Features
High Melting Point Biomass Polyamide VYLOAMIDE™
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VYLOAMIDE™ has one of the lowest water absorption rates among polyamides.
VYLOAMIDE™ has a high melting point of 315°C and excellent short-term heat resistance.
VYLOAMIDE™ boasts high chemical resistance against acids, alkalis, oils, and more.
VYLOAMIDE™ has excellent fluidity, allowing for the molding of thin-walled parts.
VYLOAMIDE™ has a biomass content of about 30% in unreinforced grades.

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Spec・QualityVYLOAMIDE™ Main GradesType

Non-FlameResistant

Property

The physical properties can be found in the Product search on the top page of VYLOAMIDETM.

GradeFeature

Unreinforced

MJ-300

Unreinforced

GF reinforced

MJ-365GT

GF35%

GF reinforced

MJ-360JA

GF35%, Good Appearance, Low Warpage

GF reinforced

MJ-365GC-U

GF35%, Impact Resistant

GF reinforced

MJ-385JT

GF45%, Low Warpage

GF reinforced

MJ-390GNZ

GF50%, High Stiffness

GF reinforced

MJ-330C

CF20%, Low Friction, High Stiffness

GF reinforced

MJ-350GCV

GF30%, High Toughness, Flame Retardant(V-0 Equivalent Rating/1.6mmt )GF reinforced

MJ-365GHV

GF35%, Flame Retardant(V-0 Equivalent Rating/0.8mmt )FlameRetardant

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Spec・Quality
High Strength
VYLOAMIDE™ maintains high strength across a wide temperature range. The graph shows temperature dependence offlexural strength. VYLOAMIDE™ is superior to PA66 and LCP at several temperatures.

Temperature dependence of flexural strength (GF30%)

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Spec・Quality
Short-Term Heat ResistanceVYLOAMIDE™ has a high melting temperature of 315°C and a high HDT (Heat Deflection Temperature) of 290°C at 1.8MPa.
The graph shows HDT of each material. VYLOAMIDE™ has a higher HDT than PA66 or PBT, so it is suitable for SMT
processes.

Heat Deflection Temperature (GF30%,1.8MPa)

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Spec・Quality
Long-Term Heat ResistanceVYLOAMIDE™ maintains its mechanical properties under long-term high-temperature conditions. The graph shows heataging results at 160°C and shows VYLOAMIDE™ to be superior in performance to PA66 and PPS.

Heat Aging

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Spec・Quality
High FlowVYLOAMIDE™ has excellent in mold flow. The graph compares the Melt Flow Index (MFI) of VYLOAMIDE™ (2,160 g/10min)
to that of several other polymers. VYLOAMIDE™ has a higher MFI than PA66 or PBT, which allows for its use in molded
parts with complex geometries or fine textures.

Melt index of VYLOAMIDE™ and several polymers

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Spec・Quality
Low Water Absorption
When selecting a polyamide for use in automotive parts and electronics parts, it is important to consider mechanicalproperties. Popular polyamides (for example PA6T, PA66) decrease in strength with water absorption. VYLOAMIDE™ has
one of the lowest water absorption rates of all the polyamides due to its polymer structure which includes long-chaincomponents. The graph shows flexural strength at 95%RH. VYLOAMIDE™ maintains its properties after water absorption
better than PA66. Moreover, VYLOAMIDE™ prevents the generation of blisters due to its inherent low water absorption. Thepicture shows a comparison of VYLOAMIDE™ and a standard PA after the reflow process. VYLOAMIDE™ has no blisters.

Flexural strength at 95% RH

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Appearance after reflow process

Spec・Quality
Chemicals ResistanceVYLOAMIDE™ has good chemical resistance to acids, alkalis, oils and other chemicals. The graph shows the surface
condition of VYLOAMIDE™ and PA66 after a CaCl2 test. VYLOAMIDE™ has no cracks, while there are multiple cracks inPA66.

Surface Strength of VYLOAMIDE™ and PA66 after CaCl2 Test

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Spec・Quality
BiomassVYLOAMIDE™ is made from inedible plant material so it is environmentally friendly. The biomass ratio of the unreinforced
grade is about 30%.

Castor Oil Plant

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Processing
Molding Condition
Drying Conditions
Drying is not necessary for VYLOAMIDE™ used directly from a new, sealed bag. When using VYLOAMIDE™ from an open
bag, dry at 120℃ for 5-8 hours at least if the opened once is used. Avoid overdrying as VYLOAMIDE™ this may cause
discoloration.

Moisture content of VYLOAMIDE™ under 100℃ and 120℃ condition.

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Processing
Typical injection molding condition
Unreinforced

Reinforced

Example of applicable grades

MJ-300

MJ-365GT

C1315～320℃

315～320℃

C2

320～330℃

320～330℃

C3

320～330℃

320～330℃

NZ

320～330℃

320～330℃

Mold Temperature120～150℃

120～150℃

Storage condition
VYLOAMIDE™ has low water absorption rate but may absorb water a little under room condition for long time. Water absorption causes foaming, poor
appearance, low mechanical properties and drooling. Seal aluminum package after using to prevent water absorption.

