Product Lineup
Kiru

KezuruMigakuwww.disco.co.jp• This catalog outlines the standard specification for this equipment and may differ from the specificationof products equipped with special accessories and specifications.
• The specification of an individual product may change due to technical improvements. Please confirm
the specification details when placing your order.
• For further information regarding each product, please contact your local DISCO sales representatives.

2019.12Kiru

KezuruBlade Dicing Saw

MigakuAutomatic dicing saw workflow
Workpiece loading

Alignment

DicingWorkpiece unloading

Manual workpieceloading by theoperator

Recognition of thepreviously registeredtarget and designationof the cut location

Cutting of the line
identified in alignment

Manual workpiece
removal by theoperator

Automatic Dicing Saw
Automatic cutting and manual handling

Kiru

Kiru

DAD324Compact modelfor ø150 mm wafers

Max workpiece sizemm

LayoutSpindleOutputkW

Y-axisZ-axisUtilities

Max cutting speed

DAD3231

DAD3431

DAD3241

Highly flexible configuration
to meet processing needs

High precision model with
X-axis air slider

Standard automatic modelfor ø200 mm wafers

DAD3351
Flexibility for diverse
application needs

DAD3651
Ultracompact facing dual
configuration

DAD3361

DAD3661
Dual spindle mounted
equipment with support forprocessing large package
substrates

Highly extensible
equipment for ø300
mm and 250x250 mm
workpieces

ø150

ø150

ø150

ø150

ø200

ø200

ø200

ø300

ø360/□ 360

SingleSingleSingleSingleSingleSingleFacing dual spindle

SingleFacing dual spindle

2.0 at 40,000 min-1

2.0 at 40,000 min-1

2.0 at 40,000 min-1

2.0 at 40,000 min-1

1.8 at 60,000 min-1

1.8 at 60,000 min-1

1.8 at 60,000 min-1

1.8 at 60,000 min-1

1.8 at 60,000 min-1

min-1

40,00040,00040,00040,00060,00060,00060,00060,00060,000mm/sec0.1 - 800

0.1 - 800

0.1 - 800

0.1 - 300

0.1 - 800

0.1 - 1,000

0.1 - 1,000

0.1 - 1,000

0.1 - 1,000

Max revolution speed
X-axisDAD3221
Standard automatic modelfor ø150 mm wafers

Index stepmm

0.00010.00010.00010.00010.00010.00010.00010.00010.0001

Positioning accuracymmWithin 0.005 / 160

Within 0.005 / 160

Within 0.005 / 160

Within 0.0015 / 160

Within 0.002 / 210

Within 0.002 / 260

Within 0.002 / 260

Within 0.002 / 310

Within 0.002 / 400

Repeating accuracy

mm

0.001

0.001

0.001

0.001

0.001

0.001

0.001

0.001

0.001

Dimensions (W×D×H)

mm

490 × 870 × 1,670

490 × 870 × 1,670

650 × 950 × 1,670

730 × 900 × 1,670

650 × 950 × 1,670

880 × 1,000 × 1,800

790 × 790 × 1,800

880 × 1,000 × 1,800

1,350 × 1,200 × 1,800

Weightkg

Approx. 420

Approx. 420

Approx. 550

Approx. 600

Approx. 550

Approx. 1,100

Approx. 1,040

Approx. 1,100

Approx. 1,550

Optional Accessories
Noncontact
setup

Blade breakage
sensorBlade tip position
relative to the chucktable surface is
detected by an opticalsensor.
Processing quality
is stable since theblade wear can bemeasured at any time
during processing.

Processing is stopped
immediately if blade
breakage occurs tominimize potential
workpiece damage.

Measurementalignment

Cutting line

Standardalignment

Measurementalignment

Ultrasonic-wave
dicing unit

Detects the correct
cutting location forworkpieces with
cutting lines that are
not properly aligned
due to warpage frombaking and curing
steps.

Ultrasonic-wave pulses
promote active selfsharpening of the blade toensure high quality and highspeed processing of difficult
to- cut materials such as SiC
and glass.

