should only touch
the flat corners of the LED’s top surface to hold theLEDs. Ensure that it does not come in contact with thelens. The LEDs uses a silicone resin for the lens andinternal pre-coating resin; the silicone resin is soft. If
pressure is applied to the lens, it may cause the lens to
be damaged, chipped and/or delaminated. If the lens isdamaged, chipped, delaminated and/or deformed, it
may cause the wire to break causing a catastrophic
failure (i.e. the LED not to illuminate) and/or reliability
issues (e.g. the LED to corrode and/or to become
dimmer, the color/directivity to change, etc.) Ensurethat no amount of pressure is applied to the lens.

LED pick up
position

2. Use a tape-and-reel feeder that ensures it does notcreate excessive vibrations causing assembly issues.
Example: Electrical (motorized) feeder
3. When removing the top cover tape, it should be done
adjacent to the target LED (See Figure 5). Otherwise, it
may shake the embossed carrier tape and cause the LED
to move within the tape pocket. This may cause- the nozzle to fail to pick up the LED or not to pick it
up properly and shift while on the nozzle during thetransport to the PCB (i.e. pick-up/placement failure)- the LED to hit the feeder cover and become damaged.

Figure 5. Examples of Correct/Incorrect Top Cover Tape Removal Positions
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Assembly Precautions for the Nichia 585 Series LEDs
4.3 Recommended Nozzle Height for Pick-up Operations

1. Ensure that the nozzle goes down onto the LED in the tape pocket until
the tip touches the flat surface around the lens.

Pick-and-Place Nozzle

Pick-up depth: 1.7mm

1.7mm below the edgeof the tape pocket(i.e. Pick-up depth)

Note: If the reference level for the nozzle setting is at the edge of thetape pocket.
2. The recommended nozzle height for pick-up operations has been
determined by Nichia under the verification conditions (See Table 5) andmay not function as expected with some other pick-and-place machines.
If the pick-up operations are unstable even with using therecommended nozzle height, adjust the nozzle height appropriate forthe pick-and-place machine being used.

LED

If the pick point of the nozzle is too high,- it may cause insufficient suction power leading to picking errors(e.g. the nozzle’s failure to pick/lift the LED into the air, incorrect
picking causing the LED to tilt when in the air).

Embossed Carrier Tape
(Pocket)Figure 6. Recommended Nozzle Height for Pick-up Operations

If the pick point of the nozzle is too low,
- it may cause issues (e.g. causing the embossed carrier tape toshake, causing the tape pocket to deform) leading to picking
failure and/or damage to the LED.

4.4 Recommended Nozzle Height for Placement Operations(Placement Depth)
Pick-and-Place Nozzle

1. After the LED is placed onto the solder paste on the PCB, the nozzle
should further press the LED 0.2mm into the PCB.

LED

If the release point of the nozzle is too high,- it may cause placement issues (e.g. the LED to stick to the nozzle
after placement, the LED to become soldered to the PCB in atilted position, etc.).

Press
0.2mm

If the release point of the nozzle is too low,
- excessive forces may be applied to the LED during placement andit may cause the LED to become damaged.

PCB

Figure 7. Recommended Nozzle Height for Placement (Placement Depth)
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Assembly Precautions for the Nichia 585 Series LEDs
4.5 Imaging-based Automatic Inspection
1. Nichia recommends using the electrodes as a reference to locate the center ofthe LED.
Polarity Detection/
Recognition Point

Electrode Location
Detection/
Recognition Points

2. If the imaging device has trouble detecting/recognizing the electrodes due tothe uniqueness of the electrode pattern, adjust it to detect/recognize the outerportions of the electrodes (i.e. the areas circled in red in Figure 8 to the left).
3. If an automatic polarity detector is used for the LEDs, set up the imaging device
to detect the empty space between the anode and cathode electrodes (i.e.
Polarity Detection/Recognition Point in Figure 8 to the left). In the example in
Figure 8, the equipment measures the brightness of the empty space against
the threshold to locate the electrodes and/or determine the polarity.

Figure 8. Recommended reference points todetect, recognize, or locate the polarity/electrodes

5. Precautions When Reflow Soldering
1. Reflow soldering must not be performed more than twice.
1 to 5℃ per sec
Pre-heat
180 to 200℃

260℃ Max
10sec Max
60sec Max
Above 220℃

120sec Max

Figure 9. Recommended Reflow Soldering Condition(Lead-free Solder)

2. Using the recommended reflow soldering conditions (See Figure 9 to the left)
as a reference, modify if necessary, the recommended reflow conditions
specified by the manufacturer of the solder paste being used.
Note: To ensure that these reflow conditions have no negative effect on theLEDs, perform sufficient verification prior to use.
3. When cooling the LEDs from the peak temperature a gradual cooling slope isrecommended; do not cool the LEDs rapidly.
4. During reflow soldering, the heat and atmosphere in the reflow oven may cause
the optical characteristics to degrade. In particular, reflow soldering performed
with an air atmosphere may have a greater negative effect on the opticalcharacteristics than if a nitrogen atmosphere is used; Nichia recommends using
a nitrogen reflow atmosphere.

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Assembly Precautions for the Nichia 585 Series LEDs

6. Evaluation of the Effect of Soldering Volume
6.1 Method/Conditions
Nichia has evaluated the effect of solder volume on the workmanship of the reflow-soldered in terms of LED emission, solder wettability (i.e.
solder void percentage), number of solder ball, LED parallel/angular misalignment, and LED tilt. To control the amount of solder, threedifferent metal solder stencil thicknesses were used.
Metal Solder Stencil Thickness:
120μm, 150μm (Nichia’s recommendation), 180μm

6.2 Results
LED emission, solder balls, LED parallel/angular placement deviations, LED delamination, and LED tilt
- There were no issues with the evaluated amounts of solder used.
Solder wettability/void percentage,- The solder spread was sufficient; the average solder void percentage of the cathode electrode area in the middle was approx. 6-10%.
For more details, refer to Table 6 on Page 10.