Water absorption rate of VYLOAMIDE™ (23°C30%RH)

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Processing
Injection Molding Troubleshooting
TroubleCause

Sink marks

Design1. High resin temperature
2. High/low mold temperature
3. Low holding pressure
4. Insufficient holding pressure time
5. Insufficient cooling time
6. No cushion
1. Small runner/ gate
2. Unsuitable gate location

1. Reduce the cylinder temperature
2. Set the mold temperature accordingly
3. Increase the holding pressure
4. Increase the holding pressure time
5. Increase the cooling time
6. Make cushion 5-10mm
1. Enlarge the runner/gate size
2. Relocate the gate to a thicker area

Machine1. Back-flow during injection

1. Inspect or exchange the backflow valve

Condition

1. Unsuitable injection conditions
2. Insufficient holding pressure time
3. Insufficient Cooling time
4. Temperature difference between cavity and core

Condition

Warpage,
Deformation

Countermeasure

Mold

1. Unsuitable ejector pin placement
2. Insufficient ejector pin size

Design1. Unsuitable gate location
2. Extreme change in part thickness3. Not enough gates for the part size

1. Increase the injection pressure/speed
2. Increase the holding pressure
3. Increase the cooling time
4. Control the temperature of cavity and core separately
1. Balance ejector pin placement
2. Enlarge ejector pin size
3. Increase the draft angle
1. Change gate location
2. Even out the part thickness
3. Increase the number of gates

1. High resin temperature
2. High injection speed
3. High holding pressure
4. Low mold clamping force
5. Filling resin Volume is too high
1. Mold surface doesn't mate properly

1. Reduce the resin temperature
2. Reduce the injection speed
3. Reduce the holding pressure
4. Increase the mold clamping force
5. Set the cushion about 5mm
1. Modify the mold

1. High resin temperature
2. Air entrapment
3. High injection speed
4. Filling resin volume is too high

1. Reduce the resin temperature
2. Reduce the screw rotation
3. Reduce the injection speed
4. Decrease the residence time

1. Inadequate venting
1. Unsuitable gate location
2. Small gate size
1. Low resin temperature
2. Low mold temperature
3. Low injection speed

1. Increase gas ventilation
1. Change the gate location to make the welding line on the PL
2. Enlarge the gate size
1. Increase the cylinder temperature
2. Increase the mold temperature
3. Increase the injection speed

1. Inadequate holding pressure

1. Increase gas venting and/or change gate location to move the weld line onto the parting line.

1. Low resin temperature
2. Low mold temperature
3. Low injection speed
4. Inadequate holding pressure
5. Insufficient amount of resin for fill
1. Inadequate holding pressure
2. Unclean mold

1. Increase the cylinder temperature
2. Increase the mold temperature
3. Increase the injection speed
4. Increase the holding pressure/time
5. Make cushion 5-10mm
1. Increase the holding pressure/time
2. Clean the moldFlashCondition
MoldBurn marks
Condition
Mold
DesignWelding line
Condition
Mold
Poor surface
appearance

Condition

Mold

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Processing
SafetyMolding Operation• When purged resin contains a large quantity of gas or steam, the resin may have been insufficiently dried. We recommend re-drying the resin.
• Resin held in the cylinder for an extended period of time may lose viscosity or experience other impacts on quality. Please resume molding only
after
thoroughly replacing the resin that has been held too long in the cylinder with new resin.
• When switching from VYLOAMIDE ™ to another polymer, replace the VYLOAMIDE ™ with polyethylene or polypropylene to purge. Local andgeneral
ventilation are recommended.
• Keep hands and face away from the nozzle during molding to prevent burn injury.
• Please ensure proper ventilation, as a small amount of gas and fine dust may be produced during molding.

Protective equipment• Wear appropriate protective equipment such as protective clothing, safety glasses, and gloves to protect eyes and skin from the molten resin.

Emergency Response• Should molten resin adhere to the skin, cool the area immediately with cold water or an ice pack and then seek medical attention. Do not
attempt to peel
the resin off of the skin.

Other• Do not let molten resin touch electric wires or hoses.
• Molten resin reaches high temperatures and can catch fire if it forms large clumps when purging. Break up large clumps and allow to cool before
disposal.
• Spilled pellets can be a slipping hazard, so be sure to clean them off the floor immediately.

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NotesDisclaimer•
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All of the property data is based on natural color or general black. Data may vary depending on color.
All information in this technical data sheet is based on the experiences of TOYOBO MC Corporation.
These information may vary depending on mold condition and application.
There may also be laws and regulations depending on intended use. Please be careful of this things when using thisproduct.
If this material is to be used for medical, military, or food contact applications, or if it is to be used in a product where adefect in the product is likely to result in death, bodily harm, or substantial property damage, please contact us separatelybeforehand.
Export of our materials and products using our materials must comply with the Foreign Exchange and Foreign Trade Law
and other relevant laws and regulations.
Chemical substances used in this material may be regulated by laws and regulations related to chemical substances ineach country, and separate applications may be required or import/export may not be allowed. If you are an importer orexporter of this material, please inquire about compliance with regulations in the relevant country.
The information of this document is based on materials, methods and data available at the time of document preparation.
Please note that the information is subject to revision without prior notice based on subsequent findings.

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