U09
U18
Special blade for ultrasonic-wave dicing• Blade with built-in oscillator

Application example

SiC Wafer thickness: 350 µm

Applicablematerial

SiC, glass, alumina ceramic,
etc.

Bond type

Electroformed

Note: Please consult a DISCO sales representative for information regarding which optional accessories are supported for each model.

1

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Kiru

KezuruMigakuBlade Dicing Saw
Fully automatic dicing saw workflow
Loading

Alignment

DicingCleaning & Drying

Unloading

The workpiece isremoved from thecassette and transferredto the chuck table

Recognition of thepreviously registeredtarget and designationof the cut location

Cutting of the line
identified in alignment

Spinner table cleaning& drying

Fully Automatic Dicing Saw
Automatic wafer transfer, alignment, cutting, and cleaning & drying

The workpiece is stored
in the cassette after
the cleaning & drying
process is complete

Kiru

Kiru
Max workpiece size

DFD6240

DFD6341

DFD6450

Reduced-footprint fully automatic
single-spindle dicing saw for ø200
mm wafers

Standard equipment which supports
ø200 mm wafer processing

Next generation parallel dual dicing
saw for a wide range of applications

mm

ø200

ø200

ø200

SingleFacing dual

Parallel dual

Facing dual

Facing dual

Facing dualkW

1.2 at 60,000 min-1

1.2 at 60,000 min-1

1.0 at 60,000 min-1

1.8 at 60,000 min-1

1.8 at 60,000 min-1

1.2 at 60,000 min-1

min-1

60,00060,00060,00060,00060,00060,000LayoutSpindleOutputMax revolution speed

X-axisY-axisZ-axisUtilities

DFD6363

DFD6561

2-way transfer* flagship model
Also supports DBG half-cuts

Space-saving with a reduced
maintenance area

ø300

DFD6760
Dual chuck table configuration tominimize standby time for maximum
efficiency

ø300

ø300

Max workpiece size
LayoutSpindleOutputMax revolution speed

mm/sec0.1 - 600

0.1 - 1,000

0.1 - 600

0.1 - 1,000

0.1 - 1,000

0.1 - 1,000

Index stepmm

0.00010.00010.00010.00010.00010.0001

Positioning accuracymmWithin 0.003 / 210

Within 0.002 / 210

Within 0.003 / 250

Within 0.002 / 310

Within 0.002 / 310

Within 0.003 / 310

Repeating accuracy

mm

0.001

0.001

0.001

0.001

0.001

0.001

Dimensions (W×D×H)

mm

900 × 1,190 × 1,800

1,180 × 1,080 × 1,820

1,120 × 1,500 × 1,600

1,200 × 1,550 × 1,800

1,240 × 1,550 × 1,960

1,200 × 1,900 × 1,800

Weightkg

Approx. 1,200

Approx. 1,500

Approx. 1,400

Approx. 1,800

Approx. 1,500

Approx. 2,750

Feed speed rangemm

X-axisY-axisZ-axisUtilities

Feed speed range

kW
min-1
mm/secIndex stepmm

Positioning accuracymm

Repeating accuracymm

Dimensions (W×D×H)

mm

Weightkg*Frame/wafer dual-type transfer mechanism (Option)

Optional Accessories

Spindle layout

DBG

Dicing Before Grinding

SingleSingle spindle layout

3

Parallel dual

Facing dual

Two spindles mounted inparallelto facilitate a wide range ofapplications.

Two spindles opposite to eachother along the same axis.
Minimizes the cut strokes
required and raises throughput.

Cassette and tapeframe

Automatic blade
changerHigh precision products tofacilitate stable production fromtape mounter to die bonder.
Meets
the ø300
mm wafer
SEMI
standard.

Conducts blade change andresumes cutting fully automatically.
Minimizes the labour required andraises theutilization
rate of theequipment.

Note: Please consult a DISCO sales representative for information regarding which optional
accessories are supported for each model.

Partial Cut Dicing

BG Tape Laminating

Back Grinding

Dicing Saw

Laminator

Grinder

Frame Mounting

BG Tape Peeling

What is DBG?
The reverse of theconventional “Backside
grinding Wafer cutting”
process. Wafer half cut isperformed first, then the die
are separated throughbackside grinding. Die canbe produced fromlarge-diameter wafers byminimizing backsidechipping and wafer damage
during die separation(dicing).