6.2 Recommendations
If solder balls appear in the chosen application, review the reflow profile and/or reduce the size of the metal solder stencil aperture for thecathode electrode in the middle.

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Assembly Precautions for the Nichia 585 Series LEDs

6. Evaluation of the Effect of Soldering Volume (Continued)
Table 6. Evaluation Results for Each Stencil Thickness
Stencil Thickness

Sample size: 102 LEDs per condition (i.e. stencil thickness)

120μm
Cathode(Edge)

Cathode(Middle)

150μm(Nichia’s Recommendation)

180μm

Anode

X-Ray Image1

Emission Inspection

LED emitted

LED emitted

LED emitted

Solder Ball

No solder balls were formed

No solder balls were formed

No solder balls were formed

Cathode (Edge):
Cathode (Middle):
Anode:

Cathode (Edge):
Cathode (Middle):
Anode:

Cathode (Edge):
Cathode (Middle):
Anode:

Solder Void Percentage2

LED Parallel/Angular
Misalignment, and LED Tilt

5.9 %10.1 %
5.2 %No issue

5.0 %
6.9 %
4.5 %

No issue

4.2 %
6.2 %
3.6 %

No issue

Note:
1
Example of LEDs with average void percentages under the same evaluation conditions (i.e. amount of solder).
2
Solder void percentage [%]: Area of a space within the solder joint that lacks solder paste/area of the electrode.

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Assembly Precautions for the Nichia 585 Series LEDs

7. Verification of the Self-Alignment Capability
7.1 Method/Conditions
Nichia has verified the self-alignment capability of the LEDs using three different solder stencil thicknesses to control the amount of solder.
Evaluation LEDs were placed on specified points or intentionally rotated to create a parallel/angular misalignment from the center of thesoldering pad pattern (see Figure 10 below). After reflow soldering, LED positions and angles were measured for each stencil thickness (i.e. solder
volume) to determine the amount of misalignment.
Metal Solder Stencil Thickness: 120μm, 150μm (Nichia’s recommendation), 180μm
Parallel Deviation Condition: ∆x,y = 0.1mm, 0.2mm
Angular Deviation Condition: ∆θ = 10°, 5°+ Center of the soldering pad pattern+ LED center for placement (i.e. center determined based on the electrodes’ position)

Normal position

x,y = 0.2mm

x,y = 0.1mm

θ = 10°θ = 5°

Figure 10. LED misalignment Conditions

7.2 Conclusions
LED Parallel Misalignment- If the misalignment is within 0.2mm in both the x and y coordinates, it will not have an effect on the self-alignment capability.
LED Angular Misalignment- Since all the rotated LEDs moved back to the correction position (i.e. the center of the soldering pad pattern) by themselves during reflow
soldering, there are no issues with the self-alignment capability against the evaluated angular deviation.
For more details, refer to Figures 11 and 12 on Page 12.

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Assembly Precautions for the Nichia 585 Series LEDs

7. Verification of the Self-Alignment Capability (Continued)
0.3

0.3

Figure 11. Evaluation Results(Parallel misalignment)

0.2

0.2

0.1

0.1

⊿y [mm]⊿y [mm]x,y = 0.2mm

0
120μm

-0.1

150μm
180μm
Placement-0.2

x,y = 0.1mm

Sample size: 12 LEDs for each condition

0
120μm

-0.1

150μm
180μm
Placement-0.2

Position

Position
-0.3
-0.3

-0.2

-0.1

0

0.1

0.2

0.3

-0.3
-0.3

-0.2

10

Amount of Rotation from the
ﾘﾌﾛｰ後の回転角θ
Angle [°] [°]Reference

-0.1

0

0.1

0.2

0.3

⊿x [mm]⊿x [mm]8

Figure 12. Evaluation Results(Angular misalignment)

6

Sample size: 12 LEDs for each condition

RotationAngle (θ)

42

+ Center of the soldering pad pattern+ LED center for placement (i.e. center

0

120μm

150μm

180μm

θ：10°

120μm

150μm

determined based on the electrodes’ position)

180μm

θ：5°
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Assembly Precautions for the Nichia 585 Series LEDs

Disclaimer
This application note is a controlled document of Nichia Corporation (Nichia) published to provide technical information/data forreference purposes only. By using this application note, the user agrees to the following:• This application note has been prepared solely for reference on the subject matters incorporated within it and Nichia makes noguarantee that customers will see the same results for their chosen application.
• The information/data contained herein are only typical examples of performances and/or applications for the product. Nichia
does not provide any guarantees or grant any license under or immunity from any intellectual property rights or other rights
held by Nichia or third parties.
• Nichia makes no representation or warranty, express or implied, as to the accuracy, completeness or usefulness of any
information contained herein. In addition, Nichia shall not be liable for any damages or losses arising out of exploiting, using,or downloading or otherwise this document, or any other acts associated with this document.
• The content of this application note may be changed without any prior or subsequent notice.
• Copyrights and all other rights regarding the content of this document are reserved by Nichia or the right holders who havepermitted Nichia to use the content. Without prior written consent of Nichia, republication, reproduction, and/or redistributionof the content of this document in any form or by any means, whether in whole or in part, including modifications or derivative
works hereof, is strictly prohibited.

491 Oka, Kaminaka-Cho, Anan-Shi,
TOKUSHIMA 774-8601, JAPAN
Phone: +81-884-22-2311 Fax: +81-884-21-0148

NICHIA CORPORATION
http://www.nichia.co.jp

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