Mounter4

Kiru

KezuruLaser Saw

MigakuAblation Process

Short pulse laser

A processing method utilizing high-intensity laser irradiation inbrief intervals to perform cutting.

Focusing lensWorkpiece

Stealth Dicing

Short pulse laser

A processing method that focuses a laser within the workpiece to form amodified layer. Die separation is achieved with a tape expander.

Focusing lensWorkpiece• Little to no heat damage to the workpiece.
• Non-contact processing with low impact and load.
• Ideal for hard workpieces that are very difficult to process.
• Able to reduce streets down to 10 µm in width.
(depends on workpiece conditions)• Controls cutting waste because only a subsurface layer is processed. This issuitable for workpieces that are vulnerable to contamination.
• A dry process that does not require cleaning, suitable for applications (suchas MEMS) that are vulnerable to mechanical load.
• Extremely narrow kerf widths allow significant reductions in street width.

Modifiedlayer

DISCO's stealth dicing laser saws incorporate an SD
engine, which has a modularized laser and dedicated

Modified
layer

改質層

optical system. The SD engine has been developed for
DISCO by Hamamatsu Photonics K.K..
STEALTH DICING and SDE are registered trademarks of Hamamatsu Photonics K. K.

Ablation process example
Grooving

Full cut

Sapphire

Low-k

Wafer thickness: 150 µm

Wafer thickness: 200 µm
Feed speed: 600 mm/s π cut

Kiru

Kiru

Scribing

Stealth dicing process example

Si

GaAs

Wafer thickness: 50 µm
Feed speed: 500 mm/s 3 passes

Wafer thickness: 100 µm
Feed speed: 140 mm/s 1 pass

Cu-Mo-Cu

MEMS (Si)

Sapphire

Wafer thickness: 100 µm

Wafer thickness: 120 µm

LiTaO 3Wafer thickness: 150 µm

Laser Lift-Off is a process for peeling substrates made ofsapphire or glass. It is used for the purpose of peeling off thesapphire substrate from the crystal layer of a GaN (gallium nitride)compound material, primarily
Sapphireused for making verticalstructured blue LEDs.

HogoMax
Water soluble
protective film toprevent debris
adhesion to thewafer surface during
ablationHigh product quality andhigh throughput grooving

Supports DAF cutting after
DBG

ø300

ø300

Max workpiece size

Fully automatic

Fully automatic

Processing method

X-axis Max feed speedmm

1.0 - 1,000

0.1 - 600

Y-axis Positioning accuracymmWithin 0.003 / 310

Within 0.003 / 310

1,560 × 1,550 × 1,800

1,200 × 1,550 × 1,800

Approx. 2,300

Approx. 1,750

Dimensions (W×D×H) mm
Weightkg

Applying HogoMax to thedevice surface reduces
thermal adhesion of debris
from laser ablation toincrease reliability and yield.

With HogoMax

mm

DFL7341

DFL7362

Realizes high productivity
for sapphire and MEMS
processing

High-speed, high-quality
processing of ultra-thin Si
Supports a variety of processes

ø200

ø300

ø300

Fully automatic

Fully automatic

Fully automatic

DFL7360FH
DFL7560L

1.0 - 1,000

0.1 - 2,000

1.0 - 1,000

Within 0.003 / 210

Within 0.003 / 310

Within 0.003 / 310

Dimensions (W×D×H) mm

950 × 1,732 × 1,800

1,600 × 2,755 × 1,800

1,100 × 2,100 × 1,990

Approx. 1,800

Approx. 2,850

Approx. 2,090

Utilities

WeightRelated Products

mm

kg

SDBG

Sapphireseparation

Dedicated tape frametransfer modelY-axis Positioning accuracy mm

X-axis Max feed speed

Without HogoMax

GaN

Laser
irradiation

DFL7160

Processing method

Utilities

Substrate

DFL7161mm

Wafer thickness: 700 µm

Laser Lift-Off process

HogoMax

Max workpiece size

Glass

Wafer thickness: 350 µm

Laser Lift-Off model witha fixed laser
Max workpiece size
Utilities

mm

Dimensions (W×D×H) mm
Weightkg

ø150
2,000 × 1,810 × 1,800
Approx. 3,300

BG Tape Laminating

Stealth Dicing

Back Grinding & Dry Polishing

Mounting & BG Tape Peeling

Cool Expanding& Heat Shrinking

Laminator

DFL7362

DGP8761

DFM2800

Die Separator

Stealth Dicing Before Grinding

Die Separator
High precision die separation
after laser processing

Max workpiece size
Dimensions (W×D×H)
Utilities
Weight

5

mm
mm
kg

ø200
718 × 897 × 1,608
Approx. 450

DDS2300

High precision DAF separation
ø300
1,200 × 1,550 × 1,800
Approx. 900

DDS2310

Supports small die separation for ø300 mm wafers
ø300
1,200 × 1,800 × 1,955
Approx. 1,000

Due to removal of themodified layer createdwith a laser throughgrinding, ultrathin,
high-strength die canbe created

Fracture Stress［MPa］

DDS2010

Small die separation by breaking

High die strength
process

Die strength（Three point bending）

4000

Wafer size : ø300 mm × t20 µm
Material
: Si
Max.

3000

Avg.
Min.

2000
1000
0

Thinning +Blade Dicing

SDBG

Increase in die yield
per wafer

High quality
DAF separation

Stealth dicing does not require spaceon the wafer to be allocated for cutting
as the kerf width is almost 0.
As a result, street width can be greatly
reduced and the number of die
obtainable per wafer can be increased.

High grade DAF
separation in
combination with the
Die Separator

50 µm

Thinning +Blade dicing

50 µm

SDBG

Si thickness : 40 µm
DAF thickness : 10 µm

Si + DAF

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Kiru

KezuruGrinder, Polisher, and Sur face Planer

MigakuGrinder

Grinder /PolisherHigh precision ultrathin backgrinding

Wafer backgrinding
and polishing

DAG810
A compact and versatile
automatic single spindle
grinder

DFG8340
Supports small-volume
grinding with highprecision

DFG8540

DFG8560

Standard dual-spindle grinder

PolisherEquipment for polishingwafer backsides

DFG8830

DFG8640

DGP8761

DFP8141

DFP8140

Quad-spindle grinder
designed to process hardmaterials such as sapphireand SiC

High-precision dual-axis
equipment which supports
hard and brittle materials
including LiTaO3 and SiC

Integrated backgrinding
and stress relief for bothenhanced productivity andultrathin processing

CMP polisher specialized
for processing hard andbrittle materials such as
sapphire and SiC

Realizes chemical-free
dry polish stress relief

The DFP8761HC supports high cleaning
processes for applications such as TSV.
Max workpiece size

ø200

ø200

ø200

ø300

ø150

ø200

ø300

ø200

1

1

2

2

4

2

3

1

1

kW

4.2

4.2

4.2

4.8

6.3

6

6.3

7.5

4.8

min-1

1,000 - 7,000

1,000 - 7,000

1,000 - 7,000

1,000 - 4,000

1,000 - 4,000

1,000 - 7,000

1,000 - 4,000 (Z1, Z2), 1,000 - 3,000 (Z3)500 - 2,000

1,000 - 4,000

1

2

3

3

5

3

4

2

1

mm

Number of axes
Spindle Output
Revolution speed
Number of chuck tables
Utilities

Dimensions (W×D×H)

mm

600 × 1,700 × 1,780

800 × 2,450 × 1,800

1,200 × 2,670 × 1,800

1,400 × 3,322 × 1,800

1,400 × 2,500 × 2,000

1,000 × 2,800 × 1,800

1,690 × 3,315 × 1,800

900 × 2,584 × 2,000

1,200 × 2,670 × 1,800

Weightkg

Approx. 1,300

Approx. 2,500

Approx. 3,100

Approx. 4,000

Approx. 6,000

Approx. 3,500

Approx. 6,700

Approx. 3,100

Approx. 1,900

Related Products

Multifunction Wafer Mounter
An integrated
solution for DAF
frame mounting
and protective
tape peeling fromthinned wafers.

Surface planer processing example[Processing example 1] Bump planarization[Processing example 2] LED phosphor resin planarization
Before planarization

After planarization

Resin

平坦化なし

平坦化あり

色度図

色度図

Flat surface and bump height

MigakuMigakuBump
N-layerBump

P-layer

Before planarization

DAS8920

DAS8930

Compact automatic models ideal for small lot production
and R&D
Max workpiece size
Spindlemm

Number of axes
Revolution speed

min-1

Number of chuck tables
Utilities

DFS8910
Fully-automatic model forø200 mm wafers

DFS8960

ø200

ø300

ø200

ø300

1

1

1

2

100 - 5,000

100 - 5,000

100 - 5,000

100 - 5,000

1

1

1

2

Dimensions (W×D×H)

mm

500 × 1,235 × 1,800

730 × 1,570 × 1,800

1,200 × 2,670 × 1,800

1,400 × 3,312 × 1,870

Weightkg

Approx. 800

Approx. 1,600

Approx. 2,400

Approx. 5,000

After planarization

Substrate

Phosphor[Processing example 3] Protective tape planarization

Fully-automatic dual
spindle modelfor ø300 mm wafers

Protective tapemounting

Existing
process

Tapeplanarization

Tape
planarization

Backgrinding

Ground wafer
Uneven thickness corresponding to thedepressed silicon areas on the device surface

The uneven device surface istransferred to the tape as bumps.
TapeHigh TTV

Uneven tapesurface

Image of the DGP8761 in-line system

DFM2800
High-yield thin wafer processing
mm

ø300

Dimensions (W×D×H)

mm

2,150 × 2,643 × 1,800

Weightkg

Approx. 3,100

Max workpiece size

The uneven tape surface
is removed

Wafer

KezuruKezuruSurface Planer
Ultrahigh-precision planarization of ductile materials using a diamond bit

7

ø200

Low TTV

Utilities

8

Kiru

KezuruDicing Blade

MigakuHub Blade

Hubless Blade

The combination of an ultra-thin diamond blade and an aluminum
hub provides enhanced operational efficiency and stable cutting
results

Bond type, blade thickness, grit size and outer diameter canbe selected to meet processing requirements for a variety of
workpieces such as silicon, glass or ceramics.

ZH05

ZH14

ZHZZ

Z05

Z09

ZP07

High-precision concentration
control for extremely stable
and consistent process results

Achieves stable processing underhigh load conditions through useof the high strength V1 bondUltrathin hub blades forstable dicing of narrow
street wafers

Ultra-high cutting performancefor a wide range of workpieces
and applications

Electroformed blades
optimized for high quality
cutting with fine grit sizes

Porous blade structure forhigh-grade processing ofhard and composite materials• Optimized to balance blade life andprocess quality.

• Suppresses breakage and wavy
cutting even during high speed anddeep cutting or when using bladeswith long blade exposure• The thinnest hub blades in theindustry - only 10 µm wide.

•Through improved fine control
of abrasive concentrations, ourlineup now offers up to six different
concentration levels.

•High-strength bond for high-speed
and high-straightness.

• Dicing solution for SiC and otherdifficult-to-cut materials.

PZT processing

Blade tip

Concentration range

Cut grooves

Concentration range

Cut quality comparison (silicon, 0.9 mm thickness)

Low

Conventional
blade

High

Conventional
blade

Low

High

Grit

50

ZH05

70

Low

90

110

130
High

Concentration

30

Z05
ZH14

Conventional blade

Applicablematerial

Silicon, compound semiconductor (GaAs, GaP, etc.), etc.

Silicon, etc.

Bond type

Electroformed

Electroformed

Conventional blade
Kerf 40 µm

Conventional blade
Kerf 20 µm

ZHZZ
Kerf 10 µm

60

90

Low

Kiru

120 150 180
HighConcentration

Z09

Conventional blade

New porous structure electroformed blade

Silicon, compound semiconductor (GaAs, GaP, etc.), etc.

Applicablematerial

Chip LED board, green ceramics, hard and brittle material, etc.

PZT, LiTaO3, ceramics, silicon, etc.

Composite materials, ceramics, etc.

Electroformed

Bond type

Electroformed

Electroformed

Electroformed

ZHFX

ZHDG

R07

B1A

TM11

Designed to prevent blade
tip collapse

Designed for continuous
processing of oxide wafers

Electroformed hub blades forhigh quality substrate dicing

High-quality, high-speed
cutting of hard and brittle
materials

For precision dicing ofdifficult-to-cut materials

Realizes high blade strength
through use of a specialbond type• Strengthened blade structure toprevent blade tip collapse whenprocessing with blades thicker
than 60 µm.

• Significantly lowers dress frequency
during processing for high continuous
processing performance.

• Selectable from a lineup with anabundant variety of grit sizes andconcentrations.

• Utilizes a newly-developed
bond material to match thecharacteristics of the workpiece.

• Wide variety of bond types forvarious applications.

• Supports processes requiring
long blade exposures with athin blade

Applications by grit size

Position of TM11 blades

GrooveBlade tip

Collapse

For semiconductor wafers#1500〜#5000

ZH05
SeriesZHCR

Conventional blade

ZHFX

Conventional bladeLong

For substrates#360〜#1000

ZHDG
SeriesGrooveBlade life

Blade tip shape and groove comparison
Blade tip

Bond comparison

Large

Grit size

Grit size

BB500

#4500

Burr
Size BB300#1200

Concentration
Cutting quality

#320

Al2O3
Green ceramics

TiO2

BB200

#600

Glass family (quartz, soda glass etc.)

Ferrite composite

BB101

Small

#2000

Single crystal ferrite

IC packages
Sapphire

Good

TM11
Blade wear

ZHDG series
LiTaO3 processing

Small

ZHCR

Electroformed
Metal
Resin

Large

Kiru

Pore

Low

Stiffness

Applicablematerial

Silicon, etc.

Oxide wafers (LiTaO3, etc.)

Chip LED board, semiconductor packages, etc.

Applicablematerial

Glass, quartz, ceramics, etc.

Electronic parts, optical component material, IC packages, etc.

Green ceramics, IC packages, etc.

Bond type

Electroformed

Electroformed

Electroformed

Bond type

Resin

Metal

Metal

High

VT07/VT129Related ProductsHigh straightness anddimensional accuracy forhigh-load processing

Color Case, Case Holder for Hub/Hubless Blade• Ideal for high quality edge
trimming and processing of hardceramics, sapphire and SiC.

Color Case

Case Holder

Cases for hub andhublessblades
which prevent blade
mounting errors.
Using color cases,
the possibility of blade
mounting errors canbe reduced whendifferent types of
blades are used foreach equipment andspindle.

Case holders canbe attached to theequipment to hold thecases for the blades
being used. Using thesame color holders
and cases improves
blade type recognition.
These can be used
for both hub andhublessblades.
Color Case for Hub Blade

Color Case for Hubless Blade

SiC processing

Conventional blade Chipping Avg.: 24 µm VT12Case Holder

Chipping Avg.: 16 µm

Applicablematerial

Si3N4, SiC, crystal, sapphire, etc.

Bond type

Vitrified

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Kiru

KezuruGrinding Wheel

MigakuKiru

KezuruMigakuDry Polishing Wheel

GF13

GFCP

DP08

Gettering DP

Improved productivity andgrinding quality
Grinding wheel for semiconductor
wafersSimultaneous grinding ofdifferent materials
Wheel for package grinding

For chemical-freestress relief

High die strength equal
to normal processing
while maintaining gettering
performance• Support for the Dicing Before Grinding
process (DBG) as well as normal wafer
polishing.

•Supports SDBG processing•Supports package grinding
with various specifications using
customizable vitrified bonds.

Product lineup

Example of Si + mold resin grinding

Applications
Roughgrinding
Silicon

Bond

Example of Cu + mold resin grinding

Gettering effect

TEM damage comparison

Mirror wafer

Grit size

Resin

SDC340, SD340(conventional stress relief surface)

Gettering DP polished wafer
5.00
4.50

Mold resin

4.00
3.50

Mold resin

Vitrified(SDBG processing)

SD400, SD600

Resin

SD2000Vitrified

SD4800, SD6000, 45D

3.00
2.50

Cu

Si

2.00
1.50
1.00
0.50

Fine grinding

Applicablematerial

0.00*Magnified image

Ground using a #2000 wheel

Semiconductor packages, etc.
(composite materials, such as silicon, resin, metal)

Silicon, SiC, LiTaO3, GaAs

Related Products

DP08

Mirror surface
before contamination

After contaminationand diffusion

SiliconMirror surface
before contamination

After contaminationand diffusion

Unit :
e10 atoms/cm2

Applicablematerial

SiliconProcessing examples of various materials (Surface roughness data)*Data measured using AFM

KezuruProven track record of grinding and polishing various materials in addition to silicon

Wheel Guard
Protects wheel segments for streamlined wheel replacement andeasier handling.

Grinding Wheel

Sapphire grinding

Sapphire polishing

LiTaO 3 grinding

SiC polishing

Ra: 10 nm
Ry: 72 nm

Ra: 1 nm
Ry: 5 nm

Ra: 18 nm
Ry: 106 nm

Ra: 1 nm
Ry: 6 nmø200 mm Wheel Guard

Wheel Guard
Without careful handling, somewheel segments may crack or
break.

Wheel Guard protects grinding
wheel segments to prevent
damage.

ø300 mm Wheel Guard

Migaku

11

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Kiru

KezuruMigakuDeionized Water Recycling Unit

Automatic cleaning system

Water Temperature Control Unit

Cutting Water Filtration Unit for Dicing Saws

DWR1710DWR1722

DCS1441
DCS1460

DTU152/DTU162
DTU1540/DTU1550

CC Filter Unit

Multi-function, super-compact deionizedwater recycling unit for dicing saws

Performs spin cleaning and drying of workpieces
processed with a automatic dicing saw

Optimizes the temperature andpressure of both cutting and cooling water

The high-capacity, highly functional CC
Filter Unit reduces filtration running costs• Integrates deionized water production, water temperature
control, filtration and cutting water treatment.
• 99% recycling rate (zero wastewater) significantly reduces
city water consumption.

• The highly effective atomizing cleaning nozzle
can be installed as an option.
• The cleaning sequence can be fully optimized
for any workpiece.

• Complete water temperature regulation to enhance
processing accuracy.
• Significantly reduced water consumption byrecirculating cutting water via a particle filtration
system. (DTU162)• Primary filtration unit to reduce load for cutting water
recycling or wastewater treatment.
• Can be combined with the DTU162 to reduce maintenancerequirements for cutting water recycling.

Specific resistance value after treatment MΩ·cm

Cutting water

Pumping capacity

L/min

Spindle coolant water system Pumping capacity

L/min

Temperature setting rangeºC

Temperature fluctuation rangeºC

Utilities

Dimensions (W×D×H)

mm

Dry weightkg

DWR1710DWR1722

DWR1710DWR172212 or higher
10
25
N/A
10
20 - 25*
20 - 25
Within 1*
Within 1
780 × 400 × 1,450 450 × 1,600 × 1,656
Approx. 200
Approx. 460

DCS1441

DTU1550

Max workpiece size
Utilities

DCS1441
ø200
400 × 600 × 1,380
Approx. 120

mm

Dimensions (W×D×H)

mm

Dry weightkg

DCS1460
ø300
500 × 650 × 1,220
Approx. 144*When the prepared cooling water temperature is -2 ºC lower than the set temperature.

Cutting water
systemDWR1722

Filtration

Shockwave /Expansion waveºC

15 - 30

15 - 30

Temperature fluctuation rangeºC

Within 1
450 × 1,296 × 1,235
Approx. 310

Within 1
430 × 900 × 1,500
Approx. 240

DTU1540
9.4, 1045

DTU1550
6.2, 12.5
30
3.0
18

Mist (fluid droplets)
Particle

Jet water flow

Deionized
waterCity water

Particle

No wastewater

Cutting water
systemDimensions (W×D×H)

mm

Dry weightkg

Cooling and heating capacity kW
Pumping capacity

L/min

Spindle coolant Cooling capacity
systemCooling capacity

kW
L/min

Cutting water

At instant of impact

After impact

Shared with cutting water

Temperature setting rangeºC

15 - 30

15 - 30

Temperature fluctuation rangeºC

Within 1
500 × 780 × 1,650
Approx. 270

Within 1
450 × 1,090 × 1,680
Approx. 310(Cutting water / Spindle coolant water)

Dicing saw

L/min

DTU162
0.6, 2
10
0.6, 0.6
6

Temperature setting range

Utilities

Dicing saw

Pumping capacity

DTU152
6.3, 12.5
25
1.16, 2.5
6kWSpindle coolant Cooling and heating capacity kW
systemL/min
Cooling capacity(Cutting water / Spindle coolant water)

Atomizing cleaning

Water supply
temperature control

Cooling and heating capacity

Utilities

Dimensions (W×D×H)

mm

Dry weightkg

Cutting Water Additives for Dicing

Cutting water additives which prevent
issues when dicing

Dedicated unit for injecting
StayClean into cutting water

StayClean-A• Prevents particle adhesion

StayClean-F• Prevents the bonding pads from corroding• Prevents particles from adhering to the pad section

StayClean-R• Prevents the bonding pads from corroding• Prevents particles from adhering to the pad section• Can be used in combination with a DI water
recycling unit (DWR series)kg

Dicing saw

DTU162

CC Filter Unit
Filtered water

Wastewater

Cutting water

CO2 Injector
When using StayClean-A or F

• Highly accurate dilution control to ratios as low
as 1:10,000.
• Automatic bottle replacement enables
continuous operation.

Flow rate range

StayClean-A
1,000 - 2,000(0.1 - 0.05%)

StayClean-F
1,000 - 10,000(0.1 - 0.01%)

StayClean-R
1,000 - 10,000(0.1 - 0.01%)

Approx. 10

Approx. 10

Approx. 10

Lmm

Dry weightDual
20
760 × 374 × 1,260
Approx. 75

L/min

Cutting water temperature
Controllable concentration
UtilitiesºC%

Dimensions (W×D×H)

mm

Dry weightkg

Reduces particle adhesion due to charging
caused by dicing and device damage causedby static electricity• Direct control from the dicing saw enables easy operation.
• Applies a multi-stage mixing method to closely track changes inresistivity caused by changes in flow rate.

StayClean
Injector

StayClean Injector
2 - 2020 - 250.01 - 0.1
200 × 300 × 500
Approx. 25

Bottle Stocker
357 × 392 × 440
Approx. 10

Wastewater
Deionized
water pipe

Water flow rate

L/min

Resistivity settings range

Cutting Water

MΩ·cm

Resistivity fluctuation range *Dicing saw

Utilities

Dimensions (W×D×H)
Dry weightStandard specification Low-resistivity specification
3 - 15
0.5 - 1.0
0.2 - 0.6
Setting ±10%
Setting ±0.06 MΩ · cm
328 × 178 × 365
Approx. 13* The flow rate is constant within the range from 3 to 15 L/min at the supply water temperature from 20 to 25ºC

When using StayClean-R
Reduced particle adhesion

Dicing saw

Pad corrosion prevention

Supplied by user

StayClean
Injector

Configuration of CO2 Injector,
dicing saw, and utilities

MigakuMigakuVolumeDimensions (W×D×H)

Single10400 × 400 × 1,260
Approx. 61

KezuruKezuru

StayClean Injector

times

Utilities

L/min

Resistivity Management Unit for Dicing Saws

StayClean-A
StayClean-F
StayClean-R

Recommended
dilution

Water flow rate

Kiru

Kiru

One unit housing the capabilities of four.
Deionized waterproduction
Wastewastertreatment

Dual CC Filter type

CO2 gassupplyCutting Water

Link
CO2

Deionized water pipe

Wastewater
Deionized
water supply

Deionized Water Recycling Unit
Deionized water

When using StayClean-A

Deionized water

When using StayClean-F

DWR1710/DWR1722

CO2 Injector

CO2 aqueous
solution

Dicing saw

Deionized water

White areas: Adhered particles

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